System for reducing oxidation of electronic devices

LEAD FRAME CLAMPING APPARATUS FOR WIRE BONDING

본 발명은 반도체 칩 패키지 제조 공정 중에서 와이어 본딩 공정을 진행할 때 리드프레임을 고정시키는 와이어 본딩용 리드프레임 클램핑 장치에 관한 것으로서, 와이어 본딩 영역을 노출시키는 윈도우와 그 주변부에 돌출 가압부가 형성된 주 클램핑 블록과, 그 주 클램핑 블록의 양측 가장자리에 축 결합되어 있는 사이드 블록과, 그 사이드 블록의 사이에 결합되어 사이드 블록을 고정시키는 고정 블록, 및 그 고정블록이 축으로 결합된 베이스 블록을 포함하는 클램핑 플레이트와; 베이스 블록이 고정되는 고정대를 구비하는 것을 특징으로 한다. 이에 따르면, 클램핑 플레이트의 수평 조절 작업이 상하좌우 모든 부분에서 가능하고 별도의 수평 조정 작업이 자동으로 이루어질 수 있다.

WIRE CLAMP

PURPOSE: A wire clamp is provided to avoid a loss of clamping force of an actuator by making an operation unit move linearly in a fixing unit, and to remarkably reduce fabricating cost by eliminating the necessity of a hinge for precision parts like ruby or sapphire. CONSTITUTION: The inside of a lengthwise fixing unit(51) is vacant. The operation unit(52) is received inside the fixing unit. A voice coil motor is installed in a side of the fixing unit so that the operation unit can reciprocate in a lengthwise direction in the fixing unit. A side of a plate spring(53) is connected to the fixing unit and the operation unit, respectively. An operation unit pad(58) is installed at an end of the operation unit. A fixing unit pad(59) is installed at an end of the inside of the fixing unit, corresponding to the operation unit pad. © KIPO 2004 ...

Clamping plate for enhancing clamp force of a wire bonder

A clamping plate for enhancing clamp force of a wire bonder is provided for a wire-bonding process between a die and leads. The base of the clamping plate is formed with lateral protruding lips toward connecting bars of the leads, allowing an expanding for the compress area between the clamping plate and the leads, thereby providing enough clamp force to fix the leads during the bonding process, shortening the length of exposed inner leads, decreasing lessened packaging space, and reducing the cost of the package. In addition, the clamping plate is able to prevent a stitch collision due to a overclose clamping plate towards the bonding stitch in the prior arts.

WIRE BONDING METHODS AND BONDING FORCE CALIBRATION

A method of applying bonding energy to form a bond between a portion of a wire and a contact of a bonding location using a wire bonding machine is provided. The method includes: (1) moving a bonding tool towards the contact; (2) detecting when a portion of the contact (100a) is pressed against a device supporting surface (112) of the wire bonding machine; and (3) applying bonding energy to the portion of the contact such that a bond is formed between the contact and the portion of wire.

A CLAMPING ASSEMBLY

A clamping assembly (1 ) for clamping a lead frame (7) with pre-attached semiconductor device, comprising of: a first member (2) to hold the lead frame (7), said first member (2) having a surface profile in contact with a surface profile of the semiconductor device, a second member (3)for allowing the mounting of the first member (2) thereon, an attachment means to secure the first member (2) onto the second member (3), wherein the attachment means is adjustable to conform the surface profile of the first member (2) to the surface profile of the lead frame (7).

Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits

A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.

Bondhead lead clamp apparatus

An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the present invention also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. The present invention also contemplates the replacement of the fixed clamp with another, or second, independent clamp in addition to the first individual independent lead finger clamp during the wire bonding process.

Apparatus and method of clamping semiconductor devices using sliding finger supports

An apparatus for supporting lead fingers during a wire bonding process and of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.

A SEMICONDUCTOR DEVICE

A laminated semiconductor chip fabricated by fixing back surfaces of first and second semiconductor chips, respectively having a principle surface and the back surface, to each other. Each of the principle surfaces of the laminated semiconductor chip is fixed to a corresponding surface of a lead frame. A standing linear portion of a metallic wire on a ball bond side is pulled up in parallel with a side surface of the semiconductor chip in its thickness direction and a side surface of the inner lead in its thickness direction, and subjected to wire bonding. Thus formed semiconductor chip is covered by a sealing resin material so that an outer lead protrudes from a side surface of the sealing resin. Thus, the thickness of the semiconductor device can be made thin, a cost can be reduced, and a quality can be improved to deal with a tendency of increments of capacities of electronic equipments.

Tool position measurement method, offset measurement method, reference member and bonding apparatus

So as to achieve accurate detection of the bonding tool position in, for instance, a wire bonding apparatus, the positional relationship between a position detection camera and a reference hole formed in, for instance, a clamper is measured by imaging the reference hole by the position detection camera. The position detection camera and a bonding tool are moved by an XY table, and the tip end of the bonding tool is inserted into the reference hole. Then, the bonding tool is moved in the X and Y directions, and the contact of the bonding tool to an edge of the reference hole is detected based upon changes in the waveform of the ultrasonic vibrations applied to the bonding tool, thus measuring the positional relationship between the tool and the reference hole. The offset amount between the position detection camera and the bonding tool is then determined based upon the measured values and the amounts of movement of the bonding tool between the locations for such measured values.

Wire Bonder mit einer Haltevorrichtung zum Anpressen der Anschlussfinger eines Systemträgers an eine Heizplatte

Wire Bonder (W) mit einer Heizplatte (13) und einer Haltevorrichtung (1) zum Anpressen der Anschlussfinger (9) eines Systemträgers (7) an die Heizplatte (13), wobei die Haltevorrichtung (1) heb- und senkbar ist, dadurch gekennzeichnet, dass die Haltevorrichtung (1) vier Führungselemente (2) für die Lagerung einer Halteplatte (4) aufweist, wobei jedes Führungselement (2) eine Auflagefläche (3) und einen mittels eines Antriebs (6', 6) bewegbaren Bolzen (5', 5) aufweist, wobei die Halteplatte (4) in einem angehobenen Zustand der Haltevorrichtung (1) auf den Auflageflächen (3) der vier Führungselemente (2) aufliegt und wobei in einem abgesenkten Zustand der Haltevorrichtung (1) die Bolzen (5', 5) der vier Führungselemente (2) die Halteplatte (4) gegen die Anschlussfinger (9) des auf der Heizplatte (13) bereitgestellten Systemträgers (7) drücken, und wobei mindestens einer der vier Bolzen (5', 5) einzeln bewegbar ist. Wire Bonder (W) with a heating plate (13) and a holding device (1) for pressing the connection fingers (9) of a system carrier (7) to the heating plate (13), wherein the holding device (1) can be raised and lowered, characterized in that the holding device (1) has four guide elements (2) for the storage of a holding plate (4), wherein each guide element (2) a bearing surface (3) and a bolt (5 ', movable by means of a drive (6', 6), 5), wherein the holding plate (4) in a raised state the holding device (1) on the bearing surfaces (3) of the four guide elements (2) rests and wherein in a lowered state of the holding device (1) the bolts (5 ', 5) of the four guide members (2) the holding plate (4) against the connecting fingers (9) of the provided on the heating plate (13) leadframe Press (7), and wherein at least one of the four bolts (5 ', 5) individually movable is.

Wire payout measurement and calibration techniques for a wire bonding machine

CLAMP FOR WIRE BONDING OF BALL GRID ARRAY SEMICONDUCTOR PACKAGE AND METHOD FOR WIRE BONDING TEST USING THE SAME

PURPOSE: A clamp for wire bonding of a ball grid array semiconductor package and a method for wire bonding test using the same are provided to check easily a wire bonding state of a semiconductor package by using a grounding clamp with a grounding projection. CONSTITUTION: A grounding projection(21) of a clamp is contacted with a grounding solder ball land(24) when a clamp is connected electrically with a grounding line(18) of one side of a WBMS(Wire Bonding Monitoring System). A conductive wire of a capillary(CP) connected electrically with the other side of the WBMS. A multitude of bond pad(30) of a semiconductor chip(1) and a multitude of bond finger(32) of a resin circuit board(11) are bonded by the conductive wire of the capillary(CP). COPYRIGHT 2001 KIPO ...

HOLD-DOWN DEVICE FOR LEAD FRAME

PURPOSE: To clamp a lead frame positively by forming depth from a guide surface of the recessed section of a sample base in size shallower than the quantity of a pellet fitting section being displaced and holding down only a lead section by the hold-down section of a hold-down plate. CONSTITUTION: In the sample base 21, the depth of the recessed section 21b from the guide surface 21a is formed in size slightly shallower than the quantity of the pellet fitting section 12 displaced. A recessed section 21c is formed to a guide surface 21a section corresponding to the hold-down section 24a. Consequently, the lower surface of the pellet fitting section 12 is fast stuck to the recessed section 21b at all times in the lead frame 10, and the state in which there is a clearance between the lead section 14 and the guide surface 21a is brought. Accordingly, only the lead section 14 supported in a cantilever shape is pushed down by the hold-down section 24a, and the lead section 14 can be brought into ...

METHOD AND APPARATUS FOR WIRE BONDING

PURPOSE: To prevent the deformation and cutting of the bonded wire due to the vibration causal by bonding operation. CONSTITUTION: When a lead frame 3 is held between the surface of a bonding table 10 and a lead-frame pressing plate 15, a pad 1a of an IC chip 1 and a lead 2b to be connected are brought into contact with a pressure receiving metal fitting 13 of the table 10, and the connected pad 1a of an IC chip 1 and lead 2b are brought into contact with a vibration-absorbing elastic member 14 of the table 10 in this bonding method. At the surface of the bonding table 10, one or a plurality of the pads 1a and the pressure receiving metal fittings 13 corresponding to leads 2a to be connected to the pads 1a are exposed. The other part is covered with the vibration-absorbing elastic member 14. The table 10 and a bonding capillary 6 repeat the up and down motion at every time one pad 1a is connected, and the pad 1a to be connected at the next time and the lead 2a repeat the rotating motion ...

