ИЗДЕЛИЕ ИЗ СТАЛИ С ДВУМЯ СЛОЯМИ РАЗНОЙ ТВЕРДОСТИ И СПОСОБ ЕГО ИЗГОТОВЛЕНИЯ

Изобретение относится к области металлургии. Для повышения механических и баллистических свойств получают стальное изделие, которое содержит первую закаливаемую на воздухе легированную сталь, имеющую первую твердость, металлургически связанную со второй закаливаемой на воздухе легированной сталью, имеющей вторую твердость. Способ изготовления стального изделия из двух слоев разной твердости включает создание первого компонента из легированной стали, закаливаемой на воздухе, который содержит первую сопрягаемую поверхность и имеет твердость первого компонента, и создание второго компонента из легированной стали, закаливаемой на воздухе, который содержит вторую сопрягаемую поверхность и имеет твердость второго компонент. Первый компонент из закаливаемой на воздухе легированной стали металлургически соединен со вторым компонентом из закаливаемой на воздухе легированной стали, для образования металлургически соединенного пакета. Металлургически соединенный пакет подвергают горячей прокатке для ...

СПОСОБ ИЗГОТОВЛЕНИЯ ПОЛОЙ ЛОПАТКИ ДЛЯ ГАЗОТУРБИННОГО ДВИГАТЕЛЯ

Способ может быть использован при изготовлении полой лопатки для газотурбинного двигателя, содержащий ножку и перо. Изготавливают две наружные детали путем ковки первичного элемента, образующего, по меньшей мере, перьевую часть наружной детали и, по меньшей мере, одного вторичного элемента, предназначенного для образования, по меньшей мере частично, нижней части наружной детали, относящейся к ножке. Соединяют каждый вторичный элемент с первичным элементом для получения наружной детали. Две наружные детали соединяют между собой диффузионной сваркой. Способ позволяет предварительно получить отдельные элементы наружных деталей, составляющих лопатку, каждый из которых имеет относительно равномерную толщину, с последующим их соединением, что обеспечивает снижение расходов по изготовлению полых лопаток за счет экономии металла и отказа от механической обработки. 6 з.п. ф-лы, 9 ил.

ФОЛЬГА ИЗ НЕРЖАВЕЮЩЕЙ СТАЛИ И НОСИТЕЛЬ КАТАЛИЗАТОРА ДЛЯ УСТРОЙСТВА ОЧИСТКИ ВЫХЛОПНОГО ГАЗА, ИСПОЛЬЗУЮЩИЙ ЭТУ ФОЛЬГУ

Изобретение относится к области металлургии, а именно к фольге из нержавеющей стали, используемой в носителе катализатора устройства очистки выхлопного газа автомобиля. Фольга выполнена из нержавеющей стали, содержащей, в мас.%: 0,05 или меньше С, 2,0 или меньше Si, 1,0 или меньше Мn, 0,003 или меньше S, 0,05 или меньше Р, 25,0 - 35,0 Сr, 0,05 - 0,30 Ni, 3,0 - 10,0 Аl, 0,10 или меньше N, 0,02 или меньше Ti, 0,02 или меньше Nb, 0,02 или меньше Та, 0,005 - 0,20 Zr, 0,02 или меньше Се, 0,03 - 0,20 РЗЭ (редкоземельного элемента), исключая Се, 0,5 - 6,0 в сумме по меньшей мере одного из Мо и W, Fe и случайные примеси остальное. Стальная фольга имеет высокую прочность при высоких температурах, превосходную стойкость к окислению при высоких температурах и превосходную стойкость к солевой коррозии. 2 н. и 5 з.п.ф-лы, 4 ил., 2 табл., 1 пр.

СПОСОБ ДИФУЗИОННОГО СОЕДИНЕНИЯ ДЛЯ МИКРОКАНАЛЬНЫХПЛАСТИН

... 1. Способ соединения микроканальной пластины и диэлектрического изолятора, включающий следующие этапы: на сопрягаемые поверхности микроканальной пластины (МКП) и диэлектрического изолятора наносят тонкопленочное покрытие из соответствующего металла, выбранного из условия оптимальной диффузии при повышенной температуре и давлении; взаимно состыковывают металлизированные МКП и диэлектрический изолятор и помещают их в соединительное устройство, после чего прикладывают к совмещенным наружным поверхностям МКП и диэлектрического изолятора соответствующее усилие сжатия, достаточное для инициирования диффузионного процесса соединения при выбранной температуре; соединительное устройство, в котором находятся зафиксированные металлизированные МКП и диэлектрический изолятор, помещают в вакуумную термокамеру для ускорения диффузионного процесса соединения между МКП и диэлектрическим изолятором. 2. Способ по п.1, отличающийся тем, что металл для нанесения тонкой пленки выбран из группы металлов, состоящей ...

ТИТАНОВЫЙ УЗЕЛ ЛЕТАТЕЛЬНОГО АППАРАТА И СПОСОБ ЕГО ИЗГОТОВЛЕНИЯ СВЕРХПЛАСТИЧЕСКИМ ФОРМОВАНИЕМ

... 1. Способ изготовления конструктивного узла с заданной конфигурацией посредством сверхпластического формования пакета листов, в котором: ! формируют пакет, содержащий первый и второй титановые листы, сложенные в виде стопы, причем первый лист имеет размер зерна по меньшей мере примерно вдвое больший, чем размер зерна второго листа, ! нагревают пакет по меньшей мере до температуры сверхпластического формования второго листа и ! осуществляют сверхпластическое формование второго листа пакета до заданной конфигурации с получением при этом указанного узла. ! 2. Способ по п.1, в котором при осуществлении указанного формирования пакета используют первый лист с размером зерна более примерно 5 мкм и второй лист с размером зерна менее примерно 2 мкм. ! 3. Способ по п.1, в котором при осуществлении указанного формирования пакета используют первый лист с размером зерна более примерно 8 мкм и второй лист с размером зерна примерно между 0,8 и 1,2 мкм. ! 4. Способ по п.1, в котором при осуществлении указанного ...

АДДИТИВНОЕ ИЗГОТОВЛЕНИЕ, ОБЕСПЕЧИВАЮЩЕЕ ВЫСОКОТЕМПЕРАТУРНУЮ ПЛАСТИЧНОСТЬ И УВЕЛИЧЕННОЕ ВРЕМЯ ДО РАЗРУШЕНИЯ

Joining esp. aluminium@ to steel

Joining of different metals, esp. aluminium to high grade steel, is carried out by: (a) inserting aluminium sheets (1, 3) and a high grade steel body (2) in the cold condition into a tool space (4); (b) effecting heat transfer in conventional manner under the action of pressure; and (c) after additional heating to just below the aluminium melting point via heated upper and lower tools (5, 6), compressing the sheets (1, 3) and body (2) to form a sandwich packet.

Verfahren zur automatischen Bandmontage.

Verfahren und Vorrichtung zur "Flip-Chip" Montage eines elektronischen Bauteils

Vorrichtung zur Aufnahme und Führung einer Verbindungseinrichtung

A device (10) for holding and guiding a tool component (24), especially a joining component, with a feed device movable by an adjuster (15) along a feed axis (21) and a holding device (12) movable along an axis (23) in such a way that the holding device (12) can move in relation to the feed device (11). There is a force measuring device (28) on the feed device (11) and an elastic component (26) between the force measuring device (28) and the holding device (12), so that the elastic component (26) is deformed during a relative movement between the force measuring device (28) and the holding device (12).

VERFAHREN ZUM ABDICHTEN VON UMHUELLUNGEN FUER ELEKTRISCHE TEILE

A method of diffusion bonding

A Method of Manufacturing Bimetallic Blanks.

... 1,197,764. Making composite sheet, welding by fusion or pressure. INSTITUT ELEKTROSVARKI IM. E.O. PATONA. 11 Dec., 1967, No. 56148/67. Headings B3A and B3R. In making a bimetallic blank consisting of a cladding 2 and a base 1 of air hardening steel, a facing 5 of low carbon steel, i.e. 0.1% max. carbon, is applied around the area of the base 1 to be clad, the base 1 is annealed and the cladding 2 is welded at its edge to the facing 5. The facing 5 is applied, e.g., by hot-pressing or submerged arc welding using a strip electrode with preheating, to a base 1 consisting of a forging or ingot of Cr-Ni-Mo steel, and the base is annealed to remove the local hardening caused by welding. A cladding 2 of high-alloy steel, e.g., austenitic Cr-Ni steel, is surfaced with a layer of nickel or pure iron by say electroplating. The edge of the cladding 2 is welded to the facing 5 by submerged arc welding with austenitic steel electrode. The blank is subsequently hot rolled. The base 1 may or may not be ...

HARD SURFACE COMPOSITE PARTS.

A die set for welding U-shaped cooling fins to a base plate

A die set for welding a plurality of U-shaped cooling fins 20 to a base plate of a heat sink, comprises a first die seat 30 for receiving the base plate 32, and a second die seat 40 having elongate members 43 for contacting the cooling fins. Pressing means 41 are provided for pressing the elongate members, which in turn press planar base portions 21 of the cooling fins into contact with the base plate. Heating means are also provided in the elongate members for heating the base portions of the cooling fins so as to weld them to the base plate.

Heat exchanger and method of making a heat exchanger

A heat exchanger comprises a plurality of layers of tubes. A first layer of tubes (13) is laid onto a base plate (10) so that the tubes lie parallel to side walls (12A, 12B). A similar layer running at right angles to the first and sitting on an intermediate plate (20), is laid on top of the first layer. The packing is arranged such that when heat and loading is applied to the composite structure in a vacuum, the tubes (13) are deformed and are bonded to the plates with the sidewalls ( 12A, 12B ) being bonded to the plate above.

Heat exchanger

A heat exchanger comprises at least one layer (13, 33) of substantially parallel conduits laid on a base plate (11). Two sidewalls (12A, 12B) are positioned on the base plate (11) with the conduits (13) lying between and substantially parallel to the sidewalls (12A, 12B). The sidewalls are formed by stacking a plurality of flat shims (12C, 12D, 12E) on the base plate (11) and the height of the sidewalls (12A, 12B) so formed is such that the conduits (13) extend above the sidewalls (12A, 12B). Atop plate (20, 40) is positioned on the so-extending upper surfaces of the conduits (13, 33). Heat and loading are applied to the composite structure so formed while in a vacuum to deform the conduits (13, 33) to reduce their height, whereby the conduits bond to the plates (11, 20, 40). The conduits may be arranged in a plurality of groups (figure 5) separated by spacer bars (206).

A method of manufacturing an article by diffusion bonding and superplastic deformation

A method of manufacturing a gas turbine engine fan blade (10) comprises forming three metal workpieces (30,32,34). The metal workpieces (30,32,34) are assembled into a stack (36) so that the flat surfaces (38,42,46,48) are in mating abutment. Heat and pressure is applied across the thickness of the metal workpieces (30,32,34) to diffusion bond the metal workpieces (30,32,34) together to form an integral structure (80). The integral structure (80) is upset forged at one end (58) to produce an increase in thickness (82) for forming the blade root (26). The upset forged integral structure (80) is then hot creep formed and superplastically formed to produce the required aerofoil shape and the thickened end (82) is machined to form the blade root (26). The method enables thinner metallic workpieces with better microstructure to be used and increases the yield of metallic workpieces.

Device for blocking-off part of interior of a pipe

A method of manufacture of an aircraft landing gear component

Method of manufacturing an aerofoil

A METHOD OF MANUFACTURING AN ARTICLE BY SUPERPLASTIC FORMING AND DIFFUSION BONDING

Flat plate heat exchanger

Method for interconnecting tubulars by forge welding.

LASER BEAM PROCESSING PROCEDURE

PRESSE MIT EINEM BLECH UND EIN BLECH AUS STAHL

PROCEDURE FOR THE DIFFUSION CONNECTING OF A MIKROKANALPLATTE WITH A MULTI-LAYER CERAMIC(S) BODY; DIFFUSION-CONNECTED MICRO-CHANNEL DISK BODY ARRANGEMENT

PROCEDURE FOR THE DIFFUSION CONNECTING OF A MIKROKANALPLATTE WITH A MULTI-LAYER CERAMIC(S) BODY; DIFFUSION-CONNECTED MICRO-CHANNEL DISK BODY ARRANGEMENT

Method for making a double-walled cooking vessel by hot stamping, and resulting vessel

Manifold for a tube bundle heat exchanger for large product pressures, method for producing a tube bundle heat exchanger comprising a manifold of said type and use of a tube bundle heat exchanger for large product pressures with said type of manifold in a spray drying system

The invention relates to a manifold (1) with a circular cross-section having a deviation angle of 180 degrees for a tube bundle heat exchanger (100) for large product pressures, having a first and a second flange (2, 3) on each inlet (E) and outlet (A) of the manifold (1), in addition to a method for producing a tube bundle heat exchanger (100) comprising said type of manifold (1) and to the use of a tube bundle heat exchanger (100) for large product pressure having said type of manifold (1) in a spray drying system. The aim of the invention is to produce a manifold for a tube bundle heat exchanger for large product pressure, which has, amongst other things, the required strength and sustainable dimensional accuracy and is optimized in terms of flow technology during the course of the production thereof. A manifold (1) of said type can be achieved due to the following: the manifold (1) consists of two manifold halves (1.1, 1.2) which are respectively made of a single piece such that each ...

WELDING UNIT FOR WELDING TOGETHER TWO RAILS OF A TRACK, AND METHOD

A welding unit (1) for welding two rails (2) of a track comprises, on a unit half (4), an air nozzle (13) with a temperature sensor (14). Immediately after a welding burr (11) is sheared off, a glowing weld joint can be cooled in a controlled manner by supplying compressed air via a cooling opening (18) of the air nozzle (13). This makes it possible to carry out an optimal welding of head-hardened rails (2).

PROCESS FOR MOUNTING MINIATURE ELECTRONIC COMPONENTS WITH WELD CONNECTION TABS ON A FLEXIBLE SUBSTRATE

L'invention concerne le montage, sur un substrat souple (6), de composants électroniques miniatures du type "beam lead". Elle a pour objet un procédé de montage consistant, après avoir soudé une première patte de connexion (2) d'un composant (1) sur le substrat (6), à cambrer chacune des autres pattes de connexion (3) du composant considéré (1) pendant fleur soudage en appuyant la patte de connexion considérée (3) sur une plage métallisée (5) du substrat (6) au moyen d'une pointe (10) d'un outil de soudage tout en effectuant avec cette dernière pointe (10) un mouvement de rapprochement vers le corps du composant considéré (1) avant de procéder au soudage proprement dit. Grâce à ce procédé de montage, les composants électroniques "beam lead" ne sont plus plaqués au substrat avec leurs pattes de connexion en extension mais arqués sur ces dernières, ce qui leur procure une liberté de débattement leur permettant d'absorber les contraintes mécaniques en s'aplatissant plus ou moins sur le substrat ...

CONSTRUCTION OF HOLLOW ZINC DIE-CASTING BY THIXOTROPIC WELDING

A method for manufacturing a plumbing fixture by thixotropic welding.

DEVICE FOR SOLID STATE JOINING OF LIGHT METALS

A device for solid state joining of light metals like aluminium is described. The device utilizes the principle of continuous extrusion to add a string of filler metal into a groove separating the components to be joined, and shear deformation for surface oxide removal in the groove. The device comprises a rotating drive spindle (13) terminated in a drive spindle head (14). A groove with the shape of a circular arc constituting an extrusion chamber (16) is machined in the outer surface (15) of the drive spindle head (14), the extrusion chamber (16) being limited radially outwards by a stationary annular metal shoe (17) surrounding the drive spindle head (14), the extrusion chamber (16) being terminated by an integrated (fixed) or replaceable abutment member (18) for diverting aluminium from its circular movement in the extrusion chamber (16) through a die orifice (19).

METHOD AND MACHINE FOR FORGE WELDING OF TUBULAR ARTICLES AND EXOTHERMIC FLUX MIXTURE AND METHOD OF MANUFACTURING AN EXOTHERMIC FLUX MIXTURE

A method of forge welding includes placing at least two components (1, 2) for welding together, adjacent each other and with an exothermic flux mixture (8) placed between the components. The exothermic flux mixture (8) is heated to initiate an exothermic reaction and the faying surfaces (12) of the two components are pressed together. The components being welded may be tubular, in particular pipes. Apparatus (20) for the method of forge welding and exothermic flux mixtures for the method of forge welding are also provided.

HOLLOW, INTEGRAL ASYMMETRICAL METAL STRUCTURE SUCH AS AN AIRCRAFT WING SLAT TRAILING EDGE AND METHOD OF MANUFACTURE

A hollow, integral asymmetrical metal structure, e.g. an aircraft wing slat trailing edge, including two gradually diverging outer skins (16, 18) with differing curvatures joined together at one edge (20). The structure further includes internal reinforcements defining pairs of cells (26, 28) separated by an intermediate partition. The structure is produced by diffusion welding and superplastic moulding without opening the die. To take into account the dissymmetry, portions (40, 42) are cut out of the skin (18) that is elongated the most during forming and the cut portions (44, 46) are attached to the other skin (16).

Bonded Pipe and Method for Bonding Pipes

METHOD FOR BONDING DUAL-PHASE STAINLESS STEEL

The method provides a diffusion-bonding of dual-phase stainless steel material having excellent strength and corrosion. The method includes: cold-working a material to be bonded so as to enhance the proof stress; inserting into the bonding portion an insert material; applying pressure thereto while performing shielding by mixed nitrogen/argon gas; heating the restricted bonding portion; cooling at a restricted rate; so as to form a bonded portion having the ferritic phase percentage of 30-70% by volume.

TURBINE BLADES MADE FROM MULTIPLE SINGLE CRYSTAL CAST SUPERALLOY SEGMENTS

Large gas turbine blades (10) made from separate cast segments (12, 14. 16, 18) of superalloys are disclosed. The turbine blade is designed such that bond lines between adjacent segments are placed in low stress regions of the blade. The cast superalloy segments of the blades are aligned and fitted together with specified tolerances. The turbine blade segments are then joined by transient liquid phase bonding, followed by a controlled heat treatment which produces the desired microstructure in the bond region. The method allows for the production of large, high quality turbine blades (10) by joining small, high quality cast superalloy sections (12, 14, 16, 18), in comparison with prior attempts to cast large turbine blades as single pieces which have produced very low yields and high individual component costs.

Verfahren zum Herstellen eines Verbindungsstückes zum Verbinden elektrischer Leiter und das nach dem Verfahren hergestellte Verbindungsstück.

Verfahren und Vorrichtung zum elektrisch leitenden Verbinden von kunststoffbeschichteten Metallbändern für Kabel

Procédé de compression à chaud et dispositif pour la mise en oeuvre du procédé

Procédé pour la liaison simultanée des plots de connexion d'un circuit électronique sous forme de pastille à des conducteurs et machine pour sa mise en oeuvre

METHOD FOR WELDING A ELECTRICAL COMPONENT WITH A SET OF BOND FINGERS AS WELL AS MACHINE AND TAPE FOR CARRYING OUT SAID METHOD.

Method for the metallurgical to fixedcondition-connect different high temperature materials and article made therewith.

Verfahren zum Zusammenfügen unähnlicher Hochtemperaturlegierungen werden zusammen mit Artikeln (100), wie aerodynamischen Turbinenprofilen, die durch das Verfahren hergestellt werden, bereitgestellt. Das Verfahren umfasst das Einfügen eines Barrierematerials zwischen ein erstes Segment (110) und ein zweites Segment (120), um einen Segmentzusammenbau zu bilden. Das erste Segment umfasst ein Titanaluminid-Material und das zweite Segment umfasst eine Nickellegierung. Das Barrierematerial umfasst ein primäres konstitutives Element, das in dem Barrierematerial in einer Konzentration von mindestens etwa 30 Gewichtsprozent des Barrierematerials vorliegt und das primäre konstitutive Element ist ein Übergangsmetallelement der Gruppe 1B, Gruppe 4B (ausschliesslich Titan und Zirkonium), Gruppe 5B, Gruppe 6B, Gruppe 7B oder Gruppe 8B (ausschliesslich Nickel). Der Segmentzusammenbau wird im Festzustand bei einer Kombination von Temperatur, Druck und Zeit verbunden, die wirksam ist, um eine metallurgische ...

high temperature materials The method for joining and articles made therefrom.

Verfahren zum Zusammenfügen unähnlicher Hochtemperaturlegierungen werden zusammen mit Artikeln (100), wie aerodynamischen Turbinenprofilen, die durch das Verfahren hergestellt werden, bereitgestellt. Das Verfahren umfasst das Einfügen eines Barrierematerials zwischen ein erstes Segment (110) und ein zweites Segment (120), um einen Segmentzusammenbau zu bilden. Das erste Segment umfasst ein Titanaluminid-Material und das zweite Segment umfasst eine Nickellegierung. Das Barrierematerial umfasst ein primäres konstitutives Element, das in dem Barrierematerial in einer Konzentration von mindestens etwa 30 Gewichtsprozent des Barrierematerials vorliegt, und das primäre konstitutive Element ist ein Übergangsmetallelement der Gruppe 1B, Gruppe 4B (ausschliesslich Titan und Zirkonium), Gruppe 5B, Gruppe 6B, Gruppe 7B oder Gruppe 8B (ausschliesslich Nickel). Der Segmentzusammenbau wird im Festzustand bei einer Kombination von Temperatur, Druck und Zeit verbunden, die wirksam sind, um eine metallurgische ...

METHOD FOR ASSEMBLING PARTS MADE OF GOLD ALLOY.

Linvention concerne un procédé dassemblage de pièces en alliage dor qui permet dassembler des alliages dor identiques ou différents, en particulier, des alliages dor de couleurs différentes. Ce procédé comprend les étapes suivantes: a) on applique une couche détain sur une partie au moins dune face dune première pièce en alliage dor, b) on met la face étamée de la première pièce en alliage dor directement en contact avec une face dune deuxième pièce en alliage dor, c) on presse les première et deuxième pièces lune contre lautre et d) on chauffe lensemble. Ce procédé peut être utilisé pour fabriquer des damiers.

