CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRCUIT BOARD
The present invention refers to circuit board and, relates to manufacturing method for the preparation of polyolefins having a. Patent document 1 the, disclosure for manufacturing method of multi-layered circuit board metal base of wet liquid to flow down. The manufacturing method is, one surface of the first insulating adhesive lamianated the conductors interposed material and a step for circuit, said conductor circuit on insulating number 2 for circuit via an adhesive layer has a process of bonding an conductor layer. Insulating core pattern on a substrate and forming copper plate which are bonded at one end to, then the component on the pattern forming copper plate is possible reflow soldering. In in this case, insulating core board between the copper plate, both bonding failure; if there is a gap as an antioxidant, slop is given during mounting reflow component under a high temperature environment, said gap said presence a gas by expanding a 2000 the rotor has a semi-circular gap. The insulating core from a substrate is by in puffiness copper delamination and presses the.. The aim of the present disclosure, insulating core board and a metal plate and to give due from the nip between material capable of inhibiting the detachment of metal plate provides a circuit board on which it can be by a rope.. In addition it is intended to provide a manufacturing method for the preparation of polyolefins having a. The present disclosure in one aspect, as therein electronic part is mounted, insulating core board and, having patterned metal plate is board. Said insulating core and to at least one side of the same to said metal plate pieces 17 are mounted. Said insulating core board and said metal plate laminate configured gas vent ball (gas-vent hole) is formed. Present between said insulating core board and said metal plate a gas, is given during mounting of electronic components expands said said gas vent hole to the atmosphere through open-sided light thus passed passes to the, said gas vent and selects is formed. Core board insulating when by bonding a metal plate to, insulating core board and a metal plate and to give by forming a gap between a signal, in addition of mounting electronic component in which when a gas present in a gap from being raised in temperature to tried is rotatively. However, according to this structure, said gas, ., it is dequeued to vent gas. In short gap present a gas, gas is exhaust gases are discharged into the atmosphere through the vent hole. Thereby, insulating core board and a metal plate and to give due from the nip between exfoliation of metal plate is prevented from being.. In one aspect, said gas vent and selects, both said insulating core board and said metal plate through the through hole number 1. In one aspect, said gas vent and selects, said insulating core board and said metal plate, and at least one adhesive of each other is formed a groove. In one aspect, said insulating core board on both sides of the, said a metal plate, the plate 1 and the pattern pair of conductors, said further circuit board is formed of said number 1 is so simple and easy to assemble by filled with said 1 pair of conductors for electrically connecting pattern has the conductors are. According to this structure, each gluing the insulating core on the two faces of a substrate a metal plate, the plate 1 pair of conductors for electrically connecting pattern plating when. is not required. In one aspect, said further circuit board is formed of said laminate is adhered a heat members are formed with the same width. According to this structure, metal plate and core board insulating the optical package comprises a laminate is, since the is bonded to the heat radiation member, heat is generated in electronic component may, heat generated is dissipating heat from the heat radiating member. In one aspect, said circuit board is formed of further, a heat radiation member said number 2 and a vent gas, a heat dissipation member said said laminate a gas present between said is given during mounting of electronic components when expanded, said number 2 gas said gas vent hole to the atmosphere through open-sided light thus passed passes to the, said number 2 is formed and selects vent gas. Heat radiation member, and a stacked body to be adhered by to, a heat dissipation member laminate by forming a gap between a signal, in addition electronic part is mounted when a gas present in a gap from being raised in temperature to tried is rotatively. However, according to this structure, said gas, heat radiation member is formed in a gas vent to ., it is dequeued. Thereby, after