УСТРОЙСТВО ДЛЯ ОХЛАЖДЕНИЯ ЭЛЕКТРОЛИТА (ВАРИАНТЫ)

Устройство относится к гидрометаллургии цинка и может быть использовано для охлаждения электролита в металлургической, химической и других областях промышленности, где требуется охлаждение больших объемов растворов. Устройство для охлаждения электролита содержит корпус в виде башни с дном, расположенным выше нулевой отметки, окна для подачи охлаждающего воздуха, патрубки для подвода и отвода электролита, сопла для разбрызгивания электролита, расположенные выше окон для подачи охлаждающего воздуха, при этом дно дополнительно снабжено кессонами, уложенными вплотную друг к другу по всему сечению дна башни, верхняя часть которых выполнена из П-образного свинцового профиля, а нижняя - из полимерного материала, и брызгоуловителями, расположенными в верхней части башни в виде конусов, установленных на разных уровнях, на поверхности которых радиально в шахматном порядке выполнены прорези с отогнутыми V-образными пластинками. Отличием второго варианта является то, что кессоны установлены с промежутками ...

Cyanous bath supervisory circuit - when coolant exceeds bath pressure coolants diverted to outflow from drain to detoxification system after every standstill

In a supervisory system for noxious (galvanic) baths the pressure produced by a pump in the cooling or heating coils is kept higher, in operation, than the static bath pressure. To prevent any toxic substance, which may have leaked into the coils at a standstill, from poisoning the drains, a 3-way valve in the outflow line is opened by a time switch long enough to a detoxification system to ensure the complete removal of the contents of the coils. The 3-way valve is then returned to the drain position.

Process and apparatus for electro depositing chromium

... 266,379. Jackson, L. Mellersh-, (Siemens & Halske Akt.-Ges.). Feb. 19, 1927. Drawings to Specification. Chromium, depositing; electrodes, heating and cooling.-In chromium plating the temperature of the bath is maintained within prescribed limits by the use of a hollow anode through which cooling or heating medium such as water or steam is passed. The anode may be a flat spiral or sinuous coil of lead pipe. Two anodes may extend along opposite sides of the cell, the cathodes being hung from a central busbar. The electrolyte may contain 500 gms. of chromic acid and 4 gms. of chromium sulphate Cr2(SO4)3.18H2o per litre. A suitable temperature is 30‹ + 2‹ C.

PLANT FOR THE ENTERPRISE OF A DEAD ELECTRO-CHEMICAL BATH WITH BATH HEATING BY MICROWAVES

VERFAHREN ZUR HERSTELLUNG STRUKTURIERTER CHROMSCHICHTEN

Die Erfindung betrifft ein Verfahren zur Herstellung strukturierter Chromschichten, insbesondere für Medienkontaktflächen, wobei die Strukturchromschicht durch galvanische Abscheidung von Chrom aus einem Elektrolyt auf ein Substrat hergestellt wird. Die der Erfindung zugrunde liegende Aufgabe, ein Verfahren zur Herstellung strukturierter Chromschichten für Kontaktflächen mit gegenüber den bekannten Chrombeschichtungen verbesserten Eigenschaften zu schaffen, wird dadurch gelöst, dass die Bildung der Strukturchromschicht bei konstanten Stromdichten und in einem von der Stromdichte abhängigen Temperaturbereich erfolgt und dass die Strukturbildung durch zumindest eine Temperaturänderung initiiert wird ...

DEVICE FOR GALVANIC SEPARATION PROTHETI, METALLIC DENTALFORMTEILE

Electrical contact structures from flexible wire

Vorrichtung zum Kühlen des Elektrolyten in Bleichlaugen-Elektrolyseuren.

Procédé de fabrication d'un vitrage chauffant électrique, dispositif pour sa mise en oeuvre et vitrage obtenu par ce procédé

Procédé de fabrication d'un vitrage chauffant électrique et dispositif pour sa mise en oeuvre

Устройство для нанесения композиционных электрохимических покрытий

Изобретение относится к гальванотехнике, в частности к установке для нанесения композиционных электрохимических покрытий. Установка включает ванну (1) с дном (2) в виде усеченного конуса, в которой размещены аноды (4) и катоды (5), и систему гидродинамической рециркуляции электролита с суспензией. Ванна (1) оснащена системой подогрева (3). Система гидродинамической рециркуляции включает отрезок направляющей трубы (7), вертикально установленный в центре ванны и зафиксированный распорками (8), внутри которого размещена труба (9) с возможностью возвратно-поступательного движения. На нижнем торце трубы смонтирована воронка (10), обращенная меньшим основанием вверх, а верхним торцом труба (9) сообщена с распределительной трубой (11) с форсунками (12), расположенной перпендикулярно ей и погруженной в электролит, при этом распределительная труба (11) соединена c электроприводом (17) посредством штока (13) с пружиной (15), ролика (16) и эксцентрика (18), последовательно расположенных и связанных ...

Separation and reunion hard tube galvanizing rig

Device is electroplated in secondary zinc -plating

Electrochemistry anodic oxidation experiment teaching device

Device automatically controlling carbon processing

Conductive roll carbon brush cooling device

Portable excavator hydraulic -pressure detection maintenance car

The utility model provides a portable excavator hydraulic -pressure detection maintenance car relates to excavating equipment testing and maintenance technical field, the utility model provides a portable excavator hydraulic -pressure detection maintenance car includes automobile body, hydraulic -pressure detection platform, electroplating device and restoration match grinding device, and hydraulic -pressure detection platform, electroplating device and restoration match grinding device are installed on the automobile body, and the hydraulic -pressure detection platform is arranged in detecting whether hydraulic system's hydraulic component damages on the excavator, and the electroplating device is used for going up the case chromium plating of wearing and tearing to hydraulic component, restores the match grinding device and is used for grinding the valve opening that hydraulic component went up wearing and tearing. The utility model provides a portable excavator hydraulic -pressure detection ...

Electro-deposition device for preparing magnetic material film

The electro-deposition device comprises a fixing base, a heating cavity is formed in the fixing base, a through opening is formed in the inner wall of the top of the heating cavity, a groove body is slidably connected to the inner wall of the through opening, and anode plates are connected to the two sides of the inner wall of the bottom of the groove body through bolts; a connecting opening is formed in the inner wall of the bottom of the tank body, a base plate is fixed to the inner wall of the connecting opening, the base plate is made of a flexible material, heaters are arranged at the two ends of the inner wall of one side of the heating cavity, a water opening is formed in the inner wall of one side of the heating cavity, and a swing mechanism is arranged in the heating cavity. According to the device, the fluidity of hot water can be improved, so that the heat transfer effect is improved, the electro-deposition efficiency of a magnetic material film is improved, and the situation ...

CANTILEVER BEAMS AND MANUFACTURING METHOD OF INTERCONNECTS FACTOR USING SACRIFICIAL SUBSTRATES

장식용 Pd-Fe 합금 도금액 조성물 및 이를 이용한 도금 방법

... 본 발명은 황산제이철 100중량부 기준으로, 황산팔라듐 15 내지 30중량부; 설포살리실산 100 내지 120중량부; 수산화암모늄 15 내지 30중량부; 시트릭산 20 내지 30중량부; 및 염산 35 내지 50중량부를 포함하는 장식용 Pd-Fe 합금 도금액 조성물 및 이를 이용한 도금방법을 제공한다. 본 발명에 따른 Pd-Fe 합금 도금액 조성물은 광택 및 외관 특성이 우수하며 경도와 연성이 높고, 수소 취화율이 낮을 뿐만 아니라 저다공성 및 내마모성 우수하다.

apparatus for tubular type high-field fabrication of anodic nanostructures

본 발명은 튜브 형태의 금속의 내표면에 나노구조체를 형성하기 위한 고전계 양극산화장치에 관한 것으로서, 금속을 산화시켜 표면에 나노구조체를 형성하는 양극산화장치에 있어서, 튜브 형태의 금속 양극과; 상기 양극의 양측에 결합되며, 상기 양극의 양단부가 삽입되도록 형성되어 상기 양극을 고정시키는 고정공과, 상기 고정공에 인접하여 형성되어 상기 양극을 전기적으로 접촉시키는 양극접촉구로 이루어진 양극고정부와; 상기 양극고정부 사이에 위치하며 상기 양극을 내부에 수용하여 양극의 외부로 냉각매체가 순환공급되도록 하는 냉각부와; 상기 양극고정부 측면에 결합되며, 전해액이 상기 금속 양극의 일측에서 내부로 공급되고 타측으로 배출되도록 형성된 전해액 공급부와; 상기 전해액 공급부를 지나 상기 금속 양극 내부를 길이 방향으로 관통되어 전해액에 침지형성된 상대전극으로써의 음극과; 상기 전해액 공급부 측면에 결합되어 상기 음극을 고정시키는 음극고정부;를 포함하여 구성되는 것을 특징으로 하는 튜브형 고전계 양극산화장치를 기술적 요지로 한다. 이에 따라 전해액이 금속 양극 내부로 공급되도록 하고 냉각매체가 금속 양극 외부로 공급되도록 함과 함께 음극이 금속 양극 내부에서 길이 방향으로 형성되도록 함으로써, 금속 양극 내표면에의 나노구조체를 고속으로 형성함과 아울러 이에 따른 열을 고속으로 제거함으로써 산화막 형성이 균일하고도 신속하게 이루어지도록 하여 다송성 금속산화물 튜브의 제공이 가능한 이점이 있다. 금속 튜브 고전계 양극산화 나노구조체 전해액

Plating tank heating structure improvement

Probe card assembly and kit, and methods of using same

A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly thereto (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are "stacked up" so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's ...

Electrodeposition System and Electrodeposition Method

In an electrodeposition system, the final quality of a coating is prevented from being degraded due to a coating material-containing aqueous solution flowing out of a steel plate mating portion during a drying process, while derivative problems such as an increase in the size of the system, an increase in the initial costs and the running costs, and a decrease in reliability are avoided. A washing zone that is subsequent to an electrodeposition zone in which an object to be coated is immersed in a coating material solution for electrodeposition so that a coating is formed on a surface of the object to be coated is provided with: a hot water washing tank in which the coated object is washed by being immersed in high-temperature washing water in the tank; and a spray washer that sprays a steel plate mating portion of the coated-object with high-temperature washing water, subsequent to washing in the hot water washing tank. 1. An electrodeposition system comprising:an electrodeposition zone in which an object to be coated is immersed in a coating material solution for electrodeposition so that a coating is formed on a surface of the object to be coated;a washing zone in which the coated object having the coating formed on the surface thereof in the electrodeposition zone is washed using washing water; anda drying zone in which the coated object washed in the washing zone is heated so that the coating of the coated object is hardened and dried,wherein the washing zone is provided with at least:a hot water washing tank in which the coated object is washed by being immersed in high-temperature washing water in the tank; anda spray washer that sprays a steel plate mating portion of the coated-object with high-temperature washing water, subsequent to washing in the hot water washing tank.2. The electrodeposition system according to claim 1 ,wherein the washing zone includes an upstream washing zone in which the coated object is washed using washing water that is clean water ...

METHOD AND SYSTEM OF POWDER COATING A VEHICLE COMPONENT

A method of painting a vehicle component includes charging the vehicle component. The charge of the vehicle component in an area to be painted is selectively changed. Paint is applied to the vehicle component. The vehicle component is heated to fuse the paint to the vehicle component.

ELECTROCHEMICAL DEPOSITION SYSTEMS WITH ENHANCED CRYSTALLIZATION PREVENTION FEATURES

Electrochemical deposition systems and methods are described that have enhanced crystallization prevention features. The systems may include a bath vessel operable to hold an electrochemical deposition fluid having a metal salt dissolved in water. The systems may also include sensors including a thermometer and concentration sensor operable to measure characteristics of the electrochemical deposition fluid. The systems further include a computer configured to perform operations that include receiving system data from the electrochemical system and generating a control signal to change a characteristic of the electrochemical deposition fluid to prevent crystallization of a metal salt in the fluid. The computer generates the control signal based on processing that may include comparing an actual metal salt concentration in the electrochemical deposition fluid to a theoretical solubility limit for the metal salt in the fluid.

Apparatus for the electrolytic deposition on metallic prothetic dental elements

Device for galvanically coating a prosthetic metallic dental molded part comprises a beaker for receiving an electrolyte bath, a stirring system, an infrared radiator as heating system, an anode and cathode, and an electrical supply unit Device for galvanically coating a prosthetic metallic dental molded part (4b) comprises a beaker (1) for receiving an electrolyte bath (2), a stirring system for agitating the bath, an infrared radiator (7) emitting in the wavelength region of 0.5-1000 mum and used as heating system for heating the bath, an anode (3) and cathode (4a), and an electrical supply unit connected to the anode and cathode. An Independent claim is also included for a process for the production of a prosthetic metallic dental molded part using the above device.

Устройство для подогрева электролитических ванн

Immersion unit for galvanic baths

The immersion unit (1), in particular, for galvanic baths consists of a connector head (11) provided with an immersion pipe with a heater insert, at least one probe pipe or probe, a control system and an electrical supply connection. The unit is characterised by the use of at least one probe (13), the entire control system (133) of the immersion unit (1) is housed in the connector head (11).Pref. the immersion unit is provided with a thermostat (131) in the form of a probe. At the top of the connector head (11) there is a turnable know for thermostat setting.

BEHEIZTER KORROSIONSFESTER KUNSTSTOFFBEHAELTER

VERBINDUNGSELEMENTE FÜR MIKROELEKTRONISCHE KOMPONENTEN

TRIMMING THE RESISTANCE OF THIN FILM DEVICES

... 1322996 Resistors; capacitors WESTERN ELECTRIC CO Inc 19 April 1971 [30 March 1970] 25385/71 Headings HIS and H1M The resistance of a thin film device e.g. a resistor or capacitor is trimmed to within predetermined limits of a predetermined value by placing the device, 10, in a tank containing an electrolyte for example a 0À1% citric acid solution when resistor 10 and cathode 13 are of tantulum, and connecting the device to a computer controlled relay 26 which connects the device either to a constant current source 22 for the purpose of anodizing the film, or to a resistance measuring circuit, 32, coupled to the computer controlling the relay. The anodization is carried out by a reiterative process (Fig. 4, not shown). The steps involve first measuring the film resistance and then calculating the length of time the films must be further anodized to increase its resistance to the desired value. The film is then anodized for a fraction r of the calculated time after which the resistance is ...

Improvements in or relating to electrical heating apparatus for liquids

... 286,563. Newland, W. Y. May 2, 1927. Protective arrangements.-In apparatus for the electrodeposition of metals provided with an electric heater 11, a part of the apparatus e.g. the vessel 15, or a member immersed in the liquid. or, as shown, the metallic sheathing surrounding the heating element is normally connected to earth through a resistance but is automatically connected directly to earth in the event of a rise of the electric potential, as from a leakage of the heating ' current. The earthing arrangement shown comprises a resistance coil 1 wound on a core 2 provided with poles 3 and a pivoted armature 4 carrying contacts 5 adapted, when depressed, to engage mercury cups 6 and shortcircuit the coil 1. The armature is provided with an adjustable weight 8. The armature, when depressed. is maintained so by a pawl 10 until reset. Specification 285,691, [Class 39 (iii), Heating by electricity], is referred to.

VERFAHREN ZUR HERSTELLUNG STRUKTURIERTER CHROMSCHICHTEN

PROCEDURE FOR SNAPPING GALVANIC DEPOSITING OF GOLD OUT OF GOLD ELECTROLYTES ON A DOCUMENT AND A WAESSERIGER GOLDGALVANISIEUNGSELEKTROLYT FOR THE EXECUTION OF THE PROCEDURE

Способ получения железной фольги

Изобретение относится к способу получения железной фольги, которая может быть использована в электронной и радиотехнической промышленности. Заявленный способ включает электролитическое осаждение железа в виде железной фольги на вращающийся барабан-катод, частично погруженный в электролит, содержащий хлористое железо, в котором установлен растворимый анод и последующее отделение осажденной фольги. При этом барабан-катод выполнен из стеклоуглерода, а электролитическое осаждение проводят из электролита, содержащего 500…600 г/л хлористого железа и 1…2 г/л хлористого рубидия, при температуре 85…90°С и катодной плотности тока 30…50 А/дм2. П. формулы: 1 Фиг.: 1 ...

Устройство для нанесения композиционных электрохимических покрытий

Изобретение относится к гальванотехнике, в частности к установке для нанесения композиционных электрохимических покрытий. Установка включает ванну (1) с дном (2) в виде усеченного конуса, в которой размещены аноды (4) и катоды (5), и систему гидродинамической рециркуляции электролита с суспензией. Ванна (1) оснащена системой подогрева (3). Система гидродинамической рециркуляции включает отрезок направляющей трубы (7), вертикально установленный в центре ванны и зафиксированный распорками (8), внутри которого размещена труба (9) с возможностью возвратно-поступательного движения. На нижнем торце трубы смонтирована воронка (10), обращенная меньшим основанием вверх, а верхним торцом труба (9) сообщена с распределительной трубой (11) с форсунками (12), расположенной перпендикулярно ей и погруженной в электролит, при этом распределительная труба (11) соединена с электроприводом (17) посредством штока (13) с пружиной (15), ролика (16) и эксцентрика (18), последовательно расположенных и связанных ...

Способ получения железной фольги

Изобретение относится к способу получения железной фольги, которая может быть использована в электронной и радиотехнической промышленности. Заявленный способ включает электролитическое осаждение железа в виде железной фольги на вращающийся барабан-катод, частично погруженный в электролит, содержащий хлористое железо, в котором установлен растворимый анод и последующее отделение осажденной фольги. При этом барабан-катод выполнен из стеклоуглерода, а электролитическое осаждение проводят из электролита, содержащего 500…600 г/л хлористого железа и 1…2 г/л хлористого рубидия, при температуре 85…90°С и катодной плотности тока 30…50 А/дм2. П. формулы: 1 Фиг.: 1 ...

Electroplating cooling circulation line improvement device

Electroplating bath reheater - with easily accessible parts

element of heating for corrosive baths

PLATING DEVICE POSSIBLE FOR MULTITASKING

The present invention relates to a plating device capable of multitasking by monitoring plating conditions and a working state based on a real-time; and performing an active conditional control at the same time while plating materials with different thicknesses in a single plating bath at the same time. The plating device possible for multitasking comprises: the plating bath (110) wherein an electrolyte is received; a cathode unit (120) formed on a central part of the plating bath (110); a first rectifier (130) applying a first direct current power source to a first anode unit (131); a second rectifier (140) applying a second direct current power source different from the first direct current power source to a second anode unit (141); a concentration control unit (150) composed of a concentration measurement unit (151) and a supply unit (152); a temperature control unit (160) equipped with a temperature measurement unit (161) measuring a temperature of the electrolyte received inside the ...

Apparatus For Removing Water On the Plating Strip Surface

Assembly of two electronic devices

MAGNETIC THIN FILM, ITS MANUFACTURING METHOD, MAGNETIC HEAD USING THE SAME, AND ELECTROPLATING APPARATUS

PURPOSE: To provide a magnetic thin film, whose coercive force and magnetostriction constant are both small and which is capable of stably obtaining high saturation magnetization of 18,000 to 23,000 G, a method of manufacturing the same, a magnetic head using the same, and an electroplating apparatus. CONSTITUTION: The ratio of the diffracted X-ray intensity fcc (200) on the face-centered cubic lattice (200) plane of a magnetic thin film of Co-Ni-Fe alloy to the diffracted X-ray intensity fcc (111) on the face-centered cubic lattice (111) plane of the thin film is represented by fcc (200)/fcc (111), and the ratio fcc (200)/fcc (111) is set smaller than 0.25. Also the peak intensity ratio of the intensity bcc (110) of the diffracted X-ray on the face-centered cubic lattice (110) plane to that of the intensity fcc (111) of diffracted X-ray on the face- centered cubic lattice (111) plane is set at 0.01 to 3.0. © KIPO & JPO 2002 ...

Proximity head heating method and apparatus

Provided is an apparatus and a method for heating fluid in a proximity head. A fluid source supplies fluid to a channel within the proximity head. The fluid flows in the channel, through the proximity head, to an outlet port located on a bottom surface of the proximity head. Further, within the proximity head is a heating portion that heats the fluid. Various methods can heat the fluid in the heating portion. For example, the fluid can be heated via resistive heating and heat exchange. However, any mechanism for heating fluid in the proximity head is possible. After heating the fluid, the proximity head delivers the heated fluid through the outlet port to a surface of a semiconductor wafer. An inlet port proximately disposed near the outlet port vacuums the heated fluid to remove the heated fluid from the surface of the semiconductor wafer.

