Halbleitervorrichtung-Auswertungshaltevorrichtung, Halbleitervorrichtung-Auswertungsvorrichtung und Halbleitervorrichtung-Auswertungsverfahren

Eine Grundfläche (21), die eine elektrische Leitfähigkeit und eine Plattenform aufweist, für eine Halbleitervorrichtung-Auswertungshaltevorrichtung (20), weist eine vordere Oberfläche (21a) auf, welche einen Montagebereich (R1, R2, R3) aufweist, auf welchem eine Halbleitervorrichtung (30) anzubringen ist. In diesem Montagebereich (R1, R2, R3) weist die Grundfläche (21) eine Durchgangsbohrung (21e) auf, die sich durch die Grundfläche (21) erstreckt. Ein Temperaturerfassungselement (22) ist an der Grundfläche (21) befestigt. Eine Elektrodenkontaktstelle (23) ist elektrisch mit dem Temperaturerfassungselement (22) verbunden und in der Seite der vorderen Oberfläche (21a) ausgebildet.

MODUL FÜR INTEGRIERTE SCHALTUNGEN MIT STRESSREDUZIERENDEN FEDERKONTAKTEN VON MINDESTENS ZWEI VERSCHIEDENEN TYPEN

Mounting apparatus for ball grid array device

TEST CONNECTOR FOR ELECTRICAL DEVICES

PROCEDURE AND DEVICE FOR EXAMINING BASES IN THE CIRCUIT

PROBE AND TEST VERSION ARRANGEMENT

CONVERTER FEMALE CONNECTOR

VERTICALLY SERVED BGA LINK

Apparatus and methods to pre-stress anisotropic conductive elastomer meterials

CONTACT FOR SPIRAL CONTACTOR AND SPIRAL CONTACTOR

Electrical contact structures from flexible wire

PROBE CARD AND INSPECTION METHOD

A probe card (100) according to the present invention inspects a work (50) that has a plurality of pads (51). The probe card (100) is provided with: a planar secondary battery (10) that comprises a planar electrode (22) and is arranged such that the planar electrode (22) faces the work (50); and an electrical connector (30) that is arranged between the work (50) and the secondary battery (10). The secondary battery (10) has a structure wherein a wiring line is able to be led out from the planar electrode (22) at an arbitrary position. The electrical connector (30) has a plurality of contacts (31) which protrude toward the facing pads (51); and the plurality of pads (51) and the planar electrode (22) are electrically connected to each other via the plurality of contacts (31).

Test socket and method of producing microchips identified as serviceable by using this socket

L'invention concerne une douille d'essais (20) comprenant: un substrat (22) incluant des conducteurs (24) de contacts extérieurs qui viennent en contact avec une carte extérieure d'essais de déverminage à une première extrémité latérale de ladite douille d'essais, une série d'ouvertures traversantes (21) situées à une distance prédéterminée desdits conducteurs (24) de contact, et au moins une ou plusieurs configurations de dépôts conducteurs (27) formées autour desdites ouvertures, traversantes (21) de façon à être reliées auxdits conducteurs (24) de contact au moyen de fils métalliques (30); une série de microplaquettes semi-conductrices montées par un moyen adhésif sur une partie supérieure desdites ouvertures traversantes ménagées sur la partie centrale dudit substrat et incluant une série de pastilles de soudage (25); des fils métalliques (28) reliant électriquement des pastilles de soudage desdites microplaquettes auxdites configurations de dépôts conducteurs; et un boîtier (29), formant ...

Test socket which can be aligned easily

Contact and Electrical Connection Device

본 발명은, 각 플런저를, 흔들림 없이 안정하여 접동이 자유롭게 지지하여, 확실한 전기적 접촉을 실현한다. 본 발명의 접촉자는, 제1 플런저 및 제2 플런저가, 그 선단 쪽에 설치되고 접동 가능하게 지지되어 2개의 부재에 각각 접촉되는 선단부와, 그 기단 쪽에 설치되고 상기 각 플런저를 각각 반으로 나눈 형상으로 하여 서로 접동 가능하게 겹쳐져 상기 압축 코일 스프링 내에 삽입되는 접동부를 갖춘다. 상기 각 접동부는, 상대쪽 플런저의 선단부와 함께 접동 가능하게 지지되는 길이로 설정된다. The present invention stabilizes each plunger without shaking and freely supports sliding, thereby ensuring reliable electrical contact. The contactor of the present invention has a tip portion in which the first plunger and the second plunger are provided on the distal end and slidably supported and in contact with the two members, respectively, and the proximal end and the respective plungers divided in half. And slidably overlapping each other to be inserted into the compression coil spring. Each said sliding part is set to the length supported so that sliding with the front-end | tip of an opposing plunger is possible.

CONDUCTIVE CONTACT HOLDER AND CONDUCTIVE CONTACT UNIT

BGA TYPE SOCKET FOR INTEGRATED CIRCUIT USED IN TEST AND BURN-IN

TEST SOCKET HAVING A STOPPER PART FOR EVEN CONTACT

PURPOSE: A test socket is provided to have a stopper part ensuring a reliable test result by keeping the even contact between the terminal of a device and the conductive part of a test socket in a horizontal state. CONSTITUTION: A test socket(10) is arranged between a device being tested and a test device and performs a function of electrically contacting the terminal of the device for being tested with the test device. The test socket is mounted on the upper side of the test device and is contacted with the terminal of the device being tested by being moved by an insertion. The test socket includes a conductive part(20), a support part(30), and a stopper part(40). The conductive part has conductivity in the direction of thickness and every position corresponding to the terminal of the device being tested has a conductive part. An insulation part is arranged between the conductive parts. The conductive part is arranged in the upper side, in an electrode arranged at every position corresponding to the terminal of the device being tested, and in the lower part of the electrode. The conductive part includes an elastic conductive part formed in a structure including multiple conductive particles inside an elastic material.

TEST SOCKET, CAPABLE OF PREVENTING THE ABRASION OF A CONDUCTIVE SILICON PART

PURPOSE: A test socket is provided to prevent the abrasion of a conductive silicon part by combining a connection plate on an upper part of the conductive silicon part. CONSTITUTION: A joint hole penetrating up and downward is formed at the central of a support plate of a flat pattern, and a protruding portion(12) protruded to an upper part of the silicon part(10) is formed. A plurality of conductive silicon parts(20) is formed by arranging a metal ball on the protruding portion vertically, and a connection plate(90) comprises a plurality of plungers(30) while being mounted on top of the protruding portion. © KIPO 2009 ...

METHOD OF MAKING A SOCKET TO PERFORM TESTING ON INTEGRATED CIRCUITS AND SUCH A SOCKET

A interconnect structure is inexpensively manufactured and easily insertable into a socket. The interconnect structure is manufactured by forming a sacrificial substrate with cavities that is covered by a masking material having openings corresponding to the cavities. A first plating process is performed by depositing conductive material, followed by coupling wires within the openings and performing another plating process by depositing more conductive material. The interconnect structure is completed by first removing the masking material and sacrificial substrate. Ends of the wires are coupled opposite now-formed contact structures to a board. To complete the socket, a support device is coupled to the board to hold a tested integrated circuit. © KIPO & WIPO 2007 ...

ELECTRICALLY CONDUCTIVE PIN AND ELECTRICALLY CONDUCTIVE MODULE USING THE SAME

CONTACT, SOCKET, SOCKET BOARD, AND ELECTRONIC COMPONENT TEST APPARATUS

A contact (44), comprising a first coiled spring (441), a second coiled spring (442) installed in the hollow part of the first coiled spring (441) and having a length shorter than the length of a wire material forming the first coiled spring (441), and contact parts (443) provided at both ends of the first coiled spring (441) and the second coiled spring (442), whereby, since the contact (44) does not have a probe part and a casing though a probe pin has the probe part and the casing, an inductance component can be decreased and a pitch can be reduced and, since the contact (44) does not use conductive resin material, the contact (44) has an excellent durability. © KIPO & WIPO 2007 ...

Semiconductor device socket

A fixed side terminal 20C of a contact terminal 20ai having a movable side contact piece 20m and a fixed side contact piece 20f has a contact portion 20t in contact with a group of electrodes 18E of a printed wiring board 16 at a predetermined pressure, and a socket body 10 is fixed to the printed wiring board 18 via locking nibs 10NA to 10ND fastened by a tapping screw TBs.

Conductive contact unit

INSERT ASSEMBLY AND ELECTRONIC DEVICE ACCOMMODATION APPARATUS INCLUDING THE SAME

CONDUCTIVE CONTACT HOLDER AND CONDUCTIVE CONTACT UNIT

A conductive contact holder includes a conductive holder substrate (11) on which a second opening (9) is formed for containing a grounding conductive contact (16). The internal surface of a first opening (8) is electrically insulated from a signal conductive contact (15). The internal surface of a third opening (10) is electrically insulated from a power supply conductive contact (17). On the other hand, the internal surface of the second opening (9)is in direct contact with the external surface of the grounding conductive contact (16). Accordingly, the grounding conductive contact (16) can receive supply of grounding potential from the holder substrate (11) and it is possible to stably supply the grounding potential to a semiconductor integrated circuit and the like to be used.

METHOD FOR MAKING A BLOCK FOR TESTING COMPONENTS

The invention concerns a test block (10) for an electronic component, comprising an embossed support layer (12) including a plurality of projecting protrusions (12), said protrusions being respectively equipped in their top parts with at least a conductive testing pad (14), capable of being electrically contacted with a terminal of the component. The invention is useful for controlling bare or housed electronic components.

Multiple rigid contact solution for IC testing

A chip testing solution having two separate contacts: one to provide current and one to measure voltage. One contact acts as the force and other as sense, and with its unique short wipe stroke technology enables the electrical connection from the contact terminal of the device under test (DUT) to the loadboard without fail even after prolonged insertion/testing of the devices. The two contacts are in close proximity, but electrically isolated from each other. Each contact is made to electrically touch a single conductive lead/pad on the DUT thus forming a test connection. The two contacts; one on front and other on back, wiping on the lead/pads will generally be a sense probe, and a force used for making a Kelvin connection. The short contact is connected to the loadboard by means of an additional contact known as interposer extending through and top of the tall contact base body.

Method and apparatus for testing bumped die

An apparatus for testing unpackaged semiconductor dice having raised ball contact locations is disclosed. The apparatus uses a temporary interconnect wafer that is adapted to establish an electrical connection with the raised ball contact locations on the die without damage to the ball contact locations. The interconnect is fabricated on a substrate, such as silicon, where contact members are formed in a pattern that matches the size and spacing of the ball contact locations on the die to be tested. The contact members on the interconnect wafer are formed as either pits, troughs, or spike contacts. The spike contacts penetrate through the oxide layer formed on the raised ball contact locations. Conductive traces are provided in both rows and columns and are terminated on the inner edges of the walls of the pits formed in the substrate.

Holder for electronic component, holding sheet for electronic component, electronic module using holder, electronic module using holding sheet, lamination of electronic modules, method for manufacturing electronic module, and method for testing electronic module

A first cavity in a holder is provided with a plurality of spiral contactors and a thermosetting adhesive member. In a state where a first bare chip is mounted in the first cavity and spherical contactors on the first bare chip are pressed against the plurality of spiral contactors, various tests are performed. If the result of the test is pass, the holder is heated so that the adhesive member becomes hard and rigid by being heated. This can perform securing while a good connection between the first bare chip and the holder is maintained. If the result of the test is fail, only the first bare chip is removed and replaced with a new bare chip.

Structure and method for package burn-in testing

The present invention discloses a contact structure and method for burn-in testing. The structure comprises a print circuit board, metal solder join fixed to the print circuit board, and contact fixed plate. The contact metal springs are located on the metal solder join and contacted with contact metal balls. The metal solder join is located on the contact fixed plate. Between the contact metal balls and the contact metal springs keep an approximately constant pressure and self-alignment by using the surface of the fixed plate contacting with the surface of the ball grid array (BGA) package.

Contactor having conductive particles in a hole as a contact electrode

A contactor is provided which contactor comprises an insulating substrate, a concave portion formed in the insulating substrate and extending in a perpendicular direction from a surface thereof, and elastic conductive particles disposed in the concave portion. A part of one of the conductive particles protrudes from the surface of the insulating substrate.

System level test socket

A system level test socket for testing semiconductor packages having non-pin grid array footprints. The test socket having solder pads positioned on the test socket to form electrical connections with corresponding leads on the bottom of the semiconductor package. The test socket has internal connections connecting each solder pad with a corresponding connection on the bottom of the test socket. The test socket is mounted on a burn-in board, thus allowing a semiconductor package having a non-pin grid array footprint to be tested without requiring an interposer for converting the non-pin grid array footprint of the semiconductor package. In addition, the test socket includes guide posts which align with guide slots on a hydraulic cylinder. The hydraulic cylinder compresses the semiconductor package to the test socket thereby ensuring solid connections between the semiconductor package and test socket.

Connector assembly for chip testing

Soft bond for semiconductor dies

On a semiconductor integrated circuit die, a semipermanent electrical connection is effected by the use of wirebond techniques, in which the parameters of the wirebond are controlled, so that less bonding force retains the leadwires to the bondpads than the attachment strength of the bondpads to the die. The wirebond techniques include attaching leadwires to bondpads on the die, using ultrasonic wedge bonding. The strength of the bond between the leadwires is significantly less than the attachment strength of the bondpads, preferably by a ratio which ensures that the bondpads are not lifted from the die when the leadwires are removed by breaking the bond between the leadwires and the bondpads. Subsequent to testing and burnin, the bond between the leadwires and the bondpads is severed. The die are then removed from the package body and the bondpads may then be attached by conventional means. The technique is useful in providing known good die.

Electrical connector incorporating an elastic electrically conductive material

An electrical connector for interconnecting a first circuit such as an integrated circuit having a plurality of IC terminals with a second circuit having a plurality of contact pads when the terminals and pads are positioned opposite each other. The connector includes an electrically insulating sheet made of a first elastic material formed with a plurality of bores extending therethrough in a direction mutually perpendicular to the first and second circuits, and a plurality of electrical conductors, each made of a second, electrically conductive elastic material and shaped so as to contact the first circuit terminals. The elastic material electrical conductors are each positioned relative to the electrically insulating sheet so as to cover each of the bores and extend into the bore co-axially therewith. The elastic conductors are sized to extend into the bores a distance insufficient to contact the second circuit pads when the insulating elastic sheet is uncompressed, and sufficient to ...

Connection device for stabilizing a contact with external connectors

The present invention provides a connection device for stabilizing contact between the external connectors (spherical contactors) of electrical parts and spiral contactors.As shown in FIG. 5A, the directions of the windings of adjacent spiral contactors 20 are opposite to each other. Further, as shown in FIG. 5B, when the directions of the windings of adjacent spiral contactors 20 are opposite to each other and the positions of forming the starting ends of the windings of adjacent spiral contactors 20 are formed in a difference of 180° between them, tensile stresses between adjacent spiral contactors 20 can cancel each other out. By doing so, since distortion generated in a substrate on which the spiral contactors 20 are provided can be minimized, contact between the spherical contactors and the spiral contactors 20 can be stabilized.

Ball grid array chip packages having improved testing and stacking characteristics

A stackable ball grid array (BGA) or fine ball grid array (FBGA) semiconductor package particularly suitable for board-on-chip or chip-on-board applications in which a low profile BGA or FBGA semiconductor package is needed. The stackable ball grid array (BGA) or fine ball grid array (FBGA) provides a semiconductor package that is capable of being burned in and tested in a more efficient and cost effective manner than prior known BGA or FBGA semiconductor packages. A high density, low profile memory module incorporating a plurality of the disclosed BGA or FBGA semiconductor packages in a stacked arrangement is further disclosed.

IC socket and IC tester

A housing and a bottom cover are secured together and have pairs of aligned through-apertures, and probe pins are accommodated in respective pairs of through-apertures to provide an IC socket. Each probe pin comprises a tube having a stop flange formed around its outer periphery, a movable plunger accommodated in the tube such that an extension portion of the movable plunger in urged to project out of a narrowed first end portion of the tube by a first coil spring, and a fixed plunger fitted to a second end portion of the tube. Each probe pin is urged by a second coil spring such that the stop flange on the tube is urged into abutment with a shoulder portion of a through-aperture of the bottom cover, whereby a tip end of the fixed plunger is projected beyond the outer surface of the bottom cover and a tip end of the movable plunger is projected beyond the outer surface of the housing.

Burn-in socket

A burn-in socket for land grid array devices or ball grid array devices includes a receptacle having an array of terminals for accepting and contacting the device and an outer shell which is actuated by rotation of the shell to capture the device and provide a force to ensure electrical contact between the device and the terminals.

Integrated circuit module having springy contacts of at least two different types for reduced stress

An electromechanical module is comprised of an electronic component that is attached to a substrate which is bendable. Multiple springy contacts touch respective I/O pads on the substrate. A compressing mechanism compresses the springy contacts against the I/O pads with forces that bend the substrate. The bending of substrate is reduced by including contacts of a first type, each of which exert a relatively small force against its respective I/O pad; and contacts of a second type, each of which exert a substantially larger force against its respective I/O pad.

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, INSPECTION DEVICE OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

A subject matter of this invention is that a manufacturing yield of a semiconductor device is improved. 1. A manufacturing method of a semiconductor device , the manufacturing method comprising the steps of:(a) inserting a semiconductor device including a wiring substrate provided with a plurality of ball electrodes as external terminals into an inspection socket; and(b) bringing a plurality of first terminals provided in the socket into contact with the ball electrodes, respectively, bringing a second terminal provided in the socket into contact with a first ball electrode of the ball electrodes, and inspecting a conductive state between the first terminal and the first ball electrode,wherein in the step (b), a coupling failure between the first terminal and the first ball electrode is detected by measuring a resistance value between the first terminal and the second terminal by bringing the second terminal into contact with the first ball electrode from a direction different from a direction in which the first terminal is brought into contact with the first ball electrode.2. The manufacturing method of a semiconductor device according to claim 1 ,wherein in the step (b), the second terminal is brought into contact with the first ball electrode from a direction along a surface of the wiring substrate on which the ball electrodes are provided.3. The manufacturing method of a semiconductor device according to claim 1 ,wherein in the step (b), the second terminal is brought into contact with the first ball electrode at a position closer to the wiring substrate than a position where the first terminal is brought into contact with the first ball electrode.4. The manufacturing method of a semiconductor device according to claim 1 ,wherein the second terminal is a flange-shaped terminal including a plurality of protrusion portions extending to a hole portion in which the first terminal of the socket is arranged in plan view, andwherein in the step (b), the protrusion ...

NON-DESTRUCTIVE TESTING OF INTEGRATED CIRCUIT CHIPS

Semiconductor devices and electronics packaging methods include integrated circuit chips having redundant signal bond pads along with signal bond pads connected to the same signal port for non-destructive testing of the integrated circuit chips prior to packaging. Electrical testing is made via the redundant signal bond after which qualified integrated circuit chips can be attached to a pristine and bumped final interposer or printed circuit board to provide increased reliability to the assembled electronic package.

