КОЛЬЦЕВОЕ СИММЕТРИРУЮЩЕ-СОГЛАСУЮЩЕЕ УСТРОЙСТВО

Симметрирующе-согласующее устройство, содержащее короткозамкнутый отрезок двухпроводной линии из проводников одинакового диаметра, и коаксиальный разъем, установленный на короткозамкнутом конце отрезка, отличающееся тем, что каждый из отрезков двухпроводной линии выполнен в виде трубчатых полуколец, одни концы которых соединены между собой и образуют короткозамкнутый конец двухпроводной линии, а между другими концами трубчатых полуколец имеется зазор, так что оба трубчатых полукольца образуют кольцо с зазором, диаметр кольца D= λ/2•π, где λ- длина рабочей волны, а линия, проходящая через середину зазора и точку соединений трубчатых полуколец, является осью симметрии кольца, коаксиальный разъем установлен так, что центральный проводник его совпадает с осью симметрии кольца, в одном из трубчатых полуколец проложен внутренний проводник, одним концом соединенный с центральным проводником коаксиального разъема, а вторым - с началом второго трубчатого полукольца в зазоре.

Широкополосный объёмный полосково-щелевой переход

Полезная модель относится к радиотехнике, в частности, к щелевым переходам. Широкополосный объемный полосково-щелевой переход содержит диэлектрическую подложку, расположенную на одной стороне подложки заземляющую пластину, в которой выполнена щелевая линия. На другой стороне подложки расположена полосковая линия, скрещивающаяся со щелевой. Переход снабжен второй диэлектрической подложкой, заземляющая пластина расположена между двумя подложками, а на другой стороне второй подложки дополнительно расположена полосковая линия, причем полосковые линии на обеих подложках выполнены П-образной формы, расположены параллельно друг над другом, скрещиваются с щелевой линией в двух местах и заканчиваются холостым ходом на расстоянии четверти длины волны от пересечения с щелевой линией. Технический результат - расширение полосы пропускания. 2 ил.

СИММЕТРИРУЮЩЕЕ УСТРОЙСТВО

Изобретение относится к области радиоэлектроники, а именно к устройствам СВЧ. Устройство содержит отрезок связанных линий передачи, один из концов которых соединен с общим корпусом, указанный отрезок связанных линий передачи выполнен из четвертьволновых линий разной ширины с подключенными параллельно к входному зажиму и выходному зажиму, гальванически связанных с входным зажимом, дополнительных короткозамкнутых четвертьволновых шлейфов. При этом симметрирующее устройство обеспечивает полную идентичность передачи сигнала на выходы с разностью фаз 180 градусов между ними. Технический результат - обеспечение идентичности рабочих характеристик, улучшение полосовых свойств. 12 ил.

СИММЕТРИРУЮЩЕЕ УСТРОЙСТВО

Симметрирующее устройство, содержащее отрезки коаксиальной и симметричной двухпроводной линий различной электрической длины, а также четвертьволновый разомкнутый коаксиальный шлейф, отличающийся тем, что коаксиальный шлейф и отрезок коаксиальной линии расположены параллельно друг другу, при этом начало внешнего проводника коаксиального шлейфа и конец внешнего проводника отрезка коаксиальной линии соединены между собой непосредственно, начало внутреннего проводника коаксиального шлейфа и конец внутреннего проводника отрезка коаксиальной линии соединены с соответствующими выводами начала симметричной двухпроводной линии, волновое сопротивление которой равно волновому сопротивлению шлейфа и отрезка коаксиальной линии.

СИММЕТРИРУЮЩИЙ ТРАНСФОРМАТОР С ЖИДКОСТНЫМ ОХЛАЖДЕНИЕМ

Настоящая техника представляет собой симметрирующий трансформатор с жидкостным охлаждением, включая подложку с лицевой и противоположной обратной стороной, основной и второстепенный проводящие элементы, расположенные на лицевой и обратной стороне подложки соответственно, первичный и вторичный сигнальные порты, электрически соединенные с основным и второстепенным проводящими элементами соответственно, а также модуль охлаждения. Второстепенный проводящий элемент находится в преобразовательном соединении с основным проводящим элементом и электрически изолирован от него. Модуль охлаждения включает основной трубчатый элемент. Основной трубчатый элемент имеет впускное отверстие для подачи охлаждающей жидкости в основной трубчатый элемент, проточную часть для проведения потока охлаждающей жидкости внутри основного трубчатого элемента и выпускное отверстие для выведения охлаждающей жидкости из основного трубчатого элемента. Проточная часть основного трубчатого элемента находится в термическом контакте ...

Кольцевое широкополосное симметрирующе-согласующее устройство

Кольцевое широкополосное симметрирующе-согласующее устройство, содержащее два симметричных трубчатых полукольца, образующих кольцо с зазором, коаксиальный вход, закрепленный на трубчатом кольце диаметрально противоположно зазору, внутри первого полукольца проложен центральный проводник, образующий коаксиальную линию с этим полукольцом, при этом один конец центрального проводника соединен с центральным проводником коаксиального входа, а другой конец выведен в зазор кольца, отличающееся тем, что диаметр трубчатого кольца с зазором равен Dк=λ0/2π, где λ0 - центральная длина волны в свободном пространстве, а часть коаксиальной линии первого, полукольца, начиная от зазора, выполнена в виде четвертьволнового согласующего трансформатора, во втором полукольце проложен центральный проводник, образующий разомкнутый шлейф, один конец центрального проводника разомкнутого шлейфа в зазоре кольца соединен с выходом центрального проводника четвертьволнового согласующего трансформатора, при этом диаметр ...

СИММЕТРИРУЮЩЕЕ УСТРОЙСТВО, УСТРОЙСТВО РАДИОСВЯЗИ И СПОСОБ КОНСТРУИРОВАНИЯ АНТЕННОЙ СИСТЕМЫ

... 1. Симметрирующее устройство, подсоединяемое между симметричной и несимметричной схемами, обеспечивают передачу и прием общей и разностной мод, отличающееся тем, что содержит первый проводник заданной длины, второй проводник заданной длины, равной длине первого проводника, располагаемый параллельно первому проводнику и отделенный от первого проводника первым расстоянием, причем первый и второй проводники служат для формирования первой линии передачи, имеющей первое полное сопротивление для передач разностной моды, а также для образования второго полного сопротивления для передач общей моды. 2. Симметрирующее устройство по п. 1, отличающееся тем, что используют плоские металлические полоски в качестве первого и второго проводников. 3. Симметрирующее устройство п. 2, отличающееся тем, что используют гибкий пластичный материал для отделения первого проводника от второго. 4. Симметрирующее устройство по п. 1, отличающееся тем, что первый и второй проводники дополнительно содержат трансформатор ...

Высокочастотное симметрирующее устройство

Изобретение относится к высокочастотной технике Цель изобретения - повышение надежности и стабилизации электрических параметров высокочастотного симметрирующего устройства. Устройство содержит корректирующие емкости, каркасы с наружными и внутренними обмотками 3, 4, каждый из которых выполнен цилиндрическим, а обмотки 3, 4 зафиксированы рейками 6 и 7. Рейки 6 и 7 армированы изоляционными ребрами 12, выполненными из более жесткого материала,чем рейки,которые стянуты с внешней стороны хомутами, выполненными из материала, однотипного материалу ребер Внутренняя обмотка 7 намотана на ребристом изоляционном каркасе и вставлена в каркасе с натягом. Это обеспечивает жесткость закрепления обмоток и стабильность электрических параметров 1 з п ф- лы 5 ил 4 - А (Л С ...

Симметрирующее устройство

Симметрирующее устройство

Использование: преобразование СВЧ- колебаний несимметричной линии передачи в СВЧ-колебания симметричной линии передачи. Сущность изобретения: устройство содержит первый плоский проводник в виде петли, расположенный на диэлектрической пластине. Концы этой петли подключены к проводникам симметричной линии передачи, а середина подключена к экрану несимметричной линии передачи и к прово- дящей пластине, которая расположена внутри петли. Второй плоский проводник расположен на другой стороне диэлектрической пластины и подключен одним концом к центральному проводнику несимметричной линии передачи, а другим - к дополнительной проводящей пластине, расположенной на той же стороне диэлектрической пластины . По обе стороны диэлектрической пластины установлены два ферритовых идентичных кольца, ось симметрии которых совмещена с осью симметрии проводящей пластины и первого плоского проводника. 1 ил. / со С ...

Симметрирующий трансформатор

Широкополосное симметрирующее устройство

Устройство связи активных элементовС НАгРузКОй

Съемник СВЧ-энергии

Устройство для кондуктивной связи

Переходное устройство от симметричных к несимметричным линиям

180-Grad Phasenschieber

KREISSCHLITZ-ARRAYANTENNE MIT ABGLEICHTEIL

A circular slot array antenna comprises a circular radiation plate 1, having a plurality of slots, a circular base plate 2, and an annular side plate disposed between the outer peripheral portions of the circular radiation plate and the base plate. A matching member 5 having a flange 5b is secured to the base plate at a central portion thereof. A power feeder 3a, 3b is inserted into a hole of the matching member. The matching member is secured to the base plate 2 by fastening means 9a, 9b, 10 which do not project into the waveguide space between the plates. ...

Schaltung zum Übergang von Unsymmetrie auf Symmetrie als Eingangschaltung eines Mischers

Anordnung zur Ankopplung einer Antenne

Transformatoren, insbesondere mit symmetrischer/unsymmetrischer Kopplung.

Transformationsglied fuer Fernseh- und UKW-Betrieb mit symmetrischen Leitungen

BREITBANDIGER SYMMETRIERÜBERTRAGER

BREITBANDIGER 180 GRAD-PHASENSCHIEBER

Dielektrisches Filter, dielektrischer Duplexer und Kommunikationsgerät

HOCHFREQUENZ-SYMMETRIEREINRICHTUNG IN EINEM MEHRSCHICHTSUBSTRAT

Integrierter Filterbalun

Eine Komponente, die eine erste Struktur umfaßt, die mit einer zweiten Struktur integriert ist. Die erste Struktur ist eine konzentrierte Symmetrisch-zu-Unsymmetrisch-Schaltung (Balun), wobei die zweite Struktur ein resonatorbasiertes Filter ist. Die Funktion des Baluns besteht darin, ein Signal von einer Differenzform zu einer Eintaktform oder von einer Eintaktform zu einer Differenzform zu überführen. Die Komponente weist einen Bereich auf, der mit dem Bereich vergleichbar ist, der erforderlich ist, um den Balun allein zu implementieren. Die Komponente liefert nun jedoch eine Filterfunktion. Vorzugsweise agiert das Substrat der ersten Struktur auch als ein Substrat für die zweite Struktur.

Laminated balun transformer

Antenna balun

High frequency coupling device

... 609,559. Transformers. STANDARD TELEPHONES & CABLES, Ltd. March 15, 1946, No. 8188. Convention date, April 17, 1945. [Class 38 (ii)] [Also in Group XL (c)] A high-frequency transformer for coupling a balanced and an unbalanced circuit comprises a wire loop 1, connected, for example, to anodes 2, 3 of two push-pull connected power output tubes, and inductively coupled to a second wire loop 4 which is earthed at one end 13 by connection to an earthed metal plate 5 and is surrounded by two cylindrical shields 6, 7, each connected at one end to plate 5, and connected at points 21, 22 by a variable condenser 20. The positions of points 21, 22 and the valve of the condenser are adjusted to give maximum power output from the transformer. Insulating spacers 8, 11, 15 are respectively provided to separate the ends of screens 6, 7 and to space the conductor 4 from the screens 6, 7 and the plate 5. The output end 16 of conductor 4 may be surrounded by an earthed coaxial screen 17.

Improvements relating to electrical coupling arrangements

... 673,658. Aerial coupling arrangements. ELECTRIC & MUSICAL INDUSTRIES, Ltd. March 9, 1950 [March 9, 1940], No. 6365/49. Class 40 (v). In an electrical circuit arrangement including a feeder comprising an unscreened pair of parallel conductors connected at one end to a balanced device and at its other end to an unbalanced device, the conductors of the feeder are coiled together adjacent their point of connection with the unbalanced device in such a manner that balanced potentials at the balanced device are converted into unbalanced potentials at said point or unbalanced potentials at said point are converted into balanced potentials at the end of the coiled feeder remote from said point. As shown, a balanced device 1 which may be a dipole aerial is coupled to an unbalanced device 2, for example a radio receiver, via conductors 3 and 4, the ends adjacent device 2 being coiled together to provide a pair of coupled inductances, and optimum energy transfer is obtained if the electrical length ...

CIRCULAR SLOT ARRAY ANTENNA WITH A MATCHING MEMBER

PURPOSE:To stably attach a matching part in an antenna by attaching the circular matching part concentrically with a feeding part on the bottom plate of the antenna. CONSTITUTION:A feeding aperture 2a is drilled at the center part of a bottom plate 2 of the circular slot antenna, and a circular lambda/4 type matching part 5 having a flange part 5b provided in a wave guide space S of the circular slot antenna concentrically with the said aperture 2a is provided. In the lambda/4 type matching part 5, a male screw part 5c is projectingly provided from the center part of the flange part 5b through the aperture 2a to the outside, and a nut fastener 10 which screws the male screw part 5c and sandwiches the lambda/4 type matching part 5 to the bottom plate 2 is provided. In such a case, reflection from the feeding part is suppressed by the one-stage type circular lambda/4 type matching part 5. Thus the matching part can be stabilized.

Microwave mixer/modulator

A planar microwave double- balanced ring mixer or modulator comprises two slot line/microstrip series-T junctions (32A, 32B) each having three arms such that energy fed into the junction on a first arm (42A, 42B) produces antiphase signals in the second and third arms. The second and third arms of each junction (32A, 32B) are connected by paths of equal electrical length (142A, 152A: 142B, 152B) to a respective pair of opposed terminals (53, 55; 54, 56) of a diode quad (65). The first arms of the two junctions (32A, 32B) constitute first and second ports of the mixer, and coupling means (63A, 64A; 63B, 64B) to two points electrically mid-way between the second and third arms of a respective one of the two junctions (32A, 32B) constitute a third port. Such a circuit is operable over a broad bandwidth with good isolation between ports. ...

A Hybrid coupler

A hybrid coupler (20) for dividing an input electrical signal to produce first and second output electrical signals which are substantially out of phase, including: an input port (12); an input line (14) for coupling an input signal to a slotline (18); an output line (24) coupling the first and second output electrical signals to a first output port (26) and a second output port (28), the output line (24) having a junction with the slotline (18); the slotline (18) couples the input electrical signal to the junction, and the junction acts as a divider to produce the first and second electrical signals; the slotline (18) is terminated by an output open circuit termination (22); a pair of ground planes, between which said input and output lines (14, 24) are located; and wherein: on one of the ground planes, the slotline (18) transitions into a first end of a Co-Planar Waveguide CPW (40), said CPW being electrically connected to said output line (24) and defining at a second, opposing end thereof ...

BALUN CIRCUITS

Improvements in or relating to wireless aerial systems

... 475,348. Wireless signalling; aerials. CORK, E. C., and PAWSEY, J. L. March 17, 1936, No. 8037. [Class 40 (v)] Relates to means for coupling the feed-line to a short-wave aerial, suitable for television, so as to reduce the variation of reactance with signal frequency. As shown in Fig. 1, the inner ends of the dipole 1, 2 are tapered at 3, 4. The sheath 5 of the coaxial feed-line is connected to the limb 1, whilst an auxiliary conductor 6, which operates in the manner described in Specification 438,506 is branched off from the feed-line at D and is connected to the lower dipole at G. The arrangement enables the centre conductor 7 of the feed-line to be connected across to the auxiliary conductor 6 by a comparatively-short lead. In an alternative arrangement the ends of the sheath 5 and conductor 6 are chamfered for the same purpose ; this also allows the dipole limbs 62 to be set in strict alignment. Fig. 3 shows another modification in which flat conductors 8, 9 join the feed-line 5, 7 ...

Improvements in and relating to high frequency transmission lines

MICROWAVE TRANSMISSION LINE AND DEVICES USING MULTIPLE COPLANAR CONDUCTORS

... 1455155 Microwave strip-line circuits RCA CORPORATION 7 Dec 1973 [14 Dec 1972] 56791/73 Heading H1W [Also in Division H3] Devices are constructed which utilize the ability of a so-called "co-planar" transmission line to propagate wave energy in both even and odd modes. Such a line consists of a dielectric substrate carrying on one surface a ribbon conductor spaced on either side from two similar, parallel conductors usually of greater width than the central conductor. The even mode is associated with symmetrical electric fields extending from the central conductor to the two outer conductors, and the odd mode with an electric field extending between the outer conductors and asymmetric about the centre of the line. These modes will propagate within a chosen frequency band provided the relative widths of the central conductor and its spacing from the outer conductor lie within a certain range (fully discussed in the Specification. In particular, if the characteristic impedances associated ...

SYMMETRIEREINRICHTUNG FOR THE DIRECT CONNECTION OF A SYMMETRICAL ANTENNA TO A COAXIAL CABLE

SYMMETRY TRANSDUCER AND TRANSCEIVER

ARRANGEMENT FOR SEPARATION SENDEUND OF RECEIVED SIGNALS

LAMINATED SYMMETRY TRANSDUCER

SYMMETRIEREINRICHTUNG FOR THE DIRECT CONNECTION OF A SYMMETRICAL ANTENNA TO A COAXIAL CABLE

WAVEGUIDE FILTER WITH FREQUENCY-SELECTIVE SURFACE

PASSIVE SIGNAL PROCESSING COMPONENTS ON LIQUID CRYSTAL POLYMER AND MULTI-LAYER POLYMER BASIS FOR HF-/DRAHTLOS-MULTIPLE REEL-APPLICATIONS

NET CONVERTER, HIGH FREQUENCY MODULE AND COMMUNICATIONS EQUIPMENT

CABLE CONNECTION MECHANISM FUER SYMMETRICAL ANTENNA.

RADIO FREQUENCY TRANSFORMER AND ITS USE

TRANSITION OF A WAVEGUIDE TO A STRIP LINE

Miniature active conversion between slotline and coplanar waveguide

MICROWAVE MIXER

The mixer comprises two parallel conductors placed on each side of a substrate, one or a number of diodes mounted in series between the first ends of the two conductors, an incident-wave input connected between the second conductor-end located on the second face of the substrate and a ground line located on the first face, a mixing-wave input connected to means for applying between the ends of each diode an electric field produced by the mixing wave, and a mixed-wave output connected between at least one end of a diode and the ground line. The end of the conductor of the two-wire line is left free and electrically isolated from the ground line by means of a gap.