METHOD AND APPARATUS FOR TRANSFERRING LEAD FRAME

PROBLEM TO BE SOLVED: To prevent the wear of feed claws on a loader by detecting the top end of a lead frame by a positioning sensor and positioning the lead frame and then carrying a first bonding section of the lead frame, with the lead frame being chucked by the feed claws, to a bonding position. SOLUTION: A lead frame IA is on-p' to a position about 20mm before a positioning sensor 40. Then, the lead frame IA is chucked by the feeder claws 5 on a loader by closing the claws 5. Then, the lead frame IA is ' until the top end of it is detected by the positioning sensor 40. Then, the lead frame, being kept chucked by the feed claws 5 on the loader, is carried until an IC2A comes to a bonding position 7. After bonding of the IC2A is finished, a window clamper is opened and the lead frame IA is moved by the feed claws 5 on the loader to l' an IC2B to the bonding position 7. COPYRIGHT: (C)1998,JPO ...

A leadframe and a method of manufacturing a semiconductor device by use of it

Heating block and wire bonding method using the same

The invention provides a heating block for lead bonding process and a method for bonding by the heating block. The heating block comprises a heating hole formed in the center part of the heating block for heating a lead frame to be bonded; a vacuum adsorbing hole corresponding to pins of the lead frame distributed on periphery of the heating hole through the whole heating block for adsorbing the lead frame. The heating block can enable the lead frame to be fixed on the heating block firmly, thereby eliminating vibration and instability phenomenons of the pins of the lead frame in the course of bonding leads.

WIRE BONDING DEVICE

PURPOSE: To tightly contact the tip end of a lead to a frame placement stage by providing a groove at a part corresponding to the tip end of a pressing part of a frame presser on the upper surface of the frame placement stage. CONSTITUTION: Related to the upper surface of a frame placement stage 3, a groove 8 is formed at a part which receives the tip end of a pressing part 4a of a frame presser 4. When a lead 1b is pressed to a frame placement stage 3 with a rear end of the pressing part 4a of the frame presser 4, the pressing force is released to the groove 8 so that the tip end of the lead 1b will not rise for tight contact with the frame placement stage 3. Since the tip end of the lead 1b is tightly contacted to the frame placement stage 3 with a simple structure, the ultrasonic wave vibration loss at wire bonding is eliminated for improved bonding quality. COPYRIGHT 2001 KIPO ...

INSPECTION DEVICE FOR SIDE OF BONDED WIRE

PURPOSE: An inspection device for side of bonded wire is provided to eliminate the necessity that an operator additionally should monitor the side surface while a leadframe is detached, by attaching a reflecting material to the leadframe so that the side surface of the bonded wire is monitored inside a wire bonder. CONSTITUTION: A body is of an almost rectangular type. A leadframe clamp(100) includes an opening(130) for opening a chip pad of the leadframe, formed in the center of the body. The unit for monitoring the side surface of the bonded wire includes the leadframe clamp in which the reflecting material(150) is attached to an inclined part(132) at the edge of the opening. © KIPO 2003 ...

Wire bonding machine

Method for manufacturing semiconductor device

A manufacturing method is for providing an excellent wire bonding property in the manufacturing of a semiconductor device using an organic resin wiring substrate. In the manufacturing of the semiconductor device, a thermosonic wire bonding apparatus is used when the electrodes of a semiconductor element fixed to the principal surface of a substrate are connected to lines on the substrate with wires. To connect the first and second portions to be bonded of the substrate placed on a wire bonding stage with wires each held by a capillary, the wire bonding apparatus heats the capillary to a specified temperature by irradiating the capillary with a laser beam for a given period of time immediately before first bonding for connecting the wire to the first portion to be bonded and immediately before second bonding for connecting the wire to the second portion to be bonded and heats the portions of the wires to be bonded with the resulting heat, thereby connecting the wires to predetermined portions by using thermocompression and ultrasonic vibration.

Apparatus of clamping semiconductor devices using sliding finger supports

An apparatus for supporting lead fingers during a wire bonding process and method of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.

Apparatus of clamping semiconductor devices using sliding finger supports

An apparatus and method of supporting lead fingers during a wire bonding process and method of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.

Support structures and clamping systems for semiconductor devices during wire and ribbon bonding operations

A support structure for supporting a semiconductor device during a bonding operation is provided. The support structure comprises a body portion defining an upper surface configured to support a semiconductor device during a bonding operation. The upper surface defines a constraining feature for constraining at least a portion of the semiconductor device during the bonding operation.

Die paddle clamping method for wire bond enhancement

A leadframe configuration for a semiconductor device has a die attach paddle with paddle support bars. In addition, clamp tabs extend outwardly from lesser supported locations of the paddle to underlie a conventional lead clamp. The clamp tabs are formed as an integral part of the paddle. Normal clamping during die attach and wire bonding operations prevents paddle movement and enhances integrity of the die bond and wire bonds.

Window clamp and method of alignment of lead frame strip utilizing the same

METHOD OF MEASURING POSITION OF TOOL, METHOD OF MEASURING OFFSET, REFERENCE MEMBER AND BONDING DEVICE

PURPOSE: To accurately detect the position of a tool. CONSTITUTION: A reference hole 30 is photographed by a camera 7 for detecting a position, and the positional relationship of the camera 7 for detecting the position and the reference hole 30 is measured. The camera 7 for detecting the position and the tool 4 are moved by XY tables 1, the front end of the tool 4 is inserted into the reference hole 30, and moved in the XY directions, and the positional relationship of the tool 4 and the reference hole 30 is measured by detecting the abutting of the tool 4 and the reference hole 30 based on the waveform change of ultrasonic vibrations applied to the tool 4. The quantity of the offset is obtained based on both measured values and movement during that time. © KIPO & JPO 2002 ...

LEAD FRAME GRIPPER FOR PREVENTING IMPACT BETWEEN PAD STRUCTURE AND LEAD FRAME AND IMPROVING HOLDING POWER BETWEEN FIXED PAD AND MOVING PAD OF PAD STRUCTURE AND WIRE BONDING APPARATUS WITH THE SAME

PURPOSE: A lead frame gripper and a wire bonding apparatus with the same are provided to restrain the impact between a pad structure and a lead frame and to enhance holding power between a fixed pad and a moving pad of the pad structure. CONSTITUTION: A lead frame gripper includes a fixed frame, a fixed pad, a moving frame, a working cylinder, and a moving pad. The fixed pad(32) is installed at one end portion of the fixed frame. The moving frame(33) is hinge-connected with the other end portion of the fixed frame, so that the moving frame is capable of rotating in a vertical direction against the fixed frame. The working cylinder(34) is used for rotating the moving frame. The moving pad(35) is installed opposite to the fixed pad. The moving pad is connected with the fixed pad at an end portion of the moving frame. © KIPO 2006 ...

SEMICONDUCTOR DEVICE SUPPORT FOR BONDING

In one embodiment, a support structure comprises a base, a compliant layer, and a protective layer which is used to secure a semiconductor device, such as a lead-frame, to a window clamp during a bonding process. The compliant layer distributes even loading over the surface of the semiconductor device while clamped. In other embodiments, the compliant layer may be segmented into individual portions corresponding with openings in the window clamp. The window clamp may also have a compliant layer and a protective layer and may be used with or without a compliant layer on the support structure. Features on the protective layer may be included to support structures of the semiconductor device.

Bondhead lead clamp apparatus and method

An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the present invention also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. The present invention also contemplates the replacement of the fixed clamp with another, or second, independent clamp in addition to the first individual independent lead finger clamp during the wire bonding process.

Methods for lead penetrating clamping system

An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method include the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provide for the use of either a penetrating or non-penetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.

Electrically conductive pattern printer for downhole tools

A device which prints an electrically conductive pattern on a downhole tool using electrical ink includes a print head assembly and gripper claw assembly to print and manipulate the downhole tool during printing, respectively. The electrically conductive pattern may be an antenna coil, circuit or other desired pattern. After printing, the accuracy of the pattern is verified by the system and an impact resistant coating is applied to the pattern.

Die paddle clamping method for wire bond enhancement

A leadframe configuration for a semiconductor device has a die attach paddle with paddle support bars. In addition, clamp tabs extend outwardly from lesser supported locations of the paddle to underlie a conventional lead clamp. The clamp tabs are formed as an integral part of the paddle. Normal clamping during die attach and wire bonding operations prevents paddle movement and enhances integrity of the die bond and wire bonds.

LEAD FRAME STAY DEVICE

PURPOSE: To facilitate the fixing and removal of a stay for cutting down the replacement time thereof by a method wherein, while abutting a lead frame stay against abutting surfaces of frame stay fixture, the stay is aligned through the intermediary of this guide parts and then the stay vacuum sucked is fixed on the fixture. CONSTITUTION: A lead frame stay fixture 4 vertically movable is formed into a flat U-shape frame while both end upper surfaces of a lead frame stay 6 are abutted against the lower surface of both ends of the frame to present abutting surfaces 7 rectangular and recessed to fix the stay 6. Simultaneously, guide parts 8 abutting against the outer periphery of the stay 6 are formed on the step parts of respective abutting surfaces. Furthermore, suction holes 9 are made inside the fixture 4; opening ends are connected to a vacuum suction source not shown in figures; the stay 6 is fixed to the fixture 4 through the intermediary of the other suction holes 10 and the suction ...

Semiconductor device and method of its fabrication

Wire bonder for preventing electrical over-stress damage

WIRE BONDER FOR TREATING PROPERLY SYSTEM CARRIER WITH SMALL PITCH RANGE USING DOWN HOLDER FOR COMPRESSING FINGERS OF SYSTEM CARRIER ON HEATING PLATE

PURPOSE: A wire bonder is provided to treat properly a system carrier with a small pitch range of 40 m or less by using a down holder for compressing fingers of the system carrier on a heating plate. CONSTITUTION: A wire bonder includes a heating plate(13) and a down holder(1) for compressing fingers(9) of a system carrier(7) on the heating plate. The down holder is capable of moving up and down. The down holder includes four guide members(2) for supporting a support plate(4). Each guide member includes a support surface(3) and a bolt(5) capable of being moved up and down using a driving part(6). The support plate is loaded on the support surfaces of the four guide members when the down holder is lifted. When the down holder is descended, the bolt compresses the fingers of the system carrier on the heating plate. © KIPO 2005 ...

SUPPORT STRUCTURES AND CLAMPING SYSTEMS FOR SEMICONDUCTOR DEVICES DURING WIRE AND RIBBON BONDING OPERATIONS

A support structure for supporting a semiconductor device during a bonding operation is provided. The support structure comprises a body portion defining an upper surface configured to support a semiconductor device during a bonding operation. The upper surface defines a constraining feature for constraining at least a portion of the semiconductor device during the bonding operation.

METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON A WIRE BONDING MACHINE, AND APPARATUSES FOR PERFORMING THE SAME

A method of teaching bonding locations of a semiconductor device on a wire bonding machine is provided. The method includes (1) providing the wire bonding machine with position data for (a) bonding locations of a first component of the semiconductor device, and (b) bonding locations of a second component of the semiconductor device; and (2) teaching the bonding locations of the first component of the semiconductor device and the second component of the semiconductor device using a pattern recognition system of the wire bonding machine to obtain more accurate position data for at least a portion of the bonding locations of the first component and the second component. The teaching step is conducted by teaching the bonding locations in the order in which they are configured to be wire bonded on the wire bonding machine.

WIRE PAYOUT MEASUREMENT AND CALIBRATION TECHNIQUES FOR A WIRE BONDING MACHINE

A method of calibrating a wire payout related to predetermined looping motions used during formation of a wire loop is provided. The method includes the steps of: (a) determining a first wire payout length related to predetermined wire looping motions used in the formation of a first of the wire loop, the predetermined looping motions being performed on a first wire bonding system; (b) determining a second wire payout length related to the predetermined wire looping motions used in the formation of a second of the wire loop; and (c) adjusting at least one wire bonding process variable, and repeating step (b) with the at least one adjusted wire bonding process variable such that the second wire payout length determined in the repeated step (b) is closer to the first wire payout length than the second wire payout length determined in the initial step (b).

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

A semiconductor element ( 10 ) is secured to an island ( 7 ), and a plurality of through-holes ( 8 ) are formed in the portion of the island ( 7 ), which surrounds the area to which the semiconductor element ( 10 ) is secured. Further, the electrode pads of the semiconductor element ( 10 ) and leads ( 4 ) are electrically connected by copper wires ( 11 ). In this structure, the cost of materials is reduced by using the copper wires ( 11 ) in comparison with gold wires. Further, a part of a resin package ( 2 ) is embedded in through-holes ( 8 ), so that the island ( 7 ) can be easily supported within the resin package ( 2 ).

Lead penetrating clamping system

An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method includes the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provides for the use of either a penetrating or non-penetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.

A leadframe and a method of manufacturing a semiconductor device by use of it

The appratus for gripping a window clamp

WIRE CLAMP FOR STABILIZING OPERATION OF DRIVING UNIT BY RECONCILING THE CENTER OF GRAVITY OF THE DRIVING UNIT

PURPOSE: A wire clamp is provided to stabilize efficiently the operation of a driving unit by reconciling the center of gravity of the driving unit with a pivot center. CONSTITUTION: A wire clamp(2) includes a fixed body, a moving body, a clamping pad, a pivot unit, and a disc type piezo driving unit. The fixed body(21) is fixedly installed at a bonding head link. The moving body(22) is installed on the fixed body, the clamping pad(23) is installed opposite to one end portion of each of the fixed body and moving body. The clamping pad is used for clamping a wire. The pivot unit(24) is used for fixing the other end portion of the moving body to the fixed body. The disc type piezo driving unit(25) is installed between the moving body and fixed body to control the motion of the moving body. © KIPO 2006 ...

HEAT BLOCK CAPABLE OF DISCHARGING ELECTRICITY AND THUS PREVENTING ELECTRIC ELEMENT FROM BEING BURNED OUT, WHILE HOLDING THE ELECTRIC ELEMENT SECURELY IN PLACE

PURPOSE: A heat block is provided to discharge electricity while holding an electric element and to prevent the electric element from burned-out due to unexpected electric current or potential. CONSTITUTION: A heat block(100) for securing an electric element(200) comprises: a base(110); and one or more discharging elements(130) arranged on the base, wherein the discharging elements are electrically-conductive and grounded, the electric element is placed on the base, and the discharging elements are in contact with an electric contact of the electric element. © KIPO 2008 ...

Electrically Conductive Pattern Printer for Downhole Tools

A device which prints an electrically conductive pattern on a downhole tool using electrical ink includes a print head assembly and gripper claw assembly to print and manipulate the downhole tool during printing, respectively. The electrically conductive pattern may be an antenna coil, circuit or other desired pattern. After printing, the accuracy of the pattern is verified by the system and an impact resistant coating is applied to the pattern.

MANUFACTURE OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To laminate a plurality of semiconductor chips, sealing them with a resin-sealing body, and make thin a semiconductor device by adhering and fixing first and second semiconductor chips while the surface and backside face each other and the positions are shifted in the direction that orthogonally crosses the arrangement direction of an electrode. SOLUTION: Semiconductor chips 4 and 5 are adhered and fixed via an adhesive layer 7 while the backsides face each other so that the other long side 4A2 of the semiconductor chips and one long side 5A1 face the side of a lead 10B. Then, the laminates of the semiconductor chips 4 and 5 are supported by a support lead 8, and the support lead 8 is adhered and fixed to a main surface 4A of the semiconductor chip 4 via the adhesive layer 8. As a result, no tabs exist between the semiconductor chips 4 and 5 and at the same time only one adhesive layer exists, thus reducing distance from the main surface 4A of the semiconductor chip ...

WIRE BONDING DEVICE

PURPOSE:To minimize the thermal deformation of a tab-hanging lead in a lead frame, and to improve the reliability of wire bonding by using brass having high thermal conductivity as a heat block for a wire bonding device and allowing a hold-down section for the tab-hanging lead for a lead hold-down jig to project to a section slightly lower than a hold-down section for a lead terminal. CONSTITUTION:Since a heat block 1 is composed of brass having high thermal conductivity, a lead frame 2 is heated instantaneously up to the deformation saturation region of the lead frame 2 by the heat block 1, and the thermal deformation of the lead frame 2 at the time of bonding is inhibited minimally. A tab-hanging hold-down section 9 is formed to a section lower than a lead terminal hold-down section 10 in a lead hold-down jig 7, thus positively pressing a tab-hanging lead 3 by small force.

WIRE BONDING EQUIPMENT

PURPOSE: To bring the die pad part of a lead frame into contact with the die pad mounting part of a heat adapter without forming a gap, at the time of clamping. CONSTITUTION: Notched parts 31a, 31b are formed in the die pad mounting part 31 of a heat adapter 30. Die pad suspension part fixing parts 23a, 23b of a lead frame 20 are mounted on the notched parts 31a, 31b, and clamped. COPYRIGHT: (C)1996,JPO ...

Window clamp and method of aligning lead frame strip

The present invention relates to a window clamp and a method of aligning a lead frame strip and which makes the alignment precise, fast and increases yield by sensing an alignment condition of a die (6) and a lead frame by utilizing a window clamp (25B) formed with a bonding window (22A) and a lead sensing window (22B) and by utilizing an image sensing means to monitor the wire bonding equipment and to prevent the occurrence of wire bond misalignment.

Method of manufacturing semiconductor device, and wire bonder

本发明涉及用于制造半导体器件和接线键合器的方法。具体地，通过减小引线框或者布线衬底在接线键合之后的颤动，实现了接线键合质量的改进。在接线键合器的接线键合部分的加热块之上，提供冷却风机，用于冷却经过接线键合的矩阵框，从而使其温度可以逐步降低。在接线键合之后，冷空气从冷却风机吹送到矩阵框，并且执行对矩阵框的温度控制，从而使矩阵框的温度在接线键合之后可以逐步降低。或者，利用诸如框保持部件、引导部件、滚轴装置或者弹性装置的保持工具来固定经过接线键合的矩阵框，直到冷却完成。

Bonding device and bonding method

A bonding device of this embodiment includes: a first blower part (11h) generating a first airflow (D1) from a bonding opening (26) that is formed at a conveyer (20) to traverse an imaging space (VS) for identifying a bonding target; and a second blower part (12h) generating a second airflow (D2) along the imaging space. The second blower part (12h) forms a barrier with the second airflow (D2) to suppress a surrounding gas (G2) from being involved into the imaging space (VS) by the first airflow (D1), thereby suppressing influence of heat wave that is generated by the bonding target, such as a substrate or a lead frame.

SUPPORT SYSTEM FOR A SEMICONDUCTOR DEVICE

A support system for a semiconductor device during a wire or ribbon bonding operation is provided. The support system includes a body portion defining an upper surface. The upper surface has an upper surface contact region configured to support at least a portion of a lower surface of a semiconductor device at a lower surface contact region during a wire or ribbon bonding operation. The support system also includes a plurality of protrusions on the upper surface contact region.

Method for manufacturing a semiconductor device having a heat radiator

A highly reliable semiconductor device and a method of manufacturing the same. The semiconductor device is constituted by a semiconductor element which is disposed within a space portion defined by leads of a lead frame or fixed to a die pad of a lead frame and which has bonding pads connected to the leads through wires respectively, and a heat radiation block/plate which is made of a good thermally conductive material and which has an outer periphery having a size sufficiently to overlap the leads so that the heat radiation block/plate is disposed on the leads partly through a tape-like insulator, the semiconductor element being disposed on a center portion of the heat radiation block/plate directly or through the die pad. The semiconductor device is sealed with resin or the like with part of the leads and an end surface of the heat radiation block/plate left exposed or with part of the leads left exposed.

Bondhead lead clamp methods

A method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The method includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the method also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding and also provides for the replacement of the fixed clamp with another, or second, independent clamp.

Apparatus and method of clamping semiconductor devices using sliding finger supports

An apparatus and method of supporting lead fingers during a wire bonding process and of preventing the bonding apparatus and clamping assembly from applying force against the die are available. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.

Bondhead lead clamp apparatus and method

An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the present invention also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. The present invention also contemplates the replacement of the fixed clamp with another, or second, independent clamp in addition to the first individual independent lead finger clamp during the wire bonding process.

Lead frame gripper and wire bonding apparatus therewith

CLAMPING STRUCTURE IN A WIRE BONER CAPABLE OF PERFORMING WIRE BONDING USING AN ULTRASONIC WAVE

PURPOSE: A clamping structure in a wire boner is provided to eliminate defects due to wire bonding, thereby increasing productivity. CONSTITUTION: A power unit is installed on a table of a wire bonder. The power unit includes a rotation shaft, a motor, and a cam. The motor transfers power to the rotation shaft by a belt. An elevation unit is elevated by the power unit. The elevation unit includes an elevation rod, a linear bushing, an elevation block, and a spring. A clamp(140) is coupled with the top of the elevation unit. COPYRIGHT KIPO 2011 ...

Window clamp and method of alignment of lead frame strip utilizing the same

Leadframe diepad

The leadframe diepad island 14 is generally square shaped with added projections 14a and 14b. During die or wire bonding of a semiconductor chip to the island 14 the leadframe is held on the stage on which it is placed by pressing pins against the projections 14a,b.

