FLEXIBLE SUBSTRATE AND ORGANIC DEVICE INCLUDING SAME

In hereinafter, the present invention. in parallel with the axis.

Exhibits flexible substrate to Figure 1 of the present invention. Also 1 consults a surface, a frame part of the present invention flexible substrate (10), a sub-substrate (20), fixing part (30) and bridge (40) includes.

A terms of used in the present invention the flexibility of the bending (bending) and increase the (stretching), elastic (elasticity) may be used for terms including properties.

Said edge part (10) an upper side of the trench area framework-flexible board flexible, said edge part (10) is formed such as a substrate sub. Said edge part (10) of a special number't is one. For example, said edge part (10) a transverse and longitudinal length in each case can be range 1mm-100mm.

Said a sub-substrate (20) a frame in plurality spaced apart. may be positioned. Also 1 consults a surface, plurality of sub-boards or which is independently of each other is separately is formed, bridge. portion near the fuel tank.

Said a sub-substrate (20) is effective in preventing the size of the one number, for example a sub-substrate horizontal and vertical length of said 0. 1-10mm can be. Said a sub-substrate (20) on independent organic devices can be formed is deposited.

Said a sub-substrate (20) - several linking the plurality may be formed.

A sub-substrate said position so that a sub-substrate different stress and deformation according to. for preventing the influence. I.e., the flexible substrate of the present invention a sub-substrate, fixed part and a vacant space of the tape carrier region external grudge number filling since the through, the space (space) and deformation stress by. cannot be transmitted. Thus, the flexible substrate of the present invention between a sub-substrate on the stress and influence of higher. length.

Said fixing part (30) the a sub-substrate and a sub-substrate which is located between said bridge (30) and is coupled. Said fixing part (30) the bridge (30) is fixed to an outer are elongated, according to modified bending such as one body with the rod the substrate at the time of film improves the mechanical strength of an.

Said bridge (40) the plurality of sub-boards, interconnects edge part fixed part and, a sub-substrate applied to. capable of reducing a impact deformation and which.

Said bridge (40) receives the elongated power or receiving part, using a structure can be. Said bridge (40) the spring shape or scallop shaped structure can be a structure having a. For example, scallop shaped improve condensation efficiency and bottom normal aspect plate extending in a direction power (properties opened upward and downward) earphone for a direction over and under having very high preferably characteristic of a transfer system.

Said bridge (40) or said fixing part (30) the height of the a sub-substrate (20) or flanges can be to each other to conform to the height and. Of the present invention flexible substrate components is, lower end of components preferably coplanar located at about the same flexible substrate to object it is easy to attachment to.

Said bridge (40) that includes at least one first sub layer is force with which is to greatly alleviate, said modified server boards for processes which are accompanied by stresses and strains the wafer being free from contact with the free surfaces. For example, spring constant spring or corrugated relative to the bridge, -2. 9 N/m, a sub-substrate to -811. 0 N/m is in, a sub-substrate any while dispersing the length of substrate is stretchable KIPO & laterally until -70%.

A adheres to dirt of the dry said flexible substrate may be used in polymer, preferably photocurable as acrylate (acrylate) having, use can be made of, polymer.

Having properties and sintered results which bear, said flexible substrate the 2 - hydroxyethyl acrylate, 2 - hydroxypropyl acrylate, [...] or [...] acids containing hydroxyl groups such as of an acrylate-based compound; polyethylene [...][...] or of an acrylate-based compound such as of an aqueous solution of the; tree [...], [...] or [...] polyfunctional of the polyhydric alcohol, such as polyester [...] compound; trimethylolpropane, polyfunctional alcohol such as bisphenol hydrogenation A A or bisphenol, non-phenol and the like of polyhydric phenol ethylene oxide adduct and/or propylene oxide adduct of an acrylate-based compound; said at least one isocyanate function acids containing hydroxyl groups of an acrylate-based compound or polyfunctional by the decomposer modified caulker ability polyurethane acrylate; diglycidyl bisphenol A, hydrogenation bisphenol A can epoxy phenol novolak or diglycidylether or (meth) acrylic acid additive is of epoxy [...] compound; [...] modified polycaprolactone, modified polycaprolactone ε - [...] acrylate, polycaprolactone such as polycaprolactone modified hydroxy [...] of an acrylate-based compound for; or said acrylate applicable to a methacrylate such as photosensitive (meth) acrylate compound compound :.

For bath number flexible film for Figure 2 said method and said flexible substrate thereby blades, presenting a method electrode is formed. Said method said and engraved mold polymer first structure of the flexible substrate with reduced operation said polymer mold-stick photocurable polymer sequentially load a plurality of pressed into the resin and curing of flat polymer mold includes.

