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05-01-2012 дата публикации

Copper-zinc alloy electroplating bath and method of plating using same

Номер: US20120003498A1
Автор: Yukiko Wada
Принадлежит: Bridgestone Corp

Provided is a copper-zinc alloy electroplating bath which can form a copper-zinc alloy plating coating having an improved throwing property and a plating method using the same. Also provided is a copper-zinc alloy electroplating bath containing, as an additive, at least one selected from the group consisting of the compounds represented by the following formulae (I) to (III): (wherein R 1 represents a lower alkylene group, R 2 represents H or a lower alkyl group, and the weight-average molecular weight is 10 3 to 10 5 ); and Na—SO 3 —(CH 2 ) 3 —S—S—(CH 2 ) 3 —SO 3 —Na (III) These additives can be used alone, and two or more of these can be used in combination.

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Номер записи: 1
20-02-2003 дата публикации

ТЕХНОЛОГИЧЕСКАЯ ЛИНИЯ ДЛЯ ПРОИЗВОДСТВА МЕТАЛЛА С ПОКРЫТИЕМ

Номер: RU0000027825U1
Автор: Карпов А.А., Котий В.Н., Кулаковский В.Т., Морозов А.А., Овчинников А.А., Рашников В.Ф., Сеничев Г.С., Тахаутдинов Р.С., Тверской Ю.А.
Принадлежит: Закрытое акционерное общество "Патентные услуги"

Технологическая линия для производства металла с покрытием, например, цинком, включающая расположенные друг за другом стан обработки металла давлением, агрегат подготовки поверхности ленты к соответствующему покрытию, агрегат непрерывного горячего цинкования (АНГЦ) с оборудованием для нанесения покрытия, системы контроля качества оцинкованной ленты, устройства для комплектования готовой продукции, автоматизированные системы управления технологическим процессом, отличающаяся тем, что технологическая линия дополнительно снабжена соединенными последовательно конвертером, вакууматором с патрубками, агрегатом "печь-ковш", слябовыми машинами непрерывного литья заготовок, двухклетьевым реверсивным станом, при этом всасывающий металл патрубок вакууматора оборудован фурмами с возможностью регулирования подачи аргона в металл снизу; в качестве стана обработки металла давлением установлен стан горячей прокатки, в качестве агрегата подготовки поверхности ленты к покрытию установлен непрерывно травильный агрегат, после которого расположен двухклетьевой реверсивный стан, а оборудование для нанесения покрытия, например, цинка, дополнительно содержит вторую ванну цинкования, причем совместно с первой они оснащены системой транспортировки и подъема для перемещения ванн с линии на линию, устройство для закалки, агрегат дрессировки с рабочими валками для достижения усилия прокатки, соответствующего различным маркам стали, в качестве нагревательной печи установлена радиантная печь вертикального типа, а на выходе из АНГЦ установлены, как минимум, две моталки для сматывания полос с возможностью намотки последних как сверху, так и снизу, при этом все агрегаты, составляющие технологическую линию, объединены в единый транспортный контур. (19) RU (11) 27 825 (13) U1 (51) МПК C21C 5/28 (2000.01) C25D 3/22 (2000.01) B21C 1/00 (2000.01) РОССИЙСКОЕ АГЕНТСТВО ПО ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К СВИДЕТЕЛЬСТВУ (21), (22) Заявка: 2002130351/20 , 18.11.2002 (24) Дата начала ...

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Номер записи: 2
20-03-2003 дата публикации

Устройство для электролитического хромирования длинномерных изделий

Номер: RU0000028360U1
Автор: Васильевский В.В., Ким В.Е., Макеенко Е.Я.
Принадлежит: Общество с ограниченной ответственностью "Гидровек"

1. Устройство для электролитического хромирования длинномерных изделий, включающее проточную ванну-ячейку, размещенный в ней анод, рабочая поверхность которого установлена коаксиально относительно изделия, систему подвода и отвода электролита, источник постоянного тока и привод вращения изделия, отличающееся тем, что оно дополнительно снабжено приводом продольного перемещения изделия, ванна-ячейка выполнена конечной длины с узлами уплотнения на входе и выходе из нее изделия, а анод выполнен из нескольких анодных секций, электрически изолированных друг от друга и соединенных с источником постоянного тока. 2. Устройство по п.1, отличающееся тем, что анод выполнен не менее чем из четырех анодных секций. 3. Устройство по п.1, отличающееся тем, что оно снабжено дополнительным электродом, подключенным к отрицательному полюсу источника постоянного тока и установленным в ванне-ячейке перед первой анодной секцией по ходу перемещения изделия. 4. Устройство по пп.1-3, отличающееся тем, что каждая из анодных секций и дополнительный электрод подключены к источнику постоянного тока через выключатели. 5. Устройство по пп.1 и 2, отличающееся тем, что расстояние между анодными секциями в продольном относительно изделия направлении составляет 10-50 мм. 6. Устройство по п.1, отличающееся тем, что оно дополнительно снабжено камерами обезжиривания и промывки поверхности изделия, установленными соответственно перед ванной-ячейкой и после нее по ходу продольного перемещения изделия. 7. Устройство по п.6, отличающееся тем, что камеры обезжиривания и промывки снабжены узлами уплотнения, аналогичными по конструкции узлам уплотнения, установленным на входе и выходе ванны-ячейки. 8. Устройство по пп.1 и 6, отличающееся тем, что узлы уплотнения ванны-ячейки и камер обезжиривания и промывки выполнены самоустанавливающимися и взаимозаменяемыми. 9. Устройство по пп.1 и 6, отличающееся тем, что ванна-ячейка и камеры обезжиривания и промывки снабжены карманами для сбора соответствующих рабочих ...

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Номер записи: 3
10-09-2007 дата публикации

УСТРОЙСТВО ДЛЯ ПОЛУЧЕНИЯ ЛИСТОВОГО АЛЮМИНИЯ

Номер: RU0000066258U1
Автор: Бледнова Жесфина Михайловна, Русинов Петр Олегович, Чаевский Михаил Иосифович
Принадлежит: Государственное образовательное учреждение высшего профессионального образования "Кубанский государственный технологический университет" (ГОУВПО "КубГТУ")

Устройство для получения листового алюминия, характеризующееся тем, что содержит керамическую ванну с расплавленным свинцом, вокруг корпуса ванны расположены нихромовые нагреватели, корпус ванны соединен с приемным столом, поверхность которого выполнена из чугуна, на столе, со стороны ванны установлен с возможностью горизонтального перемещения керамический затвор, на котором в месте контакта с расплавленным алюминием закреплены металлические пластины, а скребок для очистки алюминиевого листа от прилипших остатков свинца закреплен на керамической ванне. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) 66 258 (13) U1 (51) МПК B23P 15/06 (2006.01) C25D 3/00 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ, ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (21), (22) Заявка: 2007118995/22 , 21.05.2007 (24) Дата начала отсчета срока действия патента: 21.05.2007 (45) Опубликовано: 10.09.2007 (73) Патентообладатель(и): Государственное образовательное учреждение высшего профессионального образования "Кубанский государственный технологический университет" (ГОУВПО "КубГТУ") (RU) U 1 6 6 2 5 8 R U Ñòðàíèöà: 1 U 1 Формула полезной модели Устройство для получения листового алюминия, характеризующееся тем, что содержит керамическую ванну с расплавленным свинцом, вокруг корпуса ванны расположены нихромовые нагреватели, корпус ванны соединен с приемным столом, поверхность которого выполнена из чугуна, на столе, со стороны ванны установлен с возможностью горизонтального перемещения керамический затвор, на котором в месте контакта с расплавленным алюминием закреплены металлические пластины, а скребок для очистки алюминиевого листа от прилипших остатков свинца закреплен на керамической ванне. 6 6 2 5 8 (54) УСТРОЙСТВО ДЛЯ ПОЛУЧЕНИЯ ЛИСТОВОГО АЛЮМИНИЯ R U Адрес для переписки: 350072, г.Краснодар, ул. Московская, 2, ГОУ ВПО "КубГТУ", Отдел интеллектуальной и промышленной собственности, Проректору по НиМД, проф. В.С. Симанкову (72) Автор(ы): Чаевский Михаил Иосифович (RU ...

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Номер записи: 4
10-02-2011 дата публикации

УСТАНОВКА ДЛЯ ПРОТОЧНОГО ЖЕЛЕЗНЕНИЯ ВНЕШНИХ ПОВЕРХНОСТЕЙ ДЕТАЛЕЙ ТИПА "ВАЛ"

Номер: RU0000102009U1
Автор: Мурылев Михаил Юрьевич
Принадлежит: Ляпин Роман Алексеевич, Мурылев Константин Михайлович

1. Установка для проточного железнения внешних поверхностей деталей типа «вал», включающая ванну с электролитом, по крайней мере, одну рабочую камеру с расположенными в ней анодами, источник тока, отличающаяся тем, что она содержит расположенный выше уровня электролита непосредственно над ванной или около нее блок вращения обрабатываемой детали в горизонтальной плоскости, рабочая камера выполнена открытой сверху с возможностью размещения на покрываемой поверхности детали, проходящей через отверстие в стенке, перпендикулярной оси вращения, причем камера снабжена соплом для подачи электролита насосом из ванны снизу вверх вдоль оси вращения, а аноды выполнены в виде стержней или пластин из малоуглеродистой стали в анодных чехлах. 2. Установка по п.1, отличающаяся тем, что камера выполнена с возможностью изменения ее ширины в зависимости от длины покрываемой поверхности за счет перемещения стенки камеры вдоль оси вращения, а отверстие в стенке камеры снабжено набором кольцевых вставок или дисковых экранов, монтируемых на детали вплотную к стенкам камеры в соответствии с диаметром детали. 3. Установка по п.1, отличающаяся тем, что она содержит экраны для обеспечения равномерного распределения осадка железа по образующей покрываемой поверхности, расположенные между анодами и деталью. 4. Установка по п.1, отличающаяся тем, что для покрытия поверхностей деталей, имеющих эксцентриситет, блок вращения оснащен устройством для перемещения рабочей камеры перемещаться точно вместе с эксцентричной поверхностью, без касания с ней. 5. Установка по п.1, отличающаяся тем, что для обеспечения монтажа рабочей камеры для покрытия поверхности сложнопрофилированных деталей стенки камеры, перпендикулярные оси вращения, выполнены разъемными, причем линия разъема проходит горизонтально. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) 102 009 (13) U1 (51) МПК C25D 17/06 (2006.01) C25D 3/20 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ, ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (12) ОПИСАНИЕ ПОЛЕЗНОЙ ...

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Номер записи: 5
27-05-2015 дата публикации

ЭЛЕКТРОЛИТ ЛАТУНИРОВАНИЯ

Номер: RU0000152469U1
Автор: Барнашев Александр Владимирович, Булгакова Юлия Владимировна, Расторгуева Елена Анатольевна
Принадлежит: Публичное акционерное общество "Завод "Фиолент"

Электролит латунирования стальных деталей, включающий сульфат меди, сульфат цинка, борную кислоту и комплексообразователь, отличающийся тем, что содержит в качестве комплексообразователя пирофосфат калия и аммоний хлористый при следующем соотношении компонентов, г/л: И 1 152469 ко РОССИЙСКАЯ ФЕДЕРАЦИЯ ВУ” 152 469” 44 ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ИЗВЕЩЕНИЯ К ПАТЕНТУ НА ПОЛЕЗНУЮ МОДЕЛЬ ММ9К Досрочное прекращение действия патента из-за неуплаты в установленный срок пошлины за поддержание патента в силе Дата прекращения действия патента: 11.12.2018 Дата внесения записи в Государственный реестр: 16.09.2019 Дата публикации и номер бюллетеня: 16.09.2019 Бюл. №26 Стр.: 1 па 69у7с9 ЕП

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Номер записи: 6
10-06-2016 дата публикации

Многослойное ценное изделие

Номер: RU0000162264U1
Автор: Алексей Борисович Акинин, Андрей Борисович Курятников, Аркадий Владимирович Трачук, Георгий Валентинович Корнилов, Елена Михайловна Федорова, Сергей Никитович Гончаров, Сергей Сергеевич Моисеев
Принадлежит: Федеральное Государственное Унитарное Предприятие "Гознак" (Фгуп "Гознак")

1. Многослойное ценное изделие, содержащее основу из сплава железа, на поверхности которой гальваническим способом нанесен слой металла с люминесцентным защитным элементом, выполненный из маркирующего люминофора, покрытого защитной капсулой, оболочка которой выполнена прозрачной с возможностью пропускать волны оптического спектра.2. Изделие по п. 1, оличающееся тем, что оболочка пропускает волны, находящиеся в оптически видимой части спектра.3. Изделие по п. 1, оличающееся тем, что оболочка пропускает волны, находящиеся в оптически невидимой части спектра.4. Изделие по п. 1, оличающееся тем, что в качестве металла покрытия использован никель.5. Изделие по п. 1, оличающееся тем, что в качестве металла покрытия использовано серебро.6. Изделие по п. 1, оличающееся тем, что выполнено и в качестве металла покрытия использована латунь.7. Изделие по п. 1, оличающееся тем, что в качестве металла покрытия использована медь. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 162 264 U1 (51) МПК B32B 15/04 (2006.01) B32B 15/18 (2006.01) C25D 3/12 (2006.01) C25D 15/00 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ТИТУЛЬНЫЙ (21)(22) Заявка: ЛИСТ ОПИСАНИЯ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ 2015150539/05, 25.11.2015 (24) Дата начала отсчета срока действия патента: 25.11.2015 (45) Опубликовано: 10.06.2016 Бюл. № 16 (73) Патентообладатель(и): Федеральное государственное унитарное предприятие "Гознак" (ФГУП "Гознак") (RU) 1 6 2 2 6 4 R U (57) Формула полезной модели 1. Многослойное ценное изделие, содержащее основу из сплава железа, на поверхности которой гальваническим способом нанесен слой металла с люминесцентным защитным элементом, выполненный из маркирующего люминофора, покрытого защитной капсулой, оболочка которой выполнена прозрачной с возможностью пропускать волны оптического спектра. 2. Изделие по п. 1, оличающееся тем, что оболочка пропускает волны, находящиеся в оптически видимой части спектра. 3. Изделие по п. 1, оличающееся тем, что оболочка пропускает волны, ...

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Номер записи: 7
21-12-2021 дата публикации

Плоский стальной прокат с многослойным защитным покрытием

Номер: RU0000208467U1
Автор: Чернецов Василий Юрьевич
Принадлежит: Чернецов Василий Юрьевич

Полезная модель относится к плоскому стальному прокату с многослойным защитным покрытием. Указанный прокат содержит цинковый гальванический слой, выполненный с обеих сторон плоского проката, пассивирующий слой, выполненный по поверхности цинкового гальванического слоя с обеих сторон упомянутого проката, грунтовочный слой, выполненный с обеих сторон указанного проката, и слой защитного полимерного материала на основе поливинилиденфторида, выполненный поверх грунтовочного слоя с лицевой стороны стального плоского проката. Цинковый гальванический слой дополнительно содержит от 2 мас.% до 20 мас.% Ni, толщина слоя составляет от 4 мкм до 12 мкм с каждой стороны, при этом разнотолщинность каждого слоя цинка и слоев между собой не превышает 20%. Пассивирующий слой выполнен толщиной 1-2 мкм, грунтовочный слой выполнен толщиной 5-15 мкм, слой защитного полимерного материала с лицевой стороны выполнен толщиной 20-35 мкм на основе полимерной композиции с содержанием в ней от 85 мас.% до 90 мас.% поливинилиденфторида. Дополнительно с обратной стороны по грунтовочному слою выполнен слой защитного полимерного материала толщиной 10-35 мкм на основе композиции, состоящей из 40-50 мас.% поливинилиденфторида, 30-40 мас.% акрилатов и 10-30 мас.% эпоксидной смолы. Обеспечивается расширение арсенала технических средств защитных покрытий стального проката за счет формирования многослойного защитного покрытия, позволяющего получить высокую коррозионную и химическую стойкость. 7 пр. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 208 467 U1 (51) МПК C23C 28/00 (2006.01) C25D 3/22 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (52) СПК C23C 28/00 (2021.08); C25D 3/22 (2021.08) (21)(22) Заявка: 2021128326, 28.09.2021 (24) Дата начала отсчета срока действия патента: (73) Патентообладатель(и): Чернецов Василий Юрьевич (RU) Дата регистрации: 21.12.2021 (45) Опубликовано: 21.12.2021 Бюл. № 36 2 0 8 4 6 7 R U (54) Плоский стальной прокат с ...

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Номер записи: 8
02-02-2012 дата публикации

Composition for metal plating comprising suppressing agent for void free submicron feature filling

Номер: US20120024711A1
Автор: Alexandra Haag, Charlotte Emnet, Cornelia Roeger-Goepfert, Dieter Mayer, Roman Benedikt Raether
Принадлежит: BASF SE

A composition for filling submicrometer sized features having an aperture size of 30 nanometers or less comprising a source of copper ions, and at least one suppressing agent selected from compounds of formula (I) wherein the R1 radicals are each independently selected from a copolymer of ethylene oxide and at least one further C3 to C4 alkylene oxide, said copolymer being a random copolymer. the R2 radicals are each independently selected from R1 or alkyl. X and Y are spacer groups independently, and X for each repeating unit independently, selected from C1 to C6 alkylen and Z—(O—Z)m wherein the Z radicals are each independently selected from C2 to C6 alkylen, n is an integer equal to or greater than 0. m is an integer equal to or greater than 1.

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Номер записи: 9
02-02-2012 дата публикации

Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv) with heated substrate and cooled electrolyte

Номер: US20120024713A1
Автор: Robert F. Preisser
Принадлежит: Individual

Process of electrodepositing a metal in a high aspect ratio via in a silicon substrate to form a through-silicon-via (TSV), utilizing an electrolytic bath including a redox mediator, in an electrolytic metal plating system including a chuck adapted to hold the silicon substrate and to heat the silicon substrate to a first temperature, a temperature control device to maintain temperature of the electrolytic bath at a second temperature, in which the first temperature is maintained in a range from about 30° C. to about 60° C. and the second temperature is maintained at a temperature (a) at least 5° C. lower than the first temperature and (b) in a range from about 15° C. to about 35° C.

