СБОРКА МЕТАЛЛИЧЕСКОЙ ДЕТАЛИ И ДЕТАЛИ, ВЫПОЛНЕННОЙ ИЗ КЕРАМИЧЕСКОГО МАТЕРИАЛА НА ОСНОВЕ SiC И/ИЛИ НА ОСНОВЕ С

Изобретение относится к сборке металлической детали и детали, выполненной из керамического материала на основе карбида кремния и/или углерода, и может быть использовано в области авиации: в соплах, камерах сгорания и оборудовании дожигания турбомашин. Сборка металлической детали (1) из сплава на основе никеля или кобальта и детали (7) из керамического материала на основе карбида кремния (SiC) и/или углерода (С) имеет многослойную структуру, включающую следующие элементы, соединенные вместе попарно в следующем порядке путем спаивания: металлическая деталь (1), первая промежуточная деталь (3), вторая промежуточная деталь (5) и деталь из керамического материала. Вторая промежуточная деталь (5) выполнена из нитрида алюминия и/или муллита, имеющего коэффициент расширения меньший, чем коэффициент расширения материала, составляющего металлическую деталь (1). Первая промежуточная деталь (3) выполнена из ковкого металла и способна деформироваться для компенсации разницы расширений между указанной ...

СПОСОБ ИЗГОТОВЛЕНИЯ И СОЕДИНЕНИЯ ПАЙКОЙ ШАРИКОВ ИЗ СУПЕРСПЛАВА И ИЗДЕЛИЯ, ИЗГОТОВЛЕННЫЕ ИЗ ЭТИХ СБОРОК

Изобретение относится к области изготовления множества полых металлических изделий из множества первичных изделий и может быть использовано при производстве звукопоглощающих материалов. Каждое из полых изделий состоит из оболочки из первого металлического материала, окружающей со всех сторон центральное пространство, свободное от металлического материала, и частиц на основе второго металлического материала, отличного от первого, покрывающих внутреннюю и/или наружную поверхность оболочки. Согласно способу на частицы каждого изделия предварительно наносят слой припоя и соединяют между собой частицы пайкой. При этом при нанесении частиц на наружную поверхность оболочки центральное пространство первичных изделий пустое, либо в нем размещают сердцевину из органического материала, которую затем удаляют пиролизом во время пайки. 3 н. и 13 з.п. ф-лы.

ПАЯНЫЙ МЕТАЛЛИЧЕСКИЙ СОТОВЫЙ ЭЛЕМЕНТ С ДИСТАНЦИОННЫМИ РАСПОРКАМИ В МЕСТАХ ПАЙКИ И СПОСОБ ЕГО ИЗГОТОВЛЕНИЯ

Изобретения могут быть использованы при изготовлении элементов, применяемых в качестве каталитических нейтрализаторов отработавших газов транспортных средств. Металлические листы частично имеют структуру, образующую каналы для прохождения текучей среды. На одном из соседних листов выполняют обращенный в сторону соседнего листа выдавленный выступ в качестве дистанционной распорки. Припой наносят в зоне выступа в образованный паяльный зазор. Способ изготовления элементов позволяет снизить потерю силы предварительного напряжения металлических листов в процессе пайки. Изготовленные сотовые элементы отличаются максимально однородным выполнением паяных соединений. 2 с. и 8 з.п. ф-лы, 7 ил.

СВАРКА ИЗДЕЛИЙ ИЗ СУПЕРСПЛАВОВ

Изобретение относится к области сварки, в частности к способу сварки турдносвариваемых изделий из суперсплавов, и может найти применение в различных отраслях машиностроения. Всю зону сварного шва и область, примыкающую к этой зоне, предварительно нагревают до температуры пластичности, которая выше температуры старения и ниже начальной температуры плавления для суперсплава. Поддерживают эту температуру во время сварки и твердения сварного шва. Увеличивают температуру сварного изделия до температуры снятия механических напряжений. Охлаждают сварное изделие до температуры ниже диапазона дисперсного твердения первичной гамма-фазы со скоростью, эффективной для уменьшения выделения первичной гамма-фазы. В результате получают сварное изделие без трещин как в сварном шве, так и в основном сплаве. 11 з.п. ф-лы, 3 ил., 1 табл.

СОСТАВЫ ДЛЯ ПРИПОЯ

Изобретение может быть использовано при получении паяного соединения бессвинцовым припоем, в частности, при изготовлении печатных плат. Припой содержит смесь порошковых компонентов, один из которых представляет собой первый сплав для припоя, а второй порошковый компонент – второй сплав для припоя или металл. Припой содержит дополнительный порошковый компонент, выбранный из группы, включающей карбиды, нитриды, оксиды металлов и углеродные нанотрубки. В качестве первого и второго сплавов для припоя используют несмешиваемые при нагреве сплавы, температура плавления которых различается в пределах 10°С. Припой обладает хорошей термоусталостной долговечностью и низкой высокотемпературной ползучестью, а также высокой пластичностью и тепло- и электропроводностью. 7 н. и 13 з.п. ф-лы, 16 ил.

СОТОВАЯ СТРУКТУРА, ИСТИРАЕМОЕ УПЛОТНЕНИЕ И СПОСОБЕГО ОБРАЗОВАНИЯ

Истираемое уплотнение предназначено для турбин. Оно содержит новую сотовую ячеистую структуру, изготовленную из металлической фольги или листа, обладающую хорошей технологичностью, облегчающую процесс пайки и имеющую высокую стойкость к окислению и высокую конструкционную целостность после припайки к металлической опорной конструкции. Фольга или листы из сплава MCrAlY (где М - Ni, Fe, Co или их комбинации) особенно хорошо подходят для изготовления такой ячеистой структуры. Такое выполнение истираемого уплотнения позволит повысить его высокую долговременную размерную стабильность при высокой температуре. 3 н. и 10 з.п. ф-лы, 4 ил., 3 табл.

ФЛЮС ДЛЯ НАНЕСЕНИЯ В СУХОМ СОСТОЯНИИ

Изобретение может быть использовано при изготовлении пайкой деталей из алюминия или его сплавов, прежде всего радиаторов и теплообменников. Флюс на основе фторалюмината щелочного металла пригоден для нанесения в сухом состоянии, имеет гранулометрический состав с заданным суммарным объемным распределением частиц по их крупности и не содержит мелкой фракции. Заданное распределение частиц обеспечивает простую пневмотранспортировку и нанесение флюса, а также надежную прилипаемость его к поверхности детали. Флюс наносят в сухом и статически наэлектризованном состоянии на соединяемые детали и эти детали соединяют пайкой при нагреве. 2 с. и 2 з.п. ф-лы, 11 ил., 4 табл.

НОВАЯ КОНЦЕПЦИЯ ВЫСОКОТЕМПЕРАТУРНОЙ ПАЙКИ

Изобретение относится к области металлургии, а именно к высокотемпературной пайке. Механическая смесь частиц порошков для высокотемпературной пайки изделия содержит по меньшей мере один источник бора и по меньшей мере один источник кремния. Частицы имеют средний размер менее чем 250 мкм, каждая частица является источником кремния или источником бора. Механическая смесь содержит бор и кремний в массовом соотношении бора к кремнию в диапазоне от 5:100 до 1:1; кремний и бор присутствуют совместно в механической смеси в концентрации по меньшей мере 25 мас.%. По меньшей мере один источник бора и по меньшей мере один источник кремния являются бескислородными за исключением неизбежных количеств загрязняющего кислорода, составляющих менее чем 10 мас.%. Упрощается процесс пайки при сокращении количества тугоплавких присадок. 10 н. и 29 з.п. ф-лы, 6 ил., 19 табл., 13 пр.

СПОСОБ СОЕДИНЕНИЯ МЕТАЛЛИЧЕСКИХ ДЕТАЛЕЙ

Изобретение может быть использовано для соединения металлических деталей, имеющих температуру солидуса выше 1100°C. На поверхность (15) первой металлической детали (11) наносят подавляющий плавление состав (14), содержащий подавляющий плавление компонент, включающий по меньшей мере 25 мас.% бора и кремния для снижения температуры плавления первой металлической детали (11). Приводят вторую металлическую деталь (12) в контакт с подавляющим плавление составом (14) в контактной точке (16). Нагревают металлические детали (11, 12) до температуры выше 1100°C. Обеспечивают плавление поверхностного слоя первой металлической детали с образованием вместе с упомянутым компонентом металлического слоя в контакте со второй металлической деталью. Получают соединение (25) в контактной точке (16). Изобретение обеспечивает получение простым и надежным способом прочного соединения между металлическими деталями. 3 н. и 25 з.п. ф-лы, 19 ил., 14 табл., 5 пр.

СПОСОБ СВАРКИ ЗАГОТОВОК ИЗ ВЫСОКОЖАРОПРОЧНЫХ СУПЕРСПЛАВОВ С ОСОБОЙ МАССОВОЙ СКОРОСТЬЮ ПОДАЧИ СВАРОЧНОГО ПРИСАДОЧНОГО МАТЕРИАЛА

Изобретение относится к способу лазерной сварки заготовок (9) из высокожаропрочных суперсплавов. Создают с помощью лазерного источника (3) тепла зоны (11) подвода тепла на поверхности (10) заготовки. Подают с помощью устройства (5) сварочный присадочный материал (13) в зону (11) подвода тепла и осуществляют с помощью транспортировочного устройства (15) относительное перемещение между источником (3) тепла и устройством (5) подачи с одной стороны а также поверхностью (10) заготовки с другой стороны. Подачу сварочного присадочного материала осуществляют с массовой скоростью ≤350 мг/мин. Устанавливают, по меньшей мере, один из следующих параметров лазерной сварки: мощность лазера от 100 Вт до 300 Вт, диаметр лазерного луча от 500 мкм до 800 мкм, скорость сварки, по меньшей мере, 250 мм/мин. 17 з.п. ф-лы, 6 ил.

СВАРКА АВТОМОБИЛЬНЫХ ДЕТАЛЕЙ ЛАЗЕРНЫМ ПЛАКИРОВАНИЕМ

... 1. Деталь, содержащая:по меньшей мере две стальные заготовки, соединенные между собой сварным швом, содержащим по меньшей мере одно из никеля и железа и характеризующимся по существу полным отсутствием силикатных включений; ипокрытие, полученное путем окрашивания, фосфатирования или электрофоретического формирования покрытия и сцепленное по меньшей мере с частью указанного сварного шва, характеризующегося по существу полным отсутствием силикатных включений.2. Деталь по п. 1, в которой указанный сварной шов содержит никель.3. Деталь по п. 1, в которой указанный сварной шов содержит железо.4. Деталь по п. 1, в которой указанное покрытие представляет собой покрытие, получаемое путем окрашивания.5. Деталь по п. 1, в которой указанное покрытие представляет собой покрытие, получаемое путем фосфатирования.6. Деталь по п. 1, в которой указанное покрытие представляет собой покрытие, получаемое путем электрофоретического формирования покрытия.7. Способ изготовления детали, предусматривающий следующие ...

СПОСОБ ИСПРАВЛЕНИЯ МЕТАЛЛИЧЕСКИХ ДЕТАЛЕЙ

... 1. Способ исправления металлических деталей, соединенных между собой высокотемпературной пайкой, отличающийся тем, что исправляют паяные зоны при помощи лазера для исправления, причем пиковая мощность лазера для исправления заключена между 1500 Вт и 3000 Вт, при этом лазер для исправления используется в импульсном режиме. ! 2. Способ по п.1, в котором исправление паяных зон осуществляют с использованием присадочного металла, нанесенного на паяные зоны. ! 3. Способ по п.2, в котором присадочный металл представлен в виде порошка, пасты, проволоки или предварительно спеченной формы. ! 4. Способ по п.2, в котором присадочный металл совместим с присадочным металлом, использовавшимся во время первоначальной пайки металлических деталей. ! 5. Способ по п.1, в котором лазером для исправления управляют полуручным способом. ! 6. Способ по п.1, в котором металлические детали выполнены из сплава на основе никеля или кобальта. ! 7. Способ по п.1, в котором время нарастания лазерного импульса меньше его ...

ЛАЗЕРНОЕ ПЛАКИРОВАНИЕ НА ПОДЛОЖКАХ С НИЗКОЙ ЖАРОСТОЙКОСТЬЮ

... 1. Способ нанесения тугоплавкого материала на подложку, причем упомянутая подложка имеет температуру плавления ниже температуры плавления тугоплавкого материала, включающий в себя: ! (а) перемещение лазерного луча, генерируемого лазером, по поверхности упомянутой подложки, причем упомянутый лазерный луч состоит из волн длиной от примерно 300 до примерно 10600 нм; ! (b) подачу порошка металла, сплава или композита металлического сплава к поверхности упомянутой подложки; и ! (с) генерирование в лазере достаточной мощности для поверхностного нагрева упомянутой подложки и для осуществления соединения сплавлением порошка металла, сплава или композита металлического сплава и поверхности упомянутой подложки. ! 2. Способ по п.1, в котором упомянутый лазерный луч состоит из волн длиной примерно 1060 нм или менее. ! 3. Способ по п.1, в котором упомянутый лазерный луч состоит из волн длиной от примерно 700 до примерно 1060 нм. ! 4. Способ по п.1, в котором упомянутый лазер создает поверхностный нагрев ...

СПОСОБ ИЗГОТОВЛЕНИЯ И СОЕДИНЕНИЯ ПАЙКОЙ ШАРИКОВ ИЗ СУПЕРСПЛАВА И ИЗДЕЛИЯ, ИЗГОТОВЛЕННЫЕ ИЗ ЭТИХ СБОРОК

... 1. Способ одновременного изготовления множества полых металлических изделий из множества первичных изделий, каждое из которых состоит из оболочки из первого металлического материала, окружающей со всех сторон центральное пространство, свободное от металлического материала, и частиц на основе второго металлического материала, отличного от первого, покрывающих внутреннюю и/или наружную поверхность вышеупомянутой оболочки, отличающийся тем, что на частицы каждого изделия предварительно наносят слой припоя и соединяют между собой частицы пайкой. ! 2. Способ по п.1, отличающийся тем, что в качестве первого металлического материала используют никель и/или кобальт. ! 3. Способ по п.1, отличающийся тем, что в качестве второго металлического материала используют суперсплав на основе никеля и/или кобальта. ! 4. Способ по п.2, отличающийся тем, что в качестве второго металлического материала используют суперсплав на основе никеля и/или кобальта. ! 5. Способ по п.3, отличающийся тем, что пайку осуществляют ...

СПОСОБ ВОССТАНОВЛЕНИЯ МЕТАЛЛИЧЕСКОГО ИЗДЕЛИЯ И СПОСОБ ВОССТАНОВЛЕНИЯ КОМПОНЕНТА ГАЗОТУРБИННОГО ДВИГАТЕЛЯ

... 1. Способ восстановления металлического изделия, включающий: обеспечение металлического изделия, имеющего дефект в виде разрыва; удаление материала из металлического изделия на участке,образованном дефектом в виде разрыва, с формированием выемки;помещение материала, применяемого для восстановления, в сформированную выемку;герметизацию и вакуумирование области соединения, определенной между металлическим изделием и материалом, применяемым для восстановления; иобработку материала, применяемого для восстановления, и металлического изделия с применением горячего изостатического прессования для проведения восстановления.2. Способ по п.1, в котором металлическое изделие включает компонент газотурбинного двигателя и в котором сформированная выемка имеет больший объем, чем объем дефекта в виде разрыва.3. Способ по п.1, в котором герметизацию области соединения проводят посредством герметизации поверхностного участка области соединения.4. Способ по п.3, в котором толщина герметизирующего материала ...

СПОСОБ ПРИМЕНЕНИЯ ТИТАНСОДЕРЖАЩИХ ПОБОЧНЫХ ПРОДУКТОВ

... 1. Способ получения материала покрытия для сварочных электродов или получения сварочного порошка, добавки для сварочного порошка или добавки для сварочного флюса, которые могут быть использованы для электросварки, в частности - для порошковой сварки, сварки с применением порошкового присадочного материала или сварки под флюсом, отличающийся тем, что к материалу покрытия, и/или к сварочному порошку, к добавке для сварочного порошка, и/или к добавке для сварочного флюса добавляют и/или примешивают титансодержащий, в частности содержащий диоксид титана, материал, образующийся в процессе получения диоксида титана, в частности получения пигмента на основе диоксида титана, на одном из этапов или на одной из стадий производства в качестве побочного продукта или отхода, и обрабатывают смесь с получением материала покрытия, и/или сварочного порошка, и/или добавки для сварочного порошка, и/или добавки для сварочного флюса.2. Способ применения титансодержащего побочного продукта или отхода, образующегося ...

ПРОДУКТЫ ИЗ АЛЮМИНИЕВЫХ СПЛАВОВ И СПОСОБЫ ИХ ПОЛУЧЕНИЯ

ПЛАСТИЧНЫЙ БОРСОДЕРЖАЩИЙ СВАРОЧНЫЙ МАТЕРИАЛ НА ОСНОВЕ НИКЕЛЯ

РЕШЕНИЕ ДЛЯ СВАРКИ КОРНЕВОГО ПРОХОДА

... 1. Трубчатая сварочная проволока, содержащая:оболочку и гранулированную сердцевину, расположенную внутри оболочки, содержащую больше чем приблизительно 2,4% по весу активатора стекловидного шлака в виде одного или более компонентов, выбранных из группы, содержащей диоксид кремния, диоксид титана, борат или оксид натрия, а также газообразующие, легирующие, раскисляющие и денитрифицирующие компоненты.2. Трубчатая сварочная проволока по п. 1, содержащая упомянутый активатор в количестве от приблизительно 2,5% до приблизительно 3,3% по весу.3. Трубчатая сварочная проволока по п. 1, содержащая упомянутый активатор в количестве от приблизительно 2,9% до приблизительно 3,2% по весу.4. Трубчатая сварочная проволока по п. 1, содержащая в качестве раскисляющих и денитрифицирующих компонентов алюминиевый порошок в количестве от приблизительно 2,6% до приблизительно 3,7% по весу.5. Трубчатая сварочная проволока по п. 1, содержащая в качестве раскисляющих и денитрифицирующих компонентов алюминиевый ...