Method for joining light metals and/or alloys, comprises coating joining zones of light metal with a metal such as copper, zinc or tin and its compounds and/or an alloy of the metals with light metals to be coated before the joining

The method for joining light metals and/or alloys, comprises coating joining zones of light metal with a metal such as copper, zinc or tin and its compounds and/or an alloy of the metals with light metals to be coated before the joining. The areas of the light metal to be coated are coated with a further metal such as copper, zinc or tin and its compounds and/or the alloy of the metals with light metals to be coated that are subjected together to the surface of the light metal to be joined, and the coated surface and/or coatings are locally melted. The method for joining light metals and/or alloys, comprises coating joining zones of light metal with a metal such as copper, zinc or tin and its compounds and/or an alloy of the metals with light metals to be coated before the joining. The areas of the light metal to be coated are coated with a further metal such as copper, zinc or tin and its compounds and/or the alloy of the metals with light metals to be coated that are subjected together ...

METHOD OF JOINING PIPES EXPANDABLE

METHOD OF CREATING CONNECTION BETWEEN COPPER AND STAINLESS STEEL

СВАРОЧНЫЙ АГРЕГАТ ДЛЯ СВАРКИ ДВУХ РЕЛЬСОВ ПУТИ И СПОСОБ СВАРКИ

Сварочный агрегат (1) для сварки двух рельсов (2) пути (3) содержит на одной половине (4) воздушное сопло (13) с температурным датчиком (14). Через охлаждающее отверстие (18) воздушного сопла (13) непосредственно после срезания сварочного грата (11) раскаленный сварной стык (12) может быть контролируемым образом охлажден посредством подачи сжатого воздуха. Таким образом, может быть осуществлена оптимальная сварка рельсов (2) с закаленной головкой.

КУЗНЕЧНАЯ СВАРКА ТРУБ ДЛЯ ТЯЖЕЛЫХ УСЛОВИЙ РАБОТЫ

Способ соединения нефтепромысловых, скважинных или других труб для тяжелых условий работы, при котором соединяют трубы кузнечной сваркой и обдувают струей восстановительного газа нагретые концы труб во время по крайней мере части операции кузнечной сварки, для удаления оксидов с концов труб, подвергающихся кузнечной сварке, и ограничения количества оксидных включений и неровностей между концами труб, подвергающихся кузнечной сварке. Концы труб могут иметь зубчатую или неплоскую форму, чтобы препятствовать любым резким изменениям в прочности стенки в месте сварки и/или уменьшить действие сдвигающих сил на шов кузнечной сварки, когда трубы скручиваются и/или радиально расширяются.

КОВАЛЬСЬКЕ ЗВАРЮВАННЯ ТРУБНИХ КОНСТРУКЦІЙ, ЯКІ ЕКСПЛУАТУЮТЬСЯ У ВАЖКИХ УМОВАХ

Процес з'єднання нафтопромислових, обсадних або інших трубних конструкцій, що експлуатуються в важких умовах, який містить з'єднання труб шляхом ковальського зварювання та обдування відновлювальним продувним газом нагрітих кінців труб протягом принаймні частини періоду процесу зварювання так, що оксиди видаляються з кінців труб, з'єднаних шляхом ковальського зварювання, та кількість оксидних включень та неоднорідностей між з'єднаними торцями труб шляхом ковальського зварювання значно обмежується. Торці труб можуть мати зубчасту або неплоску форму, щоб запобігти раптовим змінам напруг у стінках у зоні зварювання та/або зменшити зусилля зсуву в звареному шві, коли труби піддаються закручуванню та/або радіальному розширенню.

СПОСОБ СОЕДИНЕНИЯ ТРУБЧАТЫХ ДЕТАЛЕЙ КУЗНЕЧНОЙ СВАРКОЙ

Способ соединения трубчатых деталей кузнечной сваркой, содержащий этапы, на которых размещают концы (12, 12А) соединяемых трубчатых деталей на расстоянии до нескольких миллиметров друг от друга в камере с защитным газом, в которую нагнетают взрывобезопасную продувочную смесь текучих сред (например, N2+Н2); нагревают каждый конец (12, 12А) трубчатой детали в этом пространстве по меньшей мере тремя электродами (2-5, 2А-5А), прижатыми с разнесенными по окружности интервалами к стенке каждой трубчатой детали (1, 1А) рядом с ее концом (12, 12А) так, что электроды передают электрический ток (7) высокой частоты, по существу, в окружном направлении через сегмент трубчатой детали между электродами (2-5, 2А-5А); и перемещают равномерно нагретые концы трубчатых деталей по направлению друг к другу до формирования кузнечного сварного шва между нагретыми концами (12, 12А) трубчатых деталей.

СПОСОБ СОЕДИНЕНИЯ РАСШИРЯЕМЫХ ТРУБ

Предложен способ соединения расширяемых труб и расширения соединенных труб, при котором соединяют трубы при помощи кузнечной сварки при одновременном обдуве нагретых концов труб восстановительным газом в течение по меньшей мере части операции кузнечной сварки, в результате чего с концов упомянутых труб, свариваемых кузнечной сваркой, удаляют оксиды и ограничивают количество неоднородностей в области соединения упомянутых концов труб, свариваемых кузнечной сваркой, и расширяют соединенные трубы в радиальном направлении.

Method for making a joint between copper and stainless steel

Electrical steel sheet for stacking, stacked electrical steel sheet, method of manufacturing stacked electrical steel sheet, and iron core for automotive motor

Method for airtightly joining reinforced platinum hollow tube with platinum flange

Method for interconnecting tubulars by forge welding and system using this method

METHOD FOR MOUNTING ON A FLEXIBLE SUBSTRATE OF ELECTRONIC COMPONENTS MINIATURE CONNECTOR TABS TO BE WELDED.

Process of obtaining a metal circular part reinforced by fibres.

Process for the manufacture of containers welded out of crucible cast steel with vanadium pourhaute interior or external pressure

METHOD FOR THE MANUFACTURE OF A HOLLOW WORKPIECE STIFFENED AND TWISTED LARGE PART OBTAINED BY SAID METHOD

FACE BONDING MACHINE

A method and apparatus for the diffusion bonding

Un procédé de soudage par diffusion de composants structuraux (54a-54c) sur un panneau en nid d'abeilles (32) en titane, comprend l'introduction du panneau dans une cavité (30) formée dans une paire de moitiés d'outil (14, 16), de façon qu'une tôle de face (36) du panneau soit en contact avec la surface de soudage de l'un des composants structuraux; le chauffage et l'établissement d'une condition de vide à l'interface entre les composants structuraux et le panneau en nid d'abeilles (32); et l'introduction d'un gaz sous pression à l'intérieur du panneau en nid d'abeilles, pour appliquer sa tôle de face (36) contre les surfaces de soudage des composants structuraux, avec une force suffisante pour réaliser une soudure par diffusion entre elles.

METHOD FOR FORMING COMPOSITE ARTICLES

Ohmic connection to large surface

Process of hot compression and its applications to the junction of metal elements

METHOD OF PRODUCING ELECTRICAL CONNECTIONS FOR A SET OF FREE ' ELECTRIC POWER

L'invention concerne un procédé de réalisation des connexions électriques d'un ensemble de stockage d'énergie électrique (10) mis en oeuvre par au moins un élément de stockage d'énergie électrique (70) placé à l'intérieur d'une enveloppe (20"), ladite enveloppe comprenant au moins un couvercle (30, 40) renfermant l'élément de stockage d'énergie électrique (70) dans un corps principal (20) de l'enveloppe, ledit élément (70) et ledit couvercle (30, 40) comprenant, chacun, un moyen collecteur de courant caractérisé en ce qu'il comprend au moins une étape d'un dépôt de gallium sur l'un ou l'autre des moyens collecteurs de courant et une étape d'assemblage des deux moyens collecteurs de courant séparés par le dépôt de gallium suivie d'une étape de brasage diffusion réalisée par la disposition et la pression d'une masse portée à une température donnée sur l'ensemble formé des deux moyens collecteurs de courant, l'ensemble étant brasé pendant un temps donné en vue de réaliser la liaison électrique ...

Method of forming heat-diffusing base for cooking pan, has inserted aluminum disc raised above fusion temperature to occupy whole space between true and false pan bottoms

La présente invention concerne un procédé de fabrication d'un récipient de cuisson comportant un fond diffuseur de chaleur encapsulé, le corps (1) du récipient étant pourvu d'un matériau diffuseur thermique (2) recouvert par une capsule métallique emboutie (3), le matériau diffuseur thermique (2) étant lié respectivement au corps (1) du récipient et à la capsule (3) par une soudure ou par une brasure. L'invention consiste en ce qu'on place le récipient sur un vérin de maintien où on chauffe le fond du récipient dans une plage de températures appropriée pour fondre le matériau constituant le diffuseur thermique (2) sous une pression inférieure à 1 Mpa, on détecte la fusion du matériau constituant le diffuseur thermique (2), on arrête le chauffage du fond du récipient et on refroidit le fond dudit récipient après détection de la fusion du matériau (2). Application à la fabrication de récipients de cuisson.

PROCESS FOR THE MANUFACTURE OF A PART STIFFENED HOLLOW AND TWISTED LARGE AND SUCH A METHOD

L'invention concerne un procédé pour la fabrication d'une pièce de grande dimension comportant un intrados et un extrados, lequel procédé comprend les étapes consistant à : i. former à chaud et séparément 3 plaques dont une, dite intermédiaire, est constituée d'un matériau superplastique ; ii. appliquer sur les faces formant interface des plaques ainsi formées un agent formant une barrière de diffusion, en conservant des zones en vis-à-vis exemptes dudit agent ; iii. empiler les 3 plaques selon lesdites interfaces, la plaque intermédiaire étant placée entre l'intrados et l'extrados ; iv. souder en continu la périphérie de l'empilement ; v. souder par diffusion la plaque intermédiaire aux plaques intrados extrados dans les zones exemptes d'agent format barrière de diffusion, en portant cet assemblage sous pression dans un outillage à une température adaptée ; vi.gonfler l'empilement à une température adaptée au formage superplastique de la plaque intermédiaire pour obtenir un intérieur creux ...

MANUFACTORING PROCESS Of a PADDLE DIGS FOR TURBOSHAFT ENGINE.

L'invention concerne un procédé de fabrication d'une aube creuse pour turbomachine comprenant un pied et une pale, le procédé comportant une étape de réalisation de deux pièces externes (14) ainsi qu'une étape d'assemblage par soudage par diffusion de ces deux pièces externes de manière à obtenir une préforme d'aube. Selon l'invention, l'étape de réalisation des deux pièces externes comprend, pour chacune de ces pièces, les opérations suivantes : - la fabrication d'un élément primaire (28) constituant au moins une partie pale de la pièce externe, - la fabrication d'au moins un élément secondaire (34) destiné à former au moins partiellement une partie pied de la pièce externe, et - l'assemblage de chaque élément secondaire sur l'élément primaire afin d'obtenir la pièce externe.

절단방법, 가공대상물 절단방법 및 광투과성재료 절단방법

... 본 발명은 가공 대상물의 표면에 용융이나 절단 예정 라인으로부터 벗어난 갈라짐이 생기지 않고 가공 대상물을 절단할 수 있는 절단방법, 가공대상물 절단방법 및 광투과성 재료 절단방법을 제공한다. 다광자 흡수를 일으키게 하는 조건으로 또한 가공 대상물(1)의 내부에 집광점(P)을 맞추어, 펄스 레이저 광(L)을 가공 대상물(1)의 표면(3)의 절단 예정 라인(5)에 조사하고 있다. 집광점(P)을 절단 예정 라인(5)에 따라 이동시킴으로써, 개질 영역을 절단 예정 라인(5)에 따르도록 가공 대상물(1)의 내부에 형성하고 있다. 개질 영역을 기점으로 하여 절단 예정 라인(5)에 따라 가공 대상물(1)을 나눔으로써, 비교적 작은 힘으로 가공 대상물(1)을 절단할 수 있다. 이 레이저 광(L)의 조사에 있어서, 가공 대상물(1)의 표면(3)에서는 펄스 레이저 광(L)이 거의 흡수되지 않기 때문에, 개질 영역 형성이 원인이 되어 표면(3)이 용융하지 않는다.

Method for permanent bonding of wafers

This invention relates to a method for bonding of a first solid substrate (1) to a second solid substrate (2) which contains a first material with the following steps, especially the following sequence: formation or application of a function layer (5) which contains a second material to the second solid substrate (2), making contact of the first solid substrate (1) with the second solid substrate (2) on the function layer (5), pressing together the solid substrates (1, 2) for forming a permanent bond between the first and second solid substrate (1, 2), at least partially reinforced by solid diffusion and/or phase transformation of the first material with the second material, an increase of volume on the function layer being caused.

Bonding method and bonding device

The present invention relates to a bonding method for clamping to bond the first bonded object with the second bonded object. The bonding method according to the present invention includes the first process for holding the first bonded object and the second bonded object on the first holding member and the second holding member, respectively, so as to make the bonding surface of the first bonded object and the bonding surface of the second bonded object face to face; the second process for employing the processing liquid on the bonding surface of the first bonded object and the bonding surface of the second bonded object under the situation of holding the first bonded object and the second bonded object on the first holding member and the second holding member; and, the third process for clamping the first bonded object and the second bonded object by the first holding member and the second holding member for sealing these bonding surfaces.

Process för att erhålla en mekanisk komponent genom diffusionssvetsning

Ihåligt konstruktionselement och metod för dess tillverkning

Dual hardness steel article and method of making

CHROMATOGRAPHY APPARATUS HAVING DIFFUSION-BONDED AND SURFACE-MODIFIED COMPONENTS

A microfluidic device for separating a sample by chromatography includes diffusion bonded metallic sheets joined together to create a hermetically sealed interface between each adjacent metallic sheet without the introduction of a secondary material. Enclosed within the diffusion bonded sheets is a separation channel accessible by at least one of an inlet or an outlet. The separation channel is packed with micrometer-sized particles serving as a stationary phase in a chromatographic separation. Wetted surfaces of the separation channel include a coating of an organic material at least one monolayer thick.

METHOD AND APPARATUS FOR MAKING A LOAD CELL

A unique method and apparatus for making a load cell provides faster assembly throughput and a manufacturing cost reduction. The method and apparatus includes adhering a sensor (10) to a mount surface (12) and clamping (20) the sensor (10) to the mount surface (12) with heated clamps (22). Heat is applied directly through the clamps to heat the interface between the sensor and mount surface for a predetermined amount of time to form a secure bond.

METHOD OF JOINING A SURFACE-MOUNT COMPONENT TO A SUBSTRATE WITH SOLDER THAT HAS BEEN TEMPORARILY SECURED

A method of joining a surface-mount component to a substrate includes placing a piece of solder on top of the substrate and temporarily bonding the piece of solder to the substrate with at least one temporary bond. The method also includes placing a surface-mount component on top of the substrate with a bottom face of the surface-mount component facing the substrate. The surface-mount component has at least one lateral side. The method further includes positioning the surface-mount component with the at least one lateral side proximate the piece of solder, heating the substrate and the piece of solder to a joining temperature for a time sufficient for the solder to flow into an area between the bottom face of the surface-mount component and the substrate, and cooling the substrate and solder. 1. A method of joining a surface-mount component to a substrate , the method comprising the steps of:placing a piece of solder on top of a substrate;temporarily bonding the piece of solder to the substrate;placing a surface-mount component on top of the substrate, a bottom face of the surface-mount component facing the substrate, the surface-mount component having a lateral side;positioning the surface-mount component with the lateral side proximate the piece of solder;heating the substrate and the piece of solder to a joining temperature for a time sufficient for the solder to flow into an area between the bottom face of the surface-mount component and the substrate; andcooling the substrate and solder.2. The method of claim 1 , wherein the temporary bond is an ultrasonic bond.3. The method of claim 2 , further comprising claim 2 , prior to the bonding step claim 2 , applying a force to the piece of solder with a bonding tool claim 2 ,wherein the bonding tool is used to make the ultrasonic bond.4. The method of claim 3 , wherein the applied force is from 1 N to 12 N.5. The method of claim 2 , wherein the bonding step includes applying ultrasonic waves having a frequency from ...

Solderless mounting for semiconductor lasers

A first contact surface of a semiconductor laser chip can be formed to a first target surface roughness and a second contact surface of a carrier mounting can be formed to a second target surface roughness. A first bond preparation layer comprising a first metal can optionally be applied to the formed first contact surface, and a second bond preparation layer comprising a second metal can optionally be applied to the formed second contact surface. The first contact surface can be contacted with the second contact surface, and a solderless securing process can secure the semiconductor laser chip to the carrier mounting. Related systems, methods, articles of manufacture, and the like are also described.

Method of making and joining an aerofoil and root

A ducted fan gas turbine engine aerofoil is made by electron beam welding together at least two metal sheets ( 10 ) and ( 12 ) and electron beam welding that sub assembly via an end to a root that has been manufactured in a separate operation, and then heating the whole to a temperature that will convert the electron beam welds to diffusion bonds.

Golf club face plates with internal cell lattices and related methods

Embodiments of golf club face plates with internal cell lattices are presented herein. Other examples and related methods are also disclosed herein.

TANTALUM CLAD NIOBIUM

Golf club face plates with internal cell lattices and related methods

Embodiments of golf club face plates with internal cell lattices are presented herein. Other examples and related methods are also disclosed herein.

Differential pressure method and apparatus for bonding high temperature structures

A method and apparatus for bonding high temperature structures, such as face sheets to high performance honeycomb cores, using differential gas pressure at high temperatures. A high temperature resistant, foil sheet having a thickness of from about 0.0005 to 0.003 inch is welded to a support to form a vacuum bag to surround the structure to be bonded. A vacuum line is connected to the bag to allow evacuation of the bag. Typically, the structure is bonded in a vacuum furnace. Initially, the furnace is heated to the bonding temperature of the assembly while both the furnace chamber and the vacuum bag are substantially completely evacuated. Then slight pressure is allowed to return to the chamber to force the foil sheet into intimate presure contact with the structural assembly to bring the components tightly together, using the relative pressure different between the vacuum in the chamber and the vacuum within the bag. The bag material may have superplastic deformation characteristics to ...

Composite consolidation using induction heating

A process for consolidating a composite material comprises the steps of forming a workpiece including a matrix interspersed with fibers, supporting the workpiece by an electrically conductive support, inductively heating the support and thereby conductively heating the workpiece, and applying pressure to the heated workpiece. We apply the pressure by passing the support and workpiece through spaced rolls. To keep the workpiece from sticking to the support (i.e., the mandrel), we use boron nitride as a release agent.

Electronic device having electric wires and method of producing same

An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag-Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.

Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same

Described is a method for producing a diffusion bonded sputtering assembly which is thermally treated to precipitation harden the backing plate without compromising the diffusion bond integrity. The method includes heat treating and quenching to alloy solution and artificially age the backing plate material after diffusion bonding to a target. Thermal treatment of the diffusion bonded sputtering target assembly includes quenching by partial-immersion in a quenchant and is performed after diffusion bonding and allows for various tempers in the backing plate.

Method of manufacturing an article by diffusion bonding and superplastic forming

A method of manufacturing a gas turbine engine fan blade (10) comprises forming three metal workpieces (30, 32, 34). The metal workpieces (30, 32, 34) are assembled into a stack (36) so that the flat surfaces (38, 42, 46, 48) are in mating abutment. Heat and pressure is applied across the thickness of the metal workpieces (30, 32, 34) to diffusion bond the metal workpieces (30, 32, 34) together to form an integral structure (80). The integral structure (80) is upset forged at one end (58) to produce an increase in thickness (82) for forming the blade root (26). The upset forged integral structure (80) is then hot creep formed and superplastically formed to produce the required aerofoil shape and the thickened end (82) is machined to form the blade root (26). The method enables thinner metallic workpieces with better microstructure to be used and increases the yield of metallic workpieces.

Thermocompression bonders, methods of operating thermocompression bonders, and horizontal scrub motions in thermocompression bonding

A method of operating a thermocompression bonding system is provided. The method includes the steps of: bringing first conductive structures of a semiconductor element into contact with second conductive structures of a substrate in connection with a thermocompression bonding operation; and moving the semiconductor element relative to the substrate along at least one substantially horizontal direction using a motion system of at least one of the semiconductor element and the substrate.

Apparatus for the material-bonded connection of connection partners of a power-electronics component

A pressing ram having an elastic cushion element and intended for the material-bonded press-sintering connection of a first connection partner to a second connection partner of a power-electronics component. The elastic cushion element of the pressing ram is enclosed by a dimensionally stable frame, within which the cushion element and a guide part of the pressing ram are guided for linear movement such that the dimensionally stable frame lowers onto the first connection partner, or a workpiece carrier with the first connection partner arranged therein, and, following abutment against the same, the pressing ram together with the elastic cushion element is lowered onto the second connection partner and the elastic cushion exerts a pressure necessary for connecting the first connection partner to the second connection partner.

Aluminum bonding alloy made of an Nickel-Magnesium alloy

ФОЛЬГА ИЗ НЕРЖАВЕЮЩЕЙ СТАЛИ И НОСИТЕЛЬ КАТАЛИЗАТОРА ДЛЯ УСТРОЙСТВА ОЧИСТКИ ВЫХЛОПНОГО ГАЗА, ИСПОЛЬЗУЮЩИЙ ЭТУ ФОЛЬГУ

... 1. Фольга из нержавеющей стали, характеризующаяся тем, что содержит, в мас.%: 0,05 или меньше C, 2,0 или меньше Si, 1,0 или меньше Mn, 0,003 или меньше S, 0,05 или меньше Р, 25,0-35,0 Cr, 0,05-0,30 Ni, 3,0-10,0 Al, 0,10 или меньше N, 0,02 или меньше Ti, 0,02 или меньше Nb, 0,02 или меньше Та, 0,005-0,20 Zr, 0,02 или меньше Се, 0,03-0,20 РЗЭ (редкоземельного элемента), исключая Се, 0,5-6,0 в сумме, по меньшей мере, одного из Мо и W, и остальное Fe и случайные примеси.2. Фольга по п.1, характеризующаяся тем, что содержит по меньшей мере один из Мо и W в суммарном количестве 2,5-5,0 мас.%.3. Фольга по п.1, характеризующаяся тем, что дополнительно содержит по меньшей мере один из: Hf в количестве 0,01-0,20 мас.%, Са в количестве 10-300 млн, и Mg в количестве 15-300 млн.4. Фольга по п.2, характеризующаяся тем, что дополнительно содержит по меньшей мере один из: Hf в количестве 0,01-0,20 мас.%, Са в количестве 10-300 млн, и Mg в количестве 15-300 млн.5. Фольга по любому из пп.1-4, характеризующаяся ...