SLOT TRANSMISSION LINE COUPLING TECHNIQUE USING A CAPACITOR

A SLOT TRANSMISSION LINE COUPLING TECHNIQUE USING A CAPACITOR Josef L. Fikart A novel technique for coupling microwave signals to a slot transmission line and for effecting a simultaneous impedance transformation. One lead of a microwave capacitor, connects to a source of microwave signals (such as a microstrip transmission line). The other capacitor lead, located in the same plane as the slot line, crosses the slot line at a right angle and connects to the gound plane on the other side of the slot. A short-circuited segment of the slot line extends beyond the point of crossing where N is an odd integer.

BALUN

The present invention relates to a balun circuit that includes means for transforming a balanced input signal to an unbalanced signal and impedance changing means. The means for transforming the balun input signal to an unbalanced output signal is a .lambda./2-waveguide (30). A first side of the .lambda./2-waveguide (30) is connected to a second port (P2) of the balun circuit, while a second side of said .lambda./2-waveguide (30) is connected to a third port (P3) of the balun circuit. The impedance changing means is a .lambda./4-waveguide (40) of which a first side is connected to a second side of the .lambda./2-waveguide (30) and a second side is connected to the first port (P1) of the balun circuit.

MICROWAVE MIXER

A FLUID-COOLED BALUN TRANSFORMER

... ?The present technique presents a fluid-cooled balun transformer including a substrate plate with a first and an opposite second face, a first and a second conductive element arranged on the first and the second face respectively, a first and a second signal port electrically connected to the first and the second conductive element respectively, and a cooling module. The second conductive element is transformingly coupled to the first conductive element and electrically isolated therefrom. The cooling module includes a first tubular member. The first tubular member has a fluid inlet to receive a coolant fluid into the first tubular member, a flow channel to conduct a flow of coolant fluid within the first tubular member and a fluid outlet to release the coolant fluid from the first tubular member. The flow channel of the first tubular member is arranged in thermal contact with the first conductive element.

PRINTED CIRCUIT TRANSFORMER

Circuits such as balanced diode mixers require balanced transformers. For ultrahigh frequency operation, a balanced transformer is formed as part of a printed circuit on a planar substrate of insulating material. The balanced transformer has a center-tapped winding formed by a loop of a strip transmission line having first and second coextensive elongated conductors disposed on the substrate. Preferably the first and second conductors are disposed adjacent each other on respective opposite sides of the substrate. At a first end portion of the strip transmission line, the second conductor is connected to a center tap, and at a second end portion of the strip transmission line, the first conductor is also connected to the center tap. For a balun transformer, the center tap is a ground plane provided by conductive regions disposed on the substrate. Preferably an unbalanced signal is fed into the transformer at a second winding including at least a third elongated conductor disposed on the ...

HIGH FREQUENCY, WIDE BAND, TRIPLE BALANCED MIXER

A triple balanced mixer includes two miniature diode quad rings (12, 14) positioned on opposite faces of a duroid sheet (16) which is integral with a duroid layer (18) of one of three pairs of parallel baluns (28, 30, 32). An LO balun pair (30) is connected directly to the ring terminals (80, 82, 84, 86) while ribbon connectors (34, 36) are used to interconnect the other balun pairs (28, 32) to the ring terminals (80, 82, 84, 86, 88, 90, 92, 94). The baluns (28, 30, 32) are orthogonally disposed and have a particular curved shape in order to accomodate the miniature rings (12, 14). The rings (12, 14) are suspended from the baluns (28, 30, 32) and positioned within a cavity (38) of a housing (20) which is provided with electromagnetic energy absorbent material and which is selectively dimensioned to minimize signal loss from the pairs of baluns (28, 30, 32), balun connectors (34, 36) and rings (12, 14).

BALUN TRANSFORMERS

A balun is formed by printed tracks (20, 22) on a printed circuit board (not shown) . A first conductor to one side of the board extends between ground (16) and single ended signal port 11. A second conductor to the other side of the board extends between ground 21 and a balanced signal port (12) in electrical symmetry. The arrangement provides a construction wherein the balanced side of the balun is entirely on one side of the board, resulting in symmetrical parasitic effects in the balanced limbs. Also cross board connections are not required. The balun allows a printed circuit form to be used where parasitic effects are likely, such as high frequency power amplifiers with their associated large heat sink, replacing other forms, such as coaxial cable types.

PLANAR DIELECTRIC INTEGRATED CIRCUIT

A planar dielectric integrated circuit is provided such that energy conversion loss between a planar dielectric line and electronic components is small and that impedance matching between them can be easily obtained. By providing slots which oppose both main surfaces of a circuit substrate, two planar dielectric lines are constructed. A slot line and a first line-conversion conductor pattern which is connected to the electromagnetic field of the slot line and a first planar dielectric line in order to perform line conversion are provided at the end portion of the first planar dielectric line, including a slot. A coplanar line such that a second line- conversion conductor pattern is made to project in a direction at right angles to a second planar dielectric line is provided at the end portion of the second planar dielectric line, including a slot. A semiconductor device is placed in such a manner as to be extended over the coplanar line and the slot line.

BIPHASE MODULATOR WITH BALUN DESIGN

A double-balanced microwave biphase modulator circuit is provided with a first balun (9) for transforming the unbalanced RF input impedance to a balanced biode impedance and providing direct current ground return paths, and a second balun (11) for transforming the balanced diode impedance to the unbalanced RF output impedance and providing access for data input (12). The first balun (9) consists of a transmission line (1) attached from a coupled pair of transmission lines (2A, 2B) to ground. The second balun (11) consists of three pairs of coupled transmission lines (4A, 4B, 5A, 5B, 6A, 6B), in which the first two pairs of transmission lines (4A, 4B, 5A, 5B) are attached to a diode ring (10), to a data input filter (7), to a circuit ground, and to the third pair of transmission lines (6A, 6B).

Anordnung zum Zusammenschluss einer erdunsymmetrischen koaxialen Hochfrequenzenergieleitung mit einer erdsymmetrischen Hochfrequenzenergieleitung für Meter- und Dezimeterwellen.

Anordnung zum Übergang einer erdunsymmetrischen Hochfrequenzanordnung in eine erdsymmetrische Anordnung.

Einrichtung zur Kopplung und Anpassung einer Magnetronröhre an ein Kabel.

Einrichtung zur veränderbaren Kopplung eines erdsymmetrischen Schwingungskreises mit einer konzentrischen Leitung.

Einrichtung zur Kopplung einer nicht-erdsymmetrischen Übertragunsleitung mit einem erdsymmetrischen Übertragungssystem.

Vorrichtung mit zwei in Gegentaktschaltung verbundenen Übertragungsleitungen und einer einfachen Übertragungsleitung, die miteinander gekoppelt sind.

Auskopplungstransformator für Magnetronsender.

Transformator zur Verbindung einer symmetrischen Leitung mit einer unsymmetrischen Leitung

Unsymmetrisch gespeister Dipol

Anpassungs-Übertrager für hochfrequente elektromagnetische Wellen, eingeschaltet zwischen einer erdsymmetrischen und erdunsymmetrischen Leitung

Hochfrequenzübertrager

BALANCING DEVICE WIDELY STRIP ANTENNA

METHOD FOR PRODUCING A COUPLER WITH CIRCULAR POLARIZATION BASED ON A METAL-DIELECTRIC STRIP-LINE WAVEGUIDE

Oil-resistant multi-layer balun

Balun and power amplifier impedance matching circuit

The invention discloses a balun and a power amplifier impedance matching circuit. The balun is composed of three layers of dielectric layers and two layers of strip line conduction bands; the upper-layer conduction band is of a U-shaped structure, and the lower-layer conduction band is of a helical line structure; the upper-layer conduction band is strongly coupled through radio frequency; the signal of the lower-layer conduction band is coupled to the upper-layer conduction band and conveyed to two output ports of the upper-layer conduction band averagely, so that impedances of the two end ports of the upper-layer conduction band can be changed randomly according to the impedance of a power amplifier end port connected with the two end ports, and thus, wide-range impedance matching is realized, and requirements of power amplifier matching are met; when the balun is applied to the power amplifier impedance matching circuit, the matching circuit can be well matched to the impedance of the ...

Balun structure and preparation method thereof

The invention provides a balun structure and a preparation method thereof.The balun structure comprises a base body, a first inductance coil and a second inductance coil, the base body comprises a dielectric diaphragm and a magnetic core unit, the magnetic core unit comprises two magnetic core layers and three magnetic core columns arranged at intervals, the two magnetic core layers are arranged on the two opposite sides of the dielectric diaphragm in a stacked mode respectively, and the first inductance coil and the second inductance coil are arranged between the two magnetic core layers. Each magnetic core column penetrates through the dielectric diaphragm to connect the two magnetic core layers; the first inductance coil is located between the two magnetic core layers and spirally wound among the three magnetic core columns. The second inductance coil is located between the two magnetic core layers and spirally wound among the three magnetic core columns, and the second inductance coil ...

ALL-PASS DEVICE CARRIED out IN CORRESPONDENCE WITH the TECHNIQUE Of INTEGRATION IN the FIELD OF the MICROWAVES

Improvements with the feeders and devices similar for electric currents àhaute frequency

Planar coupler for waveguide and HF line - is oriented at right angles to waveguide end and has two conductive layers on either side of dielectric

Improvements with the devices of connection of a dissymmetrical resistance of use compared to the ground with a symmetrical source of tension compared to the ground, or conversely

Device of connection between an antenna and a case of micro-electronics

Improvements with the devices of symmetrization particularly intended for the field of the decimetre waves

Improvements in and relating to ultra-high frequency couplings

Variable device of coupling of a symmetrical oscillatory circuit with a coaxial line

Symetrisor, in particular for antennas

WAVEGUIDE TO MICROSTRIP COUPLER

WAVEGUIDE?STRIPLINE TRANSDUCER

Device of high frequency coupling

Repeater for high frequency electromagnetic waves for reciprocal adaptation of symmetrical or asymmetrical drivers compared to the ground

CHANGE WHEEL IMPROVED SYMMETRIC AND ASYMMETRIC.

MICROWAVE FREQUENCY CONVERTER WITH WAVEGUIDE

CROSSOVER NETWORK, IN PARTICULAR FOR RADIO

COMBINING CIRCUIT Of ENERGY IN ULTRA HIGH FREQUENCIES OF CONICAL CONFIGURATION

Device of connection between an antenna and a case of micro-electronics

Le dispositif électronique comprend un boîtier d'antenne (1), muni d'un circuit (2) sur lequel est gravé une antenne et d'un circuit balun (3) pour l'alimentation de cette antenne, lui-même relié à un boîtier microélectronique muni d'une connexion étanche constituée par une perle de verre (7) scellée, traversée par au moins un fil conducteur (8). Le circuit balun comprenant au moins deux pistes différentes, de part et d'autre d'un substrat diélectrique, il est prévu au moins un contact électrique immédiat entre le fil conducteur du boîtier (8) et l'une des pistes du circuit balun, en même temps qu'une fixation mécanique directe entre le boîtier d'antenne et le boîtier microélectronique, accompagnée d'une autre liaison du même genre ou d'un conducteur (6) de report de masse, qui est d'une part relié à l'autre piste du balun, d'autre part en contact avec le boîtier microélectronique.

ALL-PASS DEVICE CARRIED out IN CORRESPONDENCE WITH the TECHNIQUE Of INTEGRATION IN the FIELD OF the MICROWAVES

BALUN DISTRIBUTES HAS NONUNIT REPORT/RATIO Of IMPEDANCE

L'invention concerne un transformateur à changement de mode comprenant une première ligne conductrice constituée de deux enroulements primaires (5, 6) électriquement en série et dont la longueur est fonction d'une fréquence centrale de fonctionnement du transformateur ; et une deuxième ligne conductrice constituée de deux enroulements secondaires (7, 8) électriquement en série, couplés deux à deux avec les enroulements primaires et dont la longueur est fonction de ladite fréquence centrale. Les lignes conductrices présentent des largeurs différentes choisies en fonction du rapport d'impédance souhaité pour le transformateur.

Microwave circuits constructed inside a waveguide

Assembly of elements of electrical circuits

CIRCUIT OF TRANSITION LINE MICRORUBAN/LIGNE SLIT

L'invention concerne un circuit de transition d'une ligne microruban vers une ligne fente. Selon l'invention, la ligne fente (2) du circuit de transition est équipée d'un filtre (SBFs) pour ramener sur la ligne fente, au niveau de la zone de croisement de la ligne microruban (1) et de la ligne fente (2), une impédance sensiblement égale à l'impédance d'un circuit ouvert pour au moins une fréquence désirée du signal et une impédance sensiblement égale à l'impédance d'un court circuit pour au moins une fréquence indésirable du signal. Avantageusement, la ligne microruban est également équipée d'un filtre (SBFm) pour ramener sur la ligne microruban, au niveau de la zone de croisement, une impédance sensiblement égale à l'impédance d'un court circuit pour la fréquence désirée et une impédance sensiblement égale à l'impédance de circuit ouvert pour la fréquence indésirable.

Device of coupling, in decametric waves, between two dissymmetrical lines and a line symétriqueet station of emission comprising at least such a device

L'invention concerne un dispositif de couplage qui permet de coupler, au choix, une ou deux lignes dissymétriques à une même ligne symétrique afin, généralement, de relier, au choix, un ou deux émetteurs à une même antenne. Le dispositif utilise des symétriseurs (S1, S2) et des commutateurs (K1, K2) montés de telle sorte que le couplage simultané des deux lignes dissymétriques (1-L2, 2) à la même ligne symétrique (3), se fasse par la mise en série électrique des deux lignes dissymétriques à l'une des extrémités d'un symétriseur (S2) dont l'autre extrémité est reliée à la ligne symétrique (3). Application, en particulier, à la radioémission en ondes décamétriques.

Method and System for Configurable Differential or Single-Ended Signaling in an Integrated Circuit

Aspects of a method and system for configurable differential or single-ended signaling in an integrated circuit. In this regard, a balun comprising one or more loops fabricated in a plurality of metal layers in an integrated circuit may enable conversion between unbalanced and balanced signals. In this regard, balanced signal output by a power amplifier may be converted to a balanced signal for transmission via an antenna. Similarly, an unbalanced signal received by an antenna may be converted to a balanced signal for amplification by an amplifier with a balanced input. The loops may be fabricated in transmission line media such as microstrip and/or stripline. The loops may comprise ferromagnetic material which may be deposited on and/or within the IC. Signals converted via the balun may be in the 61 GHz-61.5 GHz ISM band.

Figure 8 balun

A balun includes a first set of wound conductors includes a first loop portion and a second loop portion. The first loop portion and the second loop portion are conductively coupled and form a first figure eight structure. The balun further includes a second set of wound conductors includes a third loop portion and a fourth loop portion. The third loop portion and the fourth loop portion are conductively coupled and form a second figure eight structure. The first loop portion and the third loop portion are inductively coupled. The second loop portion and the fourth loop portion are inductively coupled.

Phase shifter using substrate integrated waveguide

Provided is a phase shifter using a substrate integrated waveguide (SIW). The phase shifter includes: a substrate; and a waveguide integrated on the substrate, wherein the waveguide includes an input port, an out port, two columns of via walls which are separated by a width of the waveguide and are arranged parallel to each other, and either a plurality of air holes which are formed to shift a phase of a signal between the input port and the output port or a plurality of rods, each including an air hole and a dielectric material inserted into the air hole.

Waveguide/planar line transducer

A waveguide/planar line transducer of the present invention includes a waveguide that transmits electromagnetic waves through an opening portion, and a multiplayer substrate that includes a plurality of conductive layers. The multilayer substrate includes: a first conductive layer that is in close contact with the opening portion of the waveguide, and includes a first coupling hole provided at a position overlapping the opening portion of the waveguide when viewed in a plate thickness direction of the multilayer substrate; a strip electrode that is electromagnetically coupled to the first conductive layer, arranged on an opposite side to the first conductive layer in the plate thickness direction, and extending in one of a planar direction of the multilayer substrate; and a second conductive layer that is arranged between the first conductive layer and the strip conductor in the plate thickness direction, and includes a second coupling hole having a protuberance facing at least one of directions in which the strip electrode extends.

BALANCED-UNBALANCED TRANSFORMER

A balanced-unbalanced transformer includes: a balanced transmission line including paired transmission lines; an unbalanced transmission line; and two lead transmission lines connected to two neighboring end portions of four end portions of the paired transmission lines at a right angle to the paired transmission lines, wherein one of the two lead transmission lines has a first electrode face which faces the other of the two lead transmission lines, the other of the two lead transmission lines has a second electrode face which faces the one of the two lead transmission lines, and the first electrode face and the second electrode face are electrode faces of a capacitor. 1. A balanced-unbalanced transformer comprising:a balanced transmission line including paired transmission lines for input or output of a balanced signal, the paired transmission lines being disposed adjacently and aligned in a longitudinal direction;an unbalanced transmission line for input or output of an unbalanced signal, the unbalanced transmission line being in parallel with the balanced transmission line and facing the balanced transmission line; andtwo lead transmission lines one of which is connected to one end portion of one of the paired transmission lines at a right angle to the one of the paired transmission lines, and the other of which is connected to one end portion of the other of the paired transmission lines at a right angle to the other of the paired transmission lines, the one end portion of the one of the paired transmission lines and the one end portion of the other of the paired transmission lines being neighboring two end portions of four end portions of the paired transmission lines,wherein the one of the two lead transmission lines has a first electrode face which faces the other of the two lead transmission lines,the other of the two lead transmission lines has a second electrode face which faces the one of the two lead transmission lines, andthe first electrode face and ...

Wideband, differential signal balun for rejecting common mode electromagnetic fields

Provided are assemblies and processes for efficiently coupling wideband differential signals between balanced and unbalanced circuits. The assemblies include a broadband balun having an unbalanced transmission line portion, a balanced transmission line portion, and a transition region disposed between the unbalanced and balanced transmission line portions. The unbalanced transmission line portion includes at least one ground and a pair of conductive signal traces, each isolated from ground. The balanced portion does not include an analog ground. The transition region effectively terminates the analog ground, while also smoothly transitioning or otherwise shaping transverse electric field distributions between the balanced and unbalanced portions. Beneficially, the balun is free from resonant features that would otherwise limit operating bandwidth, allowing it to operate over a wide bandwidth of 10:1 or greater. Assemblies can include RF chokes with back-to-back baluns, and other elements, such as balanced filters, and also can be implemented as integrated circuits.

