Настройки

Укажите год
-

Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

Подробнее
-

Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

Подробнее

Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
Ведите корректный номера.
Ведите корректный номера.
Ведите корректный номера.
Ведите корректный номера.
Укажите год
Укажите год
Применить Всего найдено 4727. Отображено 100.
12-04-2017 дата публикации

Нагреватель электрический плоский

Номер: RU0000170028U1
Автор: Радий Борисович Мальнев
Принадлежит: Радий Борисович Мальнев

Полезная модель относится к электроэнергетике и теплотехнике и может быть использована для обогрева технологического оборудования, такого как бункеры, утепленные контейнеры, блок-боксы. Нагреватель предназначен для работы в обычных и взрывоопасных средах. Нагреватель состоит из корпуса, в котором расположен датчик температуры. Под крышкой корпуса размещен теплоизоляционный слой. Вдоль корпуса размещен зигзагообразный нагревательный элемент, в котором установлена металлическая сетка, отделенная от теплоизоляционного слоя отражающим слоем. По периметру верхней части корпуса приварена прижимная планка. Между крышкой и прижимной планкой расположена термостойкая прокладка. Технический результат - увеличение тепловой мощности. 3 ил. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 170 028 U1 (51) МПК H05B 3/26 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ФОРМУЛА ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ РОССИЙСКОЙ ФЕДЕРАЦИИ (21)(22) Заявка: 2016148749, 12.12.2016 (24) Дата начала отсчета срока действия патента: 12.12.2016 (72) Автор(ы): Мальнев Радий Борисович (RU) (73) Патентообладатель(и): Мальнев Радий Борисович (RU) 12.04.2017 (56) Список документов, цитированных в отчете о поиске: US6281475 B1, 28.08.2001. Приоритет(ы): (22) Дата подачи заявки: 12.12.2016 RU2027321 C1, 20.01.1995. RU85282 U1, 27.07.2009. Адрес для переписки: 634061, г. Томск, а/я 4177, Рыбаковой Наталье Владимировне R U (57) Формула полезной модели 1. Нагреватель электрический плоский, включающий корпус с размещенными в нем зигзагообразным нагревательным элементом и теплоизоляционным слоем, отличающийся тем, что сверху и снизу нагревательного элемента установлены металлические сетки, между верхней металлической сеткой и теплоизоляционным слоем расположен отражающий слой, а по периметру верхней части корпуса приварена прижимная планка для соединения корпуса с выступающей частью крышки, а между крышкой и прижимной планкой расположена термостойкая прокладка. 2. Нагреватель электрический плоский по п. 1, ...

Подробнее
Номер записи: 1
15-11-2018 дата публикации

Устройство для электронагрева ультрачистых инертных газов в протоке

Номер: RU0000184948U1
Автор: Александр Дмитриевич Попов, Геннадий Петрович Попов, Дмитрий Геннадьевич Попов
Принадлежит: Геннадий Петрович Попов

Полезная модель относится к области электротехники и может быть использована для электронагрева ультрачистых инертных газов в протоке.Полезная модель представляет собой устройство для нагрева ультрачистых инертных газов, содержащее изоляционный корпус, выполненный в виде полого с внутренним объемом многошарового сосуда, на внешнюю поверхность которого нанесена токопроводящая пленка, узлы для ввода и вывода нагреваемой среды и токоподводами электрической энергии, отличающееся тем, что внутренний полый объем устройства плотно заполнен стеклянными шариками, диаметры которых относятся к диаметру шаров сосуда какпри этом в узлах для ввода и вывода нагреваемой среды установлены сетчатые пластинки (7).Экономический эффект от применения одного устройства при стоимости одного устройства 2000 рублей составляет 500 рублей, при этом класс чистоты нагретого инертного газа сохраняется на прежнем уровне, т.к. поток инертного газа соприкасается только с кварцем. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 184 948 U1 (51) МПК H05B 3/26 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (52) СПК H05B 3/26 (2006.01) (21)(22) Заявка: 2018127307, 24.07.2018 (24) Дата начала отсчета срока действия патента: Дата регистрации: (73) Патентообладатель(и): Попов Геннадий Петрович (RU) 15.11.2018 (56) Список документов, цитированных в отчете о поиске: RU 67371 U1, 10.10.2007. SU 866783 A2, 23.09.1981. SU 188601 A1,01.11.1966. WO 2014152224 A1, 25.09.2014. (45) Опубликовано: 15.11.2018 Бюл. № 32 1 8 4 9 4 8 R U (54) УСТРОЙСТВО ДЛЯ ЭЛЕКТРОНАГРЕВА УЛЬТРАЧИСТЫХ ИНЕРТНЫХ ГАЗОВ В ПРОТОКЕ (57) Реферат: Полезная модель относится к области диаметру шаров сосуда как электротехники и может быть использована для электронагрева ультрачистых инертных газов в протоке. при Полезная модель представляет собой устройство для нагрева ультрачистых инертных газов, содержащее изоляционный корпус, выполненный в виде полого с внутренним этом в узлах для ввода и вывода ...

Подробнее
Номер записи: 2
28-06-2012 дата публикации

Coreless layer buildup structure

Номер: US20120160547A1
Автор: Frank D. Egitto, Rabindra N. Das, Timothy Antesberger, Voya R. Markovich, William E. Wilson
Принадлежит: Endicott Interconnect Technologies Inc

A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin.

Подробнее
Номер записи: 3
17-01-2013 дата публикации

Solar Panel

Номер: US20130014807A1
Автор: Montgomery W. Childs, William Deburger
Принадлежит: Individual

There is disclosed a photovoltaic solar panel capable of clearing accumulated ice. The panel includes a plurality of photovoltaic cells arranged in a plane with an overlaying glass sheet. The glass sheet has a first side towards the photovoltaic cells and a second side having a flat planar surface. The panel further includes an electrical heating web on the first side of the glass sheet between the sheet and the photovoltaic cells. The electrical heating web is configured to heat the first glass sheet sufficiently to melt the ice where it contacts the flat planar surface to cause the snow and ice to slide off the photovoltaic solar panel when the photovoltaic solar panel is at an angle from the horizontal. The electrical heating web is thermally separated from the photovoltaic cells by a transparent layer of low thermal conductivity.

Подробнее
Номер записи: 4
21-02-2013 дата публикации

Process Including Converting Resistive Powder to Fused Heater Element using Laser Metal Deposition Apparatus

Номер: US20130042465A1
Автор: Brian Esser, John Knapp
Принадлежит: HUSKY INJECTION MOLDING SYSTEMS LTD

A process ( 200 ), comprising: a transfer operation ( 204 ), including transferring a resistive powder ( 106 ) to an electrically insulated element ( 102 ); and a converting operating ( 206 ), including converting at least some of the resistive powder ( 106 ) to a fused heater element ( 108 ) by using a laser metal deposition apparatus ( 110 ), the fused heater element ( 108 ) being fused to the electrically insulated element ( 102 ).

Подробнее
Номер записи: 5
11-04-2013 дата публикации

Film Conductor for Flat Cells and Method for Producing Same

Номер: US20130087364A1
Автор: Blome Frank, Weixler Roland
Принадлежит: DAIMLER AG

A foil conductor for flat cells includes a contact zone for contact with further cells or busbars, an adhesion zone for adhesive bonding with a packaging foil of a cell, and a connection zone for connection to an electrode foil within the cell. At least two of the zones have a surface composition differing from each other. 121-. (canceled)22. A foil conductor for flat cells , comprising:a contact zone configured for contact with further cells or busbars;an adhesion zone configured for adhesive bonding with a packaging foil of a cell; anda connection zone configured for connection to an electrode foil within the cell,wherein at least two of the zones have a surface composition that are different from each other.23. The foil conductor according to claim 22 , wherein the foil conductor comprises an aluminium base structure and the adhesion zone comprises an adhesion base/conversion layer.24. The foil conductor according to claim 23 , wherein there is no natural aluminium oxide skin between the adhesion base/conversion layer of the adhesion zone and the aluminum base structure.25. The foil conductor according to claim 23 , wherein a polymer layer is arranged on the adhesion base/conversion layer of the adhesion zone.26. The foil conductor according to claim 22 , wherein the foil conductor comprises an aluminium base structure and the contact zone comprises a solderable coating.27. The foil conductor according to claim 26 , wherein the solderable coating contains nickel claim 26 , tin claim 26 , copper or silver.28. The foil conductor according to claim 22 , wherein the foil conductor comprises a copper base structure.29. The foil conductor according to claim 28 , wherein the adhesion zone has a roughened surface.30. The foil conductor according to claim 28 , wherein the foil conductor comprises a nickel-plated surface.31. The foil conductor according to claim 22 , wherein the surface or coating structure of the contact zone is conditioned for a soldering or welding ...

Подробнее
Номер записи: 6
25-04-2013 дата публикации

SUPERCONDUCTING MAGNET AND METHOD OF PRODUCING SAME

Номер: US20130102473A1
Автор: Ichiki Yota, Tanaka Kazuhide
Принадлежит: Hitachi, Ltd.

A superconducting magnet includes a superconducting wire including magnesium diboride; a superconducting coil where a part of the superconducting wire is wound; and a joint where an end of the superconducting wire and an end of another superconducting wire are connected and united. The joint includes a sintered body including magnesium diboride, an averaged particle diameter of magnesium diboride at the joint of the superconducting wire is greater than an averaged particle diameter of the magnesium diboride at the part where the superconducting wire is wound. 1. A superconducting magnet comprising:a superconducting wire including magnesium diboride;a superconducting coil, wherein a part of the superconducting wire is wound; anda joint where an end of the superconducting wire and an end of another superconducting wire are connected and united; wherein the joint includes a sintered body including magnesium diboride, an averaged particle diameter of magnesium diboride at the joint of the superconducting wire is greater than an averaged particle diameter of the magnesium diboride at the part of the superconducting wire.2. The superconducting magnet as claimed in claim 1 , wherein the averaged particle diameter of the magnesium diboride at the end of the superconducting wire is inclusively two to twenty times the averaged particle diameter of the magnesium diboride at the part of the superconducting wire.3. A method of producing the superconducting magnet as claimed in claim 1 , comprising:a coil producing process comprising:winding a wire made of a material including magnesium and diboride; anda first heat treatment process applying a heat treatment applied to an end of the wire at a temperature higher than a temperature of a heat treatment applied to the part; anda second heat treatment process forming the joint in which the end of the wire is unified with another superconducting wire.4. The method of producing the superconducting magnet as claimed in claim 3 ,wherein ...

Подробнее
Номер записи: 7
23-05-2013 дата публикации

FIXTURE FOR COMPONENT TO BE MOUNTED TO CIRCUIT BOARD

Номер: US20130126211A1
Автор: Muro Takashi
Принадлежит: Yazaki Corporation

An object is to provide a fixture for a component to be mounted on a circuit board which is easily manufactured and can exhibit good solderability and high whisker resistance. In a fixture which includes a solder joint plate part that can be fixed on a surface of a circuit board by soldering using solder cream, and a component fixing part that can be fixed to a component configured to be mounted on the circuit board, and in which Sn plating is performed at least on a solder joint surface of the solder joint plate part, the solder joint plate part is divided into a plurality of long-plate-like solder joint pieces and on both sides of each of the long-plate-like solder joint pieces wing-like joint feet are provided to protrude through bent flexible parts and the lower surface of each of the joint feet becomes a solder joint surface to be joined with the surface of the circuit board by solder cream. 1a solder joint plate part to be fixed on a surface of a circuit board by soldering using solder cream; anda component fixing part fixed to a component to be mounted on the circuit board;wherein Sn plating is performed at least on a solder joint surface of the solder joint plate part;the solder joint plate part is divided into a plurality of long-plate-like solder joint pieces;on both sides of each of the long-plate-like solder joint pieces, wing-like joint feet are provided to protrude through bent flexible parts; anda lower surface of each of the joint feet becomes the solder joint surface to be joined with the surface of the circuit board by the solder cream.. A fixture for a component to be mounted on a circuit board, comprising: The present invention relates to a fixture for fixing a component such as a board-mounted connector to a circuit board by soldering.For example, the surfaces of a fixture for fixing a board-mounted connector on a circuit board by soldering are generally subjected to tin (Sn) plating for improving solderability. However, it is being pointed out ...

Подробнее
Номер записи: 8
06-06-2013 дата публикации

HEATING APPARATUS AND METHOD FOR MAKING THE SAME

Номер: US20130140294A1
Автор: Torpy Keith Mario, Yeung Wing Yiu
Принадлежит:

A heating apparatus includes a heating element adapted to be disposed on a substrate. The heating element includes electrodes and a multi-layer conductive coating of nano-thickness disposed between the substrate and electrodes. The multi-layer conductive coating has a structure and composition which stabilize performance of the heating element at high temperatures. The multi-layer conductive coating may be produced by spray pyrolysis. 1. A heating apparatus including a heating element adapted to be disposed on a substrate , the heating element comprising:electrodes; anda multi-layer conductive coating of about 50 nm to about 70 nm each layer in thickness disposed between the substrate and electrodes.2. The heating apparatus as claimed in claim 1 , wherein the multi-layer conductive coating comprises an oxide coating including a source metal selected from the group consisting of tin claim 1 , indium claim 1 , cadmium claim 1 , tungsten claim 1 , titanium and vanadium with organometallic precursors.3. The heating apparatus as claimed in claim 1 , wherein the heating element further comprises a multi-layer insulating coating disposed between the multi-layer conductive coating and the substrate.4. The heating apparatus as claimed in claim 3 , wherein each layer of the multi layer insulating coating is about 30 nm to about 50 nm in thickness.5. The heating apparatus as claimed in claim 3 , wherein the multi-layer insulating coating comprises sol-gel derived silicon dioxide.6. The heating apparatus as claimed in claim 1 , wherein the electrodes comprises glass ceramic frit based ink including a source metal selected from the group consisting of platinum claim 1 , gold claim 1 , silver claim 1 , palladium and copper.7. The heating apparatus as claimed in claim 1 , further comprising a surfactant on the substrate claim 1 , the surfactant comprising perfluoralkyl surfactant of a concentration between about 0.01 and about 0.001% w/w with sodium dioctyl sulphosuccinate of a ...

Подробнее
Номер записи: 9
20-06-2013 дата публикации

Low temperature resistor for superconductor circuits

Номер: US20130157864A1
Автор: David J. Phillips, Erica C. Folk, John J. Talvacchio, Sean R. McLaughlin
Принадлежит: Northrop Grumman Systems Corp

A integrated circuit and methods for fabricating the circuit are provided. The circuit integrates at least one circuit element formed from a material that is superconducting at temperatures less than one hundred milliKelvin and at least one resistor connected to the circuit element. The resistor is formed from an alloy of transition metals that is resistive at temperatures less than one hundred milliKelvin.

Подробнее
Номер записи: 10
27-06-2013 дата публикации

METHOD FOR JOINTING METAL MEMBER AND RESIN AND JOINTED BODY THEREOF

Номер: US20130161807A1
Автор: Akahoshi Haruo, Mabuchi Katsumi, MOTOWAKI Shigehisa
Принадлежит: Hitachi, Ltd.

Reliability is improved by improving adhesiveness, crack resistance, and moisture resistance of a metal member-resin jointed body by enhancing adhesiveness between the metal member and the resin. 1. A jointed body of a metal member and a resin comprisingan intermediate layer and a silane coupling agent layer formed on the metal member at an interface between the metal member and the resin, whereinthe silane coupling agent layer and the resin are contacted,the intermediate layer is any one of an oxide layer of the metal, a chelating agent layer, a composite layer made of the oxide layer and the chelating agent layer, and a mixed layer made of the oxide and the chelating agent, andthe intermediate layer has an electrically non-insulating characteristic.2. A jointed body of a metal member and a resin according to claim 1 , wherein said thickness of the oxide layer is 100 {acute over (Å)} or more and less than 1000 {acute over (Å)}.3. The jointed body of the metal member and the resin according to claim 1 , where in the intermediate layer is the composite layer made of the oxide layer and the chelating agent layer or the mixed layer made of the oxide and the chelating agent.41. The jointed body of the metal member and the resin according to claim claim 1 , wherein the intermediate layer is the oxide layer.5. The jointed body of the metal member and the resin according to claim 1 , wherein the surface of the metal member is made of copper claim 1 , nickel claim 1 , cobalt claim 1 , zinc claim 1 , or an alloy thereof.6. The jointed body of the metal member and the resin according to claim 1 , wherein the silane coupling agent is represented by a structure of XRSi—Y or XSiR′SiX claim 1 ,where n is 0 or 1; X is selected from a group consisting of a hydrolyzable group OR (R is represented by methyl, ethyl, ethylmethyl, propyl, butyl, isobutyl, s-butyl, t-butyl, and acetyl); X may be the same as or different from each other; Y is selected from a group consisting of organic ...

Подробнее
Номер записи: 11
11-07-2013 дата публикации

Plane heating element using ceramic glass

Номер: US20130175257A1
Автор: In-Bum Jeong, Jung-Woong Lee, Ki-Bum Park, Sang-Gil Do, Seong-Yong Park, Won-Bae Lee
Принадлежит: Chang Sung Co

The present invention relates to a plane heating element which is supplied with power to generate heat. The plane heating element may include a support layer made of ceramic glass, a heat-generating layer which is formed by printing heat-generating paste on the upper surface of the support layer, and an insulating layer which is formed by applying insulating paste on the upper surface of the heat-generating layer. The heat generating paste may be dried and plasticized, and receives predetermined power to generate heat. The insulating paste may be dried and plasticized and may be configured to insulate the and prevent oxidation of the heat-generating layer. The present invention provides a strong adhesion with respect to a glass substrate and makes it possible to increase temperature up to a target level in a short time, and thus can be used as an effective printing method in various electric and electronic product fields.

Подробнее
Номер записи: 12
18-07-2013 дата публикации

Printed circuit board with embedded heater

Номер: US20130180973A1
Автор: Gil White
Принадлежит: Individual

Aspects of the present invention are directed to providing a printed circuit board including a top conductive layer; a bottom conductive layer; a plurality of electronic components arranged on at least one of the top conductive layer or the bottom conductive layer; a heater layer interposed between the top conductive layer and the bottom conductive layer and configured to generate and transfer heat to at least one of the electronic components.

