Solder applying device for restricted areas of PCB's - has pivotable lever squeezing press to provide solder in cooperation with screen printing masks

A device for applying solder paste to restricted areas of PCB's on which components are already mounted by screen printing methods. The device includes a transporting and holding device (1) for the PCB's (2). The device also has a lifting and lowering device (3) which is movable vertically in relation to the holding device (1) and has a motor (4). A screen circuit printing device (5) is attached. This includes a base-plate (6) and a stencil arm (7) with stencil printing films (8), attached to the base (6). A pivotable lever (9) has a spring-loaded press (10) which cooperates with the films (8). The printing device (5) also has a pivot driver (11) for the lever (9) and a contact part (12) with a solder cartridge (13) and a flexible lead (14) to the press (10). USE/ADVANTAGE - E.g. for mounting components on PCB's in SMD technology. Enables solder to be deposited accurately to particular areas of the PCB in a simple manner and at a speed acceptable for production line manufacture.

Print template, especially for mounting components on circuit board, has template soldered to metal wire mesh and/or metal wire mesh soldered to stable shape frame

The print template (1) has a template (4) clamped by a stable shape frame (2) that is joined at the outer edge to the inner edge (15) of a metal wire mesh (5) that is cut out in the middle and that is attached to the frame at the outer edges. The template is soldered to the metal wire mesh and/or the metal wire mesh is soldered to the frame.

SIEBDRUCKMASCHINE.

Siebdruckvorrichtung und Siebdruckverfahren

... chtung und ein Siebdruckverfahren an, die bei einem auf der oberen Fläche einer Leiterplatte und auf den Bodenflächen von sich in der oberen Fläche öffnenden Vertiefungen durchzuführenden Siebdrucken die Druckarbeit effizient ausführen und gleichzeitig eine hervorragende Druckqualität sicherstellen können. In der Siebdruckvorrichtung, die eine Paste für das Bonding von elektronischen Bauelementen auf eine obere Fläche und eine Bodenfläche einer Vertiefung druckt, sind eine Druckvorrichtung 2(1) und eine Druckvorrichtung 2(2), die die Paste sequentiell in zwei Schritten auf die Leiterplatte drucken, in einer Reihe angeordnet. Die Druckvorrichtung 2(1) auf der vorgeordneten Seite umfasst eine Bodenflächen-Druckmaske, die in Entsprechung zu der Bodenfläche der Vertiefung vorgesehen ist, und einen geschlossenen Rakelmechanismus 36A, der gegen die obere Fläche der Bodenflächen-Druckmaske anstößt und über dise gleitet, um die Paste unter Druck zu setzen und zuzuführen. Die Druckvorrichtung 2( ...

Siebdruckvorrichtung

VORRICHTUNG ZUM TRAGEN UND SPANNEN EINER SCHABLONE

Einrichtung zum Aufdrucken elektrischer Schaltungselemente auf Traegerkoerper

Verfahren und Vorrichtung zum Herstellen und Sondieren von Gedruckte-Schaltungsplatine-Testzugriffspunktstrukturen

Eine Testzugriffspunktstruktur zum Zugreifen auf Testpunkte einer gedruckten Schaltungsplatine und ein Verfahren zur Fertigung derselben sind präsentiert. Jede Testzugriffspunktstruktur ist leitfähig mit einer Leiterbahn bei einem Testzugriffspunkt und über einer freiliegenden Oberfläche der gedruckten Schaltungsplatine verbunden, um für ein Sondieren durch eine Halterungssonde zugreifbar zu sein. Die Testzugriffspunktstruktur kann entworfen und hergestellt sein, um eine Verformung der Testzugriffspunktstruktur auf ein anfängliches Sondieren der Testzugriffspunktstruktur mit einer Halterungssonde hin zu gestatten, um einen elektrischen Kontakt zwischen der Halterungssonde und der Testzugriffspunktstruktur sicherzustellen.

Screen printing device and screen printing method

Provided are a screen printing device and a screen printing method by which, in the case of a work which requires high positioning accuracy, a necessary printing position accuracy can be obtained. In the screen printing for a plurality of individual substrates (11) held by a carrier (10), a mask plate (14) is provided with a cavity portion (15) wherein a print pattern corresponding to a single individual substrate (11) is formed, images of the mask plate (14) and the respective individual substrates (11) are captured by a camera head unit (23) to recognize positions, and, on the basis of the recognition result, the individual substrates (11) held by the carrier (10) are respectively positioned to correspond to the cavity portion (15) to perform printing sequentially. Thereby, when the plurality of individual substrates (11) are positioned at the same time with respect to the mask plate (14), the positioning error caused by positional variation of the respective individual substrates (11 ...

Screen printing device and screen printing method

Printing screen frame

A screen printing stencil

Screen printer and method for cleaning screen printer

Screen for printing electrical circuits

A printing screen, particularly for use in the printing of electrical circuits, comprises a metal foil (1) having an array of holes (2) etched through it, and a layer of a screen printing emulsion (3) applied to one surface of the foil. A pattern is formed in the emulsion (3) by removing portions of it. The holes (2) and the pattern are formed in accurate register with one another. The foil may be mounted indirectly in a printing frame by bending the foil to a woven mesh stretched in conventional fashion on the frame and then cutting away the mesh in the general area of the pattern. If a suitably resistant emulsion is used then the etching of holes into the foil may be a later step than the pattern formation in the emulsion. ...

A screen printing stencil

Alpha stencil redesign

Screen printing device and screen printing method

Provided is a screen printing device and a screen printing method capable of performing, in a screen printing with respect to an upper surface of a substrate and a bottom surface of a recess portion that is opened in the upper surface, efficient printing operations while ensuring preferable printing quality. In the screen printing, pastes are printed sequentially in two stages with respect to a cavity substrate having an upper surface printing area and a bottom surface printing area on the bottom surface of the recess portion by an upstream printing unit and a downstream printing unit including hermetically sealed squeegee mechanisms (36(1), 36(2)) provided with a first sliding contact plate (54A) and a second sliding contact plate (54B), respectively. In the screen printing, in the case where the bottom surface printing area is to be printed, residual pastes in an reentrant portion on an upper surface side of a fitting portion are scooped with the sliding contact plate disposed in a rearward ...

Screen printing apparatus and method

A screen printing apparatus for screen printing onto a substrate S comprises a printing screen unit with a printing screen 217 and a frame 211 for holding the printing screen in a substantially planar primary configuration: a support 203 for the substrate; a moveable print head 205 for contacting and sweeping across a printing region of a first surface of the printing screen; and an engagement structure 220 mounted to contact a region of a surface of the printing screen which lies outside any part of the printing region and which is drivable to move a portion of the printing screen in a direction orthogonal to the screen. Moving the screen away from the substrate improves separation between the printing screen and substrate. Moving the screen towards the substrate before printing can pre­tension the screen to reduce the tension which the print head has to overcome. There is also provided a method of screen printing which includes the step of moving at least a portion of the screen in a ...

Flexible screen suitable for use in screen printing and method of making same

METHOD OF DECREASING THE WETTABILITY OF SURFACES

... 1337578 Printing stencils E I DU PONT DE NEMOURS & CO 16 Dec 1970 [17 Dec 1969 1 May 1970] 59763/70 Heading B6C [Also in Division B2] A screen stencil is coated with a fluorinated organic compound such as silane to which has been applied a fluorinated anionic surfactant capable of reacting with the silane. Such a surfactant may be fluorinated phosphonic acid and the silane may be gamma-aminopropyltriethoxysilane or delta-aminobutylmethyldiethoxysilane or a mixture thereof.

Screen loading system

Stencil printing device

The stencil 7 of a stencil printing device is fixed on one side at a lift-off distance 5 on the printing level 6 of the printing table 4. The side 13 of the stencil opposite the fixed side 12 is held in a clamping piece 14 which is articulated via pivotable clamping limbs 15 to an axis of rotation 16 on the printing table 4, which axis runs parallel to the fixed side 12. The axis of rotation 16 lies underneath the underside 17 of the stencil 7, by which means the tension and lift-off of the stencil 7 can be controlled simply merely by the weight acting on the clamping limbs 15. ...

DRUCKSCHABLONE OF A SMT PROCESS AND A PROCEDURE FOR YOUR COATING

PRINTING FILTER, SCREEN PRINTING MACHINE AND - PROCEDURES

SCREEN PRINTING FORM

SPANNRAHMEN MIT DRUCKSCHABLONE

The template (5) is of flexile material and is mounted on a frame (2) that is constructed from elements to create a box section. Fixed to the sides of the frame are flexible clamping elements (3) that have tips (6) shaped to engage in lugs (4) mounted on the template. This applies a stretching force to tension the template.

PROCEDURE FOR THE PRODUCTION OF A SUBSTRATE WITH MANAGING PORTIONS

SCREEN PRINTING DEVICE

SCHABLONENDRUCKVORRICHTUNG

CLAMPING FRAME WITH DRUCKSCHABLONE

Fine pitch component placement method and apparatus

STENCIL FOR DEPOSITING AND PORTIONING VARIOUSLY THICK SPOT LAYERS OF A VISCOUS MATERIAL

La présente invention conceme un pochoir (25,38) pour le dépôt et le dosage de couches plus ou moins épaisses, à base de points, d'un produit visqueux. Pour remédier aux problèmes rencontrés sur l'écran sérigraphique en toile polyester ou métallique et au pochoir métallique, la présente invention propose d'utiliser une feuille pleine et homogène (38) de matière synthétique et péférentiellement en polyester sans inclusion de fils. Cette feuille pleine en polyester est percée mécaniquement ou thermiquement aux endroits voulus. La toile polyester, du fait qu'elle est pleine, admet des forces de tension supérieure aux toiles à fils métalliques et au moins égale aux pochoirs métalliques.

MINI-STENCIL AND DEVICE FOR USING SAME

La présente invention concerne un mini pochoir (8) avec son élément de tension associé à un dispositif de mise en oeuvre permettant de déposer de la crème à braser pour le remplacement de composants sur une carte électronique, qui comprend: une feuille plane (1) de forme rectangulaire en matériau synthétique souple ou métallique dotée d'orifices (2) de transfert et distribution du produit; deux des côtés parallèles de la feuille sont reliés à des pattes verticales rigides (3) et mobiles en position de fixation sur un élément de mise en tension de la feuille; les deux autres côtés parallèles de la feuille et orthogonaux aux précédents sont prolongés par des parois souples (6) orthogonales à la feuille, un pli raidisseur (7) séparant la feuille perforée et chacune des parois, ledit pli délimitant la feuille, la paroi étant libre en rotation autour du pli. Un élément de mise en oeuvre formant le bras (20) à plusieurs brins articulés dotés d'un moyen unique de blocage (22) de ses articulations ...

Verfahren zur Herstellung einer Rasterschablone

Device and method for correcting screen printing machine

Method for manufacturing screen printing mask with resin, and screen printing mask with resin

STENCIL KEY SET OF SERIGRAPHY AND PROCESS TO CARRY IT OUT

MINI STENCIL KEY SET AND ITS SYSTEM Of AUTOPOSITIONING FOR the REPAIR AND/OR the REPLACEMENT OF UNIT COMPONENTS ON an ELECTRONIC CHART

Electronics circuit flux dispensing stencil

La présente invention concerne un mini pochoir permettant de déposer de la crème à braser ou du flux pour la réparation de composants et/ ou le remplacement de composants sur une carte électronique. Le mini pochoir selon l'invention comprend : - une feuille plane (1) de forme rectangle en un matériau synthétique souple dotée d'orifices (2) de transfert et distribution du produit; - deux des côtés parallèles de la feuille sont reliés à des pattes verticales rigides (3) et mobiles en position de fixation sur un bâti support et de mise en tension de la feuille; - les deux autres côtés parallèles de la feuille et orthogonaux aux précédents sont prolongés par des parois souples (6) orthogonales à la feuille, un pli raidisseur (7) séparant la feuille perforée et chacune des parois, ledit pli délimitant la feuille, la paroi étant libre en rotation autour du dit pli.

Method of refilling the hollow grid of the printed circuit boards during the manufacture of IC chips, uses a mesh which rests on the substrate without any deformation, and which acts as a guide for the injection unit

L'invention consiste en un moyen permettant de remplir des inter-pistes profonds sur un circuit imprimé (1) par l'utilisation d'un écran à mailles métalliques d'épaisseur inférieures à 150µ et dont le rapport de surface ouverte est supérieur à 50%. Ladite maille (4) en tension est inextensible sous l'effet de la pression de transfert du produit à transférer. La maille prend appui sur le substrat et ne subit aucune déformation, elle permet de guider sur un plan parfaitement défini l'organe de transfert (7).

STORABLE SILK SCREEN DEVICE

스크린 인쇄용 메쉬 부재 및 스크린 인쇄판

... 본 발명은 핑거 전극 및 버스 바 전극을 스크린 인쇄로 형성할 때에 사용되는 스크린 인쇄용 메쉬 부재를 제공하는 것이다. 이 메쉬 부재는 압연 금속박에 에칭으로 천공 가공된 것이다. 핑거 전극 대응부에서는, 가로로 긴 형태로 형성된 각각의 구멍이 당해 구멍의 횡길이 방향과 직교하는 방향으로 배열 설치되어, 당해 횡길이 방향의 길이가, 인쇄 패턴 예정부의 폭보다 크고, 그 단부가 인쇄 패턴 예정부의 외측까지 연장되어 형성되어 있다. 핑거 전극 대응부에 있어서의 개구 면적률이 버스 바 전극 대응부에 있어서의 개구 면적률보다도 크다.

스크린 인쇄용 메쉬 부재 및 스크린 인쇄판

... 본 발명은 핑거 전극 및 버스 바 전극을 스크린 인쇄로 형성할 때에 사용되는 스크린 인쇄용 메쉬 부재를 제공하는 것이다. 이 메쉬 부재는 압연 금속박에 에칭으로 천공 가공된 것이다. 핑거 전극 대응부에서는, 가로로 긴 형태로 형성된 각각의 구멍이 당해 구멍의 횡길이 방향과 직교하는 방향으로 배열 설치되어, 당해 횡길이 방향의 길이가, 인쇄 패턴 예정부의 폭보다 크고, 그 단부가 인쇄 패턴 예정부의 외측까지 연장되어 형성되어 있다. 핑거 전극 대응부에 있어서의 개구 면적률이 버스 바 전극 대응부에 있어서의 개구 면적률보다도 크다.

STENCILS WITH REMOVABLE BACKINGS FOR FORMING MICRON-SIZED FEATURES ON SURFACES AND METHODS OF MAKING AND USING THE SAME

Screen plate and method for manufacturing same

To provide a screen plate with which printing accuracy can be improved. A screen plate comprising a plate frame, and a screen gauze formed of synthetic fiber warps and wefts, characterized in that the screen gauze is stretched over the plate frame under a prescribed tension, and that a thickness of the screen gauze stretched over the plate frame is 88% or less of a thickness of the screen gauze not under tension.

SCREEN PRINTING FRAME

The invention relates to a screen printing frame comprising: a first layer as a screen printing template carrier, designed as a high-grade steel foil and being provided with first cavities which are designed such that they reach from an upper side to a bottom side of the first layer; a second layer as a screen printing template, designed as a masking layer which is rigidly connected to the lower side of the first layer. The second layer is provided with second cavities which at least partially overlap the first cavities of the first layer such that a printing medium can be conveyed through the first cavities of the first layer from the upper side thereof through the second cavities of the second layer in the direction of the lower side onto a substrate that can be placed beneath. The surfaces of the first and/or the second cavities are provided with a coating which has a thickness which is at least 5 % of the smallest cross-section inner width of the respective cavity, the ratio of the ...

MESH MEMBER FOR SCREEN PRINTING AND SCREEN PRINTING PLATE

A mesh member for screen printing is used when a finger electrode and a bus bar electrode are formed by screen printing. This mesh member is processed by making holes in rolled metallic foil by etching. In a finger electrode-associated portion, individual holes each formed in an oblong shape are lined up in the direction orthogonal to the oblong direction of the hole, the length in the oblong direction thereof is larger than the width of a scheduled printing pattern portion, and the ends thereof are formed to extend to the outside of the scheduled printing pattern portion. The opening area rate in the finger electrode-associated portion is larger than the opening area rate in a bus bar electrode-associated portion.

MONOFILAMENT FOR SCREEN FABRIC AND PROCESS FOR PRODUCTION OF SCREEN FABRIC

A high-mesh and high-modulus screen fabric excellent in the stability in weaving, the stability as screen fabric, and continuous printing performance can be obtained by subjecting a woven fabric constituted of monofilaments for screen fabric which exhibit, after moist-heat treatment, a degree of inclination change (B/A ratio) of 0.6 or above but below 1.0 in the elongation-stress curve wherein A is an inclination just before the primary yield point and B is that just after the primary yield point to treatment with boiling water, heat-setting the treated fabric in a state stretched by 0.2 to 5% in the both warp and weft directions, and then setting the resulting fabric in a state further stretched by 0.3 to 5%.