Wideband multilayer transmission line transformer

Embodiments of the invention include transmission line transformers. According to one aspect, a multilayer transmission line transformer (TLT) includes a first set of two conductors forming a first clockwise spiral. The TLT includes a second set of two conductors forming a second counterclockwise spiral that is substantially coaxial with the first spiral. The first and second spirals are arranged to cause a substantial cancellation of common mode currents in the first and second sets of conductors during operation of the TLT

Interchip communication using an embedded dielectric waveguide

An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.

PLANAR BALUN TRANSFORMER DEVICE

An electric transformer device (balun) is formed on a support plate having a first base face and an opposite second base face. The balun includes a first port () connectable to an electrical line for a differential signal and a second port connectable to an electrical line for a single-ended signal. A first printed conductive track is associated to the first base face of the support plate for connecting the first port to the second port. A printed conductive path is associated to the second base face of the support plate for connecting the first port to the second port. The printed conductive path is formed of a symmetric second and third printed conductive tracks. 1. An electric transformer device configured to adapt an electrical line for differential signal to an electrical line for single-ended signal , comprising:a support plate having a first base face and an opposite second base face;a first port connectable to the electrical line for differential signal;a second port connectable to the electrical line for single-ended signal;a first printed conductive track associated to said first base face of the support plate for connecting said first port to said second port; anda printed conductive path associated to said second base face of the support plate for connecting said first port to said second port.2. The electric transformer device according to claim 1 , wherein said printed conductive path comprises a second and a third conductive track claim 1 , each of which is configured to connect said first port to said second port.3. The electric transformer device according to claim 2 , wherein said first claim 2 , second and third conductive tracks are metal tracks made of copper.4. The electric transformer device according to claim 3 , wherein said conductive tracks are obtained by means of a selective chemical removal operation of the copper from a copper sheet that is secured on each of said first and second base faces of the support plate.5. The electric ...

THIN FILM BALUN

A thin film balun that can be made smaller and thinner while maintaining required balun characteristics is provided. A thin film balun includes: an unbalanced transmission line UL including a first coil portion C and a second coil portion C; a balanced transmission line BL including a third coil portion C and a fourth coil portion C that are positioned facing and magnetically coupled to the first coil portion C and the second coil portion C respectively; an unbalanced terminal UT connected to the first coil portion C; a ground terminal G connected to the second coil portion C via a C component D; and an electrode D connected to the ground terminal G and facing a part of the second coil portion C. The C component D is formed by the electrode D and the part D of the second coil portion C 1. A thin film balun comprising:an unbalanced circuit;a balanced circuit magnetically coupled to the unbalanced circuit; anda capacitor connected to the unbalanced circuit,wherein a part of a line portion constituting the unbalanced circuit serves as one electrode of the capacitor.2. A thin film balun comprising:an unbalanced transmission line; anda balanced transmission line positioned facing the unbalanced transmission line and magnetically coupled to the unbalanced transmission line,wherein one end of the unbalanced transmission line is connected to an unbalanced terminal, and an other end of the unbalanced transmission line is connected to a ground terminal via a C component, andwherein the C component is formed by an opposite electrode and a part of a line portion constituting the unbalanced transmission line.3. A thin film balun comprising:an unbalanced transmission line including a first line portion and a second line portion;a balanced transmission line including a third line portion and a fourth line portion that are positioned facing the first line portion and the second line portion and magnetically coupled to the first line portion and the second line portion, respectively ...

Signal transmission medium and high frequency signal transmission medium

A signal transmission medium for transmitting EHF band signals from a first point to a second point, including: a first end at which a signal exchange with the first point takes place; a second end at which a signal exchange with the second point takes place; and a transmission line portion which is flexible and connects the first end and the second end. The transmission line portion includes: strip conductors which are formed substantially down a center of a flexible printed circuit board to establish electrical connection between a signal line at the first end and a signal line at the second end; and a pair of grounding sheets which are arranged in parallel to each other at a substantially constant gap from the flexible printed circuit board in 180-degree opposite directions. The cavities are formed between the pair of grounding sheets and the strip conductors.

METHOD FOR MAKING ELECTRICAL STRUCTURE WITH AIR DIELECTRIC AND RELATED ELECTRICAL STRUCTURES

A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric. 117-. (canceled)18. An electrical structure comprising:a first subunit comprising a free-standing electrically conductive circuit surrounded by an air dielectric, said free-standing electrically conductive circuit comprising a first metal;a second subunit comprising a dielectric layer and an electrically conductive layer thereon comprising the first metal; andan intermetallic compound of the first metal and a second metal bonding adjacent metal portions together of said first and second subunits to define an air dielectric core waveguide.19. The electrical structure of wherein the first metal has a melting point temperature greater than that of the second metal; and wherein a melting point temperature of the second metal is below a lamination temperature of the dielectric layer.20. The electrical structure of wherein said dielectric layer comprises liquid crystal polymer (LCP).21. The electrical structure of wherein the first metal comprises copper.22. The electrical structure of further comprising a ...

MICROWAVE APPLICATOR WITH SOLID-STATE GENERATOR POWER SOURCE

A microwave system has a solid-state generator which generates microwave energy and includes at least one control input for receiving a control signal to vary electrically a parameter of the microwave energy. A microwave load receives the microwave energy and produces an effect in response to the microwave energy. A microwave conducting element couples the microwave energy to the microwave load. An impedance match adjusting device is coupled to the microwave conducting element to vary at least one of the parameters of the microwave energy. The effect produced in response to the microwave energy is altered by both electrical variation of the parameter of the microwave energy via the control signal and adjustment of the impedance match adjusting device to vary the parameter of the microwave energy. 1. A microwave plasma system , comprising:a solid-state generator for providing microwave energy characterized by one or more parameters, the solid-state generator having at least one electrical control input for receiving a control signal to vary electrically the one or more parameters of the microwave energy;a plasma applicator for receiving the microwave energy, the plasma applicator comprising a plasma discharge tube in which a plasma is generated in response to the microwave energy, a central longitudinal axis of the plasma discharge tube extending between opposite ends of the plasma discharge tube, the plasma generated in the plasma discharge tube being characterized by a spatial plasma intensity profile distributed longitudinally along the central longitudinal axis and radially from the central longitudinal axis, perpendicular to the central longitudinal axis, toward a radial wall of the plasma discharge tube; anda controller generating the control signal to vary electrically the one or more parameters of the microwave energy, and applying the control signal to the control input of the solid-state generator to vary electrically the one or more parameters of the ...

RIDGE GAP WAVEGUIDE SWITCHES AND RECONFIGURABLE POWER SPLITTERS

Ridge Gap Waveguide (RGW) has emerged as a preferred waveguide technology for millimeter-wave frequencies. Microwave power splitters and switches represent important components for routing microwave signals and/or splitting a microwave signal into equal or unequal portions. To date, solutions have typically employed MEMS phase shifters, MEMS reflective loads, etc. or monolithic microwave integrated circuits to replace traditional electromechanical switches. However, such devices have typically demonstrated at frequencies below 18 GHz and require transitions to/from the RGW. The inventors have established an alternate design, which provides a reconfigurable power splitter and/or microwave switch, which is directly within the same metallic RGW waveguide technology. Such RGW power splitters and switches operating at higher frequencies, such as 26 GHz-40 GHz, for example. 1. A method comprising:providing a variable power splitter.2. The method according to claim 1 , wherein [ an upper structure comprising a periodic structure comprising a plurality of pins disposed on a solid conductor; and', 'a lower structure comprising a periodic structure comprising a plurality of pins disposed on a solid conductor; and, 'providing a first ridge gap waveguide (RGW) comprising, 'a cantilevered sheet disposed between the upper structure of the first RGW and the lower structure of the first RGW; wherein, 'providing the variable power splitter comprisesthe plurality of pins of the upper structure of the first RGW are disposed towards the plurality of pins of the lower structure of the first RGW;the upper structure of the first RGW and the lower structure of the first RGW are disposed a predetermined distance apart; andvariation of gaps between the cantilevered sheet and each of the upper structure of the first RGW and the lower structure of the first RGW results in a variation of splitting microwave power guided within the first RGW to each of a second RGW comprising the upper structure ...

Method and Apparatus for Integrated Shielded Circulator

An RF circulator in combination with a RF integrated circuit, the RF integrated circuit having a plurality of RF waveguide or waveguide-like structures in or on the RF integrated circuit, the RF circulator comprising a disk of ferrite material disposed on a metallic material disposed on or in the RF integrated circuit, the disk of ferrite material extending away from the RF integrated circuit when disposed thereon, the metallic portion having a plurality of apertures therein adjacent the disk of ferrite material which, in use, are in electromagnetic communication with the disk of ferrite material and with the plurality of RF waveguide or waveguide-like structures, the disk of ferrite material being disposed in a metallic cavity.

Planar circuit to waveguide transition

Openings are formed by removing part of a ground conductor, and a differential signal line including signal line conductors is configured with some of the openings. In addition, a metal block is mounted thereon to cover the opening to thus configure a waveguide using the metal block and ground conductor as wall surfaces. A planar circuit to waveguide transition according to the above can achieve traveling wave conversions from a waveguide mode to a slot mode, and from the slot mode to a differential mode without utilizing resonance, which makes it possible to align a dominant direction of an electric field by the three ones; thus, a wider bandwidth can be expected. Thus, the wider bandwidth can be achieved with a simple layer structure.

Coaxial Waveguide Microstructures Having an Active Device and Methods of Formation Thereof

Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure. 120-. (canceled)21. A hermetic package including a coaxial waveguide microstructure , comprising:a multi-layer coaxial waveguide including a center conductor having one or more layers of a conductive material, an outer conductor comprising one or more walls spaced apart from and disposed around the center conductor, the one or more walls having a plurality of layers of the conductive material, and a non-conductive core volume disposed between the center conductor and the outer conductor; anda dielectric cap disposed over an endface of the multi-layer coaxial waveguide to hermetically seal the coaxial waveguide at the endface.22. The hermetic package according to claim 21 , wherein the dielectric cap comprises a membrane extending from the center conductor to the outer conductor23. The hermetic package according to claim 22 , wherein the dielectric membrane covers at least an outer periphery of the center conductor and at least an inner periphery of the outer conductor.24. The hermetic package according to claim 21 , comprising a device mounted on the dielectric cap.25. The hermetic package according to claim 21 , wherein the dielectric cap comprises a photopatternable polymer.26. The hermetic package according to claim 21 ...

Half-patch launcher to provide a signal to a waveguide

An apparatus includes a first conductive patch coupled to a first surface of a dielectric layer, a second conductive patch coupled to a second surface of the dielectric layer, and a probe coupled to the second conductive patch. The apparatus further includes a waveguide having a wall conductively coupled to the first conductive patch. Responsive to a signal provided to the second conductive patch by the probe, interaction of the waveguide, the first conductive patch, and the second conductive patch generates a transmission signal that propagates in the waveguide.

Plug connector for connecting a waveguide to at least one electric conductor

A preferred embodiment of a plug connector for connecting a waveguide to at least one electric conductor may have a housing for connecting to the waveguide. Fastening means may be provided to attach the housing to a structure having the at least one electric conductor. The housing may accommodate a signal converter having an antenna arrangement. A waveguiding arrangement may be provided within the housing. The waveguiding arrangement may guide an electromagnetic wave into the waveguide and may be paired with the antenna arrangement. The signal converter may be connected to at least one electric conductor and may perform conversion between electric signals and high-frequency electromagnetic signals.

ON-CHIP, WIDEBAND, DIFFERENTIALLY FED ANTENNAS WITH INTEGRATED BIAS STRUCTURES

Terahertz (THz) or millimeter wave (mmW) band characterization of a differential-mode device under test (DUT) is performed using a non-contact probing setup based on an integrated circuit that includes the on-chip DUT and an on-chip test fixture as follows. A differential transmission line pair is operatively coupled with the DUT. A first differential antenna pair at a first end of the transmission line pair has a first antenna connected only with the first transmission line and a second antenna connected only with the second transmission line. A second differential antenna pair is likewise connected with a second end of the differential transmission line pair. A THz or mmW transmitter radiates a probe THz or mmW beam to the first differential antenna pair, and an electronic analyzer receives a THz or mmW signal radiated by the second differential antenna pair responsive to the radiation of the probe THz or mmW beam to the first differential antenna pair, thus enabling no-contact S-parameter measurements for characterizing differential-mode, on-wafer, active or passive devices and integrated circuits. 1. An apparatus for performing terahertz (THz) or millimeter wave (mmW) characterization , the apparatus comprising: a differential transmission line pair comprising parallel first and second transmission lines operatively coupled with the DUT;', 'a first differential antenna pair connected with a first end of the differential transmission line pair and including a first antenna connected only with the first transmission line and a second antenna connected only with the second transmission line; and', 'a second differential antenna pair connected with a second end of the differential transmission line pair and including a third antenna connected only with the first transmission line and a fourth antenna connected only with the second transmission line;, 'an integrated circuit including an on-chip device under test (DUT) and an on-chip test fixture includinga THz or mmW ...

IRIS COUPLED COAXIAL TRANSMISSION LINE TO WAVEGUIDE ADAPTER

An adapter for coupling a coaxial transmission line to a waveguide, wherein the center conductor of the coaxial line passes via a back short of the waveguide through an iris and that terminates to the inside wall of the waveguide. 1. An apparatus for coupling a coaxial transmission line to a waveguide comprising:a coaxial section having a center conductor,a waveguide having an inside wall and a shorted end,an iris, andwherein the center conductor of the coaxial section passes through the iris adjacent the shorted end of the waveguide, and terminates to the inside wall of the waveguide.2. The apparatus of wherein the iris is formed as a circular claim 1 , square claim 1 , or irregularly shaped opening in a conductor.3. The apparatus of wherein the iris is fabricated as a separate part and affixed to the coaxial transmission line and waveguide.4. The apparatus of wherein the coaxial section is provided by a launch end of a coaxial connector.5. The apparatus of wherein the waveguide is rectangular in cross section.6. The apparatus of wherein the inside wall of the waveguide is a broadwall.7. The apparatus of wherein the iris is a circular hole formed in a metal sheet.8. The apparatus of wherein one or more of the coaxial section and the waveguide section are formed in a planar substrate.9. The apparatus of wherein the coaxial section comprises a TEM mode transmission line.10. The apparatus of wherein the TEM mode transmission line is either a microstrip or coplanar transmission line. This application claims priority to a co-pending U.S. Provisional Patent Application Ser. No. 63/058,219 filed Jul. 29, 2020 entitled “Coaxial Iris Coupled Waveguide Adapter”, the entire contents of which are hereby incorporated by reference.This application relates to interconnecting a waveguide to a coaxial transmission line.Waveguide to coaxial transitions are commonly used to efficiently convert a TE10 waveguide mode to a coaxial waveguide TEM mode. So called “in line” transitions are ...

Dielectric waveguide input/output structure and dielectric waveguide duplexer including the same

A dielectric waveguide includes a first resonator and a second resonator. On a surface of a printed circuit board, a line, an impedance matching portion, gaps, a first conductor non-formation portion having a crank shape, a second conductor non-formation portion having a crank shape, and a surface ground are formed. A back surface ground is formed on a back surface of the printed circuit board. Furthermore, via holes connecting the surface ground and the back surface ground are formed in the printed circuit board. A first dielectric exposure portion and a second dielectric exposure portion are provided on bottom surfaces of the first resonator and the second resonator, respectively, and a third dielectric exposure portion is provided on a side surface of the dielectric waveguide and near the line. Such a dielectric waveguide is mounted on the printed circuit board.

FILTER CIRCUIT AND FREQUENCY SWITCHING METHOD

The objective of the present invention is to provide a filter circuit by which radio wave interference can be avoided through a simple configuration and a frequency band can be effectively used. In order to achieve the objective, the filter circuit according to the present invention is provided with: a first transmission line and a third transmission line each having a predetermined electrical length; a second transmission line opposed to the first transmission line; an input terminal connected to the first transmission line; a fourth transmission line opposed to the third transmission line; a first output terminal and a second output terminal each connected to the fourth transmission line; a first open end connected to the second transmission line; a second open end connected to the third transmission line; a fifth transmission line connected to the second transmission line; a sixth transmission line opposed to the fifth transmission line; a first switch that connects or opens between the fifth transmission line and the ground; and a second switch that connects or opens between the sixth transmission line and the ground. The electrical length of a transmission line composed of the first open end, the second transmission line, and the fifth transmission line, and the electrical length of a transmission line composed of the second open end, the third transmission line, and the sixth transmission line are each three quarters of a second wavelength corresponding to a second frequency which is higher than a first frequency. 1. A filter circuit comprising:a first transmission line that has an electrical length that is one sixth of a first wavelength corresponding to a first frequency;a second transmission line that has an electrical length that is one sixth of the first wavelength and is disposed to be opposed to the first transmission line separately from each other;an input terminal connected to a first end of two ends in a direction to which current in the first ...

Semiconductor package with plastic waveguide

A semiconductor device including an Integrated Circuit (IC) package and a plastic waveguide. The IC package includes a semiconductor chip; and an embedded antenna formed within a Redistribution Layer (RDL) coupled to the semiconductor chip, wherein the RDL is configured to transport a Radio Frequency (RF) signal between the semiconductor chip and the embedded antenna. The plastic waveguide is attached to the IC package and configured to transport the RF signal between the embedded antenna and outside of the IC package.

Module and Coupling Arrangement

The application concerns a surface mount module adapted for transfer of a microwave signal between the module and a motherboard, the module comprising a substrate with a first microstrip conductor and a second microstrip conductor, wherein the two conductors are connected with a connection through the module. The module is distinguished in that the connection comprises the first microstrip conductor connected to a foil of electrically conducting material coated on the first side, the foil being surrounded by electrically conducting trenches running through the substrate from the first side to the second side forming a substrate integrated waveguide, wherein the trenches on the second side surrounds a second foil of electrically conducting material coated on the second side of the substrate and connected the second microstrip conductor. The application also concerns a coupling arrangement.

