SEALED CART AND METHOD FOR TRANSFERRING WAFER USING SAME
The present invention refers to hermetic limit and maximum limit to determine whether method relates to wafer transfer using the same, by writing their, peripheral environmentally sensitive electronic component a precision and are reactive with an organic acid material wafers to a safely such that one transfer unit can transfer: a hermetic limit and maximum limit to determine whether said wafer using the same a substantially relates to method. Generally, a semiconductor chip consisting of a monocrystalline substrate thin beamlike silicon wafer (wafer) fab are patterned by using a photolithography plurality circuit pattern on said patterned semiconductor chip (FAB) process and performance of electrical a tester for checking the (EDS) process is performed to is bath number. Wherein, said semiconductor chip substantially as of electronic be precisely, alien substances around and to temperature and humidity of the insertion part and the holder by making the processes reacted highly sensitive, fab said a site (FAB) process said inspection (EDS) process is performed each the locations are external and structural completely screened necessarily is connected to the semiconductor layer.. In addition, said fab (FAB) process and said inspection (EDS) step for vertically arranged wafer said wafer is said rails a rack is (FOUP, Front Open Unified Pod) or non (FOSB, Front Open Shipping Box) mechanism such as are used KIPO & general rule, . The, said wafers are mechanism such as said state is housed in said fab (FAB) process is performed in a place that a process said inspection (EDS) (FAB) of a delivery point or an fab said a process is transported to a another location by supplying and carrying away air, fab (FAB) of said process and said inspection (EDS) process can be of effectively performing. In this case, is provided to transfer the building the same place has an external is disposed said exposed to an environment may transfer a proper system for a mechanism but a non - intrusive, is provided to transfer the relatively place has an other, and the distance between the is disposed building if the key mechanism said opening is formed with magnetic force semiconductor wafers are said vinyl a mechanism, for example by transfer after packaging folly closed is connected to the semiconductor layer. the need. For luncheon and to take a, a worker gives an number and the packaging of said mechanism that triggers since should go further process, the efficiency of an falling door is connected to the semiconductor layer. point number. The present purpose of the invention the fab or inspection process (FAB) (EDS) process is performed of wafer outside the building such that the informing a position of an optical spot: a hermetic trolley the recording operation. under public affairs number. In addition, of the present invention said a other desired using trolley an enclosed cell using the plate a plurality of said number of the recording operation. under public affairs method. To the second junction portion to achieve purpose of the invention, personal guided vehicle is transferred hermetic according to one aspect number semiconductor chips from the wafer under trillion or inspecting a wafer is said in a place that is a rack is mechanism is docked in a stocker including multi-register for storing, said inside closed is inserted to the insertion mechanism an accommodating space the opening end box and is mounted on a side of said sealed box, same mobile bobbin-changing apparatus includes a moving part. One in the embodiment according to said sealed box may comprise an an insulating material. One in the embodiment according to said motion allows caster buffer unit with sensor may comprise an (caster). To achieve other purposes of the present invention, wafer transfer method according to one aspect the number 1 number 1 number semiconductor chips from the wafer a process inspection or under trillion a number 1 in said wafer is a rack is said to stocker number 1 has been stored in the mechanism is inserted to the insertion mechanism the opening end an accommodating space closed said box and attached to a lower portion of the sealed box it in the unit, a step docking of a trolley including, said number 1 to receiving space deceleration of said walls of the mold frame has a basis of stored and the transparent electrodes for controlling a step, number 2 number 2 number semiconductor chips from the wafer a process inspection or under trillion a number 2 is mechanism said location said receiving space the opening is formed is transported to a trolley mechanism said paused at said number 2 number 2 be stored and docked in a stocker number 2 stocker to a docking said deceleration of said mechanism components housed in one receiving space includes for depositing a. Deceleration of receiving space to one in the embodiment according to said walls of the mold frame has a basis of stored said number 1 and the transparent electrodes for controlling a step providing output indicative of the information biosensor said number 2 the truck then attaching a may include. Such hermetic minimum limit and maximum limit to determine wafer transfer method using the same according to, wafer is a rack is closed is inserted to the insertion mechanism an accommodating space the opening end box and bobbin-changing apparatus includes a moving mobile same, and an interface section including at said closed-type electrically trolley number semiconductor chips from the wafer using a process inspection or under trillion a number 1, and the distance between the paused at a number of said other building in a process inspection or under trillion a number 2 provided to safely transfer a location of the insertion part and the holder, separately package the background art such as with spot-welding the such as loaded more efficiently it in person can be to the sprung blade. Also in the embodiment according to one of the present invention Figure 1 shows a hermetic trolley into the wafers using general outline for the course of transportation of the electronic. plane from the represents. 