СПОСОБ ОПТИМИЗАЦИИ РЕЖИМОВ РАБОТЫ ТЕРМОЭЛЕКТРИЧЕСКОЙ БАТАРЕИ С УЧЕТОМ ГЕОМЕТРИЧЕСКИХ И ЭЛЕКТРОТЕПЛОФИЗИЧЕСКИХ ПАРАМЕТРОВ ПРИ ИМПУЛЬСНОМ ПИТАНИИ

Изобретение относится к способам оптимизации режимов работы термоэлектрической батареи. Способ оптимизации режимов работы термоэлектрической батареи с учетом геометрических и электротеплофизических параметров при импульсном питании заключается в том, что геометрические размеры полупроводниковых ветвей и металлических спаев термоэлектрической батареи оптимизированы в соответствии с электро- и теплофизическими свойствами материалов термоэлементов, при этом питание термоэлектрической батареи обеспечивается импульсным током с длительностью и скважностью импульсов, пропорциональной параметрам движения зарядов. В термоэлектрической батарее геометрические размеры полупроводниковых ветвей и металлических спаев выбраны таким образом, что учитываются параметры движения зарядов внутри полупроводника и металлических спаев. Такими параметрами являются длина свободного пробега заряда до соударения и энергия, передаваемая при столкновении заряда с кристаллической решеткой. Технический результат - улучшение ...

УСТРОЙСТВО АВТОМАТИЧЕСКОГО УПРАВЛЕНИЯ ПОТРЕБЛЕНИЕМ ТЕПЛОВОЙ ЭНЕРГИИ

Изобретение относится к области отопления зданий. Предложено устройство автоматического управления потреблением тепловой энергии, включающее подающий трубопровод, соединенные последовательно регулирующий капан расхода, второй вход которого снабжен электроприводом, водоструйный элеватор, систему отопления и обратный трубопровод, а также модуль управления клапаном расхода, выход которого соединен с входом электропривода, а три входа соответственно с датчиком измерения температуры наружного воздуха и датчиками измерения температуры теплоносителя, установленными на подающем и обратном трубопроводах, и размещенную между подающим и обратным трубопроводом линию циркуляционного насоса, снабженного первой и второй запорной арматурой на входе и выходе насоса, и обратным кланом на выходе и входом подключенного через вторую запорную арматуру к обратному трубопроводу. Причем устройство дополнительно содержит модуль управления насосом, первый и второй вход которого связаны с датчиком измерения давления ...

ТЕРМОРЕЛЕ ДЛЯ ХОЛОДИЛЬНИКОВ

УСТРОЙСТВО КОНТРОЛЯ ТЕМПЕРАТУРЫ

Устройство контроля температуры, содержащее регулятор температуры и термовыключатель, размещенные в герметичном кожухе и имеющие внешние электрические выводы, отличающееся тем, что оно снабжено теплопроводящей пластиной с фиксатором, на которой закреплены регулятор температуры и термовыключатель.

ТЕРМОРЕЛЕ

Термореле, содержащее корпус, переключатель, термочувствительный элемент, пружину настройки, размещенную между передаточным рычагом и ползуном, взаимодействующим с кулачком, отличающееся тем, что кулачок снабжен дополнительным рабочим профилем, а усилие пружины настройки при воздействии ползуна с дополнительным рабочим профилем меньше усилия термочувствительного элемента.

МАЛОДИФФЕРЕНЦИАЛЬНОЕ ТЕРМОРЕЛЕ ДЛЯ ХОЛОДИЛЬНИКОВ

Полезная модель относится к приборам холодильной техники и может быть использована для регулирования температуры в холодильнике. Цель - повышение надежности и долговечности. На рычаге переключения электрических контактов в месте его шарнирного взаимодействия с перекидывающейся пружиной выполнена ножевая кромка под острым углом.

ТЕРМОРЕЛЕ С РУЧНЫМ ВОЗВРАТОМ

Термостатическое перекрывное устройство

Термостатическое перекрывное устройство преимущественно для топливных систем летательных аппаратов, содержащее корпус с входным и выходным подпружиненными седлами, расположенной между ними задвижкой и подвижную часть термопривода, соединенную с задвижкой, отличающееся тем, что, с целью повышения надежности, устройство снабжено кожухом, в котором размещена подвижная часть термопривода и установленной в выходном седле соединенной с кожухом эжекторной трубкой.

ТЕРМОСТАТ

Система отопления

Прибор для регулирования влажности гигроскопических материалов и температуры

Способ автоматического управления процессом теплообмена при тепловой обработке материала

Способ автоматического регулирования процесса тепловлажностной обработки в автоклаве

THERMALLY RESPONSIVE CONTROL ASSEMBLIES

... 1438494 Controlling the temperature in tumble dryers T I DOMESTIC APPLIANCES Ltd 31 Aug 1973 [11 Sept 1972] 42102/72 Heading F4G A thermally responsive control assembly, e.g. for a tumble dryer, comprises a manually operable control, e.g. a knob 8, for setting the assembly to a predetermined temperature and means, e.g. a bimetallic coil 10, responsive to ambient temperature in the vicinity of the manual control for causing an induction to be given of a change in ambient temperature and of a correction therefor which may be applied to the manually operable control. As shown the knob 8 is associated with a scale disc 4 and the bimetallic coil 10 is connected therebetween such that rotation of the knob 8 causes a corresponding rotation of the disc 4 to bring a temperature setting on the disc 4 opposite a fiducial mark 6 on a casing 1. On a change in the ambient temperature the relative positions of the scale 4 and mark 6 will change to indicate the correction required. The scale may be on ...

METHOD AND APPARATUS FOR MAINTAINING ELECTRICALLY OPERATING DEVICE TEMPERATURES

MIXING APPARATUS FOR COLD AND WARM WATER

THERMALSTATICALLY STEERED MIXING FAUCET

Thermostatic transmitter

For temperature-control valves or in order to influence the same by means of remote control, for example for radiator valves, a thermostatic transmitter is provided. This transmitter substantially comprises an inelastic vessel 1 having a compressible bellows 3 and a piston 6 for carrying out the control movements. The space between the vessel 1 and the bellows 3 is closed hermetically and filled with a medium with a good coefficient of thermal expansion. Wax or a wax mixture is used as the medium 2 between vessel 1 and bellows 3. The bellows 3 is composed of plastic, in particular of acetal plastic, and is preferably formed by blow-moulding. ...

THERMALSTATIC MIXING VALVE

Temperature feeling arrangement

THERMALSTATIC MIXING VALVE WITH FLOW DIVERSON

AUTOMATIC BATH TUB FILLING DEVICE

THERMALSTATICALLY STEERED MIXING VALVE

THERMALSTATIC GIVER

CONTROL LEVER FOR SWITCHING DEVICES

THERMOSTAT VALVE FOR WARM WATER HEATING ELEMENTS

THERMOSTAT VALVE, IN PARTICULAR RADIATOR VALVE

THERMOSTAT VALVE

REGULATING VALVE, IN PARTICULAR THERMALSTATICALLY REGULAR VALVE

ADJUSTMENT OF AN ELECTRICAL INSULATION SLEEVING ON A TEMPERATURE LIMITER

MIXING APPARATUS FOR COLD AND WARM WATER

FLUESSIKGEITSAUSDEHNUNGSTHERMOSTAT OR TEMPERATURE REGULATORS WITH SAFETY DEVICE

THERMOSTAT RADIATOR VALVE

THERMALSTATICALLY STEERED MIXING VALVE

TEMPERATURE REGULATOR

REGULATING VALVE

AMBIENT TEMPERATURE THERMOSTAT, WHICH IS INTENDED BY CENTRAL HEATING PLANTS TO INSTALLATION WITH RADIATORS

RADIATOR VALVE

THERMALSTATIC MIXING VALVE.

RULE DEVICE WITH TWO FLOW-STEERED EXITS.

POSITION DEVICE FOR A MIXING VALVE.

HEATING SYSTEM WITH HEAT STORAGE.

SANITARY MIXING TAP.

STEAM WATER MIXER.

MIXING TAP WITH THERMALSTATIC REGULATION

VALVE FOR HEATER, WARM WATER OR COOLING SYSTEMS

THERMOSTAT VALVE WITH PRE-SETTING OF THE FLOW RATE

TEMPERATURE-STEERED 3-WEGE-LEITUNGSVENTIL WITH MANIPULATION BY a MEMORY ALLOY

WATER CIRCULATION UNIT

SANITARY FITTING

PROCEDURE AND DEVICE FOR THE THERMALSTATIC REGULATION OF A FLOW DIRECTION

THERMALSTATIC MIXING APPARATUS WITH A MIXTURE MIX DEVICECMIXTURE DEVICE

THERMALSTATICALLY STEERED MIXING VALVE FOR KALT-UND WARM WATER

VALVE, IN PARTICULAR THERMOSTAT VALVE FOR HEATING SYSTEMS

Thermostat-steered mixing valve

Mixing apparatus for warm and cold liquids

VALVE FOR HEATING SYSTEMS

GAS HEATER

SANITARY MIXING TAP.

ELECTRICALLY STEERED MIXING FAUCET.

Thermalstatically steered steam water arrester

THERMALSTATIC MIXING VALVE

THERMALSTATICALLY REGULAR MIXING VALVE

THERMALSTATIC MIXING FAUCET FOR SANITARY PLUMBINGS

Valve with essay for a thermalstatic operating system

DEVICE FOR REVERSIBLE ADJUSTING OF A TAPPET

Expansion body for a thermalstatic rule device for one or more liquid or gaseous media

Thermalstatically operated valve

SANITARY MIXING TAP WITH THERMOSTAT REGULATION

MIXING VALVE

Automatically, in particular thermalstatically steered valve

Thermally steered steam trap

THERMOSTAT VALVE HEAD FOR HEATING SYSTEMS

ELECTRONIC MODULE WITH SELF-ACTIVATED HEAT PIPE

ELECTRONIC MODULE WITH SELF-ACTIVATED HEAT PIPE A plurality of heat pipes extend longitudinally through a unitary or segmented circuit card module, terminating at both ends in cavities formed along lateral edges of the module. In one embodiment, bellows extend outwardly from the cavities in a direction normal to the plane of the module, terminating in interface plates which extends along the respective lateral edges of the module. In another embodiment, upstanding pillars are connected to bellows covering the cavities. Electronic components are mounted on a circuit card applied to a face of the module. The module is loosely received between opposed liquid cooled surfaces of guiderails in a circuit card rack. Heat from the components is communicated through the card to the heat pipes, increasing the pressure within the pipes to urge the interface plates or pillars into variable pressure contact with the guiderails. The pressure is sufficient to snugly hold the module in the rack. The thermal ...

WATER TEMPERATURE MANAGEMENT SYSTEM

A system for the regulation of water supply temperature, particularly in a domestic setting where multiple users are connected to a common water supply. The system comprises a water mixing chamber with separate inlets for hot water and cold water from a hot water chamber and a cold water chamber respectively, and an outlet for the mixed water. The system includes a pressure regulating device comprising a pressure release valve connected to the water mixing chamber and the outlet. When the pressure at either the hot water inlet or the cold water inlet of the mixing chamber decreases, a portion of the mixed water about to exit the outlet is recirculated to the mixing chamber by the pressure release valve of the pressure regulating device; the temperature in the water mixing chamber is thus maintained within a desired temperature range.

HEATING DEVICE WITH A PHASE CHANGE TEMPERATURE CONTROLLER

HEATING DEVICE WITH A PHASE CHANGE TEMPERATURE CONTROLLER A heating device demonstrating an improved temperature control and a method of main taining a steady-state temperature at an essentially constant value are disclosed. The heating device comprises a thermally-conductive chamber containing a material capable of undergoing a phase change at or near the desired steady-state temperature. The heating device is useful in a variety of applications, and especially applications requiring the maintenance of a steadystate temperature over relatively long time periods, such as in diagnostic assays of biological fluids, like the hemoglobin AlC (HbAlc) assay of whole blood. MS-1594 ...

Anordnung zum Einstellen mehrerer, vom gleichen Bezugswert abhängiger Organe

Verfahren zum schnellen Aufheizen und anschliessenden Temperaturkonstanthalten eines Körpers

Anordnung zum Stabilisieren der Temperatur einer geheizten Fläche

Automatic temperature regulating device - for use during heat treatment of synthetic yarns

Temp. regulating appts., whereby the temps. of the appts. is maintained at a constant by regulating a heat transfer medium vapour, includes a number of pressure sensing bellows which communicate via thin tubes with heating vessels. Each pressure sensing bellows has a lever for actuating a micro switch. Counter bellows are coupled to the pressure sensing bellows in an opposed relationship and each counter bellows communicates with one common constant pressure chamber. The pressure in the counter bellows is regualted as a whole by varying the pressure in the common constant pressure chamber. As the pressure in the counter bellows varies the temperature of the heating vessels as a whole is regulated.

Temperature sensitive control device for spacecraft - uses medium filled Bourdon spiral with medium container as temperature probe

A control device with a hollow space, filled with a medium to expand and contract as a function of the temperature, is intended for use as a rotary drive of a diaphragm for the temperature control inside spacecraft and has a faster response and is insensitive against gross overloads. The container (1) for the medium is used as a temperature probe. The drive (3) with the Bourdon spiral (7) is connected to the container (1) by pipes (9, 10). A compensator (15) forms a cavity (24) with metal bellows (25); one end wall (29) rests in the normal position on stops (32) of an insert (28), urged by springs (26, 27).

Method and appliance for carrying out a chemical process

THERMOSTAT VALVE.

MIXING TAP WITH THERMALSTATICALLY STEERED VALVES.

DEVICE FOR THE ADJUSTMENT OF THE WATER TEMPERATURE OF A CENTRAL HEATING PLANT.

THERMALSTATIC GIVER AND PROCEDURE FOR ITS PRODUCTION.

THERMALSTATIC CONTROL GOVERNOR.

THERMALSTATICALLY STEERED MIXING VALVE FOR COLD AND WARM WATER.

MIXTURE UNIT WITH TWO TOGETHER OPERATE-CASH VALVES.

SANITARY INSTALLATION WITH AT LEAST ONE TAX ARMATURE AND SEPARATE WATER OUTPUT UNIT.

MECHANISM FOR THE REGULATION OF THE PROPORTIONATE SUPPLY DIFFERENT OF KEEPING AT A MODERATE TEMPERATURE INDUSTRIAL WATER THROUGHPUT.

Thermostatic valve for radiator, has pipe with alternator driven by flow of heating fluid, and digital control unit mounted either on hot water pipe or at distance from radiator to control opening of valves based on ambient temperature

The valve has a pipe (2) with an alternator (1) driven by flow of heating fluid (50) and a motor (3) that are integrated in a portion of the pipe to produce electricity from fluid. Valves (33, 34) control flow of the fluid through the pipe. A microcontroller and a digital control unit control opening of the valves based on ambient temperature. The control unit is mounted either on a hot water pipe or at a distance from a radiator.

THERMOSTATIC MIXING DEVICE FOR HOT AND COLD WATER.

THERMALSTATICALLY CONTROLS UNTERPUTZARMATUR.

THERMALSTATICALLY STEERED MIXING TAP.

Thermostat valve.

РЕГУЛЯТОР ТЕМПЕРАТУРЫ

Регулятор температуры содержит корпус с входными и выходным каналами и установленный в нем подпружиненный стакан с окнами, в котором размещен термобаллон со штоком, заполненный термочувствительной средой.

СПОСОБ И СИСТЕМА АВТОМАТИЧЕСКОГО УПРАВЛЕНИЯ ГОРЕНИЕМ В ПЕЧИ

Предметом изобретения являются способ и система автоматического управления горением в печи по отношению к измеренному содержанию свободного кислорода и окиси углерода в отработанных (дымовых) газах, до определенной концентрации свободного кислорода в отработанных газах, которая определяется на основании измеренной и заданной предельно допустимой концентрации окиси углерода с компенсацией возмущений, вызванных изменениями в потоке топлива.

ТЕРМОЧУТЛИВИЙ РЕГУЛЯТОР ПОТОКУ РІДИНИ

Винахід належить до теплотехніки й холодильної техніки, зокрема до пристроїв розподілу й регулювання потоку рідини в системах охолодження або термостабілізації. Термочутливий регулятор потоку рідини має корпус із патрубками вхідного і вихідного контурів, в якому розташовані підпружинений розподільний золотник з розміщеним в ньому керуючим золотником і термочутливий привідний вузол. Розподільний золотник має зовнішню кільцеву проточку для протікання рідини. Його торцеві стінки сполучені з робочою й зливною порожнинами корпусу відповідно. Термочутливий привідний вузол контактує з керуючим золотником і сполучений з потоком рідини, температура якої регулюється. Керуючий золотник підпружинений і забезпечений системою каналів для з'єднання робочої порожнини корпусу з кільцевим каналом розподільного золотника або зливною порожниною. Робочими елементами термочутливого привідного вузла можуть бути пакети біметалевих дисків. В одному пакеті встановлюють біметалеві диски з однаковою температурою спрацьовування ...

РЕГУЛЯТОР ТЕМПЕРАТУРЫ ПРЯМОГО ДЕЙСТВИЯ

Заявлен регулятор температуры прямого действия. Винт настроечного элемента посредством резьбового соединения связан с гайкой, размещенной внутри втулки, на цилиндрической поверхности которой выполнены наклонные пазы. В пазах размещены штифт и стержень крана, закрепленные на гайке. Регулятор снабжен сигнализатором, выполненным в виде штока, закрепленного на дне стакана, и электроконтактов, размещенных вне корпуса.

Customized thermal interface to optimize mechanical loading and thermal conductivity characteristics

A method, system, and apparatus for cooling one or more devices through use of a cooling plate. An example system includes multiple heat generating devices coupled to a cooling plate, each through an individual thermal interface unit. The thermal interface unit includes a compressible solid pad with at least one surface having a plurality of projections carrying a flowable material. The thermal interface units are pressed between the heat generating devices and the cooling plate so that the flowable material is completely enclosed.

VARIABLE THERMAL INSULATION

A device for selectively controlling the passage of thermal energy therethrough by selectively varying the overall thermal conductivity of the device comprises a structure having at least one component movable from a first position to a second position. When the at least one component is positioned in the first position the device exhibits a first thermal conductivity and when the at least one component is positioned in the second position the device exhibits a second thermal conductivity different than the first thermal conductivity. 1. A device for selectively controlling the passage of thermal energy therethrough by selectively varying the overall thermal conductivity of the device , the device comprising:a structure having at least one component movable from a first position to a second position, wherein when the at least one component is positioned in the first position the device exhibits a first thermal conductivity and when the at least one component is positioned in the second position the device exhibits a second thermal conductivity different than the first thermal conductivity.2. The device of wherein the structure comprises a number of thermally conductive pathways adapted to be disposed between the first space and the second space claim 1 , wherein each pathway of the number of thermally conductive pathways are selectively interruptible by movement of the at least one component such that the overall thermal conductivity of the device is selectively variable between the first thermal conductivity and the second thermal conductivity.3. The device of wherein the structure comprises:a first plate member having a number of fins extending therefrom; anda second plate member having a number of fins extending therefrom, a first position in which the number of fins of the first plate member contact the number of fins of the second plate member creating the number of thermally conductive pathways, and', 'a second position in which the number of fins of the first ...

METHOD FOR SETTING THE VOLUMETRIC FLOW RATE OF A HEATING AND/OR COOLING MEDIUM BY MEANS OF ROOM HEAT EXCHANGERS OF A HEATING OR COOLING SYSTEM

Room heat exchangers of varying priority are provided by setting the volumetric flow rate of a medium by means of the room heat exchangers of a heating or cooling system. A target spread of the flow and return temperatures for each individual room heat exchanger(s) is set by fixably or adjustably limiting the respective room heat exchanger valve(s). A system-specific target spread for high-priority room heat exchangers is a basis to allow a lower target spread and a higher target spread is ensured given low-priority room heat exchangers. When operating in a high-priority room heat exchanger with a lower spread, the volumetric flow through at least one low-priority room heat exchanger with a higher spread is changed in such a way that a return temperature optimized for the heating device of the heating system is set by mixing the return medium from all room heat exchangers of the heating system. 1. A method for setting the volumetric flow rate of a heating and/or cooling medium by means of room heat exchangers of a heating or cooling system , in which the target spread of the flow and return temperatures for the individual room heat exchangers is in each case set by limiting the respective room heat exchanger valve in an adjustable and/or fixable manner , characterized in that room heat exchangers of varying priority are defined , wherein a system-specific target spread for high-priority room heat exchangers is used as the basis to allow a lower target spread , and a higher target spread is ensured given low-priority room heat exchangers , and that , during the operation of a high-priority room heat exchanger with a lower spread , the volumetric flow through at least one low-priority room heat exchanger with a higher spread is changed in such a way that a return temperature optimized for the heating device of the heating system is set by mixing the return medium from all room heat exchangers of the heating system.2. The method according to claim 1 , characterized in ...

