ПЕЧАТНАЯ ПЛАТА, В ЧАСТНОСТИ, ДЛЯ СИЛЬНОТОЧНОГО ЭЛЕКТРОННОГО МОДУЛЯ, СОДЕРЖАЩЕГО ЭЛЕКТРОПРОВОДЯЩУЮ ПОДЛОЖКУ

Изобретение относится к печатной плате, в частности, для сильноточного электронного модуля. Технический результат - достижение непосредственного электрического контакта проводящих поверхностей или соответственно токопроводящих дорожек с самой подложкой и использование подложки в качестве электрического проводника. Достигается тем, что в печатной плате, в частности, для сильноточного электронного модуля, содержащего электропроводную подложку, подложка, по меньшей мере, частично, предпочтительно, полностью, выполнена из алюминия или из алюминиевого сплава. Причем, по меньшей мере, на одной поверхности электропроводной подложки расположена, по меньшей мере, одна проводящая поверхность в виде электропроводящего слоя, нанесенного, предпочтительно, методом печати, особенно предпочтительно, методом трафаретной печати. Причем проводящая поверхность непосредственно контактирует с электропроводной подложкой. 2 н. и 13 з.п. ф-лы, 11 ил.

Vorrichtung zum Führen und Halten eines in Transportrichtung T kontinuierlich geförderten Strangs der Tabak verarbeitenden Industrie sowie Tubenradsatz

Die Erfindung betrifft eine Vorrichtung (10) zum Führen und Halten eines in Transportrichtung T kontinuierlich geförderten Strangs (11) der Tabak verarbeitenden Industrie während eines Schneidvorgangs strangförmiger Artikel (12) von dem Strang (11), umfassend ein mittels eines Antriebs (13) antreibbares Tubenrad (14), das aus einem Antriebskörper (15) und einem Führungskörper (16) gebildet ist, die über mindestens ein Koppelelement (17), dem mindestens eine Tube (22) als Halte- und Führungselement zugeordnet ist, miteinander in Wirkverbindung stehen, wobei der Antriebskörper (15) mit einer Antriebswelle (18) des Antriebs (13) verbunden ist, derart, dass der Antriebskörper (15) um die Rotationsachse A als ortsfeste und verstellfreie Antriebsachse rotierend angetrieben ist, und der Führungskörper (16) an einem Tragarm (20) auf einem Achselement (21) gelagert ist, derart, dass der Führungskörper (16) um eine Rotationsachse B, die versetzt zur Rotationsachse A angeordnet ist, rotierend ausgebildet ...

LIGHT EMITTING PACKAGE HAVING A GUIDING MEMBER GUIDING AN OPTICAL MEMBER

A light emitting device package including a base including a top flat surface; an insulating layer on the base; a light emitting diode on the base; an optical member comprising a light transmissive material such that light emitted from the light emitting diode passes therethrough; a guiding member to guide the optical member, the guiding member having a ring shape; an electrical circuit layer electrically connected to the light emitting diode, the electrical circuit layer including an electrode portion and an extended portion, the electrode portion disposed inside the guiding member and electrically connected to the light emitting diode, the extended portion extended from the electrode portion to outside the guiding member; and an electrode layer on the electrode portion of the electrical circuit layer and electrically connected to the light emitting diode.

Light emitting package having a guiding member guiding an optical member

A light emitting device package can include a base including a flat top surface; first and second electrical circuit layers on the flat top surface; a light emitting diode on a region of the flat top surface; an optical member to pass light; and a guiding member having a closed loop shape surrounding the region for guiding the optical member, in which the first and second electrical circuit layers respectively include first and second portions disposed between the flat top surface and a bottom surface of the guiding member, in which the first and second electrical circuit layers respectively include first and second extension portions that respectively extend from the first and second portions to locations outside of an outer edge of the guiding member in different directions.

Leiterplatte, insbesondere für ein Leistungselektronikmodul, umfassend ein elektrisch leitfähiges Substrat

Leiterplatte (1a, 1b, 1c), insbesondere für ein Leistungselektronikmodul (2), umfassend ein elektrisch leitfähiges Substrat (3), wobei das Substrat (3) zumindest teilweise, vorzugsweise vollständig, aus Aluminium und/oder einer Aluminiumlegierung besteht, wobei auf wenigstens einer Oberfläche (3a, 3b) des elektrisch leitfähigen Substrats (3) wenigstens eine Leiterfläche (4a, 4b) in Form einer, vorzugsweise durch ein Druckverfahren, besonders bevorzugt durch ein Siebdruckverfahren, aufgebrachten, elektrisch leitfähigen Schicht angeordnet ist, wobei die Leiterfläche (4a, 4b) direkt mit dem elektrisch leitfähigen Substrat (3) elektrisch kontaktiert ist.

Leiterplatte, insbesondere für ein Leistungselektronikmodul, umfassend ein elektrisch leitfähiges Substrat

Leiterplatte (1a, 1b, 1c), insbesondere für ein Leistungselektronikmodul (2), umfassend ein elektrisch leitfähiges Substrat (3), wobei das Substrat (3) zumindest teilweise, vorzugsweise vollständig, aus Aluminium und/oder einer Aluminiumlegierung besteht, wobei auf wenigstens einer Oberfläche (3a, 3b) des elektrisch leitfähigen Substrats (3) wenigstens eine Leiterfläche (4a, 4b) in Form einer, vorzugsweise durch ein Druckverfahren, besonders bevorzugt durch ein Siebdruckverfahren, aufgebrachten, elektrisch leitfähigen Schicht angeordnet ist, wobei die Leiterfläche (4a, 4b) direkt mit dem elektrisch leitfähigen Substrat (3) elektrisch kontaktiert ist.

System and method for thermal management of electronic devices

SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF ELECTRONIC DEVICES A thermal management system (300) for electronic devices, the system (300) comprising at least one electronic device (302); a heat sink (304); and a thermally-conducting and electrically-insulating thermal bridge (306) that is interposed between the at least one electronic device (302) and the heat sink (304) and that thermally couples the at least one electronic device (302) to the heat sink (304) and electrically isolates the at least one electronic device (302) from the heat sink (304), wherein the at least one electronic device (302), the heat sink (304), and the thermal bridge (306) are mounted on a same planar surface of a printed circuit board (308). 310 %%SNIPPET%% 1 ...

FLEXIBLE PRINTED CIRCUIT LOW EMISSIVITY

Semiconductor device wiring pattern and connections

A semiconductor device, while being small, makes it possible to achieve low inductance responding to high speed switching. The semiconductor device includes a plurality of conductive pattern members, on each of which is mounted one or a plurality of power semiconductor chips, and a printed circuit board wherein a chip rod-form conductive connection member connected to the power semiconductor chip and a pattern rod-form conductive connection member connected to the conductive pattern member are disposed on the surface opposing the conductive pattern member. The conductive pattern member is formed of a narrow portion and a wide portion, the narrow portion of at least one conductive pattern member and the printed circuit board are connected by the pattern rod-form conductive connection member, and a current path is formed between the conductive pattern member and the power semiconductor chip connected via the chip rod-form conductive connection member to the printed circuit board.

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

A printed circuit board and a method of manufacturing the same are provided. The printed circuit board may include a core layer, a metal layer disposed on the core layer, and a heat dissipation unit disposed to pass through the core layer in across a thickness of the core layer.

ПЕЧАТНАЯ ПЛАТА, В ЧАСТНОСТИ, ДЛЯ СИЛЬНОТОЧНОГО ЭЛЕКТРОННОГО МОДУЛЯ, СОДЕРЖАЩЕГО ЭЛЕКТРОПРОВОДЯЩУЮ ПОДЛОЖКУ

... 1. Печатная плата (1а, 1b, 1c), в частности, для сильноточного электронного модуля (2), содержащего электропроводную подложку (3), причем подложка (3) по меньшей мере частично, предпочтительно, полностью, выполнена из алюминия и/или из алюминиевого сплава, отличающаяся тем, что по меньшей мере на одной поверхности (3а, 3b) электропроводной подложки (3) расположена по меньшей мере одна проводящая поверхность (4а, 4b) в виде электропроводящего слоя, нанесенного, предпочтительно, методом печати, особенно предпочтительно, методом трафаретной печати, причем проводящая поверхность (4а, 4b) непосредственно электрически контактирует с электропроводной подложкой (3).2. Печатная плата по п. 1, отличающаяся тем, что по меньшей мере одна поверхность (3а, 3b) электропроводной подложки (3) по существу выполнена плоской.3. Печатная плата по п. 1, отличающаяся тем, что проводящая поверхность (4а, 4b) по существу состоит из меди.4. Печатная плата по п. 1, отличающаяся тем, что проводящая поверхность (4а ...

Circuit board

Eine Leiterplatte (1) mit einem Schichtaufbau, der zumindest eine erste und eine zweiten metallische Schicht (2, 3, 4, 5) sowie metallische Schichten trennende Lagen (6, 7, 8) aus einem isolierenden Verbundwerkstoff aufweist und mit mehreren metallischen Durchkontaktierungen (11..16) zwischen zumindest einer ersten und zumindest einer zweiten metallischen Schicht, wobei an zumindest einer Stelle der Leiterplatte (1) eine zentrale, durch zumindest eine Lage (7) verlaufende hülsenförmige Durchkontaktierung (17) vorgesehen ist, welche beidseitig an einer oberen und/oder unteren Endlage aus Verbundwerkstoff endet und deren zylindrischer Hohlraum (17h) mit einem Material gefüllt ist und an zumindest einem Ende der zentralen Durchkontaktierung in Abstand (d) von dieser zumindest zwei massive Durchkontaktierungen (18, 19) vorgesehen sind, welche mit der zentralen Durchkontaktierung in deren Endbereich in metallischer Verbindung stehen, durch eine Endlage aus Verbundwerkstoff verlaufen und bis ...

HERSTELLEN EINER SCHALTUNGSANORDNUNG MIT THERMISCHEN DURCHKONTAKTIERUNGEN

Zum Herstellen einer Schaltungsanordnung (40) auf einer Trägerplatte (10) mit thermischen Durchkontaktierungen (20), die durch die Trägerplatte (10) hindurch von der Oberseite (11) zur Unterseite (12) verlaufen, werden zuerst die thermischen Durchkontaktierungen (20) an der Unterseite (12) durch Aufbringen einer Schicht thermisch leitfähigen, elektrisch isolierenden Materials (14) verschlossen, die vorzugsweise die Öffnung mehrerer Durchkontaktierungen (20) auf der Unterseite (12) gemeinsam überdeckt, und sodann die thermischen Durchkontaktierungen (20) von der Oberseite (11) her mit Lötmaterial (16) verfüllt. Bevorzugt werden die Bauteile (39) auf einer Oberseite (11) der Trägerplatte (10) aufgebracht, bevor die Durchkontaktierungen (20) in einem Reflow-Prozess verfüllt werden.

HERSTELLEN EINER SCHALTUNGSANORDNUNG MIT THERMISCHEN DURCHKONTAKTIERUNGEN

Zum Herstellen einer Schaltungsanordnung (40) auf einer Trägerplatte (10) mit thermischen Durchkontaktierungen (20), die durch die Trägerplatte (10) hindurch von der Oberseite (11) zur Unterseite (12) verlaufen, werden zuerst die thermischen Durchkontaktierungen (20) an der Unterseite (12) durch Aufbringen einer Schicht thermisch leitfähigen, elektrisch isolierenden Materials (14) verschlossen, die vorzugsweise die Öffnung mehrerer Durchkontaktierungen (20) auf der Unterseite (12) gemeinsam überdeckt, und sodann die thermischen Durchkontaktierungen (20) von der Oberseite (11) her mit Lötmaterial (16) verfüllt. Bevorzugt werden die Bauteile (39) auf einer Oberseite (11) der Trägerplatte (10) aufgebracht, bevor die Durchkontaktierungen (20) in einem Reflow-Prozess verfüllt werden.

SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF ELECTRONIC DEVICES

A thermal management system and method for electronic devices is provided. The system includes an electronic device, a heat sink, and a thermally conducting and electrically insulating thermal bridge that is interposed between the electronic device and the heat sink. The thermal bridge thermally couples the electronic device to the heat sink and electrically isolates the electronic device from the heat sink. The electronic device, the heat sink, and the thermal bridge are mounted on a same planar surface of a printed circuit board.

VERTICAL RADIO FREQUENCY MODULE

A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge of the heat sink extends past a boundary of the substrate. RF, logic and power circuitry is disposed on the substrate and one or more RF signal ports are formed on an edge of the substrate to allow the RF module to be used in an array antenna having a brick architecture. The tapered edge heat sink provides both a ground plane for RF signal components and a thermal path for heat generating circuits disposed in the substrate.

THERMALLY CONDUCTIVE TYPE POLYIMIDE SUBSTRATE

A thermally conductive type polyimide substrate is provided. The substrate comprises at least one insulating layer having a metal layer on a single side or both sides thereof. The material of the insulating layer is a thermally conductive type photosensitive resin having a thermal conductivity of 0.4 to 2, and the thermally conductive type photosensitive resin includes the following components: (a) a photosensitive polyimide, (b) an inorganic filler, and (c) a silica solution. The photosensitive polyimide accounts for 50 to 70% of a total weight of a solid composition of the thermally conductive type photosensitive resin. The inorganic filler accounts for 20-30% of the total weight of the solid composition of the thermally conductive type photosensitive resin, and has a particle size between 40 nm and 5 μm. The silica solution comprises silica particles polymerized by a sol-gel process, and the silica particles have a particle size between 10 nm and 15 nm and account for 5 to 30% of the ...

Circuit board

Eine Leiterplatte (1) mit einem Schichtaufbau, der zumindest eine erste und eine zweiten metallische Schicht (2, 3, 4, 5) sowie metallische Schichten trennende Lagen (6, 7, 8) aus einem isolierenden Verbundwerkstoff aufweist und mit mehreren metallischen Durchkontaktierungen (11..16) zwischen zumindest einer ersten und zumindest einer zweiten metallischen Schicht, wobei an zumindest einer Stelle der Leiterplatte (1) eine zentrale, durch zumindest eine Lage (7) verlaufende hülsenförmige Durchkontaktierung (17) vorgesehen ist, welche beidseitig an einer oberen und/oder unteren Endlage aus Verbundwerkstoff endet und deren zylindrischer Hohlraum (17h) mit einem Material gefüllt ist und an zumindest einem Ende der zentralen Durchkontaktierung in Abstand (d) von dieser zumindest zwei massive Durchkontaktierungen (18, 19) vorgesehen sind, welche mit der zentralen Durchkontaktierung in deren Endbereich in metallischer Verbindung stehen, durch eine Endlage aus Verbundwerkstoff verlaufen und bis ...

CIRCUIT BOARD, PARTICULARLY FOR A POWER ELECTRONIC MODULE, COMPRISING AN ELECTRICALLY-CONDUCTIVE SUBSTRATE

The invention relates to a circuit board (1a, 1b, 1c), particularly for a power-electronic module (2), comprising an electrically-conductive substrate (3) which consists, at least partially and preferably entirely, of aluminium and/or an aluminium alloy. On at least one surface (3a, 3b) of the electrically-conductive substrate (3), at least one conductor surface (4a, 4b) is arranged in the form of an electrically-conductive layer applied preferably using a printing method and more preferably using a screen-printing method, said conductor surface (4a, 4b) being in direct electrical contact with the electrically-conductive substrate (3).

Resin composition, prepreg, metal foil-clad laminate and printed wiring board

Electromagnetic noise suppressing film comprising graphene and electronic device comprising the same

Sliding thermal contact for pluggable optic modules

Present thermal solutions to conduct heat from pluggable optical modules into heat sinks use a metal heat sink attached with a spring clip. The interface between the pluggable module and the heat sink is simple metal-on-metal contact, which is inherently a poor thermal interface and limits heat dissipation from the optical module. Heat dissipation from pluggable optical modules is enhanced by the application of thermally conductive fibers, such as an advanced carbon nanotube velvet. The solution improves heat dissipation while preserving the removable nature of the optical modules.

COMPONENT VERTICAL MOUNTING

A circuit component arrangement includes a base and a plurality of circuit components mounted to the base. A bonding agent adheres the circuit components in intimate contact to the base. The bonding agent is disposed in a respective open channel defined in an outward facing surface of the base in contact with each of the circuit components. A method of assembling a circuit component arrangement includes temporarily fastening a plurality of circuit components to a base. A bonding agent is injected into a respective open channel defined in the base to adhere each of the plurality of circuit components to the base. The plurality of circuit components are unfastened from the base. Injecting a bonding agent can include ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.

THERMAL STABILIZATION OF TEMPERATURE SENSITIVE COMPONENTS

An enclosure for thermally stabilizing a temperature sensitive component on a circuit board is provided. The enclosure comprises a first cover section configured to be mounted over a portion of a first side of the circuit board where at least one temperature sensitive component is mounted. The first cover section includes a first lid, and at least one sidewall that extends from a perimeter of the first lid. The enclosure also comprises a second cover section configured to be mounted over a portion of a second side of the circuit board opposite from the first cover section. The second cover section includes a second lid, and at least one sidewall that extends from a perimeter of the second lid. The first and second cover sections are configured to releasably connect with the circuit board.

Multilayer ceramic printed circuit board provided with heat sink substrate and manufacturing method thereof

System and method for thermal management of electronic devices

SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF ELECTRONIC DEVICES A thermal management system (300) for electronic devices, the system (300) comprising at least one electronic device (302); a heat sink (304); and a thermally-conducting and electrically-insulating thermal bridge (306) that is interposed between the at least one electronic device (302) and the heat sink (304) and that thermally couples the at least one electronic device (302) to the heat sink (304) and electrically isolates the at least one electronic device (302) from the heat sink (304), wherein the at least one electronic device (302), the heat sink (304), and the thermal bridge (306) are mounted on a same planar surface of a printed circuit board (308). 310 %%SNIPPET%% 1 ...

CIRCUIT BOARD, PARTICULARLY FOR A POWER-ELECTRONIC MODULE, COMPRISING AN ELECTRICALLY-CONDUCTIVE SUBSTRATE

The invention relates to a circuit board (1a, 1b, 1c), particularly for a power-electronic module (2), comprising an electrically-conductive substrate (3) which consists, at least partially and preferably entirely, of aluminium and/or an aluminium alloy. On at least one surface (3a, 3b) of the electrically-conductive substrate (3), at least one conductor surface (4a, 4b) is arranged in the form of an electrically-conductive layer applied preferably using a printing method and more preferably using a screen-printing method, said conductor surface (4a, 4b) being in direct electrical contact with the electrically-conductive substrate (3).

Flexible circuit board substrate and method of manufacturing the same

This present invention provides a flexible circuit board substrate including: a conductive material layer with a first surface, a second surface opposite to the first surface, and at least one via hole throughout the first surface and the second surface; a first surface-treated layer with a plurality of first particles and a plurality of second particles formed on the first surface and/or the second surface, wherein each first particle has a diameter greater than that of each second particle; and an insulating structure formed on the first surface-treated layer and filled up with the via hole, and a method of manufacturing the same.

CIRCUIT SUBSTRATE AND SEMICONDUCTOR DEVICE

To improve a TCT characteristic of a circuit substrate. The circuit substrate comprises a ceramic substrate including a first and second surfaces, and first and second metal plates respectively bonded to the first and second surfaces via first and second bonding layers. A three-point bending strength of the ceramic substrate is 500 MPa or more. At least one of L1/H1 of a first protruding portion of the first bonding layer and L2/H2 of a second protruding portion of the second bonding layer is 0.5 or more and 3.0 or less. At least one of an average value of first Vickers hardnesses of 10 places of the first protruding portion and an average value of second Vickers hardnesses of 10 places of the second protruding portion is 250 or less.

FLEXIBLE PRINTED BOARD LOW-E

Le circuit imprimé flexible à faible émissivité comprend des premier et second extrémités (48a, 48b), et une partie centrale flexible (50) s'étendant entre les première et seconde extrémités et comportant des pistes électriquement conductrices (52), enrobées dans un matériau polymère, pour relier électriquement les première et seconde extrémités. La partie centrale flexible est couverte au moins en partie par un écran thermique (54) formé dans un matériau ayant une émissivité inférieure à celles du matériau polymère et des pistes électriquement conductrices.