Deposition of solder pattern on circuit boards - applying charge drum collecting pattern of soldered powder particles for transfer to board.

A printing process used to transfer solder onto a circuit board has a drum (1) with a photoconducting surface (3) of selenium or zinc oxide. An electrical charge unit (5) is positioned near to the surface together with a magazine (6) containing solder powder. A controlled light source (9) output is directed onto the faces of a rotating polygon scanner (10). The modulated beam is reflected (11) onto the drum surface to form a charge pattern that collects solder particles transferred onto the circuit board. ADVANTAGE - High precision formation of solder on board surface.

Bonding agent to heat-join two aluminum components consists of a combination of heated aluminum and zinc applied as a wire, rod, foil or powder

In a process to joint two aluminum work pieces by the application of heat, the bonding agent (3) consists substantially of aluminum that is heated by a heat source (4). The agent diffuses at least partially into the aluminum surfaces in a non-liquid condition. The agent is wire, rod, foil or powder consisting of aluminum and zinc. The heat source is a laser, butane or propane gas, induction heat or hot air.

Zusammensetzung und Verfahren zum Verbinden von unterschiedlichen Elementen und so hergestellte Verbundbauteile

LOT FÜR OXIDSCHICHTBILDENDES METALL UND LEGIERUNGEN

Punktschweißen von Metallblechen mit Impfmitteln

Die vorliegende Erfindung betrifft ein Verfahren zum Punktschweißen von zwei, hauptsächlich aus vergütetem Stahl hergestellten Blechen, umfassend die folgenden Schritte: Vorbestimmen des Kontaktbereichs der beiden Bleche, an welchem der Schweißpunkt erzeugt werden soll; Auftragen von Materialien, die Impfpartikel enthalten, auf die Oberfläche von wenigstens einem der beiden Bleche in besagtem Kontaktbereich; Punktschweißen der beiden Bleche, indem elektrischer Strom mit Hilfe von einem Paar Elektroden durch die Bleche geleitet wird, wobei die Partikel wenigstens ein Material der folgenden Gruppen aufweisen:(a) Al+Ca; (b) Sr+Zr.

Verfahren zum pulvermetallurgischen Herstellen von duennen Metallbaendern

Fülldraht zum MSG-Schweißen von FeMn-Stahl

Fülldraht zum MSG-Schweißen von vollaustenitischen Hochmanganstahl im Dünnblechbereich, bestehend aus einem Mantel aus weichem, gut verformbarem unlegiertem Stahl und einem innenliegenden Pulvergemisch aus den KomponentenC 0,05 - 0,8 %Si ≤ 0,4 %Mn 16,5 - 30,0 %Al ≤ 0,2 %Rest Fe wobei dem Pulvergemisch jeweils 0,001 bis 0,05 % die Elemente Bor, Zirkonium, Titan, Lanthan oder Cer einzeln oder in Kombination und 0,1 bis 2 % der Additive FeO, FeOTiO, MnO, MnOoder MnOeinzeln oder in Kombination zugesetzt sind.

VERFAHREN ZUR HERSTELLUNG UND ZUM TRANSFERIEREN METALLISCHER TROPFEN

Verfahren zum Reparieren bzw. Fertigen eines Bauteils

Die Erfindung betrifft ein Verfahren zum Reparieren eines Bauteils, insbesondere eines statorseitigen Bauteils einer Gasturbine wie eines Gehäuses oder eines Leitschaufelkranzes, wobei aus dem Bauteil ein beschädigter Abschnitt herausgetrennt wird, und wobei ein den beschädigten sowie herausgetrennten Abschnitt ersetzender Neuabschnitt mit dem Bauteil durch Schweißen fest verbunden wird. Erfindungsgemäß wird der beschädigte Abschnitt derart aus dem zu reparierenden Bauteil herausgetrennt, das die Länge einer Trennnaht und damit einer späteren Schweißnaht minimiert wird, wobei abhängig von der Materialdickenverteilung entlang der Trennnaht zur Bereitstellung einer möglichst gleichmäßigen Materialdicke entlang der späteren Schweißnaht vom Bauteil Material abgetragen wird und wobei nach dem Verbinden des Bauteils mit dem Neuabschnitt durch Laserpulverauftragschweißen zumindest das abgetragene Material erneuert wird.

Couponreparatur mittels Einsatz eines PSP-Elements und repariertes Bauteil

Durch die Verwendung eines PSP-Elements, das unterschiedlich dick (7‘, 7‘‘) ausgebildet ist, wird eine an die Muldengeometrie optimal angepasste Oberfläche (9) erzeugt und eine ebene Oberfläche (12), auf der einfach ein Coupon (13) aufgebracht werden kann und gelötet ist.

Verfahren zur Herstellung eines Werkzeugs für die Bearbeitung von Blechen sowie Werkzeug

Die Erfindung betrifft ein Verfahren zur Herstellung eines Werkzeugs (1) für die Bearbeitung von Blechen, insbesondere zu deren Beschneiden oder Umformen mittels Tiefziehen sowie ein solches Werkzeug (1). Das Verfahren umfasst die Bereitstellung eines metallischen Basiskörpers (2), auf welchen zumindest bereichsweise ein Schweißgut (9) aufgeschweißt wird. Erfindungsgemäß besteht das Schweißgut (9) aus einer Legierung in Massen-% von Kohlenstoff (C) 1,51,8 Vanadium (V) 7,59,0 Chrom (Cr) 4,56,0 Molybdän (Mo) 1,02,5 Nickel (Ni) kleiner (<) 0,5 Mangan (Mn) kleiner (<) 1,0 Silizium (Si) kleiner (<) 1,0 sowie einem Rest aus Eisen (Fe) und erschmelzungsbedingten Verunreinigungen.

Selectively joining bodies to bearers with laser beams involves subjecting body/bodies on bearer to high intensity pulsed laser beams in vacuum or protective gas up to lower than melting temperature

The method involves placing a body or several bodies on the surface of the bearer and subjecting the body or bodies to high intensity pulsed laser beams in a vacuum or in a protective gas up to a temperature lower than the melting temp. of the body or bodies, whereby a pulsed radiation pressure acts on the body or bodies simultaneously. The bodies can be applied in the form of a powder. Independent claims are also included for the following: (a) an arrangement for implementing the inventive method (b) and the use of an ultrashort pulse laser.

Mfr. or repair of turbine blade tips using laser beam weld-coating and blade master alloy metal powder filler

The method is used to make or repairs turbine blades. Laser beam weld-coating is employed, using a metal powder filler. The novel approach involves forming a strip of metal sheet (3) into a fork-like shape. This is fitted tightly around the contour (4) of the blade tip (6) with the aid of an externally-surrounding encapsulation of injection-moulded plastic (5). This locks around the contour, faithful to its profile, forming a mould in the manner of shuttering. The strip projects beyond both encapsulation and blade tip. The internal region (8) rising above the tip, is completely filled. Also claimed are the corresponding mould, as described, and the method of making it. The flexible metal strip is formed about the tip of the blade and pressed on using an upper lamellar diaphragm (22). A contour-fitting lower lamellar diaphragm is set near the root of the blade, completing a closed cavity between upper and lower diaphragms. The plastic is then injected, exerting pressure on the lower regions ...

Cored wire for treating molten metal by wire injection, comprises an outer casing formed by metal strip, and a filling material, which is in the form of granules and/or powder and which is accommodated in a closed cavity

The cored wire for treating molten metal by wire injection, comprises an outer casing formed by metal strip (2), and a filling material (3), which is in the form of granules and/or powder and which is accommodated in a closed cavity formed by the casing. The void volume has an oxygen concentration that is reduced in comparison with inert gas as protective gas. The inert gas has high density than oxygen. The inert gas concentration in the void volume is greater than 50 vol.%. Independent claims are included for: (1) procedure for continuous production of cored wire; and (2) device for continuous production of cored wire.

A boroscope and a method of laser processing a component using the borescope

A boroscope 60 has a working head. An optical fibre 74 extends through the borescope 60 to the working head 68. Another optical fibre 76 extends through the boroscope (60) to the end 72 of the working head 68. A laser optical fibre 78 extends through the borescope 60. A lens 80 may be is arranged in the working head 68 and a mirror 82 is gimballed 84 to the end 72 of the working head 68. The laser optical fibre 78 directs laser light optionally onto the lens 80 and then onto the mirror 82. LEDs 86, 88 are arranged on the working head 68. An actuator 90,92 adjusts the position of the mirror 82.

METHODS FOR MAKING METAL PARTICLES SPHERICAL AND REMOVING OXIDE FILM,SOLDER PASTE AND SOLDERING METHOD

Soldering method

A method of soldering in which a solder is applied to a first part to be soldered and any oxide film on the thus formed presoldering is removed by, for example, a flux is characterised in that the solder is then coated with an organic solvent to prevent further oxidation and a second part to be soldered is contacted with the first part. The resulting assembly is heated so that the solder melts and bonds the first and second parts together and so that the organic solvent evaporates. Thus soldering can be carried out without the need to clean any flux away after soldering. The solder may be Au-20Sn; Pb-3.5Ag-1.55n or Pb-55n and the organic solvent may be tetraethylene glycol. The first part may be a semiconductor chip and the second part may be a printed substrate for mounting the semiconductor chip. ...

BRAZING ALLOY COMPOSITION

... 1360890 Copper-nickel brazing alloy; joining compacts during sintering A JOHNSON & CO Inc 17 May 1972 [17 May 1971] 23244/72 Headings C7A and C7D [Also in Division B3] A brazing alloy, especially for joining pressed powder metal parts during sintering thereof, comprises: - and the balance, apart from impurities being Ni. The brazing alloy may be provided as a powder mixture of (A) Cu 3À5-70%, Ni 3-20% and Mn balance and (B) Si 2À5-5À5%, B 0À75-5À25% and Ni balance in the range 50%A and 50%B to 75%A and 25%B. Examples refer to graphite and iron powder compacts being sintered and joined in a reducing atmosphere. The parts being joined may both be powder compacts or such a compact may be joined to a wrought body. The brazing alloy may be used as a pressed shim or collar for joining the iron compacts together during sinte ring.

Wear-resistant coating on a component,and a method of producing it

The invention concerns a wear-resistant coating on a component exposed to high wear loads. The coating is made up of a mixture of at least one metallic material in powder form and an oxide-dissolving non-metallic fluxing agent, also in powder form, this mixture being converted by the addition of a non-corrosive, stable, resin-like binder into a form which can be spread or laid on the component and then fused on to the component.

Rotating build plate for powder bed additive layer manufacturing system

A powder bed additive layer manufacturing system includes a linear traversing re-coater 8 and a build plate 6, characterised in that the build plate 6 is mounted for rotation. In a further aspect, the build plate 6 includes an elevator mechanism 7, which mechanism incorporates the rotation axis. In an alternative arrangement, the re-coater 8 is rotated instead of the build plate 6. Preferably, the re-coater 8 distributes powder material 4 from a hopper 9 onto the build plate 6, and a laser 1, directed by scanning optics 2, directs a beam 3 onto the powder 4 to to form a solid layer 5. By this method, a three-dimensional model can be fabricated. The provision of a rotation axis on the build plate 6 or re-coater 8 allows an uppermost deposited layer, especially in a body 5 having parts of different orientations, to be positioned so that it lies substantially orthogonal to the line of movement of the re-coater 8 before the next layer is deposited, thereby reducing any frictional forces and ...

Combustor component and method of manufacture

Laser Deposition Spray Nozzle

A spray nozzle 10 for a laser deposition apparatus, comprises an elongate nozzle aperture 16, a powder supply chamber 18 in fluid communication with the elongate nozzle aperture and upper and lower elongate gas apertures 26, 28 located above and below the elongate nozzle aperture respectively and extending substantially parallel to the elongate nozzle aperture. In use the powder supply chamber supplies powder to the nozzle aperture under pressure so as to cause a wide powder stream to be ejected from the nozzle aperture and the upper and lower elongate apertures eject a wide gas stream above and below the wide powder stream. When used with a laser deposition apparatus 10 a relatively wide coating of a substantially uniform thickness can be deposited.

Method of fabricating soldering balls for semiconductor encapsulation

CONTACT ELEMENT AND PROCESS FOR PRODUCING THE SAME

METHOD OF MANUFACTURING A COMPONENT USING A LASER

Apparatus for manufacturing a component by added layer deposition and a method of manufacturing a component. The method comprises the steps of directing a beam of energy e.g. a laser beam to heat a working region of a substrate and adjusting the cross sectional shape of the beam to thereby generate a variety of predetermined cross sectional shapes of working region while the beam is being directed onto the substrate. Thus the distribution of energy delivered to the substrate is controlled during the manufacturing process. The cross sectional shape and area of the beam is repeatedly monitored and compared to a library of predetermined cross sectional shape(s) and area(s) and the beam cross sectional shape adjusted accordingly.

Method for connecting at least two components of an endoscope, component of an endoscope and endoscope

Method of welding single crystal turbine blade tips with an oxidation-resistant filler material

BRAZING ALLOY

Braze joints with a dispersed particulate microstructure

METHOD OF FILLING CAVITIES IN AND BETWEEN METAL ARTICLES

... 1534371 Coating or repairing superalloy surfaces UNITED TECHNOLOGIES CORP 2 Jan 1976 [6 Jan 1975] 00036/76 Headings C7D and C7F Surface defects in metal articles such as Fe, Co or Ni based superalloys are repaired by removing the defects to form a cavity which is filled with a powder mixture comprising (a) a powder corresponding in composition to the article and (b) a powder containing the base metal of the article and a melting point depressant such as B or Si and heating the assembly to partially melt the powder mixture. Powder (b) preferably contains 1-3% B and the weight ratio of powder (a) to powder (b) in the mixture is 2:1 to 9:1. The powder mixture may be loosely packed in the cavity and heated or solidphase sintered in position prior to melting. Pressure may also be applied during the heating.

Rotating build plate

Method for joining metal parts

A novel coating concept

A braze alloy layered product

Method for joining metal parts

A novel brazing concept

A novel brazing concept

A braze alloy layered product

A novel coating concept

A novel brazing concept

A novel coating concept

A braze alloy layered product

A novel brazing concept

Method for joining metal parts

A novel brazing concept

A novel brazing concept

REPAIR OF WITHDRAWAL EDGE AND PLATFORM OF A TURBINE CONSTRUCTION PART BY LASER COATING

AUXILIARY POWDER TO THE DIFFUSION BRAZE WELDING OF WORKPIECES FROM NICKEL, COBALT OR IRON BASIS ALLOYS

ALLOY FOR SOLDERING AND THEIR USE

LEAD FREE TIN ZINC PLUMB BOB, ITS MIXTURE AND SOLDERING PART

LOETMISCHUNG TO CONNECTING METAL PARTS

VERFAHREN ZUM HERSTELLEN EINER VERSCHLEISSARMEN SCHUTZSCHICHT AUF EINEM BAUTEIL

DEVICE FOR THE RECLOADING OF A CONCAVE SURFACE OF A WORKPIECE BY BRINGING IN A MATERIALES AND BY BRINGING IN OF LASER ENERGY

GAS CELL WITH PARTIKELFORMIGES MATERIAL AN ABSTENTION HARD SOLDERING ALLOY

REPAIR OF THE STATIONARY POETRY OF A ROTOR

PROCEDURE FOR THE DIFFUSION BRAZE WELDING OF ARTICLES FROM SUPERALLOYS

FLEXIBLE ONE AND INTERLACE-CASH THERMAL INTERFACE MATERIALS

HARD RELEASE MIXTURE

PROCEDURE FOR THE PRODUCTION OF A SCHNEIDODER EMBOSSING ROLL OF MEANS LASER DEPOSIT WELDING

PROCEDURE FOR THE PRODUCTION OF MEHRKOMPONENTIGER, CONGRUENT OF ERSCHMELZENDER PLUMB BOB MATERIALS

HARTLOTBLATT UND HERSTELLUNGSVERFAHREN DAFÜR

Um ein Hartlotblatt mit ausgezeichneten Handhabungseigenschaften zu erhalten, wird ein Pulver einer Lötmetall-Zusammensetzung aus einer einzelnen Pulversorte gewonnen oder durch Mischen von zwei oder mehr Pulvern, um die Lötmetall-Zusammensetzung zu bilden. Durch Pulver-Walzverdichten wird das Pulver in Blattform gebracht.

PROCEDURE FOR THE BELOTEN OF PURIFYING STRUCTURES FROM DUENNEN FOR SOLDERING SHEET METALS, IN PARTICULAR WASTE GAS CATALYST TRAEGERKOERPERN.

PRODUCTION OF ARTICLES BY COMPOUND FORMATION OF PRE-TREATED POWDERS

PROCEDURE FOR CONNECTING TUNGSTEN CARBIDE PARTS

PROCEDURE FOR THE PRODUCTION OF A MOLDED ARTICLE BY METALLIC POWDER FUSION PROCEDURES

BOUNDARY SURFACE MATERIALS AND PROCEDURES FOR YOUR PRODUCTION AND USE

HARTLOT

FLUXING AGENT-COATED METAL CONSTRUCTION UNITS

REPAIR OF WITHDRAWAL EDGE AND PLATFORM OF A TURBINE CONSTRUCTION PART BY LASER COATING

REPAIR OF WITHDRAWAL EDGE AND PLATFORM OF A TURBINE CONSTRUCTION PART BY LASER COATING

REPAIR OF WITHDRAWAL EDGE AND PLATFORM OF A TURBINE CONSTRUCTION PART BY LASER COATING

REPAIR OF WITHDRAWAL EDGE AND PLATFORM OF A TURBINE CONSTRUCTION PART BY LASER COATING

REPAIR OF WITHDRAWAL EDGE AND PLATFORM OF A TURBINE CONSTRUCTION PART BY LASER COATING

REPAIR OF WITHDRAWAL EDGE AND PLATFORM OF A TURBINE CONSTRUCTION PART BY LASER COATING

REPAIR OF WITHDRAWAL EDGE AND PLATFORM OF A TURBINE CONSTRUCTION PART BY LASER COATING

REPAIR OF WITHDRAWAL EDGE AND PLATFORM OF A TURBINE CONSTRUCTION PART BY LASER COATING

Method of bonding hard metal objects

Buffer Layer to Enhance Photo and/or Laser Sintering

Conductive lines are deposited on a substrate to produce traces for conducting electricity between electronic components. A patterned metal layer is formed on the substrate, and then a layer of material having a low thermal conductivity is coated over the patterned metal layer and the substrate. Vias are formed through the layer of material having the low thermal conductivity thereby exposing portions of the patterned metal layer. A film of conductive ink is then coated over the layer of material having the low thermal conductivity and into the vias to thereby coat the portions of the patterned metal layer, and then sintered. The film of conductive ink coated over the portion of the patterned metal layer does not absorb as much energy from the sintering as the film of conductive ink coated over the layer of material having the low thermal conductivity. The layer of material having the low thermal conductivity may be a polymer, such as polyimide.

