07-12-2017 дата публикации
Номер: US20170349479A1
What is disclosed is a lead-free glass, which is a VO—TeO—RO (at least one selected from the group consisting of MgO, CaO, SrO, and BaO)—ZnO glass and has a low softening point, comprising: 5-55 wt % of VO, 5-75 wt % of TeO, 1-25 wt % of RO (at least one selected from the group consisting of MgO, CaO, SrO, and BaO) in total, 0.1-6 wt % of ZnO, and 0.1-3 wt % of RO (at least one selected from the group consisting of LiO, NaO, and KO) in total. This glass can be used as a sealing material providing fluidity which is capable of being sealed at a temperature of 400° C. or less 1. A lead-free glass , which is a VO—TeO—RO (at least one selected from the group consisting of MgO , CaO , SrO , and BaO)—ZnO glass and has a low softening point , comprising:{'sub': 2', '5, '5-55 wt % of VO,'}{'sub': '2', '5-75 wt % of TeO,'}1-25 wt % of RO (at least one selected from the group consisting of MgO, CaO, SrO, and BaO) in total,0.1-6 wt % of ZnO, and{'sub': 2', '2', '2', '2, '0.1-3 wt % of RO (at least one selected from the group consisting of LiO, NaO, and KO) in total.'}2. A sealing material claim 1 , comprising the lead-free glass as claimed in and an inorganic filler claim 1 , wherein a content of the inorganic filler is in a range of 1-35 volume % relative to a total volume of the lead-free glass and the inorganic filler.3. A glass paste claim 1 , comprising a glass powder composed of the lead-free glass as claimed in and an organic vehicle.4. A method for producing an electronic component claim 3 , comprising a step of baking at a temperature exceeding a softening point in order to perform sealing after applying the glass paste as claimed in .5. The method for producing the electric component as claimed in claim 4 , wherein a baking temperature is 400° C. or less in the step of baking. The present invention relates to a sealing material using a lead-free glass having a low softening point.Various solders and glasses have been used as an adhesive material and a sealing material ...
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