Adapter for removable computer expansion devices

In an embodiment, an adapter assembly includes a plurality of system connectors configured to simultaneously engage a plurality of receiving connectors of an external system when inserted in the external system and simultaneously disengage from the plurality of receiving connectors of the external system when disengaged from the external system. The adapter assembly includes a device-receiving connector configured to engage a connector of a removable device, where the adapter assembly is configured to house at least a portion of the removable device. The adapter assembly includes connections between at least a portion of the plurality of system connectors and the device-receiving connector, where the connections are configured to route communication lanes of the removable device to one or more of the plurality of system connectors.

SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF STORAGE DEVICES

Methods, systems, and devices for providing computer implemented services are disclosed. To provide the computer implemented services, a data processing system may include hardware components that provide the computer implemented services. Any of the hardware components may have thermal limitations. To mitigate the impact of the thermal limitations, the data processing system may include host circuit card integrated heating assemblies. The heating assemblies may be used to warm hardware components of devices connected to the host circuit card. When connected to the host circuit card, a thermal conduction path between a device and a heating assembly may be established.

Package for light emitting device

Copper foil lhc, and molding and its manufacturing method

COPPER FOIL COMPOSITE, MOLDED BODY, AND METHOD FOR PRODUCING SAME

... 본 발명은 프레스 가공 등과 같은 1 축 굽힘과 상이한 과혹 (복잡) 한 변형을 실시해도 동박이 갈라지는 것을 방지하여, 가공성이 우수하고, 또한 내식성 및 전기 접점 성능을 장기간 안정적으로 발휘하는 동박 복합체, 그리고 그 성형체 및 그 제조 방법을 제공하는 것을 목적으로 한다. 본 발명은 동박과 수지층이 적층된 동박 복합체로서, 동박의 두께를 t2 (㎜), 인장 변형 4 ％ 에 있어서의 동박의 응력을 f2 (㎫), 수지층의 두께를 t3 (㎜), 인장 변형 4 ％ 에 있어서의 수지층의 응력을 f3 (㎫) 으로 했을 때, 식 1：(f3 × t3)/(f2 × t2) ≥ 1 을 만족하며, 또한 동박과 수지층의 180°박리 접착 강도를 f1 (N/㎜), 동박 복합체의 인장 변형 30 ％ 에 있어서의 강도를 F (㎫), 동박 복합체의 두께를 T (㎜) 로 했을 때, 식 2：1 ≤ 33f1/(F × T) 를 만족하고, 동박 중 수지층이 적층되어 있지 않은 면에, 부착량 5 ∼ 100 ㎍/dm2 의 Cr 산화물층이 형성되어 있는 동박 복합체, 그리고 그 성형체 및 그 제조 방법에 관한 것이다.

High heat dissipation circuit board set

The present invention is a high heat dissipation circuit board set, which has a circuit board and a heat dissipation device; the circuit board has a plurality of electronic components, at least one heat dissipation hole and at least a thermally conductive material, wherein the electronic components are disposed on the top surface of the circuit board. Each heat dissipation hole penetrates through the top and bottom surfaces of the circuit board and faces on one of the electronic components, each thermally conductive material is accommodated in the corresponding heat dissipation hole and contacts the electronic component which the heat dissipation hole faces. The heat dissipation device is flatly attached to the bottom surface of the circuit board and contacts with each thermally conductive material. Through a thermally conductive material with high thermal conductive coefficient, the waste heat which is generated by the electronic components during the operation on the circuit board can ...

Graphite sheet to protect SMT components from thermal exposure

A formed graphite sheet is shaped and sized as a protective shield positioned over an electronic component coupled to a PCB. The formed graphite sheet is used to protect a body of the electronic component from heat applied during the assembly of the electronic component to the PCB, such as the heating steps used in SMT and through-hole technology.

Graphitic substrates with ceramic dielectric layers

Different kinds of printing pastes or inks are utilized in various combinations to develop multiple ceramic dielectric layers on graphitic substrates in order to create effective dielectric ceramic layers that combine good adhesion to both graphitic substrates and printed copper traces, and strong insulating capability. The pastes or inks may comprise a high thermal conductivity powder.

Server system

A server system includes an enclosure, a first section, a motherboard section, a fan section, and a midplane board. The first section is disposed at a first end of the enclosure and includes at least one heat generating component. The motherboard section is disposed at a second end of the enclosure and includes at least one motherboard. The fan section is disposed between the front section and the motherboard section and includes at least one fan for directing air in from the first end and out of the second end. The midplane board is vertically interposed between the fan section and the motherboard section, and is configured to electrically and communicatively couple the at least one motherboard to one or more components in the first section, and includes one or more airflow cutouts. The one or more airflow cutouts of the midplane board make up at least thirty percent of a cross-sectional surface area of the midplane board.

Circuit board, electronic module and illuminating device having the circuit board, and method for manufacturing the circuit board

Various embodiments relate to a circuit board, including a base and a heat-conducting layer. The base has a first region and a second region on one side thereof facing the heat-conducting layer, the first region is recessed with respect to the second region, a first insulating layer is accommodated in the first region, a second insulating layer is formed on the second region, and the first insulating layer and the second insulating layer have different thermal conductivities. In addition, various embodiments further relate to an electronic module and an illuminating device including such circuit board. Various embodiments also relate to a method for manufacturing such circuit board.

LIGHT EMITTING PACKAGE HAVING A GUIDING MEMBER GUIDING AN OPTICAL MEMBER

A light emitting device package can include a base including a flat top surface; first and second electrical circuit components disposed on the flat top surface of the base; a light emitting diode disposed on the flat top surface of the base, an optical member comprising a light transmissive material; and a guiding member disposed on the flat top surface of the base and having a closed loop shape for guiding the optical member, in which the first and second electrical circuit components respectively include first and second portions disposed between the flat top surface of the base and a bottom surface of the guiding member, the first electrical circuit component includes a first extension portion that extends from the first portion to a first location outside of an outer edge of the guiding member in a first direction, and a second extension portion that extends from the first extension portion to a second location outside of the outer edge of the guiding member in a second direction different ...

SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF ELECTRONIC DEVICES

A thermal management system and method for electronic devices is provided. The system includes an electronic device, a heat sink, and a thermally conducting and electrically insulating thermal bridge that is interposed between the electronic device and the heat sink. The thermal bridge thermally couples the electronic device to the heat sink and electrically isolates the electronic device from the heat sink. The electronic device, the heat sink, and the thermal bridge are mounted on a same planar surface of a printed circuit board.

System and method for thermal management of electronic devices

A thermal management system and method for electronic devices is provided. The system includes an electronic device, a heat sink, and a thermally conducting and electrically insulating thermal bridge that is interposed between the electronic device and the heat sink. The thermal bridge thermally couples the electronic device to the heat sink and electrically isolates the electronic device from the heat sink. The electronic device, the heat sink, and the thermal bridge are mounted on a same planar surface of a printed circuit board.

Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board

A copper heat dissipation material having a satisfactory heat dissipation performance is provided. The copper heat dissipation material has an alloy layer containing at least one metal selected from Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn and Mo on one or both surfaces, in which surface roughness Sz of the one or both surfaces, measured by a laser microscope using laser light of 405 nm in wavelength, is 5 μm or more.

Thermally highly conductive coating on base structure accommodating a component

A component carrier has a base structure with a recess, a thermally highly conductive coating covering at least a part of a surface of the base structure, and a component in the recess.

Fixation of heat sink on SFP/XFP cage

An apparatus and system for a heat sink assembly, and a procedure for forming a heat sink assembly. The heat sink assembly includes a heat sink having a base and fins extending from the base, and a spring clip disposed on the heat sink between the fins. The spring clip includes a first tab that forms a first angle with respect to the base of the heat sink and including a second tab that forms a second angle with respect to the base of the heat sink. The first and second tabs are attached to the circuit board. By virtue thereof, a heat sink attachment to cage is provided that is space-efficient and permits a higher density of cages on a circuit board than do conventional arrangements.

LIGHT EMITTING PACKAGE

The present invention discloses a light emitting package, comprising: a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; a gold layer on the electrical circuit layer; a wire electrically connected between the light emitting device and the gold layer; a screen member having an opening and disposed on the base adjacent to the light emitting device; and a lens covering the light emitting device, wherein a cross-sectional shape of the screen member is substantially rectangular, and a width of the cross-sectional shape of the screen member being larger than a height of the cross sectional shape of the screen member, wherein a bottom surface of the screen member is positioned higher than the light emitting device, and wherein an entire uppermost surface of the screen member is in contact with the lens.

Display panel and display device including the same

A display panel includes a substrate including a display area and a pad area, a plurality of pad electrodes disposed on the pad area, and an insulating layer disposed between adjacent ones of the plurality of pad electrodes and including a heat absorbing particle. A laser is irradiated to heat the insulating layer, and the heat absorbing particle in the insulating layer absorbs the heat and cures an anisotropic conductive film by heat transfer to electrically connect the plurality of pad electrodes to a plurality of bump electrodes.

Leiterplattensatz mit hocheffizienter Wärmeabfuhr

Ein Leiterplatinenset, das eine hocheffiziente Wärmeabfuhr hat, weist eine Leiterplatine (PCB) 10 und eine Wärmeabfuhreinrichtung 20 auf. Die PCB 10 hat mehrere elektronische Bauelemente 11 zumindest eine Wärmeabfuhröffnung 12 und zumindest ein thermisch leitfähiges Material 30. Die elektronischen Bauelemente 11 sind auf der PCB 100 angeordnet. Jede Wärmeabfuhröffnung 12 wird durch die PCB 10 gebildet und ist mit einem der elektronischen Bauelemente 11 ausgerichtet. Jedes thermisch leitfähige Material 30 ist in der entsprechenden Wärmeabfuhröffnung 12 angeordnet und steht mit den elektronischen Bauelementen 11 in Kontakt. Die Wärmeabfuhreinrichtung 20 ist an der Bodenfläche der PCB 10 befestigt und kontaktiert das wenigstens eine thermisch leitfähige Material 30. Mit einer hohen thermischen Leitfähigkeit überträgt das thermisch leitfähige Material 10 schnell die Wärme, die durch die PCB 10 erzeugt wird, an die Wärmeabfuhreinrichtung 20 zur Wärmeabfuhr.

Optical module

Thermally conductive polyimide substrate

A thermally conductive polyimide substrate is provided. The substrate comprises at least one insulation layer. A metal layer is disposed on one or both sides of the insulation layer. The insulation layer is made by a thermally conductive and photosensitive resin. The resin comprises (a) photosensitive polyimide, (b) inorganic filler and (c) silica solution. The photosensitive polyimide has an amount of weight accounting for 50-80% of the total solid composition of the resin. The particle size of the inorganic filler is between 40nm to 5[mu]m, and it has an amount of weight accounting for 20-50% of the total solid composition of the resin. The silica solution includes colloidal silica prepared by sol-gel process, and the particle size of the colloidal silica is between 10-15nm. The thermally conductive and photosensitive resin has a thermal conductivity between 0.4 and 2.

Light emitting package having a guiding member guiding an optical member

The present invention discloses a light emitting package, including: a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; a screen member having an opening and disposed on the base adjacent to the light emitting device; and a lens covering the light emitting device, wherein a width of a cross-sectional shape of the screen member is larger than a height of the cross sectional shape of the screen member, wherein the lens is disposed on the screen member, and wherein the lens is connected to an uppermost surface of the screen member.

Electrical equipment

Thermally expandable material, sheet material, circuit board, method for manufacturing circuit board, storage medium, electronic apparatus, and structure to analyze heat-generation position

CIRCUIT BOARD STRUCTURES FOR THERMAL INSULATION AND METHOD OF MAKING SAME

Techniques and mechanisms for providing thermal insulation with a circuit board. In an embodiment, a circuit board comprises a metal core and an electrical insulator disposed thereon. A first portion and a second portion each comprise at least five percent of the metal core by volume, wherein a first surface of the first portion is at a first level along a height axis, and a second surface of the second portion is at a second level along the height axis. A difference between the first level and the second level is less than, and at least twenty percent of, an overall thickness of the metal core. In another embodiment, the metal core further comprises a trench portion disposed between the first portion and the second portion, wherein a thickness of the trench portion is less each of the respective thicknesses of the first portion and the second portion.

NEAR-FIELD ELECTROMAGNETIC WAVE ATTENUATION AND HEAT-DISSIPATION PASSIVE ELEMENT LAYER COMPRISING GRAPHENE, AND ELECTROMAGNETIC DEVICE INCLUDING SAME

The present invention relates to a near-field electromagnetic wave attenuation and heat-dissipation passive element layer, and an electromagnetic device and a circuit board, which comprise the passive element layer. The near-field electromagnetic wave attenuation and heat-dissipation passive element layer may interrupt electromagnetic waves emitted from external electronic equipment or prevent the discharge of electromagnetic waves generated in electronic equipment to the outside. In addition, the near-field electromagnetic wave attenuation and heat-dissipation passive element layer may reduce interference between transmission circuits in a near-field region or malfunction in electronic equipment due to external electromagnetic waves.

PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS

A printed wiring board has thereon an electronic component having a heat radiation pad, and an electrolytic capacitor provided for the electronic component. The printed wiring board further has thereon another electronic component having another heat radiation pad and exhibiting a higher heat value than that of the electronic component, and another electrolytic capacitor provided for the other electronic component. The heat radiation pad of the electronic component, a ground terminal of the electrolytic capacitor, the other heat radiation pad for the other electronic component, and another ground terminal of the other electrolytic capacitor are connected by using a ground conductor. In the ground conductor, a thermal resistance between the other heat radiation pad and other ground terminal is lower than the thermal resistance between the heat radiation pad and the ground terminal.

With enhanced heat dissipation of the electronic power module and manufacturing method thereof

Copper foil composite, molded body, and method for producing same

The objective of the present invention is to provide: a copper foil composite that prevents the copper foil from splitting even when subjected to extreme (complex) deformation differing from uniaxial bending such as press working or the like, has superior workability, and furthermore exhibits corrosion resistance and electrical contact performance stably over the long term; a molded body thereof; and a method for producing same. The copper foil composite results from a copper foil and a resin layer being laminated, when the thickness of the copper foil is t2 (mm), the stress on the copper foil at a tensile strain of 4% is f2 (MPa), the thickness of the resin layer is t3 (mm), and the stress on the resin layer at a tensile strain of 4% is f3 (MPa), formula 1, (f3t3)/(f2t2) >= 1, is satisfied, when the 180 DEG peel (bond) strength between the copper foil and the resin layer is f1 (N/mm), the strength of the copper foil composite at a tensile strain of 30% of F (MPa), and the thickness of ...

Circuit arrangement for vehicles and use of a circuit arrangement

Circuit arrangement for vehicles with at least one semiconductor element 30 and at least one first metal carrier plate 2a and a metal circuit board 2b. A multifaceted scope of application is provided if the carrier plate 2a is electrically insulated from the circuit board 2b and the carrier plate 2a is electrically linked with at least one of the circuit boards 2b by means of at least one semiconductor device 30 so that the carrier plate 2a and the circuit board 2b form an electrical three-pole.

Graphene Based Conformal Heat Sink and Method Therefor

An information handling system includes an electronic assembly, the assembly including heat-generating components arranged on a printed circuit board. The system further includes a conformal coating that is applied over a first region of the electronic assembly. The coating includes a graphene containing polymer material configured to dissipate heat away from the heat-generating components.

Package for light emitting device with metal base to conduct heat

A light emitting device includes a metal base, an electrical circuit layer provided at an upper side of the metal base for providing a conductive path, a light emitting device mounted in a second region having a smaller thickness than a first region on the metal base, an insulating layer sandwiched between the metal base and the electrical circuit layer, an electrode layer provided at an upper side of the electrical circuit layer, and a wire for electrically connecting the electrode layer and the light emitting device. The light emitting device package has improved light emission efficiency since the light emitting device is placed on a small thickness portion of the metal base.

Power conversion apparatus

Provided is a power conversion apparatus including: a plurality of power converters including a first power converter and a second power converter simultaneously operated by power supplied via a first connector; and a heat dissipation board having a first pattern formed thereon for distributing the power supplied via the first connector to the first power converter and the second power converter.

Power conversion device control board

Semiconductor device

Circuit Arrangement for Vehicles and Use of a Circuit Arrangement

Circuit arrangement for vehicles with at least one semiconductor element 30 and at least one first metal carrier plate 2a and a metal circuit board 2b. A multifaceted scope of application is provided if the carrier plate 2a is electrically insulated from the circuit board 2b and the carrier plate 2a is electrically linked with at least one of the circuit boards 2b by means of at least one semiconductor device 30 so that the carrier plate 2a and the circuit board 2b form an electrical three-pole.

Befestigungseinrichtung, Gerät

Die Erfindung betrifft eine Befestigungseinrichtung (5) zur Befestigung eines ersten Bauteils an einem zweiten Bauteil, insbesondere zur Befestigung eines Kühlkörpers (4) an einer Leiterplatte (2), mit einem ersten Befestigungselement (9) und mit einem zweiten Befestigungselement (10), wobei das erste Befestigungselement (9) in das zweite Befestigungselement (10) zur Befestigung einsteckbar ist. Es ist vorgesehen, dass das erste Befestigungselement (9) als Torsionselement (11) ausgebildet ist, das an seinem freien Ende (13) wenigstens einen seitlichen Rastvorsprung (16, 19) aufweist, der mit dem zweiten Befestigungselement (10) durch elastische Torsion des ersten Befestigungselementes (9) zur formschlüssigen Befestigung zusammenwirkt.

Vorrichtung zum Führen und Halten eines in Transportrichtung T kontinuierlich geförderten Strangs der Tabak verarbeitenden Industrie sowie Tubenradsatz

Die Erfindung betrifft eine Vorrichtung (10) zum Führen und Halten eines in Transportrichtung T kontinuierlich geförderten Strangs (11) der Tabak verarbeitenden Industrie während eines Schneidvorgangs strangförmiger Artikel (12) von dem Strang (11), umfassend ein mittels eines Antriebs (13) antreibbares Tubenrad (14), das aus einem Antriebskörper (15) und einem Führungskörper (16) gebildet ist, die über mindestens ein Koppelelement (17), dem mindestens eine Tube (22) als Halte- und Führungselement zugeordnet ist, miteinander in Wirkverbindung stehen, wobei der Antriebskörper (15) mit einer Antriebswelle (18) des Antriebs (13) verbunden ist, derart, dass der Antriebskörper (15) um die Rotationsachse A als ortsfeste und verstellfreie Antriebsachse rotierend angetrieben ist, und der Führungskörper (16) an einem Tragarm (20) auf einem Achselement (21) gelagert ist, derart, dass der Führungskörper (16) um eine Rotationsachse B, die versetzt zur Rotationsachse A angeordnet ist, rotierend ausgebildet ...

Novel circuit board based on thermal conductive silica gel

Electronic device and circuit board assembly

Electronic power module with enhanced thermal dissipation and manufacturing method thereof

An electronic power module comprising a case that houses a stack, which includes: a first substrate of a DBC type or the like; a die, integrating an electronic component having one or more electrical-conduction terminals, mechanically and thermally coupled to the first substrate; and a second substrate, of a DBC type or the like, which extends over the first substrate and over the die and presents a conductive path facing the die. The die is mechanically and thermally coupled to the first substrate by a first coupling region of a sintered thermoconductive paste, and the one or more conduction terminals of the electronic component are mechanically, electrically, and thermally coupled to the conductive path of the second substrate by a second coupling region of sintered thermoconductive paste.

Printed circuit board assembly

A printed circuit board assembly is provided. A printed circuit board assembly includes a printed circuit board; an electronic component mounted on the printed circuit board; a heat radiating member which contacts the electronic component and is configured to receive and conduct heat generated by the electronic component; and at least one connection part connecting the printed circuit board and the heat radiating member to each other and configured to transfer the heat conducted through the heat radiating member to the printed circuit board.

Gehäuse für eine lichtemittierende Vorrichtung

Ein Gehäuse für eine lichtemittierende Vorrichtung, umfassend eine metallische Basis, eine elektrische Schaltungsschicht, die auf der Oberseite der metallischen Basis zum Bereitstellen einer Leiterbahn vorgesehen ist, eine Isolierschicht, die zwischen der metallischen Basis und der elektrischen Schaltungsschicht angeordnet ist, eine lichtemittierende Vorrichtung, die auf der oberen Oberfläche der metallischen Basis in einem freigelegten Bereich, von dem die Isolierschicht entfernt ist, montiert ist, eine Elektrodenschicht, die an einer Oberseite der elektrischen Schaltungsschicht vorgesehen ist, und einen Verbindungsabschnitt zum elektrischen Verbinden der Elektrodenschicht und der lichtemittierenden Vorrichtung.

