СИСТЕМА ПЕРЕДАЧИ СИГНАЛА, УСТРОЙСТВО РАЗЪЕМА, ЭЛЕКТРОННОЕ УСТРОЙСТВО И СПОСОБ ПЕРЕДАЧИ СИГНАЛА

FIELD: physics. SUBSTANCE: invention relates to a signal transmission system. Signal transmission system comprises: a first connector device; second connector device, which is connected to first connector device. First connector device and second connector device are connected together, forming electromagnetic field connecting module, and the signal object-transmission is converted into a radio signal, which is then transmitted through the electromagnetic field connecting module between the first connector device and the second connector device. EFFECT: technical result of the invention consists in increase of speed of transfer and carrying capacity due to provision of new structure for realization of interfaces of connection of signals, such as video signal and computer image. 20 cl, 29 dwg РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2 715 030 C2 (51) МПК H04L 12/02 (2006.01) H04B 5/02 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ИЗОБРЕТЕНИЯ К ПАТЕНТУ (52) СПК H04B 3/56 (2019.08); H04L 12/00 (2019.08); H05K 1/0239 (2019.08) (21)(22) Заявка: 2016120973, 11.05.2011 (24) Дата начала отсчета срока действия патента: Дата регистрации: 21.02.2020 18.05.2010 JP 2010-114123 Номер и дата приоритета первоначальной заявки, из которой данная заявка выделена: 2012147774 18.05.2010 (43) Дата публикации заявки: 14.11.2018 Бюл. № 32 (56) Список документов, цитированных в отчете о поиске: US 2006/159158 A1, 20.07.2006. WO 2009/048063 A1, 16.04.2009. RU 2293443 C2, 20.07.2005. RU 2341903 C2, 20.12.2008. RU 2236759 C1, 20.09.2004. (54) СИСТЕМА ПЕРЕДАЧИ СИГНАЛА, УСТРОЙСТВО РАЗЪЕМА, ЭЛЕКТРОННОЕ УСТРОЙСТВО И СПОСОБ ПЕРЕДАЧИ СИГНАЛА (57) Реферат: Изобретение относится к системе передачи первым устройством разъема. Первое устройство сигнала. Технический результат изобретения разъема и второе устройство разъема соединены заключается в повышении скорости передачи и вместе, формируя соединительный модуль пропускной способности за счет обеспечения электромагнитного ...

Patent RU2016120973A3

ВУ“? 2016120973`” АЗ Дата публикации: 12.09.2019 Форма № 18 ИЗИМ-2011 Федеральная служба по интеллектуальной собственности Федеральное государственное бюджетное учреждение ж 5 «Федеральный институт промышленной собственности» (ФИПС) ОТЧЕТ О ПОИСКЕ 1. . ИДЕНТИФИКАЦИЯ ЗАЯВКИ Регистрационный номер Дата подачи 2016120973/08(032971) 11.05.2011 Приоритет установлен по дате: [ ] подачи заявки [ ] поступления дополнительных материалов от к ранее поданной заявке № [Х] приоритета 11.05.2011 по первоначальной заявке № 2012147774 из которой данная заявка выделена [ ] подачи первоначальной заявки № из которой данная заявка выделена [ ] подачи ранее поданной заявки № [Х] подачи первой(ых) заявки(ок) в государстве-участнике Парижской конвенции (31) Номер первой(ых) заявки(ок) (32) Дата подачи первой(ых) заявки(ок) (33) Код страны 1. 2010-114123 18.05.2010 ]Р Название изобретения (полезной модели): [Х] - как заявлено; [ ] - уточненное (см. Примечания) СИСТЕМА ПЕРЕДАЧИ СИГНАЛА, УСТРОИСТВО РАЗЪЕМА, ЭЛЕКТРОННОЕ УСТРОИСТВО И СПОСОБ ПЕРЕДАЧИ СИГНАЛА Заявитель: СОНИ СЕМИКОНДАКТОР СОЛЮШНЗ КОРПОРЕЙШН, ]Р 2. ЕДИНСТВО ИЗОБРЕТЕНИЯ [Х] соблюдено [ ] не соблюдено. Пояснения: см. Примечания 3. ФОРМУЛА ИЗОБРЕТЕНИЯ: [Х] приняты во внимание все пункты (см. Примечания) [ ] приняты во внимание следующие пункты: [ ] принята во внимание измененная формула изобретения (см. Примечания) 4. КЛАССИФИКАЦИЯ ОБЪЕКТА ИЗОБРЕТЕНИЯ (ПОЛЕЗНОЙ МОДЕЛИ) (Указываются индексы МПК и индикатор текущей версии) НО4Г, 12/02 (2006.01) НОВ 5/02 (2006.01) 5. ОБЛАСТЬ ПОИСКА 5.1 Проверенный минимум документации РСТ (указывается индексами МПК) НОАК 3/00, НО4Т, 12/00 - НО4Г, 12/70, НОТО 1/00 - НОТО 1/46, НО4О 7/00 - НО4О 7/32, НО4В 1/00 - НО4В 1/69, НО4В 5/00 - НО4В 5/02, СО2В 6/00 - С02В 6/42 5.2 Другая проверенная документация в той мере, в какой она включена в поисковые подборки: 5.3 Электронные базы данных, использованные при поиске (название базы, и если, возможно, поисковые термины): СТРО, СМГРА, О\/РТ, ЕАРАТГУ, Езрасепеф, ...

ЗАЩИЩЕННЫЕ ПЛОЩАДКИ ПЕЧАТНЫХ ПЛАТ

... 1. Устройство, содержащее:печатную плату (ПП);область присоединения компонентов, включающую в себя первый проводник, по меньшей мере, по существу, покрывающий верхнюю поверхность области присоединения компонентов, и второй проводник, по меньшей мере, по существу, покрывающий нижнюю поверхность области присоединения компонентов;отверстие, по меньшей мере, по существу, окружающее область присоединения компонентов;компоненты низкой утечки, соединяющие область присоединения компонентов с ПП через указанное отверстие;защитный элемент, состоящий из третьего проводника, по меньшей мере, по существу, окружающего указанное отверстие на верхней поверхности ПП, и четвертого проводника, по меньшей мере, по существу, окружающего указанное отверстие на нижней поверхности ПП;первое переходное отверстие, соединяющее первый проводник и второй проводник области присоединения компонентов; ивторое переходное отверстие, соединяющее третий проводник и четвертый проводник ПП.2. Устройство по п. 1, дополнительно ...

СИСТЕМА ПЕРЕДАЧИ СИГНАЛА, УСТРОЙСТВО РАЗЪЕМА, ЭЛЕКТРОННОЕ УСТРОЙСТВО И СПОСОБ ПЕРЕДАЧИ СИГНАЛА

СИСТЕМА ПЕРЕДАЧИ СИГНАЛА, УСТРОЙСТВО РАЗЪЕМА, ЭЛЕКТРОННОЕ УСТРОЙСТВО И СПОСОБ ПЕРЕДАЧИ СИГНАЛА

... 1. Система передачи сигнала, содержащая:первое устройство разъема; ивторое устройство разъема, которое соединено с первым устройством разъема,в котором первое устройство разъема и второе устройство разъема соединены вместе, формируя соединительный модуль электромагнитного поля, исигнал-объект передачи преобразуют в радиосигнал, который затем передают через соединительный модуль электромагнитного поля между первым устройством разъема и вторым устройством разъема.2. Система передачи сигнала по п.1, дополнительно содержащая:первый модуль преобразования сигнала, который выполняет обработку модуляции на основе сигнала-объекта передачи и преобразует этот сигнал в высокочастотный сигнал; ивторой модуль преобразования сигнала, который выполняет обработку демодуляции на основе принятого радиосигнала и преобразует этот сигнал в сигнал в основной полосе пропускания,в которой первое устройство разъема имеет первый модуль соединения по радиоканалу, который электрически соединен с первым модулем преобразования ...

ELEKTRISCHE SCHALTVORRICHTUNG

LED mounting circuit board for use in belt-like flexible LED light of LED illuminating device, has mounting portion provided on central part along transverse direction of flexible board, where portion and boards are formed to be bendable

The board (10) has an LED mounting portion (1) comprising LEDs that are mounted in an array. The LED mounting portion is provided on a central part along transverse direction of a long belt-like flexible board. Two sides along the transverse direction of the LED mounting portion are provided with two boards (2, 3) in which two feed patterns (P2, P3) cause current to flow to the LEDs. The LED mounting portion and the boards are formed to be bendable. Coupling pieces (4, 5) bend the boards with respect to the LED mounting portion. An independent claim is also included for an LED illuminating device.

Halterungsaufbau für einen Schwinger

Leitklebeverbindung zwischen zwei Kontaktpartnern und Verfahren zur Herstellung einer Leitklebeverbindung

Die Erfindung betrifft eine Leitklebeverbindung zwischen zwei Kontaktpartnern (1), welche jeweils einen elektrisch nicht leitenden Träger (20) und einen elektrisch leitenden Kontaktbereich (40) aufweisen, wobei auf jedem Kontaktpartner (1) eine vorgegebene Klebeflächengeometrie (10) ausgebildet ist, welche in Verbindung mit einem aufgebrachten Leitkleber (16) eine elektrisch leitfähige Verbindung zwischen den elektrisch leitenden Kontaktbereichen (40) der Kontaktpartner (1) herstellt, sowie ein Verfahren zur Herstellung einer Leitklebeverbindung zwischen zwei Kontaktpartnern (1). Erfindungsgemäß umfasst die Klebeflächengeometrie (10) mindestens eines Kontaktpartners (1) mindestens einen elektrisch nicht leitenden Bereich (12) des Trägers (20) und mindestens einen elektrisch leitenden Bereich (14) des Kontaktbereichs (40).

Abwinkelbare und/oder abgewinkelte Leiterplattenstruktur mit zumindest zwei Leiterplattenabschnitten und Verfahren zu deren Herstellung

Die Erfindung betrifft eine abwinkelbare und/oder abgewinkelte Leiterplattenstruktur mit wenigstens zwei winkelig zueinander anordenbaren bzw. angeordneten Leiterplattenabschnitten, wobei die Leiterplattenstruktur wenigstens ein zumindest überwiegend in der Leiterplattenstruktur eingebettetes Leitungselement enthält, das sich zwischen zwei Anschlussstellen erstreckt und mit diesen Anschlussstellen elektrisch leitend verbunden ist, wobei sich die beiden Anschlussstellen auf verschiedenen Leiterplattenabschnitten befinden, wobei die Leiterplattenabschnitte unter Beibehaltung der Verbindungen zwischen den Anschlussstellen und dem wenigstens einen Leitungselement und unter Biegung des wenigstens einen Leitungselements über eine Biegekante zwischen den Leiterplattenabschnitten gegeneinander abwinkelbar und/oder abgewinkelt sind. Um die elektrische und mechanische Verbindung zwischen den Leiterplattenabschnitten zu verbessern, ist erfindungsgemäß vorgesehen, dass das Leitungselement im Querschnitt ...

Metal-ceramic substrate for electrical circuit

Processes are claimed for producing an electrical circuit substrate by applying first and second metallisations (3, 4) onto both sides of a ceramic layer (2), the first metallisation (3) being a copper foil applied by a DCB (direct copper bond) technique. In one process, a substrate (1b) with a through-contact (10) is produced by providing an opening (11) in the ceramic layer and applying the second metallisation (4) as a metal-containing paste by a thick film or thin film technique such that the paste is also applied onto the opening (11) and a first metallisation area exposed in the opening. In another process, in which a metallic interlayer is to be formed for thermal and/or electrical connection of the substrate (1a) to another component (e.g. a metal base plate, 6), the second metallisation (4) is much thinner than the first metallisation (3) and is applied as a metal-containing paste by a thick film or thin film technique. Also claimed is a substrate produced by one of the above processes ...

Herstellungsverfahren von elektronischen Komponenten

Verfahren zur Herstellung einer mit elektroplattiertem Sackloch versehenen mehrschichtigen Leiterplatte

Vorrichtung mit mindestens einem Halbleiterbauteil und einer Leiterplatte und Verfahren zur Herstellung einer elektromechanischen Verbindung zwischen beiden

Die Erfindung betrifft eine Vorrichtung mit einem Halbleiterbauteil (1) und einer Leiterplatte (2). Das Halbleiterbauteil (1) weist Außenkontakte (3) und die Leiterplatte (2) weist Kontaktanschlüsse (4) auf. Die Kontaktanschlüsse (4) zeigen eine zentrale Blindöffnung (5), in welche die Außenkontakte (3) des Halbleiterbauteils (1) hineinragen und kraftschlüssig mit den Kontaktanschlussflächen (4) in Eingriff stehen. Bei dem Verfahren zum elektromechanischen Verbinden der beiden Teile zu einer Vorrichtung werden lediglich nach dem Ausrichten die beiden Komponenten aufeinander gepresst.

Elektromagnetische Bandabstandstruktur und Leiterplatte

Eine elektromagnetische Bandabstandstruktur und Leiterplatte sind offenbart. Nach einer Ausführungsform der vorliegenden Erfindung enthält die elektromagnetische Bandabstandstruktur eine pilzartige Struktur mit einer ersten Metallplatte und einer Duchkontaktierung, deren eines Ende mit der ersten Metallplatte verbunden ist; eine zweite Metallplatte, welche mit dem anderen Ende der Durchkontaktierung verbunden ist; eine Metallschicht, welche durch eine Metallleitung mit der zweiten Metallschicht verbunden ist; eine erste dielektrische Schicht, welche zwischen der ersten Metallschicht und der ersten Metallplatte schichtweise gebildet ist; eine zweite dielektrische Schicht, welche auf der ersten Metallplatte und der ersten dielektrischen Schicht schichtweise gebildet ist; und eine zweite Metallschicht, welche auf der zweiten dielektrischen Schicht schichtweise gebildet ist. Mit der vorliegenden Erfindung ist es möglich, das zuvor erwähnte Mischsignalproblem zu lösen, indem die Übertragung ...

ELECTRONIC CIRCUIT ASSEMBLIES

... 1365877 Cooling circuit assemblies SPERRY RAND Ltd 19 Oct 1971 [21 Oct 1970] 49858/70 Heading H1R Circuit boards 2 are attached to the faces of a thermally conducting core 3 with the components 4 accommodated in recesses 5. Thermal contact between components and core may be achieved by direct contact or by a silicone grease filling the recesses or by copper layers on the boards 2. One edge of the core may be secured to a well ventilated external wall of a casing. Connectors 6 are provided for the circuit boards.

Partially voided anti-pads

Electode arrangment, textile garement and method

PRINTED CIRCUIT BOARD AND MANUFACTURING PROCESS FOR IT

FOIL AS CARRIERS OF INTEGRATED CIRCUITS

MORE VORVERZERRER COUPLED TO A HF AMPLIFIER

Printed wiring board, method of soldering quad flat package IC, and air conditioner

A printed wiring board (1) has a solder-land group (5, 6) for placing a quad flat package IC (3), and the solder land group (5, 6) consists of front solder-land groups (5) and rear solder-land groups (6). The printed wiring board 1 includes rear solder-drawing lands (9) that are positioned adjacent to rear solder-land groups (6), that have front edges each of which is substantially parallel to a longitudinal direction of rear solder lands (6a, 6b) constituting the rear solder-land group (6) and has a length approximately equal to or longer than that of the solder lands in the longitudinal direction, that are separated into two parts in a horizontal direction with respect to a traveling direction of solder flow such that a gap between the respective two separate lands (9) is made wider in its rearward portion than that in its frontward portion, and that have a slit (9a) substantially parallel to the longitudinal direction near the front edge. -0-0 *U.LLL I u.g.LJ.a' 2 .......... 1 . Kz6a ...