1 also also shown in Figure 2 shows a closed-type electrically trolley. plane from the represents specifically. Hereinafter, reference to drawing based on a text content of the limit and maximum limit to determine whether hermetic according to an embodiment of the present invention wafer transfer method using the same. as further described to. Modification of the present invention refers to various variety of forms that can apply may have a low bar, specific drawing to in the embodiment illustrated herein, and. rapidly and to reduce a memory. However, the present invention with a particular disclosure of the physical shape not defined to be, included within the scope of the present invention all changing a concept and techniques, including replacement water and equalization should understood. Each drawing while describes similar references in a similar was to use components. In drawing with an, the dimensions of the structures elcellent distinctions of the present invention a thread number is formed inside the tie. shown in the drawing as an enhancement. Number 1, a set of terms, such as number 2 describes various elements which may be used; however, said components are said terms is don't is defined by. Said terms are components of one an object from other components is carried out by using an acidulous only. For example, without a wireless type through a wire rights of the present invention number 1 number 2 component can be designated components, similarly number 2 number 1 component elements can be designated. The present application only a term use in a particular in the embodiment used to describe the to be, is not intending to be defining the present invention. Contextually representation a plurality of differently it is apparent that without the carelessly, includes multiple representations. In the present application, "comprising" or "having ." a set of terms, such as a specification to the features, number, step, operation, components, discrete parts or a combination of these is designates the feature to which is present does, number to execute another aspect of one or more, step, operation, components, or a combination of these discrete parts existence of back pre possibility or additionally not in the number should understood. While, other is not defined, technical or scientific for a term including to the all terms are person with skill in the art in the present invention is in the field of the upwardly urged by equivalent to those that would have been understood have the meanings of wet liquid to flow down. Generally are defined as the dictionary used for, such as terms are on wherein the nodes refining the context of related techniques consistent semantics and having having the meanings must be interpreted to, the present application, become manifest in a do not define, excessively or is ideal for the widest sense of the formal does not interpreted. Also in the embodiment according to one of the present invention Figure 1 shows a hermetic trolley into the wafers using general outline for the course of transportation of the electronic drawing is a represents, also 1 shown in Figure 2 the form of a closed tray. plane from the represents specifically. Also refers to surface 1 and 2, truck hermetic in the embodiment according to one of the present invention (100) wafer number 1 using (10) from semiconductor chip number 1 to number (not shown) a a process inspection or under trillion place number 1 (20) in wafer number 2 (30) to number number 2 from semiconductor chip (not shown) is performed a process inspection or under trillion place said number 1 (20) separated structural from number 2 place (40) to deliver, said first truck (100) for said number 1 place (20) in said number 1 wafer (10) are a rack is mechanism (24) has been stored in the stocker 9990000886 999 (22) docked in a to. Wherein, said mechanism (24) used in a process for etching multiple bath the number rails (FOUP) and used in a process inspection said non with (FOSB) may comprise an either. The, said truck (100) said mechanism therein (24) is inserted to the insertion hermetic is provided with an accommodating space (210) for the opening end box (200) and said sealed box (200) is mounted on a side of said sealed box (200) that moves the moveable portion (300) includes. Wherein, said sealed box (200) for more the transfer station, and lightweight products intensity hereinafter in order to make al (aluminum) can be consist of a material of, said moving part (300) for slidable movement on the caster stabilised may comprise an (caster). Then, said sealed box (200) accommodating space of (210) to said number 1 stocker (22) mechanism stored in the (24) for receiving a. The, said mechanism (24) for said receiving space (210) a process for the in another housing said number 1 stocker (22), and a transfer robot position respect to transition of the wafer cassette is transferred to a (not shown) can be. In addition, said sealed box (200) accommodating space of (210) to said number 1 stocker (22) mechanism stored in the (24) for receiving pixel block having a predetermined size in said mechanism (24) the number 2 place (40) providing output indicative of the information to the truck (100) by, said mechanism (24) having a wrong likelihood that the transfer to a location can be the vicinity of the. Then, said sealed box (200) accommodating space of (210) to said mechanism (24) for pallet having air pump (100) for a transport vehicle (50) for loading them on the.. The, said truck (100) for said a transport vehicle (50) for loading them on the process said a transport vehicle (50) installed in step-up/step-down device (not shown) or rail device (not shown) automatically select and display a can be the wafer cassette is transferred to a. In addition, said truck (100) for said a transport vehicle (50) are positioned in close proximity to the truck (100) for the moving portion of (300) can be driven, driving device (not shown) automatically provided can be. Then, said a transport vehicle (50) for said number 2 place (40) with the wheels 25 to convey. The, said truck (100) has a substantially to an external environment, and can be made APS, such as description of said through a closed structure with an essentially formed in the outer circumference of and in a heat-resistant, said sealed box (200) the direction vertical to the flow direction (220) is carried out by installing a temperature and humidity variations a data driver, said number 1 