WAVEGUIDE

A waveguide includes a dielectric substrate, a first conductor layer and a second conductor layer formed on a lower surface and an upper surface thereof, a pair of side wall parts forming side walls of both sides of the waveguide, and a feed part feeding an input signal to the waveguide. The feed part includes a feed terminal formed on the lower surface of the dielectric substrate and does not contact the first conductor layer, a first via conductor connected at a lower end thereof to the feed terminal, a first connection pad connected to an upper end of the first via conductor, and second via conductors that are each connected at a lower end thereof to the first connection pad. The sum of the cross-sectional areas of the second via conductors is greater than the sum of the cross-sectional area of the first via conductor. 1. A waveguide configured using a dielectric substrate including a plurality of dielectric layers stacked together , characterized in thatthe waveguide comprises:a first conductor layer formed on a lower surface of the dielectric substrate;a second conductor layer formed on an upper surface of the dielectric substrate;a pair of side wall portions which electrically connect the first conductor layer and the second conductor layer to each other and form side walls of the waveguide on opposite sides; anda feed portion for supplying an input signal to the waveguide,wherein the feed portion comprises:a feed terminal formed on the lower surface of the dielectric substrate without contacting the first conductor layer;a single or plurality of first via conductors whose lower ends are connected to the feed terminal;a first connection pad connected to an upper end(s) of the single or plurality of first via conductors; anda plurality of second via conductors whose lower ends are connected to the first connection pad,wherein a sum total of cross-sectional areas of the plurality of second via conductors along the lower surface of the dielectric substrate is ...

APPARATUS FOR USE IN THE RECEIPT AND/OR TRANSMISSION OF DATA SIGNALS

Apparatus is provided which allows for the receipt and/or transmission of data signals, and, for the received signals, for the subsequent separation of the same into at least two sets of data signals which are orthogonal and provide these sets of data signals to subsequent processing components, whilst maintaining the isolation between the first and second data signal sets. For the transmission of the data signals the first and second sets of data signals are initially separate and then combined into one data set to allow the same to be transmitted. 1. Apparatus for the receipt and/or transmission of Radio Frequency data signals , said apparatus including a waveguide to receive and/or transmit said data signals , said waveguide having at least first and second probes depending therefrom , said first probe provided to carry first data signals and said second probe provided to carry second data signals , distinct from the first data signals , means to substantially maintain the isolation between said first and second data signals as the same are passed to and/or from further processing components for the said data signals and wherein said waveguide includes a first end through which received and/or transmitted data signals pass into and/or from the same , and a second end spaced from the first end at , and/or adjacent to , which is provided at least one protrusion which is configured and located with respect to the said first and second probes so as to cause said first data signals to be separated and pass to and/or from the first probe and said second data signals to be separated and pass to and/or from the second probe and wherein both the first and second probes are located on the same side of the waveguide.2. Apparatus according to wherein the first and second data signals are orthogonal.3. Apparatus according to wherein at least one of the sets of first or second data signals pass through an aperture formed in a side of the waveguide.4. (canceled)5. Apparatus ...

High frequency filter

In a high frequency filter, a multilayer structure includes a plurality of insulator layers, a first transmission line transmits an input signal, and a second transmission line is electromagnetic coupled with the first transmission line on the same insulator layer and transmits an output signal. A conductor layer defines capacitors with the first transmission line and the second transmission line with the insulator layer in between. A dielectric constant of the insulator layer that comes in contact with the first transmission line and the second transmission line is higher than a dielectric constant of an insulator layer other than the insulator layer.

Grounded bga wave-guiding interface between an on-package signal launch and an external waveguide

A device comprises a package substrate and a ball grid array (BGA). The package substrate encapsulates an integrated circuit (IC) die and comprises a signal launch configured to emit or receive a signal on a surface of the package substrate. The BGA is affixed to the surface and comprises a set of grounded solder balls arranged as a boundary around the signal launch. The device may further comprise a printed circuit board (PCB) substrate having a waveguide interface side opposite a secondary waveguide side and a through-hole cavity that extends from the waveguide interface side to the secondary waveguide side, perpendicular to a plane of the PCB substrate. The BGA couples the package substrate to the waveguide interface side such that the surface of the package substrate faces the through-hole cavity and the signal launch and through-hole cavity are substantially aligned.

RF POWER AMPLIFIER WITH BALUN TRANSFORMER

A radiofrequency power amplifier includes a balun transformer and a plurality of power transistor pairs arranged in a push-pull configuration. The balun transformer has an unbalanced coil extending between a first single-ended signal terminal and a first reference, and a balanced coil extending between a first balanced signal terminal and a second balanced signal terminal. The balun transformer also includes an auxiliary coil electrically isolated from the unbalanced coil and the balanced coil. The auxiliary coil is inductively coupled to the unbalanced coil and extends between a third balanced signal terminal and a fourth balanced signal terminal forming a balanced combiner-divider. An output of a first one of the power transistor pairs is coupled to the first and second balanced signal terminals and an output of a second one of the power transistor pairs is coupled to the third and fourth balanced signal terminals. 1. A radiofrequency power amplifier , comprising:a first balun transformer and a plurality of power transistor pairs, each of the plurality of power transistor pairs arranged in a push-pull configuration;wherein the first balun transformer comprises an unbalanced coil extending between a first single-ended signal terminal and a first reference port and a balanced coil extending between a first balanced signal terminal and a second balanced signal terminal;wherein the unbalanced coil and the balanced coil are inductively coupled and electrically isolated from each other;wherein the first balun transformer further comprises at least one auxiliary coil electrically isolated from the unbalanced coil and the balanced coil;wherein the at least one auxiliary coil is inductively coupled to the unbalanced coil and extends between a third balanced signal terminal and a fourth balanced signal terminal forming a balanced combiner;wherein an output of a first one of the plurality of power transistor pairs is coupled to the first and second balanced signal terminals; ...

APPARATUS AND METHODS FOR GENERATING AN ELECTROMAGNETIC WAVE ALONG A TRANSMISSION MEDIUM

Aspects of the subject disclosure may include, generating, by a plurality of dielectric antennas of a waveguide system, a plurality of instances of electromagnetic waves that combines to form a combined electromagnetic wave, and directing, by the waveguide system, the combined electromagnetic wave to an interface of a transmission medium for guiding propagation of the combined electromagnetic wave along the transmission medium without requiring an electrical return path. Other embodiments are disclosed. 1. A waveguide system , comprising:a plurality of antennas coupled to a plurality of cores;a processor that facilitates selectively enabling transmissions by the plurality of antennas according to a selected wave mode, wherein the selected wave mode is generated by radiating instances of electromagnetic waves by at least a portion of the plurality of antennas selectively enabled to form a combined electromagnetic wave in the selected wave mode; anda structure that facilitates guiding the combined electromagnetic wave for propagation along a transmission medium without requiring an electrical return path.2. The waveguide system of claim 1 , wherein the structure comprises a tapered horn.3. The waveguide system of claim 1 , wherein the structure comprises a cover that substantially prevents the combined electromagnetic wave from radiating through the cover.4. The waveguide system of claim 1 , wherein each antenna of the plurality of antennas comprises a dielectric strip antenna.5. The waveguide system of claim 4 , wherein the dielectric strip antenna comprises a tapered end.6. The waveguide system of claim 1 , wherein each antenna of the plurality of antennas comprises a polyrod antenna.7. The waveguide system of claim 6 , wherein the polyrod antenna comprises a tapered end.8. The waveguide system of claim 1 , wherein each antenna of the plurality of antennas is positioned in a corresponding slot of the structure of the waveguide system.9. The waveguide system of claim ...

POWER COMBINER CIRCUIT

A power combiner circuit comprises a network topology for broadband RF and microwave systems that includes coupling elements, internodal matching sections, and an output matching section. The network topology serves as a combining mechanism for power from multiple power amplifiers. The network topology is designed so that characteristic impedances of transmissions lines serving as the coupling elements, internodal matching sections, and an output matching section produce a load impedance at an output port that is matched to the impedances seen by each power amplifier providing power to the power combiner circuit. Such a network topology is scalable to an unlimited number of power amplifiers, and enables a desired broadband frequency response for power amplification, while realizing a very low level of power output loss between input and output ports. 1. A power combiner circuit , comprising:a plurality of input ports, each input port receiving an input signal; a plurality of transmission lines between the plurality of input ports and the output ports,', 'a coupling element configured between each input port and a receiving node in a cascaded array of nodes,', 'a plurality of internodal matching sections, each matching section configured between receiving nodes in the cascaded array of nodes, and', 'an output matching section coupled between the output port and a last receiving node of the cascaded array of nodes,', 'the impedance matching network topology having a simultaneously-matched impedance condition between the input ports and the output port, achieved by a) calculating a current seen at each receiving node, and b) calculating an impedance of each coupling element, each internodal matching section, and the output matching section for a desired bandwidth, so that a load impedance at the output port is equal to an impedance seen at each input port; and, 'an impedance matching network topology configured between the plurality of input ports and an output port, ...

CHIP-TO-CHIP INTERFACE USING MICROSTRIP CIRCUIT AND DIELECTRIC WAVEGUIDE

Disclosed is a chip-to-chip interface using a microstrip circuit and a dielectric waveguide. A board-to-board interconnection device, according to one embodiment of the present invention, comprises: a waveguide which has a metal cladding and transmits a signal from a transmitter-side board to a receiver-side board; and a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT), wherein the microstrip circuit matches a microstrip line and the waveguide, adjusts the bandwidth of a predetermined first frequency band among the frequency bands of the signal, and provides same to the receiver. 1. A board-to-board interconnect apparatus comprising:a waveguide which transmits a signal from a board on the side of a transmitter to a board on the side of a receiver and has a metal cladding; anda microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT),wherein the microstrip circuit matches a microstrip line and the waveguide, and adjusts a bandwidth of a first predetermined frequency band among frequency bands of the signal to provide the signal to the receiver.2. The board-to-board interconnect apparatus of claim 1 , wherein the microstrip circuit comprises:a microstrip feeding line which supplies the signal in a first layer;a probe element which adjusts the bandwidth of the first frequency band;a slotted ground plane including a slot for minimizing a ratio of reverse-traveling waves to forward-traveling waves in a second layer;a ground plane including vias for forming an electrical connection between the slotted ground plane and the ground plane in a third layer; anda patch for radiating the signal at a resonance frequency.3. The board-to-board interconnect apparatus of claim 2 , wherein the probe element has a characteristic impedance greater than that of the microstrip feeding line.4. The board-to-board interconnect apparatus of claim 2 , wherein the probe element is connected ...

RADIO-FREQUENCY DEVICES AND ASSOCIATED PRODUCTION METHODS

A radio-frequency device comprises a printed circuit board and a radio-frequency package, which is mounted on the printed circuit board at a first mounting point and has a radio-frequency chip and a radio-frequency radiation element, wherein the printed circuit board has a first elasticity at least in a first section comprising the first mounting point. The radio-frequency device further comprises a waveguide component, which is mounted on the printed circuit board at a second mounting point and has a waveguide, wherein the radio-frequency radiation element is configured to radiate signals into the waveguide and/or to receive signals by way of the waveguide. The printed circuit board has a second elasticity at least in a second section with an increased elasticity between the first mounting point and the second mounting point, wherein the second elasticity is higher than the first elasticity. 1. A radio-frequency device , comprising:a printed circuit board;a radio-frequency package, which is mounted on a side of the printed circuit board at a first mounting point and has a radio-frequency chip and a radio-frequency radiation element, wherein the printed circuit board has a first elasticity at least in a first section comprising the first mounting point; anda waveguide component, which is mounted on the side of the printed circuit board and above the radio-frequency package at a second mounting point and has a waveguide, wherein the radio-frequency radiation element is configured to radiate signals into the waveguide and/or to receive signals by way of the waveguide,wherein the printed circuit board has a second elasticity at least in a second section with an increased elasticity between the first mounting point and the second mounting point, and wherein the second elasticity is higher than the first elasticity.2. The radio-frequency device as claimed in claim 1 , wherein the second section with the increased elasticity comprises a thinned section of the printed ...

A PACKAGING STRUCTURE COMPRISING AT LEAST ONE TRANSITION FORMING A CONTACTLESS INTERFACE

The present invention relates to a packaging structure () comprising a split-block assembly with a first and a second conducting block section (A,A) and at least one transition between a first planar transmission line (A) and a second transmission line (A), and one or more input/output ports. The first transmission line (A) is arranged on a substrate, e.g. an MMIC (A), disposed on the first conducting block section (A) and comprises a coupling section (A), the first conducting block (A) comprises a cavity (A) with a cavity opening in an upper surface of the first conducting block section (A) so arranged that, in an assembled state of the split-block assembly, the coupling section (A) will be located above, or in, the opening of the cavity (A), the second transmission line (A) being in line with the first transmission line (A) and located on an opposite side of the opening of the cavity (A). The second conducting block section (A) acts as a lid in an assembled state of the packaging structure. One of the conducting block sections is provided with a high impedance surface (A) in a transition region along or facing the first (A) and second (A) transmission lines, a narrow gap being provided between the high impedance surface region (A) and the opposing surface of the other conducting block section (A) at least in the transition region such that the transition will be contactless without any galvanic contact between the first and second transmission lines (A,A). 132-. (canceled)33. A high frequency packaging structure comprising at least one transition between a first transmission line and a second transmission line , said first transmission line being a planar transmission line , the packaging structure comprising a split-block assembly with a first conducting block section and a second conducting block section and at least one input/output port , where in the first transmission line is arranged on a substrate or forms part of a circuit arrangement arranged on a ...

ARRAY ANTENNA DEVICE

Included are: a waveguide in which multiple probe inserting holes are provided in a first wall surface, and multiple connection shaft inserting holes are provided in a second wall surface; multiple feed probes each of which is inserted in one of the probe inserting holes, and to a first end of each of which one of multiple circularly polarized element antennas is connected; multiple connection shafts each of which is inserted in one of the connection shaft inserting holes, and a third end of each of which is connected to a second end of one of the feed probes; multiple rotation shafts, a fifth end of each of which is connected to a fourth end of one of the connection shafts; multiple rotation devices each of which rotates one of the rotation shafts; and a control device that individually controls rotation of the rotation devices. 1. An array antenna device comprising:a waveguide in which a plurality of probe inserting holes is provided in a first wall surface, and a plurality of connection shaft inserting holes is provided in a second wall surface facing the first wall surface;a plurality of feed probes each of which is inserted in one of the probe inserting holes, and to a first end of each of which at least one of multiple circularly polarized element antennas is connected;a plurality of connection shafts each of which is inserted in one of the connection shaft inserting holes, and a third end of each of which is connected to a second end of one of the feed probes;a plurality of rotation shafts, a fifth end of each of which is connected to a fourth end of one of the connection shafts;a plurality of rotation devices each of which rotates one of the rotation shafts; anda control device that individually controls rotation of the rotation devices.2. The array antenna device according to claim 1 ,wherein the waveguide is a rectangular waveguide,the rectangular waveguide includes two wide wall surfaces and two narrow wall surfaces of which areas are equal to or less ...

SIGNAL TRANSMISSION SYSTEM, CONNECTOR APPARATUS, ELECTRONIC DEVICE, AND SIGNAL TRANSMISSION METHOD

A signal transmission system including: a first connector apparatus, and a second connector apparatus that is coupled with the first connector apparatus. The first connector apparatus and the second connector apparatus are coupled together to form an electromagnetic field coupling unit, and a transmission object signal is converted into a radio signal, which is then transmitted through the electromagnetic field coupling unit, between the first connector apparatus and the second connector apparatus. 1. (canceled)2. A signal transmission system comprising:a connector that has a coupling structure to couple with another connector, the coupling structure including a radio coupler connected configured to a signal converting circuit to execute modulation processing based on a transmission object signal and to convert the signal into a high-frequency signal, the radio coupler also being configured to execute demodulation processing on the basis of a received radio signal and to convert the signal into a baseband signal and transmitting the radio signal, the connector being coupled with the other connector to form an electromagnetic field coupler between the radio coupler and a radio coupler of the other connector; andcircuitry that determines whether the radio signal can be transmitted through the electromagnetic field coupler between the connector and the other connector.3. The signal transmission system according to claim 2 , wherein claim 2 , when the circuitry determines that the radio signal can be transmitted claim 2 , the circuitry allows the transmission object signal to be transmitted by the radio signal through each connector.4. The signal transmission system according to claim 2 , wherein claim 2 , when the circuitry determines that the radio signal cannot be transmitted claim 2 , the circuitry forbids the transmission object signal to be transmitted by the radio signal through each connector.5. The signal transmission system according to claim 2 , wherein claim ...

Multi-layer circuit board with waveguide to microstrip transition structure

A multi-layer circuit board with a waveguide to microstrip transition structure includes a laminated structure having a plurality of dielectric layers, a top metal frame disposed over the laminated structure, a microstrip line disposed over the laminated structure, a bottom metal frame underlying the laminated structure, and a plurality of conductors electrically connecting the top metal frame and the bottom metal frame. The top metal frame defines a top cavity, the bottom metal frame defines a bottom cavity corresponding to the top cavity, and the microstrip line extends into the top cavity. The laminated structure includes an upper dielectric layer and at least one lower dielectric layer, wherein top cavity exposes a top surface of the upper dielectric layer, and the bottom cavity exposes a bottom surface of the at least one lower dielectric layer.

FILTER CIRCUIT AND BALUN CIRCUIT

A filter circuit includes a branch line coupler and a balun circuit having an input terminal connected to the branch line coupler to receive a signal, a first line connected to the input terminal and having a length comparable to a quarter of an electrical length of one wavelength at a frequency of the signal, a second line connected to the input terminal and having a length comparable to the quarter, a third line connected to the second line and having a length comparable to the quarter, and a fourth line connected to the third line and electromagnetically coupled to the first line, the fourth line having a length comparable to the quarter, wherein an end of the first line and an end of the fourth line are both connected to a ground or open-circuited, or are connected to two respective terminating resistors whose resistance values are equal.

WILKINSON COMBINER AND WILKINSON DIVIDER

A Wilkinson combiner includes: a plurality of splitting units that splits signals inputted from two ports; an isolating unit that connects one ends of the signals split at the plurality of splitting units to each other; and a combiner that connects other ends of the signals split at the plurality of splitting units to each other and outputs a combined signal. The isolating unit balun-connects the connected signals to each other using a balun circuit, short-circuits the balun-connected one end, and terminates the balun-connected other end using a terminator. 1. A Wilkinson combiner comprising:a plurality of splitting units that splits signals inputted from two ports;an isolating unit that connects one ends of the signals split at the plurality of splitting units to each other; anda combiner that connects other ends of the signals split at the plurality of splitting units to each other and outputs a combined signal,wherein the isolating unit balun-connects the connected signals to each other using a balun circuit, short-circuits the balun-connected one end, and terminates the balun-connected other end using a terminator.2. The Wilkinson combiner according to claim 1 ,wherein an impedance converter is provided between the balun-connected other end and the terminator.3. The Wilkinson combiner according to claim 1 ,wherein the balun circuit is configured of a plurality of semi-rigid cables in balun connection.4. The Wilkinson combiner according to claim 1 ,wherein the balun circuit is formed of lines in a pattern on a circuit board in balun connection.5. A Wilkinson divider comprising:a divider that divides an inputted signal;a plurality of splitting units that splits signals divided at the divider and outputs one ends of the signals; andan isolating unit that connects other ends of the signals split at the plurality of splitting units to each other,wherein the isolating unit balun-connects the connected signals to each other using a balun circuit, short-circuits the ...

