ZUSAMMENSTELLUNGEN UND METHODEN ZUR ANORDNUNG ANISOTROPISCH LEITENDER BAHNEN UND VERBINDUNGEN ZWISCHEN ZWEI SÄTZEN VON LEITERN

Making electrically conducting adhesive connection between module and electronic component e.g. for chip card, involves first introducing conducting body arranged in compressible fixing structure between them

The method involves first introducing conducting bodies between the connection contacts and then pressing the module, conducting body and component together. The conducting body (16,17) is arranged in a compressible fixing structure (10) for introduction between the module (25) and the electronic component (26). An Independent claim is also included for a chip card produced with the method.

POLYMER PARTICLES AND CONDUCTIVE PARTICLES COMPRISING THE SAME TO IMPROVE CONDUCTING PROPERTIES, ELECTRIC CONNECTION RELIABILITY AND TO MAKE POSSIBLE TO INCREASE CONTACT AREA WHEN USED IN CIRCUIT BOARD BY HAVING EXCELLENT COMPRESSIVE DEFORMATION PROPERTY AND RECOVERY PROPERTY FROM THE COMPRESSIVE DEFORMATION

PURPOSE: A polymer particles and conductive particles comprising the same which are used in connecting electrodes in circuit boards by being intervened therebetween are provided to improve conducting properties, compressive deformation characteristics, recovery properties from such compressive deformation, thereby increasing the contact area when being intervened to make electric connection between electrodes, and to achieve uniform particle shape and narrow particle size distribution. CONSTITUTION: The polymer fine particles has 10% K value, which means the K value when the particle diameter is compressively deformed by 10%, ranged between 250 kgf/mm^2 and 700 kgf/mm^2; 30% K value which is the K value when 30% compressive deformation in the particle diameter and 40% K value which is the K value when 40% compressive deformation in the particle diameter is maintained in the range between 20% and 70% relative to the 10% K value; and the recovery rate from the compressive deformation is 30% ...

Anisotropic conductive film and production method therefor

An anisotropic conductive film in which conductive particles are positioned uniformly in a single layer, and which is compatible with fine pitch connection. Said anisotropic conductive film is produced by drying an applied coat of a particle dispersion (1), which is a diluted solution (2) of thermoplastic resin in which the conductive particles (3) are dispersed and which forms a coating upon drying. A conductive particle containing layer (7) is formed in which the coated conductive particles (4), which are coated by the dried coating of the diluted solution (2) of thermoplastic resin, are fixed in a single layer to the dried applied coat (6a), and the conductive particle containing layer (7) is laminated by an insulating resin layer (8).

Conductive fine particles, method for plating fine particles, and substrate structural body

The purpose of the present invention is to provide a conductive fine particles having an ability of relaxing the force exerted on a circuit, and a method for retaining the constant distance between substrates. The present invention relates to conductive fine particles, wherein at least one metallic layer is covered with basic fine particles of resin. The coefficient of linear expansion of the resin is 3x10-5 to 7x10-5 (1/K).

NON-RANDOM ARRAY ANISOTROPIC CONDUCTIVE FILM (ACF) AND MANUFACTURING PROCESSES

The present invention discloses structures and manufacturing processes of an ACF of improved resolution and reliability of electrical connection using a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes the steps of (i) fluidic filling of conductive particles onto a substrate or carrier web comprising a predetermined array of microcavities, or (ii) selective metallization of the array followed by filling the array with a filler material and a second selective metallization on the filled microcavity array. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film. release layer ...

Anisotropically electroconductive connecting material

An anisotropically electroconductive connecting material, which is disposed between a connection terminal on a first substrate and a connection terminal on a second substrate and joins the substrates together by thermocompression bonding while maintaining electroconductive connection therebetween, includes electroconductive particles dispersed in an insulating adhesive, wherein the modulus of elasticity of the electroconductive particles at the compression bonding temperature is 200% or less of the modulus of elasticity of the first substrate at the compression bonding temperature.

Electronic component built-in substrate and method of manufacturing the same

In an electronic component built-in substrate of the present invention, an electronic component is mounted on a mounted body having a first wiring layer, the electronic component is embedded in an insulating layer, a conductive ball is arranged to pass through the insulating layer and connected electrically to the first wiring layer, a second wiring layer connected electrically to the conductive ball is formed on the insulating layer, and the first wiring layer and the second wiring layer are interlayer-connected via the conductive ball.

DISPLAY DEVICE

PROBLEM TO BE SOLVED: To provide a display device capable of suppressing an increase in contact resistance between a substrate and an integrated circuit chip by fixing the compressed form of a conductive ball. SOLUTION: The display device includes: a wiring substrate having a wiring part formed therein; an integrated circuit chip mounted on the wiring substrate; and a pad part extended from the wiring part to be set between the wiring substrate and the integrated circuit chip, and coupled to the integrated circuit chip. The pad part includes: a first conductive layer extended from the wiring part; and a second conductive layer positioned on the first conductive layer and harder than the first conductive layer. COPYRIGHT: (C)2011,JPO&INPIT ...

Elektrisch leitfähige, thermoplastische und hitzeaktivierbare Klebstofffolie und deren Verwendung

Elektrisch leitfähige, thermoplastische und hitzeaktivierbare Klebstoffolie, enthaltend i) ein thermoplastisches Polymer mit einem Anteil von zumindest 30 Gew.-%, ii) ein oder mehrere klebrigmachende Harze mit einem Anteil von 5 bis 50 Gew.-% und/oder iii) Epoxidharze mit Härtern, gegebenenfalls auch Beschleunigern, mit einem Anteil von 5 bis 40 Gew.-%, iv) metallisierte Partikel mit einem Anteil von 0,1 bis 40 Gew.-%, v) nur schwer oder nicht verformbare Spacerpartikel mit einem Anteil von 1 bis 10 Gew-%, die bei der Verklebungstemperatur der Klebstoffolie nicht schmelzen.

Method of applying a conductive adhesive

ELECTRICALLY CONDUCTIVE ONES, THERMOPLASTIC ONES AND HEAT-ACTIVATE-CASH ADHESIVE FOIL

COMPOSITIONS AND METHODS FOR ARRANGEMENT ANISOTROPISCH OF DIRECTIONS COURSES AND CONNECTIONS BETWEEN TWO SENTENCES OF LEADERS

COATED CONDUCTIVE PARTICLE, COATED CONDUCTIVE PARTICLE MANUFACTURING METHOD, ANISOTROPIC CONDUCTIVE MATERIAL, AND CONDUCTIVE CONNECTION STRUCTURE

A coated conductive particle excellent in connection reliability, a coated conductive particle manufacturing method, an anisotropic conductive material, and an electrical connection structure. A coated conductive particle composed of a particle having a surface of a conductive metal and insulating particles covering the particle having the conductive metal surface, wherein the insulating particles form a single coating layer by chemically bonding with the particle having the conductive metal surface through a functional group (A) having a bondability with the conductive metal.

Anisotropic conductive adhesive

The anisotropic conductive adhesive

DISPLAY DEVICE

LED-BASED LIGHT SOURCE UTILIZING ASYMMETRIC CONDUCTORS

ELECTROCONDUCTIVE PARTICLE, ANISOTROPIC ELECTROCONDUCTIVE MATERIAL AND CONNECTING STRUCTURE

CONDUCTIVE ADHESIVE, STRUCTURE FOR MOUNTING, LIQUID CRYSTAL DEVICE, ELECTRONIC DEVICE AND PREPARATION METHOD OF STRUCTURE FOR MOUNTING, LIQUID CRYSTAL DEVICE AND ELECTRONIC DEVICE

PURPOSE: A conductive adhesive, a structure for mounting, a liquid crystal device, an electronic device, and their preparation method are provided, which conductive adhesive is resistant to the solder reflow treatment. CONSTITUTION: The conductive adhesive (7, 32) is prepared by mixing a plurality of conductive particles (16) with an adhesive resin (14), wherein the conductive particles (16) comprises a core (17) which is formed by a synthetic resin and a conductive material (18) which coats the core (17), and the heat transformation temperature of the synthetic resin is higher than that of the adhesive resin (14). The structure for mounting (1, 23) comprises a base substrate (3, 35); and mounting components which are adhered to the base substrate by using the previously mentioned conductive adhesive (7, 32). The liquid crystal device (21) comprises a liquid crystal panel which are prepared by inserting liquid crystal between a pair of substrates; and the previously mentioned structure ...

ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD THEREFOR

An anisotropic conductive film in which conductive particles are positioned uniformly in a single layer, and which is compatible with fine pitch connection. Said anisotropic conductive film is produced by drying an applied coat of a particle dispersion (1), which is a diluted solution (2) of thermoplastic resin in which the conductive particles (3) are dispersed and which forms a coating upon drying. A conductive particle containing layer (7) is formed in which the coated conductive particles (4), which are coated by the dried coating of the diluted solution (2) of thermoplastic resin, are fixed in a single layer to the dried applied coat (6a), and the conductive particle containing layer (7) is laminated by an insulating resin layer (8).

CIRCUIT-CONNECTING MATERIAL, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER

Disclosed is a circuit-connecting material for electrically interconnecting two circuit members each having a circuit electrode formed thereon with the circuit electrodes being opposed to each other. The circuit-connecting material comprises an adhesive composition and an electrically conductive particle, wherein the electrically conductive particle comprises a core comprising an organic polymer compound and a metal layer comprising metal nickel or a nickel alloy which covers the core, and has multiple projection parts on its surface. The core has an average particle diameter of 1 to 4 μm. The metal layer has a thickness of 65 to 125 nm.

Liquid crystal device and manufacturing method therefor

A liquid crystal device and a manufacturing method thereof are described. The device comprises a liquid crystal panel and an auxiliary panel formed with an IC circuit for supplying driving signals to the liquid crystal device. The auxiliary substrate is separately provided with the circuit and the function thereof is tested in advance of the assembling with the liquid crystal panel. By this procedure, the yield is substantially improved.

Method of producing a wiring board

A wiring board comprises a substrate; a resin layer which is selectively formed on one main surface of the substrate and has fine metal particles contained or adhered to its surface; and a conductive metal layer which is formed on the resin layer with the fine metal particles interposed between them.

Anisotropic conductive adhesive, electrode connection structure and method using the adhesive

Anisotropic conductive adhesive has conductive particles dispersed in adhesive and includes hard particles having conductivity, a resin layer that coats the hard particles and a conductive layer that coats the resin layer. A connection structure electrically connects electrodes to each other with the anisotropic conductive adhesive. A connection method includes the steps of causing the anisotropic conductive to intervene between electrodes, applying pressure to the anisotropic conductive adhesive and allowing the adhesive to be solidified.

Method for Forming Conductive Circuit

A conductive circuit is formed by printing a pattern using a conductive ink composition and heat curing the pattern. A thixotropic agent, typically carbon black is added to the solvent-free ink composition comprising an addition type silicone resin precursor, a curing catalyst, and conductive particles. The ink composition has such thixotropy that the printed pattern may retain its shape after curing.

COATED CONDUCTIVE PARTICLE, COATED CONDUCTIVE PARTICLE MANUFACTURING METHOD, ANISOTROPIC CONDUCTIVE MATERIAL, AND CONDUCTIVE CONNECTION STRUCTURE

A semi-rigid cable according to the invention is provided with a brass wire 1 having a silver-plating layer 2 formed by plating of silver having an electrically high conductive property, a dielectric layer 3 of fluoro-resin, a polymer-resin film 4 deposited with a well electrical conductive film (inside outer conductor) 5 by vapor deposition method, and a metal pipe 6 of a low thermal conductivity which is an outside outer conductor, respectively, coaxially arranged. This polymer-resin film 4 is inserted into the metal pipe 6 in such a manner than the well electrical conductive film 5 is directed toward the outer periphery, and the well electrical conductive film 5 and the metal pipe 6 are electrically in contact. The well conductive film 5 has a thickness in a range of more than 1 µm and less than 10 µm.

Verfahren zur Herstellung eines Bauteils mittels pulverbasiertem 3D-Druck sowie ein solches Bauteil

Die Erfindung betrifft ein Verfahren zur Herstellung eines Bauteils mittels pulverbasiertem 3D-Druck sowie ein solches Bauteil.Es ist vorgesehen, dass ein Verfahren zur Herstellung eines Bauteils mittels pulverbasiertem 3D-Druck mit zumindest einem elektrisch leitenden Bereich (24, 38, 52) und zumindest einem elektrisch isolierenden Bereich (22, 36, 50) bereitgestellt wird. Das Verfahren umfasst dabei die folgenden Schritte: Ausrichten einer Laservorrichtung (16) über einem Multi-Material-Pulverwerkstoff, wobei die Laservorrichtung (16) ausgelegt ist, wenigstens zwei sich unterscheidende Laserparameter aufzuweisen, und Bearbeiten des Multi-Material-Pulverwerkstoffs mittels der Laservorrichtung (16) zur Herstellung des Bauteils, wobei eine definierte Verwendung der zwei Laserparameter eingesetzt wird. Der Multi-Material-Pulverwerkstoff wird aus wenigstens zwei Materialien hergestellt, wobei die wenigstens zwei Materialien verschiedene Schmelz- und Siedepunkte aufweisen, so dass beim Bearbeiten ...

Leitfähige Verbindungsstruktur.

Electrically conductive microparticle, anisotropic electrically conductive material, connection structure, and method for production of electrically conductive microparticle

Disclosed is an electrically conductive microparticle which has low initial connection resistance and which is less likely to cause the increase in connection resistance even when stored for a long period. Specifically disclosed is an electrically conductive microparticle comprising a resin microparticle and a copper layer formed on the surface of the resin microparticle, wherein the copper layer has an area corresponding to a void at an areal ratio of 5% or less relative to the surface area of a thickness-wise cross-section thereof, and wherein the copper constituting the copper layer has an average crystallite diameter of 40 nm or more.