모터 차량들을 위한 회로 배치 및 회로 배치의 이용

... 차량들을 위한 회로 배치가 제공되는데, 상기 회로 배치는 적어도 하나의 반도체 소자(30) 및 적어도 하나의 제 1 금속 캐리어 플레이트(20) 및 하나의 금속 프린트된 회로 보드(2b)를 포함한다. 캐리어 플레이트(2a)가 프린트된 회로 보드(2b)로부터 전기적으로 절연되고 소정 거리 이격되어 있으며, 그리고 캐리어 플레이트(2a) 및 프린트된 회로 보드(2b)가 전기적 3 극을 형성하도록, 캐리어 플레이트(2a)가 적어도 하나의 반도체 소자(30)에 의해서 적어도 하나의 프린트된 회로 보드(2b)에 전기적으로 연결되는 경우, 다양한 활용예들이 가능하다.

Conductor board, in particular for a power electronics module, comprising an electrically conductive substrate

LIGHT EMITTING PACKAGE

The present invention discloses a light emitting package, comprising: a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; a gold layer on the electrical circuit layer; a wire electrically connected between the light emitting device and the gold layer; a screen member having an opening and disposed on the base adjacent to the light emitting device; and a lens covering the light emitting device, wherein a bottom surface of the screen member is positioned higher than the light emitting device, and wherein an entire uppermost surface of the screen member is in contact with the lens.

수직 무선 주파수 모듈

... 복수의 채널들을 구비하는 무선 주파수(RF) 모듈은, 적어도 하나의 테이퍼진 엣지를 구비하는 히트 싱크; 및 상기 히트 싱크의 테이퍼진 엣지가 기판의 경계를 지나 연장하도록 상기 히트 싱크의 표면 위에 배치된 기판을 포함한다. RF, 로직 및 전력 회로는 상기 기판 상에 배치되고, 하나 이상의 RF 신호 포트들은 상기 기판의 엣지 상에 형성되어, RF 모듈이 브릭 아키텍처를 구비하는 어레이 안테나에서 사용되도록 한다. 테이퍼진 엣지 히트 싱크는 RF 신호 컴포넌트들을 위한 접지면과 상기 기판에 배치된 열 발생 회로들을 위한 열 경로 모두를 제공한다.

Light emitting package having a guiding member guiding an optical member

A light emitting package, includes a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; an optical member formed of a light transmissive material; and a guiding member guiding the optical member, the guiding member including an opening, a first portion disposed on the uppermost surface of the base, and a second portion connected to an edge portion of the optical member. The first portion of the guiding member is positioned higher than a bottom surface of the optical member, an uppermost surface of the base is closer to the first portion of the guiding member than the second portion of the guiding member, and the edge portion of the optical member is closer to the second portion of the guiding member than the first portion of the guiding member.

Printed wiring board

A printed wiring board includes a first outer surface, a second outer surface, and an electronic circuit. The second outer surface is opposite to the first outer surface. The electronic circuit includes at least one specific design circuit block and at least one common design circuit block. The at least one specific design circuit block is provided on the first outer surface and designed in accordance with a specification of a device to which the printed wiring board is applied. The at least one common design circuit block is for a common use regardless of the specification of the device. The at least one common design circuit block is provided on the second outer surface.

Method and electronic assembly for manufacturing and detaching electronic components

COPPER FOIL COMPOSITE, MOLDED BODY, AND METHOD FOR PRODUCING SAME

COMPONENT VERTICAL MOUNTING

A circuit component arrangement includes a base and a plurality of circuit components mounted to the base. A bonding agent adheres the circuit components in intimate contact to the base. The bonding agent is disposed in a respective open channel defined in an outward facing surface of the base in contact with each of the circuit components. A method of assembling a circuit component arrangement includes temporarily fastening a plurality of circuit components to a base. A bonding agent is injected into a respective open channel defined in the base to adhere each of the plurality of circuit components to the base. The plurality of circuit components are unfastened from the base. Injecting a bonding agent can include ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.

Thermoelektrisches Generatormodul, Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates

Die Erfindung betrifft ein thermoelektrisches Generatormodul mit einem Heiß- und Kaltbereich (1a, 1b) umfassend zumindest ein erstes, dem Heißbereich zugeordnetes Metall-Keramik-Substrat (2) mit einer ersten Keramikschicht (6) und wenigstens einer auf der ersten Keramikschicht (6) aufgebrachten, strukturierten ersten Metallisierung (4) und zumindest ein zweites, dem Kaltbereich (1b) zugeordnetes Metall-Keramik-Substrat (4) mit einer zweiten Keramikschicht (7) und wenigstens einer auf der zweiten Keramikschicht aufgebrachten, strukturierten zweiten Metallisierung (5) sowie mehreren zwischen der ersten und zweiten strukturierten Metallisierung (4, 5) der Metall-Keramik-Substrate (2, 3) aufgenommenen thermoelektrischen Generatorbauteilen (N, P). Besonders vorteilhaft weist das erste, dem Heißbereich (1a) zugeordnete Metall-Keramik-Substrat (2) zumindest eine Stahl- oder Edelstahlschicht (8) aufweist, wobei die erste Keramikschicht (6) zwischen der ersten strukturierten Metallisierung (4) und ...

WÄRMEÜBERTRAGUNGSSYSTEM FÜR EINE ELEKTRONISCHE VORRICHTUNG UND SICH DARAUF BEZIEHENDE VERFAHREN

Es wird eine Technologie zur Wärmeübertragung bei elektronischen Vorrichtungen offenbart. Bei einem Beispiel kann eine Baugruppe einer elektronischen Vorrichtung ein Substrat aufweisen. Die Baugruppe der elektronischen Vorrichtung kann auch eine Wärmeübertragungskomponente aufweisen. Die Baugruppe der elektronischen Vorrichtung kann ferner eine Wärme erzeugende elektronische Komponente aufweisen, die mit dem Substrat gekoppelt ist und sich zwischen dem Substrat und der Wärmeübertragungskomponente befindet. Die Baugruppe der elektronischen Vorrichtung kann auch ein viskoses Wärmeübergangsmaterial (TIM) aufweisen, das einen Wärmeübertragungsweg zwischen der elektronischen Komponente und der Wärmeübertragungskomponente bereitstellt. Zusätzlich kann die Baugruppe der elektronischen Vorrichtung eine Barriere um zumindest einen Teil einer Peripherie des viskosen TIM aufweisen, um das viskose TIM innerhalb einer eingeschlossenen Stelle in der Nähe der elektronischen Komponente zu halten. Das TIM ...

Steuerungsplatine für eine Leistungswandlervorrichtung

Eine Steuerungsplatine für eine Leistungswandlervorrichtung weist auf: einen Platinenkörper, welcher eine Mehrschichtplatine ist, einen ersten Schaltkreisabschnitt, welcher auf einer ersten Oberfläche des Platinenkörpers montiert ist und eine Wärmeerzeugungskomponente aufweist, einen zweiten Schaltkreisabschnitt, welcher auf der ersten Oberfläche des Platinenkörpers montiert ist, wobei der zweite Schaltkreisabschnitt eine Spannung verwendet, welche sich von einer Spannung des ersten Schaltkreisabschnittes unterscheidet, einen Isolierbereich, welcher auf der ersten Oberfläche des Platinenkörpers ausgeformt ist, wobei der Isolierbereich eine Isolation durchführt zwischen dem ersten Schaltkreisabschnitt und dem zweiten Schaltkreisabschnitt, und ein Muster aus einem thermisch leitenden Material, welches auf einer inneren Schicht des Platinenkörpers ausgeformt ist, und sich in einem Bereich erstreckt, welcher mit dem Isolierbereich überlappt bei Betrachtung aus einer Richtung, welche orthogonal ...

Circuit substrate and semiconductor device

To improve a TCT characteristic of a circuit substrate. The circuit substrate comprises a ceramic substrate including a first and second surfaces, and first and second metal plates respectively bonded to the first and second surfaces via first and second bonding layers. A three-point bending strength of the ceramic substrate is 500 MPa or more. At least one of L1/H1 of a first protruding portion of the first bonding layer and L2/H2 of a second protruding portion of the second bonding layer is 0.5 or more and 3.0 or less. At least one of an average value of first Vickers hardnesses of 10 places of the first protruding portion and an average value of second Vickers hardnesses of 10 places of the second protruding portion is 250 or less.

HEATING OR COOLING APPARATUS-INTEGRATED HEAT SINK FOR A COMPUTING DEVICE

A computing device includes a heat dissipation component, a heating or cooling apparatus, and a printed circuit board. The heating or cooling apparatus includes a heating or cooling component and a wire, and the heating or cooling component is affixed to a surface of the heat dissipation component. The printed circuit board includes a printed circuit board component, and the heat dissipation component is affixed to the printed circuit board component and configured to heat or cool the printed circuit board component.

New energy automobile copper-based circuit board and manufacturing method thereof

Thermoelectrically separated type PCB member and processing method thereof

수지 조성물, 프리프레그, 금속박 피복 적층판, 및 프린트 배선판

... 실리콘 원자 함유 비율이 9 ∼ 23 질량％ 이고, 알루미늄 원자 함유 비율이 21 ∼ 43 질량％ 이고, 평균 입자경 (D50) 이 0.5 ∼ 10 ㎛ 인 알루미노실리케이트 (A) 를 함유하는 무기 충전재 (B) 와, 에폭시 수지 (C), 시안산에스테르 화합물 (D), 말레이미드 화합물 (E), 페놀 수지 (F), 아크릴 수지 (G), 폴리아미드 수지 (H), 폴리아미드이미드 수지 (I), 및 열경화성 폴리이미드 수지 (J) 로 이루어지는 군에서 선택되는 어느 1 종 이상의 열경화성 화합물을 함유하고, 상기 무기 충전재 (B) 의 함유량이, 수지 고형분 100 질량부에 대해 250 ∼ 800 질량부인 수지 조성물.

COMPOSITE PHASE CHANGE MATERIAL, APPLICATION METHOD OF COMPOSITE PHASE CHANGE MATERIAL, AND BATTERY

A composite phase change material, including 65 to 80 parts of a phase change material and 20 to 35 parts of a binder by weight. The binder includes an acrylate monomer having a molecular weight of 50 to 300, an acrylate polymer having a molecular weight of 500 to 2000, and an initiator. The initiator in the composite phase change material can generate free radicals under the condition of ultraviolet light irradiation to initiate polymerization reactions between components of the composite phase change material, so that the composite phase change material is cured, thereby greatly accelerating a cure speed of the composite phase change material.

Heat radiation adhesive, heat radiation sheet using same, and electronic device having same

conjunto elétrico

SEMICONDUCTOR DEVICE

A semiconductor device, while being small, makes it possible to achieve low inductance responding to high speed switching. The semiconductor device includes a plurality of conductive pattern members, on each of which is mounted one or a plurality of power semiconductor chips, and a printed circuit board wherein a chip rod-form conductive connection member connected to the power semiconductor chip and a pattern rod-form conductive connection member connected to the conductive pattern member are disposed on the surface opposing the conductive pattern member. The conductive pattern member is formed of a narrow portion and a wide portion, the narrow portion of at least one conductive pattern member and the printed circuit board are connected by the pattern rod-form conductive connection member, and a current path is formed between the conductive pattern member and the power semiconductor chip connected via the chip rod-form conductive connection member to the printed circuit board.

CIRCUIT SUBSTRATE AND SEMICONDUCTOR DEVICE

The use of pressurized air or gas cooling the conductive traces

Thermal expansion suppressing member and anti-thermally-expansive member

Provided are a thermal expansion suppressing member having negative thermal expansion properties and a metal-based anti-thermally-expansive member having small thermal expansion. More specifically, provided are a thermal expansion suppressing member, including at least an oxide represented by the following general formula (1), and an anti-thermally-expansive member, including a metal having a positive linear expansion coefficient at 20° C., and a solid body including at least an oxide represented by the following general formula (1), the metal and solid being joined to each other: (Bi 1-x M x )NiO 3 (1) where M represents at least one metal selected from the group consisting of La, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Y, and In; and x represents a numerical value of 0.02≦x≦0.15.

Buffer Layer to Enhance Photo and/or Laser Sintering

Conductive lines are deposited on a substrate to produce traces for conducting electricity between electronic components. A patterned metal layer is formed on the substrate, and then a layer of material having a low thermal conductivity is coated over the patterned metal layer and the substrate. Vias are formed through the layer of material having the low thermal conductivity thereby exposing portions of the patterned metal layer. A film of conductive ink is then coated over the layer of material having the low thermal conductivity and into the vias to thereby coat the portions of the patterned metal layer, and then sintered. The film of conductive ink coated over the portion of the patterned metal layer does not absorb as much energy from the sintering as the film of conductive ink coated over the layer of material having the low thermal conductivity. The layer of material having the low thermal conductivity may be a polymer, such as polyimide.

Reducing thermal gradients to improve thermopile performance

With infrared (IR) sensors, repeatability and accuracy can become an issue when there are thermal gradients between the sensor and an underlying printed circuit board (PCB). Conventionally, a large thermal mass is included in the sensor packaging to reduce the effect from such thermal gradients, but this increase costs and size of the sensor. Here, however, a PCB is provided that includes an isothermal cage included therein that generally ensures that the temperature of the underlying PCB and sensor are about the same by including structural features (namely, the isothermal cage) that generally ensure that the thermal time constant for a path from a heat source to the thermopile (which is within the sensor) is approximately the same as thermal time constants for paths through the PCB.

Ceramic/metal composite structure and method of manufacturing the same

A ceramic/metal composite structure includes an aluminum oxide substrate, an interface bonding layer and a copper sheet. The interface bonding layer is disposed on the aluminum oxide substrate. The copper sheet is disposed on the interface bonding layer. The interface bonding layer bonds the aluminum oxide substrate to the copper sheet. Some pores are formed near or in the interface bonding layer. A porosity of the interface bonding layer is substantially smaller than or equal to 25%. A method of manufacturing the ceramic/metal composite structure is also provided.

Method of arranging components of circuit board for optimal heat dissipation and circuit apparatus having components arranged by performing the method

A method of arranging a plurality of components of a circuit board for optimal heat dissipation and a circuit apparatus having a plurality of components arranged by performing the method are provided. The method includes arranging a predetermined number of the plurality of components in the order of size of the components in a heat dissipation area having a predetermined width on a virtual straight line connecting the air inlet unit and the air outlet unit.

Multilayered printed circuit board and manufacturing method thereof

An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22 , the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20 a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Cooling device

The invention relates to a cooling device for an electric energy supply ( 2 ), comprising at least one first heat-dissipating part ( 3 ), the power components ( 4 ) of which are connected to the cooling device ( 1 ) in a thermally conductive manner, wherein a fluid-conducting connection ( 5 ) conducts liquid coolant ( 6 ) from a pump ( 7 ) to a cooler ( 8 over the first heat-dissipating part ( 3 ), wherein one shut-off unit ( 9′, 9 ) each is arranged in the fluid-conducting connection ( 5 ) at least between the first heat-dissipating part ( 3 ) and the cooler ( 8 ) and between the pump ( 7 ) and the first heat-dissipating part ( 3 ). The cooling device is characterized in that, in order to avoid an overpressure in at least one part ( 3, 14 ) to be cooled, at least one pressure limiting valve ( 17, 28 ) is provided, which is arranged in connection with the fluid conductor inside the part ( 3, 14 ) and/or, as part of a unit ( 15 ) for preloading the cooling liquid ( 6 ) in the fluid-conducting connection ( 5 ), is connected to the part ( 3, 14 ) by means of the pressure sure side of a check valve ( 13 ) provided downstream of the part ( 3, 14 ).

Circuit board, semiconductor device, process for manufacturing circuit board and process for manufacturing semiconductor device

A circuit board ( 1 ) exhibits an average coefficient of thermal expansion (A) of the first insulating layer ( 21 ) in the direction along the substrate surface in a temperature range from 25 degrees C. to its glass transition point of equal to or higher than 3 ppm/degrees C. and equal to or lower than 30 ppm/degrees C. Further, an average coefficient of thermal expansion (B) of the second insulating layer ( 23 ) in the direction along the substrate surface in a temperature range from 25 degrees C. to its glass transition point is equivalent to an average coefficient of thermal expansion (C) of the third insulating layer ( 25 ) in the direction along the substrate surface in a temperature range from 25 degrees C. to its glass transition point. (B) and (C) are larger than (A), and a difference between (A) and (B) and a difference between (A) and (C) are equal to or higher than 5 ppm/degrees C. and equal to or lower than 35 ppm/degrees C.

Laminated and sintered ceramic circuit board, and semiconductor package including the circuit board

A circuit board that can decrease thermal stress acting between a semiconductor element and a board in association with temperature alteration and has high mechanical strength (rigidity) as a whole board (including a multilayer wiring layer) is provided. Ceramic base material having a coefficient of thermal expansion close to that of a semiconductor element and inner layer wiring are integrally sintered, and the circuit board is configured so that fine-lined conductor structure corresponding to a multilayer wiring layer in the inner layer wiring has predetermined width, intralayer interval and interlayer interval. Thereby, thermal stress acting between a semiconductor element and the board when the board is exposed to temperature alteration in a condition where it is joined with the semiconductor element is suppressed, rigidity of the board is maintained, and its reliability against temperature cycle is increased.

Disc comprising an electrical connection element

The present invention relates to a pane with an electrical connection element, comprising: a substrate made of glass ( 1 ), an electrically conductive structure ( 2 ) with a layer thickness of 5 μm to 40 μm on a region of the substrate ( 1 ), a connection element ( 3 ), and a layer of a solder material ( 4 ), which electrically connects the connection element ( 3 ) to a portion ( 12 ) of the electrically conductive structure ( 2 ), wherein the connection element ( 3 ) contains at least an iron-nickel alloy or an iron-nickel-cobalt alloy, the connection element ( 3 ) is connected to the portion ( 12 ) of the electrically conductive structure ( 2 ) via a contact surface ( 11 ) over its entire surface, and the contact surface ( 11 ) has no corners.

Method for partially stripping a defined area of a conductive layer

A method for partial detachment of a defined area of a conductive layer using a laser beam includes forming a conductor track with a defined path from the conductive layer on the substrate, the path defining main axes. The area is segmented into zones. A linear recess is provided along a respective perimeter of each of the zones. Each of the zones has a strip shape such that the recesses extend along paths that are substantially straight lines not parallel to either of the main axes. One of the zones to be removed is heated using laser radiation until adhesion of the conductive layer to the substrate is substantially reduced and the zone to be removed is detached in a surface-wide manner from the substrate under external influences. Laser-beam parameters are set such that only the conductive layer is removed without affecting an underlying substrate.

Mitigation of block bending in a ring laser gyroscope caused by thermal expansion or compression of a circuit board

An apparatus includes a sheet of circuit board material, at least one electrically conductive trace positioned on the sheet of circuit board material, and at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically conductive trace. The apparatus further includes at least one deformation point configured to absorb stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to an object resisting expansion or compression.

Reducing thermal gradients to improve thermopile performance

With infrared (IR) sensors, repeatability and accuracy can become an issue when there are thermal gradients between the sensor and an underlying printed circuit board (PCB). Conventionally, a large thermal mass is included in the sensor packaging to reduce the effect from such thermal gradients, but this increase costs and size of the sensor. Here, however, a PCB is provided that includes an isothermal cage included therein that generally ensures that the temperature of the underlying PCB and sensor are about the same by including structural features (namely, the isothermal cage) that generally ensure that the thermal time constant for a path from a heat source to the thermopile (which is within the sensor) is approximately the same as thermal time constants for paths through the PCB.

Semiconductor package, semiconductor apparatus and method for manufacturing semiconductor package

A semiconductor package includes: a metal plate including a first surface, a second surface and a side surface; a semiconductor chip on the first surface of the metal plate, the semiconductor chip comprising a first surface, a second surface and a side surface; a first insulating layer that covers the second surface of the metal plate; a second insulating layer that covers the first surface of the metal plate, and the first surface and the side surface of the semiconductor chip; and a wiring structure on the second insulating layer and including: a wiring layer electrically connected to the semiconductor chip; and an interlayer insulating layer on the wiring layer. A thickness of the metal plate is thinner than that of the semiconductor chip, and the side surface of the metal plate is covered by the first insulating layer or the second insulating layer.

