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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 32. Отображено 32.
27-02-2019 дата публикации

커패시터

Номер: KR0101952869B1
Автор: 박노일, 문병철, 이일로, 신현호, 임승모, 강인영
Принадлежит: 삼성전기주식회사

... 본 발명의 일 실시예는 복수개의 트랜치를 포함하며, 용량부와 상기 용량부 주위에 배치되는 마진부를 포함하는 기판; 상기 기판의 일면 및 상기 트랜치를 충전하도록 배치되는 유전층; 상기 유전층의 일면에 배치되며, 상기 용량부로 부터 상기 마진부로 인출되는 제1 인출부를 포함하는 복수의 제1 전극층; 및 상기 유전층을 사이에 두고 상기 제1 전극층과 대향하도록 상기 유전층의 일면에 배치되며, 상기 용량부로부터 상기 마진부로 인출되는 제2 인출부를 포함하는 복수의 제2 전극층;을 포함하고, 상기 복수의 제1 전극층의 상기 제1 인출부 및 상기 복수의 제2 전극층의 상기 제2 인출부는 상기 마진부로부터 상기 용량부 방향으로 기울어진 계단 형상으로 적층된 커패시터에 관한 것이다.

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Номер записи: 1
21-05-2018 дата публикации

MULTILAYER THIN FILM CAPACITOR

Номер: KR1020180052879A
Автор: PARK, NO IL, KANG, PIL JOONG, LIM, SEUNG MO, SHIN, HYUN HO
Принадлежит:

The present disclosure relates to a multilayer thin film capacitor including a stack body on which a plurality of dielectric layers and first and second internal electrode layers are alternately stacked, and first and second external electrodes disposed on the stack body and connected to the first and second internal electrode layers. The multilayer thin film capacitor includes a first edge via connected to the first external electrode. The first edge via is disposed on at least one edge among the edges of the upper side of the stack body. The multilayer thin film capacitor includes a second edge via connected to the second external electrode. The second edge via is disposed on at least one edge of the upper side of the stack body. Accordingly, the present invention can remarkably reduce ESR. COPYRIGHT KIPO 2018 ...

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Номер записи: 2
26-04-2016 дата публикации

SEMICONDUCTOR PACKAGE MODULE

Номер: KR1020160044953A
Автор: LEE, KANG HYUN, PARK, NO IL
Принадлежит:

The semiconductor package module of the present invention includes at least one electronic component mounted on a substrate; a shield can which is mounted on the substrate while the shield can accommodates the electronic component; and a buffer member which is arranged between the electronic component and the shield can and absorbs an impact due to warpage deformation of the shield can. Therefore, a collision between an electronic component and the shield can be minimized. COPYRIGHT KIPO 2016 ...

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Номер записи: 3
23-01-2019 дата публикации

커패시터 및 이를 포함하는 실장기판

Номер: KR1020190007630A
Автор: 박노일, 강인영, 신현호, 임승모, 류정훈
Принадлежит:

... 본 발명의 일 실시예는 제1 커패시터 영역과 제2 커패시터 영역을 포함하는 기판을 포함하는 바디; 및 상기 바디의 외측에 배치되는 제1 단자 전극, 제2 단자 전극 및 제3 단자 전극;을 포함하고, 상기 제1 커패시터 영역은, 복수의 제1 트랜치; 및 상기 제1 커패시터 영역의 상기 기판의 일면과 상기 제1 트랜치에 배치되며, 적어도 하나 이상의 제1 유전층과 상기 제1 유전층을 사이에 두고 배치되는 제1 및 제2 전극을 포함하는 제1 커패시터층;을 포함하고, 상기 제2 커패시터 영역은, 복수의 제2 트랜치; 및 상기 제2 커패시터 영역의 상기 기판의 일면과 상기 제2 트랜치에 배치되며, 적어도 하나 이상의 제2 유전층과 상기 제2 유전층을 사이에 두고 배치되는 제3 및 제4 전극을 포함하는 제2 커패시터층;을 포함하고, 상기 제2 커패시터층의 비표면적이 상기 제1 커패시터층의 비표면적보다 큰 커패시터를 제공한다.

