SILICA SOL COMPOSITION WITH EXCELLENT DISPERSIBILITY FOR CYANATE-BASED RESIN AND MANUFACTURING METHOD THEREOF
The present invention refers to (cyanate resin) resin is represented by s-cyano for the to silica sol composition and manufacturing method is provided to, and hard water stability of an anionic dispersion number when aggregation is performed by adding silica and cationic dispersion for reforming the surface, hydrophobic resin for the to silica sol composition and relates to manufacturing method. Integrated circuit (integrated circuit) has curved substrates is generally easy to memo advertisement sheet for a thin is carried out by using an acidulous. On a metal substrate, and composite dielectric which the transferred material is many such as according to be used in the, coefficient of thermal expansion of the mold each materials (CTE: coefficient of thermal expansion) of values placed on a based on variations in. Such bending an electronic assembly (electric assembly) to a piece of pressure result in the problem is to generate. Such bending to prevent raveling and underfill (underfill) composition filler silica low coefficient of thermal expansion (CTE) is used. Substrate for lowering the CTE the upper part large amount of silica, silica for circuit generally residual surface silica additive metal coordination playing, by etching are removed and then (silanol), resin (epoxy silane) silane epoxy curing possible and improve thermal stability is used is subjected to surface treatment by means, through surface modification silica silica filler surface metal coordination playing, quality of circuit board then removed from the objective compound.. Silicas is performed using an ion surface modification-epoxide underfill composition compounding resin and if there is the specific improves wettability on substrate. Underfill of the composition before, varnish combination full mixed solution (varnish) has silica filler (polar) organic solvent polarity (hydrophobicity) hydrophobic water insoluble chemical additives present after extension of compounding resin by mixing it with prepare. Compounding resin a variety of resin, pigment (pigment), curing number is included. Varnish used in fabricating silica pillar (cyanate resin) cyanate resin into a resin to thereby obtain polarity (polarity) based on variations in compatible is large causes problems is determined to, surface treatment of silica filler metal coordination residual a are not uniform or first conductive layer shield is playing, , silica surface processing as epoxy groups with cyano, has low when polycarbonate resin is compatible (compatibility), a mixed solution of the composition before varnish viscosity of increased significantly at and lowering the efficiency of the process, stable product to production line operation causes problems to. Such of the existing method invention in, opening patent 10-2009-0090324 Korean, Japanese registration patent 4276423 device is metal coordination surface of silica filler for circuit through shielding playing, silica pillar, whereby the shock applied to pressure cooker is provided to but, metal coordination residual surface of the existing method of silica filler technique playing, shield is sufficiently support part and, viscosity of the composition dramatically increased objects' traces to remaining problems are still undealt. The present invention refers to, said such as to solve the problem that the of the prior art, Surface treatment of silica filler metal coordination residual pillar a are not uniform or shielding playing, , silica surface processing as epoxy groups (compatibility) compatible bonding strength between polycarbonate with cyano, has low when, underfill of the composition before, full mixed solution (varnish) varnish combination process increased dramatically viscosity of not lowering the efficiency of high-on at least one of the upper, ultra-uniform silicides car surface modification as well as the, resin compatible with for circuit be higher than the peripheral portion silica sol composition and manufacturing method in for providing. To achieve the aim of said, The present invention refers to silica, anionic dispersion number, cationic dispersion number, epoxy silane coupling number and an organic solvent compositions for the silica sol including. Furthermore, the present invention refers to (a) anionic organic solvent layer is placed on the when aggregation is performed by adding dispersion silica dispersion having a the stages of formation of the ; (b) said anionic dispersion fibers have silica dispersions the epoxy silane coupling injection process is improved so that silica surface which modifies the step; and (c) said surface modified silica dispersions to cationic dispersing agent including the method involves adding surface modified silica sol composition provides manufacturing method. Furthermore, the present invention refers to (a ') anionic organic solvent layer is placed on the number and cationic dispersion dispersion when aggregation is performed by adding silica dispersion having a the stages of formation of the; and (b') said anionic dispersion fibers have silica dispersions the epoxy silane coupling injection process is improved so that silica surface which modifies the step including surface modified silica sol composition provides manufacturing method. Furthermore, phosphoric acid, and cyano the present invention refers to said silica sol composition including resin compositions for the varnish. Silica sol composition of the present invention in which the surface is reformed according to manufacturing method, Anionic dispersion number and cationic dispersing agent using uniform of silica particles may be surface modification as well as, epoxy groups underfill pillar silica of which surface is modified by compatible with compounding resin composition can be effectively increasing the unit is off. Also Figure 1 shows a coarse of manufacturing method of the present invention surface-modified silica sol composition is indicative of the picture. According to of the present invention embodiment also Figure 2 shows a surface modification of the silica manufacturing forward measuring the IR-ft is a chart of. Hereinafter, to cyanate resin of the present invention for the silica sol composition and on the manufacturing method. Silica sol of the present invention respect to he cyanate composition efficacy as an anti-superior dispersibility, to this end, silica, anionic dispersion number, cationic dispersion number, epoxy silane coupling number. and an organic solvent. In particular, said polarity filler silica dispersants anion (polar) organic solvent to compatibility to improve the particles are dispersed in the height, said cationic compatible with cyanate resin dispersants to improve the present invention included. Silica sol composition of the present invention, said silica SiO2 mixture by the addition of an initiator, generally and without restriction, special type to be used in where a new file does not exist, use can be made of,. Said silica powder in the form, in this case inner portion and a property of siloxane bonds is silicon atom and oxygen atoms and into two wavelengths through the optical (Si-O-Si), has a plurality of surface OH groups. A silica sol of the present invention said size silica compositions, without aggregating the silica powder form when under a standard of tyrosine kinase suppression 1 an average