Method for forming microelectronic spring structures on a substrate

A method for fabricating microelectronic spring structures is disclosed. In an initial step of the method, a layer of sacrificial material is formed over a substrate. Then, a contoured surface is developed in the sacrificial material, such as by molding the sacrificial material using a mold or stamp. The contoured surface provides a mold for at least one spring form, and preferably for an array of spring forms. If necessary, the sacrificial layer is then cured or hardened. A layer of spring material is deposited over the contoured surface of the sacrificial material, in a pattern to define at least one spring form, and preferably an array of spring forms. The sacrificial material is then at least partially removed from beneath the spring form to reveal at least one freestanding spring structure. A separate conducting tip is optionally attached to each resulting spring structure, and each structure is optionally plated or covered with an additional layer or layers of material, as desired ...

Known good die using existing process infrastructure

An apparatus for testing a semiconductor die and the method wherein there is provided a package having a cavity therein with a plurality of terminals in the package disposed at the periphery of the cavity. A semiconductor die to be tested and having a plurality of bond pads thereon is disposed in the cavity and an interconnecting layer having electrically conductive paths thereon is also disposed in the cavity, each of the paths having first and second spaced apart regions thereon, the first region of each path being aligned with and contacting a bond pad. An interconnection is provided between the second spaced apart region of each of the paths and one of the plurality of terminals. The second spaced apart region of each of the paths is preferably a bump aligned with and contacting one of the plurality of terminals. A compliant layer is preferably disposed over the interconnecting layer and provides a force causing engagement of at least the first spaced apart regions and the bond pads ...

CONTACT STRUCTURE FOR INTERCONNECTIONS, INTERPOSER, SEMICONDUCTOR ASSEMBLY AND METHOD

An interconnection contact structure assembly including an electronic component (102) having a surface and a conductive contact terminal (103) carried by the electronic component (102) and accessible at the surface. The contact structure (101) includes an internal flexible elongate member (106) having first (107) and second ends (108) and with the first end (107) forming a first intimate bond to the surface of the conductive contact terminal (103) without the use of a separate bonding material. An electrically conductive shell (116) is provided and is formed of at least one layer of a conductive material enveloping the elongate member (106) and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

CONTACT ASSEMBLY AND SOCKET FOR SEMICONDUCTOR PACKAGE USING IT

PROBLEM TO BE SOLVED: To provide a contact assembly capable of accepting narrow pitch terminals of a semiconductor package. SOLUTION: This contact assembly is so structured that a first set of contacts 30-1 to 30-5 arranged in a first plane and a second set of contacts 40-1 to 40-5 arranged in a second plane are paired and the plurality of pairs are stacked; contact parts 12 of the first and second sets of contacts are fitted together; and board connection parts 20 of the first and second sets of contacts are arranged so as to be generally symmetrical with respect to a center line. The pitch P2 of the board connection parts 20 of the first and second sets of contacts is expanded relative to the pitch P1 of the contact parts 12. COPYRIGHT: (C)2006,JPO&NCIPI ...

Verbindungselement für Halbleiterpackungstest und Herstellungsverfahren

Die Erfindung bezieht sich auf ein Verbindungselement zum Testen einer Halbleiterpackung mit einem Verbindungselementkörper (120) und wenigstens einem leitfähigen Element innerhalb des Verbindungselementkörpers. DOLLAR A Erfindungsgemäß beinhaltet das leitfähige Element einen leitfähigen Bereich hoher Dichte (132) nahe einer Oberseite (123) des Verbindungselementkörpers und aus dieser vorstehend und einen leitfähigen Bereich niedriger Dichte (134) in im Wesentlichen vertikaler Ausrichtung unterhalb des leitfähigen Bereichs hoher Dichte, wobei eine Unterseite (131) des leitfähigen Bereichs niedriger Dichte an einer Unterseite (121) des Verbindungselementkörpers freiliegt. DOLLAR A Verwendung zum Testen von Halbleiterpackungen.

Test holder for integrated circuit with solder ball connections serving as test points

An upper casing (14) attached to a circuit board (22), includes a cavity accepting the case (12) of the integrated circuit (28). The lower casing (16) lies below the circuit board and includes channels (41) accepting solid test pins. Resilience below the circuit board (membrane, 46), presses the test pins (38) up through the circuit board, into electrical contact with the test points (32) (solder balls).

VON OBEN ZU BESTÜCKENDER SOCKEL FÜR BAUELEMENT MIT RASTERARTIG ANGEORDNETEN LEITERBALLKONTAKTEN

Testsystem für integrierte Schaltkreischips

Testsystem für einen integrierten Schaltkreischip, mit – einer Testleiterplatte (130) mit einer ersten Oberfläche (130a), die einen Chipmontagebereich (132) aufweist, und einer der ersten gegenüberliegenden zweiten Oberfläche (130b), – einer Temperatursteuereinheit (120), um dem einen oder mehrere integrierte Schaltkreischips (10), die auf dem Chipmontagebereich der Testleiterplatte montierbar sind, in einen vorgebbaren Temperaturzustand zu versetzen, – einer Testeinheit (110), die elektrisch mit der Testleiterplatte verbindbar ist, um Eigenschaften des oder der mehreren integrierten Schaltkreischips zu testen, – einer lösbar an der zweiten Oberfläche (130b) der Testleiterplatte (130) anzubringenden Abdichteinheit (140) zum Definieren eines vor Umgebungsluft isolierten Innenraums (a), der zur Seite der Testleiterplatte hin von wenigstens einem Teil der zweiten Oberfläche der Testleiterplatte begrenzt wird, welcher dem Chipmontagebereich gegenüberliegt, und – Luftzufuhrmitteln (120, 139a ...

VERBINDUNGSELEMENTE FÜR MIKROELEKTRONISCHE KOMPONENTEN

Verfahren und Gerät zum dynamischen Ausrichten von Halbleitervorrichtungen

Gerät, umfassend:ein Nest (100), welches einen ersten Abschnitt (108) und einen zweiten Abschnitt (110) umfasst, wobei das Nest (100) ausgelegt ist, um eine Halbleitervorrichtung (112) in einer Aufnahmeposition zu empfangen, in welcher der erste und der zweite Abschnitt (108, 110) voneinander durch einen ersten Abstand beabstandet sind, und um die Halbleitervorrichtung (112) in einer Ausrichtungsposition auszurichten, in welcher der erste und der zweite Abschnitt (108, 110) voneinander durch einen zweiten Abstand beabstandet sind, der geringer als der erste Abstand ist;ein Betätigungselement (102), welches ausgelegt ist, um das Nest (100) von der Aufnahmeposition in die Ausrichtungsposition zu bewegen,eine Welle (128), welche zwischen einer ersten Position, in der die Welle zwischen dem ersten und dem zweiten Abschnitt (108, 110) des Nestes (100) eingefügt ist, und einer zweiten Position, in der die Welle (128) unterhalb des ersten und des zweiten Abschnitts (108, 110) des Nestes (100) ...

Measuring attachment for structural element with integrated circuit; has several test points with top casing having cavity for structural element with integrated circuit and bottom casing having apertures for solid test pins

The attachment (10) has an integrated circuit with several test points (32). A top casing (14) arranged on a printed circuit board (22) has a cavity (26) for structural elements with integral integrated circuits. A bottom casing (16) has several recesses (40) for solid test pins (38). Elastic members under the printed circuit board bias the test pins through the printed circuit board to contact the test points (32) of the structural element.

Prüfbasis für Halbleiterbauelemente

Testing device

A jig for use in positioning and holding electronic components during testing comprises an electronic circuit board 2 mounted on a support 4 having signal input/output coaxial microwave cable connectors 6 for connection to electronic test apparatus. The upper surface of the board has a recess 8 in which to receive an electrical component 32 to be tested, and a cap 16 is locatable on the base in contact with the component. A clamp 22 presses the cap on to the component with a pre-determined pressure, the clamp comprising a structure extending over the cap and provided with magnetic means for releasably holding the structure to the base and at least one spring-loaded pressure pad 28 mounted beneath the structure for engaging and pressing the cap.

Test mounting for surface mount device packages

Socket

Top load socket and carrier

Latching of rotating pressing members in IC test socket

A socket for an electrical part, such as an IC test socket, is provided with one or more pressing members 15 to press the electrical part in a horizontal position, and an operation member 14. The pressing members have latches 16 which lock the pressing members in the horizontal position, by having an engaging pawl 31b to be engaged with the socket body, and are released by a portion 14g of the operating member pressing portion 31a when it moves down. Optionally, pressing the operation member down rotates the pressing members to a vertical, out of the way, position. by pressing on one portion of them, and when the operation member is released, it is pushed up by springs 22 and rotates the pressing members to a horizontal position, where they push on the electrical part, by pressing on another portion. There may also be a support member (27, Fig 20) moved by link arms (23, Fig 20).

SOCKET FOR IC CARRIER

ADAPTER BASE FOR THE ADMISSION OF ELECTRONIC TEST OBJECTS

Carrier and system for testing bumped semiconductor components

INTEGRATED CIRCUIT INTERFACE AND METHOD OF MAKING THE SAME

One example includes a device (100) that is comprised of a plurality of printed circuit boards (200), a plurality of vias (110), and a plurality of castellations (130). The plurality of printed circuit boards (200) are laminated together, at least some of the plurality of printed circuit boards (200) including a dielectric panel (210) and a plurality of conductor pads (220). The plurality of vias (110), through the plurality of conductor pads (220), include a conductive material to respectively electrically couple the plurality of conductor pads (220) with each other. The plurality of castellations (130), on at least one side of the plurality of printed circuit boards (200), to electrically couple each of a plurality of contact pins of an integrated circuit socket with respective contact pads of the plurality of conductor pads (220).

PROCESS AND DEVICE OF TRANSPORT OF ELECTRONIC MODULES AND EQUIPMENT OF HANDLING AND TEST OF ELECTRONIC MODULES

MODULATE HAS CONTACT TAGS AND DEVICE INSPECTING EQUIPS WITH THIS MODULE

... - Module à broches de contact et dispositif de contrôle équipé de ce module. - L'invention concerne une portion intermédiaire entre des groupes (60) et (62) de broches de contact dans un cadre conducteur (54) d'un module à broches de contact (34) qui est supportée par une plaque de support (64). - Contrôle de dispositifs électroniques.

임베디드 쉘 레이어를 구비한 전기 커넥터

... 본 발명은 임베디드 쉘 레이어를 구비한 전기 커넥터에 관한 것으로, 본 발명에 따른 일 실시예는 적어도 하나의 레이어가 코어의 외면 상의 적어도 일부와 동일한 구조가 되도록 상기 적어도 하나의 레이어를 상기 코어에 부착하는 단계, 소켓 바디의 소켓 캐비티 안으로 상기 적어도 하나의 레이어가 구비된 상기 코어를 프레스 핏(press fit)하는 단계 -여기서, 상기 소켓 캐비티는 내면을 포함함-, 상기 레이어가 상기 소켓 캐비티의 상기 내면에 부착된 쉘 레이어를 형성하도록 상기 레이어의 적어도 일부를 남기면서 상기 소켓 캐비티로부터 상기 코어를 제거하는 단계 -여기서, 상기 쉘 레이어는 내면을 구비한 쉘 캐비티를 더 포함함-, 적어도 하나의 플런져의 테일이 상기 쉘 캐비티에 슬라이딩 가능하게 수용되고 바이어싱 장치가 상기 쉘 캐비티의 상기 내면으로부터 이격 되도록 상기 적어도 하나의 플런져의 팁을 바이어스하도록 상기 적어도 하나의 플런져 및 상기 바이어싱 장치를 상기 쉘 캐비티에 삽입하는 단계를 포함하는 전기 커넥터를 형성하는 방법을 제공한다.

Device for test socket having a plurality of vertically stacked rubber sockets

Assembly of two electronic devices

APPARATUS FOR TESTING FLIP CHIP OR WIRE BOND INTEGRATED CIRCUIT

METHOD FOR FORMING MICROELECTRONIC SPRING STRUCTURES ON A SUBSTRATE

A SOCKET, A TEST EQUIPMENT, AND METHOD FOR MANUFACTURING A MULTI-CHIP SEMICONDUCTOR DEVICE PACKAGE

TEST SOCKET MANUFACTURED BY A MICRO-ELECTRO-MECHANICAL SYSTEMS, USED FOR TESTING A SEMICONDUCTOR DEVICE WITH A HIGH DENSITY ELECTRICAL CONTACT

PURPOSE: A test socket manufactured by micro-electro-mechanical systems(MEMS) is provided to reduce the pitch of electrical contacts in the test socket by adjusting the structure, the width, the length, and the thickness of a plate matrix shaped cantilever. CONSTITUTION: A plurality of cavities with a pre-set depth is distributed at the central part of a substrate(100). Cantilever type electrical contacts(150) are distributed on the upper part of the cavities as much as the number of semiconductor devices(200). The cantilever type electrical contacts are induced to be in separate contact with respect to the electrodes of the semiconductor devices. A signal connection line is in electrical connection with a mother board printed circuit board(300) which is located at the lower part of the substrate. Conductive bumps are located at the upper part of the electrical contacts. COPYRIGHT KIPO 2011 ...

PROGRAMMABLE TEST SOCKET

A test socket for a semiconductor device includes a guide plate operable to receive the semiconductor device and to maintain electrical terminals of the semiconductor device in registration with electrical terminals of a base. A shell operable to couple to the base and to maintain the guide plate in registration with the electrical terminals of the base, the shell including an aperture in communication with the base through which the guide plate can be inserted and removed when the shell is coupled to the base; and at least one fastener coupled to the shell and operable to maintain the semiconductor device in engagement with the guide plate and to urge the electrical terminals of the semiconductor device in contact with the electrical terminals of the base. A method for operating the test socket is also disclosed. © KIPO & WIPO 2007 ...

STRUCTURE AND METHOD FOR BURN-IN TESTING AFTER PACKAGING FOR MAINTAINING UNIFORM PRESSURE BETWEEN SOLDER BALLS AND METAL SPRINGS

PURPOSE: A structure and a method for burn-in testing after packaging are provided to maintain uniform pressure between solder balls and metal springs, independently contact respective balls with springs, prevent the contact spring from being damaged easily, and make it possible to be used to a burn-in and test for WLP(Wafer Level Package) and multi-package after packaging. CONSTITUTION: A contact structure for burn-in testing after packaging comprises a PCB(103), a fix plate(105), and solder joints(102). The fix plate is fixed to the PCB. The solder joints are fixed to the fix plate. The solder joints comprise a plurality of contact metal springs, which are electrically connected to the PCB to be used to contact with a testing object. The fix plate contacts with a surface of the testing object for substantially keeping a uniform pressure between contact metal balls(101) and the contact metal springs. © KIPO 2006 ...

SOCKET FOR CARRYING OUT HIGH-ACCURACY FAULT ANALYSIS AND PERFORMANCE TEST OF SEMICONDUCTOR DEVICES CONVENIENTLY USING HIGH-PERFORMANCE DETECTOR

PURPOSE: A socket is provided to carry out high-accuracy fault analysis and performance test of semiconductor devices conveniently using a high-performance detector. CONSTITUTION: A socket includes a socket base(1), an accommodating part, a socket lead(3), a socket lever(7), and a socket cover(8). The accommodating part is formed on the socket base and accommodates a package(9) sealing up an IC chip(15) mounted thereon such that the backside of the package is placed upward. The socket lead is arranged around the accommodating part and has elasticity in a predetermined direction. The socket lever has an end engaged with the socket lead. The socket cover presses the other end of the socket lever to change the location of the socket lead toward the outside of the socket base. © KIPO 2005 ...

SOCKET FOR POSITIONING IC CHIPS ON FLEXIBLE CONNECTION SHEET

PURPOSE: A socket for positioning IC chips on flexible connection sheet are provided to surely inspect a great number of sub circuits. CONSTITUTION: A socket for positioning IC chips on flexible connection sheet(20) comprises a base(30) having a recess(34), units(38,39) for determining the direction of a chip on the recess, a moving member(56) and an inserting unit. An elastic body(44) is inserted into the recess of the base. The moving member(56) is movable between an opening position and a closing position. The inserting unit connects plural terminals with the elastic body by embedding the terminals into the elastic body through the moving member. COPYRIGHT 2000 KIPO ...

Electronic component testing device and electronic component transport method

An electronic component testing device includes a first imaging device for imaging an upper-surface electrode of an electronic component before the electronic component is held by a holding part, a second imaging device for imaging a contact terminal provided to a testing head, a third imaging device for imaging a lower-surface electrode of the electronic component held by the holding part, and a fourth imaging device for imaging a testing socket. A control device controls the position adjustment part of the testing head to adjust the position of the holding part, and thereby controlling, based on images captured by the first and second imaging devices, a holding orientation when the holding part holds the electronic component, and controlling, based on the images captured by the third and fourth imaging devices, a holding orientation of the holding part in relation to the testing socket.

Universal test socket, semiconductor test device, and method of testing semiconductor devices

A universal test socket including a first sub-layer including a plurality of first through conductors, the plurality of first through conductors arranged at a first pitch in a first substrate, and a second sub-layer including a plurality of second through conductors, the second sub-layer stacked on the first sub-layer so that the plurality of first through conductors are in contact with the plurality of second through conductors, the plurality of second through conductors arranged at a second pitch in a second substrate, the second pitch being less than or equal to the first pitch may be provided.

Electrical probe with rotatable plunger

This disclosure provides for an electrical probe, which can include a shell extending along a longitudinal axis and defining an internal cavity with an opening at a first end, where the shell can include a neck portion defined by a hollow polygonal shaft twisted about the longitudinal axis to form an internal cam surface. The electrical probe can also include a plunger slidably received in the internal cavity. The plunger can include a tip configured to extend at least partially through the opening at the first end and a cam element integrally formed with the tip and having a cross-sectional shape substantially corresponding to a cross-sectional shape of the hollow polygonal shaft, such that, when the plunger is reciprocated along the longitudinal axis of the shell, the cam element can engage with the internal cam surface of the neck portion to cause rotation of the tip.

Reverse build-up structure of circuit board

A reverse build-up structure of a circuit board is proposed. The structure includes a supporting board having at least one through hole; a dielectric layer with a first surface and a second surface wherein the first surface sealed one end of the through hole and extending into the through hole; a plurality of electrically contact pads embedded in the dielectric layer, appeared on the first surface of dielectric layer and corresponding to the through hole of the supporting board; a circuit layer formed on the second surface of the dielectric layer and having a plurality of conducting via in the dielectric layer for electrically connecting to the electrically contact pads. Thus, there is no plating through hole (PTH) in the structure, hence impedance can be reduced, electricity performance is enhanced and the circuit board is thinner.