MAGNETIC CORE, METHOD FOR MANUFACTURING A MAGNETIC CORE AND BALUN WITH A MAGNETIC CORE

Magnetic core for a balun, balun with a magnetic core and method for manufacturing a magnetic core. In particular, a magnetic core is provided comprising multiple core elements, wherein the individual core elements are concentrically arranged. Furthermore, a heat sink is arranged between two adjacent core elements. By using multiple core elements for a magnetic core, the individual core elements can be adapted to different frequency ranges. In this way, the magnetic core may be used for a balun having a broad frequency range. Furthermore, thermal energy generated in the magnetic core can be dissipated by the heat sinks between the individual core elements. In this way, the power handling capability of the magnetic 1. A magnetic core for a balun , the magnetic core comprising:a number of at least two core elements; andat least one heat sink;wherein the number of core elements and the at least one heat sink are arranged concentrically, and wherein the at least one heat sink is arranged between the number of core elements.2. The magnetic core of claim 1 , comprising at least three core elements and at least two heat sinks.3. The magnetic core of claim 1 , wherein each core element of the number of core elements comprises a ferrite.4. The magnetic core of claim 1 , wherein each core element of the number of core elements comprises a same material.5. The magnetic core of claim 1 , wherein the materials of each core element of the number of core elements are different.6. The magnetic core of claim 1 , wherein the at least one heat sink comprises a metallic material.7. The magnetic core of claim 1 , wherein the at least one heat sink comprises a ceramic material.8. The magnetic core of claim 1 , wherein each core element of the number of core elements is adapted to achieve a predetermined bandwidth of the balun.9. The magnetic core of claim 1 , wherein the number of core elements has a cylindrical shape or a hollow cylindrical shape.10. The magnetic core of claim 1 , ...

Radar system for registering the environment for a motor vehicle and a circuit board for such a radar system

The disclosure relates to a radar system for registering the environment for a motor vehicle, with a circuit board includes a wave termination with a termination line, a signal line connected to it for the transmission of a high frequency signal, and a first substrate layer which is produced from a material with a first loss factor. The radar system also includes a first tier attached onto the first substrate layer, which includes the signal line, a second substrate layer which is produced from a second material with a second loss factor, which is greater than the first loss factor, and a second tier applied to the second substrate layer, which includes the termination line. Additionally, the disclosure relates to a circuit board for such a radar system.

WAVEGUIDE PROPAGATION APPARATUS COMPATIBLE WITH HERMETIC PACKAGING

This topic is related to a waveguide propagation apparatus, converting microstrip propagation to waveguide propagation, providing hermeticity on the mounting area, eliminating the cabling component causing degradation on the overall performance, involving at least a microwave module (), and comprising a combination of a base part () and a cover part (). 1. A waveguide propagation apparatus , converting microstrip propagation to waveguide propagation , providing hermeticity on a mounting area , and at least a microwave module transmitting or receiving RF signal;', 'at least a conductive pin, installed in the microwave module, linked to a microstrip line enabling electromagnetic propagation, and making signal transfer possible from the outer surface or to the outer surface;', 'at least a solder ring, carrying out a mounting of the conductive pin to the microwave module by surrounding the conductive pin when it is melted, and ensuring hermeticity on the mounting area;', 'at least a solder ring detail, bearing the solder ring, having a definite depth and a diameter larger than the diameter of the solder ring, and located on the side wall of the microwave module;', 'at least a module guiding pin guaranteeing a mounting of the wave tide propagation apparatus to the microwave module in a fixed manner;', 'at least a connector mounting detail providing an attachment of a coaxial connector, by the help of which the functionality of the microwave module is validated before the mounting of the waveguide propagation apparatus to the microwave module, by the usage of a screw;, 'eliminating the cabling component causing degradation on the overall performance, comprisingat least a module mounting screw detail on the microwave module to mount the waveguide propagation apparatus to the microwave module by the usage of a screw;at least a module guiding pin detail, accepting the module guiding pin, and located on the side wall of the microwave module;at least a base part, providing a ...

WAVEGUIDE ASSEMBLY, WAVEGUIDE PASSAGE, AND USE OF A WAVEGUIDE ASSEMBLY

A waveguide assembly comprising a first waveguide, and a second waveguide designed as a dielectric multimodal waveguide, and a waveguide transition for transmitting an electromagnetic wave between the first waveguide and the second waveguide, the waveguide transition having a dielectric waveguide piece which is between the first waveguide and the second waveguide. The dielectric waveguide piece is capable of guiding a smaller mode number than the second waveguide, at least in a front section, facing the first waveguide. 1. A waveguide assembly comprising:a first waveguide;a second waveguide that is embodied as a dielectric multi-mode waveguide; anda waveguide transition for transmitting an electromagnetic wave between the first waveguide and the second waveguide, the waveguide transition having a dielectric waveguide piece between the first waveguide and the second waveguide; andwherein the dielectric waveguide piece is embodied to run a lower number of modes, at least in a front section that is facing the first waveguide, than the second waveguide.2. The waveguide assembly as claimed in claim 1 , and wherein the dielectric waveguide piece is a purely dielectric waveguide piece.3. The waveguide assembly as claimed in claim 1 , and wherein the front section of the dielectric waveguide piece is a single mode waveguide.4. The waveguide assembly as claimed in and wherein the front section of the dielectric waveguide piece has a reduced cross-section with respect to the second waveguide;the front section of the dielectric waveguide piece has a reduced permittivity of a dielectric core material with respect to the second waveguide; and/orthe front section of the dielectric waveguide piece has an increased permittivity of a sheath, which encases the dielectric core material, with respect to the second waveguide.5. The waveguide assembly as claimed in and wherein the dielectric waveguide piece has a rear section that is facing the second waveguide and the rear section of ...

MODE CONVERTER

An aspect of the present invention is to reduce return loss in a mode converter. A mode converter () includes an excitation pin (through via TV) configured to carry out mutual conversion between a waveguide mode of a post-wall waveguide (PW) and a waveguide mode of a microstrip line (MS). The mode conductor includes a pair of wide walls (conductor layers and ), in which first and second anti-pads (anti-pads ) are formed, respectively. The first and second anti-pads each have an inner edge including the excitation pin and each have an outer size (diameter D) that is more than 5 times and less than 6 times as large as the diameter (DT) of the excitation pin. 1. A mode converter comprising:a post-wall waveguide including a first wide wall and a second wide wall, which make a pair of wide walls;a microstrip line in which the first wide wall is a ground layer; andan excitation pin made of a through via which penetrates through the post-wall waveguide, the excitation pin being configured to carry out mutual conversion between a waveguide mode of the post-wall waveguide and a waveguide mode of the microstrip line,the first wide wall and the second wide wall having a first anti-pad and a second anti-pad, respectively, the first anti-pad and the second anti-pad each having a ring-like shape and each being formed so as to (i) have an inner edge including the excitation pin and (ii) have an outer size that is more than 5 times and less than 6 times as large as a diameter of the excitation pin, when seen in plan view.2. The mode converter as set forth in claim 1 , further comprising a cap made of a conductor provided on a surface of the second wide wall claim 1 , the cap having an opening which surrounds an outer edge of the second anti-pad.3. The mode converter as set forth in claim 2 , further comprising a support member being a plate-like or block-like support member claim 2 , which is provided on the surface of the second wide wall so as to cover the second anti-pad claim 2 ...

COAXIAL WIRING DEVICE AND TRANSMISSION/RECEPTION INTEGRATED SPLITTER

Conventional coaxial wiring devices present a problem in that the management of the manufacturing process therefor is difficult. A coaxial wiring device according to the present invention includes a first member, a second member, and a conductor plate. The first member () and the second member () include, when a line that connects a first port and a second port is denoted by a reference line, a first groove () that has a central point on the reference line and extends in a direction that intersects with the reference line; a second groove () that connects one end (FN) of the first groove () and the first port; a third groove () that connects the other end (FN) of the first groove () and the first port and has a shape that is line symmetrical to the second groove () with respect to the reference line; a fourth groove () that connects one end (FN) of the first groove () and the second port; and a fifth groove () that connects the other end (FN) of the first groove () and the second port and has a shape that is line symmetrical to the fourth groove () with respect to the reference line. 17-. (canceled)8. A coaxial wiring device comprisinga first metallic member,a second metallic member opposed to the first member, anda conductor plate that is provided to be held between the first metallic member and the second metallic member,wherein:a high-frequency signal is transmute d between a first port and a second port provided on respective ends of a coaxial wire formed in the conductor plate by grooves formed in the first metallic member and the second metallic member and the coaxial wire, andthe coaxial wire is arranged to be centrosymmetric with a point on a line that connects the first port and the second port as a center of symmetry.9. The coaxial wiring device according to claim 8 , wherein the second port is provided on an antenna that converts a signal input through a waveguide into a signal that propagates on a coaxial.10. The coaxial wiring device according to claim ...

WAVEGUIDE TUBE/TRANSMISSION LINE CONVERTER AND ANTENNA DEVICE

A metal member which allows a waveguide to extend inside a dielectric substrate and is adapted to hold a short-circuit metal layer at a potential same as a potential of the waveguide is made to remain along cross-sections of the two wide walls of the waveguide and is removed along cross-sections of two narrow walls of the waveguide so as to prevent an electromagnetic wave from unintendedly being radiated. 1. A waveguide/transmission line converter configured to convert power transmitted by a waveguide and power transmitted by a transmission line to each other , the waveguide/transmission line converter comprising:a dielectric substrate arranged in a manner blocking an opening of the waveguide;a short-circuit metal layer arranged on a surface of the dielectric substrate and outside of the waveguide, and held at a potential same as a potential of the waveguide by a metal member penetrating the dielectric substrate along cross-sections of two wide walls of the waveguide or by a metal member penetrating the dielectric substrate along the cross-sections of the two wide walls and a cross-section of one of two narrow walls of the waveguide; anda matching element arranged on a surface of the dielectric substrate and inside the waveguide, and coupled to the transmission line, in which a resonant length adapted to set up, as a standing wave, an electromagnetic wave having an effective wavelength in a surrounding environment of the dielectric substrate is in an electric field direction inside the waveguide and in a feed power direction of the transmission line.2. The waveguide/transmission line converter according to claim 1 , further comprising a dielectric layer formed on surfaces of the transmission line and the short-circuit metal layer.3. The waveguide/transmission line converter according to claim 2 , wherein the dielectric layer has a thickness of 0.2 times or less of an effective wavelength of an electromagnetic wave in the surrounding environment of the waveguide/ ...

WAVEGUIDE MOUNT FOR MICROSTRIP CIRCUIT AND MATERIAL CHARACTERIZATION

The present invention relates to a waveguide-to-microstrip line transition package for superconducting film characterization. The package allows propagation and impedance properties thin-film microwave line superconductor to be characterized at millimeter wave frequencies as a function of frequency. The superconducting film's kinetic inductance can be varied by applying direct current along the ground plane via spring loaded probe. When implemented with a non-superconducting metal housing the present invention is highly suitable for measuring resonators with the quality factor, Q, ranges from 100 to 1×10. Through the use of a housing realized from an appropriate superconducting bulk material or coating the upper end of this range of applicability can be readily extended to >1×10. 1. A superconducting film device comprising: a substrate disposed on a silicon handling wafer;', 'a microstrip feed line; and', 'a plurality of superconducting microstrip resonators and a half-wavelength resonator, disposed on said silicon substrate and coupled to said microstrip feed line., 'a superconducting microstrip device including2. The superconducting film device of claim 1 , wherein said substrate is a single-crystal silicon substrate of 50 μm in thickness.3. The superconducting film device of claim 2 , wherein said plurality of superconducting microstrip resonators are niobium titanium nitride (NbTiN) microstrip resonators claim 2 , and said NbTiN microstrip resonators are 80 claim 2 , 40 claim 2 , and 20 μm in width claim 2 , and respectively 550 claim 2 , 534 and 510 μm in length.4. The superconducting film device of claim 3 , wherein said half-wavelength resonator is a niobium (Nb) half-wavelength resonator claim 3 , and said Nb resonator is 20 μm in width and 510 μm in length.5. The superconducting film device of claim 4 , wherein said silicon handling wafer has a thickness of 325 μm claim 4 , a length of 6 mm claim 4 , and a width of 1.5 mm.6. The superconducting film device ...

MOUNTING SUBSTRATE, WAVEGUIDE MODULE, INTEGRATED CIRCUIT-MOUNTED SUBSTRATE, MICROWAVE MODULE

A mounting substrate includes a circuit board and a coupler. The circuit board has a mounting surface on which a microwave integrated circuit element is to be mounted, the microwave integrated circuit element having a plurality of terminals including first and second antenna I/O terminals. The coupler connects the first and second antenna I/O terminals to a waveguide device. The coupler includes: a first electrical conductor portion to be connected to the first antenna I/O terminal; a second electrical conductor portion to be connected to the second antenna I/O terminal; and an elongated gap in which an end face of the first electrical conductor portion and an end face of the second electrical conductor portion oppose each other. The elongated gap has a narrow portion at which the distance between the end face of the first electrical conductor portion and the end face of the second electrical conductor portion is locally decreased. The coupler couples an electromagnetic field being produced at the narrow portion to a waveguide in the waveguide device. 1. A mounting substrate comprising:a circuit board having a mounting surface on which a microwave integrated circuit element is to be mounted, the microwave integrated circuit element having a plurality of terminals, the plurality of terminals including first and second antenna input/output (I/O) terminals; anda coupler to connect the first and second antenna I/O terminals to a waveguide device, wherein,the circuit board includes an interconnect to be connected to a terminal other than the first and second antenna I/O terminals among the plurality of terminals; and a first electrical conductor portion to be connected to the first antenna I/O terminal,', 'a second electrical conductor portion to be connected to the second antenna I/O terminal, and', 'an elongated gap in which an end face of the first electrical conductor portion and an end face of the second electrical conductor portion oppose each other;, 'the coupler ...

Surface mounted notch radiator with folded balun

A notch radiator apparatus includes: a planar circuit board having a plurality of different planar layers; a balun cavity formed between two ground layers of the planar circuit board that are separated by a laminated layer; a conductive notch formed horizontally in a plane parallel to the planar circuit board by two three dimensional (3D) structures formed on a top surface of the circuit board; a stripline signal feed folded within planar circuit board layers; and a plated hole formed vertically in a plane perpendicular to the planar circuit board and extending from the stripline signal feed. The stripline signal feed electromagnetically transfer radio frequency (RF) energy into or out of the antenna notch radiator apparatus.

Balanced to unbalanced converter

Disclosed is a balanced to unbalanced converter, which relates to the field of semiconductor technologies. The balanced to unbalanced converter includes a first spiral coil and a second spiral coil. The first spiral coil includes: multiple rings of first metal wires; and a second metal wire, which is located above the multiple rings of first metal wires and is connected to an innermost ring of the first metal wires using a conductive plug. The second spiral coil includes: multiple rings of third metal wires, adjacent third metal wires being separated by one ring of the first metal wires; and multiple rings of fourth metal wires that are located above the multiple rings of the third metal wires, each ring of the fourth metal wires being connected to one ring of the third metal wires by the conductive plug, a fourth metal wire closer to an outer ring being connected to a third metal wire closer to an outer ring, and a fourth metal wire closer to an inner ring being connected to a third metal wire closer to an inner ring. The second metal wire and the innermost ring of the first metal wires do not overlap in a vertical direction, and at least one of the multiple rings of the fourth metal wires and the third metal wire connected to the fourth metal wire do not overlap in the vertical direction.

Higher Signal Isolation Solutions for Printed Circuit Board Mounted Antenna and Waveguide Interface

Higher isolation solutions for printed circuit board mounted antenna and waveguide interfaces are provided herein. An example waveguide mounted onto a dielectric substrate can enclose around a periphery of an antenna and contain radiation produced by the antenna along a path that is coaxial with a centerline of the waveguide. The waveguide can have a first portion having a first cross sectional area that is substantially polygonal that transitions to a second cross sectional area that is substantially conical. A shape of the radiation produced by the antenna is altered by the first portion as the radiation propagates through the first portion. A second portion includes an elongated tubular member coupled with the first portion

SIGNALING DEVICE INCLUDING A SUBSTRATE INTEGRATED WAVE GUIDE

An illustrative example electronic device includes a substrate integrated wave guide (SIW) comprising a substrate and a plurality of conductive members in the substrate. An antenna member is situated at least partially in the substrate in a vicinity of at least some of the plurality of conductive members. A signal generator has a conductive output electrically coupled with the antenna member. The antenna member radiates a signal into the SIW based on operation of the signal generator. 1. An electronic device , comprising:a substrate integrated waveguide (SIW) comprising a substrate and a plurality of conductive members in the substrate;an antenna member situated at least partially in the substrate in a vicinity of at least some of the plurality of conductive members;a signal generator having a conductive output electrically coupled with the antenna member, wherein the antenna member radiates a signal into the SIW based on operation of the signal generator.2. The device of claim 1 , whereinthe signal generator comprises a ball grid array including a plurality of solder balls; andthe conductive output comprises at least one of the solder balls.4. The device of claim 1 , wherein the antenna member comprises a portion of a metal layer on the substrate.5. The device of claim 1 , wherein the antenna member comprises a generally circular and generally planar disk.6. The device of claim 1 , whereinthe plurality of conductive members of the SIW respectively comprise a metalized via or a metal-filled via in the substrate;the SIW has a direction of signal output on a first side of the antenna element;the device includes a plurality of backshort vias in the substrate on a second side of the antenna element;at least some of the second side faces in an opposite direction from the direction of signal output; andthe backshort vias reflect radiation from the antenna element in the direction of signal output.7. The device of claim 1 , wherein the device is configured as a radar ...