STENCIL MANUFACTURE

A method of forming a screen-printing stencil comprising electroforming the stencil using a bi-polar electrical signal. The bi-polar signal comprises a cathodic pulse (22) and an anodic pulse (24) . When the cathodic pulse (22) is applied during the electroforming process, metal is deposited. When the anodic pulse (24) is applied, metal is removed. The cathodic pulse (22) has a longer duration than the anodic pulse (24) . The ratio of the magnitude of the anodic pulse (24) to the magnitude of the cathodic pulse (22) is greater than one.

PLATE FOR SCREEN PRINTING AND METHOD FOR MANUFACTURING THE SAME

A plate for screen printing characterized in that it comprises a screen frame and, stretched thereon, a sheet of at least one resin selected from among polyimide, polyether imide, polyphenylene sulfide which sheet is punched by means of a numerically controlled punching machine, as well as a method for manufacturing a plate for screen printing characterized in that it comprises stretching a sheet of at least one resin selected from among polyimide, polyether imide, polyphenylene sulfide on a screen frame and then punching said resin sheet by means of a numerically controlled punching machine, or it comprises punching said resin sheet stretched by cramping edge parts thereof by means of a numerically controlled punching machine, and then stretching said resin sheet on a screen frame.

Method for manufacturing electronic component

A method for manufacturing an electronic component includes the steps of inserting tabs of a cover into through holes formed in a circuit board having mounting elements on the front surface thereof, disposing a print mask having openings at positions corresponding to the through holes on the back surface of the circuit board, and supplying solder cream to the through holes through the openings by placing the solder cream on the print mask and moving the solder cream in a predetermined direction with a squeegee. The print mask is provided with projections which project upstream in the moving direction of the solder cream in openings of the print mask, and the openings are shifted upstream in the moving direction of the solder cream. In addition, the tabs are inserted into the through holes such that the width direction of the tabs is along the moving direction of the solder cream.

Printing mask for use in printing on a board having a projected portion and manufacturing process therefor

A printing mask for use in printing on a board having a projection characterized in that a cavity member with a desired dimension is put on a screen tensed on a frame, a part of the screen surrounded by an open end of the cavity member is cut off, and thereafter, the other part of the screen is formed with a pattern to be printed.

STENCIL.

PRINTING STENCILS FOR APPLYING A PRINTING PATTERN TO A SUBSTRATE AND METHOD FOR PRODUCING A PRINTING STENCIL

The present invention relates to a printing stencil, for example, for applying a contacting (contact finger, busbar(s)) to a substrate of a solar cell and to a method for producing such a printing stencil. The printing stencil can include a carrier layer and a structure layer located below the carrier layer, the structure layer having at least one printed image opening which corresponds to at least a portion of the printed image of the contacting (contact finger, busbar(s)), the carrier layer having one or more carrier layer openings and the one or more carrier layer openings overlapping when the printing stencil is viewed from above, with respect to the printed image opening in such a manner that the printing stencil has an opening which is formed from the at least one printed image opening and the one or more carrier layer openings, and is suitable for applying contacting material to the substrate through the opening.

PCB stencil manufacturing method and system

A PCB stencil manufacturing method and system. The method comprises: inputting PCB stencil design information in a preset input format, the PCB stencil design information comprises solder pad element information; and converting the PCB stencil design information into corresponding system core data information, the system core data information comprises solder pad element packaging information, and the solder pad element packaging information comprises a solder pad element packaging pattern and solder pad element coordinates; and querying a stencil opening database according to the solder pad element packaging pattern, records in the stencil opening database comprise the following attributes: a solder pad element packaging pattern and a stencil opening pattern; and placing a stencil opening pattern corresponding to a matching solder pad element packaging pattern to an opening layer according to the solder pad element coordinates.

Method and mask assembly for forming solder bodies on a substrate

A method for forming solder bodies on a substrate includes: positioning a first mask plate, which is formed with at least one first through-hole, on the substrate; filling the first through-hole with a first solder paste so as to form a first solder body on the substrate; positioning a second mask plate, which is formed with at least one second through-hole and at least one recess spaced apart from the second through-hole, on the substrate in such a manner that the first solder body is received in the recess; and filling the second through-hole with a second solder paste so as to form a second solder body on the substrate.

Processes for forming waveguides using LTCC substrates

Processes for forming waveguides (200) using multiple co-planar layers of LTCC substrates (212, 212a, 212b) are described. Registration holes (222) on the substrates help align layering of the substrates. Arrays of circuit patterns are printed on each substrate, with each circuit being made up of conductor pattern (213) and/or via holes (224). Cavity alignment holes (226) formed around a periphery of each circuit allow alignment marks to be printed on the substrates for vision inspection. Similarly, circuit orientation holes (227) associated with each circuit allow orientation marks to be printed on the substrates to identify orientation of circuits in each finally formed waveguide. Substrate orientation holes (225) allow marks to be printed on one side of each substrate for alignment during screen printing. These in-process vision inspections and quality assurance tests allow product quality and process yields to improve.

Printing plate, and printing method using the same

A circuit board with high quality is provided by preventing the falling of paste which comes around to the squeegee complementary angle side during the pattern printing or paste filling by the squeegeeing method. While lowering, the squeegee is passed through the inclined portion of a paste removing section (3) provided on a mask (2 ) before pattern printing or paste filling, whereby the paste on the non-printing side (complementary angle) of the squeegee can be removed; thus, a circuit board superior in quality is obtained.

Virtual silk screen for printed circuit boards

Methods and devices that identify a silkscreen data file associated with a physical printed circuit board and use an image of the physical printed circuit board to display a virtual silkscreen over the image of the physical printed circuit board.

Viscous fluid supply device

In solder printer, solder supply device uses positive and negative pressure supply device to apply pressure inside air chamber to move solder cup inside outer tube, such that solder paste is supplied from supply nozzle. Controller, when supply of solder paste from supply nozzle is stopped, performs drive control of positive and negative pressure supply device to decrease the pressure inside air chamber, and uses timer to measure the time required from the starting of decreasing the pressure inside the air chamber to when the pressure inside air chamber has reached a set pressure. Because this required time corresponds to the movement amount of solder cup from the start of supply of the solder paste to when supply is stopped, controller using the measured required to estimate the remaining amount of the solder paste in detail with good accuracy.

SYSTEM AND METHOD FOR NORMALIZING SOLDER INTERCONNECTS IN A CIRCUIT PACKAGE MODULE AFTER REMOVAL FROM A TEST BOARD

A system for normalizing the solder interconnects (e.g., normalizing the height of the solder ball interconnects) in a circuit package module (e.g., dual-sided mold grid array package module) after removal from a test board includes a fixture that receives the circuit package module upside down and a stencil removably coupleable to the fixture and over the circuit package module. The stencil has a pattern of apertures that coincides with the pattern of solder interconnects of the circuit package module. Solder paste can be applied over the stencil to pass through the apertures to add solder paste to the solder interconnects. The stencil can be removed from over the fixture, and the circuit package module removed from the fixture. The circuit package module can be heated to reflow the solder interconnects with the added solder paste.

Hydrophilization process for a screen printing carrier, process and liquid for removing screen material from the carrier

Die Erfindung betrifft ein verfahren zur Hydrophilierung von Siebdruckschablonenträgern, bei dem der Siebdruckschablonenträger vor dem Aufbringen von Schablonenmaterial mit einem Hydrophilierungsmittel behandelt wird, Das Verfahren ist dadurch gekennzeichnet, daß ein Hydrophilierungsmittel verwendet wird, das feinstteilige oxidteilchen und ein Benetzungsmittel enthält. Die Erfindung betrifft ferner eine Entschichtungsflüssigkeit zum Entfernen von Schablonenmaterial von einem Siebdruckschablonenträger mit einem Entschichtungsmittel und einem Benetzungsmittel, welche dadurch gekennzeichnet ist, daß die Entschichtungsflüssigkeit feinstteilige Oxidteilchen enthält.

PRINTING MASK

SYSTEM AND METHOD FOR MODIFYING ELECTRONIC DESIGN DATA

Customer data relating to the location and character of fiduccials (e.g., conductive pads to which electronic parts are soldered on a printed circuit board) are stored in a digital form (e.g., as "Gerber data"). A library of footprints that characterize the features is created from this data (62, 64). A footprint filter and a modification parameter are then applied to the footprint library to select footprints for modification and to make a desired change to the selected footprints. In a printed circuit board embodiment, apertures (54, 56) in a stencil designed for printing solder on the printed circuit board are then cut in accordance with the footprints. Data representing all the apertures to be cut in the stencil can be moved or scaled to compensate for variations in the printed circuit board manufacturing and stencil manufacturing processes. The above-described method can be carried out via instructions stored as software code on a computer-readable medium.

Process and apparatus for manufacturing thin perforated foils by electroforming

The apparatus comprises an electrically conductive cathode (3) having an active surface which has at least one island which is not receptive to deposition. This island (4) is embedded in the cathode and has an outer face situated flush with the active surface of the cathode. This island may be formed in a hollow arranged either in the active surface of the cathode or in a conductive layer deposited onto this active surface. The island may be formed by localised deposition or by continuous deposition and selective removal depending on the desired pattern. A metal layer is formed by electrodeposition on the cathode thus prepared and the perforated sheet (1) is then detached. ...

Printing mask having protrusions with through holes for printing solder paste on lands on printed circuit board

A printing mask (1) has protrusions (13) having through holes (12) defined therein for printing a solder paste (3) on lands (6) on a printed circuit board (2). The protrusions (13) serve to increase the amount of solder paste (3) filled in the through holes (12).

ТРАФАРЕТНЫЕ СЕТКИ, РАМКИ ДЛЯ НИХ И БЛОКИ ТРАФАРЕТНЫХ СЕТОК

... 1. Блок трафаретной сетки, содержащий: ! трафаретную сетку, содержащую лист, по меньшей мере часть по меньшей мере одной пары противоположных краев которого содержит либо отверстия для сцепления, либо выступы для сцепления; и ! опорную рамку, содержащую по меньшей мере одну пару сопрягающих блоков, которые присоединены по меньшей мере к одной паре противоположных краев трафаретной сетки, причем каждый из сопрягающих блоков содержит по меньшей мере один соединительный элемент, который содержит другие отверстия для сцепления или выступы для сцепления для взаимного сцепления либо с отверстиями для сцепления, либо с выступами для сцепления в соответствующем одном из противоположных краев трафаретной сетки и сопрягающий элемент для сцепления с натяжным механизмом, который содержит соединительную секцию, которая содержит первую и вторую части корпуса, которые вместе образуют между собой соединительную щель, в которую вставляется по меньшей мере один соединительный элемент и соответствующий край ...

Befestigungsverfahren für elektrische Bauteile

Befestigungsverfahren für wenigstens ein elektronisches Bauteil mit den folgenden Schritten: Anordnen eines leitfähigen Verbindungsmaterials (40) über einem Verdrahtungssubstrat (10), welches einen Verdrahtungsabschnitt (12) enthält; Anordnen des wenigstens einen elektronischen Bauteiles (20) auf dem Verdrahtungssubstrat (10) mittels dem leitfähigen Verbindungsmaterial (40); Ausbilden eines Drahtbondierkissens (50) aus Metall an einem Abschnitt des Verdrahtungsabschnittes (12), der drahtbondiert werden soll; und Drahtbondieren des elektronischen Bauteils (20) an dem Verdrahtungsabschnitt (12) über das Drahtbondierkissen (50), wobei das Drahtbondierkissen (50) ausgebildet wird, bevor das leitfähige Verbindungsmaterial über dem Verdrahtungssubstrat (10) angeordnet wird, und das Drahtbondierkissen (50) durch Abreiben des Abschnittes des Verdrahtungsabschnittes (12), der drahtbondiert werden soll, mit einem Bauteil (K3) gebildet wird, so dass das Drahtbondierkissen (50) in Filmform ausgebildet ...

Druckschablone sowie Verfahren zu deren Herstellung

Verfahren zur Herstellung einer Druckschablone (1) zur Aufbringung von Pads auf in einem bestimmten Muster angeordnete Kontaktstellen einer Leiterplatte (3) mit dreidimensionaler Oberflächenstruktur (4), wobei in ein Schablonenmaterial (2) auf dessen der Leiterplatte (3) zugewandten Schablonenseite ein Abbild der dreidimensionalen Oberflächenstruktur (4) der Leiterplatte (3) eingebracht wird, dadurch gekennzeichnet, dass auf das Schablonenmaterial (2) auf dessen der Leiterplatte (3) zugewandten Schablonenseite eine verformbare Abformschicht (2c) aufgebracht wird, und dass das Schablonenmaterial (2) unter Abformung der Oberflächenstruktur (4) der Leiterplatte (3) nur in die Abformschicht (2c) gegen die Leiterplatte (3) gepresst wird.

Printing screen for relief substrates, preferably for electronic unit manufacture, has structure plate with differently shaped openings in different directions on upper surface and printing spaces

The device has a structure plate (3) arranged within the surface of a screen-printing frame (1) spanned by a screen printing gauze (2). The structure plate has differently shaped openings in different directions on its upper surface with spaces for feeding an element with print images (4) underneath and recesses (5) on the underside in the form of a component to be accommodated or other protrusions already present on the printing substrate.

METALLMASKE ZUR VERWENDUNG BEIM SIEBDRUCK

SIEBDRUCKSCHABLONE

DRUCKPLATTE, LEITERPLATTE UND VERFAHREN ZUM DRUCKEN EINER LEITERPLATTE

Screen printing

Improved printing stencil

Planarity alignment of stencils and workpieces

An alignment system 10 for a workpiece printing machine comprises a stencil support 14 for supporting a mask 3 and a workpiece support 4 for supporting an article 15 in an X-Y plane. A planarity control mechanism with at least one actuator 7’, 8’, 9’ allows relative rotation between the supports 14, 4 about at least one of the axes defining the X-Y plane. At least two actuators 7’, 8’ may be arranged to allow rotation about both these axes. At least two movable clamps 11, 12 may be located on an alignment frame, which may comprise the workpiece support 4 or the mask support 14. A third movable or fixed alignment clamp 13 may also be present. Each clamp 11, 12, 13 may comprise bearings which co-operate with an external surface to allow movement of the frame within the X-Y plane. A clamp assembly with mutually opposed clamping surfaces and an actuator to switch the grip assembly between unclamped and clamped states by movement of the clamping surfaces along an axis is also disclosed, as is ...

Method of applying corrosion inhibitor to parts mounted circuit board

Flexible screen suitable for use in screen printing and method of making same

A flexible screen 10 suitable for use in screen printing comprising a flexible sheet material having a plurality of first holes (12) formed therein positioned to define a pattern which is to be screen printed using the screen. An array 22 of second holes (24) is also formed in the flexible sheet material and a layer of flexible material covers the second holes (24) but leaves the first holes (12) exposed. A method of making a screen is also described.

SCREEN PRINTING

Solder stencil mounting frame

A frame for mounting a metal stencil for use in the printing of solder paste on to printed circuit boards, comprises a rectangular frame (46) having along each side thereof a mounting bar (44, 53) having a plurality of attachment means (80) for attaching an edge portion of a stencil (82) thereto, at least two adjacent mounting bars being slidably mounted to move outwardly and inwardly of the frame, and the frame including manually-operable means (40, 41, 48 - 50) for moving the movable mounting bars outwardly of the frame together, whereby the stencil may be tensioned in two directions. Pivotal levers (41) may be operated to urge the opposed bars apart by respective rotatable cam shafts (40) and axially movable cam shafts (49). Alternative actuating mechanisms are disclosed. ...

METAL MASK SCREEN FOR SCREEN-PRINTING

... 1393056 Printing screen RCA CORPORATION 22 Aug 1973 [28 Aug 1972] 39740/73 Heading B6C A printing screen comprises a metal mesh having on it an image carrying layer of metal 2 occupying the central part of the mesh and being surrounded by a layer of synthetic resin 10, the metal layer having peripheral tabs 8 extending into the resin layer at points of stress. The periphery of the screen may have a layer of metal 12. The mesh is preferably nickel coated stainless steel and the metal layer 2 is of nickel. The synthetic resin is preferably diazosensitized hydrolysed polyvinyl alcohol.

Tooling pin placement system

Screen printing apparatus screen printing method

Location detector device

Provided is a mask holder for holding a mask, in which a patterned hole corresponding to the disposition of an electrode is formed, above a substrate holding member, said mask holder being used in screen printing machines for printing solder paste onto an electrode on a substrate. The mask holder is equipped with: operating knobs (42) capable of movement operations in the front-rear direction with respect to left-and-right edge supporting members (31) for supporting both the left and right edges of a mask inserted horizontally in the printing machine from the front; rod members (45), an end of each rod member being connected to the corresponding operating knob (42); rear edge stoppers (47) which are moved in the front-rear direction via the rod members (45), and which are brought into contact with the rear edge of a mask (15) by a fixing operation of the rod members (45) with respect to the left-and-right edge supporting members (31) operated by the operating knobs (42); and front edge ...

Screen printing system and method for cleaning masks of screen printing system

Disclosed are a screen printing system and a method for cleaning masks of the screen printing system that can sufficiently clean the masks used in screen printing of a cavity substrate. The mask-contact region (R) of a paper member (42) is caused to contact the bottom surface of one of the convex sections (13t) of a first mask (13a), and after eliminating paste (Pst) adhered to that portion, and during the period until the paper member (42) contacts the next convex section (13t) from which paste (Pst) is to be eliminated, the paper member (42) is reeled, causing the mask-contact region (R) to be replaced.