Подробнее
Номер записи: 13
01-08-2013 дата публикации

STRUCTURE BODY AND ELECTRONIC COMPONENT AND PRINTED WIRING BOARD INCLUDING THE SAME

Номер: US20130192873A1
Автор: HORIKAWA Yuhei, Ito Noboru, ORIKASA Makoto, SEIKE Hideyuki, Yoshida Kenichi
Принадлежит: TDK Corporation

This structure body includes a conductor comprising Cu as a main component, an intermediate layer formed on the conductor, and a protective layer formed on the intermediate layer, the intermediate layer includes at least Cu, Sn, Ni, and P, and the protective layer includes at least Ni and P. 1. A structure body comprising:a conductor including Cu as a main component;an intermediate layer formed on the conductor; anda protective layer formed on the intermediate layer, whereinthe intermediate layer includes at least Cu, Sn, Ni, and P, andthe protective layer includes at least Ni and P.2. The structure body according to claim 1 , wherein a maximum value of the Sn concentration of the intermediate layer is 5 (at. %) or more and 50 (at. %) or less.3. The structure body according to claim 1 , wherein an average value of the P concentration of the intermediate layer is smaller than an average value of the P concentration of the protective layer.4. The structure body according to claim 2 , wherein an average value of the P concentration of the intermediate layer is smaller than an average value of the P concentration of the protective layer.5. The structure body according to claim 3 , wherein the average value of the P concentration of the intermediate layer is 2 (at. %) or more and 19 (at. %) or less.6. The structure body according to claim 4 , wherein the average value of the P concentration of the intermediate layer is 2 (at. %) or more and 19 (at. %) or less.7. The structure body according to claim 1 , wherein the intermediate layer has a thickness of 0.05 μm or more and 0.5 μm or less.8. The structure body according to claim 1 , wherein the protective layer has a thickness of 0.1 μm or more and 5 μm or less.9. The structure body according to claim 1 , further comprising a surface electrode layer formed on the protective layer.10. An electronic component comprising the structure body according to .11. A printed wiring board comprising the structure body according to . ...

Подробнее
Номер записи: 14
03-10-2013 дата публикации

SUBSTRATE SUPPORT WITH FEEDTHROUGH STRUCTURE

Номер: US20130256966A1
Автор: KULKARNI MAYUR G., VOLFOVSKI LEON
Принадлежит: Applied Materials, Inc.

Apparatus for providing electrical currents and substrate supports utilizing the same are provided. In some embodiments, a feedthrough structure may include a body having a wall defining one or more openings disposed through the body from a first end to a second end; one or more first conductors and one or more second conductors each disposed in the wall from the first end to the second end; and a plurality of conductive mesh disposed in the wall, at least one conductive mesh surrounding a first region of the wall including the one or more first conductors and at least one conductive mesh surrounding a second region of the wall including the one or more second conductors, wherein the plurality of conductive mesh substantially electrically insulates the first and second regions from respective first and second external electromagnetic fields respectively disposed outside the first and second regions. 1. A feedthrough structure for a substrate support , comprising:a body having a wall defining one or more openings disposed through the body from a first end of the body to a second end of the body;one or more first conductors disposed in the wall from the first end to the second end;one or more second conductors disposed in the wall from the first end to the second end; anda plurality of conductive mesh disposed in the wall, wherein at least one conductive mesh surrounds a first region of the wall that includes the one or more first conductors and wherein at least one conductive mesh surrounds a second region of the wall that includes the one or more second conductors, wherein the plurality of conductive mesh substantially electrically insulates the first region from a first external electromagnetic field outside the first region and the second region from a second external electromagnetic field outside the second region.2. The feedthrough structure of claim 1 , further comprising:one or more third conductors disposed in the one or more openings wherein the plurality of ...

Подробнее
Номер записи: 15
03-10-2013 дата публикации

DAUGHTER CIRCUIT BOARD FOR INTERFACE SIGNAL CONVERSION

Номер: US20130258612A1
Автор: ZHANG Xiansheng, ZHAO Yong
Принадлежит: ZHONGSHAN BROAD-OCEAN MOTOR CO., LTD.

A daughter circuit board of a brushless DC motor for interface signal conversion, having circuit units integrated on the daughter circuit and eight ports for communicating with a control system of a user terminal. The daughter circuit board is plugged into a motor controller for signal conversion so that the motor controller communicates with the control system of the user terminal. The eight ports include a signal input port of analog control, a signal port for activating a fan mode, signal ports of speed feedback, a reserved signal port, a port of COM, a port of DC power supply, and a R/T port. 234. The daughter circuit board of claim 1 , wherein the port M is at a low level claim 1 , and the port M is an open collector output.37. The daughter circuit board of claim 1 , further comprising an identify circuit () claim 1 , wherein{'b': '7', 'the identify circuit () is a voltage divider circuit comprising serially-connected resistors;'}{'b': 7', '7, 'one port of the identify circuit () is connected to a power supply, another port of the identify circuit () is connected to the ground; and'}an output port BSEL of the indentify circuit is connected to an input port of a micro control unit (MCU) of the motor controller.43. The daughter circuit board of claim 1 , wherein the third signal conversion circuit () is connected to a pulse counter.51234. The daughter circuit board of claim 1 , wherein the first claim 1 , second claim 1 , third claim 1 , and fourth signal conversion circuits () claim 1 , () claim 1 , () claim 1 , and () are conventional photoelectric coupling circuit units.61234. The daughter circuit board of claim 2 , wherein the first claim 2 , second claim 2 , third claim 2 , and fourth signal conversion circuits () claim 2 , () claim 2 , () claim 2 , and () are conventional photoelectric coupling circuit units.71234. The daughter circuit board of claim 3 , wherein the first claim 3 , second claim 3 , third claim 3 , and fourth signal conversion circuits () ...

Подробнее
Номер записи: 16
03-10-2013 дата публикации

MULTIFUNCTIONAL NANOPARTICLES

Номер: US20130259808A1
Автор: Bawendi Moungi G., CHEN Ou
Принадлежит:

Multifunctional nanoparticles can include two or more different populations of nanocrystals that impart a combination of properties arising from the constituent populations in a single, multifunctional nanoparticle. 1. A multifunctional nanoparticle comprising:a first population of nanoparticles and an assembly polymer associated with the first population of nanoparticles.2. The multifunctional nanoparticle of claim 1 , further comprising a second population of nanoparticles distinct from the first population claim 1 , wherein the assembly polymer is associated with the first and second populations of nanocrystals.3. The multifunctional nanoparticle of claim 1 , wherein the multifunctional nanoparticle has a diameter no greater than 1 claim 1 ,000 nm.4. The multifunctional nanoparticle of claim 1 , wherein the multifunctional nanoparticle has a diameter no greater than 500 nm.5. The multifunctional nanoparticle of claim 1 , wherein the multifunctional nanoparticle has a diameter no greater than 100 nm.6. The multifunctional nanoparticle of claim 1 , wherein the first population has an average diameter no greater than 50 nm claim 1 , and the second population has an average diameter no greater than 50 nm.7. The multifunctional nanoparticle of claim 1 , wherein the assembly polymer is non-covalently associated with the first and second populations.8. The multifunctional nanoparticle of claim 1 , further comprising a shell including a silicon oxide on a surface of the multifunctional nanoparticle.9. The multifunctional nanoparticle of claim 8 , wherein the shell including a silicon oxide is further functionalized.10. The multifunctional nanoparticle of claim 9 , wherein the shell including a silicon oxide is further functionalized with a dye claim 9 , a polymer claim 9 , a biomolecule claim 9 , or a member of a binding pair.11. The multifunctional nanoparticle of claim 1 , wherein the first population is a population of semiconductor nanocrystals.12. The ...

Подробнее
Номер записи: 17
24-10-2013 дата публикации

POLYMER PARTICLE

Номер: US20130277621A1
Автор: JOHNSEN HEIDI, Justynska Justyna, Kristiansen Helge, Redford Keith, SCHMID RUTH
Принадлежит: CONPART AS

A heat-treated polymer particle comprising an addition polymer core particle which has had swollen and polymerised therein a blend of an aromatic alcohol with an aldehyde or a blend of an aromatic amine or urea with an aldehyde and which has been subsequently heat treated, e.g. to a temperature of at least 150° C. 1. A heat-treated polymer particle , comprising: an addition polymer core particle , which has had swollen and polymerized therein a blend of an aromatic alcohol with an aldehyde or a blend of an aromatic amine or urea with an aldehyde , and which has been heat treated to a temperature of at least 150° C.2. The polymer particle of claim 1 , wherein the particle has been coated with at least one layer comprising a metal.3. The polymer particle of claim 1 , wherein the particle has been treated with an amine.4. The polymer particle of claim 3 , wherein the particle has been coated with at least one layer comprising a metal.5. (canceled)6. A process for the preparation of a heat-treated polymer particle claim 3 , comprising: heat-treating an addition polymer core particle claim 3 , which has had swollen and polymerized therein a blend of an aromatic alcohol and an aldehyde or a blend of an aromatic amine or urea and an aldehyde claim 3 , at a temperature above 150° C.7. The process of claim 6 , further comprising coating the addition polymer core polymer particle with an aldehyde with at least one metal layer.8. The process of claim 7 , wherein after the particle is heat-treated at a temperature above 150° C. coating the particle with at least one metal layer.9. A process for the preparation of a surface treated polymer particle comprising treating an addition polymer core particle claim 7 , which has had swollen and polymerized therein a blend of an aromatic alcohol and an aldehyde or a blend of an aromatic amine or urea and an aldehyde claim 7 , with an amine.10. The process of claim 6 , wherein after the particle is heat-treated at a temperature above 150° ...

Подробнее
Номер записи: 18
14-11-2013 дата публикации

CNT METAL COMPOSITE AND METHOD OF MANUFACTURING THE SAME

Номер: US20130299212A1
Автор: HATA Kenji, SUBRAMANIAM Chandramouli, YAMADA Takeo
Принадлежит:

Provided are a CNT plating metal composite with high conductivity and wherein metal plating is plated onto the inside of a high-density CNT aggregate, and a production method for same. Also provided is a method for patterning the CNT plating metal composite. A CNT metal composite is provided including a CNT aggregate formed by adhering a metal onto a plurality of CNTs, wherein when an X-ray diffraction analysis is performed using a Cu-Kα ray as a radiation source, an intensity ratio between a peak having the greatest intensity belonging to the metal and a peak having the greatest intensity belonging to an oxide of the metal is 10 or more and the volume resistance is 2×10Ωcm or more and 5×10Ωcm or less. 1. A CNT metal composite comprising:a CNT aggregate formed by adhering a metal onto a plurality of CNTs,{'sup': −6', '−3, 'wherein when an X-ray diffraction analysis is performed using a Cu-Kα ray as a radiation source, an intensity ratio between a peak having the greatest intensity belonging to the metal and a peak having the greatest intensity belonging to an oxide of the metal is 10 or more and the volume resistance is 2×10cm or more and 5×10cm or less.'}2. A CNT metal composite comprising:a CNT aggregate arranged with a CNT having a metal adhered to a surface thereupon, the CNT forming a CNT matrix structure,wherein at least one part of the CNT contacts the metal, and at least one part of the CNT covers the metal, at least one part of the CNT is attached to cover and wrap the metal, at least one part of the CNT is attached to cover a film on a surface of the metal, and at least one part of the CNT contacts and inter-posit the surface of the metal.3. The CNT metal composite according to wherein 3% by weight or more and 70% by weight or less of the CNTs are included.4. The CNT metal composite according to wherein a BET specific surface area of the CNT metal composite is 0.1 m/g or more and 100 m/g or less.5. The CNT metal composite according to wherein at least one ...

Подробнее
Номер записи: 19
26-12-2013 дата публикации

Metal Foil Provided with Electrically Resistive Film, and Method for Producing Same

Номер: US20130344322A1
Автор: Kurosawa Toshio
Принадлежит: JX NIPPON MINING & METALS CORPORATION

Provided are: a metal foil provided with an electrically resistive film comprising nickel, chromium, silicon and oxygen; the metal foil provided with an electrically resistive film having an oxygen concentration of 20 to 60 at %; the metal foil provided with an electrically resistive film having chromium (Cr) and silicon (Si) concentrations (at %) satisfying that Cr/(Cr+Si)×100 [%] is 73 to 79%; and the metal foil provided with an electrically resistive film having a nickel (Ni) concentration of 2 to 10 at %. 1. Metal foil provided with an electrically resistive film , wherein nickel is added to an electrically resistive oxide film comprising chromium , silicon and oxygen.2. The metal foil provided with an electrically resistive film according to claim 1 , wherein the electrically resistive film has an oxygen concentration of 20 to 60 at %.3. The metal foil provided with an electrically resistive film according to claim 2 , wherein the chromium (Cr) and silicon (Si) components of the electrically resistive film have concentrations (at %) satisfying Cr/(Cr+Si)×100 [%] is 73 to 79%.4. The metal foil provided with an electrically resistive film according to claim 3 , wherein the nickel (Ni) component of the electrically resistive film has a concentration of 2 to 10 at %.5. The metal foil provided with an electrically resistive film according to claim 4 , wherein the metal foil is a copper or copper alloy foil having a foil thickness of 5 to 35 μm.6. A method for producing metal foil provided with an electrically resistive film claim 4 , the method comprising the steps of forming an electrically resistive film on metal foil using a sputtering target claim 4 , in which chromium (Cr) claim 4 , silicon (Si) claim 4 , oxygen (O) and nickel (Ni) are contained claim 4 , the chromium (Cr) and the silicon (Si) concentrations (at %) satisfy Cr/(Cr+Si)×100 [%] is 73 to 79% claim 4 , the oxygen (O) concentration is 20 to 60 at % claim 4 , and the Ni concentration is 2 to 10%.7. ...

Подробнее
Номер записи: 20
09-01-2014 дата публикации

RESISTANCE-FORMED SUBSTRATE AND METHOD FOR MANUFACTURING SAME

Номер: US20140008104A1
Автор: Ishitomi Hiroyuki, NAKAMURA Tadashi, SUGAYA YASUHIRO
Принадлежит: Panasonic Corporation

A resistance-formed substrate includes a first insulating layer, a first wiring formed on a first surface of the first insulating layer, a thin-film resistance layer formed on a second surface of the first insulating layer, and a first via-hole conductor. The first via-hole conductor penetrates through the first insulating layer, and is electrically connected to the first wiring and the thin-film resistance layer. The first via-hole conductor includes a metal part including a low-melting point metal and a high-melting point metal, and a paste resin part. The low-melting point metal includes tin and bismuth, and has a melting point of 300° C. or lower. The high-melting point metal includes at least one of copper and silver, and has a melting point of 900° C. or higher. The first via-hole conductor is in contact with the thin-film resistance layer at both the paste resin part and the metal part. 1. A resistance-formed substrate comprising:a first insulating layer;a first wiring formed on a first surface of the first insulating layer;a thin-film resistance layer formed on a second surface of the first insulating layer and including nickel as a main component; anda first via-hole conductor penetrating through the first insulating layer, and electrically connected to the first wiring and the thin-film resistance layer, [ a low-melting point metal including tin and bismuth and having a melting point of 300° C. or lower, and', 'a high-melting point metal including at least one of copper and silver and having a melting point of 900° C. or higher; and, 'a metal part including'}, 'a paste resin part, and, 'wherein the first via-hole conductor includeswherein the first via-hole conductor is brought into contact with the thin-film resistance layer at both the paste resin part and the metal part.2. The resistance-formed substrate of claim 1 , further comprising:a second wiring coupled to the first via-hole conductor via the thin-film resistance layer on the second surface of the ...

Подробнее
Номер записи: 21
16-01-2014 дата публикации

METHOD FOR MANUFACTURING METAL FOIL PROVIDED WITH ELECTRICAL RESISTANCE LAYER

Номер: US20140014498A1
Автор: Kurosawa Toshio
Принадлежит: JX NIPPON MINING & METALS CORPORATION

The present invention provides a method for producing a metal foil with an electric resistance layer which can stably obtain electric characteristics of a resistive element, suppress peeling between the metal foil and the electric resistance layer disposed on the metal foil, and realize a high sheet resistance value and the method includes forming an electric resistance layer on a metal foil having a 10-point average roughness Rz, which is measured by the optical method according to 1 μm or less and whose surface is treated by irradiation with ion beams at an ion beam intensity of 0.70 to 2.10 sec·W/cmby vapor deposition while applying oxygen as an atmospheric gas using a sputtering target containing nickel, chromium, and silicon. 1. A method for producing a metal foil with an electric resistance layer comprising forming an electric resistance layer on a metal foil having a 10-point average roughness Rz , which is measured by the optical method according to 1 μm or less and whose surface is treated by irradiation with ion beams at an ion beam intensity of 0.70 sec·W/cmto 2.10 sec·W/cmby vapor deposition while applying oxygen as an atmospheric gas using a sputtering target containing nickel , chromium , and silicon.2. The method according to claim 1 , wherein the forming an electric resistance layer includes controlling the amount of oxygen as an atmospheric gas so that the oxygen concentration in the electric resistance layer is from 20 at % to 60 at %.3. The method according to claim 1 , wherein the sputtering target comprises NiCrSi alloy or NiCrSiO alloy.4. The method according to claim 1 , wherein the sputtering target has a Ni-content from 2 at % to 10 at % claim 1 , a Cr-content from 73 at % to 79 at % and an O-content from 10 at % to 60 at % in a component percentage of Cr and Si (Cr/(Cr+Si)×100[%]).5. The method according to claim 4 , wherein the applying oxygen as an atmospheric gas includes applying 0 vol % to 19 vol % of oxygen as the atmospheric gas.6. ...

Подробнее
Номер записи: 22
30-01-2014 дата публикации

METHOD FOR MANUFACTURING CONDUCTIVE FILM ROLL

Номер: US20140027021A1
Автор: Fujino Nozomi, ISHIBASHI Kuniaki, Takao Hiroyuki
Принадлежит:

A method for manufacturing a conductive film roll includes the following steps: 1. A method for manufacturing a conductive film roll , comprising the steps of:preparing a first roll by rolling up a film substrate;laminating a first transparent conductor layer on a first surface of the film substrate after rewinding the film substrate from the first roll;laminating a first metal layer on the first transparent conductor layer;forming a metal oxide layer by oxidizing a surface of the first metal layer in oxygen atmosphere;laminating a second transparent conductor layer on a second surface of the film substrate;laminating a second metal layer on the second transparent conductor layer; androlling up the film substrate in the form of a roll, wherein the first transparent conductor layer, the first metal layer, and the metal oxide layer, the second transparent conductor layer, and the second metal layer are laminated,an entire process of the aforementioned steps is continuously performed in a film formation apparatus.2. The method according to claim 1 , wherein a material for the first metal layer and a material for the second metal layer are respectively copper claim 1 , and a material for the metal oxide layer is copper oxide.3. The method according to or claim 1 , wherein a material for the first transparent conductor layer and a material for the second transparent conductor layer are respectively any one of indium tin oxide (ITO) claim 1 , indium zinc oxide or indium oxide-zinc composite oxide. 1. Field of the InventionThe present invention relates to a method for manufacturing a conductive film roll.2. Description of Related ArtA conventional conductive film comprises: a film substrate; a plurality of transparent conductor layers; and a plurality of metal layers. The plurality of transparent conductor layers are formed on both surfaces of the film substrate. The plurality of metal layers are formed on respective transparent conductor layers (JP-A-2011-60146). Such a ...

