Method of chemical-mechanical polishing

A method of chemical-mechanical polishing. A die region and a scribe line region are defined on a wafer. A dummy pattern is formed in the scribe line region. A dielectric layer is formed to cover the dummy pattern and the wafer. The dielectric layer is planarized by chemical-mechanical polishing.

Heat Conducting Structure With Coplanar Heated Portion Manufacturing Method Thereof And Heat Sink Therewith

A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold (20) and a second mold (30) having different concave cambers (211, 211a, 221, 221a), using the first mold (20) to progressively compress the heat pipes (10) and form a camber (112) at an evaporating section (11), using the second mold (30) to compress the camber (112) to form a contact plane (112′) and an attaching plane (113′) perpendicular to each other, coating an adhesive (50) on the contact planes (112′), connecting the contact planes to make the attaching planes co-planar.

HEAT DISSIPATING STRUCTURE OF LED LAMP CUP MADE OF POROUS MATERIAL

A heat dissipating structure of a lightweight lamp cup 10 made of a porous material includes a containing cavity 11 at an end of the lamp cup 10, a lamp holder 30 at another end of the containing cavity 11, a metal hood 60 sheathed with the lamp holder 30 and covered onto an external side of the lamp cup 10, a heat conduction medium 50 between the lamp cup 10 and the metal hood 60, and a light emitting unit 20 contained in the containing cavity 11 of the lamp cup 10, such that the heat produced by the light emitting unit 20 can be conducted form the lamp cup 10 to the metal hood 60 and dissipated from the metal hood 60 to the outside.

Voltage-controlled capacitor circuit and related circuitry with diode and MOS varactors

A voltage-controlled capacitor circuit and related circuitry. The voltage-controlled capacitor circuit includes a metal-oxide semiconductor (MOS) varactor, a diode varactor, and/or a capacitor with fixed capacitance. The MOS varactor, the diode varactor and the capacitor are electrically connected in parallel or in series to form a capacitor with a preferred characteristic of voltage-controlled capacitance.

BACK PANEL MANUFACTURING PROCESS

A method for manufacturing a back panel on a substrate is provided. The substrate has at least a switching device formed therein and a dielectric layer structure formed thereon. An interconnect structure is also formed in the dielectric layer structure. The method of forming the back panel comprises the step of performing an alloying process. After the alloying process, a pixel mirror layer is formed over the substrate. The pixel mirror layer is electrically connected to the switching device through the interconnect structure. A planar passivation layer is formed on the pixel mirror layer. Then, the planar passivation layer is patterned to expose a portion of the pixel mirror layer.

HEAT SINK SYSTEM AND HEAT SINKING METHOD HAVING AUTO SWITCHING FUNCTION

A heat sink system and a heat sinking method having auto switching function are disclosed. The heat sink receives a control command sent by an external device. An internal heat sink device is controlled according to content of the control command to control power ON or power OFF of a thermoelectric cooler of the heat sink device or to control power ON, power OFF, or change rotation speed setting of a heat sink fan in the heat sink device. Thus, the heat sink auto switches operations of the heat sink device correspondingly according to temperature changes of the external device. 1. A heat sink system having auto switching function comprising: a temperature sensing device for detecting temperature of the notebook and reporting detected data;', 'a CPU electrically connected to the temperature sensing device for generating a control command according to the detected data;', 'a transmitting-end USB data transmission wiring electrically connected to the CPU for receiving the control command and external data transmission; and, 'a notebook, comprising a heat sink device;', 'a control unit electrically connected to the heat sink device for receiving the control command for controlling the heat sink device operation according to content of the control command., 'a heat sink connected to the notebook comprising2. The heat sink system having auto switching function of claim 1 , wherein the heat sink further comprises a receiving-end USB data transmission wire electrically connected to the control unit connected to the transmitting-end USB data transmission wiring via a USB transmission cable for transmitting the control command.3. The heat sink system having auto switching function of claim 1 , wherein the heat sink further comprises a Bluetooth transmission interface electrically connected to the control unit claim 1 , the transmitting-end USB data transmission wiring of the notebook is connected to an external Bluetooth transmission module claim 1 , the Bluetooth ...

Method for manufacturing heat dissipator having heat pipes and product of the same

A heat dissipator having heat pipes includes a heat-conducting base, a first heat pipe and a second heat pipe. The heat-conducting base has an accommodating trough. After the first heat pipe is accommodated in the accommodating trough, it is deformed so as to abut against the inner wall face of the accommodating trough. Further, the second heat pipe and the first heat pipe are provided in the same accommodating trough, and the second heat pipe is overlapped vertically on the first heat pipe. As a result, the second heat pipe is deformed so as to abut against the first heat pipe and the interior of the accommodating trough, thereby enhancing the heat-conducting performance of the heat dissipator.

METHOD AND APPARATUS FOR CONTROLLING A USER INTERFACE OF A CONSUMER ELECTRONIC DEVICE

Methods and systems for controlling a user interface of a consumer electronic device. An exemplary embodiment of a method for controlling a user interface of a consumer electronic device, including a plurality of I/O interfaces for communication with a plurality of data sources, is disclosed. The method comprises: utilizing the user interface to display a content list of a first data source present in the consumer electronic device if the first data source is active; and when a second data source is added to the consumer electronic device and then actively selected, utilizing the same user interface to display a content list of the second data source.

Motorcycle structure

The present invention relates to an improved motorcycle structure, comprising a front wheel, a back wheel, an engine, and a frame body; wherein the frame body having a left horizontal frame and a right horizontal frame, each of the horizontal frames having an aslant pipe coupled backward to the horizontal frames; a side wheel unit being set on each of the external side of the front wheel and the back wheel, further comprising a connecting device, a contractible supporting base, and a side wheel; the connecting device is for pivotally connecting the contractible supporting base and the horizontal frame, and using a sliding axle to pass through the components of the horizontal frame, and in the meantime passing through and coupling to a bushing corresponsive to contractible supporting base. The side wheel is pivotally coupled to the external side of the contractible supporting base; the contractible supporting base has at least one contractible rod such that the bottom and the top of the contractible rod are pivotally coupled onto the surface of the contractible supporting base and onto the frame body. Such arrangement mainly makes use of the erection assistance and the contraction functions of the side wheel unit, so that motorcycle riders can drive or make turns on a rough road surface more safely and stably.

APPARATUS, METHOD, AND SYSTEM FOR REPRESENTING A MULTIMEDIA DISPLAY

A system, an apparatus, and a method for representing a multimedia display are proposed in the present invention for displaying multimedia data and a menu. The system comprises an interface from which the user may input signals and the apparatus comprising screens for displaying. Three signals can be inputted from the interface, a first signal, a second signal, and a third signal. The apparatus comprises a first screen for displaying multimedia data, a second screen for displaying menu, and optionally a third screen for displaying information related to the multimedia data. The method comprises the steps of: providing a first screen to display multimedia data; providing a second screen to display a menu; and optionally providing a third screen to display information related to multimedia data.

Method for assembling fins-type heat sink

A method for assembling a fins-type heat sink includes providing a heat sink, a presser and a plurality of caps, the heat sink having a heat pipe and a plurality of fins disposed on the heat pipe, the presser being provided with through-holes allowing the distal ends of the heat pipe to be inserted therein, a periphery of each through-hole being provided with an annular neck, the presser being provided with notches that are arranged circumferentially outside the annular neck; (b) covering the caps on the annular necks of the presser respectively, each caps extending downwards to form protruding flaps penetrating the notches; (c) disposing a plate-like die on the topmost fin of the heat sink; (d) inserting a distal end of the heat pipe through the through-hole of the presser to abut inside the cap, while folding the flaps outwards via the plate-like die.

Integrated heat-dissipating device for portable electronic product

An integrated heat-dissipating device for a portable electronic product includes a heat-conducting base, a heat-dissipating plate, a first heat-dissipating module and a second heat-dissipating module. The heat-dissipating plate is adhered onto the heat-conducting base. The coefficient of heat conductivity of the heat-dissipating plate is larger than that of the heat-conducting base. The first heat-dissipating module includes a first heat pipe. One section of the first heat pipe is connected to the heat-conducting base, and the other section thereof extends in a direction away from the heat-conducting base. The second heat-dissipating module includes a second heat pipe, an adapting block and a third heat pipe. One section of the second heat pipe is connected to the heat-conducting base, and the other section thereof is connected to the adapting block. One section of the third heat pipe is connected to the adapting block, and the other section thereof extends in a direction away from the adapting block. With a multiple-directional heat-dissipating path, a great amount of heat generated by a heat-generating source can be dissipated to the outside quickly.

HEAT PIPE ASSEMBLY AND HEAT DISSIPATION DEVICE HAVING THE SAME

A heat pipe assembly includes a number of heat pipes and a fixing seat. Each of the heat pipes includes an evaporating section and at least a condensing section. A bottom of the evaporating section of each of the heat pipes is flat and has a flat heat absorbing surface. The evaporating sections of each of the heat pipes are parallel to and adjoin with each other, whereby the flat heat absorbing surfaces of the evaporating sections of the heat pipes being coplanar and adjoining with each other. A top surface of the evaporating section of each of the heat pipes has a top edge. The fixing seat has an integral structure and combines with the top edge of the evaporating section of each of the heat pipes, whereby the heat absorbing surfaces of the evaporating sections of the heat pipes are coplanar and adjoin with each other.

LED LAMP TUBE WITH HEAT DISTRIBUTED UNIFORMLY

A LED lamp tube which includes a hollow transparent tube, a LED lamp assembly disposed in the transparent tube, two conductive caps provided on both ends of the transparent tube respectively, and a circuit control unit. The circuit control unit includes a plurality of separated sub-portions. The respective sub-portions of the circuit control unit are distributed uniformly on the circuit board of the LED lamp assembly. Via the uniform arrangement of respective sub-portions of the circuit control unit, the heat within the LED lamp tube can be distributed uniformly, thereby lowering the temperature and facilitating the heat dissipation.

COOLING RACK STRUCTURE OF THERMOELECTRIC COOLING TYPE

A cooling rack structure includes a cooling plate (1), a temperature conductor (2), a centrifugal fan (3), a cooling body (4) and a thermoelectric cooling component (5). A temperature-super-conducting component (13) is disposed on an inner surface (11) of the cooling plate (1). The temperature conductor (2) is arranged on the temperature-super-conducting component (13). In addition, a heat-exhausting hole (120) is arranged on an upper side of the cooling plate (1). The centrifugal fan (3) is disposed between the temperature conductor (2) and the heat-exhausting hole (120) while the cooling body (4) is disposed between the fan (3) and the heat-exhausting hole (120). A hot side face (501) of the thermoelectric cooling component (5) closely contacts the cooling body (4) while a cold side face (500) is arranged on the temperature-super-conducting component (13). By quickly conducting the low temperature generated from the thermoelectric cooling component (5) onto the cooling plate (1) through ...

Method for embedding heat pipe into heat-conducting seat

A method for embedding a heat pipe into a slot of heat-conducting seat is disclosed. The method has the exposed portion of the heat pipe be flat and coplanar with the surface of the heat-conducting seat after the heat pipe is embedded into the slot of the seat. The method utilizes a power press machine with multiple stamping dies to progressively press the heat pipe.

Heat-dissipating fin capable of increasing heat-dissipating area

A heat-dissipating fin capable of increasing heat-dissipating area includes a lower plate and an upper plate. The lower plate is provided with a through-hole. The upper plate extends from the lower plate and is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the fin.

Voltage-controlled capacitor circuit and related circuitry with diode and MOS varactors

A voltage-controlled capacitor circuit and related circuitry. The voltage-controlled capacitor circuit includes a metal-oxide semiconductor (MOS) varactor, a diode varactor, and/or a capacitor with fixed capacitance. The MOS varactor, the diode varactor and the capacitor are electrically connected in parallel or in series to form a capacitor with a preferred characteristic of voltage-controlled capacitance.

Heat conducting structure with coplanar heated portion, manufacturing method thereof, and heat sink therewith

A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold (20) and a second mold (30) having different concave cambers (211, 211a, 221, 221a), using the first mold (20) to progressively compress the heat pipes (10) and form a camber (112) at an evaporating section (11), using the second mold (30) to compress the camber (112) to form a contact plane (112) and an attaching plane (113) perpendicular to each other, coating an adhesive (50) on the contact planes (112), connecting the contact planes to make the attaching planes co-planar.

PROCESS FOR FABRICATING MICRO-DISPLAY

A process for fabricating a micro-display is provided. First, a wafer having a driving circuit thereon is provided. Then, a metallic reflective layer is formed on the wafer. Thereafter, an anti-reflection layer and a patterned photoresist layer are sequentially formed on the metallic reflective layer. Using the patterned photoresist layer as an etching mask, the anti-reflection layer and the metallic reflective layer are etched to form a trench pattern that exposes the surface of the wafer. After that, the patterned photoresist layer is removed. A dielectric layer is formed to cover the anti-reflection layer and fill the trench pattern. Then, a portion of the dielectric layer and the anti-reflection layer are removed to expose the surface of the metallic reflective layer.

HEAT DISSIPATING STRUCTURE OF LED CIRCUIT BOARD AND LED LAMP TUBE COMPRISED THEREOF

A heat dissipating structure of an LED circuit board and a device applied in an LED tube which comprises an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered a coating layer including Nanoparticles and a bonding agent. Accommodating the LED circuit board covering the coating layer in an LED lamp tube to accelerate dissipating the heat of the LED circuit board by the coating layer having the characters of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, for the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board to accelerate dissipating the heat.

