29-06-2017 дата публикации
Номер: US20170183542A1
Принадлежит:
The present invention relates to a pressure sensitive adhesive sheet containing, laminated in this order, a supporting substrate, a pressure sensitive adhesive layer (X), a continuous void-containing layer including a composition containing silica particles, and a pressure sensitive adhesive layer (Y), the continuous void-containing layer having a mass concentration of the silica particles of more than 60% and 100% or less. 1: A pressure sensitive adhesive sheet , comprising: laminated in this order , a supporting substrate , a pressure sensitive adhesive layer (X) , a continuous void-containing layer including a composition containing silica particles , and a pressure sensitive adhesive layer (Y) ,wherein the continuous void-containing layer has a mass concentration of the silica particles of more than 60% and 100% or less.2: The pressure sensitive adhesive sheet according to claim 1 , wherein the continuous void-containing layer has a thickness incremental rate by voids of more than 170% and 280% or less.3: The pressure sensitive adhesive sheet according to claim 1 , wherein the silica particles have a volume average secondary particle diameter of from 0.5 to 10 μm.4: A method for producing the pressure sensitive adhesive sheet according to claim 1 , the method comprising:simultaneously coating at least two layers of the pressure sensitive adhesive layer (X), the continuous void-containing layer, and the pressure sensitive adhesive layer (Y), with a multilayer coater.5: A method for producing the pressure sensitive adhesive sheet according to claim 1 , the method comprising:laminating each of the pressure sensitive adhesive layer (X), the continuous void-containing layer, and the pressure sensitive adhesive layer (Y), by bonding. The present invention relates to a pressure sensitive adhesive sheet, and more specifically, relates to a blister resistant pressure sensitive adhesive sheet that, on attaching to a surface of various plastic molded articles, is ...
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