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Номер записи: 10
02-02-2012 дата публикации

Trivalent chromium plating solution and plating method using the same

Номер: US20120024714A1
Автор: A.B. Velichenko, Dae-Gun Kang, F.I. Danilov, Joo-yul Lee, Man Kim, Sang-yeoul Lee, Sik-Choi Kwon, V.O. Gordiienko, V.S. Protsenko
Принадлежит: Korea Institute of Machinery and Materials KIMM

Provided is hard trivalent chromium plating solution having improved covering power. The trivalent chromium plating solution comprises a trivalent chromium compound comprising a compound of formula (1) below; wherein Cr 2 (SO 4 ) n (OH) 6-2n ( n<3)   (1).

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Номер записи: 11
02-02-2012 дата публикации

Composition for metal plating comprising suppressing agent for void free submicron feature filling

Номер: US20120027948A1
Автор: Alexandra Haag, Charlotte Emnet, Cornelia Roeger-Goepfert, Dieter Mayer, Roman Benedikt Raether
Принадлежит: BASF SE

A composition comprising a source of metal ions and at least one suppressing agent obtainable by reacting a) an amine compound comprising active amino functional groups with b) a mixture of ethylene oxide and at least one compound selected from C3 and C4 alkylene oxides, said suppressing agent having a molecular weight M w of 6000 g/mol or more.

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Номер записи: 12
09-02-2012 дата публикации

Process for preparing reactive zinc by electrochemical reduction

Номер: US20120031771A1
Автор: Andreas Fischer, Daniel Breuninger, Daniela Mirk, Gerrit Waters, Itamar Michael Malkowsky, Laszlo Szarvas, Marc Martin, Markus Brueggemann, Steven Brughmans, Ulrich Griesbach
Принадлежит: BASF SE

The invention relates to a process for preparing reactive zinc by electrochemical reduction, wherein iron or steel is used as cathode material.

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Номер записи: 13
08-03-2012 дата публикации

Gallium Electrodeposition Processes and Chemistries

Номер: US20120055801A1
Автор: Hariklia Deligianni, Shafaat Ahmed
Принадлежит: International Business Machines Corp

Solutions and processes for electrodepositing gallium or gallium alloys includes a plating bath free of complexing agents including a gallium salt, an indium salt, a combination thereof, and a combination of any of the preceding salts with copper, an acid, and a solvent, wherein the pH of the solution is in a range selected from the group consisting of from about zero to about 2.6 and greater than about 12.6 to about 14. An optional metalloid may be included in the solution.

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Номер записи: 14
29-03-2012 дата публикации

Iridium plating solution and method of plating using the same

Номер: US20120073980A1
Автор: Masahiro Ito
Принадлежит: Individual

Proposed are an iridium plating solution capable of easily forming an iridium plating coat in which the occurrence of cracks is suppressed as much as possible and an iridium plating method. In the present invention, the iridium plating solution uses an iridium compound obtained by adding, to an iridium (III) complex salt containing a halogen as an anionic component, one or more compounds selected from the following group and by stirring the resulting mixture, the group consisting of a saturated monocarboxylic acid, a saturated monocarboxylic acid salt, a saturated dicarboxylic acid, a saturated dicarboxylic acid salt, a saturated hydroxycarboxylic acid, a saturated hydroxycarboxylic acid salt, an amide and urea, wherein the iridium plating solution includes at least one or more of Fe, Co, Ni and Cu.

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Номер записи: 15
26-04-2012 дата публикации

Silver electroplated and/or silver alloy electroplated article having an oxidation layer on its surface

Номер: US20120097545A1
Автор: Ryusuke Oka, Takashi Kinase, Toru Imori
Принадлежит: Individual

The object of the present invention is to provide a silver plated and/or a silver alloy plated article with high productivity, high reflectance in the visible light range, and excellent sulfidizing resistance. The present invention provides a silver electroplated and/or silver alloy electroplated article having an oxidation layer on its surface, wherein a silver plating layer and/or silver alloy plating layer is formed on a substrate by silver electroplating and/or silver alloy electroplating, and then subjected to oxidation treatment to form an oxidation layer on the surface thereof. The thickness of the oxidation layer formed on the surface of the plating layer is 0.05 μm or more.

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Номер записи: 16
03-05-2012 дата публикации

Plating or Coating Method for Producing Metal-Ceramic Coating on a Substrate

Номер: US20120107627A1
Автор: Wei Gao, Weiwei Chen
Принадлежит: Auckland Uniservices Ltd

A method for producing a metal-ceramic composite coating with increased hardness on a substrate includes adding a sol of a ceramic phase to the plating solution or electrolyte. The sol may be added prior to and/or during the plating or coating and at a rate of sol addition controlled to be sufficiently low that nanoparticles of the ceramic phase form directly onto or at the substrate and/or that the metal-ceramic coating forms on the substrate with a predominantly crystalline structure and/or to substantially avoid formation of nanoparticles of the ceramic phase, and/or agglomeration of particles of the ceramic phase, in the plating solution or electrolyte. The ceramic phase may be a single or mixed oxide, carbide, nitride, silicate, boride of Ti, W, Si, Zr, Al, Y, Cr, Fe, Pb, Co, or a rare earth element. The coating, other than the ceramic phase may comprise Ni, Ni—P, Ni—W—P, Ni—Cu—P, Ni—B, Cu, Ag, Au, Pd.

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Номер записи: 17
17-05-2012 дата публикации

Electrolytic Dissolution of Chromium from Chromium Electrodes

Номер: US20120118749A1
Автор: Trevor Pearson
Принадлежит: Individual

An electrolytic cell for replenishing chromium content of a trivalent chromium. electrolyte and a method of replenishing trivalent chromium content using the electrolytic cell is provided. The method comprising the steps of immersing a chromium electrode and a second electrode in a trivalent chromium electrolyte and applying an alternating pulse current across the chromium electrode and the second electrode. In this manner, trivalent chromium is electrolytically dissolved from the chromium electrode and the trivalent chromium content of the electrolyte in which the chromium electrode is immersed is enriched.

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Номер записи: 18
17-05-2012 дата публикации

Coated articles, electrodeposition baths, and related systems

Номер: US20120118755A1
Автор: Alan C. Lund, John Cahalen, John D&#39;Urso, Jonathan C. Trenkle, Nazila Dadvand
Принадлежит: Xtalic Corp

Coated articles, electrodeposition baths, and related systems are described. The article may include a base material and a coating comprising silver formed thereon. In some embodiments, the coating comprises a silver-based alloy, such as a silver-tungsten alloy. The coating can exhibit desirable properties and characteristics such as durability (e.g., wear), hardness, corrosion resistance, and high conductivity, which may be beneficial, for example, in electrical and/or electronic applications. In some cases, the coating may be applied using an electrodeposition process.

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Номер записи: 19
31-05-2012 дата публикации

Tin plating solution

Номер: US20120132530A1
Автор: Makoto Sakai, Mutsuko Saito, Shinjiro Hayashi
Принадлежит: Rohm and Haas Electronic Materials LLC

To provide a tin plating solution having uniformity of through-hole plating, uniformity of film thickness distribution and no burn deposits even. The tin plating solution include a tin ion source, at least one non-ionic surfactant, imidazoline dicarboxylate and 1,10-phenanthroline.

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Номер записи: 20
21-06-2012 дата публикации

Electrolytic copper process using anion permeable barrier

Номер: US20120152751A1
Автор: Bioh Kim, John Lee Klocke, Kyle M. Hanson, Rajesh Baskaran, Robert W. Batz, Jr., Tom L. Ritzdorf
Принадлежит: Applied Materials Inc

Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and a counter electrode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, a counter electrode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. Some of the described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.

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Номер записи: 21
16-08-2012 дата публикации

Tin-containing alloy plating bath, electroplating method using same, and substrate with the electroplating deposited thereon

Номер: US20120208044A1
Автор: Kenji Dewaki, Shinji Dewaki, Teru Matsuura, Yukari DEWAKI
Принадлежит: M Tech Japan Co Ltd

Provided are a tin-containing alloy plating bath being capable of manufacturing a tin-containing alloy plated product suitable for electric and electronic members with excellent anti-oxidation performance, and an electroplating method using the bath. Specifically the bath is a plating bath to deposit a tin-containing alloy on the surface of a substrate, which plating bath contains: (a) a tin compound containing 99.9% by mass to 46% by mass of tin based on entire metal mass in the plating bath; (b) a gadolinium compound containing 0.1% by mass to 54% by mass of gadolinium based on entire metal mass in the plating bath; (c) at least one complexing agent; and (d) a solvent, and the electroplating method uses the tin-containing alloy bath, thus can manufacture a tin-containing alloy plated product having excellent anti-oxidation performance.

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Номер записи: 22
30-08-2012 дата публикации

Process for the electrolytic copper plating of zinc diecasting having a reduced tendency to blister formation

Номер: US20120217166A1
Автор: Frank Straubinger, Franz Gassner, Guenter Wirth, Klaus Reissmueller, Silvia Neuhaus
Принадлежит: UMICORE GALVANOTECHNIK GMBH

In the electroplating of zinc diecastings with a copper layer, the electrolyte penetrates into the pores of the zinc diecasting. When the temperature is increased later, this leads to vaporization of the electrolyte liquid in the pores and to blistering or flaking of the copper layer. It is proposed that plating be carried out in two steps. In the first step, only a thin copper layer of less than 1 μm is applied and the plated parts are then treated at a temperature which leads to vaporization of the electrolyte liquid. The thin copper layer is still sufficiently porous for the vapour to be able to escape. Only the solid constituents of the electrolyte remain. The copper layer is then thickened to a final thickness of from about 20 to 30 μm. In this plating step, electrolyte liquid no longer penetrates into the pores of the zinc diecasting. The parts which are coated in this way display no blistering or flaking of the copper layer after storage at a temperature of 150° C.

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Номер записи: 23
20-09-2012 дата публикации

Nickel-Plated Steel Sheet for Manufacturing Pipe Having Corrosion Resistance Against Fuel Vapors, Pipe Which Uses the Steel Sheet,and Fuel Supply Pipe Which Uses the Steel Sheet

Номер: US20120234428A1
Автор: Hideyuki Minagi, Koh Yoshioka, Tatsuo Tomomori
Принадлежит: Toyo Kohan Co Ltd

Provided is a nickel-plated steel sheet for manufacturing a pipe having corrosion resistance against fuel vapor of fuel such as gasoline, light oil, bioethanol or bio-diesel fuel, and a pipe and a fuel supply pipe. In the nickel-plated steel sheet for manufacturing a pipe, a nickel plating layer having a plating thickness of 0.5 to 10 μm is formed on a surface of a steel sheet thus having corrosion resistance against fuel vapor. In the pipe and the fuel supply pipe, a nickel plating layer having a plating thickness of 0.5 to 10 μm is formed on an inner surface of a pipe formed of a steel sheet thus having corrosion resistance against fuel vapor. In the fuel supply pipe 20 formed of a steel sheet for supplying fuel to a fuel tank 23 , the fuel supply pipe includes: a large-diameter pipe portion 21 through which the fuel passes; and a small-diameter pipe portion 22 which makes an upper portion of the large-diameter pipe portion and a lower portion of the large-diameter pipe portion communicate with each other for ventilation, and a nickel plating layer having a plating thickness of 0.5 to 10 μm is formed on an inner surface of at least the small-diameter pipe portion.

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Номер записи: 24
20-09-2012 дата публикации

Porous three dimensional copper, tin, copper-tin, copper-tin-cobalt, and copper-tin-cobalt-titanium electrodes for batteries and ultra capacitors

Номер: US20120237823A1
Автор: Dmitri A. Brevnov, Robert Z. Bachrach, Sergey D. Lopatin
Принадлежит: Applied Materials Inc

A method and apparatus for forming a reliable and cost efficient battery or electrochemical capacitor electrode structure that has an improved lifetime, lower production costs, and improved process performance are provided. In one embodiment a method for forming a three dimensional porous electrode for a battery or an electrochemical cell is provided. The method comprises depositing a columnar metal layer over a substrate at a first current density by a diffusion limited deposition process and depositing three dimensional metal porous dendritic structures over the columnar metal layer at a second current density greater than the first current density.

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Номер записи: 25
15-11-2012 дата публикации

Electronic component

Номер: US20120288731A1
Автор: Akihiro Motoki, Atsuko Saito, Kenji Masuko, Makoto Ogawa, Toshinobu FUJIWARA
Принадлежит: Murata Manufacturing Co Ltd

A laminated ceramic capacitor includes a rectangular solid-shaped electronic component element. External electrodes of terminal electrodes are disposed at one end surface and the other end surface of the electronic component element. First plated films including a Ni plating are disposed on the surfaces of external electrodes. On the surfaces of the first plated films, second plated films containing Sn are disposed as Sn-plated films defining outermost layers of the external electrodes. The second plated films have a polycrystalline structure, and flake-shaped Sn—Ni alloy grains are located at a Sn crystal grain boundary and within a Sn crystal grain, respectively.

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Номер записи: 26
15-11-2012 дата публикации

Electroplating method for depositing continuous thin layers of indium or gallium rich materials

Номер: US20120288986A1
Автор: Bulent M. Basol, Jiaxiong Wang, Serdar Aksu
Принадлежит: SoloPower Inc

An electrochemical deposition method to form uniform and continuous Group IIIA material rich thin films with repeatability is provided. Such thin films are used in fabrication of semiconductor and electronic devices such as thin film solar cells. In one embodiment, the Group IIIA material rich thin film is deposited on an interlayer that includes 20-90 molar percent of at least one of In and Ga and at least 10 molar percent of an additive material including one of Cu, Se, Te, Ag and S. The thickness of the interlayer is adapted to be less than or equal to about 20% of the thickness of the Group IIIA material rich thin film.

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Номер записи: 27
29-11-2012 дата публикации

Electrolyte and process for depositing a matt metal layer

Номер: US20120298519A1
Автор: Andreas Konigshofen, Andreas Mobius, Christoph Werner, Danica Elbick, Peter Pies, Wolfgang Clauberg
Принадлежит: Enthone Inc

An electrolytic composition for the deposition of a matt metal layer onto a substrate and deposition process where the composition comprises a source of metal from the group consisting of Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Re, Pt, Au, Bi, and combinations thereof; a substituted or unsubstituted polyalkylene oxide or its derivative as an emulsion and/or dispersion former; and a compound comprising fluorated or perfluorated hydrophobic chains or which is a polyalkylene oxide substituted quaternary ammonium compound as wetting agent; wherein the electrolytic composition forms a microemulsion and/or dispersion.

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Номер записи: 28
29-11-2012 дата публикации

Silver-coated composite material for a movable contact part, method of producing the same, and movable contact part

Номер: US20120301745A1
Автор: Masato Ohno, Satoru Zama, Satoshi Suzuki, Yoshiaki Kobayashi
Принадлежит: Furukawa Electric Co Ltd

A silver-coated composite material for movable contact parts, which has: an underlying layer composed of any one of nickel, cobalt, a nickel alloy, and a cobalt alloy at least provided on a part of the surface of a stainless steel substrate; an intermediate layer composed of copper or a copper alloy provided thereon; and a silver or silver alloy layer provided thereon as an outermost layer, wherein a thickness of the intermediate layer is 0.05 to 0.3 μm, and wherein an average grain size of the silver or silver alloy provided as the outermost layer is 0.5 to 5.0 μm.

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Номер записи: 29
20-12-2012 дата публикации

Method of electroplating uniform copper layers

Номер: US20120318676A1
Автор: Elie H. Najjar, Leon R. Barstad, Mark Lefebvre, Michael P. Toben
Принадлежит: Rohm and Haas Electronic Materials LLC

Electroplating methods provide substantially uniform deposits of copper on the edges and walls of through-holes of printed circuit boards. The electroplating methods provide copper deposits which have high throwing power.

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Номер записи: 30
27-12-2012 дата публикации

Gallium Electrodeposition Processes and Chemistries

Номер: US20120325668A1
Автор: Hariklia Deligianni, Shafaat Ahmed
Принадлежит: International Business Machines Corp

Solutions and processes for electrodepositing gallium or gallium alloys includes a plating bath free of complexing agents including a gallium salt, an indium salt, a combination thereof, and a combination of any of the preceding salts with copper, an acid, and a solvent, wherein the pH of the solution is in a range selected from the group consisting of from about zero to about 2.6 and greater than about 12.6 to about 14. An optional metalloid may be included in the solution.

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Номер записи: 31
10-01-2013 дата публикации

Copper Foil for Printed Circuit

Номер: US20130011690A1
Автор: Atsushi Miki, Hideta Arai
Принадлежит: JX Nippon Mining and Metals Corp

Disclosed is a copper foil for printed circuits prepared by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on ternary alloy composed of copper, cobalt and nickel on the primary particle layer; in which the average particle size of the primary particle layer is 0.25 to 0.45 μm, and the average particle size of the secondary particles layer based on ternary alloy composed of copper, cobalt and nickel is 0.05 to 0.25 μm. Provided is a copper foil for printed circuits, in which powder fall from the copper foil can be reduced and the peeling strength and heat resistance can be improved by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on copper-cobalt-nickel alloy plating on the primary particle layer.

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Номер записи: 32
24-01-2013 дата публикации

Silver plated electrical contact

Номер: US20130023166A1
Автор: Robert Daniel Hilty, Zhengwei Liu
Принадлежит: Tyco Electronics Corp

A method for silver plating an electrical contact is provided. The method includes cleaning an electrical contact by removing oil or other contaminants and exposing the electrical contact to at least one of an acid or base. The method also includes preparing a silver plating bath including a silver compound, a transition metal compound, and a supporting salt, wherein the transition metal is at least one of nickel or cobalt. The method further includes silver plating the electrical contact in the silver plating bath.

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Номер записи: 33
31-01-2013 дата публикации

Core-shell type metal nanoparticles and method for producing the same

Номер: US20130029842A1
Автор: Atsuo Iio, Hiroko Kimura, Koshi Sekizawa, Naoki Takehiro, Tatsuya Arai
Принадлежит: Toyota Motor Corp

The present invention provides core-shell type metal nanoparticles having a high surface coverage of the core portion with the shell portion, and a method for producing the same. Disclosed is core-shell type metal nanoparticles comprising a core portion comprising a core metal material and a shell portion covering the core portion, wherein the core portion substantially has no {100 } plane of the core metal material on the surface thereof.