Подробнее
Номер записи: 23
06-02-2014 дата публикации

CARBON NANOTUBE THIN FILM LAMINATE RESISTIVE HEATER

Номер: US20140034633A1
Автор: Burton Brett R., Feier Ioan I., Heintz Amy M., Lastrapes Timothy J., Mitchell Katherine P., Muszynski Beth
Принадлежит: BATTELLE MEMORIAL INSTITUTE

Laminated resistive heaters comprising a carbon nanotube layer are described. The invention also includes methods of making laminated resistive heaters and applications using the resistive heaters. 1. A laminated resistive heater , comprising: a polymeric substrate , a CNT resistive heating layer having an interior that is substantially polymer-free disposed on the substrate , first and second electrical leads connected to the CNT layer , a protective layer disposed on a side of the CNT layer opposite the side facing the substrate , and a psa disposed on a side of the substrate opposite the side on which the CNT layer is disposed.2. The laminated resistive heater of wherein the psa is directly disposed on the substrate.3. The laminated resistive heater of wherein the CNT layer comprises hyaluronic acid in an amount less than 50 weight % of the CNT layer including additives.4. The laminated resistive heater of wherein the protective layer is polyurethane.5. The laminated resistive heater of wherein the electrical leads are printed on the substrate.61. The laminated resistive heater of claim wherein the substrate is a grooved substrate having peaks and troughs claim 1 , and wherein the CNT layer is disposed in the troughs and not on the peaks.7. The laminated resistive heater of wherein the peaks are directly bonded to the protective layer.8. The laminated resistive heater of wherein the protective layer has a thickness of 150 μm or less.9. The laminated resistive heater of wherein the substrate comprises a polyether imide.10. The laminated resistive heater of wherein the CNT resistive heating layer is arranged in a plurality of separated rows disposed on the polymeric substrate.11. A laminated resistive heater claim 1 , comprising: a polymeric substrate claim 1 , a CNT resistive heating layer arranged in a plurality of separated rows disposed on the polymeric substrate claim 1 , first and second electrical leads connected to the CNT layer claim 1 , a protective layer ...

Подробнее
Номер записи: 24
13-02-2014 дата публикации

METHOD FOR MANUFACTURING MULTILAYER CERAMIC SUBSTRATE AND COMPOSITE SHEET

Номер: US20140041912A1
Автор: KISHIDA Kazuo, OTSUKA Yusuke, TAKADA Takahiro
Принадлежит: MURATA MANUFACTURING CO., LTD.

A high-quality resistor pattern and conductor pattern is formed on an external surface of a multilayer ceramic substrate by an ink jet method. A composite sheet including a first ceramic green layer and a shrinkage-retardant layer is formed, and a resistor pattern and a conductor pattern are formed on the first ceramic green layer of the composite sheet by an ink jet method. Subsequently, a plurality of second ceramic green layers are stacked with the composite sheet such that the shrinkage-retardant layer of the composite sheet defines an outermost layer, thus forming a multilayer composite including an unfired multilayer ceramic substrate and the shrinkage-retardant layer. Then, the multilayer composite is fired, and the shrinkage-retardant layer is removed to obtain a sintered multilayer ceramic substrate. 1. A pattern-including composite sheet comprising:a ceramic green layer including a low-temperature co-fired ceramic material;a shrinkage-retardant layer disposed on the ceramic green layer and containing a sintering-resistant ceramic powder that is substantially not sintered under a condition for sintering the low-temperature co-fired ceramic material; anda resistor pattern and/or conductor pattern formed on the ceramic green layer by an ink jet method using a resistor ink and/or a conductor ink.2. The pattern-including composite sheet according to claim 1 , wherein the ceramic green layer has a voidage of about 30% or more.3. The pattern-including composite sheet according to claim 1 , wherein the ceramic green layer contains a binder claim 1 , and the binder has a solubility of about 14 g or less in the resistor ink and/or the conductor ink.41. The pattern-including composite sheet according to claim claim 1 , wherein the ceramic green layer has a different color than that of the shrinkage-retardant layer.5. A composite sheet comprising:a ceramic green layer containing a low-temperature co-fired ceramic material; anda shrinkage-retardant layer disposed on ...

Подробнее
Номер записи: 25
13-02-2014 дата публикации

HEATING PLATE WITH PLANAR HEATER ZONES FOR SEMICONDUCTOR PROCESSING

Номер: US20140045337A1
Автор: Benjamin Neil, Comendant Keith, Gaff Keith, Singh Harmeet
Принадлежит: LAM RESEARCH CORPORATION

An exemplary method is directed to powering heaters in a substrate support assembly on which a semiconductor substrate is supported. The support assembly has an array of heaters powered by two or more power supply lines and two or more power return lines wherein each power supply line is connected to a power supply and at least two of the heaters and each power return line is connected to at least two of the heaters, and a switching device which independently connects each one of the heaters to one of the power supply lines and one of the power return lines so as to provide time-averaged power to each of the heaters by time divisional multiplexing of switches of the switching device. The method includes supplying power to each of the heaters sequentially using a time-domain multiplexing scheme. 122.-. (canceled)23. A method of powering heaters in a substrate support assembly on which a semiconductor substrate is supported , the support assembly having an array of heaters powered by two or more power supply lines and two or more power return lines wherein each power supply line is connected to a power supply and at least two of the heaters and each power return line is connected to at least two of the heaters , and a switching device which independently connects each one of the heaters to one of the power supply lines and one of the power return lines so as to provide time-averaged power to each of the heaters by time divisional multiplexing of switches of the switching device , the method comprising:supplying power to each of the heaters sequentially using a time-domain multiplexing scheme.24. The method of claim 23 , wherein only one power supply line is connected to a power supply at the same time.25. The method of claim 23 , wherein an average power of each of the heaters is directly proportional to an average duration of time that heater is turned on.26. The method of claim 23 , wherein the array of heaters are arranged in a grid claim 23 , the method further ...

Подробнее
Номер записи: 26
20-02-2014 дата публикации

ELECTRODE COMPOSITE AND PHOTOELECTRIC ELEMENT EQUIPPED THEREWITH

Номер: US20140048786A1
Автор: Kato Fumiaki, Nishide Hiroyuki, Oyaizu Kenichi, Sekiguchi Takashi, Suzuka Michio
Принадлежит:

The present invention provides an electrode composite that has a reaction interface with a large area and can constitute a photoelectric element having high electron transport properties between the reaction interface and the electrode. The electrode composite of the present invention includes a first electrode and a conductive particle layer stacked on the first electrode. The conductive particle layer includes conductive particles containing acicular particles. The conductive particle layer has a three-dimensional porous network structure that is formed by the interconnection of the conductive particles. The three-dimensional network structure is joined to the first electrode. The conductive particle layer contains pores having a pore size of 50 nm or more in a total volume of 50% or more based on the volume of all pores in the conductive particle layer. 1. An electrode composite comprising:a first electrode; and a conductive particle layer stacked on the first electrode,wherein the conductive particle layer includes conductive particles containing acicular particles,the conductive particle layer has a three-dimensional porous network structure, interconnection of the conductive particles forms the three-dimensional network structure, the three-dimensional network structure is joined to the first electrode, andthe conductive particle layer contains pores having a pore size of 50 nm or more in a total volume of 50% or more based on the volume of all pores in the conductive particle layer.2. An electrode composite comprising:a first electrode; and a conductive particle layer stacked on the first electrode,wherein the conductive particle layer is a sintered compact of conductive particles containing acicular particles and is joined to the first electrode, andthe conductive particle layer contains pores having a pore size of 50 nm or more in a total volume of 50% or more based on the volume of all pores in the conductive particle layer.3. The electrode composite ...

Подробнее
Номер записи: 27
13-03-2014 дата публикации

METHOD FOR MANUFACTURING ELECTRIC FILM BODY

Номер: US20140072780A1
Автор: OTABE Noboru, SUGAI Takayasu
Принадлежит: KABUSHIKI KAISHA NIHON MICRONICS

A method for manufacturing an electric film body is made by forming a film body to have a shape in accordance with a desired electric characteristic and includes a film forming process for forming an electric film body on a board layer, an electric characteristic measuring process for measuring an electric characteristic in a surface of the electric film body formed in the film forming process, an electric film body shape setting process for setting a shape of the electric film body based on the electric characteristic measured in the electric characteristic measuring process, and an electric film body forming process for forming the electric film body formed in the shape set in the electric film body shape setting process. 1. A method for manufacturing an electric film body made by forming a film body to have a shape in accordance with a desired electric characteristic , comprising:a film forming process for forming an electric film body on a board layer;an electric characteristic measuring process for measuring an electric characteristic in a surface of the electric film body formed in the film forming process;an electric film body shape setting process for setting a shape of the electric film body based on the electric characteristic measured in the electric characteristic measuring process; andan electric film body forming process for forming the electric film body formed in the shape set in the electric film body shape setting process.2. The method for manufacturing an electric film body according to claim 1 , wherein claim 1 , in the film forming process claim 1 , the electric film body on the board layer is formed on an entire surface of the board layer claim 1 ,wherein, in the electric characteristic measuring process, the electric characteristic over an entire area in the electric film body is measured,wherein, in the electric film body shape setting process, the shape of the electric film body is set in accordance with the electric characteristic at an ...

Подробнее
Номер записи: 28
27-03-2014 дата публикации

Resistor and Resistance Element

Номер: US20140085044A1
Автор: Sakyo Hirose
Принадлежит: Murata Manufacturing Co Ltd

A resistance element that includes a resistor made of a thin film containing VO 2 as a main component and at least one of W, Nb, Mo and Ti as an additive element. The thin film has a plurality of layer regions distributed in the direction of thickness thereof, and amounts of the additive elements doped in the layer regions are different from each other between the adjacent layer regions. Terminal electrodes are disposed such that a current flows through the plural layer regions of the resistor. Preferably, an interval at which the plural layer regions are distributed is selected to be not less than 8 nm and not more than 35 nm.

Подробнее
Номер записи: 29
03-04-2014 дата публикации

Conductive fiber materials

Номер: US20140093731A1
Автор: Annalisa Bonfiglio, Beatrice Fraboni, Giorgio MATTANA
Принадлежит: Consiglio Nazionale delle Richerche CNR, Universita di Bologna

The invention relates to a conductive fiber material comprising a base fiber material ( 1 ) including a textile fiber, a plurality of nanoparticles ( 20 ) deposited on an external surface ( 10 ) of said base fiber material, said nanoparticles including one or more metals or metal oxides and a conductive polymer layer deposited on said external surface including nanoparticles.

Подробнее
Номер записи: 30
10-04-2014 дата публикации

Heater assembly

Номер: US20140097176A1
Автор: Peter M. Bobgan, Timothy Robert DeBruin
Принадлежит: Minco Products Inc

An assembly suitable for controlling the temperature of a workpiece operatively engaged thereby is provided. The assembly generally comprises a housing characterized by first and second housing members sealingly united at their peripheries, and a heater cartridge enclosed within the housing and compressively retained interior of the sealingly united peripheries of the housing members. The heater cartridge comprises a heat conducting casing characterized by first and second heat conducting casing members and a composite heating element compressively retained between the heat conducting casing members. The first and second heat conducting casing members are selectively united interior of their peripheries so as to delimit heat conduits for the heater cartridge.

Подробнее
Номер записи: 31
02-01-2020 дата публикации

HEATING ELEMENT AND METHOD OF ANALYZING

Номер: US20200000150A1
Автор: ROTHWELL Howard
Принадлежит:

A method for obtaining a heating element for an electronic vapor provision system includes providing a sheet of electrically conductive porous material, measuring amounts of light transmitted through at least two locations on the sheet to obtain a set of optical transmission values including a maximum value and a minimum value, comparing a difference value calculated from the maximum and minimum values with a predetermined acceptable variation in optical transmission, and selecting the sheet for use as a heating element if the difference value falls within the acceptable variation. 1. A method for obtaining a heating element for an electronic vapor provision system , the method comprising:providing a sheet of electrically conductive porous material;measuring amounts of light transmitted through at least two locations on the sheet to obtain a set of optical transmission values including a maximum value and a minimum value;comparing a difference value calculated from the maximum value and the minimum value with a predetermined acceptable variation in optical transmission; andselecting the sheet for use as a heating element if the difference value falls within the predetermined acceptable variation.2. The method according to claim 1 , wherein the difference value is the difference between the maximum value and the minimum value claim 1 , and the predetermined acceptable variation is a largest acceptable range in the measured optical transmission values which the difference value should not exceed.3. The method according to claim 2 , wherein the difference value is expressed as a percentage claim 2 , proportion or fraction claim 2 , and the largest acceptable range is defined as a percentage claim 2 , proportion or fraction of the maximum value or the minimum value of optical transmission measured for the sheet.4. The method according to claim 3 , wherein the largest acceptable range is not greater than 10% of the maximum value.5. The method according to claim 1 , ...

Подробнее
Номер записи: 32
01-01-2015 дата публикации

Material with Designed Anisotropy When Consolidated

Номер: US20150001449A1
Автор: Ballinger Clinton T.
Принадлежит:

Disclosed herein are a consolidated material and a method of consolidating a mixture of materials. The method can include providing a first material with the first material being substantially fully crystallized. The method may also include providing a second material, wherein the second material is partially crystallized. The method may further include combining the first material and the second material into a mixed material and consolidating the mixed material into a consolidated material. Further disclosed is a consolidated material made according to this method. 1. A method of consolidating a mixture of materials , the method comprising:providing a first material, the first material being substantially fully crystallized;providing a second material, the second material being partially crystallized;combining the first material and the second material into a mixed material; andconsolidating the mixed material into a consolidated material.2. The method of claim 1 , wherein the first material and the second material comprise a single species claim 1 , and wherein a crystallinity of the first material and the second material are different.3. The method of claim 1 , wherein the first material and the second material comprise different species claim 1 , and wherein a crystallinity of the first material and the second material are different.4. The method of claim 1 , wherein the consolidating comprises at least one method chosen from a group consisting of: hot pressing claim 1 , spark plasma sintering claim 1 , and hot isostatic pressing.5. The method of claim 1 , wherein the consolidated material has varying anisotropic properties throughout the consolidated material.6. The method of claim 5 , wherein the varying anisotropic properties include at least one of a variation in direction of anisotropy and a variation in magnitude of anisotropy.7. A consolidated material made by a method of consolidating a mixture of materials claim 5 , the method comprising:providing a ...

Подробнее
Номер записи: 33
07-01-2016 дата публикации

METHOD FOR FABRICATING PRINTED ELECTRONICS

Номер: US20160007473A1
Автор: Culp Slade R., Dardona Sameh, Schmidt Wayde R.
Принадлежит: HAMILTON SUNDSTRAND CORPORATION

A method for fabricating printed electronics and optical components includes printing a trace of electrically conductive, semiconductive or insulating material on a substrate and shrinking the substrate to a target size. The material can include an ink, solution, dispersion, powder, slurry, paste or the like. The step of shrinking can include heating the substrate at a predetermined temperature based on properties of the substrate. The step of shrinking can also include heating the substrate for a predetermined duration based on properties of the substrate. The step of shrinking can also include releasing an external electrical potential used to stretch the substrate during printing. For example, the substrate may decrease in area by at least fifty percent during heating. 1. A method for fabricating printed electronics:printing a trace of electrically conductive, semiconductive, or insulating material on a substrate; andshrinking the substrate to a target size.2. The method of claim 1 , wherein the step of shrinking includes heating the substrate at a predetermined temperature based on properties of the substrate.3. The method of claim 1 , wherein the step of shrinking includes heating the substrate for a predetermined duration based on properties of the substrate.4. The method of claim 1 , wherein the step of shrinking includes initially stretching the substrate by an external electric potential and removing the external electric potential to shrink the substrate.5. The method of claim 1 , wherein the substrate is biaxially stretched.6. The method of claim 1 , wherein the substrate is selected from the group consisting of polystyrene claim 1 , thermoplastics claim 1 , neoprene claim 1 , silicone claim 1 , and polyvinylchloride (PVC).7. The method of claim 1 , wherein the substrate is prestrained.8. The method of claim 1 , wherein the substrate decreases in area by at least fifty percent during heating.9. An electrical component manufactured by the process ...

Подробнее
Номер записи: 34
04-01-2018 дата публикации

METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A THIN FILM RESISTOR FORMED ON AN LCP SOLDER MASK AND RELATED DEVICES

Номер: US20180007797A1
Автор: JR. Louis Joseph, Rendek
Принадлежит:

A method of making an electronic device may include forming at least one circuit layer that includes solder pads on a substrate and forming at least one liquid crystal polymer (LCP) solder mask having mask openings therein. The method may also include forming at least one thin film resistor on the LCP solder mask and coupling the at least one LCP solder mask to the substrate so that the at least one thin film resistor is coupled to the at least one circuit layer and so that the solder pads are aligned with the mask openings. 122-. (canceled)23. A method of making an electronic device comprising:forming a pair of circuit layers each comprising a plurality of solder pads on opposing major surfaces of a liquid crystal polymer (LCP) substrate;forming a pair of LCP solder masks each having opposing first and second major surfaces and a plurality of mask openings extending therebetween;forming at least one thin film resistor directly on the first major surface of each of the pair of the LCP solder masks; andcoupling each of the pair of LCP solder masks to the opposing major surfaces of the LCP substrate so that each at least one thin film resistor is coupled to a respective one of the pair of circuit layers and so that each plurality of solder pads is aligned with a respective plurality of mask openings.24. The method of wherein each LCP solder mask is coupled to a respective one of the major surfaces of the LCP substrate so that the plurality of thin film resistors are sandwiched between the plurality of LCP solder masks and the LCP substrate.25. The method of wherein the plurality of thin film resistors is formed on the plurality of LCP solder masks by sputtering.26. The method of further comprising attaching a circuit component to corresponding solder pads of the plurality thereof.27. The method of further comprising forming at least one electrically conductive via through the LCP substrate.28. A method of making an electronic device comprising:forming a pair of ...

Подробнее
Номер записи: 35
03-01-2019 дата публикации

PRINTED CIRCUIT BOARDS

Номер: US20190008031A1
Автор: KUO Sung Hsia, LAI Ho M, Nguyen Vincent
Принадлежит: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

An example method includes linking a transmit line and receive line to a respective via, and printing two paths to each via, wherein each path is interrupted by two pairs of contacts. When a first resistor is in a first pair of contacts at a receive via, first signal is formed between a receive point of a first connector and the receive line. When a first capacitor is in first pair of contacts at a transmit via, second signal is formed between transmit point of first connector and the transmit line. When a second resistor is in second pair of contacts at receive via, third signal is formed between receive point of a second connector and the receive line. When a second capacitor is in second pair of contacts at transmit via, fourth signal is formed between a transmit point of second connector and the transmit line. 1. A method of manufacturing a printed circuit board (PCB) , comprising:providing a substrate;linking a receive line and a transmit line to a receive via and a transmit via, respectively, in the substrate; andprinting a first path and a second path to each via, wherein each first path and second path is interrupted by a first pair of contacts and a second pair of contacts, respectively, whereinwhen a first resistor is coupled to the first pair of contacts of the receive via, a first signal path is formed between a receive connection point of a first connector and the receive line;when a first capacitor is inserted in the first pair of contacts of the transmit via, a second signal path is formed between a transmit connection of point of the first connector and the transmit line;when a second resistor is inserted in the second pair of contacts of the receive via, a third signal path is formed between a receive connection point of a second connector and the receive line; andwhen a second capacitor is inserted in the second pair of contacts of the transmit via, a fourth signal path is formed between a transmit connection point of the second connector and the ...

