Wafer inspection method and wafer

A wafer comprises a substrate layer, a first mirror layer having a plurality of two-dimensionally arranged first mirror parts, and a second mirror layer having a plurality of two-dimensionally arranged second mirror parts. A gap is formed between the first mirror parts and the second mirror parts to thereby constitute a plurality of Fabry-Perot interference filter parts. A wafer inspection method according to an embodiment includes a step of determining the quality of each of the plurality of Fabry-Perot interference filter parts, and a step of applying ink to at least a part of the portion of the second mirror layer in the Fabry-Perot interference filter part determined to be defective that overlaps the gap as seen from the direction opposite the second mirror layer.