diameter is 5 nm to 10 µm can be employed, preferably 10 nm to 5um can be employed, more preferably 100 nm to 1um can be employed. Silica 1 is 5 nm if less than an average diameter of the primary particles in the, by suction between particles which are not easily the uniform dispersion, if the flow is greater than the 10 µm, height a transparent material final circuit is ., there is the problem that. Silica sol composition of the present invention, said silica based on a total content composition to 50 to 90 weight %, preferably 60 to 80 body is included to the display apparatus weight %. Said silica content material circuit if less than 50 weight % (CTE) coefficient of thermal expansion of high a circuit printed circuit board formed of rigid a transparent integrated circuit phenomenon occurs to height and an auxiliary electrode, 90 weight % if the load gradient exceeds the first underfill composition compounding resin a low content of a silica filler (filler), and a mixed uniform compounding resin and a circuit board is difficult to (flexibity) with respect to properties such as elasticity waist band of. problem. Silica sol composition of the present invention, said anionic dispersants phosphoric acid, sulfuric acid or carboxylic acids and such acidic functionality (acid functional group), axial flow fan is improved to prevent or salt thereof are restrictions cannot special ramyon, preferably acidic functional groups low phosphate or phosphate phosphoric acid, use can be made of, a. Said anionic dispersant in specific embodiments, a dispersant anionic possessing phosphate BYK-W903, BYK-W9010, BYK 110, such as group BYK 180 at least one can be a silica in a, sulfate anionic possessing a dispersant such as group DO113L-EU EU-DO113 or at least one can be a silica in a, carboxylic acid possessing a dispersant anionic TEGO 757W, TEGO 755W, TEGO 610 such as at least one group, use can be made of, is. Silica sol composition of the present invention, said anionic dispersants based on a total content composition 0.01 to 5 weight %, preferably 0.1 to 2 weight % it is preferred that a at a low temperature of. Said anionic dispersant content less than 0.01 weight % the homogeneous dispersion of silica filler in organic solvent high resolution is difficult, to achieve the uniform surface modification and simply the, 5 weight % of the composition underfill if the load gradient exceeds the first temperature change and circuit material thermal properties to that act as an impurity (impurity). problem. Silica sol composition of the present invention, said cationic dispersants having basic functional groups to special are restrictions cannot, preferably basic it is a salt or ammonium amine functional groups may be used in to, a specific example, BYK 161, BYK 163, BYK 2152, BYK 2155, BYK 112, BYK 9132 and BYK 2008 are selected from the group consisting of is least one, use can be made of,. Silica sol composition of the present invention, said cationic dispersants based on a total content composition 0.01 to 5 weight %, preferably 0.1 to 2 weight % it is preferred that a at a low temperature of. Said cationic dispersant content if less than 0.01 weight % (resin) compounding resin underfill composition compatible with cyanate resin in vertically, varnish viscosity of increased and the process efficiency and is prevented from releasing with symmetrical force, 5 weight % of the composition underfill if the load gradient exceeds the first temperature change and circuit material thermal properties to that act as an impurity (impurity). problem. Silica sol composition of the present invention, said epoxy silane the coupling agent includes epoxy groups the silane coupling number cannot are restrictions special ramyon, preferably 3-( [...]) profile) trimethoxysilane, vinyltriethoxysilane on the profile ([...]) 3-, 2-(3, 4-epoxy aminocyclohexyl) ethyl trimethoxysilane, 2-(3, 4-epoxy aminocyclohexyl) ethyl triethoxysilane and epoxy [...] trimethoxysilane the group consisting of at least one, use can be made of,. Silica sol composition of the present invention, said epoxy silane coupling in a composition based on a total content 0.05 to 5 weight %, preferably 0.1 to 3 weight % it is preferred that a at a low temperature of. Said epoxy silane coupling agent content sufficient if less than 0.05 weight % silica surface modification fuel flowing out by passing through an silica surface a quantity of a residual metal coordination playing, and, leaving the (silanol group), silica, which has not been employed in organic solvated by pillar, whereby the shock applied to compatible layer and, 5 weight % after modifying silica surface if the load gradient exceeds the first remaining in solvent by the silane coupling agent, silica same at the time of hardening the underfill composition introduced filler, curing temperature variations or of separated from a target in the end product. problem. Silica sol composition of the present invention, said organic solvent having non-proton polar (aprotic polar) with an organic solvent or an said organic solvent having non-proton polar (aprotic polar) organic solvent to quantization polar (protic polar) organic mixture of an aprotic solvent, use can be made of, solvent. At this time, aprotic solvent mixing said mixture solvent weight 10 contrast the entire polar organic solvent is preferably not less % hereinafter. Silica sol composition of the present invention, non-proton polar (aprotic polar) organic solvent having said non-proton polar extension of to special limitation cannot, preferably DMF, MEK, MIBK and THF are selected from the group consisting of least one, use can be made of,. Silica sol composition of the present invention, said (protic polar) organic solvent having polar quantization extension of polar quantization to special limitation cannot, preferably MeOH, EtOH, IPA Butanol and are selected from the group consisting of least one, use can be made of,. Silica sol composition silica sol composition of the present invention, since the reverse link has a higher such a composition as said, 1 to 100 MPa *s, preferably 10 to 50 MPa *s, more preferably 10 to 30 MPa * s low viscosities 2000. The present invention refers to, said such as silica sol composition, (A) anionic organic solvent layer is placed on the when aggregation is performed by adding dispersion silica dispersion having a the stages of formation of the ; (b) said anionic dispersion fibers have silica dispersions the epoxy silane coupling injection process is improved so that silica surface which modifies the step; and (c) said surface modified silica dispersions to cationic dispersing agent including the method involves adding surface modified silica sol composition provides manufacturing method. Said surface modified silica sol composition showed to coarse also degree of manufacturing method 1. First, the manufacturing method of the present invention surface modified silica sol composition layer is placed on the step (a) anionic organic solvent when aggregation is performed by adding dispersion to prepare silica dispersion. The manufacturing method of the present invention surface modified silica sol composition, using anionic dispersing agent, organic solvent layer is placed on the dispersibility of silica particles in upper surface homogeneous dispersion state outputs a relay driving signal. is able to derive a. Through variation of the first and the second state, epoxy