PROCEDURE FOR THE PRODUCTION OF A SPLICING TAPE FROM A DISK-SHAPED SEMICONDUCTOR SUBSTRATE ON FLEXIBLE ADHÄSIVEN A TRANSPORTATION CARRIER AS WELL AS MECHANISM TO THE EXECUTION OF THIS PROCEDURE

The invention concerns a procedure for the production of a splicing tape of a disk-shaped semiconductor substrate on a flexible adhäsiven transportation carrier or for the change of the semiconductor substrate of a transportation carrier on a further transportation carrier as well as a mechanism for the execution of this procedure. To the treatment and/or for the temporary storage of a wafer, thus a disk-shaped substrate and/or semiconductor material, in particular with the production ultradünner wafer (thicknesses < 50 I J), are applied these on transportation carriers. The treatment of the wafer can be for example a sharpening procedure, a Dünnung, cleaning, an electrical test or also division into individual parts, like chips. Like that it is well-known to provide the wafer on a side with a reciprocally sticking foil or directly with an adhesive layer and these with the foil or with the adhesive layer on a further disk, the so-called carrier disk to apply. This pile can be transported then to the thin procedure of the wafer. Since with the thin one the back of the wafer must be released, the carrier disk must be mounted onto the active side of the wafer. In order to be able to test the gedünnten wafer however electrically and/or dividing the wafer into individual parts such as chips would drive through to be able, must a Ummontage take place, with which a further carrier disk is installed onto the wafer back. In addition after the thin procedure on the worked on side of the wafer a further foil and/or a further adhesive layer and a further carrier disk are then applied. The first disk and/or foil and this pile is removed is transported for example to a tester and/or to dividing the wafer to the sawing machine. Such sandwich structure are well-known for example also from the EP 979,852 a2. Foils are used, which the different forces of the tensions in the wafer and/or in the later chip and in the transportation carriers, for example in the used feed plates, to take up and/or absorb. It is also a procedure and mechanisms well-known for applying the foil from the EP 881,663 a2. With this procedure it is unfavorable that the complex structure of the mechanism causes many individual process steps, which are very time intensive. Unfavorably it is further that the contact pressure is not produced over a pressing role, which very often leads with ultradünnen Wafern to wafer breaks on the other hand an education of small cavities absolutely avoidable is. A curved convex carrier, a so-called Chuck, well-known, is over electrostatic forces the wafer deformed also from the DE 197 37 825 A1. Further a curved carrier is well-known from the JP 60-226124 A, with which over a vaccum pump the wafer is quasi sucked in. Likewise 4,603,466 A a curved convex Chuckfläche are well-known from US, which deforms the wafer with gas and/or vacuum then according to its surface. Finally 5,131,968 A a Chuck are well-known from US, which deforms a wafer with pressure convex to another even wafer. Furthermore is also from the JP 1-135439 A and the JP 1-321655 A warping the wafer, in order to reach a sticking at a foil, well-known. With all the well-known mechanisms pointed out above it is unfavorable that the wafer, in particular the ultradünne, extremely break-sensitive and usually also brittle wafer, is deformed to a gluing. Thus it can very often come to wafer breaks. Furthermore it is well-known from US 5,950,613 A, a wafer, which is fastened on a cut document already to fix on a supporting plate by vacuum. Further 5,273,615 A equipment are well-known from US, which was designed for cleaning Wafern, in addition, for fastening Wafern on documents. Unfavorably at this procedure it is however that the edition surface must be flat implemented, since otherwise no constant contact pressure distribution is possible over the wafer surface. By the flat execution of the Auflagenoberfiäche however cavities are inevitable. Finally needleless outdoing single feeder chip of a wafer foil is still well-known in the Bonder from the JP 2-137 352 A. During the needleless outdoing process the replacement of the foil is supported by the chip which can be outdone by local sucking in of the foil. Task of the invention is it to create a procedure of the kind initially specified that on the one hand the disadvantages quoted above avoids and that on the other hand, beside a rational, also RK 411,856 B a qualitatively high-standing manufacturing permitted. The task is solved by the invention. The procedure according to invention is characterized by that during the production of the splicing tape and/or with a change of the transportation carriers the semiconductor substrate taking up flexible adhäsive transportation carriers at least over a part of the surface of the semiconductor substrate by the structure of Luftbzw. Gas pressure is convex bent. With the