IMAGE SENSOR MODULE AND MANUFACTURING METHOD THEREOF
Image sensor module is proposed invention and Image sensor module of metals and Sn-SB. Core component camera Image sensor module is mounted on an apparatus, transmitting the beyond the general camera, mobile phone, etc. various fields such as thermal [thay[thay] with vehicle utilized in a portable terminal. Image sensor module includes an Image on a substrate sensor configured to mount and general, Image sensor on top of the transparent member (or transparent member cover) formed through a method of joining. Image sensor module is a gate Image sensor bonding process transparent member of the spacer frame (Spacer Frame) or synthetic resin by an optical transparent member and Image sensor mp3. specified space. Also, such as epoxy resin and settled on an transparent member in, resin shape or height may be changed since the position of the transparent member to guide the main shaft require a sophisticated effort. U.S. Patent US6590269 call photoelectric chip package structure of registration (Photosensitive Chip) arranged to, based on the transparent member has a structure such that two chip sample frame layer. If the proposed invention to provide simplification of a production process through Image sensor module for improving structure of Image sensor module and its manufacturing method are disclosed. Also, if a mode for generating a proposed invention other transparent member Image sensor module for improving reliability and consequently providing Image sensor module and method of making same are disclosed. Image sensor module includes an Image sensor module according to the proposed invention conventional transparent member for separating the Image sensor and a separate spacer or maintenance work for a bonding wire both replace the processing requirements. The proposed invention electrical circuit formed on a surface of a substrate, flip chip semiconductor substrate (Image sensor), a bonding wire electrically connected to the semiconductor chip and the substrate, and the transparent member including a bonding wire supported by molding, can be formed on an opposite side of substrate further comprises solder ball. The transparent member is formed of transparent material such as glass, bonding wire (Dispensing) adhesives applied by a bonding wire attached on the substrate. Since a bonding wire connecting the transparent member is supported in a lower portion, the distance between the semiconductor chip and the transparent member shape and height can be controlled by bonding. The upper and lower transparent (or area) form having a different diameter are formed on the base. The step-type cutting (Step Cut) or bevel cutting through transparent member (Bevel Cut) area capable or slope (Bevel) smaller than the diameter of the diameter of the upper photoresist layer is formed on the TFTs in the form of lower. The transparent member is accommodated in the roller structure molding unit Image sensor module capable of rigidly fixed to the transparent member. Also, an infrared cut form a coating layer on the transparent member can be replace serves as the filter. Image sensor module according to the invention proposed the support face is attached to the semiconductor chip, bonding wire through an electric circuit of the substrate side of the chip and the bonding wire attached between the substrate and the semiconductor chip are connected to electrically. The surface of the wire bonding and adhesive applied, are attached to a transparent member on the top of the bonding wire. Controlling the height of 3 mm during bonding wire region is a transparent member of two each other. Lead wire seated on transparent member, molding the molten semiconductor chip, wires and transparent member seals, internal component and organic light emitting substrate. The Image sensor module and method to manufacture the proposed invention provides a transparent member to have additional time and costs can simplify the process. Also, according to the proposed invention are patterned using Image sensor module and method to manufacture the transparent member can be transparent member consequently improve the reliability of the engine height. Figure 1 shows a proposed invention also in accordance with one embodiment Image sensor module (100) side are disclosed. 2a is also proposed invention in accordance with one embodiment Image sensor module (100) to a transparent member (140) exhibit a different example, 2b is also proposed invention in accordance with one embodiment Image sensor module (100) to a transparent member (140) on the molding unit (150) connection exhibiting drawing disclosed. Figure 3 shows a another embodiment of the proposed invention also Image sensor module (300) side are disclosed. 