Physical analysis method, sample for physical analysis and preparing method thereof

09-04-2024 дата публикации
Номер:
US0011955312B2
Принадлежит: Materials Analysis Technology Inc.
Контакты:
Номер заявки: 60-04-1756
Дата заявки: 23-12-2021







Цитирование НПИ

324/762.02
356/237.4
382/145
428/161
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Kang-Ping Peng, Ya-Chi Liu, I-Feng Lin, Chir-Chien Lin, Sho-Wethuang, and Chao-Cheng Ting; “The development of low-temperature atomic layer deposition of HfO 2 for TEM sample preparation on soft photo-resist substrate”; Jul. 19, 2018(Jul. 19, 2018); URL: http://ieeexplore.ieee.org/stampPDF/getPDF.jsp?tp=&arnumber=8452177&ref=aHR0cHM6Ly9pZWVleHBsb3JILmllZWUub3JnL2RvY3VtZW50Lzg0NTlxNzc=2018 IEEE International Symposium (IPFA), Jul. 16-19, 2018.
Sharmila M. Mukhopadhyay; “Sample Preparation for Microscopic and Spectroscopic Characterization of Solid Surfaces and Films” In: “Sample Preparation Techniques in Analytical Chemistry”; Sep. 19, 2003(Sep. 19, 2003); John Wiley & Sons, Inc., Hoboken, NJ, USA; vol. 162; pp. 377-411.
Yi Qiang Shen, Li Hong Li, Irene Tee, Kok Wah Lee, Ye Chen, Jie Zhu & Si Ping Zhao; “A study of coating techniques for ultra-thin film X-TEM sample preparation”; 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), IEEE, Jul. 4, 2017(Jul. 4, 2017), pp. 1-4.
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