GAS DELIVERY SYSTEM FOR REDUCING OXIDATION IN WIRE BONDING OPERATIONS

Wire bonding device

To tightly contact the tip end of a lead to a frame placement stage using simple structure. A groove 8 is disposed at a corresponding part which receives the tip end of a pressing part 4a of a frame presser 4 on the upper surface of a frame placement stage 3.

Ultrasonic bonding jig, bonding structure, and bonding method

An ultrasonic bonding jig includes: a base; and a protrusion portion which has a protrusion portion end surface approximately parallel to the base and which has a pair of first walls, the pair of first walls being disposed upright approximately perpendicular to the base from opposed sides of the protrusion portion end surface. A bonding structure includes a bonding portion of a metal plate and a base material. The bonding portion has a recessed portion with a closed bottom on a surface of the metal plate, and the recessed portion has a pair of walls approximately perpendicular to the surface of the metal plate.

Thermal board used for bonding wires in semiconductor manufacturing process

A thermal board is used for bonding wires in semiconductor manufacturing process for providing high temperature to increase the wire bonding efficiency while preventing the die paddle of a lead frame from being oxidized. The thermal board has a base board and a platform disposed on the base board. The platform has a center portion defined therein a chamber to receive the die paddle. A plurality of supporting posts are formed on the bottom of the chamber to support the die paddle so that the die paddle does not directly contact with the bottom of the chamber.

A SEMICONDUCTOR DEVICE

A laminated semiconductor chip fabricated by fixing back surfaces of first and second semiconductor chips, respectively having a principle surface and the back surface, to each other. Each of the principle surfaces of the laminated semiconductor chip is fixed to a corresponding surface of a lead frame. A standing linear portion of a metallic wire on a ball bond side is pulled up in parallel with a side surface of the semiconductor chip in its thickness direction and a side surface of the inner lead in its thickness direction, and subjected to wire bonding. Thus formed semiconductor chip is covered by a sealing resin material so that an outer lead protrudes from a side surface of the sealing resin. Thus, the thickness of the semiconductor device can be made thin, a cost can be reduced, and a quality can be improved to deal with a tendency of increments of capacities of electronic equipments.

MANUFACTURING DEVICE OF SEMICONDUCTOR DEVICE, HEAT PLATE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a manufacturing device of a semiconductor device which can reduce wire bonding failures. SOLUTION: A heat plate 22 of a wire bonding device 21 has a preliminary heating part 31 and a regular heating part 32. The preliminary heating part 31 is provided with a cleaning mechanism 34 constituted of a wire brush 34a. Thereby, burr, projection or foreign matters generated in a rear of an inner lead 15, or a part projected by peeling of plating is removed when passing through the preliminary heating part 31 by each wire brush 34a. COPYRIGHT: (C)2004,JPO ...

WIRE CLAMPER OF WIRE BONDING DEVICE

PURPOSE: A wire clamper of a wire bonding device is provided to effectively dampen the vibration between a moving terminal lever and a fixing terminal lever by adopting a damping device for reducing the frictional force. CONSTITUTION: A wire clamper of a wire bonding device comprises a fixing terminal lever(1) coupled to a wire bonding head. Moving terminal levers(2,3) are pivotably coupled to the fixing terminal lever(1) through a leaf spring. Plates(4,5) are attached to one ends of the moving terminal levers(2,3) and the fixing terminal lever(1). A voice coil motor is attached to the other ends of the moving terminal levers(2,3) and the fixing terminal lever(1) so as to rotate the levers. A damping device is provided between the moving terminal levers(2,3) and the fixing terminal lever(1) so as to dampen the frictional force generated between the moving terminal levers(2,3) and the fixing terminal lever(1). COPYRIGHT 2001 KIPO ...

WIRE BONDING APPARATUS AND METHOD OF BONDING USING THE SAME

PURPOSE: A method of wire bonding is to recognize bonding point, using a plurality of cameras, during wire bonding, thereby reducing a packaging time. CONSTITUTION: A wire bonding CPU(100) allocates all of the chips to a serial number. The serial number is allocated with order which the chips enter a window clamper. The ith chip is initialized as value of 1. The ith chip is moved to a main operating region of the window clamper. A main camera is positioned to the main operation region. A serve camera is positioned to a serve operation region. Using the main/serve camera, the image of both the ith chip and (i+1)th chip is obtained. The bonding point of the (i plus one)th chip is recognized by another CPU. When the wire bonding of the ith chip is completed, the wire bonding of the (i+1)th chip is continuously performed. If the chip which is not wire-bonded remains, the value of 'i' is increased with two chips unit. COPYRIGHT 2001 KIPO ...

WIRE BONDING APPARATUS USING PROTRUDED PORTION FOR PREVENTING ELECTRICAL OVER-STRESS DAMAGE

PURPOSE: A wire bonding apparatus is provided to restrain electrical over-stress damage by using a first and a second protruded portion of a window clamp and a heater block. CONSTITUTION: A wire bonding apparatus includes a heater block and a window clamp. The heater block(3) is used for supporting a substrate(6) and heating the substrate. The substrate has predetermined terminals electrically connected with bonding pads of a semiconductor chip. The window clamp includes a window and a first protruded portion. The window is used for exposing a wire bonding portion between the substrate and the semiconductor chip to the outside. The first protruded portion is used for pressurizing the substrate against the heater block. The heater block includes a second protruded portion electrically connected with the last input/output terminal of the substrate. © KIPO 2007 ...

WIRE BONDING APPARATUS AND METHOD FOR WIRE BONDING USING THE SAME

PURPOSE: A wire bonding apparatus and a method for wire bonding using the same are provided to increase the productivity of a wire bonding apparatus by reducing a time necessary for wire bonding. CONSTITUTION: A multitude of camera(21a,21b,21c) is formed at a bond head(23). A multitude of working area(26a,26b,26c) is formed on a window clamper(26) corresponding to the cameras(21a,21b,21c). A multitude of semiconductor chip(24a,24b,24c) are adhered to a lead frame(25). The bond head(23) has a transducer(22) for bonding a wire on a chip. An interval between adjacent cameras corresponds to an interval(A') between adjacent semiconductor chips. An interval(A) between two adjacent work areas corresponds to the interval(A') between the adjacent semiconductor chips. COPYRIGHT 2001 KIPO ...

Wire bonder with a downholder for pressing the fingers of a system carrier onto a heating plate

A Wire Bonder (W) has a downholder (1) for pressing the fingers (9) of a system carrier (7) onto a heating plate (13). The downholder (1) can be raised and lowered. A downholder (1) in accordance with the invention contains four guide elements (2) for bearing a holding plate (4), whereby each guide element (2) has a supporting surface (3) and a bolt (5', 5) that can be moved by means of a drive (6', 6). In the raised condition of the downholder (1), the holding plate (4) rests on the supporting surfaces (3) of the four guide elements (2). In the lowered condition of the downholder (1), the bolts (5', 5) of the four guide elements (2) press the holding plate (4) against the fingers (9) of the system carrier (7) presented on the heating plate (13). At least one of the four bolts (5', 5) can be moved separately so that the holding plate (4) can temporarily anchor the system carrier (7) without already pressing all fingers (9) against the heating plate (13).

SEMICONDUCTOR DEVICE SUPPORT FOR BONDING

In one embodiment, a support structure comprises a base, a compliant layer, and a protective layer which is used to secure a semiconductor device, such as a lead-frame, to a window clamp during a bonding process. The compliant layer distributes even loading over the surface of the semiconductor device while clamped. In other embodiments, the compliant layer may be segmented into individual portions corresponding with openings in the window clamp. The window clamp may also have a compliant layer and a protective layer and may be used with or without a compliant layer on the support structure. Features on the protective layer may be included to support structures of the semiconductor device.

Wire bonder with a downholder for pressing the fingers of a system carrier onto a heating plate

A Wire Bonder has a downholder for pressing the fingers of a system carrier onto a heating plate. The downholder can be raised and lowered. A downholder in accordance with the invention contains four guide elements for bearing a holding plate, whereby each guide element has a supporting surface and a bolt that can be moved by means of a drive. In the raised condition of the downholder, the holding plate rests on the supporting surfaces of the four guide elements. In the lowered condition of the downholder, the bolts of the four guide elements press the holding plate against the fingers of the system carrier presented on the heating plate. At least one of the four bolts can be moved separately so that the holding plate can temporarily anchor the system carrier without already pressing all fingers against the heating plate.

BOND SURFACE CONDITIONING SYSTEM FOR IMPROVED BONDABILITY

Thick film bond surfaces (8 ) on a support structure (10), such as a ceramic substrate or an IC package substrate, tend to deform during processing. A personality kit (16 ) having raised bosses (24 ) engages with and compresses the bond surfaces, resulting in a flatter, wider bond surface having improved reflectivity. The personality kit (16 ) is fit within a clamp (30 ) that can be used as a stand-alone unit or integrated into an existing machine, such as a wire bonder (46).

SMART INDEXING HEAD FOR UNIVERSAL LEAD FRAME WORK STATION

Apparatus and a method for orienting individual bonding sites of a lead frame having a plurality of bonding sites includes a universal work station in a work holder. The work holder comprises a gripper mechanism which is mounted on a transverse rail or bar for grasping a lead frame at an edge portion thereof while exposed in a supply magazine. The jaws of the gripper mechanism are pivoted in a horizontal direction which permits the exposed edge of the lead frame to be aligned parallel to a reference plane in a theta orientation direction. While oriented in the theta orientation direction, the lead frame is moved precisely to the window of the work station of the work holder where it is clamped by the top plate and lower plate of the work station before being subsequently bonded. A modified feature of the invention permits the mechanically theta oriented bonding site to be viewed by a PRS system and reoriented in an X and Y position prior to being clamped in the work station to provide a very high degree of theta, X and Y location of individual bonding sites in the window of a work station prior to bonding.

Die paddle clamping method for wire bond enhancement

A leadframe configuration for a semiconductor device has a die attach paddle with paddle support bars. In addition, clamp tabs extend outwardly from lesser supported locations of the paddle to underlie a conventional lead clamp. The clamp tabs are formed as an integral part of the paddle. Normal clamping during die attach and wire bonding operations prevents paddle movement and enhances integrity of the die bond and wire bonds.

Lead penetrating clamping system

An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method include the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provide for the use of either a penetrating or nonpenetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.