Подробнее
Номер записи: 36
12-01-2017 дата публикации

HOB

Номер: US20170010002A1
Автор: Baier Martin, Ose Lutz, Thimm Wolfgang, Wittenhagen Wolfgang
Принадлежит:

A hob has a hob plate and a plurality of heating devices arranged beneath the hob plate, wherein the hob plate is designed such that it transmits light in the wavelength range visible to the human eye. The heating device has an electrical resistance heater arranged on a support with thermal insulation. IR-stimulable material including quantum dots is arranged as an indicator light or lighting means on the resistance heater or on the thermal insulation or on the hob plate. The IR-stimulable material is formed in such a way that it can be excited to output light for the indicator light by excitation light in the IR wavelength range. 1. A hob comprising a hob plate and comprising at least one heating device being arranged beneath said hob plate , wherein:said hob comprises a hob plate being designed to transmit light in a wavelength range visible to a human eye;said heating device comprises an electrical resistance heater being arranged on a support with a thermal insulation;IR-stimulable material is provided as an indicator light or lighting means being formed in such a way that it can be excited to output light or emit light by excitation with light in an IR wavelength range; andsaid IR-stimulable material is arranged on at least one of said resistance heater, said thermal insulation, said hob plate and an additional support.2. The hob according to claim 1 , wherein said IR-stimulable material has a long-term temperature stability at temperatures of greater than 1000° C. to 1300° C.3. The hob according to claim 1 , wherein said IR-stimulable material comprises erbium or is doped with erbium.4. The hob according to claim 3 , wherein said IR-stimulable material comprises Er3+.5. The hob according to claim 1 , wherein said IR-stimulable material is quantum dots or wherein it has quantum dots.6. The hob according to claim 1 , wherein said IR-stimulable material is provided as an indicator light in a region or in a heating region of the at least one heating device.7. The ...

Подробнее
Номер записи: 37
27-01-2022 дата публикации

Pre-charge unit for charging a dc link capacitor and battery system including the same

Номер: US20220029427A1
Автор: Florian MAXL
Принадлежит: Samsung SDI Co Ltd

A pre-charge unit for charging a DC link capacitor includes a printed circuit board including at least one conductive layer; a pre-charge switch on the printed circuit board; and a pre-charge resistor electrically connected in series with the pre-charge switch, wherein the pre-charge resistor is formed by a conductive trace in the at least one conductive layer of the printed circuit board.

Подробнее
Номер записи: 38
12-01-2017 дата публикации

THIN-FILM RESISTOR AND METHOD FOR PRODUCING THE SAME

Номер: US20170011826A1
Автор: HIROSHIMA Yasushi
Принадлежит:

Provided is a thin-film resistor that has a higher resistance value than the conventional thin-film resistors while retaining excellent TCR characteristics. The thin-film resistor includes a substrate, a pair of electrodes formed on the substrate, and a resistive film connected to the pair of electrodes. The resistive film includes a first resistive film and a second resistive film, the second resistive film having a different TCR from that of the first resistive film, and each of the first resistive film and the second resistive film contains Si, Cr, and N as the main components. 1. A thin-film resistor comprising a substrate , a pair of electrodes formed on the substrate , and a resistive film connected to the pair of electrodes , whereinthe resistive film includes a first resistive film and a second resistive film, the second resistive film having a different TCR from that of the first resistive film, andeach of the first resistive film and the second resistive film contains Si, Cr, and N as main components.2. The thin-film resistor according to claim 1 , wherein one of the first resistive film or the second resistive film has a positive TCR value claim 1 , and the other has a negative TCR value.3. The thin-film resistor according to claim 2 , wherein the first resistive film and the second resistive film contain different percentages of silicon nitride across xTCR (a threshold of silicon nitride) as a boundary claim 2 , the xTCR being a percentage of silicon nitride at which a positive TCR changes to a negative TCR or a negative TCR changes to a positive TCR.4. The thin-film resistor according to claim 1 , whereineach of the first resistive film and the second resistive film contains silicon nitride, anda percentage of Si that forms silicon nitride in the first resistive film relative to the entire Si contained in the first resistive film is less than or equal to 63%, and a percentage of Si that forms silicon nitride in the second resistive film relative to the ...

Подробнее
Номер записи: 39
14-01-2021 дата публикации

THIN FILM RESISTOR

Номер: US20210013197A1
Автор: Chen Chien-Mao, YU Hung-Chih
Принадлежит:

A semiconductor device includes: a metal thin film disposed on a semiconductor substrate; and first and second contact structures disposed on the metal thin film, wherein the first and second contact structures are laterally spaced from each other by a dummy layer that comprises at least one polishing resistance material. 1. A semiconductor device , comprising:a metal thin film disposed on a semiconductor substrate;at least one contact structure disposed on the metal thin film,a dummy layer disposed on the metal thin film, wherein the dummy layer comprises at least one polishing resistance material; anda transistor gate structure disposed adjacent to the at least one contact structure, wherein a material of the transistor gate structure is the same as the at least one polishing resistance material.2. The device of claim 1 , wherein the at least one polishing resistance material is selected from a group c consisting of a metal-based material claim 1 , an oxide-based material claim 1 , a ceramic-based material claim 1 , and a combination thereof.3. The device of claim 1 , wherein the at least one polishing resistance material further comprises a barrier material.4. The device of claim 3 , wherein the barrier material is selected from a group consisting of: titanium (Ti) claim 3 , tantalum (Ta) claim 3 , titanium nitride (TiN) claim 3 , tantalum nitride (TaN) claim 3 , and a combination thereof.5. The device of claim 1 , wherein the metal thin film claim 1 , and the first and second contact structures form a thin film resistor.6. The device of claim 1 , wherein the dummy layer is formed of a polysilicon material.7. The device of claim 1 , wherein the at least one contact structure comprises first and second contact structures claim 1 , and wherein the first and second contact structures have a p-type work function and the at least one polishing resistance material has an n-type work function and is laterally spaced apart from the first and second contact structures ...

Подробнее
Номер записи: 40
15-01-2015 дата публикации

Device housing package

Номер: US20150016074A1
Автор: Atsushi Ogasawara, Eiichi Katayama, Emi Mukai, Mahiro Tsujino
Принадлежит: Kyocera Corp

A device housing package includes a substrate in a form of a rectangle, having a mounting region of a device at an upper surface thereof; a frame body disposed on the substrate so as to extend along an outer periphery of the mounting region, the frame body having a cutout formed at a part thereof; and an input-output terminal disposed in the cutout. The input-output terminal includes a first insulating layer, a second insulating layer overlaid on the first insulating layer, and a third insulating layer overlaid on the second insulating layer. First terminals set at a predetermined potential are disposed on an upper surface of the first insulating layer. Second terminals set at a predetermined potential are disposed on a lower surface of the first insulating layer. Third terminals through which AC signals flow are disposed on an upper surface of the second insulating layer.

Подробнее
Номер записи: 41
14-01-2016 дата публикации

APPARATUS, SYSTEM, AND METHOD FOR ELECTRONICS MANUFACTURING USING DIRECT WRITE WITH FABRICATED FOILS

Номер: US20160014900A1
Автор: Culp Slade R., Dardona Sameh, Piech Marcin, Schmidt Wayde R.
Принадлежит: UNITED TECHNOLOGIES CORPORATION

An apparatus system and method for an electronic component made with additive manufacturing processes and a foil substrate is provided. The electronic component may include one or more foil substrates and one or more elements. The elements may be produced by an additive manufacturing process. Moreover, the elements may be produced in the same plane or out of plain with one or more foil substrates. The elements may also be various structures, including, for example, connectors, electrical components (e.g., a resistor, a capacitor, a switch, and/or the like), and/or any other suitable electrical elements and/or structures. 1. A method , comprising:producing a first foil from a metal substrate by at least one of an etching process or micro-machining process, wherein the foil is a portion of a circuit;writing a first structure by depositing conductive material via a direct write manufacturing process to the first foil, wherein the first structure is substantially in a plane defined by the first foil; andwriting a second structure by depositing conductive material via the direct write manufacturing process to the first foil, wherein at least a portion of the second structure is substantially out of the plane defined by the first foil.2. The method of claim 1 , further comprising pre-processing the first foil claim 1 , wherein the pre-processing includes treating the foil to facilitate bonding of at least one of the first structure or the second structure.3. The method of claim 1 , further comprising post-processing an electronic assembly claim 1 , wherein the electronic assembly comprises the foil claim 1 , the first structure and the second structure.4. The method of claim 1 , wherein the first structure is at least one of a connector or an electronic component.5. The method of claim 1 , wherein the second structure is at least one of a connector and an electronic component.6. The method of claim 1 , further comprising coupling a second foil to the second structure.7. ...

Подробнее
Номер записи: 42
17-01-2019 дата публикации

Image processing apparatus, image processing method, and storage medium

Номер: US20190019070A1
Автор: Minako Kato
Принадлежит: Canon Inc

Provided are an image processing apparatus, an image processing method, and a storage medium that can contribute to formation of electric circuits having different resistance values without causing increase in cost. The image processing apparatus generates print data for printing an electrically conductive print image on a print medium by ejecting a metal particle-containing ink from ejection device, the image processing apparatus has: a setting unit configured to set a printing condition based on a resistance value of the electrically conductive print image so as to change at least one of an amount of ink droplets of the metal particle-containing ink contacting each other and a time to be taken for ejected metal particle-containing ink droplets to contact each other; and a generation unit configured to generate the print data based on image data for the electrically conductive print image and the printing condition.

Подробнее
Номер записи: 43
18-01-2018 дата публикации

END CELL HEATER FOR FUEL CELL

Номер: US20180020506A1
Автор: JANG Kil Sang
Принадлежит:

Provided is an end cell heater for a fuel cell capable of preventing water existing in reaction cells of a fuel cell stack from being frozen to improve initial start ability and initial driving performance of the fuel cell at the time of cold-starting the fuel cell during winter by disposing heaters on end cells disposed at both ends of the fuel cell stack and capable of securing air-tightness and pressure resistance properties of air passages and fuel passages formed in the end cell. 1. An end cell heater for a fuel cell , comprising:an end cell including a body and an upper cover stacked on and in contact with an upper surface of the body, and having air channels formed between the body and the upper cover;a heating element stacked on and coupled to the end cell; andan electricity collecting plate stacked on and in contact with the heating element.2. The end cell heater for a fuel cell of claim 1 , wherein fusing protrusions are formed to protrude on any one or more of the upper surface of the body and a lower surface of the upper cover claim 1 , fusing grooves are concavely formed at both sides of the fusing protrusions so as to be in contact with the fusing protrusions claim 1 , and the fusing protrusions are melted claim 1 , such that the body and the upper cover are bonded to each other.3. The end cell heater for a fuel cell of claim 1 , wherein the fusing protrusions and the fusing grooves are formed at both sides of the air channels so as to be spaced apart from the air channels.4. The end cell heater for a fuel cell of claim 1 , wherein in the end cell claim 1 , fusing protrusions are melted by vibration fusion or laser fusion claim 1 , such that the body and the upper cover are bonded to and formed integrally with each other.5. The end cell heater for a fuel cell of claim 1 , wherein a seating groove is concavely formed in a lower surface of the body claim 1 , andthe electricity collecting plate is stacked on a lower surface of the heating element so as to ...

Подробнее
Номер записи: 44
23-01-2020 дата публикации

METHOD AND APPARATUS FOR THE MELTING OF SNOW AND ICE FROM VEHICLE EXTERIORS

Номер: US20200023816A1
Автор: Oskwarek John
Принадлежит:

An apparatus and method for melting snow and/or ice on a vehicle comprises a precipitation sensor, a surface temperature sensor, an ambient temperature sensor, a heater, and a programmable controller. The programmable controller comprises a memory unit and a processor to store and execute a cut-off surface temperature Tc, and program modules, respectively. A heater control module is configured to deactivate the heater based on the surface temperature being greater than the cut-off surface temperature. The heater could be an electric heater and a hydronic heater. The electric heater is electrically coupled to at least any one of, an alternator, an onboard power system, and a remote power source, via a relay. Further, the heater control module is configured to activate the heater based on an ambient temperature being lower than freezing point of water and precipitation being present outside the vehicle, thereby melting snow and/or ice on the vehicle. 1. An apparatus for melting snow from exterior portion of the vehicle roof , the apparatus comprising:a precipitation sensor;an ambient temperature sensor;a surface temperature sensor;a heater embedded within the vehicle roof, wherein the heater is disposed between a thermally conductive layer and an insulating layer of the vehicle roof; wherein the thermally conductive layer comprises at least one of thermally conductive clips, wireways pre-formed with the roof, thermally conductive clips, wireways affixed to the roof by means of welding or thermally conductive adhesives, and pre-wired, thermally conductive polymer substrate assembly in which the heating cable is embedded, said assembly then being secured to underside of the roof by means of screws, bolts or clips with receivers formed in the roof, and wherein the insulating layer of the vehicle roof is installed to cover a passenger compartment or a cargo bay side of the vehicle, configured to minimize heat transfer into the passenger compartment or the cargo bay, ...

Подробнее
Номер записи: 45
26-01-2017 дата публикации

Packaged Electrical Components With Supplemental Conductive Structures

Номер: US20170027058A1
Автор: Bushnell Tyler S., Cardinali Steven P., Ness Trevor J., Perkins Ryan C.
Принадлежит:

Electrical components such as integrated circuits and other components may be mounted on a substrate such as a printed circuit substrate. A molded plastic cap may cover the components and a portion of the printed circuit substrate to form a packaged electrical device. Metal structures such as springs, posts, and other metal members may be insert molded within the plastic cap. A metal layer on the surface of the cap may be patterned to from electromagnetic shielding, signal paths, contact pads, sensor electrodes, antennas, and other structures. Multiple substrates each with a respective set of mounted electrical components may be joined using a flexible printed circuit. The flexible printed circuit may be covered with a rigid cap portion or an elastomeric material or may be left uncovered. 1. A packaged electrical device , comprising:a substrate;electrical components mounted to the substrate;a cap that covers the electrical components and that has an exterior surface; andsignal lines formed from metal traces on the surface of the cap.2. The packaged electrical device defined in wherein the signal lines include parallel metal traces that form a signal bus.3. The packaged electrical device defined in wherein the signal lines include contact pads and wherein the electrical components include silicon integrated circuit die.4. The packaged electrical device defined in wherein the signal lines comprise electroplated signal lines.5. The packaged electrical device defined in wherein the cap comprises laser activated areas under the electroplated signal lines.6. The packaged electrical device defined in wherein the signal lines are electrically isolated from the electrical components.7. The packaged electrical device defined in wherein the cap comprises molded plastic claim 3 , the packaged electrical device further comprising a metal structure embedded within the cap.8. The packaged electrical device defined in wherein the electrical structure has a portion that is mounted ...

Подробнее
Номер записи: 46
24-01-2019 дата публикации

TEMPERATURE DETECTION AND CONTROL SYSTEM FOR LAYERED HEATERS

Номер: US20190029076A1
Автор: WALLINGER Martin
Принадлежит: WATLOW ELECTRIC MANUFACTURING COMPANY

A layered heater is provided that includes a sensor layer formed by a layered process having a plurality of independently controllable zones, and a resistive heating layer disposed adjacent the sensor layer. In one form, the sensor layer is formed of a material having a relatively high temperature coefficient of resistance (TCR) and the resistive heating layer is formed of a material having a relatively low TCR. 1. A layered heater comprising:a sensor layer formed by a layered process and comprising a plurality of independently controllable zones; anda resistive heating layer adjacent the sensor layer.2. The layered heater according to claim 1 , wherein the layered process is selected from the group consisting of thick film claim 1 , thin film claim 1 , thermal spraying claim 1 , and sol-gel.3. The layered heater according to claim 2 , wherein the resistive heating layer is formed by a layered process.4. The layered heater according to claim 1 , wherein the independently controllable zones of the sensor layer have the same size.5. The layered heater according to claim 1 , wherein the independently controllable zones of the sensor layer are comprised of the same material.6. The layered heater according to claim 1 , wherein the sensor layer defines sensor layer tracks having a width Ws and the resistive heating layer defines resistive heating layer tracks having a width Wr greater than Ws.7. The layered heater according to claim 6 , wherein the sensor layer tracks cross the resistive heating layer tracks.8. The layered heater according to claim 6 , wherein the sensor layer tracks and the resistive heating layer tracks are formed by a laser removal process.9. The layered heater according to further comprising an over temperature detection circuit operatively connected to the resistive heating layer claim 1 , the over temperature detection circuit comprising:a resistor or potentiometer;the sensor layer; andan electromechanical relay in parallel with the sensor layer.10. ...

Подробнее
Номер записи: 47
28-01-2021 дата публикации

Method for producing a printed circuit board using a mould for conductor elements

Номер: US20210029831A1
Автор: Markus WÖLFEL
Принадлежит: JUMATECH GMBH

A method is provided for producing a printed circuit board including at least one conductor element, which extends between connection points in the printed circuit board. In order to increase the productivity of a known method for producing a printed circuit board including at least one conductor element, which extends between connection points in the printed circuit board, the method comprises the following steps: Step A: providing a mold having at least one receptacle for a conductor element; Step B: arranging a conductor element in the receptacle of the mold; Step C: connecting the conductor element arranged in the receptacle of the mold to an electrically conductive sheetlike element at positions of the intended connection points; Step D: embedding the conductor element, which is connected to the electrically conductive sheetlike element, into insulating material; and Step E: working out the connection points from the electrically conductive sheetlike element.

Подробнее
Номер записи: 48
01-05-2014 дата публикации

Multilayer wiring base plate and probe card using the same

Номер: US20140118017A1
Автор: Noboru Otabe, Takayasu SUGAI, Toshinori OMORI
Принадлежит: Micronics Japan Co Ltd

A multilayer wiring base plate includes an insulating plate including a plurality of synthetic resin layers made of an insulating material, a wiring circuit provided in the insulating plate, a thin-film resistor formed along at least one of the synthetic resin layers to be buried in the synthetic resin layer and inserted in the wiring circuit, and a heat expansion and contraction restricting layer formed to be buried in the synthetic resin layer adjacent to the synthetic resin layer in which the thin-film resistor is formed to be buried, arranged along the thin-film resistor, and having a smaller linear expansion coefficient than a linear expansion coefficient of the adjacent synthetic resin layers.

Подробнее
Номер записи: 49
04-02-2021 дата публикации

Element substrate, liquid ejection head, and method of manufacturing element substrate

Номер: US20210031513A1
Автор: Mineo Shimotsusa, Soichiro Nagamochi
Принадлежит: Canon Inc

An element substrate has a layered structure including a heating resistance element, a first insulation layer where a temperature detection element constituted by a via is formed, and a second insulation layer provided between the heating resistance element and the temperature detection element which electrically insulates the heating resistance element and the temperature detection element.

