КОМПОЗИЦИОННАЯ МЕДНАЯ ФОЛЬГА И СПОСОБ ЕЕ ИЗГОТОВЛЕНИЯ

Изобретение относится к области гальванопластики, в частности к изготовлению композиционной медной фольги, и может быть использовано для производства печатных плат. Композиционная медная фольга (10), содержащая несущую фольгу (12), электролитически осажденную на катод, имеет катодную сторону, образованную в контакте с катодом, и противоположную ей электролитическую сторону. На электролитической стороне несущей фольги (12) расположен очень тонкий отделяющий слой (14). Тонкая функциональная фольга (16), образованная осаждением меди, имеет лицевую сторону, контактирующую с отделяющим слоем (14), и противоположную ей обратную сторону. Электролитическая сторона несущей фольги (12) имеет шероховатость Rz, меньшую или равную 3,5 мкм. Способ заключается в том, что на катоде электролитическим осаждением получают несущую фольгу (12), на электролитической стороне которой формируют очень тонкий отделяющий слой (14), и осаждением меди формируют тонкую функциональную фольгу (16), которая имеет лицевую ...

VERFAHREN ZUR HERSTELLUNG VON POLYIMID-METALL-LAMINATEN

PRINTED CIRCUIT CARD

... 1,221,968. Printed circuit assemblies. INTERNATIONAL BUSINESS MACHINES CORP. 17 April, 1968 [8 May, 1967], No. 18052/68. Heading H1R. [Also in Division H2] Electrical connection between two electrically conductive coatings 46, 48, Fig. 3, on a dielectric base 47 is produced by providing in one coating conical members 53 which project through holes in the base 47 and corresponding conical members in the second coating which fit over the first said members. Such connections are produced by depositing a conducting layer (72), Fig. 2b (not shown), of e.g. copper, on a steel former (70) having raised conical projections (71), and then assembling a prepunched dielectric layer (73), e.g. of epoxy or silicone glass, a further conducting layer (74), e.g. of copper, provided with conical members (76), on the deposited conducting layer. The various layers are then laminated together by heat and pressure and thereafter removed from the former. To ensure good electrical connections, solder may be provided ...

Metal-clad laminate construction

A metal-clad laminate having special utility in the production of high resolution printed circuit patterns and preparation of the laminate are described. The laminate preferably comprises a resin- bonded, glass-reinforced substrate, a layer of coupling agent covering and bonded to a major surface of the substrate, a layer of ultra-thin copper adjacent the layer of coupling agent, and a composite bonding layer disposed between the copper layer and the layer of coupling agent. The composite bonding layer comprises copper alloyed with at least one non-copper metal and oxide material of the non-copper metal.

METAL-CLAD LAMINATE CONSTRUCTION

Transfer lamination of vapour deposited copper films

A low temperature (about 0 DEG C. to about 100 DEG C.) method is disclosed for forming an ultrathin film of copper on an aluminum carrier sheet. By this method, which employs matte finish aluminum foil, the peel strength for separating the aluminum carrier from the copper film can be preset at a desired value between 0.1 and 2 pounds per inch.

METHOD OF ELECTROPLATING A METALLIC FOIL

... 1460602 Electro-plating copper on to aluminium PERSTORP AB 27 Feb 1974 [28 Feb 1973] 9005/74 Addition to 1401815 Heading C7B Cu is electro-plated to a thickness less than 17 Ám on Al or Al alloy foil of thickness less than 200 Ám from a bath containing Cu, pyrophosphate and the anion of an acid, e.g. oxalic, which has pK # 0À8 at 20‹C. The foil may be washed in NaOH before plating at a c.d. of 2-35 A/dm2. The plated foil may be bonded to a permanent insulating base, e.g. epoxy-impregnated glass cloth, the Al foil peeled off and a printed circuit formed on the Cu. Plating conditions desirably are such that adhesion of the Al to the Cu is 0À1 - 1À0 kp/cm measured by ASTM D-1867. The bath may comprise Cu 2 P 2 O 7 , K 4 P 2 O 7 , oxalic acid and NH 4 OH or an amine to pH 3À5-9.

METAL-CLAD LAMINATES

PROCEDURE FOR THE PRODUCTION OF AN ELECTRICALLY LEADING LAMINATED STRUCTURE

PROCEDURE FOR THE PRODUCTION OF A LAMINATED PRINTED CIRCUIT BOARD

PROCEDURE FOR THE PRODUCTION OF A PLATED THROUGH PRINTED CIRCUIT BOARD

PRODUCTION OF DIELECTRIC PLATES PLATED WITH COPPER.

PRODUCTION MATS OF A SURFACE ON A LAYER OF METAL.

PROCEDURE FOR THE PRODUCTION OF A MULTILEVEL PRINTED PRINTED CIRCUIT BOARD AND SANDWICH FOIL FOR THE USE THEREIN

PROCEDURE FOR THE CONNECTION OF KUPFERFOLIEN AND PARTITION PLATES

DEVICE AND PROCEDURE FOR THE PRODUCTION OF PRINTED PRINTED CIRCUIT BOARDS

Drum-side treated metal foil and laminate for use in printed circuit boards and methods of manufacture

Printed circuit heaters with ultrathin low resistivity materials

METHOD FOR PRODUCING POLYMER-COATED METAL FOILS AND USE THEREOF

The invention relates to a method for producing polymer-coated metal foil s, comprising the following steps: (a) a base layer (7) is applied to a carr ier foil (3) by means of a dispersion (5) containing particles that can be e lectroless-plated or electroplated in a matrix material; (b) the matrix mate rial is at least partially dried and/or at least partially hardened; (c) a m etal layer (19) is formed on the base layer (7) by subjecting the base layer (7) containing the particles that can be electroless-plated or electroplate d to an electroless plating or electroplating process; (d) a polymer (23) is applied to the metal layer (19). The invention further relates to a use of the polymer-coated metal foil produced according to the invention for manufa cturing printed circuit boards.

COMPOSITE COPPER FOIL AND MANUFACTURING METHOD THEREOF

A composite copper foil (10) comprises a carrier foil (12) formed by electrodeposition onto a cathode, the carrier foil (12) having a cathode side formed in contact with the cathode and an opposite electrolyte side. A very thin release layer (14) is on the electrolyte side of said carrier foil (12). A thin functional foil (16) formed by deposition of copper has a front side in contact with the release layer (14) and an opposite back side. The electrolyte side of the carrier foil (12) has a surface roughness Rz less than or equal to 3.5 .mu.m. There is also presented a method for manufacturing such a composite copper foil.

DRUM-SIDE TREATED METAL FOIL AND LAMINATE FOR USE IN PRINTEDCIRCUIT BOARDS AND METHODS OF MANUFACTURE

Drum or smooth side-treated metal foil can be used either as an intermediate product for use in the manufacture of laminate or as a part of the finished laminate to be used in the manufacture of multi-layer printed circuit board (PCB) packages. By treating the drum or smooth side (11) of metal foil (10) with a bond strength enhancer (13) rather than treating the matte side or rough side (12), or both sides, several time- consuming and costly steps can be bypassed in the manufacture of multi-layer printed circuit boards (PCB) while the integrity of the metal foil, laminate and multi-layer PCB are not compromised and are actually enhanced by way of improved impedan ce control and adhesion characteristics after relamination. This novel foil can be initially bonded to substrate on either side before circuit formation and can be used either as an internal foil layer or as a foil cap. The invention includ es methods of manufacture of the metal foil, laminate and multi-layer printed circuit board ...

COMPONENT OF PRINTED CIRCUIT BOARDS

A component (10) for use in manufacturing articles, such as printed circuit boards, comprising a laminate constructed of a sheet of copper foil (20) that, in a finished circuit board, constitutes a functional element, and a sheet of carbon steel (14) having a layer of an inert metal (16) thereon, the sheet of carbon steel (14) constituting a discardable element. One surface (22) of the copper sheet (20) and the surfa ce (18) of the inert metal layer (16) on the carbon steel sheet (14) are essentially uncontaminated and engageable with each other at interfaces. The copper sheet (20) is attached to the inner metal layer (16) of the carbon steel (14) at their borders and defines substantially uncontaminated central zones inwardly of the edges of the sheets that are unjoined at the interfaces.

Process for producing a metallised laminate

The metallised laminate is produced by treating a substrate with a release agent, depositing a layer of metal on the thus treated surface of the substrate, treating the top side of this conductive metal with improvement of its adhesive properties, bonding the conductive metal to a laminate, removing the substrate and thus obtaining the resulting metallised laminate. The metal layer has a thickness of 1 to 20 mu . When the metallised laminate is produced in this manner, it can be readily stripped off the material of the respective substrate. Such a laminate is used for example in printed circuit technology.

METHOD OF MANUFACTURING MUCH SLOINOI OF PRINTED CIRCUIT BOARD AND INTENDED FOR THAT COMPOSITE FOIL

[...] copper foil, copper-clad laminated board, printed circuit board, electronic apparatus, and the printed circuit board manufacturing method

Copper foil with carrier

Easy-to-peel carrier foil as well as preparation method and application thereof

IMPROVED PROTECTED CONDUCTIVE FOLL ASSEMBLAGE AND PROCEDURE FOR PREPARING SAME USING STATIC ELECTRICAL FORCES

PROCEDE DE FABRICATION D'UN STRATIFIE REVETU DE CUIVRE ET STRATIFIE OBTENU

PROCEDE FOURNISSANT DES STRATIFIES REVETUS DE CUIVRE A SURFACE LISSE ET EXEMPTE DE TROUS D'EPINGLE. IL COMPREND: LE DEPOT EN PHASE VAPEUR SUR UN CORPS DE CUIVRE 17 D'EPAISSEUR INFERIEURE A 80MM D'UN FILM ULTRA-MINCE 16 D'UN METAL CHOISI PARMI LE ZINC, L'ALUMINIUM, L'ETAIN ET LE CHROME; LE DEPOT EN PHASE VAPEUR, SUR LE FILM METALLIQUE ULTRA-MINCE RESULTANT, D'UN FILM ULTRA-MINCE 15 D'UN OXYDE CHOISI ENTRE L'OXYDE DE SILICIUM ET L'OXYDE D'ALUMINIUM; ET LA STRATIFICATION DU CORPS METALLIQUE REVETU DU FILM D'OXYDE AVEC UN SUBSTRAT 12 POUR OBTENIR UNE ADHERENCE RELATIVEMENT FORTE ENTRE LE CORPS ET LE SUBSTRAT. APPLICATION AUX PLAQUETTES POUR CIRCUITS IMPRIMES.

LOAD CARRIERS AND METHOD OF MANUFACTURE

PROCESS FOR PRINTING USING TWO LASERS

LAMINATE COVERED METAL AND MANUFACTORING PROCESS

LAMINATE COVERED OF COPPER AND MANUFACTORING PROCESS

METHOD FOR PRODUCING FLEXIBLE COPPER-CLAD LAMINATED SUBSTRATE AND MULTI-LAYER LAMINATE

METHOD FOR PRODUCING MULTI-LAYER PRINTED WIRING BOARDS HAVING BLIND VIAS

ULTRATHIN COPPER FOIL WITH CARRIER, AND COPPER LAMINATED BOARD OR PRINTED WIRING BOARD

Multi-layer wiring board number bath method

POLYIMIDE-COPPER COMPOSITE LAMINATE FOR SECURING GOOD MECHANICAL AND ELECTRIC CHARACTERISTICS AND ALKALI AND ACID RESISTANCE BY USING AN AROMATIC POLYIMIDE FILM

PURPOSE: A polyimide-copper composite laminate is provided to supply a carrier containing a thin copper film and an aromatic polyimide film forming electronic circuits with fine patterns. CONSTITUTION: A polyimide-copper composite laminate comprises a metal carrier(4a,4b) with the thickness of 10-20micrometer; a thin copper film(2a,2b) with the thickness of 1-8micrometer; a heat-resistant intermediate layer(3a,3b) positioned between the metal carrier and the thin copper film; and an aromatic polyimide film directly fixed to the thin copper film without an adhesive agent. The thickness of the metal carrier is 10-18micrometer or 15-18micrometer. The heat-resistant intermediate layer is made from ceramic or metal. The aromatic polyimide film is fixed to the copper film at the release strength over 0.7N/nm. The copper film is fixed to the metal carrier at the release strength of 0.001-0.2N/nm. © KIPO 2006 ...

캐리어 부착 동박, 캐리어 부착 동박의 제조 방법, 프린트 배선판용 캐리어 부착 동박 및 프린트 배선판

... 동박의 적어도 일방의 면에, 입자 길이의 10 ％ 위치인 입자 근원의 평균 직경 (D1) 이 0.2 ㎛ ∼ 1.0 ㎛ 이고, 입자 길이 (L1) 와 상기 입자 근원의 평균 직경 (D1) 의 비 (L1/D1) 가 15 이하인 동박의 조화 처리층을 갖는 것을 특징으로 하는 프린트 배선판용 동박. 조화 처리층을 갖는 프린트 배선용 동박과 수지를 적층한 후, 구리층을 에칭에 의해 제거한 수지의 표면에 있어서, 요철을 갖는 수지 조화면의 구멍이 차지하는 면적의 총합이 20 ％ 이상인 것을 특징으로 하는 프린트 배선판용 동박. 동박의 다른 여러 가지 특성을 열화시키지 않고, 상기한 회로 침식 현상을 회피하는 반도체 패키지 기판용 동박을 개발하는 것이다. 특히, 동박의 조화 처리층을 개선하여, 동박과 수지의 접착 강도를 높일 수 있는 프린트 배선판용 동박 및 그 제조 방법을 제공하는 것을 과제로 한다.

프린트 배선판의 제조 방법

... 추가의 에칭 공정을 별도로 요하지 않고, Cu 에칭에 의해 면 내에서 균일하게 구리층의 에칭을 행할 수 있음과 함께, 국소적인 회로 오목부의 발생을 억제 가능한, 프린트 배선판의 제조 방법이 제공된다. 이 제조 방법은, 표면 구리층 및 에칭 희생층을 이 순서대로 구비한 금속박, 또는 표면 구리층, 에칭 희생층 및 추가 구리층을 이 순서대로 구비한 금속박을 사용하여 지지체를 얻는 공정과, 표면 구리층 상에, 구리제의 제1 배선층과 절연층을 적어도 포함하는 빌드업 배선층을 형성하여 빌드업 배선층을 구비한 적층체를 얻는 공정과, 표면 구리층 및 에칭 희생층, 또는 표면 구리층, 에칭 희생층 및 추가 구리층을 에칭액에 의해 제거하여 제1 배선층을 노출시키고, 그것에 의해 빌드업 배선층을 포함하는 프린트 배선판을 얻는 공정을 포함한다. 에칭 희생층의 에칭 레이트는 Cu보다도 높은 것이다.

COPPER FOIL ATTACHED TO CARRIER SUITABLE FOR PRINT WIRING PLATE, MULTI LAYER PRINT WIRING PLATE AND CHIP ON FILM WIRING PLATE AND PRINTED CIRCUIT BOARD USING THE SAME

PURPOSE: A copper foil attached to a carrier and a printed circuit board using the same are provided to prevent interface of a release layer from getting loose, to make manufacturing quality stable and separate a carrier foil and a copper foil easily. CONSTITUTION: The copper foil attached to the carrier includes a carrier film, a diffusion preventing layer, a release layer and a copper foil. The release layer includes a metal (A) having detachability and a metal for making plating of copper foil easy. The content (a) of the metal (A) and the content (b) of the metal (B) constituting the release layer satisfies the formula of 10<=a/(a+b)×100<=70. The metal (A) constituting the release layer is selected from a group consisting of Mo, Ta, V, Mn, W and Cr, and metal (B) is selected from a group consisting of Fe, Co, Ni and Cr. © KIPO 2007 ...

캐리어 부착 동박

L/S = 20 ㎛/20 ㎛ 보다 미세한 배선, 예를 들어 L/S = 15 ㎛/15 ㎛ 의 미세한 배선을 형성하는 것이 가능한 캐리어 부착 동박을 제공한다. 동박 캐리어, 중간층, 극박 구리층을 이 순서로 갖는 캐리어 부착 동박으로서, 상기 중간층은 Ni 를 함유하고, 상기 캐리어 부착 동박을 220 ℃ 에서 2 시간 가열한 후, JIS C 6471 에 준거하여 상기 극박 구리층을 박리했을 때, 상기 극박 구리층의 상기 중간층측의 표면의 Ni 의 부착량이 5 ㎍/d㎡ 이상 300 ㎍/d㎡ 이하인, 캐리어 부착 동박.

CARRIER BASE MATERIAL ATTACHED WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

A carrier base material attached wiring substrate comprises a wiring substrate and a carrier base material. The wiring substrate includes: an insulating layer; a wiring layer located on the lower surface of the insulating layer; and a solder resist layer covering the lower surface of the insulating layer, and including an opening exposing a part of the wiring layer as an external connection terminal. The carrier base material is bonded to the solder resist layer by an adhesive layer. The carrier base material includes an opening exposing the external connection terminal in communication with the opening of the solder resist layer. The opening of the carrier base material has a diameter smaller than a diameter of the opening of the solder resist layer. COPYRIGHT KIPO 2018 ...

COPPER FOIL WITH CARRIER

FLEXIBLE COPPER CLAD LAMINATE CAPABLE OF PREVENTING OPEN/SHORT CIRCUIT AND METHOD FOR MANUFACTURING SAME

Disclosed is a flexible copper-clad laminate capable of preventing open and/or short circuit by ensuring uniform chemical polishing, and a method for manufacturing the same. The flexible copper clad laminate of the present invention comprises a nonconductive polymer substrate, a tiecoat layer on the nonconductive polymer substrate, and a copper layer on the tiecoat layer. When performing the chemical polishing to reduce the thickness of the copper layer by 1 to 2 μm, the polished copper layer has surface roughness (Rz) of 0.1 to 0.15 μm and ND direction average grain of 2 μm or less. COPYRIGHT KIPO 2018 ...

ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL FURNISHED WITH PRIMER RESIN LAYER AND PROCESS FOR PRODUCING THE SAME

An electrolytic copper foil with a carrier foil furnished with a primer resin layer, that even when the electrolytic copper foil with a carrier foil at its surface to be bonded with a substrate resin layer has low surface roughness, exhibits high adherence, and that when pinholes, etc. remain in the bulk copper layer, or when the inside wall part of through-holes, via holes, etc. is brought into contact with a desmear solution, allows any detachment due to erosion between electrolytic copper foil layer and substrate resin layer to be less probable. Thus, there is provided an electrolytic copper foil with a carrier foil furnished with a primer resin layer, comprising a carrier foil and, sequentially superimposed on at least one major surface thereof, a junction interface layer, a bulk copper layer, a Ni-Zn containing plating layer and a primer resin layer, wherein the Ni-Zn containing plating layer contains Ni and Zn in a Ni/Zn adhesion ratio of 1.5 to 10. Further, there is provided a process ...