heat radiation is prevent harmful components from being. In one aspect, the core board insulating said number 1 number 2 surface and having stabilized, and the metal plate said surface said number 1, said number 2 surface, spacer stacked an insulative substrate is a parts, said electronic component, said component a dielectric substrate and the embedded in and between spacers, said gas vent and selects, number 2 an core insulating material, said conductive is so simple and easy to assemble, said further circuit board is formed of said patterns of electrical conductors said electronic element for electrically connecting at least one said number 2 has conductive material that the product that is being charged is so simple and easy to assemble. According to this structure, an insulating core is so simple and easy to assemble; and a conductive material by filling the number 3, electronic component, conductor pattern a metal plate, the plate can be electrically connected to. Therefore, circuit board is formed of. miniaturized. In one aspect, copper plate, in which said metal plate. By another aspect of the present disclosure, it is intended to provide a manufacturing method for the preparation of polyolefins having a. The manufacturing method, insulating core board and a metal plate and to give and is stacked; said insulating core board and said metal plate by so as to press the pressing member, said said insulating core substrate is bonded to the metal plate, the plate, and an vent gas in addition; of mounting electronic component with the identification of said metal plate; said insulating core board and said metal plate a gas present between, said is given during mounting of electronic components when expanded, said gas, said gas vent to photo has to the Vcc/2 generator. According to method is, insulating core board and a metal plate and to give exist between the gas is given during mounting of the electronic parts when expanded, to vent the gas gas said photo ., it is dequeued side. Therefore, insulating core board and a metal plate and to give due from the nip between exfoliation of metal plate is prevented from being.. The present disclosure other features of advantage and, the growth of hematopoietic stem cell, hereinafter this disclosure features of associated to describe the drawing will clearly by. The present disclosure are believed to be novel feature, in particular, based on a text content of the quite plain that he in the following is claimed. The aim flue gas with a high reactivity involving the present disclosure a, hereinafter in point current which indicates to description of a preferred embodiment based on a text content of the form by referring to with drawing, is it will be appreciated. Figure 1 shows a device form number 1 embodiment also is the stoppers. Figure 2 shows a manufacturing method of electronic apparatus to explain the retaining steps is also of Figure 1. Figure 3 shows a device form number 2 embodiment also is the stoppers. Figure 4 shows a manufacturing method of electronic apparatus to explain the retaining steps is also of Figure 3. Figure 5 shows a device form number 3 embodiment also is the stoppers. Figure 6 shows a manufacturing method of electronic apparatus to explain the retaining steps is also of Figure 5. Is predicted from another Figure 7 shows a device to variations is the stoppers. (Form number 1 embodiment) Hereinafter, the present disclosure a embody a number 1 embodiment, also according to 1 and 2 is described. Also 1 as shown in the, electronic apparatus (10) has the circuit board (20) is provided with, circuit board (20) the wiring board, (30) comprises an ultra-. Wiring board (30) the, surface mounted component may as electronic component (80) line electrodes are mounted in. Wiring board (30) in, insulating core board (40) on, number 1 metal plate as copper plate (50), insulating core board (60), number 2 metal plate as copper plate (70) are provided in multilayer. Copper plate (50) pipe with opened center ([...]) from the processing of poultry, a desired patterned in shape comprises isopropyl alcohol vapor and nitrogen gas, conductor pattern (51) is formed. The same, copper plate (70) is of punching out a desired other patterned in shape comprises isopropyl alcohol vapor and nitrogen gas, conductor pattern (71, 72) is formed. As such, insulating core board (40) slop upper surface of the one side of the same, patterned copper plate (50) is bonded to the other. Copper plate (50) one side of the same in short upper surface of the, insulating core board (60) is bonded to the other. Insulating core board (60) slop upper surface of the one side of the same, patterned