Подробнее
Номер записи: 50
31-01-2019 дата публикации

CHIP RESISTOR AND METHOD FOR PRODUCING THE SAME

Номер: US20190035520A1
Автор: HIROSHIMA Yasushi
Принадлежит:

Provided is a thin-film chip resistor including an insulating substrate; a thin-film resistive element formed on the substrate; a pair of electrodes connected to the thin-film resistive element; and a protective film covering at least the thin-film resistive element between the pair of electrodes, in which the protective film includes a first protective film and a second protective film, the first protective film containing silicon nitride in contact with the thin-film resistive element, and the second protective film containing silicon oxide in contact with the first protective film. 1. A thin-film chip resistor comprising:an insulating substrate;a thin-film resistive element formed on the substrate;a pair of electrodes connected to the thin-film resistive element; anda protective film covering at least the thin-film resistive element between the pair of electrodes,wherein:the protective film includes a first protective film and a second protective film, the first protective film containing silicon nitride in contact with the thin-film resistive element, and the second protective film containing silicon oxide in contact with the first protective film.2. The thin-film chip resistor according to claim 1 , wherein a refractive index of the first protective film is 2.0 to 2.3 at a wavelength of 632.8 nm.3. The thin-film chip resistor according to claim 1 , wherein the first protective film contains an excessive amount of silicon claim 1 , the amount being greater than an amount corresponding to a stoichiometric composition of silicon nitride Si:N=3:4.4. The thin-film chip resistor according to claim 1 , wherein the second protective film is thicker than the first protective film.5. The thin-film chip resistor according to claim 1 , wherein a thickness of the first protective film is 75 to 500 nm.6. The thin-film chip resistor according to claim 1 , further comprising an overcoat film covering a region between the pair of electrodes claim 1 ,wherein:the overcoat film is ...

Подробнее
Номер записи: 51
31-01-2019 дата публикации

THINNED ELECTRONIC PRODUCT AND MANUFACTURING METHOD THEREOF

Номер: US20190037698A1
Автор: HUANG Pei-Hsuan, PU Yi-Feng, SHIEH Wei-Ming
Принадлежит:

A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer. 1. A manufacturing method of a thinned electronic product , comprising:forming a conductive circuit on a first surface of a supporting body, wherein the conductive circuit is made of a conductive metal layer, and the conductive metal layer is a metal foil, and the supporting body is a thinned supporter with a predetermined supporting force or strength;disposing an electronic element on the conductive circuit, wherein the electronic element is electrically connected to the conductive circuit; anddisposing a film layer on the conductive circuit having the electronic element, wherein the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.2. The manufacturing method according to claim 1 , wherein the conductive metal layer is patterned to form the conductive circuit claim 1 , and forming the conductive circuit comprises:placing the conductive metal layer on a toppan stamping plate, wherein a protrusion of the toppan stamping plate forms a circuit pattern, and the conductive metal layer contains a binder;placing the supporting body on the conductive metal layer;hot pressing the conductive metal layer through the toppan stamping plate to press and fix a part of the conductive metal layer on the supporting body to from the patterned conductive metal layer having the circuit pattern on the supporting body; andremoving another part of the conductive metal layer not pressed and fixed on the ...

Подробнее
Номер записи: 52
31-01-2019 дата публикации

THINNED ELECTRONIC PRODUCT AND MANUFACTURING METHOD THEREOF

Номер: US20190037699A1
Автор: HUANG Pei-Hsuan, PU Yi-Feng, SHIEH Wei-Ming
Принадлежит:

A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer. 1. A manufacturing method of a thinned electronic product , comprising:forming a conductive circuit on a first surface of a supporting body, wherein the conductive circuit is made of a patterned conductive ink layer;disposing an electronic element on the conductive circuit, wherein the electronic element is electrically connected to the conductive circuit; anddisposing a film layer on the conductive circuit having the electronic element, wherein the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.2. The manufacturing method according to claim 1 , wherein forming the conductive circuit comprises:forming the patterned conductive ink layer having a polymer or adhesive and a conductive material on the supporting body; andcuring the patterned conductive ink layer to form the conductive circuit having a circuit pattern on the supporting body.3. The manufacturing method according to claim 1 , wherein the film layer is formed on the supporting body having the electronic element and the conductive circuit by an out-mold wrapping process claim 1 , a high temperature vacuum adsorption process claim 1 , a hot pressing process claim 1 , an ultrasonic melting process claim 1 , a melt bonding process or an adhesive bonding process.4. The manufacturing method according to claim 1 , wherein the supporting body is a thinned supporter with a predetermined supporting force or strength to provide a ...

Подробнее
Номер записи: 53
08-02-2018 дата публикации

Thin Film Resistor

Номер: US20180040396A1
Автор: Ying-Chieh Lee
Принадлежит: National Pingtung University of Science and Technology

A thin film resistor includes 38-60 at.% of nickel, 10-25 at.% of chromium, 3-10 at.% of manganese, 4-18 at.% of yttrium, and 1-36 at.% of dysprosium. The thin film resistor can greatly increase the resistivity with a low temperature coefficient of resistance to broaden the applications of the thin film resistor.

Подробнее
Номер записи: 54
12-02-2015 дата публикации

Electroless Nickel Plating Solution and Method

Номер: US20150044374A1
Автор: Janik Robert, Micyus Nicole J.
Принадлежит: MACDERMID ACUMEN, INC.

An electroless nickel plating solution and a method of using the same is described. The electroless nickel plating solution comprises (i) a source of nickel ions; (ii) a reducing agent; (iii) one or more complexing agents; (iv) one or more bath stabilizers; (v) a brightener, said brightener comprising a sulfonated compound having sulfonic acid or sulfonate groups; and (vi) optionally, one or more additional additives. The use of the sulfonated compound brightener results in a bright electroless nickel deposit on various substrates having a high gloss value. 1. An electroless nickel plating solution comprising:a) a source of nickel ions;b) a reducing agent;c) one or more complexing agents;d) one or more bath stabilizers; ande) a brightener, said brightener comprising a sulfonated compound selected from the group consisting of alkyl or aryl substituted sulfonamides, alkyl or aryl substituted sulfonic acids, alkyl or aryl substituted sulfosuccinates, and alkyl or aryl substituted sulfonates.2. The electroless nickel plating solution according to claim 1 , wherein the source of nickel ions comprises a nickel salt selected from the group consisting of nickel bromide claim 1 , nickel fluoroborate claim 1 , nickel sulfonate claim 1 , nickel sulfamate claim 1 , nickel alkyl sulfonate claim 1 , nickel sulfate claim 1 , nickel chloride claim 1 , nickel acetate claim 1 , nickel hypophosphite and combinations of one or more of the foregoing.3. The electroless nickel plating solution according to claim 2 , wherein the sulfonated compound is selected from the group consisting of 2-amino ethane sulfonic acid claim 2 , toluene sulfonamide claim 2 , 1-octane sulfonic acid claim 2 , 2-chloro-hydroxy-propane sulfonic acid claim 2 , saccharin claim 2 , sodium diamyl sulfosuccinate claim 2 , sodium 1 claim 2 ,4 claim 2 ,-bis(1 claim 2 ,3-dimethylbutyl) sulfosuccinate claim 2 , sulfosuccinic acid claim 2 , and sodium allyl sulfonate.4. The electroless nickel plating solution according to ...

Подробнее
Номер записи: 55
06-02-2020 дата публикации

PANEL BAKING APPARATUS

Номер: US20200041826A1
Автор: LIU Kaixin
Принадлежит:

A panel baking apparatus, including: a heating plate disposed with a plurality of holes thereon, and the holes being are controllably opened or closed; a plurality of supporting bar for supporting a panel to be baked disposed on a side of the heating plate, and the set position of the supporting bar corresponds to the set position of the hole and the supporting bar moves in a direction of an axis of the hole. The holes is controllably opened, the supporting bar moves upward in the direction of the axis of the hole and through the hole, and supports the panel to be baked positioned on the side of the heating plate; the supporting bar moves downward in the direction of the axis of the hole and out of the hole, the hole is controllably closed, and the panel to be baked is supported on the smooth heating plate. 1. A panel baking apparatus , comprising:a heating plate, disposed with a plurality of holes thereon, and the holes being controllably opened or closed; anda plurality of supporting bar for supporting a panel to be baked, disposed on a side of the heating plate, the set position of the supporting bar corresponding to the position of the hole and the supporting bar moving in a direction of an axis of the hole, wherein:the holes is controllably opened, and the supporting bar moves upward in the direction of the axis of the hole and through the hole, and supports the panel to be baked positioned on the side of the heating plate; the supporting bar moves downward in the direction of the axis of the hole and out of the hole, and the hole is controllably closed, and the panel to be baked is supported on the smooth heating plate.2. The panel baking apparatus according to claim 1 , wherein the supporting bar ascends or descends vertically in the direction of the axis of the hole.3. The panel baking apparatus according to claim 2 , wherein the number of the supporting bars is one-to-one correspondence to the number of the holes.4. The panel baking apparatus according to ...

Подробнее
Номер записи: 56
18-02-2021 дата публикации

HEATER AND HEATING APPARATUS

Номер: US20210048769A1
Автор: Takagi Osamu
Принадлежит:

A heater includes a heat generating member in a first layer, a sensor that is in a second layer different from the first layer and configured to detect a temperature of the heat generating member, and a wiring pattern in one or more third layers between the first and second layers to supply power to the heat generating member. 1. A heater comprising:a heat generating member in a first layer;a sensor that is in a second layer different from the first layer and configured to detect a temperature of the heat generating member; anda wiring pattern in one or more third layers between the first and second layers to supply power to the heat generating member.2. The heater of claim 1 , further comprising:another wiring pattern to supply power to the sensor.3. The heater of claim 2 , whereinsaid another wiring pattern is included in a layer other than the third layers.4. The heater of claim 1 , whereinthe heat generating member extends along a longitudinal direction of the heater.5. The heater of claim 1 , wherein a first pattern electrically connected to one electrode of the heat generating member, and', 'a second pattern electrically connected to another electrode of the heat generating member., 'the wiring pattern comprises6. The heater of claim 5 , whereinthe first and second patterns are included in different layers.7. The heater of claim 5 , whereinthe wiring pattern further comprises a third pattern electrically connected to an electrode of another heat generating member, andthe first and third patterns are included in different layers.8. The heater of claim 5 , whereinthe first pattern and said one electrode of the heat generating member, and the second pattern and said another electrode of the heat generating member are connected via through-holes.9. The heater of claim 1 , further comprising:a temperature adjusting element configured to adjust the temperature of the heater; andanother wiring pattern for the temperature adjusting element in the second layer.10. The ...

Подробнее
Номер записи: 57
07-02-2019 дата публикации

LAYERED HEATER SYSTEM HAVING CONDUCTIVE OVERLAYS

Номер: US20190045584A1
Автор: PTASIENSKI Kevin, RUSSEGGER Elias, SCHEFBANKER Gerhard, WALLINGER Martin
Принадлежит: WATLOW ELECTRIC MANUFACTURING COMPANY

A method of manufacturing a layered heater includes: applying a dielectric material on a substrate to form a dielectric layer; thermal-spraying a resistive material on the dielectric layer to form a resistive layer on the dielectric layer; forming a plurality of conductive overlays at predetermined locations on the substrate; and forming a plurality of cuts into the resistive layer by laser cutting to form a resistive circuit pattern that overlaps the conductive overlays. 1. A method of manufacturing a layered heater , comprising:applying a dielectric material on a substrate to form a dielectric layer;thermally spraying a resistive material on the dielectric layer to form a resistive layer on the dielectric layer;forming a plurality of conductive overlays at predetermined locations on the substrate; andforming a plurality of cuts into the resistive layer by laser cutting to form a resistive circuit pattern that overlaps the conductive overlays.2. The method according to claim 1 , wherein the substrate defines opposing ends claim 1 , and the forming of a plurality of conductive overlays comprises forming the plurality of conductive overlays along each of the opposing ends of the substrate.3. The method according to claim 1 , wherein the plurality of conductive overlays are discretely arranged along each of opposing ends of the substrate before the resistive circuit pattern is formed.4. The method according to claim 1 , wherein the resistive circuit pattern includes a plurality of bend portions.5. The method according to claim 4 , wherein the plurality of conductive overlays overlap the bend portions.6. The method according to claim 5 , wherein the conductive overlays are formed on at least one of a top surface and a bottom surface of the bend portions.7. The method according to claim 1 , wherein some of the plurality of cuts are parallel.8. The method according to claim 7 , wherein the plurality of cuts extend between the plurality of conductive overlays9. The method ...

Подробнее
Номер записи: 58
25-02-2016 дата публикации

Sauna Heating Apparatus and Methods

Номер: US20160051440A1
Автор: Johnson Erik
Принадлежит:

In one embodiment, the present invention includes an infrared apparatus to heat a body. The infrared apparatus includes layers. The first layer has a first conductive path coupled to pass a first current. The second layer has a second conductive path running coincident to the first conductive path. The second layer terminates an electric field produced within said first layer. The first conductive path includes a resistive element that produces heat from the current. 1. An infrared apparatus to heat a body , said infrared apparatus comprising:a first layer having a first conductive path coupled to pass a current; anda second layer having a second conductive path running coincident to said first conductive path,wherein said second layer terminates an electric field produced within said first layer, and wherein said first conductive path includes a resistive element that produces a heat from said current.2. The infrared apparatus of wherein said first conductive path is coupled to redirect said current to said second conductive path and set up complimentary magnetic fields between the first and second layers.3. The infrared apparatus of wherein said second conductive path is metal which reduces the potential at said second layer.4. The infrared apparatus of further comprising:a first connection point at the end of said first conduction path; anda second connection point to said second layer through an opening in an end of said first conductive path,wherein said first and second connection points are adjacent to each other and perpendicular to said first and second conduction paths.5. The infrared apparatus of further comprising an electrically insulative planar substrate claim 1 , wherein said first and second layers are thermally coupled to said electrically insulative planar substrate claim 1 , and wherein said electrically insulative planar substrate radiates said heat.6. The infrared apparatus of further comprising claim 1 , said third layer having a third ...

Подробнее
Номер записи: 59
08-05-2014 дата публикации

Electrical heating device and equipment with pluggable heating module

Номер: US20140126896A1
Автор: Chih-Chang Wei, Etsuro Habata
Принадлежит: Betacera Inc

An electrical heating device with pluggable heating module includes a box body ( 10 ) and a heating module ( 20 ). The box body ( 10 ) has an accommodation space ( 14 ) for the liquid ( 74 ) contained therein, which is provided with a slot ( 111 ) communicating the accommodation space ( 14 ). The heating module ( 20 ) is received in the slot ( 111 ) in a pluggable way and separates the accommodation space into a first chamber ( 141 ) and a second chamber ( 142 ). The heating module ( 20 ) includes a positive temperature coefficient (PTC) heating component ( 21 ) and a heat conducting component ( 22 ) covering the outside of the PTC heating component ( 21 ). By this arrangement, the time for maintaining the electrical heating device ( 1 ) can be saved and the liquid ( 74 ) heating effect of the electrical heating device ( 1 ) can be improved as well.

Подробнее
Номер записи: 60
15-05-2014 дата публикации

TOUCH ELECTRODE DEVICE

Номер: US20140131065A1
Автор: Peng Yen-Chun
Принадлежит: HENGHAO TECHNOLOGY CO. LTD

A touch electrode device includes a substrate and at least one electrode layer. The electrode layer is disposed above a surface of the substrate. The electrode layer includes non-transparent conductive material. 1. A touch electrode device , comprising:a substrate; andat least one electrode layer disposed above the a surface of the substrate, the electrode layer including a non-transparent conductive material.2. The device of claim 1 , further comprising an insulation layer disposed between the electrode layer and the substrate.3. The device of claim 2 , wherein the insulation layer comprises insulation material.4. The device of claim 2 , wherein the at least one electrode layer comprises a first electrode layer and a second electrode layer disposed above a same surface of the substrate; and the insulation layer is disposed between the first electrode layer and the second electrode layer for electrical insulation therebetween.5. The device of claim 1 , wherein the at least one electrode layer comprises a first electrode layer and a second electrode layer disposed on opposite surfaces of the substrate claim 1 , respectively.6. The device of claim 1 , wherein the non-transparent conductive material comprises a plurality of metal wires claim 1 , a copper mesh or a silver mesh.7. The device of claim 6 , wherein the metal wire has a diameter of some nanometers to hundreds of nanometers.8. The device of claim 6 , wherein the metal wires are flatly distributed.9. The device of claim 1 , wherein the non-transparent conductive material further comprises photoresistive material.10. The device of claim 1 , wherein the non-transparent conductive material further comprises adhesive material.11. The device of claim 1 , wherein the electrode layer further comprises plastic material claim 1 , for fixing the non-transparent conductive material in the electrode layer.12. The device of claim 1 , wherein the substrate is a transparent substrate.13. The device of claim 2 , wherein the ...

Подробнее
Номер записи: 61
14-02-2019 дата публикации

Composite electronic component and resistance element

Номер: US20190051463A1
Автор: Isamu Fujimoto, Kazuo Hattori, Shinichiro Kuroiwa
Принадлежит: Murata Manufacturing Co Ltd

A composite electronic component includes an electronic element mounted on a resistance element in a height direction. The electronic element includes an electronic element body, and first and second external electrodes separated from each other in a length direction. The resistance element includes a base portion, a resistor disposed on an upper surface of the base portion, and first and second upper surface conductors on the upper surface of the base portion. The first and second upper surface conductors are separated from each other in the length direction, and the resistor is located between the first and second upper surface conductors. A dimension in the height direction of the resistor is smaller than both a dimension in the height direction of the first external electrode of a portion located on a lower surface of the electronic element body, and a dimension in the height direction of the second external electrode of a portion located on a lower surface of the electronic element body.

Подробнее
Номер записи: 62
25-02-2021 дата публикации

HEATING DEVICE

Номер: US20210059020A1
Автор: MORALE Salvatore
Принадлежит:

A heating device configured to heat an object including an emitter of thermal radiation; and a radiating plate defining a propagation surface to face the object, and an absorption surface for adsorbing the thermal radiation coming out of the emitter; the radiating plate is not in contact with the emitter, so as to be heated by irradiation, and not in contact with the object, so as to heat it by irradiation. 1. A heating device configured to heat an object , comprising:an emitter of thermal radiation;a radiating plate defining a propagation surface configured to face said object, and an absorption surface for adsorbing said thermal radiation coming out of said emitter opposite to said propagation surface with respect to said radiating plate; and placed on the opposite side of said radiating plate with respect to said emitter,', 'thermally insulating and', 'defining a reflective surface for reflecting said thermal radiation, which faces said absorption surface and said emitter;, 'a base body'}wherein said radiating plate is configured to be heated by said thermal radiation emitted by said emitter and reflected by said reflective surface and to heat said object by irradiation.2. The heating device according to claim 1 , wherein said propagation surface has an emissivity of at least 0.8.3. The heating device according to claim 2 , wherein said propagation surface is white.4. The heating device according to claim 1 , wherein said absorption surface has an absorption coefficient of at least 0.8.5. The heating device according to claim 4 , wherein said absorption surface is black.6. The heating device according to claim 1 , wherein said base body and said radiating plate define a box-like body delimiting a housing for said emitter.7. The heating device according to claim 6 , wherein said housing is closed and thermally insulated from the outside claim 6 , with the sole exclusion of said propagation surface.8. The heating device according to claim 1 , wherein said ...

