Integrated Circuit Devices Including Interconnections Insulated by Air Gaps and Methods of Fabricating the Same.

Integrated Circuit Devices Including Interconnections Insulated by Air Gaps and Methods of Fabricating the Same

Номер патента: US20140342548A1
Опубликовано: 20-11-2014
Автор(ы): BACK Hyunchul, KIM JEEYONG, LEE Hyunmin, LEE Jung-Hwan
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