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Номер записи: 4
11-12-2018 дата публикации

CAPACITOR

Номер: KR1020180131846A
Автор: SHIN, HYUN HO, JUNG, WOONG DO, HAN, JONG SUK, YOO, DONG SIK, RYOU, JEONG HOON, PARK, NO IL, LIM, SEUNG MO, LEE, IL RO
Принадлежит:

The present invention relates to a capacitor which can markedly improve capacitance. According to an embodiment of the present invention, a cell includes a plurality of trenches arranged on a substrate, a capacity unit on which the trenches are positioned, and a margin unit arranged around the capacity unit. The cell further includes: n (n >= 3) dielectric layers arranged on the capacity unit and arranged to fill the trenches; and n (n >= 3) or more electrode layers sequentially stacked to arrange the dielectric layers therebetween. At least some of the electrode layers include withdrawal electrodes withdrawn to the margin unit from the capacity unit. One side of a first direction of the cell with respect to the center of the first direction is referred to as a first area, and the other side of the first direction of the cell with respect to the center of the first direction is referred to as a second area. The withdrawal electrodes of oddly stacked odd electrode layers among the electrode ...

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Номер записи: 5
14-06-2016 дата публикации

SOLDER RESIST FILM AND PRINTED CIRCUIT BOARD

Номер: KR1020160067554A
Автор: PARK, NO IL, KIM, EUN SIL, ICHIRO OGURA, SHIN, SANG HYUN
Принадлежит:

Disclosed are a solder resist film and a printed circuit board. According to one aspect of the present invention, the solder resist film comprises: a solder resist layer composed of resins; and a glass layer formed in the inside of the solder resist layer and having a lower thermal expansion coefficient than that of the resin. The purpose of the present invention is to provide the solder resist film having a low thermal expansion coefficient. COPYRIGHT KIPO 2016 ...

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Номер записи: 6
28-12-2018 дата публикации

커패시터 및 그 제조 방법

Номер: KR0101933419B1
Автор: 류정훈, 유동식, 한승훈, 박노일, 임승모, 신현호
Принадлежит: 삼성전기 주식회사

... 본 발명의 일 실시예는 기판 및 상기 기판 상에 배치되는 용량층을 포함하는 바디를 포함하며, 상기 기판은, 상기 기판의 일면에서 상기 기판의 내측으로 관입하는 복수의 제1 트랜치; 및 상기 기판의 일면과 상기 제1 트랜치에 배치되며, 제1 유전층과 상기 제1 유전층을 사이에 두고 서로 교번하여 배치되는 제1 및 제2 전극을 포함하는 제1 커패시터층;을 포함하고, 상기 용량층은, 상기 용량층의 일면에서 상기 용량층의 내측으로 관입하는 복수의 제2 트랜치; 및 상기 용량층의 일면과 상기 제2 트랜치에 배치되며, 제2 유전층과 상기 제2 유전층을 사이에 두고 서로 교번하여 배치되는 제3 및 제4 전극을 포함하는 제2 커패시터층;을 포함하는 커패시터를 제공한다.

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Номер записи: 7
26-07-2017 дата публикации

GRAPHITE-CONDUCTIVE POLYMER COMPOSITE AND MANUFACTURING METHOD THEREOF

Номер: KR1020170086292A
Автор: CHUNG, DAE WON, LEE, SEONG MIN, PARK, NO IL, LEE, SEUL BI
Принадлежит:

The present invention relates to a method for manufacturing a graphite-conductive polymer composite comprising: a dispersion step of dispersing graphite into a conductive polymer monomer and preparing a graphite-conductive polymer monomer dispersion solution; and a polymerization step of polymerizing the conductive polymer monomer and forming a graphite-conductive polymer composite. According to the present invention, a composite can be directly formed from low-priced graphite. Also, a graphite-conductive polymer composite having excellent water dispersibility and electric conductivity can be provided even if graphite is included. COPYRIGHT KIPO 2017 (AA) Conductive polymer (BB) Graphite ...