Resin particle, conductive particle and anisotropic conductive adhesive containing the same

The conductive material and connection structure

Semiconductor device and method for making same

CONDUCTIVE PARTICLE AND ADHESIVE AGENT

A conductive particle (30) usable for connecting a variety of fitted bodies, comprising a resin particle (31), a first conductive particle disposed around the resin particle (31), a first resin film (25) disposed around the first conductive particle and softer than the resin particle (31), and a second conductive film (36) disposed around the first resin film (25), wherein when, for example, the surface portion of an electrode (13) of the fitted body to be connected is hard, the first resin film (35) and the second conductive film (36) are ruptured by pressing, and the second conductive film (36) is brought into contact with the electrode (13) and a metal wire (17) and, when the surface portion of the electrode (13) is soft, the second conductive film on the surface side comes into contact with the electrode (13), whereby the conductive particle can be used for the connection of the variety of fitted bodies irrespective of the state of the surface of the fitted body. © KIPO & WIPO 2007 ...

CONDUCTIVE PARTICLE AND METHOD FOR PREPARING THE SAME, OBTAINING A HIGH DEFORMATION RECOVERY RATE AFTER COMPRESSIVE DEFORMATION IN CASE OF A HIGH COMPRESSIVE DISPLACEMENT

PURPOSE: A conductive particle and a method for preparing the same are provided to suppress deterioration of physical properties of a polymer due to strong acid or strong alkali used during plating. CONSTITUTION: A conductive particle includes a polymer base particle and a conductive layer to cover the polymer base particle. When a displacement of a particle diameter of the conductive particle is 50%, a compressive elastic deformation characteristic of the conductive particle is 100 to 50000 N/mm^2 at a temperature of 20 degrees centigrade, and a recovery rate of the particle diameter of the conductive particle is more than 30%. © KIPO 2008 ...

CONDUCTIVE COMPOSITIONS CONTAINING BLENDED ALLOY FILLERS

CONDUCTIVE MATERIAL AND CONNECTED STRUCTURE

... 본 발명은 반응 속도가 빠르고, 또한 플럭스 효과가 높은 도전 재료를 제공한다. 본 발명에 관한 도전 재료는 적어도 외표면이 땜납인 도전성 입자(1)와, 음이온 경화성 화합물과, 음이온 경화제와, 카르복실기 및 카르복실기가 에스테르화된 관능기를 갖는 유기산을 포함한다.

Coated fine particle and their manufacturing metho

COATED CONDUCTIVE POWDER AND CONDUCTIVE ADHESIVE USING THE SAME

Disclosed is a coated conductive powder having excellent electrical reliability, wherein aggregation of conductive particles is suppressed. Also disclosed is a conductive adhesive using such a coated conductive powder, which is capable of forming an electrical connection of high reliability even for an electrode connection in miniaturized electronic devices such as IC chips or circuit boards. Specifically disclosed is a coated conductive powder which is obtained by coating the surfaces of conductive particles with insulating inorganic fine particles. The coated conductive powder is characterized by having a volume resistivity of not more than 1 Ω·cm. The coated conductive powder is also characterized in that the insulating inorganic fine particles have a specific gravity of not more than 5.0 g/ml, and the particle diameter ratio of the insulating inorganic fine particles to the conductive particles (insulating inorganic fine particles/conductive particles) is not more than 1/100. The coated ...

Conductive bonding agent and a conductive connecting method

In a conductive connecting structure for electrically connecting first and second electronic parts each having a plurality of connecting terminals arranged at a small pitch, a conductive bonding agent is interposed between the plurality of connecting terminals of the first and second electronic parts. The conductive agent is prepared by mixing a plurality of fine connecting particles in an insulating adhesive. Each fine connecting particle is designed such that a fine conductive particle or a fine insulating particle with a plating layer formed on its surface is covered with an insulating layer consisting of a material which is broken upon thermocompression bonding. When the conductive bonding agent is subjected to thermocompression bonding between the connecting terminals of the first and second electronic parts, portions of the fine connecting particles which are urged by the respective fine connecting terminals are broken. However, the insulating layers of the fine connecting particles ...

ANISOTROPIC CONDUCTIVE ADHESIVE FILM

An anisotropic conductive adhesive film capable of maintaining a high connection reliability on connection electrodes with a fine pitch on which an oxide film is formed. The anisotropic conductive adhesive film 1 comprises conductive particles 7 dispersed in an insulating binder 6. Each conductive particle 7 consists of a styrene resin particle 71 and a thin metal film 72 formed on the surface thereof by gold-plating, etc. Projections 72a are formed on the surface of the thin metal film 72 of the conductive particle 7.

Connection body, method for manufacturing a connection body, connecting method and anisotropic conductive adhesive agent

Ensure conduction between an electronic component and a circuit substrate having reduced pitches in wiring of the circuit substrate or electrodes of the electronic component and prevent short circuits between electrode terminals of the electronic component. A connection body including an electronic component connected to a circuit substrate via an anisotropic conductive adhesive agent containing conductive particles; wherein the conductive particles are regularly arranged; and wherein the conductive particles have a particle diameter that is ½ or less than a height of a connecting electrode of the electronic component.

COATED CONDUCTIVE PARTICLES AND METHOD FOR PRODUCING SAME

... [Problem to be Solved] To provide conductive particles which are capable of providing an anisotropically conductive adhesive that can maintain sufficient insulation characteristics and conduction characteristics even when used for the connection of a very small circuit, while having excellent moisture absorption resistance at a lower cost. [Solution] A coated conductive particle (5) comprises: a composite conductive particle (3) that has a resin particle (4) and a metal layer (6) that covers the resin particle (4); and insulating fine particles (1) that are provided on the outer side of the metal layer (6) so as to partially cover the surface of the metal layer (6). The metal layer (6) has a nickel-palladium alloy plating layer (6a).

ELECTRICALLY CONDUCTIVE PAPER

ANISOTROPIC CONDUCTIVE ADHESIVE, CONNECTION STRUCTURE USING THE SAME AND CONNECTION METHOD

PROBLEM TO BE SOLVED: To maintain a connection state between an electrode and a conductive particle in an excellent state both at projected parts and recessed parts and to prevent a rise in connection resistance even in the formation of unevenness on the surface of an electrode to be connected. SOLUTION: The anisotropic adhesive comprises a conductive particle in an adhesive. The conductive particle comprises a conductive hard particle, a resin layer formed to cover the hard particle and a conductive layer formed to cover the resin layer. The hard particle is a metal particle such as Ni particle, etc. The particle diameter of the hard particle is ≤1/3 particle diameter of the conductive particle. COPYRIGHT: (C)2006,JPO&NCIPI ...

ELECTRICALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE TAPE

Electrically conductive elements on two substrates can be electrically interconnected by an adhesive tape containing electrically conductive equiax particles that are individually positioned in the adhesive layer in a predetermined pattern. Each particle is harder than the elements it is to interconnect, so that hand pressure causes the particles to penetrate into the elements, thus creating a reliable electrical connection. Particularly useful particles are glass beads having a metallic coating that is from 0.1 to 2 .mu.m thick.

Electroconductive fine particles, anisotropic electroconductive material, and connection structure

This invention provides electroconductive fine particles which can reduce a connection resistance value and can realize high connection reliability, and an anisotropic electroconductive material and aconnection structure using the electroconductive fine particles. The electroconductive fine particles comprise a resin fine particle and a metal layer containing nickel or palladium and a low-meltingpoint metal layer containing a low-melting point metal and at least one group 13 element selected from the group consisting of thallium, indium, and gallium stacked in that order on the surface of the resin fine particle. The content of the group 13 element based on the total content of the metals contained in the low-melting point metal layer is 0.01 to 6% by weight.

Circuit connection material and circuit connection structure

METHODS OF PRODUCING ANISOTROPIC CONDUCTIVE ADHESIVE FILM AND CONNECTION

INHIBITOR PARTICLE, METHOD FOR PRODUCING THE SAME, ELECTRODE PASTE, AND METHOD FOR PRODUCING ELECTRONIC DEVICE, CAPABLE OF SUPPRESSING PARTICLE GROWTH OF Ni AT SINTERING PROCESS

PURPOSE: An inhibitor particle, a method for producing the same, an electrode paste, and a method for producing an electronic device are provided to suppress deterioration of capacitance by preventing an electrode from being shorted. CONSTITUTION: An inhibitor particle includes a core portion(51) and a cladding layer(52). The core portion(51) is made of dielectric material. The coating layer(52) covers around the core portion(51). The coating layer(52) is made of noble material. And, the noble material includes material selected from a group consisting of Ru, Rh, Re, Pt, Ir and Os. © KIPO 2007 ...

도전 재료 및 접속 구조체

... 본 발명은 반응 속도가 빠르고, 또한 플럭스 효과가 높은 도전 재료를 제공한다. 본 발명에 관한 도전 재료는 적어도 외표면이 땜납인 도전성 입자(1)와, 음이온 경화성 화합물과, 음이온 경화제와, 카르복실기 및 카르복실기가 에스테르화된 관능기를 갖는 유기산을 포함한다.

ELECTROCONDUCTIVE FINE PARTICLES, ANISOTROPIC ELECTROCONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE

This invention provides electroconductive fine particles which can reduce a connection resistance value and can realize high connection reliability, and an anisotropic electroconductive material and a connection structure using the electroconductive fine particles. The electroconductive fine particles comprise a resin fine particle and a metal layer containing nickel or palladium and a low-melting point metal layer containing a low-melting point metal and at least one group 13 element selected from the group consisting of thallium, indium, and gallium stacked in that order on the surface of the resin fine particle. The content of the group 13 element based on the total content of the metals contained in the low-melting point metal layer is 0.01 to 6% by weight. COPYRIGHT KIPO & WIPO 2010 ...

POLYMER RESIN MICROFINE PARTICLES, CONDUCTIVE PARTICLES CONTAINING THE SAME. AND ANISOTROPIC CONDUCTIVE CONNECTION MATERIALS CONTAINING THE CONDUCTIVE PARTICLES

PURPOSE: Polymer resin microfine particles for conductive particles contained in anisotropic conductive connection structure or film are provided to produce conductive particles with excellent conductive performance difficult to be damaged and improve contact area of the conductive particles by coating the polymer resin base microfine particles with at least one metal layer to form the conductive particles. CONSTITUTION: The polymer resin particle has 10% K value at 10% modification of particle diameter ranging from 250kgf/mm^2 to 700kgf/mm^2, below 30% of compression recovery and above 30% of compression failure strain. The polymer resin particle has average particle size of 0.1 to 200 microns and aspect ratio of below 1.5 and CV value of less than 20%. The polymer resin microfine particle is obtained by seed polymerization using polymer seed with molecular weight ranging from 1,000 to 30,000. The conductive microfine particle is fabricated by coating the polymer resin particle(11) as ...

Anisotropic conductive film, method for producing the same, connecting method and joined structure

An anisotropic conductive film for anisotropically conductively connecting a terminal of a substrate to a terminal of an electronic component, said film containing conductive particles, wherein the conductive particles are conductive particles obtained by forming a metal deposit layer and an insulating layer in this order on the surface of resin particles and/or conductive particles obtained by forming an insulating layer on the surface of metal particles. The conductive particles have been connected to form clusters each made up of 3.0 to 10.0 particles on average.

METHOD OF APPLYING A CONDUCTIVE ADHESIVE

A method of applying a conductive adhesive comprising: using a conductive adhesive 18 made up of conductive beads 12 in an adhesive matrix 8, the conductive beads comprising a polymer core and a conductive coating and having a maximum dimension of 100 µm or less; and depositing droplets of the adhesive 18 on a substrate via a nozzle 20.

Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained

METHOD OF PRODUCING ELECTRO-OPTICAL DEVICE AND ELECTRO-OPTICAL DEVICE

A method of producing an electro-optical device for electrically connecting a first terminal portion provided on an electro-optical panel to a second terminal portion of a substrate includes applying an anisotropic conductive adhesive containing conductive particles made of a low-melting-point material onto either the first terminal portion or the second terminal portion, and electrically connecting the first terminal portion to the second terminal portion by eutectic bonding by melting the conductive particles by application of heat in thermocompression bonding of the second terminal portion to the first terminal portion with the anisotropic conductive adhesive therebetween.

CONDUCTIVE MATERIAL AND CONNECTED STRUCTURE

There is provided a conductive material which has a rapid reaction rate and is high in fluxing effect. The conductive material according to the present invention includes a conductive particle having solder at at least an external surface, an anionically hardenable compound, an anionic hardener, and an organic acid having a carboxyl group and having a functional group that is an esterified carboxyl group.

Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips

A composition (18) comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles (3) having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B), is effective for connecting circuits electrically or connecting a semiconductive chip (11) to a wiring substrate (14).

ELEKTRISCHE VERBINDUNGSSTRUKTUR UND VERFAHREN ZUM ELEKTRISCHEN VERBINDEN VON ANSCHLUESSEN UNTEREINANDER

Electrical connector laminate for flat components, e.g. PCB and LCD - using metal- or graphite-coated hard mineral particles to provide conductivity perpendicular to it plane

The connector has a carrier layer (1) with a printed-on layer (2) of metal or graphite-filled high polymer paste and a layer of heat sealable high polymeric material. It is electrically conductive perpendicularly to its plane by way of discrete conductive particles, pref. irregularly-shaped particles which are harder than the carrier layer (1) and which are esp. metal- or graphite-coated hard mineral particles, 3-25 microns in size. USE/ADVANTAGE - The connectors can be used in connecting flat components to flat elements, e.g. PCBs or flexible or hybrid switches to LCDs, solar cells or membrane switches. The mineral particles are cheaper than metal (e.g., Au, Ag or noble metal) particles. They are also more resistant to oxidn. and settling-out and give a transition resistance of ca 100 ohm for CMOS circuits. .