DOUBLE-SIDED WIRING BOARD FABRICATION METHOD, DOUBLE-SIDED WIRING BOARD, AND BASE MATERIAL THEREFOR, CAPABLE OF FORMING FINE WIRING EVEN WHEN COPPER FILM ELECTRO-DEPOSITED ON EXPOSED COPPER FOIL BECOMES THICK DURING ELECTROPLATING OF METAL LAYER

PURPOSE: A double-sided wiring board fabricating method, a double-sided wiring board, and a base material therefor are provided to improve flexibility in comparison with a conventional flexible board by making the thickness of a copper foil below approximately 23 um. CONSTITUTION: A double-sided wiring board fabricating method includes the steps of: stacking a metal layer having a support substrate on at least one side surface of an electric insulating board; removing the support substrate from the metal layer to make the metal layer remain on the electric insulating board; and forming a through hole and/or a blind via hole inside the electric insulating board. The double-sided wiring board includes metal wiring patterns formed on both surfaces of the electric insulating board and electrically connected to each other through the through hole and/or the blind via hole. © KIPO 2006 ...

COMPONENT FOR PC BOARDS

The component is used in the manufacture of PC boards, containing laminated sheet of copper foil or aluminium or a similar material. A band of universal adhesive connects the sheets at their ends and forms a protected central zone in their contact surfaces. Sectors of the adhesive are located inside the sheet edges and holes are formed across them for the guiding pins for facilitation of the foil treatment.

Micro-roughened electrodeposited copper foil and copper clad laminate

Provided is a micro-roughened electrodeposited copper foil, which comprises a micro-rough surface and multiple copper nodules. The micro-rough surface includes multiple smooth areas and rough areas. The micro-rough surface of 120 [mu]m2 has at least five smooth areas of 62500 nm2 or more. Each rough area has a length of 300 nm to 2,500 nm and includes three to fifty copper nodules with a mean width of 100 nm to 300 nm. Besides, the micro-roughened electrodeposited copper foil have an Rlr value of 1.05 to 1.60 or an Sdr of 0.01 to 0.08. With said surface profile and/or characteristics, the electron path distance can be shortened, such that the micro-roughened electrodeposited copper foil can reduce the insertion loss of the copper clad laminate at high frequencies and have the desired peel strength.

Copper foil with low profile bond enhancement

A composite material (10) includes a structural carrier layer (12) and a relatively thin metal foil layer (14) separated by a release layer (16). The release layer (16), that may be an admixture of a metal such as nickel or chromium and a non-metal such as chromium oxide, nickel oxide, chromium phosphate or nickel phosphate, provides a separation force for the metal foil layer (14) from the carrier strip (12) that is typically on the order of 1.79 kg/m (0.1 pound per inch) to 35.7 kg/m (2 pounds per inch). This provides sufficient adhesion to prevent premature separation of the metal foil layer (14) from the carrier layer (12), but easy removal of the carrier layer (12) when desired. The metal foil layer (14) may be electrolytically formed copper having a low height profile, on the order of 0.5 micron to 2.7 microns, bond strength enhancing agent (20) coating a side (18) of the metal foil layer (14). The enhanced surface is subsequently bonded to a dielectric (22) and the carrier layer ...

SURFACE PROTECTIVE FILM

Provided is a surface protective film comprising a base film; and an adhesive layer formed on the inner side of the base film, wherein the adhesive composition of the adhesive layer comprises 1 to 4 parts by weight of an epoxy-based curing agent based on 100 parts by weight of an acrylic resin having carboxyl functional groups so as to reduce the difference between an adhesion after the compression at high temperature and an initial adhesion at a lamination.

APPARATUS AND METHOD FOR PRODUCING NON-OR LIGHTLY-EMBOSSED PANELS

Compositions and methods are provided whereby a separator sheet (10) is produced that comprises a) an alloy substrate layer (20) having a top surface (22) and a bottom surface (24), b) a first metal layer (30), c) a second metal layer (40), and d) an intermediate metallic material (50, 55) that couples the first metal layer (30) to the top surface (22) of the substrate layer (20) and that couples the second metal layer (40) to the bottom surface (24) of the substrate layer (20). The separator sheet (10) can be incorporated into the production of a layered material. The layered material is then further incorporated into an electronic component. The intermediate material (50, 55) and the alloy layers is removed from the layered material before the material is incorporated into an electronic component. Further, the first and second metal layers (30, 40) of the separator sheet (10) are not removed from the layered material, and they function as laminates for the layered materials that are incorporated ...

METAL FOIL COMPOSITE STRUCTURE FOR PRODUCING CLAD LAMINATE

A metal foil composite structure used for the construction of clad laminate and printed circuit wiring boards comprises first and second conductive metal foil layers having substantially the same width. Each of the layers has opposite lateral edges. A carrier layer is disposed between the first and second conductive metal layers. The carrier layer has a width less than the width of the first and second conductive metal layers, and forms a margin at each of the lateral edges. The first and second conductive layers are joined to each other only within the margins. Strength provided by the carrier enables thin conducting metal foils to be incorporated in clad laminates. Such foils, which may be as thin as 8 - 10 µm, are often too weak to be reliably self–supporting. The provision of a supporting carrier layer enables the thin foils to be handled and bonded to a dielectric substrate in an efficient and economical manner. Defects in the resulting clad laminate, such as wrinking or creasing ...

PEELABLE CIRCUIT BOARD FOIL

In one embodiment, a peelable circuit board foil (200) has a metal support layer (205) and a conductive metal foil layer (210) bonded by an inorganic high temperature release structure (215) that comprises a co-deposited layer (250) and a metal oxide layer (260). The co-deposited layer comprises an admixture of nickel and one or more of boron, phosphorus, and chromium. In a second embodiment, the peelable printed circuit foil (200) has a crystallized dielectric oxide layer (405) disposed on the metal foil layer and an electrode layer (415) disposed on the crystallized dielectric oxide layer, forming a dielectric peelable circuit board foil (400) that may be adhered to a layer of a flexible or rigid circuit board, after which the metal support layer can be peeled away, leaving a capacitive structure including the metal foil layer, the crystallized dielectric oxide layer, and the electrode layer.

HIGH DENSITY SUBSTRATE AND METHODS FOR MANUFACTURING SAME

L'invention concerne des substrats munis d'une couche métallique ultra-mince, qu'on utilise pour fabriquer des circuits à haute densité. Elle concerne de nouveaux procédés mettant en oeuvre ces substrats pour fabriquer des stratifiés, des circuits, des interposeurs et autres stratifiés électroniques.

MULTILAYER WIRING BOARD, METHOD FOR PRODUCING MULTILAYER WIRING BOARD, POLISHER FOR MULTILAYER WIRING BOARD, AND METAL SHEET FOR PRODUCING WIRING BOARD

A plurality of multilayer metal sheets (1) each comprising a bump-forming metal layer (2), etching-stop layer (3), and a wiring film-forming metal layer (4) are processed so as to each have a wiring film (4a) formed out of the wiring film-forming metal layer and bumps (2a) formed out of the bump-forming metal layer. The multilayer metal sheets are so stacked by repeating a stacking step in such a way that the bump-forming surface of one multilayer metal sheet faces to the wiring film of another multilayer metal sheet. A multilayer wiring board is polished by a polisher (11a) for a multilayer wiring board comprising a metal sheet holding means (13) for holding a metal sheet (1a), a blade holding means (25) for holding a blade (26) above the metal sheet, a height adjusting mechanism (20) for adjusting the height of the blade holding means, and a blade translating mechanism (15) for moving the blade holding means parallel to the surface of the metal sheet.

Metal foil with carrier

Provided is a metal foil with a carrier as a laminated body in which a carrier A and a metal foil B are placed alternately, wherein the carrier A and the metal foil B respectively have a glossy surface, so-called ‘S surface’, and the said surfaces are laminated to face each other. The present invention relates to a copper foil with a carrier which is used for producing a single-sided laminated plate or a multilayer laminated plate of two or more layers for use in a printed wiring board. In particular, this copper foil with a carrier is used for producing a laminated plate, and its objective is to improve the handling performance during the production process of a printed board and reduce costs by increasing the yield.

Method for making circuit board

A method for making the same is disclosed. First, a first substrate and a second substrate are provided. The first substrate includes a release film attached to a carrier. The second substrate includes a copper film covered with a solder mask. Second, the solder masked is patterned. Next, the release film and the patterned solder mask are pressed together so that the first substrate is attached to the second substrate. Then, the copper film is patterned to form a first pattern and a second pattern. The first pattern is in direct contact with the release film and the second pattern is in direct contact with the patterned solder mask. Later, a passivation is formed to cover the first pattern and the second pattern to form a circuit board structure. Afterwards, a package is formed on the carrier to form a packaging structure.

Copper foil for high-density ultra-fine printed wiring board

The present invention is to provide an ultra-thin copper foil with a carrier which comprises a release layer, a diffusion preventive layer and a copper electroplating layer laminated in this order, or a diffusion preventive layer, a release layer and a copper electroplating layer laminated in this order on the surface of a carrier foil, wherein a surface of the copper electroplating layer is roughened; a copper-clad laminated board comprising the ultra-thin copper foil with a carrier being laminated on a resin substrate; a printed wiring board comprising the copper-clad laminated board on the ultra-thin copper foil of which is formed a wiring pattern; and a multi-layered printed wiring board which comprising a plural number of the above printed wiring board being laminated.

Peelable circuit board foil

In one embodiment, a peelable circuit board foil (200) has a metal support layer (205) and a conductive metal foil layer (210) bonded by an inorganic release material (215). The conductive metal foil layer has a an exposed surface (212) that is coated with a high temperature anti-oxidant barrier (220) and has a roughness less than 0.05 microns RMS. In a second embodiment, the peelable printed circuit foil (200) has a crystallized dielectric oxide layer (405) disposed on the exposed surface of the conductive metal foil layer and an electrode layer (415) disposed on the crystallized dielectric oxide layer, forming a dielectric peelable circuit board foil (400) that may be adhered to a layer of a flexible or rigid circuit board, after which the metal support layer can be peeled away, leaving a capacitive structure including the metal foil layer, the crystallized dielectric oxide layer, and the electrode layer.

Printed circuit material

A product useful in the manufacture of printed circuits includes a carrier layer of copper having a thickness on the order of about 10-15 microns. A thin layer of copper having a thickness in the range of 1-12 microns, and which will provide the conductive path for the printed circuit, is secured to the copper carrier by an intermediate metallic layer positioned therebetween and secured to both layers of copper. The intermediate layer has a thickness in the range of 0.1-2.0 microns and is selected from the group consisting of nickel, a nickel-tin alloy, a nickel-iron alloy, lead and a tin-lead alloy. The intermediate layer adheres sufficiently to the thin layer of copper to prevent removal thereof during the etching process which removes the carrier layer of copper. The described thin metallic foil is bonded upon opposite sides of a suitable dielectric which may be a reinforced or non-reinforced epoxy or any one of a number of other suitable materials for forming the core of a printed circuit ...

Method of protecting the surface of foil and other thin sheet materials before and during high-temperature and high pressure laminating

A method for protecting a substrate sheet such as a conductive foil suitable for use in the manufacture of printed circuit boards involving applying a lamination mold-release layer to one side of a protective film, and applying a preferably electron beam curable adhesive pressure-sensitive coating to the other side of the film, curing the adhesive coating, and laminating the protective film to the foil or other substrate sheet, which, in turn, may be laminated to other substrates such as dielectric sheets. The laminate product is a protected substrate sheet having a protective film laminated to one side of the sheet (or both), the film having a lamination mold-release layer on one side thereof and an electron beam cured pressure-sensitive adhesive coating on the other side thereof, said other side contacting but being releasably detachable from said substrate sheet Where the substrate sheet is a foil or similar surface, protection is thus provided during handling and storage as well as ...

Substrate for flexible wiring and method for producing the same

The present invention provides a substrate for flexible wiring comprises a liquid crystalline polyester layer and a copper foil with a thickness of 5 mum or less. The substrate has a large adhesion between the resin layer and the copper foil, and is sufficient in water absorbing property and electrical properties.

METHOD FOR MAKING CIRCUIT BOARD

A method for making the same is disclosed. First, a first substrate and a second substrate are provided. The first substrate includes a release film attached to a carrier. The second substrate includes a copper film covered with a solder mask. Second, the solder masked is patterned. Next, the release film and the patterned solder mask are pressed together so that the first substrate is attached to the second substrate. Then, the copper film is patterned to form a first pattern and a second pattern. The first pattern is in direct contact with the release film and the second pattern is in direct contact with the patterned solder mask. Later, a passivation is formed to cover the first pattern and the second pattern to form a circuit board structure. Afterwards, a package is formed on the carrier to form a packaging structure.

COMPOSITE COPPER FOIL AND MANUFACTURING METHOD THEREOF

PRINTED WIRING BOARD COPPER FOIL AND COPPER-PLATED LAMINATED BOARD USING THE SAME

PROBLEM TO BE SOLVED: To provide a copper foil, which is superior both in properties of selectively etching a resistive circuit layer and a copper layer for manufacturing a printed wiring board, and in UL heat resistance. SOLUTION: A printed wiring board copper foil is provided with roughened surface on its one side, a nickel-zinc alloy layer is formed on the roughened surface of the copper foil used for a printed wiring board, and the printed wiring board copper foil is used for solving the problem. At the same time, a suitable method of manufacturing the above copper foil is provided. COPYRIGHT: (C)2003,JPO ...

МНОГОСЛОЙНАЯ ФОЛЬГА И СПОСОБ ЕЕ ИЗГОТОВЛЕНИЯ

Изобретение относится к многослойной фольге, ее изготовлению и может быть использовано при изготовлении печатных плат в электротехнической и электронной промышленности. Многослойная фольга включает металлическую фольгу-носитель; первый барьерный слой, расположенный на одной стороне металлической фольги-носителя; второй металлический слой, расположенный на первом барьерном слое, причем второй металлический слой включает комбинацию металла, выбранного из группы, включающей цинк, медь и кобальт, и по меньшей мере одного металла, выбранного из группы, включающей мышьяк, марганец, олово, ванадий, молибден, сурьму и вольфрам; и осажденную электролитическим способом ультратонкую металлическую фольгу на металлическом слое. Способ включает подготовку металлической фольги-носителя, нанесение первого барьерного слоя, электролитическое осаждение второго металлического слоя на указанный первый барьерный слой, причем второй металлический слой наносят электролитическим осаждением в ванне, включающей комбинацию ...

СПОСОБ ИЗГОТОВЛЕНИЯ МЕТАЛЛИЧЕСКОЙ ФОЛЬГИ С ПОЛИМЕРНЫМ ПОКРЫТИЕМ И ЕЕ ПРИМЕНЕНИЕ

... 1. Способ изготовления металлической фольги с полимерным покрытием, включающий следующие стадии: ! (a) нанесение на пленочную подложку (3) базового слоя (7) из дисперсии, содержащей покрытые без тока и/или гальванически покрытые частицы в матричном материале, причем пленочная подложка (3) выполнена из материала, который обладает слабой адгезией к базовому слою (7), ! (b) no меньшей мере частичную сушку и/или по меньшей мере частичное отверждение матричного материала, ! (c) формирование на базовом слое (7) металлического слоя (19) путем покрытия без тока и/или гальванического покрытия содержащихся в базовом слое (7) покрытых без тока и/или гальванически покрытых частиц, ! (d) нанесение полимера (23) на металлический слой (19). ! 2. Способ изготовления покрытой металлом основы, включающий следующие стадии: ! (a) нанесение на пленочную подложку (3) базового слоя (7) из дисперсии, содержащей покрытые без тока и/или гальванически покрытые частицы в матричном материале, причем пленочная подложка ...

Ultradünne Kupferfolie mit Träger und Leiterplatte und dessen Verwendung

ELEKTROLYTISCHE KUPFERFOLIE MIT TRÄGERFOLIE UND KUPFERKASCHIERTES LAMINAT WOBEI DIE ELEKTROLYTISCHE KUPFERFOLIE MIT TRÄGERFOLIE VERWENDET WIRD

DUENNE VERBUND-FOLIE

GESCHUETZTE LEITENDE FOLIE UND VERFAHREN ZUM SCHUTZ EINER GALVANISCHEN METALLFOLIE WAEHREND DER WEITEREN BEARBEITUNG

VERFAHREN ZUM HERSTELLEN VON GEDRUCKTEN SCHALTUNGEN

METHOD FOR THE PRODUCTION OF THROUGH HOLES IN A LAMINATE COMPRISING AN INSULANT BASE AND AT LEAST ONE METAL LAYER

... 1502975 Etching PERSTORP AB 5 Sept 1975 [27 Sept 1974] 36747/75 Heading B6J [Also in Division H1] A metal, e.g. copper and zinc, coated insulant printed circuit laminate is coated with an adherent protective layer of plastics or metal, e.g. aluminium, nickel, chromium, tin, lead or their alloys, chemically different from the metal coating, and the laminate is drilled or punched for through holes, the protective layer reducing burr formation and enabling any burrs to be etched off; after which the protective layer is removed. The etchant attacks the burrs but not the protective layer, and may be ammonium persulphate + dilute nitric acid, or dilute hydrogen peroxide and dilute sulphuric acid, or dilute sulphuric acid and chloride ions with electrolysis. The laminate may be formed by applying a film conductor metal formed on a temporary base of aluminium, nickel, chromium, tin or lead, or an alloy thereof, with an intervening adhesive layer, the temporary base being later removed, e.g. by ...

