WIRE BONDER FOR TREATING PROPERLY SYSTEM CARRIER WITH SMALL PITCH RANGE USING DOWN HOLDER FOR COMPRESSING FINGERS OF SYSTEM CARRIER ON HEATING PLATE
Holder down also Figure 1 shows a perspective view, Figure 2 shows a side of holder down elevated also, Figure 3 shows a wire of semiconductor chip also a linking is performed side of holder down in, Figure 4 shows a also another side of holder down when, Figure 5 shows a also several windows is in the support plate. The present invention refers to system carrier, in particular according to Claim 1 range charges fingers of lead frame described preambles onto heating plate of type and device for controlling the down in compressing said material relates wire bonder. Specialist technical term known wire bonding, semiconductor chip electrical between carrier and system in the formation of wire connection, coupled said system carrier of the fingers grip the by the support plates ., and is pressed against the heating plate. Said fingers joined with an end of said support plate that is accessible for. NiCr MISFET sensor monitoring hydrogen gas in. Between the microstrip patch after mounting semiconductor chip to a substrate is the wire coupling device. Said between the microstrip patch comprises an ultra-capillary clamped to the distal end of the horn. Said wire said capillary is of said semiconductor chip connection point of the electrode 30 and are attached to the connection points adapted for the substrate as well as a connecting point between said 2 said wire guide the make. Said semiconductor chip connection points adapted for the substrate when connection wire between connection points adapted for the, said capillary which protrude from the rear is melt bolometer first ends of said wire. Furthermore, by ultrasonic pressure and the balls wire said said attached attachment point of semiconductor chip. A Y shaft servo motor including a, passage of ultrasonic waves from said ultrasonic transducer is applied to the horn. . Termed ball bonding the process. the wire is drawn length required, wire loop is formed and is coupled to connection points adapted for the substrate. This process. termed wedge bond the picture or a sign is printed. Said wire then, the decoding equipment attachment point of said substrate, said wire are prepared and then bonding cycle can begin.. To support surface of said fingers to achieve a relatively uniform partial compression said as the support plate is movable and apparatus enabling multi-mode wireless down is publicly known call patent specification CH 680 176 a synchronized switch holder. Such down holder a system carrier is provided to function with excellent resistance to hydrogen, thus technical database the Internet known as pitch (pitch), adjacent to the a signal by detecting the average distance between 2000 falls hereinafter. However, 25 micrometers in pitch in 50, 40 or only a magnetic layer, in particular, system carrier and a support plate or heating plate having a coefficient of thermal expansion of patterned and thereby a problem of a circumferential length between the drive. is caused. The present purpose of the invention 40 micrometers or hereinafter the ground state and very little a system carrier which is suitable for use in producing a holder. is to develop a highly-. said range claimed by the features according to Claim 1 a. are resolved according to the present invention. Between the microstrip patch, which is connected wire thereon said semiconductor chip for aligning exactly system carrier is heating provided plate, said system carrier of constitution: a sensoring heating said fingers has a and a down holder pressurized. A replaceable holder down said support plate is hinged to which. can be raised and lowered. A system carrier said mobile are at elevated holder down said can be. The wire connecting of semiconductive chips said said down holder is carried out with sealing head is lowered. According to the present invention, said down holder for between said one guide members is provided with a 4. Each guide member driving a pin or bolt or with a bearing surface device by that can be displaced to produce the like comprises an ultra-. In state are at elevated holder down said, said 4 the support plate of said one guide members and resting on a surface and being support, said support plate of silver, copper said they not to contact an. elevated in addition. Descent of the holder down said is carried out at step 2. Number 1 in step, so that it can be lowered holder down said, the bolts one of said supporting plate is dropped in addition compression while, other of silver, copper element is lifted off said support plate said support plate that it does not come into contact or at least any force also does not act on the. Upon lowered, said support plate of said system carrier of fingers since the for applying impacts to, this is by to the contact points. Number 1 after, thus said support plate of a 1 or a small number of adjacent fingers compress the only only for. When predetermined heated to a temperature, other the fingers grip the heating plate can be is free to move relative to. Said predetermined temperature as soon as substantially reached, said supporting plate for mounting the article and is cancellation slope. the 4 one guide members are all bolts is transferred them in the supporting plate is carried out the compression. Down holder is lowered in a state in which the, sockets adjacent to bolts members one guide said 4 said heating plate provided on said supporting plate said system carrier of fingers against the.. Hereinafter, substracte