Mikromechanischer Sensorkern für Inertialsensor

Mikromechanischer Sensorkern (100) für einen Inertialsensor (200), aufweisend: – eine bewegliche seismische Masse (10); – eine definierte Anzahl von Ankerelementen (20), mittels der die seismische Masse (10) an einem Substrat befestigt ist; – eine definierte Anzahl von am Substrat befestigten Anschlagseinrichtungen (20) zum Anschlagen der seismischen Masse (10); wobei – an der Anschlagseinrichtung (20) ein erstes federndes Anschlagselement (21), ein zweites federndes Anschlagselement (23) und ein festes Anschlagselement (22) ausgebildet sind; – wobei die Anschlagselemente (21, 22, 23) derart ausgebildet sind, dass die seismische Masse (10) nacheinander an das erste federnde Anschlagselement (21), das zweite federnde Anschlagselement (23) und das feste Anschlagselement (22) anschlagen kann.

DEVICE AND PROCEDURE FOR THE ATTACHMENT OF COMPLETELY LIBERATING MICRO CONSTRUCTION UNITS

Thermal out-of-plane buckle-beam actuator

An out-of-plane thermal buckle-beam microelectrical mechanical actuator is formed on a planar substrate of semiconductor material (e.g., silicon). The actuator includes first and second anchors secured to the substrate and multiple elongated thermal buckle beams that are secured between the anchors. The buckle beams are formed of semiconductor material, such as polysilicon. In one implementation, the buckling beams are coupled together by a pivot frame that includes a frame base secured to each buckle beam and at least one pivot arm that is coupled to the frame base at one end and includes a free end that pivots out-of-plane when the actuator is activated. A current source directs electrical current through the thermal buckle beams via the anchors to impart thermal expansion of the buckle beams and hence a buckling motion of them out of the plane (i.e., away from) the substrate. Some implementations may include an out-of-plane buckle bias that predisposes the buckle beams to move away from ...

Movable device

A movable device simultaneously enabling reduction of size down to the submicron level, higher speed operation, a streamlined production process, low costs, and greater reliability. A movable device provided with bottom electrodes and a basic conductive layer fixed to a substrate, an elastic shaft of a carbon nanotube with a bottom end fixed on the basic conductive layer and standing up, and a top structure including a top electrode spaced away from the bottom electrode and fixed to a top end of the elastic shaft, wherein when applying voltage between a bottom electrode and the top electrode, the top electrode displaces relatively to the bottom electrodes within an allowable range of elastic deformation of the elastic shaft.

DECREASE OF THE OFF SET OF AN ACCELERATION ADAPTOR

6-axis electromagnetically-actuated meso-scale nanopositioner

A MEMS actuator includes a coil stack in the form of microfabricated, electrically conductive first and second superposed layers. A magnet array is superposed in magnetic communication with the coil stack, with first and second coils being selectively, electrically actuatable to generate relative movement between the coil stack and the magnet array both in-plane and out-of-plane. In various embodiments, a plurality of the actuators are integrally coupled to a microfabricated compliant mechanism to provide a high bandwidth, six degree of freedom nanopositioner.

MEMS ACTUATOR STRUCTURES RESISTANT TO SHOCK

Shock-resistant MEMS structures are disclosed. In one implementation, a motion control flexure for a MEMS device includes: a rod including a first and second end, wherein the rod is tapered along its length such that it is widest at its center and thinnest at its ends; a first hinge directly coupled to the first end of the rod; and a second hinge directly coupled to the second of the rod. In another implementation, a conductive cantilever for a MEMS device includes: a curved center portion includes a first and second end, wherein the center portion has a point of inflection; a first root coupled to the first end of the center portion; and a second root coupled to the second end of the center portion. In yet another implementation, a shock stop for a MEMS device is described.

MEMS ACTUATOR, IN PARTICULAR A MICROMIRROR, WITH INCREASED DEFLECTABILITY

A MEMS actuator comprising a frame structure and at least one actuator arm. The actuator arm is connected at a first end to the frame structure and at a second end to an actuator body. The MEMS actuator is characterized in that the at least one actuator arm has a meander structure comprising two or more actuator sections. The two or more actuator sections are oriented substantially perpendicular to the longitudinal axis of the actuator arm. Furthermore, the two or more actuator sections comprise at least one layer of an actuator material, wherein a movement of the actuator body can be effected by actuating the two or more actuator sections. Further disclosed is a method for producing the MEMS actuator.

Micro-electromechanical apparatus having central anchor

A micro-electromechanical apparatus includes a substrate, two first anchors, a frame-shaped mass and two elastic members. The substrate is provided with a reference point thereon. The ring-type mass surrounds the two first anchors, and each of the elastic members connects the corresponding first anchor and the ring-type mass. Each of the first anchors is disposed nearby the center of the micro-electromechanical apparatus so as to decrease effect caused by warpage of the substrate. The micro-electromechanical apparatus can be applied to a micro-electromechanical sensor having rotatable mass, such as a three-axis accelerometer or a magnetometer, to improve processing yields, reliability, and measurement accuracy.

Resonant thermal out-of-plane buckle-beam actuator

An out-of-plane thermal buckle-beam micro electrical mechanical actuator is formed on a planar substrate of semiconductor material (e.g., silicon). The actuator includes first and second anchors secured to the substrate and multiple elongated thermal buckle beams that are secured between the anchors. The buckle beams are formed of semiconductor material, such as polysilicon. In one implementation, the buckling beams are coupled together by a pivot frame that includes a frame base secured to each buckle beam and at least one pivot arm that is coupled to the frame base at one end and includes a free end that pivots out-of-plane when the actuator is activated. A cyclic current source directs cyclic electrical current through the thermal buckle beams via the anchors to impart thermal expansion of the buckle beams and hence a cyclic buckling motion of them out of the plane (i.e., away from) the substrate. In one implementation, the actuator has a characteristic resonant deflection frequency ...

Micromechanical sensor core for inertial sensor

本發明揭示一種用於一慣性感測器(200)的微機械感測器核心(100)，其包含：-一行動地震塊體(10)；-經定義之數量個錨定元件(20)，藉以將該地震塊體(10)緊固於一基板上；-經定義之數量個止動裝置(20)，其緊固在該基板上，用於撞擊該地震塊體(10)；其中-一第一彈性止動元件(21)、一第二彈性止動元件(23)及一固定止動元件(22)形成在該止動裝置(20)上；-其中該等止動元件(21、22、23)係以使得該地震塊體(10)可相繼地撞擊該第一彈性止動元件(21)、該第二彈性止動元件(23)及該固定止動元件(22)之一方式組態。

MINIATURE KINETIC ENERGY HARVESTER FOR GENERATING ELECTRICAL ENERGY FROM MECHANICAL VIBRATIONS

The invention relates to a miniature kinetic energy harvester () for generating electrical energy, comprising: —a support (), —a first element () having walls (-) surrounding at least one cavity (), —at least one spring () mounted between the first element () and the support (), the spring () being arranged so that the first element () may be brought into oscillation relative to the support () according to at least one direction (X) of oscillation, —a transducer () arranged between the first element () and the support () for converting oscillation of the first element () relative to the support () into an electrical signal, —at least one second element () housed within the cavity () and mounted to freely move within the cavity () relative to the first element () so as to impact the walls (-) of the cavity () when the harvester () is subjected to vibrations. 11. A miniature kinetic energy harvester () for generating electrical energy , comprising:{'b': '2', 'a support (),'}{'b': 3', '32', '35', '31, 'a first element () having walls (-) surrounding at least one cavity (),'}{'b': 4', '3', '2', '4', '3', '2, 'at least one spring () mounted between the first element () and the support (), the spring () being arranged so that the first element () may be brought into oscillation relative to the support () according to at least one direction (X) of oscillation,'}{'b': 5', '3', '2', '3', '2, 'a transducer () arranged between the first element () and the support () for converting oscillation of the first element () relative to the support () into an electrical signal,'}{'b': 7', '31', '31', '3', '32', '35', '31', '1, 'at least one second element () housed within the cavity () and mounted to freely move within the cavity () relative to the first element () so as to impact the walls (-) of the cavity () when the harvester () is subjected to vibrations.'}2371. The miniature kinetic energy harvester of claim 1 , wherein the first element () has a first natural frequency of ...

Method of forming compound stage MEM actuator suspended for multidimensional motion

A microelectromechanical compound stage microactuator assembly capable of motion along x, y, and z axes for positioning and scanning integrated electromechanical sensors and actuators is fabricated from submicron suspended single crystal silicon beams. The microactuator incorporates an interconnect system for mechanically supporting a central stage and for providing electrical connections to componants of the microactuator and to devices carried thereby. The microactuator is fabricated using a modified single crystal reactive etching and metallization process which incorporates an isolation process utilizing thermal oxidation of selected regions of the device to provide insulating segments which define conductive paths from external circuitry to the actuator components and to microelectronic devices such as gated field emitters carried by the actuator.

Apparatus and method for anchoring micromachined structures

Micromachined structures, such as fixed drive or sensing fingers of an inertial sensor, are anchored to a substrate using multiple anchors or elongated anchors in order to reduce the bending or twisting of the micromachined structure about the anchor point.

Inertial sensor

In an inertial sensor, a mass is supported by a number of mass support structures positioned within an inner periphery of the mass. The mass support structures are affixed to a substrate by at least one anchor positioned proximate to the mass' center of mass. A number of sensing fingers are affixed to the mass support structures.

Dual and triple axis accelerometers

There is provided an accelerometer comprising: a frame; a first proof mass 10 suspended from the frame by one or more flexures 14 to move relative to the frame along a first axis; a first resonant element assembly fixed between the frame and the first proof mass, wherein movement of the proof mass along the first axis relative to the frame exerts a strain on the first resonant element 16 that affects the resonant behaviour of the first resonant element assembly; a second proof mass 20 suspended from the frame by one or more flexures 24 to move relative to the frame along a second axis, a second resonant element assembly fixed between the frame and the second proof mass, wherein movement of the second proof mass along the second axis relative to the frame exerts a strain on the second resonant element 26 that affects the resonant behaviour of the second resonant element assembly; wherein the second proof mass surrounds the first proof mass and the first resonant element assembly.

Multi-axis accelerometers with reduced cross-axis sensitivity

A multi-axis accelerometer may include a proof mass, a first electrode set, and a second electrode set. The first electrode set may detect acceleration along a second axis of the accelerometer, and may include a first electrode (C1) and a second electrode (C2). The second electrode set may detect acceleration along a first axis of the accelerometer that is orthogonal to the second axis, and may include a third electrode (C3) and a fourth electrode (C4). Application of a force along only the second axis may result in the exhibition of a non-zero change in differential capacitance between at least C1 and C2, but a zero net change in the differential capacitance between at least C3 and C4. As such, the accelerometer may exhibit little or no cross axis sensitivity in response to the applied force.

Compound stage MEM actuator suspended for multidimensional motion

A microelectromechanical compound stage microactuator assembly capable of motion along x, y, and z axes for positioning and scanning integrated electromechanical sensors and actuators is fabricated from submicron suspended single crystal silicon beams. The microactuator incorporates an interconnect system for mechanically supporting a central stage and for providing electrical connections to componants of the microactuator and to devices carried thereby. The microactuator is fabricated using a modified single crystal reactive etching and metallization process which incorporates an isolation process utilizing thermal oxidation of selected regions of the device to provide insulating segments which define conductive paths from external circuitry to the actuator components and to microelectronic devices such as gated field emitters carried by the actuator.

With a single driven micromechanical monolithic three-axis gyroscope

REDUCING OFFSET IN ACCELEROMETERS

Accelerometer offset is reduced by forming mass support structures within an inner periphery of the mass, affixing the mass support structures to the substrate by at least one anchor positioned near the mass' center of mass, and affixing the sensing fingers proximate to the anchor. The mass support structures can be affixed to the substrate using a single anchor or multiple anchors that are positioned close together. The sensing fingers can be affixed to the substrate or to the mass support structures. The mass is typically suspended from within its periphery but toward its outer periphery.

MEMS ELEMENT AND OPTICAL APPARATUS USING THE SAME

A MEMS element includes a substrate 200, a fixing portion 2 provided at the substrate 200, first and second actuators 3, 4 provided at the fixing portion, a drive target member 7 coupled to the first and second actuators 3, 4, a third actuator 9 provided at the fixing portion 2, and a restriction member 10 coupled to the third actuator. The first and second actuators 3, 4 drive the drive target member 7 in a direction parallel to or crossing an upper surface of the substrate 200. The third actuator 9 drives the restriction member 10 in a direction crossing a movement direction of the drive target member 7 to position the restriction member 10 within a movement plane of the drive target member 7 such that the restriction member 10 restricts displacement of the drive target member 7.

Surface mount actuator

A silicon MEMS device can have at least one solder contact formed thereupon. The silicon MEMS device can be configured to be mounted to a circuit board via the solder contact(s). The silicon MEMS device can be configured to be electrically connected to the circuit board via the solder contact(s).

Drehfederelement

Ein Drehfederelement (100) ist drehbar mit einem Substrat (200) verbunden und zum Einsatz in mikro-elektro-mechanischen Vorrichtungen geeignet, wobei das Drehfederelement (100) sowohl gegenüber dem Substrat (200) verdreht als auch linear gegenüber dem Substrat (200) bewegt werden kann und dadurch gekennzeichnet ist, dass das Drehfederelement (100) einstückig ausgebildet ist.

