Deposition of solder pattern on circuit boards - applying charge drum collecting pattern of soldered powder particles for transfer to board.

A printing process used to transfer solder onto a circuit board has a drum (1) with a photoconducting surface (3) of selenium or zinc oxide. An electrical charge unit (5) is positioned near to the surface together with a magazine (6) containing solder powder. A controlled light source (9) output is directed onto the faces of a rotating polygon scanner (10). The modulated beam is reflected (11) onto the drum surface to form a charge pattern that collects solder particles transferred onto the circuit board. ADVANTAGE - High precision formation of solder on board surface.

Verfahren zur Herstellung von schaltungstragenden Kunststoffgehäusen elektronischer Bauteile

Elektronik-Bauteile, bei denen Leiterbahnen direkt in die innenseitige Oberfläche von Kunststoffgehäusen integriert sind, müssen mit Kontaktstiften versehen werden, die nach einiger Zeit nicht mehr kontaktsicher sind. DOLLAR A Nach dem vorliegenden Verfahren werden keine Kontaktstifte benötigt, indem in einem Zweikomponentenspritzgießverfahren in einem ersten Spritzgießvorgang unter Verwendung eines elektrisch leitfähigen Kunststoffs elektrische Leiterbahnen der Schaltung einschließlich der später durch Wandungen hindurchgehenden Verbindungen spritzgegossen werden und in einem zweiten Spritzgießvorgang ein Umgießen der Leiterbahnen mit einem nichtleitenden Kunststoff zu der fertigen Gehäuseform erfolgt.

METHOD OF FABRICATING CIRCUIT

TRANSFER VOLUME WITH ELECTRICAL AND THERMAL LEADING ADHESIVE.

Metallurgically bonded polymer vias

MATERIAL AND METHOD OF MANUFACTURE OF A SOLDER JOINT WITH HIGH THERMAL CONDUCTIVITY AND HIGH ELECTRICAL CONDUCTIVITY

The present invention provides a powder blend or composite powder that is fed into a kinetic spray device, accelerated towards a substrate or part in order to form a composite solder with thermal and electrical properties better than existing solder. The other advantages of building a solder layer in this manner include a low oxide content to improve subsequent solderability, excellent control of the deposition thickness, excellent control of the deposition chemistry and lastly, high speed of manufacture.

METHOD OF FORMING SOLDER FILM

A method of forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts, which is capable of forming a precise and fine pattern and which comprises selectively imparting tackiness to only a predetermined part of the metallic surface by means of a tacky layer-forming solution containing at least one compound selected from benzotriazole derivatives, naphthotriazole derivatives, imidazole derivatives, benzoimidazole derivatives, mercaptobenzothiazole derivatives, benzothiazole thiofatty acid derivatives, and triazine derivatives, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.

ELECTRICALLY CONDUCTIVE COMPOSITIONS AND METHODS FOR THE PREPARATION AND USE THEREOF

Electrically conductive adhesive compositions and methods for the preparation and use thereof; in which a solder powder, a chemically protected cross-linking agent-with fluxing properties and a reactive monomer or polymer sue the principal components. Depending upon the intended end use; the compositions comprise three or more of the following: a relatively high melting metal powder; solder powder; the active cross-linking agent which also serves as a fluxing agent; a resin; and a reactive monomer or polymer. The compositions are useful as improved conductive adhesives, such as for attaching electrical components to electrical circuits; the compositions comprising metal powder are ideally suited for creating the conductive paths on printed circuits. The compositions for forming conductive-paths may first be applied to a substrate in the desired pattern of an electrical circuit, and then heated to cure it. During heating, the action of the cross-linking agent and optional reactive monomer or polymer within the mixture fluxes the metals, enabling sintering to occur between the metal powder and the solder powder.

Electronic components mounting adhesive and electronic components mounting structure

本发明的目的是提供一种电子部件安装粘合剂，该电子部件安装粘合剂可以防止在将电子部件相互结合得到的电子部件安装结构中发生裂纹和剥离，以及使用该电子部件安装粘合剂结合电子部件而得到的电子部件安装结构。在电子部件安装结构中，第一电路板和第二电路板通过电子部件安装粘合剂来结合。这里，电子部件安装粘合剂是通过将金属粒子分散于热固性树脂内来得到，该金属粒子熔点Mp低于该热固性树脂的固化材料的玻璃转变温度Tg。

Adhesive composition, electronic component-mounted substrate using the adhesive composition, and semiconductor device

FLIP CHIP MOUNTING PROCESS AND FLIP CHIP ASSEMBLY

차세대 LSI의 플립 칩 실장에 적용 가능한, 생산성 및 신뢰성이 높은 플립 칩 실장 방법은, 복수의 전극 단자(11)를 구비한 배선 기판(10) 상에, 땜납 분말 및 대류 첨가제(12)를 함유하는 수지(13)를 공급한 후, 수지(13)의 표면에 복수의 접속 단자(21)를 구비한 반도체 칩(20)을 맞닿게 한다. 이 상태에서, 배선 기판(10)을, 땜납 분말이 용융되는 온도로 가열한다. 가열 온도는, 대류 첨가제(12)의 비점보다도 높은 온도로 실행되어서, 비등한 대류 첨가제(12)는 수지(13) 중에서 대류한다. 이 가열 공정에서, 용융된 땜납 분말을, 배선 기판(10)의 전극 단자(11)와 반도체 칩(20)의 접속 단자(21)의 사이에 자기 집합시킴으로써, 전극 단자(11)와 접속 단자(21)를 전기적으로 접속한다. 마지막으로, 수지(13)를 경화시켜서, 반도체 칩(20)을 배선 기판(10)에 고정한다. The highly productive and reliable flip chip mounting method applicable to flip chip mounting of the next generation LSI includes solder powder and convective additive 12 on the wiring board 10 having the plurality of electrode terminals 11. After supplying the resin 13, the semiconductor chip 20 including the plurality of connection terminals 21 is brought into contact with the surface of the resin 13. In this state, the wiring board 10 is heated to a temperature at which the solder powder is melted. The heating temperature is performed at a temperature higher than the boiling point of the convective additive 12, and the boiling convective additive 12 convections in the resin 13. In this heating step, the molten solder powder is self-assembled between the electrode terminal 11 of the wiring board 10 and the connection terminal 21 of the semiconductor chip 20 to thereby form the electrode terminal 11 and the connection terminal ( 21) is electrically connected. Finally, the resin 13 is cured to fix the semiconductor chip 20 to the wiring board 10.

CONDUCTIVE MATERIAL, CONDUCTIVE PASTE, CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE

Electronic components mounting adhesive and electronic components mounting structure

The invention intends to provide an electronic component mounting adhesive that can inhibit cracks and peelings in an electronic component mounting structure obtained by joining electronic components each other from occurring and an electronic component mounting structure obtained by joining electronic components with such an electronic component mounting adhesive. In an electronic component mounting structure, a first circuit board and a second circuit board are bonded with an electronic component mounting adhesive. Here, the electronic component mounting adhesive is obtained by dispersing metal particles having the melting temperature Mp lower than the glass transition temperature Tg of a cured material of a thermosetting resin in the thermosetting resin.

Conductive fine particles, method for plating fine particles, and substrate structural body

The purpose of the present invention is to provide a conductive fine particles having an ability of relaxing the force exerted on a circuit, and a method for retaining the constant distance between substrates. The present invention relates to conductive fine particles, wherein at least one metallic layer is covered with basic fine particles of resin. The coefficient of linear expansion of the resin is 3x10-5 to 7x10-5 (1/K).

METHOD OF FORMING CONDUCTIVE PATTERN AND WIRING BOARD

... [PROBLEMS] To provide a method of conductive pattern formation by which a fine pattern can be easily formed at a low cost. [MEANS FOR SOLVING PROBLEMS] A flat plate having a protrudent pattern formed on a surface thereof is disposed so as to face a substrate. A fluid containing conductive particles and a bubble generator is supplied to the space between the substrate and the flat plate. The fluid is then heated to cause the bubble generator contained in the fluid to generate bubbles. As the bubbles generated by the bubble generator grow, the fluid is pushed away by the bubbles and, as a result, gathers by itself in the space between the protrudent pattern formed on the flat plate and the substrate due to interfacial tension. The conductive particles thus gathered, which are contained in the fluid having gathered by itself, constitute a conductive pattern on the substrate.

ADHESIVE COMPOSITION, ELECTRONIC COMPONENT-MOUNTED SUBSTRATE USING THE ADHESIVE COMPOSITION, AND SEMICONDUCTOR DEVICE

This invention provides an adhesive composition which, while maintaining storage stability, can form a metallic bond in such a state that the cured product wets components and is spread well between components, and is excellent in adhesion, electroconductivity, TCT resistance, and mounting reliability such as high-temperature standing resistance, and an electronic component-mounted substrate using the adhesive composition and a semiconductor device.The adhesive composition comprises electroconductive particles (A) and a binder component (B). The adhesive composition is characterized in that the electroconductive particles (A) comprise a metal (a1), which has a melting point equal to or above the reflow temperature and is free form lead, and a metal (a2), which has a melting point below the reflow temperature and is free from lead, and the binder component (B) comprises a heat curable resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2).

Interconnections with electrically conductive adhesives: structures, materials, method and their applications

A new interconnection scheme is disclosed for a tape automated bonding (TAB) package, a flip chip package and an active matrix liquid crystal display (AMLCD) panel, where an electrically conducting adhesive is used to form an electrical interconnection between an active electronic device and its components. The electrically conducting adhesive can be a mixture comprising a polymer resin, a no-clean solder flux, a plurality of electrically conducting particles with an electrically conducting fusible coating which provides a metallurgical bond between the conducting particles as well as to the substrates. The advantages of using the electrically conducting adhesives include reduction in bonding pressure and/or bonding temperature, control of interfacial reactions, promotion of stable metallurgical bonds, enhanced reliability of the joints, and others.

Thermally and electrically conductive adhesive material and method of bonding with same

The present invention discloses a thermally and electrically conductive adhesive material comprising a hardened adhesive, and a non-solidified filler containing a liquid metal dispersed in separate spaced regions of the adhesive. The hardened adhesive provides a mechanical bond whereas the filler provides continuous thermal and electrical metal bridges, each bridge extending through the adhesive and contacting the bonded surfaces. The method includes (a) dispersing a filler containing a liquid metal into an unhardened adhesive, (b) contacting the unhardened adhesive and the filler in non-solidified state to the surfaces resulting in separate spaced regions of the non-solidified filler contacting both surfaces, and (c) hardening the adhesive.

Method of manufacturing an electronic circuit and manufacturing apparatus of an electronic circuit

A method of manufacturing an electronic circuit satisfying demands for cost reduction, diversified small-quantity production, and a shorter cycle of design, manufacture, evaluation, correction, and so on is provided. The method includes at least forming a first pattern or forming a second pattern. Forming the first pattern comprises: forming a visible image on an electrostatic latent image formed on a photosensitive base, by the adhesion of charged particles essentially made of a resin; transferring the visible image onto the intermediate transfer base by the contact and pressurization of the visible image; heating/softening on the intermediate transfer base; and transferring a heated/softened resin layer onto a base material by the contact and pressurization of the resin layer. In forming the second pattern, using charged particles containing conductive metal particulates, a conductor metal layer is formed by electroless plating after a metal-containing resin pattern is transferred similarly ...

ELECTRONIC DEVICE, BONDING MATERIAL, AND METHOD FOR PRODUCING ELECTRONIC DEVICE

An electronic device has a printed substrate having land electrodes and a chip-type electronic component having external electrodes formed on a surface of a component element body. The land electrodes and the external electrodes are bonded via a solder to form electrode bonding parts. A thermosetting resin is filed between the electrode bonding parts. The bonding material contains solder particles having a melting point T1, a thermosetting resin having a curing temperature T2 that is higher than the melting point T1, and an activating agent having an activation temperature T3 that is lower than the curing temperature T2. The viscosity of the contained components except the solder particles at the melting point T1 is 0.57 Pa·s or less, and the melting point T1 and the activation temperature T3 satisfy T1T3<50° C.

Material and method of manufacture of a solder joint with high thermal conductivity and high electrical conductivity

The present invention provides a powder blend or composite powder that is fed into a kinetic spray device, accelerated towards a substrate or part in order to form a composite solder with thermal and electrical properties better than existing solder. The other advantages of building a solder layer in this manner include a low oxide content to improve subsequent solderability, excellent control of the deposition thickness, excellent control of the deposition chemistry and lastly, high speed of manufacture.

METHOD FOR BONDING ELECTRICAL CONDUCTORS TO AN INSULATING SUBSTRATE

Electrical conductors (30) are bonded to an insulating substrate (10) by partially embedding granulated electrically conductive material (22) in said insulating substrate to provide exposed unembedded portions thereof, and binding the exposed portions of said partially embedded granules (34 and 36) in an electrically conductive matrix.

Verfahren zum Aufbringen von Kohlenstoff/Zinn-Gemengen auf Metall- oder Legierungsschichten

Die Erfindung betrifft ein Verfahren zum Aufbringen einer Beschichtungszusammensetzung enthaltend Kohlenstoff in Form von Kohlenstoff-Nanoröhren, Graphenen, Fullerenen oder deren Mischungen und Metallpartikel, auf ein Substrat. Die Erfindung betrifft ferner das durch das erfindungsgemäße Verfahren hergestellte beschichtete Substrat sowie die Verwendung des beschichteten Substrats als elektromechanisches Bauteil.