Printed circuit board and heat sink arrangement

Method for fabricating electrical connecting elements, and connecting element

PRINTED CIRCUIT BOARD FOR REAL-TIME CLOCK IC AND MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD FOR REAL-TIME CLOCK IC

According to one embodiment, a printed circuit board for a real-time clock IC includes a plurality of wiring layers sequentially laminated to form one substrata and including at least one layer which forms an oscillator circuit pattern having a crystal oscillator generating a reference signal and an oscillation stabilizing portion which stabilizes and oscillates the reference signal and adjusts the oscillation frequency to a target frequency, and a power supply layer arranged in at least one of a position between the plurality of wiring layers and front and rear surfaces of the substrate, and forming a power supply circuit pattern which supplies electric power to a circuit on the substrate and removing a portion of the power supply circuit pattern which has width not smaller than width of the oscillator circuit pattern in a portion of the power supply circuit pattern which overlaps with the oscillator circuit pattern.

HIGH VOLTAGE POWER SOURCE DEVICE

PATTERN STRUCTURE OF A PRINTED CIRCUIT BOARD

A pattern structure of a printed circuit board is utilized for mounting various kinds of electronic chip parts. The printed circuit board has a pad in each of a circuit-connecting portion and a ground-circuit portion thereof. A broad continuous ground pattern is formed with cuts to provide the pad in the groundcircuit portion with substantially the same size or area as the pad in the circuit-connecting portion. The pad in the ground-circuit portion is connected to copper foil surrounding the cuts.

PRINTED CIRCUIT BOARD FOR ELECTRICAL DEVICES HAVING RF COMPONENTS, PARTICULARLY FOR MOBILE RADIO TELECOMMUNICATION DEVICES

Printed circuit board for electrical devices having RF components, particularly for mobile radio telecommunication devices To increase the packing density of electronic circuits and conductor-track structures on printed circuit boards for electrical devices having RF components, particularly for mobile radio telecommunication devices, a "micro via" coating is initially applied to one or both sides of a printed circuit board assembly. This "micro via" coating then has, in particular, RF circuits and RF conductor-track structures applied to at least part of its surface. Finally, the RF circuits and RF conductor-track structures are protected in relation to an RF ground coating of the printed circuit board assembly by barrier areas arranged in an assembly coating, situated directly below the "micro via" coating, of the printed circuit board assembly against interfering influences which impair the RF parameters, to be set in each case, of the RF circuits and RF conductor-track structures.

Arrangement electrical components and electrical drive motor with an arrangement of parts

Die Erfindung betrifft eine Bauteileanordnung für eine Steuerschaltung, insbesondere zur Steuerung elektrischer Antriebe. Sie umfasst eine Leiterplatte (2) mit wenigstens einer Leiterbahn (3) und wenigstens ein auf der Leiterplatte angeordnetes elektrisches Bauteil (1). Das wenigstens eine Bauteil (1) ist auf einer Seite der Leiterbahn (3) auf der Leiterplatte (2) vorgesehen und weist zwei Anschlussleitungen (7a, 7b) auf, die durch Durchgänge (8a, 8b) in der Leiterplatte (2) ragen. Wenigstens eine der Anschlussleitungen (7a) ist mittels einer Kontaktstelle (11a) mit der Leiterbahn (3) leitend verbunden, die auf der gegenüberliegenden Seite der Leiterbahn vorgesehen ist. Ein elektrischer Antriebsmotor (20) verwendet eine Steuerschaltung mit einer solchen Bauteileanordnung zur elektronischen Kommutierung.

Suspension board assembly sheet with circuits and method for manufacturing the same

An assembly sheet includes a plurality of suspension boards and a frame member that integrally supports the suspension boards. On a surface of the frame member, a plurality of identification marks for identifying respective positions of the suspension boards in automatic optical inspection are provided corresponding to the suspension boards.

Electronic equipment

Suspension board with circuit

CAPACITIVE AND BACKLIT CONTROL INTERFACE FOR MOTOR VEHICLE

L'invention concerne une interface (100) de commande capacitive et rétroéclairée pour véhicule automobile, comprenant : - une façade de style (102) avec une face avant (104) destinée à être tournée vers un utilisateur et une face arrière (106) opposée à la face avant (104), la façade de style (102) présentant une zone à rétroéclairer (108), - une carte à circuit imprimé (112) monté à distance (G) et en vis-à-vis de la face arrière (106) de la façade de style (104), - une diode électroluminescente (114) montée sur la carte à circuit imprimé (112), - un capteur de détection capacitive (116), - au moins une électrode de détection capacitive (118) reliée électriquement au capteur de détection capacitive (116), caractérisée en ce que l'électrode de détection capacitive (118) est disposée sur la carte à circuit imprimé (112) et en ce que l'interface de commande (100) comprend en outre un guide optique (120) transparent ou translucide, fixé sur la carte à circuit imprimé (112), et présentant un ...

Printed circuit i.e. backplane circuit, for controller of aircraft, has protected conductive track comprising nominal cross-section and throat of reduced cross-section less than nominal cross-section defining fuse segment on protected track

Ce circuit comprend un support isolant et au moins une piste conductrice (10), caractérisé en ce qu'il comprend au moins une piste protégée (10), la ou chaque piste protégée (10) présentant une section nominale et comprenant un rétrécissement (24) de section réduite inférieure à la section nominale définissant un tronçon fusible sur la piste protégée (10).

DEVICE OF CONNECTION FOR SIGNALS HIGH FREQUENCY ENTERS A CONNECTOR AND A LINE OF TRANSMISSION

L'invention concerne un dispositif de raccordement pour signaux haute fréquence comprenant un circuit imprimé (10) sur une face externe (12) duquel est imprimée une ligne de transmission (13) et un connecteur coaxial (11) monté en surface du circuit imprimé (10) sur la face externe (12). L'invention trouve une utilité particulière pour la transmission de signaux radiofréquence en bande X, en particulier pour des fréquences de 9 à 10 GHz. La ligne de transmission (13) est raccordée au connecteur (11) au moyen d'un plot (15) appartenant à la ligne de transmission (13) sur lequel est rapportée une âme centrale du connecteur (11). Le circuit imprimé (10) comprend au moins un plan de masse interne (25) parallèle à la face externe (12) et contribuant à l'adaptation de la ligne de transmission (13). L'invention vise à améliorer la transparence de la transition entre le connecteur (11) et la ligne de transmission (13). Selon l'invention, le plan de masse interne (25) est ajouré au moyen d'une épargne ...

ELECTRONICS COMPONENT LAMINATES

Un composant électronique stratifié a une structure dans laquelle une ligne microruban (ligne MSR) est formée dans une première couche de diélectrique, et une première couche mise à la masse et une couche avec un motif d'ajustement sont formées, respectivement, sur la surface supérieure et sur la surface de base de la première couche de diélectrique. Une seconde couche de diélectrique est formée entre la couche avec un motif d'ajustement et une seconde couche mise à la masse, et des électrodes parallèles en forme de dents de peigne, ayant une surface plus grande que celle de la ligne MSL, sont formées à des positions en face de la ligne MSL dans la couche avec un motif d'ajustement. Une fente est formée dans la seconde couche mise à la masse, de manière à ne pas être en face de la ligne MSL et de manière à être en face des points de connexion des électrodes parallèles. En émettant un faisceau laser depuis la direction de la seconde couche mise à la masse à travers la fente et la seconde ...

DEVICE FOR DETECTING ALIGNMENT ERROR OF PATTERN

Member for flexible device and method of fabricating the same

CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRCUIT BOARD

METHOD FOR MANUFACTURING A SUBSTRATE, PREVENTING A PLATING LAYER COATED IN AN INNER WALL OF A PENETRATION HOLE FROM BEING DAMAGED WHEN ETCHING THE PLATING LAYER

PURPOSE: A method for manufacturing a substrate is provided to improve adhesion between the substrate and a wiring layer by etching a conductive layer formed in a surface of the substrate with a predetermined pattern. CONSTITUTION: A penetration hole(18) is formed in a substrate(16). A penetration hole is a pilot hole. A plated through hole is passed through the plated through hole. The plating is performed in the substrate. An inner wall of the penetration hole is coated with a plating layer(19). A photoresist is laminated in the surface of the substrate. The photoresist is exposed and developed. A resist pattern(72) is formed. The resist pattern covers at least planar region of the penetration hole. A conductive layer is formed in the surface of the substrate and is etched. The conductive layer is etched. The resist pattern is used as a mask. The substrate includes a conductive core unit(10). © KIPO 2009 ...

A method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method

A method of fabricating a substrate core structure comprises: providing first and second patterned conductive layers defining openings therein on each side of a starting insulating layer; providing a first and a second supplemental insulating layers onto respective ones of a first and a second patterned conductive layer; laser drilling a set of via openings extending through at least some of the conductive layer openings of the first and second patterned conductive layers; filling the set of via openings with a conductive material to provide a set of conductive vias; and providing a first and a second supplemental patterned conductive layer onto respective ones of the first and the second supplemental insulating layers, the set of conductive vias contacting the first supplemental patterned conductive layer at one side thereof, and the second supplemental patterned conductive layer at another side thereof.

Wiring circuit board, and method of manufacturing the wiring circuit board and mounting electronic component on the same

A wiring circuit board, and a method of manufacturing the wiring circuit board and mounting an electronic component on the same, by which a highly reliable conductor pattern can be formed and an electronic component can be mounted precisely, are provided. An insulating layer (3) having a mounting part (10) is formed on a metal support layer (2) having a mirror surface glossiness of 150-500% at an incident angle 45DEG, and a conductor pattern (4) is formed on the insulating layer (3), and the quality of the shape of the conductor pattern (4) is examined by a reflection type optical sensor (24). Then, a portion in the metal support layer (2) overlapped with the mounting part (10) is etched in such a manner that the haze value of the mounting part (10) of the insulating layer 3 exposed by the etching is set to 20-50%, so as to form an opening part (16), and a TAB tape carrier (1) is thus obtained. After that, an electronic component (21) is aligned with the mounting part (10) by using a reflection ...

Method of providing printed circuit board with conductive holes and board resulting therefrom

A method of making a printed circuit board in which conductive thru-holes are formed within two dielectric layers of the board's structure so as to connect designated conductive layers. One hole connects two adjacent layers and the other connects two adjacent layers, including one of the conductive layers connected by the other hole. It is also possible to connect all three conductive layers using one or more holes. The resulting holes may be filled, e.g., with metal plating, or conductive or non-conductive paste. In the case of the latter, it is also possible to provide a top covering conductive layer over the paste, e.g., to serve as a pad or the like on the board's external surface.

Printed circuit board for connection with an external connector

A multi-layered printed circuit board (PCB) for connection with an external connector. The external connector has a signal pin and an outer conductor. The printed circuit board includes a first conductive reference plane, a signal trace, a second conductive reference plane, a characteristic impedance member, and a third conductive reference plane. The characteristic impedance member is provided for connecting the signal trace and the signal pin. The third conductive reference plane is provided for electrical connection with the outer conductor. There are vertical separations inserted between the first conductive reference plane, the second conductive reference plane, and the third conductive reference within the printed circuit.

WIDE WEB LASER ABLATION

Circuits on a wide web are made by a method in which a circuit and an index marker are patterned on a first row of the wide web. The wide web is then shifted to a second row. The index marker in the first row of the wide web is sensed, and a circuit in the second row is patterned in the wide web in response to sensing the index marker in the first row, thereby ensuring that circuits in the first and second rows are aligned in the cross-web direction.

LUMINOUS DEVICE AND PROCESS FOR PRODUCING A LUMINOUS DEVICE

The luminous device (L) comprises a first substrate (1), to which a second substrate (2) equipped with at least one semiconductor light source (9) is applied areally, wherein the first substrate (1) is integrally bonded to the second substrate (2) without the use of a bonding agent. The process (S1-S5) serves for producing a luminous device (L), the process comprising at least the following steps: a volume region (3) made of plastic of a first substrate (1) is heated to above the glass transition temperature thereof (S3); a second substrate (2) is placed and pressed areally onto the volume region (3) made of plastic of the first substrate (1) (S4); and the volume region (3) made of plastic of the first substrate (1) is cooled to below the glass transition temperature (Tg) thereof, with the second substrate (2) pressed on (S5).

FLEXIBLE CIRCUIT

The present application is directed to a method of producing a multilayer circuit. The method comprises providing a first electrically insulating layer comprising apertures through the layer and bonding the first electrically insulating layer with a first conductive layer. The first conductive layer is bonded to the first electrically insulating layer in register to the apertures in the electrically insulating layer and the multilayer circuit is produced at a sustained rate. In another embodiment, the method comprises providing a second electrically insulating layer and bonding the second electrically insulating layer with the first conductive layer opposite the first electrically insulating layer.

ELECTRONIC COMPONENT WITH LAMINATED SUBSTRATE

Disclosed is an electronic component with a laminated substrate that can prevent the occurrence of cracks and delamination near the interface of a conductor pattern and a dielectric layer. The laminated substrate includes: a plurality of dielectric layers laminated together; a first conductor pattern (20) positioned along a main surface (12a) of the dielectric layer (12) and connected electrically to ground; and second conductor patterns (22, 24) positioned along the main surface of the dielectric layer, facing the first conductor pattern (20) through the dielectric layer only, and forming an inductor element. Only the dielectric layers on both sides of the first conductor pattern (20) are bonded together via openings (20a to 20h) in the first conductor pattern (20). When perspectively viewed from the laminated direction, the entirety of the second conductor patterns (42, 44) overlap, except for the openings (20a to 20h) in the first conductor pattern (20).

TRANSMISSION LINE HAVING IMPEDANCE SET BY REFERENCE PLANE FENESTRATION

An arrangement in which a transmission line (60) on a multilayer printed circuit board which has an impedance which is set by forming apertures or windows (90) (fenestration) in a nearest conductive reference plane (70).

Wired circuit board assembly

There is provided a wired circuit board assembly which allows effective prevention of the breakage of the flexing portion of a wired circuit board supported by a support frame. In a wired circuit board support sheet (1), a plurality of wired circuit boards (2) each composed of a base insulating layer (5), a conductor pattern (6), and a cover insulating layer (7) which are formed on a support board (4) are supported by a support frame (3) in such a manner that they are arranged and aligned in mutually spaced relation. Each of the wired circuit board (2) has a flexing portion (20) formed by removing the support board (4) to obtain a flexing property. In addition, second connecting portions (19) are provided in spanning relation between the flexing portion (20) and the vertical frame parts (16) of the support frame (3). The arrangement allows effective prevention of the breakage of the flexing portion (20) of each of the wired circuit boards (2) supported by the support frame (3).

Signal transmission structure

A signal transmission structure including a signal line, a first reference plane with a first opening, and a second reference plane with a second opening is provided. The first reference plane is disposed beside the signal line, and a portion of the signal line passes through a position of the first opening. In addition, the second reference plane is disposed beside the first reference plane, and the second opening is in a position corresponding to the position of the first opening, while the outline of the second opening projected onto the first reference plane does not overlap with the position of the first opening. Therefore, at high frequency-transmission, the above structure can reduce the insertion loss resulted from impedance mismatch as the signal passes through the opening, and reduce the resonance induced by the coupling between two reference planes to enhance the quality of signal transmission.

Production method of suspension board with circuit

A production method of a suspension board with circuit that can reduce variations in diameter of the location holes or like holes formed in the suspension board and can produce a trim contour of the suspension board. In the process of forming a seed film 12, zirconium is previously deposited on a surface of the suspension board 2 by sputtering a conductive material forming the seed film 12 using an electrode formed of zirconium. Or, in the process of forming a metal coating 14, palladium is previously deposited on the surface of the suspension board 2 by electroless-plating the thin metal film forming the metal coating 14 using a catalyst including palladium. Thereafter, the suspension board 2 formed of stainless is trimmed by the chemical etching. This can allow an end face 17 of the suspension board 2 to be chemically etched evenly.