FLOW REGULATOR DEVICE

A fluid flow regulator of the present invention comprises in combination a stationary hollow duct housing having a first end and a second end through which fluid flows. The device also incorporates a movable member aligned concentric with the duct having an end essentially similarly shaped and sized to the first end of the housing. The member may be spaced apart from the duct so that fluid can enter the duct housing through an opening defined by the space between the end of the member and the first end of the duct, with the movement of the member serving to change the size of opening. The movement of the member is controlled by the movement of a float located within the duct. The position of the float can be preset by the operator of the invention so that when fluid flow into the duct is at a predetermined amount the float will remain stationary, and when the fluid flow increases above such predetermined level the float will be moved in the direction of the fluid flow and when fluid flow into the duct is below said predetermined amount, the float will move the member opposite the direction of fluid flow. 1. A device for regulating fluid flow comprising(a) a stationary duct having a first end and a second end, said duct defining a path for fluid flow therethrough from said first end to said second end;(b) a movable having an forward end essentially similarly shaped and sized to the first end of the duct, said forward end being spaced apart from said first end to form an opening through which fluid can enter the duct, with the member being movable relative to the duct between a fully retracted position where the opening is at a maximum size and a forward position at which the forward end is adjacent to said first end and the opening is at a minimum size or is closed, and all positions intermediate;(c) wherein the movement of the member is controlled by the movement of a float located within the duct which is impacted by the flow of fluid through the duct.2. (canceled) ...

METAL INJECTION MOLDED HEAT DISSIPATION DEVICE

A heat dissipation device is provided. The heat dissipation device includes an integrated heat spreader and a base plate coupled to the integrated heat spreader, wherein the base plate comprises a plurality of metal pellets to dissipate heat from the integrated heat spreader. 1. A heat dissipation device , comprising:an integrated heat spreader; anda base plate coupled to the integrated heat spreader, wherein the base plate comprises a plurality of metal pellets to dissipate heat from the integrated heat spreader.2. The heat dissipation device of claim 1 , wherein the base plate comprises a metal injection molded plate having a plurality of copper pellets.3. The heat dissipation device of claim 1 , wherein the base plate comprises a metal injection molded plate having a plurality of aluminum pellets.4. The heat dissipation device of claim 1 , wherein a porosity of the plurality of metal pellets is between about 10% and about 50%.5. The heat dissipation device of claim 1 , wherein a size of each of the plurality of metal pellets is between about 20 microns and 400 microns.6. The heat dissipation device of claim 1 , further comprising inlet and outlet hose couplings coupled to the base plate claim 1 , wherein the inlet and outlet hose couplings are to circulate a coolant fluid through the plurality of metal pellets of the base plate.7. The heat dissipation device of claim 6 , wherein the inlet and outlet hose couplings are coupled to the base plate through threaded hose connectors.8. The heat dissipation device of claim 6 , wherein the inlet and outlet hose couplings are coupled to the base plate through soldered hose connectors.9. The heat dissipation device of claim 6 , further comprising a sealant material disposed adjacent to the base plate to substantially prevent leakage of the coolant fluid from the base plate.10. The heat dissipation device of claim 9 , wherein the sealant material comprises eutectic solder.11. A microelectronic package claim 9 , comprising:a ...

SYNTHETIC JET EMBEDDED HEAT SINK

A system and method for cooling heat-producing devices using synthetic jet embedded heat sinks is disclosed. The cooling system includes a heat sink comprising a base portion and a plurality of fins disposed on the base portion and extending vertically out therefrom, the plurality of fins spaced to define a channel between adjacent fins. The cooling system also includes at least one synthetic jet actuator attached to the heat sink, with each of the at least one synthetic jet actuators comprising a plurality of orifices therein and being configured to generate and project a series of fluid vortices out from the plurality of orifices and toward at least a portion of the channels of the heat sink. 1. A cooling system comprising:a heat sink comprising a base portion and a plurality of fins disposed on the base portion and extending vertically out therefrom, the plurality of fins spaced to define a channel between adjacent fins; andat least one synthetic jet actuator attached to the heat sink, each of the at least one synthetic jet actuators comprising a plurality of orifices therein and being configured to generate and project a series of fluid vortices out from the plurality of orifices and toward at least a portion of the channels of the heat sink;wherein each of the at least one synthetic jet actuators comprises a toroid shaped synthetic jet actuator encircling the heat sink, and wherein the plurality of orifices are dispersed about an inner perimeter of the synthetic jet actuator to project the series of fluid vortices inwardly through the at least a portion of the plurality of channels.2. The cooling device of wherein the plurality of fins are positioned on the base portion to define a hollow central area in the heat sink.3. The cooling device of wherein the at least one synthetic jet actuator comprises a plurality of synthetic jet actuators positioned in a stacked arrangement so as to be vertically offset.4. The cooling device of wherein the plurality of orifices ...

HEAT CONDUCTING DEVICE AND ELECTRONIC DEVICE APPLYING THE SAME

A heat conducting device, comprising a first heat conducting board and a heat conducting structure, the first heat conducting board comprising an upper heat conducting arm provided on one surface of the first heat conducting board, the heat conducting structure slidably abutting against the upper heat conducting arm of the first heat conducting board to form a contact surface through which heat transfer is realized, the heat conducting structure comprising a heat conducting surface, wherein the heat conducting structure is used to keep the relative position between the first heat conducting board and the heat conducting surface, allow the varying of the distance between the first heat conducting board and the heat conducting surface of the heat conducting structure through relative sliding between the upper heat conducting arm and the heat conducting structure. 1. A heat conducting device , wherein ,the heat conducting device comprises a first heat conducting board and a heat conducting structure, the first heat conducting board comprising an upper heat conducting arm provided on one surface of the first heat conducting board, the heat conducting structure slidably abutting against the upper heat conducting arm of the first heat conducting board to form a contact surface through which heat transfer is realized, the heat conducting structure comprising a heat conducting surface, wherein the heat conducting structure is used to keep the relative position between the first heat conducting board and the heat conducting surface, allow the varying of the distance between the first heat conducting board and the heat conducting surface of the heat conducting structure by means of relative sliding between the upper heat conducting arm and the heat conducting structure, and ensure that a contact surface for heat transfer always exists between the upper heat conducting arm of the first heat conducting board and the heat conducting structure.2. The heat conducting device ...

Heat Exchanger for a System for Solidification and/or Crystallization of a Semiconductor Material

Heat exchanger () for a system for solidification and/or for crystallization of a semiconductor material, comprising a first member () and a second member (), the first and second members being movable with respect to each other, characterized in that the first member comprises a first pattern of relief () and the second member comprises a second pattern of relief (), the first pattern of relief being designed to cooperate with the second pattern of relief. 1. Heat exchanger , notably heat exchanger for a solidification and/or crystallization system for a semiconductor material , comprising a first member and a second member , the first and second members being movable with respect to each other , wherein the first member comprises a first pattern of relief and the second member comprises a second pattern of relief , the first pattern of relief being designed to cooperate with the second pattern of relief and in that it comprises an element for displacement of the first member relative to the second member allowing an exchanged heat flux to be controlled.2. Exchanger according to claim 1 , wherein the displacement element comprises a regulator for modulating the distance between the first member and the second member according to the desired exchanged heat flux.3. Exchanger according to claim 2 , wherein the regulator allows the first and second members to be positioned at least two different distances so as to obtain at least two different exchanged heat fluxes or two different exchange coefficients.4. Exchanger according to claim 2 , wherein the regulator allows the distance between the two members to be continuously varied between a first position where an exchange surface area is a minimum and a second position where the exchange surface area is a maximum.5. Exchanger according to claim 1 , wherein the first pattern of relief comprises recesses and protrusions and in that the second pattern of relief comprises recesses and protrusions.6. Exchanger according to ...

HEAT EXCHANGER ASSEMBLY AND USE OF AN APPARATUS IN A HEAT EXCHANGER

A heat exchanger assembly comprises a heat exchanger for heat exchange between at least a first heat exchange fluid and a second heat exchange fluid. The heat exchanger comprises at least one heat transfer element delimiting a first fluid path from a second fluid path, and a through connection for the first heat exchange fluid arranged at a first side portion of an outer structure of the heat exchanger. The assembly comprises a pressure pulse damping apparatus comprising an elastic element, and a first conduit leading to the elastic element. The first conduit comprises a first opening connected to the through connection of the heat exchanger such that the first conduit is fluidly connected with the first fluid path. The elastic element fluidly communicates with the first fluid path only via the first opening. There is further disclosed use of a pressure pulse damping apparatus comprising an elastic element. 1. A heat exchanger assembly comprising a heat exchanger for heat exchange between at least a first heat exchange fluid and a second heat exchange fluid , the heat exchanger comprising at least one heat transfer element delimiting a first fluid path for the first heat exchange fluid from a second fluid path for the second heat exchange fluid inside the heat exchanger , and a through connection for the first heat exchange fluid arranged at a first side portion of an outer structure of the heat exchanger , wherein the assembly comprises a pressure pulse damping apparatus , the apparatus comprising an elastic element , and a first conduit leading to the elastic element , whereinthe first conduit comprises a first opening connected to the through connection of the heat exchanger such that the first conduit is in fluid connection with the first fluid path, and whereinthe elastic element is in fluid communication with the first fluid path only via the first opening.2. The assembly according to claim 1 , wherein the first conduit of the pressure pulse damping apparatus ...

HEAT EXCHANGER

Provided is a heat exchanger. The heat exchanger includes a refrigerant tube through which a refrigerant flows and a fin having at least two tube through holes in which the refrigerant tube is inserted. The fin includes a fin body, a plurality of louvers protruding from a surface of the fin body, a plane part defined between the plurality of louvers, the plane part having a flat surface, and a guide part disposed on at least one side of the plane part to guide a flow of air or discharge of defrosting water. 1. A heat exchanger comprising:a refrigerant tube through which a refrigerant flows; anda fin having a plurality of tube through holes into which the refrigerant tube is inserted,wherein the fin comprises:a fin body;a plurality of louvers protruding from a surface of the fin body;a plane part defined between the plurality of louvers, wherein the plane part has a flat surface; anda guide part disposed on at least one side of the plane part to guide a flow of air or discharge of defrosting water.2. The heat exchanger according to claim 1 , wherein the plane part comprises:a first plane part extending in a direction corresponding to an air flow direction; anda second plane part extending to cross the first plane part.3. The heat exchanger according to claim 2 , wherein the first plane part extends from an end of one side of the fin body to an end of an opposing side of the fin body.4. The heat exchanger according to claim 2 , wherein the second plane part extends from a first tube through hole to a second tube through hole.5. The heat exchanger according to claim 2 , wherein the guide part protrudes from at least one of the first and second plane parts.6. The heat exchanger according to claim 5 , wherein the guide part comprises:a first inclined surface protruding from one surface of the fin body in one direction;a second inclined surface protruding from the one surface of the fin body in an opposing direction; anda tip part connecting the first inclined surface to ...

Air Barrier

A heat transfer inhibitor system to minimize the heat transfer through the structural opening closures with an interior and an exterior panel such as windows, doors and skylights that are the weak links in interior insulation. By moving a stream of constant temperature air through a space between the external panel and the interior panel, the temperature differential between the exterior surface of the internal panel and the interior is minimized thus reducing the load and maintenance costs on heater/AC systems. It also reduces the required size and costs of installations. Minimizing the resistance to flow of air through the system with butted tubing joints secured with plastic straps and molded deflectors at a specific angle enhance the cost effectiveness of the system. 1. A heat transfer inhibitor for a structural opening closure , comprised of:a spacer frame that fits in said structural opening closure with a top wall, a bottom wall, two side walls, an interior side and an exterior side;an exterior panel;an interior panel, where said exterior panel and said interior panel are separated in said spacer frame forming a gap between said interior and exterior panels;a top port that penetrates through said side wall of said spacer frame toward said top wall that opens into said gap;a bottom port that penetrates through said bottom wall of said spacer frame into said gap;a constant temperature air source;a larger diameter tube connects said constant temperature air source to the proximal end of first deflector and is then terminated with a cap;said deflectors are molded as a larger diameter tube of matching diameter to the said larger diameter tube with a smaller diameter tube at a 22½ degree angle to said larger diameter axis;said smaller diameter tube section of said first deflector connects through said smaller diameter tubing and fittings to said top port;smaller diameter tubing and fittings connect said bottom port to 22 ½ degree section of second deflector where ...

Assembly for a Modular Automation Device

An assembly for a modular automation device includes a sensor, which is arranged in a housing capsule of the assembly, for detecting the temperature (T) of the feed air in the housing capsule, where feed air flows through air-inlet openings in the housing capsule, across components, and finally through air-outlet openings in the housing capsule, and includes a monitoring unit for evaluating the temperature (T) that is detected by the sensor such that the feed-air temperature can be determined more accurately by using suitable measures. 1. An assembly for a modular automation device , comprising:a housing capsule having air-inlet openings and air-outlet openings;{'sub': 'det', 'a sensor arranged in the housing capsule of the assembly, said sensor detecting a temperature (T) of feed air in the housing capsule, said feed air flowing through the air-inlet openings in the housing capsule, across components, and through the air-outlet openings in the housing capsule; and'}{'sub': 'det', 'a monitoring unit for evaluating the temperature (T) of the feed air detected by the sensor;'}{'sub': det', 'det, 'wherein at least one reference curve is stored in the monitoring unit, said reference curve representing, for at least one performance parameter, deviations in one of (i) the detected temperature (T) of feed air in the housing capsule and (ii) a reference temperature, which is associated with the detected temperature (T), as a function of one of (i) a heat-up time and (ii) a cool-down time of the assembly; and'}{'sub': z', 'det', 'a, 'wherein the monitoring unit is configured to determine the feed-air temperature (T) from one of (i) the detected feed-air temperature (T) and (ii) the reference temperature and the time-dependent temperature deviation (T) via the reference curve.'}4. The modular automation device having a plurality of assemblies arranged on a support as claimed in . 1. Field of the InventionThe invention relates to an assembly for a modular automation device, ...

Thermostat Classification Method and System

The disclosure provides a computer-implemented method and system of reducing commodity usage by providing tailored consumer information to the consumer. The method utilizes neural network and machine learning techniques to calculate and cluster statistical data to classify the premises for desired observable condition, including the presence of a programmed thermostat. A score is determined that corresponds to at least one of: (i) a present state of an observable condition, (ii) a non-present state of the observable condition, and (iii) a degree of a condition of the observable condition, to provide tailored consumer information associated to the consumer's usage of the commodity. 1. A computer-implemented method of reducing commodity usage by providing tailored consumer information to a consumer , the computer-implemented method comprising:receiving energy usage data of a consumer associated to a premises, the premises having a controller to regulate temperature in a controlled space within the premises, the energy usage data being associated, in part, to the regulation of the controller;determining, via a processor, a status of whether the controller adjusts the temperature according to a time-of-day dependent setting, the status-determination being based on the received energy usage data; andproviding tailored consumer information based on the determined status, the information being associated to the consumer's usage of the commodity.2. The computer-implemented method of claim 1 , wherein determining the status of whether the controller adjusts the temperature according to a time-of-day dependent setting includes:comparing a first statistical feature derived from the received energy usage data to a second statistical feature derived from at least one representative pattern of a premises with a controller that adjusts the temperature according to a time-of-day dependent setting.3. The computer-implemented method of claim 1 , wherein providing tailored consumer ...

THERMALLY CONDUCTIVE LIQUID PACK

Provided is a thermally conductive liquid pack including a liquid thermal conductive material and a hollow pliable outer package filled with the liquid thermal conductive material, the pliable outer package having a first contact surface and a second contact surface different from the first contact surface and being in a closed state, the pliable outer package including a first sheet including the first contact surface, a second sheet including the second contact surface and disposed opposite to the first sheet, the first sheet and the second sheet including a plurality of fine discharge holes capable of discharging the thermal conductive material, a release sheet configured to seal the discharged holes from the outside being releasably layered on the first sheet and the second sheet, and the second sheet including a third sheet formed from a non-woven fabric or mesh in the inside thereof. 1. A thermally conductive liquid pack comprising:a thermally conductive material in a liquid state; anda hollow pliable outer package, the hollow pliable outer package being filled with the liquid thermal conductive material,wherein the hollow pliable outer package includes a first contact surface and a second contact surface different from the first contact surface and is in a closed state.2. The thermally conductive liquid pack according to claim 1 ,wherein the hollow pliable outer package includes a first sheet including the first contact surface, a second sheet including the second contact surface and disposed opposite to the first sheet, and a release sheet,at least one of the first sheet and the second sheet includes a plurality of fine discharge holes capable of discharging the thermal conductive material, andthe release sheet is configured to seal the plurality of fine discharged holes from the outside and is releasably layered on the at least one of the first sheet and the second sheet.3. The thermally conductive liquid pack according to claim 1 ,wherein the hollow ...

HEAT EXCHANGER CLOSURE BAR WITH SHIELD

A heat exchanger for managing thermal energy between a flow of a first fluid and a flow of a second fluid includes first and second parting sheets and a closure bar extending between the first and second parting sheets. The closure bar includes an elongate body, a shield positioned upstream from the body relative to a direction of the flow of the first fluid, and a support connecting the shield to the closure bar. 1. A heat exchanger for managing thermal energy between a flow of a first fluid and a flow of a second fluid comprising:a first parting sheet;a second parting sheet; and an elongate body;', 'a shield positioned upstream from the body relative to the hot flow direction; and', 'a support connecting the shield to the closure bar., 'a closure bar extending between the first and second parting sheets, wherein the closure bar comprises2. The heat exchanger of claim 1 , wherein the elongate body comprises:a first surface that faces towards the flow of the first fluid; anda second surface on an opposite side of the body from the first surface.3. The heat exchanger of claim 2 , wherein a first portion of the support is connected to and extends from the first surface of the closure bar claim 2 , wherein a second potion of the support is connected to and extends from the shield.4. The heat exchanger of claim 1 , wherein the shield is spaced from the body by a gap.5. The heat exchanger of claim 1 , wherein the shield comprises a plurality of shield portions.6. The heat exchanger of claim 5 , wherein each shield portion of the plurality of portions is separated from an adjacent shield portion by an opening in the shield.7. The heat exchanger of claim 6 , wherein the opening in the shield is angled relative to the hot flow direction.8. The heat exchanger of claim 1 , wherein the support comprises a cylindrical claim 1 , cuboid claim 1 , or spherical shape claim 1 , and wherein the support comprises a height that is less than a height of the shield and less than a height ...

PASSIVE AND COMPACT LIQUID METAL HEAT SWITCH

A passive heat switch device is disclosed that includes a casing defining a closed channel, as well as a passive thermal actuator and liquid slug positioned inside the closed channel. The closed channel includes a heat conducting region made of a heat conducting material and an insulating region made of an insulating material. The passive thermal actuator is thermally coupled to the heat conducting material of the heat conducting region and extends into the insulating region of the closed channel. The passive thermal actuator deforms when an actuator temperature falls within a switching temperature range. The liquid slug is positioned within the closed channel and contacts at least a portion of the passive thermal actuator and the closed channel and is configured to move along the closed channel between the insulating region and the thermally conductive region in response to deformation of the passive thermal actuator. 1. A passive heat switch device , comprising: i. the heat conducting region comprises a first portion of the upper and lower sides comprising a heat conducting material; and', 'ii. the insulating region comprising a second portion of the upper and lower sides each comprising the insulating material;, 'a. a casing comprising a pair of opposed lateral sides comprising an insulating material and opposed upper and lower sides, the lateral sides, upper side, and lower side defining a closed channel, the closed channel comprising a heat conducting region and an insulating region, whereinb. a passive thermal actuator thermally coupled to the first portion of the upper side and extending into the insulating region of the closed channel, the passive thermal actuator configured to deform when an actuator temperature of at least a portion of the passive thermal actuator falls within a switching temperature range defined between a minimum switching temperature and a maximum switching temperature; andc. a liquid slug positioned within the closed channel, the ...