silane step (b) refers to when input coupling agent, more uniform surface modification is enabled. After this, the manufacturing method of the present invention surface modified silica sol composition in step (b) said anionic dispersion fibers have silica dispersions the epoxy silane coupling injection process is improved so that silica surface that is reduced or interrupted until the. The manufacturing method of the present invention surface modified silica sol composition, using anionic dispersing agent, organic solvent layer is placed on the dispersion of silica particles in the second metal layer is thicker silica dispersion, epoxy silane coupling injection process is improved so that silica surface silanol groups of sol-gel (sol-gel) silane coupling agent dispersed throughout the reaction uniform of silica particles is enabled surface modification. After this, the manufacturing method of the present invention surface modified silica sol composition in step (c) said surface modified silica dispersions to cationic dispersing agent are doped. This epoxy silane coupling agent in step (b) of which surface is modified by epoxy groups by silica dispersions to, cyanate resin compatible with dispersion cationic be higher than the peripheral portion when aggregation is performed by adding, as a result resin dispersion as well as signal to the ECU, low viscosity of the composition (underfill) underfill metal mixture, Ni-containing alloy before, full mixed solution (varnish) varnish combination signal or a noise low viscosities, enters one end of the optical dispersion stability result supplies a liquid to the plate is enabled. Furthermore, the present invention refers to, said such as silica sol composition, (A ') anionic organic solvent layer is placed on the number and cationic dispersion dispersion when aggregation is performed by adding silica dispersion having a the stages of formation of the; and (b') said anionic dispersion fibers have silica dispersions the epoxy silane coupling injection process is improved so that silica surface which modifies the step including surface modified silica sol composition provides manufacturing method. Said anionic dispersing agent cationic such as adding a simultaneously dispersant, also manufacturing method, a wise added to separating manufacturing method corresponding to a silica surface modification efficiency and can take the compatible resin. First, the manufacturing method of the present invention surface modified silica sol composition (a')organic solvent layer is placed on the step anionic dispersion number and cationic dispersion when aggregation is performed by adding silica dispersions to prepare. The manufacturing method of the present invention surface modified silica sol composition, anionic dispersing agent wherein an organic solvent the second metal layer is thicker dispersion of silica particles is able to derive a state the particles are dispersed in the outputs a relay driving signal.. The uniform dispersion solution through, refers to (b')when input coupling agent epoxy silane step, more uniform surface modification is enabled. Furthermore, said anionic dispersant together, since the addition of cationic dispersing agent, resin compatible be higher than the peripheral portion cationic dispersion when aggregation is performed by adding, as a result underfill composition in cyanate resin combination of silica filler dispersion stability to the titanium dioxide particle as well as improved, low viscosity of the composition (underfill) underfill metal mixture, Ni-containing alloy before, full mixed solution (varnish) varnish combination and retain a low viscosity of, as a result of silica filler improved dispersion stability to the titanium dioxide particle supplies a liquid to the plate is enabled. After this, the manufacturing method of the present invention surface modified silica sol composition (b')anionic dispersion fibers have said step silica dispersions the epoxy silane coupling injection process is improved so that silica surface that is reduced or interrupted until the. The manufacturing method of the present invention surface modified silica sol composition, anionic dispersion number and cationic dispersion a silica dispersions to, epoxy silane coupling injection process is improved so that silica surface silanol groups of sol-gel (sol-gel) silane coupling agent dispersed throughout the reaction uniform of silica particles is enabled surface modification. Said 2 in manufacturing method of, silica, which is used, anionic dispersion number, cationic dispersion number, epoxy silane coupling number and organic solvent having all have the same may be used in, specifically content as follows. Specifically, surface modified silica sol composition of the present invention in manufacturing method, said mixture by the addition of an initiator SiO2 silica, special and without restriction, type to be used in industry generally, use can be made of,. Said silica powder in the form, in this case inner portion and a property of siloxane bonds is silicon atom and oxygen atoms and into two wavelengths through the optical (Si-O-Si), has a plurality of surface OH groups. Surface modified silica sol composition of the present invention in manufacturing method, an average diameter of the primary particles in the 1 said silica is 5 nm to 10 µm it is preferred that a. Silica 1 is 5 nm if less than an average diameter of the primary particles in the, by suction between particles which are not easily the uniform dispersion, if the flow is greater than the 10 µm, height a transparent material final circuit is ., there is the problem that. Surface modified silica sol composition of the present invention in manufacturing method, said silica based on a total content composition to 50 to 90 weight %, preferably 60 to 80 body is included to the display apparatus weight %. Said silica content material circuit if less than 50 weight % (CTE) coefficient of thermal expansion of high a circuit printed circuit board formed of rigid a transparent integrated circuit phenomenon occurs to height and an auxiliary electrode, 90 weight % if the load gradient exceeds the first underfill composition compounding resin a low content of a silica filler (filler), and a mixed uniform compounding resin and a circuit board is difficult to (flexibity) with respect to properties such as elasticity waist band of. problem. Surface modified silica sol composition of the present invention in manufacturing method, said anionic dispersants phosphoric acid, sulfuric acid or carboxylic acids and such acidic functionality (acid functional group), axial flow fan is improved to prevent or salt thereof are restrictions cannot special ramyon, preferably acidic functional groups low phosphate or phosphate phosphoric acid, use can be made of, a. Said anionic dispersant in specific embodiments, a dispersant anionic possessing phosphate BYK-W903, BYK-W9010, BYK 110, such as group BYK 180 at least one can be a silica in a, sulfate anionic possessing a dispersant such as group D0113L-EU EU-D0113 or at least one can be a silica in a, carboxylic acid possessing a dispersant anionic TEGO 757W, TEGO 755W, TEGO 610 such as at least one group, use can be made of, is. Surface modified silica sol composition of the present invention in manufacturing method, said anionic dispersants based on a total content composition 0.01 to 5 weight %, preferably 0.1 to 2 weight % it is preferred that a at a low temperature of. Said anionic dispersant content less than 0.01 weight % the homogeneous dispersion of silica filler in organic solvent high resolution is difficult, to achieve the uniform surface modification and simply the, 5 weight % of the composition underfill if the load gradient exceeds the first temperature change and circuit material thermal properties to that act as an impurity (impurity). problem. Surface modified silica sol composition of the present invention in manufacturing method, said cationic dispersants having basic functional groups to special are restrictions cannot, preferably a silica bond functionality amine or ammonium it is a salt may be used in to, a specific example, BYK 161, BYK 163, BYK 2152, BYK 2155, BYK 112, BYK 9132 and BYK 2008 are selected from the group consisting of is least one, use can be made of,. Surface modified silica sol composition of the present invention in manufacturing method, said cationic dispersants based on a total content composition 0.01 to 5 weight %, preferably 0.1 to 2 weight % it is preferred that a at a low temperature of. Said cationic dispersant content underfill if less than 0.01 weight % (resin) cyanate resin composition compatible and a vertically, of the composition before, full mixed solution (varnish) varnish combination process increased and the viscosity of lowering the efficiency of a high-and an auxiliary electrode, 5% weight of the composition underfill if the load gradient exceeds the first temperature change and circuit material thermal properties to that act as an impurity (impurity). problem. Surface modified silica sol composition of the present invention in manufacturing method, said epoxy silane the coupling agent includes epoxy groups the silane coupling number cannot are restrictions special ramyon, preferably 3-( [...]) profile) trimethoxysilane, vinyltriethoxysilane on the profile ([...]) 3-, 2-(3, 4-epoxy aminocyclohexyl) ethyl trimethoxysilane, 2-(3, 4-epoxy aminocyclohexyl) ethyl triethoxysilane and epoxy [...] trimethoxysilane the group consisting of at least one, use can be made of,. Surface modified silica sol composition of the present invention in manufacturing method, said epoxy silane coupling in a composition based on a total content 0.05 to 5 weight %, preferably 0.1 to 3 weight % it is preferred that a at a low temperature of. Said epoxy silane coupling agent content sufficient if less than 0.05 weight % silica surface modification fuel flowing out by passing through an silica surface a quantity of a residual metal coordination playing, and, leaving the (silanol group), silica, which has not been employed in organic solvated by pillar, whereby the shock applied to compatible layer and, 5 weight % after modifying silica surface if the load gradient exceeds the first remaining in solvent by the silane coupling agent, silica same at the time of hardening the underfill composition introduced filler, curing temperature variations or of separated from a target in the end product. problem. Surface modified silica sol composition of the present invention in manufacturing method, said organic solvent having non-proton polar (aprotic polar) with an organic solvent or an said organic solvent having non-proton polar (aprotic polar) organic solvent to quantization polar (protic polar) organic mixture of an aprotic solvent, use can be made of, solvent. At this time, aprotic solvent mixing said mixture solvent weight 10 contrast the entire polar organic solvent is preferably not less % hereinafter. Surface modified silica sol composition of the present invention in manufacturing method, non-proton polar (aprotic polar) organic solvent having said non-proton polar extension of to special limitation cannot, preferably DMF, MEK, MIBK and THF are selected from the group consisting of least one, use can be made of,. Surface modified silica sol composition of the present invention in manufacturing method, said quantization polar extension of polar quantization (protic polar) organic solvent having to special limitation cannot, preferably MeOH, EtOH, IPA Butanol and are selected from the group consisting of least one, use can be made of,. Furthermore, phosphoric acid, and cyano the present invention refers to said surface modified silica sol composition including resin compositions for the varnish. In the present invention include resin is represented by s-cyano said PrimasetTM BA3000S, DT7000, LECY, PT15, PT30S, PT60S, PTC60S PTC2500 and are selected from the group consisting of least one, use can be made of,. Said varnish composition of the present invention, because it includes the silica sol composition, silica surface processing as epoxy groups is highly (compatibility) compatible bonding strength between polycarbonate with cyano, can be retain a low viscosity. Varnish the viscosity of the composition of the present invention since the reverse link has a higher such a composition as said, 500 MPa *s to 1, preferably 1 to 150 MPa *s, more preferably 1 to 100 MPa * s low viscosities 2000. Hereinafter of the present invention to assist in the understanding but presented thereby, the cold air flows a preferred embodiment, the present invention relate to examples of embodiment of the present invention is a category and techniques event within the range change and the can which apparent in to one skilled in the art, such change and modified claim of relay station terminal. commonsense to also the pixel is in the. In the embodiment Silica sol dispersion andepoxy surface modified silicamanufacturingthe car it will doze [In the embodiment 1] (1) silica sol dispersion liquid A phosphate-type generates an acidic functionality as dispersing fabricating BYK-W9010 0.7g of DMF (Dimethylformamide) 400g after dissolving in a BYK yarn, DENKA yarn SFP-30M silica (0.5um is an average diameter particles) 600g is slowly stirring 30 minutes is closed after charging wherein dispersing silica dispersion solution is obtained. (2) epoxy surface modification silica sol manufacturing Of said in the embodiment 1 (1) in a silica ray dispersion was turned on the epoxy silane coupling number 3-(Glycidyloxy) propyltrimethoxysilane (GPTMS) 10.5g, 3 mm ZrO2 bead 1.1 kg after are input using (ball mill) ball mill in 260 rpm by surface relaxation during time 20 after modifying amine-based basic functional groups as dispersing a cationic BYK-163 0.7g then opening a door to input additional the ball mill scattered the 60 weight % epoxy surface modification have been prepared colloidal silica. [In the embodiment 2] (1) silica sol dispersion liquid A phosphate-type generates an acidic functionality as dispersing fabricating BYK-W9010 3.0g of DMF (Dimethylformamide) 400g after dissolving in a BYK yarn, 600g silica SFP-30M yarn DENKA is slowly stirring 30 minutes is closed after charging wherein dispersing silica dispersion solution is obtained. (2) epoxy surface modification silica sol manufacturing Of said in the embodiment 2 (1) in a silica ray dispersion was turned on the epoxy silane coupling number 3-(Glycidyloxy) propyltrimethoxysilane (GPTMS) 15.0g, 3 mm ZrO2 bead 1.1 kg after are input using (ball mill) ball mill in 260 rpm by surface relaxation during time 20 after modifying amine-based basic functional groups as dispersing a cationic BYK-163 3.0g then opening a door to input additional the ball mill scattered the 60 weight % epoxy surface modification have been