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Номер записи: 34
21-02-2013 дата публикации

Novel compound and use thereof

Номер: US20130043137A1
Автор: Aya Shimomura, Hiroki Yasuda, Hiroshi Ishizuka, Mikiko Kosaka, Ryoichi Kimizuka, Takuro Sato, Tatsuji Takasu, Yasuhiro Ogo, Yu Tonooka, Yumiko Shimizu, Yuto Oyama
Принадлежит: JCU Corp

Provided is a copper plating technique that enables the filling of high aspect-ratio via-holes and through-holes in semiconductor substrates such as silicon substrates, organic material substrates or ceramic substrates. The disclosed technique involves a tertiary amine compound, which is obtained by reacting a heterocyclic compound with the epoxy group of a glycidyl ether group of a compound that has three or more glycidyl ether groups, and a quaternary amine compound thereof, as well as a copper plating additive, a copper plating bath, and a copper plating method employing the compounds.

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Номер записи: 35
28-02-2013 дата публикации

Biocidal metallic layers comprising cobalt

Номер: US20130052482A1
Автор: Diana Facchini, Francisco Gonzalez, Gino Palumbo, Jonathan McCrea, Klaus Tomantschger, Mike Uetz
Принадлежит: Integran Technologies Inc

Free standing articles or articles at least partially coated with substantially porosity free, fine-grained and/or amorphous Co-bearing metallic materials optionally containing solid particulates dispersed therein, are disclosed. The electrodeposited metallic layers and/or patches comprising Co provide, enhance or restore strength, wear and/or lubricity of substrates without reducing the fatigue performance. The fine-grained and/or amorphous metallic coatings comprising Co are particularly suited for articles exposed to thermal cycling, fatigue and other stresses and/or in applications requiring anti-microbial properties.

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Номер записи: 36
07-03-2013 дата публикации

Acid Mist Mitigation Agents for Electrolyte Solutions

Номер: US20130056357A1
Автор: Jack BENDER, Louis Rebrovic, Michael Virnig
Принадлежит: Cognis IP Management GmbH

Sulfonate-, sulfate-, or carboxylate-capped, alkoxylated anti-misting agents having the structure: R((AO) n X) m ((AO) n H) p , and methods of suppressing mist from electrolyte solutions by adding a mist-suppressing amount of one or more compounds selected from the group consisting of compounds of the Formulas R((AO) n X) m ((AO) n H) p and R 3 N + (CH 3 ) 2 R 4 , and mixtures thereof, to electrolyte solutions.

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Номер записи: 37
14-03-2013 дата публикации

Photovoltaic devices with metal semiconductor alloy metallization

Номер: US20130061917A1
Автор: Qiang Huang
Принадлежит: International Business Machines Corp

A photovoltaic device, such as a solar cell, having improved performance is provided. In one embodiment, the photovoltaic device includes a multimetal semiconductor alloy layer located on exposed portions of a front side surface of a semiconductor substrate. The multimetal semiconductor alloy layer includes at least a first elemental metal that forms an alloy with a semiconductor material, and a second elemental metal that differs from the first elemental metal and that does not form an alloy with a semiconductor material at the same temperature as the first elemental metal. The photovoltaic device further includes a copper-containing layer located atop the multimetal semiconductor alloy layer.

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Номер записи: 38
14-03-2013 дата публикации

Embedding a nanotube inside a nanopore for dna translocation

Номер: US20130062212A1
Автор: Ali Afzali-Ardakani, Binquan Luan, Hongbo Peng
Принадлежит: International Business Machines Corp

A technique for embedding a nanotube in a nanopore is provided. A membrane separates a reservoir into a first reservoir part and a second reservoir part, and the nanopore is formed through the membrane for connecting the first and second reservoir parts. An ionic fluid fills the nanopore, the first reservoir part, and the second reservoir part. A first electrode is dipped in the first reservoir part, and a second electrode is dipped in the second reservoir part. Driving the nanotube into the nanopore causes an inner surface of the nanopore to form a covalent bond to an outer surface of the nanotube via an organic coating so that the inner surface of the nanotube will be the new nanopore with a super smooth surface for studying bio-molecules while they translocate through the nanotube.

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Номер записи: 39
21-03-2013 дата публикации

COMPOSITION FOR METAL ELECTROPLATING COMPRISING LEVELING AGENT

Номер: US20130068626A1
Автор: Arnold Marco, Emnet Charlotte, Fluegel Alexander, Mayer Dieter, Meier Nicole, Raether Roman Benedikt, Roeger-Goepfert Cornelia, Siemer Michael
Принадлежит: BASF SE

A composition comprising a source of metal ions and at least one leveling agent comprising a linear or branched, polymeric imidazolium compound comprising the structural unit of formula L1 (L1) wherein R, R, Rare each independently selected from an H atom and an organic radical having from 1 to 20 carbon atoms, R4 is a divalent, trivalent or mutlivalent organic radical which does not comprise a hydroxyl group in the α or β position relative to the nitrogen atom of the imidazole rings is an integer. 2. The composition according to claim 1 , wherein Rand Rare H atoms.3. The composition according to claim 1 , wherein Ris an H atom.4. The composition according to claim 1 , wherein Ris a substituted or an unsubstituted C2 to C20 alkandiyl.5. The composition according to claim 4 , wherein Rdoes not comprise hydroxyl groups.6. The composition according to claim 1 , wherein the additive comprises a counterion hu o− claim 1 , wherein o is an integer.7. The composition according to claim 6 , wherein the counterion Y is a chloride claim 6 , a sulfate or an acetate.8. The composition according to claim 1 , wherein a number average molecular weight Mof the polymeric imidazolium compound claim 1 , determined by gel permeation chromatography claim 1 , is greater than 500 g/mol.9. The composition according to claim 1 , wherein the polymeric imidazolium compound comprises more than 80% by weight of structural units of the formula L1.10. The composition according to claim 1 , wherein the additive is prepared by reacting{'sup': 1', '2, 'an α-dicarbonyl compound R—CO—CO—R,'}{'sup': '3', 'an aldehyde R—CHO,'}{'sub': 'm', 'sup': '4', 'at least one amino compound (NH2—)R, and'}{'sup': +', 'o−, 'sub': 'o', 'a protic acid (H)Y.'}11. The composition according to claim 10 , wherein the amino compound is an aliphatic or aromatic diamine claim 10 , triamine claim 10 , multiamin claim 10 , or mixtures thereof.12. (canceled)13. The composition according to claim 1 , further comprising an ...

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Номер записи: 40
28-03-2013 дата публикации

ACRYLIC ANTICRATER ADDITIVE FOR ELECTROCOATS

Номер: US20130075269A1
Автор: Johnson Jeffery W., Smith Alan E., Woodhouse Michael E.
Принадлежит: E I DU PONT DE NEMOURS AND COMPANY

The present disclosure is directed to an anticrater additive that is useful for providing a smooth surface to a cured layer of an electrocoating composition on a substrate. The anticrater additive comprises the reaction product of a polyisocyanate with an acrylic polymer having one isocyanate reactive functional group. The acrylic polymer can be an acrylic polymer that is terminated with a chain transfer agent. Also disclosed is an electrocoat composition comprising the anticrater additive and a substrate coated with a cured layer of the electrocoat composition. 1. An anticrater additive comprising a copolymer that is the reaction product of an isocyanate containing compound with an isocyanate blocking compound , wherein the isocyanate containing compound has a structure according to the formula:{'br': None, 'sub': 'n', '(OCN)—X—N(H)—C(O)-G-R—S—Z;'}wherein n is an integer from 1 to 6;X is selected from the group consisting of aryl, alkyl, cycloalkyl groups and a combination thereof having up to 60 carbon atoms; wherein each of the aryl, alkyl, cycloalkyl groups can optionally be substituted with an isocyanurate group, an iminooxadiazine dione group, an allophanate group, a biuret group, a urea group, a urethane group or a uretidione group;{'sub': '1', 'G is selected from the group consisting of O, N(R) or a direct bond;'}R is selected from the group consisting of aryl, alkyl, cycloalkyl groups and a combination thereof having up to 20 carbon atoms, and R can optionally contain amide, ester, ether, urethane and/or urea groups;{'sub': '1', 'Ris selected from the group consisting of H, aryl, alkyl, cycloalkyl groups and a combination thereof having up to 20 carbon atoms; and'}Z comprises polymerized (meth)acrylic monomers.The anticrater additive of claim wherein X comprises an aryl group or a combination of both aryl and alkyl groups.The anticrater additive of claim wherein the polymerized (meth)acrylic monomers are chosen from the group consisting of methyl acrylate, ...

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Номер записи: 41
04-04-2013 дата публикации

METHOD FOR TREATING THE SURFACE OF A DEVICE FOR DISPENSING A FLUID PRODUCT

Номер: US20130081953A1
Автор: Bruna Pascal, Laurent Matthieu, Nekelson Fabien, Roussel Sébastien, Tessier Lorraine
Принадлежит: VALOIS SAS

A treatment method for treating the surface of a fluid dispenser device, said method comprising the step of using chemical grafting to form a thin film on at least one support surface of at least one movable portion of said device that is movable while said device is being actuated, said thin film having anti-friction properties. 1. A treatment method for treating the surface of a fluid dispenser device , said method being characterized in that it comprises a step of using chemical grafting to form a thin film on at least one support surface of at least one movable portion of said device that is movable while said device is being actuated , said thin film having anti-friction properties.2. A method according to claim 1 , wherein said grafting step comprises putting said surface that is in contact with the fluid into contact with a solution that includes at least one adhesive primer claim 1 , said adhesive primer being a cleavable aryl salt claim 1 , and at least one monomer or polymer selected from the group constituted by vinyl- or acrylic-terminated siloxanes.3. A method according to claim 1 , wherein vinyl- or acrylic-terminated siloxanes are selected from the group constituted by: vinyl- or acrylic-terminated polyalkylsiloxanes such as vinyl- or acrylic-terminated polymethylsiloxane; vinyl- or acrylic-terminated polydimethylsiloxane such as polydimethylsiloxane-acrylate (PDMS-acrylate); vinyl- or acrylic-terminated polyarylsiloxanes such as vinyl- or acrylic-terminated polyphenylsiloxane such as polyvinylphenylsiloxane; and vinyl- or acrylic-terminated polyarylalkylsiloxanes such as vinyl- or acrylic-terminated polymethylphenylsiloxane.4. A method according to claim 1 , wherein the cleavable aryl salt is selected from the group constituted by: aryl diazonium salts; aryl ammonium salts; aryl phosphonium salts; aryl sulfonium salts; and aryl iodonium salts.5. A method according to claim 1 , wherein said chemical-grafting step is initiated by chemical activation.6. ...

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Номер записи: 42
11-04-2013 дата публикации

STEEL SHEET FOR CONTAINER AND METHOD OF MANUFACTURING THE SAME

Номер: US20130089751A1
Автор: Hirano Shigeru, Kawabata Makoto, Tachiki Akira, Yanagihara Morio, Yokoya Hirokazu
Принадлежит: NIPPON STEEL & SUMITOMO METAL CORPORATION

The present invention provides a steel sheet for a container including a cold-rolled steel sheet and a composite film formed on the cold-rolled steel sheet through an electrolysis process in a solution containing: at least one metal ion of an Sn ion, an Fe ion, and an Ni ion; Zr ion; a nitric acid ion: and an ammonium ion, in which the composite film contains at least one element of: Zr of 0.1 to 100 mg/min equivalent units of metal Zr; Sn of 0.3 to 20 g/min equivalent units of metal Sn; Fe of 5 to 2000 mg/min equivalent units of metal Fe; and Ni of 5 to 2000 mg/min equivalent units of metal Ni. 1. A steel sheet for a container , the steel sheet comprisinga cold-rolled steel sheet, and at least one metal ion selected from the group consisting of an Sn ion, an Fe ion, and an Ni ion;', 'a Zr ion;', 'a nitric acid ion; and', 'an ammonium ion, wherein, 'a composite film formed on the cold-rolled steel sheet through an electrolysis process in a solution containing [{'sup': '2', 'Zr of 0.1 to 100 mg/min equivalent units of metal Zr, {'sup': '2', 'Sn of 0.3 to 20 g/min equivalent units of metal Sn;'}, {'sup': '2', 'Fe of 5 to 2000 mg/min equivalent units of metal Fe; and'}, {'sup': '2', 'Ni of 5 to 2000 mg/min equivalent units of metal Ni.'}], 'the composite film contains at least one element selected from the group consisting of2. The steel sheet for a container according to claim 1 , whereinthe solution further contains at least one of a phosphoric acid ion and a phenolic resin, and{'sup': 2', '2, 'the composite film further contains at least one of a phosphoric acid compound of 0.1 to 50 mg/min equivalent units of P, and a phenolic resin of 0.1 to 50 mg/min equivalent units of C.'}3. The steel sheet for a container according to claim 2 , whereinthe solution further contains a fluorine ion, and{'sup': '2', 'the composite film further contains a fluorine compound of not more than 0.1 mg/min equivalent units of F.'}4. The steel sheet for a container according to claim 1 , ...

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Номер записи: 43
25-04-2013 дата публикации

Plating bath and method

Номер: US20130098770A1
Автор: Maria Anna Rzeznik, Zuhra I. NIAZIMBETOVA
Принадлежит: Rohm and Haas Electronic Materials LLC

Copper plating baths containing a leveling agent that is a reaction product of one or more of certain pyridine compounds with one or more epoxide-containing compounds, that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.

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Номер записи: 44
09-05-2013 дата публикации

Electroplating Solutions and Methods For Deposition of Group IIIA-VIA Films

Номер: US20130112564A1
Автор: Aksu Serdar, Kleiman-Shwarsctein Alan, Pinarbasi Mustafa
Принадлежит: SoloPower, Inc.

The embodiment described herein relate to pulse electroplating methods and solutions. 1. A method of forming an absorber layer over a surface of a base , the method comprising:forming a metal layer over the surface of the base, wherein the metal layer comprises a Group IIIA material;co-depositing Group IIIIA and Group VA materials to form a Group IIIA-VIA layer on the metal layer using pulse electroplating that varies an electroplating pulse between a first higher value and a second lower value, wherein at the first higher value electroplating of at least one of Ga and In predominates, and wherein at the second lower value electroplating of one of Se, Te and S predominates, wherein the step of co-depositing the Group IIIA-VIA layer uses a roll-to-roll electroplating process wherein the base having the metal layer is continuously advanced within an electroplating solution held in a deposition chamber as at least one electric field is formed between at least one anode to deposit the Group IIIA-VIA layer onto the metal layer; andreacting the metal layer and the Group IIIA-VIA layer to form the absorber layer.2. The method of wherein the Group IIIA-VIA layer is one of a Ga—Se alloy claim 1 , In—Se and In—Ga—Se alloy.3. The method of wherein the Group IIIA-VIA layer is one of a Ga—Te alloy claim 1 , In—Te and In—Ga—Te alloy.4. The method of wherein the Group IIIA-VIA layer is one of a Ga—S alloy claim 1 , In—S and In—Ga—S alloy.5. The method of wherein the Group IIIA-VIA layer is one of a Ga—Se—Te alloy claim 1 , In—Se—Te and In—Ga—Se—Te alloy.6. The method of wherein the Group IIIA-VIA layer is one of a Ga—Se—S claim 1 , In—Se—S and In—Ga—Se—S alloy.7. The method of wherein the Group IIIA-VIA layer is one of a Ga—Te—S claim 1 , In—Te—S and In—Ga—Te—S alloy.8. The method of wherein the Group IIIA-VIA layer is one of a Ga—Se—Te—S claim 1 , In—Se—Te—S and In—Ga—Se—Te—S alloy.9. The method of claim 1 , wherein the step of forming the metal layer comprises forming an In- ...

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Номер записи: 45
09-05-2013 дата публикации

Electrodeposited metallic coatings comprising cobalt with enhanced fatigue properties

Номер: US20130115478A1
Автор: Diana Facchini, Francisco Gonzalez, Gino Palumbo, Jonathan McCrea, Klaus Tomantschger, Mike Uetz
Принадлежит: Integran Technologies Inc

Free standing articles or articles at least partially coated with substantially porosity free, fine-grained and/or amorphous Co-bearing metallic materials optionally containing solid particulates dispersed therein, are disclosed. The electrodeposited metallic layers and/or patches comprising Co provide, enhance or restore strength, wear and/or lubricity of substrates without reducing the fatigue performance compared to either uncoated or equivalent thickness chromium coated substrate. The fine-grained and/or amorphous metallic coatings comprising Co are particularly suited for articles exposed to thermal cycling, fatigue and other stresses and/or in applications requiring anti-microbial properties.

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Номер записи: 46
16-05-2013 дата публикации

METHOD FOR PRODUCING ALUMINUM STRUCTURE AND ALUMINUM STRUCTURE

Номер: US20130121873A1
Автор: Goto Kengo, HOSOE Akihisa, Kimura Koutarou, Nishimura Junichi, Okuno Kazuki, Ota Hajime
Принадлежит: Sumitomo Electric Industries, Ltd.

An object is to provide a method for producing an aluminum structure using a porous resin body having a three-dimensional network structure, with which an aluminum structure having a low impurity content can be formed, and in particular, a porous aluminum body having a large area can be obtained. 1. A method for producing an aluminum structure comprising:a conductivity-imparting step of applying a conductive coating material containing conductive carbon onto a surface of a resin body to impart electrical conductivity to the resin body;a plating step of plating a surface of the resin body, to which electrical conductivity has been imparted, with aluminum in a molten salt to form an aluminum layer; anda heat treatment step of conducting heat treatment to remove the resin body,wherein the conductive carbon is carbon black having an average particle diameter of 0.003 μm or more and 0.05 μm or less.2. The method for producing an aluminum structure according to claim 1 , wherein the heat treatment step is conducted at a temperature of 500° C. or higher and 640° C. or lower in an atmosphere containing oxygen.3. The method for producing an aluminum structure according to claim 1 , wherein the resin body is a porous resin body having a three-dimensional network structure.4. The method for producing an aluminum structure according to claim 1 , wherein the resin body is composed of polyurethane.5. An aluminum structure produced by the method according to .6. An Aluminum structure according to claim 5 , wherein a carbon content is 2% by weight or less. The present application is a continuation application of International Application No. PCT/JP2012/063007, filed May 22, 2012, which claims priority to Japanese Patent Application No. 2011-124707, filed Jun. 3, 2011. The contents of these applications are incorporated herein by reference in their entirety.The present invention relates to an aluminum structure suitable for use as a porous metal body used in various filters, battery ...