Heat sink system and heat sinking method having auto switching function

A heat sink system and a heat sinking method having auto switching function are disclosed. The heat sink receives a control command sent by an external device. An internal heat sink device is controlled according to content of the control command to control power ON or power OFF of a thermoelectric cooler of the heat sink device or to control power ON, power OFF, or change rotation speed setting of a heat sink fan in the heat sink device. Thus, the heat sink auto switches operations of the heat sink device correspondingly according to temperature changes of the external device.

METHOD FOR COMBINING HEAT PIPES WITH A FIXING BASE AND STRUCTURE OF THE SAME

In a method for juxtaposing and combining a plurality of heat pipes with a fixing base, first, a fixing base having an accommodating trough is provided. The accommodating trough is provided therein with at least one recess. Further, a plurality of heat pipes is provided. Adhesive medium is coated on the contacting surface between the heat pipe and the accommodating trough. The plurality of heat pipes is pressed into the accommodating trough. Finally, the heat pipes juxtaposed in the accommodating trough are pressed coplanarly the surface of the fixing base while a portion of the adhesive medium is received in the recess.

Method for manufacturing a heat sink

A method for manufacturing a heat sink includes providing a heat-conducting base with a plurality of open troughs; providing a plurality of heat pipes, each having a heat-absorbing section and a heat-releasing section extending from the heat-absorbing section; the heat-absorbing section being accommodated in one open trough to have the heat pipe engaged with the heat-conducting base; providing a plurality of heat-dissipating fins, each of the heat-dissipating fins having a lower plate and an upper plate extending from the lower plate, the upper plate being folded to form an overlapping portion attached on the lower plate; forming a through-hole in the lower plate and the upper plate at the overlapping portion; and penetrating the through-holes of the heat-dissipating fins by the heat-releasing section of the heat pipe. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the heat sink.

HEAT SINK AND HEAT-DISSIPATING FINS OF THE SAME

A heat sink and heat-dissipating fins have wave-shaped folds. The heat sink includes a plurality of heat-dissipating fins that are radially connected together to form a ring. The inside of the heat-dissipating fins is formed with an accommodating space for allowing a heat-generating element to be disposed therein. The heat-dissipating fin is a metallic piece with its one side bent vertically to form a fold. The fold is bent continuously to form a wave shape. Via the wave-shaped folds, the user can grip the heat-dissipating fins easily. Further, the rigidness and strength of the fold can be increased.

COOLER HAVING GROUND HEATED PLANE FOR COOLING HEATING ELECTRONIC COMPONENT

A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.

LED lamp tube heat dissipating structure

A light emitting diode (LED) lamp tube heat dissipating structure is capable of dissipating heat in a tube quickly to improve the heat dissipating efficiency. A circuit board with a light radiating surface and a heat dissipating surface is contained in the tube, and the light radiating surface of the circuit board is electrically connected to LED lamps. Two conductive bushings are sheathed onto both ends of the tube and electrically connected with the circuit board, and at least one heat dissipating hole is disposed separately on both distal surfaces of the tube that covers the heat dissipating surface of the circuit board, such that external air is entered into the tube from the heat dissipating hole on a distal surface of the tube and dispersed from the heat dissipating hole on another distal surface of the tube for dissipating the heat in the tube.

Circuit capable of automatically calibrating a resonance frequency of antenna and method thereof

The invention discloses a circuit capable of automatically calibrating a resonance frequency of an antenna and method thereof. A circuit capable of automatically calibrating a resonant frequency of an antenna includes the antenna, a switch, a conversion unit, a count comparator, and a capacitor array. The switch is coupled to the antenna for being turned on and turned off according to a pulse. The antenna is used for generating the resonant frequency according to on and off of the switch. The conversion unit is coupled to the antenna for generating a clock according to a signal with the resonant frequency. The count comparator is coupled to the conversion unit for counting a number generated by a reference clock during a period of the clock, and comparing the pulse number with a predetermined value to generate an adjustment signal. The capacitor array is used for adjusting capacitance of the capacitor array according to the adjustment signal.

Method for combining heat pipes with a fixing base

In a method for juxtaposing and combining a plurality of heat pipes with a fixing base, first, a fixing base having an accommodating trough is provided. The accommodating trough is provided therein with at least one recess. Further, a plurality of heat pipes is provided. Adhesive medium is coated on the contacting surface between the heat pipe and the accommodating trough. The plurality of heat pipes is pressed into the accommodating trough. Finally, the heat pipes juxtaposed in the accommodating trough are pressed coplanarly the surface of the fixing base while a portion of the adhesive medium is received in the recess.

INTEGRATED HEAT-DISSIPATING DEVICE FOR PORTABLE ELECTRONIC PRODUCT

An integrated heat-dissipating device for a portable electronic product includes a heat-conducting base, a heat-dissipating plate, a first heat-dissipating module and a second heat-dissipating module. The heat-dissipating plate is adhered onto the heat-conducting base. The coefficient of heat conductivity of the heat-dissipating plate is larger than that of the heat-conducting base. The first heat-dissipating module includes a first heat pipe. One section of the first heat pipe is connected to the heat-conducting base, and the other section thereof extends in a direction away from the heat-conducting base. The second heat-dissipating module includes a second heat pipe, an adapting block and a third heat pipe. One section of the second heat pipe is connected to the heat-conducting base, and the other section thereof is connected to the adapting block. One section of the third heat pipe is connected to the adapting block, and the other section thereof extends in a direction away from the ...

APPARATUS FOR GRINDING HEATED PLANE OF COOLER

A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.

Heat dissipating structure of LED lamp cup made of porous material

A heat dissipating structure of a lightweight lamp cup 10 made of a porous material includes a containing cavity 11 at an end of the lamp cup 10, a lamp holder 30 at another end of the containing cavity 11, a metal hood 60 sheathed with the lamp holder 30 and covered onto an external side of the lamp cup 10, a heat conduction medium 50 between the lamp cup 10 and the metal hood 60, and a light emitting unit 20 contained in the containing cavity 11 of the lamp cup 10, such that the heat produced by the light emitting unit 20 can be conducted form the lamp cup 10 to the metal hood 60 and dissipated from the metal hood 60 to the outside.

LED lighting device capable of uniformly dissipating heat

An LED lighting device with a heat dissipating structure is disclosed. The lighting device includes a lamp base coupled with a top cover to form an accommodating space for accommodating a first heat dissipating module and a second heat dissipating module. The first heat dissipating module includes a first heat-conducting plate, a first heat pipe and a first heat dissipater. An LED lighting module is connected with the first heat-conducting plate, in which an evaporator section of the first heat pipe is disposed thereon. The first heat dissipater is arranged on a condenser section of the first heat pipe, and the second heat dissipating module includes a second heat-conducting plate and a second heat pipe. The second heat-conducting plate paralleling to the first heat-conducting plate is connected with the LED lighting module. An evaporator section of the second heat pipe is disposed on the second heat-conducting plate, and whose condenser section is connected with an inner surface of the ...

Cooler with ground heated plane and grinding method and apparatus thereof

A method for making heated plane of a cooler obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.

MULTI-STAGE FOLDING PORTABLE SOLAR CHARGING APPARATUS

A multi-stage folding portable solar charging apparatus includes first, second and third photoelectric conversion modules. The second photoelectric conversion module is pivotally connected to a side of the first photoelectric conversion module and folded/unfolded with respect to an upper surface of the first photoelectric conversion module, and the third photoelectric conversion module is pivotally connected to another side of the first photoelectric conversion module and can be folded/unfolded with respect to a lower surface of the first photoelectric conversion module, such that the photoelectric conversion modules are electrically connected with each other. A connector is fixed and electrically connected to one of the photoelectric conversion modules. The second and third photoelectric conversion modules are unfolded from the stacked first photoelectric conversion module to increase an electric power generation area of charging apparatus when unfolded to enhance the electric power generation ...

COMBINED ASSEMBLY OF FIXING BASE AND HEAT PIPE

A combined assembly of a fixing base and an angled heat pipe includes a fixing base and heat pipes. The fixing base has a plate body. The bottom surface of the plate body is formed with opening trough. An end of the opening trough is provided with a through hole penetrating through the plate body. The opening trough is formed with an enlarging portion. The width of the enlarging portion is larger than that of a mouth of the opening trough. The heat-releasing end penetrates out of the through hole, and the heat-absorbing end is accommodated in the opening trough. A portion of the heat-absorbing end abuts against the inner wall of the opening trough, while the exposed portion thereof is flush with the bottom surface of the fixing base.

LED lamp with replaceable power supply

An LED lamp with replaceable power supply includes a tubular body, a light module, a power supply, and two power connectors. The light module is disposed within the tubular body. The light module includes a circuit board and a plurality of LEDs. The LEDs are electrically coupled to the circuit board and are disposed on the bottom side of the circuit board. The power supply is replaceably disposed on the light module and is electrically coupled to the circuit board. The two power connectors are respectively coupled to the two ends of the tubular body and are electrically coupled to the power supply.

ADJUSTABLE PROP STAND OF WINDOW CURTAIN

An adjusting structure of adjustable window curtain prop stand includes two prop plates and an adjusting structure arranged between the two prop plates. The adjusting structure further includes a lead screw, two displacing elements, two positioning elements and a plurality of connecting elements. The lead screw has two external threads respectively with different directions of spiral and available for being engaged with the two displacing elements thereon. The two positioning elements are respectively secured to inner side faces of the two prop plates to be located at an upper and a lower positions between the two displacing elements, where each connecting element is separately and actively connected between the two displacing elements and the two displacing elements, such that a linkage mechanism is formed by taking the two displacing elements as a gliding pair.

IMAGE-PROCESSING UNIT

An image-processing unit for an image sensor is provided. The image-processing unit comprises a plurality of photodiodes arranged inside the image sensor. The photodiodes have different sensing area according to its location. Typically, the sensing area of the photodiodes increases from the center toward the periphery. Therefore, the attenuation of sensitivity caused by a larger incident angle away from the central region can be compensated to enhance image quality.

ASSEMBLY STRUCTURE FOR LED LAMP

An assembly structure for a LED lamp includes a cover plate, a LED module, fasteners and a mask. An inner surface of the cover plate is provided with a fixing portion. Both sides of the cover plate are formed with a slot respectively. The LED module has a substrate and a plurality of LED mounted on the substrate. The substrate is provided with an insertion hole. One end of the fastener is detachably connected into the insertion hole of the substrate and the other end thereof is fixed to the fixing portion. The mask is made of transparent materials and has an accommodating space for allowing the LED module to be disposed therein. Both sides of the mask defining the accommodating space are formed with a locking flange for inserting into the slot of the cover plate. With the above arrangement, the operator can assemble or detach the LED lamp quickly.

METHOD FOR MANUFACTURING IMAGE SENSOR DEVICE

The invention is directed to a method for manufacturing an image sensor device. The method comprises steps of forming a photodiode and a transistor on a substrate. A salicide block is formed over a photo-sensing region of the photodiode. An interconnects processes is performed several times to forming a plurality of dielectric layers over the substrate and interconnects between the dielectric layers. A photolithography and etching process is performed to remove the dielectric layers over the photo-sensing region to expose the salicide block over the photo-sensing region.

Method for forming salicide layers

A method for fabricating salicide devices over a substrate is described. The substrate has a gate structure pair in which a first gate structure comprises a first gate and a first stuffed film located on the first gate, and a second gate structure comprises a second gate and a second stuffed film located on the first gate. A first spacer is formed on the sidewall of the first gate structure. A second spacer is formed at the sidewall of the second gate structure. The first and the second stuffed films are removed. The second spacer is etched back so as to form a third spacer lower than the second gate. Salicide layers are formed upon the first and the second gates.

Method of manufacturing a heat conducting structure having a coplanar heated portion

A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold (20) and a second mold (30) having different concave cambers (211, 211a, 221, 221a), using the first mold (20) to progressively compress the heat pipes (10) and form a camber (112) at an evaporating section (11), using the second mold (30) to compress the camber (112) to form a contact plane (112') and an attaching plane (113') perpendicular to each other, coating an adhesive (50) on the contact planes (112'), connecting the contact planes to make the attaching planes co-planar.

Heat sink having heat-dissipating fins of large area and method for manufacturing the same

A heat-dissipating fin of a large area is made of a metallic sheet and has a fin body. An outer edge of one side of the fin body extends to form a sheet-like expanding portion. The expanding portion is bent and overlapped on the fin body to obtain the heat-dissipating fin. A heat sink includes a plurality of heat-dissipating fins and a heat-conducting element, which is formed by means of penetrating the respective heat-dissipating fins with a condensing section of the heat-conducting element.

VAPOR CHAMBER

A vapor chamber includes a plate and a wick structure. The plate is provided therein with a working fluid, and the plate has a heated end and a condensed end. The wick structure comprises a first wick portion adhered to be opposite to the heated end, a second wick portion overlapping on the first wick portion, and a third wick portion adhered on the rest portion of a chamber. The aperture diameter of the first wick portion is larger than that of the second wick portion, or the aperture density of the first wick portion is smaller than that of the second wick portion. Therefore, the amount of working fluid attached to the second wick portion is smaller than of the first wick portion. As a result, after heated, the working fluid attached to the second wick portion will be vaporized more quickly, thereby increasing the efficiency of heat transfer and improving the heat-dissipating effect.

Leveling Method for Embedding Heat Pipe in Heat-Conducting Seat

A leveling method for embedding a heat pipe in a heat-conducting seat includes preparing at least one heat pipe and a heat-conducting seat connected to the heat pipe, providing grooves at the bottom surface of the heat-conducting seat for embedding the heat pipe therein; horizontally arranging the heat pipe into the groove of the heat-conducting seat, pressing inwardly the portion of the heat pipe projecting from the groove into the groove via a first upper mold, forming a concave surface on the contacting surface between the first upper mold and the heat pipe; and pressing the heat pipe via a second upper mold to make the contacting surface between the second upper mold and the heat pipe substantially a leveled surface. In this way, the stress concentration caused by the pressing operation of the heat pipe can be reduced, and thus a more leveled surface to be heated of the heat pipe can be obtained.