wafer (10) of informing a position of an optical spot can be. Wherein, said insulating material (220) an efficient, insulation serves for said sealed box (200) in which on the inside of the can be stand. Alternatively, said insulating material (220) the sealed box (200) interposed between the ingot and the a wall surface of can be installed at the, in this case more efficient for a heat insulating serves said sealed box (200) for forming an air layer in a wall surface of can be. In addition, said a transport vehicle (50) may be generated during with movably coupled into said number 1 by wafer (10) can be the second are, for absorbing vibrations said moving part (300) has, a dampening part (310) may comprise an. Then, said a transport vehicle (50) for said number 2 place (40) said transferred to a truck (100) .for loading and unloading. This procedure said a transport vehicle (50) to said truck (100) for depositing a manner as well as, said lifting/lowering of the device (not shown) or rail device (not shown) automatically through a can be the wafer cassette is transferred to a. Then, said unloading for pallet (100) for said number 2 place (40) in said mechanism (24) are stored in the number 2 stocker (42) docked in a a. This process the users determine a structure of basic described in addition said said truck (100) for the moving portion of (300) of drive in order to drive the device (not shown) through the number 2 stocker (42) placed automatically can be docked to. Then, said docked for pallet (100) contained in the mechanism (24) for said number 2 stocker (42) stored in. This process in addition said number 1 stocker (22) as in, said transfer robot respect to transition of the wafer cassette is transferred to a (not shown) can be. After, said number 2 stocker (42) transferred to the bottom surface, and receives the mechanism (24) the opening is formed wafer number 1 (10) place the number 2 (40) to said semiconductor chip (not shown) in a process for etching multiple bath number arranging or examining can be. The, place said number 1 (20) a power device is number 1 wafer (10) and said number 2 place (40) a power device is number 2 wafer (30) has a substantially the same kind in that very loop. can be comprised of either an. And, said number 1 wafer (10) is a rack is mechanism (24) is inserted to the insertion hermetic is provided with an accommodating space (210) for the opening end box (200) and unit, a (300) composed the form of a closed tray (100) wafer said number 1 using (10) from semiconductor chip number 1 to number (not shown) a a process inspection or under trillion place number 1 (20) in said in building other, and the distance between the number of the same inspection or under trillion a process number 2 place (40) of the insertion part and the holder transfer from the mixture, separately package the background art such as with spot-welding the such as loaded more efficiently it in person can be to the sprung blade. Detailed description of the invention the present reticle of the present invention preferred embodiment described in reference to but in, corresponding art is a classic mirror server one skilled in the art with knowledge of the conventional to the technical field or a claim of the present invention is be refers to grow concept and techniques region within such a range that causes no away from the present invention various modified and change can be 2000 database for each consumer. 10: number 1 wafer 20: number 2 place 22: number 1 stocker 24: mechanism 30: number 2 wafer 40: number 2 place 42: number 2 stocker 50: a transport vehicle 100: truck 200: sealed box 210: receiving space 220: insulating material 300: moving parts 310: dampening part A sealed cart is docked in a stocker in which a storage tool storing a plurality of wafers is stored in a place where a process of manufacturing or inspecting semiconductor chips from the wafers is performed. Moreover, the sealed cart comprises: a sealed box having a sealed accommodating space in which the storage tool is accommodated; and a moving unit mounted in a lower portion of the sealed box to move the sealed box. COPYRIGHT KIPO 2016 Or under trillion number semiconductor chips from the wafer is performed by inspecting a wafer is said in a place that mechanism a rack is is docked in a stocker including multi-register for storing, said inside closed is inserted to the insertion mechanism an accommodating space the opening end box; and said sealed box is mounted on a side of, including a moving section moves characterized in a hermetic truck. According to Claim 1, said insulator is sealed box is characterized in including a hermetic truck. According to Claim 1, said motion allows caster buffer unit with sensor (caster) a hermetic characterized in including a truck. Number 1 number 1 number semiconductor chips from the wafer a process inspection or under trillion a number 1 in said wafer is a rack is said to stocker number 1 has been stored in the mechanism is inserted to the insertion mechanism the opening end an accommodating space closed said box and attached to a lower portion of the sealed box it in the unit, a step docking of a trolley including; said number 1 to receiving space deceleration of said walls of the mold frame has a basis of stored and the transparent electrodes for controlling a step; number 2 number 2 number semiconductor chips from the wafer a process inspection or under trillion a number 2 is mechanism said location said receiving space the opening is formed is transported to a trolley mechanism said paused at said number 2 number 2 be stored a docked in a stocker; and a docking said number 2 stocker to components housed in one receiving space deceleration of said mechanism for depositing a step using trolley hermetic including wafer transfer method. According to Claim 4, deceleration of said walls of the mold frame has a basis of stored said number 1 to receiving space and the transparent electrodes for controlling a step providing output indicative of the information biosensor said number 2 the truck then attaching a characterized in including a hermetic trolley using wafer transfer method. According to Claim 4, said number 1 and number 2 wafers are characterized in the same kind in that very loop a hermetic trolley using wafer transfer method.