invention it is for the first time possible, rationally and a high quality ensuring for wafer with a thickness of approximately 50 to wafer, in particular ultradünne wafer, thus over and among them, to install onto a transportation carrier and/or reassemble from a transportation carrier on another transportation carrier. With this process step according to invention, i.e., it is ensured to the deformation of the transportation carrier that the assembly is nonporously accomplished. This is in view to the further use and/or for the Sicherstellung of the claim of quality of great importance. A deformation of the transportation carrier in the order of magnitude of approximately 20 can be sufficient pm - for 50 pm. In accordance with an arrangement of the invention a disk, in particular a silicon wafer, provided with a glue layer, becomes preferably with a thickness of 200 as transportation carriers - 800 IJm, uses. Such disks provided with an adhesive layer are very gladly used, since these disks can be manufactured according to standard with very small thickness tolerance and therefore high plan parallelism, which are necessary with the sharpening procedure for example. Further by these disks it is guaranteed that during a temporary storage in a magazine no dip of the wafer is given. After a further arrangement of the invention than transportation carrier a windowpane and/or a quartz disk provided with a thin adhesive layer becomes, preferably with a thickness of 0,5 - 0.8 mm, uses. Also such disks provided with a thin adhesive layer are available according to standard for the semiconductor manufacturing and ensure that the dip is alike in the magazine to zero. Furthermore quartz disks exhibit the advantage that in use of UV adhesives or with UV adhesive of coated foils the adhesive force can be reduced by UV exposure, with which the transportation carrier is relatively easily removable. In accordance with another arrangement of the invention than flexible adhäsiver transportation carrier a plastic disk is used. Also this material, used as transportation carriers, makes its contribution for the Sicherstellung of a qualitatively high-standing manufacturing. After a further arrangement of the invention than flexible adhäsiver transportation carrier a foil, in particular a bilateral adhesive film, is used. Such foils are used for example as protective plastic films for the contacts applied on the wafer with the sharpening procedure. The arrangement of such foils comes thus favourable-proves the Qualitätsanforde3s against rungen. In accordance with a further training of the invention as flexible adhäsiver transportation carrier a foil, which is stretched on a foil frame side member, is used. Such transportation carriers are for example used, if the wafer is transported to the sawing machine. After a special characteristic of the procedure according to invention the deflection and/or deformation of the transportation carrier takes place via the structure from different pressures to both sides of the transportation carrier. It participates from advantage that the pressure can be applied defined, whereby the deformation can be accomplished exactly after the before assignable parameters. In accordance with a further characteristic of the invention the pressure is developed from the center to the boundary regions of the transportation carrier. This is possible in particular if the foil in a foil frame side member is arranged and the pressure works evenly over the foil. With this kind of printing creation thus a balloon-like deformation of the transportation carrier can be achieved. If the second transportation carrier is advanced according to one tangential level, preferably also with a centric contact, to the wafer, then a nonporous assembly is ensured. After a further favourable arrangement of the invention the pressure on a side of the transportation carrier is developed by production of a Unteroder Uberdruckes on the other side. According to the given basic conditions the printing creation for a rational manufacturing can be selected. In accordance with a further arrangement of the invention the delivery takes place from a TransportlO carrier on the further transportation carrier via the deflection according to a revolution movement of the substrate. Naturally this revolution movement can be steered via an appropriate printing creation. After another arrangement of the invention the delivery takes place from a transportation carrier on the further transportation carrier via the deflection according to a folding movement of the substrate effected. As shown already above also the folding movement can be steered via an appropriate printing creation. In accordance with a further characteristic of the procedure according to invention the deflection of the transportation carrier takes place convex. Thus a very simple nonporous gluing is ensured. The task of the available invention is solved also by a mechanism for the execution of the procedure. The mechanism according to invention for the execution of the