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Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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31-05-2019 дата публикации

Мощный тонкопленочный резистор

Номер: RU0000189715U1
Автор: Татьяна Михайловна Калинина
Принадлежит: Акционерное общество "Финансово-промышленная компания "Энергия"

Полезная модель относится к электронной технике, а именно к производству постоянных резисторов по тонкопленочной технологии, и может быть использована в электронной, радиотехнической и других смежных отраслях промышленности при изготовлении мощных СВЧ резисторов.Сущность полезной модели: мощный тонкопленочный резистор включает диэлектрическую подложку из высокотеплопроводной керамики с полированной лицевой стороной и нанесенную на подложку резистивную пленку с электродными контактами, при этом лицевая сторона диэлектрической подложки отполирована до получения высоты неоднородности не более 0,1 мкм, при этом толщина резистивной пленки составляет не менее удвоенной высоты неоднородности.Технический результат: повышение стабильности сопротивления при длительной эксплуатации. 7 ил. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 189 715 U1 (51) МПК H01C 17/00 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (52) СПК H01C 17/00 (2019.02) (21)(22) Заявка: 2019107338, 14.03.2019 (24) Дата начала отсчета срока действия патента: 31.05.2019 Приоритет(ы): (22) Дата подачи заявки: 14.03.2019 (45) Опубликовано: 31.05.2019 Бюл. № 16 1 8 9 7 1 5 R U (54) Мощный тонкопленочный резистор (57) Реферат: Полезная модель относится к электронной технике, а именно к производству постоянных резисторов по тонкопленочной технологии, и может быть использована в электронной, радиотехнической и других смежных отраслях промышленности при изготовлении мощных СВЧ резисторов. Сущность полезной модели: мощный тонкопленочный резистор включает диэлектрическую подложку из высокотеплопроводной керамики с полированной Стр.: 1 2208256 C2, 10.07.2003. RU 2133514 C1, 20.07.1999. SU 1812562 A1, 30.04.1993. US 5119538 A, 09.06.1992. US 4929923 A, 29.05.1990. лицевой стороной и нанесенную на подложку резистивную пленку с электродными контактами, при этом лицевая сторона диэлектрической подложки отполирована до получения высоты неоднородности не более 0,1 мкм, при ...

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Номер записи: 1
07-03-2013 дата публикации

Method for manufacturing multilayer ceramic electronic component

Номер: US20130056133A1
Автор: Koji Sato, Yasuhiro Nishisaka, Yukio Sanada
Принадлежит: Murata Manufacturing Co Ltd

A method for manufacturing a multilayer ceramic electronic component significantly reduces and prevents swelling or distortion when a conductive paste is applied to a green ceramic element body. A ceramic green sheet used in the method satisfies 180.56≦A/B wherein A is a polymerization degree of an organic binder contained in the ceramic green sheet, and B is a volume content of a plasticizer contained in the ceramic green sheet.

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Номер записи: 2
11-04-2013 дата публикации

CHIP THERMISTOR AND METHOD OF MANUFACTURING SAME

Номер: US20130088319A1
Автор: SAITO Yo, TSUCHIDA Daisuke, YAMADA Kouki
Принадлежит: TDK Corporation

A chip thermistor has a thermistor portion including a ceramic material containing respective metal oxides of Mn, Ni, and Co as major ingredients; a pair of composite portions including a composite material of Ag—Pd, and respective metal oxides of Mn, Ni, and Co and arranged on both sides of the thermistor portion so as to sandwich in the thermistor portion between the composite portions; and external electrodes connected to the pair of composite portions, respectively. In this manner, the pair of composite portions are used as bulk electrodes and, for this reason, the resistance of the chip thermistor can be adjusted mainly with consideration to the resistance in the thermistor portion without need for much consideration to the distance between the external electrodes and other factors. 1. A chip thermistor comprising:a thermistor portion comprised of a ceramic material containing a metal oxide as a major ingredient;a pair of composite portions comprised of a composite material including a metal and a metal oxide and arranged on both sides of the thermistor portion so as to sandwich in the thermistor portion between the composite portions; andexternal electrodes arranged at both ends in a longitudinal direction of an substantially rectangular parallelepiped shaped element body which includes the thermistor portion and the pair of composite portions, the external electrodes are connected to the pair of composite portions respectively.2. The chip thermistor according to claim 1 , wherein each of the external electrodes is configured to cover respective end faces in the longitudinal direction of the element body.3. The chip thermistor according to claim 1 , wherein each of the external electrodes is configured to oppose to each other on at least one side face which extends along the longitudinal direction of the element body.4. The chip thermistor according to claim 1 , wherein the thermistor portion is configured in a layered structure such that a direction in which ...

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Номер записи: 3
02-05-2013 дата публикации

CHIP RESISTOR AND METHOD OF MANUFACTURING THE SAME

Номер: US20130104389A1
Автор: YONEDA Masaki
Принадлежит: ROHM CO., LTD.

A method of manufacturing a chip resistor includes the following steps. A resistor layer is formed on an obverse surface of a material substrate. A plurality of substrate sections are defined in the material substrate by forming, in the obverse surface of the material substrate, a plurality of first grooves each of which is elongated in a first direction. A conductor layer is formed in each of the first grooves. The substrate sections are cut along lines extending in a second direction different from the first direction. 1. A method of manufacturing a chip resistor , the method comprising the steps of:forming a resistor layer on an obverse surface of a material substrate;defining a plurality of substrate sections in the material substrate by forming, in the obverse surface of the material substrate, a plurality of first grooves each being elongated in a first direction;forming a conductor layer in each of the first grooves; andcutting the substrate sections in a second direction different from the first direction.2. The method according to claim 1 , wherein each of the first grooves includes a bottom surface.3. The method according to claim 2 , further comprising the step of forming claim 2 , in the bottom surface of each first groove claim 2 , a second groove smaller in width than said each first groove.4. The method according to claim 1 , wherein the resistor layer comprises a plurality of resistor rows spaced from each other in the second direction claim 1 , each of the resistor rows comprising a plurality of resistor strips arranged in the first direction claim 1 , each of the resistor strips being elongated in the second direction claim 1 ,wherein in the step of defining a plurality of substrate sections, each of the first grooves is formed between adjacent two of the resistor rows.5. The method according to claim 4 , further comprising the step of forming a surface electrode layer on the obverse surface of the material substrate before the step of forming a ...

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Номер записи: 4
09-05-2013 дата публикации

Plastic Tubular Connecting Sleeve for a Pipe with Internal Liner

Номер: US20130114945A1
Автор: Pionetti François-Régìs, Rocher Xavier
Принадлежит:

pipe having at least two steel pipe elements with internal lining that are assembled together end to end, with the ends of the two pipe elements being welded together. A tubular junction sleeve is interposed inside the pipe at the abutting ends of the two pipe elements so that the end terminal portions of the sleeve are at least in part in leaktight contact with respective ones of the terminal portions at the ends of the internal linings of the two pipe elements. The leaktight contact zone is a zone of fusion welding together the materials in mutual contact constituting at least a portion of each terminal portion of the sleeve and of each respective terminal portion of the lining. At each of the terminal portions of the sleeve in the leaktight contact zone, the tubular junction sleeve presents a Joule effect heater wire arranged in a double spiral on the outer surface of each terminal portion at the ends of the sleeve. 115-. (canceled)16. A tubular junction sleeve of thermoplastic material suitable for being inserted inside a pipe comprising at least two steel pipe elements that are internally lined with a thermoplastic material where the ends of the two welded together pipe elements are assembled end to end , said sleeve presenting at each end a tubular wall terminal portion of thickness that is smaller than the thickness of the adjacent running portion of the tubular wall of said sleeve , said sleeve presenting a Joule effect heater wire at at least one of said terminal portions of the sleeve , and preferably at each of them , the wire being arranged in a spiral at the outer surface of said terminal portion of said sleeve , wherein said heater wire is folded in half so as to form a double spiral made up of two wire portions arranged side by side forming two substantially equidistant spirals that are joined together at a common end constituted by a hairpin-bend , each spiral traveling along said outer surface of each terminal portion of the sleeve from the first ...

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Номер записи: 5
06-06-2013 дата публикации

METHOD OF MANUFACTURING THERMAL HEAD, AND THERMAL PRINTER

Номер: US20130141507A1
Автор: KOROISHI Keitaro, MOROOKA Toshimitsu, SANBONGI Norimitsu, SHOJI Noriyoshi
Принадлежит: SEIKO INSTRUMENTS INC.

A method of manufacturing a thermal head, comprising the steps of: bonding a support substrate and an upper substrate, which have a flat shape, together in a laminated state, the support substrate and the upper substrate having opposed surfaces, at least one of which includes a concave portion; thinning the upper substrate bonded onto the support substrate; a measurement step of measuring a thickness of the thinned upper substrate; determining a target resistance value of a heating resistor from the following expression based on the measured thickness of the upper substrate; and forming the heating resistor having the target resistance value at a position opposed to the concave portion, Rh=R×(1+(D+D)/(D+K)) where Rh represents the target resistance value; R, a design resistance value; D, the thickness of the upper substrate; D, a design thickness of the upper substrate; and K, a heating efficiency coefficient. 2. A method of manufacturing a thermal head according to claim 1 , wherein the forming the heating resistor comprises:a first step of forming a heating resistor having an arbitrary resistance value;a second step of measuring the resistance value of the heating resistor formed in the first step; anda third step of adjusting the resistance value of the heating resistor so as to reduce a difference between the resistance value measured in the second step and the target resistance value.3. A method of manufacturing a thermal head according to claim 2 , wherein the third step comprises applying predetermined energy to the heating resistor to adjust the resistance value.4. A method of manufacturing a thermal head according to claim 3 , wherein the applying the predetermined energy comprises using a voltage pulse.5. A method of manufacturing a thermal head according to claim 3 , wherein the applying the predetermined energy comprises using laser light.6. A thermal printer claim 1 , comprising a thermal head manufactured by the method of manufacturing a thermal head ...

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Номер записи: 6
20-06-2013 дата публикации

MOISTURE RESISTANT LAYERED SLEEVE HEATER AND METHOD OF MANUFACTURE THEREOF

Номер: US20130152383A1
Автор: ANTOSCH Gernot, BOLDT Allen, FENNEWALD Kenneth, KENCHEL Matt, POESCHL Wolfgang, PTASIENSKI Kevin, RUSSEGGER Elias, SCHEFBANKER Gerhard, WALLINGER Martin
Принадлежит: WATLOW ELECTRIC MANUFACTURING COMPANY

A method of forming a layered heater assembly includes: forming a plurality of layers onto a substrate, the plurality of layers including a resistive element layer; forming electrical terminations in contact with the resistive element layer; securing a protective cover over the layers using a laser welding process, wherein edges of the protective cover are welded circumferentially around raised end portions of the substrate and welded longitudinally along a slotted portion of the substrate; securing a pair of lead wires to the electrical terminations; and securing a lead cap assembly around the pair of lead wires and to the protective cover using a laser welding process. 1. A method of forming a heater assembly comprising:forming a plurality of layers onto a substrate using a thermal spray process, wherein a recessed area for a termination is disposed on the layers;forming electrical terminations proximate the recessed area;securing a protective cover over the layers using a laser welding process, wherein edges of the protective cover are welded circumferentially around raised end portions of the substrate and welded longitudinally along a slotted portion of the substrate;securing a pair of lead wires to the electrical terminations within the recessed area; andsecuring a lead cap assembly around the pair of lead wires and to the protective cover.2. The method according to claim 1 , wherein the plurality of layers includes a resistive element layer that is formed by a laser removal process.3. The method according to claim 1 , wherein the lead wires are secured to the electrical terminations using a laser welding process.4. The method according to claim 1 , wherein the lead cap assembly is secured to the protective cover using a laser welding process.5. The method according to claim 1 , wherein the lead wires are secured to the electrical terminations with a termination spring claim 1 , and the termination spring is severed after the termination spring is secured to ...

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Номер записи: 7
11-07-2013 дата публикации

HEATING ELEMENT AND A MANUFACTURING METHOD THEREOF

Номер: US20130175255A1
Автор: Choi Hyeon, Hong Young-Jun, Kim Ki-Hwan, KIM Su-Jin
Принадлежит: LG CHEM, LTD.

The present invention relates to a heating element including a transparent substrate, a bus bar, a power supply connected to the bus bar, a heat emitting pattern line provided on the transparent substrate and electrically connected to the bus bar, and a non-heat emitting pattern line provided on the transparent substrate and not electrically connected to the bus bar, and a method for manufacturing the same. 1. A heating element , comprising:a transparent substrate;a bus bar;a power supply connected to the bus bar;a heat emitting pattern line provided on the transparent substrate and electrically connected to the bus bar; anda non-heat emitting pattern line provided on the transparent substrate and not electrically connected to the bus bar.2. The heating element according to claim 1 , wherein the transparent substrate is a plastic film claim 1 , a plastic substrate or a glass substrate.3. The heating element according to claim 1 , wherein the heat emitting pattern line is disposed so that heat is uniformly emitted.4. The heating element according to claim 3 , wherein the heat emitting pattern line is disposed so that a standard deviation of a surface temperature in an entire area in which the heat emitting pattern line is provided is 20% or less.5. The heating element according to claim 1 , wherein the non-heat emitting pattern line is disposed so that a distribution of an entire pattern including the heat emitting pattern line and the non-heat emitting pattern line is uniform.6. The heating element according to claim 1 , wherein the non-heat emitting pattern line is disposed so that an opening ratio deviation with respect to a circle having a diameter of 20 cm of the entire pattern including the heat emitting pattern line and the non-heat emitting pattern line is 5% or less.7. The heating element according to claim 1 , wherein when the area in which the heat emitting pattern line is provided is divided into two or more partitions claim 1 , lengths of the heat ...

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Номер записи: 8
25-07-2013 дата публикации

CHIP RESISTOR AND MANUFACTURING METHOD THEREOF

Номер: US20130187749A1
Автор: NAKA Kentaro, TSUKADA Torayuki
Принадлежит: ROHM CO., LTD.

A method of manufacturing a chip resistor includes forming a resistor assembly in which a conductive member including portions separated from each other in a first direction is provided in a resistance body member; and dividing the resistor assembly into chip resistors, each including a chip-shaped resistance body formed by a part of the resistance body member, a pair of main electrodes formed by a part of the conductive member and separated from each other in the first direction, and a pair of sub-electrodes formed by a part of the conductive member, separated from each other in the first direction, and adjacent to the main electrodes in a second direction perpendicular to the first direction with concave portions recessed in the first direction interposed therebetween, by punching. 1. A method of manufacturing a chip resistor , comprising:forming a resistor assembly in which a conductive member including portions separated from each other in a first direction is provided in a resistance body member; and a chip-shaped resistance body formed by a part of the resistance body member;', 'a pair of main electrodes formed by a part of the conductive member and separated from each other in the first direction; and', 'a pair of sub-electrodes formed by a part of the conductive member, separated from each other in the first direction, and adjacent to the main electrodes in a second direction perpendicular to the first direction with concave portions recessed in the first direction interposed therebetween, by punching., 'dividing the resistor assembly into chip resistors, each of the chip resistors including2. The method of claim 1 , wherein the resistance body member has at least one elongated resistance body plate extended in the second direction claim 1 ,wherein the conductive member has a plurality of elongated conductive plates, each being extended in the second direction, and arranging the plurality of elongated conductive plates to be separated from each other in the ...

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Номер записи: 9
01-08-2013 дата публикации

ELECTRONIC CIGARETTE AND METHOD

Номер: US20130192619A1
Автор: Jordan Geoffrey Brandon, Mullins Michael J., Rostami Ali A., Smith Barry S., Tucker Christopher S.
Принадлежит: ALTRIA CLIENT SERVICES INC.

An electronic smoking article includes an outer tube extending in a longitudinal direction, an inner tube within the outer tube and including a pair of opposing slots, a liquid supply comprising a liquid material, a coil heater, a wick and a mouth end insert. The coil heater is located in the inner tube. The coil heater is formed of an iron-free, nickel-chromium alloy and has substantially uniformly spaced windings. The wick is surrounded by the coil heater such that the wick delivers liquid material to the coil heater and the coil heater heats the liquid material to a temperature sufficient to vaporize the liquid material and form an aerosol in the inner tube. 1. A method of manufacturing an electronic smoking article wherein a wick is surrounded by a coil heater such that the wick delivers liquid material to the coil heater and the coil heater heats the liquid material to a temperature sufficient to vaporize the liquid material and form an essentially carbonyl free aerosol , the method comprising:forming a heater coil about a wick, the forming step including establishing coil windings having substantially uniform spacing between each winding; andmaintaining the spacing during manufacture of the electronic smoking article.2. The method of wherein the maintaining step includes providing clearance for the coil windings when inserting the heater coil in an inner tube extending in a longitudinal direction within the electronic smoking article.3. The method of claim 2 , wherein the maintaining step further includes placing a closure ring proximate to the wick to at least partially close said clearance claim 2 , the placing step being completed essentially without imparting a bending moment upon the heater coil.4. An electronic smoking article comprising:an outer tube extending in a longitudinal direction;an inner tube within the outer tube, the inner tube including a pair of opposing slots;a liquid supply comprising a liquid material, the liquid supply contained in an ...

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Номер записи: 10
01-08-2013 дата публикации

Electronic cigarette

Номер: US20130192622A1
Автор: Ali A. Rostami, Barry S. Smith, Charles Dendy, Chris HESSION, Christian Schuh, Christopher S. Tucker, Geoffrey Brandon Jordan, George Karles, Gerd Kobal, Jason Flora, Michael Fisher, Munmaya K. Mishra, Pauline Marcq, Robert Mitten, Shon Gedevani, Steven Rinehart, Zane Gibbs
Принадлежит: Altria Client Services LLC

An electronic smoking article includes a liquid supply including liquid material, a heater operable to heat the liquid material to a temperature sufficient to vaporize the liquid material and form an aerosol, a wick in communication with the liquid material and in communication with the heater such that the wick delivers the liquid material to the heater, at least one air inlet operable to deliver air to a central air passage upstream of the heater, and an aroma carrier on an outer surface of the outer tube. The aroma carrier includes fragrance material and is operable to deliver fragrance during smoking.

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Номер записи: 11
15-08-2013 дата публикации

Resistance Component and Method for Producing a Resistance Component

Номер: US20130207770A1
Автор: Rinner Franz
Принадлежит: EPCOS AG

A resistance component includes a stack of ceramic layers and inner electrodes. Inner electrodes of a first type are electrically conductively connected to a first external contact and inner electrodes of a second type are electrically conductively connected to a second external contact. The inner electrodes of the first type are arranged such that there is no overlap with the inner electrodes of the second type. An inner electrode of a third type, which is electrically conductively connected neither to the first external contact nor to the second external contact, at least partially overlaps the inner electrodes of the first type and the inner electrodes of the second type. 115-. (canceled)16. A resistance component , comprising:a stack composed of ceramic layers;a first external contact;a second external contact;internal electrodes of a first type, which are electrically conductively connected to the first external contact;internal electrodes of a second type, which are electrically conductively connected to the second external contact; andan internal electrode of a third type, which is electrically conductively connected to neither the first external contact nor the second external contact;wherein the internal electrodes of the first type are arranged in a manner free of overlap with the internal electrodes of the second type;wherein the internal electrode of the third type at least partly overlaps the internal electrodes of the first type and the internal electrodes of the second type; andwherein, for each internal electrode of the third type, at least three internal electrodes of the first type and three internal electrodes of the second type are provided.17. The component according to claim 16 , wherein the first and second external contacts are arranged on opposite side faces of the component.18. The component according to claim 16 , wherein the internal electrode of the third type at a substantially identical distance from two opposite side faces of the ...

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Номер записи: 12
15-08-2013 дата публикации

Metal nanoparticle organic composite film and method for its preparation

Номер: US20130210679A1
Автор: Gabriele Nelles, Isabelle Raible, Nadejda Krasteva, Yvonne Joseph
Принадлежит: Sony Corp

The present invention relates to method for preparing a metal nanoparticle organic composite film, preferably a metal nanoparticle organic composite film of a chemical sensing device, to a metal nanoparticle organic composite film obtained by said method, and to a chemical sensing device comprising a metal nanoparticle organic composite film or an array of different metal nanoparticle organic composite films obtained by said method.