Semiconductor package module

Disclosed herein is a semiconductor package module, including: a circuit board having connection pads formed on one surface thereof; a semiconductor package including lead terminals protruded out of a housing; and an interposer positioned between the circuit board and the semiconductor package, the interposer including a body allowing the circuit board and the semiconductor package to be spaced apart from each other and elastic members contacted with the connection pads and the lead terminals.

Printed circuit board and method for manufacturing the same

Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a core reinforcement having stiffness; insulating layers formed on both surfaces of the core reinforcement; a through hole formed by penetrating through the insulating layer and the core reinforcement; and a circuit layer formed on the insulating layer and a plating layer formed in the through hole for implementing inter-layer connection of the circuit layers.

Light emitting package

The present invention discloses a light emitting package, including: a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; a screen member having an opening and disposed on the base adjacent to the light emitting device; and a lens covering the light emitting device, wherein a width of a cross-sectional shape of the screen member is larger than a height of the cross sectional shape of the screen member, wherein the lens is disposed on the screen member, and wherein the lens is connected to an uppermost surface of the screen member.

Phase Shifter, Antenna, and Base Station

The present disclosure relates to phase shifters, antennas, and base stations. One example phase shifter includes a cavity, a built-in printed circuit board (PCB), and a stress relief portion. The stress relief portion is connected to the PCB, and the stress relief portion is configured to reduce a stress generated due to different coefficients of thermal expansion (CTE) of the cavity and the PCB. 1. A phase shifter , comprising a cavity and a built-in printed circuit board (PCB) , wherein the phase shifter further comprises:a stress relief portion, wherein the stress relief portion is connected to the PCB, and wherein the stress relief portion is configured to reduce a stress generated due to different coefficients of thermal expansion (CTE) of the cavity and the PCB.2. The phase shifter according to claim 1 , wherein the stress relief portion comprises:a structural connection portion, wherein the structural connection portion is structurally connected to a second strip on the PCB, wherein a first strip and the second strip are independent of each other, and wherein the first strip is used for internal conduction of the phase shifter.3. The phase shifter according to claim 2 , wherein the structural connection portion is adjacent to a solder joint.4. The phase shifter according to claim 1 , wherein the stress relief portion comprises:an elastic mechanical part, wherein the elastic mechanical part is electrically connected to a first strip on the PCB, and wherein the first strip is used for internal conduction of the phase shifter.5. The phase shifter according to claim 4 , wherein a shape of the elastic mechanical part comprises at least one of an H-shape claim 4 , a W-shape claim 4 , a V-shape claim 4 , a zigzag claim 4 , an inverted V-shape claim 4 , or a fold line shape.6. An antenna claim 4 , comprising a phase shifter claim 4 , wherein the phase shifter comprises a cavity claim 4 , a built-in printed circuit board (PCB) claim 4 , and a stress relief portion ...

ELECTRONIC-COMPONENT-MOUNTED MODULE

An electronic-component-mounted module has an electronic component, a first silver-sintered bonding layer bonded on one surface of the electronic component, a circuit layer made of copper or copper alloy and bonded on the first silver-sintered bonding layer, and a ceramic substrate board bonded on the circuit layer, and further has an insulation circuit substrate board with smaller linear expansion coefficient than the electronic component, a second silver-sintered bonding layer bonded on the other surface of the electronic component, and a lead frame with smaller linear expansion coefficient than the electronic component bonded on the second silver-sintered bonding layer; and a difference in the linear expansion coefficient between the insulation circuit substrate board and the lead frame is not more than 5 ppm/° C. 1. Electronic-component-mounted module comprising:an electronic component;a first silver-sintered bonding layer bonded on one surface of the electronic component;an insulation circuit substrate board comprising a circuit layer made of copper or copper alloy bonded on the first silver-sintered bonding layer and a ceramic substrate board bonded on the circuit layer, and having a smaller linear expansion coefficient than the electronic component;a second silver-sintered bonding layer bonded on the other surface of the electronic component; anda lead frame bonded on the second silver-sintered bonding layer and having a smaller linear expansion coefficient than the electronic component, wherein a difference in the linear expansion coefficient to the insulation circuit substrate board is not more than 5 ppm/° C.2. The electronic-component-mounted module according to claim 1 , wherein a thickness of the circuit layer is t1; a thickness of the lead frame is t2; and a thickness ratio of the thickness t1 and the thickness t2 is not less than 0.2 and not more than 5.0.3. The electronic-component-mounted module according to claim 1 , wherein the lead frame is made ...

SEMICONDUCTOR ASSEMBLIES INCLUDING THERMAL CIRCUITS AND METHODS OF MANUFACTURING THE SAME

Semiconductor assemblies including thermal layers and associated systems and methods are disclosed herein. In some embodiments, the semiconductor assemblies comprise one or more semiconductor devices over a substrate. The substrate includes a thermal layer configured to transfer thermal energy along a lateral plane and across the substrate. The thermal energy is transferred along a non-lateral direction from the semiconductor device to the graphene layer using one or more thermal connectors. 1. A semiconductor assembly , comprising:a substrate;a semiconductor device over the substrate; anda thermal connector between and directly contacting opposing surfaces of the substrate and the semiconductor device, the thermal connector being configured to transfer thermal energy between the substrate and the semiconductor device;wherein:the substrate includes a graphene layer thermally coupled to the thermal connector and configured to transfer the thermal energy along a horizontal direction across the substrate.2. The semiconductor assembly of claim 1 , further comprising a heat spreader over the substrate and thermally coupled to the graphene thermal layer for receiving and dissipating the thermal energy from the semiconductor device.3. The semiconductor assembly of claim 2 , wherein the heat spreader and the semiconductor device are separated by a distance along the horizontal direction.4. The semiconductor assembly of claim 1 , wherein the substrate is a printed circuit board (PCB) including an external layer above or below the graphene layer.5. The semiconductor assembly of claim 4 , wherein the graphene layer is a core of the PCB.6. The semiconductor assembly of claim 4 , further comprising a core extending parallel to the graphene layer claim 4 , wherein the graphene layer is disposed between the core and the external layer.7. The semiconductor assembly of claim 1 , wherein:the substrate and the semiconductor device comprise a module; andfurther comprising:a second ...

CIRCUIT ASSEMBLY AND ELECTRICAL JUNCTION BOX

Provided is a circuit assembly that enables suppression of a decrease in heat dissipation properties. A circuit assembly includes a circuit board having a conductive path, a heat dissipation member on which the circuit board is placed, and an insulating layer that is interposed between the circuit board and the heat dissipation member. A surface of the heat dissipation member that faces the circuit board is a rough surface having protrusions and recessions, and the circuit board and the heat dissipation member are fixed to each other by the insulating layer penetrating the protrusions and recessions of the rough surface. 1. A circuit assembly comprising:a circuit board having a conductive path;a heat dissipation member on which the circuit board is placed; andan insulating layer that is interposed between the circuit board and the heat dissipation member,wherein a surface of the heat dissipation member that faces the circuit board is a rough surface having protrusions and recessions, andthe circuit board and the heat dissipation member are fixed to each other by the insulating layer penetrating the protrusions and recessions of the rough surface.2. The circuit assembly according to claim 1 , wherein the rough surface is formed by chemical processing or laser processing.3. The circuit assembly according to claim 1 , wherein the circuit board is fastened to the insulating layer with a fixing member.4. The circuit assembly according to claim 3 , wherein a fixed portion for fixation of a terminal of the circuit board with the fixing member is formed in the insulating layer.5. The circuit assembly according to claim 1 , wherein a connector housing in which a terminal of the circuit board is accommodated is formed in the insulating layer.6. The circuit assembly according to claim 1 ,wherein electronic components constituted by a plurality of low-heat generating components and a plurality of high-heat generating components that generate more heat than the plurality of low- ...

HEAT DISSIPATION DEVICE FOR ELECTRONIC SYSTEM

An electronic system includes an electronic component, a heat dissipation device coupled on the electronic component and a retaining device around the electronic component. The heat dissipation device includes a base configured to contact the electronic component and a plurality of fins extending from the base. The base includes a coupling face forming a plurality of screw threads thereon. The retaining device includes at least a coupling face. The coupling face of the retaining device forms a plurality of screw threads for engaging with the screw threads of the coupling face of the base. 1. An electronic system comprising:an electronic component;a heat dissipation device coupled on the electronic component, the heat dissipation device comprising a base configured to contact the electronic component and a plurality of fins extending from the base, wherein the base comprises a coupling face forming a plurality of screw threads thereon; anda retaining device positioned around the electronic component and comprising at least a coupling face, the coupling face of the retaining device forming a plurality of screw threads for engaging with the screw threads of the coupling face of the base.2. The electronic system of claim 1 , wherein the retaining device comprises a plurality of coupling blocks extending toward the heat dissipation device claim 1 , the coupling face of the retaining device being a face of each of the coupling blocks.3. The electronic system of claim 2 , wherein the retaining device further comprises a base plate claim 2 , the plurality of coupling blocks extending from the base plate claim 2 , the base plate defining an opening exposing the electronic component outwards.4. The electronic system of claim 3 , wherein the plurality of coupling blocks are positioned around the opening.5. The electronic system of claim 3 , wherein the coupling faces of the coupling blocks positioned located on a circumferential face of an imaginary cylinder.6. The electronic ...

HEATSINK AND CIRCUIT BOARD WITH HEATSINK

A heatsink to be mounted on a circuit board including a plurality of electronic parts is constituted of a conductive and rectangular plate-shaped member, and mounted on the circuit board such that a main surface of the heatsink blocks an airflow generated on the circuit board, the heatsink being electrically grounded. The main surface includes a contacting portion disposed in contact with the circuit board and an isolated portion separated from the circuit board, the isolated portion being cut into two parts along a straight line extending in a direction away from the circuit board. The two parts are each bent such that an end portion on a side of the straight line is oriented to a downstream side of the airflow, so that an opening is defined between the respective end portions of the two parts on the side of the straight line. 1. A heatsink for use in a circuit board including a plurality of electronic parts , the heatsink being constituted of a conductive and rectangular plate-shaped member , and mounted on the circuit board such that a main surface of the heatsink blocks an airflow generated on the circuit board , the heatsink being electrically grounded ,wherein the main surface includes a contacting portion disposed in contact with the circuit board and an isolated portion separated from the circuit board, the isolated portion being cut into two parts along a straight line extending in a direction away from the circuit board, andthe two parts are each bent such that an end portion on a side of the straight line is oriented to a downstream side of the airflow, so that an opening is defined between the respective end portions of the two parts on the side of the straight line.2. The heatsink according to claim 1 ,wherein the two parts are each bent about an end portion opposite to the end portion on the side of the straight line, so that the opening is defined in a central region of the isolated portion.3. The heatsink according to claim 2 ,wherein the two parts ...

IMAGE CAPTURING DEVICE

An image capturing device includes a circuit board, an image capturing module, a light source module disposed on the circuit board and a connection body disposed above the light source module. The image capturing module has a first lens set and a second lens set disposed on the circuit board. The connection body has a first connection section having a first open end and a second open end. The first open end of the first connection section abuts against the light-emitting component or the upper side of the circuit board in adjacency to the light-emitting component. The first and second open ends together define a first light passage. The light-emitting component is positioned in the first light passage. The image capturing device can effectively avoid light leakage of the image. 1. An image capturing device comprising:a circuit board having an upper side and a lower side;an image capturing module having a first lens set and a second lens set, the first and second lens sets being respectively disposed on the upper side of the circuit board and electrically connected therewith;a light source module having an light-emitting component disposed on the upper side of the circuit board and electrically connected therewith; anda connection body correspondingly disposed above the light source module, the connection body having a first connection section, the first connection section having a first open end and a second open end corresponding to the first open end, the first open end abutting against the light-emitting component or the upper side of the circuit board in adjacency to the light-emitting component, the first and second open ends together defining a first light passage, the light-emitting component being positioned in the first light passage.2. The image capturing device as claimed in claim 1 , wherein the light-emitting component has a base seat and a lens disposed on the base seat claim 1 , the first open end outward extending from the connection body to abut ...

ACTIVE HEATSINK LID

An active device lid for a device base. The device lid includes a heatsink proximate to a circuit assembly and configured to remove heat generated by the device base, the circuit assembly configured to generate an operating signal voltage for the device base, and a connector configured to connect the circuit assembly to the device base, where the device base is configured to connect to a device mounting substrate on a substrate side of the device base, and where the circuit assembly is configured to be at least partially located on an opposing side of the device base, the opposing side opposing the substrate side. 1. A device lid for a device base , the device lid comprising:a heatsink proximate to a circuit assembly and configured to remove heat generated by the device base;the circuit assembly configured to generate an operating signal voltage for the device base; anda connector configured to connect the circuit assembly to the device base,wherein the device base is configured to connect to a device mounting substrate on a substrate side of the device base, andwherein the circuit assembly is configured to be at least partially located on an opposing side of the device base, the opposing side opposing the substrate side.2. The device lid of claim 1 ,wherein the heatsink comprises a first portion for collecting the heat from the device base and a second portion for releasing the heat into an ambient space,wherein the circuit assembly is interposed between the first portion and the second portion of the heatsink.3. The device lid of claim 2 ,wherein the heatsink penetrates an opening in the circuit assembly to connect to the device base.4. The device lid of claim 3 , further comprising:an input connector configured to receive a system signal voltage, wherein the system signal voltage is used by the circuit assembly to generate the operating signal voltage; andan output connector configured to provide the operating signal voltage to the device base,wherein the input ...

Electronic device and method for producing an electronic device

The invention relates to an electronic device comprising a printed circuit board () and comprising an electronic component () arranged on a first surface () of the printed circuit board (). The printed circuit board () has a cutout () extending from a second surface () of the printed circuit board (), said second surface being situated opposite the first surface (), in the direction of the electronic component (). The electronic device comprises a coolant container (), which has an opening closed by the second surface () of the printed circuit board (). The invention additionally relates to a method for producing such an electronic device. 1. An electronic device comprising:a printed circuit board;an electronic component arranged on a first surface of the printed circuit board;the printed circuit board has a cutout extending from a second surface of the printed circuit board, the second surface being situated opposite the first surface, in the direction of the electronic component; anda coolant container which has an opening closed by the second surface of the printed circuit board.2. The electronic device as claimed in claim 1 , wherein the material thickness of the printed circuit board in the region of the cutout is less than 50% claim 1 , preferably less than 30% claim 1 , more preferably less than 20% claim 1 , with respect to the thickness of the printed circuit board.3. The electronic device as claimed in claim 1 , wherein the cutout has side faces aligned perpendicularly to the plane of the printed circuit board.4. The electronic device as claimed in claim 1 , wherein the cutout overlaps the electronic component in a direction perpendicular to the plane of the printed circuit board.5. The electronic device as claimed in claim 1 , wherein the opening of the coolant container is larger than the cutout of the printed circuit board.6. The electronic device as claimed in claim 1 , wherein the cutout is arranged completely within the opening of the coolant ...

Heat Sink With Protrusions On Multiple Sides Thereof And Apparatus Using The Same

Examples of a thermal management unit and an electronic apparatus utilizing the thermal management unit are described. In one aspect, the thermal management unit includes a heat sink. The heat sink includes a base portion, a first protrusion structure and a second protrusion structure. The base portion has a first side and a second side opposite the first side. The first protrusion structure protrudes from the first side of the base portion, and includes multiple fins. The second protrusion structure protrudes from the second side of the base portion, and includes multiple ribs. The heat sink may be made of silicon.

ELECTRONIC UNIT AND METHOD OF MAKING THE SAME

A digital amplifier integrated circuit (“IC”), which is a heat-generating electronic component, is mounted on an upper surface of an insulating substrate. The digital amplifier IC is disposed inside a recess of a heat sink. The heat sink includes a peripheral wall having an end face placed on the upper surface of the insulating substrate. A hot-melt resin layer, molded by hot-melt molding, covers the upper surface of the insulating substrate. The hot-melt resin layer is in contact with a side face of the peripheral wall and retains the heat sink on the insulating substrate. The recess of the heat sink has no hot-melt resin therein. 1. An electronic unit comprising:a substrate;a heat-generating electronic component mounted on the substrate;a heat sink disposed on the heat-generating electronic component; anda hot-melt resin layer disposed on the substrate,wherein the heat sink includes an upper part that serves as a radiating portion and a lower part that has a recess facing downward and that includes a peripheral wall surrounding the recess and having an end face and a side face, the recess of the heat sink covering the heat-generating electronic component, and the end face of the peripheral wall of the heat sink placed on a surface of the substrate,wherein the hot-melt resin layer covers at least part of the surface of the substrate and at least part of the side face of the peripheral wall of the heat sink, andwherein the peripheral wall separates the heat-generating electronic component from the hot-melt resin layer.2. The unit according to claim 1 , wherein the heat sink is fixed to the surface of the substrate by adhesion of the hot-melt resin layer.3. The unit according to claim 2 ,wherein the end face of the peripheral wall is placed on the surface of the substrate with an adhesive layer in between, andwherein the hot-melt resin layer retains the heat sink on the substrate with a force greater than a force with which the adhesive layer retains the heat sink on ...

ELECTRONIC SWITCH MODULE WITH AN INTEGRATED FLYBACK DIODE

An electronic module is provided including power switches mounted on a circuit board and configured as an inverter circuit for an electric motor. A sliding member is coupled to an actuator. A power contact switch is provided including a first conductive body, a second conductive body, and a contact switch. The first and second conductive bodies are mounted on a first surface of the circuit board and include pins received through through-holes of the circuit board to make electrical contact with two conductive tracks on a second surface of the circuit board. The contact switch pivotably is secured to the first conductive body and pivotably moveable by the sliding member to make contact with the second conductive body with movement of the actuator. A flyback diode is electrically connected between the first and second conductive track on the second surface of the circuit board parallel to the power contact switch. 1. An electronic module comprising:a circuit board defining a longitudinal axis and having a first surface and a second surface;a plurality of power switches mounted on the circuit board and configured as an inverter circuit to supply electric power from a power supply to an electric motor;a sliding member coupled to an actuator, the actuator causing movement of the sliding member in a direction substantially perpendicular to the longitudinal axis of the circuit board;a first conductive body mounted on the first surface of the circuit board, the first conductive body including a terminal tab coupled to a positive node of the power supply and a first pin received through a first through-hole of the circuit board to make electrical contact with a first conductive track on the second surface of the circuit board;a second conductive body mounted on the first surface of the circuit board, the second conductive body including a second pin received through a second through-hole of the circuit board to make electrical contact with a second conductive track on the ...

COMPOSITE CARRIER FOR WARPAGE MANAGEMENT

A composite carrier is disclosed for warpage management as a temporary carrier in semiconductor process. Warpage is reduced for a product, semi-product, or build-up layer processed on the temporary composite carrier which is peeled off the temporary carrier in a later step. The composite carrier comprises a top substrate and a bottom substrate, an adhesive layer is configured in between the top substrate and a bottom substrate. One of the embodiments discloses the top substrate of the composite carrier having a lower CTE and the bottom substrate of the composite carrier having a higher CTE. 1. A composite carrier for fabricating a build-up circuitry thereon , comprising:a polymer;a top substrate;a bottom substrate below the top substrate; andan adhesive layer between the top substrate and the bottom substrate, the adhesive layer bonding the top substrate to the bottom substrate; [ top and bottom surfaces opposite to each other in a thickness direction of the composite carrier, and', 'a side surface extending in the thickness direction and connecting the top and bottom surfaces,, 'each of the top substrate, the bottom substrate and the adhesive layer has'}, 'the top surface of the top substrate includes an area for semiconductor processing thereon,', 'the polymer wraps around the side surface of each of the top substrate, the adhesive layer and the bottom substrate,', 'the area for semiconductor processing on the top surface of the top substrate is free of the polymer, and', 'in a cross-section taken in a plane perpendicular to the top surface of the top substrate, the polymer has an outer surface curved and convex outwardly away from the top substrate, the adhesive layer and the bottom substrate., 'wherein'}2. The composite carrier as claimed in claim 1 , whereinthe top substrate has a lower CTE and the bottom substrate has a higher CTE.3. The composite carrier as claimed in claim 1 , wherein Invar having a coefficient of thermal expansion (CTE) around 1 ppm,', ' ...