Method and apparatus for wirebonding, for severing bond wires, and for forming balls on the ends of bond wires

The efficacy of electrical discharges for severing bond wires and/or for forming balls at the ends of bond wires (including bond wires already severed by alternative mechanisms) is improved by performing the electrical discharges in the presence of ultraviolet light. A "spark gap" is formed between an EFO electrode and the wire, one of which serves as the cathode of the spark gap. Preferably, the ultraviolet light is directed at the element serving as the cathode of the spark gap. Providing photoemission at the cathode element of the spark gap stabilizes arc/plasma formation and produces more reliable and predictable results. This technique may be used in conjunction with negative EFO systems or with positive EFO systems, and may benefit from either direct or field-assisted photoemission.

Plating apparatus

A plating apparatus includes a processing bath configured to store a processing liquid therein, a transporter configured to immerse a substrate holder, holding a substrate, in the processing liquid, raise the substrate holder out of the processing bath, and transport the substrate holder in a horizontal direction, and a gas flow generator configured to generate a clean gas flow forward of the substrate with respect to a direction in which the substrate holder is transported. The transporter moves the gas flow generator together with the substrate holder in the horizontal direction while transporting the substrate holder in the horizontal direction.

Metal coating device and method for production of double-layered and copper coated pipe

The invention is a metal coating device in which the sheet metal fed to a coating container for being copper-coated by electrolysis in the coating container comprising a first roll device having a roll in contact with the sheet metal forwarded in the vertical position and having a rotational axis perpendicular thereto, a carrier body bearing the roll and a current transmitted via a current plate electrically connected to a power source, a coal device which includes an electric current carrying coals from the carrier body to the roll and a cooling chamber provided around the region where the current plate is connected to the carrier body and through which a cooling liquid flows.

METHOD AND APPARATUS FORMING COPPER (Cu) OR ANTIMONY (Sb) DOPED ZINC TELLURIDE AND CADMIUM ZINC TELLURIDE LAYERS IN A PHOTOVOLTAIC DEVICE

A method and apparatus for an amount of Cu or Sb dopant incorporated into a zinc-based layer as the layer is being formed. The layer is formed over a coated substrate using an electrochemical deposition (ECD) process. In the ECD process, the bias voltage and plating solution composition may be systematically changed during the electrochemical deposition process to change the amount of Cu or Sb dopant incorporated into the plated layer. 1. An electrochemical deposition system comprising:a first plating solution comprising a dopant, a complexing agent and a zinc-based semiconductor solute; anda first electrochemical deposition unit for forming at least a first portion of a doped zinc-based semiconductor layer on a partially completed photovoltaic device placed in the first plating solution, wherein the first electrochemical deposition unit is configured to incorporate the dopant from the first plating solution into the doped zinc-based semiconductor layer during a deposition process.2. The system of claim 1 , wherein the dopant in the first plating solution is a Cu dopant or an Sb dopant.3. The system of claim 1 , wherein the complexing agent in the first plating solution is at least one of citrate claim 1 , phenathroline claim 1 , thoicyanate claim 1 , halides claim 1 , pyridines or their derivatives.4. The system of claim 3 , wherein the first electrochemical deposition unit comprises:a first plating bath for containing the first plating solution, wherein the first plating solution is contacted with the partially completed photovoltaic device;a first heater below the first plating bath for heating the first plating solution to a predetermined temperature; anda power source electrically connected to the partially completed photovoltaic device for generating a bias voltage across the partially completed photovoltaic device when it is in contact with the first plating solution.5. The system of claim 4 , wherein the semiconductor solute comprises solutes of zinc (Zn) ...

EQUIPMENT AND METHOD FOR LIQUID TREATMENT

PROBLEM TO BE SOLVED: To provide an equipment and a method of liquid treatment, which can improve uniformity of liquid treatment to be performed on a substrate to be treated. SOLUTION: This method comprises contacting the wafer W with a plating liquid by lowering a holding part 31 for holding a wafer W; heating the wafer W in the state with a resistor exothermic body 46 arranged in the holding part 31, so that the temperature of the wafer W can become gradually higher in the center than the contour parts; and then applying voltage between an anode electrode 22 and the wafer W, to plate the surface to be plated of the wafer W. COPYRIGHT: (C)2002,JPO ...

СПОСОБ МИКРОПЛАЗМЕННОГО ОКСИДИРОВАНИЯ ВЕНТИЛЬНЫХ МЕТАЛЛОВ И ИХ СПЛАВОВ И УСТРОЙСТВО ДЛЯ ЕГО ОСУЩЕСТВЛЕНИЯ

Изобретение относится к микроплазменной электрохимической обработке поверхности металлических изделий и может быть использовано в машиностроении, самолетостроении, нефтехимической, нефтяной и других отраслях промышленности. Предложен способ микроплазменного оксидирования вентильных металлов и их сплавов, включающий погружение детали в электролит, задание в электрической цепи начальной силы поляризующего тока, выдержку детали до формирования покрытия заданной толщины, снятие формирующего напряжения, извлечение детали и последующую промывку детали и отличающийся тем, что погружение детали в электролит ведут с постоянной скоростью, определяемой зависимостью: V = А ехр(В • N), где V - скорость погружения детали, дм2/мин; N - выходная мощность источника питания, а после окончания формирования покрытия напряжение в электрической цепи уменьшают до появления на обрабатываемой поверхности одиночных блуждающих микроплазменных разрядов и осуществляют выдержку до момента полного гашения одиночных блуждающих ...

УСТРОЙСТВО ДЛЯ ОХЛАЖДЕНИЯ ЭЛЕКТРОЛИТА ( ВАРИАНТЫ)

... 1. Устройство для охлаждения электролита, содержащее корпус в виде башни с дном, расположенным выше нулевой отметки, окна для подачи охлаждающего воздуха, патрубки для подвода и отвода электролита и сопла для разбрызгивания электролита, расположенные выше окон для подачи охлаждающего воздуха, отличающееся тем, что оно дополнительно снабжено кессонами, уложенными вплотную друг к другу по всему сечению дна башни, верхняя часть которых выполнена из П-образного свинцового профиля, а нижняя - из полимерного материала, и брызгоуловителями, расположенными в верхней части башни в виде конусов, установленных на разных уровнях, на поверхности которых радиально в шахматном порядке выполнены прорези с отогнутыми V-образными пластинами. 2. Устройство для охлаждения электролита, содержащее корпус в виде башни с дном, расположенным выше нулевой отметки, окна для подачи охлаждающего воздуха, патрубки для подвода и отвода электролита и сопла для разбрызгивания электролита, расположенные выше окон для подачи ...

Способ реализации конструкции ванны щелочного оксидирования стальных деталей

FIELD: manufacturing technology. SUBSTANCE: invention relates to production of baths for application of chemical coatings, particularly baths for alkaline oxidation of steel parts, which can be used both in automotive, and in mechanized or manual lines of galvanochemical treatment. Method includes formation by means of welding in bath body of inner reservoir of rectangular shape, consisting of bottom, side and end walls with horizontal sides, and equipping it with windows located in the upper part for connection to the exhaust ventilation bath, equipping the bath with a water supply pipeline and/or a drain pipe, heat insulation and electric heating elements. At that, side walls of the inner reservoir of the bath body are made with developed surface, and in compartments formed by side walls of reservoir and side walls of bath body, electric heating elements are arranged. At that, developed surface of side walls of bath body is made in the form of sets interconnected by welding or obtained by pressing, arranged vertically or horizontally of semi-cylindrical profiles, connected, by welding, directly or through coupling elements, respectively, with the bottom, the vertical part of the side walls of the inner bath body and the end walls of the inner reservoir of the bath body. Bath body bottom is double and electric heating elements are arranged in compartments under bottom of bath. EFFECT: enlarging the type and/or number of surfaces and heating elements of the treatment medium of the bath and versions of their placement in the bath of alkaline oxidation of steel parts. 9 cl, 7 dwg РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2 701 334 C1 (51) МПК C25D 17/02 (2006.01) C25D 21/02 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ИЗОБРЕТЕНИЯ К ПАТЕНТУ (52) СПК C25D 17/02 (2019.08); C25D 21/02 (2019.08) (21)(22) Заявка: 2018133752, 24.09.2018 (24) Дата начала отсчета срока действия патента: (73) Патентообладатель(и): Алексеев Андрей Николаевич (RU) ...

VORRICHTUNG ZUM KUEHLEN ELEKTRISCHER EINRICHTUNGEN

VERFAHREN ZUM SCHNELLEN GALVANISCHEN ABLAGERN VON GOLD AUS EINEM GOLDELEKTROLYTEN AUF EINER UNTERLAGE UND WAESSERIGER GOLDGALVANISIEUNGSELEKTROLYT ZUR DURCHFUEHRUNG DES VERFAHRENS

COATING PROCESS AND APPARATUS WITH IMPROVED RESISTANCE TO BACTERIA

A coating process using an aqueous coating or aqueous rinse includes a step in which at least a part of the aqueous coating, aqueous rinse, and/or an aqueous component added to the aqueous coating or aqueous rinse is pasteurized. The pasteurization may be carried out continuously in a circulation loop of a tank containing the material or in a line carrying the material to a sprayhead.

Electroplating solution heating device for electroplating

Electroplating device for producing HDI board

High-temperature phosphating tank heating device

Cyclic energy-saving constant temperature treatment equipment for aluminum oxidation processing

Ultrathin polar plate electrolytic cell

The Heat e xchanging unit of organic resin feeding tank in the EG organic resin steel sheets manufacturing line.

HEATER APPARATUS FOR TREATMENT TANK

The present invention provides a heater apparatus for a treatment tank which prevents damage to a pump. The heater apparatus heats plating liquid of a treatment tank (1) or chemicals such as a chemical treatment agent, comprising: a quartz heater pipe (10) installed in the treatment tank (1), wherein an upper end thereof is opened; a heater heat generation unit (20) accommodated in the quartz heater pipe (10); a first connector (30) having a short PVC pipe shape to be coupled to an upper end of the quartz heater pipe (10); a second connector (50) formed from PVC, wherein one end thereof is detachably coupled to the first connector (30) to communicate with the opened upper end of the quartz heater pipe (10), and a through hole formed on the other end thereof; a cable (60) extended from the heater heat generation unit (20) to the outside through the through hole of the second connector (50); and a PVC tube (70) enclosing the cable (60), wherein one end thereof is fixated on an end of the ...

GULDELEKTROLYT

Electro-deposition system and method thereof

The present invention provides an electro-deposition system. The electro-deposition system includes an electrode for connecting a sample, a power providing device for directly applying the heat energy on the sample, an electro-plating solution for immersing the sample therein and an external circuit for providing a current. The electro-deposition method of the present invention includes the steps of heating the sample directly by the power providing device and providing the current by the external circuit so that an electro-deposition process can be performed on the electro-plating solution, the electrode and the sample.

COATING SUBSTRATES

A method of coating is disclosed in which a substrate and plating solution are placed in a container and heated by a microwave power source. This produces coatings which can have superior coating rates, grain structure and hardness as well as providing cleaner treatment conditions. The coating process may be electroless plating or electrolytic plating.

Method of temporarily, then permanently, connecting to a semiconductor device

Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150° C., and can be completed in less than 60 minutes.

Process for producing an iron-tin layer on a packaging steel substrate

A production process for producing an iron-tin alloy layer on a packaging steel substrate and to a substrate provided with said layer wherein one or both sides of a SR- or DR-blackplate substrate is coated with an iron-tin alloy layer which contains at least 80 weight percent (wt. %) of FeSn (50 at. % tin and 50 at. % iron).

APPARATUS FOR DEPOSITING METAL MOLDING MATERIAL OF PROSTHESIS FOR DENTISTRIES BY ELECTROPLATING

PROBLEM TO BE SOLVED: To provide an apparatus for depositing a metal material of prosthesis for dentistries in which a system to heat an electrolyte bath, a beaker, a swirling system, an anode, a cathode and a power supply unit are installed to shorten the deposition period. SOLUTION: The heating system consists of not less than one infrared radiator 7, and the principal element of the emission from the infrared radiator 7 is prescribed to be within the wavelength of 0.5-1000μm. COPYRIGHT: (C)2004,JPO ...

PLATING METHOD AND APPARATUS THEREFOR

PROBLEM TO BE SOLVED: To surely penetrate and supply a plating liquid into microgrooves on a substrate by immersing a substrate to be plated into this plating liquid, reducing the pressure in a plating tank and dearating the gas adhered to the surface of the substrate to be plated and dissolved into the plating liquid, then reducing the pressure of the plating liquid to its saturation vapor pressure or below thereby boiling the plating liquid. SOLUTION: The substrate 2 to be plated is immersed into the plating liquid 9 in the plating tank 1 and thereafter, the inside of the tank is evacuated by a vacuum pump 21. The residual air in the microgrooves on the substrate 2 expands in its volume and part thereof is released from the microgrooves. When the pressure is restored to the atm. pressure, the air in the microgrooves reduces its volume and the plating liquid 9 partly intrudes into part of the microgrooves. When the pressure in the tank is further reduced, the air bubbles of the dissolved ...

СПОСОБ МИКРОПЛАЗМЕННОГО ОКСИДИРОВАНИЯ ВЕНТИЛЬНЫХ МЕТАЛЛОВ И ИХ СПЛАВОВ И УСТРОЙСТВО ДЛЯ ЕГО ОСУЩЕСТВЛЕНИЯ

... 1. Способ микроплазменного оксидирования вентильных металлов и их сплавов, включающий погружение детали в электролит, задание в электрической цепи начальной силы поляризующего тока, достаточной для возникновения на погруженной в электролит поверхности обрабатываемой детали перемещающихся микроплазменных разрядов, выдержку детали до формирования покрытия заданной толщины, снятие формирующего напряжения, извлечение детали, и последующую промывку детали, отличающийся тем, что погружение детали в электролит ведут с постоянной скоростью, определяемой зависимостью V = A • exp (B • N), где V - скорость погружения детали, дм2/мин, N - выходная мощность источника питания, (B•A); A - (0,05 - 0,5) дм2/мин; В - (1,5 - 2,5)•10-5(1/B•A), а после окончания формирования покрытия напряжение в электрической цепи уменьшают до появления на обрабатываемой поверхности одиночных блуждающих микроплазменных разрядов и осуществляют выдержку погруженной обрабатываемой поверхности детали в электролите до момента полного ...

Badwärmvorrichtung zur Erwärmung eines galvanischen Bades

Badwärmvorrichtung (1) zur Erwärmung eines galvanischen Bades mit einem heizbaren Tauchabschnitt (3) zum Eintauchen in das galvanische Bad, mit einem externen Füllstandsensor (10) zur Detektion der Unterschreitung eines nominellen Mindestfüllstands des galvanischen Bads sowie mit einem externen Temperatursensor (9) zur Detektion der Temperatur des galvanischen Bads, gekennzeichnet durch einen weiteren Temperatursensor (13) zur Detektion einer Überwachungstemperatur des heizbaren Tauchabschnitts (3) und eine Auswerteschalteinrichtung (21), wobei die Auswerteschalteinrichtung (21) zur Bestimmung eines Zustands des galvanischen Bads durch Auswertung der Überwachungstemperatur des heizbaren Tauchabschnitts (3) ausgebildet ist.

An electric heating unit for corrosive baths

... 1,070,849. Immersion heaters. VULCAIN. Sept. 22, 1964 [Sept. 23, 1963], No. 38654/64. Heading H5H. To prevent corrosion of the metal tube 1 enclosing an insulated electric resistance for heating corrosive liquids, the tube is covered by a thin layer 6 of plastics material which contracts under heat and extends to the supply cable 5. The layer may comprise nylon or an epoxy resin and may be applied by spraying, dipping or using a plastics tube passed over the tube 1.

Improvements in or relating to Heat Exchangers for Cooling Electrical Apparatus.

... 1,180,803. Transformers. UDYLITE CORP. 23 June, 1967 [23 June, 1966], No. 29158/67. Heading H1T. A cooling system for a transformer enclosure 8 comprises a blower 40 which blows cooling air from an inlet 26 over the electrical components to an outlet 28, and a removable housing 80 which is bolted to the enclosure when additional cooling thereof is required, the housing including at least one heat exchange module having a tube through which cooling water is passed and the air exhausted from the enclosure 8 being passed over the or each module and returned to the enclosure.

A HEATING PROCEDURE AND A HEATING DEVICE IN CLOSE HEADS FOR THE SEMICONDUCTOR WAFER PRODUCTION

Plasma electroplating

Wire bonding, severing, and ball forming

Experimental device for producing electroplated diamond wires and experimental method

Assembly of an electronic component with spring packaging

Special heat pump of multi -functional electroplating

The utility model discloses a special heat pump of multi -functional electroplating, including the heating plating bath, titanium pipework condensation ware, a compressor, main road air side choke valve, the bypass choke valve, air side evaporimeter, economic ware, the cross valve, its characterized in that has increased the cooling plating bath, and cooling titanium pipe evaporimeter, the setting of titanium pipe evaporimeter is in the cooling plating bath, titanium pipe evaporimeter and air side evaporimeter parallel connection are between economic ware and compressor, titanium pipe evaporimeter is connected with economic ware through the conversion cross valve with air side evaporimeter, but control conversion cross valve time sharing option titanium pipe evaporimeter and its the evaporimeter effect together of air side evaporimeter. Can lower the temperature for the plating solution in the plating solution in the heating, simultaneously can the controlled heating groove and the temperature ...

Electroplate dry bucket

Copper foil electrolysis heat abstractor

Laboratory is with multi -functional anodic oxidation equipment

The invention discloses a nickel plating device beneficial to improving the nickel plating efficiency

Electroplating cooling device on basis of single chip microcomputer control

IMPROVEMENTS WITH THE MANUFACTURE OF SEMICONDUCTOR DEVICES

PROCESS OF THERMAL TRANSFER Of ENERGY

Process of adjustment of the temperature of the baths of galvanic treatment and other baths of surface dressing, in particular of the baths of bonderization, and device for the implementation of this process

PLATING METHOD

Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv) with heated substrate and cooled electrolyte

Process of electrodepositing a metal in a high aspect ratio via in a silicon substrate to form a through-silicon-via (TSV), utilizing an electrolytic bath including a redox mediator, in an electrolytic metal plating system including a chuck adapted to hold the silicon substrate and to heat the silicon substrate to a first temperature, a temperature control device to maintain temperature of the electrolytic bath at a second temperature, in which the first temperature is maintained in a range from about 30° C. to about 60° C. and the second temperature is maintained at a temperature (a) at least 5° C. lower than the first temperature and (b) in a range from about 15° C. to about 35° C.

APPARATUS FOR MANUFACTURING MOLD FOR NANOIMPRINTING AND METHOD OF MANUFACTURING MOLD FOR NANOIMPRINTING

An apparatus for manufacturing a mold for nanoimprinting and a method of manufacturing a mold for nanoimprinting are provided. The apparatus for manufacturing the mold for nanoimprinting performs an anodic oxidation treatment to an aluminum substrate with an electrolytic solution and is characterized in that at least a material of a surface of a portion contacting with the electrolytic solution is a metal or an alloy thereof, having an eluted amount of 0.2 ppm/cmor less per unit area when immersed in 80 ml of the electrolytic solution at room temperature for 450 hours. The method of manufacturing the mold for nanoimprinting is characterized in using the apparatus for manufacturing the mold for nanoimprinting to carry out the anodic oxidation treatment. The manufacturing apparatus and manufacturing method of the invention suppress metal elution into the electrolytic solution during the anodic oxidation treatment. 1. An apparatus for manufacturing a mold for nanoimprinting , which performs an anodic oxidation treatment to an aluminum substrate in an electrolytic solution , and is characterized in that at least a material of a surface of a portion in contact with the electrolytic solution is a metal of the following criteria or an alloy of the metal of the following criteria:{'sup': '2', 'an eluted amount of the metal per unit area when immersed in 80 mL of the electrolytic solution for 450 hours at room temperature is 0.2 ppm/cmor less.'}2. The apparatus of claim 1 , wherein the electrolytic solution is oxalic acid.3. The apparatus of claim 2 , wherein the material of the surface of the portion in contact with the electrolytic solution is zirconium or an alloy thereof.4. The apparatus of claim 2 , wherein the material of the surface of the portion in contact with the electrolytic solution is tantalum or an alloy thereof5. The apparatus of claim 1 , wherein the electrolytic solution is sulfuric acid.6. The apparatus of claim 5 , wherein the material of the surface of ...

