ОСЕВОЙ ЭЛЕКТРИЧЕСКИЙ РУЛОННЫЙ КОНДЕНСАТОР

Осевой электрический рулонный конденсатор выполнен в виде по меньшей мере одного конденсаторного рулона, расположенного на центральной трубке 9. На двух его противоположных торцевых сторонах расположено по одному металлическому контактно-выводному элементу 3 (12), электрическим соединенному с шоопированным покрытием 11, расположенным на торцевой стороне рулона, и центрированному в центральной трубке 9. Конденсатор снабжен синтетической оболочкой 6 до области вывода для внешних подключений. 18 з.п. ф-лы, 5 ил.

Verwendung eines Silikonoels fuer elektrische Geraete

Impraegnierfluessigkeiten fuer Elektroisoliermaterialien

In eine isolierende Fluessigkeit eingesetzter Wickelkondensator

Stossstromanlage zur Erzeugung von kurzzeitigen Hochspannungs-Starkstromstoessen

Improvements in or relating to capacitors and the manufacture thereof

A capacitor section with terminals exposed at the ends of an encompassing tubular pre-fabricated casing is impregnated with a mixture of an unsaturated alkyd resin having an acid number below 20 and a compatible liquid monomer such as styrene, the mixture then being copolymerized, suitably at a temperature of 150 DEG F. As an unsaturated alkyd resin there is specified one derived from maleic anhydride and ethylene glycol as principal constituents, as described in Example 4 of Specification 679,539. The polymerization step may be conducted in the presence of catalysts and inhibitors.

CAPACITORS

... 1325530 Laminates SIEMENS AG 16 June 1971 [26 June 1970] 28088/71 Heading B5N [Also in Divisions B2 and H1] A composite strip for use in manufacturing a wound electrical capacitor comprises strip 1 of porous material, e.g. paper, with metallized layers 2, 3 on opposite surfaces, and a foil made by successive deposition of a varnish layer 6, e.g. cellulose acetate, a metal layer 4 and a varnish layer 5 on to a carrier (the metal being vapour deposited). Fig. 3 (not shown) illustrates a modification of this arrangement.

Electric capacitor assembly

... 1,095,079. Capacitors. AEROVOX CORPORATION. March 14, 1966 [March 31, 1965], No. 11131/66. Heading H1M. Wound capacitor section 10 consisting of interleaved metal foil strips and paper or plastics strips impregnated with dielectric fluid is located in can B filled with the impregnant, and ionic impurities derived from decomposition products of the impregnant are immobilized by a pair of U-shaped compressed Kraft paper members 11, 111 impregnated with a stabilizer. The stabilizer, forming 30 to 90% of the paper may be the activated oxide, hydroxide or hydrated oxide of magnesium, aluminium, silicon or titanium, bentonite, Fuller's earth, and aluminium silicates. Since the paper members are in a region where the electric field of the capacitor is less than 200 volts/mil. there is no weakening of the bond between the stabilizer and the decomposition products as is the case when the stabilizer is incorporated in the paper spacer of the capacitor section proper. Moreover, thick paper ...

Improvements in Electric Capacitors

... 1,183,155. Capacitors. ROBERT BOSCH G.m.b.H. 14 Oct., 1968 [18 Oct., 1967], No. 48506/68. Heading H1M. In an impregnated capacitor wherein the dielectric comprises strips of synthetic material the relationship between the proportion of paraffinically bonded carbon C P(K) in the synthetic material and the proportion of aromatically bonded carbon C A(T) in the impregnating agent is given by C A(T) = K.C p(K) m, wherein K is from 0À16 to 0À33 and n is from 2 to 3. The capacitor dielectric may be a polycarbonate and the impregnant a mineral oil with an aromatically bonded carbon content of 0À5 to 2%, or polyethylene terephthalate, when the mineral oil has an aromatically bonded carbon content of 1 to 5%, or polypropylene, when the impregnant has an aromatically bonded carbon content of 16 to 33%. The capacitor electrodes may be metal foils, or the dielectric material may be metallized, or a paper strip forming part of the dielectric may be metallized, or a paper or plastics strip may be metallized ...

Capacitor

... 1,039,292. Capacitors. STANDARD TELEPHONES & CABLES Ltd. June 7, 1963 [June 14, 1962], No. 22850/62. Heading HIM. A capacitor having a dielectric constituted by a re-oxidized surface layer of an essentially reduced ceramic body is impregnated with a silicone oil or an epoxy resin. Barium and strontium titanates with a lanthanum or other rare earth titanate mixed with a binder may be pressed into a disc or an axially-bored cylinder, fired to form a ceramic body, reduced, coated with silver electrodes, and re-oxidized to form the basic capacitor. This may be placed in a mould with an epoxy resin and heated under a vacuum for 15 minutes. The moulds are topped up with further resin and heated again for 30 minutes under vacuum, and the mould is then left in atmospheric air at 125‹ C. for 18 hours to cure the resin. The impregnation step reduces leakage currents and may employ silicone oil instead of epoxy resin. The capacitor may be of the flat plate type (Fig. 1, not shown) or of the hollow ...

Electrical capacitor

An electrical capacitor having an improved dielectric system. The capacitor includes layers of metal foil and a dielectric sheet material which is impregnated with a liquid dielectric composition composed of a mixture of methyl diphenyl ethane and a lower alkyl diphenyl.

Improvements in or relating to condensers for very high voltages

... 1,213,892. Capacitors. PIRELLI S.p.A. 30 Aug., 1968 [30 Aug., 1967; 22 Dec., 1967], No. 41401/68. Heading H1M. A capacitor for power factor correction plant comprises coaxial electrodes 1, 2 inner electrode 1 being perforated so that insulating fluid within it may communicate with insulating fluid impregnating the e.g. paper tape dielectric 3 between the electrodes. The electrodes may be extruded aluminium and capacitors e.g. 2700 metres long may be coiled in skeins with adjacent turns in contact; and bound with non-magnetic tape. This contact may provide adequate heat dissipation or further forced cooling may be employed. Fig. 3 illustrates a plant comprising a set of three skeins for each of three phases in an oil-tight tank 14. The inner conductors in skeins 8, 9, 10 are connected in parallel to terminal 11 by means of hollow, compressed sulphur hexafluoride insulated connecting conductors 12, 16, 17, 22 and 23 and trifurcating boxes 15, 18, 21, 24 and 27, the two ends 19 and 20, 25 ...

Improvements in or relating to electrical condensers

... 493,070. Condensers. STANDARD TELEPHONES & CABLES. Ltd., LENO, J. A., and EDWARDS, J. C. April 1, 1937, No. 9302. [Class 37] The tubular metal former upon which the alternate layers of metal and insulation are wound is perforated over the area in contact with the insulation layer in order to facilitate impregnation. Preferably the metal of the former is relatively thick to promote cooling.

ELECTRICALLY DIRECTION FOIL MATERIAL FOR ELECTRICAL CONDENSERS AND DEVICE TO ITS PRODUCTION

Reduction of ageing in insulating material of a winding, in particular an oil-impregnated high-voltage device

Die Erfindung betrifft eine Anordnung umfassend zumindest eine Wicklung (2) und ein Gehäuse (3), in welcher die Wicklung angeordnet ist, wobei die Wicklung zumindest einen elektrischen Leiter (8) aufweist, wobei die Wicklung und/oder deren elektrischer Leiter zumindest teilweise von einem zellulosehaltigen Isoliermaterial umgeben sind und wobei das Gehäuse (3) im Betriebszustand mit einem flüssigen Kühlmittel (4) gefüllt ist, sodass sich die Wicklung (2) im Betriebszustand in einem flüssigen Kühlmittel (4) befindet. Dabei ist vorgesehen, dass - zusätzlich zum vorhandenen zellulosehaltigen Isoliermaterial, das die Wicklung (2) und/oder deren elektrischen Leiter (8) zu Isolationszwecken umgibt - im Gehäuse (3) und/oder in einem Kühlkreislauf (5) für das Kühlmittel (4) zumindest ein Mittel (15, 16) enthalten ist, das chemische Verbindungen zum Reduzieren des Alterns von zellulosehaltigem Isoliermaterial enthält.

PROCEDURE FOR MANUFACTURING A LEISTUNGSKONDENSATORS

CAPACITOR STRUCTURES WITH IMPROVED ELECTRICAL STRESS CAPABILITY

AXIALLY-WOUND ELECTRICAL CAPACITOR

An axially-wound electrical capacitor is composed of at least one capacitor winding arranged on a core tube. A respective metallic lead through contact element is arranged at each of the two opposite end faces and is connected to a respective schoopage layer carried on the respective end face, the contact element being centered in the core tube. A plastic envelope covers the capacitor up to the lead-through regions for the external connections.

Verfahren zur Herstellung metallisierter dielektrischer Stoffe.

Procédé de fabrication d'un condensateur imprégné de polychloronaphtalène et condensateur obtenu par mise en oeuvre de ce procédé

Neuerung an elektrischen Kondensatoren.

Kernbohreinrichtung

Imprägnierter elektrischer Kondensator

Imprägnierter elektrischer Kondensator für Betriebstemperaturen nahe um und über 100 C

Elektrischer Wickelkondensator mit einem Dielektrikum aus mit organischem Imprägniermittel imprägnierten organischen Kunststoff-Folien und Verfahren zur Herstellung desselben

Elektrischer Kondensator

Electric condenser containing dielectric

The dielectric is composed of polypropylene and a mixture of impregnating agent containing pref. 10-20% aromatic material, 30% naphthenes and 50-60% paraffins the foil being heat treated pref. for at least 5 hrs. at 100-150 degrees C, before impregnation.

Imprägnierter regenerierfähiger elektrischer Kondensator

Electrical capacitor with a dielectric composed of bands - of plastics material impregnated with a liquid impregnant

Electrical capacitor with a dielectric composed of bands of plastics material impregnated with a liquid impregnant. F1-. In which the relationship between the fraction CP(K) of paraffinic carbon bonds and the fraction CA(T) of aromatic carbon bonds is given by CA(T) = K. CP(K)n where K = 0.16-0.33 (esp. 0.2) and n = 2-3 (esp. 2.5). Preferred dielectrics are (I) polycarbonate film impregnated with a refined mineral oil with a fraction of aromatic carbon links of 0.5-2% (esp. not more than 1%); (2) polyethylene glycol terephthalate film impregnated with a mineral oil with an aromatic carbon fraction of 1-5% (esp. ca. 2%), OR (3) polypropylene film impregnated with and insulating liquid with an aromatic carbon link fraction of 16-33%. Products are capacitors for use with alternating current, having better properties than impregnated paper dielectrics.

Verfahren zur Herstellung eines Kondensators

Kondensatoren-Anordnung

Elektrischer Kondensator

Dielektrikum und dessen Verwendung in Kondensatoren

Imprägnierter elektrischer Kondensator mit Kunststoffolien als Dielektrikum und Verfahren zur Herstellung eines derartigen Kondensators

Dielectric material - comprising a solid polyolefine completely impregnated with a halogenated aromatic cpd

Dielectric system consists of (a) a solid-polyolefin dielectric material, which is suitable for use as an electric insulator, and (b) an impregnating material, for increasing its dielectric strength. The system is prepared so that it consists of a matrix of (a) fully impregnated with (b), with a disperse phase consisting of (a) dissolved in (b). The dielectric material is characterised by having a long working life under high voltage loads, and a low loss factor. The system has a CAS of at least 750 volts; a power factor at usage voltage of not above 0.15% at room temp. to above 85 deg.C.; and a safe voltage load of at least 750 volts per mil. The system is particularly valuable for use in capacitor elements.

Verfahren zur Herstellung eines Metallpapierkondensators

ELECTRICAL WINDING OR PILE CONDENSER.

COMPOSITION OF LIQUID DIELECTRIC CAPACITOR.

CAPACITOR.

High-voltage capacitor of high energy density

Electrical Capacitor

Process of sealing of condensers and condensers obtained by this process

Polymeric film dielectric capacitor - with inert particles in and projecting from the polymer film

Process for the manufacture of rolled up electric condensers, isolated with paper

Impregnated electric condenser capable of regeneration

Dielectric compositions

IMPREGNATION MIXTURES FOR ELECTRICAL INSULATING MIXTURES

POLYOLEFIN FILM CONTAINING DISPERSED THREREIN FINE PARTICLES OF DIELECTRIC LIQUID-SOLUBLE FILLER MATERIAL

ELECTRICAL CAPACITOR

DRILL

Electrical condenser prodn

Impregnated wound capacitor

... 1. An impregnated wound capacitor with a dielectric which is formed by at least one plastics film, one surface of which is rougher than the other surface, and with at least one electrode which is formed by metallisation of one side of this plastics film or another plastics film, wherein at least the film serving as the dielectric has a space factor of between 4 % and 20 %, preferably between 8 % and 20 %, characterized in that the space factor is defined in the following manner : 10 layers of the film are placed on top of one another and subjected to a pressure of 0.2 N/mm**2 ; the height of this compressed stack is measured : this is the measured value W1 ; independently thereof there is measured using a weight the height which the stack would have if no air were entrapped therein ; this measured value is W2 ; the space factor (in %) is then given by see diagramm : EP0045397,P3,F1 in that this film consists of a material which in the unwound state, after being left in the impregnating ...

Elektrische Kondensatoren

Verfahren zur Herstellung von wachsimpraegnierten Papierwickelkondensatoren

DIELEKTRISCHE FLUESSIGKEITEN

ELEKTRISCHER KONDENSATOR

Impregnated wound capacitor

Double sided metallised paper tapes are used, the tapes themselves between short circuit metallised layers are not exposed to an electric field. Plastic film acts as dielectric with the impregnant. The metallising is such that when the paper tape is wound that on its convex side has a rougher surface than that on the concave side. Paper marketed under the trade name "Satinagegrade A-C" is used. After winding, the capacitor is annealed to shrink the plastic film and it is then imprengated.

Verfahren zum Herstellen eines Leistungskondensators

Verfahren zum Herstellen eines Leistungskondensators

HOCHSPANNUNGSKONDENSATOR

Improvements in Electrical Capacitor and method of making the same

... 1,169,039. Capacitors. GENERAL ELECTRIC CO. 26 April, 1967 [27 May, 1966], No. 19304/67. Heading H1M. The dielectric material in a capacitor comprises a synthetic resin film which includes particulate aluminium oxide, having a particle size less than 1 micron preferably 0À1 to 0.3 microns, incorporates into the film before or after it has been formed. Optionally a spacer such as kraft paper may also be present. The synthetic resin may be polypropylene or polycarbonate, and the capacitor may be wound or stacked. Wound capacitors may be impregnated with halogenated hydrocarbons, mineral oil, polybutene, silicone oil or castor oil, or with a liquid which may be solidified by curing.

Improvements in or relating to self-sealing electric condensers

... 876,119. Electric capacitors. BOSCH G.m.b.H., ROBERT. March 4, 1958 [March 16, 1957], No. 6854/58. Class 37. A self-sealing electric capacitor comprises vapour deposited, metallized layers on an impregnated paper base between two layers impermeable to the impregnant. At least one plate may have part surfaces connected by way of fusible bridges such that only the area of the plates enclosing the fusible bridges is protected by a protective layer from the action of the impregnant, which may be a chlorinated diphenyl normally leaving conductive residues on breakdown of the insulation. In an embodiment of the first type paper strips 10, Fig. 1, carry metal plates 11, paper strips 12 separating strips 10, between which are impregnants 13. The metal plates 11 are not directly vapourdeposited on to strips 10 but are sandwiched between two thin protective layers 14, 15 impermeable to the passage of the impregnant. A lacquer, e.g. nitrocellulose, ethylcellulose, or acetyl-cellulose, with melamine ...

IMPREGNATED CAPACITOR MADE OF FOILS

Improvements in or relating to electrical coudensers

... 529,375. Condensers. SPORING, P. A., STEPHAN, F. C., and TELEGRAPH CONDENSER CO., Ltd. May 2, 1939, No. 13080: [Class 37] A condenser housing is hermetically sealed and contains, under pressure, a low-boiling liquid dissolved in an inert non-volatile liquid such as transformer oil. Suitable low-boiling liquids are propane, isobutane, cyclopropane, cyclobutane, propylene, butene-1, ethyl or methyl fluoride or chloride, isopropyl fluoride difluoro-monochloro-methane, difluoro-dichloromethane, trifluoro-methane, trichloro-monofluoro-methane or trifluoro monochlor-ethylene. Reference has been directed by the Comptroller to Specification 432,284.

Improvements in or relating to paper insulation for electric cables or capacitors

... 688,028. Impregnating for electric insulation; paper. DUSSEK BROS. & CO., Ltd. Sept. 11, 1950. (Sept. 14, 1949] No. 23748/49. Classes 96 and 140. A process for the manufacture of paper insulation for electric cables and capacitors of the type comprising a paper dielectric impregnated with a suitable material comprises introducing into the paper at some stage during its manufacture, or at some stage during its preparation for use, e.g. up to 2 per cent of one or more hydrogen-absorbing organic compounds, preferably solid at room temperature, which compounds are soluble in the subsequently introduced impregnating material and which do not bring about any substantial deterioration.in the power factor of the material. The hydrogen-absorbing compound may be an olefinic or acetylenic compound, or may be naphthalene, and may be introduced into the paper in the beater in the form of an aqueous dispersion, or may be introduced into the paper web as a solution in a volatile solvent which is subsequently ...