Said said and engraved of the flexible substrate the structure a publicly known method of use can be made of, for grudge without number. Also 2 reference to an surface, coating the register layer onto the isolated inter layer comprising a substrate, then, flexible shape of the substrate a is possible to design motor, and a photocuring the. and scrubbing of the device includes following steps. Then, said relief printed a device for purification and of the flexible substrate surface of the conductive polymer injecting a photoresist on the then cured and engraved structure of the flexible substrate a polymer mold. it possible to obtain.

Said front structure of the flexible substrate as of an intervening, edge part (10), a sub-substrate (20), fixing part (30) and bridge (40) includes.

Said flexible substrate base paper in an intaglio the pressing step a device for purification and polymer mold-stick photocurable polymer sequentially load a plurality of flat polymer into a mold, is pressing the. Said polymer mold include typically used in the art for any material, e.g., silicon wafer, PDMS (polydimethylsiloxane), plastics or the like material may be employed, preferably PDMS (polydimethylsiloxane) that is capable of using optical.

PDMS molds since the characteristics between conformal contact (conformal contact), two PDMS mold contact zone there are no residual polymer layer. Then, PDMS pattern remaining in the-stick photocurable polymer having UV-a plurality of laterally displaced regions is which is curable with UV through the PDMS mold. PDMS and a photocurable polymer as a material of surface energy respect to each other part lowered, two PDMS mold a cured flexible substrate can be ease of separating the structure.

Said flexible substrate (PUA substrate) an electrode material by depositing and flexible substrate to remove the electrode to the substrate with easy can be. Surface reference to an lower end of Figure 2, additional said bridge and a fixing member under the state without or the patterning photolithography elastic electrode enables clearing unit number. I.e., removing electrode material flexible substrate (PUA substrate) simply by thermal deposition or spin coating after the, a support substrate such as glass or PDMS (supporting backbone) flexible substrate from which is separated is formed on flexible substrate electrode can be.

Flexible-flexible board of Figure 2 b plane view is formed inside the tie. shown is roughly. The of Figure 2 c number by the present invention show flexible substrate prepared by the method. the flexible substrate is of Figure 2 d until 80% laterally. shown that elongated. The gold electrode is deposited of Figure 2 e said attached onto the flexible substrate to nail to show.

Of Figure 2 e such as a, PUA substrate remaining in the unsaturated acrylate adhesion even after cure, UV can be under public affairs number.

Hereinafter, the present invention through in the embodiment but as further described further, the present invention these e.g. only limited not.

In the embodiment1

Negative PR flat layer coated spindle on Si wafer (1500 rpm, 30 seconds). After wafer down on a hot plate heated to 60 °C the 5 minutes. A desired structures said PR through the shadow mask is exposed to the UV layer, then baking, developing, washing and drying steps performed for all the. PDMS layer patterned PR carboxyl and engraved using the number. Patterned PR layer from a PDMS after unloading sensing UV curable PUA mixture ((main) american new other contact, mINS-311 or mINS-301) for PDMS intaglio surface on and is dispersed in, other flat PDMS mold was by. Conformal contact between the PDMS (conformal contact) passivation layer is formed on the two PDMS mold and moved in a longitudinal contact zone PUA't layer (using roller). PDMS pattern remaining in the PUA mixture through UV-a plurality of laterally displaced regions UV curing the PDMS mold. Two PDMS the mold after curing UV is ease of separating the independent PUA can be substrate to yield. Said number prepared by the method. micrometer -80 PUA the thickness of the substrate.

In the embodiment2

Bottom-gate shape (Al/PMMA/pentacene/Au) in a number of OTFTs a under trillion PUA in the embodiment 1 is formed to allow the plating solution on a flexible substrate. First, aluminum, gold electrode and pentacene layer in a vacuum, individually atmosphere is formed by. A sol number PMMA layer, coating the 5 wt % PMMA (in toluene) to the spindle, in glove box at room temperature to evaporate the toluene time was 24. Thereby, a appropriate alignment with to the act of depositing each element, flexible PUA substrate flat PDMS mold a part of the entire number, which has the geometry plane during trillion processes. Gold source and drain electrodes 130 micrometers with channel length between each, . micrometer 960. PUA inverter organic are on the surface of a substrate the method bath OTFT number with trillion processes equal number (TFT channel outside number). Organic inverter (threshold voltage) Vth of a OTFT a number two different to the channel length (130, 700 micrometers, channel the width same) the first voice portion out of an.