Screen printing system and method for cleaning masks of screen printing system

STENCIL HAVING IMPROVED WEAR-RESISTANCE AND QUALITY CONSISTENCY AND METHOD OF MANUFACTURING THE SAME

Inflatable pneumatic stencil clamp

DEVICE FOR CARRYING AND STRETCHING A TEMPLATE

IMPROVED TEMPLATE OR MASK FOR APPLYING PLUMB BOB ON PRINTED CIRCUIT BOARDS AND SUPPORT FRAMES FOR IT

PERFORATED SCREEN PRINTING FORM FOR APPLYING AND PROPORTIONING MORE OR LESS THICKNESSES LAYERS OF A VISCOUS PRODUCT

FRAMEWORK FOR SUPPORTING DRUCKSCHABLONEN

PROCEDURE FOR THE PRODUCTION OF A PRINTED CIRCUIT BOARD LAYER (LAYER OF CIRCUITRY) FOR AN IN PARTICULAR MULTILEVEL PRINTED CIRCUIT BOARD (CERAMIC SUBSTRATE)

FILTER FOR THE TECHNICAL SCREEN PRINTING

DEVICE FOR THE SOLDERING OR CONDUCTIVE PASTE PRINTING.

SCREEN PRINTING DEVICE

Screen print system and method for cleaning a mask of the same

It is an objective to provide a screen print system and a method for cleaning a mask of the screen print system that enable sufficient cleaning of the mask used for subjecting a cavity substrate to screen printing. A mask contact area R of a paper member 42 is brought into contact with a lower surface of one of convex portions 13 t of a first mask 13 a, thereby removing paste Pst adhering to the lower surface. Subsequently, the paper member 42 is winded up before the paper member 42 contacts the next convex portion 13 t to be subjected to removal of the paste Pst, thereby updating the mask contact area R.

Method for making an opening in a substrate

A method for making an opening in a substrate includes creating a cutting path in the substrate for cutting out a polygonal area along predetermined side paths which enclose the opening and are connected to each other via respective corner points. The cutting path is started in an internal region of the polygonal area at a distance from the side paths. The cutting path is continued in a recess in the internal region to a start point on a first one of the side paths, the start point being disposed along the first one of the side paths at a substantial distance from each of the respective corner points so as to divide the first one of the side paths into a long side path portion and a short side path portion. The cutting path is continued, from the start point, along each of the side paths.

Stencil for printing solder paste on printed circuit board

A stencil for printing solder paste on a printed circuit board improves an assembly process, cuts production costs, and saves storage space. The stencil is coupled to a fixing frame having a plurality of fixing portions and a motor unit. The motor unit generates a plurality of pulling forces. The stencil includes a solder paste printing region and a plurality of fixing regions. Vias are disposed in the solder paste printing region. The directions of the pulling forces are coplanar with the solder paste printing region. The edge of the solder paste printing region extends outward to define the fixing regions. The fixing regions are movably fixed to the fixing portions and bear the pulling forces to flatten the solder paste printing region of the stencil.

ELECTRICALLY CONDUCTING ASSEMBLIES

The present invention pertains to a process for the manufacture of a multilayer assembly comprising applying at least one patterned substrate onto at least one surface of at least one non-patterned substrate. 19-. (canceled)10. A multilayer assembly comprising: a patterned layer (LMP) made of a core of at least one first metal compound (M1) and, optionally, a shell of at least one second metal compound (M2) at least partially coating said core, said compound (M2) being equal to or different from said compound (M1), and', 'optionally, directly adhered onto at least one surface of layer (LMP), preferably onto one surface of layer (LMP), an optically transparent substrate layer (LT-1); and, '(1) at least one patterned substrate, said patterned substrate comprising an optically transparent substrate layer (LT-2) having an outer surface and an inner surface, said layer (LT-2) being equal to or different from layer (LT-1), if any, and', {'sub': 'ot', 'directly adhered onto one surface of layer (LT-2), an optically transparent non-patterned layer (LMT) made of at least one optically transparent metal compound (M),'}, 'said at least one surface of layer (LT-2) being optionally treated by a radio-frequency glow discharge process in the presence of an etching gas, wherein layer (LMP) of the patterned substrate of the multilayer assembly is directly adhered onto the opposite surface of layer (LMT) of the non-patterned substrate., '(2) at least one non-patterned substrate, said non-patterned substrate comprising12. The multilayer assembly according to claim 10 , said multilayer assembly comprising:a patterned layer (LMP) made of a core of at least one first metal compound (M1) and, optionally, a shell of at least one second metal compound (M2) at least partially coating said core, said compound (M2) being equal to or different from said compound (M1),{'sub': 'ot', 'directly adhered onto one surface of layer (LMP), an optically transparent non-patterned layer (LMT) made of at ...

PCB STENCIL MANUFACTURING METHOD AND SYSTEM

A PCB stencil manufacturing method and system. The method comprises: inputting PCB stencil design information in a preset input format, the PCB stencil design information comprises solder pad element information; and converting the PCB stencil design information into corresponding system core data information, the system core data information comprises solder pad element packaging information, and the solder pad element packaging information comprises a solder pad element packaging pattern and solder pad element coordinates; and querying a stencil opening database according to the solder pad element packaging pattern, records in the stencil opening database comprise the following attributes: a solder pad element packaging pattern and a stencil opening pattern; and placing a stencil opening pattern corresponding to a matching solder pad element packaging pattern to an opening layer according to the solder pad element coordinates. 1. A PCB stencil manufacturing method , wherein the PCB stencil manufacturing method comprises:inputting PCB stencil design information in a preset input format, the PCB stencil design information comprises solder pad element information; and converting the PCB stencil design information into corresponding system core data information, the system core data information comprises solder pad element packaging information, and the solder pad element packaging information comprises a solder pad element packaging pattern and solder pad element coordinates; andquerying a stencil opening database according to the solder pad element packaging pattern, records in the stencil opening database comprise the following attributes: a solder pad element packaging pattern and a stencil opening pattern; and placing a stencil opening pattern corresponding to a matching solder pad element packaging pattern to an opening layer according to the solder pad element coordinates.2. The PCB stencil manufacturing method as in claim 1 , wherein the PCB stencil ...

Screen printing apparatus and method

A screen printing apparatus for screen printing onto a substrate comprises: a printing screen unit, with a printing screen and a frame for holding the printing screen in a substantially planar primary configuration; a support for the substrate; and a moveable print head for contacting and sweeping across a printing region of a first surface of the printing screen; an engagement structure mounted to contact a region of a surface of the printing screen which lies outside any part of the printing region which is drivable to move a portion of the printing screen in a direction orthogonal to the screen. Moving the screen away from the substrate improves separation between the printing screen and substrate. Moving the screen towards the substrate before printing can pre-tension the screen to reduce the tension which the print head has to overcome. Controlled movement of the screen towards and away from the substrate can reduce tension applied to the screen, and thus improve its working life.

MASK FRAME ASSEMBLY INCLUDING PATTERN POSITION ADJUSTING MECHANISM AND PATTERN POSITION ADJUSTING METHOD USING THE MASK FRAME ASSEMBLY

A mask frame assembly includes: a mask including a deposition pattern through which a deposition material is deposited to a deposition target; a frame to which the mask comprising the deposition pattern is combined; and a pattern position adjusting mechanism which is coupled to the frame and configured to apply a force to the frame such that a position of the deposition pattern of the mask combined to the frame is changed. 1. A mask frame assembly comprising:a mask comprising a deposition pattern through which a deposition material is deposited to a deposition target;a frame to which the mask comprising the deposition pattern is combined; anda pattern position adjusting mechanism which is coupled to the frame and configured to apply a force to the frame such that a position of the deposition pattern of the mask combined to the frame is changed.2. The mask frame assembly of claim 1 , wherein the pattern position adjusting mechanism comprises:a rotor provided in plurality along an edge of the frame; anda wire which connects more than one of the rotor to each other and applies the force to the frame according to rotation of the rotor.3. The mask frame assembly of claim 2 , wherein each of the plurality of rotors comprises:a winch bolt rotatably combined to the frame and to which the wire is connected; andan adjusting bolt integrally combined to the winch bolt and with which rotation of the winch bolt is manipulable.4. The mask frame assembly of claim 3 , wherein the winch bolt rotatably combined to the frame is provided on an outer surface of the edge of the frame.5. The mask frame assembly of claim 3 , wherein an outer circumference surface of the adjusting bolt is a polyhedron.6. The mask frame assembly of claim 2 , wherein the wire is provided in singularity commonly connected to all of the plurality of rotors and surrounds the edge of the frame.7. The mask frame assembly of claim 2 , wherein the wire is provided in plurality each connecting more than one of the ...

SCREEN EXTENDING FRAME

A screen extending frame including cut grooves formed from an inner side to an outer side thereof, or from the outer side to the inner side, or in both directions of joints of the screen extending frame, which is constituted by connecting four frame members in a rectangle shape. The cut grooves enable the joints to deform. The four frame members are individual bodies that are joined by corner members, and connecting portions are inclined with respect to the longitudinal direction of the frame members. Gaps are created in the connections. Elastic elements can be placed at the connections of the four frame members. Alternatively, the joint portions are orthogonal to the longitudinal direction, and elastic elements are placed at the joints. 1. A screen extending frame having a rectangular shape , said screen extending frame comprising:four frame members connected so as to define a rectangular shape, each of said four frame members having a square cross sectional shape,and said four screen frame members are connected at a plurality of joints,and one face of each of said four frame members is attachable to a screen,and an opposite face of each of said four frame members is adopted to a screen extending jig having an extending and reducing function,wherein said four frame members are individual units, adjacent frame members are joined by a corner member respectively, and couplings of said four frame members and said four corner members have flexibility and elasticity.2. The screen extending frame according to claim 1 ,wherein end faces of connecting portions to which said four frame members are adjacent are faces inclined in the longitudinal direction of said four frame members, and gaps are formed between respective inclined faces.3. The screen extending frame according to claim 1 ,wherein end faces of connecting portions to which said four frame members are adjacent are faces inclined in the longitudinal direction of said four frame members, and elastic elements are ...

Board printing apparatus and board printing method

A board printing apparatus includes a board working table, a first printing table, a second printing table, and a control portion controlling printing operations. The control portion is configured to perform second printing on a board held by the board working table by a large component mask of the second printing table after a first printing performed on the board held by the board working table by a small component mask of the first printing table.

APPARATUS FOR PERFORMING COMPENSATION ASSOCIATED WITH SCREEN PRINTER AND METHOD THEREOF

An apparatus that communicates with a screen printer and a solder inspection device is disclosed. The apparatus according to the present disclosure may include a process that is configured to: obtain first information associated with each of a plurality of pads on the substrate; obtain second information associated with each piece of the solder paste applied to each of the plurality of pads from the solder inspection device; determine a position correction value for the stencil mask with respect to the substrate based on the first information and the second information; and deliver the position correction value to the screen printer. 1. An apparatus that communicates with a screen printer , which applies solder paste to a substrate on which a stencil mask is disposed , and communicates with a solder inspection device , which measures a state of the solder paste applied to the substrate , the apparatus comprising:a processor configured to:obtain first information associated with each of a plurality of pads on the substrate;obtain second information associated with each piece of the solder paste applied to each of the plurality of pads from the solder inspection device;determine a plurality of first regions on the substrate based on the first information, each of the plurality of first regions corresponding to each of the plurality of pads;determine a plurality of second regions on the substrate based on the second information, each of the plurality of second regions corresponding to each piece of the solder paste applied to each of the plurality of pads;determine a plurality of cross regions in which the plurality of first regions and the plurality of second regions overlap each other;determine a cross area ratio of an entire area of the plurality of cross regions to an entire area of the plurality of first regions;determine a position correction value that maximizes the cross area ratio; anddeliver the position correction value to the screen printer,wherein each of ...

MULTILAYER SCREEN PRINTING STENCIL

A method of forming solder paste on an object is provided. The method includes providing a multilayered stencil, each stencil layer having an aperture formed therethrough from a top surface of the respective stencil layer to a bottom surface of the stencil layer. The method also includes applying the stencil to a surface of the object. The method also includes filling a void space formed by a combination of the apertures in the stencil layers with solder paste. The method also includes removing the stencil layers in a sequential manner to leave the solder paste.

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME, TOUCH PANEL SENSOR SHEET AND SCREEN PRINTING PLATE

Disclosed is a method of manufacturing a circuit board, which includes a stand-by process setting a screen printing plate so as to be opposed with a base, where the screen printing plate has a line pattern formed therethrough, and the line pattern is configured by a plurality of dot-like through-holes discretely pierced and arrayed in a single line; a coating process coating an ink which contains a water-dispersed electroconductive paste onto the surface of the screen printing plate; and an ejection process ejecting ink dots through the dot-like through-holes onto the surface of the base, by pressing the screen printing plate into the base under sliding contact of a squeegee with the surface of the screen printing plate, and allowing the ink dots ejected out from the adjacent through-holes to fuse on the surface of the base, to thereby form a linear ink puddle. 1. A method of manufacturing a circuit board , the method comprising:establishing stand-by by setting a screen printing plate so as to be opposed with a base, the screen printing plate having a line pattern formed therethrough, and the line pattern being configured by a plurality of dot-like through-holes discretely pierced and arrayed in a single line or in a plurality of lines;coating an ink which contains a water-dispersed electroconductive paste onto the surface of the screen printing plate;ejecting the ink through the dot-like through-holes onto the surface of the base, by pressing the screen printing plate onto the base under sliding contact of a squeegee with the surface of the screen printing plate, and allowing ink dots ejected out from the adjacent through-holes to fuse on the surface of the base, to thereby form a linear ink puddle; anddrying the linear ink puddle to form an electroconductive pattern on the surface of the base.2. The method of manufacturing a circuit board of claim 1 ,wherein in the step of ejecting the ink, a portion of the ink, elected from the through-hole and creeps forward in ...

SCREEN PRINTER AND COMPONENT MOUNTING LINE

A screen printer includes: a mask having a first area formed with a first pattern and a second area formed with a second pattern; and a print head which forms a past printing on a board and is movable on the mask. When a paste print is formed using the first pattern, the print head moves from a start position located between the first area and the second area to the first area and then returns to the start position. When a paste print is formed using the second pattern, the print head moves from the start position to the second area and then returns to the start position. 1. A screen printer comprising:a mask having a first area formed with a first pattern and a second area formed with a second pattern such that the first area and the second area are arranged in an arrangement direction;a board holding/moving mechanism which is movable in the arrangement direction under the mask, and which comprises a board holding unit which holds a board so as to allow the board to selectively contact one of the first area and the second area by moving the board holding unit; anda print head which forms a past printing on the board through the mask, and which is movable on the mask in the arrangement direction,wherein when a paste print is formed on the board contacting the first area by using the first pattern, the print head moves in the arrangement direction from a start position located between the first area and the second area to the first area and then returns to the start position, andwherein when a paste print is formed on the board contacting the second area by using the second pattern, the print head moves in the arrangement direction from the start position to the second area and then returns to the start position.2. The screen printer according to claim 1 , further comprising:a board carry-in unit which is movable in the arrangement direction, and which transfers a board carried in from an upstream machine to the board holding/moving mechanism; anda board carry-out ...

PRINTED CIRCUIT BOARD

It is an object of the present invention to provide a printed circuit board capable of accurately detecting disconnections of circuit patterns with an automatic circuit pattern inspecting device even when positions of mounting lands are slightly deviated from normal positions due to manufacturing errors. 1. A printed circuit board formed with mounting lands and circuit patterns on a surface thereof ,wherein electric checker lands electrically connected with the mounting lands are formed on a surface of a wiring board.2. The printed circuit board as claimed in claim 1 , wherein the mounting lands are for mounting a chip part of a size standard of less than “1005” thereon.3. The printed circuit board as claimed in claim 1 , wherein the size of the mounting lands is less than 0.5 mm and the size of the electric checker lands is 0.5 mm or more.4. The printed circuit board as claimed in claim 1 , wherein a solder resist film is formed on the surface of the printed wiring board excluding the mounting lands and peripheral portions thereof claim 1 , and the electric checker lands and peripheral portions thereof.5. The printed circuit board as claimed in claim 4 , wherein a resist clearance between the mounting lands and the solder resist film is 0.15 mm or more in design value.6. The printed circuit board as claimed in claim 1 , wherein a ck resist cut between mounting lands and electric checker lands adjacent to each other is 0.15 mm in design value.7. The printed circuit board as claimed in claim 1 , wherein a length of circuit patterns connecting the mounting lands with the electric checker lands is 0.45 mm or more.8. The printed circuit board as claimed in claim 1 , wherein the electric checker lands extend towards outside of the chip part.9. The printed circuit board as claimed in claim 1 , wherein a shape of the electric checker lands is circular or rectangular. The present invention relates to a printed circuit board, and specifically to a printed circuit board onto ...