METHOD FOR INTERCONNECTING CONTACT LAYERS OF A CIRCUIT BOARD

Electrode embedded member

An electrode embedded member includes a plate-shaped substrate having a front surface and a back surface and that is made of a ceramic, an inner electrode extending parallel to the front surface of the substrate and that is embedded in the substrate, a connection member extending parallel to the front surface of the substrate and that is disposed so as to overlap the inner electrode, and a terminal connected to the connection member. The electrode embedded member has a predetermined structure including at least one of the following: a first predetermined structure in which a thickness of at least a part of the connection member in a direction perpendicular to the front surface of the substrate is 0.2 mm or smaller; a second predetermined structure in which the connection member includes a cutout portion; and a third predetermined structure in which the connection member is composed of a mesh structure.

Circuit element mounting board and circuit element mounting method

The invention provides a technique for mounting circuit elements, in which short circuits between the electrodes of the circuit element do not occur when using silver paste to mount the circuit element. On a board 1 between conductors 2 on which a circuit element 4 is mounted, an insulating resin layer 6 is formed, which is about twice as wide as the circuit element 4, and has a thickness that fills the gap between the mounted circuit element 4 and the board 1. The insulating resin layer 6 is made of a resin whose curing speed is faster than that of a silver paste 5, and is cured at the same time as the curing step of the silver paste 5.

Method of Interconnecting substrates for electrical coupling of microelectronic components

Interconnecting substrates used in the manufacturing of microelectronic devices and printed circuit assemblies, packaged microelectronic devices having interconnecting substrates, and methods of making and using such interconnecting substrates. In one aspect of the invention, an interconnecting substrate comprises a first external layer having a first external surface, a second external layer having a second external surface, and a conductive core between the first and second external layers. The conductive core can have at least a first conductive stratum between the first and second external layers, and a dielectric layer between the first conductive stratum and one of the first or second external layers. The conductive core can also include a second conductive stratum such that the first conductive stratum is on a first surface of the dielectric layer and the second conductive stratum is on a second surface of the dielectric layer. The interconnecting substrate also has at least one ...

Thermal/electrical break for printed circuit boards

A multi-layer printed circuit board including at least one layer of an electrically conducting material and at least one layer of an electrically insulating material. At least one through hole formed at least through the at least one layer of electrically conducting material. The at least one through hole includes a material plated on an interior surface thereof. At least one thermal break is provided in the at least one layer of electrically conducting material, such that heat passing between the through hole and the at least one layer of electrically conducting material passes through the at least one thermal break. At least one electrical connection provided in the at least one layer of electrically conducting material between the material plated on the interior surface of the through hole and the at least one layer of electrically conducting material. At least a portion of the at least one electrical connection is between the through hole and the at least one thermal break.

Printed circuit laminate, printed circuit board produced therefrom, and printed circuit process therefor

A novel printed circuit laminate product and process are provided for use in connection with a printed circuit board. The laminate is composed of a polyimide support stratum, a copper electrical conductor stratum, and an intermediate adhesive stratum. In one form, the opposite faces of the laminate are separately etched to provide different circuit related features and the laminate as an entirety has through holes, which have particular cross sectional geometry and which are produced by particular process steps. In another form, the copper stratum is laminated to the adhesive face of the adhesive and support strata and is etched after through holes have been drilled in the adhesive and support strata. The geometry is such that the diameter of a through hole in a conducting portion of the conducting stratum is smaller than the diameter of the through hole in the adhesive and support strata, so as to provide a conducting rim or flange for ease and security of mechanical and electrical connection ...

Circuit board

A circuit board is provided. The circuit board includes a first metal layer, at least a second metal layer and at least an insulating layer. The first metal layer has at least a solder pad. The second metal layer does not overlap with the solder pad. The insulating layer is disposed between the second metal layer and the first metal layer.

Method of providing printed circuit board with conductive holes and board resulting therefrom

A method of making a printed circuit board in which conductive thru-holes are formed within two dielectric layers of the board's structure so as to connect designated conductive layers. One hole connects two adjacent layers and the other connects two adjacent layers, including one of the conductive layers connected by the other hole. It is also possible to connect all three conductive layers using one or more holes. The resulting holes may be filled, e.g., with metal plating, or conductive or non-conductive paste. In the case of the latter, it is also possible to provide a top covering conductive layer over the paste, e.g., to serve as a pad or the like on the board's external surface.

Circuit element mounting board and circuit element mounting method

The invention provides a technique for mounting circuit elements, in which short circuits between the electrodes of the circuit element do not occur when using silver paste to mount the circuit element. On a board 1 between conductors 2 on which a circuit element 4 is mounted, an insulating resin layer 6 is formed, which is about twice as wide as the circuit element 4, and has a thickness that fills the gap between the mounted circuit element 4 and the board 1. The insulating resin layer 6 is made of a resin whose curing speed is faster than that of a silver paste 5, and is cured at the same time as the curing step of the silver paste 5.

Laminated flat cable and method for producing same

A laminated flat cable includes a laminate, a signal line for high-frequency signal transmission, a reference ground conductor, and an auxiliary ground conductor. The laminate includes a first base layer with first and second principal surfaces and a second base layer with third and fourth principal surfaces, and the second principal surface is opposed to the third principal surface. The signal line is located on the second principal surface. The reference ground conductor is located on the first principal surface and is opposite to the signal line. The auxiliary ground conductor is located on the third or fourth principal surface and is opposite to the signal line. The auxiliary ground conductor includes a plurality of openings arranged along the signal line.

Light source module, fabrication method therefor, and lighting device including the same

A light source module includes at least one light source emitting light, and a body supporting the light source. The body includes a heat sink absorbing heat from the light source and dissipating the heat to the outside, an insulating layer having electrical insulating properties, the insulating layer being provided on at least one surface of the heat sink, and a conductive layer provided on the insulating layer to enable electric current to flow therein. The conductive layer includes an electrically conductive layer providing a path region in which electric current is applied to the light source, and a heat dissipation conductive layer diffusing generated by the light source. Accordingly, it is possible to obtain effects such as rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, and promotion of heat dissipation. Furthermore, it is possible to obtain various effects that can be understood through configurations described ...

Flexible substrate and electronic device

A flexible substrate inserted in a hinge electrically connects circuit substrates, which are housed in a first casing and a second casing, respectively, to each other. The substrate has a power supply line and signal lines which are formed from a wiring conductor. Slits are opened in border portions of the power supply line in a cranked portion. The slits opened in the border portions of the power supply line make the rigidity of the border portions lower than in prior art. This means that a base is prevented from squashing the wiring conductor (power supply line) when the substrate is bent and that stress concentration on the border portions can accordingly be avoided. As a result, cracks in the border portions are prevented and the power supply line (wiring conductor) is protected against wire breakage.

CIRCUIT BOARD HAVING CONFIGURABLE GROUND LINK AND WITH COPLANAR CIRCUIT AND GROUND TRACES

Housing of LED light source comprising electrical connector

An electrical conductive covering structure of an illuminating device (8) includes a substrate (81) and a plurality of light-emitting elements (82). The electrical conductive covering structure includes an electrical conductive circuit (10), an electrical connector (20), a transparent body (30), and a lamp cover (40). The electrical conductive circuit (10) is arranged on a surface of the substrate (81) and electrically connected to the light-emitting elements (82). The electrical connector (20) is fixed to the substrate (81) and electrically connected to the electrical conductive circuit (10). The transparent body (30) is over-molded outside the electrical conductive circuit (10) and the electrical connector (20). The lamp cover (40) is over-molded outside the electrical connector (20) and the transparent body (30). With this structure, the influence of humidity and moisture on the illuminating device (8) can be minimized, thereby increasing its anti-oxidant property and lifetime.

INTEGRATED HEAD-ELECTRONICS INTERCONNECTION SUSPENSION FOR A DATA RECORDING DISK DRIVE

An integrated transducer-electronics interconnection suspension (12) for a disk drive having a high data transfer rate generally above (15) Mbytes/sec between the transducer (9) and the read/write electronics. A suspension (12) supports a slider (10) to which a transducer (9) is mounted and maintains the slider (10) in close proximity to the disk surface. An integrated transducer-electronics interconnection suspension is a laminate structure having electrically conductive traces as part of the structure and connecting the transducer (9) with the read/write electronics. It can support high data transfer rates between the transducer (9) and the read/write electronics by providing means for avoiding sudden changes in the characteristic impedance of the traces to minimize signal reflection on them. The width of the traces are shaped accordingly to prevent abrupt changes in the trace impedance caused by trace bonding areas, apertures and other mechanical obstructions in the suspension. Changes ...

Wiring board and manufacturing method thereof

A wiring board is disclosed that includes a first insulating layer (110), a conductor (155,160,170) which is formed on a surface of the first insulating layer (110), and a second insulating layer (180) which is formed on surfaces of the first insulating layer (110) and of the conductor (155,160,170). The wiring board is provided with a semispherical-shaped or conical-shaped hole-forming portion (200) which penetrates through the second insulating layer (180) into the conductor (155,160,170).

HEAT SINK

PROBLEM TO BE SOLVED: To provide a heat sink exhibiting excellent heat dissipation performance at a low material cost. SOLUTION: The heat sink 1 comprises: an insulating substrate 3 having one surface serving as a heating element mounting surface; and a heat sink 5 secured to the other surface of the insulating substrate 3. A metal layer 7 is formed on the surface of the insulating substrate 3 opposite to the heating element mounting surface. A stress relax member 4 made of an aluminum plate 10 having a plurality of through holes 9 serving as stress absorption spaces is interposed between the metal layer 7 on the insulating substrate 3 and the heat sink 5. The stress relax member 4 is soldered to the metal layer 7 on the insulating substrate 3 and the heat sink 5. COPYRIGHT: (C)2007,JPO&INPIT ...

SEMICONDUCTOR DEVICE

PURPOSE: To contrive to cut down the cost of title semiconductor device by accomplishing a BGA (ball grid array) in a TAB system, and to make it possible to visually observe the state of soldering to a mounting substrate. CONSTITUTION: An inner lead 3a and a land 3b are formed on a base film 2 where a through hole 2a is formed, and a copper foil wiring 3, on which through holes 3c are perforated, is formed on a land part. A cover resist 4, having an aperture on the land part, is covered on the base film. The electrode 1a of a semiconductor chip 1 is bonded on the inner lead 3a, and the electrode 1a is protected by sealing resin 5. A bump 6 is formed by supplying a solder ball to the land 3b and conducting reflow treatment. At this time, solder creeps up to the opposite side too via through hole 3c. By this creeping up 6a, the state of soldering can be visually observed, and electric characteristics can also be checked. COPYRIGHT: (C)1996,JPO ...

Leiterplatte und elektronisches Bauteil

Elektromagnetische Bandlückenstruktur und Leiterplatte

Elektromagnetische Bandlückenstruktur (300), welche Folgendes aufweist: eine erste Metallschicht (210-1); eine erste dielektrische Schicht (220a), die über der ersten Metallschicht (210-1) gestapelt ist; eine Metallplatte (330), die über der ersten dielektrischen Schicht (220a) gestapelt ist; eine Durchkontaktierung (340), die die erste Metallschicht (210-1) mit der Metallplatte (330) verbindet; eine zweite dielektrische Schicht (220b), die über der Metallplatte (330) und der ersten dielektrischen Schicht (220a) gestapelt ist; eine zweite Metallschicht (210-2), die über der zweiten dielektrischen Schicht (220b) gestapelt ist, wobei in der Metallplatte (330) mehrere Löcher (350) außerhalb eines Bereichs ausgebildet sind, in welchem die Durchkontaktierung (340) mit der Metallplatte (330) verbunden ist.

STREIFENLEITUNG MIT GLEICHMAESSIG ANGEPASSTEM WELLENWIDERSTAND

Electronic substrate assembly structure for use in vehicle electronic device, has water proof seal inserted in connection section and sealed by connecting screw, where electronic substrate is adhered by water proof seal

The structure has a ground plate part (2) provided with a heat transfer section. A cut-protection section forms a gap between an opposite side upper surface and two heat transfer models, where the gap is filled with thermal conductive adhesive. A connection section includes a covering part (1) and the ground plate part, and a water proof seal is inserted in the connection section and sealed by a connecting screw (3). An electronic substrate (5) is adhered in a sandwich manner by the water proof seal. The seal and adhesive are selected from a fluid silicon resin material.

Leiterplatte und Verfahren für deren Herstellung

Leiterplatte, bei der ein leitender Film nicht über dem Abschnitt eines Substrats bereitgestellt ist, der den umgebenden Abschnitten eines Lochs entspricht, das durch das Substrat ausgebildet wird.

Vorrichtung für eine Leistungs-Hochspannungsquelle.

VERFAHREN ZUR HERSTELLUNG EINER GEDRUCKTEN LEITERPLATTE

VORVERZERRER GEKOPPELT AN EINEN HF VERSTÄRKER

Direct copper bonded substrates

In a direct copper bonded substrate arrangement having copper layers on both major surfaces of an electrically insulating substrate, one of which layers is patterned to leave a gap, the copper of the other layer is reduced in section over a region opposite the gap so as to reduce the cross-section of copper in tension across the gap, and thereby the forces which would tend to distort the substrate as a result of temperature cycling.

Laminated electronic component

METHOD FOR EMI/RFI SHEILDING AN INFRARED ENERGY REFLOW SOLDERED DEVICE

Circuit module and method of manufacturing the same

PRINTED PRINTED CIRCUIT BOARD AND PROCEDURE FOR THEIR PRODUCTION

LAMP HOLDER FOR A HIGH PRESSURE TLA DUNG LAMP AND A HIGH PRESSURE GLOW LAMP

PRINTED CIRCUIT BOARD AND MANUFACTURING PROCESS FOR IT

PRODUCTION PROCESS FOR PRINTED CIRCUIT BOARDS, ON WHICH ELECTRONIC COMPONENTS WITHOUT CONNECTING CABLE AUFGELÖTET

SOLDERING RECESS FOR BUS BAR

PROCEDURE FOR MANUFACTURING A CERAMEL OF SUBSTRATE

MANUFACTURING PROCESS OF A MAP AND RECEIVED MAP

PROCEDURE FOR THE METALLIZATION OF A SUBSTRATE.

PRINTED CIRCUIT BOARD FOR ELECTRICAL DEVICES WITH HF COMPONENTS, IN PARTICULAR FOR MOBILE RADIO OF TELECOMMUNICATIONS DEVICES

COMPOSITE MULTI-LAYER SUBSTRATE AND MODULE USING THE SUBSTRATE

SYSTEMS AND METHODS FOR ELECTROMAGNETIC NOISE SUPPRESSION USING HYBRID ELECTROMAGNETIC BANDGAP STRUCTURES

A hybrid electromagnetic bandgap (EBG) structure for broadband suppression of noise on printed wiring boards includes an array of coplanar patches interconnected into a grid by series inductances, and a corresponding array of shunt LC networks connecting the coplanar patches to a second conductive plane. This combination of series inductances and shunt resonant vias lowers the cutoff frequency for the fundamental stopband. The series inductances and shunt capacitances may be implemented using surface mount component technology, or printed traces. Patches may also be interconnected by coplanar coupled transmission lines. The even and odd mode impedances of the coupled lines may be increased by forming slots in the second conductive plane disposed opposite to the transmission line, lowering the cutoff frequency and increasing the bandwidth of the fundamental stopband. Coplanar EBG structures may be integrated into power distribution networks of printed wiring boards for broadband suppression ...

CIRCUIT BOARD, POWER STORAGE DEVICE, BATTERY PACK, AND ELECTRONIC DEVICE

An electronic apparatus is provided including a substrate, a conductive land formed on a surface of the substrate, an electronic component including an electrode, at least one insulating protrusion formed on the land in an overlapping region between the land and the electrode in plan view, and a solder that bonds the electronic component to the land, the solder being formed between the electrode and the land in the overlapping region in a normal direction to the surface of the substrate.