СПОСОБ СОЕДИНЕНИЯ ДЛЯ МИКРОКАНАЛЬНЫХ ПЛАСТИН

... 1. Способ соединения микроканальной пластины и многослойного керамического компонента подвода питания, включающий следующие этапы: на сопрягаемые поверхности микроканальной пластины (МКП) и многослойного керамического компонента подвода питания (МККПП) наносят тонкопленочное покрытие из соответствующего металла, выбранного из условия оптимальной диффузии при повышенной температуре и давлении, при этом пленочное покрытие поверхности МККПП имеет выступающие участки, расположенные таким образом, чтобы обеспечить возможность соединения сопрягаемых поверхностей МКП и МККПП; взаимно состыковывают металлизированные МКП и МККПП и помещают их в соединительное устройство для приложения к ним усилия, достаточного для инициирования диффузионного соединения между сопрягаемыми поверхностями МКП и МККПП при выбранной повышенной температуре; и помещают соединительное устройство в вакуумную термокамеру для ускорения процесса диффузионного соединения МКП и МККПП. 2. Способ по п.1, отличающийся тем, что каждый ...

Method of bonding titanium to stainless steel

A method of bonding a stainless steel part to a titanium part by heating a component assembly comprised of the titanium part, the stainless steel part, and a laminated titanium-nickel filler material placed between the two parts and heated at a temperature that is less than the melting point of either the stainless steel part or the titanium part. The component assembly is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a hermetic and strong bond between the stainless steel part and the titanium part. The bonded component assembly is optionally treated with acid to remove any residual free nickel and nickel salts, to assure a biocompatible component assembly, if implanted in living tissue.

DIFFUSION BONDING MACHINE AND METHOD

An example diffusion bonding machine includes a support structure configured to receive first and second die sets. A heat transfer device is arranged near the support structure and is configured to transfer heat relative to the die sets. A mechanism is configured to separate the die sets from one another during heat transfer. In one example method of diffusion bonding, heat is transferred relative to a space between die sets. The die sets are supported on the support structure, and a load is applied to the die sets to diffusion bond a component within each of the die sets. 1. A method of diffusion bonding a component comprising:transferring heat relative to a space between first and second die sets;supporting the first die set on the second die set; andapplying a load to the die sets to diffusion bond a component within each of the die sets.2. The method according to claim 1 , comprising loading the die sets onto a support structure prior to performing the heat transferring step.3. The method according to claim 2 , comprising moving the die sets and support structure relative to one another to provide a space.4. The method according to claim 3 , wherein the moving step includes lifting the die sets off of a platen.5. The method according to claim 2 , wherein the heat transferring step includes heating the space and the die sets.6. The method according to claim 2 , wherein the heat transferring step includes cooling the space and the die sets.7. The method according to claim 1 , wherein the loading step includes pressing the die sets between first and second platens.8. The method according to claim 1 , comprising transferring heat relative to a space between the die sets prior to and subsequent to the load applying step.9. The method according to claim 1 , wherein the load applying step includes heating the die sets.10. The method according to claim 1 , wherein the heat transferring step claim 1 , the die sets supporting step claim 1 , and the load applying step are ...

Metal bonding method and metal bonded structure

The gap between first and second bonding portions is filled with a disperse solution obtained by dispersing copper micro-particles into a solution for copper oxide elution, so as to elute copper oxide configured as the outermost layer of the first bonding portion and copper oxide configured as the outermost layer of the second bonding portion, and copper oxide formed on the surface of each copper micro-particle. Pressure is applied to the first and second bonding portions using a press machine so as to raise the pressure of the disperse solution. At the same time, heat is applied under a relatively low temperature condition of 200° C. to 300° C., so as to remove the components contained in the disperse solution except for copper, thereby depositing copper. Thus, a first base portion and a second base portion are bonded via a copper bonded portion containing copper derived from the copper micro-particles.

METAL BONDING APPARATUS

The metal bonding apparatus comprises: a solution supply unit configured to supply a solution which is able to elute an oxide with copper oxide as a principal component, to at least one of a first bonding portion and a second bonding portion; a pressing unit configured to apply pressure to the first bonding portion and the second bonding portion so as to sandwich the solution between the first bonding portion and the second bonding portion, and in a direction in which a distance between the first bonding portion and the second bonding portion is reduced; and a heating unit configured to heat the first bonding portion and the second bonding portion, wherein the first bonding portion and the second bonding portion are bonded by the pressure applied by the pressing unit and the heat from the heating unit. 1. A metal bonding apparatus comprising:a solution supply unit configured to supply a solution which is able to elute an oxide with copper oxide as a principal component, to at least one of a first bonding portion and a second bonding portion;a pressing unit configured to apply pressure to the first bonding portion and the second bonding portion so as to sandwich the solution between the first bonding portion and the second bonding portion, and in a direction in which a distance between the first bonding portion and the second bonding portion is reduced; anda heating unit configured to heat the first bonding portion and the second bonding portion,wherein the first bonding portion and the second bonding portion are bonded by the pressure applied by the pressing unit and the heat from the heating unit.2. A metal bonding apparatus according to claim 1 ,wherein the first bonding portion comprises a first base portion formed of a metal with copper as a principal component and the first coating portion formed of an oxide with copper oxide as a principal component and configured to coat a surface of the first base portion,wherein the second bonding portion comprises a second ...

Cookware with Selectively Bonded Layers

Cookware comprising a selectively bonded composite of at least two layers of materials wherein the first of the at least two layers of materials has a plurality of spaced-apart bubbles formed on its surface, defining a cooking surface of the cookware, and a second layer of two layers of material is bonded thereto, wherein the bonding between the bubbles and the second material is of a lesser degree than the bonding between the first and second layers of materials in areas intermediate the bubbles, whereby a coefficient of heat conductivity is greater in the intermediate areas than in the bubbles.

METHOD OF FABRICATION OF AI/GE BONDING IN A WAFER PACKAGING ENVIRONMENT AND A PRODUCT PRODUCED THEREFROM

A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer. 1. A method for bonding a first substrate wafer and a second substrate wafer , a patterned aluminum layer disposed on the first substrate wafer , a patterned germanium layer disposed on the second substrate wafer , the method comprising:placing the first substrate wafer in a first chuck;placing the second substrate wafer in a second chuck;aligning the first substrate wafer and the second substrate wafer; andforming a eutectic bond between the patterned germanium layer and the patterned aluminum layer, wherein the eutectic bond is formed by applying a force across the first chuck and the second chuck, and ramping the temperature over the eutectic point of the aluminum/germanium bond to a second predetermined temperature that is less than 450° C.2. The method of claim 1 , wherein one of the first and second substrate wafers is a cover wafer.3. The method of claim 1 , wherein providing an insulating layer between the second substrate wafer and a portion of the patterned germanium layer.4. A method for bonding a first substrate wafer and a second substrate wafer claim 1 , an aluminum layer disposed on the first substrate wafer claim 1 , a germanium layer disposed on the second substrate wafer claim 1 , the method comprising:placing the first substrate wafer in a first chuck;placing the second substrate wafer in a second chuck; ...

DEVICE AND METHOD FOR PARTS ASSEMBLY FOR A NACELLE OF AN AIRCRAFT TURBOJET ENGINE

A device and a method of assembly by brazing or diffusion-welding under a gaseous pressure is provided to make structures for a nacelle of an aircraft turbojet engine such as an inner fixed structure. Sealing of the assembly space inside which the parts to assemble are disposed is provided by tie members exerting a mechanical pressure on mold elements. The tie members include jaws made of a first material and a holding element made of a second material. The first material has a thermal expansion coefficient higher than that of the second material. 1. A device for assembling by brazing or diffusion-welding metallic parts for a nacelle of an aircraft turbojet engine , the device comprising:tooling including a first mold element and a second mold element, the tooling configured to clasp the metallic parts within an assembly space between the first mold element and the second mold element;a gas injection device to inject a gas into the assembly space such that an increase in pressure presses the metallic parts against each other;an enclosure adapted to receive the tooling and the metallic parts; anda heating device arranged to increase a temperature inside the enclosure to an assembly temperature,wherein the tooling further includes tie members configured to seal the assembly space, each tie member comprising two jaws and a holding element,wherein the holding element is configured to hold the two jaws in a sealing position and cause the two jaws to exert a mechanical pressure against respective bearing surfaces of the first mold element and of the second mold element such that the mechanical pressure inhibits the first mold element and the second mold element from getting away from each other at least along a direction normal to said bearing surfaces at least at the assembly temperature,wherein the two jaws of each tie member comprises a first material and the holding element of each tie member comprises a second material, the first material having a thermal expansion ...

BOND HEADS FOR THERMOCOMPRESSION BONDERS, THERMOCOMPRESSION BONDERS, AND METHODS OF OPERATING THE SAME

A bond head for a thermocompression bonder is provided. The bond head includes a tool configured to hold a workpiece to be bonded, a heater configured to heat the workpiece to be bonded, and a chamber proximate the heater. The chamber is configured to receive a cooling fluid for cooling the heater. 1. A bond head for a thermocompression bonder , the bond head comprising:a tool configured to hold a workpiece to be bonded;a heater configured to heat the workpiece to be bonded; anda chamber proximate the heater, the chamber configured to receive a cooling fluid for cooling the heater.2. The bond head of wherein the chamber is in contact with the heater with a variable contact force so as to adjust a heat exchange between the heater and the chamber.3. The bond head of claim 1 , wherein the chamber is moveable relative to the heater to be in and out of contact with the heater.4. The bond head of wherein the cooling fluid has a thermal capacity to absorb heat from the heater during contact between the chamber and the heater.5. The bond head of wherein the cooling fluid is selected from the group consisting of water claim 1 , ethylene glycol and fluorinated liquid.6. The bond head of wherein the cooling fluid is received in the chamber during a first operational phase claim 1 , and a second fluid is received in the chamber during a second operational phase.7. The bond head of wherein the first operational phase is a cooling phase and the second operational phase is a non-cooling phase.8. The bond head of wherein the second fluid is air.9. The bond head of wherein the cooling fluid includes a corrosive inhibitor.10. The bond head of further comprising at least two flexures disposed between a support structure of the bond head and the heater.11. The bond head of wherein the tool claim 1 , the heater and the chamber are integrated in a single structure.12. The bond head of wherein the chamber is disposed within a cavity of a support structure of the bond head above the heater ...

METHOD FOR BONDING A TANTALUM STRUCTURE TO A COBALT-ALLOY SUBSTRATE

Methods for bonding a porous tantalum structure to a substrate are provided. The method includes placing a compressible or porous interlayer between a porous tantalum structure and a cobalt or cobalt-chromium substrate to form an assembly. The interlayer comprising a metal or metal alloy that has solid state solubility with both the substrate and the porous tantalum structure. Heat and pressure are applied to the assembly to achieve solid state diffusion between the substrate and the interlayer and the between the porous tantalum structure and the interlayer. 1. (canceled)2. A method of bonding , comprising:providing a substrate comprising cobalt or cobalt-chromium;providing a subassembly that includes a porous tantalum structure with a compressible interlayer formed on a surface portion of the porous tantalum structure, said compressible interlayer having a porosity of between 5% and 40% and consisting essentially of interconnected metal or metal alloy particles that exhibit solid solubility with tantalum and with cobalt or cobalt-chromium, said interconnected metal or metal alloy particles defining collapsible pores therebetween;bending the subassembly from a first configuration to a second configuration;forming an assembly which includes placing an exposed surface of the compressible interlayer in contact with the substrate after said bending; andapplying heat and pressure to the assembly for a time sufficient to achieve solid-state diffusion between the substrate and the compressible interlayer and between the compressible interlayer and the porous tantalum structure.3. The method of claim 2 , wherein the compressible interlayer has a substantially uniform thickness before said bending.4. The method of claim 2 , wherein said applying heat and pressure to the assembly includes compressing a portion of the compressible interlayer from a first thickness to a second claim 2 , reduced thickness.5. The method of claim 2 , wherein said applying heat and pressure to the ...

METHOD FOR PRODUCING METAL LAMINATE MATERIAL

An object of the present invention is to provide a method for producing a metal laminate material that maintains sufficient bonding strength and has superior production efficiency. A method for producing a metal laminate material by bonding two sheets, one sheet composed of a material M1 and the other sheet composed of a material M2, wherein each of M1 and M2 is a metal or alloy comprising any one or more selected from the group consisting of Mg, Al, Ti, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Pd, Ag, In, Sn, Hf, Ta, W, Pb, and Bi, comprises the steps of subjecting the faces of the two sheets to be bonded to sputtering treatment with inert gas ions under vacuum such that oxide layers on surface layers remain; temporarily bonding the two sheets by roll pressure bonding; and conducting a thermal treatment to thereby bond the two sheets, and, when Tm1>Tm2 where Tm1 (K) is the melting point of M1 and Tm2(K) is the melting point of M2, the temperature of the thermal treatment is 0.45Tm2 or more and less than 0.45Tm1, provided that the temperature is not more than Tm2. 1. A method for producing a metal laminate material bonding two sheets , one sheet composed of a material M1 and the other sheet composed of a material M2 , each of M1 and M2 being a metal or alloy comprising any one or more selected from the group consisting of Mg , Al , Ti , Cr , Mn , Fe , Co , Ni , Cu , Zn , Nb , Mo , Pd , Ag , In , Sn , Hf , Ta , W , Pb , and Bi , wherein the method comprises the steps of:subjecting the faces to be bonded of the two sheets to sputtering treatment with inert gas ions under vacuum such that oxide layers on surface layers remain;temporarily bonding the two sheets by roll pressure bonding; andconducting a thermal treatment to thereby bond the two sheets; andwherein, when Tm1>Tm2 where Tm1 (K) is the melting point of M1 and Tm2(K) is the melting point of M2, the temperature of the thermal treatment is 0.45Tm2 or more and less than 0.45Tm1, provided that the temperature is not ...

HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COMPRESSION BONDING PROCESS

Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block. 1. An assembly comprising:a cooling block comprising an array of vertical micro channels jets coupled to a heater surface, wherein an outlet micro channel jet of the array is coupled with an adjacent inlet micro channel jet of the array; andan inlet and outlet manifold coupled to the array of vertical micro channel jets, wherein the heater surface and the array of vertical micro channel jets are coupled in the same block material, wherein the heater surface comprises a plurality of micro fins, and wherein a tip of each micro fin is aligned in a center position between adjacent inlet and outlet micro channel jets.2. The assembly of claim 1 , wherein each outlet micro channel jet is coupled with two adjacent micro channel jets.3. The assembly of claim 1 , wherein inlet and outlet micro channel jets are disposed in a staggered configuration.4. The assembly of claim 1 , wherein a bottom portion of each inlet and outlet micro channel jet is chamfered.5. The assembly of claim 1 , wherein the vertical micro channel jets comprise vertical individual inlet and outlet nozzles attached to the heater surface.6. The assembly of claim 1 , further comprises a nozzle coupled to the heater claim 1 , and a die coupled to the nozzle claim 1 , wherein the die is on a substrate disposed on a pedestal.7. The assembly of claim 5 , wherein the assembly comprises a portion of a TCB bonding system.8. The assembly of claim 1 , wherein a TEC pad is disposed between the heater surface and the cooling block of the assembly.9. An assembly comprising:a ...

Method and machine for forge welding of tubular articles and exothermic flux mixture and method of manufacturing an exothermic flux mixture

A method of forge welding includes placing at least two components for welding together, adjacent each other and with an exothermic flux mixture placed between the components. The exothermic flux mixture is heated to initiate an exothermic reaction and the faying surfaces of the two components are pressed together. The components being welded may be tubular, in particular pipes. Apparatus for the method of forge welding and exothermic flux mixtures for the method of forge welding are also provided.

METHOD FOR JOINING HIGH TEMPERATURE MATERIALS AND ARTICLES MADE THEREWITH

Methods for joining dissimilar high-temperature alloys are provided, along with articles, such as turbine airfoils, formed by the method. The method comprises interposing a barrier material between a first segment and a second segment to form a segment assembly. The first segment comprises a titanium aluminide material, and the second segment comprises a nickel alloy. The barrier material comprises a primary constituent element present in the barrier material at a concentration of at least about 30 weight percent of the barrier material, and the primary constituent element is a transition metal element of Group 1B, Group 4B (excluding titanium and zirconium), Group 5B, Group 6B, Group 7B, or Group 8B (excluding nickel). The segment assembly is bonded in the solid state at a combination of temperature, pressure, and time effective to produce a metallurgical joint between the first and second segments, thereby forming an intermediate article; and the intermediate article is heat treated to form a bonded article. 1. A method comprising:interposing a barrier material between a first segment and a second segment to form a segment assembly, wherein the first segment comprises a titanium aluminide material, the second segment comprises a nickel alloy, and the barrier material comprises a primary constituent element present in the barrier material at a concentration of at least about 30 weight percent of the barrier material; wherein the primary constituent element is a transition metal element of Group 1B, Group 4B (excluding titanium and zirconium), Group 5B, Group 6B, Group 7B, or Group 8B (excluding nickel);bonding the segment assembly in the solid state at a combination of temperature, pressure, and time effective to produce a metallurgical joint between the first and second segments, thereby forming an intermediate article; andheat treating the intermediate article to form a bonded article.2. The method of claim 1 , wherein the primary constituent element comprises ...

HYBRID BONDED TURBINE ROTORS AND METHODS FOR MANUFACTURING THE SAME

Hybrid bonded turbine rotors and methods for manufacturing the same are provided. A method for manufacturing a hybrid bonded turbine rotor comprises the steps of providing turbine disk having a rim portion comprising a live rim of circumferentially continuous material and a plurality of live rim notches in an outer periphery of the turbine disk alternating with a plurality of raised blade attachment surfaces defining the outer periphery; providing a plurality of turbine blades, each of which comprising an airfoil portion and a shank portion, the shank portion having a base surface; metallurgically bonding a compliant alloy material layer to either or both of the raised blade attachments surfaces of the turbine disk and the base surfaces of the blade shanks; and linear friction welding the plurality of blades to the turbine disk so as to form a bond plane between the raised blade attachments surfaces of the turbine disk and the base surfaces of the blade shanks, the compliant alloy material layer being disposed at the bond plane. 1. A method for manufacturing a hybrid bonded turbine rotor comprising the steps of:providing turbine disk having a rim portion comprising a live rim of circumferentially continuous material and a plurality of live rim notches in an outer periphery of the turbine disk alternating with a plurality of raised blade attachment surfaces defining the outer periphery;providing at least one turbine blade, the at least one turbine blade comprising an airfoil portion and a shank portion, the shank portion having a base surface;metallurgically bonding a compliant alloy material layer to either or both of one or more of the raised blade attachment surfaces of the turbine disk and the base surface of the blade shank, wherein the compliant alloy is bonded only to the one or more of the raised blade attachment surfaces and not any other portion of the turbine disk, only to the base surface of the blade shank and not any other portion of the at least one ...

Dual hardness steel article

A dual hardness steel article comprises a first air hardenable steel alloy having a first hardness metallurgically bonded to a second air hardenable steel alloy having a second hardness. A method of manufacturing a dual hard steel article comprises providing a first air hardenable steel alloy part comprising a first mating surface and having a first part hardness, and providing a second air hardenable steel alloy part comprising a second mating surface and having a second part hardness. The first air hardenable steel alloy part is metallurgically secured to the second air hardenable steel alloy part to form a metallurgically secured assembly, and the metallurgically secured assembly is hot rolled to provide a metallurgical bond between the first mating surface and the second mating surface.

Method for bonding stainless steel members and stainless steel

A method for bonding stainless steel members includes: contacting a first stainless steel member with a second stainless steel member that has a strain exceeding 50% reduction; and heating the first and second stainless steel members to a re-crystallization initiation temperature or higher, after the contacting.

COOKWARE WITH COPPER BONDED LAYER

Provided is an article of cookware and a method of making the same. The cookware has at least one stainless steel layer and at least one copper layer metallurgically bonded directly to the at least one stainless steel layer via solid state bonding. The at least one stainless steel layer may be a ferritic stainless steel layer, and the at least one copper layer may be a grain stabilized copper. The at least one stainless steel layer may be made from a 400 series stainless steel, such as a 436 stainless steel alloy, a 439 stainless steel alloy, or a 444 stainless steel alloy. The at least one copper layer may be made from a high purity, oxygen free copper alloy, such as a C101 copper alloy, a C102 copper alloy, or a C107 copper alloy. 1. Cookware having a multi-layer , solid state bonded composite wall structure , the cookware comprising:at least one stainless steel layer; andat least one copper layer metallurgically bonded to the at least one stainless steel layer via solid state bonding, andwherein the at least one copper layer is a grain stabilized copper.2. The cookware of claim 1 , wherein the at least one stainless steel layer is made from a 300 series stainless steel or a 400 series stainless steel.3. The cookware of claim 1 , wherein the at least one stainless steel layer is made from a 436 stainless steel alloy claim 1 , a 439 stainless steel alloy claim 1 , or a 444 stainless steel alloy.4. The cookware of claim 1 , wherein the at least one stainless steel layer is made from a ferro-magnetic stainless steel with chrome content of at least 17%.5. The cookware of claim 1 , wherein the at least one copper layer is made from a C101 copper alloy claim 1 , a C102 copper alloy claim 1 , or a C107 copper alloy.6. The cookware of claim 1 , wherein the at least one stainless steel layer has a thickness between about 0.01 inches (0.254 mm) to about 0.10 inches (2.54 mm).7. The cookware of claim 1 , wherein the at least one copper layer has a thickness between about 0. ...