Solder adhesive and a production method for the same, and an electronic device comprising the same

The present invention relates to a solder adhesive and a production method for the same, and to an electronic device comprising the same, and more specifically it relates to a solder adhesive comprising an alloy including tin and having a melting point of from 130 to 300° C., a first binder including a rosin compound, and a second binder having a thermosetting resin, as well as to a production method for the same and an electronic device comprising the same.

Repair of turbine components and solder alloy therefor

A method for repairing a component of a gas turbine and a solder alloy are disclosed. In an embodiment, the method includes applying the solder alloy to the component in an area of the component having a punctiform damage or a linear imperfection, where the solder alloy is a mixture of a NiCoCrAlY alloy and a Ni-based solder. A molded repair part made of the solder alloy is applied to the component in an area of the component having a planar defect. The component is heat treated to solder the molded repair part on the component and to solder the solder alloy applied to the component in the area of the component having the punctiform damage or the linear imperfection. The component is cooled after the heat treating and, following the cooling, the component is further heat treated.

Laser processing system and overlay welding method

A laser processing system includes a laser processing head, a powder supply device, and a controller. The powder supply device supplies powder to the laser processing head. The laser processing head includes: a laser emission unit which irradiates a workpiece with laser light; and a powder supply unit which receives the powder supplied from a powder supply device to the laser processing head, and can supply the powder to a laser spot on the workpiece. The powder supply unit includes: a powder discharge unit which can discharge the powder toward the laser spot on the workpiece; and a powder-supply control mechanism which controls the amount of the powder to be supplied to the powder discharge unit, by distributing to the powder discharge unit at least a part of a flow of the powder supplied from the powder supply device. The controller controls the distributing by the powder-supply control mechanism.

Cutting/polishing tool and manufacturing method thereof

There are provided a cutting/polishing tool that may be readily manufactured and have an improved cutting performance, and a manufacturing method thereof. The method for manufacturing the cutting/polishing tool including at least one cutting/polishing body may comprise preparing a tool body, and forming a cladding layer including cutting material particles by spraying, onto an outer surface of the tool body, the cutting material particles and a metal powder having a specific gravity greater than a specific gravity of the cutting material particles while heating the outer surface of the tool body using a heating device installed in a lower side of the outer surface of the tool body so that the metal powder is deposited on the outer surface of the tool body, wherein the cladding layer configures the at least one cutting/polishing body.

Method of determining bond coverage in a joint

A method of determining bonding agent coverage in a joint between a first substrate ( 10 ) and a second substrate ( 12 ), including: dispersing a marker material ( 18 ) throughout a bonding agent ( 16 ); melting the bonding agent ( 16 ) but not the marker material; solidifying the melted bonding agent ( 16 ) to form an actual bond ( 24 ) in a joint between the first substrate ( 10 ) and the second substrate ( 12 ); detecting the marker material ( 18 ) in the joint through at least one of the substrates to ascertain an actual bond ( 24 ); and comparing the actual bond ( 24 ) to an expected bond ( 28 ) for the joint to determine the bonding agent coverage.

Solder, soldering method, and semiconductor device

A solder includes Sn (tin), Bi (bismuth) and Zn (zinc), wherein the solder has a Zn content of 0.01% by weight to 0.1% by weight.

Method and device for producing a component of a turbomachine

The invention relates to a method for producing a component ( 10 ) of a turbomachine, especially a structural part of a turbine or a compressor, the method being a generative production method for the layer-by-layer buildup of the component ( 10 ). After production of one or more successive component layers pressure is applied to at least sections of the surface of the most recently produced component layer ( 12 ), the pressure being induced by laser or plasma. The invention further relates to a device for producing a component ( 10 ) of a turbomachine, especially a structural part of a turbine or a compressor, the device ( 26 ) comprising at least one powder feed ( 28 ) for the deposition of at least one powder component material ( 16 ) onto a component platform, at least one radiation source ( 14 ) for a local layer-by-layer fusion or sintering of the component material ( 16 ) and at least one laser radiation source ( 20 ) or at least one plasma impulse source.

Braze alloy for high-temperature brazing and methods for repairing or producing components using a braze alloy

In a Ni-based, Co-based, or Ni—Co-based braze alloy ( 1 ) for high-temperature brazing of components ( 7 ) of modular structure and for repairing damaged components ( 7 ) which are formed of single crystal or directionally solidified superalloys using said braze alloy ( 1 ), the braze alloy has a first metallic powder component ( 2 ) having particle sizes in the nanometer range and a second metallic powder component ( 3 ) having particle sizes in the micrometer range. The surface of the particles of the second powder component ( 3 ) is thinly coated with particles of the first powder component ( 2 ). The braze alloy ( 1 ) additionally includes grain boundary stabilizing elements as alloying elements. In addition, melting point depressants can be present in the braze alloy ( 1 ) in a commercially common quantity or with a considerably increased proportion. Both the melting temperature of the braze alloy ( 1 ) and the probability of recrystallization are advantageously reduced.

Conductive bonding material, conductor bonding method, and semiconductor device production method

A conductive bonding material comprising: a first metal particle; a second metal particle having an average particle diameter larger than an average particle diameter of the first metal particle; and a third metal particle having an average particle diameter larger than the average particle diameter of the first metal particle, a relative density larger than a relative density of the first metal particle, and a melting point higher than a melting point of the second metal particle.

Lead-free solder paste

As electronic equipment has become smaller in size, printed circuit boards which cannot be subjected to cleaning have been developed, and a no-clean lead-free solder paste is becoming necessary. In order for a solder paste not to require cleaning, it is necessary that the color of the residue be transparent and that the residue be non-tacky. A maleated rosin, which is a rosin suited for no-clean paste, has a high acid value so it is not suitable for a flux for lead-free solder. As a means of suppressing a reaction between a flux containing a maleated rosin and a Sn—Ag—Cu based solder alloy powder, a Sn—Ag—Cu—Sb based solder alloy powder is used which adds 1-8 mass % of Sb to a Sn—Ag—Cu based solder alloy. As a result, it is possible to provide a solder paste which has the excellent effect that the solder paste does not easily undergo changes over time and

MANUFACTURING METHOD OF SOLDER TRANSFER SUBSTRATE, SOLDER PRECOATING METHOD, AND SOLDER TRANSFER SUBSTRATE

An adhesive layer forming step of forming an adhesive layer on a surface of a substrate; a solder layer forming step of forming a solder layer on the adhesive layer by loading plural solder powders with in-between spaces; and a filler supplying step of supplying fillers to the in-between spaces of the solder powders that have been formed on the adhesive layer are included. 1. A manufacturing method of a solder transfer substrate , comprising:an adhesive layer forming step of forming an adhesive layer on a surface of a substrate;a solder layer forming step of forming a solder layer on the adhesive layer by loading plural solder powders with in-between spaces; anda filler supplying step of supplying fillers to the in-between spaces of the solder powders.2. A manufacturing method of a solder transfer substrate , comprising:an adhesive layer forming step of forming an adhesive layer on a surface of a substrate;a solder layer forming step of forming a solder layer on the adhesive layer by loading plural solder powders with in-between spaces;a flux supplying step of supplying a flux so that the solder powders are covered with the flux; anda filler supplying step of supplying fillers to the in-between spaces of the solder powders.3. A solder precoating method , comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'a solder joining step of superposing the solder transfer substrate that has been manufactured by the manufacturing method according to , and a work that has a low-dielectric-constant layer with an electrode formed thereon so that a face on which the solder layer is formed faces a face on which the electrode is formed, and carrying out heating and pressurization, thereby allowing the solder powders to be diffused and joined to the electrode; and'}a transfer substrate peeling-off step of peeling off, after cooling, the solder transfer substrate from the work.4. A solder transfer substrate , comprising:a base layer;an adhesive layer that is arranged on the ...

Soldering paste and flux

The object of the present invention is to provide a solder paste that enables to form a surface mounting structure for electronic components that exhibits crack resistance in a solder joint section even in 100 heat-shock cycles at −40° C. to 150° C. as required for use in the vicinity of engines for vehicular applications. A flux including an amine halogen salt and a dicarboxylic acid is kneaded with a Sn—Ag—Bi—In alloy powder. As a result, a solder paste exhibiting long continuous printability, little occurrence of solder balls, and excellent joining ability with no cracking in 100 heat-shock cycles at −40° C. to 150° C. is obtained.

Innovative braze and brazing process for hermetic sealing between ceramic and metal components in a high-temperature oxidizing or reducing atmosphere

A superior braze material, along with a method of producing the braze material and a method of sealing, joining or bonding materials through brazing is disclosed. The braze material is based on a metal oxide-noble metal mixture, typically Ag—CuO, with the addition of a small amount of metal oxide and/or metal such as TiO 2 , Al 2 O 3 , YSZ, Al, and Pd that will further improve wettability and joint strength. Braze filer materials, typically either in the form of paste or thin foil, may be prepared by a high-energy cryogenic ball milling process. This process allows the braze material to form at a finer size, thereby allowing more evenly dispersed braze particles in the resultant braze layer between on the surface of the ceramic substrate and metallic parts.

Manufacturing Method Of Heat Exchanger, And Heat Exchanger Manufactured By Such Manufacturing Method

The disclosed method relates to manufacturing a heat exchanger which causes no brazing defects, and a heat exchanger manufactured by the method. The method relates to manufacturing a heat exchanger having an aluminum alloy tube defining a cooling-medium flowing passage and a copper alloy tube defining a water flowing passage, wherein a heat exchange is carried out between a cooling medium flowing through the cooling-medium flowing passage and water flowing through the water flowing passage. The aluminum alloy tube and the copper alloy tube are brazed to each other at a temperature of less than 548° C.

SOLDER POWDER AND METHOD OF PRODUCING SOLDER POWDER

A solder powder having an average particle diameter of, for example, 0.05 μm or more and less than 3 μm is obtained by a method of producing a solder powder, including the steps of: putting solid or liquid metal, a non-aqueous solvent, and crushing balls having a diameter of 0.05 mm to 5 mm into a container to obtain a mixture; heating the mixture to 150° C. or higher and stirring the mixture; separating the crushing balls from the mixture after the stirring to obtain a mixture of the solder powder and the non-aqueous solvent; and performing solid-liquid separation on the mixture of the solder powder and the non-aqueous solvent to obtain a solder powder.

STARTING MATERIAL AND PROCESS FOR PRODUCING A SINTERED JOIN

The present invention relates to a starting material for producing a sintered connection. In order to avoid the formation of cracks in the joining partners in the case of fluctuating thermal loading, the starting material comprises second particles in addition to metallic first particles , wherein the second particles at least proportionately contain a particle core material which has a coefficient of thermal linear expansion α at 20° C. which is less than the coefficient of thermal linear expansion α at 20° C. of the metal or of the metals of the first particles in metallic form, and wherein the Dvalue of the second particles is greater than or equal to half the Dvalue of the first particles and less than or equal to two times the Dvalue of the first particles . In addition, the present invention relates to a corresponding sintered connection ′, to an electronic circuit and also to a process for forming a thermally and/or electrically conductive sintered connection. 1100100. A starting material () for a sintered bond (′) , which comprises{'b': '10', 'metal-containing first particles () and'}{'b': '20', 'second particles (),'}{'b': 20', '21', '10, 'characterized in that the second particles () contain at least a proportion of a particle core material () whose coefficient of thermal expansion α at 20° C. is smaller than the coefficient of thermal expansion α at 20° C. of the metal or metals of the first particles () in metallic form,'}and{'sub': 50', '50', '50, 'b': 20', '10', '10, 'the Dof the second particles () is greater than or equal to half the Dof the first particles () and less than or equal to twice the Dof the first particles ().'}221. The starting material as claimed in claim 1 , wherein the coefficient of thermal expansion α of the particle core material () at 20° C. is ≦10·10K.32010. The starting material as claimed in claim 1 , wherein the Dof the second particles () is greater than or equal to half the Dof the first particles and less than or equal to ...

Method of Joining at Least Two Components, a Method for Rendering a Component Resistant to Eroision, and a Turbine Blade

A method of joining at least two components, a method of preventing erosion of a base component and a turbine blade is provided. The method of joining at least two components includes providing a laser cladding apparatus, aligning a first component and second component, and jointing the first and second components by laser cladding. The first component includes a first joining surface adjacent to a seconding joining surface of the second component. The first joining surface and the second joining surface are joined by laser cladding along a joining plane. A joining material from the laser cladding provides at least one joining layer between the first joining surface and the second joining surface. The first and second joining surfaces include a bevel angle. A method for rendering a component resistant to erosion and a turbine blade are also provided.

Systems and methods for tubular welding wire

A tubular welding wire includes a granular core and a metal sheath encircling the granular core. Furthermore, the metal sheath includes at least approximately 0.3% manganese by weight and at least approximately 0.05% silicon by weight.

Joining method, joint structure, electronic device, method for manufacturing electronic device and electronic part

A method of joining a first metal member having at least a surface made of a first metal to a second metal member having at least a surface made of a second metal with a joining material sandwiched therebetween. The joining material includes a low melting point metal having a lower melting point than the first metal and/or the second metal. The low melting point metal composing the joining material is Sn or an alloy containing Sn. At least one of the first metal and the second metal is a metal or an alloy which forms an intermetallic compound with the low melting point metal, and which has a lattice constant difference of 50% or more from the intermetallic compound. The joining material located between the first metal member and the second metal member is heat-treated at a temperature at which the low melting point metal is melted.

CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

A conductive bonding material includes: a solder component including a metal foamed body of a first metal having at least one pore, the pore absorbs melted first metal when the metal foamed body is heated at a temperature higher than the melting point of the first metal, and a second metal having a melting point lower than the melting point of the first metal. 1. A conductive bonding material comprising:a solder component including:a metal foamed body of a first metal having at least one pore, the pore absorbs melted first metal when the metal foamed body is heated at a temperature higher than the melting point of the first metal, anda second metal having a melting point lower than the melting point of the first metal.2. The conductive bonding material according to claim 1 , whereinthe solder component contains particles of the metal foamed body and particles of the second metal, or the solder component contains coated particles, which are particles of the metal foamed body coated with the second metal.3. The conductive bonding material according to claim 2 , whereinthe mass ratio (A:B) of the particles of the first metal (A) to the particles of the second metal (B) is in the range of 20:80 to 50:50.4. The conductive bonding material according to claim 1 , whereinthe first metal has a melting point of 150° C. or more and 230° C. or less, and the second metal has a melting point of less than 150° C.5. The conductive bonding material according to claim 1 , whereinthe metal foamed body of the first metal is one of Sn—Bi—X alloy particles and Sn—Cu—X alloy particles, X being selected from the group consisting of Ag, Ni, Zn, Pd, and In.6. The conductive bonding material according to claim 1 , whereinthe second metal is one of a Sn—Bi alloy and a Sn—Bi—Y alloy, Y being selected from the group consisting of Ag, Ni, Zn, Pd, and In.7. The conductive bonding material according to claim 1 , whereinthe solder component constitutes 50% by mass or more and 95% by mass or less of ...

Metallic compositions useful for brazing, and related processes and devices

A braze alloy composition is disclosed, containing nickel, about 5% to about 40% of at least one refractory metal selected from niobium, tantalum, or molybdenum; about 2% to about 32% chromium; and about 0.5% to about 10% of at least one active metal element. An electrochemical cell that includes two components joined to each other by such a braze composition is also described. A method for joining components such as those within an electrochemical cell is also described. The method includes the step of introducing a braze alloy composition between a first component and a second component to be joined, to form a brazing structure. In many instances, one component is formed of a ceramic, while the other is formed of a metal or metal alloy.

Localized repair of superalloy component

A method for repairing a damaged portion ( 144 ) of a brazed-on gas turbine engine seal ( 142 ) without the need to remove and to replace the entire seal. The damaged portion is removed to reveal a repair surface ( 146 ) of the underlying superalloy material, and a new seal structure ( 148 ) is formed by an additive manufacturing processes using a laser beam ( 124 ) to melt a powder ( 116 ) including superalloy material ( 116 ′) and flux material ( 116 ″). The flux material forms a protective layer of slag ( 132 ) over the melted superalloy material, thereby permitting the new seal structure to be formed directly onto the underlying superalloy material without the need for an intervening braze layer.

Active solder

An active solder is revealed. The active solder includes an active material and a metal substrate. There are two kinds of active materials, titanium together with rare earth elements and magnesium. The metal substrate is composed of a main component and an additive. The main component is tin-zinc alloy and the additive is selected from bismuth, indium, silver, copper or their combinations. The active solder enables targets and backing plates to be joined with each other directly in the atmosphere. The target is ceramic or aluminum with low wetting properties. The bonding temperature of the active solder ranges from 150° C. to 200° C. so that the problem of thermal stress can be avoided.

Flange for pressure measurement cells or pressure transfer means and method for manufacture of such flanges

A flange for a corrosion resistant and nevertheless low cost flange for pressure measurement cells, or pressure transfer means, is composed essentially of a metal foundation of a standard material and is protected on the side facing a process medium by a there applied layer of a highly alloyed, special material.