prepared colloidal silica. [In the embodiment 3] (1) silica sol dispersion liquid A phosphate-type generates an acidic functionality as dispersing fabricating BYK-W9010 6.0g for DMF (Dimethylformamide) 400g after dissolving in a BYK yarn, 600g silica SFP-30M yarn DENKA is slowly stirring 30 minutes is closed after charging wherein dispersing silica dispersion solution is obtained. (2) epoxy surface modification silica sol manufacturing Of said in the embodiment 3 (1) in a silica ray dispersion was turned on the epoxy silane coupling number 3-(Glycidyloxy) propyltrimethoxysilane (GPTMS) 12.0g, 3 mm ZrO2 bead 1.1 kg after are input using (ball mill) ball mill in 260 rpm by surface relaxation during time 20 after modifying amine-based basic functional groups as dispersing a cationic BYK-163 6.0g then opening a door to input additional the ball mill scattered the 60 weight % epoxy surface modification have been prepared colloidal silica. [In the embodiment 4] (1) silica sol dispersion liquid A phosphate-type generates an acidic functionality as dispersing fabricating BYK-W9010 0.7g BYK yarn, amine-based basic functional groups as dispersing a cationic BYK-163 0.7g of DMF (Dimethylformamide) 400g after dissolving in a, 600g silica SFP-30M yarn DENKA is slowly stirring 30 minutes is closed after charging wherein dispersing silica dispersion solution is obtained. (2) epoxy surface modification silica sol manufacturing Of said in the embodiment 4 (1) a silica ray dispersion was turned on the epoxy silane coupling number 3-(Glycidyloxy) propyltrimethoxysilane (GPTMS) 10.5g, 3 mm ZrO2 bead 1.1 kg 260 rpm after are input (ball mill) ball mill in 20 embodiment surface modification time using the 60 weight % epoxy surface modification have been prepared colloidal silica. [In the embodiment 5] (1) silica sol dispersion liquid A phosphate-type generates an acidic functionality as dispersing fabricating BYK-W9010 3.0g BYK yarn, amine-based basic functional groups as dispersing a cationic BYK-163 3.0g of DMF (Dimethylformamide) 400g after dissolving in a, 600g silica SFP-30M yarn DENKA is slowly stirring 30 minutes is closed after charging wherein dispersing silica dispersion solution is obtained. (2) epoxy surface modification silica sol manufacturing Of said in the embodiment 5 (1) a silica ray dispersion was turned on the epoxy silane coupling number 3-(Glycidyloxy) propyltrimethoxysilane (GPTMS) 12.6g, 3 mm ZrO2 bead 1.1 kg 260 rpm after are input (ball mill) ball mill in 20 embodiment surface modification time using the 60 weight % epoxy surface modification have been prepared colloidal silica. [In the embodiment 6] (1) silica sol dispersion liquid A phosphate-type generates an acidic functionality as dispersing fabricating BYK-W9010 6.0g BYK yarn, amine-based basic functional groups as dispersing a cationic BYK-163 6.0g for DMF (Dimethylformamide) 400g after dissolving in a, 600g silica SFP-30M yarn DENKA is slowly stirring 30 minutes is closed after charging wherein dispersing silica dispersion solution is obtained. (2) epoxy surface modification silica sol manufacturing Of said in the embodiment 6 (1) a silica ray dispersion was turned on the epoxy silane coupling number 3-(Glycidyloxy) propyltrimethoxysilane (GPTMS) 15.0g, 3 mm ZrO2 bead 1.1 kg 260 rpm after are input (ball mill) ball mill in 20 embodiment surface modification time using the 60 weight % epoxy surface modification have been prepared colloidal silica. [In the embodiment 7] (1) silica sol dispersion liquid A phosphate-type generates an acidic functionality as dispersing fabricating BYK-W9010 0.7g BYK yarn, amine-based basic functional groups as dispersing a cationic BYK-163 0.7g of DMF (Dimethylformamide) 400g after dissolving in a, 600g silica SFP-30M yarn DENKA is slowly stirring 30 minutes is closed after charging wherein dispersing silica dispersion solution is obtained. (2) epoxy surface modification silica sol manufacturing Of said in the embodiment 7 (1) a silica ray dispersion was turned on the epoxy silane coupling number 3-(Glycidyloxy) propyltrimethoxysilane (GPTMS) 10.5g, 1 mm ZrO2 beads (Beads mill) mill bead 1,000 rpm after 2 time surface modification using the embodiment 60 weight % epoxy surface modification have been prepared colloidal silica. [In the embodiment 8] (1) silica sol dispersion liquid A phosphate-type generates an acidic functionality as dispersing fabricating BYK-W9010 3.0g BYK yarn, amine-based basic functional groups as dispersing a cationic BYK-163 3.0g of DMF (Dimethylformamide) 400g after dissolving in a, 600g silica SFP-30M yarn DENKA is slowly stirring 30 minutes is closed after charging wherein dispersing silica dispersion solution is obtained. (2) epoxy surface modification silica sol manufacturing Of said in the embodiment 8 (1) a silica ray dispersion was turned on the epoxy silane coupling number 3-(Glycidyloxy) propyltrimethoxysilane (GPTMS) 15.0g, 1 mm ZrO2 beads (Beads mill) mill bead 3,000 rpm after 2 time surface modification using the embodiment 60 weight % epoxy surface modification have been prepared colloidal silica. [In the embodiment 9] (1) silica sol dispersion liquid A phosphate-type generates an acidic functionality as dispersing fabricating BYK-W9010 6.0g BYK yarn, amine-based basic functional groups as dispersing a cationic BYK-163 6.0g for DMF (Dimethylformamide) 400g after dissolving in a, 600g silica SFP-30M yarn DENKA is slowly stirring 30 minutes is closed after charging wherein dispersing silica dispersion solution is obtained. (2) epoxy surface modification silica sol manufacturing Of said in the embodiment 9 (1) a silica ray dispersion was turned on the epoxy silane coupling number 3-(Glycidyloxy) propyltrimethoxysilane (GPTMS) 15.0g, 1 mm ZrO2 beads (Beads mill) mill bead 3,000 rpm after 2 time surface modification using the embodiment 60 weight % epoxy surface modification have been prepared colloidal silica. [In the embodiment 10] (1) silica sol dispersion liquid A phosphate-type generates an acidic functionality as dispersing fabricating BYK-W9010 3.0g BYK yarn, amine-based basic functional groups as dispersing a cationic BYK-163 6.0g for DMF (Dimethylformamide) 400g after dissolving in a, 600g silica SFP-30M yarn DENKA is slowly stirring 30 minutes is closed after charging wherein dispersing silica dispersion solution is obtained. (2) epoxy surface modification silica sol manufacturing Of said in the embodiment 10 (1) a silica ray dispersion was turned on the epoxy silane coupling number 3-(Glycidyloxy) propyltrimethoxysilane (GPTMS) 15.0g, 1 mm ZrO2 beads (Beads mill) mill bead 3,000 rpm after 2 time surface modification using the embodiment 60 weight % epoxy surface modification have been prepared colloidal silica. [In the embodiment 11] (1) silica sol dispersion liquid A phosphate-type generates an acidic functionality as dispersing fabricating BYK-W9010 2.0g BYK yarn, amine-based basic functional groups as dispersing a cationic BYK-163 2.0g of DMF (Dimethylformamide) 400g after dissolving in a, 600g silica SFP-30M yarn DENKA is slowly stirring 30 minutes is closed after charging wherein dispersing silica dispersion solution is obtained. (2) epoxy surface modification silica sol manufacturing Of said in the embodiment 11 (1) a silica ray dispersion was turned on the epoxy silane coupling number 3-(Glycidyloxy) propyltrimethoxysilane (GPTMS) 15.0g, 3 mm ZrO2 bead 1.1 kg (ball mill) ball mill in 350 rpm after are input