procedure initially specified is characterized by that two relatively one on the other too movable, with one, are intended if necessary even or curved, surface as bearing surface for the transportation carrier or also for the wafer provided editions, whereby at least one edition with Überoder is subjectable negative pressure. With this mechanism according to invention it is for the first time possible to accomplish a qualitatively high-standing and also extremely rational manufacturing beyond that. Such editions, in which technical language also Chucks are mentioned, as previously mentioned, with a if necessary even or curved surface as bearing surface for the transportation carrier or also for the wafer provide. As a further training of the invention it is also conceivable that the edition independently and/or. separately, parallel to the direction of motion led and across feathers/springs is linked up. During a unification of the two editions by moving the drive axles on for this movement a compression is reached to each other by overcoming of the spring action, whereby a controlled attitude of the contact pressure can be achieved. In accordance with a special characteristic of the invention the application of pressure is made at least one edition by a centric inlet. In addition at least one bearing surface can exhibit a drilling, over air is injected or sucked off. Now if the transportation carrier and/or the wafer is positioned on this bearing surface, then it can be deformed a firm disk or a foil, over an appropriate controlling of the air supply the transportation carriers clamped at its edges, is. In the case of an exhaust of air the transportation carrier is sucked in on the bearing surface. In accordance with a special characteristic of the invention the surface is formed and/or curved at least one edition defined. The curvature can be thereby for example cylindrical or sphericalally implemented. Thus the deformation can be selected freely. An exactly defined delivery can be achieved thereby. After a further special arrangement of the invention at least one edition is tiltable. Thus it can be achieved that Abrollbzw. Folding movement by defined swivelling of the editions is managed. Also with a such execution the delivery the quality goal can be accomplished accordingly. After a special characteristic of the invention this is characterized by that, a pressure tight container build upable from two pot-like container parts is intended and that inside at least one container part a höhenverstellbare edition is intended. The pressure ratios, which affect the transportation carrier, can be selected by the arrangement of a pressure tight container according to the procedure default freely. The deformation of the transportation carrier is thus at any time before definable. Joining the appropriate parts can be controlled by the höhenverstellbaren editions, thus for example when assembling the wafer with a transportation carrier exactly. In accordance with a further training of the invention the interior of the closed container with Überoder negative pressure is subjectable. In view to a nonporous assembly it can be favourable to produce inside the container a negative pressure. In accordance with a further special characteristic of the invention are in the division level of the container a substrate, in particular a foil or an adhesive film, preferably, led a bilateral adhesive film. A such foil is used for example as protective plastic film for the wafer already provided with contacts, or serves as sticking medium for the assembly an RK 411,856 B RST wafer on a carrier disk, or serves as transparency for the sawing process. After a further training of the invention each container part for itself is subjectable with Überoder negative pressure with inserted foil. By the possibility of the defined printing regulation, both in the container and over the edition a nonporous production process is attainable. The invention is described on the basis of remark examples, which are represented in the design, more near. Show: Fig. 1 a schematic representation of a mechanism for installing a wafer on a transportation carrier, Fig. 2 a schematic representation of a mechanism for reassembling a wafer of a transportation carrier on another transportation carrier Fig. 3 and 4 further remark examples of the mechanism and/or the procedure Fig. 5 a diagonal view of a mechanism for the assembly and/or for reassembling a wafer and a Fig. 6 a sectional view in accordance with the mechanism the Fig. By way of introduction it is noted that in the descriptive remark example same parts are provided with same reference symbols and/or same construction unit designations, whereby the revealing contained in the entire description will transfer in a general manner to same parts with same reference symbols and/or same construction unit designations can. Also the position data selected in the description are as e.g. above, down, laterally etc. to the directly described as represented figures related and are during a position