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Номер записи: 8
08-02-2017 дата публикации

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Номер: KR1020170014958A
Автор: LEE, KI JU, MYUNG, JUN WOO, PARK, NO IL, KIM, JIN SU, LEE, EUNG SUEK, LIM, JAE HYUN
Принадлежит:

Disclosed is a semiconductor package capable of forming a plurality of lead frames by removing an upper end part of the lead frame mounted on a substrate through a surface mounting process, after a molding layer is stacked. Accordingly, the present invention can form the lead frame with a fine pitch. COPYRIGHT KIPO 2017 ...

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Номер записи: 9
19-07-2018 дата публикации

SAFETY HELMET CAPABLE OF PREVENTING ACCIDENTS AND PERFORMING RESCUE BY SENDING INFORMATION OF WEARER IN REAL TIME

Номер: KR1020180082856A
Автор: KIM, SUN MYENG, AHN, HYEONG WOOK, PARK, NO IL, LEE, JI EUN
Принадлежит:

The present invention relates to a safety helmet capable of preventing accidents and performing rescue by sending information of a wearer in real time, wherein the safety helmet comprises: a control unit positioned at the upper end of the safety helmet and controlling various devices installed in the helmet; a sensing unit coupled to the control unit to sense the state of the helmet; a communication unit coupled to the control unit and configured to transmit data identified through the sensing unit to an external server; and a photographing unit positioned on the front surface of the safety helmet and connected to the control unit to photograph an image. COPYRIGHT KIPO 2018 ...

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Номер записи: 10
12-10-2017 дата публикации

ACOUSTIC WAVE DEVICE AND MANUFACTURING METHOD THEREOF

Номер: KR1020170111913A
Автор: PARK, SEUNG WOOK, JEONG, TAE SUNG, PARK, NO IL
Принадлежит:

An acoustic wave device according to an embodiment of the present invention includes a substrate having an acoustic wave generating part and at least one ground pad on one surface, a support part provided on one surface of the substrate so as to be spaced apart from the acoustic wave generating part, a shielding member stacked on the support part and spaced apart from the acoustic wave generating part, and a ground terminal disposed on the ground pad. The ground pad and the shield member may be electrically connected to each other through the ground terminal. The acoustic wave device can be easily manufactured. COPYRIGHT KIPO 2017 ...

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Номер записи: 11
09-01-2017 дата публикации

APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE MODULE

Номер: KR1020170002945A
Автор: PARK, NO IL, PARK, SEUNG WOOK, LEE, EUNG SUEK, JEONG, TAE SUNG
Принадлежит:

An apparatus for manufacturing a semiconductor package module according to an embodiment of the present invention comprises: a lower mold on which a substrate having one or more elements mounted thereon is placed; and an upper mold which is provided on the upside of the substrate in a state of accommodating the substrate; a molding means which is provided in at least one of the upper mold or the lower mold, and supplies a filler to form a molding portion between the substrate and the upper mold; and a pattern forming means which is provided on the inner surface of the upper mold facing the substrate to provide an uneven shape. In addition, a method for manufacturing a semiconductor package module according to another embodiment of the present invention comprises: supplying a filler to a substrate having one or more elements mounted thereon and then hardening the filler to form a molding portion; and forming an uneven shape to raise surface roughness of the outer surface of the molding portion ...

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Номер записи: 12
19-08-2015 дата публикации

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Номер: KR1020150093981A
Автор: LEE, CHANG BAE, PARK, NO IL, PARK, SEUNG WOOK
Принадлежит:

A semiconductor package comprises: a printed circuit board; a first semiconductor device and a second semiconductor device which are a stacked structure mounted on one surface of the printed circuit board, wherein the second semiconductor device is larger than the first semiconductor device; and at least one third device, at least a part of which is disposed in an empty space between the printed circuit board and the second semiconductor device around the first semiconductor device. It is possible to maximize space use efficiency by a simple manufacturing process without deformation of the printed circuit board and without change or improvement of electronic components, and it is possible to minimize the size of the semiconductor package. COPYRIGHT KIPO 2015 ...