Heat sink having auto switching function, heat sink system and heat sinking method for the same

A heat sink having auto switching function, a heat sink system and a heat sinking method are disclosed. The heat sink receives a control command sent by an external device. An internal heat sink device is controlled according to content of the control command to control power ON or power OFF of a thermoelectric cooler of the heat sink device or to control power ON, power OFF, or change rotation speed setting of a heat sink fan in the heat sink device. Thus, the heat sink auto switches operations of the heat sink device correspondingly according to temperature changes of the external device.

METHOD FOR EMBEDDING HEAT PIPE INTO HEAT-CONDUCTING SEAT

A method for embedding a heat pipe into a slot of heat-conducting seat is disclosed. The method has the exposed portion of the heat pipe be flat and coplanar with the surface of the heat-conducting seat after the heat pipe is embedded into the slot of the seat. The method utilizes a power press machine with multiple stamping dies to progressively press the heat pipe.

Vapor chamber

A vapor chamber includes a plate and a wick structure. The plate is provided therein with a working fluid, and the plate has a heated end and a condensed end. The wick structure includes a first wick portion adhered to be opposite to the heated end, a second wick portion overlapping on the first wick portion, and a third wick portion adhered on the rest portion of a chamber. The aperture diameter of the first wick portion is larger than that of the second wick portion, or the aperture density of the first wick portion is smaller than that of the second wick portion. The amount of working fluid attached to the second wick portion is smaller than that of the first wick portion. After heating, the working fluid attached to the second wick portion is vaporized more quickly.

LED road lamp holder structure

A road lamp holder structure includes a lamp guard (1), an LED unit (2) installed at the bottom of the lamp guard (1), and a heat dissipating device (30) installed in lamp guard (1) and having a base (30), a vapor chamber (31) and two heat dissipating elements (32) attached to the LED unit (2). The vapor chamber (31) includes a heated section (310) attached onto the base (30), two heat transmitting sections (311) bent and extended upward from both sides of the heated section (310) respectively, a condensing section (312) bent and extended laterally from each of the two heat transmitting sections (311), two heat dissipating elements (32) having a heated base (30), and heat dissipating fins (321) disposed on the heated base (30). The two heated bases (30) are attached onto external sides of the two heat transmitting sections (311) of the vapor chamber (31) respectively, and the two condensing sections (312) of the vapor chamber (31) are attached to the internal periphery of the top of the ...

Process for fabricating micro-display

A process for fabricating a micro-display is provided. First, a wafer having a driving circuit thereon is provided. Then, a metallic reflective layer is formed on the wafer. Thereafter, an anti-reflection layer and a patterned photoresist layer are sequentially formed on the metallic reflective layer. Using the patterned photoresist layer as an etching mask, the anti-reflection layer and the metallic reflective layer are etched to form a trench pattern that exposes the surface of the wafer. After that, the patterned photoresist layer is removed. A dielectric layer is formed to cover the anti-reflection layer and fill the trench pattern. Then, a portion of the dielectric layer and the anti-reflection layer are removed to expose the surface of the metallic reflective layer.

Cooling rack structure of thermoelectric cooling type

A cooling rack structure includes a cooling plate (1), a temperature conductor (2), a centrifugal fan (3), a cooling body (4) and a thermoelectric cooling component (5). A temperature-super-conducting component (13) is disposed on an inner surface (11) of the cooling plate (1). The temperature conductor (2) is arranged on the temperature-super-conducting component (13). In addition, a heat-exhausting hole (120) is arranged on an upper side of the cooling plate (1). The centrifugal fan (3) is disposed between the temperature conductor (2) and the heat-exhausting hole (120) while the cooling body (4) is disposed between the fan (3) and the heat-exhausting hole (120). A hot side face (501) of the thermoelectric cooling component (5) closely contacts the cooling body (4) while a cold side face (500) is arranged on the temperature-super-conducting component (13). By quickly conducting the low temperature generated from the thermoelectric cooling component (5) onto the cooling plate (1) through ...

Heat-dissipating device for supplying cold airflow

A heat-dissipating device (1) includes a casing (10) and a thermal insulation plate (20) provided within the casing (10). The thermal insulating plate (20) divides the interior of the casing (10) into a first accommodating space (101) and a second accommodating space (102). A hot air outlet (121) and a first air inlet (122) of the casing (10) are in communication with the first accommodating space (101). A cold air outlet (110) and a second air inlet (123) of the casing (10) are in communication with the second accommodating space (102). A thermoelectric cooling chip (30) is disposed in a through-hole (200) of the thermal insulation plate (20) and has a hot-end surface (31) facing the first accommodating space (101) and a cold-end surface (32) facing the second accommodating space (102). A heat-dissipating module (40) is received in the first accommodating space (101). A cold-airflow supplying module (50) is received in the second accommodating space (102). The heat generated by the hot-end ...

Protecting cover and LED lamp tube having the same

A light emitting diode (LED) lamp tube structure includes a tube, a circuit board, a plurality of LED lamps, two electric connectors and a protecting cover. The tube includes a plurality of heat dissipating holes. The circuit board is installed in the tube. The LED lamps are installed on the circuit board and electrically coupled to the circuit board. The two electric connectors are connected to both ends of the tube and electrically coupled to the circuit board. The protecting cover is installed onto the LED lamp tube and includes a board, and through holes disposed on the board and corresponding to the heat dissipating holes. Therefore, the LED lamp tube structure achieves a good heat dissipating effect and enhances the life of the LED lamp tube.

LEVELING METHOD FOR BURYING EVAPORATING SECTION OF HEAT PIPE INTO THERMALLY CONDUCTIVE SEAT

A leveling method for burying an evaporating section of a heat pipe into a thermally conductive seat is provided for an assembly of heat pipe and heat-conducting seat by simultaneously making the evaporating section of heat pipe partially formed into a flat surface when the evaporating section of heat pipe is being burying into the thermally conductive seat. Furthermore, in cooperation with a stamping machine, the leveling method is to make a multiple steps of press-fitting process to an evaporating section of heat pipe under a condition that there is no need to change the stamping die.

Method for connecting heat-dissipating body and heat pipe and structure thereof

A method for connecting a heat-dissipating body and a heat pipe and the structure thereof are used to improve the efficiency of heat conduction. The structure includes a heat-dissipating body and a heat pipe. The central position of the heat-dissipating body is provided with an accommodating trough for accommodating the heat pipe. A plurality of corresponding slots extends outwardly from the periphery of the trough. The other end of the slot is connected to a through hole. Tools are disposed in the slots to widen the slots and thus the periphery of the trough, so that the inner diameter of the trough is larger than the outer diameter of the heat pipe. After the heat pipe penetrates into the trough, the tools are removed, so that the inner wall surface of the trough abuts tightly against the outer circumferential surface of the heat pipe. Thus, the optimal efficiency of heat conduction between the heat pipe and the heat-dissipating body can be achieved.

Charge cabinet and storage device thereof

A storage device includes a base and a plurality of wire management modules. The wire management module includes a partition and a positioning assembly. The partition is disposed to the base and has a supporting surface and a wire management groove. The wire management groove is located at the supporting surface for accommodating a wire. The positioning assembly includes a first positioning member, a second positioning member and an assembling member. The first positioning member is disposed to the partition. The second positioning member is connected to the assembling member. The assembling member is assembled together with the partition. The second positioning member is rotatable around the edge of the second positioning member as a rotation axis in relation to the assembling member to be at either a fastening position or a releasing position. The partitions and the base jointly form a plurality of accommodation spaces.

LED lamp tube with heat distributed uniformly

A LED lamp tube which includes a hollow transparent tube, a LED lamp assembly disposed in the transparent tube, two conductive caps provided on both ends of the transparent tube respectively, and a circuit control unit. The circuit control unit includes a plurality of separated sub-portions. The respective sub-portions of the circuit control unit are distributed uniformly on the circuit board of the LED lamp assembly. Via the uniform arrangement of respective sub-portions of the circuit control unit, the heat within the LED lamp tube can be distributed uniformly, thereby lowering the temperature and facilitating the heat dissipation.

Fixing assembly for heat-absorbing surfaces of juxtaposed heat pipes and heat sink having the same

A heat sink includes a fixing base, a plurality of heat pipes and a fixing body. The bottom surface of the fixing base is provided with a connecting plane and extends upwards to form a fixing arm. The fixing arm is provided with a plurality of first grooves. The fixing body is provided with a plurality of second grooves and combined with the fixing arm. The second grooves correspond to the first grooves for cooperatively receiving and clamping the upper edges of the evaporating sections of the heat pipes. The evaporating section of the heat pipe is provided with a contacting plane and an adhering plane. The contacting planes of the evaporating sections are adjacent to each other and the evaporating sections are fixed to the connecting plane of the fixing base. With this arrangement, the juxtaposed heat pipes can be assembled with the fixing base. Further, the condensing section of the heat pipe penetrates a plurality of fins to form the heat sink.

Apparatus, method, and system for representing a multimedia display

A system, an apparatus, and a method for representing a multimedia display are proposed in the present invention for displaying multimedia data and a menu. The system comprises an interface from which the user may input signals and the apparatus comprising screens for displaying. Three signals can be inputted from the interface, a first signal, a second signal, and a third signal. The apparatus comprises a first screen for displaying multimedia data, a second screen for displaying menu, and optionally a third screen for displaying information related to the multimedia data. The method comprises the steps of: providing a first screen to display multimedia data; providing a second screen to display a menu; and optionally providing a third screen to display information related to multimedia data.

FIXING ASSEMBLY FOR HEAT-ABSORBING SURFACES OF JUXTAPOSED HEAT PIPES AND HEAT SINK HAVING THE SAME

A heat sink includes a fixing base, a plurality of heat pipes and a fixing body. The bottom surface of the fixing base is provided with a connecting plane and extends upwards to form a fixing arm. The fixing arm is provided with a plurality of first grooves. The fixing body is provided with a plurality of second grooves and combined with the fixing arm. The second grooves correspond to the first grooves for cooperatively receiving and clamping the upper edges of the evaporating sections of the heat pipes. The evaporating section of the heat pipe is provided with a contacting plane and an adhering plane. The contacting planes of the evaporating sections are adjacent to each other and the evaporating sections are fixed to the connecting plane of the fixing base. With this arrangement, the juxtaposed heat pipes can be assembled with the fixing base. Further, the condensing section of the heat pipe penetrates a plurality of fins to form the heat sink.

Method for manufacturing heat pipe cooling device

A method for manufacturing a heat pipe cooling device. The heat pipe cooling device includes a U-shaped heat pipe, which is embedded within a heat conductor. The heat conductor includes a rectangular base and an upper cover connected to the base. The base includes many retaining grooves which allow the absorption end of the heat pipe to be disposed therein. The upper cover includes many through holes formed thereon corresponding to the cooling end of the heat pipe. The bottom surface includes many protrusive portions corresponding to the inner side of the absorption end of the heat pipe. Furthermore, the upper cover and the base both include a positioning portion for engaging each other. In this manner, the upper cover is pressed on the cooling end of the heat pipe. The protrusive portion will push the heat pipe to tightly contact with the base. Finally, a planarization process is performed, thereby making the bottom surface of the absorption end and the bottom surface of the heat conductor ...

PIXEL ARRAY STRCUTURE

A pixel array structure is provided. The pixel array structure comprises a plurality of pixel units and a plurality of dielectric walls. Each dielectric wall is disposed between two neighboring pixel units, wherein each pixel unit comprises at least one organic light emitting diode and a complementary metal-oxide-semiconductor (CMOS). The organic light emitting diode comprises a transparent electrode, a bottom electrode, and a light emitting material between the transparent electrode and the bottom electrode. The CMOS is disposed in a substrate. The substrate comprises a top-metal-layer structure located thereon and the top-metal-layer structure comprises an upmost top metal layer. Further, the bottom electrode of the CMOS is the upmost top metal layer of the top-metal-layer structure and the upmost top metal layer is a titanium metal layer.

Thermal structure for electric devices

A thermal module includes a thermal body, at least one thermal tube, and a holding part. The thermal tube includes a heat receiving portion and condenser terminals connecting with the thermal body, wherein the heat receiving portion has a plane. The holding part includes a plate body with trenches therein, wherein the trenches has through holes and a connecting part formed between the through holes. The through holes are used for receiving and holding the heat receiving portion of the thermal tube. The connecting part are connected with a top surface of the heat receiving portion. Thus, thermal transfer is speed up, and the thermal module is assembled without a thermal treatment which causing a copper reduction reaction, resulting in improvement of thermal conduction, reduction of cost, and manufacturing time saving.

Assembly structure for LED lamp

An assembly structure for a LED lamp includes a cover plate, a LED module, fasteners and a mask. An inner surface of the cover plate is provided with a fixing portion. Both sides of the cover plate are formed with a slot respectively. The LED module has a substrate and a plurality of LED mounted on the substrate. The substrate is provided with an insertion hole. One end of the fastener is detachably connected into the insertion hole of the substrate and the other end thereof is fixed to the fixing portion. The mask is made of transparent materials and has an accommodating space for allowing the LED module to be disposed therein. Both sides of the mask defining the accommodating space are formed with a locking flange for inserting into the slot of the cover plate. With the above arrangement, the operator can assemble or detach the LED lamp quickly.