change in a general manner to the new situation to be transferred. In accordance with the Fig. 1 is schematically pointed a mechanism to installing a wafer 1 onto a transportation carrier 2, in the represented case a foil 3, which can be a bilateral adhesive film if necessary. The wafer 1 rests upon an edition 4, whereby this edition 4 exhibits an even bearing surface. Furthermore this mechanism exhibits a further edition 5, the one to the first edition 4 defines formed surface 6, i.e. a kugelkalottenhafte, raised bearing surface possesses. The two editions 4, 5 are relatively one on the other too movable, whereby for this represented execution both editions are höhenverstellbar 4, 5, as this is suggested by the arrows 7. Between these two editions 4, 5 as transportation carrier 2 the foil 3 is led, whereby this foil 3 can be a continuous foil and in the starting situation is evenly strained. The wafer 1 is located on the even bearing surface of the edition 4. The edition 5 with its easily curved surface 6 is induced to the foil 3, whereby the foil 3 of the surface 6 adapts. Now the wafer 1 is induced by means of the edition 4 to the deformed foil 3. In the first moment the contact of the wafer surface with the foil 3, during appropriate arrangement of the wafer 1 and appropriate training of the surface 6 of the edition 5 will centrically take place. In the next step if the two editions 4, 5 are then moved synchronously into the starting position of the edition 5 and if the flexible foil 3 in this position is maintained, the foil 3 puts evenly, from the center of the wafer 1 to the boundary regions, on the wafer surface. Naturally also the surface could be trained 6 of the edition 5 according to a roller, whereby the first contact is linienförmig. With the synchronous movement of the two editions 4, 5 into the starting position of the edition 5 again an even gluing of the transportation carrier 2 on the wafer surface would take place. By this procedure it is ensured that the assembly of the wafer 1 on the foil 3 is nonporously accomplished. As previously mentioned, is this in view to the further use and/or for the Sicherstellung of the claim of quality of great importance became. A deformation of the foil 3 can be sufficient for 50 by the raised surface 6 of the edition 5 in the order of magnitude of approximately 20 pm - pm. In accordance with the Fig. a mechanism is shown out to 2 for reassembling a wafer 1 foil 3 trained of a transportation carrier 2 in this case of a foil 8, which on a foil frame side member 9 is stretched, on another transportation carrier 2, i.e. on one than one-sided adhesive film. During this mechanism the two to each other movable editions 4, 5 are intended, whereby both edition surfaces of the editions 4, 5 are evenly implemented. For a such execution of the mechanism it is insignificant whether only one edition 4, 5 or both are höhenverstellbar. It is important that they can be moved to each other. At least one of the editions 4, 5 - in the represented case the edition 4 - exhibits besides a centric inlet 10, over air to be supplied or if necessary sucked off can. On the foil 8 arranged, preferably glued on, wafer 1 on the bearing surface of the edition 4 is positioned, whereby the foil frame side member 9 is fixed at the boundary regions of the edition 4. By bringing in air over the inlet 10 under the foil 8 a pressure is developed and the foil 8 with the wafer 1 toward the foil 3 is balloon-like easily deformed. The höhenverstellbare edition 5 is advanced to the foil 3 and brought to the contact with the wafer 1. The first contact takes place again punctiformly, centrically the wafer surface. In the case of a moving of the edition 5 on toward the edition 4 an even, nonporous creation of the foil 3 takes place on the wafer surface. The further the edition 5 with the foil 3 to the wafer surface and thus the creation of the foil 3 on the wafer 1 would drive near can by simultaneous throttling of the air supply over the inlet 10 be naturally supported. During an execution of the mechanism, with which both editions 4, 5 with an inlet 10 for air are equipped, a different pressure can be produced for both sides of the wafer 1 and/or the transportation carrier 2. Also by a such difference of pressure the small deformations of the transportation carrier 2, which are necessary for the processing process, can be forced. The difference of pressure can be developed by production of a negative pressure on a side and a positive pressure on the other side. Naturally it lies also in the range of the invention, if the wafer 1 with its transportation carrier 2 evenly an edition 4, 5 rests upon and the foil 3 is balloon-like deformed by air supply. Furthermore it is also conceivable, the bearing surface of the editions 4, 5 with a air-permeable, preferably porous, to provide layer and exclusively not to supply the air supply thereby central. Likewise it is also conceivable that over the central air supply 10 and/or over the porous layer air is sucked off. The transportation carrier 