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Номер записи: 13
14-02-2018 дата публикации

THIN-FILM CERAMIC CAPACITOR

Номер: KR1020180016228A
Автор: SHIN, HYUN HO, JUNG, WOONG DO, YOON, YOUNG SEOK, YOO, DONG SIK, PARK, NO IL, LIM, SEUNG MO, LEE, IL RO
Принадлежит:

According to an embodiment of the present invention, a thin film ceramic capacitor comprises: a body on which a plurality of dielectric layers and first and second electrode layers are alternately disposed on a substrate; and first and second electrode pads disposed on the outside of the body. A plurality of vias are disposed in the body. A first via among the plurality of vias connects the first electrode layer and the first electrode pad, and penetrates from one side of the body to the first electrode which is the lowest electrode layer adjacent to the substrate. A second via among the plurality of vias connects the second electrode layer and the second electrode pad, and penetrates from one side of the body to the second electrode which is the lowest electrode layer adjacent to the substrate. A separation slit is disposed to expose the substrate through the upper surface of the body. The plurality of first vias and the plurality of second vias are arranged in a mirror-like fashion. COPYRIGHT ...

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Номер записи: 14
07-10-2015 дата публикации

CORDLESS CHARGING APPARATUS AND ELECTRONIC DEVICE HAVING THE SAME

Номер: KR0101558107B1
Автор: 장재혁, 박노일, 정창렬, 김학관
Принадлежит: 삼성전기주식회사

... 본 발명은 무선 충전 장치 및 이를 구비하는 전자 기기에 대한 것으로, 특히 무선 충전용 코일이 케이스와 일체로 형성되는 무선 충전 장치 및 이를 구비하는 전자 기기에 관한 것이다. 이를 위한 본 발명에 따른 무선 충전 장치는, 제품의 외형을 이루며 자성체 분말을 함유하는 수지 재질로 형성된 케이스; 상기 케이스의 외부면에 패턴 형태로 형성되는 코일 패턴; 상기 케이스의 내부면에 형성되어 상기 케이스 내부에 배치되는 배터리와 전기적으로 연결되는 접촉 패드; 및 상기 케이스 내부에 형성되어 상기 접촉 패드와 상기 코일 패턴을 전기적으로 연결하는 비아;를 포함할 수 있다.

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Номер записи: 15
09-05-2018 дата публикации

MULTILAYER THIN FILM CAPACITOR

Номер: KR1020180046825A
Автор: PARK, NO IL, SHIN, HYUN HO, LIM, SEUNG MO, YOO, DONG SIK
Принадлежит:

The present disclosure includes a first laminated body and a second laminated body which are divided up and down through a division layer. The second laminated body is arranged on the lower side of the first laminated body so that the first laminated body configures a top capacitor and the second laminated body configures a bottom capacitor. First to third external terminals are arranged on the upper side of the first laminated body. Accordingly, the present invention can obtain capacitance flexibility while maximizing the capacitance of a capacitor. COPYRIGHT KIPO 2018 ...

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Номер записи: 16
02-11-2018 дата публикации

CAPACITOR AND MANUFACTURING METHOD THEREOF

Номер: KR1020180119364A
Автор: RYOU, JEONG HOON, YOO, DONG SIK, HAN, SEUNG HUN, PARK, NO IL, LIM, SEUNG MO, SHIN, HYUN HO
Принадлежит:

Provided are a capacitor having a structure capable of significantly increasing a capacity of the capacitor, and a manufacturing method thereof. The capacitor according to an embodiment of the present invention comprises: a substrate; and a body including a capacity layer disposed on the substrate. The substrate comprises: a plurality of first trenches embedded from one side of the substrate to the inside of the substrate; and a first capacitor layer disposed on one side of the substrate and in the first trench and including a first dielectric layer and first and second electrodes alternately disposed while interposing the first dielectric layer therebetween. The capacity layer comprises: a plurality of second trenches embedded from one surface of the capacitor layer to the inside of the capacitor layer; and a second capacitor layer disposed on one side of the capacity layer and on the second trench and including a second dielectric layer and third and fourth electrodes alternately disposed ...