Contactor for electronic parts and a contact method

A contactor for electronic parts can provide an appropriate and uniform contact with respect to a plurality of electrode terminals in an electronic part such as an IC. Each of a plurality of contact members has a first contact portion on one end thereof and a second contact portion on the other end thereof, the first contract portion having a recessed portion that receives one of the electrode terminals of the electronic part. A base accommodates and supports the plurality of the contact members. The first contact portion is movable in a horizontal direction.

Test socket with high density conduction section and fabrication method thereof

Provided is a test socket, the test socket including an elastic conductive sheet including a first conductive unit wherein a plurality of first conductive particles are arranged in an elastic material in a thickness direction; a support sheet; a second conductive unit wherein a plurality of second conductive particles are arranged in an elastic material in a thickness direction, and wherein the second conductive particle is arranged in the elastic material at a higher density than the first conductive particle.

Electrical connector

An electrical connector for connecting an IC module comprises a base, a plurality of contacts received in the base, a rotatable lid able to cover the base. Said lid comprises a frame having an opening, and a pressing member which is capable of moving vertically to the frame. Side pressing member is formed with a through hole communicating with said opening. A plurality of springs are set between the frame and the pressing member. The position of the pressing member can by adjusted to ensure a reliable touch between the pressing member and the IC module.

Method for forming microelectronic spring structures on a substrate

A method for fabricating microelectronic spring structures is disclosed. In an initial step of the method, a layer of sacrificial material is formed over a substrate. Then, a contoured surface is developed in the sacrificial material, such as by molding the sacrificial material using a mold or stamp. The contoured surface provides a mold for at least one spring form, and preferably for an array of spring forms. If necessary, the sacrificial layer is then cured or hardened. A layer of spring material is deposited over the contoured surface of the sacrificial material, in a pattern to define at least one spring form, and preferably an array of spring forms. The sacrificial material is then at least partially removed from beneath the spring form to reveal at least one freestanding spring structure. A separate conducting tip is optionally attached to each resulting spring structure, and each structure is optionally plated or covered with an additional layer or layers of material, as desired ...

Probe unit and base member for use therewith

METHODS AND APPARATUS FOR RELEASABLY MOUNTING A SEMICONDUCTOR DEVICE TO A PRINTED CIRCUIT BOARD

Methods and apparatus for releasably mounting a semiconductor device, such as a ball grid array (BGA) integrated circuit to a printed circuit board (PCB) are disclosed. The socket (10) includes a base (12) mountable over a contact pad of the printed circuit board (24) and having an opening (20) to receive the semiconductor device (22). A socket board is mountable to or integrally formed with the base. The socket board includes at least one aperture having a spring contact for electrically coupling a contact element of the semiconductor device to a contact of the printed circuit board when the semiconductor device is received in the base.

SOCKET CONNECTOR AND CONTACT FOR USE IN A SOCKET CONNECTOR

A socket connector and a contact for use in a socket connector is disclosed. The socket connector includes a plurality of contacts arranged in a grid shape and a socket body provided with the respective contacts. The contact includes a first contact piece and a second contact piece out of contact with each other in a first condition and in contact with each other in a second condition. When the first and second contact piece are in conctact with each other, the electric path length is shortened to reduce a self-inductance, thereby allowing the socket connector of the present invention to be used in high frequency application and in test and evaluation sockets.

Known good die using existing process infrastructure

An apparatus for testing a semiconductor die and the method wherein there is provided a package having a cavity therein with a plurality of terminals in the package disposed at the periphery of the cavity. A semiconductor die to be tested and having a plurality of bond pads thereon is disposed in the cavity and an interconnecting layer having electrically conductive paths thereon is also disposed in the cavity, each of the paths having first and second spaced apart regions thereon, the first region of each path being aligned with and contacting a bond pad. An interconnection is provided between the second spaced apart region of each of the paths and one of the plurality of terminals. The second spaced apart region of each of the paths is preferably a bump aligned with and contacting one of the plurality of terminals. A compliant layer is preferably disposed over the interconnecting layer and provides a force causing engagement of at least the first spaced apart regions and the bond pads ...

Resilient contact structures formed and then attached to a substrate

Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics. A variety of techniques for configuring, severing, and overcoating the wire stem are disclosed. In an exemplary embodiment, a free end of a wire stem is bonded to a contact area on a substrate, the wire stem is configured to have a springable shape, the wire stem is severed to be free-standing by an electrical discharge, and the free-standing wire stem is overcoated by plating. A variety of materials for the wire stem (which serves as a falsework) and for the overcoat (which serves as a superstructure over the falsework) are disclosed. Various techniques are described for mounting the contact structures to ...

Test socket for ball grib array electronic module

An electronic module test assembly comprising a frame, an array of contact pins, and at least one latch. The frame has a recess formed therein for receiving an electronic module. The array of contact pins is anchored to the frame. The contact pins have resiliently depressible terminals forming a resiliently depressible contact array in the recess. The latch is movably mounted to the frame for latching the electronic module to the frame. The latch is movable relative to the frame and engages an outer edge of the electronic module when the electronic module is disposed against the resiliently depressible contact array. The resiliently depressible contact array biases the electronic module against the latch.

Flip-chip test socket adaptor and method

A test set socket adapter (20) comprises a substrate (28), a plurality of cantilever beams (32) and a package (30). A bare chip (22) may be inserted into and held by the test socket adapter (20) for insertion into a standard test socket. The cantilevers (32) are designed to deflect and compensate for variations in solder bumps (26) on the bare chip (22). The deflection of the cantilever beams (32) allows a positive contact between the solder bumps (26) and the cantilever beams for an AC and a burn-in test.

Testing apparatus

A testing apparatus includes a chip carrying device and a pressing device. The chip carrying device includes a circuit board and a plurality of electrically connecting units disposed on the circuit board. Each electrically connecting unit includes a main body disposed on the circuit board to form an accommodating slot, a lift structure partially arranged in the accommodating slot. A portion of the lift structure having a chip receiving slot passes through an opening of the main body. The pressing device includes a temperature conditioner being controllable to increase or decrease temperature. When the lift structure is pressed by a flat structure of the temperature conditioner, the probe assemblies are connected to one side of a chip received in the chip receiving slot, and the flat contacting surface is abutted against another side of the chip for transmitting heat energy there-between.

Method For Testing Semiconductor Devices

A method of testing semiconductor devices includes placing a plurality of semiconductor devices in a carrier assembly and performing at least one testing operation on the plurality of semiconductor devices while they remain inside the carrier assembly.

TEST CARRIER

A test carrier includes a base member that holds a die and a cover member. The base member includes a board having a wiring line that is electrically connected to the die. The wiring line includes a wiring line and a resistive portion having a resistance value that is higher than the resistance value of the wiring line.

Contactor system for a ball grid array device

A contactor system is adapted for use when testing a ball grid array (BGA) device, and includes a conductive socket that is retained on a testing board and that establishes a ground connection therewith. The socket is formed with a receiving space adapted for receiving the BGA device therein. An insulating guide unit is mounted on the socket in the receiving space and is adapted to guide loading movement of the BGA device into the receiving space via an open top section of the latter and to prevent undesired electrical contact between the socket and the BGA device. A surface mount matrix is disposed on top of the testing board and is clamped between the socket and the testing board. The surface mount matrix is accessible via an open bottom section of the receiving space, and is adapted to contact solder balls on the BGA device directly so as to establish electrical connection between the BGA device and testing circuit layout on the testing board.

Socket for a semiconductor device

A device, wherein, at cells 10 ai of a metallic upper housing 10 corresponding to a signal line, between an end portion of an adapter 24 that has electrically insulating properties the inner surface of an upper housing 12 that has electrically insulating properties, an annular air layer Ai is formed at the peripheries of sleeves 20 S of contact terminals 20 ai that have the same structure as each other, and wherein, at the cells 10 ai that correspond to ground lines, contact points 20 CT 2 of the contact terminals 20 ai are inserted in through-holes 12 ai of the lower housing 12, and their contact points 20 CT 1 are inserted into small diameter holes 22 b of conductive collars 22 that touch the inner surfaces of the cells 10 ai.

Interposer

An interposer includes a substrate having a first surface and a second surface with vias extending between the first and second surfaces. The interposer also includes a contact array mounted to the first surface that has a plurality of coil-shaped contacts. The contacts have heels terminated to corresponding vias. The contacts have beams defining a mating interface of the interposer configured for mating with an electronic component. The contacts may be conic helix shaped. The beams may include at least one turn. The beams may be free standing from the heel and may be compressible along contact axes toward the first surface of the substrate.

Contact Holder

To provides a contact holder, capable of compensating a change of signal transmission characteristic at the outer edge area of the substrate. A substrate 21 has grounding conductive layers 291, 292 arranged on or above surfaces 212, 213 of the substrate, near a plunger of a signal transmitting contact 3 b. Each grounding conductive layer is electrically connected to a conductive portion 241 electrically connected to each grounding contact, on surface 212 or 213 of substrate 21. Further, each grounding conductive layer is not electrically connected to the signal transmitting contact.

TEST SYSTEM

A test system having a manipulation device and a test unit. The manipulation device has a receiving unit with a socket that accommodates a packaged integrated circuit, which has a top side and a bottom side. A plurality of electrical terminal contacts are formed on the bottom side. In a first state, the manipulation device provides the integrated circuit to the test unit, and during the first state the test unit is disposed above the top side of the integrated circuit and forms a connection with the manipulation device, and the test unit carries out a function test on the integrated circuit. A sensor device is formed on the top side, and the top side of the integrated circuit is oriented in a direction of the test unit and the electrical terminal contacts are electrically connected to the receiving unit of the manipulation device. 1. A test system comprising:a test unit;a manipulation device having a receiving unit with a socket, the socket accommodating a packaged integrated circuit, the packaged integrated circuit having a top side and a bottom side with a plurality of electrical terminal contacts being formed on the bottom side; anda sensor device arranged on the top side of the integrated circuit, the top side of the integrated circuit being oriented in a direction of the test unit and the electrical terminal contacts being electrically connected to the receiving unit of the manipulation device,wherein there is an electrical connection between the socket and the terminal contacts,wherein, in a first state, via the receiving unit, the manipulation device provides the integrated circuit to the test unit,wherein, in the first state, the test unit is arranged above the top side of the integrated circuit and forms a connection with the manipulation device, and the test unit carries out a function test on the integrated circuit.2. The test system according to claim 1 , wherein the receiving unit has a coupling device and wherein the socket is electrically connected to ...

LOCALIZED PRINTED CIRCUIT BOARD LAYER EXTENDER APPARATUS FOR RELIEVING LAYER CONGESTION NEAR HIGH PIN-COUNT DEVICES

A method and apparatus for a localized printed circuit board layer extender (LLX) is provided. The apparatus relieves layer routing congestion in and around high pin count integrated circuits. The method begins when a localized layer extender is provided that is compatible with the bottom-side pin-field of a device under test (DUT). The LLX is affixed to the bottom-side pin-field of the DUT. Test signals are then routed through the LLX as part of a test procedure. The apparatus includes: a LLX that substantially matches the pin-field of a bottom side of a DUT; a LLX base; and a LLX debug interface. 1. A method for testing an electronic device , comprising:providing a localized layer extender (LLX) compatible with a bottom-side pin-field of a device under test (DUT);affixing the LLX to the bottom-side pin-field of the DUT; androuting signals through the LLX as part of a test procedure.2. The method of claim 1 , wherein the LLX is affixed to the bottom-side pin-field of the DUT with a base of predetermined thickness.3. The method of wherein the LLX includes a signal connector interface.4. The method of wherein the LLX signal interface includes a debug connector interface.5. The method of wherein the LLX fits within the DUT pin-field footprint.6. The method of wherein the LLX uses unused claim 5 , no connection (NC) DUT pins for an LLX connection resource.7. The method of wherein the LLX uses vacant DUT ball grid array (BGA) rows for an LLX connection resource.8. The method of wherein the LLX uses vacant DUT ball grid array (BGA) columns for an LLX connection resource.9. The method of wherein the LLX connection resource is an attached cable.10. The method of wherein the LLX fits outside the DUT pin-field footprint.11. The method of wherein the LLX connection resources are outside the DUT pin-field footprint.12. The method of wherein the selected LLX pin connections are omitted opposite selected pins in the bottom-side DUT pin-field.13. An apparatus for testing an ...

Pin for a semiconductor chip test, and socket for a semiconductor chip test including same

This patent is about “A New Test Socket Pin & Socket Design for Semiconductor Chip Test”. According to the present invention, there is huge improvement on pin movement with different types of shape and materials. It makes better and stable contact between chip and PCB pad thanks to pivot shaft and rectangle elastomers. So it finally improves reliability of testing. In addition, there is cost reduction effect as we use the pin twice. Once the first contact terminal(Left side of pin) is worn out, the pin can be rotated to its other contact terminal(Right side) and reuse the opposite terminal.

Socket

A surface-mountable socket has a wiping function. A socket 100 of the present technology can be surface-mounted to a board 210. The socket 100 includes a plurality of contacts 110, and each contact 110 includes a contact portion 112 that can contact a terminal of a semiconductor device, a locking portion 116 connected to the contact portion 112, and a board-side contact portion 118 that extends from the locking portion 116 and can contact a conductive region formed on a board surface. The socket 100 further includes a stopper member 120 that holds the locking portion 116 of the plurality of contacts 110 and a guide member 180 that is disposed so as to oppose the stopper member 120, and the guide member 180 is formed with a plurality of through holes 184 that houses a board-side contact 118 protruding from the stopper member.

APPARATUS FOR TESTING STACKED DIE ASSEMBLIES, AND RELATED METHODS

Apparatus for testing semiconductor devices comprising die stacks, the apparatus comprising a substrate having an array of pockets in a surface thereof arranged to correspond to conductive elements protruding from a semiconductor device to be tested. The pockets include conductive contacts with traces extending to conductive pads, which may be configured as test pads, jumper pads, edge connects or contact pads. The substrate may comprise a semiconductor wafer or wafer segment and, if the latter, multiple segments may be received in recesses in a fixture. Testing may be effected using a probe card, a bond head carrying conductive pins, or through conductors carried by the fixture. 1. A semiconductor device test apparatus , comprising:at least one substrate comprising at least one test site including an array of pockets configured for at least partially receiving conductive elements protruding from a semiconductor device to be tested; anda conductive contact within each pocket coupled to a conductive trace extending to a conductive pad offset from the array of pockets.2. The apparatus of claim 1 , wherein the at least one substrate is selected from the group consisting of semiconductor material claim 1 , glasses claim 1 , and ceramics.3. The apparatus of claim 1 , wherein the at least one substrate comprises one of a semiconductor wafer and a segment of a semiconductor wafer.4. The apparatus of claim 3 , wherein the at least one substrate comprises a segment of a semiconductor wafer in the form of a strip of semiconductor material having at least one row of test sites thereon.5. The apparatus of claim 4 , wherein the at least one substrate comprises a number of substrates claim 4 , and further comprising a fixture configured with a number of recesses claim 4 , each recess sized and configured to at least partially receive a substrate of the number of substrates claim 4 , at least some of the recesses having a substrate at least partially received therein.6. The ...

Contact pin and socket

A contact pin includes: a first plunger including a first contact portion provided at an upper end, and a hollow body portion provided below the first contact portion; a second plunger including: a second contact portion provided at a lower end; a first taper portion that is provided above the second contact portion and enlarges in diameter toward the second contact portion; a small diameter portion provided above the first taper portion; and a large diameter portion that is provided above the small diameter portion and is inserted into the body portion to abut on an inner wall surface of the body portion; and a spring for energizing the first and second contact portions to be separated from each other. The first taper portion is capable of abutting on a lower end of the body portion in a case where the first and second contact portions approach each other.

BALL GRID ARRAY CURRENT METER WITH A CURRENT SENSE MESH

Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB). A current sense mesh can be placed between adjacent solder balls and is attached to the upper surface of the PCB. The solder balls are electrically connected to supply current from the PCB through the BGA package to the IC. A MUX/Sequencer can sequentially connect wires of the current sense mesh to an amplifier. The amplifier can amplify a voltage induced on the current sense mesh by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals. 1. A ball grid array (BGA) current meter apparatus for measuring electrical current flow in a BGA package , the BGA current meter apparatus comprising:an integrated circuit (IC), electrically connected to the BGA package;a set of solder balls electrically connected to a corresponding first set of attachment pads located on a lower surface of the BGA package; 'a second set of attachment pads positionally corresponding to the first set of attachment pads;', 'a printed circuit board (PCB) including a first set of wires, each wire of the first set of wires located adjacent to a first linear sequence of the solder balls and extending parallel to a first axis; and', 'a second set of wires, each wire of the second set of wires located adjacent to a second linear sequence of the solder balls and extending parallel to a second axis orthogonal to the first axis; and, 'a current sense mesh attached to an upper surface of the PCB, the current sense mesh comprising electrically connect, sequentially, each wire of the first and of the second set of wires to an input of an amplifier; and', 'generate, on a sequence output, a sequence identifier for each wire connected to the ...

TEST SOCKET ASSEMBLY AND RELATED METHODS

A socket assembly including a housing that has one or more spring probes therein. The socket assembly further includes a leadframe assembly that has one or more cantilever members, and the leadframe assembly has microwave structures and a flexible ground plane. The socket assembly further includes an elastomeric spacer adjacent the leadframe assembly, the elastomeric spacer having one or more holes receiving the spring probes therethrough. 1. A test socket assembly comprising:a housing;a leadframe assembly having impedance controlled microwave structures and a flexible signal and ground plane, the leadframe assembly disposed within the housing; anda spacer adjacent the leadframe assembly and supporting the leadframe assembly.2. The test socket assembly as recited in claim 1 , wherein the spacer is resilient to the ground and microwave structures.3. The test socket assembly as recited in claim 1 , further comprising an outer metal housing having one or more mounting connectors claim 1 , where the lead frame assembly is disposed within the outer metal housing.4. The test socket assembly as recited in claim 1 , further comprising an outer a plastic housing claim 1 , the lead frame assembly is disposed within the plastic housing and having surface-mount connectors are positioned directly on the leadframe assembly.5. The test socket assembly as recited in claim 1 , wherein the leadframe assembly has signal lines claim 1 , and the signal lines are in a coplanar waveguide transmission line structure.6. The test socket assembly as recited in claim 1 , wherein the leadframe assembly has signal lines with split signals claim 1 , and the split signals shift phase to a prescribed amount at a prescribed frequency.7. The test socket assembly as recited in claim 1 , wherein the leadframe assembly has signal lines with split signals claim 1 , and the split signals shift phase of 180 degrees.8. The test socket assembly as recited in claim 6 , wherein a resultant output of the split ...