Grid Arrays With Enhanced Fatigue Life

Reliability is improved for the mechanical electrical connection formed between a grid array device, such as a pin grid array device (PGA) or a column grid array device (CGA), and a substrate such as a printed circuit board (PCB). Between adjacent PCB pads, a spacing pattern increases toward the periphery of the CGA, creating a misalignment between pads and columns. As part of the assembly method, columns align with the pads, resulting in column tilt that increases from the center to the periphery of the CGA. An advantage of this tilt is that it reduces the amount of contractions and expansions of columns during thermal cycling, thereby increasing the projected life of CGA. Another advantage of the method is that it reduces shear stress, further increasing the projected life of the CGA. 1. A method of assembling an electronic component onto a printed circuit board comprising:placing an array of pads on the printed circuit board;applying connective material to the pads;providing the electronic component, having an array of conducting posts, pads of the array of pads being misaligned with conducting posts of the array of conducting posts;mounting the electronic component to the circuit board with the array of conducting posts connected to the array of pads with ends of the conducting posts drawn into closer alignment with the pads, conducting posts of the array of conducting posts being angled from the electronic component to the circuit board when at 20 degrees Celsius.2. The method of claim 1 , wherein connecting pads connected to angled posts outside of a centermost region of the electronic component have a lesser pad thickness than the connecting pads in the centermost region.3. The method of claim 1 , wherein peripheral conducting posts of the array are angled outwardly from a center of the electronic component to the circuit board.4. The method of claim 1 , wherein a board coefficient of expansion is greater than an electronic component coefficient of thermal ...

PRINTED CIRCUIT BOARD FOR INTEGRATED LED DRIVER

A multi-layer metal core printed circuit board (MCPCB) has mounted on it at least one or more heat-generating LEDs and one or more devices configured to provide current to the one or more LEDs. The one or more devices may include a device that carries a steep slope voltage waveform. Since there is typically a very thin dielectric between the patterned copper layer and the metal substrate, the steep slope voltage waveform may produce a current in the metal substrate due to AC coupling via parasitic capacitance. This AC-coupled current may produce electromagnetic interference (EMI). To reduce the EMI, a local shielding area may be formed between the metal substrate and the device carrying the steep slope voltage waveform. The local shielding area may be conductive and may be electrically connected, to a DC voltage node adjacent to the one or more devices. 1. A light emitting diode (LED) module comprising:a first dielectric layer on a base metal substrate;a first patterned metal layer on the first dielectric layer;a local shielding area within the first patterned metal layer, the local shielding area comprising a substantially continuous area of conductive material;a second dielectric layer on the first patterned metal layer;a second patterned metal layer on the second dielectric layer;one or more LEDs on the second patterned metal layer, wherein the one or more LEDs are thermally coupled to the base metal substrate;one or more devices on the second patterned metal layer configured to provide a target current to the one or more LEDs, wherein a device of the one or more devices carries a steep slope voltage waveform and is located above at least a portion of the local shielding area; anda DC voltage node on the second patterned metal layer, wherein the DC voltage node is electrically connected to the local shielding area.2. The module of claim 1 , wherein the DC voltage node and the local shielding area are electrically connected by a conductive via extending through a ...

CIRCUIT BOARD ELEMENT

A circuit board element includes a glass substrate, a first dielectric layer, and a first patterned metal layer. The glass substrate has an edge. The first dielectric layer is disposed on the glass substrate and has a central region and an edge region. The edge region is in contact with the edge of the glass substrate, and the thickness of the central region is greater than the thickness of the edge region. The first patterned metal layer is disposed on the glass substrate and in the central region of the first dielectric layer. 1. A circuit board element , comprising:a glass substrate having an edge;a first dielectric layer disposed on the glass substrate and having a central region and an edge region, wherein the edge region is in contact with the edge of the glass substrate, and a thickness of the central region is greater than a thickness of the edge region;a first patterned metal layer disposed on the glass substrate and in the central region of the first dielectric layer; andan insulating protective layer disposed on the first patterned metal layer and the central region of the first dielectric layer, wherein the central region of the first dielectric layer has a first side surface, the insulating protective layer has a second side surface, and the first side surface is connected to the second side surface, and an extending line of the first side surface and the second side surface intersects the glass substrate.2. The circuit board element of claim 1 , wherein the glass substrate and the first dielectric layer are made of different materials.3. The circuit board element of claim 1 , wherein the first dielectric layer is made of ajinomoto build-up film (ABF) claim 1 , pregpreg (PP) claim 1 , polyimide (PI) claim 1 , or photoimageable dielectric (PID).4. The circuit board element of claim 1 , wherein the central region has a top surface claim 1 , the edge region has a top surface claim 1 , and the top surface of the central region and the top surface of the ...

Insulating ceramic paste, ceramic electronic componet, and method for producing the same

Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.

TECHNOLOGIES FOR SWITCHING NETWORK TRAFFIC IN A DATA CENTER

Technologies for switching network traffic include a network switch. The network switch includes one or more processors and communication circuitry coupled to the one or more processors. The communication circuitry is capable of switching network traffic of multiple link layer protocols. Additionally, the network switch includes one or more memory devices storing instructions that, when executed, cause the network switch to receive, with the communication circuitry through an optical connection, network traffic to be forwarded, and determine a link layer protocol of the received network traffic. The instructions additionally cause the network switch to forward the network traffic as a function of the determined link layer protocol. Other embodiments are also described and claimed. 1. A network switch comprising:one or more processors;communication circuitry coupled to the one or more processors, wherein the communication circuitry is to assist the one or more processors to switch network traffic of multiple link layer protocols; receive, with the communication circuitry through an optical connection, network traffic to be forwarded;', 'determine a link layer protocol of the received network traffic, wherein the received network traffic is formatted according to one of the multiple link layer protocols; and', 'forward the network traffic as a function of the determined link layer protocol to a destination network device., 'one or more memory devices having stored therein a plurality of instructions that, when executed, cause the network switch to2. The network switch of claim 1 , wherein to receive the network traffic comprises to receive network traffic through an optical connection that provides one fourth of a total bandwidth of a link.3. The network switch of claim 1 , wherein to receive the network traffic comprises to receive the network traffic from a sled coupled to the optical connection.4. The network switch of claim 3 , wherein to receive the network ...

METHOD OF JOINING COOLING COMPONENT

A disclosed method of joining a cooling component includes joining an electronic component and a spherical shaped bottom plate of a cooling component to each other by pressing the bottom plate against the electronic component, while providing a thermal bonding material between the bottom plate and the electronic component. 1. A method of joining a cooling component comprising:joining an electronic component and a spherical shaped bottom plate of a cooling component to each other by pressing the bottom plate against the electronic component, while providing a thermal bonding material between the bottom plate and the electronic component.2. The method of joining a cooling component according to claim 1 , further comprising:bulging the bottom plate into a spherical shape by supplying pressurized gas into the cooling component before the joining.3. The method of joining a cooling component according to claim 2 , wherein the bulging the bottom plate is performed while heating the bottom plate.4. The method of joining a cooling component according to claim 2 , whereinthe cooling component includes a cover thicker than the bottom plate, andthe pressurized gas is supplied into a space between the cover and the bottom plate.5. The method of joining a cooling component according to claim 4 , whereina plurality of pins are provided to stand on a surface of the bottom plate exposed to the space, andcoolant flows between the pins. This application is based upon and claims the benefit of priority of the prior Japanese Patent Application No. 2015-141793, filed on Jul. 16, 2015, the entire contents of which are incorporated herein by reference.The embodiments discussed herein are related to a method of joining a cooling component.Electronic components such as a CPU (Central Processing Unit) are mounted in electronic devices such as servers and personal computers. When the electronic components generate heat exceeding an allowable temperature, the operation of the electronic ...

Circuit structure and electrical junction box

A circuit structure includes a circuit board having a connection opening. An electronic component is mounted on a top surface side of the circuit board, and a plurality of bus bars are disposed on a bottom surface side thereof, the electronic component includes a plurality of connection terminals, and a connection terminal of the plurality of connection terminals is connected to a bus bar on the bottom surface side of the circuit board via the connection opening. The circuit structure includes a heat dissipation member provided on a side of the plurality of bus bars opposite to a surface on which the electronic component is connected, an insulating heat-transfer material having insulating properties and heat transferring properties, and a restricting member is provided between the plurality of bus bars and the heat dissipation member, and restricts movement of the insulating heat-transfer material caused by an increase in temperature.

RESIN SUBSTRATE AND ELECTRONIC DEVICE

A resin substrate includes a resin body, an interlayer connection conductor provided in the resin body, and a conductor pattern bonded to the interlayer connection conductor. The resin body includes a gap provided adjacent to or in a vicinity of a bonding portion of the interlayer connection conductor and the conductor pattern, and a contact portion that contacts the interlayer connection conductor. 1. A resin substrate comprising:a resin body including a gap;an interlayer connection conductor provided in the resin body; anda conductor pattern bonded to the interlayer connection conductor; wherein a contact portion that contacts the interlayer connection conductor;', 'a first resin layer with a first thermal expansion coefficient; and', 'a second resin layer with a second thermal expansion coefficient;, 'the resin body includesthe first thermal expansion coefficient is greater than the second thermal expansion coefficient;the gap is provided adjacent to or in a vicinity of a bonding portion in which the interlayer connection conductor and the conductor pattern are bonded to each other;the gap is provided in the first resin layer; andthe contact portion is provided in the second resin layer.2. The resin substrate according to claim 1 , whereinthe resin substrate includes a plurality of resin bodies;the plurality of the resin bodies are stacked so that second resin layers of the plurality of resin bodies are in contact with each other and interlayer connection conductors of the plurality of the resin bodies are overlapped with each other; andportions in which the interlayer connection conductors of the plurality of the resin bodies are bonded so as to come into contact with each other are bonded by a bonding layer.3. The resin substrate according to claim 1 , wherein the resin body includes a plurality of gaps.4. The resin substrate according to claim 1 , wherein the gap provided adjacent to or in a vicinity of the bonding portion of the interlayer connection ...

CIRCUIT BOARD STRUCTURE

A circuit board structure includes a carrier and a patterned circuit layer. The patterned circuit layer is disposed on the carrier, and the patterned circuit layer has at least one fluid channel therein. The fluid channel has a heat absorption section and a heat dissipation section relative to the heat absorption section. A heat source is electrically connected to the patterned circuit layer, and the heat absorption section is adjacent to the heat source. The heat generated by the heat source is transferred from the patterned circuit layer to the heat absorption section of the fluid channel, and is transferred from the heat absorption section to the heat dissipation section for heat dissipation. 1. A circuit board structure suitable for carrying at least one heat source , comprising:a carrier; anda patterned circuit layer, disposed on the carrier, wherein the patterned circuit layer is provided with at least one fluid channel therein, the at least one fluid channel is provided with a heat absorption section and a heat dissipation section relative to the heat absorption section, the at least one heat source is electrically connected to the patterned circuit layer, the heat absorption section is adjacent to the at least one heat source, and the heat generated by the at least one heat source is transferred from the patterned circuit layer to the heat absorption section of the at least one fluid channel, and is transferred from the heat absorption section to the heat dissipation section for heat dissipation,wherein an orthographic projection of the at least one heat source on the carrier is overlapped with an orthographic projection of the heat absorption section of the at least one fluid channel on the carrier.2. The circuit board structure according to claim 1 , wherein the carrier is an insulating substrate claim 1 , and the patterned circuit layer is directly disposed on the carrier.3. The circuit board structure according to claim 2 , wherein a material of the ...

HYBRID CARRIER BOARD AND MANUFACTURING METHOD, ASSEMBLY, AND OPTICAL MODULE THEREOF

A hybrid carrier board and a manufacturing method, an assembly, and an optical module thereof. The hybrid carrier board includes a PCB and a package substrate bonded to the PCB, the package substrate and the PCB being electrically connected. A surface of the package substrate is partially exposed outside of the PCB to form a packaging area adapted for bare die installation. 1. A hybrid carrier board , comprising:a printed circuit board (PCB); anda package substrate bonded to, and electrically connected with, the PCB,wherein a surface of the package substrate is partially exposed outside of the PCB to form a packaging area adapted for bare die installation.2. The hybrid carrier board of claim 1 , wherein solder pads are disposed on the packaging area claim 1 , anda pitch of the solder pads on the packaging area matches a pitch of solder pads of a bare die that is to be installed.3. The hybrid carrier board of claim 2 , wherein the pitch between the solder pads on the packaging area is less than or equal to 150 μm.4. The hybrid carrier board of claim 1 , wherein the package substrate comprises a dielectric layer and an electrically conductive layer claim 1 , a coefficient of thermal expansion (CTE) of the dielectric layer being smaller than or equal to a CTE of an insulating layer of the PCB.5. The hybrid carrier board of claim 4 , wherein the CTE in a horizontal direction of the dielectric layer is less than or equal to 10 ppm/° C.6. The hybrid carrier board of claim 5 , wherein a material of the dielectric layer of the package substrate is ceramic claim 5 , glass claim 5 , or silicon claim 5 , orthe material of the dielectric layer of the package substrate and the material of the insulating layer of the PCB are both Bismaleimide Triazine (BT) resin or BT-like resin.7. The hybrid carrier board of claim 1 , wherein an electrical interface is disposed on a surface of the PCB.8. The hybrid carrier board of claim 1 , wherein surface-mount solder pads are disposed on a ...

METHOD FOR MANUFACTURING A FLUID-BASED COOLING ELEMENT AND FLUID-BASED COOLING ELEMENT

A method for manufacturing a fluid-based cooling element is provided. The fluid-based cooling element is configured for cooling a heat generating element arranged on a printed circuit board (). The method comprises forming a base body comprising a plate-shaped base body portion and an inner base body portion integrally formed with the plate-shaped base body portion. The step of forming the base body comprises forming the plate-shaped base body portion and the inner base body portion by means of die casting. The inner base body portion comprises a plurality of protrusions formed on an upper side of the inner base body portion. The protrusions have a gap size in a range of 0.5 mm to 1.5 mm. 1102. A method for manufacturing a fluid-based cooling element , wherein the fluid-based cooling element is configured for cooling a heat generating element () arranged on a printed circuit board (PCB) , wherein the method comprises:forming a base body comprising a plate-shaped base body portion and an inner base body portion integrally formed with the plate-shaped base body portion,wherein the step of forming the base body comprises forming the plate-shaped base body portion and the inner base body portion by means of die casting,wherein the inner base body portion comprises a plurality of protrusions formed on an upper side of the inner base body portion, andwherein the protrusions have a gap size in a range of 0.5 mm to 1.5 mm.2. The method according to claim 1 , wherein the protrusions have a gap size of approximately 1 mm.3. The method according to claim 1 , wherein the step of forming the base body comprises using an aluminum-silicon die casting alloy claim 1 , wherein the aluminum-silicon die casting alloy is G-AlSi12.4. The method according to claim 3 , wherein the aluminum-silicon die casting alloy G-AlSi12 is substantially free of copper.5. The method according to claim 1 , wherein the step of forming the base body comprises using an aluminum-silicon-magnesium die casting ...

RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE

Provided is a resin composition for a printed wiring board with which a substrate material having a low CTE can be formed while ensuring good moldability. A resin composition for a printed wiring board contains a thermosetting resin including an epoxy resin, a curing agent, an inorganic filler, and an expansion relief component including an acrylic resin that is soluble in an organic solvent. The content of the inorganic filler is 150 parts by mass or more with respect to 100 parts by mass of the total amount of the thermosetting resin and the curing agent. The melt viscosity at 130° C. is less than 50000 Ps.

Electronic component package

An electronic component package includes: a core including a cavity, a first resin layer, a second resin layer and a reinforcing layer disposed between the first resin layer and the second resin layer; and an electronic component disposed in the cavity, wherein a thickness of the first resin layer is different from a thickness of the second resin layer.

Light emitting diode (led) lighting device

Various embodiments provide a light emitting diode (LED) module, an LED lighting device comprising an LED module, and methods for manufacturing an LED module and/or an LED lighting device. In one embodiment, the LED lighting device comprises a housing comprising a metal shell and defining a central opening; and an LED module having one or more LEDs mounted about a periphery of a first surface of the LED module. The LED module is oriented and retained within the central opening of the housing such that the first surface faces out of the central opening. Furthermore, the LED module is secured to the housing via the metal shell.

Chip packaging and composite system board

A chip packaging includes a substrate, a first chip, a molding material, a first circuit, and a second circuit. The substrate includes a bottom surface, a first top surface disposed above the bottom surface with a first height, and a second top surface disposed above the bottom surface with a second height. The first height is smaller than the second height. The first chip is disposed on the first top surface. The molding material is disposed on the substrate and covers the first chip. The first and second circuits are disposed on the molding material, and are respectively and electrically connected to the first chip and the second top surface of the substrate. The substrate is made of copper material with huge area and has the properties of high current withstand capacity and high thermal efficiency. The second top surface protects the first chip from damage.

SUBSTRATE FOR POWER MODULES, SUBSTRATE WITH HEAT SINK FOR POWER MODULES, AND POWER MODULE

The present invention provides a power module substrate including an insulating substrate, a circuit layer which is formed on one surface of the insulating substrate, and a metal layer which is formed on the other surface of the insulating substrate, in which the circuit layer has a first aluminum layer made of aluminum or an aluminum alloy which is bonded to the insulating substrate and a first copper layer made of copper or a copper alloy which is bonded to the first aluminum layer by solid-phase diffusion, the metal layer has a second aluminum layer made of aluminum or an aluminum alloy, and a relationship between a thickness tof the circuit layer and a thickness tof the second aluminum layer of the metal layer satisfy t Подробнее

Electronic, optoelectronic, or electric arrangement

An electronic, optoelectronic or electric arrangement contains a circuit carrier having a metallic heat conductor, and a component, which is embedded, inserted or formed in the circuit carrier. The component has at least one electric, electronic or optoelectronic construction element and a rewiring layer, which contains a metallic heat conducting path. A metallic-thermal connection of the rewiring layer and the metallic heat conducting layer of the circuit carrier is provided by the heat conducting path.

Carrier, Semiconductor Module and Fabrication Method Thereof

A semiconductor module includes a carrier having a first carrier surface and a second carrier surface opposite the first carrier surface, a first semiconductor chip mounted over the first carrier surface and a heatsink coupled to the second carrier surface with a first heatsink surface facing the carrier. The second carrier surface or the first heatsink surface has at least one cavity in the form of one or more of dimples and trenches.

FIXATION OF HEAT SINK ON SFP/XFP CAGE

An apparatus and system for a heat sink assembly, and a procedure for forming a heat sink assembly. The heat sink assembly includes a heat sink having a base and fins extending from the base, and a spring clip disposed on the heat sink between the fins. The spring clip includes a first tab that forms a first angle with respect to the base of the heat sink and including a second tab that forms a second angle with respect to the base of the heat sink. The first and second tabs are attached to the circuit board. By virtue thereof, a heat sink attachment to cage is provided that is space-efficient and permits a higher density of cages on a circuit board than do conventional arrangements.

FLEXIBLE SUBSTRATE

A flexible substrate includes a circuit board, a flexible heat-dissipating structure and an adhesive. The circuit board has a substrate and a circuit layer formed on a top surface of the substrate, and the flexible heat-dissipating structure has a flexible supporting plate and a flexible heat-dissipating metal layer formed on a surface of the flexible supporting plate. The flexible heat-dissipating metal layer of the flexible heat-dissipating structure is connected with a bottom surface of the substrate by the adhesive. The circuit layer and the flexible heat-dissipating metal layer are made of same material. 1. A flexible substrate comprising:a circuit board including a substrate and a circuit layer, wherein the substrate has a top surface and a bottom surface, the circuit layer is formed on the top surface, and the top surface has a chip-disposing area;a flexible heat-dissipating structure connected with the bottom surface of the substrate including a flexible supporting plate and a flexible heat-dissipating metal layer, wherein the flexible supporting plate comprises a surface facing toward the bottom surface of the substrate, the flexible heat-dissipating metal layer is formed on the surface of the flexible supporting plate, located underneath the chip-disposing area and not electrically connected to the circuit layer, wherein the substrate and the flexible supporting plate are made of same material; andan adhesive formed on the flexible heat-dissipating metal layer, wherein the flexible heat-dissipating metal layer is directly connected with the bottom surface of the substrate by the adhesive.2. The flexible substrate in accordance with claim 1 , wherein the flexible heat-dissipating metal layer has a lateral surface claim 1 , and the flexible supporting plate has a side wall coplanar with the lateral surface.3. The flexible substrate in accordance with claim 2 , wherein the flexible heat-dissipating structure further includes a protecting layer covering the ...