PRESSURE SENSOR AND PROCESS OF MANUFACTURING SAID PRESSURE SENSOR

A pressure sensor includes a sensor assembly and an evaluation unit. The sensor assembly includes a sensor and an electrode arrangement. The sensor generates signals under the action of a pressure profile, and the electrode arrangement transmits the signals to the evaluation unit. The evaluation unit includes an electric circuit board that is connected to the electrode arrangement by material bonding. 1. A pressure sensor comprising:a sensor assembly that includes a sensor that is electrically connected to an electrode arrangement; andan evaluation unit that includes an electric circuit board that is connected by material bonding to the electrode arrangement; andwherein the sensor is configured to generate signals under the action of a pressure profile, and the electrode arrangement is configured to transmit the signals to the evaluation unit.2. The pressure sensor according to claim 1 , wherein each of the successive connections enabling the transmission of a signal from the electrode arrangement to the evaluation unit consists only of material bonding.3. The pressure sensor according to claim 1 , wherein each of a plurality of successive connections is configured and disposed to enable the transmission of a signal from the sensor to the evaluation unit via the electrode arrangement claim 1 , and each of these successive connections consists only of material bonding.4. The pressure sensor according to claim 1 , wherein:the pressure sensor is a piezoelectric pressure sensor;the sensor is a piezoelectric sensor;the piezoelectric sensor produces piezoelectric charges under the action of a pressure profile; andthe electrode arrangement receives the piezoelectric charges from the piezoelectric sensor and transmits the received piezoelectric charges as signals to the evaluation unit.5. The pressure sensor according to claim 1 , wherein:the electrode arrangement includes a charge output; andthe electric circuit board includes an electrical connection element that is ...

CHROMATOGRAPHY APPARATUS HAVING DIFFUSION-BONDED AND SURFACE-MODIFIED COMPONENTS

A microfluidic device for separating a sample by chromatography includes diffusion bonded metallic sheets joined together to create a hermetically sealed interface between each adjacent metallic sheet without the introduction of a secondary material. Enclosed within the diffusion bonded sheets is a separation channel accessible by at least one of an inlet or an outlet. The separation channel is packed with micrometer-sized particles serving as a stationary phase in a chromatographic separation. Wetted surfaces of the separation channel include a coating of an organic material at least one monolayer thick. 1. A diffusion-bonded product manufactured comprising the steps of:supplying two or more substantially compositionally similar metal sheets with each having a flat major surface with no layer thereon to promote bonding; at least one of the two or more metal sheets including at least a portion of a microfluidic channel disposed therein;bringing the flat major surface of each of the two or more metal sheets into a contacting relationship with at least one of the two or more sheets thereby forming an interface and forming and enclosing the microfluidic channel at the interface between such sheets, the microfluidic channel having at least one entrance port and at least one exit port;heating the contacting sheets in a vacuum furnace or an inert-atmosphere furnace to a temperature substantially below melting temperature of such sheets;urging the contacting sheets together under a compressive stress while the sheets are being heated to bond the sheets together by causing grains of the two or more metal sheets to merge across the interface from one sheet to the other sheet;cooling the bonded two or more sheets to about room temperature; andapplying at least an organic coating to the microfluidic channel enclosed between the bonded two or more sheets through at least one of the at least one entrance port or the at least one exit port.2. The diffusion-bonded product of claim ...

Methods for directly bonding silicon to silicon or silicon carbide to silicon carbide

A method for bonding a first silicon part to a second silicon part includes arranging the first silicon part and the second silicon part in direct physical contact on a surface in a thermal insulating structure; controlling pressure in the thermal insulating structure to a predetermined pressure; controlling temperature in the thermal insulating structure to a predetermined temperature using one or more heaters; and bonding the first silicon part and the second silicon part during a process period. The predetermined temperature is in a temperature range that is greater than or equal to 1335° C. and less than 1414° C.

PRESSURE TRANSFER PLATE FOR PRESSURE TRANSFER OF A BONDING PRESSURE

A pressure transfer plate for transferring a bonding pressure, especially in thermocompression bonding, from a pressurization apparatus to a wafer, comprising a first pressure side for making contact with a pressurization apparatus, a second pressure side facing away from the first pressure side having an effective contact area for making contact with the wafer and pressurizing it, at least the effective contact area having a low adhesiveness relative to the wafer. 110-. (canceled)11. A pressure transfer disk for transferring a bonding pressure , especially in thermocompression bonding , from a pressurization apparatus to a wafera first pressure side for making contact with the pressurization apparatus,a second pressure side facing away from the first pressure side, said second pressure side having an effective contact area for making contact with the wafer and pressurizing it, at least the effective contact area having a low adhesiveness relative to the wafer, wherein the pressure transfer disk is made as a lattice network.12. The pressure transfer disk as claimed in claim 11 , wherein the adhesiveness is defined by a surface energy of less than 0.1 J/m.13. The pressure transfer disk as claimed in claim 11 , wherein the adhesiveness of the contact area is defined with a contact angle greater than 20°.14. The pressure transfer disk as claimed in claim 11 , wherein the lattice network has a mesh width M less than 2 mm.15. The pressure transfer disk as claimed in claim 11 , wherein at least the contact area of the second pressure side has a surface roughness M′ between 100 nm and 100 μm claim 11 , produced by one of the following: shotpeening claim 11 , sandblasting claim 11 , grinding claim 11 , etching and/or polishing.16. The pressure transfer disk as claimed in claim 11 , wherein the pressure transfer disk is formed from a material which is thermodynamically stable up to at least 400° C.17. The pressure transfer disk as claimed in claim 11 , wherein the pressure ...

METHOD OF FORMING AN INFLATED AEROFOIL

There is proposed a method of forming an inflated aerofoil (), the method comprising the steps of: forming a layered, planar pre-form (); providing at least one stress-relieving opening () through the pre-form; hot creep forming and inflating the pre-form () to form an intermediate aerofoil; and subsequently removing material from the intermediate aerofoil, including at least a region containing the or each stress-relieving opening (), to form a finished aerofoil. 1. A method of forming an inflated aerofoil , the method comprising the steps of: forming a layered , planar pre-form; providing at least one stress-relieving opening through the pre-form; hot creep forming and inflating the pre-form to form an intermediate aerofoil; and subsequently removing material from the intermediate aerofoil , including at least a region containing the or each stress-relieving opening , to form a finished aerofoil.2. A method according to claim 1 , further including the step of providing at least one datum region on the pre-form claim 1 , for use in locating the pre-form during said hot creep forming and inflating steps claim 1 , wherein said step of forming said at least one stress-relieving opening involves forming the or each opening in or adjacent a said datum region claim 1 , and said step of removing material from the intermediate aerofoil involves removing the or each datum region.3. A method according to claim 1 , further including a step of defining on the pre-form a nominal profile of the aerofoil to be formed.4. A method according to claim 3 , wherein said step of defining a nominal profile involves machining the nominal profile on at least one outwardly directed face of the pre-form.5. A method according to claim 2 , further including a step of defining on the pre-form a nominal profile of the aerofoil to be formed claim 2 , wherein the or at least one said stress-relieving opening is provided through the pre-form at a position located between a said datum region and a ...

Reheatable and washproof container with insulation properties

The various embodiments herein provide an insulated container. The container comprises a body assembly and a lid assembly. The body assembly comprises of an outer plastic body and a plastic ring insert molded with an inner stainless steel (SS) container. The inner SS container has a non-woven polyester fabric acting as an insulation material. The non-woven polyester fabric is enclosed in between the outer plastic body and the inner SS container. The lid assembly comprises of a plastic top lid, an inner lid and a bowl with non-woven polyester fabric acting as insulation. The polyester fabric is sandwiched between the plastic top lid, the inner lid and the bowl. In the body assembly, the outer plastic body and the inner plastic ring is joined together using a spin welding technique. In the lid assembly the top lid, inner lid and bowl are joined together using spin welding technique.

APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME

A substrate stacking apparatus that stacks first and second substrates on each other, by forming a contact region where the first substrate held by a first holding section and the second substrate held by a second holding section contact each other, at one portion of the first and second substrates, and expanding the contact region from the one portion by releasing holding of the first substrate by the first holding section, wherein an amount of deformation occurring in a plurality of directions at least in the first substrate differs when the contact region expands, and the substrate stacking apparatus includes a restricting section that restricts misalignment between the first and second substrates caused by a difference in the amount of deformation. In the substrate stacking apparatus above, the restricting section may restrict the misalignment such that an amount of the misalignment is less than or equal to a prescribed value. 124-. (canceled)25. A substrate processing method for processing at least one of a first substrate and a second substrate to be stacked on each other , comprising:forming a structure on each of the first substrate and the second substrate, the structure of the at least one of the first substrate and the second substrate being formed at a position such that misalignment is restricted between the structure of the first substrate and the structure of the second substrate once the first substrate and the second substrate have been stacked on each other to form a substrate stack.26. The substrate processing method according to claim 25 , whereinthe structure of the at least one of the first substrate and the second substrate is formed at the position according to an amount of deformation of the first substrate.27. The substrate processing method according to claim 26 , whereinthe amount of deformation includes an amount of deformation generated in the first substrate during a process of stacking the first substrate and the second substrate on ...

METHOD FOR PRODUCING NANO-COMPOSITE METAL MEMBER AND METHOD FOR JOINING PHASE-SEPARATED METAL SOLIDS

A method for producing a nano-composite metal member, by which a nano-composite metal member can be readily produced and the production cost can be reduced, and a method for joining phase-separated metal solids using the principle same as that of the former method are provided. A nano-composite metal member is obtained by bringing a solid metal body comprising a first component into contact with a solid metal material comprising a compound, an alloy or a non-equilibrium alloy that simultaneously contains a second component and a third component having a positive heat of mixing and a negative heat of mixing, respectively, relative to the first component, and then performing heat treatment at a predetermined temperature for a predetermined length of time, so as to cause interdiffusion between the first component and the third component. 1. A method for producing a nano-composite metal member , which comprises:bringing a solid metal body comprising a first component into contact with a solid metal material comprising a compound, an alloy or a non-equilibrium alloy that simultaneously contains a second component and a third component having a positive heat of mixing and a negative heat of mixing, respectively, relative to the first component; andperforming heat treatment at a predetermined temperature for a predetermined length of time, so as to cause interdiffusion between the first component and the third component.2. The method for producing a nano-composite metal member according to claim 1 , wherein the heat treatment is performed after the contact of the metal body with the metal material claim 1 , so that the first component and the third component are interdiffused for binding with each other.3. The method for producing a nano-composite metal member according to claim 1 , wherein the heat treatment is performed by maintaining a temperature corresponding to no less than 50% of the melting point of the metal body on the basis of the absolute temperature.4. The ...

Bonded functionally graded material structure for heat transfer and cte matching and method of making same

A method for producing a bonded functionally graded Material (FGM) structure, includes the steps of providing a plurality of dissimilar material layers; forming a first group and a second group of through holes alternately on a plurality of intermediate dissimilar material layers and on a bottom dissimilar material layer, wherein the first group of through holes has a diameter larger than a diameter of the second group of through holes; stacking the plurality of dissimilar material layers on top of one another. A first group of through holes on any dissimilar material layer is arranged corresponding to a second group of through holes on a dissimilar material layer stacked above, and a second group of through holes on any dissimilar material layer is arranged corresponding to a first group of through holes on a dissimilar material stacked right below; and bonding the plurality of dissimilar material layers.

METHOD AND SYSTEM FOR FUSING PIPE SEGMENTS

A system for securing first and second metal workpieces to a central metal workpiece located therebetween. The system includes clamps to secure the first and second metal workpieces in coaxial alignment with the central metal workpiece, and the central metal workpiece is rotatable about its axis. Heating elements heat opposed ends of the first and the central metal workpieces, and opposed ends of the second and the central metal workpieces to a hot working temperature. While the opposed ends are at the hot working temperature, the heating elements are removed, and the opposed ends are engaged with each other, and the opposed ends of the central metal workpiece are rotated relative to the other opposed ends engaged therewith. 1. A system for securing first and second metal workpieces defining first and second central axes thereof to a central metal workpiece defining a central axis thereof located between the first and second metal workpieces , the system comprising:first and second clamps, securable to the first and second metal workpieces respectively;a central gear, securable to the central metal workpiece;a drive gear, meshably engagable with the central gear;a motor, for rotating the central metal workpiece about the central axis;first and second heating elements, positionable respectively between (i) the first metal workpiece and the central metal workpiece, and (ii) the second metal workpiece and the central metal workpiece, for respectively heating (i) opposed ends of the first metal workpiece and the central metal workpiece, and (ii) opposed ends of the second metal workpiece and the central metal workpiece;at least one shielding subassembly, for providing at least one non-oxidizing atmosphere enveloping the opposed ends of the first metal workpiece and the central metal workpiece and the opposed ends of the second metal workpiece and the central metal workpiece;at least one first ram subassembly, for pushing the first metal workpiece against the central ...

WIRE FUSING APPARATUS

A wire fusing apparatus including a first body having a first surface, a second body having a second surface, and a heating unit is provided. The second body is pivoted to the first body to rotate relatively to the first body enabling the first and second bodies to be in an expanded or a closed state. When the first and second bodies are in the closed state, the first and second surfaces define a closed containing groove for containing two independent wires butt jointed with each other. The first surface, the second surface and the containing groove each has a heat-conducting region, and the heat-conducting regions contact each other when the first and second bodies are in the closed state. The heating unit disposed on the first or second body contacts one of the heat-conducting regions for heat-fusing a butt-jointing point of the wires to form a fused wire. 1. A wire fusing apparatus , comprising:a first body, having a first surface;a second body, pivoted to one side of the first body to rotate relatively to the first body to be in an away state or a closed state with the first body, the second body having a second surface, wherein the first surface and the second surface each has a heat-conducting region, and when the first body and the second body are in the closed state, the first surface and the second surface are closed and jointly define a containing groove passing through the heat-conducting regions and for containing two independent wires butt-jointed with each other, wherein the heat-conducting regions contact each other when the first body and the second body are in the closed state; anda heating unit, disposed on the first body or the second body, and contacting one of the heat-conducting regions for heat a butt-jointing point of the two wires to form a fused wire by fusing the two wires.2. The wire fusing apparatus according to claim 1 , further comprising a heating control interface configured to be electrically connected to the heating unit so as to ...

ENCAPSULATED COMPOSITE BACKING PLATE

A backing plate for use with a sputtering target is disclosed including a core component formed of a composite material and an outer layer formed of a metal or metal alloy, wherein the outer layer completely surrounds and covers said core component. A method for recycling such a backing plate is also disclosed. 1. A backing plate for use with a sputtering target , comprising:a core component formed of a composite material; andan outer layer of a metal or metal alloy, said outer layer completely surrounding and covering said core component.2. The backing plate of claim 1 , wherein said outer layer is selected from the group consisting of aluminum claim 1 , vanadium claim 1 , niobium claim 1 , copper claim 1 , titanium claim 1 , tantalum claim 1 , tungsten claim 1 , ruthenium claim 1 , germanium claim 1 , selenium claim 1 , zirconium claim 1 , molybdenum claim 1 , hafnium claim 1 , and alloys and combinations thereof.3. The backing plate of claim 1 , wherein said backing plate has a circular shape and a thickness claim 1 , said outer layer further comprising an annular flange made of the same material as said outer layer claim 1 , said annular flange extending radially outwardly of said core component around a periphery of said backing plate.4. The backing plate of claim 3 , wherein said annular flange has a thickness less than said backing plate thickness.5. The backing plate of claim 3 , wherein said annular flange includes at least one opening extending therethrough.6. The backing plate of claim 1 , wherein said core component is formed of a metal matrix composite (MMC) including a reinforcing material dispersed in a metal matrix.7. The backing plate of claim 6 , wherein the metal matrix is selected from the group consisting of aluminum claim 6 , vanadium claim 6 , niobium claim 6 , copper claim 6 , titanium claim 6 , tantalum claim 6 , tungsten claim 6 , ruthenium claim 6 , germanium claim 6 , selenium claim 6 , zirconium claim 6 , molybdenum claim 6 , hafnium ...

Apparatus and Method for Establishing an Electrically Conductive and Mechanical Connection

An apparatus includes a main body having an electrode and a contact element. The contact element is directly mechanically and electrically conductively connected to the electrode in order to form an electrical connection between the main body and the contact element. The electrical and mechanical connection between the electrode and the contact element is free of melting regions of the materials of the electrode and of the contact element that are involved in the connection. Furthermore, the connection is realized in a manner free of connection material, for example, in a manner free of solder material. 114-. (canceled)15. An apparatus comprising:a main body having an electrode; anda contact element directly mechanically and electrically conductively connected to the electrode in order to electrically conductively and mechanically connect the main body and the contact element so that an electrical and mechanical connection between the electrode and the contact element is free of melting regions of materials of the electrode and of the contact element that are involved in the connection and wherein the connection is realized in a manner free of solder material.16. The apparatus according to claim 15 , wherein the connection is realized in a manner free of any connection material.17. The apparatus according to claim 15 , wherein the connection is formed by a cohesive diffusion connection between the material of the electrode and the material of the contact element.18. The apparatus according to claim 15 , wherein the connection has a plurality of local connection regions delimited from one another between the electrode and the contact element.19. The apparatus according to claim 15 , wherein a surface of the contact element that faces the electrode has a noble metal surface region in a connecting region in which the connection is formed.20. The apparatus according to claim 15 , wherein the contact element is a wire.21. The apparatus according to claim 15 , wherein the ...

SHEAR BONDING DEVICE AND SHEAR BONDING METHOD OF METAL PLATES

A shear bonding device and a shear bonding method of metal plates are disclosed. The shear bonding device may include: an upper shear bonding mold having more than one upper perpendicular tooth and more than one upper slanted tooth formed alternately on a front end surface thereof; a lower shear bonding mold overlapped with the upper shear bonding mold in a vertical direction by a predetermined width below the upper shear bonding mold, and having more than one lower perpendicular tooth corresponding to the more than one upper slanted tooth and the more than one upper perpendicular tooth corresponding to the more than one lower slanted tooth formed alternately on a front end surface confronting the upper shear bonding mold; an upper heating clamper including a front end surface contacting with the upper perpendicular tooth of the upper shear bonding mold and adapted to generate heat by receiving power from a power supply; a lower heating clamper including a front end surface contacting with the lower perpendicular tooth of the lower shear bonding mold and adapted to generate heat by receiving power from the power supply; upper and lower pressing cylinders moving the upper and lower shear bonding molds upwardly or downwardly so as to apply load; and upper and lower clamping cylinders moving the upper and lower heating clampers upwardly or downwardly so as to apply clamping force and load, wherein the metal plates are disposed between the upper shear bonding mold and heating clamper, and the lower shear bonding mold and heating clamper. 1. A shear bonding device of metal plates comprising:an upper shear bonding mold having more than one upper perpendicular tooth and more than one upper slanted tooth formed alternately on a front end surface thereof;a lower shear bonding mold overlapped with the upper shear bonding mold in a vertical direction by a predetermined width below the upper shear bonding mold, and having more than one lower perpendicular tooth corresponding to ...

TOOL AND METHOD FOR BONDING LAYERS OF A METALLIC AXISYMMETRIC STRUCTURE HAVING COMPLEX CURVATURES

A tool and method for bonding layers of a shell by the differential pressure bonding process. The tool and method includes a plurality of separable mandrel segments that combine to form a mandrel having a longitudinal axis, an outer surface, an upper end, and at least one substantially continuous inner surface. The inner surface has a substantially axisymmetric shape having complex curvature. In this embodiment, the tool further includes a retort configured to at least partially shroud the outer surface and upper end of the hollow body. The retort includes at least one vacuum port. The tool is configured to facilitate the compression of a plurality of layers of a multi-layer shell having complex curvature as the shell layers and an interdisposed bonding material are heated to an elevated bonding temperature. 1. A method of bonding a plurality of layered materials by differential pressure bonding to produce an axisymmetric shell having an exterior surface with at least one convex or concave curvature , the method comprising:(a) assembling a segmented mandrel comprising a plurality of separable mandrel segments, the assembled mandrel having at least one substantially continuous inner surface that substantially corresponds in shape to the exterior surface of the shell;(b) assembling the layered materials about the inner surface of the assembled mandrel; and(c) heating the assembled mandrel and the layered materials to an elevated bonding temperature while establishing a pressure differential that presses the layered component materials against the inner surface of the mandrel as the layered materials are bonded together.2. The method of claim 1 , further comprising:(a) cooling the mandrel and the bonded shell;(b) removing at least a first mandrel segment from the assembled mandrel; and(c) separating the shell from the remaining mandrel segment or segments of the mandrel assembly.3. The method of claim 1 , further comprising:(a) covering a substantial portion of the ...

Method of forming gas turbine engine components

A method of forming a gas turbine engine component according to an example of the present disclosure includes, among other things, attaching a cover skin to an airfoil body, the airfoil body and the cover skin cooperating to establish pressure and suction sides of an airfoil, positioning the airfoil between first and second dies of a deforming station, heating the airfoil body to a first predefined temperature threshold between the first and second dies, and moving the first die relative to the second die to hold the airfoil between the first and second dies subsequent to the heating step, and then deforming the airfoil between the first and second dies.

METHOD OF MAKING AN EDGE-TO-EDGE METAL COMPOSITE

A clad metal composite produced according to a method for edge-to-edge cladding of two or more different metals (such as aluminum and copper). The metals are joined next to each other to form an edge-to-edge or side-by-side clad bimetal. In one embodiment, nine metal strips are used to create the desired clad metal composite. The design includes strips of metal that have industry standard cut edges (such as, slit-cut edges). The clad metal composite may include multiple layers of metals positioned edge-to-edge. 1. A method for creating a clad metal composite strip comprising the steps of:a) providing a first layer of metal strips including a first side strip of a first metal, a second side strip of the first metal and a center strip of a second metal, the first side strip abutting one edge of the center strip and the second side strip abutting the opposite edge of the first center strip, wherein the first center strip has a first width and the first and second side strips having a second width;b) aligning a second layer of metal strips with the first layer of metal strips, the second layer of metal strips having a width commensurate with the width of the first layer of metal strips and including a second center strip of the second metal and a third and fourth side strips of the first metal, the third side strip abutting one edge of the second center strip and the fourth side strip abutting the opposite edge of the second center strip, wherein the second center strip has a third width and the third and fourth side strips have a fourth width;c) aligning a third layer of metal strips with the second layer of metal strips, the third layer of metal strips having a width commensurate with the width of the first and second layers of metal strips and including a third center strip of the second metal and a fifth and sixth side strips of the first metal, the fifth side strip abutting one edge of the third center strip and the sixth side strip abutting the opposite edge of ...