Testing apparatus

A test apparatus for testing a first flash memory chip is provided. The testing apparatus includes: an interface printed circuit board (PCB), a separate PCB, and a socket device. The separate PCB is disposed over the interface PCB, and a second flash chip is placed between the interface PCB and the separate PCB. The second flash memory chip includes a first embedded flash chip and a dynamic random access memory (DRAM), and the second flash memory chip is connected to the interface PCB through corresponding first pins of the DRAM. The socket device is disposed over the separate PCB and is configured to install the first flash memory chip. The first flash memory chip is connected to the interface PCB through corresponding second pins.

CONTACTOR WITH ANGLED DEPRESSIBLE PROBES IN SHIFTED BORES

A test probe contactor includes an angled depressible probe configuration that causes the tips of the compressible probes to “swipe” the contact pads/solder balls of an IC device under test as the contacts are made. The angulation of the depressible probes permit penetration through foreign material layers on the pad/ball surfaces with less contact force. The contactor includes an upper block and a main block for housing the plurality of probes. The main block and the upper block include corresponding pluralities of slanted probe cavities. The upper bore axis of one or more of the upper probe cavities is laterally shifted relative to the main bore axis of a corresponding probe cavity of the main block, resulting in a lateral offset between the upper bore axis and the main bore axis. 1. A slanted probe contactor for providing electrical contact between an array of contacts of an IC device under test (DUT) and a test board , the contactor comprising:a body portion having substantially parallel top and bottom faces defining a contactor interface wall which lies in an x-y plane and which has a perpendicular z-axis, the top face of said contactor interface wall being configured to receive a DUT which is placed contacts down on the top face, wherein the body portion includes a main block having a plurality of main slanted probe cavities, each main slanted probe cavity having a main bore axis being angled relative to the z-axis of the interface wall, and wherein the body portion also includes an upper block having a corresponding plurality of upper slanted probe cavities;a plurality of depressible probes extending through said contactor interface wall, the depressible probes having probe tips and being angled relative to the z-axis of the interface wall such that the probe tips emerge from the top and bottom faces thereof, and wherein the depressible probes are arranged in different arrays of depressible probes, the depressible probes of one array of depressible probes ...

Current Leakage And Charge Injection Mitigating Solid State Switch

Disclosed is a test and measurement switch matrix. The test and measurement switch matrix includes a solid state switch to couple a test signal from a Device Under Test (DUT) to a test system. The solid state switch has a dual tee guard arrangement providing low leakage when off. The solid state switch also includes an optically coupled drive, which further improves isolation and reduces undesirable charge injection when changing switch states.

VIBRATING DEVICE FOR POSITIONING A MINIATURIZED PIECE IN A TESTING ACCOMMODATION, AND POSITIONING METHOD

A for positioning a miniaturized piece includes a positioning structure that forms a first cavity designed to receive with play the miniaturized piece and a second cavity communicating with the first cavity. At least one electrical-contact terminal is provided facing the second cavity and is electrically coupleable to an electronic testing device designed to carry out an electrical test on the miniaturized piece. An actuator device causes a vibration of the positioning structure such that the vibration translates the miniaturized piece towards the second cavity until it penetrates at least in part into the second cavity. 1. A device for positioning and testing a plurality of integrated circuit chips , the device comprising: a first receptacle configured to receive one of the plurality of integrated circuit chips in a first direction from an external source, each of the plurality of integrated circuit chips having a conductive signal pad; and', 'a second receptacle configured to receive the one of the plurality of integrated circuit chips in a second direction that is substantially orthogonal to the first direction, wherein the second receptacle has a conductive signal terminal; and, 'an plurality of holders, each of the plurality of holders comprisinga positioner configured to move the one of the plurality of integrated circuit chips from the first receptacle, along the second direction, into the second receptacle to a position where the conductive signal pad is in electrical contact with the conductive signal terminal.2. The device of claim 1 , wherein the first receptacle is larger than each of the plurality of integrated circuit chips and the second receptacle is smaller than the first receptacle.3. The device of claim 1 , wherein the plurality of holders is movable together back and forth in at least one direction.4. The device of claim 1 , wherein the first receptacle includes: a bottom; and a side wall having a first portion that extends from and is ...

CONTACT AND TEST SOCKET DEVICE FOR TESTING SEMICONDUCTOR DEVICE

The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device. 115-. (canceled)16. A contact , integrally formed by blanking a metal plate member and rolling the metal plate member into a cylindrical shape , the contact comprising:a first elastic portion formed by connecting a plurality of closed-loop strips of an identical size in series by using a first portion and by bending the closed-loop strips into a cylindrical shape;a second elastic portion formed by connecting a plurality of closed-loop strips of the size identical to the size of the closed-loop strips of the first elastic portion in series by using a second portion and by bending closed-loop strips into a cylindrical shape;a bent portion having a width and a length larger than widths and lengths of the first portion and the second portion and connecting the closed-loop strips in a lowermost end and an uppermost end of the first elastic portion and the second elastic portion in series;an upper head portion having an upper indented portion protruding upwards and extending from the uppermost end of the first elastic portion, and being bent into a cylindrical shape; anda lower head portion having a lower indented portion protruding downwards and extending from the lowermost end of the second elastic portion, and being bent into a cylindrical shape.17. The contact of ...

Test carrier

A test carrier includes a base member that holds a die and a cover member. The base member includes a board having a wiring line that is electrically connected to the die. The wiring line includes a wiring line and a resistive portion having a resistance value that is higher than the resistance value of the wiring line.

Assembly For Testing Semiconductor Devices

A testing assembly for testing a plurality of semiconductor devices comprising a carrier assembly adapted to hold the plurality of semiconductor devices at predetermined locations therein that is operably connectable with a plurality of different socket assemblies. A universal socket assembly is also described.

Method for Testing Semiconductor Devices

A method of testing semiconductor devices includes placing a plurality of semiconductor devices in a carrier assembly and performing at least one testing operation on the plurality of semiconductor devices while they remain inside the carder assembly, 118-. (canceled)19. A method of testing semiconductor devices comprising:placing a plurality of loose semiconductor devices in a carder assembly;preconditioning the semiconductor devices in the carrier assembly;performing at least one pre-stress electrical test on the semiconductor devices in the carrier assembly;performing at least one bias-stress test on the semiconductor devices in the carrier assembly;performing at least one post-stress electrical test on the semiconductor devices in the carder assembly.20. The method of further comprising unloading the semiconductor devices in the carrier assembly.21. The method of further comprising performing failure analysis on at least one semiconductor device unloaded from the carrier assembly.2223-. (canceled)24. The method of wherein the placing the semiconductor devices in the carder assembly comprises placing the semiconductor devices at predetermined locations in the carrier assembly.25. The method of wherein the predetermined locations each includes structures adapted to perform the at least one testing operation.26. The method of further comprising cleaning and drying the semiconductor devices while the devices remain inside the carrier assembly.29. The method of further comprising baking and cleaning the semiconductor devices while the devices remain inside the carrier assembly.27. The method of wherein the at least one testing operation includes a B HAST test.28. A method of testing semiconductor devices comprising:placing a plurality of loose semiconductor devices in a carrier assembly;performing at least one pre-stress electrical test on the semiconductor devices in the carrier assembly;performing at least one bias-stress test on the semiconductor devices in the ...

Testing holders for chip unit and die package

A testing holder for a chip unit, a multi site holding frame for plural chip units and a method for testing a die thereof are provided. The proposed multi site holding frame for testing plural chip units simultaneously includes a first holder frame having a plurality of testing holders. Each of the plurality of testing holders includes a holder body containing a specific one of the plural chip units, and a pressure releasing device formed on the holder body to release an insertion pressure when the specific one of the plural chip units is inserted in the holder body.

CONDUCTIVE CONTACTOR UNIT

A conductive contactor unit includes: a signal conductive contactor configured to input or output a signal to or from a predetermined circuit structure, the signal conductive contactor including a first plunger, a second plunger, and a spring member; and a conductive contactor holder configured to house the signal conductive contactor used for inputting and outputting the signal to and from the predetermined circuit structure, the conductive contactor holder having a coaxial structure with the signal conductive contactor, and including a holder substrate including an opening configured to allow the signal conductive contactor to be inserted therethrough, a holding member housed in the opening, and including a holding hole configured to hold one or more of the signal conductive contactors, and a stab configured to form a hollow space extending from the holding hole in a direction perpendicular to a central axis of the holding hole. 1. A conductive contactor unit comprising:a signal conductive contactor configured to input or output a signal to or from a predetermined circuit structure, the signal conductive contactor includinga first plunger configured to contact the predetermined circuit structure,a second plunger connected to a circuit board configured to input or output the signal to or from the predetermined circuit structure, anda spring member configured to connect the first plunger and the second plunger in an extendable and contractible manner; anda conductive contactor holder configured to house the signal conductive contactor used for inputting and outputting the signal to and from the predetermined circuit structure, the conductive contactor holder having a coaxial structure with the signal conductive contactor, and includinga holder substrate including an opening configured to allow the signal conductive contactor to be inserted therethrough,a holding member housed in the opening, and including a holding hole configured to hold one or more of the signal ...

Contactor with angled depressible probes

A spring probe contactor includes an angled spring probe configuration that causes the tips of the spring probes to “swipe” the contact pads/solder balls of an IC device under test as the contacts are made. The angulation of the spring probes permit penetration through foreign material layers on the pad/ball surfaces with less contact force.

TEST SOCKET AND METHOD FOR TESTING A SEMICONDUCTOR PACKAGE

A test socket includes a base to receive a semiconductor package, an actuator in the base, the actuator including a through-hole, and a socket pin in the through-hole of the actuator, the socket pin contacting a terminal of the semiconductor package, wherein the socket pin includes a pin body, a pin head to contact the terminal of the semiconductor package, and an inclined portion inclined with respect to a longitudinal direction of at least an upper portion of the pin body, the pin head being connected to a top end of the inclined portion, and the pin body being connected to a bottom end of the inclined portion, wherein the inclined portion contacts at least a portion of an inner sidewall of the through-hole. 1. A test socket , comprising:a base to receive a semiconductor package;an actuator in the base, the actuator including a through-hole; anda socket pin in the through-hole of the actuator, the socket pin contacting a terminal of the semiconductor package, a pin body,', 'a pin head to contact the terminal of the semiconductor package, and', 'an inclined portion inclined with respect to a longitudinal direction of at least an upper portion of the pin body, the pin head being connected to a top end of the inclined portion, and the pin body being connected to a bottom end of the inclined portion,', 'wherein the inclined portion contacts at least a portion of an inner sidewall of the through-hole., 'wherein the socket pin includes2. The test socket as claimed in claim 1 , wherein the through-hole includes:a first portion vertical with respect to a surface of the actuator; anda second portion inclined from the first portion toward the surface of the actuator.3. The test socket as claimed in claim 2 , wherein at least a portion of an inner sidewall of the first portion contacts the inclined portion.4. The test socket as claimed in claim 1 , wherein the pin body has a substantially linear shape.5. The test socket as claimed in claim 1 , further comprising:a cover ...

Bga socket device for testing bga ic

Disclosed is a BGA socket device used for testing a BGA IC and having a dual pinch type contact. The BGA socket device includes: contacts each including a fixed terminal and a movable terminal and configured such that respective upper ends of the fixed and movable terminals are offset from each other with respect to each solder ball of the IC; a main body in which the contact is provided and fixed; a cover supported on an upper surface of the main body and configured to be movable up and down; and a slider provided between the main body and the cover and configured to slide left and right, thus opening and closing the movable terminal in a horizontal direction, the slider having a fixed terminal receiving hole and a movable terminal receiving hole in which the fixed and movable terminals of the contact are received, respectively, by passing therethrough.

Chip attach frame

A chip attach frame is used to align pins of an integrated circuit chip with pads on a chip carrier. A frame block has a socket defining two alignment edges that form a reference corner. The chip is lowered into the socket, and the chip carrier is inclined while it supports the frame block and chip until the chip moves under force of gravity to the reference corner. Once located at the reference corner, the chip position is carefully adjusted by moving the frame block in the x- and y-directions until the pins are aligned with the pads. The frame block is spring biased against movement in the x- and y-directions, and the position of the frame block is adjusted using thumbscrews. A plunger mechanism can be used to secure the integrated circuit chip in forcible engagement with the chip carrier once the pins are aligned with the pads.

ELECTRICAL INTERCONNECT ASSEMBLY

An electrical test contact electrically connects a test terminal of an Integrated Circuit (IC) test assembly with an IC terminal of an IC device in an electrical interconnect assembly. The test contact is formed of electrically conductive material and includes a head portion and a foot portion. The head portion includes a first electrical contacting portion for electrically engaging an IC terminal of an IC device during use, and the foot portion includes a second electrical contacting portion for electrically engaging a test terminal of a test assembly during use. The head portion includes a head receiving portion that receives a first resiliently biasing member to retain the first resiliently biasing member in contact with the test contact. The first resiliently biasing member biases the first electrical contacting portion against the IC terminal of the IC device during use. An electrical interconnect assembly having multiple test contacts is also disclosed. 1. An electrical test contact for electrically connecting a test terminal of an IC test assembly with an IC terminal of an IC device in an electrical interconnect assembly , comprising:a first electrical contacting portion for electrically engaging said IC terminal of an IC device during use;a second electrical contacting portion fixed to said first electrical contacting portion for electrically engaging said test terminal of a test assembly during use, said second electrical contacting portion having a curved surface for rotably engaging said test terminal during use;a first resiliently biasing member adapted to engage with said first electrical contacting portion; anda second resiliently biasing member adapted to engage with said second electrical contacting portion and to decelerate a force exerted on the test terminal of the test assembly by the second electrical contacting portion during use.2. An electrical test contact for electrically connecting a test terminal of an IC test assembly with an IC terminal ...

CONTACTOR WITH ANGLED DEPRESSIBLE PROBES

A spring probe contactor includes an angled spring probe configuration that causes the tips of the spring probes to “swipe” the contact pads/solder balls of an IC device under test as the contacts are made. The angulation of the spring probes permit penetration through foreign material layers on the pad/ball surfaces with less contact force. 1. A contactor for providing electrical contact between an array of contacts of an IC device under test (DUT) and a test board , said contactor comprising a body portion having substantially parallel top and bottom faces defining a contactor interface wall which lies in an x-y plane and which has a perpendicular z-axis , the top face of said contactor interface wall being configured to receive a DUT which is placed contacts down on said top face , and a plurality of spring probes extending through said contactor interface wall , said spring probes having probe tips and being angled relative to the z-axis of said interface wall such that the probe tips of said spring probes emerge at an angle from the top and bottom faces thereof.2. The contactor of wherein the angle of the spring probes relative to the z-axis of said contactor interface wall is between about 2 and 25 degrees.3. The contactor of wherein the angle of the spring probes relative to the z-axis of said contactor interface wall is between about 10 and 20 degrees.4. The contactor of wherein the spring probes are arranged in different arrays of spring probes claim 1 , the spring probes of one array of spring probes being angled differently than the spring probes of another array of spring probes.5. The contactor of wherein at least two arrays of spring probes are provided claim 1 , one of which is angled oppositely from the spring probes of other array of spring probes.6. The contactor of wherein said spring probes are single-ended spring probes having depressible probe tips and a non-depressible probe tips.7. The contactor of wherein the non-depressible probe tips of ...

Electronics tester

A tester apparatus is described. Various components contribute to the functionality of the tester apparatus, including an insertion and removal apparatus, thermal posts, independent gimbaling, the inclusion of a photo detector, a combination of thermal control methods, a detect circuitry in a socket lid, through posts with stand-offs, and a voltage retargeting.

TESTING HOLDERS FOR CHIP UNIT AND DIE PACKAGE

A testing holder for a chip unit, a multi site holding frame for plural chip units and a method for testing a die thereof are provided. The proposed multi site holding frame for testing plural chip units simultaneously includes a first holder frame having a plurality of testing holders. Each of the plurality of testing holders includes a holder body containing a specific one of the plural chip units, and a pressure releasing device formed on the holder body to release an insertion pressure when the specific one of the plural chip units is inserted in the holder body. 1. A testing holder for a chip unit , comprising:a holder body configured to contain the chip unit; anda pressure releasing device formed on the holder body configured to release an insertion pressure when the chip unit is inserted in the holder body.2. The testing holder of claim 1 , wherein the holder body further comprises a surrounding wall claim 1 , and the surrounding wall defines an inner space configured for containing and testing the chip unit.3. The testing holder of claim 2 , wherein the surrounding wall further has a tilted surface configured to guide therein an insertion of the chip unit and to avoid an edge scratch on the chip unit.4. The testing holder of claim 2 , wherein the surrounding wall has an upper surrounding wall including a first and a second openings with a first size and a lower surrounding wall including a third opening with a second size claim 2 , the upper surrounding wall and the lower surrounding wall are connected by plural guide pins claim 2 , and is configured so that the chip unit is insertable into the holder body via the first claim 2 , the second claim 2 , and the third openings claim 2 , and the first size is equal to a size of the chip unit to fix an inserted chip unit.5. The testing holder of claim 2 , wherein the testing holder has an outer dimension kept unchanged and an inner dimension adapted to a size of a chip unit to be inserted in the testing holder.6. ...

Ic chip holder

The present disclosure relates to an IC chip holder capable of alleviating an impact if the IC chip holder is dropped or collides with another object. In the IC chip holder, an upper housing body is provided, on a side of electric contacts of an IC chip, with an elastic deformation portion capable of elastically deforming toward the inside of the upper housing body. Thus, since the elastic deformation portion elastically deforms toward the inside of the upper housing body, if the IC chip holder is dropped or collides with another object, the elastic deformation portion bends and the impact is alleviated. Thus, a possibility of the IC chip being damaged is reduced.

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Improvement in yield of a semiconductor device is obtained. In addition, increase in service life of a socket terminal is obtained. A projecting portion PJ and a projecting portion PJ are provided in an end portion PU of a socket terminal STE. Thus, it is possible to enable contact between a lead and the socket terminal STE in which a large current is caused to flow, at two points by a contact using the projecting portion PJ and by a contact using the projecting portion PJ, for example. As a result, the current flowing from the socket terminal STE to the lead flows by being dispersed into a path flowing in the projecting portion PJ and a path flowing in the projecting portion PJ. Accordingly, it is possible to suppress increase of temperature of a contact portion between the socket terminal STE and the lead even in a case where the large current is caused to flow between the socket terminal STE and the lead. 116-. (canceled)17. A method of manufacturing a semiconductor device , comprising: the socket including a housing portion, a first socket terminal, a second socket terminal, and a third socket terminal,', a first semiconductor chip having a low-side MOSFET, which is a component of a DC/DC converter,', 'a second semiconductor chip having a planar size smaller than a planar size of the first semiconductor chip and having a high-side MOSFET, which is a component of the DC/DC converter,', 'a first external terminal electrically connected with a source of the low-side MOSFET,', 'a second external terminal electrically connected with each of a drain of the low-side MOSFET and a source of the high-side MOSFET,', 'a third external terminal electrically connected with a drain of the high-side MOSFET,', 'a sealing body sealing the first semiconductor chip and the second semiconductor chip such that a first surface of the first external terminal, a second surface of the second external terminal, and', 'a third surface of the third external terminal are exposed,', 'a first ...

