ORGANIC LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
The present invention refers to organic light emitting element and method relates to number of bath, more particularly semiconductor device having metal line including flexible organic light emitting element and a number of flexible substrate bath method are disclosed. Organic light-emitting device (Organic Light Emitting Device, OLED) organic light emitting materials is electrically excitation (exciting) to that induces luminescence molecular element are disclosed. Electron injection depending on the type of materials comprising the organic light-emitting layer emitting the green can be. First and second wider viewing angles, fast response time, thin, low cost and high contrast (contrast) number bath such as fiber properties. Next generation flat panel display device (flat panel display device) and lighting as first and second response disclosed. The present invention has a better reliability and number if the number of organic light-emitting method number [...] bath for 30 to 60 seconds. The present invention is the improved organic light emitting element if the number and reliability than [...] number 30 to 60 seconds. The present invention is the number to one or more pipeline and number and number if not, another and number are not mentioned below may be clearly understand one skilled from the substrate are disclosed. According to an embodiment of the present invention flexible substrate and on the number of organic light-emitting organic light emitting structure said bath method form comprising a flexible substrate, said flexible substrate is coupled, number 1 number 1 polymer pattern formed on the metal layer, said number 1 polymer pattern exposed by said number 1 number 2 metal film to form a metal layer pattern formed thereon, said number 1 polymer pattern and said number 2 on the metal layer to form a gas barrier film, said number to said number 1 and number 2 gas-barrier layer pattern formed thereon on one side of the number 1 and number 2 polymer layer to expose the metal layer comprising a stand-alone polymer pattern can be one. Said number 1 metal film and said number 2 metal film can be different material. Said gas barrier silicon oxide (SiO2 ), Nitride (SiNx ), Being devoid of carbon (SiOx Ny ), Titanium oxide (TiO2 ), Zirconium oxide (ZrO2 ) Or aluminum oxide (Al2 O3 ) Can be comprising. Said gas barrier polyacrylamide, polyurethane, epoxy polymer, polyimide, polypropylene, can be a fluorine-containing polymer or silicone polymer. Said gas barrier to at least one layer of inorganic film or layer can be at least one organic layer. Said number 2 metal film can be formed using electroplating or electroless plating. Said one of said said number 1 and number 2 polymer organic light emitting structure can be formed on one face said metal film. Said flexible substrate is coupled before said number 2 metal layer is formed, said number 1 number further comprises a method for preparing a metal film can be amended. Said catalyst is palladium (Pd) can be a number. Said flexible substrate is coupled before said number 2 metal layer is formed, said number 1 polymer pattern on the surface to have hydrophobic characteristics of said performing said number 1 polymer pattern can be further surface treatment process. Said surface processing process said number 1 on the surface of said organic thin film fluoride polymer, a silicon organic film or self configuring single array panel can be formed.
A flexible substrate and said organic light emitting device according to an embodiment of the present invention comprising a flexible organic light emitting structure disposed on a substrate, said flexible substrate, a polymer layer, said polymer layer disposed on the gas-barrier properties, gas barrier film disposed on said polymer patterns and said polymer patterns exposed by said gas-barrier portion can be disposed on the lower line.
Wetting said number 1 number 1 portions and said number 1 runs in peripheral direction and are parallel to each other direction intersecting the number 2 runs in peripheral direction and are parallel to each other comprising a number 2 portions, said number 1 portions and said number 2 portions can be crossing each other.
Said polymer patterns are spaced apart from each other in the direction the number 1 direction and said number 2, said number 1 portions adjoining said number 2 and said polymer patterns, said number 2 portions adjoining said number 1 is interposed between said polymer patterns, said edge disposed on said first and second gas-barrier, said barrier further comprising a metal water level surrounding side, said number 1 portions of ends and said number 2 portions of said side barrier a fisherman can be physically connected to the end portions.