4a to 4g also proposed invention also includes a process for the manufacture of Image sensor module according to one embodiment of a drawing indicating are disclosed. Figure 5 shows a cross-section of Image sensor module according to the proposed invention also applied camera are disclosed. Below, with reference to the attached drawings present proposed invention embodiments detailed as follows. Terms and words to be used herein terms as the TdSS are controlled by a function in embodiments, wherein the meanings of the terms of said scale can be depending on intended or the like. The terms used in the embodiment carry, if a particularly defined herein according to which, in the absence of a specific defined are generally one skilled will be interpreted as a semantic recognition. Figure 1 shows a proposed invention also in accordance with one embodiment Image sensor module (100) side are disclosed. The reference also 1, Image sensor module in accordance with one embodiment proposed invention (100) substrate (110), semiconductor chip (120), bonding wire (130), a transparent member (140) molding part (150) which, solder ball (160) results are. Substrate (Substrate, 110) organized electrical circuit on the surface of which an insulating fan, the electric circuit substrate (110) formed only on one side of or, can be formed double-sided. As an example, substrate (110) formed in the electric circuit (Printed Circuit Board, PCB) printed circuit board can be formed. Semiconductor chip (120) substrate (110) mounted on and attached on one surface of the substrate. Semiconductor chip (120) Image sensor chip, Image sensor (Image Sensor) comprising and microlenses. Semiconductor chip (120) substrate (110) can be mounted is positioned centrally. The semiconductor chip (120) is bonding wire (130) substrate by using (110) electrically connected thereto. Semiconductor chip (120) includes a plurality of bonding wire (130) contact with each other. As an example, Image sensor and lens is semiconductor chip (120) when the central part of the position, Image sensor to not detract from the performance of bonding wire (130) includes a semiconductor chip (120) located on the periphery of semiconductor chip (edge) (120) and the substrate (110) are electrically connected to each other. Also, semiconductor chip (120) a plurality of bonding pads formed (130) is all have a same height are formed on the base. Image sensor module according to the proposed invention (100) without the use of separate the [su[su] pay it stands, or, composition, bonding wire (130) is a transparent member (140) has a lower foam form. Thus, bonding wire (130) includes a transparent member (140) is horizontally bonding wire (130) rests on the semiconductor chip to have to all be the same height (120) in a transfer liquid. The transparent member (140) includes a bonding wire (130) seated on the formed. At this time, the transparent member (140) is ethylene bonding wire (130) secured on. The transparent member (140) lower foam bonding wire (130) by a transparent member (140) and semiconductor chip (120) a space between (Gap) formed on the substrate. I.e., second semiconductor proposed invention (130) serves since spacer is performed together, separate spacer structures can be omitted. During this process the transparent member (140) and semiconductor chip (120) the distance between the bonding wire (130) determined by, bonding wire (130) shape and height through the transparent member (140) and semiconductor chip (120) can adjust the distance between. Also, a transparent member (140) to a contact on the molding, bonding wire (130) via an Image sensor semiconductor chip (120) and a lens plays a role in the transparent member (140) to extract can adjust the distance between the focusing position. Also, a transparent member (140) on one side of one or more infrared blocking material, a transparent member (140) through semiconductor chip (120) can be included in an IR blocking light incident Image sensor. In particular, glass (140) infrared barrier coating on the metal electrode, Image sensor module (100) includes an Image capture device is produced or alternative many Image sensor module (100) when applying an infrared cut filter (IR filter) is attached to the housing that enables omitting the, disposed at one end of cylinder capable of manufacturing process. Molding unit (150) includes a semiconductor chip (120), bonding wire (130) and transparent member (140) seals a sealing substrate. Molding unit (150) of the substrate (110) semiconductor chip (120) with the liquid drops from the semiconductor chip (120), bonding wire (130) and transparent member (140) to the side of the formed, semiconductor chip (120), bonding wire (130) and transparent member (140) an external chamber from and protecting other. Molding unit (150) includes a transparent member (140) is stepped contact with, a transparent member (140) of the binding portion of a transparent member (140) Image sensor module (100) can be strongly binds. As an example, molding unit (150) can be formed through the epoxy molding compound (Epoxy Molding Compound, EMC). Substrate (110) epoxy on transparent member (140) to the side of the laminated and cured molding part (150) and form. But, molding unit (150) is a step for forming a confined within the EMC has the, site including gate compression molds (Side Gate Compression Mold) utilizing various molding method can be applicable. The process formed over a molding unit (150) is outwardly from the Image sensor module (100) or a rail entering the external Image sensor module (100) to protect other. Solder ball (160) substrate (110) O-chlorophenol (semiconductor chip (120) with an opposing surface) in a transfer liquid. A plurality of solder balls (160) substrate (110) is made and not limited to the particular process, the BGA (Ball Grid Array) typically used various processes including package can be used. 2a is also proposed invention in accordance with one embodiment Image sensor module (100) to a transparent member (140) exhibit a different example, 2b is also proposed invention in accordance with one embodiment Image sensor module (100) to a transparent member (140) on the molding unit (150) connection exhibiting drawing disclosed. Also 1, 2a and 2b also reference the also, Image sensor module in accordance with one embodiment proposed invention (100) to a transparent member (140) includes a transparent member has the lower portion having a diameter different (A) (B) are formed on the base. 1 form a first transparent member (141) is stepped cutting (Step Cut) processing through the lower top (A) (B) the stepped are formed on the base. The first transparent member form 2 (142) the second transparent member 1 is a case with steps first form (141) unlike on gentle slantingly formed through bevel cutting (Bevel Cut) form. Image sensor module according to the proposed invention (100) in the transparent member (140) includes a lower cylindrical portion having a diameter different top (A) (B) since, molding unit (150) can be rigidly fixed to the more by. Proposed invention transparent member (140) in the side of the molding operation of the transparent member (140) step of molding unit (150) roller, a transparent member (140) on the molding unit (150) between the causes hard. I.e., a transparent member (140) is accommodated in the anchoring (Anchoring) via a coupling structure by effect, transparent member (140) Image sensor module (100) fixed to each other. In 2a and 2b also also transparent member (140) circular shape of a straight line but, transparent member (140) and not the limited to the shape of the circular. Image sensor module (100) in accordance with the application and structure of transparent member (140) may have the shape of a variety of shapes. I.e., a transparent member (140) when the shape of rectangular, upper (A) is made to have a large surface area and a lower (B) can be different. Image sensor module according to the proposed invention (100) to a transparent member (140) includes a transparent material is formed of a material which, as an example glass (Glass) can be used. The transparent member (140) is Image sensor module (100) according to intended use and use of predetermined refractive index that may, predetermined color can be added. The transparent member (140) is aspect of semiconductor chip (120) into a region including an infrared cut coating layer corresponding various coating or filter layer can be added. Figure 3 shows a another embodiment of the proposed invention also Image sensor module (300) side are disclosed. The reference also 3, Image sensor module (300) another embodiment of the substrate (110), semiconductor chip (120), bonding wire (130), a transparent member (140), molding unit (150) solder ball (160) comprising, portions (170) further comprises. Proposed second chip (130) of the linear member (140) a before attachment, adhesive bonding wire (130) (Dispensing) applied to the substrate. During this process the adhesive is laminated by a bonding wire portion (170) can be formed. Portions (170) depending on the type and amount of adhesive can be the size of the adhesive, the adhesive (170) according to the size of the design process from freely. In Figure 1 bonding wire (130) is applied to adhesive bonding wire (130) is formed thin on the surface of the while, in Figure 3 bonding wire (130) having a predetermined thickness so as to applied adhesive, compared to 1 also has a stronger adhesion. But, portions (170) includes a transparent member (140) lead wire (130) to be attached to the pipes, a transparent member (140) does not directly support at the bottom. Also, by an adhesive and an adhesive part (170) an electric insulating (Electric Insulation) be a material having properties. One embodiment of the proposed invention is also 4a to 4g also is connected to a drawing and methods of manufacturing are disclosed. The reference also 4a to 4g also, electrical circuit substrate (110) on semiconductor chip (120) arranged on the substrate. Semiconductor chip (120) Image sensor, for Image sensors can be microlenses. And a substrate (110) on semiconductor chip (120) when mounting, semiconductor chip (120) substrate (110) can be heat emitted to is positioned centrally. Semiconductor chip (120) substrate (110) mountable on the, 4c also such as semiconductor chip (120) and the substrate (110) wire (130) connected to each other. Semiconductor chip (120) and electrodes of the substrate (110) via a plurality of bonding wire electrode of wire bonding process (130) formed on a semiconductor chip (120) and substrate (110) between circuitry electrically connects the can. Bonding wire (130) includes a transparent member (140) lower supporting substrate. The, transparent member (140) lead wire (130) to the other