TESTING HOLDERS FOR CHIP UNIT AND DIE PACKAGE

A testing holder for a chip unit, a multi site holding frame for plural chip units and a method for testing a die thereof are provided. The proposed multi site holding frame for testing plural chip units simultaneously includes a first holder frame having a plurality of testing holders. Each of the plurality of testing holders includes a holder body containing a specific one of the plural chip units, and a pressure releasing device formed on the holder body to release an insertion pressure when the specific one of the plural chip units is inserted in the holder body. 1. A testing holder for a chip , comprising:a holder body configured to contain the chip, a bottom plate;', 'a surrounding wall disposed on the bottom plate,', 'an upper surrounding wall with a first opening and a second opening having a first size; and', 'wherein the surrounding wall comprises], 'wherein the holder body comprisesa lower surrounding wall with a third opening having a second size, and wherein the second size is larger than the first size.2. The testing holder of claim 1 , wherein the surrounding wall has a tilted surface configured to guide therein an insertion of the chip.3. The testing holder of claim 1 , wherein the surrounding wall has a recess formed therein.4. The testing holder of claim 1 , wherein the upper surrounding wall and the lower surrounding wall are connected by plural guide pins.5. The testing holder of claim 1 , wherein the testing holder has an inner dimension configured to be adapted to a size of a chip to be inserted in the testing holder.6. The testing holder of claim 1 , further comprising a porous metal plate disposed between the bottom plate and the lower surrounding wall.7. The testing holder of claim 1 , wherein the porous metal plate is formed of a copper/nickel alloy.8. A testing holder for a chip claim 1 , comprising: wherein the holder body comprises:', 'a bottom plate; and', wherein the surrounding wall comprises:', 'an upper surrounding wall; and', 'a ...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

A semiconductor device is manufactured at an improved efficiency. The method of the invention includes a step of carrying out an electrical test by bringing an external terminal electrically coupled to a semiconductor chip mounted on a semiconductor device into contact with a tip portion of a probe pin coupled to a test circuit and thereby electrically coupling the semiconductor chip to the test circuit. The probe pin has a tip portion comprised of a base material, a nickel film formed thereon, and a conductive film formed thereon and made of silver. The conductive film is thicker than the nickel film. 1. A method of manufacturing a semiconductor device , comprising the steps of:(a) providing a semiconductor device having a semiconductor chip and an external terminal electrically coupled to a semiconductor integrated circuit formed over a main surface of the semiconductor chip; and(b) bringing the external terminal into contact with a contact region of a test terminal to test electrical properties of the semiconductor integrated circuit,wherein the contact region of the test terminal has a base material, a nickel film formed over the base material, and a conductive film formed over the nickel film and including silver, andwherein the conductive film is thicker than the nickel film.2. The method of manufacturing a semiconductor device according to claim 1 ,wherein the conductive film includes silver having a Vickers hardness of 170 HV or more.3. The method of manufacturing a semiconductor device according to claim 1 ,wherein the conductive film includes silver containing diamond nanoparticles.4. The method of manufacturing a semiconductor device according to claim 3 ,wherein primary particles of the nanoparticles have a particle size of 5 nm or less.5. The method of manufacturing a semiconductor device according to claim 1 ,wherein the conductive film has a first conductive film formed over the nickel film and a second conductive film formed over the first conductive ...

Test Socket

The test socket includes: a pressing body for pressing an IC package housed in a device housing portion in a direction toward a board; a lid-part main body holding the pressing body while allowing reciprocating movement in the direction toward and from the board, and to be connected to a housing-part main body; a stopper attached at an intermediate point to the lid-part main body so that the stopper is swingable, the stopper having an engaging portion 5 a coming into engagement with the housing-part main body, and a proximal end portion approaching and separating from a side surface of the lid-part main body; and an insertion portion to be inserted into a gap between the proximal end portion and the side surface of the lid-part main body according to an action of the pressing body pressing the IC package in the direction toward the board.

TESTING HOLDERS FOR CHIP UNIT AND DIE PACKAGE

A testing holder for a chip unit, a multi site holding frame for plural chip units and a method for testing a die thereof are provided. The proposed multi site holding frame for testing plural chip units simultaneously includes a first holder frame having a plurality of testing holders. Each of the plurality of testing holders includes a holder body containing a specific one of the plural chip units, and a pressure releasing device formed on the holder body to release an insertion pressure when the specific one of the plural chip units is inserted in the holder body. 1. A testing holder for a chip unit , comprising:a holder body configured to contain the chip unit; anda pressure releasing device formed on the holder body configured to release an insertion pressure when the chip unit is inserted in the holder body,wherein the holder body comprises a bottom plate,wherein the bottom plate comprises one of either a set of plural pogo pins or a set of plural soft spacers for absorbing a contact stress from the insertion.2. The testing holder of claim 1 , wherein the holder body further comprises a surrounding wall claim 1 , and the surrounding wall defines an inner space configured for containing and testing the chip unit.3. The testing holder of claim 2 , wherein the surrounding wall further has a tilted surface configured to guide therein an insertion of the chip unit and to avoid an edge scratch on the chip unit.4. The testing holder of claim 2 , wherein the surrounding wall has an upper surrounding wall including a first and a second openings with a first size and a lower surrounding wall including a third opening with a second size claim 2 , the upper surrounding wall and the lower surrounding wall are connected by plural guide pins claim 2 , and is configured so that the chip unit is insertable into the holder body via the first claim 2 , the second claim 2 , and the third openings claim 2 , and the first size is equal to a size of the chip unit to fix an inserted ...

ELECTRIC COMPONENT SOCKET

An electric component socket in which a pressing member is not brought into contact with the tip end of the a contact pin when the socket is pressed by the pressing member in a state where an electric component is not housed in the socket. The electric component socket is provided with a movable plate supported so as to move vertically, a floating plate that is provided above the movable plate and houses the electric component, and a movable spacer that protrudes upward from an upper surface of the movable plate. The electric component socket is configured so that the movable plate is thereby moved downward, thereby enabling the regulating section of the movable plate to move the contact pin downward when the movable spacer is moved downward. 1. An electric component socket , comprising:a socket body in which a first electric component is housed and which is disposed on a second electric component, the first electric component and the second electric component being electrically connected to each other via a contact pin disposed in the socket body, a movable plate configured to be supported so as to move vertically and energized upward by a plate energizing member,', 'a floating plate configured to be supported above the movable plate so as to move vertically and house the first electric component therein, and', 'a movable spacer configured to protrude upward from an upper surface of the movable plate,, 'the socket body including'} a first conductive contact member configured to be brought into contact with the first electric component,', 'a second conductive contact member configured to be brought into contact with the second electric component, and', 'a spring member configured to energize the first contact member to the first electric component side,, 'the contact pin including'} a first through-hole configured to pass the first contact member of the contact pin therethrough, and', 'a regulating section configured to regulate an upward movement of the first ...

TESTING HOLDERS FOR CHIP UNIT AND DIE PACKAGE

A testing holder for a chip unit, a multi site holding frame for plural chip units and a method for testing a die thereof are provided. The proposed multi site holding frame for testing plural chip units simultaneously includes a first holder frame having a plurality of testing holders. Each of the plurality of testing holders includes a holder body containing a specific one of the plural chip units, and a pressure releasing device formed on the holder body to release an insertion pressure when the specific one of the plural chip units is inserted in the holder body. 1a holder body configured to contain the chip unit; anda pressure releasing device formed on the holder body configured to release an insertion pressure when the chip unit is inserted in the holder body.. A testing holder for a chip unit, comprising: This application is a Continuation of U.S. application Ser. No. 15/594,143, filed on May 12, 2017, which is a Continuation of U.S. application Ser. No. 15/250,198, filed Aug. 29, 2016 now U.S. Pat. No. 9,664,707, which is a Continuation of U.S. application Ser. No. 15/098,037, filed Apr. 13, 2016 now U.S. Pat. No. 9,453,877, which is a Continuation of U.S. application Ser. No. 13/830,525, filed Mar. 14, 2013 now U.S. Pat. No. 9,341,671, the entire contents of which are hereby incorporated by reference.As semiconductor technologies evolve, three-dimensional integrated circuits emerge as an effective alternative to further reduce the physical size of a semiconductor chip. In a three-dimensional integrated circuit (3DIC), active circuits are fabricated on different wafers and each wafer die is stacked on top of another wafer die using pick-and-place techniques. Much higher density can be achieved by employing vertical stacking of integrated circuits. Furthermore, three-dimensional integrated circuits can achieve smaller form factors, cost-effectiveness, increased performance and lower power consumption.The making and using of the present embodiments are ...

VERTICAL PROBE TESTING HEAD WITH IMPROVED FREQUENCY PROPERTIES

A testing head comprises at least one guide provided with a plurality of guide holes, and a plurality of contact elements housed in the plurality of guide holes. Suitably, the at least one guide comprises a plurality of conductive layers, each conductive layer: including holes of a corresponding plurality of group of the plurality of guide holes and electrically connecting a corresponding group of contact elements housed in the guide holes of the group, contact elements of a group being adapted to carry a same type of signal. The at least one guide is a multilayer comprising a plurality of non-conductive layers, and the conductive layers are arranged on respective faces of a layer of the plurality of non-conductive layers. 1. A testing head comprising:at least one guide provided with a plurality of guide holes, the plurality of guide holes including a plurality of groups of guide holes, and including holes of a corresponding group of the plurality of groups of guide holes, and', 'electrically connecting a corresponding group of contact elements, of the groups of contact elements, housed in the guide holes of the corresponding group of guide holes, the contact elements of the corresponding group of contact elements being adapted to carry a same type of signal, wherein:, 'a plurality of contact elements housed in the plurality of guide holes, the plurality of contact elements including a plurality of groups of contact elements, wherein the at least one guide comprises a plurality of conductive layers, each conductive layerthe at least one guide is a multilayer comprising a plurality of non-conductive layers, andthe conductive layers are arranged on respective faces of a layer of the plurality of non-conductive layers.2. The testing head of claim 1 , wherein the at least one guide is a ceramic multilayer comprising a plurality of non-conductive layers made of a ceramic material.3. The testing head of claim 1 , wherein the at least one guide comprises an organic ...

CONTACTOR WITH ANGLED DEPRESSIBLE PROBES IN SHIFTED BORES

A test probe contactor includes an angled depressible probe configuration that causes the tips of the compressible probes to “swipe” the contact pads/solder balls of an IC device under test as the contacts are made. The angulation of the depressible probes permit penetration through foreign material layers on the pad/ball surfaces with less contact force. The contactor includes an upper block and a main block for housing the plurality of probes. The main block and the upper block include corresponding pluralities of slanted probe cavities. The upper bore axis of one or more of the upper probe cavities is laterally shifted relative to the main bore axis of a corresponding probe cavity of the main block, resulting in a lateral offset between the upper bore axis and the main bore axis. 1. A slanted probe contactor for providing electrical contact between an array of contacts of an IC device under test (DUT) and a test board , the contactor comprising:a body portion having substantially parallel top and bottom faces defining a contactor interface wall which lies in an x-y plane and which has a perpendicular z-axis, the top face of said contactor interface wall being configured to receive a DUT which is placed contacts down on the top face, wherein the body portion includes a main block having a plurality of main slanted probe cavities, each main slanted probe cavity having a main bore axis being angled relative to the z-axis of the interface wall, and wherein the body portion also includes an upper block having a corresponding plurality of upper slanted probe cavities;a plurality of depressible probes extending through said contactor interface wall, the depressible probes having probe tips and being angled relative to the z-axis of the interface wall such that the probe tips emerge from the top and bottom faces thereof, and wherein the depressible probes are arranged in different arrays of depressible probes, the depressible probes of one array of depressible probes ...

IC CHIP HOLDER

The present disclosure relates to an IC chip holder capable of alleviating an impact if the IC chip holder is dropped or collides with another object. In the IC chip holder, an upper housing body is provided, on a side of electric contacts of an IC chip, with an elastic deformation portion capable of elastically deforming toward the inside of the upper housing body. Thus, since the elastic deformation portion elastically deforms toward the inside of the upper housing body, if the IC chip holder is dropped or collides with another object, the elastic deformation portion bends and the impact is alleviated. Thus, a possibility of the IC chip being damaged is reduced. 1. IC chip holder configured for removable insertion into a chip writer unit provided on a printer having one or more ink tanks refillable , the IC chip holder being further configured to be attached to , and detached from , an ink storage container for filling the one or more ink tanks of the printer with ink , the IC chip holder comprising:a housing body configured to mount an IC Chip, the housing body having:a top surface;a side surface; andan elastic deformation portion configured to elastically deform toward the inside of the housing body, the elastic deformation portion having a protrusion protruding further to the outside than the top surface of the housing body, the elastic deformation portion being positioned between a portion configured to mount an IC Chip and the side surface in a first direction, the top surface being positioned in a second direction perpendicular to the first direction with respect to the elastic deformation portion.2. The IC chip holder according to claim 1 , whereinthe elastic deformation portion is provided with a base portion cantileveredly supported by the housing body.3. The IC chip holder according to claim 2 , whereinthe base portion is positioned further to the inside than the top surface.4. The IC chip holder according to claim 1 , whereinthe elastic deformation ...

검사소켓 및 그의 제조방법

프로브를 지지하는 검사소켓의 제조방법이 개시된다. 검사소켓의 제조방법은, 상기 프로브를 수용하는 프로브공이 마련된 절연성의 재질의 소켓블록 및 상기 소켓블록의 외면에 피복된 도전성 재질의 외부막과 상기 프로브공의 내면에 피복된 도전성 재질의 내부막을 가진 코팅부를 포함하며, 상기 내부막의 적어도 일부는 상기 외부막으로부터 전기적으로 격리되어 있는 것을 특징으로 한다.

Sockets for electrical contacts and electrical components

본 발명은, 장기간에 걸쳐 반복 사용해도 접촉 저항이 쉽게 증대하지 않는 전기 접촉자를 제공한다. 전기 접촉자의 모재에, 제1 전기 부품의 제1 전극에 접촉하는 제1 접촉부와, 제2 전기 부품의 제1 전극에 접촉하는 제2 접촉부와, 제1 접촉부를 제1 전극에 압압하는 스프링부를 설치하고, 제1 접촉부의 선단부에 내마모성 접점막을 형성한다. 또한, 모재의, 내마모성 접점막의 영역과 제2 접촉부의 선단부와의 사이에, 상기 모재보다도 전기 저항이 작은 고도전성막을 형성한다. The present invention provides an electrical contactor whose contact resistance does not easily increase even when repeatedly used over a long period of time. On the base material of the electrical contactor, a first contact portion in contact with the first electrode of the first electrical component, a second contact portion in contact with the first electrode of the second electrical component, and a spring portion pressing the first contact portion with the first electrode And a wear-resistant contact film is formed at the tip of the first contact portion. Further, a highly conductive film having an electric resistance smaller than that of the base material is formed between the region of the wear-resistant contact film of the base material and the tip of the second contact part.

상하 2개의 영역으로 구분되는 단일 코일 스프링을 포함하는 테스트 소켓

본 발명의 테스트 핀은, 반도체 기기와 테스트 장치 사이에서 상하 슬라이드 되고, 상기 반도체 기기의 도전 볼 일측에 접촉하는 제1볼 플런저, 상기 제1볼 플런저와 개별적으로 동작하고, 상기 도전 볼의 타측에 접촉하는 제2볼 플런저, 한 쌍의 상기 볼 플런저 사이에서 독립적으로 슬라이드 되고, 상기 테스트 장치의 콘택 패드와 접촉하는 패드 플런저, 및 상기 제1볼, 제2볼, 및 패드 플런저의 외측에 탑재되고, 일체로 형성되나 직경이 상이한 다수 구간으로 구성되는 단일 코일 스프링를 포함한다. 이와 같은 본 발명의 구성에 의하면, 부품수와 공정수가 단축된다.

Test socket which allows for ease of alignment

本发明涉及一种允许简单对准的测试插座，并且更具体地涉及一种介于待检器件与检测仪器之间而将待检器件的端子与检测仪器的焊盘进行电连接的测试插座，该测试插座包括：一个对准构件，该对准构件具有多个在与该待检器件的这些端子或该检测仪器的这些焊盘相对应的点处形成的通孔、并且被附接到该检测仪器上而使得这些通孔被定位于该检测仪器的这些焊盘处；以及一个弹性导电片，该弹性导电片包括多个导电部分、多个绝缘支撑部分、以及多个伸出的导电部分，这些导电部分是布置在与该待检器件的这些端子相对应的点处并且包括分布于一种绝缘弹性材料中的多个导电粒子，这些绝缘支撑部分支撑这些导电部分并且将相邻的导电部分之间的电连接断开，并且这些伸出的导电部分从这些导电部分向下伸出并且插入到该对准构件的这些通孔中，其中，在这些伸出的导电部分被插入到该对准构件的这些通孔中时，该弹性导电片在该对准构件中对准。

Contact device for test and test socket

The present invention relates to a contact device for a test and an electric test socket. More specifically, the contact device for a test is inserted into through holes of a housing having the through holes formed at every location corresponding to terminals of a device to be tested to electrically connect the device to be tested and pads of a test device. The contact device for a test comprises: a first plate member including a first probe unit having a probe formed at the lower end thereof and a first contact unit which is extended upward from the first probe unit; and a pair of second plate members which are spaced apart from each other interposing the first plate member therebetween. Each of the second plate members includes: a second plate member including a second probe unit which has a probe formed at the upper end thereof and is extended downward with a certain width and a second contact unit which is extended downward from the second probe unit and is in surface-contact with the first contact unit; and a spring member which is arranged to surround the first and second contact units at a part where the first contact unit and the second contact unit are overlapped with each other and supports the first and second plate members to be relatively slid, wherein a second protrusion unit is arranged on one surface of the second probe unit facing the inner wall of the through holes to fill at least a portion of space between the inner wall of the through holes and one surface of the second probe unit.

Inspection contact device and electrical inspection socket

Electrical test socket

The present invention relates to a test socket and, more specifically, to a test socket for electrically connecting a pad of a test device and a terminal of a tested device by being installed between the tested device and the test device. The test socket includes: an anisotropic conductive sheet including a first conductive unit, an insulation supporting unit, and a second conductive unit; a guide sheet installed on the upper side of the insulation supporting unit and separated from the insulation supporting unit, wherein the guide sheet has a through hole installed at all positions corresponding to the second conductive unit; and multiple elastic pumps separated from the second conductive unit in a horizontal direction. The first conductive unit is installed at all positions corresponding to the terminal of a tested device and has multiple first conductive particles arranged in a thickness direction in an insulating elastic matter. The insulation supporting unit is installed around the first conductive unit and insulates each first conductive unit from others while supporting the first conductive unit. The second conductive unit protrudes from the first conductive unit to the upper side and is positioned to be higher than the upper surface of the insulation supporting unit. The lower surface of each elastic pump is in contact with the upper surface of the insulation supporting unit and the upper surface is in contact with the lower surface of the guide sheet to support the guide sheet. The elastic pumps are formed of a material that is softer than the guide sheet.