copper plate (70) is bonded to the other. Insulating core board (40) and copper plate (50) dielectric core board (60) and copper plate (70) the, laminate is bonded together, thus presses together with. In short, electronic apparatus (10) is designed to be supported-on the (not shown), also 2 as shown in the, insulating core board (40), adhesive sheet (not shown), copper plate (50), adhesive sheet (not shown), insulating core board (60), adhesive sheet (not shown), copper plate (70) is, which are laminated in this order. Insulating core board (40), adhesive sheet, copper plate (50), adhesive sheet, insulating core board (60), adhesive sheet, copper plate (70) the, their on and to achieve the pressing member is adhesive by pressing the in addition. The direction of the right, or the left in addition, municipal for the sake of convenience in something, electronic this direction (10) is disposed on the not limited to. Patterned copper plate (70) on the electronic component (80) is is mounted. Electronic component (80) the, solder (81, 82) projecting the patterned copper plate (70) is joined to a. Specifically, patterned copper plate (70) which are a part of the conductor pattern (71) and an electronic component (80) the, soldered together in contact with the, patterned copper plate (70) another part of the conductor pattern (72) and an electronic component (80) the, soldered together electrically connected to. the present embodiment in wiring board (30) as, thick copper substrates is carried out by using an acidulous. Insulating core board (40) and copper plate (50) dielectric core board (60) and copper plate (70) in the optical package comprises a laminate (S1) the, copper plate (50) dielectric core board (60) and copper plate (70) through the through hole as gas-vent ball (gas-vent hole) (90, 91) is formed. Number 1 through hole as through hole (90, 91) the, solder reflow process, functioning as a gas vent ball. In short, insulating core board (40) and copper plate (50) or gap as porosity formed between the, copper plate (50) dielectric core board (60) or gap as porosity formed between the, insulating core board (60) and copper plate (70) as porosity formed between the through hole to the rotor has a semi-circular gap (90, 91) the inhibit. In embodiment comprises the processes of forming a cut, gas vent and selects, insulating core board (60) and copper plate (50, 70) a through hole through the (90, 91) is. Yet, copper plate (50) dielectric core board (60) and copper plate (70) through the a through hole (91) inside the, solder as conductive material (92) filled with. Solder (92) the, patterned copper plate (50) which are a part of the conductor pattern (51) and patterned copper plate (70) which are a part of the conductor pattern (72) turning each other. In hereinafter, said electronic apparatus (10) is WIPO. In process for fabricating of lamination-pressing, combined with control the speed of the, also 2 as shown in the, insulating core board (40), adhesive sheet, copper plate (50), adhesive sheet, insulating core board (60), adhesive sheet, and copper plate (70) is, which are laminated in this order (lamination process). And, in-low temperature to high temperature, their on and to achieve the pressing member by pressing the in addition, insulating core board (40) is copper plate (50) which are bonded at one end to, copper plate (50) to the insulating core board (60) which are bonded at one end to, insulating core board (60) is copper plate (70) is bonded to the through hole as ball vent gas (90, 91) is formed (substrate forming process). Slop in-low temperature to high temperature, insulating core board (40) with a copper plate (50) is bonded to the to, in addition copper plate (50) of each of core board (60) is bonded to the to, insulating core board (60) with a copper plate (70) by bonding a, through hole (90, 91) are formed.. Insulating core board (40) and copper plate (50) of adhesive of each other and, copper plate (50) dielectric core board (60) of adhesive of each other and, insulating core board (60) and copper plate (70) of the adhesive of each other, insulating core board (40), adhesive sheet, copper plate (50), adhesive sheet, insulating core board (60), adhesive sheet, and copper plate (70) and to achieve the pressing member on by pressing the is embodiment in addition. At this time, insulating core board (40) and copper plate (50) or a gap is formed between the, copper plate (50) dielectric core board (60) or a gap is formed between the, insulating core board (60) and copper plate (70) a or a gap is formed between the. Their the gap is, between core board insulating plate copper occur because of the bonding