17-09-2015 дата публикации
Номер: US20150263005A1
Принадлежит:
A dynamic random access memory (DRAM) and a production method, a semiconductor packaging component and a packaging method. The production method of the DRAM comprises: providing a memory wafer, the memory wafer being provided with a memory bare chip, and the memory bare chip being provided with a top metal layer, the top metal layer being provided with a power source bonding pad, a signal bonding pad, and a micro bonding pad, and an internal bus led out of the memory bare chip being electrically connected to the micro bonding pad; repairing the memory wafer; if a yield of the memory wafer is greater than or equal to a preset threshold, rearranging the micro bonding pad to form a butt joint bonding pad, the butt joint bonding pad being electrically connected to the micro bonding pad and the power source bonding pad. The semiconductor packaging method comprises: providing a first wafer of the DRAM; providing a second wafer having a logic chip; realizing wafer level packaging of the first wafer and the second wafer through electrical connection of adaptive butt joint bonding pads. A structure of the DRAM is not significantly changed, a data bandwidth of the DRAM is increased, and meanwhile, a high yield is ensured. 1. A method for forming a dynamic random access memory (DRAM) , comprising:providing a memory wafer, where memory dies are formed on the memory wafer, a top metal layer is formed on the memory dies, power source pads, signal pads and micro pads are formed on the top metal layer, and an internal bus is led out from the memory dies to be electrically connected with the micro pads;repairing the memory wafer;after the repair, if a yield of the memory wafer is greater than or equal to a predetermined threshold, redistributing the micro pads to form bonding pads which are electrically connected with the micro pads and the power source pads.2. (canceled)3. The method according to claim 1 , wherein the memory dies comprise a plurality sets of internal buses claim 1 ...
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