2 can be positioned if necessary on the bearing surface of the editions 4, 5 or be sucked in by sucking air off also to convex training of the bearing surface, whereby likewise a deformation of the transportation carrier 2 enters. Also a such procedure way can ensure a nonporous assembly or Ummontage. Furthermore it lies also in the range of the invention that as transportation carrier 2 a disk, in particular a silicon wafer, preferably with a thickness of 200 - 800 IJm, is used or a Glasoder plastic disk and/or a quartz disk, preferably with a thickness of 0,5 - 0.8 mm. In accordance with the Fig. 3 is those relative to one on the other movable editions 4, 5 in a container 13 build upable from two pot-like container parts 11, 12 intended, whereby both the Behätterteile is 11, 12 and the editions 4, 5, preferably independent, elevatormoderately adjustable. Both editions 4, 5 exhibit exhaust the inlet for the central air supply or -. Beyond that each container part is 11, 12 with a connection 24 for an air supply or - exhaust provide. With a guidance of the continuous foil 3 in the division level of the container 13, this can be made naturally pressure tight and be subjected for each container part 11, 12 for itself with Überoder negative pressure. The pressing procedure of the foil 3 to the wafer 1 can be supported thus further, if the two container parts of 11, 12 are used as pressure chambers. Hiebei is used the lower container part 12 as lower pressure chamber, in which also the wafer 1 is and evacuates, whereby the available pressure gradient causes a pressing of the foil 3 to the wafer 1. In another variant also the upper container part 11 than upper pressure chamber can be used, in which a positive pressure is stopped. Importantly and crucially is here the pressure gradient. In a further variant of the procedure, which is suitable also for applying a bilateral adhesive film, the wafer 1 is put the even edition 4 and held if necessary with negative pressure and/or vacuum over the inlet 10. Uber the wafer 1 becomes the foil 3 strained, which is first still in a larger distance to the wafer 1, which can be achieved by lowering the edition 4. Now the container parts of 11, 12 to pressure chambers 6 RKs 411,856 B are closed. Depending upon work mode either the lower pressure chamber is evacuated, or the upper pressure chamber with pressure subjects, so that itself pressure gradient adjusts from top to bottom. This pressure gradient becomes baggy the foil 3 spherically - in the design schematically strichliert represented - downward out, whereby the extent of the bulge can be stopped over the height of the s of pressure gradient. If one moves now the edition 4 with the wafer 1 upward, then sometime the durchgebeulte foil 3 affects the wafer 1 from the center outgoing to the edge. It is also conceivable that the edition 4 is positioned in a certain height, at which a punctiform contact with the foil 3 takes place, or the contact straight does not take place yet. Also the bulge of the foil 3 is continued to increase by an enlargement of the pressure gradient lo, so that the foil matches the contour 3 ever more from the center outgoing to the edge, of the wafer 1. The advantage of this method is in that it is possible for a variety at process parameter combinations with which more clearance for the process optimization is present. It pay attention that with this procedure also a bilateral adhesive film can be used, since the upper edition 5 is not used there these rather far above, in a StandbyPosition, is positioned. In the Fig. 4 a further execution of the procedure is pointed out. With this variant of the procedure a wafer 1 by means of bilateral adhesive film 3 can be installed on a firm carrier. In addition - design-moderately this step is jumped over - the firm transportation carrier 2, for example a disk, is put on the even edition 4. Then the likewise even edition 5 toward edition 4 is moved downward, until a contact with the transportation carrier 2 takes place. By creation of a negative pressure over the inlet 10 at the upper edition 5 the transportation carrier 2 to the edition 5 is sucked in, so that with a movement of the edition 5 into the upper final position of the transportation carriers 2 one carries forward. Now the wafer 1 is put on the edition 4. Additionally still another framework 25 without foil, for example a foil frame side member 9, is inserted, the contact with the boundary region of the edition 4 has. Into the division level of the receiver 13 now a foil 3, i.e. a bilateral adhesive film, is drawn. This condition is in Fig. 4 represented. With latches of the container 13 the foil has 3 neither contact with the wafer 1 nor with the transportation carrier 2. now becomes by creation of negative pressure and/or vacuum in the lower container part of 12, or by creation of pressure in the upper container part of 11 a pressure gradient from top to bottom produces, whereby the foil 3 through-becomes baggy itself downward. By the upward motion of the edition 4 a punctiform contact