ELEKTRISCH LEITFÄHIGE ZUSAMMENSETZUNGEN UND VERFAHREN ZUR HERSTELLUNG DERSELBEN UND ANWENDUNGEN

A method of fabricating a circuit

In a method of fabricating a circuit, an adhesive region (8) is laid down on a substrate (1) and conductive particles are applied to the adhesive region to provide a conductive area such as a circuit track. A suitable material for the adhesive is a sticky ink which is laid down by offset lithography. It is preferred that a containing layer (11) is applied over the tracks to contain the conductive particles in the required region when heating is applied to fuse the particles together. ...

Forming conductive tracks on circuit boards

Conductive tracks (22) on an insulating substrate (11), e.g. in the manufacture of a printed circuit board, are formed by coating the substrate with a conductive film, applying a powdered solder to the film, and directing laser light on to the solder to fuse a track pattern on to the film. The fused solder is then used as an etch mask for the removal of the uncoated portions of the film. ...

PROCEDURE FOR THE PRODUCTION ELECTRICAL OF CONDUCTIVE CONNECTING STRUCTURES

ELECTRICALLY CONDUCTIVE COMPOSITIONS AND PROCEDURES FOR THE PRODUCTION THE SAME AND APPLICATIONS

COATED AND MAGNETIC PARTICLES AND APPLICATIONS THEREOF

Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards

ELECTRICALLY AND THERMALLY CONDUCTIVE ADHESIVE TRANSFER TAPE

Apparatus for adhering solder powder and method for adhering solder powder to electronic circuit board

Disclosed is a solder powder adhering apparatus, which finely adheres a solder powder to an electronic circuit board. Also disclosed is a method for adhering the solder powder to the electronic circuit board. The apparatus for adhering the solder powder is provided with: a container, which contains the electronic circuit board and the solder powder; a substrate holding unit, which is provided in the container, and which holds the electronic circuit board such that the substrate surface faces substantially the vertical direction; a tilting mechanism, which has a tilted position where the container is tilted in the first direction as the initial position of the container, and tilts the container in the second direction, which is the direction opposite to the first direction, then, tilts the container again in the first direction; an eccentric motor, which vibrates the bottom portion of the container by rotating the rotating shaft, and which is provided at the center of the bottom portion; ...

Multilayer wiring substrate producing method and multilayer wiring substrate obtained by the same

BUILDUP BOARD, AND ELECTRONIC COMPONENT AND APPARATUS HAVING THE BUILDUP BOARD

Filling composition, Semiconductor device including the same and Method of fabricating the semiconductor device

ANISOTROPIC ELECTROCONDUCTIVE MATERIAL

... [PROBLEMS] To provide an anisotropic electroconductive material which can solve problems of the conventional anisotropic electroconductive material using low-melting particles as electroconductive particles that the electroconductivity between conductors in a vertical direction necessary for good continuity is low and, further, the insulating resistance between adjacent conductors necessary for high insulating resistance is low. [MEANS FOR SOLVING PROBLEMS] An anisotropic elctroconductive material in which the solidus line of low-melting particles is 125°C or above, the peak temperature is 200°C or below, and the difference in temperature between the solidus line temperature and the peak temperature is 15°C or above. Among the low-melting particles, the maximum diameter of the low-melting particles is smaller than one-fourth of the distance between the adjacent conductors. COPYRIGHT KIPO & WIPO 2010 ...

Electric components connecting method

Wiring board having through hole or non-through hole, and method for producing the same

Multilayer flexible wired circuit board and producing method thereof

A two-surface substrate is prepared. The two-surface substrate has a first insulating layer, a first conduction layer on one side of the first insulating layer, and a second conduction layer on another side of the first insulating layer. A first single-surface substrate having a second insulating layer and a third conductive layer on one side of the first single-surface substrate is prepared. A second single-surface substrate having a third insulating layer and a fourth conductive layer on one side of the third insulating layer is prepared. The first conductive layer is bonded to the third conductive layer with first thermosetting bonding agent layer, and the second conductive layer is bonded to the fourth conductive layer with a second thermosetting bonding agent layer. As a result, a four-layer flexible electric circuit board is formed.

MASK AND METHOD FOR ELECTROKINETIC DEPOSITION AND PATTERNING PROCESS ON SUBSTRATES

A mask for application to a substrate to facilitate electrokinetic deposition of charged particles onto the substrate, the mask comprising a conducting layer, a dielectric layer, and mask openings. A method for applying a pattern of charged particles to a substrate comprising applying the foregoing the substrate to yield a masked substrate; immersing the masked substrate in a bath containing the charged particles; and establishing an electrical potential between the conducting layer of the mask and a counter-electrode thereby electrokinetically depositing the particles through the mask openings onto areas of the substrate exposed in the mask openings. Products made by this method.

SHEET FOR FORMING SOLDER BUMP AND METHOD FOR MANUFACTURE THEREOF

A method for manufacturing a sheet for forming a solder bump which comprises providing a sheet (1) having recesses (5) at prescribed positions, the bottom surface of the recess being comprised of an adhesive (3); filling the recess (5) with a solder powder (6) to thereby attach and hold the solder powder with the adhesive (3); removing the solder powder (6) being not held with the adhesive from the sheet (1); and coating the solder powder in the recess (5) of the sheet (1) with a flux or a thermoplastic resin layer having the function of a flux, to thereby manufacture a sheet for forming a solder bump holding a solder powder in respective recesses. Another method for manufacturing a sheet for forming a solder bump which further comprises heating the above resultant sheet (1), to convert the powder in each dent to one molten sphere (10); and cooling the sheet to form solidified solder balls (11) in respective recesses and thereby manufacture a sheet for forming a solder bump holding solder ...

ELECTRICALLY CONDUCTIVE PASTE, AND ELECTRICAL AND ELECTRONIC DEVICE COMPRISING THE SAME

Disclosed is an electrically conductive paste which enables to reduce the level of void growth in a conducting pathway formed in a joint part produced after curing the electrically conductive paste in the implementation of an electronic component on a circuit board by using the electrically conductive paste, and which contains a reduced amount of a viscosity-adjusting/thixotropy-imparting additive. Two Sn-containing low-melting-point alloy particles having different melting points and different average particle diameters are selected as electrically conductive filler components to be used in an electrically conductive paste, and the two alloy particles are mixed at a predetermined ratio for use.

SOLDER, AND SOLDERED ELECTRONIC COMPONENT AND ELECTRONIC CIRCUIT BOARD

A soldering material, electronic component improves bonding stength and electronic circuit board. Solder wettability is improved to increase bonding strength and the tombstone phenomenon is prevented by gradual melting of solder. To inprove soldering reliability, a coating of indium (In) or bismuth (Bi) is applied to a soldering material, the lead frame and electrodes of an electronic component, and a copper (Cu) land of an electronic circuit board.

Buildup board, and electronic component and apparatus having the buildup board

A buildup board includes a buildup layer having a multilayer structure and/or a core layer having a multilayer structure. The multilayer structure includes a signal wiring pattern, a pad connected to the signal wiring pattern, an insulating part arranged around the pad on the same layer as the pad, and a conductor arranged around the insulating part on the same layer as the pad. The multilayer structure has at least two different keepouts where the keepout is defined as a minimum interval between an outline of the pad and the conductor closest to the pad on the same layer.

Production method of connection structure

In order to lower the substantial heating temperature of a thermosetting adhesive and to realize favorable connection reliability during connecting an electrical element to a circuit board by anisotropic conductive connection with using solder particles, a product in which solder particles having a melting temperature Ts are dispersed in an insulating acrylic-based thermosetting resin having a minimum melt viscosity temperature Tv is used as an anisotropic conductive adhesive in producing a connection structure by connecting the circuit board and the electrical element to each other by anisotropic conductive connection.

Method of enabling solder deposition on a substrate and electronic package formed thereby

An electronic package includes a substrate (110, 310, 510) and a solder resist layer (120, 320, 520) over the substrate. The solder resist layer has a plurality of solder resist openings (121, 321, 521) therein. The electronic package further includes a finish layer (130, 330, 535) in the solder resist openings, an electrically conducting layer (140, 440) in the solder resist openings over the finish layer, and a solder material (150, 810) in the solder resist openings over the electrically conducting layer. The electrically conducting layer electrically connects the solder resist openings in order to enable the electrokinetic deposition of the solder material.

TRANSIENT LIQUID PHASE MATERIAL BONDING AND SEALING STRUCTURES AND METHODS OF FORMING SAME

A method of forming a bonding element including a first transient liquid phase (TLP) bonding element including a first material and a second material, the first material having a higher melting point than the second material, a ratio of a quantity of the first material and the second material in the first TLP bonding element having a first value, and a second TLP bonding element including the first material and the second material, a ratio of a quantity of the first material and the second material in the second TLP bonding element having a second value different from the first value.

Printed wiring board and method of manufacturing a printed wiring board

A heated and pressed printed wiring board (100) is made by filling via-holes formed in layers of insulating film of the wiring board (100) with an interlayer conducting material. The insulating film is stacked with conductor patterns (22), and each conductor pattern (22) closes a via hole (24). The interlayer conducting material forms a solid conducting material (51, 52) in the via holes (24) after a heating a pressing procedure. The solid conducting material (51, 52) includes two types of conducting materials. The first type of conducting material (51) includes a metal, and the second type of conductive material (52) includes an alloy formed by the metal and conductor metal of the conductor patterns (22). The conductor patterns (22) are electrically connected reliably without relying on mere mechanical contact.

Conductive plastic, conductive circuit using the same, and method for forming the conductive circuit

Method for manufacturing electronic data carrier, involves arranging electronic component module exchange areas to exchange areas of wire or thread

The method involves arranging, pressurizing and heating an adhesive film (5) with solder particles (6) between exchange areas (1b) of the electronic component module (1). The electronics component module exchange areas is assigned to exchange areas (2C) of the wire or thread (2a), until a permanent electrical solder joint is developed between the electronic component module exchange areas and the exchange areas, and a permanent adjustment of the electronic construction unit module is developed on the textile substrate. An independent claim is also included for an electronic data carrier for textile fabric.

FORMING CONDUCTING TRACKS ON CIRCUIT BOARDS

ELECTRICALLY CONDUCTIVE PASTE MATERIALS AND APPLICATIONS

A structure and method of fabrication are described. The structure is a combination of a polymeric material and particles, e.g. Cu, having an electrically conductive coating, e.g. Sn. Heat is applied to fuse the coating of adjacent particles. The polymeric material is a thermoplastic. The structure is disposed between two electrically conductive surfaces, e.g. chip and substrate pads, to provide electrical interconnection and adhesion between their pads.

Solder transfer

Joining sheet, electronic component, and producing method thereof

The invention provides a joining sheet, electronic component, and producing method thereof. The joining sheet contains solder particles, a thermosetting resin, a thermoplastic resin, and a blocked carboxylic acid.

HEATING DEVICE, REFLOW DEVICE, HEATING METHOD, AND BUMP FORMING METHOD

A solder bump is formed on a substrate by using a heating device where a lid structure (51) blocks hot air (41, 42) from directly blowing against a solder composition (10). Because use of the heating device reduces high-temperature oxygen molecules that come into contact with the solder composition (10), oxidation of the solder composition (10) is suppressed. As a result, in spite of the fact that the hot air (41, 42) is used for heating, a solder bump can be formed by the liquid-like solder composition (10). Further, because the lid structure (51) is uniformly heated by the hot air (41, 42), radiation heat from the lid structure (51) is also uniform, and as a result, a container (30) is more uniformly heated. In addition, because the hot air (41, 42) is suppressed from directly blowing against a liquid surface (13), the liquid-like solder composition (10) is not scattered by the hot air (41, 42). © KIPO & WIPO 2008 ...

ADHESIVE COMPOSITION, ELECTRONIC COMPONENT-MOUNTED SUBSTRATE USING THE ADHESIVE COMPOSITION, AND SEMICONDUCTOR DEVICE

ANISOTROPIC ELECTROCONDUCTIVE MATERIAL

METHOD OF MOUNTING ELECTRONIC PARTS ON WIRING BOARD

접속용 패드에 얇은 땜납층을 통해서 베어 칩을 플립칩 접속에 의해 접속하고, 기판상의 탑재용 패드에 얇은 땜납층을 통해서 적어도 다른 납땜 부품을 납땜하는 배선 기판상으로의 전자 부품 탑재 방법이 제공된다. 우선, 상기 접속용 패드 및 탑재용 패드상에 접착제 수지층을 형성한다. 땜납 입자를 산포하여, 상기 접속용 패드 및 탑재용 패드상에 땜납 입자를 임시 접착한다. 상기 탑재용 패드상에 상기 납땜 부품을 탑재하고, 리플로우 처리를 행하여, 상기 땜납 입자를 리플로우시켜서 상기 접속용 패드상에 얇은 땜납층을 프리-코팅하고, 동시에 상기 탑재용 패드상에 땜납을 통해서 상기 납땜 부품을 탑재한다. 최종적으로, 상기 접속용 패드의 얇은 땜납층상에 베어 칩을 위치결정하고, 상기 베어 칩을 상기 접속용 패드에 플립칩 접속하는 플립칩 접속 처리를 행한다. Provided is a method for mounting an electronic component onto a wiring board which connects a bare chip to a connection pad through a thin solder layer by flip chip connection, and solders at least another solder component to the mounting pad on the substrate through the thin solder layer. . First, an adhesive resin layer is formed on the said connection pad and a mounting pad. The solder particles are dispersed, and the solder particles are temporarily bonded onto the connection pad and the mounting pad. The solder component is mounted on the mounting pad, reflow treatment is performed to reflow the solder particles to pre-coat a thin solder layer on the connection pad, and at the same time solder is placed on the mounting pad. Mount the solder parts through. Finally, a bare chip is positioned on the thin solder layer of the connecting pad, and a flip chip connecting process of flip chip connecting the bare chip to the connecting pad is performed. 베어 칩, 땜납, 패드, 플립칩, 리플로우 Bare Chip, Solder, Pads, Flip Chip, Reflow

FORAMTION METHOD FOR WIRING PATTERN USING NANO INK COMPRISING METALS WITH LOW MELTING POINT

CONDUCTIVE CONNECTING MATERIAL, METHOD FOR PRODUCING ELECTRONIC COMPONENT, ELECTRONIC MEMBER WITH CONDUCTIVE CONNECTING MATERIAL AND ELECTRONIC COMPONENT

Process for production of connected structure

In the production of a connected structure by the anisotropic conductive connection of a wiring substrate to an electric element for the purpose of achieving good connection reliability by decreasing the temperature for the main heating of a heat-curable adhesive agent in the anisotropic conductive connection of the electric element to the wiring substrate using solder particles, a material produced by dispersing solder particles having a melting temperature (Ts) in an insulating acrylic heat-curable resin having a lowest melt viscosity temperature (Tv) is used as the anisotropic conductive adhesive agent. In a first heating/pressurizing step, the anisotropic conductive adhesive agent is melt-fluidized to cause the press-out of the adhesive agent from a gap between the wiring substrate and the electric element, and the adhesive agent is pre-cured. In a second heating/pressuring step, the solder particles are molten to form a metal bond between an electrode of the wiring substrate and an ...