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Номер записи: 47
23-05-2013 дата публикации

CHIP ELECTRONIC DEVICE

Номер: US20130128411A1
Автор: TAHARA Mikio
Принадлежит: TAIYO YUDEN CO., LTD.

Provided is a chip electronic device that has an increased reliability with a small size. A chip electronic component has a main body made of a ceramic having an internal electrode therein. Provided on the main body is an external electrode that is made of a first electrode layer on the main body, a conductive protective layer on the first electrode layer, and a second electrode layer on the conductive protective layer formed by electrolytic plating. The conductive protective layer prevents hydrogen from diffusing into the main body during the electrolytic plating. 1. A chip electronic device , comprising:a main body that is made of a ceramic and that has an internal electrode therein; andan external electrode formed on an outer surface of the main body, the external electrode including:a first electrode layer formed on the outer surface of the main body;a conductive protective layer formed on an outer surface of the first electrode layer by a physical vapor deposition method or a chemical vapor deposition method, the conductive protective layer substantially preventing hydrogen from diffusing into the main body form an exterior during electrolytic plating to be performed thereafter; anda second electrode layer formed on an outer surface of the conductive protective layer by electrolytic plating, the second electrode layer being made of one or more layers.2. The chip electronic device according to claim 1 , wherein the conductive protective layer includes first metal grains and second metal grains claim 1 , the first metal grain having a higher hydrogen storage capacity than that of Ni claim 1 , the second metal grain having a lower hydrogen diffusion coefficient than that of Ni.3. The chip electronic device according to claim 2 , wherein the conductive protective layer includes Pd as the first metal grains claim 2 , and one or both of Cu and Au as the second metal grains.4. The chip electronic device according to claim 3 , wherein the conductive protective layer ...

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Номер записи: 48
23-05-2013 дата публикации

COATED STEEL SHEET, METHOD FOR PRODUCING THE SAME, AND RESIN-COATED STEEL SHEET OBTAINED USING THE SAME

Номер: US20130130055A1
Автор: Inose Masao, Iwasa Hiroki, Miyamoto Yuka, Nakamura Norihiko, Noro Hisato, Suzuki Takeshi, Tobiyama Yoichi
Принадлежит: JFE STEEL CORPORATION

A coated steel sheet includes a corrosion-resistant coating composed of at least one layer selected from the group consisting of a Ni layer, a Sn layer, an Fe—Ni alloy layer, an Fe—Sn alloy layer, and an Fe—Ni—Sn alloy layer disposed on at least one surface of a steel sheet, and an adhesive coating disposed on the corrosion-resistant coating, the adhesive coating containing Zr and further containing at least one metal element selected from the group consisting of Co, Fe, Ni, V, Cu, Mn, and Zn, in total, at a ratio by mass of 0.01 to 10 with respect to Zr. The coated steel sheet has excellent humid resin adhesion and corrosion resistance, in which streaky surface defects do not occur. 1. A coated steel sheet comprising:a corrosion-resistant coating composed of at least one layer selected from the group consisting of a Ni layer, a Sn layer, an Fe—Ni alloy layer, an Fe—Sn alloy layer, and an Fe—Ni—Sn alloy layer disposed on at least one surface of a steel sheet; andan adhesive coating disposed on the corrosion-resistant coating, the adhesive coating containing Zr and further containing at least one metal element selected from the group consisting of Co, Fe, Ni, V, Cu, Mn, and Zn, in total, at a ratio by mass of 0.01 to 10 with respect to Zr.2. The coated steel sheet according to wherein the adhesive coating further contains P derived from a phosphoric acid and/or C derived from a phenolic resin claim 1 , in total claim 1 , at a ratio by mass of 0.01 to 10 with respect to Zr.3. The coated steel sheet according to claim 1 , wherein the Zr coating weight of the adhesive coating is 3 to 200 mg/mper one surface of the steel sheet.4. A method for producing a coated steel sheet comprising:depositing a corrosion-resistant coating composed of at least one layer selected from the group consisting of a Ni layer, a Sn layer, an Fe—Ni alloy layer, an Fe—Sn alloy layer, and an Fe—Ni—Sn alloy layer on at least one surface of a steel sheet; and{'sup': '2', 'disposing an adhesive ...

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Номер записи: 49
23-05-2013 дата публикации

Material and Process for Electrochemical Deposition of Nanolaminated Brass Alloys

Номер: US20130130057A1
Автор: CALDWELL Richard, UNGER Jesse
Принадлежит: Modumetal LLC

Described herein are methods of preparing nanolaminated brass coatings and components having desirable and useful properties. Also described are nanolaminated brass components and plastic and polymeric substrates coated with nanolaminated brass coatings having desirable and useful properties. 1. A method for preparing an article comprising a nanolaminated brass coating , the process comprising:(a) providing a mandrel or a conductive plastic or polymeric substrate;(b) contacting at least a portion of the mandrel or at least a portion of the conductive plastic or polymeric substrate with an electrolyte containing metal ions of zinc and copper, and optionally containing additional metal ions, wherein said electrolyte is in contact with an anode; and(c) applying an electric current across the mandrel or the plastic or polymeric substrate and the anode and varying in time one or more of: the amplitude of the electric current, frequency of the electric current, the average electric current, the offset of an alternating current, the ratio of positive current and negative current, and combinations thereof, electrolyte temperature, electrolyte additive concentration, or electrolyte agitation, in order to produce the nanolaminated brass coating having a desired thickness and periodic layers of electrodeposited species and/or periodic layers of electrodeposited species microstructures;wherein said periodic layers each have thicknesses from about 2 nm to about 2,000 nm.24.-. (canceled)5. The method of claim 1 , wherein said article comprising a nanolaminated brass coating is prepared on a conductive plastic or polymeric substrate;wherein said article has an ultimate tensile strength, flexural modulus, modulus of elasticity, and/or stiffness ratio that is greater than ultimate tensile strength, flexural modulus, modulus of elasticity, and/or stiffness ratio of said conductive plastic or polymeric substrate upon which has been electrodeposited a homogenous brass coating having a ...

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Номер записи: 50
06-06-2013 дата публикации

ELECTROLYTE AND PROCESS FOR THE DEPOSITION OF COPPER-TIN ALLOY LAYERS

Номер: US20130140185A1
Автор: Berger Sascha, Bronder Klaus, Manz Uwe, Oberst Frank, Tomazzoni Mario, Weyhmueller Bernd
Принадлежит: UMICORE GALVANOTECHNIK GMBH

The present invention relates to an electrolyte and a process for depositing bronze alloys on consumer goods and industrial articles. The electrolyte of the invention comprises, in addition to the metals to be deposited and additives such as wetting agents, complexing agents and brighteners, in particular sulfur compounds which have a positive effect in the corresponding process for the deposition of the bronzes. 1. A cyanide-free electrolyte for the deposition of copper-tin bronzes on consumer goods and industrial articles , which contains the metals to be deposited in the form of water-soluble salts , whereinthe electrolyte comprises the following further constituents:a) one or more alkylsulfonic acids;b) an ionic wetting agent in the form of a salt of a sulfonated or sulfated aromatic alkyl aryl ether compound;c) a complexing agent; andd) a compound selected from the group consisting of dialkyl thioether derivatives.2. The electrolyte as claimed in claim 1 , wherein it comprises copper and tin or copper claim 1 , tin and zinc as metals to be deposited.3. The electrolyte as claimed in claim 1 , wherein the metals to be deposited are present in ionically dissolved form claim 1 , with the ion concentration of copper being in the range from 0.2 to 10 g/l of electrolyte claim 1 , the ion concentration of tin being in the range from 1.0 to 20 g/l of electrolyte and claim 1 , if present claim 1 , the ion concentration of zinc being in the range from 1.0 to 20 g/l of electrolyte.4. The electrolyte as claimed in claim 1 , wherein alkylsulfonic acids selected from the group consisting of methanesulfonic acid claim 1 , ethanesulfonic acid claim 1 , n-propanesulfonic acid are used.5. The electrolyte as claimed in claim 1 , wherein the alkanesulfonates of the metals to be deposited are used as water-soluble salts.6. The electrolyte as claimed in claim 1 , wherein an alkyl aryl ether compound selected from the group consisting of β-naphthol ethoxylate claim 1 , nonylphenol ...

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Номер записи: 51
13-06-2013 дата публикации

Electroplating methods for fabricating integrated circuit devices and devices fabricated thereby

Номер: US20130147005A1
Автор: Hei Seung Kim, Insun Park, Jongmin Baek, Jongwon Hong
Принадлежит: SAMSUNG ELECTRONICS CO LTD

Provided are methods of fabricating a semiconductor device and semiconductor devices fabricated thereby. In the methods, dummy recess regions may be formed between cell recess regions and a peripheral circuit region. Due to the presence of the dummy recess regions, it may be possible to reduce a concentration gradient of a suppressor contained in a plating solution near the dummy pattern region, to make the concentration of the suppressor more uniform in the cell pattern region, and to supply an electric current more effectively to the cell pattern region. As a result, a plating layer can be more uniformly formed in the cell pattern region, without void formation therein.

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Номер записи: 52
20-06-2013 дата публикации

ELECTRODEPOSITION BATHS, SYSTEMS AND METHODS

Номер: US20130153430A1
Автор: Cahalen John, Dadvand Nazila, Lund Alan C., Montville Daniel J.
Принадлежит: Xtalic Corporation

Electrodeposition baths, systems and methods are provided. In some embodiments, the baths, systems and methods are used to deposit metal alloy coatings. 120-. (canceled)21. An electrodeposition method comprising:removing a sample from an electrodeposition bath comprising a tungsten and/or molybdenum ionic species, an ionic species of a second metal, and a brightening agent comprising a betaine compound, the betaine compound comprises a positively charged cationic functional group and a negatively charged anionic functional group;analyzing the sample; andelectrodepositing a coating on an article in the electroplating bath, wherein the coating comprises tungsten and/or molybdenum, and the second metal.22. The method of claim 21 , wherein the second metal is nickel.23. The method of claim 21 , wherein the anionic functional group comprises a sulfate group.24. The method of claim 21 , wherein the anionic functional group comprises a sulfonic group.25. The method of claim 21 , wherein the anionic functional group comprises a carboxylic group.26. The method of claim 21 , wherein the cationic functional group comprises an ammonium group.27. The method of claim 21 , wherein the cationic functional group comprises a phosphonium group.28. The method of claim 21 , wherein the cationic functional group comprises a pyridinium group.29. The method of claim 21 , wherein analyzing the sample comprises determining the concentration of the brightening agent.30. The method of claim 21 ,wherein the bath comprises a wetting agent.31. The method of claim 30 , wherein the analyzing the sample comprises determining the concentration of the wetting agent.32. The method of claim 31 , wherein the wetting agent is sulfopropylated polyalkoxy napthol compound.33. The method of claim 21 , wherein the coating comprises a tungsten alloy.34. The method of claim 33 , wherein the coating comprises a nickel-tungsten alloy.35. The method of claim 21 , wherein the coating is electrodeposited using DC ...

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Номер записи: 53
20-06-2013 дата публикации

Amorphous Nickel Phosphorus Alloys for Oil and Gas

Номер: US20130153432A1
Автор: Jones Robert
Принадлежит:

There is disclosed a system and method for applying an amorphous NiP alloy coating on pipes and rods, particularly for use in the oil and gas industries to inhibit corrosion, In an embodiment, the method comprises applying an amorphous nickel phosphorus or NiP alloy coating to pipes and rods for use in oil and gas industries, comprising; preparing a Watt's type nickel phosphorus (NiP) plating bath solution utilizing a Watt's type nickel electrolyte containing hypophosphorous acid; maintaining the plating bath solution temperature at between 120° F. and 170° F. adjusted to regulate phosphorus content over 11%; regulating a pH level of the plating bath solution between 1.0 and 3.0 utilizing sulphuric acid; and controlling the cathode current density in the range of 10-100 amps/sq/ft. Significant cost savings may be realized by using an electroplated nickel-phosphorus alloy over regular carbon steel alloy components at sufficient thickness to be pore free replacing the use of more expensive components made of stainless steels or nickel base alloys. 1. A method of applying an amorphous nickel phosphorus (NiP) alloy coating to oil and gas equipment used in downhole applications , comprising:preparing a Watt's type NiP plating bath solution utilizing a Watt's type electrolyte containing phosphorous acid;maintaining the plating bath solution temperature at between about 120° F. and 170° F. adjusted to regulate phosphorus content over 11%;regulating a pH level of the plating bath solution at between about 1.0 and 3.0 utilizing sulphuric acid; andcontrolling the cathode current density in the range of about 10-100 amps/sq/ft.2. The method of claim 1 , wherein the plating bath solution temperature is between about 150° F. and 170° F.3. The method of claim 2 , wherein the plating bath solution controls the pH level of the plating bath solution using nickel carbonate.4. The method of any one of claims 3 , wherein the cathode current density in the range of about 50-100 amps/sq. ...

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Номер записи: 54
20-06-2013 дата публикации

Methods and apparatus for three-dimensional microfabricated arrays

Номер: US20130157498A1
Автор: Boyden Edward, Fonstad Clifton, Scholvin Jorg, Zorzos Anthony
Принадлежит: Massachusetts Institute of Technology

In exemplary implementations of this invention, electrical connections are fabricated between two orthogonal surfaces by electroplating. The two surfaces are separated (except for the electrical connections) by a gap of not more than 100 micrometers. Multiple electrical connections may be fabricated across the gap. In preparatory steps, conductive pads on the two surfaces may be separately electroplated to build up “bumps” that make it easier to bridge the remainder of the gap in a final plating step. Alternately, electroless deposition may be used instead of electroplating. In exemplary implementations, a 3D probe array may be assembled by inserting array structures into an orthogonal base plate. The array structures may be aligned and held in place, relative to the base plate, by mechanical means, including side hooks, stabilizers, bottom hooks, alignment parts and a back plate. 1. A method comprising fabrication of at least one electrical connection between a first surface and a second surface by electrical deposition , wherein:the first and second surfaces are separated, except for the at least one electrical connection, by a gap of not more than 100 micrometers; andthe first and second surfaces are off angle with respect to each other.2. The method of claim 1 , wherein the electrical deposition comprises electroplating.3. The method of claim 1 , wherein the electrical deposition comprises electroless deposition.4. The method of claim 1 , wherein the at least one electrical connection comprises multiple electrical connections claim 1 , and the pitch between at least some of the multiple electrical connections is less than 50 micrometers.5. The method of claim 4 , wherein the pitch between at least some of the multiple electrical connections is less than 40 micrometers.6. The method of claim 5 , wherein the pitch between at least some of the multiple electrical connections is less than 30 micrometers.7. The method of claim 1 , wherein the method further comprises ...

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Номер записи: 55
04-07-2013 дата публикации

COPPER-ELECTROPLATING COMPOSITION AND PROCESS FOR FILLING A CAVITY IN A SEMICONDUCTOR SUBSTRATE USING THIS COMPOSITION

Номер: US20130168255A1
Автор: Frederich Nadia, González José, Raynal Frederic
Принадлежит: ALCHIMER

The subject-matter of the present invention is a composition especially intended for filling, by the electroplating of copper, a cavity in a semiconductor substrate such as a “through-via” structure for the production of interconnects in three-dimensional integrated circuits. 1. composition especially intended for filling , by the electroplating of copper , a cavity in a semiconductor substrate such as a “through-via” structure for the production of interconnects in three-dimensional integrated circuits , characterized in that it comprises in solution in a solvent:copper ions in a concentration lying between 45 and 1500 mM;a complexing agent for the copper consisting of at least one compound chosen from aliphatic polyamines having 2 to 4 amino groups, preferably ethylenediamine, in a concentration lying between 45 and 3000 mM;the molar ratio between the copper and said complexing agent lying between 0.1 and 5;thiodiglycolic acid in a concentration lying between 1 and 500 mg/l; andoptionally a buffer system, in particular ammonium sulfate, in a concentration lying between 0.1 and 3M.2. The composition as claimed in claim 1 , wherein the copper ion concentration lies between 45 and 500 mM claim 1 , preferably between 100 and 300 mM.3. The composition as claimed in claim 1 , wherein the aforementioned copper ions are cupric ions preferably derived from copper sulfate.4. The composition as claimed in claim 1 , wherein the complexing agent for the copper consists of at least one compound chosen from ethylenediamine claim 1 , diethylenetriamine claim 1 , triethylenetetramine and dipropylenetriamine.5. The composition as claimed in claim 1 , wherein the aforementioned complexing agent is ethylenediamine.6. The composition as claimed in claim 1 , wherein the complexing agent concentration lies between 45 and 1500 mM claim 1 , preferably between 300 and 900 mM.7. The composition as claimed in claim 4 , wherein the molar ratio between the copper and the complexing agent lies ...

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Номер записи: 56
04-07-2013 дата публикации

ALUMINUM ELECTROPLATING SOLUTION

Номер: US20130168258A1
Автор: Akahoshi Haruo, NAKANO Hiroshi, NEGISHI Yoshinori
Принадлежит: Hitachi, Ltd.