PRINTED CIRCUIT BOARD FOR ELECTRICAL DEVICES HAVING RF COMPONENTS, PARTICULARLY FOR MOBILE RADIO TELECOMMUNICATION DEVICES

The invention aims to raise the packing density of electronic circuits and printed conductor structures on circuit boards intended for electrical apparatus having HF components, notably mobile radiocommunications equipment. To this end, a "micro via" layer (M2) is first applied to one or both sides of a circuit board substrate (LPT4). Thereafter, especially HF circuits and HF printed conductor structures (LBS3HF) are placed onto at least part of the "micro via" layer (M2). The HF circuits and HF printed conductor structures (LBS3HF) are protected in relation to an HF mass layer of the circuit board substrate by blocking zones arranged in a substrate layer (LPL2) of the circuit board layer situated directly below the "micro via" layer (M2) against interfering influences which affect the HF parameters to be adjusted of the HF circuits or HF printed conductor structures LBS3HF).

Layout of contact pads of a system in package, comprising circuit board and electronic integrated elements

Method for providing a printed circuit board (16) with an electronic device, wherein the electronic device (1) having at least one external soldering pad (11) having a predetermined size for heat dissipation is soldered with the soldering pad onto a printed circuit board substrate of the printed circuit board (16) such that the electronic device (1) is electrically connected to an electrical circuit provided on the printed circuit board substrate, characterised in that prior to soldering, one or more through holes (12) are provided in the printed circuit board (16) in the area where the soldering pad is to be soldered to the printed circuit board (16) such that the through hole (12) is provided for allowing flux gasses resulting during soldering of the electronic device (1) to the printed circuit board to escape.

Scalable high-bandwidth connectivity

High-frequency signal line and electronic device

To provide an easily bendable high-frequency signal line and an electronic apparatus which are capable of suppressing the deviation of the characteristic impedance of a signal line from a predetermined characteristic impedance. A dielectric body 12 is obtained by laminating a protection layer 14 and dielectric sheets 18a to 18c, and has a surface and an undersurface. A signal line 20 is a linear conductor disposed in the dielectric body 12. A ground conductor 22 is disposed in the dielectric body 12, faces the signal line 20 via the dielectric sheet 18a, and continuously extends along the signal line 20. A ground conductor 24 is disposed in the dielectric body 12, faces the ground conductor 22 via the signal line 20 sandwiched therebetween, and has a plurality of openings 30 arranged along the signal line 20. The surface of the dielectric body 12 on the side of the ground conductor 22 with respect to the signal line 20 is in contact with a battery pack 206.

Defected ground structure with shielding effect

A defected ground structure with shielding effect is provided. The structure includes a dielectric layer, a defected metal layer, a grounded metal layer and at least a conductive mushroom-like structure. The defected metal layer has a line-shaped opening and is disposed in the dielectric layer. The conductive mushroom-like structure is disposed between the defected metal layer and the grounded metal layer and is arranged along an extending direction of the line-shaped opening periodically. The conductive mushroom-like structure includes a fungating part and a stipe part. The fungating part is parallel to the defected metal layer and a distance is maintained away from the defected metal layer. The projection area of the fungating part on the defected metal layer covers a length of the line-shaped opening corresponding to the fungating part. The stipe part connects the fungating part and the grounded metal layer.

Wiring structure and joint box including the same

A wiring structure includes a board assembly and pin terminals. In each of pin terminal insertion holes formed in the board assembly, a terminal connection portion electrically connected to a metal foil wire and fitted onto the pin terminal so as to hold the pin terminal is provided in a through-hole of at least one of a plurality of circuit boards forming the board assembly, which forms a part of the pin terminal insertion hole, whereas an insulating sleeve blocking contact between the pin terminal and each of the remaining circuit boards is fitted into through-holes of the remaining circuit boards, which form the remaining part of the pin terminal insertion hole.

Bendable Luminous Modules and Method for Producing Bendable Luminous Modules

A light module ( 1; 14 ), comprising a carrier ( 8, 10 ) for mounting at least one semiconductor source ( 5 ), in particular a light emitting diode, wherein: the carrier ( 8, 10 ) has a flexible printed circuit board ( 10 ), the flexible printed circuit board ( 10 ) is bonded face-to face to at least one base plate, ( 8 ) and the carrier ( 8, 10 ) can be bent along at least one predetermined bending line ( 3; 3 a - 3 e ), the base plate ( 8 ) can be bent along the at least one bending line, ( 3; 3 a - 3 e ), the base plate ( 8 ) has at least one cutout ( 9 ) along the bending line ( 3; 3 a - 3 e ) and the flexible printed circuit board ( 10 ) has at least one strip ( 11; 15 ) which crosses at least one of the cutouts ( 9 ).

High-frequency signal transmission line

A flexible high-frequency signal transmission line includes a dielectric body including laminated flexible dielectric layers. A signal line is provided in the dielectric body. A grounding conductor is arranged in the dielectric body to be opposed to the signal line via one of the dielectric layers. The grounding conductor is of a ladder structure including a plurality of openings and a plurality of bridges arranged alternately along the signal line. A characteristic impedance of the signal line changes between two adjacent ones of the plurality of bridges such that the characteristic impedance of the signal line rises from a minimum value to an intermediate value and to a maximum value and falls from the maximum value to the intermediate value and to the minimum value in this order.

Construction of reliable stacked via in electronic substrates - vertical stiffness control method

A stacked via structure for reducing vertical stiffness includes: a plurality of stacked vias, each via disposed on a disc-like structure. The disc-like structure includes a platted through hole landing with a thickness of substantially 3 μm. The platted through hole landing includes an etched pattern and a copper top surface.

Apparatus for detecting pattern alignment error

An apparatus for detecting pattern alignment error includes a first conductive pattern disposed over a first insulation member with a power source applied of the first conductive pattern; a second insulation member for covering the first conductive pattern; a second conductive pattern disposed on the second insulation member; a conductive via connected to the second conductive pattern and passing through the second insulation member; and an insulation pattern disposed in the first to conductive pattern for detecting an alignment error in response to a position of the conductive via. The apparatus for detecting pattern alignment error can detect the alignment of lower wiring in a device with multi-layer wiring

Thermal Management Of LED-Based Lighting Systems

An LED lighting element for use in a fluorescent lighting fixture includes first and second end caps formed as printed circuit boards for connecting with and obtaining physical support from respective first and second sockets of the fluorescent lighting fixture, and a blade supporting one or more LEDs between the first and second end caps. The blade includes a first compartment that contains high voltage circuitry, a second compartment, separated from the first compartment, that contains a low voltage assembly including the one or more LEDs, and a third compartment forming an optical cavity. The element also includes a power converter, located in one or both of the first and second end caps, that converts power from the fluorescent light socket into power for operating the LEDs.

Display apparatus

A display apparatus including a display panel including a pixel electrode and a plurality of first signal lines transmitting a driving signal to the pixel electrode, a conductive member on the first signal lines, the conductive member having a resin, and a second signal line on the conductive member, the second signal line having an opening through which the resin travels to couple the second signal line with one of the first signal lines.

Printed circuit board

A printed circuit board is designed to meet the following requirements. A front-back copper foil residual rate difference a−b falls within a range of −10% to 10%, where the insulative board is divided into a plurality of divisions, in which front and back surface copper foil residual rates of each division are a % and b %, respectively. A difference (a−b)−(c−d) between front-back copper foil residual rate differences of adjacent divisions falls within a range of −10% to 10%, where the front and back surface copper foil residual rates of a division adjacent to the each division are c % and d %, respectively. There are not three or more consecutive divisions for which the difference between the front-back copper foil residual rate differences goes beyond a range of −5% to 5%.

Flexible printed circuit board and circuit-board connection structure

A terminal portion configured to obtain electrical connection with a printed circuit board includes a first signal pad that is formed in a first conductor layer and is electrically separated from a ground layer, a pair of first ground pads that is formed in the first conductor layer to sandwich the first signal pad and is connected to the ground layer, a second signal pad that is formed in a second conductor layer and is connected to a signal line, a pair of second ground pads that is formed in the second conductor layer to sandwich the second signal pad and is electrically separated from the signal line, a third signal pad formed in a third conductor layer, and a pair of third ground pads formed in the third conductor layer to sandwich the third signal pad. The second signal pad is wider than the third signal pad.

Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers

A wearable device includes a flexible printed circuit board and one or more conductive stiffeners. The conductive stiffeners include a conductive surface that can be electrically or thermally connected to contact pads on the flexible printed circuit board. The wearable device can further include an adhesive layer or an encapsulation layer. The adhesive layer and the encapsulation layer can include conductive portions surrounded by non-conductive portions. The conductive portions can be aligned with the conductive stiffeners and together transmit electrical and/or thermal energy to the contact pads of the flexible printed circuit board.

PRINTED WIRING LINE, ELECTRONIC DEVICE, TOUCH PANEL, GRAVURE PLATE, PRINTED WIRING LINE FORMATION METHOD, TOUCH PANEL PRODUCTION METHOD, AND ELECTRONIC DEVICE PRODUCTION METHOD

A printed wiring line formed on a substrate connects two different points on the substrate which are connectable by another printed wiring line with a shape of a straight-line segment and has a shape corresponding to at least one of: 1) a shape with no linear part parallel to the straight-line segment; 2) a shape with line segments connected in series, each line segment having a shape with no linear part parallel to the straight-line segment; 3) a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment, length of the part parallel to the straight-line segment being not more than length of the straight-line segment; and 4) a shape in which line segments are connected in series, each line segment having a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment. 1. A printed wiring line formed on a substrate , whereinthe printed wiring line connects two different points on the substrate which are connectable by another printed wiring line with a shape of a straight-line segment and has a shape corresponding to at least one of:1) a shape with no linear part parallel to the straight-line segment;2) a shape in which line segments are connected in series, each line segment having a shape with no linear part parallel to the straight-line segment;3) a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment, length of the part parallel to the straight-line segment being not more than half of length of the straight-line segment; and4) a shape in which line segments are connected in series, each line segment having a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment.2. Printed wiring lines comprising:at least two printed wiring lines formed parallel to each other on a substrate, whereinthe at least two printed wiring lines each have a same shape, 1) a ...

SIGNAL TRANSMISSION SYSTEM, CONNECTOR APPARATUS, ELECTRONIC DEVICE, AND SIGNAL TRANSMISSION METHOD

A signal transmission system including: a first connector apparatus, and a second connector apparatus that is coupled with the first connector apparatus. The first connector apparatus and the second connector apparatus are coupled together to form an electromagnetic field coupling unit, and a transmission object signal is converted into a radio signal, which is then transmitted through the electromagnetic field coupling unit, between the first connector apparatus and the second connector apparatus. 1. (canceled)2. A signal transmission system comprising:a connector that has a coupling structure to couple with another connector, the coupling structure including a radio coupler connected configured to a signal converting circuit to execute modulation processing based on a transmission object signal and to convert the signal into a high-frequency signal, the radio coupler also being configured to execute demodulation processing on the basis of a received radio signal and to convert the signal into a baseband signal and transmitting the radio signal, the connector being coupled with the other connector to form an electromagnetic field coupler between the radio coupler and a radio coupler of the other connector; andcircuitry that determines whether the radio signal can be transmitted through the electromagnetic field coupler between the connector and the other connector.3. The signal transmission system according to claim 2 , wherein claim 2 , when the circuitry determines that the radio signal can be transmitted claim 2 , the circuitry allows the transmission object signal to be transmitted by the radio signal through each connector.4. The signal transmission system according to claim 2 , wherein claim 2 , when the circuitry determines that the radio signal cannot be transmitted claim 2 , the circuitry forbids the transmission object signal to be transmitted by the radio signal through each connector.5. The signal transmission system according to claim 2 , wherein claim ...

Electronic device and wiring structure thereof

An electronic device is provided and includes a wiring structure including a conductive wiring and an insulating layer. The conductive wiring is disposed on a substrate and has a top side and two side walls opposite to each other. The insulating layer wraps around the conductive wiring at least through the top side and two side walls, wherein there is a gap between the insulating layer and at least one of the two side walls. The conductive wiring includes a first layer, a second layer and a third layer, the second layer is disposed between the first layer and the third layer, and the first layer is disposed between the second layer and the substrate. A thickness of the second layer is greater than a thickness of the first layer, and the thickness of the second layer is greater than a thickness of the third layer.

Electrical Components Attached to Fabric

An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint. 1. An item , comprising:fabric comprising intertwined strands of material, wherein the fabric has a pocket and the intertwined strands of material include a conductive strand that passes through the pocket; andan electrical component in the pocket, wherein the electrical component has a groove and wherein the conductive strand is soldered to the electrical component in the groove.2. The item defined in wherein the electrical component comprises a protective structure and wherein the groove is located in the protective structure.3. The item defined in wherein the protective structure comprises thermoplastic material.4. The item defined in further comprising an additional groove in the protective structure that is parallel to the groove.5. The item defined in wherein the intertwined strands of material comprise an additional conductive strand that is soldered to the electrical component in the additional groove.6. The item defined in wherein the electrical component comprises a contact pad and wherein the groove exposes the contact pad.7. The ...

Method for forming voids and structure with voids formed using the same

A method for forming voids corresponding to pads of SMT components is provided. The method comprises following steps: One or more condition parameters are inputted into a searching unit. The searching unit searches all of the pads with reference to the condition parameters to obtain a pre-selected group of pads. A judgment unit is provided to determine whether each pad of the pre-selected group of pads meets a pre-determined processing requirement to generate a to-be-processed group of pads. An execution unit executes a void formation step with reference to corner coordinates of each of the to-be-processed group of pads, so as to form at least a void at the portion of a contact surface corresponding to a corner of the pad. In an embodiment, four voids which are related to respective corners of each pad of the to-be-processed group are formed at the contact surface accordingly.

Opening in the Pad for Bonding Integrated Passive Device in InFO Package

A package includes a conductive pad, with a plurality of openings penetrating through the conductive pad. A dielectric layer encircles the conductive pad. The dielectric layer has portions filling the plurality of openings. An Under-Bump Metallurgy (UBM) includes a via portion extending into the dielectric layer to contact the conductive pad. A solder region is overlying and contacting the UBM. An integrated passive device is bonded to the UBM through the solder region. 1. A package of integrated circuit device , the package comprising:a device die;a through-via;an encapsulating material encapsulating the device die and the through-via therein;a plurality of redistribution lines over the encapsulating material and electrically coupling to the device die and the through-via, wherein the plurality of redistribution lines comprise a first metal pad and a second metal pad;an integrated passive device comprising a first terminal and a second terminal, wherein the first terminal overlaps a portion of, and is electrically coupled to, the first metal pad and the second metal pad; anda polymer layer comprising a plurality of portions extending into the first metal pad, wherein the plurality of portions of the polymer layer are separated from each other by the first metal pad.2. The package of further comprising:an Under-Bump Metallurgy (UBM) comprising a first via portion and a second via portion located at opposite ends of the UBM, wherein the first via portion extends into the polymer layer to contact the first metal pad, and the second via portion extends into the polymer layer to contact the second metal pad.3. The package of claim 2 , wherein each of the first metal pad and the second metal pad laterally extends beyond edges of the UBM.4. The package of claim 2 , wherein the UBM comprises a third via portion extending into the polymer layer to contact the first metal pad.5. The package of claim 4 , wherein each of the first via portion and the third via portion is ...

Current redistribution in a printed circuit board

In one implementation, a multilayered printed circuit board is configured to redirect current distribution. The current may be distributed by steering, blocking, or otherwise manipulating current flows. The multilayered printed circuit board includes at least one power plane layer. The power plane layer does not distribute current evenly. Instead, the power plane layer includes multiple patterns with different resistances. The patterns may include a hatching pattern, a grid pattern, a directional pattern, a slot, a void, or a continuous pattern. The pattern is a predetermined spatial variation such that current flows in a first area differently than current flows in a second area.

Flexible circuit board for multiple signal transmission

The present disclosure provides a flexible circuit board for multiple signal transmission including a first dielectric layer; a plurality of first side grounds formed on one surface of the first dielectric layer to be parallel; first signal lines formed between the plurality of first side grounds; and a plurality of through holes which is formed in each of the plurality of first side grounds with an interval, along a length direction of the first side grounds.