PCB Integrated Waveguide Terminations and Load

The present application discloses embodiments that relate to a radar system. The embodiments may include a plurality of radiating waveguides each having a waveguide input. The embodiments also include an attenuation component, which can be located on a circuit board. The embodiments further include a beamforming network. The beamforming network includes a beamforming network input. The beamforming network also includes a plurality of beamforming network outputs, where each beamforming network output is coupled to one of the waveguide inputs. Additionally, the beamforming network includes an attenuation port, wherein the attenuation port is configured to couple the beamforming network to the attenuation component. The attenuation component dissipates received electromagnetic energy. 1. A radar system comprising:at least one attenuation component, wherein the at least one attenuation component is disposed on a circuit board and wherein the attenuation component is configured to dissipate electromagnetic energy;at least one attenuation port, wherein the at least one attenuation port is configured to couple the beamforming network to the at least one attenuation component; and a beamforming network input, and', 'at least one of beamforming network output, wherein the beamforming network output is coupled to a radiating waveguide input; and, 'a beamforming network, and wherein the beamforming network comprisesat least one attenuation port, wherein the at least one attenuation port is configured to couple the beamforming network to the at least one attenuation component.2. The radar system according to claim 1 , wherein the at least one attenuation port comprises a plurality of attenuation ports and wherein the at least one attenuation component comprises a plurality of attenuation components claim 1 , wherein each attenuation port is coupled to a respective attenuation component.3. The radar system according to claim 1 , wherein the attenuation component comprises a ...

Method and Apparatus for Coupling a Waveguide Structure to an Integrated Circuit Package

A mechanism is provided to reduce a distance of a waveguide antenna from transmit and receive circuitry in an integrated circuit device die. This distance reduction is performed by providing vertical access to radio frequency connections on a top surface of the IC device die. A cavity in the encapsulant of the package can be formed to provide access to the connections and plated to perform a shielding function. A continuous connection from the RF pads is used as a vertical interconnect. The region around the vertical interconnect can be filled with encapsulant potting material and back grinded to form a surface of the semiconductor device package. A waveguide antenna feed can be plated or printed on the vertical interconnect on the surface of the package. 1. A semiconductor device package comprising:a lead frame;a semiconductor device die adhesively coupled by an inactive major surface of the semiconductor device die to the lead frame, the semiconductor die comprising a radio frequency (RF) pad on an active major surface of the semiconductor die, wherein the inactive major surface of the semiconductor device die is opposite the active major surface of the semiconductor device die;an encapsulant material injected over and around the semiconductor device die and the lead frame; the antenna feed corresponds with the RF signal pad on the semiconductor device die, and', 'at least a portion of the antenna feed is directly above the RF signal pad; and, 'an antenna feed formed on a major surface of the encapsulant material, wherein'} the vertical interconnect comprises a continuous conductor formed by additive manufacturing, and', 'the continuous conductor is vertically disposed through the encapsulant material., 'a vertical interconnect coupling the RF signal pad to the antenna feed, wherein'}2. The semiconductor device package of further comprising:a waveguide contact pad on the major surface of the encapsulant material corresponding to the antenna feed; andan ...

Extremely High Frequency Electronic Component

A circuit substrate of an extremely high frequency electronic component having an organic substrate material and at least one hollow space incorporated into the substrate material, the hollow space being provided, on at least part of its peripheral surfaces, with a metal layer and acting as a hollow waveguide for electrical signals with a carrier frequency of 10 GHz or higher, and being directly adjacent to an active component part, and thereby being electrically connected with such an active component part, or being electrically connected with it through a metal lead, in particular a strip line projecting into the hollow space.

Flared dielectric coupling system and methods for use therewith

In accordance with one or more embodiments, a dielectric coupler includes a neck portion configured to receive a first electromagnetic wave from a hollow waveguide. A flared portion is configured to generate, responsive to the first electromagnetic wave, a second electromagnetic wave along a surface of a transmission medium, wherein the flared portion at least partially surrounds the transmission medium, wherein the second electromagnetic wave propagates along the surface of the transmission medium without requiring an electrical return path. A tapered portion is configured to interface the neck portion to the flared portion.

CONTACTLESS AIR-FILLED SUBSTRATE INTEGRATED WAVEGUIDE DEVICES AND METHODS

Whilst offering promise to millimeter-wave applications and potentially also microwave applications the air-filled substrate integrated waveguides (AF-SIWs) established to date within the prior art require a complete and flawless smooth connection of the top and bottom layers to the intermediate substrate. This necessitates a high precision and costly structure to avoid signal leakage from any discontinuity or bad connection of the layers and “tight” mechanical contact between the components through closely located mechanical fixtures that hold and tighten together the AF-SIW. In order to overcome the costly and high precision fabrication and assembly processes and to enable SIWs to be used in applications where SIWs are closely located the inventors have established a contactless air-filled SIW (CLAF-SIW) which allows high performance SIWs to be implemented with increased tolerances, cheaper substrate technologies, and lower complexity. 1. An electromagnetic waveguide comprising: a central region filled with a material of predetermined low dielectric constant;', 'left and right portions of the substrate either side of the central region, each of the left and right portions comprising a first artificial magnetic conductor (AMC) on a first side of the substrate, a second AMC on a second side of the substrate opposite the first (AMC), and a plurality of electrically conductive vias, each via electrically coupling a predetermined portion of the first AMC to a predetermined portion of the second AMC;, 'a substrate comprisinga first electrical conductor disposed on a first carrier over at least the central portion and the left and right portions of the substrate on the side of the first AMC with the first electrical conductor facing the first AMC and at least one of in contact with or within a predetermined distance of the AMC; anda second electrical conductor disposed on a second carrier over at least the central portion and the left and right portions of the substrate ...

Lumped circuit balance converter applied to double-sided parallel lines

The present invention discloses a lumped circuit balance converter applied to double-sided parallel lines, comprising a radio frequency transceiver, a balance converter, a filter and a matching network. The filter is connected with the matching network through the balance transmission line. The balance converter comprises a second circuit block, a first circuit block, a third circuit block, a first port, a second port and a third port. A positive polarity of a signal is positioned at the top of the second port and the bottom of the third port. Balance signals are respectively fed to the converter at the top of the second port and the bottom of the third port, and the signals are combined in the first port. The present invention has simple structure and better effect when used, can be easily changed to different required performance, and has good applicability and strong practicability.

Nodes for use in a communication network and methods of operating the same

According to an aspect, there is provided a method of operating a first radio access node in a communication network, the method comprising determining (601) whether a first base key that is used to determine a first encryption key for encrypting communications between a communication device and the first radio access node can be used by a second radio access node for determining a second encryption key for encrypting communications between the communication device and the second radio access node; and if the first base key can be used by the second radio access node, sending (603) the first base key to the second radio access node during handover of the communication device from the first radio access node to the second radio access node.

METHOD OF MAKING A LOW MASS FOAM ELECTRICAL STRUCTURE

A method of making an electrical structure having a foam housing is set forth. The foam housing includes an interior surface forming a conductive cavity adapted to carry energized waveforms therethrough. An electrical component of the electrical structure is integrally formed with the interior surface as the foam housing of the structure is assembled. The method includes the steps of depositing a plating material into a mold, pouring a foam polymer into the mold and removing the plated foam structure from the mold without etching the section from the mold. The method further includes steps of forming a metallic form into a planar structure, filling the open pores of the foam with a material such as photo-resist, machining a cavity from the foam, electroplating the cavity in the foam then removing the photo-resist material. 1. (canceled)2. (canceled)3. (canceled)4. (canceled)5. A method of manufacturing a low mass radio frequency (RF) transmission line structure comprising the steps of:forming first and second housings of open cell metallic foam;filling the open cell metallic foam with a filling material;machining a first cavity in a first surface of the first housing and machining a second cavity in a first surface of the second housing;plating the first and second cavitiesremoving the filling material from the open cell metallic foam forming the first and second housings;locating a printed circuit board comprising an electrical component between the first and second housing sections; andcoupling the first surface of the first housing to the first surface of the second housing so that the first and second cavities are aligned and form the RF transmission line structure.6. The method of wherein the filling material is a photo resist.7. The method of wherein the filling material is an epoxy-based negative photo resist.8. The method of wherein the filling material is a machining wax.9. The method of wherein the filling material is a polyester.10. (canceled) This ...

RADIO FREQUENCY POWER SENSOR HAVING A NON-DIRECTIONAL COUPLER

Disclosed is a capacitive non-directional coupler having a non-directional coupler printed circuit board (PCB) and a capacitive attenuator The non-directional coupler PCB includes a coupler section configured to carry energy travelling on a main transmission line. The non-directional coupler PCB and the capacitive attenuator are configured as a capacitive voltage divider, and provide a sample of the energy on the main transmission line. Also disclosed is a method for measuring for measuring RF power using an RF power sensor having the capacitive non-directional coupler that includes with the non-directional coupler printed circuit board and the capacitive attenuator. Also disclosed is an RF power metering system that includes an RF power sensor having the capacitive non-directional coupler. 195.-. (canceled)96. A radio frequency (RF) power sensor comprising:a non-directional coupler and an analog processing circuit;said non-directional coupler is a capacitive non-directional coupler and comprised of a non-directional coupler printed circuit board (PCB) and a capacitive attenuator;said non-directional coupler PCB is comprised of a coupler section configured to carry energy travelling on a main transmission line;wherein said non-directional coupler PCB and said capacitive attenuator are configured as a capacitive voltage divider and provide a sample of the energy on said main transmission line.97. The RF power sensor as set forth in claim 96 , wherein said coupler section is a microstripline.98. The RF power sensor as set forth in claim 96 , wherein a front side of said non-directional coupler PCB is comprised of said coupler section claim 96 , a reverse side of said non-directional coupler PCB is comprised of a printed metallic structure claim 96 , and a di-electric material located between said coupler section and said printed metallic structure;at least a portion of said coupler section and said printed metallic structure overlap; andsaid coupler section and said ...

Antenna device with direct differential input useable on an automated vehicle

An illustrative example transmission device, which is useful for an automated vehicle, includes a substrate having a metal layer near one surface of the substrate and a waveguide area. The metal layer includes a slot that at least partially overlaps the waveguide area. A source of radiation includes a first radiation output situated on a first side of the slot and a second radiation output situated on a second, opposite side of the slot.

Semiconductor chip with local oscillator buffer reused for loop-back test and associated loop-back test method

A semiconductor chip includes a first wireless communication circuit, a local oscillator (LO) buffer, and an auxiliary path. The first wireless communication circuit has a signal path, wherein the signal path has a mixer input port and a signal node distinct from the mixer input port. The auxiliary path is used to electrically connect the LO buffer to the signal node of the signal path. The LO buffer is reused for a loop-back test function through the auxiliary path.

Radio frequency communication

A differential transmission transition interface is disclosed which can include first and a second buried conducting tracks providing respectively first and second differential couplings between a differential RF transmission output and a waveguide; the first buried conducting track extending over an opening of the waveguide to provide a first RF coupling element; and the second buried conducting track extending over the opening to provide a second RF coupling element. At least a portion of the first RF coupling element extends over the waveguide opening in a first angular direction; and at least a portion of the second RF coupling element extends over the waveguide opening in a second angular direction that is opposed to the first angular direction.

Microelectronic assemblies with substrate integrated waveguide

Microelectronic assemblies that include a lithographically-defined substrate integrated waveguide (SIW) component, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate portion having a first face and an opposing second face; and an SIW component that may include a first conductive layer on the first face of the package substrate portion, a dielectric layer on the first conductive layer, a second conductive layer on the dielectric layer, and a first conductive sidewall and an opposing second conductive sidewall in the dielectric layer, wherein the first and second conductive sidewalls are continuous structures.

MULTIBAND WAVEGUIDE INTERCONNECT

There is disclosed in one example an electromagnetic wave launcher apparatus, including: an interface to an electromagnetic waveguide; a first launcher configured to launch a high-frequency electromagnetic signal onto a first cross-sectional portion of the waveguide; and a second launcher configured to launch a lower-frequency electromagnetic signal onto a second cross-sectional portion of the waveguide. 1. An electromagnetic wave launcher apparatus , comprising:an interface to an electromagnetic waveguide;a first launcher configured to launch a high-frequency electromagnetic signal onto a first cross-sectional portion of the waveguide; anda second launcher configured to launch a lower-frequency electromagnetic signal onto a second cross-sectional portion of the waveguide.2. The electromagnetic wave launcher apparatus of claim 1 , wherein the high-frequency electromagnetic signal has a minimum frequency of approximately 200 gigahertz (GHz).3. The electromagnetic wave launcher apparatus of claim 1 , wherein the high-frequency electromagnetic signal has a frequency in the range of approximately 300 GHz to approximately 1 terahertz (THz).4. The electromagnetic wave launcher apparatus of claim 1 , wherein the low-frequency electromagnetic signal has a maximum frequency of approximately 200 GHz.5. The electromagnetic wave launcher apparatus of claim 1 , wherein the low-frequency electromagnetic signal has a maximum frequency of approximately 60 GHz.6. The electromagnetic wave launcher apparatus of claim 1 , wherein the first cross-sectional portion is rectangular and has dimensions of less than 200 micrometers (μm)×400 μm.7. The electromagnetic wave launcher apparatus of claim 1 , wherein the first cross-sectional portion is rectangular and has dimensions of less than 100 μm×400 μm.8. The electromagnetic wave launcher apparatus of claim 1 , wherein the second cross-sectional portion is rectangular and has dimensions of approximately 1.5 millimeters (mm)×3 mm.9. The ...

Composite electronic component

A composite electronic component includes a multilayer stack, a filter, and an antenna. The filter is located within the multilayer stack and interposed between a first ground conductor layer and a second ground conductor layer. The antenna includes a radiation element. The radiation element is located on a side of the second ground conductor layer opposite from the first ground conductor layer. When viewed in a direction parallel to the stacking direction of the multilayer stack, the radiation element entirely lies inside the perimeter of the second ground conductor layer. The multilayer stack includes a plurality of connection conductor sections arranged around the filter and connecting the first ground conductor layer and the second ground conductor layer.

Electrosurgical apparatus for generating radiofrequency energy and microwave energy for delivery into biological tissue

An isolating circuit for electrosurgical generator arranged to produce radiofrequency (RF) energy and microwave energy for treating biological tissue. The generator has an RF channel and a microwave channel which are combined at signal combiner to enable the RF energy and microwave energy to be delivered into tissue along a common feed path. The isolating circuit comprises a tunable waveguide isolator at a junction between the microwave channel and signal combiner, and can include a capacitive structure between a ground conductor of the signal combiner and a conductive input section of the waveguide isolator to inhibit coupling of the RF energy and leakage of the microwave energy. The isolating circuit can combine into a single tunable unit all the necessary components to isolate the microwave and RF channels from one another whilst providing a high withstanding voltage.

TRANSMISSION LINE

The present invention reduces the risk of damaging a waveguide made of a brittle material. A transmission line () includes: a first waveguide () which is made of a brittle material; a second waveguide (); and a bonding layer () by which the first waveguide () and the second waveguide () are bonded and which is electrically conductive. At least part of the bonding layer () is made of an electrically conductive adhesive, the at least part of the bonding layer () being in contact with the first waveguide (). 1. A transmission line , comprising:a first waveguide which is made of a brittle material;a second waveguide; anda bonding layer by which the first waveguide and the second waveguide are bonded and which is electrically conductive,at least part of the bonding layer being made of an electrically conductive adhesive, the at least part of the bonding layer being in contact with the first waveguide.2. The transmission line as set forth in claim 1 , wherein the electrically conductive adhesive has claim 1 , after being cured claim 1 , an elastic modulus smaller than that of the brittle material.3. The transmission line as set forth in claim 1 , wherein:a waveguide mode of the first waveguide is coupled to that of the second waveguide via respective openings of the first waveguide and of the second waveguide; andthe bonding layer surrounds the respective openings of the first waveguide and of the second waveguide.4. The transmission line as set forth in claim 1 , wherein the bonding layer has an outer periphery whose corners are rounded.5. The transmission line as set forth in claim 1 , further comprising:another bonding layer which is provided so as to surround the bonding layer and which is made of a non-electrically conductive adhesive,the first waveguide and the second waveguide being bonded by not only the bonding layer but also the another bonding layer.6. The transmission line as set forth in claim 5 , wherein the non-electrically conductive adhesive has claim 5 , ...

METALLIZED PLASTIC HIGH RADIO FREQUENCY INTEGRATED WAVEGUIDE

An integrated waveguide for use in high radio frequency communication is provided. The integrated waveguide including: a first substrate including a first plastic layer having on a first inward-facing surface, a first portion of a waveguide feature formed on the first inward-facing surface, and a metal layer disposed on the first inward-facing surface; and a second substrate including a second plastic layer having a second inward-facing surface, a second portion of a waveguide feature formed on the second inward-facing surface, and a metal layer disposed on the second inward-facing surface, wherein the first substrate and the second substrate are assembled to define an integrated waveguide feature defined by an assembling of the first portion of the waveguide feature and the second portion of the waveguide feature. 1. An integrated waveguide comprising:a first substrate comprising a first plastic layer having on a first inward-facing surface, a first portion of a waveguide feature formed on the first inward-facing surface, and a metal layer disposed on the first inward-facing surface; anda second substrate comprising a second plastic layer having a second inward-facing surface, a second portion of a waveguide feature formed on the second inward-facing surface, and a metal layer disposed on the second inward-facing surface,wherein the first substrate and the second substrate are assembled to define an integrated waveguide feature defined by an assembling of the first portion of the waveguide feature and the second portion of the waveguide feature.2. The integrated waveguide of claim 1 , wherein the first plastic layer is formed using an injection mold assembly and the metal layer of the first plastic layer is disposed on the first inward-facing surface by electroplating.3. The integrated waveguide of claim 1 , wherein dimensions of the first and second plastic layers are predefined claim 1 , and the first and second plastic layers are dimensioned within +/−10 mils ...