DENDRITIC SURFACE TREATMENT OF METAL LAYERS

COMPONENT OF A PRINTED CIRCUIT BOARD

NANO-STRUCTURAL COATINGS

ELECTROLYTIC COPPER FOIL WITH TRANSPARENCY, WHICH ARE WITH PRIMING RESIN LAYER MISTAKE, AND MANUFACTURING PROCESS FOR IT

Very ultra thin conductor layers for printed wiring boards

Method for joining copper films and separating sheets of metal

PRINTED CIRCUIT HEATERS WITH ULTRATHIN LOW RESISTIVITY MATERIALS

Resin/copper/metal laminate and method of producing same

Drum-side treated metal foil and laminate for use in printed circuit boards and methods of manufacture

COATING ALUMINUM WITH A STRIPPABLE COPPER DEPOSIT

SUPPORT LAYER FOR THIN COPPER FOIL

MOLDED PRINTED CIRCUITS AND METHOD

Component of Printed Circuit Boards

СПОСОБ ИЗГОТОВЛЕНИЯ МНОГОСЛОЙНОЙ ПЕЧАТНОЙ ПЛАТЫ И ПРЕДНАЗНАЧЕННАЯ ДЛЯ ЭТОГО КОМПОЗИЦИОННАЯ ФОЛЬГА

... 1. Способ изготовления многослойной печатной платы, при котором а) изготавливают основание (20) печатной платы, б) изготавливают композиционную фольгу (10), содержащую функциональный слой (16) меди толщиной менее 10 мкм, нанесенный на несущую фольгу (12) и покрытый неармированной термореактивной смолой, в) ламинируют основание (20) печатной платы композиционной фольгой (10), уложенной на него своей покрытой смолой стороной, г) удаляют несущую фольгу (12) с функционального слоя (16), д) со стороны функционального слоя (16) посредством прошивки CO2-лазером функционального слоя (16) и смолы формируют межслойные микроотверстия. 2. Способ по п.1, отличающийся тем, что функциональный слой (16) меди получают методом электролитического осаждения и он имеет толщину около 5 мкм. 3. Способ по п.1 или 2, отличающийся тем, что обращенную к несущей фольге сторону функционального слоя (16) меди подвергают поверхностной обработке, способствующей более эффективному поглощению медью энергии, излучаемой CO2 ...

Method for producing laminate, and laminate

COPPER FOIL PROVIDED WITH CARRIER

Method for the production of material for printed circuits

ELECTROLYTIC PROCESS OF COPPER DEPOSIT ON an ALUMINIUM SUPPORT

STRATIFIE REVETU DE CUIVRE ET PROCEDE DE FABRICATION

STRATIFIE DANS LEQUEL LE FILM DE CUIVRE ADHERE DIRECTEMENT A LA FEUILLE DE SUPPORT. IL COMPREND UNE FEUILLE DE SUPPORT 18 EN METAL NON REVETU ET UN FILM DE CUIVRE A GRAINS FINS 14 DEPOSE EN PHASE VAPEUR, EN CONTACT DIRECT AVEC LA SURFACE DE LA FEUILLE DE SUPPORT ET ADHERANT A CELLE-CI AVEC UNE RESISTANCE AU PELAGE COMPRISE ENTRE ENVIRON 0,876 ET ENVIRON 3,502NCM. APPLICATION A LA FABRICATION DE PLAQUETTES POUR CIRCUITS IMPRIMES.

METHOD FOR MANUFACTURING FCCL CAPABLE OF CONTROLLING FLEXIBILITY AND STIFFNESS OF CONDUCTIVE PATTERN

Disclosed is a method for manufacturing an FCCL capable of controlling flexibility and stiffness of a conductive pattern. The method for manufacturing an FCCL (Flexible Copper Clad Laminate) includes: an electroforming step of forming a conductive pattern on a mold for electroforming through electroforming; and a transfer step of transferring the conductive pattern from the mold for electroforming to the bottom of a polymer plastic film, wherein the electroforming process is performed in a plating bath equipped with a first metal, a second metal and a third metal, wherein the first metal is copper (Cu), the second metal serves to add flexibility and is one of tin (Sn), gold (Au), silver (Ag) and aluminum (Al), and the third metal serves to add stiffness and is one of nickel (Ni), cobalt (Co), chrome (Cr), iron (Fe), tungsten (W) and titanium (Ti). 1. A method for manufacturing an FCCL (Flexible Copper Clad Laminate) , the method comprising:an electroforming step of forming a conductive pattern on a mold for electroforming through electroforming; anda transfer step of transferring the conductive pattern from the mold for electroforming to the bottom of a polymer plastic film,wherein the electroforming process is performed in a plating bath equipped with a first metal, a second metal and a third metal,wherein the first metal is copper (Cu), the second metal serves to add flexibility and is one of tin (Sn), gold (Au), silver (Ag) and aluminum (Al), and the third metal serves to add stiffness and is one of nickel (Ni), cobalt (Co), chrome (Cr), iron (Fe), tungsten (W) and titanium (Ti).2. The method of claim 1 , wherein the second metal is Sn.3. The method of claim 2 , wherein the third metal is Ni.4. The method of claim 1 , wherein the polymer plastic film is made of PI (Polyimide).5. A method for manufacturing an FCCL claim 1 , the method comprising:an electroforming step of forming a conductive pattern, having a metal layer made of a first metal, on a mold for ...

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND METHOD FOR PRODUCING PRINTED CIRCUIT BOARD

A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties and a sintered layer formed of a plurality of metal particles, the sintered layer being stacked on at least one surface of the base film, in which a region of the sintered layer extending from an interface between the sintered layer and the base film to a position 500 nm or less from the interface has a porosity of 1% or more and 50% or less. 1. A substrate for a printed circuit board , comprising:a base film having insulating properties; anda sintered layer formed of a plurality of metal particles, the sintered layer being stacked on at least one surface of the base film,wherein a region of the sintered layer extending from an interface between the sintered layer and the base film to a position 500 nm or less from the interface has a porosity of 1% or more and 50% or less.2. The substrate for a printed circuit board according to claim 1 , wherein a metal oxide derived from a metal of the metal particles claim 1 , a group derived from the metal oxide claim 1 , a metal hydroxide derived from the metal claim 1 , or a group derived from the metal hydroxide is present in a vicinity of an interface between the base film and the sintered layer.3. The substrate for a printed circuit board according to claim 2 , wherein the metal oxide or the group derived from the metal oxide in the vicinity of the interface between the base film and the sintered layer is present in an amount of 0.1 μg/cmor more and 10 μg/cmor less per unit area.4. The substrate for a printed circuit board according to claim 3 , wherein the metal oxide derived from the metal of the metal particles or the group derived from the metal oxide and the metal hydroxide derived from the metal or the group derived from the metal hydroxide are present claim 3 ,the ratio of an amount of the metal oxide or the group derived from the metal oxide present to an amount of the metal ...

Carrier-Attached Copper Foil, Laminate, Laminate Producing Method, Printed Wiring Board Producing Method, And Electronic Device Producing Method

Provided herein is a carrier-attached copper foil having desirable laser drillability through an ultrathin copper layer, preferred for fabrication of a high-density integrated circuit substrate. The carrier-attached copper foil includes an interlayer and an ultrathin copper layer that are provided in this order on one or both surfaces of a carrier. The surface roughness Sz and the surface roughness Sa on the interlayer side of the ultrathin copper layer satisfy Sz≦3.6 μm, and Sz/Sa≦14.00 as measured with a laser microscope in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471 after the carrier-attached copper foil is laminated to an insulating substrate from the ultrathin copper layer side under a pressure of 20 kgf/cm 2 and heated at 220° C. for 2 hours. GMD, which is a 60-degree glossiness of the ultrathin copper layer surface on the interlayer side in MD direction, satisfies GMD≦150 in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471 after the carrier-attached copper foil is laminated using the same procedure.

COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND METHOD FOR PRODUCING PRINTED CIRCUIT BOARD

There is provided a copper foil provided with a carrier exhibiting a high peeling resistance against the developer in the photoresist developing process and achieving high stability of mechanical peel strength of the carrier. The copper foil provided with a carrier comprises a carrier; an interlayer disposed on the carrier, the interlayer having a first surface adjacent to the carrier and containing 1.0 atom % or more of at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W and Ni and a second surface remote from the carrier and containing 30 atom % or more of Cu; a release layer disposed on the interlayer; and an extremely-thin copper layer disposed on the release layer. 1. A copper foil provided with a carrier , comprising:a carrier composed of glass or ceramics;an interlayer disposed on the carrier, the interlayer having a first surface adjacent to the carrier and containing 1.0 atom % or more at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W and Ni and a second surface remote from the carrier and containing 30 atom % or more of Cu;a release layer disposed on the interlayer; andan extremely-thin copper layer disposed on the release layer.2. The copper foil provided with a carrier according to claim 1 , wherein the interlayer has a thickness of 5 to 1000 nm.3. The copper foil provided with a carrier according to claim 1 , wherein the interlayer comprises;an adhesive metal layer provided on the carrier and composed of at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W and Ni; anda release assisting layer disposed on the adhesive metal layer and composed of copper.4. The copper foil provided with a carrier according to claim 3 , wherein the adhesive metal layer has a thickness of 5 to 500 nm.5. The copper foil provided with a carrier according to claim 3 , wherein the release assisting layer has a thickness of 5 to 500 nm.6. The copper foil provided with a carrier according to claim 1 , wherein ...

PRINTED WIRING BOARD, ELECTRONIC DEVICE, CATHETER, AND METALLIC MATERIAL

Provided herein is a printed wiring board that can desirably dissipate the heat of a heat-generating component. The printed wiring board includes one or more wires, and one or more heat-generating components. The one or more wires include a rolled copper foil, either partly or as a whole. The one or more heat-generating components and the one or more wires are directly or indirectly connected to each other. 1. A printed wiring board comprising:one or more wires; andone or more heat-generating components,wherein the one or more wires satisfy, either partly or as a whole, at least one of the following conditions (A) to (C):(A) the one or more wires include a rolled copper foil, either partly or as a whole,(B) the one or more wires include, either partly or as a whole, a material having a thermal conductivity of 330 W/(m·K) or more, and(C) the one or more wires include, either partly or as a whole, a material having an electrical conductivity of 88% IACS or more, andwherein the one or more heat-generating components and the one or more wires are directly or indirectly connected to each other.2. A printed wiring board comprising:one or more wires; andone or more heat-generating components,wherein the one or more heat-generating components and the one or more wires are directly or indirectly connected to each other, andwherein the one or more wires are provided with a plurality of extraction wires that is adapted to discharge heat of the heat-generating components from the printed wiring board.3. The printed wiring board according to claim 1 , wherein one of the one or more heat-generating components claim 1 , more than one of the one or more heat-generating components claim 1 , or all of the one or more heat-generating components are light-emitting components.4. The printed wiring board according to claim 2 , wherein one of the one or more heat-generating components claim 2 , more than one of the one or more heat-generating components claim 2 , or all of the one or more ...

Carrier-Attached Copper Foil, Laminate, Method For Producing Printed Wiring Board, And Method For Producing Electronic Device

Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order. The maximum ridge height Sp as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 0.193 to 3.082 μm. 1. A carrier-attached copper foil comprising a carrier , an interlayer , and an ultrathin copper layer in this order ,wherein the maximum ridge height Sp as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 0.193 to 3.082 μm.2. The carrier-attached copper foil according to claim 1 , wherein the level difference Sk of a core portion as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 0.097 to 0.937 μm.3. The carrier-attached copper foil according to claim 1 , wherein the projecting ridge height Spk as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 0.059 to 0.470 μm.4. The carrier-attached copper foil according to claim 2 , wherein the projecting ridge height Spk as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 0.059 to 0.470 μm.5. The carrier-attached copper foil according to claim 1 , wherein the actual volume Vmp of a ridge portion as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 0.003 to 0.024 μm/μm.6. The carrier-attached copper foil according to claim 2 , wherein the actual volume Vmp of a ridge portion as measured with a laser microscope according ...

Carrier-Attached Copper Foil, Laminate, Method For Producing Printed Wiring Board, And Method For Producing Electronic Device

Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order. The maximum trough depth Sv as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cmat 220° C. for 2 hours is 0.181 to 2.922 μm. 1. A carrier-attached copper foil comprising a carrier , an interlayer , and an ultrathin copper layer in this order ,{'sup': '2', 'wherein the maximum trough depth Sv as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cmat 220° C. for 2 hours is 0.181 to 2.922 μm.'}2. The carrier-attached copper foil according to claim 1 , wherein the level difference Sk of a core portion as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cmat 220° C. for 2 hours is 0.095 to 0.936 μm.3. The carrier-attached copper foil according to claim 1 , wherein the projecting trough depth Svk as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer ...

Carrier-Attached Copper Foil, Laminate, Method For Producing Printed Wiring Board, And Method For Producing Electronic Device

Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order, wherein D2-D1 is 0.30 to 3.83 μm, where D1 is the gravimetrically measured thickness of the carrier-attached copper foil excluding the carrier and the interlayer, and D2 is the maximum thickness of the layer remaining on a bismaleimide-triazine resin substrate in case of detaching the carrier after the carrier-attached copper foil is laminated to the resin substrate from the ultrathin copper layer side by being heat pressed under a pressure of 20 kgf/cm 2 at 220° C. for 2 hours.

Copper Foil with Carrier, Method of Producing Same, Copper Foil with Carrier for Printed Wiring Board, and Printed Wiring Board

Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 μm, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil. In particular, an object of the present invention is to provide a copper foil for a printed wiring board and a method of producing the copper foil, in which the adhesion strength between the copper foil and the resin can be enhanced by improvement of the roughened layer of the copper foil. 127-. (canceled)28. A copper foil with a carrier comprising a carrier , an intermediate layer , and an ultra-thin copper layer laminated in this order , wherein the ultra-thin copper layer includes a roughened layer on a surface thereof , and the roughened layer comprises particles having an average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length L1 of 0.2 to 1.0 μm and having a ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom of 15 or less.29. The copper foil with a carrier according to claim 28 , wherein the roughened layer on a surface of the ultra-thin copper layer has a ratio D2/D1 of the average diameter D2 at the particle middle being apart from the bottom of each particle by 50% of the particle length to the ...

PRODUCTION METHOD FOR MULTILAYER WIRING BOARD

A method of manufacturing a multilayer wiring board is disclosed, the method being capable of reinforcing the multilayer wiring layer and thereby improving the reliability of connection and the flatness on the surface of the multilayer wiring layer. The method includes providing a laminated sheet having a substrate, a first release layer and a metal layer; forming a first wiring layer on the metal layer; alternately stacking insulating layers and wiring layers on the laminated sheet on which the first wiring layer is formed to give a laminate provided with a multilayer wiring layer; stacking a reinforcing sheet on the laminate provided with the multilayer wiring layer at the side opposite to the laminate sheet, while interposing the second release layer; separating the substrate from the metal layer; and separating the reinforcing sheet from the laminate provided with the multilayer wiring layer to give the multilayer wiring board. 1. A method of manufacturing a multilayer wiring board , comprising the steps of:providing a laminated sheet including, in sequence, a substrate, a first release layer, and a metal layer;forming a first wiring layer on the metal layer;alternately stacking insulating layers and wiring layers on the laminated sheet on which the first wiring layer is formed to give a laminate provided with a multilayer wiring layer, the first wiring layer being incorporated in the form of an embedded wiring layer;stacking a reinforcing sheet having a lower Vickers hardness than that of the substrate on the laminate provided with the multilayer wiring layer at the side opposite to the laminated sheet, while interposing a second release layer;separating the substrate from the metal layer at the first release layer; andseparating the reinforcing sheet from the laminate provided with the multilayer wiring layer at the second release layer to give the multilayer wiring board.2. The method according to claim 1 , further comprising the step of removing the metal ...

PRODUCTION METHOD FOR MULTILAYER WIRING BOARD

A method of manufacturing a multilayer wiring board is disclosed, the method being capable of separating a substrate without large local warpage of the multilayer wiring layer and thereby improving the reliability of connection in the multilayer wiring layer. This method includes providing a laminated sheet having, in sequence, a substrate, a first release layer and a metal layer; forming a first wiring layer on the metal layer; alternately stacking insulating layers and wiring layers on the laminated sheet on which the first wiring layer is formed to give a laminate provided with a multilayer wiring layer; stacking a reinforcing sheet on the laminate provided with the multilayer wiring layer while interposing a second release layer; separating the substrate from the metal layer; and separating the reinforcing sheet from the laminate provided with the multilayer wiring layer to give the multilayer wiring board. 1. A method of manufacturing a multilayer wiring board , comprising the steps of:providing a laminated sheet including, in sequence, a substrate, a first release layer, and a metal layer;forming a first wiring layer on the metal layer;alternately stacking insulating layers and wiring layers on the laminated sheet on which the first wiring layer is formed to give a laminate provided with a multilayer wiring layer, the first wiring layer being incorporated in the form of an embedded wiring layer;stacking a reinforcing sheet on the laminate provided with the multilayer wiring layer at the side opposite to the laminated sheet, while interposing a second release layer exhibiting a higher release strength than that of the first release layer;separating the substrate from the metal layer at the first release layer; andseparating the reinforcing sheet from the laminate provided with the multilayer wiring layer at the second release layer to give the multilayer wiring board.2. The method according to claim 1 , further comprising the step of removing the metal layer by ...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on first surface side of the laminate and first via conductors on second surface side of the laminate, and a solder resist layer interposed between the plate and the laminate and having openings formed such that the openings are exposing the first pads. The laminate has first surface on the first surface side and second surface on the second surface side on the opposite side and includes a first resin insulating layer forming the second surface of the laminate, and the first conductors are formed through the first insulating layer such that the first vias are tapering from the first surface side toward the second surface side of the laminate and have end surfaces recessed from the second surface of the laminate on the second surface side of the laminate. 1. A printed wiring board , comprising:a support plate;a laminate found on the support plate and comprising a plurality of first conductor pads on a first surface side of the laminate and a plurality of first via conductors on a second surface side of the laminate; anda solder resist layer interposed between the support plate and the laminate and having a plurality of openings formed such that the openings are exposing the first conductor pads respectively,wherein the laminate has a first surface on the first surface side and a second surface on the second surface side on an opposite side with respect to the first surface of the laminate and includes a first resin insulating layer forming the second surface of the laminate, and the plurality of first via conductors is formed through the first resin insulating layer such that the first via conductors are tapering from the first surface side toward the second surface side of the laminate and have end surfaces recessed from the second surface of the laminate on the second surface side of the laminate respectively.2. A printed wiring board according ...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on first surface side of the laminate and second conductor pads on second surface side of the laminate, and a solder resist layer interposed between the support plate and laminate and having openings formed such that the openings are exposing the first pads. The laminate includes a resin insulating layer and has a first surface on the first surface side and a second surface on the second surface side on the opposite side, and a via conductor structure penetrating from the first surface to the second surface of the laminate such that the via structure includes via conductors formed in the insulating layer and tapering from the first surface side toward second surface side of the laminate, and the second pads are protruding from the second surface of the laminate. 1. A printed wiring board , comprising:a support plate;a laminate formed on the support plate and comprising a plurality of first conductor pads on a first surface side of the laminate and a plurality of second conductor pads on a second surface side of the laminate; anda solder resist layer interposed between the support plate and the laminate and having a plurality of openings formed such that the openings are exposing the first conductor pads respectively,wherein the laminate includes a resin insulating layer and has a first surface on the first surface side and a second surface on the second surface side on an opposite side with respect to the first surface of the laminate, and a via conductor structure penetrating from the first surface to the second surface of the laminate such that the via conductor structure comprises a plurality of via conductors formed in the resin insulating layer and tapering from the first surface side toward the second surface side of the laminate, and the plurality of second conductor pads is protruding from the second surface of the laminate respectively. ...

COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND METHOD FOR PRODUCING PRINTED CIRCUIT BOARD

There is provided a copper foil provided with a carrier exhibiting a high peeling resistance against the developer in the photoresist developing process and achieving high stability of mechanical peel strength of the carrier. The copper foil provided with a carrier comprises a carrier; an interlayer disposed on the carrier, the interlayer having a first surface adjacent to the carrier and containing 1.0 atom % or more of at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W and Ni and a second surface remote from the carrier and containing 30 atom % or more of Cu; a release layer disposed on the interlayer; and an extremely-thin copper layer disposed on the release layer. 1 a carrier;', 'an interlayer disposed on the carrier;', 'a release layer disposed on the interlayer; and', 'an extremely-thin copper layer disposed on the release layer,, 'providing a copper foil including a carrier as a support; wherein the copper foil provided with a carrier comprisesforming a wiring layer on a surface of the extremely-thin copper layer to prepare a coreless support including a wiring layer;forming a build-up layer on a surface having the wiring layer of the coreless support including the wiring layer;mounting an electronic element on the coreless support to prepare a laminate;separating the laminate to prepare a multilayer wiring board including the build-up layer;performing selective etching to expose a wiring layer of the multilayer wiring board; andproviding an outer layer pad on a surface of the wiring layer.. A method for manufacturing a printed wiring board, the method comprising: The present application is a Continuation of U.S. application Ser. No. 16/397,449, filed Apr. 29, 2019, which is a Continuation of U.S. application Ser. No. 16/080,442, filed Aug. 28, 2018, now issued as U.S. Pat. No. 10,356,915, which is a National stage of International Patent Application No. PCT/JP2017/006423, filed Feb. 21, 2017, which claims priority to International ...

COPPER FOIL PROVIDED WITH CARRIER, LAMINATE, PRINTED WIRING BOARD, ELECTRONIC DEVICE AND METHOD FOR FABRICATING PRINTED WIRING BOARD

Provided is a copper foil provided with a carrier in which the laser hole-opening properties of the ultrathin copper layer are good and which is suitable for producing a high-density integrated circuit substrate. A copper foil provided with a carrier having, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein the specular gloss at 60° in an MD direction of the intermediate layer side surface of the ultrathin copper layer is 140 or less. 1. A copper foil provided with a carrier comprising , in order , a carrier , an intermediate layer , and an ultrathin copper layer , wherein at least one of the following (a) and (b) is satisfied:(a) a specular gloss at 60° in a machine direction (MD) of the intermediate layer side surface of the ultrathin copper layer is 140 or less;(b) a specular gloss at 60° in a transverse direction (TD) of the intermediate layer side surface of the ultrathin copper layer is 65 or less.2. The copper foil provided with a carrier according to claim 1 , wherein a specular gloss at 60° in a machine direction (MD) of the intermediate layer side surface is 130 or less.3. The copper foil provided with a carrier according to claim 2 , wherein a specular gloss at 60° in a machine direction (MD) of the intermediate layer side surface is 120 or less.4. The copper foil provided with a carrier according to claim 1 , wherein a specular gloss at 60° in a transverse direction (TD) of the intermediate layer side surface of the ultrathin copper layer is 60 or less.5. The copper foil provided with a carrier according to claim 1 , wherein a specular gloss at 60° in a transverse direction (TD) of the intermediate layer side surface of the ultrathin copper layer is 55 or less.6. The copper foil provided with a carrier according to claim 1 , wherein a specular gloss at 60° in a machine direction (MD) of the intermediate layer side surface of the ultrathin copper layer/a specular gloss at 60° in a transverse direction (TD) of the ...

Copper foil structure having blackened ultra-thin foil and manufacturing method thereof

A copper foil structure having blackened ultra-thin copper foil of the instant disclosure includes a carrier foil, a blackened layer, a release layer, and an ultra-thin copper foil. The carrier foil includes a matte surface and a shiny surface wherein the blackened layer is disposed thereon. The release layer is disposed on the blackened layer formed with one selected from the group: copper, cobalt, nickel, and manganese while the release layer is formed with one selected from the group: molybdenum, nickel, chromium, and potassium. Successively, the ultra-thin copper foil is disposed on the release layer. Laser drilling can apply to the blackened ultra-thin copper foil on the inner layers of a high density multi-layer printed wiring board, thus eliminating the traditional blackening or browning chemical process. The blackened ultra-thin copper foil in combination with a polyimide thin (PI) or other substrate materials displays desirable appearance.

RESIN-COATED COPPER FOIL FOR MANUFACTURING A PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD USING THE SAME

A resin-coated copper foil includes: a copper foil layer including a first surface and a second surface, wherein a laser absorptance of the first surface of the copper foil layer is greater than a laser absorptance of the second surface of the copper foil layer, and wherein ribs are formed on the second surface of the copper foil layer; a carrier film disposed on the first surface of the copper foil layer; a primer resin layer disposed on the second surface of the copper foil layer; and a build-up resin layer disposed on the primer resin layer. 1. A resin-coated copper foil , comprising:a copper foil layer comprising a first surface and a second surface, wherein a laser absorptance of the first surface of the copper foil layer is greater than a laser absorptance of the second surface of the copper foil layer, and wherein ribs are formed on the second surface of the copper foil layer;a carrier film disposed on the first surface of the copper foil layer;a primer resin layer disposed on the second surface of the copper foil layer; anda build-up resin layer disposed on the primer resin layer.2. The resin-coated copper foil of claim 1 , wherein the first surface of the copper foil layer is surface-treated with at least one selected from the group consisting of Ni claim 1 , Co and Zn.3. The resin-coated copper foil of claim 1 , wherein a thickness of the copper foil layer is about 0.2 μm to about 3.0 μm.4. The resin-coated copper foil of claim 1 , wherein the primer resin layer comprises at least one selected from the group consisting of an epoxy resin claim 1 , a polyimide resin claim 1 , a polyamide-imide resin claim 1 , a polyamide resin claim 1 , a liquid crystal polymer resin claim 1 , and a cycloolefin resin.5. The resin-coated copper foil of claim 1 , wherein the primer resin layer comprises at least one of a metal oxide filler and an organic filler in an amount greater than 0 wt % and less than about 10 wt %.6. The resin-coated copper foil of claim 1 , wherein the ...

RESIN COMPOSITION ELIMINATING VOLATILE LOSS OF INITIATING SPECIES FOR THE PREPARATION OF PRINTED CIRCUIT BOARD LAMINATES

An enhanced prepreg for printed circuit board (PCB) laminates includes a substrate and a resin applied to the substrate. The resin includes a curable polymer and a polymerization initiator polymer having a backbone with a free radical initiator forming segment that breaks apart upon being subjected to heat to generate a plurality of non-volatile initiating species. This resin composition eliminates possible volatile loss of the free radical initiator during all processing steps in the preparation of PCB laminates. The resin may additionally include a cross-linking agent, flame retardant and viscosity modifiers. In one embodiment, a sheet of woven glass fibers is impregnated with the resin and subsequently dried or cured. The glass cloth substrate may include a silane coupling agent to couple the resin to the substrate. In another embodiment, resin coated copper (RCC) is prepared by applying the resin to copper and subsequently curing the resin. 1. A resin , comprising:a curable polymer; anda polymerization initiator polymer having a backbone with a free radical initiator forming segment that breaks apart upon being subjected to heat to generate a plurality of non-volatile initiating species, wherein each of the plurality of non-volatile initiating species has a molecular weight in excess of 1000.2. The resin as recited in claim 1 , wherein the polymerization initiator polymer is a modified polyphenylene ether (PPE) that is blended in the resin with a conventional resin that includes an unmodified PPE.6. A cured resin comprising the reaction product of a resin comprising:a curable polymer; anda polymerization initiator polymer having a backbone with a free radical initiator forming segment that breaks apart upon being subjected to heat to generate a plurality of non-volatile initiating species, wherein each of the plurality of non-volatile initiating species has a molecular weight in excess of 1000.7. The cured resin as recited in claim 6 , wherein the polymerization ...

SEMI-FINISHED PRODUCT FOR THE PRODUCTION OF CONNECTION SYSTEMS FOR ELECTRONIC COMPONENTS AND METHOD

A semi-finished product for the production of connection systems for electronic components comprises two groups (A, B) of alternately applied conductive layers and insulating layers, wherein outer layers () of the two groups (A, B) are facing each other to form a separation area for the groups (A, B) to be separated from each other to yield connection systems for electronic components and the separation area is overlapped and sealed on all sides thereof at least by the two insulating layers () following the separation area. The method for the production of connection systems for electronic components is characterized by the following steps: a) orienting two groups (A, B) of alternately applied conductive layers and insulating layers () to face each other with outer layers to form a separation area for the groups (A, B) to be separated from each other and safeguarding that the separation area is overlapped and sealed on all sides thereof at least by the two insulating layers () following the separation area, b) processing the groups (A, B) of alternately applied conductive layers and insulating layer, c) cutting through the separation area along the edges thereof. 1224422. A semi-finished product for the production of connection systems for electronic components , the semi-finished product comprising two groups (A , B) of alternately applied conductive layers and insulating layers , wherein outer layers ( , ′) of the two groups (A , B) are facing each other to form a separation area for the groups (A , B) to be separated from each other to yield connection systems for electronic components , wherein the separation area is overlapped and sealed on all sides thereof at least by the two insulating layers ( , ′) following the separation area , wherein the outer layers ( , ′) are closely held together without bonding.222. The semi-finished product according to claim 1 , wherein the outer layers ( claim 1 , ′) facing each other are conductive layers.3. The semi-finished ...

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

There is provided a method for manufacturing a printed circuit board including: preparing a substrate having a conductive layer formed on at least a portion thereof; forming an insulating layer formed with an opening through which a portion of the conductive layer is exposed on the substrate; forming a plating seed layer on the insulating layer and the exposed conductive layer; forming an electroplating layer on the plating seed layer by overplating the plating seed layer; and etching the overplated portion in a lump to form a circuit layer in the opening. 1. A method for manufacturing a printed circuit board , the method comprising:preparing a substrate having a conductive layer formed on at least a portion thereof;forming an insulating layer formed with an opening through which a portion of the conductive layer is exposed on the substrate;forming a plating seed layer on the insulating layer and the exposed conductive layer;forming an electroplating layer on the plating seed layer by overplating the plating seed layer; andetching the overplated portion in a lump to form a circuit layer in the opening.2. The method of claim 1 , wherein the forming of the electroplating layer includes overplating the plating seed layer until an exposed surface of the electroplating layer is planarized.3. The method of claim 1 , wherein the etching of the overplated portion in a lump includes etching the overplated portion in a lump until the insulating layer is exposed.4. The method of claim 1 , wherein the etching of the overplated portion in a lump includes etching the overplated portion in a lump so that the electroplating layer and the plating seed layer of 1 μm or less remains outside the insulating layer and the electroplating layer and the plating seed layer of 1 μm or less which are formed outside the insulating layer serve as the plating seed layer for forming additional circuit layer.5. The method of claim 1 , wherein the forming of the plating seed layer includes forming ...

Method for producing circuit board and circuit board producing apparatus, and method for producing integrated circuit using the same

A method for producing a circuit board includes providing a substrate on which a toner image formed of a thermoplastic toner has been formed and forming a conductive foil layer having a thickness of 0.1 μm to 2 μm on the toner image that has been formed on the substrate and then applying heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil.

Printing method using two lasers

The invention relates to a laser printing method that includes the following steps: (a) the provision of a receiver substrate ( 4 ); (b) the provision of a target substrate ( 5 ) comprising a transparent substrate ( 50 ) one surface of which has a coating has a coating ( 51 ) constituted of a solid metal film; (c) the localised irradiation of the said film ( 51 ) through the said transparent substrate ( 50 ) by means of a first laser ( 6 ) in order to reach the melting temperature of the metal in a target zone of the said film which is in liquid form; (d) the irradiation of the said liquid film through the said transparent substrate by means of a second laser on the said target zone defined in the step (c), in order to form a liquid jet in the said target zone and bring about the ejection thereof from the substrate in the form of molten metal; (e) the depositing on the receiver substrate of a molten metal drop over a defined receiving zone, with the said drop solidifying upon cooling.

METAL FOILS WITH ORDERED CRYSTAL STRUCTURE AND METHOD FOR PRODUCING METAL FOILS

A method for producing a metal foil comprising depositing metal onto an oxidizable substrate to form a metal film on the substrate; oxidizing the substrate at an interface between the metal film and the substrate; and removing the metal film from the substrate to yield a metal foil. A method for forming a thin metal film comprising pre-polarizing a single-crystal Si substrate by application of a potential which is negative of a potential at which Si oxidizes, which pre-polarization occurs in the presence of metal ions to form metal growth nucleation sites on the substrate, followed by application of a potential at which both oxidation of Si and electrodeposition of the metal occur to grow the metal film and oxidize the Si to SiOx, which potential is more positive than the potential applied in the pre-polarization step. 1. A method for producing a metal foil comprising:depositing metal onto an oxidizable substrate to form a metal film on the substrate;oxidizing the substrate at an interface between the metal film and the substrate;and removing the metal film from the substrate to yield a metal foil.2. The method of wherein the metal is Au claim 1 , Ag claim 1 , Cu claim 1 , Au-based claim 1 , Ag-based claim 1 , or Cu-based.3. The method of wherein the metal film has a thickness between about 5 and about 50 nm.4. The method of wherein the substrate comprises Si.5. The method of wherein the substrate comprises single crystal Si.6. The method of wherein the substrate is single-crystal Si (111) and the metal film is single-crystal Au (111).7. The method of wherein the substrate is single-crystal Si (100) and the metal film is single-crystal Cu (100).8. The method of wherein the oxidizing comprises directing light energy through the metal film to impact the substrate at the interface.9. The method of wherein the oxidizing comprises submerging the metal film and substrate in an acidic solution and directing light energy through the metal film to impact the substrate at the ...

TEMPORARY CARRIER PLATE AND MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD FOR PACKAGING SUBSTRATE

A temporary carrier plate according to an embodiment of the present disclosure includes a first carrier core layer, a first copper foil layer on the first carrier core layer, a second carrier core layer on the first copper foil layer, and a second copper foil layer on the second carrier core layer, wherein the first copper foil layer includes physically press-fitted first outer-layer copper foil and first inner-layer copper foil, and the second copper foil layer includes physically press-fitted second outer-layer copper foil and second inner-layer copper foil. 1. A temporary carrier plate , comprising:a first carrier core layer;a first copper foil layer on the first carrier core layer;a second carrier core layer on the first copper foil layer; anda second copper foil layer on the second carrier core layer,wherein the first copper foil layer comprises physically press-fitted first outer-layer copper foil and first inner-layer copper foil, and the second copper foil layer comprises physically press-fitted second outer-layer copper foil and second inner-layer copper foil.2. The temporary carrier plate according to claim 1 , wherein the first copper foil layers are provided on two sides of the first carrier core layer respectively claim 1 , the second carrier core layers are provided on both of the first copper foil layers claim 1 , and the second copper foil layer is provided on a surface of the second carrier core layer.3. The temporary carrier plate according to claim 1 , wherein the first carrier core layer comprises an epoxy fiberglass cloth laminate plate and an epoxy resin layer on the surface of the epoxy fiberglass cloth laminate plate claim 1 , and the second carrier core layer comprises an epoxy resin layer.4. The temporary carrier plate according to claim 1 , wherein a thickness of the first outer-layer copper foil near one side of the second carrier core layer is greater than the thickness of the first inner-layer copper foil away from one side of the ...

SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, RESIN SUBSTRATE, PRINTED WIRING BOARD, COPPER CLAD LAMINATE AND METHOD FOR PRODUCING PRINTED WIRING BOARD

The present invention provides a surface-treated copper foil capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The present invention also provides a resin substrate provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil of the present invention is a surface-treated copper foil, wherein a surface-treated layer is formed on a copper foil, and the proportion of the area corresponding to the particles of the surface of the surface-treated layer is 0.1 to 0.85. 1. A surface-treated copper foil , wherein a surface-treated layer is formed on a copper foil , and the proportion of the area corresponding to the particles of the surface of the surface-treated layer is 0.1 to 0.85.2. A surface-treated copper foil , wherein a surface-treated layer is formed on a copper foil , and the proportion of the area corresponding to the particles of the surface of the surface-treated layer is 0.1 to 0.7.3. A surface-treated copper foil , wherein a surface-treated layer is formed on a copper foil , and the average diameter of the particles on the surface of the surface-treated layer is 0.03 to 0.28 μm.4. A surface-treated copper foil , wherein a surface-treated layer is formed on a copper foil , and the average diameter of the particles on the surface of the surface-treated layer is 0.05 to 0.28 μm.5. A surface-treated copper foil , wherein a surface-treated layer is formed on a copper foil , and the number density of the particles on the surface of the surface-treated layer is 3.8 to 430 particles/μm.6. A surface-treated copper foil , wherein a surface-treated layer is formed on a copper foil , and the number density of the particles on the surface of the surface-treated layer is 3.8 ...

Surface-treated copper foil, manufacturing method therefor, printed circuit board copper-clad laminate, and printed circuit board

There is provided a copper foil having a surface coating layer that can achieve a high bonding strength to a resin layer even if the copper foil has an extremely smooth surface such as one formed by vapor deposition, for example, sputtering and also has a desirable insulation resistance suitable for achieving a fine pitch in a printed wiring board. A surface-treated copper foil according to the present invention includes a copper foil and a silicon-based surface coating layer provided on at least one surface of the copper foil, the silicon-based surface coating layer being mainly composed of silicon (Si). The silicon-based surface coating layer has a carbon content of 1.0 to 35.0 atomic % and an oxygen content of 12.0 to 40.0 atomic % relative to a total content in 100 atomic % of carbon (C), oxygen (O) and silicon (Si) elements as measured by X-ray photoelectron spectroscopy (XPS).

Circuit board

A circuit board includes a substrate having a through hole, a circuit layer, a first measurement mark and a second measurement mark. According to the first and second measurement marks, an electronic detection device can measure a first distance between a first edge of the through hole and the first measurement mark and a second distance between a second edge of the through hole and the second measurement mark to determine whether the through hole has an undesired size or shift.