Подробнее
Номер записи: 63
23-02-2017 дата публикации

Heater

Номер: US20170055317A1
Автор: Yasuyuki Aritaki
Принадлежит: ROHM CO LTD

The present invention provides a heater capable of prohibiting failures of a substrate and a heat resistor. The heater of the present invention includes a substrate in a longitudinal shape, a heat resistor formed on the substrate, and an electrode for resistor formed on the substrate and connected to the heat resistor. The heat resistor includes a first elongated portion, and the first elongated portion extends along a long side direction of the substrate and is disposed in a side in a first short side direction, which is one of short side directions of the substrate. A ratio of a distance between the first elongated portion and an edge of the substrate on the first short side direction, to a thickness of the substrate is more than 0 and less than 1.75.

Подробнее
Номер записи: 64
23-02-2017 дата публикации

METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A THIN FILM RESISTOR FORMED ON AN LCP SOLDER MASK AND RELATED DEVICES

Номер: US20170055350A1
Автор: JR. Louis Joseph, Rendek
Принадлежит:

A method of making an electronic device may include forming at least one circuit layer that includes solder pads on a substrate and forming at least one liquid crystal polymer (LCP) solder mask having mask openings therein. The method may also include forming at least one thin film, resistor on the LCP solder mask and coupling the at least one LCP solder mask to the substrate so that the at least one thin film resistor is coupled to the at least one circuit layer and so that the solder pads are aligned with the mask openings. 122-. (canceled)23. A method of making an electronic device comprising:forming a pair of circuit layers each comprising a plurality of solder pads on opposing major surfaces of a liquid crystal polymer (LCP) substrate;forming a pair of LCP solder masks each having opposing first and second major surfaces and a plurality of mask openings extending therebetween;forming at least one thin film resistor directly on the first major surface of each of the pair of the LCP solder masks; andcoupling each of the pair of LCP solder masks to the opposing major surfaces of the LCP substrate so that each at least one thin film resistor is coupled to a respective one of the pair of circuit layers and so that each plurality of solder pads is aligned with a respective plurality of mask openings.24. The method of wherein each LCP solder mask is coupled to a respective one of the major surfaces of the LCP substrate so that the plurality of thin film resistors are sandwiched between the plurality of LCP solder masks and the LCP substrate.25. The method of wherein the plurality of thin film resistors is formed on the plurality of LCP solder masks by sputtering.26. The method of further comprising attaching a circuit component to corresponding solder pads of the plurality thereof.27. The method of further comprising forming at least one electrically conductive via through the LCP substrate.28. An electronic device comprising:a substrate having opposing first and ...

Подробнее
Номер записи: 65
05-03-2015 дата публикации

Temperature Control Device and Method and Electronic Device

Номер: US20150060429A1
Автор: Song Jingshan
Принадлежит: ZTE CORPORATION

Provided are a device and method and an electronic device for temperature control, which are used to solve the problem that electronic devices and components cannot operate in a low-temperature state. The temperature control device includes a temperature detection unit () configured to detect the operating temperature of a component (); a heating unit () configured to heat the component () according to the detection result of the temperature detection unit () so that the operating temperature is between a first temperature and a second temperature; and a power supply interface () respectively connected to the temperature detection unit () and the heating unit () and configured to supply power to the temperature detection unit () and the heating unit (). The first temperature is the lower limit value of the operating temperature of the component (), and the second temperature is the upper limit value of the operating temperature of the component (). The temperature control device can maintain the operating temperature of an electronic device or a component so that the electronic device and the component thereof overcome a low-temperature obstacle, thereby operating normally. 1. A temperature control device , configured to maintain an operating temperature of a component of an electronic device , comprising:a temperature detection unit, configured to detect the operating temperature of the component;a heating unit, configured to heat the component according to a detection result of the temperature detection unit so that the operating temperature is between a first temperature and a second temperature; anda power supply interface respectively connected to the temperature detection unit and the heating unit and configured to supply power to the temperature detection unit and the heating unit;wherein the first temperature is a lower limit value of the operating temperature of the component, and the second temperature is an upper limit value of the operating temperature ...

Подробнее
Номер записи: 66
05-03-2015 дата публикации

METAL NITRIDE MATERIAL FOR THERMISTOR, METHOD FOR PRODUCING SAME, AND FILM TYPE THERMISTOR SENSOR

Номер: US20150061820A1
Автор: Fujita Toshiaki, Nagatomo Noriaki, Tanaka Hiroshi
Принадлежит:

Provided are a metal nitride material for a thermistor, which has high reliability and high heat resistance and can be directly deposited on a film or the like without firing, a method for producing the same, and a film type thermistor sensor. 1. A metal nitride material for a thermistor , consisting of a metal nitride represented by the general formula: (MA)AlN(where “M” represents at least one element selected from Ti , V , Cr , Mn , Fe , and Co , “A” represents at least one element selected from Mn , Cu , Ni , Fe , and Co , which is different from the selected “M” , 0.0 Подробнее

Номер записи: 67
05-03-2015 дата публикации

METAL NITRIDE MATERIAL FOR THERMISTOR, METHOD FOR PRODUCING SAME, AND FILM TYPE THERMISTOR SENSOR

Номер: US20150061821A1
Автор: Fujita Toshiaki, Nagatomo Noriaki, Tanaka Hiroshi
Принадлежит:

Provided are a metal nitride material for a thermistor, which has high reliability and high heat resistance and can be directly deposited on a film or the like without firing, a method for producing the same, and a film type thermistor sensor. 1. A metal nitride material for a thermistor , consisting of a metal nitride represented by the general formula: (MA)Al(NO)(where “M” represents at least one element selected from Ti , V , Cr , Mn , Fe , and Co , “A” represents at least one element selected from Mn , Cu , Ni , Fe , and Co , which is different from the selected “M” , 0.0 Подробнее

Номер записи: 68
20-02-2020 дата публикации

Perovskite nanocrystals and methods of making the same

Номер: US20200055882A1
Автор: Abhijit Hazarika, Joseph Matthew Luther
Принадлежит: Alliance for Sustainable Energy LLC

The present disclosure relates to a perovskite that includes A1-xA′xBX3, where A is a first cation, A′ is a second cation, B is a third cation, X is a first anion, and 0<x≤1. In some embodiments of the present disclosure, the perovskite may further include a second anion (X′) such that the perovskite includes A1-xA′xB(X1-zX′z)3, where 0<z≤1. In some embodiments of the present disclosure, the perovskite may further include a fourth cation (A*) such that the perovskite includes A1-x-yA′xA*yB(X1-zX′z)3, where 0<y≤1. In some embodiments of the present disclosure, the perovskite may further include a fifth cation (B′) such that the perovskite includes A1-x-yA′xA*yB1-aB′a(X1-zX′z)3, where 0<a≤1.

Подробнее
Номер записи: 69
22-05-2014 дата публикации

MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

Номер: US20140138139A1
Автор: Fukami Yoshiyuki, KON Noriko, MIKUNI Katsushi, OMORI Toshinori
Принадлежит: KABUSHIKI KAISHA NIHON MICRONICS

Provided is a method for manufacturing a multi-layer wiring board and the multi-layer wiring board that are capable of suppressing variation in resistance values. The method according to the present invention is the method for manufacturing a multi-layer wiring board. The method includes forming a resistor thin film, measuring resistance distribution of the resistor thin film, calculating resistor width adjustment rates of the plurality of resistors according to the resistance distribution, forming a pattern of a protective film on the resistor thin film, in which the pattern of the protective pattern has pattern width according to the resistor width adjustment rate, forming a pattern of a plating film on the resistor thin film at a position exposed from the protective film, and etching the resistor thin film at a position exposed from the plating film and the protective film so as to pattern the resistor thin film. 1. A method for manufacturing a multi-layer wiring board including a plurality of wiring layers and a plurality of resistors formed on a topmost wiring layer , the method comprising:forming a resistor thin film;measuring resistance distribution of the resistor thin film;calculating resistor width adjustment rates of the plurality of resistors according to the resistance distribution;forming a pattern of a protective film above the resistor thin film, the pattern of the protective pattern having pattern width according to the resistor width adjustment rate;forming a pattern of a plating film above the resistor thin film at a position exposed from the protective film; andetching the resistor thin film at a position exposed from the plating film and the protective film so as to pattern the resistor thin film.2. The method according to claim 1 , wherein in the forming of the pattern of the plating film claim 1 ,a resist pattern is formed above the protective film and the resistor thin film, andthe plating film is formed in an opening of the resist pattern.3. ...

Подробнее
Номер записи: 70
04-03-2021 дата публикации

STRAIN GAUGE AND SENSOR MODULE

Номер: US20210063258A1
Автор: Adachi Shigeyuki, ASAKAWA Toshiaki, IIJIMA Hirotsugu, KIMURA Yoichi, KITAMURA Atsushi, MISAIZU Eiji, SATO Satoshi
Принадлежит:

The present strain gauge includes a substrate having flexibility; a resistor formed from a material containing at least one of chromium and nickel, on the substrate; a pair of wiring patterns formed on the substrate and electrically connected to both ends of the resistor; and a pair of electrodes formed on the substrate and electrically connected to the pair of wiring patterns, respectively. The wiring patterns include a first layer extending from the resistor, and a second layer having a lower resistance than the first layer and layered on the first layer. On the substrate, an electronic component mounting area is demarcated, on which an electronic component electrically connected to the electrodes is mounted. 1. A strain gauge comprising:a substrate formed of resin and having flexibility;a resistor formed from a material containing at least one of chromium and nickel, on the substrate;a pair of wiring patterns formed on the substrate and electrically connected to both ends of the resistor, anda pair of electrodes formed on the substrate and electrically connected to the pair of wiring patterns, respectively,wherein the wiring patterns include a first layer extending from the resistor, and a second layer having a lower resistance than the first layer and layered on the first layer, andwherein on the substrate, an electronic component mounting area is demarcated, on which an electronic component electrically connected to the electrodes is mounted.213-. (canceled)14. A strain gauge comprising:a substrate formed of resin and having flexibility;a functional layer formed from a metal, an alloy, or a metal compound, directly on one surface of the substrate;{'sub': '2', 'a resistor formed as a film containing Cr, CrN, and CrN into which an element contained in the functional layer is diffused, on one surface of the functional layer;'}a pair of wiring patterns formed on the one surface of the functional layer and electrically connected to both ends of the resistor; anda ...

Подробнее
Номер записи: 71
03-03-2016 дата публикации

ELECTRONIC COMPONENT

Номер: US20160064124A1
Автор: Ikeda Hiroshi, Koto Kiyohiro, MIURA Tadamasa
Принадлежит:

An electronic component in which a metal layer is unlikely to be peeled from a substrate includes an insulating ceramic substrate, a ceramic layer diffusion-bonded to the substrate, a metal layer including a first principal surface and a second principal surface opposed to the first principal surface, with the first principal surface diffusion-bonded to the ceramic layer, and a characteristic layer diffusion-bonded to the second principal surface of the metal layer and prepared from a ceramic material, wherein the characteristic layer varies in resistance value with respect to ambient temperature or applied voltage. 1. An electronic component comprising:a substrate including an insulating ceramic material;a ceramic layer diffusion-bonded to the substrate;a metal layer including a first principal surface and a second principal surface opposed to the first principal surface, with the first principal surface diffusion-bonded to the ceramic layer; anda characteristic layer diffusion-bonded to the second principal surface of the metal layer and including a ceramic material; whereinthe characteristic layer varies in resistance value with respect to at least one of an ambient temperature and an applied voltage.2. The electronic component according to claim 1 , wherein the ceramic layer blocks atom transfer from the substrate to the characteristic layer.3. The electronic component according to claim 1 , wherein the ceramic layer is made of a same ceramic material as the characteristic layer.4. The electronic component according to claim 1 , wherein the substrate is a multilayer substrate including a plurality of insulating ceramic sheets including silicon-based glass.5. The electronic component according to claim 1 , wherein the substrate is made of an insulating ceramic material containing Al.6. The electronic component according to claim 1 , wherein the characteristic layer is a thermistor characteristic layer.7. The electronic component according to claim 6 , wherein the ...

Подробнее
Номер записи: 72
22-05-2014 дата публикации

ELECTROMAGNETIC WAVE SHIELDING STRUCTURE AND METHOD FOR FABRICATING THE SAME

Номер: US20140141232A1
Автор: HONG Ming-Tsung, LEE Yun-Ching, LIANG Li-Chun, YANG Wei-Ta
Принадлежит: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Provided is an electromagnetic wave shielding structure, including: a substrate; and a porous composite film formed on the substrate, wherein the porous composite film includes a continuous phase network fused from a plurality of metal nanoparticles, a first resin composition coated on a surface of the continuous phase network and a plurality of holes which are void spaces in the continuous phase network coated with the first resin composition. 1. An electromagnetic wave shielding structure , comprising:a substrate; anda porous composite film formed on the substrate, wherein the porous composite film comprises a continuous phase network fused from a plurality of metal nanoparticles, a first resin composition coated on a surface of the continuous phase network and a plurality of holes which are void spaces in the continuous phase network coated with the first resin composition.2. The electromagnetic wave shielding structure of claim 1 , wherein the first resin composition is essentially formed of an epoxy resins.3. The electromagnetic wave shielding structure of claim 1 , wherein the plurality of holes has an average diameter of between about 0.01 and about 0.5 μm.4. The electromagnetic wave shielding structure of claim 1 , further comprising a conductive adhesive layer formed on the porous composite film claim 1 , wherein the conductive adhesive layer comprises a conductive powder.5. The electromagnetic wave shielding structure of claim 4 , wherein the conductive powder comprises nickel claim 4 , silver claim 4 , copper or combinations thereof.6. The electromagnetic wave shielding structure of claim 4 , wherein the conductive adhesive layer further comprises a second resin composition claim 4 , and wherein the second resin composition is essentially formed of an epoxy resins.7. The electromagnetic wave shielding structure of claim 1 , further comprising a flexible PCB adhered to the conductive adhesive layer.8. The electromagnetic wave shielding structure of claim 7 ...

Подробнее
Номер записи: 73
01-03-2018 дата публикации

PTC HEATER WITH AUTONOMOUS CONTROL

Номер: US20180063886A1
Автор: Aeschliman Carl, Owens George F., Roach Kevin Edward, Shearer Jon
Принадлежит:

A heating arrangement has a positive temperature coefficient (“PTC”) heater. A resistor is electrically in series with the PTC heater sized and configured to limit current through the PTC heater and the resistor below a selected value. 1. A heating arrangement comprising:a positive temperature coefficient (“PTC”) heater; anda resistor electrically in series with the PTC heater sized and configured to limit current through the PTC heater and the resistor below a selected value.2. The heating arrangement as set forth in claim 1 , wherein said selected value is determined by parameters of a specific application.3. The heating arrangement as set forth in claim 2 , wherein at least one of the parameters is a material of the PTC heater.4. The heating arrangement as set forth in claim 2 , wherein at least one of the parameters is an area of the PTC heater.5. The heating arrangement as set forth in claim 2 , wherein at least one of the parameters is a maximum acceptable operating current for the PTC heater or resistor.6. The heating arrangement as set forth in claim 2 , wherein at least one of said parameters is a current available by a power supply in use with the heating arrangement.7. The heating arrangement as set forth in claim 2 , wherein at least one of said parameters is a current threshold that would cause a protective device to open a circuit associated with the heating arrangement.8. The heating arrangement as set forth in claim 1 , wherein said resistor is a negative temperature coefficient element.9. The heating arrangement as set forth in claim 1 , wherein said resistor is a resistance heating element.10. The heating arrangement as set forth in claim 9 , wherein said resistance heating element is placed on a surface of said PTC heater.11. The heating arrangement as set forth in claim 9 , wherein said resistance heating element is formed by wires which are incorporated into a substrate of said PTC heater.12. The heating arrangement as set forth in claim 9 , ...

Подробнее
Номер записи: 74
08-03-2018 дата публикации

SYSTEMS, ARTICLES, AND METHODS FOR ELECTROMYOGRAPHY SENSORS

Номер: US20180064363A1
Автор: Lake Stephen, Morun Cezar
Принадлежит:

Systems, articles, and methods for surface electromyography (“EMG”) sensors that combine elements from traditional capacitive and resistive EMG sensors are described. For example, capacitive EMG sensors that are adapted to resistively couple to a user's skin are described. Resistive coupling between a sensor electrode and the user's skin is galvanically isolated from the sensor circuitry by a discrete component capacitor included downstream from the sensor electrode. The combination of a resistively coupled electrode and a discrete component capacitor provides the respective benefits of traditional resistive and capacitive (respectively) EMG sensor designs while mitigating respective drawbacks of each approach. A wearable EMG device that provides a component of a human-electronics interface and incorporates such capacitive EMG sensors is also described. 1. A method of fabricating an electromyography (“EMG”) sensor , the method comprising:forming a first sensor electrode on a first surface of a substrate, wherein forming a first sensor electrode on a first surface of a substrate includes depositing at least a first layer of a first electrically conductive material on the first surface of the substrate;depositing an amplifier on a second surface of the substrate, the second surface opposite the first surface across a thickness of the substrate;depositing a first capacitor on the second surface of the substrate;depositing a first resistor on the second surface of the substrate; andforming a first electrically conductive pathway that communicatively couples the first sensor electrode and the amplifier through the first capacitor and the first resistor.2. The method of wherein depositing at least a first layer of a first electrically conductive material on the first surface of the substrate includes depositing a first layer including copper on the first surface of the substrate claim 1 , and wherein forming the first sensor electrode further includes depositing a second ...

Подробнее
Номер записи: 75
12-03-2015 дата публикации

FUNCTIONALIZATION OF A SUBSTRATE

Номер: US20150069354A1
Автор: Helander Michael, Lu Zheng-Hong, Qiu Jacky, Wang Zhibin
Принадлежит:

A method of increasing a work function of an electrode is provided. The method comprises obtaining an electronegative species from a precursor using electromagnetic radiation and reacting a surface of the electrode with the electronegative species. An electrode comprising a functionalized substrate is also provided. 1. A method of increasing a work function of an electrode comprising:obtaining an electronegative species from a precursor using electromagnetic radiation; andreacting a surface of the electrode with the electronegative species.2. The method of wherein the electronegative species is a halogen.3. The method of wherein the electromagnetic radiation has a wavelength of at least 100 nm.4. The method of wherein the electromagnetic radiation has a wavelength of less than 400 nm.5. The method of further comprising cleaning the surface of the electrode.6. The method of wherein the electrode is a transparent conducting oxide.7. The method of wherein the transparent conducting oxide is ITO.8. The method of wherein the electronegative species is selected to obtain an electrode of a predetermined work function.9. The method of wherein surface coverage of the species is selected to obtain an electrode of a predetermined work function.10. The method of wherein up to about a monolayer of halogen is functionalized to the substrate.11. The method of wherein the halogen is chlorine.12. The method of wherein the precursor is a volatile liquid.13. The method of wherein the precursor is a gas.14. The method of wherein the substrate is functionalized to increase its stability in air.15. An electrode comprising a substrate functionalized according to the method of .16. An organic electronic device comprising the electrode of .17. The use of a system to chemically functionalize a substrate with a species claim 15 , the system comprising:a reaction chamber;a radiation emitter operable to emit electromagnetic radiation into the reaction chamber;wherein the reaction chamber is ...