The purpose of the present invention is to provide an aluminum electroplating solution that allows aluminum electroplating to be conducted efficiently and in a short period of time, can increase the amount of electricity in the current of electroplating, and has high solubility in a nonaqueous solvent. This aluminum electroplating solution is characterized by comprising an aluminum metal salt, an ionic liquid obtained by an organic compound forming an ion pair with the aluminum metal salt, and an organic solvent having a dielectric constant of 8 or less. It is preferable for the volume percentage of the organic solvent in relation to the total volume of the ionic liquid and the organic solvent to be at least 30%, and for at least one of the following to be included as the organic solvent having a dielectric constant of 8 or less: hexane, toluene, diethyl ether, ethylacetate, cyclohexane, xylene, benzene, naphthalene, heptane, cyclopentyl methyl ether, and dioxane. 1. An aluminum electroplating solution comprising:an aluminum metal salt,an ionic liquid obtained by an organic compound forming an ion pair with the aluminum metal salt; andan organic solvent having a dielectric constant of 8 or less,wherein a volume fraction of the organic solvent in relation to a total volume of the ionic liquid and the organic solvent is 75% or more.2. (canceled)3. The aluminum electroplating solution according to claim 1 , wherein the aluminum metal salt comprises at least aluminum halide.4. The aluminum electroplating solution according to claim 1 , wherein the organic solvent is at least one kind selected from the group consisting of hexane claim 1 , toluene claim 1 , diethyl ether claim 1 , ethylacetate claim 1 , cyclohexane claim 1 , xylene claim 1 , benzene claim 1 , naphthalene claim 1 , heptane claim 1 , cyclopentyl methyl ether claim 1 , and dioxane.5. The aluminum electroplating solution according to claim 1 , wherein the organic compound forming an ion pair with the aluminum ...

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Номер записи: 57
04-07-2013 дата публикации

ELECTROLYTIC BATH FOR ELECTRODEPOSITION AND METHOD FOR PRODUCING SAME

Номер: US20130168259A1
Автор: Kurrle Matthias
Принадлежит: IPT International Plating Technologies GmbH

An electrolytic bath for electrodeposition includes nickel salt, phosphoric acid, phosphonic acid, and boric acid in solution. A method for producing an electrolytic bath includes the steps of mixing a nickel salt, phosphoric acid, phosphonic acid, and boric acid, and adding nickel carbonate in order to increase the pH value. 1. An electrolytic bath for electrodeposition , comprising in solution:a) nickel saltb) phosphoric acidc) phosphonic acidd) boric acid.2. The electrolytic bath of claim 1 , comprising in solution phosphoric acid with a concentration in the range of 60-90 g/l.3. The electrolytic bath of claim 2 , further comprising in solution phosphonic acid with a concentration in the range of 20-40 g/l.4. The electrolytic bath of claim 3 , further comprising in solution phosphonic acid with a concentration in the range of 20-40 g/l.5. The electrolytic bath of claim 1 , further comprising in solution boric acid with a concentration in the range of 30-40 g/l.6. The electrolytic bath of claim 1 , further comprising in solution nickel(II) with a concentration in the range of 90-130 g/l.7. The electrolytic bath of any of claim 1 , further comprising in solution 0-4 g/l saccharine.8. The electrolytic bath of claim 1 , having a pH in the range from 1.6 to 2.3.9. The electrolytic bath of claim 1 , wherein the nickel salt comprises nickel sulfate and wherein more than 50% of the nickel(II) in the bath comes from the nickel sulfate.10. The electrolytic bath of claim 1 , further comprising in solution sulfate with a concentration in the range of 147-213 g/l.11. A method for producing an electrolytic bath claim 1 , the method comprising the steps of:A) mixing a nickel salt, phosphoric acid, phosphonic acid, and boric acid; andB) adding nickel carbonate is added to raise the pH.12. The method of claim 11 , wherein the pH of the bath is measured and wherein nickel carbonate is added to raise the pH until a predetermined pH is reached claim 11 , the predetermined pH being ...

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Номер записи: 58
11-07-2013 дата публикации

METHOD FOR ALUMINIZING A SURFACE BY MEANS OF THE ADVANCE DEPOSITION OF A PLATINUM AND NICKEL LAYER

Номер: US20130175178A1
Автор: Lagrange Frederic, Manesse Denis
Принадлежит: SNECMA

A method for depositing an aluminizing coating onto a substrate. The method includes: (a) depositing a layer, containing platinum and at least 35% of nickel, onto a surface of the substrate; and (b) depositing an aluminum coating onto the layer. 16-. (canceled)7. A method for depositing an aluminizing coating on a substrate , comprising:(a) depositing a layer containing platinum and at least 35% of nickel on a surface of the substrate;(b) depositing a aluminum coating on the layer.8. The method according to claim 7 , wherein claim 7 , in (a) claim 7 , to deposit the layer claim 7 , a first layer containing platinum is first deposited on the surface claim 7 , then a second layer containing nickel is deposited on the first layer.9. The method according to claim 8 , wherein claim 8 , in (a) claim 8 , the second layer of nickel is deposited by electrolysis.10. The method according to claim 7 , wherein the substrate is a superalloy.11. The method according to claim 10 , wherein the superalloy is a nickel-based superalloy.12. The method according to claim 7 , wherein before the deposition of the layer in (a) claim 7 , the surface is prepared. The present invention relates to a method for depositing an aluminizing coating on a substrate.Aluminum-based coatings, called “aluminizing coatings,” are used to protect the surface of parts operating at high temperatures and in oxidizing environments. Such a coating may also serve as a fastening layer for attaching to another protective coating, said protective coating being more able to adhere to such an aluminizing coating than to the surface of the part itself.For example, such parts are found in aeronautic turbojet engines, such as airplane engines. These parts are in particular turbine vanes or nozzles.These parts are for example made from nickel-based superalloys.To perform an aluminizing coating on such a superalloy, a layer of platinum is first deposited on the surface of said superalloy that is the substrate . This step is ...

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Номер записи: 59
11-07-2013 дата публикации

Polyamine brightening agent

Номер: US20130175179A1
Автор: William E. Eckles
Принадлежит: Coventya Inc

A zinc electroplating bath includes zinc ions and a brightening agent. The brightening agent is a polyamine or a mixture of polyamines that include a quaternary ammonium group.

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Номер записи: 60
25-07-2013 дата публикации

Flux method for tin and tin alloys

Номер: US20130186766A1
Автор: Peter R. Levey
Принадлежит: Rohm and Haas Electronic Materials LLC

A flux composition which includes one or more organic compounds including one or more sulfonic acid groups, salts or anhydrides thereof is applied to tin or tin alloy deposits. The flux composition is then homogenized on the tin or tin alloy to inhibit tin or tin alloy oxidation and improve brightness of the tin or tin alloy.

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Номер записи: 61
25-07-2013 дата публикации

METHOD OF MANUFACTURING COPPER FOIL FOR PRINTED WIRING BOARD, AND COPPER FOIL PRINTED WIRING BOARD

Номер: US20130189538A1
Автор: Moriyama Terumasa
Принадлежит: JX NIPPON MINING & METALS CORPORATION

A method of manufacturing a copper foil for a printed wiring board, characterized in that a roughened layer of roughening copper grains is formed on at least one surface of the copper foil by using an electrolytic bath of sulfuric acid and copper sulfate, and the electrolytic bath contains tungsten ions and/or arsenic ions and further contains an alkyl sulfate-based anionic surfactant. The object of the present invention is to provide a method of manufacturing a copper foil for a printed wiring board, wherein in particular a roughened layer on the copper foil can be improved to enhance the adhesive strength between the copper foil and a resin substrate without deteriorating other properties of the copper foil. 1. A method of manufacturing a copper foil for a printed wiring board , characterized in that a roughened layer of roughening copper grains is formed on at least one surface of the copper foil by using an electrolytic bath of sulfuric acid and copper sulfate , and the electrolytic bath contains tungsten ions and/or arsenic ions and an alkyl sulfate-based anionic surfactant.2. The method of manufacturing a copper foil for a printed wiring board according to claim 1 , wherein the surfactant is contained in an amount of 0.1 to 100 mg/l.3. A copper foil for a printed wiring board comprising claim 1 , a copper foil claim 1 , a roughened layer of roughening copper grains formed on at least one surface of the copper foil in an electrolytic bath of sulfuric acid and copper sulfate containing an alkyl sulfate-based anionic surfactant in an amount of 0.1 to 100 mg/l and at least one of tungsten ions and arsenic ions claim 1 , and a cover-plated layer formed on the roughened layer by cover plating the roughened layer in an electrolytic bath of sulfuric acid and copper sulfate.4. The copper foil for a printed wiring board according to claim 3 , wherein a heat resistant and rust proof layer containing at least one element selected from the group consisting of zinc claim 3 ...

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Номер записи: 62
01-08-2013 дата публикации

High temperature resistant silver coated substrates

Номер: US20130196174A1
Автор: Margit Clauss, Michael P. Toben, Wan Zhang-Beglinger
Принадлежит: Rohm and Haas Electronic Materials LLC

A thin film of tin is plated directly on nickel coating a metal substrate followed by plating silver directly on the thin film of tin. The silver has good adhesion to the substrate even at high temperatures.

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Номер записи: 63
01-08-2013 дата публикации

Apparatuses and Methods for Gas Mixed Liquid Polishing, Etching, and Cleaning

Номер: US20130196506A1
Автор: Johann Kosub
Принадлежит: INFINEON TECHNOLOGIES AG

In accordance with an embodiment of the present invention, a method of polishing a device includes providing a layer having a non-uniform top surface. The non-uniform top surface includes a plurality of protrusions. The method further includes removing the plurality of protrusions by exposing the layer to a fluid that has gas bubbles and a liquid.

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Номер записи: 64
08-08-2013 дата публикации

COPPER FILLING OF THROUGH SILICON VIAS

Номер: US20130199935A1
Автор: Abys Joseph A., Hurtubise Richard, JR. Vincent, Lin Xuan, Paneccasio, Richardson Thomas B., Shao Wenbo, Wang Cai, Wang Chen, Zhang Yun
Принадлежит: ENTHONE INC.

A method for metallizing a through silicon via feature in a semiconductor integrated circuit device substrate. The method comprises immersing the semiconductor integrated circuit device substrate into an electrolytic copper deposition composition, wherein the through silicon via feature has an entry dimension between 1 micrometers and 100 micrometers, a depth dimension between 20 micrometers and 750 micrometers, and an aspect ratio greater than about 2:1; and supplying electrical current to the electrolytic deposition composition to deposit copper metal onto the bottom and sidewall for bottom-up filling to thereby yield a copper filled via feature. The deposition composition comprises (a) a source of copper ions; (b) an acid selected from among an inorganic acid, organic sulfonic acid, and mixtures thereof; (c) an organic disulfide compound; (d) a compound selected from the group consisting of a reaction product of benzyl chloride and hydroxyethyl polyethyleneimine, a quaternized dipyridyl compound, and a combination thereof; and (d) chloride ions. 1. A method for metallizing a through silicon via feature in a semiconductor integrated circuit device substrate , wherein the semiconductor integrated circuit device substrate comprises a front surface , a back surface , and the via feature and wherein the via feature comprises an opening in the front surface of the substrate , a sidewall extending from the front surface of the substrate , and a bottom , the method comprising: (a) a source of copper ions;', '(b) an acid selected from among an inorganic acid, organic sulfonic acid, and mixtures thereof;', '(c) an organic disulfide compound;', '(d) a compound selected from the group consisting of a reaction product of benzyl chloride and hydroxyethyl polyethyleneimine, a quaternized dipyridyl compound, and a combination thereof; and', '(d) chloride ions; and, 'immersing the semiconductor integrated circuit device substrate into an electrolytic copper deposition composition ...

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Номер записи: 65
08-08-2013 дата публикации

Methods and Electrolytes for Electrodeposition of Smooth Films

Номер: US20130199936A1
Автор: Fei Ding, Gordon L. Graff, Jiguang Zhang, WU Xu, Xilin Chen, Yuyan SHAO
Принадлежит: Battelle Memorial Institute Inc

Electrodeposition involving an electrolyte having a surface-smoothing additive can result in self-healing, instead of self-amplification, of initial protuberant tips that give rise to roughness and/or dendrite formation on the substrate and/or film surface. For electrodeposition of a first conductive material (C1) on a substrate from one or more reactants in an electrolyte solution, the electrolyte solution is characterized by a surface-smoothing additive containing cations of a second conductive material (C2), wherein cations of C2 have an effective electrochemical reduction potential in the solution lower than that of the reactants.

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Номер записи: 66
08-08-2013 дата публикации

Method for Depositing a Nickel-Metal Layer

Номер: US20130202910A1
Автор: Koppe Stefan
Принадлежит:

A method for depositing nickel-metal layers for colouring surfaces, and a bath for depositing such a layer. This is made possible by depositing a nickel-metal layer from a bath for the electroless deposition of nickel which contains at least one further metal compound, a voltage being additionally applied enable the metal of the metal compound to be incorporated while forming a nickel-metal layer. 1. A method for depositing a nickel-metal layer , comprising the following steps:a) providing a nickel bath for electroless deposition of a nickel layer, wherein the bath additionally contains a compound of another metal; b1) deposition of nickel from the nickel bath and', 'b2) voltage-supported deposition of the other metal compound from the bath provided., 'b) depositing a nickel-metal layer by simultaneous'}2. The method as claimed in claim 1 , 'the electroless deposited metal layer is a nickel/phosphorus or a nickel/boron layer, which further contains at least one other metal.', 'characterized in that'}3. The method as claimed in claim 1 , 'the voltage-supported deposition is carried out at a temperature above 50° C.', 'characterized in that'}4. The method as claimed in claim 1 , 'the other metal compound is a zinc compound.', 'characterized in that'}5. The method as claimed in claim 1 , 'the other metal compound is present in the bath in a range between 0.05 mol/l and 0.5 mol/l relative to the metal.', 'characterized in that'}6. The method as claimed in claim 1 , 'a graphite electrode is used for the voltage-supported deposition.', 'characterized in that'}7. The method as claimed in claim 1 , 'the bath additionally contains at least one conducting salt.', 'characterized in that'}8. The method as claimed in claim 1 , {'sup': '2', 'the voltage-supported deposition is carried out with current densities between 0.01 and 5 A/dm.'}, 'characterized in that'}9. The method as claimed in claim 1 , 'electroless deposition of a nickel layer or nickel-metal layer is carried out ...

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Номер записи: 67
15-08-2013 дата публикации

Plating bath and method

Номер: US20130206602A1
Автор: Elissei Iagodkine, Inho Lee, Yi Qin, Yu Luo
Принадлежит: Rohm and Haas Electronic Materials LLC

Tin-silver alloy electroplating baths having certain amine-oxide surfactants and methods of electrodepositing a tin-silver-containing layer using these baths are disclosed. Such electroplating baths are useful to provide tin-silver solder deposits having reduced void formation and improved within-die uniformity.

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Номер записи: 68
15-08-2013 дата публикации

ELECTROLYTIC FREEZING OF ZINC SURFACES

Номер: US20130206603A1
Автор: ARNOLD Andreas, ROTH Marcel, STODT Jürgen, WOLPERS Michael
Принадлежит: Henkel AG & Co. KGaa

The present invention relates to a method for the metallizing pretreatment of galvanized and/or alloy-galvanized steel surfaces or joined metallic components having at least some zinc surfaces, wherein a thin surface layer of iron is deposited on the zinc surfaces from an aqueous electrolyte containing water-soluble compounds that are a source of iron cations. The method is performed at least partially or continuously under application of an electrolytic voltage, the galvanized and/or alloy-galvanized steel surfaces being connected as cathode. The aqueous electrolyte additionally contains an accelerator selected from oxo acids of the elements phosphorus, nitrogen and/or sulfur, the elements phosphorus, nitrogen and/or sulfur being present in moderate oxidation states. 211.-. (canceled) The present invention relates to a method for the metallizing pretreatment of galvanized and/or alloy-galvanized steel surfaces or joined metallic components having at least some zinc surfaces, wherein a thin surface layer of iron is deposited on the zinc surfaces from an aqueous electrolyte containing water-soluble compounds that are a source of iron cations. The method is performed at least partially or continuously under application of an electrolytic voltage, the galvanized and/or alloy-galvanized steel surfaces being connected as cathode. The aqueous electrolyte additionally contains an accelerator selected from oxo acids of the elements phosphorus, nitrogen and/or sulfur, the elements phosphorus, nitrogen and/or sulfur being present in moderate oxidation states.Methods for metallizing galvanized and/or alloy-galvanized steel surfaces are known from the prior art. Thus WO 2008/135478 describes a pretreatment method for the currentless deposition of metallic coatings, in particular of iron and tin, on galvanized and/or alloy-galvanized steel surfaces. The pretreatment delivers moderately metallized zinc surfaces, which is advantageous for the application of subsequent anti- ...

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Номер записи: 69
22-08-2013 дата публикации

STEEL SHEET FOR CONTAINERS AND MANUFACTURING METHOD FOR SAME

Номер: US20130216858A1
Автор: Miyamoto Yuka, Nakamura Norihiko, Suzuki Takeshi, Tobiyama Yoichi
Принадлежит: JFE STEEL CORPORATION

A steel sheet for containers that has excellent film adhesion qualities, and has a Zr compound film formed thereupon by immersion in or electrolytic treatment with a solution containing Zr ions, F ions, and hydroxylic acid, the Zr compound film being applied in an amount such that the metal Zr content is 0.1-100 mg/m and the F content is no more than 0.1 mg/m. 17-. (canceled)8. A steel sheet for containers having a Zr compound film which is formed on a steel sheet by immersing or electrolytically treating the steel sheet in a solution containing Zr ions , F ions and a hydroxy acid ,{'sup': 2', '2', '2, 'wherein the adhesion amount of the Zr compound film is within a range of 0.1 mg/mto 100 mg/mas an amount of metal Zr and is within a range of 0.1 mg/mor less as an amount of F.'}9. The steel sheet for containers according to claim 8 ,wherein the solution further contains phosphate ions, and{'sup': 2', '2, 'the adhesion amount of the Zr compound film is 0.1 mg/mto 50 mg/mas an amount of P.'}10. The steel sheet for containers according to claim 8 ,{'sup': 2', '2, 'wherein the adhesion amount of the Zr compound film is 0.05 mg/mto 50 mg/mas an amount of C of a hydroxy acid precipitate.'}11. The steel sheet for containers according to claim 8 , wherein the steel sheet is a surface-treated steel sheet having a surface treatment layer which contains 5 mg/mto 1 claim 8 ,000 mg/mof Ni or 100 mg/mto 15 claim 8 ,000 mg/mof Sn claim 8 , on at least one surface thereof.12. The steel sheet for containers according to claim 8 ,{'sup': 2', '2', '2', '2, 'wherein the steel sheet is a surface-treated steel sheet haying an underlying Ni layer which is a Ni plating layer or an Fe—Ni alloy plating layer and contains 5 mg/mto 150 mg/mof Ni, and a Sn island plating layer which is a remainder of a Sn plating layer and is not alloyed, the Sn island plating layer being formed by plating 300 mg/mto 3,000 mg/mof Sn on the underlying Ni layer, and alloying a part or the entirety of the ...

