ЦЕЛЬНАЯ ПОЛАЯ МИКРОМЕХАНИЧЕСКАЯ ДЕТАЛЬ С НЕСКОЛЬКИМИ ФУНКЦИОНАЛЬНЫМИ УРОВНЯМИ, ОБРАЗОВАННАЯ ИЗ МАТЕРИАЛА НА ОСНОВЕ АЛЛОТРОПА СИНТЕТИЧЕСКОГО УГЛЕРОДА

Изобретение относится к способу изготовления микромеханической детали, изготавливаемой из цельного материала на основе аллотропа синтетического углерода, при этом способ содержит этап образования подложки с негативной полостью для микромеханической детали, подлежащей изготовлению, этап нанесения покрытия на негативную полость подложки в виде слоя материала на основе аллотропа синтетического углерода, толщина которого меньше глубины негативной полости, и этап удаления подложки для освобождения цельной микромеханической детали, образованной в вышеуказанной негативной полости. 3 н. и 16 з.п. ф-лы, 27 ил.

Herstellungsverfahren für Mikrokomponenten

Herstellungsverfahren für eine Mikrokomponente, das die folgenden Schritte aufweist: einen Harzbasisformschritt zum Formen einer Harzbasis, die mit einem Lösungsmittel aufgelöst werden kann; einen Höhlungsformschritt mit Einwirkung einer äußeren physikalischen Kraft auf die Harzbasis und Formen einer Höhlung mit einer Form, die der Form einer herzustellenden Mikrokomponente entspricht; einen Metalleinfüllschritt zum Einfüllen eines Metalls in die Höhlung; einen Metallentfernungsschritt zum Schleifen und Entfernen überschüssigen Metalls; und einen Basisauflösungsschritt zum Auflösen der Harzbasis unter Verwendung eines Lösungsmittels.

CARRIER FOR MICRO FLUID SYSTEM AND MANUFACTURING PROCESS FOR IT

PROCEDURE FOR THE EXAMINATION OF THE TIGHTNESS OF A HERMETICALLY SEALED MICROMECHANICAL ELEMENT AND SO SEARCHING ELEMENT

CARRIER UNIT FOR A MICRO-FLUID SYSTEM

CARRIER UNIT FOR A MICRO-FLUID SYSTEM

Micromechanical part hollow, multi-functional levels and one-piece from a material based on synthetic of an allotrope of carbon.

Linvention se rapporte à un procédé de fabrication dune pièce de micromécanique en un matériau (15, 17) monobloc à base dun allotrope synthétique du carbone caractérisé en ce quil comporte les étapes suivantes: a) former un substrat (1) comportant sur au moins deux niveaux (N 1 , N 2 ) une empreinte (3) négative de ladite pièce de micromécanique à fabriquer; b) recouvrir ladite empreinte (3) négative du substrat (1) dune couche dudit matériau à base dun allotrope synthétique du carbone dune épaisseur (e 1 ) inférieure à la profondeur de chacun desdits au moins deux niveaux (N 1 , N 2 ) de ladite empreinte; c) retirer le substrat (1) afin de laisser libre la pièce de micromécanique monobloc formée dans ladite empreinte négative. Linvention se rapporte également à une pièce de micromécanique obtenue à partir du procédé de linvention, ainsi quà des pièces dhorlogerie incluant une telle pièce de micromécanique.

Method for manufacturing components timekeeping silicon.

Le procédé selon l’invention comprend les étapes suivantes: a) se munir d’un substrat (1) comprenant une première couche de silicium (2), une deuxième couche de silicium (3) et, entre les deux, une couche intermédiaire d’oxyde de silicium (4); b) graver la première couche de silicium (2) afin d’y former les composants horlogers; c) libérer du substrat (1) une plaquette (8) formée par au moins tout ou partie de la première couche de silicium (2) gravée et comprenant les composants horlogers; d) oxyder thermiquement puis désoxyder les composants horlogers; e) former par oxydation thermique ou dépôt une couche d’oxyde de silicium sur les composants horlogers; f) détacher les composants horlogers de la plaquette (8).

Composition, particulate materials and methods for making particulate materials

Wafer inspection method Wafer and wafer

Wafer inspection method and wafer

A wafer comprises a substrate layer, a first mirror layer having a plurality of two-dimensionally arranged first mirror parts, and a second mirror layer having a plurality of two-dimensionally arranged second mirror parts. A gap is formed between the first mirror parts and the second mirror parts to thereby constitute a plurality of Fabry-Perot interference filter parts. A wafer inspection method according to an embodiment includes a step of determining the quality of each of the plurality of Fabry-Perot interference filter parts, and a step of applying ink to at least a part of the portion of the second mirror layer in the Fabry-Perot interference filter part determined to be defective that overlaps the gap as seen from the direction opposite the second mirror layer.

Micro fluid system support unit and manufacturing method thereof

A micro fluid system support unit in accordance with the present invention includes a first support body (2), a first adhesive layer (1a) arranged on the surface of the first support body (2), a first hollow filament group consisting of a plurality of hollow filaments (501-508) arranged with an arbitrary shape on the surface of the first adhesive layer (1a), a second hollow filament group consisting of a plurality of hollow filaments (511-518) arranged in the direction orthogonal to the first hollow filament group, a second adhesive layer (1b) arranged on the surface of the second hollow filament group, and a second support body (6) arranged on the surface of the second adhesive layer (1b). The first and the second hollow filament group constitute a flow passage layer.

Electrical conditioning of MEMS device and insulating layer thereof

A method of fabricating a MEMS device includes conditioning of an insulating layer by applying a voltage across the insulating layer via a conductive sacrificial layer for a period of time, prior to removal of the conductive sacrificial layer. This conditioning process may be used to saturate or stabilize charge accumulated within the insulating layer. The resistance across the insulating layer may also be measured to detect possible defects in the insulating layer.

PROCEDURE FOR THE PRODUCTION OF A GETTER MATERIAL ABSTENTION MICROMECHANICAL DEVICES AND SO MANUFACTURED DEVICES

MASTER FOR MICRO FLOW PATH CREATION, TRANSFER COPY, AND METHOD FOR PRODUCING MASTER FOR MICRO FLOW PATH CREATION

There is provided a master for micro flow path creation, a transfer copy, and a method for producing a master for micro flow path creation by which transfer copies having an area with high hydrophilicity can be easily mass-produced, the master for micro flow path creation including: a base material; a main concave-convex portion provided on a surface of the base material and extending in a planar direction of the base material; and a fine concave-convex portion provided on a surface of the main concave-convex portion and having a narrower pitch than the main concave-convex portion. The fine concave-convex portion has an arithmetic average roughness of 10 nm to 150 nm and has a specific surface area ratio of 1.1 to 3.0.

MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF

A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system.

ULTRA-LIGHT MICRO-LATTICES AND A METHOD FOR FORMING THE SAME

СПОСОБ ИЗГОТОВЛЕНИЯ МИКРОМЕХАНИЧЕСКИХ УСТРОЙСТВ, СОДЕРЖАЩИХ ГАЗОПОГЛОТИТЕЛЬНЫЙ МАТЕРИАЛ, И ИЗГОТОВЛЕНИЕ ЭТИМ СПОСОБОМ УСТРОЙСТВА

... 1. Способ изготовления микромеханических устройств, включающий в себя этап прямого соединения двух частей подложки, одна из которых (12, 20) сделана из кремния, и другая - из кремния или полупроводникового, керамического или окисного материала; причем функциональные элементы (11) и возможные вспомогательные элементы устройства присутствуют, по меньшей мере, на одной из этих частей подложки и покрытие (13, 24) из газопоглотительного материала присутствует на одной кремниевой части подложки; при этом способ включает в себя этапы, согласно которым: обеспечивают первую часть (10) подложки, на которой выполнены функциональные элементы (11) и возможные вспомогательные элементы устройства; обеспечивают вторую часть (20) подложки; причем упомянутые первая и вторая части подложки выполнены таким образом, что при их совмещении они образуют полость (14), в которой помещены упомянутые функциональные элементы, вспомогательные элементы и покрытие из газопоглотительного материала; сближают упомянутые ...

ЦЕЛЬНАЯ ПОЛАЯ МИКРОМЕХАНИЧЕСКАЯ ДЕТАЛЬ С НЕСКОЛЬКИМИ ФУНКЦИОНАЛЬНЫМИ УРОВНЯМИ, ОБРАЗОВАННАЯ ИЗ МАТЕРИАЛА НА ОСНОВЕ АЛЛОТРОПА СИНТЕТИЧЕСКОГО УГЛЕРОДА

VERFAHREN ZUR PRÜFUNG DER DICHTHEIT EINES HERMETISCH VERSIEGELTEN MIKROMECHANISCHEN ELEMENTS UND SO ZU PRÜFENDES ELEMENT

몰드의 제작 방법, 패턴 시트의 제조 방법, 전주 금형의 제작 방법, 및 전주 금형을 이용한 몰드의 제작 방법

... 몰드의 제작 방법은, 받침대(10C) 위의 패턴 존재 영역(10D)에 복수의 돌기부(12)로 형성된 돌기 형상 패턴(10A)을 갖는 원판(10), 및 열가소성 수지 시트(20)를 준비하고, 원판(10)과 열가소성 수지 시트(20)를 상대적으로 이동시켜, 원판(10)을 열가소성 수지 시트(20)에 압압하는 위치를 결정하며, 가열된 원판(10)의 돌기부(12)를, 원판(10)의 패턴 존재 영역(10D) 중 돌기부(12)를 제외한 부분과 열가소성 수지 시트(20)의 표면(20B)을 이간한 위치에서, 열가소성 수지 시트(20)에 압압하고, 압압한 돌기부(12)와 열가소성 시트(20)가 접촉한 상태에서 원판(10)을 냉각하며, 원판(10)과 열가소성 수지 시트(20)를 떼어내, 열가소성 수지 시트(20)에 오목 형상 패턴(20A)을 형성한다.

CARRIER UNIT FOR A MICRO-FLUID SYSTEM

CARRIER UNIT FOR A MICRO-FLUID SYSTEM

Process for manufacturing micromechanical devices containing a getter material and devices so manufactured

Method of fabricating microsphere using metal substrate with through hole

Solder material lining a cover wafer attached to wafer substrate

The invention relates to a cover wafer with a core and with an inside, whereby the inside has one or more annular outer areas, (an) annular area(s), which inwardly adjoin(s) the outer area(s), and has (a) inner area(s), and to a component cover with only one annular outer area on its inside. The invention is characterized in that at least area(s) has/have a buffer layer, which has a wetting angle of <35° for a metallic eutectic solution that melts in a range of >265° C. to 450° C. The invention also relates to a component cover having one of the areas which has said buffer layer in a comparable manner. The invention additionally relates to a wafer component or to a component, which can be inserted using microsystem technology and which has a cover wafer or component cover applied with the aid of a solder material, and to a method for the production thereof.

METHOD FOR NANO-DRIPPING 1D, 2D OR 3D STRUCTURES ON A SUBSTRATE

Process for manufacturing micromechanical devices containing a getter material and devices so manufactured

Method of checking the hermeticity of a closed cavity of a micrometric component and micrometric component for the implementation of the same

In order to check the hermeticity of a closed cavity of at least one micrometric component, said component includes a structure made over or in one portion of a substrate, a cap fixed to one zone of the substrate to protect the structure, and an indicator element whose optical or electrical properties change in the presence of a reactive fluid. The indicator element may be a copper layer for an optical check or a palladium resistor for an electrical check. The micrometric component is placed in a container which is then hermetically closed. This container is filled with a reactive fluid under pressure, which is oxygen for the optical check and hydrogen for the electrical check. The component in the container is subjected to a reactive fluid pressure higher than 10 bars for a determined time period, and to thermal (T>100° C.) or optical (<500 nm) activation. After this time period, an optical or electrical check of the indicator element determines the hermeticity of said cavity.

МИКРОМЕХАНИЧЕСКИЙ КОМПОНЕНТ И СПОСОБ ЕГО ИЗГОТОВЛЕНИЯ

Изобретение относится к микромеханическому, микроэлектромеханическому компоненту. Технический результат направлен на изготовления компонента, не требующего сложной производственной технологии, позволяющего надежно заключить в герметическую оболочку соответствующие активные структуры и вывести из компонента электрические контакты. Способ изготовления микромеханического, микроэлектромеханического или микрооптоэлектромеханического компонента, согласно которому: изготавливают первый слоистый композитный материал, имеющий первую подложку (2) и первый изолирующий слой (3), который покрывает по меньшей мере одну часть поверхности (1) первой подложки (2). Изготавливают второй слоистый композитный материал, содержащий вторую подложку (12) и второй изолирующий слой (14), который покрывает по меньшей мере одну часть поверхности (13) второй подложки (12). Наносят по меньшей мере частично проводящий структурный слой (7) на первый изолирующий слой (3). Наносят второй композитный материал на структурный ...

МИКРОМЕХАНИЧЕСКИЙ КОМПОНЕНТ И СПОСОБ ЕГО ИЗГОТОВЛЕНИЯ

... 1. Способ изготовления компонента, в частности микромеханического, микроэлектромеханического или микрооптоэлектромеханического компонента, согласно которому ! изготавливают первый слоистый композитный материал, имеющий первую подложку (2) и первый изолирующий слой (3), который покрывает по меньшей мере одну часть поверхности (1) первой подложки (2), ! изготавливают второй слоистый композитный материал, содержащий вторую подложку (12) и второй изолирующий слой (14), который покрывает по меньшей мере одну часть поверхности (13) второй подложки (12), ! наносят по меньшей мере частично проводящий структурный слой (7) на первый изолирующий слой (3), ! наносят второй композитный материал на структурный слой (7), так что второй изолирующий слой (14) примыкает к структурному слою (7), ! причем первый и второй слоистые композитные материалы, а также структурный слой (7) сконфигурированы таким образом, что по меньшей мере одна часть структурного слоя (7), которая содержит активную область (8) компонента ...

Micromechanical component and method for fabricating a micromechanical component

Micro-electro-mechanical systems (MEMS) device and method for forming a micro-electro-mechanical systems (MEMS) device

A micro-electro-mechanical systems (MEMS) device and method for forming a MEMS device is provided. A proof mass is suspended a distance above a surface of a substrate by a fulcrum. A pair of sensing plates is positioned on the substrate on opposing sides of the fulcrum. Metal bumps are associated with each sensing plate and positioned near a respective distal end of the proof mass. Each metal bump extends from the surface of the substrate and generally inhibits charge-induced stiction associated with the proof mass. Oxide bumps are associated with each of the pair of sensing plates and positioned between the respective sensing plate and the fulcrum. Each oxide bump extends from the first surface of the substrate a greater distance than the metal bumps and acts as a shock absorber by preventing the distal ends of the proof mass from contacting the metal bumps during shock loading.

Mikromechanisches Bauteil sowie Verfahren zur Herstellung eines mikromechanischen Bauteils

Ein Verfahren zum Herstellen eines mikro-elektromechanischen oder mikro-optoelektromechanischen Bauteils weist folgende Schritte auf: DOLLAR A - Erzeugen eines ersten Schichtverbunds, der ein erstes Substrat (2) und eine erste Isolationsschicht (3), die wenigstens einen Teil der Oberfläche (1) des ersten Substrats (2) bedeckt, aufweist, DOLLAR A - Erzeugen eines zweiten Schichtverbunds, der ein zweites Substrat (12) und eine zweite Isolationsschicht (14), die wenigstens einen Teil der Oberfläche (13) des zweiten Substrats (12) bedeckt, aufweist, DOLLAR A - Aufbringen einer zumindest teilweise leitfähigen Strukturschicht (7) auf die erste Isolationsschicht (3), DOLLAR A - Aufbringen des zweiten Verbunds auf die Strukturschicht (7), derart, dass die zweite Isolationsschicht (14) an die Strukturschicht (7) angrenzt, DOLLAR A - wobei der erste und zweite Schichtverbund sowie die Strukturschicht (7) so ausgestaltet sind, dass zumindest ein Teil der Strukturschicht (7), der das aktive Gebiet ...

Verfahren zur Herstellung eines mikromechanischen Bauteils

Verfahren zum Herstellen eines Bauteils, insbesondere eines mikromechanischen, mikro-elektromechanischen oder mikro-opto-elektromechanischen Bauteils, mit den folgenden Schritten: – Erzeugen eines ersten Schichtverbunds, der ein erstes Substrat (2) und eine erste Isolationsschicht (3), die wenigstens einen Teil der Oberfläche (1) des ersten Substrats (2) bedeckt, aufweist, – Erzeugen eines zweiten Schichtverbunds, der ein zweites Substrat (12) und eine zweite Isolationsschicht (14), die wenigstens einen Teil der Oberfläche (13) des zweiten Substrats (12) bedeckt, aufweist, – Erzeugen von ersten Vertiefungen (4) in der Oberfläche (1) des ersten Substrates (2), – Aufbringen einer zumindest teilweise leitfähigen Strukturschicht (7) auf den ersten Schichtverbund, wobei die Strukturschicht (7) auf der ersten Isolationsschicht (3) aufliegt und Bereiche des ersten Substrates (2), in denen die ersten Vertiefungen (4) erzeugt wurden, überdeckt, – Aufbringen des zweiten Verbunds auf die Strukturschicht ...

Method of positioning and removing small objects, esp. micro-technical components, requires vibrating the gripping device at a specified amplitude and frequency, in order to loosen the object from the gripper

A method for placing and removing very small objects (5) , such as micro-technical components in which the object is received by a transport element, such as a gripping device (1) and then placed at a target location, now overcomes the difficulties and time wasting associated with the object adhering to the transport element, particularly with spheres of diameters of about 500 mu m, sometimes for hours or even days as a result of the prevailing forces of adhesion. To make the object (5) drop from the gripping device (1) the latter is now made to vibrate, at more than 5 mu m and less than 50 mu m and at a frequency of 250 Hz.

Master for micro flow path creation, transfer copy, and method for producing master for micro flow path creation

Micromechanical component and method for fabricating a micromechanical component

Transcript apparatus

A transcript apparatus having a table 11 having a placement surface on which a forming material 13 is placed; a die holder 205, disposed in opposition to the table, to fixedly hold a transcription die 41; a first gimbal member 201 having one side to hold the die holder body and the other side formed with a convex spherical surface, a second gimbal member 203 formed with a concave spherical surface facing the convex spherical surface, the gimbal mechanism guiding ultraviolet rays therein; a movable body 19, holding the second gimbal member, that is movable in a vertical direction to the placement surface; attitude adjustment and holder means to adjust and hold an attitude of the first gimbal member; and an ultraviolet ray path to guide ultraviolet rays emitted from an ultraviolet ray generator 42 onto the forming material through the transcription die.

Method of checking the hermeticity of a closed cavity of a micrometric component and micrometric component for the implementation of the same

In order to check the hermeticity of a closed cavity of at least one micrometric component, said component includes a structure made over or in one portion of a substrate, a cap fixed to one zone of the substrate to protect the structure, and an indicator element whose optical or electrical properties change in the presence of a reactive fluid. The indicator element may be a copper layer for an optical check or a palladium resistor for an electrical check. The micrometric component is placed in a container which is then hermetically closed. This container is filled with a reactive fluid under pressure, which is oxygen for the optical check and hydrogen for the electrical check. The component in the container is subjected to a reactive fluid pressure higher than 10 bars for a determined time period, and to thermal (T>100° C.) or optical (<500 nm) activation. After this time period, an optical or electrical check of the indicator element determines the hermeticity of said cavity.

MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF

A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system.

Deckelwafer, in der Mikrosystemtechnik einsetzbares Bauelement mit einem solchen Wafer sowie Lötverfahren zum Verbinden entsprechender Bauelement-Teile

Deckelwafer mit einem Kern (1) und einer Innenseite, wobei die Innenseite einen ringförmigen Außenbereich (7), einen sich an den Außenbereich nach innen anschließenden ringförmigen Bereich sowie einen Innenbereich umfasst, dadurch gekennzeichnet, dass zumindest der sich nach innen anschließende ringförmige Bereich eine Pufferschicht (6) aufweist, die einen Benetzungwinkel von < 35° für ein metallisches Eutektikum aufweist, das im Bereich von > 265°C und 450°C schmilzt.