Printed circuit boards including strip-line circuitry and methods of manufacturing same

A printed circuit board includes a first layer stack and a second layer stack coupled to the first layer stack. The first layer stack includes a first electrically-insulating layer, a first electrically-conductive layer, and a cut-out area defining a void that extends therethrough. The first electrically-insulating layer includes a first surface and an opposite second surface. The first electrically-conductive layer is disposed on the first surface of the first electrically-insulating layer. The second layer stack includes a second electrically-insulating layer. The second electrically-insulating layer includes a first surface and an opposite second surface. One or more electrically-conductive traces are disposed on the first surface of the second electrically-insulating layer. The printed circuit board further includes a device at least partially disposed within the cut-out area. The device is electrically-coupled to one or more of the one or more electrically-conductive traces disposed on the first surface of the second electrically-insulating layer.

Circuit module and method of manufacturing the same

Manufacturing method and circuit module, which comprises an insulator layer and, inside the insulator layer, at least one component, which comprises contact areas, the material of which contains a first metal. On the surface of the insulator layer are conductors, which comprise at least a first layer and a second layer, in such a way that at least the second layer contains a second metal. The circuit module comprises contact elements between the contact areas and the conductors for forming electrical contacts. The contact elements, for their part, comprise, on the surface of the material of the contact area, an intermediate layer, which contains a third metal, in such a way that the first, second, and third metals are different metals and the contact surface area (A CONT 1 ), between the intermediate layer and the contact area is less that the surface area (A PAD ) of the contact area.

Flexible printed board and method of producing a flexible printed board

An objective of the present invention is to prevent a copper foil used as a recognition mark from being stripped from a base film in a flexible printed board while preventing the recognition accuracy for the recognition mark from being reduced. A flexible printed board includes a base film; a copper foil pattern on the base film, wherein the copper foil pattern has a hollow shape with an outer circumferential section and an inner circumferential section and is configured to function as a recognition mark; a coverlay having an opening formed therein, wherein the coverlay is bonded to the base film and covers the outer circumferential section of the copper foil pattern such that an edge of the opening is positioned between the outer circumferential section and the inner circumferential section of the copper foil pattern.

Suspended lattice for electrical interconnects

A method of forming an electrical interconnect includes etching a lattice pattern into a contact pad on a circuit substrate as a first connection point, at least partially filling the lattice pattern with a conductive epoxy, contacting the conductive epoxy with a second connection point, and curing the epoxy.

Light Sensing Module and Display Apparatus

A light sensing module and a display apparatus are provided. The light sensing module includes a circuit board and a light sensing device, wherein the circuit board includes a mounting region and a device region surrounding the mounting region, an encapsulation layer is disposed on the device region, and a light sensing device, a light sensing hole and a barrier structure are provided on the mounting region, a vertical projection of the light sensing device on the mounting region at least partially overlaps with a vertical projection of the light sensing hole on the mounting region, and the barrier structure is disposed around the periphery of the light sensing hole, and separates the encapsulation layer from the light sensing hole.

CIRCUIT BOARD, POWER STORAGE DEVICE, BATTERY PACK, AND ELECTRONIC DEVICE

An electronic apparatus is provided including a substrate, a conductive land formed on a surface of the substrate, an electronic component including an electrode, at least one insulating protrusion formed on the land in an overlapping region between the land and the electrode in plan view, and a solder that bonds the electronic component to the land, the solder being formed between the electrode and the land in the overlapping region in a normal direction to the surface of the substrate. 1. An electronic apparatus comprising:a substrate;a conductive land formed on a surface of the substrate;an electronic component including an electrode;at least one insulating protrusion formed on the land in an overlapping region between the land and the electrode in plan view; anda solder that bonds the electronic component to the land, the solder being formed between the electrode and the land in the overlapping region in a normal direction to the surface of the substrate.2. The electronic apparatus according to claim 1 , further comprising a plurality of the protrusions that are positioned in the overlapping region near corners of the electrode in plan view.3. The electronic apparatus according to claim 1 , wherein the solder is interposed between the protrusion and the electrode in the normal direction.4. The electronic apparatus according to claim 1 , wherein the land includes an extension portion that protrudes from a side of the land in plan view.5. The electronic apparatus according to claim 4 , wherein a shape of the extension portion is selected from the group consisting of a rectangular shape claim 4 , a triangular shape claim 4 , a curved shape and a semicircular shape.6. The electronic apparatus according to claim 5 , wherein at least a portion of the extension portion is present in the overlapping region.7. The electronic apparatus according to claim 1 , wherein a thickness of the solder interposed between the land and the electrode is at least 70 μm in the normal ...

Electrical Components Attached to Fabric

An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint. 1. An item , comprising:fabric comprising first and second strands with conductive segments;an electrical component having a surface with first and second grooves; andconductive material in the first and second grooves that electrically couples the electrical component to the conductive segments of the first and second strands.2. The item defined in wherein the fabric comprises a pocket and wherein the electrical component is located in the pocket.3. The item defined in wherein the electrical component comprises a protective structure that encapsulates the conductive segments of the first and second strands.4. The item defined in wherein the protective structure comprises thermoplastic material.5. The item defined in wherein the protective structure is transparent.6. The item defined in wherein the electrical component emits light through the protective structure.7. The item defined in wherein the electrical component comprises a light-emitting diode.8. The item defined in wherein the first and second grooves are located in the protective ...

Circuit board

A circuit board is disclosed, including a circuit board body and at least one via apparatus provided on the circuit board body. The via apparatus includes a via (101) formed on the circuit board body, a via pad (201) surrounding the via and separately provided from the via, and an electrical conductor (301) electrically connecting the via pad (201) with the via (101).

Circuit board, and manufacturing method for circuit board

A circuit board, onto which an electronic component is to be mounted, is provided with insulating core substrates and patterned metal plates. The metal plates are bonded to at least one side of the insulating core substrates. The insulating core substrates and the metal plates form a laminated body, in which a gas-vent hole is provided. The gas-vent hole is formed so that when the electronic component is mounted, the gas present between the insulating core substrates and the metal plates expands and is released to a side open to the atmosphere via the gas-vent hole.

Signal transmission system, connector apparatus, electronic device, and signal transmission method

A signal transmission system including: a first connector apparatus, and a second connector apparatus that is coupled with the first connector apparatus. The first connector apparatus and the second connector apparatus are coupled together to form an electromagnetic field coupling unit, and a transmission object signal is converted into a radio signal, which is then transmitted through the electromagnetic field coupling unit, between the first connector apparatus and the second connector apparatus.

SEMICONDUCTOR DEVICE HAVING BUFFER STRUCTURE FOR EXTERNAL TERMINALS

A semiconductor device, including a first board, a second board having a plurality of through holes passing therethrough, and a plurality of external terminals that are respectively press-fitted into the plurality of through holes of the second board, one end portion of each external terminal passing through the corresponding through hole and being fixed to a front surface of the first board. The second board is a printed circuit board that further includes, in a top view thereof, a plurality of support regions, each having one of the plurality of through holes formed therein, and a plurality of buffer regions respectively surrounding the plurality of support regions, each buffer region having at least one buffer hole and at least one torsion portion formed therein, the at least one torsion portion being connected to the support region surrounded by each buffer region. 1. A semiconductor device , comprising:a first board;a second board having a plurality of through holes passing therethrough; anda plurality of external terminals that are respectively press-fitted into the plurality of through holes of the second board, one end portion of each external terminal passing through the corresponding through hole and being fixed to a front surface of the first board, wherein a plurality of support regions, each having one of the plurality of through holes formed therein, and', 'a plurality of buffer regions respectively surrounding the plurality of support regions, each buffer region having at least one buffer hole and at least one torsion portion formed therein, the at least one torsion portion being connected to the support region surrounded by said each buffer region., 'the second board is a printed circuit board that further includes, in a top view thereof,'}2. The semiconductor device according to claim 1 , whereineach of the plurality of support regions is of a circular shape, andin each of the plurality of buffer regions, the at least one buffer hole is positioned ...

METHOD OF FORMING A SUBSTRATE CORE STRUCTURE USING MICROVIA LASER DRILLING AND CONDUCTIVE LAYER PRE-PATTERNING AND SUBSTRATE CORE STRUCTURE FORMED ACCORDING TO THE METHOD

A method of fabricating a substrate core structure comprises: providing first and second patterned conductive layers defining openings therein on each side of a starting insulating layer; providing a first and a second supplemental insulating layers onto respective ones of a first and a second patterned conductive layer; laser drilling a set of via openings extending through at least some of the conductive layer openings of the first and second patterned conductive layers; filling the set of via openings with a conductive material to provide a set of conductive vias; and providing a first and a second supplemental patterned conductive layer onto respective ones of the first and the second supplemental insulating layers, the set of conductive vias contacting the first supplemental patterned conductive layer at one side thereof, and the second supplemental patterned conductive layer at another side thereof. 1. A system comprising: a starting insulating layer;', 'a first patterned conductive layer on one side of the starting insulating layer, and a second patterned conductive layer on another side of the starting insulating layer;', 'a first supplemental insulating layer on the first patterned conductive layer;', 'a second supplemental insulating layer on the second patterned conductive layer;', 'a first supplemental patterned conductive layer on the first supplemental insulating layer;', 'a second supplemental patterned conductive layer on the second supplemental insulating layer;', 'a set of conductive vias provided in corresponding laser-drilled via openings extending from the second supplemental patterned conductive layer to the first supplemental patterned conductive layer, the via openings further extending through the first patterned conductive layer and the second patterned conductive layer; and, 'a multilayer substrate core structure including, 'an electronic assembly includinga main memory coupled to the electronic assembly.2. The system of claim 1 , wherein ...

SUBSTRATE, ELECTRONIC DEVICE, AND DESIGN SUPPORT METHOD OF SUBSTRATE

Provided is a substrate including a first wiring layer, wherein the first wiring layer has a structure in which among a plurality of first connection parts of a plurality of vias, at least one of first connection parts of two vias located closer to both ends of the first wiring layer is coupled to a body of the first wiring layer through a first conductive portion, each of the plurality of first connection parts being coupled to the first wiring layer, and a cross-sectional area of the first conductive portion is less than an area of a first part of the first wiring layer, the first part being in contact with a first connection part of a via other than the first connection parts of the two vias. 1. A substrate including a first wiring layer , wherein among a plurality of first connection parts of a plurality of vias, at least one of first connection parts of two vias located closer to both ends of the first wiring layer is coupled to a body of the first wiring layer through a first conductive portion, each of the plurality of first connection parts being coupled to the first wiring layer, and', 'a cross-sectional area of the first conductive portion is less than an area of a first part of the first wiring layer, the first part being in contact with a first connection part of a via other than the first connection parts of the two vias., 'the first wiring layer has a structure in which'}2. The substrate according to claim 1 , whereinat least one of the first connection parts of the two vias located closer to both ends of the first wiring layer is coupled to the body of the first wiring layer through a plurality of the first conductive portions, anda sum of cross-sectional areas of the plurality of the first conductive portions is less than the area of the first part of the first wiring layer.3. The substrate according to claim 1 , whereinthe first conductive portion is formed by providing an aperture around a first connection part of a corresponding via.4. The ...

Optical module

A first circuit board has an electrode pattern, a ground pattern, a first through hole, and a second through hole. The first through hole penetrates through the electrode pattern. The second through hole penetrates through the ground pattern. A second circuit board has a signal line, an electrode terminal, and a ground terminal. The electrode terminal is extended from the signal line, and is electrically connected to the electrode pattern with the electrode terminal being inserted into the first through hole. The ground terminal is electrically connected to the ground pattern with the ground terminal being inserted into the second through hole, and has a width, a length, or an area or any combination thereof larger than a width, a length, or an area or any combination thereof of the electrode terminal.

SUBSTRATE AND ELECTRONIC DEVICE

Provided is a substrate including a first wiring layer coupled to another wiring layer through a plurality of vias, wherein in the first wiring layer, an area of a first region except an aperture is greater than an area of a second region except an aperture, the first region being enclosed by a first line segment passing through a first connection part of a first via and being parallel to a first short side of the first wiring layer and a second line segment passing through a second connection part of a second via and being parallel to the first short side, the second region being enclosed by the second line segment and a third line segment passing through a third connection part of a third via and being parallel to the first short side, the first, second, and third connection parts connecting to the first wiring layer. 1. A substrate including a first wiring layer coupled to another wiring layer through a plurality of vias , whereinthe first wiring layer has a structure in whichan area of a first region, which is enclosed by a first line segment and a second line segment, except an aperture located in the first region is greater than an area of a second region, which is enclosed by the second line segment and a third line segment, except an aperture located in the second region, the first line segment passing through a first connection part of a first via of the plurality of vias and being parallel to a first short side of the first wiring layer, the second line segment passing through a second connection part of a second via of the plurality of vias and being parallel to the first short side, the third line segment passing through a third connection part of a third via of the plurality of vias and being parallel to the first short side, the first connection part, the second connection part, and the third connection part being connected to the first wiring layer.2. The substrate according to claim 1 , further comprising:a second wiring layer coupled to the first ...

Multi-chip package and manufacturing method

Manufacturing method and a multi-chip package, which comprises a conductor pattern and insulation, and, inside the insulation, a first component, the contact terminals of which face towards the conductor pattern and are conductively connected to the conductor pattern. The multi-chip package also comprises inside the insulation a second semiconductor chip, the contact terminals of which face towards the same conductor pattern and are conductively connected through contact elements to this conductor pattern. The semiconductor chips are located in such a way that the first semiconductor chip is located between the second semiconductor chip and the conductor pattern.

Transmission apparatus for wifi circuit of terminal device and preparating method thereof

Provided is a transmission apparatus for a WiFi circuit of a terminal device including a printed circuit board, a WiFi chip and an antenna, and the transmission apparatus includes: a transmission element embedded onto the printed circuit board and forming a closed path; a first transition element connected between the transmission element and the WiFi chip so that the transmission element and the WiFi chip have impedance continuity; and a second transition element connected between the transmission element and the antenna so that the transmission element and the antenna have impedance continuity, wherein the transmission element is provided with two rows of metal via holes cut through in a thickness direction of the transmission element so that a channel for transmission of millimeter wave signal is formed between the two rows of metal via holes. In addition, the disclosure also provides a preparing method of the transmission apparatus.

RESIN MULTILAYER SUBSTRATE, ELECTRONIC COMPONENT, AND MOUNTING STRUCTURE THEREOF

A resin multilayer substrate includes a plurality of insulating resin base material layers and a plurality of conductor patterns provided on the plurality of insulating resin base material layers. The plurality of conductor patterns include a signal line and a ground conductor overlapping the signal line as viewed from a laminating direction of the insulating resin base material layers. A plurality of openings are provided in the ground conductor, and an aperture ratio is higher in a zone far from the signal line than in a zone adjacent to or in a vicinity of the signal line in a direction perpendicular or substantially perpendicular to the laminating direction. 1. A resin multilayer substrate comprising:a plurality of insulating resin base material layers; anda plurality of conductor patterns provided on the plurality of insulating resin base material layers; whereinthe plurality of conductor patterns include a signal line and a ground conductor overlapping the signal line as viewed from a laminating direction of the plurality of insulating resin base material layers;a plurality of openings are provided in the ground conductor to provide an unevenly distributed aperture ratio; andthe openings are provided, in a direction perpendicular or substantially perpendicular to the laminating direction, in a first zone adjacent to or in a vicinity of the signal line and in a second zone farther from the signal line than the first zone, and the aperture ratio is higher in the second zone than in the first zone.2. The resin multilayer substrate according to claim 1 , wherein the openings are provided only at positions not overlapping the signal line as viewed from the laminating direction.3. The resin multilayer substrate according to claim 1 , wherein a diameter or a width of each of the openings is smaller than a line width of the signal line.4. The resin multilayer substrate according to claim 1 , wherein the ground conductor includes a plurality of ground conductors ...

