Printed circuit heaters with ultrathin low resistivity materials
(19)AUSTRALIAN PATENT OFFICE (54) Title Printed circuit heaters with ultrathin lowresistivity materials (51)6 International Patent Classification(s) H01C 001/012 (21) Application No: 2003279920 (22) Application Date: 2003.10.10 (87) WIPO No: WO04/039134 (30) Priority Data (31) Number (32) Date 10/278,184 2002.10.22 (33) Country US 200511037 (43) Publication Date : 2004.05.13 (43) Publication Journal Date : 2004 .06.17 (71) Applicant(s) OAK-MITSUI, INC. (72) Inventor(s) Gray, Jeffrey T.; Carbin, Derek C;Andresakis, John A. (-1-1) Application NoAU2003279920 A8(19)AUSTRALIAN PATENT OFFICE (54) Title Printed circuit heaters with ultrathin lowresistivity materials (51)6 International Patent Classification(s) H01C 001/012 (21) Application No: 2003279920 (22) Application Date: 2003.10.10 (87) WIPO No: WO04/039134 (30) Priority Data (31) Number (32) Date 10/278,184 2002.10.22 (33) Country US 200511037 (43) Publication Date : 2004.05.13 (43) Publication Journal Date : 2004 .06.17 (71) Applicant(s) OAK-MITSUI, INC. (72) Inventor(s) Gray, Jeffrey T.; Carbin, Derek C;Andresakis, John A.-1- A printed circuit heater and process for forming a printed circuit heater are described. The printed circuit heater is formed by depositing a thin metal layer onto a surface of a metal carrier foil, forming a composite. The thin metal layer has a thickness of about 0.1 mum to about 2 mum. The composite is attached to a substrate such that the thin metal layer is in contact with the substrate, forming a laminate. At least a portion of the metal carrier foil is selectively removed from portions of the laminate. The thin metal layer is patterned and etched such that the etched thin metal layer has a heat density of from about 0.5 watts/in<2 >to about 20 watts/in<2 >at working voltages from about 3 volts to about 600 volts. The remaining portions of the metal carrier foil, if any, can be selectively removed to thereby provide low resistance busses within the circuit, thus eliminating the need for multiple external connections, and to facilitate evenness of heat distribution. What is claimed is: 1. A process for forming a printed circuit heater comprising the steps of: a) depositing a thin metal or metal alloy layer onto a surface of a metal carrier foil, which thin metal or metal alloy layer has a thickness of about 0. 1 um to about 2 um, thereby forming a composite; b) attaching the composite to a substrate such that the thin metal or metal alloy layer is in contact with the substrate, thereby forming a laminate; c) selectively removing at least a portion of the metal carrier foil from portions of the laminate ; and d) patterning and etching the thin metal or metal alloy layer such that the etched thin metal or metal alloy layer has a heat density of from about 0.5 watts/in2 to about 20 watts/in2 at voltages from about 3 volts to about 600 volts.
2. The process of claim 1 wherein the metal carrier foil comprises copper.
3. The process of claim 1 wherein the thin metal layer comprises nickel.
4. The process of claim 1 wherein the metal carrier foil comprises copper and the thin metal layer comprises nickel.
5. The process of claim 1 wherein the substrate comprises a polyimide.
6. The process of claim 1 wherein the substrate comprises silicone. <Desc/Clms Page number 15> 7. The process of claim 1 wherein the thin metal layer comprises nickel, the metal carrier foil comprises copper and the substrate comprises polyimide.
8. The process of claim 1 wherein the then metal layer comprises nickel, the metal carrier foil comprises copper and the substrate comprises silicone.
9. The process of claim 1 wherein the thin metal layer has a thickness ranging from about 0.4 lim to about. 6 pm.
10. The process of claim 1 wherein the laminate has a thickness ranging from about 25 ; j. m to about 50 , m.
11. The process of claim 1 further comprising the step of applying a protective film cover to the circuit after patterning and etching the thin metal layer.
12. The process of claim 1 wherein all of the metal carrier foil is removed in step (c).
13. The process of claim 1 wherein less than all of the metal carrier foil is removed in step (c).
14. The process of claim 1 wherein the selective removal of step (c) results in the formation of at least one electrically conductive buss. <Desc/Clms Page number 16> 15. A printed circuit heater formed by a process comprising the steps of: a) depositing a thin metal or metal alloy layer onto a surface of a metal carrier foil, which thin metal or metal alloy layer has a thickness of about 0. 1 um to about 2 um, thereby forming a composite; b) attaching the composite to a substrate such that the thin metal or metal alloy layer is in contact with the substrate, thereby forming a laminate ; c) selectively removing at least a portion of the metal carrier foil from portions of the laminate ; and d) patterning and etching the thin metal or metal alloy layer such that the etched thin metal layer has a heat density of from about 0.5 watts/in2 to about 20 watts/in2 at voltages from about 3 volts to about 600 volts.
16. The printed circuit heater of claim 15 wherein the metal carrier foil comprises copper.
17. The printed circuit heater of claim 15 wherein the thin metal layer comprises nickel.
18. The printed circuit heater of claim 15 wherein the metal carrier foil comprises copper and the thin metal layer comprises nickel.
19. The printed circuit heater of claim 15 wherein the substrate comprises a polyimide.
20. The printed circuit heater of claim 15 wherein the substrate comprises silicone. <Desc/Clms Page number 17> 21. The printed circuit heater of claim 15 wherein the thin metal layer comprises nickel, the metal carrier foil comprises copper and the substrate comprises polyimide.
22. The printed circuit heater of claim 15 wherein the then metal layer comprises nickel, the metal carrier foil comprises copper and the substrate comprises silicone.
23. The printed circuit heater of claim 15 wherein the thin metal layer has a thickness ranging from about 0. 4 tm to about. 6 um.
24. The printed circuit heater of claim 15 wherein the laminate has a thickness ranging from about 251l to about 50 Il.
25. The printed circuit heater of claim 15 further comprising a protective film cover which has been applied after the patterning and etching of the thin metal layer.
26. The printed circuit heater of claim 15 wherein all of the metal carrier foil has been removed in step (c).
27. The printed circuit heater of claim 15 wherein less than all of the metal carrier foil has been removed in step (c).
28. The printed circuit heater of claim 15 wherein the selective removal of step (c) results in the formation of at least one electrically conductive buss.