MTHOD OF PRODUCING MICRO COMPONENT

METHOD FOR NANO-DRIPPING 1D, 2D OR 3D STRUCTURES ON A SUBSTRATE

Extensions of self-assembled structures to increas

MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF

A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system.

PROCESS FOR MANUFACTURING MICROMECHANICAL DEVICES CONTAINING A GETTER MATERIAL AND DEVICES SO MANUFACTURED

A process for manufacturing micromechanical devices is described, said devices being formed by joining two parts together by direct bonding, one of the parts (12) being made of silicon and the other one being made of a material chosen between silicon and a semiconductor ceramic or oxidic material, such that the joint between the two parts forms a cavity (14) containing the functional elements of the device (11), possible auxiliary elements and a getter material deposit (13).

MICROMECHANICAL COMPONENT AND METHOD FOR FABRICATING A MICROMECHANICAL COMPONENT

A method for fabricating a microelectromechanical or microoptoelectromech anical component has the following steps: - Producing a first layer composit e having a first substrate (2) and a first insulating layer (3), which cover s at least part of the surface (1) of the first substrate (2), producing a s econd layer composite having a second substrate (12) and a second insulating layer (14) which covers at least part of the surface (13) of the second sub strate (12), applying an at least partially conductive structure layer (7) o nto the first insulating layer (3), applying the second composite onto the s tructure layer (7) such that the second insulating layer (14) adjoins the st ructure layer (7), - the first and second layer composites and the structure layer (7) being designed such that at least part of the structure layer (7) which contains the active area (8) of the microelectromechanical or microop toelectromechanical component is hermetically sealed tightly by the first an d second ...

Electrical inspection method

Methods and devices for fabricating three-dimensional nanoscale structures

METHOD OF CHECKING THE HERMETICITY OF A CLOSED CAVITY OF A MICROMETRIC COMPONENT AND MICROMETRIC COMPONENT FOR THE IMPLEMENTATION OF THE SAME

In order to check the hermeticity of a closed cavity of at least one micrometric component, said component includes a structure made over or in one portion of a substrate, a cap fixed to one zone of the substrate to protect the structure, and an indicator element whose optical or electrical properties change in the presence of a reactive fluid. The indicator element may be a copper layer for an optical check or a palladium resistor for an electrical check. The micrometric component is placed in a container which is then hermetically closed. This container is filled with a reactive fluid under pressure, which is oxygen for the optical check and hydrogen for the electrical check. The component in the container is subjected to a reactive fluid pressure higher than 10 bars for a determined time period, and to thermal (T>100° C.) or optical (<500 nm) activation. After this time period, an optical or electrical check of the indicator element determines the hermeticity of said cavity.

ONE-PIECE, HOLLOW MICROMECHANICAL PART WITH SEVERAL FUNCTIONAL LEVELS FORMED OF A SYNTHETIC CARBON ALLOTROPE BASED MATERIAL

A method for fabrication of a micromechanical part made of a one-piece synthetic carbon allotrope based material, the method including: forming a substrate with a negative cavity of the micromechanical part to be fabricated; coating the negative cavity of the substrate with a layer of the synthetic carbon allotrope based material in a smaller thickness than the depth of the negative cavity; and removing the substrate to release the one-piece micromechanical part formed in the negative cavity.

Master disc for manufacturing microflow channel, transfer product, and method for producing master disc for manufacturing microflow channel

Provided are: a master disc (1) for manufacturing microflow channels with which a transfer product with a highly hydrophilic region can be easily mass-produced; a transfer product; and a method for producing the master disc for manufacturing microflow channels. The master disc for manufacturing microflow channels is provided with: a substrate (10); main recesses and protrusions (11) that are provided on the surface of the substrate and extend in the direction of the plane of the substrate; and micro-recesses and micro-protrusions (14) that are provided on the surfaces of the main recesses and protrusions and have a narrower pitch than the main recesses and protrusions. The micro-recesses and micro-protrusions have an arithmetic mean roughness of 10 nm - 150 nm, and a relative surface area ratio of 1.1-3.0.

One-piece hollow micromechanical part having multiple functional levels and made of a material made from a synthetic allotrope of carbon

CLOSING BLADE FOR DEFORMABLE VALVE IN A MICROFLUIDIC DEVICE, AND METHOD

MEDICAL THREE-DIMENSIONAL STRUCTURE, PROCESS FOR PRODUCING THE SAME AND PRODUCTION APPARATUS

A medical three-dimensional structure comprised of a biocompatible biodegradable resin, which requires a resolution of 50 μm or less in molding. There is provided a process comprising filling a minute syringe with fine granules of a biocompatible biodegradable resin and melting the resin; forming one of two-dimensional slice layers by controlling the discharge of molten biodegradable resin through a nozzle and the plane-direction move of molding stage disposed opposite to the nozzle in accordance with the plane configuration data of a multiplicity of two-dimensional slice layers constituting a three-dimensional structure; effecting spacing movement of the molding stage in the longitudinal direction as much as the thickness of one of the two-dimensional slice layers; and thereafter repeating similar operations, thereby forming a three-dimensional structure. By this process, there can be provided an extremely fine medical three-dimensional structure comprised of a biocompatible biodegradable ...

Master disc for manufacturing microflow channel, transfer product, and method for producing master disc for manufacturing microflow channel

MICRO FLUID SYSTEM SUPPORT UNIT AND MANUFACTURING METHOD THEREOF

Process for manufacturing micromechanical devices containing a getter material and devices so manufactured

A process for manufacturing micromechanical devices is described, said devices being formed by joining two parts together by direct bonding, one of the parts (12) being made of silicon and the other one being made of a material chosen between silicon and a semiconductor ceramic or oxidic material, such that the joint between the two parts forms a cavity (14) containing the functional elements of the device (11), possible auxiliary elements and a getter material deposit (13).

PATTERNED SHEET PRODUCTION METHOD

Method of fabricating microsphere using metal substrate with through hole

The purpose of invention is to provides a method for manufacturing microspheres which is the solid or liquid microparticles utilized in food industry, pharmacy or cosmetics manufacturing etc. as emulsion, emulsion used in DDS(drug delivery system) etc.. The above purpose can be achieved by the method for manufacturing microspheres list below: the dispersed phase are separated with the continuous phase by the substrate 1 with through holes 7, and the dispersed phase is extruded into the continuous phase to form microspheres, characterized in that at least one substrate 1 made by metal, the width of the through holes 7 being 0.5~500 m, the depth of the through holes 7 being 10 m~6000 m, and the ratio of width to the depth of the through holes 7 being 1~1/30, is used.

POLYMER ACTUATOR AND METHOD FOR PRODUCING SAME

Disclosed is a polymer actuator using ionization which has a large displacement magnitude and a large generative power. A polymer solution is spun by the electrospinning method to form a fiber layer composed of layered fibers. The fiber layer is impregnated with an ionic solution to form an ion conductive layer (2). A first electrode layer (3) and a second electrode layer (4), each containing a polymer, an ionic liquid and a carbon nanofiber, are formed and layered on the surface on both sides of the ion conductive layer (2). Since the fiber layer has many voids in the inside thereof and, therefore, the ionic liquid can easily penetrate therein, when a voltage is applied between the first electrode layer (3) and the second electrode layer (4), a large displacement magnitude arises due to the curvature and, as a result, a large power is generated.

TRÄGER FÜR MIKROFLUIDSYSTEM UND HERSTELLUNGSVERFAHREN DAFÜR

Extensions of self-assembled structures to increased dimensions via a bootstrap self-templating method

Methods for fabricating sublithographic, nanoscale arrays of openings and linear microchannels utilizing self-assembling block copolymers, and films and devices formed from these methods are provided. Embodiments of the invention use a self-templating or multilayer approach to induce ordering of a self-assembling block copolymer film to an underlying base film to produce a multilayered film having an ordered array of nanostructures that can be removed to provide openings in the film which, in some embodiments, can be used as a template or mask to etch openings in an underlying material layer.

Three-axis excitation device for MEMS microstructure dynamic characteristic test

Electrical inspection method

An electrical inspection method that comprises: a step for preparing a wafer on which are formed a plurality of Fabry-Perot interference filter parts at which the distance between facing first mirror parts and second mirror parts changes due to electrostatic force; and a step for inspecting the electrical characteristics of each of the plurality of Fabry-Perot interference filter parts.

MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF

A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system.

Composition, particulate materials and methods for making particulate materials.

Particulate material comprising rough mesoporous hollow nanoparticles. The rough mesoporous hollow nanoparticles may comprise a mesoporous shell, the external surface of which has projections thereon, the projections having smaller sizes than the particle size. The particulate material may be used to deliver active agents, such as insecticides and pesticides. The active agents can enter into the hollow core of the particles and be protected from degradation by sunlight. The rough surface of the particles retains the particles on plant leaves or animal hair. Methods for forming the particles are also described. Carbon particles and methods for forming carbon particles are also described.

Method for nano-dripping 1D, 2D, 3D structures on a substrate

A method for the production of nano- or microscaled 1D, 2D and/or 3D depositions from an solution (6), by means of a liquid reservoir (2) for holding the ink with an outer diameter (3,D) of at least 50 nm, is proposed, wherein there is provided an electrode (7,8 or 9) in contact with said ink (6) in said capillary (2), and wherein there is a counter electrode in and/or on and/or below and/or above a substrate (15) onto which the depositions are to be produced, including the steps of: i) keeping the electrode (7, 8, 9) and the counter electrode (15, 18) on an essentially equal potential; ii) establishing a potential difference between the electrode (7, 8, 9) and the counter electrode (15, 18) leading to the growth of an ink meniscus (11) at the nozzle (3) and to the ejection of droplets (13) at this meniscus with a homogeneous size smaller than the meniscus size (11) at a homogenous ejection frequency; keeping the voltage applied while the continuously dried droplets leave behind the dispersed ...

Method of producing micro component

To produce a micro component, a resin base ( 1 ) capable of being dissolved by a solvent is formed, physical external force is allowed to act on the resin base ( 1 ) to form a concave ( 3 ) and after a metal is filled into the concave ( 3 ), an excessive metal is removed by grinding and the resin base ( 1 ) is dissolved by the solvent. Consequently, the necessity for lithography apparatuses such as a stepper and an etching apparatus can be eliminated, economy can be improved and production of components having complicated shapes that the lithographic technology cannot easily produce can also be produced.

Method Of Checking The Hermeticity Of A Closed Cavity Of A Micrometric Component And Micrometric Component For The Implementation Of Same

In order to check the hermeticity of a closed cavity of at least one micrometric component, said component includes a structure made over or in one portion of a substrate, a cap fixed to one zone of the substrate to protect the structure, and an indicator element whose optical or electrical properties change in the presence of a reactive fluid. The indicator element may be a copper layer for an optical check or a palladium resistor for an electrical check. The micrometric component is placed in a container which is then hermetically closed. This container is filled with a reactive fluid under pressure, which is oxygen for the optical check and hydrogen for the electrical check. The component in the container is subjected to a reactive fluid pressure higher than 10 bars for a determined time period, and to thermal (T>100° C.) or optical (lambda<500 nm) activation. After this time period, an optical or electrical check of the indicator element determines the hermeticity of said cavity.

Process for manufacturing micromechanical devices containing a getter material and devices so manufactured

A process for manufacturing micromechanical devices is described, said devices being formed by joining two parts together by direct bonding, one of the parts (12) being made of silicon and the other one being made of a material chosen between silicon and a semiconductor ceramic or oxidic material, such that the joint between the two parts forms a cavity (14) containing the functional elements of the device (11), possible auxiliary elements and a getter material deposit (13).

Method for manufacturing mold, method for manufacturing, master mold, method, for manufacturing master mold, and method for manufacturing mold using electroforming die

ULTRA-LIGHT MICRO-LATTICES AND A METHOD FOR FORMING THE SAME

The present invention relates to a micro-lattice and, more particularly, to an ultra-light micro-lattice and a method for forming the same. The micro is a cellular material, formed of interconnected hollow tubes, The cellular material has a relative density in range of 0,001 % to 0,3%, and a density of 0,9 mg/cc has been demonstrated. The cellular material also has the ability to recover from a deformation exceeding 50% strain ...

CLOSING BLADE FOR DEFORMABLE VALVE IN A MICROFLUIDIC DEVICE, AND METHOD

A microfluidic manipulation system is provided that includes a blade for manipulating deformable material and at least one movable support that is capable of moving the blade into contact with a microfluidic device including a deformable feature. When the microfluidic device is operatively held by a holder, a movable support can position the distal end of the blade relative to the microfluidic device and move the contact tip surface of the blade such that it deforms the deformable feature.

Methods and devices for fabricating three-dimensional nanoscale structures

Cutting tool using interrupted cut fast tool servo

A cutting tool assembly having a tool post capable of lateral movement along a work piece to be cut and an actuator with a tool tip. The actuator provides for control of the movement of the tool tip in an x-direction into and out of the work piece in order to make discontinuous microstructures in it. The machined work piece can be used to make microstructured articles such as films having non-adjacent lenslets.

Elektrokinetische Mikroleistungszelle, die einen Mikrofluidchip des Mehrfachkanaltyps verwendet

Die Erfindung betrifft eine neue Mikroleistungszelle, die den Mikrofluidchip vom Mehrfachkanaltyp anwendet. Das Strömungspotential ist der Hauptschub, der durch das elektrokinetische Prinzip von Helmholtz-Soluchowski erzeugt wird, wenn eine Elektrolytlösung durch einen Mikrokanal strömt. Der Mikrofluidchip umfasst eine Einströmöffnung (10), einen Verteiler (20), einen Mehrfachkanal (30), eine Sammeleinrichtung (40), eine Ausströmöffnung (50) und ein Paar von Elektroden (60). Die vorliegende Erfindung könnte auf eine neue Stromquelle für saubere Energie angewendet werden.

VERFAHREN ZUR HERSTELLUNG VON EIN GETTERMATERIAL ENTHALTENDEN MIKROMECHANISCHEN VORRICHTUNGEN UND SO HERGESTELLTE VORRICHTUNGEN

Micromechanical component and method for fabricating a micromechanical component

A method for fabricating a microelectromechanical or microoptoelectromechanical component. The method includes producing first and second layer composites. The first has a first substrate and a first insulation layer, which covers at least one part of the surface of the first substrate, while the second has a second substrate and a second insulation layer, which covers at least one part of the surface of the second substrate. An at least partly conductive structure layer is applied to the first insulation layers and the second composite is applied to the structure layer so that the second insulation layer adjoins the structure layer. The first and second layer composites and the structure layer are configured so that at least one part of the structure layer that comprises the active area of the microelectromechanical or microoptoelectromechanical component is hermetically tightly sealed by the first and second layer composites. Contact holes are formed for making contact with conductive ...

Micro fluid system support unit and manufacturing method thereof

A micro fluid system support unit in accordance with the present invention includes a first support body (2), a first adhesive layer (1a) arranged on the surface of the first support body (2), a first hollow filament group consisting of a plurality of hollow filaments (501- 508) arranged with an arbitrary shape on the surface of the first adhesive layer (1a), a second hollow filament group consisting of a plurality of hollow filaments (511- 518) arranged in the direction orthogonal to the first hollow filament group, a second adhesive layer (1b) arranged on the surface of the second hollow filament group, and a second support body (6) arranged on the surface of the second adhesive layer (1b). The first and the second hollow filament group constitute a flow passage layer.

Method of designing rotary thermal actuator and rotary thermal actuator

Provided are a method of designing a rotary thermal actuator and a rotary thermal actuator. The method includes setting the shape of an entire design domain; dividing the entire design domain into a predetermined number of domains which are symmetrical to one another in a rotational direction from the center of the entire design domain; designing the domains using a topology optimization method which uses a driving stage disposed at the center of the entire design domain, an initial shape of thermal expansion members which connect electrodes disposed at outer boundaries of the entire design domain, material properties of the thermal expansion members, and boundary conditions of the domains; and designing the entire design domain such that the designed domains are symmetrical to one another in the rotational direction.

CLOSING BLADE FOR DEFORMABLE VALVE IN A MICROFLUIDIC DEVICE, AND METHOD

A microfluidic manipulation system is provided that includes a blade for manipulating deformable material and at least one movable support that is capable of moving the blade into contact with a microfluidic device including a deformable feature. When the microfluidic device is operatively held by a holder, a movable support can position the distal end of the blade relative to the microfluidic device and move the contact tip surface of the blade such that it deforms the deformable feature.

CAD SYSTEM AND METHOD OF GENERATING DESIGN DATA

A CAD system generating design data corresponding to structural parts of a microfluidic device formed of a material: includes a coordinate value setter to a coordinate value for each of the structural parts of the microfluidic device, and a design data generator to generate the design data by setting, for each of the structural parts to which the coordinate value has been set, attribute information according to material data representing information specifying a material and including a depth, a thickness, and a cross-sectional shape of the material.

METHOD FOR FABRICATING THREE-DIMENSIONAL MICROSTRUCTURE BY FIB-CVD AND DRAWING SYSTEM FOR THREE-DIMENSIONAL MICROSTRUCTURE

For preventing in the course of processing and appearing in the use of MEMS bump design mixed

Electrokinetic micro power cell using microfluidic-chip with multi-channel type

The invention relates to a new micro power cell applying the microfluidic-chip with multi-channel type. The streaming potential is the main thrust, which is created by Helmholtz-Smoluchowski's electrokinetic principle when electrolytic solution flows through a microchannel. The microfluidic-chip comprises an inflow port, a distributor, a multi-channel, a collector, an outflow port, and a pair of electrodes. The present invention could be applied to a new power source of clean energy.

Hybrid MEMS bump design to prevent in-process and in-use stiction

A micro-electro-mechanical systems (MEMS) device and method for forming a MEMS device is provided. A proof mass is suspended a distance above a surface of a substrate by a fulcrum. A pair of sensing plates are positioned on the substrate on opposing sides of the fulcrum. Metal bumps are associated with each sensing plate and positioned near a respective distal end of the proof mass. Each metal bump extends from the surface of the substrate and generally inhibits charge-induced stiction associated with the proof mass. Oxide bumps are associated with each of the pair of sensing plates and positioned between the respective sensing plate and the fulcrum. Each oxide bump extends from the first surface of the substrate a greater distance than the metal bumps and acts as a shock absorber by preventing the distal ends of the proof mass from contacting the metal bumps during shock loading.

Four-axis excitation device capable MEMS of dynamically driving six micro-structures

Transcript apparatus

Deckelwafer, in der Mikrosystemtechnik einsetzbares Bauelement mit einem solchen Wafer sowie Lötverfahren zum Verbinden entsprechender Bauelement-Teile

Die Erfindung betrifft einen Deckelwafer mit einem Kern (1) und einer Innenseite (7, 10, 11), wobei die Innenseite einen ringförmigen Außenbereich (7), einen sich an den Außenbereich nach innen anschließenden ringförmigen Bereich (10) sowie einen Innenbereich (11) umfasst, dadurch gekennzeichnet, dass zumindest der Bereich (10) eine Pufferschicht aufweist, die einen Benetzungswinkel von < 35 DEG für ein metallisches Eutektikum aufweist, das im Bereich von > 265 DEG C und 450 DEG C schmilzt. Ferner betrifft die Erfindung ein in der Mikrosystemtechnik einsetzbares Bauelement, das einen derartigen, mit Hilfe eines Lotmaterials angebrachten Deckelwafer aufweist, sowie ein Verfahren zu dessen Herstellung.