Said polymer patterns are plasma in said polymer film, said polymer film and said polymer film and said gas barrier between said polymer film and said polymer patterns copper metal and said side barrier extending between said water level can. Said polymer patterns are overlapping spaces between said number 1 portions between them said number 2 central patterns and said recess spaced center patterns, can be surrounding said metal edge pattern. Said polymer patterns are same as that of the metal wiring may have said thickness. Said polymer may have a thickness thicker than the thickness of said metal wiring patterns. According to an embodiment of the present invention, number 1 polymer patterns and number 1 number 2 metal pattern is formed on the barrier polymer patterns formed between gas, gas-barrier properties can be number 2 on polymer layer. Guiding the oxygen and moisture to penetrate into the gas barrier film across a polymer number 2, number 1 and number 2 from the second side toward polymer pattern from the second side toward metal pattern formed on the organic light emitting structure can prevent oxygen and moisture permeable. According to an embodiment of the present invention, a flexible substrate comprising metal interconnection and gas barrier film for expensive photolithographic process such as printing and without forming a plating process can be. The, flexible organic light emitting element can be manufactured at a low cost. 1A also includes a flexible substrate according to an embodiment of the present invention semiconductor device having metal line including organic light emitting plane view indicating are disclosed. The flexible substrate according to an embodiment of the present invention semiconductor device having metal line 1b also including organic light-emitting device in the chemical formula, I a-I also 1a of ' 16 cross-sectional drawing line direction are disclosed. 2A also includes a flexible substrate according to an embodiment of the present invention semiconductor device having metal line including organic light emitting plane view indicating are disclosed. 2B also includes a flexible substrate according to an embodiment of the present invention semiconductor device having metal line including organic light-emitting device in the chemical formula, I a-I also 2a of ' 16 cross-sectional drawing line direction are disclosed. Figure 8 shows a number of organic light-emitting semiconductor device having metal line including flexible substrate according to an embodiment of the present invention to also 3 also revealing the bath method is, of I a-I also 1a ' line direction cross-section 16 are disclosed. Figure 11 shows a number of organic light-emitting semiconductor device having metal line 9 also including flexible substrate according to an embodiment of the present invention to also revealing the secret key to bath method, of Figure 2 II a-II ' line direction cross-section 16 are disclosed. Advantages and features of the present invention, achieve the appended drawing method and an electronic component connected to the reference surface with specifically carry activitycopyright will in the embodiment. In the present invention refers to hereinafter however limited to the disclosure in the embodiment but can be embodied in the form of various different, in the embodiment of the present invention disclosure is to only the completely, to complete the present invention of the invention is provided to a target number for informing a person with skill in the art categories in which ball, defined by category of the present invention refers to claim only disclosed. The same references refer to the same components across special specification. The specification describes in the embodiment for the present invention the term used in which relayed a number that is even endured. In the specification, a plurality type comprises a unit in a single may be phrase will not specially mentioned. Used in specification 'includes (comprises)' and/or 'including (comprising)' handle components, steps, operation and/or element comprises at least one other components, steps, operation and/or devices does not number the presence or addition times. In addition, in the embodiment of the present invention are discussed specification the ideal example products on be described and/or plane view that excels in the cross-sectional drawing are disclosed. Substrate in drawing, description and technical content of effective for exaggerated thickness regions are disclosed. The, number bath techniques and/or tolerances of form can be modified by example degrees. Thus, the specific number of the present invention in the embodiment shown are but one type of change including process for preparing produced in accordance number are disclosed. For example, the etching area shown at right angles having an predetermined angular or round may be in the form disclosed. The, drawing exemplified regions are coarse has attribute, for example the shape for drawing exemplified areas in the region of the invention which form relayed number categories for endured. 1A also includes a flexible substrate according to an embodiment of the present invention semiconductor device having metal line including organic light emitting plane view indicating are disclosed. The flexible substrate according to an embodiment of the present invention semiconductor device having metal line 1b also including organic light-emitting device in the chemical formula, I a-I also 1a of ' 16 cross-sectional drawing line direction are disclosed. Also 1a and 1b also reference the, organic light emitting device (100) a flexible substrate (30), number 1 electrode (40), organic light emitting structure (50), number 2 electrode (60) and anvil latent heat film (70) can be comprising. Flexible substrate (30) is number 1 polymer patterns (14), metal line (16), gas-barrier properties (22), number 2 polymer membrane (24), and protective film (26) can be comprising. Protective film (26) number 2 on polymer layer (24) can be disposed. Protective film (26) can be cured polymer layer. Number 2 polymer film (24) comprising a material having a flexibility can. In one example, number 2 polymer film (24) can be thermosetting polymer or photocurable polymer. For example, number 2 polymer membrane (24) is an acrylate resin, urethane resin, polyethylene resin, polypropylene resin, polystyrene resin, polyvinyl chloride resin, polyimide resin, polyester resin, silicone resin or resin mixture including at least two or more can be. In one example, number 2 polymer film (24) can be ceramic compound is contained in the resin. The, a size of 200 nm to about 1 μm ceramic particles implementation being. Safety device may have a hollow form an intermediate ceramic particles. Number 2 polymer film (24) on gas-barrier properties (22) can be disposed. Gas-barrier properties (22) may have thinner to have flexibility. In one example, gas-barrier properties (22) consist of a material having can-crystal or epitaxial layer. For example, gas-barrier properties (22) silicon oxide (SiO2 ), Nitride (SiNx ), Being devoid of carbon (SiOx Ny ), Titanium oxide (TiO2 ), Zirconium oxide (ZrO2 ) Or aluminum oxide (Al2 O3 ) Include a single inorganic material such as can be. For example, gas-barrier (22) is polyacrylamide, polyurethane, epoxy polymer, polyimide, polypropylene, a fluorine-containing polymer, silicon polymer or the like can be a single organic material thin film. In addition, in one example, gas-barrier properties (22) includes at least one layer of inorganic material thin film to at least one layer of organic materials can be thin film multilayer thin film. Gas-barrier (22) is covered (16) can be arranged. Metal line (16) is number 1 portions (16a) and number 2 portions (16b) can be comprising. Number 1 portions (16a) into the direction (X) parallel to each other can be the number 1, number 2 portions (16b) number 2 runs in the direction (Y) can be parallel to each other. Number 1 portions (16a) and number 2 portions (16b) can be intersect one another. For example, metal line (16) materials copper, nickel, gold, silver or platinum can be comprising. Metal wiring (16) exposed by the gas barrier film (22) number 1 on portions of the polymer patterns (14) can be arranged. Number 1 polymer patterns (14) comprises a central patterns (14a) edge of the plank and (14b) can be comprising. Center patterns (14a) metal (16) number 1 of portions (16a) between metal wiring (16) of number 2 portions (16b) to fill the space between can be superimposed. An edge (14b) gas barrier film (22) can be disposed on edges of, metal line (16) may surround disclosed. An edge (14b) comprises a central patterns (14a) and can be spaced disclosed. In one example, number 1 polymer patterns (14) (t2) thickness of the metal wiring (16) can be (t1) thickness of the same. As another alternative, number 1 polymer patterns (14) thickness of the metal wiring (t2) (16) (t1) thickness of may be thicker than disclosed. Number 1 polymer patterns (14) comprising a material having a flexibility can. In one example, number 1 polymer patterns (14) can be thermosetting polymer or photocurable polymer. For example, number 1 polymer patterns (14) is an acrylate resin, urethane resin, polyethylene resin, polypropylene resin, polystyrene resin, polyvinyl chloride resin, polyimide resin, polyester resin, fluorinated organic resin, silicone resin or resin mixture including at least two or more can be. In one example, number 1 polymer patterns (14) can be ceramic compound is contained in the resin. The, a size of 200 nm to about 1 μm ceramic particles implementation being. Safety device may have a hollow form an intermediate ceramic particles. Number 1 polymer patterns (14) are one side of (5) is partially etched (16) on one surface of (7) number 1 on electrode (40) can be disposed. Number 1 electrode (40) metal (16) number 1 of portions (16a) and number 2 portions (16b) and can be vertically overlapping. Number 1 electrode (40) can be conductive material. For example, number 1 electrode (40) of indium tin oxide (ITO) transparent conductive oxide such as the, nano wire such as metal fiber, carbon fiber, conductive polymer material can be yes pin complex or the like. Number 1 electrode (40) organic light emitting structure (50) can be disposed. Organic light emitting structure (50) to the organic light emitting material, organic light-emitting layer can be plays a role. Organic light emitting structure (50) presents a dopant can be further includes organic light emitting materials is in number. As another alternative, organic light emitting structure (50) including a semiconductor material, can be P-type ohmic serves. According to an embodiment of the present invention, organic light emitting structure (50) number 2 on polymer film (24) that is located between the gas-barrier properties (22) moisture (H2 O) molecules having molecular structure consisting of polymer film greater than number 2 (24) blocking the moisture and/or oxygen infiltrated organic light emitting structure (50) moisture and/or oxygen is introduced into thereof can prevent. The, moisture and/or oxygen organic light emitting structure (50) to prevent damage to the, organic light emitting device (100) of can be improved more. Organic light emitting structure (50) number 2 on electrode (60) can be arranged. Number 2 electrode (60) conductive material, e.g., metal or transparent conductive oxide can be. Number 1 electrode (40) and number 2 electrode (60) [...] one, it will be a child node be the other. Number 2 electrode (60) disposed on, number 1 electrode (40), organic light emitting structure (50) and number 2 electrode (60) latent heat film to cover the semiconductor device (70) can be disposed. N latent heat film (70) ambient moisture from ethylene and oxygen organic light emitting structure (50) can be protecting. 