PRINT SCREEN UNIT

Disclosed herein is a print screen unit. The print screen unit has a structure in which the connection member is positioned to be slanted at a predetermined angle when the print screen is fitted to an interface unit, such that, as tensile force is applied to the print screen, the engagement state of engaging apertures of the print screen and engaging protrusions of the connection member moves toward the coupling direction thereof so as to further increase coupling force therebetween, and the print screen unit has a structure in which, when each of corner pieces is fitted into and connected to each of end portions of the interface unit, a connection surface area increases so as to bring three surfaces of the inside of the interface unit into close contact with a first and a second piece member. 1. A print screen unit , comprising:a print screen, which has a rectangular shape, including a pattern of printing apertures, anda support frame including a first and a second pair of interface units to which the print screen is fitted and attached by a connection member engaged correspondingly with each pair of edges of the print screen, and a first to a fourth corner piece which connect each of the interface units to each other,wherein the print screen and the connection member include engaging apertures provided on the edge of the print screen and engaging protrusions provided on a lower part of the connection member respectively, which have rectangular shapes, at predetermined intervals along longitudinal directions thereof such that the edge of the print screen is fitted into the interface unit by the engaging apertures and the engaging protrusions being correspondingly engaged with each other,wherein the interface unit is provided with a lower side body part including a first connection slot to which each edge of the print screen is horizontally fitted, and provided with an upper side body part including a second connection slot to which the connection member standing ...

Processes For Forming Waveguides Using LTCC Substrates

The present invention describes processes for forming waveguides ( 200 ) using multiple co-planar layers of LTCC substrates ( 212, 212 a, 212 b ). Registration holes ( 222 ) on the substrates help align layering of the substrates. An array of circuit patterns are printed on each substrate, with each circuit being made up of conductor pattern ( 213 ) and/or via holes ( 224 ). Cavity alignment holes ( 226 ) formed around a periphery of each circuit allow alignment marks to be printed on the substrates for vision inspection. Similarly, circuit orientation holes ( 227 ) associated with each circuit allow orientation marks to be printed on the substrates to identify orientation of circuits in each finally formed waveguide. Substrate orientation holes ( 225 ) allow marks to be printed on one side of each substrate for alignment during screen printing. These in-process vision inspections and quality assurance tests allow product quality and process yields to improve.

Screen mask

A screen mask for screen printing includes a mask, and a frame configured to support the mask with a tension; the frame including a fixing frame and a moving frame configured to support the mask and movably mounted on the fixing frame, wherein the tension is controlled by the moving frame.

METHOD FOR APPLYING ELECTRONIC COMPONENTS

A method for applying at least one electronic component to a surface is described. The method includes placing a component stencil on a support. At least one electronic component is arranged in a corresponding opening of the component stencil with a top surface of the electronic component on the support. A contact material stencil is positioned on the component stencil such that at least one opening in the contact material stencil is over a corresponding contact region on the bottom surface of the at least one electronic component. A contact material is applied on the at least one contact region of the at least one electronic component within the corresponding opening of the contact material stencil. The contact material stencil is removed from the component stencil. The component stencil is removed from the support. The at least one electronic component is applied to the surface. 1. A method for applying at least one electronic component to a surface of an object , the method comprising:placing a component stencil on a support;arranging at least one electronic component in a corresponding opening of the component stencil with a top surface of the electronic component on the support;positioning a contact material stencil on the component stencil such that at least one opening in the contact material stencil is over a corresponding contact region on the bottom surface of the at least one electronic component;applying a contact material on the at least one contact region of the at least one electronic component within the corresponding opening of the contact material stencil;removing the contact material stencil from the component stencil;removing the component stencil from the support; andapplying the at least one electronic component to the surface such that the contact material couples the at least one electronic component to the surface of the object.2. The method according to claim 1 , further comprising using an SMT component placement system to apply the at ...

PRINTING DEVICE AND PRINTING METHOD

A solder paste printer for which a pressing force of squeegee towards a stencil when spreading solder paste , that is, a printing pressure, is smaller than a printing pressure when performing solder paste printing. The force with which the solder paste is pressed downwards by the squeegee is weak, and instead of solder paste being pressed down, it spreads along the squeegee. Also, the moving speed of the squeegee when spreading the solder paste is faster than the moving speed of the squeegee when printing solder paste. Thus, because the squeegee is moving fast, before the solder paste is pressed down sufficiently to be printed, the solder paste spreads out along the squeegee. Accordingly, it is possible to appropriately spread the solder paste along the direction in which the squeegee extends. 1. A printing device comprising:a squeegee configured to slide on an upper surface of a stencil in which through-holes are formed;a moving device configured to move the squeegee back and forth along a specified direction; and a spreading section configured to spread a viscous material loaded on the upper surface of the stencil in a direction in which the squeegee extends by sliding the squeegee, and', 'a printing section configured to squeeze the viscous material that was spread by the spreading section into the through-holes of the stencil by sliding the squeegee such that the viscous material is printed onto a board that is closely contacting a lower surface of the stencil,, 'a control device configured to control operation of the moving device, the control device including'}whereina pressing force of the squeegee towards the stencil when the squeegee is slid by the spreading section is smaller than a pressing force of the squeegee towards the stencil when the squeegee is slid by the printing section.2. A printing device according to claim 1 , whereinthe pressing force of the squeegee towards the stencil when the squeegee is slid by the spreading section is larger at a ...

Electrical devices with electrodes on softening polymers and methods of manufacturing thereof

Flexible electrical devices comprising electrode layers on softening polymers and methods of manufacturing such devices, including lift-off processes for forming electrodes on softening polymers, processes for forming devices with a patterned double softening polymer layer, and solder reflow processes for forming electrical contacts on softening polymers.

STENCIL STEP DESIGN METHOD AND SYSTEM, COMPUTER READABLE STORAGE MEDIUM, AND DEVICE

A stencil step design method and system, a computer readable storage medium and a device. The method comprises: acquiring data of stencil apertures for electronic components in a circuit board, and identifying the stencil apertures for electronic components one by one to determine whether the stencil apertures need to be stepped; and if yes, performing step design for the stencil apertures that need to be stepped according to preset step rules corresponding to the stencil apertures for electronic components one by one so as to generate a stencil step design file with the step design, and outputting the stencil step design file. According to the present disclosure, 90% or more steps can be automatically designed and the stencil step design is in conformity with processing requirements. A manual intervention process is omitted, and the design can be accomplished by several simple steps. 1. A stencil step design method , comprising:acquiring data of stencil apertures for electronic components in a circuit board, and identifying the stencil apertures for electronic components one by one to determine whether the stencil apertures need to be stepped; andif yes, performing step design for the stencil apertures that need to be stepped according to preset step rules corresponding to the stencil apertures for electronic components one by one so as to generate a stencil step design file with the step design, and outputting the stencil step design file; and if not, ending the stepped stencil design and outputting an aperture design file.2. The stencil step design method according to claim 1 , wherein before acquiring data of stencil apertures for electronic components in a circuit board claim 1 , the stencil step design method further comprises:reading a CAD file of the circuit board, converting and saving the CAD file of the circuit board as CAD graphic data, and loading package information and associated aperture attribute information in the CAD file to a corresponding CAD ...

Dual Conductor Laminated Substrate

A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first conductive layer; defining a first trace pattern including one or more traces in the first laminate; providing a second laminate including a second insulating layer and a second conductive layer; defining a second trace pattern including one or more traces in the second laminate; defining access holes in the second insulating layer; at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and aligning and attaching the first laminate to the second laminate to create a laminated substrate.

SUPPLY UNIT, PRINTING DEVICE, AND METHOD FOR CONTROLLING PRINTING DEVICE

The supply unit is used in a printing device to perform a print process of a viscous fluid on a printing target to supply the viscous fluid. The supply unit includes an attachment section to and from which a cartridge accommodating the viscous fluid is attachable or detachable, a restricting wall section configured to cover the cartridge and restrict access to an inside of the printing device, and a driving section configured to move the cartridge attached to the attachment section and the restricting wall section in a supply operation direction. 1. A supply unit used in a printing device for performing a print process of a viscous fluid on a printing target to supply the viscous fluid , the supply unit comprising:an attachment section to and from which a cartridge accommodating the viscous fluid is attachable or detachable;a restricting wall section configured to cover the cartridge and restrict access to an inside of the printing device; anda driving section configured to move the cartridge attached to the attachment section and the restricting wall section in a supply operation direction.2. The supply unit according to claim 1 ,wherein the attachment section is located below the driving section, andthe restricting wall section is formed on a side surface and a lower surface of the cartridge.3. The supply unit according to claim 1 ,wherein the printing device has an opening portion through which the cartridge passes at a standby position where the supply unit is placed in standby; andthe restricting wall section is formed along an opening edge of the opening portion to restrict the access to the inside of the printing device.4. A printing device for performing a print process of a viscous fluid on a printing target claim 1 , the printing device comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the supply unit according to ;'}a moving section configured to move the supply unit between a standby area in which the supply unit is placed in standby and a ...

ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHODS OF MANUFACTURING THEREOF

Flexible electrical devices comprising electrode layers on softening polymers and methods of manufacturing such devices, including lift-off processes for forming electrodes on softening polymers, processes for forming devices with a patterned double softening polymer layer, and solder reflow processes for forming electrical contacts on softening polymers. 1. A method of manufacturing an electrical device , comprising:forming a patterned inorganic liftoff layer to expose a target electrode site on a softening polymer layer;depositing an electrode layer on the inorganic liftoff layer and on the exposed target electrode site; andremoving the inorganic liftoff layer by a horizontal liftoff etch to leave the electrode layer on the exposed target electrode site.2. The method of claim 1 , wherein the inorganic liftoff layer has a thin film stress of less than about 150 MPa.3. The method of claim 1 , wherein forming the patterned inorganic liftoff layer includes removing portions of the inorganic liftoff layer exposed through openings in a patterned photoresist layer on the inorganic liftoff layer by a fluorine plasma dry etch process.4. The method of claim 1 , wherein removing the inorganic liftoff layer by the horizontal liftoff etch includes etchant solvent exposure of the: inorganic liftoff layer claim 1 , a photoresist layer on the inorganic liftoff layer and portions of the electrode layer on the photoresist layer claim 1 , wherein:the etchant solvent exposure is for at least about 20 hours at about 25° C., andthe etchant solvent includes an ester-based photoresist removing solvent or a potassium borate photo developing solution.5. An electrical device claim 1 , comprising:a softening polymer layer; and{'sup': '2', 'an electrode layer on the softening polymer layer, wherein at least a portion of the electrode layer has less than about 100 ppm Carbon/micronof organic material thereon.'}6. The device of claim 5 , wherein the portion of the electrode layer has a root ...

WIRELESS SENSOR PLATFORM

A wireless sensor platform and methods of manufacture are provided. The platform involves providing a plurality of wireless sensors, where each of the sensors is fabricated on flexible substrates using printing techniques and low temperature curing. Each of the sensors can include planar sensor elements and planar antennas defined using the printing and curing. Further, each of the sensors can include a communications system configured to encode the data from the sensors into a spread spectrum code sequence that is transmitted to a central computer(s) for use in monitoring an area associated with the sensors. 1. A sensor device , comprising:a flexible substrate having at least one surface that is electrically insulating; anda plurality of components disposed on the at least one surface, the plurality of components comprising a communications system, at least one sensor device communicatively coupled to the communications system, and at least one antenna electrically coupled to the communications system,wherein each of the at least one sensor and the at least one antenna is a planar device, and wherein the communications system is configured for receiving sensor signals from the at least one sensor, encoding the sensor signals into a bit sequence via code shift keying using a spread spectrum coding, and transmitting the bit sequence.2. The sensor device of claim 1 , wherein the communications system is configured for performing the encoding by:combining at least a portion of the sensor signals into an n-bit word, andgenerating the bit sequence using a linear feedback shift register (LFSR) using the n-bit word as a seed,wherein a feedback arrangement for the LFSR is selected to provide a Gold code.3. The sensor device of claim 1 , wherein the communications system is configured for performing the encoding by:combining at least a portion of the sensor signals into a plurality of n-bit words, andgenerating the bit sequence via an exclusive-ORing of the output of a ...

METHOD FOR STENCIL PRINTING DURING MANUFACTURE OF PRINTED CIRCUIT BOARD

A method for stencil printing during manufacture of a printed circuit board includes forming a circuit diagram on a trepanned circuit board using a first stencil that has the circuit diagram, a scraper and conductive inks, forming a solder mask layer on the circuit board using a second stencil, the scraper, and solder materials, forming words and marks on the circuit board using a third stencil, the scraper, and inks, and forming a solder paste layer on the circuit board using a fourth stencil, the scraper, and solder paste. 1. A method for stencil printing during manufacture of a printed circuit board , the method comprising:forming a circuit diagram on a trepanned circuit board using a first stencil that has the circuit diagram, the scraper, and conductive inks;forming a solder mask layer on the circuit board using a second stencil, the scraper, and solder materials;forming words and marks on the circuit board using a third stencil, the scraper, and inks; andforming a solder paste layer on the circuit board using a fourth stencil, the scraper, and solder paste.2. The method according to claim 1 , further comprising:testing the printed circuit board.3. The method according to claim 2 , wherein the printed circuit board is tested by electrical testing and visual inspection.4. The method according to claim 1 , further comprising:compressing inner layer circuit boards and outer layer circuit boards of a multilayer circuit board;trepanning holes on the multilayer circuit board; andforming a conductor layer on each via hole of the multilayer circuit board using a fifth stencil, the scraper, and conductive paste.5. The method according to claim 4 , wherein the conductive paste are silver paste claim 4 , copper paste claim 4 , or carbon paste.6. The method according to claim 4 , further comprising:testing the inner layer circuit board; andtesting the outer layer circuit board.7. The method according to claim 4 , further comprising:forming a metal layer on an edge ...

METHOD FOR SILKSCREEN PRINTING DURING MANUFACTURE OF PRINTED CIRCUIT BOARD

A method for silkscreen printing during manufacture of a printed circuit board includes forming a circuit pattern on a trepanned circuit board using a first silkscreen plate that has the circuit pattern, the scraper, and conductive inks, forming a solder mask layer on the circuit board using a second silkscreen plate, the scraper, and a solder material, forming words and marks on the circuit board using a third silkscreen plate, the scraper, and inks, and forming a solder paste layer on the circuit board using a fourth silkscreen plate, the scraper, and solder paste. 1. A method for silkscreen printing during manufacture of a printed circuit board , the method comprising:forming a circuit pattern on a trepanned circuit board using a first silkscreen plate that has the circuit pattern, the scraper, and a conductive ink, wherein the circuit pattern on the first silkscreen plate is aligned to an area where a circuit pattern is to be formed on the printed circuit board, the conductive ink is put on one end of the first silkscreen plate, the scraper moves the conductive ink around repeatedly between the end having the conductive ink and the other end to distribute the conductive ink uniformly on the circuit pattern area of the circuit board;forming a solder mask layer on the circuit board using a second silkscreen plate, the scraper, and a solder material;forming words and marks on the circuit board using a third silkscreen plate, the scraper, and an ink; andforming a solder paste layer on the circuit board using a fourth silkscreen plate, the scraper, and solder paste.2. The method according to claim 1 , further comprising:testing the printed circuit board.3. The method according to claim 2 , wherein the printed circuit board is tested by electrical testing and visual inspection.4. The method according to claim 1 , wherein claim 1 , the printed circuit board is a multilayer circuit board comprising a plurality of inner layer circuit boards and an outer layer circuit ...

Automatic solder paste addition apparatus for solder paste printer

The present application provides an automatic solder paste addition apparatus and system for a solder paste printer, the apparatus comprising: a push rod, a pressure plate, a support plate, a movable plate and a working platform; the pressure plate moves up and down as the push rod moves up and down, the support plate is fixed in relation to movement of the push rod, an outer side of the movable plate is disposed on the support plate so as to be capable of sliding up and down, the pressure plate is disposed on an inner side of the movable plate so as to be capable of sliding up and down, and the working platform is fixed to the movable plate and used for bearing a solder paste tub, wherein a lower one-way locking mechanism is provided between the movable plate and the support plate, the lower one-way locking mechanism being configured to lock the movable plate when the movable plate is in the working position, so that the movable plate cannot move downward; and wherein an upper locking mechanism is provided between the movable plate and the pressure plate, the upper locking mechanism being configured so that the pressure plate can move relative to the movable plate when the movable plate is not moving, and can also move together with the movable plate when the movable plate is moving.

Method for forming multilayered circuit pattern on surface of three-dimensional metal board

A method for forming a multilayered circuit pattern on a surface of a 3D metal board includes: forming a first insulation layer on the surface of the 3D metal board; forming a first conductive pattern on the first insulation layer; forming a second insulation layer on the first conductive pattern except for a predetermined region; forming a second conductive pattern on the second insulation layer; and forming a third insulation layer on the second conductive pattern except for one or more circuit element mounting regions.

Printing device

In a printing device, a second storage position is displaced from a first storage position so as to enable a moving member to move a second mask arranged in a second storage in a state in which a first mask is arranged in the first storage position by movement of the first mask from an operation position to the first storage position by the moving member.

Electrically conducting assemblies

The present invention pertains to a process for the manufacture of a multilayer assembly comprising applying at least one patterned substrate onto at least one surface of at least one non-patterned substrate. The present invention also pertains to the multilayer assembly obtainable by said process and to uses of said multilayer assembly in various applications.

