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Package structure and method of fabricating the same

Номер патента: US12080681B2
Опубликовано: 03-09-2024
Автор(ы): Shang-Yun Hou, Sung-Hui Huang, Wen-Wei Shen
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Anisotropic conductive adhesives for thermo-compression bonding containing solder conductive particles and flux additives and method of connecting electronic parts using the same

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Catalyst for synthesizing dimethylether or methylacetate from synthetic gas, method for preparing the same, and method for preparing dimethylether or methylacetate using the same

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Indium precursor compound, method of preparing thin film using the same, and board prepared using the same

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Mobile Robot and Method of Localization and Mapping of the Same

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Dry castable concrete compositions and methods of preparing and dry casting the same

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Systems and methods for allowing multiple devices to share the same serial lines

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Flexible nail strip and method of and apparatus for manufacturing the same

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Metal-ligand complex, catalyst composition for preparing ethylene-based polymer containing the same, and preparation method of ethylene-based polymer using the same

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