Подробнее
Номер записи: 76
04-03-2021 дата публикации

THIN FILM RESISTOR HAVING SURFACE MOUNTED TRIMMING BRIDGES FOR INCREMENTALLY TUNING RESISTANCE

Номер: US20210068256A1
Автор: Hwang Kyu-Pyung, Song Young Kyu
Принадлежит:

A resistor assembly is disclosed and comprises a first conductive trace, a second conductive trace, and a plurality of trimming bridges that electrically couple the first conductive trace to the second conductive trace. The resistor assembly also comprises a thin film resistor electrically coupled to the first conductive trace. The first conductive trace, the second conductive trace, the plurality of trimming bridges, and the thin film resistor are all part of a surface mounted layer of the resistor assembly. The plurality of trimming bridges are each removable to increase a resistance of the thin film resistor. 1. A resistor assembly , comprising:a first conductive trace, a second conductive trace, and a plurality of trimming bridges that electrically couple the first conductive trace to the second conductive trace; anda thin film resistor electrically coupled to the first conductive trace, wherein the first conductive trace, the second conductive trace, the plurality of trimming bridges, and the thin film resistor are all part of a surface mounted layer of the resistor assembly, and wherein the plurality of trimming bridges are each removable to increase a resistance of the thin film resistor.2. The resistor assembly of claim 1 , further comprising an electrical trace that is part of the surface mounted layer claim 1 , wherein the electrical trace electrically couples the thin film resistor to the first conductive trace.3. The resistor assembly of claim 1 , wherein the plurality of trimming bridges are spaced at equal distances from one another claim 1 , and wherein spacing the plurality of trimming bridges at equal distances from one another results in a linear increase in the resistance of the thin film resistor as each trimming bridge is removed.4. The resistor assembly of claim 1 , wherein the first conductive trace and the second conductive trace are arranged concentrically with respect to one another.5. The resistor assembly of claim 4 , wherein the first ...

Подробнее
Номер записи: 77
29-05-2014 дата публикации

METHOD OF FABRICATING ZINC OXIDE THIN FILM

Номер: US20140144770A1
Автор: Kim Seo Hyun, Lee Hyunhee, Yoo Young Zo, Yoon Gun Sang
Принадлежит: SAMSUNG CORNING PRECISION MATERIALS CO., LTD.

A method of fabricating a zinc oxide (ZnO) thin film in which the surface shape of the ZnO thin film can be controlled during deposition of the ZnO thin film. The method includes depositing the ZnO thin film on a substrate by chemical vapor deposition (CVD). The CVD feeds an etching gas that etches the ZnO thin film concurrently with a source gas and an oxidizer gas, thereby controlling the surface shape of the ZnO thin film that is being deposited. 1. A method of fabricating a zinc oxide thin film comprising depositing a zinc oxide thin film on a substrate by chemical vapor deposition , wherein the chemical vapor deposition comprises feeding an etching gas that etches the zinc oxide thin film concurrently with a source gas and an oxidizer gas , thereby controlling a surface shape of the zinc oxide thin film that is being deposited.2. The method of claim 1 , wherein the source gas comprises a mixture of diethylzinc (DEZn) and a hydrocarbon-based solvent claim 1 , and the oxidizer gas comprises HO.3. The method of claim 2 , wherein the source gas is fed at 1.0 to 9.0 g/min and the oxidizer gas is fed at 0.5 to 5.0 g/min.4. The method of claim 1 , wherein a flow rate of the etching gas is controlled in a range from 1 to 50 sccm.5. The method of claim 1 , wherein the etching gas comprises one selected from the group of fluorine-containing gases consisting of CF claim 1 , CF claim 1 , CF claim 1 , CFand NF.6. The method of claim 1 , further comprising preheating the source gas and the oxidizer gas before feeding the source gas and the oxidizer gas into a process chamber where the chemical vapor deposition is carried out.7. The method of claim 1 , wherein the source gas and the oxidizer gas is fed along different paths into a process chamber where the chemical vapor deposition is carried out.8. The method of claim 7 , wherein each of the source gas and the oxidizer gas is carried into the process chamber on a carrier gas that comprises an inert gas.9. The method of claim ...

Подробнее
Номер записи: 78
27-02-2020 дата публикации

ELECTRIC HEATER

Номер: US20200063971A1
Автор: SONG Misun
Принадлежит:

An electric heater includes a substrate (an insulating material capable of forming a conductor pattern on a surface of an insulating substrate), a first plane heating element formed on one surface of the substrate, and a second plane heating element formed on one surface of the substrate to be located outside the first plane heating element. The first plane heating element includes a first pattern portion connecting a start point with an end point located in a first zone, a pair of first electrodes located outside the first zone, and a pair of first connectors connecting the first pattern portion with the first electrodes. The second plane heating element includes a second pattern portion located in a second zone surrounding the first zone and connecting a start point with an end point, and at least some of the first connectors are located in the second zone. 1. An electric heater comprising:a substrate;a first plane heating element located at a surface of the substrate, the first plane heating element defining a first zone of the surface of the substrate; anda second plane heating element located at the surface of the substrate outside the first plane heating element, the second plane heating element defining a second zone that surrounds the first zone, a first pattern portion that is located in the first zone, the first pattern portion having a start point and an end point that are connected to each other,', 'a pair of first electrodes located outside the first zone, and', 'a pair of first connectors that connect the first pattern portion to the pair of first electrodes,, 'wherein the first plane heating element compriseswherein the second plane heating element comprises a second pattern portion located in the second zone, the second pattern portion having a start point and an end point that are connected to each other, andwherein at least a portion of the pair of first connectors are located in the second zone.2. The electric heater of claim 1 , wherein the start ...

Подробнее
Номер записи: 79
11-03-2021 дата публикации

DECORATION MEMBER

Номер: US20210072441A1
Автор: Heo Nansra, Jo Pilsung, Kim Ki Hwan, Kim Yong Chan, Shon Jeong Woo, SONG Jin Suk
Принадлежит:

A decoration member including: a color developing layer including a light reflective layer and a light absorbing layer provided on the light reflective layer; and a substrate provided on one surface of the color developing layer. The light absorbing layer includes a copper oxynitride (CuON). 2. The decoration member of claim 1 , wherein Tx is greater than or equal to 0.51 and less than or equal to 1.3. The decoration member of claim 1 , wherein σis greater than or equal to 1.1 and less than or equal to 1.9.4. The decoration member of claim 1 , wherein a hue-angle h* in CIE LCh color space of the light absorbing layer is in a range of 105° to 315°.5. The decoration member of claim 1 , wherein the light reflective layer is a single layer or a multilayer comprising one or more materials selected from the group consisting of indium (In) claim 1 , titanium (Ti) claim 1 , tin (Sn) claim 1 , silicon (Si) claim 1 , germanium (Ge) claim 1 , aluminum (Al) claim 1 , copper (Cu) claim 1 , nickel (Ni) claim 1 , vanadium (V) claim 1 , tungsten (W) claim 1 , tantalum (Ta) claim 1 , molybdenum (Mo) claim 1 , neodymium (Nd) claim 1 , iron (Fe) claim 1 , chromium (Cr) claim 1 , cobalt (Co) claim 1 , gold (Au) claim 1 , silver (Ag) claim 1 , oxides thereof claim 1 , nitrides thereof claim 1 , oxynitrides thereof claim 1 , carbon and carbon composites.6. The decoration member of claim 1 , wherein the light absorbing layer has a refractive index of 0 to 8 at a wavelength of 400 nm.7. The decoration member of claim 1 , wherein the light absorbing layer has an extinction coefficient of greater than 0 and less than or equal to 4 at a wavelength of 400 nm.8. The decoration member of claim 1 , wherein the light absorbing layer includes two or more points with different thicknesses.9. The decoration member of claim 1 , wherein the color developing layer further comprises a color film.10. The decoration member of claim 1 , wherein the substrate comprises a pattern layer claim 1 , and the ...

Подробнее
Номер записи: 80
08-03-2018 дата публикации

Printed transparent heaters using embedded micro-wires

Номер: US20180070411A1
Автор: Haoyan Wei
Принадлежит: Eastman Kodak Co

A transparent heater includes a plurality of high aspect ratio micro-wires. A plurality of channels is formed into the surface of a transparent substrate within an active heater region. The channels have a width of between 4 microns and 9 microns to insure that they are invisible to the naked eye, and a depth that is at least 1.5 times the width. Spacing between the channels is preferably at least 100 μm. Micro-wires are formed by at least partially filling the channels with a conductive material. Power source connections are provided to connect to an electrical power source to supply a current through the plurality of micro-wires. An average optical transmittance of the transparent heater within the active heater region is greater than 50 percent.

Подробнее
Номер записи: 81
05-06-2014 дата публикации

ELECTROLESS NICKEL PLATING BATH COMPOSITION

Номер: US20140150689A1
Автор: BERA Holger, JANSSEN Boris Alexander, Schafsteller Britta, WEISSBROD Sebastian
Принадлежит: ATOTECH DEUTSCHLAND GMBH

The present invention relates to an aqueous plating bath composition for depositing a nickel phosphorous alloy having a phosphorous content in the range of 5 to 12 wt. %. The plating bath comprises a sulfur-containing organic stabilizing agent. 1. An aqueous plating bath composition for electroless plating of a nickel phosphorous alloy , the plating bath comprising(i) a water soluble source of nickel ions(ii) a hypophosphite compound(iii) at least one complexing agent selected from the group comprising carboxylic acids, polyamines, sulfonic acids and mixtures thereof and [{'br': None, 'sup': 1', '2, 'sub': 2', 'n', '3, 'RS—(CH)—SOR\u2003\u2003(1)'}, {'br': None, 'sup': 3', '3, 'sub': 3', '2', 'm', '2', 'm', '3, 'RSO—(CH)—S—S—(CH)—SOR\u2003\u2003(2)'}], '(iv) a stabilizing agent selected from the group consisting of compounds according to formulae (1) and (2)wherein{'sup': 1', '2', '3, 'R, Rand Rare independently selected from the group consisting of hydrogen, methyl, ethyl, propyl, butyl, lithium, sodium, potassium and ammonium,'}{'b': '6 and', 'n ranges from 1 to'}m ranges from 1 to 6and having a pH value in the range of 3.5 to 6.5.2. The aqueous plating bath according to wherein the concentration of nickel ions ranges from 1 to 18 g/l.3. The aqueous plating bath composition according to wherein the hypophosphite compound is selected from the group comprising phosphorous acid claim 1 , sodium hypophosphite claim 1 , potassium hypophosphite and ammonium hypophosphite.4. The aqueous plating bath composition according to wherein the concentration of the hypophosphite compound ranges from 2 to 60 g/l.5. The aqueous plating bath composition according to wherein the concentration of the at least one complexing agent ranges from 1 to 200 g/l.6. The aqueous plating bath composition according to wherein the concentration of the stabilizing agent according to formulae (1) and (2) ranges from 1 to 100 ppm.7. The aqueous plating bath composition according to wherein the ...

Подробнее
Номер записи: 82
11-03-2021 дата публикации

THERMISTOR, METHOD FOR MANUFACTURING SAME, AND THERMISTOR SENSOR

Номер: US20210074453A1
Автор: Chitose Norihisa, Fujita Toshiaki, Nagatomo Noriaki, Sako Nagisa, Suzuki Shunpei
Принадлежит:

Provided is a thermistor which has a smaller change in resistance value between before and after a heat resistance test and from which a high B constant is obtained, a method for manufacturing the same, and a thermistor sensor. The thermistor is a thermistor formed on a substrate and includes: an intermediate stacked portion formed on the substrate; and a main metal nitride film layer formed of a thermistor material of a metal nitride on the intermediate stacked portion, wherein the intermediate stacked portion includes a base thermistor layer formed of a thermistor material of a metal nitride and an intermediate oxynitride layer formed on the base thermistor layer, the main metal nitride film layer is formed on the intermediate oxynitride layer, and the intermediate oxynitride layer is a metal oxynitride layer formed through oxidation of the thermistor material of the base thermistor layer immediately below the intermediate oxynitride layer. 1. A thermistor formed on a substrate , the thermistor comprising:an intermediate stacked portion formed on the substrate; anda main metal nitride film layer formed of a thermistor material of a metal nitride on the intermediate stacked portion,wherein the intermediate stacked portion includes one or plural pairs of two layers which are a base thermistor layer formed of a thermistor material of a metal nitride and an intermediate oxynitride layer formed on the base thermistor layer and are stacked,wherein the main metal nitride film layer is formed on the intermediate oxynitride layer which is an uppermost portion of the intermediate stacked portion, andwherein the intermediate oxynitride layer is a metal oxynitride layer formed through oxidation of the thermistor material of the base thermistor layer immediately below the intermediate oxynitride layer.2. The thermistor according to claim 1 ,wherein the base thermistor layer and the main metal nitride film layer have the same composition.3. The thermistor according to claim 1 , ...

Подробнее
Номер записи: 83
11-03-2021 дата публикации

FLAT COIL CARRIER

Номер: US20210076458A1
Автор: Laemmle Christopher, Liebertseder Johannes, Menrath Andreas, Schmidt Felix, Schroth Holger, Watzlawski Markus
Принадлежит:

A flat coil carrier may include a carrier body. The carrier body may include, on an axial front side, a groove spiral configured to receive a coil wire. The groove spiral may have an axially open groove opening and may include a plurality of radially consecutive groove sections. The plurality of radially consecutive groove sections may each have an axially open groove section opening of a plurality of groove section openings. The plurality of radially consecutive groove sections may each be separated from one another by a common separating wall section of a plurality of separating wall sections of the carrier body. At least one of the plurality of separating wall sections may protrude from the carrier body and may have at least one undercut section including a radially protruding protrusion such that an undercut for the coil wire is formed in the at least one undercut section. 1. A flat coil carrier for a flat coil , comprising:a carrier body for receiving a spirally wound coil wire;the carrier body including, on an axial front side, a groove spiral configured to receive the coil wire, the groove spiral having an axially open groove opening and extending spirally on the carrier body transversely to an axial direction such that the groove spiral includes a plurality of radially consecutive groove sections;the plurality of radially consecutive groove sections each having an axially open groove section opening, of a plurality of groove section openings;wherein the plurality of radially consecutive groove sections are each separated from one another by a common separating wall section of a plurality of separating wall sections of the carrier body; andwherein at least one of the plurality of separating wall sections protrudes from the carrier body and has at least one undercut section including a radially protruding protrusion that radially reduces a corresponding groove section opening of the plurality of groove section openings such that an undercut for the coil wire ...

Подробнее
Номер записи: 84
16-03-2017 дата публикации

Device and inspection method of the same

Номер: US20170074925A1
Автор: Hiroaki Yamazaki
Принадлежит: Toshiba Corp

According to one embodiment, a device is disclosed. The device includes a substrate, an element provided on the substrate, and a film on the substrate. The film and the substrate constitute a cavity in which the element is housed. The device further includes a member capable of generating heat or deforming.

Подробнее
Номер записи: 85
24-03-2022 дата публикации

Server motherboard, server, and power supply control method

Номер: US20220091647A1
Автор: Yongbin HU
Принадлежит: Lenovo Beijing Ltd

A server motherboard includes a protective film, a substrate, and a power supply circuit. An equivalent electrical parameter of the protective film changes as a shape of the protective film changes. The shape changes when a temperature of the server mother board is greater than a predetermined temperature. A portion of at least one side surface of the substrate is covered by the protective film. The power supply circuit is electrically connected to the protective film and configured to detect the equivalent electrical parameter of the protective film. The power supply circuit stops outputting a power supply voltage to the substrate when a change of the equivalent electrical parameter is detected.

Подробнее
Номер записи: 86
15-03-2018 дата публикации

Chip Resistor and Method for Manufacturing Same

Номер: US20180075954A1
Автор: Matsumoto Kentaro
Принадлежит:

Provided is a chip resistor having wide and flat end-face electrodes on a surface thereof and having increased connection reliability between upper electrodes and the end-face electrodes. The chip resistor according to the present invention is provided with: a cuboidal insulating substrate ; a pair of upper electrodes disposed at both ends in a longitudinal direction on a surface of the insulating substrate ; a resistor body disposed between the upper electrodes ; an insulating protective layer covering the entire surfaces of the upper electrodes and the resistor body ; and a pair of end-face electrodes disposed on both end faces in the longitudinal direction of the insulating substrate , wherein the upper electrodes include bent portions extending around from between the insulating substrate and the protective layer along the end faces of the protective layer , and the end-face electrodes are connected to the exposed portions of the upper electrodes , including the bent portions , exposed from between the insulating substrate and the protective layer 1. A chip resistor comprising: an insulating substrate that is shaped like a cuboid;a pair of front electrodes that are provided on lengthwise opposite edge portions of a front surface of the insulating substrate;a resistor body that is disposed between the two front electrodes and connected to the two front electrodes;a protection layer that covers entire surfaces of the resistor body and the two front electrodes; and 'the front electrodes have bent portions that extend around from between the insulating substrate and the protection layer along end surfaces of the protection layer; and the end-surface electrodes are connected to exposed portions of the front electrodes including the bent portions, that are exposed from between the insulating substrate and the protection layer.', 'a pair of end-surface electrodes that are provided on lengthwise opposite end surfaces of the insulating substrate to be electrically ...

Подробнее
Номер записи: 87
15-03-2018 дата публикации

INTEGRATED HEATER AND SENSOR SYSTEM

Номер: US20180077752A1
Автор: LINDLEY Jacob, Swanson Cal
Принадлежит: WATLOW ELECTRIC MANUFACTURING COMPANY

The present disclosure provides a thermal system that includes an array of heating resistor circuits having first termination ends and second termination ends, and a plurality of nodes connected to the heating resistor circuits at the first and second termination ends. The thermal system further includes power wires to provide power to the heating resistor circuits and signal wires to sense a temperature of each of the heating resistor circuits. Each node is connected to a power wire and to a signal wire, and a number of heating resistor circuits is greater than or equal to a number of power wires and to a number of the signal wires. 1. A thermal system comprising:an array of heating resistor circuits, each of the heating resistor circuits having a first termination end and a second termination end;a plurality of nodes that connect to the array of heating resistor circuits at each of the first and second termination ends;a plurality of power wires to provide power to the array of heating resistor circuits; anda plurality of signal wires to sense a temperature of each of the heating resistor circuits,wherein each of the plurality of nodes is connected to a power wire from among the plurality of power wires and to a signal wire from among the plurality of signal wires, andwherein a number of heating resistor circuits is greater than or equal to a number of power wires and to a number of the signal wires.2. The thermal system of further comprising a control system coupled to the plurality of power wires and configured to provide power to at least one of the heating resistor circuits by way of the power wires.3. The thermal system of claim 2 , wherein the control system is configured to selectively apply power or a ground signal to the plurality of nodes by way of the power wires4. The thermal system of claim 2 , wherein the control system is coupled to the plurality of signal wires and configured to measure a resistance of each of the heating resistor circuits by way ...

