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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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26-03-2018 дата публикации

Многослойная заготовка для горячей прокатки

Номер: RU0000178157U1
Автор: Андрей Александрович Крамер
Принадлежит: Андрей Александрович Крамер

Полезная модель относится к производству биметаллических заготовок и многослойных пакетов под горячую прокатку и может быть использована в металлургической промышленности, энергомашиностроении, нефтегазостроении, в производстве атомного и нефтехимического оборудования и машиностроении при изготовлении металлических листов или заготовок из разнородных материалов, в том числе крупногабаритных.Биметаллическая заготовка предназначена для изготовления ответственных композиционных деталей из трудносвариваемых материалов, например, для соединения низколегированных сталей со средне- и высоколегированными сталями, а также для получения толстолистового горячекатанного проката из, например, высокопрочных и/или коррозионностойких сплавов и сталей. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 178 157 U1 (51) МПК B23K 20/00 (2006.01) B32B 15/01 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (52) СПК B23K 20/00 (2006.01); B32B 15/01 (2006.01) (21)(22) Заявка: 2016126384, 30.06.2016 (24) Дата начала отсчета срока действия патента: (73) Патентообладатель(и): Крамер Андрей Александрович (RU) Дата регистрации: 26.03.2018 (56) Список документов, цитированных в отчете о поиске: RU 84763 U1, 20.07.2009. RU 2421312 С2, 20.06.2011. RU 151517 U1, 10.04.2015. US 4645720 A, 24.12.1987. (45) Опубликовано: 26.03.2018 Бюл. № 9 R U (54) МНОГОСЛОЙНАЯ ЗАГОТОВКА ДЛЯ ГОРЯЧЕЙ ПРОКАТКИ (57) Реферат: Полезная модель относится к производству Биметаллическая заготовка предназначена биметаллических заготовок и многослойных для изготовления ответственных композиционных пакетов под горячую прокатку и может быть деталей из трудносвариваемых материалов, использована в металлургической например, для соединения низколегированных промышленности, энергомашиностроении, сталей со средне- и высоколегированными нефтегазостроении, в производстве атомного и сталями, а также для получения толстолистового нефтехимического оборудования и горячекатанного проката из, например ...

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Номер записи: 1
26-01-2012 дата публикации

Process for joining carbon steel part and zirconia ceramic part and composite articles made by same

Номер: US20120021245A1
Автор: Cheng-Shi Chen, Hsin-Pei Chang, Huann-Wu Chiang, Wen-Feng Hu, Wen-Rong Chen
Принадлежит: Hon Hai Precision Industry Co Ltd, Hongfujin Precision Industry Shenzhen Co Ltd

A process for joining a carbon steel part and a zirconia ceramic part, comprising steps of: providing a metal part made of carbon steel, a ceramic part made of zirconia ceramic, and a titanium foil; bringing the metal part, ceramic part, and titanium foil into contact, with the titanium foil inserted between the metal part and ceramic part; applying a joining pressure of about 10˜50 MPa to the parts to be joined; and simultaneously applying a pulse electric current to the parts while the joining pressure is applied for heating up the parts to a joining temperature of about 800° C. to about 1100° C. at a rate of about 50˜600° C./min, maintaining the joining temperature for about 10˜50 minutes.

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Номер записи: 2
09-02-2012 дата публикации

Bonding unit control unit and multi-layer bonding method

Номер: US20120031557A1
Автор: Kensuke Ide, Masato Kinouchi, Takayuki Goto, Takenori Suzuki, Takeshi Tsuno
Принадлежит: Mitsubishi Heavy Industries Ltd

A multi-layer bonding method of the present invention includes: forming a first bonded substrate by bonding a first substrate and an intermediate substrate in a bonding chamber; conveying a second substrate inside said bonding chamber when said first bonded substrate is arranged inside said bonding chamber; and forming a second bonded substrate by bonding said first bonded substrate and said second substrate in said bonding chamber. According to such a multi-layer bonding method, the upper-side substrate can be bonded with an intermediate substrate and then a first bonded substrate is bonded with a lower-side substrate without taking out the first bonded substrate from the bonding chamber. For this reason, a second bonded substrate can be produced at high speed and at a low cost.

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Номер записи: 3
09-02-2012 дата публикации

Gas delivery system for reducing oxidation in wire bonding operations

Номер: US20120031877A1
Автор: Gary S. Gillotti, Peter J. Van Emmerik, Stanley Szczesniak
Принадлежит: Kulicke and Soffa Industries Inc

A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.

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Номер записи: 4
09-02-2012 дата публикации

Low deflection bi-metal rotor seals

Номер: US20120032404A1
Автор: David C. Seib, Mark Joseph Kuzdzal
Принадлежит: Dresser Rand Co

A seal assembly for use in a turbomachine is provided. The seal assembly has an annular division wall with outside and inside surfaces, a carrier ring disposed adjacent the inside surface of the annular division wall, and a sealing substrate metallurgically-bonded to an inner-most surface of the carrier ring. The sealing substrate is machined to form a seal surface that can be disposed proximate a rotor and maintained substantially parallel thereto during operation of the turbomachine.

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Номер записи: 5
16-02-2012 дата публикации

Capillary and ultrasonic transducer for ultrasonic bonding

Номер: US20120037687A1
Автор: Takayoshi Matsumura
Принадлежит: Fujitsu Ltd

A capillary is attached to an ultrasonic transducer of a wire-bonding apparatus. The capillary includes a first part configured to be attached to the ultrasonic transducer, and a second part other than the first part and extending from the first part. The first part has a shape different from a shape of the second part so that the first part has a flexure rigidity larger than the second part.

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Номер записи: 6
29-03-2012 дата публикации

Method of Forming or Repairing Devices Configured to Comminute Material

Номер: US20120073105A1
Автор: Andrew W. Vargo, Curtis Erwin Prothe, Ivo Botto, Kranthi Prakash Peddeti
Принадлежит: FLSmidth AS

A method for repairing a crushing device or other device configured to comminute material includes the steps of removing at least one first insert from a portion of a crushing body such that at least one opening is formed in the portion of the crushing body, positioning at least one second insert in the at least one opening formed by the removing of the at least one first insert, positioning a force application mechanism adjacent to the at least one second insert and the portion of the crushing body, and actuating the force application mechanism to deform the portion of the crushing body to attach the at least one second insert to the portion of the crushing body. The one or more first inserts may be damaged and the one or more second inserts may be used to replace the one or more damaged first inserts. The force application mechanism is preferably explosive material. A method of forming a wearable surface is also disclosed.

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Номер записи: 7
29-03-2012 дата публикации

Method of bonding titanium to stainless steel

Номер: US20120073114A1
Автор: Attila Antalfy, Guangqiang Jiang
Принадлежит: ALFRED E MANN FOUNDATION FOR SCIENTIFIC RESEARCH

A method of bonding a stainless steel part to a titanium part by heating a component assembly comprised of the titanium part, the stainless steel part, and a laminated titanium-nickel filler material placed between the two parts and heated at a temperature that is less than the melting point of either the stainless steel part or the titanium part. The component assembly is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a hermetic and strong bond between the stainless steel part and the titanium part. The bonded component assembly is optionally treated with acid to remove any residual free nickel and nickel salts, to assure a biocompatible component assembly, if implanted in living tissue.

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Номер записи: 8
31-05-2012 дата публикации

method of manufacturing a component

Номер: US20120135198A1
Автор: Oliver M. Strother
Принадлежит: Rolls Royce PLC

A method of manufacturing a component having first and second layers, the first and/or second layers including one or more depressions provided on a surface of the respective layer. The method including: arranging the first and second layers so that they face one another and with the depressions on inner facing surfaces of the layers; diffusion bonding the first and second layers together about their edges; applying a first differential pressure across each of the first and second layers to evacuate an inner space defined by the layers, thereby forming one or more depressions on an outer facing surface of the first or second layer; and applying a second differential pressure across each of the first and second layers to expand the inner space defined by the layers.

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Номер записи: 9
19-07-2012 дата публикации

Laminate armor and related methods

Номер: US20120180630A1
Автор: Henry S. Chu, Thomas A. Zagula, Thomas M. Lillo
Принадлежит: Battelle Energy Alliance Llc

Laminate armor and methods of manufacturing laminate armor are disclosed. Specifically, laminate armor plates comprising a commercially pure titanium layer and a titanium alloy layer bonded to the commercially pure titanium outer layer are disclosed, wherein an average thickness of the titanium alloy inner layer is about four times an average thickness of the commercially pure titanium outer layer. In use, the titanium alloy layer is positioned facing an area to be protected. Additionally, roll-bonding methods for manufacturing laminate armor plates are disclosed.

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Номер записи: 10
26-07-2012 дата публикации

Structural element for a motor vehicle

Номер: US20120187738A1
Автор: Andreas Dannheisig, Bernd Gross, Christian Hübsch, Dirk Angermann, Dirk Eckenroth, Hans-Georg Werner, Joshua Hesterberg, Martin Oren, Praveen Koparde, Robin Ndagijimana, Stefan Funk, Vedat Nuyan, Vikas Wayal, Wolfgang Pellenz, Yaniv Oren
Принадлежит: Johnson Controls GmbH

The invention relates to a structural element ( 100 ) of a motor vehicle, in particular of a motor vehicle seat, wherein the structural element ( 100 ) comprises a first component ( 101 ) and a second component ( 102 ). In an overlap region ( 103 ), the first component ( 101 ) and the second component ( 102 ) have a formed-closed connection, or a form-closed and form-closed connection, wherein the connection in the overlap region ( 103 ) can be produced by an electromagnetic pulse shaping method, wherein the first component comprises at least one form-closed moulding ( 600 ), wherein the second component can be moulded into the at least one form-closed moulding ( 600 ).

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Номер записи: 11
29-11-2012 дата публикации

Method of manufacturing semiconductor device

Номер: US20120302009A1
Автор: Masahiko Sekihara, Masaki Furukawa
Принадлежит: Renesas Electronics Corp

Provided is a technology of suppressing, in forming an initial ball by using an easily oxidizable conductive wire and pressing the initial ball onto a pad to form a press-bonded ball, an initial ball from having a shape defect, thereby reducing damage to the pad. To achieve this, a ball formation unit is equipped with a gas outlet portion for discharging an antioxidant gas and a discharging path through this gas outlet portion is placed in a direction different from a direction of introducing the antioxidant gas into a ball formation portion. Such a structure widens a region for discharging the antioxidant gas, making it possible to prevent a gas flow supplied from the side of one side surface of the ball formation portion from being reflected by the other side surface facing with the one side surface and thereby forming a turbulent flow.

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Номер записи: 12
20-12-2012 дата публикации

Method for making a metal reinforcement for the blade of a turbine engine

Номер: US20120317810A1
Автор: Dominique Magnaudeix, Gilles Charles Casimir Klein, Philippe Marolle, Stephane Andre Leveque
Принадлежит: SNECMA SAS

A method for making a metal reinforcement for the leading edge or trailing edge of the blade of a turbine engine that includes making a metal insert defining the base of the metal reinforcement; positioning the metal insert at the end of a blank of a shaping tool, the blank repeating the shape of the turbine-engine blade; shaping a planar metal sheet on the metal insert and the blank of the shaping tool using a superplastic hot-shaping method.

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Номер записи: 13
28-02-2013 дата публикации

Method for manufacturing sealing disks

Номер: US20130048614A1
Автор: Francois Chevalley, Jürg Lanz, Marcel Oberholzer
Принадлежит: SOUDRONIC AG

Sealing disks ( 44 ) for producing peel-off lids comprising lid rings having a peel-off foil sealed onto the lid ring are produced in that an annular sealing part made of steel ( 54 ) is fastened on a main plate ( 53 ) made of copper, for example by electron-beam welding, whereupon the sealing part is hardened by laser hardening. In this way, a sealing disk having good thermal conductivity and high wear resistance can be favorably produced.

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Номер записи: 14
14-03-2013 дата публикации

Low loop wire bonding

Номер: US20130062765A1
Автор: Law Wai Ling, Liew Siew Har
Принадлежит: Carsem M Sdn Bhd

A multi-die package includes a first semiconductor die and a second semiconductor die each having an upper surface with a plurality of bond pads positioned thereon. The multi-die package also includes a plurality of bonding wires each coupling one of the bond pads on the upper surface of the first semiconductor die to a corresponding one of the bond pads on the upper surface of the second semiconductor die. A bonding wire of the plurality of bonding wires includes a first portion extending upward from one of the second plurality of bond pads substantially along a z-axis and curving outward substantially along x and y axes in a direction towards the first semiconductor die. The bonding wire also includes a second portion coupled to the first portion and extending from the first portion downward to one of the first plurality of bond pads on the upper surface of the first semiconductor die.

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Номер записи: 15
21-03-2013 дата публикации

Apparatus and Method Using Reduced Volume Electro-Hydraulic Chambers for Trimming and Joining Panels

Номер: US20130067976A1
Автор: Sergey Fedorovich Golovashchenko
Принадлежит: FORD GLOBAL TECHNOLOGIES LLC

A tool for modifying a workpiece by either trimming or joining the workpiece. The tool is an electro-hydraulic tool that uses a pulse transmitted through a liquid to trim a workpiece or to join two thicknesses of metal together. A method of trimming the workpiece includes the steps of providing a high voltage discharge in a liquid that drives a workpiece into engagement with a cutting edge of a tool steel insert. A method of joining two or more thicknesses of metal together includes the step of creating a high voltage discharge through an electrode that accelerates one panel or thickness of metal into a second panel that is held stationary by a backing plate while the first thickness of metal is accelerated into the second thickness of metal.

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Номер записи: 16
21-03-2013 дата публикации

CORROSION RESISTANT ISOLATOR ASSEMBLY FOR PROCESS DEVICES

Номер: US20130068029A1
Автор: Klosinski Andrew J., Linse Vonne D., Romo Mark G.
Принадлежит:

A process device has a process seal for coupling to an industrial process. The process device includes a process device body having an isolation cavity and an isolation passageway extending from the isolation cavity to a pressure sensor. The isolation cavity and isolation passageway filled with an isolation fluid. An isolation diaphragm is positioned to isolate the isolation cavity from process fluid. The isolation diaphragm has a process fluid side and an isolation fluid side. A weld ring is positioned around a periphery of the process fluid side of the isolation diaphragm. The weld ring is formed of a first material compatible with the isolation diaphragm and a second material compatible with the process device body. A weld secures the weld ring to the process device body. 1. A process device having process seal for coupling to an industrial process , comprising:a process device body having an isolation cavity and an isolation passageway extending from the isolation cavity to a pressure sensor, the isolation cavity and isolation passageway filled with an isolation fluid;an isolation diaphragm positioned to isolate the isolation cavity from process fluid, the isolation diaphragm having a process fluid side and an isolation fluid side;a weld ring positioned around a periphery of the process fluid side of the isolation diaphragm, the weld ring being formed of a first material compatible with the isolation diaphragm and a second material compatible with the process device body; anda weld securing the weld ring to the process device body.2. The process device of claim 1 , wherein the first and second materials of the weld ring are joined by an explosion-welded interface.3. The process device of claim 2 , wherein the interface is an inclined interface.4. The process device of claim 1 , wherein the first material is tantalum.5. The process device of claim 4 , wherein the second material is stainless steel.6. The process device of claim 1 , wherein the second material is ...

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Номер записи: 17
21-03-2013 дата публикации

ALUMINUM COPPER CLAD MATERIAL

Номер: US20130071686A1
Автор: Hashimoto Akio, Ikeuchi Kenji, Ishio Masaaki, Oda Yoshimitsu
Принадлежит:

An aluminum copper clad material has excellent bonding strength and includes an aluminum layer and a copper layer that are bonded without a nickel layer interposed therebetween. 112-. (canceled)13. An aluminum copper clad material comprising:an aluminum layer;a copper layer; andan Al—Cu intermetallic compound layer; whereinthe aluminum layer and the copper layer are diffusion-bonded via the Al—Cu intermetallic compound layer;the copper layer satisfies Dcs≦0.5×Dcc, where Dcc represents an average crystal grain size of crystal grains in a central portion in a thickness direction of the copper layer, and Dcs represents an average crystal grain size of an interface adjacent portion in the copper layer that is about 0.5 μm apart from an interface between the copper layer and the intermetallic compound layer; andthe intermetallic compound layer has an average thickness of about 0.5 μm to about 10 μm.14. The aluminum copper clad material according to claim 13 , whereinthe average crystal grain size Dcs of the interface adjacent portion satisfies Dcs≦0.4×Dcc.15. An aluminum copper clad material comprising:an aluminum layer;a copper layer; andan Al—Cu intermetallic compound layer; whereinthe aluminum layer and the copper layer are diffusion-bonded via the Al—Cu intermetallic compound layer;the aluminum layer satisfies Das≦0.5×Dac, where Dac represents an average crystal grain size of crystal grains in a central portion in a thickness direction of the aluminum layer, and Das represents an average crystal grain size of an interface adjacent portion in the aluminum layer that is about 0.5 μm apart from an interface between the aluminum layer and the intermetallic compound layer; andthe intermetallic compound layer has an average thickness of about 0.5 μm to about 10 μm.16. The aluminum copper clad material according to claim 15 , whereinthe average crystal grain size Das of the interface adjacent portion satisfies Das≦0.4×Dac.17. The aluminum copper clad material according to ...