by a plurality of bonding pads (130) may all be the same height (H) is formed to have. As an example, semiconductor chip (120) to Image sensing affects the performance of bonding wire (130) includes a semiconductor chip (120) located on the periphery of semiconductor chip (side) (120) toward the outside can be formed. Also, bonding wire (130) is a transparent member (140) to accurately support the lower in semiconductor chip (120) both of all four directions around the bonding wire (130) is located can be designed. Bonding wire (130) is power semiconductor chips (120) is formed, such as bonding wire also 4d (130) applying glue to the adhesive portion (170) and form. Portions (170) is according to the amount or the type of adhesive applied near the s402.. Also, portions (170) is also supplied with the 4d such as shown as well as, bonding wire (130) can be applied as a thin layer on the surface of the form. The adhering part (170) includes a transparent member (140) lead wire (130) to be attached to the pipes, a transparent member (140) does not directly support at the bottom. Also, by an adhesive and an adhesive part (170) be a material having electrical insulating properties. Bonding wire (130) is applied to the nozzle is, a transparent member (140) bonding wire (130) are attached to a on top of. Bonding wire (130) seated on a transparent member (140) is applied adhesive (170) bonded by means of a wire (130) is fixed to the, bonding wire (1300 (120) semiconductor chip by means of a predetermined interval (G) formed by spaced-apart. The proposed invention bonding wire (130) through the transparent member (140) via a coupling structure without separate spacer supporting semiconductor chip (120) and the transparent member (140) that it can be specified. Bonding wire (130) connecting the transparent member (140) or between a top, bonding wire (130) through for adjusting height of transparent member (140) and semiconductor chip (120) can adjust the distance between. In particular, the transparent member (140) to a contact on the molding, bonding wire (130) via an Image sensor semiconductor chip (120) and a lens plays a role in the transparent member (140) to extract can adjust the distance between the focusing position. Also, a transparent member (140) can be adding fixed on one side of infrared blocking material coating. The transparent member (140) on one side of one or more infrared blocking material, a transparent member (140) through semiconductor chip (120) can be included in an IR blocking light incident Image sensor. In particular, glass (140) infrared barrier coating on the metal electrode, Image sensor module (100) includes an Image capture device is produced or alternative many Image sensor module (100) when applying an infrared cut filter (IR filter) is attached to the housing that enables omitting the, disposed at one end of cylinder capable of manufacturing process. Next, bonding wire (130) on the top of the transparent member (140) is attached, such as molding process also 4f molding part (150) formed on a semiconductor chip (120), bonding wire (130) and transparent member (140) and organic light emitting substrate. Molding unit (150) includes a semiconductor chip (120) in the periphery of the substrate (110) from the transparent member (140) can be in the form of stacked side up to the top level. Such a molding unit (150) through semiconductor chip (120), bonding wire (130) and transparent member (140) from the top surface of the blocking is also can be, for reducing the effects from the outside can be. Substrate (110) on one side of semiconductor chip (120), bonding wire (130), a transparent member (140) molding part (150) executes the, 4g also such as substrate (110) on an opposite side of solder ball (160) can be formed. Bump (160) Image sensor module is (100) are connected to other electrically either on a circuit module. Figure 5 shows a cross-section of Image sensor module according to the proposed invention also applied camera are disclosed. The reference also 1 and also 5, also 1 or 3 also shown in Image sensor module applied camera apparatus (500) is shown such as 5 also are disclosed. Image sensor module (100) solder ball (160) outside through the substrate (501) electrically connected thereto. External substrate (501) for connecting with another device or additional out thereof can printed circuit. Also, separate substrate is required if there is no, external substrate (501) comprises a housing (502) can be replaced. Housing (502) Image sensor module is (100) enclosing an external physical shock from Image sensor module (100) to protect other. The housing (502) (Electro Magnetic Interference) the EMI shielding material via an Image sensor module (100) to perform the function for shielding the disturbance (Disturbance) can be. Of Figure 5 camera apparatus (500) is Image sensor module (100) and a predetermined interval away filter (503) can be with. As an example, camera apparatus (500) with filter (503) is an infrared cut filter (Infrared Cut provided off Filter) implementation being. But, filter (503) as well as component of the included is the ability may be equipped, Image sensor module (100) to a