HEAT-DISSIPATING FIN CAPABLE OF INCREASING HEAT-DISSIPATING AREA

A heat-dissipating fin capable of increasing heat-dissipating area includes a lower plate and an upper plate. The lower plate is provided with a through-hole. The upper plate extends from the lower plate and is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the fin. 130. A heat-dissipating fin () capable of increasing heat-dissipating area , comprising;{'b': 31', '33, 'a lower plate () provided with a through-hole (); and'}{'b': 32', '31', '31, 'an upper plate () extending from the lower plate () and bent to be overlapped on the lower plate (), thereby forming a heat-dissipating path (b) therebetween.'}2303331131. The heat-dissipating fin () capable of increasing heat-dissipating area according to claim 1 , wherein the periphery of the through-hole () is formed with an annular wall () extending from the lower plate ().330323333313332132311321. The heat-dissipating fin () capable of increasing heat-dissipating area according to claim 2 , wherein the upper plate () is provided with another through-hole () corresponding to the through-hole () of the lower plate () claim 2 , the periphery of the another through-hole () is formed with an outer annular wall () extending from the upper plate () claim 2 , the inner annular wall () is adhered to the outer annular wall ().43032. The heat-dissipating fin () capable of increasing heat-dissipating area according to claim 2 , wherein a distal end of the upper plate () is warped. This application is a divisional application of U.S. patent application Ser. No. 12/511,195 filed on Jul. 29, 2009.1. Field of the InventionThe present invention relates to a heat-dissipating fin, a heat sink and a method for manufacturing the same, and in particular to a heat-dissipating fin capable of increasing heat-dissipating area, a heat sink having such heat-dissipating ...

PORTABLE SOLAR CELL CHARGING DEVICE

A solar cell charging device includes a base shown as a shell shape, a light-converging lens arranged at a top face of the base, a solar collector correspondingly located under the light-converging lens and a photoelectric converting unit. A plurality of charging troughs arranged on the base are recessed inwardly from circumferential faces thereof. The photoelectric converting unit is connected between each charging trough and the solar collector, converting the light energy absorbed by the solar collector into electric energy provided to be input into each charging trough, after the light-converging lens focuses the solar energy onto the solar collector.

Heat dissipating fin assembly for clamping dynamic random access memory to dissipate heat

An exemplary heat dissipating fin assembly for clamping the DRAM to dissipate heat includes a number of heat dissipating fins arranged in a stacked fashion and a shaft. Each of the heat dissipating fins defines a pivoting hole and a slot therein. The slots of the heat dissipating fins are configured for receiving the DRAM. The shaft goes through the pivoting hole of each of the heat dissipating fins so as to string the heat dissipating fins. The heat dissipating fin assembly can enhance heat dissipating efficiency of the DRAM and reduce cost greatly.

Heat-Dissipating Device For Supplying Cold Airflow

A heat-dissipating device ( 1 ) including a casing ( 10 ), a thermal insulation plate ( 20 ), a thermoelectric cooling chip ( 30 ), a heat-dissipating body ( 40 ), super heat pipes ( 52 ), a cooler ( 53 ), a first fan ( 54 ) and a second fan ( 60 ). The thermal insulation plate ( 20 ) divides the interior of the casing ( 10 ) into a hot air zone (ZH) and a cold air zone (ZC). The thermoelectric cooling chip ( 30 ) is disposed on the thermal insulation plate ( 20 ) with its hot-end surface ( 32 ) facing the hot air zone (ZH). The heat-dissipating body ( 40 ) is disposed in the hot air zone (ZH) to contact the hot-end surface ( 32 ). The super heat pipes ( 52 ) and the cooler ( 53 ) thermally contact a cold-end surface ( 31 ) of the thermoelectric cooling chip ( 30 ). Thus, the cold generated by the cold-end surface ( 31 ) can be rapidly and uniformly conducted to other places to form a cold airflow.

Heat-dissipating device having air-guiding cover

A wind guider of integrated circuit heat dissipation structure includes a first connecting portion, wide-guiding pipes, a second connecting portion and wind-guiding holes. The first connecting portion is connected to heat-dissipating fins. The wide-guiding pipes are integrally connected to the first connecting portion. The second connecting portion is integrally connected to the wide-guiding pipes. A heat-dissipating fan is mounted in the second connecting portion. The second connecting portion is not in parallel to the first connecting portion. The wide-guiding holes run through the first connecting portion, the wide-guiding pipes and the second connecting portion. Since the second connecting portion is not in parallel to the first connecting portion, a cooling airflow generated by the heat-dissipating fan in the second connecting portion can blow to a region corresponding to the heat-dissipating fins. Thus, the cooling airflow blows to the hottest portion of the heat-dissipating fins directly, thereby improving the cooling efficiency and lowering the temperature of the integrated circuit.

Method of flatting evaporating section of heat pipe embedded in heat dissipation device

A method of flatting evaporating section of a heat pipe embedded in a heat dissipation device includes the following steps: (a) providing at least a heat pipe and a base of the heat dissipation device to be thermally connected with the heat pipe, the base defining at least a groove for embedding the heat pipe therein; (b) positioning an evaporating section of the heat pipe on the groove of the base; (c) pressing the evaporating section of the heat pipe to embed the evaporating section into the groove of the base with a partial uneven surface of the evaporating section protruding out of the base; (d) flatting the protruded uneven surface of the evaporating section by polishing.

Motorcycle with front side wheels

A pair of side wheels mounted to the front wheel of a motorcycle includes front base frame, steering unit comprised of linkage and steering rod set being pivoted to the center of the base frame, two side suspensions, and two side wheels; a pair of connection rods of the linkage unit each respectively pivoted to the base of the side wheel unit; a regulator from the suspension unit being connected to where between the base and the base frame, and further to head tube of the frame through an absorber; and the base being pivoted to the side wheel to improve riding safety and stability.

Method For Connecting Heat-Dissipating Body And Heat Pipe And Structure Thereof

A method for connecting a heat-dissipating body and a heat pipe and the structure thereof are used to improve the efficiency of heat conduction. The structure includes a heat-dissipating body and a heat pipe. The central position of the heat-dissipating body is provided with an accommodating trough for accommodating the heat pipe. A plurality of corresponding slots extends outwardly from the periphery of the trough. The other end of the slot is connected to a through hole. Tools are disposed in the slots to widen the slots and thus the periphery of the trough, so that the inner diameter of the trough is larger than the outer diameter of the heat pipe. After the heat pipe penetrates into the trough, the tools are removed, so that the inner wall surface of the trough abuts tightly against the outer circumferential surface of the heat pipe. Thus, the optimal efficiency of heat conduction between the heat pipe and the heat-dissipating body can be achieved.

HEAT-DISSIPATING FINS, LARGE-AREA HEAT SINK HAVING SUCH HEAT-DISSIPATING FINS AND METHOD FOR MANUFACTURING THE SAME

The present invention relates to a heat sink of a large area, in which a heat-dissipating body is further provided in its limited space. The method for manufacturing a fin includes the steps of providing a fin, cutting the fin to form a foldable piece thereon, folding back the foldable piece to be overlapped on the fin and form an accommodating hole, and punching the folded piece and the fin to form two overlapped through-holes. The fin, the heat-dissipating body and heat pipes are assembled together to obtain the heat sink. Since the fins and the heat-dissipating body dissipate the heat of the heat-generating element simultaneously, the heat-dissipating efficiency of the heat sink can be improved.

Thermal structure for electric devices

A thermal module includes a thermal body, at least one thermal tube, and a holding part. The thermal tube includes a heat receiving portion and condenser terminals connecting with the thermal body, wherein the heat receiving portion has a plane. The holding part includes a plate body with trenches therein, wherein the trenches has through holes and a connecting part formed between the through holes. The through holes are used for receiving and holding the heat receiving portion of the thermal tube. The connecting part are connected with a top surface of the heat receiving portion. Thus, thermal transfer is speed up, and the thermal module is assembled without a thermal treatment which causing a copper ruduction reaction, resulting in improvement of thermal conduction, reduction of cost, and manufacturing time saving.

Heat dissipating structure of LED circuit board and LED lamp tube comprised thereof

A heat dissipating structure of an LED circuit board includes an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered by a coating layer including Nanoparticles and a bonding agent. The LED circuit board is covered by the coating layer in an LED lamp tube to accelerate dissipating the heat of the LED circuit board. The coating layer has the characteristics of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board to, thereby accelerating dissipating the heat.

Method of for a Host to Access an Object Stored in a Multimedia Device Supported by MTP

An object table is provided between a file system interface of a host and a multimedia device so that the host is capable of accessing objects stored in the multimedia device regardless of incompatibility between file formats respectively used in the file system and the multimedia device. At least one index of the stored object is stored in the object table. A file accessing architecture is constructed in the object table, where the file accessing architecture has at least one API recognizable for the file system interface. Therefore, the host is capable of accessing the objects stored in the multimedia device though the file system interface and the constructed file accessing architecture.

MANUFACTURING METHOD, FINISHED PRODUCT AND FIXTURE OF COPLANAR EVAPORATORS OF MULTIPLE HEAT PIPES

In a manufacturing method, finished product and fixture of coplanar evaporators of multiple heat pipes, the method is first to provide a plurality of heat pipes, each of which has an evaporator formed a heated face thereon; then, the evaporators are moved closely to one another in a manner, such that their heated faces are disposed onto a flat face; next, the evaporators are limited from multiple directions; afterward, pressing the evaporators toward the flat face makes their heated faces flush therewith; finally, injecting a bonding media into the gaps among the heat faces of the evaporators bonds the heat faces together to form a fixedly coplanar configuration.

LED LAMP TUBE HEAT DISSIPATING STRUCTURE

A light emitting diode (LED) lamp tube heat dissipating structure is capable of dissipating heat in a tube quickly to improve the heat dissipating efficiency. A circuit board with a light radiating surface and a heat dissipating surface is contained in the tube, and the light radiating surface of the circuit board is electrically connected to LED lamps. Two conductive bushings are sheathed onto both ends of the tube and electrically connected with the circuit board, and at least one heat dissipating hole is disposed separately on both distal surfaces of the tube that covers the heat dissipating surface of the circuit board, such that external air is entered into the tube from the heat dissipating hole on a distal surface of the tube and dispersed from the heat dissipating hole on another distal surface of the tube for dissipating the heat in the tube.

Heat sink having heat-dissipating fins capable of increasing heat-dissipating area

A heat sink having heat-dissipating fins capable of increasing heat-dissipating area-includes a heat pipe and the heat-dissipating fins. The heat pipe has a heat-absorbing section and a heat-releasing section. The heat-dissipating fin has a lower plate and an upper plate. The upper plate is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. The lower plate and the upper plate are provided with a through-hole respectively in such a manner that these two through-holes correspond to each other. The heat-releasing section of the heat pipe penetrates the through-holes of the heat-dissipating fins successively. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the heat sink.

METHOD OF FLATTING EVAPORATING SECTION OF HEAT PIPE EMBEDDED IN HEAT DISSIPATION DEVICE AND HEAT DISSIPATION DEVICE WITH HEAT PIPE

A method of flatting evaporating section of a heat pipe embedded in a heat dissipation device includes the following steps: (a) providing at least a heat pipe and a base of the heat dissipation device to be thermally connected with the heat pipe, the base defining at least a groove for embedding the heat pipe therein; (b) positioning an evaporating section of the heat pipe on the groove of the base; (c) pressing the evaporating section of the heat pipe to embed the evaporating section into the groove of the base with a partial uneven surface of the evaporating section protruding out of the base; (d) flatting the protruded uneven surface of the evaporating section by polishing.

Leveling method for burying evaporating section of heat pipe into thermally conductive seat

A leveling method for burying an evaporating section of a heat pipe into a thermally conductive seat is provided for an assembly of heat pipe and heat-conducting seat by simultaneously making the evaporating section of heat pipe partially formed into a flat surface when the evaporating section of heat pipe is being burying into the thermally conductive seat. Furthermore, in cooperation with a stamping machine, the leveling method is to make a multiple steps of press-fitting process to an evaporating section of heat pipe under a condition that there is no need to change the stamping die.

Combined assembly of fixing base and heat pipe

A combined assembly of a fixing base and heat pipes includes a fixing base and at least one heat pipe. The fixing base has a plate body. The bottom surface of the plate body is formed with a transverse opening trough. The opening trough is provided with a through-hole penetrating the plate body. A longitudinal groove is provided in the opening trough at a position corresponding to that of the through-hole. One end of the longitudinal groove does not penetrate the plate body and is formed into a loose-proof section on the bottom section of the opening trough. The heat pipe has a heat-absorbing section and a heat-releasing section. The heat-releasing section penetrates to the outside of the through-hole, and the heat-absorbing section is accommodated in the opening trough. A portion of the heat-absorbing section is inserted into the longitudinal groove and stopped by the loose-proof section, and the other portion thereof is formed with a plane that is in flush with the bottom surface of the ...

SEMICONDUCTOR MANUFACTURING PROCESS AND PACKAGE CARRIER

A package carrier includes a carrier and a light absorption layer. The light absorption layer is disposed on the carrier. The light absorption layer includes a notch at the periphery of the carrier, and the notch is light transmissive so as to expose the carrier to light in a normal direction of the carrier. A semiconductor manufacturing process is also provided. 1. A semiconductor manufacturing process comprising:providing a carrier;coating the carrier with a light absorption layer; andremoving a portion of the light absorption layer at a periphery of the carrier to form a notch in the light absorption layer at the periphery of the carrier, and the light absorption layer remained directly below the notch has at least 10 percent of light transmittance so as to expose the carrier to light in a normal direction of the carrier.2. The semiconductor manufacturing process as claimed in claim 1 , further comprising:providing a semiconductor layer on the light absorption layer.3. The semiconductor manufacturing process as claimed in claim 1 , further comprising:debonding the light absorption layer from the carrier.4. The semiconductor manufacturing process as claimed in claim 1 , wherein in the step of removing the portion of the light absorption layer claim 1 , the portion of the light absorption layer is completely removed in the normal direction to the carrier so as to expose a surface of the carrier.5. The semiconductor manufacturing process as claimed in claim 1 , wherein in the step of removing the portion of the light absorption layer claim 1 , the portion of the light absorption layer is partially removed in the normal direction so that the light absorption layer remained directly below the notch has 10 to 90 percent of light transmittance.6. The semiconductor manufacturing process as claimed in claim 1 , wherein the light absorption layer includes a colorant claim 1 , and the colorant absorbs infrared laser wavelengths.7. A semiconductor manufacturing process ...