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Номер записи: 18
28-03-2013 дата публикации

Nanoimprinting mold and method for producing the nanoimprinting mold

Номер: US20130078332A1
Автор: Kazuyuki Usuki, Naotoshi SATOU, Satoshi Wakamatsu
Принадлежит: Fujifilm Corp

A nanoimprinting mold having high durability enables reduction of thickness fluctuations in resist. The mold is equipped with a patterned base plate having a patterned region, in which a fine pattern of protrusions and recesses is formed, on a first surface thereof, and a second surface having a 3σ value related to a height difference distribution within a range from 1 nm to 6 nm; a hollowed base plate having a hollowed shape at least at a portion corresponding to the patterned region and a thickness greater than or equal to that of the patterned base plate; and a metal film formed between the patterned base plate and the hollowed base plate so as to bond the second surface of the patterned base plate and a surface of the hollowed base plate that faces the second surface.

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Номер записи: 19
11-04-2013 дата публикации

Explosive Cladding Of At Least Two Metal Pipes Arranged Within Each Other

Номер: US20130087240A1
Автор: Van Eijkeren Eric Petrus Hyacinthus Maria
Принадлежит: Synex-Tube B.V.

A method for attaching together by means of explosion welding two metal pipes () arranged within each other, wherein a mantle of explosive material () is arranged around the outer pipe () and this mantle is made to explode in order to cause a metallurgical joint between the two pipes, according to the present invention is characterised in that the interior () of the inner pipe () is filled with granular material () and the interstices left free by the granular material () are filled with liquid () before the explosive material () is made to explode. 1. Method for attachingat least two metal pipes arranged within each other comprising:filling an inner pipe with granular material;filling the interstices left free by the granular material with a liquid;arranging around an outer pipe a mantle of explosive material; andexploding the mantle in order to cause a metallurgical joint between the two pipes.2. Method according to further comprising condensing the granular material before the interstices left free by the granular material are filled with the liquid.3. Method according to claim 1 , wherein the granular material has grains with a rugged surface.4. Method according to claim 1 , wherein the granular material comprises at least one of gravel and sand.5. Method according to further comprising crushing stone-like material to obtain the granular material.6. Method according to claim 1 , wherein the liquid comprises water.7. Method according to further comprising placing within the inner pipe a solid inner core before the interior of the inner pipe is filled with the granular material.8. Method according to further comprising:filling a hollow pipe in advance with the granular material and liquid, andarranging the filled pipe within the interior of the inner pipe.9. Pipe-shaped metal work piece manufactured by explosion welding claim 1 , comprising:an inner pipe of a first metal, andan outer pipe of a second metal,{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'wherein ...

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Номер записи: 20
09-05-2013 дата публикации

COMPOSITE POWDER FOR DIFFUSION-BRAZING ASSEMBLY OR RESURFACING OF SUPERALLOY PARTS

Номер: US20130112737A1
Автор: Clement Jean-Francois Didier
Принадлежит: SNECMA

The invention relates to a composite metal powder for diffusion-brazing assembly or resurfacing of parts () made of superalloy, the powder being formed by mixing a powder () of an Astroloy type base metal with a powder () of an NiCrB1055 type diffusion-brazing metal. The composite powder is free of silicon and it comprises in the range 65% to 70% by weight of Astroloy and in the range 30% to 35% by weight of NiCrB1055. 1. A composite metal powder comprising:65% to 70% by weight of an Astroloy powder,30% to 35% by weight of an NiCrB1055 powder, andno silicon.2. The composite powder of claim 1 , comprising about 67.5% by weight of the Astroloy powder and about 32.5% by weight of the NiCrB1055 powder.3. The composite powder of claim 1 , wherein both the Astroloy powder and the NiCrB1055 powder have a grain size in a range of 60 μm to 70 μm.4. A method of diffusion-brazing assembly or resurfacing comprising contacting the composite powder of with at least one superalloy part.5. The method of claim 4 , wherein the superalloy part comprises nickel.6. The method of claim 4 , further comprising heating the composite powder to a temperature in a range of 1180° C. to 1200° C. for a period in a range of 5 min to 30 min.7. The method of claim 4 , wherein the superalloy part is an element of a turbine engine.8. The composite powder of claim 2 , wherein both the Astroloy powder and the NiCrB1055 powder have a grain size in a range of 60 μm to 70 μm.9. The composite powder of claim 1 , wherein both the Astroloy powder and the NiCrB1055 powder have a grain size of about 63 μm.10. The composite powder of claim 2 , wherein both the Astroloy powder and the NiCrB1055 powder have a grain size of about 63 μm.11. The method of claim 7 , wherein the superalloy part comprises nickel and is fitted on a nozzle sector of the turbine engine.12. A method of diffusion-brazing assembly or resurfacing comprising contacting the composite powder of with at least one superalloy part.13. The method of ...

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Номер записи: 21
16-05-2013 дата публикации

Ribbon bonding tools and methods of using the same

Номер: US20130119111A1
Автор: Garrett W. Jones, Jay C. McCandless, Mark A. Delsman, Theodore J. Copperthite, Tick-Kwang Loh, Todd J. Walker
Принадлежит: Orthodyne Electronics Corp

A ribbon bonding tool including a body portion is provided. The body portion includes a tip portion. The tip portion includes a working surface between a front edge of the tip portion and a back edge of the tip portion. The working surface includes a region defining at least one of a plurality of recesses and a plurality of protrusions. The working surface also defines at least one of ( 1 ) a first planar portion between the region and the front edge of the tip portion, and ( 2 ) a second planar portion between the region and the back edge of the tip portion.

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Номер записи: 22
23-05-2013 дата публикации

Wire loops, methods of forming wire loops, and related processes

Номер: US20130125390A1
Автор: Gary S. Gillotti
Принадлежит: Kulicke and Soffa Industries Inc

A method of forming a wire loop is provided. The method includes the steps of: ( 1 ) forming a conductive bump on a bonding location using a wire bonding tool; ( 2 ) bonding a portion of wire to another bonding location using the wire bonding tool; ( 3 ) extending a length of wire from the bonded portion of wire toward the bonding location; ( 4 ) lowering the bonding tool toward the bonding location while detecting a height of a tip of the wire bonding tool; and ( 5 ) interrupting the lowering of the wire bonding tool during step ( 4 ) if the wire bonding tool reaches a predetermined height.

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Номер записи: 23
23-05-2013 дата публикации

Connecting material, method for manufacturing connecting material and semiconductor device

Номер: US20130127026A1
Автор: Masahide Okamoto, Osamu Ikeda
Принадлежит: Individual

In a connecting material of the present invention, a Zn series alloy layer is formed on an outermost surface of an Al series alloy layer. In particular, in the connecting material, an Al content of the Al series alloy layer is 99 to 100 wt.% or a Zn content of the Zn series alloy layer is 90 to 100 wt.%. By using this connecting material, the formation of an Al oxide film on the surface of the connecting material at the time of the connection can be suppressed, and preferable wetness that cannot be obtained with the Zn—Al alloy can be obtained. Further, a high connection reliability can be achieved when an Al series alloy layer is left after the connection, since the soft Al thereof functions as a stress buffer material.

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Номер записи: 24
30-05-2013 дата публикации

METHOD OF JOINING PART HAVING HIGH FATIGUE STRENGTH

Номер: US20130133785A1
Автор: Kimpara Osamu, Nozue Akira
Принадлежит: OHASHI TECHNICA, INC.

A method of joining using a supporting electrode having a cooling circuit and a pressure electrode movably arranged above the supporting electrode, using a steel material causing martensitic transformation for one of or both of a first member having an opening portion and a second member , engaging the second member with the opening portion of the first member, starting conduction from a power supply to the supporting electrode and the pressure electrode, allowing an insertion portion of the second member to enter the opening portion of the first member by a pressure force of the pressure electrode, causing the second member and an inner wall portion of the opening portion to be subjected to solid-phase diffusion joining, rapidly cooling the both members by thermal conduction of the supporting electrode after the joining, and quenching a joined portion and generating compressive residual stress by the rapid cooling. 1. A method of joining a part having high fatigue strength for joining a first member having an opening portion formed in a vertical direction and a second member having an insertion portion with a constant cross section , the method comprising: providing a press-fit interference to the insertion portion of the second member corresponding to the opening portion of the first member; using a supporting electrode having a cooling circuit formed inside , and a pressure electrode movably arranged above the supporting electrode; using a steel material causing martensitic transformation for one of or both of the first member and the second member; supplying a coolant to the cooling circuit; placing the first member on an upper surface portion of the supporting electrode and causing the pressure electrode to hold the second member; causing the pressure electrode to descend with a pressure force and engaging the second member with the opening portion of the first member; starting conduction from a power supply to the supporting electrode and the pressure ...

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Номер записи: 25
30-05-2013 дата публикации

Method of Securing a Shaft to a Constant Velocity Joint

Номер: US20130134152A1
Автор: Dine Donald W., Yablochnikov Boris A.
Принадлежит: Dana Automotive Systems Group, LLC

A constant velocity joint assembly and a method of securing a shaft to the assembly are described. The assembly may have an outer race with a first portion having a plurality of grooves and a second portion that extends from the first portion and is substantially parallel to the shaft. The method of securing the shaft to the assembly includes the step of magnetically pulse welding the shaft to the outer race. 121-. (canceled)22. A method of securing a shaft to a constant velocity joint assembly , comprising: an inner surface with a plurality of grooves on a first portion and a substantially constant diameter portion on a second portion, and', 'an outer surface having a first portion located radially outward from said inner surface first portion and a second portion located radially outward from said substantially constant diameter portion, said second portion of said outer surface comprising a depression in said outer surface, said depression transitioning directly to at least one radially extending step, said first portion of said outer surface having a recess therein for receiving a dust cover and a dust cover seal therein;, 'providing an outer race comprisinglocating said outer race within a driveshaft having a hollow end portion, said driveshaft extending over said outer race outer surface first portion and said depression to said radially extending step;locating an inductor at least over said depression; andenergizing said inductor to magnetically pulse weld said shaft and said outer race together.23. The method of claim 22 , wherein said inductor generates a magnetic field that drives said driveshaft into direct contact with said groove to weld said driveshaft and said groove together.24. The method of claim 23 , wherein an end portion of said driveshaft takes on a complimentary shape to said groove and said radially extending step after being welded thereto.25. The method of claim 24 , wherein said driveshaft tube extends over said dust cover recess and does ...

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Номер записи: 26
20-06-2013 дата публикации

Methods and apparatus for three-dimensional microfabricated arrays

Номер: US20130157498A1
Автор: Boyden Edward, Fonstad Clifton, Scholvin Jorg, Zorzos Anthony
Принадлежит: Massachusetts Institute of Technology

In exemplary implementations of this invention, electrical connections are fabricated between two orthogonal surfaces by electroplating. The two surfaces are separated (except for the electrical connections) by a gap of not more than 100 micrometers. Multiple electrical connections may be fabricated across the gap. In preparatory steps, conductive pads on the two surfaces may be separately electroplated to build up “bumps” that make it easier to bridge the remainder of the gap in a final plating step. Alternately, electroless deposition may be used instead of electroplating. In exemplary implementations, a 3D probe array may be assembled by inserting array structures into an orthogonal base plate. The array structures may be aligned and held in place, relative to the base plate, by mechanical means, including side hooks, stabilizers, bottom hooks, alignment parts and a back plate. 1. A method comprising fabrication of at least one electrical connection between a first surface and a second surface by electrical deposition , wherein:the first and second surfaces are separated, except for the at least one electrical connection, by a gap of not more than 100 micrometers; andthe first and second surfaces are off angle with respect to each other.2. The method of claim 1 , wherein the electrical deposition comprises electroplating.3. The method of claim 1 , wherein the electrical deposition comprises electroless deposition.4. The method of claim 1 , wherein the at least one electrical connection comprises multiple electrical connections claim 1 , and the pitch between at least some of the multiple electrical connections is less than 50 micrometers.5. The method of claim 4 , wherein the pitch between at least some of the multiple electrical connections is less than 40 micrometers.6. The method of claim 5 , wherein the pitch between at least some of the multiple electrical connections is less than 30 micrometers.7. The method of claim 1 , wherein the method further comprises ...

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Номер записи: 27
04-07-2013 дата публикации

Contact element for diverters of electrochemical cells

Номер: US20130171494A1
Автор: Steffen Legner, Tim Schaefer
Принадлежит: Li Tec Battery GmbH

What is proposed is a contact element for connection between electrically conducting, preferably plate-shaped, components, in particular diverters of electrochemical cells, consisting of different materials, wherein the contact element is produced from at least two elements ( 32, 34 ), wherein at least two elements are joined by means of laser induction rollers, wherein a first element is adapted for connection to a first of the electrically conducting components, wherein a second element is adapted for connection to a second of the electrically conducting components, and wherein the first and the second element have an electrically conducting connection to one another. Therefore, a connection with high process reliability can be provided between diverters of electrochemical cells.

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Номер записи: 28
11-07-2013 дата публикации

DIFFUSION BONDING MACHINE AND METHOD

Номер: US20130175329A1
Автор: Trask Richard D.
Принадлежит: UNITED TECHNOLOGIES CORPORATION

An example diffusion bonding machine includes a support structure configured to receive first and second die sets. A heat transfer device is arranged near the support structure and is configured to transfer heat relative to the die sets. A mechanism is configured to separate the die sets from one another during heat transfer. In one example method of diffusion bonding, heat is transferred relative to a space between die sets. The die sets are supported on the support structure, and a load is applied to the die sets to diffusion bond a component within each of the die sets. 1. A method of diffusion bonding a component comprising:transferring heat relative to a space between first and second die sets;supporting the first die set on the second die set; andapplying a load to the die sets to diffusion bond a component within each of the die sets.2. The method according to claim 1 , comprising loading the die sets onto a support structure prior to performing the heat transferring step.3. The method according to claim 2 , comprising moving the die sets and support structure relative to one another to provide a space.4. The method according to claim 3 , wherein the moving step includes lifting the die sets off of a platen.5. The method according to claim 2 , wherein the heat transferring step includes heating the space and the die sets.6. The method according to claim 2 , wherein the heat transferring step includes cooling the space and the die sets.7. The method according to claim 1 , wherein the loading step includes pressing the die sets between first and second platens.8. The method according to claim 1 , comprising transferring heat relative to a space between the die sets prior to and subsequent to the load applying step.9. The method according to claim 1 , wherein the load applying step includes heating the die sets.10. The method according to claim 1 , wherein the heat transferring step claim 1 , the die sets supporting step claim 1 , and the load applying step are ...

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Номер записи: 29
25-07-2013 дата публикации

METHOD FOR HIGH PRESSURE/HIGH VELOCITY WELDING OR JOINING FIRST AND SECOND METAL WORKPIECES BEFORE WELDING/JOINING; ARTICLE OF MANUFACTURE MADE THEREBY

Номер: US20130189025A1
Автор: GAFRI Oren, LIVSHIZ Yuri
Принадлежит: INFINITY IP COMMERCIALIZATION (ISRAEL) LTD.

A method is provided for forming a metallurgical bond. A first metal workpiece and one or more second metal workpieces are brought into proximity to one another such that a first portion of the first workpiece is in general overlying relationship with a second portion of the one or more second workpieces. A suitable material is provided between said first portion and said second portion, said material being in the form of particles or foil. At least a first part of said first workpiece comprising said first portion is forced toward said a part of the one or more second workpiece comprising said second portion by means of any one of a suitable high pressure joining process and a high speed joining process, such as to cause the said first metal workpiece and said one or more second metal workpieces to become joined or welded to one another to form a metallurgical bond therebetween. 131-. (canceled)32. A method for forming a metallurgical bond between a first metal workpiece and one or more second metal workpieces , comprising:(a) bringing said first metal workpiece and said one or more second metal workpieces into proximity to one another such that a first portion of said first workpiece is in general overlying relationship with a second portion of said one or more second workpieces;(b) providing suitable material between said first portion and said second portion, said material being in the form of particles or foil ; and(c) forcing at least a first part of said first workpiece comprising said first portion toward said a part of said one or more second workpiece comprising said second portion by means of any one of a suitable high pressure joining process and a high speed joining process, such as to cause the said first metal workpiece and said one or more second metal workpieces to become joined or welded to one another to form a metallurgical bond therebetween.33. Method according to claim 32 , wherein said any one of a suitable high pressure joining process and a ...

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Номер записи: 30
01-08-2013 дата публикации

Wire bonding method in circuit device

Номер: US20130196452A1
Автор: Joon-gil LEE
Принадлежит: SAMSUNG ELECTRONICS CO LTD

A wire bonding method in a circuit device mounted on a lead frame, the wire bonding method including: counting a stop time if an operation of a capillary stops; removing a contaminated free air ball (FAB) formed on an end of the capillary if the stop time exceeds a reference time; forming a new FAB; and restarting a wire bonding process.