PRESSURE APPLYING UNIT

Provided is a pressure applying unit used in baking a metal particle paste of an assembled body formed by arranging an electronic part on a substrate with the metal particle paste interposed therebetween by heating the assembled body while applying pressure to the assembled body using a pair of heating parts. The pressure applying unit includes: a pair of transferring members which transfers pressure and heat to the assembled body by sandwiching the assembled body therebetween; guide members which movably connect the pair of transferring members to each other; and a distance adjusting mechanism being configured to make the second transferring member separated from the assembled body during a pressure non-applying time and brings both the first transferring member and the second transferring member into contact with the assembled body during a pressure applying time. 1. A pressure applying unit used in baking a metal particle paste of an assembled body formed by arranging an electronic part on a substrate with the metal particle paste interposed therebetween by heating the assembled body while applying pressure to the assembled body using a pair of heating parts , whereinassuming a time during which pressure is not applied to the pressure applying unit as a pressure non-applying time and a time during which predetermined pressure is applied to the pressure applying unit as a pressure applying time,the pressure applying unit comprises:a pair of transferring members which is constituted of a plate-like first transferring member being in contact with the substrate at least during the pressure applying time and a plate-like second transferring member being in contact with the electronic part at least during the pressure applying time and transfers pressure and heat to the assembled body by sandwiching the assembled body therebetween in sintering the metal particle paste;a guide member which connects the pair of transferring members to each other, and allows the movement ...

GOLF CLUB FACE PLATES WITH INTERNAL CELL LATTICES

Embodiments of golf club face plates with internal cell lattices are presented herein. Other examples and related methods are also disclosed herein. 1. A golf club head comprising: an inner skin;', 'an outer skin;', 'a plurality of cells defined by the plurality of walls, the plurality of cells positioned between the inner skin and the outer skin;', 'a cell lattice with a plurality of walls having, 'wherein the cell lattice of the faceplate further defines a plurality of cell lattice regions comprising the cell lattice, including: a center lattice region, a top-heel lattice region, a top-toe lattice region, a bottom-toe lattice region, and a bottom-heel lattice region;', 'wherein the cell lattice comprises a wall height that varies relative to a position from the inner skin and the outerskin within at least one of the plurality of cell lattice regions for controlling stiffness within the at least one of the plurality of cell lattice regions., 'a faceplate comprising2. The golf club head of claim 1 , wherein the cell lattice of at least one of the plurality of cell lattice regions further comprises a wall thickness that varies relative to a position from the inner skin and the outer skin.3. The golf club head of claim 1 , wherein the plurality of cells of at least one of the plurality of cell lattice regions further comprise a cell width that varies relative to a position from the inner skin and the outer skin.4. The golf club head of claim 1 , wherein the center lattice region is stiffer than at least one of the top-heel lattice region claim 1 , top-toe lattice region claim 1 , bottom-toe lattice region claim 1 , and bottom-heel lattice region.5. The golf club head of claim 1 , wherein the cell lattice of each of the plurality of cell lattice regions is selected from the group consisting of hexagonal claim 1 , diamond claim 1 , square claim 1 , circular claim 1 , circular interspersed with triangles claim 1 , and cell subsets with walls.6. The golf club head of ...

Laser processing method and laser processing apparatus

A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein at pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Transferring member and pressure applying unit

Provided is transferring members having a plate-like shape used in baking a metal particle paste of an assembled body formed by arranging an electronic part on a substrate with the metal particle paste interposed therebetween by applying pressure to the assembled body and by heating the assembled body, the transferring members being configured to sandwich the assembled body in baking the metal particle paste, wherein the transferring members are made of a material having thermal conductivity which falls within a range of from 1 to 200 W/(m k) and Vickers hardness which falls within a range of from 180 to 2300 kgf/mm 2 . With such a configuration, it is possible to provide a transferring member for being used in a method of manufacturing a bonded body which can suppress the lowering of bonding property between a substrate and an electronic part and which can prevent the remarkable lowering of productivity of a bonded body.

COMPOSITE POROUS INTERBODIES AND METHODS OF MANUFACTURE

A method of forming a composite titanium body for use in forming spinal implant interbodies includes selecting a metal alloy body, carving out a top portion and a bottom portion from the metal alloy body, and bonding a porous material to the carved-out top and bottom portions. Multiple pieces may be cut from the composite titanium body, each having a front face formed of the metal alloy, top and bottom portions formed of the porous material, and with a medial portion of the metal alloy extending from the front face to the back. Methods and devices for spinal interbodies having locking mechanisms to prevent bone screw back-out are also described. 1. A method of manufacturing a composite interbody , the method comprising:selecting a solid titanium body having a top side and a bottom side;carving out a portion of the top side of the solid titanium body to form a top portion void;carving out a portion of the bottom side of the solid titanium body to form a bottom portion void;diffusion bonding porous titanium to the top portion void;diffusion bonding porous titanium to the bottom portion void, the steps of diffusion bonding porous titanium to the top portion void and bottom portion void forming a composite titanium block; andcutting out a composite interbody from the composite titanium block.2. A composite interbody system comprising:a body having an anterior face and an opposing posterior face, a top portion and a bottom portion, with a medial portion extending through the body from the anterior face to the opposing posterior face; andthe anterior face formed of titanium alloy, the top portion and bottom portion formed of porous titanium, and the medial portion formed of titanium alloy.3. The composite interbody system of claim 2 , wherein the anterior face and medial portion are formed of a single piece of titanium alloy.4. The composite interbody system of claim 3 , wherein the porous titanium comprises sheets of porous titanium diffusion bonded together to form the ...

METHOD FOR BONDING STAINLESS STEEL MEMBERS AND STAINLESS STEEL

A method for bonding stainless steel members includes: contacting a first stainless steel member with a second stainless steel member that has a strain exceeding 50% reduction; and heating the first and second stainless steel members to a re-crystallization initiation temperature or higher, after the contacting. 1. A method for bonding stainless steel members comprising:contacting a first austenitic stainless steel member with a second austenitic stainless steel member that contains at least 30 volume % of martensite; andheating the first and second austenitic stainless steel members to an As temperature or higher, after the contacting.2. The method for bonding stainless steel members as claimed in claim 1 , wherein the first austenitic stainless steel member contains at least 30 volume % of martensite.3. The method for bonding stainless steel members as claimed in claim 1 , wherein in the heating claim 1 , the first austenitic stainless steel member and the second austenitic stainless steel member are heated to a temperature that is equal to the As temperature or higher and is equal to a re-crystallization initiation temperature plus 100 degrees C. or lower. This application is a divisional of U.S. application Ser. No. 14/881,971 filed Oct. 13, 2015, the entire contents of which is incorporated herein by reference. U.S. application Ser. No. 14/881,971 is a continuation application of International Application PCT/JP2014/074972 filed on Sep. 19, 2014 and designated the U.S., the entire contents of which are incorporated herein by reference.The present application relates to a method for bonding stainless steel members and a stainless steel.A technology for bonding stainless steel members is being demanded. For example, Patent Document 1 discloses a technology in which surfaces of metal members are activated by removing oxides on bonding faces with a chemical treatment and thereby a diffusion bonding is performed at a low temperature for suppressing grain coarsening. ...

CRYSTALLINE ALLOY HAVING GLASS FORMING ABILITY, METHOD FOR MANUFACTURING SAME, ALLOY TARGET FOR SPUTTERING, AND METHOD FOR MANUFACTURING SAME

The purpose of the present invention is to provide a crystalline alloy having glass forming ability which has significantly superior thermal stability for being amorphous while having glass forming ability, and a manufacturing method for same. In addition, another purpose of the present invention is to provide an alloy target for sputtering, manufactured by using the crystalline alloy, and a method for manufacturing same. According to one aspect of the present invention, provided is the crystalline alloy having glass forming ability and comprising three or more elements having glass forming ability, wherein the average grain size of the alloy is 0.1-5 μm, and wherein the alloy comprises 67-78 atomic percentage of Zr, 4-13 atomic percentage of Al and/or Co, and 15-24 atomic percentage of Cu and/or Ni. 1. A crystalline alloy having amorphous forming ability , composed of three or more elements having an amorphous forming ability ,wherein the crystalline alloy has an average size of crystal grains in the range of 0.1 μm through 5 μm,wherein the alloy comprises 67 atomic % through 78 atomic % of Zr, 4 atomic % through 13 atomic % of one or more selected from Al and Co, and 15 atomic % through 24 atomic % of one or more selected from Cu and Ni.2. The crystalline alloy of claim 1 , wherein the alloy comprises 67 atomic % through 78 atomic % of Zr claim 1 , 4 atomic % through 12 atomic % of Co claim 1 , and 15 atomic % through 24 atomic % of one or more selected from Cu and Ni.3. The crystalline alloy of claim 1 , wherein the alloy comprises 67 atomic % through 78 atomic % of Zr claim 1 , 3 atomic % through 10 atomic % of Al claim 1 , 2 atomic % through 9 atomic % of Co claim 1 , and 17 atomic % through 23 atomic % of one or more selected from Cu and Ni.4. The crystalline alloy of claim 1 , wherein the alloy has capable to obtain an amorphous ribbon having casting thickness in the range of 20 μm through 100 μm when the melt of the alloy is casted with a cooling rate in the ...

GOLF CLUB FACE PLATES WITH INTERNAL CELL LATTICES AND RELATED METHODS

Embodiments of golf club face plates with internal cell lattices are presented herein. Other examples and related methods are also disclosed herein. 1. A golf club head comprising:a top rail, a sole, a heel, a toe, a faceplate, a rear portion, and a hosel,wherein the faceplate comprises an inner skin, a midsection, and an outer skin defining at least a portion of a striking surface,wherein the midsection comprises a cell lattice region,wherein the cell lattice region comprises a cell lattice comprising a plurality of cells;the faceplate further comprising a target strike region, wherein the target strike region does not comprise a cell lattice; andthe rear portion comprising a rear portion void comprising a plurality of cross ribs extending within the rear portion void.2. The golf club head of claim 1 , wherein the faceplate comprises a plurality of apertures extending through the inner skin.3. The golf club head of claim 2 , wherein each of the plurality of apertures extends from a cell within the midsection of the faceplate.4. The golf club head of claim 1 , wherein each of the plurality of cells further comprise cell walls having a wall thickness.5. The golf club head of claim 4 , wherein a minimum wall thickness ranges from 0.005 inches to 0.2 inches.6. The golf club head of claim 4 , wherein at least one of the cell walls of at least one of the plurality of cells comprises a gap.7. The golf club head of claim 1 , wherein the rear portion comprises a toe section claim 1 , a heel section claim 1 , and a center section and;wherein the rear portion void is formed in the center section of the rear portion.8. The golf club head of claim 1 , wherein the rear portion comprises a rear aperture providing a pathway from the rear portion void to an exterior of the golf club head.9. The golf club head of claim 8 , wherein the rear aperture is filled in.10. The golf club head of claim 10 , further comprising a tip weight and a toe screw weight claim 10 , wherein the tip ...

Steel sheet and method for producing same

Steel sheet low in cost and improved in fatigue characteristics without causing a drop in the cold formability, characterized in that it comprises an inner layer and a hard layer on one or both surfaces of the inner layer, a thickness of the hard layer is 20 μm or more and 40% or less of the thickness of the steel sheet, an average micro-Vickers hardness of the hard layer is 240 HV or more and less than 400 HV, an amount of C of the hard layer is 0.4 mass % or less, an amount of N is 0.02 mass % or less, a variation of hardness measured by a nanoindenter at a depth of 10 from the surface of the hard layer is a standard deviation of 2.0 or less, an average micro-Vickers hardness of the inner layer is 80 HV or more and less than 400 HV, a volume rate of carbides contained in the inner layer is less than 2.00%, and the average micro-Vickers hardness of the hard layer is 1.05 times or more the average micro-Vickers hardness of the inner layer.

METALLIC THIN-FILM BONDING AND ALLOY GENERATION

Diffusion bonding a stack of aluminum thin films is particularly challenging due to a stable aluminum oxide coating that rapidly forms on the aluminum thin films when they are exposed to atmosphere and the relatively low meting temperature of aluminum. By plating the individual aluminum thin films with a metal that does not rapidly form a stable oxide coating, the individual aluminum thin films may be readily diffusion bonded together using heat and pressure. The resulting diffusion bonded structure can be an alloy of choice through the use of a carefully selected base and plating metals. The aluminum thin films may also be etched with distinct patterns that form a microfluidic fluid flow path through the stack of aluminum thin films when diffusion bonded together. 1. A method of diffusion bonding a stack of aluminum thin films comprising:plating each of the aluminum thin films with another metal; andapplying one or both of heat and pressure to the stack of plated aluminum thin films for a time period sufficient to diffusion bond the thin films together and distribute the metal plating evenly throughout the thin films.2. The method of claim 1 , wherein the metal plating includes one or more of copper claim 1 , silver claim 1 , nickel claim 1 , manganese claim 1 , chromium and zinc.3. The method of claim 1 , wherein the aluminum thin films are each made of an aluminum alloy.4. The method of claim 1 , further comprising:etching a distinct pattern into each of the aluminum thin films prior to diffusion bonding the aluminum thin films together.5. The method of claim 4 , wherein the distinct patterns etched into the aluminum thin films forms a microfluidic fluid flow path through the stack of aluminum thin films.6. The method of claim 4 , wherein the distinct patterns etched into the aluminum thin films forms a microstructure within the stack of aluminum thin films.7. The method of claim 1 , wherein the metal plating forms an oxide at a slower rate than the aluminum thin ...

Method of Fabricating Roll-Bonded Expanded Load-Bearing Aluminum Laminate Structural Elements for Vehicle

An expanded laminate and method of forming an expanded laminate are disclosed. In at least one embodiment, the method includes selectively applying a relatively high temperature-resistant material to a surface of a first metal sheet to form a covered portion and an uncovered portion and diffusion bonding the first metal sheet to a second metal sheet at the uncovered portion to form a bonded region and an unbonded region. Pressurized gas may be introduced between the first and second metal sheets to expand the first and second metal sheets in the unbonded region. The metal sheets may be aluminum sheets. The sheets may be positioned in a die having a plurality of cavities such that when the pressurized gas is introduced the sheets expand into the cavities. The diffusion bonding may be performed by applying pressure, for example, using rollers. 1. A method comprising:selectively applying a relatively high temperature-resistant material to a surface of a first metal sheet to form a covered portion and an uncovered portion;diffusion bonding the first metal sheet to a second metal sheet at the uncovered portion to form a bonded region and an unbonded region; andintroducing pressurized gas between the first and second metal sheets to expand the first and second metal sheets in the unbonded region.2. The method of claim 1 , wherein a plurality of uncovered portions are formed in the selectively applying step and the plurality of uncovered portions are diffusion bonded to form a plurality of bonded regions in the diffusion bonding step.3. The method of claim 1 , wherein the first and second metals sheets are aluminum alloy sheets.4. The method of claim 1 , wherein the relatively high temperature-resistant material includes graphite or aluminum oxide.5. The method of claim 1 , wherein the bonded region and the unbonded region have a same initial thickness and the unbonded region has a finished thickness that is greater than the initial thickness after the pressurized gas is ...

METHOD OF MANUFACTURING A METALLIC COMPONENT BY USE OF WIRE WINDING AND HOT ISOSTATIC PRESSING

The present invention relates to a method of manufacturing a metallic component () wherein a plurality of layers of metallic wire () is wound around a mandrel or inner layer (). An outer layer of a metallic material is provided around the wound layers of wire () so that a canister () is obtained. The canister () is then evacuated and sealed before it placed in a hot isostatic pressing device () at high pressure and high temperature for a predetermined period of time. Hereby at least a majority of the windings of wire () consolidate and diffusion-bond to form the metallic component (). In some embodiments of the invention, the canister () and/or the mandrel/inner layer () is/are not removed after the consolidation and thus forms an integral part of the component (). 1. Method of manufacturing a metallic component , the method comprising—providing a mandrel or inner layer of a metallic material ,winding a plurality of layers of metallic wire around the mandrel or inner layer so that each of at least a majority of subsequent layers of wire touches at least one adjacent layer of wire,providing an outer layer of a metallic material around the wound layers of wire so that a canister is obtained,evacuating and sealing the canister,placing the canister in a hot isostatic pressing device at highpressure and high temperature for a predetermined period of time in order to consolidate and diffusion-bond at least a majority of the windings of wire to form the metallic component.2. Method according to claim 1 , wherein the mandrel or inner layer comprises one or more of the following surface features on an outer surface: groove claim 1 , rib claim 1 , strut.3. Method according to claim 1 , wherein the mandrel or inner layer is made by additive manufacturing or by incremental forming.4. Method according to claim 1 , wherein the canister and/or the mandrel/inner layer is/are removed after the consolidation of the wire material.5. Method according to claim 1 , wherein the canister ...

Advanced Device Assembly Structures And Methods

A microelectronic assembly includes a first substrate having a surface and a first conductive element and a second substrate having a surface and a second conductive element. The assembly further includes an electrically conductive alloy mass joined to the first and second conductive elements. First and second materials of the alloy mass each have a melting point lower than a melting point of the alloy. A concentration of the first material varies in concentration from a relatively higher amount at a location disposed toward the first conductive element to a relatively lower amount toward the second conductive element, and a concentration of the second material varies in concentration from a relatively higher amount at a location disposed toward the second conductive element to a relatively lower amount toward the first conductive element. 1. A microelectronic assembly , comprising:a first substrate having a first surface and first conductive elements;a second substrate having a second surface and second conductive elements; anda plurality of electrically conductive masses, each mass joined to a respective pair of the first and second conductive elements,wherein each electrically conductive mass includes a first material, a second material, and a third material, the third material selected to increase the melting point of an alloy including the third material and at least one of the first material or the second material,wherein a concentration of the first material varies from a relatively higher amount at a location disposed toward the respective first conductive element to a relatively lower amount toward the respective second conductive element,wherein a concentration of the second material varies in concentration from a relatively higher amount at a location disposed toward the respective second conductive element to a relatively lower amount toward the respective first conductive element, andwherein the third material has a highest concentration at a location ...

APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME

A substrate stacking apparatus that stacks first and second substrates on each other, by forming a contact region where the first substrate held by a first holding section and the second substrate held by a second holding section contact each other, at one portion of the first and second substrates, and expanding the contact region from the one portion by releasing holding of the first substrate by the first holding section, wherein an amount of deformation occurring in a plurality of directions at least in the first substrate differs when the contact region expands, and the substrate stacking apparatus includes a restricting section that restricts misalignment between the first and second substrates caused by a difference in the amount of deformation. In the substrate stacking apparatus above, the restricting section may restrict the misalignment such that an amount of the misalignment is less than or equal to a prescribed value. 124-. (canceled)25. A substrate bonding apparatus that forms , at a central portion of a first substrate and a second substrate , a contact region where the first substrate and the second substrate contact each other and then bonds the first substrate and the second substrate so that the contact region expands from the central portion , the substrate bonding apparatus comprising:a first holding section that holds the first substrate; anda second holding section that holds the second substrate, whereinat least one of the first holding section and the second holding section is controlled differently between a region in a first direction and a region in a second direction among directions from a center toward a periphery portion of the at least one of the first holding section and the second holding section, the second direction being different from the first direction.26. The substrate bonding apparatus according to claim 25 , wherein a speed of expansion of the contact region formed between the first substrate and the second substrate is ...

BEARING COMPONENT

A bearing component including a first metallic material and a second metallic material. The first metallic material provides a first carbon content and the second metallic material presents a second carbon content. The first metallic material and the second metallic material have been joined by a diffusion welding process. The diffusion welding process results in a transition zone with a varying carbon content between the first metallic material and the second metallic material. Varying carbon content in the transition zone is within an interval and the interval end points are defined by the carbon contents of the first metallic material and the second metallic material. 1. A bearing component comprising ,a first metallic material and a second metallic material, wherein the first metallic material presents a first carbon content and the second metallic material presents a second carbon content,wherein the first metallic material and the second metallic material have been joined by a diffusion welding process, wherein the diffusion welding process has resulted in a transition zone with a varying carbon content between the first metallic material and the second metallic material, andwherein the varying carbon content in the transition zone is within an interval, andwherein the interval end points are defined by the carbon contents of the first metallic material and the second metallic material.2. The bearing component according to claim 1 , wherein the varying carbon content in the transition zone between the first metallic material and the second metallic material is linear.3. The bearing component according to claim 1 , wherein at least 80% of a total change in carbon content between the first metallic material and the second metallic material takes place at a distance of less than 200 μm measured perpendicularly to the joining surface.4. The bearing component according to claim 1 , wherein at least 80% of a total change in carbon content between the first and the ...

Solderless Mounting for Semiconductor Lasers

A first contact surface of a semiconductor laser chip can be formed to a first target surface roughness and a second contact surface of a carrier mounting can be formed to a second target surface roughness. A first bond preparation layer comprising a first metal can optionally be applied to the formed first contact surface, and a second bond preparation layer comprising a second metal can optionally be applied to the formed second contact surface. The first contact surface can be contacted with the second contact surface, and a solderless securing process can secure the semiconductor laser chip to the carrier mounting. Related systems, methods, articles of manufacture, and the like are also described.