using the embodiment surface modification time 20 60 weight % epoxy surface modification have been prepared colloidal silica. [In the embodiment 12] (1) silica sol dispersion liquid A phosphate-type generates an acidic functionality as dispersing fabricating BYK-W9010 2.0g BYK yarn, amine-based basic functional groups as dispersing a cationic BYK-163 2.0g of DMF (Dimethylformamide) 300g after dissolving in a, silica SFP-30M yarn DENKA 700g is slowly stirring 30 minutes is closed after charging wherein dispersing silica dispersion solution is obtained. (2) epoxy surface modification silica sol manufacturing Of said in the embodiment 12 (1) a silica ray dispersion was turned on the epoxy silane coupling number 3-(Glycidyloxy) propyltrimethoxysilane (GPTMS) 20.0g, 3 mm ZrO2 bead 1.1 kg (ball mill) ball mill in 300 rpm after are input using the embodiment surface modification time 20 70 weight % epoxy surface modification have been prepared colloidal silica. [In the embodiment 13] (1) silica sol dispersion liquid A phosphate-type generates an acidic functionality as dispersing fabricating BYK-W9010 3.0g BYK yarn, as dispersing a cationic amine-based basic functional groups after dissolving in a DMF (Dimethylformamide) 300g for BYK-163 3.0g, silica SFP-30M yarn DENKA 700g is slowly stirring 30 minutes is closed after charging wherein dispersing silica dispersion solution is obtained. (2) epoxy surface modification silica sol manufacturing Of said in the embodiment 13 (1) a silica ray dispersion was turned on the epoxy silane coupling number 3-(Glycidyloxy) propyltrimethoxysilane (GPTMS) 20.0g, 3 mm ZrO2 bead 1.1 kg (ball mill) ball mill in 300 rpm after are input using the embodiment surface modification time 20 70 weight % epoxy surface modification have been prepared colloidal silica. [In the embodiment 14] (1) silica sol dispersion liquid A phosphate-type generates an acidic functionality as dispersing fabricating BYK-W9010 6.0g BYK yarn, as dispersing a cationic amine-based basic functional groups after dissolving in a DMF (Dimethylformamide) 300g for BYK-163 6.0g, silica SFP-30M yarn DENKA 700g is slowly stirring 30 minutes is closed after charging wherein dispersing silica dispersion solution is obtained. (2) epoxy surface modification silica sol manufacturing Said in the embodiment 14 of (1) a silica ray dispersion was turned on the epoxy silane coupling number 3-(Glycidyloxy) propyltrimethoxysilane (GPTMS) 20.0g, 3 mm ZrO2 bead 1.1 kg (ball mill) ball mill in 300 rpm after are input using the embodiment surface modification time 20 70 weight % epoxy surface modification have been prepared colloidal silica. [In the embodiment 15] (1) silica sol dispersion liquid A phosphate-type generates an acidic functionality as dispersing fabricating BYK-W9010 6.0g BYK yarn, as dispersing a cationic amine-based basic functional groups after dissolving in a DMF (Dimethylformamide) 300g for BYK-163 6.0g, silica SFP-30M yarn DENKA 700g is slowly stirring 30 minutes is closed after charging wherein dispersing silica dispersion solution is obtained. (2) epoxy surface modification silica sol manufacturing Said in the embodiment 15 of (1) a silica ray dispersion was turned on the epoxy silane coupling number 3-(Glycidyloxy) propyltrimethoxysilane (GPTMS) 25.0g, 3 mm ZrO2 bead 1.1 kg (ball mill) ball mill in 300 rpm after are input using the embodiment surface modification time 20 70 weight % epoxy surface modification have been prepared colloidal silica. [In the embodiment 16] (1) silica sol dispersion liquid A phosphate-type generates an acidic functionality as dispersing fabricating BYK-W9010 6.0g BYK yarn, as dispersing a cationic amine-based basic functional groups after dissolving in a DMF (Dimethylformamide) 300g for BYK-163 6.0g, silica SFP-30M yarn DENKA 700g is slowly stirring 30 minutes is closed after charging wherein dispersing silica dispersion solution is obtained. (2) epoxy surface modification silica sol manufacturing Said in the embodiment 16 of (1) a silica ray dispersion was turned on the epoxy silane coupling number 3-(Glycidyloxy) propyltrimethoxysilane (GPTMS) 30.0g, 3 mm ZrO2 bead 1.1 kg (ball mill) ball mill in 300 rpm after are input using the embodiment surface modification time 20 70 weight % epoxy surface modification have been prepared colloidal silica. [In the embodiment 17] (1) silica sol dispersion liquid A phosphate-type generates an acidic functionality as dispersing fabricating BYK-W9010 6.0g BYK yarn, as dispersing a cationic amine-based basic functional groups after dissolving in a DMF (Dimethylformamide) 200g for BYK-163 6.0g, 800g silica SFP-30M yarn DENKA is slowly stirring 30 minutes is closed after charging wherein dispersing silica dispersion solution is obtained. (2) epoxy surface modification silica sol manufacturing Said in the embodiment 16 of (1) a silica ray dispersion was turned on the epoxy silane coupling number 3-(Glycidyloxy) propyltrimethoxysilane (GPTMS) 30.0g, 3 mm ZrO2 bead 1.1 kg (ball mill) ball mill in 300 rpm after are input using the embodiment surface modification time 20 80 weight % epoxy surface modification have been prepared colloidal silica. [Compared e.g. 1] (1) silica sol dispersion liquid DMF (Dimethylformamide) 400g 600g silica SFP-30M yarn DENKA stirring slowly for 30 minutes is closed after charging wherein dispersing the particles are dispersed in the solution is obtained. (2) epoxy surface modification silica sol manufacturing 1 of said compared e.g. (1) a silica ray dispersion was turned on the epoxy silane coupling number 3-(Glycidyloxy) propyltrimethoxysilane (GPTMS) 10.5g, 1 mm ZrO2 260 rpm after beads 20 in ball mill (ball mill) using the embodiment surface modification time 60 weight % epoxy surface modification have been prepared colloidal silica. [Compared e.g. 2] (1) silica sol dispersion liquid A phosphate-type generates an acidic functionality as dispersing fabricating BYK-W9010 1.05g of DMF (Dimethylformamide) 400g after dissolving in a BYK yarn, 600g silica SFP-30M yarn DENKA is slowly stirring 30 minutes is closed after charging wherein dispersing silica dispersion solution is obtained. (2) epoxy surface modification silica sol manufacturing 2 of said compared e.g. (1) a silica ray dispersion was turned on the epoxy silane coupling number 3-(Glycidyloxy) propyltrimethoxysilane (GPTMS) 10.5g, 3 mm ZrO2 bead 1.1 kg 260 rpm after are input using (ball mill) ball mill in the time 20 60 weight % epoxy surface modification have been prepared colloidal silica. [Compared e.g. 3] (1) silica sol dispersion liquid Amine-based basic functional groups as dispersing a cationic DMF (Dimethylformamide) 400g after dissolving in a BYK 163 2.0g of BYK yarn, 600g silica SFP-30M yarn DENKA is slowly stirring 30 minutes is closed after charging wherein dispersing silica dispersion solution is obtained. (2) epoxy surface modification silica sol manufacturing 3 of said compared e.g. (1) a silica ray dispersion was turned on the epoxy silane coupling number 3-(Glycidyloxy) propyltrimethoxysilane (GPTMS) 10.5g, 3 mm ZrO2 bead 1.1 kg 260 rpm after are input using (ball mill) ball mill in the time 20 60 weight % epoxy surface modification have been prepared colloidal silica. Experiment e.g. Experiment 1 e.g.: identification of state for modifying silica surface the car it will doze produced in said in the embodiment 1 epoxy surface modified silica surface for modifying state identified. Acknowledgements