Ball Grid Array Package Test Apparatus and Method

모듈 기판 상에 실장된 볼 그리드 어레이 패키지(BGA패키지)검사장치 및 그 검사방법을 개시한다. 이러한 BGA패키지 검사장치는 테스트를 하기 위한 신호라인이 패키지용테스트신호라인과 기판용테스트신호라인으로 구성되고, 그 패키지용테스트신호라인 및 기판용테스트신호라인은 접속장치에 의해 분리 또는 연결되도록 구성된다. 이와 같은 구성에 의해 실제 메모리모듈을 구동할 경우 테스트신호라인이 스텁(STUB)으로 작용하는 것을 줄이는 이점이 있다. Disclosed are a ball grid array package (BGA package) inspection apparatus mounted on a module substrate, and an inspection method thereof. The BGA package inspection device is configured such that a signal line for testing consists of a test signal line for a package and a test signal line for a board, and the test signal line for a package and the test signal line for a board are separated or connected by a connection device. do. Such a configuration has an advantage of reducing the test signal line acting as a stub when driving the actual memory module.

universal test socket and semiconductor package testing apparatus using the same

본 발명의 범용 테스트 소켓은 중앙부에 관통창이 형성된 측벽과 측벽의 내측으로 돌출된 내측 돌출부에 복수개의 핀홀들이 형성된 하우징 프레임과, 테스트 핀들이 배치된 핀 플레이트와 핀 플레이트의 외주면에 형성된 복수개의 가이드 핀들을 구비하고 하우징 프레임과 체결되는 핀 플레이트 어셈블리와, 하우징 프레임에 체결된 핀 플레이트 어셈블리 상부에 위치하여 하우징 프레임과 체결되고 내부에 테스트될 반도체 패키지가 탑재될 수 있는 패키지 가이드부를 포함한다. 본 발명의 범용 테스트 소켓은 핀 플레이트 어셈블리가 하우징 프레임에 체결될 때 핀 플레이트 어셈블리의 가이드 핀들의 삽입 위치를 알기 위해 하우징 프레임의 내측 돌출부의 배면에는 표시부가 설치되어 있고, 가이드 핀들이 핀홀들에 삽입되어 하우징 프레임에 체결될 때 핀 플레이트 어셈블리의 회전 방향에 따라 하우징 프레임 내에서 배열된 테스트 핀들의 위치가 이동한다. A universal test socket of the present invention comprises a housing frame having a sidewall having a through-hole formed at its center and a plurality of pinholes formed at an inner protruding portion protruding inwardly of the sidewall, a pin plate having test pins disposed thereon, and a plurality of guide pins And a package guide portion which is positioned above the pin plate assembly fastened to the housing frame and is fastened to the housing frame and on which the semiconductor package to be tested can be mounted. The universal test socket of the present invention is provided with a display portion on the back surface of the inner protrusion of the housing frame for inserting the guide pins of the pin plate assembly into the housing frame when the pin plate assembly is fastened to the housing frame, And the position of the test pins arranged in the housing frame moves according to the rotational direction of the pin plate assembly when the housing is fastened to the housing frame.

Contact structure for interconnections interposer semiconductor assembly and method

상호접속 접촉구조 어셈블리는 표면과 이 표면에 액세스 가능하며 상기 전자소자에 의해 지지된 도전접촉구조를 가진다. 접촉구조는 제1 및 제2단부를 가진 내부 가요성 연장부재를 포함하며, 상기 제1단부는 개별 본딩 재료를 사용하지 않고 상기 도전접촉단자의 표면에 제1인티메이트 본드를 형성한다. 전기도전 셸은 상기 연장부재를 밀봉하고 상기 제1인티메이트에 인접한 상기 도전 접촉단자의 적어도 일부분을 가진 제2인티메이트 본드를 형성하는 적어도 하나의 도전재료층으로 형성된다.

Method for manufacturing a contact guide film in an inspection socket for semiconductor package

본 발명은 경질의 절연성 수지로 판상의 필름을 준비하고; 상기 절연성 수지 필름에 다수의 통과공을 형성하고; 상기 절연성 수지 필름의 일면에 투명한 연성필름을 대고, 다른 일면에 도전성 페이스트를 밀어넣어 상기 다수의 통과공을 채우고; 상기 투명한 연성필름을 통해 모든 통과공으로부터 도전성 페이스트가 채워진 것을 확인한 후, 도전성 페이스트의 채움을 중단하고; 및 상기 절연성 수지 필름의 양 표면상의 도전성 페이스트 및 투명한 연성필름을 제거하는 단계를 포함하여 구성되는 반도체 패키지 검사용 소켓의 컨택가이드 필름 제조방법을 제공한다. 본 발명에 따르면, 전기적 특성의 신뢰성을 크게 향상시킨 반도체 소자의 테스트 소켓에 사용되는 컨택가이드 필름을 제조할 수 있고, 특히 컨택가이드 필름의 사용상의 오염을 감소시킬 수 있으며, 오염이 발생되더라고 쉽게 세척 및 재활용이 가능하다. 컨택가이드 필름, 전기 접촉성, 도전성 고무, BGA 패키지

Electrical contact device in semiconductor device inspection equipment

Pins for testing semiconductor chips and sockets for testing semiconductor chips including them

본 고안은 반도체 칩 테스트용 핀 및 그를 포함한 반도체 칩 테스트용 소켓에 관한 것으로, 더욱 상세하게는 반도체 칩에 접근하는 움직임이 자연스럽고 테스트 단자와의 접촉이 확실히 이루어져서 테스트 신뢰성을 향상시키고, 반도체 칩 단자와의 접촉시 발생하는 마모도가 작음은 물론 일측 컨택 단자의 마모시에는 타측 컨택 단자로 뒤집어 사용할 수 있어서 비용을 저감하며, 부품 수가 줄어들면서도 부품의 파손은 방지할 수 있는 반도체 칩 테스트용 핀 및 그를 포함한 반도체 칩 테스트용 소켓에 관한 것이다. The present invention relates to a semiconductor chip test pin and a semiconductor chip test socket including the same, and more particularly, a natural approach to the semiconductor chip and the contact with the test terminal is securely made to improve the test reliability, and the semiconductor chip terminal The pins for semiconductor chip test that can reduce the cost and reduce the number of parts and prevent the parts from being damaged by being able to turn over to the other contact terminal when the wear of one contact terminal is not only small. The present invention relates to a socket for testing a semiconductor chip.

Probe

검사신호를 안정적으로 전달할 수 있는 프로브를 개시한다. 개시된 프로브는, 반도체 디바이스 및 상기 반도체 디바이스를 테스트 하기 위한 테스터 사이를 전기적으로 연결하기 위한 것으로서, 상기 반도체 디바이스와 전기적으로 연결 가능한 상부 플런저와; 상기 테스트와 전기적으로 연결 가능한 하부 플런저와; 상기 상부 플런저와 상기 하부 플런저 사이에 배치되어 상기 상부 플런저 및 상기 하부 플런저가 서로 이격되도록 상기 상부 플런저 및 상기 하부 플런저를 탄성바이어스 시키는 탄성부재와; 상기 탄성부재 내부 또는 외부에 배치되어 상기 상부 플런저와 상기 하부 플런저를 전기적으로 연결하는 도전성부재와; 상기 상부 및 하부플런저, 상기 탄성부재 및 상기 도전성부재를 수용하는 배럴을 포함하는 것을 특징으로 한다. Disclosed is a probe that can stably transmit a test signal. The disclosed probe includes an upper plunger electrically connected between a semiconductor device and a tester for testing the semiconductor device, the upper plunger being electrically connectable with the semiconductor device; A lower plunger electrically connectable with said test; An elastic member disposed between the upper plunger and the lower plunger to elastically bias the upper plunger and the lower plunger such that the upper plunger and the lower plunger are spaced apart from each other; A conductive member disposed inside or outside the elastic member to electrically connect the upper plunger and the lower plunger; And a barrel accommodating the upper and lower plungers, the elastic member and the conductive member.

Test connector for electrical equipment

Interposer for inspection for semiconductor chip

본 기술은 반도체 칩의 신뢰성을 검증하기 위한 검증용 인터포저를 개시한다. 본 기술의 검증용 인터포저는 제 1면의 액티브 영역에 배치되며 액티브 모드시 검증대상 칩을 테스트하기 위한 데이터와 제어신호가 입출력되는 패드들 및 상기 검증대상 칩과 인터포저의 동작을 위한 전원을 공급받는 패드들을 포함하는 액티브 패드들, 상기 제 1면의 패시브 영역에 배치되며, 패시브 모드시 상기 검증대상 칩을 테스트하기 위한 데이터 및 상기 검증대상 칩과 인터포저의 동작을 위한 전원을 공급받는 패드들을 포함하는 패시브 패드들 및 상기 제 1면과 대향되는 제 2 면에 배치되며, 상기 검증대상 칩과 연결되는 범프 패드들을 포함할 수 있다.

A socket for testing packages, a rubber for the test socket, and a guide for the test socket

본 발명은 전기배선을 구비하는 2 이상의 러버; 전기 배선을 구비하는 2 이상의 가이드; 및 상기 러버 및 상기 가이드를 수납하는 소켓 프레임을 구비하고, 상기 러버의 개수와 상기 가이드의 개수가 동일하고, 상기 러버 및 상기 가이드가 상기 소켓 프레임의 수납 공간 내에서 최하부에 하나의 러버가 위치하도록 교대로 적층되는 패키지 테스트용 소켓을 제공한다. The present invention is two or more rubber having an electrical wiring; Two or more guides having electrical wiring; And a socket frame accommodating the rubber and the guide, wherein the number of the rubber is equal to the number of the guide, and the rubber and the guide are positioned at a lowermost portion in the storage space of the socket frame. Provides a package test socket that is alternately stacked. 본 발명의 패키지 테스트용 소켓을 이용하여 패키지를 테스트하면 멀티칩 반도체 패키지를 제조하여 테스트하지 않더라도 단일칩 반도체 패키지를 이용하여 멀티칩 반도체 패키지의 테스트 결과를 얻을 수 있다. When the package is tested using the package test socket of the present invention, the test result of the multichip semiconductor package may be obtained using the single chip semiconductor package even if the multichip semiconductor package is not manufactured and tested. 패키지 테스트용 소켓, 러버, 가이드, 전기배선, Socket for testing packages, rubber, guides, electrical wiring,

Contact for electronic device

본 발명은 전자장치용 콘택트에 관한 것으로서, 검사 대상인 별도의 반도체 IC의 리드와 접촉하도록 하는 소정형상의 접촉부와, 두개의 고정 돌기와, 몸체를 포함하는 상부 접촉 핀; 상기 상부 접촉 핀과 상호 직교하도록 결합되는 하부 접촉 핀; 및 상기 상부 접촉 핀과 하부 접촉 핀 사이에 삽입되는 스프링; 을 포함하되, 상기 몸체는, 단부에 경사면과 걸림 돌기가 형성되어 있고, 서로 대칭하는 두개의 탄성부를 가지고, 상기 두 탄성부의 내측에는 상기 하부 접촉 핀과 결합되었을 때 유동 공간을 제공하는 도피 홈이 형성되어 있으며, 상기 하부 접촉 핀의 걸림 돌기를 수용 걸림 및 유동하도록 하고, 상기 하부 접촉 핀의 걸림 돌기 및 측면 접촉부와 전기적으로 접촉하도록 형성된 유동 홈;으로 구성되는 것을 특징으로 한다. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device contact, comprising: a contact portion having a predetermined shape for contacting a lead of a separate semiconductor IC to be inspected, two fixing protrusions, and an upper contact pin including a body; A lower contact pin coupled to be orthogonal to the upper contact pin; And a spring inserted between the upper contact pin and the lower contact pin; Including, but the body, the inclined surface and the engaging projection is formed at the end, and has two elastic portions symmetric with each other, the inner side of the two elastic portion is an escape groove that provides a flow space when combined with the lower contact pins And a flow groove formed to receive and lock the catching protrusion of the lower contact pin and to flow, and to electrically contact the catching protrusion and the side contact portion of the lower contact pin. 콘택트, 반도체 IC, PCB, 테스트 소켓 Contacts, Semiconductor ICs, PCBs, Test Sockets

Contact and test socket device for testing semiconductor device

【課題】従来技術のピンタイプとラバータイプのテストソケット装置の欠点を補完して電気的特性に優れ且つ使用寿命を延長することができるファインピッチのデバイスに適したテストソケット装置を提供する。【解決手段】半導体デバイスをテストするためのコンタクト１００及びソケット装置に関し、コンタクト１００は、金属板材を打ち抜きし、曲げて一体に構成されたスプリングコンタクトであって、一定のパターンの多様なストリップからなる弾性部１２０と、弾性部１２０の両端にそれぞれ設けられた尖端部とを含み、好ましくは、空間体積内に導電性と弾性を有するフィラーが充填されることにより、耐久性と電気的特性に優れる。また、本発明に係るテストソケットは、上述したコンタクトを採用したラバータイプであって、ファインピッチ用デバイスのテストに適する。【選択図】図２

Film of test socket fabricated by MEMS technology having improved contact bump

본 발명의 테스트 소켓용 MEMS 필름은 반도체 기기와 테스트 장치 사이에 배치되어 상기 반도체 기기의 전기적 검사를 수행하는 테스트 소켓용 MEMS 필름에 있어서, 가요성의 베어 필름, 및 MEMS 공정에 의하여 상기 베어 필름 상에 형성되고, 상기 테스트 장치의 전극 패드 혹은 상기 반도체 기기의 도전 볼과 전기적 콘택을 형성하되, 접촉면이 에지에서 센터로 갈수록 상기 전극 패드 혹은 상기 도전 볼 방향으로 볼록하게 라운드 되는 라운드 타입(round-type)의 복수 MEMS 범프를 포함한다. 이와 같은 구성에 의하면, 접촉성이 크게 개선된다. The MEMS film for a test socket according to the present invention is disposed between a semiconductor device and a test device and performs electrical inspection of the semiconductor device. The MEMS film for a test socket includes a flexible bare film, Type, round-type, which forms an electrical contact with an electrode pad of the test apparatus or a conductive ball of the semiconductor device, the contact surface of which is convexly rounded toward the electrode pad or the conductive ball toward the center from the edge, Of MEMS bumps. According to such a configuration, the contact property is greatly improved.

Measuring mechanism for bga-ic

(57)【要約】 【課題】 ＢＧＡ−ＩＣの半田ボールと、ＢＧＡ用コン タクト座との間に異物が挟まっても、どこかの部分で接 触をとることにより、接触の確実性・容易性を図ると共 に、再コンタクトチェックに要する時間を無くすことに より、測定時間の短縮化に寄与するＢＧＡ−ＩＣ用測定 機構を提供する。 【解決手段】 基板３０に、円錐状の接触面１０Ａを備 えたＢＧＡ用コンタクト座１０を埋設すると共に、ＢＧ Ａ用コンタクト座１０をテスタ側と接続し、ＢＧＡ−Ｉ Ｃ４０の半田ボール４１を、ＢＧＡ用コンタクト座１０ の前記円錐状接触面１０Ａに接触させることにより、パ ッケージテストを行う。

Test socket for Ball Grid Array package and method for testing thereof

전기적 최종검사 공정에서 BGA 패키지의 외부연결단자가 변형되거나, 불량 BGA 패키지가 양품으로 판정되는 문제를 억제할 수 있는 BGA 패키지의 전기적 검사를 위한 소켓 및 이를 이용한 검사방법에 관해 개시한다. 본 발명은 BGA 패키지의 외부연결단자인 솔더볼을 메쉬와, 중간연결부인 전도성 고무와, 소켓보오드의 채널연결수단를 통하여 테스터로 연결시킨다. 채널연결수단은 포고핀을 장착하거나, 인쇄회로패턴을 장착한 평판형의 보오드를 사용할 수 있다. Disclosed are a socket for an electrical inspection of a BGA package capable of suppressing a problem in which an external connection terminal of a BGA package is deformed or a defective BGA package is considered good in an electrical final inspection process, and an inspection method using the same. The present invention connects the solder ball, which is the external connection terminal of the BGA package, to the tester through the mesh, the conductive rubber, which is the intermediate connection, and the channel connection means of the socket board. The channel connecting means may be equipped with a pogo pin, or a board of a board type with a printed circuit pattern.

Test socket

The present invention relates to a test socket used for measuring an electrical characteristic of an electrical device. Provided is the test socket, wherein the present invention is the test socket disposed between facing terminals to electrically connect the terminals, comprising: first contact pins contacting the power or signal terminals facing each other at both ends thereof; a second contact pin whose both ends are in contact with facing ground terminals; at least one first bridge connecting the first contact pins to each other; and at least one second bridge connecting the first contact pin and the second contact pin to each other.

Socket-board fixing jig for memory package

본 발명은 자동 및 수동 겸용의 메모리 패키지 테스트용 소켓보드 고정지그에 관한 것으로, 하나의 소켓보드 고정지그에 착탈 가능하는 구조의 수동형 핸들러 푸셔를 구성하여 수동형 핸들러 푸셔의 장착과 탈거를 통해 메모리 패키지의 수동 테스트와 자동 테스트가 가능하도록 함에 그 목적이 있다. 이를 위해 구성되는 본 발명은 상부 고정지그와 하부 고정지그로 구성되어 상부 고정지그와 하부 고정지그 사이에 소켓이 실장된 소켓보드를 고정시키되 소켓에 대응하여 상부 고정지그 상에 형성된 패키지 안착홈을 통해 메모리 패키지를 안착 가압시켜 메모리 패키지의 불량률을 테스트하는 소켓보드 고정지그에 있어서, 패키지 안착홈의 일측으로부터 외측으로 일정깊이 형성되어지되 선단 양측에는 힌지홈이 일정깊이로 형성된 힌지결합부; 힌지결합부의 양측 힌지홈 선단 상부로부터 하부로 일정길이 돌출 형성되는 힌지 걸림돌기; 및 힌지결합부의 힌지홈 상에 직립된 상태의 하단이 삽입되어 전후로 회전된 상태에서 힌지 걸림돌기에 의해 걸림되는 착탈 가능한 구조로 구성되어지되 힌지결합부에 장착한 상태로는 패키지 안착홈에 안착된 메모리 패키지를 수동방식으로 가압하여 메모리 패키지의 불량률 테스트가 가능하도록 하는 한편 힌지결합부로부터 탈거한 상태로는 패키지 안착홈에 안착된 메모리 패키지를 자동으로 가압하는 자동형 핸들러 푸셔를 통해 가압하여 메모리 패키지의 불량률 테스트가 가능하도록 하는 수동형 핸들러 푸셔를 포함한 구성으로 이루어진다. The present invention relates to a socket board fixing jig for testing a memory package for both automatic and manual use, and comprises a manual handler pusher having a structure detachable to one socket board fixing jig to install and remove a manual handler pusher to The purpose is to enable manual and automated testing. The present invention is configured for this purpose is composed of the upper fixing jig and the lower fixing jig to fix the socket board mounted with the socket between the upper fixing jig and the lower fixing jig through a package seating groove formed on the upper fixing jig corresponding to the socket A socket board fixing jig for mounting and pressing a memory package to test a defective rate of a memory package, comprising: a hinge coupling part formed at a predetermined depth from one side of a package mounting groove to a predetermined depth at both ends thereof; Hinge engaging projection formed to protrude a predetermined length from the upper end of the hinge groove both sides of the hinge coupling portion; And a removable structure in which a lower end of the hinge coupling part is erected on the hinge groove of the hinge coupling part is inserted into and detached from the hinge engaging protrusion in a state of being ...