SOLDER TRANSFER BASE, METHOD FOR PRODUCING SOLDER TRANSFER BASE, AND METHOD FOR TRANSFERRING SOLDER

A solder transfer substrate, including: a base layer; an adhesive layer arranged on the base layer; and plural solder powders arranged on the adhesive layer, wherein in the base layer, which is a porous member, a plurality of holes, which allow at least a peeling-off liquid to pass therethrough, are formed from a side thereof on which the adhesive layer is not arranged to a side thereof on which the adhesive layer is arranged. Particularly, the adhesive layer has a characteristic of expanding with the peeling-off liquid infused. 1. A solder transfer substrate , comprising:a base layer;an adhesive layer arranged on the base layer; andplural solder powders arranged on the adhesive layer, whereinin the base layer, a plurality of holes, which allow at least a peeling-off liquid to pass therethrough, are formed from a side thereof on which the adhesive layer is not arranged to a side thereof on which the adhesive layer is arranged.2. A solder transfer substrate according to claim 1 , whereinthe adhesive layer has a characteristic of expanding with the peeling-off liquid infused.3. A solder transfer substrate according to claim 1 , whereinthe base layer is a porous member.4. A solder transfer substrate according to claim 1 , whereinthe plurality of holes are provided so as to penetrate from a face of the base layer, which does not touch the adhesive layer, towards a face of the base layer, which touches the adhesive layer.5. A solder transfer substrate according to claim 4 , whereinthe plurality of holes are formed at least to an inside of the adhesive layer.6. A solder transfer substrate according to claim 1 , whereinthe base layer is larger than the adhesive layer in respect of a compression rate at a time of heating.7. A manufacturing method of a solder transfer substrate claim 1 , comprising:an adhesive layer forming step of forming an adhesive layer on a surface of a base layer having a plurality of holes; anda solder powder loading step of loading, on the adhesive ...

Hot-wire consumable to provide weld with increased wear resistance

A filler wire (consumable) for depositing wear-resistant materials in a system for any of brazing, cladding, building up, filling, hard-facing overlaying, welding, and joining applications is provided. The consumable is composed of base filler materials consistent with commonly known compositions. For example, the base filler material can comprise standard materials used in many standard mild steel wires. In addition to the base filler materials, the consumable includes wear-resistant materials. The wear-resistant materials include at least one of amorphous metallic powder, diamond crystals, diamond powder, tungsten carbide, and aluminides.

NICKEL-BASED BRAZING METAL POWDER FOR BRAZING BASE METAL PARTS WITH REDUCED EROSION

A brazing filler metal powder is provided for brazing thin stainless steel parts together with reduced erosion. The brazing filler metal powder is formed by processing first metal particles, which typically comprise a nickel-based alloy including chromium, phosphorous, silicon, to a particle size of not greater than 0.0098 inch; providing second metal particles, typically consisting of copper, molybdenum, or cobalt; combining the first metal particles with the second metal particles by mixing and/or, milling, or sintering; and processing the combined composition to a particle size of not greater than 0.0098 inch. The first and second metal particles are less than fully alloyed together and are distinct from one another. A preferred composition of the brazing filler metal powder is 26.1 wt. % chromium, 5.4 wt. % phosphorous, 5.9 wt. % silicon, 10.0 wt. % cobalt, and a balance essentially of nickel. 1. A brazing filler metal powder , comprising:a plurality of first metal particles including 13.0 wt. % to 45.0 wt. % chromium, 0.0 wt. % to 12.0 wt. % phosphorous, 0.0 wt. % to 12.0 wt. % silicon, 0.0 wt. % to 6.0 wt. % boron, 0.0 wt. % to 15.0 wt. % iron, and at least 41.0 wt. % nickel, based on the total weight of the first metal particles;a plurality of second metal particles combined with the first metal particles and consisting of at least one of copper, molybdenum, cobalt, chromium, and alloys thereof;the first metal particles and the second metal particles having a particle size of not greater than 0.0098 inch; andwherein the first metal particles and the second metal particles are distinct from one another and are less than fully alloyed together.2. The brazing filler metal powder of including 70.0 wt. % to 95.0 wt. % of the first metal particles and 1.0 wt. % to 30.0 wt. % of the second metal particles claim 1 , based on the total weight of the brazing filler metal powder.3. The brazing filler metal powder of claim 1 , wherein the second metal particles include ...

Electrically conductive compositions comprising non-eutectic solder alloys

Transient liquid phase sintering compositions comprising one or more high melting point metals and one or more low melting temperature alloys are known in the art as useful compositions for creating electrically and/or thermally conductive pathways in electronic applications. The present invention provides transient liquid phase sintering compositions that employ non-eutectic low melting temperature alloys for improved sintering and metal matrix properties.

Lead-free solder composition for glass

The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin. The indium (In) ranges from about 30.0 wt % to about 60 wt %. The zinc (Zn) ranges from about 0.01 wt % to about 11.0 wt %. The tin (Sn) is included as a remaining component.

Lead-Free Solder Ball

A lead-free solder ball for electrodes of a BGA or CSP comprising 0.5-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. Even when a printed circuit board to which the solder ball is bonded has Cu electrodes or Au-plated or Au/Pd-plated Ni electrodes, the solder ball has good resistance to drop impacts. The composition may further contain at least one element selected from Fe, Co, and Pt in a total amount of 0.003-0.1 mass % or at least one element selected from Bi, In, Sb, P, and Ge in a total amount of 0.003-0.1 mass %. 1. A lead-free solder ball which is used for electrodes by mounting on a module substrate for a BGA or CSP and which has a solder composition comprising 0.5-1.1 mass % of Ag , 0.7-0.8 mass % of Cu , 0.05-0.08 mass % of Ni , and a remainder of Sn.2. The lead-free solder ball according to claim 1 , wherein the solder composition comprises 0.9-1.1 mass % of Ag claim 1 , 0.7-0.8 mass % of Cu claim 1 , 0.05-0.08 mass % of Ni claim 1 , and a remainder of Sn.3. The lead-free solder ball according to claim 1 , wherein the solder composition comprises 1.0 mass % of Ag claim 1 , 0.75 mass % of Cu claim 1 , 0.07 mass % of Ni claim 1 , and a remainder of Sn.4. The lead-free solder ball according to claim 1 , wherein the solder composition further contains at least one element selected from Fe claim 1 , Co claim 1 , and Pt in a total amount of 0.003-0.1 mass %.5. The lead-free solder ball according to claim 1 , wherein the solder composition further contains at least one element selected from Bi claim 1 , In claim 1 , Sb claim 1 , P claim 1 , and Ge in a total amount of 0.003-0.1 mass %.6. The lead-free solder ball according to claim 1 , wherein the solder ball has a diameter of at least 0.1 mm.7. The lead-free solder ball according to claim 1 , wherein the solder ball has a diameter of at least 0.3 mm.8. The lead-free solder ball according to claim 1 , wherein the solder ball has a diameter of at least 0.5 mm.9. A method of ...

METHOD FOR TREATING Cu THIN SHEET

A method for treating a Cu thin sheet is provided. The method comprises the steps of: supplying a slurry in which a diffusion bonding aid (DBA), such as Ni powder, and a reinforcing material (RM), such as a carbide base metal compound, are dispersed in a solvent to a predetermined portion on a Cu or Cu base alloy thin sheet, drying the supplied slurry, and applying a laser to induce melting, solidification, and fixation, so as to form a buildup layer. In the method, the weight ratio of DBA to RM is specified to be 80:20 to 50:50, and the median diameters D 50 of both DBA and RM employed fall within 0.1 to 100 μm, the median diameter D 50 of DBA is larger than the median diameter D 50 of RM, and both the distribution ratio D 90 /D 10 of DBA and the distribution ratio D 90 /D 10 of RM are 4.0 or less.

Systems and methods for low-manganese welding wire

The invention relates generally to welding and, more specifically, to welding wires for arc welding, such as Gas Metal Arc Welding (GMAW) or Flux Core Arc Welding (FCAW). In one embodiment, a tubular welding wire includes a sheath and a core. The tubular welding wire is configured to form a weld deposit on a structural steel workpiece, wherein the weld deposit includes less than approximately 2.5% manganese by weight.

Suppressors and their methods of manufacture

Methods and systems to manufacture gun suppressors using laser metal melting (LMM) are disclosed, together with gun suppressors manufactured according to the methods and systems. In preferred forms the LMM process involves deposition of a metal powder such as titanium oxide.

Lead-free solder alloy, solder joining material, electronic circuit mounting substrate, and electronic control device

A lead-free solder alloy includes 2.0% by mass or more and 4.0% by mass or less of Ag, 0.3% by mass or more and 0.7% by mass or less of Cu, 1.2% by mass or more and 2.0% by mass or less of Bi, 0.5% by mass or more and 2.1% by mass or less of In, 3.0% by mass or more and 4.0% by mass or less of Sb, 0.001% by mass or more and 0.05% by mass or less of Ni, 0.001% by mass or more and 0.01% by mass or less of Co, and the balance being Sn.

LEAD-FREE SOLDER ALLOY

Provided is a lead-free solder alloy that has excellent tensile strength and ductility, does not deform after heat cycles, and does not crack. The In and Bi content are optimized and the Sb and Ni content are adjusted. As a result, this solder alloy has an alloy composition including, by mass, 1.0 to 7.0% of In, 1.5 to 5.5% of Bi, 1.0 to 4.0% of Ag, 0.01 to 0.2% of Ni, and 0.01 to 0.15% of Sb, with the remainder made up by Sn. 1. A lead-free solder alloy having an alloy composition comprising:1.0 to 6.5 wt % of In, more than 3.0 wt % but not more than 4.0 wt % of Bi, 1.0 to 3.0 wt % of Ag, 0.02 to 0.08 wt % of Ni, 0.03 to 0.09 wt % of Sb, and a balance of Sn.2. A solder paste comprising the lead-free solder alloy according to .3. A preform material comprising the lead-free solder alloy according to .4. A solder joint comprising the lead-free solder alloy according to .5. A lead-free solder alloy having an alloy composition comprising:1.0 to 6.0 wt % of In, more than 3.0 wt % but not more than 4.0 wt % of Bi, 2.0 to 3.0 wt % of Ag, 0.03 to 0.07 wt % of Ni, 0.05 to 0.08 wt % of Sb, and a balance of Sn.6. A solder paste comprising the lead-free solder alloy according to .7. A preform material comprising the lead-free solder alloy according to .8. A solder joint comprising the lead-free solder alloy according to .9. A lead-free solder alloy having an alloy composition comprising:1.0 to 7.0 wt % of In, 3.0 to 5.5 wt % of Bi, 1.0 to 4.0 wt % of Ag, 0.01 to 0.2 wt % of Ni, 0.01 to 0.09 wt % of Sb, and a balance of Sn.10. A solder paste comprising the lead-free solder alloy according to .11. A preform material comprising the lead-free solder alloy according to .12. A solder joint comprising the lead-free solder alloy according to . The present invention relates to a lead-free solder alloy.Electronic circuits (hereinafter referred to as “in-vehicle electronic circuits”) obtained by soldering electronic parts to printed circuit boards are mounted on a vehicle. Such in-vehicle ...

MICRO/NANO PARTICLE REINFORCED COMPOSITE SOLDER AND PREPARATION METHOD THEREFOR

A micro/nanoparticle-reinforced composite solder for low-temperature soldering and a preparation method thereof belong to the manufacturing field of lead-free low-temperature soldering solders. Micro/nanoparticle-reinforced tin-based alloy solder powder is formed by diffusely mixing micro/nano-sized Cu, Ag and Sb particles with a molten metal tin and atomizing the mixture, and then blended with low-melting-point SnBi-based alloy solder powder and a conventional flux to prepare a micro/nanoparticle-reinforced composite solder. In soldering at a temperature below 200° C., tin atoms in the molten micro/nanoparticle-reinforced tin-based alloy form an intermetallic compound on a soldering pan in preference to the low-melting-point SnBi-based alloy, and the micro/nanoparticles are dispersed in soldered joints to form a “separator effect”, which blocks atoms in the SnBi-based alloy from being precipitated and bonded with the soldering pan, thereby inhibiting the growth of a Bi-rich layer, and solving the problem of brittle and unreliable soldered joints in lead-free low-temperature soldering. 1. A micro/nanoparticle-reinforced composite solder for low-temperature soldering , comprising the following components by mass percentage:50-80% of low-melting-point SnBi-based alloy solder powder;10-40% of micro/nanoparticle-reinforced tin-based alloy solder powder, the micro/nanoparticle-reinforced tin-based alloy solder powder being an alloy powder formed by diffusely mixing one or two of micro/nano-sized Cu, Ag and Sb particles with a molten metal Sn and atomizing the mixture; anda balance amount of a flux.2. The micro/nanoparticle-reinforced composite solder according to claim 1 , whereinthe micro/nanoparticle-reinforced composite solder comprises the following components by mass percentage: 60-70% of low-melting-point SnBi-based alloy solder powder, 10-30% of micro/nanoparticle-reinforced tin-based alloy solder powder, and a balance amount of a flux;the low-melting-point SnBi- ...

BRAZE COMPOSITIONS, AND RELATED DEVICES

A braze alloy composition for sealing a ceramic component to a metal component in an electrochemical cell is presented. The braze alloy composition includes copper, nickel, and an active metal element. The braze alloy includes nickel in an amount less than about 30 weight percent, and the active metal element in an amount less than about 10 weight percent. An electrochemical cell using the braze alloy for sealing a ceramic component to a metal component in the cell is also provided. 1. An electrochemical cell comprising:a tubular separator disposed in a cell case defining a portion of a cathodic chamber and an anodic chamber, wherein the cathodic chamber comprises an alkali metal halide, and forms an ion capable of conducting through the separator;an electrically insulating ceramic collar disposed on a top end of the separator, anda metal ring disposed on the electrically insulating ceramic collar,wherein the electrically insulating ceramic collar is joined to the metal ring by a braze alloy composition comprising nickel, chromium, iron, silicon, boron and an active metal element, wherein chromium is present in an amount less than 10 weight percent, iron is present in an amount less than 10 weight percent, silicon is present in an amount from about 2 weight percent to about 10 weight percent, boron is present in an amount less than 5 weight percent, the active metal element is present in an amount from about 1 weight percent to about 3 weight percent, based on a total weight of the braze alloy composition, wherein the active metal element comprises titanium, zirconium, hafnium, vanadium, or a combination thereof, and wherein the braze alloy composition is in direct contact with both the electrically insulating ceramic collar and the metal ring.2. The electrochemical cell of claim 1 , wherein the alkali metal halide comprises sodium halide.3. The electrochemical cell of claim 1 , wherein the anodic chamber contains sodium.4. The electrochemical cell of claim 1 , ...

ELECTROCONDUCTIVE MICROPARTICLES, ANISOTROPIC ELECTROCONDUCTIVE MATERIAL, AND ELECTROCONDUCTIVE CONNECTION STRUCTURE

The present invention aims to provide electroconductive microparticles which are less likely to cause disconnection due to breakage of connection interfaces between electrodes and the electroconductive microparticles even under application of an impact by dropping or the like and are less likely to be fatigued even after repetitive heating and cooling, and an anisotropic electroconductive material and an electroconductive connection structure each produced using the electroconductive microparticles. The present invention relates to electroconductive microparticles each including at least an electroconductive metal layer, a barrier layer, a copper layer, and a solder layer containing tin that are laminated in said order on a surface of a core particle made of a resin or metal, the copper layer and the solder layer being in contact with each other directly, the copper layer directly in contact with the solder layer containing copper at a ratio of 0.5 to 5% by weight relative to tin contained in the solder layer. 1. Electroconductive microparticles used for conductive connection of electronic circuit substrates having copper electrodes each comprising at least an electroconductive metal layer , a barrier layer , a copper layer , and a solder layer containing tin that are laminated in said order on a surface of a core particle made of a resin ,the copper layer and the solder layer being in contact with each other directly, the copper layer directly in contact with the solder layer containing copper at a ratio of 0.5 to 5% by weight relative to tin contained in the solder layer.2. The electroconductive microparticles according to claim 1 ,wherein the concentration of the copper at any given point in the solder layer is 0.5 to 40% by weight after heating at 150° C. for 12 hours.3. The electroconductive microparticles according to claim 1 ,wherein at least one of nickel and cobalt is adhered to the surface of the solder layer.4. An anisotropic electroconductive material ...

Conductive particles, method for producing conductive particles, conductive material and connection structure

Provided are a conductive particle and a conductive material which are capable of decreasing the connection resistance and suppressing generation of voids in a connection structure when the connection structure is obtained by electrically connecting electrodes. The conductive particle according to the present invention has a solder at a conductive surface, wherein a group including a carboxyl group is covalently bonded to the surface of the solder; and the conductive material according to the present invention includes the conductive particles and a binder resin.

Brazing and soldering alloy wires

Brazing alloy wire formed from a composite comprising a sheath of at least one ductile first phase and a core comprising particles of a different composition to the sheath, in which: the sheath has an annealing temperature in degrees K the particles have a melting point at least 20% above the annealing temperature of the sheath the particles have a size distribution in which 25% by weight or less comprise particles less than 25 μm in size the particles are discrete

Solder Alloy for Power Devices and Solder Joint Having a High Current Density

A solder joint which is used in power devices and the like and which can withstand a high current density without developing electromigration is formed of a Sn—Ag—Bi—In based alloy. The solder joint is formed of a solder alloy consisting essentially of 2-4 mass % of Ag, 2-4 mass % of Bi, 2-5 mass % of In, and a remainder of Sn. The solder alloy may further contain at least one of Ni, Co, and Fe. 16-. (canceled)7. A process for preventing electromigration in a solder joint in which a current with a current density of 5-100 kA/cmflows through at least a portion thereof , comprising:providing a solder joint between an electronic part and a Cu land or Ni land of a printed circuit board; and{'sup': '2', 'applying the current having the current density of 5-100 kA/cmthrough at least the portion of the solder joint,'}wherein the solder joint is formed of a solder alloy consisting of 2-4 mass % of Ag, 2-4 mass % of Bi, 2-5 mass % of In, optionally at least one element selected from 0.05-0.3 mass % of Ni and 0.1-0.32 mass % of Co, and a remainder of Sn, and{'sub': 6', '5', '6', '5, 'sup': '2', 'wherein a reaction layer comprised of an intermetallic compound of (CuNi)(SnIn)or (CuCo)(SnIn)is formed between the solder alloy and the land, so that electromigration is prevented under a current density of 5-100 kA/cm.'}8. The process for preventing electromigration in a solder joint according to claim 7 , wherein a content of Ag in the solder alloy is 2.5-4 mass %.9. The process for preventing electromigration in a solder joint according to claim 7 , wherein a content of Bi in the solder alloy is 2-3 mass %.10. The process for preventing electromigration in a solder joint according to claim 7 , wherein a content of In in the solder alloy is 3-4 mass %.11. The process for preventing electromigration in a solder joint according to claim 7 , wherein the solder alloy consists of 2-4 mass % of Ag claim 7 , 2-4 mass % of Bi claim 7 , 2-5 mass % of In claim 7 , 0.05-0.3 mass % of Ni claim ...