of the present invention embodiment is described pulsating current is based on drawing. Figure 1 shows a support (not shown) also accommodates and a down holder (1) is in degree perspective view of. Said down holder (1) of a system carrier of fingers pressed against the heating plate to wire bonding are used in on wire bonder during. Said predetermined of 2 between the microstrip patch between location, represented by position z, said in a vertical direction down holder (1) cleaning solution supply/exhaust part and a drive device (20) has a. Said down holder (1) when is raised, a system carrier said said heating plate is fed said heating plate away from or can be. Said down holder (1) is lowered when, said support plate of said system carrier of said fingers. against the heating plate. Said down holder (1) the 4 one guide elements (2) wherein the, on the which the core and the winding are is supported as the support plate is said. Also the geometry and function of said guide member 2, 3 and 4 is described pulsating current is based on. In all drawing, the same drawing the signs the same component a new line. Z also Figure 2 shows a ratio is down holder (1) is in a side view of. Said guide member (2) each supporting surface (3) wherein the, thereon the support plate (4) is said down holder (1) are at elevated constitution: placed. Said 4 suite of bearing surfaces one (3) the 1 and decides the plane. Said guide member (2) two in addition 1 each bolt (5) and a, said bolt (5) for at least part of an direction moves underneath z for 1 driving device (6) includes further. Said 4 one guide member (2) bolt (5) has are said support plate (4) to. elevated so as not to come into contact. In such condition, said system carrier (7) can be a mobile. Said support plate (4) the system carrier (7) of fingers (9) ends of said semiconductor chip (10) accessible for drilling and rod of as a window (8) has a. Said support plate (4) window (8) the system carrier (7) of the continuous frames on a side toward the (11) and encapsulated by. Said frame (11) and a support plate (4) essentially said heating plate (13) parallel to the surface of.. Said heating plate (13) the wire bonder W is mounted on the is arranged. The wire connecting said of semiconductive chips, metal lead against the frame, about 220 °C is carried out at a temperature at which the ranges of. Said heating plate (13) is heated to a temperature such.. Said system carrier (7) has warm-up but, immediately after complete of said transfer process at its temperature easily said heating plate (13) lower than the temperature of 60° may be is cooled to more abruptly during delivered to. Said system carrier (7) the heating plate (13) is heated to a temperature predetermined by must be, is a vortex size is reduced while the a constant is. Figure 3 shows a also said window (8) the frame surrounds the a (11) is said system carrier (7) of fingers (9), is placed on said fingers (9) of said heating plate (13), and the which to this end is pressed against said down holder z a direction (1) of is in a side view. Said support plate (4) the longer said guide member (2) suite of bearing surfaces (3) where it is heated not placed on a on, i.e., said support surface (3) and backing plate (4) a magnet (12) is there is a. Said support plate (4) is said fingers (9) of said heating plate (13) to which to this end is pressed against and a contact pressure the need to form, said 4 one guide member (2) bolt (5) has are said support plate (4) against the to said z of an allocated drive device (6) in the direction in parallel to the is. In the manufacture, said system carrier (7) in the transport direction the stepwise is communicated to then recognition unit recognizes a semiconductor chip (10) for wire bonding said heating plate (13) provides, the down holder (1) has door 2 is enabled state, shown in. As soon as said transfer process is terminated, said down holder (1) lowers and 4 also-useless error step 2 is held in state shown in, finally also 3 placed shown in the free surfaces. Said down holder (1) initially fall of, said 4 one guide member (2) all bolt (5) is elevated said support plate (4) is not in contact with. Said support plate (4) immediately after or drop motion of the antenna in during fall of, said 4 of bolt (5) one, i.e., bolt (5 ') has in corresponding driving device (6') in parallel to the is, this said frame (11) is said system carrier (7) of fingers (9') placed on said support plate after is moved (4), and is pressed against the.. This, said support plate (4) is said bolt (5') a nearest neighbor to said frame (11) a tilt by point P has effect. Said frame (11) and a support plate (4) thus each φ to said heating plate (13) the surface of the free surfaces. Thus said support plate (4) is is in an up position and the vessel having an upper opening. Therefore, said frame (11) adjacent to the the point P 1 or a small number of fingers (9') only said heating plate (13) against the while, remaining fingers (9) a frame (11) and heating plate (13) not clamping yet between. Said down holder (1) during the predetermined time τ, i.e., said system carrier (7) is said heating plate (13) is heated to a temperature of or at least substantially said heating plate (13) be heated to a temperature of such until. is maintained. -out layer upon heating, said system carrier (7) expands in the, the, said non-clamping fingers (9) the heating plate (13) can move relative to. Said predetermined duration τ after with an, said 4 one guide member (2) bolt (5', 5) both the is dropped, they both said support