DYNAMIC CURRENT DISTRIBUTION CONTROL APPARATUS AND METHOD FOR WAFER ELECTROPLATING

Methods, systems, and apparatus for plating a metal onto a work piece are described. In one aspect, an apparatus includes a plating chamber, a substrate holder, an anode chamber housing an anode, an ionically resistive ionically permeable element positioned between a substrate and the anode chamber during electroplating, an auxiliary cathode located between the anode and the ionically resistive ionically permeable element, and an insulating shield with an opening in its central region. The insulating shield may be movable with respect to the ionically resistive ionically permeable element to vary a distance between the shield and the ionically resistive ionically permeable element during electroplating. 1. An apparatus comprising:(a) a plating chamber configured to contain an electrolyte and an anode while electroplating metal onto a substrate;(b) a substrate holder configured to hold the substrate such that a plating face of the substrate is positioned at a distance from the anode during electroplating, the substrate holder having one or more electrical power contacts arranged to contact an edge of the substrate and to provide electrical current to the substrate during electroplating;(c) an ionically resistive ionically permeable element positioned between the substrate and the anode, the ionically resistive ionically permeable element having a flat surface that is substantially parallel to and separated from the plating face of the substrate;(d) a shield positioned between the ionically resistive ionically permeable element and the anode, the shield being movable with respect to the ionically resistive ionically permeable element to vary a distance between the shield and the ionically resistive ionically permeable element during electroplating, the shield including an opening in the central region of the shield; and(e) an auxiliary cathode located between the anode and the ionically resistive ionically permeable element, and peripherally oriented to shape the ...

Electro-Depositing Metal Layers of Uniform Thickness

The invention is an apparatus and method for forming highly uniform layers of metal on a substrate by electro-deposition. The substrate is electroplated in a bath composed of a quiescent (i.e., no external agitation) electrolyte solution using an effective constant current density carefully selected to match the chemical composition of the electrolyte. 1. In an electrodeposition process for electroplating at least one uniform layer of a metal on an cathodic substrate in an electroplating bath containing a suitable electroplating solution , the improvement comprising conducting the electroplating process (1) without external agitation of the electroplating solution and (2) under an effective current density or effective voltage to obtain the at least one uniform layer of a semi-conducting metal on the substrate.2. The process according to claim 1 , wherein the improvement additionally comprises disposing the cathode and anode within the bath in closely spaced-apart relation to each other and such that their longitudinal axes are disposed horizontally.3. The process according to claim 2 , wherein the cathode is positioned above the anode.4. The process according to wherein the cathodic substrate comprises a metal or metal alloy selected from the group consisting of titanium claim 1 , molybdenum claim 1 , chromium claim 1 , nickel and stainless steel.5. The process according to wherein the electroplating solution comprises a metal or metal salt selected from the group consisting of copper claim 1 , indium claim 1 , nickel claim 1 , gallium claim 1 , tin claim 1 , zinc claim 1 , cadmium claim 1 , tellurium claim 1 , selenium claim 1 , gold claim 1 , silver claim 1 , thallium and tungsten.6. The process according to wherein the current density during the process is maintained between about 0.35 and about 10.7 ASF.7. The process according to wherein the electroplating process is carried out with two to five different metals selected from the group consisting of copper ...

SYSTEM, METHOD AND APPARATUS FOR MEASURING ELECTROLYSIS CELL OPERATING CONDITIONS AND COMMUNICATING THE SAME

System, method and apparatus for measuring electrolysis cell operating conditions and communicating the same are disclosed. The system includes a selectively positionable member coupled to an analytical apparatus, wherein the selectively positionable is configured to move the analytical apparatus into and out of physical communication with a bath. The system may also include a crust breaker for breaking the surface of a bath and an electronic device for measuring bath level. 1. A system comprising: a metal electrolysis cell comprising a bath; and a selectively positionable member coupled to an analytical apparatus , wherein the selectively positionable member is operable to move the analytical apparatus from a first position to a second position , wherein in the first position the analytical apparatus is not in physical communication with the bath , wherein in the second position the analytical apparatus is in physical communication with the bath , and wherein the analytical apparatus is configured to measure at least one operating condition related to the bath and communicate the measured operating condition to a host computer through a network.2. The system of claim 1 , further comprising an electronic device coupled to at least one of the selectively positionable member and the analytical apparatus claim 1 , wherein the electronic device detects a delta between the first position and the second position claim 1 , and communicates the delta to the host computer through the network.3. The system of claim 2 , wherein the analytical apparatus and the electronic device are integrated claim 2 , and wherein the selectively positionable member claim 2 , the analytical apparatus and the electronic device are automated.4. The system of claim 2 , wherein the operating condition comprises bath superheat claim 2 , bath temperature claim 2 , bath constituent concentration claim 2 , bath constituent ratio claim 2 , and bath level.5. The system of claim 4 , wherein the metal ...

SYSTEM AND PROCESS FOR PRODUCING LITHIUM

A decoupled plating system is provided for producing lithium. In a general embodiment, the present disclosure provides a feed tank configured to supply a lithium-rich aqueous electrolyte stream, a plating tank that is configured to receive an organic electrolyte and plate out lithium metal from that organic electrolyte, and one or more lithium replenishment cells configured to receive both electrolytes, keep them separated, and selectively move lithium ions from the aqueous electrolyte into the spent organic electrolyte stream. The present system and process can advantageously reduce operating costs and/or improve energy efficiency in production of lithium metal and associated products. 1. A lithium producing system comprising:a plating tank configured to receive an organic electrolyte;an anode provided within the plating tank;a substrate spaced apart from the anode and provided within the plating tank, wherein the anode and the substrate are configured to apply a potential to the substrate, whereupon lithium is plated onto the substrate from the organic electrolyte, and a spent electrolyte stream is discharged; andone or more lithium replenishment cells configured to receive the spent electrolyte stream and to form one or more regenerate electrolyte streams.2. The lithium producing system of claim 1 , wherein the anode comprises a substantially planar mesh structure.3. The lithium producing system of claim 1 , wherein the substrate comprises a substantially planar body portion.4. The lithium producing system of claim 1 , wherein the plating tank includes one or more sidewalls claim 1 , and the anode and the substrate are coupled to the one or more sidewalls.5. The lithium producing system of claim 1 , wherein the substrate measures approximately 12.7 cm or greater in the longest dimension.6. The lithium producing system of claim 1 , wherein the organic electrolyte comprises a DMC-LiPF6 mix.7. The lithium producing system of claim 1 , wherein the one or more lithium ...

FABRICATING METHOD AND FABRICATING APPARATUS FOR SECONDARY BATTERY

To provide a fabricating method and a fabricating apparatus for a lithium-ion secondary battery having stable charge characteristics and lifetime characteristics. A positive electrode is subjected to an electrochemical reaction in a large amount of electrolytic solution in advance before a secondary battery is completed. In this manner, the positive electrode can have stability. The use of the positive electrode enables fabrication of a highly reliable secondary battery. Similarly, a negative electrode is subjected to an electrochemical reaction in a large amount of electrolytic solution in advance. The use of the negative electrode enables fabrication of a highly reliable secondary battery. 1. A fabricating apparatus comprising:a container configured to hold an electrolytic solution;a mechanism for holding a first electrode;a first cord configured to electrically connect the first electrode to a controller; anda second cord configured to electrically connect a second electrode including an active material to the controller,wherein the controller is configured to control oxidation treatment or reduction treatment on the second electrode.2. The fabricating apparatus according to claim 1 , further comprising a means for stirring the electrolytic solution.3. The fabricating apparatus according to claim 2 , wherein the means for stirring the electrolytic solution is a magnet stirrer.4. The fabricating apparatus according to claim 1 , further comprising a pump for bubbling the electrolytic solution with argon.5. The fabricating apparatus according to claim 1 , further comprising a means for heating the electrolytic solution.6. The fabricating apparatus according to claim 1 , further comprising an exhaust means for exhausting a gas in the container.7. A fabricating method for a secondary battery claim 1 , comprising:forming a first electrode including a positive electrode active material layer;forming a second electrode including a negative electrode active material layer ...

SEMICONDUCTOR MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

A semiconductor manufacturing apparatus according to an embodiment includes a container that stores a processing liquid for plating processing of a substrate. A holder can hold the substrate. A cooler cools the substrate to a temperature lower than a temperature of the processing liquid before the holder immerses the substrate in the processing liquid in the container. 1. A semiconductor manufacturing apparatus comprising:a container storing a processing liquid for plating processing of a substrate;a holder capable of holding the substrate; anda cooler cooling the substrate to a temperature lower than a temperature of the processing liquid before the holder immerses the substrate in the processing liquid in the container.2. The apparatus of claim 1 , wherein the cooler stops cooling the substrate after the substrate is immersed in the processing liquid in the container.3. The apparatus of claim 1 , wherein the cooler cools the substrate to 17° C. or lower.4. The apparatus of claim 2 , wherein the cooler cools the substrate to 17° C. or lower.5. The apparatus of claim 1 , further comprising a heater heating the substrate after the substrate is immersed in the processing liquid in the container.6. The apparatus of claim 2 , further comprising a heater heating the substrate after the substrate is immersed in the processing liquid in the container.7. The apparatus of claim 3 , further comprising a heater heating the substrate after the substrate is immersed in the processing liquid in the container.8. The apparatus of claim 2 , further comprising a heater heating the substrate after the substrate is immersed in the processing liquid in the container and the cooler stops cooling the substrate.9. The apparatus of claim 3 , further comprising a heater heating the substrate after the substrate is immersed in the processing liquid in the container and the cooler stops cooling the substrate.10. A semiconductor manufacturing apparatus comprising:a container storing a ...

LITHIUM-ION BATTERIES WITH NANOSTRUCTURED ELECTRODES AND ASSOCIATED METHODS OF MAKING

Several embodiments related to lithium-ion batteries having electrodes with nanostructures, compositions of such nanostructures, and associated methods of making such electrodes are disclosed herein. In one embodiment, a method for producing an anode suitable for a lithium-ion battery comprising preparing a surface of a substrate material and forming a plurality of conductive nanostructures on the surface of the substrate material via electrodeposition without using a template. 1. A method for producing an anode for a lithium-ion battery , the method comprising:providing a substrate, including a metallic material, having a nucleation layer grown thereon; andforming a plurality of freestanding conductive nanostructures on a surface of the nucleation layer via electrodeposition without using a template.2. The method of wherein:providing the substrate includes growing the nucleation layer on the substrate at a first temperature; andforming the plurality of freestanding conductive nanostructures includes forming the plurality of freestanding conductive nanostructures on the surface of the nucleation layer via electrodeposition at a second temperature different than the first temperature.3. The method of wherein forming the plurality of freestanding conductive nanostructures includes forming the plurality of freestanding conductive nanostructures on the surface of the nucleation layer via electrodeposition without using a template at a temperature greater than about 40° C.4. The method of wherein forming the plurality of freestanding conductive nanostructures includes forming a plurality of freestanding conductive nanoneedles on the surface of the nucleation layer via electrodeposition without using a template.5. The method of wherein forming the plurality of freestanding conductive nanostructures includes forming a plurality of tin nanoneedles on the surface of the nucleation layer via electrodeposition without using a template.6. The method of wherein:forming the ...

METHOD FOR PRODUCING METAL POROUS BODY, AND PLATING APPARATUS

A method for producing a metal porous body includes the steps of: performing electrical conduction treatment on a surface of a skeleton of a sheet-like resin porous body having the skeleton with a three-dimensional network structure, to obtain a conductive resin porous body having a conductive layer; performing electroplating treatment on a surface of a skeleton of the conductive resin porous body to obtain a plated resin porous body having a metal plating layer; and performing treatment of removing at least the resin porous body from the plated resin porous body to obtain a metal porous body. In the electroplating treatment, power was supplied to a rotation shaft of a rotating electrode roller by bringing a power supply brush formed by a material containing carbon as a main component into sliding contact with the rotation shaft. 1. A method for producing a metal porous body , comprising the steps of:performing electrical conduction treatment on a surface of a skeleton of a sheet-like resin porous body having the skeleton with a three-dimensional network structure, to obtain a conductive resin porous body having a conductive layer;performing electroplating treatment on a surface of a skeleton of the conductive resin porous body to obtain a plated resin porous body having a metal plating layer; andperforming treatment of removing at least the resin porous body from the plated resin porous body to obtain a metal porous body, whereinin the electroplating treatment, power was supplied to a rotation shaft of a rotating electrode roller by bringing a power supply brush formed by a material containing carbon as a main component into sliding contact with the rotation shaft.2. The method for producing a metal porous body according to claim 1 , wherein claim 1 , in the electroplating treatment claim 1 , heat generated in the power supply brush is dissipated to the outside by a heat dissipation member connected to the power supply brush.3. The method for producing a metal ...

PLASMA ELECTROLYTIC OXIDATION APPARATUS AND METHOD OF PLASMA ELECTROLYTIC OXIDATION USING THE SAME

In a plasma electrolytic oxidation apparatus and a method of plasma electrolytic oxidation using the plasma electrolytic oxidation apparatus, the plasma electrolytic oxidation apparatus includes a chamber and an electrode unit. The chamber is configured to receive an electrolyte. The electrode unit is configured to receive the electrolyte from the chamber and to treat an object with a plasma electrolytic oxidation treatment. The electrode unit includes an electrode, an enclosing part and a cover. The electrode is configured to receive a voltage from outside, and to form a receiving space in which the electrolyte is received between the electrode and the object. The enclosing part is configured to enclose a gap between the electrode and the object. The cover is configured to cover the electrode. 1. A plasma electrolytic oxidation apparatus comprising:a chamber configured to receive an electrolyte; andan electrode unit configured to receive the electrolyte from the chamber and to treat an object with a plasma electrolytic oxidation treatment, an electrode configured to receive a voltage from outside, and to form a receiving space in which the electrolyte is received between the electrode and the object;', 'an enclosing part configured to enclose a gap between the electrode and the object; and', 'a cover configured to cover the electrode., 'wherein the electrode unit comprises2. The apparatus of claim 1 , wherein the electrode further comprises:an attaching portion disposed to face the object and configured to be electrically insulated from the object,wherein the enclosing part makes contact with the attaching portion.3. The apparatus of claim 1 , wherein the electrode unit further comprises:a first cover configured to cover the electrode, and having an insulator; anda second cover configured to cover the first cover, and having a conductor.4. The apparatus of claim 3 , wherein the object and the second cover are grounded.5. The apparatus of claim 1 , wherein the ...

METAL SURFACE MODIFICATION APPARATUS

A metal surface modification apparatus, includes: a particle and solution mixing and circulating system used for providing nanoparticle solution for a workpiece; a rotating platform used for fixing the workpiece and driving the workpiece to rotate; an electrophoresis system used for depositing particles in the nanoparticle solution in the particle and solution mixing and circulating system to a surface of the workpiece according to an electrophoretic effect; and a temperature control apparatus used for changing a surface temperature of the workpiece. The metal surface modification apparatus provided in the present disclosure may perform hydrophilic and hydrophobic modification treatment on a metal surface by combining one or more different processes. 1. A metal surface modification apparatus , comprising:a particle and solution mixing and circulating system, used for providing nanoparticle solution for a workpiece;a rotating platform, used for fixing the workpiece and driving the workpiece to rotate;an electrophoresis system, used for depositing particles in the nanoparticle solution in the particle and solution mixing and circulating system to a surface of the workpiece according to an electrophoretic effect; anda temperature control apparatus, used for changing a surface temperature of the workpiece.2. The metal surface modification apparatus according to claim 1 , wherein the particle and solution mixing and circulating system comprises:a particle and solution mixing container, provided with a suction pipe and a suction pipe clamp which are used for providing the nanoparticle solution for the workpiece, wherein the suction pipe is used for sucking the nanoparticle solution to the surface of the workpiece; andone or more of a vibration apparatus, a magnetic stirring apparatus, a suspension suction apparatus and a solution circulating apparatus.3. The metal surface modification apparatus according to claim 2 , wherein the electrophoresis system comprises:an ...

SYSTEMS AND METHODS FOR PREPARING AND PLATING OF WORK ROLLS

The present embodiments are directed to systems and methods for plating of work rolls. In one embodiment, a system includes an inner tank having an inner diameter dimensioned to receive a work roll, and an outer tank, wherein the inner tank is disposed coaxially within the outer tank. The inner tank and the outer tank may each include cylindrical shapes. A temperature regulating tank, positioned outside of the outer tank, may be in fluid communication with an annular space between the inner and outer tanks. An exhaust hood having a generally ring-shaped profile including a plurality of slots formed therein may suction fumes from the inner tank. An anode configuration also is disclosed, having a shunt incorporated into the anode, wherein current going to the anode passes through the shunt. 120-. (canceled)21. A system for plating of work rolls , the system comprising:a tank having a main reservoir dimensioned to receive a work roll; anda chamber positioned within the tank, wherein introduction of a fluid towards the chamber urges a surplus of a substance within the chamber towards the main reservoir of the tank, and wherein removal of fluid from the chamber allows a portion of the substance within the main reservoir of the tank to fill the chamber, wherein a membrane separates the fluid from the substance.22. The system of claim 21 , further comprising an exhaust hood disposed over a perimeter of the tank claim 21 , the exhaust hood comprises a generally ring-shaped profile having a plurality of slots formed therein to suction fumes from the tank.23. The system of claim 21 , further comprising an anode having a shunt incorporated into the anode claim 21 , wherein current going to the anode passes through the shunt.24. The system of claim 23 , wherein the anode comprises an upper region and a lower region claim 23 , wherein the shunt separates the upper and lower regions of the anode.25. The system of claim 21 , further comprising at least one actuator operatively ...

FILM FORMATION METHOD FOR METALLIC COATING AND FILM FORMATION DEVICE FOR METALLIC COATING

It is determined whether an imaginary component at a predetermined frequency of an alternating current impedance is equal to or more than a preliminarily set film-formable value or not. The metallic coating is formed in a state where the substrate is pressed by the solid electrolyte membrane when the imaginary component is equal to or more than the film-formable value in the determining. The metallic coating is formed in a state where the pressing of the substrate by the solid electrolyte membrane is released to separate the solid electrolyte membrane from the substrate, the solid electrolyte membrane is re-tensioned with a constant tensile force, and subsequently, the substrate is pressed by the re-tensioned solid electrolyte membrane when the imaginary component is smaller than the film-formable value in the determining. 1. A film formation method for a metallic coating ,wherein a metallic coating derived from metal ions is formed on a surface of a substrate by disposing a solid electrolyte membrane between an anode and the substrate that serves as a cathode, pressing the substrate by the solid electrolyte membrane with a fluid pressure of an electrolyte that is disposed between the anode and the solid electrolyte membrane and contains the metal ions, and applying a voltage between the anode and the substrate in a state of pressing the substrate, the method comprises:measuring an alternating current impedance between the anode and the substrate in a state where the solid electrolyte membrane is in contact with the substrate;determining whether an imaginary component at a predetermined frequency of the alternating current impedance is equal to or more than a preliminarily set film-formable value or not, the imaginary component at the predetermined frequency indicating a contact state between the solid electrolyte membrane and the substrate, and a film formation becoming performable at the film-formable value;forming the metallic coating in a state where the ...

ANODIZING AND PLATING SYSTEM AND METHOD

An anodizing or plating system is provided that has a bath with an electrolytic solution into which a production part is at least partially disposed. For the anodizing process, an anodizing monitoring device is present and has a control panel at least partially disposed within the electrolytic solution. A power source for forming an electrical circuit between the power source, the bath, the production part, and the anodizing monitoring device is present. The production part and the anodizing monitoring device are arranged in parallel relationship to one another in the electrical circuit. 1. An anodizing system , comprising:a bath that has a tank and an electrolytic solution;a production part at least partially disposed within the electrolytic solution;an anodizing monitoring device having a control panel, wherein the control panel is at least partially disposed within the electrolytic solution; anda power source for imparting electrical energy to form an electrical circuit that includes the electrolytic solution, the production part, and the anodizing monitoring device in order to anodize the production part.2. The anodizing system as set forth in claim 1 , where the production part and the anodizing monitoring device are arranged in parallel relationship to one another in the electrical circuit.3. The anodizing system as set forth in claim 2 , wherein the anodizing monitoring device has an amp meter for use in measuring the amount of amperage in the anodizing monitoring device when the power source causes the electrical circuit to be formed.4. The anodizing system as set forth in claim 3 , wherein the control panel has an area of one square foot that is anodized along with the production part during anodizing of the production part claim 3 , wherein the amp meter measures the amount of current through the anodizing monitoring device such that the output of the amp meter in amps is also the amount of current density in amps per square foot claim 3 , wherein the ...