HYBRID MEMS BUMP DESIGN TO PREVENT IN-PROCESS AND IN-USE STICTION

A micro-electro-mechanical systems (MEMS) device and method for forming a MEMS device is provided. A proof mass is suspended a distance above a surface of a substrate by a fulcrum. A pair of sensing plates are positioned on the substrate on opposing sides of the fulcrum. Metal bumps are associated with each sensing plate and positioned near a respective distal end of the proof mass. Each metal bump extends from the surface of the substrate and generally inhibits charge-induced stiction associated with the proof mass. Oxide bumps are associated with each of the pair of sensing plates and positioned between the respective sensing plate and the fulcrum. Each oxide bump extends from the first surface of the substrate a greater distance than the metal bumps and acts as a shock absorber by preventing the distal ends of the proof mass from contacting the metal bumps during shock loading.

Verfahren zur Herstellung einer Antihaftschicht auf einem MEMS-Bauelement

Bei einem Verfahren zur Herstellung einer Antihaftschicht auf einem MEMS-Bauelement wird die Oberfläche des MEMS-Bauelementes zumindest teilweise mit einer selbstassemblierenden Monolagenschicht beschichtet. Für die Beschichtung werden Verbindungen als Precursormoleküle eingesetzt, die auf wenigstens einem Siloxan basieren. Das Siloxan weist wenigstens eine reaktive Endgruppe an wenigstens einem Silicium-Atom auf, wobei die wenigstens eine reaktive Endgruppe Chlor und/oder Brom und/oder wenigstens eine Methoxy-Gruppe und/oder wenigstens eine Ethoxy-Gruppe ist.

패턴 시트의 제조 방법

... 저비용으로, 생산성이 우수한 패턴 시트의 제조 방법을 제공한다. 돌기 형상 패턴(12)이 형성된 원판(10)으로부터, 수지에 의하여, 돌기 형상 패턴의 반전형인, 오목형의 제1 몰드(20)를 복수 제작하는 공정과, 제1 몰드(20)로 전주에 의하여, 금속제의 돌기 형상 패턴이 형성된 전주 금형(70)을 복수 제작하는 공정과, 전주 금형(70)으로부터, 수지에 의하여, 돌기 형상 패턴의 반전형인 오목형의 제2 몰드(80)를 복수 제작하는 공정과, 제2 몰드(80)로부터, 돌기 형상 패턴(102)이 형성된 패턴 시트(100, 110)를 제작하는 공정을 갖는 패턴 시트의 제조 방법이다.

Method for controlling the hermeticity of closed c

ULTRA-LIGHT MICRO-LATTICES AND A METHOD FOR FORMING THE SAME

The present invention relates to a micro-lattice and, more particularly, to an ultra-light micro-lattice and a method for forming the same. The micro is a cellular material, formed of interconnected hollow tubes, The cellular material has a relative density in range of 0,001 % to 0,3%, and a density of 0,9 mg/cc has been demonstrated. The cellular material also has the ability to recover from a deformation exceeding 50% strain ...

Micromechanical Component and Method for Fabricating a Micromechanical Component

A method for fabricating a microelectromechanical or microoptoelectromechanical component. The method includes producing first and second layer composites. The first has a first substrate and a first insulation layer, which covers at least one part of the surface of the first substrate, while the second has a second substrate and a second insulation layer, which covers at least one part of the surface of the second substrate. An at least partly conductive structure layer is applied to the first insulation layers and the second composite is applied to the structure layer so that the second insulation layer adjoins the structure layer. The first and second layer composites and the structure layer are configured so that at least one part of the structure layer that comprises the active area of the microelectromechanical or microoptoelectromechanical component is hermetically tightly sealed by the first and second layer composites. Contact holes are formed for making contact with conductive ...

Verfahren zum Messen eines Verhaltens eines MEMS-Bauelements

Die vorliegende Erfindung betrifft ein Verfahren zum Messen eines Verhaltens eines MEMS-Bauelements (1), das einen 6-Achsen- oder 9-Achsen Trägheitssensor (2) umfasst, wobei das Verfahren die folgenden Schritte umfasst: A. Befestigen des MEMS-Bauelements (1) an einer Testvorrichtung (13), die eine Schwingungsquelle (14) umfasst, B. Anlegen einer Schwingung an das MEMS-Bauelement (1) durch die Schwingungsquelle (14) und gleichzeitiges Bewegen der Testvorrichtung (1) gemäß einem vorbestimmten Bewegungsmuster, C. Lesen von durch den Trägheitssensor (2) gelieferten Ausgabedaten und Vergleichen der Ausgabedaten mit dem vordefinierten Bewegungsmuster, und/oder D. Lesen von durch den Trägheitssensor gelieferten Ausgabedaten und Berechnen einer Frequenzgangkurve des Trägheitssensors (2). Des Weiteren betrifft die vorliegende Erfindung auch ein alternatives Verfahren zum Messen des Verhaltens eines MEMS-Bauelements.

비정질 합금 와이어를 이용한 마이크로 성형품 제조 방법 및 제조 장치

... 본 발명은 비정질 합금 와이어를 이용한 마이크로 성형품 제조 방법 및 제조 장치에 관한 것으로, 자기장의 인가 또는 차단에 따른 MR fluid(Magneto-rheological fluid, 자기변성유체)의 거동을 이용하여 성형장치에 상기 비정질 합금 와이어를 공급하는 단계 및 상기 비정질 합금 와이어를 성형품으로 제조하는 단계를 포함하는 비정질 합금 와이어를 이용한 마이크로 성형품 제조 방법에 관한 것이다. 본 발명에 따른 마이크로 성형품 제조 방법 및 제조 장치는 3차원 형상의 수십 마이크로미터 크기~수 미리미터 크기의 미세 부품제조가 가능하여 미세 부품을 대량 제조할 수 있으며, 마이크로 로봇, 마이크로 시스템 부품, 바이오 메디컬 시스템 부품, 전자기기 부품 등으로 적용될 수 있다.

Method for producing a stamp for hot embossing

The present invention provides a process for producing a stamp for hot embossing (HE). The stamp can be constructed from any photo-resist epoxy that is stable at temperatures equal to the glass transition temperature (T g ) of the material to be stamped. The stamp can be used repeatedly without significant distortion of features. The stamp benefits from low relative cost, high fidelity of features in all three-dimensions and fast construction. The process for producing a stamp for hot embossing from a resist, comprising the steps of producing a seed layer L 1 from a selected photoresist polymer material, soft baking the seed layer L 1 , exposing said seed layer L 1 to initiate cross-linking and then post-exposure bake L 1 to fully cross-link it, coating the cross-linked seed layer L 1 with a second photoresist polymer layer L 2 ; soft baking the second photoresist polymer layer L 2 ; applying a mask to the top surface of the soft baked layer L 2 and illuminating the unmasked portions of the soft baked layer L 2 with UV radiation through the mask, wherein the exposed areas form the pattern of the embossing features, washing away un-exposed regions of the photoresist with a developer to leave behind a relief pattern formed in the second photoresist polymer layer L 2 , which relief pattern corresponds to a pattern in the mask.

Bonding unit control unit and multi-layer bonding method

A multi-layer bonding method of the present invention includes: forming a first bonded substrate by bonding a first substrate and an intermediate substrate in a bonding chamber; conveying a second substrate inside said bonding chamber when said first bonded substrate is arranged inside said bonding chamber; and forming a second bonded substrate by bonding said first bonded substrate and said second substrate in said bonding chamber. According to such a multi-layer bonding method, the upper-side substrate can be bonded with an intermediate substrate and then a first bonded substrate is bonded with a lower-side substrate without taking out the first bonded substrate from the bonding chamber. For this reason, a second bonded substrate can be produced at high speed and at a low cost.

Scanner apparatus having electromagnetic radiation devices coupled to mems actuators

A disclosed scanner apparatus includes a member having spaced apart proximal and distal portions. An electromagnetic radiation device is configured to direct electromagnetic radiation therefrom and is moveably coupled to the distal portion of the member. The electromagnetic radiation device is configured to move in a first plane of movement to a first position to direct the electromagnetic radiation along a first path and configured to move in the plane of movement to a second position to direct the electromagnetic radiation along a second path. A MicroElectroMechanical Systems (MEMS) actuator is coupled to the electromagnetic radiation device, wherein the MEMS actuator is configured to move in a first direction to move the electromagnetic radiation device to the first position and configured to move in a second direction to move the electromagnetic radiation device to the second position. Other scanning and robotic structure devices are disclosed.

Method for strip testing of mems devices, testing strip of mems devices and mems device thereof

A method for testing a strip of MEMS devices, the MEMS devices including at least a respective die of semiconductor material coupled to an internal surface of a common substrate and covered by a protection material; the method envisages: detecting electrical values generated by the MEMS devices in response to at least a testing stimulus; and, before the step of detecting, at least partially separating contiguous MEMS devices in the strip. The step of separating includes defining a separation trench between the contiguous MEMS devices, the separation trench extending through the whole thickness of the protection material and through a surface portion of the substrate, starting from the internal surface of the substrate.

Micro-electromechanical semiconductor component

The micro-electromechanical semiconductor component is provided with a semiconductor substrate in which a cavity is formed, which is delimited by lateral walls and by a top and a bottom wall. In order to form a flexible connection to the region of the semiconductor substrate, the top or bottom wall is provided with trenches around the cavity, and bending webs are formed between said trenches. At least one measuring element that is sensitive to mechanical stresses is formed within at least one of said bending webs. Within the central region surrounded by the trenches, the top or bottom wall comprises a plurality of depressions reducing the mass of the central region and a plurality of stiffening braces separating the depressions.

Mold, method of manufacturing the same, article having fine uneven structure on surface, and method of manufacturing the same

A mold in which a fine uneven structure is formed on the surface by anodizing a surface of an aluminum base material having a purity of equal to or more than 99.5% by mass, wherein a 60-degree gloss of the surface on the side where a fine uneven structure is formed is equal to or more than 750%.

Method for producing microparticles

Silicon microcarriers suitable for fluorescent assays as a well as a method of producing such microcarriers are provided. The method includes the steps of providing a SOI wafer having a bottom layer of monocristalline silicone, an insulator layer and a bottom layer of monocristalline silicon, delineating microparticles, etching away the insulator layer and then depositing an oxide layer on the wafer still holding the microparticles before finally lifting-off the microparticles.

Semiconductor structure

Micro-Electro-Mechanical System (MEMS) structures, metrology structures and methods of manufacture are disclosed. The method includes forming one or metrology structure, during formation of a device in a chip area. The method further includes venting the one or more metrology structure after formation of the device.

METHOD AND DEVICE FOR MEASURING A MICROELECTROMECHANICAL SEMICONDUCTOR COMPONENT

In the method for measuring a micromechanical semiconductor component which comprises a reversibly deformable measuring element sensitive to mechanical stresses, which is provided with electronic circuit elements and terminal pads for tapping measurement signals, the measuring element () of the semiconductor component (), for the purpose of determining the distance/force and/or distance/pressure characteristic curve thereof, is increasingly deformed by mechanical action of a plunger () which can in particular be advanced step by step. After a or after each step-by-step advancing movement of the plunger () by a predetermined distance quantity, the current measurement signals are tapped via the terminal pads (). The semiconductor component () is qualified on the basis of the obtained measurement signals representing the distance/force and/or distance/pressure characteristic curve. 1. A method for measuring a microelectromechanical semiconductor component comprising a reversibly deformable measuring element sensitive to mechanical stresses and is provided with electronic circuit elements as well as terminal pads for tapping measurement signals , wherein in the methodsaid measuring element of said semiconductor component, for the purpose of determining the distance/force and/or distance/pressure characteristic curve thereof, is increasingly deformed by mechanical action of a plunger which can in particular be advanced step by step,after an advancing movement or after each step-by-step advancing movement of said plunger by a predetermined distance quantity, the current measurement signals are tapped via said terminal pads, andsaid semiconductor component is qualified on the basis of the obtained measurement signals representing the distance/force and/or distance/pressure characteristic curve.2. The method according to claim 1 , characterized in that a plurality of semiconductor components to be measured are configured on a substrate wafer claim 1 , and that the ...

Lathe Head for Nano/Micro Machining of Materials

Apparatus, methods and systems for nano/micro machining. A lathe head has a microscopic pivot aperture for seating a conical tip. The conical tip is carried on a turnable part at one end thereof and is polished down to a microscopic apex. The microscopic pivot aperture is dimensioned for seating the concentric tip in the pivot aperture such that an apex of the conical tip protrudes through and beyond the aperture to a position in close proximity with the aperture. A driver system can comprise a rotator for axially rotating the turnable part, including the conical tip seated in the pivot aperture, and a forward pressure applicator for concurrently applying forward pressure to the conical tip in the direction of the pivot aperture. A light/particle beam system can be utilized to machine the rotating conical tip and the rotating turnable part, including the tip, can be easily removed after machining. 1. An apparatus for a micro/nano machining lathe system; the apparatus comprisinga lathe head for retaining in a micro/nano machining lathe system, the lathe head comprising a microscopic pivot aperture for seating a conical tip, said conical tip being carried on a turnable part at one end thereof and being polished down to a microscopic apex;wherein said microscopic pivot aperture is dimensioned for seating said concentric tip in said pivot aperture such that an apex of said conical tip protrudes through and beyond said aperture to a position in close proximity with said aperture; anda driver system comprising:a rotator for axially rotating said turnable part, including said conical tip seated in said pivot aperture, anda forward pressure applicator for concurrently applying forward pressure to said conical tip in the direction of the pivot aperture,wherein, in use, when said driver system axially rotates, and applies said forward pressure to, said turnable part, including said conical tip seated in said aperture, the pivot point of said conical tip is substantially fixed ...

Microelectromechanical component and method for testing a microelectromechanical component

The microelectromechanical component has a semiconductor substrate ( 1 ), which has a cavity ( 2 a ) formed in the semiconductor substrate. The cavity is covered by a reversibly deformable membrane ( 2 ). A sensor ( 17 ) for detecting a deformation of the membrane ( 2 ) is formed within the region of the membrane ( 2 ). A test actuator ( 28, 29, 30 ) for deforming the membrane ( 2 ) for testing purposes is also arranged within the region of the membrane ( 2 ). Finally, the microelectromechanical component has an evaluation and activation unit ( 41 ) connected to the sensor ( 17 ) and the test actuator ( 28, 29, 30 ) for activating the test actuator ( 28, 29, 30 ) in order to deform the membrane ( 2 ) as a test and for evaluating a measurement signal of the sensor ( 17 ) as a sensor detection of a deformation of the membrane ( 2 ) as a result of the activation of the test actuator ( 28, 29, 30 ).

Complex micromechanical part

The invention relates to a micromechanical part ( 11, 21, 31, 41, 51, 61 ) made of a single-piece material. According to the invention, the part has an elementary section formed of at least two secant and non-aligned segments so that one of the at least two segments forms the height (e 3 ) of the micromechanical part ( 11, 21, 31, 41, 51, 61 ), the height being greater than the thickness (e 1 ) of each segment. The invention also concerns the method of fabricating the part.

MICROPATTERN GENERATION WITH PULSED LASER DIFFRACTION

Methods and devices for preparing microscale polymer relief structures from a thin polymer layer on an absorbing substrate are described. The described methods are ultrafast (about 8 nanoseconds) and allow formation of patterned microstructures having complex morphologies and narrow line widths that are an order of magnitude smaller than the masks used in the methods. 116-. (canceled)17. A device for preparing periodic microscale polymer relief structures , the device comprising:a source of electromagnetic radiation;a periodic aperture arranged to allow electromagnetic radiation from the source of electromagnetic radiation to pass through the periodic aperture; anda stage configured and arranged to allow a substrate positioned on the stage to be separated by a distance from the periodic aperture and irradiated by electromagnetic radiation from the source after the electromagnetic radiation has passed through the periodic aperture, whereby a near-field diffraction pattern of electromagnetic radiation intensity maxima and minima is created on the substrate.18. The device of claim 17 , wherein the source of electromagnetic radiation is a laser.19. The device of claim 17 , wherein the source of the electromagnetic radiation is a pulsed laser.20. The device of claim 17 , further comprising at least one additional optic selected from non-linear optics claim 17 , optical parametric amplifiers claim 17 , dichroic mirrors claim 17 , diffraction gratings claim 17 , collimators claim 17 , convergent optics claim 17 , divergent optics claim 17 , and combinations thereof21. The device of claim 17 , wherein the source of electromagnetic radiation is capable of producing light having a wavelength of about 355 nm.22. The device of claim 17 , wherein the source of electromagnetic radiation is capable of producing electromagnetic radiation having a fluence of about 100 to 400 mJ per cm.23. The device of claim 17 , wherein the periodic aperture and the stage are configured to allow ...

Mass transfer tool

Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.

Testing for defective manufacturing of microphones and ultralow pressure sensors

A method of testing a MEMS pressure sensor device such as, for example, a MEMS microphone package. The MEMS pressure sensor device includes a pressure sensor positioned within a housing and a pressure input port to direct acoustic pressure from outside the housing towards the pressure sensor. An acoustic pressure source is activated and acoustic pressure from the acoustic pressure source is directed to the pressure input port and to an exterior location of the housing other than the pressure input port. Based on the output signal of the pressure sensor, it is determined whether any defects exist that allow acoustic pressure to reach the pressure sensor through the exterior of the housing at locations other than the pressure input port.

Device and method for monitoring surface condition of contact surface of detected object

A surface monitoring device is for monitoring a contact surface of a detected object. The surface monitoring device and the detected object are disposed on a substrate. The surface monitoring device includes a resonant mechanical part, having a contact tip adjacent to the contact surface by a preset gap in a static state. A driving circuit, applying an AC input signal to drive the resonant mechanical part to cause the contact tip to vibrate with respect to the contact surface at a plurality of sampling frequencies. The contact tip substantially hits the contact surface in a tapping bandwidth within the sampling frequencies. An analysis circuit to analyze a ratio of an output voltage to an input voltage of the input signal and determine the tapping bandwidth, wherein the ratio in the tapping bandwidth is jumping to a flatten phase.

MICROSTRUCTURE FOR TRANSDERMAL ABSORPTION AND METHOD FOR MANUFACTURING SAME

The present invention relates to a microstructure including a biocompatible polymer or an adhesive and to a method for manufacturing the same. The present inventors optimized the aspect ratio according to the type of each microstructure, thereby ensuring the optimal tip angle and the diameter range for skin penetration. Especially, the B-type to D-type microstructures of the present invention minimize the penetration resistance due to skin elasticity at the time of skin attachment, thereby increasing the penetration rate of the structures (60% or higher) and the absorption rate of useful ingredients into the skin. In addition, the D-type microstructure of the present invention maximizes the mechanical strength of the structure by applying a triple structure, and thus can easily penetrate the skin. When the plurality of microstructures are arranged in a hexagonal arrangement type, a uniform pressure can be transmitted to the whole microstructures on the skin. 1. A microstructure comprising a biocompatible polymer or an adhesive , wherein the aspect ratio (w:h) , configured of the diameter (w) of the bottom surface of the microstructure and the height (h) of the microstructure , is 1:5 to 1:1.5 , and the angle of a distal tip is 10° to 40°.2. The microstructure of claim 1 , wherein the biocompatible polymer is at least one polymer selected from the group consisting of hyaluronic acid (HA) claim 1 , carboxymethyl cellulose (CMC) claim 1 , alginic acid claim 1 , pectin claim 1 , carrageenan claim 1 , chondroitin (sulfate) claim 1 , dextran (sulfate) claim 1 , chitosan claim 1 , polylysine claim 1 , collagen claim 1 , gelatin claim 1 , carboxymethyl chitin claim 1 , fibrin claim 1 , agarose claim 1 , pullulan polylactide claim 1 , polyglycolide (PGA) claim 1 , polylactide-glycolide copolymer (PLGA) claim 1 , pullulan polyanhydride claim 1 , polyorthoester claim 1 , polyetherester claim 1 , polycaprolactone claim 1 , polyesteramide claim 1 , poly(butyric acid) claim 1 , ...

Passive Semiconductor Device Assembly Technology

A method of assembling a group of devices, the method comprising the steps of: evacuating a space between each component of a first group of two or more components on a source device and a transfer device thereby to create a temporary bond between each component of the first group of two or more components and the transfer device; selectively removing the first group of two or more components from the source device whilst the transfer device is temporarily bonded to each component of the first group of two or more components on the source device; positioning the first group of two or more components on a host device; and decoupling the first group of two or more components from the transfer device, thereby to form a first group of assembled devices.