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Номер записи: 31
08-08-2013 дата публикации

Manufacturing Method Of Heat Exchanger, And Heat Exchanger Manufactured By Such Manufacturing Method

Номер: US20130199763A1
Автор: Akira Yanagida, Kazuyoshi NAKASHIMA, Kotaro Kitawaki, Masakazu Morimoto, Shoei Teshima, Takashi Murase, Takeshi Iguchi
Принадлежит: Denso Corp, FURUKAWA-SKYALUMINUM CORP

The disclosed method relates to manufacturing a heat exchanger which causes no brazing defects, and a heat exchanger manufactured by the method. The method relates to manufacturing a heat exchanger having an aluminum alloy tube defining a cooling-medium flowing passage and a copper alloy tube defining a water flowing passage, wherein a heat exchange is carried out between a cooling medium flowing through the cooling-medium flowing passage and water flowing through the water flowing passage. The aluminum alloy tube and the copper alloy tube are brazed to each other at a temperature of less than 548° C.

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Номер записи: 32
22-08-2013 дата публикации

Metal bonding method and metal bonded structure

Номер: US20130216302A1
Автор: Koichi Saito, Yasuhiro Kohara, Yasuyuki Yanase
Принадлежит: Sanyo Electric Co Ltd

The gap between first and second bonding portions is filled with a disperse solution obtained by dispersing copper micro-particles into a solution for copper oxide elution, so as to elute copper oxide configured as the outermost layer of the first bonding portion and copper oxide configured as the outermost layer of the second bonding portion, and copper oxide formed on the surface of each copper micro-particle. Pressure is applied to the first and second bonding portions using a press machine so as to raise the pressure of the disperse solution. At the same time, heat is applied under a relatively low temperature condition of 200° C. to 300° C., so as to remove the components contained in the disperse solution except for copper, thereby depositing copper. Thus, a first base portion and a second base portion are bonded via a copper bonded portion containing copper derived from the copper micro-particles.

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Номер записи: 33
05-09-2013 дата публикации

METAL BONDED STRUCTURE AND METAL BONDING METHOD

Номер: US20130230740A1
Автор: Saito Koichi, YANASE Yasuyuki
Принадлежит: SANYO ELECTRIC CO., LTD.

After a microcrystalline layer having a grain size that is finer than that of a base member is formed on the surface of at least one of a first bonding portion and a second bonding portion, the gap between the first bonding portion and the second bonding portion is filled with a solution into which copper oxide can be eluted, so as to deposit copper oxide contained in the surface oxide film into the solution. By applying pressure and by heating at a temperature of at most the copper recrystallization temperature, the components contained in the solution are removed except for copper, so as to elute copper oxide, thereby bonding the first bonding portion and the second bonding portion via the copper thus deposited. Subsequently, the copper is solid-phase diffused into the first bonding portion and the second bonding portion. 1. A metal bonded structure wherein a first bonding portion formed of copper-based metal and a second bonding portion formed of copper-based metal are bonded to each other by diffusion bonding ,and wherein the metal bonded structure has a portion along a line that is orthogonal to a bonded interface between the first bonding portion and the second bonding portion, in which the number of copper grain boundaries per unit length is greater than that of the first bonding portion and that of the second bonding portion.2. A metal bonding method comprising:preparing a first bonding portion formed of copper-based metal and a second bonding portion formed of copper-based metal;forming, on a surface of at least one from among the first bonding portion and the second bonding portion, a microcrystalline layer having a cooper grain size that is smaller than that of the bonding portion configured as a base member;filling a gap between the first bonding portion and the second bonding portion with a solution into which an oxide with copper oxide as a principal component can be eluted;applying pressure to the first bonding portion and the second bonding portion ...

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Номер записи: 34
26-09-2013 дата публикации

Precision ribbon resistance welding system

Номер: US20130248496A1
Автор: Asghar Dadashian, Dro Darbidian, Hamid Habibi, Reza Imani
Принадлежит: Pacesetter Inc

Disclosed herein is a resistance welding system for welding a ribbon to a bond site of a bond surface. The system includes a welding header, a bond header, a ribbon dispenser, a cutter, and a support surface. The welding header includes a resistance welding tip. The bond header includes a bond foot displaceable relative to the bond surface. The bond foot includes a welding aperture. The ribbon dispenser feeds the ribbon to the bond foot. The support surface is configured to support the bond surface. The bond foot is configured to press the ribbon against the bond site of the bond surface, which is thereby forced against the support surface. With the ribbon so pressed against the bond site, the system is configured to cause the welding tip to enter the welding aperture to resistance weld the ribbon to the bond site of the bond surface.

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Номер записи: 35
17-10-2013 дата публикации

Alloy formation control of transient liquid phase bonding

Номер: US20130270326A1
Автор: Koji Shiozaki, Sang Won Yoon
Принадлежит: Toyota Motor Engineering and Manufacturing North America Inc

A bonding structure enabling fast and reliable methods to fabricate a substantially homogeneous bondline with reduced dependency of a thickness limitation is disclosed. Also, this system creates a bondline targeted for performance in power electronics. This system is highly adaptable as various structures and fabrication options may be implemented. This enables diverse fabrication selection and creates less dependency on outside conditions. The disclosed system is at least applicable to wafer-to-wafer, die-to-wafer, die-to-substrate, or die-to-die bonding.

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Номер записи: 36
31-10-2013 дата публикации

ELECTRICALLY DRIVEN RAPIDLY VAPORIZING FOILS, WIRES AND STRIPS USED FOR COLLISION WELDING AND SHEET METAL FORMING

Номер: US20130283878A1
Автор: DAEHN Glenn S., Johnson Jason R., TABER Geoffrey A., Vivek Anupam
Принадлежит:

A method for forming a piece of a sheet metal is performed by positioning a consumable body, made of metal, proximate to the piece of the sheet metal. The consumable body is rapidly vaporized, and the gas pressure generated thereby is directed into the piece of the sheet metal. This results in acceleration of the piece of sheet metal, and it is collided into a stationary body at a velocity, generally in excess of 200 m/s. Depending upon the type of stationary body, the piece of sheet metal is deformed into a predetermined shape or is welded onto the stationary body. The vaporization is accomplished by passing a high current of electricity into the consumable body. The effect of the vaporized metal may be augmented by additional components in the consumable body. 1. A method for forming a piece of a sheet metal , comprising the steps of:positioning a consumable body, comprising a metal, proximate to the piece of the sheet metal;accelerating the piece of the sheet metal by rapidly vaporizing the consumable body and directing the gas pressure generated by the rapidly-vaporized metal into the piece of the sheet metal; andcolliding the accelerated piece of the sheet metal into a stationary body, resulting in the formed piece of sheet metal.2. The method of claim 1 , wherein:the consumable body comprises a metal foil.3. The method of claim 1 , wherein:in the colliding step, the stationary body is a die and the piece of sheet metal is deformed by the collision to create a desired shape or surface structure4. The method of claim 1 , wherein:in the colliding step, the stationary body is a die that contains holes, such that-the piece of sheet metal is perforated or sheared by the collision to create a desired hole or series of holes.5. The method of claim 1 , wherein:in the colliding step, the stationary body is a further piece of metal and the piece of sheet metal is welded thereto by the collision.6. The method of claim 3 , wherein:the piece of sheet metal and the further ...

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Номер записи: 37
31-10-2013 дата публикации

METAL BONDING APPARATUS

Номер: US20130284794A1
Автор: Saitou Kouichi, Suzuki Takashi, YANASE Yasuyuki
Принадлежит: SANYO ELECTRIC CO., LTD.

The metal bonding apparatus comprises: a solution supply unit configured to supply a solution which is able to elute an oxide with copper oxide as a principal component, to at least one of a first bonding portion and a second bonding portion; a pressing unit configured to apply pressure to the first bonding portion and the second bonding portion so as to sandwich the solution between the first bonding portion and the second bonding portion, and in a direction in which a distance between the first bonding portion and the second bonding portion is reduced; and a heating unit configured to heat the first bonding portion and the second bonding portion, wherein the first bonding portion and the second bonding portion are bonded by the pressure applied by the pressing unit and the heat from the heating unit. 1. A metal bonding apparatus comprising:a solution supply unit configured to supply a solution which is able to elute an oxide with copper oxide as a principal component, to at least one of a first bonding portion and a second bonding portion;a pressing unit configured to apply pressure to the first bonding portion and the second bonding portion so as to sandwich the solution between the first bonding portion and the second bonding portion, and in a direction in which a distance between the first bonding portion and the second bonding portion is reduced; anda heating unit configured to heat the first bonding portion and the second bonding portion,wherein the first bonding portion and the second bonding portion are bonded by the pressure applied by the pressing unit and the heat from the heating unit.2. A metal bonding apparatus according to claim 1 ,wherein the first bonding portion comprises a first base portion formed of a metal with copper as a principal component and the first coating portion formed of an oxide with copper oxide as a principal component and configured to coat a surface of the first base portion,wherein the second bonding portion comprises a second ...

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Номер записи: 38
31-10-2013 дата публикации

ALLOYING ELEMENT-SAVING HOT ROLLED DUPLEX STAINLESS STEEL MATERIAL, CLAD STEEL PLATE HAVING DUPLEX STAINLESS STEEL AS CLADDING MATERIAL THEREFOR, AND PRODUCTION METHOD FOR SAME

Номер: US20130288074A1
Автор: Ishida Kazuhiko, Kajimura Haruhiko, Oikawa Yuusuke, Tsuge Shinji, Yamamoto Yoichi
Принадлежит:

This alloying element-saving hot rolled duplex stainless steel material contains, by mass %, C: 0.03% or less, Si: 0.05% to 1.0%, Mn: 0.5% to 7.0%, P: 0.05% or less, S: 0.010% or less, Ni: 0.1% to 5.0%, Cr: 18.0% to 25.0%, N: 0.05% to 0.30% and Al: 0.001% to 0.05%, with a remainder being Fe and inevitable impurities, wherein the alloying element-saving hot rolled duplex stainless steel material is produced by hot rolling, a chromium nitride precipitation temperature TN is in a range of 960° C. or lower, a yield strength is 50 MPa or more higher than that of a hot rolled steel material which is subjected to a solution heat treatment, and the alloying element-saving hot rolled duplex stainless steel material is as hot rolled state, and is not subjected to a solution heat treatment. This clad steel plate includes a duplex stainless steel as a cladding material, the duplex stainless steel has the above composition, and the chromium nitride precipitation temperature TN is in a range of 800° C. to 970° C. 1. An alloying element-saving hot rolled duplex stainless steel material comprising , by mass %:C: 0.03% or less;Si: 0.05% to 1.0%;Mn: 0.5% to 7.0%;P: 0.05% or less;S: 0.010% or less;Ni: 0.1% to 5.0%;Cr: 18.0% to 25.0%;N: 0.05% to 0.30%; andAl: 0.001% to 0.05%,with a remainder being Fe and inevitable impurities,wherein the alloying element-saving hot rolled duplex stainless steel material is produced by hot rolling,a chromium nitride precipitation temperature TN, which is an index regarding precipitation of chromium nitrides during the hot rolling, is in a range of 960° C. or lower,a yield strength is 50 MPa or more higher than that of a hot rolled steel material which is subjected to a solution heat treatment, andthe alloying element-saving hot rolled duplex stainless steel material is as hot rolled state, and is not subjected to a solution heat treatment.2. An alloying element-saving hot rolled duplex stainless steel material comprising , by mass %:C: 0.03% or less;Si: ...

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Номер записи: 39
07-11-2013 дата публикации

METHOD OF MAKING A METAL-STRIP LAMINATE

Номер: US20130295443A1
Автор: STUTH Bernhard
Принадлежит:

A metal laminate is made by first laying at least one first metal strip of at least one first metal having a thickness of 40 μm to 750 μm on at least one second metal strip of a second metal different from the first metal to form a multilayer stack having a total thickness between 2 mm and 15 mm. Then the first and second strips of the multilayer stack are bonded together by rolling. Finally a finished laminate is formed by reducing a thickness of the bonded-together first and second strips by rolling in at least one pass such that the one first metal strip has a thickness of 0.5 to 10 μm. 1. A method of making a metal laminate , the method comprising the steps of sequentially:a) laying at least one first metal strip of at least one first metal having a thickness of 40 μm to 750 μm on at least one second metal strip of a second metal different from the first metal to form a multilayer stack having a total thickness between 2 mm and 15 mm;b) bonding together the first and second strips of the multilayer stack by rolling; andc) forming a finished laminate by reducing a thickness of the bonded-together first and second strips by rolling in at least one pass such that the one first metal strip has a thickness of 0.5 to 10 μm.2. The method defined in claim 1 , wherein the multilayer stack has a total thickness between 5 and 7 mm.3. The method defined in claim 1 , further comprising the step of:diffusion annealing the stack prior to step c) to produce between the first and second strip a diffusion layer that is also reduced in thickness during thickness reduction.4. The method defined in claim 1 , wherein the stack is comprised of only the first strip and the second strip.5. The method defined in claim 4 , wherein prior to step c) the thickness of the one second metal strip is 5 to 10 mm and the thickness of a first metal strip is 0.8-15% of the thickness of the individual singular second metal strip.6. The method defined in claim 4 , wherein the first metal strip is a ...

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Номер записи: 40
14-11-2013 дата публикации

Electromagnetic pulse - welding device for welding metal sheet, comprising a cooling insulator

Номер: US20130299487A1
Автор: Pablo Pasquale
Принадлежит: PST Products GmbH

The invention relates to an electromagnetic pulse-welding device for joining a metal sheet to a metal part, consisting of an electric energy source which is connected to a coil by means of a current conductor, the active part of said coil being in the direct proximity of the metal sheet, said metal sheet being at a distance from the metal part. The passive part of the coil has a larger cross-section than the active part and said active part borders on one part of the surface in a positive fit, to a cooling insulator, the material having a relatively high thermal conductivity and a relatively low magnetic and electric conductivity compared to the material of the coil.

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Номер записи: 41
23-01-2014 дата публикации

Method of Manufacturing Coil Tubing Using Friction Stir Welding

Номер: US20140021244A1
Автор: DuBois Jon D.
Принадлежит:

A method of manufacturing coiled tubing comprises joining two portions of parent stock metal by friction stir welding. The adjoining portions of said two portions of parent stock metal are first reduced to a deformable plastic state, and then allowed to cool in such a manner that there is no re-crystallization of parent stock metal in a resulting weld. 1joining two portions of parent stock metal by friction stir welding so that adjoining portions of said two portions of parent stock metal are first reduced to a deformable plastic state, and then allowed to cool in such a manner that there is no recrystalization of parent stock metal in a resulting weld.. A method of manufacturing coiled tubing, said method comprising: 1. Field of the InventionEmbodiments of the invention generally relate to a method of manufacturing coil tubing using friction stir welding.2. Description of the Related ArtCoiled steel tubing is used in the oil and gas industry for many applications in the drilling and workover areas. The tubing is produced in a continuous milling operation that utilizes coiled strip of the appropriate width to make the correct diameter of tube. These strips are joined or welded together by a process that causes the metal to be melted or liquefied and filler metal or wire is necessary to be added to the weld puddle to provide a suitable weld.These welded strips are then run continuously through the ERW tube mill to produce a “string” of tubing that can be as much as 20,000 feet long. The welded string is then placed on a large truck that sets up over the well and the tubing is reeled repeatedly in and out of the well as various fluids and acids are pumped through the tube.The 20,000 foot string can have as many as 15-20 strip welds that were made to make up the 20,000 foot string. As the tubing is forced in and out of the well, it is repeatedly coiled and uncoiled on the truck reel and the wall of the tubing is repeatedly stressed as the tubing is bent and has a high ...

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Номер записи: 42
30-01-2014 дата публикации

METHOD FOR BONDING ALUMINUM-BASED METALS

Номер: US20140030634A1
Автор: HIROSE Akio, Inoue Masayuki, MIYAMOTO Kenji, Nanbu Toshikazu, Uehara Yoshitaka, Yamamoto Chika
Принадлежит: NISSAN MOTOR CO., LTD.

An inexpensive bonding method is provided to bond materials constituted of an aluminum-based metal to each other at a low temperature and a low pressure while inhibiting deformation, without requiring the use of a flux and minimizing the influence on the base materials and the periphery. Also provided are various bonded parts obtained by the bonding method. An insert material comprising Zn as an element that undergoes a eutectic reaction with Al is interposed between two materials constituted of an aluminum-based metal. The two materials are heated, while being pressed against each other, to a temperature at which the eutectic reaction takes place, thereby generating, at the bonding interface between the two materials, a melt due to the eutectic reaction with some of the Al contained in the base materials and discharging the Al oxide films from the bonding interface together with the melt. Thus, the two materials are bonded. 1. A method for joining aluminum-based metals , comprising:interposing an insert material between two materials composed of aluminum-based metal, the insert material composed of an alloy containing, as main components, zinc and aluminum; zinc and magnesium; zinc, magnesium and aluminum; zinc, copper and aluminum; zinc, tin, aluminum; or zinc, silver and aluminum;heating the two materials composed of aluminum-based metal to a temperature that causes a eutectic reaction while pressing the two materials toward each other, thereby generating a melt by eutectic reaction containing aluminum from the aluminum-based metal the two materials at a joint interface; anddischarging aluminum oxide film along with the melt from the joint interface.2. (canceled)3. (canceled)4. (canceled)5. (canceled)6. (canceled)7. (canceled)8. (canceled)9. The joining method as claimed in claim 1 , wherein pressing is performed within a range between 5 Mpa and 30 Mpa.10. The joining method as claimed in claim 1 , wherein the insert material is foil shaped.11. The joining method ...