Electronic apparatus and method for fabricating the same

An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

SOLDER BUMP STRETCHING METHOD FOR FORMING A SOLDER BUMP JOINT IN A DEVICE

A method of producing a solder bump joint includes heating a solder bump comprising tin above a melting temperature of the solder bump, wherein the solder bumps comprises eutectic Sn—Bi compound, and the eutectic Sn-Bi compound is free of Ag. The method further includes stretching the solder bump to increase a height of the solder bump, wherein stretching the solder bump forms lamellar structures having a contact angle of less than 90°. The method further includes cooling down the solder bump. 1. A method of producing a solder bump joint , the method comprising:heating a solder bump comprising tin above a melting temperature of the solder bump, wherein the solder bumps comprises eutectic Sn—Bi compound, and the eutectic Sn—Bi compound is free of Ag;stretching the solder bump to increase a height of the solder bump, wherein stretching the solder bump forms lamellar structures having a contact angle of less than 90°; andcooling down the solder bump.2. The method of claim 1 , wherein heating the solder bump comprises heating the solder bump further comprising copper.3. The method of claim 1 , wherein stretching the solder bump comprises stretching the solder bump to have a ratio of an average center width spacing to an average top contact width spacing is between 0.5 and 1.0.4. The method of claim 1 , wherein stretching the solder bump comprises forming the lamellar structure being predominantly orthogonal to an axis of stretching claim 1 , after the stretching.5. The method of claim 1 , wherein stretching the solder bump comprises forming the lamellar structure being predominantly parallel to an axis of stretching claim 1 , after the stretching.6. The method of claim 1 , wherein stretching the solder bump comprises forming the lamellar structure having a first portion and a second portion claim 1 , the first portion being predominantly parallel to an axis of stretching and the second portion being predominantly orthogonal to the axis of stretching claim 1 , after the ...

CONDUCTIVE BALL AND ELECTRONIC DEVICE

A conductive ball includes a copper ball, a nickel layer covering an outer surface of the copper ball, a copper layer covering an outer surface of the nickel layer, and a tin-based solder covering an outer surface of the copper layer. A copper weight of the copper layer relative to a summed weight of the tin-based solder and the copper layer is 0.7 wt % to 3 wt %. 1. A conductive ball comprising:a copper ball;a nickel layer covering an outer surface of the copper ball;a copper layer covering an outer surface of the nickel layer, anda tin-based solder covering an outer surface of the copper layer,wherein a copper weight of the copper layer relative to a summed weight of the tin-based solder and the copper layer is 0.7 wt % to 3 wt %.2. The conductive ball according to claim 1 , wherein a concentration of copper in the copper layer claim 1 , which is to diffuse into the tin-based solder when the tin-based solder is reflow heated claim 1 , is 0.7 wt % to 3 wt %.3. The conductive ball according to claim 1 , wherein the tin-based solder is one of a tin/bismuth solder claim 1 , a tin/silver solder claim 1 , and a tin/bismuth/nickel solder.4. An electronic device comprising:a lower electronic member having a first connection pad;an upper electronic member arranged above the lower electronic member and having a second connection pad; anda conductive ball configured to interconnect the first connection pad of the lower electronic member and the second connection pad of the upper electronic member, a copper ball,', 'a nickel layer covering an outer surface of the copper ball, and', 'a tin-based solder covering an outer surface of the nickel layer, and, 'wherein the conductive ball comprises{'sub': 6', '5, 'wherein a (Cu, Ni)Snlayer is formed between the nickel layer and the tin-based solder.'}5. The electronic device according to claim 4 , wherein each surface of the first connection pad and the second connection pad is a nickel layer or a copper layer claim 4 , and{'sub': 6 ...

Tool Blades And Their Manufacture

There is provided a tool blade, comprising a backing strip particles of abrasive material and a binder layer of binding material which binds the abrasive particles along an edge of the backing strip, wherein the edge of the backing strip is pre-formed with teeth, on which the abrasive particles are bound by the binding material. A profiled cutting portion extends beyond the pre-formed teeth. The pre-formed teeth are shaped as generally triangular waves or are flattened at least partially along an upper edge on which the cutting portion is at least partially disposed. A method of making such a blade is also provided. 1. A tool blade , comprising:a backing strip;particles of abrasive material; anda binder layer of binding material which binds the abrasive particles along an edge of the backing strip;wherein the edge of the backing strip is pre-formed with teeth on which the abrasive particles are bound by the binding material.2. The tool blade according to claim 1 , wherein the binding material and abrasive particles form a cutting portion profiled to provide a cutting edge.3. The tool blade according to claim 2 , wherein the profiled cutting portion extends beyond the pre-formed teeth.4. The tool blade according to claim 1 , wherein the pre-formed teeth are shaped as generally triangular waves.5. The tool blade according to claim 2 , wherein the pre-formed teeth are flattened at least partially along an upper edge on which the cutting portion is at least partially disposed.6. The tool blade according to claim 1 , wherein the pre-formed teeth of the backing strip are undersize relative to a desired size claim 1 , the abrasive particles and binding material coating the pre-formed teeth to increase the tooth size to the desired size.7. The tool blade according to claim 1 , wherein the abrasive particles have a particle size of 500 microns or less.8. The tool blade according to claim 1 , wherein the binding material comprises a braze material.9. A method of making a tool ...

Aluminum alloy products, and methods of making the same

The present disclosure relates to new metal powders for use in additive manufacturing, and aluminum alloy products made from such metal powders via additive manufacturing. The composition(s) and/or physical properties of the metal powders may be tailored. In turn, additive manufacturing may be used to produce a tailored aluminum alloy product.

Stable undercooled metallic particles for engineering at ambient conditions

Undercooled liquid metallic core-shell particles, whose core is stable against solidification at ambient conditions, i.e. under near ambient temperature and pressure conditions, are used to join or repair metallic non-particulate components. The undercooled-shell particles in the form of nano-size or micro-size particles comprise an undercooled stable liquid metallic core encapsulated inside an outer shell, which can comprise an oxide or other stabilizer shell typically formed in-situ on the undercooled liquid metallic core. The shell is ruptured to release the liquid phase core material to join or repair a component(s). 1. A method of joining under ambient conditions , comprising using one or more undercooled liquid metallic core-shell particles in a manner to join one or more metallic or nonmetallic components by rupturing the outer shell of the undercooled core-shell particles to release the undercooled liquid metallic core material to contact the one or more components and solidify.2. The method wherein the liquid metallic material of the undercooled particle core has a melting point Tin the range of 26 to 900° C.3. The method of wherein the chemistry of the one or more metallic components is the same or different from the chemistry of the liquid metallic material of the core.4. The method of for joining said one or more metallic or nonmetallic components that comprise non-particulate material.5. The method of for joining said one or more metallic or nonmetallic components that comprise one or more particulates.6. The method of wherein the one or more particulates comprise other of said liquid metallic core-shell particles that are joined together.7. The method of wherein the particulates are placed in a mold or a container and their outer shells then are ruptured to join the particulates in the mold or container.8. The method of wherein the one or more core-shell particles is/are assembled as a layer between metallic or non-metallic components to be joined and ...

Brazing alloy powder and joined component

Provided is a brazing alloy powder with which the development of defect in a brazed portion is suppressed and which enables an increase in the joint strength of the portion to be joined. Also provided is a brazed joined component having a high joint strength of the portion to be joined. The brazing alloy powder includes particles which include 55 mass % or more of at least one element selected from Ni, Fe, and Co. The alloy powder includes not less than 10% alloy particles having an amorphous phase. In addition, d90≦60 μm, where d90 is the grain diameter indicating 90% in an integral volume distribution curve according to a laser diffraction scattering method. The joined component includes a plurality of members joined with a brazing material including the brazing alloy powder.

COATING METHOD AND COMPONENT

A coating method for applying a cover layer to a base material is provided. A solder positioned on a surface of the base material is heated until it is molten, for joining the solder to the base material in a heat treatment. Oxygen is diffused in the molten lot for forming a diffusion layer in the cover layer. A component for a steam turbine is also provided. 1. A coating process for applying a covering layer onto a base material , comprising:heating a solder positioned on a surface of the base material in a heat treatment until the solder is molten to join the solder to the base material, wherein oxygen is diffused into the molten solder to form a diffusion layer in the covering layer.2. The coating process as claimed in claim 1 , wherein a titanium alloy is used as the base material.3. The coating process as claimed in claim 2 , wherein a titanium-based solder is used as the solder.4. The coating process as claimed claim 1 , wherein the solder is mixed with an additional base material which consists of the same material as the base material.5. The coating process as claimed in claim 4 , wherein the additional base material is present in a proportion by mass of from 30% to 70% in the solder.6. The coating process as claimed in claim 1 , wherein the solder is used in a pulverulent form.7. The coating process as claimed in claim 6 , wherein a ribbon in which the pulverulent solder has been applied to a support layer is used.8. A component for a steam turbine claim 6 , comprising:a base material; anda covering layer affixed to a surface of the base material, wherein the covering layer has a diffusion layer in which atomic oxygen is embedded in a metal lattice of the covering layer. This application claims priority to PCT Application No. PCT/EP2015/054481, having a filing date of Mar. 4, 2015, based off of German application No. DE 102014205413.3 having a filing date of Mar. 24, 2014, the entire contents of which are hereby incorporated by reference.The following ...

SOLDER COMPOSITION AND ELECTRONIC BOARD

A solder composition of the invention contains solder powders and a flux composition. The flux composition contains (A) a resin and (B) an activator. The (B) component contains (B1) an organic acid, and (B2) a pyridine compound represented by a formula (1) below. A chlorine concentration is 900 mass ppm or less, a bromine concentration is 900 mass ppm or less, an iodine concentration is 900 mass ppm or less and a total halogen concentration is 1500 mass ppm or less in the solder composition. 2. The solder composition according to claim 1 , whereina mass ratio (B1/B2) of a content of the (B1) component to a content of the (B2) component ranges from 1/9 to 9/1.3. The solder composition according to claim 1 , whereina mass ratio (B1/B2) of a content of the (B1) component to a content of the (B2) component ranges from 6/4 to 4/6.4. The solder composition according to claim 1 , whereinthe (B1) component is at least one organic acid selected from the group consisting of dicarboxylic acids having 3 to 22 carbon atoms and tricarboxylic acids having 3 to 22 carbon atoms.5. The solder composition according to claim 1 , whereinthe (B1) component is at least one organic acid selected from the group consisting of dicarboxylic acids having 4 to 7 carbon atoms and tricarboxylic acids having 6 to 9 carbon atoms.6. The solder composition according to claim 1 , whereinthe (B1) component is at least one organic acid selected from the group consisting of succinic acid, glutaric acid, adipic acid, pimelic acid, propane tricarboxylic acid, hexane tricarboxylic acid, cyclohexane tricarboxylic acid, and benzene tricarboxylic acid.7. The solder composition according to claim 1 , whereinthe (B1) component is at least one organic acid selected from the group consisting of succinic acid, propane tricarboxylic acid, and dimer acid.8. The solder composition according to claim 1 , whereinthe (B1) component is at least one organic acid selected from the group consisting of succinic acid, and ...

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHODS OF MANUFACTURE

A solder connection may be surrounded by a solder locking layer () and may be recessed in a hole () in that layer. The recess may be obtained by evaporating a vaporizable portion () of the solder connection. Other features are also provided. 1. A manufacturing method comprising: one or more first components each of which comprises solder and a material sublimatable or vaporizable when the solder is melted; and', 'a first layer comprising a top surface and one or more holes in the top surface, each hole containing at least a segment of a corresponding first component;, 'obtaining a first structure comprisingheating each first component to sublimate or vaporize at least part of each sublimatable or vaporizable material and provide an electrically conductive connection at a location of each first component;wherein in the heating operation at least part of each first component recedes down from the top surface to provide or increase a recess in each hole at the top surface.2. The method of wherein each hole is a through-hole.3. The method of wherein each hole's sidewall is a dielectric sidewall.4. The method of wherein the first layer is dielectric.5. The method of wherein the first layer is formed by molding.6. The method of further comprising:obtaining a second structure with one or more protruding conductive posts; andinserting each conductive post into a corresponding recess provided or increased in the heating operation, and forming a solder bond in each recess between the corresponding conductive post and the corresponding electrically conductive connection.7. The method of wherein before the heating operation claim 1 , at least a segment of each first component either:comprises of a solder core coated with the sublimatable or vaporizable material; orconsists of the sublimatable or vaporizable material.8. The method of wherein in obtaining the first structure claim 7 , the one or more first components are formed before the first layer.9. The method of wherein in ...

CONDUCTIVE PASTE AND ELECTRONIC DEVICE AND SOLAR CELL INCLUDING AN ELECTRODE FORMED USING THE CONDUCTIVE PASTE

A conductive paste includes a conductive powder, a metallic glass having a glass transition temperature of less than or equal to about 600° C. and a supercooled liquid region of greater than or equal to 0 K, and an organic vehicle, and an electronic device and a solar cell include an electrode formed using the conductive paste. 1. A conductive paste comprising:a conductive powder; the metallic glass having a glass transition temperature of less than or equal to about 600° C., and', 'the metallic glass having a supercooled liquid region of greater than or equal to about 0 K; and, 'a metallic glass,'}an organic vehicle.2. The conductive paste of claim 1 , wherein the glass transition temperature of the metallic glass ranges from about 10° C. to about 400° C.3. The conductive paste of claim 1 , wherein the supercooled liquid region of the metallic glass ranges from about 0 K to about 200 K.4. The conductive paste of claim 1 , wherein the metallic glass exists at least partly in an amorphous state.5. The conductive paste of claim 1 , wherein the metallic glass includes at least one of an aluminum-based metallic glass claim 1 , a cerium-based metallic glass claim 1 , a strontium-based metallic glass claim 1 , a gold-based metallic glass claim 1 , an ytterbium metallic glass claim 1 , a zinc-based metallic glass claim 1 , a calcium-based metallic glass claim 1 , a magnesium-based metallic glass claim 1 , a platinum-based metallic glass claim 1 , a palladium-based metallic glass claim 1 , and a zirconium-based metallic glass.6. The conductive paste of claim 5 , whereinthe at least one of the aluminum-based metallic glass, cerium-based metallic glass, strontium-based metallic glass, gold-based metallic glass, ytterbium metallic glass, zinc-based metallic glass, calcium-based metallic glass, magnesium-based metallic glass, platinum-based metallic glass, palladium-based metallic glass, and zirconium-based metallic glass is an alloy including at least one of aluminum, cerium, ...

Method and machine for forge welding of tubular articles and exothermic flux mixture and method of manufacturing an exothermic flux mixture

A method of forge welding includes placing at least two components for welding together, adjacent each other and with an exothermic flux mixture placed between the components. The exothermic flux mixture is heated to initiate an exothermic reaction and the faying surfaces of the two components are pressed together. The components being welded may be tubular, in particular pipes. Apparatus for the method of forge welding and exothermic flux mixtures for the method of forge welding are also provided.

Low-temperature Nanosolders

A nanosolder comprises a first metal nanoparticle core coated with a second metal shell, wherein the first metal has a higher surface energy and smaller atomic size than the second metal. For example, a bimetallic nanosolder can comprise a protective Ag shell “glued” around a reactive Cu nanoparticle. As an example, a 3-D epitaxial Cu-core and Ag-shell structure was generated from a mixture of copper and silver nanoparticles in toluene at temperatures as low as 150° C. 1. A nanosolder , comprising a first metal nanoparticle core coated with a second metal shell , wherein the first metal has a higher surface energy and smaller atomic size than the second metal.2. The nanosolder of claim 1 , wherein the first metal has a surface energy that is greater than 1.25 times the surface energy of the second metal.3. The nanosolder of claim 1 , wherein the first metal comprises copper and the second metal comprises silver.4. The nanosolder of claim 1 , further comprising at least one additional metal.5. A method for forming a nanosolder claim 1 , comprising:providing a mixture of first metal nanoparticles and second metal nanoparticles, wherein the first metal has a higher surface energy and smaller atomic size than the second metal; andheating the mixture to a sufficiently high temperature to cause the first and second metal nanoparticles to react to form a nanosolder comprising a nanoparticle core of the first metal coated with a shell of the second metal.6. The method of claim 5 , wherein the first metal comprises copper and the second metal comprises silver.7. The method of claim 6 , wherein the mixture is heated to between 150° C. and 300° C.8. The method of claim 5 , wherein the first and second metal nanoparticles are dispersed in a solution.9. The method of claim 8 , wherein the solution comprises toluene. This application is a continuation-in-part of U.S. application Ser. No. 14/660,707, filed Mar. 17, 2015, which claimed the benefit of U.S. Provisional Application No ...

Lead-free and antimony-free tin solder reliable at high temperatures

A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt. % of silver, 2.5 to 4 wt. % of bismuth, 0.3 to 0.8 wt. % of copper, 0.03 to 1 wt. % nickel, 0.005 to 1 wt. % germanium, and a balance of tin, together with any unavoidable impurities.

Nickel based alloy with high melting range suitable for brazing super austenitic steel

The invention discloses a nickel based brazing filler metal in form of an alloy containing or consisting of between 20 wt % and 35 wt % chromium, between 7 wt % and 15 wt % iron and between 2.5 wt % and 9 wt % silicon, between 0 wt % and 15 wt % molybdenum, unavoidable impurities and the balance being nickel. The solidus temperature of the brazing filler shall be between 1140° C. and 1240° C. The brazing filler metal is suitable for production of catalytic converters and heat exchangers. The invention also discloses a brazing method.