2A also includes a flexible substrate according to an embodiment of the present invention semiconductor device having metal line including organic light emitting plane view indicating are disclosed. 2B also includes a flexible substrate according to an embodiment of the present invention semiconductor device having metal line including organic light-emitting device in the chemical formula, II a-II also 2a of ' 16 cross-sectional drawing line direction are disclosed. For liver deficiency described, substantially the same one in the embodiment 1 also shown in the same drawing on component is used for the code, description is given of a corresponding component dispensed the on-sensors other. Also 2a and 2b also reference the, organic light-emitting device (200) a flexible substrate (30), number 1 electrode (40), organic light emitting structure (50), number 2 electrode (60) and anvil latent heat film (70) can be comprising. Flexible substrate (30) is number 1 polymer patterns (14), metal line (16), gas-barrier properties (22), number 2 polymer film (24) and protective film (26) can be comprising. Protective film (26) number 2 on polymer layer (24) can be disposed. And, number 2 polymer film (24) number 1 in polymer patterns (14) can be arranged. Number 1 polymer patterns (14) intersecting each other number 1 direction (X) and (Y) direction number 2 can be spaced apart each other. Number 1 polymer patterns (14) are one side of (5) is number 1 polymer patterns (14) polymer film exposed by number 2 (24) from the second side toward a portion of the (3) located at a higher level than can be. Number 1 polymer patterns (14) polymer film exposed by number 2 (24) from the second side toward a portion of the (3) in a metal film (19) can be disposed. In one example, metal film (19) has a thickness of number 1 polymer patterns (t3) (14) (t2) of thicknesses may be less than disclosed. As another alternative, metal film (19) has a thickness of number 1 polymer patterns (t3) (14) (t2) can be of the same thicknesses. Metal film (19) one aspect of (8) is number 1 polymer patterns (14) are one side of (5) and can be 151m. Metal film (19) for example, copper, nickel, gold, silver or platinum can be comprising. Metal film (19) metal (16) and side barrier control unit (18) can be a. Metal line (16) is number 1 polymer patterns (14) number 2 between polymer layer (24) can be disposed on a portion of. Metal line (16) is number 1 portions (16a) and number 2 portions (16b) can be comprising. Number 1 portions (16a) number 1 and number 2 (Y) direction facing the adjacent polymer patterns (14) are arranged between the, number 1 (X) can be extending direction. Number 2 portions (16b) is number 1 (X) direction and facing each other adjacent number 1 polymer patterns (14) are arranged between the, number 2 extending direction (Y) can be. Number 1 portions (16a) and number 2 portions (16b) can be intersect one another. Side barrier control unit (18) is number 2 polymer film (24) can be disposed on edges of, side barrier control unit (18) is most quoin number 1 polymer patterns (14) antenna and (16) may surround disclosed. For example, side barrier control unit (18) may have a ring shape. Side barrier control unit (18) the metal wiring (16) number 1 of portions (16a) of ends and number 2 portions (16b) of end portions can be physically connected. Side barrier control unit (18) is number 2 polymer film (24) toward the sidewalls of the water membrane be oxygen and moisture. Gas-barrier properties (22) the number 1 polymer patterns (14) and number 2 polymer film (24) between metal wiring building (16) number 2 and polymer layer (24) and between the side barrier control unit (18) number 2 on polymer layer (24) can be extending between. Side barrier control unit (18) gas barrier film (22) can be disposed on edges of, gas-barrier properties (22) extending along the edge of the can. Metal film (19) one aspect of (8) and number 1 polymer patterns (14) are one side of (5) is made of electrode number 1 (40), organic light emitting structure (50) and number 2 electrode (60) can be arranged. And, number 2 electrode (60) disposed on, number 1 electrode (40), organic light emitting structure (50) and number 2 electrode (60) latent heat film to cover the semiconductor device (70) can be disposed. Figure 8 shows a number of organic light-emitting semiconductor device having metal line including flexible substrate according to an embodiment of the present invention to also 3 also revealing the bath method is, of I a-I also 1a ' line direction cross-section 16 are disclosed. The reference also 3, sacrificial substrate (10) number 1 on metal film (12) can be formed. Sacrificial substrate (10) includes a glass substrate, a quartz substrate, plastic