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Номер записи: 43
20-02-2014 дата публикации

ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME

Номер: US20140048584A1
Автор: Luechinger Christoph B., Valentin Orlando L., Xu Tao
Принадлежит: Orthodyne Electronics Corporation

An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool for bonding a conductive bonding material to a workpiece. The ultrasonic bonding system also includes a pressing member adapted to press against the workpiece, the pressing member being supported by the bond head assembly and being moveable with respect to the bond head assembly independent of the bonding tool. The pressing member includes a body portion and a plurality of pressing elements extending below the body portion, the pressing elements being configured to contact the workpiece. 1. An ultrasonic bonding system comprising:a bond head assembly;a bonding tool for bonding a conductive bonding material to a workpiece, the bonding tool being supported by the bond head assembly; anda pressing member adapted to press against the workpiece, the pressing member being supported by the bond head assembly and being moveable with respect to the bond head assembly independent of the bonding tool, the pressing member including a body portion and a plurality of pressing elements extending below the body portion, the pressing elements being configured to contact the workpiece.2. The ultrasonic bonding system of further comprising an actuator adapted to move the plurality of pressing elements into and out of contact with the workpiece.3. The ultrasonic bonding system of wherein the pressing member includes at least one compression element being compressible during contact between at least one of the plurality of pressing elements and the workpiece.4. The ultrasonic bonding system of wherein the body portion of the pressing member is configured to surround the bonding tool at a position along the bonding tool during a wire bonding operation.5. The ultrasonic bonding system of wherein the body portion and the plurality of pressing elements are formed from a unitary piece of material.6. The ultrasonic bonding system of wherein the plurality of pressing ...

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Номер записи: 44
20-02-2014 дата публикации

Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly

Номер: US20140048805A1
Автор: Akira Yamauchi, Ryuichi Kondou, Tadatomo Suga
Принадлежит: BONDTECH CO Ltd, Lan Technical Service Co Ltd, TAIYO YUDEN CO LTD

[Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.

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Номер записи: 45
06-03-2014 дата публикации

Precise-Aligned Lock-And-Key Bonding Structures

Номер: US20140061901A1
Автор: Fei Liu, Kuan-Neng Chen
Принадлежит: International Business Machines Corp

Copper (Cu)-to-Cu bonding techniques are provided. In one aspect, a bonding method is provided. The method includes the following steps. A first bonding structure is provided having at least one copper pad embedded in a first insulator and at least one via in the first insulator over the copper pad, wherein the via has tapered sidewalls. A second bonding structure is provided having at least one copper stud embedded in a second insulator, wherein a portion of the copper stud is exposed for bonding and has a domed shape. The first bonding structure is bonded to the second bonding structure by way of a copper-to-copper bonding between the copper pad and the copper stud, wherein the via and the copper stud fit together like a lock-and-key. A bonded structure is also provided.

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Номер записи: 46
13-03-2014 дата публикации

METHOD FOR FABRICATING A SINGLE-PIECE PART FOR A TURBINE ENGINE BY DIFFUSION BONDING

Номер: US20140068937A1
Автор: Dambrine Bruno Jacques Gerard, Godon Thierry
Принадлежит: SNECMA

A method of fabricating a single-piece part for a turbine engine by diffusion bonding, the method including making a blank for the part around a mandrel, the blank including a plurality of coaxial and superposed annular layers of independent rings of metal wire that are stacked on one another around the mandrel, and subjecting the blank to hot isostatic pressing to obtain a single-piece part, and optionally machining the part. 110-. (canceled)11. A method for fabricating a single-piece part for a turbine engine by diffusion bonding , the method comprising:making a blank around a mandrel, the blank including at least one layer of metal wires;subjecting the blank to a hot isostatic pressing to obtain a single-piece part; andoptionally machining the part;wherein the at least one layer of metal wires in the blank includes independent rings that are engaged and stacked on the mandrel.12. A method according to claim 11 , wherein the rings are of a circular or a non-circular shape.13. A method according to claim 12 , wherein the rings are pre-formed with a shape that is a circular or a non-circular shape claim 12 , prior to being engaged on the mandrel.14. A method according to claim 11 , wherein the mandrel is of a cylindrical or a non-cylindrical shape.15. A method according to claim 11 , wherein the rings are closed rings.16. A method according to claim 11 , wherein the rings are split at a zone around a circumference.17. A method according to claim 16 , wherein the opening of each ring engaged on the mandrel is angularly offset relative to openings of adjacent rings around a longitudinal axis of the mandrel.18. A method according to claim 11 , wherein the single-piece part is one of a single-piece shaft claim 11 , a disk claim 11 , or a bladed ring of a turbine engine.19. A method according to claim 11 , wherein at least one annular layer of metal-coated ceramic fibers is arranged between two successive metal wire layers on the mandrel.20. A method according to claim ...

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Номер записи: 47
13-03-2014 дата публикации

Friction stir spot welding device and friction stir spot welding method

Номер: US20140069986A1
Автор: Hajime Kashiki, Hideki Okada, Kazumi Fukuhara, Mitsuo Fujimoto
Принадлежит: Kawasaki Jukogyo KK

A tool driving section of a friction stir spot welding device is configured to advance and retract each of a pin member and a shoulder member. A tool driving control section is configured to control the tool driving section such that an absolute value of a tool average position Tx defined by a following equation: Ap·Pp+As·Ps=Tx, where Ap is a cross-section area of a front end surface of the pin member, As is a cross-section area of a front end surface of the shoulder member, Pp is a press-fit depth of the pin member press-fitted from a front surface of an object to be welded, and Ps is a press-fit depth of the shoulder member press-fitted from the front surface of the object to be welded, is small.

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Номер записи: 48
27-03-2014 дата публикации

Method for joining substrates

Номер: US20140083597A1
Автор: Carolin Rothhardt, Gerhard Kalkowski, Mathias Rohde, Ramona Eberhardt
Принадлежит: Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV, Friedrich Schiller Universtaet Jena FSU

The invention relates to a method of joining substrates. It is the object of the invention in this respect to join substrates of substrate materials together without having to exert an increased effort for a coating with additional coating processes to be carried out and to be able to achieve a good quality of the join connection in so doing. In the method in accordance with the invention a pretreatment of at least one join surface of a substrate to be joined is carried out in low pressure oxygen plasma prior to the actual joining. On the joining, a contact force acts on the substrates to be joined in the range 2 kPa to 5 MPa and in this process a heat treatment is carried out at an elevated temperature of at least 100° C. and at under pressure conditions of a maximum of 10 mbar, preferably <10 −3 mbar.

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Номер записи: 49
27-03-2014 дата публикации

Joint of metal material and ceramic-carbon composite material, method for producing same, carbon material joint, jointing material for carbon material joint, and method for producing carbon material joint

Номер: US20140086670A1
Автор: Tetsuro Tojo, Tomoyuki Ohkuni, Weiwu Chen, Yoshinari Miyamoto
Принадлежит: Toyo Tanso Co Ltd

Provided are a joint of a metal material and a ceramic-carbon composite material which can be used at high temperatures, a method for producing the same, a novel carbon material joint, a jointing material for a carbon material joint, and a method for producing a carbon joint. A joint 6 of a metal material 4 and a ceramic-carbon composite material 1 is a joint of a metal material 4 made of metal and a ceramic-carbon composite material 1. The ceramic-carbon composite material 1 includes a plurality of carbon particles 2 and a ceramic portion 3 made of ceramic. The ceramic portion 3 is formed among the plurality of carbon particles 2. The metal material 4 and the ceramic-carbon composite material 1 are joined through a joining layer 5. The joining layer 5 contains a carbide of the metal and the ceramic.

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Номер записи: 50
06-01-2022 дата публикации

CLADDED ARTICLE WITH CLAD LAYER HAVING VARYING THICKNESS

Номер: US20220001649A1
Автор: Guenther Karsten, Prothe Curtis Erwin, Ruminski Andrew, Sparkowich Steven David
Принадлежит: DMC Global Inc.

A cladded article may include a first metallic layer, a clad layer, and a first solid-state welding interface region positioned between the clad layer and the first metallic layer. The clad layer may include a first clad layer region having a first clad layer thickness in a thickness direction of the clad layer and a second clad layer region having a second clad layer thickness in the thickness direction of the clad layer. The second clad layer thickness may be greater than the first clad layer thickness. 1. A cladded article comprising:a first metallic layer; a first clad layer region having a first clad layer thickness in a thickness direction of the clad layer; and', 'a second clad layer region having a second clad layer thickness in the thickness direction of the clad layer; wherein', 'the second clad layer thickness is greater than the first clad layer thickness; and, 'a clad layer, the clad layer comprisinga first solid-state welding interface region positioned between the clad layer and the first metallic layer.2. The cladded article of claim 1 , wherein the first solid-state welding interface region is a first explosion welding interface region.3. The cladded article of claim 1 , wherein the second clad layer region is one of a plurality of second clad layer regions.4. The cladded article of claim 1 , further comprising:a second metallic layer; anda second solid-state welding interface region bonding the second metallic layer to the first metallic layer on a side opposite the clad layer.5. The cladded article of claim 1 , wherein the clad layer comprises one of zirconium claim 1 , niobium claim 1 , palladium claim 1 , platinum claim 1 , ruthenium claim 1 , rhodium claim 1 , osmium claim 1 , and iridium claim 1 , or an alloy including one of zirconium claim 1 , niobium claim 1 , palladium claim 1 , platinum claim 1 , ruthenium claim 1 , rhodium claim 1 , osmium claim 1 , and iridium.6. The cladded article of claim 4 , wherein the second solid-state welding ...

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Номер записи: 51
01-01-2015 дата публикации

Cookware with Selectively Bonded Layers

Номер: US20150001226A1
Автор: Groll William A.
Принадлежит: ALL-CLAD METALCRAFTERS LLC

Cookware comprising a selectively bonded composite of at least two layers of materials wherein the first of the at least two layers of materials has a plurality of spaced-apart bubbles formed on its surface, defining a cooking surface of the cookware, and a second layer of two layers of material is bonded thereto, wherein the bonding between the bubbles and the second material is of a lesser degree than the bonding between the first and second layers of materials in areas intermediate the bubbles, whereby a coefficient of heat conductivity is greater in the intermediate areas than in the bubbles.

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Номер записи: 52
01-01-2015 дата публикации

METHOD FOR JOINING METAL MATERIALS

Номер: US20150001280A1
Автор: MIYAMOTO Kenji, Nakagawa Shigeyuki, Nanbu Toshikazu
Принадлежит:

A method for joining metal materials, which joins a first member with at least a joining face made of Metal A, the Metal A being mainly composed of at least one selected from the group consisting of Al, Cu, Ag and Au, to a second member with at least a joining face made of Metal B, the Metal B being mainly composed of at least one selected from the group consisting of Al Cu, Ag and Au, includes interposing an insert between the joining faces of the first and second members, wherein the insert contains Zn as a metal capable of causing an eutectic reaction with at least one metal except for Au in Metal A as well as at least one metal except for Au in Metal B. 1. A method for joining metal materials , which joins a first member with at least a joining face made of Metal A , the Metal A being mainly composed of at least one selected from the group consisting of Al , Cu , Ag and Au , to a second member with at least a joining face made of Metal B , the Metal B being mainly composed of at least one selected from the group consisting of Al Cu , Ag and Au , except for joining metals both of which are mainly composed of Al and joining metals both of which are mainly composed of Au , comprising:interposing an insert between the joining faces of the first and second members, wherein the insert contains Zn as a metal capable of causing an eutectic reaction with at least one metal except for Au in Metal A as well as at least one metal except for Au in Metal B; andjoining the first and second members to each other by heating the first and second members to a temperature causing the eutectic reaction within a range from a melting point of the insert to the melting point+100° C. while applying an opposing pressure to the first and second members, so that an eutectic melt is produced at an joining interface between the first and second members, and an oxide film formed on a surface of the Metal A and/or Metal B is discharged from the joining interface along with the eutectic melt.2. ...

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Номер записи: 53
07-01-2016 дата публикации

Solid Cartridge for a Pulse Weld Forming Electrode and Method of Joining Tubular Members

Номер: US20160001392A1
Автор: Bonnen John Joseph Francis, Dawson Scott Alwyn, deVries James, Golovashchenko Sergey Fedorovich, Maison Lloyd Douglas, Mamutov Alexander
Принадлежит:

A cartridge assembly is disclosed for a pulse welding a first tube supported on a mandrel to a second tube. An outer tool is assembled over the second tube and a stored charge is discharged in the cartridge assembly. The cartridge comprises an annular conductor and a solid casing enveloping the conductor. The stored charge is electrically connected to the conductor and discharged through the conductor to compress the second tube and pulse weld the second tube to the first tube. 1. A cartridge assembly for a pulse welding a first tube supported by a support structure to a second tube , a tool assembled to the second tube , by discharging a stored charge , the cartridge assembly comprising:a conductor; anda solid casing enveloping the conductor, wherein the stored charge is electrically connected to the conductor and discharged through the conductor to compress the second tube and pulse weld the second tube to the first tube.2. The cartridge assembly of wherein the casing is encased between the second tube and a cavity formed in the tool when the stored charge is discharged.3. The cartridge assembly of wherein the conductor is a metal coil that generates an electro-magnetic pulse against the second tube that drives the second tube into the first tube.4. The cartridge assembly of wherein the electro-magnetic pulse kinetically drives the second tube toward the first tube to form the pulse weld joining the first tube to the second tube.5. The cartridge assembly of wherein the conductor is a metal foil that generates an electro-magnetic pulse against the second tube that drives the second tube into the first tube.6. The cartridge assembly of wherein the solid casing is formed from a relatively incompressible material that is sufficiently incompressible to transmit the stored charge when discharged into the conductor to the second tube.7. The cartridge assembly of wherein the incompressible material is a polyurethane based composition.8. The cartridge assembly of wherein ...

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Номер записи: 54
02-01-2020 дата публикации

Processes and tooling associated with diffusion bonding the periphery of a cavity-back airfoil

Номер: US20200001411A1
Автор: Daniel A. Bales, Thomas DeMichael
Принадлежит: United Technologies Corp

A fixture assembly includes a first fixture portion, a second fixture portion that interfaces with the first fixture portion, and a sub-fixture movably mounted to the first fixture portion. A multiple of actuators selectively move the sub-fixture toward the second fixture portion. A method of manufacturing a fan blade includes deploying the sub-fixture from the first fixture portion to effectuate a peripheral diffusion bond to join the blade body and the cover of the fan blade.

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Номер записи: 55
04-01-2018 дата публикации

ALUMINUM-ALLOY-CLAD PLATE AND ALUMINUM-ALLOY-CLAD STRUCTURAL MEMBER

Номер: US20180001596A1
Автор: Matsumoto Katsushi, SATO Kazufumi
Принадлежит: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)

An aluminum-alloy-clad plate in which a plurality of aluminum alloy layers are layered and diffusion heat treatment is performed thereon, wherein aluminum alloy layers having a specific composition are layered so as to each have a different content Mg or Zn, the structure of the aluminum alloy clad plate after diffusion heat treatment thereof has a minute crystal grain diameter and a predetermined amount of a specific Mg and Zn inter-diffusion region in which Mg and Zn of layered aluminum alloy layers are diffused with each other, and increased strength and high moldability are obtained at the same time. 1. An aluminum alloy clad plate as a laminate of a plurality of aluminum alloy layers ,wherein each of the aluminum alloy layers laminated inside of an aluminum alloy layer on an outermost layer side of the aluminum alloy clad plate contains one or both of Mg: 3 to 10 mass % and Zn: 5 to 30 mass %,the aluminum alloy layer on the outermost layer side has a composition containing Mg in a range from 3 to 10 mass % and Zn that is limited to 2 mass % or less (including 0 mass %),the aluminum alloy layers are laminated such that aluminum alloy layers having different contents of one of Mg and Zn are adjacently bonded to each other, the total number of laminated layers is 5 to 15, and total thickness is 1 to 5 mm,the aluminum alloy clad plate has an average content of Mg in a range from 2 to 8 mass % and an average content of Zn in a range from 3 to 20 mass %; the average content being an average of the contents of each of Mg and Zn of the laminated aluminum alloy layers,when the aluminum alloy clad plate is subjected to diffusion heat treatment, the aluminum alloy clad plate has a microstructure having an average grain size of 200 μm or less, the average grain size being an average of grain sizes of the laminated aluminum alloy layers, and having Mg—Zn interdiffusion regions each containing Mg and Zn that interdiffuse between the laminated aluminum alloy layers, andsome ...

