Soldering method

A method of soldering in which a solder is applied to a first part to be soldered and any oxide film on the thus formed presoldering is removed by, for example, a flux is characterised in that the solder is then coated with an organic solvent to prevent further oxidation and a second part to be soldered is contacted with the first part. The resulting assembly is heated so that the solder melts and bonds the first and second parts together and so that the organic solvent evaporates. Thus soldering can be carried out without the need to clean any flux away after soldering. The solder may be Au-20Sn; Pb-3.5Ag-1.55n or Pb-55n and the organic solvent may be tetraethylene glycol. The first part may be a semiconductor chip and the second part may be a printed substrate for mounting the semiconductor chip. <IMAGE>