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Номер записи: 17
04-04-2017 дата публикации

IMAGE SENSOR MODULE AND MANUFACTURING METHOD THEREOF

Номер: KR1020170037459A
Автор: PARK, SEUNG WOOK, PARK, NO IL, JEONG, TAE SUNG
Принадлежит:

The present invention relates to an image sensor module replacing a spacer with a bonding wire in contrast to an existing image sensor module requiring an extra spacer or an extra process to space a transparent member and an image sensor apart from each other. The image sensor module comprises: a substrate having an electric circuit formed on a surface thereof; a semiconductor chip (image sensor) attached on the substrate; a bonding wire electrically connecting the semiconductor chip and the substrate; a transparent member supported by the bonding wire; and a molding part. A solder ball formed on the other surface of the substrate can be further included in the image sensor module. COPYRIGHT KIPO 2017 ...

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Номер записи: 18
22-02-2017 дата публикации

GLASS PACKAGE AND CAMERA MODULE HAVING SAME

Номер: KR1020170019636A
Автор: PARK, SEUNG WOOK, PARK, NO IL, JEONG, TAE SUNG
Принадлежит:

According to an embodiment of the present invention, a glass package comprises: a glass substrate having a via hole provided thereon, and having an electrode pad connected to the via hole provided on one surface; an image sensor coupled to the other surface of the glass substrate, and electrically connected to the via hole; and a molding unit for sealing the other surface of the glass substrate and the image sensor. COPYRIGHT KIPO 2017 ...

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Номер записи: 19
07-03-2017 дата публикации

ACOUSTIC WAVE DEVICE AND MANUFACTURING METHOD THEREOF

Номер: KR1020170024520A
Автор: PARK, SEUNG WOOK, JEONG, TAE SUNG, PARK, NO IL
Принадлежит:

According to an embodiment of the present invention, an acoustic wave device comprises: a substrate having an acoustic wave generating unit installed on one surface thereof; a support unit installed on one surface of the substrate to be separated from the acoustic wave generating unit; a protection member coupled to the support unit to be separately installed from the acoustic wave generating unit at a predetermined interval; and a sealing unit configured to seal the protection member. COPYRIGHT KIPO 2017 ...

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Номер записи: 20
26-10-2017 дата публикации

그래파이트-전도성 고분자 복합체 및 그 제조 방법

Номер: KR0101790282B1
Автор: 정대원, 이성민, 박노일, 이슬비
Принадлежит: (주)에버켐텍

... 본 발명은 그래파이트를 전도성 고분자 모노머에 분산하여 그래파이트-전도성 고분자 모노머 분산 용액을 제조하는 분산 단계; 상기 전도성 고분자 모노머를 중합하여 그래파이트-전도성 고분자 복합체를 형성하는 중합 단계;를 포함하는 그래파이트-전도성 고분자 복합체 제조방법에 관한 것으로, 저렴한 그래파이트로부터 직접 복합체를 형성할 수 있고, 그래파이트가 포함되어 있어도 수분산성이 우수하고 동시에 전기전도도가 우수한 그래파이트-전도성 고분자 복합체를 제공할 수 있다.

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Номер записи: 21
30-06-2017 дата публикации

METHOD FOR PRODUCING ELECTRONIC DEVICE MODULE

Номер: KR1020170074477A
Автор: LEE, KANG HYUN, LEE SUNG CHUL, LEE, EUNG SUEK, MYUNG, JUN WOO, LEE, KI JU, PARK, NO IL
Принадлежит:

The present invention relates to a method for producing an electronic device module. According to an embodiment of the present invention, the method for producing the electronic device module comprises the following steps: preparing a substrate; installing at least one first electronic device on one side of the substrate; forming a first mold part which covers up the first electronic device; filling a conductive material in a via hole which penetrates the first mold part and a groove part which is formed on a surface of the first mold part by being extended from the via hole so as to form a conductive via and a circuit pattern; installing a second electronic device connected to the circuit pattern; and forming a second mold part covering up the second electronic device. COPYRIGHT KIPO 2017 ...