Current Monitoring for Plating

Various implementations of a method include receiving a measurement of an electrical current provided to a component undergoing electroplating, analyzing the current measurement, and adjusting the current based at least on the analyzing. The receiving, analyzing, and adjusting may be performed on a substantially continuous ongoing basis throughout the electroplating, and/or without interrupting the electroplating. In various implementations, the method includes measuring a current through a neck portion of a hangar to which the component is affixed. The adjusting may regulate the current based on a variety of conditions and target factors. 1. A method comprising:receiving a current measurement, wherein the current measurement represents a current provided to a component, while the component undergoes electroplating;analyzing the current measurement; andadjusting the current based at least on the analyzing the current measurement.2. The method of claim 1 , wherein the receiving claim 1 , the analyzing the current measurement claim 1 , and the adjusting are performed without interrupting the electroplating.3. The method of claim 1 , wherein the component comprises a semiconductor substrate claim 1 , the method comprising:coupling the semiconductor substrate to a hanger element;hanging the hanger element on a supply line;immersing at least a portion of the semiconductor substrate into an electrolyte solution; andproviding the current from the supply line, via the hanger element, to the semiconductor substrate.4. The method of claim 3 , wherein the coupling the component to the hanger element comprises:mounting the component on a jig; andmounting the jig on the hanger element.5. The method of claim 3 , comprising:wirelessly transmitting the current measurement from the hanger element to a data collection unit, wherein the current measurement is based at least on a Hall-effect measurement of a current flow through a current-throttled region of the hanger element.6. The ...

SYSTEMS AND METHODS FOR PREPARING AND PLATING OF WORK ROLLS

The present embodiments are directed to systems and methods for plating of work rolls. In one embodiment, a system includes an inner tank having an inner diameter dimensioned to receive a work roll, and an outer tank, wherein the inner tank is disposed coaxially within the outer tank. The inner tank and the outer tank may each include cylindrical shapes. A temperature regulating tank, positioned outside of the outer tank, may be in fluid communication with an annular space between the inner and outer tanks. An exhaust hood having a generally ring-shaped profile including a plurality of slots formed therein may suction fumes from the inner tank. An anode configuration also is disclosed, having a shunt incorporated into the anode, wherein current going to the anode passes through the shunt. 1. A system for plating of work rolls , the system comprising:an inner tank having an inner diameter dimensioned to receive a work roll; andan outer tank, wherein the inner tank is disposed coaxially within the outer tank.2. The system of claim 1 , wherein the inner tank and the outer tank comprise cylindrical shapes.3. The system of claim 1 , wherein an annular space is formed between the inner tank and the outer tank claim 1 , wherein temperature regulating fluid is disposed within the annular space.4. The system of claim 3 , further comprising a temperature regulating tank claim 3 , positioned outside of the outer tank claim 3 , which is in fluid communication with the annular space between the inner and outer tanks.5. The system of claim 1 , wherein the inner tank comprises titanium and the outer tank comprises steel.6. The system of claim 1 , further comprising an exhaust hood disposed over a perimeter of the inner tank.7. The system of claim 6 , wherein the exhaust hood comprises a generally ring-shaped profile having a plurality of slots formed therein to suction fumes from the inner tank.8. The system of claim 1 , further comprising a chamber positioned within the inner ...

DYNAMIC CURRENT DISTRIBUTION CONTROL APPARATUS AND METHOD FOR WAFER ELECTROPLATING

Methods, systems, and apparatus for plating a metal onto a work piece are described. In one aspect, an apparatus includes a plating chamber, a substrate holder, an anode chamber housing an anode, an ionically resistive ionically permeable element positioned between a substrate and the anode chamber during electroplating, an auxiliary cathode located between the anode and the ionically resistive ionically permeable element, and an insulating shield with an opening in its central region. The insulating shield may be movable with respect to the ionically resistive ionically permeable element to vary a distance between the shield and the ionically resistive ionically permeable element during electroplating. 1. An apparatus comprising:(a) a plating chamber configured to contain an electrolyte and an anode while electroplating metal onto a substrate;(b) a substrate holder configured to hold the substrate such that a plating face of the substrate is positioned at a distance from the anode during electroplating, the substrate holder having one or more electrical power contacts arranged to contact an edge of the substrate and to provide electrical current to the substrate during electroplating;(c) an ionically resistive ionically permeable element positioned between the substrate and the anode, the ionically resistive ionically permeable element having a flat surface that is substantially parallel to and separated from the plating face of the substrate;(d) a shield positioned between the ionically resistive ionically permeable element and the anode, the shield being movable with respect to the ionically resistive ionically permeable element to vary a distance between the shield and the ionically resistive ionically permeable element during electroplating, the shield including an opening in the central region of the shield; and(e) an auxiliary cathode located between the anode and the ionically resistive ionically permeable element, and peripherally oriented to shape the ...

APPARATUS, SECONDARY BATTERY, ELECTRONIC DEVICE, AND BATTERY MANAGEMENT UNIT

A fabricating method and a fabricating apparatus for a lithium-ion secondary battery having stable charge characteristics and lifetime characteristics are provided. A positive electrode is subjected to an electrochemical reaction in a large amount of electrolyte solution in advance before a secondary battery is completed. In this manner, the positive electrode can have stability. In a manner similar to that of the positive electrode, a negative electrode is also subjected to the electrochemical reaction in a large amount of the electrolyte solution in advance, whereby a high reliable secondary battery can be manufactured. 1. An apparatus comprising:a container;a first electrode inside the container;a first control device outside the container;a first code configured to electrically connect the first control device to the first electrode;a second code configured to electrically connect the first control device to a second electrode to be provided inside the container;a gas outlet provided inside the container and at a lower portion of the container;a lid configured to be put on a top of the container; andan exhaust port provided on the lid.2. The apparatus according to claim 1 , wherein the first electrode is provided at a bottom of the container.3. The apparatus according to claim 1 , wherein the gas outlet is coupled with a pipe introduced inside the container through the exhaust port.4. The apparatus according to claim 3 , wherein the pipe is provided with a second control device outside the container.5. The apparatus according to claim 3 , wherein the pipe is coupled with the first control device.6. The apparatus according to claim 1 , comprising a cover inside the container and over the gas outlet.7. The apparatus according to claim 1 , comprising a heater adjacent to the container.8. The apparatus according to claim 7 , wherein the heater is provided outside the container.9. An apparatus comprising:a container;a first electrode inside the container;a first ...

PLATING APPARATUS AND OPERATION METHOD THEREOF

A plating apparatus and a plating method thereof are provided. The plating apparatus includes: a tank body including at least one side wall, the at least one side wall being provided with an opening extending from the inside to the outside of the tank body, and the tank body being configured to accommodate a plating solution; a fixing device configured to fix the substrate at the opening of the side wall; at least one sealing element disposed around the opening; and a cleaning module coupled to the tank body for cleaning the at least one sealing element. A cleaning method is also provided for cleaning the at least one sealing element with the cleaning module after operation of the plating apparatus. 1. A plating apparatus for performing plating treatment on a substrate , comprising:a tank body comprising at least one side wall, the at least one side wall being provided with an opening extending from an inside to an outside of the tank body, the tank body being configured to accommodate a plating solution;a fixing device configured to fix the substrate to the outside of the tank body at the opening of the at least one side wall;at least one sealing element disposed around the opening; anda cleaning module coupled to the plating apparatus for cleaning the at least one sealing element.2. The plating apparatus according to claim 1 , whereinthe cleaning module comprises a plate assembly and a roller assembly coupled together, whereinthe plate assembly provides a mechanical support to the roller assembly and the roller assembly is configured to clean the at least one sealing element.3. The plating apparatus according to claim 2 , whereinthe roller assembly comprises a feeder roller for supplying a fresh tape to the at least one sealing element and a receiver roller for receiving a contaminated tape from the at least one sealing element, wherein the fresh tape is turned into the contaminated tape for cleaning the at least one sealing element.4. The plating apparatus ...

PLATING APPARATUS AND PLATING METHOD

Provided is a technique that allows suppressing a liquid splash of a plating solution. A plating apparatus includes a plating tank including an inner tank , a substrate holder, and a paddle configured to agitate the plating solution accumulated in the inner tank by reciprocating in a horizontal direction. The paddle is arranged to be inserted through a hole provided in an outer peripheral wall of the inner tank and to build a bridge between an inside of the inner tank and an outside of the inner tank, and the paddle includes a first portion configured to agitate the plating solution accumulated in the inner tank, a second portion arranged outside the inner tank and disposed above the first portion, and a connecting portion arranged outside the inner tank to connect the first portion to the second portion. 1. A plating apparatus comprising:a plating tank configured to accumulate a plating solution inside the plating tank, the plating tank including an inner tank provided with an anode arranged inside the inner tank;a substrate holder configured to hold a substrate as a cathode, anda paddle configured to agitate the plating solution accumulated in the inner tank by reciprocating in a horizontal direction, whereinthe paddle is arranged to be inserted through a hole provided in an outer peripheral wall of the inner tank and to build a bridge between an inside of the inner tank and an outside of the inner tank, the paddle including a first portion configured to agitate the plating solution accumulated in the inner tank, a second portion arranged outside the inner tank and disposed above the first portion, and a connecting portion arranged outside the inner tank to connect the first portion to the second portion.2. The plating apparatus according to claim 1 , whereinthe plating tank is a plating tank having a double tank structure further including an outer tank arranged outside the inner tank.3. The plating apparatus according to claim 2 , whereinthe outer tank is ...

MANDREL FOR ELECTROFORMING

An apparatus and method for a mandrel used during an electroforming process. The mandrel is formed of a structural wax and includes a metallic layer utilized to formulate a metal component. During the electroforming process, the mandrel is actively cooled utilizing a closed loop. The closed loop includes the mandrel and a heat exchanger through which a coolant flows. 1. A mandrel for an electroforming process , the mandrel comprising:a body defined by a reclaimable material; anda cooling core within the body through which a coolant can flow.2. The mandrel of wherein the reclaimable material forming the body is a structural wax material.3. The mandrel of wherein the cooling core further comprises a cooling channel.4. The mandrel of wherein at least a portion of the cooling core is removable.5. The mandrel of wherein the cooling core is a tubeless cooling core.6. The mandrel of wherein the mandrel is coated in an electrically conductive material.7. An electroforming system for forming a component with an electroforming process claim 1 , the electroforming system comprising:an electrodeposition bath within a bath tank;a circuit including an anode and a cathode in the form of a mandrel made from a reclaimable material, the anode and cathode provided in the bath tank; and a heat exchanger,', 'a cooling core formed within the mandrel, and', 'a coolant tube fluidly coupling the heat exchanger with the cooling core through which a coolant can flow., 'a coolant circuit at least partially passing through the electrodeposition bath including8. The electroforming system of wherein the reclaimable material forming the mandrel is a structural wax material.9. The electroforming system of wherein the cooling core further comprises a cooling channel.10. The electroforming system of wherein the coolant tube fluidly couples the heat exchanger to the cooling channel.11. The electroforming system of wherein the coolant tube and cooling core form a closed loop.12. The electroforming ...

DEVICE AND METHOD FOR PREVENTING BATH CRYSTALLIZATION OF SQUEEZING COMPONENT OF ELECTROPLATING EQUIPMENT

The present invention discloses a device and method for preventing bath crystallization of a squeezing component of electroplating equipment in the technical field of manufacturing of copper electroplating films. The device comprises a plating tank and a squeezing component located on the discharge end of the plating tank. A non-metallic film is squeezed by the squeezing component after being discharged from the plating tank. A wind cutting device is arranged between the plating tank and the squeezing component for wind cutting of the discharged non-metallic film; and a spraying component is arranged behind the squeezing component for spraying the squeezing component. The method comprises a step of adding a wind cutting device for wind cutting of a non-metallic film to remove bath and a step of adding a spraying component for spraying the squeezing component. In the present invention, the wind cutting device and the spraying component are added specifically to eliminate bath crystallization so as to avoid piercing or concave and convex points of non-metallic films caused by crystallization and fully improve the quality of the plating product. 1. A device for preventing bath crystallization of a squeezing component of electroplating equipment , comprising a plating tank and a squeezing component located on the discharge end of the plating tank , wherein a non-metallic film is squeezed by the squeezing component after being discharged from the plating tank , and a wind cutting device is arranged between the plating tank and the squeezing component for wind cutting of the discharged non-metallic film; and a spraying component is arranged behind the squeezing component for spraying the squeezing component.2. The device for preventing bath crystallization of a squeezing component of electroplating equipment according to claim 1 , wherein the wind cutting device comprises an upper wind cutting unit and a lower wind cutting unit claim 1 , the upper wind cutting unit is ...

FILLING DEVICE AND APPARATUS, ELECTROCHEMICAL DEPOSITION SYSTEM AND FILLING METHOD

The present disclosure relates to a filling device and apparatus, an electrochemical deposition system, and a filling method. The filling device includes: a feeding structure including a first feed port and a first discharge port; a container including a second feed port and a second discharge port; a weighing means disposed on the container; a conveying structure disposed between the first discharge port and the second feed port, the second feed port being in communication with the first discharge port via the conveying structure, and the conveying structure being configured to convey a material output from the first discharge port to the second feed port; and a control structure connected to the weighing means and the conveying structure, respectively, and configured to control a conveying speed of the conveying structure according to the weight detected by the weighing means. 1. A filling device , comprising:a feeding structure comprising a first feed port and a first discharge port;a container comprising a second feed port and a second discharge port, the second discharge port serving as a discharge port of the filling device;a weighing means disposed on the container, the weighing means being configured to detect a weight of a material in the container;a conveying structure disposed between the first discharge port and the second feed port, the second feed port being in communication with the first discharge port via the conveying structure, and the conveying structure being configured to convey a material output from the first discharge port to the second feed port; anda control structure connected to the weighing means and the conveying structure, respectively, and configured to control a conveying speed of the conveying structure according to the weight detected by the weighing means.2. The filling device according to claim 1 , wherein the conveying structure comprises:a conveying pipeline connected between the first discharge port and the second feed port; ...

CLOSED LOOP ELECTROLYTE ANALYZER

A processing system for electroplating semiconductor wafers and similar substrates includes an electrolyte tank, at least one processing chamber connected to the electrolyte tank via fluid lines, and an electrolyte analyzer. The electrolyte analyzer may have a probe, such as a voltammetry probe, in the electrolyte tank, a pump, a reservoir and at least one valve, with these components connected via fluid lines to form a fluid loop. The valve may be switchable to provide a closed fluid loop where electrolyte circulates through the probe to analyze the electrolyte, and to provide an open fluid loop to removal of the used electrolyte and introduction of fresh electrolyte from the tank into the fluid loop. The used electrolyte may be moved to a facility drain and not returned to the electrolyte tank, to reduce risk of contamination. 1. A processing system , comprising:an electrolyte tank;at least one processing chamber connected to the electrolyte tank via fluid lines;an electrolyte analyzer including a probe at least partially within the electrolyte tank, a pump, a valve switchable to a first position and to a second position, and fluid lines connecting the probe at least indirectly to the pump and to the valve, with the pump, the valve, the probe and the fluid lines forming a fluid loop, which is a closed fluid loop when the valve is in the first position, and which is an open fluid loop when the valve is in the second position.2. The processing system of further comprising a reservoir in the fluid loop.3. The processing system of claim of with the reservoir and the probe both substantially entirely within the electrolyte tank.4. The processing system of with the length of the fluid lines in the tank greater than the length of fluid lines not in the tank.5. The processing system of with the probe claim 2 , the reservoir claim 2 , the pump and the valve supported on a plate on a top surface of the tank.6. A processing system claim 2 , comprising:an electrolyte tank;at ...

Apparatus and Method for Fast Evaluation of Electroplating Formulation Performance in Microvia Filling

The presently claimed invention provides an electrochemical analytical apparatus and a method for evaluating performance of electroplating formulations of electrolyte solutions used for via filling. The electrochemical analytical apparatus comprises an electric power generating device, an electrical output signal measurement device, an electrochemical measurement device, and a motion generator. The electrochemical measurement device of the present invention comprises a supporting structure, a cavity, a cavity electrode, and a surface electrode. The electrical output signals of the cavity electrode and the surface electrode are measured during electroplating for calculating a filling performance value. The presently claimed invention provides an accurate, fast and cost effective method for evaluating performance of electroplating formulations, following with choosing the electroplating formulation of the highest FP value for actual microvia filling process. 1. An electrochemical measurement device for evaluating performance of an electroplating formulation of an electrolyte solution used for via filling , comprising:at least one supporting structure, comprising at least one measurement surface for contacting the electrolyte solution;at least one cavity, located at the supporting structure, and comprising a top cavity opening and a bottom cavity opening, wherein the top cavity opening is located on the measurement surface of the supporting structure, and allows the electrolyte solution to flow into the cavity;at least one cavity electrode, wherein the cavity electrode comprises at least one cavity electrolytic surface, which is in contact with the bottom cavity opening, and is used for being electroplated by the electrolyte solution; andat least one surface electrode, wherein the surface electrode comprises at least one top electrolytic surface, which is located on the measurement surface of the supporting structure, and is used for being electroplated by the ...

Electro-Plating and Apparatus for Performing the Same

A method of plating a metal layer on a work piece includes exposing a surface of the work piece to a plating solution, and supplying a first voltage at a negative end of a power supply source to an edge portion of the work piece. A second voltage is supplied to an inner portion of the work piece, wherein the inner portion is closer to a center of the work piece than the edge portion. A positive end of the power supply source is connected to a metal plate, wherein the metal plate and the work piece are spaced apart from each other by, and are in contact with, the plating solution.

Single Solution for Electro-Electroless Deposition of Metals

A hybrid electro-electroless deposition process whereby multiple metal films layers are deposited from a single plating solution which includes both electroless and electroplating components. The article to be plated is immersed in the solution, and electric current is selectively applied at determined voltages for predetermined times, at selected intervals to effect electroplating in conjunction with electroless deposition. Electroplated metal layers are interspersed with electroless deposited metal layers. 1. A process for deposition of a multi-layer metal coating on a metal substrate to be plated , the process comprising ,at least partially immersing said substrate into a plating bath, the plating bath comprising a reducing agent, and a source of metal plating ions, the plating ions comprising one or more from the grouping consisting of copper ions, gold ions, nickel ions, zinc ions, silver ions, boron ions, cobalt ions and phosphorous ions,providing a sacrificial metal anode and cathode in said plating bath, and electrically connecting said anode and cathode,selectively supplying power to said anode, wherein said power is supplied in a pulsed time-wise manner to alternately effect anode oxidation and the formation of an electro-deposition plating layer of metal ions from the anode on the substrate, and the formation of an electroless deposition plating layer of the plating ions from the bath solution.2. The process of claim 1 , wherein said substrate is provided as said cathode.3. The process of claim 1 , wherein the plating ions comprise gold and/or copper ions.4. The process of claim 1 , further comprising maintaining the plating bath at a temperature of between about 40° C. to less than about 99° C. claim 1 , and preferably from about 95° C. to about 98° C.5. The process of claim 1 , wherein said plating ions are gold ions claim 1 , and said anode comprises a metal selected from the group consisting of nickel claim 1 , a nickel alloy and cobalt.6. (canceled)7 ...

Electrolyte for the electrolytic deposition of silver-palladium alloys and method for deposition thereof

The present invention relates to an electrolyte and to a method for the electrolytic deposition of silver-rich silver-palladium alloys which to a minor degree also include selenium and/or tellurium. The electrolyte of the invention allows uniform deposition of such an alloy on conductive surfaces across a wide range of current densities.