Rotorcraft Masts having a Nonintegral Raceway

A propulsion assembly for a rotorcraft includes a mast including a distal ridge and a proximal ridge forming a retaining pocket therebetween, a raceway receivable by the retaining pocket to form a press fit between the mast and the raceway and a mast bearing assembly including a plurality of bearings facing the mast to engage the raceway. The distal and proximal ridges are operable to reduce axial motion of the raceway along the mast, thereby securing the raceway in the retaining pocket. 1. A propulsion assembly for a rotorcraft comprising:a mast including a distal ridge and a proximal ridge forming a retaining pocket therebetween;a raceway receivable by the retaining pocket to form a press fit between the mast and the raceway; anda mast bearing assembly including a plurality of bearings facing the mast to engage the raceway;wherein, the distal and proximal ridges are operable to reduce axial motion of the raceway along the mast, thereby securing the raceway in the retaining pocket.2. The propulsion assembly as recited in wherein the mast further comprises a material that is not case hardened.3. The propulsion assembly as recited in wherein the mast further comprises stainless steel.4. The propulsion assembly as recited in wherein the mast further comprises titanium.5. The propulsion assembly as recited in wherein the distal and proximal ridges extend circumferentially around the mast.6. The propulsion assembly as recited in wherein the raceway is nonintegral with the mast.7. The propulsion assembly as recited in wherein the raceway is formed from a different material than the mast.8. The propulsion assembly as recited in wherein the raceway further comprises a hardened raceway.9. The propulsion assembly as recited in wherein the raceway further comprises a through hardened raceway.10. The propulsion assembly as recited in wherein the raceway is thermally fitted onto the mast.11. The propulsion assembly as recited in wherein the raceway further comprises an annular ...

HOT FORMED BONDING IN SHEET METAL PANELS

A method for bonding metal workpieces includes: (a) heating a plurality of metal workpieces until the metal workpieces are fully annealed; (b) applying pressure to the metal workpieces to compress the metal workpieces together while the metal workpieces are still heated until the metal workpieces fuse together; and (c) actively cooling the metal workpieces while the metal workpieces are compressed together to join the metal workpieces together. 1. A method , comprising:heating a plurality of metal workpieces until the metal workpieces are fully annealed;applying pressure to the metal workpieces to compress the metal workpieces together while the metal workpieces are still heated until the metal workpieces fuse together; andactively cooling the metal workpieces while the metal workpieces are compressed together to join the metal workpieces together.2. The method of claim 1 , wherein the metal workpieces are actively cooled for five seconds to fifteen seconds.3. The method of claim 1 , wherein the metal workpieces are actively cooled until the metal workpieces reach eighty degrees Fahrenheit.4. The method of claim 1 , wherein the method is characterized by an absence of hemming.5. The method of claim 1 , wherein the method is characterized by an absence of a use of a chemical adhesive.6. The method of claim 1 , wherein the method is characterized by an absence of a use of a fastener.7. The method of claim 1 , wherein the method is characterized by an absence of welding.8. The method of claim 1 , wherein the method is characterized by an absence of soldering.9. The method of claim 1 , wherein at least one of the metal workpieces includes steel claim 1 , and heating the plurality of metal workpieces includes heating the plurality of the metal workpieces at a temperature that is between 1400 degrees Fahrenheit and 1600 degrees Fahrenheit.10. The method of claim 1 , wherein at least one of the metal workpieces includes aluminum claim 1 , and heating the plurality of metal ...

METHOD FOR PRODUCING A STAINLESS STEEL DIFFUSION-BONDED PRODUCT

A method for producing a stainless steel diffusion-bonded product provides a stainless steel material diffusion-bonded product having excellent reliability of the bonded portion by using a direct method, which includes directly contacting stainless steel materials with each other to unify the materials together by diffusion bonding. At least one of the stainless steel materials to be contacted is dual-phase steel having an austenite transformation starting temperature Acpoint of 650 to 950° C. during the temperature elevation and having an austenite+ferrite dual-phase temperature region in the range of 880° C. or higher. Diffusion bonding is advanced under conditions such that the contact surface pressure is in the range of 1.0 MPa or less and the heating temperature is in the range of from 880 to 1,080° C. while being accompanied by the movement of grain boundary caused when the ferrite phase in the dual-phase steel undergoes transformation to an austenite phase. 1. A method for producing a stainless steel diffusion-bonded product , comprising directly contacting stainless steel materials with each other to unify the materials together by diffusion bonding , wherein at least one of the stainless steel materials to be contacted is a dual-phase steel having an austenite transformation starting temperature Acpoint of 650 to 950° C. during the temperature elevation and having an austenite+ferrite dual-phase temperature region in the range of 880° C. or higher , and the diffusion bonding is advanced under conditions such that the contact surface pressure is in the range of 1.0 MPa or less and the heating temperature is in the range of from 880 to 1 ,080° C. while being accompanied by the movement of grain boundary caused when the ferrite phase in the dual-phase steel undergoes transformation to an austenite phase.2. A method for producing a stainless steel diffusion-bonded product , comprising directly contacting stainless steel materials with each other to unify the ...

Wafer-level methods of fabricating semiconductor device packages and related packages

Methods of fabricating semiconductor device packages may involve forming trenches in a first wafer. A dielectric material may be placed over a first active surface. Electrically conductive elements may be operatively connected to bond pads of a second wafer with the dielectric material interposed between the first wafer and the second wafer. Force may be applied to the first wafer and the second wafer while exposing the first wafer and the second wafer to an elevated temperature. Portions of the dielectric material may flow into the trenches. The elevated temperature may be reduced to at least partially solidify the dielectric material. A thickness of the first wafer may be reduced to reveal the portions of the dielectric material in the trenches. The first wager may be singulated and the second wafer may be singulated to form semiconductor dice.

METALLIZING POLYMERS, CERAMICS AND COMPOSITES FOR ATTACHMENT STRUCTURES

A method of manufacture includes forming a metallized tie layer on a surface of a non-metallic component, positioning the surface of the non-metallic component to mate with a metallic surface of a second component, and joining the metallized tie layer with the mated metallic surface of the second component using metal to metal joining techniques. 1. A method of manufacture comprising:forming a metallized tie layer on a surface of a non-metallic component;positioning the surface of the non-metallic component to mate with a metallic surface of a second component; andjoining the metallized tie layer with the mated metallic surface of the second component using metal to metal joining techniques.2. The method of claim 1 , wherein the non-metallic component is one of a group consisting of:a polymeric component;a ceramic component;a ceramic-polymer composite component; anda resin plastic injection molded component.3. The method of claim 1 , wherein the metal to metal joining techniques include compression fusion welding.4. The method of claim 3 , wherein the surfaces of the non-metallic component and the metallic surface of the second component are gold plated claim 3 , wherein the compression fusion welding is made by contacting the two gold plated surfaces and applying an energy source.5. The method of claim 4 , wherein the energy source is ultrasonic or megasonic in nature.6. The method of claim 4 , wherein the gold is held to the surface of the non-metallic component by another metal forming the metallized tie layer.7. The method of claim 1 , wherein forming a metallized tie layer includes at least one of:electroplating;electroless plating;vacuum deposition;sputtering of a metal including one or more of Ti, Cr, Ta, Ru, NiChrome and NiV; andvapor deposition.8. The method of further comprising modifying the surface of the non-metallic component by at least one of:an ion source containing oxygen, or argon or both prior to forming the metallized tie layer on the surface of ...

ELECTRICAL STEEL SHEET FOR STACKING, STACKED ELECTRICAL STEEL SHEET, METHOD OF MANUFACTURING STACKED ELECTRICAL STEEL SHEET, AND IRON CORE FOR AUTOMOTIVE MOTOR

A stacked electrical steel sheet used for a stacked iron core of an automotive motor and the like required to have high-temperature bond property and high-temperature oil resistance is provided. An electrical steel sheet for stacking includes: an electrical steel sheet; and a bond-type insulating coating formed on at least one surface of the electrical steel sheet and having Martens hardness HM of 50 or more and less than 500. 1. An electrical steel sheet for stacking , comprising:an electrical steel sheet; anda bond-type insulating coating formed on at least one surface of the electrical steel sheet and having Martens hardness HM of 50 or more and less than 500.2. The electrical steel sheet for stacking according to claim 1 ,wherein the bond-type insulating coating has a logarithmic decrement peak temperature of 50° C. or more and 200° C. or less measured by a rigid body pendulum test.3. The electrical steel sheet for stacking according to claim 1 ,wherein the bond-type insulating coating contains at least one phenolic resin selected from novolac type, resol type, modified type, and a mixture thereof.4. A stacked electrical steel sheet claim 1 , comprising{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'a plurality of the electrical steel sheet for stacking according to stacked through the bond-type insulating coating.'}5. A method of manufacturing a stacked electrical steel sheet claim 1 , comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'stacking a plurality of the electrical steel sheet for stacking according to ; and'}simultaneously heating and pressing the stacked plurality of the electrical steel sheet for stacking.6. An iron core for an automotive motor claim 1 , comprising{'claim-ref': {'@idref': 'CLM-00004', 'claim 4'}, 'a plurality of the stacked electrical steel sheet according to stacked through the bond-type insulating coating.'} The disclosure relates to an electrical steel sheet for stacking suitable as a material of a stacked iron core ...

GOLF CLUB FACE PLATES WITH INTERNAL CELL LATTICES AND RELATED METHODS

Embodiments of golf club face plates with internal cell lattices are presented herein. Other examples and related methods are also disclosed herein. 1. A golf club head comprising: an inner skin;', 'an outer skin;', a plurality of axes extending centrally through the walls between the inner skin and the outer skin, wherein the walls extend from the axes at an angle less than or equal to approximately 45 degrees, wherein the walls intersect adjacent walls at a single, first point neat the inner skin and at a single, second point near the outer skin;', 'a wall thickness that varies relative to position from the inner skin and the outer skin;', 'a plurality of cells defined by the plurality of walls, the plurality of cells positioned between the inner skin and the outer skin and having a cell width that varies relative to position from the inner skin and the outer skin; and', 'a plurality of apertures for removal of excess material in the cell lattice, the plurality of apertures including at least a first aperture positioned near a center of the cell lattice and a remaining apertures positioned around the perimeter of the cell lattice., 'a cell lattice with a plurality of walls having], 'a face plate having2. The golf club head of claim 1 , wherein the wall thickness is greater near the inner skin and the outer skin than near a central region of the cell lattice and wherein the plurality of apertures are filled with a material similar to a material of the face plate.3. The golf club head of claim 1 , wherein the minimum wall thickness ranges from 0.005 inches to 0.2 inches.4. The golf club head of claim 2 , wherein the maximum cell width ranges from 0.005 inches to 0.2 inches.5. The golf club head of claim 1 , wherein the thickness of the walls varies defining a plurality of hourglass shapes.6. The golf club head of claim 1 , wherein a center-to-center distance between adjacent axes ranges from 0.005 inches to 0.2 inches.7. The golf club head of claim 1 , wherein the ...

GOLF CLUB FACE PLATES WITH INTERNAL CELL LATTICES

Embodiments of golf club face plates with internal cell lattices are presented herein. Other examples and related methods are also disclosed herein. 120-. (canceled)21. A golf club head comprising: an inner skin;', 'an outer skin;', 'a first region; and', 'a second region;, 'a faceplate having the first region comprises one or more cell lattices, wherein a cell lattice comprises a plurality of walls defining a plurality of cells bounded between the inner skin and the outer skin; and', 'the second region comprises one or more cell lattices., 'wherein22. The golf club head of claim 21 , wherein: a midsection between the inner skin and outer skin;', 'an inner midsection end of the midsection is coupled to the inner skin of the face plate; and', 'an outer midsection end of the midsection is coupled to the outer skin of the face plate., 'the faceplate further comprises23. The golf club head of claim 21 , wherein:the first region is located near a center region of the face plate; andthe second region surrounds the first region.24. The golf club head of claim 21 , wherein:the first region has a first stiffness;the second region has a second stiffness; andthe first stiffness is greater than the second stiffness.25. The golf club head of claim 21 , wherein:the one or more plurality of cells comprise at least one of a hexagon shape, a circular shape, a rhombus shape, a straight triangle shape, or a Reuleaux triangle shape.26. The golf club head of claim 21 , wherein:the plurality of cells of the first region comprise a first geometric shape;the plurality of cells of the second region comprise a second geometric shape; andthe first geometric shape is different than the second geometric shape.27. The golf club head of claim 23 , wherein:the one or more cell lattices of the second region comprises the plurality of cells in a pattern where a density of the plurality of cells decreases towards the first region.28. The golf club head of claim 23 , wherein:the one or more cell ...

COOKWARE WITH COPPER BONDED LAYER

Provided is an article of cookware and a method of making the same. The cookware has at least one stainless steel layer and at least one copper layer metallurgically bonded directly to the at least one stainless steel layer via solid state bonding. The at least one stainless steel layer may be a ferritic stainless steel layer, and the at least one copper layer may be a grain stabilized copper. The at least one stainless steel layer may be made from a 400 series stainless steel, such as a 436 stainless steel alloy, a 439 stainless steel alloy, or a 444 stainless steel alloy. The at least one copper layer may be made from a high purity, oxygen free copper alloy, such as a C101 copper alloy, a C102 copper alloy, or a C107 copper alloy. 131-. (canceled)32. A method of making multi-layer , bonded cookware , the method comprising:providing at least one stainless steel layer and at least one copper layer in a stacked blank assembly; andapplying heat and pressure to the stacked blank assembly for a predetermined period of time such that at least one stainless steel layer is metallurgically bonded to the at least one copper layer via solid state bonding to form a bonded blank assembly,wherein the at least one stainless steel layer is a ferritic stainless steel layer, andwherein the at least one copper layer is a copper alloy having controlled grain growth properties.33. The method of claim 32 , wherein heat is applied at a temperature below a grain growth temperature of the at least one copper layer.34. The method of claim 33 , wherein heat is applied at a temperature between about 1150° F. (625° C.) to about 1250° F. (675° C.).35. The method of claim 32 , wherein pressure is applied at about 5 claim 32 ,000 psi (350 kg/cm) to about 20 claim 32 ,000 psi (1 claim 32 ,400 kg/cm).36. The method of claim 32 , wherein pressure is applied in a direction normal to a plane of the at least one stainless steel plate and the at least one copper plate.37. The method of claim 32 , ...

FAN OUTLET GUIDE VANE MANUFACTURE

A method of forming an article for finish fabrication into a fan outlet guide vane of a turbofan engine is provided. The method includes steps of: providing first and second sides of a metallic workpiece, each side having a relatively thin central region and a relatively thick peripheral region, and each side being formed from a plurality of separate pieces which are assembled in position relative to each other to provide the respective side, the pieces of each side including a plate which at least partially forms the central region, and one or more thicker blocks which at least partially form the peripheral region; stacking the first and second sides so that a contact interface is formed between the sides; diffusion bonding the first and second sides together across the interface over regions of the interface other than a preselected region thereof corresponding with the thin central regions of the first and second sides; and hot creep forming the bonded first and second sides and inflating the workpiece at the preselected region to produce the article such that the first and second sides form opposite aerofoil surfaces of the fan outlet guide vane. 1. A method of forming an article for finish fabrication into a fan outlet guide vane of a turbofan engine , the method including steps of:providing first and second sides of a metallic workpiece, each side having a central region and a peripheral region, a thickness of the central region being smaller than a thickness of the peripheral region, and each side being formed from a plurality of separate pieces which are assembled in position relative to each other to provide the respective side, the pieces of each side including a plate which at least partially forms the central region, and one or more thicker blocks which at least partially form the peripheral region;stacking the first and second sides so that a contact interface is formed between the sides;diffusion bonding the first and second sides together across the ...

Battery Interconnect System

A system and a corresponding method are provided for interconnecting the batteries in a battery pack in a manner that is designed to simplify the connection process, thereby improving throughput. The system uses two different types of interconnects; wire and ribbon interconnects. The wire interconnects are attached to each battery's large contact area terminal nub while the ribbon interconnects are attached to the crimped edge region of each battery's case. 1. A method of electrically interconnecting a plurality of batteries contained within a battery pack , said method comprising:coupling a first terminal of each battery of said plurality of batteries to a first bus bar using a plurality of wire interconnects, wherein each wire interconnect of said plurality of wire interconnects has a substantially circular cross-section; andcoupling a second terminal of each battery of said plurality of batteries to a second bus bar using a plurality of ribbon interconnects, wherein each ribbon interconnect of said plurality of ribbon interconnects has a substantially rectangular cross-section.2. The method of claim 1 , said step of coupling said first terminal of each battery of said plurality of batteries to said first bus bar further comprises coupling a large contact area terminal nub corresponding to said first terminal of each battery of said plurality of batteries to said first bus bar using said plurality of wire interconnects claim 1 , wherein said large contact area terminal nub is integrated into a central region of a battery cap assembly.3. The method of claim 2 , further comprising the step of attaching each wire interconnect of said plurality of wire interconnects to said large contact area terminal nub and to said first bus bar using a technique selected from the group consisting of laser welding claim 2 , e-beam welding claim 2 , resistance welding claim 2 , ultrasonic bonding claim 2 , thermocompression bonding and thermosonic bonding.4. The method of claim 1 , ...

Method of Making a Plurality of Bonded Blank Assemblies

A method of making cookware containing a bonded composite comprising the steps of providing at least two layers of materials by pressurizing and heating wherein the first of the at least two layers of materials has a plurality of spaced-apart bubbles formed on its surface, defining a cooking surface of the cookware, and a second layer of two layers of material is bonded thereto, wherein the bonding between the bubbles and the second material is of a lesser degree than the bonding between the first and second layers of materials in areas intermediate the bubbles, whereby a coefficient of heat conductivity is greater in the intermediate areas than in the bubbles. The method also includes providing a plurality of sets of bonding blank assemblies by solid state processing under pressure and heat. 1. A method of making a plurality of bonded composite blank assemblies for the manufacture of cookware , comprising the steps of:(a) providing at least two blank assemblies for bonding, wherein each blank assembly comprises three discs of planar materials which are of stainless steel, aluminum and stainless steel, and a perforated template having a plurality of holes formed therein, said perforated template positioned on an outer surface of a stainless steel disc of each blank assembly;(b) placing the at least two blank assemblies into a pressing fixture wherein each of the assemblies has a separation disc placed between adjacent assemblies to prevent bonding between adjacent assemblies;(c) exerting an axial force on the assemblies by way of the pressing fixture;(d) heating the assemblies while under pressure at a sufficient temperature and time to achieve a desired level of bonding between each of the discs in each of the blank assemblies;(e) forming a plurality of spaced-apart bubbles along a surface of one of the stainless steel discs of each blank assembly during steps (c) and (d), wherein the bonding between the bubbles and the second disc is of a lesser degree than the ...

METHOD OF BONDING METAL MEMBERS AND METAL MEMBER JOINT BODY

A method of bonding metal members includes a stacked body forming step of forming a stacked body by putting an insert material between a first metal member and a second metal member formed of carbide-containing Ni alloys or carbide-containing Fe alloys, and a solid phase diffusion bonding step of forming a metal member joint body by heating and pressurizing the stacked body to perform solid phase diffusion bonding, wherein the insert material contains Ni having a content higher than an Ni content of the first metal member and the second metal member when the first metal member and the second metal member are formed of the carbide-containing Ni alloys, and contains Fe or Ni having a content higher than an Fe content of the first metal member and the second metal member when the first metal member and the second metal member are formed of the carbide-containing Fe alloys. 1. A method of bonding metal members comprising:a stacked body forming step of forming a stacked body by putting an insert material between a first metal member and a second metal member formed of carbide-containing Ni alloys or carbide-containing Fe alloys; anda solid phase diffusion bonding step of forming a metal member joint body by heating and pressurizing the stacked body to perform solid phase diffusion bonding, whereinthe insert material contains Ni having a content higher than an Ni content of the first metal member and the second metal member when the first metal member and the second metal member are formed of the carbide-containing Ni alloys, and contains Fe or Ni having a content higher than an Fe content of the first metal member and the second metal member when the first metal member and the second metal member are formed of the carbide-containing Fe alloys.2. The method of bonding metal members according to claim 1 , whereinthe first metal member and the second metal member are formed of the carbide-containing Ni alloys, andthe insert material contains Ni having a content higher than ...

DIFFUSION BONDED FASTENER ASSEMBLY

A fastener assembly includes a bolt having a shaft and a head. The shaft has proximal and distal shaft ends and a shaft body, with the head at the proximal shaft end. At least a bondable portion of the shaft body is at least partially made of a bondable material. At least one collar has proximal and distal collar ends longitudinally separated by a collar body which includes a longitudinally oriented collar aperture extending through a thickness thereof between proximal and distal collar surfaces. The collar aperture defines an inner collar wall having a bondable portion which is at least partially made of a bondable material. At least the bondable portion of the shaft body is located inside the collar aperture. The bondable material of both of the inner collar wall and the shaft body is activated to bond the shaft and the collar into an integral fastener assembly structure. 1. A method of installing a fastener assembly on a substrate having a longitudinally oriented substrate aperture extending through a thickness thereof between proximal and distal substrate surfaces , the method comprising:providing a bolt having a shaft and a head, the shaft having proximal and distal shaft ends longitudinally separated by a shaft body, the head being located at the proximal shaft end, and at least a bondable portion of the shaft body spaced from the proximal shaft end being at least partially made of a bondable material; 'applying a longitudinally tensile force to the shaft to reduce a lateral cross-sectional area of the shaft and thereby facilitate the insertion of at least a portion of the shaft through the substrate aperture;', 'inserting the distal shaft end of the bolt longitudinally into the substrate aperture from the proximal substrate surface, including'}extending the distal shaft end of the bolt from the distal substrate surface with at least a portion of the bondable portion of the shaft body being located distal to the distal substrate surface;providing at least one ...

PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF THEIR FABRICATION

An embodiment of a method of attaching a semiconductor die to a substrate includes placing a bottom surface of the die over a top surface of the substrate with an intervening die attach material. The method further includes contacting a top surface of the semiconductor die and the top surface of the substrate with a conformal structure that includes a non-solid, pressure transmissive material, and applying a pressure to the conformal structure. The pressure is transmitted by the non-solid, pressure transmissive material to the top surface of the semiconductor die. The method further includes, while applying the pressure, exposing the assembly to a temperature that is sufficient to cause the die attach material to sinter. Before placing the die over the substrate, conductive mechanical lock features may be formed on the top surface of the substrate, and/or on the bottom surface of the semiconductor die. 1. A method of attaching a semiconductor die to a substrate , the method comprising:placing a bottom surface of a semiconductor die over a top surface of a substrate with a die attach material between the bottom surface of the semiconductor die and the top surface of the substrate, resulting in an assembly that includes the substrate, the die attach material, and the semiconductor die;contacting a top surface of the semiconductor die and the top surface of the substrate with a conformal structure that includes a non-solid, pressure transmissive material;applying a pressure to the conformal structure, wherein the pressure is transmitted by the non-solid, pressure transmissive material to the top surface of the semiconductor die; andwhile applying the pressure, exposing the assembly to a temperature that is sufficient to cause the die attach material to sinter.2. The method of claim 1 , wherein the conformal structure includes a conformal solid and the non-solid claim 1 , pressure transmissive material claim 1 , wherein during the contacting step claim 1 , the conformal ...