failure ;.. As of the electronic component (80) for mounting step, copper plate (70) applied on solder paste, solder reflow furnace ([...]) body in its cross section is composed of. Solder paste for example, in its cross section is composed of high-temperature 250 °C. At this time, insulating core board (40) and copper plate (50) present in the gap defined between the gas or, copper plate (50) dielectric core board (60) present in the gap defined between the gas or, insulating core board (60) and copper plate (70) present in the gap defined between the reads the data in the is rotatively gas, through hole as ball vent gas (90, 91) is, it is dequeued. (gas vent process). Thereby, insulating core board (40) and copper plate (50) or the gap defined between the, copper plate (50) dielectric core board (60) or the gap defined between the, insulating core board (60) and copper plate (70) the gap defined between the rotor has a semi-circular elements.. As a result, copper plate (50, 70) suffering exfoliation of prevented from undergoing the, insulating core board (40) and copper plate (50) adhesion between, copper plate (50) dielectric core board (60) adhesion between, insulating core board (60) and copper plate (70) to improve the adhesion between. Yet, through hole (91) to, in soldering process, solder (92) for filling the. Thereby copper plate (50) by conductor pattern (51) and copper plate (70) by conductor pattern (72) can take conduction layers i.e. between. The resulting structured materials, according to one embodiment, hereinafter may yield an identical. (1) circuit board (20) of the whole bellows structure, insulating core board (40, 60) surface of patterned copper plate (50, 70) and is bonded to the other, core board insulating include a broad definition (40, 60) to at least one side of the same, patterned copper plate (50, 70) and is bonded to the other, electronic component (80) line electrodes are mounted in. Also, insulating core board (40, 60) and copper plate (50, 70) by a laminate core board insulating in (S1) (40, 60) and copper plate (50, 70) exist between the gas the electronic parts (80) when expanded is given during mounting of, photo gas said gas-vent, it is dequeued side through hole as ball (90, 91) are formed at the. In short, is a embodiment, insulating core board (40, 60) and copper plate (50, 70) in a stacked state in which when a press and which is gas vent structure. An editing unit switches the first, is a embodiment, insulating core board (40, 60) and copper plate (50, 70) in the optical package comprises a laminate (S1) when a press is gas vent structure. Therefore, insulating core board (40, 60) is copper plate (50, 70) when is adhered to a, insulating core board (40) and copper plate (50) even a gap is formed between the, also copper plate (50) dielectric core board (60) even a gap is formed between the, yet insulating core board (60) and copper plate (70) even a gap is formed between the, is as follows. Electronic component (80) bonding, when packaging a gap from being raised in temperature a gas present in the chamber allow the member to purchase, is rotatively, said gas, through hole (90, 91) through the free surfaces pulled out from a the gap. Thereby, insulating core board (40, 60) and copper plate (50, 70) caused by from the nip between copper plate (50, 70) is prevent harmful components from being. In short thick copper substrates in, copper plate (50, 70) dielectric core board (40, 60) (S1) by through hole to a laminate (90, 91) by forming a, gas vent structure is is established. Therefore, solder reflow low hour insulating core board (40, 60) from copper plate (50, 70) is prevent harmful components from being. As a result, adhesion. the center of the cylinder. (2) insulating core board (60) both sides of which are bonded at one end to, in addition patterned copper plate (50, 70) in conductor pattern (51, 72) each, through hole (91) conductive materials with the solder (92) by filled with, been electrically connected. Therefore, insulating core board (60) both sides of which are bonded at one end to, in addition patterned copper plate (50, 70) in conductor pattern (51, 72) for electrically connecting plating process. is not required. (3) the manufacturing method for the preparation of polyolefins having a, lamination process and the substrate forming step for step of vent and gas mounting process. In lamination process, insulating core board (40, 60) and copper plate (50, 70) is layered on one surface of the. Substrate forming process, said insulating core board (40, 60) and said metal plate (50, 70) by compression of pressing member on, insulating core board (40, 60) with a copper