COMPONENTS JOINING METHOD AND COMPONENTS JOINING STRUCTURE

To provide a components joining method and a components joining structure which can realize joining of components while securing conduction at a low electrical resistance with high reliability. In a construction in which by using a solder paste containing solder particles 5 in a thermosetting resin 3a, a rigid substrate 1 and a flexible substrate 7 are bonded by the thermosetting resin 3a, and a first terminal 2 and a second terminal 8 are electrically connected by the solder particles 5, a blending ratio of an activator of the thermosetting resin 3a in the solder paste is properly set and oxide film removed portions 2b, 8b, and 5b are partially formed in oxide films 2a, 8a, and 5a of the first terminal 2, the second terminal 8, and the solder particles 5. Thereby, the first terminal 2 and the second terminal 8 are electrically conducted by solder bonding the solder particles 5 to both the first terminal 2 and the second terminal 8 via the oxide film removed portions 2b and 8b, and while ...

ADHESIVE TAPE, JOINT STRUCTURE, AND SEMICONDUCTOR PACKAGE

Disclosed is an adhesive tape (101) for electrically connecting conductive members to each other. The adhesive tape (101) comprises a resin layer (132) containing a thermocurable resin, a solder powder (103), and a curing agent. The solder powder (103) and the curing agent are present in the resin layer (132), the curing temperature (T1) of the resin layer (132) and the melting point (T2) of the solder powder (103) meet the requirement expressed by the following formula: T1 ≥ T2+20˚C, and the melt viscosity of the resin layer (132) at the melting point (T2) of the solder powder (103) ranges from 50 to 5000 Pa s inclusive.

MULTILAYER FLEXIBLE WIRING CIRCUIT BOARD AND ITS MANUFACTURING METHOD

A multilayer flexible wiring circuit board on which high-density wiring can be laid and which can be thin and compact and its manufacturing method are disclosed. A double-sided base sheet (24) having a first insulating layer (21) on both sides of which formed are first and second conductive layers (22, 23), a first single-sided base sheet (30) having a second insulating layer (28) on one side of which formed is a third conductive layer (29), and a second single-sided base sheet (33) having a third insulating layer (31) on one side of which formed is a fourth conductive layer (32) are prepared. The first conductive layer (22) is joined to the third conductive layer (29) through a first thermosetting adhesive layer (35), and the second conductive layer (23) is joined to the fourth conductive layer (32) through a second thermosetting adhesive layer (37). Thus, a four-layer flexible wiring circuit board is produced.

Electrically conductive adhesive sheet, circuit board and electrical connection structure using the same

An electrically conductive adhesive sheet is disclosed which has an electrically conducting property across a thickness thereof and an electrically insulating property along a sheet surface direction. The electrically conductive adhesive sheet comprises an electrically insulating adhesive material and electrically conductive metal powder uniformly dispersed therein. The metal powder has a melting point lower than a certain working temperature, and is flattened by application of pressure between a pair of conductors between which the adhesive sheet is provided. The adhesive material is molten at the certain working temperature and is flown by application of pressure. The adhesive sheet is useful to electrically connect a pair of circuit boards each having a plurality of conductor patterns thereon by bonding corresponding ones through the metal powder as molten, while keeping the neighboring patterns insulated. The circuit board is mechanically integrated simultaneously by the adhesive sheet ...

Method for forming multi-layer bumps on a substrate

A method for forming multi-layer bumps on a substrate includes depositing an adhesive or a flux on the substrate, depositing a first metal powder on the adhesive, and melting or reflowing the adhesive and first metal powder to form first bumps. An adhesive or a flux and a second metal powder are then deposited on the first bumps, and melted to form second bumps on the first bumps to form multi-layer bumps. The multi-layer bumps are formed without the need for any wet chemicals.

Methods of fabricating dendritic powder materials for high conductivity paste applications

Methods for forming pastes of dendrites particles coated with an electrically conductive coating are described. A surface is placed in contact with an electrolytic or electroless plating solution. Dendrites are formed on the surface. The dendrites are exposed to another plating solution to plate a coating on the surface of the dendrites. The coated dendrites are removed from the surface to form a powder of coated dendrites. The powder is added to a polymer material to form a paste which is heated to fuse the dendrite surfaces to form a network of interconnected dendrites and further heated to cure the polymer. When the paste is disposed between adjacent electrically conductive surfaces, the coated dendrites fuse to the electrically conductive surface to form electrical interconnections.

Methods for making circuit substrates and electrical assemblies

Methods for making circuit substrates and electrical assemblies are disclosed. A conductive composition is disposed between confronting conductive regions and can be cured to form a via structure. The conductive composition includes conductive particles and a carrier. The carrier can include a fluxing agent and an epoxy-functional resin having a viscosity of less than about 1000 centipoise at 25° C.

Conductive adhesive material with metallurgically-bonded conductive particles

A conductive adhesive material characterized by metallurgical bonds between electrically-conductive particles dispersed in a polymer matrix of the material. The polymer matrix has a fluxing capability when heated to reduce metal oxides on the surfaces of the particles. At least the outer surfaces of the particles are formed of a fusible material, so that sufficiently heating the conductive adhesive material will reduce metal oxides on the particles, and at least partially melt the fusible metal, enabling the particles to metallurgically bond to each other and to metal surfaces contacted by the adhesive material.

ELECTRICALLY CONDUCTIVE ADHESIVE (ECA) FOR MULTILAYER DEVICE INTERCONNECTS

A multilayer capable electrically conductive adhesive (ECA) mixture for connecting multilevel Z-axis interconnects and a method of forming the ECA for connecting multilevel Z-axis interconnects. The multilayer capable ECA contains a mixture of constituent components that allow the paste to be adapted to specific requirements wherein the method of making a circuitized substrate assembly in which two or more subassemblies having potentially disparate coefficients of thermal expansion (CTE) are aligned and Z-axis interconnection are created during bonding. The metallurgies of the conductors, and those of a multilayer capable conductive paste, are effectively mixed and the flowable interim dielectric used between the mating subassemblies flows to engage and surround the conductor coupling.

Method for forming metallic coat

Method for forming metallic coat where, the surface of workpiece is partly covered with a masking material having a predetermined pattern, and metallic powders are ejected to the surface at the ejection velocity of 80 m/sec or higher or at the ejection pressure of 0.3 Mpa or higher by utilizing an ejection apparatus such as blast work apparatus, in order to easily attain the metallic coat having high adhesion strength without washing process, nor heat process by a relatively simple facility ...

СПОСОБ НАНЕСЕНИЯ СМЕСИ УГЛЕРОД/ОЛОВО НА СЛОИ МЕТАЛЛОВ ИЛИ СПЛАВОВ

FIELD: chemistry. SUBSTANCE: invention relates to a method of applying a coating composition containing carbon in form of carbon nanotubes, graphenes, fullerenes or mixtures thereof and metal particles on a substrate, followed by treatment under pressure and heat treatment of the coating after application on the substrate. The invention also relates to a substrate obtained using the disclosed method and use thereof as an electrochemical structural element. EFFECT: invention provides low mechanical wear, low frictional coefficient and good electrical conductivity of the coating. 30 cl, 2 ex, 4 dwg РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (51) МПК H05K 1/09 H05K 1/11 H01B 1/02 C23C 24/08 C09D 5/24 (13) 2 525 176 C2 (2006.01) (2006.01) (2006.01) (2006.01) (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ (21)(22) Заявка: ИЗОБРЕТЕНИЯ К ПАТЕНТУ 2012126142/05, 01.10.2010 (24) Дата начала отсчета срока действия патента: 01.10.2010 Приоритет(ы): (30) Конвенционный приоритет: (43) Дата публикации заявки: 27.12.2013 Бюл. № 36 (45) Опубликовано: 10.08.2014 Бюл. № 22 2008015167 A1, 07.02.2008. US 2009114425 A1, 07.05.209. RU 2006109415 A, 27.09.2007. EP 1930933 A2, 11.06.2008. US 2009242246 A1, 01.10.2009. RU 2318851 C2, 10.03.2008 (86) Заявка PCT: DE 2010/001165 (01.10.2010) C 2 C 2 (85) Дата начала рассмотрения заявки PCT на национальной фазе: 25.06.2012 (87) Публикация заявки PCT: 2 5 2 5 1 7 6 WO 2011/063778 (03.06.2011) R U 2 5 2 5 1 7 6 (56) Список документов, цитированных в отчете о поиске: JP 2009043981 A, 26.02.2009. WO (73) Патентообладатель(и): КМЕ ДЖЕРМАНИ АГ УНД КО. КГ (DE), ТАЙКО ЭЛЕКТРОНИКС АМП ГМБХ (DE), ВИЛАНД-ВЕРКЕ АКЦИЕНГЕЗЕЛЛЬШАФТ (DE) R U 25.11.2009 DE 102009054427.5 (72) Автор(ы): АДЛЕР Удо (DE), РОДЕ Дирк (DE), БУРЕШ Изабелль (DE), ВАН Цзянь (US), ФРЕКМАНН Доминик (US), ШМИДТ Хельге (DE) Адрес для переписки: 129090, Москва, ул. Б. Спасская, 25, строение 3, ООО "Юридическая фирма Городисский и Партнеры" (54) СПОСОБ НАНЕСЕНИЯ СМЕСИ ...

СПОСОБ НАНЕСЕНИЯ СМЕСИ УГЛЕРОД/ОЛОВО НА СЛОИ МЕТАЛЛОВ ИЛИ СПЛАВОВ

... 1. Способ нанесения состава для покрытия на субстрат, который включает стадии:a) получение состава для покрытия физическим и/или химическим смешиванием углерода в форме углеродных нанотрубок, графенов, фуллеренов или их смеси с металлическими частицами,b) сплошное или избирательное нанесение состава для покрытия на субстрат илиc) сплошное или избирательное введение состава для покрытия в предварительно нанесенное покрытие/на предварительно покрытый субстрат.2. Способ по п.1, отличающийся тем, что в качестве металлических частиц применяют металлические частицы, которые содержат Cu, Sn, Ag, Au, Pd, Ni, Zn и/или их сплавы.3. Способ по п.1 или 2, отличающийся тем, что металлические частицы имеют средний размер частиц в области от 10 до 200 мкм.4. Способ по п.1 или 2, отличающийся тем, что металлические частицы имеют средний размер частиц в области от 8 нм до 500 нм.5. Способ по п.1 или 2, отличающийся тем, что металлические частицы имеют средний размер частиц в области от 50 до 1000 нм.6. Способ ...

Lotmaterial, enthaltend ein Metallstearat sowie Verwendung von Metallstearaten in Lotmaterialien

Die Erfindung betrifft Lotmaterialien, wie z.B. eine Lotpaste (11) und Kontaktflächen für Lötverbindungen, wobei erfindungsgemäß vorgesehen ist, dass als Flussmittel ein Metallstearat zum Einsatz kommt, welches entweder als feste Schicht (14, 15) auf den Lotpartikeln (12) oder Kontaktflächen (nicht dargestellt) aufgebracht ist oder als Dispersion oder Lösung im Bindemittel vorliegt. Vorteilhaft kann der Einsatz klassischer Flussmittel hierdurch vermieden werden, insbesondere können harzfreie Lotmaterialien zur Verfügung gestellt werden. Dies bewirkt eine vereinfachte Lagerung und Verarbeitbarkeit der Lotmaterialien unter Ausbildung vergleichsweise besserer Lötverbindungen. Die Verwendbarkeit von Metallstearaten als Flussmittel lässt sich erreichen, wenn Metalle verwendet werden, deren erstes Oxid bei einer geringeren Sauerstoffaktivität (ao) aus reinem Metall gebildet wird, als das erste Chromoxid aus Chrom, bevorzugt als das erste Titanoxid aus Titan und dieses Metallstearat in genügender ...

CIRCUIT BOARD

Fabricating solder tracks

A method of forming metal alloy tracks on a planar substrate, e.g. a copper clad laminate 1. The substrate surface is coated with solder particles 2 in a fluid carrier 3. The surface is then traversed with a focussed beam 4 of radiant energy of a wavelength such that there is a low absorption of energy in the fluid carrier and a high absorption of energy in the particles which are thereby fused to the copper cladding 5. The substrate is then washed to remove surplus particles and the exposed copper is etched using the fused solder tracks as a mask. ...