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Номер записи: 56
07-01-2016 дата публикации

METHOD OF FABRICATION OF AI/GE BONDING IN A WAFER PACKAGING ENVIRONMENT AND A PRODUCT PRODUCED THEREFROM

Номер: US20160002029A1
Автор: Flannery, JR. Anthony F., NASIRI Steven S.
Принадлежит:

A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer. 1. A method for bonding a first substrate wafer and a second substrate wafer , a patterned aluminum layer disposed on the first substrate wafer , a patterned germanium layer disposed on the second substrate wafer , the method comprising:placing the first substrate wafer in a first chuck;placing the second substrate wafer in a second chuck;aligning the first substrate wafer and the second substrate wafer; andforming a eutectic bond between the patterned germanium layer and the patterned aluminum layer, wherein the eutectic bond is formed by applying a force across the first chuck and the second chuck, and ramping the temperature over the eutectic point of the aluminum/germanium bond to a second predetermined temperature that is less than 450° C.2. The method of claim 1 , wherein one of the first and second substrate wafers is a cover wafer.3. The method of claim 1 , wherein providing an insulating layer between the second substrate wafer and a portion of the patterned germanium layer.4. A method for bonding a first substrate wafer and a second substrate wafer claim 1 , an aluminum layer disposed on the first substrate wafer claim 1 , a germanium layer disposed on the second substrate wafer claim 1 , the method comprising:placing the first substrate wafer in a first chuck;placing the second substrate wafer in a second chuck; ...

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Номер записи: 57
03-01-2019 дата публикации

DEVICE AND METHOD FOR PARTS ASSEMBLY FOR A NACELLE OF AN AIRCRAFT TURBOJET ENGINE

Номер: US20190002131A1
Автор: BELINY Serge, Bienvenu Philippe, CORNU CHRISTOPHE, DELAMOTTE DAVID, MERABET BOUALEM
Принадлежит: Safran Nacelles

A device and a method of assembly by brazing or diffusion-welding under a gaseous pressure is provided to make structures for a nacelle of an aircraft turbojet engine such as an inner fixed structure. Sealing of the assembly space inside which the parts to assemble are disposed is provided by tie members exerting a mechanical pressure on mold elements. The tie members include jaws made of a first material and a holding element made of a second material. The first material has a thermal expansion coefficient higher than that of the second material. 1. A device for assembling by brazing or diffusion-welding metallic parts for a nacelle of an aircraft turbojet engine , the device comprising:tooling including a first mold element and a second mold element, the tooling configured to clasp the metallic parts within an assembly space between the first mold element and the second mold element;a gas injection device to inject a gas into the assembly space such that an increase in pressure presses the metallic parts against each other;an enclosure adapted to receive the tooling and the metallic parts; anda heating device arranged to increase a temperature inside the enclosure to an assembly temperature,wherein the tooling further includes tie members configured to seal the assembly space, each tie member comprising two jaws and a holding element,wherein the holding element is configured to hold the two jaws in a sealing position and cause the two jaws to exert a mechanical pressure against respective bearing surfaces of the first mold element and of the second mold element such that the mechanical pressure inhibits the first mold element and the second mold element from getting away from each other at least along a direction normal to said bearing surfaces at least at the assembly temperature,wherein the two jaws of each tie member comprises a first material and the holding element of each tie member comprises a second material, the first material having a thermal expansion ...

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Номер записи: 58
04-01-2018 дата публикации

Fuel Nozzle of Gas Turbine Combustor and Manufacturing Method Thereof, and Gas Turbine Combustor

Номер: US20180003386A1
Автор: Keisuke Miura, Mitsuhiro KARISHUKU, Satoshi Dodo, Satoshi Kumagai, Yoshihide Wadayama
Принадлежит: Mitsubishi Hitachi Power Systems Ltd

To provide a fuel nozzle for a gas turbine combustor, offering favorable durability and strength reliability. In a fuel nozzle for a gas turbine combustor, jetting fuel into a combustion chamber of the gas turbine combustor, the fuel nozzle is metallurgically and integrally bonded with a base plate that supports the fuel nozzle, and an interface between the fuel nozzle and the base plate includes a surface in which bonding is performed by a fusion joint or a brazing joint and an inside part in which bonding is performed by pressure bonding.

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Номер записи: 59
05-01-2017 дата публикации

BONDING DEVICE

Номер: US20170005064A1
Автор: Sugito Akio
Принадлежит:

[Problem] 1. A bonding device that includes a vibration driving portion to vibrate a capillary , the vibration driving portion comprising:a piezoelectric element that is expanded and contracted along an axial direction of a bonding arm with one end thereof fixed to a leading end of the bonding arm;a capillary holding portion that is in contact with a circumferential face of the capillary at a base end side thereof as being fixed to the other end of the piezoelectric element;a string-like member that is wound to a half circumferential face of the capillary at the base end side on a side opposite to the capillary holding portion; anda tension mechanism that is arranged at the bonding arm side to press and hold the capillary to the capillary holding portion by exerting tensile force on the string-like member.2. The bonding device according to claim 1 ,wherein the vibration driving portion operates without utilizing resonance.3. The bonding device according to claim 1 ,wherein the string-like member presses and holds the capillary to the capillary holding portion so that the capillary is capable of performing bonding operation owing to that tensile force is exerted on the string-like member by the tension mechanism.4. The bonding device according to claim 1 ,wherein the string-like member has tensile force exerted by the tension mechanism and applies preliminary pressure required for driving the capillary and fixing the capillary to the capillary holding portion.5. The bonding device according to claim 1 ,wherein the string-like member has a possible length of expansion and contraction being larger than a length of expansion and contraction of the piezoelectric element in a state that predetermined preliminary pressure required for driving the capillary and fixing the capillary to the capillary holding portion is applied as having tensile force exerted by the tension mechanism.6. The bonding device according to claim 1 ,wherein the tension mechanism causes ends of the ...

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Номер записи: 60
05-01-2017 дата публикации

BONDING DEVICE

Номер: US20170005065A1
Автор: Sugito Akio
Принадлежит: Kaijo Corporation

[Problem] To provide a bonding device capable of adequately controlling a leading end of a capillary when a ball formed at a leading end of a wire is pressed and bonded to an electrode of a semiconductor chip with scrub vibration. 1. A bonding device that includes a vibration driving portion to vibrate a capillary , the vibration driving portion comprising:a plurality of piezoelectric elements that are expanded and contracted along an axial direction of a bonding arm respectively with one end thereof fixed to a leading end of the bonding arm;a plurality of capillary holding portions that are in contact respectively with a circumferential face of the capillary at a base end side thereof as being fixed correspondingly to the other end of the piezoelectric elements; anda pressing-holding portion that sandwiches the capillary as pressing the capillary to the capillary holding portions with at least one end side fixed to the bonding arm and the other end side being in contact with the circumferential face of the capillary at the base end side thereof on a side opposite to the capillary holding portions.2. The bonding device according to claim 1 ,wherein the vibration driving portion operates without utilizing resonance.3. The bonding device according to claim 1 ,wherein the piezoelectric elements are arranged along the axial direction of the capillary.4. The bonding device according to claim 1 ,wherein the piezoelectric elements are two piezoelectric elements that are arranged along the axial direction of the capillary, the two piezoelectric elements being a first piezoelectric element and a second piezoelectric element arranged below the first piezoelectric element.5. The bonding device according to claim 4 ,wherein voltage waveforms having the same phase are applied to the first piezoelectric element and the second piezoelectric element.6. The bonding device according to claim 4 ,wherein voltage waveforms with a phase difference of 180 degrees set therebetween at the ...

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Номер записи: 61
07-01-2016 дата публикации

Method for Cohesive Joining to a Cable End, and also Configured Cable

Номер: US20160006138A1
Автор: Essers Marc, Harms Alexander, Reisgen Uwe, Schiebahn Alexander, Schleser Markus
Принадлежит:

The invention proposes a method for cohesive joining to a cable end (), in which method a welding tool element () is fitted on an open bundle end of individual cores () of the cable end (), welding energy is fed into the individual cores ( ), and the welding tool element () is removed from the bundle end. In the process, an engagement recess () can be formed in the open bundle end, an engagement pin () of the welding tool element () can engage into the engagement recess (), and at least a portion of the welding energy can be fed via the engagement recess (). A configured cable comprising individual cores () with a receiving sleeve () is also presented, wherein the receiving sleeve () has an inlet opening () for a bundle () of the individual cores (), the receiving sleeve () has an end piece () which is widened in relation to the inlet opening (), and there is, at least also in the widened end piece (), a cohesive connection between at least one subset of the individual cores () with respect to one another and/or between at least a subset of the individual cores () and the receiving sleeve (). 118-. (canceled)1921513037414345485321530374143454853. A method for materially joining at an open bundle end of individual strands ( , ) of at least one cable end () , in which method a welding tool element ( , , , , , , ) is mounted onto said open bundle end with a contact pressure acting in the longitudinal direction of said open bundle end , welding energy is introduced into said individual strands ( , ) by friction welding with a rotating welding tool element or by torsional ultrasound welding , and said welding tool element ( , , , , , , ) is removed from said open bundle end.205230374143454853. The method claimed in claim 19 , wherein said open bundle end claim 19 , or at least a partial bundle thereof claim 19 , is introduced into a receptacle () claim 19 , formed by a depression claim 19 , in said welding tool element ( claim 19 , claim 19 , claim 19 , claim 19 , claim ...

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Номер записи: 62
04-01-2018 дата публикации

SEMICONDUCTOR DEVICE

Номер: US20180005981A1
Автор: Fujii Kenji, Haga Motoharu, Kasuya Yasumasa, KIMURA Akihiro, NAGAHARA Toichi, Yoshida Shingo
Принадлежит: ROHM CO., LTD.

A semiconductor device according to the present invention includes a semiconductor chip, an electrode pad made of a metal material containing aluminum and formed on a top surface of the semiconductor chip, an electrode lead disposed at a periphery of the semiconductor chip, a bonding wire having a linearly-extending main body portion and having a pad bond portion and a lead bond portion formed at respective ends of the main body portion and respectively bonded to the electrode pad and the electrode lead, and a resin package sealing the semiconductor chip, the electrode lead, and the bonding wire, the bonding wire is made of copper, and the entire electrode pad and the entire pad bond portion are integrally covered by a water-impermeable film. 1. A semiconductor device comprising:an interlayer insulating film formed on a semiconductor substrate;an uppermost layer wiring made of copper and formed on the interlayer insulating film;a passivation film formed on the uppermost layer wiring and selectively exposing a top surface of the uppermost layer wiring as an electrode pad; anda bonding wire made of copper and bonded directly to the electrode pad.2. The semiconductor device according to claim 1 , wherein the bonding wire is stitch bonded directly to the electrode pad.3. The semiconductor device according to claim 1 , wherein the bonding wire is bonded to the electrode pad by a stud bump.4. The semiconductor device according to claim 1 , wherein a thickness of the electrode pad is no less than 10 μm.5. The semiconductor device according to claim 1 , wherein a thickness of the electrode pad is 10 μm to 15 μm.6. The semiconductor device according to claim 1 , further comprising a lower layer wiring covered with the interlayer insulating film claim 1 , whereinthe uppermost layer wiring includes a protrusion extending inside the interlayer insulating film,the lower layer wiring is electrically connected to the electrode pad via a pathway including the protrusion.7. The ...

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Номер записи: 63
02-01-2020 дата публикации

Integrate Rinse Module in Hybrid Bonding Platform

Номер: US20200006052A1
Автор: Chao Lan-Lin, Chen Xiaomeng, HSIEH Yuan-Chih, Huang Xin-Hua, Kuang Hsun-Chung, LIN Hung-Hua, Liu Ping-Yin, Tsai Chia-Shiung
Принадлежит:

A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component. 1. A method comprising: performing a plasma treatment on the package component in the surface treatment station;', 'removing oxides on surface metal pads of the package component in the integrated cleaning station; and', 'cleaning the package component using de-ionized water in the integrated cleaning station., 'using an apparatus to form a package component, the apparatus comprising a surface treatment station and an integrated cleaning station, and the method comprising2. The method of further comprising:dispensing a first chemical on the package component;collecting the first chemical using a first container in a chamber in the integrated cleaning station;dispensing a second chemical on the package component; andcollecting the second chemical using a second container in the first container.3. The method of claim 2 , wherein the collecting the first chemical comprises spinning the first chemical into the first container claim 2 , and the first chemical passes top edges of the second container and drops into the first container.4. The method of claim 2 , wherein the second container is fully inside the first container claim 2 , and the second container has top edges lower than top edges of the first container.5. The method of further comprising:cleaning the package component using de-ionized water; andcollecting the de-ionized water using a third container in the chamber.6. The method of further comprising:draining the collected first chemical out of the first container through a first outlet connecting from outside of the chamber to the first container; anddraining the collected second chemical out of the second container through a second outlet connecting from outside of the chamber to the second ...

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Номер записи: 64
03-01-2019 дата публикации

PROTECTED CHIP-SCALE PACKAGE (CSP) PAD STRUCTURE

Номер: US20190006237A1
Автор: CHEN Chia-Chan, Lee Yueh-Chuan, Liu Ching-Heng
Принадлежит:

A method for forming an integrated circuit (IC) package is provided. In some embodiments, a semiconductor workpiece comprising a scribe line, a first IC die, a second IC die, and a passivation layer is formed. The scribe line separates the first and second IC dies, and the passivation layer covers the first and second IC dies. The first IC die comprises a circuit and a pad structure electrically coupled to the circuit. The pad structure comprises a first pad, a second pad, and a bridge. The bridge is within the scribe line and connects the first pad to the second pad. The passivation layer is patterned to expose the first pad, but not the second pad, and testing is performed on the circuit through the first pad. The semiconductor workpiece is cut along the scribe line to individualize the first and second IC dies, and to remove the bridge. 1. A method for forming an integrated circuit (IC) package , the method comprising:forming a semiconductor workpiece comprising a scribe line region, a first IC die, and a second IC die, wherein the scribe line region separates and adjoins the first and second IC dies, wherein the first IC die comprises a circuit and a pad structure electrically coupled to the circuit, wherein the pad structure comprises a first pad, a second pad, and a bridge, and wherein the bridge is within the scribe line region and extends from the first pad to the second pad to connect the first pad to the second pad; andcutting the semiconductor workpiece along the scribe line region to individualize the first and second IC dies, wherein the cutting removes the bridge to separate the first and second pads.2. The method according to claim 1 , wherein the semiconductor workpiece comprises a passivation layer covering the first pad and the second pad claim 1 , and wherein the method further comprises:performing an etch into the passivation layer to form an opening exposing the first pad, but not the second pad, and wherein the cutting is performed while the ...

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Номер записи: 65
08-01-2015 дата публикации

TRANSIENT LIQUID PHASE BONDING PROCESS FOR DOUBLE SIDED POWER MODULES

Номер: US20150008253A1
Автор: KATO Takehiro, SHIOZAKI Koji, Yoon Sang Won
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

A double-sided bonding process using transient liquid phase (TLP) bonding structure. A first side of an electronic device is processed to partially complete bonding. A second side of the electronic device is processed to complete bonding. The first side completes bonding during the processing of the second side. This reduces the time needed for the bonding process of both sides. This process allows for various TLP bonding parameters while being compatible with conventional fabrication systems. 1. A transient liquid phase (TLP) bonding method for double-sided bonding comprising:placing a first bonding material between an electronic device and a first bonding objective, the first bonding material having a first solidification temperature and including a first material having a first melting point and a second material having a second melting point less than the first melting point;aligning the first bonding objective with a first side of the electronic device;starting a first bonding process by raising a temperature to the second melting point to melt the second material;interrupting the first bonding process by reducing the temperature before the second material is completely diffused;placing a second bonding material between the electronic device and a second bonding objective, the second bonding material having a second solidification temperature and including a third material having a third melting point and a fourth material having a fourth melting point less than the third melting point;aligning the second bonding objective with a second side of the electronic device opposite the first side;starting a second bonding process by raising the temperature to the second solidification temperature;completing the first bonding process during the second bonding process by forming a first bondline from the first bonding material; andcompleting the second bonding process by forming a second bondline from the second bonding material.2. The method of claim 1 , wherein the ...