RESIN MULTILAYER SUBSTRATE, ELECTRONIC COMPONENT, AND MOUNTING STRUCTURE THEREOF

A resin multilayer substrate includes a plurality of insulating resin base material layers and a plurality of conductor patterns provided on the plurality of insulating resin base material layers. The plurality of conductor patterns include a plurality of signal lines provided at positions not overlapping each other as viewed from a laminating direction of the insulating resin base material layers, and a ground conductor overlapping the plurality of the signal lines as viewed from the laminating direction. Openings are provided in the ground conductor and, as viewed from the laminating direction, an aperture ratio is higher in an inner zone that is sandwiched between two signal lines than in an outer zone of the two signal lines. 1. A resin multilayer substrate comprising:a plurality of insulating resin base material layers; anda plurality of conductor patterns provided on the plurality of insulating resin base material layers; whereinthe plurality of conductor patterns include a plurality of signal lines provided at positions not overlapping each other as viewed from a laminating direction of the plurality of insulating resin base material layers, and a ground conductor overlapping the plurality of signal lines as viewed from the laminating direction;the ground conductor includes a plurality of openings that provide an unevenly distributed aperture ratio; andas viewed from the laminating direction, the aperture ratio due to the openings provided in an inner zone that is sandwiched between two signal lines of the plurality of signal lines is higher than the aperture ratio due to the openings provided in an outer zone that is not sandwiched between the two signal lines.2. The resin multilayer substrate according to claim 1 , whereinthe ground conductor includes a plurality of ground conductors between which the plurality of signal lines are sandwiched in the laminating direction; andthe resin multilayer substrate includes an interlayer connecting conductor that ...

Detection device and display device with detection function

[Problem] To prevent detachment of overcoat layer which covers at least a part of a terminal formed on a substrate. [Measure to solve the problem] According to one embodiment, a detection device includes a substrate, detection electrode, terminal formed of a metal material, lead, coating layer, conductive adhesion layer, and circuit board. The lead connects the electrode and the terminal. The coating layer covers the electrode and the lead, and partly covers the terminal. The adhesion layer covers a part of the terminal exposed from the coating layer and covers a part of the coating layer. The circuit board is connected to the terminal with the adhesion layer interposed therebetween. At least in an overlapping area where the conductive adhesion layer covers the coating layer, the metal material that forms the terminal includes a shape that the metal material is partly removed.

Led tube lamp

An LED tube lamp including a lamp tube, an end cap attached to an end of the lamp tube, a power supply disposed in the end cap, and an LED light bar disposed inside the lamp tube. The LED light bar is mounted with LED light sources which are electrically connected to the power supply by way of the LED light bar. The LED light bar includes a bendable circuit sheet which is longer than the lamp tube. A soldering pad is configured and disposed at an end of the bendable circuit sheet. The soldering pad is formed with a through-hole or a notch to allow tin solder to pass through when soldering such that the bendable circuit sheet can be directly soldered and electrically connected to the power supply.

CONNECTION STRUCTURE BETWEEN OPTICAL DEVICE AND CIRCUIT SUBSTRATE, AND OPTICAL TRANSMISSION APPARATUS USING THE SAME

An optical device includes a connection pad, which is connected to a conductor pattern on the circuit substrate, at one edge. The connection pad includes one ground pad, and two or more signal pads between which the ground pad is interposed from its both sides. The ground pad includes a concave portion including an opening at the edge. The circuit substrate is provided with a metal columnar member in the conductor pattern to which the ground pad is connected. The conductor pattern and the connection pad are fixed to each other with solder in a state in which the columnar member is fitted into the concave portion. Solder, which gradually rises from the ground pattern to a lateral surface of the columnar member, is formed between the columnar member and the ground pattern that is formed in the flexible printed circuit. 1. A connection structure between an optical device and a circuit substrate ,wherein the optical device includes a flexible printed circuit including a conductive pattern to which an electrode configured to input a radio-frequency signal to the optical device is connected,in the flexible printed circuit,connection pads, which are connected to a conductor pattern on the circuit substrate, are arranged at one edge,the connection pads include at least one ground pad, and at least two signal pads between which the ground pad is interposed from its both sides, andat least one concave portion including an opening formed in the one edge is provided at a portion, at which the ground pad is formed, in the one edge of the flexible printed circuit, andin the circuit substrate,the conductive pattern, to which the ground pad is connected, on a surface of the circuit substrate, is provided with a columnar member that extends from the conductor pattern to an upper side of a substrate surface of the circuit substrate and is formed from a metal,the conductor pattern and the connection pads are fixed to each other with solder in a state in which the columnar member is ...

Printed circuit board

[Object] There is suggested a printed circuit board capable of realizing impedance matching by securing joint reliability between signal pins of a surface mount connector and signal pin pads and preventing the reduction of impedance of signal pin pads while minimizing the reduction of a wirable area. [Solution] A printed circuit board equipped with a signal pin pad, which is soldered to a signal pin from a surface mount connector, and a ground layer located as a lower layer below the signal pin pad; wherein a fillet is formed around a joint area between the signal pin and the signal pin pad after soldering; wherein a cut-out portion is provided in the signal pin pad within a joint area with the signal pin; and wherein the size of the cut-out portion is set within the range of being completely covered within the joint area with the signal pin based on size tolerance of the signal pin, fabrication tolerance of the printed circuit board, and mount position tolerance of the surface mount connector.

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

A semiconductor device and a method for manufacturing the semiconductor device. The semiconductor device includes an insulating substrate, a semiconductor chip, a plate member, and a cooler. The insulating substrate includes insulating ceramics serving as an insulating plate, and conductive plates provided on opposite surfaces of the insulating ceramics. The semiconductor chip is provided on an upper surface of the insulating substrate. The plate member is bonded to a lower surface of the insulating substrate. The cooler is bonded to a lower surface of the plate member. At least one of bonding between a lower surface of the insulating substrate and the plate member and bonding between a lower surface of the plate member and the cooler is performed via a bonding member composed mainly of tin. Also, a cyclic stress of the plate member is smaller than a tensile strength of the bonding member. 1. A semiconductor device comprising:an insulating substrate including an insulating plate and conductive plates which are provided on opposite surfaces of said insulating plate;a semiconductor chip provided on an upper surface of said insulating substrate;a plate member bonded to a lower surface of said insulating substrate; anda cooler bonded to a lower surface of said plate member, whereinat least one of bonding between the lower surface of said insulating substrate and said plate member and bonding between the lower surface of said plate member and said cooler is performed via a bonding member which is composed mainly of tin, anda cyclic stress of said plate member is smaller than a tensile strength of said bonding member.2. The semiconductor device according to claim 1 , wherein{'b': 3', '33, 'said plate member (, ) is formed of aluminum with a purity of 99.999% or higher,'}3. The semiconductor device according to claim 1 , whereinsaid plate member includes an aluminum plate member formed of aluminum with a purity of 99.999% or higher, and conductive members which are ...

Circuit board configurations facilitating operation of heat sensitive sensor components

A multilayered circuit board having a metal-free region vertically extending through at least a portion of a conductive layer, which lies generally parallel to a horizontal plane, vertically spaced from an outer surface. Heat-emitting and heat-sensitive components are mounted on the outer surface. The heat-emitting component is vertically and laterally spaced from the metal-free region, whereas the heat-sensitive component is vertically spaced and laterally aligned within the metal-free region such that the metal-free region is a thermal barrier that shields heat-sensitive component from radial heat flowing from the heat-emitting component.

Electrical Components Attached to Fabric

An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint. 1. An item , comprising:fabric formed from strands including at least first and second conductive strands;an electrical component having a substrate with first and second opposing surfaces and an electrical device mounted to the first surface of the substrate; anda protective structure that encapsulates the electrical device, wherein the protective structure has first and second grooves and wherein the first and second conductive strands are electrically coupled to the electrical component within the first and second grooves.2. The item defined in wherein the protective structure is transparent.3. The item defined in wherein the electrical device emits light through the protective structure.4. The item defined in wherein the electrical device comprises a light-emitting diode.5. The item defined in wherein the fabric comprises insulating strands that are woven with the first and second conductive strands.6. The item defined in wherein the substrate comprises a printed circuit substrate.7. The item defined in further comprising first and second ...

TRANSPARENT CONDUCTIVE COATINGS FOR OPTOELECTRONIC AND ELECTRONIC DEVICES

The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same. 1. A process for the manufacture of a conductive transparent film on a substrate , the process comprising:coating a substrate by a first material to form a wet film of said first material on at least a region of a surface of said substrate;treating the film with at least one second material capable of displacing the first material in the film at the point of contact; thereby leading to displacement of the film material from the point of contact and the exposure of the substrate, to provide an array of spaced apart ring-voids in said film; andoptionally treating the film to render the first material conductive.2. The process according to claim 1 , wherein the substrate is of a material selected from the group consisting of glass claim 1 , paper claim 1 , a semiconductor inorganic or organic material claim 1 , a polymeric material and a ceramic material.3. The process according to claim 2 , wherein the substrate is an inorganic semiconductor material selected from the group consisting of silicon claim 2 , tin claim 2 , compounds of boron claim 2 , tellurium claim 2 , geranium claim 2 , gallium claim 2 , gallium arsenide (GaAs) claim 2 , gallium phosphide (GaP) claim 2 , cadmium telluride (CdTe) claim 2 , gallium aluminum arsenide (GaAlAs) claim 2 , indium phosphide (InP) claim 2 , gallium arsenide phosphide (GaAsP) claim 2 , cadmium sulfide (CdS) claim 2 , copper indium gallium diselenide (CIGS) claim 2 , mercury cadmium telluride (HgCdTe) claim 2 , copper indium sulfide and copper indium selenide.4. The process according to claim 2 , wherein the substrate is of a polymeric material selected from the group consisting of a polyimide claim 2 , polyester claim 2 , a polyacrylate claim 2 , a polyolefin claim 2 , a polyimide claim 2 , a polycarbonate and polymethyl methacrylate.5. The process according to claim 1 , wherein the first ...

Contact Area Design for Solder Bonding

A package component includes a dielectric layer and a metal pad over the dielectric layer. A plurality of openings is disposed in the metal pad. The first plurality of openings is separated from each other by portions of the metal pad, with the portions of the metal pad interconnected to form a continuous metal region. 1. A package comprising: a first dielectric layer;', 'a second dielectric layer over and contacting the first dielectric layer;', 'a metal pad over the first dielectric layer, wherein the metal pad is in the second dielectric layer; and', 'a first plurality of trenches in the metal pad, wherein the first plurality of trenches is separated from each other by portions of the metal pad, the portions of the metal pad being interconnected to form a continuous metal region;, 'a first package component comprisinga solder region disposed in the first plurality of trenches in the metal pad, the solder region in contact with the metal pad, wherein an outer edge of the solder region is in contact with a sidewall of the second dielectric layer; anda metal trace in the first dielectric layer, the metal trace comprising a second plurality of trenches filled with a dielectric material.2. The package of further comprising:a second package component comprising a metal pillar.3. The package of claim 1 , wherein the metal trace comprises an edge vertically aligned with the metal pad claim 1 , wherein a bottom surface of the metal pad is in contact with a top surface of the metal trace.4. The package of claim 1 , wherein the metal trace comprises:a trace portion having a first width, wherein the trace portion extends laterally beyond edges of the metal pad from a plan view; anda pad portion having a second width greater than the first width, wherein the metal pad overlies and contacts the pad portion of the metal trace.5. The package of claim 4 , wherein the pad portion of the metal trace comprises the second plurality of trenches claim 4 , and bottom surfaces of the ...

PRINTED WIRING LINE, ELECTRONIC DEVICE, TOUCH PANEL, GRAVURE PLATE, PRINTED WIRING LINE FORMATION METHOD, TOUCH PANEL PRODUCTION METHOD, AND ELECTRONIC DEVICE PRODUCTION METHOD

A printed wiring line formed on a substrate connects two different points on the substrate which are connectable by another printed wiring line with a shape of a straight-line segment and has a shape corresponding to at least one of: 1) a shape with no linear part parallel to the straight-line segment; 2) a shape with line segments connected in series, each line segment having a shape with no linear part parallel to the straight-line segment; 3) a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment, length of the part parallel to the straight-line segment being not more than length of the straight-line segment; and 4) a shape in which line segments are connected in series, each line segment having a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment. 1. A gravure plate for gravure offset printing , the gravure plate comprising:a plate having a top surface configured to come into contact with a blanket, wherein a recess having a bottom surface and two side surfaces is formed on the top surface, the recess defining a pattern of a wiring line to be printed by the gravure plate; andprojections formed on the bottom surface of the recess, wherein the projections protrude inside the recess to reduce a volume of the recess by a total volume of the projections which protrude therein.2. The gravure plate according to claim 1 , whereina top of each of the projections is located between the top surface of the plate and the bottom surface of the recess, inclusive of the top surface of the plate and exclusive of the bottom surface of the recess.3. The gravure plate according to claim 1 , whereinthe projections are formed in a row in a longitudinal direction of the recess and only one of the projections is present in a width direction of the recess between the two side surfaces.4. The gravure plate according to claim 2 , whereinthe projections are formed in a row ...

Backlight bar, backlight module and display device

A backlight bar includes a flexible circuit board and backlight lamp, the flexible circuit board includes a circuit board base and an electrostatic shielding structure, the electrostatic shielding structure is disposed on a first surface of the circuit board base and located in a non-marginal region, and the backlight lamp disposed on a second surface of the circuit board base, the first surface disposed opposite to the second surface. A backlight module and a display device are also provided.

Card manufacturing technique and resulting card

A card manufacturing technique and the resulting card are provided. The card has a ground and/or power layer extending to the edges of a circuit board for electrostatic discharge protection but also has gaps at the edge of the ground and/or power layer to avoid short circuiting with conductive segments of another layer deformed when the card is trimmed during manufacture.

Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers

A device includes a flexible printed circuit board and one or more conductive stiffeners. The conductive stiffeners include a conductive surface that can be electrically connected to contact pads on the flexible printed circuit board. The wearable device can further include an adhesive layer or an encapsulation layer. The adhesive layer and the encapsulation layer can include conductive portions surrounded by non-conductive portions. The conductive portions can be aligned with the conductive stiffeners and together transmit electrical energy to the contact pads of the flexible printed circuit board.

Copper metallisation on ceramic substrate - obtd. by bonding copper foil directly to whole surface of substrate, then masking and etching

Structured Cu metallisation is produced on a ceramic substrate by a process in which a Cu foil is bonded directly to the whole surface of the substrate and is then masked and etched. Control of the masking and etching process produces one or all of the forms: (a) rounding of the corners of the metallisation; (b) an edge region of reduced thickness; (c) formation of tooth or finger-shaped edges; (d) sub-division or weakening e.g. by formation of holes in the metallisation. ADVANTAGE - Reduced tendency to crack formation.

Multilayer printed circuit board

Printed wiring board

Fabrication of high density multilayer interconnect printed circuit boards

High density built-up multilayer printed circuit boards are produced by constructing microvias with photoimageable dielectric materials. A photosensitive dielectric composition (4) on a conductive foil (2) is laminated to conductive lines (6) on a core (8). After imaging the foil (2), and imaging and curing the photosensitive dielectric composition (4), vias (14) are formed to the conductive lines (6). Thereafter the conductive lines (6) are connected (16) through the vias (14) to the conductive foil (2), and then the conductive foil (2) is patterned.

Low impedance structure for PCB based electrodes

A PCB based electrochemical sensor includes a PCB having a first electrode on a first surface of the PCB, and a second electrode on a second surface. A sensing element, such as a conductive wire, is attached to the first electrode. The PCB includes one or more through holes, and the conductive wire is positioned proximate one or more of the one or more through holes. When the PCB based electrochemical sensor is positioned in a solution to be sensed, the solution fills the through holes. The ions within the solution provide a current pathway between the conductive wire and the second electrode through the through holes. A voltage potential between the two electrodes is measured. The measured voltage potential is used to determine a value associated with the solution, such as a pH value.