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Номер записи: 13
29-08-2013 дата публикации

THERMISTOR AND METHOD FOR MANUFACTURING THE SAME

Номер: US20130221584A1
Автор: MIURA Tadamasa
Принадлежит: MURATA MANUFACTURING CO. LTD.

An NTC thermistor having a metal base material, a thermistor film layer formed on the metal base material, and a pair of split electrodes formed on the thermistor film layer. A ceramic slurry is applied onto a carrier film to form the thermistor film layer, a metal powder containing paste is applied onto the thermistor film layer to form the metal base material, and further an electrode paste is applied onto the metal base material to form the split electrodes. Thereafter, the three substances are integrally fired. 1. A method for manufacturing a thermistor having a metal base material , a thermistor film layer adjacent the metal base material , and a pair of split electrodes adjacent the thermistor film layer , the method comprising:applying a ceramic slurry onto a carrier film with a predetermined thickness to form a ceramic green sheet serving as the thermistor film layer;applying a metal powder containing paste onto the ceramic green sheet with a predetermined thickness to form a metal base material sheet serving as the metal base material;applying an electrode paste onto a surface of the ceramic green sheet with a predetermined thickness to form a split electrode pattern serving as the split electrodes; andintegrally firing the metal base material sheet, the ceramic green sheet, and the split electrode pattern.2. The method for manufacturing a thermistor according to claim 1 , wherein a thickness of the metal base material after firing is 10 to 80 μm claim 1 , and a thickness of the thermistor film layer after firing is 1 to 10 μm.3. The method for manufacturing a thermistor according to claim 1 , wherein when a distance between the split electrodes after firing is defined as Lp and a thickness of the thermistor film layer after firing is defined as Tt claim 1 , Lp≧Tt+5 μm.4. The method for manufacturing a thermistor according to claim 1 , wherein a distance from an end portion of the split electrodes after firing to an end portion of the thermistor film layer ...

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Номер записи: 14
14-11-2013 дата публикации

Ceramic Multilayered Component and Method for Producing a Ceramic Multilayered Component

Номер: US20130300533A1
Автор: Bisplinghoff Gerhard, Hesse Christian, Kloiber Gerald
Принадлежит: EPCOS AG

A ceramic multilayered component which includes a layer stack having a plurality of ceramic layers. The multilayered component includes a first and a second connecting contact as well as a first and a second inner electrode, which are each arranged between two layers of the layer stack. The multilayered component includes a first and a second via electrode for electrically coupling the first connecting contact to the first inner electrode and for electrically coupling the second connecting contact to the second inner electrode. 113-. (canceled)14. A ceramic multilayered component , comprising:a layer stack comprising a plurality of ceramic layers:a first connection contact;a second connection contact;a first internal electrode and a second internal electrode, arranged between two layers of the layer stack;a first via electrode electrically coupling the first connection contact to the first internal electrode; anda second via electrode electrically coupling the second connection contact to the second internal electrode.15. The ceramic multilayered component according to claim 14 , wherein the first connection contact is arranged at a surface of the layer stack and the second connection contact is arranged at an opposite surface claim 14 , and wherein an area of the first connection contact is smaller than an area of the surface and wherein an area of the second connection contact is smaller than an area of the opposite surface.16. The ceramic multilayered component according to claim 14 , wherein the first and the second connection contacts are arranged at a common surface of the layer stack and wherein the area of the first and second connection contacts taken together is smaller than an area of the common surface.17. The ceramic multilayered component according to claim 14 , wherein the internal electrodes are each smaller in projection in a stacking direction of a last stack than the projection of the layer stack.18. The ceramic multilayered component according to ...

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Номер записи: 15
05-12-2013 дата публикации

CHIP RESISTOR AND METHOD OF PRODUCING SAME

Номер: US20130321121A1
Автор: OHBAYASHI Takashi, Sakai Kazunori, SHIRAISHI Seigo
Принадлежит: Panasonic Corporation

An object of the disclosure is to provide a chip resistor without causing the disconnection in atmosphere of sulfidizing gas and without precipitating silver sulfide on its surface. 1. A chip resistor comprising:a substrate having a top surface;a resistor layer disposed on the top surface of the substrate;a pair of first upper electrode layers disposed on the top surface of the substrate and being electrically connected to the resistor layer at both sides of the resistor layer; anda pair of second upper electrode layers disposed on the pair of the first upper electrode layers and including between 75% by weight and 85% by weight (inclusive) of silver particles with an average particle diameter ranging from 0.3 μm to 2 μm, between 1% by weight and 10% by weight (inclusive) of carbon, and a resin.2. The chip resistor according to claim 1 , further comprising:a protecting layer disposed so as to cover the resistor layer and a part of the pair of the second upper electrode layers; anda side electrode layer disposed at the side of the substrate, the side electrode layer being electrically connected to the pair of the second upper electrode layers.3. The chip resistor according to claim 2 , further comprising:a plated layer disposed on the surfaces of the pair of the second upper electrode layers and the side electrode layer.4. A method for producing a chip resistor comprising the steps of:providing a pair of first electrode layers on a top surface of a substrate;providing a resistor layer between the pair of the first electrode layers, both sides of the resistor layer being electrically connected to the pair of the first electrode layers;providing a pair of second upper electrode layers on the pair of the first upper electrode layers, the pair of the second upper electrode layers including between 75% by weight and 85% by weight (inclusive) of silver particles with an average particle diameter ranging from 0.3 μm to 2 μm, between 1% by weight and 10% by weight (inclusive ...

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Номер записи: 16
19-12-2013 дата публикации

THERMAL HEAD, PRINTER, AND METHOD OF MANUFACTURING THERMAL HEAD

Номер: US20130335500A1
Автор: KOROISHI Keitaro, MOROOKA Toshimitsu, SANBONGI Norimitsu
Принадлежит: SEIKO INSTRUMENTS INC.

A thermal head comprises: a support substrate; an upper substrate arranged on the support substrate on one surface side thereof in a laminated state; an intermediate layer which is arranged between the upper substrate and the support substrate to bond the upper substrate and the support substrate to each other, and which has one of a through hole and a concave portion to form a cavity portion between the upper substrate and the support substrate; and a heat generating resistor formed on a surface of the upper substrate on a side opposite to the support substrate at a position opposed to the cavity portion, wherein the upper substrate has a melting point lower than a melting point of the intermediate layer. 1. A thermal head comprising:a support substrate;an upper substrate arranged on the support substrate on one surface side thereof in a laminated state;an intermediate layer which is arranged between the upper substrate and the support substrate to bond the upper substrate and the support substrate to each other, and which has one of a through hole and a concave portion to form a cavity portion between the upper substrate and the support substrate; anda heat generating resistor formed on a surface of the upper substrate on a side opposite to the support substrate at a position opposed to the cavity portion,wherein the upper substrate has a melting point lower than a melting point of the intermediate layer.2. A thermal head according to claim 1 , whereinthe upper substrate is formed in a range which is larger than an opening area of the one of the through hole and the concave portion of the intermediate layer and which is smaller than an area of the one surface of the support substrate.3. A thermal head according to claim 2 , further comprising:any one of the above-mentioned thermal heads; anda pressure mechanism which delivers a thermal recording medium while pressing the thermal recording medium against the heat generating resistor of the thermal head.4. A thermal ...

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Номер записи: 17
19-12-2013 дата публикации

RESISTOR, METHOD OF ASSEMBLING THE SAME, AND SWITCHGEAR

Номер: US20130335887A1
Автор: MORII Hiroaki, Morita Ayumu, OKADA Naoya, SHIINA Akitaka, Tsuchiya Kenji, YAMAMOTO Mitsuaki, YANAGISAWA Takao
Принадлежит:

A resistor for suppressing magnetizing inrush current includes a container made of an insulating material and at least one resistive element housed in the container, the resistive element being connected to two bushings provided at the container, the outer surface of the container being coated with a conductive paint, and the paint being connected to the ground, thereby being able to be located between a cable and a switch, and being able to fix the outer surface thereof to a ground voltage level so that human contact safety is not impaired. 1. A resistor comprising:a container made of an insulating material; andat least one resistive element housed in the container,wherein the resistive element is connected to two bushings provided at the container;wherein an outer surface of the container is coated with a conductive paint; andwherein the paint is connected to a ground.2. The resistor according to claim 1 ,wherein the container is made of resin; andwherein at least one resistive element in a circular ring shape is housed in the container.3. The resistor according to claim 1 , wherein one of the two bushings is connected to a cable and the other bushing is connected to a switch.4. The resistor according to claim 1 ,wherein metal plates are located over and under the resistive element; andwherein the metal plates are connected to conductors of the bushings respectively.5. The resistor according to claim 2 ,wherein metal plates are located over and under the resistive element; andwherein the metal plates are connected to conductors of the bushings respectively.6. The resistor according to claim 3 ,wherein metal plates are located over and under the resistive element; andwherein the metal plates are connected to conductors of the bushings respectively.7. The resistor according to claim 4 ,wherein a spring is located over the metal plate located over the resistive element;wherein an insulating plug is located over the spring and a metal lid is located over the ...

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Номер записи: 18
26-12-2013 дата публикации

METHOD FOR MANUFACTURING A CHIP RESISTOR

Номер: US20130341301A1
Автор: Chen Full
Принадлежит: RALEC ELECTRONIC CORPORATION

In a method of manufacturing a chip resistor, a semi-product is formed by sandwiching an electric-insulating material layer between an electric-conducting material layer and a heat-dissipating material layer. Resistor sections arranged in an array on the semi-product are formed by forming longitudinal first slots and transverse second slots through the semi-product. Slits are formed on a first layer of each resistor section to form a resistor main body. A dividing slot is formed on a second layer of each resistor section. Two electrodes are formed to be electrically connected to opposite ends of the resistor main body. The resistor sections are trimmed from the semi-product to obtain the chip resistors. 1. A method for manufacturing a chip resistor , said method comprising the following steps of:a) sandwiching an electric-insulating material layer between an electric-conducting material layer and a heat-dissipating material layer to form a semi-product; forming a plurality of first slots through the semi-product, the first slots extending in a first direction and being arranged in a plurality of rows, each row including a plurality of adjacent pairs of the first slots, and', 'forming a plurality of second slots through the semi-product, the second slots extending in a second direction perpendicular to the first direction and being arranged in a plurality of columns, each adjacent pair of the second slots cooperating with a corresponding adjacent pair of the first slots to surround and define one of the resistor sections, each of the resistor sections having a first layer which is a segment of the electric-conducting material layer, a second layer which is a segment of the heat-dissipating material layer, and a sandwiched layer which is a segment of the electric-insulating material layer;, 'b) forming a plurality of resistor sections arranged in an array on the semi-product by'}c) for each resistor section, forming a plurality of slits on the second layer of the ...

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Номер записи: 19
06-02-2014 дата публикации

OVER-CURRENT PROTECTION DEVICE AND METHOD OF MAKING THE SAME

Номер: US20140035719A1
Автор: Chen Kuo Hsun, LEE Wen Feng, Lu Ming Hsun, SHA YI AN, TSENG Chun Teng
Принадлежит: POLYTRONICS TECHNOLOGY CORP.

An over-current protection device has a PTC device, first and second electrodes and an insulation layer. The PTC device comprises first and second electrically conductive members and a PTC layer laminated between the first and second electrically conductive members. The first and second electrodes are electrically connected to the first and second electrically conductive members, respectively. The insulation layer is disposed on a surface of the first electrically conductive member. The device is a stack structure extending along a first direction, and comprises at least one hole extending along a second direction substantially perpendicular to the first direction. The value of the covered area of the hole divided by the area of the form factor of the over-current protection device is not less than 2%, and the value of the thickness of the device divided by the number of the PIC devices is less than 0.7 mm. 1. An over-current protection device , comprising:at least one PTC device of a thickness less than around 0.4 mm, the PTC device comprising a first electrically conductive member, a second electrically conductive member and a PTC material layer laminated between the first and second electrically conductive members;a first electrode electrically connected to the first electrically conductive member;a second electrode electrically connected to the second electrically conductive member; anda first insulating layer disposed on the first electrically conductive member and having a thickness between around 10 μm and 65 μm;wherein the over-current protection device is a stack structure extending along a first direction, and comprises at least one bole extending along a second direction substantially perpendicular to the first direction, a value of as covered area of the hole divided by an area of the form factor of the over-current protection device is equal to or greater than 2%, and a value of the thickness of the over-current protection device divided by the number ...

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Номер записи: 20
20-02-2014 дата публикации

CHIP RESISTOR AND METHOD OF MANUFACTURING THE SAME

Номер: US20140049358A1
Автор: KANG Heun Ku, KIM Jung II, Kim Yong Min, KIM Young Tae, TANAKA Ichiro
Принадлежит: SAMSUNG ELECTRO-MECHANICS CO., LTD.

There are provided a chip resistor and a method of manufacturing the same. The chip resistor includes a ceramic substrate; an adhesion portion formed on a surface of the ceramic substrate; and a resistor formed on the adhesion portion, wherein the adhesion portion includes at least one of copper (Cu), nickel (Ni), and copper-nickel (Cu—Ni). 1. A chip resistor , comprising:a ceramic substrate;an adhesion portion formed on a surface of the ceramic substrate; anda resistor formed on the adhesion portion,wherein the adhesion portion includes at least one of copper (Cu), nickel (Ni), and copper-nickel (Cu—Ni).2. The chip resistor of claim 1 , wherein the resistor includes at least one of copper-nickel (Cu—Ni) claim 1 , copper-nickel-manganese (Cu—Ni—Mn) claim 1 , and nickel-chromium (Ni—Cr).3. The chip resistor of claim 1 , further comprising an electrode formed on a surface of the resistor.4. The chip resistor of claim 3 , further comprising an additional electrode formed on a surface of the electrode to precisely adjust resistance.5. The chip resistor of claim 3 , further comprising a protective layer partially covering the resistor and the electrode.6. A method of manufacturing a chip resistor claim 3 , the method comprising:preparing a ceramic substrate;printing an adhesive paste including at least one of copper (Cu),nickel (Ni),andcopper-nickel (Cu—Ni) on a surface of the ceramic substrate; andforming a resistor on an upper surface of the adhesive paste.7. The method of claim 6 , wherein the resistor includes at least one of copper-nickel (Cu—Ni) claim 6 , copper-nickel-manganese (Cu—Ni—Mn) claim 6 , and nickel-chromium (Ni—Cr).8. The method of claim 6 , further comprising forming an electrode by printing an electrode paste on a surface of the resistor.9. The method of claim 8 , further comprising firing the electrode.10. The method of claim 9 , wherein the firing of the electrode is performed at a temperature from 800° C. to 1400° C.11. The method of claim 9 , ...

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Номер записи: 21
27-02-2014 дата публикации

CHIP RESISTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Номер: US20140055228A1
Автор: Wang Wan-Ping
Принадлежит: RALEC ELECTRONIC CORPORATION

A chip resistor device includes an insulating substrate, two indented patterns, and a resistor unit. The insulating substrate has opposite first and second surfaces. The first surface has two opposite edges and two electrode forming regions adjacent to the two opposite edges, respectively. The indented patterns are respectively formed in the electrode forming regions of the first surface and indented from the first surface. The resistor unit includes two contact electrodes respectively formed on the electrode forming regions of the first surface and filled into the indented patterns, and a resistor formed on the first surface between the two contact electrodes and electrically contacting the contact electrodes. 1. A chip resistor device , comprising:an insulating substrate having a first surface and a second surface opposite to said first surface, said first surface having two opposite edges and two electrode forming regions adjacent to said two opposite edges respectively;two indented patterns respectively formed in said electrode forming regions of said first surface and indented from said first surface; and two contact electrodes respectively formed on said electrode forming regions of said first surface and filled into said indented patterns; and', 'a resistor formed on said first surface between said two contact electrodes and electrically contacting said contact electrodes., 'a resistor unit including2. The chip resistor device of claim 1 , wherein each of said indented patterns includes at least one notch.3. The chip resistor device of claim 2 , wherein said notch of each of said indented patterns is formed using a diamond blade or laser.4. The chip resistor device of claim 1 , further comprising an insulating protection layer which covers said resistors.5. A method for fabricating a chip resistor device claim 1 , comprising the steps of:(a) defining a plurality of substrates on an insulating film by a plurality of spaced-apart and interlaced splitting ...

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Номер записи: 22
06-03-2014 дата публикации

METHOD AND APPARATUS FOR MANUFACTURING METAL PLATE CHIP RESISTORS

Номер: US20140059838A1
Автор: Hirano Tatsuki, TANAKA Kazuo
Принадлежит: KAMAYA ELECTRIC CO., LTD.

The object of the invention is to provide a method and an apparatus that allow production of metal plate chip resistors having a relatively low resistance with high accuracy and yield through simple process. The object is achieved by apparatus for manufacturing metal plate chip resistors including cutting mold for cutting intermediate product strip transversely to obtain worked product chip, ohm meter for measuring the resistance of the worked product chip, control device having a calculating part for performing a calculation using the resistance measured by the ohm meter to work out a width in which the strip is to be cut transversely so as to obtain a worked product chip of a desired resistance, and cutting width adjustor for making an adjustment so that the strip is to be cut transversely in the width obtained from the calculating part. 1. A method for manufacturing metal plate chip resistors comprising the steps of:cutting a resistive metal plate strip transversely in a predetermined width corresponding to a width of one chip resistor to obtain a resistive metal plate chip, said resistive metal plate strip having been provided with an electrode film along each longitudinal edge and a protective film between the electrode films along the edges,measuring a resistance of said resistive metal plate chip, andperforming a calculation using a measured value to work out a cutting width in which said resistive metal plate strip is to be cut transversely in a next cutting step so as to obtain a resistive metal plate chip of a desired resistance,wherein said method is characterized by the further steps of:cutting said resistive metal plate strip transversely in said cutting width obtained from said step of performing a calculation,measuring a resistance of a resulting resistive metal plate chip, andperforming a calculation using a measured resistance to work out a cutting width in which said resistive metal plate strip is to be cut transversely in a next cutting step so as ...

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Номер записи: 23
13-01-2022 дата публикации

SUPPORT ARRANGEMENT FOR AN ELECTRICAL PROTECTION ASSEMBLY

Номер: US20220013258A1
Автор: Risi Kevin Philip, Risi Philip Edward Lawrence, Risi Shaun Lawrence
Принадлежит: THE TRUSTEES FOR THE TIME BEING OF THE LIVE LINE INTERNATIONAL TRUST

A support arrangement for an electrical protection assembly for connection between an electrical power supply line and electrical equipment is provided. The support arrangement comprises a first insulator body and a second insulator body extending at right angles to the first insulator body, wherein the first and second insulator bodies are integrally formed into a unitary body. In an embodiment, the second insulator body extends from a lower end of the first insulator body, so as to define a unitary L-shaped support arrangement. In one version, the support arrangement comprises an L-shaped inner support frame around which the first and second insulator bodies are molded. The L-shaped inner support frame comprises a T-shaped metal connector having a first end from which a first fibre glass support arm extends, around which the first insulator body is molded, and a second end from which a second fibre glass support arm extends, around which the second insulator body is molded. 2. The support arrangement of claim 1 , wherein the second insulator body extends from a lower end of the first insulator body claim 1 , at right angles thereto claim 1 , so as to define a unitary L-shaped support arrangement.3. The support arrangement of claim 1 , wherein displaceable upper arm extends across the top of the support arrangement claim 1 , with a fuse cutout assembly comprising a fuse tube extending on the side of the support arrangement with the second insulator body claim 1 , and on the other side of the support arrangement there is a surge protection assembly comprising a drop out voltage surge protection unit.4. The support arrangement of claim 3 , wherein the upper end of the fuse tube is releasably fitted to a first end of the displaceable upper arm claim 3 , with the distal end of the second insulator body including a first bracket with a connector at its free end to accommodate the lower end of the fuse tube claim 3 , in use claim 3 , in a pivotal manner.5. The support ...