Cooling structure and parallel plate etching apparatus

A cooling structure includes a cooling target member; a cooling plate including a cooling mechanism, the cooling plate being configured to cool the cooling target member; and a clamp configured to hold the cooling plate. The cooling plate includes a spherical portion having a spherical surface facing the cooling target member and having a center portion that bulges toward the cooling target member with respect to a peripheral edge portion, and a flat portion provided outside the spherical portion so that the spherical portion is thicker than the flat portion. The clamp is configured to apply at least a predetermined pressure only to the spherical portion through a surface of the cooling target member facing the cooling plate.

COVER FOR HEAT SOURCE

A cover for a heat source according to an exemplary aspect of the present disclosure includes, among other things, a first portion covering at least a portion of the heat source, and a second portion including a first latch and a second latch. Each of the first and second latches are configured to engage a fluid conduit. An assembly is also disclosed. 1. A cover for a heat source , comprising:a first portion covering at least a portion of the heat source; anda second portion including a first latch and a second latch, each of the first and second latches configured to engage a fluid conduit.2. The cover as recited in claim 1 , wherein the first and second latches have a contour corresponding to an outer contour of the fluid conduit.3. The cover as recited in claim 2 , wherein the first and second latches are generally U-shaped.4. The cover as recited in claim 1 , wherein the first and second latches each include first and second deflectable projections.5. The cover as recited in claim 4 , wherein claim 4 , when the fluid conduit is engaged with the first and second latches claim 4 , the first and second deflectable projections are biased toward the fluid conduit.6. The cover as recited in claim 1 , wherein:the cover includes a pilot opening configured to align with a boss projecting from a structure adjacent the heat source; anda fastener extends through the pilot opening to connect the cover to the boss.7. The cover as recited in claim 1 , wherein a contour of the cover adjacent the second portion includes a sunken portion to allow tool access between the fluid conduit and heat source.8. The cover as recited in claim 1 , wherein:the second portion of the cover includes first, second, and third latches; andthe first and second latches engage a first fluid conduit, and the third latch engages a second fluid conduit.9. The cover as recited in claim 1 , wherein the cover is formed integrally as a single piece of material.10. The cover as recited in claim 9 , wherein ...

SUPPLY AND EXTRACTION OF TUBE FLOWS AT INTERMEDIATE TEMPERATURE IN HELICALLY COILED HEAT EXCHANGERS

A heat exchanger for the indirect exchange of heat between a first fluid and a second fluid, the heat exchanger having a casing surrounding a casing chamber that accommodates the first fluid. A core tube may extend within the casing. A tube bundle is arranged in the casing chamber and has multiple tubes to accommodate the second fluid. The tubes are helically wound around a longitudinal axis of the chamber or around the core tube in a coil region extending from a lower coil end to an upper coil end. At least one tube is coiled only in a section of the coil region. Outside of the section of the coil region the at least one tube extends as a straight tube to the lower coil end, the upper coil end, or to both the lower coil end and the upper coil end. 1. A heat exchanger for the indirect exchange of heat between a first fluid and a second fluid , the heat exchanger comprising:a casing extending along a longitudinal axis and surrounding a casing chamber, the casing chamber for accommodating the first fluid;a tube bundle arranged in the casing chamber, the tube bundle having multiple tubes for accommodating the second fluid;wherein in a coil region extending along the longitudinal axis, the tubes of the tube bundle are helically coiled around the longitudinal axis from a lower coil end to an upper coil end;wherein at least one tube of the tube bundle is coiled around the longitudinal axis in only a section of the coil region; andwherein the at least one tube extends as a straight tube below the section of the coil region along the longitudinal axis to the lower coil end; orwherein the at least one tube extends as a straight tube above the section of the coil region along the longitudinal axis to the upper coil end; orwherein the at least one tube extends as a straight tube below the section of the coil region along the longitudinal axis to the lower coil end and as a straight tube above the section of the coil region along the longitudinal axis to the upper coil end.2. ...

CONTROLLABLE MAGNETORHEOLOGICAL FLUID TEMPERATURE CONTROL DEVICE

Apparatus for controlling heat transfer between two objects. In one embodiment, The apparatus includes a first and second conductive elements, a container of magnetorheological fluid disposed between the first and second conductive elements, an electromagnet disposed about the container, wherein the electromagnet is configured to produce a magnetic field within the container of magnetorheological fluid and conductively couple the first and second conductive elements, and at least one biasing element wherein the biasing element is coupled to the first conductive element and is configured to move the first conductive element relative to the container to conductively couple and uncouple the first conductive element and the second conductive element. 1. An apparatus for controlled heat transfer , comprising:a first and second conductive elements;a container of magnetorheological fluid disposed between the first and second conductive elements;an electromagnet disposed about the container, wherein the electromagnet is configured to produce a magnetic field within the container of magnetorheological fluid and conductively couple the first and second conductive elements; andat least one biasing element, wherein the biasing element is coupled to the first conductive element and is configured to move the first conductive element relative to the container to conductively couple and uncouple the first conductive element and the second conductive element.2. The apparatus of claim 1 , wherein the electromagnet comprises a solenoid disposed around the container of magnetorheological fluid.3. The apparatus of claim 1 , wherein the container holding the magnetorheological fluid is flexible.4. The apparatus of claim 1 , wherein control of a current through the electromagnet affects an alignment of particles in the magnetorheological fluid and affects heat transfer between the first and second conductive elements.5. The apparatus of further comprising:a second biasing element coupled ...

CONTROLLABLE MAGNETORHEOLOGICAL FLUID TEMPERATURE CONTROL DEVICE

Method for controlling heat transfer between two objects. In one embodiment, the method includes providing a first current through a first electromagnet disposed about a container holding magnetorheological fluid to generate a first magnetic field such that particles in the magnetorheological fluid align with the first magnetic field to conductively couple a first conductive element to a second conductive element; and providing a second current through a second electromagnet disposed perpendicular to the first electromagnet to generate a second magnetic field perpendicular to the first magnetic field such that the particles in the magnetorheological fluid align with the second magnetic field to conductively uncouple the first conductive member from the second conductive member. 1. A method of controlling heat transfer , the method comprising:providing a first current through a first electromagnet disposed about a container holding magnetorheological fluid to generate a first magnetic field such that particles in the magnetorheological fluid align with the first magnetic field to conductively couple a first conductive element to a second conductive element; andproviding a second current through a second electromagnet disposed perpendicular to the first electromagnet to generate a second magnetic field perpendicular to the first magnetic field such that the particles in the magnetorheological fluid align with the second magnetic field to conductively uncouple the first conductive member from the second conductive member.2. The method of claim 1 , wherein controlling the first current provided to the first electromagnet controls an amount of heat transferred.3. The method of claim 1 , wherein the first current is reduced in combination with providing the second current through the second electromagnet to conductively uncouple the first conductive element from the second conductive element.4. The method of claim 3 , wherein the first current is reduced to zero.5. The ...

CONTROLLABLE MAGNETORHEOLOGICAL FLUID TEMPERATURE CONTROL DEVICE

Method for controlling heat transfer between two objects. In one embodiment, the method includes flowing a current through an electromagnet disposed about a container holding magnetorheological fluid to bias a first conductive element against a first end of the container and a second conductive element against a second end of the container to align particles in the magnetorheological fluid such that first conductive element is conductively coupled to the second conductive element; and reducing the current through an electromagnet such that the first conductive element is biased away from the first end of the container and the second conductive element is biased away from the second end of the container to break the alignment of the particles in the magnetorheological fluid such that the first conductive element is not conductively coupled to the second conductive element. 1. A method of controlling heat transfer , the method comprising:flowing a current through an electromagnet disposed about a container holding magnetorheological fluid to bias a first conductive element against a first end of the container and a second conductive element against a second end of the container to align particles in the magnetorheological fluid such that first conductive element is conductively coupled to the second conductive element; andreducing the current through an electromagnet such that the first conductive element is biased away from the first end of the container and the second conductive element is biased away from the second end of the container to break the alignment of the particles in the magnetorheological fluid such that the first conductive element is not conductively coupled to the second conductive element.2. The method of claim 1 , wherein flowing a current through an electromagnet disposed about a container holding magnetorheological fluid induces stress in a first biasing element to bias a first conductive element and in a second biasing element to bias the ...

APPARATUS AND METHOD FOR ANALYZING A FLOW OF MATERIAL

An apparatus and method for analyzing a flow of material having an inlet region, a measurement range and an outlet region, and having a first diverter and a second diverter, and a deflection area, wherein in a first state of operation, the two diverters form a continuous first material flow space from the inlet region via the first diverter through the measurement range, via the second diverter to the outlet region, and in a second state of operation, form a continuous second material flow space from the inlet region via the first diverter through the deflection area, via the second diverter to the outlet region. 1. An apparatus for the analysis of a material flow , the apparatus comprising:a material flow space;an inlet region;a measurement range designed for measuring properties of the material flow;an outlet region;a first diverter disposed between the inlet region and the measurement range;a second diverter arranged between the measurement range and the outlet region; and in a first state of operation of the first diverter and the second diverter, a continuous first material flow space is formed from the inlet region via the first diverter through the measurement range via the second diverter to the outlet region, and', 'in a second state of operation of the first diverter and the second diverter, a continuous second material flow space is formed from the inlet region via the first diverter through the deflection area via the second diverter to the outlet region., 'a deflection area of the material flow space that is arranged and configured such that2. The apparatus for analyzing a flow of material according to claim 1 , wherein the first diverter is configured as a first slide diverter that is insertable into the material flow space between the inlet region and the measurement range claim 1 , and the first diverter having a first passage opening for a passage of the flow of material from the inlet region via the first slide diverter into the measurement range ...

OPENING AND CLOSING CONTROL SYSTEM AND OPENING AND CLOSING CONTROL APPARATUS

An opening and closing control system that controls an operation of an inlet port so that an external environment is detected more accurately and opening and closing of the inlet port is controlled more properly is provided. In the ventilation control system, an internal environment sensor detects an internal environment of a casing, and an external environment sensor is disposed apart from the casing without being in contact with the casing and detects an external environment of the casing which corresponds to the internal environment. Then, a calculation unit obtains the internal environment and the external environment detected by the internal environment sensor and the external environment sensor, and controls opening and closing of a ventilation port in response to difference between the internal environment and the external environment. According to the ventilation control system, the external environment sensor can be less susceptible to an effect of the presence of the casing when detecting the external environment, and can detect the external environment with high accuracy. Accordingly, opening and closing of the ventilation port can be controlled in an appropriate manner. 1. An opening and closing control system that controls an operation of an inlet port which is formed on a casing so as to be openable; the opening and closing control system comprising:an internal environment detecting section that detects an internal environment of the casing;an external environment detecting section that is disposed apart from the casing without being in contact with the casing and detects an external environment of the casing which corresponds to the internal environment of the casing;an environment acquiring section that obtains the internal environment and the external environment detected by the internal environment detecting section and the external environment detecting section; andan opening and closing control section that controls opening and closing of the ...

Thermostatic cartridge for regulating hot and cold fluids to be mixed

A cartridge comprising a slide valve for regulating the temperature of a mixture of hot and cold fluids is provided. The slide valve is, under the action of a thermostatic element and with respect to an external casing of the cartridge, movable along the central axis of the casing so as to inversely vary the respective cross sections of flow of a cold-fluid inlet and a hot-fluid inlet. Therefore the cartridge can, in an economical and easy manner, regulate high flows of hot fluid and/or cold fluid. The slide valve delimits externally a groove for channelling hot fluid, which can distribute the supply of hot fluid from the hot-fluid inlet over the entire external periphery of the slide valve, and/or a groove for channelling cold fluid which can distribute the supply of cold fluid from the cold-fluid inlet over the entire external periphery of the slide valve.

HEAT SINK AND SUBSTRATE UNIT

A heat sink includes: a fixing unit fixed to a heating element; and a heat dissipation unit including a heat dissipation protruding portion and configured to slide with respect to the fixing unit. 1. A heat sink comprising:a fixing unit fixed to a heating element; anda heat dissipation unit including a heat dissipation protruding portion and configured to slide with respect to the fixing unit.2. The heat sink of claim 1 , wherein the fixing unit is fixed to be superimposed on the heating element claim 1 , and the heat dissipation unit slide in an intersecting direction with respect to a direction in which the fixing unit is superimposed on the heating element.3. The heat sink of claim 2 , wherein the heat dissipation unit includes a main body superimposed on the fixing unit claim 2 , and the heat dissipation protruding portions are vertically provided on the main body.4. The heat sink of claim 3 , wherein the heat dissipation protruding portions are formed on one side of the main body in the intersecting direction.5. The heat sink of claim 1 , wherein at least one groove which extends in an intersecting direction is formed in one of the fixing unit and the heat dissipation unit claim 1 , and at least one projecting portion inserted into the groove is formed on the other of the fixing unit and the heat dissipation unit.6. The heat sink of claim 5 , wherein the groove and the projecting portion are formed in tapered shapes in which a width is decreased from a bottom side of the groove to an opening side of the groove.7. The heat sink of claim 2 , wherein a plurality of fixing holes aligned in a sliding direction of the heat dissipation unit are formed in one of the fixing unit and the heat dissipation unit claim 2 ,one or more communication holes are formed in the other of the fixing unit and the heat dissipation unit to selectively communicate with one of the plurality of fixing holes according to a position where the heat dissipation unit is slid with respect to the ...

Smart thermostat robust against adverse effects from internal heat-generating components

A thermostat may include a plurality of heat-generating components; a plurality of first temperature sensors, each of the plurality of first temperature sensors being disposed next to a corresponding one of the plurality of heat-generating components; a second temperature sensor that is disposed away from the plurality of heat-generating components; and a memory device storing a coefficient matrix. The thermostat may also include one or more processors that combine a plurality of inputs to calculate an ambient temperature for an enclosure in which the thermostat is installed, the plurality of inputs including readings from the plurality of first temperature sensors, readings from the second temperature sensor, and the coefficient matrix.

ACTIVE GAS-GAP HEAT SWITCH WITH FAST THERMAL RESPONSE

An active gas-gap heat switch may significantly reduce the time required to transition between the open and closed states, reduce the heat require to warm the getter, and reduce the heat that leaks from the getter to the switch body. A thermal interface at one end of the active gas-gap heat switch may include a plurality of fins. A getter assembly may be hermetically attached to the thermal interface and a containment tube may surround and house the plurality of fins. 1. An apparatus , comprising:a first thermal interface at one end of the apparatus comprising a plurality of fins;a getter assembly hermetically attached to the first thermal interface; anda containment tube surrounding and housing the plurality of fins.2. The apparatus of claim 1 , further comprising:a second thermal interface at another end of the apparatus comprising a plurality of fins, whereinthe plurality of fins of the first thermal interface are interleaved with the plurality of fins of the second thermal interface such that the fins do not physically touch one another.3. The apparatus of claim 2 , wherein the plurality of fins of the first thermal interface and the plurality of fins of the second thermal interface are alternatingly interleaved such that with the exception of two outermost fins claim 2 , each fin is surrounded by two fins from the opposite thermal interface.4. The apparatus of claim 1 , wherein the getter assembly comprises:a support;bellows positioned inside the support; anda re-entrant tube positioned inside the bellows.5. The apparatus of claim 3 , wherein the re-entrant tube comprises titanium 15333 and the support comprises plastic.6. The apparatus of claim 3 , wherein the bellows and the re-entrant tube are connected via a flanged connection.7. The apparatus of claim 5 , wherein the flanged connection is thermally anchored via a strap to a temperature node that is intermediate between a body temperature of the apparatus and a getter of the getter assembly.8. The apparatus ...

RADIAL FIN HEAT SINK FOR REMOTE RADIO HEADS AND THE LIKE

In one embodiment, an apparatus includes three remote radio heads (RRHs) mounted on a pole using one or more triangular brackets, each RRH connected to a corresponding antenna. Each RRH includes an electronics module, a heat sink mounted on the electronics module, and a cover attached to the heat sink. The heat sink comprises a base, a plurality of attached forward-facing fins, and a pair of backward-facing fins. Each forward-facing fin and backward-facing fin comprises a proximal end attached to the base and an opposite distal end. The proximal ends of the plurality of forward-facing fins are collinear. The distal ends of the plurality of forward-facing fins and the backward-facing fins define an arc of an ellipse. 1. An apparatus comprising a heat sink for an electronics module , wherein:the heat sink comprises a base and a plurality of forward-facing fins;a first side of the base is adapted for mounting to the electronics module;each forward-facing fin comprises (i) a proximal end attached to a second side of the base and (ii) an opposite distal end;the proximal ends of the plurality of forward-facing fins are collinear; andthe distal ends of the plurality of forward-facing fins define an arc of an ellipse.2. The apparatus of claim 1 , wherein:the first side of the base is substantially planar; andthe second side of the base is substantially planar and parallel to the first side.3. The apparatus of claim 1 , wherein the plurality of forward-facing fins is truncatedly disposed on the first side of the base.4. The apparatus of claim 3 , wherein the further a fin of the plurality of forward-facing fins is located from a center line of the first side of the base claim 3 , the shorter is the length of the fin measured from the proximal end to the distal end.5. The apparatus of claim 4 , wherein the plurality of forward-facing fins is also radially disposed on the first side of the base.6. The apparatus of claim 5 , wherein the further a fin of the plurality of forward ...

APPARATUSES, SYSTEMS, COOLING AUGERS, AND METHODS FOR COOLING BIOCHAR

Apparatuses, systems, char cooling augers, and methods for cooling biochar are described. An example system may include a char cooling auger coupled to a gasifier. The char cooling auger including a receiving hopper and an outer tube. The receiving hopper configured to receive and hold biochar from the gasifier. The receiving hopper configured to feed the biochar to a screw conveyor. The screw conveyor configured to rotate to transport the biochar from a first end of the outer tube to an outlet port near a second end of the outer tube. A temperature of the outer tube is less than a temperature of the biochar such that the biochar is cooled as transported through the outer tube prior to collection of the biochar. 1. A system , comprising:a char cooling auger coupled to a gasifier, the char cooling auger comprising a receiving hopper and an outer tube, the receiving hopper configured to receive and hold biochar from the gasifier, the receiving hopper configured to feed the biochar to a screw conveyor extending through the outer tube, the screw conveyor configured to transport the biochar from a first end of the outer tube to an outlet port near a second end of the outer tube, wherein a temperature of the outer tube is less than a temperature of the biochar such that the biochar is cooled as it is transported through the outer tube prior to collection of the biochar in a collection hopper.2. The system of claim 1 , wherein the char cooling auger is coupled to the gasifier via a cyclone configured to separate syngas from the biochar.3. The system of claim 1 , wherein the char cooling auger further comprises a rotation mechanism configured to rotate the screw conveyor to transport the biochar the outlet port.4. The system of claim 3 , wherein the rotation mechanism comprises a motor .5. The system of claim 4 , wherein the motor is directly connected to the screw conveyor via a drive belt or a drive chain.6. The system of claim 3 , further comprising a control system ...

GAS REGULATOR FITTING

The aim is to provide a gas control valve in which the specified desired value range can be subsequently shifted easily in order to optimize the range of settable temperatures for the heating device without exceeding the device- and/or installation-specific admissible use conditions. To this end, a setting element () which serves to change the position of a temperature-sensitive element () and thus to actuate a switch for activating a valve has a threaded part () that is screwable into the housing () of the gas control valve. In this case, the two are connected together in a rotationally secure manner via a releasable locking mechanism, wherein a tubular latching part () that is firmly connected to the threaded part () is arranged between the pot-like setting element (), partially surrounding the threaded part () with a recess (), and the threaded part (). By way of a stop element () that protrudes from the end side, the latching part () projects into a guiding contour () which is formed by an end-side aperture located in the setting element (). 12-. (canceled)3. A gas regulator fitting for a gas-fired heating device , the gas-fired heating device including a main burner , the gas regulator fitting comprising:{'b': 1', '1, 'a housing () defining a gas flow path in a gas-conducting area of the housing ();'}{'b': '1', 'a main valve accommodated in the housing () and disposed in the gas flow path;'}{'b': '1', 'at least one second valve accommodated in the housing () and disposed downstream of the main valve in the gas flow path;'}{'b': 1', '7', '8', '17', '17', '8', '17', '7, 'a switching system accommodated in the housing () and operative to regulate the volume of gas flowing to the main burner; the switching system comprising a longitudinally moveable tappet (), a temperature-sensitive element () and a setting element (); the setting element () comprising an aperture, wherein the temperature-sensitive element () is coupled to the setting element () and operates to ...