ELECTRONIC MULTI-FILM CIRCUIT AND PROCEDURE FOR THE PRODUCTION

ELECTRICALLY CONDUCTIVE ADHESIVE SHEET CIRCUIT BOARD AND ELECTRICAL CONNECTION STRUCTURE

A deposition method and apparatus therefor

Production of electrical circuit boards

METHOD OF MANUFACTURING WIRE SEGMENTS OF HOMOGENEOUS COMPOSITION

The disclosed invention provides for a method of manufacturing solder columns fo r particular use in attaching substrates to a printed circuit board. The method re sults in columns of homogeneous composition and thus overcomes problems associated with t he phenomena of segregation. The method includes the steps of forming particles of the metal composition to be used for the columns from a molten source of the composition. The solid particles are then formed into segments of homogeneous composition by drawing in gots of the composition into wire and severing the wire into segments.

Adhesive tape, semiconductor package, and electronic device

用于导电连接导电部件的粘合带，该粘合带包含树脂、焊料粉末、具有助焊活性的固化剂，其中焊料粉末以及具有助焊活性的固化剂包含在树脂中。

Method for forming bump and device for forming bump

A method for forming a bump (19) on an electrode (32) of a wiring board (31) comprises a step (a) for supplying a fluid (14) containing conductive particles (16) and a bubble generating agent onto a first region (17) including the electrode (32) of the wiring board (31), a step (b) for arranging a substrate (40), which is provided with a wall face (45) for forming a meniscus (55) of the fluid (14) in the vicinity of the electrode (32), opposite to the wiring board (31), and a step (c) for heating the fluid (14) so as to generate bubbles (30) from the bubble generating agent contained in the fluid (14).

Electroconductive fine particles, anisotropic electroconductive material, and connection structure

This invention provides electroconductive fine particles which can reduce a connection resistance value and can realize high connection reliability, and an anisotropic electroconductive material and aconnection structure using the electroconductive fine particles. The electroconductive fine particles comprise a resin fine particle and a metal layer containing nickel or palladium and a low-meltingpoint metal layer containing a low-melting point metal and at least one group 13 element selected from the group consisting of thallium, indium, and gallium stacked in that order on the surface of the resin fine particle. The content of the group 13 element based on the total content of the metals contained in the low-melting point metal layer is 0.01 to 6% by weight.

Adhesive composition, electronic component-mounted substrate using the adhesive composition, and semiconductor device

This invention provides an adhesive composition which, while maintaining storage stability, can form a metallic bond in such a state that the cured product wets components and is spread well between components, and is excellent in adhesion, electroconductivity, TCT resistance, and mounting reliability such as high-temperature standing resistance, and an electronic component-mounted substrate using the adhesive composition and a semiconductor device.The adhesive composition comprises electroconductive particles (A) and a binder component (B). The adhesive composition is characterized in that the electroconductive particles (A) comprise a metal (a1), which has a melting point equal to or above the reflow temperature and is free form lead, and a metal (a2), which has a melting point below the reflow temperature and is free from lead, and the binder component (B) comprises a heat curable resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2).

SOLDER PRECOATING METHOD AND WORK FOR ELECTRONIC DEVICE

MASK AND METHOD FOR ELECTROKINETIC DEPOSITION AND PATTERNING PROCESS ON SUBSTRATES

A mask for application to a substrate to facilitate electrokinetic deposition of charged particles onto the substrate, the mask comprising a conducting layer, a dielectric layer, and mask openings. A method for applying a pattern of charged particles to a substrate comprising applying the foregoing the substrate to yield a masked substrate; immersing the masked substrate in a bath containing the charged particles; and establishing an electrical potential between the conducting layer of the mask and a counter-electrode thereby electrokinetically depositing the particles through the mask openings onto areas of the substrate exposed in the mask openings. Products made by this method. © KIPO & WIPO 2008 ...

PRINTED CIRCUIT BOARD AND A MANUFACTURING METHOD THEREOF, CAPABLE OF REDUCING PRODUCTION COSTS

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to shorten a manufacturing process and to reduce manufacturing costs while realizing effective transmission of electric signals. CONSTITUTION: A method for manufacturing a printed circuit board comprises the following steps of: selectively printing a metal alloy paste on a first metal layer to form a first bump(102); laminating an insulating layer on the first metal layer in order for the first bump to pass through the insulating layer; laminating a second metal layer on the insulating layer; and selectively etching the first metal layer so as to form an interlayer circuit electrically connected to the first bump. © KIPO 2009 ...

ELECTROCONDUCTIVE FINE PARTICLES, ANISOTROPIC ELECTROCONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE

This invention provides electroconductive fine particles which can reduce a connection resistance value and can realize high connection reliability, and an anisotropic electroconductive material and a connection structure using the electroconductive fine particles. The electroconductive fine particles comprise a resin fine particle and a metal layer containing nickel or palladium and a low-melting point metal layer containing a low-melting point metal and at least one group 13 element selected from the group consisting of thallium, indium, and gallium stacked in that order on the surface of the resin fine particle. The content of the group 13 element based on the total content of the metals contained in the low-melting point metal layer is 0.01 to 6% by weight. COPYRIGHT KIPO & WIPO 2010 ...

ADHESIVE COMPOSITION, ELECTRONIC COMPONENT-MOUNTED SUBSTRATE USING THE ADHESIVE COMPOSITION, AND SEMICONDUCTOR DEVICE

This invention provides an adhesive composition which, while maintaining storage stability, can form a metallic bond in such a state that the cured product wets components and is spread well between components, and is excellent in adhesion, electroconductivity, TCT resistance, and mounting reliability such as high-temperature standing resistance, and an electronic component-mounted substrate using the adhesive composition and a semiconductor device.The adhesive composition comprises electroconductive particles (A) and a binder component (B). The adhesive composition is characterized in that the electroconductive particles (A) comprise a metal (a1), which has a melting point equal to or above the reflow temperature and is free form lead, and a metal (a2), which has a melting point below the reflow temperature and is free from lead, and the binder component (B) comprises a heat curable resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2). COPYRIGHT KIPO & WIPO 2010 ...

Method for forming multi-layer bumps on a substrate

A method for forming multi-layer bumps on a substrate includes depositing a first metal powder on the substrate, and selectively melting or reflowing a portion of the first metal powder to form first bumps. A second metal powder is then deposited on the first bumps, and melted to form second bumps on the first bumps. A masking plate is disposed over the substrate to select the portions of the metal powders that are melted and the metal powders are melted via an irradiation beam. The multi-layer bump is formed without the need for any wet chemicals.

Method for producing a circuit board

METHOD AND APPARATUSES FOR PRINTING AND PRINTED PRODUCT

The invention concerns a method for forming a conductive pattern on an insulating substrate and a related apparatus. In the method, particle-type conductive matter is transferred onto a surface of the substrate and the particle-type conductive matter is at least partially sintered at elevated temperature and pressure in order to convert the particle-formed pattern into a continuously conducting pattern affixed to the substrate. According to the invention, the conductive matter is transferred in the form of a predefined pattern, and the sintering is carried out by using a nip comprising two opposing nip members between which the substrate is fed. The method provides an efficient way of making high-resolution conductor structures at low temperatures.

FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD

A flip chip mounting method and a bump forming method which are applicable to next generation LSI flip chip mounting and have high productivity and reliability. A resin (14) containing a solder powder (16) and an air bubble generating agent is supplied to a space between a circuit board (21) having a plurality of connecting terminals (11) and a semiconductor chip (20) having a plurality of electrode terminals (12). Then, the resin (14) is heated and air bubbles (30) are generated from the air bubble generating agent contained in the resin (14). The resin (14) is pushed to the outside of the air bubbles by growth of the generated air bubbles (30), and are self-collected between the connecting terminals (11) and the electrode terminals (12). Furthermore, by heating the resin (14) and melting the solder powder (16) contained in the self-collected resin (14) between the terminals, a connector is formed between the terminals and a flip chip mounting body is completed.

Polymer with transient liquid phase bondable particles

A technique of forming a metallurgical bond between pads on two surfaces is provided. A metal coating placed on each surface includes a first metal base layer and a second metal surface layer. The first and second metals include a low melting point constituent. A first ratio of the two metals forms a liquid phase with a second ratio of the two metals forming a solid phase. The volume of the base layer metal exceeds the volume necessary to form the solid phase between the base metal and the surface metal. Conductive metal particles are provided having a core metal and a coating metal dispersed in an uncured polymer material, at a volume fraction above the percolation threshold. The core metal and the coating metal together include a low melting point constituent. At a first ratio the components form a liquid phase and at a second ratio the two components form a solid phase. The polymer containing particles is placed between the two metal surfaces with the particles interfacing with each ...

METHOD OF PRODUCING ELECTRO-OPTICAL DEVICE AND ELECTRO-OPTICAL DEVICE

A method of producing an electro-optical device for electrically connecting a first terminal portion provided on an electro-optical panel to a second terminal portion of a substrate includes applying an anisotropic conductive adhesive containing conductive particles made of a low-melting-point material onto either the first terminal portion or the second terminal portion, and electrically connecting the first terminal portion to the second terminal portion by eutectic bonding by melting the conductive particles by application of heat in thermocompression bonding of the second terminal portion to the first terminal portion with the anisotropic conductive adhesive therebetween.

Printed circuit board and manufacturing method thereof

A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method may include forming at least one first bump over a first metal layer by selectively printing an alloy paste, stacking an insulation layer over the first metal layer such that the first bump penetrates the insulation layer, and stacking a second metal layer over the insulation layer. Embodiments of the invention can shorten the manufacturing process and lower manufacturing costs, while effectively implementing signal transfers.

Components joining method and components joining structure

To provide a components joining method and a components joining structure which can realize joining of components while securing conduction at a low electrical resistance with high reliability. In a construction in which by using a solder paste containing solder particles 5 in a thermosetting resin 3a, a rigid substrate 1 and a flexible substrate 7 are bonded by the thermosetting resin 3a, and a first terminal 2 and a second terminal 8 are electrically connected by the solder particles 5, a blending ratio of an activator of the thermosetting resin 3a in the solder paste is properly set and oxide film removed portions 2b, 8b, and 5b are partially formed in oxide films 2a, 8a, and 5a of the first terminal 2, the second terminal 8, and the solder particles 5. Thereby, the first terminal 2 and the second terminal 8 are electrically conducted by solder bonding the solder particles 5 to both the first terminal 2 and the second terminal 8 via the oxide film removed portions 2b and 8b, and while ...

Electronic element unit and reinforcing adhesive agent

It is an object of the present invention to provide an electronic element unit and a reinforcing adhesive agent in which a bonding strength can be improved between an electronic element and a circuit board and a repairing work can be carried out without giving a thermal damage to the electronic element or the circuit board. In an electronic element unit ( 1 ) including an electronic element ( 2 ) having a plurality of connecting terminals ( 12 ) on a lower surface thereof, a circuit board ( 3 ) having a plurality of electrodes ( 22 ) corresponding to the connecting terminals ( 12 ) on an upper surface thereof. The connecting terminals ( 12 ) and the electrodes ( 22 ) are connected by solder bumps ( 23 ), and the electronic element ( 2 ) and the circuit board ( 3 ) are partly bond by a resin bond part ( 24 ) made of a thermosetting material of a thermosetting resin, and a metal powder ( 25 ) is included in the resin bond parts ( 24 ) in a dispersed state. The metal powder ( 25 ) has a melting point lower than a temperature at which the resin bond parts ( 24 ) are heated when a work (a repairing work) is carried out for removing the electronic element ( 2 ) from the circuit board ( 3 ).

Wiring board, production method of the same, and via paste

Disclosed is a multilayer wiring board having via-hole conductors, the via-hole conductor including a metal portion and a resin portion. The metal portion includes a first metal region which includes a link of copper particles forming a path electrically connecting a first wiring and a second wiring; a second metal region mainly composed of a metal selected from the group consisting of tin, a tin-copper alloy, and a tin-copper intermetallic compound; a third metal region mainly composed of bismuth; and a fourth metal region composed of tin-bismuth solder particles. The link has plane-to-plane contact portions where the copper particles are in plane-to-plane contact with one another. At least a part of the second metal region is in contact with the first metal region. The tin-bismuth solder particles, each surrounded by the resin portion, are interspersed in the via-hole conductor.

Bumped land grid array

A semiconductor package and methods for producing the same are described. One example of the semiconductor package is described to include a substrate having a first face and an opposing second face. The package is further described to include a plurality of solderable surfaces formed on the first face of the substrate, a first solderable surface in the plurality of solderable surfaces having a pattern plating structure on an outward facing surface of the first solderable surface. There may also be an amount of solder bonded to the outward facing surface of the first solderable surface, where the pattern plating structure on the outward facing surface of the first solderable surface causes the amount of solder to have a first thickness at its ends, a second thickness at its center, and a discrete transition between the first thickness and the second thickness.

Bonding member and bonding method

A bonding member that includes a resin body defining an airtight interior, and a bonding material enclosed in the interior of the resin body. The bonding material is a mixed powder that includes a plurality of particles of a first metal powder and a plurality of particles of a second metal powder. The second metal powder reacts with the first metal powder when melted to thereby produce an intermetallic compound. The resin body has a melting point higher than a softening point of the mixed powder.

