Adhesive composition, electronic component-mounted substrate using the adhesive composition, and semiconductor device

Mode of execution

The adhesive composition of the present invention is characterized in that, comprising conductive particles (A) and adhesive ingredient (B) of the adhesive composition, the above-mentioned conductive particle (A) containing melting point in a reflow soldering temperature (reflow   temperature) or more and the metal without lead (a1) and less than the reflow soldering temperature and the melting point of lead-free metal (a2), the above-mentioned adhesive ingredient (B) containing thermosetting resin composition (b1) and aliphatic dihydroxy carboxylic acid (b2).

The following, the adhesive composition of the present invention contained in a description of each ingredient.

Conductive particles (A)

In this invention the use of conductive particles (A), containing in a reflow soldering temperature above the melting point of the metal lead (a1) and less than the reflow soldering temperature and the melting point of lead-free metal (a2) the two.

On the above-mentioned reflow soldering temperature, such as installing the temperature of the solder paste SnAgCu, that is, the 260 [...].

As in the reflow soldering temperature above the melting point of the metal lead (a1), from, for example, can be cited Pt, Au, Ag, cu, Ni, Pd, Al selected such as a kind of metal or containing two or more kinds of metal alloy, more specifically, can be cited of powder Au, Ag powder, powder cu, the Ag plating cu powder, and the like. As market , it is preferred to use a Hitachi chemical industrial corporate the tradenames as " MA05K the commodity [...].

As a melting point of less than a reflow soldering temperature and is not leaded metal (a2), from, for example, can be cited of Sn, Ag, cu, Bi, In, Zn selected such as a kind of metal or containing two or more kinds of metal alloy, more specifically, can cite Sn42-Bi58 solder (melting point 138 the [...]), or Sn96.5-Ag3-Cu0.5 solder (melting point 217 the [...]), and the like.

In the adhesive composition of the above-mentioned conductive particle (A) containing the rate of the, preferably 5-95 weight %, of from to consider the operability or conductivity, more preferably 10-90 weight %, to consider from the mounting reliability, further more preferably 15-85 weight %. The above-mentioned conductive particle (A) containing ratio of less than 5% of the weight of, the decline in conductivity exists, on the other hand, if exceeding 95 weight %, the viscosity of the adhesive composition is increased, there is a possibility of failure to ensure operation, or the presence of the binder component (B) and the decline in mounting reliability.

The reflow temperature above the melting point of the metal lead (a1) is less than the reflow soldering temperature and the melting point of lead-free metal (a2) matching ratio (a1) : (a2) preferably 90-1 weight % : 10-99 weight %, to consider from the conductivity, more preferably 70-5 weight % : 30-95 weight %, to consider from the mounting reliability, further more preferably 60-10 weight % : 40-90 weight %. If the above-mentioned melting point is less than the reflow soldering temperature and is not leaded metal (a2) ratio of less than 10 weight % or greater than 99% of the weight, a downward trend in mounting reliability.

As in the adhesive composition containing the above-mentioned conductive particle (A) shape, for example, the above-mentioned metal (a1) under the condition of, can cite only by the metal (a1) of the particle, mixed with only by the metal (a1) of the particles and the filler material a mixed particle, surface coated with metal in filling material (a1) of the coated particle. Metal (a2) and also under the condition of (a1) of the same. In such a case, metal (a1) and the metal (a2) combined mode is arbitrary.

Only by the above-mentioned metal (a1) or (a2) of the average particle diameter of the particles has no particular restriction, but is preferably 0.1-100 the  m, printability or operability from the context, to consider more preferably 1.0-50 the  m, from the storage stability or installation reliability aspects to consider further more preferably 5.0-30 the  m. The above-mentioned average particle size of less than 0.1 the when   m, the viscosity of the presence of the adhesive composition cannot be ensured and the possibility of operability, or, in order to ensure the melting of the metal and require a large amount of aliphatic dihydroxy carboxylic acid (b2), storage stability, a downward trend in adhesion. Furthermore, if the above-mentioned average particle size is greater than the 100  m, the printability or a downward trend in connection reliability. Refer to the above-mentioned average particle size of 50% of the volume of the particle size, can use Mastersizer· laser scattering type particle size distribution measuring device (Malvern Company system) and is measured.

As with the above-mentioned metal mixed filling material or is coated with the above-mentioned metal filling material, can cite acrylic rubber, polymer particles of polystyrene; diamond, boron nitride, aluminum nitride, inorganic particles of alumina, and the like; and the like.

Adhesive ingredient (B)

In this invention the use of adhesive ingredient (B) containing thermosetting resin composition (b1) and aliphatic dihydroxy carboxylic acid (b2) the two.