APPARATUS FOR THE MATERIAL-BONDED CONNECTION OF CONNECTION PARTNERS OF A POWER-ELECTRONICS COMPONENT

A pressing ram having an elastic cushion element and intended for the material-bonded press-sintering connection of a first connection partner to a second connection partner of a power-electronics component. The elastic cushion element of the pressing ram is enclosed by a dimensionally stable frame, within which the cushion element and a guide part of the pressing ram are guided for linear movement such that the dimensionally stable frame lowers onto the first connection partner, or a workpiece carrier with the first connection partner arranged therein, and, following abutment against the same, the pressing ram together with the elastic cushion element is lowered onto the second connection partner and the elastic cushion exerts a pressure necessary for connecting the first connection partner to the second connection partner. 1. Apparatus for the material-bonded connection of connection partners of a power-electronics component , the apparatus comprising:a pressing ram having an elastic cushion element, for the material-bonded press-sintering connection of a first connection partner to a second connection partner of the power-electronics component, said pressing ram also having a guide part; anda dimensionally stable frame which encloses said elastic cushion element;wherein said elastic cushion element and said guide part of said pressing ram are guided for linear movement within said frame such that said frame lowers onto said first connection partner, and, following abutment against the same, said pressing ram together with said elastic cushion element is lowered onto said second connection partner;whereby said elastic cushion element exerts the pressure necessary for connecting said first connection partner to said second connection partner.2. The apparatus of claim 1 , further comprising:a suspension arrangement positioned between said pressing ram and said frame.3. The apparatus of claim 1 , wherein said pressing ram further includes a lowering device which acts ...

METHODS FOR BONDING SUBSTRATES

Methods for bonding substrates used, for example, in substrate-level packaging, are provided herein. In some embodiments, a method for bonding substrates includes: performing electrochemical deposition (ECD) to deposit at least one material on each of a first substrate and a second substrate, performing chemical mechanical polishing (CMP) on the first substrate and the second substrate to form a bonding interface on each of the first substrate and the second substrate, positioning the first substrate on the second substrate so that the bonding interface on the first substrate aligns with the bonding interface on the second substrate, and bonding the first substrate to the second substrate using the bonding interface on the first substrate and the bonding interface on the second substrate. 1. A method for bonding substrates , comprising:performing electrochemical deposition (ECD) to deposit at least one material on each of a first substrate and a second substrate;performing chemical mechanical polishing (CMP) on the first substrate and the second substrate to form a bonding interface on each of the first substrate and the second substrate;positioning the first substrate on the second substrate so that the bonding interface on the first substrate aligns with the bonding interface on the second substrate; andbonding the first substrate to the second substrate using the bonding interface on the first substrate and the bonding interface on the second substrate.2. The method of claim 1 , wherein the at least one material is at least one of Sn claim 1 , Ag claim 1 , Pb claim 1 , In claim 1 , Bi claim 1 , or Au.3. The method of claim 2 , wherein at least one of the first substrate and the second substrate comprises at least one of Cu or Al claim 2 , and at least one of Si claim 2 , oxide claim 2 , or a polymer claim 2 , andwherein the at least one material is deposited on the at least one of Cu or Al.4. The method of claim 1 , wherein the at least one material is deposited ...

METHOD FOR SEALING TWO ELEMENTS BY LOW TEMPERATURE THERMOCOMPRESSION

A sealing method between two elements includes producing a first sealing material on a face of a first of the two elements, producing a second sealing material, different from the first sealing material, on one face of a second of the two elements, securing the two elements by thermocompression of the sealing materials against each other at a temperature Tc below the melting temperatures of the first and second sealing materials, the first and second sealing materials are chosen such that they each have at least one phase able to react with the phase of the other sealing material by interdiffusion of the components of the phases of the sealing materials during the securing step and forming at least one other solid phase having a melting temperature above the temperature Tc. 112.-. (canceled)13. A sealing method between at least two elements , comprising:producing at least one first sealing material on at least one face of a first element of said two elements;producing at least one second sealing material, different from the first sealing material, on at least one face of a second element of said two elements;securing said two elements together by thermocompression of the sealing materials against each other at a temperature Tc below melting temperatures of the first and second sealing materials,wherein the first sealing material has a phase that reacts with a phase of the second sealing material by interdiffusion of components of the respective phases of the first and second sealing materials during the securing step, andwherein the respective phases of the first and second sealing materials react together and form at least one solid phase having a melting temperature that is higher than the temperature Tc, andwherein the first or second sealing material is an eutectic alloy obtained at least by implementing several successive depositions of materials intended to form the eutectic alloy, and at least one thermal treatment of said materials intended to form the ...

WELDING LIGHT METAL WORKPIECES BY REACTION METALLURGY

Aluminum alloy workpieces and/or magnesium alloy workpieces are joined in a solid state weld by use of a reactive material placed, in a suitable form, at the joining surfaces. Joining surfaces of the workpieces are pressed against the interposed reactive material and heated. The reactive material alloys or reacts with the workpiece surfaces consuming some of the surface material in forming a reaction product comprising a low melting liquid that removes oxide films and other surface impediments to a welded bond across the interface. Further pressure is applied to expel the reaction product and to join the workpiece surfaces in a solid state weld bond. 1. A method of forming a solid-state weld between a first joining surface of a light metal alloy workpiece comprising an aluminum or a magnesium alloy and a second joining surface of a coated steel workpiece where the joining surface of the steel workpiece is coated with a protective layer comprising zinc , the method comprising:placing a predetermined quantity of reactive material, compatible with zinc, between the joining surfaces, the zinc of the protective layer coating and the reactive material cooperating to react with at least the light metal alloy joining surface to form a reaction product upon being heated to a temperature below the solidus temperature of the light metal alloy, the reaction product comprising a liquid, the liquid comprising the reactive material, zinc and the light metal alloy; the following steps being conducted at ambient conditions,assembling the workpieces with their respective joining surfaces face-to-face separated by the reactive material and thereby applying a first interfacial pressure to the joining surfaces;applying a second interfacial pressure, greater than the first interfacial pressure, to the assembly so that the facing surfaces engage, and then, while maintaining the second interfacial pressure, heating the reactive material for a predetermined time to form the reaction product ...

DIAPHRAGM, PRESSURE SENSOR USING DIAPHRAGM, AND DIAPHRAGM PRODUCING METHOD

Provided herein is a diaphragm that is highly durable, and that does not involve the risk of gas leakage, and a pressure sensor using such a diaphragm. The diaphragm is a metallic diaphragm that includes a plate-shaped pressure receiver, and a frame-like support member. The pressure receiver has a metal structure grown parallel to a flat plate surface of the plate-shaped pressure receiver. 1. A metallic diaphragm comprising a plate-shaped pressure receiver , and a frame-like support member ,wherein the pressure receiver has a metal structure grown parallel to a flat plate surface of the plate-shaped pressure receiver.2. The diaphragm according to claim 1 , wherein the pressure receiver is bonded to an end surface of the support member.3. The diaphragm according to claim 1 , wherein the pressure receiver and the support member are integrally formed.4. The diaphragm according to claim 1 , wherein the pressure receiver comprises a Co—Ni-base alloy of a composition range containing claim 1 , in mass % claim 1 , Co: 28 to 42% claim 1 , Ni: 15 to 40% claim 1 , Cr: 10 to 27% claim 1 , Mo: 3 to 12% claim 1 , Ti: 0.1 to 1% claim 1 , Mn: 1.5% or less claim 1 , Fe: 0.1 to 26% claim 1 , C: 0.1% or less claim 1 , Nb: 3% or less claim 1 , W: 5% or less claim 1 , Al: 0.5% or less claim 1 , and the balance unavoidable impurities.5. The diaphragm according to claim 1 , wherein the pressure receiver comprises a duplex stainless steel of a composition range containing claim 1 , in mass % claim 1 , Cr: 24 to 26% claim 1 , Mo: 2.5 to 3.5% claim 1 , Ni: 5.5 to 7.5% claim 1 , C: 0.03% or less claim 1 , N: 0.08 to 0.3% claim 1 , and the balance Fe and unavoidable impurities.6. A pressure sensor using the diaphragm according to .7. A method for producing a metallic diaphragm that includes a plate-shaped pressure receiver claim 1 , and a frame-like support member claim 1 ,the method comprising:flattening a raw material alloy ingot, and punching the worked plate with a forming press to ...

ADAPTIVE TCB BY DATA FEED FORWARD

A method and machine-readable medium including non-transitory program instructions that when executed by a processor cause the processor to perform a method including measuring at least one parameter of a substrate or a die; and establishing or modifying a thermal compression bonding recipe based on the at least one parameter, wherein the thermal compression bonding recipe is operable for thermal compression bonding of the die and the substrate. A thermal compression bonding tool including a pedestal operable to hold a substrate during a thermal compression bonding process and a bond head operable to engage a die, the tool including a controller machine readable instructions to process a substrate and a die combination, the instructions including an algorithm to implement or modify a thermal compression bonding process based on a parameter of a substrate or die. 1. A method comprising:measuring at least one parameter of a substrate or a die; andestablishing or modifying a thermal compression bonding recipe based on the at least one parameter, wherein the thermal compression bonding recipe is operable for thermal compression bonding of the die and the substrate.2. The method of claim 1 , wherein the parameter of the substrate is a substrate thickness variation claim 1 , planarity or bump height of solder bumps on the substrate.3. The method of claim 1 , wherein the parameter of the die comprises an xy-planarity of the die.4. The method of claim 1 , further comprising measuring at least one parameter of the other of the substrate or the die and establishing or modifying a thermal compression bonding recipe based on the at least one parameter of each of the die and the substrate.5. The method of claim 1 , wherein after establishing or modifying a thermal compression bonding recipe claim 1 , thermal compression bonding the die to the substrate based on the recipe.6. The method of claim 1 , wherein the one parameter comprises an xy planarity of the substrate and ...

Hot clamping method and clamping cooling apparatus

A hot clamping method includes: blanking to cut a material; cold-working to cool down the cut material to produce a product having a shape of a completed product; heating the cooled product in a heating furnace; and clamping cooling to set the heated product in a clamp to clamp it so that it is in contact with the clamp to be cooled down.

Cooking Utensil Having A Graphite Core

Provided is an article of cookware and a method of making the same. The cookware has a multi-layer bonded composite wall structure having an inner metal layer and an outer metal layer, and a core layer between the inner layer and the outer layer. The core layer has at least two perforated graphite plates, each plate having a plurality of spaced-apart holes formed therethrough, and at least one intermediate metal element disposed between the at least two perforated graphite plates and extending through the plurality of spaced-apart holes of each of the at least two perforated graphite plates. The at least one intermediate metal element is metallurgically bonded to the inner layer and the outer layer at least through the plurality of spaced-apart holes. 1. Cookware having a multi-layer bonded composite wall structure , the cookware comprising:an inner metal layer and an outer metal layer; anda core layer between the inner layer and the outer layer, the core layer comprising at least two perforated graphite plates, each plate having a plurality of spaced-apart holes formed therethrough, and at least one intermediate metal element disposed between the at least two perforated graphite plates and extending through the plurality of spaced-apart holes of each of the at least two perforated graphite plates,wherein the at least one intermediate metal element is metallurgically bonded to the inner layer and the outer layer at least through the plurality of spaced-apart holes.2. The cookware of claim 1 , wherein the at least one intermediate metal element is an aluminum plate having a diameter equal to or larger than a diameter of the at least two perforated graphite plates.3. The cookware of claim 1 , wherein the at least one intermediate metal element has a thickness of 0.032 in.4. The cookware of claim 1 , wherein at least one of the perforated graphite plates has a thickness between 0.0010 in. and 0.0050 in.5. The cookware of claim 1 , wherein the inner layer is stainless ...

Method of hardening articles and articles comprising the same

Disclosed herein is a method comprising disposing on a base article a nickel-titanium alloy; where the nickel is in an amount of about 58 to about 62 weight percent and titanium in an amount of about 38 to about 42 wt %, based on the total weight of the nickel-titanium alloy; and applying a pressure of 12 to 20 kilopounds per square inch at a temperature of 1400 to 2100° F. for a period of 1 to 8 hours to form a nickel-titanium alloy coating on the base article. Disclosed is an article comprising a base article; and a nickel-titanium alloy; where the nickel-titanium alloy is disposed on the base article; where the nickel is in an amount of about 58 to about 62 weight percent and titanium in an amount of about 38 to about 42 wt %, based on the total weight of the nickel-titanium alloy.

Thermal compression bonding process cooling manifold

Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.

GALVANIC PELLICLE REMOVABLE ATTACHMENT TOOL

A tool () includes a base () made of contact and projection woven, metallic, compression screens () secured to each other. A plurality of linear projections () extend away from the base (). A shortest distance between adjacent linear projections () may be between about 20 μm and about 20 mm. The tool () is forced upon an uncompressed galvanic pellicle () so that the projections () compress and bond connected areas () of the pellicle () to a conductive surface () to form an electrode (). 1. A removable attachment tool for attaching a galvanic pellicle to an electrically conductive surface , the removable attachment tool comprising:a base having a contact surface and an opposed projection surface, wherein the base includes at least first and second woven, planar, rigid, metallic compression screens, the first and second compression screens secured to each other so that windows defined by the metallic compression screens are aligned to overlie each other, wherein extending connection surfaces of the at least first metallic compression screen are secured to extending connection surfaces of the at least second metallic compression screen to form cross-over intersections; and,a plurality of linear projections extending from the cross-over intersections in a direction perpendicular to and away from the projection surface of the base, and wherein no projection contacts another projection.2. The removable attachment tool of claim 1 , wherein all of the projections extend a same predetermined distance away from the projection surface of the base.3. The removable attachment tool of claim 1 , wherein all of the projections extend away from the projection surface of the base so that all of the projections are equidistant from each other.4. The removable attachment tool of wherein each linear projection includes an attachment end farthest from the base claim 1 , and wherein each attachment end includes one of a brazing filler material and a soldering filler material.5. The ...

Method of manufacturing a metal matrix reinforced composite component and a composite component formed by the method

Method of manufacturing a metal matrix composite component includes the steps of providing a first tubular member having a first end and an opposite second end, the first tubular member's first end being formed as a first end block; positioning a metal matrix composite tubular member concentrically the first tubular member; positioning a second tubular member concentrically over metal matrix composite tubular member, second tubular member having a first end and an opposite second end, the second tubular member's second end being formed as a second end block; welding first tubular member's first end to the second tubular member's first end, and the first tubular member's second end to second tubular member's second end, to join the first and second tubular member and thereby to form a metal matrix composite preform; and consolidating metal matrix composite preform by a hot isostatic pressing process to form the metal matrix composite component.

SUPERPLASTIC FORMING AND DIFFUSION BONDING PROCESS

A process and apparatus for forming a structure comprising: a) forming a pack from a skin sheet and a core sheet, b) placing the pack in a mould and heating the pack; c) injecting a first gas between the core and skin sheets to urge the skin sheet against the mould; d) injecting a second gas on the side of the core sheet remote from the skin sheet to urge the core sheet against the skin sheet; e) maintaining gas pressure of the second gas thereby diffusion bonding the sheets; and f) injecting a third gas between the skin sheet and the mould, to force the skin sheet against the core sheet. 1. A process of forming a structure by diffusion bonding and superplastic forming at least one skin sheet and at least one core sheet , the process comprising:a) forming a pack from the at least one skin sheet and the at least one core sheet;b) placing the pack in a mould and heating the pack to a temperature at which the sheets are capable of superplastic deformation;c) injecting a first gas between the core sheet and the skin sheet to urge the skin sheet against an internal face of the mould thereby forming a cavity between the core sheet and the skin sheet;d) injecting a second gas on the side of the core sheet remote from the skin sheet to urge the core sheet against the skin sheet;e) maintaining gas pressure of the second gas on the side of the core sheet remote from the skin sheet, thereby forming a diffusion bond between the skin sheet and the core sheet; andf) injecting a third gas on the side of the skin sheet remote from the core sheet, between the skin sheet and the mould, to force the skin sheet against the core sheet.2. The process according to claim 1 , wherein at least part of step f) is performed during at least part of step e).3. The process according to claim 1 , wherein a gas pressure of the third gas is less than or equal to a gas pressure of the second gas.4. The process according to claim 1 , wherein the third gas is injected in step f) between the skin sheet ...

KINETICALLY LIMITED NANO-SCALE DIFFUSION BOND STRUCTURES AND METHODS

Bulk materials having a kinetically limited nano-scale diffusion bond is provided. The bulk materials having a kinetically limited nano-scale diffusion bond includes transparent material, absorbent opaque material and a diffusion bond. The transparent material has properties that allow an electromagnetic beam of a select wavelength to pass there through without more than minimal energy absorption. The absorbent opaque material has properties that significantly absorb energy from the electromagnetic beam. The diffusion bond is formed by the electromagnetic beam bonding the transparent material to the absorbent opaque material. Moreover, the diffusion bond has a thickness that is less than 1000 nm. 1. Bulk materials having a kinetically limited nano-scale diffusion bond comprising:transparent material having properties that allow an electromagnetic beam of a select wavelength to pass there through without more than minimal energy absorption;absorbent opaque material having properties that significantly absorb energy from the electromagnetic beam; anda diffusion bond formed by the electromagnetic beam bonding the transparent material to the absorbent opaque material, the diffusion bond having a thickness less than 1000 nm.2. The bulk materials having a kinetically limited nano-scale diffusion bond of claim 1 , further comprises:the diffusion bond including an interfacial bond joint region that is less than 200 nm and an amorphous diffusion zone that is less than 60 nm thick and within the interfacial bond joint region; andundisturbed transparent material and undisturbed absorbent opaque material outside the interfacial bond joint, the undisturbed transparent material and undisturbed absorbent opaque material not being affected by the formation of the bond.3. The bulk materials having a kinetically limited nano-scale diffusion bond of claim 1 , further comprising:the diffusion bond including an interfacial bond joint region that is less than 1000 nm; andundisturbed ...

Method of manufacturing a brazing sheet

In a brazing sheet manufacturing method, a cladding slab is prepared by overlaying at least a core-material slab composed of an aluminum material and a filler-material slab composed of an Al—Si series alloy, in which a metal element that oxidizes more readily than Al is included in at least one of the slabs. A clad sheet is prepared by hot rolling this cladding slab, which then has at least a core material layer composed of the core-material slab and a filler material layer composed of the filler-material slab and disposed on at least one side of the core material. Then, a surface of the clad sheet is etched using a liquid etchant that contains an acid. Subsequently, the clad sheet is cold rolled to a desired thickness. In flux-free brazing, such a brazing sheet is capable of curtailing degradation in brazeability caused by fluctuations in dew point and oxygen concentration.

STEEL MATERIAL COMPOSITE, METHOD FOR PRODUCING A COMPONENT, AND USE

The present invention relates to a steel material composite having at least two layers (), comprising at least one first layer () of a material-removable and/or shearable steel and at least one second layer () of a formable steel, cohesively bonded to the first layer (). 1. A steel material composite having at least two layers , comprising:at least one first layer of at least one of a material-removable and shearable steel; andat least one second layer of a formable steel, cohesively bonded to the at least one first layer.3. The steel material composite as claimed in wherein the at least one second layer consists of a steel having an elongation at break A>10.4. The steel material composite as claimed in wherein the first layer has a material thickness between 5% and 70% claim 3 , based on a total material thickness of the steel material composite.5. The steel material composite as claimed in wherein the steel material composite has been produced by means of cladding claim 4 , especially by means of hot roll cladding.6. A method for producing a component claim 4 , wherein a steel material composite is formed to a preform claim 4 , the steel material composite having at least two layers including at least a first layer of at least one of a material-removable and shearable steel and at least one second layer of a formable steel claim 4 , cohesively bonded to the at least one first layer and the preform is mechanically processed at least in sections in the region of the first layer to create one of a final form and further form.7. The method as claimed in claim 6 , wherein the final form or further form is heat-treated.8. A component in a drivetrain of a motor vehicle comprising:at least one first layer of at least one of a material-removable and shearable steel; andat least one second layer of a formable steel, cohesively bonded to the at least one first layer.9. The steel material composite as claimed in where the first layer includes at least one of:Cr: up to 3.0%;Cu ...

FIRING PIN ASSEMBLY OF NAIL GUN AND BONDING METHOD THEREOF

A firing pin assembly of a nail gun and a bonding method thereof are provided. The firing pin assembly includes a firing pin body and a firing pin head made of a material having a hardness greater than that of the firing pin body. The firing pin head has a first end and a second end. The first end is made of a material having a density lower than that of the second end. The first end and the front end face of the firing pin body are preheated to a set temperature. The top of the second end is pressed toward the front end face of the firing pin body for an appropriate bonding time, so that the material particles of the firing pin body are dissociated and fused into the first end of the firing pin head to form the firing pin assembly. 1. A firing pin assembly of a nail gun , comprising a firing pin body and a firing pin head connected to a front end face of the firing pin body and made of a material having a hardness greater than that of firing pin body; the firing pin head having an outer diameter same as that of a front section of firing pin body , the firing pin head including a first end and a second end integral with the first end , the first end being made of a material having a density lower than that of the second end , the first end of the firing pin head being bonded to the front end face of the firing pin body.2. The firing pin assembly as claimed in claim 1 , wherein the front end face of the firing pin body is provided with a connecting post claim 1 , a bottom surface of the first end of the firing pin head is formed with an engaging recess corresponding to the connecting post of the front end face of the firing pin body claim 1 , and the connecting post is engaged in the engaging recess.3. The firing pin assembly as claimed in claim 1 , wherein the material of the firing pin body has a Rockwell hardness of 42-95 claim 1 , and the material of the firing pin head has a Rockwell hardness of 60-100.4. A bonding method of a firing pin assembly of a nail gun ...