VARIABLE THERMAL INSULATION

A device for selectively controlling the passage of thermal energy through the device from a first space to a second space by selectively varying an overall thermal conductivity of the device comprises a structure having at least one component movable from a first position to a second position and an actuator mechanically coupled to the component for moving the component from the first position to the second position. When the at least one component is positioned in the first position the device exhibits a first thermal conductivity and when the at least one component is positioned in the second position the device exhibits a second thermal conductivity different from the first thermal conductivity. 1. A device for selectively controlling the passage of thermal energy through the device from a first space to a second space by selectively varying an overall thermal conductivity of the device , the device comprising:a structure having at least one component movable from a first position to a second position; andan actuator mechanically coupled to the component for moving the component from the first position to the second position,wherein when the at least one component is positioned in the first position the device exhibits a first thermal conductivity and when the at least one component is positioned in the second position the device exhibits a second thermal conductivity different from the first thermal conductivity.2. The device of wherein the at least one component is moveable to a third position different from the first position and the second position by the actuator mechanically coupled thereto claim 1 , and wherein when the at least one component is positioned in the third position the device exhibits a third thermal conductivity different from the first thermal conductivity and the second thermal conductivity.3. The device of wherein the structure comprises a number of thermally conductive pathways adapted to be disposed between the first space and the ...

COOLING DEVICE AND METHOD FOR MANUFACTURING THE SAME

Provided is a cooling device including opening/closing holes disposed in one side thereof and a cavity. Each of the opening/closing holes is actively opened and closed according to a temperature of an external heat source, and the cavity is connected to the outside of the cooling device through the opening/closing holes. 1. A cooling device comprising opening/closing holes disposed in one side thereof and a cavity ,wherein each of the opening/closing holes is actively opened and closed according to a temperature of an external heat source, and the cavity is connected to the outside of the cooling device through the opening/closing holes.2. The cooling device of claim 1 , wherein claim 1 , when viewed from a plan view claim 1 , each of the opening/closing holes has one of a circular shape claim 1 , a Z shape and a triangular shape.3. The cooling device of claim 1 , wherein claim 1 , when viewed from a plan view claim 1 , a configuration of each of the opening/closing holes comprises a first portion extending in a first direction claim 1 , a second portion extending from one end area of the first portion in a second direction perpendicular to the first direction claim 1 , and a third portion extending from other end area of the first portion in a third direction that is perpendicular to the first direction and opposite to the second direction.4. The cooling device of claim 1 , wherein claim 1 , when viewed from a plan view claim 1 , the opening/closing holes are spaced apart from each other claim 1 , andthe spaced distance between the opening/closing holes corresponds to a half of a size of each of the opening/closing holes.5. The cooling device of claim 1 , further comprising a temperature-responsive polymer.6. The cooling device of claim 5 , wherein the temperature-responsive polymer comprises poly(N-isopropylacrylamide).7. The cooling device of claim 1 , wherein the cavity is provided in plurality.8. A method for manufacturing a cooling device claim 1 , the method ...

THERMAL DISSIPATION COMPOSITE MATERIAL AND MANUFACTURING METHOD THEREOF

A thermal dissipation composite material comprising: a matrix including a polymer material; and composite particles distributed in the matrix, wherein the composite particles include a filler, and a thermally conductive material coated on the surface of the filler by an inorganic coating layer, and wherein the plurality of thermally conductive materials coated by the inorganic coating layer are connected to each other on the surfaces of the plurality of composite particles so as to establish a heat transfer network. 1. A method of manufacturing a thermal dissipation composite material , the method comprising:preparing a first mixture by mixing an inorganic binder and a filler with each other;preparing a second mixture by mixing a thermally conductive material with the first mixture;preparing a composite particle in which a surface of the filler is coated with the thermally conductive material by an inorganic coating layer formed by curing the inorganic binder, by thermally treating the second mixture; andpreparing the thermal dissipation composite material by mixing the composite particle and a polymer material with each other.2. The method of claim 1 , wherein the preparing of the first mixture includes:providing a solvent to the inorganic binder, and performing stirring; andpreparing the first mixture by providing the filler to the solvent and the inorganic binder, which are stirred, and performing stirring.3. The method of claim 1 , wherein the preparing of the second mixture includes:generating an OH functional group on a surface of the thermally conductive material by thermally treating the thermally conductive material; andpreparing the second mixture by providing the thermally conductive material on which the OH functional group is generated to the first mixture and performing stirring.4. The method of claim 3 , wherein the thermally conductive material is thermally treated in an oxygen atmosphere claim 3 , andthe thermally conductive material on which the OH ...

HEAT-CONDUCTIVE CONNECTION ARRANGEMENT

A heat-conductive connection arrangement for connecting a printed circuit board to a cooling body. The connection arrangement has a carrier which is flat. At least part of the carrier includes at least one balloon body which faces away from the carrier and is connected to the carrier. The balloon body includes an envelope which encloses an interior, and the interior is at least in part filled with a preferably free-flowing, in particular viscous, heat-conducting substance. The envelope is configured so as to tear open under the influence of pressure and to thus release the heat-conducting substance. 13031357781277812910910. A heat-conductive connection means ( , ) for connecting a printed circuit board () to a cooling body () , having a carrier () which is configured so as to be flat , wherein at least part of the carrier () includes at least one balloon body ( , ) which faces away from the carrier () and is connected to the carrier () , wherein the balloon body ( , ) includes an envelope () which encloses an interior , wherein the interior is at least in part filled with a viscous heat-conducting means () and the envelope () is configured so as to tear open under the influence of pressure and to thus release the heat-conducting means ().230317. The connection means ( claim 1 , ) according to claim 1 , characterized in that the carrier () includes a fabric.33031713. The connection means ( claim 1 , ) according to claim 1 , characterized in that the carrier () includes a carrier film ().430319. The connection means ( claim 1 , ) according to claim 1 , characterized in that the envelope () is formed by a plastic envelope.530313031157910. The connection means ( claim 1 , ) according to claim 1 , characterized in that the connection means ( claim 1 , ) includes at least one pin () which claim 1 , under the influence of pressure on the carrier () claim 1 , is configured and disposed so as to penetrate the envelope () and to thus release the heat-conducting means (). ...

METHODS OF FORMING SERPENTINE THERMAL INTERFACE MATERIAL AND STRUCTURES FORMED THEREBY

Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include forming a thermal interface material comprising a thermally conductive serpentine foil located between a first and a second interface material. The serpentine foil may be in a parallel position or a rotated position, in embodiments. 1. A method of forming a thermal interface material (TIM) comprising:forming a first interface material on a substrate;placing a serpentine foil on the first interface material, wherein the serpentine foil comprises a repeating serpentine pattern; andforming a second interface material on the serpentine foil, wherein an apex portion of the serpentine foil is in contact with at least one of the first and second interface materials.2. The method of further comprising wherein the apex portion of the serpentine foil is disposed in a substantially parallel position with at least one of the first and second interface materials.3. The method of further comprising wherein the apex portion of the serpentine foil is disposed in a rotated alignment with respect to at least one of the first and second interface materials.4. The method of further comprising wherein the rotated alignment comprises wherein the apex is disposed at an angle with respect to at least one of the first and second interface materials claim 1 , and wherein the angle is not substantially parallel to the first and second interface materials.5. The method of further comprising wherein the angle comprises between about a 10 to about an 80 degree angle with respect to the first and second interface materials.6. The method of further comprising wherein the serpentine foil comprises a thickness of between about 100 microns to about 1000 microns.7. The method of further comprising wherein at least one of the first and second interface materials comprise a thickness of between about 1 to about 100 microns.8. The method of further comprising wherein ...

VARIABLE THERMAL RESISTANCE

Electrical and electromechanical devices often require maintaining a specific temperature, or a narrow range or temperatures, during operation. An assembly regulates the temperature of a device by providing a variable thermal resistance between the device and a heatsink. The device can be mounted to a base having a high thermal resistance, the base thermally isolating the device from the heatsink. At low environmental temperatures, the base enables the device to rise to its operating temperature as a result of the device's waste heat, and with no or minimal use of a heater. As the environmental temperature increases, a working fluid, having a low thermal resistance, undergoes thermal expansion to fill a portion of a volume in the base between the device and the heat sink, lowering the thermal resistance between the device and the heatsink to maintain the device at the required operating temperature. 1. An apparatus for regulating temperature , comprising:a mount configured to accept a device on a surface thereon;a heatsink; anda base defining a well therein configured to contain a working fluid and defining a channel disposed in a thermally conductive path between the mount and the heatsink, the channel in liquid communication with the well, the well and channel being sized to enable the working fluid to expand passively from the well into the channel and contract passively from the channel into the well in continuous amounts, the amounts being a function of a temperature of the heatsink.2. The apparatus of claim 1 , wherein the thermally conductive path has a thermal resistance that varies in a substantially linear relation to the temperature of the heatsink claim 1 , the thermal resistance being a function of the amount of working fluid in the channel.3. The apparatus of claim 2 , wherein the thermal resistance of the thermally conductive path varies in a manner enabling the mount to maintain a substantially constant temperature while the temperature of the ...

THERMAL INSULATION SYSTEM USING EVAPORATIVE COOLING

A thermal insulation system can include a body of heated material at an elevated temperature. A layer of porous insulating material can be placed adjacent to and in fluid communication with the body of heated material. The insulating layer can contain distributed liquid water in an amount sufficient to cool the insulating layer through evaporative vapor flow toward the body of heated material. The amount of water can be sufficient to provide water vapor for inhibiting the diffusion and adsorption of hydrocarbons from the heated material. The insulating layer can include a continuous vapor phase. A heat sink material at a lower temperature can be placed adjacent to the insulating layer and opposite from the body of heated material. 1. A thermal insulation system comprising:a body of heated material at a first temperature;an insulating layer comprising an insulating material adjacent to and in fluid communication with the body of heated material, wherein the insulating layer contains a distributed liquid water in an amount sufficient to cool the insulating layer through evaporative vapor flow toward the body of heated material; anda heat sink material adjacent to the insulating layer and opposite from the body of heated material, wherein the heat sink material is at a second temperature lower than the first temperature.2. The thermal insulation system of claim 1 , wherein the amount of water contained by the insulating layer is not greater than a saturation amount3. The thermal insulation system of claim 1 , wherein the heat sink material is temperature sensitive to the first temperature.4. The thermal insulation system of claim 1 , wherein the heat sink material is a vapor impermeable material.5. The thermal insulation system of claim 1 , wherein the heat sink material comprises a hydrated clay.6. The thermal insulation system of claim 5 , wherein the hydrated clay is selected from the group consisting of bentonite claim 5 , montmorillonite claim 5 , kaolinite claim ...

Heat Transfer Using Flexible Fluid Conduit

Heat transfer between a fluid-bearing flexible tube and a heat-conducting surface is improved by fixing a flexible heat-conducting sheath to the flexible tube and by compressive fixing that distorts the tube and deforms the sheath and/or the surface. The tube can be made of cross-linked polythene (PEX). The sheath can be spirally wound high-purity aluminum wire. The sheath enables efficient heat transfer between the outer surface of the tube and the heat-conducting surface. Applications include radiant heating and cooling. Tube layout can be customized and variable tube spacing is possible, for example by using a castellated layer to support the tube. 1. A flexible conduit used in heat transfer applications comprising:a. a flexible tube arranged to conduct a heat transfer fluid;b. fixed to the outer surface of said tube and contiguous with said surface a sheath of material with thermal conductivity greater than 15 W/m° C.;c. said sheath having means of flexing such that said tube and said sheath together have substantively the same flexibility as said tube alone;d. said means of flexing being uniform spacing between adjacent segments of said sheath.2. A conduit as claimed in wherein said tube has at least one layer of cross-linked claim 1 , high-density polythene.3. A conduit as claimed in wherein said sheath is a spiral strip enclosing said tube and said adjacent segments are spirals of said spiral strip.4. A conduit as claimed in wherein said sheath is a series of rings each enclosing said tube and each contiguous with the outer surface of said tube and said adjacent segments are rings in said series of rings.5. A conduit as claimed in wherein said sheath is composed of soft deformable material.6. A conduit as claimed in wherein said sheath is composed of aluminum of at least 95% purity.7. A conduit as claimed in wherein said sheath is attached to said tube by a flexible adhesive.8. An apparatus for heat transfer comprising:{'claim-ref': {'@idref': 'CLM-00001', ' ...

COMBINATION HEAT SINK ASSEMBLY

A heat sink assembly includes a heat transfer block defining alternatively arranged mounting grooves and spacer ribs, and radiation fins respectively formed by bending one respective thin metal sheet member into a substantially inverted U-shaped profile having two radiation fin walls that have one end connected to each other and an opposite end terminating in a respective outwardly upwardly extending folded portion, each radiation fin wall with the respective outwardly upwardly extending folded portion being inserted into one respective mounting groove of the heat transfer block and fixedly secured thereto through a stamping operation to deform the folded portions of the radiation fin walls of the radiation fins and spacer ribs of the heat transfer block synchronously. 1. A heat sink assembly , comprising:a heat transfer block comprising a plurality of mounting grooves located on an outer surface thereof and a spacer rib disposed between each two adjacent said mounting grooves; anda plurality of radiation fins affixed to said mounting grooves of said heat transfer block, each said radiation fin comprising two radiation fin walls, said two radiation fin walls each having one end thereof connected to each other and an opposite end thereof terminating in a respective outwardly upwardly extending folded portion, each said radiation fin wall with the respective said outwardly upwardly extending folded portion being inserted into one respective said mounting groove and fixedly secured thereto through a stamping operation to deform the folded portions of said radiation fin walls of said radiation fins and said spacer ribs of said heat transfer block synchronously.2. The heat sink assembly as claimed in claim 1 , wherein said spacer ribs rise above respective groove walls of said mounting grooves claim 1 , defining an elevational difference between said spacer ribs and said groove walls of said mounting grooves.3. The heat sink assembly as claimed in claim 1 , wherein each ...

THERMAL METAMATERIAL FOR LOW POWER MEMS THERMAL CONTROL

A thermal metamaterial device comprises at least one MEMS thermal switch, comprising a substrate layer including a first material having a first thermal conductivity, and a thermal bus over a first portion of the substrate layer. The thermal bus includes a second material having a second thermal conductivity higher than the first thermal conductivity. An insulator layer is over a second portion of the substrate layer and includes a third material that is different from the first and second materials. A thermal pad is supported by a first portion of the insulator layer, the thermal pad including the second material and having an overhang portion located over a portion of the thermal bus. When a voltage is applied to the thermal pad, an electrostatic interaction occurs to cause a deflection of the overhang portion toward the thermal bus, thereby providing thermal conductivity between the thermal pad and the thermal bus. 1. A device comprising: a substrate layer including a first material having a first thermal conductivity;', 'a thermal bus over a first portion of the substrate layer, the thermal bus including a second material having a second thermal conductivity that is higher than the first thermal conductivity;', 'an insulator layer over a second portion of the substrate layer, the insulator layer including a third material that is different from the first and second materials, the insulator layer including a first portion having a first height, and a second portion having a second height that is less than the first height; and', 'a thermal pad supported by the first portion of the insulator layer, the thermal pad including the second material and having an overhang portion, wherein the overhang portion is located over a portion of the thermal bus;, 'at least one micro-electro-mechanical (MEMS) thermal switch, comprisingwherein when a voltage is applied to the thermal pad, an electrostatic interaction occurs between the thermal pad and the thermal bus to cause a ...

PROTECTIVE HEAT SHIELDS FOR THERMALLY SENSITIVE COMPONENTS AND METHODS FOR PROTECTING THERMALLY SENSITIVE COMPONENTS

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided. 1. A method of manufacturing a printed circuit board assembly , the method comprising:providing a circuit board;positioning a plurality of components on the circuit board, at least one of the components being a thermally-sensitive component having a maximum temperature threshold;positioning a customized protective heat shield on the thermally-sensitive component;exposing the circuit board to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component; andremoving the customized protective heat shield from the thermally-sensitive component.2. The method according to claim 1 , wherein the customized protective heat shield is positioned on the thermally-sensitive component prior to positioning of the thermally-sensitive component on the circuit board.3. The method according to claim 2 , wherein the thermally-sensitive component and the customized protective heat shield are together picked and placed on the circuit board with a surface mount technology machine.4. The method according to claim 1 , wherein the customized protective heat shield is positioned on the thermally-sensitive component after positioning of the thermally- ...

Partitioned, Rotating Condenser Units to Enable Servicing of Submerged IT Equipment Positioned Beneath a Vapor Condenser Without Interrupting a Vaporization-Condensation Cycling of the Remaining Immersion Cooling System

An immersion cooling tank includes: a tank comprised of a base wall, and perimeter walls, and having a lower tank volume in which a liquid can be maintained and heated to a boiling point to generate a rising plume of vapor; a rack structure within the tank volume that supports insertion of multiple, heat dissipating electronic devices in a side-by-side vertical configuration; and a condenser configured as a plurality of individually rotatable condenser sub-units, with each condenser sub-unit located above a vertical space that extends vertically from the lower tank volume and within which an electronic device can be inserted. Each individual condenser sub-unit can be opened independent of the other sub-units and each other condenser sub-unit can remain in a closed position while a first condenser sub-unit is opened to allow access to a first vertical space and any existing electrical device contained therein below the first condenser sub-unit. 1. An immersion cooling tank comprising:a tank comprised of a base wall, and perimeter walls, and having a lower tank volume in which a liquid can be maintained and heated to a boiling point to generate a rising plume of vapor;a rack structure within the tank volume that supports insertion of multiple, heat dissipating electronic devices in a side-by-side vertical configuration; anda condenser configured as a plurality of individually rotatable condenser sub-units, with each condenser sub-unit located above a vertical space that extends vertically from the lower tank volume and within which an electronic device can be inserted;wherein each individual condenser sub-unit can be opened independent of the other sub-units and each other condenser sub-unit can remain in a closed position while a first condenser sub-unit is opened to allow access to a first vertical space and any existing electrical device contained therein below the first condenser sub-unit.2. The immersion cooling tank of claim 1 , wherein each of the plurality of ...

SOCKETS FOR REMOVABLE DATA STORAGE DEVICES

A socket includes a housing configured to receive a removable Data Storage Device (DSD) and a Thermal Interface Material (TIM). An assembly of the socket is attached to the housing and configured to expand due to heat. In a thermally expanded state, the assembly causes the TIM to come into contact with the removable DSD to draw heat away from the removable DSD. According to another aspect, a retaining strip or assembly is attached to a housing in a configuration such that the retaining strip or assembly expands due to heat to increase a resistance to removal of the removable DSD from the housing when the retaining strip or assembly is in a thermally expanded state. 1. A socket , comprising:a housing configured to receive a removable Data Storage Device (DSD);a Thermal Interface Material (TIM); andan assembly attached to the housing and configured to expand due to heat, wherein the assembly in a thermally expanded state causes the TIM to come into contact with the removable DSD to draw heat away from the removable DSD.2. The socket of claim 1 , wherein the assembly is further configured to push the TIM to come into contact with the removable DSD.3. The socket of claim 1 , wherein the assembly is further configured to push a first side of the removable DSD to cause a second side of the removable DSD opposite the first side to come into contact with the TIM.4. The socket of claim 1 , wherein the housing includes a slot portion through which the assembly is attached to the socket.5. The socket of claim 1 , wherein the assembly includes a bi-metal material composition.6. The socket of claim 1 , wherein the removable DSD is a Secure Digital (SD) memory card.7. The socket of claim 1 , wherein the location of the TIM relative to the housing when the removable DSD is fully received in the housing corresponds to at least one of a portion of the removable DSD with a higher thermal conductivity than other portions of the removable DSD and a portion of the removable DSD that ...