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Номер записи: 24
07-01-2021 дата публикации

CHIP RESISTOR

Номер: US20210005361A1
Автор: IGUCHI Natsuki, KAMIJO Yasuhiro, USHIYAMA Kazuhisa
Принадлежит: KOA Corporation

An object is to provide a chip resistor in which hot spots can be dispersed and the adverse effects on performance caused by microcracks can also be reduced. A chip resistor includes an insulating substrate, a resistive element, and electrodes. In the resistive element, a first trimming groove and a second trimming groove are formed. A first vertical groove of the first trimming groove and a second vertical groove of the second trimming groove are formed with a spacing in between in an X1-X2 direction. A first horizontal groove of the first trimming groove and a second horizontal groove of the second trimming groove extend in directions approaching each other, and terminal ends of the first horizontal groove and the second horizontal groove are formed to be separated in the X1-X2 direction such that the first horizontal groove and the second horizontal groove do not overlap in a Y1-Y2 direction. 1. A chip resistor comprising:a substrate;a resistive element formed on a surface of the substrate; andelectrodes formed on either side of the resistive element, whereinin the resistive element, at least a first trimming groove and a second trimming groove are formed,the first trimming groove and the second trimming groove have respective vertical grooves that extend orthogonally from one edge of the resistive element that faces a direction orthogonal to a direction between the electrodes, and additionally have horizontal grooves bent from the vertical grooves and extending in the direction between the electrodes,the first vertical groove of the first trimming groove and the second vertical groove of the second trimming groove are formed with a spacing in between in the direction between the electrodes, andthe first horizontal groove of the first trimming groove and the second horizontal groove of the second trimming groove extend in directions approaching each other, and in addition, terminal ends of the first horizontal groove and the second horizontal groove are formed to ...

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Номер записи: 25
07-01-2021 дата публикации

PPTC DEVICE HAVING RESISTIVE COMPONENT

Номер: US20210005362A1
Автор: Chen Jianhua, Tsang Chun Kwan
Принадлежит: LITTELFUSE, INC.

A PPTC assembly may include a PPTC component, having a trip temperature, and further comprising a first temperature coefficient of resistance, in a low temperature range below the trip temperature. The PPTC assembly may include a resistive component, disposed in electrical contact with the PPTC component on a first side of the PPTC component, the resistive component comprising an electrical conductor, and having a second temperature coefficient of resistance in the low temperature range, less than the first temperature coefficient of resistance. The PPTC component may include a first electrode, electrically coupled to the first side of the PPTC component, and a second electrode, electrically coupled to the second side of the PPTC component, where the PPTC component and the resistive component are arranged in electrical series between the first electrode and the second electrode. 1. A polymer positive temperature coefficient (PPTC) assembly , comprising:a PPTC component, the PPTC component comprising a trip temperature, and further comprising a first temperature coefficient of resistance, in a low temperature range below the trip temperature;and a resistive component, disposed in electrical contact with the PPTC component on a first side of the PPTC component, the resistive component comprising an electrical conductor, and having a second temperature coefficient of resistance in the low temperature range, less than the first temperature coefficient of resistance;a first electrode, electrically coupled to the first side of the PPTC component; anda second electrode, electrically coupled to a second side of the PPTC component, wherein the PPTC component and the resistive component are arranged in electrical series between the first electrode and the second electrode.2. The PPTC assembly of claim 1 , wherein the resistive component comprises a thin resistor material claim 1 , a metal thin film resistor claim 1 , a conductive polymer composite claim 1 , a ceramic metal ...

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Номер записи: 26
07-01-2021 дата публикации

SURGE ARRESTER AND METHOD FOR INSTALLING A SURGE ARRESTER

Номер: US20210005363A1
Автор: PIPPERT ERHARD
Принадлежит:

A surge arrester includes a tubular housing and an end fitting which is connected to one end of the housing and on which a column having at least one electrical resistor is disposed. A support abuts the inner surface of the tubular housing in the region of the end fitting. The support has a recess in the longitudinal direction of the surge arrester, into which a pressure device is inserted. A method for installing a surge arrester is also provided. 115-. (canceled)16. A surge arrester , comprising:a tubular housing having an end and an inner surface;an end fitting connected to said end of said housing;a column disposed on said end fitting, said column having at least one electrical resistor;a support abutting said inner surface of said tubular housing in a region of said end fitting, said support having a recess formed in a longitudinal direction of the surge arrester; anda pressure device inserted in said recess.17. The surge arrester claim 16 , according to claim 16 , wherein said pressure device is wedge-shaped.18. The surge arrester according to claim 16 , wherein said pressure device is form-lockingly disposed in said recess.19. The surge arrester according to claim 16 , wherein:said recess has two contact regions contacting said pressure device;said contact regions each have a guide groove;said pressure device has sides facing said contact regions and a respective guide projection on each of said sides; andsaid guide projections are disposed in said guide grooves.20. The surge arrester according to claim 19 , wherein said guide grooves and said guide projections fix said pressure device on said support and produce a cylinder-barrel-shaped outer contour of said pressure device and said support being pressed against said inner surface of said tubular housing without damage.21. The surge arrester according to claim 16 , wherein said support is a hollow cylinder.22. The surge arrester according to claim 16 , wherein said pressure device is one of a plurality of ...

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Номер записи: 27
02-01-2020 дата публикации

CHIP RESISTOR AND METHOD FOR MANUFACTURING THE SAME

Номер: US20200005972A1
Автор: IMAHASHI Wataru, SHINOURA Takanori
Принадлежит:

A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode. 132-. (canceled)33. A chip resistor comprising:a substrate including a first surface, a second surface opposite to the first surface, and a side surface disposed between the first surface and the second surface in a thickness direction of the substrate, the first surface including a first end part and a second end part that are spaced apart from each other in a first direction in plan view;an upper electrode located on the first end part of the first surface;a resistor element located on the first surface of the substrate and electrically connected to the upper electrode;a first insulating layer covering the upper electrode and the resistor element;a second insulating layer formed on the first insulating layer;a protective layer formed on the upper electrode and including a portion located between the first insulating layer and the second insulating layer in the thickness direction; anda side electrode electrically connected to the upper electrode and including a first portion and a second portion, the first portion being located on the side surface of the substrate, the ...

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Номер записи: 28
20-01-2022 дата публикации

Surge Arresters and Related Assemblies and Methods

Номер: US20220020513A1
Автор: Gastaldi Eduardo, Kumar Senthil A., Yaworski Harry
Принадлежит:

A surge arrester includes a polymer body including a first leg having a first channel defined therein and a second leg perpendicular to the first leg and having a second channel defined therein. A varistor assembly is in the first channel. The varistor assembly includes a plurality of varistor elements electrically connected in series and forming a stack of the plurality of varistor elements. The stack has a first end surface, a second end surface, and an outer side surface extending between the first end surface and the second end surface. The varistor assembly includes a first end fitting at the first end surface of the stack, a second end fitting at the second end surface of the stack, a plurality of rods disposed around the side surface of the stack, and a polymer fill layer between the side surface of the stack and the first leg of the body. 1. A surge arrester comprising: a first leg having a first channel defined therein; and', 'a second leg perpendicular to the first leg and having a second channel defined therein, the second channel configured to receive a bushing;, 'a polymer body comprising a plurality of varistor elements electrically connected in series and forming a stack of the plurality of varistor elements, wherein the stack has a first end surface, a second end surface, and an outer side surface extending between the first end surface and the second end surface;', 'a first end fitting at the first end surface of the stack;', 'a second end fitting at the second end surface of the stack;', 'a plurality of rods disposed around the side surface of the stack, each rod comprising a first end that is connected to the first end fitting and a second end that is connected to the second end fitting; and', 'a polymer fill layer between the side surface of the stack and the first leg of the body., 'a varistor assembly in the first channel, the varistor assembly comprising2. The surge arrester of wherein the fill layer fills an air void that would otherwise be ...

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Номер записи: 29
10-01-2019 дата публикации

HEATING ELEMENT FOR A COOKING APPLIANCE

Номер: US20190008322A1
Автор: Bergel Noah, Ellena Joseph D., Feldman Benjamin F., Hull David, Lollar Pat, Musman Thomas, Reyes Aurelio, Simmers Richard
Принадлежит:

A heating element for a cooking appliance includes terminals that act as electrically conductive contact points. One or more buses are arranged between the terminals, and connect one or more heating element segments in a zig-zag configuration. The heating element segments are connected in series and are arranged parallel with one another. Each heating element segment includes a plurality of cutouts linked together and having an elliptical shape. The terminals, heating element segments, and buses are a continuous single sheet of conductive material. A method of making the heating element includes forming a pattern into the sheet of conductive material by etching the pattern into the conductive sheet using photolithography. 1. A heating element for a cooking appliance , the heating element comprising:first and second terminals; andone or more heating element segments extending between the first and second terminals, each heating element segment having a plurality of cutouts arranged in a repeating pattern, each cutout having an elliptical shape;wherein the first and second terminals and the one or more heating element segments are a continuous single sheet of material.2. The heating element of claim 1 , further comprising one or more buses arranged between the first and second terminals claim 1 , the one or more buses connecting the one or more heating element segments in a zig-zag configuration.3. The heating element of claim 1 , further comprising a first set of heating element segments having a first length claim 1 , a second set of heating element segments having a second length claim 1 , and a third set of heating element segments having a third length;wherein the third set of heating element segments are arranged between the first and second sets of heating element segments, and wherein the first length is less than the second length, and the second length is less than the third length.4. The heating element of claim 3 , wherein the length of the first set of ...

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Номер записи: 30
27-01-2022 дата публикации

LEAD-FREE GLASS PASTE, CHIP RESISTOR AND METHOD FOR PRODUCING SAME

Номер: US20220024808A1
Автор: SHEN Hongkun
Принадлежит:

A lead-free glass paste, a chip resistor and a method for producing the same are provided. The lead-free glass paste includes 6-7 parts by mass of borosilicate oil, 12-21 parts by mass of aluminum oxide powder, 2-3 parts by mass of glass fiber powder, and 0.1-0.5 parts by mass of a curing agent. 1. A lead-free glass paste , comprising 6-7 parts by mass of borosilicate oil , 12-21 parts by mass of aluminum oxide powder , 2-3 parts by mass of glass fiber powder , and 0.1-0.5 parts by mass of a curing agent.2. The lead-free glass paste of claim 1 , wherein the borosilicate oil comprises 100-115 parts by mass of a phenyl-containing silicon substance claim 1 , 13-28 parts by mass of a boron-containing monomer claim 1 , 50-75 parts by mass of silane claim 1 , and 60-80 parts by mass of dihydroxypyridine.3. The lead-free glass paste of claim 2 , wherein the phenyl-containing silicon substance comprises at least one of ethoxydiphenylsilane claim 2 , diphenyldimethoxysilane or diphenylsilanediol; the silane comprises at least one of dichlorodimethylsilane claim 2 , dichlorodiethylsilane or dichlorodiphenylsilane; the dihydroxypyridine comprises at least one of 2 claim 2 ,4-dihydroxypyridine claim 2 , 2 claim 2 ,6-dihydroxypyridine or 3 claim 2 ,5-dihydroxypyridine; the boron-containing monomer comprises at least one of boric acid claim 2 , phenylboronic acid claim 2 , tri-isopropyl borate or dichlorophenylborane.4. The lead-free glass paste of claim 1 , wherein the aluminum oxide powder comprises at least one of nanoscale aluminum oxide powder claim 1 , gas-phase aluminum oxide powder or α-type nanoscale aluminum oxide powder.5. The lead-free glass paste of claim 1 , wherein the glass fiber powder comprises at least one of alkali-free glass fiber powder claim 1 , alkali-resistant glass fiber powder claim 1 , high-alkali glass fiber powder or medium-alkali glass fiber powder.6. The lead-free glass paste of claim 1 , wherein the curing agent comprises at least one of ...

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Номер записи: 31
11-01-2018 дата публикации

Resistor and method for manufacturing resistor

Номер: US20180012685A1
Автор: Masahito Komasaki, Toshiyuki Nagase
Принадлежит: Mitsubishi Materials Corp

The resistor includes a chip resistive element which includes a resistive element and metal electrodes and which is formed on first surface of a ceramic substrate, metal terminals electrically joined to the metal electrodes, and an Al member formed on the second surface side of the ceramic substrate, wherein the ceramic substrate and the Al member are joined using an Al—Si-based brazing filler metal, the metal electrodes and the metal terminals are joined to each other using a solder, and a degree of bending of an opposite surface of the Al member opposite to a surface on the ceramic substrate side is in a range of −30 μm/50 mm to 700 μm/50 mm.

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Номер записи: 32
14-01-2021 дата публикации

CHIP RESISTOR AND METHOD FOR MANUFACTURING THE SAME

Номер: US20210012932A1
Автор: IMAHASHI Wataru, SHINOURA Takanori
Принадлежит:

A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode. 132-. (canceled)33. A chip resistor comprising:a substrate having a first surface, a second surface and a side surface, the first and the second surfaces being spaced apart from each other in a thickness direction of the substrate, the side surface being located between the first surface and the second surface;an upper electrode provided on the first surface of the substrate;a resistor element arranged on the first surface of the substrate and electrically connected to the upper electrode;a side electrode electrically connected to the upper electrode and has a first, a second and a third portion, the first portion being arranged on the side surface of the substrate, the second portion and the third portion overlapping with the first surface and the second surface in the thickness direction, respectively;an intermediate electrode covering the side electrode;an external electrode covering the intermediate electrode;a first protective layer located between the upper electrode and the intermediate electrode, the first protective layer being in contact with the upper ...

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Номер записи: 33
12-01-2017 дата публикации

CHIP RESISTOR, METHOD OF PRODUCING CHIP RESISITOR AND CHIP RESISTOR PACKAGING STRUCTURE

Номер: US20170013719A1
Автор: NAKA Kentaro
Принадлежит:

[Object] A method for efficiently manufacturing chip resistors is provided. 1. A chip resistor manufacturing method comprising the steps of:preparing at least three conductive elongated boards made of an electrically conductive material and a resistive member made of a resistive material;arranging said at least three conductive elongated boards apart from each other in a width direction crossing a longitudinal direction in which one of said at least three conductive elongated boards is elongated;forming a resistor aggregate by bonding the resistive member to said at least three conductive elongated boards; andcollectively dividing the resistor aggregate into a plurality of chip resistors by punching, each of the chip resistors including two electrodes and a resistor portion bonded to the two electrodes.2. The method according to claim 1 , wherein the step of forming a resistor aggregate uses welding.3. The method according to claim 2 , wherein the step of forming a resistor aggregate uses high energy beam wielding.4. The method according to claim 3 , wherein the step of forming a resistor aggregate uses electron beam welding or laser beam welding as the high energy beam welding.5. The method according to claim 1 , further comprising the step of bending one of said at least three conductive elongated boards.6. The method according to claim 5 , wherein the bending step is performed at the same time as the collectively dividing step.7. The method according to claim 1 , wherein one of said at least three conductive elongated boards has a thickness smaller than a thickness of the resistive member.8. The method according to claim 1 , wherein the resistive member includes a plurality of resistive elongated boards claim 1 , andthe step of forming a resistor aggregate comprises bonding each of the resistive elongated boards to two of said at least three conductive elongated boards.9. The method according to claim 8 , wherein the step of forming a resistor aggregate comprises ...

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Номер записи: 34
17-01-2019 дата публикации

ELECTRICAL FUSE AND/OR RESISTOR STRUCTURES

Номер: US20190019752A1
Автор: Basker Veeraraghavan S., Cheng Kangguo, Khakifirooz Ali, Li Juntao
Принадлежит:

Electrical fuse (eFuse) and resistor structures and methods of manufacture are provided. The method includes forming metal gates having a capping material on a top surface thereof. The method further includes protecting the metal gates and the capping material during an etching process which forms a recess in a dielectric material. The method further includes forming an insulator material and metal material within the recess. The method further includes forming a contact in direct electrical contact with the metal material. 1. A semiconductor structure , comprising:metal gates having a capping material on a top surface thereof;contact structures in recesses in a dielectric material between the metal gates;an opening in the dielectric material, wherein the opening is between the contact structures; andan insulator material and metal material within the opening.2. The semiconductor structure of wherein the metal material contacts surfaces of the dielectric material in the opening.3. The semiconductor structure of claim 2 , wherein the insulator material is in a trench in the metal material.4. The semiconductor structure of claim 1 , wherein the contact structures each comprise a liner formed in one of the recesses in the dielectric material.5. The semiconductor structure of claim 4 , wherein the metal material contacts the liner of each of the contact structures.6. The semiconductor structure of claim 1 , wherein top surfaces of the dielectric layer claim 1 , the capping material claim 1 , the contact structures claim 1 , the insulator material claim 1 , and the metal material are co-planar.7. The semiconductor structure of claim 1 , further comprising:another dielectric layer over the dielectric layer, the capping material, the contact structures, the insulator material, and the metal material; andadditional contacts in the other dielectric layer.8. The semiconductor structure of claim 7 , wherein the additional contacts contact the contact structures claim 7 , ...

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Номер записи: 35
29-01-2015 дата публикации

CHIP THERMISTOR AND METHOD OF MANUFACTURING SAME

Номер: US20150028992A1
Автор: SAITO Yo, TSUCHIDA Daisuke, YAMADA Kouki
Принадлежит: TDK Corporation

A chip thermistor has a thermistor portion comprised of a ceramic material containing respective metal oxides of Mn, Ni, and Co as major ingredients; a pair of composite portions comprised of a composite material of Ag—Pd, and respective metal oxides of Mn, Ni, and Co and arranged on both sides of the thermistor portion so as to sandwich in the thermistor portion between the composite portions ; and external electrodes connected to the pair of composite portions , respectively. In this manner, the pair of composite portions are used as bulk electrodes and, for this reason, the resistance of the chip thermistor can be adjusted mainly with consideration to the resistance in the thermistor portion , without need for much consideration to the distance between the external electrodes and other factors. 1. A chip thermistor comprising:a thermistor portion comprised of a ceramic material containing a metal oxide of at least one of Mn, Ni, or Co as a major ingredient;a pair of composite portions comprised of a composite material including a metal and a metal oxide and arranged on both sides of the thermistor portion so as to sandwich in the thermistor portion between the composite portions.2. The chip thermistor according to claim 1 , wherein the thermistor portion is configured in a layered structure such that a direction in which the pair of composite portions are opposed to each other is a laminated direction.3. The chip thermistor according to claim 1 , wherein each of the pair of composite portions is configured in a layered structure such that a direction in which the pair of composite portions are opposed to each other is a laminated direction.4. The chip thermistor according to claim 1 , wherein the thermistor portion is substantially totally connected to the pair of composite portions claim 1 , on both sides thereof.5. The chip thermistor according to claim 1 , wherein the thermistor portion is composed of a thermistor element having a negative characteristic claim ...

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Номер записи: 36
10-02-2022 дата публикации

PROCESS FOR MANUFACTURING A PTC HEATING ELEMENT AND PTC HEATING ELEMENT

Номер: US20220044850A1
Автор: BITTO-GOLON Florian, Blüml Alfred, KNÜPFER Yves, KÜMPEL Andreas
Принадлежит:

A process manufactures a PTC heating element () that includes at least one PTC component () and, on at least one side () of the at least one PTC component (), at least one carrier () permanently connected to the PTC component (). The process includes arranging solder material () between the one side of the at least one PTC component (), which side is to be permanently connected to the at least one carrier (), and the at least one carrier to be connected on this side of the at least one PTC component (). The solder material () is melted by induction soldering to connect the at least one PTC component () to the at least one carrier (). 1. A process for manufacturing a PTC heating element , wherein the PTC heating element comprises at least one PTC component and a carrier permanently connected to the at least one PTC component on at least one side of the at least one PTC component , the process comprising the steps of:arranging solder material between the at least one side of the at least one PTC component, which side is to be permanently connected to the carrier, and the carrier to be connected on the least one side of the at least one PTC component; andmelting the solder material by induction soldering and thereby connecting the at least one PTC component to the carrier.2. The process in accordance with claim 1 , wherein:the step of arranging solder material comprises applying solder material to the at least one side of the at least one PTC component, which side is to be connected to the carrier; orthe step of arranging solder material comprises applying solder material to the carrier to be connected to the at least one PTC component; orthe step of arranging solder material comprises applying solder material to the at least one side of the at least one PTC component, which side is to be connected to the carrier and also applying solder material to the carrier to be connected to the at least one PTC component.3. The process in accordance with claim 2 , wherein ...