OIL-FILLED TRANSFORMER

... 1452766 Transformers and inductors MATSUSHITA ELECTRIC INDUSTRIAL CO Ltd 26 Oct 1973 [31 Oct 1972 (2)] 50048/73 Heading HIT A transformer comprises a core-coil assembly the coil 3 thereof having its surfaces surrounded by a layer 8 of porous material and the coil and porous layer being impregnated with an insulating oil, a casing 1 of electrically insulating material housing the core-coil assembly, a passage 4 extending from the coil through the porous layer to the outside of the casing and a substantially impervious layer 9 of plastics material filling the space between the core-coil assembly, the passage and the casing. The coils 3 and passage 4 are dipped in an epoxy or phenolic solution containing a suspension of CaCO 3 to leave a coating which becomes the porous layer 8 on curing. Alternatively layer 8 may be formed from a material such as silicone rubber whose rate of change of viscosity during curing is zero or positive. The coils 3 and layer 8 may be vacuum impregnated with oil ...

ELECTRIC CAPACITORS

Improvements relating to the generation of high voltage heavy current pulses

... 833,124. Dielectric materials. BRITISH INSULATED CALLENDER'S CABLES Ltd. Jan. 13, 1959 [Jan. 14, 1958], No. 1347/58. Drawings to Specification. Class 37. [Also in Group XL (c)] In a high voltage heavy current pulse generator of the type in which a capacitor is slowly charged from a D.C. supply and rapidly discharged through a load, (see Group XL (c)), the capacitor is castor oil impregnated and insulated with Kraft insulating paper and at its peak voltage is subjected to an electrical stress of at least 85 volts/micron.

Metallized polypropylene film capacitor

A wound film capacitor of metallized polypropylene film comprising a wound body having layers of polypropylene film 10, 11 and metal layers 12, 13 is impregnated with an electronegative gas 16 as an insulant between the metallized polypropylene film layers. The wound capacitor body, which works substantially as a dry film capacitor, is thence immersed in a vegetable oil coolant 14, 15 within a capacitor can (not shown). This construction is found to exhibit superior properties as regards electrical stability and corona starting voltage. ...

VERFAHREN ZUR HERSTELLUNG EINES FOLIENWICKEL- KONDENSATORS

Electrical condenser

PROCEDURE FOR THE PRODUCTION OF A FOIL WINDING OF CONDENSER

OIL IMPREGNATED CAPACITOR WITH PLASTIC FILM DIELECTRIC

OIL EMPREGNATED CAPACITOR WITH PLASTIC FILM DIELECTRIC

IMPREGNATED CAPACITOR FOIL

METHOD OF MANUFACTURING HIGH VOLTAGE ELECTRICAL CAPACITOR AND CAPACITOR THUS OBTAINED

Electric condenser and its method for realization

Condenser for very low temperatures

CONDENSATEUR COMPOSE ENTIEREMENT DE FEUILLES IMPREGNEES

... a. Procédé de fabrication de condensateurs à films spiralés sans couches intermédiaires de papier, et condensateurs fabriqués par ce procédé. On forme, en utilisant des films et feuilles lisses, avec deux électrodes et un diélectrique, comprenant au moins un film de matière plastique étiré, en enroulement qu'on imprègne ensuite. b. Afin d'obtenir les interstices microscopiques nécessaires pour l'imprégnation entre les films ou feuilles adjacents, on porte l'enroulement 4 à une température au moins aussi élevée que la température nécessaire pour rétrécir au moins un film étiré 2 adjacent à au moins un autre film 1 qui ne rétrécit pas ou pas autant à la température en question, et on maintient l'enroulement 4 à cette température jusqu'à ce que le film ou la feuille non ou moins rétréci se plisse. c. Permettant de réduire le volume des condensateurs, ce procédé offre de grands avantages pour la miniaturisation, tout en étant réalisable avec l'outillage conventionnel pour la formation des enroulements ...

CONDENSATEUR A HAUTE TENSION

CONDENSATEUR A HAUTE TENSION, SANS HUILE OU GAZ D'ISOLATION. LES COUCHES DIELECTRIQUES DANS LES ELEMENTS DE CONDENSATEUR A SONT IMPREGNEES AVEC UNE RESINE SYNTHETIQUE ET LES ELEMENTS DE CONDENSATEUR SONT EGALEMENT ISOLES AVEC UNE RESINE SYNTHETIQUE, PAR IMPREGNATION DU MATERIAU ISOLANT B, C AUTOUR DES ELEMENTS DE CONDENSATEUR AVEC UNE RESINE SYNTHETIQUE, DES PASSAGES 10 POUR L'AIR ETANT MENAGES AXIALEMENT DANS LA COUCHE ISOLANTE QUI ENTOURE LES ELEMENTS DE CONDENSATEUR.

ELECTRIC CONDENSER HAS REGENERATION AND PROCEEDED FOR SA MANUFACTURE

IMPROVEMENTS IN OR RELATING TO ELECTRICAL CAPACITORS

Electrical capacitor with metallised plastic film

Condenser of power

La présente invention concerne un condensateur de puissance du type constitué par au moins un élément capacitif obtenu par bobinage d'au moins deux films diélectriques métallisés. Dans ce cas, le film diélectrique est constitué par un film plastique, l'élément capacitif (C) est aplati de manière à former un élément plat présentant une épaisseur garantie et l'élément plat est imprégné par un diélectrique liquide.

METHOD FOR MANUFACTURING DIELECTRIC SUBSTRATE, AND METAMATERIAL

Provided in the present invention are a method for manufacturing a dielectric substrate and a metamaterial having applied the dielectric substrate. For acquisition of the dielectric substrate having a predetermined dielectric constant and an enhanced material, the present invention employs a method of adding a ceramic fiber material to the dielectric substrate, because, relatively speaking, the ceramic fiber material has a great dielectric constant and mechanical performance, so when the ceramic fiber material is added to an organic resin substrate, the mechanical strength and dielectric constant thereof will be improved. The present invention employs a sol-gel technique to prepare a precursor solution for use in manufacturing the ceramic material, and because the sol-gel technique provides the manufacturing of the ceramic material with a greater material selectivity, thus facilitating the acquisition of the dielectric substrate having the appropriate dielectric constant and reinforced ...

Hochspannungsgeraet mit fluessigem Isolator

IMPRAEGNIERTER ELEKTRISCHER WICKELKONDENSATOR

RAUHE ELEKTROISOLIERFOLIE AUS POLYPROPYLEN UND VERFAHREN ZU IHRER HERSTELLUNG

Insbesondere Bariumtitanat enthaltendes Dielektrikum fuer Kondensatoren

PROCESS FOR PRODUCING A ROUGH ELECTRICALLY INSULATING FOIL OF POLYPROPYLENE

HIGH-TENSION CAPACITOR

Electrical capacitor

... 1,061,628. Capacitors. P. R. MALLORY & CO. Inc. Aug. 4, 1964 [Aug. 21, 1963], No. 30836/64. Heading HIM. A capacitor comprises electrodes 11, 12 of filmforming metal having dielectric oxide films 17, 18 formed thereon and a second dielectric material 21 in contact with the oxide layers filling imperfections in the surface thereof. The filmforming metal may be tantalum, aluminium, niobium, hafnium or zirconium and the oxide coating may be porous or non-porous. One electrode need not be of film-forming metal. The co-operating dielectric material may be applied to the oxide layer as a powder, or in a solvent which leaves a film on evaporation or as a cast film. Heat is then applied to soften or fuse the co-operating dielectric material and mechanical pressure applied to a stack of treated electrodes to integrate the layers. The hotpressing takes place under vacuum. After cooling leads are attached and the capacitor encapsulated. Alternatively, to form a wound -capacitor, the co-operating dielectric ...

ELECTRICAL CAPACITORS

... 1360236 Capacitors IMPERIAL CHEMICAL INDUSTRIES Ltd 30 March 1972 [23 April 1971] 11012/71 Heading H1M [Also in Division B5] In a wound impregnated capacitor the dielectric spacer comprises a film of thermoplastic material having dispersed therein, and forming projections on at least one surface thereof, from 0.01 to 1% by weight of an inert particulate insulating material having an average particle diameter of from 1 to 5 microns.

Method of manufacturing ceramic electronic component, ceramic electronic component, and wiring board

A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.

Nanolithographic method of manufacturing an embedded passive device for a microelectronic application, and microelectronic device containing same

A method of manufacturing an embedded passive device for a microelectronic application comprises steps of providing a substrate ( 110, 210, 310 ), nanolithographically forming a first section ( 121, 221, 321 ) of the embedded passive device over the substrate, and nanolithographically forming subsequent sections ( 122, 222, 322 ) the embedded passive device adjacent to the first section. The resulting embedded passive device may contain features less than approximately 100 nm in size.

Z-directed pass-through components for printed circuit boards

A Z-directed signal pass-through component for insertion into a printed circuit board while allowing electrical connection from external surface conductors to internal conductive planes or between internal conductive planes. The Z-directed pass-through component is mounted within the thickness of the PCB allowing other components to be mounted over it. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body.

Multilayer capacitor

A multilayer capacitor which can control ESR in a wide frequency band is provided. In a multilayer capacitor 1 , inner electrodes 8 a , 8 b oppose each other as different polarities through a dielectric layer 7 in a capacitance unit 10 , inner electrodes 8 c to 8 f oppose each other as different polarities through dielectric layers 7 in ESR control units 11 A, 11 B, and the inner electrodes 8 a, 8 b of the capacitance unit 10 connected to the outer electrodes 3, 4 and the inner electrodes 8 c, 8 f of the ESR control units 11 A, 11 B connected to the outer electrodes 3, 4 are kept from opposing each other as different polarities through the dielectric layer 7 at boundaries between the capacitance unit 10 and the ESR control units 11 A, 11 B.

Multilayer ceramic electronic component

A multilayer ceramic electronic component that is small, that has high electrical strength, and that is resistant to separation between ceramic layers includes a ceramic sintered body having a substantially rectangular parallelepiped shape and a plurality of first and second internal electrodes. The plurality of first and second internal electrodes are alternately arranged so as to face each other. The first and second internal electrodes are parallel or substantially parallel to first and second major surfaces. The first and second internal electrodes are exposed to at least one of the fifth and sixth surfaces and are not exposed to the third or fourth surface. No bends exist in any of the ends of each of the first and second internal electrodes adjacent to the third and fourth surfaces.

Chip type laminated capacitor

There is provided a chip type laminated capacitor including: a ceramic body formed by laminating a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 μm or less; first and second outer electrodes; a first inner electrode having one end forming a first margin together with one end surface of the ceramic body at which the second outer electrode is formed and the other end leading to the first outer electrode; and a second inner electrode having one end forming a second margin together with the other end surface of the ceramic body at which the first outer electrode is formed and the other end leading to the second outer electrode, wherein the first and second margins have different widths under a condition that they are 200 μm or less.

Energy storage cell and energy storage module

An energy storage cell includes an energy storage part for storing electric charges, a container for housing the energy storage part, and a pair of electrode terminals connected to the energy storage part and exposed to the outside of the container. The container is formed to have a thick polygonal outer shape and a groove part linearly extending in a direction perpendicular to a thickness direction is provided in each of a pair of mutually facing side surfaces of the polygonal shape. Each of the electrode terminals includes a base end part connected to a corresponding polarity of the energy storage part in the container and an exposed part exposed to the outside of the container, and the exposed part is formed along an inner side of the groove part.

Thin-Film Capacitor

A thin-film capacitor and a method for making the thin-film capacitor having a structure that can prevent vertical stress acting on outer connecting terminals, such as bumps, from concentrating on electrode layers, and capable of easily increasing the equivalent series resistance to a desired value. The thin-film capacitor includes a substrate, a capacitor unit disposed above the substrate and composed of at least one dielectric thin film and two electrode layers, a protective layer covering at least part of the capacitor unit, a lead conductor electrically connected to one of the electrode layers of the capacitor unit, and a bump disposed above the lead conductor. The lead conductor includes a connecting part disposed in an opening in the protective layer and electrically connected to one of the electrode layers of the capacitor unit, and a wiring part extending over the protective layer. The bump is disposed above the wiring part. 1. A thin-film capacitor comprising:a substrate;a capacitor unit disposed above the substrate and including at least one dielectric thin film and two electrode layers;a protective layer covering at least part of the capacitor unit;a lead conductor electrically connected to one of the electrode layers of the capacitor unit; andan outer connecting terminal disposed above the lead conductor,wherein the lead conductor includes a connecting part disposed in an opening in the protective layer and electrically connected to one of the electrode layers of the capacitor unit, and a wiring part extending over the protective layer; and the outer connecting terminal is disposed above the wiring part;at least one sublayer of the protective layer is an organic insulator;the wiring part is connected to a plurality of connecting parts;the wiring part has at least one bent portion; andthe wiring part includes a first conductor line and a second conductor line connected to the first conductor line via the bent portion, and the first conductor line and the ...

Multilayer ceramic electronic component and fabrication method thereof

A multilayer ceramic electronic component includes: a ceramic main body; a plurality of internal electrodes laminated within the ceramic main body; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 μm or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a width direction is Tc and a thickness of the external electrodes at a lateral edge of a printed surface region of the internal electrodes is T 1 , 0.5≦|T 1 /Tc|≦1.0 is satisfied.

Capacitor Assembly For A Mass Spectrometer

A capacitor assembly ( 1 ) for measuring the level of radio frequency voltage in a mass spectrometer. The assembly ( 1 ) includes an RF sensing capacitor ( 2 ) with first and second capacitor plates ( 3, 4 ), a rectifying circuit ( 5 ) and a vacuum housing feedthrough ( 6 ), all of which are mounted within a vacuum enclosure of the mass spectrometer. The first capacitor plate ( 3 ) is adapted for connection to a voltage source and mounted within the enclosure by first insulating spacers ( 31 ). The second capacitor plate ( 4 ) is nested within the first insulating spacers ( 31 ) and mounted within the enclosure by second insulating spacers ( 41 ). The rectifying circuit ( 5 ) is electrically connected to the second capacitor plate ( 4 ) and to the vacuum housing feedthrough ( 6 ).

CASE MOLD TYPE CAPACITOR

A case mold type capacitor is formed of multiple metalized film capacitors connected together in parallel and rigidly accommodated with molding resin within a case. The multiple metalized film capacitors are divided into a first block and a second block, and P-poles of each block confront each other, and N-poles thereof also confront each other. Bus-bars including a connection terminal for external connection at an end are connected to respective P-poles and N-poles of each block. The bus-bars connected to the P-poles are coupled together, and the bus-bars connected to the N-poles are coupled together. Each one of the bus-bars includes a section located on the opening side of the case with respect to the blocks. The bus-bars connected to the P-poles overlap in part, and the bus-bars connected to the N-poles also overlap in part. 1. A case mold type capacitor comprising:a first block including a metalized film capacitor that has a P-pole and an N-pole;a first P-pole bus-bar connected to the P-pole of the metalized film capacitor of the first block, and including a first P-pole terminal at an end thereof for external connection;a first N-pole bus-bar connected to the N-pole of the metalized film capacitor of the first block, and including a first N-pole terminal at an end thereof for external connection;a second block including a metalized film capacitor that has a P-pole and an N-pole;a second P-pole bus-bar connected to the P-pole of the metalized film capacitor of the second block, and including a second P-pole terminal at an end thereof for external connection;a second N-pole bus-bar connected to the N-pole of the metalized film capacitor of the second block, and including a second N-pole terminal at an end thereof for external connection;a case including an opening at an upper section and accommodating the first block and the second block; andmolding resin embedding the first block, the second block, the first P-pole bus-bar, the first N-pole bus-bar, the second ...

Electronic component

An electronic component includes a laminate including a plurality of insulating layers that are laminated on each other. A capacitor conductor is embedded in the laminate and includes an exposed portion exposed between the insulating layers at a predetermined surface of the laminate. An external electrode is provided on the predetermined surface by direct plating so as to cover the exposed portion. An outer edge of the external electrode is spaced away from the exposed portion by about 0.8 μm or more.

Capacitors and semiconductor devices including the same

A capacitor includes a lower electrode having a curved surface, a first seed on a sidewall of the lower electrode, which the first seed includes a metal silicide and has a shape corresponding to the curved surface of the lower electrode, a dielectric layer on the lower electrode, the dielectric layer covering the first seed, and an upper electrode on the dielectric layer.