substrate, silicon substrate or a metal substrate can be. Number 1 metal film (12) a sputtering deposition apparatus is, thermal deposition method, an electron beam deposition or plating method can be used in. Number 1 metal film (12) metal material, can be yes pin or conductive oxide. Metal materials comprise for example, copper, chromium, nickel, titanium, molybdenum, tungsten, manganese, is, gold, platinum, tin, silicon or an alloy including at least two or more can be. Conductive oxide for example, ITO (indium tin oxide, IZO (indium zinc oxide), Al non-doped zinc oxide, tin oxide, F non-doped tin oxide, Sb non-doped tin oxide, or ZTO comprising (zinc tin oxide) can be. Number 1 metal film (12) on the surface of the surface treatment process can be performed. Surface processing process number 1 be carry metal film (12) in a number industry, number 2 metal film (16) and number 1 polymer patterns (14) number 1 from metal film (12) can be performed to a number hereinafter for the stand-alone. Due to the surface treatment process, number 1 metal film (12) may have the surface of the hydrophobic properties. For example, plasma processing process surface treatment process, fluorinated organic coating process, a coating process can be silicon organic coating process or self configuring single array panel. E.g., e.g. plasma, oxygen plasma processing, argon plasma processing, be a nitrogen plasma processing or fluorinated carbon plasma processing. Fluorinated organics are e.g., fluoroethyl acrylate, fluoroethyl methacrylate, fluoropropyl acrylate, fluoropropyl methacrylate, fluorobutyl acrylate, fluorobutyl methacrylate, fluoropentyl acrylate or implementation being fluoropentyl methacrylate. Silicon organic e.g., Hexamethyldisilazane (HMDS) implementation being. If necessary, number 1 metal film (12) can be applied catalyst number. Catalyst number is number 1 be carry metal film (12) number 2 on metal film (16) can be used as a step for forming a reduction in the number. Catalyst number is e.g., palladium (Pd) can be comprising. The reference also 4, number 1 metal film (12) number 1 on polymer patterns (14) can be formed. Number 1 polymer patterns (14) number 1 the metal film (12) for exposing an upper portion of the upper surface of can be. Number 1 polymer patterns (14) and curing the liquid polymer layer can be formed by printing. Number 1 polymer patterns (14) for example, screen printing, gravure printing, offset printing or inkjet printing can be used in. Alternatively, number 1 polymer patterns (14) is formed on the liquid polymer, exposed polymer film by ultraviolet light through the mask pattern can be formed by strip portions. In one example, number 1 polymer patterns (14) can be thermosetting polymer or photocurable polymer. For example, number 1 polymer patterns (14) is an acrylate resin, urethane resin, polyethylene resin, polypropylene resin, polystyrene resin, polyvinyl chloride resin, polyimide resin, polyester resin, fluorinated organic resin, silicone resin or resin mixture including at least two or more can be. In one example, number 1 polymer patterns (14) can be ceramic compound is contained in the resin. The, a size of 200 nm to about 1 μm ceramic particles implementation being. Safety device may have a hollow form an intermediate ceramic particles. Number 1 polymer patterns (14) on the surface of the surface treatment process can be further performs. Surface treatment process number 2 are subsequently be formed in a metal film (16) is number 1 polymer patterns (14) can be formed on proceeds to prevent. Surface processing process number 1 polymer patterns (14) on the surface of organic fluoride coating, organic coating or self configuring single array panel comprising silicon coating can be. Fluorinated organics are e.g., fluoroethyl acrylate, fluoroethyl methacrylate, fluoropropyl acrylate, fluoropropyl methacrylate, fluorobutyl acrylate, fluorobutyl methacrylate, fluoropentyl acrylate or implementation being fluoropentyl methacrylate. Silicon organic e.g., Hexamethyldisilazane (HMDS) implementation being. The, number 1 polymer patterns (14) has a hydrophobic characteristics of, number 1 metal film (12) because the hydrophilic properties, fluorinated organic hydrophobic properties, organic or self configuring single array panel number 1 is silicon polymer patterns (14) can be applied selectively on the surface of. The reference also 5, number 1 polymer patterns (14) metal film exposed by number 1 (12) number 2 on the upper side of a part of a metal film (16) can be formed. Number 2 metal film (16) is number 1 polymer patterns (14) can be filling a space between. In one example, number 2 metal film (16) is number 1 polymer patterns (14) can be formed to have same as that of the. As another alternative, number 2 metal film (16) is number 1 polymer patterns (14) can be formed with a thickness less than that of thickness. Number 2 metal film (16) is electroless plating or electrolytic plating layer can be formed. Chemical reactions on a metal plating by the electroless plating method, prior to the aforementioned number 1 metal film (12) is formed on the metal ions used in the electroless plating catalyst number one selected from reduced, number 1 metal film (12) number 2 on the surface of the metal film (16) can be formed. Number 1 be carry metal film (12) in a number industry, number 