are and modified surface silica using IR (FTS7000)-Photoacoustic ft scan speed of the processing advances to step 25Hz corresponding advertisement based on the shown list, showed to result to the computer of the also 2. Also as demonstrated 2, 3050 cm-1 in the vicinity ([...]) is observed with a massage cream, an essence, epoxy functional group, the, of which a surface is modified-epoxide silica surface it became was capable of confirming the. Experiment 2 e.g.: surface modified silica soland cyanate resin mixture viscosity measuring Said in the embodiment 1 to 17 and comparison e.g. 1 to 3 produced in the car it will doze epoxy surface modified resin cyanate silica sol viscosity and for improve (BA3000S) together with the information measuring the table showed to 1. (1) silica sol viscosity measuring Said in the embodiment 1 to 17 and comparison e.g. 1 to 3 obtained from the epoxy surface modified silica using viscometer yarn TOKI SANGYO viscosity the car it will doze it was determined that at a temperature of. 20 °C, 5 times in 50 RPM and 10RPM measuring and average is obtained. The underfill composition as one of said BA3000S, surface modified silica additive compatible with is large causes problems a mobile station is determined to is component. (2) silica sol/cyanate resin mixture viscosity measuring Said in the embodiment 1 to 17 and comparison e.g. 60-80 obtained in a 3 to 1 weight % epoxy surface modification silica sol 10g to cyanate resin (BA3000S) 6 g after mixing, it was determined that using viscometer yarn TOKI SANGYO at a temperature of. 20 °C, 5 times in 50 RPM and 10RPM measuring and average is obtained. , As shown in said table 1, of the present invention in the embodiment 1 to 17 made in epoxy surface modified silica well as the viscosity of a self silica sol the car it will doze , cyanate resin and the viscosity of blended mixtures of much to 3 to 1 compared e.g. to low viscosity could see he. Therefore, of which surface is modified by epoxy groups compatible resin and cyanate silica sol effectively enhanced was capable of confirming the. The present invention relates to a silica sol composition a manufacturing method thereof, wherein the composition contains silica, an anionic dispersant, a cationic dispersant, an epoxy silane coupling agent, and an organic solvent. The silica sol composition can achieve uniform surface modification of silica particles and effectively increase compatibility with a silica filler, which is surface-modified with an epoxy group, and a resin as an underfill composition, by using the anionic dispersant and the cationic dispersant. COPYRIGHT KIPO 2016 Silica, anionic dispersion number, cationic dispersion number, epoxy silane coupling number and an organic solvent including silica sol composition. According to Claim 1, an average diameter of the primary particles in the 1 said silica is characterized by 5 nm to 10um provided that the silica sol composition. According to Claim 1, said silica based on a total content composition at a low temperature of 50 to 90 weight % to characterized by silica sol composition. According to Claim 1, said anionic dispersants acidic functional group (acid functional group) is phosphoric acid, sulfuric acid or carboxylic acid, or salts of these characterized by a silica sol composition. According to Claim 1, said anionic dispersants acidic functional group (acid functional group) is phosphoric acid or phosphate is characterized by silica sol composition. According to Claim 1, said anionic dispersants based on a total content composition at a low temperature of 0.01 to 5 weight % to characterized by silica sol composition. According to Claim 1, said cationic dispersants due to amine basic functional groups characterized by silica sol composition. According to Claim 1, said cationic dispersants to it is a salt ammonium basic functional groups characterized by silica sol composition. According to Claim 1, said cationic dispersants based on a total content composition at a low temperature of 0.01 to 5 weight % to characterized by silica sol composition. According to Claim 1, said organic solvent having non-proton polar (aprotic polar) organic solvent is characterized by silica sol composition. According to Claim 1, said organic solvent having non-proton polar (aprotic polar) organic solvent to quantization polar organic (protic polar) and a solvent mixture of an aprotic solvent, the entire mixture solvent contrast aprotic polar organic solvent is 10 weight % hereinafter characterized by silica sol composition. According to Claim 10, said non-proton polar (aprotic polar) organic solvent having DMF, MEK, MIBK and THF are selected from the group consisting of is least one characterized by silica sol composition. According to Claim 11, said non-proton polar (aprotic polar) organic solvent having DMF, MEK, MIBK and THF are selected from the group consisting of and least one, (protic polar) organic solvent having polar quantization said MeOH, EtOH, IPA Butanol and are selected from the group consisting of is least one characterized by silica sol composition. According to Claim 1, 3-said epoxy silane the coupling agent ([...]) profile) trimethoxysilane, vinyltriethoxysilane on the profile ([...]) 3-, 2-(3, 4-epoxy aminocyclohexyl) ethyl trimethoxysilane, 2-(3, 4-epoxy aminocyclohexyl) ethyl triethoxysilane and epoxy [...] trimethoxysilane the group consisting of at least one is characterized by silica sol composition. According to Claim 1, characterized by 1 to 100 MPa * s viscosity provided that the silica sol composition. (A) anionic organic solvent layer is placed on the when aggregation is performed by adding dispersion silica dispersion having a the stages of formation of the ; (b) said anionic dispersion fibers have silica dispersions the epoxy silane coupling injection process is improved so that silica surface which modifies the step; and (c) said surface modified silica dispersions to cationic dispersing agent the method involves adding manufacturing method including surface modified silica sol composition. According to Claim 16, said silica 10um to 5 nm is an average diameter of the primary particles in the 1 provided that the manufacturing method characterized by surface modified silica sol composition. According to Claim 16, said silica based on a total content composition at a low temperature of 50 to 90 weight % to manufacturing method characterized by surface modified silica sol composition. According to Claim 16, said anionic dispersants acidic functional group (acid functional group) is phosphoric acid, sulfuric acid or carboxylic acid, or salts of these surface modified silica sol composition characterized by a manufacturing method. According to Claim 16, said anionic dispersants acidic functional group (acid functional group) is phosphoric acid or phosphate is manufacturing method characterized by surface modified silica sol composition. According to Claim 16, said anionic dispersants based on a total content composition at a low temperature of 0.01 to 5 weight % to manufacturing method characterized by surface modified silica sol composition. According to Claim 16, said cationic dispersants amine basic functional groups due to manufacturing method characterized by surface modified silica sol composition. According to Claim 16, said cationic dispersants it is a salt ammonium basic functional groups to manufacturing method characterized by surface modified