APPARATUS AND PROCESS OF ELECTRO-CHEMICAL PLATING

An electro-chemical plating process begins with supplying a supercritical fluid into an electroplating solution to be deposited, and a bias is applied between a substrate and an electrode, which is located in the electroplating solution. The substrate is placed into the electroplating solution to deposit a material on the substrate. 1. An electro-chemical plating (ECP) process , comprising:supplying a supercritical fluid into an electroplating solution to be deposited;applying a bias between a substrate and an electrode, wherein the electrode is located in the electroplating solution; andplacing the substrate into the electroplating solution to deposit a material on the substrate.2. The ECP process of claim 1 , wherein the electroplating solution comprises a plurality of ions of the material.3. The ECP process of claim 2 , wherein the bias promotes diffusion of the ions of the material towards the substrate claim 2 , and the ions are reduced to form the material on the substrate.4. The ECP process of claim 1 , wherein the substrate acts as a cathode claim 1 , and the electrode acts as an anode during applying the bias between the substrate and the electrode.5. The ECP process of claim 1 , wherein the substrate is placed into the electroplating solution in substantially parallel to a surface of the electroplating solution.6. The ECP process of claim 1 , further comprising filtering impurities in the supercritical fluid before supplying the supercritical fluid into the electroplating solution.7. The ECP process of claim 1 , wherein the supercritical fluid is a substance at a temperature and pressure above a critical point of the substance.8. An electro-chemical plating (ECP) process claim 1 , comprising:preparing a supercritical fluid from a substance;supplying the supercritical fluid into an electroplating solution;placing a substrate into the electroplating solution;electroplating the substrate; andrecycling the substance from the electroplating solution.9. The ECP ...

ELECTROPLATING PROCESSOR WITH WAFER HEATING OR COOLING

In electroplating a wafer, the front and/or back side of the wafer is heated or cooled during processing. The wafer may be in contact with a backing plate of an electroplating processor. The backing plate may be heated via electrical heaters, by radiant heaters, or via a heated liquid or gas. The backing plate may alternatively be cooled using electric coolers or cooled liquid or gas. The heated or cooled backing plate then heats or cools the back side of the wafer largely via conduction. 1. A method for electroplating a wafer , comprising:moving a front side of a wafer into contact with an electrolyte;passing electric current through the electrolyte and through a conductive film on the wafer; andheating or cooling the wafer to a temperature different from the temperature of the electrolyte.2. The method of comprising heating or cooling the back side of the wafer.3. The method of further including placing the wafer into a processor having a backing plate with the back side of the wafer in contact with the backing plate claim 2 , and heating or cooling the wafer by heating or cooling the backing plate.4. The method of including heating the back side of the wafer by heating the backing plate via at least one electric resistive heater on or in the backing plate.5. The method of further comprising heating or cooling the back side of the wafer by applying a fluid onto the back side of the wafer.6. The method of with the fluid comprising a heated or cooled liquid or gas.7. The method of comprising heating the back side of the wafer via at least one radiant heat source.8. The method of comprising heating the back side of the wafer via direct impingement of radiant heat onto the back side of the wafer.9. The method of comprising indirectly heating the back side of the wafer by heating a backing plate via the radiant heat source claim 7 , with the backing plate conducting heat to the back side of the wafer.10. An electroplating apparatus comprising:a vessel holding an ...

A METAL COATING DEVICE AND METHOD FOR PRODUCTION OF DOUBLE-LAYERED AND COPPER COATED PIPE

The invention is a metal coating device in which the sheet metal fed to a coating container for being copper-coated by electrolysis in the coating container comprising a first roll device having a roll in contact with the sheet metal forwarded in the vertical position and having a rotational axis perpendicular thereto, a carrier body bearing the roll and a current transmitted via a current plate electrically connected to a power source, a coal device which includes an electric current carrying coals from the carrier body to the roll and a cooling chamber provided around the region where the current plate is connected to the carrier body and through which a cooling liquid flows. 1. A metal coating device in which a sheet metal fed through a coating container , wherein the sheet metal is coated with copper by an electrolysis method characterized in that a first roll assembly comprising:a roll in continuous contact with the sheet metal, moving in a vertical position and having a perpendicular axis of rotation,a carrier body bearing the roll and electrically connected thereto by a current plate electrically bonded to a power source,a coal system comprising coals conveying electric current to the roll from the carrier body of the fixed structure,. anda cooling chamber which is configured to flow a cooling liquid externally fed through it and provided in vicinity of a region to which at least the current plate is connected to the carrier body.2. The metal coating device according to claim 1 , further comprising the equivalent of a first roll device and according to this a second roll device configured to transfer continuous electrical current to the sheet metal through the roll that is provided in the continuation of the first roll device.3. The metal coating device according to claim 2 , further comprising a third roll device provided in the continuation of the second roll device which is identical to the first roll device and is accordingly configured to deliver ...

Electrolytic solution, secondary battery, electronic device, and method of manufacturing electrode

To provide a method of manufacturing a lithium-ion secondary battery having stable charge characteristics and lifetime characteristics. A positive electrode is subjected to an electrochemical reaction in a large amount of electrolytic solution in advance before a secondary battery is completed. In this manner, the positive electrode can have stability. The use of the positive electrode enables manufacture of a highly reliable secondary battery. Similarly, a negative electrode is subjected to an electrochemical reaction in a large amount of electrolytic solution in advance. The use of the negative electrode enables manufacture of a highly reliable secondary battery.

PLATING DEVICE

A plating device equipped with a plating tank and an impurity removal mechanism disposed so as to remove impurities from a plating solution in the plating tank or a plating solution to be supplied to the plating tank, in which the impurity removal mechanism includes at least one of a carboxylic acid removal mechanism and an alcohol removal mechanism. 1. A plating device comprising:a plating tank; andan impurity removal mechanism connected to the plating tank so as to remove impurities from a plating solution in the plating tank or a plating solution supplied to the plating tank, whereinthe impurity removal mechanism includes at least one of a carboxylic acid removal mechanism and an alcohol removal mechanism.2. The plating device according to claim 1 , further comprising:a management tank for receiving the plating solution supplied from the plating tank and supplying the plating solution received to the plating tank again, whereinat least one of the carboxylic acid removal mechanism and the alcohol removal mechanism is connected to the management tank.3. The plating device according to claim 1 , wherein the impurity removal mechanism includes both of a carboxylic acid removal mechanism and an alcohol removal mechanism.4. The plating device according to claim 2 , wherein the impurity removal mechanism includes both of a carboxylic acid removal mechanism and an alcohol removal mechanism. The present invention relates to a plating device. More specifically, the present invention relates to a plating device for manufacturing an electrically conductive pattern used in various kinds of electronic parts, and particularly, it relates to a plating device for forming a planar coil by electroplating.In recent years, the shape of the planar coil parts used in electronic equipment is also required to be miniaturized, thinned, lightened in association with miniaturization, thinning, and weight saving of the electronic equipment, and the improvement in coil performance in the ...

METHODS AND SYSTEMS FOR ALUMINUM ELECTROPLATING

Systems and methods for coating a metallic component are provided. In one embodiment, a metallic coating may be disposed in a plating bath comprising AlBr3. The metallic coating may be coupled with, or configured as, a working electrode. A counter electrode formed of aluminum may be disposed within the plating bath. An electric current may be applied between the two electrodes resulting in the electrodeposition of aluminum on the metallic component. In one particular embodiment, the plating bath may include LiBr, KBr and CsBr, with AlBrbeing present in an amount of approximately 80 percent or greater by weight. Various types of metals may be coated with aluminum using embodiments of the present disclosure. Additionally, the methods and systems described herein are amenable to coating of complex geometries. 1. A system comprising:{'sub': '3', 'a primary crucible containing a plating bath, the plating bath comprising AlBr;'} a working electrode including a metallic workpiece comprising zirconium; and', 'a counter electrode comprising aluminum., 'an electrode assembly including2. The system of claim 1 , wherein the plating bath further comprises LiBr claim 1 , KBr claim 1 , and CsBr.3. The system of claim 2 , wherein the plating bath is a homogenous mixture.4. The system of claim 2 , wherein the plating bath does not exhibit a eutectic melting point temperature.5. The system of claim 2 , wherein the AlBris present in the plating bath in an amount of approximately 80 weight percent or greater.6. A system comprising:{'sub': '3', 'a primary crucible containing a plating bath, the plating bath comprising AlBr;'} a working electrode including a metallic workpiece; and', 'a counter electrode comprising aluminum., 'an electrode assembly including7. The system of claim 6 , wherein the plating bath further comprises LiBr claim 6 , KBr claim 6 , and CsBr.8. The system of claim 7 , wherein the plating bath is a homogenous mixture.9. The system of claim 7 , wherein the plating ...

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD USING THE SAME

An electroplating apparatus includes a plating bath and a substrate in a horizontal direction. The electroplating apparatus further includes a plurality of cathodes on first and second sides of the substrate in a first direction on one surface of the substrate, and an anode above the substrate, the anode being spaced apart from the substrate and configured to be movable in the first direction. 1. An electroplating apparatus , comprising:a plating bath;a substrate in a horizontal direction;a plurality of cathodes on first and second sides of the substrate in a first direction on one surface of the substrate; andan anode above the substrate, the anode being spaced apart from the substrate and configured to be movable in the first direction.2. The electroplating apparatus of claim 1 , wherein the plurality of cathodes includes:a plurality of first cathodes on the first side of the substrate;a plurality of second cathodes on a the second side of the substrate, the second side opposing the first side; andeach of the plurality of first cathodes is configured to correspond to each of the plurality of second cathodes.3. The electroplating apparatus of claim 2 , further comprising:a power supply unit electrically connected to the plurality of cathodes and the anode to apply a current; anda controller configured to control the power supply unit to regulate a voltage to be applied to the plurality of cathodes based on an area of plating on the substrate corresponding to the position of the anode.4. The electroplating apparatus of claim 1 , wherein a length of the anode in the first direction is shorter than a length of the anode in a second direction perpendicular to the first direction on the surface of the substrate.5. The electroplating apparatus of claim 4 , wherein the anode includes a plurality of sub-anodes claim 4 , the plurality of sub-anodes being spaced apart from each other.6. The electroplating apparatus of claim 5 , wherein the anode further includes at least one ...

SURFACE TREATMENT SYSTEM AND WORKPIECE-HOLDING JIG

A surface treatment system includes a surface treatment tank, a first guide rail and a second guide rail that extend at a position offset from a position over the upper opening of the surface treatment tank, and a plurality of transfer jigs that respectively hold a workpiece and are supported by the first guide rail and the second guide rail. The transfer jig includes a horizontal arm section, a first guide target section that is guided by the first guide rail, a second guide target section that is guided by the second guide rail, and a vertical arm section that is suspended from the horizontal arm section at a position between the first guide target section and the second guide target section, and holds the workpiece. 1. (canceled)2. (canceled)3. (canceled)4. (canceled)5. (canceled)6. (canceled)7. A workpiece-holding jig that holds a sheet-like rectangular workpiece in a solution contained in a treatment tank , the workpiece-holding jig comprising:a plurality of first chuck members that hold a first side of the rectangular workpiece;a plurality of second chuck members that hold a second side of the rectangular workpiece, the second side being opposite to the first the side in a first direction; anda frame-like member that is disposed to surround the rectangular workpiece, and supports the plurality of first chuck members and the plurality of second chuck members,the frame-like member including:a first guide section that guides the plurality of first chuck members so that the plurality of first chuck members are movable along the first direction; anda first biasing member that biases the plurality of first chuck members in one direction in which the plurality of first chuck members move away from the plurality of second chuck members along the first direction.8. The workpiece-holding jig as defined in claim 7 ,the frame-like member further including:a second guide section that guides the plurality of second chuck members so that the plurality of second chuck members ...

Electrode for an eloxal process

The present disclosure relates to an electrode for eloxing a component, in particular a component of a vehicle brake system, comprising an electrolyte inlet for feeding an electrolyte into the electrode, an inlet channel, which connects the electrolyte inlet to an electrolyte outlet opening formed in the region of an outer surface of the electrode, an electrolyte inlet opening formed in the region of the outer surface of the electrode at a distance from the electrolyte outlet opening, an electrolyte flow path, which runs between the electrolyte outlet opening and the electrolyte inlet opening along the outer surface of the electrode and is designed to bring a surface portion of the component, which surface portion is to be eloxed, into fluid contact with the electrolyte flowing through the electrolyte flow path, an outlet channel, and an electrolyte outlet.

PLATING APPARATUS

There is disclosed a plating apparatus which can dispose an anode, a substrate and a regulation plate parallel to each other in such a manner that the center of the anode, the center of the substrate and the center of an opening of the regulation plate are aligned in a straight line. A frame of the plating apparatus includes: a support for supporting upper portions of an anode holder, a substrate holder and the regulation plate; a box structure secured to the support; an upper positioning structure for fixing a relative position between the support and the upper portions of the anode holder, the substrate holder and the regulation plate; and a lower positioning structure for fixing a relative position between the box structure and lower portions of the anode holder, the substrate holder and the regulation plate. 1. A plating apparatus comprising:a plating tank;a substrate holder for holding a substrate;an anode holder for holding an anode;a regulation plate for regulating the distribution of electric potential on the substrate held by the substrate holder; anda frame for positioning the substrate holder, the anode holder and the regulation plate in the plating tank, a support for supporting upper portions of the anode holder, the substrate holder and the regulation plate;', 'a box structure fixed to the support;', 'an upper positioning structure for fixing a relative position between the support and the upper portions of the anode holder, the substrate holder and the regulation plate; and', 'a lower positioning structure for fixing a relative position between the box structure and lower portions of the anode holder, the substrate holder and the regulation plate., 'the frame including2. The plating apparatus according to claim 1 , wherein the upper positioning structure is provided on the support claim 1 , and the lower positioning structure is provided in the box structure.3. The plating apparatus according to claim 1 , wherein the upper positioning structure ...

Method and device for regenerating a platinum bath

A method of regenerating a platinum bath by flow reaction, the method comprising the successive steps of: drawing off fluid from the platinum bath by means of a draw-off flow; complexing platinum by mixing together the draw-off flow and a regeneration solution flow containing platinum, mixing taking place in an intensified reactor; and feeding the platinum bath with the mixture resulting from the platinum complexing step, by means of a regenerated bath flow; all of these steps being performed as a continuous flow.

SMART ELECTROCHEMICAL PROCESSING APPARATUS

A smart electrochemical processing apparatus includes a reaction container, an electrode unit and a surface feature scanner. The reaction container has an electrolytic tank. The electrode unit has a first electrode fixed to the electrolytic tank and a second electrode rotatably positioned at the electrolytic tank. The surface feature scanner is positioned at the electrolytic tank. Before being put in the electrolytic tank for processing, a workpiece positioned at the second electrode is scanned with the surface feature scanner while being rotated by the second electrode. After surface feature data of the workpiece have been collected, various process parameters can be adjusted to thereby achieve satisfactory surface treatment of the workpiece. 1. A smart electrochemical processing apparatus , comprising:a reaction container having an electrolytic tank;an electrode unit having a first fixed electrode positioned in the electrolytic tank of the reaction container, and a second rotatable electrode positioned in the electrolytic tank of the reaction container; anda surface feature scanner positioned at the reaction container and configured to automatically scan an intended element positioned at the second electrode and collect surface features data of the intended element.2. The smart electrochemical processing apparatus of claim 1 , wherein the reaction container further comprises a linear driver positioned on a peripheral surface of the reaction container claim 1 , and a disconnectable top cover positioned at a tank opening of the electrolytic tank and connected to the linear driver.3. The smart electrochemical processing apparatus of claim 2 , wherein the electrode unit has a rotating driver positioned at the top cover and connected to the second electrode.4. The smart electrochemical processing apparatus of claim 3 , further comprising a control unit electrically connected to the linear driver claim 3 , the rotating driver and the surface feature scanner.5. The smart ...

ADJUSTABLE AC/DC CONVERSION TOPOLOGY TO REGULATE AN ISOLATED DC LOAD WITH LOW AC RIPPLE

Electroplating and painting systems, methods and power converters are disclosed to provide regulated individual DC output signals to anode structures distributed in a plating solution in a tank to promote formation of plating material on a workpiece using a PWM inverter to generate a first AC signal, a sinewave filter to provide a filtered AC signal, a multiphase isolation transformer to provide a plurality of isolated AC signals, a multi-pulse diode bridge rectifier to provide a DC rectifier output signal, an output filter to provide a filtered DC rectifier output signal, and a blocking diode to provide the filtered DC rectifier output signal to the corresponding tank anode structure. 1. A system to apply a coating to a workpiece , comprising:a tank at least partially filled with a solution, and extending along a process direction from an entry end to an exit end;a plurality of tank anode structures mounted in distributed fashion along the process direction between the entry end and the exit end of the tank, the individual anode structures being electrically connected to the solution in the tank; an adjustable voltage, adjustable frequency pulse width modulation (PWM) inverter to generate a first AC signal,', 'a sinewave filter, including an input to receive the first AC signal, and an output to provide a filtered AC signal,', 'a multiphase isolation transformer, including a primary winding to receive the filtered AC signal, and a multiphase secondary to provide a plurality of isolated AC signals,', 'a multi-pulse diode bridge rectifier, including a plurality of rectifier inputs to receive the plurality of isolated AC signals, and a rectifier output to provide a DC rectifier output signal,', 'an output filter, including an input to receive the DC rectifier output signal, and an output to provide a filtered DC rectifier output signal, and', 'a blocking diode, including an anode connected to the output of the output filter, and a cathode to provide the filtered DC ...

MONITORING ELECTROLYTES DURING ELECTROPLATING

Methods of and apparatuses for monitoring electroplating bath quality in electroplating cells using voltage readings are described herein. Methods involve obtaining real-time voltage readings during an electroplating process and determining whether the voltage readings are within a threshold deviation of an expected voltage reading at a given time. 1. A method of controlling an electroplating cell by monitoring conditions of an electroplating bath , the method comprising:(a) reading an initial voltage between a substrate as a first electrode and a second electrode;(b) during electroplating on the substrate in the electroplating cell, repeatedly reading a voltage between the substrate and the second electrode; 'wherein the drift is determined from substrate electroplating operations that produce satisfactory electroplating results;', '(c) comparing each of the repeated readings of the voltage to a corresponding expected voltage that drifts from the initial voltage during the electroplating,'}(d) determining that one or more of the repeated readings of the voltage deviate from the corresponding expected voltage by a value greater than a threshold deviation; and(e) in response to determining that the one or more of the repeated readings of the voltage deviate from the corresponding expected voltage by a value greater than the threshold deviation, sending a notification and/or suspending operation of the electroplating cell.2. The method of claim 1 , wherein (e) further comprises placing the electroplating cell into an error state.3. The method of claim 1 , wherein the second electrode is an anode.4. The method of claim 1 , wherein the second electrode is a reference electrode in proximity to the substrate.5. The method of claim 1 , wherein the electroplating cell is coupled to a power source configured to make the repeated readings of voltage between the substrate and the second electrode.6. The method of claim 1 , wherein the substrate comprises recessed features ...

PLATING APPARATUS

To provide a plating apparatus that prevents or reduces a diversion of an electric field. According to one embodiment, a plating apparatus for performing a plating process on a substrate held onto a substrate holder is provided. The plating apparatus includes a plating tank configured to receive the substrate holder holding the substrate, a block member that extends to an inside of the plating tank from a wall surface of the inside of the plating tank, and is movable inside the plating tank, and a moving mechanism configured to move the block member toward the substrate holder disposed inside the plating tank. 1. A plating apparatus for performing a plating process on a substrate held onto a substrate holder , the plating apparatus comprising:a plating tank configured to receive the substrate holder holding the substrate;a block member that extends to an inside of the plating tank from a wall surface of the inside of the plating tank, and is movable inside the plating tank; anda moving mechanism configured to move the block member toward the substrate holder disposed inside the plating tank.2. The plating apparatus according to claim 1 , whereinthe moving mechanism is configured to move the block member toward a side surface of the substrate holder disposed inside the plating tank.3. The plating apparatus according to claim 1 , whereinthe moving mechanism is configured to move the block member toward a front surface of the substrate holder disposed inside the plating tank.4. The plating apparatus according to claim 1 , whereinthe moving mechanism is configured to move the block member toward a back surface of the substrate holder disposed inside the plating tank.5. The plating apparatus according to claim 1 , whereinthe block member includes a sealing member contactable to the substrate holder disposed inside the plating tank.6. The plating apparatus according to claim 1 , whereinthe block member extends in a height direction of the plating tank.7. The plating ...

METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE

Disclosed is a method for manufacturing a semiconductor device. The method includes a template disposing step, a processing solution supply step, and a processing step. At the processing step, a template including a plurality of flow paths configured to allow a processing solution to flow therethrough and a plurality of electrodes installed in the flow paths is disposed with respect to a substrate including a plurality of through holes formed therethrough in a thickness direction such that the flow paths correspond to the through holes. At the processing solution supply step, the processing solution is supplied into the through holes through the flow paths, and at the processing step, a predetermined processing is performed with respect to the substrate by applying a voltage using one of the electrodes as a positive electrode and using another electrode as a negative electrode. 1. A method for manufacturing a semiconductor device , the method comprising:a template disposing step at which a template including a plurality of flow paths configured to allow a processing solution to flow therethrough and a plurality of electrodes installed in the flow paths is disposed with respect to a substrate including a plurality of through holes formed therethrough in a thickness direction such that the flow paths correspond to the through holes;a processing solution supply step at which the processing solution is supplied into the through holes through the flow paths; anda processing step at which a predetermined processing is performed with respect to the substrate by applying a voltage using one of the electrodes as a positive electrode and using another electrode as a negative electrode.2. The method of claim 1 , wherein the substrate includes a circuit unit configured to interconnect the positive electrode and the negative electrode claim 1 , andat the processing step, a voltage is applied to the positive electrode and the negative electrode via the circuit unit.3. The method ...

ELECTRODEPOSITION SYSTEMS AND METHODS THAT MINIMIZE ANODE AND/OR PLATING SOLUTION DEGRADATION

Disclosed are electrodeposition systems and methods wherein at least three electrodes are placed in a container containing a plating solution. The electrodes are connected to a polarity-switching unit and include a first electrode, a second electrode and a third electrode. The polarity-switching unit establishes a constant polarity state between the first and second electrodes in the solution during an active plating mode, wherein the first electrode has a negative polarity and the second electrode has a positive polarity, thereby allowing a plated layer to form on a workpiece at the first electrode. The polarity-switching unit further establishes an oscillating polarity state between the second and third electrodes during a non-plating mode (i.e., when the first electrode is removed from the plating solution), wherein the second electrode and the third electrode have opposite polarities that switch at regular, relatively fast, intervals, thereby limiting degradation of the second electrode and/or the plating solution. 1. An electrodeposition system comprising:a container containing a plating solution; a first electrode removeably placed in said plating solution;', 'a second electrode in said plating solution; and,', 'a third electrode; and,, 'three electrodes in said container and comprisinga polarity-switching unit electrically connected to said first electrode, said second electrode and said third electrode,said polarity-switching unit being selectively operated in one of an active plating mode and a non-plating mode,during said active plating mode, said polarity-switching unit establishing a constant polarity state between said first electrode and said second electrode in said plating solution such that said first electrode has a negative polarity and said second electrode has a positive polarity, andduring said non-plating mode, said polarity-switching unit establishing an oscillating polarity state between said second electrode and said third electrode such ...

Static Disk Electrode for Electroplating Bath Analysis

The presently claimed invention provides an electrochemical analytical apparatus for electrochemical bath analysis. The apparatus comprise a static electrode and a rotatable unit. As steady liquid flow can be generated on the electrolytic surface of the static electrode by the rotatable unit through rotation, the static disk electrode does not involve any movement during the bath analysis such that the design of the electrical contact in the electrode can be substantially simplified. 1. An electrochemical analytical apparatus for electrochemical bath analysis , comprising:a static working electrode having at least one electrolytic surface for being inserted into a liquid electrolyte;a rotatable unit comprising at least one blade and located near the static working electrode for creating flow of the liquid electrolyte by rotation; anda control unit for controlling the rotation of the rotatable unit for arousing a relative motion between the electrolytic surface of the working electrode and a bulk portion of the liquid electrolyte.2. The apparatus of claim 1 , wherein the aroused relative motion is symmetrical relative to the at least one electrolytic surface of the static working electrode.3. The apparatus of claim 1 , wherein the static working electrode is connected with an electrical contact.4. The apparatus of claim 1 , wherein the static working electrode is a disk electrode or a ring disk electrode.5. The apparatus of claim 1 , wherein the rotatable unit is located along a vertical axis of the at least one electrolytic surface of the static working electrode and rotates above the at least one electrolytic surface of the static working electrode.6. The apparatus of claim 1 , wherein the rotatable unit further comprises two or more blades being symmetrically arranged relative to the at least one electrolytic surface of the static working electrode.7. The apparatus of claim 1 , wherein the control unit controls rotation speed of the rotatable unit.8. The apparatus ...

PLATING POWER SUPPLY WITH HEADROOM CONTROL AND ETHERCAT INTERFACE

A system for controlling the operation of apparatus for electroplating semiconductor substrates includes operating in a high mode of operation in which an off-the-shelf power supply provides current or voltage that is directly used to produce the channel control signal and in a low mode of operation in which the off-the-shelf power supply biases a circuit that provides a current or voltage to produce the channel control signal. 1. A method of controlling operation of electroplating apparatus , comprising:generating, from a target electroplating process, an output electrical control signal schedule of target output electrical control signal values and corresponding durations;operating an alternating current (AC) to direct current (DC) power block to generate a DC voltage according to the output control schedule in at least two modes, whereinin a high mode of operation, the AC-to-DC power block directly provides the output electrical control signal to an electroplating channel; andin a low mode of operation, the AC-to-DC power block provides a headroom voltage signal to bias a low range controller transistor stage, and wherein the low range control transistor acts as a post-regulator to control the output electrical control signal to the electroplating channel; andadjusting the headroom voltage to control abrupt variations in the output electrical control signal during transition from the low mode of operation to the high mode of operation and to minimize power consumption in the low range control transistor.2. The method of further comprising:using one or more sensors to provide feedback of an output electrical control signal that is output on the electroplating channel.3. The method of claim 1 , wherein the output electrical control signal is a voltage signal.4. The method of claim 1 , wherein the operating the AC to DC power block includes communicating claim 1 , from a computer claim 1 , via an EtherCAT interface claim 1 , messages to control operation of the AC ...

SUBSTRATE HOLDER RECEPTION APPARATUS

This invention concerns a substrate holder reception apparatus () for clamping a substrate holder () in a substrate holder clamping direction (SHCD) in a predetermined position of the substrate holder () and releasing the substrate holder (), comprising at least one substrate holder connection device () for mechanical aligning and electrically contacting of the substrate holder (), wherein the substrate holder connection device () comprises a separate substrate holder alignment device () for aligning the substrate holder () with the substrate holder connection device () in an alignment direction, and a separate substrate holder contact device () for electrically contacting the substrate holder (). Further, the invention concerns an electrochemical treatment apparatus () comprising the substrate holder reception apparatus (). 1. Substrate holder reception apparatus for clamping a substrate holder in a substrate holder clamping direction in a predetermined position of the substrate holder and releasing the substrate holder characterized in thatthe substrate holder reception apparatus comprises a substrate holder clamping device configured to receive a substrate holder; wherein the substrate holder clamping device comprises at least one substrate holder connection device for mechanical aligning and electrically contacting of the substrate holder and at least one substrate holder clamping arm, wherein the substrate holder connection device, which is arranged at the end of a substrate holder clamping arm, comprises a separate substrate holder alignment device for aligning the substrate holder with the substrate holder connection device in an alignment direction, and a separate substrate holder contact device for electrically contacting the substrate holder; wherein the substrate holder reception apparatus is configured to first align the substrate holder and to afterwards bring the substrate holder contact device into contact with the substrate holder, in the clamping ...

METHOD OF NO-BATH PLASMA ELECTROLYTIC OXIDATION AND DEVICE FOR IMPLEMENTING THE SAME

An applicator for no-bath plasma gel electrolytic oxidation of a workpiece made of a valve metal or an alloy thereof; the applicator movable over a surface of a workpiece to be treated. The applicator including an electrode connectable to a power supply and configured for applying electric voltage to a gap between the electrode and a workpiece. A gel electrolytic medium body is mounted in a holder being in an electric contact with the electrode. 1. A method of no-bath plasma electrolytic oxidation of a workpiece made of a valve metal or an alloy thereof; the method comprising:deploying a workpiece to form a first electrode;providing an applicator of a gel electrolyte medium body to form a second electrode; said applicator comprising a receptacle of a member, made of said gel electrolyte medium body, facing said workpiece;mounting said gel electrolyte medium body within a holder;applying a voltage between said first electrode and said second electrode;contacting said gel electrolyte medium body to said workpiece.2. The method according to claim 1 , wherein said gel electrolyte medium body comprises a component selected from the group consisting of an acidic component claim 1 , an alkaline component claim 1 , a current amplifier component claim 1 , a component improving thermal and electric conductivity claim 1 , water and any combination thereof.3. The method according to claim 2 , wherein said alkaline component is potassium hydroxide claim 2 , a gel forming component.4. The method according to claim 2 , wherein said current amplifier component is sodium silicate.5. The method according to claim 2 , wherein said gel electrolyte medium body comprises a gel forming component that is agar-agar.6. The method according to claim 2 , wherein gel electrolyte medium body comprises a gel forming component that is kappa carrageenan.7. The method according to claim 2 , wherein said component improving thermal and electric conductivity is selected from the group consisting of ...

PLATING METHOD, PLATING APPARATUS, AND METHOD FOR ESTIMATING LIMITING CURRENT DENSITY

A plating method for plating a substrate by increasing a current value from a predetermined current value to a first current value is provided. The plating method plates the substrate for a first predetermined period with the first current value when a first current density corresponding to the first current value is lower than a limiting current density. This plating method includes measuring a voltage value applied to the substrate, and when the current value is increased from the predetermined current value to the first current value, determining whether the first current density is equal to or more than the limiting current density or not based on an amount of change in the voltage value. 1. A plating method comprising:increasing a current value from a predetermined current value to a first current value, and plating a substrate for a first predetermined period with the first current value when a first current density corresponding to the first current value is lower than a limiting current density;measuring a voltage value applied to the substrate; andwhen the current value is increased from the predetermined current value to the first current value, determining whether the first current density is equal to or more than the limiting current density or not based on an amount of change in the voltage value.2. The plating method according to claim 1 , whereinthe determining includes determining that the first current density is equal to or more than the limiting current density when the voltage value has increased by a predetermined value within a predetermined period after the current value has increased from the predetermined current value to the first current value.3. The plating method according to claim 1 , comprisingperforming a specific plating including, when the first current density is determined to be equal to or more than the limiting current density, performing plating for a second predetermined period with a second current value corresponding to a ...

Conditioning of contact leads for metal plating systems

Embodiments of the invention provide a method for conditioning contacts of an electrochemical metal plating system. The method includes deplating the contacts by supplying a reversed biased energy and monitoring electrical measurements of the plating system in real-time such that the endpoint of a deplating process can be determined. In different embodiments, the method includes the use of a constant current or voltage, variable current or voltage, or combinations thereof for conditioning the contacts.

Treating vessel

Off-heat use

FIELD: electricity. SUBSTANCE: it is suggested to use off-heat received in industrial process from alternate-current converters to direct-current and electric engines in order to use is for heating at another stage of the process. For this purpose liquid cooling is used for elements generating off-heat. EFFECT: saving of electric energy or energy accumulated in fossil fuel thus leading to direct or indirect reduction in emission of greenhouse gases. 6 cl, 5 dwg РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) 2 506 687 (13) C2 (51) МПК H02K 9/00 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ИЗОБРЕТЕНИЯ К ПАТЕНТУ (21)(22) Заявка: 2010154000/07, 05.05.2009 (24) Дата начала отсчета срока действия патента: 05.05.2009 (43) Дата публикации заявки: 10.07.2012 Бюл. № 19 (56) Список документов, цитированных в отчете о поиске: ЕР 1808924 А2, 18.07.2007. ЕР 0858145 А2, 12.08.1998. WO 03091163 A, 06.11.2003. CN 1295979 A, 23.05.2003. RU 2089791 C1, 10.09.1997. RU 2270849 C2, 27.02.2006. 2 5 0 6 6 8 7 R U (86) Заявка PCT: EP 2009/055371 (05.05.2009) C 2 C 2 (85) Дата начала рассмотрения заявки PCT на национальной фазе: 29.12.2010 (87) Публикация заявки РСТ: WO 2009/144116 (03.12.2009) Адрес для переписки: 129090, Москва, ул. Б.Спасская, 25, стр.3, ООО "Юридическая фирма Городисский и Партнеры", пат.пов. Ю.Д.Кузнецову, рег.№ 595 (54) ИСПОЛЬЗОВАНИЕ ОТХОДЯЩЕГО ТЕПЛА (57) Реферат: Предложено в промышленном процессе отходящее тепло преобразователей переменного тока в постоянный и электрических двигателей применять для нагрева в другом этапе процесса. Для этого применяется жидкостное охлаждение для элементов, генерирующих отходящее тепло. Тем самым экономится электрическая энергия или энергия, запасенная в ископаемом топливе, что в свою очередь ведет к прямому или косвенному сокращению эмиссии газов, создающих парниковый эффект. 2 н. и 4 з.п. флы, 5 ил. Ñòð.: 1 ru 2 5 0 6 6 8 7 (45) Опубликовано: 10.02.2014 Бюл. № 4 (73) Патентообладатель(и): СИМЕНС АКЦИЕНГЕЗЕЛЛЬШАФТ ( ...

Alloy coating apparatus and metalliding method

원하는 특성을 강화하고 부가하기 위하여 물질(20)이 실질적으로 산소가 없는 대기(14) 및 대기(14) 내의 전해욕(18)을 사용하는 금속표층경화 공정을 통하여 코팅된다. 코팅될 전기적으로 전도성인 기판(20)이 환원전극(20)으로서 다중 산화전극(26)과 함께 욕(18)에 잠기고, 각 산화전극(26a, 26b, 26c)은 서로 다른 조성을 가진다. 가변적인 전력원(30)은 인가된 전류 밀도에 비례하여 각 산화전극 물질(26a, 26b, 26c)에 의한 기판(20)의 코팅을 야기하도록 산화전극(26) 각각에 다르게 선택된 전류 밀도를 제공한다. Material 20 is coated through a metal surface curing process using substantially oxygen free atmosphere 14 and electrolytic bath 18 in atmosphere 14 to enhance and add desired properties. The electrically conductive substrate 20 to be coated is immersed in the bath 18 together with the multiple anodes 26 as the cathode 20, and each anode 26a, 26b, 26c has a different composition. The variable power source 30 provides a differently selected current density to each of the anodes 26 to cause coating of the substrate 20 by each anode material 26a, 26b, 26c in proportion to the applied current density. do.

Coating method by plasma electrolytic oxidation

A coating method by plasma electrolytic oxidation according to the invention is to coat a metal surface with electrolyte. The electric current with 50 mA/ to 100 mA/ of electric current density is applied with 350 V to 600 V of voltage, higher voltage than voltage applied during the remaining process is applied in early plasma electrolytic oxidation process, the rate of number of times between a positive voltage pulse and a negative voltage pulse is 1 : 1 to 2 : 1 in early plasma electrolytic oxidation process and is 30 : 1 to 50 : 1 after middle process when applying the voltage for the positive electrode and the negative electrode in a plasma electrolytic oxidation bath. The surface coating according to the invention has a coating thickness of 0.5 to 5, a surface roughness Ra50 of 0.5 to 10, and maintains a breakdown voltage of 1,000V or higher. Moreover, the invention can be efficiently applied when coating the upper part in a way to apply the electricity such as paint, Teflon, electro deposition coating, silane or coating solution using silane as a main component, coating or electro deposition coating of glass-ceramic, PVD, electroplating, etc.. In addition, the coating has an excellent physical property such as pencil hardness of 8H or greater, 5% NaCl salt water resistant spraying of 96 hours or longer, excellent cohesive property (KS M ISO 2409) (no separation), excellent impact resistance (KS D 6711) (no abrasion).

Apparatus for spraying of plural solutions

온수, 도금액, 염산, 냉수를 필요시 선택적으로 분사할 수 있도록 구성됨으로써, 스트립의 온도조절작업과 굴절롤 세척작업이 효율적으로 균일하게 이루어져서 스트립의 줄무늬가 발생하지 않으며, 도금작업을 신속화시키는 다용액 분사장치를 제공한다. 본 발명에 따른 다용액 분사장치는, 분사구가 형성된 케이스 부재; 및 상기 케이스 부재 내부에 나란하게 복수 개가 배치되며, 길이방향으로 적어도 하나의 노즐을 가진 분사배관;을 포함하며, 각 분사배관의 노즐이 상기 분사구에 순차적으로 대응되도록 상기 복수 개의 분사배관은 하나의 축을 중심으로 회전가능하게 구성되어 복수의 용액이 선택적으로 분사된다. 본 발명에 의하면, 온수, 도금액, 염산, 냉수를 필요시 선택적으로 분사할 수 있다. 이로 인하여, 스트립의 온도조절작업과 굴절롤 세척작업이 효율적으로 균일하게 이루어져서 스트립의 줄무늬가 발생하지 않으며, 도금작업을 하지 못하는 휴지시간을 줄여서 도금작업의 신속화를 꾀할 수 있는 효과를 얻는다. 전기도금, 회전노즐, 분사배관, 온수, 도금액, 염산, 냉수, 스트립 The temperature of the strip is adjusted and the refilling roll cleaning operation is efficiently and uniformly performed so that the stripe of the strip is not generated, Thereby providing an injection device. The multi-solution injector according to the present invention includes: a case member having an injection port; And a plurality of injection pipes arranged in parallel within the case member and having at least one nozzle in the longitudinal direction, wherein the plurality of injection pipes are arranged in a line in the longitudinal direction so that the nozzles of each injection pipe sequentially correspond to the injection ports, And is rotatable about an axis so that a plurality of solutions are selectively injected. According to the present invention, hot water, plating solution, hydrochloric acid, and cold water can be selectively sprayed, if necessary. Accordingly, the temperature of the strip and the cleaning operation of the refraction rolls are efficiently and uniformly formed, so that the stripe of the strip is not generated, and the downtime in which the plating operation is not performed is shortened, thereby achieving the effect of speeding up the plating operation. Electroplating, rotary nozzle, injection pipe, hot water, plating solution, hydrochloric acid, cold water, strip

Method for manufacturing electro galvanized steel sheet with good appearance

PURPOSE: To remove surface defects such as band mark and scratch by electroplating an electrogalvanized steel sheet in a chloride bath again. CONSTITUTION: The method is characterized in that an electroplated steel sheet is again plated in a chloride bath containing 45 to 150 g/L of Zn¬2+, 80 to 380 g/L of Cl¬- and 0.1 to 20 g/L of NH4¬+ under condition that pH of plating solution is 2.0 to 6.0, the temperature of plating solution is 40 to 70 deg.C, electric current is 10 to 200 A/dm¬2, relative flow rate of plating solution against anodic plate is 0.5 to 3.0 m/sec, wherein the plating amount is 1.0 to 10.0 g/m¬2, and relative concentration of chloride ion to zinc ion is kept within 1.5 and 2.5.

METHOD OF METALIZATION AND DEVICE FOR ITS IMPLEMENTATION

1. Устройство для металлизации, включающее: ! среду практически с полным отсутствием кислорода; ! электролитическую ванну, находящуюся внутри данной среды; ! электропроводящую подложку с погруженной в ванну поверхностью; ! совокупность элементов, каждый из которых обладает электрической проводимостью и отличается по составу от других элементов, при этом поверхности каждого из элементов погружены в ванну; и ! источник питания, подключенный к подложке и совокупности элементов, источник питания, служащий для создания плотности тока на каждом элементе и положке, таким образом, что обеспечивается покрытие подложки материалом из каждого из совокупности элементов, погруженных в ванну, пропорционально созданным на них плотностям тока. ! 2. Устройство по п.1, отличающееся тем, что как минимум один из совокупности элементов содержит как минимум один атомный элемент, металл, неметаллический материал и сплав. ! 3. Устройство по п.1, отличающееся тем, что элемент выбран из группы атомных элементов, состоящей из кремния (Si), ниобия (Nb), бора (В), и тантала (Та). ! 4. Устройство по п.1, отличающееся тем, что совокупность элементов состоит из двух элементов, включающих первый элемент из бора и второй элемент из ниобия, при этом плотности тока, созданные на первом и втором элементах, обеспечивают нанесение покрытия из сплава борида ниобия на подложку. ! 5. Устройство по п.1, отличающееся тем, что подложка выполнена из стали. ! 6. Устройство по п.1, отличающееся тем, что электролитическая ванна содержит соль фтористоводородной кислоты. ! 7. Устройство по п.6, отличающееся тем, что соль фтористоводородной кислоты выбрана из группы, состоящей из РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) 2011 104 145 (13) A (51) МПК C25D 3/56 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ЗАЯВКА НА ИЗОБРЕТЕНИЕ (71) Заявитель(и): ХУРСТ Уильям Д. (US) (21)(22) Заявка: 2011104145/02, 24.09.2009 Приоритет(ы): (30) Конвенционный приоритет: 29.09.2008 US 61/100,950 (72) Автор(ы): ХУРСТ Уильям Д ...