In the present invention, conductive particles (A) and adhesive ingredient (B) matching ratio, counts and according to weight ratio relative to the adhesive composition of the solid ingredient, conductive particles (A): adhesive ingredient (B) is preferably 50 the [...] the 50-95 [...] 5. And then, from the adhesive, conductive, operational considerations, more preferably the conductive particle (A): adhesive ingredient (B) to the 70 [...] the 30-90 [...] 10. In the above-mentioned matching ratio, if adhesive ingredient (B) the ratio is greater than 50 weight %, the conductive particle (A) insufficient amount of the conductivity trend of variation and, in addition, if adhesive ingredient (B) ratio of less than 5 weight %, the viscosity of the adhesive composition cannot be ensured and the trend of operability, or, a downward trend in adhesion.

Furthermore, in the present invention, so-called adhesive ingredient (B) means the thermosetting resin composition (b1) and aliphatic dihydroxy carboxylic acid (b2) mixture.

As the thermosetting resin composition (b1), containing thermosetting organic high molecular compound or its precursor, according to need, can also contain more than one type of the following ingredients, i.e., reactive diluent, a curing agent, curing is used for improving the curing accelerator, having an ethylenically-polymerizable carbon-carbon double bond of compound, a free radical initiator, but flexure medicinal preparation for easing stress, is used to improve the operability of diluent, agent for improving adhesion, agent for improving wettability, defoaming agents and for low viscous reactive diluent. Furthermore, thermosetting resin composition (b1) in this invention may also contain a component other than the components listed.

As the above-mentioned thermosetting organic high molecular compound or its precursor, there is no particular limitation, can be cited, for example, epoxy resin, acrylic resin, maleic acid imide resin, cyanic acid ester resin, thermosetting organic high molecular compound or a precursor thereof, and the like. From heat resistance, excellent adhesion property, and can be prepared through the use of suitable solvent into a liquid, thus the point of view of operability is excellent, preferably wherein the acrylic resin, maleic acid imide resin or an epoxy resin. The above-mentioned thermosetting organic high molecular compound or its precursor can be used alone, or combined use of more than two kinds.

Use thermosetting epoxy resin as the organic high molecular compound, it is preferably used in a reactive diluent, a curing agent, a curing accelerator.

As the above-mentioned epoxy resin, preferably 1 in a molecule and 2 or more epoxy compounds, for example, can be cited by bisphenol A, double toxicarol F, such as reaction with epichlorohydrin bisphenol AD derived from such as epoxy resin and the like. As a specific example of the epoxy resin, can cite AER-X8501 (the rising sun turns into industrial corporate, tradenames), R-301 (yuhwa shell epoxy Corporation systems, tradenames), YL-980 (yuhwa shell epoxy Corporation systems, tradenames) bisphenol A-type epoxy resin, such as; YDF-170 (east into corporate, tradenames) bisphenol F-type epoxy resin, such as; R-1710 (Mitsui oil chemical industrial corporate, tradenames) bisphenol AD-type epoxy resin, such as; N-730S (Dainippon ink chemical industrial corporate, tradenames), Quatrex-2010 (Dow chemical Corporation system, tradenames), phenolic novolak epoxy resin (phenol   novolak   type   epoxy   resins); YDCN-702S (east into corporate, tradenames), EOCN-100 (Japan Company system of medicine, tradenames) of the linear P-cresol novolac epoxy resin (  epoxy   type   resins   Novolak cresol); EPPN-501 (Japan Company system of medicine, tradenames), TACTIX-742 (Dow chemical Corporation system, tradenames), VG-3010 (Mitsui oil chemical industrial corporate, tradenames), 1032S (yuhwa shell epoxy Corporation systems, tradenames) polyfunctional epoxy resin, such as; HP-4032 (Dainippon ink chemical industrial corporate, tradenames) epoxy resin having a naphthalene skeleton; EHPE-3150, CEL -3000 (are big game fine jade chemical industrial corporate, tradenames), DME-100 (new Japan chemical corporate, tradenames), EX-216L (NAGASE formation industrial corporate, tradenames) alicyclic epoxy resin, such as; W-100 (new Japan chemical Company, tradenames) an aliphatic epoxy resin, such as; ELM-100 (Sumitomo chemical industry Company system, tradenames), YH-434L (east into corporate, tradenames), TETRAD-X, TETRAC-C (is the Mitsubishi gas chemical Company, tradenames) amine epoxy resin, such as; DenacolEX-201 (NAGASE formation industrial corporate, tradenames) resorcinol such as epoxy resin (resorcin   type   epoxy   resins);   EX-211 Denacol (NAGASE formation industrial corporate, tradenames) and other new pentamethylene glycol epoxy resin (  type nepentyl   epoxyresins   glycol);   EX-212 Denacol (NAGASE formation industrial corporate, tradenames), hexanoic two mellow glycol epoxy resin (hexane   diol   glycol   type   epoxy   resins); series   EX Denacol (EX-810, 811,850, 851,821,830, 832,841,861 (by NAGASE formation industrial corporate, tradenames) · trimethylene glycol glycol such as epoxy resin; the following general formula (I) of the said epoxy resin E-XL-24, E-XL-3L (co-Mitsui Toatsu chemical corporate, tradenames); and the like.