MOUNTING SYSTEM THAT MAINTAINS STABILITY OF OPTICS AS TEMPERATURE CHANGES

An optical system comprises a detector to determine one or more intensities of light impinging on one or more locations of the detector and an optical element to redirect light towards the detector along a detection axis. The detector and optical element are coupled together by three or more substantially flat flexures respectively defining three or more flexure planes parallel to the detection axis. The three or more substantially flat flexures prevent rotational movement of the optical element with respect to the detector with changes in temperature 1. A scanner comprising:a light source to generate light;a microlens array to split the light into an array of light beams;a base;a detector, mounted to the base, comprising an array of sensors, wherein each sensor of the array of sensors determines an intensity of light impinging on the sensor;a beam splitter to transmit the array of light beams towards a target and redirect a reflected array of light beams from the target towards the detector along a detection axis in a first direction; andthree or more flexures that couple the beam splitter to the base, wherein thermal expansion or contraction of the beam splitter with respect to at least one of the detector or the base bends each flexure of the three or more flexures in a respective second direction without bending the flexure in a respective third direction approximately perpendicular to the first direction and the respective second direction, wherein the three or more flexures maintain an alignment of the microlens array to the detector with changes in temperature.2. The scanner of claim 1 , wherein the beam splitter has a first coefficient of thermal expansion that is different from a second coefficient of thermal expansion of at least one of the detector or the base.3. The scanner of claim 1 , wherein each flexure has a height in the first direction claim 1 , a thickness in the respective second direction claim 1 , and a width in the respective third direction ...

DRIVER BOARD ASSEMBLIES AND METHODS OF FORMING THE SAME

A method of manufacturing a driver board assembly includes embedding one or more power device assemblies within a first PCB material layer, forming one or more cooling channels within a surface of the first PCB material layer such that the one more cooling channels extend proximate to the one or more power device assemblies, forming a plurality of thermally conductive vias extending between a surface of the one or more power device assemblies and the one or more cooling channels, and bonding a second PCB material layer to the first PCB material layer to enclose the one or more cooling channels between the first PCB material layer and the second PCB material layer. 1. A method of manufacturing a driver board assembly , the method comprising:embedding one or more power device assemblies within a first printed circuit board (PCB) material layer;forming one or more cooling channels within a surface of the first PCB material layer such that the one or more cooling channels extend proximate to the one or more power device assemblies;forming a plurality of thermally conductive vias extending between a surface of the one or more power device assemblies and the one or more cooling channels; andbonding a second PCB material layer to the first PCB material layer to enclose the one or more cooling channels between the first PCB material layer and the second PCB material layer.2. The method of claim 1 , further comprising arranging the one or more power devices assemblies in an inverter topology.3. The method of claim 1 , further comprising:forming an inlet channel within at least one of the surface of the first PCB material layer and a surface of the second PCB material layer, the inlet channel comprising an inlet port configured to fluidly couple the one or more cooling channels to a coolant source; andforming an outlet channel within at least one of the surface of the first PCB material layer and the surface of the second PCB material layer, the outlet channel comprising an ...

OPTICAL UNIT WITH ROLLING CORRECTION FUNCTION AND OPTICAL UNIT WITH TRIAXIAL SHAKE CORRECTION FUNCTION

An optical unit with rolling correction function is provided and performs rolling correction by fixing a circuit board on which an imaging element is mounted and a heat dissipating member to a rotation member, transmitting heat from the circuit board to the heat dissipating member, and rotating the rotation member. A rotation shaft of a rotation supporting mechanism is fixed to the rotation member via the heat dissipating member. Accordingly, it is possible to dissipate heat by transmitting heat that is generated from the imaging element, from the circuit board to the heat dissipating member, and then transmitting the heat from the heat dissipating member to the rotation shaft. The imaging element and the heat dissipating member overlap with the rotation shaft at an identical position when the imaging element and the heat dissipating member are seen from an optical axis direction. 1. An optical unit with rolling correction function , comprising:an optical element;an imaging element that is arranged on a counter object side of the optical element;a rotation member to which a circuit board and a heat dissipating member are fixed, wherein the circuit board being mounted with the imaging element, and the heat dissipating member being arranged on the counter object side of the circuit board to receive a heat from the circuit board;a fixation member that is arranged on the counter object side of the rotation member;a rotation supporting mechanism that includes a rotation shaft fixed to the rotation member via the heat dissipating member, and a bearing part provided on the fixation member; anda rolling magnetic driving mechanism that causes the rotation member to rotate on an optical axis of the optical element,wherein at least a part of the imaging element and at least a part of the heat dissipating member overlap with the rotation shaft at an identical position when the imaging element and the heat dissipating member are seen from an optical axis direction.2. The optical ...

MICROELECTRONIC MODULES WITH SINTER-BONDED HEAT DISSIPATION STRUCTURES AND METHODS FOR THE FABRICATION THEREOF

Methods for producing high thermal performance microelectronic modules containing sinter-bonded heat dissipation structures. In one embodiment, the method includes embedding a sinter-bonded heat dissipation structure in a module substrate. The step of embedding may entail applying a sinter precursor material containing metal particles into a cavity provided in the module substrate, and subsequently sintering the sinter precursor material at a maximum processing temperature less than a melt point of the metal particles to produce a sintered metal body bonded to the module substrate. A microelectronic device and a heatsink are then attached to the module substrate before, after, or concurrent with sintering such that the heatsink is thermally coupled to the microelectronic device through the sinter-bonded heat dissipation structure. In certain embodiments, the microelectronic device may be bonded to the module substrate at a location overlying the thermally-conductive structure. 1. A method for fabricating a microelectronic module , comprising: applying a sinter precursor material containing metal particles into a cavity provided in the module substrate; and', 'sintering the sinter precursor material at a maximum processing temperature less than a melt point of the metal particles to produce a sintered metal body bonded to the module substrate, the maximum processing temperature ranging between 170 and 300 degrees Celsius; and, 'embedding a sinter-bonded heat dissipation structure in a module substrate, embedding comprisingattaching a microelectronic device and a heatsink to the module substrate, the heatsink thermally coupled to the microelectronic device through the sinter-bonded heat dissipation structure.2. The method of wherein a common sintering process is carried-out to produce the sintered metal body claim 1 , while concurrently attaching the microelectronic device and the heatsink to the module substrate.3. The method of wherein the heatsink comprises a metal ...

TECHNOLOGIES FOR OPTICAL COMMUNICATION IN RACK CLUSTERS

Technologies for optical communication in a rack cluster in a data center are disclosed. In the illustrative embodiment, a network switch is connected to each of 1,024 sleds by an optical cable that enables communication at a rate of 200 gigabits per second. The optical cable has low loss, allowing for long cable lengths, which in turn allows for connecting to a large number of sleds. The optical cable also has a very high intrinsic bandwidth limit, allowing for the bandwidth to be upgraded without upgrading the optical infrastructure. 1a plurality of network switches, each network switch of the plurality of network switches comprising a plurality of optical connectors;a plurality of sleds, each sled of the plurality of sleds comprising a circuit board, an optical connecter mounted on the circuit board, and one or more physical resources mounted on the circuit board; at least two optical fibers;', 'a first connector at a first end of the passive optical cable connected to an optical connector of a sled of a plurality of sleds; and', 'a second connector at a second end of the passive optical cable connected to an optical connector of the plurality of optical connectors of a corresponding network switch of the plurality of the network switches,, 'a plurality of passive optical cables, wherein each passive optical cable of the plurality of passive optical cables compriseswherein each of the plurality of sleds is connected to each of the plurality of network switches by at least one of the plurality of passive optical cables.. A system comprising: The present application is a continuation application of U.S. application Ser. No. 15/396,035, entitled “TECHNOLOGIES FOR OPTICAL COMMUNICATION IN RACK CLUSTERS,” which was filed on Dec. 30, 2016, is scheduled to issue as U.S. Pat. No. 10,070,207 on Sep. 4, 2018, and claims the benefit of U.S. Provisional Patent Application No. 62/365,969, filed Jul. 22, 2016, U.S. Provisional Patent Application No. 62/376,859, filed Aug. 18, ...

SOLID STATE RELAY

A compact solid state relay () is provided. Solid state devices (), such as Triacs or Thyristors are used to implement the relay functionality. The device is at least partially enclosed in a housing that has pins for mounting on an electronics board. A number of “U” shaped jumpers () or other jumpers or wires are provided in the housing to act as heat sinks. A sub-miniature fan () is positioned to create an air flow over the heat sinks and dissipate heat from the device. 1. A relay , comprising:a relay, implemented on a printed circuit board, operative for switching power between a first contact associate with a first circuit and a second contact;housing structure for at least partially enclosing said relay;multiple heat sink elements for dissipating heat generated by said relay in operation; anda fan positioned for producing an air flow across said heat sink elements.2. A relay as set forth in claim 1 , wherein said heat sink elements comprise “u” shaped jumper formed from heat conducting material.3. A relay as set forth in claim 1 , wherein said heat sink elements are formed from heat conducting material and extend between appointed walls of said housing.4. A relay as set forth in claim 1 , wherein said relay is implemented as solid state switches.5. A relay as set forth in claim 1 , where said fan is mounted on said housing.6. A relay as set forth in claim 5 , further comprising pins extending from said housing for mounting on an electronics board.7. A relay as set forth in claim 1 , further comprising a controller for controlling said relay to switch power in synchronization with arrays of a power signal.8. A method for use in constructing a relay claim 1 , comprising:forming a relay on a printed circuit board, said relay operative for switching power between a first contact associated with a first circuit and a second contact;mounting said relay on a housing structure for at least partially enclosing said relay;mounting multiple heat sink elements on said ...

ELECTRONIC MODULE FOR A TRANSMISSION CONTROL UNIT, AND TRANSMISSION CONTROL UNIT

An electronic module for a transmission control unit may include a printed circuit board that has an electronic component. The electronic component may be electrically connected to a surface of the printed circuit board at least at one point. At least a portion of the electronic component that includes the at least one point may be covered with a protective coating. The protective coating may include a media-tight protective lacquer. The electronic component may be a semiconductor component contained in a housing. 1. An electronic module for a transmission control unit , comprising:a printed circuit board that has an electronic component,wherein the electronic component is electrically connected to a surface of the printed circuit board at least at one point,wherein at least a portion of the electronic component that includes the at least one point is covered with a protective coating,wherein the protective coating includes a media-tight protective lacquer, andwherein the electronic component is a semiconductor component contained in a housing.2. The electronic module according to claim 1 , wherein a protective cap covers the portion of the electronic component claim 1 , and wherein the protective cap is attached to the printed circuit board.3. The electronic module according to claim 2 , wherein the protective cap is glued to the printed circuit board.4. The electronic module according to claim 2 , wherein the attachment of the protective cap to the printed circuit board lacks a media-tight barrier.5. The electronic module according to claim 1 , wherein a mechanical carrier element is located at least one of inside the printed circuit board and on the surface of the printed circuit board in order to reinforce the printed circuit board.6. The electronic module according to claim 5 , wherein the carrier element is connected to the printed circuit board with at least one of a thermally conductive adhesive claim 5 , a thermally conductive paste claim 5 , a thermally ...

HEAT-INSULATION MATERIAL AND PRODUCTION METHOD THEREOF

A heat-insulation material does not cause deterioration in heat-insulation performance and any loss of components included therein, and possesses an excellent radiation-preventing function. The heat-insulation material includes: a first heat-insulation layer that includes a fist silica xerogel and a first radiation-preventing material; and a third heat-insulation layer that includes a third silica xerogel and second fibers, wherein the first heat-insulation layer and the third heat-insulation layer are layered. An electronic device includes the heat-insulation, material. Yet further disclosed is a method for producing the heat-insulation material. 1. A heat-insulation material , comprising:a first heat-insulation layer that includes a first silica xerogel and a first radiation-preventing material; anda third heat-insulation layer that includes a third silica xerogel and second fibers, wherein the first heat-insulation layer and the third heat-insulation layer are layered.2. The heat-insulation material according to claim 1 , further comprising a second heat-insulation layer that includes a second xerogel claim 1 , a second radiation-preventing material claim 1 , and first fibers claim 1 , wherein the second heat-insulation layer is placed between the first heat-insulation layer and the third heat-insulation layer.3. The heat-insulation material according to claim 2 , wherein the first heat-insulation layer does not include the same type of fibers as the first fibers.4. The heat-insulation material according to claim 2 , wherein the first heat-insulation layer does not include any fibers.5. The heat-insulation material according to claim 2 , wherein the first fiber and the second fiber are the same type of fibers.6. The heat-insulation material according to claim 2 , wherein the first radiation-preventing material and the second radiation-preventing material are the same type of radiation-preventing materials.7. The heat-insulation material according to claim 2 , ...

Electronic device and electronic apparatus

A screw hole which is formed on one end of a substrate and through which an electronic device is attached to a metal frame by using a metal screw provided, an NAND memory as a heating section is provided on the screw hole side, a heat conducting sheet which covers an upper peripheral portion of the screw hole and an upper portion of the NAND memory is provided, and heat of the NAND memory is conducted to the metal frame through the heat conducting sheet and the metal screw fitted into the screw hole.

SEMICONDUCTOR PACKAGE

A stacked semiconductor package includes a first semiconductor package including a first circuit board and a first semiconductor device mounted on the first circuit board; a second semiconductor package including a second circuit board and a second semiconductor device mounted on the second circuit board, the second semiconductor package being stacked on the first semiconductor package; and a heat transfer member provided on the first semiconductor device and a part of the first circuit board, the part being around the first semiconductor device. 1. A stacked semiconductor package , comprising:a first semiconductor package including a first circuit board and a first semiconductor device mounted on the first circuit board;a second semiconductor package including a second circuit board and a second semiconductor device mounted on the second circuit board, the second semiconductor package being stacked on the first semiconductor package; anda heat transfer member provided over the first semiconductor device and a part of the first circuit board, the part being around the first semiconductor device.2. The stacked semiconductor package according to claim 1 , wherein:the first semiconductor package includes a plurality of joining electrode terminals joined with the second semiconductor package and provided around the first semiconductor device; andthe heat transfer member is located inner to the plurality of joining electrode terminals.3. The stacked semiconductor package according to claim 1 , wherein:the first semiconductor package includes a plurality of joining electrode terminals joined with the second semiconductor package and provided around the first semiconductor device; andthe heat transfer member is provided on substantially an entire surface of the first semiconductor package while enclosing the plurality of joining electrode terminals.4. The stacked semiconductor package according to claim 1 , wherein:the first circuit board has a thermal via; andthe heat ...

Automated data center maintenance

Techniques for automated data center maintenance are described. In an example embodiment, an automated maintenance device may comprise processing circuitry and non-transitory computer-readable storage media comprising instructions for execution by the processing circuitry to cause the automated maintenance device to receive an automation command from an automation coordinator for a data center, identify an automated maintenance procedure based on the received automation command, and perform the identified automated maintenance procedure. Other embodiments are described and claimed.

INORGANIC FILLER, AND INSULATING RESIN COMPOSITION, INSULATING FILM, PREPREG AND PRINTED CIRCUIT BOARD INCLUDING THE SAME

An inorganic filler has a negative coefficient of thermal expansion, and a shell thereon that decreases diffusion of ions contained in the inorganic filler to outside of the shell and organic filler. 1. An inorganic filler having a negative coefficient of thermal expansion , the inorganic filler having a shell thereon so as to decrease diffusion of ions contained in the inorganic filler to outside of the shell and inorganic filler.2. The inorganic filler as set forth in claim 1 , containing lithium.3. The inorganic filler as set forth in claim 2 , further comprising a crystallized glass comprised of LiO claim 2 , AlO claim 2 , and SiOcomponents.4. The inorganic filler as set forth in claim 2 , further comprising a β-eucryptite represented by:{'br': None, 'sub': 2', '2', '3', '2, 'xLiO-yAlO-zSiO'}where each of x, y and z represents a mixing molar ratio, x and y are each independently 0.9 to 1.1, and z is 1.2 to 2.1.5. The inorganic filler as set forth in claim 2 , wherein the shell is made of inorganic material not containing lithium.6. The inorganic filler as set forth in claims 1 , wherein the shell includes at least one selected from a group consisting of silica claims 1 , diboron trioxide claims 1 , alumina claims 1 , barium sulfate claims 1 , talc claims 1 , mica powder claims 1 , aluminum hydroxide claims 1 , magnesium hydroxide claims 1 , calcium carbonate claims 1 , magnesium carbonate claims 1 , magnesium oxide claims 1 , boron nitride claims 1 , aluminum borate claims 1 , barium titanate claims 1 , calcium titanate claims 1 , magnesium titanate claims 1 , bismuth titanate claims 1 , titanium oxide claims 1 , barium zirconate claims 1 , and calcium zirconate.7. The inorganic filler as set forth in claim 6 , wherein the shell includes silica.8. The inorganic filler as set forth in claim 1 , wherein an average diameter of the inorganic filler is 1 nm to 100 μm.9. The inorganic filler as set forth in claim 1 , wherein an average thickness of the shell is 1 nm ...

Pcb current track cooling in electrical climate compressors

An assembly and a method for maximizing the current-carrying capacity of conductor tracks and the current-carrying capacity of conductors on or within a circuit board, allows for the use of copper materials, and minimizes the costs of materials and production of the circuit board. The circuit board is connected via a housing with a coolant of a cryogenic device in order to provide heat extraction. The extraction of heat from the circuit board occurs by connecting the circuit board via a housing with a coolant of a cryogenic device.

Technologies for allocating resources within a self-managed node

Technologies for dynamically allocating resources within a self-managed node include a self-managed node to receive quality of service objective data indicative of a performance objective of one or more workloads assigned to the self-managed node. Each workload includes one or more tasks. The self-managed node is also to execute the one or more tasks to perform the one or more workloads, obtain telemetry data as the workloads are performed, determine, as a function of the telemetry data, an adjustment to the allocation of resources among the workloads to satisfy the performance objective, and apply the determined adjustment as the workloads are performed by the self-managed node. Other embodiments are also described and claimed.

Technologies for determining and storing workload characteristics

Technologies for determining and storing workload characteristics include an orchestrator server to identify a workload to be executed by a managed node, obtain a profile associated with the workload, wherein the profile includes a model that relates an input parameter set indicative of one of more characteristics of the workload with an output parameter set indicative of one or more aspects of resources to be allocated for execution of the workload, determine, as a function of the input parameter set and the model, resources to allocate to the managed node to execute the workload, and allocate the determined resources to the managed node to execute the workload. Other embodiments are also described and claimed.

Techniques to determine and process metric data for physical resources

Various embodiments are generally directed to an apparatus, method and other techniques for communicating metric data between a plurality of management controllers for sleds via an out-of-band (OOB) network, the sleds comprising physical resources and the metric data to indicate one or more metrics for the physical resources. Embodiments may also include determining a physical resource of the physical resources to perform a task based at least in part on the one or more metrics, and causing the task to be performed by the physical resources.

Technologies for managing the efficiency of workload execution

Technologies for managing the efficiency of workload execution in a managed node include a managed node that includes one or more processors that each include multiple cores. The managed nodes is to execute threads of workloads assigned to the managed node, generate telemetry data indicative of an efficiency of execution of the threads, determine, as a function of the telemetry data, an adjustment to a configuration of the threads among the cores to increase the efficiency of the execution of the threads, and apply the determined adjustment. Other embodiments are also described and claimed.

CONFIGURABLE HEAT CONDUCTING PATH FOR PORTABLE ELECTRONIC DEVICE

A portable electronic device includes at least one energy module which further included thermoelectric materials which may convert heat to electric power. A plurality of heat removers selectively thermal contact to at least one wall of an enclosure of the portable electronic device depended on the configuration of the portable electronic device. 1. A portable electronic device , comprising:a first housing comprising a front wall, a rear wall opposite to the first wall, and at least one side wall; anda second housing comprising a front wall, a rear wall opposite to the front wall, and at least one side wall, wherein the first housing slidable and rotatably connects to the second housing;both the first housing and the second housing comprise a circuit board comprising at least one heat generating component on at least one side of the circuit board, a transparent screen located on the front wall, a display module comprising at least one heat generating component, wherein the display module generates image and displays through the transparent screen;both the first housing and the second housing comprise a first heat remover disposed over a surface of the at least one heat generating component on either one of the display module and the circuit board, wherein the first heat remover comprises graphene; andthe front wall, the at least one side wall and the rear wall of the first housing comprise a first housing heat remover comprising graphene for conducting the heat; andthe front wall, the at least one side wall and the rear wall of the second housing comprise a second housing heat remover comprising graphene for conducting the heat;the first housing and the second housing are arranged as at least two configuration: in a first configuration, the rear wall of the first housing cover the front wall of the second housing, wherein the transparent screen of the second housing is covered; and in a second configuration, the transparent screen of the first housing and the ...