of the foil 3 with the wafer 1 finally takes place, whereby by a further upward motion of the edition 4 or increase of the pressure gradient pressing the foil 3 to the wafer 1 can be achieved and at the framework 25. After now the wafer and the framework 25 sticking contact with the foil 3 have 1, the pressure gradient is turned around. The foil 3 tries to through-become baggy upward, however from the place, in which the splicing tape with the wafer 1 takes place, from the bulge is prevented, whereby however a small remainder bulge of the wafer is given to 1. This deformation, which within ranges from 20 IJm - 50 IJm to be already sufficient knows, is used, in order to thus achieve a punctiform first contact of the foil 3 with the transportation carrier 2, with the disk, by the edition 5 with the sucked in transportation carrier 2 towards the foil 3 one moves. Pressing the foil 3 to the transportation carrier 2 takes place in similar way. Exactly in the phase the printing reversal, thus at the time where in both container parts 11, 12 equal pressure with the external pressure, is it prevails also conceivable that the two-piece container 13 is opened, and the edition 4 is changed. An edition 4 with a curved surface is used. The following bulge of the foil 3 with the wafer 1 upward can be supported now defined by the surface of the edition 4, in which the edition 4 is moved upward. At the same time by creation of a negative pressure and/or a vacuum the wafer 1 is sucked in to the edition 4 curved now. s0 of the frameworks 25 and/or foil frame side member 9 is not necessarily necessary here, has however the advantage that the finished thing can be taken more easily out of the device, and for example into an external device for cutting can be put, in which the foil 3 is concisely cut off. Naturally it is also conceivable that the roles of wafer 1 and transportation carrier 2 are exchanged that thus the transportation carrier 2 on the lower edition 4, and the wafer 1 ren themselves on obelO edition 5 find. In the Fig. 5 is the mechanism for the execution more near above of the procedure describing in diagonal view and in the Fig. 6 shown in a sectional view. Relatively to each other the movable editions 4, 5 are intended in a container 13 build upable from two pot-like container parts 11, 12. The container parts of 11, 12 are integrated in a machine rack 14 and can be separately elevatormoderately adjusted via the columns 15. At a side of the machine rack 14 the supply role of 16 intended for a transportation carrier 2, for example for a bilateral adhesive film, is. At the supply role of 16 opposite side of the machine rack 14, thus subordinate the mechanism for the assembly and/or. for reassembling a wafer 1, which is arranged in the container 13, a placing surface or a table 17, for example intended for a cutter for the continuous foil, is. Between the supply role of 16 and the container 13 still guiding roles 18 for the continuous foil are installed. Each edition 4, 5 is arranged and over a vertical adjustment, consisting of for example spindles 19 or such a thing, is moved in her assigned the container part of 11 and/or 12. The adjustment of the spindles 19 is made by disks 20 arranged outside, which are propelable over one - not represented - common belt drive and a stepping motor 21. Likewise outside the connections 22 for the central air supply are and/or - exhaust for the inlet 10 intended. In order to be able to observe the processing process also from the outside, sights 23 in the container parts 11, 12 are arranged. In order refined or is to regulate to be able, each container part of 11, 12 with a connection 24 for an air supply continues to steer the processing process of the wafer 1 in accordance with the stated procedure or - exhaust provide. With a guidance of the continuous foil in the division level of the container 13, this can be made naturally pressure tight and be subjected for each container part 11, 12 for itself with Überoder negative pressure. During a further training of the available plant it is quite possible to plan according to the processing process, replaceable bearing surfaces for the editions 4, 5. Further it is possible, the editions 4 to implement 5 tiltable. The delivery could take place from a transportation carrier 2 on the further transportation carrier 2 via a folding movement or also a revolution movement of the substrate. As it mentions already several times is by this procedure and this mechanism ensures that the assembly and/or Ummontage of the wafer 1 is nonporously accomplished on the transportation carrier 2. Finally it is pointed out that in the remark examples described before individual parts are unproportional increased and/or schematically represented, in order to improve the understanding of the solution according to invention. The moreover one also individual parts of the characteristic combination of the remark example in connection with other single characteristics, described before, can form independent, solutions according to invention.