(The general formula (I) in, said n 1-5 integer. )

Wherein heat from, the point of view of response speed, preferably 3 functional the above-mentioned epoxy resin. And then, the viewpoint of relay from sticking , more preferably containing a tertiary amine epoxy resin.

These epoxy resin can be used alone, or combined use of more than two kinds.

Furthermore, as a reactive diluent, to 1 only in the molecule containing 1 epoxy group of the epoxy compound a, can be without prejudice to the adhesive composition of the present invention the characteristics of use within the range of, preferably, relative to the total amount of epoxy resin 0-30 use of the range of weight %. As such the epoxy compound market , can cite PGE (Japan Company system of medicine, tradenames), PP-101 (east into corporate, tradenames), ED-502, ED -509, ED -509S (rising sun electrification industrial corporate, tradenames), YED-122 (yuhwa shell epoxy Corporation systems, tradenames), KBM-403 (Shin-Etsu chemical industry Company system, tradenames), TSL-8350, TSL -8355, TSL -9905 (Toshiba silicone Company system, tradenames), and the like.

Furthermore, as the curing agent, as long as it is as an epoxy resin curing agent and the curing agent usually used without special restrictions on, for example, can be cited H-1 (Meiwa into corporate, tradenames), VR-9300 (Mitsui Toatsu chemical corporate, tradenames) linear phenolic resin; XL-225 (Mitsui Toatsu chemical corporate, tradenames) the phenol aldehyde is fragrant alkyl resin, such as; AL-VR-9300 (Mitsui Toatsu chemical corporate, tradenames) allylation of the phenolic novolac resin, such as; dicy ; Novacure (dawn into industrial corporate, tradenames) containing such as epoxy resin with an amine compound of the reactant of the microcapsule type curing agent; the represented by the following general formula (II) is of the phenolic resin the MTPC linear P-cresol (Honshu chemical industrial corporate, tradenames); expressed by the following formula (III) for special phenolic resin of PP-700-300 (Japan petroquimica corporate, tradenames); expressed by the following formula (IV) of the ADH biatomate of coal tar, PDH, SDH (the industrial [...] corporate, tradenames); and the like.

[Process 3]

(Wherein in the general formula (II), R said hydrocarbyl, said m 1-5 integer. )

[Process 4]

(Wherein in the general formula (III), R¹ said alkyl, R² represents hydrogen or hydrocarbyl, said p 2-4 integer. )

[Process 5]

(In general formula (IV), R³ expressed asia phenyl, the phenyl, etc. 2 aromatic base of price, the carbon atom number 1-12 straight or branched chain alkylene. )

These curing agent, can be 1 a suitably used alone or combined 2 the above.

In terms of the amount of curing agent, relative to epoxy group of the epoxy resin 1.0 equivalent, preferably the reaction activity of the curing agent based on the total amount of 0.3-1.2 equivalent, more preferably 0.4-1.0 equivalent, especially preferably 0.5-1.0 equivalent. The amount of the above-mentioned curing agent is less than 0.3 equivalent time, solder-reflow cracking resistance a downward trend, if greater than 1.2 equivalent, the increase in the viscosity of the adhesive composition, a downward trend in operability. The above-mentioned curing agent to the reaction activity of the in with the epoxy resin reaction of the active substituent, for example, phenolic hydroxy, etc. can be cited.

With respect to the epoxy resin 100 parts by weight, the consumption of the aluminum ammonium sulfate is preferably 0.01-90 parts by weight, more preferably 0.1-50 parts by weight. The amount of the above-mentioned curing agent is less than 0.01 parts by weight, , curable a downward trend, if exceeding 90 parts by weight, the viscosity of the adhesive composition is increased, a downward trend in operability.

Furthermore, as a curing accelerator, for example, can be cited as the organoboron salt compound EMZ·K, TPPK (by north is popular chemical industrial corporate, tradenames), tertiary amine or its salt of DBU, U-CAT102, 106,830, 840, 5002 (are San-Apro corporate, tradenames), imidazolates the Curesol, 2PZ-CN, 2P4MHZ, C17Z, 2PZ-OK (are four States into corporate, tradenames), and the like.