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Номер записи: 66
08-01-2015 дата публикации

BOND HEADS FOR THERMOCOMPRESSION BONDERS, THERMOCOMPRESSION BONDERS, AND METHODS OF OPERATING THE SAME

Номер: US20150008254A1
Автор: Schmidt-Lange Michael P., Wasserman Matthew B.
Принадлежит:

A bond head for a thermocompression bonder is provided. The bond head includes a tool configured to hold a workpiece to be bonded, a heater configured to heat the workpiece to be bonded, and a chamber proximate the heater. The chamber is configured to receive a cooling fluid for cooling the heater. 1. A bond head for a thermocompression bonder , the bond head comprising:a tool configured to hold a workpiece to be bonded;a heater configured to heat the workpiece to be bonded; anda chamber proximate the heater, the chamber configured to receive a cooling fluid for cooling the heater.2. The bond head of wherein the chamber is in contact with the heater with a variable contact force so as to adjust a heat exchange between the heater and the chamber.3. The bond head of claim 1 , wherein the chamber is moveable relative to the heater to be in and out of contact with the heater.4. The bond head of wherein the cooling fluid has a thermal capacity to absorb heat from the heater during contact between the chamber and the heater.5. The bond head of wherein the cooling fluid is selected from the group consisting of water claim 1 , ethylene glycol and fluorinated liquid.6. The bond head of wherein the cooling fluid is received in the chamber during a first operational phase claim 1 , and a second fluid is received in the chamber during a second operational phase.7. The bond head of wherein the first operational phase is a cooling phase and the second operational phase is a non-cooling phase.8. The bond head of wherein the second fluid is air.9. The bond head of wherein the cooling fluid includes a corrosive inhibitor.10. The bond head of further comprising at least two flexures disposed between a support structure of the bond head and the heater.11. The bond head of wherein the tool claim 1 , the heater and the chamber are integrated in a single structure.12. The bond head of wherein the chamber is disposed within a cavity of a support structure of the bond head above the heater ...

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Номер записи: 67
03-01-2019 дата публикации

COLD PRESSURE WELDING APPARATUS, COIL MANUFACTURING APPARATUS, COIL, AND METHOD OF MANUFACTURING THE SAME

Номер: US20190006921A1
Автор: HONGO Takenobu
Принадлежит:

The cold pressure welding apparatus includes a first holding part capable of sandwiching a first flat conductor, a second holding part disposed opposite to the first holding part and capable of sandwiching a second flat conductor, and a drive part for moving the first holding part and the second holding part. The drive part can move the first holding part and the second holding part between a first direction separated position and a close position along a first direction. The drive part can move the first holding part and the second holding part between a second direction separated position and a sandwiching position along a second direction. 1. A method of manufacturing a coil comprising a helical structure and having a predetermined length along a helical loop of the helical structure , the method comprising:providing a plurality of flat conductors, wherein each of the flat conductors has a first end and a second end that are flat, and when the plurality of flat conductors is arranged to form a coil-like structure having the helical structure by connecting flat conductors at the first and second ends thereof, the coil-like structure has a length along the helical loop of the helical structure that is longer than the predetermined length of the coil along the helical loop;pressing the first end of one of the plurality of flat conductors against the second end of another of the plurality of flat conductors in a direction of the helical loop so that the two flat conductor are cold-welded and a total length of the two welded flat conductors along the helical loop is shortened by the pressing; andrepeating the pressing for all of the plurality of flat conductors so that a total length of the plurality of welded flat conductors along the helical loop becomes equal to the predetermined length of the coil along the helical loop.2. The method of claim 1 , wherein a plurality of welded portions are formed along the helical loop of the coil.3. The method of claim 1 , wherein ...

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Номер записи: 68
27-01-2022 дата публикации

METHOD FOR MONITORING THE QUALITY OF ULTRASONIC WELDING

Номер: US20220023978A1
Автор: Herzing Thomas, Klimas Felix, LEHMANN Lutz, Zemann Daniel
Принадлежит: Lisa Draexlmaier GmbH

A method for monitoring the quality of an ultrasonic weld includes monitoring a vibration behavior during a joining process with respect to an actual value of a vibration frequency and/or a vibration amplitude of at least one joining partner of joining partners involved in the joining process. A tool of an ultrasonic welding device is used in the joining process, and at least one measuring device is configured to quantify mechanical vibrations. The detected vibration behavior is analyzed using a Fourier analysis and compared to a predefined set value as reference value. 1. A method for monitoring quality of an ultrasonic weld , the method comprising: at least one of a vibration frequency and a vibration amplitude of at least one joining partner of joining partners involved in the joining process; and', 'at least one of a vibration frequency and a vibration amplitude of a tool of an ultrasonic welding device used in the joining process,, 'monitoring a vibration behavior during a joining process with respect to an actual value of at least one ofby measuring with at least one measuring device configured to quantify mechanical vibrations,wherein a detected vibration behavior is analyzed using a Fourier analysis and compared to a predefined target value as a reference value.2. The method according to claim 1 , wherein an optical measurement device is used to quantify the mechanical vibrations during the joining process.3. The method according to claim 1 , wherein at least one of an eddy current sensor and a laser vibrometer is used to quantify the mechanical vibrations during the joining process.4. The method according to claim 1 , wherein a plurality of measurement points are monitored by the at least one measuring device with regard to vibration behavior of the measurement points differing from respective target values.5. The method according to claim 4 , wherein one measurement point on at least one of a sonotrode claim 4 , an anvil claim 4 , a first joining partner ...

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Номер записи: 69
15-01-2015 дата публикации

METHOD FOR BONDING A TANTALUM STRUCTURE TO A COBALT-ALLOY SUBSTRATE

Номер: US20150014397A1
Автор: Allen Steve M., Anderson Jeffrey P., Gorhe Devendra, Harmon Casey, Hippensteel Gregory M., Miller David M., Panchison Clarence M., Peek Lawrence F., Scrafton Joel G.
Принадлежит:

Methods for bonding a porous tantalum structure to a substrate are provided. The method includes placing a compressible or porous interlayer between a porous tantalum structure and a cobalt or cobalt-chromium substrate to form an assembly. The interlayer comprising a metal or metal alloy that has solid state solubility with both the substrate and the porous tantalum structure. Heat and pressure are applied to the assembly to achieve solid state diffusion between the substrate and the interlayer and the between the porous tantalum structure and the interlayer. 1. (canceled)2. A method of bonding , comprising:providing a substrate comprising cobalt or cobalt-chromium;providing a subassembly that includes a porous tantalum structure with a compressible interlayer formed on a surface portion of the porous tantalum structure, said compressible interlayer having a porosity of between 5% and 40% and consisting essentially of interconnected metal or metal alloy particles that exhibit solid solubility with tantalum and with cobalt or cobalt-chromium, said interconnected metal or metal alloy particles defining collapsible pores therebetween;bending the subassembly from a first configuration to a second configuration;forming an assembly which includes placing an exposed surface of the compressible interlayer in contact with the substrate after said bending; andapplying heat and pressure to the assembly for a time sufficient to achieve solid-state diffusion between the substrate and the compressible interlayer and between the compressible interlayer and the porous tantalum structure.3. The method of claim 2 , wherein the compressible interlayer has a substantially uniform thickness before said bending.4. The method of claim 2 , wherein said applying heat and pressure to the assembly includes compressing a portion of the compressible interlayer from a first thickness to a second claim 2 , reduced thickness.5. The method of claim 2 , wherein said applying heat and pressure to the ...

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Номер записи: 70
19-01-2017 дата публикации

METHOD FOR PRODUCING METAL LAMINATE MATERIAL

Номер: US20170014941A1
Автор: Koshiro Takashi, Kurokawa Teppei, Nanbu Kouji, Okayama Hironao
Принадлежит: TOYO KOHAN CO., LTD.

An object of the present invention is to provide a production method for efficiently producing a metal laminate having high bonding strength. A method for producing a metal laminate material comprising the steps of: sputter etching faces to be bonded of a stainless steel and an aluminum such that an oxide layer remains on each face; temporarily bonding the faces to be bonded of the stainless steel and the aluminum by roll pressure bonding; and thermally treating the temporarily bonded laminate material at a temperature lower than the recrystallization temperature of the stainless steel to thermally diffuse at least a metal element comprised in the stainless steel into the aluminum. 1. A method for producing a metal laminate material comprising the steps of:sputter etching faces to be bonded of a stainless steel and an aluminum such that an oxide layer remains on each face;temporarily bonding the faces to be bonded of the stainless steel and the aluminum by roll pressure bonding, andthermally treating the temporarily bonded laminate material at a temperature lower than the recrystallization temperature of the stainless steel to thermally diffuse at least a metal element comprised in the stainless steel into the aluminum.2. The method for producing a metal laminate material according to claim 1 , wherein claim 1 , in the thermally diffusing step claim 1 , 8 atm % or more of at least Fe element comprised in the stainless steel is diffused at a point 5 nm in the aluminum direction from the bonding interface.3. The method for producing a metal laminate material according to claim 1 , wherein the thermally diffusing step comprises thermally treating the temporarily bonded laminate material at a temperature lower than the recrystallization temperature of the stainless steel to thermally diffuse the metal element comprised in the stainless steel and the aluminum to each other.4. The method for producing a metal laminate material according to claim 1 , wherein the thermal ...

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Номер записи: 71
19-01-2017 дата публикации

METHOD FOR PRODUCING METAL LAMINATE MATERIAL

Номер: US20170014942A1
Автор: Koshiro Takashi, Kurokawa Teppei, Nanbu Kouji, Okayama Hironao
Принадлежит: TOYO KOHAN CO., LTD.

An object of the present invention is to provide a method for producing a metal laminate material that maintains sufficient bonding strength and has superior production efficiency. A method for producing a metal laminate material by bonding two sheets, one sheet composed of a material M1 and the other sheet composed of a material M2, wherein each of M1 and M2 is a metal or alloy comprising any one or more selected from the group consisting of Mg, Al, Ti, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Pd, Ag, In, Sn, Hf, Ta, W, Pb, and Bi, comprises the steps of subjecting the faces of the two sheets to be bonded to sputtering treatment with inert gas ions under vacuum such that oxide layers on surface layers remain; temporarily bonding the two sheets by roll pressure bonding; and conducting a thermal treatment to thereby bond the two sheets, and, when Tm1>Tm2 where Tm1 (K) is the melting point of M1 and Tm2(K) is the melting point of M2, the temperature of the thermal treatment is 0.45Tm2 or more and less than 0.45Tm1, provided that the temperature is not more than Tm2. 1. A method for producing a metal laminate material bonding two sheets , one sheet composed of a material M1 and the other sheet composed of a material M2 , each of M1 and M2 being a metal or alloy comprising any one or more selected from the group consisting of Mg , Al , Ti , Cr , Mn , Fe , Co , Ni , Cu , Zn , Nb , Mo , Pd , Ag , In , Sn , Hf , Ta , W , Pb , and Bi , wherein the method comprises the steps of:subjecting the faces to be bonded of the two sheets to sputtering treatment with inert gas ions under vacuum such that oxide layers on surface layers remain;temporarily bonding the two sheets by roll pressure bonding; andconducting a thermal treatment to thereby bond the two sheets; andwherein, when Tm1>Tm2 where Tm1 (K) is the melting point of M1 and Tm2(K) is the melting point of M2, the temperature of the thermal treatment is 0.45Tm2 or more and less than 0.45Tm1, provided that the temperature is not ...

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Номер записи: 72
19-01-2017 дата публикации

HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COMPRESSION BONDING PROCESS

Номер: US20170014957A1
Автор: Desai Pranav K., Devasenathipathy Shankar, Dhavaleswarapu Hemanth K., Kostiew George S., Li Zhihua, Petrini Joseph B., Roach Steven B., Saha Sanjoy K., Sauciuc Ioan
Принадлежит: Intel Corporation

Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block. 1. An assembly comprising:a cooling block comprising an array of vertical micro channels jets coupled to a heater surface, wherein an outlet micro channel jet of the array is coupled with an adjacent inlet micro channel jet of the array; andan inlet and outlet manifold coupled to the array of vertical micro channel jets, wherein the heater surface and the array of vertical micro channel jets are coupled in the same block material, wherein the heater surface comprises a plurality of micro fins, and wherein a tip of each micro fin is aligned in a center position between adjacent inlet and outlet micro channel jets.2. The assembly of claim 1 , wherein each outlet micro channel jet is coupled with two adjacent micro channel jets.3. The assembly of claim 1 , wherein inlet and outlet micro channel jets are disposed in a staggered configuration.4. The assembly of claim 1 , wherein a bottom portion of each inlet and outlet micro channel jet is chamfered.5. The assembly of claim 1 , wherein the vertical micro channel jets comprise vertical individual inlet and outlet nozzles attached to the heater surface.6. The assembly of claim 1 , further comprises a nozzle coupled to the heater claim 1 , and a die coupled to the nozzle claim 1 , wherein the die is on a substrate disposed on a pedestal.7. The assembly of claim 5 , wherein the assembly comprises a portion of a TCB bonding system.8. The assembly of claim 1 , wherein a TEC pad is disposed between the heater surface and the cooling block of the assembly.9. An assembly comprising:a ...

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Номер записи: 73
15-01-2015 дата публикации

PROCESSING OF METAL OR ALLOY OBJECTS

Номер: US20150017475A1
Автор: Ward-Close Charles Malcolm
Принадлежит:

Disclosed are methods of processing an object, the object being made of a metal or an alloy, the object having a plurality of open cavities, the method comprising: performing a sealing process on the object to seal the openings of the open cavities, thereby forming a plurality of closed cavities; and reducing the sizes of the closed cavities by performing a consolidation process on the object having the closed cavities. Sealing process may comprise shot peening or coating the object. A consolidation process may comprise a hot isostatic pressing process. The sizes of the closed cavities may be reduced until the closed cavities are no longer present in the object. 119-. (canceled)20. A method of processing an object , the object being made of a metal or an alloy , the method comprising:coating the surface of the object with a solid layer of material thereby providing a coated object, wherein the material is a metal or alloy that is different to the metal or alloy from which the object is made, the layer of material and the object forming a eutectic composition at or proximate to the interface between the layer of material and the object; andheating the coated object to a temperature above a melting point of the eutectic composition so as to cause the eutectic composition to melt, thereby forming a liquid layer between the solid layer of material and the solid object.21. A method according to claim 20 , wherein heating of the coated object is performed at least until diffusion or dissolving of the object and/or the layer of material into the liquid layer causes a melting point of the composition of the layer of material and the object to increase above the temperature to which the coated object is heated claim 20 , thereby causing solidification of the liquid layer.22. A method according to claim 20 , wherein heating of the coated object is performed at least until the entire solid layer of material has been dissolved into the liquid layer.23. A method according to ...

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Номер записи: 74
15-01-2015 дата публикации

BASE METAL FOR HIGH-TOUGHNESS CLAD PLATE HAVING EXCELLENT TOUGHNESS AT WELDED JOINT AND METHOD OF MANUFACTURING THE CLAD PLATE

Номер: US20150017476A1
Автор: Hoshino Toshiyuki, Kishi Keiichiro, Kuronuma Yota, Nishimura Kimihiro, Sueyoshi Hitoshi, Tachibana Shunichi, Yazawa Yoshihiro
Принадлежит:

A base metal for high-toughness clad plate having excellent toughness at a welded joint contains, in terms of mass %, C: 0.030 to 0.10%, Si: 0.10 to 0.30%, Mn: 1.00 to 1.60%, P: 0.015% or less, S: 0.003% or less, V: less than 0.010%, and at least one selected from Mo: 0.05 to 0.50%, Nb: 0.010 to 0.060%, Ti: 0.005 to 0.020%, Al: 0.040% or less, Ca: 0.0010 to 0.0040%, and N: 0.0030 to 0.0060%, the balance being Fe and unavoidable impurities, in which a percent ductile fracture is 85% or more in a −20° C. DWTT test and vE−20° C. is 100 J or more at a HAZ 3 mm position. 1. A base metal for a high-toughness clad plate having excellent toughness at a welded joint , the base metal comprising , in terms of mass % , C: 0.030 to 0.10% , Si: 0.10 to 0.30% , Mn: 1.00 to 1.60% , P: 0.015% or less , S: 0.003% or less , V: less than 0.010% , and at least one selected from Mo: 0.05 to 0.50% , Nb: 0.010 to 0.060% , Ti: 0.005 to 0.020% , Al: 0.040% or less , Ca: 0.0010 to 0.0040% , and N: 0.0030 to 0.0060% , the balance being Fe and unavoidable impurities , wherein a percent ductile fracture is 85% or more in a −20° C. DWTT test and vE−20° C. is 100 J or more at a HAZ 3 mm position.2. The base metal according to claim 1 , further comprising claim 1 , in terms of mass % claim 1 , at least one selected from Ni: 1.00% or less claim 1 , Cr: 1.00% or less claim 1 , and Cu: 1.00% or less.3. The base metal according to claim 1 , wherein a ratio of Ti content to N content claim 1 , Ti/N claim 1 , is 2.0 to 3.5 where the element symbols represent contents of respective elements in terms of mass %.4. The base metal according to claim 1 , wherein a ratio of Nb content to C content claim 1 , Nb/C claim 1 , is 0.2 to 2.0 where the element symbols represent contents of respective elements in terms of mass %.5. The base metal according to claim 3 , wherein a ratio of Nb content to C content claim 3 , Nb/C claim 3 , is 0.2 to 2.0 where the element symbols represent contents of respective elements in ...