plate (50, 70) by bonding a, through hole as ball vent gas (90, 91) is formed on. In mounting process, copper plate (70) electronic component (80) mounted. Gas vent step, insulating core board (40, 60) and copper plate (50, 70) exist between the gas the electronic parts (80) when expanded is given during mounting of, said gas, through hole as ball vent gas (90, 91) through ., it is dequeued side photo. Therefore, insulating core board (40, 60) and copper plate (50, 70) between core board an insulating due from the nip (40, 60) from copper plate (50, 70) is prevent harmful components from being. (Form number 2 embodiment) A hereinafter, form number 2 embodiment described about difference with a form number 1 embodiment. Also 1 and a relative, number 2 embodiment form is configured which indicates to Figure 3. In 3 also, electronic apparatus (11) the, aluminum sink (100) and, heat sink (100) mounted on a circuit board on which it (20) comprises an ultra-. Electronic component (80) on the, circuit board (20) through the heat sink is in a non-woven fabric is covered laminate (S1) (100). escape from the. Heat sink (100) on the upper surface of the insulating core board (40) is bonded to the other. Heat sink (100) dielectric core board (40) and copper plate (50) dielectric core board (60) and copper plate (70) laminated by the compression tool to 2000. In short, electronic apparatus (11) is designed to be supported-on the (not shown), also as shown in the 4, heat sink (100), number 1 adhesive sheet (not shown), insulating core board (40), number 2 adhesive sheet (not shown), copper plate (50), number 3 adhesive sheet (not shown), insulating core board (60), adhesive sheet, copper plate (70) is, which are laminated in this order. Heat sink (100), adhesive sheet, insulating core board (40), adhesive sheet, copper plate (50), adhesive sheet, insulating core board (60), adhesive sheet, copper plate (70) the, their from above and to achieve the pressing member is adhesive by pressing the in addition. Heat sink as heat radiation member (100) the, number 2 as ball vent gas through hole (101, 102) heat sink (100) is formed through the. Next, and through hole (101, 102) corresponding to a through-hole through which an heat sink (100) to electronic apparatus composed as a mask so as to form a (11) relates to action of. In process for fabricating of lamination-pressing, combined with control the speed of the, also as shown in the 4, heat sink (100), adhesive sheet, insulating core board (40), adhesive sheet, copper plate (50), adhesive sheet, insulating core board (60), adhesive sheet, copper plate (70) is laminated descending order of. And, in-low temperature to high temperature, their from above and to achieve the pressing member by pressing the in addition, heat sink (100) to the insulating core board (40) which are bonded at one end to, insulating core board (40) is copper plate (50) which are bonded at one end to, copper plate (50) to the insulating core board (60) which are bonded at one end to, insulating core board (60) is copper plate (70) to 2000. As ball vent gas through hole (101, 102) is formed. In-low temperature to high temperature, through hole (90, 91) the, heat sink (100) of each of core board (40) for adhering keys to a and, insulating core board (40) with a copper plate (50) for adhering keys to a and, copper plate (50) of each of core board (60) is bonded to the to, insulating core board (60) with a copper plate (70) is formed by bonding a. At this time, heat sink (100) dielectric core board (40) or a gap is formed as a gap between, insulating core board (40) and copper plate (50) or a gap is formed as a gap between, copper plate (50) dielectric core board (60) or clearance is formed as a gap between, insulating core board (60) and copper plate (70) as a gap between is clearance is formed. As of the electronic component (80) in mounting process of, copper plate (70) applied on solder paste, solder reflow furnace body in its cross section is composed of. At this time, heat sink (100) dielectric core board (40) present in the gap defined between the reads the data in the is rotatively gas, said gas, gas vent ball as through hole (101, 102) ., it is dequeued through. The same, insulating core board (40) and copper plate (50) present in the gap defined between the gas or, copper plate (50) dielectric core board (60) present in the gap defined between the gas or, insulating core board (60) and copper plate (70) present in the gap defined between the reads the data in the is rotatively a gas, as co gas-vent these gases through hole (90, 91) ., it is dequeued through. As such electronic apparatus (11) in a gas presence gap, it