Scalable, Printable, Patterned Sheet of High Mobility Graphene On Flexible Substrates

The present invention provides methods for fabricating graphene workpieces. The present invention also provides for products produced by the methods of the present invention and for apparatuses used to perform the methods of the present invention.

Method for preparing novel material layer structure of high-frequency circuit board and article thereof

The present invention discloses a method for preparing a novel material layer structure of a high-frequency circuit board, comprising the steps of: (1) coating a synthetic liquid TFP film on a cured PI film; (2) delivering the same to a tunnel oven for roasting in sections to form a semi-cured TFP film on a front surface of the cured PI film; and (3) hot pressing a copper foil on the semi-cured TFP film to obtain a novel single-sided material layer structure of a high-frequency circuit board. The present invention also discloses a novel material layer structure of a high-frequency circuit board prepared by performing the above-mentioned method. The prepared novel material layer structure of the high-frequency circuit board has the performance of high-speed transmission of high-frequency signals, and can adapt to the current high-frequency and high-speed trend from wireless network to terminal applications, especially for new 5G technology products. It can be used as a circuit board preparation material to manufacture a circuit board structure, such as a single-layer circuit board, a multi-layer flexible circuit board and a multi-layer soft-hard combined board, which brings great convenience to subsequent preparation for the circuit board and simplifies the process.

METHOD FOR MANUFACTURING WIRING BOARD OR WIRING BOARD MATERIAL

Provide are a method for manufacturing a wiring board or a wiring board material, and the wiring board obtained by the method, which allows columnar metal members to be inserted into the wiring board at once using a simple operation, enables alignment without requiring strict accuracy, can handle columnar metal members having different shapes, and imparts sufficiently high adhesive strength to the columnar metal members. 1. A method for manufacturing a wiring board or a wiring board material , the method comprising the steps of:preparing a laminate material including a support sheet having a plurality of columnar metal members formed thereon, and a wiring board or a wiring board material having a plurality of openings in portions corresponding to the columnar metal members such that the columnar metal members are positioned in the respective openings;obtaining a laminate including a thermosetting resin filled and cured between an inner surface of each of the openings of the wiring board or the wiring board material and each of the columnar metal members; andpeeling at least the support sheet from the laminate.2. A method for manufacturing a wiring board or a wiring board material , the method comprising the steps of:forming a plurality of columnar metal members on a support sheet;laminating a laminate material including the support sheet having the columnar metal members formed thereon, a wiring board or a wiring board material having a plurality of openings in portions corresponding to the columnar metal members, and a prepreg having a plurality of openings in portions corresponding to the columnar metal members and containing a thermosetting resin such that the columnar metal members are positioned in the respective openings;integrating the laminate material by heating and pressing to obtain a laminate including a thermosetting resin filled between an inner surface of each of the openings of the wiring board or the wiring board material and each of the columnar ...

SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, RESIN SUBSTRATE, PRINTED WIRING BOARD, COPPER CLAD LAMINATE AND METHOD FOR PRODUCING PRINTED WIRING BOARD

The present invention provides a surface-treated copper foil capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The present invention also provides a resin substrate provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil of the present invention is a surface-treated copper foil having a surface-treated layer formed on a copper foil, and the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 μm. 1. A surface-treated copper foil , wherein a surface treated layer is formed on a copper foil , and the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 μm.2. The surface-treated copper foil according to claim 1 , wherein a surface-treated layer is formed on a copper foil claim 1 , and the ratio B/A of the three-dimensional surface area B to the two-dimensional surface area A of the surface of the surface-treated layer is 1.05 to 1.8.3. The surface-treated copper foil according to or claim 1 , wherein when the surface-treated copper foil is bonded claim 1 , via the surface-treated layer side thereof claim 1 , to a resin substrate and the surface-treated copper foil is removed claim 1 , the surface roughness Sz of the surface claim 1 , on the copper foil removal side claim 1 , of the resin substrate is 1 to 5 μm.4. The surface-treated copper foil according to any one of to claim 1 , wherein when the surface-treated copper foil is bonded claim 1 , via the surface-treated layer side thereof claim 1 , to a resin substrate and the surface-treated copper foil is removed claim 1 , the ratio B/A of the three-dimensional surface area B to the two-dimensional surface area A of the surface claim 1 , on the copper foil removal side ...

SUBSTRATE OR PANEL WITH RELEASABLE CORE

Generally discussed herein are systems and apparatuses that can include a base with one or more recesses therein. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include providing a releasable core, the releasable core including a first conductive foil integrally coupled with a base at a first side of the base and a first side of the conductive foil, the first conductive foil situated in a first recess in the first side of the base. The technique can include releasably coupling a second conductive foil to a second side of the first conductive foil through a temporary adhesive layer integrally coupled to a first side of the second conductive foil, the second side of the first conductive foil opposite the first side of the first conductive foil. 1. A device comprising:an adhesive layer;a first foil coupled with a first side of the adhesive layer, the first foil including a first width in a cross-section of the device;a second foil coupled with a second side of the adhesive layer at a first side of the second foil, the second side of the adhesive layer opposite the first side of the adhesive layer, the second foil including a second width in the cross-section of the device, the second width less than the first width; anda base coupled to a second side of the second foil, the second side of the second foil opposite the first side of the second foil.2. The device of claim 1 , wherein the adhesive layer includes an epoxy claim 1 , resin claim 1 , or a combination thereof3. The device of claim 1 , wherein the adhesive layer includes a resin.4. The device of claim 1 , wherein the base includes a cloth.5. The device of claim 4 , wherein the base further includes a resin.6. The device of claim 1 , wherein the base includes a recess and the second foil is situated claim 1 , at least partially in the recess.7. The device of claim 1 , wherein the second foil ...

METAL-CLAD LAMINATE AND PRINTED WIRING BOARD

A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer. 1. A metal-clad laminate comprising:an insulating layer, and a metal layer present on at least one surface side of the insulating layer, whereinthe insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer,the center layer contains a cured product of a resin composition, and a fiber base material,the first resin layer and the second resin layer are formed of cured products of resin compositions, respectively,the resin composition in the center layer contains a thermosetting resin,a resin contained in the resin composition in the center layer is different from resins contained in the resin compositions in the first resin layer and the second resin layer, anda coefficient of thermal expansion of the cured product of the resin composition contained in the first resin layer and a coefficient of thermal expansion of the cured product of the resin composition contained in the second resin layer are between 10% and 70%, respectively, of a coefficient of thermal expansion of the cured product of the resin composition contained in the ...

Surface-Treated Metal Material, Metal Foil With Carrier, Connector, Terminal, Laminate, Shielding Tape, Shielding Material, Printed Wiring Board, Processed Metal Member, Electronic Device, And Method For Manufacturing Printed Wiring Board

A surface-treated metal material good in heat absorbency and heat releasability is provided. The surface-treated metal material has a heat conductivity of 32 W/(m·K) or higher; and a color difference ΔL based on JIS Z8730 of the surface thereof satisfying ΔL≦−40. 1. A surface-treated metal material having:a heat conductivity of 32 W/(m·K) or higher; anda color difference ΔL based on JIS Z8730 of a surface thereof satisfying ΔL≦−40.2. The surface-treated metal material according to claim 1 , wherein with respect to color differences ΔL claim 1 , Δa based on JIS Z8730 of a surface thereof claim 1 ,when Δa≦0.23, ΔL satisfies ΔL≦−40;when 0.23<Δa≦2.8, ΔL satisfies ΔL≦−8.5603×Δa−38.0311; andwhen 2.8<Δa, ΔL satisfies ΔL≦−62.3. The surface-treated metal material according to claim 1 , wherein with respect to color differences ΔL claim 1 , Δb based on JIS Z8730 of a surface thereof claim 1 ,when Δb≦−0.68, ΔL satisfies ΔL≦−40;when −0.68<Δb≦0.83, ΔL satisfies ΔL≦−2.6490×Δb−41.8013;when 0.83<Δb≦1.2, ΔL satisfies ΔL≦−48.6486×Δb−3.6216; andwhen 1.2<Δb, ΔL satisfies ΔL≦−62.4. The surface-treated metal material according to claim 1 , wherein with respect to color differences ΔL claim 1 , Δa based on JIS Z8730 of a surface thereof claim 1 ,when Δa≦0.23, ΔL satisfies ΔL≦−40;when 0.23<Δa≦2.8, ΔL satisfies ΔL≦−8.5603×Δa−38.0311; andwhen 2.8<Δa, ΔL satisfies ΔL≦−62, andwith respect to color differences ΔL, Δb based on JIS Z8730 of the surface thereof,when Δb≦−0.68, ΔL satisfies ΔL≦−40;when −0.68<Δb≦0.83, ΔL satisfies ΔL≦−2.6490×Δb−41.8013;when 0.83<Δb≦1.2, ΔL satisfies ΔL≦−48.6486×Δb−3.6216; andwhen 1.2<Δb, ΔL satisfies ΔL≦−62.5. The surface-treated metal material according to claim 1 , wherein the color difference ΔL satisfies ΔL≦−45.6. The surface-treated metal material according to claim 5 , wherein the color difference ΔL satisfies ΔL≦−55.7. The surface-treated metal material according to claim 6 , wherein the color difference ΔL satisfies ΔL≦−60.8. The surface-treated metal ...

COPPER FOIL PROVIDED WITH CARRIER, LAMINATE, PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR FABRICATING PRINTED WIRING BOARD

Provided is a copper foil provided with a carrier which enables to form an extremely fine circuit and to suppress the disconnection of a circuit well. A copper foil provided with a carrier having, in order, an intermediate layer and an ultrathin copper layer on one side or both sides of the carrier, wherein the ultrathin copper layer is an electrolytic copper layer; and the thickness of the ultrathin copper layer measured by using a gravimetric method is 1.5 μm or less and the number of pinholes in the ultrathin copper layer is 0 pinholes/mor more and 5 pinholes/mor less. 1. A copper foil provided with a carrier comprising , in order , an intermediate layer and an ultrathin copper layer on one side or both sides of the carrier , whereinthe ultrathin copper layer is an electrolytic copper layer; and{'sup': 2', '2, 'a thickness of the ultrathin copper layer measured by using a gravimetric method is 1.5 μm or less and a number of pinholes in the ultrathin copper layer is 0 pinholes/mor more and 5 pinholes/mor less.'}2. A copper foil provided with a carrier comprising , in order , an intermediate layer and an ultrathin copper layer on one side or both sides of the carrier , whereinthe ultrathin copper layer is an electrolytic copper layer; and{'sup': 2', '2, 'a thickness of the ultrathin copper layer measured by using a gravimetric method is less than 1.0 μm and a number of pinholes in the ultrathin copper layer is 0 pinholes/mor more and 10 pinholes/mor less.'}3. The copper foil provided with a carrier according to claim 1 , wherein a thickness of the ultrathin copper layer measured by using the gravimetric method is 0.15 to 0.85 μm.4. The copper foil provided with a carrier according to claim 2 , wherein a thickness of the ultrathin copper layer measured by using the gravimetric method is 0.15 to 0.85 μm.5. The copper foil provided with a carrier according to claim 2 , wherein a number of pinholes in the ultrathin copper layer is 0 pinholes/mor more and 5 pinholes/mor ...

COPPER FOIL PROVIDED WITH CARRIER, LAMINATE, PRINTED WIRING BOARD, AND METHOD FOR FABRICATING PRINTED WIRING BOARD

Provided is a copper foil provided with a carrier which enables, in a laminate produced by laminating a copper foil provided with a carrier on a resin substrate, to peel the ultrathin copper layer from the carrier well. A copper foil provided with a carrier having, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein, when the surface of the carrier opposite to the ultrathin copper layer is measured using a laser microscope based on JIS B0601-1994, the ten point average roughness Rz of the surface is 6.0 μm or less. 1. A copper foil provided with a carrier comprising , in order , a carrier , an intermediate layer , and an ultrathin copper layer , wherein at least one of the following (i-a) to (iii-a) is satisfied:(i-a) when a surface of the carrier opposite to the ultrathin copper layer is measured using a laser microscope based on JIS B0601-1994, a ten point average roughness Rz of the surface is 6.0 μm or less;(ii-a) when a surface of the carrier opposite to the ultrathin copper layer is measured using a laser microscope based on JIS B0601-1994, an arithmetic average roughness Ra of the surface is 1.0 μm or less;(iii-a) when a surface of the carrier opposite to the ultrathin copper layer is measured using a laser microscope based on JIS B0601-2001, a maximum cross-sectional height Rt in a roughness curve of the surface is 7.0 μm or less.2. The copper foil provided with a carrier according to claim 1 , wherein at least one of the following (i-b) to (iii-b) is satisfied:(i-b) when a surface of the carrier opposite to the ultrathin copper layer is measured using a laser microscope based on JIS B0601-1994, a ten point average roughness Rz of the surface is 0.9 μm or more;(ii-b) when a surface of the carrier opposite to the ultrathin copper layer is measured using a laser microscope based on JIS B0601-1994, an arithmetic average roughness Ra of the surface is 0.12 μm or more;(iii-b) when a surface of the carrier opposite to the ultrathin ...

Embedded printed circuit board

Provided is an embedded printed circuit board, including: a first insulating substrate including a first cavity and a second cavity; a first element disposed in the first cavity; an adhesive layer for adhering the first insulating substrate to the first element and including an opening to which the first element is exposed; and an second insulating substrate forming a bonding layer of a lower surface of the first insulating substrate and a bottom surface of the second cavity.

Method For Producing A Foil Arrangement And Corresponding Foil Arrangement

A method for producing a foil arrangement includes structuring a conductive foil to be applied or applied onto a support foil upper side of a support foil and coating a conductive foil upper side of the structured conductive foil with a protective layer. A cover foil is laminated onto the support foil upper side and onto a protective layer upper side of the protective layer after the coating step.

Electronic product and manufacturing method thereof

A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a film, wherein the conductive circuit is made of a conductive metal layer, the conductive metal layer is a metal foil and the conductive metal layer is patterned to form the conductive circuit. Then, an electronic element is disposed on the conductive circuit of the film, and the electronic element is electrically connected to the conductive circuit. Then, the film and a supporting structure are combined by an out-mold forming technology or an in-mold forming technology, such that the electronic element is wrapped between the film and the supporting structure.

Circuit board structure and manufacturing method thereof

A method of manufacturing circuit board structure includes forming a sacrificial layer having first openings on a substrate; forming a metal layer on the sacrificial layer; forming a patterned photoresist layer having second openings over the sacrificial layer, in which the second openings are connected to the first openings and expose a portion of the metal layer; forming a first circuit layer filling the second openings and the first openings; forming a first dielectric layer over the sacrificial layer and covering the metal layer, in which the first dielectric layer has third openings exposing the first circuit layer; forming a second circuit layer filling the third openings and covering a portion of the first dielectric layer; removing the substrate to expose the sacrificial layer, a portion of the metal layer and a portion of the first circuit layer; and removing the sacrificial layer and the metal layer.

Manufacturing method of circuit board assembly for high frequency signal transmission

A manufacturing method of copper foil and circuit board assembly for high frequency transmission are provided. Firstly, a raw copper foil having a predetermined surface is produced by an electrolyzing process. Subsequently, a roughened layer including a plurality of copper particles is formed on the predetermined surface by an arsenic-free electrolytic roughening treatment and an arsenic-free electrolytic surface protection treatment. Thereafter, a surface treatment layer is formed on the roughened layer, and the roughened layer is made of a material which includes at least one kind of non-copper metal elements and the concentration of the non-copper metal elements is smaller than 400 ppm. By controlling the concentration of the non-copper elements, the resistance of the copper foil can be reduced.

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

A printed wiring board includes a laminate, a wiring layer formed on first main surface of the laminate and including conductor pads, via conductors including first and second via conductors and formed in the laminate such that each via conductor has diameter gradually reducing from the first main surface toward second main surface of the laminate, and conductor post formed on the first via conductors such that each conductor post includes a metal foil and a plating layer formed on the metal foil. The via conductors are formed such that the first via conductors are positioned in an outer edge portion of the laminate and have minimum-diameter-side surfaces positioned to form a same plane with the second main surface of the laminate and that the second via conductors are positioned in a central portion of the laminate and have minimum-diameter-side surfaces recessed from the second main surface of the laminate. 1. A printed wiring board , comprising:a laminate;a wiring layer formed on a first main surface of the laminate and comprising a plurality of conductor pads;a plurality of via conductors including a plurality of first via conductors and a plurality of second via conductors and formed in the laminate such that each of the via conductors has a diameter gradually reducing from the first main surface toward a second main surface of the laminate on an opposite side with respect to the first main surface; anda plurality of conductor post formed on the plurality of first via conductors respectively such that each of the conductor posts comprises a metal foil and a plating layer formed on the metal foil,wherein the plurality of via conductors is formed such that the first via conductors are positioned in an outer edge portion of the laminate and have minimum-diameter-side surfaces positioned to form a same plane with respect to the second main surface of the laminate and that the second via conductors are positioned in a central portion of the laminate and have minimum ...

Advanced Manufacturing Method for the Manufacturing of High-Precision Electronic Flexible Circuit Boards enabling the Democratization of design, development, and production of electronic and electrical devices

The present invention is a novel method of preparing copper sheeting for exposure to UV or optical light in the process of manufacturing flexible printed circuit boards. This method seeks to remove the need for the highly complex, costly, and capital-intensive use of collimated UV lights and vacuum chambers in conventional FPCB manufacturing by preparing copper sheeting for non-vacuum non-collimated UV exposure with a relatively trivial method using clear vinyl stickers, conventional toner-adhering decorative foil, and UV reflective glue. This in turn will “democratize” the design, development, fabrication, production, and distribution of advanced electronics that depend upon the use of high-precision FPCBs.

Resin composition eliminating volatile loss of initiating species for the preparation of printed circuit board laminates

An enhanced prepreg for printed circuit board (PCB) laminates includes a substrate and a resin applied to the substrate. The resin includes a curable polymer and a polymerization initiator polymer having a backbone with a free radical initiator forming segment that breaks apart upon being subjected to heat to generate a plurality of non-volatile initiating species. This resin composition eliminates possible volatile loss of the free radical initiator during all processing steps in the preparation of PCB laminates. The resin may additionally include a cross-linking agent, flame retardant and viscosity modifiers. In one embodiment, a sheet of woven glass fibers is impregnated with the resin and subsequently dried or cured. The glass cloth substrate may include a silane coupling agent to couple the resin to the substrate. In another embodiment, resin coated copper (RCC) is prepared by applying the resin to copper and subsequently curing the resin.