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Номер записи: 37
24-01-2019 дата публикации

SURFACE MOUNT RESISTORS AND METHODS OF MANUFACTURING SAME

Номер: US20190027280A1
Автор: Smith Clark, Wyatt Todd
Принадлежит: VISHAY DALE ELECTRONICS, LLC

Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of conductive elements. The plurality of conductive elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of conductive elements and a surface of the resistive element. The plurality of conductive elements is coupled to the resistive element. 1. A resistor comprising:a resistive element;first and second conductive elements electrically insulated from one another by a dielectric material, the first and second conductive elements thermally coupled to an upper surface of the resistive element via an adhesive, the first conductive element and the second conductive element each having an upper portion that is stepped, angled or rounded;wherein the first conductive element has a first outer edge in alignment with a first outer edge of the resistive element so as to form a generally planar first side surface, and the second conductive element has a second outer edge in alignment with a second outer edge of the resistive element so as to form a generally planar second side surface;a first plated layer disposed so as to directly contact the first side surface and extend beneath at least a portion of the bottom surface of the resistive element; anda second plated layer disposed so as to directly contact the second side surface and extend beneath at least a portion of the bottom surface of the resistive element.2. The resistor of claim 1 , wherein the first conductive element and the second conductive element comprise heat spreaders.3. The resistor of claim 1 , wherein the first conductive element and the second conductive element provide support for the resistive element.4. The resistor of claim 1 , wherein the adhesive is positioned only between the first and second conductive elements and the resistive element.5. ...

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Номер записи: 38
24-01-2019 дата публикации

EPOXY-BASED RESIN SYSTEM COMPOSITION CONTAINING A LATENT FUNCTIONALITY FOR POLYMER ADHESION IMPROVEMENT TO PREVENT SULFUR RELATED CORROSION

Номер: US20190027281A1
Автор: Boday Dylan J., Kuczynski Joseph, Wertz Jason T., Zhang Jing
Принадлежит:

An epoxy-based resin system composition includes a latent functionality for polymer adhesion improvement. The composition may be used to produce an overcoat layer and/or protection layer in an anti-sulfur resistor (ASR). In some embodiments, the composition include epoxy-based resin(s), hardener(s) and, optionally, blowing agent(s) and/or filler(s). An epoxide functionality of one or more of the epoxy-based resin(s) and a reactive functionality of one or more of the hardener(s) react with each other at a first temperature. The latent functionality, which does not react at the first temperature, is contained in at least one of the epoxy-based resin(s), hardener(s) and filler(s) and reacts in response to another stimulus (e.g., UV light/initiator and/or a second temperature greater than the first temperature) to enhance chemical bonding. Optionally, voids created via etching and/or the blowing agent(s) may be used to enhance mechanical bonding, alone, or in combination with filler(s) exposed in the voids. 1. A composition , comprising:one or more epoxy-based resins, wherein at least one of the one or more epoxy-based resins includes a first epoxide functionality;one or more hardeners, wherein at least one of the one or more hardeners includes a first reactive functionality, and wherein the first reactive functionality and the first epoxide functionality react with each other at a first temperature;one or more filler materials, wherein a latent functionality is contained in the one or more filler materials, wherein the latent functionality does not react at the first temperature, and wherein the latent functionality reacts in response to a stimulus comprising at least one of ultraviolet (UV) light and a second temperature greater than the first temperature.2. The composition as recited in claim 1 , wherein the one or more filler materials includes at least one of silica fibers and silica particles surface modified to contain the latent functionality claim 1 , and ...

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Номер записи: 39
28-01-2021 дата публикации

BASE METAL ELECTRODES FOR METAL OXIDE VARISTOR

Номер: US20210027921A1
Автор: CHEN Guoliang, LEI Ming, Liu Shuying, SUI Youqun
Принадлежит: Dongguan Littelfuse Electronics Company Limited

A MOV device including a MOV chip, a first base metal electrode disposed on a first side of the MOV chip, and a second base metal electrode disposed on a second side of the MOV chip opposite the first side, each of the first base metal electrode and the second base metal electrode including a first base metal electrode layer disposed on a surface of the MOV chip and formed of one of silver, copper, and aluminum, the first base metal electrode layer having a thickness in a range of 2-200 micrometers, and a second base metal electrode layer disposed on a surface of the first base metal electrode layer and formed of one of silver, copper, and aluminum, the second base metal electrode layer having a thickness in a range of 2-200 micrometers. 1. A metal oxide varistor (MOV) device comprising:a MOV chip;a first base metal electrode disposed on a first side of the MOV chip; anda second base metal electrode disposed on a second side of the MOV chip opposite the first side; a first base metal electrode layer disposed on a surface of the MOV chip and formed of one of silver, copper, and aluminum, the first base metal electrode layer having a thickness in a range of 2-200 micrometers; and', 'a second base metal electrode layer disposed on a surface of the first base metal electrode layer and formed of one of silver, copper, and aluminum, the second base metal electrode layer having a thickness in a range of 2-200 micrometers;, 'each of the first base metal electrode and the second base metal electrode comprisingwherein each of the first base metal electrode layers are formed of aluminum, have a thickness in a range of 20-200 micrometers, and have a surface area in a range of 60-90% of respective surface areas of the surfaces of the MOV chip on which the first base metal electrode layers are disposed, and wherein each of the second base metal electrode layers are formed of silver, have a thickness in a range of 2-10 micrometers, and have a surface area that is less than 60% of ...

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Номер записи: 40
04-02-2021 дата публикации

HEATING ELEMENT FOR A COOKING APPLIANCE

Номер: US20210030205A1
Автор: Bergel Noah, Ellena Joseph D., Feldman Benjamin F., Hull David, Lollar Pat, Musman Thomas, Reyes Aurelio, Simmers Richard
Принадлежит: Revolution Cooking, LLC

A heating element for a cooking appliance includes terminals that act as electrically conductive contact points. One or more buses are arranged between the terminals, and connect one or more heating element segments in a zig-zag configuration. The heating element segments are connected in series and are arranged parallel with one another. Each heating element segment includes a plurality of cutouts linked together and having an elliptical shape. The terminals, heating element segments, and buses are a continuous single sheet of conductive material. A method of making the heating element includes forming a pattern into the sheet of conductive material by etching the pattern into the conductive sheet using photolithography. 120-. (canceled)21. A heating element for a cooking appliance , the heating element comprising:a plurality of heating element segments, each heating element segment extending between first and second terminal ends and defining a sheet having a plurality of cutouts and first and second opposed sides; anda reflector extending across the second sides of the plurality of heating element segments, the plurality of heating element segments being mechanically supported to the reflector by mechanical supports that allow the heating element segments to thermally expand and contract;wherein the plurality of heating element segments have their respective first sides exposed for emitting infrared radiation toward a cooking cavity of the cooking appliance.22. The heating element of claim 21 , wherein the reflector is a planar sheet.23. The heating element of claim 21 , wherein the reflector is electrically and thermally insulating.24. The heating element of claim 21 , wherein the reflector is arranged to reflect the infrared radiation emitted by the plurality of heating element segments toward the plurality of heating element segments.25. The heating element of claim 21 , wherein each heating element segment is attached to the reflector by a mechanical support ...

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Номер записи: 41
04-02-2016 дата публикации

ELECTRODE COMPONENT WITH PRETREATED LAYERS

Номер: US20160035466A1
Автор: Huang Jen-Heng, JIA Zhiwei, Xu Xun
Принадлежит: THINKING ELECTRONIC INDUSTRIAL CO., LTD.

An electrode component with pretreated layers includes a ceramic substrate, two pretreated layers formed on two opposite surfaces of the ceramic substrate, two electrode layers respectively formed on the two pretreated layers, two pins respectively connected to the electrode layers, and an insulating layer enclosing the ceramic substrate, the pretreated layers, the electrode layers, and portions of the two pins. The pretreated layer formed between the ceramic substrate and the electrode layer replaces the fabrication means for conventional silver electrode layer to provide good binding strength between the ceramic substrate and the electrode layer. Besides same electrical characteristics for original products, the electrode component can get rid of the use of precious silver in screen printed silver electrode and avoid pollution caused by evaporation and thermal dissolution of organic solvent while lowering the ohmic contact resistance between the electrode layer and the ceramic substrate. 1. An electrode component with preheated layers , comprising:a ceramic substrate having two opposite surfaces;two pretreated layers respectively formed on the two opposite surfaces of the ceramic substrate, each pretreated layer formed by a metal material selected from one of nickel, vanadium, chromium, aluminum, and zinc or a combination thereof;two electrode layers respectively formed on the two preheated layers;two pins, each pin having a top portion connected to one of the two electrode layers; andan insulating layer enclosing the ceramic substrate, the two electrode layers, and the top portions of the two pins.2. The electrode component as claimed in claim 1 , wherein the pretreated layers are formed by a sputtering process.3. The electrode component as claimed in claim 1 , wherein a thickness of each pretreated layer is in a range of 0.1 to 0.5 μm.4. The electrode component as claimed in claim 2 , wherein a thickness of each pretreated layer is in a range of 0.1 to 0.5 μm.5. ...

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Номер записи: 42
01-05-2014 дата публикации

Surface mountable over-current protection device

Номер: US20140118871A1
Автор: Chi Jen Su, Chun Teng Tseng, David Shau Chew Wang
Принадлежит: Polytronics Technology Corp

A surface mountable over-current protection device having upper and lower surfaces comprises a PTC device, first and second electrodes, and first and second circuits. The PTC device comprises a PTC material layer and first and second conductive layers. The PTC material layer is disposed between the conductive layers and comprises crystalline polymer and conductive filler dispersed therein. The first electrode comprises a pair of first metal foils, whereas the second electrode comprises a pair of second metal foils. The first circuit connects the first electrode and conductive layer, and has a first planar line extending horizontally. The second circuit connects the second electrode and conductive layer, and has a second planar line extending horizontally. At least one of the planar lines has a thermal resistance sufficient to mitigate heat dissipation by which the over-current protection device undergoes a test at 25° C. and 8 amperes can trip within 60 seconds.

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Номер записи: 43
31-01-2019 дата публикации

Systems And Methods For Forming A Thin Film Resistor Integrated In An Integrated Circuit Device

Номер: US20190035878A1
Автор: Fest Paul
Принадлежит: MICROCHIP TECHNOLOGY INCORPORATED

A method is provided for forming an integrated thin film resistor (TFR) in a semiconductor integrated circuit device. A first dielectric layer is deposited on an integrated circuit (IC) structure including conductive contacts, a resistive film (e.g., comprising SiCCr, SiCr, CrSiN, TaN, TaSi, or TiN) is deposited over the first dielectric layer, the resistive film is etched to define the dimensions of the resistive film, and a second dielectric layer is deposited over the resistive film, such that the resistive film is sandwiched between the first and second dielectric layers. An interconnect trench layer may be deposited over the second dielectric layer and etched, e.g., using a single mask, to define openings that expose surfaces of the IC structure contacts and the resistive film. The openings may be filled with a conductive interconnect material, e.g., copper, to contact the exposed surfaces of the conductive contacts and the resistive film. 1. A method of forming an integrated thin film resistor (TFR) in a semiconductor integrated circuit device , the method comprising:forming an integrated circuit structure including at least one conductive contact;forming a first dielectric layer over the integrated circuit structure;forming a resistive film over the first dielectric layer;forming a second dielectric layer over the resistive film, such that the resistive film is arranged between the first and second dielectric layers;forming an interconnect trench layer over the second dielectric layer;performing at least one etch process to define openings that expose both (a) at least one surface of the at least one conductive contact and (b) at least one surface of the resistive film; andat least partially filling the openings with a conductive interconnect material to contact the exposed surfaces of the at least one conductive contact and the resistive film.2. The method of claim 1 , wherein the integrated circuit structure includes a memory cell or transistor structure ...

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Номер записи: 44
11-02-2016 дата публикации

Electrical Device

Номер: US20160042845A1
Автор: Diane G. Bigler, Jaydip Das, Kavitha Bharadwaj, Mario G. Sepulveda, Mark F. Wartenberg, Nicola Pugliano, Richard B. Lloyd, Ting Gao
Принадлежит: Tyco Electronics Corp

An electrical device having first and second electrodes and a layer of a conductive composite electrically in contact with the first and second electrodes. The conductive composite is a mixture of a semi-crystalline polymer and a conductive filler, the conductive filler including a plurality of particles containing an inner material including a first metal; and an outer material surrounding the inner material, the outer material including a second metal; and an intermetallic compound formed between the inner material and the outer material. The intermetallic compound has features from the inner material and the outer material. The device can be a circuit protection device. Also provided is a method of making a conductive composite by dry mixing the components.

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Номер записи: 45
09-02-2017 дата публикации

CHIP RESISTOR AND METHOD FOR MANUFACTURING SAME

Номер: US20170040091A1
Автор: NAKAYAMA SHOGO
Принадлежит:

A chip resistor includes an insulating substrate, a resistive element provided on an upper surface of the insulating substrate, a pair of upper-surface electrodes provided on respective ones of both end portions of an upper surface of the resistive element so as to expose a part of the upper surface of the resistive element from the upper-surface electrodes, and a protective layer that covers the part of the resistive element and that does not cover the pair of upper-surface electrodes. The pair of upper-surface electrodes have exposed upper surfaces and exposed edge surfaces, respectively. Each of the edge surfaces of the pair of upper-surface electrodes does not project outward from respective one of the edge surfaces of the insulating substrate. The chip resistor can reduce a temperature coefficient of resistance to improve the temperature coefficient of resistance. 1. A chip resistor comprising:an insulating substrate having an upper surface and edge surfaces;a resistive element provided on the upper surface of the insulating substrate;a pair of upper-surface electrodes provided on respective ones of both end portions of the upper surface of the resistive element so as to expose a part of an upper surface of the resistive element from the upper-surface electrodes; anda protective layer that covers the part of the resistive element and that does not cover the pair of upper-surface electrodes,wherein the pair of upper-surface electrodes have exposed upper surfaces and exposed edge surfaces, respectively, andwherein each of the edge surfaces of the pair of upper-surface electrodes does not project outward from respective one of the edge surfaces of the insulating substrate.2. The chip resistor according to claim 1 , further comprising a pair of plating layers provided on the upper surfaces and the edge surfaces of the pair of upper-surface electrodes.3. A method of manufacturing a chip resistor claim 1 , comprising: an insulating substrate,', 'a resistive element ...

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Номер записи: 46
08-02-2018 дата публикации

ELECTRICAL FUSE AND/OR RESISTOR STRUCTURES

Номер: US20180040557A1
Автор: Basker Veeraraghavan S., Cheng Kangguo, Khakifirooz Ali, Li Juntao
Принадлежит:

Electrical fuse (eFuse) and resistor structures and methods of manufacture are provided. The method includes forming metal gates having a capping material on a top surface thereof. The method further includes protecting the metal gates and the capping material during an etching process which forms a recess in a dielectric material. The method further includes forming an insulator material and metal material within the recess. The method further includes forming a contact in direct electrical contact with the metal material. 1. A method comprising:forming metal gates having a capping material on a top surface thereof;protecting the metal gates and the capping material during an etching process which forms a recess in a dielectric material;forming an insulator material and metal material within the recess;forming contact structures in the dielectric material between the metal gates, wherein the recess is formed between the contact structures and first filled with the metal material followed by the insulator material; andforming a contact in direct electrical contact with the metal material.2. The method of claim 1 , wherein the recess is formed as an opening in the dielectric material above the contact structures.3. The method of claim 1 , further comprising removing excess insulator material formed on the metal material outside the recess.4. The method of claim 1 , further comprising forming a pattern on the insulator material prior to forming the contact.5. A method comprising:forming metal gate structures in a dielectric material;forming a capping material over the metal gate structures;forming a mask over the capping material of the metal gate structures;recessing the dielectric material between the metal gate structures by an etching process while the mask over the capping material protects the capping material and the metal gate structures;depositing insulator material and metal material within the recess in the dielectric material;forming contact structures in ...

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Номер записи: 47
18-02-2021 дата публикации

ELECTRONIC VAPING DEVICE

Номер: US20210046257A1
Автор: Jordan Geoffrey Brandon, Mullins Michael J., Rostami Ali A., Smith Barry S., Tucker Christopher S.
Принадлежит: Altria Client Services LLC

In one embodiment, the electronic vaping device includes a cartridge and a battery section. The cartridge and the battery section are connectable so as to define an air inlet between a portion of the cartridge and a portion of the battery section. 1. (canceled)2. A cartridge comprising:an outer housing extending in a longitudinal direction;a reservoir configured to contain a pre-vapor formulation in the outer housing; and two non-diverging outlets spaced from a center point of the mouthpiece, and', 'a projection extending longitudinally from an inner surface of an end wall of the mouthpiece, the projection extending from the center point of the mouthpiece, the projection between the two non-diverging outlets, such that an interior surface of the mouthpiece is symmetrical about a longitudinal axis of the mouthpiece, the mouthpiece and the projection being a single-piece., 'a mouthpiece at a first end of the outer housing, the mouthpiece including,'}3. The cartridge of claim 2 , further comprising:a gasket at an end of the reservoir; anda chamber between the gasket and the mouthpiece.4. The cartridge of claim 2 , further comprising:a vaporizer in the outer housing.5. The cartridge of claim 4 , wherein the vaporizer comprises:a wick in fluid communication with the reservoir; anda heater in contact with at least a portion of the wick.6. The cartridge of claim 5 , wherein the heater comprises a heating coil.7. The cartridge of claim 2 , further comprising:an inner tube in the outer housing.8. The cartridge of claim 7 , wherein the inner tube defines an air channel having a central outlet that is centrally located within the outer housing.9. The cartridge of claim 8 , wherein the two non-diverging outlets of the mouthpiece are respectively laterally offset from the central outlet of the air channel.10. The cartridge of claim 8 , further comprising:an air inlet in fluid communication with the two non-diverging outlets of the mouthpiece via the central outlet of the air ...

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Номер записи: 48
24-02-2022 дата публикации

TEMPERATURE COMPENSATION FOR SILICON RESISTOR USING INTERCONNECT METAL

Номер: US20220057818A1
Автор: Gonzalez Octavio A., Seaberg Charles Eric
Принадлежит:

An integrated circuit that can include a driver having a first driver output, and a first resistance coupled between a first node coupled to the first driver output and a second node. The first resistance can include a process resistor including a first material having a first temperature coefficient, and an interconnect resistor configured to provide at least 20% of the first resistance and including a second material having a second temperature coefficient which changes resistance in an opposite direction with temperature as compared to the first temperature coefficient. A first terminal of the interconnect resistor is directly connected to a first terminal of the process resistor. 1. An integrated circuit , comprising:a driver having a first driver output and a second driver output;{'claim-text': ['a process resistor including a first material having a first temperature coefficient, and', 'an interconnect resistor configured to provide at least 20% of the first resistance and including a second material having a second temperature coefficient which changes resistance in an opposite direction with temperature as compared to the first temperature coefficient, wherein a first terminal of the interconnect resistor is directly connected to a first terminal of the process resistor; and'], '#text': 'a first resistance coupled between a first node coupled to the first driver output and a second node, wherein the first resistance includes:'}{'claim-text': ['a second process resistor including the first material, and', 'a second interconnect resistor including the second material and configured to provide at least 20% of the second resistance, wherein a first terminal of the second interconnect resistor is directly connected to a first terminal of the second process resistor.'], '#text': 'a second resistance coupled between the second node and a third node coupled to the second driver output, wherein the second resistance includes:'}2. The integrated circuit of claim 1 , ...