Method of automatic adjustment of electrolyte composition in electroplating baths

Изобретение относитс  к гальванотехнике и может быть использовано дл  управлени  технологическими процессами в ваннах гальванолиний. Цель изобретени  - повышение точности корректировки, при обработке изделий различной площади путем определени  текущих значений концентрации компонентов электролита В способе автоматической корректировки электролита в ваннах гальванической линии, включающем ввод информации оператором о начальной концентрации компонентов электролита, измерение тока в ванне и количества подвесок с издели ми, прошедших через ванну, расчет на основе полученной информации текущей концентрации компонентов электролита, сравнение текущей концентрации с заранее заданными допустимыми значени ми, корректировку электролита в случае, если текущее значение концентрации меньше допустимого, осуществл ют измерение площади изделий на каждой подвеске, умножение значени  площади на удельный унос электролита и пересчет текущего значени  концентрации компонентов электролита. Предлагаемый способ позвол ет своевременно проводить корректировку раствора, что обеспечивает получение качественных покрытий. 1 ил. 45 е The invention relates to electroplating and can be used to control the technological processes in the baths of galvano line. The purpose of the invention is to improve the accuracy of adjustment when processing products of various sizes by determining the current values of the concentration of electrolyte components. passed through the bath, the calculation based on the information obtained current concentration of electrolyte components, a comparison of the current concentration radios with predetermined allowable values, electrolyte correction in case the current concentration value is less than the allowable one, measures the area of products on each suspension, multiplies the area value by the specific electrolyte entrainment and recalculates the current concentration value of electrolyte components. The proposed method allows timely adjustment of the solution, ...

Plasma electroplating

A method for depositing a film of an advanced material on a surface of an article is disclosed. The method comprises placing the article within a bath having a pair of spaced electrodes one of which is formed by said article and an electrolyte containing a source of the material to be deposited. A stream of bubbles is generated within the electrolyte adjacent to the cathode. There are a number of techniques for generating the stream of bubbles, e.g. electrolysis, ebullition, cavitation, entrainment and sparging. The method also includes applying a potential difference across the cathode and anode such that a glow discharge is formed in the bubble region so as form a plasma of ionised gaseous molecules within the bubble. This highly energised gaseous plasma then acts to deposit a film of material on the surface of the article. The method may be carried out at atmospheric pressure and does not require a vacuum apparatus. The body of electrolyte liquid acts as a source of containment for the plasma. In large potential difference or voltage drop across the stream of bubbles facilitates the formation of a glow discharge in this region which energises and ionises the molecules to be deposited. An apparatus for carrying out this method is also disclosed.

Continuous electroplating apparatus

本发明涉及一种连续电镀装置，并且更具体而言，涉及这样一种连续电镀装置，其包括：框架；驱动辊子，其上缠绕具有预定宽度以及在一个方向上延伸的待电镀目标，其中，该驱动辊子借助于由旋转装置传输的动力进行旋转，并且该驱动辊子被安装在框架中；从动辊子，其安装在框架中并与驱动辊子分离以使得在从动棍子上抓住待电镀的目标；负极辊子，其安装在框架中并在驱动辊子和被动辊子之间沿着待电镀的目标的移动路径被布置，其中，负极辊子接触待电镀的目标以便对待电镀的目标充以负电；以及正极喷嘴单元，其安装在框架中并且将包括正离子的电镀液喷射到负极辊子与待电镀的目标之间的接触区域上。

Method of concentration of diluted electrolyte implemented with process bath heating realized in the two-level component of the operating module of high-speed galvanochemical processing

FIELD: technological processes. SUBSTANCE: invention relates to a zero-discharge galvanochemical treatment of parts in a heated process bath of an operating module. Outlet of the pump and / or the process bath filtration device itself is connected to a developed surface located in the collector-concentrator, as well as with the process bath. As the heat medium fed to the heat exchanger, the electrolyte of the process bath itself heated to the technologically prescribed temperature is used. It begins to be supplied during the processing of the parts and / or after its termination by the signal of the level sensor located in the collector-concentrator. Supply of the electrolyte to the heat exchanger is stopped by the signal of the temperature sensor installed in the process bath when the temperature of the electrolyte in the process bath is lower than the value, providing an efficient heat transfer from the surface of the heat exchanger to the diluted electrolyte of the process bath. EFFECT: method provides a reduction in the cost of electricity used to concentrate the electrolyte diluted with water in a suitable collection and the expansion of functional and technological capabilities. 11 cl, 3 dwg РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2 648 904 C1 (51) МПК C25D 17/02 (2006.01) C25D 19/00 (2006.01) C25D 21/00 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ИЗОБРЕТЕНИЯ К ПАТЕНТУ (52) СПК C25D 17/02 (2006.01) (21)(22) Заявка: 2017107275, 06.03.2017 (24) Дата начала отсчета срока действия патента: (73) Патентообладатель(и): Алексеев Андрей Николаевич (RU) Дата регистрации: 28.03.2018 (56) Список документов, цитированных в отчете о поиске: АЛЕКСЕЕВ А.Н. Метод проектирования оптимальной структуры системы распределительной многоступенчатой струйной противоточной промывки бессточной линии гальванической обработки и/или очистки общего вида. Новые промышленные технологии. N5, 2003, c.14-16, рис.1. RU 2043430 C1, 10.09.1995. DE 4232183 A1, 31.03. ...

Method of making znic electroplating with excellent surface

PURPOSE: A manufacturing method of a zinc electroplated steel plate having excellent surface appearance is provided, which can manufacture an electroplated steel plate having excellent surface appearance by keeping ion concentration of aluminum at 0.005-0.5 mol per liter without using any organic additives. The surface appearance does not change even in a wide range of the ratio of zinc ion to chlorine ion and has excellent glossiness and white color degree and no streak of plating. CONSTITUTION: The method is as follows: (i) prepare electroplating solution having 0.69-2.29 mol per liter of zinc ion, 2.26-11.28 mol per liter of chlorine ion and 0.005-0.5 mol per liter of aluminum ion, the concentration ratio of chlorine ion to zinc ion being 3.32-7.38; (ii) adjust the pH of the solution to 2.0-6.0 and keep the temperature at 40-70 deg.C; (iii) electroplate by keeping relative flow velocity at 0.5-3.0 meter per second and by keeping current density at 20-250 A/dm2.

Electro zinc plating method of steel sheet

본 발명은 도금층의 광택도, 백색도, 조도, 전류효율을 양호하게 하여, 품질을 향상시키고, 우수한 전기아연도금강판을 제조할 수 있는 강관의 전기아연도금방법을 제공하는 데 그 목적이 있다. 본 발명의 강판의 전기아연도금방법은, 10 ~ 15 중량%의 폴리에틸렌글리콜과, 0.1 ~ 1.0 중량%의 안식향산 및, 상호간에 1:1 ~ 1:3 의 중량비를 갖되 중량 합계가 폴리에틸렌글리콜의 중량 대비 2 ~ 5 중량% 인 포름알데히드와 붕산의 혼합물을 함유하는 도금용액 첨가제를 도금용액 전체에 대하여 0.08 ~ 2.0 mL/L 로 첨가하고, 상기 도금용액의 아연이온의 몰농도를 0.7 ~ 2.0 몰/리터로 하고, 염소이온의 몰농도를 4.0 ~ 9.0 몰/리터로 하며, 온도를 40 ~ 75℃ 로 하고, pH를 1.5 ~ 6.0 으로 하며, 전류밀도를 30 ~ 200 A/dm 2 으로 하여 강판을 전기아연도금하는 것을 특징으로 한다.

Method for surface treatment of a magnesium alloy part

마그네슘 합금으로 이루어진 부품의 주조공정 후 도장공정 전 그 표면을 처리하는 마그네슘합금 부품의 표면처리 방법으로써, 상기 부품 표면의 기름성분을 제거하는 탈지단계(10); 상기 부품 표면의 스크래치를 제거하는 에칭단계(20); 고주파의 교류전류가 흐르는 코일에 상기 부품을 장입하여 전자기 유도 현상을 통해 부품을 가열하는 활성화 단계(30); 및 상기 가열된 부품(42)과 기준도체(44)를 각각 양극과 음극에 연결하여 전해액(46)에 장입함으로써 부품(42)의 표면에 산화코팅막을 형성하는 코팅단계(40);를 포함하는 마그네슘합금 부품의 표면처리 방법이 소개된다. 그 마그네슘합금 부품의 표면처리 방법에 따르면, 개선된 활성화와 코팅을 통하여 표면처리를 함으로써 그 마그네슘합금 부품의 표면 내식성이 향상된다. 또한 고주파 유도를 이용한 활성화를 함으로써 단기간의 시간에도 좀 더 치밀한 코팅층을 얻을 수 있다. A surface treatment method of a magnesium alloy component for treating the surface of the magnesium alloy component after the casting process of the component made of magnesium alloy and before the coating process, the degreasing step of removing the oil component on the surface of the component (10); Etching to remove scratches on the surface of the part; An activation step (30) of charging the component by inserting the component into a coil through which an alternating current of high frequency flows; And a coating step 40 of forming the oxide coating film on the surface of the component 42 by charging the heated component 42 and the reference conductor 44 to the anode and the cathode, respectively, and charging the electrolyte 46. A method of surface treatment of magnesium alloy parts is introduced. According to the surface treatment method of the magnesium alloy component, the surface corrosion resistance of the magnesium alloy component is improved by surface treatment through improved activation and coating. In addition, by enabling activation using high frequency induction, a more dense coating layer can be obtained even in a short time. 마그네슘 합금, 표면 처리, 활성화 단계 Magnesium alloy, surface treatment, activation step

Lining method for electorlytic cell

Method of mounting a spring element on a semiconductor device and testing at a wafer level

Resilient contact structures (430) are mounted directly to bond pads (410) on semiconductor dies (402a, 402b), prior to the dies (402a, 402b) being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies (402a, 402b) to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies (702, 704) with a circuit board (710) or the like having a plurality of terminals (712) disposed on a surface thereof. Subsequently, the semiconductor dies (402a, 402b) may be singulated from the semiconductor wafer, whereupon the same resilient contact structures (430) can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements (430) of the present invention as the resilient contact structures, burn-in (792) can be performed at temperatures of at least 150 DEG C, and can be completed in less than 60 minutes.

Process for the prevention of arc-spot in electroplating

Coating is formed as front and back of steel strip(3) passing each four electrolytic cells(1). Steel strip goes into electrolytic cell in grounding state by this roll. In each electrolytic cells, conductor roll(2) spins with submerged half way in coating solution and connected to negative pole of rectifier using rotational axis of conductor roll. Conductor roll is consisted of metallic conductive body(21) that allows conduction and rubber cover layer(22) to be applied around it. Common point of contact substance(8) connects steel strip and conductive body to eliminate voltage difference electrically.

Aluminum alloy hard anodic oxidation device and method

本发明公开了一种铝合金硬质阳极氧化装置及方法，所述铝合金硬质阳极氧化装置包括控温保温系统，阳极氧化系统和辅助控制系统和电源；所述控温保温系统包括装有冷却介质的真空保温容器，所述真空保温容器中设有冷却铜管，所述阳极氧化系统安装在真空保温容器内，所述阳极氧化装置包括电解槽，所述电解槽内设有阴极板和阳极挂具；所述辅助控制系统设置在阴极板和阳极挂具之间，所述辅助控制系统包括L型支撑架，所述L型支撑架包括相互垂直的竖板和横板，所述竖板固定在电解槽上，所述横板上安装有搅拌装置和温度传感器；所述电源为可调式恒流恒压电源。利用本发明进行阳极氧化能及时散热冷却，降低阳极氧化过程中高温对氧化膜性能的不良影响。

Apparatus for preventing a stain of strip sides

본 발명은 냉연 전기도금강판의 에지측에 잔류되는 분사액을 제거하여 도금강판의 표면품질을 향상시킬 수 있도록 한 강판의 에지(Edge)측 표면얼룩 방지장치에 관한 것으로, 스크루우샤프트(19)를 구동시키도록 된 구동부와; 상기 스크루우샤프트(19)의 구동에 의해 강판(100)의 에지측으로 이동되도록 된 한 쌍의 작동부와; 상기 강판(100)의 에지측에 잔류된 분사액을 흡입하도록 된 흡입부를 포함하여 구성되는 것을 특징으로 하되, 상기 작동부는 상기 스크루우샤프트(19)에 치합되어 있는 하우징박스(40)와; 상기 하우징박스(40)에 고정되는 작동실린더(15)와; 상기 작동실린더(15)의 작동에 의해 강판(100)의 에지측에 진입하여 잔류된 분사액을 제거하기 위한 로울러부를 포함하여 구성되는 것을 특징으로 하는 강판의 에지측 표면얼룩 방지장치를 제공한다. 따라서 상, 하부 와이퍼롤을 통과한 후 인접하여 부설되는 상,하부로울러 및 수직로울러에 의해 강판의 에지측이 깨끗하게 스퀴징 처리되도록 할 수 있어 고품질의 도금강판을 생산할 수 있게 된다. 도금강판, 스퀴징(Squeezing) ,수냉대, 내지문강판, 와이퍼롤(Wiper Roll) The present invention relates to an edge surface staining prevention device of the steel sheet to improve the surface quality of the coated steel sheet by removing the injection liquid remaining on the edge side of the cold-rolled electroplating steel sheet, A drive unit configured to drive the screw shaft 19; A pair of operating parts adapted to be moved to the edge side of the steel sheet 100 by driving the screw shaft 19; And a suction part configured to suck the injection liquid remaining on the edge side of the steel plate 100, wherein the operation part comprises: a housing box 40 engaged with the screw shaft 19; An operation cylinder 15 fixed to the housing box 40; It is provided by the operation of the operation cylinder 15 to the edge side of the steel sheet 100 to provide an edge side surface stain prevention device of the steel sheet, characterized in that it comprises a roller portion for removing the remaining injection liquid. Therefore, the upper and lower rollers and vertical rollers which are placed adjacently after passing through the upper and lower wiper rolls can be cleanly squeezed to the edge side of the steel sheet, thereby producing high quality plated steel sheet. Plated Steel Sheet, Squeezing, Water Cooling Plate, Anti-fingerplate Steel Sheet, Wiper Roll

Continuous plating apparatus

본 발명은 연속 도금 장치에 대한 것으로서, 더욱 상세하게는 프레임; 일정한 폭을 가지면서 일방향으로 연장되는 피도금체를 감아걸고 있으며 회전수단에 의하여 동력을 전달받아 회전하고 상기 프레임에 설치되는 구동롤러; 상기 프레임에 설치되고, 상기 구동롤러와 이격되어 배치되며 상기 피도금체가 감아걸리는 종동롤러; 상기 프레임에 설치되되, 상기 구동롤러와 종동롤러의 사이로서 상기 피도금체가 이동하는 이동경로상에 배치되며 상기 피도금체와 접촉하여 상기 피도금체에 음극 전기를 대전시키는 음극롤러; 및 상기 프레임에 설치되되, 상기 음극롤러와 상기 피도금체의 접촉부분에 양극 이온을 포함하는 도금액을 분사하는 양극 노즐부;을 포함하는 연속 도금 장치에 대한 것이다.. The present invention relates to a continuous plating apparatus, and more particularly, to a continuous plating apparatus comprising a frame; A driving roller which is wound around a plated body extending in one direction with a predetermined width and is rotated by receiving power by a rotating means and installed in the frame; A driven roller installed in the frame and spaced apart from the drive roller, the driven roller being wound around the plated member; A negative electrode roller provided on the frame and disposed on a moving path along which the plated body moves between the driving roller and the driven roller and contacting the plated body to electrify the negative electrode to the plated body; And a positive electrode nozzle unit installed in the frame, for spraying a plating liquid containing positive electrode ions to a contact portion between the negative electrode roller and the plated body.

Method of temporarily, then permanently, connecting to a semiconductor device

탄성 접촉 구조물(430)은 다이(402a, 402b)들이 반도체 웨이퍼로부터 개별화(분리)되기 전에 하나의 반도체 다이(402a, 402b) 상에 패드(410)들을 결합하도록 직접 장착된다. 이는 복수개의 단자(712)가 배치된 표면을 갖는 회로 기판(710) 등을 갖춘 반도체 다이(702, 704)에 연결함으로써 반도체 다이(402a, 402b)들을 실행(예를 들어, 시험 및/또는 번인 등)시킬 수 있게 해준다. 따라서, 반도체 다이(402a, 402b)들은 반도체 웨이퍼로부터 개별화될 수 있어서, 동일한 탄성 접촉 구조물(430)이 반도체 다이들과 (와이어링 구조, 반도체 패키지 등)의 다른 전자 부품들 사이의 상호 접속을 수행하는 데 사용될 수 있다. 탄성 접촉 구조물로서 본 발명의 모든 금속성 복합 상호 접속 요소(430)를 사용함으로써 번인을 적어도 150 ℃의 온도로 60분 미만 내에서 완료할 수 있다. The elastic contact structure 430 is mounted directly to couple the pads 410 on one semiconductor die 402a, 402b before the dies 402a, 402b are singulated (separated) from the semiconductor wafer. This executes (eg, tests and / or burns in) semiconductor dies 402a, 402b by connecting them to semiconductor dies 702, 704 with a circuit board 710, etc., having a surface on which a plurality of terminals 712 are disposed. Etc.). Thus, the semiconductor dies 402a and 402b can be individualized from the semiconductor wafer, such that the same elastic contact structure 430 performs the interconnection between the semiconductor dies and other electronic components of the wiring structure, semiconductor package, etc. Can be used to By using all metallic composite interconnect elements 430 of the present invention as elastic contact structures, burn-in can be completed in less than 60 minutes at a temperature of at least 150 ° C.

Apparatus for tubular type high-field fabrication of anodic nanostructures

본 발명은 튜브 형태의 금속의 내표면에 나노구조체를 형성하기 위한 고전계 양극산화장치에 관한 것으로서, 금속을 산화시켜 표면에 나노구조체를 형성하는 양극산화장치에 있어서, 튜브 형태의 금속 양극과; 상기 양극의 양측에 결합되며, 상기 양극의 양단부가 삽입되도록 형성되어 상기 양극을 고정시키는 고정공과, 상기 고정공에 인접하여 형성되어 상기 양극을 전기적으로 접촉시키는 양극접촉구로 이루어진 양극고정부와; 상기 양극고정부 사이에 위치하며 상기 양극을 내부에 수용하여 양극의 외부로 냉각매체가 순환공급되도록 하는 냉각부와; 상기 양극고정부 측면에 결합되며, 전해액이 상기 금속 양극의 일측에서 내부로 공급되고 타측으로 배출되도록 형성된 전해액 공급부와; 상기 전해액 공급부를 지나 상기 금속 양극 내부를 길이 방향으로 관통되어 전해액에 침지형성된 상대전극으로써의 음극과; 상기 전해액 공급부 측면에 결합되어 상기 음극을 고정시키는 음극고정부;를 포함하여 구성되는 것을 특징으로 하는 튜브형 고전계 양극산화장치를 기술적 요지로 한다. 이에 따라 전해액이 금속 양극 내부로 공급되도록 하고 냉각매체가 금속 양극 외부로 공급되도록 함과 함께 음극이 금속 양극 내부에서 길이 방향으로 형성되도록 함으로써, 금속 양극 내표면에의 나노구조체를 고속으로 형성함과 아울러 이에 따른 열을 고속으로 제거함으로써 산화막 형성이 균일하고도 신속하게 이루어지도록 하여 다송성 금속산화물 튜브의 제공이 가능한 이점이 있다. 금속 튜브 고전계 양극산화 나노구조체 전해액

Method of fabricating an interconnection element

Contact structures formed on an electronic component are useful for connecting the component to other electronic components. A contact tip structure can be formed on a sacrificial substrate, then combined with an interconnection element. A preferred contact structure includes some topography, generally in the form of certain raised features. These are formed by embossing depressed features into the sacrificial substrate upon which the contact tip structure is constructed. The contact tip structure can be optimized for making contact with another electrical component.