Electrode joining method, production method of electrode joined structure, and production system of electrode joined structure

Disclosed is a system for mounting a flexible first substrate having a first connection region provided with a first electrode group, on a second substrate having a second connection region provided with a second electrode group. The system includes: a stage configured to support the second substrate; a unit for supplying a bonding material including conductive particles and a thermosetting resin, to at least one of the first and second electrode groups; a unit for placing the first substrate on the second substrate via the bonding material and a unit for successively performing a joining process by pressing a first electrode toward a second electrode and curing the thermosetting resin, using a heating tool, while moving the tool to a processing position of another first electrode not yet subjected to the joining process.

BALL MOUNTING METHOD AND WORKING MACHINE FOR BOARD

A working machine for a board including a working device that selectively performs work for mounting conductive balls on a circuit board by a ball holder and work for transferring viscous fluid onto the circuit board by transfer pins, and a tray in which the viscous fluid is stored, when the conductive balls are to be mounted on the circuit board, the viscous fluid being transferred onto the circuit board by the transfer pins and the conductive balls having been immersed in the viscous fluid are mounted on the transferred viscous fluid. Accordingly, the conductive balls can be fixed onto the circuit board by the viscous fluid, which is transferred onto the circuit board by the transfer pins, and the viscous fluid that adheres to the conductive balls due to the immersion of the conductive balls in the viscous fluid. 1. A ball mounting method of mounting conductive balls on a circuit board with a working machine including a working device that selectively performs work for mounting the conductive balls on the circuit board by a ball holder and performs work for transferring viscous fluid onto the circuit board by a viscous fluid transfer tool including transfer pins , and a viscous fluid tray in which the viscous fluid is stored , the ball mounting method comprising:a transfer pin immersion step of immersing the transfer pins in the viscous fluid stored in the viscous fluid tray;a viscous fluid transfer step of transferring the viscous fluid onto the circuit board by the transfer pins that have been immersed in the viscous fluid;a ball immersion step of immersing the conductive balls, which are held by the ball holder, in the viscous fluid stored in the viscous fluid tray; anda ball mounting step of mounting the conductive balls, which have been immersed in the viscous fluid, on the circuit board onto which the viscous fluid has been transferred in the viscous fluid transfer step.2. The ball mounting method according to claim 1 , whereinthe working machine includes ...

Solder paste and electronic part

A solder paste includes: solder particles containing Sn and Bi; an epoxy resin having two or more epoxy groups; an epoxy compound having one epoxy group; and a curing agent. And an electronic part includes: a wiring board provided with an electrode pad; a part mounted on the wiring board and provided with a plurality of electrodes; and a cured product of a solder paste configured to connect the plurality of electrodes and the electrode pad, wherein the solder paste includes: solder particles containing Sn and Bi; an epoxy resin having two or more epoxy groups; an epoxy compound having one epoxy group; and a curing agent.

Conductor connecting structure and mounting board

A conductor connecting structure includes a mounting board, a target board, and an anisotropic conductive material. The mounting board includes a base material that includes first and second surfaces. The mounting board also includes a conductor layer formed on the first or second surface and a first dummy conductor layer formed at a corner of the second surface. The target board includes a mounting surface, a conductor layer, and a second dummy conductor layer. The anisotropic conductive material includes a polymeric material and electrically conductive particles dispersed in the polymeric material. The electrically conductive particles, when heated, aggregate so as to connect an end portion of the conductor layer of the mounting board and the conductor layer of the target board to each other and connect the first and second dummy conductor layers to each other.

FLUX, SOLDER PASTE, AND METHOD FOR FORMING SOLDER BUMP

A flux includes a rosin resin, an activator, a thixotropic agent, and a solvent. The solvent includes 30% by mass or more and 60% by mass or less monovalent alcohol with respect to a total mass amount of the flux. The monovalent alcohol has 18 or more and 24 or less of carbon atoms in one molecule. 1. A flux comprising:a rosin resin;an activator;a thixotropic agent; anda solvent including 30% by mass or more and 60% by mass or less monovalent alcohol with respect to a total mass amount of the flux, the monovalent alcohol having 18 or more and 24 or less of carbon atoms in one molecule.2. The flux according to claim 1 , wherein the carbon atoms contained in the one molecule of the monovalent alcohol is 18 or more and 20 or less.3. The flux according to claim 1 , wherein the monovalent alcohol is a branched alcohol or an unsaturated alcohol.4. The flux according to claim 2 , wherein the monovalent alcohol is a branched alcohol or an unsaturated alcohol.5. The flux according to claim 1 , wherein the monovalent alcohol is at least one selected from the group consisting of oleyl alcohol claim 1 , isostearyl alcohol claim 1 , isoeicosanol claim 1 , 2-octyldodecanol claim 1 , and 2-decyltetradecanol.6. The flux according to claim 2 , wherein the monovalent alcohol is at least one selected from the group consisting of oleyl alcohol claim 2 , isostearyl alcohol claim 2 , isoeicosanol claim 2 , 2-octyldodecanol claim 2 , and 2-decyltetradecanol.7. The flux according to claim 3 , wherein the monovalent alcohol is at least one selected from the group consisting of oleyl alcohol claim 3 , isostearyl alcohol claim 3 , isoeicosanol claim 3 , 2-octyldodecanol claim 3 , and 2-decyltetradecanol.8. The flux according to claim 4 , wherein the monovalent alcohol is at least one selected from the group consisting of oleyl alcohol claim 4 , isostearyl alcohol claim 4 , isoeicosanol claim 4 , 2-octyldodecanol claim 4 , and 2-decyltetradecanol.9. The flux according to claim 1 , wherein a ...

Lamination of polymer thick film conductor compositions

This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to lamination. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to lamination. The invention further provides devices containing electrical conductors made by these methods.

SELF-HEATING SOLDER FLUX MATERIAL

A self-heating solder flux material includes a solder flux material and a multi-compartment microcapsule. The solder flux material includes a solvent carrier, and the multi-compartment microcapsule includes a first compartment, a second compartment, and an isolating structure. The first compartment contains a first reactant, and the second compartment contains a second reactant. The isolating structure separates the first compartment from the second compartment. The isolating structure is adapted to rupture in response to a stimulus. Rupture of the isolating structure results in an exothermic reaction between the first reactant and the second reactant. The exothermic reaction generates heat to volatilize the solvent carrier 1. A self-heating solder flux material comprising:a solder flux material that includes a solvent carrier; and a first compartment that contains a first reactant;', 'a second compartment that contains a second reactant; and', 'an isolating structure separating the first compartment from the second compartment, wherein the isolating structure is adapted to rupture in response to a stimulus, and wherein rupture of the isolating structure results in an exothermic reaction between the first reactant and the second reactant that generates heat to volatilize the solvent carrier., 'a multi-compartment microcapsule that includes2. The self-heating solder flux material of claim 1 , wherein the stimulus includes a magnetic field.3. The self-heating solder flux material of claim 1 , wherein the stimulus includes ultraviolet (UV) light.4. The self-heating solder flux material of claim 1 , wherein the multi-compartment microcapsule is a shell-in-shell microcapsule comprising an inner shell contained within an outer shell claim 1 , wherein the inner shell encapsulates the first compartment claim 1 , wherein the outer shell encapsulates the second compartment claim 1 , and wherein the inner shell defines the isolating structure.5. The self-heating solder flux ...

Pattern-forming composition and pattern-forming method using the same

The present invention relates to a pattern-forming composition used to form a conductive circuit pattern. The pattern-forming composition comprises Cu powders, a solder for electrically coupling the Cu powders, a polymer resin, a curing agent and a reductant. According to the present invention, a circuit pattern having superior conductivity can be formed at low cost.

SELF-HEATING SOLDER FLUX MATERIAL

A self-heating solder flux material includes a solder flux material and a multi-compartment microcapsule. The solder flux material includes a solvent carrier, and the multi-compartment microcapsule includes a first compartment, a second compartment, and an isolating structure. The first compartment contains a first reactant, and the second compartment contains a second reactant. The isolating structure separates the first compartment from the second compartment. The isolating structure is adapted to rupture in response to a stimulus. 1. A self-heating solder flux material comprising:a solder flux material that includes a solvent carrier; and a first compartment that contains a first reactant;', 'a second compartment that contains a second reactant; and', 'an isolating structure separating the first compartment from the second compartment, wherein the isolating structure is adapted to rupture in response to a stimulus., 'a multi-compartment microcapsule that includes2. The self-heating solder flux material of claim 1 , wherein the stimulus includes a magnetic field.3. The self-heating solder flux material of claim 1 , wherein the stimulus includes ultraviolet (UV) light.4. The self-heating solder flux material of claim 1 , wherein the multi-compartment microcapsule is a shell-in-shell microcapsule comprising an inner shell contained within an outer shell claim 1 , wherein the inner shell encapsulates the first compartment claim 1 , wherein the outer shell encapsulates the second compartment claim 1 , and wherein the inner shell defines the isolating structure.5. The self-heating solder flux material of claim 4 , wherein magnetic nanoparticles are embedded in the inner shell claim 4 , and wherein the stimulus includes a magnetic field to dislodge the magnetic nanoparticles from the inner shell to rupture the inner shell.6. The self-heating solder flux material of claim 5 , wherein the magnetic nanoparticles include magnetite (FeO) particles.7. The self-heating solder ...

Solder transfer sheet

The present solder transfer sheet addresses the issue of providing a solder transfer sheet having both solder powder holding properties and sheet releasing properties and having excellent solder transfer properties. This solder transfer sheet is for soldering in a section to be soldered in a circuit substrate and has: a support base material; an adhesive layer provided on at least one surface of the support base material; and at least one solder layer including solder particles, provided upon the adhesive layer. The adhesive layer contains a side-chain crystalline polymer, exhibits viscosity by having fluidity at at least the melting point of the side-chain crystalline polymer, and decreases viscosity by crystalizing at temperatures less than the melting point of the side-chain crystalline polymer.

METHOD FOR FORMING FUNCTIONAL PART IN MINUTE SPACE

A method for forming a functional part in a minute space includes the steps of: filling a minute space with a dispersion functional material in which a thermally-meltable functional powder is dispersed in a liquid dispersion medium; evaporating the liquid dispersion medium present in the minute space; and heating the functional powder and hardening it under pressure. 1. A method for preparing a structure comprising a substrate with a functional part , comprising the steps of:providing a substrate having a through-hole or non-through-hole, or stacked substrates having a gap; a liquid dispersion medium; and', 'a thermally-meltable functional powder and a binder powder which are dispersed in the liquid dispersion medium;, 'filling the through-hole, the non-through-hole or the gap with a dispersion functional material consisting ofevaporating and removing the liquid dispersion medium present in the through-hole, the non-through-hole or the gap;heating the functional material to be made into a molten metal; andhardening the molten metal under pressure to obtain a functional part made from the molten metal in the substrate or the stacked substrates such that the through-hole, the non-through-hole or the gap is filled with the functional part.2. The method according to claim 1 , wherein the thermally-meltable functional powder is a mixture of a low-melting metallic powder and a high-melting metallic powder.3. The method according to claim 2 , wherein the high-melting metallic powder is formed in nanoparticles or particles having a nanocomposite structure.4. The method according to claim 2 , wherein the low-melting metallic powder is a metallic powder comprising Sn claim 2 , which is formed in nanoparticles or particles having a nanocomposite structure.5. The method according to claim 2 , wherein the high-melting metallic powder is a metallic powder comprising at least one element selected from the group consisting of Ag claim 2 , Cu claim 2 , Au claim 2 , Pt claim 2 , Ti ...

Method for electrically and mechanically connecting at least two conductive layers

A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.

Multilayer flexible wiring circuit board and its manufacturing method

A multilayer flexible wired circuit board that can provide high density wiring and also can provide reduction in thickness and size, and a producing method thereof. A four-layered flexible wired circuit board is produced by preparing a double-sided substrate in which a first conductor layer and a second conductor layer are laminated on both sides of a first insulating layer; preparing a first single-sided substrate in which a third conductor layer is laminated on one surface of a second insulating layer and a second single-sided substrate in which a fourth conductor layer is laminated on one surface of a third insulating layer; bonding the first conductor layer and the third conductor layer to each other through a first thermosetting adhesive layer; and bonding the second conductor layer and the fourth conductor layer to each other through a second thermosetting adhesive layer.

Multilayer flexible wiring circuit board and its manufacturing method

A multilayer flexible wired circuit board that can provide high density wiring and also can provide reduction in thickness and size, and a producing method thereof. A four-layered flexible wired circuit board is produced by preparing a double-sided substrate in which a first conductor layer and a second conductor layer are laminated on both sides of a first insulating layer; preparing a first single-sided substrate in which a third conductor layer is laminated on one surface of a second insulating layer and a second single-sided substrate in which a fourth conductor layer is laminated on one surface of a third insulating layer; bonding the first conductor layer and the third conductor layer to each other through a first thermosetting adhesive layer; and bonding the second conductor layer and the fourth conductor layer to each other through a second thermosetting adhesive layer.