METHOD FOR BONDING STAINLESS STEEL MEMBERS AND STAINLESS STEEL

A method for bonding stainless steel members includes: contacting a first stainless steel member with a second stainless steel member that has a strain exceeding 50% reduction; and heating the first and second stainless steel members to a re-crystallization initiation temperature or higher, after the contacting. 1. A stainless steel comprising:a first austenitic stainless steel member;a second austenitic stainless steel member having at least 30 volume % of martensite, whereinthe first and second austenitic stainless steel members are bonded together.2. The steel of claim 1 , wherein the first and second austenitic stainless steel members have re-crystallized grains.3. The steel of claim 2 , wherein the re-crystallized grains are disposed at bonding face between the first and second austenitic stainless steel members.4. The steel of claim 3 , wherein the re-crystallized grains cross bonding face between the first and second austenitic stainless steel members.5. The steel of claim 1 , wherein at least one of the first and second austenitic stainless steel members comprises at least 50 volume % of the martensite.6. The steel of claim 1 , wherein at least one of the first and second austenitic stainless steel members comprises at least 80 volume % of the martensite.7. The steel of claim 1 , wherein both of the first and second austenitic stainless steel members comprises at least 30 volume % of the martensite.8. The steel of claim 1 , wherein both of the first and second austenitic stainless steel members comprises at least 50 volume % of the martensite.9. The steel of claim 1 , wherein both of the first and second austenitic stainless steel members comprises at least 80 volume % of the martensite.10. The steel of claim 1 , wherein an interface between the first and second austenitic stainless steel members is an uneven interface comprising re-crystallized grains.11. The steel of claim 10 , wherein the re-crystallized grains at the interface are formed by heat treating ...

Method for bonding stainless steel members and stainless steel

A method for bonding stainless steel members includes: contacting a first stainless steel member with a second stainless steel member that has a strain exceeding 50% reduction; and heating the first and second stainless steel members to a re-crystallization initiation temperature or higher, after the contacting.

THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD

Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid. 1. (canceled)2. A method for thermal compression bonding , the method comprising:generating a heat high enough to melt solder of one of a first die or a first substrate;compressing the first die or the first substrate to one of a second die or a second substrate; andcooling the solder with a cooling manifold having a pre-mixing chamber that is separated from a mixing chamber by a baffle wherein the baffle comprises a plurality of concentric patterns through a thickness of the baffle such that a primary cooling fluid from the pre-mixing chamber is substantially evenly distributed into the mixing chamber.3. The method of further comprising forming the cooling manifold by three-dimensional printing.4. The method of further comprising coupling a plurality of cooling fluid inputs to the cooling manifold.5. The method of further comprising:coupling a plurality of cooling fluid outputs to a cooling block that is coupled to the mixing chamber of the cooling manifold;causing the primary cooling fluid to enter the cooling manifold through the pre-mixing chamber;causing the primary cooling fluid to enter the mixing chamber through the baffle; andcausing the primary cooling fluid to flow through a channel between the heater and the cooling block and exit the cooling block.6. The method of ...

Thermocompression bonding structure and thermocompression bonding method

A thermocompression bonding structure includes a first member and a second member having a linear expansion coefficient different from that of the first member; and metal fine particles interposed between the first and second members as a bonding material to thermocompression bond the two members. The two members are disposed to apply thermal stress generating between the first member and the second member as pressurizing force on a bonding surface between the two members, and to increase temperature to thermocompression bond the first member and the second member.

THERMOACOUSTIC ENERGY CONVERTING ELEMENT PART, THERMOACOUSTIC ENERGY CONVERTER, AND METHOD OF MANUFACTURING THERMOACOUSTIC ENERGY CONVERTING ELEMENT PART

The thermoacoustic energy converting element part includes a plurality of through holes extending along a uniform direction to penetrate a body of the thermoacoustic energy converting element part to form traveling paths of acoustic waves. The element part includes a wall surrounding each of the through holes to extend in an extending direction of the through hole and configured to exchange heat between the fluid. The through hole includes a through hole that has a hydraulic diameter of 0.4 mm or smaller, and an open area ratio of the through holes is 60% or higher. A first layer and a second layer are alternately provided on the wall of the thermoacoustic energy converting element part along the extending direction. A porosity of the first layer is 0% or smaller than a porosity of the second layer. The thermal conductivity of the structure of the thermoacoustic energy converting element part along the extending direction is 2 W/m/K or lower. If a metal plate is provided as the first layer, a plurality of the metal plates having a roughened main surface is layered and bonded by thermocompression bonding to manufacture the thermoacoustic energy converting element part. 1. A thermoacoustic energy converting element part configured to convert acoustic energy into thermal energy or thermal energy into acoustic energy between a fluid in which acoustic waves travel and a wall in contact with the fluid ,the thermoacoustic energy converting element part comprising a wall which surrounds each of through holes provided in a body of the element part, extending in a direction, and configured for acoustic waves travelling routes, the wall extending in an extending direction of the through holes and configured to exchange heat with a fluid in the through holes, whereinthe through holes include a through hole that has a hydraulic diameter of 0.4 mm or smaller,an open area ratio of the plurality of through holes in the thermoacoustic energy converting element part is 60% or higher, ...

CHIP SUPPORT SUBSTRATE, CHIP SUPPORT METHOD, THREE-DIMENSIONAL INTEGRATED CIRCUIT, ASSEMBLY DEVICE, AND FABRICATION METHOD OF THREE-DIMENSIONAL INTEGRATED CIRCUIT

The present invention relates to a chip support substrate including a lyophilic region that is formed on the substrate and that absorbs a chip A, and an electrode that is formed on the substrate and in the lyophilic region and that generates electrostatic force in the chip, and to a chip support method including the steps of arranging the chip onto the lyophilic region of the chip support substrate with a liquid , the chip support substrate comprising the lyophilic region that is formed on the substrate, and the electrode that is formed on the substrate and in the lyophilic region, and generating the electrostatic force in the chip corresponding to the electrode by applying a voltage to the electrode. 1. A chip support substrate comprising:a lyophilic region that is formed on the substrate and that absorbs a chip; andan electrode that is formed on the substrate and in the lyophilic region, that generates electrostatic force in the chip, and that comprise a cathode and an anode.2. The chip support substrate according to claim 1 ,wherein the lyophilic region includes a plurality of lyophilic regions that respectively absorb a plurality of the chips, andwherein the cathode and the anode are formed in each of the plurality of lyophilic regions.3. The chip support substrate according to claim 1 ,wherein the substrate is formed by a semiconductor, glass, ceramic, plastic or an interposer substrate.4. The chip support substrate according to claim 1 ,wherein the lyophilic region is formed by an insulation film.5. The chip support substrate according to claim 1 ,wherein a region where the lyophilic region is not arranged on the substrate comprises a region having a lyophilic property lower than that of the lyophilic region.6. (canceled)7. The chip support substrate according to claim 1 ,wherein the cathode includes a plurality of cathodes, the anode includes a plurality of anodes, andwherein, in the lyophilic region, the plurality of cathodes and the plurality of anodes are ...

ADVANCED DEVICE ASSEMBLY STRUCTURES AND METHODS

A microelectronic assembly includes a first substrate having a surface and a first conductive element and a second substrate having a surface and a second conductive element. The assembly further includes an electrically conductive alloy mass joined to the first and second conductive elements. First and second materials of the alloy mass each have a melting point lower than a melting point of the alloy. A concentration of the first material varies in concentration from a relatively higher amount at a location disposed toward the first conductive element to a relatively lower amount toward the second conductive element, and a concentration of the second material varies in concentration from a relatively higher amount at a location disposed toward the second conductive element to a relatively lower amount toward the first conductive element. 1. A method for making a microelectronic assembly , including:aligning a first bond component with a second bond component such that the first and second bond components are in contact with each other, the first bond component being included in a first element having a substrate defining a surface and a first conductive element at the surface, the first bond component including a first material layer adjacent the first conductive element and a first protective layer overlying the first material layer, the second bond component being included in a second element including a substrate defining a surface and a second conductive element exposed at the surface, the second bond component including a second material layer adjacent the second conductive element and a second protective layer overlying the first material layer; andheating the first and second bond components such that at least portions of the first and second material layers diffuse together to form an alloy mass joining the first and second elements with one another.2. The method of claim 1 , wherein the heating step is carried out at a first temperature claim 1 , and ...

METALLIZED COMPONENTS AND SURGICAL INSTRUMENTS

A surgical instrument and related methods are described. The surgical instrument includes a first jaw including a first structural jaw element and a first sealplate fixed to the first structural jaw element and a second jaw including a second structural jaw element and a second sealplate fixed to the second structural jaw element. The second structural jaw element is moveably coupled to the first structural jaw element to facilitate pinching tissue between the first and second sealplates. The first and second sealplates are configured to facilitate sealing tissue pinched therebetween. The first jaw further includes a metallized tie layer between the first sealplate and the first structural jaw element, wherein the first sealplate is fixed to the first structural jaw element via a metal to metal joint between the first sealplate and the metallized tie layer. 110-. (canceled)11. A method of manufacture comprising:forming a metallized tie layer on a surface of a nonmetallic component;positioning the surface of the nonmetallic component to mate with a metallic surface of a second component; andjoining the metallized tie layer with the mated metallic surface of the second component using metal to metal joining techniques.12. The method of claim 11 , wherein the nonmetallic component is one of a group consisting of:a polymeric component;a ceramic component;a ceramic-polymer composite component;a resin plastic injection molded component;an undoped silicon component;a glass component; andan alumina-filled epoxy component.13. The method of claim 11 , wherein the metal to metal joining techniques include compression fusion welding.14. The method of claim 13 , wherein the surfaces of the nonmetallic component and the metallic surface of the second component are gold plated claim 13 , wherein the compression fusion welding is made by contacting the two gold plated surfaces and applying an energy source.15. The method of claim 14 , wherein the energy source is ultrasonic or ...

HOLLOW AIRFOIL WITH CATENARY PROFILES

A method of forming a gas turbine engine according to an example of the present disclosure includes, among other things, attaching a first skin to a main body to enclose at least one internal channel, the first skin and the main body cooperating to define pressure and suction sides of an airfoil, holding the first skin and the main body between first and second dies, and pressurizing the at least one internal channel such that walls of the first skin and the main body move outwardly toward surface contours of the first and second dies. A gas turbine engine component is also disclosed. 1. A method of forming a gas turbine engine component comprising:attaching a first skin to a main body to enclose at least one internal channel, the first skin and the main body cooperating to define pressure and suction sides of an airfoil;holding the first skin and the main body between first and second dies; andpressurizing the at least one internal channel such that walls of the first skin and the main body move outwardly toward surface contours of the first and second dies.2. The method as recited in claim 1 , wherein the airfoil is a fan blade.3. The method as recited in claim 1 , wherein the at least one internal channel is a plurality of internal channels claim 1 , and further comprising forming the plurality of internal channels in the main body.4. The method as recited in claim 3 , wherein the walls of the first skin have a substantially constant thickness along the plurality of internal channels subsequent to the attaching step.5. The method as recited in claim 4 , further comprising removing material from the walls along exterior surfaces of the pressure and suction sides.6. The method as recited in claim 5 , wherein the first skin and main body comprise titanium.7. The method as recited in claim 6 , wherein internal surfaces along the walls bounding the plurality of internal channels have a catenary profile.8. The method as recited in claim 1 , wherein the attaching step ...

FIRING PIN ASSEMBLY OF NAIL GUN AND BONDING METHOD THEREOF

A firing pin assembly of a nail gun and a bonding method thereof are provided. The firing pin assembly includes a firing pin body and a firing pin head made of a material having a hardness greater than that of the firing pin body. The firing pin head has a first end and a second end. The first end is made of a material having a density lower than that of the second end. The first end and the front end face of the firing pin body are preheated to a set temperature. The top of the second end is pressed toward the front end face of the firing pin body for an appropriate bonding time, so that the material particles of the firing pin body are dissociated and fused into the first end of the firing pin head to form the firing pin assembly. 1. A bonding method of a firing pin assembly of a nail gun , the firing pin assembly comprising a firing pin body and a firing pin head connected to a front end face of the firing pin body and made of a material having a hardness greater than that of firing pin body; the firing pin head having an outer diameter same as that of a front section of firing pin body , the firing pin head including a first end and a second end integral with the first end , the first end being made of a material having a density lower than that of the second end , the first end of the firing pin head being bonded to the front end face of the firing pin body , the bonding method comprising:the firing pin head and the firing pin body being upright aligned with each other;a bottom surface of the first end of the firing pin head being spaced a predetermined distance apart from the front end face of the firing pin body;the firing pin head and the firing pin body being preheated to a set temperature so that particles having a lower melting point of the materials of the firing pin body and the firing pin head are close to be melted to generate high adhesiveness; anda top of the second end of the firing pin head being pressed toward the front end face of the firing pin ...

Electric-resistance-welded stainless clad steel pipe or tube

An electric-resistance-welded stainless clad steel pipe or tube that is excellent in both the fracture property of the weld and the corrosion resistance of the pipe or tube inner surface as electric resistance welded without additional welding treatment such as weld overlaying after electric resistance welding is provided. An electric-resistance-welded stainless clad steel pipe or tube comprises: an outer layer of carbon steel or low-alloy steel; and an inner layer of austenitic stainless steel having a predetermined chemical composition, wherein a flatness value h/D in a 90° flattening test in accordance with JIS G 3445 is less than 0.3, and a pipe or tube inner surface has no crack in a sulfuric acid-copper sulfate corrosion test in accordance with ASTM A262-10, Practice E, where h is a flattening crack height (mm), and D is a pipe or tube outer diameter (mm).

ReBCO HIGH TEMPERATURE SUPERCONDUCTING WIRE BONDING DEVICE AND BONDING METHOD USING SAME

Disclosed herein are an apparatus for joining second-generation ReBCO high temperature superconducting wires and a joining method using the same which are capable of fabricating sufficiently long superconducting wires of a persistent current mode having almost zero resistance at the joint of the wires compared to the conventional non-superconducting joint by press-joining the ReBCO high temperature superconductor layers placed to make a direct surface contact with each other through melting diffusion or solid-state diffusion of a tiny portion of a material of the superconductor layers without a medium such as solder or a filler. 1. An apparatus for joining ReBCO high temperature superconducting wires , comprising:a chamber;an oxygen supply unit mounted on one side of the chamber to supply oxygen into the chamber;a vacuum pump mounted on one side of the chamber to adjust a degree of vacuum in the chamber;a pressure measurement device mounted on one side of the chamber to measure a pressure in the chamber;a temperature measurement device mounted on one side of the chamber measure a temperature in the chamber and a temperature of joints of the superconducting wires;a timer mounted on one side of the chamber to measure a entire process time of a joining process and a superconductivity recovery process;a support holder mounted inside the chamber, the support holder allowing a pair of superconducting wire to be rested thereon;a holder jig mounted inside the chamber and positioned between the support holder and the chamber, the holder jig being screw-coupled to the support holder through a plurality of coupling screws;a heater mounted between the support holder and the holder jig to heat the pair of superconducting wires;a press block mounted inside the chamber to apply pressure to join the pair of superconducting wires; anda pressurizer extending from one side of the chamber to an upper portion of the press block to supply pressure to the press block.2. The apparatus ...

APPARATUS FOR ESPECIALLY THERMALLY JOINING MICRO-ELECTROMECHANICAL PARTS

The invention relates to an apparatus for especially thermally joining micro-electromechanical parts () in a process chamber (), comprising a bottom support plate () for holding at least one first () of the parts () to be joined, and a pressing device () for applying pressure to at least one second () of the parts () to be joined in relation to the at least one first part (). The pressing device () is equipped with an expandable membrane () provided for entering in contact with the at least one second part (). Fluid pressure, in particular gas pressure, can be applied to said membrane () on the side thereof facing away from the parts () to be joined. 12311223153232151931923. An apparatus for especially thermally joining micro-electromechanical components ( , ) in a process chamber (B) with a lower support plate () for receiving at least one first component () of the components ( , ) to be joined and with a pressing device () for applying pressure onto at least one second component () of the components ( , ) to be joined , in direction of the least one first component () , characterized in that said pressing device () is formed with an expandable membrane () provided for contacting the at least one second component () , wherein fluid pressure , in particular gas pressure , can be applied onto said membrane () on its side facing away from the components ( , ) to be joined.219. The apparatus according to claim 1 , characterized in that the membrane () is made of a gas-tight sheet material claim 1 , in particular a rubberlike material.319231923. The apparatus according to or claim 1 , characterized in that the thickness of the membrane () and its expansibility are preferably selected according to the topography of the components ( claim 1 , ) to be joined such that the membrane () claim 1 , in the contacting operating condition claim 1 , applies at least approximately the same contact pressure onto the components ( claim 1 , ) claim 1 , regardless of any differences in ...

HIGH-CONDUCTIVITY BONDING OF METAL NANOWIRE ARRAYS

A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW. 1. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface , comprising the steps of:removing a template membrane from the MNW;infiltrating the MNW with a bonding material;placing the bonding material on the adjacent surface;bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; andallowing the bonding material to form a solid bond between the MNW and the adjacent surface.2. The method of claim 1 , further comprising an additional step claim 1 , performed after the placing step and before the bringing step claim 1 , of:wetting the bonding material to the adjacent surface.3. The method of claim 1 , wherein the step of infiltrating comprises heating the bonding material so that it becomes one or more of softened and molten.4. The method of claim 1 , wherein the step of infiltrating comprises chemically treating a composite material so as to create a bonding material.5. The method of claim 1 , wherein the step of bringing comprises bringing the adjacent surface into contact ...

FLUX-LESS DIRECT SOLDERING BY ULTRASONIC SURFACE ACTIVATION

A solder joint and a method of making the same is described. The solder joint includes, a first metal part; a second metal part; and solder material disposed between the first and second metal parts; such that the solder material forms a joint with the first and second metal parts; and the solder material has a plurality of abrasive particles disposed therein. The method includes contacting the solder material with the abrasive particles; placing the solder material and the abrasive particles between the first and second metal parts to form a layered structure; applying a compressive force on the layered structure; applying ultrasonic vibration for a predetermined time to the layered structure to remove the passive oxide layer of the metal part; and applying heat to the layered structure to cause the solder material to melt and flow between the metal parts and form a bond with the metal parts. 1. A solder joint comprising:a first metal part;a second metal part; andsolder material disposed between the first and second metal parts;wherein the solder material forms a joint with the first and second metal parts; andwherein the solder material has a plurality of abrasive particles disposed therein.2. A solder joint according to claim 1 , wherein claim 1 , the first metal part is made from a metal capable of forming a passive oxide layer on the surface.3. A solder joint according to claim 1 , wherein claim 1 , the second metal part is made from a metal capable of forming a passive oxide layer on the surface.4. A solder joint according to claim 1 , wherein claim 1 , the metal is an aluminum alloy.5. A solder joint according to claim 1 , wherein claim 1 , the metal is a titanium alloy.6. A solder joint according to claim 1 , wherein claim 1 , the solder material is selected from a group containing tin-lead-based solder alloys and lead-free tin-based solder alloys.7. A solder joint according to claim 1 , wherein claim 1 , the solder material is brass.8. A solder joint ...

BONDED ALUMINUM-DISSIMILAR METAL STRUCTURE AND METHOD OF MAKING SAME

A bonded dissimilar material structure includes a first component made of a first dissimilar material; a second component made of a second dissimilar material stacked under the first component; and a plurality of blind holes formed on an upper surface of the second component; and the first component has a plurality of protrusions formed in the plurality of blind holes on the second component, respectively. 1. A method for producing a bonded dissimilar material structure , comprising:providing a first component made of a first material;providing a second component made of a second material, wherein the second material has a yield strength higher than the yield strength of the first material;forming a plurality of blind holes on an upper surface of the second component;cleaning surfaces the first component and the second component;stacking the first component on the second component; andbonding the first component and the second component using a diffusion bonding process.2. The method for producing a bonded dissimilar material structure according to claim 1 , wherein cleaning surfaces of the first and second components includes using acidic or alkaline solutions to remove oxide material from the first and second components.3. The method for producing a bonded dissimilar material structure according to claim 1 , wherein cleaning surfaces of the plurality of dissimilar material layers includes using etchant consisting of 75%˜85% phosphoric acid (HPO) claim 1 , 0%˜10% acetic acid (CHCOOH) claim 1 , 0%˜10% nitric acid (HNO) claim 1 , and 5%˜15% water (HO) to remove oxide material from the dissimilar material layers.4. The method for producing a bonded dissimilar material structure according to claim 1 , wherein bonding the first component and the second component using a diffusion bonding process includes:disposing the stacked components in a diffusion bonding apparatus; andapplying a mechanical force or an isostatic pressure to the stacked components, the pressure is ...

IMAGING SYSTEM AND MANUFACTURING APPARATUS

An imaging system using ultraviolet light or a manufacturing apparatus including the imaging system is provided. An imaging system includes an imaging element and a light source, which operates the imaging element with light that is emitted from the light source and reflected or transmitted by an object. A pixel included in the imaging element includes a photoelectric conversion element and a charge holding part. The light source has a function of emitting ultraviolet light to an object. The photoelectric conversion element is irradiated with the ultraviolet light reflected or transmitted by the object. The photoelectric conversion element has a function of changing the potential of the charge holding part when irradiated with the ultraviolet light and retaining the potential when not irradiated with the ultraviolet light. 1. An imaging system comprising:an imaging element comprising a pixel; anda light source configured to emit ultraviolet light to an object,wherein the pixel comprises a photoelectric conversion element and a charge holding part,wherein the photoelectric conversion element is configured to change a potential of the charge holding part when the photoelectric conversion element is irradiated with the ultraviolet light reflected or transmitted by the object, andwherein the photoelectric conversion element is configured to retain the potential of the charge holding part when the photoelectric conversion element is not irradiated with the ultraviolet light.2. The imaging system according to claim 1 ,wherein the pixel comprises a first transistor, a second transistor, a third transistor, and a fourth transistor,wherein the photoelectric conversion element comprises the first transistor,wherein one of a source and a drain of the first transistor is electrically connected to one of a source and a drain of the second transistor and a gate of the third transistor, andwherein one of a source and a drain of the third transistor is electrically connected to one ...