Curing agent and the curing accelerator added according to the requirements, can be use singly respectively, in addition, can also be a plurality of curing agent and the curing accelerator suitable for making re-use. Preferably the amount of curing accelerator to the epoxy resin 100 parts by weight to 20 parts by weight of the following.

Furthermore, as having an ethylenically-polymerizable carbon-carbon double bond of compound, can cite acrylic acid ester compound or methyl acrylic acid ester compound, and the like, its in 1 molecule has 1 or more acrylic acid or methacrylic acid-based compound. Specific examples are as follows for example. For example, can cite methyl acrylate, ethyl acrylate, propyl acrylate, isopropyl acrylate, n-butyl acrylate, isobutyl acrylate, tert-butyl acrylate, acrylic acid-amyl, isoamyl acrylate, acrylic acid own ester, acrylic acid heptyl esters , octyl acrylate, acrylic acid 2-ethyl hexyl acrylate, acrylic acid ninth stem ester , acrylic acid decyl, Hydrocarbonylation acrylate, lauryl acrylate, acrylic acid tridecane ester, acrylic acid-alkyl ester, eighteen alkyl ester of acrylic acid, acrylic acid heteroploid eighteen alkyl ester, acrylic acid cyclohexyl ester , acrylic isoborneol ester such as ester compound of acrylic acid; methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, tert-butyl methacrylate, methyl acrylic acid-amyl, isoamyl methacrylate, methyl acrylic acid own ester, methyl acrylic acid heptyl esters , octyl methacrylate, methyl acrylic acid 2-ethyl hexyl acrylate, methyl acrylic acid ninth stem ester , decyl methacrylate, methyl acrylic acid Hydrocarbonylation, lauryl ester methacrylate, methyl acrylic acid tridecane ester, methyl acrylic acid-alkyl ester, alkyl ester of eighteen methacrylate, methyl acrylic acid heteroploid eighteen alkyl ester, methyl acrylic acid cyclohexyl ester , isobornyl methacrylate, methyl acrylic acid ester compound;

Diethylene glycol acrylate, polyethylene glycol acrylate, polypropylene acrylate, 2-methoxy ethyl acrylate, 2-ethoxy ethyl acrylate, 2-butoxy ethyl acrylate, methoxy diethylene glycol acrylate, methoxypolyethylene glycol acrylate, bicyclic pentenyl propoxycyclohexyl ethyl acrylate, 2-phenoxy ethyl acrylate, phenoxy diethylene glycol acrylate, phenoxypolyethylene glycol acrylate, 2-acyloxy ethyl acrylate, 2-hydroxy-3-phenoxypropyl acrylate, acrylic acid ester compound; diethylene glycol methyl acrylate, polyethylene glycol methacrylate, polypropylene methyl acrylate, 2-methoxy ethyl methyl acrylate, 2-ethoxy ethyl methyl acrylate, 2-butoxy ethyl methyl acrylate, methoxy diethylene glycol methyl acrylate, methoxy polyethylene glycol methacrylate, bicyclic pentenyl propoxycyclohexyl ethyl methyl acrylate, 2-phenoxy ethyl methyl acrylate, phenoxy diethylene glycol methyl acrylate, phenoxypolyethylene glycol methyl acrylate, 2-benzoyl oxy ethyl methyl acrylate, 2-hydroxy-3-phenoxy-propyl methacrylate, methyl acrylic acid ester compound;

Benzyl acrylate, 2-cyanoethyl acrylate, γ-acrylic acyloxide ethyl trimethoxy silane, glycidyl acrylate, four tetrahydrofurfuryl acrylate, dimethyl amino ethyl acrylate, diethyl amino ethyl acrylate, acrylic acyloxy ethyl phosphoric acid ester, phosphoric acid ester of acrylic acyloxy ethyl benzyl acidic acrylic acid ester compound such as; benzyl methyl acrylate, 2-cyano-ethyl methyl acrylate, γ-methacryloxy ethyl trimethoxy silane, glycidyl methyl acrylate, four tetrahydrofurfuryl methyl acrylate, dimethyl amino ethyl methacrylate, diethyl amino ethyl methyl acrylate, methacryloxy ethyl phosphate ester, methacryloxy ethyl benzyl acidic phosphoric acid ester, methacrylic acid ester compound;

Ethylene diacrylate, 1, 4-butane diol acrylate, 1, 6-hexane diol acrylate, 1, 9- ninth stem two mellow two acrylate, 1, 3-butane diol acrylate, neopentylglycol diacrylate ester compound of acrylic acid and the like; ethylene glycol dimethacrylate, 1, 4-butane diol dimethacrylate, 1, 6-hexane diol dimethacrylate, 1, 9- ninth stem two mellow dimethyl acrylate, 1, 3-butane diol dimethacrylate, neopentyl glycol dimethacrylate, etc. dimethyl acrylic acid ester compound;