SELF-REGULATING THERMAL INSULATION AND RELATED METHODS

Presently disclosed self-regulating thermal insulation may include one or more thermal actuators that may expand and contract in response to changes in temperature adjacent the thermal insulation, thereby automatically changing the thermal resistance of the thermal insulation. In this manner, a self-regulating thermal insulation may be configured to locally adjust in response to local changes in temperature of a part being insulated, for example, during curing or some other manufacturing process. Such self-regulating thermal insulation may be configured to respond to temperature changes without feedback control systems, power, or human intervention. One example of self-regulating thermal insulation may include a first plate, a second plate, a support structure coupling the first plate and the second plate and defining an insulation thickness therebetween, an internal partition positioned between the first plate and the second plate, and at least one thermal actuator positioned between the second plate and the internal partition. 1. A self-regulating thermal insulation , comprising:a first plate having a first outer surface and a first inner surface;a second plate having a second outer surface and a second inner surface, the second inner surface facing the first inner surface of the first plate;a support structure coupling the first plate to the second plate, the support structure being configured to position the first plate with respect to the second plate such that the first plate is separated from the second plate by an insulation thickness;an internal partition positioned between the first plate and the second plate; anda thermal actuator coupled to the second inner surface of the second plate adjacent a second actuator end, wherein the thermal actuator is coupled to the internal partition at a first actuator end, wherein the thermal actuator is configured to automatically move the internal partition with respect to the first plate and the second plate in ...

Passive Thermal Diode for Pipelines

A system and method for a passive thermal diode (PTD) to be disposed on a pipeline that inhibits heat transfer from the pipeline to the environment below a threshold temperature and promotes heat transfer from the environment to the pipeline above a threshold temperature. 1. A method of operating a passive thermal diode (PTD) disposed on a pipeline , comprising:inhibiting, via the PTD, heat transfer from the pipeline to environment in response to an external temperature being below a threshold temperature; andpromoting, via the PTD, heat transfer from the environment to the pipeline in response to the external temperature being above the threshold temperature.2. The method of claim 1 , wherein the external temperature comprises an external surface temperature of the PTD claim 1 , and wherein heat transfer from the environment to the pipeline increases temperature of a fluid transported in the pipeline.3. The method of claim 1 , wherein the external temperature comprises a temperature of an external graphene sheet of the PTD claim 1 , and wherein heat transfer from the environment to the pipeline decreases viscosity of a fluid transported in the pipeline.4. The method of claim 1 , wherein the threshold temperature comprises a deformation temperature of a phase change material (PCM) in the PTD claim 1 , and wherein electricity is not supplied to the PTD.5. The method of claim 1 , wherein promoting the heat transfer comprises placing claim 1 , via thermal expansion of a control material in the PTD claim 1 , a heat-transfer material layer of the PTD in contact with the pipeline claim 1 , wherein the heat transfer from the environment to the pipeline comprises heat transfer from the environment through the heat-transfer material layer to the pipeline.6. The method of claim 5 , wherein the heat-transfer material layer comprises a graphene sheet.7. The method of claim 5 , wherein the control material comprises a phase change material (PCM).8. The method of claim 7 , ...

Controlling the Heating of a Composite Part

A method and apparatus for heating a part. The part is heated with the part at least partially surrounded by a surface of a tooling system, while a heatsink system is positioned relative to the part. A thermal conduction between the heatsink system and the part is changed during heating of the part. 1. An apparatus comprising:a surface of a tooling system that is located around at least a portion of a part;a heatsink that is positioned relative to the part to control a transfer of heat between air and the part relative to a set of locations on the part during heating of the part; anda meltable layer that attaches the heatsink to the surface in which the meltable layer is configured to melt at a selected melting temperature during heating of the part.2. The apparatus of claim 1 , wherein the selected melting temperature is selected such that the part is hotter than the air when the meltable layer reaches the selected melting temperature.3. The apparatus of claim 1 , wherein melting of the meltable layer reduces a separation distance between the heatsink and the surface of the tooling system claim 1 , thereby increasing a thermal conduction between the heatsink and the part to allow the heat to be transferred from the part to the air.4. The apparatus of claim 1 , wherein melting of the meltable layer increases a surface area of contact between the meltable layer and the surface and between the meltable layer and the heatsink claim 1 , thereby increasing a thermal conduction between the heatsink and the part to allow the heat to be transferred from the part to the air.5. The apparatus of claim 1 , wherein melting of the meltable layer causes the meltable layer claim 1 , and thereby claim 1 , the heatsink claim 1 , to detach from the surface of the tooling system during heating of the part.6. The apparatus of claim 5 , wherein a thermal conduction between the heatsink and the part is reduced when the meltable layer and the heatsink separate from the surface of the ...

HEAT DISSIPATION DEVICE

A heat dissipation device includes a heat dissipation member, a heat transfer member, and a reinforcing member. The heat transfer member has one side attached to the heat dissipation member, and two opposite lateral edges thereof are respectively provided with at least one connection portion and at least one through hole. The reinforcing member is connected to the other side of the heat transfer member, and two opposite lateral edges thereof are respectively formed with at least one mating connection portion for correspondingly connecting to the connection portion. The reinforcing member is provided at a central portion with an opening. With these arrangements, the heat transfer member can bear a larger locking force when the heat dissipation member is locked thereto, and is also prevented from deformation. 1. A heat dissipation device , comprising:a heat dissipation member having a plurality of heat radiation fins;a heat transfer member having one side attached to the heat dissipation member, and two opposite lateral edges thereof being respectively provided with at least one connection portion; anda reinforcing member being connected to the other side of the heat transfer member, and two opposite lateral edges thereof being respectively formed with at least one mating connection portion for correspondingly connecting to the connection portion; and the reinforcing member being provided at a central portion with an opening.2. The heat dissipation device as claimed in claim 1 , wherein the heat transfer member is a vapor chamber claim 1 , which is formed at a central portion with a raised portion for fitting in the opening.3. The heat dissipation device as claimed in claim 2 , wherein the heat transfer member includes a first side and a second side; and the first side thereof being connected to the reinforcing member whereas the second side thereof being attached to the heat dissipation member.4. The heat dissipation device as claimed in claim 3 , wherein the ...

LARGE CAPACITY HEAT SINK

A cooling system includes a first boiler defining a first flow path with a first thermal load. A second heat exchanger defines a second flow path with a second thermal load. A reservoir is configured to communicate a working fluid to at least one of the first boiler and second heat exchanger. A pump is configured to selectively exhaust the working fluid to an ambient environment. A method is also disclosed. 1. A system for cooling a thermal load , comprising:a reservoir configured to communicate a working fluid to a first boiler defining a first flow path, wherein the first boiler is configured to cool a first load;a second heat exchanger defining a second flow path and configured to cool a second, different load; anda first pump configured to selectively exhaust the working fluid from the first boiler to an ambient environment.2. The system of claim 1 , wherein the working fluid is communicated from the reservoir to the second heat exchanger.3. The system of claim 2 , wherein the second heat exchanger is a second boiler.4. The system of claim 2 , wherein the second flow path comprises a second pump positioned downstream of the second heat exchanger claim 2 , configured to communicate the working fluid from the second flow path to the first flow path upstream of the first pump.5. The system of claim 1 , wherein the second cooling path is a closed loop vapor cycle system including a condenser configured to reject heat from the second cooling path to the first cooling path.6. The system of claim 5 , wherein the condenser is arranged in series with the first boiler.7. The system of claim 5 , wherein the condenser is arranged in parallel with the first boiler.8. The system of claim 5 , wherein the vapor cycle system includes a refrigerant accumulator arranged between the condenser and an expansion valve.9. The system of claim 1 , wherein the working fluid includes water.10. The system of claim 1 , comprising at least one flow control valve configured to meter flow ...

RESIN SHEET HAVING CONTROLLED THERMAL CONDUCTIVITY DISTRIBUTION, AND METHOD FOR MANUFACTURING THE SAME

A resin sheet has a single composition, and changes in thermal conductivity according to an area. The resin sheet includes a region having a thermal conductivity that is greater than an average value of a thermal conductivity of an entirety of the resin sheet by 1 W/mK or more. A method for manufacturing a resin sheet includes: forming a resin composition into a molded body having a sheet shape, the resin composition containing a filler having magnetic anisotropy; performing magnetic field orientation on the filler by using a bulk superconductor magnet in one or a plurality of predetermined portions of the molded body; and forming a region having a thermal conductivity that is greater than an average value of a thermal conductivity of an entirety of the resin sheet by 1 W/mK or more, in the one or the plurality of predetermined portions. 1. A resin sheet that has a single composition and that changes in thermal conductivity according to an area , whereina region exists that has a thermal conductivity that is greater than an average value of a thermal conductivity of an entirety of the resin sheet by 1 W/mK or more.2. The resin sheet according to claim 1 , wherein a minimum unit area of the region having the thermal conductivity that is greater than the average value of the thermal conductivity of the entirety of the resin sheet by 1 W/mK or more is 0.2 cmor more.3. The resin sheet according to claim 1 , wherein an area of the region having the thermal conductivity that is greater than the average value of the thermal conductivity of the entirety of the resin sheet by 1 W/mK or more is from 1 to 50% of an area of the entirety of the resin sheet.4. The resin sheet according to claim 1 , wherein the region having the thermal conductivity that is greater than the average value of the thermal conductivity of the entirety of the resin sheet by 1 W/mK or more includes a portion having a thermal conductivity of 5 W/mK or more.5. The resin sheet according to claim 1 , ...

Nanotube-Based Insulators

A nanotube-based insulator is provided having thermal insulating properties. The insulator can include a plurality of nanotube sheets stacked on top of one another. Each nanotube sheet can be defined by a plurality of carbon nanotubes. The plurality of carbon nanotubes can be configured so as to decrease normal-to-plane thermal conductivity while permitting in-plane thermal conductivity. A plurality of spacers can be situated between adjacent nanotube sheets so as to reduce interlayer contact between the nanotubes in each sheet. The plurality of spacers can be ceramic or alumina dots or provided by texturing the nanotube sheets. 1. A process for making a carbon nanotube insulator , the process comprising:generating, from a cloud of nanotubes, a plurality of nanotube sheets having;processing the nanotube sheets to substantially align the nanotubes within the sheet, so as to maintain in-plane thermal conductivity while minimizing normal-to-plane thermal conductivity; andpositioning a spacer between adjacent nanotube sheets, so as to create additional spacing between the sheets to further minimize normal-to-plane thermal conductivity.2. The process of claim 1 , wherein the step of generating includes introducing a dopant during nanotube growth or post nanotube growth to decrease normal-to-plane thermal conductivity.3. The process of claim 2 , wherein claim 2 , in the step of introducing claim 2 , the dopant is boron claim 2 , carbon 13 claim 2 , an irradiated CNT material claim 2 , or a combination thereof.4. The process of claim 1 , wherein the step of processing includes decreasing inter-tube contact to further minimize normal-to-plane thermal conductivity.5. The process of claim 4 , wherein the step of decreasing includes infusing claim 4 , into the nanotube sheets claim 4 , a material that can permeate within spaces between adjacent nanotubes to disrupt inter-tube contacts.6. The process of claim 1 , wherein claim 1 , in the step of positioning claim 1 , the spacer ...

HEAT DISSIPATION DEVICE

This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel. 1. A heat dissipation device configured to be in thermal contact with a heat source , and the heat dissipation device comprising:a heat dissipation body having at least one vertical channel and configured to be in thermal contact with the heat source; anda cover plate stacked on the heat dissipation body and covering the at least one vertical channel;wherein a thermal conductivity of the heat dissipation body is larger than a thermal conductivity of the cover plate, and the cover plate has at least one first through hole connecting to the at least one vertical channel.2. The heat dissipation device according to claim 1 , wherein the thermal conductivity of the heat dissipation body is at least twenty times higher than the thermal conductivity of the cover plate.3. The heat dissipation device according to claim 2 , wherein the thermal conductivity of the heat dissipation body is at least one hundred times higher than the thermal conductivity of the cover plate.4. The heat dissipation device according to claim 1 , wherein an extension direction of the at least one vertical channel is not perpendicular to a vertical direction.5. The heat dissipation device according to claim 4 , wherein the ...

METHOD AND APPARATUS FOR IMPROVING THERMAL EFFICIENCY OF HEATING DEVICE

A method for improving thermal efficiency of a heating device that reduces an amount of heat flowing out from a heating device to the outside by installing a heat-resistant inorganic conjugated molded product in and along a pathway for heated gas generated from the heating device without interrupting the flow of heated gas passing the pathway , heating the inorganic conjugated molded product with the heated gas, and putting radiation heat from the heated inorganic conjugated molded product back into the heating device , the inorganic conjugated molded product being provided with an interior layer and an exterior layer, the exterior layer consisting of a coverture for inorganic materials that protects the interior layer from heated gas. 155-. (canceled)56. A method for the improving thermal efficiency of a heating device , comprising:installing a heat-resistant inorganic conjugated molded product in and along a pathway for heated gas generated from a heating device without interrupting a flow of heated gas passing the pathway;heating the inorganic conjugated molded product with the heated gas;putting back into the heating device radiation heat from the heated inorganic conjugated molded product; andreducing an amount of heat that flows out from the heating device to the outside, the inorganic conjugated molded product being provided with an interior layer and an exterior layer, the exterior layer being formed of a coverture for inorganic materials that protects the interior layer from heated gas.57. The method for improving thermal efficiency of a heating device according to claim 56 , whereinthe interior layer is formed by a reinforcing material and a ceramic matrix, the reinforcing material being formed of a heat-resistant inorganic fiber, the ceramic matrix being filled in voids in the reinforcing material, andthe reinforcing material is formed having a cloth member or a processed fiber product.58. The method for improving thermal efficiency of a heating device ...

AUXILIARY CONDUIT ASSEMBLY

A heat transfer system, comprising a primary heat transfer assembly for transferring heat therethrough to a thermal energy consumption system, thermal insulation for minimizing escape of heat from the primary heat transfer assembly, and an auxiliary conduit assembly formed with an auxiliary conduit channel for flow of an auxiliary heat transfer fluid therethrough, the auxiliary heat transfer fluid may be heated by heat escaping from the primary heat transfer assembly. 146-. (canceled)47. A heat transfer system , comprising:a primary heat transfer conduit formed with a channel for flow of a primary heat transfer fluid therethrough to a thermal energy consumption system;thermal insulation for minimizing escape of heat from the primary heat transfer conduit; andan auxiliary conduit assembly formed with an auxiliary conduit channel for flow of an auxiliary heat transfer fluid, said auxiliary heat transfer fluid being heated by heat escaping from the primary heat transfer conduit.48. The system of wherein the auxiliary conduit channel at least partially surrounds the primary heat transfer conduit.49. The system of wherein the auxiliary conduit assembly comprises a plurality of pipes.50. The system of wherein the plurality of pipes comprise at least one of a plurality of microtubes claim 49 , a plurality of relatively small pipes claim 49 , and a plurality of pipes with a rectangular-like cross section.51. The system of wherein the auxiliary conduit assembly comprises a coiled pipe.52. The system of wherein the auxiliary conduit assembly comprises a serpentine-like coiled pipe.53. The system of wherein the auxiliary conduit assembly comprises an at least partially cylindrical pipe.54. The system of wherein the auxiliary conduit channel overlies or underlies the thermal insulation.55. The system of wherein the auxiliary conduit channel is embedded within the thermal insulation56. The system of wherein the thermal energy consumption system comprises at least one of a system ...

PHASE-CHANGE MECHANICALLY DEFORMABLE COOLING DEVICE

The present invention comprises: a base receiving heat from a heat source; a hollow cylinder-shaped fixed cylinder fixedly receiving the heat from the base, an opening thereof being closed by the base; fixed fins fixedly provided at the fixed cylinder to receive the heat from the fixed cylinder; a piston slidably blocking the inside of the fixed cylinder forming an accommodation chamber for a phase change material; and an elastic member for applying force toward the base with respect to the piston, wherein at low temperature heat, the phase change material changes a phase in a volume reducing direction, and the piston is returned to a backward position at the side of the base, and at high temperature heat, the phase change material changes the phase in a volume increasing direction, and the piston is operated to move from the backward position to a forward position. 1. A phase-change mechanically deformable cooling device comprising:a base provided so as to receive heat from a heat source;a hollow cylinder-shaped fixed cylinder fixedly provided so as to receive the heat from the base, and provided such that an opening thereof is closed by the base;fixed fins fixedly provided at the fixed cylinder so as to receive the heat from the fixed cylinder;a piston blocking the inside of the fixed cylinder in a watertight or airtight manner in a direction perpendicular to an axial direction, and fitted to be slidable in the axial direction so as to form an accommodation chamber for accommodating a phase change material;an elastic member for applying an elastic restoring force toward the base with respect to the piston;an opening formed at an end of the fixed cylinder at the opposite side to the base;a protruding rod provided on a side of the piston facing the opening to pass through the opening;a heat transfer deformation part which is fixed to the protruding rod to deform a shape, a posture, or a position according to the movement of the protruding rod and provided in contact ...

Thermal Diode

The thermal diode is formed of a first material as a ceramic material exhibiting thermal conductivity that increases in a certain temperature range of −200° C. or higher but 1000° C. or lower and a second material exhibiting the thermal conductivity that decreases in the temperature range, the first material and the second material being bonded together. The first material has preferably a microstructure having a characteristic length Lof 1 nm to 10 μm. 1. A thermal diode comprising:a first material as a ceramic material exhibiting thermal conductivity that increases in a certain temperature range of −200° C. or higher but 1000° C. or lower; anda second material exhibiting the thermal conductivity that decreases in the temperature range,wherein the first material and the second material are bonded together.2. The thermal diode according to claim 1 , wherein the first material has a microstructure having a characteristic length Lof 1 nm to 10 μm.3. The thermal diode according to claim 2 , wherein the first material is configured by a composite material in which a dissimilar material is dispersed in a base material claim 2 , a gap GI between particles of the dissimilar material represents the characteristic length Lof the microstructure claim 2 , and the particles of the dissimilar material have a particle diameter of 1 nm to 1000 nm.4. The thermal diode according to claim 3 , wherein when an average value of gaps GI between the particles of the dissimilar material of the first material is defined as GI claim 3 , the gaps GI between the particles of the dissimilar material are 0.1GIor more but 50GIor less.5. The thermal diode according to claim 2 , wherein the first material is configured by a porous body claim 2 , a gap PI between pores in the porous body represents the characteristic length Lof the microstructure claim 2 , and a pore diameter is 1 nm to 1000 nm.6. The thermal diode according to claim 5 , wherein when an average value of gaps PI between the pores of ...

HEAT SINK FOR PLUG-IN CARD, PLUG-IN CARD INCLUDING HEAT SINK, AND ASSOCIATED MANUFACTURING METHOD

Various embodiments of the present disclosure provide a heat sink for a plug-in storage card and a plug-in storage card including the heat sink. The heat sink comprises a first part secured to a surface of the plug-in storage card and a second part coupled to the first part and being movable relative to the first part in a first direction, wherein the first direction is perpendicular to the surface of the plug-in storage card. In this way, when the second part and the first part have a larger overlap in the first direction, the heat sink has a smaller first height and when the second part and the first part have a smaller overlap in the first direction, the heat sink has a greater second height. 1. A device , comprising:a plug-in storage card; a first part mounted relative to the plug-in storage card, the first part including a plurality of first heat radiating elements;', 'a second part mounted relative to the plug-in storage card and opposing the first part, the second part including a plurality of second heat radiating elements extending toward the first part, the first part and the second part being configured for relative movement to adjust a vertical height of the heat sink; and', 'a first transmission member coupled to the plug-in storage card and operatively coupled to one of the first and second parts, the first transmission member movable to cause corresponding relative movement of the first and second parts to adjust the vertical height of the heat sink., 'a heat sink associated with the plug-in storage card, the heat sink comprising2. The device of claim 1 , wherein the second part is movably coupled to the plug-in storage card claim 1 , the second part movable relative to the first part to adjust the vertical height of the heat sink.3. The device of claim 2 , wherein the first transmission member is operatively coupled to the second part and pivotally coupled to the plug-in storage card claim 2 , wherein pivotal movement of the first transmission member ...