plate (4), and is pressed against the.. This, said frame (11) again tilt and all fingers (9) is said heating plate (13) to the bolt is coupled has the effect of compressed. Said down holder (1) also 3 the now is enabled state, shown in. Z in the direction said bolt (5) movement of the cam plate displacement-controlled or force-and closed by the control of the, i.e., said bolt (5) is of an allocated drive said device (6) predetermined by or are moved into position z said bolt (5) level-crossing detector senses the predetermined force thereto until when action z direction of an allocated drive said device (6) moved by can be carried out by. Said support plate (4) on bolt (5) all the force that which is acted upon by a bolt (5) the same strength or the different intensities can be chosen to have. Said bolt (5) device for driving pneumatic motor or piezoelectric motor for example, what types such as motor and or the electromagnet can be may be. Said 1 one bolt (5 ') 3 other and moving independently of bolt (5) moved together with the window part is are in addition, it is possible to, or all 4 of bolt (5' , 5) adapted to individually moved.. Furthermore, said lowered of step number 1, said 4 of bolt (5) during 2 perform grounding with respect to lowering the individual point rather than P said frame (11) is two edge 1 of said system carrier (7), is placed on said support plate (4) the so that the tilt by the perimeter also.. Said bolt (5', 5) purpose: a device (6) the wire bonder is unit to. Said support plate (4) is, the frame surrounds the each (11) several respectively provided with a window (8) with, in a three-phase working cycle during said wire bonder bond head disposed in the extent of movement of wire of semiconductor chips are several applications for which can be connected in addition present examples. Furthermore, said window (8) are said support plate (4) longitudinal axis of (14) asymmetrical with respect to the coil in the state of being mounted also present applications. These Figure 5 shows a support plate (4) is a. Said down holder (1) a drop motion of the antenna in a bolt lowers at step number 1 (5') and said support plate (4) is shown in addition is P point is. Preferably, said support plate (4) has the cavity, into is said bolt (5) constitution: it goes, the, said support plate (4) the position of said down holder (1) is regulated to the spare card to automatically. The present invention refers to the following. offers a number of advantages: -Said range block in bond wire bonder of the metal lead frame coefficient of thermal expansion is passed between both horizontal directions can typically amounts to at 10 micrometers. The present invention refers to said lead frame is with no interference caused by enclosed package during a heating allows the expanded, said lead frame of fingers (9) the thermal expansion is completed or almost complete be a clamping, and to introduce only when. Nevertheless, said lead frame rmtr constraint of the fitting protrusion 46 is fixed to 1. This said fingers (9', 9) of the location of the optical measurement on an instantaneous basis allows the disclosure, the point P to is measured firstly an adjacent finger. -Said fingers (9) of said window the RAM which will grow dizzily (8) or location of said support plate (4) for said is carried out independent of the position of the window. Said window (8) is said support plate (4) arranged in an asymmetric fashion on applications are present. -Said finger (9) for said heating plate (13) which to this end is pressed against the force that the system carrier (7) the thickness of, the, motion of. 41. Therefore, the present invention refers to provided as a word line, 40 micrometers or hereinafter ground state and very little a system carrier which is suitable for use in producing a holder so that it can be utilized to an organic solution and mixed with excellent. PURPOSE: A wire bonder is provided to treat properly a system carrier with a small pitch range of 40 m or less by using a down holder for compressing fingers of the system carrier on a heating plate. CONSTITUTION: A wire bonder includes a heating plate(13) and a down holder(1) for compressing fingers(9) of a system carrier(7) on the heating plate. The down holder is capable of moving up and down. The down holder includes four guide members(2) for supporting a support plate(4). Each guide member includes a support surface(3) and a bolt(5) capable of being moved up and down using a driving part(6). The support plate is loaded on the support surfaces of the four guide members when the down holder is lifted. When the down holder is descended, the bolt compresses the fingers of the system carrier on the heating plate. © KIPO 2005 Heating plate (13) and, system carrier (7) of fingers (9) of said heating plate (13) form and a down holder (1) has a, said down holder (1) can be raised or lowered the a, wire bonder in (W), Said down holder (1) the carrier plate (4) a 4 one guide member (2) has a, each guide member (2) comprises a support surface (3) and, driving device (6 '.6) by bolt that can be displaced to produce (5' , 5) has a, said support plate (4) the down holder (1) are at elevated in said 4 one guide member (2) suite of bearing surfaces (3), is placed on, said down holder (1) in a state is lowered, said 4 one guide member (2) bolt (5 '.5) the support plate (4) of said heating plate (13) provided on said system carrier (7) of fingers (9) against the which, bolt two said 4 (5' , 5) capable of moving independently from one at least one of that it can be characterized by wire bonder.