SEMICONDUCTOR DEVICE WITH SUBSTRATE INTEGRATED HOLLOW WAVEGUIDE AND METHOD THEREFOR

A method of manufacturing a device is provided. The method includes forming a first cavity in a first substrate with the first cavity having a first depth. A second cavity is formed in a second substrate with the second cavity having a second depth. The first cavity and the second cavity are aligned with each other. The first substrate is affixed to the second substrate to form a waveguide substrate having a hollow waveguide with a first dimension substantially equal to the first depth plus the second depth. A conductive layer is formed on the sidewalls of the hollow waveguide. The waveguide substrate is placed over a packaged semiconductor device, the hollow waveguide aligned with a launcher of the packaged semiconductor device. 1. A method comprising:forming a first cavity in a first substrate, the first cavity having a first depth;forming a second cavity in a second substrate, the second cavity having a second depth;aligning the first cavity and the second cavity with each other;affixing the first substrate to the second substrate to form a waveguide substrate having a hollow waveguide with a first dimension substantially equal to the first depth plus the second depth;forming a conductive layer on the sidewalls of the hollow waveguide; andplacing the waveguide substrate over a packaged semiconductor device, the hollow waveguide aligned with a launcher of the packaged semiconductor device.2. The method of claim 1 , wherein the conductive layer formed on the sidewalls of the hollow waveguide comprises a copper material.3. The method of claim 1 , further comprising placing a waveguide antenna structure over the waveguide substrate claim 1 , the hollow waveguide providing a continuous channel between the launcher of the packaged semiconductor device and the waveguide antenna structure.4. The method of claim 1 , wherein the second cavity formed in the second substrate is a mirrored copy of the first cavity formed in the first substrate.5. The method of claim 1 , ...

Balun

A balun includes an unbalanced terminal, balanced terminals, and lines, and converts a signal between an unbalanced line and an balanced line. A first line is connected between the unbalanced terminal and a reference potential. A second line is connected between the balanced terminal and the reference potential, and is coupled to the first line. A third line is connected between the balanced terminal and the reference potential, and is coupled to the first line. A fourth line is connected in parallel to the second line, and is coupled to the third line. The fourth line is configured such that a signal with an opposite phase to that of a signal passing through the third line passes through the fourth line.

SIGNAL TRANSMISSION LINE INCLUDING ELECTRICALLY THIN RESISTIVE LAYER AND ASSOCIATED METHODS

A signal transmission line includes: a first electrical conductor; a second electrical conductor; a dielectric region between the first electrical conductor and the second electrical conductor; and an electrically thin resistive layer disposed within the dielectric region and disposed between the first electrical conductor and the second electrical conductor. A gap exists in the electrically thin resistive layer. 1. A signal transmission line comprising:a first electrical conductor;a second electrical conductor;a dielectric region between the first electrical conductor and the second electrical conductor; andan electrically thin resistive layer disposed within the dielectric region, and disposed between the first electrical conductor and the second electrical conductor, wherein a gap exists in the electrically thin resistive layer.2. The signal transmission line of claim 1 , wherein the electrically thin resistive layer is configured to be substantially transparent to a substantially transverse-electromagnetic (TEM) mode of transmission while substantially completely attenuating higher order modes of transmission claim 1 , and the higher order modes of transmission are not substantially attenuated in the gaps.3. The signal transmission line of claim 1 , wherein the gap exists perimetrically in the electrically thin resistive layer.4. The signal transmission line of claim 1 , wherein the gap exists radially in the electrically thin resistive layer.5. The signal transmission line of claim 1 , further comprising a plurality of gaps claim 1 , wherein some of the plurality of gaps exist perimetrically in the electrically thin resistive layer claim 1 , and some of the plurality of gaps exist radially in the electrically thin resistive layer.6. The signal transmission line of claim 5 , wherein each of the plurality of gaps has a length claim 5 , and each of the lengths is substantially the same.7. The signal transmission line of claim 5 , wherein each of the plurality of ...

IMPROVED ANTENNA

A substrate integrated waveguide, SIW, antenna comprises a modified design of prior art SIW antennas that comprises an addition of electrically conducting means, e.g. vias, also along the substrate extending from the antenna aperture. By doing so, the SIW antenna of the present disclosure enables a reduction of mutual coupling between neighboring SIW antennas when arranged adjacent each other, e.g. in an array. Moreover, a reduction of back radiation in the SIW antenna can also be observed. 1. A substrate integrated waveguide , SIW , antenna comprising:a substrate,a first metal plate arranged on a first side of the substrate,a second metal plate arranged on a second side of the substrate,first electrically conducting means arranged through the substrate to connect the first metal plate and the second metal plate, the first electrically conducting means being arranged in a direction of extension, starting at a feed end and ending at an aperture, andsecond electrically conducting means arranged through the substrate, the second electrically conducting means being arranged in the direction of extension and starting at the aperture.2. The SIW antenna of claim 1 , where:the first electrically conducting means are configured as two walls that are flared in a direction perpendicular to the direction of extension, thereby forming a SIW horn antenna.3. The SIW antenna of claim 2 , where:the first electrically conducting means comprise any of via holes, via posts and solid walls.4. The SIW antenna of claim 1 , where:the second electrically conducting means are configured as two parallel walls.5. The SIW antenna of claim 4 , where:the second electrically conducting means comprise any of via holes, via posts and solid walls.6. The SIW antenna of claim 1 , comprising:at least a third metal plate and a fourth metal plate arranged on the first side of the substrate and the second side of the substrate, respectively, beyond the aperture in the direction of extension.7. The SIW ...

LAUNCH STRUCTURES FOR A HERMETICALLY SEALED CAVITY

An apparatus includes a substrate containing a cavity and a dielectric structure covering at least a portion of the cavity. The cavity is hermetically sealed. The apparatus also may include a launch structure formed on the dielectric structure and outside the hermetically sealed cavity. The launch structure is configured to cause radio frequency (RF) energy flowing in a first direction to enter the hermetically sealed cavity through the dielectric structure in a direction orthogonal to the first direction. 1. An apparatus , comprising:a substrate containing a cavity;a dielectric structure covering at least a portion of the cavity, wherein the cavity is hermetically sealed; anda launch structure formed on the dielectric structure and outside the hermetically sealed cavity, wherein the launch structure is configured to cause radio frequency (RF) energy flowing in a first direction to enter the hermetically sealed cavity through the dielectric structure in a direction orthogonal to the first direction.2. The apparatus of claim 1 , wherein:the launch structure comprises a rectangular waveguide and a first inductive current loop conductive element;the apparatus further includes a second inductive current loop conductive element in a layer between the dielectric structure and the substrate; andthe first and second inductive current loop conductive elements are aligned so that a current in the first inductive current loop conductive element induces a current in the second inductive current loop conductive element.3. The apparatus of claim 2 , wherein the rectangular waveguide is a WR5 waveguide.4. The apparatus of claim 1 , wherein the transmission line comprises a coplanar waveguide claim 1 , and wherein the apparatus further includes a metal layer between the dielectric and the substrate claim 1 , the metal layer including an iris through which the RF energy enters into the cavity from the transmission line.5. The apparatus of claim 4 , wherein the iris comprises a ...

Broadband Waveguide Launch Designs on Single Layer PCB

The present application discloses embodiments that relate to an electromagnetic apparatus. In one aspect, the present apparatus includes a circuit board configured to propagate an electromagnetic signal, a waveguide configured to propagate an electromagnetic signal, and a coupling port configured to couple the electromagnetic signal between the circuit board and the waveguide. The apparatus further includes a radiating structure disposed on the circuit board. The radiating structure includes an electric field coupling component configured to an electric field between the circuit board and the coupling port and a magnetic field coupling component configured to couple a magnetic field between the circuit board and the coupling port.

Feed Network

A feed network includes three radio frequency (RF) devices constructed in a suspended-substrate stripline configuration that provides a five-port microwave device having a sum port and four feed ports. The three RF devices include at least one coupled-line quadrature hybrid and at least one Marchand balun. Each of the at least one coupled-line quadrature hybrid has only a single transmission line section providing two outputs with approximately equal amplitude power and a phase difference of 90°. Each of the at least one Marchand balun includes two offset-coupled transmission line sections separated by a gap and two outputs on opposite sides of the gap. The two outputs have approximately equal amplitude power and a phase difference of 180°. The three RF devices are electrically arranged relative to the sum port and the four feed ports such that the feed ports have equal amplitude power and a progressive 90° phase shift.

PRECISION WAVEGUIDE INTERFACE

A waveguide interface comprising a support block configured to support a printed circuit board assembly. An interface is coupled to an end portion of the support block and extends from the support block. The interface includes a slot positioned to receive at least a portion of the printed circuit board assembly and one or more holes positioned to receive attachment devices to secure the interface to a waveguide component. The support block and interface are molded as a monolithic device. A method of forming the waveguide interface, a waveguide assembly including the waveguide interface, and a method of making the waveguide assembly including the waveguide interface are also disclosed. 1. A waveguide interface comprising:a monolithic molded device comprising a support block configured to support a printed circuit board assembly and an interface coupled to an end portion of the support block and extending from the support block, the interface having a slot positioned to receive at least a portion of the printed circuit board assembly and one or more holes positioned to receive attachment devices to secure the interface to a waveguide flange.2. The waveguide interface of claim 1 , wherein the support block and the interface are formed from a moldable metal alloy.3. The waveguide interface of claim 1 , wherein the support block and interface comprise a plurality of draft angles along one or more surfaces of the support block and the interface to allow for removal from a mold.4. A waveguide assembly comprising:a monolithic molded waveguide interface comprising a support block having a printed circuit board assembly affixed thereto and an interface coupled to an end portion of the support block and extending from the support block, the interface having a slot positioned to receive at least a portion of the printed circuit board assembly and one or more holes positioned to receive attachment devices to secure the interface to a waveguide flange;a launch transducer ...

MICROWAVE ANTENNA APPARATUS, PACKING AND MANUFACTURING METHOD

A microwave antenna apparatus comprises a semiconductor element and an antenna element embedded into a mold layer, which is covered by a redistribution layer. The antenna element is preferably configured as SMD component so that it can be handled by a standard pick and place process. The coupling between semiconductor element and antenna element is provided either by a metal layer or aperture coupling within the redistribution layer. The microwave antenna apparatus may be coupled to a PCB arrangement thus forming an embedded wafer-level ball grid array (eWLB) or embedded micro-wafer-level-packaging (emWLP) package. 2. Microwave antenna apparatus as claimed in claim 1 ,wherein the antenna element is configured as an SMD component.3. Microwave antenna apparatus as claimed in claim 1 ,wherein the antenna substrate layer is made of a microwave material, or of a BT, FR4 or FR408 type substrate material, or of ceramics, or of Rogers substrate material, of PTFE, or of a mold type material.4. Microwave antenna apparatus as claimed in claim 1 ,wherein multiple antenna elements are arranged within the mold layer, in particular around the semiconductor element.5. Microwave antenna apparatus as claimed in claim 1 ,wherein the antenna element comprises one or more antenna feed lines arranged on a first surface of the antenna substrate layer opposite the second surface and the radiating element arranged on the second surface of the antenna substrate layer, wherein the antenna element is arranged within the mold layer such that an outer surface of the antenna feed lines is not covered by mold material, andwherein the redistribution layer is arranged on the surface of the mold layer such that the metal layer is in contact with the outer surfaces of one or more antenna feed lines.6. Microwave antenna apparatus as claimed in claim 5 ,wherein the antenna element comprises one or more connection lines connecting one or more antenna feed lines with the radiating element through the ...

POWER COUPLERS AND RELATED DEVICES HAVING ANTENNA ELEMENT POWER ABSORBERS

A power coupler includes an input port, first and second output ports and an antenna element that is electrically coupled between the first output port and the second output port or that is electrically coupled to an isolation port of the power coupler. The power coupler is configured to split a radio frequency signal incident at the input port and/or to combine radio signals incident at the respective first and second output ports. 1. A power coupler , comprising:an input port;a first output port;a second output port;an antenna element that is electrically coupled between the first output port and the second output port or that is electrically coupled to an isolation port of the power coupler;wherein the power coupler is configured to split a radio frequency (“RF”) signal incident at the input port and/or to combine radio signals incident at the respective first and second output ports.2. The power coupler of claim 1 , wherein the antenna element comprises a patch radiating element.3. The power coupler of claim 1 , wherein the power coupler comprises a four port power coupler that includes the isolation port claim 1 , and wherein the antenna element is electrically coupled to the isolation port.4. The power coupler of claim 1 , wherein the power coupler comprises a three port power coupler claim 1 , and wherein the antenna element is electrically coupled between the first output port and the second output port.5. The power coupler of claim 1 , wherein the power coupler is implemented in a printed circuit board that includes a dielectric substrate claim 1 , a conductive ground plane on a first surface of the dielectric substrate and a conductive pattern on a second surface of the dielectric substrate that is opposite the first surface.6. The power coupler of claim 5 , wherein at least a portion of the power coupler is implemented as a substrate integrated waveguide power coupler that includes an array of plated through holes that connect the conductive ground plane ...

MARCHAND BALUN STRUCTURE AND DESIGN METHOD

Aspects of the invention provide for a Marchand balun structure and a related design method. In one embodiment, a marchand balun structure includes: a first trace for an unbalanced port on a first metal layer, the first trace comprising: an unbalanced line including a first width for a first half and a second width for a second half, wherein the second width can be different from the first width; a pair of traces for balanced ports on a second metal layer, the pair of traces comprising: a pair of balanced lines; and a ground plane on a third metal layer, the ground plane comprising: a pair of openings directly under the pair of traces for balanced ports, wherein a center of the unbalanced line of the first trace is offset from a center of the pair of balanced lines of the pair of traces. 1. A Marchand balun structure comprising: 'an unbalanced line including a first width for a first half and a second width for a second half, wherein the second width is different from the first width;', 'a first trace for an unbalanced port on a first metal layer, the first trace comprising 'a pair of balanced lines; and', 'a pair of traces for balanced ports on a second metal layer, the pair of traces comprising 'a pair of openings directly under the pair of traces for balanced ports,', 'a ground plane on a third metal layer, the ground plane comprisingwherein a center of the unbalanced line of the first trace is offset from a center of the pair of balanced lines of the pair of traces.2. The Marchand balun structure of claim 1 , further comprising a floating ground pad in each opening in the ground plane.3. The Marchand balun structure of claim 2 , wherein the offset begins at a point above a first floating ground pad and the offset ends at a point above a second floating ground pad.4. The Marchand balun structure of claim 1 , wherein a first portion of the unbalanced line is not offset from a first portion of a first balanced line of the pair of traces.5. The Marchand balun ...

BALUN FOR CONVERTING BETWEEN MULTIPLE DIFFERENTIAL SIGNAL PAIRS AND A SINGLE-ENDED SIGNAL

A balun includes a first transmission line and a number (N) of second transmission lines. The first transmission line includes an end terminal for receiving or outputting a signal with a target wavelength, and having a length of half the target wavelength. Each of the second transmission lines is disposed adjacent to and spaced apart from the first transmission line so as to establish electromagnetic coupling therebetween, and includes first and second end terminals for cooperatively outputting or receiving a differential signal pair with the target wavelength. 1. A balun comprising:a first transmission line including an end terminal for receiving or outputting a signal with a target wavelength, and having a length of half the target wavelength; anda number (N) of second transmission lines, each of which is disposed adjacent to and spaced apart from said first transmission line so as to establish electromagnetic coupling therebetween, each of which includes a first end terminal and a second end terminal for cooperatively outputting or receiving a differential signal pair with the target wavelength, and a grounded central terminal, and each of which has a first length that is between said first end terminal and said central terminal thereof and that equals a quarter of the target wavelength, and a second length that is between said second end terminal and said central terminal thereof and that equals a quarter of the target wavelength, where N is an integer greater than or equal to two,wherein each of said second transmission lines has a width 1/N times that of said first transmission line.2. The balun of claim 1 , wherein said first and second transmission lines straightly extend in the same longitudinal direction thereof and are parallel to each other.3. The balun of claim 2 , wherein said first end terminal of each of said second transmission lines is aligned with said end terminal of said first transmission line.4. The balun of claim 1 , wherein N=2 claim 1 , ...

Coaxial microstrip line conversion circuit

A coaxial microstrip line conversion circuit includes: a waveguide including first and second through holes, spaced apart from each other, the second through hole having a dimension to cut off a used frequency; a coaxial connector including a central conductor including a projection projecting from an axial end of an outer conductor; and a microstrip line including a ground conductor provided on one surface of an insulating substrate, and a strip line provided on the other surface of the insulating substrate and including a projection projecting axially from the ground conductor. The outer conductor is connected to an outer wall of the waveguide. The projection of the central conductor is inserted through the first through hole into the waveguide, the ground conductor is connected to an inner wall of the second through hole, and the projection of the strip line is inserted through the second through hole into the waveguide.

STRUCTURES AND METHODS FOR INTERCONNECTS AND ASSOCIATED ALIGNMENT AND ASSEMBLY MECHANISMS FOR AND BETWEEN CHIPS, COMPONENTS, AND 3D SYSTEMS

Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems. 1. A microstructure , comprising:a first microstructural element having a plurality of fused layers of a material, each layer parallel to an upper surface of the first microstructural element, the first microstructural element having a first mating edge;a second microstructural element having a plurality of fused layers of a material, each layer parallel to an upper surface of the second microstructural element, the second microstructural element having a second mating edge, the second mating edge disposed adjacent the first mating edge; anda jumper having a plurality of fused layers of a material, the jumper disposed at the upper surfaces of the first and second microstructural elements at a location spanning the first and second mating edges and attached to each of the first and second microstructural elements to join the first and second microstructural elements to one another.2. The microstructure according to claim 1 , wherein the first microstructural element includes an alignment feature and the jumper includes a corresponding alignment feature for mating with the alignment feature of the first microstructural element.3. The microstructure according to claim 2 , wherein the alignment feature of one or more of the first microstructural element comprises a plurality of the fused layers.4. The microstructure according to claim 2 , wherein the alignment feature of one or more of the first microstructural element and jumper comprises a pin.5. The microstructure according to claim 2 , wherein the alignment features of one or more of the first microstructural element and jumper comprises a tapered pin.6. The microstructure according to claim 5 , wherein the taper includes a portion in a selected layer that is wider in the plane of the layer than a taper portion disposed in a layer adjacent the selected layer.7. The ...

TEST PROBE ASSEMBLY FOR HIGH FREQUENCY DEVICE CHARACTERIZATION

A test probe assembly includes a mounting fixture, a co-planar waveguide lead frame having a device contact point, where the co-planar waveguide lead frame is mounted to the mounting fixture, and at least one radio frequency (RF) connector assembly electrically coupled with the co-planar waveguide lead frame. 1. A test probe assembly comprising:a mounting fixture;at least one co-planar waveguide lead frame having a device contact point, the co-planar waveguide lead frame mounted to the mounting fixture; andat least one radio frequency (RF) connector assembly electrically coupled with the co-planar waveguide lead frame.2. The test probe assembly as recited in claim 1 , wherein the at least one co-planar waveguide lead frame has a metal layer and a substrate layer.3. The test probe assembly as recited in claim 2 , wherein the metal layer has a signal lead surrounded on two sides by a ground.4. The test probe assembly as recited in claim 1 , wherein a gap and signal width are defined to match impedance of test equipment.5. The test probe assembly as recited in claim 4 , wherein the gap and the signal width are defined to match impedance of a device under test (DUT).6. The test probe assembly as recited in claim 1 , wherein the at least one co-planar waveguide lead frame is a single ground-signal-ground co-planar waveguide lead frame.7. The test probe assembly as recited in claim 1 , wherein the at least one co-planar waveguide lead frame is at least one of a single ground-signal-signal-ground co-planar waveguide lead frame claim 1 , a single ground-signal-ground-signal-ground co-planar waveguide lead frame claim 1 , or a single ground-signal-ground-signal-ground-signal-ground co-planar waveguide lead frame.8. The test probe assembly as recited in claim 1 , wherein the co-planar waveguide lead frame is a single ended to differential balun.9. The test probe assembly as recited in claim 1 , wherein the at least one co-planar waveguide lead frame includes multiple co- ...