Diethylene glycol diacrylate, triethylene glycol diacrylate, four ethylene glycol acrylate, poly ethylene glycol acrylate, three c diacrylate, poly trimethylene glycol two two acrylic ester, acrylic acid ester compound; diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, four ethylene glycol dimethacrylate, polyethylene glycol dimethacrylate, dipropylene glycol dimethacrylate, polypropylene glycol dimethacrylate, dimethyl acrylic acid ester compound;

1 mol bisphenol A, double toxicarol F or bisphenol AD and 2 molar of the reactant of the glycidyl acrylate, 1 mol of bisphenol A, double toxicarol F or bisphenol AD with 2 moles of glycidyl methyl acrylate reactant;

Bisphenol A, double toxicarol F or bisphenol AD poly ethylene oxide adduct of a di-acrylate, bisphenol A, double toxicarol F or bisphenol AD polypropylene propane adduct of a di-acrylate, bisphenol A, double toxicarol F or bisphenol AD a poly-ethylene oxide addition product of dimethyl acrylate, bisphenol F or bisphenol AD polypropylene propane adduct of dimethyl acrylate;

Double (acryloxy propyl) poly dimethyl siloxane, double (acryloxy propyl) methyl siloxane-dimethyl siloxane copolymer, double (methacryloxy propyl) poly dimethyl siloxane, double (methacryloxy propyl) methyl siloxane-dimethyl siloxane copolymer or the like.

Having an ethylenically-polymerizable carbon-carbon double bond of compound can be used independently of the above-mentioned compounds or used in combination of 2 or more kinds.

Furthermore, as a free radical initiator is no special limitation, but porosity (void) perspective preferred peroxides, such as, in addition, from the adhesive composition viscosity stability of curable and preferably the point of view of the decomposition temperature of the peroxide the 70-170 [...]. As a specific example of free radical initiator, can cite 1, 1, 3, 3, -tetramethyl butyl crosses the oxygen radical 2- ethyl caproate , 1, 1-bis (T-butyl crosses the oxygen radical) cyclohexane, 1, 1-bis (T-butyl crosses the oxygen radical) ring-dodecane, di-tert-butyl peroxide between base benzene -phthalic acid ester, tert-butyl too propoxycyclohexyl benzoates, bicumene peroxide, T-butyl cumyl peroxide, 2, 5-dimethyl -2, 5-di (tert-butyl crosses the oxygen radical) hexane, 2, 5-dimethyl -2, 5-di (tert-butyl crosses the oxygen radical) 3-hexyl, such as cumene hydroperoxide. In the adhesive composition, the use level of the free radical initiator is preferably 0.1-10 weight %, more preferably 0.5-5 weight %.

Furthermore, as the flexure medicinal preparation , can cite liquid polybutadiene (ube Kosan corporate "CTBN-1300 × 31 the [...] ," CTBN-1300 × 9 the [...] , Japan soda corporate " the NISSO-PB-C-2000 [...]), and the like. Can relax flexure medicinal preparation by the semiconductor element with the lead frame (  frame Lead) bonding of the effect of the stress that is produced. The use level of but flexure medicinal preparation , relative to the organic high-molecular compound and its precursors the total amount of 100 parts by weight is usually 0-500 parts by weight.

As the aliphatic dihydroxy carboxylic acid (b2), as long as the aliphatic backbone skeleton either directly or through the aliphatic side chain linkage 2 hydroxy groups and 1 the compounds of the above carboxyl group a there is no special restriction. 2 hydroxy groups can be the same or not the same carbon atom, preferably bonded to the same carbon atom. As the aliphatic dihydroxy carboxylic acid (b2), preferably two hydroxyalkanoic acid, for example, can be cited of 2, 2-dihydroxy methyl propionic acid, 2, 2-dihydroxy methyl butane acid , 2, 2-dihydroxy methyl pentane acid , 2, 2-dihydroxy methyl oneself acid, 2, 2-dihydroxy methyl heptane acid , 2, 2-dihydroxy methyl octane acid , tartaric acid, dihydroxy adipic acid, dihydroxy C_3-20 paraffin hydrocarbon mono or di carboxylic acid, preferably dihydroxy C_4-14 alkane mono-carboxylic acid or the like.

As a preferred aliphatic dihydroxy carboxylic acid (b2), is represented by the following general formula (1) shown in the aliphatic dihydroxy carboxylic acid.

[Process 6]

(The general formula (1) in, R₁ is an alkyl group which may have a substituent, m and n for 0-5 integer. )

The above-mentioned R₁ can instantiate the methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, amyl, etc. carbon atom number 1-5 alkyl.