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Номер записи: 49
24-02-2022 дата публикации

THERMISTOR CHIP AND PREPARATION METHOD THEREOF

Номер: US20220059260A1
Автор: BAI Qixing, BAI Xiaohai, DUAN Zhaoxiang, TANG Limin, YANG Jun, YANG Mengtian
Принадлежит:

A thermistor chip is provided, which includes a thermosensitive ceramic substrate, a surface electrode and a bottom electrode. The surface electrode and the bottom electrode are respectively arranged on the two surfaces of the thermosensitive ceramic substrate. The surface electrode is a silver layer. The bottom electrode consists of a silver layer, a titanium-tungsten alloy layer, a copper layer and a gold layer, laminating on the thermosensitive ceramic substrate in turn from inside to outside. A preparation method thereof is also provided. The thermistor chip can meet the requirements of both solder paste reflow soldering and wire bonding process simultaneously, and has the advantages of good bonding effect and high temperature resistance, high reliability and high stability. 1. A thermistor chip , comprising a thermosensitive ceramic substrate , a surface electrode and a bottom electrode , and the surface electrode and the bottom electrode are arranged on the two surfaces of the thermosensitive ceramic substrate respectively , wherein the surface electrode is a silver layer; the bottom electrode consists of a silver layer , a titanium-tungsten alloy layer , a copper layer and a gold layer , laminating on the thermosensitive ceramic substrate in turn from inside to outside.2. The thermistor chip of claim 1 , wherein a thickness of the silver layer of the bottom electrode is 4˜7 microns claim 1 , a thickness of the titanium-tungsten alloy layer is 0.1˜0.15 microns claim 1 , a thickness of the copper layer is 0.1˜0.2 microns claim 1 , and a thickness of the gold layer is 0.25˜0.55 microns.3. The thermistor chip of claim 1 , wherein a mass ratio of titanium to tungsten of the titanium-tungsten alloy layer of the bottom electrode is 1:9.4. The thermistor chip of claim 1 , wherein a thickness of the silver layer of the surface electrode is 4˜7 microns.5. The thermistor chip of claim 1 , wherein the silver layers of the surface electrode and the bottom electrode are ...

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Номер записи: 50
16-02-2017 дата публикации

CHIP RESISTOR AND ELECTRONIC DEVICE

Номер: US20170048983A1
Автор: YONEDA Masaki
Принадлежит:

[Object] To provide a chip resistor with which laser irradiation requires no extremely high positional accuracy, and a plating layer provided on a base and adjacent to a resistor element can be connected to an external conductive layer. [Solution] A chip resistor includes a base , a first principal surface electrode , a second principal surface electrode spaced apart from the first principal surface electrode in a first direction X, a resistor element in contact with the first principal surface electrode and the second principal surface electrode , an overcoat covering the resistor element , the first principal surface electrode and the second principal surface electrode, a first auxiliary electrode covering the first principal surface electrode and the overcoat , and a first plating electrode covering the first auxiliary electrode . The first auxiliary electrode includes a portion offset from the first principal surface electrode in the first direction X 122-. (canceled)23. A chip resistor comprising:a base including a principal surface;a first principal surface electrode formed on the principal surface;a second principal surface electrode formed on the principal surface and spaced apart from the first principal surface electrode in a first direction;a resistor element formed on the principal surface and held in contact with the first principal surface electrode and the second principal surface electrode;an overcoat covering the resistor element, the first principal surface electrode and the second principal surface electrode;a first auxiliary electrode covering the first principal surface electrode and the overcoat; anda first plating electrode covering the first auxiliary electrode,wherein the first auxiliary electrode includes a portion offset from the first principal surface electrode in the first direction,the first auxiliary electrode has an auxiliary electrode end face that faces in the first direction, and an auxiliary electrode obverse surface spaced apart ...

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Номер записи: 51
13-02-2020 дата публикации

HIGHLY SENSITIVE REDUCED GRAPHENE OXIDE-NICKEL COMPOSITE BASED CRYOGENIC TEMPERATURE SENSOR

Номер: US20200049573A1
Автор: DINESH Narasimhiah Subrahmanyam, JAIN Pavithra B., KEDAMBAIMOOLE Vaishakh, KONANDUR Rajanna, MANASA , NAYAK M M., NEELLA Nagarjuna
Принадлежит:

The present disclosure generally relates to the field of resistive sensing. In particular, the present disclosure relates to a highly sensitive reduced graphene oxide-nickel (RGO—Ni) composite based fast response temperature sensor. Aspects of the present disclosure provide a method for fabrication of a highly sensitive reduced graphene oxide-nickel (RGO—Ni) composite-based temperature sensor. An aspect of the present disclosure provides a temperature sensor comprising: a substrate; and a composite film deposited onto said substrate, wherein the composite film comprises a reduced graphene oxide-nickel composite film. In an embodiment, the temperature sensor is cryo-compatible. 1. A highly sensitive fast response cryogenic temperature sensor comprising: a substrate; and a composite film deposited onto said substrate , wherein the composite film is further connected with a plurality of leads , characterized in that the composite film comprises a reduced graphene oxide-nickel composite.2. The temperature sensor as claimed in claim 1 , wherein the substrate is ceramic AlO.3. The temperature sensor as claimed in claim 1 , wherein the reduced graphene oxide-nickel composite film is screen printed onto said substrate.4. The composite film as claimed in wherein the plurality of leads is made of Indium.5. The composite film as claimed in wherein the composite film is connected with said plurality of leads using a conductive silver epoxy resin.6. The composite film as claimed in wherein connection between said composite film and said plurality of leads is further strengthened using a thermal epoxy resin.7. The temperature sensor as claimed in claim 1 , wherein the reduced graphene oxide-nickel composite film has a thickness ranging from 5 μm to 200 μm claim 1 , preferably of about 50 μm; width ranging from 0.05 mm to 2.5 mm claim 1 , preferably of about 1 mm; and length ranging from 0.1 mm to 10 mm claim 1 , preferably of about 4 mm.8. The temperature sensor as claimed in ...

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Номер записи: 52
13-02-2020 дата публикации

CHIP RESISTOR AND METHOD FOR PRODUCING SAME

Номер: US20200051716A1
Автор: KINOSHITA YASUHARU, TAMURA Takaaki
Принадлежит:

An object of the present disclosure is to provide a chip resistor capable of suppressing degradation of long-term reliability, and a method for producing the chip resistor. The chip resistor of the present disclosure includes resistance member () formed of metal, and a pair of electrodes () respectively formed on both ends of first main surface () of resistance member (). The chip resistor further includes first protective film () formed on second main surface () located on a rear side of first main surface () of resistance member (), second protective film () formed on first main surface () of resistance member () and between the pair of electrodes (), and a third protective film formed on a side surface parallel to a direction of a current flowing between the pair of electrodes () of resistance member (). The side surface of resistance member () is provided with a protrusion that protrudes outward when viewed along the current flowing direction. 1. A chip resistor comprising:a resistance member;a pair of electrodes;a first protective film;a second protective film; anda third protective film, a first main surface,', 'a second main surface located on a side opposite to the first main surface, and', 'a protrusion that protrudes outward from a plane connecting an edge of the first main surface and an edge of the second main surface,, 'wherein the resistance member includes'}the pair of electrodes are respectively disposed on both ends of the first main surface of the resistance member, and a direction connecting respective ones of the pair of electrodes is a direction along the edge of the first main surface and the edge of the second main surface,the first protective film is disposed on the second main surface of the resistance member,the second protective film is disposed on the first main surface of the resistance member and between the pair of electrodes, andthe third protective film is disposed on the protrusion of the resistance member.2. A chip resistor ...

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Номер записи: 53
01-03-2018 дата публикации

ADHESIVE POSITIVE TEMPERATURE COEFFICIENT MATERIAL

Номер: US20180061534A1
Автор: Chen Jianhua, Tsang Chun-Kwan
Принадлежит: LITTELFUSE, INC.

Positive temperature coefficient (PTC) devices and methods to manufacture PTC devices are disclosed. A PTC device or apparatus may include a grafted polymer. Furthermore, the PTC device may include a conductive filler included in the polymer material. The PTC device may include at least one conductive layer dispose over a surface of the PTC device. 1. An apparatus , comprising:a polymer material including a grafted polymer; anda conductive filler included in the polymer material.2. The apparatus according to claim 1 , wherein the conductive filler includes one or more of: metal claim 1 , metal ceramic claim 1 , tungsten carbide claim 1 , nickel claim 1 , carbon claim 1 , and titanium carbide.3. The apparatus according to claim 1 , wherein the polymer material includes at least polyvinylidene difluoride claim 1 , polyethylene claim 1 , ethylene tetrafluoroethylene claim 1 , ethylene-vinyl acetate claim 1 , or ethylene butyl acrylate.4. The apparatus according to claim 1 , wherein the polymer material includes at least a semi-crystalline polymer.5. The apparatus according to claim 1 , wherein the grafted polymer includes at least maleic anhydride grafted to polymer claim 1 , the polymer including at least vinylidene fluoride.6. The apparatus according to claim 1 , wherein the grafted polymer includes at least maleic anhydride grafted to polymer claim 1 , the polymer including at least ethylene vinyl acetate.7. The apparatus according to claim 1 , wherein the grafted polymer includes at least acrylic acid grafted to polymer.8. The apparatus according to claim 1 , wherein the grafted polymer includes at least amine grafted to polymer.9. The apparatus according to claim 1 , comprising a conductive layer disposed on a surface of the polymer material.10. The apparatus according to claim 9 , wherein the conductive layer is a metal foil.11. The apparatus according to claim 10 , wherein the metal foil is a nickel foil claim 10 , aluminum foil claim 10 , or a copper foil.12. A ...

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Номер записи: 54
01-03-2018 дата публикации

CHIP RESISTOR

Номер: US20180061536A1
Автор: TACHIBANA YUSUKE
Принадлежит:

The present invention relates to a chip resistor. A method of manufacturing a chip resistor comprising steps of: preparing an insulating substrate squarely segmented with vertical slits and horizontal slits, applying on the insulating substrate a conductive paste crossing over the horizontal slits, applying a resistor paste on the insulating substrate, forming trimming grooves to adjust resistivity of the resistor layers, and splitting the insulating substrate to form chip resistors, wherein the conductive paste comprises (i) a conductive powder comprising an agglomerated metal powder, wherein particle diameter (D50) of the agglomerated metal powder is 3 to 12 μm and specific surface area (SA) of the agglomerated metal powder is 3.1 to 8.0 m/g, (ii) a glass frit and (iii) an organic vehicle. 1. A method of manufacturing a chip resistor comprising steps of:preparing an insulating substrate squarely segmented with vertical slits and horizontal slits;applying on the insulating substrate a conductive paste in a square pattern crossing over the horizontal slits;firing the conductive paste to form front electrodes;applying a resistor paste on the insulating substrate to bridge the front electrodes;firing the resistor paste to form resistor layers;forming trimming grooves on the resistor layers to adjust resistivity of the resistor layers; andsplitting the insulating substrate at the vertical slits and the horizontal slits to form chip resistors;{'sup': '2', 'wherein the conductive paste comprises (i) a conductive powder comprising an agglomerated metal powder, wherein particle diameter (D50) of the agglomerated metal powder is 3 to 12 μm and specific surface area (SA) of the agglomerated metal powder is 3.1 to 8.0 m/g, (ii) a glass frit and (iii) an organic vehicle.'}2. The method of claim 1 , wherein the insulating substrate is a ceramic substrate.3. The method of claim 1 , wherein the thickness of the insulating substrate is 0.1 to 2 mm.4. The method of claim 1 , ...

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Номер записи: 55
29-05-2014 дата публикации

Thin films having large temperature coefficient of resistance and methods of fabricating same

Номер: US20140146856A1
Автор: Declan Macken, Eric Walter Singleton, Huaqing Yin, Venkateswara Rao Inturi, WEI Tian
Принадлежит: SEAGATE TECHNOLOGY LLC

An apparatus comprises a head transducer and a resistive temperature sensor provided on the head transducer. The resistive temperature sensor comprises a first layer comprising a conductive material and having a temperature coefficient of resistance (TCR) and a second layer comprising at least one of a specular layer and a seed layer. A method is disclosed to fabricate such sensor with a laminated thin film structure to achieve a large TCR. The thicknesses of various layers in the laminated thin film are in the range of few to a few tens of nanometers. The combinations of the deliberately optimized multilayer thin film structures and the fabrication of such films at the elevated temperatures are disclosed to obtain the large TCR.

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Номер записи: 56
28-02-2019 дата публикации

High-precision additive formation of electrical resistors

Номер: US20190066889A1
Автор: Moosheimer Ulrich
Принадлежит:

Shown herein is a method of forming an electrical resistor comprising the steps of: forming an electrically resistive layer on a substrate; measuring an electrical resistance-related parameter of the electrically resistive layer and determining a target length of the electrically resistive layer corresponding to a target electrical resistance; and forming first and second electrically conductive terminals contacting the electrically resistive layer, said first and second electrically conductive terminals being separated by a distance corresponding to the target length. 1. A method of forming an electrical resistor having a target electrical resistance by additive manufacturing comprising the steps of:forming an electrically resistive layer on a substrate;measuring an electrical resistance-related parameter of the electrically resistive layer and determining from the electrical resistance-related parameter a target length of the electrically resistive layer corresponding to the target electrical resistance; andforming a first electrically conductive terminal and a second electrically conductive terminal contacting the electrically resistive layer, said first and second electrically conductive terminals being separated by a distance corresponding to the target length, such that an electrical resistance of a portion of the electrically resistive layer extending between the first electrically conductive terminal and the second electrically conductive terminal corresponds to the target electrical resistance.215.-. (canceled)16. A method of forming an electrical resistor having a target electrical resistance by additive manufacturing comprising the steps of:forming an electrically resistive layer on a substrate;measuring an electrical resistance-related parameter of the electrically resistive layer and determining from the electrical resistance-related parameter a target length of the electrically resistive layer corresponding to the target electrical resistance;forming ...

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Номер записи: 57
08-03-2018 дата публикации

ELECTRICAL FUSE AND/OR RESISTOR STRUCTURES

Номер: US20180068948A1
Автор: Basker Veeraraghavan S., Cheng Kangguo, Khakifirooz Ali, Li Juntao
Принадлежит:

Electrical fuse (eFuse) and resistor structures and methods of manufacture are provided. The method includes forming metal gates having a capping material on a top surface thereof. The method further includes protecting the metal gates and the capping material during an etching process which forms a recess in a dielectric material. The method further includes forming an insulator material and metal material within the recess. The method further includes forming a contact in direct electrical contact with the metal material. 1. A method comprising:forming metal gates having a capping material on a top surface thereof;protecting the metal gates and the capping material during an etching process which forms a recess in a dielectric material;forming an insulator material and metal material within the recess;forming contact structures in the dielectric material between the metal gates, wherein the recess is formed as an opening in the dielectric material above the contact structures, and the opening is first filled with the metal material followed by the insulator; andforming a contact in direct electrical contact with the metal material.2. The method of claim 1 , wherein the recess is formed between the contact structures.3. The method of claim 1 , further comprising removing excess insulator material formed on the metal material outside the recess.4. The method of claim 1 , further comprising forming a pattern on the insulator material prior to forming the contact.5. A method comprising:forming metal gate structures in a dielectric material;forming a capping material over the metal gate structures;forming a mask over the capping material of the metal gate structures;recessing the dielectric material between the metal gate structures by an etching process while the mask over the capping material protects the capping material and the metal gate structures;depositing insulator material and metal material within the recess in the dielectric material;forming contact ...

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Номер записи: 58
27-02-2020 дата публикации

CHIP RESISTOR AND METHOD FOR MANUFACTURING SAME

Номер: US20200066429A1
Автор: IMAHASHI Wataru, SHINOURA Takanori
Принадлежит:

One aspect of the present disclosure provides a chip resistor. In the chip resistor, a top electrode is disposed on a front surface of a substrate. A resistor is disposed on the front surface and electrically connected to the top electrode. A protective layer covers the resistor. A protective electrode is electrically connected to the top electrode. A side electrode is electrically connected to the top electrode. The side electrode has a side portion disposed on the side surface, and a top portion and a bottom portion respectively overlapping the front surface and the back surface in plan view. An intermediate electrode covers the protective electrode and the side electrode. An outer electrode covers the intermediate electrode. The protective electrode is in contact with both the top electrode and the protective layer and covers a portion of the top electrode and a portion of the protective layer. 1. A chip resistor comprising:a substrate having a front surface and a back surface spaced apart from each other in a thickness direction, and a side surface between the front surface and the back surface;a top electrode disposed on the front surface;a resistor disposed on the front surface and electrically connected to the top electrode;a protective layer covering the resistor;a protective electrode electrically connected to the top electrode;a side electrode electrically connected to the top electrode, the side electrode having a side portion disposed on the side surface, and a top portion and a bottom portion respectively overlapping the front surface and the back surface in plan view;an intermediate electrode covering the protective electrode and the side electrode; andan outer electrode covering the intermediate electrode,wherein the protective electrode is in contact with both the top electrode and the protective layer and covers a portion of the top electrode and a portion of the protective layer.2. The chip resistor according to claim 1 , whereinthe protective ...

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Номер записи: 59
05-06-2014 дата публикации

CHIP RESISTOR, METHOD OF PRODUCING CHIP RESISITOR AND CHIP RESISTOR PACKAGING STRUCTURE

Номер: US20140152419A1
Автор: NAKA Kentaro
Принадлежит: ROHM CO., LTD.

[Object] 1. A chip resistor manufacturing method comprising the steps of:preparing at least three conductive elongated boards made of an electrically conductive material and a resistive member made of a resistive material;arranging said at least three conductive elongated boards apart from each other in a width direction crossing a longitudinal direction in which one of said at least three conductive elongated boards is elongated;forming a resistor aggregate by bonding the resistive member to said at least three conductive elongated boards; andcollectively dividing the resistor aggregate into a plurality of chip resistors by punching, each of the chip resistors including two electrodes and a resistor portion bonded to the two electrodes.2. The method according to claim 1 , wherein the step of forming a resistor aggregate uses welding.3. The method according to claim 2 , wherein the step of forming a resistor aggregate uses high energy beam welding.4. The method according to claim 3 , wherein the step of forming a resistor aggregate uses electron beam welding or laser beam welding as the high energy beam welding.5. The method according to claim 1 , further comprising the step of bending one of said at least three conductive elongated boards.6. The method according to claim 5 , wherein the bending step is performed at the same time as the collectively dividing step.7. The method according to claim 1 , wherein one of said at least three conductive elongated boards has a thickness smaller than a thickness of the resistive member.8. The method according to claim 1 , wherein the resistive member includes a plurality of resistive elongated boards claim 1 , andthe step of forming a resistor aggregate comprises bonding each of the resistive elongated boards to two of said at least three conductive elongated boards.9. The method according to claim 8 , wherein the step of forming a resistor aggregate comprises arranging each of the resistive elongated boards between adjacent ...

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Номер записи: 60
17-03-2016 дата публикации

Electrical component with random electrical characteristic

Номер: US20160078999A1
Автор: Lucian Shifren, Mudit Bhargava, Vikas Chandra
Принадлежит: ARM LTD

An electrical component is formed with a directed self assembly portion having a random electrical characteristic, such as resistance or capacitance. The random pattern can be produced by using a directed self assembly polymer with guide structures 2 including randomness inducing features. The electrical components with the random electrical characteristics may be used in electrical circuits relying upon random variation in electrical characteristics, such as physically unclonable function circuitry. The electrical components may be resistors and/or capacitors.

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Номер записи: 61
15-03-2018 дата публикации

Chip Resistor and Method for Manufacturing Same

Номер: US20180075954A1
Автор: Matsumoto Kentaro
Принадлежит:

Provided is a chip resistor having wide and flat end-face electrodes on a surface thereof and having increased connection reliability between upper electrodes and the end-face electrodes. The chip resistor according to the present invention is provided with: a cuboidal insulating substrate ; a pair of upper electrodes disposed at both ends in a longitudinal direction on a surface of the insulating substrate ; a resistor body disposed between the upper electrodes ; an insulating protective layer covering the entire surfaces of the upper electrodes and the resistor body ; and a pair of end-face electrodes disposed on both end faces in the longitudinal direction of the insulating substrate , wherein the upper electrodes include bent portions extending around from between the insulating substrate and the protective layer along the end faces of the protective layer , and the end-face electrodes are connected to the exposed portions of the upper electrodes , including the bent portions , exposed from between the insulating substrate and the protective layer 1. A chip resistor comprising: an insulating substrate that is shaped like a cuboid;a pair of front electrodes that are provided on lengthwise opposite edge portions of a front surface of the insulating substrate;a resistor body that is disposed between the two front electrodes and connected to the two front electrodes;a protection layer that covers entire surfaces of the resistor body and the two front electrodes; and 'the front electrodes have bent portions that extend around from between the insulating substrate and the protection layer along end surfaces of the protection layer; and the end-surface electrodes are connected to exposed portions of the front electrodes including the bent portions, that are exposed from between the insulating substrate and the protection layer.', 'a pair of end-surface electrodes that are provided on lengthwise opposite end surfaces of the insulating substrate to be electrically ...