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Номер записи: 75
21-01-2016 дата публикации

GRID NOZZLE ASSEMBLY, A FLUIDIZED BED REACTOR WITH A GRID NOZZLE ASSEMBLY AND METHODS OF USING A GRID NOZZLE ASSEMBLY

Номер: US20160016136A1
Автор: Campanella Ron, Gargone Patrick, KHAN Tanveer, Musgrove Robert
Принадлежит: AMEC FOSTER WHEELER NORTH AMERICA CORP.

A grid nozzle assembly for a fluidized bed reactor, a fluidized bed reactor with a grid nozzle assembly, a method of mounting a grid nozzle assembly as a replacement in a fluidized bed reactor, and a method of replacing a grid nozzle assembly in a fluidized bed reactor. The reactor includes a horizontally extending bottom plate, a gas plenum chamber below the bottom plate, and vertical gas pipes having a top end and extending from the gas plenum chamber upwards across the bottom plate. The nozzle assembly includes a nozzle head with a gas channel for injecting fluidizing gas from one of the vertical gas pipes to the reaction chamber and a tube sleeve adapted to be firmly fixed by welding around the top end of the vertical gas pipe. The nozzle head and the tube sleeve form a twist-lock enabling quick connecting and disconnecting.

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Номер записи: 76
18-01-2018 дата публикации

DIRECT WRITING NOZZLE SYSTEM FOR ADDITIVE MANUFACTURING

Номер: US20180015567A1
Автор: Kuntz Joshua D., Rosso Paul A.
Принадлежит:

A nozzle apparatus used for extruding a material includes an internal spindle that imparts motion into the extruding material, the internal spindle having a base; a multiple degree-of-freedom pivot at the base of the internal spindle, and a drive mechanism that controls the motion of the internal spindle. In one embodiment the material is a semi-solid metal or alloy. In another embodiment the material is a shear thinning mixture or material. In yet embodiment the material is a thixotropic mixture or material. The nozzle apparatus can be used for making a three-dimensional object with the steps of providing a material; providing a nozzle that extrudes the material, the nozzle having an internal spindle that imparts motion into the material; positioning the nozzle above a support structure; and moving the nozzle in a three-dimensional pattern while extruding the material through the nozzle onto the support structure or onto the material previously deposited. 1. A nozzle apparatus used for extruding a material , comprising:an internal spindle that imparts motion into the extruding material, said internal spindle having a base;a multiple degree-of-freedom pivot at said base of said internal spindle, anda drive mechanism that controls said motion of said internal spindle.2. The nozzle apparatus of wherein the material is a semi-solid metal or alloy.3. The nozzle apparatus of wherein the material is a shear thinning mixture or material.4. The nozzle apparatus of wherein the material is a thixotropic mixture or material.5. The nozzle apparatus of wherein said pivot is a flexural pivot.6. The nozzle apparatus of wherein said spindle has a diameter and a length and wherein said diameter varies along said length.7. The nozzle apparatus of wherein said multiple degree-of-freedom pivot constrains said spindle against axial rotation and allows oscillation of said spindle.8. An additive manufacturing apparatus for producing an object claim 1 , comprising:an additive manufacturing ...

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Номер записи: 77
14-01-2021 дата публикации

Method and Apparatus for Flexible Circuit Cable Attachment

Номер: US20210014977A1
Автор: Gary Fang, Hien Ly, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Wenlu Wang
Принадлежит: Jabil Inc

A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

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Номер записи: 78
21-01-2016 дата публикации

METHOD OF MAKING A DUAL HARDNESS STEEL ARTICLE

Номер: US20160017455A1
Автор: Bailey Ronald E., Stefansson Njall, Swiatek Glenn J.
Принадлежит:

A dual hardness steel article comprises a first air hardenable steel alloy having a first hardness metallurgically bonded to a second air hardenable steel alloy having a second hardness. A method of manufacturing a dual hard steel article comprises providing a first air hardenable steel alloy part comprising a first mating surface and having a first part hardness, and providing a second air hardenable steel alloy part comprising a second mating surface and having a second part hardness. The first air hardenable steel alloy part is metallurgically secured to the second air hardenable steel alloy part to form a metallurgically secured assembly, and the metallurgically secured assembly is hot rolled to provide a metallurgical bond between the first mating surface and the second mating surface. 1. A method of manufacturing a dual hardness steel article , comprising:providing a first air hardenable steel alloy part comprising a first mating surface and having first part hardness;providing a second air hardenable steel alloy part comprising a second mating surface and having a second part hardness, wherein the first part hardness is greater than the second part hardness;disposing the first air hardenable steel alloy part and the second air hardenable steel alloy part so that at least a portion of the first mating surface contacts at least a portion of the second mating surface;metallurgically securing the first air hardenable steel alloy part to the second air hardenable steel alloy to form a metallurgically secured assembly;hot rolling the metallurgically secured assembly to form a metallurgical bond between the first mating surface and the second mating surface;cooling the hot rolled assembly.2. The method of claim 1 , further comprising grinding at least a portion of at least one of the first mating surface and the second mating surface prior to the disposing.3. The method of claim 1 , wherein metallurgically securing the first air hardenable steel alloy part to the ...

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Номер записи: 79
21-01-2016 дата публикации

Turbine Engine Hybrid Rotor

Номер: US20160017713A1
Автор: Hansen James O.
Принадлежит: UNITED TECHNOLOGIES CORPORATION

A turbine engine rotor component has a Ti-based first member () circumscribing an axis () and has either a circumferential array of integrally formed airfoils () or a circumferential array of blade retention features. A TiB particulate reinforced second member () also circumscribes the axis.

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Номер записи: 80
19-01-2017 дата публикации

Method of manufacturing secondary battery

Номер: US20170018752A1
Автор: Hyewon Kim, Inseop Byun, Jeawoan Lee, Joonsup Kim, Taegon Kim, Wanuk CHOI, Youngchang Lim
Принадлежит: Samsung SDI Co Ltd

A method of manufacturing a secondary battery includes: ultrasonic-welding a first electrode plate of an electrode assembly and a first electrode tab to each other by using a first horn including a first protruding tip; ultrasonic-welding a second electrode plate of the electrode assembly and a second electrode tab to each other by using a second horn including a second protruding tip, the second protruding tip having a positioning direction different from a positioning direction of the first protruding tip; and preparing the electrode assembly by arranging a separator between the first and second electrode plates.

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Номер записи: 81
03-02-2022 дата публикации

PROCESS FOR ELECTRICALLY CONNECTING CONTACT SURFACES OF ELECTRONIC COMPONENTS

Номер: US20220037284A1
Автор: Bayaras Abito D., Chong Kim H., Kang Il T., Kim Tae Y., Pun Yean M., SARANGAPANI Murali, Sutiono Sylvia, Tok Chee W., Zhang Xi
Принадлежит:

A process for electrically connecting contact surfaces of electronic components by capillary wedge bonding a round wire of 8 to 80 μm to the contact surface of a first electronic component, forming a wire loop, and stitch bonding the wire to the contact surface of a second electronic component, wherein the wire comprises a wire core having a silver or silver-based wire core with a double-layered coating comprised of a 1 to 50 nm thick inner layer of nickel or palladium and an adjacent 5 to 200 nm thick outer layer of gold. 1. A process for electrically connecting a contact surface of a first electronic component with a contact surface of a second electronic component comprising the subsequent steps:(1) capillary wedge bonding a wire having a circular cross-section with an average diameter in the range of 8 to 80 μm to the contact surface of the first electronic component,(2) raising the capillary wedge bonded wire to form a wire loop between the capillary wedge bond formed in step (1) and the contact surface of the second electronic component, and(3) stitch bonding the wire to the contact surface of the second electronic component,wherein the capillary wedge bonding of step (1) is carried out with a ceramic capillary having a lower face angle within the range of from zero to 4 degrees,wherein the wire comprises a wire core with a surface, the wire core having a double-layered coating superimposed on its surface,wherein the wire core consists of a material selected from the group consisting of pure silver, doped silver with a silver content of >99.5 wt.-% and silver alloys with a silver content of at least 89 wt.-%, andwherein the double-layered coating comprises a 1 to 50 nm thick inner layer of nickel or palladium and an adjacent 5 to 200 nm thick outer layer of gold.2. The process of claim 1 , (a′) an ultrasonic energy in a range of 50 to 100 mA,', '(b′) a force in a range of 10 to 30 g,', '(c′) a constant velocity in a range of 0.3 to 0.7 μm/s,', '(d′) a contact ...

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Номер записи: 82
18-01-2018 дата публикации

METAL-METAL DIRECT BONDING METHOD

Номер: US20180019124A1
Автор: GONDCHARTON Paul, Imbert Bruno, Moriceau Hubert
Принадлежит:

A method for assembling a first substrate and a second substrate by metal-metal direct bonding, includes providing a first layer of a metal at the surface of the first substrate and a second layer of the metal at the surface of the second substrate, the first and second metal layers having a tensile stress (σ) between 30% and 100% of the tensile yield strength (σ) of the metal; assembling the first and second substrates at a bonding interface by directly contacting the first and second tensile stressed metal layers; and subjecting the assembly of the first and second substrates to a stabilization annealing at a temperature lower than or equal to a temperature threshold beyond which the first and second tensile stressed metal layers are plastically compressively deformed. 1. A method for assembling a first substrate and a second substrate by a metal-metal direct bonding , comprising:providing a first layer of a metal at a surface of the first substrate and a second layer of said metal at a surface of the second substrate, the first and second metal layers having a tensile stress comprised between 30% and 100% of the tensile yield strength of said metal;assembling the first and second substrates at a bonding interface by directly contacting the first and second metal layers;subjecting the assembly of the first and second substrates to a stabilization annealing at a temperature lower than or equal to a temperature threshold beyond which the first and second tensile stressed metal layers are plastically compressively deformed.2. The method according to claim 1 , comprising calculating said temperature threshold from the tensile stress of the first and second metal layers and the thermo-elastic coefficient of said metal.3. The method according to claim 1 , wherein the providing comprises depositing the first metal layer onto a face of the first substrate and the second metal layer onto a face of the second substrate.4. The method according to claim 3 , wherein the ...

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Номер записи: 83
18-01-2018 дата публикации

Wedge bonding component

Номер: US20180019224A1
Автор: Hidekazu Shigeyoshi
Принадлежит: Kyocera Corp

There is provided with a surface for contacting a wire. At least a part of the surface comprises a surface of a ceramic sintered body containing aluminum oxide as a main ingredient and titanium carbide as an accessory ingredient.

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Номер записи: 84
22-01-2015 дата публикации

Method and machine for forge welding of tubular articles and exothermic flux mixture and method of manufacturing an exothermic flux mixture

Номер: US20150021377A1
Автор: Hu Chun Yi, Jeremy Joseph Iten, Wayne Rudd
Принадлежит: Tubefuse Applications BV

A method of forge welding includes placing at least two components for welding together, adjacent each other and with an exothermic flux mixture placed between the components. The exothermic flux mixture is heated to initiate an exothermic reaction and the faying surfaces of the two components are pressed together. The components being welded may be tubular, in particular pipes. Apparatus for the method of forge welding and exothermic flux mixtures for the method of forge welding are also provided.

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Номер записи: 85
22-01-2015 дата публикации

ADDITIVE MANUFACTURING SYSTEM FOR JOINING AND SURFACE OVERLAY

Номер: US20150021379A1
Автор: Albrecht Bruce Patrick, Hsu Christopher
Принадлежит:

An additive manufacturing system includes an additive manufacturing tool configured to receive a plurality of metallic anchoring materials and to supply a plurality of droplets to a part, and a controller configured to independently control the composition, formation, and application of each droplet to the plurality of droplets to the part. The plurality of droplets is configured to build up the part. Each droplet of the plurality of droplets includes at least one metallic anchoring material of the plurality of metallic anchoring materials. 1. An additive manufacturing system , comprising:an additive manufacturing tool configured to receive a plurality of metallic anchoring materials and to supply a plurality of droplets to a part, wherein each droplet of the plurality of droplets comprises at least one metallic anchoring material of the plurality of metallic anchoring materials; anda controller configured to independently control the composition, formation, and application of each droplet of the plurality of droplets to the part, wherein the plurality of droplets is configured to build up the part.2. The system of claim 1 , comprising a heating device configured to preheat a work piece coupled to the part claim 1 , wherein the controller is configured to independently control the preheating of the work piece from heating of the at least one metallic anchoring material.3. The system of claim 1 , comprising sensors disposed on the additive manufacturing tool claim 1 , wherein the sensors are configured to measure temperature claim 1 , deflection claim 1 , composition of applied droplets of the plurality of droplets claim 1 , a relative position of the additive manufacturing tool to the part claim 1 , or any combination thereof.4. The system of claim 3 , wherein the controller is configured to control the composition claim 3 , formation claim 3 , and application of each droplet based at least in part on input from the sensors.5. The system of claim 1 , wherein the ...

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Номер записи: 86
28-01-2016 дата публикации

METHOD FOR JOINING HIGH TEMPERATURE MATERIALS AND ARTICLES MADE THEREWITH

Номер: US20160023439A1
Автор: Buresh Steve John, Dheeradhada Voram Supatarawanich, Marte Judson Sloan, Zhang Wanming, Zhao Qi
Принадлежит:

Methods for joining dissimilar high-temperature alloys are provided, along with articles, such as turbine airfoils, formed by the method. The method comprises interposing a barrier material between a first segment and a second segment to form a segment assembly. The first segment comprises a titanium aluminide material, and the second segment comprises a nickel alloy. The barrier material comprises a primary constituent element present in the barrier material at a concentration of at least about 30 weight percent of the barrier material, and the primary constituent element is a transition metal element of Group 1B, Group 4B (excluding titanium and zirconium), Group 5B, Group 6B, Group 7B, or Group 8B (excluding nickel). The segment assembly is bonded in the solid state at a combination of temperature, pressure, and time effective to produce a metallurgical joint between the first and second segments, thereby forming an intermediate article; and the intermediate article is heat treated to form a bonded article. 1. A method comprising:interposing a barrier material between a first segment and a second segment to form a segment assembly, wherein the first segment comprises a titanium aluminide material, the second segment comprises a nickel alloy, and the barrier material comprises a primary constituent element present in the barrier material at a concentration of at least about 30 weight percent of the barrier material; wherein the primary constituent element is a transition metal element of Group 1B, Group 4B (excluding titanium and zirconium), Group 5B, Group 6B, Group 7B, or Group 8B (excluding nickel);bonding the segment assembly in the solid state at a combination of temperature, pressure, and time effective to produce a metallurgical joint between the first and second segments, thereby forming an intermediate article; andheat treating the intermediate article to form a bonded article.2. The method of claim 1 , wherein the primary constituent element comprises ...

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Номер записи: 87
16-01-2020 дата публикации

BONDING APPARATUS WITH REPLACEABLE BONDING TOOL

Номер: US20200020661A1
Автор: CHEN Xiao Liang, SONG Keng Yew, ZHANG Yue
Принадлежит:

A bonding apparatus has a bonding tool for bonding a wire to a bonding surface, a bonding tool retainer configured to releasably retain the bonding tool, a bonding tool holder configured to hold at least one bonding tool, a bonding tool manipulator configured to transfer said bonding tool between said bonding tool holder and said bonding tool retainer, and a bonding tool guide configured to guide said bonding tool to be received by said bonding tool retainer during transfer by said bonding tool manipulator.

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Номер записи: 88
25-01-2018 дата публикации

ALUMINUM-ALLOY-CLAD PLATE AND ALUMINUM-ALLOY-CLAD STRUCTURAL MEMBER

Номер: US20180022067A1
Автор: Matsumoto Katsushi, SATO Kazufumi
Принадлежит: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)

An aluminum-alloy-clad plate which includes a plurality of superposed aluminum alloy layers and which has undergone a diffusion heat treatment. Aluminum alloy layers having specific compositions are superposed so that any adjoining two of these differ in the content of Mg or Zn, and are subjected to a diffusion heat treatment to give a structure which has fine crystal grain diameters and Mg/Zn mutual diffusion regions and which has specific DSC properties. Thus, both higher strength and high formability are imparted. 1. An aluminum alloy clad plate as a laminate of a plurality of aluminum alloy layers , whereineach of the aluminum alloy layers laminated inside of an aluminum alloy layer on an outermost layer side of the aluminum alloy clad plate contains one or both of Mg: 3 to 10 mass % and Zn: 5 to 30 mass %,wherein the aluminum alloy layer on the outermost layer side has a composition containing Mg in a range from 3 to 10 mass % and Zn that is limited to 2 mass % or less (including 0 mass %),the aluminum alloy layers are laminated such that aluminum alloy layers having different contents of one of Mg and Zn are adjacently bonded to each other, the total number of laminated layers is 5 to 15, and total thickness is 1 to 5 mm,the aluminum alloy clad plate has an average content of Mg in a range from 2 to 8 mass % and an average content of Zn in a range from 3 to 20 mass %, the average content being an average of the contents of each of Mg and Zn of the laminated aluminum alloy layers, andwhen the aluminum alloy clad plate is subjected to diffusion heat treatment of holding for 4 hr at 500° C. followed by cooling to room temperature at a cooling rate of 80 ° C./sec, and subsequently subjected to artificial age hardening of 120° C.×24 hr, the aluminum alloy clad plate has a microstructure having an average grain size of 200 μm or less, the average grain size being an average of grain sizes of the laminated aluminum alloy layers, and having an Mg—Zn interdiffusion ...