SCREEN PRINTER

A screen printer comprising: a conveyance device configured to convey a board; a board holding device configured to position a conveyed board at a printing position; a stencil holding device configured to attach a stencil above the held board; a squeegee device configured to fill pattern holes of the stencil with solder paste; a board raising and lowering device configured to raise and lower the board positioned by the board holding device; and a control device configured to perform drive control of each the above devices, the control device including a standby printing processing section configured to raise the board from below with respect to the stencil such that the board contacts the stencil, stand by in a state with solder paste filled in the pattern holes, and lower the board to separate the board from the stencil in accordance with a board conveyance signal. 13.-. (canceled)4. A screen printer comprising:a conveyance device configured to convey a board;a board holding device configured to position a conveyed board at a printing position;a stencil holding device configured to attach a stencil above the held board;a squeegee device configured to fill pattern holes of the stencil with solder paste;a board raising and lowering device configured to raise and lower the board positioned by the board holding device; anda control device configured to perform drive control of each the above devices, the control device including a standby printing processing section configured to raise the board from below with respect to the stencil such that the board contacts the stencil, stand by in a state with solder paste filled in the pattern holes, and lower the board to separate the board from the stencil in accordance with a board conveyance signal.5. The screen printer according to claim 4 , whereinthe control device is configured to lower the board to separate the board from the stencil in accordance with the board conveyance signal that is issued from another machine or ...

PRINTING SCREENS, FRAMES THEREFOR AND PRINTING SCREEN UNITS

A printing screen, comprising a sheet, at least sections of at least one pair of opposite edges of which are folded such as to define attachment elements, and a printing screen unit including at least one pair of interface members attachable to the attachment elements at the at least one pair of opposite edges of the sheet. 1. A printing screen unit , comprising:a printing screen, comprising a sheet having opposite sides; anda rectangular frame comprising interface members attached to the respective sides of the sheet;wherein the interface members can shift relative to one another, whereby the frame can be tensioned by an external tensioning mechanism to tension the sheet.2. The printing screen unit of claim 1 , wherein the interface members are bonded to the printing screen.3. The printing screen unit of claim 1 , wherein the interface members each comprise a plurality of interface elements spaced along a length of a respective edge of the sheet.4. The printing screen unit of claim 1 , wherein the interface members each comprise first and second strips attached to opposite sides of the respective edge of the sheet.5. The printing screen unit of claim 1 , wherein the interface members each comprise first and second strips attached to opposite sides of the respective edge of the sheet claim 1 , and include a plurality of engagement apertures for engagement to a tensioning mechanism spaced along a length thereof.6. A printing screen unit claim 1 , comprising:a printing screen, comprising a flat stainless steel sheet having two pairs of opposite edges; anda frame comprising first and second pairs of interface members adhesively bonded along substantially the entire length thereof to the respective pairs of opposite edges of the sheet and coupled together at corners of the frame,wherein the frame holds the printing screen in an untensioned state when no tension is applied thereto by external tensioning mechanisms separate to the frame,the frame having no element or ...

VIRTUAL SILK SCREEN FOR PRINTED CIRCUIT BOARDS

Methods and devices that identify a silkscreen data file associated with a physical printed circuit board and use an image of the physical printed circuit board to display a virtual silkscreen over the image of the physical printed circuit board. 1. A device comprising:a memory that stores a silkscreen data file, the silkscreen data file comprising data for a silkscreen comprising a printable legend of identifiers of components associated with a physical printed circuit board;a display showing an image of the physical printed circuit board, wherein the printable legend is not legibly printed on the physical printed circuit board; anda processor communicatively coupled to the memory and to the display, the processor configured to use the silkscreen data file to overlay a visual depiction of the printable legend of identifiers of components over the image of the physical printed circuit board on the display, wherein an overlaid identifier visually identifies a corresponding component depicted in the image of the physical circuit board.2. The device of wherein the image of the physical printed circuit board includes images of the components associated with the physical printed circuit board.3. The device of wherein the device displays prompts instructing a user to select one or more alignment reference points claim 1 , and receives input from the user to align the visual depiction of the silkscreen with the image of the physical printed circuit board.4. The device of wherein the image of the silkscreen superimposed on the physical printed circuit board is navigable by a user.5. The device of wherein the image of the silkscreen superimposed on the physical printed circuit board is searchable by a user to identify specific components.6. The device of comprising a portable phone executing an application.7. The device of wherein the image of the printed circuit board is displayed in real time from an image sensor of the portable phone.8. A method implemented on an ...

SCREEN PRINTING MACHINE

A screen printing machine for appropriately contact between a mask and a board, comprising: a mask-holding device configured to hold a mask; a board-positioning device configured to hold a board and to position the held board with respect to a mask held by the mask-holding device from below; a squeegee device configured to spread a cream solder with respect to the mask; a height-measuring device configured to measure the height of the mask and the board; a control device configured to control each device, and to calculate the thickness of a mask lower layer, integrally formed with the mask, based on the measurement values obtained from the height-measuring device; and an operation display device configured to input operation and to display calculation values from the control device, and the like. 1. A screen printing machine , comprising:a mask-holding device configured to hold a mask;a board-positioning device configured to hold a board and to position the held board with respect to a mask held by the mask-holding device from below;a squeegee device configured to spread a cream solder with respect to the mask;a height-measuring device configured to measure the height of the mask and the board;a control device configured to control each device, and to calculate the thickness of a mask lower layer, integrally formed with the mask, based on the measurement values obtained from the height-measuring device; andan operation display device configured to input operation and to display calculation values from the control device.2. The screen printing machine of claim 1 ,wherein the height-measuring device measures a mask upper face height of a mask held by the mask-holding device and a board upper face height of the board moved to a measurement height position by being driven by the board positioning device, andthe control device calculates the thickness of the mask lower layer based on values of the mask upper face height, the board upper face height, the mask thickness, ...

Additive manufacturing techniques for meander-line polarizers

Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for producing meander-line polarizers. In some implementations, a meander-line polarizer includes a dielectric substrate made of a polyester polymer material and meander-line arrays formed on a surface of the dielectric substrate. Each meander-line array includes a sequence of alternating perpendicular conductive traces that are formed the surface of the dielectric substrate by applying conductive ink to the surface of the dielectric substrate using a template that defines a location and dimensions of each conductive trace of each meander-line array.

Stencil Frames

Stencil frames for tensioning stencils of an angular shape are provided. The stencil frame comprises corner elements ( 2 ), edge elements ( 1 ), fastening elements ( 13 ) and tensioning devices with a tensioning device being associated with each edge element ( 1 ). The corner elements ( 2 ) each have two, mutually perpendicular, guiding profiles ( 12 ) which joined at an intersection of their axes and the edge elements ( 1 ) each have a uniaxial reception profile ( 11 ). Each reception profile ( 11 ) is connectable to two guiding profiles ( 12 ) by loose fit. Each tensioning device has at least one elastic element ( 5 ) and connects between two neighbouring corner elements ( 2 ). A line of force exerted by each tensioning device is parallel to the axis of its corresponding reception profile ( 11 ).

SCREEN EXTENDING FRAME

A screen extending frame including cut grooves formed from an inner side to an outer side thereof, or from the outer side to the inner side, or in both directions of joints of the screen extending frame, which is constituted by connecting four frame members in a rectangle shape. The cut grooves enable the joints to deform. The four frame members are individual bodies that are joined by comer members, and connecting portions are inclined with respect to the longitudinal direction of the frame members. Gaps are created in the connections. Elastic elements can be placed at the connections of the four frame members. Alternatively, the joint portions are orthogonal to the longitudinal direction, and elastic elements are placed at the joints. 1. A screen extending frame having a rectangular shape , said screen extending frame comprising:four frame members connected so as to define a rectangular shape, each of said four frame members having a square cross sectional shape,and said four screen frame members are connected at a plurality of joints,and one face of each of said four frame members is attachable to a screen by using an adhesive agent,and an opposite face of each of said four frame members is adapted to a screen extending jig configured to extend and retract,wherein adjacent frame members are joined at corners of the screen extending frame, and the corners of the screen extending frame are configured to have flexibility and elasticity.2. The screen extending frame according to claim 1 ,wherein end faces of connecting portions to which said four frame members are adjacent are faces inclined in the longitudinal direction of said four frame members, and are not of the same plane angle with each other.3. The screen extending frame according to claim 1 ,wherein end faces of connecting portions to which said four frame members are adjacent are faces inclined in the longitudinal direction of said four frame members, and elastic elements are provided between respective ...

Printing electrically conductive ink on fabric

One disclosed example comprises an ink formulated for printing an electrically conductive trace on a flexible fabric substrate. The ink includes an elastomer and a liquid vehicle capable of swelling the elastomer, the liquid vehicle having a boiling point of 150° C. or greater at one atmosphere. A plurality of non-spherical, electrically conductive particles are suspended in the liquid vehicle to impart electrical conductivity to the ink.

METHOD FOR NANOMODULATING METAL FILMS BY MEANS OF HIGH-VACUUM CATHODE SPUTTERING OF METALS AND STENCILS

The present invention relates to a method for nanomodulating metal films by means of high-vacuum cathode sputtering of metals, and to stencils of anodized Al. As an example of the use of these nanomodulated metal films, the synthesis or production of a magnetically weak film by means of cathode sputtering, which film can he used as a magnetic field sensor, and a metal nanomodulated stencil are analyzed. 1. Method for nanomodulation of metal surfaces , comprising the following steps:a) to obtain a template recorded with aluminum nanovalleys, anodizing a high-purity aluminum film consisting of a natural oxide layer very thin of aluminum on its surface, growing said layer by using an electrochemical solution to partially dissolve the oxide aluminum and form a porous layer is supported on the aluminum, which is removed by selective chemical attack with an acidic solution, to thereby obtaining aluminum with semicircular holes arranged hexagonally, and then obtaining an aluminum substrate metal which is recorded with semicircular nanovalleys hexagonally ordered;{'sub': 2', '4', '2', '2', '4', '3', '4', '3', '4', '2, 'b': '9', 'wherein said electrolytic solution is selected from sulfuric acid (HSO), oxalic acid (HCO) or phosphoric acid (HPO), and said acid solution is a mixture of chromic acid (CrOs), phosphoric acid (HPO and H0;'}b) nanomodulating a metal film using aluminum substrate recorded with nanovalleys obtained in step a), by evaporating onto said substrate a metal selected from the group consisting of Au, Cu or Ag to generate a metal film then take off, and where evaporation of metal is deposited, it is performed by sputtering in a high vacuum, and the metal evaporated adopts the structure of aluminum nanovalleys, and where to ensure low adhesion of metal deposited on the nanostructured aluminum is used a deposition rate very high, between 59 and 127 nm/min and also a distance of approximately 5 cm between the barrel and the substrate is used;c) removing the foil ...

DOUBLE-SIDED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

A double-sided printed circuit board and method for manufacturing requires a ceramic substrate, two circuit layers, and conductive paste. The ceramic substrate includes two opposite surfaces, and at least one through hole passing through the two opposite surfaces. The two circuit layers can be plated on the two opposite surfaces. The conductive paste is infilled into the full extent of the through hole and thermo-cured, the ingress of electroplating materials into the hole is thus prevented. The method has low process requirement and high reliability in use. 1. A double-sided printed circuit board , comprising:a ceramic substrate including two opposite surfaces, and at least one through hole passing through the two opposite surfaces;two circuit layers plated on the two opposite surfaces; anda conductive thick-film paste filled and fired in the at least one through hole to electrically connect the two circuit layers.2. The double-sided printed circuit board of claim 1 , wherein the circuit layer comprises a first metallic layer sputtered on each of the two opposite surfaces claim 1 , and a second metallic layer electroplated on the first metallic layer.3. The double-sided printed circuit board of claim 1 , wherein the conductive thick-film paste is conductive ink.4. The double-sided printed circuit board of any one of claim 1 , wherein two protective films are formed on the corresponding circuit layers.5. The double-sided printed circuit board of claim 4 , wherein the protective film is made of Ni claim 4 , or Au claim 4 , or an alloy of Ni and Au.6. (canceled)7. (canceled)8. (canceled)9. (canceled) The disclosure generally relates to printed circuit boards, and particularly to double-sided printed circuit board and methods for manufacturing such double-sided printed circuit board.Miniaturization is a constant goal, thereby leading to the application of double-sided printed circuit boards to achieve higher density and performance.A typical method for manufacturing ...

Additive manufacturing techniques for meander-line polarizers

Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for producing meander-line polarizers. In some implementations, a meander-line polarizer includes a dielectric substrate made of a polyester polymer material and meander-line arrays formed on a surface of the dielectric substrate. Each meander-line array includes a sequence of alternating perpendicular conductive traces that are formed the surface of the dielectric substrate by applying conductive ink to the surface of the dielectric substrate using a template that defines a location and dimensions of each conductive trace of each meander-line array.

PREPARATION METHOD FOR ELECTRONIC COMPONENTS WITH AN ALLOY ELECTRODE LAYER

A preparation method for an electronic component with an alloy electrode layer includes steps of printing a metal layer on each of the two opposite surfaces of a ceramic substrate with the metal layer made from aluminum, spraying an alloy layer being a copper alloy layer on an outer surface of each metal layer, connecting a pin to each alloy layer, and enclosing the ceramic substrate, the metal layers, the alloy layers and a portion of each pin with an insulating layer. With the adoption of copper alloy for the alloy layer, the preparation method has the advantages of low production cost and high reliability of the electronic component produced by the method. 1. A preparation method for an electronic component with an alloy electrode layer , comprising steps of:preparing a ceramic substrate having two opposite surfaces;printing a metal layer on each of the two opposite surfaces of the ceramic substrate, wherein the material of the metal layer is aluminum;spraying an alloy layer on an outer surface of each metal layer, wherein the alloy layer is a copper alloy layer, and each metal layer and a corresponding alloy layer stacked on the metal layer form an electrode layer;connecting a pin to each alloy layer; andenclosing the ceramic substrate, the electrode layers and a portion of each pin with an insulating layer.2. The preparation method as claimed in claim 1 , wherein the step of printing the metal layer further has steps of:coating aluminum slurry on the two opposite surfaces of the ceramic substrate through silk-screen printing, wherein the aluminum slurry includes aluminum powder, glass powder and a binder, and a weight percent of the aluminum powder in the aluminum slurry is in a range of 65 to 75%, a weight percent of the glass powder in the aluminum slurry is in a range of 10% to 15%, and a weight percent of the binder is in a range 10% to 25%;baking to dry out the aluminum slurry; andsintering the baked aluminum slurry to form the metal layer.3. The ...

METHOD OF MANUFACTURING A HYBRID METAL PATTERN BY USING WIRE EXPLOSION AND LIGHT-SINTERING, AND A HYBRID METAL PATTERN MANUFACTURED THEREBY

The inventive concepts relate to a method of manufacturing a hybrid metal pattern and a hybrid metal pattern manufactured thereby. In the method, the hybrid metal pattern may be manufactured on a substrate (e.g., a flexible substrate), formed of various materials, at room temperature without damaging the substrate, by a wire explosion method in liquid and light-sintering. In more detail, when performing the wire explosion method in liquid according to conditions of the inventive concepts, metal particles having uniform nano-sizes and uniform micro-sizes can be formed by a simple process, and additional dispersing and collecting processes can be omitted. In addition, conductive hybrid ink is formed by adding a metal precursor and then is light-sintered. In this case, the hybrid metal pattern can be manufactured by a very simple process. 1. A method of manufacturing a hybrid metal pattern , the method comprising:adjusting a gap between an anode and a cathode provided in a wire explosion apparatus;providing a metal wire between the anode and the cathode;supplying a dispersant and a solvent into the wire explosion apparatus;forming metal particles from the metal wire by wire explosion performed by applying a voltage between the anode and the cathode;separating conductive hybrid ink including the metal particles, the dispersant, and the solvent from the wire explosion apparatus;printing the separated conductive hybrid ink on a substrate to form a hybrid metal pattern; andlight-sintering the hybrid metal pattern.2. The method of claim 1 , wherein the adjusted gap between the anode and the cathode ranges from 10 mm to 20 mm.3. The method of claim 1 , wherein the metal wire has a length of 10 mm to 20 mm and a diameter of 0.1 mm to 0.5 mm.4. The method of claim 1 , wherein the metal wire includes one selected from a group comprising gold claim 1 , silver claim 1 , copper claim 1 , nickel claim 1 , zinc claim 1 , and any compound thereof claim 1 , andwherein the solvent ...

PRINTING DEVICE AND PRINTING METHOD FOR APPLYING A VISCOUS OR PASTY MATERIAL

The invention relates to a printing device for applying a viscous or pasty material onto a support substrate and molding a defined material geometry by means of a template. The template which is provided for application and molding purposes has at least one continuous opening, and the opening side facing the support substrate functions as an application opening surface. Furthermore, the opening, in particular the inner wall thereof, forms an outer border for the material geometry outer surface to be molded. As a whole, the template is designed such that an adhesive force of the viscous or pasty material acting on the inner wall of the opening is overcome by means of a relative movement, in particular a movement relative to the support substrate. The template is advantageously formed as a stack composite of at least two sub-templates adjoining each other in a connection region. Each of the sub-templates has at least one sub-opening, by means of which the inner wall of the opening is divided into proportional molding surfaces of the sub-template. Furthermore, sub-opening connection surfaces which correspond to one another are formed in the connection region, and each of the sub-templates can be reversibly separated in the connection region. 110040204555501205546454055c. A printing device () for applying a viscous or pasty material () onto a carrier substrate () and shaping a defined material geometry () by means of a stencil , wherein the stencil has at least one continuous opening () with an application opening surface (.) facing the carrier substrate () and the inner wall of the opening () forms an outer boundary for an outer surface () of the material geometry () to be shaped , wherein the stencil is configured to overcome an adhesive force of the viscous or pasty material () acting on the inner wall of the opening () by means of a relative movement ,characterized in that{'b': 50', '50', '1', '50', '2', '50', '30', '50', '1', '50', '2', '50', '55', '1', '55', '2', ...