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Номер записи: 62
16-03-2017 дата публикации

CHIP COMPONENT AND METHOD OF PRODUCING THE SAME

Номер: US20170076842A1
Автор: KONDO YASUHIRO, TAMAGAWA Hiroshi, Yamamoto Hiroki
Принадлежит: ROHM CO., LTD.

A chip resistor includes a substrate, and a plurality of resistor elements each having a resistive film provided on the substrate and an interconnection film provided on the resistive film in contact with the resistive film. An electrode is provided on the substrate. Fuses disconnectably connect the resistor elements to the electrode. The resistive film is made of at least one material selected from the group of NiCr, NiCrAl, NiCrSi, NiCrSiAl, TaN, TaSiO, TiN, TiNO and TiSiON. 1. A chip resistor , comprising:a substrate;a plurality of resistor elements each having a resistive film provided on the substrate and an interconnection film provided on the resistive film in contact with the resistive film;an electrode provided on the substrate; anda plurality of fuses disconnectably connecting the resistor elements to the electrode, wherein{'sub': '2', 'the resistive film is made of at least one material selected from the group consisting of NiCr, NiCrAl, NiCrSi, NiCrSiAl, TaN, TaSiO, TiN, TiNO and TiSiON.'}2. The chip resistor according to claim 1 , wherein the resistive film has a temperature coefficient of less than 1000 ppm/° C.3. The chip resistor according to claim 2 , wherein the temperature coefficient of the resistive film is 50 ppm/° C. to 200 ppm/° C.4. The chip resistor according to claim 1 , wherein the resistive film has a thickness of 300 Å to 1 μm.5. The chip resistor according to claim 1 , wherein the resistor elements each include a linear element having a line width of 1 μm to 1.5 μm.6. The chip resistor according to claim 5 , whereinthe resistor elements each include conductive film pieces provided on the resistive film and spaced a predetermined distance from each other in a linear element extending direction,a portion of the resistive film not provided with the conductive film pieces spaced the predetermined distance from each other functions as a single unit resistor body.7. The chip resistor according to claim 1 , wherein the conductive film pieces ...

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Номер записи: 63
05-03-2020 дата публикации

Metal plate resistor and method for manufacturing same

Номер: US20200075200A1
Автор: Yasuharu Kinoshita
Принадлежит: Panasonic Intellectual Property Management Co Ltd

An object of the present disclosure is to provide a metal plate resistor that is capable of reducing a resistance value and a TCR. A metal plate resistor according to the present disclosure includes: a resistor body that includes a metal plate having an upper surface and a lower surface that are spaced apart from each other in a thickness direction; a pair of electrodes that include a metal having a low electrical resistivity and a high TCR in comparison with this resistor body, the pair of electrodes being formed in both ends of the lower surface of the resistor body; and an internal electrode that is formed on the upper surface of the resistor body. The internal electrode includes a metal having a low electrical resistivity in comparison with the resistor body.

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Номер записи: 64
23-03-2017 дата публикации

Chip Resistor and Method for Manufacturing Same

Номер: US20170084364A1
Автор: Matsumoto Kentaro
Принадлежит:

Provided are: a chip resistor whose resistance value can be adjusted with high accuracy while maintaining high sulfurization resistance of electrodes of the chip resistor even in the case where the resistance value of the chip resistor is low; and a method for manufacturing this chip resistor. This chip resistor () includes: an insulating film that covers a resistor substance () formed so as to make contact with both of a pair of electrodes () formed on an upper surface (A) of an insulating substrate (). Each of the pair of electrodes () includes: (1) a main electrode layer (B) that contains silver as a main metal component and 10 weight % or more of palladium as another metal component, and an auxiliary electrode layer (A) that is lower in specific resistance than the main electrode layer (B); (2) a laminate part where the auxiliary electrode layer (A) and the main electrode layer (B) are sequentially laminated in this order on a single surface of the insulating substrate (); and (3) an exposed part (A) of the auxiliary electrode layer (A) where a part of the auxiliary electrode layer (A) is not covered with the main electrode layer (B) on a far side from the resistor substance (), and parts (B) that extend from a near side to the far side with respect to the resistor substance (). 2. A chip resistor according to claim 1 , wherein:the auxiliary electrode layer contains 95 weight % or more of silver as a metal component.3. A method for manufacturing a chip resistor claim 1 , the chip resistor including:an insulating substrate;a pair of electrodes that are formed on a single surface of the insulating substrate;a resistor substance that is formed on the single surface of the insulating substrate to make contact with both of the pair of electrodes; andan insulating film that covers the resistor substance and partially covers the pair of electrodes; wherein:each of the pair of electrodes has a main electrode layer and an auxiliary electrode layer, the main electrode ...

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Номер записи: 65
02-04-2015 дата публикации

Vertical Shunt Resistor

Номер: US20150091551A1
Автор: Peter Kanschat, Thilo Stolze
Принадлежит: INFINEON TECHNOLOGIES AG

A measurement resistor for current measurement is described. According to one exemplary embodiment, the measurement resistor includes a first and a second metal layer, an electrically insulating interlayer and a resistive layer. The first metal layer is arranged in a first plane. The second metal layer is arranged in a second plane that is essentially parallel to the first plane and separated from the first plane. The electrically insulating interlayer is arranged between the first and second metal layers and mechanically connects the first and second metal layers to one another. The resistive layer electrically connects the first and second metal layers to one another.

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Номер записи: 66
29-03-2018 дата публикации

Tensioning device for a surge arrester, production method and surge arrester

Номер: US20180090246A1
Автор: Bernd Kruska, Dirk Springborn, Kai Steinfeld
Принадлежит: SIEMENS AG

A tensioning device is provided for a surge arrester having an end fitting and tensioner. The tensioning device has an axial clearance for receiving a tensioner and a region being conically tapered in axial direction to be introduced into a clearance of the end fitting being shaped for a substantially exact fit. The conically tapered region has delimitation walls defining the axial clearance for the tensioner being movable toward a clearance interior. An antifriction layer is applied to the surface of the conically tapered region. A production method for a surge arrester and a corresponding surge arrester are also provided.

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Номер записи: 67
29-03-2018 дата публикации

Chip Resistor

Номер: US20180090247A1
Автор: KASHIWAGI Kotaro, Matsumoto Kentaro
Принадлежит:

In order to provide a chip resistor which has wide and flat terminal electrodes in its front surface and which has high connection reliability between front electrodes and the terminal electrodes, a chip resistor according to the present invention includes: an insulating substrate shaped like a cuboid; a pair of front electrodes provided on lengthwise opposite edge portions of a front surface of the insulating substrate ; a resistor body provided between the front electrodes ; an insulating protection layer covering entire surfaces of the front electrodes and the resistor body ; and a pair of terminal electrodes provided on lengthwise opposite end surfaces of the insulating substrate . The chip resistor is configured such that the front electrodes sandwiched between the insulating substrate and the protection layer are exposed from widthwise end surfaces and the lengthwise end surfaces of the insulating substrate , and the terminal electrodes wrap around the widthwise opposite end surfaces of the insulating substrate to be thereby connected to the exposed portions of the front electrodes 1. A chip resistor comprising: an insulating substrate that is shaped like a cuboid; a pair of front electrodes that are provided on lengthwise opposite edge portions of a front surface of the insulating substrate; a resistor body that is provided between the two front electrodes; an insulating protection layer that covers entire surfaces of the resistor body and the two front electrodes; and a pair of terminal electrodes that are provided on lengthwise opposite end surfaces of the insulating substrate; wherein: the front electrodes are exposed from widthwise end surfaces and the lengthwise end surfaces of the insulating substrate , and the terminal electrodes wrap around the widthwise opposite end surfaces of the insulating substrate to be thereby connected to the exposed portions of the front electrodes.2. A chip resistor according to claim 1 , wherein: thick film portions in ...

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Номер записи: 68
30-03-2017 дата публикации

Electronic Component and Method for the Production Thereof

Номер: US20170092394A1
Автор: Rinner Franz, Wang Yongli
Принадлежит:

An electronic component and a method for producing an electrical component are disclosed. In an embodiment, the electronic component includes a functional body having a first surface and a second surface, wherein the second surface faces away from the first surface, and a contact electrically linked to the first surface, the contact having an edge region and a central region, wherein the functional body has a first electrical resistance between the first surface and the second surface in a first functional body portion, which overlaps the edge region of the contact as viewed in a plan view of the electronic component, that is greater than a second electrical resistance between the first surface and the second surface in a second functional body portion, which overlaps the central region of the contact as viewed in a plan view of the electronic component. 117-. (canceled)18. An electronic component comprising:a functional body comprising a first surface and a second surface, wherein the second surface faces away from the first surface; anda first contact electrically linked to the first surface, the first contact having an edge region and a central region,wherein the functional body has a first electrical resistance between the first surface and the second surface in a first functional body portion, which overlaps the edge region of the first contact as viewed in a plan view of the electronic component, that is greater than a second electrical resistance between the first surface and the second surface in a second functional body portion, which overlaps the central region of the first contact as viewed in the plan view of the electronic component.19. The electronic component according to claim 18 , wherein the first functional body portion extends at least partly circumferentially around the second functional body portion as viewed in the plan view of the electronic component.20. The electronic component according to claim 18 , wherein a surface area of the second ...

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Номер записи: 69
30-03-2017 дата публикации

POSITIVE TEMPERATURE COEFFICIENT CIRCUIT PROTECTION CHIP DEVICE

Номер: US20170092395A1
Автор: CHEN Jack Jih-Sang, JIANG Chang-Hung
Принадлежит:

A method of making a PTC protection chip device includes: preparing an assembly of a PTC polymer material, a spacer unit, and first and second electrode sheets of a metal-plated copper foil, the PTC polymer material and the spacer unit of the assembly being sandwiched between and cooperating with the first and second electrode sheets to form a stack; subjecting the stack to a hot pressing process, so that the first and second electrode sheets contact and are pressed against the PTC polymer material and the spacer unit and so that the PTC polymer material is bonded to and cooperates with the first and second electrode sheets to form a PTC laminate; and cutting the PTC laminate so as to form the PTC circuit protection chip device. 1. A method of making a PTC circuit protection chip device , comprising:preparing an assembly of a PTC polymer material, a spacer unit, and first and second electrode sheets of a metal-plated copper foil, the PTC polymer material and the spacer unit of the assembly being sandwiched between and cooperating with the first and second electrode sheets to form a stack;subjecting the stack to a hot pressing process, so that the first and second electrode sheets contact and are pressed against the PTC polymer material and the spacer unit and so that the PTC polymer material is bonded to and cooperates with the first and second electrode sheets to form a PTC laminate; andcutting the PTC laminate so as to form the PTC circuit protection chip device.2. The method of claim 1 , further comprising removing the spacer unit from the PTC laminate after the hot pressing.3. The method of claim 1 , wherein the cutting of the PTC laminate includes punching the PTC laminate into a structure that includes a first single piece of the metal-plated copper foil claim 1 , a second single piece of the metal-plated copper foil claim 1 , a PTC body of the PTC polymer material claim 1 , the first single piece having a first electrode portion and a first terminal lead ...

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Номер записи: 70
26-06-2014 дата публикации

POWER RESISTOR WITH INTEGRATED HEAT SPREADER

Номер: US20140176294A1
Автор: Smith Clark, Wyatt Todd
Принадлежит:

An integrated assembly includes a resistor and a heat spreader. The resistor includes a resistive element and terminals. The heat spreader is integrated with the resistor and includes a heat sink of thermally conducting and electrically insulating material and terminations of a thermally conducting material and situated at an edge of the heat sink. At least a portion of a top surface of the resistive element is in thermally conductive contact with the heat sink. Each resistor terminal is in thermally conductive contact with a corresponding termination of the heat sink. A method of fabricating an integrated assembly of a resistor and a heat spreader includes forming the heat spreader, forming the resistor, and joining the heat spreader to the resistor by bonding at least a portion of a top surface of the resistive element to the heat sink and bonding each electrically conducting terminal to a corresponding termination. 1. An integrated assembly of a resistor and a heat spreader , comprising: a resistive element having a top surface; and', 'terminals in electrical contact with the resistive element; and, 'a resistor comprising a heat sink comprising a piece of thermally conducting and electrically insulating material; and', 'terminations comprised of a thermally conducting material and situated at an edge of the heat sink;, 'a heat spreader integrated with the resistor, the heat spreader comprisingwherein at least a portion of the top surface of the resistive element is in thermally conductive contact with the heat sink; andeach terminal is in thermally and electrically conductive contact with a corresponding one of the terminations.2. The integrated assembly of wherein at least one of the terminals is straight in all dimensions.3. The integrated assembly of wherein at least one of the terminals comprises a deposited electrically conducting material.4. The integrated assembly of claim 1 , further comprising a thermally conductive and electrically insulating adhesive ...

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Номер записи: 71
19-03-2020 дата публикации

COMPOSITE THERMISTOR CHIP AND PREPARATION METHOD THEREOF

Номер: US20200090840A1
Автор: BAI Qixing, DUAN Zhaoxiang, TANG Limin, YANG Jun, YE Jiankai
Принадлежит:

A composite thermistor chip includes a thermosensitive ceramic chip, a metal electrode and a glass glaze resistor, wherein the thermosensitive ceramic chip has a front side and a back side, the metal electrode includes a first terminal electrode, a second terminal electrode and a third electrode layer; the first terminal electrode and the second terminal electrode are respectively arranged at two ends of the front side of the thermosensitive ceramic chip, and the glass glaze resistor is arranged on the front side of the thermosensitive ceramic chip, two ends of the glass glaze resistor are respectively connected to the first terminal electrode and the second terminal electrode; and the back side of the thermosensitive ceramic chip is covered with the third electrode layer. 110-. (canceled)11. A composite thermistor chip , comprising a thermosensitive ceramic chip , a metal electrode and a glass glaze resistor; the thermosensitive ceramic chip has a front side and a back side; the metal electrode comprises a first terminal electrode , a second terminal electrode and a third electrode layer; the first terminal electrode and the second terminal electrode are respectively arranged at two ends of the front side of the thermosensitive ceramic chip; the glass glaze electrode is arranged on the front side of the thermosensitive ceramic chip , two ends of the glass glaze resistor are respectively connected to the first terminal electrode and the second terminal electrode; and the back side of the thermosensitive ceramic chip is covered with the third electrode layer.12. The composite thermistor chip of claim 11 , wherein the metal electrode is made from a precious metal.13. The composite thermistor chip of claim 11 , wherein the thermosensitive ceramic chip is made from a negative temperature coefficient thermosensitive ceramic material.14. The composite thermistor chip of claim 11 , wherein the glass glaze resistor is prepared by printing and sintering glass glaze resistor ...

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Номер записи: 72
19-03-2020 дата публикации

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

Номер: US20200090841A1
Автор: Choi Hyun Jun, Kim Hyung Gon, Kim Jung Il, LEE Jong Pil, Roh Hyung Seok, Yoo Doo Ho
Принадлежит:

An electronic component and a manufacturing method thereof are disclosed. The electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, at least one dummy conductor pattern disposed to be spaced apart from the conductor pattern portion and disposed on the substrate, and at least one dummy electrode pattern disposed on the at least one dummy conductor pattern. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern. 1. An electronic component comprising:a substrate;a conductor pattern portion disposed on the substrate and extending in a first direction;a first electrode pattern and a second electrode pattern disposed at opposite ends of the conductor pattern portion in the first direction, respectively, and disposed on the conductor pattern portion;at least one dummy conductor pattern spaced apart from the conductor pattern portion and disposed on the substrate; andat least one dummy electrode pattern spaced apart from the first electrode pattern and the second electrode pattern and disposed on the at least one dummy conductor pattern,wherein a width, in a second direction different from the first direction, of the first electrode pattern is substantially the same as a width, in the second direction different from the first direction, of a portion of the conductor pattern portion in contact with the first electrode pattern, anda width, in the second direction different from the first direction, of the second electrode pattern is substantially the same as a width, in the second direction different from the first direction, of a portion of the conductor ...

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Номер записи: 73
19-03-2020 дата публикации

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

Номер: US20200090842A1
Автор: Choi Hyun Jun, Kim Hyung Gon, Kim Jung Il, LEE Jong Pil, Roh Hyung Seok, TANAKA Ichiro, Yoo Doo Ho
Принадлежит:

An electronic component and a manufacturing method thereof are disclosed. An electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, and at least one dummy electrode pattern disposed to be spaced apart from the first electrode pattern and the second electrode pattern and disposed on the substrate. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern. 1. An electronic component comprising:a substrate;a conductor pattern portion disposed on the substrate and extending in a first direction;a first electrode pattern and a second electrode pattern disposed at opposite ends of the conductor pattern portion in the first direction, respectively, and disposed on the conductor pattern portion; andat least one dummy electrode pattern spaced apart from the first electrode pattern and the second electrode pattern and disposed on the substrate,wherein a width, in a second direction different from the first direction, of the first electrode pattern is substantially the same as a width, in the second direction, of a portion of the conductor pattern portion in contact with the first electrode pattern, anda width, in the second direction, of the second electrode pattern is substantially the same as a width, in the second direction, of a portion of the conductor pattern portion in contact with the second electrode pattern.2. The electronic component of claim 1 , wherein the at least one dummy electrode pattern includes:a first dummy electrode pattern and a second dummy electrode pattern disposed at opposite sides of the first electrode pattern in the second ...

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Номер записи: 74
16-04-2015 дата публикации

RESISTOR, PARTICULARLY A LOW-RESISTANCE CURRENT-MEASURING RESISTOR

Номер: US20150102897A1
Автор: Hetzler Ullrich
Принадлежит:

The invention relates to a resistor, in particular a low-resistance current-measuring resistor, comprising a first connection part () that consists of a conductor material for introducing an electrical current (I), a second connection part () that consists of a conductor material for discharging said electrical current (I), and a resistor element () that consists of a resistor material and is arranged between the two connection parts () in the direction of the current, also comprising a resistor coating () that consists of a metallic material for the purpose of achieving protection from corrosion, and/or improving solderability. According to the invention, the metallic coating () is applied directly to the entire free surface of the resistor element () without any insulation layer. 111-. (canceled)12. A resistor comprising:a) a first connection part comprising a conductor material for introducing an electrical current into the resistor,b) a second connection part comprising a conductor material for discharging the electrical current from the resistor,c) a resistor element comprising a resistor material, the resistor element being arranged in a direction of a current between the first connection part and the second connection part, andd) a coating of the resistor comprising a metallic material to achieve at least one of corrosion protection and improved solderability,e) wherein the metallic coating is applied without an insulation layer directly to an entire free surface of the resistor element.13. The resistor according to claim 12 , wherein the metallic coating has a layer thickness of less than 50 μm.14. The resistor according to claim 12 , wherein the metallic material of the coating has a greater specific electrical resistance than the resistor material of the resistor element.15. The resistor according to claim 12 , whereina) the metallic coating together with the resistor element forms an electrical by-pass between the first and second connection parts,b) the ...

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Номер записи: 75
05-04-2018 дата публикации

Low temperature fabrication of lateral thin film varistor

Номер: US20180096760A1
Автор: Jeffrey P. Gambino, Richard S. Graf, Sudeep Mandal
Принадлежит: International Business Machines Corp

A structure and method for fabricating a laterally configured thin film varistor surge protection device using low temperature sputtering techniques which do not damage IC device components contiguous to the varistor being fabricated. The lateral thin film varistor may include a continuous layer of alternating regions of a first metal oxide layer and a second metal oxide layer formed between two laterally spaced electrodes using a low temperature sputtering process followed by a low temperature annealing process.