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Номер записи: 70
29-08-2013 дата публикации

ELECTRODEPOSITION OF CHROMIUM FROM TRIVALENT CHROMIUM USING MODULATED ELECTRIC FIELDS

Номер: US20130220819A1
Автор: Hall Timothy, Kagajwala Burhanuddin
Принадлежит: FARADAY TECHNOLOGY, INC.

A layer of chromium metal is electroplated from trivalent chromium onto an electrically conducting substrate by immersing the substrate and a counter electrode in a electroplating bath and passing a modulated electric current between the electrodes. In one embodiment, the current contains pulses that are cathodic with respect to said substrate and in another embodiment the current contains pulses that are cathodic and pulses that are anodic with respect to said substrate. The cathodic pulses have a duty cycle greater than about 80%. 2. The method of wherein an interval of no electric current flow is interposed between said cathodic pulses.3. The method of wherein an interval of no electric current flow is interposed between said anodic pulses and cathodic pulses.4. The method of wherein an interval of no electric current flow is interposed between said cathodic pulses and succeeding anodic pulses and between said anodic pulses and succeeding cathodic pulses.5. The method of wherein said cathodic pulses and said anodic pulses succeed each other without intervening intervals of no electric current flow.6. The method of wherein said cathodic pulses and said anodic pulses form a pulse train having a frequency less than about 500 Hertz.7. The method of wherein said cathodic pulses form a pulse train having a frequency between about 100 Hertz and about 6000 Hertz.8. The method of wherein said cathodic pulses have a duty cycle of at least about 80%.9. The method of wherein said anodic pulses have a duty cycle of less than about 10%.10. The method of wherein said electroplating bath may additionally include a metal selected from the group consisting of copper claim 1 , silver claim 1 , gold claim 1 , zinc claim 1 , nickel claim 1 , bronze claim 1 , brass claim 1 , and alloys thereof.11. The method of wherein a layer of metal of substantially uniform thickness is deposited on said surface.12. The method of wherein said plating bath includes chromium sulfate claim 1 , ...

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Номер записи: 71
29-08-2013 дата публикации

METHOD OF PREVENTING SILVER TARNISHING

Номер: US20130224515A1
Автор: Foyet Adolphe, GUEBEY Jonas, TOBEN Michael P., ZHANG-BEGLINGER Wan
Принадлежит:

A thin indium metal layer is electroplated onto silver to prevent silver tarnishing. The indium and silver composite has high electrical conductivity. 1. A method comprising:a) providing a substrate comprising a silver layer; andb) electroplating an indium layer adjacent the silver layer to form an indium and silver composite on the substrate, the composite has a contact resistance of 5 mOhms or less.2. The method of claim 1 , wherein heat is not applied to the indium and silver composite.3. The method of claim 1 , wherein the contact resistance is 1-5 mOhms.4. The method of claim 1 , wherein the indium metal layer has a thickness of 0.5-50 nm.5. The method of claim 1 , wherein the indium is electroplated from an indium electroplating bath having an indium ion concentration of 0.5-10 g/L.6. The method of claim 5 , wherein the substrate is chosen from jewelry and an electronic component.7. An article comprising a composite layer of a layer of indium 0.5-50 nm thick adjacent a layer of silver claim 5 , the contact resistance of the composite layer is 5 mOhms or less. This application claims the benefit of priority under 35 U.S.C. §119(e) to U.S. Provisional Application No. 61/604,965, filed Feb. 29, 2013, the entire contents of which application are incorporated herein by reference.The present invention is directed to a method of preventing silver tarnishing by electroplating indium metal on silver. More specifically, the present invention is directed to a method of preventing silver tarnishing by electroplating indium metal on the silver and to provide a high conductivity indium and silver composite layer.Silver tarnishing takes place through a variety of mechanisms. In general, this leads to a disfiguring layer on the surface of the silver that is visually unacceptable. The main product of silver tarnishing is silver sulfide caused by the presence of sulfides, such as hydrogen sulfide, present in the atmosphere. The reaction mechanisms are 8Ag+4HS4AgS+2H+4e and O+ ...

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Номер записи: 72
29-08-2013 дата публикации

METHOD FOR PRODUCING ALUMINUM FOIL

Номер: US20130224589A1
Автор: Andou Setsuo, Hoshi Hiroyuki, Okamoto Atsushi
Принадлежит: HITACHI METALS, LTD.

A method for producing an aluminum foil of the present invention is characterized in that an aluminum film is formed on a surface of a substrate by electrolysis using a plating solution containing at least (1) a dialkyl sulfone, (2) an aluminum halide, and (3) at least one nitrogen-containing compound selected from the group consisting of an ammonium halide, a hydrogen halide salt of a primary amine, a hydrogen halide salt of a secondary amine, a hydrogen halide salt of a tertiary amine, and a quaternary ammonium salt represented by the general formula: RRRRN.X (Rto Rindependently represent an alkyl group and are the same as or different from one another, and X represents a counteranion for the quaternary ammonium cation), then the film is separated from the substrate to obtain an aluminum foil, and the obtained aluminum foil is subjected to a heat treatment. 1. A method for producing an aluminum foil , characterized in thatan aluminum film is formed on a surface of a substrate by electrolysis using a plating solution containing at least (1) a dialkyl sulfone, (2) an aluminum halide, and (3) a nitrogen-containing compound,then the film is separated from the substrate to obtain an aluminum foil, andthe obtained aluminum foil is subjected to a heat treatment.2. A production method according to claim 1 , characterized in that the heat treatment is performed at 80 to 550° C.3. A production method according to claim 1 , characterized in that the dialkyl sulfone is dimethyl sulfone.4. An aluminum foil characterized by being produced by the method of .5. An aluminum foil according to claim 4 , characterized by having an aluminum content of 97.00 to 99.95 mass % claim 4 , S and Cl contents of 1.50 mass % or less each claim 4 , and a thickness of 1 to 15 μm.6. An aluminum foil according to claim 4 , characterized by having a crystal orientation such that the ratio of the X-ray diffraction intensity of a (111) plane to the X-ray diffraction intensities of other crystal planes ...

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Номер записи: 73
05-09-2013 дата публикации

COMPOSITES OF CARBON BLACK AND METAL

Номер: US20130228465A1
Автор: FRANSAER Jan, STAPPERS Linda, TOBEN Michael P., ZHANG-BEGLINGER Wan
Принадлежит:

Nano-sized particles of carbon black and various metal ions are mixed to form substantially homogenous solutions or dispersions. The nano-sized particles of carbon black and metal ions are electroplated on various types of substrates as composites of one or more metals and substantially uniformly dispersed nano-sized particles of carbon black within the metals. 1. A composition comprising one or more sources of metal ions and carbon black nano-particles.2. The composition of claim 1 , wherein the carbon black nano-particles range in size from 5 nm to 500 nm.3. The composition of claim 1 , wherein metal ions are chosen from silver claim 1 , gold claim 1 , palladium claim 1 , nickel claim 1 , copper claim 1 , tin and indium ions.4. The composition of claim 1 , wherein a concentration of the carbon black nano-particles in the composition is at least 1 g/L.5. The composition of claim 1 , further comprising one or more surfactants.6. The composition of claim 5 , wherein the surfactants are chosen from alcohol phosphate esters.7. A method comprising:a) providing a composition comprising one or more sources of metal ions and carbon black nano-particles;b) contacting a substrate with the composition; andc) electroplating a composite of one or more metals and carbon black nano-particles onto the substrate.8. The method of claim 7 , wherein the carbon black nano-particles range in size from 5 nm to 500 nm.9. The method of claim 7 , wherein metal ions are chosen from silver claim 7 , gold claim 7 , palladium claim 7 , nickel claim 7 , copper claim 7 , tin and indium ions.10. An article comprising a composite comprising one or more metals and carbon black nano-particles dispersed within the one or more metals.11. The article of claim 10 , wherein a thickness of the composite is at least 0.1 μm. This application claims the benefit of priority under 35 U.S.C. §119(e) to U.S. Provisional Application No. 61/606,170, filed Mar. 2, 2012, the entire contents of which application are ...

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Номер записи: 74
12-09-2013 дата публикации

ADHESION PROMOTION OF CYANIDE-FREE WHITE BRONZE

Номер: US20130236742A1
Автор: GUEBEY Jonas, WEITERSHAUS Katharina, ZHANG-BEGLINGER Wan
Принадлежит: Rohm and Haas Electronic Materials LLC

White bronze is electroplated from a cyanide-free tin/copper bath onto a void inhibiting layer coating a copper underlayer. The void inhibiting metal layer includes one or more void inhibiting metals. 1. A method comprising:a) depositing a metal layer comprising one or more void inhibiting metals adjacent a copper containing layer; andb) electroplating a tin/copper alloy layer from a cyanide-free tin/copper electroplating bath adjacent the metal layer comprising the one or more void inhibiting metals.2. The method of claim 1 , wherein the one or more void inhibiting metals are chosen from zinc claim 1 , zinc alloy claim 1 , bismuth claim 1 , bismuth alloy and nickel.3. The method of claim 2 , wherein the zinc alloy comprises at least 4% zinc.4. The method of claim 2 , wherein the bismuth alloy comprises at least 10% bismuth.5. The method of claim 1 , wherein the metal layer comprising the one or more void inhibiting metals is at least 0.02 μm thick.6. The method of claim 5 , wherein the metal layer has a thickness of 0.05 μm to 10 μm.7. The method of claim 1 , wherein the tin/copper layer is at least 0.01 μm to 20 μm thick.8. An article made according to the method of .9. The article of claim 8 , wherein the article is a component of an electronic device or a decorative part. This application claims the benefit of priority under 35 U.S.C. §119(e) to U.S. Provisional Application No. 61/529,088, filed Aug. 30, 2011, the entire contents of which application are incorporated herein by reference.The present invention is directed to adhesion promotion of cyanide-free white bronze on a copper or copper alloy underlayer. More specifically, the present invention is directed to adhesion promotion of cyanide-free white bronze on a copper or copper alloy underlayer where the white bronze is electroplated from a cyanide-free white bronze electroplating bath onto a metal layer containing void inhibiting metals coating the copper or copper alloy underlayer.Methods for ...

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Номер записи: 75
12-09-2013 дата публикации

Copper alloy sheet with sn coating layer for a fitting type connection terminal and a fitting type connection terminal

Номер: US20130237105A1
Автор: Koichi Taira, Masahiro Tsuru, Ryoichi Ozaki
Принадлежит: Kobe Steel Ltd

A copper alloy sheet with a Sn coating layer comprises a base material made of Cu—Ni—Si system copper alloy. Formed on the base material is a Ni coating layer having an average thickness of 0.1 to 0.8 μm. Formed on the Ni coating layer is a Cu—Sn alloy coating layer having an average thickness of 0.4 to 1.0 μm. Formed on the Cu—Sn alloy coating layer is an Sn coating layer having average thickness of 0.1 to 0.8 μm. A material surface is subject to reflow treatment and has arithmetic mean roughness Ra of 0.03 μm or more and less than 0.15 μm in both a direction parallel to the rolling direction and a direction perpendicular to the rolling direction. An exposure rate of the Cu—Sn alloy coating layer to the material surface is 10 to 50%. A fitting type connection terminal requiring low insertion force can be obtained at a low cost.

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Номер записи: 76
19-09-2013 дата публикации

Composition for Metal Surface Treatment, Metal Surface Treatment Method, and Metal Material

Номер: US20130244026A1
Автор: Inbe Toshio, Kolberg Thomas
Принадлежит:

A metal material is contacted with a treatment solution containing zirconium and/or titanium compound, and a polyamine compound having a number average molecular weight from 150 to 500,000 and containing from 0.1 mmol to 17 mmol of primary and/or secondary amino group per 1 g of solid content and at least one siloxane unit. Concentration of zirconium and/or titanium compound in the metal surface treatment composition is from 10 ppm to 10,000 ppm with respect to the metal element, and mass ratio of the zirconium and/or titanium element is from 0.1 to 100 with respect to the polyamine compound. The metal material is washed with water after contacted by the treatment solution.

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Номер записи: 77
10-10-2013 дата публикации

COMPOSITION FOR METAL ELECTROPLATING COMPRISING LEVELING AGENT

Номер: US20130264213A1
Автор: Emnet Charlotte, HOERHAMMER Harald, Marco Arnold, Mayer Dieter, Raether Roman Benedikt, Roeger-Goepfert Cornelia
Принадлежит: BASF SE

Disclosed is a composition comprising a source of metal ions, one or more suppressing agents and at least one additive comprising a linear or branched, polymeric biguanide compound comprising the structural unit of formula L1 or the corresponding salt thereof, wherein Ris independently selected from H or an organic radical having 1-20 carbon atoms; Ris an divalent organic radical having 1-20 carbon atoms, optionally comprising 20 polymeric biguanide side branches; and n is an integer of 2 or more. 2. The composition of claim 1 , wherein Ris claim 1 , independently at each occurrence claim 1 , an H atom or a substituted or unsubstituted Cto Calkyl radical.3. The composition of claim 1 , wherein Ris an H atom.4. The composition of claim 1 , wherein Ris a substituted or unsubstituted linear Cto Calkanediyl.5. The composition of claim 1 , wherein n is from 2 to 6000.6. The composition of claim 1 , wherein a number average molecular weight Mof the polymeric biguanide compound claim 1 , determined by gel permeation chromatography claim 1 , is greater than 300 g/mol.7. The composition according to claim 1 , wherein the additive is obtained by reactinga dicyanamide compound, andat least one amino compound comprising at least two amino groups which independently of each other are primary or secondary amino groups, withan inorganic or organic protic acid.8. The composition of claim 7 , wherein the at least one amino compound is an aliphatic or aromatic diamine claim 7 , triamine claim 7 , multiamine claim 7 , or a mixture thereof.9. The composition of claim 7 , wherein the at least one amino compound is a terminal diamine.10. The composition of claim 1 , wherein the metal ions comprise a copper ion.11. The composition of claim 1 , further comprising an accelerating agent.12. The composition of claim 11 , wherein the accelerating agent has a formula MOS—R—S—R—S—S—R—SOM claim 11 , wherein{'sup': 'A', 'Mis a hydrogen or an alkali metal, and'}{'sup': A1', 'A1′, 'Rand R are each ...

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Номер записи: 78
17-10-2013 дата публикации

INDIUM COMPOSITIONS

Номер: US20130270117A1
Автор: BRESE Nathaniel E., GAETHKE Thomas, SCHWAGER Felix J., SZOCS Edit, TOBEN Michael P.
Принадлежит:

Indium compositions including hydrogen suppressor compounds and methods of electrochemically depositing indium metal from the compositions onto substrates are disclosed. Articles made with the indium compositions are also disclosed. 14-. (canceled)5. A method comprising:a) providing a composition comprising one or more sources of indium ions and one or more epihalohydrin copolymers; andb) electroplating an indium metal layer on a substrate.6. The method of claim 5 , wherein the composition further comprises one or more alloying metals.7. The method of claim 5 , wherein the indium metal layer has a thickness of 0.1 μm or greater.8. The method of claim 5 , wherein the substrate is chosen from a processing die claim 5 , lid and a heat spreader.9. The method of claim 5 , wherein the substrate is chosen from a metal claim 5 , metal alloy claim 5 , ceramic and composites of metals and ceramics.10. An article comprising a die joined on a first side to a base claim 5 , a second side of the die opposite the first side comprises a thermal interface material consisting of indium metal or an indium alloy. This application is a Divisional of U.S. Non-Provisional application Ser. No. 12/002,080, filed Dec. 13, 2007, which application claims the benefit of priority under 35 U.S.C. §119(e) to U.S. Provisional Application No. 60/875,177, filed Dec. 15, 2006, the entire contents of which application are incorporated herein by reference.The present invention is directed to indium compositions for electrochemical deposition of indium metal and indium alloys. More specifically, the present invention is directed to indium compositions including one or more hydrogen suppressing compounds for the electrochemical deposition of indium metal and indium alloys.Electrochemical deposition of indium metal is challenging because indium metal deposition occurs simultaneously with hydrogen evolution from the electrolysis of water. The evolution of hydrogen compromises cathodic current efficiency ...

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Номер записи: 79
17-10-2013 дата публикации

TIN OR TIN ALLOY ELECTROPLATING SOLUTION

Номер: US20130270122A1
Автор: Ohta Yasuo, SHIMAZU Motoya
Принадлежит:

An additive obtained from the reaction product obtained by reacting glutaraldehyde and at least one type of compound selected from hydrocarbon compounds containing a hydroxyl group, and at least one type of compound selected from amine compounds, as well as a tin or tin alloy plating solution containing this additive. 16-. (canceled)7. A manufacturing method for an additive for a tin or tin alloy electroplating solution , comprising:(1) reacting glutaraldehyde and at least one type of compound selected from hydrocarbon compounds containing a hydroxyl group in the presence of an acid in a reaction solution; and(2) a step of adding at least one type of compound selected from amine compounds to the reaction solution to form the additive.8. The manufacturing method for an additive for a tin or tin alloy electroplating solution of claim 7 , further comprising a step of contacting the additive with an acidic solution.96. A manufacturing method for an acidic tin or tin alloy electroplating solution claim 7 , wherein the additive of claim is added to an acidic solution containing stannous ion and an acid component. This application is a Divisional of U.S. Non-Provisional application Ser. No. 13/094,092, filed Apr. 26, 2011 which application is a Continuation of U.S. Non-Provisional application Ser. No. 12/150,233, filed Apr. 24, 2008 and now granted U.S. Pat. No. 7,931,793, which patent claims priority of Japanese Patent Application No. 2007-114798, filed Apr. 24, 2007, the entire contents of which applications are incorporated herein by reference.The present invention relates to a tin or tin alloy electroplating solution and to an additive. In further detail, the present invention relates to a novel additive for an acidic-based electrolytic tin or tin alloy plating solution that is particularly preferable for use with barrel plating, and to a tin or tin alloy plating solution using this additive.Tin and tin alloy plating is used in electronic components that require ...