Plating current control method

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Plating equipment capable of controling temperature of plating solution

본 발명은 도금액 온도제어가 가능한 도금장치에 관한 것으로서, 도금액(R)이 수용되는 것으로서 티타늄 재질로 된 도금조(10)와; 도금액(R)에 수용된 상태에서 도금조(10)의 내주면에 마주보게 설치되는 것으로서, 유동되는 냉매에 의하여 상기 도금액(R)을 냉각시키기 위한 한쌍의 열교환부(20)와; 열교환부(20)로 냉매를 공급하기 위한 냉매공급부(30);를 포함하는 것을 특징으로 한다.

Mounting spring elements on semiconductor devices

탄성 접촉 구조물(430)은 다이(402a, 402b)들이 반도체 웨이퍼로부터 개별화(분리)되기 전에 하나의 반도체 다이(402a, 402b) 상에 패드(410)들을 결합하도록 직접 장착된다. 이는 복수개의 단자(712)가 배치된 표면을 갖는 회로 기판(710) 등을 갖춘 반도체 다이(702, 704)에 연결함으로써 반도체 다이(402a, 402b)들을 실행(예를 들어, 시험 및/또는 번인 등)시킬 수 있게 해준다. 따라서, 반도체 다이(402a, 402b)들은 반도체 웨이퍼로부터 개별화될 수 있어서, 동일한 탄성 접촉 구조물(430)이 반도체 다이들과 (와이어링 구조, 반도체 패키지 등)의 다른 전자 부품들 사이의 상호 접속을 수행하는 데 사용될 수 있다. 탄성 접촉 구조물로서 본 발명의 모든 금속성 복합 상호 접속 요소(430)를 사용함으로써 번인을 적어도 150 ℃의 온도로 60분 미만 내에서 완료할 수 있다. The elastic contact structure 430 is mounted directly to couple the pads 410 on one semiconductor die 402a, 402b before the dies 402a, 402b are singulated (separated) from the semiconductor wafer. This executes (eg, tests and / or burns in) semiconductor dies 402a, 402b by connecting them to semiconductor dies 702, 704 with a circuit board 710, etc., having a surface on which a plurality of terminals 712 are disposed. Etc.). Thus, the semiconductor dies 402a and 402b can be individualized from the semiconductor wafer, such that the same elastic contact structure 430 performs the interconnection between the semiconductor dies and other electronic components of the wiring structure, semiconductor package, etc. Can be used to By using all metallic composite interconnect elements 430 of the present invention as elastic contact structures, burn-in can be completed in less than 60 minutes at a temperature of at least 150 ° C.

Method of measuring the thickness of coating in the process of plasma-electrolytic oxidation and the device for its implementation

FIELD: technological processes. SUBSTANCE: invention relates to the field of electrochemical processing of materials and relates to a method for determining the thickness of a coating. Method comprises measuring 5 to 300 seconds after the radiation intensity of the part has been processed in a wavelength range of 3–50 nm, which includes the characteristic spectral emission line of the material of the component, located in the wavelength region 200–900 nm. In addition, the intensity of microdischarge radiation is measured in the wavelength range 3–50 nm, including the characteristic spectral emission line of one of the electrolyte components located in the wavelength range 200–900 nm. Thickness of the coating is determined by the formula: h=k 1 ⋅(lnI 1 -lnI 2 )+k 2 , where k 1 and k 2 – empirical coefficients, depending on the nature of the material being processed and the composition of the electrolyte, determined by the calibration curves, I 1 and I 2 – intensity of the spectral lines of one of the electrolyte components and the material of the component, respectively. EFFECT: technical result consists in increasing the accuracy of determining the thickness of the coating and ensuring the possibility of timely termination of the plasma electrolytic oxidation process. 2 cl, 10 dwg, 2 tbl РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2 672 036 C1 (51) МПК G01B 11/06 (2006.01) C25D 21/12 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ИЗОБРЕТЕНИЯ К ПАТЕНТУ (52) СПК G01B 11/0658 (2006.01); C25D 21/12 (2006.01) (21)(22) Заявка: 2017126345, 21.07.2017 (24) Дата начала отсчета срока действия патента: Дата регистрации: 08.11.2018 (45) Опубликовано: 08.11.2018 Бюл. № 31 2 6 7 2 0 3 6 R U (56) Список документов, цитированных в отчете о поиске: RU 2435134 C1, 27.11.2011. SU 989938 A1, 10.05.2006. US 6674533 B2, 06.01.2004. US 6885466 B1, 26.04.2005. (54) СПОСОБ ИЗМЕРЕНИЯ ТОЛЩИНЫ ПОКРЫТИЯ В ХОДЕ ПРОЦЕССА ПЛАЗМЕННОЭЛЕКТРОЛИТИЧЕСКОГО ОКСИДИРОВАНИЯ И ...

Electromagnetic thermal coupling thermoelectric chemical oxidation equipment

本申请提供电磁热耦合的热电化学氧化的设备，包括：电解池、电解槽、电磁热耦合部、热电化学氧化电源和温控系统，所述电解槽在电解池的内部，电解槽为中空的圆筒，电解池中的电解液漫过电解槽，电磁热耦合部与电解槽连接，电磁热耦合部用于通过磁场控制电解槽中的带电粒子的定向运动，电磁热耦合部由螺旋线圈和电流源组成，螺旋线圈为绝缘导线螺旋缠绕在电解槽的外壁而形成，螺旋线圈的两端与电流源连接，热电化学氧化电源的正极与工件连接、负极与电解槽连接，工件为阀金属或者为外表面为阀金属的导电金属，工件在电解槽中进行热电化学氧化、在工件表面原位生长氧化陶瓷层，所述温控系统与电解池连接，用于控制电解池中的电解液的温度。

Plating method

Apparatus for electroplating, in particular copper plating, flat plate or arched objects

Vorrichtung zur Galvanisierung, insbesondere Verkupferung, flacher, platten- oder bogenförmiger Gegenstände, insbesondere von gedruckten Leiterplatten, mit a) einem Maschinengehäuse, welches einen mit einem flüssigen Elektrolyten anfüllbaren Raum aufweist; b) einer Fördereinrichtung, welche die Gegenstände im wesentlichen horizontal, parallel zu ihrer Haupterstreckungsrichtung, kontinuierlich von einem Eingang zu einem Ausgang durch das Maschinengehäuse befördert; c) mindestens einer Anode, welche sich parallel zum Bewegungsweg der Gegenstände erstreckt und mit einem ersten Pol einer Spannungsquelle verbunden ist; d) einer Kontaktiereinrichtung, welche einen elektrischen Kontakt zu den Gegenständen herstellt und mit einem zweiten Pol der Spannungsquelle verbunden ist; dadurch gekennzeichnet, dass die Spannungsquelle mindestens einen einstellbaren Impulsgenerator (55, 56) umfasst, dessen Ausgangssignale an die Anoden (4, 5) und die Kontaktiereinrichtung (7) gelegt und Rechteckimpulse mit wählbarer Wiederholfrequenz, Taktverhältnis, Amplitude und Polarität sind, wobei im zeitlichen Mittel die Anoden (4, 5) gegenüber der Kontaktiereinrichtung (7) positiv ist, dass der oder... Apparatus for electroplating, in particular copper plating, flat, plate-shaped or arched objects, in particular of printed circuit boards, with a) a machine housing having a fillable with a liquid electrolyte space; b) a conveyor which continuously conveys the articles substantially horizontally, parallel to their main direction of extent, from an entrance to an exit through the machine housing; c) at least one anode which extends parallel to the path of movement of the objects and is connected to a first pole of a voltage source; d) a contacting device which makes electrical contact with the objects and is connected to a second pole of the voltage source; characterized, in that the voltage source comprises at least one adjustable pulse generator (55, 56) whose output signals are applied to the ...

Temperature maintenance apparatus of plating solution

본 발명은 도금용액 순환탱크의 도금용액이 도금에 적합한 온도를 갖도록 가열 또는 냉각하도록 구성된 도금용액 항온장치에 관한 것으로, 상기 도금용액 순환탱크(130)에 설치된 열매체자켓(310)과, 열매체를 상기 열매체자켓(310)에 공급하고 그 열매체자켓(310)에서 배출된 열매체를 다시 공급받도록 연결된 열매체 저장탱크(340)와, 상기 열매체 저장탱크(340)의 열매체와 간접 열교환에 의해 그 열매체의 온도를 조절하도록 가스를 순환시키는 냉각 및 가열사이클과, 상기 도금용액 순환탱크(130)의 도금용액 온도를 측정하도록 설치된 도금용액 온도센서(T1)와, 상기 도금용액 온도센서(T1)의 도금용액 온도 정보에 의해 상기 열매체 저장탱크(340)의 열매체와 간접 열교환하는 가스의 온도를 제어하도록 설치된 제어기(360)를 포함하고; 상기 냉각사이클은, 가스의 압축을 위한 압축기(358)와, 상기 열매체 저장탱크(340)에 설치된 열교환기(350)와, 가스의 팽창을 위한 팽창밸브(356)와, 상기 열매체 저장탱크(340)와 분리된 영역에 설치된 외부 열교환기(354)를 포함하여, 가스가 압축기(358), 외부 열교환기(354), 팽창밸브(356) 및 열교환기(350)를 통해 다시 압축기(358)로 공급되는 순환 사이클을 이루도록 구성된다. The present invention relates to a plating solution constant temperature device configured to heat or cool a plating solution of a plating solution circulation tank to have a temperature suitable for plating. The heating medium jacket 310 and the heat medium are installed in the plating solution circulation tank 130. The heat medium storage tank 340 is connected to the heat medium jacket 310 and the heat medium discharged from the heat medium jacket 310 is supplied again, and the temperature of the heat medium is indirectly exchanged with the heat medium of the heat medium storage tank 340. Cooling and heating cycles to circulate the gas to adjust, the plating solution temperature sensor T1 installed to measure the plating solution temperature of the plating solution circulation tank 130, and the plating solution temperature information of the plating solution temperature sensor T1. And a controller 360 installed to control the temperature of the gas indirectly heat-exchanging with the heat medium of the heat medium storage tank 340; The cooling cycle includes a compressor 358 for compressing the gas, a heat exchanger 350 installed in the heat medium storage tank 340, an expansion valve 356 for expanding the gas, and the heat medium storage tank 340. Gas is passed back to the compressor 358 through the compressor 358, the external ...

Anodizing method of subject

According to the present invention, an object anodizing method using a sulfuric acid method comprises: 10-20 wt% of sulfuric acid (H_2SO_4) as an electrolyte; and adds 0.1-2 wt% of a compound organic acid composed of acetic acid, terephthalic acid, and 2-hydroxybenzoic acid at a weight ratio of 1:0.5:0.3-1:1:1. The electrolyte is raised to move on an outer surface of the object at an average speed of 17-18 cm/second. Anodization is performed for 5-20 minutes under conditions with a temperature of the outer surface of the object maintained at 15-22C; a current density in a range of 0.5-1.3 A/dm^2; and a direct current voltage of 12-20 V.

Lining method for electrolytic cell

Probe card assembly and kit, and method using the same

Resilient contact structures extend from a top surface of a support substrate and solder-ball (or other suitable) contact structures are disposed on a bottom surface of the support substrate. Interconnection elements (110) are used as the resilient contact structures and are disposed atop the support substrate. Selected ones of the resilient contact structures atop the support substrate are connected, via the support substrate, to corresponding ones of the contact structures on the bottom surface of the support substrate. In an embodiment intended to receive an LGA-type semiconductor package (304), pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally normal to the top surface of the support substrate (302). In an embodiment intended to receive a BGA-type semiconductor package (404), pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally parallel to the top surface of the support substrate (402).

Device for galvanic bath voltage control

USING WASTE HEAT

1. Устройство, содержащее !- электрический преобразователь (4, 8, 10), который вырабатывает отходящее тепло (5, 7, 11), ! - устройство (2, 9, 14, … 17, 21) обработки и ! - устройство нагрева для устройства (2, 9, 14, … 17, 21) обработки, ! выполненное таким образом, что отходящее тепло (5, 7, 11) подается в устройство нагрева. ! 2. Устройство по п.1, в котором для электрического преобразователя (4, 8, 10) предусмотрено жидкостное охлаждение, которое выполнено с возможностью направления отходящего тепла (5, 7, 11) в устройство нагрева. ! 3. Устройство по п.1, в котором устройство обработки таким образом согласовано с электрическим преобразователем (4, 8, 10), что отходящее тепло (5, 7, 11) полностью достаточно для нагрева устройства (2, 9, 14, … 17, 21) обработки. ! 4. Устройство по п.2, в котором устройство обработки таким образом согласовано с электрическим преобразователем (4, 8, 10), что отходящее тепло (5, 7, 11) полностью достаточно для нагрева устройства (2, 9, 14, … 17, 21) обработки. ! 5. Устройство по любому из пп.1-4, в котором электрический преобразователь (8, 10) представляет собой преобразователь частоты переменного тока (10) и/или двигатель (8), а устройство (9) обработки является эмульсионной ванной (9). ! 6. Устройство по любому из пп.1-4, в котором электрический преобразователь (4) представляет собой выпрямитель, а устройство (2) обработки является выпарной установкой (2). ! 7. Устройство по любому из пп.1-4, в котором электрический преобразователь (4) представляет собой выпрямитель (4) и/или преобразователь постоянного тока в переменный, а устройство (14) обработки является установкой (14) опреснения для морской воды. ! 8. Устройство по любому из пп.1-4, в котором электрический преобразователь (4) � (19) РОССИЙСКАЯ ФЕДЕРАЦИЯ RU (11) 2010 154 000 (13) A (51) МПК H02K 9/00 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ЗАЯВКА НА ИЗОБРЕТЕНИЕ (71) Заявитель(и): СИМЕНС АКЦИЕНГЕЗЕЛЛЬШАФТ (DE) (21)(22) Заявка: 2010154000/07, 05.05. ...

The trouble sensing device and thereof controlling method of the electroplating line

PURPOSE: An apparatus for sensing breakdown of an electroplating line and a method for controlling the same are provided which promptly and accurately finds out the causes for the stoppage of the line when the electroplating line is stopped. CONSTITUTION: The apparatus for sensing breakdown of an electroplating line comprises a PLC input card transmitting the input signal to CPU after receiving signal inputted on whether or not obstruction is occurred; a PLC output card outputting a control signal of the CPU judging the signal that is transmitted by the PLC input card, wherein the PLC output card is formed in corresponding to the PLC input card; a plurality of position indicators (21) arranged on a breakdown monitoring panel (19), wherein the position indicators have lamps (23) and correspondingly connected to each signal control circuits of the PLC output card so that the position of the obstruction is easily discriminated; and a buzzer (22) installed on the breakdown monitoring panel and connected to the CPU so that the alarming horn is sounded simultaneously when at least one or more lamps (23) of the position indicators (21) are operated.

Electrical and magnetic fields insensitive continuous plating plant - has forked sensor head to position strip edge, arms to mount AC transmitter and parallelly connected receiver coils

In a continuous plating plant, the position of strip edges is determined by an arrangement of a forked sensor head (4), between whose arms (5, 6), the edge (2) of the strip (3) passes. One arm mounts a transmitter coil (7), whose axis (8) is perpendicular to the arm, while the other arm (6) mounts two receiver coils (9, 10). The transmitter is supplied with alternating current and receiver coils are connected in parallel and to a signal amplifier. ADVANTAGE - Insensitive to strong electrical and magnetic fields.

Electroplating equipment and process for new energy automobile parts

本发明涉及电镀技术领域，特别涉及用于新能源汽车零部件的电镀设备及工艺，电镀槽内底部设置有可转动的阳极转盘，阳极转盘的上端边缘固定有阳极板，阳极转盘带动阳极板转动，电镀槽的上方设置有盖板，盖板上方设置有第一电机，盖板下方设置有阴极板，第一电机驱动阴极板自转，阳极板位于阴极板侧方，阴极板位于阳极转盘中心正上方，阳极板电连接于电源正极，阴极板电连接于电源负极，待电镀产品挂设于阴极板上，基座内设置有第二电机，第二电机的输出端垂直连接于阳极转盘底部中心，第二电机驱动阳极转盘绕中心自转。与现有技术相比，本发明的用于新能源汽车零部件的电镀设备及工艺可有效提高电镀效率，实现更为均匀电镀效果。

Electronics producing line electrochemical processing cell

本发明公开一种电子产线用电化学处理槽，包括电解槽、调节槽、阳极端子和阴极端子，第一进口导流板和第二进口导流板位于所述电解槽内且靠近进水口侧，所述第一进口导流板上开设有若干个第一进口通孔，所述第二进口导流板上开有若干个第二进口通孔，所述第一进口通孔与第二进口通孔对应设置，一安装于电解槽上的升降机构与第一进口导流板连接，此第一进口导流板在升降机构驱动下沿上、下方向运动，从而实现调节对应的第一进口通孔与第二进口通孔重叠区域大小，所述调节槽两端通过管路连接到电解槽的进水口和出水口。本发明实现了控制工作液体流场均匀并消除局部环流现象，保证了电化学处理槽内均布的每个产品都能有效参与电化学反应。

alloy coating apparatus and method for intermetallization

Method of mounting resilient contact structures to semiconductor devices

Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150° C., and can be completed in less than 60 minutes.

Method of mixing the working media in electroplating chamber for parts processing

FIELD: technological processes. SUBSTANCE: invention relates to the field of electroplating and can be used to mix the treatment media of electroplating chambers as compressed air, and directly by the processing medium itself, in particular, when processing parts or printed circuit boards placed on pendants. Method comprises mixing the treating medium using a set of semi-cylindrical profiles with the mixing mechanism connected to the outlet of the pressure system in the form of perforated tubes with double-row perforation in their lower part, which are placed along the junction of semi-cylindrical profiles with each other, and controlling the flow rate of the treatment medium of chamber or compressed air using actuators, the set of semi-cylindrical profiles with a stirring mechanism is made in the form of a monoblock detachably mounted on the bottom of the chamber, the detachable installation on the bottom of the monoblock chamber is made with clips mounted on the horizontal part of the side of the chamber and / or corners rigidly connected to the lining or material of the walls of the chamber, and in the case of feeding to the stirring mechanism of the treatment media of the chamber, a suction device placed in the last intake element connected to the inlet of the pressure system is used. EFFECT: reduction of material consumption, simplification of implementation and provision of the possibility of replacing a set of semi-cylindrical profiles and mixing mechanism, broadening of functional and manufacturing capability of the method. 5 cl, 5 dwg РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2 643 535 C1 (51) МПК C25D 17/02 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ИЗОБРЕТЕНИЯ К ПАТЕНТУ (52) СПК C25D 17/02 (2006.01) (21)(22) Заявка: 2016135588, 01.09.2016 (24) Дата начала отсчета срока действия патента: (73) Патентообладатель(и): Алексеев Андрей Николаевич (RU) Дата регистрации: 02.02.2018 (56) Список документов, цитированных в отчете о ...

Multi-function plating equipment

The present invention relates to a high-quality multi-function plating device, which comprises: a plating bath (10) which has a box shape opened to an upper side and accommodating a plating solution (A); an electrode support rod (20) which crosses an upper part of the plating bath (10) and on which a rack (not shown) on which a plating object (not shown) is supported is selectively hung; a unit (30) for reciprocally transferring the support rod, which is installed on one side wall (10a) of the plating bath (10), and reciprocally transfers one side (20a) of the electrode support rod to the left and right so that the rack supported by the electrode support rod (20) can be reciprocally transferred; and a unit (40) for reciprocally interworking the support rod, which is installed on the other wall (10b) of the plating bath (10), and supports the other side of the electrode support rod (20b) to be reciprocally transferred to the left and right. The present invention can make a plating thickness, formed on an object to be plated, constant.