Leadless Multi-Layered Ceramic Capacitor Stacks

A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode. 1. A capacitor stack comprising:multilayered ceramic capacitors wherein each multilayered ceramic capacitor of said multilayered ceramic capacitors comprises:first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode of said first electrodes and each adjacent second electrode of said second electrodes wherein said first electrodes have a first polarity and terminate at a first side of said multilayered ceramic capacitor and said second electrodes have a second polarity and terminate at a second side of said multilayered ceramic capacitor;a first transient liquid phase sintering conductive layer on said first side and in electrical contact with each said first electrode; anda second transient liquid phase sintering conductive layer on said second side and in electrical contact with each said second electrode.2. The capacitor stack of further comprising a conductive layer between said first side and said first transient liquid phase sintering conductive layer.3. The capacitor stack of wherein said first transient liquid phase sintering conductive layer comprises at least one low melting point metal selected from indium claim 2 , tin claim 2 , antimony claim 2 , bismuth claim 2 , cadmium claim 2 , zinc claim 2 , gallium claim 2 , tellurium claim 2 , mercury claim 2 , ...

Electronic component

A multilayer ceramic capacitor includes flat-shaped inner electrodes that are laminated. An interposer includes an insulating substrate that is larger than contours of the multilayer ceramic capacitor. A first mounting electrode that mounts the multilayer ceramic capacitor is located on a first principal surface of the insulating substrate, and a first external connection electrode for connection to an external circuit board located on a second principal surface. The multilayer ceramic capacitor is mounted onto the interposer in such a way that the principal surfaces of the inner electrodes are parallel or substantially parallel to the principal surface of the interposer, that is, the first and second principal surfaces of the insulating substrate.

ELECTRONIC COMPONENT WITH TERMINAL STRIPS

An electronic component with terminal strips joined to end faces of external electrodes via a solder is characterized in that two plate-like supports of each terminal strip are formed by bending two plate-like parts projecting outward in a line-symmetrical manner from both side edges of a plate-like leg in the width direction such that at least tips of the thickness surfaces on the electronic component sides of the two plate-like parts are positioned below an external electrode of the electronic component, and the electronic component is supported from below by the tips of the thickness surfaces on the electronic component sides of the four plate-like supports. Slipping of the electronic component from both terminal strips due to melting of the solder can be suppressed in a reliable manner. 1. An electronic component with terminal strips , which comprises an electronic component having external electrodes on its opposing ends , as well as a terminal strip joined to each of the external electrodes , and which is configured to mount the electronic component onto a board or other mating part by both terminal strips , wherein:each of the terminal strips has a plate-like joint being joined via a solder to an end face of each of the external electrodes, a plate-like leg continuing from the plate-like joint, a plate-like mounting part continuing from the plate-like leg, and two plate-like supports continuing from the plate-like leg;the two plate-like supports are formed by bending inwardly two plate-like parts projecting in a line-symmetrical manner from both side edges of the plate-like leg such that at least a tip of a thickness surface on the electronic component side of each plate-like part is positioned below the electronic component; andthe electronic component is supported from below by at least the tips of the thickness surfaces on the electronic component sides of the four plate-like supports.2. An electronic component with terminal strips according to claim 1 , ...

DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR INCLUDING THE SAME

A dielectric ceramic composition may include a base material main ingredient and an accessory ingredient. The accessory ingredient contains one or more selected from a group consisting of oxides and carbonates of one or more elements among Bi, Li, and Cu. When the accessory ingredient contains Bi, a content of Bi may be 0.1 to 1.0 part by mole, based on 100 parts by mole of the base material main ingredient, when the accessory ingredient contains Li, a content of Li may be 0.1 to 1.0 part by mole, based on 100 parts by mole of the base material main ingredient, and when the accessory ingredient contains Cu, a content of Cu may be 0.1 to 1.0 part by mole, based on 100 parts by mole of the base material main ingredient. 1. A dielectric ceramic composition comprising a base material main ingredient and an accessory ingredient ,wherein the accessory ingredient contains one or more selected from a group consisting of oxides and carbonates of one or more elements among Bi, Li, and Cu, andwhen the accessory ingredient contains Bi, a content of Bi is 0.1 to 1.0 part by mole, based on 100 parts by mole of the base material main ingredient,when the accessory ingredient contains Li, a content of Li is 0.1 to 1.0 part by mole, based on 100 parts by mole of the base material main ingredient, andwhen the accessory ingredient contains Cu, a content of Cu is 0.1 to 1.0 part by mole, based on 100 parts by mole of the base material main ingredient.2. The dielectric ceramic composition of claim 1 , wherein the base material main ingredient comprises one or more selected from a group consisting of BaTiO claim 1 , (BaCa) (TiCa)O(0≦x≦0.3 and 0≦y≦0.1) claim 1 , (BaCa)(TiZr)O(0≦x≦0.3 and 0≦y≦0.5) claim 1 , and Ba(TiZr)O(0 Подробнее

Solder column grid array capacitors

A grid array capacitor can be used to physically and electrically couple an integrated circuit (IC) package to a printed circuit board (PCB). The grid array capacitor includes an inner conductor and an inner dielectric coaxially surrounding the inner conductor. A secondary conductor can be located to surround, in a coaxial orientation, the inner dielectric. Both the inner conductor and the secondary conductor can be electrically connected to the IC package and to the PCB. In certain applications, the structure of the inner conductor, inner dielectric, and secondary conductor can provide capacitance used to decouple electronic circuits.

MULTILAYER CERAMIC ELECTRONIC COMPONENT

A multilayer ceramic capacitor includes a laminated body including laminated ceramic layers, and first and second internal electrodes extending along interfaces between the ceramic layers. External electrodes are located on outer surfaces of the laminated body. Phosphor is disposed on portions of outer surfaces of the laminated body containing no external electrodes. 1. A multilayer ceramic electronic component comprising:a laminated body including a plurality of ceramic layers laminated, and internal electrodes extending along interfaces between the plurality of ceramic layers; andan external electrode on an outer surface of the laminated body; whereina phosphor is disposed on a portion of an outer surface of the laminated body on which the external electrode is not located.2. The multilayer ceramic electronic component according to claim 1 , wherein the phosphor comprises at least one of an oxide claim 1 , an oxynitride claim 1 , and a nitride.3. The multilayer ceramic electronic component according to claim 1 , wherein the plurality of ceramic layers are dielectric ceramic layers.4. The multilayer ceramic electronic component according to claim 1 , wherein the phosphor comprises a perovskite-type compound.5. The multilayer ceramic electronic component according to claim 4 , wherein the phosphor contains claim 4 , as a main constituent claim 4 , a perovskite-type compound represented by ABO claim 4 , and contains R as an additive component claim 4 , A contains at least one of Ba claim 4 , Sr claim 4 , and Ca claim 4 , B contains at least one of Ti claim 4 , Zr claim 4 , Hf claim 4 , Al claim 4 , and Sn claim 4 , and O represents oxygen; andR contains at least one of Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Y.6. The multilayer ceramic electronic component according to claim 4 , wherein the internal electrodes contain a non-precious metal.7. The multilayer ceramic electronic component according to claim 4 , wherein the external electrode contains a non- ...

HIGH-VOLTAGE CAPACITOR

A high-voltage capacitor includes a gas-tight enclosure containing interleaved electrodes. The dielectric of the capacitor is a pressurized gas at a pressure of at least 6 bar, and preferably 10 or 15 bar. In order to withstand this level of internal pressure, the insulating body section of the capacitor may be formed of a high-strength polymeric material. 1. A high-voltage capacitor comprising a gas-tight enclosure , the gas-tight enclosure containing a gas dielectric and at least two capacitor electrodes , wherein a pressure of the gas dielectric in the gas-tight enclosure is at least 6 bar.2. Method of manufacturing a high-voltage capacitor comprising a gas-tight enclosure , the gas-tight enclosure containing a gas dielectric and at least two capacitor electrodes , wherein a pressure of the gas dielectric in the gas-tight enclosure is at least 6 bar , the method comprising assembling the gas-tight enclosure and filling the gas-tight enclosure with the gas dielectric to the said pressure of at least 6 bar.3. A high-voltage capacitor according to claim 1 , wherein the gas-tight enclosure comprises an insulating body section and two end caps.4. A high-voltage capacitor according to claim 3 , wherein the insulating body section is made at least partially of a polymeric material.5. A high-voltage capacitor according to claim 4 , wherein the polymeric material is PEEK and/or wherein the polymeric material is reinforced with reinforcement fibres.6. A high-voltage capacitor according to claim 1 , wherein the pressure is at least 10 bar claim 1 , or at least 15 bar.7. A high-voltage capacitor according to claim 1 , wherein the gas-tight enclosure comprises a substantially cylindrical chamber having an axial length of between 25 mm and 200 mm and/or a diameter of between 35 mm and 150 mm.8. A high-voltage capacitor according to claim 1 , wherein the breakdown voltage of the capacitor is at least 10 kV and/or the capacitance of the capacitor is between 5 pF and 5000 pF.9. A ...

DIELECTRIC CERAMIC COMPOSITION, STACKED CERAMIC CAPACITOR USING THE SAME, AND METHOD OF MANUFACTURING THE SAME

A stacked ceramic capacitor that includes a ceramic body formed by stacking dielectric ceramic layers and internal electrodes mainly composed of Ni; and an external electrode formed on an outer surface of ceramic body. The dielectric ceramic layers are formed by using a dielectric ceramic composition that includes a main ingredient expressed by (KNaLiM2)(NbTaMgM4)O, where M2 is at least one of Ca, Sr and Ba, M4 is at least one of Zr, Hf and Sn, and a, b, c, d, w, x, y, and z satisfy predetermined relationships; and includes 2 to 15 molar parts of Mn with respect to 100 molar parts of a total content of Nb, Ta, Mg, and M4. 1. A dielectric ceramic composition comprising:{'sub': a', 'b', 'c', 'd', 'w', 'x', 'y', 'z', '3, 'claim-text': M2 is at least one of Ca, Sr and Ba,', 'M4 is at least one of Zr, Hf and Sn,', 'w+x+y+z=1,', '0.07≦a≦0.92,', '0≦b≦0.81,', '0≦c≦0.09,', '0.57≦a+b+c≦0.95,', '0.1≦d≦0.4,', '0.95≦a+b+c+d≦1.05,', '0.73≦w+x≦0.93,', '0≦x/(w+x)≦0.3,', '0.02≦y≦0.07, and', '0.05≦z≦0.2; and, 'a main ingredient expressed by (KNaLiM2)(NbTaMgM4)O, where'}2 to 15 molar parts of Mn with respect to 100 molar parts of a total content of Nb, Ta, Mg, and M4.2. A stacked ceramic capacitor comprising:a ceramic body including a plurality of stacked dielectric ceramic layers and a plurality of internal electrodes comprising Ni along an interface between said dielectric ceramic layers; andan external electrode on an outer surface of said ceramic body, wherein{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'said dielectric ceramic layers comprise the dielectric ceramic composition as recited in .'}3. A method of forming a stacked ceramic capacitor , the method comprising:forming a plurality of ceramic green sheets from a dielectric ceramic composition;forming an internal electrode patterns comprising Ni on respective ceramic green sheets of the plurality of ceramic green sheets;stacking the plurality of ceramic green sheets such that the internal electrode patterns are at an ...

Multilayer ceramic capacitor

A multilayer ceramic capacitor includes a laminated body including an inner layer portion including ceramic dielectric layers and internal electrodes, and outer layer portions including ceramic dielectric layers. External electrodes connected to the internal electrodes are provided on both ends of the laminated body. The main constituent of the inner layer portion is a perovskite-type compound represented by ABO 3 . The outer layer portions include first outer layers and second outer layers respectively containing oxides that differ from each other in main constituents, and boundary reaction layers are provided between the first outer layers and the second outer layers. First ceramic dielectric layers outside the boundary reaction layers differ in color from second ceramic dielectric layers inside the boundary reaction layers.

CAPACITOR AND METHOD OF MANUFACTURE THEREOF

An alternating current power capacitor including one or more capacitor bodies (e.g., bobbins) having conductive and dielectric film windings, wherein edges of the conductive film windings define a plane forming at least one capacitor body contact surface, one or more electrodes having one or more electrode contact surfaces and a housing operative to apply compressive force that binds the capacitor body and electrode together so that to maintain uniform electrical and thermal conductive contact throughout a plane parallel to and between the electrode contact surface and capacitor body contact surface. 1200. AC Capacitor () , comprising:{'b': 204', '230', '210, 'at least one capacitor body () having conductive and dielectric film windings and wherein an edge () of the conductive film windings defines a plane normal to a concentric axis (W) of the windings forming at least one capacitor body contact surface ();'}{'b': 206', '208, 'at least one electrode () having at least one electrode contact surface (); and'}{'b': 202', '210', '208, 'a housing () operative to apply compressive force operative to bind the capacitor body contact surface () and the electrode contact surface () together so that to maintain uniform electrical and thermal conductive contact throughout a plane parallel to and between the electrode contact surface and capacitor body contact surface.'}2. The capacitor according to claim 1 , wherein when assembled the electrode contact surface is in contact with over 50% of the winding's edge of the conductive film windings constituting a body contact surface.3. The capacitor according to claim 1 , wherein when assembled the electrode contact surface is in contact with over 75% of the winding's edge of the conductive film windings constituting a body contact surface.4. The capacitor according to claim 1 , wherein when assembled the electrode contact surface is in contact with over 90% of the winding's edge of the conductive film windings constituting a body ...

CHIP PARTS

A chip part is provided that includes a substrate in which an element region and an electrode region are set, an insulating film (a first insulating film and a second insulating film) which is formed on the substrate and which selectively includes an internal concave/convex structure in the electrode region on a surface, a first connection electrode and a second connection electrode which include, at a bottom portion, an anchor portion entering the concave portion of the internal concave/convex structure and which include an external concave/convex structure on a surface on the opposite side and a circuit element which is disposed in the element region and which is electrically connected to the first connection electrode and the second connection electrode. 1. A chip transformer including:a substrate that has an element formation surface;a primary coil formation trench and a secondary coil formation trench that are formed in the substrate by digging down from the element formation surface and that are formed in the shape of a spiral in a plan view when seen in a normal direction perpendicular to the element formation surface;a primary coil that is formed with a first conductive member embedded within the primary coil formation trench; anda secondary coil that is formed with a second conductive member embedded within the secondary coil formation trench.2. The chip transformer described in further including:a first electrode and a second electrode which are disposed on the element formation surface, one end portion of the primary coil connected to the first electrode and an opposite end portion of the primary coil connected to the second electrode; anda third electrode and a fourth electrode which are disposed on the element formation surface, one end portion of the secondary coil connected to the third electrode and an opposite end portion of the secondary coil connected to the fourth electrode.3. A chip transformer described in further including:an insulating film ...

Capacitor component

A capacitor component includes a lamination portion in which first and second internal electrodes are disposed to face each other in a first direction and separated from each other by a dielectric layer, and a body comprising the lamination portion and first and second connection portions disposed on both sides of the lamination portion in a second direction, perpendicular to the first direction, and connected to the first and second internal electrodes. The first and second connection portions each include a metal layer including nickel and disposed on the lamination portion and a ceramic layer disposed on the metal layer, and an average thickness of each of the first and second internal electrodes is 0.4 μm or less.

CAPACITOR AND MANUFACTURING METHOD THEREFOR

A capacitor includes: a semiconductor substrate; at least one trench provided in the semiconductor substrate and formed downward from an upper surface of the semiconductor substrate; a first conductive layer provided above the semiconductor substrate and in the trench; a first insulating layer provided between the substrate and the first conductive layer to isolate the first conductive layer from the substrate; a second conductive layer provided above the r substrate and in the trench, the second conductive layer including a first and a second conductive region that are independent from each other, the first conductive region being electrically connected to the substrate, and the second conductive region being electrically connected to the first conductive layer; and a second insulating layer provided between the first and the second conductive layer to isolate the first conductive region from the first conductive layer and isolate the second conductive region from the substrate. 1. A capacitor , wherein the capacitor comprises:a semiconductor substrate;at least one trench provided in the semiconductor substrate and formed downward from an upper surface of the semiconductor substrate;a first conductive layer provided above the semiconductor substrate and in the trench;a first insulating layer provided between the semiconductor substrate and the first conductive layer to isolate the first conductive layer from the semiconductor substrate;a second conductive layer provided above the semiconductor substrate and in the trench, the second conductive layer comprising a first conductive region and a second conductive region that are independent from each other, the first conductive region being electrically connected to the semiconductor substrate, and the second conductive region being electrically connected to the first conductive layer; anda second insulating layer provided between the first conductive layer and the second conductive layer to isolate the first ...

MULTILAYER CERAMIC ELECTRONIC COMPONENT

A multilayer ceramic electronic component includes a multilayer ceramic electronic component body and a pair of metal terminals. The multilayer ceramic electronic component body includes a multilayer body including laminated ceramic layers and inner electrode layers and first and second outer electrodes provided on both end surfaces of the multilayer body. The metal terminals are connected to the outer electrodes. The inner electrode layers are perpendicular or substantially perpendicular to a mounting surface and include extended portions that extend to the end surfaces and portions of the first and second side surfaces. The distance between ends of the first and second outer electrodes on one of the first and second side surfaces is in a range from about 1.8% to about 31.3% of a length dimension of the multilayer ceramic electronic component in a direction connecting both end surfaces of the multilayer ceramic electronic component body. 1. A multilayer ceramic electronic component comprising: a multilayer body including a plurality of ceramic layers that are laminated and a plurality of inner electrode layers that are laminated, the multilayer body including a first principal surface and a second principal surface that are opposite to each other in a lamination direction, a first side surface and a second side surface that are opposite to each other in a width direction orthogonal or substantially orthogonal to the lamination direction, and a first end surface and a second end surface that are opposite to each other in a length direction orthogonal or substantially orthogonal to the lamination direction and the width direction;', 'a first outer electrode provided on the first end surface, at least a portion of the first side surface, and at least a portion of the second side surface of the multilayer body; and', 'a second outer electrode provided on the second end surface, at least a portion of the first side surface, and at least a portion of second side surface ...

MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON

A multilayer electronic component include a multilayer capacitor including a capacitor body and first and second external electrodes disposed on ends of the capacitor body, respectively; an alumina chip including a chip body and first and second external terminals disposed on ends of the chip body, respectively, the first and second external terminals being in contact with the first and second external electrodes, respectively; a first plating layer covering the first external electrode and the first external terminal; and a second plating layer covering the second external electrode and the second external terminal. The first and second plating layers each include a nickel plating layer a tin plating layer disposed on the first external electrode and the first external terminal and on the second external electrode and the second external terminal, respectively. 1. A multilayer electronic component comprising:a multilayer capacitor including a capacitor body and first and second external electrodes disposed on ends of the capacitor body, respectively;an alumina chip including a chip body and first and second external terminals disposed on ends of the chip body, respectively, the first and second external terminals being in contact with the first and second external electrodes, respectively;a first plating layer covering the first external electrode and the first external terminal; anda second plating layer covering the second external electrode and the second external terminal.2. The multilayer electronic component of claim 1 , wherein the first plating layer includes a first nickel plating layer disposed on the first external electrode and the first external terminal and a first tin plating layer disposed on the first nickel plating layer claim 1 , and the second plating layer includes a second nickel plating layer disposed on the second external electrode and the second external terminal and a second tin plating layer disposed on the second nickel plating layer.3. ...

MULTILAYER CERAMIC ELECTRONIC COMPONENT

A multilayer ceramic electronic component includes an electronic component main body including a first outer electrode disposed on a first side surface of a multilayer body, and a second outer electrode spaced apart from the first outer electrode and disposed on the first side surface, a first metal terminal connected to the first outer electrode, a second metal terminal connected to the second outer electrode, and an exterior material. The first side surface or a second side surface opposes a mounting surface of a mounting substrate, first and second inner electrode layers are disposed perpendicularly or substantially perpendicularly to the mounting surface, and a portion of the first side surface, the first and second outer electrodes, and a portion of the first and second metal terminals are covered with the exterior material. 1. A multilayer ceramic electronic component comprising: a multilayer body including a plurality of dielectric layers that are laminated and a plurality of inner electrode layers that are laminated, and including a first principal surface and a second principal surface opposing each other in a lamination direction, a first side surface and a second side surface opposing each other in a width direction orthogonal or substantially orthogonal to the lamination direction, and a first end surface and a second end surface opposing each other in a lengthwise direction orthogonal or substantially orthogonal to both of the lamination direction and the width direction;', 'a first outer electrode disposed at least on the first side surface and a second outer electrode spaced apart from the first outer electrode and disposed at least on the first side surface; and, 'an electronic component main body includinga first metal terminal connected to the first outer electrode and a second metal terminal connected to the second outer electrode; whereinthe plurality of inner electrode layers include a first inner electrode layer and a second inner electrode ...

FILM CAPACITOR

A film capacitor includes a capacitor element that includes an element body formed of a winding of or a laminate of metallized films and a P pole electrode and an N pole electrode that are respectively formed on opposite end faces of the element body. The film capacitor also includes a P electrode bus bar and an N electrode bus bar that are respectively connected to the P pole electrode and the N pole electrode, and an electrically conductive covering that covers a peripheral surface of the capacitor element with the covering spaced away from at least one of the P pole electrode or the N pole electrode. 1. A film capacitor comprising:a capacitor element including an element body that is formed of a winding of a metallized film or a laminate of metallized films, a positive (P) pole electrode, and a negative (N) pole electrode, the P pole electrode and the N pole electrode being respectively formed on opposite end faces of the element body;a positive (P) electrode lead terminal connected to the P pole electrode;a negative (N) electrode lead terminal connected to the N pole electrode; anda covering that is electrically conductive and covers a peripheral surface of the capacitor element with the covering spaced away from at least one of the P pole electrode or the N pole electrode.2. The film capacitor according to claim 1 , whereinthe covering touches one of the P pole electrode and the N pole electrode and is spaced away from another one of the P pole electrode and the N pole electrode.3. The film capacitor according to claim 2 , whereinthe covering touches the N pole electrode and is spaced away from the P pole electrode.4. The film capacitor according to claim 2 , wherein:the covering extends over to a surface of the one of the P pole electrode and the N pole electrode; anda lead terminal corresponding to the one of the P pole electrode and the N pole electrode among the P electrode lead terminal and the N electrode lead terminal is covered by the covering at a ...

Ceramic electronic component, method of producing the same, and electronic component mounting substrate

A ceramic electronic component includes a ceramic body, a sintered metal film, and a metal terminal. The ceramic body includes internal electrodes. The sintered metal film has a joint surface having a surface roughness Ra of 0.200 μm or less. The sintered metal film is connected to the internal electrodes and formed on a surface of the ceramic body. The metal terminal is jointed to the joint surface.

Surface Mount Multilayer Coupling Capacitor and Circuit Board Containing the Same

The present invention is directed to a surface mount coupling capacitor and a circuit board containing a surface mount coupling capacitor. The coupling capacitor includes a main body containing at least two sets of alternating dielectric layers and internal electrode layers. The coupling capacitor includes external terminals electrically connected to the internal electrode layers wherein the external terminals are formed on a top surface of the coupling capacitor and a bottom surface of the coupling capacitor opposing the top surface of the coupling capacitor. 1. A surface mount coupling capacitor comprising: 'each internal electrode layer including a top edge, a bottom edge opposite the top edge, and two side edges extending between the top edge and the bottom edge that define a main body of the internal electrode layer,', 'each set of alternating dielectric layers and internal electrode layers containing a first internal electrode layer and a second internal electrode layer,'}, 'a main body containing a first set of alternating dielectric layers and internal electrode layers and a second set of alternating dielectric layers and internal electrode layers,'}external terminals electrically connected to the internal electrode layers wherein the external terminals are formed on a top surface of the coupling capacitor and a bottom surface of the coupling capacitor opposing the top surface of the coupling capacitor,wherein the capacitor exhibits an insertion loss of 0.25 dB or less.2. The multilayer coupling capacitor according to claim 1 , wherein the capacitor provides an impedance differential of 100Ω±10%.3. The multilayer coupling capacitor according to claim 1 , wherein at least one of the first internal electrode layer or the second internal electrode layer electrically contacts the external terminal on the top surface of the coupling capacitor and the other internal electrode layer electrically contacts the external terminal on the bottom surface of the coupling ...

HIGH ENERGY DENSITY CAPACITOR WITH MICROMETER STRUCTURES AND NANOMETER COMPONENTS

A high density energy storage system including a giant-colossal dielectric thin film material electrically insulating between two electrodes configured to have increased overlapping surface area. 2. (canceled)3. The system of claim 1 , wherein the through-holes are defined by one or more sets of a hub claim 1 , one or more spokes extending from the hub and one or more rims surrounding the hub and coupled to the hub via the spokes.4. The system of claim 3 , wherein the rims claim 3 , the spokes and the protrusions each have a width of between 0.1976 and 100 micrometers and the hubs each have a radius of between 0.1976 and 100 micrometers.5. The system of claim 4 , wherein the hubs claim 4 , the rims claim 4 , the spokes and the protrusions each have a height of between 0.025 and 10 centimeters.6. The system of claim 1 , wherein the non-conductive film has a thickness of between 10 and 5000 nanometers.7. The system of claim 6 , wherein the non-conductive film is a compound dielectric material of two or more dielectric materials.8. The system of claim 6 , wherein the non-conductive film is a complex dielectric material of two or more dielectric materials.9. The system of claim 6 , wherein the non-conductive film comprises at least one giant-colossal dielectric material and at least one material having a non-giant-colossal dielectric constant.10. The system of claim 6 , wherein the non-conductive film covers the entirety of the first electrode or the second electrode.11. The system of claim 1 , wherein two or more of the capacitor modules are electrically coupled together in series claim 1 , in parallel or both.13. (canceled)14. The capacitor of claim 12 , wherein the through-holes are defined by one or more sets of a hub claim 12 , one or more spokes extending from the hub and one or more rims surrounding the hub and coupled to the hub via the spokes.15. The capacitor of claim 14 , wherein the rims claim 14 , the spokes and the protrusions each have a width of between ...

Electronic component and use thereof

What is specified is an electronic component ( 100 ) comprising a functional body ( 1 ) provided with a reflection structure ( 2 ) wherein the reflection structure ( 2 ) is arranged and designed to reflect radiation that impinges on the electronic component ( 100 ) from outside away from the functional body ( 1 ) and wherein the electronic component ( 100 ) is radiation-passive.

Electronic device including a capacitor

An electronic device includes a capacitor and a passivation layer covering the capacitor. The capacitor includes a first electrode, a dielectric layer disposed over the first electrode and a second electrode disposed over the dielectric layer. An area of the first electrode is greater than an area of the dielectric layer, and the area of the dielectric layer is greater than an area of the second electrode so that a side of the capacitor has a multi-step structure.

Power conversion apparatus

A power conversion apparatus includes a power module, a capacitor unit 23, and a first connection portion 80a. The first connection portion 80a connects a first power conversion circuit portion 31 of the power module and the capacitor unit 23 to each other. The first connection portion 80a includes a first positive electrode bus bar extending portion 83 and a second positive electrode bus bar extending portion 93 which extend along a first module case 61 and a first positive electrode bus bar stretching portion 85 and a second positive electrode bus bar stretching portion 95 which extend in a Z axis direction. The first connection portion 80a includes a first negative electrode bus bar extending portion 84 and a second negative electrode bus bar extending portion 94 which extend along the first module case 61 and a first negative electrode bus bar stretching portion 86 and a second negative electrode bus bar stretching portion 96 which extend in the Z axis direction.

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

An electronic component is provided with: an electronic component body including a top face, a bottom face, a pair of side faces, and a pair of end faces provided with an outside electrode; and a pair of metal terminals individually connected to the pair of outside electrodes of the electronic component body, wherein the metal terminals is electrically and mechanically connected to the outside electrode of the electronic component body, and is also in contact with bottom face of the electronic component. The electronic component requires no jig or a simple jig if any for securing a metal terminal and electronic component body in place. 1. An electronic component comprising:an electronic component element having a top face, a bottom face, a pair of side faces, and a pair of end faces as well as a pair of external electrodes provided on the pair of end faces; anda pair of metal terminals respectively connected to the pair of external electrodes on the electronic component element;wherein each metal terminal is constituted by: a lead terminal whose one end is electrically and mechanically connected to the external electrode on the electronic component element; and a plate-shaped horizontal part to which another end of the lead terminal is connected and which also has a bottom contact part in contact with the bottom face of the electronic component element, wherein the lead terminal includes a part formed between the one end and the other end as a lead facing the external electrode, said lead being capable of undergoing flexural deformation by bending.2. An electronic component according to claim 1 , wherein a center of gravity of the metal terminal is positioned inside the electronic component element as viewed from above.3. (canceled)4. A method for manufacturing an electronic component claim 1 , which is a method for manufacturing an electronic component comprising an electronic component element having a top face claim 1 , a bottom face claim 1 , a pair of side ...

Electrical insulating oil composition having excellent properties in wide temperature range

The present invention provides an electrical insulating oil composition that can maintain breakdown voltage at a high level in a wide temperature range of −50° C. to 30° C., extremely unlikely precipitates as crystals in particular at −50° C., and has excellent properties both at ordinary temperature and low temperature. The insulating oil composition comprises diarylalkanes having 14 carbon atoms (C14) and having 15 carbon atoms (C15), wherein the C14 diarylalkane is 1,1-diphenylethane or a mixture of 1,1-diphenylethane and benzyltoluene and the C15 diarylalkane is 1-phenyl-1-methylphenylethane.

POWER SUPPLY DEVICE AND CAPACITOR

A power supply device converts power supplied from a power source to power to be supplied to a load and supplies the converted power to the load from an output terminal. The power supply device includes a capacitor that includes a case, a first terminal exposed outside the case, and a second terminal exposed outside the case. The first terminal is fixed to a busbar. The busbar electrically connects the first terminal to the output terminal of the power supply device. The second terminal is fixed to an electrically conductive support that receives a reference potential. 1. A power supply device for converting power supplied from a power source to power to be supplied to a load and supplying the converted power to the load from an output terminal , the power supply device comprising:a power converter to convert the power supplied from the power source to the power to be supplied to the load and to output the converted power to the output terminal;a capacitor including a dielectric, two electrodes opposing each other with the dielectric in between, a case accommodating the dielectric and the two electrodes, a first terminal electrically connected to one of the two electrodes and exposed outside the case, and a second terminal electrically connected to the other one of the two electrodes and exposed outside the case, the capacitor being located in a circuit between the power converter and the output terminal;a busbar to which the first terminal is fixed, the busbar electrically connecting the first terminal to the output terminal; andan electrically conductive support to which the second terminal is fixed, the electrically conductive support being configured to receive a reference potential.2. The power supply device according to claim 1 , whereinthe case has a shape of a cylinder having two closed end surfaces,the first terminal is exposed outside the case through one of the end surfaces, andthe second terminal is exposed outside the case through the other one of the ...

LAMINATED ELECTRONIC COMPONENT AND CIRCUIT BOARD FOR MOUNTING THE SAME

A laminated electronic component includes a first capacitor including a first ceramic body, first external electrodes disposed on upper and lower surfaces of the first ceramic body, and second external electrodes disposed apart from the first external electrodes on the upper and lower surfaces of the first ceramic body, and a second capacitor including a second ceramic body, a third external electrode disposed on a lower surface of the second ceramic body, and a fourth external electrode disposed apart from the third external electrode on the lower surface of the second ceramic body, and disposed on the first capacitor and electrically connected to the first capacitor. A current loop passing through the upper surface of the first ceramic body and the lower surface of the second ceramic body is formed. 1. A laminated electronic component , comprising:a first capacitor including a first ceramic body, first external electrodes disposed on upper and lower surfaces of the first ceramic body, and second external electrodes disposed apart from the first external electrodes on the upper and lower surfaces of the first ceramic body; anda second capacitor including a second ceramic body, a third external electrode disposed on a lower surface of the second ceramic body, and a fourth external electrode disposed apart from the third external electrode on the lower surface of the second ceramic body, and disposed on the first capacitor and electrically connected to the first capacitor,wherein a current loop passing through the upper surface of the first ceramic body and the lower surface of the second ceramic body is formed.2. The laminated electronic component of claim 1 ,wherein the current loop is formed in a plane perpendicular to a mounting surface when the laminated electronic component is mounted on a board.3. The laminated electronic component of claim 1 , wherein the first capacitor and the second capacitor are connected in series.4. The laminated electronic component of ...

Power Factor Correction Capacitors

An apparatus includes a case capable of receiving a plurality of capacitive elements, each capacitor element having at least two capacitors, and each capacitor having a capacitive value. The apparatus also includes a cover assembly with a peripheral edge secured to the case. The cover assembly includes, for each of the plurality of capacitive elements, a cover terminal that extends upwardly from the cover assembly generally at a central region of the cover assembly. Each cover terminal is connected to one of the at least two capacitors of the respective one of the plurality of capacitive elements. The cover assembly also includes, for each of the plurality of capacitive elements, a cover terminal that extends upwardly from the cover assembly at a position spaced apart from the cover terminal generally at the central region of the cover assembly. 1. An apparatus comprising:a case capable of receiving a plurality of capacitive elements, each capacitor element having at least two capacitors, each capacitor having a capacitive value; and for each of the plurality of capacitive elements, a cover terminal that extends upwardly from the cover assembly generally at a central region of the cover assembly, wherein each cover terminal is connected to one of the at least two capacitors of the respective one of the plurality of capacitive elements,', 'for each of the plurality of capacitive elements, a cover terminal that extends upwardly from the cover assembly at a position spaced apart from the cover terminal generally at the central region of the cover assembly, wherein each cover terminal at the spaced apart position is connected to another of the at least two capacitors for the respective one of the plurality of elements,', 'a common insulation barrier mounted to the cover assembly, wherein one cover terminal that extends upwardly from the cover assembly generally at the central region of the cover assembly extends through the common insulation barrier, the common ...

Multilayer ceramic capacitor and method of manufacturing the same

A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a plurality of internal electrodes; and first and second side margin portions disposed on end portions of the internal electrodes exposed to the first and second surfaces, wherein each of the first and second side margin portions is divided into a first region adjacent to an outer side surface of the side margin portion and a second region adjacent to the internal electrodes exposed to the first and second surfaces, and a content of magnesium (Mg) contained in the second region is higher than a content of magnesium (Mg) contained in the first region.