Vent Attachment System For Micro-Electromechanical Systems

A method of installing a vent to protect an open port of a micro-electrical mechanical system (MEMS) device, the vent being of the type comprising an environmental barrier membrane attached to a carrier and the vent further being attached to a liner, the method comprising the steps of: (a) feeding the vent to a die attach machine with die ejectors and at least one of a vacuum head and a gripper head; (b) detaching the vent from said liner using the die ejectors; (c) picking up the vent with at least one of the vacuum head and the gripper head of the die attach machine; (d) disposing the vent over the open port of the MEMS device; and (e) securing the vent over the open port of the MEMS device. 1. A method of installing a vent assembly to protect an open port of a micro-electrical mechanical system (MEMS) device , said vent assembly being of the type comprising an environmental barrier membrane attached to a carrier and said vent further being attached to a liner , said method comprising the steps of:(a) feeding said vent assembly to a die attach machine with die ejectors and at least one of a vacuum head and a gripper head;(b) detaching said vent assembly from said liner using said die ejectors;(c) picking up said vent assembly with at least one of said vacuum head and said gripper head of said die attach machine;(d) disposing said vent assembly over said open port of said MEMS device; and(e) securing said vent assembly over said open port of said MEMS device.2. A method as defined in wherein said carrier comprises a material selected from the group consisting of PEEK and polyimide.3. A method as defined in wherein said carrier is attached to said membrane by a pressure sensitive adhesive.4. A method as defined in wherein said carrier is attached to said membrane by a weld.5. A method as defined in wherein said weld is selected from a group comprising a heat weld claim 4 , a sonic weld claim 4 , and a laser weld.6. A method as defined in wherein said liner comprises ...

METHOD FOR MANUFACTURING GAS DETECTOR BY MEMS PROCESS

A method for manufacturing a gas detector by a micro-electrical-mechanical systems (MEMS) process. The method includes providing a MEMS wafer including a plurality of mutually adjacent units; forming a gas sensing material layer on the MEMS wafer; bonding a structure reinforcing layer and the MEMS wafer through anode bonding; providing an adhesive tape; performing a cutting process to form a gas detection unit; and adhering the gas detection unit on a substrate by the adhesive tape to form a gas detector. The structure reinforcing layer is capable of enhancing the strength of a device and preventing edge collapsing, and hence enhancing the overall yield rate and reducing costs. 1. A method for manufacturing a gas detector by a micro-electrical-mechanical systems (MEMS) process , comprising:{'b': '1', 'S: providing a MEMS wafer, the MEMS wafer comprising a plurality of mutually adjacent units, each of the plurality of units comprising a top portion, a side block portion extending from an edge of the top portion, and a bottom chamber formed by the top portion and the side block portion in a surrounding manner, the side block portions of the plurality of units mutually connected;'}{'b': '2', 'S: forming a gas sensing material layer on one side of the MEMS wafer opposing to the bottom chamber;'}{'b': '3', 'S: bonding a structure reinforcing layer with the MEMS wafer through anode bonding in a negative-pressure environment, wherein the structure reinforcing layer covers the bottom chambers, and is made of at least one selected from a group consisting of glass and borosilicate glass;'}{'b': '4', 'S: providing an adhesive tape on one side of the structure reinforcing layer opposing to the MEMS wafer;'}{'b': '5', 'S: performing a cutting process along connecting positions of the side block portions of the plurality of units to form a plurality of gas detection units each comprising the bottom chamber; and'}{'b': '6', 'S: adhering one of the plurality of gas detection units ...

Method of controlling the placement of micro-objects

Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause phototransistors or electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. A set of micro-object may be analyzed. Geometric properties of the set of micro-objects may be identified. The set of micro-objects may be divided into multiple sub-sets of micro-objects based on the one or more geometric properties and one or more control patterns.

MASS TRANSFER TOOL

Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads. 1. A mass transfer tool comprising: a carrier substrate holder; and', 'a receiving substrate holder;, 'a lower assembly includinga stage located over the lower assembly;an articulating transfer head assembly mounted on the stage; andan actuator assembly to adjust a spatial relationship of the articulating transfer head assembly in at least six degrees of freedom.2. The mass transfer tool of claim 1 , wherein the stage is movable within an x-y plane.3. The mass transfer tool of claim 2 , wherein the lower assembly further comprises an upward-viewing imaging device.4. The mass transfer tool of claim 3 , wherein the upward-viewing imaging device is fixed in place relative to the carrier substrate holder.5. The mass transfer tool of claim 3 , wherein the upward-viewing imaging device comprises a digital camera.6. The mass transfer tool of claim 1 , further comprising a first position sensor fixed relative to the transfer head assembly to detect a position of the carrier substrate holder.7. The mass transfer tool of claim 6 , further comprising a second position sensor fixed relative to the carrier substrate holder to detect a position of the articulating transfer head assembly.8. The mass transfer tool of claim 1 , further comprising a flexure to dampen force when contacting the articulating transfer head assembly with a workpiece.9. The mass transfer tool of claim 8 , further comprising a position sensor fixed relative to the transfer head assembly to sense a ...

Pop-Up Laminate Structures with Integrated Electronics

A multi-layer, super-planar laminate structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations. A layer with electrical wiring can be included in the structure for delivering electric current to devices on or in the laminate structure. 1. A pop-up laminate device with integrated electronics , comprising:at least one segmented rigid layer with gaps between segments of the rigid layer;at least one flexible layer laminated to the rigid layer and extending across the gaps that separate the segments of the rigid layer to form hinges, wherein the flexible layer is less rigid than the rigid layer; anda plurality of layers of electrically conductive wiring extending across or through the rigid segments, wherein at least one of the layers of electrically conductive wiring extends from rigid segments to form at least one of the following: (a) a bridge across the hinges and (b) a via structure separating layers in the pop-up laminate.2. The pop-up laminate of claim 1 , further comprising an electronic transducer coupled with the electrically conductive wiring.3. The pop-up laminate of claim 2 , wherein the electronic transducer is selected from an electromagnetic actuator configured to generate displacement claim 2 , a light-emitting-diode/phototransistor pair coupled with an optical encoder claim 2 , and a Hall effect sensor.4. The pop-up laminate of claim 2 , wherein the electronic transducer is included ...

One-piece, hollow micromechanical part with several functional levels formed of a synthetic carbon allotrope based material

A method for fabrication of a micromechanical part made of a one-piece synthetic carbon allotrope based material, the method including: forming a substrate with a negative cavity of the micromechanical part to be fabricated; coating the negative cavity of the substrate with a layer of the synthetic carbon allotrope based material in a smaller thickness than the depth of the negative cavity; and removing the substrate to release the one-piece micromechanical part formed in the negative cavity.

Three dimensional (3D) robotic micro electro mechanical systems (MEMS) arm and system

A micro assembly having a substrate and an operating plane coupled to the substrate. The operating plane is movable from an in-plane position to an out-of-plane position. One or more electric connections provide electric power from the substrate to the operating plane in the out-of-plane position. A tool is coupled to the operating plane. The tool is operable to receive electric power from the operating plane to perform work. 1a substrate;an operating plane coupled to the substrate and movable from an in-plane position to an out-of-plane position;one or more electric connections providing electric power from the substrate to the operating plane in the out-of-plane position;a tool coupled to the operating plane; andthe tool operable to receive electric power from the operating plane to perform work.. A micro assembly, comprising: This application claims priority under 35 USC § 120 to U.S. patent application Ser. No. 15/295,604, filed on Oct. 17, 2016, which will issue as U.S. Pat. No. 10,059,582 on Aug. 28, 2018, which claims priority under 35 USC § 120 to U.S. patent application Ser. No. 14/247,021, filed on Apr. 7, 2014, and now issued as U.S. Pat. No. 9,473,048 on Oct. 18, 2016; which claims priority under 35 USC § 120 to Ser. No. 13/406,454, filed on Feb. 27, 2012, and now issued as U.S. Pat. No. 8,689,899 issued on Apr. 8, 2014; which claims priority under 35 USC § 120 to U.S. patent application Ser. No. 12/470,474, filed on May 21, 2009, and now issued as U.S. Pat. No. 8,122,973 issued on Feb. 28, 2012; which claims priority under 35 USC § 119(e) to U.S. Provisional Patent Application Ser. No. 61/055,038, filed on May 21, 2008, the entire contents of all and which are hereby incorporated by reference.This invention relates to Micro Electro Mechanical Systems (MEMS), and more particularly to a three dimensional (3D) MEMS arm and system.Micro ElectroMechanical Systems (MEMS) integrate mechanical elements, sensors, actuators, and/or electronics on a common silicon ...

Microstructured nozzle and production thereof

The invention relates to a nozzle for use in a device for administering a liquid medical formulation, to a method for producing the nozzle in the form of a microfluidic component and to a tool for producing microstructures of the microfluidic component. The nozzle is formed by a plastics plate with groove-like microstructures which are covered by a plastics cover on the longitudinal side in a fixed manner. The production method includes a moulding process in which a moulding tool is used, which moulding tool has complementary metal microstructures which have been produced from a semiconductor material in an electrodeposition process by means of a master component.

MEMS TRANSDUCER SYSTEM AND ASSOCIATED METHODS

The disclosure provides a system, comprising: a MEMS capacitive transducer, comprising one or more first capacitive plates coupled to a first node and one or more second capacitive plates coupled to a second node; biasing circuitry coupled to the first node, operable to provide a biasing voltage to the one or more first capacitive plates; and test circuitry coupled to the second node, operable to: selectively apply one or more current sources to the second node, so as to charge and discharge the MEMS capacitive transducer and so vary a signal based on a voltage at said second node between an upper value and a lower value; determine a parameter that is indicative of a time period of the variation of the signal; and determine a capacitance of the MEMS capacitive transducer based on the parameter that is indicative of the time period. 121.-. (canceled)22. A system , comprising:a MEMS capacitive transducer, comprising one or more first capacitive plates coupled to a first node and one or more second capacitive plates coupled to a second node;biasing circuitry coupled to the first node, operable to provide a biasing voltage to the one or more first capacitive plates;output circuitry coupled to the second node, for generating an output signal; andcapacitive circuitry coupled to the first node, comprising a charge amplifier arranged in a feedback loop, the feedback loop further comprising a first capacitor coupled to an output of the charge amplifier, such that an effective capacitance of the first capacitor is increased based on a gain of the charge amplifier.23. The system according to claim 22 , wherein the first capacitor is further coupled to the first node.24. The system according to claim 22 , wherein an inverting input of the charge amplifier is coupled to the first node.25. The system according to claim 24 , wherein the inverting input of the charge amplifier is coupled to the first node via a second capacitor.26. The system according to claim 22 , wherein a non- ...

MICROELECTROMECHANICAL SYSTEMS SENSOR TESTING DEVICE, SYSTEM AND METHOD

A microelectromechanical system (MEMS) sensor testing device, system and method are provided. The testing device includes a socket having a plurality of pads configured to receive a respective plurality of pins of the MEMS sensor, a body having a plurality of operable positions associated with a respective plurality of orientations of the MEMS sensor and circuitry which performs a method for testing the MEMS sensor in the plurality of operable positions. The method includes, for each position of the plurality of operable positions, outputting an indication of the position to the plurality of operable positions, receiving one or more measurements made by the MEMS sensor at the respective position and determining whether the one or more measurements satisfy a reliability criterion. The method includes generating a report based on the plurality of measurements and indicating whether the plurality of measurements satisfy a plurality of reliability criteria, respectively. 1. A device , comprising:a socket configured to be coupled to a microelectromechanical system (MEMS) sensor;a body having a plurality of operable positions associated with a respective plurality of orientations of the MEMS sensor; and [ outputting an indication of the position to the plurality of operable positions;', 'receiving one or more measurements made by the MEMS sensor at the respective position of the plurality of operable positions; and', 'determining whether the one or more measurements satisfy a reliability criterion of a plurality of reliability criteria;, 'for each position of the plurality of operable positions, 'generating a report based on the plurality of measurements and indicating whether the plurality of measurements satisfy the plurality of reliability criteria, respectively; and', 'outputting the report., 'circuitry which, in operation, performs a method for testing the MEMS sensor in the plurality of operable positions, the method including2. The device of claim 1 , wherein the ...

SYSTEM AND METHOD FOR CHARACTERIZING CRITICAL PARAMETERS RESULTING FROM A SEMICONDUCTOR DEVICE FABRICATION PROCESS

A system includes three related structures. A first structure includes a first finger interposed between a first pair of sidewalls. The first finger has a first length and a first width, and is separated from each of the sidewalls by a first gap having a first spacing. A second structure includes a second finger interposed between a second pair of sidewalls. The second finger has a second length and the first width, and is separated from each of the sidewalls by a second gap having a second spacing. A third structure includes a third finger interposed between a third pair of sidewalls. The third finger has the second length and a second width, and is separated from each of the sidewalls by a third gap having a second spacing. Resistance and capacitance measurements of the three structures are used to extract critical parameters resulting from a semiconductor device fabrication process. 1. A process control monitoring system formed on a substrate comprising:a first structure formed in a structural layer of said substrate, said first structure including a first finger interposed between a first pair of sidewalls, said first finger exhibiting a first length and a first width, each of which is parallel to a surface of said substrate, and said first finger being separated from each of said first pair of sidewalls by a first gap having a first spacing;a second structure formed in said structural layer of said substrate, said second structure including a second finger interposed between a second pair of sidewalls, said second finger exhibiting a second length and said first width, each of which is parallel to said surface of said substrate, and said second finger being separated from each of said second pair of sidewalls by a second gap having said first spacing; anda third structure formed in said structural layer of said substrate, said third structure including a third finger interposed between a third pair of sidewalls, said third finger exhibiting said second length ...

METHODS FOR FABRICATING ISOLATED MICRO- OR NANO-STRUCTURES USING SOFT OR IMPRINT LITHOGRAPHY

The presently disclosed subject matter describes the use of fluorinated elastomer-based materials, in particular perfluoropolyether (PFPE)-based materials, in high-resolution soft or imprint lithographic applications, such as micro- and nanoscale replica molding, and the first nano-contact molding of organic materials to generate high fidelity features using an elastomeric mold. Accordingly, the presently disclosed subject matter describes a method for producing free-standing, isolated nanostructures of any shape using soft or imprint lithography technique. 1. A method for forming one or more particles , the method comprising:(a) providing a patterned template and a substrate, wherein the patterned template comprises a patterned template surface having a plurality of recessed areas formed therein; (i) the patterned template surface; and', '(ii) the plurality of recessed areas; and, '(b) disposing a volume of liquid material in or on at least one of (i) contacting the patterned template surface with the substrate and treating the liquid material; and', '(ii) treating the liquid material., '(c) forming one or more particles by one of2. The method of claim 1 , wherein the patterned template comprises a solvent resistant claim 1 , low surface energy polymeric material.3. The method of claim 1 , wherein the patterned template comprises a solvent resistant elastomeric material.4. The method of claim 1 , wherein at least one of the patterned template and substrate comprises a material selected from the group consisting of a perfluoropolyether material claim 1 , a fluoroolefin material claim 1 , an acrylate material claim 1 , a silicone material claim 1 , a styrenic material claim 1 , a fluorinated thermoplastic elastomer (TPE) claim 1 , a triazine fluoropolymer claim 1 , a perfluorocyclobutyl material claim 1 , a fluorinated epoxy resin claim 1 , and a fluorinated monomer or fluorinated oligomer that can be polymerized or crosslinked by a metathesis polymerization reaction ...

Transparent material processing method, transparent material processing device, and transparent material

An object of one embodiment of the invention is to process a material simply and high efficiently. A fabrication method of transparent material is a method of processing a thermosetting transparent material. The fabrication method of transparent material includes a disposing step (S 01 ) of disposing an uncured thermosetting transparent material, a laser beam irradiation step (S 02 ) of irradiating the disposed uncured thermosetting transparent material with a laser beam so that cavitation bubbles are generated in the uncured thermosetting transparent material, and a curing step (S 03 ) of performing a curing process on the uncured thermosetting transparent material in which the cavitation bubbles are generated.

PROCESSING METHOD FOR WAFER

A processing method for a wafer includes the steps of forming a frame unit having a ring-shaped frame, providing a resin sheet, fixing the resin sheet, which covers the wafer at its front side, at its outer peripheral edge, on the ring-shaped frame, forming through-holes in the resin sheet, holding the frame unit on a side of the resin sheet under suction on a holding surface to fix the ring-shaped frame, applying a laser beam to the wafer to form modified layers inside the wafer, and separating the resin sheet. In the holding step, the adhesive tape is suctioned under a negative pressure acting from the holding surface via through-holes while the front side of the wafer is prevented by the resin sheet from being suctioned on the holding surface. 1. A method for processing a wafer , on a front side of which devices are formed in a plurality of regions defined by intersecting streets , comprising:a frame unit forming step of bonding an adhesive tape to a ring-shaped frame centrally defining an opening, so that the opening is closed by the adhesive tape, and bonding the wafer at a back side to the adhesive tape to form a frame unit;a resin sheet providing step of providing a resin sheet that has a diameter greater than that of the opening of the ring-shaped frame and will serve as a protective member for the wafer;a resin sheet fixing step of covering the opening of the ring-shaped frame with the resin sheet from the front side of the wafer in the frame unit and fixing, at an outer peripheral edge of the resin sheet, the resin sheet on the ring-shaped frame, the resin sheet facing the ring-shaped frame;a through-hole forming step of forming through-holes in a region of the resin sheet, the region being located on a radially outer side of an outer periphery of the wafer;a holding step of, after the resin sheet fixing step and the through-hole forming step, using a chuck table that includes a table main body having a holding surface of a diameter greater than that of ...

MICRO-ELECTRO-MECHANICAL-SYSTEMS PROCESSING METHOD, AND MICRO-ELECTRO-MECHANICAL-SYSTEMS PROCESSING APPARATUS

The invention is to reduce non-uniformity of a processing shape over a wide range of a single field-of-view. 1. A micro-electro-mechanical-systems processing method in a processing apparatus ,the processing apparatus including:an irradiation unit that irradiates a sample with a charged particle beam;a shape measuring unit that measures a shape of the sample; anda control unit, whereinthe micro-electro-mechanical-systems is processed by a first step and a second step, the irradiation unit irradiates a plurality of single field-of-view points with the charged particle beam in a first region of the sample;', 'the shape measuring unit measures the shape of a spot hole formed in the first region of the sample; and', 'the control unit sets, based on measurement results of the shape of the spot hole, a scan condition of the charged particle beam or a forming mask of the charged particle beam at each of the single field-of-view points, and, 'in the first step,'} 'the irradiation unit irradiates, based on the scan condition or the forming mask set in the first step, a second region of the sample with the charged particle beam.', 'in the second step,'}2. The micro-electro-mechanical-systems processing method according to claim 1 , whereinin the first step, the control unit sets, as the scan condition, the scan pitch and an irradiation time of the charged particle beam at each of the single field-of-view points based on the measurement results of the shape of the spot hole.3. The micro-electro-mechanical-systems processing method according to claim 2 , whereinin the first step,the control unit calculates a ratio of the scan pitch and the irradiation time at each of the single field-of-view points to the scan pitch and the irradiation at a center of a beam axis of the charged particle beam.4. The micro-electro-mechanical-systems processing method according to claim 2 , whereinin the first step,the control unit sets, as the scan condition, the scan pitch and the irradiation time ...