VORRICHTUNG UND VERFAHREN ZUR BEFESTIGUNG VON VÖLLIG BEFREITEN MIKROBAUTEILEN

THERMAL OUT-OF-PLANE BUCKLE-BEAM ACTUATOR

평면외 써멀 버클빔 마이크로 전자 기계 액추에이터는 반도체 재료(예컨대 실리콘)의 평면 기판상에 형성된다. 상기 액추에이터는 상기 기판에 고정된 제 1 및 제2 앵커와 상기 앵커들 사이에 고정된 복수의 신장된 써멀 버클빔을 포함한다. 버클빔은 폴리실리콘과 같은 반도체 재료로 형성된다. 일실시예에서는, 버클빔은, 각 버클빔에 고정된 프레임 베이스, 및 일단에서 프레임 베이스에 접속되고 액추에이터가 작동될 때에 평면외로 선회하는 자유단을 포함하는 하나 이상의 피봇 아암을 포함하는 피봇 프레임에 의해 함께 접속된다. 전류원은 앵커를 경유하여 써멀 버클빔을 통해 전류를 보내 버클빔의 열팽창을 부여함으로써 버클빔이 기판의 평면 외부로(즉, 기판으로부터 벗어나) 휘어지게 된다. 몇몇 실시예는, 작동될 때에 버클빔이 기판으로부터 벗어나 이동하도록 하는 평면외 버클 바이어스를 포함할 수 있다. An out-of-plane thermal bucklebeam microelectromechanical actuator is formed on a planar substrate of semiconductor material (eg silicon). The actuator includes first and second anchors fixed to the substrate and a plurality of elongated thermal buckle beams fixed between the anchors. The buckle beam is formed of a semiconductor material such as polysilicon. In one embodiment, the buckle beam includes a frame base secured to each buckle beam, and at least one pivot arm comprising a free end connected at one end to the frame base and pivoting out of plane when the actuator is actuated. Are connected together. The current source sends current through the thermal buckle beam via the anchor to impart thermal expansion of the buckle beam such that the buckle beam is bent out of the plane of the substrate (ie off the substrate). Some embodiments may include an out-of-plane buckle bias that causes the buckle beam to move away from the substrate when actuated. 써멀 평면외 버클빔 액추에이터, 마이크로 전기 기계, MEMS 액추에이터, 버클빔 Thermal out-of-plane buckle beam actuators, micro-electrical machines, MEMS actuators, buckle beams

MEMS sensor compensation for off-axis movement

A microelectromechanical system (MEMS) sensor includes a MEMS layer that includes fixed and movable electrodes. In response to an in-plane linear acceleration, the movable electrodes move with respect to the fixed electrodes, and acceleration is determined based on the resulting change in capacitance. A plurality of auxiliary electrodes are located on a substrate of the MEMS sensor and below the MEMS layer, such that a capacitance between the MEMS layer and the auxiliary loads changes in response to an out-of-plane movement of the MEMS layer or a portion thereof. The MEMS sensor compensates for the acceleration value based on the capacitance sensed by the auxiliary electrodes.

VERRINGERUNG DES OFFSETS EINES BESCHLEUNIGUNGSAUFNEHMERS

Dual and triple axis accelerometers

Inertial sensor

In an inertial sensor, a mass is supported by a number of mass support structures positioned within an inner periphery of the mass. The mass support structures are affixed to a substrate by at least one anchor positioned proximate to the mass' center of mass. A number of sensing fingers are affixed to the mass support structures.

TORSION SPRING ELEMENT

Miniature kinetic energy harvester for generating electrical energy from mechanical vibrations

단일 구동 모드를 가진 미세기계화 모노리식 3축 자이로스코프

... 본 개시는 디바이스 층의 x-y 평면에 형성된 단일 프루프 매스 3축 자이로스코프를 캡슐화하도록 구성된 캡 웨이퍼 및 비아 웨이퍼를 제공한다. 단일 프루프 매스 3축 자이로스코프는 단일의 중앙 앵커의 주위에 현가된 메인 프루프 매스 부분을 포함하고, 메인 프루프 매스 부분은 3축 자이로스코프 센서의 에지부를 향해 바깥쪽으로 연장된 방사형 부분을 포함하며, 단일 프루프 매스 3축 자이로스코프는 또한 단일의 중앙 앵커로부터 3축 자이로스코프를 현가하도록 구성된 중앙 서스펜션 시스템과 가동 부분 및 정지 부분을 구비하는 구동 전극을 포함하며, 가동 부분은 방사형 부분에 결합되고, 구동 전극과 중앙 서스펜션 시스템은 3축 자이로스코프를 x-y 평면에 대해 법선 방향인 z축 주위에서 구동 주파수로 진동시키도록 구성된다.

REDUCING OFFSET IN ACCELEROMETERS

Compound stage MEM actuator suspended for multidimensional motion

A microelectromechanical compound stage microactuator assembly capable of motion along x, y, and z axes for positioning and scanning integrated electromechanical sensors and actuators is fabricated from submicron suspended single crystal silicon beams. The microactuator incorporates an interconnect system for mechanically supporting a central stage and for providing electrical connections to componants of the microactuator and to devices carried thereby. The microactuator is fabricated using a modified single crystal reactive etching and metallization process which incorporates an isolation process utilizing thermal oxidation of selected regions of the device to provide insulating segments which define conductive paths from external circuitry to the actuator components and to microelectronic devices such as gated field emitters carried by the actuator.

INTEGRATED OPTICAL MICROELECTRONIC MECHANICAL SYSTEMS DEVICES AND METHODS

Silicon photonics provides an attractive platform for optoelectronic integrated circuits (OEICs) exploiting hybrid or monolithic integration with or without concurrent integration of microelectromechanical systems (MEMS) and/or CMOS electronic. Such OEICs offering optical component solutions across multiple applications from optical sensors through to optical networks operating upon one or more wavelengths. Accordingly, various silicon photonic building blocks are required in order to provide a toolkit for a circuit designer to exploit OEICs where these building blocks must address specific aspects of OEICs such as polarisation dependency of the optical waveguides. Accordingly, the inventors have established designs for: polarisation rotators with MEMS based tuning to allow the dual polarisations from a polarisation splitter to be managed by an OEIC operating upon a single polarisation; analog or digital phase shifts with MEMS actuation for switches, attenuators etc.; and passband filters with MEMS tuning.

VERRINGERUNG DES OFFSETS EINES BESCHLEUNIGUNGSAUFNEHMERS

In an inertial sensor, a mass is supported by a number of mass support structures positioned within an inner periphery of the mass. The mass support structures are affixed to a substrate by at least one anchor positioned proximate to the mass' center of mass. A number of sensing fingers are affixed to the mass support structures.

SURFACE MOUNT MEMS ACTUATOR

A silicon MEMS device having at least one solder contact formed thereupon for being mounted and electrically connected to a circuit board via the solder contact(s). The MEMS device may have flexures, the solder contacts being formed upon each flexure. The MEMS device may also be an actuator having an arm configured to move when the actuator is actuated.

Miniature kinetic energy harvester for generating electrical energy from mechanical vibrations

The invention relates to a miniature kinetic energy harvester for generating electrical energy, comprising a support, a first element having walls surrounding at least one cavity, at least one spring mounted between the first element and the support, the spring being arranged so that the first element may be brought into oscillation relative to the support according to at least one direction of oscillation, a transducer arranged between the first element and the support for converting oscillation of the first element relative to the support into an electrical signal, at least one second element housed within the cavity and mounted to freely move within the cavity relative to the first element so as to impact the walls of the cavity when the harvester is subjected to vibrations.

Surface mount actuator

A silicon MEMS device can have at least one solder contact formed thereupon. The silicon MEMS device can be configured to be mounted to a circuit board via the solder contact(s). The silicon MEMS device can be configured to be electrically connected to the circuit board via the solder contact(s).

Thermischer Aktuator mit einem aus der Fläche biegenden Balken

MIRROR DEVICE, OPTICAL SWITCH, THIN FILM ELASTIC STRUCTURE, AND THIN FILM ELASTIC STRUCTURE PRODUCING METHOD

A mirror device comprises a mirror (2), and a support mechanism for elastically supporting the mirror (2) with respect to a base board (1) in a floating state above the base board (1) and tiltably in an optional direction. The support mechanism comprises three support sections (3A, 3B, 3C) that mechanically connect the base board (1) and the mirror (2). Each of the support sections (3A, 3B, 3C) has one or more plate springs (5) composed of one or more layers of thin film. The plate springs (5) are connected at one of their respective ends to the base board (1) through legs (9) having a portion rising from the base board (1), and mechanically connected at the other ends to the mirror (2) through connectors having a portion rising from the other ends. The mirror (2) is supported with respect to the base board (1) only through the plate springs (5) of the support sections (3A, 3B, 3C). Thereby, size reduction and mass productivity can be further improved while retaining superior optical characteristics ...

MICROMACHINED MONOLITHIC 3-AXIS GYROSCOPE WITH SINGLE DRIVE

This document discusses, among other things, a cap wafer and a via wafer configured to encapsulate a single proof-mass 3-axis gyroscope formed in an x-y plane of a device layer. The single proof-mass 3-axis gyroscope can include a main proof-mass section suspended about a single, central anchor, the main proof-mass section including a radial portion extending outward towards an edge of the 3-axis gyroscope sensor, a central suspension system configured to suspend the 3-axis gyroscope from the single, central anchor, and a drive electrode including a moving portion and a stationary portion, the moving portion coupled to the radial portion, wherein the drive electrode and the central suspension system are configured to oscillate the 3-axis gyroscope about a z-axis normal to the x-y plane at a drive frequency. 120-. (canceled)21. An inertial measurement system , comprising: a 3-axis gyroscope including a single proof mass formed in an x-y plane of a device layer; and', 'a 3-axis accelerometer including a single proof mass formed in the x-y plane of the device layer adjacent the 3-axis gyroscope,, 'a device layer includingwherein the 3-axis gyroscope includes a central suspension configured to suspend the single proof-mass of the 3-axis gyroscope about a single, central gyroscope anchor, andwherein the 3-axis accelerometer including separate x, y, and z-axis flexure bearings configured to suspend a single proof-mass of the 3-axis accelerometer about a single, central accelerometer anchor.22. The system of claim 21 , including:a cap wafer bonded to a first surface of the device layer; anda via wafer bonded to a second surface of the device layer,wherein the cap wafer and the via wafer are configured to encapsulate the 3-axis accelerometer and the 3-axis gyroscope in the same cavity.23. The system of claim 21 , including a via wafer bonded to a perimeter of a surface of the device layer claim 21 , andwherein the single proof masses of the 3-axis gyroscope and the 3-axis ...

Resonant thermal out-of-plane buckle-beam acuator

An out-of-plane thermal buckle-beam microelectrical mechanical actuator is formed on a planar substrate of semiconductor material (e.g., silicon). The actuator includes first and second anchors secured to the substrate and multiple elongated thermal buckle beams that are secured between the anchors. The buckle beams are formed of semiconductor material, such as polysilicon. In one implementation, the buckling beams are coupled together by a pivot frame that includes a frame base secured to each buckle beam and at least one pivot arm that is coupled to the frame base at one end and includes a free end that pivots out-of-plane when the actuator is activated. A cyclic current source directs cyclic electrical current through the thermal buckle beams via the anchors to impart thermal expansion of the buckle beams and hence a cyclic buckling motion of them out of the plane (i.e., away from) the substrate. In one implementation, the actuator has a characteristic resonant deflection frequency range ...

Semiconductor sensor for physical parameter e.g. acceleration sensor or angular velocity sensor, has base region coupled to oscillator via support bridge region with 2 parallel support bridges and transverse bridge

The semiconductor sensor (100) has a base region (10) coupled to an oscillator (20,30), having an oscillation characteristic dependent on a measured physical parameter, via a support bridge region (21,31) with 2 parallel U-shaped support bridges (22,23,32,33) coupled together via a transverse bridge (24,34).

단일 구동 모드를 가진 미세기계화 모노리식 3축 자이로스코프

... 본 개시는 디바이스 층의 x-y 평면에 형성된 단일 프루프 매스 3축 자이로스코프를 캡슐화하도록 구성된 캡 웨이퍼 및 비아 웨이퍼를 제공한다. 단일 프루프 매스 3축 자이로스코프는 단일의 중앙 앵커의 주위에 현가된 메인 프루프 매스 부분을 포함하고, 메인 프루프 매스 부분은 3축 자이로스코프 센서의 에지부를 향해 바깥쪽으로 연장된 방사형 부분을 포함하며, 단일 프루프 매스 3축 자이로스코프는 또한 단일의 중앙 앵커로부터 3축 자이로스코프를 현가하도록 구성된 중앙 서스펜션 시스템과 가동 부분 및 정지 부분을 구비하는 구동 전극을 포함하며, 가동 부분은 방사형 부분에 결합되고, 구동 전극과 중앙 서스펜션 시스템은 3축 자이로스코프를 x-y 평면에 대해 법선 방향인 z축 주위에서 구동 주파수로 진동시키도록 구성된다.

SYSTEM AND METHOD FOR CONSTRAINING TOTALLY RELEASED MICROCOMPONENTS

A system and method are disclosed which constrain a microcomponent that is totally released from a substrate for handling of such totally released microcomponent. A preferred embodiment provides constraining members that work to constrain a microcomponent to a substrate as such microcomponent is totally released from such substrate. Accordingly, such constraining members may aid in preserving the microcomponent with its substrate during the release of such microcomponent from its substrate during fabrication. Additionally, a preferred embodiment provides constraining members that are suitable for constraining a totally released microcomponent to a base for post-fabrication handling of the microcomponent. To further aid in post-fabrication handling of totally released microcomponents, a preferred embodiment may be implemented as a 'pallet' having one or more microcomponents constrained thereto. Moreover, constraining members of a preferred embodiment enable the totally released microcomponent to be removed from such constraints when desired, but prevents the totally released microcomponent from inadvertently escaping such constraints.

REDUCING OFFSET IN ACCELEROMETERS

Accelerometer offset is reduced by forming mass support structures (104, 106, 108, 110, 112, 114, 116, 118) within an inner periphery of the mass (102), affixing the mass support structures to the substrate by at least one anchor positioned near the mass, center of mass, and affixing the sensing fingers (120, 122, 124, 126) proximate to the anchor. The mass support structures can be affixed to the substrate using a single anchor or multiple anchors that are positioned close to gather. The sensing fingers can be affixed to the substrate or to the mass support structures. The mass is typically suspended from within its periphery but toward its outer periphery.

SURFACE MOUNT ACTUATOR

A silicon MEMS device can have at least one solder contact formed thereupon. The silicon MEMS device can be configured to be mounted to a circuit board via the solder contact(s). The silicon MEMS device can be configured to be electrically connected to the circuit board via the solder contact(s).