As the above-mentioned general formula (1) of the aliphatic dihydroxy carboxylic acid in the specific example, can cite 2, 2-dihydroxy methyl propionic acid, 2, 2-dihydroxy methyl butane acid , 2, 2-dihydroxy methyl pentane acid and other, wherein preferably 2, 2-dihydroxy methyl propionic acid.

In the present invention, aliphatic dihydroxy carboxylic acid (b2) is smaller than the content of the reflow soldering temperature and relative to the melting point of lead-free metal (a2) 100 parts by weight, preferably 0.1-20 parts by weight, the storage stability, considerations of the conductivity, more preferably 1.0-10 parts by weight. The above-mentioned aliphatic dihydroxy carboxylic acid (b2) content is smaller than 0.1 parts by weight, the conductive particle (A) in the tube, because the metal particles is not sufficiently to each other to form a metal in a downward trend in the conductivity. On the other hand, if the above-mentioned aliphatic dihydroxy carboxylic acid (b2) content is more than 20 parts by weight, no sufficient can be obtained on the basis of the enhancing effect of the curable resin composition, the storage stability of the adhesive composition, a downward trend in printing.

In the present invention in the adhesive composition, can use the silane coupling agent (Shin-Etsu chemical Company system " KBM-573 the such [...]), relay and so on stickstitanium resin acceptor improving agent, an anionic surfactant or a fluorine-based surface active agent such as agent for improving wettability, defoamer additive such as silicone oil, and the like. above sticks relay-improving agent, the wettability improving agent, defoaming agent, etc., can be respectively used alone or combined use of two or more kinds, of the total amount of additive, relative to the adhesive composition as a whole preferably 0.1-10 weight %.

Furthermore, in the present invention in the adhesive composition, in order to make the preparation of adhesive composition the operability when the coating and at the time of using the more excellent in operability, diluent can be added according to the requirements. As a diluent, preferably butyl cellosolve, carbitol , butyl cellosolve acetate, acetic acid carbitol , dipropylene glycol single methyl ether , ethylene glycol ethyl ether, α-terpineol, etc. having a high boiling point organic solvent. Diluent with respect to the adhesive composition as a whole the amount of preferably 0.1-30 weight % range.

In order to manufacture the adhesive composition of the present invention, the electrically conductive particles can be (A) and adhesive ingredient (B) and other components according to the need to add a disposable or batch-time use of the stirrer, sand mill, three-roll mill, planetary mixer (  Mixer Planetary), dissolved · appropriate combination of the device, according to the need for heating, mixing, dissolving, mixing or dispersing xie Li , so as to make homogeneous paste.

Adhesive composition of the present invention, with the solder same degree of conductivity, excellent relay and sticks , therefore can be used as part of the solder in the past the use of widely used to substitute materials. In other words, can be used for passive parts, electronic components such as LSI package with the following bonding of the base plate, the base plate is in the polyimide resin, plastic such as an epoxy resin and a glass nonwoven fabric impregnated in the substrate such as polyimide resin, epoxy resin, BT resin, plastic and make its solidification of the ceramic or alumina as well as the material of the substrate.

Specifically, as shown in Figure 1-2, adhesive composition of this invention can be applied is connected with the solder in the past of the use of the connection of the passive component, or utilize solder or anisotropic conductive film of a semiconductor element or the like is connected with the connection of the electronic components. The adhesive composition of this invention can be compared with the solder is connected with the low-temperature condition, the special preferably suitable for the bad heat resistance, the CCD module, and the like of the part. Furthermore, through a solder connection of the semiconductor element and the base plate, in order to ease the thermal expansion coefficient of the semiconductor element and the base plate of the stress caused by the difference, between the element and the base plate (Underfill) filled at the bottom of the injected material. Opposite to this, the present invention is being connected with the adhesive composition, the resin composition has the role of stress relaxation, therefore will not need to be filled at the bottom of the material, in addition in the process connection, can also be reduction of flux washing process, the bottom filling material injection process, so it is useful.

Furthermore, as shown in Figure 3, of the present invention can be used in combination with the solder the adhesive composition to the connection of the semiconductor element and the base plate. And then, as shown in Figure 4, the adhesive composition of this invention in the chart 1, chart 2 is shown as carrying the passive parts in the intermediate substrate (interposer) mounted on a main board, can also be used when other substrates.

Mounting of this invention the base plate of the electronic component, with the adhesive composition of the present invention, the substrate and the bonding structures of the electronic component.

The following, using chart 1-4 mounting of the present invention a description of the base plate of the electronic component.

Figure 1 is the mode profiles of display of the present invention the substrate mounted with an electronic component of a preferred embodiment. As shown in Figure 1, contains electronic components on the base plate 1 has the following structure, in other words, the base plate 12 of the connecting terminal is formed on the base plate 14 and is connected to the electronic component 16 of the electronic part is connected with the terminal 18 through the conductive member 10 the structure of the electrical connection. The conductive member 10 in order to make the above-mentioned adhesives of the present invention to form a part of the curable composition.