PRESSER OF LEAD FRAME FOR ELECTRONIC COMPONENT AND PRESSING METHOD USING THIS PRESSER

PURPOSE: To increase the reliability of wire bonding by stabilizing the pressed and fastened condition of lead terminals on a lead frame. CONSTITUTION: In a pressure equipment which is provided with a heater block 1 which heats an island A1 on which a semiconductor element is mounted and a plurality of lead terminals A2 which are connected to the semiconductor element by abutting them and a pressing body 5 which moves down towards the heater block and which abuts each lead terminal, projections 4 which face the tip of the lead terminals are formed on the heater block when mounting the lead frame on the heater block. COPYRIGHT: (C)1995,JPO ...

Wire welding machine and semiconductor device processing method

Bondhead lead clamp apparatus and method

An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the present invention also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. The present invention also contemplates the replacement of the fixed clamp with another, or second, independent clamp in addition to the first individual independent lead finger clamp during the wire bonding process.

RESIN-SEALED SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To suppress cracks from growing to provide a thin device by contacting leads to a circuit forming face of a semiconductor element and adhering this element to a chip support with an insulation tape to thereby connect them, without fixing the leads to the circuit-forming face. SOLUTION: A semiconductor element 1 has a polyimide wafer coat 9 on a circuit-forming face and is mounted on a lead frame having leads 3 and chip support 10 between which the support 10 is adhered and fixed to the wafer coat 9 through an insulation tape 2 with the leads 3 not fixed to the wafer coat 9 but remaining in contact with the wafer coat 9. An Au wire plating on the upper surfaces of the leads 3 is connected to Au balls 5 on the semiconductor element 1 through Au wires 6 and the outside thereof is sealed with a resin 7 and cut off from the lead frame. COPYRIGHT: (C)1997,JPO ...

WIRE BONDING PROCESS

PURPOSE: To prevent bonding wires and a bonding pad from short-circuiting with each other by a method wherein wire leads are held positions lower than the chip bonding pad to be bonded onto the bonding wires and then the wire leads are pushed up. CONSTITUTION: A chip bonding pad 1 and wire leads 2 fixed into one body are fixed on a bench 8 with protrusions 8'. First, the wire leads 2 are pressed down by wire lead press down jigs 9 using the protrusions 8' as falcrums as shown by arrows P by around 0.5W1.0(mm) and then bonding wires 3 are bonded onto a semiconductor chip 4 and the wire leads 2. Second, the wire lead press down jigs 9 are released as shown by arrows P'. Through these procedures, the wire leads 2 can be reset to their original positions by their own elasticity so that the bonding wires 3 kept in contact with the chip pad 1 may be released interlocking with the resetting action from the pad 1 making a proper gap (0.4W0.7mm) between the bonding wires 3 and the pad 1. COPYRIGHT ...

DRAHTVERBINDUNG.

WIRE CLAMP OF WIRE BONDER FOR FABRICATING SEMICONDUCTOR PACKAGE

PURPOSE: A wire clamp of a wire bonder for fabricating a semiconductor package is provided to reduce a wire bonding error by changing raw materials of elements of a wire clamp and a structure of the wire clamp. CONSTITUTION: A piezoelectric element(8) is installed in a main body(1) of a clamp. A reference plate(2) is extended from one side of the main body(1). A control plate(3) faces the reference plate(2). The control plate(3) is combined with a fixing screw(7). Clamp pads(4) are adhered to each end portion of the reference plate(2) and the control plate(3). A screw(9) for controlling a gap is installed at a rear end portion of the reference plate(2) in order to control a gap between the clamp pads(4) by changing a position of the piezoelectric element(8) of the reference plate(2). The clamp pad(4) is formed by a sapphire material. An elastic member(10) such as a plate spring is inserted between the reference plate(2) and the control plate(3). © KIPO 2003 ...

A CAPILLARY FOR A WIRE BONDING APPARATUS AND A METHOD FOR FORMING AN ELECTRIC CONNECTION BUMP USING THE CAPILLARY

HEAT BLOCK

Apparatus and method for wire bonding

A kind of wire bonding apparatus and method are disclosed in the present invention, in which it is capable of keeping the top of the apparatus at a required temperature while keeping a resin substrate at a temperature that no softening or no deformation of the resin substrate is occurred during wire bonding. The invention is provided with the followings: a chip heating means 20, which is installed above a heating block 4 having a heater 11 to heat a chip 3 of the apparatus 1; and a cooling pipe 10, which is installed at the heating block 4 for cooling the heating block 4 and keeps the bonding surface of the apparatus 1 at a temperature suitable for bonding so as to cool the temperature of heating block 4 with cooling water or cooling air flowing through the cooling pipe 10 and keep it at low temperature so that the resin substrate 2 is not softened.

Gas delivery system for reducing oxidation in wire bonding operations

A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.

Packaging Integrated Circuits

An integrated circuit 15 is placed onto a lead frame 101 having lead fingers 109 of substantially constant thickness along their length. Wires are formed from the lead fingers 109 to corresponding electrical contacts the integrated circuit. Following the wire bonding process, the thickness of the tips of the lead fingers 109 is reduced by a laser process, to form tips of reduced thickness desirable for a subsequent moulding operation. Thus, at the time of the wire bonding the tips of the fingers 109 need not have a gap beneath them, so that more secure wire bonds to the lead fingers 109 can be formed.

Support structures and clamping systems for semiconductor devices during wire and ribbon bonding operations

A support structure for supporting a semiconductor device during a bonding operation is provided. The support structure comprises a body portion defining an upper surface configured to support a semiconductor device during a bonding operation. The upper surface defines a constraining feature for constraining at least a portion of the semiconductor device during the bonding operation.

Wire bonding process

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

A method and device for transferring lead frame

로더측 이송클릭이 마모하지 않고, 이 때문에 장기간 사용하더라도 리드프레임의 위치 어긋남이 발생하지 않는다. 또 로더측 매거진이나 가이드레일등의 소음진동 등이 있더라도 리드프레임의 위치어긋남은 발생하지 않고, 또한 히터의 열에 의한 변형이나 로더측 이송클릭의 바로잡음에 의한 리드프레임의 위치어긋남이 발생하더라도 본딩 위치에의 리드프레임의 이송어긋남이 발생하지 않았다. The loader-side feed click does not wear out, and therefore, even when used for a long time, the position shift of the lead frame does not occur. The position of the lead frame does not occur even if there are noise vibrations such as the magazine on the loader side or the guide rail, and the position of the lead frame is caused by the deformation of the heater or the misalignment of the loader click. There was no transfer misalignment of the lead frame to the edge. 본딩위치(7)의 근방에서 로더측 매거진(20A)측에 설치된 위치결정센서(40)로리드프레임(1)(1A, 1B,...)의 선단을 검출하여 위치결정을 행하고, 위치결정후에 리드프레임(1)을 이송클릭(5)으로 척킹한 상태에서 리드프레임(1)의 최초의 본딩 부분(2A)을 본딩위치(7)까지 반송한다. Positioning is performed by detecting the leading end of the lead frame 1 (1A, 1B, ...) of the positioning sensor 40 provided on the loader side magazine 20A side near the bonding position 7. Thereafter, the first bonding portion 2A of the lead frame 1 is conveyed to the bonding position 7 in the state where the lead frame 1 is chucked with the transfer click 5.

Connecting method of body and discharge electrode used for said method

Substrate fixing device and substrate fixing structure

Production of semiconductor device

Wire bonding method

Wire bonding device

Wire bonding equipment

Oilless compressor

(57)【要約】 【課題】 複数の半導体デバイスが搭載されたリードフ レームのデバイス近傍を同時にクランプする場合であっ ても、その平行調整を容易に行うことができるウインド クランパーを提供すること。 【解決手段】 クランプする複数の半導体デバイスに対 応するプレート部材１１，１３を独立して動作するよう にベースプレート１５に接続し、かつ、各プレート部材 １１，１３を回転自在に軸１７で軸止した構成のウイン ドクランパーを用いることにより平行調整を容易に行う ことができる。

Semiconductor device

In order to improve the mounting accuracy of QFN (Quad Flat Non-leaded package) having external connection terminals on a rear surface of the package, a semiconductor device and its manufacturing method are provided. In the QFN, notch sections are provided in the two diagonal corner portions on the front surface of the sealing body. Reference marks with a circular form are formed in the parts of the suspension leads exposed from the notch sections so that the positions of the reference marks can be optically detected from above the sealing body when mounting the QFN to the wiring board. The reference marks are formed by the etching to remove the parts of the metal plate that constitutes the suspension leads or by pressing the parts to punch them.

Gold alloy wire for bonding

(57)【要約】 【課題】 半導体装置が過酷な熱サイクルの環境に晒さ れても断線を抑制し、また樹脂封止の際のワイヤ流れを 小さくし、さらに振動破断性能を向上させたワイヤボン ディング用金合金線の提供。 【解決手段】 高純度金にＺｎ，Ｃｏ，Ｍｏ，Ｃｒのう ち少なくとも１種を０．１〜３．０重量％、Ｌａ，Ｅ ｕ，Ｂｅ，Ｙ，Ｃａのうち少なくとも１種を１〜１００ 重量ppm 含有させる。

Gold alloy wire for bonding on semiconductor device

(57)【要約】 【課題】 銅合金製のリードフレームを用いた半導体装 置が過酷な熱サイクルの環境に晒された場合でも、断線 を抑制する効果が向上すること、及びボンディング時の ループ形状を安定させる為に、ボンディング時の加熱温 度を１５０℃と低温度で行いながらセカンド側接合点で の接合性、とりわけピール強度及び振動破断性能が向上 した金合金線を提供すること。 【解決手段】 銀（Ａｇ）を０．６〜５０重量％、Ｃ ｕ，Ｉｎ，Ｓｎ，Ｐｂ，Ｓｂ，Ｔｉ，Ｌａ，Ｅｕ，Ｙｂ のうち少なくとも１種を１〜５００重量ppm 、及び残部 が金及び不可避不純物からなる半導体素子ボンディング 用金合金線。

Gas delivery system for reducing oxidation in wire bonding operations

GAS DELIVERY SYSTEM FOR REDUCING OXIDATION IN WIRE BONDING OPERATIONSA wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation areaFig. 1B

Lead of semiconductor device

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Pressing structure for lead frame

Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits

A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.