Interconnector for solar cells, and solar cell module

The purpose of the present invention is to provide an interconnector for solar cells, which reduces the stress acting on a solar cell and suppresses warping and cracking of the solar cell. An interconnector for solar cells of the present invention is characterized by comprising an electrically conductive wire part and a surface layer that is formed on at least one wide surface of the electrically conductive wire part. The interconnector for solar cells is also characterized in that the surface layer has a function of reducing the stress that is caused by the difference between the thermal expansion coefficient of the electrically conductive part and the thermal expansion coefficient of a solar cell, said stress being generated when the interconnector is joined to the solar cell.

Low Silver, Low Nickel Brazing Material

A homogenous brazing material essentially consisting of relatively low amounts of silver and nickel together with copper, zinc, and other constituents is provided. The brazing material has a working temperature exceeding 630° F. and is preferably between about 1250° F. and 1500° F. The brazing material preferably has about 30 percent by weight of silver, about 36 percent by weight of copper, about 32 percent by weight of zinc, and about 2 percent by weight of nickel. The addition of nickel in the above-specified amount improves resistance against interface corrosion in aqueous solutions, aids in the strength of the alloy, and provides improved wettability on ferrous and non-ferrous substrates. The brazing material may also include a flux, such as a core or a coating. 1. A brazing material consisting essentially ofless than approximately 35 percent by weight of silver;less than approximately 40 percent by weight of copper;more than 18 percent by weight of zinc; andfrom approximately 1.75 percent by weight to approximately 2.25 percent by weight of nickel.2. The material of having silver in an amount less than 32 percent by weight of silver.3. The material of having silver in an amount less than 31 percent by weight of silver.4. The material of having from approximately 29 percent by weight to approximately 31 percent by weight of silver.5. The material of having from approximately 31 percent by weight to approximately 40 percent by weight of zinc.6. The material of having copper in an amount less than 38 percent by weight.7. The material of having copper in an amount less than approximately 37 percent by weight.8. The material of having from approximately 35 percent by W eight to approximately 37 percent by weight of copper.9. The material of having a working temperature greater than approximately 630° F.10. The material of having a working temperature of between 1250° F. and 1450° F.11. The material of in the form of at least one of a strip claim 1 , a wire claim 1 ...

PLOW BLADE

The present disclosure provides a plow blade edge device for mounting to a moldboard of a plow comprising at least one adapter blade including a bottom edge having selectively carbide insert(s) along at least a portion of the bottom edge. The disclosure further provides for a method of brazing the carbide insert(s) in a cavity along at least a portion of the bottom edge. The device further includes at least one wear block selectively reversible to present the adapter blade at a first angle or a second angle. The at least one wear block can include a bottom edge having a carbide insert along at least a portion of the bottom edge. 1. A method for brazing solid carbide inserts , comprising:forming a channel into a steel section;applying brazing flux to said channel surface;inserting a first layer of braze into a base of said channel;inserting a first solid carbide insert over said first brazing layer;inserting at least a second layer of braze over said first solid carbide insert;inserting at least a second solid carbide insert over said at least second brazing layer;heating said first layer and said at least second layer of braze, and said first solid carbide insert and said at least second solid carbide insert at a temperature of at least 1500 degrees Fahrenheit; and,melting said first layer and said at least second layer of braze completely around said first solid carbide insert and around a majority of said at least second solid carbide insert for securing said first solid carbide insert and said at least second solid carbide insert within said channel.2. The method according to claim 1 , wherein said heating is induction coil heating at a temperature of at least 1700 degrees Fahrenheit.3. The method according to claim 1 , wherein a height of said at least second solid carbide insert is greater than a height of said first solid carbide insert.4. The method according to claim 1 , wherein a volume of said at least second solid carbide insert is greater than a volume ...

Bonding member and bonding method

A bonding member that includes a resin body defining an airtight interior, and a bonding material enclosed in the interior of the resin body. The bonding material is a mixed powder that includes a plurality of particles of a first metal powder and a plurality of particles of a second metal powder. The second metal powder reacts with the first metal powder when melted to thereby produce an intermetallic compound. The resin body has a melting point higher than a softening point of the mixed powder.

LASER METAL DEPOSITION WELDING OF AUTOMOTIVE PARTS

A part, such as an automotive part, is provided. The part includes at least two work pieces of steel which are joined together at a weld seam which includes at least one of nickel and iron and is substantially entirely free of silicate islands. The part also includes a painted, phosphated or electrocoated coating which is bonded with at least a portion of the substantially entirely silicate island free weld seam. 1. A part , comprising:at least two work pieces that are made of a steel material;said at least two work pieces being joined together by a weld seam;said weld seam including said steel material of said at least two work pieces and including an additional material which includes only nickel or only iron or only nickel and iron;said weld seam being free of silicate islands; anda painted, phosphated, or electrocoated coating bonded with at least a portion of said weld seam.2. The part as set forth in claim 1 , wherein said additional material of said weld seam includes only iron.3. The part as set forth in claim 1 , wherein said additional material of said weld seam includes only nickel.4. The part as set forth in claim 1 , wherein said additional material of said weld seam includes only nickel and iron.5. The part as set forth in wherein said coating is a painted coating.6. The part as set forth in wherein said coating is a phosphated coating.7. The part as set forth in wherein said coating is an electrocoated coating.8. The part as set forth in wherein said coating is applied to said weld seam in an as-welded condition.9. The part as set forth in wherein no material of said weld seam is removed from said weld seam through material abrasion or chemical processes prior to said coating being applied to said weld seam.10. The part as set forth in wherein said weld seam is joined through a laser metal deposition operation.11. A part formed according to a process which includes the steps of:placing at least two work pieces of steel into a joint;directing a stream ...

Porous aluminum complex and method of producing porous aluminum complex

A high quality porous aluminum body, which has excellent joint strength between the porous aluminum body and the aluminum bulk body, and a method of producing the porous aluminum complex, are provided. The porous aluminum complex includes: a porous aluminum body made of aluminum or aluminum alloy; and an aluminum bulk body made of aluminum or aluminum alloy, the porous aluminum body and the aluminum bulk body being joined each other. The junction between the porous aluminum body and the aluminum bulk body includes a Ti—Al compound. It is preferable that pillar-shaped protrusions projecting toward the outside are formed on outer surfaces of one of or both of the porous aluminum body and the aluminum bulk body, and the pillar-shaped protrusions include the junction.

NI-MN-CR-AL-TI-ALLOY, POWDER, METHOD AND COMPONENT

Provided is a soldering system based on nickel, manganese, chromium, aluminum and titanium, a fracture free alternative to the soldering of nickel or cobalt-based alloys is created. Disclosed is an alloy which comprises, as alloy elements, at least the following (in % by weight): manganese, in particular from 10%-16%, very particularly preferably from 12% to 15%, chromium, in particular from 3% to 10%, very particularly preferably from 5% to 8%, aluminum, in particular from 1% to 6%, very particularly preferably from 2% to 4%, titanium, in particular from 1% to 6%, very particularly preferably from 2% to 4%, nickel, in particular nickel as balance, very particularly preferably nickel-based. 1. An alloy which comprises , as alloy elements , at least the followingin % by weight:manganesefrom 10%-16%,chromiumfrom 3% to 10%,aluminumfrom 1% to 6%,titaniumfrom 1% to 6%, andnickel as a balance.2. The alloy as claimed in comprising 3% by weight of aluminum.3. The alloy as claimed in claim 1 , comprising 3% by weight of titanium.4. The alloy as claimed in claim 1 , comprising 15% by weight of manganese.5. The alloy as claimed in claim 1 , comprising 8% by weight of chromium.6. The alloy as claimed in claim 1 , wherein the alloy consists of nickel claim 1 , manganese claim 1 , chromium claim 1 , aluminum and titanium.7. The alloy as claimed inwhich comprises no boronand/or no germaniumand/or no galliumand/or no silicon.8. A powder or raw material comprising an alloy as claimed in claim 1 ,in particular consisting thereof.9. The powder as claimed in which comprises a physical mixture of a powder or of an alloy and a manganese-free nickel-based powder.10. A method of soldering a nickel-based component claim 1 , wherein an alloy as claimed in or a powder or raw material is used.11. The method as claimed in claim 10 , wherein the soldering temperature is in the range from 1453K to 1508K.12. The method as claimed in claim 10 , wherein the soldering operation is integrated into a ...

Method for automated superalloy laser cladding with 3d imaging weld path control

Superalloy components, such as service-degraded turbine blades and vanes, are clad by laser beam welding. The welding/cladding path, including cladding application profile, is determined by prior, preferably real time, non-contact 3D dimensional scanning of the component and comparison of the acquired dimensional scan data with specification dimensional data for the component. A welding path for cladding the scanned component to conform its dimensions to the specification dimensional data is determined The laser welding apparatus, preferably in cooperation with a cladding filler material distribution apparatus, executes the welding path to apply the desired cladding profile. In some embodiments a post-weld non-contact 3D dimensional scan of the welded component is performed and the post-weld scan dimensional data are compared with the specification dimensional data. Preferably the welding path and/or cladding profile application are modified in a feedback loop with the pre- and/or post-welding 3D dimensional scanning.

Brazing material, brazing material paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor module

To provide a brazing material for maintaining bonding strength between ceramic substrate and metal plate at a conventionally attainable level, while addition amount of In is reduced, and a brazing material paste using the same. A mixture powder provided by mixing alloy powder composed of Ag, In, and Cu, Ag powder, and active metal hydride powder, the mixture powder containing active metal hydride powder with a 10-to-25-μm equivalent circle average particle diameter by 0.5 to 5.0 mass %, the equivalent circle average particle diameters for the alloy powder, Ag powder, and active metal hydride powder having a relationship: alloy powder≧active metal hydride powder>Ag powder, and the powder mixture having a particle size distribution of d10 of 3 to 10 μm, d50 of 10 to 35 μm, and d90 of 30 to 50 μm, and in the frequency distribution, a peak of the distribution existing between d50 and d90.

Joint Manufacturing Method

Provided is a joint manufacturing method including: a step A of preparing a laminate in which two objects to be joined are temporarily adhered with a heat-joining sheet including a pre-sintering layer interposed between the two objects to be joined; a step B of increasing a temperature of the laminate from a temperature equal to or lower than a first temperature defined below to a second temperature; and a step C of holding the temperature of the laminate in a predetermined range after the step B, in which the laminate is pressurized during at least a part of the step B and at least a part of the step C. The first temperature is a temperature at which an organic component contained in the pre-sintering layer is decreased by 10% by weight when the pre-sintering layer is subjected to thermogravimetric measurement.

METHOD FOR PRODUCING A CONNECTION BETWEEN TWO METALLIC COMPONENTS

The invention relates to a method for producing a connection between a first metallic component () and a second metallic component (), wherein at least one of the two metallic components () is powder-metallurgically manufactured from a sintering material and the connection is produced by means of soldering in a connection area () formed between the two metallic components (). The surface (), which forms a part of the connection area (), of the metallic component ( or ) manufactured from the sintering material is compacted prior to the soldering. 123234239423. A method for producing a connection between a first metallic component () and a second metallic component () , wherein at least one of the two metallic components ( , ) is manufactured powder-metallurgically from a sintering material and the connection is produced by means of soldering in a connection area () formed between the two metallic components ( , ) , wherein the surface () , which forms a part of the connection area () , of the metallic component ( or ) manufactured from the sintering material is compacted prior to the soldering.29423. The method according to claim 1 , wherein the compaction of the surface () claim 1 , which forms a part of the connection area () claim 1 , of the component ( or ) manufactured powder-metallurgically from a sintering material is carried out to a density of at least 99.5% of the full material density.39423. The method according to claim 1 , wherein the compaction of the surface () claim 1 , which forms a part of the connection area () claim 1 , of the component ( or ) manufactured powder-metallurgically from a sintering material is carried out by means of blasting.4. The method according to claim 3 , wherein for blasting claim 3 , a powder of stainless steel manufactured by means of gas atomization is used as blasting medium.5. The method according to claim 1 , wherein a sintering powder of stainless steel is used as sintering material.6. The method according to claim 1 , ...

BRAZING METHOD FOR ASSEMBLING TWO ELEMENTS VIA AN INTERMETALLIC COMPOUND

A brazing method for assembling two elements includes selecting two brazing materials that can generate, when they are heated and melted, an intermetallic compound having a melting temperature which is higher than the melting temperature of each of the selected brazing materials taken individually, positioning the two selected brazing materials between the two elements, heating and melting the two selected brazing materials in order to substantially reach the melting temperature of each of the selected brazing materials so as to achieve the precipitation of an intermetallic compound having a melting temperature which is higher than the melting temperature of each of the selected brazing materials taken individually. 1. A brazing method for assembling two elements , said method comprising:selecting two brazing materials that can generate, when the two brazing materials are heated and melted, an intermetallic compound having a melting temperature which is higher than the melting temperature of each of the two selected brazing materials taken individually,positioning the two selected brazing materials between the two elements,heating and melting the two selected brazing materials to substantially reach the melting temperature of each of the two selected brazing materials so as to achieve the precipitation of an intermetallic compound having a melting temperature which is higher than the melting temperature of each of the two selected brazing materials taken individually.2. The brazing method according to claim 1 , wherein each of the two selected brazing materials is an alloy or a pure metal.3. The brazing method according to claim 1 , wherein one of the two selected brazing materials is Au80Sn20 alloy and the other of the two selected brazing materials is pure tin.4. The brazing method according to claim 1 , wherein each of the two selected brazing materials is in the form of:a strip, ora powder mixed with a high viscosity organic material.5. The brazing method ...

Metal cored welding wire, hardband alloy and method

Various embodiments of a metal cored wires, hardband alloys, and methods are disclosed. In one embodiment of the present invention, a hardbanding wire comprises from about from about 16% to about 30% by weight chromium; from about 4% to about 10% by weight nickel; from about 0.05% to about 0.8% by weight nitrogen; from about 1% to about 4% by weight manganese; from about 1% to about 4% by weight carbon from about 0.5% to about 5% by weight molybdenum; from about 0.25% to about 2% by weight silicon; and the remainder is iron including trace elements. The hardband alloy produced by the metal cored wire meets API magnetic permeability specifications and has improved metal to metal, adhesive wear resistance compared to conventional hardband alloys.

Flux composition and brazing sheet

This brazing flux composition for an aluminum alloy is characterized by containing [A] a flux component containing KAlF 4 and [B] a fluoride that does not contain K and that contains elements other than group 1 elements and group 2 elements: being in a particle form of single component of [B] the fluoride; and the added amount (C) (mass %) of [B] the fluoride with respect to [A] the flux component and the average particle size (d) (μm) satisfying formula (1), 0.83 C −0.19 d <43  (1).

Manufacturing method of copper bonded part

A manufacturing method of a copper bonded part in which a first copper member and a second copper member are bonded together. The first copper member and the second copper member are made of copper or a copper alloy, and at least one of the first copper member and the second copper member includes a copper porous body made of copper or a copper alloy. This manufacturing method has a bonding material disposing step S01 of disposing a bonding material between the first copper member and the second copper member, and a reduction sintering step S02 of heating and holding the first copper member, the second copper member, and the bonding material in a reducing atmosphere in a range of 600° C. or higher and 1,050° C. or lower. The bonding material contains a copper oxide or a mixture of metallic copper and the copper oxide.

METAL PARTICLE AND METHOD FOR PRODUCING THE SAME, COVERED METAL PARTICLE, AND METAL POWDER

A metal particle having a particle diameter of 10 μm or more and 1000 μm or less and includes Cu and trace elements and a total mass content of P and S, among other trace elements, is 3 ppm or more and 30 ppm or less. A method for producing a metal particle including producing a molten metal material by melting a metal material in a crucible, wherein Cu as determined in GDMS analysis is over 99.995% and a total of P and S is 3 ppm or more and 30 ppm or less; applying a pressure of 0.05 MPa or more and 1.0 MPa or less to drip the molten metal material through an orifice, thereby producing a molten metal droplet; and rapidly solidifying the molten metal droplet using an inert gas whose oxygen concentration is 1000 ppm or less. 16-. (canceled)7. A metal particle having a particle diameter of 10 μm or more and 1000 μm or less and including Cu and trace elements , wherein a Cu mass content as determined in GDMS analysis is over 99.995% and a total mass content of P and S , among other trace elements , is 3 ppm or more and 30 ppm or less.8. A covered metal particle claim 7 , wherein a surface of the metal particle according to is covered with an Ni layer.9. The covered metal particle according to claim 8 , wherein a surface of the Ni layer is covered with a solder layer.10. A metal powder comprising metal particles according to .11. A metal powder comprising covered metal particles according to .12. A metal powder comprising covered metal particles according to .13. A method for producing a metal particle claim 9 , the method comprising:a step a of producing a molten metal material by melting a metal material in a crucible, wherein a Cu mass content as determined in GDMS analysis of the metal material is over 99.995% and a total mass content of P and S of the metal material is 3 ppm or more and 30 ppm or less;a step b of applying a pressure of 0.05 MPa or more and 1.0 MPa or less to an inside of the crucible to drip the molten metal material through an orifice whose ...

WEAR RESISTANT COATING

A composite material comprising a plurality of round particles bound together by a binding material. Each of the plurality of round particles includes a wear resistant element, an intermediate coating on the wear resistant element, and a round outer layer encapsulating the intermediate coating and the wear resistant element. The intermediate coating is metallurgically bonded to the wear resistant element, and is metallurgically bondable to the binding material. 1. A composite material , comprising: a wear resistant element;', 'an intermediate coating on the wear resistant element; and', 'a round outer layer encapsulating the intermediate coating and the wear resistant element;, 'a plurality of round particles bound together by a binding material, each of the plurality of round particles comprisingwherein the intermediate coating is metallurgically bonded to the wear resistant element, and is metallurgically bondable to the binding material.2. The composite material of claim 1 , wherein the composite material is configured to form a brazing rod.3. The composite material of claim 2 , wherein the composite material is heated to form the brazing rod.4. The composite material of claim 3 , wherein the binding material is melted to form a monolithic matrix of metallic binding material.5. A coating on a substrate claim 1 , wherein the coating comprises the composite material of .6. The composite material of claim 1 , wherein the round outer layer is metallurgically bonded to the intermediate coating.7. The composite material of claim 1 , wherein the round outer layer is penetrated by the binding material.8. The composite material of claim 7 , wherein the binding material is metallurgically bonded to at least one of an inner surface and an outer surface of the round outer layer.9. The composite material of claim 7 , wherein the binding material is metallurgically bonded to the intermediate layer.10. The composite material of claim 1 , wherein the outer layer comprises a ...