PHYSICAL QUANTITY SENSOR, COMPLEX SENSOR, INERTIAL MEASUREMENT UNIT, PORTABLE ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND VEHICLE

A physical quantity sensor includes a sensor element (acceleration sensor element) and a substrate (package) to which the sensor element is attached using a bonding material (resin adhesive), in which, when an elastic modulus of the bonding material is e, 2.0 GPa<e<7.8 GPa is satisfied.

Sensor package having a movable sensor

A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members.

Thermal out-of-plane buckle-beam actuator

An out-of-plane thermal buckle-beam microelectrical mechanical actuator is formed on a planar substrate of semiconductor material (e.g., silicon). The actuator includes first and second anchors secured to the substrate and multiple elongated thermal buckle beams that are secured between the anchors. The buckle beams are formed of semiconductor material, such as polysilicon. In one implementation, the buckling beams are coupled together by a pivot frame that includes a frame base secured to each buckle beam and at least one pivot arm that is coupled to the frame base at one end and includes a free end that pivots out-of-plane when the actuator is activated. A current source directs electrical current through the thermal buckle beams via the anchors to impart thermal expansion of the buckle beams and hence a buckling motion of them out of the plane (i.e., away from) the substrate. Some implementations may include an out-of-plane buckle bias that predisposes the buckle beams to move away from ...

SYSTEM AND METHOD FOR CONSTRAINING TOTALLY RELEASED MICROCOMPONENTS

A system and method are disclosed which constrain a microcomponent that is totally released from a substrate for handling of such totally released microcomponent. A preferred embodiment provides a system and method which constrain a totally released microcomponent to a base (e.g., another microcomponent or a substrate). For example, a preferred embodiment provides constraining members that work to constrain a microcomponent to a substrate as such microcomponent is totally released from such substrate. Accordingly, such constraining members may aid in preserving the microcomponent with its substrate during the release of such microcomponent from its substrate during fabrication. Additionally, a preferred embodiment provides constraining members that are suitable for constraining a totally released microcomponent to a base for post-fabrication handling of the microcomponent. To further aid in post-fabrication handling of totally released microcomponents, a preferred embodiment may be implemented as a "pallet" having one or more microcomponents constrained thereto. Moreover, constraining members of a preferred embodiment enable the totally released microcomponent to be removed from such constraints when desired, but prevents the totally released microcomponent from inadvertently escaping such constraints. For instance, in one embodiment, the constraining members are implemented as moveable members that can be moved to unconstrain the totally released microcomponent from its base.

THERMAL OUT-OF-PLANE BUCKLE-BEAM ACTUATOR

PURPOSE: An actuator is provided to offer the out-of-plane movement with same force as an existing thermal actuator. CONSTITUTION: An out-of-plane thermal buckle-beam microelectrical mechanical actuator(50) is formed on a planar substrate of semiconductor material. The actuator includes first and second anchors(52,54) secured to the substrate and multiple elongated thermal buckle beams(56) that are secured between the anchors. The buckle beams are formed of semiconductor material, such as polysilicon. In one implementation, the buckling beams are coupled together by a pivot frame(64) that includes a frame base(66) secured to each buckle beam and at least one pivot arm that is coupled to the frame base at one end and includes a free end that pivots out-of-plane when the actuator is activated. A cyclic current source(80) directs cyclic electrical current through the thermal buckle beams via the anchors to impart thermal expansion of the buckle beams and hence a cyclic buckling motion of them ...

PROCESS FOR MANUFACTURING A MICRO-ELECTRO-MECHANICAL DEVICE FROM A SINGLE SEMICONDUCTOR WAFER AND RELATED MEMS DEVICE

The present disclosure is directed to a process for manufacturing a micro-electro-mechanical system (MEMS) device. The process includes, in part, forming a first sacrificial dielectric region on a semiconductor wafer; forming a structural layer of semiconductor material on the first sacrificial dielectric region; forming a plurality of first openings through the structural layer; forming a second sacrificial dielectric region on the structural layer; forming a ceiling layer of semiconductor material on the second sacrificial dielectric region; forming a plurality of second openings through the ceiling layer; forming on the ceiling layer a permeable layer; selectively removing the first and the second sacrificial dielectric regions; and forming on the permeable layer a sealing layer of semiconductor material.

Structure with thermal out-of-plane buckle-beam acuator

MEMS HAVING LID DRIVE AND METHOD FOR OPERATION THEREOF

Ein MEMS-Bauelement umfasst einen Schichtstapel mit einer Mehrzahl an MEMS-Schichten, die entlang einer Schichtfolgenrichtung angeordnet sind. Das MEMS-Bauelement umfasst ein in einer ersten MEMS-Schicht gebildetes bewegliches Element, das zwischen einer zweiten MEMS-Schicht und einer dritten MEMS-Schicht des Schichtstapels angeordnet ist. Ferner ist eine Antriebseinrichtung vorgesehen, die eine mit dem beweglichen Element mechanisch fest verbundene erste Antriebsstruktur und eine mit der zweiten MEMS-Schicht mechanisch fest verbundene zweite Antriebsstruktur aufweist. Die Antriebseinrichtung ist ausgebildet, um eine Antriebskraft senkrecht zu der Schichtfolgenrichtung an dem beweglichen Element zu erzeugen, und die Antriebskraft ist ausgelegt, um das bewegliche Element auszulenken.

Halbleitersensoren für eine Physikalische Grösse

Ein Halbleiterwinkelgeschwindigkeitssensor besitzt einen rahmenförmigen Basisbereich (10), einen Meßoszillator (30), der mit dem Basisbereich (10) über einen Meßtragbalkenbereich (31) verbunden ist, und einen Antriebsoszillator (20), der mit dem Meßoszillator (30) über einen Antriebstragbalkenbereich (21) verbunden ist. Jeder der Tragbalkenbereiche (21, 31) besitzt ein Paar von Tragbalken (22, 23, 32, 33), von denen jeder eine allgemeine U-Form besitzt und die miteinander über einen Brückenbereich (24, 34) verbunden sind. Demgemäß können die Tragbalkenbereiche (21, 31) eine große Rotationssteifheit bzw. Steifheit gegenüber Rotationen besitzen, derart, daß sie Oszillationen bzw. Schwingungen der Oszillatoren (20, 30) nicht verhindern bzw. hemmen.

Acceleration sensor and manufacturing method for the same

System and method for constraining totally released micro-components

本发明公开一种对与一衬底完全脱离的微元件进行约束的系统和方法，对完全获释微元件进行处理。其设置了一些约束构件，构件能将微元件约束到衬底上，微元件就是从衬底上完全脱离出来的。在制造过程中，约束构件有助于在微元件从其衬底相分离时将微元件保持在衬底上。另外，其还可设置一些约束构件，适于将完全获释微元件约束到基底上，在微元件的制造完全之后对其处理。为了能进一步便于对完全获释微元件制出后处理，可将一优选实施例设计成“托盘”的形式，其上约束着一个或多个微元件。另外，一优选实施例中的约束构件能使得完全获释的微元件在需要时能脱离所述的约束件，但却能防止完全获释的微元件在无意中脱离所述约束件。

Three-axis monolithic MEMS accelerometers and methods for fabricating same

Three-axis monolithic microelectromechanical system (MEMS) accelerometers and methods for fabricating integrated capacitive and piezo accelerometers are provided. In an embodiment, a three-axis MEMS accelerometer includes a first sensing structure for sensing acceleration in a first direction. Further, the three-axis MEMS accelerometer includes a second sensing structure for sensing acceleration in a second direction perpendicular to the first direction. Also, the three-axis MEMS accelerometer includes a third sensing structure for sensing acceleration in a third direction perpendicular to the first direction and perpendicular to the second direction. At least one sensing structure is a capacitive structure and at least one sensing structure is a piezo structure.

INTEGRATED OPTICAL MICROELECTRONIC MECHANICAL SYSTEMS DEVICES AND METHODS

VORRICHTUNG UND VERFAHREN ZUR BEFESTIGUNG VON VÖLLIG BEFREITEN MIKROBAUTEILEN

Thermal out-of-plane buckle-beam actuator

An out-of-plane thermal buckle-beam microelectrical mechanical actuator is formed on a planar substrate of semiconductor material (e.g., silicon). The actuator includes first and second anchors secured to the substrate and multiple elongated thermal buckle beams that are secured between the anchors. The buckle beams are formed of semiconductor material, such as polysilicon. In one implementation, the buckling beams are coupled together by a pivot frame that includes a frame base secured to each buckle beam and at least one pivot arm that is coupled to the frame base at one end and includes a free end that pivots out-of-plane when the actuator is activated. A current source directs electrical current through the thermal buckle beams via the anchors to impart thermal expansion of the buckle beams and hence a buckling motion of them out of the plane (i.e., away from) the substrate. Some implementations may include an out-of-plane buckle bias that predisposes the buckle beams to move away from ...

DRIVER

A driver (100) comprises a base section (110), a movable stage section (130) for mounting an article (12) to be driven, a resilient section (12) for connecting the base section and the stage section and exhibiting resiliency for moving the stage section along one direction (X axis), and sections (141, 142, 22) which apply a shaking force for moving the stage section to oscillate along the one direction at a resonance frequency determined by the stage section and the resilient section.

Reducing offset in accelerometers

System and method for constraining totally released microcomponents

완전히 분리된 마이크로콤포넌트의 취급을 위해, 기판으로부터 완전히 분리된 마이크로콤포넌트를 속박하는 시스템 및 방법이 기술되어 있다. 양호한 실시예는 완전히 분리된 마이크로콤포넌트를 베이스(예로서, 다른 마이크로콤포넌트 또는 기판)에 속박하는 시스템 및 방법을 제공한다. 예로서, 양호한 실시예는 이런 기판으로부터 이런 마이크로콤포넌트가 완전히 분리되었을 때, 마이크로콤포넌트를 기판에 속박하도록 기능하는 속박 부재들을 제공한다. 따라서, 이런 속박 부재들은 제조 동안 그 기판으로부터의 이런 마이크로콤포넌트를 분리하는 동안 그 기판과 함께 마이크로콤포넌트를 보존하는 것을 도울 수 있다. 부가적으로, 양호한 실시예는 마이크로콤포넌트의 제조후 취급을 위해 완전히 분리된 마이크로콤포넌트를 베이스에 속박하기에 적합한 속박 부재들을 제공한다. 완전히 분리된 마이크로콤포넌트들의 제조후 취급을 추가로 돕기 위해, 양호한 실시예는 그에 속박된 적어도 하나의 마이크로콤포넌트들을 가지는 "팔레트"로서 구현될 수 있다. 또한, 양호한 실시예의 속박 부재들은 필요시 이런 속박들로부터 완전히 분리된 마이크로콤포넌트가 벗어날 수 있지만, 완전히 분리된 마이크로콤포넌트가 비의도적으로 이런 속박들로부터 이탈되는 것은 방지한다. 예로서, 한 실시예에서, 속박 부재들은 그 베이스로부터 완전히 분리된 마이크로콤포넌트들을 속박 해제하도록 이동될 수 있는 가동성 부재들로서 구현된다.

내충격성 MEMS 액튜에이터 구조

... 내충격성(shock-resistant) MEMS 구조들이 개시된다. 한 구현예에서, MEMS 장치의 동작 제어 플렉서는: 제1 및 제2 단부를 가지며, 그 중앙에서 가장 넓고 단부들에서 가장 좁도록 그 길이를 따라 테이퍼 진 로드와; 로드의 제1 단부에 직접 결합되는 제1 힌지와; 그리고 로드의 제2 단부에 결합되는 제2 힌지를 구비한다. 다른 구현예에서, MEMS 장치의 도전 캔틸레버는 제1 및 제2 단부를 포함하며 변곡점을 가지는 굴곡된 중앙 부분과; 중앙 부분의 제1 단부에 결합되는 제1 근부와; 그리고 중앙 부분의 제2 단부에 결합되는 제2 근부를 포함한다. 또 다른 구현예에는 MEMS 장치의 충격 스톱이 기재되어 있다.

멤스 기반의 3축 가속도 센서

... 본 발명은 멤스 기반의 3축 가속도 센서에 관한 것으로서, 보다 상세하게는 바닥 웨이퍼기판에 평행한 제1 축 방향으로 입력되는 외부의 가속도를 감지하기 위한 x축 센서질량체; 상기 바닥 웨이퍼기판에 평행하고 상기 제1 축에 수직인 제2 축 방향으로 입력되는 외부의 가속도를 감지하기 위한 y축 센서질량체; 및 상기 x축 센서질량체 및 상기 y축 센서질량체를 각각 둘러싸도록 형성되고, 상기 바닥 웨이퍼기판에 수직인 제3 축 방향으로 입력되는 외부의 가속도를 감지하기 위한 z축 센서질량체를 포함하여 공간을 절약하면서도 각 축 센서질량체의 독립적인 운동을 감지해 3축 방향 가속도를 각각 측정한다.

6-AXIS ELECTROMAGNETICALLY-ACTUATED MESO-SCALE NANOPOSITIONER

A MEMS actuator includes a coil stack in the form of microf abricated, electrically conductive first and second superposed layers. A magnet: array is superposed in magnetic communication with the coil stack, with first and second coils being selectively, electrically actuatable to generate relative movement between the coil stack and the magnet array both in-plane and out-of -plane. In various embodiments, a plurality of the actuators are integrally coupled to a microf abricated compliant mechanism to provide a high bandwidth, six degree of freedom nanopositioner.

System and method for constraining totally released microcomponents

A system and method are disclosed which constrain a microcomponent that is totally released from a substrate for handling of such totally released microcomponent. A preferred embodiment provides a system and method which constrain a totally released microcomponent to a base (e.g., another microcomponent or a substrate). For example, a preferred embodiment provides constraining members that work to constrain a microcomponent to a substrate as such microcomponent is totally released from such substrate. Accordingly, such constraining members may aid in preserving the microcomponent with its substrate during the release of such microcomponent from its substrate during fabrication. Additionally, a preferred embodiment provides constraining members that are suitable for constraining a totally released microcomponent to a base for post-fabrication handling of the microcomponent. To further aid in post-fabrication handling of totally released microcomponents, a preferred embodiment may be implemented ...