Method of fixing curved circuit board and wire bonding apparatus

A method of holding a curved circuit board in a flat fashion and a wire bonding apparatus thereof, including suction cavities provided in a suction stage to which a curved circuit board is suctioned. While evacuating air from the vacuum suction cavities, a capillary attached to the tip end of a bonding arm is lowered to press a part of the curved circuit board down thus having at least one of the vacuum suction cavities sealed by the circuit board, allowing the remaining vacuum suction cavities to be sealed successively so that the curved circuit board is straightened to be flat and suction-held on the suction stage. The vacuum suction cavities are sealed with by straightened circuit board, and the circuit board is held on the suction stage in place.

Heater block with step

Lead finger clamp assembly and method of stabilizing lead frame elements

An apparatus for stabilizing a semiconductor die and lead fingers of a lead frame during the process of wire bonding comprising a rigid clamp having at least one bond site window extending therethrough and at least one resilient secondary clamp which extends from an edge of the bond site window to a position over and in contact with lead fingers extending over the semiconductor die. The arrangement of the secondary clamp is such that the contact force with the semiconductor die is sufficient to minimize, dampen, or prevent movement of the semiconductor die and/or lead finger bounce during the wire bonding process. Methods of clamping are also disclosed.

Multi-chip stacking structure and manufacturing method thereof

一种多芯片堆叠结构及其制法，提供一具芯片座及多导脚的导线架，以于该芯片座的两表面上分别接置第一及第二芯片，于焊线作业时将该导线架置于一设有凹穴的加热块上，以使该导脚架撑于该加热块上并使该第二芯片容置于该凹穴中，接着进行第一打线作业，使该第一芯片通过第一焊线而电性连接至该导脚，同时对应连接有该第一焊线的导脚一侧设有凸块，再将该导线架反置以通过该凸块架撑于该加热块上，并使该第一芯片及第一焊线容置于该加热块的该凹穴中，之后进行第二打线作业，使该第二芯片通过第二焊线而电性连接至该导脚。从而通过该凸块将该导脚撑起一段高度，避免加热块触碰至焊线，且不须更换加热块。

Wire bonder with a downholder for pressing the fingers of a system carrier onto a heating plate

Wire bonder

A wire bonder suitable for wire bonding a chip disposed on a carrier and bonding pads of the carrier is provided. The wire bonder includes a stage, a heater plate, a compression plate, a pair of clamping bases, a pair of extended blocks and a capillary. The heater plate is disposed on the stage. The compression plate arranged above the heater plate is able to move upward or downward for compressing the carrier. The clamping bases are arranged at two opposite sides of the compression plate, wherein the length of the compression plate does not match with the distance between the clamping bases. A pair of extended blocks is connected to a pair of clamping bases at one end, respectively, and connected to the compression plate at the other. The capillary is arranged above the compression plate for forming the bonding wires electrically connecting the chip and the carrier.

Method for manufacturing a resin-sealed semiconductor device

A heat plate includes projections for supporting half-etched portions of first signal connection leads, respectively. A lead frame having a resin film mounted thereon is mounted on the heat plate, and thin metal wires are respectively connected to the half-etched portions of the first signal connection leads. Even when the thin metal wire is connected to the half-etched portion of each first signal connection lead, pressing force and heat can be effectively applied to the connection.

Method of fixing curved circuit board and wire bonding apparatus

Apparatus for clamping semiconductor devices using sliding finger supports

An apparatus for supporting lead fingers during a wire bonding process and of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.

Bonding device

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits

A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.

Wire bonder with a downholder

一种丝焊器(W)，具有下夹具(1)，用于将系统支架(7)的指形件(9)压紧在加热板(13)上。该下夹具(1)能够升高和降低。根据本发明的下夹具(1)具有用于支承压板(4)的四个导向件(2)，每个导向件(2)具有支撑面(3)和由驱动装置(6’、6)移动的螺栓(5’、5)。该下夹具(1)处于升高状态时该压板(4)支撑在该四个导向件(2)的支撑面(3)上。该下夹具(1)处于降低状态时该四个导向件(2)的螺栓(5’、5)将该压板(4)压紧在该系统支架(7)的指形件(9)上。四个螺栓(5’、5)中的至少一个可以单独移动，从而压板(4)能够暂时固定该系统支架(7)，而不需将所有的指形件(9)事先压紧在加热板(13)上。

Heater for ic wiring bonder

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Wire bonding device

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Wire bonding equipment

Apparatus for delivering shielding gas during wire bonding

An apparatus is provided for supplying a shielding gas during the bonding of wires to electronic components with a bonding tool comprising a horn and a capillary. The apparatus comprises a main body with an elongated slot having a width that extends into the main body from a side of the main body generally in a first direction and the slot also extends from a top surface to a bottom surface of the main body in a second direction perpendicular to the first direction for the width of the slot. The slot is sized to receive a tip of the capillary which is operable to pass through the slot in the second direction. A gas outlet, which may be formed inside the slot, supplies shielding gas into the slot.

Semiconductor device and method for its manufacture

Heating fixture of packaging lineup process and method thereof

本发明公开一种封装打线工艺的加热治具及其方法，所述加热治具包含一承载块及一夹持块，其中所述夹持块用以夹持一封装载体，使所述封装载体被夹持于所述承载块与所述夹持块之间。所述夹持块设有至少一加热组件以加热所述封装载体的一第一区域至一第一温度；而所述封装载体的一第二区域则具有一第二温度，所述第二温度相对低于所述第一温度。因此，所述加热治具能使所述封装载体的第二区域上的芯片的焊垫硬度保持在适当的预定硬度值，以提高导线与焊垫之间的结合可靠度及结合良品率；并使得所述第一区域上的打线位置被加温，从而使导线容易接合。

Lead frame holding device for electronic components

Semiconductor device and method of producing the same

A semiconductor device includes a semiconductor chip (1) having top and bottom surfaces, upper leads (11) electrically coupled to the semiconductor chip, where a first gap is formed between the upper leads and the top surface (1a) of the semiconductor chip, lower leads (12) electrically coupled to the semiconductor chip, where a second gap is formed between the lower leads and the bottom surface of the semiconductor chip, and an encapsulating resin (2) which encapsulates the semiconductor chip so as to maintain the first and second gaps.

Apparatus for wire bonding and method for bonding using the same

본 발명은 와이어본딩의 시간을 단축시키도록 한 와이어본딩 장치 및 그를 이용한 와이어본딩 방법에 관한 것으로, 이를 위한 본 발명은 카메라를 구비한 본드헤드, 다수개의 칩이 부착된 리드프레임, 작업지역이 위치하는 윈도우클램퍼를 이용하여 와이어본딩하는 방법에 있어서, 상기 리드프레임에 부착된 모든 칩에 대해 상기 윈도우클램퍼에 위치되는 순서대로 일련번호를 부여하는 단계, 상기 일련번호가 부여된 칩중 하나를 상기 윈도우클램퍼의 제1작업지역으로 이동시키는 단계, 상기 본드헤드의 제1,2 카메라를 동시에 상기 윈도우클램퍼의 제1,2작업지역으로 이동시켜 각각 상기 제1,2작업지역에 위치한 칩의 영상을 획득하는 단계, 상기 제1작업지역에 위치한 칩의 영상을 분석해서 본딩포인트를 인식하는 단계, 상기 제1작업지역에 위치한 칩을 본딩함과 동시에 상기 제2작업지역에 위치한 칩의 영상을 분석해서 본딩포인트를 인식하는 단계, 상기 제2작업지역의 칩을 본딩하고 나머지 다른 칩을 상기 윈도우클램퍼로 이동시키는 단계를 포함하여 이루어진다. The present invention relates to a wire bonding apparatus and a wire bonding method using the same to shorten the time of wire bonding, the present invention for this purpose is a bond head having a camera, a lead frame with a plurality of chips, a work area A method of wire bonding using a window clamper, the method comprising: assigning serial numbers to all chips attached to the lead frame in the order of being located in the window clamper, and assigning one of the chips assigned the serial number to the window clamper. Moving the first and second cameras of the bond head to the first and second working areas of the window clamper simultaneously to obtain images of chips located in the first and second working areas, respectively. Step, Recognizing the bonding point by analyzing the image of the chip located in the first work area, Chip located in the first work area Bonding and at the same time comprises the step of the second method comprising: by analyzing the image of the chips located in the work area recognize the bonding points, the bonding of the second chip of the working area and the other to move the other chip in the window clamper. 와이어본딩, 리드프레임, 윈도우클램퍼, 본딩포인트인식 Wire bonding, lead frame, window clamper, bonding point recognition

Method and apparatus for manufacturing electronic device

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Wire bonding equipment

Reduced Oxidation System for Wire Bonding

본 발명에 따라서, 와이어 본딩 머신이 제공된다. 상기 와이어 본딩 머신은, (1)와이어 본딩 작업동안에 반도체 장치를 홀딩하기 위한 본드 사이트 영역과, (2) 상기 본드 사이트 영역위로 부터 상기 본드 사이트 영역에 가스를 공급하도록 형성되는 가스 공급 라인을 포함한다. According to the invention, a wire bonding machine is provided. The wire bonding machine includes (1) a bond site region for holding a semiconductor device during a wire bonding operation, and (2) a gas supply line configured to supply gas to the bond site region from above the bond site region. . 와이어 본딩 머신, 반도체 장치, 본드 사이트 영역, 가스 공급 라인 Wire bonding machine, semiconductor device, bond site area, gas supply line

Apparatus for delivering shielding gas during wire bonding

APPARATUS FOR DELIVERING SHIELDING GAS DURING WIRE BONDING An apparatus is provided for supplying a shielding gas during the bonding of wires to electronic components with a bonding tool comprising a horn and a capillary. The apparatus comprises a main body with an elongated slot having a width that extends into the main body from a side of the main body generally in a first direction and the slot also extends from a top surface to a bottom surface of the main body in a second direction perpendicular to the first direction for the width of the slot. The slot is sized to receive a tip of the capillary which is operable to pass through the slot in the second direction. A gas outlet, which may be formed inside the slot, supplies shielding gas into the slot. (FIG. 3)

Bonding device and bonding method

Adjustable clamp system and method for wire bonding die assembly

A method and an adjustable clamp system for clamping a die assembly during wire bonding. The system includes at least one pair of opposing base walls, each of the base walls has a base clamping surface. There is at least one pair of clamping members, each one of the clamping members being movable towards a respective base clamping surface to thereby clamp a lead frame of the die assembly. A die assembly support is disposed between the pair of opposing base walls and the die assembly support and pair of opposing base walls provide a cavity. There is a position sensor coupled to a controller and there is also a drive that is controllable by the controller. The drive provides movement of the die assembly support relative to each the base clamping surface to thereby adjust a depth of the cavity. In operation, after the lead frame is clamped between the base clamping surface and clamping members, the controller allows the drive to provide the relative movement until the position sensor detects that an underside of the lead frame has abutted the die assembly support.