STAMPS INCLUDING A SELF-ASSEMBLED BLOCK COPOLYMER MATERIAL, AND RELATED METHODS

Methods for fabricating stamps and systems for patterning a substrate, and devices resulting from those methods are provided. 1. A stamp , comprising: an unpatterned, neutral wetting floor;', 'opposing preferential wetting ends; and', 'opposing parallel preferential wetting sidewalls, a fixed width separating the opposing parallel preferential wetting sidewalls; and, 'a trench in a material overlying a structure and comprising{'sub': 'o', 'claim-text': a first polymer block having affinity for and swellable by absorption of an ink material selected from the group consisting of a mercaptoalcohol, an acetylenic having a hydrocarbon tail group, and an acetylenic having at least one of an alcohol functional group, a thiol functional group, an amine functional group, and a halide functional group; and', 'a second polymer block having substantially no affinity for and not swellable by the ink material., 'a self-assembled block copolymer material filling the trench and having an inherent pitch value (L) equal to a depth of the trench, the self-assembled block copolymer material comprising2. The stamp of claim 1 , further comprising the ink material within the first polymer block but not within the second polymer block.3. The stamp of claim 1 , wherein a first polymer block of the self-assembled block copolymer material is formulated to substantially absorb the ink material.4. A method of forming a stamp claim 1 , comprising:forming a trench in a material overlying a structure, the trench comprising opposing preferential wetting ends, and opposing parallel preferential wetting sidewalls separated from one another by a fixed width;{'sub': 'o', 'filling the trench with a block copolymer material having an inherent pitch value (L) equal to a depth of the trench and comprising a first polymer block having chemical affinity for and swellable by an ink material and a second polymer block having substantially no affinity for and not swellable by the ink material;'}annealing the ...

Self-Tuning Microelectromechanical Impedance Matching Circuits and Methods of Fabrication

A self-tuning impedance-matching microelectromechanical (MEMS) circuit, methods for making and using the same, and circuits including the same are disclosed. The MEMS circuit includes a tunable reactance element connected to a first mechanical spring, a separate tunable or fixed reactance element, and an AC signal source configured to provide an AC signal to the tunable reactance element(s). The reactance elements comprise a capacitor and an inductor. The AC signal source creates an electromagnetically energy favorable state for the tunable reactance element(s) at resonance with the AC signal. The method of making generally includes forming a first MEMS structure and a second mechanical or MEMS structure in/on a mechanical layer above an insulating substrate, and coating the first and second structures with a conductor to form a first tunable reactance element and a second tunable or fixed reactance element, as in the MEMS circuit. 1. A self-tuning impedance-matching microelectromechanical circuit , comprisinga) a first tunable reactance element connected to a first mechanical spring and having a tunable reactance;b) a second tunable or fixed reactance element;c) one or more electrical connections between the first reactance element and the second reactance elements; andd) an AC signal source configured to (i) provide an AC signal to the first and second reactance elements, the AC signal having a frequency, and (ii) create an electromagnetic force on the first reactance element that moves the first reactance element and tunes the self-tuning impedance-matching circuit toward resonance with the AC signal,wherein one of the first and second reactance elements comprises a capacitor and the other of the first and second reactance elements comprises an inductor.2. The self-tuning impedance-matching circuit of claim 1 , wherein the first reactance element comprises a self-tuning capacitor element.3. The self-tuning impedance matching circuit of claim 1 , wherein the first ...

METHOD AND APPARATUS FOR EVALUATING ELECTROSTATIC OR NONLINEAR DEVICES

Aspects are directed to a MEMS device configurable to receive signals from a first, a second, a third, and a fourth signal source operating at a first, a second, a third, and a fourth frequency, respectively. The MEMS device may be configured to combine the first signal with the second signal generating a first combined signal, and to combine the third signal with the fourth signal generating a second combined signal. The first combined signal may be coupled to the first terminal of the MEMS device while the second combined signal may be coupled to the second terminal of the MEMS device. The first common terminal may be configured to produce an output associated with the second and fourth frequencies. The MEMS device may be further configured to derive from the produced output a signal indicative of nonlinearities or of changes in capacitance related to the MEMS device. 1. A method for use with a MEMS apparatus , the method comprising:actuating the MEMS apparatus via an input signal, wherein the MEMS apparatus has an arrangement of at least one micro-mirror that is integrated with a capacitive portion and that provides a field of view;using modulation circuitry to modulate the input signal via signal modulation selected as including one or a combination from among the following: drive amplitude modulation, phase modulation, and frequency modulation; andusing the modulated input signal to drive the MEMS apparatus and to cause a change or increase in the field of view provided by the arrangement of at least one micro-mirror.2. The method of claim 1 , further including using the MEMS apparatus for scanning with a configurable field of view facilitated via the modulated input signal driving the MEMS apparatus.3. The method of claim 1 , wherein the signal modulation includes drive amplitude modulation.4. The method of claim 1 , wherein the signal modulation includes phase modulation.5. The method of claim 1 , wherein the signal modulation includes frequency modulation.6. ...

Redundant sensor system with self-test of electromechanical structures

A sensor system includes first and second MEMS structures and a processing circuit. The first and second MEMS structures are configured to produce first and second output signals, respectively, in response to a physical stimulus. A method performed by the processing circuit entails receiving the first and second output signals and detecting a defective one of the first and second MEMS structures from the first and second output signals by determining that the first and second output signals are uncorrelated to one another. The method further entails utilizing only the first or the second output signal from a non-defective one of the MEMS structures to produce a processed output signal when one of the MEMS structures is determined to be defective and utilizing the first and second output signals from both of the MEMS structures to produce the processed output signal when neither of the MEMS structures is defective.

Method and System for Fabricating a Microelectromechanical System Device with a Movable Portion Using Anodic Etching of a Sacrificial Layer

A method for fabricating a microelectromechanical system device. Submerging a microelectromechanical system device in water. The microelectromechanical system devices include a sacrificial layer deposited on the surface of a substrate between the portion of a structural layer to be freed for movement and a base. Anodically etching the sacrificial layer from the microelectromechanical device to free the portion of the structural layer for movement. A system comprising a solution of water, a microelectromechanical system device including a sacrificial layer of chromium deposited on the surface of a substrate between a portion of a structural layer and a base. The microelectromechanical system device is submerged in the solution of water. An electrode is submerged in the water. The electrode provides a negative bias. A voltage source provides a positive bias to the sacrificial layer of chromium, anodically etching the sacrificial layer of chromium and freeing the portion of the structural layer. 1. A method for fabricating a microelectromechanical system device comprising:submerging a microelectromechanical system device in water, wherein the microelectromechanical system device includes a sacrificial layer deposited between a portion of a structural layer that is to be freed for movement and a base; andanodically etching the sacrificial layer from the microelectromechanical system device to free the portion of the structural layer for movement.2. The method of claim 1 , wherein the step of anodically etching comprises:submerging an electrode in the water to provide a negative bias; andapplying a positive bias voltage to the sacrificial layer, causing the sacrificial layer to dissolve in the water.3. The method of claim 2 , wherein the sacrificial layer is chromium.4. The method of claim 2 , wherein the water is deionized.5. The method of claim 2 , wherein the structural layer includes a pattern of metallization.6. The method of claim 5 , wherein the ...

Method of controlling mems variable capacitor and integrated circuit device

According to one embodiment, a method of controlling a MEMS variable capacitor includes first and second electrodes, and having a capacitance varying according to a voltage applied between the first and second electrodes, the method includes applying a voltage between the first and second electrodes, evaluating whether the capacitance of the MEMS variable capacitor satisfies a predetermined condition while the voltage is being applied between the first and second electrodes, and determining that the voltage applied between the first and second electrodes is a voltage which should be applied therebetween, on a condition that the capacitance of the MEMS variable capacitor is evaluated as satisfying the predetermined condition.

METHODS FOR FABRICATING ISOLATED MICRO- OR NANO-STRUCTURES USING SOFT OR IMPRINT LITHOGRAPHY

The presently disclosed subject matter describes the use of fluorinated elastomer-based materials, in particular perfluoropolyether (PFPE)-based materials, in high-resolution soft or imprint lithographic applications, such as micro- and nanoscale replica molding, and the first nano-contact molding of organic materials to generate high fidelity features using an elastomeric mold. Accordingly, the presently disclosed subject matter describes a method for producing free-standing, isolated nanostructures of any shape using soft or imprint lithography technique. 120.-. (canceled)21. A pharmaceutical composition of delivery particles , comprising:a plurality of uniform micro or nano sized delivery particles comprising a pharmaceutically or therapeutically active agent present throughout the delivery particle, wherein each delivery particle of the plurality has a substantially uniform three-dimensional shape having parallel lateral edges and parallel top and bottom edges in cross-section and wherein the size of each delivery particle of the plurality is less than about 100 micrometers in a broadest dimension.22. The pharmaceutical composition of claim 21 , wherein each delivery particle of the plurality further comprises a degradable material.23. The pharmaceutical composition of claim 21 , wherein the broadest dimension is less than about 10 micrometers.24. The pharmaceutical composition of claim 21 , wherein the broadest dimension is less than about 3 micrometers.25. The pharmaceutical composition of claim 21 , wherein the broadest dimension is less than about 500 nanometers.26. The pharmaceutical composition of claim 21 , wherein the broadest dimension is less than about 200 nanometers.27. The pharmaceutical composition of claim 21 , wherein the shape mirrors the shape of a mold.28. The pharmaceutical composition of claim 21 , wherein each delivery particle of the plurality is free-standing.29. The pharmaceutical composition of claim 21 , wherein the pharmaceutical ...

Sensor with integrated heater

A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.

Packaged MEMS Device and Method of Calibrating a Packaged MEMS Device

A packaged MEMS device and a method of calibrating a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device comprises a carrier, a MEMS device disposed on the substrate, a signal processing device disposed on the carrier, a validation circuit disposed on the carrier; and an encapsulation disposed on the carrier, wherein the encapsulation encapsulates the MEMS device, the signal processing device and the memory element.

ULTRA-HIGH SPEED ANISOTROPIC REACTIVE ION ETCHING

A system and method for reactive ion etching (RIE) system of a material is provided. The system includes a plasma chamber comprising a plasma source and a gas inlet, a diffusion chamber comprising a substrate holder for supporting a substrate with a surface comprising the material and a gas diffuser, and a source of a processing gas coupled to the gas diffuser. In the system and method, at least one radical of the processing gas is reactive with the material to perform etching of the material, the gas diffuser is configured to introduce the processing gas into the processing region, and the substrate holder comprises an electrode that can be selectively biased to draw ions generated by the plasma source into the processing region to interact with the at least one processing gas to generate the at least one radical at the surface. 1. A system for reactive ion etching (RIE) system of a material , comprising:a plasma chamber comprising a plasma source and a gas inlet; anda diffusion chamber comprising a substrate holder for supporting a substrate with a surface comprising the material and a gas diffuser; anda source of at least one processing gas coupled to the gas diffuser,wherein at least one radical of the at least one processing gas is reactive with the material to perform etching of the material, wherein the substrate holder is configured to support the substrate within a processing region of the diffusion chamber, wherein the gas diffuser is configured to introduce the at least one processing gas into the processing region, and wherein the substrate holder comprises an electrode that can be selectively biased to draw ions generated by the plasma source into the processing region to interact with the at least one processing gas to generate the at least one radical at the surface.2. The RIE system of claim 1 , wherein the plasma source comprises a high density plasma source.3. The RIE system of claim 1 , wherein the high density plasma source comprises one of an ...

Mems Manufacturing System and Mems Manufacturing Method

In a calculator in a MEMS manufacturing system, a stage control unit inclines a stage based on a stage angle 1 setting a stage inclination angle and a stage angle 2 of the inclination angle different from the stage angle 1. A stage-angle calculation unit calculates the stage inclination angles from first and second images acquired by a SEM apparatus when the stage control unit sets the stage at the stage angles 1 and 2. A 3D-data creation unit creates three-dimensional device data from a third image that is a device image acquired when the stage is set at the stage angle 1 and a fourth image that is a device image acquired when the stage is set at the stage angle 2. When the three-dimensional device data is created, a correction value calculated from the stage angles 1 and 2 and the first and second images is used.

Simplified mems device fabrication process

A simplified MEMS fabrication process and MEMS device is provided that allows for cheaper and lighter-weight MEMS devices to be fabricated. The process comprises etching a plurality of holes or other feature patterns into a MEMS device, and then etching away the underlying wafer such that, after the etching process, the MEMS device is the required thickness and the individual die are separated, avoiding the extra steps of wafer thinning and die dicing. By etching trenches into the substrate wafer and filling them with a MEMS base material, sophisticated taller MEMS devices with larger force may be made.

Micro Devices Formed by Flex Circuit Substrates

Disclosed is a flexible electronic circuit substrate that includes a device that is fabricated from layers of the flexible electronic circuit substrate as part of construction of the flexible electronic circuit substrate. Such devices could be functional units such as micro electro mechanical devices (MEMS) devices such as micro-accelerometer sensor elements, micro flow sensors, micro pressure sensors, etc. 123-. (canceled)24. A flexible circuit comprises:a flexible substrate comprised of a plurality of layers of one or more materials, with the plurality of layers adhered together, and with at least a first set of the plurality of layers having patterned electrical conductors thereon having a configuration to receive one or more electronic circuit components; anda micro electro mechanical device within the flexible substrate and comprised of a second set of the plurality of layers of the flexible substrate.25. The flexible circuit of wherein the micro electro mechanical device is disposed within the flexible substrate and comprised of the layers of the second set of the plurality of layers claim 24 , with some of the layers of the second set further having conductive layers thereon.26. The flexible circuit of wherein at least some of the plurality of layers of the material are layers comprising a flexible material and at least some of the plurality of layers of the flexible material have conductive layers thereon.27. The flexible circuit of wherein the micro electro mechanical device is an accelerometer device disposed within the flexible substrate.28. The flexible circuit of wherein the accelerometer comprising the second set of the plurality of layers has a compartment through a first group of the second set claim 27 , a first layer of the second set of layers supporting a first electrode and at second layer of the second set layers supporting a second electrode; and with the accelerometer further comprising:a cantilever beam having a portion disposed in alignment ...

Mass Transfer Tool with High Productivity

Mass transfer tools and methods for high density transfer of arrays of micro devices are described. In an embodiment, a mass transfer tool includes a plurality of articulating transfer head assemblies coupled with a main translation track, where each articulating transfer head assembly is translatable along the main translation track between a donor substrate stage and a receiving substrate stage.

ADHESIVE TAPE SEPARATING TOOL, MANUFACTURING APPARATUS OF SEMICONDUCTOR CHIP, MANUFACTURING APPARATUS OF MEMS DEVICE MANUFACTURING APPARATUS OF LIQUID EJECTING HEAD, AND SEPARATING METHOD OF ADHESIVE TAPE

Provided is an adhesive tape separating tool which separates adhesive tape bonded to one face of a work which includes an opening on the one face from the work, in which a protrusion portion forming region in which a plurality of protrusion portions are formed is provided on a face on a side which comes into contact with the work in the tape separating tool, and the protrusion portion forming region is disposed at a position separated from a position facing the opening on the one face of the work. 1. An adhesive tape separating tool which separates adhesive tape bonded to one face of a work including an opening on the one face , from the work ,wherein a protrusion portion forming region in which a plurality of protrusion portions are formed is provided on a face on a side which comes into contact with the work in the tape separating tool, andwherein the protrusion portion forming region is disposed at a position separated from a position facing the opening on the one face of the work.2. The adhesive tape separating tool according to claim 1 ,wherein an opening group in which a plurality of the openings are aligned in a first direction is formed on one face of the work, andwherein the adhesive tape separating tool includes a protrusion portion at each of positions corresponding to both sides of the opening group in the first direction.3. A manufacturing apparatus of a semiconductor chip in which adhesive tape bonded to one face of a semiconductor chip claim 1 , as a work including an opening on one face is separated from the semiconductor chip claim 1 , the apparatus comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the adhesive tape separating tool according to .'}4. A manufacturing apparatus of a semiconductor chip in which adhesive tape bonded to one face of a semiconductor chip claim 1 , as a work including an opening on one face is separated from the semiconductor chip claim 1 , the apparatus comprising:{'claim-ref': {'@idref': 'CLM-00002', 'claim 2 ...

Compliant electrostatic transfer head with defined cavity

A compliant electrostatic transfer head and method of forming a compliant electrostatic transfer head are described. In an embodiment, a compliant electrostatic transfer head includes a base substrate, a cavity template layer on the base substrate, a first confinement layer between the base substrate and the cavity template layer, and a patterned device layer on the cavity template layer. The patterned device layer includes an electrode that is deflectable toward a cavity in the cavity template layer. In an embodiment, a second confinement layer is between the cavity template layer and the patterned device layer.

METHOD OF FABRICATING MAGNETICALLY ACTUATED ARTIFICIAL CILIA

Provided is a method of fabricating magnetic cilia including the following steps. Step (A): A mold is provided in which a plurality of micro-channels are formed, wherein the aperture of each of the micro-channels is between 50 μm and 350 μm, and the depth of each of the micro-channels is between 500 μm and 3,500 μm. Step (B): A raw material is spread onto the mold and filled into each of the micro-channels, wherein the raw material includes a polymer and magnetic particles dispersed therein. Step (C): A heat treatment is performed to harden the raw material in each of the micro-channels into a magnetic cilium. Step (D): A mold release process is performed to isolate each of the magnetic cilia from each of the micro-channels. 1. A method of fabricating magnetically actuated artificial cilia , comprising:(A) providing a mold in which a plurality of micro-channels are formed, wherein an aperture of each of the micro-channels is between 50 μm and 350 μm, and a depth of each of the micro-channels is between 500 μm and 3,500 μm;(B) spreading a raw material onto the mold and filling the raw material into each of the micro-channels, wherein the raw material comprises a polymer and magnetic particles dispersed therein;(C) performing a heat treatment to harden the raw material in each of the micro-channels into a magnetic cilium; and(D) performing a mold release process to isolate each of the magnetic cilia from each of the micro-channels.2. The method of claim 1 , wherein when performing step (B) claim 1 , the mold with the raw material spread thereon is evacuated.3. The method of claim 2 , wherein when performing step (B) claim 2 , a magnetic field is applied to the mold with the raw material spread thereon claim 2 , and a direction of the magnetic field is substantially parallel to an extending direction of the micro-channels.4. The method of claim 3 , further comprising claim 3 , after step (B) and before step (C) claim 3 , (E) removing the raw material located on the ...

CIRCUIT BOARD MODULE COMPRISING A CONTINUOUS CAVITY, ASSOCIATED SONIC TRANSDUCER ASSEMBLY, AND PRODUCTION METHOD

The invention relates to a circuit board module () for a sound transducer assembly () for generating and/or detecting sound waves in the audible wavelength spectrum, with a circuit board (), which features a recess () with a first opening (), and at least a part of a MEMS sound transducer (), which is arranged in the area of the first opening (), such that the recess () at least partially forms a cavity () of the MEMS sound transducer (). In accordance with the invention, the recess () features a second opening () opposite to the first opening (), such that the recess () extends completely through the circuit board (). In addition, the invention relates to a sound transducer assembly () with such a circuit board module () along with a method for manufacturing such sound transducer assembly (). 1. Circuit board module for a sound transducer assembly for generating and/or detecting sound waves in the audible wavelength spectrum , comprising:a circuit board, which defines a recess with a first opening,a MEMS sound transducer, at least part of which is arranged in the area of the first opening, such that the recess at least partially forms a cavity of the MEMS sound transducer, wherein the recess includes a second opening opposite to the first opening, such that the recess extends completely through the circuit board, anda first housing part, which closes off the cavity in the area of the second opening.215-. (canceled) The present invention relates to a circuit board module for a sound transducer assembly for generating and/or detecting sound waves in the audible wavelength spectrum with a circuit board, which features a recess with a first opening, and with at least a part of a MEMS sound transducer, which is arranged in the area of the first opening, such that the recess at least partially forms a cavity of the MEMS sound transducer.Furthermore, the invention relates to a sound transducer assembly with a circuit board module, which comprises a circuit board with a ...