Manufacturing method of sensor package

A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members.

Droplet control and detection device, operating method thereof, and microfluidic device

A droplet control and detection device and an operating method thereof are provided. The droplet control and detection device includes: a light source; a first electrode; a second electrode; a droplet arranged on a light-exiting side of the light source, where the droplet is movable under the effect of an electric field formed between the first electrode and the second electrode; a photoelectric detection structure configured to detect light emitted by the light source and reflected by the droplet; and a processing circuit configured to obtain droplet information according to a detection result of the photoelectric detection structure and control an electrical signal applied on the first electrode and the second electrode according to the droplet information.

MANUFACTURING METHOD OR SENSOR PACKAGE

A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members.

SYSTEM AND METHOD FOR CONSTRAINING TOTALLY RELEASED MICROCOMPONENTS

A system and method are disclosed which constrain a microcomponent that is totally released from a substrate for handling of such totally released microcomponent. A preferred embodiment provides a system and method which constrain a totally released microcomponent to a base (e.g., another microcomponent or a substrate ). For example, a preferred embodiment provides constraining members that work to constrain a microcomponent to a substrate as such microcomponent is totally released from such substrate. Accordingly, such constraining members may aid in preserving the microcomponent with its substrate during the release of such microcomponent from its substrate during fabrication. Additionally, a preferred embodiment provides constraining members that are suitable for constraining a totally released microcomponent to a base for post-fabrication handling of the microcomponent. To further aid in post-fabrication handling of totally released microcomponents, a preferred embodiment may be implemented ...

Acceleration sensor and manufacturing method for the same

The present invention easily achieves an accurate control structure for limiting displacement of a weight. An SOI substrate with a trilaminar structure including a silicon layer, a silicon oxide layer, and a silicon layer is prepared, and slits are opened by applying induced coupling plasma etching which can selectively remove only silicon from the upper side. Then, the same etching is applied from the lower side to form grooves, whereby the lower silicon layer is separated into a weight and a pedestal. Next, the structure is immersed in an etchant which can selectively remove only silicon oxide, whereby the vicinities of exposed portions of the silicon oxide layer are removed to form joint layers. A glass substrate is joined to the bottom surface of the pedestal. Piezo resistor elements are formed on the upper surface of the silicon layer to detect bending. The degree of freedom of upward displacements of the weight is accurately set based on the thickness of the joint layer.

Thermischer Aktuator mit einem aus der Fläche biegenden Balken

For generating electrical energy from mechanical vibration of the miniature dynamic energy collector

REDUCING OFFSET IN ACCELEROMETERS

Accelerometer offset is reduced by forming mass support structures (104, 106, 108, 110, 112, 114, 116, 118) within an inner periphery of the mass (102), affixing the mass support structures to the substrate by at least one anchor positioned near the mass, center of mass, and affixing the sensing fingers (120, 122, 124, 126) proximate to the anchor. The mass support structures can be affixed to the substrate using a single anchor or multiple anchors that are positioned close to gather. The sensing fingers can be affixed to the substrate or to the mass support structures. The mass is typically suspended from within its periphery but toward its outer periphery.

Thermal out-of-plane buckle-beam actuator

MICROMACHINED 3-AXIS ACCELEROMETER WITH A SINGLE PROOF-MASS

MICROMACHINED 3-AXIS ACCELEROMETER WITH A SINGLE PROOF-MASS

Micromachined monolithic 3-axis gyroscope with single drive

This document discusses, among other things, a cap wafer and a via wafer configured to encapsulate a single proof-mass 3-axis gyroscope formed in an x-y plane of a device layer. The single proof-mass 3-axis gyroscope can include a main proof-mass section suspended about a single, central anchor, the main proof-mass section including a radial portion extending outward towards an edge of the 3-axis gyroscope sensor, a central suspension system configured to suspend the 3-axis gyroscope from the single, central anchor, and a drive electrode including a moving portion and a stationary portion, the moving portion coupled to the radial portion, wherein the drive electrode and the central suspension system are configured to oscillate the 3-axis gyroscope about a z-axis normal to the x-y plane at a drive frequency.

Acceleration sensor and manufacturing method for the same

The present invention easily achieves an accurate control structure for limiting displacement of a weight (310; 310B). An SOI substrate with a trilaminar structure including a silicon layer (10), a silicon oxide layer (20), and a silicon layer (30) is prepared, and slits (S1-S4) are opened by applying induced coupling plasma etching which can selectively remove only silicon from the upper side. Then, the same etching is applied from the lower side to form grooves (G1, G2), whereby the silicon layer (30) is separated into a weight (310; 310B) and a pedestal (330; 330B). Next, the structure is immersed in an etchant which can selectively remove only silicon oxide, whereby the vicinities of exposed portions of the silicon oxide layer (20) are removed to form joint layers. A glass substrate (400) is joined to the bottom surface of the pedestal (330; 330B). Piezo resistor elements (Rx1-Rx4, Ry1-Ry4, Rz1-Rz4) are formed on the upper surface of the silicon layer (100) to detect bending. The degree ...

RESONANT THERMAL OUT-OF-PLANE BUCKLE-BEAM ACTUATOR

PURPOSE: A resonant thermal out-of-plane buckle-beam actuator is provided to supply out-of-plane motions having force almost same with an existing thermal actuator and to secure relatively large force at a small region. CONSTITUTION: An out-of-plane thermal buckle-beam MEMS actuator(50) is formed on a planar substrate of semiconductor materials. The actuator includes first and second anchors(52,54) fixed to the substrate and a plurality of elongated thermal buckle beams(56) fixed between the anchors. The buckle beams are formed of semiconductor materials as polysilicon and mutually combined by a pivot frame(64). The pivot frame includes a frame base(66) fixed to each buckle beam; at least one pivot arm coupled to the frame base at one end; and a free end(74) for pivoting out-of-plane when the actuator is driven. The buckle beams are thermally expanded by applying cyclic electrical currents from a cyclic current source(80) through the anchor to the thermal buckle beam. Accordingly, the buckle ...

6-AXIS ELECTROMAGNETICALLY-ACTUATED MESO-SCALE NANOPOSITIONER

A MEMS actuator 12 includes a coil stack 13 in the form of micro fabricated, electrically conductive first and second superposed layers. A magnet array 15 is superposed in magnetic communication with the coil stack 13, with first and second coils being selectively, electrically actuatable to generate relative movement between the coil stack 13 and the magnet array 15 both in-plane and out-of-plane. In various embodiments, a plurality of the actuators are integrally coupled to a microfabricated compliant mechanism to provide a high bandwidth, six degree of freedom nanopositioner.

Sensor package and manufacturing method thereof

6-Axis electromagnetically-actuated meso-scale nanopositioner

A MEMS actuator includes a coil stack in the form of microfabricated, electrically conductive first and second superposed layers. A magnet array is superposed in magnetic communication with the coil stack, with first and second coils being selectively, electrically actuatable to generate relative movement between the coil stack and the magnet array both in-plane and out-of-plane. In various embodiments, a plurality of the actuators are integrally coupled to a microfabricated compliant mechanism to provide a high bandwidth, six degree of freedom nanopositioner.

SYSTEM AND METHOD FOR CONSTRAINING TOTALLY RELEASED MICROCOMPONENTS

완전히 분리된 마이크로콤포넌트의 취급을 위해, 기판으로부터 완전히 분리된 마이크로콤포넌트를 속박하는 시스템 및 방법이 기술되어 있다. 양호한 실시예는 완전히 분리된 마이크로콤포넌트를 베이스(예로서, 다른 마이크로콤포넌트 또는 기판)에 속박하는 시스템 및 방법을 제공한다. 예로서, 양호한 실시예는 이런 기판으로부터 이런 마이크로콤포넌트가 완전히 분리되었을 때, 마이크로콤포넌트를 기판에 속박하도록 기능하는 속박 부재들을 제공한다. 따라서, 이런 속박 부재들은 제조 동안 그 기판으로부터의 이런 마이크로콤포넌트의 분리 동안 그 기판과 함께 마이크로콤포넌트를 보존하는 것을 도울 수 있다. 부가적으로, 양호한 실시예는 마이크로콤포넌트의 제조후 취급을 위해 완전히 분리된 마이크로콤포넌트를 베이스에 속박하기에 적합한 속박 부재들을 제공한다. 완전히 분리된 마이크로콤포넌트들의 제조후 취급을 추가로 돕기 위해, 양호한 실시예는 그에 속박된 적어도 하나의 마이크로콤포넌트들을 가지는 "팔레트"로서 구현될 수 있다. 또한, 양호한 실시예의 속박 부재들은 필요시 이런 속박들로부터 완전히 분리된 마이크로콤포넌트가 제거될 수 있지만, 완전히 분리된 마이크로콤포넌트가 비의도적으로 이런 속박들로부터 이탈되는 것은 방지한다. 예로서, 한 실시예에서, 속박 부재들은 그 베이스로부터 완전히 분리된 마이크로콤포넌트들을 속박 해제하도록 이동될 수 있는 가동성 부재들로서 구현된다.

MINIATURE HERMETIC ACCELERATION DETECTION DEVICE

A MEMS acceleration detection device including a housing having a cavity and a spring mass system assembled into the cavity of the housing. A lid enclosing the spring mass system in the cavity and contacting a top surface of the housing.

MEMS actuator structures resistant to shock

Shock-resistant MEMS structures are disclosed. In one implementation, a motion control flexure for a MEMS device includes: a rod including a first and second end, wherein the rod is tapered along its length such that it is widest at its center and thinnest at its ends; a first hinge directly coupled to the first end of the rod; and a second hinge directly coupled to the second of the rod. In another implementation, a conductive cantilever for a MEMS device includes: a curved center portion includes a first and second end, wherein the center portion has a point of inflection; a first root coupled to the first end of the center portion; and a second root coupled to the second end of the center portion. In yet another implementation, a shock stop for a MEMS device is described.

Inertial sensor

In an inertial sensor, a mass is supported by a number of mass support structures positioned within an inner periphery of the mass. The mass support structures are affixed to a substrate by at least one anchor positioned proximate to the mass' center of mass. A number of sensing fingers are affixed to the mass support structures.

Apparatus and method for anchoring micromachined structures

Micromachined structures, such as fixed drive or sensing fingers of an inertial sensor, are anchored to a substrate using multiple anchors or elongated anchors in order to reduce the bending or twisting of the micromachined structure about the anchor point.

REDUCING OFFSET IN ACCELEROMETERS

단일 구동 모드를 가진 미세기계화 모노리식 3축 자이로스코프

... 본 개시는 디바이스 층의 x-y 평면에 형성된 단일 프루프 매스 3축 자이로스코프를 캡슐화하도록 구성된 캡 웨이퍼 및 비아 웨이퍼를 제공한다. 단일 프루프 매스 3축 자이로스코프는 단일의 중앙 앵커의 주위에 현가된 메인 프루프 매스 부분을 포함하고, 메인 프루프 매스 부분은 3축 자이로스코프 센서의 에지부를 향해 바깥쪽으로 연장된 방사형 부분을 포함하며, 단일 프루프 매스 3축 자이로스코프는 또한 단일의 중앙 앵커로부터 3축 자이로스코프를 현가하도록 구성된 중앙 서스펜션 시스템과 가동 부분 및 정지 부분을 구비하는 구동 전극을 포함하며, 가동 부분은 방사형 부분에 결합되고, 구동 전극과 중앙 서스펜션 시스템은 3축 자이로스코프를 x-y 평면에 대해 법선 방향인 z축 주위에서 구동 주파수로 진동시키도록 구성된다.

Mems Device With Capacitance Enhancement On Quadrature Compensation Electrode

MICROMACHINED MONOLITHIC 3-AXIS GYROSCOPE WITH SINGLE DRIVE

MOVABLE ELEMENT

A movable element which can achieve miniaturization of submicron level, high speed operation, simplification of fabrication process, cost reduction, and high reliability simultaneously. The movable element has a basic structure comprising a lower electrode and a basic conductive layer secured onto a substrate, respectively, an elastic shaft of carbon nanotube standing with the lower end secured onto the basic conductive layer, and an upper structural body including an upper electrode secured to the upper end of the elastic shaft while spaced apart from the lower electrode, wherein the upper electrode is displaced from the lower electrode by Coulomb force acting between the both electrodes within an allowable range of elastic deformation of the elastic shaft.

Struktur mit thermischem Aktuator mit einem aus der Fläche biegenden Balken

Struktur mit thermischem Aktuator mit einem aus der Fläche biegenden Balken

TORSION SPRING ELEMENT

A frame (110) is rotatably coupled to a substrate (200) by way of a torsion spring element (100), wherein the frame (110) can be both twisted in relation to the substrate (200) and moved linearly in relation to said substrate (200). The torsion spring element (100) is made of a single piece and suitable for use in micro-electromechanical devices.

Surface mount actuator

A silicon MEMS device can have at least one solder contact formed thereupon. The silicon MEMS device can be configured to be mounted to a circuit board via the solder contact(s). The silicon MEMS device can be configured to be electrically connected to the circuit board via the solder contact(s).

SENSOR PACKAGE HAVING A MOVABLE SENSOR

A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members. 1. A sensor package , comprising: a fixed frame; and', 'a moveable platform configured to be moved with respect to the fixed frame along at least one direction and having a rectangular shape, wherein the moveable platform comprises a plurality of comb electrodes at two opposite edges of the rectangular shape of the moveable platform;, 'a micro-electromechanical system (MEMS) actuator, comprisingmultiple elastic restoring members formed between the fixed frame and another two opposite edges, different from the two opposite edges, of the rectangular shape of the moveable platform, and configured to restore a position of the moved moveable platform; anda sensor chip arranged on the moveable platform.2. The sensor package as claimed in claim 1 , whereinthe multiple elastic restoring members are formed by a patterned metal layer, andthe sensor chip is configured to transmit detected data via the multiple elastic restoring members.3. The sensor package as claimed in claim 1 , wherein the sensor chip comprises solder balls mounted on the multiple elastic restoring members.4. The sensor package as claimed in claim 1 , wherein the multiple elastic restoring members are formed as straight lines between the fixed frame and the moveable platform.5. The sensor package as claimed in claim 1 , wherein the multiple elastic restoring members arranged at each of the another two opposite edges are all parallel to each other.6. The sensor package as claimed in claim 1 , whereinthe fixed ...