Insulated HVAC Transition Box and Assembly for Insulating

An insulated HVAC duct component such as a transition box includes a first insulation layer and a second, different insulation layer. The transition box includes at least four sidewalls and one of a top and a back wall, the transition box further including a first access port and a second access port, the first access port having a different cross section than the second access port, one of the access ports being spaced from a nearest sidewall by less than 2 inches. The first insulation layer is located along an inside surface of the box. The second different insulation layer overlies the first insulation layer, the second different insulation layer having an air impervious surface, wherein the combined thickness of the first insulation layer and the second different insulation layer is less than 2 inches. 1. An insulated HVAC duct component comprising:(a) a transition box having two sets of opposing sidewalls, a back wall, and a front wall having a rectangular outlet and an extending lip;(b) a mineral wool layer having a first R value, the mineral wool layer adjacent one of an inside surface and an outside of the transition box; and(c) a reflective laminate layer having a second R value, the reflective laminate layer located adjacent the mineral wool layer.2. The insulated HVAC duct component of claim 1 , further comprising an adhesive layer intermediate the mineral wool layer and the reflective laminate layer.3. The insulated HVAC duct component of claim 1 , wherein the first R value is greater than the second R value.4. The insulated HVAC duct component of claim 1 , wherein the reflective laminate layer includes a base piece of reflective laminate material sized to overlap the back wall and two opposing sidewalls of the register box claim 1 , and side pieces of reflective laminate material sized to overlap the other two opposing sidewalls of the transition box.5. The insulated HVAC duct component of claim 1 , wherein a portion of the transition box is formed of ...

FRAMELESS COOLING MODULE

A heat exchanger adapted to be coupled with a platform is disclosed. The heat exchanger comprises two or more core units having an upper surface and a lower surface, the lower surface of each core unit being fixed to the platform. The heat exchanger further includes a plate disposed along the upper surface of the core units, the plate having a plurality of bend enhancement regions and a plurality of holes, each bend enhancement region being placed at a predetermined distance from the nearest adjacent holes, and a plurality of spacers interposed between the plate and the upper surface to couple the plate to the upper surface, the plurality of spacers adapted to provide offset between the plate from the core units. During operation of the heat exchanger, each bend enhancement region is configured to facilitate flexibility of the plate to accommodate any uneven expansion of the core units. 1two or more core units having an upper surface and a lower surface, the lower surface of each core unit being fixed to the platform;a plate disposed along the upper surface of the core units, the plate having a plurality of bend enhancement regions and a plurality of holes, each bend enhancement region being placed at a predetermined distance from the nearest adjacent holes; anda plurality of spacers interposed between the plate and the upper surface to couple the plate to the upper surface, the plurality of spacers adapted to provide offset between the plate from the core units;wherein, during operation of the heat exchanger, each bend enhancement region is configured to facilitate flexibility of the plate to accommodate any uneven expansion of the two or more core units.. A heat exchanger adapted to be coupled with a platform, the heat exchanger comprising: The present disclosure relates to heat exchangers and more specifically, to an assembly of heat exchangers.Heat exchangers are utilized across various machines for exchanging heat. The heat exchangers include multiple tubes ...

COOLING STRUCTURE AND PARALLEL PLATE ETCHING APPARATUS

A cooling structure is provided that, includes a cooling target member, a cooling plate including a cooling mechanism and being configured to cool the cooling target member, and a clamp configured to hold the cooling target member to the cooling plate at an outer periphery of the cooling plate. The cooling plate includes a surface facing the cooling target member that is arranged into a spherical shape having a center portion that bulges toward the cooling target member with respect to a peripheral edge portion. The cooling target member includes a surface facing the cooling plate to which at least a predetermined pressure is applied. 1. A cooling structure comprising:a cooling target member;a cooling plate including a cooling mechanism, the cooling plate being configured to cool the cooling target member; anda clamp configured to hold the cooling target member to the cooling plate at an outer periphery of the cooling plate;wherein the cooling plate includes a surface facing the cooling target member that is arranged into a spherical shape having a center portion that bulges toward the cooling target member with respect to a peripheral edge portion; andwherein the cooling target member includes a surface facing the cooling plate to which at least a predetermined pressure is applied.2. The cooling structure according to claim 1 , wherein the predetermined pressure is 0.1 MPa.3. The cooling structure according to claim 1 , wherein the surface facing the cooling plate of the cooling target member has a spherical shape with a radius of 84 m to 120 m.4. The cooling structure according to claim 1 , whereinthe cooling target member is an electrode; andthe cooling structure is arranged in a parallel plate etching apparatus configured to perform an etching process on a substrate.5. The cooling structure according to claim 4 , further comprising:a heat transfer sheet that is inserted between the cooling plate and the electrode.6. The cooling structure according to claim 4 , ...

PASSIVE THERMAL DIODE

A passive thermal diode (), comprising: a heat source (); a heat sink (); a thermal coupling element () removably coupled to the heat source () and the heat sink (); a lever (), the lever () connected to the thermal coupling element () via a pivot point (); and at least one spring () connected to the lever (), the spring () comprised of a shape memory alloy, wherein the lever () transmits a force to displace the thermal coupling element () when the force is produced by the spring () on the lever (). 1. A passive thermal diode , comprising:a heat source;a heat sink;a thermal coupling element removably coupled to the heat source and heat sink;a lever, the lever connected to the thermal coupling element via a pivot point; andat least one spring connected to the lever, the spring comprised of a shape memory alloy, whereinthe lever transmits a force to displace the thermal coupling element when the force is produced by the spring on the lever.2. The passive thermal diode of claim 1 , further comprising a cover system claim 1 , comprising:at least two cover elements;at least two driving pins;a connecting rod; anda plate, wherein the force transmitted through the lever is applied to the plate via the connecting rod, and displaces the at least two cover elements through the at least two driving pins.3. The passive thermal diode of claim 2 , wherein the at least two cover elements comprise a material having a thermal conductivity of less than 0.5 W/(mK).4. The passive thermal diode of claim 2 , further comprising a pistol assembly claim 2 , comprising:a base plate; anda pistol rod, wherein the pistol rod links the lever to the base plate, and the base plate is linked to the at least one spring.5. The passive thermal diode of claim 4 , wherein the pistol assembly moves in a direction running along the center axis of the pistol rod that is parallel and opposite to a second direction claim 4 , the second direction being the direction of the thermal coupling element when the ...

APPARATUS, SYSTEM, AND METHOD FOR COOLING DEVICES CONTAINING MULTIPLE COMPONENTS

The disclosed apparatus may include (1) a base that (A) supports multiple heatsinks and (B) is coupled to a device that includes (i) a first component designed to operate at temperatures below a first threshold temperature and (ii) a second component designed to operate at temperatures below a second threshold temperature, the first threshold temperature being different than the second threshold temperature, (2) a first heatsink that (A) is secured to the base and (B) transfers heat away from the first component such that the first component operates at a temperature below the first threshold temperature, and (3) a second heatsink that is (A) secured to the base, (B) physically separated from the first heatsink by at least a certain amount of space, and (C) transfers heat away from the second component such that the second component operates at a temperature below the second threshold temperature. 1. An apparatus comprising: a first component designed to operate at temperatures below a first threshold temperature; and', 'a second component designed to operate at temperatures below a second threshold temperature, the first threshold temperature being higher than the second threshold temperature;, 'is coupled to a device that comprises, 'a base capable of supporting a plurality of heatsinks that is secured to the base; and', 'transfers heat away from the first component such that the first component operates at a temperature below the first threshold temperature; and, 'a first heatsink that is secured to the base;', 'transfers heat away from the second component; and', is located between at least one side of the second heatsink and the first heatsink; and', 'is dimensioned to reduce heat transfer between the first heatsink and the second heatsink such that the second component operates at a temperature below the second threshold temperature., 'is at least partially thermally isolated from the first heatsink by a region of empty space that], 'a second heatsink that2. ...

HEAT EXCHANGER SYSTEM

A heat exchanger system includes a radiator and a charge air cooler. The charge air cooler includes two interconnected cores, being a first core mounted next to the radiator and a second core mounted upstream of the radiator so that air output from the first core does not pass through the radiator. 1. A heat exchanger system comprising:a radiator; anda charge air cooler, whereinthe charge air cooler includes at least two interconnected cores, including a first core mounted next to the radiator in a direction perpendicular to the air flow direction and generally in the plane of the radiator, neither upstream nor downstream of the radiator, and a second core mounted at an angle to the radiator and upstream of the radiator in the air path, so that air output from the first core does not pass through the radiator.2. The heat exchanger system as claimed in claim 1 , wherein the first core is mounted on top of the radiator.3. The heat exchanger system as claimed in claim 1 , wherein the first core and the second core are of the same size.4. The heat exchanger system as claimed in claim 1 , wherein the second core is at an angle to the radiator in the range 30 to 60°.5. The heat exchanger system as claimed in claim 1 , wherein the second core is at an angle to the radiator in the range 40 to 50°.6. The heat exchanger system as claimed in claim 1 , further comprising:an oil cooler upstream of the radiator.7. The heat exchanger system as claimed in claim 6 , wherein the oil cooler is tilted away from the radiator.8. The heat exchanger system as claimed in claim 7 , wherein an angle of tilt of the oil cooler is in the range 5 to 20°.9. The heat exchanger system as claimed in claim 7 , wherein an angle of tilt of the oil cooler is in the range 8 to 12°.10. The heat exchanger system as claimed in claim 6 , wherein the second core is mounted above the oil cooler.11. The heat exchanger system as claimed in claim 1 , wherein the at least two interconnected cores includes only the ...

THERMAL ISOLATED PLATFORM SYSTEM AND METHOD

The present invention provides an apparatus and method for supporting a mechanically stable and thermally isolated platform for operating sample devices which require extensive thermal isolation. The apparatus comprises a mounting base, a substrate, and microstructured tubes interconnecting the mounting base and substrate and having a thermally resistive inner portion and a thin coated layer that exhibits high electrical conductivity and low thermal emissivity. Radiation reflectors may be incorporated into the apparatus to protect components and reflect infrared radiation, and a getter equipped vacuum cover may be sealed to a vacuum header to maintain a low pressure environment within the apparatus. 1. A mechanically stable and thermally isolated platform comprising:a mounting base comprising a mounting base top surface and a mounting base bottom surface, wherein said mounting base extends from a central axis along a cross-sectional plane terminating at a mounting base perimeter;a substrate comprising a substrate top surface and a substrate bottom surface;one or more microstructured tubes for supporting said substrate, each said microstructured tube comprising a tube inner portion, a thin coated layer, an upper end portion, and a lower end portion and directly attaching to said mounting support at said lower end portion and directly attaching to said substrate at said upper end portion, wherein one or more said tube inner portions comprise a thermal resistive material, wherein one or more said thin coated layers exhibit substantially low thermal emissivity and substantially high electrical conductivity; anda sample device mounted to said substrate top surface or said substrate bottom surface.2. The mechanically stable and thermally isolated platform of claim 1 , wherein said microstructured tubes are aligned substantially parallel to the central axis and positioned periodically and substantially equal spaced about said first cross-sectional plane and adjacent to ...

WEDGE-BASED HEAT SWITCH USING TEMPERATURE ACTIVATED PHASE TRANSITION MATERIAL

A wedge-based heat switch includes a plurality of wedge segments on a shaft, an energy storage element (e.g., a spring or pressurized cavity) configured to store (and release) energy via compression or expansion of the element along the shaft and a temperature activated phase transition material. A temperature stimulus activates the phase transition material to release the stored energy and move the wedge segments axially along the shaft to expand or contract the plurality of wedge segments. The wedge-based heat switch may be configured as a unidirectional switch, either conductive-to-insulating or insulating-to-conductive, or a bi-directional switch. The specific design of the wedge-based heat switch is informed by such factors as unidirectional or bi-directional, required preloading of a surface, conductance ratio between conducting and insulating states, temperature stimulus, switching speed and form factor. 1. A wedge-based heat switch , comprising:a plurality of thermally conductive wedge segments aligned on a shaft, said wedge segments configured to transmit axial motion of the wedge segments along the shaft into radial displacement of at least one wedge segment to contract or expand the plurality of wedge segments to make or break thermal contact between first and second surfaces to provide a thermally conducting state or a thermally insulating state;one or more energy storage elements configured to store energy through compression or expansion along the shaft to provide a force to produce axial motion of the wedge segments along the shaft; anda phase transition material configured to passively activate based on a temperature stimulus to release the energy stored in the one or more energy storage elements.2. The wedge-based heat switch of claim 1 , wherein the heat switch is configured to switch states in less than one minute claim 1 , to produce a contact pressure at the first and second surfaces of at least 40 psi claim 1 , and to exhibit a conductance ...

HEAT-DISSIPATING STRUCTURE FOR OPTICAL ISOLATOR

The present invention includes a holding stay made of a heat conductive material that is the same as that of an isolator holder, the holding stay being in contact with a radiation stay made of a member having good thermal conductivity, the radiation stay being in contact with radiation fins extracted from the inside of the isolator holder through an external opening for extraction, columnar welded portions bond the holding stay and the isolator holder through openings for welding, the welded portions apply tensile force toward the isolator holder to the radiation stay via the holding stay, and the radiation stay presses the radiation fins by means of the above-described tensile force to be fixed to the isolator holder. 1. A heat-dissipating structure for an optical isolator , comprising:a cylindrical isolator holder that has a plurality of components configuring an optical isolator main body disposed thereinside and has an opening for extraction reaching the inside formed in an outer portion thereof;extracting members for radiation that are extracted from the inside of said isolator holder through the opening for extraction in the outer portion;a radiation stay that is made of a member having good thermal conductivity, is disposed on an outer side of said isolator holder to surround said isolator holder, and includes an abutting plate portion in contact with said extracting members for radiation;a holding stay in contact with the abutting plate portion of said radiation stay; andwelded portions bonding said holding stay and said isolator holder through openings for welding, whereinthe abutting plate portion is positioned between said isolator holder and said holding stay, the openings for welding are opened in the abutting plate portion in a passing-through state from a side of said holding stay toward a side of said isolator holder, the welded portions apply tensile force that draws said holding stay and said isolator holder, and the abutting plate portion presses ...

APPARATUS AND METHOD FOR HEAT SINK ASSEMBLY

A heat sink assembly uses a pin and a spring arrangement to bias a heat sink against an underlying support with an electrical component in between. A lock cap, mounted on a head of the pin, selectively engages a retainer formed beneath an upper end of a heat dissipating element or fin of the heat sink to precompress the spring. When the lock cap is engaged and the spring is precompressed, the pin may be attached to the underlying support without opposing the force of the spring. When the attachment is complete and the lock cap is disengaged, the spring is allowed to act against the head of the pin and the base of the heat sink to operatively bias the heat sink against the underlying support. 1. A heat sink assembly comprising:a retaining pin assembly; anda heat sink includinga base; anda plurality of heat dissipating elements extending at least generally vertically upwardly from the base;wherein one of the heat dissipating elements includes a retainer located beneath an upper end thereof for selective engagement with the retaining pin assembly, the retainer being horizontally offset relative to an overlying portion of the at least one heat dissipating element and configured to be selectively engaged by the retaining pin assembly; andwherein the base includes an opening configured to allow a portion of the retaining pin assembly to pass there through for connection to an underlying support.2. The heat sink assembly of claim 1 , wherein the retaining pin assembly includes a spring and a pin having a head and a body claim 1 , wherein the body passes through the opening of the heat sink claim 1 , wherein the spring is disposed around the body of the pin and over the base of the heat sink claim 1 , and wherein the spring is pre-compressed between the base and the head of the pin when the pin assembly engages the retainer on the heat dissipating element.3. The heat sink assembly of claim 2 , wherein the pin assembly further comprises a lock cap mounted on the head of the ...

MEMORY AUXILIARY HEAT TRANSFER STRUCTURE

A memory auxiliary heat transfer structure is correspondingly assembled with at least one memory unit and a water-cooling assembly. The memory auxiliary heat transfer structure includes a main body. The main body has a first end, a second end and a middle section. The middle section has a heated side and a contact side. The heated side is disposed corresponding to at least one chip disposed on the memory unit. The contact side is attached to and assembled with the water-cooling assembly. The memory auxiliary heat transfer structure serves to reduce the friction between the memory unit and the water-cooling assembly and fill the gap so as to reduce the heat resistance. 1. A memory auxiliary heat transfer structure correspondingly assembled with at least one memory unit and a water-cooling assembly , the memory auxiliary heat transfer structure comprising a main body , the main body having a first end , a second end and a middle section , two ends of the middle section extending to connect with the first and second ends , the middle section having a heated side and a contact side , the heated side being disposed corresponding to at least one chip disposed on the memory unit , the contact side being assembled with the water-cooling assembly.2. The memory auxiliary heat transfer structure as claimed in claim 1 , wherein the contact side has a wear-resistant layer claim 1 , the wear-resistant layer being formed on the contact side by means of electroplating claim 1 , surface treatment or coating.3. The memory auxiliary heat transfer structure as claimed in claim 1 , wherein the main body has elasticity claim 1 , whereby when an external force is applied to the middle section claim 1 , the middle section is tightly attached to a surface of the chip on the memory unit claim 1 , when the external force disappears claim 1 , the middle section being restored to its original state to separate from the surface of the chip on the memory unit.4. The memory auxiliary heat transfer ...

THERMAL RECTIFIER AND THERMAL RECTIFICATION UNIT

A thermal rectifier includes a first panel, a second panel, and a switching mechanism. The switching mechanism includes a first thermally conductive portion thermally connected to the first panel and a second thermally conductive portion thermally connected to the second panel. The switching mechanism switches, as at least one of the first thermally conductive portion or the second thermally conductive portion changes their shape or dimensions, from a heat radiation state to a heat insulation state, or vice versa. The heat radiation state is a state where the first thermally conductive portion and the second thermally conductive portion are thermally coupled together. The heat insulation state is a state where the first thermally conductive portion and the second thermally conductive portion are thermally isolated from each other. 1. A thermal rectifier comprising:a first panel;a second panel arranged to face the first panel; anda switching mechanism provided between the first panel and the second panel and configured to switch, according to respective temperatures of the first panel and the second panel, thermal conductivity between the first panel and the second panel,the switching mechanism including:a first thermally conductive portion thermally connected to the first panel; anda second thermally conductive portion thermally connected to the second panel,at least one of the first thermally conductive portion or the second thermally conductive portion having a property of changing their shape or dimensions as their own temperature varies,the switching mechanism being configured to, as at least one of the first thermally conductive portion or the second thermally conductive portion changes their shape or dimensions, switch from a heat radiation state where the first thermally conductive portion and the second thermally conductive portion are thermally coupled together to a heat insulation state where the first thermally conductive portion and the second thermally ...

THERMAL MANAGEMENT OF HIGH CAPACITY OPTICS IN DENSE ARRANGEMENTS

Presented herein is a plurality of arrangements of cold plates having interior chambers. The interior chamber includes a plurality of fins with a first fin zone and a second fin zone. The cold plate further includes a first fluid inlet and a first fluid outlet. The cold plates can be connected such that each cold plate allows unidirectional flow or counter flow configurations. Unidirectional flow or counter flow cold plates can be arranged in rows and in combination of rows. 1. A system comprising:a cage housing; and [ a first fin zone,', 'a second fin zone, and', 'a plurality of fins disposed in the first fin zone and the second fin zone,, 'an interior chamber, the interior chamber comprising, 'a first fluid inlet, and', 'a first fluid outlet., 'a plurality of plates disposed within the cage housing, each plate comprising2. The system of claim 1 , wherein each plate of the plurality of plates further comprises:a second fluid inlet; anda second fluid outlet,wherein the fins disposed in first fin zone have a first fin-density, and the fins disposed in the second fin zone have a second fin-density.3. The system of claim 2 , wherein the first fluid outlet of a first plate of the plurality of plates is fluidly coupled to the first fluid inlet of a second plate of the plurality of plates.4. The system of claim 3 , wherein the second fluid outlet of the first plate of the plurality of plates is fluidly coupled to the second fluid inlet of the second plate of the plurality of plates.5. The system of claim 4 , wherein one or more cage housings fit within a 1 rack unit (RU) or 2 RU form factor.6. The system of claim 2 , wherein each plate of the plurality of plates further comprises:a fluid barrier separating the first fin zone from the second fin zone, wherein the first fluid inlet and first fluid outlet are fluidly coupled to the first fin zone of the interior chamber, and the second fluid inlet and second fluid outlet are fluidly coupled to the second fin zone of the ...