PRINTED CIRCUIT BOARD SET HAVING HIGH-EFFICIENCY HEAT DISSIPATION

A printed circuit board set having high-efficiency heat dissipation includes a printed circuit board (PCB) and a heat dissipating device. The PCB has multiple electronic elements, at least one heat dissipating hole, and at least one thermally conductive material. The electronic elements are disposed on the top surface of the PCB. Each of the at least one heat dissipating hole is formed through the top and bottom surfaces of the PCB and aligns with one of the electronic elements. Each of the at least one thermally conductive material is disposed in the corresponding heat dissipating hole and in contact with the corresponding electronic element. The heat dissipating device is attached to the bottom surface of the PCB and in contact with the at least one thermally conductive material. With a high thermal conductivity, the at least one thermally conductive material rapidly transfers the waste heat produced by the PCB in operation to the heat dissipating device for heat dissipation.

Thermally Efficient Compute Resource Apparatuses and Methods

Examples may include racks for a data center and sleds for the racks, the sleds arranged to house physical resources for the data center. The sleds can house physical resources and heat sinks thermally coupled to the physical resources. The physical resources are arranged on the sleds and the heat sinks are configured so as to limit thermal shadowing between physical resources to reduce interference with airflow provided by fans of the racks. 1. A data center sled , comprising:a substrate having a top surface and a bottom surface;a first plurality of physical resources disposed on the top surface of the substrate; andat least one heat sink coupled to the top surface of the substrate and thermally coupled to the first plurality of physical resources, the first plurality of physical resources arranged on the top surface laterally across the top surface of the substrate to reduce thermal shadowing between ones of the first plurality of physical resources.2. The data center sled of claim 1 , wherein the substrate is a printed circuit board and the at least one heat sink is greater than 1U height.3. The data center sled of claim 1 , comprising a second plurality of physical resources disposed on the bottom surface of the substrate claim 1 , the second plurality of physical resources arranged on the bottom surface laterally across the bottom surface to reduce thermal shadowing between ones of the second plurality of physical resources.4. The data center sled of claim 3 , the second plurality of physical resources comprising a plurality of memory modules claim 3 , the plurality of memory modules comprising dual in-line memory modules (DIMMs) claim 3 , each of the plurality DIMMs arranged on the bottom surface of the substrate such that ends of each of the DIMMs are positioned perpendicular to a front edge of the top surface of the substrate.5. The data center sled of claim 4 , the second plurality of physical resources comprising a voltage regulator resource claim 4 , the ...

Wiring substrate and method for manufacturing wiring substrate

A wiring substrate includes an insulating layer including inorganic fillers and resin, and a conductor layer formed on a surface of the insulating layer and having a conductor pattern. The surface of the insulating layer has an arithmetic average roughness Ra in the range of 0.05 μm to 0.5 μm, the conductor layer includes a metal film formed on the surface of the insulating layer, and the inorganic fillers include a first inorganic filler including particles such that each of the particles has a portion of a surface separated from the resin and forming a gap with respect to the resin of the insulating layer and that the metal film of the conductor layer includes part formed in the gap between the first inorganic filler and the resin.

LIQUID COOLED MODULE WITH DEVICE HEAT SPREADER

An electronic device includes a printed circuit board (PCB) that supports an integrated circuit (IC) chip. The device also includes a lid over the IC chip. A thermal interface material (TIM) is configured to transfer thermal energy from the IC chip to the lid. A heat spreader forms a cavity in communication with the lid. The heat spreader is at least partially filled with a liquid that is configured to change phases during operation of the IC chip. 1. An electronic device comprising:a printed circuit board (PCB) supporting an integrated circuit (IC) chip;a lid over the IC chip;a thermal interface material (TIM) configured to transfer thermal energy from the IC chip to the lid; anda heat spreader forming a cavity in communication with the lid, the heat spreader at least partially filled with a liquid configured to change phases during operation of the IC chip, a roughed surface of the lid being exposed to the cavity to increase wicking of the liquid towards the lid.2. The electronic device of claim 1 , comprising an interposer board electrically connecting the PCB to the IC chip.3. The electronic device of claim 2 , wherein the lid is secured to the interposer board by a bonding material forming a space within which the IC chip is arranged.4. The electronic device of claim 3 , wherein an epoxy is arranged in the space.5. The electronic device of claim 3 , wherein the IC chip is a flip chip.6. The electronic device of claim 1 , wherein the lid and the heat spreader are discrete elements from one another providing an enclosure about the cavity claim 1 , the heat spreader including a perimeter wall forming an opening in communication with the cavity claim 1 , a bonding material securing the perimeter wall to the lid.7. The electronic device of claim 6 , wherein the heat spreader includes a fill port sealed with a plug.8. The electronic device of claim 6 , wherein the heat spreader is a metallic material.9. The electronic device of claim 6 , wherein the lid includes a ...

Cooling assemblies for electronic devices

According to some aspects of the present disclosure, cooling assemblies for electronic devices are disclosed. Example cooling assemblies include a circuit board having a first surface and a second surface opposite the first surface, a first set of electronic devices, a second set of electronic devices, and a third set of electronic devices. Each set includes at least two electronic devices electrically coupled in parallel and disposed on the first surface of the circuit board. At least one of the electronic devices of the first set is adjacent one of the electronic devices of the second set and is adjacent one of the electronic devices of the third set. The cooling assembly further includes a heat sink disposed on the second surface of the circuit board. The heat sink is in thermal contact with the first set, the second set, and the third set of electronic devices.

ELECTRONIC CONTROLLING APPARATUS

An electronic controlling apparatus includes a circuit board in which conductor layers and insulating layers are disposed alternately, thicknesses of an upper portion outer conductor layer that is disposed on a first surface of the circuit board and a lower portion outer conductor layer that is disposed on a second surface of the circuit board are identical and have greatest thickness among the conductor layers, or thicknesses of a first outermost position inner conductor layer and a second outermost position inner conductor layer that are positioned at two end portions inside the circuit board are identical and have greatest thickness among the conductor layers, and the conductor layers are disposed symmetrically so as to have a central plane in a thickness direction of the circuit board as a plane of symmetry. 113-. (canceled)14. An electronic controlling apparatus comprising:a circuit board in which conductor layers and insulating layers are disposed alternately;a power circuit that comprises a plurality of power elements that are each mounted to a first surface of said circuit board so as to be connected to an upper portion wiring pattern that is formed by an upper portion outer conductor layer that is disposed on said first surface of said circuit board among said conductor layers; anda control portion that is mounted to a second surface of said circuit board so as to be connected to a lower portion wiring pattern that is formed by a lower portion outer conductor layer that is disposed on said second surface of said circuit board among said conductor layers,wherein:thicknesses of said upper portion outer conductor layer and said lower portion outer conductor layer are identical and have greatest thickness among said conductor layers, or thicknesses of a first outermost position inner conductor layer that is positioned at a position that is nearest to said first surface among said conductor layers inside said circuit board and a second outermost position inner ...

WIRING BOARD AND PLANAR TRANSFORMER

A wiring board includes at least one insulating layer that has a front surface and a back surface, a first wiring layer that is disposed on a front surface side of the at least one insulating layer, a second wiring layer that is disposed on a back surface side of the insulating layer where the first wiring layer is disposed, and a connection conductor that electrically connects the first wiring layer and the second wiring layer to each other. Of the first wiring layer and the second wiring layer, at least the first wiring layer includes an unfixing region that is not fixed to the insulating layer. 1. A wiring board comprising:at least one insulating layer that has a front surface and a back surface;a first wiring layer disposed adjacent to a front surface side of the at least one insulating layer;a second wiring layer disposed adjacent to a back surface side of the at least one insulating layer; anda connection conductor electrically connecting the first wiring layer to the second wiring layer,wherein, of the first wiring layer and the second wiring layer, at least the first wiring layer includes an unfixing region that is not fixed to the at least one insulating layer.2. The wiring board according to claim 1 , wherein the first wiring layer includes at least one fixing region that is fixed to the at least one insulating layer claim 1 , andwherein the at least one fixing region includes a connection-portion fixing region that is fixed to the at least one insulating layer by the connection conductor.3. The wiring board according to claim 2 , wherein the at least one fixing region of the first wiring layer further includes an auxiliary fixing region where the first wiring layer is fixed to the at least one insulating layer at a location other than the connection-portion fixing region.4. The wiring board according claim 2 , wherein claim 2 , as viewed from a thickness direction of the first wiring layer claim 2 , a maximum distance from a gravity center of the at least ...

BGA COMPONENT MASKING DAM

The proposed masking dam protects ball grid array integrated circuit components from conformal coating overflow, preventing joint breakage and thermal mismatch. The masking dam includes a frame with an integrated seal, a cover, and a fastening mechanism. The frame is sealed to a circuit board surround a component, the cover is attached to the frame, and the masking dam is secured to protect the component. 1. A masking dam comprising:a removable cover configured to protect a component; and a seal embedded in the frame, the seal configured to sealingly engage the removable cover and a circuit board;', 'a mounting feature configured to attach the frame to the circuit board; and', 'a securing feature configured to attach the frame to the removable cover., 'a frame comprising2. The masking dam of claim 1 , wherein the securing feature comprises a second seal between the frame and the removable cover.3. The masking dam of claim 1 , wherein the securing feature comprises a lip feature configured to lock the removable cover onto the frame.4. The masking dam of claim 1 , wherein the removable cover comprises a feature configured to hold the removable cover down on the frame and the circuit board.5. The masking dam of claim 1 , wherein the removable cover is made of a material selected from the group consisting of aluminum claim 1 , carbon fiber claim 1 , ceramic claim 1 , metal filament mixes claim 1 , fiberglass claim 1 , FR4 claim 1 , nylon 6-6 claim 1 , PBT polyester claim 1 , polyphenylene sulfide claim 1 , polyetherimide claim 1 , liquid-crystal polymers claim 1 , and combinations thereof.6. The masking dam of claim 1 , wherein the frame is made of a material selected from the group consisting of aluminum claim 1 , carbon fiber claim 1 , ceramic claim 1 , metal filament mixes claim 1 , nylon 6-6 claim 1 , PBT polyester claim 1 , polyphenylene sulfide claim 1 , polyetherimide claim 1 , liquid-crystal polymers claim 1 , and combinations thereof.7. The masking dam of claim ...

THERMAL EXPANDABILITY ADJUSTER, USE AS THERMAL EXPANDABILITY ADJUSTER, THERMOSET RESIN COMPOSITION, INSULATING MATERIAL, SEALING MATERIAL AND CONDUCTIVE PASTE EACH CONTAINING THERMOSET RESIN COMPOSITION, CURED PRODUCTS, PREPREG AND MEMBER OBTAINED BY CURING THERMOSET RESIN COMPOSITION OF PREPREG, METHOD OF ADJUSTING THERMAL EXPANSION RATE, AND MEMBER MANUFACTURED USING METHOD OF ADJUSTING

A thermal expandability adjuster is provided which contains a glycoluril derivative compound represented by formula (1) below. The thermal expandability adjuster can reduce the linear thermal expansion coefficient of a cured product of a thermoset resin composition used for an insulating resin layer or the like and is effective for suppressing deformation of a circuit substrate due to heating. Compounding the above thermal expandability adjuster can reduce the linear thermal expansion coefficient of a cured product obtained by curing a thermoset resin composition and it is therefore possible to provide a member that exhibits small deformation due to heat. 3. A thermoset resin composition comprising the thermal expandability adjuster as recited in .4. An insulating material comprising the thermoset resin composition as recited in .5. A sealing material comprising the thermoset resin composition as recited in .6. A conductive paste comprising the thermoset resin composition as recited in .7. A cured product obtained by curing the thermoset resin composition as recited in .8. The cured product as recited in having a linear thermal expansion coefficient of 40 ppm/° C. or less.9. The cured product as recited in having a glass transition temperature of 180° C. or higher.10. A substrate material comprising the thermoset resin composition as recited in .11. A prepreg obtained by impregnating a base material with the thermoset resin composition as recited in .12. A member obtained by curing the sealing material as recited in .13. A method of adjusting a linear thermal expansion coefficient of a member claim 5 , comprising:{'claim-ref': {'@idref': 'CLM-00003', 'claim 3'}, 'a measurement step of measuring a linear thermal expansion coefficient of a member obtained by curing the thermoset resin composition as recited in ; and'}an adjustment step of adjusting at least one of a usage of the thermoset resin composition and a content of a thermal expansion rate adjuster in the ...

THERMALLY INSULATED PRINTED CIRCUIT BOARD

A printed circuit board (PCB) including a first side and a second side; a conductive layer within the PCB between the first side and the second side; one or more first side electrical components that are physically attached to the first side and electrically connected to the conductive layer; one or more second side electrical components attached to the second side of the PCB and electrically connected to the conductive layer; and a thermally and electrically insulating dielectric layer, within the PCB between the first side electrical components and the second side electrical components, that prevents heat emitted by the first side electrical components from increasing the temperature of the second side electrical components. 1. A printed circuit board (PCB) comprising:a first side and a second side;a conductive layer within the PCB between the first side and the second side;one or more first side electrical components that are physically attached to the first side and electrically connected to the conductive layer;one or more second side electrical components attached to the second side of the PCB and electrically connected to the conductive layer; anda thermally and electrically insulating dielectric layer, within the PCB between the first side electrical components and the second side electrical components, that prevents heat emitted by the first side electrical components from increasing the temperature of the second side electrical components, wherein at least one of the first side electrical components vertically overlaps at least one of the second side electrical components.2. The PCB recited in claim 1 , wherein a top surface of the first side electrical component(s) is coplanar with the first side of the PCB.3. The PCB recited in claim 2 , further comprising a heat sink that directly abuts the first side and the top surface of the first side electrical components.4. The PCB recited in claim 1 , further comprising claim 1 , an electrically-actuated ...

POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, AND POWER MODULE

A power module substrate including an insulating substrate, a circuit layer formed on one surface of the insulating substrate, and a metal layer formed on the other surface of the insulating substrate, wherein the circuit layer is composed of copper or a copper alloy, one surface of this circuit layer functions as an installation surface on which an electronic component is installed, the metal layer is formed by bonding an aluminum sheet composed of aluminum or an aluminum alloy, a thickness tof the circuit layer is within a range of 0.1 mm≦t≦0.6 mm, a thickness tof the metal layer is within a range of 0.5 mm≦t≦6 mm, and the relationship between the thickness tof the circuit layer and the thickness tof the metal layer satisfies t Подробнее

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

A printed wiring board includes a first insulation layer, an electronic component built into the first insulation layer, a second insulation layer having a via conductor and formed on a first surface of the first insulation layer, and a conductive film formed on the first insulation layer on the opposite side with respect to the first surface of the first insulation layer such that the conductive film is positioned to face a back surface of the electronic component. The first insulation layer has a coefficient of thermal expansion which is set higher than a coefficient of thermal expansion of the second insulation layer. 1. A printed wiring board , comprising:a first insulation layer;an electronic component built into the first insulation layer;a second insulation layer having a via conductor and formed on a first surface of the first insulation layer; anda conductive film formed on the first insulation layer on an opposite side with respect to the first surface of the first insulation layer such that the conductive film is positioned to face a back surface of the electronic component,wherein the first insulation layer has a coefficient of thermal expansion which is set higher than a coefficient of thermal expansion of the second insulation layer.2. A printed wiring board according to claim 1 , wherein the conductive film has a surface having an area which is greater than an area of the back surface of the electronic component.3. A printed wiring board according to claim 1 , further comprising:a third insulation layer having a via conductor and positioned on the second insulation layer,wherein the coefficient of thermal expansion of the first insulation layer is set higher than a coefficient of thermal expansion of the third insulation layer.4153. A printed wiring board according to claim 1 , wherein the coefficient of thermal expansion of the first insulation layer is set in a range of . to times higher than the coefficient of thermal expansion of the second ...

Multilayer wiring base plate and probe card using the same

A multilayer wiring base plate includes an insulating plate including a plurality of synthetic resin layers made of an insulating material, a wiring circuit provided in the insulating plate, a thin-film resistor formed along at least one of the synthetic resin layers to be buried in the synthetic resin layer and inserted in the wiring circuit, and a heat expansion and contraction restricting layer formed to be buried in the synthetic resin layer adjacent to the synthetic resin layer in which the thin-film resistor is formed to be buried, arranged along the thin-film resistor, and having a smaller linear expansion coefficient than a linear expansion coefficient of the adjacent synthetic resin layers.

Electrical Device for Use in an Automotive Vehicle and Method for Cooling Same

An electrical device is described for use in an automotive vehicle. The device includes a printed circuit board (PCB) having first and second sides. The PCB is adapted for multiple electronic components to be mounted to the first side, including a first component at a first position and a second component at a second position. The second component is capable of substantially blocking airflow directed substantially across the first side from at least one direction toward the first component. The PCB defines a plurality of apertures formed in a region of the PCB including the first position such that airflow directed substantially across the second side of the PCB flows through the apertures, under the first component at the first position on the first side of the PCB, and on a portion of the first side of the PCB beyond the region of the PCB including the first position.

POLYIMIDE POLYMER, POLYIMIDE FILM, AND FLEXIBLE COPPER-COATED LAMINATE

A polyimide polymer represented by the following formula 1 is provided. 3. A polyimide film comprising the polyimide polymer of .4. The polyimide film of claim 3 , wherein a dielectric constant of the polyimide film is 3 to 3.55.5. The polyimide film of claim 3 , wherein a coefficient of thermal expansion of the polyimide film is 12 ppm/° C. to 22 ppm/° C.6. The polyimide film of claim 3 , wherein a glass transition temperature of the polyimide film is 350° C. to 365° C.7. A flexible copper-coated laminate comprising: {'claim-ref': {'@idref': 'CLM-00003', 'claim 3'}, 'a polyimide film disposed on the copper foil, wherein the polyimide film is the polyimide film of .'}, 'a copper foil; and'}8. The flexible copper-coated laminate of claim 7 , further comprising an adhesive layer disposed between the copper foil and the polyimide film. This is a continuation application of and claims the priority benefit of the prior patent application Ser. No. 14/565,420, filed on Dec. 10, 2014, now allowed, which claims the priority benefit of Taiwan application serial no. 103137208, filed on Oct. 28, 2014. The entirety of each of the above-mentioned patent applications is hereby incorporated by reference herein and made a part of this specification.Field of the InventionThe invention relates to a polyimide polymer, a polyimide film, and a flexible copper-coated laminate. More particularly, the invention relates to a polyimide polymer having a low dielectric constant, a polyimide film including the polyimide polymer, and a flexible copper-coated laminate including the polyimide film.Description of Related ArtAs electronic devices gradually become thinner and lighter, the demand for use of a flexible printed circuit board greatly increases. The mainly upstream material of the flexible printed circuit board is a flexible copper-coated laminate which is produced by coating or attaching a polyimide polymer onto a copper foil. In the current industry environment, the polyimide polymer is ...

MULTI-SENSOR CAMERA WITH APERTURED CIRCUIT-CARRYING SUBSTRATE

A circuit-carrying assembly for use in an imaging system, the assembly comprising a first circuit carrier; a second circuit carrier spaced apart from the first circuit carrier; at least one attachment member to attach the circuit-carrying assembly to a rigid support member; and a compliant part between the first circuit carrier and the second circuit carrier, the compliant part allowing the second circuit carrier to move towards and away from the first circuit carrier. 1. An imaging system comprising:a rigid support member; a first part carrying a first image sensor,', 'a second part spaced apart from the first part and carrying an optical device; and', 'a compliant part between the first and the second parts, the compliant part allowing the second part to move toward and away from the first part;, 'a circuit board assembly comprising a circuit board formed to providea first attachment attaching the first part to the rigid support member; anda second attachment attaching the second part to the rigid support member.2. An imaging system according to wherein the optical device comprises a second image sensor or a structured light source.3. An imaging system according to wherein the compliant part comprises one or more compliant bridges formed in the circuit board and having portions extending in a direction that is transverse to an axis extending between the first and second parts.4. An imaging system according to wherein the compliant part comprises a part wherein the circuit board is cut away to provide thin strips of the circuit board claim 1 , the thin strips connecting the first and second parts.5. An imaging system according to wherein one or more of the thin strips has a ratio of length-to-width in the range of 4 to 20.6. An imaging system according to wherein the thin strips have parts extending transversely to an axis extending between the first and second parts.7. An imaging system according to wherein the thin strips extend across the compliant part in a ...