DROPLET CONTROL AND DETECTION DEVICE, OPERATING METHOD THEREOF, AND MICROFLUIDIC DEVICE

A droplet control and detection device and an operating method thereof are provided. The droplet control and detection device includes: a light source; a first electrode; a second electrode; a droplet arranged on a light-exiting side of the light source, where the droplet is movable under the effect of an electric field formed between the first electrode and the second electrode; a photoelectric detection structure configured to detect light emitted by the light source and reflected by the droplet; and a processing circuit configured to obtain droplet information according to a detection result of the photoelectric detection structure and control an electrical signal applied on the first electrode and the second electrode according to the droplet information. 1. A droplet control and detection device , comprising:a light source;a first electrode;a second electrode;a droplet arranged on a light-exiting side of the light source, wherein the droplet is movable under the effect of an electric field formed between the first electrode and the second electrode;a photoelectric detection structure, configured to detect light emitted by the light source and reflected by the droplet; anda processing circuit, configured to obtain droplet information according to a detection result of the photoelectric detection structure and control an electrical signal applied on the first electrode and the second electrode according to the droplet information.2. The droplet control and detection device according to claim 1 , wherein the droplet information comprises at least one of a position parameter claim 1 , an appearance parameter and a component parameter of the droplet.3. The droplet control and detection device according to claim 1 , further comprising:a first hydrophobic layer and a second hydrophobic layer oppositely arranged and on the light-exiting side of the light source, wherein the first hydrophobic layer and the second hydrophobic layer are spaced by a predetermined distance, ...

MEMS DEVICE WITH CAPACITANCE ENHANCEMENT ON QUADRATURE COMPENSATION ELECTRODE

A MEMS device includes a mass system capable of undergoing oscillatory drive motion along a drive axis and oscillatory sense motion along a sense axis perpendicular to the drive axis. A quadrature correction unit includes a fixed electrode and a movable electrode coupled to the movable mass system, each being lengthwise oriented along the drive axis. The movable electrode is spaced apart from the fixed electrode by a gap having an initial width. At least one of the fixed and movable electrodes includes an extrusion region extending toward the other of the fixed and movable electrodes. The movable electrode undergoes oscillatory motion with the mass system such that the extrusion region is periodically spaced apart from the other of the fixed and movable electrodes by a gap exhibiting a second width that is less than the first width thereby enabling capacitance enhancement between the electrodes. 1. A MEMS device for capacitance enhancement comprising:a fixed electrode coupled to a substrate and lengthwise oriented in a first direction;a movable electrode coupled to and extending from a movable mass system, said movable electrode being lengthwise oriented in said first direction, said movable electrode being spaced apart from said fixed electrode by a gap in a second direction that is perpendicular to said first direction; andan extrusion region extending in said second direction from one of said fixed and movable electrodes toward the other of said fixed and movable electrodes.2. The MEMS device of wherein:said gap between said fixed and movable electrodes is a first gap exhibiting a first width; andsaid movable electrode is configured to undergo oscillatory motion with said mass system such that said extrusion region is periodically spaced apart from the other of said fixed and movable electrodes by a second gap exhibiting a second width, said second width being less than said first width.3. The MEMS device of wherein:said first width is a minimum allowable spacing ...

SENSOR PACKAGE HAVING A MOVABLE SENSOR

A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members. 1. A sensor package , comprising: a fixed frame; and', 'a moveable platform configured to be moved with respect to the fixed frame along at least one direction;, 'a micro-electromechanical system (MEMS) actuator, comprisingat least one elastic restoring member each being formed as a straight line between the fixed frame and the moveable platform, and configured to restore a position of the moved moveable platform; anda sensor chip arranged on the moveable platform.2. The sensor package as claimed in claim 1 , whereinthe at least one elastic restoring member is a patterned metal layer, andthe sensor chip is configured to transmit detected data via the at least one elastic restoring member.3. The sensor package as claimed in claim 1 , wherein the sensor chip comprises solder balls electrically connected to the at least one elastic restoring member.4. The sensor package as claimed in claim 1 , wherein the movable platform has a rectangular shape claim 1 , and the at least one elastic restoring member is formed between two opposite sides of the rectangular shape and the fixed frame.5. The sensor package as claimed in claim 1 , wherein the movable platform has a rectangular shape claim 1 , and the at least one elastic restoring member is formed between four corners of the rectangular shape and the fixed frame.6. The sensor package as claimed in claim 1 , whereinthe fixed frame has a plurality of first comb electrodes and the moveable platform has a plurality of second comb ...

MICRO-ELECTROMECHANICAL APPARATUS HAVING CENTRAL ANCHOR

A micro-electromechanical (MEMS) apparatus includes a substrate, two first anchors, a frame, and two elastic members. The substrate is provided with a reference point thereon. The frame surrounds the two first anchors, and each of the elastic members connects the corresponding first anchor and the frame. Each of the first anchors is disposed near the center of the MEMS apparatus to decrease an effect caused by warpage of the substrate. The MEMS apparatus can be applied to an MEMS sensor having a rotatable mass, such as a three-axis accelerometer or a magnetometer, to improve process yield, reliability, and measurement accuracy. 1. A micro-electromechanical apparatus , comprising:a substrate;two first anchors disposed on the substrate, wherein a distance from each of the first anchors to a reference point of the substrate is equal;a frame surrounding the two first anchors; andtwo elastic members wherein each of the two first anchors is connected to the frame through corresponding one of the two elastic members,wherein the distance from each of the first anchors to the reference point is less than a distance from each of the first anchors to the frame.2. The micro-electromechanical apparatus as recited in claim 1 , wherein a distance from an inner side of the frame to another inner side of the frame is L claim 1 , and a distance between the two first anchors is less than L/4.3. The micro-electromechanical apparatus as recited in claim 1 , wherein each of the elastic members comprises:a fixed end connected to the corresponding first anchor;a movable end connected to the frame; anda connecting portion connected to the fixed end and the movable end, wherein a width of the fixed end is greater than a width of the connecting portion.4. The micro-electromechanical apparatus as recited in claim 3 , wherein a width of the movable end is greater than the width of the connecting portion.5. The micro-electromechanical apparatus as recited in claim 1 , further comprising at least ...

Mems actuator structures resistant to shock

Shock-resistant MEMS structures are disclosed. In one implementation, a motion control flexure for a MEMS device includes: a rod including a first and second end, wherein the rod is tapered along its length such that it is widest at its center and thinnest at its ends; a first hinge directly coupled to the first end of the rod; and a second hinge directly coupled to the second of the rod. In another implementation, a conductive cantilever for a MEMS device includes: a curved center portion includes a first and second end, wherein the center portion has a point of inflection; a first root coupled to the first end of the center portion; and a second root coupled to the second end of the center portion. In yet another implementation, a shock stop for a MEMS device is described.

Three-axis monolithic mems accelerometers and methods for fabricating same

Three-axis monolithic microelectromechanical system (MEMS) accelerometers and methods for fabricating integrated capacitive and piezo accelerometers are provided. In an embodiment, a three-axis MEMS accelerometer includes a first sensing structure for sensing acceleration in a first direction. Further, the three-axis MEMS accelerometer includes a second sensing structure for sensing acceleration in a second direction perpendicular to the first direction. Also, the three-axis MEMS accelerometer includes a third sensing structure for sensing acceleration in a third direction perpendicular to the first direction and perpendicular to the second direction. At least one sensing structure is a capacitive structure and at least one sensing structure is a piezo structure.

SENSOR PACKAGE HAVING A MOVABLE SENSOR

A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members. 1. A sensor package , comprising: a fixed frame; and', 'a moveable platform configured to be moved with respect to the fixed frame along at least one direction;, 'a micro-electromechanical system (MEMS) actuator, comprisingat least one elastic restoring member connected between the fixed frame and the moveable platform, and configured to restore the moved moveable platform to an original position; anda sensor chip arranged on the moveable platform, and configured to transmit detected data via the at least one elastic restoring member.2. The sensor package as claimed in claim 1 , wherein the at least one elastic restoring member is a patterned metal layer.3. The sensor package as claimed in claim 1 , wherein the sensor chip comprises solder balls electrically connected to the at least one elastic restoring member.4. The sensor package as claimed in claim 1 , wherein the movable platform has a rectangular shape claim 1 , and the at least one elastic restoring member is formed between two opposite sides of the rectangular shape and the fixed frame.5. The sensor package as claimed in claim 1 , wherein the movable platform has a rectangular shape claim 1 , and the at least one elastic restoring member is formed between four corners of the rectangular shape and the fixed frame.6. The sensor package as claimed in claim 1 , whereinthe fixed frame has a plurality of first comb electrodes and the moveable platform has a plurality of second comb electrodes, andthe plurality of ...

CAPACITIVE CAPACITIVE MICROELECTRONIC AND / OR NANOELECTRONIC DEVICE WITH INCREASED COMPACITY

Dispositif à élément mobile (13) s'étendant suivant un plan donné comportant au moins une première (3), une deuxième (10) et une troisième (12) couches s'étendant dans des plans parallèles au plan donné, la première couche (3) formant un support, la deuxième couche (10) comportant tout ou partie de l'élément mobile (13) et des moyens de suspension (11) de l'élément mobile (13) par rapport au support et la troisième couche (12) comprenant tout ou partie des moyens capacitifs dont la capacité varie en fonction de la position relative de l'élément mobile (13) par rapport au support (3), lesdits moyens capacitifs comportant au moins une électrode mobile (14) solidaire d'une des faces de l'élément mobile (13) parallèle au plan donné, et au moins une électrode fixe (16) par rapport au support (3), les électrodes fixe et mobile étant disposées au moins en partie dans un même plan parallèle au plan donné et au moins en partie au-dessus et/ou en dessous de l'élément mobile (13). Mobile element device (13) extending in a given plane comprising at least a first (3), a second (10) and a third (12) layer lying in planes parallel to the given plane, the first layer ( 3) forming a support, the second layer (10) comprising all or part of the movable element (13) and suspension means (11) of the movable element (13) relative to the support and the third layer (12). ) comprising all or part of the capacitive means whose capacitance varies as a function of the relative position of the movable element (13) relative to the support (3), said capacitive means comprising at least one movable electrode (14) integral with a faces of the movable element (13) parallel to the given plane, and at least one fixed electrode (16) relative to the support (3), the fixed and mobile electrodes being arranged at least partly in the same plane parallel to the plane given and at least partly above and / or below the mobile element (13).

MICROMECHANICAL SENSOR CORE FOR AN INERTIAL SENSOR

Cœur de capteur micromécanique (100) pour un capteur inertiel (200) ayant : une masse sismique mobile (10), un nombre défini d'éléments d'ancrage pour fixer la masse sismique (10) à un substrat, un nombre défini d'installations de butée (20) fixées au substrat pour servir de butée à la masse sismique (10). L'installation de butée (20) a un premier élément de butée élastique (21), un second élément de butée élastique (23) et un élément de butée fixe (22). Les éléments de butée (21, 22, 23) sont réalisés pour que la masse sismique (10) bute successivement contre le premier élément de butée élastique, puis le second élément de butée élastique (23) et ensuite l'élément de butée fixe (22). Micromechanical sensor core (100) for an inertial sensor (200) having: a movable seismic mass (10), a defined number of anchor elements for attaching the seismic mass (10) to a substrate, a defined number of stop installations (20) fixed to the substrate to serve as a stop for the seismic mass (10). The stopper installation (20) has a first elastic stopper member (21), a second elastic stopper member (23) and a fixed stopper member (22). The stopper elements (21, 22, 23) are made so that the seismic mass (10) abuts successively against the first elastic stopper element, then the second elastic stopper element (23) and then the fixed stopper element ( 22).

Micro-electromechanical apparatus having central anchor

Microelectromechanicdevices devices with central fixed seat

本发明公开一种具有中央固定座的微机电装置。该微机电装置包括基板、两第一固定座、环形质量块以及两弹性元件。环形质量块围绕两第一固定座，各弹性元件连接相对应的第一固定座与环形质量块。各第一固定座设置于微机电装置的中心附近，以使微机电装置能降低受基板翘曲造成的影响。前述微机电装置可应用于具有可旋转质量块的微机电感测器，例如三轴加速度计、磁力计等，以提升制作工艺良率、可靠度与测量准确度。

Sensor package having a movable sensor

A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members.

Manufacturing method of sensor package

提供一种传感器封装件，包含固定框、可动平台、弹性复位件以及传感芯片。所述可动平台可相对所述固定框移动并用于乘载所述传感芯片。所述弹性复位件连接于所述固定框与所述可动平台之间，用于使移动的所述可动平台回复至原始位置。所述传感芯片设置于所述弹性复位件上，以通过所述弹性复位件传送检测数据。

Capacitive micro and/ or nanoelectronic device having increased compactness

HEART OF MICROMECHANICAL SENSOR FOR AN INERTIAL SENSOR

Cœur de capteur micromécanique (100) pour un capteur inertiel (200) ayant : une masse sismique mobile (10), un nombre défini d'éléments d'ancrage pour fixer la masse sismique (10) à un substrat, un nombre défini d'installations de butée (20) fixées au substrat pour servir de butée à la masse sismique (10). L'installation de butée (20) a un premier élément de butée élastique (21), un second élément de butée élastique (23) et un élément de butée fixe (22). Les éléments de butée (21, 22, 23) sont réalisés pour que la masse sismique (10) bute successivement contre le premier élément de butée élastique, puis le second élément de butée élastique (23) et ensuite l'élément de butée fixe (22). Micromechanical sensor core (100) for an inertial sensor (200) having: a moving seismic mass (10), a defined number of anchor elements for attaching the seismic mass (10) to a substrate, a defined number of stop devices (20) attached to the substrate to abut the seismic mass (10). The stop device (20) has a first elastic stop member (21), a second resilient stop member (23) and a fixed stop member (22). The stop elements (21, 22, 23) are formed so that the seismic mass (10) abuts successively against the first elastic stop element, then the second elastic stop element (23) and then the fixed stop element ( 22).