PORTABLE SOLAR CHARGING APPARATUS

A portable solar charging apparatus includes a retaining base, a snoot, a photoelectric conversion module, a power connector and a joint mechanism. The snoot is mounted onto the retaining base, and a containing space is formed between the retaining base and the snoot. The photoelectric conversion module is contained in the containing space and mounted onto the retaining base. The photoelectric conversion module includes an accumulator and a solar chip electrically connected to the accumulator. The solar chip is installed corresponding to the snoot. The power connector is connected to the retaining base and electrically coupled to the accumulator. The joint mechanism is connected to the retaining base and disposed outside the containing space. The invention allows a portable electronic product to be charged and used anytime and improves the overall photoelectric conversion efficiency.

HEAT-DISSIPATING FIN ASSEMBLY WITH HEAT-CONDUCTING STRUCTURE

The present invention relates to a heat-dissipating fin capable of increasing surface turbulence, which includes a first heat-dissipating fin and a second heat-dissipating fin. A first surface of the first heat-dissipating fin is provided with a plurality of first protrusions arranged at intervals. The second heat-dissipating fin has a second surface toward the first surface. The second surface is also provided with a plurality of second protrusions arranged at intervals. The second protrusions are arranged to correspond to the first protrusions. The second heat-dissipating fin is overlapped with the first heat-dissipating fin. With the arrangement of the first protrusions and the second protrusions, the heat-dissipating area of the first heat-dissipating fin and the second heat-dissipating fin can be increased so as to increase the surface turbulence. Thus, the heat-exchange efficiency can be enhanced.

FINS-TYPE HEAT SINK AND METHOD FOR ASSEMBLING THE SAME

In a heat sink and a method for assembling the same, the heat sink includes a base, a heat pipe, fins, a presser and caps. The presser is provided with through-holes. The periphery of the through-hole is provided with an annular neck, so that the distal end of the heat pipe can penetrate the through-hole. The periphery of each annular neck is provided with notches on the presser. Each cap covers on the annular neck, and it extends downwards to form protruding flaps. The flap penetrates the notch and is folded outwards to abut the bottom surface of the presser. According to the assembling method, via the presser and the caps, the fins can be assembled with the heat pipe tightly.

HEAT SINK HAVING HEAT-DISSIPATING FINS OF LARGE AREA AND METHOD FOR MANUFACTURING THE SAME

A heat-dissipating fin of a large area is made of a metallic sheet and has a fin body. An outer edge of one side of the fin body extends to form a sheet-like expanding portion. The expanding portion is bent and overlapped on the fin body to obtain the heat-dissipating fin. A heat sink includes a plurality of heat-dissipating fins and a heat-conducting element, which is formed by means of penetrating the respective heat-dissipating fins with a condensing section of the heat-conducting element.

CIRCUIT CAPABLE OF AUTOMATICALLY CALIBRATING A RESONANCE FREQUENCY OF AN ANTENNA AND METHOD THEREOF

A circuit capable of automatically calibrating a resonant frequency of an antenna includes the antenna, a switch, a conversion unit, a count comparator, and a capacitor array. The switch is coupled to the antenna for being turned on and turned off according to a pulse. The antenna is used for generating the resonant frequency according to on and off of the switch. The conversion unit is coupled to the antenna for generating a clock according to a signal with the resonant frequency. The count comparator is coupled to the conversion unit for counting a number generated by a reference clock during a period of the clock, and comparing the pulse number with a predetermined value to generate an adjustment signal. The capacitor array is used for adjusting capacitance of the capacitor array according to the adjustment signal. 1. A circuit capable of automatically calibrating a resonant frequency of an antenna , the circuit comprising:an antenna having a first terminal, and a second terminal for receiving an electric wave transmitted by a reader;a switch having a first terminal coupled to the second terminal of the antenna, a second terminal coupled to ground, and a third terminal for receiving a pulse;a conversion unit having a first terminal coupled to the second terminal of the antenna for receiving a signal with the resonant frequency of the antenna, and a second terminal for outputting a clock, wherein the conversion unit is used for generating the clock according to the signal;a count comparator having a first terminal coupled to the second terminal of the conversion unit, and a second terminal for outputting an adjustment signal, wherein the count comparator is used for counting a number generated by a reference clock during a period of the clock, and comparing the number with a predetermined value to generate the adjustment signal;a capacitor array for adjusting a value of the capacitor array according to the adjustment signal.2. The circuit of claim 1 , wherein the ...

HEAT-DISSIPATING ASSEMBLY OF LED LAMP HOLDER

A LED lamp holder includes a lamp cover and a heat-dissipating device provided in the lamp cover. An accommodating inlet is provided on the lamp cover. A LED unit is provided below the lamp cover. A cover plate covers the accommodating inlet. The heat-dissipating device includes a heat-absorbing plate, a heat-dissipating plate and a heat pipe connected between the heat-absorbing plate and the heat-dissipating plate. The heat-absorbing plate is brought into contact with the LED unit, while the heat-dissipating plate is brought into contact with the cover plate. The cover plate is penetrated by a plurality of screw elements. Each of the screw elements is screwed to the heat-absorbing plate. The length of each screw element exactly makes the heat-absorbing plate to abut and contact the LED unit.

Heat-dissipating device for supplying cold airflow

A heat-dissipating device (1) including a casing (10), a thermal insulation plate (20), a thermoelectric cooling chip (30), a heat-dissipating body (40), super heat pipes (52), a cooler (53), a first fan (54) and a second fan (60). The thermal insulation plate (20) divides the interior of the casing (10) into a hot air zone (ZH) and a cold air zone (ZC). The thermoelectric cooling chip (30) is disposed on the thermal insulation plate (20) with its hot-end surface (32) facing the hot air zone (ZH). The heat-dissipating body (40) is disposed in the hot air zone (ZH) to contact the hot-end surface (32). The super heat pipes (52) and the cooler (53) thermally contact a cold-end surface (31) of the thermoelectric cooling chip (30). Thus, the cold generated by the cold-end surface (31) can be rapidly and uniformly conducted to other places to form a cold airflow.

Method for manufacturing heat pipe cooling device

A method for manufacturing a heat pipe cooling device. The heat pipe cooling device includes a U-shaped heat pipe, which is embedded within a heat conductor. The heat conductor includes a rectangular base and an upper cover connected to the base. The base includes many retaining grooves which allow the absorption end of the heat pipe to be disposed therein. The upper cover includes many through holes formed thereon corresponding to the cooling end of the heat pipe. The bottom surface includes many protrusive portions corresponding to the inner side of the absorption end of the heat pipe. Furthermore, the upper cover and the base both include a positioning portion for engaging each other. In this manner, the upper cover is pressed on the cooling end of the heat pipe. The protrusive portion will push the heat pipe to tightly contact with the base. Finally, a planarization process is performed, thereby making the bottom surface of the absorption end and the bottom surface of the heat conductor ...

METHOD FOR CONTROLLING HOST FROM DEVICE COUPLED THERETO USING UNIVERSAL SERIAL BUS AND SYSTEM THEREOF

A universal serial bus (USB) system includes a host comprising a pattern detector for detecting a predetermined pattern in a USB packet; and an external device being coupled to the host using a USB. When the pattern detector detects the predetermined pattern, the external device is operative to control the host by issuing a USB response packet comprising an external device command from the external device to the host in response to a USB command packet issued from the host.

PROCESS AND ASSEMBLY FOR FLUSH CONNECTING EVAPORATOR SECTIONS OF JUXTAPOSED HEAT PIPES TO A FIXING BASE

A process for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base and forming a plane includes the steps of: providing a fixing base with its bottom surface having an accommodating trough; providing at least two heat pipes each having an evaporator section and a condenser section; disposing the evaporator sections of the heat pipes in the accommodating trough; and machining the evaporator sections of the juxtaposed heat pipes, thereby forming a plane on the evaporator sections of the heat pipe. Via the above process, the evaporator sections of the heat pipes can be juxtaposed in and flush connected to the fixing base, thereby increasing the contact area between the evaporator sections of the heat pipes and a heat-generating element. It further provides an assembly for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base and forming a plane.

Heat pipe cooling device and method for manufacturing the same

A heat pipe cooling device includes a heat conductor base, heat pipes and a cooling body. The heat conductor base further includes a base with multiple trenches and an upper cover. The heat pipes include a heat reception end and a cooling end. When the heat reception end of the heat pipes is contained in the trenches of the base, the bottom portion of the heat reception end tightly contacts the trenches. The upper cover includes multiple through holes and compressive portions formed between each pair of the through holes. The upper cover and the base are then tightly combined. The cooling end of the heat pipe penetrates the through hole. The compressive portion between the through holes is securely affixed above the heat reception end of the heat pipes. A cooling body is connected to the cooling end of the heat pipe, thereby forming the heat pipe cooling device.

HEAT SINK HAVING AUTO SWITCHING FUNCTION, HEAT SINK SYSTEM AND HEAT SINKING METHOD FOR THE SAME

A heat sink having auto switching function, a heat sink system and a heat sinking method are disclosed. The heat sink receives a control command sent by an external device. An internal heat sink device is controlled according to content of the control command to control power ON or power OFF of a thermoelectric cooler of the heat sink device or to control power ON, power OFF, or change rotation speed setting of a heat sink fan in the heat sink device. Thus, the heat sink auto switches operations of the heat sink device correspondingly according to temperature changes of the external device.

WIRELESS HEAT SINK, WIRELESS HEAT SINK SYSTEM AND WIRELESS HEAT SINKING METHOD FOR THE SAME

A wireless heat sink, a wireless heat sink system and a wireless heat sinking method are disclosed. The wireless heat sink receives a control command sent by an external device. An internal heat sink device is controlled according to content of the control command to control power ON or power OFF of a thermoelectric cooler of the heat sink device or to control power ON, power OFF, or change rotation speed setting of a heat sink fan in the heat sink device. Thus, the heat sink auto switches operations of the heat sink device correspondingly according to temperature changes of the external device.

Method for manufacturing large-area heat sink having heat-dissipating fins

The present invention relates to a heat sink of a large area, in which a heat-dissipating body is further provided in its limited space. The method for manufacturing a fin includes the steps of providing a fin, cutting the fin to form a foldable piece thereon, folding back the foldable piece to be overlapped on the fin and form an accommodating hole, and punching the folded piece and the fin to form two overlapped through-holes. The fin, the heat-dissipating body and heat pipes are assembled together to obtain the heat sink. Since the fins and the heat-dissipating body dissipate the heat of the heat-generating element simultaneously, the heat-dissipating efficiency of the heat sink can be improved.

IMAGE SENSOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

The invention is directed to a method for manufacturing an image sensor device. The method comprises steps of forming a photodiode and a transistor on a substrate. A salicide block is formed over a photo-sensing region of the photodiode. An interconnects processes is performed several times to forming a plurality of dielectric layers over the substrate and interconnects between the dielectric layers. A photolithography and etching process is performed to remove the dielectric layers over the photo-sensing region to expose the salicide block over the photo-sensing region.

HEAT-DISSIPATING DEVICE HAVING AIR-GUIDING COVER

A heat-dissipating device having an air-guiding cover includes a heat-dissipating body, an air-guiding cover, a plurality of heat pipes, a fixing base and a fan. The heat-dissipating body is constituted of a plurality of heat-dissipating pieces that are stacked up at intervals. On the heat-dissipating body, venting channels and a plurality of through holes are provided. The air-guiding cover includes a hollow cylinder and an air-guiding blade. The hollow cylinder covers the heat-dissipating body. The air-guiding blade is accommodated in the venting channel. Each of the plurality of heat pipes includes a section to be heated and a heat-releasing section extending from the section to be heated. The heat-releasing section penetrates into the through hole. The bottom of the fixing base is provided with a plurality of grooves for accommodating the sections to be heated of the heat pipes. The fan is provided above the air-guiding cover. Via the above arrangement, the air-guiding cover guides ...

Manufacturing method for semiconductor structure, and pixel structure and manufacturing method for the same

A manufacturing method for a semiconductor structure, and a pixel structure and a manufacturing method for the same are provided. The manufacturing method for the semiconductor structure includes following steps. A substrate is provided. A first conductive layer is formed and patterned by using a first mask patterned. A first material film, including a first semiconductor layer, is formed and patterned by using a second mask. A second conductive layer is formed and patterned by using a third mask. A second material film, including a first dielectric layer, a second semiconductor layer and a second dielectric layer, is formed and patterned with using a fourth mask. The second dielectric layer is pattern by using a fifth mask. A third material film, including a third conductive layer, is formed and patterned by using a sixth mask.

Foldable cover

A foldable cover for protecting or supporting a portable electronic device is provided. The foldable cover comprises a supporting unit and a fixing unit. The supporting unit comprises a plurality of first separations, a convergent part and a plurality of first slab-shaped parts. Each first separation is connected to the convergent part. The fixing unit is connected to the supporting unit to fix the portable electronic device. When the first slab-shaped parts are located at the same surface, the supporting unit covers the portable electronic device. When a three dimensional structure is formed by the first separations, the convergent part and the first slab-shaped parts, the supporting unit supports the portable electronic device.