2 metal film (16) number 1 from metal film (12) so as to be wetting ability for thermally processing the number hereinafter, number 2 metal film (16) is number 1 metal film (12) and other metal materials can be formed. Number 2 metal film (16) for example, copper, nickel, gold, silver or platinum can be comprising. The reference also 6, number 1 polymer patterns (14) and number 2 metal film (16) on gas-barrier properties (22) can be formed. For example, gas-barrier properties (22) silicon oxide (SiO2 ), Nitride (SiNx ), Being devoid of carbon (SiOx Ny ), Titanium oxide (TiO2 ), Zirconium oxide (ZrO2 ) Or aluminum oxide (Al2 O3 ) Include a single inorganic material such as can be. In addition, gas-barrier (22) is polyacrylamide, polyurethane, epoxy polymer, polyimide, polypropylene, a fluorine-containing polymer, silicon polymer or the like can be a single organic material thin film. Gas-barrier properties (22) includes at least one layer of inorganic material thin film multilayer thin film and to at least one layer of organic materials composed can be. For flexible, gas-barrier properties (22) can be formed so as to thin. According to an embodiment of the present invention, moisture (H2 O) molecules having molecular structure consisting of polymer film greater than number 2 (24; also 5 reference) penetration of moisture and/or oxygen into the through element to prevent, number 2 polymer film (24) for forming a gas barrier film (22) can be formed. The, number 2 polymer film (24) moisture and/or oxygen penetrated through gas barrier film (22) is cut off by, 7 also shown in number 1 polymer patterns (14) and number 2 metal film (16) are one side of (5, 7) formed on the organic light emitting structure (50) to prevent moisture and/or oxygen penetration thereof can. The reference also 7, gas-barrier properties (22) number 2 on polymer layer (24) can be formed. Number 2 polymer film (24) gas barrier film (22) and then cured on liquid polymer layer can be formed. Number 2 polymer film (24) for example, screen printing (screen printing), slot die coating (Slot die coating), spin coating (spin coating), bar (bar coating) coating, doctor blade coating (doctor blade coating), or spray coating (spray coating) or the like can be formed by using. In one example, number 2 polymer film (24) can be thermosetting polymer or photocurable polymer. For example, number 2 polymer membrane (24) is an acrylate resin, urethane resin, polyethylene resin, polypropylene resin, polystyrene resin, polyvinyl chloride resin, polyimide resin, polyester resin, silicone resin or resin mixture including at least two or more can be. In one example, number 2 polymer film (24) can be ceramic compound is contained in the resin. The, a size of 200 nm to about 1 μm ceramic particles implementation being. Safety device may have a hollow form an intermediate ceramic particles. Gas-barrier properties (22) and number 2 polymer film (24) in order to enhance the adhesion strength between, number 2 polymer film (24) before forming, gas-barrier properties (22) on the surface of the plasma process can be performed. Plasma process for example, be a oxygen plasma process. Number 2 polymer film (24) on protective film (26) can be further formed. Protective film (26) can be cured polymer layer. Protective film (26) are subsequently the number 1 on the basis of metal film (12) number of process or volatile organic light emitting positive when pore number, number 2 force polymer layer (24) is formed with a slit can prevent a protective function. The reference also 8, number 1 polymer patterns (14) and number 2 metal film (16) number 1 from metal film (12) can be a stand-alone number. The, number 1 metal film (12) compiling a number 1 in contact with polymer patterns (14) are one side of (5) and number 2 metal film (16) on one surface of (7) can be exposed. Number 1 metal film (12) is a stand-alone external force number number 1 polymer patterns (14) and number 2 metal film (16) number 1 from metal film (12) a sacrificial substrate (10) can be separated with a. Number 1 metal film (12) is sliding along the volatile number, number 2 metal film (16) and gas barrier film (22) including a flexible substrate (30) can be formed. Flexible substrate (30) protective film (26), number 2 polymer membrane (24), gas-barrier properties (22), number 2 metal film (16) and number 1 polymer patterns (14) can be comprising. According to an embodiment of the present invention, a flexible substrate using printing and plating process comprising metal interconnection and gas barrier film by forming, flexible organic light emitting element can be number low cost high pressure liquid coolant. The reference 1a and 1b also again also, flexible substrate (30) is made of number 1 electrode (40), organic light emitting structure (50) and number 2 electrode (60) can be formed. Number 1 polymer patterns (14) are one side of (5) and number 2 metal film (16) on one surface of (7) number 1 on electrode (40) can be formed. Number 1 electrode (40) can be conductive material. For example, number 1 electrode (40) of indium tin oxide (ITO) transparent conductive oxide such as the, nano wire such as metal fiber, carbon fiber, conductive polymer material can be yes pin complex or the like. Number 1 electrode (40) organic light emitting structure (50) can be formed. Organic light emitting structure (50) to the organic light emitting material, organic light-emitting layer can be plays a role. Organic light emitting structure (50) presents a dopant can be further includes organic light emitting materials is in number. As another alternative, organic light emitting structure (50) including a semiconductor material, can be P-type ohmic serves. Organic light emitting structure (50) number 2 on electrode (60) can be formed. Number 2 electrode (60) conductive material, e.g., metal or transparent conductive oxide can be. Number 1 electrode (40) and number 2 electrode (60) [...] one, it will be a child node be the other. And, number 2 electrode (60) latent heat on film (70) can be formed. Latent heat film (70) is number 2 electrode (60) of the top and both sidewalls, organic light emitting structure (50) and sidewalls of the number 1 electrode (40) of both sidewalls thereof can cover. Figure 11 shows a number of organic light-emitting semiconductor device having metal line 9 also including flexible substrate according to an embodiment of the present invention to also revealing the secret key to bath method, of Figure 2 II a-II ' line direction cross-section 16 are disclosed. For liver deficiency described, according to an embodiment of the present invention is represented by the same element number of organic light-emitting the same drawing code described method bath is used, redundant description dispensed the on-sensors other. The reference also 9, sacrificial substrate (10) number 1 on metal film (12) can be formed. Number 1 metal film (12) number 1 on polymer patterns (14) can be formed. Number 1 polymer patterns (14) number 1 the metal film (12) on, direction (X) and (Y) direction crossing each other number 1 number 2 can be disposed spaced apart. Number 1 polymer patterns (14) exposed by number 1 metal film (12) in a metal film portion of (19) can be formed. In one example, metal film (19) is number 1 polymer patterns (14) thickness is thinner than can be. As another alternative, metal film (19) is number 1 polymer patterns (14) can be same as that of the metal layer. Metal film (19) is electroless plating or electrolytic plating layer can be formed. Number 1 be carry metal film (12) in a number industry, metal film (19) number 1 from metal film (12) so as to be wetting ability for thermally processing the number hereinafter, metal film (19) is number 1 metal film (12) and other metal materials can be formed. Metal film (19) for example, copper, nickel, gold, silver or platinum can be comprising. The reference also 10, gas-barrier properties (22) metal film (19) one aspect of (8) opposite the other surface (9), metal film (19) polymer patterns exposed by number 1 (14) of both sidewalls, and number 1 polymer patterns (14) are one side of (5) opposite the [...] (4) can be formed to cover a [khen foam part. And, gas-barrier properties (22) number 2 on polymer layer (24) can be formed. Number 2 polymer film (24) gas barrier film (22) and cover the surface of, gas-barrier properties (22) on, number 1 polymer patterns (14) can be filling a space between. And, number 2 polymer film (24) on protective film (26) can be formed. The reference also 11, number 1 polymer patterns (14) metal film (19) number 1 from metal film (12) can be a stand-alone number. The, number 1 metal film (12) compiling a number 1 in contact with polymer patterns (14) are one side of (5) metal film (19) one aspect of (8) can be exposed. Number 1 metal film (12) is a stand-alone external force number number 1 polymer patterns (14) metal film (19) number 1 from metal film (12) a sacrificial substrate (10) can be separated with a. Number 1 metal film (12) is sliding along the volatile number, flexible substrate (30) protective film (26), number 2 polymer membrane (24), gas-barrier properties (22), metal film (19) and number 1 polymer patterns (14) can be comprising. The 2a and 2b also again also reference, number 1 polymer patterns (14) are one side of (5) metal film (19) one aspect of (8) is made of number 1 electrode (40), organic light emitting structure (50), number 2 electrode (60) and capsule-on film (70) can be formed sequentially. Or more, of the present invention in the embodiment described with reference to the attached drawing but, in the present invention is provided to the present invention is technical idea or person with skill in the art without changing its essential features can be understand other specific embodiment can form are disclosed. In the embodiment described above the exemplary non-limiting which is understood to all sides must substrate. A method for manufacturing an organic light emitting device according to an embodiment of the present invention includes the steps of: forming a flexible substrate; and forming an organic light emitting structure on the flexible substrate. The step of forming a flexible substrate includes the steps of: forming a first polymer pattern on a first metal film; forming a second metal film on a part of the first metal film exposed by the first polymer pattern; forming a gas barrier film on the second metal film and the first polymer pattern; forming a second polymer film on the gas barrier film; and exposing one side of the first polymer pattern and one side of the second metal film by removing the first metal film. Accordingly, the present invention can prevent the