Thin-film elastic structure, manufacturing method thereof, mirror device and optical switch using the same

Micromechanical sensor core for inertial sensor and associated inertial sensor, production method and use

本發明揭示一種用於一慣性感測器(200)的微機械感測器核心(100)，其包含：-一可動的地震塊體(10)；-經定義之數量個錨定元件(14)，藉以將該地震塊體(10)緊固於一基板上；-經定義之數量個止動裝置(20)，其緊固在該基板上，用於撞擊該地震塊體(10)；其中-一第一彈性止動元件(21)、一第二彈性止動元件(23)及一固定止動元件(22)形成在該止動裝置(20)上；-其中該等止動元件(21、22、23)係以使得該地震塊體(10)可相繼地撞擊該第一彈性止動元件(21)、該第二彈性止動元件(23)及該固定止動元件(22)之一方式組態。

Apparatus and method for anchoring micromachined structures

Micromachined structures, such as fixed drive or sensing fingers of an inertial sensor, are anchored to a substrate using multiple anchors or elongated anchors in order to reduce the bending or twisting of the micromachined structure about the anchor point.

Mems actuator system

A multi-axis MEMS assembly is configured to provide multi-axis movement and includes: a first in-plane MEMS actuator configured to enable movement along at least an X-axis; and a second in-plane MEMS actuator configured to enable movement along at least a Y-axis; wherein the first in-plane MEMS actuator is coupled to the second in-plane MEMS actuator.

Mems element and optical device using same

This MEMS element has: a substrate 200; an anchor unit 2 provided to the substrate 200; first and second actuators 3, 4 provided to the anchor unit; a driven member 7 coupled to the first and second actuators 3, 4; a third actuator 9 provided to the anchor unit 2; and a restricting member 10 coupled to the third actuator. The first and second actuators 3, 4 drive the driven member 7 in a direction parallel to or intersecting with the upper face of the substrate 200. The third actuator 9 drives the restricting member 10 in a direction intersecting the direction of motion of the driven member 7 and positions the same inside the plane of motion of the driven member 7, whereby the restricting member 10 restricts displacement of the driven member 7.

MEMS actuation system

A multi-axis MEMS assembly includes: a micro-electrical-mechanical system (MEMS) actuator configured to provide linear three-axis movement, the micro-electrical-mechanical system (MEMS) actuator including: an in-plane MEMS actuator, and an out-of-plane MEMS actuator including a multi-morph piezoelectric actuator; an optoelectronic device coupled to the in-plane MEMS actuator; and a lens barrel assembly coupled to the out-of-plane MEMS actuator.

Resonant thermal out-of-plane buckle-beam actuator

Single proof mass based three-axis accelerometer

The present invention discloses a three-axis accelerometer. The three-axis accelerometer comprises: a substrate; at least one anchor block fixedly disposed on the substrate; a first X-axis electrode, a second X-axis electrode, a first Y-axis electrode, a second Y-axis electrode, a first Z-axis electrode and a second Z-axis electrode all fixedly disposed on the substrate; a framework suspended above the substrate and comprising a first beam column, a second beam column disposed opposite to the first beam column and at least one connecting beam connecting the first beam column and the second beam column; a proof mass suspended above the substrate; and at least one elastic connection component configured to elastically connect to the at least anchor block, the connecting beam, and the proof mass. The three-axis accelerometer can realize high-precision acceleration detection on three axes with only one proof mass, and in particular, can provide a fully differential detection signal for the Z axis, thereby greatly improving detection precision.

MEMS, Verfahren zum Herstellen eines MEMS und Verfahren zum Auslegen eines MEMS

Ein MEMS umfasst ein Substrat und eine in dem Substrat angeordnete Kavität. In der Kavität ist ein bewegliches Element angeordnet, das ausgebildet ist, um mit einem in der Kavität angeordneten Fluid zu interagieren, wobei eine Bewegung des Fluids und eine Bewegung des beweglichen Elements kausal zusammenhängen. Eine erste Öffnung, die die Kavität mit einer Umgebung des Substrats verbindet, bewirkt einen ersten Phasenversatz einer ersten mit der Bewegung des beweglichen Elements kausal zusammenhängenden periodischen Oszillation beim Durchqueren der ersten Öffnung. Eine zweite Öffnung, die die Kavität mit der Umgebung des Substrats verbindet, bewirkt einen von dem ersten Phasenversatz verschiedenen zweiten Phasenversatz einer zweiten mit der Bewegung des beweglichen Elements kausal zusammenhängenden periodischen Oszillation beim Durchqueren der zweiten Öffnung.

Microelectromechanical sensor device with active offset compensation

A microelectromechanical sensor device having a sensing structure with: a substrate; an inertial mass, suspended above the substrate and elastically coupled to a rotor anchoring structure by elastic coupling elements, to perform at least one inertial movement due to a quantity to be sensed; first sensing electrodes, integrally coupled to the inertial mass to be movable due to the inertial movement; and second sensing electrodes, fixed with respect to the quantity to be sensed, facing and capacitively coupled to the first sensing electrodes to form sensing capacitances having a value that is indicative of the quantity to be sensed. The second sensing electrodes are arranged in a suspended manner above the substrate and a compensation structure is configured to move the second sensing electrodes with respect to the first sensing electrodes and vary a facing distance thereof, in the absence of the quantity to be sensed, in order to compensate for a native offset of the sensing structure.

Mems actuator structures resistant to shock

Shock-resistant MEMS structures are disclosed. In one implementation, a motion control flexure for a MEMS device includes: a rod including a first and second end, wherein the rod is tapered along its length such that it is widest at its center and thinnest at its ends; a first hinge directly coupled to the first end of the rod; and a second hinge directly coupled to the second of the rod. In another implementation, a conductive cantilever for a MEMS device includes: a curved center portion includes a first and second end, wherein the center portion has a point of inflection; a first root coupled to the first end of the center portion; and a second root coupled to the second end of the center portion. In yet another implementation, a shock stop for a MEMS device is described.

Mems actuator structures resistant to shock

Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, (54) Title: MEMS ACTUATOR STRUCTURES RESISTANT TO SHOCK 24 2 Fig. 10 (57) : Shock-resistant MEMS structures are disclosed. In one implementation, a motion control flexure for a MEMS device includes: a rod including a first and second end, wherein the rod is tapered along its length such that it is widest at its center and thinnest at its ends; a first hinge directly coupled to the first end of the rod; and a second hinge directly coupled to the second of the rod. In another implementation, a conductive cantilever for a MEMS device includes: a curved center portion includes a first and second end, wherein the center portion has a point of inflection; a first root coupled to the first end of the center portion; and a second root coupled to the second end of the center portion. In yet another implementation, a shock stop for a MEMS device is de- scribed. (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau 111111111M 111111111111111111 DEEM II 11111111111111111111111111111111 RID IIIIIIII (10) International Publication Number WO 2017/116562 Al WIPO I PCT (43) International Publication Date 6 July 2017 (06.07.2017) AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, ...

Mems actuator structures resistant to shock

Mems actuator structures resistant to shock

抗震的mems致动器结构

公开了抗震MEMS结构。在一个实施方式中，用于MEMS装置的运动控制挠曲件包括：包括第一端部和第二端部的杆，其中杆沿其长度逐渐变细，使得杆在其中心处最宽并且在其端部处最薄；直接连接到杆的第一端部的第一铰链；以及直接连接到杆的第二端部的第二铰链。在另一实施方式中，用于MEMS装置的导电悬臂包括：弯曲的中心部分，其包括第一端部和第二端部，其中中心部分具有拐点；连接到中心部分的第一端部的第一根部；以及连接到中心部分的第二端部的第二根部。在又一个实施方式中，描述了用于MEMS装置的震动止动件。

내충격성 mems 액튜에이터 구조

내충격성(shock-resistant) MEMS 구조들이 개시된다. 한 구현예에서, MEMS 장치의 동작 제어 플렉서는: 제1 및 제2 단부를 가지며, 그 중앙에서 가장 넓고 단부들에서 가장 좁도록 그 길이를 따라 테이퍼 진 로드와; 로드의 제1 단부에 직접 결합되는 제1 힌지와; 그리고 로드의 제2 단부에 결합되는 제2 힌지를 구비한다. 다른 구현예에서, MEMS 장치의 도전 캔틸레버는 제1 및 제2 단부를 포함하며 변곡점을 가지는 굴곡된 중앙 부분과; 중앙 부분의 제1 단부에 결합되는 제1 근부와; 그리고 중앙 부분의 제2 단부에 결합되는 제2 근부를 포함한다. 또 다른 구현예에는 MEMS 장치의 충격 스톱이 기재되어 있다.

Mems actuator structures resistant to shock

Shock-resistant MEMS structures are disclosed. In one implementation, a motion control flexure for a MEMS device includes: a rod including a first and second end, wherein the rod is tapered along its length such that it is widest at its center and thinnest at its ends; a first hinge directly coupled to the first end of the rod; and a second hinge directly coupled to the second of the rod. In another implementation, a conductive cantilever for a MEMS device includes: a curved center portion includes a first and second end, wherein the center portion has a point of inflection; a first root coupled to the first end of the center portion; and a second root coupled to the second end of the center portion. In yet another implementation, a shock stop for a MEMS device is described.

耐衝撃性ｍｅｍｓアクチュエータ構造

微機電系統致動器、微機械臂陣列及製造微機電系統致動器的方法

提供一種微機械臂陣列。該微機械臂陣列包含：在第一水平方向上彼此隔開且沿第二水平方向延伸的複數個微機械臂，其中每個微機械臂包含位於每個微機械臂的頂部且在垂直方向向上突出的突起；複數個保護膜，每個保護膜封裝該些微機械臂之一；及沿第一水平方向延伸的金屬連接結構。該金屬連接結構包含：複數個接合部，每個接合部對應且圍繞該些微機械臂之一的突起；及沿第一水平方向延伸且連接兩個相鄰接合部的複數個連接部。

Monolithische Membran aus Glas, Doppel-Vertikalmembran-Anordnung, mikromechanische Federstruktur und zugehöriges Herstellungsverfahren

Zur Erweiterung der Anwendungsmöglichkeiten von mikromechanischen Biegestrukturen 2 in Glas wird vorgeschlagen, quer zu einer Substratebene 5 eines Glassubstrats 3 verlaufende Vertikalmembrane 1 monolithisch in dem Glassubstrat 3 auszubilden, indem Blindlöcher 8 mithilfe einer laserinduzierten Modifikation des Glassubstrats 3 und einer nachfolgenden nasschemischen Ätzung angelegt werden. Hierdurch lassen sich nicht nur Biegestrukturen 2 innerhalb des Körpers 40 des Glassubstrat 3 anordnen, sondern auch Federstrukturen 19 sowie Festkörpergelenke 35 monolithisch, insbesondere in der Tiefe des Glassubstrats 3, ausbilden. Dies ermöglicht auch neuartige Aktuierungskonzepte in Glas.

Mikromechanische Kammstruktur aus Glas sowie zugehöriges Verfahren und Verwendung

Zur Ausweitung der Anwendungsmöglichkeiten des vorbekannten LIDE (laser induced deep etching) Verfahrens wird vorgeschlagen, eine mikromechanische Kammstruktur (25) durch Setzen von einer Vielzahl von Laserpulsen (4) auf einem Glas-Substrat (3) mit nachfolgendem nasschemischen Ätzschritt zum Freilegen der Kammstruktur (25) herzustellen und dabei die Lage derjenigen Laserpulse (4) genau zu kontrollieren, die die äußere Kontur (6) von jeweiligen Fingern (24) der Kammstruktur (25) definieren. Dadurch wird es möglich, sehr schmale Finger (24) auszubilden, die gleichmäßig ausgebildete Seitenwände (13) aufweisen, wodurch sehr geringe Spaltmaße (35) und eine gleichmäßige elektrostatische Aktuierung der Kammstruktur (25) ermöglicht wird. Durch Kontrolle der Phasenlage φ und/oder des Ausmaßes des sidewall scalloping der Finger (24) ist es zudem möglich, die mechanischen Eigenschaften der Kammstruktur (25) günstig zu beeinflussen bzw. gezielt einzustellen.

Dual and triple axis accelerometers

There is provided an accelerometer comprising: a frame; a first proof mass suspended from the frame by one or more flexures to move relative to the frame along a first axis; a first resonant element assembly fixed between the frame and the first proof mass, wherein movement of the proof mass along the first axis relative to the frame exerts a strain on the first resonant element that affects the resonant behaviour of the first resonant element assembly; a second proof mass suspended from the frame by one or more flexures to move relative to the frame along a second axis, a second resonant element assembly fixed between the frame and the second proof mass, wherein movement of the second proof mass along the second axis relative to the frame exerts a strain on the second resonant element that affects the resonant behaviour of the second resonant element assembly; wherein the second proof mass surrounds the first proof mass and the first resonant element assembly.

Microelectromechanical sensor device with active offset compensation

A microelectromechanical sensor device having a sensing structure (1) with: a substrate (2); an inertial mass (3), suspended above the substrate (2) and elastically coupled to a rotor anchoring structure (6) by elastic coupling elements (8), to perform at least one inertial movement due to a quantity to be sensed; first sensing electrodes (9), integrally coupled to the inertial mass (3) to be movable due to the inertial movement; and second sensing electrodes (12), fixed with respect to the quantity to be sensed, facing and capacitively coupled to the first sensing electrodes (9) to form sensing capacitances having a value that is indicative of the quantity to be sensed. The second sensing electrodes (12) are arranged in a suspended manner above the substrate (2) and a compensation structure (20) is configured to move the second sensing electrodes (12) with respect to the first sensing electrodes (9) and vary a facing distance thereof, in the absence of the quantity to be sensed, in order to compensate for a native offset of the sensing structure (1).