BRAZE MATERIALS AND EARTH-BORING TOOLS COMPRISING BRAZE MATERIALS

A method includes disposing a braze material adjacent a first body and a second body; heating the braze material and forming a transient liquid phase; and transforming the transient liquid phase to a solid phase and forming a bond between the first body and the second body. The braze material includes copper, silver, zinc, magnesium, and at least one material selected from the group consisting of nickel, tin, cobalt, iron, phosphorous, indium, lead, antimony, cadmium, and bismuth. 1. A braze material comprising:copper;from about 50% to about 70% silver by weight;at least one element selected from the group consisting of nickel and titanium; andat least one element selected from the group consisting of indium, tin, zinc zinc, and magnesium.2. The braze material of claim 1 , wherein the braze material comprises at least two elements selected from the group consisting of indium claim 1 , tin claim 1 , zinc and magnesium.3. The braze material of claim 1 , wherein the braze material comprises zinc.4. The braze material of claim 1 , wherein the braze material comprises metallic particles having an average particle size in a range from about 1 μm to about 15 μm.5. The braze material of claim 1 , further comprising an organic binder.6. The braze material of claim 1 , wherein the braze material comprises a first plurality of metallic particles and a second plurality of metallic particles interspersed with the first plurality of metallic particles.7. The braze material of claim 6 , wherein the particles of the first plurality comprise a first material having a first composition and the particles of the second plurality comprise a second material having a second composition different from the first composition.8. The braze material of claim 1 , wherein the braze material comprises at least one intermetallic compound.9. The braze material of claim 1 , further comprising nanoparticles comprising at least one material selected from the group consisting of carbides claim 1 , ...

SOLDER COMPOSITION, ELECTRONIC BOARD, AND BONDING METHOD

A solder composition contains: flux composition containing (A) rosin-based resin, (B) activator, and (C) solvent; and (D): solder powder with a melting point of 200 to 250 degrees C. The component (A) contains (A1) rosin-based resin with a softening point of 120 degrees C. or more and an acid number of 220 mgKOH/g or more and (A2) rosin-based resin with a softening point of 100 degrees C. or less and an acid number of 20 mgKOH/g or less. The component (C) contains (C1) hexanediol solvent with a melting point of 40 degrees C. or more and a boiling point of 220 degrees C. or less and (C2) solvent with a viscosity of 10 mPa·s or less at 20 degrees C. and a boiling point of 270 degrees C. or more. A content of the component (A1) ranges from 15 to 25 mass % with respect to the flux composition (100 mass %). 1. A solder composition comprising:a flux composition comprising a component (A) in a form of a rosin-based resin, a component (B) in a form of an activator, and a component (C) in a form of a solvent; anda component (D) in a form of a solder powder with a melting point in a range from 200 degrees C. to 250 degrees C., whereinthe component (A) comprises a component (A1) in a form of a rosin-based resin with a softening point of 120 degrees C. or more and an acid number of 220 mgKOH/g or more and a component (A2) in a form of a rosin-based resin with a softening point of 100 degrees C. or less and an acid number of 20 mgKOH/g or less,the component (C) comprises a component (C1) in a form of a hexanediol solvent with a melting point of 40 degrees C. or more and a boiling point of 220 degrees C. or less and a component (C2) in a form of a solvent with a viscosity of 10 mPa·s or less at 20 degrees C. and a boiling point of 270 degrees C. or more, anda content of the component (A1) is in a range from 15 mass % to 25 mass % with respect to the flux composition being 100 mass %.2. The solder composition according to claim 1 , whereinthe softening point of the component (A1) ...

Planet carrier salvage process

A remanufactured planet carrier is disclosed having a first plate and a second plate spaced apart from and oriented generally parallel to the first plate. Supports join and support the first and second plates. The remanufactured planet carrier further has a plurality of first pin bores in the first plate and a plurality of second pin bores in the second plate. The first pin bores are parallel and generally aligned with the second pin bores. A cylindrical member extends from a central axis of the second plate away from the first plate with a shaft bore formed within the cylindrical member. The first and second pin bores and the shaft bore each have a surface layer with a hardness of at least about 180 BHN and a strength of at least about 500 MPa.

COST-EFFECTIVE LEAD-FREE SOLDER ALLOY FOR ELECTRONIC APPLICATIONS

A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be present in an amount from about 0.5% to 0.9% by weight of the solder. The bismuth may be present in an amount from about 1.0% to about 3.5% by weight of the solder. The cobalt may be present in an amount from about 0.02% to about 0.08% by weight of the solder. Where gallium is used in lieu of cobalt, the gallium may be present in an amount from about 0.2% to about 0.8% by weight of the solder. The antimony may be present in an amount between about 0.0% to about 0.09% by weight of the solder. The balance of the solder is tin. 120.-. (canceled)21. A lead-free , silver-free solder alloy comprising:0.5 to 0.9 wt % copper;1.0 to 3.5 wt % bismuth;0.02 to 0.08 wt % cobalt;0.02 to 0.09 wt % antimony;0.001 to 0.01 wt % germanium and/or 0.01 to 0.2 wt % nickel; andbalance tin, together with any unavoidable impurities.22. The lead-free claim 21 , silver-free solder alloy of consisting of:0.5 to 0.9 wt % copper;1.0 to 3.5 wt % bismuth;0.02 to 0.08 wt % cobalt;0.02 to 0.09 wt % antimony;0.001 to 0.01 wt % germanium; andbalance tin, together with any unavoidable impurities.23. The lead-free claim 21 , silver-free solder alloy of consisting of:0.5 to 0.9 wt % copper;1.0 to 3.5 wt % bismuth;0.02 to 0.08 wt % cobalt;0.02 to 0.09 wt % antimony;0.01 to 0.2 wt % nickel; andbalance tin, together with any unavoidable impurities.24. The lead-free claim 21 , silver-free solder alloy of consisting of:0.5 to 0.9 wt % copper;1.0 to 3.5 wt % bismuth;0.02 to 0.08 wt % cobalt;0.02 to 0.09 wt % antimony;0.001 to 0.01 wt % germanium;0.01 to 0.2 wt % nickel; andbalance tin, together with any unavoidable impurities.25. The lead-free claim 21 , silver-free alloy of claim 21 , wherein:the copper is present at a concentration of about 0.7 wt %;the bismuth is present at a ...

Solder Powder

The invention relates to a solder powder for connecting components made of aluminium or aluminium alloys by brazing, in particular a brazing powder for connecting heat exchanger components. The solder powder consists of powder particles on an aluminium-silicon base having a weight fraction of more than 12% by weight of silicon, wherein the powder particles have been produced by a rapid solidification and contain uniformly distributed silicon primary crystal precipitations in the eutectic aluminium-silicon alloy structure. Coating with such a solder powder leads to a uniform distribution of the silicon on the surface of the component coated with solder powder and thus to the same good soldering results. 116-. (canceled)17. Solder powder for connection of components made of aluminum or aluminum alloys by brazing consisting of:powder particles on an aluminum-silicon base with a weight fraction of more than 12 wt. % silicon,{'sup': 3', '7, 'wherein the powder particles are produced by rapid solidification of a melt on an aluminum-silicon base at high cooldown rates, in particular of 10to 10K/s,'}the powder particles have a maximum particle size of 80 μm,the powder particles contain evenly distributed silicon primary crystal segregations in the eutectic aluminum-silicon alloy structure andthe powder particles comprise no coarse silicon primary crystal segregations in the structure.18. Solder powder according to claim 17 , wherein the particle size distribution shows particles with a particle size of 5 to 30 μm claim 17 , wherein the mean particle size is preferably between 10 and 20 μm.191. Solder powder of claim wherein the powder particles are produced by atomization of a melt on an aluminum-silicon base claim 17 , and the desired particle distribution was possibly obtained by subsequent screening processes.201. Solder powder of claim wherein the powder particles on an aluminum-silicon base contain 12 to 40 wt. % silicon claim 17 , preferably 18 to 36 wt. % silicon.211 ...

EARTH-BORING TOOLS HAVING PARTICLE-MATRIX COMPOSITE BODIES AND METHODS FOR WELDING PARTICLE-MATRIX COMPOSITE BODIES

Methods for welding a particle-matrix composite body to another body and repairing particle-matrix composite bodies are disclosed. Additionally, earth-boring tools having a joint that includes an overlapping root portion and a weld groove having a face portion with a first bevel portion and a second bevel portion are disclosed. In some embodiments, a particle-matrix bit body of an earth-boring tool may be repaired by removing a damaged portion, heating the particle-matrix composite bit body, and forming a built-up metallic structure thereon. In other embodiments, a particle-matrix composite body may be welded to a metallic body by forming a joint, heating the particle-matrix composite body, melting a metallic filler material forming a weld bead and cooling the welded particle-matrix composite body, metallic filler material and metallic body at a controlled rate. 1. A method of joining a particle-matrix composite body of an earth-boring tool to a metallic body , the method comprising: forming a first bevel portion and a second bevel portion in a face portion of a weld groove; and', 'forming an overlapping interface at least proximate a root portion of the weld groove;, 'forming a joint between a particle-matrix composite body of the earth-boring tool and a metallic body of the earth-boring tool, comprisingheating a volume of the particle-matrix composite body within the weld groove to an elevated first temperature below the melting temperature of the matrix material of the particle-matrix composite body;heating at least a portion of the volume of the particle-matrix composite body within the weld groove with a welding torch to a second temperature greater than the melting temperature of the matrix material of the particle-matrix composite body;melting a metallic filler material;forming a weld bead to weld the metallic filler to the particle-matrix composite body and to the metallic body at the joint;providing the welded particle-matrix composite body, metallic filler ...

Bimetallic Joining with Powdered Metal Fillers

A method of attaching a first metal object to a second metal object is presented. The first metal object and the second metal object are dissimilar materials. The first metal object comprises an upper surface and a lower surface. The method comprises: positioning the first metal object in intimate contact with the second metal object such that the second metal object is in contact with the lower surface of the first metal object; identifying at least one attachment location on the upper surface of the first metal object where the first metal object is in intimate contact with the second metal object; adding a powdered metal on the upper surface of the first metal object at the at least one attachment location; and firing a heat source at the powdered metal to melt the powdered metal and drive the melted powdered metal through the first metal object and into the second metal object. 1. A method of attaching a first metal object to a second metal object , wherein the first metal object and the second metal object are dissimilar materials and the first metal object comprises an upper surface and a lower surface , the method comprising:positioning the first metal object in intimate contact with the second metal object such that the second metal object is in contact with the lower surface of the first metal object;identifying at least one attachment location on the upper surface of the first metal object where the first metal object is in intimate contact with the second metal object;adding a powdered metal on the upper surface of the first metal object at the at least one attachment location; andfiring a heat source at the powdered metal to melt the powdered metal and drive the melted powdered metal through the first metal object and into the second metal object.2. The method of in which the first metal object has a higher reflectivity than the second metal object.3. The method of in which the material of the first metal object is copper.4. The method of in which the ...

METHODS OF MAKING AN ELECTRICAL CONNECTION, AND OF MAKING A RECEPTACLE FOR RECEIVING AN ELECTRICAL DEVICE

A method of making an electrical connection includes soldering using channels in a receptacle to direct hot air (or another hot gas) to effect soldering where the electrical connection is to be made. The connection may be made between device electrical contacts of an electrical device, and other contacts, such as receptacle contacts of the receptacle. The connection may be a blind connection, one in which the connected ends of the contacts are hidden or unable to be directly physically accessed, when the connection is made. The electrical connection may be made between device contacts of an electrical device that is inserted into the receptacle, and receptacle electrical contacts that are part of the receptacle. The channels for directing the hot gas to where the soldering occurs may be parts of the receptacle, for example being produced during additive manufacture of the receptacle. 1. A method of making an electrical connection , the method comprising:inserting an electrical device into a receptacle;melting solder where one or more device electrical contacts of the device and one or more receptacle electrical contacts of the receptacle meet, wherein the melting includes directing heated gas through one or more channels in the receptacle to melt the solder; andmaking a solid electrical connection between the one or more device electrical contacts and the one or more receptacle electrical contacts by allowing the solder to cool.2. The method of claim 1 , wherein the making the solid electrical connection includes making a blind electrical connection that is not externally accessible for manually access to the electrical connection.3. The method of claim 1 , wherein the making the solid electrical connection includes making the electrical connection along a bottom of the receptacle claim 1 , opposite from where the device is inserted into the receptacle.4. The method of claim 1 , wherein the receptacle is additively manufactured claim 1 , with the one or more ...

BALL GRID ARRAY (BGA) APPARATUS AND METHODS

Embodiments herein may relate to an apparatus with a ball grid array (BGA) package that includes a plurality of solder balls of an off-eutectic material. In embodiments, the respective solder balls of the plurality of solder balls may form solder joints between a substrate of the BGA and a second substrate. In some embodiments the joints may be less than approximately micrometers from one another. Other embodiments may be described and/or claimed. 1. An apparatus comprising:a first substrate; anda ball grid array (BGA) package that includes a second substrate soldered to the first substrate via a plurality of solder balls comprising an off-eutectic material such that respective solder balls of the plurality of solder balls form respective joints between the first substrate and the second substrate, wherein a first joint of the respective joints is less than 0.6 micrometers from a second joint of the respective joints.2. The apparatus of claim 1 , wherein the off-eutectic material includes tin (Sn) and bismuth (Bi).3. The apparatus of claim 1 , wherein the first joint is an interior joint and a third joint of the respective joints is an edge joint claim 1 , and the first joint and third joint have an approximately equal height as measured from the first substrate to the second substrate.4. The apparatus of claim 3 , wherein the height of the first joint is greater than or equal to a height of one of the plurality of solder balls prior to a soldering process.5. The apparatus of claim 1 , wherein the off-eutectic material has a solidus temperature and a liquidus temperature that is higher than the solidus temperature.6. The apparatus of claim 5 , wherein the solidus temperature is a temperature at which the off-eutectic material transitions from a liquid to a solid while cooling.7. The apparatus of claim 6 , wherein the solidus temperature is between approximately 135 degrees Celsius and approximately 145 degrees Celsius.8. The apparatus of claim 5 , wherein the ...

BRAZE FOIL QUANTITY CONTROL METHOD

A method of making a brazing foil includes flattening the brazing foil to a minimum thickness. Calculating a quantity of material to remove from the brazing foil. Cutting a plurality of perforations into the brazing foil to remove the quantity of material. 1. A brazing foil comprising:a first surface;a second surface opposite the first surface;a plurality of perforations extending through the first surface and through the second surface.2. The brazing foil of claim 1 , wherein the brazing foil is made of a titanium alloy.3. The brazing foil of claim 1 , wherein the brazing foil is made of a nickel-based alloy.4. The brazing foil of claim 1 , further comprising a thickness extending from the first surface to the second surface claim 1 , wherein the thickness is less than 0.07620 millimeters (0.0030 inches).5. The brazing foil of claim 1 , wherein the plurality of perforations are circular.6. The brazing foil of claim 1 , wherein the plurality of perforations are cross-shaped.7. The brazing foil of claim 1 , wherein the plurality of perforations comprise a first perforation comprising a first shape claim 1 , and a second perforation comprising a second shape claim 1 , wherein the first shape is different from the second shape.8. An assembly comprising:a first sheet, wherein the first sheet has a first surface opposite a second surface;a second sheet, wherein the second sheet has a first surface opposite a second surface;a brazing foil, wherein the brazing foil has a first surface opposite a second surface, and wherein the brazing foil has a plurality of perforations extending from the first surface of the brazing foil through the second surface of the brazing foil.9. The assembly of claim 8 , wherein the brazing foil is between and contiguous the second surface of the first sheet and the first surface of the second sheet.10. The assembly of claim 8 , wherein the brazing foil has a thickness extending from the first surface of the first sheet to the second surface of ...

Method for manufacturing a molding element by fritting with a completely planar unfritted portion, and corresponding molding element

The invention relates to a method of manufacturing a molding element for a tire mold. The molding element comprises a sintered part and a non-sintered part attached to the sintered part. The sintered part comprises a shell and a core internal to the shell and formed as one piece with the said shell. The core comprises a meshed structure comprising a plurality of cavities. The method of manufacture comprises a step of manufacturing the sintered part of the molding element from a metallic powder deposited on a flat surface of a support plate and fused layer by layer, the sintered part being attached to the support plate by fused metallic powder. The method also comprises a step of machining the support plate to form the non-sintered part of the molding element.

Preform structure for soldering a semiconductor chip arrangement, a method for forming a preform structure for a semiconductor chip arrangement, and a method for soldering a semiconductor chip arrangement

A preform structure for soldering a semiconductor chip arrangement includes a carbon fiber composite sheet and a solder layer formed over the carbon fiber composite sheet.