印刷电路板的制造方法

本发明揭示了印刷电路板的制造方法，包括以下步骤：S1，提供电路板基板，在电路板基板的设定位置进行穿孔；S2，分别在基板的两侧以印刷手段在其平面进行粘接胶的印刷；S3，在两侧粘接胶上分别粘接导电层，导电层的孔位与基材的孔位相对应开设,基板与导电层的外边缘进行封闭设置；S4，导电层和基板叠合设置，加热并压合各导电层和基板，粘接胶受压完全填充导电层和基材的孔位；S5，导电层孔位溢出残胶进行磨除，孔面清洗以及干燥。本发明避免电路板外侧溢胶，保证电路板孔位内完全填胶。

Circuit board

Method for the individual encoding of metal-ceramic substrates

Die vorliegende Erfindung betrifft ein Verfahren zur individuellen Codierung von MetallKeramik-Substraten. Weiterer Gegenstand der vorliegenden Erfindung sind Metall-Keramik-Substrate, die eine individuelle Markierung aufweisen. The present invention relates to a method for the individual coding of metal-ceramic substrates. Another object of the present invention are metal-ceramic substrates having an individual marking.

电路化衬底

本发明提供一种电路化衬底，其包括复数个接续的敞开段，所述接续的敞开段在一导电层内界定多个面对的边缘部分以隔离所述导电层的分离部分，从而使所述层可用于不同的功能，例如在一包括所述衬底作为其一部分的产品(例如，电气组合件)内作为电源和接地元件。本发明还提供一种制造所述衬底的方法、一种利用所述衬底的电气组合件、一种同样利用所述衬底的多层电路化组合件及一种信息处理系统(例如一主计算机)。

印刷布线板和印刷电路板

本发明公开一种印刷布线板和印刷电路板。在多层印刷布线板中，连接第一电源布线和第二电源布线的多个通路孔平行于电流沿其流动的方向而排成行。为了防止电流集中在通路孔之中的与电源布线的最端部连接的通路孔上，通路孔和通路孔之间的狭窄部分被窄化以增大电阻。在第二导体层的电源布线的最端部处类似地设置被窄化的狭窄部分。

制造多层印刷电路板的方法

这样形成多层印刷电路板，即多个在其间分别插有绝缘层的导体层被叠置为一个整体，在绝缘层中设置以露出的导体层作为底部的非贯穿的孔，并在孔中设置用于导体层之间电连接的镀层，该孔被形成为在其轴向剖面图中，至少在孔的内周边到底面的延续区域处有半径在20-100μm的范围内的凹形曲面，由此因镀敷镀层产生的等电位面沿该延续区域也是弯曲的，因而用于镀层厚度均匀的电流密度均匀而不会在该延续区域处变薄。

High frequency printed wiring boards, probe cards and probe devices

반도체 웨이퍼상에 형성된 여러개의 IC칩의 전기적 특성의 검사를 행하기 위한 프로우브 카드는, 카드 본체와 프린트 배선관을 가진다. 카드 본체는 IC칩의 전극패드에 접촉하기 위한 접촉자를 가진다. 프린트 배선판은 접촉자에 고주파 신호를 전송하기 위한 여러개의 전송로를 가진다. 프린트 배선관은, 제1 및 제2절연층간에 배열 설치된 여러개의 신호선과, 제1 및 제2절연층의 각각을 통해서 상기 신호선과 대향하는 제1 및 제2기준 도전판을 가진다. 제1 및 제2기준 도전판에는 서로 다른 직류전의가 부여된다. 제1 및 제2기준 도전판은 각전송로를 따라서 실질적으로 서로 다르게 되도록 배치된다, 또한, 제1 및 제2기준 도전판은 약간 겹치도록 배치되고, 각 전송로의 임피던스가 전체적으로 균일하게 되도록, 겹친 양이 조정된다.

Intermediate product of multilayer wiring board, manufacturing method of multilayer wiring board

Multilayer board and its manufacturing method

비아 홀(6)이 형성된 하나 이상의 제1 내층용 기재(10)와, 최상층에 배치된 상기 기재(10)에 위치한 표층 회로용 기재(20)와, 상기 기재(10)에 위치한 제2 내층용 기재(30)와, 최하층에 배치된 표층 회로용 도체 박막(40)을 일괄 적층하여, 일괄 적층체(60)을 제조한다. 이러한 일괄 적층체(60)에서, 상기 최상층의 표층 회로용 기재(20)와 최하층의 도체 박막(40)에, 상기 제1 내층용 기재(10) 및 제2 내층용 기재(30)에 형성된 내층 회로를 전기적으로 접속하는 층간 도통부(51a, 51b)를 형성한 후, 상기 층간 도통부(51a, 51b)가 형성된 표층 회로용 기재(20) 및 표층 회로용 도체 박막(40) 상에 미세한 회로를 각각 형성한다. At least one first inner substrate 10 having via holes 6 formed therein, a substrate 20 for surface circuits positioned on the substrate 10 disposed on the uppermost layer, and a second inner layer disposed on the substrate 10. The base material 30 and the conductor thin film 40 for surface layer circuits arrange | positioned at the lowest layer are collectively laminated, and the batch laminated body 60 is manufactured. In such a batch laminate 60, an inner layer formed on the uppermost surface layer circuit substrate 20 and the lowermost conductive thin film 40 on the first inner substrate 10 and the second inner substrate 30. After the interlayer conductive portions 51a and 51b for electrically connecting the circuits are formed, a fine circuit is formed on the surface circuit substrate 20 and the surface thin film conductor 40 for forming the interlayer conductive portions 51a and 51b. Form each. 다층, multilayer, 적층, 회로, 기판 Multilayer, multilayer, laminated, circuit, board

Manufacturing method of electronic component built-in substrate

キャリアと、銅箔とからなる支持基材を準備し、銅箔上の少なくとも一部にニッケルからなる保護膜（１０５）を形成する。そして、保護膜（１０５）上に銅からなる導体パターン（１０）をアディティブ法により形成する。続いて、導体パターン（１０）が形成された基板上に、電子部品（２）をその回路形成面と導体パターン（１０）の形成面とが向かい合うように配置し、配置した電子部品（２）を半硬化状態のコア材（３）と被覆材（４）で被覆する。それから、キャリアを剥離し、アルカリエッチャントを用いて、銅箔をエッチング除去する。そして、電子部品（２）の端子（２０）と導体パターン（１０）の一部とを電気的に接続すると、電子部品内蔵基板（１）が得られる。 A support base material made of a carrier and a copper foil is prepared, and a protective film (105) made of nickel is formed on at least a part of the copper foil. Then, a conductor pattern (10) made of copper is formed on the protective film (105) by an additive method. Subsequently, the electronic component (2) is arranged on the substrate on which the conductor pattern (10) is formed so that the circuit formation surface and the formation surface of the conductor pattern (10) face each other, and the arranged electronic component (2). Is coated with a semi-cured core material (3) and a covering material (4). Then, the carrier is peeled off, and the copper foil is etched away using an alkali etchant. When the terminal (20) of the electronic component (2) and a part of the conductor pattern (10) are electrically connected, the electronic component built-in substrate (1) is obtained.

Liquid crystal display and back plate component thereof

本发明公开了一种液晶显示器，包括：背板；液晶显示面板，设置于背板的内侧；电路板，设置于背板的外侧，所述电路板上形成有开孔；其中，液晶显示器进一步包括设置在背板上的夹持件，夹持件包括与背板连接的连接部以及与连接部连接的接触部，接触部上设有凸包，电路板被接触部弹性固定至背板上，且凸包的至少一部分凸伸至所述开孔中。采用上述设计，保证电路板与背板之间连接可靠的前提下可提高电路板组装至背板的效率。

Printed wiring board and method of manufacturing the same

도체회로(106)를 가지는 절연기판(107)의 표면에 열경화형수지로 이루어지는 솔더레지스터를 인쇄하고, 열경화시켜, 낮은 열팽장계수를 가지는 절연피막(101)을 형성한다. 절연피막(101)에서의 개구부 형성부분에 레이저(102)를 조사해서 그 개구부 형성부분을 달구어 끊어, 개구부(110)를 형성하고 도체회로(106)의 일부를 노출시킨다. 이 개구부(110)는 그 내부 표면에 금속도금막을 형성함에 의하여 도전용공으로서 형성된다.외부접속패드가 개구부를 덮기 위하여 형성되는 것이 바람직하다. 금속도금막이 전기도금이 끝난뒤 레이저에 의하여 절단되는 전기도금리드에 의하여 형성된다. A solder resist made of a thermosetting resin is printed on the surface of the insulating substrate 107 having the conductor circuit 106 and thermally cured to form an insulating coating 101 having a low thermal expansion coefficient. The laser 102 is irradiated to the opening forming portion of the insulating film 101 to cut off the opening forming portion, thereby forming the opening 110 and exposing a part of the conductor circuit 106. The opening 110 is formed as a conductive hole by forming a metal plated film on the inner surface thereof. It is preferable that an external connection pad is formed to cover the opening. The metal plating film is formed by an electroplating lead which is cut by a laser after the electroplating is finished. 프린트배선판 Printed wiring board

Printed wiring board and method of manufacturing the same

도체회로(106)를 가지는 절연기판(107)의 표면에 열경화형수지로 이루어지는 솔더레지스터를 인쇄하고, 열경화시켜, 낮은 열팽장계수를 가지는 절연피막(101)을 형성한다. 절연피막(101)에서의 개구부 형성부분에 레이저(102)를 조사해서 그 개구부 형성부분을 달구어 끊어, 개구부(110)를 형성하고 도체회로(106)의 일부를 노출시킨다. 이 개구부(110)는 그 내부 표면에 금속도금막을 형성함에 의하여 도전용공으로서 형성된다.외부접속패드가 개구부를 덮기 위하여 형성되는 것이 바람직하다. 금속도금막이 전기도금이 끝난뒤 레이저에 의하여 절단되는 전기도금리드에 의하여 형성된다. A solder resist made of a thermosetting resin is printed on the surface of the insulating substrate 107 having the conductor circuit 106 and thermally cured to form an insulating coating 101 having a low thermal expansion coefficient. The laser 102 is irradiated to the opening forming portion of the insulating film 101 to cut off the opening forming portion, thereby forming the opening 110 and exposing a part of the conductor circuit 106. The opening 110 is formed as a conductive hole by forming a metal plated film on the inner surface thereof. It is preferable that an external connection pad is formed to cover the opening. The metal plating film is formed by an electroplating lead which is cut by a laser after the electroplating is finished. 프린트배선판 Printed wiring board

A kind of flexible display panels and display device

本发明公开了一种柔性显示面板及显示装置，柔性显示面板包括弯折区和显示区。弯折区包括多条金属走线；金属走线为长带状，包括金属带和开孔；开孔贯穿于所述金属带；在所述金属带的宽度方向上，所述开孔边缘的点到所述金属带一侧边的最小距离与所述金属带的宽度最小处的比值为0.1～0.7。本发明通过设计新型的弯折区走线结构，防止弯折区走线的应力集中，增强其在弯折过程中强度，避免走线断裂。

Panel of PCB

기판 판넬이 개시된다. 한 쌍의 클램프 접점과 상기 한 쌍의 클램프 접점의 사이에 위치하는 복수의 버스 라인을 포함하는 기판 판넬에 있어서, 상기 복수의 버스 라인 간의 간격은 인접한 클램프 접점으로 갈수록 커지는 것을 특징으로 하는 기판 판넬이 제공된다. A substrate panel is disclosed. A substrate panel comprising a pair of clamp contacts and a plurality of bus lines positioned between the pair of clamp contacts, wherein the spacing between the plurality of bus lines is increased toward an adjacent clamp contact. Is provided. 기판 판넬, 클램프, 버스 라인 Board Panels, Clamps, Bus Lines

Structure and wiring substrate

提出了一种结构体，包括：第一导体(102)和第二导体(103)，所述第一导体的至少一部分与所述第二导体的至少一部分彼此相对；第三导体(101)，所述第三导体插入到所述第一导体(102)与所述第二导体(103)之间，所述第三导体的至少一部分与所述第一导体(102)和所述第二导体(103)相对，并且所述第三导体具有第一开口(105)；互连(111)，设置在所述第一开口(105)的内部；以及导体过孔(121)，所述导体过孔与所述第一导体(102)和所述第二导体(103)电连接，并且与所述第三导体(101)电绝缘，其中所述互连(111)与所述第一导体(102)和所述第二导体(103)相对，所述互连的一端在所述第一开口(105)的边缘处与所述第三导体(101)电连接，并且所述互连的另一端形成为开路端。

Internally shielded energy conditioner

一种能量调节装置结构，其包含：第一电极(120)、第二电极(80)、和提供电路中改进的能量调节的屏蔽结构(70、110、150)。该结构可以作为集成电路中的分立元件或部分存在。该能量调节装置结构中的屏蔽结构不与任何电路元件电连接。

Wiring structure and joint box including the same

Panel of PCB

기판 판넬이 개시된다. 클램프 접점과, 상기 클램프 접점과 이격된 거리에서 형성된 버스 라인과, 상기 버스 라인을 통로로 전류를 공급받는 복수의 기판 유닛을 포함하는 기판 판넬에 있어서, 상기 클램프 접점과 상기 버스 라인 사이에는 전류가 흐르지 않는 절연부가 형성된 것을 특징으로 하는 기판 판넬이 제공된다. A substrate panel is disclosed. A substrate panel comprising a clamp contact, a bus line formed at a distance apart from the clamp contact, and a plurality of substrate units receiving current through the bus line as a passage, wherein a current is generated between the clamp contact and the bus line. There is provided a substrate panel characterized in that an insulating portion is formed which does not flow. 기판 판넬, 클램프, 버스 라인 Board Panels, Clamps, Bus Lines

Printed circuit board

印刷电路板的接地层中形成有槽部,使得位于印制在印刷线路板上的通信线路下面。在槽部和外部连线端之间设置电容器。通过在通信线路中流动的共模电流对各槽部产生量值相等而方向相反的两个磁通量组分。这些两个磁通量组分彼此抵消,以降低共模噪声值。

Tape distribution substrate with EMI-improved pattern

EMI 가 개선된 패턴을 구비한 테이프 배선기판을 개시한다. 테이프 배선기판은 반도체 칩이 실장되는 칩실장부를 구비하는 베이스 필름; 및 상기 베이스 필름상에 배열되어, 상기 칩실장부의 상기 반도체 칩으로 서로 반대의 위상을 갖는 신호쌍을 각각 제공하는 제1배선라인과 제2배선라인을 구비하는 다수의 배선라인쌍을 포함한다. 상기 각 배선라인쌍의 상기 제1배선라인과 상기 제2배선라인은 상기 칩실장부에 접하는 제1부분, 상기 칩실장부와 이격된 제2부분 및 상기 제1부분과 제2부분사이의 제3부분으로 구분된다. 상기 각 배선라인쌍의 상기 제1배선라인과 상기 제2배선라인은 제1부분사이의 제1간격이 상기 제2부분사이의 제2간격보다 크게 되도록 배열된다.

Biaxially oriented copolyester film and laminates thereof

Disclosed is a biaxially-oriented polyester film produced from a polyester comprising: (1) diacid residues comprising between about 95 and about 100 mole percent of terephthalic acid residues; (2) diol residues comprising between about 95 and about 100 mole percent of 1,4-cyclohexanedimethanol residues; and (3) about 0.5 to about 5 mole percent of another dicarboxylic acid or diol residue, wherein the polyester comprises a total of 100 mole percent diacid residues and a total of 100 mole percent diol residues. In one embodiment, the biaxially-oriented film has a thickness of 70 to 150 microns (3-5 mils). In another embodiment, the biaxially-oriented film undergoes not more than 3% shrinkage when immersed for 10 seconds in a solder bath preheated to 260° C. The film can be made by stretching an essentially amorphous cast film of thickness between about 450-1800 micron (18-70 mil) at a ratio from about 2.5×2.5 to 3.5×3.5 while being held at a temperature between 90° C. and 130° C., and heat-setting the stretched film at an actual film temperature of from 260° C. to Tm, where Tm is the melting point of the polyester as measured by differential scanning calorimetry (DSC), while maintaining the dimensions of the stretched film.