A method of forming a coating onto a non-random monolayer of particles, and products formed thereby

A METHOD OF FORMING A COATING ONTO A NON-RANDOM MONOLAYER OF PARTICLES, AND PRODUCTS FORMED THEREBY

The present invention provides a variety of interrelated methods of coating non-random and ordered arrays of particles, as well as films containing such arrays. The present invention also relates to the coated non-random and ordered arrays of particles and films prepared therefrom. The coated non- random and ordered arrays are obtained by the use of ferrofluid compositions which may be curable. The arrays and films may contain electrically-conductive particles useful in electronic applications for effecting contact between conductors.

COATED PARTICLE

Coated particles having excellent connection reliability. The coated particl es each comprises a core particle having a surface layer made of a metal, where in the core surface has been partly modified with an organic compound through a functional group (A) having bondability to the metal.

COMPOSITIONS AND METHODS FOR PROVIDING ANISOTROPIC CONDUCTIVE PATHWAYS AND BONDS BETWEEN TWO SETS OF CONDUCTORS

The invention provides a composition (3) comprising: (i) a ferrofluid comprising a colloidal suspension (4) of ferromagnetic particles in a nonmagnetic carrier liquid, and (ii) a plurality of electrically-conductive particles (5) having substantially uniform sizes and shapes, dispersed in the ferrofluid. Various types of substantially non-magnetic electricallyconductive particles (5) are described. Application of a substantially uniform magnetic field by magnet means (8) to the composition (3) causes the electrically-conductive particles (5) to form a regular pattern (9). The composition is used for providing anisotropic conductive pathways (9a, 9b) between two sets of conductors (2a, 2b; 7a, 7b) in the electronics industry. The composition may be a curable adhesive composition which bonds the conductors. Alternatively or in addition the electrically-conductive particles may have a latent adhesive property e.g. the particles may be solder particles. The ferrofluid may be a colloidal suspension ...

Film-like circuit connection material and circuit connection structure

Component mounting structure

本发明的部件安装结构体含有具有多个第1电极的第1对象物、具有多个第2电极的作为电子部件的第2对象物、分别接合多个第1电极和对应的多个第2电极的接合部、和树脂加强部。接合部具有含有第1金属及树脂粒子中的至少一方的第1芯部、以及第1金属与低熔点的第2金属的金属间化合物层。树脂加强部在第1电极与第2电极之间的空间的以外部分中，含有包含芯部和金属间化合物的粒状物。该部分中的粒状物的含量为0.1～10体积％。

Using method of circuit connection material

A circuit connection structure includes: a first circuit member in which a first circuit electrode is formed on a main surface of a first circuit board; a second circuit member, arranged while facing the first circuit member, in which a second circuit electrode is formed on a main surface of a second circuit board; and a circuit connection member which is provided between the main surface of the first circuit member and the main surface of the circuit member to electrically connect the first and second circuit electrodes. The first and second circuit electrodes have a thicknesses of 50 nm or more. The circuit connection member is acquired by curing a circuit connection material which contains an adhesive composite and conductive particles wherein a plurality of projections are arranged on the surface side thereof. The outermost layer of the conductive particles is formed by a nickel or a nickel alloy, thereby the circuit connection structure is constituted.

ADHESIVE AGENT, AND METHOD FOR CONNECTING ELECTRONIC COMPONENT

COATED PARTICLE

Coated particles having excellent connection reliability. The coated particles each comprises a core particle having a surface layer made of a metal, wherein the core surface has been partly modified with an organic compound through a functional group (A) having bondability to the metal. © KIPO & WIPO 2007 ...

인쇄 회로 기판의 비아

... 인쇄 회로 기판의 비아는 라미네이트 유전체의 구멍을 통해 연장하는 패턴화된 금속 층으로 구성되며, 상기 라미네이트 유전체는 라미네이트 유전체의 양면이 촉매 접착제로 덮여있다. 촉매 접착제의 층은 구멍 주변의 라미네이트 유전체의 일부분을 코팅한다. 패턴화된 금속 층은 라미네이트 유전체의 양면과 구멍 내에서 촉매 접착제 상에 놓여진다.

ELECTRICALLY CONDUCTIVE MICROPARTICLE, ANISOTROPIC ELECTRICALLY CONDUCTIVE MATERIAL, CONNECTION STRUCTURE, AND METHOD FOR PRODUCTION OF ELECTRICALLY CONDUCTIVE MICROPARTICLE

Disclosed is an electrically conductive microparticle which has low initial connection resistance and which is less likely to cause the increase in connection resistance even when stored for a long period. Specifically disclosed is an electrically conductive microparticle comprising a resin microparticle and a copper layer formed on the surface of the resin microparticle, wherein the copper layer has an area corresponding to a void at an areal ratio of 5% or less relative to the surface area of a thickness-wise cross-section thereof, and wherein the copper constituting the copper layer has an average crystallite diameter of 40 nm or more. COPYRIGHT KIPO & WIPO 2010 ...

Adhesive composition, film-like adhesive, adhesive sheet, circuit-connected body, method for connecting circuit component, use of adhesive composition, use of film-like adhesive and use of adhesive sheet

An adhesive composition is provided, which adheres a first circuit component, in which a first circuit electrode is formed on a main surface of a first circuit substrate, to a second circuit component, in which a second circuit electrode is formed on a main surface of a second circuit substrate, by electrically connecting the first circuit electrode with the second circuit electrode. At least one of the first circuit substrate and the second circuit substrate includes a thermoplastic resin having a glass transition temperature of 200 DEG C or less. The adhesive composition includes a core-shell type silicone microparticle which has a core layer and a shell layer disposed by covering the core layer.

Conductive particle, conductive material and connecting structure

Provided are: a conductive particle whereby connection resistance can be reduced in the cases where electrodes are connected to each other; and a conductive material using the conductive particle. A conductive particle (1) of the present invention is provided with a base material particle (2), and a conductive material (4) that is disposed on a region of the base material particle (2), said region being a part of the surface of the base material particle, and the conductive material (4) is a material having a Mohs hardness higher than that of nickel.

Anisotropic conductive adhesive agent

Provided is an anisotropic conductive adhesive agent with which it is possible to obtain high heat-dissipation properties. The present invention contains: conductive particles (31) in which a conductive metal layer is formed on the surface of resin particles; solder particles (32) having a smaller average size than the conductive particles; and a binder in which the conductive particles (31) and the solder particles (32) are dispersed. The conductive particles (31) are deformed into a flat shape by being pressed during crimping, thereby electrically connecting terminals. Moreover, the terminals are solder joined by means of the solder particles (32) having a smaller average size than the conductive particles (31). As a consequence, the contact area between opposing terminals increases and it is possible to obtain high heat-dissipation properties.

Anisotropically electroconductive resin film

An isotropically electroconductive resin film material produced by sticking electroconductive particles to a sticking layer formed on a support and fixing therein, and filling a film-forming resin incompatible with the sticking material among the electroconductive particles, has electroconductivity only in the film thickness direction via the electroconductive particles uniformly dispersed in the plane direction, and is suitable for electrically connecting oppositely placed circuits and fine electrodes of a plurality of electronic parts, and for testing electronic parts.

Anisotropic conductive material body, display apparatus, method for producing the display apparatus, and conductive member

An anisotropic conductive material body includes an insulating medium; and a plurality of conductive members dispersed in the medium. At least a surface of each of the plurality of conductive members is conductive. A force is applied to at least one of the plurality of conductive members so as to change the at least one conductive member, so that the conductive property of the anisotropic conductive material body provided by the at least one conductive member is changed to an insulating property.

ANISOTROPIC CONDUCTIVE ADHESIVE MATERIAL AND DISPLAY PANEL UNIT HAVING THE SAME

An anisotropic conductive adhesive material and a display panel unit having the same is disclosed. The anisotropic conductive adhesive material may comprise a binder; and a conductive filler which is uniformly distributed inside the binder and is not distorted by thermal adhesion. Accordingly, the conductive filler may be uniformly distributed, thereby enhancing an electric contact quality between an electrode of a glass substrate and an FPC and reducing contact resistance.

Halbleiterbauteil mit Verdrahtungssubstrat und Lotkugeln als Verbindungselement sowie Verfahren zur Herstellung des Halbleiterbauteils

Halbleiterbauteil mit Verdrahtungssubstrat (4) und Lotkugeln (6) als Verbindungselement (7), wobei das Verbindungselement (7) mindestens eine Sockelkugel (8) und eine auf der Sockelkugel (8) gestapelte Lotkugel (6) aufweist, wobei die Lotkugel (6) mindestens teilweise ein lötbares Lotmaterial aufweist und wobei die Sockelkugel (8) mit einer Kontaktanschlussfläche (9) des Verdrahtungssubstrats (4) elektrisch in Verbindung steht und eine nicht vom Lotmaterial der Lotkugel (6) benetzbare Schutzbeschichtung (10) auf ihrer Oberfläche (11) aufweist, die eine Oxid- oder Nitrid- oder Sulfidschicht des Materials der Sockelkugel (8) aufweist, wobei eine Grenzfläche (12) der Sockelkugel (8) frei von der Schutzbeschichtung (10) ist, und wobei die Grenzfläche (12) stoffschlüssig mit dem Material der Lotkugel verbunden ist.

ELECTRICALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE TAPE

이방성 도전 필름, 이방성 도전 필름의 제조 방법, 접속 방법 및 접합체

... 본 발명은, 기판의 단자와 전자 부품의 단자를 이방성 도전 접속시키는 이방성 도전 필름이며, 도전성 입자를 함유하고, 상기 도전성 입자가 수지 입자의 표면에 금속 도금층 및 절연층을 순차 형성한 도전성 입자, 및 금속 입자의 표면에 절연층을 형성한 도전성 입자 중 적어도 어느 하나이고, 상기 도전성 입자가 평균 3.0개 내지 10.0개 연결되어 있는 이방성 도전 필름을 제공한다.

NON-RANDOM ARRAY ANISOTROPIC CONDUCTIVE FILM (ACF) AND MANUFACTURING PROCESSES

The present invention discloses structures and manufacturing processes of an ACF of improved resolution and reliability of electrical connection using a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes the steps of (i) fluidic filling of conductive particles onto a substrate or carrier web comprising a predetermined array of microcavities, or (ii) selective metallization of the array followed by filling the array with a filler material and a second selective metallization on the filled microcavity array. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film. © KIPO & WIPO 2009 ...

POLYMER PARTICLE, CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

CONDUCTIVE PARTICLE, RESIN PARTICLE, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE

Manufacturing method for mounting body, and anisotropic conductive film

To provide a manufacturing method of a mounting body which can ensure high connection reliability while facilitating the rework, and to provide an anisotropic conductive film. The manufacturing method of a mounting body includes a mounting step for mounting an electronic member on a wiring board, via the anisotropic conductive film, containing a binder principally composed of epoxy resin, and conductive particles having a compression hardness K value of 500 kgf/mm2 or more during 10% compressive deformation, where the thickness A of the binder and the average particle size B of the conductive particles satisfy a relation 0.6 B/A 1.5, and the modulus of elasticity of the binder at 100 DEG C after hardening is 50 MPa or more, and a remounting step for performing the mounting step by reusing the wiring board, upon occurrence of an inconvenient mounting in the mounting step, by peeling the wiring board and electronic member mechanically.

CIRCUIT CONNECTING MATERIAL, FILM-LIKE ADHESIVE, ADHESIVE REEL, AND CIRCUIT CONNECTING STRUCTURAL BODY

Provided is a circuit connecting material (20) which electrically connects a pair of facing circuit electrodes by applying a pressure to the circuit electrodes in a direction wherein the circuit electrodes face each other, by arranging the circuit connecting material between the pair of circuit electrodes. The circuit connecting material contains an adhesive composition (21) and a filler (22) dispersed in the adhesive composition (21), and the content of the filer (22) is 1-25 vol%.

Connecting structure used in a chip module

An improved chip module is described. The improved chip is comprised of a loading board for connecting with an external electronic component, a plurality of electrical conductors electrically disposed on the loading board. Each electrical conductor has an elastic body and a metal layer disposed thereon. The chip module connects with the external PCB directly. The electrical connector does not need to be disposed between the chip module and the external PCB, thereby reducing the manufacturing cost of the chip module.

Anisotropically electroconductive resin film

An isotropically electroconductive resin film material produced by sticking electroconductive particles to a sticking layer formed on a support and fixing therein, and filling a film-forming resin incompatible with the sticking material among the electroconductive particles, has electroconductivity only in the film thickness direction via the electroconductive particles uniformly dispersed in the plane direction, and is suitable for electrically connecting oppositely placed circuits and fine electrodes of a plurality of electronic parts, and for testing electronic parts.

Anisotropically electroconductive resin film

ANISOTROPIC CONDUCTIVE MATERIAL, DISPLAY DEVICE, MANUFACTURING METHOD FOR THE DEVICE, AND CONDUCTIVE MEMBER

PROBLEM TO BE SOLVED: To insulate one area while maintaining conductivity of another area in an anisotropic conductive material. SOLUTION: The anisotropic conductive material 25 is provided with a medium 25a having an insulating property and a plurality of conductive members 25b dispersed in the medium 25a. At least the surface of each of the plurality of conductive members 25b has a conductivity. When stress is applied to at least one conductive member so that at least one conductive member among the plurality of conductive members 25b is changed, conductivity of the anisotropic conductive material 25 based on the one conductive member 25b is changed into an insulating property. COPYRIGHT: (C)2005,JPO&NCIPI ...