Heat Dissipating Structure Of LED Circuit Board And LED Lamp Tube Comprised Thereof

A heat dissipating structure of an LED circuit board includes an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered by a coating layer including Nanoparticles and a bonding agent. The coating layer has the characteristics of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board. The LED circuit board covered by the coating layer is placed in an LED lamp tube to provide good heat dissipation effect. 1. A heat dissipating structure of an LED circuit board , comprising:an LED circuit board having a light radiating surface and a heat dissipating surface opposite to the light radiating surface, a plurality of soldering points being formed on the heat dissipating surface; anda coating layer coating on the heat dissipating surface to cover and contact with the soldering points of the LED circuit board, wherein the coating layer is composed of Nanoparticles and a bonding agent, and is exposed to the environment.2. The heat dissipating structure of an LED circuit board according to claim 1 , wherein the Nanoparticles are heat radiative Nanoparticles claim 1 , which comprise either one of clay claim 1 , Nano-SiO claim 1 , and far infrared ceramic particles or their combinations.3. The heat dissipating structure of an LED circuit board according to claim 1 , wherein the coating layer comprises 70%˜80% weight of Nanoparticles claim 1 , 10%˜20% weight of the bonding agent and further comprising 10%˜15% weight of solvent.4. The heat dissipating structure of an LED circuit board according to claim 2 , wherein the thickness of coating layer is 10 micron to 30 micron.5. The heat dissipating structure of an LED circuit board according to claim 1 , wherein the Nanoparticles are Boron Nitride particles.6. The heat dissipating structure ...

HEAT CONDUCTING STRUCTURE WITH COPLANAR HEATED PORTION, MANUFACTURING METHOD THEREOF, AND HEAT SINK THEREWITH

A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold () and a second mold () having different concave cambers (), using the first mold () to progressively compress the heat pipes () and form a camber () at an evaporating section (), using the second mold () to compress the camber () to form a contact plane () and an attaching plane () perpendicular to each other, coating an adhesive () on the contact planes (), connecting the contact planes to make the attaching planes co-planar. 1105010111121111311210112501121141011310. A heat conducting structure with a coplanar heated portion , comprising a plurality of heat pipes () and an adhesive () , and each heat pipe () having an evaporating section () , a contact plane (′) formed at the evaporating section () , and an attaching plane (′) disposed adjacent to the contact plane (′) , and the heat pipes () being arranged in a row through the contact plane (′) , and the adhesive () being coated onto and combined with the contact planes (′ , ′) of any two adjacent heat pipes () , and a coplanar heated portion formed at each attaching plane (′) of the heat pipes ().2111011114113114. The heat conducting structure with a coplanar heated portion as recited in claim 1 , wherein the evaporating section () of the heat pipe () has a substantially rectangular cross-section claim 1 , and the evaporating section () forms another contact plane (′) and another attaching plane (′) adjacent to the another contact plane (′).31110. The heat conducting structure with a coplanar heated portion as recited in claim 1 , wherein the evaporating section () of the heat pipe () has a cross-section substantially in the shape of D.4101212. “The heat conducting structure with a coplanar portion as recited in claim 1 , wherein each heat pipe () further comprises a condensing section () ...

Heat sink having heat-dissipating fins capable of increasing heat-dissipating area

A heat sink having heat-dissipating fins capable of increasing heat-dissipating area-includes a heat pipe and the heat-dissipating fins. The heat pipe has a heat-absorbing section and a heat-releasing section. The heat-dissipating fin has a lower plate and an upper plate. The upper plate is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. The lower plate and the upper plate are provided with a through-hole respectively in such a manner that these two through-holes correspond to each other. The heat-releasing section of the heat pipe penetrates the through-holes of the heat-dissipating fins successively. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the heat sink.

Heat-dissipating fins

The present invention relates to a heat sink of a large area, in which a heat-dissipating body is further provided in its limited space. The method for manufacturing a fin includes the steps of providing a fin, cutting the fin to form a foldable piece thereon, folding back the foldable piece to be overlapped on the fin and form an accommodating hole, and punching the folded piece and the fin to form two overlapped through-holes. The fin, the heat-dissipating body and heat pipes are assembled together to obtain the heat sink. Since the fins and the heat-dissipating body dissipate the heat of a heat-generating element simultaneously, the heat-dissipating efficiency of the heat sink can be improved.

HEAT SINK OF A LARGE AREA

The present invention relates to a heat sink of a large area, in which a heat-dissipating body is further provided in its limited space. The method for manufacturing a fin includes the steps of providing a fin, cutting the fin to form a foldable piece thereon, folding back the foldable piece to be overlapped on the fin and form an accommodating hole, and punching the folded piece and the fin to form two overlapped through-holes. The fin, the heat-dissipating body and heat pipes are assembled together to obtain the heat sink. Since the fins and the heat-dissipating body dissipate the heat of a heat-generating element simultaneously, the heat-dissipating efficiency of the heat sink can be improved. 1. A heat sink of a large area , comprising;a heat pipe; anda plurality of fins parallel to each other and arranged at intervals, the heat pipe penetrating the fins, the fin being provided with a foldable piece, the foldable piece being folded back to be overlapped on the fin, thereby forming an accommodating hole on the fin, the folded piece and the fin being provided with two overlapped through-holes, the heat pipe penetrating the two through-holes of the fin.2. The heat sink of a large area according to claim 1 , wherein a hollow airflow channel is formed between the folded piece and the fin.3. The heat sink of a large area according to claim 1 , wherein the peripheries of the two through-holes are provided with two overlapped flanges.4. The heat sink of a large area according to claim 1 , further comprising a heat-conducting base claim 1 , wherein the heat pipe is inserted into the heat-conducting base.5. The heat sink of a large area according to claim 1 , wherein a hollow airflow channel is formed between the folded piece and the fin.6. The heat sink of a large area according to claim 1 , wherein peripheries of the two through-holes are provided with two overlapped flanges. This application is a divisional application of U.S. patent application Ser. No. 12/511,184 ...

DOCKING STATION AND ELECTRONIC APPARATUS USING THE SAME

A docking station and an electronic apparatus using the same are provided. The electronic apparatus includes a portable computer and a docking station. The docking station includes a body, a base and a connecter, and the portable computer is detachably connected to the docking station. The base is movably connected to the body. The connecter disposed on the base is movable with the base relative to the body. The body is electrically connected to the portable computer via the connecter, and thus the portable computer can move relative to the docking station. 1. A docking station for a portable computer to be detachably connected to , wherein the portable computer includes a display panel , the docking station comprising:a body; a first element having a hinge, wherein the hinge is connected to the body for the base to be rotated, and for the portable computer rotating relative to the docking station to be an open state or a close state; and', 'a second element movably connected to the first element; and, 'a base, movably connected to the body, comprisinga connector disposed at the second element to move with the base relative to the body, wherein the body is electrically connected to the portable computer via the connector, the portable computer rotates relative to the body via the first element and slides relative to the body via the second element.2. The docking station according to claim 1 , wherein the portable computer is connected to the second element along a direction parallel to the display panel.3. The docking station according to claim 1 , wherein the base further includes a fixing part claim 1 , and the fixing part holds the portable computer along a direction parallel to the display panel.4. The docking station according to claim 3 , wherein the fixing part is a pair of concave portions movably disposed at two opposite sides of the connector claim 3 , and the concave portions approach to each other to hold the portable computer.5. The docking station ...

DOCKING STATION AND ELECTRONIC APPARATUS USING THE SAME

A docking station and an electronic apparatus using the same are provided. The electronic apparatus includes a portable computer and a docking station. The docking station includes a body, a base and a connecter, and the portable computer is detachably connected to the docking station. The base is movably connected to the body. The connecter disposed on the base is movable with the base relative to the body. The body is electrically connected to the portable computer via the connecter, and thus the portable computer can move relative to the docking station. 1. A docking station for a portable computer to be detachably connected to , wherein the portable computer includes a display panel , the docking station comprising:a body; a third element having a hinge, wherein the hinge is connected to the body for the base to be rotated, and for the portable computer rotating relative to the docking station to be an open state or a close state; and', 'a fourth element pivotally connected to a distal end of the third element; and, 'a base, movably connected to the body, comprisinga connector disposed at the fourth element to move with the base relative to the body, wherein the body is electrically connected to the portable computer via the connector, the portable computer rotates relative to the body via the third element and rotates relative to the third element via the fourth element.2. The docking station according to claim 1 , wherein the portable computer is connected to the fourth element along a direction vertical to the display panel.3. The docking station according to claim 1 , wherein the portable computer is a tablet computer claim 1 , and the docking station further comprises a physical input module disposed at the body.4. An electronic apparatus claim 1 , comprising:a portable computer including a display panel; anda docking station detachably connected to the portable computer, wherein the docking station includes:a body; a third element including a hinge, ...

LINEAR ACTUATOR

A linear actuator includes a motor, a movable unit, and a stroke control unit. The motor includes a spindle. The movable unit includes a worm gear and a rotary shaft. The worm is provided with annular spiral or helix teeth. The stroke control unit includes at least one transmission member and at least one micro switch. The at least one transmission member is engaged with and driven by the spiral or the helix teeth of the movable unit for synchronical rotation to activating or deactivating the micro switch. In this way, the linear actuator is simplified in structure and reduced in volume. 1. A linear actuator comprising a motor , a movable unit , and a stroke control unit , the motor having a spindle , the movable unit having a worm gear and a rotary shaft , the stroke control unit having at least one transmission member and at least one micro switch , the linear actuator being characterized in that:the worm gear having annular teeth for engagement with the stroke control unit, the transmission member being driven by the annular teeth to operate the micro switch for activation or deactivation of the motor.2. The linear actuator as defined in claim 1 , wherein the transmission member comprises a cylindrical body claim 1 , at least one convexity formed on a periphery thereof and corresponding to the micro switch in number claim 1 , and an annular teeth portion formed on an end of the cylindrical body for engagement with the annular teeth of the worm gear.3. The linear actuator as defined in claim 1 , wherein the annular teeth of the worm gear are spiral teeth.4. The linear actuator as defined in claim 2 , wherein the annular teeth of the worm gear are spiral teeth.5. The linear actuator as defined in claim 1 , wherein the annular teeth of the worm gear are helix teeth.6. The linear actuator as defined in claim 2 , wherein the annular teeth of the worm gear are helix teeth.7. The linear actuator as defined in claim 1 , wherein the annular teeth are located on the worm ...

ELECTRONIC DEVICE

An electronic device having a calculation function and suitable for being detachably connected to a portable electronic device having a calculation function is provided. The electronic device includes a body, a connecting base and a supporter. The body has a first surface. The connecting base is disposed at the body and has a containing cavity. The portable electronic device is suitable for being disposed in the containing cavity to be electronically connected to the electronic device. A back surface of the portable electronic device leans against the first surface. The supporter is connected to the body and supports the body, and an angle is formed therebetween. 1. An electronic device having a calculation function and detachably connected to a portable electronic device having the calculation function , the electronic device comprising:a body having a first surface;a connecting base disposed at the body and including a containing cavity, wherein the portable electronic device is capable of being disposed in the containing cavity to be electrically connected to the electronic device, and a back surface of the portable electronic device leans against the first surface; anda supporter disposed at the body and supporting the body, wherein an angle is formed between the supporter and the body.2. The electronic device according to claim 1 , wherein the electronic device further includes a first magnetic element disposed in the body claim 1 , the portable electronic device further includes a second magnetic element disposed at the back surface claim 1 , and a magnetic force of attraction is generated between the first magnetic element and the second magnetic element to fix the portable electronic device to the body.3. The electronic device according to claim 1 , wherein the connecting base further includes a positioning post disposed in the containing cavity claim 1 , the portable electronic device further includes a fixing hole corresponding to the positioning post ...

Heat pipe assembly and heat dissipation device having the same

A heat pipe assembly includes a number of heat pipes and a fixing seat. Each of the heat pipes includes an evaporating section and at least a condensing section. A bottom of the evaporating section of each of the heat pipes is flat and has a flat heat absorbing surface. The evaporating sections of each of the heat pipes are parallel to and adjoin with each other, whereby the flat heat absorbing surfaces of the evaporating sections of the heat pipes being coplanar and adjoining with each other. A top surface of the evaporating section of each of the heat pipes has a top edge. The fixing seat, as a molded one-piece member, combines with the top edge of the evaporating section of each of the heat pipes, whereby the heat absorbing surfaces of the evaporating sections of the heat pipes are coplanar and adjoin with each other.

BIDIRECTIONAL HEAT DISSIPATION STRUCTURE

A bidirectional heat dissipation structure includes a base, a plurality of heat pipes and a heat sink having a plurality of cooling fins. The cooling fins are installed with an interval apart on the heat pipes and stacked onto the base, and each cooling fin includes at least one guide slat. When assembled, a horizontal diversion channel is formed between the cooling fins, and the guide slats form a downward diversion channel. When used, a portion of the wind current dissipates the heat of the heat sink through the horizontal diversion channel, and the other portion of the wind current blows downwardly through the downward diversion channel to dissipate the heat around the electronic device directly, so as to enhance the heat dissipation efficiency significantly. 1. A bidirectional heat dissipation structure , installed onto an electronic device , and having a wind source disposed on a side of the bidirectional heat dissipation structure , comprising:a base, disposed on the electronic device;a plurality of heat pipes, extended in a direction from the base; anda heat sink, having a plurality of cooling fins, each cooling fin sequentially passing through the heat pipes, and the cooling fins being stacked with each other above the base, and the cooling fin having a plurality of through holes for passing the heat pipes, and the cooling fin having at least one guide slat;thereby a horizontal diversion channel is formed between the cooling fins when the bidirectional heat dissipation structure is assembled, and the guide slats form a downward diversion channel between the cooling fins; and the wind source supplies wind from a lateral side, and a portion of wind current dissipates heat through the horizontal diversion channel, and the other portion of the wind current blows downwardly to dissipate heat of the electronic device through the downward diversion channel.2. The bidirectional heat dissipation structure of claim 1 , wherein the base includes a plurality of grooves ...