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Номер записи: 80
17-10-2013 дата публикации

Method to realize flux free indium bumping

Номер: US20130273730A1
Автор: Gaowei Xu, Le Luo, Qiuping Huang, Yuan Yuan
Принадлежит: Shanghai Institute of Microsystem and Information Technology of CAS

A method to realize flux free indium bumping process includes several steps including substrate metallization, contact holes opening, underbump metallization (UBM) layer thickening, indium bump preparation and Ag layer coating. The method can be used in the occasion for some special application, e.g., the packaging of the photoelectric chip (with optical lens), MEMS and biological detection chip, where the usage of flux is prohibited.

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Номер записи: 81
24-10-2013 дата публикации

IMMERSION TIN OR TIN ALLOY PLATING BATH WITH IMPROVED REMOVAL OF CUPROUS IONS

Номер: US20130277226A1
Автор: Barz Iris, Kilian Arnd, Muskulus Markus, Schafsteller Britta
Принадлежит: ATOTECH DEUTSCHLAND GMBH

The invention concerns an immersion tin plating bath which comprises at least one aromatic sulfonic acid, at least one first precipitation additive and at least one second precipitation additive. The at least one first precipitation additive is an aliphatic poly-alcohol compound, an ether thereof or a polymer derived thereof having an average molecular weight in the range of 62 g/mol and 600 g/mol. The at least one second precipitation additive is a polyalkylene glycol compound having an average molecular weight in the range of 750 to 10,000 g/mol. 1. An aqueous immersion tin or tin alloy plating bath comprising(i) Sn(II) ions,(ii) optionally ions of an alloying metal,(iii) at least on aromatic sulfonic acid or salt thereof,(iv) at least one complexant selected from the group consisting of thiourea and derivatives thereof and wherein the at least one first precipitation additive is selected from the group consisting of aliphatic poly-alcohol compounds, ethers thereof and polymers derived thereof having an average molecular weight in the range of 62 g/mol and 600 g/mol and', 'wherein the at least one second precipitation additive is selected from the group consisting of polyalkylene glycol compounds having an average molecular weight in the range of 750 to 10,000 g/mol., '(v) a mixture of at least one first precipitation additive and at least one second precipitation additive,'}2. An immersion tin or tin alloy plating bath according to wherein the concentration of the at least one second precipitation ranges from 1 to 10 wt.-% based on the total amount of the at least one first precipitation additive and the at least one second precipitation additive.3. An immersion tin or tin alloy plating bath according to wherein the at least one first precipitation additive is selected from the group consisting of ethylene glycol claim 1 , propylene glycol claim 1 , diethylene glycol claim 1 , dipropylene glycol claim 1 , triethylene glycol claim 1 , tripropyleneglycol claim 1 , ...

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Номер записи: 82
31-10-2013 дата публикации

METHOD AND APPARATUS FOR ELECTROPLATING SEMICONDUCTOR WAFER WHEN CONTROLLING CATIONS IN ELECTROLYTE

Номер: US20130284604A1
Автор: Brogan Lee, Duncan James E., Fu Haiying, Ghongadi Shantinath, Huang Ludan, Lee Hyosang S., Mayer Steven T., Merrill Charles L., PORTER David W., REID Jonathan D., Spurlin Tighe A., Stowell Marshall R., Thorum Matthew, Willey Mark J., WILMOT Frederick D.
Принадлежит:

Apparatus and methods for electroplating metal onto substrates are disclosed. The electroplating apparatus comprise an electroplating cell and at least one oxidization device. The electroplating cell comprises a cathode chamber and an anode chamber separated by a porous barrier that allows metal cations to pass through but prevents organic particles from crossing. The oxidation device (ODD) is configured to oxidize cations of the metal to be electroplated onto the substrate, which cations are present in the anolyte during electroplating. In some embodiments, the ODD is implemented as a carbon anode that removes Cu(I) from the anolyte electrochemically. In other embodiments, the ODD is implemented as an oxygenation device (OGD) or an impressed current cathodic protection anode (ICCP anode), both of which increase oxygen concentration in anolyte solutions. Methods for efficient electroplating are also disclosed. 1. An apparatus for electroplating a metal onto a substrate , the apparatus comprising: a cathode chamber for containing catholyte during electroplating;', 'a cathode electrical connection in the cathode chamber, the cathode electrical connection being able to connect to the substrate and apply a potential allowing the substrate to become a cathode;', 'an anode chamber for containing anolyte during electroplating;', 'an anode electrical connection in the anode chamber, the anode electrical connection being able to connect to an electroplating anode and apply a potential to the electroplating anode; and', 'a porous transport barrier placed between the anode chamber and the cathode chamber, which transport barrier enables migration of ionic species in an electrolyte, including metal cations, across the transport barrier while substantially preventing organic additives from passing across the transport barrier; and, '(a) an electroplating cell comprising(b) at least one oxidation device (ODD) configured to oxidize cations of the metal to be electroplated onto the ...

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Номер записи: 83
31-10-2013 дата публикации

HIGH SPEED METHOD FOR PLATING PALLADIUM AND PALLADIUM ALLOYS

Номер: US20130284605A1
Автор: Clauss Margit, GUEBEY Jonas, SCHWAGER Felix J., ZHANG-BEGLINGER Wan
Принадлежит:

A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry. 16-. (canceled)7. A method comprising:a) providing a composition comprising one or more sources of palladium ions, one or more sources of alloying metal ions, ammonium ions and at least 55 g/L urea;b) contacting a substrate with the composition; and{'sup': '2', 'c) generating a current density of at least 10 Amps/dmto deposit palladium alloy on the substrate.'}8. The method of claim 7 , wherein the current density ranges from 10 Amps/dmto 100 Amps/dm.9. The method of claim 7 , wherein the composition further includes one or more of alkali metal hydroxides and metal carbonates.10. The method of claim 7 , wherein the alloying metal ions are nickel ions.11. The method of claim 7 , wherein the composition has a free ammonia concentration of less than 50 g/L throughout palladium alloy deposition. The present application is a Divisional of U.S. Non-Provisional Application No. 12/912,400, filed Oct. 26, 2010 which application is a Continuation-in-Part application of Non-Provisional application Ser. No. 12/220,037, filed Jul. 21, 2008 which application claimed priority of U.S. Provisional Application No. 60/961,393, filed Jul. 20, 2007.The present invention is directed to high speed methods for plating palladium and palladium alloys using ammonia-based palladium and palladium alloy plating compositions. More specifically, the present invention is directed to high speed methods for plating palladium and palladium alloys using ammonia-based palladium and palladium alloy plating compositions where the level of free ammonia is reduced.The dramatic increase in the price of gold over the past several years has given rise to new methods and equipment in the ...

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Номер записи: 84
07-11-2013 дата публикации

ALUMINUM OR ALUMINUM ALLOY MOLTEN SALT ELECTROPLATING BATH HAVING GOOD THROWING POWER, ELECTROPLATING METHOD USING THE BATH, AND PRETREATMENT METHOD OF THE BATH

Номер: US20130292255A1
Автор: Hashimoto Akira, Inomata Toshiki, Inoue Manabu, Konno Naruaki, Nonomura Keisuke, Onuma Tadahiro
Принадлежит: DIPSOL CHEMICALS CO., LTD

The purpose of the present invention is to provide an electrical Al plating bath that poses little danger of exploding or igniting as a result of contacting air or water, and contains no benzene, toluene, xylene, naphthalene, or 1,3,5-trimethylbenzene, which have detrimental effects to humans. The present invention provides an electrical aluminum or aluminum alloy fused salt plating bath that is obtained by heat treatment of an electrical aluminum or aluminum alloy fused salt plating bath containing (A) a halogenated aluminum as the primary component and (B) at least one other type of halide after adding (C) one, two or more reducible compounds selected from the group consisting of hydrides of elements in Group Periods through of the Periodic Table of Elements and/or hydrides of Group Periods through of the Periodic Table of Elements and amine borane compounds. 1. An aluminum or aluminum alloy molten salt electroplating bath which is obtained by adding (C) a reducing compound which is one or more compounds selected from the group consisting of hydrides of elements in group 1 periods 2 to 6 in the periodic table , hydrides of elements in group 1 periods 2 to 6 and elements in group 13 periods 2 to 6 in the periodic table , and amine borane compounds to an aluminum or aluminum alloy molten salt electroplating bath comprising (A) an aluminum halide as a main component and (B) at least one further halide , followed by a heat treatment.2. The aluminum or aluminum alloy molten salt electroplating bath according to claim 1 , whereinthe reducing compound (C) is one or more compounds selected from the group consisting of lithium aluminum hydride, lithium hydride, lithium sodium hydride, sodium hydride, sodium borohydride, dimethylamine borane, diethylamine borane, and trimethylamine borane.3. The aluminum or aluminum alloy molten salt electroplating bath according to claim 2 , whereinthe reducing compound (C) is lithium aluminum hydride and/or dimethylamine borane.4. The ...

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Номер записи: 85
21-11-2013 дата публикации

Plating apparatus and plating solution management method

Номер: US20130306483A1
Автор: Masashi Shimoyama, Yuji Araki
Принадлежит: Ebara Corp

A plating apparatus plates a substrate with Sn alloy to form an Sn alloy film on a surface of the substrate. The apparatus includes: a plating bath for retaining a plating solution therein, the substrate being immersed in the plating solution in a position opposite to an insoluble anode; a plating solution dialysis line for extracting the plating solution from the plating bath and returning the plating solution to the plating bath; a dialysis cell provided in the plating solution dialysis line and configured to remove a free acid from the plating solution by dialysis using an anion exchange membrane; a free acid concentration analyzer; and a controller for controlling a flow rate of the plating solution flowing through the plating solution dialysis line based on the concentration of the free acid measured by the free acid concentration analyzer.

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Номер записи: 86
28-11-2013 дата публикации

ZINC-IRON ALLOY LAYER MATERIAL

Номер: US20130316190A1
Автор: Bedrnik Lukas, HAAS Frantisek, LANG Nadine, Vogel Roland
Принадлежит: ATOTECH DEUTSCHLAND GMBH

The invention discloses a zinc-iron alloy layer material having a body centred cubic crystal structure of the Γ-phase, a (330) texture and an iron content of 12 to 20 wt.-% deposited from an alkaline aqueous plating bath. The zinc alloy layer material provides a high corrosion protection to metallic substrates, has a high hardness and a bright appearance. 2. An alkaline aqueous zinc-iron alloy plating bath comprising4 to 6 g/l zinc ions1 to 3 g/l iron ions25 to 35 g/l hydroxyl ions,0.5 to 2.5 g/l of a quaternary ammonium polymer andat least one complexing agent selected from the group consisting of hydroxyl carboxylic acids and salts thereof.4. An alkaline aqueous zinc-iron alloy plating bath according to further comprising an alkanolamine compound.5. An alkaline aqueous zinc-iron alloy plating bath according to wherein the alkanolamine compound is selected from the group comprising monoethanolamine claim 4 , diethanolamine claim 4 , triethanolamine claim 4 , propanolamine claim 4 , N-methylethanolamine and N claim 4 ,N claim 4 ,N′ claim 4 , N′-tetrakis-(2-hydroxypropyl)-ethylenediamine.6. An alkaline aqueous zinc-iron alloy plating bath according to wherein the concentration of the alkanolamine compound ranges from 8 to 20 g/l.7. A process for depositing a zinc-iron alloy layer material having a body centred cubic crystal structure of the Γ-phase claim 4 , a (330) texture and an iron content of 12 to 20 wt.-% comprising the steps(i) providing a metallic substrate,{'claim-ref': {'@idref': 'CLM-00002', 'claim 2'}, '(ii) contacting the substrate with an alkaline aqueous plating bath according to and simultaneously applying a current to the substrate.'}8. An alkaline aqueous zinc-iron alloy plating bath according to further comprising an alkanolamine compound.9. An alkaline aqueous zinc-iron alloy plating bath according to wherein the alkanolamine compound is selected from the group comprising monoethanolamine claim 8 , diethanolamine claim 8 , triethanolamine claim 8 ...

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Номер записи: 87
05-12-2013 дата публикации

ELECTROLYTIC COPPER PLATING SOLUTION AND METHOD OF ELECTROLYTIC COPPER PLATING

Номер: US20130319867A1
Автор: HAYASHI Shinjiro, MIZUNO Yoko, MORINAGA Toshiyuki, SAITO Mutsuko, Sakai Makoto
Принадлежит:

An electrolytic copper plating solution is provided which has an excellent via filling ability without using formaldehyde, which is harmful to the environment. An electrolytic copper plating solution which contains compounds which have an —X—S—Y— structure wherein X and Y are individually atoms selected from a group comprising hydrogen, carbon, sulfur, nitrogen, and oxygen atoms and X and Y can be the same only when they are carbon atoms and specific nitrogen-containing compounds. Good filled vias can be made without causing a worsening of the exterior appearance of the plating by using this electrolytic copper plating solution. 3. An electrolytic copper plating solution in accordance with or , which also contains levelers and carriers.43. A method of copper-electroplating substrates using electrolytic copper plating solutions in accordance with any 1 of -.5. Substrates produced by the method referred to in . This invention concerns an electrolytic copper plating solution which contains a compound containing a sulfur atom and a specific nitrogen-containing compound, as well as a method of electrolytic copper plating which uses this electrolytic copper plating solution.In recent years, a plating method known as “through-hole plating” or “via filling plating” has been used in basic production of printed circuit boards used in electronic devices such as personal computers. Electrolytic copper plating is expected to have application to through-hole and via plating, since the rate of deposition of the plating film is rapid, 10-50 μm/hr. However, if the copper is deposited on the whole inner via surfaces, the rate of deposition near the bottom of the vias must be more rapid than the rate of deposition in their opening parts in order for the inside of the vias to be filled with copper without leaving voids. If the rate of deposition near the bottoms is the same as or slower than the rate of deposition in the opening parts, either the vias will not be filled, or the opening ...

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Номер записи: 88
05-12-2013 дата публикации

Method of producing displacement plating precursor

Номер: US20130319871A1
Автор: Hajime Murata, Tomoyuki Nagai, Toshihiro Ikai, Yu Morimoto
Принадлежит: Toyota Motor Corp

A method of producing a displacement plating precursor, including a deposition step of depositing a Cu layer on a surface of a core particle formed of Pt or a Pt alloy by contacting a Cu ion-containing acidic aqueous solution with at least a portion of a Cu electrode, and contacting the Cu electrode with the core particle or with a composite, in which the core particle is supported on an electroconductive support, within the acidic aqueous solution or outside the acidic aqueous solution, and moreover contacting the core particle with the acidic aqueous solution under an inert gas atmosphere.

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Номер записи: 89
12-12-2013 дата публикации

Method for Alkaliating Anodes

Номер: US20130327648A1
Автор: Asela Maha Acharige, Matthew Sweetland, Robert W. Grant
Принадлежит: Nanoscale Components Inc

The present invention relates to a method for lithiation of an intercalation-based anode or a non-reactive plating-capable foil or a reactive alloy capable anode, whereby utilization of said lithiated intercalation-based anode or a plating-capable foil or reactive alloy capable anode in a rechargeable battery or electrochemical cell results in an increased amount of lithium available for cycling, and an improved reversible capacity during charge and discharge.

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Номер записи: 90
19-12-2013 дата публикации

COATING TECHNOLOGY

Номер: US20130334056A1
Автор: Ashfield Laura, Berzins Allan Rein, Boardman Alan, Warren Stephen Geoffrey
Принадлежит: JOHNSON NATTHEY PUBLIC LIMITED COMPANY

The present invention provides an aqueous platinum electroplating bath including: a) a source of platinum ions; and b) a source of polyphosphate anions, and wherein the bath has a pH in the range from about 2 to about 9 when it is in use or ready for use. The aqueous platinum electroplating bath may optionally include one or more levellers. The invention also provides the use of the platinum electroplating bath and platinum salts suitable for use in the bath. 130-. (canceled)31. An aqueous platinum electroplating bath for depositing a coating of platinum on a substrate , the bath comprising:a) at least one platinum plating salt or complex; andb) a source of polyphosphate anions,and wherein the bath has a pH in the range from about 2 to about 9 when it is in use or ready for use.32. A bath according to claim 31 , wherein the platinum plating salt or complex is selected from the group consisting of diammine dinitroplatinum(II) claim 31 , tetraammineplatinum(II) hydrogen orthophosphate claim 31 , tetraamineplatinum(II) nitrate claim 31 , tetraammineplatinum(II) hydrogen carbonate claim 31 , tetraammineplatinum(II) hydroxide and tetraammineplatinum(II) sulphate.33. A bath according to claim 31 , wherein the platinum plating salt or complex is selected from the group consisting of alkali metal hexahydroxyplatinates(IV) claim 31 , alkali metal tetranitroplatinates(II) claim 31 , alkali metal salts of hydrogen hexachloroplatinate(IV) claim 31 , alkali metal salts of hydrogen dinitrosulphatoplatinate(II) claim 31 , alkali metal tetrahaloplatinates(II) and tetraamineplatinum(II) halides.34. A bath according to claim 31 , wherein the source of polyphosphate anions(a) is an alkali metal salt, alkaline earth metal salt or ammonium salt of a polyphosphoric acid, or a mixture thereof;{'sub': '2', '(b) is selected from the group consisting of disodium pyrophosphate dibasic, dipotassium pyrophosphate dibasic, tetrasodium pyrophosphate, tetrasodium pyrophosphate decahydrate, ...

