Wiring bonding structure between a semiconductor chip and a substrate and its method

01-07-2007 дата публикации
Номер:
TW200725860A
Автор: Chih-Cheng Hung, Hui-Chin Fang, Kuo-Sheng Chung
Принадлежит: Advanced Semiconductor Eng
Контакты:
Номер заявки:
Дата заявки:







CPC - классификация

HH0H01H01LH01L2H01L22H01L222H01L2224H01L2224/H01L2224/0H01L2224/05H01L2224/055H01L2224/0555H01L2224/05554H01L2224/4H01L2224/48H01L2224/482H01L2224/4822H01L2224/48227H01L2224/484H01L2224/4846H01L2224/48465H01L2224/49H01L2224/491H01L2224/4911H01L2224/49113H01L2224/494H01L2224/4942H01L2224/49427H01L2224/8H01L2224/85H01L2224/850H01L2224/8505H01L2224/85051H01L2224/859H01L2224/8595H01L2224/85951H01L24H01L24/H01L24/4H01L24/48

IPC - классификация

HH0H01H01LH01L2H01L24H01L24/H01L24/4H01L24/48H01L24/7H01L24/78