Bonded assemblies with pre-deposited polymer balls on demarcated areas and methods of forming such bonded assemblies

In a method of forming a bonded assembly 10 a liquid-based dispersion of fine polymer balls 12 (< 50 μm diameter) is applied to a first substrate 16 having a plurality of demarcated areas 14 of width less than five ball diameters. The balls 12 are urged into registration through an electrical, chemical or physical stimulus, and the liquid from the dispersion is removed to leave the polymer balls in small clusters or individually in a single layer on the demarcated areas. The first substrate is aligned with respect to a second substrate 18 and pressed together to partially compress the polymer balls. The geometry of the assembly is fixed by bonding the assembly with the balls in a compressed state. In preferred embodiments the balls 12 have a diameter of between 2-6 μm and they are urged into place using electrophoresis and surface tension. The polymer balls may be coated with a metal such as Au and In, or treated or adapted to provide the balls with a charge or promote a chemical interaction ...

ELECTRICALLY CONDUCTIVE ADHESIVE TAPE

Coated conductive particles and method for producing same

[Problem to be Solved] To provide conductive particles which are capable of providing an anisotropically conductive adhesive that can maintain sufficient insulation characteristics and conduction characteristics even when used for the connection of a very small circuit, while having excellent moisture absorption resistance at a lower cost. [Solution] A coated conductive particle ( 5 ) comprises: a composite conductive particle ( 3 ) that has a resin particle ( 4 ) and a metal layer ( 6 ) that covers the resin particle ( 4 ); and insulating fine particles ( 1 ) that are provided on the outer side of the metal layer ( 6 ) so as to partially cover the surface of the metal layer ( 6 ). The metal layer ( 6 ) has a nickel-palladium alloy plating layer ( 6 a ).

Fixed-array anisotropic conductive film using conductive particles with block copolymer coating

Structures and manufacturing processes of an ACF array and more particularly a non-random particles are transferred to the array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles surface-treated with a block copolymer composition onto a substrate or carrier web comprising a predetermined array of microcavities. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film.

Adhesive agent, and method for connecting electronic component

Provided are an adhesive agent capable of providing sufficient electrical continuity to a substrate to which a preflux treatment has been applied and a method for connecting electronic components. There is used an adhesive agent comprising a (meth)acrylate having an epoxy group in one molecule and a radical polymerization initiator having a one minute half-life temperature of 110 degrees C. or more. A surplus adhesive agent component between terminals flows, whereby an imidazole component in a preflux, the component binding to an epoxy group of an epoxy group-containing acrylate, is drawn out thereby to be removed from a surface of the terminal.

Anisotropic conductive adhesive

Provided is an anisotropic conductive adhesive in which excellent optical characteristics and heat dissipation characteristics are obtainable. The anisotropic conductive adhesive contains conductive particles each comprising a metal layer having Ag as a primary constituent formed on an outermost surface of a resin particle, solder particles having a smaller average particle diameter than the conductive particles, reflective insulating particles having a smaller average particle diameter than the solder particles and a binder into which the conductive particles solder particles and reflective insulating particles are dispersed. The conductive particles and the reflective insulating particles efficiently reflect light, thereby improving light-extraction efficiency of an LED mounting body. Additionally, inter-terminal solder bonding of the solder particles during compression bonding increases contact area between opposing terminals, thereby enabling achievement of high heat dissipation characteristics.

CONNECTION STRUCTURE

A method for manufacturing connection structure, the method includes arranging conductive particles and a first composite on a first electrode located on a first surface of a first member, arranging a second composite on a region other than the first electrode of the first surface, arranging the first surface and a second surface of a second member where a second electrode is located, so that the first electrode and the second electrode are opposed to each other, pressing the first member and the second member; and curing the first composite and the second composite. 1. A connection structure comprising:a first member having a first surface;at least one first electrode located on the first surface;a second member having a second surface opposed to the first surface;at least one second electrode opposed to the at least one first electrode and located on the second surface;a first resin and conductive particles arranged between the at least one first electrode and the at least one second electrode, the conductive particles including a particle core having elasticity coated with metals; anda second resin arranged between a first region surrounding the at least one first electrode on the first surface and a second region surrounding the at least one second electrode on the second surface,wherein the second resin is in contact with the first surface and the second surface, and the first resin and the second resin have different compositions from each other.2. The connection structure according to claim 1 , wherein the first resin is in contact with the at least one first electrode and the at least one second electrode.3. The connection structure according to claim 1 , wherein the second composite contains a dendrimer or hyperbranch polymer structure portion having an acryl group.4. The connection structure according to claim 1 , wherein the second composite contains an ene/thiol-based curable resin containing an ethylene unsaturated compound and a thiol compound claim 1 ...

VIA IN A PRINTED CIRCUIT BOARD

A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material that has been covered with catalytic adhesive material on both faces of the dielectric laminate material. The layer of catalytic adhesive coats a portion of the dielectric laminate material around the hole. The patterned metal layer is placed over the catalytic adhesive material on both faces of the dielectric laminate material and within the hole. 1. A method for forming a via in a printed circuit board , comprising:forming a first hole in dielectric laminate material;coating both faces of the dielectric laminate material with a catalytic adhesive, including filling the first hole with the catalytic adhesive;forming a second hole through the catalytic adhesive where the catalytic adhesive fills the first hole, the second hole having a smaller diameter than the first hole so that a layer of catalytic adhesive remains at a diameter of the second hole; and,forming a patterned metal layer over the catalytic adhesive on both faces of the dielectric laminate material, including placing the patterned metal layer over the layer of catalytic adhesive that remains at the diameter of the second hole.2. A method as in claim 1 , additionally comprising:removing exposed portions of the catalytic adhesive that are not covered by the patterned metal layer.3. A method as in wherein the catalytic adhesive is a dielectric adhesive that includes non-catalytic and catalytic filler particles.4. A method as in wherein the catalytic adhesive is a dielectric adhesive that includes catalytic filler particles composed of metal suitable as a catalyst for copper plating.5. A method as in wherein the catalytic adhesive is a dielectric adhesive that includes catalytic filler particles composed of inorganic filler with metal coated over the inorganic filler.6. A method as in wherein the patterned metal layer is composed of copper.7. A method for forming a via in a ...

MOUNTING BODY MANUFACTURING METHOD AND ANISOTROPIC CONDUCTIVE FILM

A method for manufacturing a mounting body comprising: a mounting step of mounting an electronic component onto a wiring board via an anisotropic conductive film containing a binder having an epoxy resin as a primary constituent and conductive particles having a compressive hardness (K) of 500 kgf/mmor more when compressively deformed by 10%, wherein a relation between a thickness (A) of the binder and an average particle diameter (B) is 0.6≦B/A≦1.5 and an elastic modulus of the binder after curing is 50 MPa or more at 100° C.; and a remounting step of mechanically peeling to detach the electronic component and the wiring board in the case of a problem occurring in mounting of the mounting step and reusing the wiring board to perform the mounting step. 1. A method for manufacturing a mounting body comprising:{'sup': '2', 'a mounting step of mounting an electronic component onto a wiring board via an anisotropic conductive film containing a binder having an epoxy resin as a primary constituent and conductive particles having a compressive hardness K of 500 kgf/mmor more when compressively deformed by 10%, wherein a relation between a thickness A of the binder and an average particle diameter B is 0.6≦B/A≦1.5 and an elastic modulus of the binder after curing is 50 MPa or more at 100° C.; and'}a remounting step of mechanically peeling to detach the electronic component and the wiring board in the case of a problem occurring in mounting of the mounting step and reusing the wiring board to perform the mounting step.2. The method for manufacturing a mounting body according to claim 1 , wherein in the remounting step claim 1 , the mounting step is performed in a state in which a residue of the anisotropic conductive film remains on the wiring board.3. The method for manufacturing a mounting body according to claim 1 , wherein the binder has a thickness of 15 μm or less.4. The method for manufacturing a mounting body according to claim 1 , wherein the relation between the ...

ANISOTROPIC CONDUCTIVE FILM AND METHOD OF PRODUCING THE SAME

An anisotropic conductive film including conductive particles arranged uniformly in a single layer and capable of supporting fine-pitch connection is produced by: drying a coating film of a particle dispersion in which conductive particles are dispersed in a dilute solution of a thermoplastic resin that forms a coating after drying, whereby a conductive particle-containing layer is formed in which the coated conductive particles coated with the dried coating of the dilute solution of the thermoplastic resin and arranged in a single layer stick to the dried coating film; and laminating an insulating resin layer onto the conductive particle-containing layer. 1. A method of producing an anisotropic conductive film , the method comprising: drying a coating film of a particle dispersion in which conductive particles are dispersed in a dilute solution of a thermoplastic resin that forms a coating after drying , whereby a conductive particle-containing layer is formed in which the coated conductive particles coated with the dried coating of the dilute solution of the thermoplastic resin and arranged in a single layer stick to the dried coating film; and laminating an insulating resin layer onto the conductive particle-containing layer.2. The method of producing an anisotropic conductive film according to claim 1 , wherein a concentration of the thermoplastic resin present as a solid in the particle dispersion is adjusted to control a distance between the conductive particles in the anisotropic conductive film.3. The method of producing an anisotropic conductive film according to claim 2 , wherein the concentration of the thermoplastic resin present as a solid in the particle dispersion is adjusted to 2 to 15 wt % of the dilute solution of the thermoplastic resin claim 2 , to thereby control an interparticle distance of the coated conductive particles to 1 to 6 μm.4. The method of producing an anisotropic conductive film according to claim 1 , wherein the conductive ...

FABRICATION PROCESS FOR FLIP CHIP BUMP BONDS USING NANO-LEDS AND CONDUCTIVE RESIN

A fabrication method achieves bump bonds (to connect two electronic devices) with a pitch of less than 20 μm using UV-curable conductive epoxy resin cured with an array of nano-LEDs. Nano-LEDs are devices with sizes less than or equal to 5 μm, typically arranged in an array. After deposition of the uncured conductive epoxy layer, the nano-LED array enables a fast curing of the bumps with high spatial resolution. Next, the uncured resin is washed off and the chips are assembled, before final thermal curing takes place. 1. A method of fabricating bump bonds to mechanically and electrically connect a first electrical component with a second electrical component , comprising:coating a surface of the first electrical component with a layer of an electrically conductive resin;illuminating the resin layer at selected locations using light emitted by a light emitting diode (LED) device to partially cure the resin at the selected locations;removing uncured resin from the surface of the first electrical component using a solvent to form a plurality of bumps of partially cured resin;assembling the first and second electrical components by placing the second component over the first electrical component on the bumps; andthermally curing the resin to form bumps that mechanically and electrically connect the first and second electrical components.2. The method of claim 1 , wherein the electrically conductive resin includes a dual-cure resin filled with electrically conductive particles at a concentration above the percolation threshold.3. The method of claim 2 , wherein the resin is an epoxy resin.4. The method of claim 2 , wherein the resin is a resin is a mixture containing bisphenol A diglycidyl ether claim 2 , amine or anhydride hardener claim 2 , oligomeric acrylates claim 2 , partially and fully acrylated epoxy oligomer claim 2 , a photoinitiator claim 2 , and an accelerator.5. The method of claim 2 , wherein the electrically conductive particles include silver particles ...

CONNECTION BODY, METHOD FOR MANUFACTURING A CONNECTION BODY, CONNECTING METHOD AND ANISOTROPIC CONDUCTIVE ADHESIVE AGENT

Ensure conduction between an electronic component and a circuit substrate having reduced pitches in wiring of the circuit substrate or electrodes of the electronic component and prevent short circuits between electrode terminals of the electronic component. A connection body including an electronic component connected to a circuit substrate via an anisotropic conductive adhesive agent containing conductive particles; wherein the conductive particles are regularly arranged; and wherein the conductive particles have a particle diameter that is ½ or less than a height of a connecting electrode of the electronic component. 1. A connection body comprising:an electronic component connected onto a circuit substrate via an anisotropic conductive adhesive agent;wherein the anisotropic conductive adhesive agent has conductive particles that are regularly arranged; andwherein the conductive particles have a particle diameter that is ½ or less than a height of a connecting electrode of the electronic component.2. The connection body according to claim 1 , wherein the conductive particles of the anisotropic conductive adhesive agent have a number density from 10 claim 1 ,000 to 60 claim 1 ,000/mm.3. The connection body according to claim 1 , wherein the conductive particles are arranged in a grid pattern.4. A method for manufacturing a connection body comprising:mounting an electronic component onto a circuit substrate via an adhesive agent containing conductive particles; andpressing the electronic component against the circuit substrate and curing the adhesive agent, thereby connecting the electronic component to the circuit substrate;wherein the anisotropic conductive adhesive agent has conductive particles that are regularly arranged; andwherein the conductive particles have a particle diameter that is ½ or less than a height of a connecting electrode of the electronic component.5. A connecting method comprising:mounting an electronic component onto a circuit substrate via ...

Circuit connection method and adhesive film used therefor

도전용 결합제 및 도전접속 구조

내용 없음.

Coated particles

It is an object of the invention to provide coated particles excellent in the reliability of connection. The invention provides coated particles each comprising a metal-surfaced particle as a core and resulting from a partial surface modification of that core particle with an organic compound via a functional group (A) capable of binding to a metal.