Multilayered wiring structure and method of manufacturing the same

다층배선구조체는 하부 배선층, 중간 절연층, 충전층, 상부 배선층, 및 도금층을 포함한다. 하부 배선층은 절연층을 통해 리드프레임상에 형성된다. 중간 절연층은 하부 배선층상에 형성되고 하부 배선층의 상부를 노출시키도록 소정 영역에서 비아홀을 갖는다. 충전층은 도전성 재료로 이루어지고 비아홀을 충전시킨다. 상부 배선층은 중간 절연층상에 형성되고 비아홀이 형성되어 있는 영역 상부에 개구부를 갖는다. 도금층이 상부 배선층상에 형성되어 충전층상에 접속된다. 다층배선구조체의 제조방법이 또한 개시된다. The multilayer wiring structure includes a lower wiring layer, an intermediate insulating layer, a filling layer, an upper wiring layer, and a plating layer. The lower wiring layer is formed on the lead frame through the insulating layer. The intermediate insulating layer is formed on the lower wiring layer and has via holes in predetermined regions to expose the top of the lower wiring layer. The filling layer is made of a conductive material and fills the via holes. The upper wiring layer is formed on the intermediate insulating layer and has an opening on the region where the via hole is formed. A plating layer is formed on the upper wiring layer and connected to the filling layer. Also disclosed is a method of making a multilayer wiring structure.

Printed wiring board with conductive constraining core including resin filled channels

인쇄 배선 기판 및 인쇄 배선 기판을 제조하는 방법을 개시한다. 본 발명의 일 측면에서, 인쇄 배선 기판은 적어도 하나의 수지가 충전된(resin filled) 채널을 가지는 도전성(electrically conductive)의 억제 코어(constraining core)를 포함한다. 수지로 충전된 채널은 전기적 분리 및 제조 수율의 증가와 연관될 수 있는 다양한 역할을 수행한다. 인쇄 배선 기판, 수지로 충전, 채널, 억제 코어

Circuit substrate having semiconductor chip

반도체 칩을 갖는 회로 기판은 상면, 상기 상면과 연결된 측면 및 상기 상면 상에 배치된 본딩 패드를 갖는 반도체 칩, 상기 본딩 패드 상에 배치되며 상기 본딩 패드로부터 지정된 높이로 돌출된 범프, 상기 반도체 칩의 상기 상면 및 상기 측면을 덮고 상기 범프의 단부를 노출하는 리세스부를 갖는 기판 몸체, 상기 기판 몸체 상에 배치되며 일부분은 상기 범프와 마주하고 나머지 부분은 상기 범프를 노출하는 개구를 갖는 배선 및 상기 개구를 통해 노출된 상기 범프 및 상기 배선을 물리적 및 전기적으로 연결하는 보강 부재를 포함한다. A circuit board having a semiconductor chip includes a semiconductor chip having an upper surface, a side surface connected to the upper surface, and a bonding pad disposed on the upper surface, a bump disposed on the bonding pad and protruding to a predetermined height from the bonding pad, A substrate body having a recess portion covering the upper surface and the side surface and exposing an end of the bump, a wiring disposed on the substrate body, the wiring having an opening facing a part of the bump and the other part exposing the bump and the opening It includes a reinforcing member for physically and electrically connecting the bump and the wiring exposed through.

Signal transmission system, connector device, electronic device and signal transmission method

FIELD: radio engineering and communications. SUBSTANCE: invention relates to a signal transmission system. Signal transmission system includes a first connector device and a second connector device, which is connected to first connector device. First connector device and second connector device are connected together to form an electromagnetic field connection module and signal - transmission object is converted into a radio signal, which is then transmitted through electromagnetic field connection module between the first connector device and second connector device. EFFECT: technical result is improvement of transmission speed and capacity due to a novel structure for implementation of interfaces of connecting signals, such as video signal and computer image. 27 cl, 29 dwg РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2 591 176 C2 (51) МПК H04L 12/02 (2006.01) H04B 5/02 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ (21)(22) Заявка: ИЗОБРЕТЕНИЯ К ПАТЕНТУ 2012147774/08, 11.05.2011 (24) Дата начала отсчета срока действия патента: 11.05.2011 Приоритет(ы): (30) Конвенционный приоритет: (72) Автор(ы): КИКУТИ Хидеказу (JP), МОГИ Такаюки (JP), АКИЯМА Ёсиюки (JP), КАВАМУРА Хирофуми (JP) (43) Дата публикации заявки: 20.05.2014 Бюл. № 14 R U (73) Патентообладатель(и): СОНИ КОРПОРЕЙШН (JP) 18.05.2010 JP 2010-114123 (45) Опубликовано: 10.07.2016 Бюл. № 19 (85) Дата начала рассмотрения заявки PCT на национальной фазе: 09.11.2012 2 5 9 1 1 7 6 (56) Список документов, цитированных в отчете о поиске: US 2006/159158 A1, 20.07.2006. WO 2009/048063 A1, 16.04.2009. RU 2 293 443 C2, 20.07.2005. RU 2 341 903 C2, 20.12.2008. RU 2 236 759 C1, 20.09.2004. (86) Заявка PCT: 2 5 9 1 1 7 6 R U C 2 C 2 JP 2011/060824 (11.05.2011) (87) Публикация заявки PCT: WO 2011/145491 (24.11.2011) Адрес для переписки: 109012, Москва, ул. Ильинка, 5/2, ООО "Союзпатент" (54) СИСТЕМА ПЕРЕДАЧИ СИГНАЛА, УСТРОЙСТВО РАЗЪЕМА, ЭЛЕКТРОННОЕ УСТРОЙСТВО И СПОСОБ ПЕРЕДАЧИ СИГНАЛА (57) Реферат: ...

Production method of suspension board with circuit

提供带电路悬挂基板的制造方法，该方法能减少工时数和繁杂的工序，形成接地端子，并降低制造成本。即，在金属基板2上，形成在接地端子13的形成位置有基层开口部3的基底绝缘层4，在基层开口部3内的金属基板2和基底绝缘层4的上形成金属薄膜5，在该金属薄膜5的上面形成导体图形。在基底绝缘层4上形成覆盖导体图形7，并且有与基层开口部3对向的覆盖开口部8的覆盖绝缘层9。在金属基板2上，形成露出基层开口部3和其周围基底绝缘层4的基板开口部11，经由导体图形7供电，在覆盖开口部8内的导体图形7的两面形成电镀层12，为使电镀层12与金属基板2电通电，在基板开口部11内形成金属填充层14。

Printed wiring board

Printed circuit board

一种印刷电路板，包括一介质层及一设置在所述介质层下方的参考层，所述介质层上设置有传输线及连接所述传输线的用于焊接一电子元件的焊盘，所述参考层上对应所述电子元件的位置开设有一外围轮廓呈平滑曲线的挖空区域，所述挖空区域呈中心对称，其中心对应所述电子元件的中心，所述挖空区域的垂直于所述两段传输线方向的最长距离的长度为： 其中W pad 为所述焊盘的宽度；W trace 为所述两段传输线的宽度；T为所述焊盘的厚度。上述印刷电路板大大减少了其上传输信号时产生的反射现象，进而提高了信号的完整性。

The manufacture method of charged road hanging base board

提供带电路悬挂基板的制造方法，该方法能减少工时数和烦杂的工序，形成接地端子，并降低制造成本。即，在金属基板2上，形成在接地端子13的形成位置有基层开口部3的基底绝缘层4，在基层开口部3内的金属基板2和基底绝缘层4的上形成金属薄膜5，在该金属薄膜5的上面形成导体图形。在基底绝缘层4上形成覆盖导体图形7，并且有与基层开口部3对向的覆盖开口部8的覆盖绝缘层9。在金属基板2上，形成露出基层开口部3和其周围基底绝缘层4的基板开口部11，经由导体图形7供电，在覆盖开口部8内的导体图形7的两面形成电镀层12，为使电镀层12与金属基板2电通电，在基板开口部11内形成金属填充层14。

Tab tape for tape carrier package

A TAB(Tape Automated Bonding) tape for a TCP(Tape Carrier Package) is provided to prevent the generation of short between adjacent metal lines by distributing the stress converged to a connection portion between first and second leads using a predetermined hole structure. A base film has a chip mounting region for loading a semiconductor chip. A metal line pattern is formed on the base film. The metal line pattern is composed of a plurality of first leads(130), a plurality of second leads(140) and a plurality of connection portions(150) for connecting the first and second leads with each other. A first hole(160) for exposing the base film to the outside is formed on the shortest connection portion and the second lead connected with the shortest connection portion. A second hole is formed at a predetermined portion adjacent to a boundary between the shortest connection portion and the first lead connected with the shortest connection portion.

Wiring circuit board assembly

Hybrid surface mount and pin thru hole circuit board

A multi-layer circuit board is disclosed. The circuit board comprises a plurality of conductive planes; a plurality of plated through hole sets, each set comprising one or more plated through holes, none to all of the plated through holes of each set contacting at least one the conductive plane; a thermal break formed around each plated through hole in each conductive plane to which the plated through hole is connected; and one or more thermal vents, in the vicinity of each plated through hole in each conductive plane to which the plated through hole is connected. Additionally, surface mount technology pads are provided on a top surface of the circuit board.

Wired circuit board

本发明揭示一种为了提供能利用简易组成在金属支撑衬底上形成的开口部的边缘使金属支撑衬底的贴合性提高从而防止金属支撑衬底剥离的布线电路板，在带电路悬置底板中，为了减小导体图案的传输损耗，将埋在基底绝缘层内的金属箔形成为具有第1金属箔部分和隔开间隙地包围第1金属箔部分的第2金属箔部分的图案，并且在金属支撑衬底形成开口部，使其开口边缘配置在间隙中。

Production method of suspension board with circuit

为了提供可以既实现工序和人工的减少、又形成接地端子接地、减低制造成本的带电路的悬挂基板的制造方法，在金属支持基板上，形成基底绝缘层，并形成有基底开口部，在基底绝缘层上形成由接地配线和信号配线构成的导体布图，在基底绝缘层上形成被覆导体布图的被覆绝缘层，并形成有第1被覆开口部和第2被覆开口部。然后，从接地配线供电，在从第1被覆开口部暴露出来的接地端子的表面和从第2被覆开口部暴露出来的接地部的表面形成电镀层后，在基底开口部内形成金属填充层，使接地部与金属支持基板导通。

Method and apparatus of changing pcb pad structure to increase solder volume and strength

The present disclosure is directed at an apparatus for changing printed circuit board pad structure to increase solder volume and strength. The invention provides increased end row pad and lead size and utilizes a plurality of lead-to-pad and pad-to-lead conforming geometric structures to form a joint providing additional solder surface adhesion area.

Innovative solder ball pad structure to ease design rule, methods of fabricating same and substrates, electronic device assemblies and systems employing same

A solder ball pad is provided for mounting and connecting of electronic devices and, more particularly, apparatus and methods are disclosed providing an improved solder ball pad structure on a substrate, such as a printed circuit board (“PCB”) or a semiconductor die, while enabling better use of the spaces between adjacent solder ball pads, and at the same time providing increased surface area for bonding to a solder ball. More particularly, the inventive solder ball pad structure comprises a terminal pad exposed through an aperture in an insulative mask having a bond pad layer comprising at least another metal layer formed over, at most, a portion of the exposed portion of the terminal pad. Methods of manufacture and substrates incorporating same are also disclosed.

Method and apparatus of changing PCB pad structure to increase solder volume and strength

The present disclosure is directed at an apparatus for changing printed circuit board pad structure to increase solder volume and strength. The invention provides increased end row pad and lead size and utilizes a plurality of lead-to-pad and pad-to-lead conforming geometric structures to form a joint providing additional solder surface adhesion area.

Scalable high-bandwidth connectivity

휴대용 저장 디바이스들 및 메모리 모듈들을 위한 확장 가능한, 고-대역폭 접속성 구조는 인쇄 회로 기판들 같이 평면의 표면들 상에 다양한 이차원적인 및 삼차원적인 구성들로 장착된 EHF 통신 링크 칩 패키지들을 활용할 수 있다. 카드 같은 디바이스들의 주된 표면들 상에 분포된 디바이스들 사이에 많은 전자기 통신 링크들에는 각각의 디바이스 상에 개별적으로 정렬된 통신 유닛들의 쌍들이 제공될 수 있다. 인쇄된 회로 기판 상에 인접한 통신 유닛들은 선형 또는 타원형 분극 같은, 다른 분극을 구비하는 전자기 방사선을 송신하거나 수신할 수 있다. 통신 디바이스들 사이에 전력 및 통신은 모두 무선으로 제공될 수 있다. An expandable, high-bandwidth connectivity architecture for portable storage devices and memory modules can utilize EHF communication link chip packages mounted in various two-dimensional and three-dimensional configurations on planar surfaces such as printed circuit boards . Many electromagnetic communication links between devices distributed on the major surfaces of devices such as cards may be provided with pairs of individually aligned communication units on each device. Adjacent communication units on a printed circuit board can transmit or receive electromagnetic radiation having different polarization, such as linear or elliptical polarization. Both power and communication between communication devices can be provided wirelessly.

Manufacturing method of multi-layer circuit board

一种多层电路板制作方法，包括步骤：提供第一覆铜板，第一覆铜板具有成型区域以及包围成型区域的边缘区域；对第一覆铜板的边缘区域进行蚀刻以形成至少一个同心铜环组，该至少一个同心铜环组包括第一铜环和环绕第一铜环的第二铜环，第一铜环的圆心定义为初始中心；提供第二覆铜板和粘合层，并将粘合层热压合于第一覆铜板与第二覆铜板之间，从而形成多层基板；以该初始中心为圆心制作贯穿第一覆铜板、粘合层与第二覆铜板的检测孔；利用光线照射多层基板，从而获得检测孔与同心铜环组的相对位置关系以确定检测孔偏离初始中心的偏位误差；根据该偏位误差确定多层基板热压合后的涨缩比例，并根据该涨缩比例确定多层基板开设导通孔的位置。

Structural body and wiring substrate

互いに少なくとも一部が対向する第１導体（１０２）および第２導体（１０３）と、第１導体（１０２）および第２導体（１０３）に挟まれ、少なくとも一部が第１導体（１０２）および第２導体（１０３）と対向し、かつ、第１開口（１０５）を有する第３導体（１０１）と、第１開口（１０５）の内部に設けられた配線（１１１）と、第１導体（１０２）および第２導体（１０３）と電気的に接続され、かつ、第３導体（１０１）と電気的に絶縁された導体ビア（１２１）とを備え、配線（１１１）は、第１導体（１０２）および第２導体（１０３）と対向し、その一端が第１開口（１０５）の縁で第３導体（１０１）と電気的に接続され、他端が開放端となっていることを特徴とする構造体。

Soldering micro-components onto printed circuits - using liq. heated to above solder m.pt. to heat substrate

Method of soldering microcomponents onto a printed circuit consisting of a substrate having at least one surface metallised then engraved, comprises (a) electrolytic deposition of an alloy forming the solder onto the metal parts of the printed circuit, (b) placing the microcomponents of the circuit normally or automatically onto the circuit, (c) melting the solder alloy metal using a liq. heated to a temp. above the melting point of the joint and placing the liq. in contact with the part of the circuit not contg. any microcomponents. The solder metal can be deposited in uniform thickness at every joint to be made, thus improving the packing density and ensuring improved yield of joints, made automatically. The components are not over heated, either individually or overall, avoiding destruction or deterioration occurring in prior art.