树脂助焊剂焊膏及安装结构体

本发明提供树脂助焊剂焊膏及安装结构体。上述树脂助焊剂焊膏包含焊料粉末和助焊剂，上述助焊剂至少包含环氧树脂、固化剂、固化促进剂和活性剂，上述环氧树脂包含相对于全部环氧树脂为10～90重量％的环氧当量为200～400的联苯芳烷基型环氧树脂、萘型环氧树脂、二环戊二烯型环氧树脂中的一种以上，上述固化剂包含相对于全部固化剂为30～95重量％的羟基当量为150～350的联苯芳烷基酚树脂、以及相对于全部固化剂为5～70重量％的羟基当量为100～200的具有烯丙基的苯酚酚醛树脂。

印刷产品和印刷所用的方法和设备

本发明涉及一种用于在绝缘衬底上形成导电图案的方法和相关的设备。在该方法中，将颗粒型导电物质转移到衬底表面上，并在升高的温度和压力下使颗粒型导电物质至少部分地烧结以将颗粒形成的图案转变成固定到所述衬底上的连续地导电的图案。根据本发明，导电物质以预定图案的形式进行转移，并通过利用压区执行烧结，所述压区包括两个相对的压轧部件，在其之间供给衬底。该方法提供了一种在低温下制造高分辨率的导体结构的有效方式。

도전 재료, 접속 구조체 및 접속 구조체의 제조 방법

도전 재료가 일정 기간 방치된 경우에도, 전극 상에 도전성 입자에 있어서의 땜납을 효율적으로 배치할 수 있고, 또한 가열 시에 도전 재료의 황변을 충분히 억제할 수 있는 도전 재료를 제공한다. 본 발명에 따른 도전 재료는, 도전부의 외표면 부분에 땜납을 갖는 복수의 도전성 입자와, 경화성 화합물과, 3불화붕소 착체를 포함한다.

Conductive bonding material and electronic device

本发明提供一种导电性接合材料，含有：热固性树脂(7)、以该热固性树脂(7)的热固化温度以下的温度熔融的低熔点金属粉末(8)、在所述热固性树脂(7)的热固化温度以下的温度下不熔融且在热固性树脂(7)的加热固化时与低熔点金属粉末(8)发生反应而生成具有300℃以上的高熔点的反应物的高熔点金属粉末(9)、除去形成于高熔点金属粉末(9)的表面的氧化物的还原性物质，低熔点金属粉末(8)及高熔点金属粉末(9)的总含量为75～88重量％，低熔点金属粉末(8)的平均粒径D1和高熔点金属粉末(9)的平均粒径D2的粒径比D1/D2为0.5～6.0。由此，即使在反复进行回流加热处理而承受与剧烈的温度变化相伴的热冲击的情况下，也可以实现具有良好的导通性及高的连接强度的导电性接合材料及使用该导电性接合材料的电子装置。

Deposition and patterning process

동전기학적 수단이나 정전 수단에 의해 중간 공구를 사용하거나 또는 직접적으로 입자를 기판에 패턴으로 인가하는 방법이 제공된다. 동전기학적 수단이나 정전 수단에 의해 중간 공구를 사용하거나 또는 직접적으로, 솔더 금속 등과 같은 금속 입자를 전자장치에 패턴으로 인가하는 방법이 제공된다. A method of applying particles in a pattern to a substrate using an intermediate tool or directly by electrokinetic or electrostatic means is provided. A method is provided for applying metal particles, such as solder metal or the like, to an electronic device in a pattern using electromechanical means or electrostatic means or directly. 기판, 입자 패턴, 마스크, 전위, 언더 범프 금속배선, 폴리머, 유전액 Substrate, Particle Pattern, Mask, Dislocation, Under Bump Metallization, Polymer, Dielectric Fluid

Resin composition for forming solder bump, method for forming solder bump, and member with solder bump

리플로우나 베이킹 등에 의해 기판이 고온에 노출된 경우에도, 레지스트(드라이 필름 등)의 제거성을 저해하지 않고, 게다가 땜납 접합성이 우수한 땜납 범프 형성용 수지 조성물을 제공한다. (A) 산가(mgKOH/g) 110 이상의 알칼리 용해성 열가소성 수지(단, 불포화 지방산 중합체는 산가 80 이상), (B) 용제 및 (C) 땜납 분말을 포함하고, 또한 활성제를 포함하지 않는 것을 특징으로 하는 땜납 범프 형성용 수지 조성물. Provided is a resin composition for forming solder bumps which does not inhibit the removability of a resist (dry film or the like) and is excellent in solder bonding property even when the substrate is exposed to high temperature by reflow or baking. (A) an alkali soluble thermoplastic resin having an acid value (mgKOH / g) of 110 or more (provided that the unsaturated fatty acid polymer has an acid value of 80 or more), (B) a solvent and (C) solder powder, Wherein the solder bump forming step comprises:

Metal Particles-Dispersed Composition and Flip Chip Mounting Process and Bump-Forming Process Using the Same

There is provided a composition that is suitably used for a flip chip mounting process or a bump-forming process. The composition comprises a first component 3 a , a second component 3 b , metal particles 1,1′ and a convection additive. The metal particles 1,1′ are dispersed in the second component 3 b . The convection additive is contained in the second component 3 b . The first component 3 a is contained in an interior of at least one particle 1 . When such at least one metal particle 1 melts upon heating, the first component 3 a comes in contact with the second component 3 b to form a thermoset resin 3 c . The convection additive is capable of generating a gas upon heating, so that the gas provides a convection effect in the composition.

Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same

A flip chip mounting process wherein a semiconductor chip and a circuit substrate are electrically interconnected. The process includes the steps of preparing a semiconductor chip on which a first plurality of electrodes are formed and a circuit substrate on which a second plurality of electrodes are formed; supplying a composition onto a surface of the circuit substrate, such surface being provided with second plurality of electrodes; bringing the semiconductor chip into contact with a surface of said composition such that the first plurality of electrodes are opposed to the second plurality of electrodes; and heating the circuit substrate, and thereby electrical connections including a metal component constituting the metal particles dispersed in the composition are formed between the first plurality of electrodes and the second plurality of electrodes. Also, a thermoset resin layer is formed between the semiconductor chip and the circuit substrate.

Method of forming multi-layer bumps on a substrate

Ein Verfahren zum Ausbilden mehrschichtiger Höcker auf einem Substrat umfasst Aufbringen eines ersten Metallpulvers auf dem Substrat und selektives Schmelzen oder Wiederverflüssigen eines Bereichs des ersten Metallpulvers, um erste Höcker auszubilden. Ein zweites Metallpulver wird auf den ersten Höckern aufgebracht und geschmolzen, um zweite Höcker auf den ersten Höckern zu bilden. Eine Maskierungsplatte wird über dem Substrat angebracht, um diejenigen Bereiche der Metallpulver auszuwählen, die geschmolzen werden, und die Metallpulver werden mittels eines Bestrahlungsstrahls geschmolzen. Der mehrschichtige Höcker wird ohne die Notwendigkeit irgendwelcher Nasschemikalien ausgebildet.

Method for manufacturing solder circuit board

Anisotropic conductive film, method for producing the same, and connection structure

Resin flux solder paste and mounting structure

【課題】高融点はんだの接続に適用でき、優れた耐熱性とヒートサイクル信頼性を有するはんだペーストを提供する。【解決手段】はんだ粉末とフラックスとを含むはんだペーストであって、前記フラックスは、エポキシ樹脂と硬化剤と硬化促進剤と活性剤を含み、前記エポキシ樹脂は、エポキシ当量が２００〜４００のビフェニルアラルキル型エポキシ樹脂、ナフタレン型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂のうちの一つ以上を全エポキシに対して１０〜９０重量％含み、前記硬化剤は、水酸基当量が１５０〜３５０のビフェニルアラルキルフェノール樹脂を全硬化剤に対して３０〜９５重量％と水酸基当量が１００〜２００のアリル基を有するフェノールノボラック樹脂を全硬化剤に対して５〜７０重量％含むはんだペースト。【選択図】図１

Electric components connecting method

제1 전기 부품의 접속부(5)에 설치된 제1 단자열(6)과 제2 전기 부품의 접속부(7)에 설치된 제2 단자열(8)을 전기적으로 도통 가능하게 접속하는 방법으로서, 땜납 입자(3)와 도전성 입자(4)를 열경화성 수지(2) 내에 산재시킨 페이스트 상태의 이방성 도전 접착제(1)를 이용하여, 양 단자열(6, 8)이 위치 맞춤된 양 접속부(5, 7)를 땜납 입자(3)에 의해 납땜하여 가 고정하는 공정과, 열경화한 열 경화성 수지(2)에 의해 양 접속부(5, 7)를 본 고정하는 공정의 2단계의 공정을 포함한다. 본 발명은 가 고정을 행하는 장치로부터 본 고정을 행하는 장치로 이송될 시에 양 단자열(6, 8)에 위치 어긋남이 발생하지 않도록 했다. 페이스트, 이방성, 도전, 접착

Vertical and horizontal measuring microscope

(57)【要約】 【課題】 新規な導電ペーストの構造およびその製造方 法を提供する。 【解決手段】 本発明の導電ペーストの構造は、ポリマ 材料と、導電性被膜、例えば錫を有する粒子、例えば銅 との混合物である。熱を加えて、隣接粒子の被膜同士を 融合させる。ポリマ材料は、スチレンアリルアルコール 樹脂または熱可塑性フェノキシポリマである。この構造 は、２つの導電面例えばチップパッドと基板パッドとの 間に設けられて、これらパッドの間に、電気的相互接続 および機械的接着を与える。

Component mounting structure body

本发明的部件安装结构体含有具有多个第1电极的第1对象物、具有多个第2电极的作为电子部件的第2对象物、分别接合多个第1电极和对应的多个第2电极的接合部、和树脂加强部。接合部具有含有第1金属及树脂粒子中的至少一方的第1芯部、以及第1金属与低熔点的第2金属的金属间化合物层。树脂加强部在第1电极与第2电极之间的空间的以外部分中，含有包含芯部和金属间化合物的粒状物。该部分中的粒状物的含量为0.1～10体积％。

Conductive bonding material and electronic device

Wiring board having through hole or non-through hole, and method for producing the same

There is provided a circuit board including a substrate having a hole. Inside the hole, a metal wiring is formed. The wiring is made of a solder alloy having a melting point of 100 to 600° C., and the metal wiring includes a polycrystalline region of the solder alloy. The metal wiring of the present invention is superior in conductivity.

Electrically conductive compositions and methods for the preparation and use thereof

Electrically conductive adhesive compositions and methods for the preparation and use thereof, in which a solder powder, a chemically protected cross-linking agent with fluxing properties and a reactive monomer or polymer are the principal components. Depending upon the intended end use, the compositions comprise three or more of the following: a relatively high melting metal powder; solder powder; the active cross-linking agent which also serves as a fluxing agent; a resin; and a reactive monomer or polymer. The compositions are useful as improved conductive adhesives, such as for attaching electrical components to electrical circuits: the compositions comprising metal powder are ideally suited for creating the conductive paths on printed circuits. The compositions for forming conductive paths may first be applied to a substrate in the desired pattern of an electrical circuit, and then heated to cure it. During heating, the action of the cross-linking agent and optional reactive monomer or polymer within the mixture fluxes the metals, enabling sintering to occur between the metal powder and the solder powder.

Composite substrates for preparation of printed circuits

Substrates for printed circuit boards and the like, in the form of a substrate base layer and at least one adherent layer fixedly attached thereto. The adherent layer preferably comprises a thermoplastic material having a glass transition temperature in the range of about 180° and about 245° C., or a thermosetting material capable of B-stage curing. The preparation of the novel substrates and printed circuits using the substrates and conductive traces formed with electrically-conductive ink compositions is also described.

Multilayer printed circuit

Methods for fabricating single and multilayer printed boards which employ electronically conductive adhesive compositions are provided. The composition comprises a solder powder, a chemically protected cross-linking agent with fluxing properties and a reactive monomer or polymer as the principal components. The compositions may also comprise three or more of the following: a relatively high melting metal powder; solder powder; the active cross-linking agent which also serves as a fluxing agent; a resin; a reactive monomer or polymer; and a metal additive. Compositions comprising metal powder are ideally suited for creating the conductive paths and vias on printed circuits.

Vertically interconnected electronic assemblies and compositions useful therefor

In accordance with the present invention, there are provided novel vertically interconnected assemblies and compositions useful therefore. Invention assemblies comprise substrate boards with multiple layer electronic assemblies. The multiple layers comprise individual layers of circuitry separated and adhered by dielectric materials selectively coated and/or filled with a transient liquid phase sintered (TLPS) material. The TLPS is formulated to be electrically conductive, and thereby serves to convey current between the layers of circuitry. In addition, the TLPS is easily workable so that it is amenable to automated, stepwise construction of multilayer circuitry without the need for labor intensive drilling and filling of conductive vias.

Multi-layer circuit substrates and electrical assemblies having conductive composition connectors

Printed circuit substrates and electrical assemblies including a conductive composition are disclosed. The printed circuit substrate and the electrical assembly embodiments comprise a first conducting region and a second conducting region. A dielectric layer is disposed between the first and second conducting regions. An aperture is disposed in the dielectric layer and a via structure including the conductive composition is disposed in the aperture. The conductive composition is preferably in a cured state and electrically communicates with the first and second conducting regions. In preferred embodiments, the conductive composition comprises conductive particles in an amount of at least about 75 wt. % based on the weight of the composition. At least 50% by weight of the conductive particles have melting points of less than about 400° C. The composition further includes a carrier including an epoxy-functional resin in an amount of at least about 50 wt. % based on the weight of the carrier, and a fluxing agent in an amount of at least about 0.1 wt % based on the weight of the carrier. The epoxy functional resin can have a viscosity of less than about 1000 centipoise at 25° C.

Electrically conductive compositions and methods for the preparation and use thereof

Electrically conductive adhesive compositions and methods for the preparation and use thereof, in which a solder powder, a chemically protected cross-linking agent with fluxing properties and a reactive monomer or polymer are the principal components. Depending upon the intended end use, the compositions comprise three or more of the following: a relatively high melting metal powder; solder powder; the active cross-linking agent which also serves as a fluxing agent; a resin; and a reactive monomer or polymer. The compositions are useful as improved conductive adhesives, such as for attaching electrical components to electrical circuits; the compositions comprising metal powder are ideally suited for creating the conductive paths on printed circuits. The compositions for forming conductive paths may first be applied to a substrate in the desired pattern of an electrical circuit, and then heated to cure it. During heating, the action of the cross-linking agent and optional reactive monomer or polymer within the mixture fluxes the metals, enabling sintering to occur between the metal powder and the solder powder.