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Номер записи: 22
09-01-2017 дата публикации

ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING SAME

Номер: KR1020170002830A
Автор: PARK, NO IL, JEONG, TAE SUNG, PARK, SEUNG WOOK
Принадлежит:

The present invention relates to an electronic component module and a method for manufacturing the same, to minimize the entire size while including electronic components. According to an embodiment of the present invention, the electronic component module includes: a substrate; at least one first device embedded in one side of the substrate; a rewire unit formed along one side of the substrate and a border of the first device; and at least one second device embedded in the rewire unit. COPYRIGHT KIPO 2017 ...

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Номер записи: 23
29-10-2018 дата публикации

박막 커패시터

Номер: KR0101912282B1
Автор: 신현호, 정웅도, 윤영석, 유동식, 박노일, 임승모, 이일로
Принадлежит: 삼성전기 주식회사

... 본 발명의 일 실시형태는 기판 상에 복수의 유전체층과 제1 및 제2 전극층이 번갈아 배치된 바디 및 상기 바디의 외측에 배치된 제1 및 제2 전극 패드를 포함하며, 상기 바디 내에는 복수의 비아가 배치되고, 상기 복수의 비아 중 제1 비아는 상기 제1 전극층과 제1 전극 패드를 연결하되, 바디의 일면에서 상기 기판에 인접한 최하층 제1 전극층까지 관통하고, 상기 복수의 비아 중 제2 비아는 상기 제2 전극층과 제2 전극 패드를 연결하되, 바디의 일면에서 상기 기판에 인접한 최하층 제2 전극층까지 관통하며, 상기 바디의 상면에서 관통되어 기판이 노출되도록 분리 슬릿이 배치되며, 상기 복수의 제1 비아 및 복수의 제2 비아는 상기 분리 슬릿을 기준으로 거울상으로 배치된 박막 커패시터를 제공한다.

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Номер записи: 24
02-08-2018 дата публикации

다층 박막 커패시터

Номер: KR0101872613B1
Автор: 박노일, 신현호, 임승모, 유동식
Принадлежит: 삼성전기주식회사

... 본 개시는 분할층을 통해 상하로 분할되는 제1 적층 바디와 제2 적층 바디를 포함하고, 상기 제1 적층 바디의 하측으로 상기 적층 바디를 배치하여, 상기 제1 적층 바디는 Top Capacitor 를 구성하고, 상기 제2 적층 바디는 Bottom Capacitor 를 구성한다. 상기 제1 적층 바디의 상면으로 제1 내지 제3 외부단자가 배치될 수 있다.

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Номер записи: 25
18-01-2017 дата публикации

SEMICONDUCTOR PACKAGE MODULE

Номер: KR1020170006527A
Автор: PARK, NO IL, JEONG, TAE SUNG, PARK, SEUNG WOOK
Принадлежит:

A semiconductor package module according to an embodiment of the present invention includes a substrate on which an electronic component is mounted, and a shield can which includes a roof member provided on the upper side of the electronic component and a wall member provided on the edge part of the roof member, to be mounted on the substrate while receiving the electronic component inside. The substrate includes a combination groove into which the end part of the wall member is inserted, to support both sides of the wall member. Accordingly, the present invention can improve a combination force between the substrate and the shield can. COPYRIGHT KIPO 2017 ...

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Номер записи: 26
08-03-2017 дата публикации

SENSING PACKAGE AND MANUFACTURING METHOD THEREOF

Номер: KR1020170025767A
Автор: PARK, SEUNG WOOK, PARK, NO IL, JEONG, TAE SUNG
Принадлежит:

A sensing package according to an embodiment of the present invention may include a substrate on which an image sensor is mounted, an electronic component mounted on one surface of the substrate, and a transparent member bonded to the other surface of the electronic component. Also, the method of manufacturing a sensing package according to another aspect of the present invention comprises bonding a transparent member onto an electronic component formed on a substrate on which the image sensor is mounted, to cover the image sensor. So, manufacturing processes can be simplified. COPYRIGHT KIPO 2017 ...