In order to use the adhesive composition of the present invention the electronic component 16 and the base plate 12 is bonded, can be carried out through the following process: firstly, the dispenser coating method, screen printing method, embossing method (stamping) of the base plate 12 of the connection terminals of the substrate 14 is coated on the adhesive composition. Furthermore, with the electronic part is connected with the terminal 18 of the electronic unit 16 is pressed to the base plate 12 is, in order to make the electronic part is connected with the terminal 18 to the substrate connection terminal 14 is electrically connected by an adhesive composition, then utilize the heating furnace or heating means, such as reflow heating curing of the adhesive composition.

Furthermore, mounting of this invention the base plate of the electronic component is not limited to the fig. 1 of the structure shown in, for example, can also have a picture 2-4 the structure shown in. Figure 2 is shown mounted with electronic components of the base plate 2 has the following structure, in other words, on the base plate 12 of the connecting terminal is formed on the base plate 14 and is connected to the electronic component 16 of the lead wire 20, through the adhesive composition of the present invention the electrically conductive part of the body of the 10 the structure of the electrical connection.

Furthermore, Figure 3 shows a mounting substrate of the electronic component 3 has the adhesive composition of the present invention with the solder and the base plate 12 and the electronic component 16 connecting structure. With the mounting base plate of the electronic component 3 in, of the electronic component 16 is formed on an electronic part is connected with the terminal 18, and then in the electronic part is connected with the terminal 18 is formed with a solder ball 22. Moreover, the solder ball 22 and on the base plate 12 is connected with the base plate formed on the terminal 14, through the cured adhesive composition of the present invention the electrically conductive part of the and 10 electrically connected, thereby forming loaded with electronic components on the base plate 3.

Furthermore, Figure 4 shows the mounting of the base plate of the electronic component 4, with the Figure 2 carry the electronic components shown in the 16 base plate 12 re-installed for other base plate 24 of the structure. Here, electronic component 16 and the base plate 12 of the connection, and the base plate 12 and the base plate 24 of the connection, through the cured adhesive composition of the present invention the electrically conductive part of the and 10 to carry out.

Furthermore, the semiconductor device of this invention, the adhesive composition of the present invention the semiconductor element and the semiconductor element mounting support the structure of the component binding. Adhered to the semiconductor element of the semiconductor component after support member for mounting, according to need, carry on the wire bonding process, the sealing process. As a semiconductor element mounting support member, for example, can be cited a 42 alloy lead frame, copper lead frame, the lead frame such as palladium PPF lead frame, a glass epoxy substrate (containing glass fiber-reinforced epoxy resin substrate), BT substrate (by cyanate ester monomer and its oligomers and double-maleic acid imide forming a BT resin substrate) and other organic substrate.

The adhesive composition of the invention adhered to the semiconductor element supporting member for mounting the semiconductor element can be carried out by the following method: first utilizes the dispenser coating method, screen printing method, embossing method (stamping), such as support for mounting the semiconductor component coating the adhesive composition on the part, then pressing the semiconductor component, the use of a heating furnace or after (heat   block) temperature heating means, such as heating curing the above-mentioned adhesive composition. The heating and curing usually through the 100-300 [...] , 5 seconds -10 hours to perform heating under the condition of. And then, after the process of wire bonding, using the normal method to sealing, so as to complete the semiconductor device.

Embodiment

The following, by embodiments of the invention specifically to the description, but the invention is not limited to these embodiments.

Embodiment, reference examples of the material used is the adoption of the following material manufactured by the method of, or buys. To implement example 1 method for manufacturing is shown as one example, however, other embodiment of a resin composition and the reference example, matching the ratio is a table 1-2 the composition and direct shown in, manufacturing method and embodiment 1 are the same.

[Embodiment 1]

The 14.8 parts by weight of a YDF-170 (east into corporate, tradenames, bisphenol F-type epoxy resin, epoxy equivalent = 170), 1.5 parts by weight of a 2PZ-CNS (four countries into industrial corporate, commodity name, imidazole compounds), 3.7 parts by weight of the BHPA (Alfa   Aesar systems, 2, 2-dihydroxy-propionic acid DMPA) mixing, through a three-roll mill the mixture 3 times, thereby preparing the adhesive ingredient.

