Package structure and method of manufacturing the same.

Package structure and method of manufacturing the same

Номер патента: US20210035936A1
Опубликовано: 04-02-2021
Автор(ы): Hung-Hsin Hsu, Nan-Chun Lin, Shang-Yu Chang Chien
Принадлежит: Powertech Technology Inc
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Рисунок 1. Взаимосвязь патентов (ближайшие 20).

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Номер патента: US20200153083A1. Автор: Liu Chung-Shi,Yu Chen-Hua,Shih Chao-Wen,Chang Shou-Zen,Hsiao Min-Chien. Владелец: Taiwan Semiconductor Manufacturing Co., Ltd.. Дата публикации: 2020-05-14.

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