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Номер записи: 91
19-12-2013 дата публикации

HIGH-PURITY ELECTROLYTIC COPPER AND ELECTROLYTIC REFINING METHOD THEREOF

Номер: US20130334057A1
Автор: Kato Naoki, Nakaya Kiyotaka, Watanabe Mami
Принадлежит:

This electrolytic refining method of high-purity electrolytic copper includes: performing electrolysis by using an electrolyte which includes a copper nitrate solution, a cathode made of stainless steel, and an anode made of copper so as to deposit high-purity electrolytic copper on the cathode. 1. An electrolytic refining method of high-purity electrolytic copper , the method comprising:performing electrolysis by using an electrolyte which includes a copper nitrate solution, a cathode made of stainless steel, and an anode made of copper so as to deposit high-purity electrolytic copper on the cathode,wherein (a) the electrolyte includes a mixture of polyethylene glycol and polyvinyl alcohol at a content of 20 ppm or more as an additive, and{'sup': '2', 'claim-text': [{'br': None, 'i': 'Z≦', '1000≦2000'}, {'br': None, 'i': Z−', 'X≦', 'Z−, '1.2−(1000)×0.0008≦2.2−(1000)×0.001.'}], '(b) when a molecular weight of the polyethylene glycol is given as Z and a current density during the electrolysis is given as X (A/dm), the electrolysis is performed under conditions that fulfill the following relational expressions,'}2. A high-purity electrolytic copper claim 1 , which is obtained by the electrolytic refining method according to claim 1 ,wherein (a) a content of S in the high-purity electrolytic copper is in a range of 0.01 ppm or less,(b) a crystallite diameter on an electrolyte surface side of the high-purity electrolytic copper is in a range of 400 nm or less,(c) a crystallite diameter on a cathode side of the high-purity electrolytic copper is in a range of 140 nm or more, and(d) an orientation index of the high-purity electrolytic copper on the cathode side fulfills the following relational expression,an orientation index of (1,1,1) crystal face >an orientation index of (2,2,0) crystal face. The present invention relates to a high-purity electrolytic copper including a low content of impurities such as sulfur (S) and the like, and an electrolytic refining method ...

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Номер записи: 92
26-12-2013 дата публикации

ELECTRO COPPER PLATING ADDITIVE AND ELECTRO COPPER PLATING BATH

Номер: US20130341199A1
Автор: Sugiura Hironori, Uchida Hiroki
Принадлежит: C. UYEMURA & CO., LTD.

Provided are an additive for electro copper plating and an electro copper plating bath containing the additive, wherein the additive forms a plating film uniformly in a range of from a low current density portion to a high current density portion and thereby gives good glossiness, and is not consumed at the time of non-usage thereof. In the present invention, an additive for electro copper plating including a block polymer compound expressed by the following general formula (1) is added to an electro copper plating bath. (Here, in the formula, R represents an alkyl group or an alkenyl group having a linear-chain or branched-chain structure and having a carbon number of 1 to 15, m is an integer of from 1 to 30, and n is an integer of from 1 to 40.) 2. The additive for electro copper plating according to claim 1 , wherein the block polymer compound is obtained in such a manner that claim 1 , under an atmosphere of inert gas claim 1 , an alkyl alcohol or an alkenyl alcohol having a carbon number of 1 to 15 is made to undergo an addition reaction with propylene oxide claim 1 , and then ethylene oxide is added and reacted.3. An electro copper plating bath containing the additive for electro copper plating according to . The present invention relates to an electro copper plating additive and an electro copper plating bath, particularly relates to an electro copper plating additive suitable as a brightener for a copper sulfate plating bath and an electro copper plating bath containing the additive. The present application asserts priority rights based on JP Patent Application 2011-070667 filed in Japan on Mar. 28, 2011. The total contents of disclosure of the patent application of the senior filing date are to be incorporated by reference into the present application.To provide a glossy copper plating film, a brightener has been conventionally added to an electro copper plating bath. As the brightener, for example, organic thio compounds and high molecular organic ...

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Номер записи: 93
26-12-2013 дата публикации

ULTRA-THIN COPPER SEED LAYER FOR ELECTROPLATING INTO SMALL FEATURES

Номер: US20130341794A1
Автор: TAO RONG, YU JICK M.
Принадлежит: Applied Materials, Inc.

An apparatus and process are described that allow electroplating to fill sub-micron, high aspect ratio semiconductor substrate features using a non-copper/pre-electroplating layer on at least upper portions of side walls of the features, thereby providing reliable bottom up accumulation of the electroplating fill material in the feature. This apparatus and process eliminates feature filling material voids and enhances reliability of the electroplating in the diminishing size of features associated with future technology nodes of 22, 15, 11, and 8 nm. The presence of non-copper pre-electroplating material on the side walls allows the feature whose side walls, but not bottom surface, are lined with such pre-electroplating material (such as cobalt) to fill the feature using electroplated fill material accumulating from the bottom of the feature up to reliability and predictability and substantially void-free. 1. A device comprising:a dielectric material layer on a substrate, wherein the dielectric material layer has a feature extending therethrough to a surface of the substrate facing the feature, wherein at least one side wall of the dielectric material layer facing the feature meets the surface of the substrate facing the feature and comprises at least one side wall and a bottom surface of the feature;a barrier layer coating the at least one side wall of the feature and extending to and coating the bottom surface of the feature;a continuous metal seed layer coating the barrier layer over the at least one side wall extending to and over the bottom surface of the feature;at least a remnant of a pre-electroplating layer coating at least an upper portion of the continuous metal seed layer over the at least one side wall of the feature, but not over the bottom surface of the feature; anda substantially void free homogeneous metal feature fill material extending from the continuous metal seed layer coating the barrier layer over the bottom surface of the feature and on the ...

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Номер записи: 94
02-01-2014 дата публикации

SELF-TERMINATING GROWTH OF PLATINUM BY ELECTROCHEMICAL DEPOSITION

Номер: US20140001049A1
Автор: LIU YIHUA, MOFFAT THOMAS P.
Принадлежит:

A self-terminating rapid process for controlled growth of platinum or platinum alloy monolayer films from a KPtCl—NaCl—NaBr electrolyte. Using the present process, platinum deposition may be quenched at potentials just negative of proton reduction by an alteration of the double layer structure induced by a saturated surface coverage of underpotential deposited hydrogen. The surface may be reactivated for platinum deposition by stepping the potential to more positive values where underpotential deposited hydrogen is oxidized and fresh sites for absorption of platinum chloride become available. Periodic pulsing of the potential enables sequential deposition of two dimensional platinum layers to fabricate films of desired thickness relevant to a range of advanced technologies, from catalysis to magnetics and electronics. 1. A self-terminating electrodeposition process for controlled growth of platinum monolayer film in an aqueous solution , the process comprising the steps of:in the aqueous solution, electrodepositing platinum or a platinum alloy onto a substrate such that a saturated underpotential deposited hydrogen layer is formed on the substrate, wherein, as the potential moves negative of an onset of proton reduction potential, a metal deposition reaction among the deposited platinum, the hydrogen layer and the aqueous solution is fully quenched or terminated, wherein the aqueous solution contains at least platinum salt; andpulsing the potential from a first value, a positive value at which no metal deposition occurs, to a second value, said second value being a more negative value than the first value, said second value being at least 0.05 V more negative or below the reversible hydrogen electrode potential of said solution, thus enabling formation on the substrate of two-dimensional platinum islands that substantially cover the substrate, said formation being followed by negligible further metal deposition on the substrate.2. The process of claim 1 , further ...

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Номер записи: 95
30-01-2014 дата публикации

PLATING BATH AND METHOD

Номер: US20140027297A1
Автор: NIAZIMBETOVA Zuhra I., RZEZNIK Maria Anna
Принадлежит:

This invention relates to copper plating baths containing a leveling agent that is a reaction product of one or more of certain cyclodiaza-compounds with one or more epoxide-containing compounds useful to deposit copper on the surface of a conductive layer. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. This invention also relates to methods of depositing copper layers using such copper plating baths. 2. The method of wherein the epoxide-containing compound comprises from 1 to 3 epoxy groups.4. The method of wherein the copper electroplating bath further comprises an accelerator. This application is a divisional of U.S. patent application Ser. No. 12/214,723, filed on Aug. 22, 2011.The present invention relates generally to the field of electrolytic metal plating. In particular, the present invention relates to the field of electrolytic copper plating.Methods for electroplating articles with metal coatings generally involve passing a current between two electrodes in a plating solution where one of the electrodes is the article to be plated. A typical acid copper plating solution comprises dissolved copper (usually copper sulfate), an acid electrolyte such as sulfuric acid in an amount sufficient to impart conductivity to the bath, and proprietary additives to improve the uniformity of the plating and the quality of the metal deposit. Such additives include accelerators, levelers, and suppressors, among others.Electrolytic copper plating solutions are used in a variety of industrial applications, such as decorative and anticorrosion coatings, as well as in the electronics industry, particularly for the fabrication of printed circuit boards and semiconductors. For circuit board fabrication, copper is electroplated over selected portions of the surface of a printed circuit board, into blind vias and onto the walls of through-holes passing between the surfaces of the circuit ...

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Номер записи: 96
30-01-2014 дата публикации

PLATING BATH AND METHOD

Номер: US20140027298A1
Автор: NIAZIMBETOVA Zuhra I., RZEZNIK Maria Anna
Принадлежит:

This invention relates to copper plating baths containing a leveling agent that is a reaction product of one or more of certain cyclodiaza-compounds with one or more epoxide-containing compounds useful to deposit copper on the surface of a conductive layer. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. This invention also relates to methods of depositing copper layers using such copper plating baths. 2. The copper electroplating bath of wherein the epoxide-containing compound comprises from 1 to 3 epoxy groups.4. The copper electroplating bath of further comprising an accelerator.5. The copper electroplating bath of wherein the at least one cyclodiaza-compound is selected from the group consisting of pyridazine claim 1 , 3-methylpyridazine claim 1 , 4-methylpyridazine claim 1 , 3 claim 1 ,6-dihydroxypyridazine claim 1 , 3 claim 1 ,6-dihydroxy-4-methyl-pyridazine claim 1 , phthalazine claim 1 , 6-phenyl-3(2H)-pyridazinone claim 1 , 6-(2-hydroxyphenyl)-3(2H)-pyridazinone claim 1 , 4 claim 1 ,5-dihydro-6-phenyl-3(2H)-pyridazinone claim 1 , 1(2H)-phthalazinone claim 1 , 4-phenylphthalazin-1(2H)-one claim 1 , 4-(4-methylphenyl)phthalazin-1(2H)-one claim 1 , and 4-(4-chlorophenyl)phthalazin-1(2H)-one.6. The copper electroplating bath of further comprising a suppressor. This application is a divisional of U.S. patent application Ser. No. 12/214,723, filed on Aug. 22, 2011.The present invention relates generally to the field of electrolytic metal plating. In particular, the present invention relates to the field of electrolytic copper plating.Methods for electroplating articles with metal coatings generally involve passing a current between two electrodes in a plating solution where one of the electrodes is the article to be plated. A typical acid copper plating solution comprises dissolved copper (usually copper sulfate), an acid electrolyte such as sulfuric acid in an amount ...

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Номер записи: 97
06-02-2014 дата публикации

METALLIZATION MIXTURES AND ELECTRONIC DEVICES

Номер: US20140034370A1
Автор: Kolics Artur, REDEKER Fritz
Принадлежит: LAM RESEARCH CORPORATION

One aspect of the present invention is a method of processing a substrate. In one embodiment, the method comprises forming an electrical conductor on or in the substrate by providing a mixture comprising metal particles and an electroless deposition solution and electrolessly depositing a metal matrix and co-depositing the metal particles. In another embodiment, the method comprises forming an electrical conductor on or in the substrate by providing a mixture comprising metal particles and an electrochemical plating solution and electrochemically plating a metal matrix and co-depositing the metal particles. Another aspect of the present invention is a mixture for the formation of an electrical conductor on or in a substrate. Another aspect of the present invention is an electronic device. 1. A mixture for forming copper structures on or in a substrate , the mixture comprising:particles comprising copper and an electroless deposition solution containing copper ions for electroless deposition of a matrix comprising copper; orparticles comprising copper and an electrochemical plating solution containing copper ions for electrochemical plating of a matrix comprising copper.2. The mixture of claim 1 , wherein the particles have a maximum size of less than 30 micrometers.3. The mixture of claim 1 , wherein the particles have a maximum size in the range from 0.1 micrometer to 10 micrometers.4. The mixture of claim 1 , wherein the electroless deposition solution or the electrochemical plating solution comprises one or more metal salts claim 1 , one or more reducing agents claim 1 , one or more complexing agents claim 1 , one or more pH adjustors claim 1 , one or more buffering agents claim 1 , one or more surfactants claim 1 , and/or one or more additives.5. An electronic device comprising:a substrate having one or more through-substrate vias;a barrier layer on the walls of the one or more substrate vias;a matrix comprising copper; andmetal particles embedded in the matrix; ...

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Номер записи: 98
13-02-2014 дата публикации

ELECTROPLATING BATH AND METHOD FOR PRODUCING DARK CHROMIUM LAYERS

Номер: US20140042033A1
Автор: HARTMANN Philip, SCHULZ Klaus-Dieter, WACHTER Philipp
Принадлежит: ATOTECH DEUTSCHLAND GMBH

The invention relates to methods and plating baths for electrodepositing a dark chromium layer on a workpiece. The trivalent chromium electroplating baths comprise sulphur compounds and the methods for electrodepositing a dark chromium layer employ these trivalent chromium electroplating baths. The dark chromium deposits and workpieces carrying dark chromium deposits are suited for application for decorative purposes. 114-. (canceled)16. The electroplating bath according to claim 15 , wherein the sulphur containing compounds having the general Formula (I) are selected from compounds wherein Ris not H if Ris H or Ris not H if Ris H.19. The electroplating bath according to claim 15 , wherein{'sup': '1', 'Ris —OH, and'}{'sup': '2', 'sub': 2', 'q', '2', 'q', '2', '2, 'Ris selected from the group consisting of —(CH—)—OH and —(CH—)—S(CH—)—OH; and'}{'claim-ref': {'@idref': 'CLM-00015', 'claim 15'}, 'q has the meaning as defined in .'}21. The electroplating bath according to claim 15 , wherein the coloring agent is selected from the group of sulphur containing compounds comprising:(1) 2-(2-Hydroxy-ethylsulfanyl)-ethanol,(2) Thiazolidine-2-carboxylic acid,(3) Thiodiglycol ethoxylate,(4) 2-Amino-3-ethylsulfanyl-propionic acid,(5) 3-(3-Hydroxy-propylsulfanyl)-propan-1-ol,(6) 2-Amino-3-carboxymethylsulfanyl-propionic acid,(7) 2-Amino-4-methylsulfanyl-butan-1-ol,(8) 2-Amino-4-methylsulfanyl-butyric acid,(9) 2-Amino-4-ethylsulfanyl-butyric acid,(10) 3-Carbamimidoylsulfanyl-propane-1-sulfonic acid,(11) 3-Carbamimidoylsulfanyl-propionic acid,(12) Thiomorpholine,(13) 2-[2-(2-Hydroxy-ethylsulfanyl)-ethylsulfanyl]-ethanol,(14) 4,5-Dihydro-thiazol-2-ylamine,(15) Thiocyanic acid,(16) 2-Amino-4-methanesulfinyl-butyric acid,(17) 1,1-Dioxo-1,2-dihydro-1lambda*6*-benzo[d]isothiazol-3-one,(18) Prop-2-yne-1-sulfonic acid,(19) Methanesulfinylmethane, and(20) 2-(1,1,3-Trioxo-1,3-dihydro-1lambda*6*-benzo[d]isothiazol-2-yl)ethanesulfonic acid.22. The electroplating bath according to claim 15 , ...

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Номер записи: 99
13-02-2014 дата публикации

ELECTROLYSIS COPPER-ALLOY FOIL, METHOD OF THE SAME, ELECTROLYTIC-SOLUTION USING THE PRODUCTION, NEGATIVE ELECTRODE AGGREGATION USED THE SAME, SECONDARY BATTERY, AND ELECTRODE OF THE SAME

Номер: US20140045061A1
Автор: Ebisugi Masato, Ezura Takeshi, Fujisawa Kimiko, Sasaki Hirokazu, SHINOZAKI Jun, Shinozaki Kensaku, Suzuki Akitoshi, TSURUTA Takahiro, Yamazaki Satoshi
Принадлежит: FURUKAWA ELECTRIC CO., LTD.

The invention relates to an electrolytic copper alloy foil having large mechanical strength in an ordinary state and showing resistant to heat deterioration even when it is heated to 300° C. or more. That electrolytic copper alloy foil, which contains tungsten copper, preferably incorporates tungsten into copper foil as a copper alloy, has a tensile strength at ordinary temperature of 650 MPa, has a tensile strength after heat treatment at 300° C. for 1 hour of 450 MPa or more, and has a conductivity of 80% or more. Further preferably, the electrolytic copper foil has an elongation at ordinary temperature of 2.5% or more and an elongation after treatment at 300° C. for 1 hour of 3.5% or more. The electrolytic copper foil is produced by adding a thiourea compound, tungsten salt, and chloride ions to a sulfuric acid-copper sulfate electrolyte and performing electrolytic deposition. 1. An electrolytic copper alloy foil comprising tungsten.220-. (canceled)21. An electrolytic copper alloy foil of claim 1 ,wherein the tungsten is at least partially incorporated as an oxide.22. The electrolytic copper alloy foil of claim 1 , further substantially comprising copper.23. The electrolytic copper alloy foil of claim 1 , comprising from 0.0001 to 0.060 wt % of tungsten.24. The electrolytic copper alloy foil of claim 1 , comprising from 0.001 to 0.055 wt % of tungsten claim 1 ,wherein the electrolytic copper alloy foil has a tensile strength at ordinary temperature of 650 MPa or more and a tensile strength after treatment at 300° C. for 1 hour of 450 MPa or more.25. The electrolytic copper alloy foil of claim 24 ,wherein the electrolytic copper alloy foil has a conductivity of 80% or more.26. The electrolytic copper alloy foil of claim 24 ,wherein the electrolytic copper alloy foil has an elongation at ordinary temperature of 2.5% or more, and an elongation after treatment at 300° C. for 1 hour of 3.5% or more.27. The electrolytic copper alloy of claim 1 , comprising tungsten and ...

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Номер записи: 100