Substrate plate for mems devices

A substrate plate is provided for at least one MEMS device to be mounted thereon. The MEMS device has a certain footprint on the substrate plate, and the substrate plate has a pattern of electrically conductive leads to be connected to electric components of the MEMS device. The pattern forms contact pads within the footprint of the MEMS device and includes at least one lead structure that extends on the substrate plate outside of the footprint of the MEMS device and connects a number of the contact pads to an extra contact pad. The lead structure is a shunt bar that interconnects a plurality of contact pads of the MEMS device and is arranged to be removed by means of a dicing cut separating the substrate plate into a plurality of chip-sized units. At least a major part of the extra contact pad is formed within the footprint of one of the MEMS devices.

ELECTRIC DEVICE, IN PARTICULAR A MICROPHONE HAVING RE-ADJUSTABLE SENSITIVITY, AND ADJUSTMENT METHOD

In order to adjust an electric device, it is proposed to integrate a programmable memory unit into the device and to address said programmable memory unit without enlarging the footprint, via contact areas that are obtained by dividing previous contact areas. In this case, an adjustment value in particular for compensating for a fault tolerance is fed into the memory unit, an operating parameter being readjusted with the aid of said adjustment value. In each case two divided contact areas are short-circuited via a common soldering location during the mounting of the device. 2. The device according to claim 1 ,wherein, from the smaller contact areas assigned to a common grid area, respectively one is connected to the programmable memory unit and the respective other smaller contact area is provided for the proper function of the device.3. The device according to claim 1 ,embodied as a microphone that supplies an analog output signal,wherein the integrated circuit regulates the operation and the sensitivity of the microphone and also the strength of the output signal,wherein the programmable memory unit makes available an adjustment value that can be set by the programming, which adjustment value is forwarded to the integrated circuit in order to adapt at least one operating parameter in accordance with the adjustment value.4. The device according to claim 2 ,wherein exactly three grid areas and thus three soldering locations are provided via which the device can be connected and via which the proper operation of the device is possible,wherein contact areas for ground, supply voltage and for the signal output comprise in three different soldering locations,wherein the contact areas for ground and supply voltage are smaller contact areas and share the grid area with in each case a smaller area contact area for a clock signal and a program signal input, which are connected to the programmable memory unit.5. The device according to claim 1 ,wherein the programmable ...

Method and device of mems process control monitoring and packaged mems with different cavity pressures

A method for fabricating an integrated MEMS device and the resulting structure therefore. A control process monitor comprising a MEMS membrane cover can be provided within an integrated CMOS-MEMS package to monitor package leaking or outgassing. The MEMS membrane cover can separate an upper cavity region subject to leaking from a lower cavity subject to outgassing. Differential changes in pressure between these cavities can be detecting by monitoring the deflection of the membrane cover via a plurality of displacement sensors. An integrated MEMS device can be fabricated with a first and second MEMS device configured with a first and second MEMS cavity, respectively. The separate cavities can be formed via etching a capping structure to configure each cavity with a separate cavity volume. By utilizing an outgassing characteristic of a CMOS layer within the integrated MEMS device, the first and second MEMS cavities can be configured with different cavity pressures.

METHODOLOGY AND SYSTEM FOR WAFER-LEVEL TESTING OF MEMS PRESSURE SENSORS

A method for testing a plurality of pressure sensors on a device wafer includes placing a diaphragm of one of the pressure sensors on the device wafer in proximity to a nozzle of a test system. A pneumatic pressure stimulus is applied to the diaphragm via an outlet of the nozzle and a cavity pressure is measured within a cavity associated with the pressure sensor in response to application of the pneumatic pressure stimulus. The pneumatic pressure stimulus within the cavity corresponds to the pressure applied to the diaphragm. Methodology is executed to test the strength and/or stiffness of the diaphragm. Additionally, the methodology and test system can be utilized to determine an individual calibration factor for each pressure sensor on the device wafer. 1. A method for testing a plurality of pressure sensors on a device wafer comprising:placing a diaphragm of one of said pressure sensors on said device wafer in proximity to a nozzle of a test system;applying a pneumatic pressure stimulus to said diaphragm via an outlet of said nozzle; andmeasuring a cavity pressure within a cavity associated with said one of said pressure sensors in response to said applying said pneumatic pressure stimulus.2. The method of wherein said placing comprises:retaining said device wafer in said test system such that said device wafer is substantially parallel to an X-Y plane of said test system; andmoving at least one of said nozzle and said device wafer along a Z-axis substantially perpendicular to said X-Y plane to place said diaphragm of one of said pressure sensors in proximity to said nozzle.3. The method of wherein said pressure sensors are located on a first side of a substrate portion of said device wafer claim 1 , a port extends through said substrate to said cavity claim 1 , and said method further comprises:positioning a seal element surrounding said outlet of said nozzle in contact with a second side of said substrate portion surrounding said port; andapplying mechanical ...

METHOD AND DEVICE OF MEMS PROCESS CONTROL MONITORING AND PACKAGED MEMS WITH DIFFERENT CAVITY PRESSURES

A method for fabricating an integrated MEMS device and the resulting structure therefore. A control process monitor comprising a MEMS membrane cover can be provided within an integrated CMOS-MEMS package to monitor package leaking or outgassing. The MEMS membrane cover can separate an upper cavity region subject to leaking from a lower cavity subject to outgassing. Differential changes in pressure between these cavities can be detecting by monitoring the deflection of the membrane cover via a plurality of displacement sensors. An integrated MEMS device can be fabricated with a first and second MEMS device configured with a first and second MEMS cavity, respectively. The separate cavities can be formed via etching a capping structure to configure each cavity with a separate cavity volume. By utilizing an outgassing characteristic of a CMOS layer within the integrated MEMS device, the first and second MEMS cavities can be configured with different cavity pressures. 1. A method for fabricating an integrated MEMS (Micro Electro Mechanical System) device comprising:receiving a semiconductor substrate having a plurality of CMOS devices formed thereon, wherein the semiconductor substrate includes an upper surface, and wherein the upper surface of the semiconductor substrate is associated with an outgassing characteristic;forming a material layer on top of the semiconductor substrate, wherein the material layer includes a first lower cavity and a second lower cavity;forming a MEMS material layer comprising a first MEMS device on top of the first lower cavity and a second MEMS device on top of the second lower cavity;forming a capping structure comprising a plurality of caps including a first upper cap and a second upper cap;coupling the capping structure to the MEMS material layer at a bonding interface, wherein the first upper cap and first lower cavity form a first MEMS cavity, wherein the first MEMS device is disposed therein, wherein the second upper cap and the second ...

MULTIPASS TRANSFER SURFACE FOR DYNAMIC ASSEMBLY

A method of manufacturing an intermediate transfer surface includes depositing an array of etch stops on a conductive surface, etching the conductive surface to form mesas of the conductive surface separated by gaps, and coating the mesas with a dielectric coating. A method of performing microassembly includes forming an assembly of particles on an assembly plane, providing an intermediate transfer surface having an array of electrodes, applying a bias to the intermediate transfer surface to form an electrostatic field between the assembly plane and the intermediate transfer surface, and moving the intermediate transfer surface towards the assembly surface until the electrostatic field strength is strong enough to cause transfer of the assembly to the intermediate transfer surface. 1. A method of manufacturing an intermediate transfer surface , comprising:depositing an array of etch stops on a conductive surface;etching the conductive surface to form mesas of the conductive surface separated by gaps; andcoating the mesas with a dielectric coating.2. The method as claimed in claim 1 , further comprising depositing dielectric into the gaps.3. The method as claimed in claim 2 , wherein depositing dielectric into the gaps comprises depositing enough dielectric to planarize the dielectric with the mesas.4. The method as claimed in claim 2 , wherein depositing dielectric into the gaps comprises depositing dielectric to leave gaps.5. The method as claimed in claim 1 , further comprising removing the etch stops;6. The method as claimed in claim 1 , further comprising connecting the mesas of the conductive surface to a voltage source.7. The method of claim 6 , wherein connecting the mesas to the voltage source comprises connecting the mesas to a single electrical connection.8. A method of performing microassembly claim 6 , comprising:forming an assembly of particles on an assembly plane;providing an intermediate transfer surface having an array of electrodes;applying a bias ...

Method of nanoscale patterning based on controlled pinhole formation

A method of nanoscale patterning is disclosed. The method comprises: mixing predetermined amounts of a first solvent and a second solvent to generate a solvent, the first solvent and the second solvent being immiscible with each other; dissolving a solute material in the solvent to generate a coating material, the solute material having solubility that is higher in the first solvent than in the second solvent; and applying the coating material onto a substrate to form a plurality of pinholes in the coating material. The formation of the plurality of pinholes is associated with suspension drops mostly comprised of the second solvent, separated from the solute material dissolved in the first solvent, in the coating material. A method of making a stamp with a nanoscale pattern is also disclosed based on the above method.

METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT

A method for producing a micromechanical component is provided, In a preparatory step, a substrate device of the micromechanical component and/or a cap device of the micromechanical component is patterned. In a first sub-step, a first pressure and/or a first chemical composition being adjusted, and the substrate device and the cap device being connected to each other so that a first cavern is formed, sealed from an environment of the micromechanical component, the first pressure prevailing in the first cavity and/or the first chemical composition being enclosed. In a second sub-step, a second pressure and/or a second chemical composition being adjusted, and the substrate device and the cap device being connected to each other so that a second cavity is formed, sealed from the environment of the micromechanical component and from the first cavity, the second pressure prevailing in the second cavity and/or the second chemical composition being enclosed. 1. A method for producing a micromechanical component , the micromechanical component including a substrate device and a cap device , the method comprising:in a preparatory step, pattering at least one of the substrate device and the cap device;in a first sub-step, adjusting at least one of a first pressure and a first chemical composition adjusted, and connecting the substrate device and the cap device to each other in such a way that a first cavity is formed, which is sealed from an environment of the micromechanical component, at least one of the first pressure prevailing in the first cavity and the first chemical composition being enclosed;in a second sub-step, adjusting at least one of a second pressure and a second chemical composition, connecting the substrate device and the cap device to each other in such a way that a second cavity is formed, which is sealed from the environment of the micromechanical component and from the first cavity, at least one of the second pressure prevailing in the second cavity and ...

SYSTEM FOR WAFER-LEVEL TESTING OF MEMS PRESSURE SENSORS

A system for testing pressure sensors on a device wafer includes a tray for holding the device wafer. The tray includes a base having a surface, a spacer extending from the surface, and a tacky material disposed on the surface. The spacer holds the device wafer spaced apart from the surface of the base to form a chamber between the surface and the device wafer. A wafer chuck retains the tray and the device wafer under vacuum. The system further includes a nozzle and a seal element in fixed engagement with the nozzle. The seal element surrounds the outlet of the nozzle and is adapted for mechanical contact with the device wafer. An actuator is configured to place the nozzle and a diaphragm of one of the pressure sensors in proximity to one another, wherein a pneumatic pressure stimulus is applied to the diaphragm via an outlet of the nozzle. 1. A tray configured to hold a device wafer comprising:a base having a first surface; anda spacer extending from said first surface of said base, wherein said spacer is configured to hold said device wafer spaced apart from said first surface of said base to form a chamber between said first surface and said device wafer.2. The tray of wherein said spacer is located at a perimeter of said first surface of said base.3. The tray of wherein an exhaust hole extends through said base from said first surface to a second surface of said base.4. The tray of wherein said tray further comprises a groove extending from said exhaust hole along said second surface of said base to an outer perimeter of said tray claim 3 , said groove extending a depth into said base that is less than a thickness of said base.5. The tray of further comprising a screen extending across at least one of said exhaust hole and said groove.6. The tray of further comprising a tacky material is disposed on said first surface of said base.7. The tray of further comprising a rim located at an outer perimeter of said base claim 1 , said rim having a height that is ...

Method for manufacturing mems device, mems device, liquid ejecting head, and liquid ejecting apparatus

A method for manufacturing a MEMS device in which a plurality of substrates are joined in a stacked state and one face of faces defining a space formed in one substrate of the plurality of substrates is a movable region is disclosed.

Method For Wafer-Level Chip Scale Package Testing

The present disclosure discloses a method for wafer-level chip scale packaged wafer testing. The method comprises: dicing a wafer-level chip scale packaged wafer into a plurality of wafer strips each comprising a plurality of un-diced chip scale packaged devices; fixing the wafer strips onto a plurality of corresponding strip carriers respectively; testing the chip scale packaged devices of the wafer strips fixed onto the strip carriers by a testing equipment; and dicing the tested wafer strips into a plurality of individual chip scale packaged devices. Since the proposed method does not involve loading a multitude of diced chips into sockets one by one, but that a limited number of wafer strips are loaded onto corresponding strip carriers, flow jam is avoided.

METHODS FOR FABRICATING ISOLATED MICRO- OR NANO-STRUCTURES USING SOFT OR IMPRINT LITHOGRAPHY

The presently disclosed subject matter describes the use of fluorinated elastomer-based materials, in particular perfluoropolyether (PFPE)-based materials, in high-resolution soft or imprint lithographic applications, such as micro- and nanoscale replica molding, and the first nano-contact molding of organic materials to generate high fidelity features using an elastomeric mold. Accordingly, the presently disclosed subject matter describes a method for producing free-standing, isolated nanostructures of any shape using soft or imprint lithography technique. 1. A method for forming one or more particles , the method comprising:(a) providing a patterned template and a substrate, wherein the patterned template comprises a patterned template surface having a plurality of recessed areas formed therein; (i) the patterned template surface; and', '(ii) the plurality of recessed areas; and, '(b) disposing a volume of liquid material in or on at least one of (i) contacting the patterned template surface with the substrate and treating the liquid material; and', '(ii) treating the liquid material., '(c) forming one or more particles by one of2. The method of claim 1 , wherein the patterned template comprises a solvent resistant claim 1 , low surface energy polymeric material.3. The method of claim 1 , wherein the patterned template comprises a solvent resistant elastomeric material.4. The method of claim 1 , wherein at least one of the patterned template and substrate comprises a material selected from the group consisting of a perfluoropolyether material claim 1 , a fluoroolefin material claim 1 , an acrylate material claim 1 , a silicone material claim 1 , a styrenic material claim 1 , a fluorinated thermoplastic elastomer (TPE) claim 1 , a triazine fluoropolymer claim 1 , a perfluorocyclobutyl material claim 1 , a fluorinated epoxy resin claim 1 , and a fluorinated monomer or fluorinated oligomer that can be polymerized or crosslinked by a metathesis polymerization reaction ...

MICRO PICK UP ARRAY AND MANUFACTURING METHOD THEREOF

A micro pick-up array used to pick up a micro device is provided. The micro pick-up array includes a substrate, a pick-up structure, and a soft polymer layer. The pick-up structure is located on the substrate. The pick-up structure includes a cured photo sensitive material. The soft polymer layer covers the pick-up structure. A manufacturing method of a micro pick-up array is also provided. 1. A micro pick-up array used to pick up a micro device , the micro pick-up array comprises:a substrate;a pick-up structure located on the substrate, the pick-up structure being composed of a photo sensitive material; anda soft polymer layer covering the pick-up structure.2. The micro pick-up array of claim 1 , wherein a material of the soft polymer layer comprises polydimethylsiloxane or rubber.3. The micro pick-up array of claim 1 , wherein a side surface of the pick-up structure is stair-shaped.4. The micro pick-up array of claim 1 , wherein the pick-up structure has a recess claim 1 , and the soft polymer layer fills into the recess.5. The micro pick-up array of claim 4 , wherein the soft polymer layer fills up the recess.6. The micro pick-up array of claim 4 , wherein the recess in the pick-up structure penetrates through the pick-up structure claim 4 , and the soft polymer layer fills into the recess and is in contact with the substrate.7. The micro pick-up array of claim 4 , wherein a width of the recess in the pick-up structure is between 5 μm and 100 μm.8. The micro pick-up array of claim 4 , wherein a depth of the recess in the pick-up structure is between 5 μm and 20 μm.9. The micro pick-up array of claim 4 , wherein a thickness of the soft polymer layer aligned with the recess is between 10 μm and 50 μm.10. The micro pick-up array of claim 1 , wherein the photo sensitive material is a transparent material.11. A manufacturing method of a micro pick-up array claim 1 , comprising:providing a substrate;forming a pick-up structure on the substrate, the pick-up structure ...

MEMS DEVICE HAVING A RUGGED PACKAGE AND FABRICATION PROCESS THEREOF

A MEMS device formed by a substrate, having a surface; a MEMS structure arranged on the surface; a first coating region having a first Young's modulus, surrounding the MEMS structure at the top and at the sides and in contact with the surface of the substrate; and a second coating region having a second Young's modulus, surrounding the first coating region at the top and at the sides and in contact with the surface of the substrate. The first Young's modulus is higher than the second Young's modulus. 1. A MEMS device , comprising:a substrate having a surface;a MEMS structure arranged on the surface;a first coating region having a first Young's modulus, the first coating region on the surface of the substrate and covering the MEMS structure; anda second coating region having a second Young's modulus, the second coating region covering the first coating region,wherein the first Young's modulus is higher than the second Young's modulus.2. The device according to claim 1 , wherein the first Young's modulus is between 20 GPa and 30 GPa claim 1 , and the second Young's modulus is between 100 MPa and 5 GPa.3. The device according to claim 1 , wherein the first coating region comprises a polymeric resin.4. The device according to claim 1 , wherein the second coating region comprises a polymeric rubber.5. The device according to claim 1 , wherein the MEMS structure is electrically coupled to the substrate.6. The device according to claim 1 , wherein the MEMS structure comprises:an ASIC die arranged on the surface of the substrate; anda MEMS sensor die arranged on the ASIC die and electrically coupled to the ASIC die.7. A process comprising:coupling a MEMS structure to a surface of a substrate;forming a first coating region on the first surface and over the MEMS structure, the first coating region having a first Young's modulus; andforming a second coating region over the first coating region, the second coating region having a second Young's modulus,wherein the first Young's ...

SYSTEMS, DEVICES, AND METHODS FOR DIRECT-WRITE PRINTING OF ELONGATED NANOSTRUCTURES

The present disclosure is directed to tailoring the structure of freeform nanotube macrostructures through extrusion-based additive manufacturing for fabrication of planar and three-dimensional features and objects. Ink containing nanomaterials can be extruded into a fluid to precipitate into a fiber that can be used to form solid structures. The fluid can include a coagulant that promotes rapid solidification in the precipitation of fibers. The fluid can be disposed into a bath that is in fluid communication with the extruded ink. Systems and devices for executing such processes, are also provided. 1. A method of extruding inks that comprise suspensions of at least one of elongated nano-particles or elongated micro-particles , comprising:extruding an ink through a nozzle of a printing device into a fluid and onto at least one of a substrate, an object disposed on the substrate, or previously extruded ink, the ink comprising a mixture of at least one of nano-particles or micro-particles and a liquid, and the fluid comprising one or more materials; andmoving the nozzle in one or more degrees of freedom with respect to the substrate while extruding the ink into the fluid,wherein the ink coagulates after it contacts the fluid such that the ink forms a solid precipitate.2. The method of claim 1 , wherein extruding the ink through a nozzle of a printing device into the fluid further comprises continuously dispensing ink such that the ink forms a continuous thread upon coagulation.3. The method of claim 1 , further comprising adjusting a draw ratio associated with the extruded ink such that the overall fiber diameter is controlled.4. The method of claim 3 , further comprising adjusting the draw ratio or other parameters such that the nanostructures can be substantially aligned in the direction of motion of the nozzle relative to the substrate.5. The method of claim 3 , wherein adjusting a draw ratio comprises adjusting at least one of a flow rate of the extruded ink claim ...