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

Provided are a multilayer ceramic electronic component and a method for manufacturing the same, the multilayer ceramic electronic component including a ceramic body including a dielectric layer and an internal electrode, and an external electrode formed on an outer side of the ceramic body and electrically connected to the internal electrode, wherein the internal electrode includes a conductive metal and an additive, and the number of particles of the additive disposed per μmof the internal electrode is in the range of 7 to 21, both inclusive. 1. A multilayer ceramic electronic component comprising:a ceramic body including a dielectric layer and an internal electrode; andan external electrode formed on an outer side of the ceramic body and electrically connected to the internal electrode,{'sup': '2', 'wherein the internal electrode contains a conductive metal and an additive, and the number of particles of the additive disposed inside the internal electrode is in the range of 7 to 21, both inclusive, per μmof the internal electrode.'}2. The multilayer ceramic electronic component of claim 1 , wherein a particle size of the additive is in the range of 5 to 200 nm claim 1 , both exclusive.3. The multilayer ceramic electronic component of claim 1 , wherein the number of particles of the additive per μminside the internal electrode is in the range of 7 to 21 claim 1 , both inclusive claim 1 , throughout the entire internal electrode.4. The multilayer ceramic electronic component of claim 1 , wherein the additive is at least one of a non-metal material and a metal oxide.5. The multilayer ceramic electronic component of claim 1 , wherein the additive is disposed more densely in a central portion than in a boundary portion of the internal electrode.6. The multilayer ceramic electronic component of claim 1 , wherein the internal electrode has connectivity of 80% or more claim 1 , where the connectivity of the internal electrode is defined as a ratio of a length of a portion ...

Composite electronic component, board having the same, and power smoother including the same

A composite electronic component includes a composite body formed by combining a multilayer ceramic capacitor (MLCC) and a tantalum capacitor. The composite electronic component has an excellent acoustic noise reduction effect, low equivalent series resistance (ESR)/equivalent series inductance (ESL), enhanced DC-bias characteristics, and a reduced chip thickness.

Mlcc module and method of manufacturing the same

A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.

CAPACITOR STRUCTURE

This capacitor structure is provided with a capacitor body in which a plurality of wound-type capacitors are housed in a housing, and which is fixed to a fixing object via a fastening tool (a cylindrical member and a fixing bolt). The capacitor structure is configured such that the capacitor body is fixed to the fixing object by inserting the fastening tool into at least one of a gap formed between the outer peripheral surfaces of the wound-type capacitors or gaps formed between the outer peripheral surfaces of the wound-type capacitors and the inner wall of the housing, in a state in which the wound-type capacitors are installed side by side on the floor of the housing. 18.-. (canceled)9. A capacitor structure comprising:a plurality of wound-type capacitors;a housing which houses the plurality of wound-type capacitors; anda fastener which fixes a capacitor body in which the plurality of wound-type capacitors are stored in the housing to a fixing object,wherein, in a state in which the wound-type capacitors are arranged side by side on a bottom of the housing, the capacitor body is configured to be fixed to the fixing object by inserting the fastener into at least one of gaps formed between outer peripheral surfaces of the respective wound-type capacitors or formed between the outer peripheral surfaces of the respective wound-type capacitors and an inner wall of the housing,the housing into which the wound-type capacitors and the fastener are inserted is filled with a resin and the wound-type capacitors are fixed in the housing by the resin, andthe fastener includes:a metallic cylindrical member formed to be longer than an overall length of the wound-type capacitors and inserted into the at least one of the gaps; anda fixing bolt inserted from an outside of the housing into the cylindrical member so as to pass through the cylindrical member and screwed to the fixing object to be fixed.10. The capacitor structure according to claim 9 ,wherein the fastener includes a ...

CAPACITOR DEVICE

To provide a capacitor device capable of preventing thermal interference between a filter capacitor and a plurality of smoothing capacitors. A capacitor device provided in an energization circuit between a power source and a semiconductor module as a power supply device includes a filter capacitor for removing a noise included in a current supplied from a power input terminal, a plurality of smoothing capacitors for smoothing a voltage, and a capacitor case that houses the filter capacitor and the plurality of smoothing capacitors, and a first gap between the filter capacitor and a smoothing capacitor provided at a position closest to the filter capacitor among the plurality of smoothing capacitors is configured to be larger than a second gap between two smoothing capacitors adjacent to each other among the plurality of smoothing capacitors. 1. A capacitor device provided in an energization circuit between a power source and a power supply device , the capacitor device comprising:a filter capacitor for removing a noise included in a current input from a power input terminal;a plurality of smoothing capacitors for smoothing a voltage; anda capacitor case that houses the filter capacitor and the plurality of smoothing capacitors, whereina first gap between the filter capacitor and a smoothing capacitor provided at a position closest to the filter capacitor among the plurality of smoothing capacitors is configured to be larger than a second gap between two smoothing capacitors adjacent to each other among the plurality of smoothing capacitors.2. The capacitor device according to claim 1 , whereinthree or more smoothing capacitors are arranged at a plurality of distances as the plurality of smoothing capacitors, and a minimum value among the plurality of distances is set to a value of the second gap.3. The capacitor device according to claim 1 , further comprisinga discharge resistor substrate provided with a discharge resistor, whereinthe discharge resistor substrate ...

MULTILAYER CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON

A multilayer capacitor and a board having the same mounted thereon are provided. The multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, and first to sixth surfaces, the first internal electrode being exposed through the third surface and the fifth surface and the second internal electrode being exposed through the fourth surface and the sixth surface; first and second side portions disposed on the fifth and sixth surfaces, respectively, of the capacitor body; first and second external electrodes; a first step-compensating portion disposed on a margin portion in a width direction on the second dielectric layer on which the second internal electrode is formed on the first internal electrode; and a second step-compensating portion disposed on another margin portion in the width direction on the first dielectric layer on which the first internal electrode is disposed on the second internal electrode. 1. A multilayer capacitor , comprising:a capacitor body comprising first and second dielectric layers and first and second internal electrodes, and a first surface and a second surface opposing each other, a third surface and a fourth surface connected to the first and second surfaces and opposing each other, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other, the first internal electrode being exposed through the third surface and the fifth surface and the second internal electrode being exposed through the fourth surface and the sixth surface;first and second side portions disposed on the fifth and sixth surfaces, respectively, of the capacitor body;first and second external electrodes respectively disposed on the third and fourth surfaces of the body and respectively connected to the first and second internal electrodes;a first step-compensating portion disposed on a first margin portion in a width direction on the second dielectric layer on which the ...

MULTILAYER CERAMIC ELECTRONIC COMPONENT

A multilayer ceramic electronic component includes a body including a dielectric layer, first and second internal electrodes, a stacked portion including first and second surfaces opposing each other in a stacking direction of the first and second internal electrodes, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other, and a coating layer disposed on the first to sixth surfaces of the stacked portion and having first and second connection portions; and first and second external electrodes connected to the first and second internal electrodes, respectively, and arranged on the third and fourth surfaces of the body, wherein the first and second internal electrodes are respectively connected to the first and second external electrodes through the first and second connection portions. 1. A multilayer ceramic electronic component comprising: a dielectric layer,', 'first and second internal electrodes,', 'a stacked portion including first and second surfaces opposing each other in a stacking direction of the first and second internal electrodes, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other, and', 'a coating layer disposed on the first to sixth surfaces of the stacked portion and having first and second connection portions; and, 'a body, including'}first and second external electrodes respectively arranged on the third and fourth surfaces of the body and connected to the first and second internal electrodes, respectively through the first and second connection portions.2. The multilayer ceramic electronic component according to claim 1 , wherein the coating layer is a single layer.3. The multilayer ceramic ...

MULTILAYER CERAMIC ELECTRONIC COMPONENT

A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and a plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween; and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively, in which the external electrode each include an electrode layer electrically connected to the internal electrodes and a plating layer disposed on the electrode layer, and a thickness of the electrode layer in a cross section of the ceramic body in first and second directions is 10 μm or more. 1. A multilayer ceramic electronic component comprising:a ceramic body including dielectric layers and a plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween, and having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction and connected to the first and second surfaces, and fifth and sixth surfaces opposing each other in a third direction and connected to the first to fourth surfaces; andexternal electrodes disposed on the third and fourth surfaces of the ceramic body in the second direction and electrically connected to the plurality of internal electrodes, respectively, wherein the ceramic body includes an active portion in which capacitance is formed by including the plurality of internal electrodes and cover portions disposed on upper and lower surfaces of the active portion, respectively,wherein a distance from the first surface of the ceramic body to an uppermost layer of the plurality of internal electrodes, or a distance from the second surface of the ceramic body to a lowermost layer of the plurality of internal electrodes, is 20 μm or less,wherein the external electrodes each include an electrode layer electrically connected to the plurality of internal ...

Power converter and capacitor module

A power converter includes a switching circuit and a capacitor module. The capacitor module includes a capacitor element, a capacitor case, an encapsulating resin, and a capacitor bus bar. The capacitor bus bar includes an element connection section, which is connected to the capacitor element inside the encapsulating resin, a terminal connection section, which is connected to a power terminal outside the encapsulating resin, and a power supply connection section, which is connected to power supply wiring outside the encapsulating resin. The power supply wiring is electrically connected to a DC power supply. The capacitor bus bar includes a DC path, which constitutes a current path between the terminal connection section and the power supply connection section. The DC path is exposed to the outside of the encapsulating resin.

Electronic Component Structures with Reduced Microphonic Noise

An electronic device is described wherein the electronic device comprises a substrate with a first conductive metal layer and a second conductive metal layer. A first microphonic noise reduction structure is in electrical contact with the first conductive metal layer wherein the first microphonic noise reduction layer comprises at least one of the group consisting of a compliant non-metallic layer and a shock absorbing conductor comprising offset mounting tabs with a space there between coupled with at least one stress relieving portion. An electronic component comprising a first external termination of a first polarity and a second external termination of a second polarity is integral to the electronic device and the first microphonic noise reduction structure and the first external termination are adhesively bonded by a transient liquid phase sintering adhesive.

High energy density capacitor with high aspect micrometer structures and a giant colossal dielectric material

A high density energy storage system including a giant-colossal dielectric thin film material electrically insulating between two electrodes configured to have increased overlapping surface area.

CAPACITOR COMPONENT

A capacitor component includes an element assembly, a first external electrode, and a second external electrode. The element assembly includes first and second internal electrode layers, a first connecting conductive layer extending along a fifth outer surface of the element assembly and connected to each of the first internal electrode layers, a first covering insulating layer covering the first connecting conductive layer, a second connecting conductive layer extending along a sixth outer surface of the element assembly and connected to each of the second internal electrode layers, and a second covering insulating layer covering the second connecting conductive layer. Only a portion of the first internal electrode layers are extended to the third outer surface and connected to the first external electrode, and only a portion of the internal electrode layers are extended to the fourth outer surface and connected to the second external electrode. 1. A capacitor component comprising: a first outer surface and a second outer surface opposing each other;', 'a third outer surface and a fourth outer surface opposing each other; and', 'a fifth outer surface and a sixth outer surface opposing each other;, 'an element assembly includinga first external electrode disposed on the third outer surface; anda second external electrode disposed on the fourth outer surface; whereinthe element assembly includes a plurality of dielectric layers and a plurality of internal electrode layers alternately laminated in a laminating direction perpendicular or substantially perpendicular to the first outer surface; a plurality of first internal electrode layers electrically connected to the first external electrode; and', 'a plurality of second internal electrode layers electrically connected to the second external electrode; wherein, 'the plurality of internal electrode layers include a first connecting conductive layer extending along the fifth outer surface and connecting to an end ...

COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

A composite electronic component includes an insulation sheet, a tantalum capacitor including a body part containing a sintered tantalum powder and a tantalum wire of which a portion is embedded in the body part, and disposed on the insulation sheet, a multilayer ceramic capacitor including a ceramic body in which a plurality of dielectric layers and internal electrodes are alternately disposed and first and second external electrodes disposed on a lower surface of the ceramic body, and disposed on the insulation sheet, and a molded part enclosing the tantalum capacitor and the multilayer ceramic capacitor, the internal electrodes including a lead-out portion led out to the lower surface of the ceramic body. 1. A composite electronic component comprising:an insulation sheet;first and second connective conductor parts disposed on the upper surface of the insulation sheet and respectively extending to first and second ends of the insulation sheet in a length direction;a tantalum capacitor body part at least partially disposed on the second connective conductor part;a ceramic body in which first and second internal electrodes are stacked with dielectric layers interposed therebetween, wherein the first and second internal electrodes include respective lead-out portions exposed to the lower surface of the ceramic body;first and second external electrodes respectively connected to the lead-out portions of the first and second internal electrodes exposed to the lower surface of the ceramic body and respectively disposed on the first and second connective conductor parts;a molded part above the insulation sheet and enclosing at least the tantalum capacitor body and the ceramic body;first and second terminal electrodes respectively on first and second end surfaces of the molded part in the length direction and respectively connected to the first and second connective conductor parts.2. The composite electronic component of claim 1 , further comprising a tantalum capacitor ...

COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

A composite electronic component includes an insulation sheet, a tantalum capacitor including a body part containing a sintered tantalum powder and a tantalum wire, a portion of which is embedded in the body part, and disposed on the insulation sheet, a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, first and second internal electrodes, and first and second external electrodes, and disposed on the insulation sheet, and a molded portion enclosing the tantalum capacitor and the multilayer ceramic capacitor. The first internal electrode includes a first lead portion led out to upper and lower surfaces and a first end surface of the ceramic body in a length direction, and the second internal electrode includes a second lead portion led out to the upper and lower surfaces and a second end surface of the ceramic body in the length direction. 1. A composite electronic component comprising:an insulation sheet;a tantalum capacitor including a body part containing a sintered tantalum powder and a tantalum wire, a portion of which is embedded in the body part, and disposed on the insulation sheet;a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, first and second internal electrodes disposed in the ceramic body to face each other with a respective dielectric layer interposed between the first and second internal electrodes, and first and second external electrodes disposed on external surfaces of the ceramic body to be connected to the first and second internal electrodes, respectively, and disposed on the insulation sheet; anda molded portion enclosing the tantalum capacitor and the multilayer ceramic capacitor,wherein the first internal electrode includes a first lead portion led out to upper and lower surfaces of the ceramic body and a first end surface of the ceramic body in a length direction of the ceramic body, and the second internal electrode includes a second lead ...

MULTILAYER CERAMIC CAPACITOR

In an embodiment, a multilayer ceramic capacitor has supplementary dielectric layers , each having a first cover part that covers the space between two first base conductor films on each of both height-direction faces, and second cover parts that connect to the first cover part and also cover parts of the first base conductor films , respectively, in the length direction. External electrodes each have a second base conductor film attached to a one length-direction face and to one length-direction edges of two first base conductor films on the respective height-direction faces, and a surface conductor film attached continuously to the surface of the second base conductor film and also to the parts of the surfaces of the two first base conductor films not covered by the second cover parts 1. A multilayer ceramic capacitor comprising a capacitor body of roughly rectangular solid shape , as well as a pair of external electrodes provided on both ends of the capacitor body in a length direction , where the external electrodes each have wraparound parts that wrap around onto at least one height-direction face of the capacitor body , wherein:the capacitor body has: (a1) a capacitive element of roughly rectangular solid shape; (a2) first base conductor films provided on both length-direction ends of at least one height-direction face of the capacitive element; and (a3) a supplementary dielectric layer having a first cover part that covers the space between the first base conductor films on the at least one height-direction face of the capacitive element, and second cover parts that connect to the first cover part and also covers parts of the first base conductor films, respectively, in the length direction;one of the external electrodes has: (b1) a second base conductor film attached to one length-direction face of the capacitive element and also to one length-direction edge of the first base conductor film present on the one length-direction side of the capacitor body; and ...

MULTILAYER CERAMIC CAPACITOR

In an embodiment, a multilayer ceramic capacitor has supplementary dielectric layers covering the spaces between two first base conductor films on both height-direction faces of a capacitive element ′, respectively, in such a way that clearances CL are left between the first base conductor films and the supplementary dielectric layers in the length direction. External electrodes each have a second base conductor film and a surface conductor film , and the wraparound locations of each surface conductor film have insertion parts that fill in the clearances CL. The multilayer ceramic capacitor can mitigate deterioration in moisture resistance. 1. A multilayer ceramic capacitor comprising a capacitor body of roughly rectangular solid shape , as well as a pair of external electrodes provided on both ends of the capacitor body in a length direction , where the external electrodes each have wraparound parts that wrap around onto at least a one height-direction face of the capacitor body , wherein:the capacitor body has: (a1) a capacitive element of roughly rectangular solid shape; (a2) first base conductor films provided on both length-direction ends of at least one height-direction face of the capacitive element; and (a3) a supplementary dielectric layer covering the space between the first base conductor films on the at least one height-direction face of the capacitive element except that there is a clearance between each of the first base conductor films and the supplementary dielectric layer in the length direction;one of the external electrodes has: (b1) a second base conductor film attached to one length-direction face of the capacitive element and also to one length-direction edge of the first base conductor film present on the one length-direction side of the capacitor body; and (b2) a surface conductor film attached continuously to a surface of the second base conductor film and also to a surface of the first base conductor film, wherein the wraparound part is ...