STENCIL SET AND SYSTEM FOR PRINTING SOLDER PASTE FOR PRINTED CIRCUIT BOARDS

A method of printing solder paste in a component board and a stencil set for doing the same are disclosed. In one embodiment, the method includes using a first stencil having a first thickness to print solder paste into at least one through hole in the component board. The method further includes using a second stencil having a second thickness to print solder paste for at least one surface mounted part on the component board, subsequent to using the first stencil. 1. A stencil set for printing solder paste in a printed circuit board (PCB) comprising:a first stencil defining a through hole aperture and having a first thickness and a bottom surface, said first stencil configured to print solder paste into at least one through hole in the PCB;a second stencil defining a surface mount aperture and having a second thickness, said second stencil configured to print solder paste for at least one surface mounted part in the PCB;wherein said bottom surface of said first stencil is free of surface mounted part pockets, and the second thickness is equal to or less than the first thickness.2. A stencil set in accordance with claim 1 , wherein each of the first and second thickness is less than 6 mils.3. A stencil set in accordance with claim 1 , wherein the second thickness is less than the first thickness.4. A stencil set in accordance with claim 3 , wherein the first thickness is between about 2 mils and about 8 mils claim 3 , and the second thickness is between about 2 mils and about 5 mils.5. A stencil set in accordance with claim 1 , wherein said second stencil defines at least one second aperture having a diameter greater than a diameter of the at least one through hole in the PCB claim 1 , wherein the at least one second aperture is concentric with the at least one through hole in the PCB when said second stencil is used to print solder paste for the at least one surface mounted part.6. A stencil set in accordance with claim 5 , wherein the diameter of the least one ...

BALL GRID ARRAY SOLDER ATTACHMENT

Reflow Grid Array (RGA) technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a ball grid array (BGA) package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is application of solder to the RGA interposer. Technical solutions described herein provide processes and equipment for application of solder and formation of solder balls to connect an RGA interposer to a BGA package. 1. An apparatus comprising:an interposer;a plurality of electrical component interposer contacts on a first surface of the interposer; anda heater trace within the interposer proximate to one or more of the plurality of electrical component interposer contacts.2. The apparatus of claim 1 , further including a plurality of conductive through-holes within the interposer and proximate to the heater trace claim 1 , each of the conductive through-holes electrically connected to each of the plurality of electrical component interposer contacts.3. The apparatus of claim 1 , further including a plurality of motherboard interposer contacts on a second surface of the interposer claim 1 , the second surface of the interposer opposite from the first surface of the interposer claim 1 , each of the conductive through-holes electrically connecting each of the plurality of electrical component interposer contacts and each of the plurality of motherboard interposer contacts.4. The apparatus of claim 1 , further including a thermal sensor trace within the interposer to generate temperature sensor data.5. The apparatus of claim 4 , further including a controller to receive temperature sensor data from the thermal sensor trace and control a heater current applied to the heater trace.6. The apparatus of claim 1 , further including:a second plurality of electrical component interposer contacts within a second zone on the first ...

Backup block and screen-printing machine

A screen-printing machine includes a mask holding device; a board holding device configured to grip a board; a positioning device to relatively position the board and the mask; and a control device. The board holding device includes a lifting and lowering table positioned in an up-down direction by a lifting and lowering mechanism, and a backup block including a mounting surface on which the board is placed, an installation surface disposed parallel to the mounting surface on an opposite side thereof, multiple suction holes to penetrate in a thickness direction between the mounting surface and the installation surface, and a chamber recessed section formed on an installation surface side so as to surround positions of the multiple suction holes, and in which an air chamber made by the chamber recessed section is configured when the backup block overlaps an upper face of the lifting and lowering table.

APPARATUS FOR PERFORMING COMPENSATION ASSOCIATED WITH SCREEN PRINTER AND METHOD THEREOF

An apparatus that communicates with a screen printer and a solder inspection device is disclosed. The apparatus according to the present disclosure may include a process that is configured to: obtain first information associated with each of a plurality of pads on the substrate; obtain second information associated with each piece of the solder paste applied to each of the plurality of pads from the solder inspection device; determine a position correction value for the stencil mask with respect to the substrate based on the first information and the second information; and deliver the position correction value to the screen printer. 1. An apparatus that communicates with a screen printer , which applies solder paste to a substrate on which a stencil mask is disposed , and communicates with a solder inspection device , which measures a state of the solder paste applied to the substrate , the apparatus comprising ,a processor configured to:obtain first information associated with each of a plurality of pads on the substrate;obtain second information associated with each piece of the solder paste applied to each of the plurality of pads from the solder inspection device;determine a position correction value for the stencil mask with respect to the substrate based on the first information and the second information; anddeliver the position correction value to the screen printer.2. The apparatus of claim 1 , wherein the processor is further configured to:determine a plurality of first regions on the substrate based on the first information, each of the plurality of first regions corresponding to each of the plurality of pads;determine a plurality of second regions on the substrate based on the second information, each of the plurality of second regions corresponding to each piece of the solder paste applied to each of the plurality of pads;determine a plurality of cross regions in which the plurality of first regions and the plurality of second regions overlap each ...

TEMPLATE THAT IMPROVES SOLDER-PASTE STENCILLING AND PRODUCTION METHOD THEREOF

The invention relates to a template or stencil with perforations, which improves solder-paste stencilling on an object and comprises: a first area treated with precision powder on a bottom laminar face of the template, said treated face covering at least an area where perforations are distributed; a second area treated with precision powder on a top laminar surface of the template, said second treated area encircling the perforations; and a third area treated twice with precision powder on the bottom laminar surface, said third area encircling the perforations of the template. The invention also relates to a method for producing a template that improves solder-paste stencilling on an object, and to a method for the improved application of solder-paste on an object, such as a printed circuit board. 1234. A template which improves the solder-paste stencilling in an object , which has an top laminar face () , a bottom laminar face () , and perforations (); this template features comprising:{'b': 5', '3', '5', '4, 'i) a first treated area () with a precision powder treatment, on its bottom laminar face (); where the said treated area () covers at least the area where the perforations are distributed ();'}{'b': 6', '2', '6', '4, 'ii) a second treated area () with a precision powder treatment, on its top laminar face (), where the said treated area () surrounds only the perforations (); and'}{'b': 8', '3', '8', '4', '1, 'iii) a third treated area () with two treatments with a precision powder, on its bottom laminar face (), where the said treated area () surrounds only the perforations () of the sheet template ().'}2. The template of the preceding claim , wherein the precision powder is aluminium oxide.3. The template of the preceding claim , wherein the aluminium oxide has particles of about 10 microns.4684. The template according to claim 1 , wherein the second () and third () treated areas have a surface area of 25.4μaround each perforation ().5. The template according ...

VIRTUAL SILK SCREEN FOR PRINTED CIRCUIT BOARDS

Methods and devices that identify a silkscreen data file associated with a physical printed circuit board and use an image of the physical printed circuit board to display a virtual silkscreen over the image of the physical printed circuit board. 117-. (canceled)18. A device , comprising:a sensor device configured to capture data from a physical printed circuit board (PCB);a processor; and identify the physical PCB from the captured PCB data;', 'obtain a silkscreen data file associated with the identified PCB;', 'browse the PCB data to identify one or more reference points on the physical PCB;', 'receive a user selection of at least one of the one or more reference points; and', 'overlay a virtual silkscreen over an image of the physical PCB based on the silkscreen data file and the user selected reference points; and, 'memory storing at least an executable program, which causes the processor toa display configured to display the image of the physical PCB with the overlaid virtual silkscreen.19. The device of claim 18 , wherein the sensor device is a camera.20. The device of claim 18 , wherein the sensor device is a bar code reader.21. The device of claim 18 , wherein the processor is configured to obtain the silkscreen data file from a remote location over a network connection.22. The device of claim 18 , wherein the silkscreen data file is stored in the memory.23. The device of claim 19 , wherein the processor is configured to identify the physical PCB by comparing an image of the physical PCB captured by the sensor to images stored in a database.24. The device of claim 23 , wherein the processor is further configured to browse the PCB image to determine at least one of a scale and orientation of the physical PCB.25. The device of claim 23 , wherein the processor is further configured to browse the PCB image to identify specific components.26. The device of claim 18 , wherein the silkscreen data file comprises a plurality of component reference designators.27. A ...

Frame Unit for Tensioning a Printing Screen and a Jig for Fitting a Printing Screen to or Removing a Printing Screen From a Frame Unit

A frame unit for tensioning a printing screen, the frame unit comprising a frame including at least one frame member, the at least one frame member comprising: a supporting frame element; at least one engagement element for engaging a fitted printing screen to tension the same, wherein the at least one engagement element comprises a body which is pivotally coupled to the supporting frame element such that the at least one engagement element is pivotable in one, tensioning sense to tension a fitted printing screen and the other, opposite sense to adopt a configuration in which a printing screen can be fitted to or removed from the frame unit, a first, engagement arm extending from the body for engaging a fitted printing screen, and a second, biasing arm extending from the body to which a biasing force is applied to bias the at least one engagement element to pivot in the tensioning sense; and at least one biasing element operative to apply a biasing force to the biasing arm of the at least one engagement element to bias the at least one engagement element to pivot in the tensioning sense and tension a fitted printing screen.

SCREEN PRINTING FORM FOR USE IN A SCREEN PRINTING METHOD, SCREEN PRINTING DEVICE, AND SCREEN PRINTING METHOD

A screen printing form (′) for use in screen printing, in particular for producing a metallic contact structure of a photovoltaic solar cell, having a woven screen printing fabric () with a plurality of elongate woven fabric elements, which are arranged in a first element direction and a second element direction perpendicular thereto, and a stencil (), arranged on the woven screen printing fabric () that has at least one opening formed as straight channel with a channel width BK. The woven fabric elements have a spacing AF in the first element direction and a spacing which deviates by less than 5% from AF in the second element direction, and the woven fabric elements have a diameter DG in the first element direction and a diameter which deviates by less than 5% from DG in the second element direction. A screen printing device and screen printing form are also provided. 111. A screen printing form ( , ′) for use in a screen printing method , the screen printing form comprising:{'b': '1', 'i': 'b', 'a screen printing fabric () with a multiplicity of elongate woven fabric elements, which are arranged in a first element direction and a second direction perpendicular thereto;'}{'b': 1', '1, 'i': c', 'b, 'a stencil () arranged on the screen printing fabric (), which has at least one opening formed as a straight channel with a channel width BK;'}wherein the woven fabric elements have a first spacing (AF) in the first element direction and a spacing which deviates by less than 5% from the first spacing (AF) in the second element direction, and the woven fabric elements have a diameter (DG) in the first element direction and a first diameter which deviates by less than 5% from the first diameter (DG) in the second element direction;{'b': '1', 'i': 'd', 'claim-text': [ {'br': None, 'i': BK', 'DG+AF', 'DG, 'sub': 'max', '=(2)sin φ+cos φ'}, 'the angle φ[°] from the group 11.31°, 14.04°, 18.44°, 26.57°, 45° with an associated maximum width (BKmax) [μm] according to'}, 'or', {'br ...

Manufacturing method of printed circuit board for led lighting apparatus

The present invention provides a manufacturing method of a printed circuit board for a light emitting diode (LED) apparatus, which comprises: a step of preparing a substrate; a step of performing a primary surface treatment to one surface of the substrate; a step of printing a circuit pattern on the one surface undergone the primary surface treatment by using a screen; a step of directly drying the printed surface by injecting ultraviolet (UV) light to the printed surface; a step of etching and peeling off the printed surface of the substrate, which is primarily dried by injecting the UV light; a step of performing a secondary surface treatment to the printed surface peeled off; a step of performing a solder resist (SR) printing to the printed surface of the substrate which has undergone the secondary surface treatment; a step of indirectly drying the printed surface by injecting UV light through a rear surface of the substrate; and a step of drying the printed surface, which is indirectly dried by injecting the UV light, by using IR light. The manufacturing method of a printed circuit board for a light emitting diode (LED) apparatus is an eco-friendly method with high productivity and remarkably reduces bleaching of white colored paint in the drying process.

REINFORCED TENSIONING FRAME

A tensioning frame for tensioning a printing screen comprises struts to reinforce the constituent beams. These may be provided either on a supplementary brace plate or integrally formed with the beam. A shaft may be used to retain engagement bodies within pockets formed in the beam. 122-. (canceled)23. A tensioning frame for tensioning a printing screen , the tensioning frame being planar and comprising a plurality of elongate beams which extend around the periphery of the tensioning frame to define the tensioning frame , each beam comprising:an engagement side arranged such that the engagement side of each beam is co-planar and orientated parallel to the plane of the tensioning frame,a beam body,an elongate channel formed within the beam body which extends parallel to the length of the beam and has an opening at the engagement side,an engagement body located within the channel carrying an engagement surface for engaging with a printing screen in use, the engagement surface being movable with respect to the beam body along a range of travel in a plane normal to the length of the beam, andan actuator operatively connected to the engagement body for moving the engagement body, and hence engagement surface, relative to the beam body,wherein at least one beam comprises at least one strut which spans the elongate channel, so that the engagement surface projects outwardly of the beam from the opening of the elongate channel and beyond the strut, during at least part of the engagement surface's range of travel.24. The tensioning frame of claim 23 , comprising a brace plate adapted to fit to the beam body adjacent the opening of the elongate channel claim 23 , the brace plate comprising an aperture sized to receive the engagement surface claim 23 , and wherein the strut is formed within the brace plate to delimit the aperture.25. The tensioning frame of claim 24 , wherein the brace plate comprises first and second interfaces respectively located at opposite sides thereof ...

SCREEN LOADING SYSTEM

A tensioning frame () for tensioning a printing screen () comprises a plurality of elongate beams (A-D) which extend around the periphery of the printing screen () and define the tensioning frame (), wherein at least one of the beams (A-D) comprises an opening () which is dimensioned to permit a printing screen () to be received therethrough, in a lateral direction (A). Mechanisms are described for engagement of the tensioning screen () and printing screen (), as well as an apparatus and a method permitting the lateral loading of the printing screen (). 130-. (canceled)31. A tensioning frame for tensioning a printing screen , the tensioning frame comprising: a plurality of elongate beams which extend around the periphery of the tensioning frame and define the tensioning frame , the tensioning frame being substantially planar , wherein at least one of the beams comprises an opening which is dimensioned to permit a printing screen to be received therethrough.32. The tensioning frame of claim 31 , wherein the opening is dimensioned to receive the printing screen therethrough in a direction parallel to the plane of the tensioning frame.33. The tensioning frame of claim 31 , wherein each beam comprises:an engagement body at least partially located within the beam, the engagement body carrying an engagement surface for engaging with a printing screen in use, the engagement body being movable relative to the beam along a range of travel in a plane normal to the length of the beam; andan actuator operatively connected to the engagement body for moving the engagement body, and hence engagement surface, relative to the beam, wherein optionally the actuator comprises at least one actuator from the group consisting of pneumatic actuator, pneumatic piston, and electric actuator.34. The tensioning frame of claim 33 , wherein the plurality of beams define an interior region of the tensioning frame in which a central region of a printing screen is located in use claim 33 , and the ...

Hole plugging method for printed circuit boards, and hole plugging device

A hole plugging method for a printed circuit board, a hole plugging device in accordance therewith and a manufacturing method in accordance therewith where a mask for selectively exposing a via hole, a through hole and a surface pattern of the printed circuit board is positioned on the board having the via hole and the through hole to electrically connect circuit patterns formed on the surface of the board and in the board and an insulating material is plugged in the via hole by abutting and pushing the material on the surface of the board. Therefore, the insulating material can be plugged smoothly without a void, the processing is simplified by plugging the insulating material just to the height of the circuit pattern in a space between the circuit patterns and accordingly, damage to the circuit pattern can be prevented.

METHOD FOR OBTAINING GLAZINGS PROVIDED WITH ELECTROCONDUCTIVE PATTERNS

A method for obtaining a glazing includes a glass sheet covered, on one of its faces with electroconductive patterns having in at least one area, a so-called extra thickness area, a greater thickness than in the other areas, the method including depositing by screenprinting a first electroconductive layer forming patterns on one side of the glass sheet, then depositing by a digital printing technique, in the or each extra thickness area, a second electroconductive layer on the first layer while the latter is still wet, then a heat treatment step to cure the first and the second layer. 1. A method for obtaining a glazing comprising a sheet of glass covered on a face thereof with electroconductive patterns having in at least one area , forming an so called extra thickness area , a greater thickness than in other areas of said face , said method comprising depositing by screenprinting a first electroconductive layer forming patterns on said face of said glass sheet , followed by depositing by a digital printing technique , in the at least one extra thickness area , a second electroconductive layer on the first electroconductive layer while the first electroconductive layer is still wet , then performing a heat treatment step to cure the first and second electroconductive layers.2. The method according to claim 1 , wherein the electroconductive patterns comprise electroconductive tracks located in at least one lateral portion and in a central portion of the glazing claim 1 , with the extra thickness areas being located in said central portion and/or in at least one lateral portion.3. The method according to claim 2 , wherein the extra thickness areas are located in the central portion and in the lateral portions.4. The method according to claim 1 , comprising claim 1 , before depositing the first electroconductive layer claim 1 , a prior step of depositing by screenprinting a black enamel coating at an edge of the glass sheet claim 1 , on which part of the ...

