02-02-2017 дата публикации
Номер: US20170029400A1
The present disclosure relates to a leveling compound for electrodepositing metals. The compound is of formula (I) or a salt thereof: 2. The compound of claim 1 , wherein Ris O.3. The compound of claim 1 , wherein Y claim 1 , Y claim 1 , Y claim 1 , Y claim 1 , Y claim 1 , Y claim 1 , Y claim 1 , and Yare hydrogen.4. The compound of claim 1 , wherein at least one of Y claim 1 , Y claim 1 , Y claim 1 , Y claim 1 , Y claim 1 , Y claim 1 , Y claim 1 , and Yis alkoxyl.5. The compound of claim 1 , wherein Rand Rare each independently Calkyl.6. The compound of claim 1 , wherein Ris alkoxyl.7. The compound of claim 1 , wherein Ris ethoxyl.8. The compound of claim 1 , wherein L is —(CH)— and wherein m is an integer.9. The compound of claim 8 , wherein m is one or two.12. The composition of claim 11 , further comprising an accelerator claim 11 , and a suppressor.13. The composition of claim 11 , further comprising a copper source.14. The composition of claim 13 , wherein the copper source comprises copper methanesulfonate.15. The composition of claim 14 , further comprising methanesulfonic acid.16. The composition of claim 13 , wherein the copper source comprises copper sulfate.17. The composition of claim 16 , further comprising sulfuric acid.18. The composition of claim 11 , wherein Y claim 11 , Y claim 11 , Y claim 11 , Y claim 11 , Y claim 11 , Y claim 11 , Y claim 11 , and Yare hydrogen.19. The composition of claim 11 , wherein at least one of Y claim 11 , Y claim 11 , Y claim 11 , Y claim 11 , Y claim 11 , Y claim 11 , Y claim 11 , and Yis alkoxyl.20. The composition of claim 11 , wherein R claim 11 , Rand Rare each independently Calkyl.21. The composition of claim 11 , wherein Ris alkoxyl.22. The composition of claim 11 , wherein Ris ethoxyl.23. The composition of claim 11 , wherein Ris alkyl substituted with phenyl.24. The composition of claim 11 , wherein Ris —(CH)phenyl claim 11 , m is an integer from 1-6.25. The composition of claim 11 , wherein Ris —CHphenyl.26. ...
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