Next, in the above-mentioned the obtained adhesive ingredient 20 in weight, adding 40 parts by weight of a metal Sn42-Bi58 the solder particles (an average particle size of 20 the  m, melting point 138 the [...]), 40 parts by weight of a metal MA05K (is silver coated copper, commodity name, Hitachi chemical industrial corporate) and mixed, in the atmosphere using vacuum stirring sand mixer mixing 10 minutes, then in 500 Pa for 10 minutes mixing and deaeration processing, so as to obtain the adhesive composition.

[Embodiment 2-7, reference example 1-7]

In addition to setting the table 1-2 the composition other than shown, with the embodiment 1 to operate the same, by the adhesive composition.

Furthermore, table 1-2 shown in the details of the material such as the following. Furthermore, table 1-2 the use level of the various materials in the unit is a part by weight.

BHBA: 2, 2-dihydroxy methyl butane acid

BHVA: 2, 2-dihydroxy methyl pentane acid

Metal Sn96.5-Ag3-Cu0.5 solder: average particle size of the 20  m, melting point 217 the [...]

(Adhesive force, volume resistivity, resistance to TCT sexual high temperature resistance and good press stability evaluation)

The following method of using the above-mentioned embodiment the 1-7, reference example 1-7 the characteristics of the adhesive composition to be measured. SUMMARY of the results are reproduced in table 1-table 2.

(1) nien relay: will be about 0.5 mg of the above-mentioned adhesive composition is applied to the Ag plating cu plate, carrying the 2 mm × 2 mm × 0.15 mm of the Sn plating cu plate. Furthermore, the embodiment used in a 1-7 and the reference example 1, 2, 4-7 test piece of the adhesive composition, applying the 150 [...] , 20 minutes of heating process, the reference example 3 test piece applied of the 260 [...] , 10 minutes of heating process. The use of these test piece, in order to shear speed 500 subsidence m/sec, the gap (clearance) 100 through the condition of machine for testing adhesion   m (bond   tester) (DAGE series of 4000, Arctec (strain) systems) in 25 the measuring [...] the shear strength.

(2) volume resistivity: through the above-mentioned adhesive composition will 2 wide, long 1 mm × 5 mm × thickness 0.15 mm of the Ag plating cu plate to respectively for vertical the form of a synthetic cross-shaped, to the adhesive layer becomes 1 mm × 1 mm × 0.1 mm of the test piece prepared, and then applying the above-mentioned (1) recorded in the heating process. Using the test piece, using four-terminal method (R687E   DIGITALMULTIMETER, Advance   Test systems) measuring the volume resistivity of the in the direction of thickness.

(3) test TCT: the glass epoxy substrate (100 mm × 50 mm × 1.0 mm) plated on the Ag foil disk cu (1.7 mm × 1.4 mm) the use of a metal mask (thickness 100 the  m, the opening size of 1.0 mm × 1.6 mm) printed above-mentioned adhesive composition, carrying sheet resistance (3.2 mm × 1.6 mm, sheet resistance RK73Z2BTTD, Kowa systems). Applied to the component mounting base plate of the above-mentioned (1) the heating process, making sexual TCT-resistant test for evaluation of the base plate. The test substrate into the thermal impact testing machine (-55 the [...] /15 min, 125 °C/15 min, WINTECH   NT1010, Kusumoto formation (strain) systems), is connected with the measuring resistance. Need to prove, table 1-2 TCT resistant sex said ± 10% relative to the initial resistance display the above thereby the cyclic number of the rate of change of resistance.

(4) high temperature storage test: with the above-mentioned (3) similarly the test substrate, into the 125 of [...]high temperature trough (small environmental tester JUNIOR   SA01, machilus nanmu the formation (strain) systems), is connected with the measuring resistance. Need to prove, table 1-2 the high temperature storage test, expressed relative to the initial resistance display ± 10% above the placement time of the rate of change of resistance.

[Table 1]

[Table 2]

By table 1 can be known, the adhesive composition of this invention has excellent TCT sex. And containing metal (a1) embodiment 1, 2 compared with, not metal-containing (a1) reference example 1 the adhesive composition the value of the volume resistivity of the, poor reliability of the TCT test, and the like.

And containing metal (a1) and thermosetting resin composition (b1) embodiment 1, 2 compared with, not metal-containing (a1) and thermosetting resin composition (b1) reference example 2 or 3 of the adhesive composition cannot be thermosetting ingredient strengthening effect, the poor reliability of the TCT test, and the like. And contain aliphatic dihydroxy carboxylic acid (b2) embodiment 1-7 compared, not containing aliphatic dihydroxy carboxylic acid (b2) reference example 4 and 5 because of the adhesive composition does not form an effective metal path, therefore the value of the volume resistivity, poor reliability of the TCT test, and the like. And containing metal (a1) embodiment 6, 7 when compared, does not contain metal (a1) reference example 6 or 7 the adhesive composition the value of the volume resistivity of the, poor reliability of the TCT test, and the like.