In the embodiment3

OPV PUA substrate assembly of device: PUA stentering surpass a ITO on a substrate (sputtering) the codes the invention also provides for a processing UV/ozone 15 minutes.

Then, PEDOT: PSS layer a prepared ITO coded PUA substrate 5000 rpm at a spin coating the 40 minutes, 150 °C the invention also provides for a heat in 10 minutes. 0 and 1 wt % P3HT. Trichlorobenzene is 8 wt % PCBM organic photoactive solution dissolved in 40 seconds at a spin coated 1500 rpm. ten layer tightly in a vacuum aluminum layer thickness of 80 nm light method on active layer 150 °C subjected to a 30 minutes the invention also provides for a heat in.

Figure 3 in the embodiment 2 by hemispherical and organic thin film transistor prepared by the method number structure to show attached. Of Figure 3 b has located in a plane of organic thin film transistor FET (field-effect transistor) show and properties, hemispherical has of Figure 3 C of organic TFT attached to FET (field-effect transistor) exhibits properties.

Picture a is affixed in the form of a planar 3b OTFT of the properties and are FET, -0. 100 cm²v^-1s^-1average hole mobility, -5*10⁴of off current ratio, blades, presenting a threshold voltage of - 20V. Of Figure 3 c reference to an surface, hemispherical surface, -0 turned off. 092cm²V^-1S^-1average hole mobility, -3x10⁴on - off current ratio and a, threshold voltage of - - 25 V( V_th)blades, presenting a.

Organic flexible substrate of the present invention opening has a diameter of several micrometer hemi surface capacities in asynchronous transfer mode according to a contact stresses in a substantially planar is affixed in the form of performance than would be the case with relatively low to organic devices still but the torsion bar is used for fully functioning..

Organic thin film transistor prepared by the method number in Figure 4 in the embodiment 2 in watt control 70%, in this case, extending up FET exhibits properties. Device 70% average hole mobility may be even 4 transmits the generated stress side. Reduced to 5% hereinafter. However, time for stressed side of 30% was scarcely changed. The results indicate that (size of a ROM) of extensible organic thin film transistor according to flexible PUA forces acting on the substrate when bonded to an is stretched (case of evolution is stress) bridge pressure rise due to. it is shown that reduced.

In addition, Figure 5 shows a number also, the fatigue of the OTFTs prepared by the method for irradiating an elongated 70% after 100 a after relief. representative of the feature FET. Also 5 reference to an surface, hole mobility is 7% average device have been reduced, even repeated relieving and stretched this stable element is of the present invention in operable. shown that.

Flexible (earphone for a characteristics) and apparatus for irradiating the, 50 mm managing cache in a multiprocessor data processing substrate PUA plastic hemisphere in moved out (picture 2a). Of Figure 6 a, b 50 times the flexing and relief, of organic TFT 100 after a FET (field-effect transistor) exhibits properties.

Due to adhesive of origin substrate PUA, and is readily movable without tape or that DPRAM is full.. Sphere of surface (contact stress) direct contact stresses exerted on a sub-substrate thence to a core PUA since the FET after the substrate is observed with small changes in the characteristics.. Mechanical modeling based on, PUA through elastic deformation of the maximum contact pressure is a sub-substrate center has been determined to - 168 Pa. PUA substrate by bending (radius of curvature 20 mm) is barely observed or is the characteristics are varied according to FET and mitigation are have not been, thus, as the observed FET hemi surface contact by a curved, a change in stress is it is judged that the derived from. Of Figure 6 c reference to an surface, bending (radius of curvature 20 mm) and mitigation are 100 average measured after a hole mobility thewater in a manner that renders the reduced about 9%, this repeated flexing and relieving operation is stable, and the device of the present invention even possible show.

Also in the embodiment 1 in the 7a number under trillion a flexible substrate are formed in a flat - plate glass and plastic hemi of polyacrylonitrile ionomer and process and is measurement of the changed corresponding to request in, also the j-curve 7b is formed inside the tie. shown.

Also 7a reference to an surface, and the light transmittance of the flexible substrate PUA the first glass which rise to high difference, a broad range in particular 300 - 1100 nm a constant transmittance sequentially controlled.

Also 7b reference to an surface, flat which comprises a component compared to hemispherical plastic of organic solar cells attached to but less photoelectric efficiency, is fully operational as organic solar cells still the torsion bar is used for..

Until now was specific to longitude in the embodiment of the present invention. The present invention is in the field of the person with skill in the art in the present invention are essentially out character-istics that are strained such a range that causes no may be embodied in the form can store references to any number of 2000. The aforementioned range of the present invention shown in an which claim rather than described, and all connections to the in the range equivalent the differences included in the present invention should be interpreted to will.