Method of mounting a spring element on a semiconductor device and testing at a wafer level

Resilient contact structures (430) are mounted directly to bond pads (410) on semiconductor dies (402a, 402b), prior to the dies (402a, 402b) being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies (402a, 402b) to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies (702, 704) with a circuit board (710) or the like having a plurality of terminals (712) disposed on a surface thereof. Subsequently, the semiconductor dies (402a, 402b) may be singulated from the semiconductor wafer, whereupon the same resilient contact structures (430) can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements (430) of the present invention as the resilient contact structures, burn-in (792) can be performed at temperatures of at least 150 DEG C, and can be completed in less than 60 minutes.

Electrical connection device for semiconductor device and contact used therefor

Burn-in board for bwrn-in test

본 발명은 표면 실장용 디바이스인 마이크로 비지에이(Micro Ball Grid Array : μBGA) 타입의 디바이스를 로딩하기에 적당한 번인 테스터용 번인보드에 관한 것으로, 폴리마이드 스트립(Polymide strip)에서 칩을 분리하지 않은 상태에서 이를 번인보드상에 직접 로딩하여 번인 테스트를 실시할 수 있도록 한 것이다. The present invention relates to a burn-in board for a burn-in tester suitable for loading a device of a micro ball grid array (μBGA) type, which is a surface mounting device, without a chip being separated from a polymide strip. Has loaded it directly onto the burn-in board so that you can run it. 이를 위해, 기판(18)의 일측에 번인 테스터의 콘택 소켓으로 결합되는 컨넥터(5)가 구비된 번인보드에 있어서, 스트립(14)이 부착되는 사각틀형태의 캐리어(16)와, 테스트할 디바이스의 볼과 일치되게 복수개의 콘택트 핀(21)이 배열된 기판(18)과, 상기 스트립이 고정된 각 캐리어가 얼라인되도록 기판상에 구비된 가이더(20)와, 상기 기판에 로딩되는 스트립상의 칩과 간섭이 발생되지 않도록 기판상에 형성된 복수개의 흡착공(25)과, 상기 흡착공이 상호 연통되도록 기판의 저면에 고정되어 번인보드를 번인 테스터에 로딩시 진공라인과 접속되는 에어라인(26)으로 구성된 것이다. To this end, in a burn-in board having a connector 5 coupled to a contact socket of a burn-in tester on one side of the substrate 18, the carrier 16 having a rectangular frame shape to which the strip 14 is attached and the device to be tested A substrate 18 in which a plurality of contact pins 21 are arranged to match a ball, a guider 20 provided on the substrate to align each carrier on which the strip is fixed, and a chip on a strip loaded on the substrate And a plurality of adsorption holes 25 formed on the substrate to prevent interference with the air lines 26 fixed to the bottom surface of the substrate so that the adsorption holes communicate with each other and connected to the vacuum line when the burn-in board is loaded on the burn-in tester. It is composed.

Contact structure for interconnections, interposer, semiconductor assembly and method

一种互联接触结构组件包括一电子元件，该电子元件有一表面和在该表面可触及的一导电接触。接触结构包括一具有第一和第二端的内柔性细长元件，第一端在所述导电接触端的表面形成第一紧密结合点而无需用另外的连接材料。一导电壳体由至少一层包封柔性细长元件的导电的材料组成，同时在紧邻第一紧密结合点的至少一部分导电接触端形成第二紧密结合点。

Contact device for inspecting semiconductor device

(57)【要約】 【課題】 検査対象である半導体装置の外部端子に損傷 を与えることなく確実な接触を得ることを可能にする半 導体装置検査用コンタクト装置を提供する。 【解決手段】 半導体装置１の外部端子２を構成する各 々のパッドに対応した位置にバンプ３を有する両面コン タクトシート４と、両面コンタクトシートと前記半導体 装置とを安定，確実に接触させるために、弾性を有する 材料中に金属細線が埋込まれた金属線埋設シート５とを 備えている。

Test socket and method of manufacturing the same

본 발명은 반도체 소자 등의 검사에 사용되는 테스트용 소켓에 관한 것으로서, 더욱 상세하게는 테스트용 소켓의 이방 전도성 시트를 지지하는 프레임의 상면과 하면에 절연 필름이 부착된 테스트용 소켓에 관한 것이다. 본 발명은 검사 대상인 소자와 검사 장치 사이에 배치되어 상기 소자의 단자와 검사 장치의 접촉 패드를 서로 전기적으로 연결하는 테스트용 소켓으로서, 판상의 절연부와, 상기 절연부의 하단 측면을 둘러싸는 프레임과, 상기 프레임의 하면 및 상기 절연부의 하면에 결합하는 제1 절연 필름과, 상기 소자의 단자 및 검사 장치의 접촉 패드에 대응하는 위치에 상기 절연부및 제1 절연 필름을 관통하여 배치되며, 상기 절연부의 두께 방향으로 전기 전도성을 갖는 복수의 접촉부와, 상기 프레임의 상면에 결합되며, 상기 절연부의 측면을 둘러싸는 제2 절연 필름을 포함하는 테스트용 소켓을 제공한다.

Socket For Testing Ball Grid Array Type Semiconductor Package

본 발명은 BGA(Ball Grid Array) 타입 반도체 패키지 검사용 소켓을 개시한다. 이에 의하면, 소켓 핀의 상측부에 BGA 타입 반도체 패키지의 솔더 볼의 하반부에 해당하는 반구 형상의 안착부가 형성되고, 상기 소켓 핀의 상측부와 하측부 사이의 중간부가 자체적으로 텐션(Tension)을 갖도록 하기 위한 형태로 절곡된다. 따라서, 상기 BGA 타입 반도체 패키지의 전기적인 검사가 실시될 때, 상기 소켓 핀의 상측부가 상기 솔더 볼의 하반부를 안정적으로 면 접촉하고, 상기 소켓 핀의 중간부가 이송장치에 의해 상기 BGA 타입 반도체 패키지에 가압되는 하중 압력을 충분히 흡수한다. 그 결과, 솔더 볼의 손상이나 스크래치와 같은 불량 현상이 방지될 수 있고, 나아가 BGA 타입 반도체 패키지의 품질 저하가 방지될 수 있다.

Method of temporarily, then permanently, connecting to a semiconductor device

탄성 접촉 구조물(430)은 다이(402a, 402b)들이 반도체 웨이퍼로부터 개별화(분리)되기 전에 하나의 반도체 다이(402a, 402b) 상에 패드(410)들을 결합하도록 직접 장착된다. 이는 복수개의 단자(712)가 배치된 표면을 갖는 회로 기판(710) 등을 갖춘 반도체 다이(702, 704)에 연결함으로써 반도체 다이(402a, 402b)들을 실행(예를 들어, 시험 및/또는 번인 등)시킬 수 있게 해준다. 따라서, 반도체 다이(402a, 402b)들은 반도체 웨이퍼로부터 개별화될 수 있어서, 동일한 탄성 접촉 구조물(430)이 반도체 다이들과 (와이어링 구조, 반도체 패키지 등)의 다른 전자 부품들 사이의 상호 접속을 수행하는 데 사용될 수 있다. 탄성 접촉 구조물로서 본 발명의 모든 금속성 복합 상호 접속 요소(430)를 사용함으로써 번인을 적어도 150 ℃의 온도로 60분 미만 내에서 완료할 수 있다. The elastic contact structure 430 is mounted directly to couple the pads 410 on one semiconductor die 402a, 402b before the dies 402a, 402b are singulated (separated) from the semiconductor wafer. This executes (eg, tests and / or burns in) semiconductor dies 402a, 402b by connecting them to semiconductor dies 702, 704 with a circuit board 710, etc., having a surface on which a plurality of terminals 712 are disposed. Etc.). Thus, the semiconductor dies 402a and 402b can be individualized from the semiconductor wafer, such that the same elastic contact structure 430 performs the interconnection between the semiconductor dies and other electronic components of the wiring structure, semiconductor package, etc. Can be used to By using all metallic composite interconnect elements 430 of the present invention as elastic contact structures, burn-in can be completed in less than 60 minutes at a temperature of at least 150 ° C.

Electrical connecting device for semiconductor device and contact used in the same

반도체 장치와 접촉하는 플런저의 접점의 위치 정밀도를 높임과 함께, 반도체 장치와의 안정된 접촉을 가능하게 하는 전기 접속 장치 및 콘택트를 제공한다. 플런저와 해당 플런저를 그 위에 지지하는 코일 스프링 유닛으로 이루어지는 콘택트로서, 플런저는, 상단부에 복수의 접점을 갖는 상방 접촉편, 폭광부, 및 각각이 하단부에 접점을 갖는 2개의 접촉편을 갖는 하방 접촉편을 포함하고 있고, 코일 스프링 유닛은, 스프링부 및 유입부와 하단부에 접점을 갖는 세권부를 포함하는 깔때기형상의 밀착권부분을 포함하고 있고, 상방 접촉편에 마련된 복수의 접점은, 평면적인 넓어짐을 갖도록 간격을 두어 배치되고, 하방 접촉편의 2개의 접촉편에 마련된 접점은, 서로에 대해 탄성 변형 가능하게 형성되어 있다. Provided are an electrical connection device and a contact which increase the positional accuracy of the contact point of the plunger in contact with the semiconductor device and enable stable contact with the semiconductor device. A contact made up of a plunger and a coil spring unit supporting the plunger thereon, the plunger being a lower contact having an upper contact piece having a plurality of contacts at its upper end, a light emitting part, and two contact pieces each having a contact at the lower end thereof. The coil spring unit includes a piece and a funnel-shaped close-up winding portion including a spring portion and a three winding portion having a contact portion at the lower end portion, and the plurality of contacts provided on the upper contact piece are flattened. The contacts are arranged at intervals so as to have a shape, and the contacts provided on the two contact pieces of the lower contact piece are formed to be elastically deformable with respect to each other. 반도체 장치용 전기 접속 장치, 콘택트 Electrical connectors and contacts for semiconductor devices

Electrical probe with rotatable plunger

본 공개 내용은, 전기 프로브를 위해 제공되며, 전기 프로브는 종 방향 축을 따라 연장되고 제1 단부에서 개구부를 가진 내부 공동을 형성하는 쉘을 포함하고, 상기 쉘은 내부 캠 표면을 형성하기 위해 상기 종 방향 축 주위에서 비틀림 구조를 가진 중공 다각형 샤프트에 의해 형성된 넥 부분을 포함한다. 상기 전기 프로브는 또한, 상기 내부 공동내에 미끄럼 운동가능하게 수용된 플런저를 포함한다. 상기 플런저는 상기 제1 단부에서 개구부를 통해 적어도 부분적으로 연장되도록 구성된 팁을 포함하고, 상기 팁과 일체구조로 형성된 캠 요소를 포함하며, 상기 캠 요소는 종 방향 축과 실질적으로 수직인 평면에서 정해진 형상을 가지고, 상기 정해진 형상의 외측 주변부는 상기 중공 다각형 샤프트의 횡단면 부분이 가지는 내측 주변부와 실질적으로 동일하거나 작다. 일부 예시적인 실시예들에서, 상기 플런저가 상기 쉘의 종 방향 축을 따라 왕복운동할 때 캠 요소는 넥 부분의 내부 캠 표면과 연결되어 상기 팁의 회전운동을 형성한다.

Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures

Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics.

BGA Socket device for testing an BGA IC

The present invention relates to a dual pinch-type BGA socket device used for testing semiconductor devices. The BGA socket device comprises: a contact (100) including a pair of fixed side terminals (110) and a movable side terminal (120) facing each other, wherein the respective upper end portions (111, 112) of the fixed side terminals (110) and the movable side terminal (120) are provided to be offset (d) at a predetermined interval with respect to a ball terminal (2); a main body part (210) having the contact (100) vertically disposed thereon and fixed thereto; a cover (230) elastically supported at an upper portion of the main body part (210) to be movable up and down within a range of a predetermined height with respect to the main body part (210); and a slider (240) provided between the main body part (210) and the cover (230), interlocked with a vertical position of the cover (230) to perform horizontal sliding such that the movable side terminal (120) is opened and closed horizontally, and having a fixed side terminal accommodation hole (245) through which the fixed side terminal (110) is positioned and a movable side terminal accommodation hole (246) through which the movable side terminal (120) is positioned, wherein the fixed side terminal accommodation hole (245) and the movable side terminal accommodation hole (246) are offset (d) by an offset (d) between the upper end portions (111, 112) of the contact, and the fixed side terminal accommodation hole is longer than the movable side terminal accommodation hole.

Data signal transmission connector

An objective of the present invention is to provide a signal transmission connector which prevents deformation of a conduction unit and an insulation unit to extend the life of a product and improve signal transfer performance. According to the present invention, the signal transmission connector is connected to an electronic part to transport an electric signal, and comprises: a plurality of conduction units having a plurality of conductive particles aligned in an elastic insulation material in a thickness direction to be connected to a terminal of the electronic part; an insulation unit which is made of an elastic insulation material and surrounds the plurality of conduction units to support the plurality of conduction units to separate the plurality of conduction units from each other; and a guide film coupled to one surface of the insulation unit and provided with film holes at positions corresponding to the plurality of conduction units. The film holes include a plurality of taper holes formed in a shape whose width becomes gradually smaller towards the insulation unit and vertically separated from each other to be arranged in multiple levels. The conduction units include a conduction unit body arranged in the insulation unit, and a conduction unit bump connected to the conduction unit body to be arranged on the film holes to fill one or more taper holes of the film holes.

Housing of test socket

The present invention provides a test socket housing to which a plurality of contact pins including a pad connection pin, a ball connection pin and a coil spring installed between the pad connection pin and the ball connection pin are fastened. The test socket housing includes: a top plate in which a first through hole corresponding to the cross-sectional shape of the ball connection pin is formed; a middle plate in which a second through-hole corresponding to the cross-sectional shape of the coil spring is formed; and a bottom plate in which a third through-hole corresponding to the cross-sectional shape of the pad connection pin is formed. The bottom plate, the middle plate and the top plate are laminated. Test reliability can be improved by removing contact defects.

Test socket and conductive particle

본 발명은 검사용 소켓 및 도전성 입자에 대한 것으로서, 더욱 상세하게는 피검사 디바이스와 검사장치 사이에 배치되어 상기 피검사 디바이스의 단자와 검사장치의 패드를 서로 전기적으로 연결시키기 위한 검사용 소켓에 있어서, 상기 피검사 디바이스의 단자와 대응되는 위치마다 마련되고 탄성 절연물질 내에 다수의 도전성 입자가 상하방향으로 배열되어 있는 복수의 도전부; 및 상기 복수의 도전부 사이에 마련되고 각각의 도전부를 지지하면서 도전부를 서로 전기적으로 절연시키는 절연성 지지부;를 포함하되, 상기 도전성 입자 중 적어도 하나는, 금속소재로 이루어지며 도전성 입자의 외형을 구성하는 몸체부와, 일부는 상기 몸체부 내에 고정되고 나머지 일부는 상기 몸체부로부터 돌출되며, 도전부를 구성하는 탄성 절연물질과 접촉되어 상기 탄성 절연물질과 견고하게 결합되는 다수의 실리카 미립자를 포함하는 검사용 소켓에 대한 것이다. The present invention relates to a socket for inspection and conductive particles, and more particularly, to a socket for inspecting a socket for electrically connecting a terminal of an apparatus to be inspected and a pad of an inspection apparatus, A plurality of conductive portions provided at positions corresponding to the terminals of the device to be inspected and having a plurality of conductive particles arranged in the vertical direction in the elastic insulating material; And an insulative support portion provided between the plurality of conductive portions and electrically insulating the conductive portions from each other while supporting the conductive portions, wherein at least one of the conductive particles is made of a metal material and forms the outer shape of the conductive particles And a plurality of silica fine particles which are fixed within the body part and a part of which protrudes from the body part and is in contact with the elastic insulating material constituting the conductive part and firmly bonded to the elastic insulating material. It is about sockets.

Test socket lattice

전기 리드선(lead)선을 갖는 집적 회로 패키지의 번-인 테스트(burn-in test)를 위한 소켓이 제공된다. 이 소켓은 내부의 일반적으로 직사각형인 단자-수용 공동부로 이루어진 열과 행의 배열을 가지는데, 일반적으로 직사각형인 단자-수용 공동부 각각은 더 긴 치수에 해당되는 길이 방향, 및 집적 회로 패키지의 리드선과 접촉하기 위한 단자-수용 공동부에 배치된 다수의 단자를 구비한다. 이 배열의 각 열과 행은 첫 번째와 마지막 공동부를 제외한 순서(sequence)의 각 공동부에 대해서 세 개 이상의 인접한 공동부의 순서를 포함하되, 공동부의 길이 방향은 실질적으로 인접한 양 측면상의 공동부 순서 속의 두 개의 공동부의 길이 방향에 수직이다 A socket is provided for a burn-in test of an integrated circuit package with electrical lead wires. The socket has an array of columns and rows of generally rectangular terminal-receiving cavities therein, each of which is generally rectangular in length, corresponding to a longer dimension, and a lead wire of an integrated circuit package. And a plurality of terminals arranged in the terminal-receiving cavity for contacting. Each column and row of this array includes a sequence of three or more adjacent cavities for each cavities in the sequence except for the first and last cavities, the longitudinal direction of the cavities being substantially within the order of the cavities on both adjacent sides. Perpendicular to the longitudinal direction of the two cavities

Spiral contact pin for test socket

본 발명의 반도체 테스트 소켓용 핀은, 반도체 기기와 테스트 장치 사이에서 도전 볼과 콘택 패드를 전기적으로 연결하는 반도체 테스트 소켓용 핀에 있어서, 상기 도전 볼과 콘택되는 제1접속 팁, 콘택 바디, 및 상기 콘택 패드와 콘택되는 3차원 스파일러 타입 제2접속 팁을 포함한다. 이와 같은 본 발명의 구성에 의하면, 스트로크가 개선된다. The pin for a semiconductor test socket of the present invention is a pin for a semiconductor test socket that electrically connects a conductive ball and a contact pad between a semiconductor device and a test apparatus, the first connection tip contacting the conductive ball, the contact body, and And a three-dimensional spoiler type second connection tip contacting the contact pad. According to such a configuration of the present invention, the stroke is improved.