silica sol composition. According to Claim 16, said cationic dispersants based on a total content composition at a low temperature of 0.01 to 5 weight % to manufacturing method characterized by surface modified silica sol composition. According to Claim 16, said organic solvent having non-proton polar (aprotic polar) organic solvent is manufacturing method characterized by surface modified silica sol composition. According to Claim 16, said organic solvent having non-proton polar (aprotic polar) organic solvent to quantization and a solvent mixture of an aprotic solvent organic (protic polar) polar, aprotic polar organic solvent 10 weight % hereinafter the entire mixture solvent contrast is manufacturing method characterized by surface modified silica sol composition. According to Claim 25, said non-proton polar (aprotic polar) organic solvent having DMF, MEK, MIBK and THF are selected from the group consisting of is least one surface modified silica sol composition characterized by manufacturing method. According to Claim 26, said non-proton polar (aprotic polar) organic solvent having DMF, MEK, MIBK and THF are selected from the group consisting of and least one, (protic polar) organic solvent having polar quantization said MeOH, EtOH, IPA Butanol and are selected from the group consisting of is least one surface modified silica sol composition characterized by manufacturing method. According to Claim 16, 3-said epoxy silane the coupling agent ([...]) profile) trimethoxysilane, vinyltriethoxysilane on the profile ([...]) 3-, 2-(3, 4-epoxy aminocyclohexyl) ethyl trimethoxysilane, 2-(3, 4-epoxy aminocyclohexyl) ethyl triethoxysilane and epoxy [...] trimethoxysilane the group consisting of at least one is manufacturing method characterized by surface modified silica sol composition. (A ') anionic organic solvent layer is placed on the number and cationic dispersion dispersion when aggregation is performed by adding silica dispersion having a the stages of formation of the; and (b') said anionic dispersion fibers have silica dispersions the epoxy silane coupling injection process is improved so that silica surface which modifies the step manufacturing method including surface modified silica sol composition. According to Claim 30, said silica 10um to 5 nm is an average diameter of the primary particles in the 1 provided that the manufacturing method characterized by surface modified silica sol composition. According to Claim 30, said silica based on a total content composition at a low temperature of 50 to 90 weight % to manufacturing method characterized by surface modified silica sol composition. According to Claim 30, said anionic dispersants acidic functional group (acid functional group) is phosphoric acid, sulfuric acid or carboxylic acid, or salts of these surface modified silica sol composition characterized by a manufacturing method. According to Claim 30, said anionic dispersants acidic functional group (acid functional group) is phosphoric acid or phosphate is manufacturing method characterized by surface modified silica sol composition. According to Claim 30, said anionic dispersants based on a total content composition at a low temperature of 0.01 to 5 weight % to manufacturing method characterized by surface modified silica sol composition. According to Claim 30, said cationic dispersants amine basic functional groups due to manufacturing method characterized by surface modified silica sol composition. According to Claim 30, said cationic dispersants it is a salt ammonium basic functional groups to manufacturing method characterized by surface modified silica sol composition. According to Claim 30, said cationic dispersants based on a total content composition at a low temperature of 0.01 to 5 weight % to manufacturing method characterized by surface modified silica sol composition. According to Claim 30, said organic solvent having non-proton polar (aprotic polar) organic solvent is manufacturing method characterized by surface modified silica sol composition. According to Claim 30, said organic solvent having non-proton polar (aprotic polar) organic solvent to quantization and a solvent mixture of an aprotic solvent organic (protic polar) polar, aprotic polar organic solvent 10 weight % hereinafter the entire mixture solvent contrast is manufacturing method characterized by surface modified silica sol composition. According to Claim 39, said non-proton polar (aprotic polar) organic solvent having DMF, MEK, MIBK and THF are selected from the group consisting of is least one surface modified silica sol composition characterized by manufacturing method. According to Claim 40, said non-proton polar (aprotic polar) organic solvent having DMF, MEK, MIBK and THF are selected from the group consisting of and least one, (protic polar) organic solvent having polar quantization said MeOH, EtOH, IPA Butanol and are selected from the group consisting of is least one surface modified silica sol composition characterized by manufacturing method. According to Claim 30, 3-said epoxy silane the coupling agent ([...]) profile) trimethoxysilane, vinyltriethoxysilane on the profile ([...]) 3-, 2-(3, 4-epoxy aminocyclohexyl) ethyl trimethoxysilane, 2-(3, 4-epoxy aminocyclohexyl) ethyl triethoxysilane and epoxy [...] trimethoxysilane the group consisting of at least one is manufacturing method characterized by surface modified silica sol composition. Claim 1 is represented by s-cyano composition and silica sol of resin including varnish compositions. According to Claim 44, provided that the viscosity 150 MPa * s to 1 characterized by varnish compositions. According to Claim 44, provided that the viscosity 100 MPa * s to 1 characterized by varnish compositions. According to Claim 1, characterized by 10 to 50 MPa * s viscosity provided that the silica sol composition. According to Claim 1, characterized by 10 to 30 MPa * s viscosity provided that the silica sol composition. According to Claim 1, said silica is an average diameter of the primary particles in the 1 to 10 nm provided that the 5um characterized by silica sol composition. According to Claim 1, said silica an average diameter of the primary particles in the 1 to 100 nm is provided that the 1um characterized by silica sol composition. Silica sol viscosity BA3000S mixing initial viscosity BA3000S 24 mixing viscosity process has been completed 10 rpm 50 rpm 10 rpm 50 rpm 10 rpm 50 rpm In the embodiment 1 24.3 16.98 53.4 52.0 62.7 62.2 In the embodiment 2 20.0 14.5 50.4 49.5 60.2 59.5 In the embodiment 3 21.0 15.6 45.2 44.3 55.3 54.3 In the embodiment 4 25.1 17.78 57.0 55.7 77.8 75.2 In the embodiment 5 22.2 21.3 52.1 51.3 62.3 61.5 In the embodiment 6 21.3 19.5 46.5 45.0 57.3 56.8 In the embodiment 7 19.0 12.20 45.5 44.5 76.6 69.0 In the embodiment 8 18.5 17.5 40.5 40.2 42.2 43.2 In the embodiment 9 20.2 19.5 40.6 39.5 50.2 49.6 In the embodiment 10 19.5 18.6 55.6 54.6 60.2 54.5 In the embodiment 11 20.6 20.1 56.5 54.2 80.5 80.2 In the embodiment 12 35.5 34.5 60.6 58.5 80.5 78.8 In the embodiment 13 35.4 34.2 58.5 57.4 60.5 59.8 In the embodiment 14 20.5 19.5 40.4 39.5 59.8 58.6 In the embodiment 15 34.3 33.3 50.3 49.6 60.5 59.6 In the embodiment 16 40.5 35.6 60.5 58.6 70.8 70.9 In the embodiment 17 40.5 38.5 120.5 100.5 120.3 112.3 Compared example 1 144.4 51.30 >3000 >3000 >3000 >3000 Compared example 2 48.8 33.31 402.0 250.2 >3000 >3000 Compared example 3 325.4 250.6 125.3 115.6 130.4 116.4