Screen printing plate

スクリーン印刷版

Manufacture of printed circuit board

Fine pitch solder deposits on printed circuit board process and product

본 발명은 구성들의 리플로우 접속에 적합한 저융점 땜납을 인쇄 회로 기판의 선택된 접점상에 형성하는 방법 및 그로 인해 생성된 제품에 관한 것이다. 본 발명의 방법은 플립 칩 장치를 포함하는 미세 피치 장치를 가지고 있고 통상적인 거친 피치 표면 장착된 구성들을 포함하는 기판상에 접속된 보편화된 인쇄 회로 기판의 제조에 특히 적합하다. 기판의 미세 피치 접점은 땜납 리플로우 온도를 견딜 수 있는 능력, 땜납에 의해 적셔지지 않는 성질 및 인쇄 회로 기판에 상대적으로 어울리는 열팽창 계수를 가지는 것을 특징으로 하는 스텐실에 있는 구멍을 통해 노출된다. 저온 땜납 페이스트는 스텐실 개구내로 스크린 피착된다. 기판상에 고정적으로 피착된 스텐실을 가지고, 스텐실 패턴에 의해 보유된 땜납 페이스트를 리플로우시켜 하부에 놓인 인쇄 회로 기판의 접점을 선택적으로 형성한다. 그 후에, 본 발명의 바람직한 실행방법에 따라, 스텐실을 기판으로부터 제거하고 미세 및 거친 피치 구성 배치를 제조하는데 있어서 이미 실행된 플럭스와 페이스트의 피착이 이루어지게 하고 이어서 땜납 리플로우시킨다. 본 발명의 또다른 실행으로는 미세 피치 땜납과 거친 피치 땜납이 동시에 피착되게 하고 미세 피치 땜납 리플로우 결과 생기는 스텐실을 보유하는 것이다.

Printing mask, method of printing solder paste using printing mask, surface-mounted structural assembly, and method of manufacturing surface-mounted structural assembly

인쇄용 마스크는, PCB 의 랜드상에 솔더 페이스트를 인쇄하기 위해 기판에 한정된 스루홀을 가지는 돌출부를 구비한다. 돌출부는 스루홀에 채워진 솔더 페이스트의 양을 증가시키는데 도움이 된다. The printing mask includes a protrusion having a through hole defined in the substrate for printing the solder paste on the land of the PCB. The protrusions help to increase the amount of solder paste filled in the through holes.

Screen plate and manufacturing method thereof

【課題】印刷精度を向上させることができるスクリーン版を提供する。【解決手段】版枠と、合成繊維の経糸及び緯糸を用いてなるスクリーン紗と、を有し、前記スクリーン紗は、所定の張力が加えられた状態で前記版枠に張られており、前記版枠に張られている前記スクリーン紗の厚さは、張力が加えられていない前記スクリーン紗の厚さの８８％以下であることを特徴とするスクリーン版。【選択図】図１ A screen plate capable of improving printing accuracy is provided. A screen frame and a screen kite made of synthetic fiber warps and wefts, the screen kite being stretched on the plate frame in a state where a predetermined tension is applied, The screen plate having a thickness of 88% or less of the thickness of the screen plate not tensioned is applied to the plate frame. [Selection] Figure 1

Plastic mask unit for paste printing and method of fabricating such plastic mask unit

인쇄 품질의 향상, 마스크 수명의 증가, 제작 소요 공정의 감소 등을 가능하도록 한 플라스틱 판(板)을 구비한 인쇄 마스크와 그 제조 방법을 제공한다. Provided are a printing mask having a plastic plate and a method of manufacturing the same, which enable improvement of print quality, increase of mask life, reduction of manufacturing process, and the like. 판(版) 소재로서 플라스틱 판을 이용한 인쇄 마스크에 관한 것이다. 플라스틱 판의 판(4')을 직접 마스크틀(1)에 접합시킨 것을 특징으로 한다. 플라스틱 판의 판(4')을 직접 마스크틀(1)에 접합시켰기 때문에, 인쇄 품질의 향상, 마스크의 긴 수명화, 제조 공정수의 감소 등을 달성할 수 있다. It relates to a printing mask using a plastic plate as a plate material. The plate 4 'of the plastic plate is bonded directly to the mask frame 1. It is characterized by the above-mentioned. Since the plate 4 'of the plastic plate is directly bonded to the mask frame 1, it is possible to improve the print quality, increase the life of the mask, reduce the number of manufacturing steps, and the like.

Resistor-buried multilayer low-temperature-cofired-ceramic substrate with flat surface and fabrication method thereof

본 발명은 표면의 평탄도가 우수한 고집적 모듈용 저항 내장 저온 동시소성 다층 세라믹 기판 및 그 제조방법에 관한 것이다. The present invention relates to a low-temperature cofired multilayer ceramic substrate with built-in resistance for a highly integrated module having excellent surface flatness and a method of manufacturing the same. 본 발명의 표면이 평탄한 저항 내장형 저온 동시소성 다층 세라믹 기판의 제조방법은 저항이 내장된 저온 동시소성 다층 세라믹 기판의 제조방법에 있어서, 저항 패턴과 내부전극이 형성되어 있는 다층의 저온 동시소성 기판의 상하부면에 접합제를 인쇄하고, 비아가 형성된 고온 소성 그린시트를 부착시키는 단계; 상기 저온 소성 그린시트에 고온 소성 그린시트가 부착된 다층 세라믹 기판을 가압하여 일체화시키는 단계; 상기의 가압된 다층 세라믹 기판을 800∼900℃에서 소성하는 단계; 상기 소성된 다층 세라믹 기판의 고온 소성 그린시트를 세척하고, 연마하여 저온 동시소성 다층 세라믹 기판을 제조하는 단계; 및 상기 저온 동시소성 다층 세라믹 기판의 비아와 연결되도록 표면회로 패턴을 인쇄하는 단계로 이루어짐에 기술적 특징이 있다. The method for manufacturing a low-temperature cofired multilayer ceramic substrate with a resistance-embedded flat surface of the present invention is a method for manufacturing a low-temperature cofired multilayer ceramic substrate with a built-in resistance, comprising: a multi-layer low temperature cofired substrate having a resistance pattern and an internal electrode formed thereon; Printing a binder on upper and lower surfaces and attaching a high temperature calcined green sheet having vias formed thereon; Pressing and integrating the multilayer ceramic substrate having the high temperature calcined green sheet attached to the low temperature calcined green sheet; Firing the pressurized multilayer ceramic substrate at 800 to 900 ° C; Washing and polishing the high temperature calcined green sheet of the calcined multilayer ceramic substrate to prepare a low temperature cofired multilayer ceramic substrate; And printing a surface circuit pattern to be connected to the via of the low temperature cofired multilayer ceramic substrate. 따라서 본 발명의 표면이 평탄한 저항 내장형 저온 동시소성 다층 세라믹 기판 및 그 제조방법은 저온 동시소성 세라믹의 소성온도에서 소성되지 않는 고온 소성 기판을 저온 소성 세라믹 적층체의 상하부면에 적층한 후 동시 소성을 실행함으로써 표면 평탄도를 향상시키는 방법을 제공한다. 이에 따라 내장된 저항의 상부에 후막인쇄, 부품 실장, IC 접합, 플립칩(flipchip) 접합과 같은 후공정이 용이하므로, 부품의 고집적화와 신뢰도 및 수율(收率)이 ...

PI (polyimide) reinforcement processing method with marking line and manufacturing method of flexible circuit board

本发明公开了一种带标记线的PI补强加工方法及柔性电路板的制作方法，本发明将PI补强上的标记线与产品上的字符分开丝印，PI补强先整板丝印标记线后，再进行后续加工，在PI补强整板丝印标记线时，PI补强板板面平整，易于丝印，在PI补强成型时，采用相机识别PI补强上的标记线后，再加工成型，可提升标记线于补强上的位置精度；先对没有贴合PI补强的基板进行丝印字符，基板板面平整，易于丝印，可提高字符的丝印精度。

Solar cell device and method for producing a solar cell device

According to an aspect, a solar cell device (120) is provided that includes one or more fingers (400). The one or more fingers are provided with a tapered shape. According to a further aspect, a method for producing a solar cell device is provided. The method includes depositing one or more finger with a tapered shape. Furthermore, a screen (132) for use in a screen printing apparatus (100) is provided. The screen includes at least one finger slot (850) wherein the at least one finger slot has a tapered shape so as to produce at least one tapered finger on a solar cell device.

A printed circuit board manufacturing method

Provided are a method of manufacturing a printed circuit board (PCB) and a film to prepare the printed circuit board. The method of manufacturing the printed circuit board comprises: a step of preparing plate net and exposure films to which a pattern and a marker are applied in a state which a pattern and the marker to be applied to the PCB are determined respectively; a step of applying the pattern and the marker to a plate net using one of a plurality of films; a step of printing photosensitive solution on the PCB in a pattern using the plate net to which the pattern and the marker are applied; a step of radiating ultraviolet rays to the PCB to apply the pattern formed on an exposure working film to the PCB in a state which the film and the PCB are aligned to a position of the pattern using the marker; a step of immersing a non-patterned copper foil of the PCB exposed to ultraviolet rays in a ferric chloride solution to melt the non-patterned copper foil; and a step of drying the PCB from which the non-patterned copper foil is removed. According to the related art, when the PCB is manufactured through light exposure in accordance with a related art since the film and the PCB are aligned with each other with a pin, it is difficult to precisely align them, thus an error rate is about 0.1-0.15% or more. However, in accordance with the present invention, when the PCB is exposed using the film to which the marker is applied, the positions are primarily aligned through a pin like the related art and the film, and the PCB are secondarily aligned with each other through the marker such that the error rate of the PCB is greatly decreased to be 0.1% or less.

Mesh member for screen printing and screen printing plate

本发明涉及在通过丝网印刷形成指状电极以及母线电极时所使用的丝网印刷用网眼部件。该网眼部件是在压延金属箔通过蚀刻进行开孔加工而得到的。在指状电极对应部，形成为横长型的各个孔排列设置在与该孔的横长方向正交的方向上，该横长方向长度大于印刷图案预定部的宽度，其端部延伸到印刷图案预定部的外侧而形成。指状电极对应部中的开口面积率大于母线电极对应部中的开口面积率。

Extruded extensible substrate for flexible printed circuit and its manufacturing method

Screen printing device

본 발명은 피인쇄체를 인쇄위치에 유지시키도록 지지하는 지지수단과, ㅇ니쇄형상을 갖도록 잉크침투부가 형성된 인쇄원판과, 상기 인쇄원판을 상기 피인쇄체에 당접하는 위치에 하우징하는 인쇄원판하우징 수단과, 상기 인쇄원판에 대해 양방향으로 수평 이동하는 슬라이더와, 상기 슬라이더를 양방향으로 구동시키는 슬라이더 구동수단과, 상기 인쇄원판에 공급된 잉크를 인쇄원판 전체에 전개시키는 제1, 제2스퀴지와, 상기 제1, 제2스퀴지를 지지하고, 상기 제1스퀴지 및 제2스퀴지중 하나를 선택하며, 선택된 스퀴지를 상기 인쇄원판에 당접시키도록 상기 슬라이더내에 배치된 스퀴지 스위치 수단으로 구성된 스크린 인쇄장치에 관한 것이다. 시트 지지용, 시트지지기구, 인쇄원판 및 인쇄원판 하우징수단으로 형성된 판유니트, 잉크인쇄입기구를 구비하고 있다. 잉크쇄입기구는 제1, 제2스퀴지, 슬라이더, 상기 슬라이더를 양방향으로 이동시키는 벨트, 각 스퀴지를 승강시키는 제1, 제2실린더로 구성되어 있다. 상기 인쇄원판은 강자성체가 함유된 재질로 형성되어 있으며, 전자석 및/혹은 영구자석은 시트지지기구내에 배치되어 있다.

Jig integrated metal mask manufacturing method and mask

본 발명은 인쇄회로기판을 제작하기 위한 메탈 마스크에 관한 것이다. 특히, 표면실장기술의 납량 조절을 위한 필름적층기술을 이용할 때, 패턴이 그 탄성에 의해 흔들리며 정확한 위치를 찾지 못하고, 얇은 금속막의 특성상 휘어지거나 구부러지는 현상을 방지하기 위해 메탈 마스크 자체를 지그에 일체된 상태로 제작하기 위한 지그 일체형 메탈 마스크 제조방법과 그 마스크에 관한 것이다. The present invention relates to a metal mask for manufacturing a printed circuit board. In particular, when using the film lamination technology for controlling the lead amount of the surface mount technology, the pattern is shaken by its elasticity and the exact position is not found, and the metal mask itself is integrated in the jig to prevent the phenomenon of bending or bending due to the characteristics of the thin metal film. The present invention relates to a jig-integrated metal mask manufacturing method and a mask for manufacturing the same. 지그프레임, 경사면, 금속막, 유리판, 금속판, 노광부, 공간부 Jig frame, slope, metal film, glass plate, metal plate, exposed part, space part

A Screen Printing Method and Apparatus

플라즈마 세정 단계를 포함하는 스크린 인쇄 방법이 개시된다. 본 발명은 금속 메쉬(7) 상에 감광성 물질(9)을 도포하여 소정의 패턴을 형성한 후 금속 메쉬(7)를 전사 기판(1)에 대고 스퀴지(11)를 이용하여 금속 메쉬(7)로부터 전사물(10)을 토출시켜 전사 기판(1) 상에 패턴을 전사하는 스크린 인쇄 방법으로서, 전사 기판(1) 상에 패턴을 전사하기 전에 전사 기판(1)을 플라즈마 처리하는 단계, 금속 메쉬(7) 상에 감광성 물질(9)을 도포하기 전에 금속 메쉬(7)의 와이어를 플라즈마 처리하는 단계, 금속 메쉬(7) 상에 패턴이 형성된 후에 금속 메쉬(7)의 와이어를 플라즈마 처리하는 단계 중 적어도 하나의 단계를 포함한다. 이로써 본 발명에 따르면 인쇄 회로 기판의 회로 패턴 제조시 고정세의 패턴을 제조할 수 있다. A screen printing method comprising a plasma cleaning step is disclosed. According to the present invention, the photosensitive material 9 is coated on the metal mesh 7 to form a predetermined pattern, and then the metal mesh 7 is attached to the transfer substrate 1 by the squeegee 11. A screen printing method of transferring a pattern onto a transfer substrate 1 by discharging a transfer object 10 from the step, wherein the step of performing plasma treatment on the transfer substrate 1 before transferring the pattern onto the transfer substrate 1, a metal mesh Plasma treating the wires of the metal mesh 7 before applying the photosensitive material 9 on (7), and plasma treating the wires of the metal mesh 7 after the pattern is formed on the metal mesh 7. At least one step of the. Thus, according to the present invention, it is possible to produce a high-definition pattern in the manufacture of a circuit pattern of a printed circuit board. 스크린 인쇄, 플라즈마 처리, 대기압 플라즈마 Screen printing, plasma treatment, atmospheric plasma

Fire protection joint cord, useful for protecting sealing and/or concrete edges of tunnel-, underground construction- and/or surface construction-joints, comprises a core containing a composite-forming carrier and an intumescent component

Fire protection joint cord comprises a core (2) containing (a) a composite-forming carrier and (b) an intumescent component. An independent claim is also included for producing the fire protection joint cord, comprising: (a) providing an outer layer (1) with the required dimensions for the cord, (b) pulling the outer layer via a supplying device, through which the core material is introduced into the outer layer, (c) providing the composite-forming carrier and the intumescent component, (d) introducing the composite-forming carrier and the intumescent component of the step (c) into the outer lay, and (e) optionally removing the outer layer; or (a) providing the composite-forming carrier and the intumescent component, and (b) extruding the composite-forming carrier with the intumescent component with the required dimensions by a tool.