FLEXIBLE ELECTRONIC FIBER-REINFORCED COMPOSITE MATERIALS

The present disclosure describes multilayer fiber-reinforced electronic composite materials comprising at least one conductive layer and at least one laminate layer further comprising at least one reinforcing layer. In various embodiments, the conductive layer is a continuous metal layer, an etched-metal layer, a metal ground plane, a metal power plane, or an electronic circuitry layer. In various embodiments, the laminate layer comprises an arrangement of unidirectional tape sub-layers to provide fiber-reinforcement and various film layers. The composite materials herein find use as flexible circuit boards, ruggedized flexible electronic displays, and other assemblies requiring flexibility and strength. 1. A composite material comprising:a. at least one conductive layer; andb. at least one laminate layer comprising at least one reinforcing layer.2. The composite material of claim 1 , wherein said conductive layer is any one of a non-etched metal layer claim 1 , an etched-metal layer claim 1 , a metal ground plane layer claim 1 , a metal power plane layer claim 1 , or an electronic circuitry layer.3. The composite material of claim 2 , wherein said conductive layer is an etched-metal layer claim 2 , said etched-metal tracing a circuit design.4. The composite material of claim 1 , further comprising at least one film layer.5. The composite material of claim 4 , wherein said at least one reinforcing layer is sandwiched between two of said film layers.6. The composite material of claim 1 , wherein said reinforcing layer comprises at least one unidirectional tape sub-layer.7. The composite material of claim 6 , wherein said unidirectional tape sub-layer comprises thinly spread parallel monofilaments coated with a resin.8. The composite of claim 7 , wherein said monofilaments have diameters less than about 60 microns and wherein spacing between individual monofilaments within an adjoining strengthening group of monofilaments is within a gap distance in the range between ...

SHIELD TO IMPROVE ELECTROMAGNETIC INTERFERENCE (EMI) SUPPRESSION CAPABILITY

An apparatus is described for suppressing EMI emissions in an electrical device. In one example, the apparatus includes absorbing material surrounding at least a portion of an electrical component and electrically conductive material configured to contact at least one side of the absorbing material. 1. An electromagnetic interference (EMI) suppression apparatus comprising:absorbing material surrounding at least a portion of an electrical component; andelectrically conductive material configured to contact at least one side of the absorbing material.2. The apparatus of claim 1 , the electrically conductive material comprising at least one of a top section or one or more side sections claim 1 , wherein the absorbing material is at least partially covered by at least one of the top section or the one or more side sections of the electrically conductive material.3. The apparatus of claim 2 , wherein the electrical component is an application specific integrated circuit (ASIC).4. The apparatus of claim 3 , the ASIC including a heat sink claim 3 , wherein at least a portion of the top section of the electrically conductive material is configured to contact at least a portion of the heat sink.5. The apparatus of claim 1 , wherein at least a portion of the absorbing material comprises iron-loaded magnetic material.6. The apparatus of claim 1 , wherein at least a portion of the absorbing material comprises Q-ZORB material.7. The apparatus of claim 1 , wherein at least a portion of the absorbing material is elastic.8. A semiconductor device comprising:a printed circuit board;a heat sink; electrically conductive material; and', 'absorbing material covered on at least one side by at least a portion the electrically conductive material., 'an electromagnetic interference (EMI) suppression shield configured to contact at least one of the printed circuit board or the heat sink, the shield comprising9. The semiconductor device of claim 8 , the electrically conductive material ...

LINE STRUCTURE AND A METHOD FOR PRODUCING THE SAME

A multi-layer line structure including a substrate, a lower layer Cu line located on the substrate, an upper layer Cu line located on an insulating layer including an inorganic film located on the lower layer Cu line and an organic resin film located on the inorganic film, and a via connection part located in a via connection hole running in an up-down direction through the insulating layer in an area where the lower layer Cu line and the upper layer Cu line overlap each other is provided. The via connection part includes a barrier conductive layer located on a part of the lower layer Cu line exposed to a bottom part of the via connection hole and on an inner wall of the via connection hole. 1. A multi-layer line structure comprising:a substrate;a first line layer located on a first surface of the substrate;a second line layer located on a first insulating layer including a first inorganic layer located on the first line layer and a first organic resin film located on the first inorganic layer;a first via connection part located in a first via connection hole running in an up-down direction through the first insulating layer in an area where the first line layer and the second line layer overlap each other; andan organic insulating layer located between the substrate and the first line layer, the organic insulating layer having a third line layer therein, the third line layer being electrically connected to the first line layer, the organic insulating layer covering whole side surfaces of the third line layer.2. The multi-layer line structure according to claim 1 , wherein the first via connection part includes a first barrier conductive layer located on a part of the first line layer exposed to a bottom part of the first via connection hole and on an inner wall of the first via connection hole.3. The multi-layer line structure according to claim 1 , wherein the first inorganic layer includes a first inorganic film and a second inorganic film.4. The multi-layer line ...

CUTS IN A CIRCUIT BOARD

Examples herein relate to cuts in a circuit board. In some examples, a circuit board can include a signal connector located on the circuit board, and cuts extending through at least a body of the circuit board that are adjacent to the signal connector and extend from a perimeter of the circuit board to an inner portion of the circuit board, where the circuit board flexes relative to the signal connector responsive to the circuit board experiencing a force. 1. A circuit board , comprising:a signal connector located on the circuit board; andcuts extending through at least a body of the circuit board that are adjacent to the signal connector and extend from a perimeter of the circuit board to an inner portion of the circuit board, wherein the circuit board flexes relative to the signal connector responsive to the circuit board experiencing a force.2. The circuit board of claim 1 , wherein the circuit board includes a tongue created by the cuts in the circuit board such that a remaining portion of the circuit board flexes relative to the tongue of the circuit board.3. The circuit board of claim 2 , wherein the signal connector is located on the tongue of the circuit board.4. The circuit board of claim 1 , wherein the cuts in the circuit board extend through an entire thickness of the body of the circuit board.5. The circuit board of claim 1 , wherein the cuts in the circuit board extending from the perimeter of the circuit board to the inner portion of the circuit board are the same length.6. The circuit board of claim 1 , wherein the cuts in the circuit board extending from the perimeter of the circuit board to the inner portion of the circuit board are a different length.7. The circuit board of claim 1 , wherein the cuts in the circuit board extend partially through a thickness of the body of the circuit board.8. A system claim 1 , comprising:a circuit board;a signal connector located on the circuit board; andcuts in the circuit board that are adjacent to the signal ...

Embedding Component in Component Carrier by Component Fixation Structure

A method of manufacturing a component carrier, includes providing a base structure having a main surface that is at least partially covered by a component fixation structure; providing a component, the component intrinsically comprising warpage; mounting the component on a surface provided on a plate structure and/or on the base structure to remove the warpage of the component at least partially; and fixating the component to the component carrier through the component fixation structure. 120.-. (canceled)21. A method of manufacturing a component carrier , the method comprising:providing a base structure having a main surface that is at least partially covered by a component fixation structure;providing a component, the component intrinsically comprising warpage;mounting the component on a surface provided on a plate structure and/or on the base structure to remove the warpage of the component at least partially; andfixating the component to the component carrier through the component fixation structure.22. The method according to claim 21 , wherein mounting the component on the surface comprises adhering the component to said surface.23. The method according to claim 21 , wherein said surface comprises a planar sticky surface.24. The method according to claim 21 , further comprising:removing the plate structure after the fixation of the component to the component carrier.25. The method according to claim 21 , wherein the plate structure is an integral part of the component carrier.26. The method according to claim 21 , wherein mounting the component on the surface comprises applying a pressure on the component to force it against said surface.27. The method according to claim 21 , wherein mounting the component on the surface comprises applying heat to at least one of the component and the surface.28. The method according to claim 21 , wherein the component fixation structure is placed between the component and the base structure.29. The method according to claim ...

POWER ELECTRONICS COOLING ASSEMBLIES AND METHODS FOR MAKING THE SAME

A power electronics module includes a cold plate manifold, a heat sink base layer at least partially embedded in the cold plate manifold, an electrically-insulating layer in direct contact with the heat sink base layer, a conductive substrate positioned on the electrically-insulating layer, and a power electronics device coupled to and in direct contact with the conductive substrate. 1. A power electronics module comprising:a cold plate manifold;a heat sink base layer at least partially embedded in the cold plate manifold;an electrically-insulating layer in direct contact with the heat sink base layer;a conductive substrate positioned on the electrically-insulating layer; anda power electronics device coupled to and in direct contact with the conductive substrate.2. The power electronics module of claim 1 , wherein the heat sink base layer defines an etched surface comprising at least one engagement feature embedded within the heat sink.3. The power electronics module of claim 1 , wherein the heat sink defines an inlet and an outlet claim 1 , and a fluid passageway that extends between the inlet and the outlet.4. The power electronics module of claim 3 , wherein the heat sink base layer comprises at least one fin that is positioned at least partially within the fluid passageway.5. The power electronics module of claim 1 , further comprising a printed circuit board layer that at least partially encapsulates the conductive substrate and the power electronics device.6. The power electronics module of claim 5 , further comprising a driver circuit component positioned on a surface of the printed circuit board layer.7. The power electronics module of claim 1 , further comprises a clamp coupled to the electrically-insulating layer and extending around the heat sink.8. The power electronics module of claim 1 , wherein the power electronics device is a first power electronics device claim 1 , and the power electronics module further comprises a second power electronics ...

Radio frequency module and communication device

A radio frequency module includes: a multilayer substrate that includes a plurality of insulator layers; an amplifying circuit that is provided on the multilayer substrate and amplifies a radio frequency signal; a power supply circuit that is provided on the multilayer substrate and supplies power to the amplifying circuit; a ground conductor that is a first conductor pattern having a ground potential and used in the amplifying circuit; and a ground conductor that is a second conductor pattern having a ground potential and used in the power supply circuit. The ground conductors are physically separated from each other and provided in internal layers of the multilayer substrate.

MOTOR POWER PACK WITH OVERMOLDED PRINTED CIRCUIT BOARD INTEGRATED CONNECTOR

A motor electronics unit includes a printed circuit board having a first and a second side. An electrical conductor is connected to the printed circuit board. A heat sink is positioned proximate to the printed circuit board. A housing of a polymeric material includes: an endcap encapsulating the printed circuit board and covering an outer edge of the heat sink defining a heat sink first portion, with a second portion of the heat sink not covered by the polymeric material and extending through and outward from the endcap to transfer heat from the printed circuit board. A first section of the electrical conductor extends through and is partially encapsulated by the endcap. A connector body is integrally connected to the housing. A second section of the electrical conductor is exposed within a cavity of the connector body to electrically connect the printed circuit board to another component. 1. A motor electronics unit , comprising:a printed circuit board having a first side and a second side;at least one electrical conductor connected to the printed circuit board;a heat sink positioned proximate to the printed circuit board; an endcap encapsulating the printed circuit board and covering an outer edge of the heat sink defining a first portion of the heat sink, with a second portion of the heat sink functioning to transfer heat from the printed circuit board; and', 'a first section of the at least one electrical conductor extending through and partially encapsulated by the endcap., 'a housing molded from a low pressure injection molded thermally conductive polymeric material, the housing including2. The motor electronics unit of claim 1 , further including a connector body integrally connected to the housing claim 1 , a second section of the at least one electrical conductor exposed within a cavity of the connector body and configured to electrically connect the printed circuit board to another component.3. The motor electronics unit of claim 2 , wherein the connector ...

DRIVE DEVICE AND ELECTRIC POWER STEERING DEVICE USING SAME

A drive device for use in a vehicle includes a motor, a substrate, and at least one inter-system ground connection capacitor. The motor includes a plurality of motor windings within one housing. Multiple inverters are mounted on the substrate. Each inverter is connected to a different battery and a different ground to form a system, where each of the motor windings is associated with its own system. The inter-system ground connection capacitor is mounted on the substrate, and electrically connects the grounds of the systems together to reduce electrical noise propagated outside the drive device to other parts in the vehicle. 1. A drive device comprising:a motor having a first winding set and a second winding set housed together in one housing;a first system including a first drive circuit connected to a first power supply and a first ground, the first system configured to control a power supply from the first power supply to the first winding set;a second system including a second drive circuit connected to a second power supply and a second ground, the second system configured to control a power supply from the second power supply to the second winding set;a substrate having the first drive circuit and the second drive circuit mounted thereon; andan inter-system ground connection capacitor mounted on the substrate and configured to electrically connect the first ground of the first system with the second ground of the second system.2. The drive device of claim 1 , whereinthe substrate has a slit formed thereon for separating wiring patterns on the substrate into the first system and the second system, and whereinthe inter-system ground connection capacitor is mounted at a position on the substrate to bridge the slit.3. The drive device of claim 1 , wherein a first substrate connection portion in the first system to a position or a corresponding position on the substrate where the second drive circuit is disposed, and', 'a second substrate connection portion in the ...

HOT SWAPPABLE DEVICES

Example implementations relate to hot swappable devices. In an example, the system may include a hot swappable fan module and a heat source device. The heat source device may include a control circuit to control a voltage ramp rate of the control circuit when the hot swappable fan module is coupled to the heat source device. 1. A system , comprising:a hot swappable fan module; anda heat source device including a control circuit to control a voltage ramp rate of the control circuit when the hot swappable fan module is coupled to the heat source device.2. The system of claim 1 , wherein the hot swappable fan module is free of a signal-generating electronic.3. The system of claim 1 , wherein the hot swappable fan module only includes a connector and a fan blade device.4. The system of claim 1 , wherein the control circuit is to control the voltage ramp rate of the control circuit such that an output voltage of the control circuit ramps at a particular rate to activate the hot swappable fan module.5. The system of claim 1 , wherein the control circuit is to detect current changes when the hot swappable fan module is coupled to the heat source device.6. The system of claim 1 , wherein the heat source device includes a circuit board claim 1 , on which the control circuit is implemented.7. A printed circuit board (PCB) claim 1 , comprising:a protrusion formed on an edge of the PCB, the protrusion to couple the PCB to a hot swappable fan module; anda control circuit including a gate controller to control a voltage ramp rate of the control circuit when the hot swappable fan module is coupled to the PCB.8. The PCB of claim 7 , wherein the PCB includes a voltage detector that activates the gate controller when an input voltage of the control circuit is above a threshold.9. The PCB of claim 7 , wherein the gate controller is to control the voltage ramp rate via a passive ramp controller coupled to the gate controller.10. The PCB of claim 7 , wherein the gate controller is to ...

Vibration-Resistant Circuit Arrangement for Electrically Connecting Two Terminal Regions

Various embodiments include a circuit arrangement comprising: a heat sink; and a set of layers arranged on a surface of the heat sink. The set of layers includes a first electrically insulating insulation layer and an electrically conductive conductor layer arranged on a side of the insulation layer facing away from the heat sink. The set of layers includes an electrical connecting path between two electrical connection regions. At least one layer of the set of layers is formed by cold gas spraying of a respective material.

MOTOR POWER PACK WITH OVERMOLDED PRINTED CIRCUIT BOARD INTEGRATED CONNECTOR

A motor electronics unit includes a printed circuit board having a first side and a second side with electronic components connected to the printed circuit board. An electrical conductor is connected to the printed circuit board. A heat sink is connected to the printed circuit board. A pre-molded electrical connector shroud has a portion of the electrical conductor positioned within the electrical connector shroud. A housing has an endcap, both co-molded in a low pressure injection molding process of a thermally conductive polymeric material. The endcap encapsulates the printed circuit board including the electronic components connected to the printed circuit board and covers a first portion of the heat sink, with a second portion of the heat sink uncovered by the polymeric material of the endcap to permit heat transfer away from the printed circuit board. The endcap also encapsulates a portion of the electrical connector shroud. 1. A motor electronics unit , comprising:a printed circuit board;at least one electrical conductor connected to the printed circuit board;a heat sink positioned proximate to the printed circuit board;a pre-molded electrical connector shroud having a portion of the least one electrical conductor positioned within the electrical connector shroud; and a first endcap portion partially encapsulating the printed circuit board; and', 'a second endcap portion encapsulating a first section of the electrical connector shroud., 'a housing molded from a low pressure injection molded thermally conductive polymeric material, the housing including2. The motor electronics unit of claim 1 , wherein a second section of the electrical connector shroud extends out an end surface of the housing and freely away from the housing.3. The motor electronics unit of claim 1 , wherein the first section of the electrical connector shroud defines a flange extending around a perimeter of the electrical connector shroud.4. The motor electronics unit of claim 3 , wherein ...

MICROCAPSULE, SHEET MATERIAL, CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND COMPUTER READABLE STORAGE MEDIUM

A microcapsule includes a shell including a conducting component; and a thermally expandable component contained in the shell and having a property of expanding by heating, the shell deforming due to expansion of the thermally expandable component to come in contact with another capsule and have a conducting state with the other capsule. 1. A microcapsule comprising a shell including a conducting component; anda thermally expandable component contained in the shell and having a property of expanding by heating,the shell deforming due to expansion of the thermally expandable component to come in contact with another capsule and have a conducting state with the other capsule.2. The microcapsule according to claim 1 , wherein the shell includes a resin material having the conducting component mixed therein.3. The microcapsule according to claim 2 , wherein the shell includes an outer layer including a resin material having the conducting component mixed therein claim 2 , and an inner layer including a resin material not having the conducting component mixed therein.4. The microcapsule according to claim 1 , wherein the shell includes a resin material coated with the conducting component on the surface.5. A thermally expandable material comprising microcapsules and a binder having an insulating property claim 1 ,each microcapsule including a shell including a conducting component, and a thermally expandable component contained in the shell and having a property of expanding by heating,the shell deforming due to expansion of the thermally expandable component to come in contact with another capsule and have a conducting state with the other capsule.6. A sheet material comprising: a base layer; anda thermally expandable layer disposed on the base layer,the thermally expandable layer including microcapsules and a binder having an insulating property,each microcapsule including a shell including a conducting component, and a thermally expandable component contained in the ...

THERMALLY EXPANDABLE MATERIAL, SHEET MATERIAL, CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, COMPUTER READABLE STORAGE MEDIUM, ELECTRONIC APPARATUS, AND STRUCTURE TO ANALYZE HEAT-GENERATION POSITION

A thermally expandable material includes microcapsules and a binder having a conducting property, each microcapsule including a shell having an insulating property, and a thermally expandable component contained in the shell and having a property of expanding by heating, the shell deforming due to expansion of the thermally expandable component to come in contact with another capsule and have an insulating state with the other capsule. 1. A thermally expandable material , comprising microcapsules and a binder having a conducting property ,each microcapsule including a shell having an insulating property, and a thermally expandable component contained in the shell and having a property of expanding by heating,the shell deforming due to expansion of the thermally expandable component to come in contact with another capsule and have an insulating state with the other capsule.2. A sheet material , comprising:a base layer; anda thermally expandable layer disposed on the base layer,the thermally expandable layer including microcapsules and a binder having a conducting property,each microcapsule including a shell having an insulating property, and a thermally expandable component contained in the shell and having a property of expanding by heating,the shell defining an insulating region due to expansion of the thermally expandable component.3. The sheet material according to claim 2 , whereinin a not-insulating region other than the insulating region, the microcapsules expand only to a predetermined magnification, andin the insulating region, the microcapsules expand to a predetermined magnification or more.4. A circuit board including the sheet material according to having a partially expanding part claim 2 ,whereina not-expanding region of the thermally expandable layer defines a conducting region of a circuit, andan expanding region of the thermally expandable layer defines an insulating region of the circuit.5. The circuit board according to claim 4 , further ...

Electrical connection arrangement

A connection arrangement includes a printed circuit board, a semiconductor component arranged on a first surface, a first side, of the printed circuit board, a connection means arranged on a second surface, a second side, of the printed circuit board, a contact element contactable with the connection means and an electrical line, wherein the connection means is arranged opposite the semiconductor component.

PRINTED WIRING BOARD, METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGE

A printed wiring board includes a wiring conductor layer having a first surface, conductor posts formed on a second surface of the wiring conductor layer on the opposite side with respect to the first surface, and a resin insulating layer embedding the wiring conductor layer such that the first surface of the wiring conductor layer is recessed with respect to a first surface of the resin insulating layer and exposed on the first surface of the resin insulating layer and covering side surfaces of the conductor posts such that an end surface of each of the conductor posts is protruding from a second surface of the resin insulating layer on the opposite side with respect to the first surface of the resin insulating layer.