Soft touch clamp actuation mechanism

A clamping mechanism having clamping jaws is provided for holding an object. The clamping mechanism comprises a solenoid pad connected to at least one of the clamping jaws which is operative to actuate movement of the clamping jaw, and a solenoid motor that is operative to attract the solenoid pad towards it when it is energized. Further, a voice coil motor is rigidly coupled to the solenoid pad to drive the solenoid pad in directions towards or away from the solenoid motor.

Work Clamp and Wire Bonding Apparatus

A work clamp and a wire bonding apparatus that can sufficiently restrain oxidation of a bonding area even while reducing a use amount of antioxidant gas are provided. The work clamp according to the present invention includes an interior hollow portion 10 providing an atmosphere of the antioxidant gas, a lower opening portion 11 a provided below the interior hollow portion, for containing the bonding area in the interior hollow portion, an upper opening portion 11 provided above the interior hollow portion, for exposing the bonding area, a cavity 13 covering the interior hollow portion and having an area larger than an opening area of the upper opening portion, gas introduction ports 14 a, 14 b provided at the cavity, for introducing the antioxidant gas into the cavity, and holes 21 connected to below the cavity, for blowing the antioxidant gas introduced from the gas introduction port to a portion other than the bonding area of the work.

Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits

A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.

Method for manufacturing a resin-sealed semiconductor device

A heat plate includes projections for supporting half-etched portions of first signal connection leads, respectively. A lead frame having a resin film mounted thereon is mounted on the heat plate, and thin metal wires are respectively connected to the half-etched portions of the first signal connection leads. Even when the thin metal wire is connected to the half-etched portion of each first signal connection lead, pressing force and heat can be effectively applied to the connection.

Semiconductor device and manufacturing method thereof

Wire payout measurement and calibration techniques for a wire bonding machine

A method of calibrating a wire payout related to predetermined looping motions used during formation of a wire loop is provided. The method includes the steps of: (a) determining a first wire payout length related to predetermined wire looping motions used in the formation of a first of the wire loop, the predetermined looping motions being performed on a first wire bonding system; (b) determining a second wire payout length related to the predetermined wire looping motions used in the formation of a second of the wire loop; and (c) adjusting at least one wire bonding process variable, and repeating step (b) with the at least one adjusted wire bonding process variable such that the second wire payout length determined in the repeated step (b) is closer to the first wire payout length than the second wire payout length determined in the initial step (b).

Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary

The capillary for ball bonding for forming a bump on the electrode pad of a semiconductor device includes a pressing member having a bore therein for supplying a metal wire, and a leveling member. The pressing member presses the ball-like end of the metal wire against the electrode pad in order to secure the ball-like end to the electrode pad under pressure. The leveling member makes the bump formed on the electrode pad to a predetermined height. According to the method of forming a bump using the capillary, first, a ball is formed at the end of the metal wire supplied from the bore. A first portion of the bump is formed by moving the capillary downwards and by securing the ball-like end to the electrode pad under pressure by the pressing member. A second portion of the bump is formed on the first portion by supplying the metal wire while the capillary is moved. When the capillary is moved downwards, a portion of the metal wire constituting the second portion is cut from the remaining portion of the metal wire in the bore by an edge of the pressing member, and simultaneously the bump is leveled by the leveling member.

For the semiconductor device strutting piece welded

一个实施方式中，支撑件结构包括基底、柔顺层和保护层，该支撑件结构用于在焊接过程中将半导体器件(如引线框)固定至窗夹具。当夹持半导体器件时，柔顺层将均匀载荷分布在半导体器件的表面上方。在其它实施方式中，可以将柔顺层分段成与窗夹具中的开口对应的单独的部分。窗夹具还可以具有柔顺层和保护层，并且可以在支撑件结构上具有或者不具有柔顺层的情况下使用。可以包括保护层上的特征，以支撑半导体器件的结构。

Apparatus of clamping semiconductor devices using sliding finger supports

An apparatus for supporting lead fingers during a wire bonding process and method of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.

Clamping assembly

A clamping assembly for clamping a lead frame with pre-attached semiconductor device, comprising of: a first member, to hold the lead frame, said first member having a surface profile in contact with a surface profile of the semiconductor device, a second member for allowing the mounting of the first member thereon, an attachment means to secure the first member onto the second member, wherein the attachment means is adjustable to conform the surface profile of the first member to the surface profile of the lead frame.

System and method for dual head bonding

A method for bonding includes positioning a bonding strip adjacent a sole first bond head, the bonding strip having a plurality of strip units, and bonding, with only the first bond head, a first number of the plurality of strip units. The method further includes transporting the bonding strip from the first bond head and positioning the bonding strip adjacent a sole second bond head, and bonding, with only the second bond head, a remaining number of the plurality of strip units on the bonding strip. In one embodiment, the method also includes heating at least one of the plurality of strip units prior to bonding the bonding strip. In one embodiment, the method also includes clamping, with a sole clamp, the bonding strip, thereby limiting warpage of the bonding strip.

Clamp for pattern recognition

A lead frame such as a normal or inverted lead frame includes an unsymmetrical part such as a gate. A clamp, for clamping the lead frame during wire bonding, includes an observation hole. The unsymmetrical part of the lead frame is visible through the observation hole. A lead eye box and a lead eye point are set on the unsymmetrical part through the observation hole. The picture inside the lead eye box is captured and compared to a control picture. Setting the lead eye box and the lead eye point on the unsymmetrical part through the observation hole allows detection of when the lead frame is inadvertently rotated at prescribed angles or when a normal lead frame and an inverted lead frame are inadvertently mixed.

Apparatus for clamping substrate of semiconductor package

본 발명은 반도체 패키지용 기판 클램핑 장치를 개시한다. 개시된 본 발명은, 기판이 안치되는 베이스의 양측 상부에 한 쌍의 프레임의 하단이 압축 스프링을 매개로 탄성 연결된다. 프레임은 베이스에 탄성 연결된 수직부와, 수직부의 상단에 직교 연결된 수평부, 및 각 수평부에서 내측을 향해 연장된 고정부로 이루어진다. 각 프레임의 각 고정부에 기판을 눌러 지지하는 2개의 지지판이 고정되어서, 각 지지판 사이를 통해서 기판의 와이어 본딩 영역이 노출된다.

Clamp for Bonding Wire of Ball Grid Array Semiconductor Packages and Method for Checking the Bonding Wire Using the same

본 발명은 반도체 패키지의 와이어 본딩용 클램프 및 이를 이용한 와이어 본딩 검사 방법에 관한 것으로, 반도체 패키지의 제조공정 중의 와이어 본딩시, 클램프의 하부에 형성된 전도성 고무가 적어도 하나의 그라운드용 솔더볼에 접촉되도록 한 상태로 WBMS를 상태로 와이어 본딩된 반도체 패키지의 와이어 본딩 불량을 검사하는 것에 의해 와이어 본딩 검사의 정확성을 기여하고, 또한, 인적, 물적, 시간적 손실을 발생 시켜 생산성 및 제품의 신뢰성를 향상할 수가 있다. The present invention relates to a wire bonding clamp of a semiconductor package and a wire bonding inspection method using the same, wherein the conductive rubber formed at the lower portion of the clamp is in contact with at least one ground solder ball during wire bonding during a manufacturing process of the semiconductor package. By inspecting the wire bonding defects of the semiconductor package wire-bonded with the WBMS, it is possible to contribute to the accuracy of the wire bonding inspection, and to increase the productivity and the reliability of the product by generating the loss of human, material and time. 본 발명의 와이어 본딩용 클램프는, 와이어 본딩작업중에, 수지 기판의 상면부를 그 하부면이 프레싱함으로써 회로 기판을 고정,지지하기 위한 클램프에 있어서, 상기 클램프의 상기 하부면에 형성된 전도성 고무가 적어도 하나 이상의 상기 수지 기판의 그라운드용 솔더볼과 전기적으로 접속되는 것을 특징으로 한다. The wire bonding clamp of the present invention is a clamp for fixing and supporting a circuit board by pressing a lower surface of a resin substrate during a wire bonding operation, wherein at least one conductive rubber is formed on the lower surface of the clamp. It is electrically connected with the ground solder ball of the said resin substrate mentioned above.

Wire-bonding method for forming an uniform wire-bent angle

Reduced oxidation system for wire bonding

A wire bonding machine is provided. The wire bonding machine includes (1) a bond site area for holding a semiconductor device during a wire bonding operation, and (2) a gas supply line configured to provide a gas at the bond site area from above the bond site area.

Wire-bonding method for forming an uniform wire-bent angle

Methods of teaching bonding locations and inspecting wire loops on a wire bonding machine, and apparatuses for performing the same

提供了在线焊机上指导半导体器件的焊接位置的改进方法。该方法包括(1)向线焊机提供位置数据，该位置数据是关于(a)半导体器件的第一部件的焊接位置以及(b)半导体器件的第二部件的焊接位置的数据；以及(2)使用线焊机的模式识别系统来指导半导体器件的第一部件和半导体器件的第二部件的焊接位置，以便获得第一部件和第二部件的焊接位置的至少一部分的更准确的位置数据。所述指导步骤是通过按照所述焊接位置被配置为在所述线焊机上被线焊的顺序指导所述焊接位置而执行的。

Wire bonding devive

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Apparatus and method of clamping semiconductor devices using sliding finger supports

An apparatus and method of supporting lead fingers during a wire bonding process and of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lead fingers of a lead frame during the wire bonding process to provide increased stability of the lead fingers and prevent the bonding apparatus and clamping assembly from applying force against the die. The present invention also provides for the transfer of heat from the heat block directly to the lead fingers during the wire bonding process. The present invention includes the use of a clamp for stabilizing lead fingers during the wire bonding process.