HETEROGENEOUS INTEGRATED CIRCUIT FOR SHORT WAVELENGTHS

A heterogeneous semiconductor structure, including a first integrated circuit and a second integrated circuit, the second integrated circuit being a photonic integrated circuit. The heterogeneous semiconductor structure may be fabricated by bonding a multi-layer source die, in a flip-chip manner, to the first integrated circuit, removing the substrate of the source die, and fabricating one or more components on the source die, using etch and/or deposition processes, to form the second integrated circuit. The second integrated circuit may include components fabricated from cubic phase gallium nitride compounds, and configured to operate at wavelengths shorter than 450 nm. 1. A method for fabricating a heterogeneous semiconductor structure , the method comprising:bonding a source die to a target wafer through a bonding layer, the source die comprising a GaAs substrate and a first plurality of layers on the GaAs substrate, the bonding comprising bonding the source die to the target wafer with the first plurality of layers facing the target wafer, each of the first plurality of layers comprising cubic phase gallium nitride compounds as a major component; andremoving the GaAs substrate.2. The method of claim 1 , wherein the target wafer comprises one or more vias and one or more patterned metal layers.3. The method of claim 1 , wherein the first plurality of layers has an overall thickness of less than 2 microns.4. The method of claim 1 , wherein the first plurality of layers comprises an active device top layer and a photonic waveguide layer claim 1 , andwherein the method further comprises etching the active device top layer to form a first portion of an active device.5. The method of claim 4 , further comprising: a passive waveguide; and', 'a second portion of the active device, the second portion having a contact pad surface; and, 'patterning and etching the photonic waveguide layer to formforming a metal contact pad on the contact pad surface.6. The method of claim ...

Waveguide coupler

An apparatus is provided. In the apparatus, there is an antenna package and an integrated circuit (IC). A circuit trace assembly is secured to the IC. A coupler (with an antenna assembly and a high impedance surface (HIS)) is secured to the circuit trace assembly. An antenna assembly has a window region, a conductive region that substantially surrounds the window region, a circular patch antenna that is in communication with the IC, and an elliptical patch antenna that is located within the window region, that is extends over at least a portion of the circular patch antenna, and that is in communication with the circular patch antenna. The HIS substantially surrounds the antenna assembly.

Connecting Unit For Radio-Frequency Devices

A connecting unit for radio-frequency components has: a housing; a first interface and a second interface which are arranged on the housing and are designed to be coupled to in each case one radio-frequency component; an internal conductor which runs in the housing and is connected to the first interface and the second interface in order to establish a radio-frequency connection between the first interface and the second interface; a spacer which surrounds the internal conductor and extends at least along a portion of the length of the internal conductor. The housing is manufactured from an electrically conductive and rigid material and the spacer is arranged such that the internal conductor is at a distance from the housing at least in sections. 1. A connecting unit for radio-frequency components , comprising:a housing;a first interface and a second interface arranged on the housing and configured to be coupled to in each case one radio-frequency component;an internal conductor running in the housing and connected to the first interface and the second interface in order to establish a radio-frequency connection between the first interface and the second interface; anda spacer surrounding the internal conductor and extending at least along a portion of the length of the internal conductor,wherein the housing is manufactured from an electrically conductive and rigid material, andwherein the spacer is arranged such that the internal conductor is at a distance from the housing at least in sections.2. The connecting unit according to claim 1 ,wherein the housing comprises two half-shells connected to one another along a joint, andwherein the housing is at least partially composed of aluminum.3. The connecting unit according to claim 1 ,wherein the internal conductor is composed of an electrically conductive material, andwherein the electrically conductive material contains at least one of the following materials or a combination of the said materials: aluminum, brass, ...

PLANAR BALUN TRANSFORMER DEVICE

An electric transformer device (balun) is formed on a support plate having a first base face and an opposite second base face. The balun includes a first port () connectable to an electrical line for a differential signal and a second port connectable to an electrical line for a single-ended signal. A first printed conductive track is associated to the first base face of the support plate for connecting the first port to the second port. A printed conductive path is associated to the second base face of the support plate for connecting the first port to the second port. The printed conductive path is formed of a symmetric second and third printed conductive tracks. 1. A method for manufacturing an electric transformer device to adapt an electrical line for differential signal to an electrical line for single-ended signal , comprising:securing a first metal sheet on a first base face of a support plate;securing a second metal sheet on a second base face of the support plate opposite said first base face;forming a first port connectable to the electrical line for the differential signal;forming a second port connectable to the electrical line for the single-ended signal;patterning the first metal sheet to define a first conductive track that electrically connects said first port to said second port; a second conductive track that electrically connects said first port to said second port; and', 'a third conductive track that electrically connects said first port to said second port; and, 'patterning the second metal sheet to defineforming a via at said first port to electrically connect an end of the first conductive track to an end of the second conductive track.2. The method according to claim 1 , wherein said first claim 1 , second and third conductive tracks are metal tracks made of copper.3. The method according to claim 1 , wherein patterning the first and second metal sheets comprises performing a selective chemical removal operation of a metal material of the ...

Printed-circuit board having antennas and electromagnetic-tunnel-embedded architecture and manufacturing method thereof

Disclosed is a printed circuit board (PCB) structure, in which an electromagnetic signal transmitting antenna and/or an electromagnetic signal receiving antenna, and an electromagnetic signal transferring tunnel (EM-tunnel) are embedded, the PCB structure including a PCB, an EM-tunnel that includes a dielectric core and a metal clad that surrounds the dielectric core and that is embedded in the PCB to be parallel to the PCB, and at least one transmitting antenna and/or at least one receiving antenna that are embedded in the PCB, wherein the transmitting antenna and/or the receiving antenna are arranged at an input port and an output port of the EM-tunnel embedded in the PCB to transmit and receive electromagnetic signals to and from the interior of the EM-tunnel.

SYSTEM AND METHOD FOR LAUNCHING SCATTERING ELECTROMAGNETIC WAVES

In accordance with one or more embodiments, a system includes a transceiver configured to generate an electromagnetic signal conveying first data. A coupler is configured to generate, responsive to the electromagnetic signal, an electromagnetic wave along a surface of a transmission medium, wherein the electromagnetic wave is within a non-optical frequency band, wherein the electromagnetic wave propagates via a cylindrical scattering wave mode along the surface of the transmission medium without requiring an electrical return path. 1. A system , comprising:a transceiver configured to generate a first electromagnetic signal conveying first data; anda coupler configured to generate, responsive to the first electromagnetic signal, a first electromagnetic wave along a surface of a transmission medium, wherein the first electromagnetic wave is within a non-optical frequency band, wherein the first electromagnetic wave propagates via a wave mode, having a superluminal phase velocity, along the surface of the transmission medium without requiring an electrical return path.2. The system of claim 1 , wherein the transmission medium is a medium voltage power line.3. The system of claim 1 , wherein the coupler generates the wave mode along the transmission medium by generating an incident electromagnetic wave.4. The system of claim 3 , wherein the incident electromagnetic wave is a cylindrical wave.5. The system of claim 4 , wherein the cylindrical wave azimuthally surrounds the transmission medium.6. The system of claim 3 , wherein the transmission medium is a wire and the surface of the transmission medium reflects the incident electromagnetic wave to form a reflected electromagnetic wave.7. The system of claim 6 , wherein the reflected electromagnetic wave is a cylindrical wave.8. The system of claim 3 , wherein the incident electromagnetic wave has a phase propagation constant in a direction of propagation along the transmission medium that is less than a ratio of a radian ...

HIGH FREQUENCY LINE CONNECTION STRUCTURE

A high-frequency line connection structure for connecting a coaxial line and a planar line includes a conductive second adhesion layer that is formed along edges of a pair of first conductive thin films of the planar line. Furthermore, end portions of the pair of first conductive thin films and an end portion of a second conductive thin film that is adjacent to the coaxial line are disposed to coincide with a position of an inner wall of a columnar penetrating hole formed in an outer conductor. 15.-. (canceled)6. A high-frequency line connection structure for connecting a coaxial line and a planar line , comprising: an outer conductor comprising a penetrating hole housing the inner conductor, the penetrating hole having a columnar shape, wherein the leading end portion of the inner conductor extends in the axial direction from an end surface of the outer conductor; and', 'an insulation layer disposed in the penetrating hole between the inner conductor and the outer conductor;, 'a first conductive adhesion layer covering a leading end portion of an inner conductor of the coaxial line and an end of a signal line included in the planar line, wherein the inner conductor extends in an axial direction and has a circular cross section around an axis, the cross-section being perpendicular to the axial direction, wherein the coaxial line further comprises a dielectric substrate;', 'a signal line on a surface of the dielectric substrate;', 'the pair of first conductive thin films on the surface of the dielectric substrate and adjacent to the coaxial line, the pair of first conductive thin films being formed on opposing sides of the signal line across a predetermined distance; and', 'a second conductive thin film that covers a back surface of the dielectric substrate, the second conductive thin film being electrically connected to the pair of first conductive thin films, wherein when seen along the axial direction, end portions of the pair of first conductive thin films ...

LTCC WIDE STOPBAND FILTERING BALUN BASED ON DISCRIMINATING COUPLING

The invention discloses a LTCC wide stopband filtering balun based on discriminating coupling. The filtering balun includes a dielectric, and a first resonator, a second resonator, a first feeding line, a second feeding line, a third feeding line and a metal ground which are arranged inside the dielectric. The two resonators are both half-wavelength resonators distributed on different layers, and the layers are connected through metal through holes. the first feeding line is coupled with a specific area of the first resonator for performing feeding to suppress a second harmonic, and the second feeding line and the third feeding line are coupled with a specific area of the second resonator for performing feeding to suppress a third harmonic, thus realizing a wide stopband filtering performance. The second feeding line and the third feeding line are symmetrically arranged about a center of the second resonator, thus realizing a same-amplitude reverse-phase balun output characteristic. The LTCC wide stopband filtering balun based on discriminating coupling according to the invention can suppress the second harmonic and the third harmonic, and a LTCC multi-layer circuit technology used reduces a size of a filtering balun. 1. A LTCC wide stopband filtering balun based on discriminating coupling , comprising a dielectric , and a resonator , a feeding line and a metal ground which are arranged inside the dielectric , wherein the resonator comprises a resonator tail end , a feeding coupling area and a resonator mutual-coupling area which are sequentially arranged from top to bottom along an inside of the dielectric , the resonator tail end is connected to the feeding coupling area through a metal via hole , the feeding coupling area is connected to the resonator mutual-coupling area through the metal via hole , the feeding line is arranged between the resonator tail end and the feeding coupling area , the metal ground comprises a first metal ground arranged at a top of the ...

WAVEGUIDE DEVICE MODULE AND MICROWAVE MODULE

A waveguide device module includes a waveguide device including a conductor with an electrically conductive surface, a waveguide extending alongside the electrically conductive surface and including an electrically-conductive waveguide surface, and a first artificial magnetic conductor extending on both sides of the waveguide, a coupler including a first surface having a groove, a second surface opposite to the first surface, and a through hole extending from the first surface through to the second surface. The groove is connected at one end to the through hole and defined by first and second metal side surfaces opposing each other and a metal bottom surface connecting between the first and second metal side surfaces. A second artificial magnetic conductor at least opposes the groove. The first and second metal side surfaces, and the metal bottom surface define a ½ rectangular hollow-waveguide. The ½ rectangular hollow-waveguide and the waveguide device are connected via the through hole. 1. A waveguide device module , comprising:a waveguide device including an electrical conductor including an electrically conductive surface, a waveguide extending alongside the electrically conductive surface and including an electrically-conductive waveguide surface, and a first artificial magnetic conductor extending on both sides of the waveguide;a coupler including a first surface including a groove, a second surface opposite to the first surface, and a through hole extending from the first surface through to the second surface, the groove being connected at one end to the through hole and defined by a first metal side surface and a second metal side surface opposing each other and a metal bottom surface connecting between the first metal side surface and the second metal side surface; anda second artificial magnetic conductor at least opposing the groove; whereinthe first metal side surface, the second metal side surface, and the metal bottom surface define a ½ rectangular ...

Feeding Device

A feeding device is disclosed. The feeding device includes a body and at least one first port, the body includes at least one first contour port, and each of the at least one first contour port corresponds to one of the at least one first port; and the first contour port includes at least two sub-ports, and the at least two sub-ports of the first contour port are connected, by using at least one power splitter, to the first port corresponding to the first contour port. In the foregoing implementation solution, the first contour port is divided into several sub-ports, and the first port and the several sub-ports are connected by using the at least one power splitter.

APPARATUS AND METHOD FOR LAUNCHING ELECTROMAGNETIC WAVES

Aspects of the subject disclosure may include, for example, a system for receiving a communication signal, generating an electromagnetic wave from the communication signal, and inducing the electromagnetic wave on a portion of a transmission medium having an insulation layer with a tapered end covering at least part of a conductor. Other embodiments are disclosed. 1. A method , comprising:receiving, by a waveguide system including a waveguide structure, a first guided electromagnetic wave; andgenerating, by the waveguide system, a first communication signal according to the first guided electromagnetic wave;wherein the first guided electromagnetic wave propagates along an outer surface of an insulation layer, wherein the insulation layer has a tapered end, wherein a portion of the insulation layer has a substantially uniform outer diameter, wherein the portion of the insulation layer is within the waveguide structure, wherein the tapered end is outside of the waveguide structure, wherein the insulation layer covers a first portion of a conductor, and wherein the insulation layer enables a first radial dimension of a field of the first guided electromagnetic wave to decrease as the first guided electromagnetic wave propagates longitudinally along the tapered end towards the waveguide structure.2. The method of claim 1 , wherein the waveguide structure has a conical structure.3. The method of claim 1 , wherein the waveguide structure has a cylindrical structure.4. The method of claim 1 , wherein the first radial dimension of the field of the first guided electromagnetic wave is less than or equal to a second radial dimension of an opening of the waveguide structure when the first guided electromagnetic wave is located within the opening claim 1 , and wherein the waveguide system comprises a receiver for facilitating the receiving of the first guided electromagnetic wave from the outer surface of the insulation layer.5. The method of claim 1 , wherein the first guided ...

POWER COMBINER

A power combiner includes a first substrate provided with a first microstrip line, a second substrate provided with a second microstrip line, and a hollow waveguide having a metal film on an inner wall of a hollow and coupled to the first microstrip line and the second microstrip line, the hollow waveguide combining a first electric power transmitted through the first microstrip line and a second electric power transmitted through the second microstrip line and transmitting a combined electric power. 1. A power combiner comprising:a first substrate provided with a first microstrip line;a second substrate provided with a second microstrip line; anda hollow waveguide having a metal film on an inner wall of a hollow and coupled to the first microstrip line and the second microstrip line, the hollow waveguide combining a first electric power transmitted through the first microstrip line and a second electric power transmitted through the second microstrip line and transmitting a combined electric power.2. The power combiner according to claim 1 , wherein the hollow waveguide is formed of openings of substrates including the first substrate and the second substrate that are stacked.3. The power combiner according to claim 1 , wherein the first substrate and the second substrate are stacked so that the first microstrip line and the second microstrip line overlap in a stack direction.4. The power combiner according to claim 1 ,wherein the first substrate and the second substrate are stacked,wherein the first microstrip line is provided on an opposite face of the first substrate from the second substrate,wherein the second microstrip line is provided on an opposite face of the second substrate from the first substrate.5. The power combiner according to claim 4 , further comprising:a third substrate that is interposed between the first substrate and the second substrate, has a first metal film on a face closer to the first substrate, and has a second metal film on a face ...

TRANSMISSION-LINE CONVERSION STRUCTURE FOR MILLIMETER-WAVE BAND

To provide a transmission-line conversion structure for a millimeter-wave band capable of being easily manufactured with a small size without easily causing non-uniformity in characteristics in a wide band. A transmission-line conversion structure for a millimeter-wave band that connects a microstrip line (), which includes a main conductor () formed on one surface of a dielectric substrate () and a ground conductor () formed on the other surface thereof, with a waveguide () has a waveguide structure in which a transmission line () having a predetermined length is formed so as to be surrounded by metal walls (). The transmission line is filled with a dielectric material having a relative permittivity of greater than 1. The transmission-line conversion structure allows electronic waves of a millimeter-wave band in a longitudinal direction of the main conductor. 1. A transmission-line conversion structure for a millimeter-wave band that connects a microstrip line , which includes a main conductor formed on one surface of a dielectric substrate and a ground conductor formed on the other surface thereof and allows electromagnetic waves of a millimeter-wave band to propagate in a longitudinal direction of the main conductor , with a waveguide which allows the electromagnetic waves of the millimeter-wave band to propagate ,wherein the transmission-line conversion structure has a waveguide structure in which a transmission line having a predetermined length is formed so as to be surrounded by metal walls, the transmission line is filled with a dielectric material having a relative permittivity of greater than 1, one end surface of the transmission line is bonded to an end surface of the dielectric substrate of the microstrip line, and the other end surface of the transmission line is bonded to an aperture of the waveguide, andwherein the dielectric material filling the transmission line includes a plurality M of dielectric layers having different relative permittivities, ...

Hollow-waveguide-to-planar-waveguide transition circuit

A hollow-waveguide-to-planar-waveguide transition circuit includes: a dielectric substrate; strip conductors formed on a first main surface of the dielectric substrate; a ground conductor formed on a second main surface of the dielectric substrate, facing the strip conductors in the thickness direction; a slot formed in the ground conductor; a coupling conductor formed at a position to be electrically coupled with the strip conductors on the first main surface; and branch conductor lines formed on the first main surface. Each of the branch conductor lines includes a base portion branching from the coupling conductor and a tip portion that is electrically open.