CAPACITOR OIL HAVING EXCELLENT PROPERTIES IN WIDE TEMPERATURE RANGE

The present invention provides a capacitor oil that can maintain breakdown voltage at a high level in a wide temperature range of −50° C. to 30° C., extremely unlikely precipitates as crystals in particular at −50° C. and thus has excellent properties both at normal temperature and a lower temperature. The capacitor oil of the present invention comprises 1,1-diphenylethane and benzyltoluene, wherein the mass ratio of 1,1-diphenylethane to benzyltoluene is 0.8 to 2.0, the total amount of the ortho-isomer and para-isomer in the benzyltoluene is 90 percent by mass or less, and the composition has a 40° C. kinematic viscosity of 3.00 mm/s or lower. 1. A capacitor oil comprising 1 ,1-diphenylethane and benzyltoluene , wherein the mass ratio of 1 ,1-diphenylethane to benzyltoluene is 0.8 to 2.0 , the total amount of the ortho-isomer and para-isomer in the benzyltoluene is 90 percent by mass or less , and the composition has a 40° C. kinematic viscosity of 3.00 mm2/s or lower.2. The capacitor oil according to further comprising an epoxy compound in an amount of 0.01 to 1.0 percent by mass.3. The capacitor oil according to wherein the chlorine content is 1 ppm by mass or less.4. A capacitor comprising a dielectric impregnated with the capacitor oil according to and at least partially composed of a polypropylene film.5. The capacitor oil according to wherein the chlorine content is 1 ppm by mass or less.6. A capacitor comprising a dielectric impregnated with the capacitor oil according to and at least partially composed of a polypropylene film.7. A capacitor comprising a dielectric impregnated with the capacitor oil according to and at least partially composed of a polypropylene film. The present invention relates to capacitor oils having excellent properties in a wide temperature range.Examples of properties that a capacitor oil is mainly required to have include high breakdown voltage, high hydrogen gas absorbability, low viscosity and low melting point. In recent years, ...

Motor Control Module, Actuator and Electromechanical Brake Apparatus

The present disclosure discloses a motor control module (120), an actuator, and an electromechanical brake apparatus, which relates to the technical field of mechanical braking. The present disclosure solves issues such as insufficient space and large size caused by directly connecting a circuit board and capacitors in the existing motor control modules. The motor control module (120) according to the present disclosure comprises a circuit board (100) and a capacitor assembly (300) including a plurality of capacitors (310) and an electrically conductive connecting element (1000) for electrically connecting the plurality of capacitors (310), the electrically conductive connecting element (1000) being electrically connected to the circuit board (100) and being disposed in a suspended state relative to the circuit board (100), such that a gap (130) is maintained between the capacitor assembly (300) and the circuit board (100). A region that is originally occupied by the capacitor assembly (300) on the circuit board (100) may be saved for mounting other electronic elements, such that mounting of the other electronic elements will not be restricted by the capacitor assembly (300). In this way, a smaller-sized circuit board may be used for a same number of electronic elements.

Contact part for electrically connecting end-face contact layers on the end faces of a plastic film capacitor winding of an encased electric single-phase or three-phase capacitor, and encased electric single-phase and three-phase capacitors comprising same

The invention relates to a contact part () for electrically connecting end-face contact layers on the end faces of a plastic film capacitor winding () of an encased electric single-phase or three-phase capacitor to a terminal wire () or a connecting wire, comprising a preferably flat contact support with a terminal region for contacting a terminal wire () or a connecting wire; comprising at least one contact piece () with at least one contact tip, said contact piece () extending upwards or downwards from the contact support in a substantially vertical manner, in order to establish an electric connection to an end-face contact layer () by pressing the contact tip into said end-face contact layer (); and comprising a penetration depth-limiting device for limiting the penetration depth of the contact tip or the contact tips in the end-face contact layer (). The invention also relates to encased single-phase and three-phase capacitors comprising said contact part. 1202112141018344442. A contact part ( , ) for electrically connecting end-face contact layers ( , ) on the end faces of a plastic film capacitor winding () of an encased electric single-phase or three-phase capacitor comprising a terminal wire ( , , ) or a connecting wire () , comprising{'b': 22', '18', '34', '44', '42, 'a preferably planar contact carrier () with a terminal region for making contact with a terminal wire (, , ) or a connecting wire (),'}{'b': 26', '22', '28', '12', '14', '28, 'at least one contact piece () which extends upwards or downwards substantially perpendicularly from the contact carrier () and has at least one contact tip () for producing an electrical connection to an end-face contact layer (, ) by the contact tip () being pushed into said end-face contact layer, and'}{'b': 28', '28', '12', '14, 'a penetration depth limitation device for limiting the penetration depth of the contact tip () or the contact tips () in the end-face contact layer (, ).'}22026222622. The contact part () as ...

MULTI-LAYER CERAMIC ELECTRONIC DEVICE

A multi-layer ceramic electronic device includes an element body and terminal electrodes. The terminal electrodes include end electrode parts covering ends of the element body in which internal electrode layers are led and upper electrode parts continuing to the end electrode parts and each partially covering an upper surface of the element body in a lamination direction. The terminal electrodes are not substantially formed on a lower surface of the element body located opposite to the upper surface of the element body in the lamination direction. 1. A multi-layer ceramic electronic device comprising:an element body in which internal electrode layers and insulation layers substantially parallel to a plane including a first axis and a second axis are laminated alternately in a third axis; andterminal electrodes formed on an external surface of the element body and electrically connected with the internal electrode layers, a pair of end electrode parts facing each other in the second axis and covering ends of the element body in the second axis in which the internal electrode layers are led; and', 'a pair of upper electrode parts continuing to the end electrode parts and each partially covering an upper surface of the element body substantially perpendicular to the third axis,, 'wherein the terminal electrodes includewherein conductive metal films are formed in interfaces between the element body and the terminal electrodes, andwherein the terminal electrodes are not substantially formed on a lower surface of the element body located opposite to the upper surface of the element body in the third axis.2. A multi-layer ceramic electronic device comprising:an element body in which internal electrode layers and insulation layers substantially parallel to a plane including a first axis and a second axis are laminated alternately in a third axis; andterminal electrodes formed on an external surface of the element body and electrically connected with the internal electrode ...

INTERPOSER STRUCTURE AND METHOD FOR MANUFACTURING THEREOF

An interposer structure is provided. The interposer structure includes a plurality of interposer units in an array arrangement from a top view perspective. Each of the interposer units includes a first region and a plurality of second regions. The first region has a capacitor structure. Each of the plurality of second regions is free of the capacitor structure. The first region surrounds the plurality of second regions. A method for manufacturing an interposer structure is also provided. 1. An interposer structure , comprising:a substrate portion;a wiring portion over the substrate portion;an interconnect portion over the wiring portion;a through via penetrating the substrate portion and the wiring portion; anda capacitor structure embedded in the wiring portion;wherein the interconnect portion comprises a first metal wire electrically coupled to the capacitor structure.2. The interposer structure of claim 1 , wherein the first metal wire is disposed over the through via claim 1 , and the first metal wire is electrically coupled to the through via and the capacitor structure.3. The interposer structure of claim 1 , wherein the through via penetrates the substrate portion claim 1 , the wiring portion claim 1 , and the interconnect portion claim 1 , and the through via is disconnected from the first metal wire.4. The interposer structure of claim 1 , wherein the interconnect portion is configured to bond with a first semiconductor die claim 1 , and the substrate portion is configured to bond with a package substrate.5. The interposer structure of claim 4 , wherein the interconnect portion is further configured to bond with a second semiconductor die claim 4 , the interconnect portion further comprises a second metal wire electrically connected to the first semiconductor die and the second semiconductor die.6. The interposer structure of claim 5 , wherein the second metal wire is disconnected from the first metal wire or the through via.7. The interposer structure of ...

CAPACITOR COMPONENT

A capacitor component includes a body, and first and second external electrodes formed on external surfaces of the body. The body includes a first connection electrode connected to the first external electrode, a second connection electrode disposed on the first connection electrode to partially cover the first connection electrode and connected to the second external electrode, and a porous capacitor portion disposed to cover the first and second connection electrodes and connected to each of the first and second connection electrodes. 1. A capacitor component comprising:a body; andfirst and second external electrodes formed on external surfaces of the body,wherein the body includes:a first connection electrode connected to the first external electrode,a second connection electrode disposed on the first connection electrode to partially cover the first connection electrode and connected to the second external electrode, anda porous capacitor portion disposed to cover the first and second connection electrodes and connected to each of the first and second connection electrodes.2. The capacitor component of claim 1 , wherein the porous capacitor portion includes a porous body claim 1 , a dielectric layer covering a surface of the porous body claim 1 , and an electrode layer covering the dielectric layer.3. The capacitor component of claim 2 , wherein the porous body is formed of a conductive material and is connected to the first connection electrode claim 2 , and the electrode layer is connected to the second connection electrode.4. The capacitor component of claim 3 , wherein the porous body is formed of the same material as that of the first connection electrode.5. The capacitor component of claim 2 , wherein the porous body is formed of an electrically insulating material claim 2 , andthe porous capacitor portion further includes an additional electrode layer formed between the porous body and the dielectric layer and connected to the first connection electrode.6 ...

Multilayer capacitor

A multilayer capacitor includes a body and external electrodes on external surfaces of the body. The body includes a plurality of internal electrodes alternately laminated with dielectric layers. The external electrodes are electrically connected to the internal electrodes. Edges of cover portions of the body are rounded. The rounded edges have a radius of curvature R and the body has a thickness T, such that R and T satisfy 10 μm≤R≤T/ 4 . Among the plurality of internal electrodes, an internal electrode in each of the cover portions has a width less than that of an internal electrode of the central portion.

MULTI-LAYER CERAMIC ELECTRONIC COMPONENT

A multi-layer ceramic electronic component includes: a ceramic body including first and second main surfaces facing in a first axis direction, first and second end surfaces facing in a second axis direction, and first and second internal electrodes; a first external electrode including a first cover portion covering the first end surface, and a first extended portion extending from the first cover portion to the second main surface; and a second external electrode including a second cover portion covering the second end surface, and a second extended portion extending from the second cover portion to the second main surface, the multi-layer ceramic electronic component satisfying that, when Trepresents a dimension of the ceramic body in the first axis direction and Trepresents a dimension of each extended portion in the first axis direction, T+Tis 50 μm or less, and T/(T+T) is 0.32 or less. 1. A multi-layer ceramic electronic component , comprising: a first main surface and a second main surface that face in a first axis direction,', 'a first end surface and a second end surface that face in a second axis direction orthogonal to the first axis direction,', 'a first internal electrode that is drawn to the first end surface, and', 'a second internal electrode that faces the first internal electrode and is drawn to the second end surface;, 'a ceramic body including'} a first cover portion that covers the first end surface, and', 'a first extended portion that extends from the first cover portion to the second main surface; and, 'a first external electrode including'} a second cover portion that covers the second end surface, and', 'a second extended portion that extends from the second cover portion to the second main surface,, 'a second external electrode including'}{'sub': 1', '2', '1', '2', '2', '1', '2, 'the multi-layer ceramic electronic component satisfying that, when Trepresents a dimension of the ceramic body in the first axis direction, and when Trepresents a ...

Multi-Die Fine Grain Integrated Voltage Regulation

A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device may include one or more current consuming elements. A passive device may be coupled to the power consuming device. The passive device may include a plurality of passive elements formed on a semiconductor substrate. The passive elements may be arranged in an array of structures on the semiconductor substrate. The power consuming device and the passive device may be coupled using one or more terminals. The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used. 120-. (canceled)21. A semiconductor device , comprising:a semiconductor substrate;a plurality of passive structures arranged in a pattern of tiles on the semiconductor substrate, wherein the tiles include passive elements formed on the semiconductor substrate;at least one power supply rail formed on the semiconductor substrate; anda plurality of terminals formed on the semiconductor substrate, wherein at least one terminal is positioned inside of each tile in the pattern of tiles, the at least one terminal being associated with the passive elements in the tile;wherein at least two or more of the tiles are coupled to the at least one power supply rail, each of the at least two or more of the tiles including at least one terminal that couples the passive elements in the tile to the at least one power supply rail.22. The semiconductor device of claim 21 , wherein at least one of the passive elements is a capacitor.23. The semiconductor device of claim 21 , further comprising at least one additional power supply rail formed on the semiconductor substrate claim 21 , wherein the at least one additional power supply rail is positioned perpendicular to the at least one power supply rail on the semiconductor substrate.24. The semiconductor device of claim ...

GATE-ALL-AROUND FIN DEVICE

A gate-all around fin double diffused metal oxide semiconductor (DMOS) devices and methods of manufacture are disclosed. The method includes forming a plurality of fin structures from a substrate. The method further includes forming a well of a first conductivity type and a second conductivity type within the substrate and corresponding fin structures of the plurality of fin structures. The method further includes forming a source contact on an exposed portion of a first fin structure. The method further comprises forming drain contacts on exposed portions of adjacent fin structures to the first fin structure. The method further includes forming a gate structure in a dielectric fill material about the first fin structure and extending over the well of the first conductivity type. 1. A method comprising:forming a first doped fin of a first conductivity type located over a first portion of a doped well;forming a second doped fin of a second conductivity type located over a second portion of the doped well;forming a gate structure located adjacent to the first doped fin over the doped well;forming a shallow trench isolation (STI) region in the doped well between the first portion and the second portion of the doped well; andforming a source contact located over the first doped fin,wherein the source contact includes alternating p regions and n regions.2. The method of claim 1 , wherein the gate structure is formed in a dielectric fill material.3. The method of claim 2 , wherein the STI region is formed in the doped well partially under the dielectric fill material and partially under the gate structure.4. The method of claim 1 , wherein:the doped well is formed as a continuous deep N-well; andthe gate structure is formed completely over the continuous deep N-well.5. The method of claim 4 , wherein the first doped fin is formed as a floating P-type fin.6. The method of claim 5 , further comprising forming a drain contact over the second doped fin.7. The method of claim ...

ELECTRONIC COMPONENT AND SUBSTRATE HAVING THE SAME MOUNTED THEREON

An electronic component and a mounting substrate thereof provide metal frames that reduce stress transmission while occupying only a limited mounting area. The electronic component includes a body, and first and second external electrodes respectively disposed on opposite ends of the body. A first metal frame includes a first support portion bonded to the first external electrode and a first mounting portion extending from a lower end of the first support portion toward the second external electrode. A second metal frame includes a second support portion bonded to the second external electrode and a second mounting portion extending form a lower end of the second support portion away from the first external electrode. 1. An electronic component , comprising:a body;first and second external electrodes respectively disposed on opposite ends of the body in a first direction;a first metal frame including a first support portion bonded to the first external electrode and a first mounting portion extending from a lower end of the first support portion parallel to the first direction and toward the second external electrode; anda second metal frame including a second support portion bonded to the second external electrode and a second mounting portion extending from a lower end of the second support portion parallel to the first direction and away from the first external electrode.21212. The electronic component of claim 1 , wherein d Подробнее

MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, METHOD OF PRODUCING A MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, AND SUBSTRATE WITH A BUILT-IN ELECTRONIC COMPONENT

A multi-layer ceramic electronic component includes: a ceramic body including internal electrodes laminated in one axial direction and having a main surface facing in the one axial direction; and an external electrode including a base layer including a step portion formed on the main surface, and a plated layer formed on the base layer, the external electrode being connected to the internal electrodes. 1. A multi-layer ceramic electronic component , comprising:a ceramic body including internal electrodes laminated in one axial direction and having a main surface facing in the one axial direction; and a base layer including a step portion formed on the main surface, and', 'a plated layer formed on the base layer,, 'an external electrode including'}the external electrode being connected to the internal electrodes.2. The multi-layer ceramic electronic component according to claim 1 , whereinthe step portion has a height dimension of 1 μm or more and 15 μm or less along the one axial direction.3. The multi-layer ceramic electronic component according to claim 2 , whereinthe step portion has a height dimension of 2 μm or more and 5 μm or less along the one axial direction.4. The multi-layer ceramic electronic component according to claim 1 , whereinthe step portion includes a plurality of step portions formed on the main surface.5. A method of producing a multi-layer ceramic electronic component claim 1 , comprising:producing a ceramic body, the ceramic body including internal electrodes laminated in one axial direction and having a main surface facing in the one axial direction;forming a base layer, the base layer including a step portion formed on the main surface and being connected to the internal electrodes; andforming a plated layer on the base layer.6. A substrate with a built-in electronic component claim 1 , comprising: a ceramic body including internal electrodes laminated in one axial direction and having a main surface facing in the one axial direction, and', ...