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Номер записи: 76
12-05-2022 дата публикации

SYSTEMS AND RESISTORS FOR DYNAMIC BRAKING

Номер: US20220148766A1
Автор: Cooper Laura, Garcia Jaime, Hosur Mahantesh, Rao Sudeep Pradhan Sadananda, WOLFF Jeffrey John
Принадлежит:

A resistor includes an elongated cylindrical body having nodes and elongated members. The elongated members interconnect the nodes to form openings between the nodes and the elongated members for the flow therethrough of a cooling fluid. The body is configured to receive electric current from a powered system and to conduct and provide electric resistance to the electric current to dissipate at least part of the electric current as heat from the body. The body may be coupled with at least one other resistor of the powered system in one or more of a parallel or series arrangement in an electric circuit. 1. A power system comprising:a power source electrically connected to an electrical intermediary device via one or more switch devices, the electrical intermediary device configured to convey electric current generated by a vehicle on a route as the vehicle travels along the route;a resistor grid electrically connected to the electrical intermediary device via the one or more switch devices, the resistor grid comprising multiple resistors electrically connected to each other in a circuit, at least a first resistor of the multiple resistors including a body that extends from a first terminal end of the body to a second terminal end of the body; anda controller operably connected to the one or more switch devices and configured to control the one or more switch devices to direct an excess portion of the electric current received from the electrical intermediary device to the resistor grid for the multiple resistors to dissipate the excess portion of the electric current as heat.2. The power system of claim 1 , wherein the body of the first resistor is disc-shaped and forms a continuous claim 1 , non-intersecting path from the first terminal end to the second terminal end.3. The power system of claim 2 , wherein the body of the first resistor includes multiple winding parts and the first resistor includes one or more insulative support members that are attached to the ...

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Номер записи: 77
14-04-2016 дата публикации

Method for Manufacturing a Surface Mount Device

Номер: US20160104559A1
Автор: Bhatawadekar Kedar V., Ngo Minh V., Nitzan Dov, Pineda Martin G., Sepulveda Mario G., Vranicar Anthony
Принадлежит: TYCO ELECTRONICS CORPORATION

A method of manufacturing a surface mount device includes forming a plaque from a material, forming a plurality of conductive protrusions on a top surface and a bottom surface of the plaque, and applying a liquid encapsulant over at least a portion of the top surface and at least a portion of the bottom surface of the plaque. The liquid encapsulant is cured and when cured encapsulant has an oxygen permeability of less than about 0.4 cm3·mm/m2·atm·day. The assembly is cut to provide a plurality of components. After cutting, the top surface of each component includes at least one conductive protrusion, the bottom surface of each component includes at least one conductive protrusion, the top surface and the bottom surface of each component include the cured encapsulant, and a core of each component includes the material. 1. A method of manufacturing a surface mount device , the method comprising:forming a plaque from a material;forming a plurality of conductive protrusions on a top surface and a bottom surface of the plaque;applying a liquid encapsulant over at least a portion of the top surface and at least a portion of the bottom surface of the plaque;curing the liquid encapsulant, wherein the cured encapsulant has an oxygen permeability of less than about 0.4 cm3·mm/m2·atm·day; andcutting through the cured encapsulant and plaque to provide a plurality of components, wherein after cutting, the top surface of each component includes at least one conductive protrusion, the bottom surface of each component includes at least one conductive protrusion, the top surface and the bottom surface of each component include the cured encapsulant, and a core of each component includes the material.2. The method according to claim 1 , wherein the plaque material corresponds to a positive-temperature-coefficient (PTC) device.3. The method according to claim 1 , wherein the encapsulant corresponds to a thermoset epoxy.4. The method according to claim 3 , wherein in a liquid state ...

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Номер записи: 78
13-04-2017 дата публикации

LOW TEMPERATURE FABRICATION OF LATERAL THIN FILM VARISTOR

Номер: US20170104054A1
Автор: Gambino Jeffrey P., Graf Richard S., Mandal Sudeep
Принадлежит:

A structure and method for fabricating a laterally configured thin film varistor surge protection device using low temperature sputtering techniques which do not damage IC device components contiguous to the varistor being fabricated. The lateral thin film varistor may include of a continuous layer of alternating regions of a first metal oxide layer and a second metal oxide layer formed between two laterally spaced electrodes using a low temperature sputtering process followed by a low temperature annealing process. 1. A method of forming a lateral thin film varistor comprising: forming the first metal oxide layer comprised of a plurality of spaced apart sections of the first metal oxide on a dielectric layer,', 'forming a pair of isolation layer sections, comprised of an insulating material, on the dielectric layer, laterally outside the first metal oxide layer, and', 'forming the second metal oxide layer comprised of a plurality of spaced apart sections of the second metal oxide on the dielectric layer, each of the sections of the second metal oxide layer being located between a pair of the sections of the first metal oxide layer., 'forming a continuous layer comprising alternating regions of a first metal oxide layer and a second metal oxide layer between two laterally spaced electrodes using sputtering process followed by an annealing process, including'}2. The method of claim 1 , wherein the first metal oxide layer comprises zinc oxide.3. The method of claim 1 , further comprising doping the first metal oxide layer with aluminum oxide.4. The method of claim 1 , wherein the second metal oxide layer comprises bismuth oxide.5. The method of claim 1 , further comprising doping the second metal oxide layer with aluminum oxide.6. The method of claim 1 , wherein the annealing process is carried out in an inert gas atmosphere.7. The method of claim 1 , wherein the annealing process comprises heating the continuous layer to a temperature not exceeding a maximum ...

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Номер записи: 79
26-03-2020 дата публикации

FLEXIBLE RESISTOR

Номер: US20200100330A1
Автор: EUSEBIO Mario, MARCER Sandro, Zanella Stefano, ZOPPAS Federico
Принадлежит:

A flexible resistor including a support made of electrically insulating material; at least one track made of an electrically conductive material incorporated in the support, and configured to be connected to an electric energy source; a foil made of electrically conductive material, having a surface fixed to a first face of the support, and a plurality of wings defined by foil portions cut and folded transversally to the surface. 1. A flexible resistor comprisinga support made of electrically insulating material;{'b': '20', 'at least one track () made of electrically conductive material incorporated in the support, adapted to be connected to an electric energy source;'}a foil made of electrically conductive material, having a surface fixed to a first face of the support, anda plurality of wings defined by foil portions cut and folded transversally to said surface.2. The flexible resistor according to claim 1 , comprising a plurality of tracks made of electrically conductive material claim 1 , adapted to be electrically connected in parallel to one another.3. The flexible resistor according to claim 1 , wherein the support is made of silicone.4. The flexible resistor according to claim 1 , wherein said foil is made of metal.5. The flexible resistor according to claim 4 , wherein the foil is made of aluminum.6. The flexible resistor according to claim 1 , wherein a respective portion of the support claim 1 , in which a respective portion of the at least one track is incorporated claim 1 , is stuck onto one or more wings of said plurality of wings.7. The flexible resistor according to claim 1 , comprising a positive temperature coefficient element in electrical contact with the at least one track.8. The flexible resistor according to claim 7 , comprising a plurality of positive temperature coefficient elements.9. The flexible resistor according to claim 8 , wherein each positive temperature coefficient element is in electrical contact with more than one portion of the ...

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Номер записи: 80
21-04-2016 дата публикации

PUNCHED PART FOR PRODUCING AN ELECTRICAL RESISTOR, CURRENT SENSOR AND CORRESPONDING PRODUCTION METHOD

Номер: US20160111189A1
Автор: MARIEN Jan
Принадлежит:

The invention relates to a punched part for producing an electrical resistor, in particular a current measuring resistor, comprising a resistor element () consisting of a low-resistance resistive material (for example Manganin®) and two electrical connection parts () consisting of a conductor material (for example copper), wherein the resistor element () is arranged between the two electrical connection parts () in the direction of current flow in such a way that the electrical current flows through the resistor element (). In accordance with the invention, the punched part additionally has a landing area () for providing an integrated circuit () on the landing area () of the punched part. Furthermore, the invention comprises a current sensor comprising such a punched part and a corresponding production method. 117-. (canceled)18. A punched part for producing an electrical resistor , comprising:a) a resistor element comprising a low-ohm resistance material,b) a first current connecting part comprising a conductor material for passing an electric current into the electrical resistor, andc) a second current connecting part comprising a conductor material for passing the electric current out of the electrical resistor, wherein:d) the resistor element is arranged between the first current connecting part and the second current connecting part in a direction of current flow, so that the electric current flows through the electrical resistor,e) the punched part is punched out of a composite material strip, andf) the punched part further comprises a landing area arranged to receive an integrated circuit.19. The punched part according to claim 18 , further comprising a first voltage measuring contact and a second voltage measuring contact for measuring the electric voltage drop across the resistor element.20. The punched part according to claim 19 , further comprising a plurality of external electrical contacts for electrical contacting of the integrated circuit from ...

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Номер записи: 81
30-04-2015 дата публикации

MULTILAYER CERAMIC ELECTRONIC COMPONENT, SERIES OF ELECTRONIC COMPONENTS STORED IN A TAPE, AND METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT

Номер: US20150114703A1
Автор: SHIMIZU Kotaro
Принадлежит:

In a multilayer ceramic electronic component, a size of a step portion on a first main surface and a size of a step portion on a second main surface are different from each other. A first outer electrode includes a plating film containing Cu. A length of a portion of the plating film containing Cu that is positioned on the first main surface in a length direction and a length of a portion of the plating film containing Cu that is positioned on the second main surface in the length direction are different from each other. 1. A multilayer ceramic electronic component comprising:a ceramic element body including first and second main surfaces extending in a length direction and a width direction, first and second side surfaces extending in the length direction and a thickness direction, and first and second end surfaces extending in the width direction and the thickness direction;first and second inner electrodes that are alternately disposed within the ceramic element body in the thickness direction and that are not positioned at an end portion of the ceramic element body in the width direction;a first outer electrode that is electrically connected to the first inner electrodes and extends from the first end surface to the first and second main surfaces; anda second outer electrode that is electrically connected to the second inner electrodes and extends from the second end surface to the first and second main surfaces; whereina size of a step portion on the first main surface and a size of a step portion on the second main surface are different from each other;the first outer electrode includes a plating film containing Cu; anda length of a portion of the plating film containing Cu that is positioned on the first main surface in the length direction and a length of a portion of the plating film containing Cu that is positioned on the second main surface in the length direction are different from each other.2. The multilayer ceramic electronic component according to ...

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Номер записи: 82
19-04-2018 дата публикации

CHIP RESISTOR AND METHOD FOR MAKING THE SAME

Номер: US20180108459A1
Автор: Harada Kenichi, YONEDA Masaki
Принадлежит:

A chip resistor includes first and second electrodes spaced apart from each other, a resistor element arranged on the first and the second electrodes, a bonding layer provided between the resistor element and the two electrodes, and a plating layer electrically connected to the resistor element. The first electrode includes a flat outer side surface, and the resistor element includes a side surface facing in the direction in which the thirst and the second electrodes are spaced. The outer side surface of the first electrode is flush with the side surface of the resistor element. The plating layer covers at least a part of the outer side surface of the first electrode in a manner such that the covering portion of the plating layer extends from one vertical edge of the outer side surface to the other vertical edge. 131-. (canceled)32. A resistor comprising: a first insulating part including first and second surfaces that face opposite sides to each other;', 'a second insulating part spaced apart from the first insulating part in a first direction, the second insulating part including first and second surfaces that face opposite sides to each other; and', 'a third insulating part disposed between the first and the second insulating parts, the third insulating part being larger in size in the first direction than each of the first and second insulating parts, the third insulating part including first and second surfaces that face opposite sides to each other, the first surface of the third insulating part being connected to the first surfaces of the first and second insulating parts, the second surface of the third insulating part being connected to the second surfaces of the first and second insulating parts;, 'an electrical insulator including a first resistor part disposed on the first surface of the first insulating part;', 'a second resistor part disposed on the first surface of the second insulating part; and', 'a third resistor part disposed on the first surface ...

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Номер записи: 83
19-04-2018 дата публикации

RECTANGULAR CHIP RESISTOR AND MANUFACTURING METHOD FOR SAME

Номер: US20180108462A1
Автор: MORITA Tomiharu, NOJIRI Yuusuke
Принадлежит:

The chip resistor includes insulating substrate , first and second top electrodes () on the top surface of the insulating substrate each on either longitudinal end thereof, and resistive element electrically in contact with the top electrodes, wherein each of the top electrodes has, on its inner side facing to the other, cutout part and protruding part , with the cutout part in the first top electrode extending from at least one longitudinal side of the insulating substrate, transversely inwards thereof, and with the cutout part in the second top electrode arranged substantially point-symmetrically to the cutout part in the first top electrode with respect to the center of the insulating substrate, wherein the resistive element has contacting regions , and non-contacting regions , and trimming slot () including a linear part. 1. A rectangular chip resistor comprising:an insulating substrate,a pair of first and second top electrodes disposed on a top surface of the insulating substrate each on either longitudinal end thereof, anda resistive element electrically in contact with said top electrodes,wherein each of said first and second top electrodes has, on its inner side facing to the other, a cutout part and a protruding part protruding with respect to the cutout part, with said cutout part in the first top electrode extending from at least one of two longitudinal sides of the insulating substrate, transversely inwards of the insulating substrate, and with said cutout part in the second top electrode being arranged substantially point-symmetrically to said cutout part in the first top electrode with respect to a center of the insulating substrate,wherein said resistive element has contacting regions each in contact with said first or second top electrode along the protruding part, and non-contacting regions each out of contact with said top electrodes along the cutout part, andwherein said resistive element has a trimming slot including a linear part extending from ...

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Номер записи: 84
21-04-2016 дата публикации

ELECTRICAL HEATER

Номер: US20160113063A1
Автор: "OConnor Jason Daniel Harold", Howe Peter Richard, Scott Ian James
Принадлежит:

An electrical heater comprising; a first conductor, a second conductor, and a fluoropolymer heating element disposed between the first conductor and the second conductor, and a temperature regulation element disposed between the fluoropolymer heating element and the second conductor, wherein the fluoropolymer heating element comprises an electrically conductive material distributed within a fluoropolymer, and wherein the electrical heater comprises a stack, the first conductor, the second conductor, the fluoropolymer heating element, and the temperature regulation element comprising layers of the stack. 134-. (canceled)35. An electrical heater comprising;a first conductor,a second conductor,a fluoropolymer heating element disposed between the first conductor and the second conductor, anda temperature regulation element disposed between the fluoropolymer heating element and the second conductor;wherein the fluoropolymer heating element comprises an electrically conductive material distributed within a fluoropolymer, andwherein the electrical heater comprises a stack, the first conductor, the second conductor, the fluoropolymer heating element, and the temperature regulation element comprising layers of the stack.36. An electrical heater according to claim 35 , wherein the fluoropolymer is a perfluoroalkoxy copolymer.37. An electrical heater according to claim 36 , wherein the perfluoroalkoxy copolymer is a copolymer of tetrafluoroethylene and perfluoromethyl vinyl ether or of tetrafluoroethylene and perfluoropropyl vinyl ether.38. An electrical heater according to wherein the electrically conductive material comprises conductive particles.39. An electrical heater according to wherein the conductive particles are selected from carbon black claim 38 , graphite claim 38 , graphene claim 38 , carbon fibres claim 38 , carbon nanotubes claim 38 , metal powders claim 38 , metal strand and metal coated fibres.40. An electrical heater according to wherein the fluoropolymer ...

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Номер записи: 85
02-04-2020 дата публикации

PTC DEVICE

Номер: US20200105443A1
Автор: LEE Wen Feng, TSENG Chun Teng, WANG DAVID SHAU CHEW
Принадлежит:

A PTC device comprises a current and temperature sensing element, a first insulating layer, a second insulating layer, a first electrode layer and a second electrode layer. The current and temperature sensing device is a laminated structure comprising a first conductive layer, a second conductive layer and a PTC material layer. The first and second conductive layers are disposed on first and second surfaces of the PTC material layer, respectively. The second surface is opposite to the first surface. The first and second insulating layers are disposed on the first and second conductive layers, respectively. The first electrode layer is disposed on the first insulating layer and electrically connects to the first conductive layer. The second electrode layer is disposed on the second insulating layer and electrically connects to the second conductive layer. Corners of the current and temperature sensing device are provided with insulating members. 1. A PTC device , comprising:a current and temperature sensing element being a laminated structure of a first electrically conductive layer, a second electrically conductive layer and a PTC material layer, the first electrically conductive layer being disposed on a first surface of the PTC material layer, the second electrically conductive layer being disposed on a second surface of the PTC material layer, the second surface being opposite to the first surface;a first insulating layer disposed on the first electrically conductive layer;a second insulating layer disposed on the second electrically conductive layer;a first electrode layer disposed on the first insulating layer and electrically connecting to the first electrically conductive layer;a second electrode layer disposed on the second insulating layer and electrically connecting to the second electrically conductive layer;wherein corners of the current and temperature sensing element are provided with insulating members,wherein the first insulating layer, the first ...

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Номер записи: 86
07-05-2015 дата публикации

Method for producing a multi-layer component and multi-layer component

Номер: US20150123516A1
Автор: Christoph Auer, Dieter Somitsch, Franz Rinner, Gerhard Fuchs
Принадлежит: EPCOS AG

A method for producing a multilayer component ( 21 ) is specified, which involves providing a body having dielectric layers ( 3 ) arranged one above another and first and second electrically conductive layers ( 4, 84, 5, 85 ) arranged therebetween. The first conductive layers ( 4, 84 ) are connected to a first auxiliary electrode ( 6 ) and the second conductive layers ( 5, 85 ) are connected to a second auxiliary electrode ( 7 ). The body ( 1, 81 ) is introduced into a medium and a voltage is applied between the first and second auxiliary electrodes ( 6, 7 ) for producing a material removal. Furthermore, a multilayer component is specified, which has depressions ( 20 ) formed by an electrochemically controlled material removal.

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Номер записи: 87
03-05-2018 дата публикации

ELECTRONIC CIGARETTE AND METHOD

Номер: US20180116296A1
Автор: Jordan Geoffrey Brandon, Mullins Michael J., Rostami Ali A., Smith Barry S., Tucker Christopher S.
Принадлежит: Altria Client Services LLC

An electronic smoking article includes a liquid supply including liquid material, a heater operable to heat the liquid material to a temperature sufficient to vaporize the liquid material and form an aerosol, a wick in communication with the liquid material and in communication with the heater such that the wick delivers the liquid material to the heater, and at least one air inlet operable to establish a predetermined resistance to draw under a prescribed test of said smoking article. 1. A method of improving a plurality of electronic smoking articles , the method comprising:forming an air inlet in an outer tube of each electronic smoking article, the air inlet being sized and configured to provide the electronic smoking article with a predetermined resistance to draw; andsubjecting the air inlet of each smoking article to a test of resistance to draw during manufacture of the electronic smoking article.2. A method of improving a plurality of electronic smoking articles , the method comprising:forming an air inlet in a metal plate insert prior to placement of the metal plate insert into an electronic smoking article, the air inlet being sized and configured to provide the electronic smoking article with a predetermined resistance to draw; andsubjecting the air inlet to a test of resistance-to-draw during manufacture of the electronic smoking article.3. The method of claim 2 , further including affixing the metal plate insert to an inner or outer surface of the outer tube of the electronic smoking article.4. The method of claim 2 , wherein the subjecting step includes establishing a benign test configuration.5. The method of claim 4 , wherein the establishing step includes using a release connection between components of the benign test configuration claim 4 , the connection conducive to automated machine handling.6. The method of claim 2 , further comprising protecting the air inlet with a removable tape prior after the subjecting step.7. A method of achieving a ...

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Номер записи: 88
13-05-2021 дата публикации

Chip Resistor Manufacturing Method

Номер: US20210142932A1
Автор: IGUCHI Natsuki, Matsumoto Kentaro
Принадлежит:

Regarding a chip resistor including a resistor provided with a first trimming groove for coarse adjustment and a second trimming groove for fine adjustment, the steps of setting the length of a first lateral direction cut part of the first trimming groove after L-shaped direction turning to be a certain length, setting coordinates of a trimming start point of the second trimming groove at a position which is constantly separated from a first vertical direction cut part of the first trimming groove only by a certain distance, and irradiating with a laser light from the coordinates toward a direction orthogonal to a direction between the electrodes are performed to form the second trimming groove which faces the first trimming groove and is oriented in the direction opposite to the orientation of the first trimming groove. 1. A method of manufacturing a chip resistor , the method comprising:an electrodes forming step of forming a pair of electrodes on a front surface of an insulating substrate with a predetermined interval therebetween;a resistor forming step of forming a rectangular parallelepiped resistor so as to connect the pair of electrodes;{'b': '1', 'a first trimming forming step of measuring a resistance value of the resistor, forming a first cutting-out which extends from one of the side faces of the resistor toward a direction orthogonal to a direction between the electrodes until a measured resistance value reaches a first target resistance value that is higher than an initial resistance value but lower than a target resistance value, and then forming a second cutting-out which extends from an end of the first cutting-out toward the direction between the electrodes by a certain distance L so as to form an L-shaped first trimming groove; and'}a second trimming forming step of measuring the resistance value of the resistor, forming a third cutting-out which extends from one of the side faces of the resistor on which the first trimming groove is formed toward ...

