30-05-2013 дата публикации
Номер: US20130133412A1
A method of producing an insert molded sensor assembly having at least one sensor element accommodated on a first side of a circuit board of the sensor assembly. During a first step, a plurality of pins are introduced and penetrate through the circuit board. The circuit board, including the at least one sensor element, is then disposed, during a second step, into a two-part insert mold tool so that the pins are supported on both sides of the circuit board in a direction transverse to a plane defined by the circuit board. A defined spacing distance, between a surface of the sensor element and the insert mold tool, is produced by the pins. During a third step of the method, the insert mold tool is filled with insert molding material, particularly a duroplast. 110-. (canceled)11100134221a. A method () of manufacturing a molded sensor subassembly () having at least one sensor element ( , ) supported on a first side () of a circuit board () of the sensor assembly () , the method comprising the steps of:{'b': 110', '6', '2, 'during a first step (), introducing a plurality of pins () which penetrate through the circuit board ();'}{'b': 210', '2', '3', '4', '6', '10', '6', '2', '7', '8', '6', '10', '6', '3', '4', '10, 'i': a', 'a, 'during a second step (), disposing the circuit board () including the at least one sensor element (, ) and the plurality of pins () in a two-part insert mold tool () so that the pins () are supported on both sides of the circuit board (), in a direction transverse to a plane defined by the circuit board, by face side tool contact surfaces (, ) of the plurality of pins () which engage with the insert mold tool (), and the plurality of pins () define a spacing distance between a surface of the sensor element (, ) and the insert mold tool (); and'}{'b': 310', '10', '14, 'during a third step (), filling the insert mold tool () with insert molding material ().'}121002110276ab. The method () according to claim 11 , further comprising the step of ...
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