penetration of oxygen and moisture. COPYRIGHT KIPO 2017 Forming a flexible substrate; and forming said organic light emitting structure comprising a flexible substrate, said flexible substrate is coupled: number 1 number 1 polymer pattern formed on the metal layer; said number 1 polymer pattern metal layer exposed by the metal layer pattern formed thereon to form said number 1 number 2; said number 1 polymer pattern and said number 2 on the metal layer to form a gas barrier film; number 2 on said gas-barrier polymer layer pattern formed thereon; and said number 1 to number 1 and number 2 number metal layer including exposing the metal layer second side toward one side of a stand-alone polymer pattern number of organic light-emitting bath method. According to Claim 1, said number 1 number of organic light-emitting metal film and said number 2 different materials including metal film bath method. According to Claim 1, said gas barrier silicon oxide (SiO2 ), Nitride (SiNx ), Being devoid of carbon (SiOx Ny ), Titanium oxide (TiO2 ), Zirconium oxide (ZrO2 ) Or aluminum oxide (Al2 O3 ) Including a number of organic light-emitting bath method. According to Claim 1, said gas barrier polyacrylamide, polyurethane, epoxy polymer, polyimide, polypropylene, a fluorine-containing polymer or silicone polymer including number of organic light-emitting bath method. According to Claim 1, said gas barrier to at least one layer of inorganic film or at least one layer of organic layer including number of organic light-emitting bath method. According to Claim 1, said number 2 metal film electroplating or electroless plating bath method formed by using a number of organic light emitting devices. According to Claim 1, said organic light emitting structure said number 1 number 2 heat by said metal film are formed on one face said organic light emitting polymer pattern number of bath method. According to Claim 1, before said number 2 metal layer is formed on said flexible substrate is coupled, said number 1 number catalyst metal particles is performed further amended including number of organic light-emitting bath method. According to Claim 8, said method including palladium (Pd) catalyst number is a number of organic light-emitting bath. According to Claim 1, before said number 2 metal layer is formed on said flexible substrate is coupled, said number 1 polymer pattern on the surface to have hydrophobic characteristics of said surface treatment process further including performing said number 1 polymer pattern number of organic light-emitting bath method. According to Claim 10, said surface processing process said number 1 on the surface of said organic thin film fluoride polymer, to form a number of organic light-emitting silicon organic film or self configuring single array panel including bath method. Flexible substrate; and said comprising a flexible organic light emitting structure disposed on a substrate, said flexible substrate is: polymer film; a polymer layer disposed on said gas-barrier properties; polymer patterns disposed on said gas-barrier properties; and said polymer patterns exposed by said gas-barrier metal including a portion disposed on the organic light emitting device. According to Claim 12, wetting said number 1 number 1 portions and said number 1 runs in peripheral direction and are parallel to each other direction intersecting the number 2 runs in peripheral direction and are parallel to each other comprising a number 2 portions, said number 1 portions and said number 2 portion are intersected each other organic light emitting devices. According to Claim 13, said polymer patterns are spaced apart from each other in the direction the number 1 direction and said number 2, said number 1 portions adjoining said number 2 and said polymer patterns, said number 2 portions adjoining said number 1 is interposed between said polymer patterns, said edge disposed on said first and second gas-barrier, said barrier further comprising a metal water level surrounding side, said number 2 ends and portions of said side barrier a fisherman said number 1 portions of an organic light emitting devices physically connected to the end portions. According to Claim 14, said plasma in said polymer patterns of the polymer film, said polymer film and said polymer film and said gas barrier between said polymer film and said polymer patterns copper metal and said side barrier extending between said water level organic light emitting devices. According to Claim 13, said polymer patterns are portions overlapping spaces between them said number 2 between said number 1 central patterns and said recess spaced center patterns, said pattern including the surrounding edges of metal organic light emitting device. According to Claim 12, said polymer having a thickness same as that of the metal wiring patterns said organic light emitting device. According to Claim 12, said polymer having a thickness thicker than the thickness of said metal wiring patterns organic light emitting devices. According to Claim 12, said gas barrier polyacrylamide, polyurethane, epoxy polymer, polyimide, polypropylene, a fluorine-containing polymer or silicone polymer including organic light-emitting device. According to Claim 12, said gas barrier to at least one layer of inorganic film or at least one layer of organic layer including organic light-emitting device.