METHOD FOR NANO-DRIPPING 1D, 2D OR 3D STRUCTURES ON A SUBSTRATE

A method for the production of nano- or microscaled ID, 2D and/or 3D depositions from an solution (), by means of a liquid reservoir () for holding the ink with an outer diameter (,D) of at least 50 nm, is proposed, wherein there is provided an electrode ( or ) in contact with said ink () in said capillary (), and wherein there is a counter electrode in and/or on and/or below and/or above a substrate () onto which the depositions are to be produced, including the steps of: i) keeping the electrode () and the counter electrode () on an essentially equal potential; ii) establishing a potential difference between the electrode () and the counter electrode () leading to the growth of an ink meniscus () at the nozzle () and to the ejection of droplets () at this meniscus with a homogeneous size smaller than the meniscus size () at a homogenous ejection frequency; keeping the voltage applied while the continuously dried droplets leave behind the dispersed material which leads a structure to emerge with essentially the same diameter as a single droplet, wherein the distance between the substrate () and the nozzle () is smaller than or equal to 20 times the meniscus diameter at least at the moment of nano-droplet ejection (); wherein the conductivity of the ink () is high enough to stabilize the liquid meniscus during droplet ejection; 1. A method for the production of 1D , 2D and/or 3D solid depositions from a nano-material loaded liquid , by means of a liquid reservoir for holding the ink with a nozzle having an opening diameter of at least 50 nm ,wherein there is provided an electrode in contact with said ink in or at said liquid reservoir, and wherein there is a counter electrode in, on, below, or above a substrate onto which the depositions are to be produced, including the steps of:i) keeping the electrode and the counter electrode on an essentially equal potential or at a potential difference below the minimal voltage necessary for droplet ejection;ii) establishing a ...

3D Printing Of Gel Networks

The invention provides a process for producing a gel network, which gel network comprises a plurality of joined gel objects, which process comprises: forming a plurality of gel objects in one or more microfluidic channels; dispensing the gel objects from the one or more microfluidic channels into a region for producing the network; and contacting each gel object with at least one other gel object in said region to join each gel object to at least one other gel object at a region of contact between the gel objects. The invention also provides a network of joined gel objects, comprising a plurality of gel objects, wherein each gel object is joined to an adjacent gel object at a region of contact between the gel objects. Also provided are various possible uses of the gel network.

REDUNDANT SENSOR SYSTEM WITH SELF-TEST OF ELECTROMECHANICAL STRUCTURES

A sensor system includes first and second MEMS structures and a processing circuit. The first and second MEMS structures are configured to produce first and second output signals, respectively, in response to a physical stimulus. A method performed by the processing circuit entails receiving the first and second output signals and detecting a defective one of the first and second MEMS structures from the first and second output signals by determining that the first and second output signals are uncorrelated to one another. The method further entails utilizing only the first or the second output signal from a non-defective one of the MEMS structures to produce a processed output signal when one of the MEMS structures is determined to be defective and utilizing the first and second output signals from both of the MEMS structures to produce the processed output signal when neither of the MEMS structures is defective. 1. A method of testing first and second microelectromechanical systems (MEMS) structures in a MEMS sensor system , the first MEMS structure being configured to produce a first output signal in response to a first physical stimulus , and the second MEMS structure being configured to produce a second output signal in response to a second physical stimulus , the method comprising:receiving the first and second output signals at a processing circuit; anddetecting defective one of the first and second MEMS structures from the first and second output signals by determining that the first and second output signals are uncorrelated to one another.2. The method of claim 1 , further comprising utilizing only the first output signal or the second output signal from a non-defective one of the first and second MEMS structures to produce a processed output signal when the detecting operation detects the defective one of the first and second MEMS structures.3. The method of claim 2 , further comprising increasing a voltage gain of the first output signal or the second ...

STRUCTURE AND METHODOLOGY FOR DETECTING DEFECTS DURING MEMS DEVICE PRODUCTION

A wafer includes a process control monitor (PCM) structure formed on a substrate. The PCM structure includes detection and reference structures. The detection structure includes a first electrically conductive line arrangement formed in a first structural layer on the substrate and a first protection layer surrounding the first electrically conductive line arrangement. The reference structure includes a second electrically conductive line arrangement formed in the first structural layer on the substrate, a second protection layer surrounding the second electrically conductive line arrangement, an insulator material formed overlying the second electrically conductive line arrangement and the second protection layer, and a second structural layer overlying the insulator material. The insulator material does not overlie the detection structure. Methodology entails measuring a capacitance between the detection structure and the substrate, measuring another capacitance between the reference structure and substrate, and comparing the two capacitances to determine whether defects exist. 1. A method for process control monitoring of a wafer , the wafer including a plurality of microelectromechanical systems (MEMS) devices formed thereon , the method comprising:measuring a first capacitance value between a first electrically conductive line arrangement of a detection structure and a substrate of the wafer, the detection structure having the first electrically conductive line arrangement formed in a first structural layer on the substrate and a first protection layer surrounding the first electrically conductive line arrangement;measuring a second capacitance value between a second electrically conductive line arrangement of a reference structure and the substrate of the wafer, the reference structure including the second electrically conductive line arrangement formed in the first structural layer on the substrate, a second protection layer surrounding the second ...

Compliant bipolar micro device transfer head with silicon electrodes

A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes.

Circuit for detection of failure of movable mems mirror

Disclosed herein is a circuit for determining failure of a movable MEMS mirror. The circuit includes a mirror position sensor associated with the movable MEMS mirror and that generates an analog output as a function of angular position of the movable MEMS mirror. An analog to digital converter converts the analog output from the mirror position sensor to a digital mirror sense signal. Failure detection circuitry calculates a difference between the digital mirror sense signal at a first instant in time and the digital mirror sense signal at a second instant in time, determines whether the difference exceeds a threshold, and indicates failure of the movable MEMS mirror as a function of the difference failing to exceed the threshold.

METHOD FOR MANUFACTURING A STRUCTURED SURFACE

A method is described for manufacturing a micromechanical structure, in which a structured surface is created in a substrate by an etching method in a first method step, and residues are at least partially removed from the structured surface in a second method step. In the second method step, an ambient pressure for the substrate which is lower than 60 Pa is set and a substrate temperature which is higher than 150° C. is set. 1. A method for manufacturing a micromechanical structure , comprising:creating a structured surface in a substrate by an etching method; andat least partially removing residues from the structured surface;during the removing step, setting an ambient pressure for the substrate that is lower than 60 Pa and setting a substrate temperature that is higher than 150° C.2. The method as recited in claim 1 , wherein in the removing step at least one of:the ambient pressure is lower than 3 Pa, andthe substrate temperature is higher than 175° C.3. The method as recited in claim 1 , wherein the ambient pressure is lower than 2 Pa.4. The method as recited in claim 1 , wherein the ambient pressure is between 0.6 Pa and 1.3 Pa.5. The method as recited in claim 1 , wherein the substrate temperature is higher than 190° C.6. The method as recited in claim 1 , wherein the substrate temperature is between 200° C. and 400° C.7. The method as recited in claim 1 , wherein a plasma is used at least partially to remove the residues claim 1 , the plasma at least partially containing O claim 1 , H claim 1 , N claim 1 , forming gas or ammonia.8. The method as recited in claim 1 , wherein O claim 1 , H claim 1 , N claim 1 , forming gas or ammonia is supplied during the removing step.9. The method as recited in claim 1 , wherein the substrate includes a sacrificial layer that is removed at least partially during the removing step.10. The method as recited in claim 1 , wherein the substrate includes at least partially one of silicon claim 1 , an oxide claim 1 , a metal ...

UNIVERSAL HARDWARE PLATFORM AND TOOLSET FOR OPERATING AND FABRICATING MICROFLUIDIC DEVICES

A microfluidic device platform may include a valve manifold adapted to deliver a programmable pressure to a plurality of ports, a cell chamber having programmable environmental control, and a chip-to-world interface. 1. A modular control system for operating a pressure-driven microfluidic device , comprising:a base module including both electrical and pneumatic connections;one or more pneumatic control modules including a plurality of pneumatic output ports; andan electrical bus and a pneumatic bus common to the base module and the one or more pneumatic control modules.2. The modular control system of claim 1 , including a modular digital environmental chamber controller claim 1 , comprising:one or more pneumatic outputs supplying chamber atmosphere gas;one or more pneumatic solenoid valves;a reprogrammable microcontroller;external connectors for remote digital environmental sensors capable of powering remote resistive loads;pneumatic and electrical bus connections configured to be shared among several modules; andan additively-manufactured manifold body with internal pneumatic circuits connecting the one or more pneumatic solenoid valves, the one or more pneumatic outputs, and a pneumatic bus.3. The modular digital environmental chamber controller of claim 2 , wherein the microcontroller is capable of recording diagnostic data indicating an operational condition of the environmental chamber controller4. The modular control system of claim 1 , including an environmental chamber comprising:an environmental basin;a gas conditioning basin;one or more resistive heaters attached to the environmental basin and the gas conditioning basin;an input for a supply of chamber atmosphere gas;one or more digital sensors to monitor environmental conditions; andan additively-manufactured manifold body with internal pneumatic circuits connecting the environmental basin, gas conditioning basin, lid, and supply of chamber atmosphere gas.5. The environmental chamber of claim 4 , wherein ...

System and Method for Wafer-Scale Fabrication of Free Standing Mechanical and Photonic Structures By Ion Beam Etching

A method for fabrication of free standing mechanical and photonic structures is presented. A resist mask is applied to a bulk substrate. The bulk substrate is attached to a movable platform. The bulk substrate is exposed to an ion stream produced by a reactive ion beam etching source. The platform is moved relative to the ion stream to facilitate undercutting a portion of the bulk substrate otherwise shielded by the mask. 1. A method for fabrication of flee standing mechanical and photonic structures , comprising the steps of:applying a resist mask to a bulk substrate;attaching the bulk substrate to a movable platform;exposing the bulk substrate to an ion stream directed at the movable platform produced by a collimated reactive ion beam etching source; andmoving the platform relative to the ion stream to facilitate undercutting a portion of the bulk substrate otherwise shielded by the mask,2. The method of claim 1 , wherein the bulk substrate comprises diamond.3. The method of claim 1 , wherein moving the platform comprises laterally displacing the platform in a plane substantially horizontal to the ion stream.4. The method of claim 1 , wherein moving the platform comprises tilting the platform relative to a plane substantially horizontal to the ion stream.5. The method of claim 4 , wherein a tilt angle of the platform relative to the ion stream is in the range of 10 degrees to 80 degrees.6. The method of claim 4 , wherein moving the platform further comprises rotating the platform relative to the ion stream.7. The method of claim 3 , further comprising the step of adjusting the ion stream according to the orientation and/or position of the platform relative to the ion stream.8. The method of claim 1 , wherein the ion stream comprises oxygen ions claim 1 , and the substrate comprises diamond.9. The method of claim 1 , wherein the ion stream comprises fluorine ions claim 1 , and the substrate comprises quartz.10. The method according to claim 1 , wherein the ion ...

Methods for manufacturing micromechanical components and method for manufacturing a mould insert component

Method of manufacturing a micromechanical component intended to cooperate with another micromechanical component, the method comprising the steps of providing a substrate, forming a mould on said substrate, said mould defining sidewalls arranged to delimit said micromechanical component, providing particles on at least said sidewalls, depositing a metal in said mould so as to form said micromechanical component, and liberating said micromechanical component from said mould and removing said particles.

METHOD FOR MANUFACTURING A TIMEPIECE COMPONENT

The invention relates to a method which comprises the steps of providing a plate () made of a micromachinable material, forming the timepiece component () with at least one attachment () for keeping the component attached to the rest of the plate (), by etching the plate (); and creating, along a desired breakage line of the attachment, a pre-detachment area () comprising at least one gap () obtained by etching into the body of the plate (). 116-. (canceled)17. A sheet of micromachinable material comprising a horology component and at least one attachment tethering the horology component to a remainder of the sheet , the sheet having a uniform thickness , the at least one attachment being formed by openings etched into the thickness of the sheet ,wherein the sheet also comprises a fracture zone for predetachment of the horology component comprising, along a line of desired fracture of the attachment, at least one opening etched into the thickness of the sheet,wherein the depth of the opening or of the openings is less than or equal to 90% of the thickness of the sheet, and greater than or equal to half the thickness of the sheet,wherein the line of desired fracture extends in a widthwise direction of the attachment at a connecting end of the attachment that connect the attachment to the component and is aligned with a free edge of the component adjacent the fracture zone.18. The sheet as claimed in claim 17 , wherein the free edge of the horology component has been formed by etching the sheet throughout the entire thickness of the sheet and the opening has been obtained by etching part of the thickness of the sheet.19. The sheet as claimed in claim 18 , wherein the etched free edge and the etched opening have been obtained by deep reactive ion etching.20. The sheet as claimed in claim 17 , wherein the opening extends along the entirety of the line of desired fracture.21. The sheet as claimed in claim 17 , wherein the predetachment zone comprises a plurality of ...

MICROFLUIDIC DEVICE AND METHOD FOR PRODUCING A MICROFLUIDIC DEVICE

A microfluidic device includes at least two layers arranged one above the other, a membrane which is arranged between the at least two layers, a cavity in one of the at least two layers, and a channel in the other of the at least two layers. The membrane is arranged so as to be expandable between the cavity and the channel. The membrane is expandable into at least one specified displacement volume. 1. A microfluidic device , comprising:at least two layers arranged above one another;an elastic diaphragm arranged between the at least two layers;a cavity arranged in a first layer of the at least two layers; andat least one duct arranged in a second layer of the at least two layers, the at least one duct configured to act upon the diaphragm with pressure,wherein the diaphragm is arranged so as to be expandable into at least one stipulated displacement volume.2. The microfluidic device as claimed in claim 1 , further comprising a limiting mechanism arranged and configured to restrict the at least one displacement volume.3. The microfluidic device as claimed in claim 2 , wherein the limiting mechanism is configured to limit expansion of the diaphragm.4. The microfluidic device as claimed in claim 2 , wherein the limiting mechanism is configured as a clearance in at least one of the at least two layers.5. The microfluidic device as claimed in claim 2 , wherein the limiting mechanism is formed by extending a fixing of the diaphragm on at least one of the at least two layers.6. The microfluidic device as claimed in claim 1 , further comprising a connecting duct arranged between the cavity and the at least one displacement volume.7. The microfluidic device as claimed in claim 6 , wherein the connecting duct is formed by at least one web.8. The microfluidic device as claimed in claim 1 , wherein at least one displacement volume is configured as the at least one duct.9. The microfluidic device as claimed in claim 4 , wherein the clearance includes rounded edges.10. The ...

Integrated optical probe card and system for batch testing of optical mems structures with in-plane optical axis using micro-optical bench components

Aspects of the disclosure relate to an integrated optical probe card and a system for performing wafer testing of optical micro-electro-mechanical systems (MEMS) structures with an in-plane optical axis. On-wafer optical screening of optical MEMS structures may be performed utilizing one or more micro-optical bench components to redirect light between an out-of-plane direction that is perpendicular to the in-plane optical axis to an in-plane direction that is parallel to the in-plane optical axis to enable testing of the optical MEMS structures with vertical injection of the light.

CIRCUITRY AND METHOD FOR GENERATING A DISCRETE-TIME HIGH VOLTAGE

A discrete-time high voltage generating circuitry is disclosed, configured to provide a discrete-time high voltage at a high voltage output only during defined high voltage periods. The discrete-time high voltage generating circuitry comprises a current mirror circuitry configured to receive a supply current from a high voltage source and to provide a slew current. The discrete-time high voltage generating circuitry is configured to generate the discrete-time high voltage using the slew current. Further, a method to operate a discrete-time high voltage generating circuitry is disclosed. The circuitry and method may be used to provide a discrete-time self-test bias voltage to at least one capacitive load such as a capacitive MEMS element. 1. A discrete-time high voltage generating circuitry configured to provide a discrete-time high voltage at a high voltage output only during defined high voltage periods , comprising:a current mirror circuitry configured to receive a supply current from a high voltage source and to provide a slew current;wherein the discrete-time high voltage generating circuitry is configured to generate the discrete-time high voltage using the slew current, andwherein the high voltage output is configured to be in zero current state during periods different than the defined high voltage periods.2. The discrete-time high voltage generating circuitry according to claim 1 , comprising: a voltage division network comprising two capacitors connected in series, wherein the voltage division network is configured to receive part of the slew current; and', 'a comparator configured to compare a voltage level between the two capacitors of the voltage division network to a preset reference voltage and, in response to the comparing, provide in its output a logical signal for controlling provision of the slew current., 'a high voltage control circuitry comprising3. The discrete-time high voltage generating circuitry of claim 1 , wherein the current mirror ...

MICROMECHANICAL SENSOR DEVICE AND CORRESPONDING MANUFACTURING METHOD

A micromechanical sensor device includes: an ASIC substrate having a first front side and a first rear side; a rewiring element formed on the first front side and including multiple stacked conductor levels and insulating layers; a MEMS substrate having a second front side and a second rear side; a first micromechanical functional layer formed on top of the second front side; and a second micromechanical functional layer formed on top of the first micromechanical functional layer and connected to the rewiring element. In the second micromechanical functional layer, a movable sensor structure is anchored on one side via a first anchoring area, and an electrical connecting element formed in a second anchoring area is anchored on one side on the ASIC, and the first and second anchoring areas are elastically connected to one another via a spring element. 1. A micromechanical sensor device , comprising:an ASIC substrate having a first front side and a first rear side;a rewiring element formed on the first front side and including multiple stacked conductor levels and insulating layers;a MEMS substrate having a second front side and a second rear side;a first micromechanical functional layer formed on top of the second front side;a second micromechanical functional layer formed on top of the first micromechanical functional layer and connected to the rewiring element via a bond connection;a movable sensor structure formed in the second micromechanical functional layer and anchored on one side on the MEMS substrate via a first anchoring area formed in the second micromechanical functional layer;an electrical connecting element which is formed in a second anchoring area of the second micromechanical functional layer and anchored on one side on the ASIC substrate via a contact area of the bond connection; anda spring element formed in the second micromechanical functional layer and elastically connecting the first anchoring area and the second anchoring area to one another.2 ...

MEMS SENSOR COMPENSATION FOR OFF-AXIS MOVEMENT

A microelectromechanical system (MEMS) sensor includes a MEMS layer that includes fixed and movable electrodes. In response to an in-plane linear acceleration, the movable electrodes move with respect to the fixed electrodes, and acceleration is determined based on the resulting change in capacitance. A plurality of auxiliary electrodes are located on a substrate of the MEMS sensor and below the MEMS layer, such that a capacitance between the MEMS layer and the auxiliary loads changes in response to an out-of-plane movement of the MEMS layer or a portion thereof. The MEMS sensor compensates for the acceleration value based on the capacitance sensed by the auxiliary electrodes. 1. A microelectromechanical (MEMS) device , comprising:a substrate layer having a substrate plane;a MEMS layer including a suspended spring-mass system and having an upper plane and a lower plane, the lower plane being located above the substrate plane;a plurality of fixed electrodes, wherein each of the plurality of fixed electrodes is at least partially located within the MEMS layer and has an upper plane and a lower plane, wherein the suspended spring-mass system moves relative to the plurality of fixed electrodes in response to a first force in a first direction, wherein the suspended spring-mass system moves relative to the substrate in response to a second force in a second direction, and wherein either the suspended spring-mass system or the plurality of fixed electrodes outputs a sense signal in response to the first force and the second force; anda plurality of auxiliary electrodes located on the substrate layer facing the lower plane of the suspended spring-mass system or one or more of the fixed electrodes, wherein a plurality of auxiliary electrical signals from the auxiliary electrodes provide compensation for the second force, and wherein an output signal representative of the first force is based on the sense signal and the compensation.2. The MEMS device of claim 1 , wherein a ...