Coated particle

본 발명의 목적은 우수한 접속 신뢰성을 갖는 피복 입자를 제공하는 것이다. 상기 피복 입자는 각각 금속으로 만들어진 표면 층을 갖는 핵 입자를 포함하며, 여기서, 핵 표면은 금속에 대해 결합성을 갖는 관능기 (A) 를 통해, 유기 화합물로 부분적으로 개질되었다. An object of the present invention is to provide coated particles having excellent connection reliability. The coated particles comprise nucleus particles each having a surface layer made of a metal, wherein the nucleus surface has been partially modified with an organic compound, via a functional group (A) having a bond to the metal. 피복 입자, 접속 신뢰성 Coated Particles, Connection Reliability

Insulated Conductive Particles and an Anisotropic Conductive Film containing the Particles

본 발명에 따른 절연 전도성 미립자는 기재수지 미립자의 표면에 니켈 층 및 금 층이 순차적으로 도금되어 있고, 최외각에는 가교 유기 미립자 층이 형성되어 있는 것을 특징으로 한다. 또한, 본 발명에 따른 이방전도성 필름은 상기 절연 전도성 미립자를 20,000∼80,000 개/㎟ 함유하는 것을 특징으로 한다. The insulating conductive fine particles according to the present invention are characterized in that a nickel layer and a gold layer are sequentially plated on the surface of the base resin fine particle, and a crosslinked organic fine particle layer is formed at the outermost part. Moreover, the anisotropic conductive film which concerns on this invention is characterized by containing 20,000-80,000 piece / mm <2> of the said insulating conductive fine particles. 절연 전도성 미립자, 도전입자, 이방전도성 필름, LCD 패키지 Insulating conductive fine particles, conductive particles, anisotropic conductive film, LCD package

Coated particle

本发明的目的是提供连接性可靠的涂布颗粒。本发明提供了涂布颗粒，它含有作为核心的有金属表面的颗粒，是用有机化合物通过能够结合于金属的官能团(A)对所述核心颗粒进行部分表面修饰所得的。

Anisotropic conductive adhesive and adhesive film

범프 또는 피치가 작은 IC를 접속하는 경우라도, 쇼트나 회로패턴에의 대미지를 주지 않고, 높은 도통(導通)신뢰성과 높은 절연신뢰성이 얻어지고, 더욱이 저코스트로 용이하게 접속할 수 있는 이방(異方)도전성 접착제를 제공한다. It is possible to obtain a high conduction reliability and a high insulation reliability without damaging a short circuit or a circuit pattern even when an IC having a small bump or pitch is connected and also to provide an anisotropic ) Conductive adhesive. 절연성 접착제(13) 중에 절연피복된 평균 입경(粒徑)이 상이한 도전입자(11,12)가 분산된 이방도전성 접착제이다. 12 are dispersed in the insulating adhesive agent 13 in which insulating-coated average particle diameters are different.

Method for forming conductive circuit

본 발명은 직경 0.8 mm, 높이 0.4 mm의 도트 형상의 인쇄 패턴을 형성한 후, 80 내지 200℃에서 열경화시키고, 인쇄된 형상과 경화 후의 형상을 비교한 경우, 도트 형상의 높이의 변화량이 5％ 이내이며, 용제를 실질적으로 함유하지 않고, 부가형 실리콘 수지 형성용 전구체와 경화 촉매의 조합과, 도전성 입자를 포함하고, 추가로 카본블랙, 아연화, 주석 산화물, 주석-안티몬계 산화물, SiC로부터 선택되는 요변화제를 함유하는 도전성 회로 묘화용 잉크 조성물을 사용하여, 인쇄법에 의해 회로를 형성하는 도전성 회로 형성 방법에 관한 것이다. 본 발명에 따르면, 요변성을 갖는 잉크 조성물에 의해 스크린 인쇄를 비롯한 인쇄 방법에 의해 회로를 묘화할 수 있고, 묘화된 회로는 묘화 후에 경화 공정을 행했을 때에도 형상이 잘 유지되어, 회로 형상의 고도의 제어가 가능하다. In the present invention, when a dot-shaped print pattern having a diameter of 0.8 mm and a height of 0.4 mm is formed and then thermally cured at 80 to 200 ° C to compare the printed shape and the cured shape, %, And is substantially free of a solvent and contains a combination of a precursor for addition-type silicone resin formation and a curing catalyst and conductive particles, and is further selected from carbon black, zinc oxide, tin oxide, tin-antimony oxide and SiC And a method for forming a circuit by a printing method using an ink composition for a conductive circuit containing the crospovidizer. According to the present invention, a circuit can be drawn by a printing method including screen printing by an ink composition having thixotropic property, and the drawn circuit can maintain a shape well even when a curing process is performed after drawing, Can be controlled.

Circuit connecting material, film-like adhesive, adhesive reel, and circuit connecting structural body

本发明提供一种电路连接材料20，其介于一对相对配置的电路电极之间，通过在相对的方向上对一对电路电极进行加压，使一对电路电极电连接，其特征在于，含有粘接剂组合物21和分散在粘接剂组合物21中的填充剂22，填充剂22的含量为1～25体积％。

Multilayer circuit board with traces thicker than the circuit board layer

多层电路板由多层催化层形成，每个催化层在表面以下具有排除深度，其中催化颗粒具有足够的密度以在形成于表面中的通道中提供化学镀沉积物。第一催化层形成有通道，通道被镀有化学镀铜。每个随后的催化层被结合或层压到下面的催化层，形成延伸穿过催化层到达下面的化学镀铜迹线的通道，并且化学镀铜被沉积到通道中以与下面的化学镀铜迹线电连接。以这种方式，可以形成具有大于单个催化层的厚度的厚度的迹线。

Anisotropic conductive material body, display apparatus, method for producing the display apparatus, and conductive member

이방성 도전체는 절연성 매질 및 이 매질에 분산되어 있는 복수의 도전성 부재를 포함한다. 각각의 복수의 도전성 부재의 적어도 표면은 도전성이다. 복수의 도전성 부재 중 적어도 하나에는 적어도 하나의 도전성 부재를 변동시키는 힘이 인가되어, 적어도 하나의 도전성 부재에 의해 제공된 이방성 도전체의 도전 특성이 절연 특성으로 변동된다. The anisotropic conductor includes an insulating medium and a plurality of conductive members dispersed in the medium. At least the surface of each of the plurality of conductive members is conductive. A force for varying the at least one conductive member is applied to at least one of the plurality of conductive members, so that the conductive characteristics of the anisotropic conductor provided by the at least one conductive member are changed to the insulating characteristics. 이방성, 도전체, 매질, 절연성, 도전성, 분산 Anisotropy, Conductor, Medium, Insulation, Conductive, Dispersion

Polymer particle, conductive particle, anisotropic conductive material, and connection structure

The present invention relates to polymer particles capable of enhancing the reliability of conduction when electrically connecting the members to be connected by the conductive particles having the metal layer formed on the surface or the anisotropic conductive material containing the conductive particles, The conductive particles used are provided. A polymer particle obtained by polymerizing a monomer which is an alicyclic compound having at least two ring structures, and a conductive particle having the polymer particle and a metal layer covering the surface of the polymer particle.

Anisotropic conductive film

Anisotropically electroconductive resin film

PURPOSE: Provided are an anisotropically electroconductive resin film adhesive capable of forming electrical connection even in a minute electrode, and an electrode connection structure capable of connecting electric circuits with high precision. CONSTITUTION: The electrode connection structure comprises minute electrodes disposed in the opposite side to multiple electronic components, and an anisotropically electroconductive film material disposed between the minute electrodes. The anisotropically electroconductive film has conductivity only in the direction of thickness through conductive particles dispersed therein so as to permit electric connections between the minute electrodes disposed in the opposite side. The conductive particles are disposed on the same surface.

Coated conductive fine particles, method for producing coated conductive fine particles, anisotropic conductive material, and conductive connection structure

Angular rate sensor having circuit board and package

An angular rate sensor includes: a circuit board; a package including an angular rate sensor chip and a connection terminal; and a conductive member. The angular rate sensor chip is accommodated in the package. The package is disposed on the circuit board through the conductive member. The package further includes a first electrode disposed on a bottom of the package, the first electrode connecting to the connection terminal. The circuit board includes a second electrode disposed on a top of the circuit board. The angular rate sensor chip in the package is electrically connected to the circuit board through the connection terminal, the first and the second electrodes and the conductive member. The circuit board and the package are electrically and elastically connected by the conductive member.

Polymer Particles and Conductive Particles Having Enhanced Conducting Properties and an Anisotropic Conductive Packaging Materials Containing the Same

본 발명은 회로 기판의 실장분야에서 사용되고 있는 이방 전도성 접착 필름에 포함되어 있는 이방 전도성 미립자에 관한 것으로서, 전기적 신뢰성이 우수한 특성을 지닌 전도성 미립자를 제공하는 것을 그 목적으로 한다. 이를 위해 본 발명의 전도성 미립자가 포함된 이방 전도성 접착 필름이 접속 기판간에 개재되어 압축되는 때에 양호한 압축 변형성 및 변형 회복성을 가지는 동시에 접촉면적의 향상을 위해 쉽게 파괴되지 않고 우수한 도전성능을 가지도록 입경이 균일하고 입경분포가 매우 좁은 구상의 고분자 수지 미립자를 제공한다. The present invention relates to anisotropic conductive fine particles contained in an anisotropic conductive adhesive film used in the field of mounting a circuit board, and an object thereof is to provide conductive fine particles having excellent electrical reliability. To this end, when the anisotropic conductive adhesive film containing the conductive fine particles of the present invention is interposed between the connecting substrates and has a good compressive deformability and strain recovery property, the particle size is such that the anisotropically conductive adhesive film is not easily destroyed to improve the contact area and has excellent conductivity. This uniform and very narrow particle size distribution provides spherical polymer resin fine particles. 고분자 수지 미립자, 전도성 미립자, 이방 전도성 필름, K값, 압축 회복률 Polymer resin fine particles, conductive fine particles, anisotropic conductive film, K value, compression recovery rate

Semiconductor device

Conductive particles, anisotropic conductive materials, and connection structures

Anisotropically electroconductive connecting material

(과제) 서로 마주보는 기판들을 이방성 도전접속할 때에, 기판으로서 ITO 전극이 형성된 플라스틱기판을 사용한 경우이더라도, ITO 전극에 크랙(crack)을 발생시키지 않고, 또, 에이징후의 접속신뢰성을 저하시키지 않는 이방성 도전접속재료를 제공한다. (해결수단) 절연성 접착제 중에 도전성입자가 분산되어 이루어지는 이방성 도전접속재료로, 제 1 기판상의 접속단자와 제 2 기판의 접속단자 사이에 배치하여, 열압착처리에 의해 양자의 도전 접속을 확보하면서 접합하기 위한 이방성 도전접속재료에 있어서, 도전성입자로서, 압착온도에서의 그 탄성율이 압착온도에서의 제 1 기판의 탄성율의 200% 이하인 것을 사용한다. 또, 도전성입자로서, 압착온도에서의 그 탄성율이 25℃ 에서의 그 탄성율의 60 ∼ 90% 인 것을 사용하는 것이 보다 바람직하다.

Circuit connection material, and connection structure of circuit member and connection method of circuit member using the circuit connection material

본 발명은 접착제 조성물 (11)과 도전 입자 (12)를 함유하는 회로 접속 재료 (10)으로서, 도전 입자 (12)는 핵체 (21) 상에 1 또는 2 이상의 금속층 (22)를 구비하여 이루어지는, 돌기 (14)를 갖는 도전 입자 (12)이고, 적어도 돌기 (14)의 표면에는 금속층 (22)가 형성되고, 상기 금속층 (22)는 니켈 또는 니켈 합금으로 구성되고, 도전 입자 (12)의 20％ 압축 시의 압축 탄성률은 100 내지 800 kgf/mm 2 인 회로 접속 재료 (10)에 관한 것이다. This invention is the circuit connection material 10 containing the adhesive composition 11 and the electrically-conductive particle 12, Comprising: The electrically-conductive particle 12 is equipped with 1 or 2 or more metal layers 22 on the nucleus 21, A conductive layer 12 having protrusions 14, at least a surface of the protrusions 14 having a metal layer 22 formed thereon, the metal layer 22 being made of nickel or a nickel alloy, and having 20 of conductive particles 12. The compressive elastic modulus at the time of% compression relates to the circuit connection material 10 which is 100-800 kgf / mm < 2> .

Compositions and Methods for Providing Anisotropic Conductive Paths and Bonds Between Two Sets of Conductors

본 발명은 (i) 비-자성 담체 액체에서 강자성 입자의 콜로이드성 현탁액(4)으로 이루어진 강자성유체와 (ii) 실질적으로 균일한 크기와 모양을 갖는 강자성유체에서 분산되어 있는 다수와 전기-전도성 입자(5)로 구성된 조성물(3)을 제공한다. 실질적으로 비-자성 전기-전도성 입자(5)의 다양한 유형이 기술되어 있다. 자석수단(8) 에 의해 조성물(3) 로의 실질적으로 균일한 자기장의 인가는 전기- 전도성 입자(5) 가 규칙적인 패턴(9) 을 형성하게 한다. 조성물은 전자산업에서 두 세트의 전도체(2a,2b;7a,7b)사이에서 이방성 전도성 경로(9a,9b)의 제공을 위해 이용된다. 조성물은 전도체를 결합시키는 경화성 접착제 조성물일 수도 있다. 또한 게다가 전기-전도성 입자는 잠재적인 접착제 특성을 가질 수 있는데 예를 들면 입자는 땜납 입자일 수 있다. 강자성유체는 액체 모노머에서 강자성 입자의 콜로이드성 현탁액일 수 있다. The present invention relates to a plurality of electroconductive particles dispersed in (i) a ferromagnetic fluid consisting of a colloidal suspension of ferromagnetic particles (4) in a non-magnetic carrier liquid and (ii) a ferromagnetic fluid having a substantially uniform size and shape. The composition (3) consisting of (5) is provided. Substantially various types of non-magnetic electro-conductive particles 5 are described. The application of a substantially uniform magnetic field to the composition 3 by the magnet means 8 causes the electrically-conductive particles 5 to form a regular pattern 9. The composition is used in the electronics industry to provide anisotropic conductive paths 9a, 9b between two sets of conductors 2a, 2b; 7a, 7b. The composition may be a curable adhesive composition that bonds the conductors. In addition, the electrically-conductive particles may also have potential adhesive properties, for example the particles may be solder particles. The ferromagnetic fluid may be a colloidal suspension of ferromagnetic particles in a liquid monomer.