DIELECTRIC COMPOSITION, DIELECTRIC ELEMENT, ELECTRONIC COMPONENT AND LAMINATED ELECTRONIC COMPONENT

The problem addressed lies in providing a dielectric composition having a relatively high dielectric constant of 800 or greater when a DC bias of at least 8 V/μm is applied, and also in providing a dielectric element employing said dielectric composition, an electronic component, and a laminated electronic component. [Solution] A dielectric composition in which the composition of the main component is in accordance with the following formula (1): (BiNaSr) (MgTi)O(1) [where a, b, c and d satisfy the following: 0.10≦a≦0.65, 0 Подробнее

MULTILAYER CERAMIC CAPACITOR

In some embodiments, a multilayer ceramic capacitor has 23 unit capacitors UC to UC, where these 23 unit capacitors UC to UC constitute: a first low-capacitance area LA constituted by three unit capacitors UC to UC; a high-capacitance area HA constituted by 17 unit capacitors UC to UC whose unit capacitance is greater than that of the three unit capacitors UC to UC; a second low-capacitance area LA constituted by three unit capacitors UC to UC whose unit capacitance is smaller than that of the 17 unit capacitors UC to UC; a first variable-capacitance part which is present between the first low-capacitance area LA and high-capacitance area HA, and which includes the two adjacent unit capacitors UC, UC; and a second variable-capacitance part which is present between the high-capacitance area HA and second low-capacitance area LA, and which includes the two adjacent unit capacitors UC, UC 1. A multilayer ceramic capacitor having multiple internal electrode layers stacked with dielectric layers sandwiched in between , with the multiple internal electrode layers connected alternately to a pair of external electrodes , wherein , when a part constituted by two of the internal electrode layers positioned adjacent to each other in a laminating direction and the dielectric layer present between these two internal electrode layers is considered a unit capacitor , then the multilayer ceramic capacitor has an n number (n≧x+y+z , where x , y and z are each an integer of 2 or greater) of unit capacitors;said n number of unit capacitors constituting:(1) a first low-capacitance area constituted by an x number of unit capacitors;(2) a high-capacitance area constituted by a y number of unit capacitors whose unit capacitance is greater than that of the x number of unit capacitors;(3) a second low-capacitance area constituted by a z number of unit capacitors whose unit capacitance is smaller than that of the y number of unit capacitors;(4) a first variable-capacitance part which is ...

Ceramic electronic component with metal terminals

A ceramic electronic component with metal terminals comprising a chip component formed with terminal electrodes at both ends, and a pair of metal terminals comprising a flat plate portion having a flat plate portion facing face provided so that it faces an end face of said chip component and connected to said terminal electrodes via a joining portion , and a mounting portion connected to one end portion of said flat plate portion and extending approximately perpendicular to said flat plate portion, wherein said mounting portion has a mounting portion bottom face forming an angle of approximately 270 degrees with respect to said flat plate portion, and a mounting portion upper face forming an angle of approximately 90 degrees with respect to said flat plate portion, and a solder adhering prevention area having lower wettability than said mounting portion bottom face is formed.

MULTI-LAYER CERAMIC CAPACITOR

A multi-layer ceramic capacitor has a structure where its dielectric layers are constituted by a sintered compact that contains a mol of ReO, b mol of SiO, c mol of MO, d mol of ZrO, and e mol of MgO (where Re is a rare earth element, M is a metal element (except for Ba, Ti, Re, Si, Zr, Mg, and rare earth elements), and x is a valance) per 100 mol of BaTiO, and a, b, c, d, and e mentioned above which indicate the mol numbers of respective constituents per 100 mol of BaTiOare 0.1≦a≦1.0, 0.1≦b≦1.5, 0.1≦c≦0.4, 0≦d≦1.0, and 0≦e≦0.03, respectively.

NOVEL CAPACITOR PACKAGE STRUCTURE

A novel capacitor package structure of the instant disclosure includes a mutilayer film capacitor, a package unit, a first conductive terminal, and a second conductive terminal. The mutilayer film capacitor includes two terminal electrodes and a mutilayer body between the two terminal electrodes, wherein the mutilayer body includes a plurality of metal layers stacked alternately with a plurality of dielectric layers. The package unit encloses the mutilayer film capacitor. The first conductive terminal and the second conductive terminal are electrically connected to the two terminal electrodes, respectively. 1. A novel capacitor package structure , comprising:a mutilayer film capacitor comprising two terminal electrodes and a mutilayer body between the two terminal electrodes, wherein the mutilayer body comprises a plurality of metal layers stacked alternately with a plurality of dielectric layers;a package unit enclosing the mutilayer film capacitor; anda first conductive terminal and a second conductive terminal electrically connected to the two terminal electrodes, respectively.2. The novel capacitor package structure according to claim 1 , wherein the mutilayer film capacitor further comprises a top protective layer laminated to a top surface of the mutilayer body and a bottom protective layer laminated to a bottom surface of the mutilayer body.3. The novel capacitor package structure according to claim 1 , wherein the first conductive terminal has a first embedded portion enclosed by the package unit claim 1 , and two opposite ends of the first embedded portion extending away from each other directly contact one of the two terminal electrodes claim 1 , and wherein the second conductive terminal has a second embedded portion enclosed by the package unit claim 1 , and two opposite ends of the second embedded portion extending away from each other directly contact another one of the two terminal electrodes.4. The novel capacitor package structure according to claim ...

CAPACITOR AND METHOD OF MANUFACTURE THEREOF

An alternating current power capacitor including one or more capacitor bodies (e.g., bobbins) having conductive and dielectric film windings, wherein edges of the conductive film windings define a plane forming at least one capacitor body contact surface, one or more electrodes having one or more electrode contact surfaces and a housing operative to apply compressive force that binds the capacitor body and electrode together so that to maintain uniform electrical and thermal conductive contact throughout a plane parallel to and between the electrode contact surface and capacitor body contact surface. 1. An AC Capacitor , comprising:at least one capacitor body having conductive and dielectric film windings and wherein an edge of the conductive film windings defines a plane normal to a concentric axis (W) of the windings forming at least one capacitor body contact surface;a pair of electrodes sandwiching the capacitor body with each electrode having at least one electrode contact surface; andwherein the pair of electrodes is urged against the capacitor body contact surface to apply compressive force, operative to bind the capacitor body contact surface and the electrode contact surface together so that to maintain uniform electrical and thermal conductive contact throughout a plane parallel to and between the electrode contact surface and capacitor body contact surface.2. The AC capacitor according to claim 1 , wherein the compressive force is the sole force that provides a functional contact between the capacitor body and the electrode contact surface negating need for an intermediate bonding material.3. The AC capacitor according to claim 1 , wherein the compressive force is a vector which is parallel to axis (W) and normal to capacitor body contact surface.4. The AC capacitor according to claim 1 , wherein the electrodes include at least one through hole.5. The AC capacitor according to claim 1 , wherein magnitude of the compressive force is limited only by value ...

MULTILAYER CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON

A multilayer capacitor and a board having the same mounted thereon are provided. The multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, and first to sixth surfaces, the first internal electrode being exposed through the third surface and the fifth surface and the second internal electrode being exposed through the fourth surface and the sixth surface; first and second side portions disposed on the fifth and sixth surfaces, respectively, of the capacitor body; first and second external electrodes; a first step-compensating portion disposed on a margin portion in a width direction on the second dielectric layer on which the second internal electrode is formed on the first internal electrode; and a second step-compensating portion disposed on another margin portion in the width direction on the first dielectric layer on which the first internal electrode is disposed on the second internal electrode. 1. A multilayer capacitor , comprising:a capacitor body comprising first and second dielectric layers and first and second internal electrodes, and a first surface and a second surface opposing each other, a third surface and a fourth surface connected to the first and second surfaces and opposing each other, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other, the first internal electrode being exposed through the third surface and the fifth surface and the second internal electrode being exposed through the fourth surface and the sixth surface;first and second side portions disposed on the fifth and sixth surfaces, respectively, of the capacitor body;first and second external electrodes respectively disposed on the third and fourth surfaces of the body and respectively connected to the first and second internal electrodes;a first step-compensating portion disposed on a first margin portion in a width direction on the second dielectric layer on which the ...

MULTILAYER CERAMIC ELECTRONIC COMPONENT

A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes with the dielectric layer interposed therebetween, the dielectric layer and the first and second internal electrodes arranged to be stacked, and a first cover portion disposed on the capacitance portion, and a second cover portion disposed on the capacitance portion, a first external electrode connected to the first internal electrode, and a second external electrode connected to the second internal electrode. The first cover portion and the second cover portion include a cover reinforcing layer including graphene. 1. A multilayer ceramic electronic component comprising:a ceramic body including a dielectric layer and first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween;a first external electrode connected to the first internal electrode; anda second external electrode connected to the second internal electrode,wherein the ceramic body includesfirst and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction andthe ceramic body includesa capacitance portion including the first and second internal electrodes stacked in the third direction to form capacitance,a first cover portion disposed on the fifth surface, anda second cover portion disposed on the sixth surface,wherein the first cover portion and/or the second cover portion include a cover reinforcing layer including graphene, andan average thickness of the cover reinforcing layer is 5% or more of an average thickness of the first cover portion or the second cover portion.2. The multilayer ceramic electronic component of claim 1 , whereinthe ceramic body includes:a first margin portion disposed on the third surface, anda second margin portion disposed on the fourth surface,wherein ...

Capacitor component for an electric motor or generator

A capacitor component comprising a first busbar, a second busbar, one or more capacitor elements and a housing, the housing having a first portion and a second portion, wherein the first portion and the second portion are arranged to extend around an aperture, the first portion includes a section for housing the one or more capacitor elements, with the second portion extending between a first end and a second end of the first portion, wherein the first busbar and the second busbar are arranged to extend around the first portion and the second portion of the housing, a first power supply terminal is formed at the first end of the first portion and a second power supply terminal is formed at the second end of the first portion, wherein the first power supply terminal is coupled to the first busbar and the second power supply terminal is coupled to the second busbar, wherein a first conductive layer of the one or more capacitor elements is coupled to the first busbar and a second conductive layer of the one or more capacitor elements is coupled to the second busbar.

Multilayer ceramic capacitor and manufacturing method thereof

A multilayer ceramic capacitor includes: a multilayer structure in which each of a plurality of ceramic dielectric layers and each of a plurality of internal electrode layers are alternately stacked, the plurality of internal electrode layers being alternately exposed to a first edge face and a second edge face of the multilayer structure, wherein 1.5≤Db/Da≤10.0 is satisfied in a side margin region that covers edge portions to which the plurality of internal electrode layers extend toward two side faces other than the first edge face and the second edge face, when Da is an average grain diameter of a main component ceramic within 20 μm from an edge of the plurality of internal electrode layers in the side margin region and Db is an average grain diameter of a main component ceramic within 20 μm from a surface layer of the side margin region.

LC FILTER

Disclosed herein is an LC filter that includes a conductive substrate, a first capacitive insulating film having one surface covered with the conductive substrate and other surface covered with a first capacitive electrode, a first inductor pattern having one end connected to the first capacitive electrode, a first terminal electrode connected to other end of the first inductor pattern, and a common terminal electrode connected to the conductive substrate. 1. An LC filter comprising:a conductive substrate;a first capacitive insulating film having one surface covered with the conductive substrate and other surface covered with a first capacitive electrode;a first inductor pattern having one end connected to the first capacitive electrode;a first terminal electrode connected to other end of the first inductor pattern; anda common terminal electrode connected to the conductive substrate.2. The LC filter as claimed in claim 1 , further comprising:a second terminal electrode connected to the first capacitive electrode and the one end of the first inductor pattern; anda second capacitive insulating film having one surface covered with the conductive substrate and other surface covered with a second capacitive electrode,wherein the first terminal electrode is connected to the second capacitive electrode.3. The LC filter as claimed in claim 2 , further comprising:a third capacitive insulating film having one surface covered with the conductive substrate and other surface covered with a third capacitive electrode;a fourth capacitive insulating film having one surface covered with the conductive substrate and other surface covered with a fourth capacitive electrode;a second inductor pattern having one end connected to the third capacitive electrode and other end connected to the fourth capacitive electrode;a third terminal electrode connected to the third capacitive electrode and the one end of the second inductor pattern; anda fourth terminal electrode connected to the ...

MULTILAYER CERAMIC CAPACITOR

A multilayer ceramic capacitor includes: a ceramic body including a dielectric layer, a first internal electrode and a second internal electrode arranged to face each other with the dielectric layer interposed therebetween; and a first external electrode disposed on an exterior surface of the ceramic body and a second external electrode disposed on the exterior surface of the ceramic body, wherein the ceramic body includes an active portion, forming capacity, cover portions disposed on upper and lower portions of the active portion, and margin portions disposed on a side surface of the active portion, and wherein the dielectric layer, the cover portions, and the margin portions of the active portion include magnesium (Mg) having content of more than 0 mole, and less than or equal to 1.0 mole, relative to titanium (Ti) included in the dielectric layer, the cover portions and the margin portions of the active portion. 1. A multilayer ceramic capacitor comprising:a ceramic body including a dielectric layer, a first internal electrode and a second internal electrode arranged to face each other with the dielectric layer interposed therebetween, a first surface and a second surface opposing each other, a third surface and a fourth surface connecting the first surface and the second surface respectively and opposing each other, and a fifth surface and a sixth surface connecting the first surface through fourth surface and opposing each other; anda first external electrode disposed on an exterior surface of the ceramic body and electrically connected to the first internal electrode and a second external electrode disposed on the exterior surface of the ceramic body and electrically connected to the second internal electrode,wherein the ceramic body includes an active portion, forming capacity, including the first internal electrode and the second internal electrode disposed to face each other with the dielectric layer interposed therebetween in a stacking direction, and ...

MULTILAYER CERAMIC CAPACITOR

A multilayer ceramic capacitor includes: a ceramic body including a dielectric layer, a first internal electrode and a second internal electrode arranged to face each other with the dielectric layer interposed therebetween; and a first external electrode disposed on an exterior surface of the ceramic body and a second external electrode disposed on the exterior surface of the ceramic body, wherein the ceramic body includes an active portion, forming capacity, cover portions disposed on upper and lower portions of the active portion, and margin portions disposed on a side surface of the active portion, and wherein the dielectric layer, the cover portions, and the margin portions of the active portion include magnesium (Mg) having content of more than 0 mole, and less than or equal to 1.0 mole, relative to titanium (Ti) included in the dielectric layer, the cover portions and the margin portions of the active portion. 1. A multilayer ceramic capacitor comprising:a ceramic body including a dielectric layer, a first internal electrode and a second internal electrode arranged to face each other with the dielectric layer interposed therebetween, a first surface and a second surface opposing each other, a third surface and a fourth surface connecting the first surface and the second surface respectively and opposing each other, and a fifth surface and a sixth surface connecting the first surface through fourth surface and opposing each other; anda first external electrode disposed on an exterior surface of the ceramic body and electrically connected to the first internal electrode and a second external electrode disposed on the exterior surface of the ceramic body and electrically connected to the second internal electrode,wherein the ceramic body includes an active portion, forming capacity, including the first internal electrode and the second internal electrode disposed to face each other with the dielectric layer interposed therebetween in a stacking direction, and ...

Metal-insulator-metal (mim) capacitor structure and method for forming the same

A metal-insulator-metal (MIM) capacitor structure and a method for forming the same are provided. The MIM capacitor structure includes a substrate, and the substrate includes a capacitor region and a non-capacitor region. The MIM capacitor structure includes a first electrode layer formed over the substrate, and a first spacer formed on a sidewall of the first electrode layer. The MIM capacitor structure includes a first dielectric layer formed on the first spacers, and a second electrode layer formed on the first dielectric layer. The second electrode layer extends from the capacitor region to the non-capacitor region, and the second electrode layer extends beyond an outer sidewall of the first spacer.

EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME

There is provided an embedded multilayer ceramic electronic component including a ceramic body including a dielectric layer and having first and second main surfaces, first and second side surfaces, and first and second end surfaces, first and second internal electrodes, and first and second external electrodes, wherein the first external electrode includes a first base electrode electrically connected to the first internal electrode, a first intermediate layer, and a first terminal electrode, the second external electrode includes a second base electrode electrically connected to the second internal electrode, a second intermediate layer, and a second terminal electrode, the first and second base electrodes include a first conductive metal and glass, and the first and second terminal electrodes are formed of a second conductive metal. 1. An embedded multilayer ceramic electronic component , comprising:a ceramic body including a dielectric layer and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other;a first internal electrode and a second internal electrode formed to be alternately exposed through both end surfaces of the ceramic body, having the dielectric layer interposed therebetween; andfirst and second external electrodes formed on both end surfaces of the ceramic body,wherein the first external electrode includes a first base electrode electrically connected to the first internal electrode, a first intermediate layer formed on the first base electrode and formed of nickel (Ni), and a first terminal electrode formed on the first intermediate layer,the second external electrode includes a second base electrode electrically connected to the second internal electrode, a second intermediate layer formed on the second base electrode and formed of nickel (Ni), and a second terminal electrode formed on the second intermediate layer,the first and second ...

COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

A composite electronic component may include: a composite body including a capacitor and an inductor coupled to each other, the capacitor having a ceramic body in which dielectric layers and internal electrodes facing each other with the dielectric layers interposed therebetween are stacked, and the inductor having a magnetic body in which magnetic layers having conductive patterns are stacked; an input terminal disposed on a first end surface of the composite body and connected to the conductive pattern of the inductor; an output terminal including a first output terminal formed on a second end surface of the composite body and connected to the conductive pattern of the inductor and a second output terminal disposed on a second side surface of the composite body; and a ground terminal disposed on a first side surface of the composite body and connected to the internal electrodes of the capacitor. 1. A composite electronic component , comprising:a composite body having a hexahedral shape and including a capacitor and an inductor which are coupled to each other, the capacitor having a ceramic body in which a plurality of dielectric layers and internal electrodes are stacked with at least one of the dielectric layers interposed between the internal electrodes, and the inductor having a magnetic body in which a plurality of magnetic layers having conductive patterns are stacked;an input terminal disposed on a first end surface of the composite body and connected to the conductive pattern of the inductor;an output terminal including a first output terminal disposed on a second end surface of the composite body and connected to the conductive pattern of the inductor and a second output terminal disposed on a second side surface of the composite body; anda ground terminal disposed on a first side surface of the composite body and connected to the internal electrodes of the capacitor.2. The composite electronic component of claim 1 , wherein the internal electrodes include ...

COMPLIANT PIN STRUCTURE FOR DISCRETE ELECTRICAL COMPONENTS

A discrete electrical component is disclosed, including a component member having at least one lead; and a base member on which the component member is supported. The electrical component further includes at least one compliant pin member, each compliant pin member having a first end portion configured for press-fit engagement in a printed circuit board and a second end portion electrically connected to the at least one lead of the component member. The at least one compliant pin at least partly extends through or into the base member. 1. A discrete electrical component , comprising:a component member having at least one lead;a base member on which the component member is supported; andat least one compliant pin member, each compliant pin member having a first end portion configured for press-fit engagement in a printed circuit board and a second end portion electrically connected to the at least one lead of the component member, the at least one compliant pin at least partly extending through or into the base member.2. The discrete electrical component of claim 1 , wherein the at least one lead of the component member and the at least one compliant pin member are integrally formed as a unitary member.3. The discrete electrical component of claim 1 , wherein the at least one lead of the component member is welded to the second end portion of the first compliant pin member.4. The discrete electrical component of claim 1 , wherein at least one of a central portion and the second end portion of the at least one compliant pin member extends through or into the base member.5. The discrete electrical component of claim 1 , wherein the base member includes a concave portion which receives at least a portion of the component member therein.6. The discrete electrical component of claim 1 , wherein the at least one lead comprises a plurality of leads claim 1 , the at least one compliant pin member comprises a plurality of compliant pin members claim 1 , each lead being ...

Combination stiffener and capacitor

Electronic device package stiffener and capacitor technology is disclosed. A combination stiffener and capacitor can include a structural material configured to be coupled to a substrate. The structural material can have a shape configured to provide mechanical support for the substrate. The combination stiffener and capacitor can also include first and second electrodes forming a capacitor. An electronic device package and a package substrate configured to receive the combination stiffener and capacitor are also disclosed.

Thin Film Capacitors Embedded in Polymer Dielectric

A substrate comprising a capacitor comprising metal electrodes and a ceramic or metal oxide dielectric layer, the capacitor being embedded in a polymer based encapsulating material and connectable to a circuit via a via post standing on said capacitor.

COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

A composite electronic component may include: a composite body including a capacitor and an inductor coupled to each other, the capacitor having a ceramic body in which dielectric layers and internal electrodes facing each other with the dielectric layers interposed therebetween are stacked, and the inductor having a magnetic body in which magnetic layers having conductive patterns are stacked; an input terminal disposed on a first end surface of the composite body; an output terminal including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on any one or more of upper and lower surfaces and a second side surface of the capacitor; and a ground terminal disposed on any one or more of the upper and lower surfaces and a first side surface of the capacitor and connected to the internal electrodes. 1. A composite electronic component , comprising:a composite body having a hexahedral shape and including a capacitor and an inductor which are coupled to each other, the capacitor having a ceramic body in which a plurality of dielectric layers and internal electrodes are stacked with at least one of the dielectric layers interposed between the internal electrodes, and the inductor having a magnetic body in which a plurality of magnetic layers having conductive patterns are stacked;an input terminal disposed on a first end surface of the composite body and connected to the conductive pattern of the inductor;an output terminal including a first output terminal disposed on a second end surface of the composite body and connected to the conductive pattern of the inductor and a second output terminal disposed on any one or more of upper and lower surfaces and a second side surface of the capacitor; anda ground terminal disposed on anyone or more of the upper and lower surfaces and a first side surface of the capacitor and connected to the internal electrodes of the capacitor.2. The composite electronic component ...

HOLLOW CYLINDRICAL CAPACITOR AND INVERTER DEVICE

The hollow tubular capacitor includes one side electrode connecting portion having an inner peripheral tubular portion and one side surface portion, the other side electrode connecting portion having an outer peripheral tubular portion and the other side surface portion and an electrostatic capacitance portion having one side electrode plate, the other side electrode plate and a dielectric body, wherein the electrostatic capacitance portion is accommodated in an annular space formed at the inner peripheral tubular portion, the one side surface portion, the outer peripheral tubular portion and the other side surface portion in a high density to reduce inside inductance component. The inverter device is formed such that the hollow tubular capacitor and an annular inverter circuit portion having three-phase upper and lower arms are integrally arranged coaxially on the central axis line.

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

A multilayer ceramic electronic component includes: a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes; with external electrodes disposed on the capacitor body and electrically connected to the internal electrodes, wherein the capacitor body includes an active region in which internal electrodes having different polarities from each other overlap each other to form capacitance, and a margin part defined as region except for the active region. A concentration of an additive element in the margin part is higher than the concentration of the additive element in the active region, and the margin part has a concentration gradient of the additive element from a surface of the capacitor body toward the active region. 1. A multilayer ceramic electronic component comprising:a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes; andexternal electrodes disposed on the capacitor body and electrically connected to the internal electrodes,wherein the capacitor body includes an active region in which internal electrodes having different polarities from each other overlap each other to form capacitance, and a margin part defined as a region of the capacitor body except for the active region,a concentration of an additive element in the margin part being higher than in the active region, and in the margin part, the concentration of the additive element gradually decreases from a surface of the capacitor body toward the active region.2. The multilayer ceramic electronic component of claim 1 , wherein a stacking direction of the internal electrodes and the dielectric layers is a thickness direction claim 1 , a direction perpendicular to the thickness direction and in which ends of the internal electrodes are exposed to the surfaces of the capacitor body is a length direction claim 1 , and a direction perpendicular to the thickness direction and the length direction is a width direction claim 1 ...

SEMICONDUCTOR DEVICE

A semiconductor device is provided with: a semiconductor chip die-bonding mounted face up on a support; an intermediate substrate connecting the semiconductor chip to a plurality of external connection portions; and a plurality of connection bumps connecting the semiconductor chip and the intermediate substrate. The plurality of connection bumps includes a plurality of power supply bumps connected to a plurality of electrode pads on the semiconductor chip for supplying power to the semiconductor chip. The intermediate substrate includes: a plurality of power supply pads connected to the plurality of electrode pads through the plurality of power supply bumps; a bump surface facing the semiconductor chip and having a plurality of power supply pads formed thereon; an external connection surface having a plurality of external connection pads formed thereon connected to the external connection portions; and a capacitor connected to the plurality of power supply bumps. 1. A semiconductor device comprising:a support;a semiconductor chip die-bonding mounted face up on the support;a plurality of external connection portions electrically connecting the semiconductor chip to an outside;an intermediate substrate disposed on a side of the semiconductor chip opposite from the support and connecting the semiconductor chip to the plurality of external connection portions; anda plurality of connection bumps connecting the semiconductor chip and the intermediate substrate,wherein:the semiconductor chip includes a plurality of electrode pads connected to the intermediate substrate through the plurality of connection bumps;the plurality of connection bumps include a plurality of power supply bumps for supplying power to the semiconductor chip; and a plurality of power supply pads connected to the plurality of electrode pads through the plurality of power supply bumps,', 'a bump surface facing the semiconductor chip and having the plurality of power supply pads formed thereon,', 'an ...

THIN-FILM CERAMIC CAPACITOR

A thin-film ceramic capacitor includes a body in which dielectric layers and first and second electrode layers are alternately disposed on a substrate, and first and second electrode pads disposed on external surfaces of the body. A plurality of vias are disposed in the body. Each of a plurality of first vias connects the first electrode layers and the first electrode pad to each other. Each of a plurality of second vias connects the second electrode layers and the second electrode pad to each other. A separation slit is disposed to penetrate from an upper surface of the body and extend to the substrate, and the pluralities of first and second vias are disposed symmetrically with respect to the separation slit. 1. A thin-film ceramic capacitor comprising:a body in which a plurality of dielectric layers and first and second electrode layers are alternately disposed on a substrate; andfirst and second electrode pads disposed on at least one external surface of the body,wherein a plurality of vias are disposed in the body,wherein among the plurality of vias, each of a plurality of first vias connects the first electrode layers and the first electrode pad to each other and penetrates from one external surface of the body to a lowermost first electrode layer adjacent to the substrate,wherein among the plurality of vias, each of a plurality of second vias connects the second electrode layers and the second electrode pad to each other and penetrates from one external surface of the body to a lowermost second electrode layer adjacent to the substrate, andwherein a separation slit is disposed to penetrate from an upper surface of the body and extend to the substrate, and the pluralities of first and second vias are disposed symmetrically with respect to the separation slit.2. The thin-film ceramic capacitor of claim 1 , wherein the second vias are disposed on both sides of the separation slit to be adjacent to the separation slit claim 1 , and the first vias are disposed ...

CASE-MOLD-TYPE CAPACITOR AND METHOD FOR PRODUCING SAME

A case-mold-type capacitor includes a capacitor element, first and second bus bars connected to the first and second electrodes of the capacitor element, a case accommodating the capacitor element and the first and second bus bars, and a mold resin filling the case therein. The case has a cutaway portion provided therein. A sealing plate joined to the case so as to seal the cutaway portion. The first and second bus bars pass through the sealing plate and are fixed to the sealing plate. The case-mold-type capacitor improves dimensional accuracy between terminal portions of the first and second bus bars without increasing material cost, and has high reliability. 1. A case-mold-type capacitor comprising:a capacitor element including a capacitor element body, a first electrode provided on the capacitor element body, and a second electrode provided on the capacitor element body;a first bus bar including a first connection portion and a first terminal portion for external connection, the first connection portion being connected to the first electrode of the capacitor element, the first terminal portion being connected to the first connection portion;a second bus bar including a second connection portion and a second terminal portion for external connection, the second connection portion being connected to the second electrode of the capacitor element, the second terminal portion being connected to the second connection portion;a case accommodating the capacitor element, the first connection portion of the first bus bar, and the second connection portion of the second bus bar therein, the case having a side wall which has a cutaway portion provided therein;a sealing plate joined to the case so as to seal the cutaway portion; anda mold resin filling the case so as to cover the capacitor element, the first connection portion of the first bus bar, and the second connection portion of the second bus bar,wherein the first bus bar and the second bus bar pass through the sealing ...

CIRCUIT BOARD, FILTER CIRCUIT USING THE SAME, AND CAPACITANCE ELEMENT

A circuit board mounted with a capacitor includes an electrode to connect one terminal of a capacitor, a first inductor including a wiring pattern that extends from a first end connected with the electrode to a second end across a region mounted with the capacitor, and a second inductor including a wiring pattern that extends from the first end connected with the electrode to a second end across the region mounted with the capacitor from the opposite side from the first inductor. In a plan view, the wiring pattern of the first inductor and the wiring pattern of the second inductor intersect with each other, and an angle defined by the wiring pattern of the first inductor and the wiring pattern of the second inductor is an angle other than a right angle. 1. A circuit board mounted with a capacitance element , the circuit board comprising:an electrode to connect one terminal of the capacitance element;a first inductance element including a first wire that extends from a first end connected with the electrode to a second end across a region mounted with the capacitance element; anda second inductance element including a second wire that extends from a first end connected with the electrode to a second end across the region mounted with the capacitance element from the opposite side from the first wire; whereinin a plan view, the first wire of the first inductance element and the second wire of the second inductance element intersect with each other, and any angle defined by the first wire and the second wire is an angle other than a right angle.2. The circuit board according to claim 1 , wherein the first inductance element and the second inductance element have a same shape and have a line-symmetric shape with respect to the electrode.3. The circuit board according to claim 1 , wherein the angle defined by the first wire and the second wire is an angle smaller than 90 degrees counterclockwise from the first wire to the second wire in a plan view.4. The circuit board ...

Electricity storage module

An electricity storage module ( 10 A, 10 B) includes an electricity storage element group ( 12 ) in which a plurality of electricity storage elements ( 11 ) are electrically connected, and a positive-electrode and a negative-electrode power terminals ( 22 P, 22 N, 66 P, 66 N) to be electrically connected to the electricity storage element group ( 12 ) and electrically connected to mating terminals ( 14 ). The power terminals ( 22 P, 22 N, 66 P, 66 N) are selected from a positive-electrode and a negative-electrode vertical power terminals ( 66 P, 66 N) to which the mating terminals ( 14 ) are connected in a vertical downward direction or a positive-electrode and a negative-electrode non-vertical power terminals ( 22 P, 22 N) to which the mating terminals ( 14 ) are connected in a direction different from the vertical downward direction.

Electrochemical Cell Packaging Material

Provided is a packaging material for electrochemical cells which has an identification mark that can be recognized from the outside and that is difficult to forge. The packaging material comprises a multilayer film which has a structure formed by laminating a base layer (), an adhesive layer (), a metal foil layer (), an acid-modified polyolefin layer (), and a heat-sealable layer () in this order, wherein the base layer () comprises both a oriented polyester film () and a oriented nylon film () with a printed layer () provided on the surface of the oriented polyester film () that faces the oriented nylon film (). 1. An electrochemical cell packaging material for housing an electrochemical cell body ,the electrochemical cell body including a positive electrode comprising a positive-electrode active material and a positive-electrode collector, a negative electrode comprising a negative-electrode active material and a negative-electrode collector, and an electrolyte; andsealing said electrochemical cell body by heat-sealing of a peripheral edge part of the electrochemical cell packaging material,said electrochemical cell packaging material characterized in thatthe electrochemical cell packaging material is a multilayer film having a structure formed by laminating at least a base layer, an adhesive layer, a metal foil layer, and a heat-sealable layer in this order from outside, the heat-sealable layer being arranged as an innermost layer, andsaid adhesive layer comprises a pigment.2. The electrochemical cell packaging material according to claim 1 , wherein said adhesive is one selected from the group consisting of a polyvinyl acetate-based adhesive claim 1 , a polyacrylic acid ester-based adhesive claim 1 , a cyanoacrylate-based adhesive claim 1 , an ethylene copolymer-based adhesive claim 1 , a cellulose-based adhesive claim 1 , a polyester-based adhesive claim 1 , a polyamide-based adhesive claim 1 , a polyimide-based adhesive claim 1 , an amino resin-based adhesive ...

Capacitor

A capacitor that includes a substrate; a capacitor structure including a lower electrode on the substrate, a dielectric film on the lower electrode and having a via hole, and an upper electrode on the dielectric film; a first terminal electrode in the via hole and electrically connected to the lower electrode; and a second terminal electrode electrically connected to the upper electrode. The width of the via hole of the dielectric film is less than or equal to twice the film thickness of the first terminal electrode.

MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THEREOF

A multilayer ceramic capacitor may include three external electrodes disposed on a mounting surface of a ceramic body so as to be spaced apart from each other. When a height of a portion of the external electrode formed on one side surface of the ceramic body in a width direction is defined as d, and a thickness of the ceramic body is defined as T, a ratio of d/T satisfies 0.10≦d/T. 1. A multilayer ceramic capacitor comprising:a ceramic body including a plurality of dielectric layers stacked in a width direction and a plurality of first and second internal electrodes;first and second external electrodes disposed on a mounting surface of the ceramic body to be spaced apart from each other in a length direction of the ceramic body, and connected to the plurality of first internal electrodes; anda third external electrode disposed between the first and second external electrodes, extended from the mounting surface of the ceramic body to portions of both side surfaces of the ceramic body in the width direction, and connected to the plurality of second internal electrodes,wherein when a height of a portion of the third external electrode formed on one side surface of the ceramic body in the width direction is defined as d, and a thickness of the ceramic body is defined as T, a ratio of d/T satisfies 0.10≦d/T.2. The multilayer ceramic capacitor of claim 1 , wherein when a length of the portion of the third external electrode formed on one side surface of the ceramic body in the width direction is defined as G claim 1 , a ratio of d/G satisfies 0.143≦d/G≦0.536.3. The multilayer ceramic capacitor of claim 1 , wherein the first and second internal electrodes are disposed to be spaced apart from both end surfaces of the ceramic body in the length direction.4. The multilayer ceramic capacitor of claim 3 , wherein the first and second external electrodes are extended from the mounting surface of the ceramic body to portions of both side surfaces of the ceramic body in the width ...