Surface-Treated Copper Foil, Copper Foil Having Carrier, Laminated Material, Method For Producing Printed Wiring Board, And Method For Producing Electronic Apparatus

To provide a surface-treated copper foil that is capable of favorably decreasing the transmission loss even used in a high frequency circuit board and has an improved peel strength on adhering to an insulating substrate, such as a resin. A surface-treated copper foil containing a copper foil, and a surface treatment layer containing a roughening treatment layer on at least one surface of the copper foil, wherein on observation of the copper foil from the side of the surface having the roughening treatment layer, the roughening treatment layer has an average length of roughening particles of 0.030 μm or more and 0.8 μm or less, the roughening treatment layer has an average number of gap portions between the adjacent roughening particles of 20/100 μm or more and 1,700/100 μm or less, and the roughening treatment layer has a total frequency of an overlap frequency and a contact frequency of roughening particles of 120/100 μm or less. 1. A surface-treated copper foil comprising a copper foil , and a surface treatment layer containing a roughening treatment layer on at least one surface of the copper foil , whereinthe roughening treatment layer has an average length of roughening particles of 0.030 μm or more and 0.8 μm or less on observation of the copper foil from the side of the surface having the roughening treatment layer,the roughening treatment layer has an average number of gap portions between the adjacent roughening particles of 20/100 μm or more and 1,700/100 μm or less on observation of the copper foil from the side of the surface having the roughening treatment layer, andthe roughening treatment layer has a total frequency of an overlap frequency and a contact frequency of roughening particles of 120/100 μm or less on observation of the copper foil from the side of the surface having the roughening treatment layer.2. The surface-treated copper foil according to claim 1 , wherein the roughening treatment layer has an average length of gap portions between the ...

COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND METHOD FOR PRODUCING PRINTED CIRCUIT BOARD

There is provided a copper foil provided with a carrier exhibiting a high peeling resistance against the developer in the photoresist developing process and achieving high stability of mechanical peel strength of the carrier. The copper foil provided with a carrier comprises a carrier; an interlayer disposed on the carrier, the interlayer having a first surface adjacent to the carrier and containing 1.0 atom % or more of at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W and Ni and a second surface remote from the carrier and containing 30 atom % or more of Cu; a release layer disposed on the interlayer; and an extremely-thin copper layer disposed on the release layer. 1. A copper foil provided with a carrier , comprising:a carrier;an interlayer disposed on the carrier, the interlayer having a first surface adjacent to the carrier and containing 1.0 atom % or more at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W and Ni and a second surface remote from the carrier and containing 30 atom % or more of Cu;a release layer disposed on the interlayer; andan extremely-thin copper layer disposed on the release layer.2. The copper foil provided with a carrier according to claim 1 , wherein the interlayer has a thickness of 5 to 1000 nm.3. The copper foil provided with a carrier according to claim 1 , wherein the interlayer comprises;an adhesive metal layer provided on the carrier and composed of at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W and Ni; anda release assisting layer disposed on the adhesive metal layer and composed of copper.4. The copper foil provided with a carrier according to claim 3 , wherein the adhesive metal layer has a thickness of 5 to 500 nm.5. The copper foil provided with a carrier according to claim 3 , wherein the release assisting layer has a thickness of 5 to 500 nm.6. The copper foil provided with a carrier according to claim 1 , wherein the interlayer is an ...

Resin composition, and resin film, metal foil with resin, metal clad laminate, wiring board, and circuit mount component using same

One aspect of the present invention relates to a resin composition containing a polyrotaxane (A), an epoxy resin (B), and a curing agent (C), in which the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.1 parts by mass or more and less than 10 parts by mass based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).

SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, RESIN SUBSTRATE, PRINTED WIRING BOARD, COPPER CLAD LAMINATE AND METHOD FOR PRODUCING PRINTED WIRING BOARD

A surface-treated copper foil is capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. A resin substrate is provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil has a surface-treated layer formed on a copper foil, and the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 μm. 1. A substrate prepared by bonding a surface-treated copper foil wherein a surface treated layer is formed on a copper foil , wherein the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 μm , the surface-treated copper foil optionally having a resin layer on the surface-treated layer , via the surface-treated layer side thereof , to a substrate , and by removing the surface-treated copper foil , ora substrate prepared by bonding a copper foil with carrier, the copper foil with carrier comprising a carrier, an intermediate layer and an ultra-thin copper layer in this order, the ultra-thin copper layer being a surface-treated copper foil wherein a surface treated layer is formed on a copper foil, wherein the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 μm and optionally having a resin layer, via the ultra-thin copper layer side thereof, to a substrate, and by removing the carrier from the copper foil with carrier and removing the ultra-thin copper layer which is the surface-treated copper foil,wherein at least one of the following (1) to (3) is satisfied:(1) the surface roughness Sz of the surface, on the copper foil removal side, of the substrate is 1 to 5 μm,(2) the ratio B/A of the three-dimensional surface area B to the two-dimensional surface area A of surface, on the copper foil removal side of the substrate, ...

Method of Producing Laminated Body, and Laminated Body

A method of producing a laminated body is provided in which, while a carrier A is wound off from a bobbin, an adhesive is applied to both facing ends thereof and a metal foil B is laid on and bonded to a side to which the adhesive was applied. The obtained laminated body is subsequently cut, a plurality of the cut laminated bodies are aligned in a stack, a roller is applied from the top of the stack when the elevation of the center of the stack becomes high to vent air existing between and within the laminated bodies. After the air vent process, the adhesive hardens to mutually bond the carrier to the metal foil of each laminated body. Accordingly, a carrier-attached copper foil that provides improvements in handling ability in the production process of a printed board and cost reduction based on improved production yield. 1. A carrier-attached metal foil in which carrier A and a metal foil B are laminated , wherein proof stress or yield stress of the carrier A is 20 to 500 N/mm , an adhesive is applied to a portion other than an area to be used as a printed circuit board of the metal foil B and the carrier A and metal foil B are bonded at ends of two facing sides with the adhesive having an adhesive strength of 5 g/cm to 500 g/cm.2. The carrier-attached metal foil according to claim 1 , wherein the adhesive has a viscosity of 3 claim 1 ,000 claim 1 ,000 mPa·S (25° C.) or less after the lapse of three minutes from application.3. The carrier-attached metal foil according to claim 1 , wherein the adhesive has a viscosity of 1 claim 1 ,000 claim 1 ,000 mPa·S (25° C.) or less after the lapse of three minutes from application.4. The carrier-attached metal foil according to claim 1 , wherein the adhesive is epoxy-based claim 1 , acrylic claim 1 , methacrylate-based claim 1 , silicon rubber-based claim 1 , ceramic-based claim 1 , or rubber-based.5. The carrier-attached metal foil according to claim 1 , wherein the metal foil B is a copper foil claim 1 , a copper alloy foil ...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

The present disclosure discloses a circuit board and a manufacturing method thereof. The manufacturing method of the circuit board comprises: forming an electroplated coating on a board body of the circuit board; performing image transfer on the board body; drilling the board body after image transfer to remove a copper layer, adjacent to the two sides of a gold finger, on the circuit board, thereby forming a strip; performing forward and reverse routing towards directions away from each other respectively at the two sides of each gold finger to form a first routing tape and a second routing tape, wherein the first routing tape and the second routing tape are connected to the two ends of the strip respectively; and removing burrs on a surface of the board body through an etching process. 1. A manufacturing method of a circuit board , comprising:forming an electroplated coating on a board body of the circuit board;performing image transfer on the board body;drilling the board body after image transfer to remove a copper layer, adjacent to the two sides of a gold finger, on the circuit board, thereby forming a strip;performing forward and reverse routing towards directions away from each other respectively at the two sides of each gold finger to form a first routing tape and a second routing tape, wherein the first routing tape and the second routing tape are connected to the two ends of the strip respectively;and removing burrs on a surface of the board body through an etching process.2. The manufacturing method of the circuit board according to claim 1 , wherein entry directions for machining the first routing tape and the second routing tape are opposite claim 1 , and feed directions for machining the first routing tape and the second routing tape are opposite.3. The manufacturing method of the circuit board according to claim 1 , wherein claim 1 , after the step of removing the burrs on the surface of the board body through the etching process claim 1 , the ...

Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Connector, Terminal, Laminate, Shield Material, Printed-Wiring Board, Metal Processed Member, Electronic Device and Method for Manufacturing the Printed Wiring Board

A copper heat dissipation material having a satisfactory heat dissipation performance is provided. The copper heat dissipation material has an alloy layer containing at least one metal selected from Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn and Mo on one or both surfaces, in which surface roughness Sz of the one or both surfaces, measured by a laser microscope using laser light of 405 nm in wavelength, is 5 μm or more. 1. A copper material comprising an alloy layer containing at least one metal selected from Cu , Co , Ni , W , P , Zn , Cr , Fe , Sn and Mo on one or both surfaces , wherein surface roughness Sz of the one or both surfaces , measured by a laser microscope using laser light of 405 nm in wavelength , is 5 μm or more.2. The copper material according to claim 1 , wherein the surface roughness Sz of the one or both surfaces claim 1 , measured by a laser microscope using laser light of 405 nm in wavelength claim 1 , is 7 μm or more.3. The copper material according to claim 2 , wherein the surface roughness Sz of the one or both surfaces claim 2 , measured by a laser microscope using laser light of 405 nm in wavelength claim 2 , is 10 μm or more.4. The copper material according to claim 3 , wherein the surface roughness Sz of the one or both surfaces claim 3 , measured by a laser microscope using laser light of 405 nm in wavelength claim 3 , is 14 μm or more.5. The copper material according to claim 1 , wherein the surface roughness Sz of the one or both surfaces claim 1 , measured by a laser microscope using laser light of 405 nm in wavelength claim 1 , is 90 μm or less.6. The copper material according to claim 1 , wherein surface roughness Sa of the one or both surfaces claim 1 , measured by a laser microscope using laser light of 405 nm in wavelength claim 1 , is 0.13 μm or more.7. The copper material according to claim 1 , wherein surface roughness Sku of the one or both surfaces claim 1 , measured by a laser microscope using laser light of 405 nm in wavelength ...

SURFACE TREATED COPPER FOIL, LAMINATE USING THE SAME, COPPER FOIL WITH CARRIER, PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

The invention provides a surface treated copper foil with which transmission loss is favorably suppressed even if the surface treated copper foil is used for a high frequency circuit board. 1. A surface treated copper foil , comprising:a copper foil; anda surface treated layer formed on at least one surface of the copper foil,{'sup': '2', 'wherein a total deposition amount of Co, Ni, and Mo is 1000 μg/dmor less in the surface treated layer,'}{'sup': '2', 'the surface treated layer includes a particle having three or more projections, a number of the particles per μmin the surface treated layer being 0.4 or more, and'}the surface treated copper foil satisfies any one or more of items (1-1) to (1-7) below:(1-1) surface roughness Rz on a side of the surface treated layer measured by a contact type roughness meter is 1.3 μm or less;(1-2) surface roughness Rp on the side of the surface treated layer measured by a laser microscope is 1.59 μm or less;(1-3) surface roughness Rv on the side of the surface treated layer measured by a laser microscope is 1.75 μm or less;(1-4) surface roughness Rzjis on the side of the surface treated layer measured by a laser microscope is 3.3 μm or less;(1-5) surface roughness Rc on the side of the surface treated layer measured by a laser microscope is 1.0 μm or less;(1-6) surface roughness Ra on the side of the surface treated layer measured by a laser microscope is 0.4 μm or less; and(1-7) surface roughness Rq on the side of the surface treated layer measured by a laser microscope is 0.5 μm or less.2. The surface treated copper foil according to claim 1 ,wherein the surface treated copper foil satisfies any one or more of items (2-1) to (2-7) below:(2-1) surface roughness Rz on the side of the surface treated layer measured by a contact type roughness meter is 0.89 μm or more;(2-2) surface roughness Rp on the side of the surface treated layer measured by a laser microscope is 0.80 μm or more;(2-3) surface roughness Rv on the side of the ...

Copper Foil, Copper Foil for High-Frequency Circuit, Carrier-Attached Copper Foil, Carrier-Attached Copper Foil for High-Frequency Circuit, Laminate, Method of Manufacturing Printed Wiring Board, and Method of Manufacturing Electronic Device

To provide a copper foil that the transmission loss is favorably controlled even when the copper foil is used in a high-frequency circuit board and that adhesion to a resin is favorable. A copper foil including a roughened layer, and the roughened layer includes a primary particle layer, a surface roughness Ra of a surface on the side of the primary particle layer is 0.12 μm or less, and the average particle size of primary particles of the primary particle layer is 0.10 to 0.25 μm.

MULTI-FLEX PRINTED CIRCUIT BOARD FOR WEARABLE SYSTEM

Disclosed is a printed circuit board (PCB) design for a multi-flex PCB system aimed at wearable devices that is capable of meeting requirements such as ultra-thin thickness profile of the board (thereby allowing 360 degree of bendability) and less manufacturing cost, as desired by consumer electronics, such as wearable motion controlled mobile gaming devices. The PCB design suggests two thickness levels for the multi-flex PCB system. The thicker parts are four-layer sections with 20 mils thickness and thinner parts are two-layer sections with 7-8 mils thickness. The ground and supply planes are only solid on the four-layer sections. Since the two-layer segments including signal paths are completely bendable, the entire rectangular board can bend as a cycle. This two thickness-level structure can be easily modified to three thickness-level structure with the third three-layer sections with 12-13 mils thickness. The three thickness-level structure is to accommodate more complicated electronics circuit design. 1. A printed circuit board design for a multi-flex board , the multi-flex board comprising:a plurality of sections made up of flexible composites and a conductive material that allows complete bendability of the multi-flex board, wherein each section is configured with a desired combination of layers;one or more components soldered on top and/or bottom copper layer;wherein the multi-flex board is configured to enable component assembly load on one or more thicker layer sections and routing capability to one or more thinner layer sections; andwherein middle layers of the thicker layer section extend out to form the thinner layer section.2. The multi-flex board of is the optimal types of PCB's in consumer electronic devices with high flexibility and complete bendability requirement.3. The multi-flex board of wherein the thinner layer sections are used for bending thereby eliminating bending of components configured on the thicker layer section.4. The multi-flex ...

CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE

A circuit substrate includes an insulating layer, a conductor layer laminated on the insulating layer and including a plane layer portion, and a solder resist layer formed on the insulating layer such that the solder resist layer is covering the conductor layer. The plane layer portion of the conductor layer has recess portions or opening portions, and the solder resist layer includes recessed portions covering the recess portions or opening portions of the plane layer portion. 1. A circuit substrate , comprising:an insulating layer;a conductor layer laminated on the insulating layer and comprising a plane layer portion; anda solder resist layer formed on the insulating layer such that the solder resist layer is covering the conductor layer,wherein the plane layer portion of the conductor layer has a plurality of recess portions or a plurality of opening portions, and the solder resist layer includes a plurality of recessed portions covering the recess portions or opening portions of the plane layer portion.2. A circuit substrate according to claim 1 , wherein the plane layer portion of the conductor layer has the plurality of opening portions formed such that each of the opening portions is exposing a surface of the insulating layer claim 1 , and the recessed portions of the solder resist layer are recessed substantially over entire interiors of the opening portions claim 1 , respectively.3. A circuit substrate according to claim 1 , wherein the solder resist layer is formed on the insulating layer such that the solder resist layer is covering a plurality of product regions each of which forms a wiring substrate claim 1 , and a non-product region between the product regions and in a peripheral edge portion surrounding the plurality of product regions claim 1 , and the conductor layer has the plane layer portion in a plurality such that the plurality of plane layer portions is positioned in the product regions and the non-product region claim 1 , respectively.4. A ...

METHOD FOR MANUFACTURING FLEXIBLE ARRAY SUBSTRATE

The present invention provides a method for manufacturing a flexible array substrate. The method includes, first, successively forming an adhesive layer, a passivation layer, a back-side drive circuit, a planarization layer, a flexible backing plate, and a front-side drive circuit and a display circuit, in a stacked arrangement, on a rigid support plate and then peeling off the rigid support plate and the adhesive layer to form a flexible array substrate having a double-sided circuit structure. The entirey process requires no steps of peeling, reversing, and then re-attaching of the flexible backing plate so that it is possible to avoid the issues of poor flatness and low yield resulting from improper or wrongful re-attachment of the flexible backing plate and thus, fabrication difficulty of a flexible array substrate having a double-sided circuit structure may be lowered down to thereby improve fabrication yield of the flexible array substrate. 1. A method for manufacturing a flexible array substrate , comprising the following steps:{'b': '1', 'Step S: providing a rigid support plate, forming an adhesive layer on the rigid support plate, and forming a passivation layer on the adhesive layer;'}{'b': '2', 'Step S: forming a back-side drive circuit on the passivation layer and covering the back-side drive circuit with a planarization layer;'}{'b': '3', 'Step S: forming a flexible backing plate on the planarization layer;'}{'b': '4', 'Step S: forming a via in the flexible backing plate to extend through the flexible backing plate and the planarization layer;'}{'b': '5', 'Step S: forming a front-side drive circuit and a display circuit that is in electrical connection with the front-side drive circuit on the flexible backing plate, such that the front-side drive circuit is electrically connected, through the via, to the back-side drive circuit; and'}{'b': '6', 'Step S: peeling off the rigid support plate and the adhesive layer to obtain a flexible array substrate.'}2. ...

Manufacturing method of flexible printed wiring board

The manufacturing method of the flexible printed wiring board relating to an embodiment includes a step of preparing a metal foil clad laminate 1 including an insulating substrate 2 and metal foil 3 and metal foil 4 provided on main surfaces of the substrate 2, a step of forming a circuit pattern 5 by patterning the metal foil 3, a step of forming a peelable printing plate layer 6 on the substrate 2 so as to embed the pattern 5, a step of forming blind holes 7 a and 7 b where the pattern 5 is exposed inside by partially removing the printing plate layer 6, a step of printing conductive paste with the printing plate layer 6 as a printing mask, and filling the conductive paste 8 inside the blind holes, and a step of peeling off the printing plate layer 6 from the metal foil clad laminate 1.