SOLDER ALLOY, SOLDER POWER, AND SOLDER JOINT

A solder alloy is provided which suppresses the change in a solder paste over time, decreases the temperature difference between the liquidus-line temperature and the solidus temperature, and exhibits a high reliability. The solder alloy has an alloy constitution composed of: 10 ppm by mass or more and less than 25 ppm by mass of As; at least one selected from the group consisting of 0 ppm by mass to 10000 ppm by mass of Bi and 0 ppm by mass to 5100 ppm by mass of Pb; more than 0 ppm by mass and no more than 3000 ppm by mass of Sb; and a remaining amount of Sn; and satisfies both the formula (1) and the formula (2). 1. A solder alloy including an alloy constitution comprising: 10 ppm by mass or more and less than 25 ppm by mass of As; at least one selected from the group consisting of 0 ppm by mass to 10000 ppm by mass of Bi and 0 ppm by mass to 5100 ppm by mass of Pb; more than 0 ppm by mass and no more than 3000 ppm by mass of Sb; and a remaining amount of Sn , wherein both a formula (1) and a formula (2) are satisfied:{'br': None, '300≤3As+Sb+Bi+Pb\u2003\u2003(1)'}{'br': None, '0.1≤{(3As+Sb)/(Bi+Pb)}×100≤200\u2003\u2003(2)'}in the formula (1) and the formula (2), As, Sb, Bi, and Pb each represents an amount thereof (ppm by mass) in the alloy constitution.2. A solder alloy including an alloy constitution comprising: 10 ppm by mass or more and less than 25 ppm by mass of As; at least one selected from the group consisting of more than 0 ppm by mass and no more than 10000 ppm by mass of Bi and more than 0 ppm by mass and no more than 5100 ppm by mass of Pb; more than 0 ppm by mass and no more than 3000 ppm by mass of Sb; and a remaining amount of Sn , wherein both a formula (1) and a formula (2) are satisfied:{'br': None, '300≤3As+Sb+Bi+Pb\u2003\u2003(1)'}{'br': None, '0.1≤{(3As+Sb)/(Bi+Pb)}×100≤200\u2003\u2003(2)'}in the formula (1) and the formula (2), As, Sb, Bi, and Pb each represents an amount thereof (ppm by mass) in the alloy constitution.3. A solder alloy ...

FLUX FOR BRAZING

The invention concerns a flux for brazing, a process for brazing metal parts employing said flux, a flux composition containing said flux, aluminum parts coated with said flux or said flux composition, a process for brazing and a brazed metal object obtainable by said brazing process. The flux is high in KAlFand low in KAlF. 1. A flux comprising a fundamental flux , wherein the fundamental flux comprises from 80 mol % to 100 mol % KAlF , the content of KAlFin the flux is equal to or lower than 2 mol % including 0 mol % , the content of free KF in the flux is lower than 0.2% by weight including 0% by weight , and wherein the flux further comprises from 0.1 to 20 weight % relative to the total weight of the flux of at least one additive salt , wherein the at least one additive salt comprises at least one anion selected from the group consisting of F , CO , O , nitrate , phosphate , borate , metaborate and oxalate , and at least one cation selected from the group consisting of earth alkali metal cations.2. The flux according to wherein the at least one additive salt is selected from the group consisting of CaF claim 1 , BeF claim 1 , MgF claim 1 , BaF claim 1 , SrF claim 1 , CaO claim 1 , BeO claim 1 , MgO claim 1 , BaO claim 1 , SrO claim 1 , CaCO claim 1 , BeCO claim 1 , MgCO claim 1 , BaCO claim 1 , and SrCO.3. The flux according to wherein the at least one additive salt is selected from the group consisting of CaF claim 2 , BeF claim 2 , MgF claim 2 , BaFand SrF.4. The flux according to claim 1 , wherein the fundamental flux comprises one or more components selected from the group consisting of KAlF claim 1 , KAlF claim 1 , potassium fluorozincates claim 1 , cesium fluoroaluminates claim 1 , potassium fluorostannates and cesium fluorostannates claim 1 , and hydrates wherein the one or more components are comprised in the fundamental flux from 0 to 20 mol % claim 1 , adding up with the content of KAlFto 100 mol %.5. The flux according to claim 1 , wherein the flux ...

Hybrid bonding structures, semiconductor devices having the same, and methods of manufacturing the semiconductor devices

Provided are a hybrid bonding structure, a solder paste composition, a semiconductor device, and a method of manufacturing the semiconductor device. The hybrid bonding structure includes a solder ball and a solder paste bonded to the solder ball. The solder paste includes a transient liquid phase. The transient liquid phase includes a core and a shell on a surface of the core. A melting point of the shell may be lower than a melting point of the core. The core and the shell are configured to form an intermetallic compound in response to the transient liquid phase at least partially being at a temperature that is within a temperature range of about 20° C. to about 190° C.

Orientation of interfacing projections

A method of joining a first component to a second component, the method comprising preparing the first component by forming an array of elongate projections on a bond surface of the component, each projection having a centreline, a tip, and a base. The centreline at the tip of each projection is oriented at an angle with respect to the normal to the bond surface at its base, and the angular orientation of the tip centrelines varies across the array of projections. Next, the first component and a flexible layer are brought together so as to embed the projections in the flexible layer before hardening the flexible layer to form the second component. Also, a joint so formed.

Lead-Free Solder Alloy

A lead-free solder alloy capable of forming solder joints in which electromigration and an increase in resistance during electric conduction at a high current density are suppressed has an alloy composition consisting essentially of 1.0-13.0 mass % of In, 0.1-4.0 mass % of Ag, 0.3-1.0 mass % of Cu, a remainder of Sn. The solder alloy has excellent tensile properties even at a high temperature exceeding 100° C. and can be used not only for CPUs but also for power semiconductors. 1. A lead-free solder alloy having an alloy composition consisting essentially of , in mass percent , In: 1.0-2.0% , Ag: 0.1-0.3% , Cu: 0.3-1.0% , and a remainder of Sn.2. A lead-free solder alloy as set forth in wherein the Cu is 0.5-1.0% claim 1 , in mass percent.3. A lead-free solder alloy as set forth in wherein the Cu is 0.5-0.7% claim 1 , in mass percent.4. A lead-free solder alloy as set forth in wherein the Cu is 0.3-0.5% claim 1 , in mass percent.5. A solder joint made from a lead-free solder alloy as set forth in .6. A solder joint as set forth in claim 5 , wherein when the lead-free solder alloy is used as solder joint under an energizing condition at a current density of 0.12 mA/μm2 in air at 165 degrees C. claim 5 , the percent increase in a resistance value of the solder joint from a resistance value before the energization to a resistance value when 2500 hours have elapsed after the start of the energization is not more than 30% and a difference between the percent increase in a resistance value and a percent increase in a resistance value when 500 hours have elapsed from the start of the energization is not more than 5%.7. A method for suppressing electromigration of a solder joint during electrical conduction comprising forming a solder joint using a lead-free solder alloy as set forth in .8. A solder joint made from a lead-free solder alloy as set forth in claim 1 , wherein the solder joint is included in power conversion equipment for solar power generation.9. A solder ...

ADDITIVE MANUFACTURING APPARATUS WITH A CHAMBER AND A REMOVABLY-MOUNTABLE OPTICAL MODULE; METHOD OF PREPARING A LASER PROCESSING APPARATUS WITH SUCH REMOVABLY-MOUNTABLE OPTICAL MODULE

An additive manufacturing apparatus comprises a processing chamber defining a window for receiving a laser beam and an optical module. The optical module is removably-mountable to the processing chamber for delivering the laser beam through the window. The optical module contains optical components for focusing and steering the laser beam and a controlled atmosphere can be maintained within the module. 1. An additive manufacturing apparatus comprising a processing chamber and an optical module for delivering a laser beam to a planar build surface in the processing chamber , the optical module comprising a housing containing optical components for focusing and steering the laser beam , a sensor for monitoring a parameter within the optical module indicative of a performance of the optical module and an external communication port for allowing communication between the sensor and a computer or control nodule.2. An additive manufacturing apparatus according to claim 1 , wherein the sensor comprises a sensor selected from the group of: a thermometer or thermosensor for monitoring a temperature within the module claim 1 , an atmospheric sensor for monitoring atmospheric conditions within the module and a humidity sensor.3. An additive manufacturing apparatus according to claim 1 , wherein the sensor comprises a beam monitor for monitoring a laser beam parameter.4. An additive manufacturing apparatus according to claim 3 , wherein the laser beam parameter is selected from the group of: a beam profile claim 3 , a beam power claim 3 , an intensity distribution of the laser beam and a beam shape.5. An additive manufacturing apparatus comprising a processing chamber and an optical module for delivering a laser beam to a planar build surface in the processing chamber claim 3 , the optical module comprising a housing containing optical components for focusing and steering the laser beam claim 3 , a sensor for monitoring parameters of a processing operation performed by the ...

Method for Forming a Connection between Two Connection Partners and Method for Monitoring a Connection Process

A method for forming a connection between two connection partners includes: forming a pre-connection layer on a first surface of a first connection partner, the pre-connection layer including a certain amount of liquid; performing a pre-connection process, thereby removing liquid from the pre-connection layer; performing photometric measurements while performing the pre-connection process, wherein performing the photometric measurements includes determining at least one photometric parameter of the pre-connection layer, wherein the at least one photometric parameter changes depending on the fluid content of the pre-connection layer; and constantly evaluating the at least one photometric parameter, wherein the pre-connection process is terminated when the at least one photometric parameter is detected to be within a desired range.

Dual-walled components for a gas turbine engine

An assembly for a dual-walled component of a gas turbine engine and methods of forming and repairing a dual-walled component. The assembly includes a cold section part having an outer surface that defines a plurality of impingement apertures, a hot section part including a pre-sintered preform, the hot section part positioned over the outer surface of the cold section part, and a plurality of support structures including the pre-sintered preform, the plurality of support structures positioned between the hot section part and the cold section part, the plurality of support structures separating the hot section part from the cold section part to define at least one cooling channel therebetween.

STABLE UNDERCOOLED METALLIC PARTICLES FOR ENGINEERING AT AMBIENT CONDITIONS

Undercooled liquid metallic core-shell particles, whose core is stable against solidification at ambient conditions, i.e. under near ambient temperature and pressure conditions, are used to join or repair metallic non-particulate components. The undercooled-shell particles in the form of nano-size or micro-size particles comprise an undercooled stable liquid metallic core encapsulated inside an outer shell, which can comprise an oxide or other stabilizer shell typically formed in-situ on the undercooled liquid metallic core. The shell is ruptured to release the liquid phase core material to join or repair a component(s). 1. A liquid metallic core-shell particle comprising:an undercooled liquid metallic core comprising a metal or alloy, the undercooled liquid metallic core having a melting point in the range of 62° C. to 250° C.; andan outer shell on the undercooled liquid metallic core, the outer shell comprising an inorganic or organic adlayer, wherein the inorganic or organic adlayer comprises acetate, phosphate, or a combination thereof;wherein the undercooled liquid metallic core is a liquid when the liquid metallic core-shell particle has a temperature that is less than the melting point of the liquid metal or alloy.2. The particle of claim 1 , wherein the undercooled liquid metallic core is a liquid when the liquid metallic core-shell particle has a temperature that is between room temperature and less than the melting point of the liquid metal or alloy.3. The particle of claim 1 , wherein the liquid metallic core-shell particle has a temperature that is less than the melting point of the liquid metal or alloy claim 1 , and wherein the undercooled liquid metallic core is a liquid.4. The particle of claim 1 , wherein the liquid metallic core-shell particle has a temperature that is greater than room temperature and less than the melting point of the liquid metal or alloy claim 1 , and wherein the undercooled liquid metallic core is a liquid.5. The particle of ...

BONDING MATERIAL

A bonding material disclosed in this specification contains high melting point metal particles, low melting point metal particles, and a thermosetting flux resin. A mass proportion of the high melting point metal particles with respect to a total mass of the high melting point metal particles and the low melting point metal particles is 55% to 75%. 1. A bonding material comprising:high melting point metal particles;low melting point metal particles whose melting point is lower than a melting point of the high melting point metal particles; anda thermosetting flux resinwherein a mass proportion of the high melting point metal particles with respect to a total mass of the high melting point metal particles and the low melting point metal particles is 55% to 75%.2. The bonding material according to claim 1 , wherein the mass proportion of the high melting point metal particles is 65% to 75%.3. The bonding material according to claim 1 , wherein the high melting point metal particles are any of Cu claim 1 , a Cu alloy claim 1 , Al claim 1 , Ag claim 1 , and Au claim 1 , and have a particle size of 5 μm to 30 μm.4. The bonding material according to claim 1 , wherein the low melting point metal particles are an Sn alloy and have a particle size of 20 μm to 40 μm.5. The bonding material according to claim 1 , wherein surfaces of the high melting point metal particles are plated with Sn or an Sn alloy.6. The bonding material according to claim 1 , wherein the flux resin includes an epoxy resin. The disclosure of Japanese Patent Application No. 2017-181702 filed on Sep. 21, 2017 including the specification, drawings and abstract is incorporated herein by reference in its entirety.The technology disclosed in this specification refers to a bonding material, and particularly, a bonding material that is unlikely to cause the occurrence of whiskers.A bonding material (solder material) obtained by mixing metal particles with a high melting point such as copper (Cu) and metal ...

Au-Sn-Ag-BASED SOLDER ALLOY, ELECTRONIC DEVICE SEALED OR JOINED USING THE SAME, AND ELECTRONIC APPARATUS EQUIPPED WITH THE ELECTRONIC DEVICE

Disclosed herein is a high-temperature lead-free Au—Sn—Ag-based solder alloy that is excellent in sealability, joint reliability, and wet-spreadability, that can be kept at a high quality level for a long period of time, and that is provided at a relatively low cost. The lead-free Au—Sn—Ag-based solder alloy contains 27.5 mass % or more but less than 33.0 mass % of Sn, 8.0 mass % or more but 14.5 mass % or less of Ag, and a balance being Au except for elements inevitably contained therein during production. When having a plate- or sheet-like shape, the Au—Sn—Ag-based solder alloy has a surface whose L*, a*, and b* in an L*a*b* color system in accordance with JIS Z8781-4 are 41.1 or more but 57.1 or less, −1.48 or more but 0.52 or less, and −4.8 or more but 9.2 or less, respectively. When having a ball-like shape, the Au—Sn—Ag-based solder alloy has a surface whose L*, a*, and b* are 63.9 or more but 75.9 or less, 0.05 or more but 0.65 or less, and 1.3 or more but 11.3 or less, respectively. 1. A plate- or sheet-shaped Au—Sn—Ag-based solder alloy comprising 27.5 mass % or more but less than 33.0 mass % of Sn , 8.0 mass % or more but 14.5 mass % or less of Ag , and a balance being Au except for elements inevitably contained therein during production , the Au—Sn—Ag-based solder alloy having a surface whose L* , a* , and b* in an L*a*b* color system in accordance with JIS Z8781-4 are 41.1 or more but 57.1 or less , −1.48 or more but 0.52 or less , and −4.8 or more but 9.2 or less , respectively.2. The Au—Sn—Ag-based solder alloy according to claim 1 , which contains 29.0 mass % or more but 32.0 mass % or less of Sn.3. The Au—Sn—Ag-based solder alloy according to claim 1 , which contains 10.0 mass % or more but 14.0 mass % or less of Ag.4. The Au—Sn—Ag-based solder alloy according to claim 1 , which contains 29.0 mass % or more but 32.0 mass % or less of Sn and 10.0 mass % or more but 14.0 mass % or less of Ag.5. An electronic device sealed with the Au—Sn—Ag-based solder ...

Welding material for welding of superalloys

Welding material for welding of superalloys comprising boron with the range of 0.3-0.8 wt. % B, 0.2-0.8 wt. % C, 17-23 wt. % Cr, 0.35-10 wt. % Mo, 0.1-4.15 wt. % Nb with nickel or iron and impurities to balance for weld repair of engine components manufactured of precipitation hardening superalloys with high content of gamma prime phase at an ambient temperature.

TOOL BLADES AND THEIR MANUFACTURE

There is provided a tool blade, comprising a backing strip particles of abrasive material and a binder layer of binding material which binds the abrasive particles along an edge of the backing strip, wherein the edge of the backing strip is pre-formed with teeth, on which the abrasive particles are bound by the binding material. A profiled cutting portion extends beyond the pre-formed teeth. The pre-formed teeth are shaped as generally triangular waves or are flattened at least partially along an upper edge on which the cutting portion is at least partially disposed. A method of making such a blade is also provided. 1. A method of making a tool blade , comprising:providing a backing strip;providing particles of abrasive material;providing binding material which forms a binder layer that binds the abrasive particles along an edge of the backing strip;wherein the edge of the backing strip is pre-formed with teeth, prior to the introduction of abrasive particles and binding material;and wherein the binding material is heated by a beam of radiation to form the binder layer.2. The method of making a tool blade according to claim 1 , wherein the teeth are pre-formed to be undersize relating to a desired size claim 1 , the abrasive particles and binding material coating the teeth to increase the size of the coated tooth to the desired size.3. The method of making a tool blade according to claim 1 , wherein the teeth are pre-formed to be undersize relative to a desired size claim 1 , the abrasive particles and binding material coating the teeth to produce coated teeth with an increased size beyond the desired size claim 1 , the coated teeth being processed to achieve the desired size.4. The method of making a tool blade according to claim 2 , wherein the coated teeth are ground for sharpness.5. The method of making a tool blade according to claim 1 , wherein the binding material is heated by laser radiation.6. The method of making a tool blade according to claim 1 , wherein ...

SOLDER POWDER, AND SOLDER PASTE USING SOLDER POWDER

In solder powder having an average particle size of 5 μm or less and constituted by a center core and a covering layer covering the center core, wherein the center core consists of an intermetallic compound of silver and tin, or silver and the intermetallic compound of silver and tin, the covering layer consists of tin, and an intermediate layer which consists of an intermetallic compound of copper and tin is interposed between the center core and the covering layer so that at least a part of the center core is covered thereby. 1. A solder powder having an average particle size of 5 μm or less and having a center core and a covering layer covering the center core , whereinthe center core consists of an intermetallic compound of silver and tin, or silver and an intermetallic compound of silver and tin,the covering layer consist of tin, andan intermediate layer which consists of an intermetallic compound of copper and tin is interposed between the center core and the covering layer so that at least a part of the center core is covered thereby.2. The solder powder according to claim 1 , wherein the intermetallic compound of silver and tin is AgSn or AgSn claim 1 , and the intermetallic compound of copper and tin is CuSn or CuSn.3. The solder powder according to claim 1 , wherein a content of silver is 0.1 to 10% by mass and a content of copper is 0.1 to 2.0% by mass based on a total amount of the solder powder as 100% by mass.4. A paste for solder obtained by mixing the solder powder according to and a flux for a solder to make a paste.5. The paste for solder according to claim 4 , which is used for mounting electronic parts. The present invention relates to lead-free solder powder for fine pitch and a paste for solder using the powder. More specifically, it relates to an Sn series fine solder powder having an average particle size of 5 μm or less and a paste for solder using the powder.A solder to be used for bonding of electronic parts is advancing to be lead-free ...