Подробнее
Номер записи: 88
26-03-2015 дата публикации

CONDUCTIVE ADHESIVE TAPE AND MANUFACTURING METHOD THEREOF

Номер: US20150086743A1
Автор: JUNG Yong Sik, LEE SEUNG HOON, SO Yun Mi
Принадлежит:

Provided is a conductive adhesive tape comprising: a substrate that is formed in a nano-web form having a number of pores by spinning a polymer material by a spinning method; and a conductive adhesive layer that is formed in a non-porous form by directly spinning a conductive adhesive material by a spinning method on one or both surfaces of the substrate, or that is laminated on one or both surfaces of the substrate. Accordingly, thickness of the adhesive tape can be made thin, adhesive strength of the adhesive tape can be enhanced, and the adhesive tape can be precisely attached on even a curved surface. Further, when removing the adhesive tape from components, the adhesive layer can be prevented from remaining on the surface of the components. 1. A conductive adhesive tape comprising:a substrate that is formed in a nano-web form having a number of pores by spinning a polymer material; anda conductive adhesive layer that is formed in a non-porous form by directly spinning a conductive adhesive material by a spinning method on one or both surfaces of the substrate, or that is laminated on one or both surfaces of the substrate.2. The conductive adhesive tape according to claim 1 , wherein the spinning method employs any one of electrospinning claim 1 , air-electrospinning (AES) claim 1 , electrospray claim 1 , electrobrown spinning claim 1 , centrifugal electrospinning claim 1 , and flash-electrospinning.3. The conductive adhesive tape according to claim 1 , wherein the conductive adhesive layer comprises any one of an electrically conductive metal claim 1 , carbon black claim 1 , carbon nanotube claim 1 , graphene claim 1 , and conductive polymer (PDOT) claim 1 , and a conductive adhesive material with a mixture of an adhesive and a solvent.4. The conductive adhesive tape according to claim 1 , wherein the conductive adhesive layer comprises a first conductive adhesive layer formed on one surface of the substrate claim 1 , and a second conductive adhesive layer ...

Подробнее
Номер записи: 89
24-03-2016 дата публикации

METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A THIN FILM RESISTOR FORMED ON AN LCP SOLDER MASK AND RELATED DEVICES

Номер: US20160088734A1
Автор: JR. Louis Joseph, Rendek
Принадлежит:

A method of making an electronic device may include forming at least one circuit layer that includes solder pads on a substrate and forming at least one liquid crystal polymer (LCP) solder mask having mask openings therein. The method may also include forming at least one thin film resistor on the LCP solder mask and coupling the at least one LOP solder mask to the substrate so that the at least one thin film resistor is coupled to the at least one circuit layer and so that the solder pads are aligned with the mask openings. 1. A method of making an electronic device comprising:forming at least one circuit layer comprising a plurality of solder pads on a substrate;forming at least one liquid crystal polymer (LCP) solder mask having a plurality of mask openings therein;forming at least one thin film resistor on the LCP solder mask; andcoupling the at least one LCP solder mask to the substrate so that the at least one thin film resistor is coupled to the at least one circuit layer and so that the plurality of solder pads is aligned with the plurality of mask openings.2. The method of wherein the at least one LCP solder mask is coupled to the substrate so that the at least one thin film resistor is sandwiched between the at least one LCP solder mask and the substrate.3. The method of wherein forming the at least one circuit layer comprises forming a plurality of circuit layers carried by opposing surfaces of the substrate; wherein forming the at least one LCP solder mask comprises forming a plurality of LCP solder masks; wherein forming the at least one thin film resistor comprises forming at least one thin film resistor on each of the plurality of LCP solder masks; and wherein each of the plurality of LCP solder masks are coupled to the opposing surfaces of the substrate.4. The method of wherein each LCP solder mask is coupled to a respective one of the surfaces of the substrate so that the plurality of thin film resistors are sandwiched between the plurality of LCP ...

Подробнее
Номер записи: 90
02-04-2015 дата публикации

Metal nitride film for thermistor, process for producing same, and thermistor sensor of film type

Номер: US20150092820A1
Автор: Hiroshi Tanaka, Hitoshi Inaba, Kazutaka Fujiwara, Noriaki Nagatomo, Toshiaki Fujita
Принадлежит: Mitsubishi Materials Corp

Provided are a metal nitride film for a thermistor, which has an excellent bending resistance and can be directly deposited on a film or the like without firing, a method for producing the same, and a film type thermistor sensor. The metal nitride film for a thermistor, which consists of a metal nitride represented by the general formula: Ti x Al y N z (where 0.70≦y/(x+y)≦0.95, 0.4≦z≦0.5, and x+y+z=1), wherein the crystal structure thereof is a hexagonal wurtzite-type single phase, and the peak ratio of the diffraction peak intensity of a-axis orientation (100) relative to the diffraction peak intensity of c-axis orientation (002) (i.e., the diffraction peak intensity of a-axis orientation (100)/the diffraction peak intensity of c-axis orientation (002)) is 0.1 or lower in X-ray diffraction.

Подробнее
Номер записи: 91
31-03-2022 дата публикации

Silicide passivation of niobium

Номер: US20220102614A1
Автор: Copel Matthew W., Hannon James B., Pyzyna Adam M.
Принадлежит:

A superconducting device which includes a substrate, multiple niobium leads formed on the substrate, a niobium silicide (NbSi) passivation layer formed on a surface of at least one of the multiple niobium leads, and an aluminum lead formed directly on at least a portion of the NbSipassivation layer such that an interface therebetween is substantially free of oxygen and oxidized material, where the multiple niobium leads and the aluminum lead are constructed to carry a supercurrent while in use. 1. A superconducting device , comprising:a substrate;a plurality of niobium leads formed on said substrate;{'sub': 'x', 'a niobium silicide (NbSi) passivation layer formed on a surface of at least one of said plurality of niobium leads, wherein x is in a range from 0.5 to 2; and'}{'sub': 'x', 'an aluminum lead formed directly on at least a portion of said NbSipassivation layer such that an interface therebetween is substantially free of oxygen and oxidized material,'}wherein said plurality of niobium leads and said aluminum lead are constructed to carry a supercurrent while in use.2. The superconducting device of claim 1 , further comprising:{'sub': 'x', 'a second aluminum lead formed directly on at least a portion of a NbSipassivation layer formed on a surface of a second one of said plurality of niobium leads such that an interface therebetween is substantially free of oxygen and oxidized material; and'}a quantum tunneling barrier formed between said first and second aluminum leads so as to form a Josephson junction.3. The superconducting device of claim 1 , further comprising a plurality of aluminum leads each having at least one region of direct contact with a respective one of a NbSipassivation layer of said plurality of niobium leads claim 1 ,{'sub': 'x', 'wherein a plurality of pairs of said plurality of aluminum leads have at least one quantum tunneling barrier formed therebetween so as to form a plurality of Josephson junctions that are in superconducting connection ...

Подробнее
Номер записи: 92
19-06-2014 дата публикации

EXPANSION CARD AND MOTHERBOARD FOR SUPPORTING THE EXPANSION CARD

Номер: US20140168925A1
Автор: WU KANG
Принадлежит:

A motherboard assembly includes a motherboard and an expansion card. The motherboard includes an expansion slot with a first idle pin connected to a standby power through a resistor. The expansion card includes an edge connector having a second idle pin and first to fifth electronic switches. When the first electronic switch receives a high level signal through the first and second idle pins, the first and fourth electronic switches are turned on. The second, third, and fifth electronic switches are turned off. The second system power outputs a standby voltage through the standby voltage output terminal. When the first electronic switch receives a low level signal, the first and fourth electronic switches are turned off. The second, third, and fifth electronic switches are turned on. The standby power outputs a standby voltage through the standby voltage output terminal. 1. An expansion card , comprising:first to third resistors;a standby voltage output terminal;an edge connector comprising a plurality of power pins, a plurality of ground pins, a plurality of signal pins, and an idle pin;a first electronic switch comprising a first terminal connected to the idle pin of the edge connector, a second terminal grounded, and a third terminal connected to a standby power through the first resistor;a second electronic switch comprising a first terminal connected to the third terminal of the first electronic switch, a second terminal grounded, a third terminal connected to the standby power through the second resistor;a third electronic switch comprising a first terminal connected to the third terminal of the first electronic switch, a second terminal grounded, a third terminal connected to a first system power through the third resistor;a fourth electronic switch comprising a first terminal connected to the third terminal of the third electronic switch, a second terminal connected to a second system power, a third terminal connected to the standby voltage output terminal; ...

Подробнее
Номер записи: 93
21-03-2019 дата публикации

OPTICAL SWITCH

Номер: US20190086764A1
Автор: Li Ming, Tu Xin, XING Jiejiang
Принадлежит:

The present application discloses an optical switch, including a first optical waveguide, a second optical waveguide, and a first heater, where a place at which a distance between the first optical waveguide and the second optical waveguide is the smallest is a junction; the first heater is adjacent to the third optical sub-waveguide; and there is a first dielectric material between the first heater and the third optical sub-waveguide, and there is a second dielectric material between the third optical sub-waveguide and the fourth optical sub-waveguide, where a thermal conductivity of the first dielectric material is greater than a thermal conductivity of the second dielectric material. The optical switch has advantages such as high heating efficiency, a small quantity of heaters, and simple control. 1. An optical switch , comprising:a first optical waveguide comprising a first optical sub-waveguide and a third optical sub-waveguide;a second optical waveguide comprising a second optical sub-waveguide and a fourth optical sub-waveguide, wherein the first optical waveguide and the second optical waveguide have a junction therebetween;a first heater disposed adjacent the third optical sub-waveguide;a first dielectric material disposed between the first heater and the third optical sub-waveguide; anda second dielectric material disposed between the third optical sub-waveguide and the fourth optical sub-waveguide, wherein a thermal conductivity of the first dielectric material is greater than a thermal conductivity of the second dielectric material.2. The optical switch according to claim 1 , wherein when the first heater is operating claim 1 , a temperature of the third optical sub-waveguide at a place that is at a first distance from the junction is higher than a temperature of the third optical sub-waveguide at a place that is near the junction.3. The optical switch according to claim 1 , wherein the first heater comprises:a first electrode, a second electrode, and a ...

Подробнее
Номер записи: 94
26-06-2014 дата публикации

HIGH BANDWIDTH DIFFERENTIAL LEAD WITH DEVICE CONNECTION

Номер: US20140176176A1
Автор: Jr. James H., MCGRATH
Принадлежит: TEKTRONIX, INC.

A high bandwidth solder-less lead may be connected to an electrical device having land patterns so that signals on the device may be more easily measured through the lead. The lead includes an attachment mechanism to mount the lead on the device, a microspring housing and at least one microspring. The microspring connects one of the particular land patterns on the device to the lead where it may be easier to couple to a measurement device than to the electrical device itself The lead may be coupled to a flexible electrical conduit to make attaching to the testing device even easier. In other versions, a uniform connector may be temporarily attached to the solder-less lead to test the device. Then the connector may be disconnected from the first lead and connected to another lead to test another area of the device. 1. A high bandwidth solder-less lead mountable to an electrical device having land patterns , the lead comprising:an attachment mechanism structured to securely attach the lead to the device;a microspring housing; anda microspring carried in the housing, a portion of the microspring extending beyond a surface of the microspring housing when the microspring is unsprung, and the microspring structured to electrically couple to one of the land patterns of the electrical device when the lead is attached to the device by the attachment mechanism.2. The high bandwidth solder-less lead of claim 1 , further comprising:a substrate coupled to the microspring housing; anda signal pad disposed on the substrate, the signal pad structured to be electrically coupled to the land pattern by the microspring.3. The high bandwidth solder-less lead of claim 2 , further comprising a ground pad disposed on the substrate claim 2 , the ground pad structured to be electrically coupled to another of the land patterns by a second microspring.4. The high bandwidth solder-less lead of claim 1 , further comprising a second microspring carried by the microspring housing claim 1 , and ...

Подробнее
Номер записи: 95
19-03-2020 дата публикации

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

Номер: US20200090842A1
Автор: Choi Hyun Jun, Kim Hyung Gon, Kim Jung Il, LEE Jong Pil, Roh Hyung Seok, TANAKA Ichiro, Yoo Doo Ho
Принадлежит:

An electronic component and a manufacturing method thereof are disclosed. An electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, and at least one dummy electrode pattern disposed to be spaced apart from the first electrode pattern and the second electrode pattern and disposed on the substrate. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern. 1. An electronic component comprising:a substrate;a conductor pattern portion disposed on the substrate and extending in a first direction;a first electrode pattern and a second electrode pattern disposed at opposite ends of the conductor pattern portion in the first direction, respectively, and disposed on the conductor pattern portion; andat least one dummy electrode pattern spaced apart from the first electrode pattern and the second electrode pattern and disposed on the substrate,wherein a width, in a second direction different from the first direction, of the first electrode pattern is substantially the same as a width, in the second direction, of a portion of the conductor pattern portion in contact with the first electrode pattern, anda width, in the second direction, of the second electrode pattern is substantially the same as a width, in the second direction, of a portion of the conductor pattern portion in contact with the second electrode pattern.2. The electronic component of claim 1 , wherein the at least one dummy electrode pattern includes:a first dummy electrode pattern and a second dummy electrode pattern disposed at opposite sides of the first electrode pattern in the second ...

Подробнее
Номер записи: 96
05-04-2018 дата публикации

Low temperature fabrication of lateral thin film varistor

Номер: US20180096760A1
Автор: Jeffrey P. Gambino, Richard S. Graf, Sudeep Mandal
Принадлежит: International Business Machines Corp

A structure and method for fabricating a laterally configured thin film varistor surge protection device using low temperature sputtering techniques which do not damage IC device components contiguous to the varistor being fabricated. The lateral thin film varistor may include a continuous layer of alternating regions of a first metal oxide layer and a second metal oxide layer formed between two laterally spaced electrodes using a low temperature sputtering process followed by a low temperature annealing process.

Подробнее
Номер записи: 97
23-04-2015 дата публикации

RADIATION HEATER APPARATUS

Номер: US20150110477A1
Автор: Kajino Hidetada, Kondoh Kouji, Maeda Manabu, Masuda Gentaro, Ota Koji, SAGOU Yasuhiro, Shiraishi Yoshihiko
Принадлежит: Denso Corporation

A radiation heater apparatus has a plurality of heat radiation parts and a plurality of heating parts. A low thermal conductive part is formed between adjacent two of the heat radiation parts. The low thermal conductive part is provided with resin material which mainly forms a substrate part. The low thermal conductive part thermally isolates the heat radiation part by surrounding a periphery of the heat radiation part. As a body contacts with the surface of the apparatus, the thermal energy of specific heat radiation part directly under the body dissipates heat to the body. Furthermore, heat transfer from the periphery of the specific heat radiation part to the specific heat radiation part is reduced by the low thermal conductive part. 1. A radiation heater apparatus comprising:a plurality of heat radiation parts which is capable of emitting heat radiation by thermal energy generated by being supplied with electric current, and are arranged on a surface in a distributed manner; anda low thermal conductive part which has a thermal conductivity lower than a thermal conductivity in a cross section containing the heat radiation part, and is disposed to surround each of the plurality of heat radiation parts.2. The radiation heater apparatus claimed in claim 1 , whereinthe heat radiation part is formed in a shape of thin plate.3. The radiation heater apparatus claimed in claim 2 , further comprising:a substrate part supporting the heat radiation parts; anda conductor part through which electric current can flow and which is disposed between adjacent two of the heat radiation parts, whereinthe low thermal conductive part contains the substrate part and the conductor part, without containing the heat radiation parts.4. The radiation heater apparatus claimed in claim 3 , whereina thermal conductivity in a cross section containing the heat radiation part is an average thermal conductivity in a cross section crossing the heat radiation part, and whereinthe thermal ...

Подробнее
Номер записи: 98
13-04-2017 дата публикации

LOW TEMPERATURE FABRICATION OF LATERAL THIN FILM VARISTOR

Номер: US20170104054A1
Автор: Gambino Jeffrey P., Graf Richard S., Mandal Sudeep
Принадлежит:

A structure and method for fabricating a laterally configured thin film varistor surge protection device using low temperature sputtering techniques which do not damage IC device components contiguous to the varistor being fabricated. The lateral thin film varistor may include of a continuous layer of alternating regions of a first metal oxide layer and a second metal oxide layer formed between two laterally spaced electrodes using a low temperature sputtering process followed by a low temperature annealing process. 1. A method of forming a lateral thin film varistor comprising: forming the first metal oxide layer comprised of a plurality of spaced apart sections of the first metal oxide on a dielectric layer,', 'forming a pair of isolation layer sections, comprised of an insulating material, on the dielectric layer, laterally outside the first metal oxide layer, and', 'forming the second metal oxide layer comprised of a plurality of spaced apart sections of the second metal oxide on the dielectric layer, each of the sections of the second metal oxide layer being located between a pair of the sections of the first metal oxide layer., 'forming a continuous layer comprising alternating regions of a first metal oxide layer and a second metal oxide layer between two laterally spaced electrodes using sputtering process followed by an annealing process, including'}2. The method of claim 1 , wherein the first metal oxide layer comprises zinc oxide.3. The method of claim 1 , further comprising doping the first metal oxide layer with aluminum oxide.4. The method of claim 1 , wherein the second metal oxide layer comprises bismuth oxide.5. The method of claim 1 , further comprising doping the second metal oxide layer with aluminum oxide.6. The method of claim 1 , wherein the annealing process is carried out in an inert gas atmosphere.7. The method of claim 1 , wherein the annealing process comprises heating the continuous layer to a temperature not exceeding a maximum ...

Подробнее
Номер записи: 99
26-03-2020 дата публикации

Electrical power conversion system

Номер: US20200099308A1
Автор: David Russell Murray, Matthew HARBER
Принадлежит: SIEMENS AG

An improved electrical power conversion system converts a high voltage (HV) from a HV electrical power supply to a low voltage. The electrical power conversion system includes at least one power converter and at least one RC network connected in series. The RC network includes a plurality of resistive components and a plurality of capacitive components electrically connected in series. The at least one RC network and at least one power converter are arranged to be connected across a line potential of the HV electrical power supply.

Подробнее
Номер записи: 100