transparent member (140) applying negative barrier coating can be formed to replace an infrared cut filter. Housing (502) placed on top of lens (504) is Image sensor module (100) from the inflow film covering the oxide layer. Through, light up the inflow path lens (504) via an Image sensor module (100) semiconductor chip (120) Image sensor integrated with each other. Of Figure 5 camera apparatus (500) which in different vapor, as an example, vehicle front and rear camera can be applied. In the field of Image sensor module for vehicle start when truly global scale and progressing to rear camera mounting obligation, traveling away from the existing parking assistance serves to transmit and tms320c6701.. The, Image sensor module for vehicle mass production of high price competitiveness in communicating with the information in the first direction with each other. For example proposed invention detailed preferred embodiment more uniformly but, aforementioned embodiment proposed invention without limit, within the range of technical idea proposed invention must therefore 155.520 in numerous modifications by pivotably. 100: Image sensor module 110: substrate 120: semiconductor chip 130: bonding wire 140: transparent member 150: molding unit 160: solder ball 170: adhesive 300: other embodiments of the Image sensor module 500: camera apparatus 501: external substrate 502: housing 503: filter 504: lens The present invention relates to an image sensor module replacing a spacer with a bonding wire in contrast to an existing image sensor module requiring an extra spacer or an extra process to space a transparent member and an image sensor apart from each other. The image sensor module comprises: a substrate having an electric circuit formed on a surface thereof; a semiconductor chip (image sensor) attached on the substrate; a bonding wire electrically connecting the semiconductor chip and the substrate; a transparent member supported by the bonding wire; and a molding part. A solder ball formed on the other surface of the substrate can be further included in the image sensor module. COPYRIGHT KIPO 2017 Circuit is formed substrate; which is mounted on a semiconductor chip on the substrate; a bonding wire electrically connected with a semiconductor chip substrate; the bonding wire to the top portion supported transparent member; and it is few formed surrounding the sides of the transparent form, extending from the space in an upper part of the transparent member; an Image sensor module. According to Claim 1, such that the transparent member (Dispensing) adhesives applied by the bonding wire attached to Image sensor module. According to Claim 1, the transparent member includes side stepped cutting (Step Cut) step is realized through Image sensor module. According to Claim 1, the transparent member includes side bevel cutting (Bevel Cut) step is realized through Image sensor module. According to Claim 1, less than the diameter of the diameter of the transparent member has lower Image sensor module. According to Claim 1, the distance between the transparent member and the semiconductor chip be adjusted via the bonding wire height of Image sensor module. According to Claim 1, includes a transparent member at the bottom supporting the bonding wire is formed by a space formed between the chip (Gap) Image sensor module. According to Claim 1, contact the surface of the substrate and the transparent to the sides of the molding unit with a semiconductor chip space between the transparent member encapsulates Image sensor module. According to Claim 1, Image sensor module includes a transparent member on one side of an infrared barrier coating layer. According to Claim 1, the bonding wire includes a transparent member attached to an electrically insulating adhesive properties (Electric Insulation) Image sensor module. Attaching a semiconductor chip on one side of substrate; (Bonding Wire) with a semiconductor chip through bonding wire electrically coupling; applying adhesive to the bonding wire; attaching the bonding wire transparent member; the transparent sides of and it is few, encapsulates the bonding wire and the semiconductor chip step; an Image sensor modules. According to Claim 11, the transparent member form stepped cutting (Step Cut) sacrificial dicing processing steps; and a further method for manufacturing Image sensor. According to Claim 11, the transparent member bevel cutting (Bevel Cut) sacrificial form dicing processing steps; and a further method for manufacturing Image sensor. According to Claim 11, the transparent member has less than the diameter of the diameter of the lower Image sensor modules According to Claim 11, the bonding wire on the center of the mounting step, the stacked transparent member forming a space between the semiconductor chip and (Gap) Image sensor modules. According to Claim 11, the semiconductor chip, the bonding wire and includes a transparent member mold step, the transparent substrate to the contact the sides of the semiconductor chip, the bonding wire and includes a transparent member mold images sensor modules. An infrared cut filter, lens and Image sensor module according to Claim 1 comprising camera apparatus.