ACTIVE HEAT DISSIPATING LIGHT EMITTING DIODE ILLUMINATION LAMP

An active heat dissipating LED illumination lamp includes a substrate holder, at least one LED illumination assembly, a plurality of heat pipes and a heat sink module. The LED illumination assembly is installed on a side of the substrate holder, and the heat pipes and the heat sink module are installed on the other side of the substrate holder, and a plurality of first diversion channels is formed between the heat pipes, and each heat dissipating fin has at least one ventilation hole occupying 12%˜60% of the total area to form a second diversion channel, and a second interval is defined between the bottom of the heat sink module and the substrate holder. When the heat generated by the LED illumination assembly is provided for performing heat conduction, the heat is guided actively to the second diversion channel to perform heat convection. 1. An active heat dissipating LED illumination lamp , capable of providing an application of a high power illumination of 70 W˜260 W , comprising:a substrate holder, having an installation surface;at least one Light emitting diode illumination assembly, installed on the installation surface, and provided for conducting the heat of the Light emitting diode illumination assembly to the substrate holder;a plurality of heat pipes, extended in a direction opposite to the installation surface and installed on the substrate holder; anda heat sink module, having a plurality of heat dissipating fins separated from on another with a first interval and disposed on the heat pipes and stacked from bottom up on the top of the substrate holder to form a plurality of first diversion channels, and each of the heat dissipating fins having at least one ventilation hole, and each ventilation hole having an area equal to 12%˜60% of the area of each heat dissipating fin to form a second diversion channel arranged from the bottom up, so that heat generated by the Light emitting diode illumination assembly is conducted to the substrate holder and the ...

IDENTIFICATION AND CLASSIFICATION OF TRAFFIC CONFLICTS

A practical method and system for transportation agencies (federal, state, and local) to monitor and assess the safety of their roadway networks in real time based on traffic conflict events such that corrective actions can be proactively undertaken to keep their roadway systems safe for travelling public. The method and system also provides a tool for evaluating the performance of autonomous vehicle/self-driving car technologies with respect to safety and efficiency. 1. A device comprising one or more processors and memory storing instructions that , when executed by the one or more processors , cause the device to:receive, from at least one device, first data associated with a roadway;generate, based at least on the first data, second data indicative of the roadway, where the second data comprises a transformation of the first data;determine, based at least on the second data, movement of an object relative to the roadway; generating, based at least on the parameter of the at least one device, a three-dimensional model of at least a portion of one or more of the roadway or object; and', 'determining, using the three-dimensional model, the dimensions of the object;, 'determine, based at least on a parameter of the at least one device, dimensions of the object, wherein the determining the dimensions of the object comprisesdetermine, using the dimensions of the object, a timing of the movement of the object; anddetermine, based at least on the timing of the movement of the object, a conflict associated with the roadway.2. The device of claim 1 , wherein the first data comprises a three-dimensional representation of the roadway and the second data comprises a two-dimensional representation of the roadway.3. The device of claim 1 , where generating the second data comprises transforming the first data to a ground coordinate system using a plurality of ground reference points.4. The device of claim 1 , wherein the parameter of the at least one device comprises at least ...

Foldable cover

A foldable cover for protecting or supporting a portable electronic device is provided. The foldable cover comprises a supporting unit and a fixing unit. The supporting unit comprises a plurality of first separations, a convergent part and a plurality of first slab-shaped parts. Each first separation is connected to the convergent part. The fixing unit is connected to the supporting unit to fix the portable electronic device. When the first slab-shaped parts are located at the same surface, the supporting unit covers the portable electronic device. When a three dimensional structure is formed by the first separations, the convergent part and the first slab-shaped parts, the supporting unit supports the portable electronic device.

RESISTANCE REGULATING BALANCE BOARD

A resistance regulating balance board includes a disc body disposed onto a semispherical base. A resistance member is disposed inside the semispherical base. An elastic component and a locking member are disposed inside a containing chamber within the resistance member. A screw rod passes through the disc body, the semispherical base and the elastic component to engage with the locking member so that a user can rotate the screw rod to regulate a resistance value generated between the resistance member and the semispherical base to change the magnitude of motion resistance of the balance board, thereby achieving optimum exercise and balancing effects. 1. A resistance regulating balance board comprising:a disc body, a bottom surface of the disc body defining a first lower arc cavity, a central axis of the disc body having a through hole;a base, a top semispherical surface of an upper portion of the base inserted into and corresponding to the first lower arc cavity of the disc body, a second lower arc cavity having a concave semispherical shape formed in a central portion of the base, a pivot hole formed in the second lower arc cavity;a regulating rotary lid, a lodging hole formed in an inner central surface of a lid body of the regulating rotary lid, the lodging hole configured to combine with a screw rod;a resistance member having a semispherical portion and a hollow tube body extending from an upper end of the resistance member, a surface of the semispherical portion corresponding to the second lower arc cavity of the base, a containing chamber formed inside a central portion of the resistance member, the hollow tube body passing through the pivot hole of the base when the semispherical portion is inserted into the second lower arc cavity; anda locking member disposed in the containing chamber of the resistance member and accepting the screw rod, an end of the screw rod extending through the hollow tube body from the through hole of the disc body to engage with the ...

IDENTIFICATION AND CLASSIFICATION OF TRAFFIC CONFLICTS USING LIVE VIDEO IMAGES

A practical method and system for transportation agencies (federal, state, and local) to monitor and assess the safety of their roadway networks in real time based on traffic conflict events such that corrective actions can be proactively undertaken to keep their roadway systems safe for travelling public. The method and system also provides a tool for evaluating the performance of autonomous vehicle/self-driving car technologies with respect to safety and efficiency. 115-. (canceled)16. A device comprising one or more processors and memory storing instructions that , when executed by the one or more processors , cause the device toreceive, from at least one camera device, first image data indicative of a roadway, where the first image data comprises a view of the roadway;generate, based at least on the first image data, second image data indicative of the roadway, where the second image data comprises a transformed view of the roadway;determine, based at least on the second image data, movement of an object relative to the roadway;determine, based at least on a parameter of the at least one camera device, dimensions of the object;determine, using the dimensions of the object, a timing of the movement of the object; anddetermine, based at least on the timing of the movement of the object, a conflict associated with the roadway.17. The device of where the view comprises a three-dimensional view of the roadway and the transformed view comprises a two-dimensional view of the roadway.18. The device of where the determining the dimensions of the object comprisesgenerating, based at least on the parameter of the at least one camera device, a three-dimensional model of a view from the at least one camera device; anddetermining, using the three-dimensional model, the dimensions of the object.19. The device of where generating the second image data comprises transforming the first image data to a ground coordinate system using a plurality of ground reference points.20. The ...

Moran's i for impulse noise detection and removal in color images

A method for impulse noise detection and removal in color images comprising a detection module and a vector median filter.

MORAN'S / FOR IMPULSE NOISE DETECTION AND REMOVAL IN COLOR IMAGES

A method for impulse noise detection and removal in color images based on Moran's/statistic using Moran's/vector median filter (MIVMF) which comprises detection and removal components. The detection module determines if a pixel is noise or is noise-free. If it is a noise pixel, the vector median filter (VMF) will be used to remove the noise. This detection capability meets the so-called “switching” mechanism, which only selects noisy pixels for suppression. The inventive filter expedites processing time with the reduced number of vector calculations due to this new detection function, achieved with Moran's/index and the indication of 1-D Laplacian kernels. Compared to other vector-type median filters, the inventive MIVMF was faster in the filtering process and efficient in removing random impulse noise with different noise levels in color images. The MIVMF demonstrated a promising de-noising result based on the criteria of Peak Signal-to-Noise Ratio (PSNR) and Structural Similarity Index Metric (SSIM). With the visualization of processed images, the MIVMF avoids image blurring, preserves the image edge details, and achieves superior noise reduction. 1. A method for impulse noise detection and removal in color images comprising a detection module and a vector median filter.2. A method for impulse noise detection and removal in color images , the method comprisingdetecting if a pixel is noise or noise-free; andremoving the pixel if it is noise using a vector median filter.3. The method of where the vector median filter is Moran's/.4. A method for impulse noise detection and removal in a color image claim 2 , the method comprising the steps of(a) reading a noise color image and setting threshold values;(b) calculating Moran's/value (MI) in a neighborhood of a pixel within a defined filtering window for each color component of the color image;(c) evaluating a plurality of 1-D Laplacian kernel response values in the neighborhood of the pixel and selecting the minimum ...

LED BAY LIGHT

An LED bay light includes a heat pipe module, a light condenser and at least one LED light emitting module. The heat pipe module is coupled to a side of the light condenser, and both are made of a thermally conductive material. The light condenser includes a top plate and at least one reflecting plate. The LED light emitting module is installed on a side of the top plate and covered by an inner side of the reflecting plate, and the inner side of the reflecting plate is coated with a color layer. The LED bay light dissipates heat produced from the LED light emitting module by the heat pipe module and the light condenser simultaneously to improve the heat dissipation efficiency effectively, and the light of the LED bay light can change its color through the reflection from the reflecting plate or the color layer. 1. An LED bay light , comprising: a base;', 'a plurality of heat conducting pipes, installed along the base; and', 'a fin set, having a plurality of fins installed with an interval apart from one another on the heat conducting pipes to form a plurality of first diversion passages in the horizontal direction, and each fin having at least one ventilation hole to form a second diversion passage in the vertical direction, and a predetermined interval being maintained between a bottom of the fin set and the base for guiding a heat current to the second diversion passage;, 'a heat pipe module, further comprising a top plate, with a side coupled to the base; and', 'at least one reflecting plate, installed around periphery of the top plate to farm a cover structure, and a reflecting surface formed on an inner side of the reflecting plate; and, 'a light condenser, installed on a side of the heat pipe module, and further comprisingat least one LED light emitting module, installed on the other side of the top plate, such that the LED light emitting module is covered within the reflecting plate; when use, a quantity of heat produced by the LED light emitting module is ...

Charge cabinet and storage device thereof

A storage device includes a base and a plurality of wire management modules. The wire management module includes a partition and a positioning assembly. The partition is disposed to the base and has a supporting surface and a wire management groove. The wire management groove is located at the supporting surface for accommodating a wire. The positioning assembly includes a first positioning member, a second positioning member and an assembling member. The first positioning member is disposed to the partition. The second positioning member is connected to the assembling member. The assembling member is assembled together with the partition. The second positioning member is rotatable around the edge of the second positioning member as a rotation axis in relation to the assembling member to be at either a fastening position or a releasing position. The partitions and the base jointly form a plurality of accommodation spaces.

CHARGING APPARATUS, CHARGING DEVICE AND CABLE MANAGEMENT MEMBER

A charging device is for charging at least one electronic device and fixing a cable which is connected to the at least one electronic device. The charging device includes a tray, a power supply part, at least one partition member and at least one cable management member. The tray has a loading zone. The power supply part is connected to the tray. The at least one partition member is disposed on the tray. The loading zone is divided into a plurality of loading sub-zones by the at least one partition member, and each of the loading sub-zones is for housing at least one electronic device. The at least one cable management member is disposed on the at least one partition member for fixing the cable. 1. A charging device for charging at least one electronic device and fixing a cable which is connected to the at least one electronic device , the charging device comprising:a tray having a loading zone;a power supply part being connected to the tray;at least one partition member being disposed on the tray, the loading zone being divided into a plurality of loading sub-zones by the at least one partition member, and each of the plurality of loading sub-zones being for housing the at least one electronic device; andat least one cable management member being disposed on the at least one partition member for fixing the cable.2. The charging device according to claim 1 , wherein the tray comprises a bottom plate and a rear plate claim 1 , the bottom plate is connected to the rear plate claim 1 , the rear plate has at least one slot claim 1 , and the cable passes through the at least one slot.3. The charging device according to claim 2 , wherein the at least one partition member has two ends connected to the bottom plate and the rear plate claim 2 , respectively.4. The charging device according to claim 2 , wherein the slot has a bridge section and two holding sections claim 2 , the two holding sections communicates with two ends of the bridge section which are opposite to each ...

CHARGING APPARATUS, POWER SUPPLY COMPONENT AND RACK MODULE

A charging apparatus is for charging an electronic device and accommodating an electronic device and a power cable connected to the electronic device, the power cable has a transformer. The charging apparatus includes a case body, a partition member and a power supply component. The case body has an accommodation space. The accommodation space has a main accommodating zone, a power supply zone and a sub-accommodating zone. The power supply zone is located above the main accommodating zone. The sub-accommodating zone is located on a side of the main accommodating zone. The sub-accommodating zone is for accommodating the transformer. The partition member is disposed in the main accommodating zone. The main accommodating zone is divided into a plurality of housing spaces by the partition member divides for accommodating the electronic device. The power supply component is disposed in the power supply zone for being coupled to the power cable. 1. A charging apparatus for charging at least one electronic device and accommodating the at least one electronic device and at least one power cable which is connected to the at least one electronic device , the power cable having at least one transformer , and the charging apparatus comprising:a case body having an accommodation space, the accommodation space having a main accommodating zone, a power supply zone and at least one sub-accommodating zone, the power supply zone being located above the main accommodating zone, the at least one sub-accommodating zone being located on a side of the main accommodating zone, and the sub-accommodating zone being for accommodating the at least one transformer;at least one partition member being disposed in the main accommodating zone, the main accommodating zone being divided into a plurality of housing spaces by the at least one partition member, and the plurality of housing spaces being for accommodating the at least one electronic device; andat least one power supply component being ...