Conductive powder applying device immersing substrate into conductive powder by rotating tank including conductive powder and substrate at opposing positions

Conductive composition, method for producing and using the same

Patterned array of uniform metal microbeads

The present invention provides a method for providing an array of metal microbeads on a substrate, preferably in a regular pattern of very fine, uniform size microspheres or microbeads at precise spacing or scale previously unachievable. The method of the present invention comprises the steps of providing a metal layer on a substrate that is partitioned into metal regions; heating the metal layer to a temperature sufficient to melt the metal and to permit beading of the layer into discrete microbeads.

Layered board and manufacturing method of the same, electronic apparatus having the layered board

본 발명은 제조를 쉽게 하여 층간 접속의 전기적·기계적 특성을 안정적으로 하는 적층 기판, 그 제조 방법 및 이러한 적층 기판을 갖는 전자기기를 제공하는 것을 목적으로 한다. An object of the present invention is to provide a laminated substrate, a method of manufacturing the same, and an electronic device having such a laminated substrate, which facilitates the manufacture and stabilizes the electrical and mechanical properties of the interlayer connection. 프린트 기판으로서 기능하는 코어층과, 절연부와 배선부를 가지고, 상기 코어층에 전기적으로 접속되는 빌드업층과, 상기 코어층과 상기 빌드업층을 전기적으로 접속 및 접착하는 접합층을 갖는 적층 기판으로서, 상기 접합층은 제1의 융점을 갖는 필러로서의 금속 입자의 표면에 상기 제1의 융점보다도 낮은 제2의 융점을 갖는 땜납 도금을 한 것을 접착제에 함유시킨 것을 포함하는 것을 특징으로 하는 적층 기판을 제공한다. As a laminated substrate which has a core layer which functions as a printed board, an insulation part, and a wiring part, the buildup layer electrically connected to the said core layer, and the bonding layer which electrically connects and bonds the said core layer and the buildup layer, The bonding layer comprises a laminate comprising an adhesive containing a solder plating having a second melting point lower than the first melting point on the surface of the metal particles as a filler having a first melting point. do.

Process for production of circuit board

Disclosed is a process for producing a circuit board, which enables the bonding of a component to be mounted on the circuit board without the need of tilting the component and which can be achieved through simplified steps. The process for producing a circuit board comprises the steps of: applying a first adhesiveness-imparting compound on the surface of a terminal provided on a circuit board, thereby forming a first adhesive layer; attaching core bodies on the first adhesive layer formed on the terminal; applying a second adhesiveness-imparting compound on the surfaces of the core bodies, thereby forming a second adhesive layer; attaching first solder particles on the second adhesive layer formed on the surfaces of the core bodies; and melting the first solder particles, thereby forming a solder layer on the surfaces of the core bodies.

DEVICE COMPRISING A SUBSTRATE CAPABLE OF BEING THERMOFORMED WITH AN ELECTRICALLY CONDUCTIVE BODY

Le dispositif (1) destiné à être thermoformé comporte un substrat (3) apte à être thermoformé et un organe électriquement conducteur (2) solidaire dudit substrat (3). L'organe électriquement conducteur (2) comporte des particules électriquement conductrices (4), un matériau électriquement conducteur (5), des éléments de forme allongée (6) électriquement conducteurs. Le matériau électriquement conducteur (5) présente une température de fusion strictement inférieure à la température de fusion des particules électriquement conductrices (4) et à la température de fusion des éléments de forme allongée (6). The device (1) intended to be thermoformed comprises a substrate (3) adapted to be thermoformed and an electrically conductive member (2) integral with said substrate (3). The electrically conductive member (2) comprises electrically conductive particles (4), an electrically conductive material (5) and electrically conductive elongated elements (6). The electrically conductive material (5) has a melting temperature strictly below the melting temperature of the electrically conductive particles (4) and the melting temperature of the elongated elements (6).

Electrically conductive paste, and electrical and electronic device comprising the same

Ceramic circuit board and production method therefor

Method of forming a via in a carrier layer made of ceramic and a carrier layer with such via

본 발명은 세라믹으로 제조된 캐리어 층(1)에 바이어를 형성하는 방법에 관한 것으로서, 상기 방법은, 캐리어 층(1)을 제공하는 단계, 캐리어 층(1)에 통로 리세스(2)를 형성하는 단계, 페이스트(3)로 통로 리세스(2)를 적어도 부분적으로 충진하는 단계, 및 캐리어 층(1)에 금속화(5)를 접합하기 위하여, 접합 공정, 특히 활성 땜납 공정 또는 DCB 공정을 수행하는 단계를 포함하며, 접합 공정이 수행될 때, 바이어가 페이스트로부터 통로 리세스에 형성된다.

Interconnect structure with conductive adhesive

Method for manufacturing multilayer wiring circuit board

Electrically and thermally conductive adhesive transfer tape

The adhesive layer of the novel transfer tape contains electrically and thermally conductive particles such as silver which are preferably spherical and are larger than the thickness of the adhesive between particles. When used to bond two rigid substrates together, pressure is applied to the substrates to flatten the particles to the thickness of the adhesive between particles, thus making good electrical and thermal connection between the substrates through each particle.

Conductive paste and electrical and electronic equipment using the same

導電性ペーストを用いて回路基板に電子部品を実装する際に、導電性ペーストを硬化させた後に得られる接合部の導通経路に生じるボイドの程度を低減させること、ならびに添加すべき粘度調整／チクソ性付与添加剤の量を低減させることが可能な導電性ペーストを提供する。導電性ペーストに用いる導電性フィラー成分として、Ｓｎを含む低融点の合金組成から、融点および平均粒子径の異なる２種類の合金粒子を選択し、所定の割合にて混合して使用する。 When electronic components are mounted on a circuit board using a conductive paste, the degree of voids generated in the conduction path of the joint obtained after the conductive paste is cured is reduced, and viscosity adjustment / thixo to be added Provided is a conductive paste capable of reducing the amount of the property-imparting additive. As the conductive filler component used in the conductive paste, two types of alloy particles having different melting points and average particle diameters are selected from a low melting point alloy composition containing Sn, and are mixed and used at a predetermined ratio.

Anisotropic electrically-conductive film, method for manufacturing same, and connection structure

一種異向性導電膜，其將於表面具有氧化被膜的焊料粒子等金屬粒子作為異向性導電連接用之導電粒子，該異向性導電膜於絕緣膜內具備金屬粒子，金屬粒子於俯視下規則排列。於金屬粒子之異向性導電膜表面側端部或異向性導電膜背面側端部之至少任一端部，以接觸或是接近之方式配置有助焊劑(flux)。較佳之金屬粒子為焊料粒子。較佳為絕緣膜成為2層結構，於其層間配置有金屬粒子。

Conductive paste and method of manufacturing printed circuit board using the same

本发明提供了一种导电胶，其包括：导电粉粒，包括聚合物粉末和顺次设置在聚合物粉末的表面上并具有不同熔点的第一低熔点金属和第二低熔点金属；以及混合在导电粉粒中的粘合剂。并且，本发明还提供了一种使用该导电胶来制造印刷电路板的方法。

Conductive fine particles, method for plating fine particles, and substrate structural body

This invention provides a conductive fine particle having an ability of relaxing the force applied to a circuit of a substrate or the like. A conductive fine particle, comprising a core fine particle made of resin with its surface covered with at least one metal layer, wherein the resin has a coefficient of linear expansion of from 3×10 −5 to 7×10 −5 (1/K).

Method for manufacturing wiring board

본 발명은 기판 표면에 패턴 형성되어 있는 플립 칩 접속용 및 배선 본딩용으로 사용되는 패드에 관한 것이다. 플립 칩 접속용으로 사용될 패드는 차폐된다. 배선 본딩용으로 사용될 각각의 패드에는 도금이 실시된다. 배선 본딩용 본딩 패드는 마스크 테이프에 의해 차폐된다. 접착층은 플립 칩 접속용으로 사용될 각 패드의 표면에 도포된다. 땜납 분말은 플립 칩 접속용으로 사용될 각 패드의 표면이 접착층과 접착되도록 구비된다. 마스크용 테이프는 배선 본딩용 본딩 패드로부터 박리된다. 땜납이 플립 칩 접속용으로 사용될 패드를 피복 하도록 땜납 분말은 리플로우잉(reflowing)에 의해 용융된다. The present invention relates to a pad used for flip chip connection and wiring bonding, patterned on a substrate surface. The pad to be used for flip chip connection is shielded. Each pad to be used for wire bonding is plated. The bonding pad for wiring bonding is shielded by a mask tape. An adhesive layer is applied to the surface of each pad to be used for flip chip connection. The solder powder is provided such that the surface of each pad to be used for flip chip connection is bonded with the adhesive layer. The mask tape is peeled off from the bonding pad for wiring bonding. The solder powder is melted by reflowing so that the solder covers the pad to be used for flip chip connection. 접속 패드, 본딩 패드, 배선 기판, 도금, 테이프, 리플로우잉 Junction Pads, Bonding Pads, Wiring Boards, Plating, Tapes, Reflowing

Method for producing a via in a carrier layer made of ceramic and carrier layer containing a via

本发明提出一种用于在由陶瓷制成的载体层(1)中制造过孔(3)的方法，所述方法包括：‑提供载体层(1)；‑在载体层中实现穿通留空部(2)；‑用膏至少部分地填充穿通留空部；以及‑执行接合法，用于将金属化部接合到载体层上，尤其活性焊接法或DCB法，其中在执行接合法时由穿通留空部中的膏来实现过孔。

METHOD OF PRODUCING A PATTERN ORDER OF SAME-SHAPED METAL BALLS

Electrically conductive paste, and electrical and electronic device comprising the same

Disclosed is an electrically conductive paste which enables to reduce the level of void growth in a conducting pathway formed in a joint part produced after curing the electrically conductive paste in the implementation of an electronic component on a circuit board by using the electrically conductive paste, and which contains a reduced amount of a viscosity-adjusting/thixotropy-imparting additive. Two Sn-containing low-melting-point alloy particles having different melting points and different average particle diameters are selected as electrically conductive filler components to be used in an electrically conductive paste, and the two alloy particles are mixed at a predetermined ratio for use.

Conductive fine particles, anisotropic conductive material, and conductive connection structure

Method for forming conductive pattern and wiring board

[Problem] To provide a conductive pattern formation method in which a fine pattern can be formed in a simple way at low cost. [Means for Solving Problem] A flat plate having a convex pattern on its surface is provided so as to oppose a substrate, a fluid body including conductive particles and a gas bubble generating agent is supplied into a gap between the substrate and the flat plate, and thereafter, the fluid body is heated for generating gas bubbles from the gas bubble generating agent included in the fluid body. The fluid body is forced out of the gas bubbles as the gas bubbles generated from the gas bubble generating agent grow, so as to self-assemble between the convex pattern formed on the flat plate and the substrate owing to interfacial force, and an aggregate of the conductive particles included in the fluid body having self-assembled is made into a conductive pattern formed on the substrate.

Hybrid substrate having two types of wiring boards, electronic device having the same, and method for manufacturing hybrid substrate

Heating device, reflow device, heating method, and bump forming method

A solder bump is formed on a substrate by using a heating device where a lid structure blocks hot air from directly blowing against a solder composition. The heating device can reduce high-temperature oxygen molecules that come into contact with the solder composition, oxidation of the solder composition is suppressed. As a result, although the hot air is used for heating, a solder bump can be formed by the liquid-like solder composition. Further, because the lid structure is uniformly heated by the hot air, radiation heat from the lid structure is also uniform, and a container is more uniformly heated. In addition, because the hot air is suppressed from directly blowing against a liquid surface, the liquid-like solder composition is not scattered by the hot air.

Conductive material and filling method for via hole

(57)【要約】 【課題】 導電性材料及びビアホールの充填方法に関 し、微細なビアホールを空洞が発生することなく充填し うる導電率の高い導電性材料、並びに、このような導電 性材料に好適なビアホールの充填方法を提供する。 【解決手段】 融点が２５０℃以下の第１の金属材料 と、融点が５００℃以上の第２の金属材料とを含み、２ ５０℃以下の温度でペースト状である導電性材料を構成 する。

Multilayer printed circuit board manufacturing method, involves applying conductive strips on substrate, and applying powder mixture on surface of substrate by electrostatic loading, where mixture has large portion of copper powder

The method involves applying conductive strips on a substrate (4), and applying a powder mixture on a surface of the substrate by electrostatic loading, where the powder mixture has a large portion of very fine grained copper powder and a small portion of a very fine-grained tin powder. The area of the applied mixture in the surface of the substrate is selectively subjected to heat to melt the tin powder melts under high temperature in a fixing unit. An independent claim is also included for a device for the production of conducting structures on the surface of a substrate.

Method of enabling solder deposition on a substrate and electronic package formed thereby

An electronic package includes a substrate ( 110, 310, 510 ) and a solder resist layer ( 120, 320, 520 ) over the substrate. The solder resist layer has a plurality of solder resist openings ( 121, 321, 521 ) therein. The electronic package further includes a finish layer ( 130, 330, 535 ) in the solder resist openings, an electrically conducting layer ( 140, 440 ) in the solder resist openings over the finish layer, and a solder material ( 150, 810 ) in the solder resist openings over the electrically conducting layer. The electrically conducting layer electrically connects the solder resist openings in order to enable the electrokinetic deposition of the solder material.