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Номер записи: 89
10-02-2022 дата публикации

METHODS AND SYSTEMS FOR CLADDING

Номер: US20220040782A1
Автор: Cheng Paul Po
Принадлежит:

A method of attaching a cladding element to a base element. A first inner side of the cladding element is positioned spaced apart from a second inner side of the base element to define a slot therebetween, and one or more heating elements are located in the slot. A non-oxidizing atmosphere is provided in the slot, and the heating element is energized, to heat at least portions of the cladding element and the base element to a hot working temperature. While at the hot working temperature, the first and second inner sides are engaged with each other, and one or both are moved relative to the other, for plastic deformation of the first and second inner sides, to subject the portions of the cladding element and the base element to shear stresses. The portions are allowed to cool, for recrystallization thereof. 1. A method of attaching at least one cladding element at least partially made of a first metal to a base element at least partially made of a second metal , the method comprising the steps of:(a) positioning said at least one cladding element spaced apart from the base element to locate a first inner side of said at least one cladding element facing a second inner side of the base element, for defining a slot therebetween having a predetermined width;(b) locating at least one heating element in the slot;(c) providing a non-oxidizing atmosphere in the slot, the non-oxidizing atmosphere covering the first and second inner sides;(d) energizing said at least one heating element, to heat the first inner side and the second inner side to a hot working temperature of the first metal and the second metal, wherein said at least one heating element is configured to distribute heat energy therefrom evenly over each of the first and second inner sides, heating the cladding element and the base element to predetermined first and second depths relative to the first and second inner sides respectively, to provide heated first and second layers of the cladding element and the ...

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Номер записи: 90
10-02-2022 дата публикации

CANISTER AND METHOD OF PRODUCTION

Номер: US20220040783A1
Автор: Cipolla Steven A.
Принадлежит:

A method of forming a canister by means of a mechanical bonding of respective layers of a first metal material (tantalum) and a second metal material (niobium) to form a sheet stock, thereby forming the sheet stock into a canister form, wherein the first metal material comprises tantalum and the second metal material comprises at least one of niobium, molybdenum, or steel. The completed canister comprises a first metal material comprising tantalum, and a second metal material mechanically bonded to the first metal material by subjecting the first and second metal materials to at least 1,000,000 psi, to thereby form a canister having an inner diameter of 13-19 millimeters (mm), the second metal material comprising at least one of niobium, molybdenum, or steel. 1. A method of forming a canister by means of a mechanical bonding of respective layers of a first metal material and a second metal material to form a sheet stock , thereby forming the sheet stock into the canister , wherein the formation of the canister consisting of the first metal material being tantalum and the second metal material being niobium.2. The method of wherein claim 1 , with respect to the canister claim 1 , an inner layer is comprised of the first material and an outer layer is comprised of the second material.3. (canceled)4. (canceled)5. The method of wherein the sheet stock is comprised of at least 30% tantalum.6. The method of claim 1 , further comprising brushing exterior surfaces of the first metal material and the second metal material to deoxidize the first metal material and the second metal material prior to performing the mechanical bonding.7. The method of wherein the first metal material and the second metal material each have a purity of at least 99.9%.8. The method of wherein the means of mechanical bonding comprises cladding with at least one roller of at least 1 claim 1 ,000000 psi to mechanically bond the first metal material together with the second metal material.9. The ...

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Номер записи: 91
28-01-2016 дата публикации

Maxmet Composites for Turbine Engine Component Tips

Номер: US20160024955A1
Автор: Amini Shahram, Burlatsky Sergei F, Fuller David Ulrich, Novikov Dmitri, Strock Christopher W
Принадлежит:

A turbine engine system includes a turbine engine component having an airfoil portion and a tip, which turbine engine component having a MAXMET composite bonded to the tip. The MAXMET composite has MAX phases in a metal matrix. 1. A turbine engine system comprising:a turbine engine component having an airfoil portion and a tip;said turbine engine component having a MAXMET composite bonded to said tip.2. The turbine engine system according to claim 1 , wherein said MAXMET composite is a composite having MAX phases and a metal matrix.3. The turbine engine system according to claim 2 , wherein said metal matrix is at least one of a low claim 2 , medium claim 2 , and high melting point metal or metal alloy.4. The turbine engine system according to claim 2 , wherein said MAX phases are defined by the formula MAXwhere M is an early transition metal element claim 2 , A is an A-group element claim 2 , X is C or N claim 2 , and n=1 to 3.5. The turbine engine system according to claim 1 , further comprising an abradable coating which is engaged by the tip of said turbine engine component with said MAXMET composite.6. The turbine engine system according to claim 1 , wherein said turbine engine component is a vane.7. The turbine engine system according to claim 1 , wherein said turbine engine component is a blade.8. A turbine engine component comprising:an airfoil portion having a tip; anda MAXMET composite bonded to said tip.9. The turbine engine component according to claim 8 , wherein said MAXMET composite is a composite having MAX phases and a metal matrix.10. The turbine engine component according to claim 9 , wherein said metal matrix is at least one of a low claim 9 , medium claim 9 , and high melting point metal or metal alloy.11. The turbine engine component according to claim 9 , wherein said MAX phases are defined by the formula MAXwhere M is an early transition metal element claim 9 , A is an A group element claim 9 , X is carbon or nitrogen claim 9 , and n=1 to 3. ...

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Номер записи: 92
26-01-2017 дата публикации

HYBRID BONDED TURBINE ROTORS AND METHODS FOR MANUFACTURING THE SAME

Номер: US20170022827A1
Автор: Mittendorf Don, Morris Mark C., Vinup Michael, Waldman David R.
Принадлежит: HONEYWELL INTERNATIONAL INC.

Hybrid bonded turbine rotors and methods for manufacturing the same are provided. A method for manufacturing a hybrid bonded turbine rotor comprises the steps of providing turbine disk having a rim portion comprising a live rim of circumferentially continuous material and a plurality of live rim notches in an outer periphery of the turbine disk alternating with a plurality of raised blade attachment surfaces defining the outer periphery; providing a plurality of turbine blades, each of which comprising an airfoil portion and a shank portion, the shank portion having a base surface; metallurgically bonding a compliant alloy material layer to either or both of the raised blade attachments surfaces of the turbine disk and the base surfaces of the blade shanks; and linear friction welding the plurality of blades to the turbine disk so as to form a bond plane between the raised blade attachments surfaces of the turbine disk and the base surfaces of the blade shanks, the compliant alloy material layer being disposed at the bond plane. 1. A method for manufacturing a hybrid bonded turbine rotor comprising the steps of:providing turbine disk having a rim portion comprising a live rim of circumferentially continuous material and a plurality of live rim notches in an outer periphery of the turbine disk alternating with a plurality of raised blade attachment surfaces defining the outer periphery;providing at least one turbine blade, the at least one turbine blade comprising an airfoil portion and a shank portion, the shank portion having a base surface;metallurgically bonding a compliant alloy material layer to either or both of one or more of the raised blade attachment surfaces of the turbine disk and the base surface of the blade shank, wherein the compliant alloy is bonded only to the one or more of the raised blade attachment surfaces and not any other portion of the turbine disk, only to the base surface of the blade shank and not any other portion of the at least one ...

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Номер записи: 93
23-01-2020 дата публикации

METHOD OF DIFFUSION BONDING

Номер: US20200023460A1
Автор: BOSWELL John H, WALLIS Michael J
Принадлежит: ROLLS-ROYCE PLC

A method of diffusion bonding two components together comprises providing a first component having a first bonding surface, and a second component having a second bonding surface. Each of the first bonding surface and the second bonding surface is etched. A cold working process is applied to each of the first bonding surface and the second bonding surface. Each of the first bonding surface and the second bonding surface is then etched. The first component is positioned adjacent to the second component with the first bonding surface abutting against the second bonding surface, to define a joint surface between the first component and the second component. A peripheral edge of the joint surface is sealed. The first bonding surface is diffusion bonded to the second bonding surface. 1. A method of diffusion bonding two components together , the method comprising the steps of:(a) providing a first component having a first bonding surface, and a second component having a second bonding surface;(b) applying a cold working process to at least one of the first bonding surface and the second bonding surface;(c) etching each of the first bonding surface and the second bonding surface;(d) position the first component adjacent to the second component with the first bonding surface abutting against the second bonding surface, to define a joint surface between the first component and the second component;(e) sealing a peripheral edge of the joint surface; and(f) diffusion bonding the first bonding surface to the second bonding surface.2. The method as claimed in claim 1 , wherein step (b) comprises the prior step of:(b)′ etching each of the first bonding surface and the second bonding surface.3. The method as claimed in claim 1 , wherein step (b) comprises the step of:(b1) applying a cold working process to each of the first bonding surface and the second bonding surface, to produce a cold worked layer having a depth from the surface of less than 1 mm.4. The method as claimed in ...

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Номер записи: 94
24-01-2019 дата публикации

Dual hardness steel article

Номер: US20190024204A1
Автор: Glenn J. Swiatek, Njall Stefansson, Ronald E. Bailey
Принадлежит: ATI Properties LLC

A dual hardness steel article comprises a first air hardenable steel alloy having a first hardness metallurgically bonded to a second air hardenable steel alloy having a second hardness. A method of manufacturing a dual hard steel article comprises providing a first air hardenable steel alloy part comprising a first mating surface and having a first part hardness, and providing a second air hardenable steel alloy part comprising a second mating surface and having a second part hardness. The first air hardenable steel alloy part is metallurgically secured to the second air hardenable steel alloy part to form a metallurgically secured assembly, and the metallurgically secured assembly is hot rolled to provide a metallurgical bond between the first mating surface and the second mating surface.

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Номер записи: 95
28-01-2021 дата публикации

ROLL-BONDED BODY AND METHOD FOR PRODUCING ROLL-BONDED BODY

Номер: US20210023648A1
Автор: Hashimoto Yusuke, Hatakeda Takafumi, Kurokawa Teppei
Принадлежит: TOYO KOHAN CO., LTD

It is an object of the present invention to provide a roll-bonded laminate controlled in warping and a method for producing the same. The method produces the roll-bonded laminate having a two-layer structure of a first metal layer and a second metal layer, by roll-bonding a first metal plate and a second metal plate, wherein the surface hardness Hv of the first metal plate is lower than the surface hardness Hv of the second metal plate; and the method comprises roll-bonding so as to satisfy the following expression (1): 2. The method for producing a roll-bonded laminate according to claim 1 , wherein the total thickness of the roll-bonded laminate is 0.1 mm to 0.5 mm.3. The method for producing a roll-bonded laminate according to claim 1 , wherein the first metal layer comprises copper claim 1 , aluminum or an alloy thereof; and the second metal layer comprises a stainless steel claim 1 , titanium claim 1 , a titanium alloy or a nickel alloy.4. The method for producing a roll-bonded laminate according to claim 1 , wherein the first metal layer comprises copper; and the second metal layer comprises a stainless steel.5. The method for producing a roll-bonded laminate according to claim 1 , wherein a difference in hardness between the surface hardness Hv of the second metal plate and the surface hardness Hv of the first metal plate is 35 to 305.6. A roll-bonded laminate having a two-layer structure of a first metal layer and a second metal layer claim 1 ,wherein a surface hardness Hv of the first metal layer is lower than a surface hardness Hv of the second metal layer; anda warping radius as measured by the following warping test is 43.8 mm or more:the warping test: a sample cut out from the roll-bonded laminate is placed on a horizontal plane so that the first metal layer is positioned on the upper side; a height of a point of the sample whose height from the horizontal plane is maximum is taken as a warping amount; and from the warping amount and a length of the ...

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Номер записи: 96
24-04-2014 дата публикации

System and method for cleaning bond wire

Номер: US20140110461A1
Автор: Mohd Rusli Ibrahim, Poh Leng EU, Yin Kheng Au
Принадлежит: Individual

A system for cleaning bond wire for use by a wire bonding machine includes a bond wire supply station, a bond wire cleaning bath station, a bond wire neutralizing station, a bond wire drying station, and a wire bonding machine. In operation, the bonding machine is supplied with bond wire stored at the supply station, which is firstly de-oxidized with a cleaning solution in the cleaning bath station. Next, the cleaning solution on the bond wire is neutralized with a neutralizing liquid in the neutralizing station. The bond wire is then dried in the drying station. The speed of the bond wire passing through the cleaning bath station, neutralizing station and drying station is controlled by the wire bonding machine.

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Номер записи: 97
28-01-2021 дата публикации

DUPLEX STAINLESS CLAD STEEL PLATE AND METHOD OF PRODUCING SAME

Номер: US20210025023A1
Автор: Kuronuma Yota, OHTSUBO Hirofumi, YOKOTA Tomoyuki
Принадлежит: JFE STEEL CORPORATION

Disclosed is a duplex stainless clad steel plate in which a duplex stainless steel plate as a cladding metal is bonded or joined to one or both surfaces of a base steel plate, in which the base steel plate comprises a predetermined chemical composition such that Nb/N is 3.0 or more and Ceq is 0.35 to 0.45, and the duplex stainless steel plate comprises: a predetermined chemical composition such that PI is 34.0 to 43.0; and a microstructure containing a ferrite phase in an area fraction of 35% to 65%, and in the microstructure, an amount of precipitated Cr is 2.00% or less and an amount of precipitated Mo is 0.50% or less. 23-. (canceled)4. A method of producing a duplex stainless clad steel plate in which a duplex stainless steel plate as a cladding metal is bonded or joined to one or both surfaces of a base steel plate , the method comprising:{'claim-ref': [{'@idref': 'CLM-00001', 'claim 1'}, {'@idref': 'CLM-00001', 'claim 1'}], 'preparing a clad slab by stacking a first blank plate to be the base steel plate and a second blank plate to be the duplex stainless steel plate as the cladding metal in a layered manner, the first blank plate comprising the first chemical composition as recited in , and the second blank plate comprising the second chemical composition as recited in and a microstructure containing a ferrite phase in an area fraction of 35% to 65%;'}heating the clad slab to 1050° C. to 1250° C.;then hot rolling the clad slab with a rolling reduction ratio of 2.0 or more to obtain a rolled clad body in which the base steel plate and the duplex stainless steel plate are bonded or joined together;allowing the rolled clad body to naturally cool;then reheating the rolled clad body to 1000° C. to 1100° C.;then cooling the rolled clad body such that the duplex stainless steel plate is cooled at a cooling rate of 0.8° C./s or higher and the base steel plate is cooled at a cooling rate of 1.0° C./s or higher; andthen tempering the rolled clad body at 700° C. or ...

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Номер записи: 98
02-02-2017 дата публикации

TUBE PROFILE MACHINING PROCESS

Номер: US20170028503A1
Автор: "ONeil Thomas M.", Smith Johnny N.
Принадлежит:

In a first embodiment, at a time of magnetic pulse welding, a stepped tube profile machining process axially bores a walled tube from an end inward to a transition depth to form a section with a reduced wall thickness and then axially bores the walled tube from the transition depth to a fall off depth, thereby forming a section with a maximized welding wall section. In a second embodiment, also at a time of magnetic pulse welding, a surface angle tube profile machining process axially bores at a surface angle a walled tube from an end to a bore length to form an angular welding wall thickness inward to a maximized wall section. For both embodiments, the bored surfaces are virgin with no pits, oil, residue, or oxidation thereon, thus making the machined walled tubes available for immediate magnetic pulse welding. 1. A tapered tube profile machining process , comprising:axially boring a walled tube inward at a tapered surface angle from an end thereof to a bore length, wherein the axially boring removes pits, oil, debris, and oxidation from the end of the walled tube to the bore length, so as to form a bored surface within the walled tube having an angular welding wall thickness inward to a maximized welding wall section;wherein the axially boring step requires no additional processing time of using acid for cleaning the bored walled tube surface of oil, of ridding the acid from the bored walled tube surface, of drying the bored walled tube surface, or further of removing pits, oil, debris, or oxidation from the bored walled tube, since the axially boring step occurs immediately just before a time of attachment of the walled tube to a workpiece, by magnetic pulse welding the tapered bored surface of the walled tube to the workpiece.2. The tapered tube profile machining process of claim 1 , wherein the workpiece is an end fitting inserted into the bored end of the axially tapered bored walled tube until the end fitting is in contact with the maximized welding wall ...

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Номер записи: 99
04-02-2016 дата публикации

Method for bonding stainless steel members and stainless steel

Номер: US20160031035A1
Автор: Masahito Katoh, Tomomi Shiratori
Принадлежит: Komatsu Seiki Kosakusho Co Ltd, National Institute of Advanced Industrial Science and Technology AIST

A method for bonding stainless steel members includes: contacting a first stainless steel member with a second stainless steel member that has a strain exceeding 50% reduction; and heating the first and second stainless steel members to a re-crystallization initiation temperature or higher, after the contacting.

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Номер записи: 100