The manufacture method of the synthetic resin of thermoplastic resin composition, synthetic resin and band coating

本发明提供具有高耐焊接热性能、镀覆特性(镀覆外观)优异、且进行熟化处理后反射率也高的热塑性树脂组合物。一种热塑性树脂组合物，其中，相对于(A)通过差示扫描量热测定(DSC)以10℃/分钟的升温速度测定的熔点为250℃以上的结晶性热塑性树脂100重量份，包含(B)玻璃填料10～80重量份、(C)波长450nm下的反射率为25%以上的激光直接成型添加剂1～30重量份、以及(D)氧化钛20～150重量份。

Multi-layered flexible print circuit board and manufacturing method thereof

A multi-layered flexible print circuit board comprising an insulating layer, a circuit layer formed on the front and back surfaces of the insulating layer and a hole connecting between the circuit layers via the insulating layer, wherein there is provided an electrically-conductive member having a metal layer formed thereon at least on the surface thereof which is press-fitted into the hole to electrically conduct the circuit layer.

Electrically conductive pressure sensitive adhesive tape

없음 none

Anisotropically electroconductive connecting material

(과제) (assignment) 서로 마주보는 기판들을 이방성 도전접속할 때에, 기판으로서 ITO 전극이 형성된 플라스틱기판을 사용한 경우이더라도, ITO 전극에 크랙(crack)을 발생시키지 않고, 또, 에이징후의 접속신뢰성을 저하시키지 않는 이방성 도전접속재료를 제공한다. When anisotropic conductive connections between substrates facing each other are used, even if a plastic substrate having an ITO electrode is used as the substrate, an anisotropic conductive connection material which does not cause cracks in the ITO electrode and does not degrade connection reliability after aging to provide. (해결수단) (Solution) 절연성 접착제 중에 분산된 도전성 입자를 포함하는 이방성 도전접속재료로, 제 1 기판상의 접속단자와 제 2 기판의 접속단자 사이에 배치하여, 열압착처리에 의해 양자의 도전 접속을 확보하면서 접합하기 위한 이방성 도전접속재료에 있어서, 도전성 입자로서, 압착온도에서의 그 탄성율이 압착온도에서의 제 1 기판의 탄성율의 200% 이하인 것을 사용한다. 또, 도전성 입자로서, 압착온도에서의 그 탄성율이 25℃ 에서의 그 탄성율의 60 ∼ 90% 인 것을 사용하는 것이 보다 바람직하다. An anisotropic conductive connecting material comprising conductive particles dispersed in an insulating adhesive, disposed between the connecting terminal on the first substrate and the connecting terminal of the second substrate, and anisotropic for bonding while securing both conductive connections by thermocompression bonding. In the electrically conductive connecting material, as the conductive particles, those whose elastic modulus at the crimping temperature are 200% or less of the elastic modulus of the first substrate at the crimping temperature are used. Moreover, as electroconductive particle, it is more preferable to use the thing whose elasticity modulus at crimping temperature is 60 to 90% of the elasticity modulus at 25 degreeC.

Thermoplastic resin composition, resin molding product, and method for producing resin molding product having plating layer

Provided is a thermoplastic resin composition having high solder heat resistance, excellent plating properties (plating appearance), and, even after aging treatment, a high reflectivity. A thermoplastic resin composition comprising: 10-80 parts by weight of a glass filler (B), 1-30 parts by weight of a laser direct structuring additive (C) having 25% or higher reflectivity at a wavelength of 450 nm, and 20-150 parts by weight of titanium oxide (D), in relation to 100 parts by weight of a crystalline thermoplastic resin (A) having a melting point 250°C or higher as measured by differential scanning calorimetry (DSC) with a heating rate of 10°C/min.

Electrically conductive microparticle, anisotropic electrically conductive material, connection structure, and method for production of electrically conductive microparticle

本发明的目的在于提供一种导电性微粒，该导电性微粒初始连接电阻低、并且即使长期保存连接电阻也难以上升。本发明涉及一种导电性微粒，其中，在树脂微粒的表面形成有铜层，所述铜层厚度方向的截面中的相当于空隙的区域的面积比为5％以下，并且构成所述铜层的铜的微晶平均粒径为40nm以上。

Method for producing conductive fine particles

Anisotropically electroconductive connecting material

An anisotropically electroconductive connecting material, which is disposed between a connection terminal on a first substrate and a connection terminal on a second substrate and joins the substrates together by thermocompression bonding while maintaining electroconductive connection therebetween, includes electroconductive particles dispersed in an insulating adhesive, wherein the modulus of elasticity of the electroconductive particles at the compression bonding temperature is 200% or less of the modulus of elasticity of the first substrate at the compression bonding temperature.

Polymer particles, conductive particles, and an anisotropic conductive packaging materials containing the same

本发明公开了一种包含在用于电路板安装领域中的各向异性导电粘结膜中的各向异性导电颗粒。该导电颗粒具有均匀的形状、窄的颗粒直径分布、以及合适的压缩变形性与变形回复性。此外，当插置并挤压于连接基板之间时，该导电颗粒显示了增强的导电性能而不破裂，由此获得颗粒与连接基板之间足够的接触面积。本发明还公开了一种用于导电颗粒中的聚合物基颗粒。

Conductive particle having a density-gradient in the complex plating layer and Preparation of the same and Conductive adhesives using the same

본 발명은 전기적 접속 부재로 사용되고 있는 이방 전도성 미립자 및 그 제조 방법에 관한 것으로서, 전기적 신뢰성이 우수한 특성을 지닌 전도성 미립자를 제조하는 것을 그 목적으로 한다. 이를 위해 본 발명은 고분자 중합체 수지 미립자를 기재로 하고, 그 기재 표면에 실질적으로 연속적인 농도 구배를 갖는 니켈(Ni)과 금(Au)의 서로 다른 금속 피복층을 갖는 것을 특징으로 하는 전도성 미립자를 제조하는 방법을 제공한다. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to anisotropically conductive fine particles used as an electrical connection member and a method for producing the same, and to manufacturing conductive fine particles having excellent electrical reliability. To this end, the present invention provides a conductive fine particle, which is based on a polymer polymer resin fine particle and has a different metal coating layer of nickel (Ni) and gold (Au) having a substantially continuous concentration gradient on the surface of the substrate. Provide a way to. 이방 전도성 접착제, 미립자, 전기 접속, 농도 구배, 무전해 도금 Anisotropic Conductive Adhesive, Fine Particles, Electrical Connections, Concentration Gradients, Electroless Plating

Electroconductive particles and anisotropic electroconductive material using the same

本发明提供了一种能够大幅度简化以往的导电性金属层附着工序、并且能够将导电层均匀地包覆在基材粒子的表面、基材粒子与导电性金属层的粘附性良好、导电性金属层的裂纹等缺陷极少的导电性微粒、以及使用了该导电性微粒的各向异性导电材料。所述导电性微粒具有基材粒子、和包覆基材粒子的表面的导电性金属层，所述基材粒子为通过X射线光电子光谱分析(ESCA)测定的钠吸附处理后的基材粒子的M/C(原子数比、M表示碱金属元素的原子数和氮元素的原子数的合计)为0.5×10 -2 以上、疏水度为不足2％、并且、质量平均粒子直径为1000μm以下的含有乙烯系聚合物的基材粒子，该导电性微粒通过利用化学镀法在上述基材粒子的表面上形成导电性金属层而得到。

Method for forming BGA package with increased standoff height

A method of forming a Ball Grid Array (BGA) package having an increased standoff height after solder reflow is described. A substrate containing a plurality of first solder bond pads and a component containing a plurality of second solder bond pads are arranged in parallel spaced relationship to form an arrangement, each first and second bond pad being in contact with a solder ball therebetween. Solder balls are formed of a core, which remains solid at solder reflow temperatures, encapsulated with a reflowable solder layer. First standoff height of the arrangement is largely determined by the diameter of the solder ball. Upon heating to solder reflow temperatures, the solder coalesces between the core and the bond pads. Upon cooling of the arrangement, the second standoff height of the BGA package is greater than the first standoff height of the arrangement.

Polymer particles, conductive particles and an anisotropic conductive packaging materials containing the same

Functional stiffener that enables land grid array interconnections and power decoupling

An exemplary assembly includes a top circuit substrate; a bottom circuit assembly that underlays the top circuit substrate and is attached to the top circuit substrate by an adhesive layer as a stiffener, the adhesive layer, and a plurality of conductive balls. The top circuit substrate includes a plurality of upper vias that extend through the top circuit substrate. The bottom circuit assembly includes a plurality of lower vias that extend through the bottom circuit assembly. The adhesive layer includes internal connections that electrically connect the upper vias to the lower vias. The conductive balls are housed in the lower vias. The bottom circuit assembly has an elastic modulus at least six times the elastic modulus of the top circuit substrate, and has a coefficient of thermal expansion at least two times the coefficient of thermal expansion of the top circuit substrate.

Multilayer circuit boards with traces thicker than the circuit board layers

다층 회로 기판은 촉매 층의 여러 층으로 형성되고, 각 촉매 층은 표면 아래에 배제 깊이를 가지며, 촉매 입자들 표면에 형성된 채널들에 무전해 퇴적을 제공하기에 충분한 밀도로 되어 있다. 제1 촉매 층에는 무전해 구리 도금된 채널들이 형성되어 있다. 각 후속 촉매 층은 아래의 촉매 층에 접착 또는 라미네이트된 촉매 층을 통해서 아래의 무전해 구리 트레이스까지 연장 채널이 형성되고, 무전해 구리가 채널에 퇴적되어 아래에 있는 무전해 구리 트레이스와 전기적으로 접속한다. 이렇게 하여 단일 촉매 층의 두께보다 두꺼운 두께를 갖는 트레이스를 형성할 수 있다.

Conductive paste and method of manufacturing printed circuit board using the same

本发明提供了一种导电胶，其包括：导电粉粒，包括聚合物粉末和顺次设置在聚合物粉末的表面上并具有不同熔点的第一低熔点金属和第二低熔点金属；以及混合在导电粉粒中的粘合剂。并且，本发明还提供了一种使用该导电胶来制造印刷电路板的方法。

Conductive fine particles, method for plating fine particles, and substrate structural body

This invention provides a conductive fine particle having an ability of relaxing the force applied to a circuit of a substrate or the like. A conductive fine particle, comprising a core fine particle made of resin with its surface covered with at least one metal layer, wherein the resin has a coefficient of linear expansion of from 3×10 −5 to 7×10 −5 (1/K).

Fixed-array anisotropic conductive film using conductive particles with block copolymer coating

将ACF阵列和更特别地非随机颗粒的结构和制造工艺转移到预定构造、形状和尺寸的微腔阵列上。该制造工艺包括在含微腔的预定阵列的基底或载网上流体填充用嵌段共聚物组合物表面处理的导电颗粒。然后用粘合剂膜罩面涂布或层压如此制备的填充导电微腔阵列。

Conductive particles, anisotropic conductive materials, and connection structures

金属層が表面に形成された導電性粒子又は該導電性粒子を含有している異方性導電材料により、接続対象部材を電気的に接続した場合に、導電信頼性を高めることができる重合体粒子、並びに該重合体粒子を用いた導電性粒子を提供する。少なくとも２つの環構造を有する脂環式化合物であるモノマーを重合させることにより得られた重合体粒子、並びに、この重合体粒子と、該重合体粒子の表面を被覆している金属層とを有する導電性粒子５。 A polymer that can increase the conductive reliability when a member to be connected is electrically connected by a conductive particle having a metal layer formed on its surface or an anisotropic conductive material containing the conductive particle. Provided are particles and conductive particles using the polymer particles. Polymer particles obtained by polymerizing a monomer which is an alicyclic compound having at least two ring structures, and the polymer particles and a metal layer covering the surface of the polymer particles Conductive particles 5.

THERMOPLASTIC AND THERMOACTIVABLE, ELECTROCONDUCTIVE ADHESIVE SHEET.

Lámina adhesiva conductora, termoactivable para implantar móculos eléctricos en tarjetas que contiene un polímero termoplástico, un adhesivo, una resina epoxi, partículas metalizadas y partículas espaciadoras duras con un alto punto de fusión. Lámina adhesiva electroconductora, termoactivable a base de polímero termoplástico, resina adhesiva, resina epoxi y partículas metalizadas, contiene también partículas espaciadoras no deformables que no se funden a al temperatura de enlace de la lámina. Lámina adhesiva electroconductora, termoplástica, termoactivable que contiene: (i) al menos un 30% en peso de polímero termoplástico, (ii) de 5 a 50% en peso de resina(s) adhesiva(s), (iii) de 5 a 40% en peso de resinas epoxi con endurecedores y opcionalmente también aceleradores, (iv) de 0,1 a 40% en peso de partículas metalizadas y (v) de 1 a 10% en peso de partículas espaciadoras que no se deforman o lo hacen solo con dificultad y que no se funden a la temperatura de enlace de la lámina. Conductive, heat-activatable adhesive sheet for implanting electric modules on cards containing a thermoplastic polymer, an adhesive, an epoxy resin, metallized particles and hard spacer particles with a high melting point. Electroconductive adhesive sheet, thermo-activatable based on thermoplastic polymer, adhesive resin, epoxy resin and metallized particles, also contains non-deformable spacer particles that do not melt at the bonding temperature of the sheet. Electroconductive, thermoplastic, thermo-activatable adhesive sheet containing: (i) at least 30% by weight of thermoplastic polymer, (ii) from 5 to 50% by weight of adhesive resin (s), (iii) from 5 to 40% by weight of epoxy resins with hardeners and optionally also accelerators, (iv) from 0.1 to 40% by weight of metallic particles and (v) from 1 to 10% by weight of spacer particles that do not deform or do so only with difficulty and that they do not melt at the bonding temperature of the sheet.