COPPER FOIL WITH RELEASE LAYER, LAMINATED MATERIAL, METHOD FOR PRODUCING PRINTED WIRING BOARD, AND METHOD FOR PRODUCING ELECTRONIC APPARATUS

A copper foil with a release layer is provided that capable of forming a circuit, of such as an embedded trace substrate, by a subtractive method in a simple process. A copper foil with a release layer, containing, in this order, a release layer; a barrier layer having dissolution resistance to a copper etchant; and a copper foil. 1. A copper foil with a release layer , comprising , in this order , a release layer; a barrier layer having dissolution resistance to a copper etchant; and a copper foil.2. The copper foil with a release layer according to claim 1 , wherein the barrier layer having dissolution resistance to a copper etchant is a layer having one or more layers selected from the group consisting of a Ni layer claim 1 , a Ti layer claim 1 , a Cr layer claim 1 , a V layer claim 1 , a Zr layer claim 1 , a Ta layer claim 1 , an Au layer claim 1 , a Pt layer claim 1 , an Os layer claim 1 , a Pd layer claim 1 , a Ru layer claim 1 , a Rh layer claim 1 , an Ir layer claim 1 , a W layer claim 1 , a Sn layer claim 1 , a stainless steel layer claim 1 , an Ag layer claim 1 , a Mo layer claim 1 , a Ni—Cr alloy layer claim 1 , an Al layer claim 1 , a Co layer claim 1 , an In layer claim 1 , a Bi layer claim 1 , an ITO (indium tin oxide) layer; a layer containing an alloy containing one or more element selected from the group consisting of Ni claim 1 , Ti claim 1 , V claim 1 , Zr claim 1 , Ta claim 1 , Au claim 1 , Pt claim 1 , Os claim 1 , Pd claim 1 , Ru claim 1 , Rh claim 1 , Ir claim 1 , W claim 1 , Si claim 1 , Fe claim 1 , Mo claim 1 , Mn claim 1 , P claim 1 , S claim 1 , N claim 1 , C claim 1 , Al claim 1 , Co claim 1 , In claim 1 , B Sn claim 1 , Ag claim 1 , Mo claim 1 , and Cr; and a layer containing a carbide claim 1 , an oxide claim 1 , or a nitride containing one or more element selected from the group consisting of Ni claim 1 , Ti claim 1 , V claim 1 , Zr claim 1 , Ta claim 1 , Au claim 1 , Pt claim 1 , Os claim 1 , Pd claim 1 , Ru claim 1 , Rh claim 1 , Ir ...

Copper foil with carrier, laminate, method of producing printed wiring board, and method of producing electronic devices

The present invention provides a copper foil with a carrier having a small absolute value of the difference in releasing strength between the copper foil with a carrier prepared by laminating and hot-pressing the surface close to an ultra-thin copper layer of the copper foil with a carrier to an insulating substrate and used after the carrier is peeled off and the copper foil with a carrier prepared by laminating and hot-pressing the surface close to the carrier of the copper foil with a carrier to an insulating substrate and used after the ultra-thin copper layer is peeled off, while generation of swelling during laminating of the copper foil with a carrier to the insulating substrate by hot pressing is prevented, discoloring of the surface of the ultra-thin copper layer due to oxidation is prevented, and the circuit formability is high. A copper foil with a carrier, including a carrier, an intermediate layer, an ultra-thin copper layer, and a surface treated layer in this order, wherein no roughened layer is disposed on the surface of the ultra-thin copper layer, and the surface treated layer consists of Zn or a Zn alloy, the amount of Zn applied in the surface treated layer is 30 to 300 μg/dm 2 , and if the surface treated layer is composed of the Zn alloy, the proportion of Zn in the Zn alloy is 51% by mass or more.

CARRIER-FOIL-ATTACHED ULTRA-THIN COPPER FOIL

The carrier-foil-attached ultra-thin copper foil according to one embodiment of the present invention comprises a carrier foil, a release layer, a first ultra-thin copper foil, a Cu-diffusion prevention layer, an Al layer, and a second ultra-thin copper foil, wherein the release layer may comprise a first metal (A2) having peeling properties, and a second metal (B2) and third metal (C2) facilitating the plating of the first metal (A2). 1. A carrier foil-attached ultra-thin copper foil comprising:a carrier foil;a release layer;a first ultra-thin copper foil;a copper (Cu)-aluminum (Al) bonding strength improvement layer;a Cu diffusion prevention layer;an Al layer; anda second ultra-thin copper foil,wherein the release layer includes a first metal (A2) having a peeling property and second and third metals (B2, C2) which facilitate plating of the first metal (A2).2. The carrier foil-attached ultra-thin copper foil of claim 1 , wherein the Cu diffusion prevention layer is formed between the Al layer and the first ultra-thin copper foil and between the Al layer and the second ultra-thin copper foil.3. The carrier foil-attached ultra-thin copper foil of claim 2 , wherein the Cu—Al bonding strength improvement layer is formed between the first ultra-thin copper foil and the Cu diffusion prevention layer.4. The carrier foil-attached ultra-thin copper foil of claim 1 , wherein a thickness (t4) of the Al layer and a thickness (t5) of a bonding pad of a semiconductor chip satisfy an expression of about 0.0005≤t4/t5≤about 3.0.5. The carrier foil-attached ultra-thin copper foil of claim 1 , wherein a thickness (t4) of the Al layer and a thickness (t6) of a bonding wire of a semiconductor chip satisfy an expression of about 0.0005≤t4/t6≤about 3.0.6. The carrier foil-attached ultra-thin copper foil of claim 1 , wherein a thickness (t7) of the Cu diffusion prevention layer and a thickness (t4) of the Al layer satisfy an expression of about 0.5≤t7/t4≤about 1.07. The carrier foil- ...

Electrically conductive layer structure and method for its production

Die Erfindung betrifft ein Verfahren zur Herstellung mindestens einer musterförmig ausgebildeten, elektrisch leitenden Schichtstruktur (5''') auf einem elektrisch isolierenden Substrat (1) sowie eine danach hergestellte elektrisch leitende Schichtstruktur (5'''), die in Schichtebene in allen Richtungen Abmessungen von kleiner als 20 mm aufweist. The invention relates to a method for producing at least one pattern-formed, electrically conductive layer structure (5 '' ') on an electrically insulating substrate (1) and an electrically conductive layer structure (5' '') produced thereafter, the dimensions in layer plane in all directions of less than 20 mm.

Printed wiring board substrate, printed wiring board, and printed wiring board manufacturing method

本発明は、ベースフィルムと金属層との剥離強度が大きく、安価に製造できるプリント配線板用基材を提供することを課題とする。本発明の一実施形態に係るプリント配線板用基材は、絶縁性を有するベースフィルムと、このベースフィルムの少なくとも一方の面に積層される複数の金属粒子の焼結層とを備えるプリント配線板用基材であって、上記焼結層におけるベースフィルムとの界面から５００ｎｍ以内の領域の空隙率が１％以上５０％以下である。本発明の別の実施形態に係るプリント配線板用基材の製造方法は、絶縁性を有するベースフィルムの一方の面に金属粒子を含有するインクを塗工する工程と、この塗工工程で形成されるインクの塗膜を焼結する工程とを備え、上記焼結工程又はその後工程で、上記塗膜の焼結により形成される焼結層におけるベースフィルムとの界面から５００ｎｍ以内の領域の空隙率が１％以上５０％以下となるよう調節する。 An object of the present invention is to provide a substrate for a printed wiring board that has a high peel strength between a base film and a metal layer and can be manufactured at low cost. A printed wiring board substrate according to an embodiment of the present invention includes a base film having insulating properties, and a sintered layer of a plurality of metal particles laminated on at least one surface of the base film. The porosity of a region within 500 nm from the interface with the base film in the sintered layer is 1% or more and 50% or less. A method for producing a printed wiring board substrate according to another embodiment of the present invention includes a step of coating an ink containing metal particles on one surface of an insulating base film, and a step of forming the coating step. A step of sintering the coating film of the ink to be formed, and in the sintering step or the subsequent step, a void in an area within 500 nm from the interface with the base film in the sintered layer formed by sintering the coating film The rate is adjusted to 1% to 50%.

Verfahren zur Herstellung einer durchkontaktlerten Leiterplatte

Method for manufacturing multilayer wiring board, and multilayer wiring board manufactured by the same

A multilayer wiring board (1) has a laminate structure including insulating layers (20, 30) and a wiring layer (40). The method for manufacturing the multilayer wiring substrate (1) comprises the step of bonding a support film having a metallic contact layer (50) to the insulating layer (20) through the metallic contact layer (50) the step of removing the support film while transferring the metallic contact layer (50) to the insulating layer (20) the step of forming the wiring layer (40) by forming a resist pattern on the metallic contact layer (50) and forming a plating film on an unmasked area of the resist pattern, and the step of removing the resist pattern and the metallic contact layer (50) which is not covered with the wiring layer (40).

Film for metal film transfer, method for transferring metal film and method for manufacturing circuit board

Films for metal film transfer, which contain (a) a support layer, (b) a release layer formed on the support layer, which is comprised of one or more kinds of water-soluble polymers selected from a water-soluble cellulose resin, a water-soluble polyester resin, and a water-soluble acrylic resin, and (c) a metal film layer formed on the release layer, show superior transferability of the metal film layer. Such films are useful for efficiently producing circuit boards by laminating the film for metal film transfer on a curable resin composition layer on a substrate such that the metal film layer is in contact with a surface of the curable resin composition layer, curing the curable resin composition layer, detaching the support layer, and removing the release layer on the metal film layer by dissolving the release layer in an aqueous solution.

Process for producing circuit board

Producing a circuit board, by laminating, on a substrate, an adhesive film with a metal film, which comprises a water-soluble polymer release layer, a metal film layer and a curable resin composition layer, which are formed in this order on a support layer, and has a release property enabling detachment of said water-soluble polymer release layer from the support layer after curing of the curable resin composition layer, such that the curable resin composition layer contacts the substrate; curing the curable resin composition layer; detaching the support layer, and removing the water-soluble polymer release layer present on the metal film layer by dissolving the release layer in an aqueous solution, efficiently forms an insulating layer and a metal film layer superior in adhesiveness to the insulating layer and in uniformity. By this method, a metal film layer having high adhesiveness and high property uniformity can be formed on the surface without the need for roughening the surface of an insulating layer with an oxidant such as alkaline potassium permanganate solution and the like. Thus, etching for circuit formation can be performed under milder conditions, which in turn provides a superior effect on micro wiring on circuit boards such as multi-layer printed wiring boards, flexible printed wiring boards, and the like.

Process for producing circuit board

절연층과, 절연층에서의 밀착성 및 균일성에서 우수한 금속막층을 효과적으로 형성할 수 있는, 회로 기판의 제조 방법이 제공된다. There is provided a circuit board manufacturing method capable of effectively forming a metal film layer excellent in the insulating layer and in the adhesion and uniformity in the insulating layer. 회로 기판 제조 방법은, 순차적으로 지지체층에 형성되는 수용성 고분자 이형층, 금속막층, 및 경화성 수지 조성물층을 포함하며, 상기 경화성 수지 조성물층이 기판에 접촉하도록 경화성 수지 조성물층의 경화 단계 후에 상기 수용성 고분자 이형층과 상기 지지체층 사이에서 상기된 수용성 고분자 이형층의 박리를 가능하게 하는 박리성을 상기 수용성 고분자 이형층이 가지는 금속막 부착 접착 필름을, 기판 상에 적층하는 단계, 상기 경화성 수지 조성물층을 경화시키는 단계, 상기 지지체층을 박리하는 단계, 수용액으로 상기 수용성 고분자 이형층을 용해시키는 것에 의해 상기 금속막층 상에 존재하는 상기 수용성 고분자 이형층을 제거하는 단계를 포함한다. The method for producing a circuit board includes a water-soluble polymer releasing layer, a metal film layer, and a curable resin composition layer sequentially formed on a support layer, wherein after the curing step of the curable resin composition layer so that the curable resin composition layer is in contact with the substrate, A step of laminating a metal film-adhering film having the water-soluble polymer releasing layer having a peeling property enabling peeling of the water-soluble polymeric releasing layer described above between the polymeric releasing layer and the support layer on a substrate; And removing the water-soluble polymer releasing layer present on the metal film layer by dissolving the water-soluble polymer releasing layer with an aqueous solution. 회로 기판, 접착 필름, 금속막층, 수용성 고분자 이형층, 경화성 수지 조성물, 금속막 전사용 필름 Circuit board, adhesive film, metal film layer, water-soluble polymer release layer, curable resin composition, metal film transfer film

Laminate including water soluble release layer for producing circuit board and method of producing circuit board

Producing a circuit board, by laminating, on a substrate, an adhesive film with a metal film, which comprises a water-soluble polymer release layer, a metal film layer and a curable resin composition layer, which are formed in this order on a support layer, and has a release property enabling detachment of said water-soluble polymer release layer from the support layer after curing of the curable resin composition layer, such that the curable resin composition layer contacts the substrate; curing the curable resin composition layer; detaching the support layer, and removing the water-soluble polymer release layer present on the metal film layer by dissolving the release layer in an aqueous solution, efficiently forms an insulating layer and a metal film layer superior in adhesiveness to the insulating layer and in uniformity.

Multilayer printed circuit board laminated with unreinforced resin

A printed circuit board laminated without reinforced binder. The invention makes possible reduced board thickness and increased layer count without excessive reduction in the thickness of core material. Laser or plasma drilling can be performed with increased control. Straighter traces, higher trace resolution and higher signal velocity with reduced distortion are made possible.

Multilayer circuit board

A circuit board is manufactured from a core layer having a conductor run layer (4') overlying the core layer (2) on one side thereof, and a continuous layer (16') of dielectric material over­lying the conductor run layer, by forming a con­tinuous outer layer (18) of conductive material over the layer of dielectric material. Material of the continuous outer layer is removed at a prede­termined location, and the dielectric material that is thus exposed is also removed so as to form an opening through which the conductor run layer is exposed. Conductive material is deposited into the opening to at least the level of the outer conduc­tor layer, whereby the conductor run layer is con­nected to the outer layer of conductive material.

Method for printed circuit board pattern making using selectively etchable metal layers

The present invention provides a method for producing high density electronic circuit boards comprising the steps of depositing a layer of a first metal upon a layer of foil to produce a composite then attaching the composite to an insulative support to produce a laminate. The layer of foil is then removed from the layer of first metal. Photoresist is then applied to the layer of first metal, exposed and developed. During the development of the photoresist portions of the photoresist are removed from the layer of first metal. A layer of third metal is then plated upon the portions of the layer of first metal that are not covered by the photoresist. All remaining photoresist and the portions of the layer of first metal which are not covered by the third metal are then removed producing a finished fine-line pattern having conductive and insulative areas. The finished fine-line pattern may then be utilized to produce a circuit board.

Component of printed circuit boards.

Transfers for metallic coatings

Matte transfer metallization film, process for its production and its use

Ultrathin copper foil with carrier and printed circuit board using same

An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content “a” of the metal A and a content “b” of the metal B forming the release layer satisfying an equation: 10≦ a/ ( a+b )* 100≦70 and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.

Process for the production of matte transfer metallization film

The invention relates to a matte multilayer polypropylene film which includes at least one base layer containing polypropylene and migrating additives or a mixture of migrating additives, and at least one outer layer which includes a mixture or a blend of two components I and II. Component I essentially contains a propylene homopolymer or a copolymer of ethylene and propylene or ethylene and butylene or propylene and butylene or ethylene and another α-olefin having 5 to 10 carbon atoms or propylene and another α-olefin having 5 to 10 carbon atoms or a terpolymer of ethylene and propylene and butylene or ethylene and propylene and another α-olefin having 5 to 10 carbon atoms or a mixture of two or more of said homopolymers, copolymers and terpolymers or a blend of two or more of said homopolymers, copolymers and terpolymers, if desired mixed with one or more of said homopolymers, copolymers and terpolymers. Component II essentially contains an HDPE or a blend of two components A and B. Blend component A is essentially an HDPE. Blend component B is essentially a propylene homopolymer or a copolymer of ethylene and propylene or ethylene and butylene or propylene and butylene or ethylene and another α-olefin having 5 to 10 carbon atoms or propylene and another α-olefin having 5 to 10 carbon atoms or a terpolymer of ethylene and propylene and butylene or ethylene and propylene and another α-olefin having 5 to 10 carbon atoms or a mixture of two or more of said homopolymers, copolymers and terpolymers or a blend of two or more of said homopolymers, copolymers and terpolymers. The film has use in a metallization process.