Printing equipment and printing method

screen printing device and screen printing method

提供了一种丝网印刷设备和丝网印刷方法，用于对基板的上表面和开口于上表面的凹陷的底表面进行丝网印刷，从而可以确保良好的印刷质量，并且可以执行有效率的印刷操作。用于将电子元件连接用膏剂印刷在基板的上表面和凹陷的底表面上的丝网印刷设备包括串联布置从而以两个步骤将膏剂顺序印刷在基板上的印刷设备(2(1))和印刷设备(2(2))，其中，上游侧印刷设备(2(1))设置有对应于凹陷的底表面设置的底部印刷掩模和在抵靠底表面印刷掩模的上表面的同时可滑动地移动以对膏剂进行加压并供应膏剂的封闭式刮板机构(36A)；并且下游侧印刷设备(2(2))设置有对应于上表面设置的上表面印刷掩模和在抵靠上表面印刷掩模的上表面的同时可滑动地移动以将膏剂填充在图案孔中的开放式刮板机构(36B)。

Mounting structure of electronic component, mounting board, and mounting method of the electronic component

(57)【要約】 【課題】 複数の電子部品の各々に所望の量の半田を供 給することができる電子部品の実装構造、搭載用基板お よび電子部品の実装方法を提供する。 【解決手段】 プリント基板１と、このプリント基板 １の１つの主面に形成された複数の凹部２１〜２３と、 この複数の凹部２１〜２３の各々の底面に設けられた複 数のパッド４１〜４６と、この複数のパッド４１〜４６ の各々に設けられた半田９１〜９６と、それぞれが電極 を有し複数の凹部２１〜２３に対応して設けられ該電極 が対応する凹部のパッド４１〜４６と半田９１〜９６に より接続された複数の電子部品とから構成する。

The method on preparation structure surface

本发明涉及一种制备结构化表面的方法，其中将包括纳米线的组合物施加到表面上并且将其结构化，特别地通过部分地移动组合物来结构化。当溶剂被去除时，纳米线聚集成结构体。这些结构体可以既是透明的又是导电的。

Method for producing structured surfaces

A process for producing a structured surface, in which a composition comprising nanowires is applied to a surface and structured, especially by partial displacement of the composition. When the solvent is removed, the nanowires aggregate to form structures. These may be transparent and also conductive.

Method of printing a bonding agent

요약 없음 No summary

Track forming method on flat substrate by stencil printing

(57)【要約】 本発明はステンシル印刷法によってプラズマディスプレイ又はＰＡＬＣディスプレイのようなフラットディスプレイ装置におけるトラック、例えば導電トラックを形成することに関するものである。特に、通過させる印刷ペーストの量を局所的に変えられる多層ステンシルを用いることができる。

electronic component multilayer alloy electrode and preparation method thereof

本发明涉及一种电子元器件的多层合金电极及其制备方法，包括依次覆盖在陶瓷基体上的第一金属层以及第二合金层；所述的第一金属层为金属电极；所述的第二合金层为合金电极；第二合金层采用热喷涂工艺覆盖在第一金属层上；所述的第一金属层为采用丝网印刷工艺制成的铝浆；所述的第二合金层为铜与磷、硅、铝中任意一种组成的合金丝或铜与磷、锡组成的合金丝。本发明第二合金层选用铜合金喷涂丝喷涂相比铜浆印刷或纯紫铜丝喷涂而言，不仅替代了铜浆印刷工艺，还在解决电子元器件电极成本问题的同时，提升贱金属铜电极在高温使用条件下的可靠性。

Process for producing structured surfaces

Die Erfindung betrifft ein Verfahren zur Herstellung einer strukturierten Oberfläche, bei dem eine Zusammensetzung umfassend Nanodrähte auf eine Oberfläche aufgebracht und strukturiert wird, insbesondere durch teilweises Verdrängen der Zusammensetzung. Beim Entfernen des Lösungsmittels lagern sich die Nanodrähte zu Strukturen zusammen. Diese können transparent als auch leitfähig sein. The invention relates to a method for producing a structured surface, in which a composition comprising nanowires is applied to a surface and structured, in particular by partial displacement of the composition. As the solvent is removed, the nanowires aggregate into structures. These can be transparent as well as conductive.

Screen mask

一種用於網版印刷之網罩包含遮罩、以及架框，配置以利用張力支撐遮罩；架框包含固定框、以及活動框，配置以支撐遮罩，且可活動地裝設於固定框上，其中張力由活動框控制。

Enclosures and printing systems

수납 장치(40)는, 스크린 마스크(M)를 포함하는 교환 대상물을 이용하여 인쇄 대상(S)에 대해 점성 유체의 인쇄 처리를 행하는 인쇄부를 구비한 스크린 인쇄 장치(11)에 이용된다. 이 수납 장치(40)는, 교환 대상물을 인쇄부(22)와의 사이에서 반출입하는 수수단(58)이 있고, 교환 대상물을 재치하는 재치부(50)를 복수 수용하고, 이 교환 대상물을 수납하는 수납부(42)와, 재치부의 어느 하나를 수수단으로 이동시키는 재치부 이동부(43)와, 수수단에 배설되고 재치부를 통과시키는 대피 위치와 재치부상의 교환 대상물에 맞닿는 맞닿음 위치와의 사이에서 이동하고 맞닿음 위치에서 교환 대상물에 맞닿아 이 교환 대상물을 반출입 방향으로 이동시키는 대상물 이동부(44)를 구비한다. The storage device 40 is used for a screen printing device 11 provided with a printing unit that performs a viscous fluid printing process on the printing target S using an exchange target including the screen mask M. This storage device 40 has a transfer means 58 for carrying in and out of the exchange object between the printing unit 22 and the receiving unit 50 for accommodating a plurality of mounting units 50 for placing the exchange object, and for accommodating the exchange object. The receiving unit 42 and the mounting unit moving unit 43 for moving one of the mounting units to the receiving means, and an evacuation position disposed in the receiving unit and passing the mounting unit through the receiving unit and the abutting position in contact with the exchange target on the receiving unit and an object moving part 44 that moves between the two and abuts against the exchange object at the abutting position to move the exchange object in the carrying-in/out direction.

Process for obtaining glazing provided with electrically conductive patterns

L’invention concerne un procédé d’obtention d’un vitrage (1) comprenant une feuille de verre (2) revêtue sur une de ses faces de motifs électroconducteurs (4, 6, 8, 10) présentant dans au moins une zone (10A, 12A), dite zone de surépaisseur, une épaisseur plus élevée que dans les autres zones, ledit procédé comprenant le dépôt par sérigraphie d’une première couche électroconductrice formant motifs sur une face de ladite feuille de verre, puis le dépôt par une technique d’impression numérique, dans la ou chaque zone de surépaisseur (10A, 12A), d’une deuxième couche électroconductrice sur la première couche encore humide, puis une étape de traitement thermique de cuisson de la première et de la deuxième couche. Figure 1 The invention relates to a process for obtaining a glazing (1) comprising a sheet of glass (2) coated on one of its faces with electrically conductive patterns (4, 6, 8, 10) having in at least one zone (10A , 12A), referred to as the extra thickness zone, a thickness greater than in the other zones, the said method comprising the deposition by screen printing of a first electroconductive layer forming patterns on one face of the said glass sheet, then the deposition by a technique of digital printing, in the or each extra thickness zone (10A, 12A), of a second electrically conductive layer on the first layer which is still wet, then a stage of heat treatment for baking the first and the second layer. Figure 1

Solder paste stencil printer

A solder paste stencil printing process and apparatus in which a stencil plate having a porous figure printing area may be used for single component solder paste application. The printing operation is performed by alignment of the stencil pattern figure over the appropriate component substrate pads. With the stencil plate being held in place by downward force, solder paste is dispensed over the stencil plate pattern allowing gravity flow of the paste material into the stencil pattern pores. Excess paste material is squeegeed level to the top surface of the stencil plate and the plate lifted from the substrate surface leaving solder paste in the configured pattern. An associated stencil plate holder matched to the apparatus receiver head allows any number of stencil plate patterns to be made available for solder paste application.

Fine pitch component placement method and apparatus

An apparatus and method for aligning fine pitch electrical components (14) and for solder paste stenciling includes a template (20, 40) for aligning an electrical component (14) and for aligning a solder stencil (60, 70). The template (20, 45) has a window (30, 50) with shelves on opposite sides. Tape is adhered to the shelves across the window (30, 50) and is used to secure the template (20, 40) to the desired location on the printed circuit board (10). The template (20, 40) also includes upright tabs that engage notches (66, 76) in theedges of the stencil for aligning the stencil (60, 70). A two-headed vacuum lifting device (120) is used to lift an aligned component (14) and an aligned stencil (60, 70) from the template. With the template (20, 40) removed from the printed circuit board (10), the stencil (60, 70) is replaced in the aligned position for solder application. The stencil (60, 70) is removed and the electrical component (14) is placed for soldering.

Method for structuring wafers or substrates using UBM layer technology, involves adhering plastics strip to surface of wafer and punching holes using laser through plastic band, above UBM layer

Method for forming metal structures on a wafer, involves forming a substructure metal layer (UBM) (12) on an electrode terminal face (11) on the surface of a wafer (1). A plastic strip is adhered to the surface of the wafer (1) and holes are stamped through the plastic strip above the UBM using a laser, to form a blind-hole in the plastic strip above the UBM (12), followed by filling a solder paste (5) into the blind-hole with a slider. The solder paste is subsequently melted and cooled to form a solder block (6), and the plastic strip is removed to release the solder block (6), and then the solder block is melted to form a solder ball (7).

Wiring substrate and method for manufacturing the same, electro-optical device and method for manufacturing the same, and electronic apparatus and method for manufacturing the same

본 발명은 기판상에 형성된 복수의 단자상에 땜납을 인쇄할 때, 땜납과 단자 사이의 접촉 면적을 항상 충분히 확보할 수 있도록 한다. The present invention ensures that a sufficient contact area between the solder and the terminal is always secured when printing the solder on the plurality of terminals formed on the substrate. IC 패키지에 구비되는 복수의 단자에 대응하도록 기판(33)상에 형성된 복수의 단자(39)상에 땜납(64)을 인쇄할 때에 이용하는 마스크(62)이다. 이 마스크(62)는, 땜납(64)을 통과시키는 개구(63)를 갖고, 이 개구(63)는 단자(39)보다도 크게 되어 있다. 땜납(64)은, 단자(39)에 인접하는 배선(38a)에 덮일지도 모르지만, 이것에 리플로우 처리가 실시되면, 일부분(64a)과 다른 부분(64b)으로 분리되어, 배선(38a)과 단자(39)의 단락이 방지된다. A mask 62 used for printing the solder 64 on the plurality of terminals 39 formed on the substrate 33 so as to correspond to the plurality of terminals provided in the IC package. The mask 62 has an opening 63 through which the solder 64 passes, and the opening 63 is larger than the terminal 39. The solder 64 may be covered by the wiring 38a adjacent to the terminal 39. However, when the reflow process is performed, the solder 64 is separated into the portion 64a and the other portion 64b, so that the solder 38 and the wiring 38a are separated. Short circuit of the terminal 39 is prevented.

Three-dimensional printed antenna, method for manufacturing the same, and electronic device

A method for manufacturing a flex-tolerant three-dimensional printed antenna suitable for use in an electronic device provides a three-dimensional printed antenna with base layer, radiation layer, through holes, and feeder. The radiation layer includes a first radiation region, at least one second radiation region, and a feed end. A region between the first and second radiation regions is defined as a bent region. The radiation layer is formed by a screen-printing plate by a planar printing process. The through holes on the bent region form a line for bending. The feeder is electrically connected to the feed end. The second radiation region is canted from the bending line with respect to the first radiation region to form the three-dimensional printed antenna. The three-dimensional printed antenna and an electronic device are also disclosed.

Mesh member for screen printing and screen printing plate

一種以網版印刷來形成指狀電極及母線電極時所使用的網版印刷用網目構件。該網目構件係為對壓延金屬箔以蝕刻做開孔加工而成。在指狀電極對應部，形成為橫長型的各個孔，是朝與該孔的橫長方向正交之方向排列設置，該橫長方向的長度，是比印刷圖樣預定部的寬度還大，其端部形成為延伸至印刷圖樣預定部的外側。指狀電極對應部之開口面積率，比母線電極對應部之開口面積率還大。

Method and stencil for extruding material on a substrate

A stencil for use in fabricating semiconductor devices is disclosed that has an aperture having a first portion extending from a first side thereof and a second portion extending from a second side thereof to minimize the shear stress between the material extruded therethrough and the stencil. The stencil allows for material to be extruded through the top of the stencil to the surface of the substrate and not contact the wall of the second portion of the aperture of the stencil. Since the material only contacts a small area of the first portion of the aperture near the top of the stencil, the material remains on the substrate and not in the aperture of the stencil.

Screen for screen printing

Gegenstand der Erfindung ist ein Sieb für den technischen Siebdruck mit einem formsteifen Rahmen (1, 2, 3), einem am Rahmen allseitig unter Spannung befestigten Streifen (4) aus elektrisch nichtleitendem Material, einem feinmaschigen Siebgewebe (6) aus elektrisch leitendem Material, vorzugsweise feinen Edelstahldrähten, das allseitig am Innenrand des Streifens (4) unter Spannung befestigt ist, und dem Siebgewebe (6) zugeordneten druckaktiven Elementen (9). Zur verbesserten Handhabung und Verteilung der verwendeten Pasten sind am Siebgewebe (6) voneinander beabstandete elektrische Anschlüsse (12, 13) befestigt, die zur Erwärmung des Siebgewebes (6) in vorbestimmten Bereichen an eine Stromquelle (10) anschließbar sind.

Stencil incorporating electronic tag

A stencil and stencil identification system in which the stencil carries a tagging device capable of storing data corresponding to characteristics of the stencil and the pattern of apertures formed in the stencil. The stencil with tagging device may be utilized in combination with a stencil printing device having a tag reader which reads information data stored within the tagging device and/or writes information into the tagging device relating to characteristics of the stencil or other criteria.

Method of making a high-density electronic circuit

A high-density circuit has a plurality of conductors formed in grooves in a ceramic substrate, the conductors having a height less than that of the walls of the grooves. The substrate is embossed with a pattern of grooves corresponding to the grooves in an electroform made from a master tool. The same master tool is used to form a stencil which mates with the grooved substrate. A cermet paste is pushed through the stencil, so as to fill the bottom region of the grooves, and the stencil is then removed, leaving only the paste at the bottom of the grooves. The substrate is then fired, causing the substrate to harden, and causing the cermet to become conductive and to become firmly bonded to the substrate. Because the stencil and the substrate are made from the same, or replications of the same, master tool, the cermet paste can be laid down with great precision, thus enhancing the quality of the product, and reducing the cost of its manufacture.

Screen printing apparatus for printing layers having different thicknesses

A screen printing apparatus for applying a printing agent in different thicknesses to a plate. A mask of the apparatus has a width corresponding to or matching the widths of two plates to be printed. A first portion of the mask, for applying a first printing to the plate, is reduced by recessing an upper surface of the mask portion, with screen holes being provided therein pursuant to a desired pattern. A second portion of the mask, for applying a second printing to the plate, is provided with screen holes in a different pattern. Recesses are provided in the lower surface of the second portion of the mask for receiving the printing agent applied via the first portion of the mask, thereby preventing the printing agent from attaching to the second portion of the mask. A single printing operation, on two plates disposed side by side, is performed by moving a squeegee having two portions with different thicknesses or heights. The plate to be printed can be shifted under the lower surface of the mask.

Steel mesh opening method for through-hole reflow soldering device and computer-readable storage medium

本发明公开了一种通孔回流焊器件钢网开口方法，包括：根据预先建立的通孔回流焊器件焊接模型计算焊接时理论所需焊锡量，将理论所需焊锡量转换为理论所需锡膏量；根据理论所需锡膏量结合器件模型或器件图纸、基础钢网厚度计算钢网理论开口面积；根据所述钢网理论开口面积设计钢网开口方案。本发明能够在焊接前精确地计算出通孔回流焊所需锡膏量，结合器件模型或器件图纸设计钢网开口方案。此外，在钢网局部加厚不可行时，预警开口失败并告知需要补充的焊锡量。本发明还通过插件孔印锡填充率计算公式及焊接模型，精准地指导通孔回流焊器件选型及印刷电路板厚度、插件孔及焊盘设计，从而获得最大的生产良率。

Apparatus and method for extrusion printing of electrical circuit elements

1,135,819. Stencil printing machine. INTERNATIONAL BUSINESS MACHINES CORP. 18 May, 1967 [24 June, 1966], No. 23007/67. Heading B6C. [Also in Division H1] An apparatus for the extrusion printing of electrical circuit elements on a substrate comprises a stencil, an extruder nozzle driving means for moving the nozzle across the stencil and means for extruding printing pigment through the nozzle. The described apparatus, Fig. 3, produces three stencilled resistance areas on a ceramic substrate 4 by sweeping a pigment extruding nozzle 11 over the upper face of a stencil 7 securely held in a recess 39 of a fixed plate 19. The nozzle 11, which is spring- loaded on to the upper stencil face, is reciprocated across the stencil by an hydraulically operated piston and cylinder arrangement 85, 86, each stroke of the piston corresponding to the stencil printing of one substrate. The individual substrates 4 are spring- pressed on a support platen 16 against the under-surface of the stencil, lowering of the platen for substrate replacement purposes being effected through an hydraulic piston and cylinder arrangement 25, 26. Fluid pressure via a hose 51 is used to force printing pigment 47 from a chamber 46 through the nozzle 11. The stencil 7 comprises a plate having, on its underside, three recesses 11, 3<SP>1</SP>, 2<SP>1</SP> (not shown), Fig. 9, corresponding to the three resistance areas to be printed, the pigment passing to the recesses during the sweep of the nozzle 11 through a multiplicity of holes 8 above the recesses.