Micro-opto-mechanical system sensor, arrangement and manufacturing method

There is provided a MOMS sensor comprising a fiber interface comprising a fiber passthrough for one or more optical fibers, a cavity comprising an element hermetically encapsulated within the cavity, wherein the element is movably anchored by SiN arms, which are movable with respect to walls of the cavity, wherein the SiN arms comprise anchor portions at first ends of the SiN arms, which are connected to the element, and at second ends of the SiN arms, which are connected to the walls of the cavity, and the fiber interface is configured to receive the fibers through the fiber passthrough into positions for communications of light between the element and the fibers. In this way a robust structure that supports sensitivity of the sensor is provided.

具有有源偏移补偿的微机电传感器设备

本公开的实施例涉及具有有源偏移补偿的微机电传感器装置设备。一种具有感测结构的微机电传感器设备，具有：衬底；惯性质量件，被悬置在衬底之上，并且通过弹性耦合元件被弹性耦合到转子锚固结构，以执行由于待感测量而引起的至少一次惯性移动；第一感测电极，被整体地耦合到惯性质量件，以能够由于惯性移动而移动；以及第二感测电极，相对于待感测量而被固定，面向第一感测电极并且电容耦合到第一感测电极以形成具有指示待感测量的值的感测电容。第二感测电极以悬置方式被布置在衬底之上；以及补偿结构，被配置为将第二感测电极相对于第一感测电极移动，并且在没有待感测量的情况下，改变第二感测电极和第一感测电极之间的面对距离，以便补偿感测结构的本体偏移。

微机械构件的执行装置，微机械构件以及用于制造微机械构件的方法

本发明提供微机械构件（2）的执行装置（1），包括：悬挂架（3）；具有弹簧材料（FM）的多个弯曲梁（4），其中弯曲梁（4）分别与悬挂架（3）机械连接并且横向地从该悬挂架延伸出去；多个致动装置（4a），其中致动装置（4a）与弯曲梁（4）机械连接；环形元件（5）或者框架元件，环形元件或者框架元件与弯曲梁（4）机械连接，并且与悬挂架（3）横向地间隔开，并且具有比所述弯曲梁（4）小的可弯曲性；多个弹簧元件（6），所述弹簧元件与所述环形元件（5）机械连接并且从在背离所述悬挂架（3）的侧上从所述环形元件（5）横向地延伸出去；以及待移动的中央段（7），其中弹簧元件（6）使中央段（7）与环形元件（5）机械连接。

Verringerung des offsets eines beschleunigungsaufnehmers

可動素子

サブミクロンレベルの小型化、動作の高速化、製造工程の簡素化、低廉化、高信頼性化を同時に可能とする可動素子。基板上にそれぞれ固定された下部電極および基礎導電層と、該基礎導電層上に下端を固定されて立つカーボンナノチューブの弾性軸と、該下部電極から間隔を空けて該弾性軸の上端に固定された上部電極を含む上部構造体とを含む基本構造を備え、該下部電極と該上部電極の間に電圧印加した際に、これら両電極間に作用するクーロン力により、該弾性軸の弾性変形の許容範囲内で、該上部電極が該下部電極に対して変位する可動素子。同じ基本構造を備え、（１）該カーボンナノチューブの弾性変形の許容範囲内において該上部構造体が加速度の作用により該下部電極に対して変位する際に、該加速度を該変位による上記両電極間の静電容量の変化として出力する加速度センサーとしての可動素子、および、（２）該上部電極上に付加された外来質量を、該カーボンナノチューブの弾性変形の許容範囲内における該上部電極の該下部電極に対する振動の共振周波数の変化として出力する質量センサーとしての可動素子。

具有覆蓋驅動之mems及其操作方法

本案提供一種MEMS裝置，其包括一層堆疊，該層堆疊具有沿著一層堆疊方向配置之多個MEMS層。該MEMS裝置包括一可移動元件，該可移動元件形成於一第一MEMS層中且安置於該層堆疊之一第二MEMS層與一第三MEMS層之間。進一步提供一驅動單元，其包含以機械方式固定至該可移動元件之一第一驅動結構及以機械方式固定至該第二MEMS層之一第二驅動結構。驅動單元構件經調適以在可移動部件上產生垂直於該層堆疊方向之一驅動力，且該驅動力經調適以使該可移動部件偏轉。

MEMS with cover drive and method of operating the same

A MEMS device includes a layer stack having a plurality of MEMS layers arranged along a layer stack direction. The MEMS device includes a movable element formed in a first MEMS layer and arranged between a second MEMS layer and a third MEMS layer of the layer stack. A driving unit is further provided, comprising a first drive structure mechanically firmly connected to the movable element and a second drive structure mechanically firmly connected to the second MEMS layer. The driving unit is configured to generate on the movable member a drive force perpendicular to the layer stack direction, and the drive force is configured to deflect the movable member.

MEMS Actuation System

A multi-axis MEMS assembly includes: a micro-electrical-mechanical system (MEMS) actuator configured to provide linear three-axis movement, the micro-electrical-mechanical system (MEMS) actuator including: an in-plane MEMS actuator, and an out-of-plane MEMS actuator including a multi-morph piezoelectric actuator; an optoelectronic device coupled to the in-plane MEMS actuator; and a lens barrel assembly coupled to the out-of-plane MEMS actuator.

抗震的mems致动器结构

公开了抗震MEMS结构。在一个实施方式中，用于MEMS装置的运动控制挠曲件包括：包括第一端部和第二端部的杆，其中杆沿其长度逐渐变细，使得杆在其中心处最宽并且在其端部处最薄；直接连接到杆的第一端部的第一铰链；以及直接连接到杆的第二端部的第二铰链。在另一实施方式中，用于MEMS装置的导电悬臂包括：弯曲的中心部分，其包括第一端部和第二端部，其中中心部分具有拐点；连接到中心部分的第一端部的第一根部；以及连接到中心部分的第二端部的第二根部。在又一个实施方式中，描述了用于MEMS装置的震动止动件。

Ｍｅｍｓ素子及びそれを用いた光学装置

ＭＥＭＳ素子は、基板２００と、基板２００に設けられた固定部２と、固定部に設けられた第１及び第２アクチュエータ３，４と、第１及び第２アクチュエータ３，４に連結された被駆動部材７と、固定部２に設けられた第３アクチュエータ９と、第３アクチュエータに連結された規制部材１０と、を有している。第１及び第２アクチュエータ３，４は被駆動部材７を基板２００の上面に平行もしくは交差する方向に駆動させ、第３アクチュエータ９は規制部材１０を被駆動部材７の移動方向と交差する方向に駆動して被駆動部材７の移動面内に位置させることで、規制部材１０が被駆動部材７の変位を規制する。

Mems管芯和基于mems的振动传感器

本发明涉及MEMS管芯和基于MEMS的振动传感器。振动传感器/加速度计在各种实现中包括：MEMS管芯，该MEMS管芯包括具有孔的板；锚固件，该锚固件设置在孔内；多个臂(例如，刚性臂)，所述多个臂从所述锚固件起延伸；以及多个弹性构件(例如，具有精心设计的弹簧刚度的环形弹簧或折叠弹簧)，各个弹性构件将板连接至所述多个臂中的一个臂。该板可以由固体层制成，其中，弹性构件是从该固体层蚀刻的。MEMS管芯还可以包括顶部晶片和底部晶片以及行程止动件，该行程止动件从顶部晶片和底部晶片起延伸并且贯穿所述板。

Mikromechanische kammstruktur aus glas sowie zugehöriges verfahren und verwendung

Zur Ausweitung der Anwendungsmöglichkeiten des vorbekannten LIDE (laser induced deep etching) Verfahrens wird vorgeschlagen, eine mikromechanische Kammstruktur (25) durch Setzen von einer Vielzahl von Laserpulsen (4) auf einem Glas-Substrat (3) mit nachfolgendem nasschemischen Ätzschritt zum Freilegen der Kammstruktur (25) herzustellen und dabei die Lage derjenigen Laserpulse (4) genau zu kontrollieren, die die äußere Kontur (6) von jeweiligen Fingern (24) der Kammstruktur (25) definieren. Dadurch wird es möglich, sehr schmale Finger (24) auszubilden, die gleichmäßig ausgebildete Seitenwände (13) aufweisen, wodurch sehr geringe Spaltmaße (35) und eine gleichmäßige elektrostatische Aktuierung der Kammstruktur (25) ermöglicht wird. Durch Kontrolle der Phasenlage φ und/oder des Ausmaßes des sidewall scalloping der Finger (24) ist es zudem möglich, die mechanischen Eigenschaften der Kammstruktur (25) günstig zu beeinflussen bzw. gezielt einzustellen.

完全に分離したマイクロコンポーネントを拘束するシステムおよび方法

完全に分離したマイクロコンポーネントを処理するための、基盤から完全に分離したマイクロコンポーネントを拘束するシステムおよび方法が開示される。好適な実施例は、完全に分離したマイクロコンポーネントをベース（例えば、別のマイクロコンポーネントまたは基盤）に拘束するシステムおよび方法が提供する。例えば、好適な実施例は、マイクロコンポーネントが完全にそのような基盤から分離するようにマイクロコンポーネントを基盤に拘束するために動作する拘束要素を提供する。従って、そのような拘束要素は、製造中にそのようなマイクロコンポーネントをその基盤から分離する間にマイクロコンポーネントをその基盤に保持するのに役立つ。従って、そのような拘束要素は、製造中にそのようなマイクロコンポーネントをその基盤から分離する間にマイクロコンポーネントをその基盤に保持するのに役立つ。加えて、好適な実施例は、マイクロコンポーネントの製造後の処理のために完全に分離したマイクロコンポーネントをベースに拘束するのに適合する拘束要素を提供する。完全に分離したマイクロコンポーネントの製造後の処理にさらに役立たせるために、好適な具体例がそこに拘束される一又は複数のマイクロコンポーネントを備える「パレット」として実施される。さらに、好適な具体例における拘束要素によれば、完全に分離したマイクロコンポーネントは、望まれたときにそのような拘束要素から解放されるが、その完全に分離したマイクロコンポーネントがそのような拘束要素から不用意にも分離しないようにできる。例えば、一例によれば、拘束要素は、完全に分離したマイクロコンポーネントをそのベースから解放するように移動可能な要素として実施される。

Low stiffness flexure

A flexure includes a support first end connected to a first frame; a support second end connected to a second frame; and a buckled section connecting the first support end to the second support end. The length of the flexure is substantially greater than its width, and the width of the flexure is substantially greater than its thickness. During operation, the flexure is maintained in a buckled state where the flexure's stiffness is significantly less than in the unbuckled state. In one implementation, a stage includes a flexure array joining a first frame and a second frame, where: the first frame and the second frame are substantially on a plane; the flexure array is substantially on the plane prior to buckling by the flexures of the flexure array; and the flexure array is bent substantially out of the plane after buckling by the flexures.

Monolithische membran aus glas, doppel-vertikalmembran-anordnung, mikromechanische federstruktur und zugehöriges herstellungsverfahren

Zur Erweiterung der Anwendungsmöglichkeiten von mikromechanischen Biegestrukturen 2 in Glas wird vorgeschlagen, quer zu einer Substratebene 5 eines Glassubstrats 3 verlaufende Vertikalmembrane 1 monolithisch in dem Glassubstrat 3 auszubilden, indem Blindlöcher 8 mithilfe einer laserinduzierten Modifikation des Glassubstrats 3 und einer nachfolgenden nasschemischen Ätzung angelegt werden. Hierdurch lassen sich nicht nur Biegestrukturen 2 innerhalb des Körpers 40 des Glassubstrat 3 anordnen, sondern auch Federstrukturen 19 sowie Festkörpergelenke 35 monolithisch, insbesondere in der Tiefe des Glassubstrats 3, ausbilden. Dies ermöglicht auch neuartige Aktuierungskonzepte in Glas.

Micromechanical arm array in micro-electromechanical system (mems) actuators

A micromechanical arm array is provided. The micromechanical arm array comprises: a plurality of micromechanical arms spaced from each other in a first horizontal direction and extending in a second horizontal direction, wherein each micromechanical arm comprises a protrusion at a top of each micromechanical arm and protruding upwardly in a vertical direction; a plurality of protection films, each protection film encapsulating one of the plurality of micromechanical arms; and a metal connection structure extending in the first horizontal direction. The metal connection structure comprises: a plurality of joint portions, each joint portion corresponding to and surrounding the protrusion of one of the plurality of micromechanical arms; and a plurality of connection portions extending in the first horizontal direction and connecting two neighboring joint portions.

微机电系统、微机电系统致动器及微机械臂阵列

提供一种微机电系统、微机电系统致动器及微机械臂阵列。该微机械臂阵列包含：在第一水平方向上彼此隔开且沿第二水平方向延伸的多个微机械臂，其中每一微机械臂包含位于每一微机械臂的顶部且在垂直方向向上突出的突起；多个保护膜，每一保护膜封装所述多个微机械臂之一；及沿第一水平方向延伸的金属连接结构。该金属连接结构包含：多个接合部，每一接合部对应且围绕所述多个微机械臂之一的突起；及沿第一水平方向延伸且连接两个相邻接合部的多个连接部。

MEMS actuation system

A multi-axis MEMS assembly includes: a micro-electrical-mechanical system (MEMS) actuator configured to provide linear three-axis movement, the micro-electrical-mechanical system (MEMS) actuator including: an in-plane MEMS actuator, and an out-of-plane MEMS actuator; and an optoelectronic device coupled to the micro-electrical-mechanical system (MEMS) actuator; wherein the in-plane MEMS actuator includes an electromagnetic actuator portion.