Mounting spring elements on semiconductor devices

탄성 접촉 구조물(430)은 다이(402a, 402b)들이 반도체 웨이퍼로부터 개별화(분리)되기 전에 하나의 반도체 다이(402a, 402b) 상에 패드(410)들을 결합하도록 직접 장착된다. 이는 복수개의 단자(712)가 배치된 표면을 갖는 회로 기판(710) 등을 갖춘 반도체 다이(702, 704)에 연결함으로써 반도체 다이(402a, 402b)들을 실행(예를 들어, 시험 및/또는 번인 등)시킬 수 있게 해준다. 따라서, 반도체 다이(402a, 402b)들은 반도체 웨이퍼로부터 개별화될 수 있어서, 동일한 탄성 접촉 구조물(430)이 반도체 다이들과 (와이어링 구조, 반도체 패키지 등)의 다른 전자 부품들 사이의 상호 접속을 수행하는 데 사용될 수 있다. 탄성 접촉 구조물로서 본 발명의 모든 금속성 복합 상호 접속 요소(430)를 사용함으로써 번인을 적어도 150 ℃의 온도로 60분 미만 내에서 완료할 수 있다. The elastic contact structure 430 is mounted directly to couple the pads 410 on one semiconductor die 402a, 402b before the dies 402a, 402b are singulated (separated) from the semiconductor wafer. This executes (eg, tests and / or burns in) semiconductor dies 402a, 402b by connecting them to semiconductor dies 702, 704 with a circuit board 710, etc., having a surface on which a plurality of terminals 712 are disposed. Etc.). Thus, the semiconductor dies 402a and 402b can be individualized from the semiconductor wafer, such that the same elastic contact structure 430 performs the interconnection between the semiconductor dies and other electronic components of the wiring structure, semiconductor package, etc. Can be used to By using all metallic composite interconnect elements 430 of the present invention as elastic contact structures, burn-in can be completed in less than 60 minutes at a temperature of at least 150 ° C.

Socket tester for fine pitch ball grid arrayFPBGA

본 발명은 파인 피치 볼 그리드 어레이용 소켓 테스터에 관한 것으로, 개개의 소켓에 대한 소켓 핀의 높이의 양불량 뿐만 아니라 테스트 보드에 실장된 소켓 전체에 대한 소켓 핀의 높이의 양불량을 짧은 시간에 테스트할 수 있는 파인 피치 볼 그리드 어레이(Fine Pitch Ball Grid Array; FPBGA)용 소켓 테스터를 제공한다. 즉, 파인 피치 볼 그리드 어레이용 소켓 테스터로서, 상기 소켓의 상부면을 통하여 삽입될 상기 파인 피치 볼 그리드 어레이 패키지에 대응되는 크기를 가지며, 하부면이 평평하며 전기전도성을 갖는 테스트 팁과; 상기 소켓의 하부면으로 노출된 소켓 핀과 접속되는 접속 단자; 및 상기 테스트 팁과 접속 단자를 서로 연결되며, 상기 테스트 팁과 소켓 핀 사이의 전기적 접속 여부를 판별하는 판별부;를 포함하며, 상기 테스트 팁과 소켓 핀의 접촉에 따른 전기적 접속여부로 상기 소켓 핀의 높이의 양불량을 테스트하는 것을 특징으로 하는 파인 피치 볼 그리드 어레이용 소켓 테스터를 제공한다. 파인 피치 볼 그리드 어레이, 소켓 테스터, 소켓 핀, 볼 그리드 어레이, 비지에이(BGA)

Carrier for electronic component test device

피시험 전자 부품의 품종 교환 또는 소켓의 소모에, 보다 작은 단위의 부품 교환에 대응할 수있는 동시에, 피시험 전자 부품의 외부 접촉 단자와 소켓 단자의 위치 결정의 고정밀도화에 대응 있는 전자 부품 시험 장치용 캐리어를 제공한다. 복수 외부 접촉 단자(HB)에 대응해서 설치된 소켓 보드(50)를 통해 테스터(6)에 접속되는 복수 단자(753)를 구비하고, IC 디바이스가 적재되는 IC 소켓(750)과, IC 디바이스를 포위하도록 환형으로 형성되어, IC 소켓(750)이 밑면부에 설치된 코어 본체(740)와, 테스트 트레이(TST)의 프레임(700)에 설치되고, 코어 본체(740)가 착탈 가능하게 설치된 바디(720)를 구비하고, 코어 본체(740)에는 소켓 보드(50)에서 돌출하는 위치 결정핀(55)과 결합하는 위치 결정공(7451,7461)이 형성되고, 코어 본체(740)는 바디(720)에 대하여 상대적으로 평면 내에서 이동 가능하게 설치되어 있다. For electronic component testing equipment that can respond to replacement of electronic components by type or socket consumption, replacement of smaller units, and high-precision positioning of external contact terminals and socket terminals of electronic components under test provide a carrier. An IC socket 750 having a plurality of terminals 753 connected to the tester 6 through a socket board 50 provided in correspondence with the plurality of external contact terminals HB, the IC socket 750 on which the IC device is loaded, and the IC device are surrounded The core body 740 is formed in an annular shape so that the IC socket 750 is installed on the bottom part, and the body 720 is installed on the frame 700 of the test tray (TST), and the core body 740 is detachably installed. ), and the core body 740 has positioning holes 7451 and 7461 that engage with the positioning pins 55 protruding from the socket board 50 are formed, and the core body 740 is the body 720 . It is installed to be movable in a plane relative to the

By-directional electrically conductive module

The present invention relates to a bidirectional conductive module capable of connecting upper and lower devices elastically. The bidirectional conductive module includes: an insulating body made of an insulating material and including a plurality of through holes penetrated in a vertical direction; a plurality of conductive pattern parts formed in each of the through holes to form a signal line in a vertical direction to connect the upper and lower devices electrically; an elastic spring having conductivity and formed in the insulating body to be physically separated from the conductive pattern parts while surrounding each of the through holes to provide restoring force in a vertical direction; and a ground terminal part combined with the lower part of the insulating body to enable the conductive pattern parts to be exposed through the bottom and earthing the elastic spring by coming into contact with the elastic spring exposed through the bottom of the insulating body. Therefore, a pogo-pin type semiconductor test socket can be replaced, a high-speed test as well as stable signal delivery can be possible, and the module can be applied to an interposer between a high-speed CPU and a board to electrically connect the CPU and the board.

Electrical Contact Method And Apparatus In Semiconductor Device Inspection Equipment

본 발명은 반도체 디바이스 검사장치에서 접촉자를 반도체 디바이스의 돌기전극에 전기적으로 접촉시키는 방법 및 장치에 관한 것이다. 본 발명의 반도체 디바이스 검사장치에 사용되는 전기적 접촉기술은 검사해야 할 반도체 디바이스를 향해 돌출한 사각뿔형의 하나 이상의 접촉자가 사용된다. 상기 접촉자는 그 경사선 또는 경사면을 통해 반도체 디바이스의 돌기전극에 접촉한다. 따라서 접촉자의 경사선 또는 경사면이 돌기전극의 측부 만을 누르게 되어 돌기전극이 그 정점부에서 손상되는 것을 방지한다.

MICRO-BGA Block for Handler

본 발명은 제조된 디바이스의 성능을 테스트하기 위하여 핸들러에서 각각의 디바이스들을 공급할 때 연속적인 작업을 수행하기 위해 디바이스를 이동시키기 위한 얼라이너 블록에 형성된 마이크로 비지에이(μ-BGA) 블록에 관한 것으로, 보다 상세하게는 마이크로 비지에이(μ-BGA)의 성능을 테스트하기 위해서 이동시킬 때 얼라이너 블록에 형성된 마이크로 비지에이(μ-BGA) 블록에 디바이스를 정확하게 안착시킴으로써 디바이스를 이동시키기 위한 테스트 트레이에 정확하게 셋팅시킬 수 있는 핸들러의 마이크로 비지에이(μ-BGA) 블록에 관한 것이다. The present invention relates to a micro-BGA block formed in an aligner block for moving a device to perform a continuous task when supplying each device in a handler to test the performance of the manufactured device, More specifically, when moving to test the performance of micro-BGA, the device can be precisely seated in the micro-BGA block formed in the aligner block to accurately place it in the test tray for moving the device. It relates to a micro-visual (μ-BGA) block of handlers that can be set. 본 발명은 마이크로 비지에이(μ-BGA) 블록 바디와; 상기 마이크로 비지에이(μ-BGA) 블록 바디에 마이크로 비지에이(μ-BGA)의 소자가 정확하게 안착되도록 저면에 버큠공을 구비하는 칩안착부와; 상기 마이크로 비지에이(μ-BGA)소자의 바깥 테두리면이 접촉되도록 경사부가 형성된 다수의 가이드로 구성된다. The present invention relates to a micro-BGA block body; A chip seat having a bore hole on a bottom surface of the micro bGA block body to accurately seat the micro BGA element; It consists of a plurality of guides in which the inclined portion is formed such that the outer edge surface of the micro-BGA device is in contact.

Probe card assembly and kit, and method using the same

Resilient contact structures extend from a top surface of a support substrate and solder-ball (or other suitable) contact structures are disposed on a bottom surface of the support substrate. Interconnection elements (110) are used as the resilient contact structures and are disposed atop the support substrate. Selected ones of the resilient contact structures atop the support substrate are connected, via the support substrate, to corresponding ones of the contact structures on the bottom surface of the support substrate. In an embodiment intended to receive an LGA-type semiconductor package (304), pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally normal to the top surface of the support substrate (302). In an embodiment intended to receive a BGA-type semiconductor package (404), pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally parallel to the top surface of the support substrate (402).

Apparatus for testing semi-conductor device of test handler

BGA 및 CSP형 반도체 디바이스를 픽커를 이용하여 테스트 소켓에 직접 접속시켜 테스트할 수 있는 테스트 핸들러의 디바이스 테스트장치를 개시한다. 개시된 본 고안은, 테스트 하고자 하는 복수의 반도체 디바이스가 적재되는 보트, 이 보트에 있는 일정수량의 디바이스를 픽킹하여 테스트 헤드의 해당하는 테스트 소켓에 접속시키는 컨택트 픽커 조립체, 컨택트 픽커 조립체를 상하 이동시키기 위한 승강수단 및 컨택트 픽커 조립체가 보트에 있는 디바이스를 픽킹하여 테스트 소켓에 접속시킬 수 있도록 하기 위하여 보트를 이동시키는 수단을 포함한다. 보트는, 복수의 반도체 디바이스를 적재하여 테스트 헤드 상부의 테스트위치로 이동시킨다. 이 보트에는 복수의 디바이스 수납홈과 이 수납홈의 사이에 위치하는 복수의 관통공이 형성된다. 이 보트의 관통공을 통하여 컨택트 픽커 조립체가 테스트 소켓까지 하강하면서 디바이스를 테스트 소켓에 접속시켜 테스트가 이루어지도록 한다. 한편, 보트는 보트이동수단에 의해 초기위치에서 일정거리만큼 이동된 위치, 즉 컨택트 픽커 조립체가 보트의 관통공을 경유하여 하강할 수 있는 위치로 피치단위로 이동된다. Disclosed is a device test apparatus for a test handler that can test BGA and CSP type semiconductor devices by directly connecting them to a test socket using a picker. Disclosed is a boat in which a plurality of semiconductor devices to be tested are loaded, a contact picker assembly which picks a certain number of devices in the boat and connects it to a corresponding test socket of a test head, and for moving the contact picker assembly up and down. And means for moving the boat so that the lifting means and the contact picker assembly can pick up devices in the boat and connect them to the test sockets. The boat loads a plurality of semiconductor devices and moves them to a test position above the test head. The boat is formed with a plurality of device accommodation grooves and a plurality of through holes positioned between the storage grooves. Through the through-holes of the boat, the contact picker assembly descends to the test socket, connecting the device to the test socket for testing. On the other hand, the boat is moved in pitch units to a position moved by a certain distance from the initial position by the boat moving means, that is, the position where the contact picker assembly can descend via the through hole of the boat.

Method and apparatus for testing a semiconductor die

Universal insert tool for fixing a bga package under test

본 발명의 범용 인서트는, 콤포넌트 캐버티, 마운팅 표면 및 콤포넌트 캐버티 내에 복수의 정렬 볼홀 구비하며, 상기 정렬 볼홀은 동일한 피치를 가지는 어레이 내에 배열되는 메쉬드 베이스, BGA 패키지를 누르고 잡아주기 위한 상기 메쉬드 베이스 내에 배치된 적어도 하나의 래치, 그리고 상기 메시드 베이스의 마운팅 표면의 주변으로부터 유연성 있게 확장하는 복수의 리프트 핀으로 구성되며, 프로브 테스트 시에, 상기 콤포넌트 캐버티는 내부 BGA 패키지를 수용하며, 솔더볼이 마운팅 표면상에 대응하는 정렬 볼홀로부터 노출되도록, 상기 정렬 볼홀의 적어도 일부가 BGA 패키지의 복수의 솔더볼에 일-대-일로 정렬되는, BGA 패키지를 수용하기 위한 범용 인서트이다. The universal insert of the present invention comprises a plurality of alignment ballholes in component cavities, mounting surfaces and component cavities, wherein the alignment ballholes are meshed bases, BGA packages for holding and grasping meshed bases arranged in an array having the same pitch. At least one latch disposed within the drawing base, and a plurality of lift pins that flexibly extend from the periphery of the mounting surface of the meshed base, and during probe testing, the component cavity houses an internal BGA package and solder balls At least a portion of the alignment ballhole is a general purpose insert for receiving a BGA package, one-to-one aligned with a plurality of solder balls of the BGA package such that it is exposed from a corresponding alignment ballhole on this mounting surface. 범용 인서트, 콤포넌트 캐버티, 마운팅 표면, 정렬 볼홀, 메쉬드 베이스, BGA 패키지, 래치, 리프트 핀, 솔더볼. Universal inserts, component cavities, mounting surfaces, alignment ballholes, meshed bases, BGA packages, latches, lift pins, solder balls.

Testing ic socket

그리드 어레이 패키지의 테스트를 위한 IC 소케트는 테스트 보드상에 실장된 어댑터 소케트에 맞도록 형성된다. IC 소케트는, 하부 플레이트를 관통하고 매트릭스 형태로 배치된 다수의 접촉자 고정홀로 형성된 하부 플레이트를 구비한 IC 소케트 본체와, 그리고 각각이 접촉자 종단, 스프링부, 고정 베이스부, 그리고 접촉자 핀을 상기 순서로 구비한 다수의 접촉자로서, 상기 접촉자 각각의 고정 베이스부가 하부 플레이트의 위쪽으로부터 상기 IC 소케트 본체의 대응하는 접촉자 고정홀로 삽입되는 다수의 접촉자를 포함한다. 상기 IC 소케트는, 대응하는 수의 고정 애퍼처를 갖고 상기 고정 애퍼처를 통해 상기 접촉자를 통과시켜 IC 소케트의 하부 플레이트의 윗면에 각각 고정된 고정 플레이트도 포함하여, 상기 접촉자의 고정 베이스부는 IC 소케트 본체의 하부 플레이트와 고정 플레이트의 고정 애퍼처의 에지부(edge portion) 사이에 고정된다.

Test socket

The present invention provides a test socket, which improves a load and a deformation amount through the structural modification of a socket. The test socket comprises: a conductive part which is disposed between an inspected device and an inspecting device to electrically connect the inspecting device with the inspected device, and in which a plurality of conductive particles is arranged in a thickness direction in elastic material; an insulation supporting part which supports the conductive part and insulates from the adjacent conductive part; and a load reducing part which avoids direct contact with the inspected device at a corresponding position where the inspected device is not disposed to reduce a load applied to the inspected device.

Test socket

The present invention relates to a semiconductor chip test socket. More specifically, provided is the semiconductor chip test socket having a MOS type contact which allows the existing operating equipment to be applied as it is by increasing a contact force to improve electrical characteristics while maintaining the actuator force required for operation. The semiconductor chip test socket includes: a base; an actuator member; and at least one contact portion.

Test kit for semiconductor package and test method thereof

소켓에서 반도체 패키지 형태에 따라 다양한 형태의 어댑터를 사용해야 하는 문제점을 해결할 수 있는 반도체 패키지 검사 장치에 관해 개시한다. 본 발명은 반도체 패키지를 소켓에 로딩/언로딩할 때에 사용하는 해드 어셈블리에 패키지 가이더와 소켓 가이더 기능을 추가하여 소켓 내부에서 사용하는 어댑터를 제거하거나 혹은 프리 사이즈 어댑터 형으로 개조하여 반도체 패키지 형태가 변화될 때마다 반드시 수행해야 하는 어댑터 금형 교체 비용, 인터페이스 보오드의 소켓 교체 시간 등을 절약하여 반도체 패키지 검사 공정에서 효율성을 증대시킬 수 있다. Disclosed is a semiconductor package inspection apparatus capable of solving a problem of using various types of adapters according to semiconductor package types in a socket. The present invention changes the shape of a semiconductor package by adding a package guider and a socket guider function to a head assembly used when loading / unloading a semiconductor package into a socket to remove an adapter used inside the socket or to convert it into a free size adapter type. The cost of adapter mold replacement and socket board replacement of interface boards can be increased every time to increase efficiency in the semiconductor package inspection process.

Device for test socket having Metal-CNT composites and/or Polymer-CNT composites

The present invention provides a test socket, which is the test socket connecting a semiconductor device and a test device to perform electrical inspection. The test socket includes a silicon body located between the semiconductor device and the test device, and a conductive powder magnetically arranged to electrically connect the semiconductor device and the test device. The conductive powder is provided as a metal-CNT composite in which carbon nanotubes (CNT) are partially inserted. According to the configuration of the present invention, the abrasion resistance and low resistance of the conductive particles are increased to improve inspection reliability.

Testing holders for chip unit and die package

A testing holder for a chip unit, a multi site holding frame for plural chip units and a method for testing a die thereof are provided. The proposed multi site holding frame for testing plural chip units simultaneously includes a first holder frame having a plurality of testing holders. Each of the plurality of testing holders includes a holder body containing a specific one of the plural chip units, and a pressure releasing device formed on the holder body to release an insertion pressure when the specific one of the plural chip units is inserted in the holder body.