Mcp bonding apparatus

본 발명은 멀티 칩 패키지의 제조시 사용되는 다이 본딩 장치에 관한 것이다. 본 발명은, 멀티 칩 패키지를 제조하기 위한 다이 본딩 장치에 있어서, 리드 프레임의 패드가 안착되고, 다수의 리드를 밀착 접촉시키기 위한 경사부가 형성되어 있는 히터 블록과; 상기 히터 블록의 상부에 안착되고, 리드 프레임에 형성된 다수의 리드를 눌러주기 위한 돌출 경사부가 형성되어 있는 윈도우 클램프를 포함하는 것을 특징으로하는 멀티 칩 패키지를 제조하기 위한 다이 본딩 장치를 제공한다. 상기와 같은 본 발명의 구조에 의하면, 와이어 본딩시 발생하는 와이어의 단락 및 단선을 방지할 수 있는 효과가 있고, 멀티 칩 패키지 제조시 단차를 극복함으로써 작업능률을 향상시킬 수 있는 효과가 있다.

Manufacturing method of semiconductor device

Pattern recognition method

A method includes setting lead eye boxes and lead eye points on a gate and a support bar of a lead frame, before clamping the lead frame, and determining whether or not the lead frame is seated in an exact first position. The lead eye boxes and the lead eye points are again set on the gate and the support bar, after clamping the lead frame, and it is redetermined whether or not the lead frame is seated in the exact first position. The positions of leads of the lead frame are captured and memorized. Die eye boxes and die eye points are set on specific patterns of a die and it is determined whether or not the die is mounted in an exact second position.

Wire bonding methods and bonding force calibration

一种利用金属线接合机施加接合能量以在金属线的一部分和接合位置的接触件之间形成接合的方法，该方法包括以下步骤：(1)将接合工具朝着接触件移动；(2)检测接触件的一部分何时被压靠在金属线接合机的装置支撑表面上；和(3)在步骤(2)之后将接合能量施加到接触件的该部分，从而在接触件和金属线的该部分之间形成接合。

Wire bonding machine table

本发明公开一种打线机台，其适用于将一个承载器上的一个芯片打线接合至所述承载器上的数个接垫。本发明打线机台包括一个基座、一个热板、一个压板、一对固定座、一对延长块，以及一个焊针，其中所述热板位于所述基座上；所述压板是以可上下移动的方式配置在所述热板的上方，以压合一个位于所述热板上的承载器；一对所述固定座是配置于所述压板相对的两侧，其中所述压板的长度是不匹配于所述两固定座之间的距离；所述两延长块是桥接于固定座与压板之间；及所述焊针是位于所述压板上方，用以形成多数条电性连接所述芯片及所述承载器的接垫的打线导线。

Bonding equipment

Wire connection equipment for semiconductor device

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

A window clamp and align method of lead frame strip using a window clamp

본 발명은 윈도우 클램프 및 그를 이용한 리드 프레임 스트립의 정렬방법에 관한 것으로, 리드 프레임 스트립의 오정렬로 인한 와이어 본딩시의 불량을 방지하기 위하여 본딩창 및 리드 감지창이 형성된 윈도우 클램프를 사용하며, 와이어 본딩 장비에 세팅된 감지 수단을 이용하여 다이 및 리드 프레임의 정렬 상태를 감지하므로써 리드 프레임 스트립의 정렬이 정확하고 빠르며, 수율을 증대시킬 수 있도록 한 윈도우 클램프 및 그를 이용한 리드 프레임 스트립의 정렬방법에 관한 것이다. The present invention relates to a window clamp and a method of aligning a lead frame strip using the same, which uses a window clamp having a bonding window and a lead sensing window in order to prevent a defect in wire bonding due to misalignment of the lead frame strip. The present invention relates to a window clamp and a method of aligning a lead frame strip using the same, which detects the alignment of the die and the lead frame using a sensing means set in the lead frame strip, thereby increasing the yield.

Semiconductor assembly apparatus and semiconductor device manufacturing method

Bonding device

Bondhead lead clamp apparatus and method

A method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The method includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the method also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding and also provides for the replacement of the fixed clamp with another, or second, independent clamp.

Copper wire bonding equipment for power device

一种利用铜线代替金线进行功率器件键合的设备，包括打火杆(2)、送线器(5)、换能器(4)、换能器外端设有供铜线穿过的瓷嘴(3)，还设有一个可防止铜线烧球氧化的双管吹气装置；双管吹气装置包括连通保护气源的两根吹气管，两个出气口相对地位于瓷嘴下端的两侧。可为铜线烧球提供N 2 和H 2 的混合气体吹气保护，防止铜线烧球的氧化，使得在现有金线键合设备上用铜线代替金线进行键合也能够实现键合的稳定性和可靠性，键合金属线成本下降约84％，产品整体成本下降5.7-8.6％；还降低了芯片产品的饱和压降参数值，铜线的导电能力比金线提高了约20％，增加了产品的可靠性。且本实用新型的技术方案对现有设备的改动较小，容易实现。

Bond Surface Conditioning System for Improved Bondability

Thick film bond surfaces on a support structure, such as a ceramic substrate or an IC package substrate, tend to deform during processing. A personality kit having raised bosses engages with and compresses the bond surfaces, resulting in a flatter, wider bond surface having improved reflectivity. The personality kit is fit within a clamp that can be used as a stand-alone unit or integrated into an existing machine, such as a wire bonder.

A clamping assembly

A clamping assembly (1 ) for clamping a lead frame (7) with pre-attached semiconductor device, comprising of: a first member (2) to hold the lead frame (7), said first member (2) having a surface profile in contact with a surface profile of the semiconductor device, a second member (3)for allowing the mounting of the first member (2) thereon, an attachment means to secure the first member (2) onto the second member (3), wherein the attachment means is adjustable to conform the surface profile of the first member (2) to the surface profile of the lead frame (7).

Support system for a semiconductor device

A support system for a semiconductor device during a wire or ribbon bonding operation is provided. The support system includes a body portion defining an upper surface. The upper surface has an upper surface contact region configured to support at least a portion of a lower surface of a semiconductor device at a lower surface contact region during a wire or ribbon bonding operation. The support system also includes a plurality of protrusions on the upper surface contact region.

Wire bonding method for power semiconductor device

Disclosed is a wire bonding method for a power semiconductor device, wherein when bonding one end (1a) of a wire (1) to an electrode part (Sa), a workpiece (WK) comprising a power semiconductor element (S) is fixed on a support (3) by a specified fixing pressure (F), and ultrasonic vibration is applied while the end (1a) of the wire (1) is pressed against the electrode part (Sa) with a specified pressing force (P) by a wedge tool (T) with an inverted V-shape wire pressing surface (Tf) in cross-section. A bond length (L) and a bond width (W) of a bond surface (J) of the wire end (1a) and the electrode part (Sa) are set such that the ratio (L/W) is within the range 1.0-1.6.

4 단위 와이어 본더

본 발명은 와이어 본더(Wire bonder)에 관한 것으로, 더욱 구체적으로는 리드프레임이 놓여지는 히터블록(Heater block)과 히터블록 위에서 리드프레임을 고정시키는 클램프(Clamp)의 구조를 변경하여 1회 작업할 때 네 개의 반도체 칩에 대해 와이어가 본딩될 수 있는 와이어 본더에 관한 것이며, 이를 위하여 네 개의 반도체 칩에 대응하여 네 개의 안착부가 형성된 히터블록과 이에 대응하여 네 개의 개구부가 형성된 클램프를 포함하는 와이어 본더의 구조를 개시하고, 이송수단에 의해 이송되는 간격을 그에 맞게 조절하여 1회 이송될 때 네 개의 반도체 칩이 실장된 간격만큼 리드프레임을 이송시키는 와이어 본더의 구조를 개시하며, 이러한 와이어 본더의 구조를 통하여 1회 작업할 때 실시되는 와이어 본더의 생산성을 향상시킬 수 있으며, 나아가 반도체 조립공정의 효율을 향상할 수 있다.

ワイヤボンディング装置及びワイヤボンディング方法

(57)【要約】 【課題】 半導体装置の歩留まり及び信頼性を高くする ボンディング装置を提供する。 【解決手段】 クランパは、基体１７が固定されている 押え枠１０と、ネジ６によってボンディング装置に固定 されている支持枠１１とに各々、ボール９が嵌合する穴 が設けられている。基体１７には、押え窓７の部分にお いて下方に突出している押え部８が設けられている。ク ランパをリードフレームへと下降させていくと、押え部 ８はリードフレームのうち内部リードである部分を押圧 し始める。内部リードによって押え部８には抗力が与え られ、ボール９同士を結ぶ軸を中心として基体１７及び 押え枠１０が回転する。基体１７は回転によって傾きを 変えながら複数の内部リードを次々と押圧していき、内 部リードはリードフレーム全体に関して均等に押え付け られる。内部リード全てがヒートブロックへと押さえつ けられると基体１７の回転は停止し、ボンディングがな される。

リ−ドフレ−ム

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

平面支架及封装方法

本发明公开了一种封装发光二极管的平面支架，包括两只引脚(1)，引脚的一端均向下折弯，并向前延伸，一只引脚向前延伸形成一较小面积的第二焊区(2)、另一只引脚向前延伸形成一较大面积的固晶区(3)。第二焊区(2)的一侧延伸出一供焊机压爪压紧的压着区(5)。本发明还提出了平面支架的封装方法。采用本发明提出的平面支架和封装方法，改变了压爪对于第二焊区(2)的压着区，减少由于平面支架第二焊区与加热板接触不好而产生的焊线不良，从而提高了生产良品率，降低了产品隐藏性不良，增加了产品的市场竞争力。

半導体装置及びその製造方法

【課題】半導体装置のワイヤ長の低減化を図る。 【解決手段】複数のリード２ａのうちのリード２ｆは、第１の厚さを有する基端部２ｇと、基端部２ｇの長さよりも長く、かつ平面視において基端部２ｇからダイパッドに向かって屈曲するインナー部２ｅと、基端部２ｇからリード幅方向Ｈに迫り出した突出部２ｈとを有しており、インナー部２ｅは、平面視において前記ダイパッド側に位置する先端部２ｅａと、基端部２ｇ及び突出部２ｈと連結する連結部２ｅｂとを有するとともに、平面視において連結部２ｅｂの幅Ｍ３は基端部２ｇの幅Ｍ１よりも大きく、複数のリード２ｆのそれぞれのインナー部２ｅにステージを接触させた状態でワイヤボンディングを行う。 【選択図】図５

线式和带式接合操作中半导体器件的支撑结构和夹持系统

提供了在接合操作过程中用于支撑半导体器件的支撑结构。该支撑结构包括具有上表面的主体部，该上表面配置为在接合操作过程中支撑半导体器件。上表面限定有约束元件，约束元件在接合操作过程中用于对半导体器件的至少一部分进行约束。