Conductive fine particles, method for plating fine particles, and substrate structural body

Conductive fine particles having an ability of relaxing the force exerted on a circuit of, e.g., a substrate and a method for retaining the constant distance between substrates are disclosed. The conductive fine particles are composed of basic fine particles of resin each covered with one or more metallic layers. The coefficient of linear expansion of the resin is 3 X 10-5 to 7 X 10-5 (1/K).

Conductive material, connection structure body, and connection structure body production method

本發明提供一種導電材料，其即便於將導電材料放置一定期間之情形時，亦可於電極上有效率地配置導電性粒子中之焊料，進而，可充分地抑制加熱時導電材料之黃變。 本發明之導電材料包含：於導電部之外表面部分具有焊料之複數個導電性粒子、硬化性化合物及三氟化硼錯合物。

Flip chip mounting method

Method of making a circuitized substrate

A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a metallic component including nano-particles and may include additional elements such as solder or other metal micro-particles, as well as a conducting polymer and organic. The particles of the paste composition sinter and, depending on what additional elements are added, melt as a result of lamination to thereby form effective contiguous circuit paths through the paste. A method of making such a substrate is also provided, as is an electrical assembly utilizing the substrate and including an electronic component such as a semiconductor chip coupled thereto.

Component-carrying structure

A component-carrying structure includes: a first object having a plurality of first electrodes; a second object having a plurality of second electrodes, the second object being an electronic component; connection portions for connecting the plurality of first electrodes to the plurality of corresponding second electrodes, respectively; and resin reinforcement portions. The connection portions include a core that includes at least one of a first metal and a resin particle, and an inter-metal compound layer of the first metal and a second metal having a low melting point. The resin reinforcement portions include granular substances that include the core and the inter-metal compound, at parts other than the gaps between the first electrodes and the second electrodes. The granular substance content of the parts is 0.1 to 10 volume%.

Electroconductive fine particles,anisotropic electroconductive material,and connection structure

본 발명은, 접속 저항값을 저감시킬 수 있고, 높은 접속 신뢰성을 실현할 수가 있는, 도전성 미립자를 제공하는 것을 목적으로 한다. 또, 본 발명은, 그 도전성 미립자를 사용하여 이루어지는 이방성 도전 재료 및 접속 구조체를 제공하는 것을 목적으로 한다. An object of the present invention is to provide conductive fine particles capable of reducing the connection resistance value and achieving high connection reliability. It is another object of the present invention to provide an anisotropic conductive material and a connection structure using the conductive fine particles. 본 발명은, 수지 미립자의 표면에 니켈 또는 팔라듐을 함유하는 금속층과, 저융점 금속과 탈륨, 인듐 및 갈륨으로 이루어지는 군에서 선택되는 적어도 1 종의 제 13 족 원소를 함유하는 저융점 금속층이 순차적으로 적층되어 있는 도전성 미립자로서, 상기 저융점 금속층 중에 함유되는 금속의 합계에서 차지하는 상기 제 13 족 원소의 함유량은 0.01 ∼ 6 중량% 인 도전성 미립자이다. The present invention is characterized in that a metal layer containing nickel or palladium on the surface of resin fine particles and a low melting point metal layer containing a low melting point metal and at least one kind of Group 13 element selected from the group consisting of thallium, indium and gallium are sequentially And the content of the Group 13 element in the total of the metals contained in the low melting point metal layer is 0.01 to 6% by weight. 도전성 미립자, 이방성 도전 재료 Conductive fine particles, anisotropic conductive material

Conductive fine particles and substrate structure

Multilayer electronic circuit and method of manufacture

SDP:101 US Multilayer Electronic Circuit And Method Of Manufacture Abstract Of The Disclosure A multilayer electronic circuit comprising at least three electronic circuit layers electrically interconnected by means of at least one interposed connecting layer which is conductive only in the Z-axis. Desirably at least four circuit layers are provided in two circuit layer pairs. Each pair comprises an insulating layer having opposing surfaces and having a circuit pattern on each of the opposing surfaces of the insulating layer. The patterns in each pair are connected by means of conductors passing through the insulating layer. The thus formed pairs are connected to each other the connecting layer interposed between one such pattern from each of said pairs. The connecting layer comprises an electrically insulating resin containing electrically conductive particles. The quantity of the particles is statistically selected so as to be sufficiently dispersed to prevent electrical conduction along the X and Y axes of the connecting layer and sufficiently concentrated and of a size to insure electrical contact through the Z-axis of the connecting layer between conductive portions of the circuit layers which are in contact with the connecting layer and directly opposite each other through the connecting layer. The invention further includes a method for making the multilayer electronic circuit.

Bump forming method using self-assembling resin and a wall surface

A method for forming bumps 19 on electrodes 32 of a wiring board 31 includes the steps of: (a) supplying a fluid 14 containing conductive particles 16 and a gas bubble generating agent onto a first region 17 including the electrodes 32 on the wiring board 31 ; (b) disposing a substrate 40 having a wall surface 45 formed near the electrodes 32 for forming a meniscus 55 of the fluid 14 , so that the substrate 40 faces the wiring board 31 ; and (c) heating the fluid 14 to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.

Method of enabling solder deposition on a substrate and electronic package formed thereby

An electronic package includes a substrate ( 110, 310, 510 ) and a solder resist layer ( 120, 320, 520 ) over the substrate. The solder resist layer has a plurality of solder resist openings ( 121, 321, 521 ) therein. The electronic package further includes a finish layer ( 130, 330, 535 ) in the solder resist openings, an electrically conducting layer ( 140, 440 ) in the solder resist openings over the finish layer, and a solder material ( 150, 810 ) in the solder resist openings over the electrically conducting layer. The electrically conducting layer electrically connects the solder resist openings in order to enable the electrokinetic deposition of the solder material.

Electrically and thermally conductive adhesive transfer tape

Connection method and connection device for electrical connection of small portions

A first portion (20) is set near or in contact with a second portion (21). The first and second portions (20, 21) are electrically connected by spraying fine metal particles (15) on the first and second portions (20, 21) to form a metal bump (24).

Electrically and thermally conductive adhesive transfer tape

Abstract of the Disclosure The adhesive layer of the novel transfer tape contains electrically and thermally conductive particles such as silver which are preferably spherical and are larger than the thickness of the adhesive between particles. When used to bond two rigid substrates together, pressure is applied to the substrates to flatten the particles to the thickness of the adhesive between particles, thus making good electrical and thermal connection between the substrates through each particle.

Electroconductive microparticles, anisotropic electroconductive material, and electroconductive connection structure

본 발명은, 낙하 등에 의한 충격이 가해져도 전극과 그 도전성 미립자의 접속 계면의 파괴에 의한 단선이 잘 발생하지 않고, 가열과 냉각을 반복해서 받아도 잘 피로되지 않는 도전성 미립자, 그 도전성 미립자를 사용하여 이루어지는 이방성 도전 재료 및 도전 접속 구조체를 제공하는 것을 목적으로 한다. 본 발명은, 수지 또는 금속으로 이루어지는 코어 입자의 표면에 적어도 도전 금속층, 배리어층, 구리층 및 주석을 함유하는 땜납층이 이 순서로 적층된 도전성 미립자로서, 상기 구리층과 땜납층이 직접 접하고 있고, 상기 땜납층 중에 함유되는 주석에 대한 상기 땜납층에 직접 접하는 구리층에 있어서의 구리의 비율이 0.5 ∼ 5 중량％ 인 도전성 미립자이다. Disclosed is a conductive fine particle which does not generate disconnection due to breakage of the connection interface between the electrode and the conductive fine particle and does not cause fatigue even after repeated heating and cooling even if an impact due to dropping or the like is applied, And an object of the present invention is to provide an anisotropic conductive material and a conductive connecting structure. The present invention is a conductive fine particle in which at least a conductive metal layer, a barrier layer, a copper layer, and a solder layer containing tin are stacked in this order on the surface of a core particle made of resin or metal, wherein the copper layer and the solder layer are in direct contact with each other , And the proportion of copper in the copper layer directly contacting the solder layer with respect to tin contained in the solder layer is 0.5 to 5 wt%.

Method for producing multilayer wiring circuit board

A method of producing a multilayer wired circuit board that can provide sufficient adhesion strength of the interface between a conductor layer and a thermosetting adhesive layer laminated, to provide improvement in connection strength between the conductor layers and thus improvement in reliability. In this method, after a thermosetting adhesive layer is formed on a first conductor layer, an opening is formed in the thermosetting adhesive layer and solder powders are charged in the opening at normal temperature. Sequentially, a second conductor layer is formed on the thermosetting adhesive layer including the opening filled with the solder powders. Thereafter, the solder powders are melted by heating, to electrically connect between the first conductor layer and the second conductor layer.

Printable compositions and their application to dielectric surfaces used in the manufacture of printed circuit boards

(57)【要約】 以下の成分：（ａ）金属粉、（ｂ）半田粉、（ｃ）ポリマーまたは重合可能でポリマーを生成するモノマーであって、該ポリマーは化学的架橋剤の作用により架橋し得るもの、及び（ｄ）前記ポリマーのための化学的架橋剤であって、該架橋剤は可塑化特性を有し触媒なしでは前記ポリマーと反応しないもの、を含むプリント回路基板、配線基板等の金属トレースや他の金属配合物の製造に使用する組成物。前記ポリマーは、一般にはエポキシ樹脂でよく、前記架橋剤は一般には多酸でよい。本組成物は、金属粉及び／又は半田粉が熱の作用で解放される前記架橋剤用触媒を発生させるか及び／又は該架橋剤用触媒を付着してなるものが好ましい。

Electrical connection device for forming and semiconductor device having metal bump electrical connection

Electrical connection device for forming electrical connection between a first portion and a second portion of a semiconductor device. The first portion is set near or in contact with the second portion. The first and second portions are electrically connected by spraying fine metal particles of gold, nickel or copper in a carrier gas of helium, argon, hydrogen or nitgrogen on the first and second portions to form a metal bump. Prior to spraying the fine metal particles to form the metal bump, hard particles of titanium, copper, hafnium, zirconium or vanadium may be sprayed on the first and second portions to remove contamination layers.

Method of making a circuit board

A printed circuit board formed by applying a thin layer of powdered metal composed of a mixture of copper-tin-lead to a heat softenable substrate, such as a sheet of thermoplastic resin, followed by the application of a heated die to the powdered surface, the die having the desired circuit pattern formed thereon and acting to sinter the metal particles in the areas contacted by the circuit defining portions of the die and also acting to soften the underlying portions of the substrate to effect a bond between the sintered metal circuit pattern and the substrate, the remainder of the powdered metal layer being unaffected by the sintering operation and readily removable for reclamation and reuse.

Deposition and patterning process

A method for applying particles in a pattern to a substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means. A method for applying metal particles such as solder metal in a pattern to an electronic device substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means.

Electronic component unit and reinforcement adhesive

本发明公开了电子元件单元和加强粘合剂，其中电子元件和电路板之间的连接强度增加，并且可执行修理工作而不导致对电子元件或电路板的损坏。具体公开了电子元件单元(1)，其包括：电子元件(2)，在其下表面上提供有多个连接端子(12)；以及电路板(3)，在其上表面上对应于连接端子(12)提供有多个电极(22)，并且通过采用焊料块(23)连接该连接端子(12)到电极(22)并且通过采用树脂连接件(24)部分连接电子元件(2)到电路板(3)而形成，树脂连接件(24)包括由热硬化树脂形成的热硬化树脂材料，其中树脂连接件(24)内以分散的状态包含金属粉(25)。金属粉(25)的熔点低于执行从电路板(3)去除电子元件(2)的工作(修理工作)时加热树脂连接件(24)的温度。

Process for production of circuit board

본 발명은 상기 사정을 감안하여 이루어진 것으로서, 탑재하는 부품을 기울이는 일없이 접합 가능하며, 또한, 공정의 간략화가 가능한 회로 기판의 제조 방법을 제공한다. 회로 기판 상의 단자부의 표면에, 제1 점착성 부여 화합물을 도포해서 제1 점착층을 형성하는 공정과, 상기 단자부의 상기 제1 점착층 상에 핵체를 부착하는 공정과, 상기 핵체의 표면에, 제2 점착성 부여 화합물을 도포해서 제2 점착층을 형성하는 공정과, 상기 핵체 표면의 상기 제2 점착층 상에 제1 땜납 입자를 부착하는 공정과, 상기 제1 땜납 입자를 용융하여, 상기 핵체의 표면에 땜납층을 형성하는 공정을 구비해서 이루어지는 회로 기판의 제조 방법을 채용한다.

Method for manufacturing hybrid printed circuit board

A method for manufacturing a hybrid printed circuit board having two kinds of wiring boards. The circuit board has method has a first wiring board having a first terminal and, a second wiring board wherein a dent wherein the first wiring board is fitted and equipped with a second terminal is formed, and forming the same plane as the first wiring board. The board also has an insulating adhesive material disposed around the first terminal, and a conductive adhesive joining the first terminal with the second terminal.

Multilayer wiring substrate and manufacturing method of multilayer wiring substrate

A multilayer wiring board includes an insulating resin layer, wirings laid on their respective opposite surfaces of the insulating resin layer, and a via-hole conductor for electrically connecting the wirings. The via-hole conductor includes metal and resin portions. The metal portion includes first metal regions including a joined unit made of copper particles for connecting the wirings, second metal regions mainly composed of, for example, tin, a tin-copper alloy, or a tin-copper intermetallic compound, and third metal regions mainly composed of bismuth and in contact with the second metal regions. The copper particles forming the joined unit are in plane contact with one another to form plane contact portions, and the second metal regions at least partially are in contact with the first metal regions.