Conductive fine particles, anisotropic conductive material, and conductive connection structure

Circuit-connecting material, and connection structure for circuit member

本发明提供一种电路连接材料和电路部件的连接结构，该电路连接材料是用于电连接形成有电路电极的2个电路部件以使得前述2个电路部件的前述电路电极相对置的电路连接材料，其中，前述电路连接材料含有粘合剂组合物和导电粒子，前述导电粒子是包含有机高分子化合物的核体被含镍或镍合金的金属层覆盖、并且在表面上具有多个突起部分的导电粒子，前述核体的平均粒径为1～4μm，前述金属层的厚度为65～125nm，前述电路连接材料用于对前述电路电极的厚度为50nm以上的电路部件进行连接。

Anisotropic conductive film and method for producing same

본 발명의 이방성 도전 필름(100)은, 절연성 결합제층(1)에 도전 입자(2)가 분산 혹은 규칙적 패턴으로 배열되어 있는 구조를 갖는다. 이방성 도전 필름(100)의 편면의 일부에는 절연성 결합제층(1)보다 밀착 강도가 낮은 저밀착성 영역(3)이 형성되어 있다. 저밀착성 영역(3)은, 절연성 결합제층(1)에 형성된 오목부(10)에 저밀착성 수지가 충전되어 있는 영역이다. The anisotropic conductive film 100 of the present invention has a structure in which the conductive particles 2 are dispersed or arranged in a regular pattern in the insulating binder layer 1 . A low-adhesion region 3 having a lower adhesive strength than that of the insulating binder layer 1 is formed on a portion of one side of the anisotropic conductive film 100 . The low-adhesion region 3 is a region in which the concave portion 10 formed in the insulating binder layer 1 is filled with a low-adhesion resin.

Conductive particles and anisotropic conductive film containing the same

An electroconductive particle that includes (a) a polymer microparticle, and (b) a graphene coating layer grafted on the polymer microparticle, which has improved long-term stability of the conductivity, surface conductivity, durability, and thermal resistance, and is applicable for producing an anisotropic conductive film used for packaging electronic devices.

Conductive fine particles, method for plating fine particles, and substrate structural body

Conductive fine particles having an ability of relaxing the force exerted on a circuit of, e.g., a substrate and a method for retaining the constant distance between substrates are disclosed. The conductive fine particles are composed of basic fine particles of resin each covered with one or more metallic layers. The coefficient of linear expansion of the resin is 3 X 10-5 to 7 X 10-5 (1/K).

Anisotropic conductive film and method for producing same

본 발명의 이방성 도전 필름(100)은, 절연성 결합제층(1)에 도전 입자(2)가 분산 혹은 규칙적 패턴으로 배열되어 있는 구조를 갖는다. 이방성 도전 필름(100)의 편면의 일부에는 절연성 결합제층(1)보다 밀착 강도가 낮은 저밀착성 영역(3)이 형성되어 있다. 저밀착성 영역(3)은, 절연성 결합제층(1)에 형성된 오목부(10)에 저밀착성 수지가 충전되어 있는 영역이다.

Wiring board and production method of wiring board

A wiring board comprises a substrate; a resin layer which is selectively formed on one main surface of the substrate and has fine metal particles contained or adhered to its surface; and a conductive metal layer which is formed on the resin layer with the fine metal particles interposed between them.

Insulated Conductive Particles and an Anisotropic Conductive film Containing the Particles

본 발명에 따른 절연 전도성 미립자는 평균입경 1∼10 ㎛ 크기의 기재수지 미립자(41)의 표면에 0.01∼0.1 ㎛ 두께의 니켈 층(42) 및 0.03∼0.3 ㎛ 두께의 금 층(43)이 순차적으로 도금되어 있고, 상기 금 층 표면에 0.05∼1 ㎛ 두께의 무기절연층(44, 45)이 연속적 또는 불연속적으로 피복된 것을 특징으로 한다. 또한, 본 발명에 따른 이방전도성 필름은 상기 절연 전도성 미립자를 10,000∼80,000 개/㎟ 함유하는 것을 특징으로 한다. Insulating conductive fine particles according to the present invention is a nickel layer 42 having a thickness of 0.01 to 0.1 ㎛ and a gold layer 43 having a thickness of 0.03 to 0.3 ㎛ are sequentially formed on the surface of the base resin particles 41 having an average particle diameter of 1 to 10 µm. Plated on the surface of the gold layer, and the inorganic insulating layers 44 and 45 having a thickness of 0.05 to 1 μm are continuously or discontinuously coated. In addition, the anisotropic conductive film according to the present invention is characterized by containing 10,000 to 80,000 pieces / mm 2 of the above insulating conductive fine particles. 절연 전도성 미립자, 무기 절연층, 이방 전도성 필름 Insulating conductive fine particles, inorganic insulating layer, anisotropic conductive film

Coated conductive powder and conductive adhesive using the same

The present invention provides a coated conductive powder in which the aggregation of conductive particles is suppressed and which is also excellent in electrical reliability, and a conductive adhesive using the same that can provide connection with high electrical reliability even for the connection of the electrodes of miniaturized electronic parts, such as IC chips, and circuit boards. The coated conductive powder of the present invention is a coated conductive powder obtained by coating the surfaces of conductive particles with insulating inorganic fine particles, wherein the volume resistivity value of the coated conductive powder is 1 Ω·cm or less, the specific gravity of the insulating inorganic fine particles is 5.0 g/ml or less, the particle diameter ratio of the insulating inorganic fine particles to the conductive particles (the insulating inorganic fine particles/the conductive particles) is 1/100 or less, and the insulating inorganic fine particles adhere to the surfaces of the conductive particles.

Conductive compositions containing blended alloy fillers

The present invention provides electrically and thermally conductive compositions for forming interconnections between electronic elements. Invention compositions comprise three or more metal or metal alloy particle types and an organic vehicle comprising a flux that is application specific. The first particle type includes a reactive high melting point metal that reacts with a reactive low melting point metal(s) in the other particles to form intermetallic species. The reactive low melting point metal(s) of the invention are provided in two distinct particle forms. The first reactive low melting point metal particle includes a carrier that facilitates the reaction with the reactive high melting point metal. The second reactive low melting point metal particle acts primarily as a source of the reactive low melting point metal. Combination of the three particle types provides several advantages including reduction of the undesireable characteristics of the carrier metal while preserving and, in some embodiments, enhancing, the advantageous facilitation of the metallic reaction.

Component-carrying structure

A component-carrying structure includes: a first object having a plurality of first electrodes; a second object having a plurality of second electrodes, the second object being an electronic component; connection portions for connecting the plurality of first electrodes to the plurality of corresponding second electrodes, respectively; and resin reinforcement portions. The connection portions include a core that includes at least one of a first metal and a resin particle, and an inter-metal compound layer of the first metal and a second metal having a low melting point. The resin reinforcement portions include granular substances that include the core and the inter-metal compound, at parts other than the gaps between the first electrodes and the second electrodes. The granular substance content of the parts is 0.1 to 10 volume%.

Conductive particles comprising complex metal layer with density gradient, method for preparing the particles, and anisotropic conductive adhesive composition comprising the particles

公开了具有优异的电可靠性、可用作电连接结构用材料的各向异性导电颗粒。还公开了一种制备导电颗粒的方法，所述导电颗粒含有聚合物树脂基体颗粒和在基体颗粒表面上形成的导电复合金属镀层，其中，所述导电复合金属镀层具有实质上连续的密度梯度，且由镍(Ni)和金(Au)组成。

Electronic System and Processor Substrate Having an Embedded Power Device Module

A processor substrate includes: an electrically insulating material having a first main side and a second main side opposite the first main side; a plurality of electrically conductive structures embedded in the electrically insulating material and configured to provide an electrical interface for a processor at the first main side of the electrically insulating material and to provide electrical connections from the electrical interface to the second main side of the electrically insulating material; and a power device module embedded in the electrically insulating material and configured to convert a voltage provided at the second main side of the electrically insulating material and which exceeds a voltage limit of the processor substrate to a voltage that is within an operating range of the processor and below the voltage limit of the processor substrate. An electronic system that includes the processor substrate is also described.

Electroconductive fine particles,anisotropic electroconductive material,and connection structure

본 발명은, 접속 저항값을 저감시킬 수 있고, 높은 접속 신뢰성을 실현할 수가 있는, 도전성 미립자를 제공하는 것을 목적으로 한다. 또, 본 발명은, 그 도전성 미립자를 사용하여 이루어지는 이방성 도전 재료 및 접속 구조체를 제공하는 것을 목적으로 한다. An object of the present invention is to provide conductive fine particles capable of reducing the connection resistance value and achieving high connection reliability. It is another object of the present invention to provide an anisotropic conductive material and a connection structure using the conductive fine particles. 본 발명은, 수지 미립자의 표면에 니켈 또는 팔라듐을 함유하는 금속층과, 저융점 금속과 탈륨, 인듐 및 갈륨으로 이루어지는 군에서 선택되는 적어도 1 종의 제 13 족 원소를 함유하는 저융점 금속층이 순차적으로 적층되어 있는 도전성 미립자로서, 상기 저융점 금속층 중에 함유되는 금속의 합계에서 차지하는 상기 제 13 족 원소의 함유량은 0.01 ∼ 6 중량% 인 도전성 미립자이다. The present invention is characterized in that a metal layer containing nickel or palladium on the surface of resin fine particles and a low melting point metal layer containing a low melting point metal and at least one kind of Group 13 element selected from the group consisting of thallium, indium and gallium are sequentially And the content of the Group 13 element in the total of the metals contained in the low melting point metal layer is 0.01 to 6% by weight. 도전성 미립자, 이방성 도전 재료 Conductive fine particles, anisotropic conductive material

Anisotropic conductive adhesive compositions

An anisotropic conductive adhesive composition comprising an insulating adhesive component and particles dispersed in said insulating adhesive component, said anisotropic conductive adhesive composition being characterized in that said insulating adhesive component comprises a copolymer of acrylic ester having an alkyl group of 1-4 carbon atoms and a maleimide derivative, 5 to 60 parts by weight, based on 100 parts by weight of the copolymer, of a thermosetting resin, and 0.05 to 5.0 parts by weight, based on 100 parts by weight of the copolymer, of a coupling agent, and said particles are metallic-layer containing particles comprising a core made of resin, a metallic layer covering said core and a resin layer formed from finely divided resin fixed by the dry blending method on the surface of said metallic layer.

Conductive particle, anisotropic conductive film, joined body, and connecting method

고경도를 유지한 채 연전성을 향상시켜 응력을 억제할 수 있고(접속시에 찌부러진 상태에서도 크랙이 잘 생기지 않고), ITO 기판뿐만 아니라, IZO 기판에 대해서도 충분한 도통 신뢰성을 확보할 수 있는 도전성 입자, 상기 도전성 입자를 구비하는 이방성 도전 필름, 상기 이방성 도전 필름을 구비하는 접합체, 및 상기 이방성 도전 필름을 이용한 접속 방법을 제공하는 것을 목적으로 한다. 본 발명의 도전성 입자는, 고분자 미립자와, 상기 고분자 미립자의 표면에 형성된 도전층을 구비하는 도전성 입자로서, 상기 도전층의 최외각이 니켈-팔라듐 합금층인 것을 특징으로 한다. It is possible to suppress the stress by maintaining the high hardness while improving the elongation property (cracks are not easily generated even in the crushed state at the time of connection), and it is possible to obtain a sufficient conductivity for the IZO substrate Particles, an anisotropic conductive film having the conductive particles, a junction body including the anisotropic conductive film, and a connection method using the anisotropic conductive film. The conductive particles of the present invention are characterized by comprising polymer particles and a conductive layer formed on the surface of the polymer particles, wherein the outermost layer of the conductive layer is a nickel-palladium alloy layer.

Conductive fine particles and substrate structure

Anisotropic conductive connection material

Plasma display device

본 발명은 플라즈마 디스플레이 패널의 구동 전극에 전압을 인가할 수 있는 FPC의 연결 구조를 개선한 플라즈마 디스플레이 장치에 관한 것이다. The present invention relates to a plasma display device having an improved connection structure of an FPC capable of applying a voltage to a driving electrode of a plasma display panel. 본 발명에 따른 플라즈마 디스플레이 장치는, 플라즈마 디스플레이 패널; 상기 플라즈마 디스플레이 패널을 구동하기 위한 구동 회로부; 상기 플라즈마 디스플레이 패널의 전극과 상기 구동 회로부를 전기적으로 연결하는 FPC(Flexible Printed Circuit); 상기 플라즈마 디스플레이 패널의 구동 전극과 구동 회로부에 연결되어 상기 FPC를 통해 구동 회로부로부터 제어되는 신호에 따라 플라즈마 디스플레이 패널의 구동 전극에 선택적으로 전압을 인가하는 드라이버 IC(Integrated Circuit); 및 상기 FPC에 위치하는 연결단자와 상기 구동 전극을 전기적으로 결합하는 이방성 도전막(ACF: Anistropic Conductive Film)을 포함하며, 상기 이방성 도전막은 연결단자와 구동 전극 사이의 영역에서 이들을 전기적으로 접속하는 도전 입자와 나머지 영역에 분포하는 도전 입자를 절연하기 위한 절연부재를 구비한다. Plasma display device according to the invention, the plasma display panel; A driving circuit unit for driving the plasma display panel; A flexible printed circuit (FPC) electrically connecting the electrode of the plasma display panel and the driving circuit unit; A driver IC connected to the driving electrode and the driving circuit of the plasma display panel and selectively applying a voltage to the driving electrode of the plasma display panel according to a signal controlled from the driving circuit through the FPC; And an anisotropic conductive film (ACF) that electrically couples the connection terminal and the driving electrode positioned in the FPC, wherein the anisotropic conductive film electrically connects them in a region between the connection terminal and the driving electrode. An insulating member for insulating the particles and the conductive particles distributed in the remaining area is provided. 플라즈마 디스플레이 패널, 구동 전극, TCP, 구동 회로부, 드라이버 IC, 이방성 도전막(ACF), 비도전막(NCF), 전도 입자, 절연막, 비전도 입자, 돌기부, 연결단자, 연결배선, 쇼트 Plasma display panel, driving electrode, TCP, driving circuit, driver IC, anisotropic conductive film (ACF), non-conductive film (NCF), conductive particles, insulating film, non-conductive particles, protrusions, ...