MICROCHEMICAL SYSTEM APPARATUS AND RELATED METHODS OF FABRICATION

The disclosure relates to microchemical (or microfluidic) apparatus as well as related methods for making the same. The methods generally include partial sintering of sintering powder (e.g., binderless or otherwise free-flowing sintering powder) that encloses a fugitive phase material having a shape corresponding to a desired cavity structure in the formed apparatus. Partial sintering removes the fugitive phase and produces a porous compact, which can then be machined if desired and then further fully sintered to form the final apparatus. The process can produce apparatus with small, controllable cavities shaped as desired for various microchemical or microfluidic unit operations, with a generally smooth interior cavity finish, and with materials (e.g., ceramics) able to withstand harsh environments for such unit operations. 120-. (canceled)21. A microchemical apparatus comprising:a fully sintered metal oxide body comprising an interior cavity within the body; the interior cavity has a minimum dimension in a range from 1 μm to 1000 μm; and', 'the interior cavity has a surface roughness of 20 μm or less., 'wherein22. The microchemical apparatus of claim 21 , wherein the fully sintered metal oxide body has a density of at least 80% relative to the theoretical density of the metal oxide.23. The microchemical apparatus of claim 21 , wherein the interior cavity is fully enclosed by the fully sintered metal oxide body.24. The microchemical apparatus of claim 21 , wherein the interior cavity is partially enclosed by the fully sintered metal oxide body. Priority is claimed to U.S. Provisional Application No. 62/378,932 filed Aug. 24, 2016, which is incorporated herein by reference in its entirety.None.The disclosure relates to relates to microchemical (or microfluidic) apparatus as well as related methods for making the same. The methods generally include partial sintering of sintering powder, removal of a fugitive phase material within the powder to create internal ...

Semiconductor structure and method of manufacturing the same

The present disclosure provides a semiconductor structure includes a sensing element configured to receive a signal from a sensing target, a molding surrounding the sensing element, a through via in the molding, a front side redistribution layer disposed at a front side of the sensing element and electrically connected thereto, and a back side redistribution layer disposed at a back side of the sensing element, the front side redistribution layer and the back side redistribution layer are electrically connected by the through via. The present disclosure also provides a method for manufacturing the semiconductor structure described herein.

METHOD FOR PRODUCING A MOULDED BODY

The present invention relates to a method for producing a molded body (), comprising the following steps: 1. A method for producing a molded body , comprising the following steps:a) providing a molding tool which has at least one receptacle in which at least one material is introduced, wherein the material comprises at least one shape-memory material, wherein the shape-memory material is present in a first state, wherein the material at least partially fills the receptacle of the molding tool in such a manner that said material adjoins at least one surface of the receptacle;b) creating a molded body in the receptacle of the molding tool from the material, wherein the shape-memory material is present in a second state, wherein a form is embossed into the molded body during the second state;c) transferring the shape-memory material from the second state to a third state, wherein the molded body can be deformed during the third state in such a manner that the molded body is demolded from the receptacle of the molding tool; andd) at least partially restoring the form of the molded body by transferring the shape-memory material from the third state to a fourth state, wherein the molded body at least partially resumes the form according to step b) during the fourth state.2. The method of claim 1 , wherein the material provided during step a) comprises at least one shape-memory material or at least one starting material claim 1 , wherein the starting material is transferred at least partially into the at least one shape-memory material before step b).3. The method of claim 1 , wherein the material provided during step a) comprises non-magnetic particles which are selected from microparticles or nanoparticles.4. The method of claim 3 , wherein the particles comprise at least one of carbon claim 3 , silicon dioxide or a metal.5. The method of claim 3 , wherein the particles are optically active.6. The method of claim 1 , wherein claim 1 , at least one of during step a) claim ...

Semiconductor component

The semiconductor component, in particular for use as a component that is sensitive to mechanical stresses in a micro-electromechanical semiconductor component, for example a pressure or acceleration sensor, is provided with a semiconductor substrate ( 1,5 ), in the upper face of which an active region ( 78 a, 200 ) made of a material of a first conductivity type is introduced by ion implantation. A semiconducting channel region having a defined length (L) and width (B) is designed within the active region ( 78 a, 200 ). In the active region ( 78 a, 200 ), each of the ends of the channel region located in the longitudinal extension is followed by a contacting region ( 79, 80 ) made of a semiconductor material of a second conductivity type. The channel region is covered by an ion implantation masking material ( 81 ), which comprises transverse edges defining the length (L) of the channel region and longitudinal edges defining the width (B) of the channel region and which comprises an edge recess ( 201,202 ) at each of the opposing transverse edges aligned with the longitudinal extension ends of the channel region, the contacting regions ( 79,80 ) that adjoin the channel region extending all the way into said edge recess.

Method of manufacturing semiconductor device

A method of manufacturing a semiconductor device is provided. The method includes the following operations. (a) A substrate is patterned. (b) A polymer layer is formed on the patterned substrate. (c) The polymer layer is patterned. Steps (a), (b) and (c) are repeated alternatingly. An intensity of an emission light generated by a reaction of a plasma and a product produced in steps (a), (b) and (c) is detected. An endpoint in patterning the substrate is determined according to the intensity of the emission light generated by the reaction of the plasma and the product produced in only one step of steps (a), (b) and (c). A sampling rate of the intensity is ranged from 1 pt/20 ms to 1 pt/100 ms. A smooth function is used to process the intensity of the emission light generated by the reaction of the plasma and the product.

Metal-based microchannel heat exchangers made by molding replication and assembly

Compression molding of metals is used to make microchannel heat exchangers. Heat transfer can be improved by employing controlled microchannel surface roughness. Flux-free bonding is achieved using a eutectic thin-film intermediate layer. Seals are leak-tight, mechanically strong, and uniform across multiple contact areas. The metal heat exchangers may be mass-produced inexpensively, and are useful for applications including the cooling of computer chips and other high-power electronic devices, air conditioning, refrigeration, condenser plates, radiators, fuel cell heat management, and instant water heating.

MICROMECHANICAL SPRING DEVICE AND METHOD FOR MANUFACTURING A MICROMECHANICAL SPRING DEVICE

A micromechanical device and a corresponding manufacturing method. The micromechanical device includes: a spring element which is moveably coupleable or is moveably coupled to a frame unit at at least one connecting point of the spring element, the spring element including at least one web, which extends outward from the at least one connecting point; and the at least one web being structured in such a way that it includes at least one first section as well as at least one widening section for reducing a non-linearity of the spring element, which is widened compared to the first section. 110-. (canceled)11. A micromechanical device , comprising:a spring element, which is moveably coupleable or moveably coupled to a frame unit at at least one connecting point of the spring element, the spring element including at least one web which extends starting from the at least one connecting point;wherein the at least one web is structured in such a way that it includes at least one first section and at least one widening section for reducing a non-linearity of the spring element, which is widened compared to the first section.12. The device as recited in claim 11 , wherein the at least one widening section has a greater cross sectional area than the first section.13. The device as recited in claim 11 , wherein the at least one widening section is formed at least partly by a mass unit claim 11 , which is formed on the web as part of the spring element.14. The device as recited in claim 13 , wherein the mass unit leaves a stiffness of the spring element unchanged.15. The device as recited in claim 13 , wherein the mass unit is formed at least partly as one piece with the web.16. The device as recited in claim 13 , wherein the mass unit is disk-shaped.17. The device as recited in claim 13 , wherein the mass unit is cuboid-shaped.18. The device as recited in claim 11 , wherein the spring element includes at least two webs claim 11 , each having the first section and the at least ...

SEMI-FINISHED PRODUCT OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE

Provided is a semi-finished product of an electronic device, including a substrate, a sensing module, and a lid. The substrate has a first surface and a second surface opposite to each other. The sensing module is disposed on the first surface. The lid is disposed on the first surface and forms a first cavity together with the substrate. An electronic device is also provided. 1. A semi-finished product of an electronic device , comprising:a substrate comprising a first surface and a second surface opposite to each other, wherein the substrate has a first through hole and a second through hole;a sensing module disposed on the first surface; anda lid disposed on the first surface and forming a first cavity together with the substrate, wherein the sensing module is disposed in the first cavity, the sensing module has a second cavity, the first through hole is in corresponding communication with the first cavity, and the second through hole is in corresponding communication with the second cavity.2. The semi-finished product according to claim 1 , wherein a correction sensitivity test of the semi-finished product is performed through air pressure.3. The semi-finished product according to claim 1 , wherein the lid has an opening configured for communication between air in the first cavity and air from outside.4. The semi-finished product according to claim 1 , wherein the lid is in direct contact with the substrate.5. The semi-finished product according to claim 1 , wherein the sensing module comprises:a wall structure disposed on the first surface;a sensor disposed on the first surface and covering the second through hole; anda pressurizing assembly disposed on the wall structure and the sensor, wherein the pressurizing assembly comprises a mass and a diaphragm.6. The semi-finished product according to claim 5 , wherein the mass is disposed in the second cavity or the mass is disposed outside the second cavity.7. An electronic device claim 5 , comprising:a first ...

Method of Fabricating Flexible Pressure Sensors

In a preferred embodiment, there is provided a method for preparing a capacitive pressure sensor, the sensor comprising a pair of conductive plate layers and a dielectric layer disposed therebetween, the dielectric layer comprising a dielectric polymer formed with a polymerization mixture fluid, wherein the method comprises placing the polymerization mixture fluid over a mold surface having a first three dimensional pattern thereon to form the dielectric polymer, thereby forming a second three dimensional pattern on a surface of the dielectric polymer complementary to the first three dimensional pattern. 1. A method for preparing a capacitive pressure sensor , the sensor comprising a pair of conductive plate layers and a dielectric layer disposed therebetween , the dielectric layer comprising a dielectric polymer formed with a polymerization mixture fluid , wherein the method comprises placing the polymerization mixture fluid over a mold surface having a first three dimensional pattern thereon to form the dielectric polymer , thereby forming a second three dimensional pattern on a surface of the dielectric polymer complementary to the first three dimensional pattern.2. The method of claim 1 , wherein the dielectric polymer comprises a crosslinked polydimethylsiloxane polymer claim 1 , and the polymerization mixture fluid comprises a pre-polymer mixture comprising at least one or more silicon monomers claim 1 , and a crosslinking agent selected for crosslinking a linear polydimethylsiloxane polymer to form the crosslinked polydimethylsiloxane polymer claim 1 , wherein the weight ratio of the pre-polymer mixture to the crosslinking agent in the polymerization mixture fluid is between about 10:1 and about 30:1.3. The method of claim 1 , wherein said method further comprises curing the polymerization mixture fluid over the mold surface at a curing temperature between about 40° C. and about 80° C. for between about 30 minutes and 4 hours.4. The method of claim 3 , ...

APPARATUS AND METHOD FOR TESTING A CAPACITIVE TRANSDUCER AND/OR ASSOCIATED ELECTRONIC CIRCUITRY

A method of testing a capacitive transducer circuit, for example a MEMS capacitive transducer, by applying a test signal via one or more capacitors provided in the transducer circuit. 1. (canceled)2. An integrated circuit for use with a MEMS capacitive transducer having a MEMS capacitor , the integrated circuit comprising:a biasing node for outputting an output voltage to a first plate of the MEMS capacitor;a first circuit node for receiving, in a test mode of operation, a test signal from an off-chip test signal generator;switching circuitry configured to selectively establish, in the test mode of operation, a test signal path between the first circuit node and the biasing node to supply the test signal from said first circuit node to the biasing node;wherein said test signal path comprises a first capacitor configured such that the test signal is supplied from said first circuit node to the biasing node via the first capacitor.3. An integrated circuit as claimed in claim 2 , wherein the switching circuitry is operable such that in a non-test mode of operation the biasing node is disconnected from the first circuit node.4. An integrated circuit as claimed in claim 2 , wherein the switching circuitry is operable such that in the test mode of operation a first plate of the first capacitor is coupled to said biasing node and a second plate of the first capacitor is coupled to said first circuit node.5. An integrated circuit as claimed in claim 4 , wherein the switching circuitry is operable to selectively couple the second plate of the first capacitor to a reference voltage during a non-test mode of operation claim 4 , with the first plate of the first capacitor coupled to the biasing node.6. An integrated circuit as claimed in claim 5 , wherein the switching circuitry is configured such that claim 5 , in the non-test mode of operation claim 5 , the first capacitor is connected in parallel with at least a second capacitor.7. An integrated circuit as claimed in claim 5 ...

Apparatus and method for packaging, handling or testing of sensors

A method of testing sensors includes providing a test sheet that includes a plurality of sensor assemblies, a plurality of test pads, and traces extending from the sensor assemblies to the plurality of test pads. A sensor is positioned on each sensor assembly. Each sensor is connected to the sensor assembly with wire bonds. An enclosure is formed over the plurality of sensor assemblies. An electrical signal is detected from each of the plurality of sensor assemblies at the test pads.

Method for Producing a Microelectromechanical Transducer

A method can be used for producing a microelectromechanical transducer. A plurality of microelectromechanical transducers are produced on a single wafer. Each transducer includes a diaphragm. The wafer is divided into at least a first and a second region. The mechanical tensions of a random sample of diaphragms of the first region are established and the values are compared with a predetermined desired value. The mechanical tensions of a random sample of diaphragms of the second region are established and the values are compared with the predetermined desired value. The tensions of the diaphragms in the first region are adjusted to the predetermined desired value, and the tensions of the diaphragms in the second region are adjusted to the predetermined desired value.

COMPENSATION AND CALIBRATION FOR MEMS DEVICES

A sensor system includes a microelectromechanical systems (MEMS) sensor, processing circuitry, measurement circuitry, stimulus circuitry and memory. The system is configured to provide an output responsive to physical displacement within the MEMS sensor to the measurement circuitry. The stimulus circuitry is configured to provide a stimulus signal to the MEMS sensor to cause a physical displacement within the MEMS sensor. The measurement circuitry is configured to process the output from the MEMS sensor and provide it to the processing circuitry, which is configured to generate stimulus signals and provide them to the stimulus circuitry for provision to the MEMS sensor. Output from the measurement circuitry corresponding to the physical displacement occurring in the MEMS sensor is monitored and used to calculate MEMS sensor characteristics. Methods for monitoring and calibrating MEMS sensors are also provided. 1. A method of monitoring and calibrating MEMS sensors in a system comprising a MEMS sensor , comprising:generating an electronic stimulus signal in the system;providing the electronic stimulus signal to the MEMS sensor;providing an electronic output from the MEMS sensor corresponding to a physical displacement of a portion of the MEMS sensor responsive to the electronic stimulus signal;monitoring, the electronic output from the MEMS sensor; and,determining a characteristic of the MEMS sensor based on the electronic output.2. A method as claimed in claim 1 , further including the step of comparing the monitored electronic output to an expected output to determine if the difference between the monitored output and expected output is less than a pre-determined threshold.3. A method as claimed in claim 2 , further including the steps of:monitoring in the processor the amount of elapsed time that has passed without the difference falling below the pre-determined threshold; and,recognizing an error condition if the elapsed time reaches a pre-determined time limit.4 ...

ANTIMICROBIAL BANDAGE WITH NANOSTRUCTURES

The subject disclosure is directed to antimicrobial bandages with nanostructures, formation thereof, and usage thereof to facilitate wound healing. In one embodiment, a bandage apparatus that facilitates healing a wound is provided. The bandage apparatus comprises a substrate comprising an attachment mechanism that facilitates removably attaching the substrate to a part of a body comprising the wound. The bandage apparatus further comprises a nanostructure film provided on a surface of the substrate and configured to contact the wound when the substrate is attached to the part of the body comprising the wound, wherein the nanostructure film comprises a plurality of nanostructures. 1. A bandage apparatus , comprising:a substrate comprising an attachment mechanism that facilitates removably attaching the substrate to a part of a body comprising a wound; anda nanostructure film provided on a surface of the substrate and configured to contact the wound when the substrate is attached to the part of the body comprising the wound, wherein the nanostructure film comprises a plurality of nanostructures.2. The bandage apparatus of claim 1 , wherein respective nanostructures of the plurality nanostructures comprise a nanospike geometry.3. The bandage apparatus of claim 1 , wherein respective nanostructures of the plurality of nanostructures have a pitch between about 100 nanometers and about 2.0 micrometers.4. The bandage apparatus of claim 1 , wherein respective nanostructures of the plurality of nanostructures comprise a proximal end on the surface of the substrate and a distal end that extends away from the proximal end claim 1 , and wherein the respective nanostructures have a diameter that tapers from the proximal end to the distal end.5. The bandage apparatus of claim 4 , wherein the distal end has a first diameter between about 1.0 nanometers and about 200 nanometers.6. The bandage apparatus of claim 4 , wherein the proximal end has a second diameter between about 1.0 ...

Method for fabricating microfluidic structures

A method for fabricating microfluidic structures is provided. The method includes: a belt is provided and an adhesion layer is formed on at least one surface of the belt; the belt is cut for forming a first microfluidic channel thereon, wherein the first microfluidic channel has an accommodating space; a second microfluidic channel is provided, wherein a line-width of the second microfluidic channel is smaller than a line-width of the first microfluidic channel; the second microfluidic channel is disposed in the accommodating space of the first microfluidic channel; and a substrate is adhered to the belt via the adhesion layer.

Method for interdigitated finger coextrusion

A method for depositing a structure comprising interdigitated materials includes merging flows of at least two materials in a first direction into a first combined flow, dividing the first combined flow in a second direction to produce at least two separate flows, wherein the second direction is perpendicular to the first direction, and merging the two separate flows into a second combined flow.

SYSTEMS AND METHODS FOR CONTROLLING RELEASE OF TRANSFERABLE SEMICONDUCTOR STRUCTURES

The disclosed technology relates generally to methods and systems for controlling the release of micro devices. Prior to transferring micro devices to a destination substrate, a native substrate is formed with micro devices thereon. The micro devices can be distributed over the native substrate and spatially separated from each other by an anchor structure. The anchors are physically connected/secured to the native substrate. Tethers physically secure each micro device to one or more anchors, thereby suspending the micro device above the native substrate. In certain embodiments, single tether designs are used to control the relaxation of built-in stress in releasable structures on a substrate, such as Si (). Single tether designs offer, among other things, the added benefit of easier break upon retrieval from native substrate in micro assembly processes. In certain embodiments, narrow tether designs are used to avoid pinning of the undercut etch front. 113-. (canceled)14100. A method of making thin and low-cost wafer-packaged micro-scale devices suitable for micro transfer printing using a ( ) silicon system , the method comprising:providing a plurality of micro-scale devices;{'b': 1', '0', '0, 'assembling the micro-scale devices onto a carrier wafer using micro-assembly techniques, wherein the carrier wafer comprises silicon ( ) and a first dielectric layer;'}embedding the assembled micro-scale devices within a second layer of dielectric; andpatterning the first and second dielectric layers to define a perimeter of each of the micro-scale devices with anchors and tethers that preserve the spatial configuration of the micro-scale devices with respect to the carrier wafer, each of the tethers laterally connecting a respective releasable micro-scale device of the plurality of micro-scale devices and shaped to fracture in response to pressure, thereby providing a wafer-level thin wafer package having micro-scale devices suitable for micro transfer printing to other ...

MICROELECTROMECHANICAL SYSTEM AND METHODS OF USE

Methods of measuring displacement of a movable mass in a microelectromechanical system (MEMS) include driving the mass against two displacement-stopping surfaces and measuring corresponding differential capacitances of sensing capacitors such as combs. A MEMS device having displacement-stopping surfaces is described. Such a MEMS device can be used in a method of measuring properties of an atomic force microscope (AFM) having a cantilever and a deflection sensor, or in a temperature sensor having a displacement-sensing unit for sensing a movable mass permitted to vibrate along a displacement axis. A motion-measuring device can include pairs of accelerometers and gyroscopes driven 90° out of phase. 1. A method of measuring displacement of a movable mass in a microelectromechanical system (MEMS) , the method comprising:moving the movable mass into a first position in which the movable mass is substantially in stationary contact with a first displacement-stopping surface;using a controller, automatically measuring a first difference between the respective capacitances of two spaced-apart sensing capacitors while the movable mass is in the first position, wherein each of the two sensing capacitors includes a respective first plate attached to and movable with the movable mass and a respective second plate substantially fixed in position;moving the movable mass into a second position in which the movable mass is substantially in stationary contact with a second displacement-stopping surface spaced apart from the first displacement-stopping surface;using the controller, automatically measuring a second difference between the respective capacitances while the movable mass is in the second position;moving the movable mass into a reference position in which the movable mass is substantially spaced apart from the first and the second displacement-stopping surfaces, wherein a first distance between the first position and the reference position is different from a second ...