Positioning assembly for computer radiator

A positioning assembly for a computer radiator contains: multiple first shank members, multiple resilient elements, and multiple second shank members. Each of the multiple first shank members includes a first head knob, a first extension, a locking rib, a shoulder, a slot, and an orifice, wherein an outer diameter of the first extension is less than the first head knob, and the locking rib is in a conical cylinder shape. Each of the multiple resilient elements is fitted on the first extension. Each of the multiple shank members includes a second head knob and a second extension extending downward from a bottom of the second head knob, wherein an outer diameter of the second extension is less than an inner diameter of the orifice so that the second extension is located on a lower end of the orifice after inserting into a top of the orifice. 1. A positioning assembly for a computer radiator comprising:multiple first shank members, each of the multiple first shank members including a first head knob, a first extension extending downward from a bottom of the first head knob, a locking rib extending outward from a lower end of the first extension, a shoulder defined between the locking rib and the first extension, a slot extending to the first extension from a bottom of the locking rib, and an orifice extending to a bottom of the slot from a top of the first head knob, wherein an outer diameter of the first extension is less than the first head knob, and the locking rib is in a conical cylinder shape;multiple resilient elements, each of the multiple resilient elements fitted on the first extension; andmultiple second shank members, each of the multiple shank members including a second head knob and a second extension extending downward from a bottom of the second head knob, wherein an outer diameter of the second extension is less than an inner diameter of the orifice so that the second extension is located on a lower end of the orifice after inserting into a top of the ...

THERMOSTATIC FAN CLUTCH FOR BLENDER NOISE REDUCTION AND MOTOR EFFICIENCY IMPROVEMENT

A blending apparatus includes a motor, a fan, and a thermostatic fan clutch. The fan is engaged with a secondary drive shaft of the motor and the thermostatic fan clutch engages the secondary drive shaft to cause the fan to rotate and disengages the secondary drive shaft to cause the fan to stop rotating. The thermostatic fan clutch also partially engages and/or partially disengages the secondary drive shaft to cause the fan to rotate at a controlled speed or an adjusted speed. In addition, the thermostatic fan clutch engages and/or disengages the secondary drive shaft based on a temperature of the motor. 1. A blending apparatus comprising: a motor , a fan , and a thermostatic fan clutch.2. The blending apparatus of claim 1 , wherein the fan is engaged with a secondary drive shaft of the motor and wherein the thermostatic fan clutch engages the secondary drive shaft to cause the fan to rotate.3. The blending apparatus of claim 1 , wherein the fan is engaged with a secondary drive shaft of the motor and wherein the thermostatic fan clutch disengages the secondary drive shaft to cause the fan to stop rotating.4. The blending apparatus of claim 1 , wherein the fan is engaged with a secondary drive shaft of the motor and wherein the thermostatic fan clutch partially engages the secondary drive shaft to cause the fan to rotate at a controlled speed or an adjusted speed.5. The blending apparatus of claim 1 , wherein the fan is engaged with a secondary drive shaft of the motor and wherein the thermostatic fan clutch partially disengages the secondary drive shaft to cause the fan to rotate at a controlled speed or an adjusted speed.6. The blending apparatus of claim 1 , wherein the fan is engaged with a secondary drive shaft of the motor and wherein the thermostatic fan clutch engages or disengages or both engages and disengages the secondary drive shaft based on a temperature of the motor.7. The blending apparatus of claim 6 , wherein the thermostatic fan clutch engages ...

HYDRONIC SPACE CONDITIONING AND WATER HEATING SYSTEMS WITH INTEGRATED DISINFECTING DEVICE

Embodiments of the present disclosure provide a system for disinfecting water for hydronic space conditioning and domestic hot water. The system includes a thermal storage tank, a disinfecting device and a control unit. The control unit monitors an outlet temperature of water exiting the thermal storage tank. Further, the control unit calculates a temperature difference between a temperature threshold limit associated with the disinfecting device and the outlet temperature. The control unit transmits a first signal to the disinfecting device when the temperature difference is a positive value. The first signal operates the disinfecting device in the activation mode for heating the water to provide anti-bacterial sanitation. The control unit transmits a second signal to the disinfecting device for deactivating the disinfecting device when the temperature difference is a negative value. The sanitized water from the disinfecting device is used for conditioning an enclosure and a domestic hot water. 1. A system , comprising:a thermal storage tank;a disinfecting device operatively coupled to the thermal storage tank; and monitor an outlet temperature of water exiting the thermal storage tank via a first set of temperature sensors mounted to the thermal storage tank,', 'calculate a temperature difference between a temperature threshold limit associated with the disinfecting device and the outlet temperature of the water exiting the thermal storage tank, and', wherein, a first signal is transmitted to the disinfecting device when the temperature difference is determined to be a positive value, wherein the first signal operates the disinfecting device in the activation mode for heating the water from the thermal storage tank to provide anti-bacterial sanitation, and', 'wherein a second signal is transmitted to the disinfecting device to operate the disinfecting device in the deactivation mode when the temperature difference is determined to be a negative value., 'operate ...

Heat-Insulating Member and Structure of Combustion Chamber for Engine

There are provided a heat-insulating member which enhances a thermal efficiency of an engine to enhance fuel efficiency, and a structure of a combustion chamber for the engine. A heat-insulating member includes a substrate , an insulating porous layer , and a surface dense layer . The substrate , the insulating porous layer and the surface dense layer are formed of a ceramic material. The surface dense layer has a porosity of 5% or less. Furthermore, the insulating porous layer has a larger porosity than the surface dense layer . The substrate sufficiently has a mechanical strength to exist in a self-supported manner. The heat-insulating member is fixed to a piston by mechanical fixing such as screwing or chemical fixing such as brazing. 1. A heat-insulating member comprising:a substrate formed of a ceramic material;an insulating porous layer formed of a ceramic material on the surface of the substrate; anda surface dense layer formed of a ceramic material on the surface of the insulating porous layer,wherein the surface dense layer has a porosity of 5% or less, andthe insulating porous layer has a larger porosity than the surface dense layer.2. The heat-insulating member according to claim 1 ,wherein the insulating porous layer and the substrate are formed of the ceramic material of a same composition or a similar composition.3. The heat-insulating member according to claim 1 ,wherein the insulating porous layer has pores of sizes of a nano-order.4. The heat-insulating member according to claim 1 ,wherein in the surface dense layer, a reflectance at a wavelength of 1.5 μm is larger than 0.5.5. The heat-insulating member according to claim 1 ,wherein in the surface dense layer, a radiation rate at a wavelength of 2.5 μm is larger than 0.5.6. The heat-insulating member according to claim 1 ,wherein the surface dense layer has a thickness of 20 μm or less.7. The heat-insulating member according to claim 1 ,wherein the insulating porous layer has a heat conductivity of ...

Thermal stand-off with tortuous solid-wall thermal conduction path

A thermal stand-off includes a rigid thermal stand-off section within a spatial region that extends along a distance between a first location and second, opposed location. The rigid thermal stand-off section includes a tortuous solid-wall thermal conduction path that extends from the first location to the second location. The tortuous solid-wall thermal conduction path is longer than the distance of the spatial region. The tortuous solid-wall thermal conduction path can include a tensile spring constant that is greater than a maximum tensile spring constant of a coil spring that fits in the same spatial region and is formed of the same material composition. The tortuous solid-wall thermal conduction path can include an antegrade section and, relative the antegrade section, a retrograde section.

THERMAL MANAGEMENT SYSTEMS INCORPORATING SHAPE MEMORY ALLOY ACTUATORS AND RELATED METHODS

Thermal management systems incorporating shape memory alloy (SMA) actuators and related methods. A thermal management system includes a heat transfer region, a process fluid conduit, a thermal management fluid conduit, and an SMA actuator assembly. The SMA actuator assembly includes an SMA element coupled to an actuation element, which is configured to assume a position among a plurality of positions defined between a restrictive position and an open position. The position of the actuation element is based, at least in part, on a conformation of the SMA element. A method of passively regulating a temperature of a process fluid includes conveying a process fluid stream in heat exchange relation with an SMA element, transitioning the SMA element to assume a conformation, flowing each of the process fluid stream and a thermal management fluid stream through a heat transfer region, and modulating a flow rate of the thermal management fluid stream. 1. A thermal management system configured to regulate a temperature of a process fluid via thermal exchange between the process fluid and a thermal management fluid , the thermal management system comprising:a heat transfer region within which the thermal exchange between the process fluid and the thermal management fluid occurs;a process fluid conduit configured to convey a process fluid stream of the process fluid in heat exchange relation with the heat transfer region;a thermal management fluid conduit configured to convey a thermal management fluid stream of the thermal management fluid in heat exchange relation with the heat transfer region; anda shape memory alloy (SMA) actuator assembly configured to selectively regulate a flow rate of the thermal management fluid stream, the SMA actuator assembly including:(i) an SMA element in thermal contact with the process fluid stream and configured to assume a conformation among a plurality of conformations, wherein the conformation of the SMA element is based, at least in part, ...

SUPERCONDUCTING ELECTRICAL MACHINE WITH DOUBLE RE-ENTRANT ENDS FOR MINIMIZING HEAT LEAK

A superconducting electrical machine includes at least one re-entrant end including at least two segments. The at least two segments are continuous. At least one re-entrant end may be included in a stator of the superconducting electrical machine, the stator being disposed substantially coannular with a longitudinal axis. At least one re-entrant end may also be included in a rotor of the superconducting electrical machine, the rotor being configured to rotate about a longitudinal axis. A first segment is substantially perpendicular to a plane parallel to the longitudinal axis, and a second segment is coannular with the longitudinal axis. Heat distal from rotor windings and/or stator windings encounters a thermal resistance provided by the at least two segments as the heat travels towards the rotor windings and/or stator windings. 1. A superconducting electrical machine , comprising: a rotor winding configured to superconduct when a temperature of the rotor winding is no greater than a superconducting temperature;', 'a drive end;', 'a non-drive end; and', 'at least two rotor segments, wherein the rotor segments are continuous, a first rotor segment is substantially perpendicular to a plane parallel to the longitudinal axis, and a second rotor segment is coannular with the longitudinal axis;', 'two re-entrant ends, of which a first re-entrant end is disposed proximate to the drive end, and a second re-entrant end is disposed proximate to the non-drive end, each of the two re-entrant ends comprising], 'a rotor configured to rotate about a longitudinal axis, the rotor comprisingwherein heat distal from the rotor winding encounters thermal resistance provided by the at least one re-entrant end as the heat travels towards the rotor winding.2. The superconducting electrical machine of claim 1 , wherein each re-entrant end further comprises a third rotor segment and a fourth rotor segment claim 1 , wherein the third rotor segment is substantially perpendicular to a plane ...

THERMAL CONDUCTIVITY CONTROL DEVICES

A system for controlling thermal conductivity between two thermal masses is disclosed. The system includes a first conduction body in thermal contact with a heat source and a second conduction body in contact with a heat sink. A thermal expansion component operatively connects to the first conduction body and moves the body between first and second positions at a predetermined temperature. In the first position the first conduction body is spaced apart from the second conduction body, thermally isolating the heat source from the heat sink. In the second position the first conduction body thermally contacts the second conduction body, and conducts heat from the heat source, through the conduction bodies and into the heat sink. Related methods are also described. 1. A system for controlling thermal conductivity between two thermal masses comprising:a first conduction body configured and adapted for thermal contact with a heat source;a second conduction body configured and adapted for thermal contact with a heat sink; anda thermal expansion component operatively connected to move the first conduction body between a first position in which the first conduction body is spaced apart from the second conduction body for thermal isolation of the heat source and heat sink, and a second position in which the first conduction body is in thermal contact with the second conduction body for conduction of heat from the heat source, through the conduction bodies, and into the heat sink,wherein the thermal expansion component is configured and adapted to move the first conduction body into the second position at a predetermined temperature.2. A system as recited in claim 1 , wherein the first and second positions of the first conduction body define a direction of motion claim 1 , and wherein the first and second conduction bodies each have a wedge face oblique with respect to the direction of motion.3. A system as recited in claim 1 , wherein the thermal expansion component includes ...

TEMPERATURE CONTROL APPARATUS

The present invention relates generally to a temperature control apparatus capable of controlling the temperature of a product using a temperature control material. More particularly, the present invention relates to a temperature control apparatus capable of uniformly controlling the temperature of a product by reducing a temperature deviation of a temperature control material flowing inside the product. 1. A temperature control apparatus , comprising:a flow path line being in communication with an inside of a temperature control object;a first operating part coupled to a first end of the flow path line;a second operating part coupled to a second end of the flow path line; anda heat source part supplying heat energy to or depriving the heat energy of a temperature control medium of the flow path line,wherein the temperature control medium controls a temperature of the temperature control object while flowing bidirectionally in the flow path line by operation of the first and second operating parts.2. The temperature control apparatus of claim 1 , wherein the first and second operating parts are piston pumps.3. The temperature control apparatus of claim 2 , wherein an air layer is provided between an end of each of the piston pumps and the temperature control medium.4. The temperature control apparatus of claim 1 , wherein the heat source part comprises a first heat source part provided on the flow path line between the first operating part and the temperature control object.5. The temperature control apparatus of claim 1 , wherein the heat source part comprises a second heat source part provided on the flow path line between the second operating part and the temperature control object.6. The temperature control apparatus of claim 1 , wherein the heat source part is provided on an outside of the flow path line.7. The temperature control apparatus of claim 1 , further comprising:a buffer chamber provided on each of the flow path line between the first operating part ...

Thin Heat Transfer Device for Thermal Management

A thin design heat transfer device for thermal management is described herein. The heat transfer device uses a cold plate that is independent or “floating” relative to a spring mechanism employed to generate contact pressure with a heat-generating device. A bridge component associated with the spring mechanism is designed to span over the cold plate and contact the cold plate when the spring deforms, which therefore allows the cold plate to be independent of the spring mechanism. The independence between the cold plate and the spring mechanism enables deformation in the spring mechanism to drive contact pressure while eliminating or reducing corresponding deformation in the cold plate. Consequently, components of the heat transfer device may be made relatively thin and have less stiffness than traditional designs, but still provide acceptable contact pressure and quality for effective thermal management. 1. A heat transfer device (comprising:a spring mechanism having a cutout to receive a cold plate, the cold plate configured to operate as a heat transfer surface for heat exchange with a heat-generating device;a spring bridge fastened to the spring mechanism and having a bridge portion configured to span the cold plate, the spring bridge configured to apply contact pressure to the cold plate responsive to deformation of the spring mechanism to affect engagement of the cold plate with the heat-generating device; andthe cold plate situated within the cutout and underneath the bridge portion of the spring bridge, the cold plate being unattached to the spring mechanism and the spring bridge.2. A heat transfer device as described in claim 1 , further comprising a heat-expelling device connected to the cold plate to convey heat away from the heat-generating device.3. A heat transfer device as described in claim 2 , wherein the heat-expelling device comprises a heat pipe configured to transfer heat using thermal conductivity.4. A heat transfer device as described in claim ...

Thermal Switch

A thermal switch having an on-state and an off-state is provided. First and second plates are composed from a thermally conductive material. The first and second plates are connected to form an internal cavity having a channel defining a gap between the first and second plate. The first reservoir is coupled to the channel and contains a thermally conductive liquid. The actuator is coupled to the first reservoir and the channel and is moveable between a first state and a second state corresponding to the on-state and the off-state of the thermal switch, respectively. Thermally conductive liquid is allowed to flow from the first reservoir to the channel when the actuator is in the first state and allowed to flow from the channel to the first reservoir when the actuator is in the second state. 1. A thermal device for controlling a temperature associated with a controlled component , comprising:a thermal switch having an on-state and an off-state; and,a heat sink, the thermal switch further including:a first plate being composed from a thermally conductive material and being thermally coupled to the controlled component;a second plate being composed from a thermally conductive material, the first and second plates being connected to form an internal cavity having a channel defining a gap between the first and second plate, the heat sink being coupled to the second plate;a first reservoir coupled to the channel, the first reservoir containing a thermally conductive liquid; and,an actuator coupled to the first reservoir and the channel, the actuator being moveable between a first state and a second state corresponding to the on-state and the off-state of the thermal switch, respectively, and being configured to allow the thermally conductive liquid to flow from the reservoir to the channel when the actuator is in the first state and to allow the thermally conductive liquid to flow from the channel to the first reservoir when the actuator is in the second state.2. A ...

Heat Dissipation Device and Control Method Thereof, Terminal

A heat dissipation device, a terminal, and a method for controlling a heat dissipation device are provided. The heat dissipation device includes a first conductive layer and a second conductive layer disposed opposite to each other, and a power supply control circuit coupled with the first conductive layer and the second conductive layer. The first conductive layer is made of a thermal conductive material. The power supply control circuit is configured to alternately apply, between the first conductive layer and the second conductive layer, a first electric field and a second electric field which are in opposite directions. 1. A heat dissipation device , comprising:a first conductive layer and a second conductive layer disposed opposite to each other, and the first conductive layer being made of a thermal conductive material; anda power supply control circuit, coupled with the first conductive layer and the second conductive layer and configured to alternately apply, between the first conductive layer and the second conductive layer, a first electric field and a second electric field which are in opposite directions.2. The heat dissipation device of claim 1 , further comprising:an insulating layer, disposed between the first conductive layer and the second conductive layer.3. The heat dissipation device of claim 2 , wherein the insulating layer is made of a polymer material.4. The heat dissipation device of claim 1 , wherein the power supply control circuit is configured to alternately:apply the first electric field between the first conductive layer and the second conductive layer until an electric field strength of the first electric field reaches a preset first threshold; andapply the second electric field between the first conductive layer and the second conductive layer until an electric field strength of the second electric field reaches a preset second threshold.5. The heat dissipation device of claim 4 , further comprising:a sensor with one end coupled to ...

REFRACTORY FOR HEATING SYSTEM

A refractory panel for a heat exchanger is provided having a body including a first planar surface having a plurality of refractory openings formed therein. A sidewall is arranged about a periphery of at least one of the plurality of refractory openings. The sidewall extends outwardly from the first planar surface and is configured to extend through an adjacent component into an inlet of a heat exchanger coil. 1. A refractory panel for a heat exchanger , comprising:a body including a first planar surface having a plurality of refractory openings formed therein; anda sidewall arranged about a periphery of at least one of the plurality of refractory openings, the sidewall extending outwardly from the first planar surface and being configured to extend through an adjacent component into an inlet of a heat exchanger coil.2. The refractory panel according to claim 1 , wherein the at least one sidewall is integrally formed with the first planar surface.3. The refractory panel according to claim 1 , wherein the body and at least one sidewall are formed via a vacuum molding process.4. The refractory panel according to claim 1 , wherein a size and shape of the refractory panel is generally complementary to the adjacent component.5. The refractory panel according to claim 1 , wherein the geometry of each refractory opening and sidewall is selected to encourage fluid flow towards the heat exchanger inlet.6. The refractory panel according to claim 1 , wherein the refractory panel is formed from a material configured to withstand a temperature of at least about 2300° F.7. A furnace comprising:a heat exchanger including a plurality of coils; and one or more burners disposed at and substantially aligned with one or more burner openings of the heat exchanger;', 'a partition plate including one or more partition openings substantially aligned with the one or more burner openings of the heat exchanger;', 'an inner box including one or more cell openings substantially aligned with the ...

Thermal Conduction Device and Associated Heat Dissipation System

This thermal conduction device intended to be installed between a first heat source part and a second heat dissipation part, comprises a male element comprising a protruding part relative to a base and a female element comprising an inner wall defining a housing for receiving the protruding part. The male element is configured to exert a radial force against the inner wall when the thermal conduction device is installed between the first heat source part and the second heat dissipation part so as to improve the thermal conduction between the male element and the female element. 2. The thermal conduction device according to claim 1 , wherein the male element and the female element have different respective overall thermal expansion coefficients claim 1 , such that when the temperature of the conduction device is above a predetermined threshold claim 1 , the protruding part exerts the radial force against the inner wall.3. The thermal conduction device according to claim 1 , wherein the protruding part is able to be moved in the receiving housing of the protruding part claim 1 , along a central axis of the housing claim 1 , by applying a compression force between the base and the base plate claim 1 , such that the distance between the base and the base plate is able to be modified by applying the compression force.4. The thermal conduction device according to claim 1 , wherein the protruding part is able to be moved in the receiving housing of the protruding part along a central axis of the housing claim 1 , and wherein the thermal conduction device comprises a pressing member able to exert a first bearing force claim 1 , respectively a second bearing force opposite one another claim 1 , on the male element and on the female element.5. The thermal conduction device according to claim 4 , wherein the pressing member is a spring extending between the base and the base plate along the central axis.6. The thermal conduction device according to claim 3 , wherein the device ...