Electronic device

電子裝置包含柔性基板、異方性導電膠以及電子元件。柔性基板包含主動區、接合墊以及位在接合墊上的複數個突出物。異方性導電膠包含複數個導電粒子，其中導電粒子接觸突出物。異方性導電膠位在柔性基板的接合墊與電子元件之間。

Anisotropic conductive adhesive and film

Coated fine particles, method for producing the same, and conductive fine particles

Anisotropic conductive film, bonding structure, and display panel and preparation method thereof

本发明提供一种各向异性导电胶(Anisotropic？Conductive？Film，ACF)，一种绑定(Bonding)结构，一种显示面板及其制备方法。本发明的各向异性导电胶，包括树脂凝胶和多个导电粒子，其中，所述多个导电粒子分布于所述树脂凝胶中，并可在电场诱导下相互对齐和连接，以在所述树脂凝胶中形成电导通路径。

Process for connecting circuits and adhesive film used therefor

An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards under heat and pressure.

Anisotropic conductive film, process for producing anisotropic conductive film, connecting method, and bonded object

各向异性导电膜，其使基板的端子和电子零件的端子各向异性导电连接，含有导电性粒子，所述导电性粒子为树脂粒子的表面依次设有金属镀敷层及绝缘层的导电性粒子以及金属粒子的表面设有绝缘层的导电性粒子中的至少一种，所述导电性粒子是以平均3.0个～10.0个连结。

Electroconductive microparticles, anisotropic electroconductive material, and electroconductive connection structure

본 발명은, 낙하 등에 의한 충격이 가해져도 전극과 그 도전성 미립자의 접속 계면의 파괴에 의한 단선이 잘 발생하지 않고, 가열과 냉각을 반복해서 받아도 잘 피로되지 않는 도전성 미립자, 그 도전성 미립자를 사용하여 이루어지는 이방성 도전 재료 및 도전 접속 구조체를 제공하는 것을 목적으로 한다. 본 발명은, 수지 또는 금속으로 이루어지는 코어 입자의 표면에 적어도 도전 금속층, 배리어층, 구리층 및 주석을 함유하는 땜납층이 이 순서로 적층된 도전성 미립자로서, 상기 구리층과 땜납층이 직접 접하고 있고, 상기 땜납층 중에 함유되는 주석에 대한 상기 땜납층에 직접 접하는 구리층에 있어서의 구리의 비율이 0.5 ∼ 5 중량％ 인 도전성 미립자이다. Disclosed is a conductive fine particle which does not generate disconnection due to breakage of the connection interface between the electrode and the conductive fine particle and does not cause fatigue even after repeated heating and cooling even if an impact due to dropping or the like is applied, And an object of the present invention is to provide an anisotropic conductive material and a conductive connecting structure. The present invention is a conductive fine particle in which at least a conductive metal layer, a barrier layer, a copper layer, and a solder layer containing tin are stacked in this order on the surface of a core particle made of resin or metal, wherein the copper layer and the solder layer are in direct contact with each other , And the proportion of copper in the copper layer directly contacting the solder layer with respect to tin contained in the solder layer is 0.5 to 5 wt%.

Conductive particles, conducting material, and connection structure

Provided are conductive particles capable of lowering the connection resistance when electrodes are electrically connected therebetween. Each conductive particle (1) is provided with a base particle (2), and a conducting portion (3) disposed on the surface of the base particle (2), the conducting portion (3) having a plurality of protrusions (3a) on the external surface, the conducting portion (3) having a crystal structure, and the crystal structure being continuous between a portion where the protrusion (3a) is present and a portion where the protrusion (3a) is not present in the conducting portion (3).

Printed circuit board laminating structure and laminating method

本发明提供了一种印制线路板压合结构,包括两块电路板，通过压合的方式使两块电路板上的金手指部位相接，所述金手指之间分布有导电粒子和树脂黏着剂组成的导电胶，通过对导电胶加压、加热，使导电粒子在相互有金手指的位置破裂，挤压在一起，形成导通，而无金手指的位置导电粒子不破裂，不形成导通。该印制线路板压合结构降低因为增加连接器而增加的成本，降低结构设计难度和降低了软硬结合板方式而增加的成本。

Connection method for circuits and adhesive film therefor.

Anisotropic Conductive Resin Film

전도성 입자를 담지체상에 형성된 접착층에 접착시키고 고정시키고, 접착물질과 비혼화성인 필름-형성 수지를 전도성 입자간에 충진시킴으로써 제조된 이방 전도성 수지 필름 물질은, 면방향에 균일하게 분산된 전도성 입자를 통해 필름 두께 방향으로만 전도성을 가지며, 반대 위치회로 및 다수 전기 부품의 미세 전극을 전기 접속하고 전기 부품을 시험하는 데 적합하다. The anisotropic conductive resin film material prepared by adhering and fixing the conductive particles to the adhesive layer formed on the carrier, and filling the conductive particles with the film-forming resin which is immiscible with the adhesive material, provides the conductive particles uniformly dispersed in the plane direction. It is conductive only in the direction of film thickness, and is suitable for electrically connecting and testing the electrical components of the counter-position circuit and the fine electrodes of many electrical components.

Plastic conductive particles and manufacturing method thereof

This invention relates to plastic conductive particles having an outer diameter of 2.5 μm~l mm obtained by sequentially plating a 0.1-10 W thick a metal plating layer and a 1-100 W thick Pb solder layer or a Pb-free solder layer on plastic core beads having a high elastic modulus of compression, and to a method of manufacturing thereof . The method of manufacturing the plastic conductive particles according to this invention includes preparing plastic core beads having excellent thermal properties and a high elastic modulus of compression, etching surfaces of the plastic core beads for surface treatment thereof, forming a metal plating layer via electroless plating to improve adhesion between the bead surface and the metal plating layer, and then forming a solder layer in a manner such that a sealed hexagonal barrel is immersed in an electroplating solution and then an electroplating process is conducted using a mesh barrel rotating 360 °at 6~10 rpm or a mesh barrel having a structure in which one surface of a conventional sealed hexagonal barrel is open, and rotating 200° in right and left directions at 1~5 rpm, to manufacture plastic conductive particles having a size of 1 mm or less. The plastic conductive particles of this invention enable the maintenance of packaging gaps, and thus can be applied to IC packaging, LCD packaging and other conductive materials.

Breakable interconnects and structures formed thereby

Methods of forming a microelectronic structure are described. Embodiments of those methods include placing an anisotropic conductive layer comprising at least one compliant conductive sphere on at least one interconnect structure disposed on a first substrate, applying pressure to contact the compliant conductive spheres to the at least one interconnect structure, removing a portion of the anisotropic conductive layer to expose at least one of the compliant conductive spheres; and then attaching a second substrate to the anisotropic conductive layer.

Connecting material for anisotropically electroconductive connection

A connecting material for anisotropically electroconductive connection for bonding and connecting a semiconductor element having a plurality of electrodes disposed recedingly from the outer face of the passivation layer formed on the semiconductor element, on the one hand, with a substrate circuit board having a plurality of electrodes in a correspondingly confronted relation to the electrodes of the semiconductor element, on the other hand, which connecting material can afford to attain simultaneously a reliable mechnical bonding of the element with the circuit board and a secured electroconductive connection between the correspondingly confronted electrodes without suffering from damage of the passivation layer even if the passivation layer is made of a resin. The said connecting material (6) comprises an adhesive component (7) of insulating property and electroconductive particles (8), wherein each of the electroconductive particles (8) comprises a resin core particle (8a) coated with a metal layer (8b) and the average particle size d of the electroconductive particles (8) is at least 1.5 times the receding depth h of the electrodes (4) from the outer face of the passivation layer (5) of the semiconductor element (3) and at most 0.5 time the distance s between the neighboring electrodes (4).

Conductive material and connection structure

　カチオン発生剤を用いているにも関わらず、接続対象部材の電極間を電気的に接続した場合に、得られる接続構造体の導通信頼性及び絶縁信頼性を高めることができる導電材料、並びに該導電材料を用いた接続構造体を提供する。　本発明に係る導電材料は、硬化性成分と、陽イオン交換体と、陰イオン交換体と、導電性粒子５とを含む。上記硬化性成分は、硬化性化合物と、カチオン発生剤とを含有する。本発明に係る接続構造体１は、第１の接続対象部材２と、第２の接続対象部材４と、第１，第２の接続対象部材２，４を電気的に接続している接続部３とを備える。接続部３は、上記導電材料を硬化させることにより形成されている。

Anisotropic conductive film and method for producing same

本發明之異向性導電膜具有於絕緣性黏合劑層分散或以規則之圖案排列有導電粒子之構造。於異向性導電膜單面之一部分形成有密合強度低於絕緣性黏合劑層之低密合性區域。低密合性區域係於形成於絕緣性黏合劑層之凹部填充有低密合性樹脂之區域。

Coated conductive particles and method for producing the same

[Problem to be Solved] To provide conductive particles which are capable of providing an anisotropically conductive adhesive that can maintain sufficient insulation characteristics and conduction characteristics even when used for the connection of a very small circuit, while having excellent moisture absorption resistance at a lower cost. [Solution] A coated conductive particle (5) comprises: a composite conductive particle (3) that has a resin particle (4) and a metal layer (6) that covers the resin particle (4); and insulating fine particles (1) that are provided on the outer side of the metal layer (6) so as to partially cover the surface of the metal layer (6). The metal layer (6) has a nickel-palladium alloy plating layer (6a).

Mixtures and Methods for Providing Anisotropic Conductive Pathways and Bonds Between Two Sets of Conductors

Polymer particle, conductive particle, anisotropic conductive material and connection structure

본 발명은 압축 탄성률이 낮고, 또한 압축 변형 회복률이 높은 중합체 입자를 제공한다. 하기 화학식 1 내지 3으로 표시되는 구조를 갖는 다관능의 (메트)아크릴레이트 단량체와, 하기 화학식 4로 표시되는 단관능의 (메트)아크릴레이트 단량체를 포함하는 공중합 성분을 공중합시킴으로써 얻어지고, 압축 변형 회복률이 70％ 이상인 중합체 입자 (2). 상기 화학식 1 중, n은 4 내지 10의 범위 내의 정수를 나타낸다. 상기 화학식 2 중, R11은 수소 원자 또는 탄소수 1 내지 4의 알킬기를 나타내고, R12 내지 R14는 탄소수 1 내지 4의 알킬렌기를 나타내고, R15 내지 R17은 수소 원자 또는 메틸기를 나타낸다. 상기 화학식 3 중, R3 내지 R6은 탄소수 1 내지 4의 알킬렌기를 나타내고, R7 내지 R10은 수소 원자 또는 메틸기를 나타낸다. 상기 화학식 4 중, R1은 수소 원자 또는 메틸기를 나타내고, R2는 탄소수 5 내지 18의 알킬기를 나타낸다.

Connection body, connection body production method, connection method, and anisotropic conductive adhesive

即便电路基板的布线间距或电子部件的电极端子被微细间距化，也确保电子部件与电路基板的导通性，并且防止电子部件的电极端子间的短路。在经由各向异性导电粘接剂（1）在电路基板（12）上连接电子部件（18）的连接体（10）中，各向异性导电粘接剂（1）中有规则地配置导电性粒子（4），导电性粒子（4）的粒径为电子部件（18）的连接电极（19）的高度的1/2以下。

Coated conductive particle coated conductive particle manufacturing method anisotropic conductive material and conductive connection structure

An objective of the invention is to provide a coated conductive particle having superior connection reliability, a method for manufacturing such coated conductive particle, an anisotropic conductive material and a conductive-connection structure. A coated conductive particle comprising a particle having a surface made of conductive metal and an insulating particles to coat the surface of the particle having the surface made of conductive metal there with, wherein the insulating particles are chemically bonded to the particle having the surface made of conductive metal via a functional group (A) having a bonding property to the conductive metal so that a single coating layer is formed.

Circuit connection structure

There is provided a circuit connection structure that can provide satisfactory electrical connection between opposing circuit electrodes and that can sufficiently increase the long-term reliability of electrical characteristics between circuit electrodes. A circuit connection structure 1 comprising a first circuit member 30 having a first circuit electrode 32 formed on the main side 31a of a first circuit board 31, a second circuit member 40 situated opposing the first circuit member 30 and having a second circuit electrode 42 formed on the main side 41a of a second circuit board 41, and a circuit-connecting member 10 provided between the main side of the first circuit member 30 and the main side of the second circuit member 40 and electrically connecting the first and second circuit electrodes 32, 42, characterized in that the thickness of the first and second circuit electrodes 32, 42 is at least 50 nm, the circuit-connecting member 10 is obtained by curing a circuit-connecting material containing an adhesive composition and conductive particles 12 having multiple protrusions 14 on the surface side, and the outermost layer of the conductive particles 12 is composed of nickel or a nickel alloy.

Via in a printed circuit board

印刷电路板的穿孔由一个图形化金属层构成，该图形化金属层延伸穿过介电板材内的孔，介电板材的两面覆有催化性粘着剂。介电板材的穿孔周围涂有一层催化性粘着剂。图形化金属层置于介电板材两面以及所述穿孔之内的催化性粘着剂之上。