Cooling rack structure of thermoelectric cooling type

A cooling rack structure includes a cooling plate (1), a temperature conductor (2), a centrifugal fan (3), a cooling body (4) and a thermoelectric cooling component (5). A heat-conducting component (13) is disposed on an inner surface (11) of the cooling plate (1). The temperature conductor (2) is arranged on the heat-conducting component (13). In addition, a heat-exhausting hole (120) is arranged on a supporting part (12) of the cooling plate (1). The centrifugal fan (3) is disposed between the temperature conductor (2) and the heat-exhausting hole (120) while the cooling body (4) is disposed between the fan (3) and the heat-exhausting hole (120). A hot side face (501) of the thermoelectric cooling component (5) closely contacts the cooling body (4) while a cold side face (500) is arranged on the heat-conducting component (13). By quickly conducting the low temperature generated from the thermoelectric cooling component (5) onto the cooling plate (1) through the heat-conducting component (13), a low temperature surface can be uniformly provided to obtain a cooling effect.

Electronic device

一種電子裝置具有運算能力且適於可拆卸地與具有運算能力的一可攜式電子裝置結合。電子裝置包括一機體、一連接座以及一支撐架。機體包括一第一表面。連接座設置於機體且具有一容置槽。可攜式電子裝置適於承放於容置槽內，以與電子裝置電性連接。可攜式電子裝置之一背面承靠於第一表面上。支撐架設於機體上並支撐機體，使其與機體之間夾一角度。

Motorcycle has left hand and right hand horizontal frame with side wheel unit installed on each, and connecting assembly hinge-connecting withdrawable support base and horizontal frames

The motorcycle has a frame body with a left hand and a right hand horizontal frame (d1) with a side wheel unit installed on each. A connecting assembly hinge-connects a withdrawable support base and the horizontal frames, and the side wheel is connected to the outer side of the support base. The withdrawable support base has at least one elastic rod so that the rod is connected to the upper surface of the support base. The upper side of the rod is connected to the upper section of the horizontal frame.

Cooler with ground heated plane and grinding method and apparatus thereof

The invention is to provide a method for making heated plane (34, 34', 42) of cooler (30, 30', 40) obtain better flatness and roughness. First, grinder (10) and fixture (20), with grinding plate (11), are provided. Then, the cooler (30, 30', 40) is arranged onto the fixture (20). Next, abrasive (132) is injected into the gap between the grinding plate (11) and the heated plane (34, 34', 42), making the fixture (20) press and clamp the cooler (30, 30', 40) in a way, such that the heated plane (34, 34', 42) of the cooler (30, 30', 40) contacts the abrasive (132) closely. Finally, the grinding plate (11) is rotated to make at least one grinding process to the heated plane (34, 34', 42), making the heated plane (34, 34', 42) obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane (34, 34', 42) and a heating element, and therefore promoting the thermally conductive efficiency between the cooler (30, 30', 40) and the heating element.

Lapping apparatus

The invention is to provide a method for making heated plane (34, 34', 42) of cooler (30, 30', 40) obtain better flatness and roughness. First, grinder (10) and fixture (20), with grinding plate (11), are provided. Then, the cooler (30, 30', 40) is arranged onto the fixture (20). Next, abrasive (132) is injected into the gap between the grinding plate (11) and the heated plane (34, 34', 42), making the fixture (20) press and clamp the cooler (30, 30', 40) in a way, such that the heated plane (34, 34', 42) of the cooler (30, 30', 40) contacts the abrasive (132) closely. Finally, the grinding plate (11) is rotated to make at least one grinding process to the heated plane (34, 34', 42), making the heated plane (34, 34', 42) obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane (34, 34', 42) and a heating element, and therefore promoting the thermally conductive efficiency between the cooler (30, 30', 40) and the heating element.

Heat-conducting assembly for heat pipes of different diameters and heat sink having the same

In a heat-conducting assembly for heat pipes of different diameters and a heat sink having such assembly, the heat-conducting assembly includes a heat-conducting base, a set of first heat pipes and a set of second heat pipes. A heat-conducting surface of the heat-conducting base is provided with a plurality of accommodating troughs. The diameter of the set of second heat pipes is smaller than that of the set of first heat pipes. The first heat pipe and the second heat pipe of different diameters are disposed in the accommodating troughs respectively. The heat pipes penetrate a plurality of fins to form the heat sink. With this arrangement, the ratio of heat pipes arranged on the heat-conducting surface can be increased and the heat-conducting efficiency thereof can be improved.

Motorcycle with side wheels

A motorcycle structure, comprises a front wheel, a back wheel, an engine, and a frame body; wherein the frame body having a left horizontal frame and a right horizontal frame d1, each of the horizontal frames having an aslant pipe d2 coupled backward to the horizontal frames; a side wheel unit being set on each of the external side of the front wheel and the back wheel, further comprising a connecting device 1, a supporting base 2, and a side wheel 3; the connecting device is for pivotally connecting the supporting base and the horizontal frame. The side wheel 3 is pivotally coupled to the external side of the supporting base; the supporting base has at least one sprung rod 24 such that the bottom and the top of the rod are pivotally coupled onto the surface of the supporting base and onto the frame body Such arrangement mainly makes use of the erection assistance and the contraction functions of the side wheel unit, so that motorcycle riders can drive or make turns on a rough road surface more safely and stably.

Heat conducting structure with coplanar heated portion, manufacturing method thereof, and heat sink therewith

A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold (20) and a second mold (30) having different concave cambers (211, 211a, 221, 221a), using the first mold (20) to progressively compress the heat pipes (10) and form a camber (112) at an evaporating section (11), using the second mold (3 0) to compress the camber (112) to form a contact plane (112') and an attaching plane (113') perpendicular to each other, coating an adhesive (50) on the contact planes (112'), connecting the contact planes to make the attaching planes co-planar.

A large area of ​​cooling fins, and a radiator with the fins

Method of chemical-mechanical polishing

A method of chemical-mechanical polishing. A die region and a scribe line region are defined on a wafer. A dummy pattern is formed in the scribe line region. A dielectric layer is formed to cover the dummy pattern and the wafer. The dielectric layer is planarized by chemical-mechanical polishing.

Motorcycle structure.

Heat-dissiping fin assembly with heat-conducting structure

The present invention relates to a heat-dissipating fin capable of increasing surface turbulence, which includes a first heat-dissipating fin (10) and a second heat-dissipating fin (20). A first surface (11) of the first heat-dissipating fin (10) is provided with a plurality of first protrusions (12) arranged at intervals. The second heat-dissipating fin (20) has a second surface (21) toward the first surface (11). The second surface (21) is also provided with a plurality of second protrusions (22) arranged at intervals. The second protrusions (22) are arranged to correspond to the first protrusions (12). The second heat-dissipating fin (20) is overlapped with the first heat-dissipating fin (10). With the arrangement of the first protrusions (12) and the second protrusions (22), the heat-dissipating area of the first heat-dissipating fin (10) and the second heat-dissipating fin (20) can be increased so as to increase the surface turbulence. Thus, the heat-exchange efficiency can be enhanced.

Vapor chamber

A vapor chamber includes a plate (1) and a wick structure (2). The plate (1) is provided therein with a working fluid, and the plate (1) has a heated end and a condensed end. The wick structure (2) comprises a first wick portion (20) adhered to be opposite to the heated end, a second wick portion (21) overlapping on the first wick portion (20), and a third wick portion (22) adhered on the rest portion of a chamber. The aperture diameter of the first wick portion (20) is larger than that of the second wick portion (21), or the aperture density of the first wick portion (20) is smaller than that of the second wick portion (21). Therefore, the amount of working fluid attached to the second wick portion (21) is smaller than of the first wick portion (20). As a result, after heated, the working fluid attached to the second wick portion (21) will be vaporized more quickly, thereby increasing the efficiency of heat transfer and improving the heat-dissipating effect.

,,struttura di motociclo migliorata,,.

Wärmerohren und befestigungseinheit dafür und wärmesenke

Läppvorrichtung

Cooling liquid flow control device

A cooling liquid flow control device includes a heat dissipation bottom plate, a fixing holder, a cooling module, and a temperature control element. The heat dissipation bottom plate has a bottom surface configured to be in contact with a heating element on a substrate. The fixing holder is connected to the heat dissipation bottom plate and configured to be fixed with the substrate. The cooling module is connected to a top surface of the heat dissipation bottom plate to form a cavity. The cavity is configured to circulate a cooling liquid. The temperature control element is connected to the cooling module and includes a valve. The valve is configured to reciprocally move based on a temperature of the heating element, thereby adjusting a flow rate of the cooling liquid in and out of the cavity.

Manufacturing method for semiconductor structure, and pixel structure and manufacturing method for the same

Wiring bonding structure between a semiconductor chip and a substrate and its method

LED-STRAßENLAMPENHALTERUNGSSTRUKTUR

Wärmeableitende struktur einer led-lampe aus porösem material

可拆式電腦之部分

【物品用途】;本創作係關於一種「可拆式電腦」。;【設計說明】;如附圖所揭示，本創作之可拆式電腦大致上呈一扁平長方體。由分離時之狀態圖可知，可拆式電腦係由顯示元件及支撐元件所組成。結合使用時，容易讓使用者產生簡約洗鍊的視覺感受。;圖式所揭露之虛線部分，為本創作不主張設計之部分。;整體觀之，本創作之可拆式電腦於申請前未見於刊物或公開使用，故而符合設計專利要件。

Voltage-controlled capacitor circuit and related circuitry with diode and MOS varactors

Method of making coplanar evaporator sections of heat pipes with product and jig thereof

Semiconductor package and method for packaging the same

半導體封裝構造及其封裝方法

Verfahren zum kombinieren von heizrohren mit einer befestigungsunterlage und struktur damit

Cooler with ground heated plane and grinding method and apparatus thereof

A method for making heated plane of a cooler obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.

ヒートパイプを有する熱放散器の製造方法及びその製品

【課題】熱放散器の熱伝達性能を向上させる。 【解決手段】ヒートパイプを有する熱放散器は熱伝達底部１、第１ヒートパイプ２及び第２ヒートパイプ３を含む。熱伝達底部は収容樋１１を有する。第１ヒートパイプが収容樋へ収容された後、それは収容樋の内壁面で終端するように変形される。第１ヒートパイプと第２ヒートパイプは同一収容樋に備えられ、第２ヒートパイプは第１ヒートパイプ上に垂直に重ねられる。第２ヒートパイプは第１ヒートパイプと収容樋内部で終端するように変形される。 【選択図】図６

Struttura di motociclo migliorata

Wärmeableitende anordnung eines led-lampenhalters

研磨された受熱平面を備える散熱器及びその研磨方法と設備

【課題】散熱器の受熱面がより良い平面度及びラフ度を達成可能な研磨された受熱平面を備える散熱器及びその研磨方法と設備。 【解決手段】研磨された受熱平面を備える散熱器30及びその研磨方法は、先ず、研磨盤11を備える研磨機10及び治具20を提供し、散熱器30を治具20上にセットし、研磨盤11と散熱器30の受熱平面34との間に研磨物132を注入し、治具20により散熱器30を圧迫して固定し、これにより散熱器30の受熱平面34は、研磨物132上に平らに密着し、さらに研磨盤11を回転させ、受熱平面34に対して、少なくとも１回の研磨を行い、こうして受熱平面34の表面ラフ度及び平面度はより優良となり、受熱平面34と発熱部品との接触時の密着度を向上させ、散熱器30と発熱部品との伝熱効率を高めることができる。 【選択図】図４

Verfahren zur anordnung von verdampferabschnitten bündig liegender wärmerohre auf einer befestigungsplatte und entsprechende anordnung

Bonding device and bonding method

A bonding device for bonding an electronic element includes an engaging component. The engaging component has a first surface and a second surface opposite to the first surface. The engaging component includes a plurality of recesses at the second surface. The plurality of recesses are configured to cover a plurality of projections of an electronic element. The engaging component is coupled to a heating component.

多熱管蒸發部共平面之製造方法及其成品、治具

Method for assembling fins-type heat sink

A method for assembling a fins-type heat sink includes providing a heat sink, a presser and a plurality of caps, the heat sink having a heat pipe and a plurality of fins disposed on the heat pipe, the presser being provided with through-holes allowing the distal ends of the heat pipe to be inserted therein, a periphery of each through-hole being provided with an annular neck, the presser being provided with notches that are arranged circumferentially outside the annular neck; (b) covering the caps on the annular necks of the presser respectively, each caps extending downwards to form protruding flaps penetrating the notches; (c) disposing a plate-like die on the topmost fin of the heat sink; (d) inserting a distal end of the heat pipe through the through-hole of the presser to abut inside the cap, while folding the flaps outwards via the plate-like die.

Wiring bonding structure between a semiconductor chip and a substrate and its method

顯示器陣列下板

鰭片扣接及其與熱管之結合方法

Verfahren und befestigung zum herstellen von koplanaren verdampfern aus wärmrohren sowie dadurch hergestellter verdampfer

Method and apparatus for controlling a user interface of a consumer electronic device

Method of producing heat dissipating fin and structure thereof and method of producing heat dissipating device comprising the heat dissipating fin and structure thereof

Verfahren zum Kombinieren von Heizrohren mit einer Befestigungsunterlage und Struktur damit

Active matrix substrates, OLED display devices and fabrication methods thereof

Semiconductor package and method for packaging the same

Image processing unit

Display array backplane

Method of fastening fin assembly and combining with heat pipe

Method and device for cavity-down package