Mikromechanische kammstruktur aus glas sowie zugehöriges verfahren und verwendung

Zur Ausweitung der Anwendungsmöglichkeiten des vorbekannten LIDE (laser induced deep etching) Verfahrens wird vorgeschlagen, eine mikromechanische Kammstruktur (25) durch Setzen von einer Vielzahl von Laserpulsen (4) auf einem Glas-Substrat (3) mit nachfolgendem nasschemischen Ätzschritt zum Freilegen der Kammstruktur (25) herzustellen und dabei die Lage derjenigen Laserpulse (4) genau zu kontrollieren, die die äußere Kontur (6) von jeweiligen Fingern (24) der Kammstruktur (25) definieren. Dadurch wird es möglich, sehr schmale Finger (24) auszubilden, die gleichmäßig ausgebildete Seitenwände (13) aufweisen, wodurch sehr geringe Spaltmaße (35) und eine gleichmäßige elektrostatische Aktuierung der Kammstruktur (25) ermöglicht wird. Durch Kontrolle der Phasenlage φ und/oder des Ausmaßes des sidewall scalloping der Finger (24) ist es zudem möglich, die mechanischen Eigenschaften der Kammstruktur (25) günstig zu beeinflussen bzw. gezielt einzustellen.

微机电传感器设备

本公开的实施例涉及微机电传感器设备。一种具有感测结构的微机电传感器设备，具有：衬底；惯性质量件，被悬置在衬底之上，并且通过弹性耦合元件被弹性耦合到转子锚固结构，以执行由于待感测量而引起的至少一次惯性移动；第一感测电极，被整体地耦合到惯性质量件，以能够由于惯性移动而移动；以及第二感测电极，相对于待感测量而被固定，面向第一感测电极并且电容耦合到第一感测电极以形成具有指示待感测量的值的感测电容。第二感测电极以悬置方式被布置在衬底之上；以及补偿结构，被配置为将第二感测电极相对于第一感测电极移动，并且在没有待感测量的情况下，改变第二感测电极和第一感测电极之间的面对距离，以便补偿感测结构的本体偏移。

具有增加的可偏转性的mems致动器、特别是微镜

本发明涉及一种MEMS致动器，其包括框架结构和至少一个致动器臂。致动器臂在第一端连接到框架结构并且在第二端连接到致动器本体。MEMS致动器的特征在于至少一个致动器臂具有包括两个或更多个致动器部分的曲折结构。两个或更多个致动器部分基本上垂直于致动器臂的纵向轴线定向。此外，两个或更多个致动器部分包括至少一层致动器材料，其中致动器本体的移动可以通过致动两个或更多个致动器部分来实现。此外，本发明涉及一种用于生产根据本发明的MEMS致动器的方法。

具有覆盖驱动的mems及其操作方法

一种MEMS装置包括层堆栈，该层堆栈具有沿着层堆栈方向布置之多个MEMS层。该MEMS装置包括可移动组件，该可移动组件形成于第一MEMS层中且布置于该层堆栈之第二MEMS层与第三MEMS层之间。进一步提供驱动单元，其包含以机械方式固定连接至该可移动组件之第一驱动结构及以机械方式固定连接至该第二MEMS层之第二驱动结构。驱动单元被配置为在可移动部件上产生垂直于该层堆栈方向之驱动力，且该驱动力被配置为使该可移动部件偏转。

微机电系统mems管芯和振动传感器

本实用新型涉及微机电系统MEMS管芯和振动传感器。振动传感器/加速度计在各种实现中包括：MEMS管芯，该MEMS管芯包括具有孔的板；锚固件，该锚固件设置在孔内；多个臂(例如，刚性臂)，所述多个臂从所述锚固件起延伸；以及多个弹性构件(例如，具有精心设计的弹簧刚度的环形弹簧或折叠弹簧)，各个弹性构件将板连接至所述多个臂中的一个臂。该板可以由固体层制成，其中，弹性构件是从该固体层蚀刻的。MEMS管芯还可以包括顶部晶片和底部晶片以及行程止动件，该行程止动件从顶部晶片和底部晶片起延伸并且贯穿所述板。

System and method for constraining totally released microcomponents

A system and method are disclosed which constrain a microcomponent that is totally released from a substrate for handling of such totally released microcomponent. A preferred embodiment provides constraining members that work to constrain a microcomponent to a substrate as such microcomponent is totally released from such substrate. Accordingly, such constraining members may aid in preserving the microcomponent with its substrate during the release of such microcomponent from its substrate during fabrication. Additionally, a preferred embodiment provides constraining members that are suitable for constraining a totally released microcomponent to a base for post-fabrication handling of the microcomponent. To further aid in post-fabrication handling of totally released microcomponents, a preferred embodiment may be implemented as a 'pallet' having one or more microcomponents constrained thereto. Moreover, constraining members of a preferred embodiment enable the totally released microcomponent to be removed from such constraints when desired, but prevents the totally released microcomponent from inadvertently escaping such constraints.

对完全获释的微元件进行约束的系统和方法

本发明公开一种对与一衬底完全脱离的微元件进行约束的系统和方法，对完全获释微元件进行处理。其设置了一些约束构件，构件能将微元件约束到衬底上，微元件就是从衬底上完全脱离出来的。在制造过程中，约束构件有助于在微元件从其衬底相分离时将微元件保持在衬底上。另外，其还可设置一些约束构件，适于将完全获释微元件约束到基底上，在微元件的制造完全之后对其处理。为了能进一步便于对完全获释微元件制出后处理，可将一优选实施例设计成“托盘”的形式，其上约束着一个或多个微元件。另外，一优选实施例中的约束构件能使得完全获释的微元件在需要时能脱离所述的约束件，但却能防止完全获释的微元件在无意中脱离所述约束件。

Vorrichtung und verfahren zur befestigung von völlig befreiten mikrobauteilen

System and method for constraining totally released microcomponents

A system and method are disclosed which constrain a microcomponent that is totally released from a substrate for handling of such totally released microcomponent. A preferred embodiment provides a system and method which constrain a totally released microcomponent to a base (e.g., another microcomponent or a substrate). For example, a preferred embodiment provides constraining members that work to constrain a microcomponent to a substrate as such microcomponent is totally released from such substrate. Accordingly, such constraining members may aid in preserving the microcomponent with its substrate during the release of such microcomponent from its substrate during fabrication. Additionally, a preferred embodiment provides constraining members that are suitable for constraining a totally released microcomponent to a base for post-fabrication handling of the microcomponent. To further aid in post-fabrication handling of totally released microcomponents, a preferred embodiment may be implemented as a "pallet" having one or more microcomponents constrained thereto. Moreover, constraining members of a preferred embodiment enable the totally released microcomponent to be removed from such constraints when desired, but prevents the totally released microcomponent from inadvertently escaping such constraints. For instance, in one embodiment, the constraining members are implemented as moveable members that can be moved to unconstrain the totally released microcomponent from its base.

低スチフネス曲げ部

曲げ部が、第１のフレームにつながれる第１の支持端部と、第２のフレームにつながれる第２の支持端部と、第１の支持端部と第２の支持端部とをつなぐ座屈部と、を含む。曲げ部は、長さが幅よりかなり大きく、幅が厚さよりかなり大きい。動作時には、曲げ部は座屈状態で維持され、このとき、曲げ部のスチフネスは非座屈状態のときよりかなり小さい。一実施態様では、ステージが、第１のフレームと第２のフレームとをつなぐ曲げ部アレイを含み、第１のフレーム及び第２のフレームは実質的に一平面上にあり、曲げ部アレイは、曲げ部アレイの曲げ部が座屈する前には、実質的にその平面上にあり、曲げ部アレイは、曲げ部が座屈した後は、実質的にその平面から外に曲がる。

Drehfederelement

Mems element and vibration-driven energy harvesting device

A MEMS element includes: a base; a fixed electrode having a plurality of fixed comb teeth, a fixed electrode pad and a support fastening portion; and a movable electrode having a plurality of movable comb teeth which are interdigitated with the fixed comb teeth, wherein: the support fastening portion includes a comb tooth linking portion that links the plurality of fixed comb teeth; and a portion of the base, which would face opposite at least part of the comb tooth linking portion over an entire length running along a direction perpendicular to a direction in which the plurality of fixed comb teeth are set one after another, is removed.

MEMS inertial sensor with high resilience to the phenomenon of stiction

A MEMS inertial sensor includes a supporting structure and an inertial structure. The inertial structure includes at least one inertial mass, an elastic structure, and a stopper structure. The elastic structure is mechanically coupled to the inertial mass and to the supporting structure so as to enable a movement of the inertial mass in a direction parallel to a first direction, when the supporting structure is subjected to an acceleration parallel to the first direction. The stopper structure is fixed with respect to the supporting structure and includes at least one primary stopper element and one secondary stopper element. If the acceleration exceeds a first threshold value, the inertial mass abuts against the primary stopper element and subsequently rotates about an axis of rotation defined by the primary stopper element. If the acceleration exceeds a second threshold value, rotation of the inertial mass terminates when the inertial mass abuts against the secondary stopper element.

Mems, verfahren zum herstellen eines mems und verfahren zum auslegen eines mems

Ein MEMS umfasst ein Substrat und eine in dem Substrat angeordnete Kavität. In der Kavität ist ein bewegliches Element angeordnet, das ausgebildet ist, um mit einem in der Kavität angeordneten Fluid zu interagieren, wobei eine Bewegung des Fluids und eine Bewegung des beweglichen Elements kausal zusammenhängen. Eine erste Öffnung, die die Kavität mit einer Umgebung des Substrats verbindet, bewirkt einen ersten Phasenversatz einer ersten mit der Bewegung des beweglichen Elements kausal zusammenhängenden periodischen Oszillation beim Durchqueren der ersten Öffnung. Eine zweite Öffnung, die die Kavität mit der Umgebung des Substrats verbindet, bewirkt einen von dem ersten Phasenversatz verschiedenen zweiten Phasenversatz einer zweiten mit der Bewegung des beweglichen Elements kausal zusammenhängenden periodischen Oszillation beim Durchqueren der zweiten Öffnung.

Mems, method of manufacturing an mems and method of configuring an mems

An MEMS has a substrate and a cavity arranged in the substrate. A movable element is arranged in the cavity, configured to interact with a fluid arranged in the cavity, wherein a movement of the fluid and a movement of the movable element are causally related. A first opening which connects the cavity to an environment of the substrate causes a first phase offset of a first periodic oscillation which is causally related to the movement of the movable element when passing through the first opening. A second opening which connects the cavity to the environment of the substrate causes a second phase offset, different from the first phase offset, of a second periodic oscillation which is causally related to the movement of the movable element when passing through the second opening.

Monolithische membran aus glas, doppel-vertikalmembran-anordnung, mikromechanische federstruktur und zugehöriges herstellungsverfahren

Zur Erweiterung der Anwendungsmöglichkeiten von mikromechanischen Biegestrukturen 2 in Glas wird vorgeschlagen, quer zu einer Substratebene 5 eines Glassubstrats 3 verlaufende Vertikalmembrane 1 monolithisch in dem Glassubstrat 3 auszubilden, indem Blindlöcher 8 mithilfe einer laserinduzierten Modifikation des Glassubstrats 3 und einer nachfolgenden nasschemischen Ätzung angelegt werden. Hierdurch lassen sich nicht nur Biegestrukturen 2 innerhalb des Körpers 40 des Glassubstrat 3 anordnen, sondern auch Federstrukturen 19 sowie Festkörpergelenke 35 monolithisch, insbesondere in der Tiefe des Glassubstrats 3, ausbilden. Dies ermöglicht auch neuartige Aktuierungskonzepte in Glas.

Mems-aktuator, insbesondere mikrospiegel, mit erhöhter auslenkbarkeit

Die Erfindung betrifft einen MEMS-Aktuator umfassend eine Rahmenstruktur und mindestens einen Aktuatorarm. Der Aktuatorarm ist an einem ersten Ende mit der Rahmenstruktur und an einem zweiten Ende mit einem Aktuatorkörper verbunden. Der MEMS-Aktuator zeichnet sich dadurch aus, dass der mindestens eine Aktuatorarm eine Mäanderstruktur umfassend zwei oder mehr Aktuatorabschnitte aufweist. Die zwei oder mehr Aktuatorabschnitte sind im Wesentlichen senkrecht zur Längsachse des Aktuatorarms ausgerichtet. Des Weiteren umfassen die zwei oder mehr Aktuatorabschnitte mindestens eine Lage aus einem Aktuatormaterial, wobei durch eine Ansteuerung der zwei oder mehr Aktuatorabschnitte eine Bewegung des Aktuatorkörpers bewirkbar ist.Weiterhin betrifft die Erfindung ein Verfahren zur Herstellung des erfindungsgemäßen MEMS-Aktuators.

저강성 플렉셔

플렉셔는 제1 프레임에 연결되는 제1 지지단과; 제2 프레임에 연결되는 제2 지지단과; 그리고 제1 지지단과 제2 지지단을 연결하는 좌굴부를 포함한다. 플렉셔의 길이는 그 폭보다 상당히 크고, 플렉셔의 폭은 그 두께보다 상당히 크다. 작동 중, 플렉셔는 플렉셔의 강성이 좌굴되지 않은 상태보다 현저히 작은 좌굴 상태로 유지된다. 한 구현예에서, 제1 프레임과 제2 프레임을 결합하는 플렉셔 행렬을 포함하는 스테이지는, 제1 프레임과 제2 프레임이 대략 한 평면에 위치하고, 플렉셔 행렬은 플렉셔 행렬의 플렉셔에 의한 좌굴 전에는 대략 한 평면에 있다가, 플렉셔들에 의한 좌굴 후에는 대략 평면 밖으로 휜다.

Micromechanical arm array in micro-electromechanical system (MEMS) actuators

A micromechanical arm array is provided. The micromechanical arm array comprises: a plurality of micromechanical arms spaced from each other in a first horizontal direction and extending in a second horizontal direction, wherein each micromechanical arm comprises a protrusion at a top of each micromechanical arm and protruding upwardly in a vertical direction; a plurality of protection films, each protection film encapsulating one of the plurality of micromechanical arms; and a metal connection structure extending in the first horizontal direction. The metal connection structure comprises: a plurality of joint portions, each joint portion corresponding to and surrounding the protrusion of one of the plurality of micromechanical arms; and a plurality of connection portions extending in the first horizontal direction and connecting two neighboring joint portions.

Procedimento di fabbricazione di un dispositivo micro-elettro-meccanico a partire da una singola fetta semiconduttiva e relativo dispositivo mems

Torsion spring element

Torsion spring element