SYSTEMS AND METHODS FOR HEAT SHIELD ASSEMBLIES

Systems and methods disclosed herein may be useful for aircraft heat shield assemblies. In this regard, a heat shield assembly is provided comprising a heat shield having an aperture, the aperture comprising an end portion and an insertion portion, the insertion portion having a width larger than the end portion, a spacer comprising an upper portion, an undermount flange and a gap between the upper portion and the undermount flange, wherein a surface of the gap is engaged with the heat shield, and wherein the undermount flange has a width less than the insertion portion of the aperture and greater than the width of the end portion. 14-. (canceled)5. A heat shield spacer comprising:an upper portion having a first width;an undermount flange having a second width, wherein the second width is less than the first width; and 'wherein the gap extends along a length of the spacer and along a terminus of the spacer.', 'a gap between the upper portion and the undermount flange, wherein the gap has a third width, wherein the third width is less than the first width and the second width,'}6. The heat shield spacer of claim 5 , wherein the spacer comprises at least one of rubber and silicone.7. The heat shield spacer of claim 5 , wherein the spacer is formed by injection molding.8. The heat shield spacer of claim 5 , further comprising a second upper portion adjacent to a second undermount flange.9. The heat shield spacer of claim 5 , further comprising an extension portion.10. The heat shield spacer of claim 9 , wherein the upper portion is affixed to the undermount flange by at least one of glue and a fastener.11. The heat shield spacer of claim 8 , wherein the undermount flange and upper portion are located at a distal terminus of the spacer.12. The heat shield spacer of claim 11 , wherein the second undermount flange and second upper portion are located at a proximal terminus of the spacer.13. The heat shield spacer of claim 12 , wherein the spacer comprises a middle portion ...

STANDARDIZED HOT-PLUGGABLE TRANSCEIVING UNIT WITH HEAT DISSIPATION CAPABILITIES

Transceiving unit with heat dissipation capabilities. The transceiving unit comprises a housing adapted to being inserted into a port of a hosting unit, the housing defining a top surface. The transceiving unit comprises a rear connector located on a back panel of the housing. The transceiving unit comprises at least one electronic component located inside the housing. The transceiving unit comprises an insert disposed along the top surface of the housing, the insert passively extracting heat generated by the at least one electronic component located inside the housing. Alternatively or complementarily to the insert, the transceiving unit comprises a heat sink integrated to a front panel of the housing for passively extracting heat generated by the at least one electronic component located inside the housing. In a particular aspect, the transceiving unit is a standardized hot-pluggable transceiving unit, the housing having standardized dimensions. 1. A transceiving unit comprising:a housing adapted to being inserted into a chassis of a hosting unit, the housing defining a top surface;at least one electronic component located inside the housing;an insert disposed along the top surface of the housing, the insert passively extracting heat generated by the at least one electronic component located inside the housing; anda rear connector located on a back panel of the housing.2. The transceiving unit of claim 1 , wherein the insert is made of copper claim 1 , silver claim 1 , graphite claim 1 , gold claim 1 , platinum claim 1 , or an alloy of a combination thereof.3. The transceiving unit of claim 1 , wherein the insert is integral to the top surface of the housing.4. The transceiving unit of claim 3 , wherein the top surface of the housing is entirely made of the insert.5. The transceiving unit of claim 1 , wherein the insert is affixed above the top surface of the housing.6. The transceiving unit of claim 1 , wherein the transceiving unit is a standardized hot- ...

THERMAL CONDUCTIVE CYLINDER INSTALLED WITH U-TYPE CORE PIPING AND LOOP PIPING

The present invention relates to a thermal conductive cylinder installed with U-type core piping and loop piping for being installed within natural thermal storage body or artifical thermal storage body; wherein the piping segments of fluid inlet terminal and/or outlet terminal of the U-type core piping and loop piping are directly made of thermal insulating material, or thermal insulating structure is installed between the inlet terminal and the outlet terminal; so as to prevent thermal energy loss between adjacent piping segments on the same side when thermal conductive fluid with temperature difference passing through. 1500. A thermal conductive cylinder for being installed within a thermal storage body () composed of a natural thermal storage body , the natural thermal storage body including one of a shallow surface of the earth , a body of water , and artificial objects in a solid , gaseous , or liquid state;{'b': 100', '100, 'wherein the thermal conductive cylinder is installed with a plurality of U-type core piping () and constructed so that a thermal insulation is present between a fluid inlet terminal and a fluid outlet terminal of each of the plurality of U-type piping () so as to prevent thermal energy loss because of thermal conduction between adjacent piping segments of the inlet terminal and the outlet terminal on a same side when thermal conductive fluid with a temperature difference passes through;'}{'b': 100', '111, 'wherein each of the plurality of U-type piping () is used for one or more of the following types of thermal conductive fluid () passing through, including1) liquid state fluid;2) gaseous state fluid;3) liquid to gaseous state fluid; and4) gaseous to liquid state fluid,wherein two or more radially arranged U-type piping sections are installed within the thermal conductive cylinder and the two or more radially arranged U-type piping sections are discrete from and have interior flowpaths that are not in communication with each other within ...

MULTIPLE HEATSINK COOLING SYSTEM FOR A LINE VOLTAGE THERMOSTAT

A line voltage thermostat having a multiple heatsink switch. A total switch may have a semiconductor switch mounted on each heatsink of the multiple heatsink switch. The semiconductor switches of the respective heatsinks may be connected in parallel to represent the total switch. Each of the two or more heatsinks, having a semiconductor switch for switching, and in total conveying the same power as one equivalent switch with one total heatsink, may have higher maximum operating temperatures and higher thermal resistances than twice the thermal resistance of the one total heatsink. The two or more heatsinks may be situated within a housing of the line voltage thermostat, and be easier to distribute in the housing to achieve an efficient layout of a display and control buttons for the thermostat. 1. A thermostat for controlling an electric heater comprising:a housing;a display positioned in the housing;a temperature setpoint device disposed within the housing;an ambient temperature sensor;a comparator mechanism disposed within the housing, the comparator mechanism connected to the ambient temperature sensor and the temperature setpoint device;a power switch positioned within the housing, the power switch having a control terminal connected to the comparator mechanism; andwherein the power switch comprises:two or more separate heatsinks;a solid state switch situated on each heatsink; andwherein each solid state switch has a control input connected in parallel to the control terminal of the power switch.2. The thermostat of claim 1 , wherein the ambient temperature sensor is for indicating a temperature of a space containing an electric heater connected to the power switch claim 1 , and for providing an output signal to the control terminal of the power switch or no output signal to the control terminal of the power switch.3. The thermostat of claim 1 , wherein:the comparator mechanism compares a first temperature indication from the ambient temperature sensor and a ...

HEAT EXCHANGER AND TURBINE ENGINE COMPRISING SUCH AN EXCHANGER

The invention relates to a heat exchanger () for heat-exchange between a first fluid and a second fluid, comprising a membrane separating the two fluids and a heat-conductive element () in thermal contact with the membrane and with the first fluid, characterised in that said heat-conductive element () moves between an active position and an inactive position, such that the capacity of heat exchange with the first fluid is weaker in the inactive position than in the active position. The exchanger is applied, in particular, for the cooling of fluid in the secondary stream of a turbofan. 117. A heat exchanger for heat exchange between a first fluid and a second fluid , comprising a membrane separating the two fluids and a heat-conductive element in thermal contact with both the membrane and the first fluid , said heat-conductive element () being movable between an active position and an inactive position such that the capacity of heat exchange with the first fluid is less in the inactive position than in the active position , wherein said element is prestressed in the active position and the transition from the active position to the inactive position is achieved by buckling of the membrane.2. The heat exchanger according to claim 1 , wherein the heat-conductive element is in the form of a blade) claim 1 , the blade being rigidly connected to the membrane by a connecting edge and claim 1 , in the active position claim 1 , moved away from the membrane so as to be in contact with the first fluid by the two faces thereof.3. The heat exchanger according to claim 2 , wherein in the inactive position the blade is arranged by one face close to the membrane.4. The heat exchanger according to claim 2 , wherein in the active position the blade has a curved shape which moves away from the membrane at the connecting edge.5. The heat exchanger according to claim 4 , wherein the connecting edge is rectilinear and the blade is curved around the connecting edge in the active position. ...

Method For Configuring The Size Of A Heat Transfer Surface

A method is disclosed for producing a heat exchanger having at least one heat transfer surface, wherein the heat is used in a thermodynamic process that uses a fluid that is condensed, expanded, evaporated, and compressed in a cycle process. The area of the heat transfer surface may be dimensioned with respect to a minimum surface area measurement of the heat transfer surface, the minimum surface area measurement being required at least for transmitting a minimum heat quantity to the fluid used with the heat exchanger in order to prevent a condensation of the fluid before, during, and after the compression process. The area of the heat transfer surface may be dimensioned based on a correlation between the molar mass of the fluid and the minimum surface area measurement of the heat transfer surface. 1. A method for producing a heat exchanger to be used in a thermodynamic process that uses a fluid that is condensed , expanded , evaporated and compressed in a cycle process , determining a minimum surface area of the heat transfer surface, the minimum surface area enabling a defined minimum amount of heat transfer to the fluid to be used with the heat exchanger during the thermodynamic process in order to prevent condensation of the fluid before, after, and during the compression of the fluid in the cycle process,', 'performing a correlation between the molar mass of the fluid and the determined minimum surface area of the heat transfer surface, and', 'selecting the surface size of the heat transfer surface based at least on the determined minimum surface area and the correlation between the molar mass of the fluid and the determined minimum surface area, and, 'selecting a surface size of a heat transfer surface of the heat exchanger, includingproducing the heat exchanger with the heat transfer surface having the selected size.2. The method of claim 1 , wherein the molar mass of the fluid is initially correlated with an inverse slope of a saturated vapor line of the ...

TEMPERATURE-UNIFORMING PLATE WITH SUPPORTING EFFECT

A temperature-uniforming plate with supporting effect includes a base plate and a cover plate mounted onto the base plate, wherein a frame is sandwiched between the base plate and the cover plate to define a vacuum chamber among the base plate, the cover plate and the frame. The frame has two arms inwardly extending therefrom and extending to a heat conducting area formed on the base plate. A passage is defined between the two arms. The two arms are clamped between a top surface of the base plane and a bottom surface of the cover plate. The temperature-uniforming plate has a thinning and simplified structure for easily formed, reducing manufacturing cost and providing a supporting effect. 1. A temperature-uniforming plate comprising:a base plate formed with a heat conducting surface and a inside surface, wherein a contacting area is formed on the heat conducting surface and adapted to be abutted a heat source;a cover plate mounted onto the base plate, the cover plate formed with a top surface and a bottom surface;a frame sandwiched between the inside surface of the base plate and the bottom surface of the cover plate;a vacuum chamber defined among the inside surface of the base plate, the bottom surface of the cover plate and an interior of the frame, wherein the vacuum chamber is provided for containing coolant; at least one capillary structure and at least one supporting structure disposed in the vacuum chamber, wherein the at least one supporting structure has two opposite ends respectively abutting against the inside surface of the base plate and the bottom surface of the cover plate;two arms respectively extending from the interior of the frame and corresponding to each other, wherein each arm has a distal end separated from each other, the two arms sandwiched between the inside surface of the base plate and the bottom surface of the cover plate; anda passage defined between the two distal ends of the two arms, the distal end of each of the two arms situated ...

Heat sink fixing member and electronic device

A heat sink fixing member includes a frame that is provided above a board of a unit and surrounds a first electronic component and a first heat sink; and a blade in which both end parts are connected to the frame, a portion between the both end parts is erected in a gap in a first fin group, and a side closer to the board in the portion abuts on a first base plate, wherein the unit includes: the board; the first electronic component mounted on the board; and the first heat sink that is provided on the first electronic component, and has the first base plate and the first fin group that protrudes from the first base plate.

HEAT CONDUCTION DEVICE

A heat conduction device includes a heat source portion, a temperature control surface, and heat transfer portions. The heat source portion is configured to generate at least hot heat or cold heat. The temperature control surface is sectioned into a plurality of temperature control sections, and at least some of the plurality of temperature control sections are disposed away from the heat source portion. The plurality of heat transfer portions connect the heat source portion and the plurality of the temperature control sections to transfer heat between the heat source portion and the plurality of temperature control sections. The plurality of temperature control sections are separated from each other based on a distance from the heat source portion.

THERMAL SWITCH

A thermal switch having an on-state and an off-state is provided. First and second plates are composed from a thermally conductive material. The first and second plates are connected to form an internal cavity having a channel defining a gap between the first and second plate. The first reservoir is coupled to the channel and contains a thermally conductive liquid. The actuator is coupled to the first reservoir and the channel and is moveable between a first state and a second state corresponding to the on-state and the off-state of the thermal switch, respectively. Thermally conductive liquid is allowed to flow from the first reservoir to the channel when the actuator is in the first state and allowed to flow from the channel to the first reservoir when the actuator is in the second state. 1. A thermal switch having an on-state and an off-state , comprising:a first plate being composed from a thermally conductive material;a second plate being composed from a thermally conductive material, the first and second plates being connected to form an internal cavity having a channel defining a gap between the first and second plate;a first reservoir coupled to the channel, the first reservoir containing a thermally conductive liquid; and,an actuator coupled to the first reservoir and the channel, the actuator being moveable between a first state and a second state corresponding to the on-state and the off-state of the thermal switch, respectively, and being configured to allow the thermally conductive liquid to flow from the first reservoir to the channel when the actuator is in the first state and to allow the thermally conductive liquid to flow from the channel to the first reservoir when the actuator is in the second state.2. A thermal switch claim 1 , as set forth in claim 1 , wherein the gap is configured such that the thermally conductive liquid flows from the channel to the first reservoir at least in part by surface tension of the thermally conductive liquid.3. A ...

HEAT SINK FOR PLUG-IN CARD, PLUG-IN CARD INCLUDING HEAT SINK, AND ASSOCIATED MANUFACTURING METHOD

Various embodiments of the present disclosure provide a heat sink for a plug-in card and a plug-in card including the heat sink. The heat sink comprises a first part secured to a surface of the plug-in card and a second part coupled to the first part and being movable relative to the first part in a first direction, wherein the first direction is perpendicular to the surface of the plug-in card. In this way, when the second part and the first part have a larger overlap in the first direction, the heat sink has a smaller first height and when the second part and the first part have a smaller overlap in the first direction, the heat sink has a greater second height.

HEAT DISSIPATION DEVICE FOR A MULTIMEDIA CONTROL UNIT

A heat dissipation device comprises a generally rectangular metal cooling plate; the metal plate comprises, on its upper face, first attachment means for attaching a first printed circuit board, which means are provided for bringing at least one heat-generating zone of the first printed circuit board to bear with the upper face of the plate; the metal plate comprises, on its lower face, second attachment means for attaching a second printed circuit board, which means are provided for bringing at least one heat-generating zone of the second printed circuit board to bear with the lower face of the plate.

METHOD FOR OPERATING AN OVEN APPLIANCE AND A CONTROL SYSTEM FOR AN OVEN APPLIANCE

A method for operating an oven appliance includes establishing a set temperature, operating a heating element of the oven appliance in order to heat a cooking chamber of the oven appliance to a target temperature with the heating element, and continually reducing the target temperature to the set temperature. A related control system for an oven appliance is also provided. 1. A method for operating an oven appliance , comprising:establishing a set temperature for a cooking operation of the oven appliance;determining a preheating cycle exit temperature for the cooking operation of the oven appliance based at least in part on the set temperature;initiating a preheating cycle of the oven appliance;operating heating elements of the oven appliance during the preheating cycle in order to heat the cooking chamber of the oven appliance to the preheating cycle exit temperature with the heating elements, the preheating cycle exit temperature being greater than the set temperature; andcontinually reducing a target temperature of the oven appliance to the set temperature after a temperature of the cooking chamber exceeds the preheating cycle exit temperature.2. The method of claim 1 , wherein said step of continually reducing comprises linearly reducing the target temperature to the set temperature.3. The method of claim 1 , wherein said step of continually reducing comprises continually reducing the target temperature to the set temperature over a period of time.4. The method of claim 3 , wherein the period of time is at least ten minutes.5. The method of claim 1 , wherein the temperature of the cooking chamber of the oven appliance does not drop below the set temperature during said step of continually reducing.6. The method of claim 1 , wherein the target temperature is at least ten degrees Celsius greater than the set temperature at a start of the preheating cycle.7. The method of claim 1 , wherein the heating elements of the oven appliance heat the cooking chamber of the ...

SELF-ADJUSTING COOLING MODULE

A cooling apparatus includes first and second wedges, a solid thermal interface material (TIM) and a flexible force-exerting element. The first wedge has a first flat surface and a first diagonal surface. The first flat surface is configured to dissipate heat from an electronic device. The second wedge has a second flat surface and a second diagonal surface. The second diagonal surface faces the first diagonal surface, and the second flat surface is coupled to a heat sink and configured to dissipate heat thereto. The TIM is disposed between the first and second diagonal surfaces, and is configured to transfer heat between the first and second wedges. The force-exerting element is configured to move the first wedge or the second wedge, so as to slide the first diagonal surface or the second diagonal surface on the TIM and push the second flat surface against the heat sink. 1. A cooling apparatus , comprising:a first wedge having a first flat surface and a first diagonal surface, wherein the first flat surface is coupled to an electronic device and configured to dissipate heat therefrom;a second wedge having a second flat surface and a second diagonal surface, wherein the second diagonal surface faces the first diagonal surface of the first wedge, and the second flat surface is coupled to a heat sink and configured to dissipate heat thereto;a solid thermal interface material (TIM) disposed between the first and second diagonal surfaces and configured to transfer heat between the first and second wedges; anda flexible force-exerting element, which is configured to move the first wedge or the second wedge, so as to slide the first diagonal surface or the second diagonal surface on the TIM and push the second flat surface against the heat sink.2. The cooling apparatus according to claim 1 , wherein the flexible force-exerting element comprises one or more compression or leaf springs claim 1 , which are coupled to the first wedge or to the second wedge.3. The cooling ...

HEAT DISSIPATION DEVICE

This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel. 1. A heat dissipation device , configured to be in thermal contact with a heat source , the heat dissipation device comprising:a heat dissipation body, having at least one vertical channel and configured to be in thermal contact with the heat source; anda cover plate, comprising a first layer and a second layer that are stacked on each other, wherein the first layer is stacked on the heat dissipation body and covers the at least one vertical channel;wherein, a thermal conductivity of the first layer is larger than a thermal conductivity of the second layer, and the cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.2. The heat dissipation device according to claim 1 , wherein the thermal conductivity of the first layer is at least twenty times higher than the thermal conductivity of the second layer.3. The heat dissipation device according to claim 2 , wherein the thermal conductivity of the first layer is at least one hundred times higher than the thermal conductivity of the second layer.4. The heat dissipation device according to claim 1 , wherein an extension direction of the at least ...

HEAT DISSIPATION STRUCTURE

A heat dissipation structure includes a heat dissipation portion and a heat storage portion. The heat dissipation portion has the heat receiving surface including the contact surface in contact with the semiconductor generating the heat, and dissipates the heat of the semiconductor in contact with the contact surface. The heat storage portion is arranged to sandwich the semiconductor. The heat storage portion has, for example, the heat storage opening portion in which the semiconductor is positioned, and surrounds the semiconductor. The heat storage portion is provided to he in contact with the heat receiving surface, and stores the heat of the semiconductor conducted through the heat dissipation portion. 1. A heat dissipation structure comprising:a heat dissipation portion that has a heat receiving surface including a contact surface in contact with an electronic component generating heat and dissipates the heat of the electronic component in contact with the contact surface; anda heat storage portion that is arranged to sandwich the electronic component, is provided to be in contact with the heat receiving surface, and stores the heat of the electronic component conducted through the heat dissipation portion.2. The heat dissipation structure according to claim 1 , further comprising:a heat conductive member that is provided between the electronic component and the heat storage portion, and the heat receiving surface.3. The heat dissipation structure according to claim 1 , further comprising:a housing that accommodates the heat storage portion and the electronic component, whereinthe heat storage portion has a heat storage opening portion in which the electronic component is positioned and surrounds the electronic component,the heat storage portion is assembled from one side in an axial direction of the heat storage opening portion to the housing and the electronic component is assembled from the other side in the axial direction to the housing, andthe housing ...