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Номер записи: 89
13-05-2021 дата публикации

CHIP RESISTOR, METHOD OF PRODUCING CHIP RESISITOR AND CHIP RESISTOR PACKAGING STRUCTURE

Номер: US20210144857A1
Автор: NAKA Kentaro
Принадлежит:

[Object] A method for efficiently manufacturing chip resistors is provided. 138-. (canceled)39. A chip resistor comprising:a first electrode;a second electrode spaced apart from the first electrode in a first direction;a resistor portion bonded to the first electrode and the second electrode;a first conductive layer formed on the first electrode; anda second conductive layer formed on the second electrode,wherein the resistor portion extends along a plane spreading in the first direction and a second direction crossing the first direction,each of the first electrode and the second electrode comprises a flat upper surface that spreads in the first direction and the second direction, the flat upper surface including, as viewed in a third direction perpendicular to the first direction and the second direction, a first straight edge extending in the first direction and a second straight edge extending in the second direction, andthe first conductive layer comprises a curved edge.40. The chip resistor according to claim 39 , wherein the curved edge is arcuate as viewed in the third direction.41. The chip resistor according to claim 39 , wherein the first electrode comprises an end face connected to the flat upper surface thereof and perpendicular to the first direction claim 39 , and the first conductive layer covers at least a part of the end face of the first electrode.42. The chip resistor according to claim 39 , wherein the resistor portion comprises: a main surface spreading in the first direction and the second direction; and a side surface encircling the resistor portion as viewed in the third direction claim 39 , wherein each of the first electrode and the second electrode is bonded to one of the main surface and the side surface of the resistor portion.43. The chip resistor according to claim 42 , wherein the resistor portion is bonded to the respective upper surfaces of the first electrode and the second electrode.44. The chip resistor according to claim 39 , ...

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Номер записи: 90
27-05-2021 дата публикации

PREPARATION AND APPLICATION OF A LOW-B HIGH-RESISTANCE HIGH-TEMPERATURE THERMISTOR MATERIAL WITH WIDE TEMPERATURE RANGE

Номер: US20210155548A1
Автор: Li Ai Feng, LI Mingya, NI Li, Zhang Chao, Zhang Yu, Zhou Yang
Принадлежит: ZKLM New Material (Yangzhou) Co., Ltd.

An object of the present disclosure is to provide the preparation and application of a low-B high-resistance high-temperature thermistor material with wide temperature range. The thermistor material uses CaCO, YO, NbO, CeOand MoOas raw materials. The CaYMoO-xCeNbO(1≤x≤3, 0.01≤y≤0.2) high-temperature thermistor material having low-B high-resistance and wide temperature region is obtained by mixing grinding, calcination, cold isostatic pressing, high-temperature sintering and coating electrode. The material constant Bis 1800 K-4000 K, and the resistivity at 25° C. is 8.0×10Ω·cm-6.0×10Ω·cm. The low-B high-resistance wide temperature range high-temperature thermistor material prepared by the disclosure has stable performance and good consistency. The thermistor material has obvious negative temperature coefficient characteristics in the range of 25° C.-1000° C. and is suitable for manufacturing wide temperature range high-temperature thermistor. 1. A low-B high-resistance wide temperature range high-temperature thermistor material , wherein the thermistor material is prepared by CaCO , NbO , CeO , MoOand YO , and the thermistor material is a composite oxide including Ca , Y , Mo , Ce and Nb.2. The low-B high-resistance wide temperature range high-temperature thermistor material according to claim 1 , wherein the chemical composition system is composed of CaYMoO-xCeNbO claim 1 , wherein 1≤x≤3 claim 1 , 0.01≤y≤0.2.3. The low-B high-resistance wide temperature range high-temperature thermistor material according to claim 1 , wherein the molar ratio of Ca claim 1 , Y claim 1 , Mo claim 1 , Ce and Nb is (0.8˜0.99):(0.01˜0.2): 1:(1˜3):(1˜3).4. The low-B high-resistance wide temperature range high-temperature thermistor material according to claim 1 , wherein the molar ratio of Ca claim 1 , Y claim 1 , Mo claim 1 , Ce and Nb is (0.85˜0.95):(0.05˜0.15):1:(1.5˜2.5):(1.5˜2.5).5. A preparation method of the low-B high-resistance wide temperature range high-temperature thermistor ...

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Номер записи: 91
04-05-2017 дата публикации

SURFACE MOUNT RESISTORS AND METHODS OF MANUFACTURING SAME

Номер: US20170125141A1
Автор: Smith Clark, Wyatt Todd
Принадлежит: VISHAY DALE ELECTRONICS, LLC

Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of conductive elements. The plurality of conductive elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of conductive elements and a surface of the resistive element. The plurality of conductive elements is coupled to the resistive element via conductive layers and solderable layers. 1. A resistor comprising:a resistive element having an upper surface, a bottom surface, a first side surface, and an opposite second side surface; anda first conductive element and a second conductive element joined to the upper surface of the resistive element by an adhesive, wherein a gap is provided between the first conductive element and the second conductive element, and wherein the positioning of the first conductive element and the second conductive leaves exposed portions of the upper surface of resistive element adjacent the first side surface and the second side surface of the resistive element;a first conductive layer covering the exposed portion of the upper surface of resistive element adjacent the first side surface, and in contact with the first conductive element;a second conductive layer covering the exposed portion of the upper surface of resistive element adjacent the second side surface, and in contact with the second conductive element;a third conductive layer positioned along a bottom portion of the resistive element, adjacent the first side of the resistive element;a fourth conductive layer positioned along a bottom portion of the resistive element, adjacent the second side of the resistive element;a dielectric material covering upper surfaces of the first conductive element and the second conductive element and filling the gap between the first conductive element and the second conductive element; and ...

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Номер записи: 92
04-05-2017 дата публикации

CHIP RESISTOR AND METHOD OF PRODUCING THE SAME

Номер: US20170125143A1
Автор: KONDO YASUHIRO, MATSUURA Katsuya, NUKAGA Eiji, TAMAGAWA Hiroshi
Принадлежит: ROHM CO., LTD.

A chip resistor includes: a board having a device formation surface, a back surface opposite from the device formation surface and side surfaces connecting the device formation surface to the back surface, a resistor portion provided on the device formation surface, a first connection electrode and a second connection electrode provided on the device formation surface and electrically connected to the resistor portion, and a resin film covering the device formation surface with the first connection electrode and the second connection electrode being exposed therefrom. Intersection portions of the board along which the back surface intersects the side surfaces each have a rounded shape. 1. A chip component production method , comprising:forming a device in each of a plurality of chip component regions defined on a front surface of a substrate;forming a trench in a boundary region defined between the chip component regions, the trench having a predetermined depth as measured from the front surface of the substrate; andgrinding a back surface of the substrate to the trench to divide the substrate into a plurality of chip components.2. The chip component production method according to claim 1 ,wherein the forming a trench step includes:forming a resist pattern for the boundary region; andetching the substrate by using the resist pattern as a mask to form the trench.3. The chip component production method according to claim 2 , wherein the etching is plasma etching.4. The chip component production method according to claim 1 ,wherein the forming a device step includes forming a resistor portion,wherein the chip components are chip resistors.5. The chip component production method according to claim 4 ,wherein the forming a resistor portion step includes:forming a resistive film on the front surface of the substrate;forming an interconnection film in contact with the resistive film; andpatterning the resistive film and the interconnection film to form a plurality of ...

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Номер записи: 93
25-08-2022 дата публикации

Chip resistor

Номер: US20220270789A1
Автор: Chia-Cheng Cheng, Quo-Xiang CHI, Tim Wang, Wen-Chun Chen
Принадлежит: Ralec Electronic Corp

A chip resistor includes a main body having opposite first and second surfaces and a peripheral surface connected between the first and second surfaces, and first and second electrode units oppositely and separately disposed on the peripheral surface. The main body includes a resistance layer having opposite top and bottom surfaces, a metallic heat dissipation layer disposed on the top surface of the resistance layer, a metallic heat conductive layer disposed on the bottom surface of the resistance layer, and an insulating unit interposed between the resistance layer and the metallic heat dissipation layer, and between the resistance layer and the metallic heat conductive layer.

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Номер записи: 94
12-05-2016 дата публикации

TEMPERATURE SENSOR WITH HEAT-SENSITIVE PASTE

Номер: US20160131537A1
Автор: ALIANE Abdelkader, Coppard Romain
Принадлежит:

The invention concerns a heat-sensitive resistor with a negative or positive temperature coefficient, comprising respectively an antimony-doped tin oxide-based resistive element or a carbon black-based resistive element, containing a polymer having a dielectric constant between 2 and 3, a molar mass between 50000 and 150000 g/mol, and a glass transition temperature Tg between 40 and 100° C. 1. A heat-sensitive resistor of negative or positive temperature coefficient , respectively comprising a resistive element based on antimony tin oxide or a resistive element based on carbon black , containing a polymer having a dielectric constant between 2 and 3 , a molar mass between 50 ,000 and 150 ,000 g/mol , and a glass transition temperature Tg between 40 and 100° C.2. The heat-sensitive resistor of claim 1 , wherein the polymer belongs to the family of styrenic polymers or to the family of fluorinated polymers.3. The heat-sensitive resistor of claim 1 , wherein the resistive element comprises from 5% to 40% by mass of dry extract of the polymer with respect to the total mass of the resistive element.4. The heat-sensitive resistor of claim 1 , of positive temperature coefficient having an adjustable threshold temperature with a resistance which is constant below said threshold and which increases along with temperature above said threshold comprising claim 1 , in series claim 1 , a first resistive track made of a heat-sensitive paste of positive temperature coefficient claim 1 , PTC claim 1 , and a second resistive track made of a heat-sensitive paste of negative temperature coefficient claim 1 , NTC.5. A method of manufacturing a heat-sensitive resistor of negative or positive temperature coefficient claim 1 , comprising the steps of:forming a first solution comprising antimony tin oxide or carbon black containing a polymer having a dielectric constant between 2 and 3, a molar mass between 50,000 and 150,000 g/mol, and a glass transition temperature Tg between 40 and 100° ...

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Номер записи: 95
04-05-2017 дата публикации

ONE-COAT ENCAPSULATED GRAPHITE HEATER AND PROCESS

Номер: US20170127476A1
Автор: Hasegawa Tomoo, Lu Zhong-Hao, Matsui Yoshihiko, Morikawa Yuji
Принадлежит:

A coated graphite heater. The heater has a configuration comprising a plurality of heating elements having a major portion disposed parallel to an upper surface of the heater so that the major portion is disposed horizontally. The heater configuration provides a heater that exhibits reduced thermal stress and/or reduced CTE mismatch stress particularly compared to designs having heating elements with a major portion oriented perpendicular to the plane of the upper surface of the heater. 1. A heater comprising:a graphite body comprising at least one heating element configured to form a pattern for an electrical flow path;a structural insert configured for insertion into the graphite body such that the structural insert provides support for the graphite body; anda coating layer encapsulating the patterned graphite body and the structural insert.2. The heater of claim 1 , wherein the structural insert comprises at least one of a nitride claim 1 , carbide claim 1 , carbonitride or oxynitride of elements selected from a group consisting of B claim 1 , Al claim 1 , Si claim 1 , Ga claim 1 , refractory hard metals claim 1 , transition metals claim 1 , and rare earth metals claim 1 , or complexes and/or combinations of two or more thereof.3. The heater of claim 2 , wherein the structural insert comprises at least one of pyrolytic boron nitride (pBN) claim 2 , aluminum nitride claim 2 , titanium aluminum nitride claim 2 , titanium nitride claim 2 , titanium aluminum carbonitride claim 2 , titanium carbide claim 2 , silicon carbide claim 2 , and silicon nitride claim 2 , or complexes and/or combinations of two or more thereof.4. The heater of claim 3 , wherein the structural insert comprises pyrolytic boron nitride (pBN).5. The heater of claim 1 , wherein the at least one heating element defines a contiguous path defining a gap between the at least one heating element claim 1 , and the structural insert is disposed in the gap.6. The heater of claim 5 , wherein the gap is ...

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Номер записи: 96
31-07-2014 дата публикации

RESISTOR AND METHOD FOR MAKING SAME

Номер: US20140210587A1
Автор: Bertsch Thomas L., Brune Rodney, Smith Clark L., Veik Thomas L., Wyatt Todd L.
Принадлежит: VISHAY DALE ELECTRONICS, INC.

A metal strip resistor is provided. The metal strip resistor includes a metal strip forming a resistive element and providing support for the metal strip resistor without use of a separate substrate. There are first and second opposite terminations overlaying the metal strip. There is plating on each of the first and second opposite terminations. There is also an insulating material overlaying the metal strip between the first and second opposite terminations. A method for forming a metal strip resistor wherein a metal strip provides support for the metal strip resistor without use of a separate substrate is provided. The method includes coating an insulative material to the metal strip, applying a lithographic process to form a conductive pattern overlaying the resistive material wherein the conductive pattern includes first and second opposite terminations, electroplating the conductive pattern, and adjusting resistance of the metal strip. 1. A metal strip resistor , comprising:a metal strip forming a resistive element and providing support for the metal strip resistor without use of a separate substrate;first and second photolithographically formed terminations overlaying the metal strip; andan adhesion layer between each of the first and second photolithographically formed terminations and the metal strip.2. The metal strip resistor of claim 1 , further comprising an insulating material overlaying the metal strip between the first and second terminations.3. The metal strip resistor of wherein the metal strip is a metal alloy comprising at least one of nickel claim 1 , chromium claim 1 , aluminum claim 1 , manganese claim 1 , and copper.4. The metal strip resistor of wherein the adhesion layer comprises copper claim 1 , titanium claim 1 , and tungsten.5. The metal strip resistor of wherein the metal strip resistor is an 0402 size (1.0 mm by 0.5 mm) chip resistor.6. The metal strip resistor of wherein the insulating material comprises a polyimide.7. The metal ...

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Номер записи: 97
12-05-2016 дата публикации

RESISTOR AND METHOD FOR MANUFACTURING SAME

Номер: US20160133362A1
Автор: Iseki Takeshi, MATSUMURA Kazutoshi, NAKAYAMA SHOGO, TSUDA Seiji
Принадлежит:

A resistor includes a resistive element, a protective film, and a pair of electrodes. The resistive element is made of a metal plate. The protective film is formed on the upper surface of the resistive element. The plated layers are formed to cover the electrodes. The electrodes are separated from each other with the protective film therebetween and are formed at both ends of the upper surface of the resistive element. The electrodes are formed by printing metal-containing paste. 1. A resistor comprising:a resistive element made of a metal plate;a protective film formed on a first surface of the resistive element; anda pair of electrodes separated from each other with the protective film therebetween and formed at both ends of the first surface of the resistive element,wherein the pair of electrodes are formed by printing paste containing resin and metal powder contained in the resin.2. The resistor according to claim 1 ,wherein the resistive element is made of an alloy containing a same metal as a metal composing the electrodes.3. The resistor according to claim 1 ,wherein the protective film has an thickness as same as those of the pair of electrodes, on the first surface of the resistive element.4. A method of manufacturing a resistor claim 1 , the method comprising:forming a plurality of electrodes by printing metal powder-containing paste at space intervals on an upper surface of a resistive element made of metal;forming a protective film so as to cover the upper surface of the resistive element and upper surfaces of the electrodes; andgrinding the protective film until the electrodes are exposed.5. A method of manufacturing a resistor claim 1 , the method comprising;forming a plurality of belt-shaped electrodes by printing metal powder-containing paste at space intervals on a surface of a sheet-shaped resistive element made of metal;forming, on the sheet-shaped resistive element, a slit crossing the belt-shaped electrodes;forming a first insulating film ...

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Номер записи: 98
01-09-2022 дата публикации

METHOD FOR PREPARING THIN FILM PIEZORESISTIVE MATERIAL, THIN FILM PIEZORESISTIVE MATERIAL, ROBOT AND DEVICE

Номер: US20220275220A1
Автор: Dai Yuan, Gao Bin, Qian He, Tang Jianshi, Wu Huaqiang, Yuan Jian, Zhang Zhengyou, ZHAO Zhenxuan
Принадлежит:

Embodiments of this application provide a method for preparing a thin film piezoresistive material, a thin film piezoresistive material, a robot, and a device. The method includes: determining a mass ratio of conductive particles to a cross-linked polymer in preparation of the thin film piezoresistive material, a value range of the mass ratio being 3:97 to 20:80; dispersing the conductive particles and the cross-linked polymer in a solvent according to the mass ratio, to obtain a first dispersion; and curing the first dispersion by using a liquid dropping method within a temperature range of 25° C. to 200° C., to obtain the thin film piezoresistive material. The technical solutions provided by the embodiments of this application provide a method for preparing a thin film piezoresistive material through liquid dropping, thereby effectively controlling the thickness of the piezoresistive material, so that the prepared thin film piezoresistive material has a relatively small thickness. 1. A method for preparing a thin film piezoresistive material , comprising:determining a mass ratio of conductive particles to a cross-linked polymer in preparation of the thin film piezoresistive material, a value range of the mass ratio being 3:97 to 20:80;dispersing the conductive particles and the cross-linked polymer in a solvent according to the mass ratio, to obtain a first dispersion; andcuring the first dispersion by using a liquid dropping method within a temperature range of 25° C. to 200° C., to obtain the thin film piezoresistive material.2. The method according to claim 1 , wherein the curing the first dispersion by using a liquid dropping method within a temperature range of 25° C. to 200° C. claim 1 , to obtain the thin film piezoresistive material comprises:mixing a first solvent and the first dispersion according to a required first viscosity, to obtain a pre-curing agent of the first viscosity;determining a first dosage of the pre-curing agent according to a ...

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Номер записи: 99
10-05-2018 дата публикации

CHIP RESISTOR

Номер: US20180130578A1
Автор: BAEK Kyung Seon, Park Kwang Hyun, YUN Jang Seok
Принадлежит:

A chip resistor includes a board, first and second electrodes disposed on one surface of the board, and a resistor body electrically connecting the first and second electrodes to each other and including a copper-manganese-tin (Cu—Mn—Sn) alloy. In the Cu—Mn—Sn alloy, a percentage of Mn ranges from 11% to 20%, a percentage of Sn ranges from 2% to 8%, and a total percentage of Mn and Sn ranges from 13.5% to 22.5%. 1. A chip resistor comprising:a board;first and second electrodes disposed on one surface of the board; anda first resistor body electrically connecting the first and second electrodes to each other and including a copper-manganese-tin (Cu—Mn—Sn) alloy,wherein, in the Cu—Mn—Sn alloy, a weight percentage of Mn ranges from 11% to 20%, a weight percentage of Sn ranges from 2% to 8%, and a total weight percentage of Mn and Sn ranges from 13.5% to 22.5%.2. The chip resistor of claim 1 , wherein an absolute value of thermo-electromotive force (EMF) of the first resistor body is 3 μV/° C. or less and an absolute value of temperature coefficient of resistivity (TCR) of the first resistor body is 100 ppm/° C. or less.3. The chip resistor of claim 1 , wherein a resistance value of the first resistor body exceeds 0Ω and is less than or equal to 100 mΩ.4. The chip resistor of claim 1 , wherein the first resistor body has a groove.5. The chip resistor of claim 1 , wherein the first resistor body further includes glass.6. The chip resistor of claim 1 , further comprising a second resistor body electrically connecting the first and second electrodes to each other and including a Cu—Mn—Sn alloy claim 1 ,wherein a weight percentage of Mn in the Cu—Mn—Sn alloy included in the second resistor body is greater than the weight percentage of Mn in the Cu—Mn—Sn alloy included in the first resistor body, anda weight percentage of Sn in the Cu—Mn—Sn alloy included in the second resistor body is less than the weight percentage of Sn in the Cu—Mn—Sn alloy included in the first resistor ...

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Номер записи: 100