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Номер записи: 27
28-03-2016 дата публикации

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Номер: KR1020160033527A
Автор: KIM, SUNG HAN, KIM, EUN SIL, HONG, JIN HO, SHIN, SANG HYUN, LEE, KEUN YONG, PARK, NO IL, LEE, SA YONG, SHIN, MIN HO
Принадлежит:

A printed circuit board and a manufacturing method thereof are disclosed. Provided are the printed circuit board which comprises: a core layer having a curved surface in at least a part of the core layer; an armature inserted inside the core layer to maintain the curved surface of the core layer; and a circuit formed in at least one surface of the core layer, and a manufacturing method thereof. COPYRIGHT KIPO 2016 ...

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Номер записи: 28
21-04-2016 дата публикации

COIL TYPE UNIT FOR WIRELESS POWER TRANSMISSION AND METHOD OF MANUFACTURING COIL TYPE UNIT FOR WIRELESS POWER TRANSMISSION

Номер: KR1020160043293A
Автор: PARK, NO IL, SHIN, MIN HO, KIM, SUNG HAN, HONG, JIN HO, JUNG, DO YOUNG
Принадлежит:

The present invention relates to a coil type unit for wireless power transmission and a method of manufacturing the coil type unit for wireless power transmission. To minimize a thickness to be slim and to improve wireless power transmission efficiency, the coil type unit includes a coil substrate having a coil pattern; and a magnetic layer which is located on the lower surface of the coil substrate and is divided into a first magnetic layer and a second magnetic layer. The second magnetic layer is a sintered material on which at least one magnetic sheet is stacked. The first magnetic layer is interposed between the second magnetic layer and the coil substrate and is made of a sintered material integrated with the second magnetic layer. COPYRIGHT KIPO 2016 ...

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Номер записи: 29
29-03-2016 дата публикации

PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE INCLUDING SAME

Номер: KR1020160034099A
Автор: PARK, NO IL, SHIN, MIN HO, LEE, SA YONG, KIM, EUN SIL
Принадлежит:

Disclosed are a printed circuit board and an electronic component package including the same. The printed circuit board includes: a base substrate which is partitioned into a plurality of units; and a resist which is formed on both sides of the base substrate. A groove is formed along a cutting line among the plurality of units on the resist. The present invention can reduce resist burr. COPYRIGHT KIPO 2016 ...

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Номер записи: 30
07-12-2018 дата публикации

CAPACITOR

Номер: KR1020180130298A
Автор: PARK, NO IL, MOON, BYEONG CHEOL, LEE, IL RO, SHIN, HYUN HO, LIM, SEUNG MO, KANG, IN YOUNG
Принадлежит:

An embodiment of the present invention relates to a capacitor. The capacitor includes: a substrate including a plurality of trenches and including a capacitance portion and a margin portion disposed around the capacitance portion; a dielectric layer disposed to fill one side of the substrate and the trenches; a plurality of first electrode layers disposed on one surface of the dielectric layer, and including a first lead portion extended from the capacitance portion to the margin portion; and a plurality of second electrode layers disposed on one surface of the dielectric layer so as to face the first electrode layers with the dielectric layer interposed therebetween, and including a second lead portion extended from the capacitance portion to the margin portion. The first lead portion of the plurality of first electrode layers and the second lead portion of the plurality of second electrode layers are stacked in a stepped shape inclined from the margin portion toward the capacitance portion ...

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Номер записи: 31
28-12-2018 дата публикации

다층 박막 커패시터

Номер: KR0101933414B1
Автор: 박노일, 강필중, 임승모, 신현호
Принадлежит: 삼성전기 주식회사

... 본 개시는 복수 개의 유전체층과 제1 및 제2 내부전극층을 교대로 적층하는 적층 바디와 그 위에 배치되어 상기 제1 및 제2 내부전극층과 연결되는 제1 및 제2 외부전극을 포함하는 다층 박막 커패시터에 관한 것이다. 상기 다층 박막 커패시터는 제1 외부전극과 연결되는 제1 모서리 비아를 가지는데, 상기 제1 모서리 비아는 상기 적층 바디의 상면의 모서리들 중 적어도 하나의 모서리 상에 배치되고, 상기 다층 박막 커패시터는 제2 외부전극과 연결되는 제2 모서리 비아를 가지는데, 상기 제2 모서리 비아는 상기 적층 바디의 상면의 모서리들 중 적어도 하나의 모서리 상에 배치된다.

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Номер записи: 32