Ultra-thin copper foil with carrier and printed wiring board

랜드리스 비아를 갖는 인쇄회로기판 및 그 제조방법

본 발명은 랜드리스 비아를 갖는 인쇄회로기판(PCB; printed circuit board) 및 그 제조방법에 관한 것이며, 보다 구체적으로는 비아의 직경이 최소인 면에 형성되며, 비아의 최소직경보다 작은 라인폭을 갖는 회로패턴을 포함하는 랜드리스 비아를 갖는 인쇄회로기판 및 그 제조방법에 관한 것이다. 본 발명에 따르면 비아의 직경이 최소인 면에 상부 랜드가 없으므로, 비아와 접속하는 회로패턴을 미세하게 형성하여 회로패턴을 고밀도화할 수 있고, 이로 인하여 인쇄회로기판 크기의 축소 및 층(layer) 수 감소를 실현할 수 있는 이점이 있다. 랜드리스, 상부랜드, 최소직경

케리어 부착 극박 동박의 제조방법 및 이 제조방법으로제조된 케리어 부착 극박동박, 프린트 배선기판, 다층프린트 배선판 및 칩온필름용 배선판

본 발명은 5㎛ 이하의 동박으로서, 핀홀 수가 적으면서 표면 거칠기가 적은 케리어 부착 극박 동박과 그 제조방법을 제공하며, 또한 이러한 케리어 부착 극박 동박을 사용한 미세 패턴용도의 프린트 배선판, 다층 프린트 배선판, 칩온필름용 배선판을 제공하는 것을 목적으로 한다. 본 발명은 케리어 동박의 적어도 한쪽면을 화학적 연마, 전기화학적 용해, 도금 및 이들을 조합한 방법에 의하거나, 혹은 추가적으로 기계적 연마를 조합하여 평균 표면 조도가 Rz: 0.01~2.0㎛가 되도록 평활화하고, 평활화된 케리어 동박의 표면에 박리층, 극박 동박을 순차적으로 적층시켜 이루어지는 것을 특징으로 하는 케리어 부착 극박 동박이다. 극박 동박, 케리어, 박리층, 배선판

用于印刷布线板的基板、印刷布线板及其制造方法

公开了一种用于印刷布线板的基板，由于其制造不需要真空设备，所以其尺寸不受限制。用于印刷布线板的基板不使用有机粘合剂，并且其包括足够薄的导电层(铜箔层)。还公开了印刷布线板、用于制造用于印刷布线板的基板的方法、以及用于制造印刷布线板的方法。具体公开了用于印刷布线板的基板(1)，其包括绝缘基底(11)；布置在所述绝缘基底(11)上的第一导电层(12)以及在所述第一导电层(12)上布置的第二导电层(13)。所述第一导电层(12)被构造成由包含金属粒子的导电墨水构成的涂层，所述第二导电层(13)被构造成镀层。

Composite copper foil, process for preparing the same, and copper-clad laminate and printed wiring board using the same

본 발명은 캐리어금속박과 극박동박의 사이에 유기계 박리층을 포함하는 복합박 및 캐리어금속박에 유기계 박리층을 형성하고, 이 유기계 박리층의 위에 전착법으로 극박동박층을 형성하는 단계를 포함하는 복합박의 제조방법을 제공한다. 상기 유기계 박리층은 질소-함유 화합물, 황-함유 화합물 또는 카르복시산이 바람직하고, 취급 및 적층하는 동안 상기 캐리어와 극박동박의 박리를 방지하는데 적절하지만, 구리/기재(copper/substrate) 접착의 박리강도에 비해 매우 작으므로, 절연기재에 복합박을 적층한 후 상기 캐리어를 쉽게 제거할 수 있는 균일한 접착강도를 제공한다. 본 발명은 또한 이런 복합박으로 제조한 적층판과 이런 적층판으로 제조한 프린트배선판을 포함한다. The present invention provides a composite foil comprising an organic peeling layer between a carrier metal foil and an ultrathin copper foil and an organic peeling layer on a carrier metal foil, and forming an ultrathin copper foil layer by electrodeposition on the organic peeling layer. Provided is a method for preparing foil. The organic release layer is preferably a nitrogen-containing compound, a sulfur-containing compound, or a carboxylic acid, and is suitable for preventing peeling of the carrier and the ultra-thin copper foil during handling and lamination, but the peel strength of copper / substrate adhesion Since it is very small compared to the above, it provides a uniform adhesive strength that can easily remove the carrier after laminating the composite foil on the insulating substrate. The present invention also includes a laminate made of such a composite foil and a printed wiring board made of such a laminate. 복합동박, 금속캐리어층, 동피복적층판, 프린트배선판, 박리강도 Composite Copper Foil, Metal Carrier Layer, Copper Clad Laminate, Printed Wiring Board, Peel Strength

Copper foil with carrier, laminate, printed circuit board and method of manufacturing printed circuit board

캐리어 부착 동박을 수지 기판에 적층함으로써 제조한 적층체에 있어서, 극박 구리층을 캐리어로부터 양호하게 박리하는 것이 가능한 캐리어 부착 동박을 제공한다. 캐리어, 중간층, 극박 구리층을 이 순서로 갖는 캐리어 부착 동박으로서, 캐리어의 극박 구리층과 반대측의 표면을 JIS B0601-1994 에 준거하여 레이저 현미경으로 측정했을 때, 표면의 10 점 평균 조도 Rz 가 6.0 ㎛ 이하인 캐리어 부착 동박. A copper foil with a carrier capable of satisfactorily separating an ultra-thin copper layer from a carrier in a laminate produced by laminating a copper foil with a carrier on a resin substrate. A carrier-coated copper foil having a carrier, an intermediate layer and an ultra-thin copper layer in this order, wherein a surface of the carrier opposite to the ultra-thin copper layer is measured by a laser microscope in accordance with JIS B0601-1994, Mu] m or less.

Transfer sheet

본 발명은 플라즈마디스플레이패널(이하, PDP), 필드에미션디스플레이(FED), 액정표시장치(LCD), 형광표시장치, 혼성집적회로 등에 있어서의 전극패턴, 유전체층, 장벽층 등의 형성에 사용되는 전사시트에 관한 것으로, 베이스필름과, 그 베이스필름 위에 박리가능하게 형성된 전사층, 또는 그 전사층 위에 보호필름을 갖추고, 그 전사층은 글래스플릿을 포함하는 무기성분, 소성제거 가능한 유기성분, 또는 더욱이 도전성분체를 함유하는 것이며, 전사층의 표면거칠기, 표면광택도, 베이스필름이나 보호필름의 박리성, 또 전사층에 있어서의 잔류용제량을 특정함으로써 특히 PDP의 하지층(下地層), 전면판이나 배면판의 유전체층(誘電體層), 감광성 블랙매트릭스(black matrix)층 및 감광성 리브(rib)층을 높은 정밀도로 형성할 수 있으며, 또 고정밀·고세밀한 전극패턴의 형성을 가능하게 하는 것이다. The present invention is used to form electrode patterns, dielectric layers, barrier layers and the like in plasma display panels (hereinafter referred to as PDPs), field emission displays (FEDs), liquid crystal displays (LCDs), fluorescent displays, and hybrid integrated circuits. A transfer sheet, comprising: a base film, a transfer layer detachably formed on the base film, or a protective film on the transfer layer, the transfer layer comprising an inorganic component including a glass split, a plastic component capable of plastic removal, or Furthermore, the conductive powder is contained, and the surface roughness of the transfer layer, the surface gloss, the peelability of the base film and the protective film, and the amount of the residual solvent in the transfer layer are specified, in particular, the base layer and the front surface of the PDP. Dielectric layer, photosensitive black matrix layer and photosensitive rib layer of plate or back plate can be formed with high precision, and high precision and high precision It is to enable the formation of a pattern.

Semi-additive manufacturing method for printed wiring boards

Thin cooper foil adhered to carrier and, printed circuit board using the same

캐리어 호일의 표면조도에 영향받지 않고 미세 결정립을 표출시킬 수 있으며, 라인/스페이스가 15μm 이하로 극세폭까지 에칭이 가능하며, 또한 15μm의 라인을 에칭한 후라도 상기 미세 라인과 배선 기판이 높은 밀착 강도를 갖는 캐리어 부착 동박을 제공한다. 캐리어 부착 동박은 캐리어 호일 상에, 박리층, 동박을 이 순서로 적층하여 이루어지며, 조면화 처리를 실시하기 전의 상기 동박은 그 표면조도가 10곳 평균조도(Rz)로 2.5μm 이하이며, 그 동박 표면 상의 인접한 피크간 최소 거리가 5μm 이상인 전해 동박이다. 또한, 상기 동박의 표면이 조면화 처리되어 있다. Fine grains can be expressed without being affected by the surface roughness of the carrier foil, and the line / space can be etched to a very narrow width of 15 μm or less, and the high adhesion strength between the fine line and the wiring board is even after etching the 15 μm line. It provides the copper foil with a carrier which has. The copper foil with a carrier is formed by laminating a peeling layer and a copper foil in this order on a carrier foil, and the copper foil before the roughening treatment has a surface roughness of 2.5 μm or less with 10 average roughness (Rz). It is an electrolytic copper foil with the minimum distance between adjacent peaks on copper foil surface 5 micrometers or more. Moreover, the surface of the said copper foil is roughened. 캐리어 부착 동박 Copper foil with carrier

Process for producing copper-clad laminate

내용 없음. No content.

Metal foil with carrier

キャリアＡと金属箔Ｂが交互に重なり合う積層体であって、隣接するキャリアＡが金属箔Ｂの全面を覆う面積を有し、かつ当該キャリアＡの縁部の一部又は全部が金属箔Ｂからはみ出す構造を備えていることを特徴とするキャリア付金属箔。プリント配線板に使用される片面若しくは２層以上の多層積層板又は極薄のコアレス基板の製造の際に用いられるキャリア付銅箔に関する。特に、積層板の製造時に使用するキャリア付き銅箔に係り、その目的とするのはプリント基板製造工程のハンドリング性向上及び歩留りアップによるコスト削減を実現することを課題とする。 The carrier A and the metal foil B are alternately stacked, the adjacent carrier A has an area covering the entire surface of the metal foil B, and a part or all of the edge of the carrier A is from the metal foil B. A metal foil with a carrier, characterized by having a protruding structure. It is related with the copper foil with a carrier used in the case of manufacture of the single-sided or 2 or more-layer multilayer laminated board used for a printed wiring board, or an ultra-thin coreless board | substrate. In particular, the present invention relates to a copper foil with a carrier used in the production of a laminated board, and its purpose is to realize improved handling in a printed circuit board production process and cost reduction by increasing yield.

Method for manufacturing of composite structure component

FIELD: radio engineering, in particular, manufacturing of printed circuit boards. SUBSTANCE: method involves production of composite structure of substrate and foil, making a surface contact between upper front surface of structure in center with front surface of composite structure of impregnated tape to produce stack, which is subjected to heating and pressurizing in order to bind upper front surface of foil to front surface of impregnated tape. Then stack is disassembled, so that composite member with composite structure of impregnated tape and foil and removed member of substrate are produced. In addition upon manufacturing of composite layer of substrate and foil, method involves gluing substrate and foil with flexible glue in glue band which embraces perimeter of given central region of composite structure of substrate and foil. EFFECT: facilitated manipulations with thin copper foil, keeping foil out of impurities and prevention of resin leaks. 6 cl, 5 dwg ДЗСУУТЬС ПЧ ГЭ РОССИЙСКОЕ АГЕНТСТВО ПО ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (19) (51) МПК? 13) ВИ” 2144 287‘ Н 05 К 3/46 СЛ 12) ОПИСАНИЕ ИЗОБРЕТЕНИЯ К ПАТЕНТУ РОССИЙСКОЙ ФЕДЕРАЦИИ (21), (22) Заявка: 98101418/09, 14.07.1992 (24) Дата начала действия патента: 14.07.1992 (30) Приоритет: 27.08.1991 Ц$ 750,798 (46) Дата публикации: 10.01.2000 (56) Ссылки: Ц$ 4875283 А, 24.10.89. ЕР 0235582 АЛ, 09.09.87. ЕР 0212124 А, 04.03.87. $0 356826 А, 27.10.12. 5Ц 1077069 А, 28.02.84. ЗИ 296293 А, 12.04.11. Ц 645857 А, 07.02.79. 4$ 4873764 А, 17.10.89. 4$ 4815282 А, 24.10.89. (62) Первичная заявка, из которой выделена настоящая: 94016379109 25.02.1994 (98) Адрес для переписки: 129010, Москва, ул.Большая Спасская, д.25, стр.3, ООО "Городисский и партнеры", Патентному поверенному Емельянову Е.И. (71) Заявитель: (73) Патентообладатель: Джонсон энд Джонстон Ассошиэйтс, Инк. (ЦЗ) (72) Изобретатель: Джеймс А.Джонстон (Ц$) Джонсон энд Джонстон Ассошиэйтс, Инк. (ЦЗ) (54) СПОСОБ ИЗГОТОВЛЕНИЯ СЛОИСТОГО КОМПОНЕНТА (57) Реферат: Способ ...

Ultra thin film of copper having bump and fabrication method for printed circuit board using the same

According to the present invention, a method for manufacturing carrier copper foil comprises the following steps of: providing a carrier; forming a separation induction layer on a surface of the carrier; forming a copper foil layer on the separation induction layer; and forming bumps on the copper foil.

Processed copper foil for low dielectric resin substrate, copper-clad laminate and printed wiring board using the treated copper foil

Method for manufacturing insulating film and multilayered printed circuit board

본 발명은, 보다 빠르면서도 간단한 방법으로 제조가 가능하여 공정의 효율성이 향상될 수 있으며, 절연층의 두께 조절이 용이하며, 물리적 손상 없이 고해상도의 비아홀을 형성할 수 있는 절연층 제조방법 및 상기 절연층 제조방법으로부터 얻어지는 절연층을 이용한 다층인쇄회로기판 제조방법에 관한 것이다. The present invention can be manufactured by a faster and simpler method to improve the efficiency of the process, the thickness of the insulating layer is easy to control, and the insulating layer manufacturing method and the insulation that can form a high-resolution via hole without physical damage A method for manufacturing a multilayer printed circuit board using an insulating layer obtained from the layer manufacturing method.

The manufacturing method of surface-treated metal material, appendix body metal foil and printed circuit board

本发明提供一种热的吸收性及散热性良好的表面处理金属材。表面处理金属材其金属材的热传导率为32W/(m·K)以上，表面的根据JISZ8730的色差ΔL满足ΔL≦－40。

Copper foil with carrier, laminate, printed circuit board, electronic device, and method of manufacturing printed circuit board

매우 미세한 회로를 형성하는 것이 가능하고, 또한, 회로의 단선을 양호하게 억제하는 것이 가능한 캐리어가 부착된 동박을 제공한다. 캐리어의 일방 또는 양방의 면에, 중간층 및 극박 구리층을 이 순서로 갖는 캐리어가 부착된 동박으로서, 극박 구리층이 전해 구리층이며, 중량법에 의해 측정한 극박 구리층의 두께가 1.5 ㎛ 이하이고, 극박 구리층의 핀홀 개수가 0 개/㎡ 이상 5 개/㎡ 이하인 캐리어가 부착된 동박. A copper foil with a carrier capable of forming a very fine circuit and capable of suppressing disconnection of a circuit well can be provided. A copper foil with a carrier having an intermediate layer and an ultra-thin copper layer in this order on one or both sides of a carrier, wherein the ultra-thin copper layer is an electrolytic copper layer, the thickness of the ultra- , And the number of pinholes of the ultra-thin copper layer is 0 / m2 to 5 / m2.

Copper foil with minimized bagginess, wrinkle and tear, electrode comprisng the same, secondary battery comprising the same and method for manufacturing the same

본 발명의 일 실시예는, 구리층을 포함하며, 29 내지 65 kgf/mm 2 의 인장강도, 18 내지 148㎛의 조도 프로파일 요소 평균 간격(mean width of roughness profile elements)(Rsm) 및 0.52 이하의 집합조직계수 바이어스[TCB(220)]를 갖는 동박을 제공한다. An embodiment of the present invention includes a copper layer and has a tensile strength of 29 to 65 kgf / mm 2 , a mean width of roughness profile elements (Rsm) of 18 to 148 μm, And a texture coefficient bias [TCB (220)].

Manufacturing method of wiring board or wiring board material

Multi-layered substrate and method for manufacturing the same

본 발명의 일 측면에 따른 다층기판은, 절연층, 절연층에 적어도 일부가 매립된 전도성패턴, 및 전도성패턴에 전기적으로 연결되어 상기 절연층을 관통하는 범프를 포함하고, 범프는 전도성패턴의 용융점보다 낮은 용융점을 가지는 저융점금속층과 저융점금속층의 용융점보다 높은 용융점을 가지고 저융점금속층의 횡단면적보다 작은 횡단면적을 가지는 고융점금속층을 포함한다. A multilayer board according to an aspect of the present invention includes an insulating layer, a conductive pattern at least partially embedded in an insulating layer, and a bump electrically connected to the conductive pattern to penetrate the insulating layer, wherein the bump has a melting point Melting metal layer having a melting point lower than that of the low melting point metal layer and a melting point higher than the melting point of the low melting point metal layer and having a cross-sectional area smaller than the cross-sectional area of the low melting point metal layer.

Copper foil with attached carrier foil, copper-clad laminate and printed wiring board

250℃ 이상의 온도가 부하되는 동장 적층판 제조에 사용해도, 구리박층으로부터 캐리어박을 용이하게 박리하는 것이 가능한 캐리어박이 부착된 구리박의 제공을 목적으로 한다. 이 목적을 달성하기 위해, 캐리어박/접합 계면층/구리박층의 층 구성을 구비하는 캐리어박이 부착된 구리박이며, 당해 캐리어박으로서, 250℃×60분의 가열 처리를 행한 후에 40㎏f/㎟ 이상의 인장 강도를 구비하는 전해 구리박을 사용한 것을 특징으로 하는 캐리어박이 부착된 구리박 등을 채용한다. Even if it uses for copper clad laminated board manufacture to which the temperature of 250 degreeC or more is loaded, it aims at provision of the copper foil with carrier foil which can peel carrier foil easily from a copper foil layer. In order to achieve this object, it is copper foil with carrier foil provided with the laminated constitution of carrier foil / bonding interface layer / copper foil layer, 40 kgf/ after performing heat processing for 250 degreeC x 60 minutes as the said carrier foil. The copper foil with carrier foil characterized by using the electrolytic copper foil provided with the tensile strength of mm<2> or more is employ|adopted.

Multilayer wiring board, method for producing multilayer wiring board, polisher for multilayer wiring board, and metal sheet for producing wiring board

범프형성용 금속층(2)/에칭스톱층(3)/배선형성용 금속층(4)으로 이루어지는 다층금속판(1)의 배선막형성용 금속층으로 배선막(4a)을 형성하여, 범프형성용 금속층으로 범프(2a)를 형성한 것을 복수 준비하여, 1개의 다층금속판의 범프의 형성면에 별도의 다층금속판의 배선막을 포갠다고 하는 형태로 반복하는 적층공정을 순차 반복하여 다층화를 한다. 또한, 금속판(1a)을 유지하는 금속판유지수단(13)과, 금속판의 위쪽에 칼날(26)을 유지하는 칼날유지수단(25)과, 해당 칼날유지수단의 높이를 조정하는 높이조정기구(20)와, 해당 칼날유지수단을 금속판의 표면에 대하여 상대적으로 평행하게 이동시키는 칼날평행이동기구(15)를 갖는 다층배선기판용 연마기(11a)로 연마한다. The wiring film 4a is formed of the wiring film forming metal layer of the multilayer metal plate 1, which is formed of the bump forming metal layer 2, the etching stop layer 3, and the wiring forming metal layer 4, thereby forming the bump forming metal layer. A plurality of bumps 2a are prepared, and a lamination process is repeated in a manner of laminating a wiring film of another multi-layer metal plate on the forming surface of the bump of one multi-layer metal plate to sequentially multilayer. In addition, the metal plate holding means 13 for holding the metal plate 1a, the blade holding means 25 for holding the blade 26 above the metal plate, and the height adjusting mechanism 20 for adjusting the height of the blade holding means. ), And the blade holding means is polished with a multi-layer wiring board polishing machine 11a having a blade parallel moving mechanism 15 for moving the blade holding means relatively parallel to the surface of the metal plate.

Flexible copper-clad substrate capable of preventing open/short circuit and manufacturing method thereof

本发明提供一种通过确保化学抛光的均匀来防止开路和/或短路的发生的可挠性覆铜基板及其制造方法。可挠性覆铜基板包括一非导电聚合物基板在非导电聚合物基板上的第一涂层以及第一涂层上的第一铜层。其中，当进行化学抛光以将第一铜层的厚度减小1μm至2μm时，抛光的第一铜层的表面粗糙度为0.1μm至0.15μm，且于法线方向上铜晶粒平均尺寸为2μm以下。