is dequeued by to vent gas, heat sink (100) dielectric core board (40) or the gap defined between the, insulating core board (40) and copper plate (50) or the gap defined between the, copper plate (50) dielectric core board (60) or the gap defined between the, insulating core board (60) and copper plate (70) the gap defined between the rotor has a semi-circular elements.. As a result, insulating core board (40, 60) from copper plate (50, 70), heat sink (100) is prevented from being, manufacturing method of load.. In short, heat sink (100) dielectric core board (40) adhesion between, insulating core board (40) and copper plate (50) adhesion between, copper plate (50) dielectric core board (60) adhesion between, insulating core board (60) and copper plate (70) adhesion between. the center of the cylinder. For example laminate which is obtained by arranging an unfounded pressure by the press and has excellent adhesive to insufficient the rotor has a semi-circular penetrated by the of data are resolved the.. The resulting structured materials, according to one embodiment, hereinafter may yield an identical. (4) insulating core board (40, 60) and copper plate (50, 70) and laminate comprising by (S1) is, heat sink as heat radiation member (100) is bonded to the.. Therefore, electronic component (80) upon occurrence of in, heat sink heat (100) is primarily released in heat from. (5) heat sink as heat radiation member (100), laminate, exist between the gas the electronic parts (S1) (80) when expanded is given during mounting of, said gas-vent the Vcc/2 generator photo gas through hole as ball (101, 102) penetrating the body of the radiation plate (100) been formed. Thereby, heat sink (100), and a stacked body (S1) when is attached to the heat sink (100), laminate, by forming a gap between a signal (S1), electronic component in addition (80) a laminate (S1) when mount a gas present in a gap from being raised in temperature even tried is rotatively, said gas a heat spreader (100) formed on the through hole (101, 102) ., it is dequeued through. Therefore, laminate (S1) from heat sink (100) and is prevented from being, manufacturing method of load, heat sink (100) (S1), laminate, adhesion between. the center of the cylinder. (Form number 3 embodiment) Form number 3 embodiment a hereinafter, described about difference with a form number 1 embodiment. Also 1 and a relative, number 3 embodiment form is configured which indicates to Figure 5. In 5 also, electronic apparatus (12) the, insulating core board (40) dielectric core board (60) to be electrically connected to the component with a built mounted an electronic component (110) has. Insulating core board (40) dielectric core board (60) to be electrically connected to the component electronic component (110) at the periphery of, electronic component (110) thicker than spacer (120) is arranged. Spacer (120) such as to a plurality of copper patterns as shafts are conventionally implemented using a is even. Furthermore, electronic component (110) dielectric upper surface of core board (60) are formed in other as spacers thin plate material (130) is arranged. Thin plate material (130) the, insulating core board (60) is formed on the lower surface of 2000. Electronic component (110) the, core board insulating as insulating substrate a component (40) and thin plate material (130) which are embedded in the between. Thin plate material (130) the, both right and left sides of the electronic component for electrodes for the (110) for electric insulation are assured as a member, for example, use can be made of, adhesive. Insulating core board (40) on the upper surface of the, electronic component (110) and the spacer (120) is each bonded is. Spacer (120) on the upper surface of the, insulating core board (60) is bonded to the other. Insulating core board (40) and the spacer (120) and the electronic component (110) and thin plate material (130) and an insulating core board (60) and copper plate (70) the, laminated by the compression tool to 2000. In short, when the water is mounted on the, also 6 as shown in the, insulating core board (40), adhesive sheet, spacer (120), adhesive sheet, insulating core board (60), adhesive sheet, copper plate (70) is, which are laminated in this order, their from above by pressing the lowered pressing member of cycloolefin resin and, bonded therewith they. Or large on, also 6 as shown in the, insulating core board (40), adhesive sheet, electronic component (110), thin plate material (130), adhesive sheet, insulating core board (60), adhesive sheet, copper plate (70) is, which are laminated in this order, their from above by pressing the lowered pressing member, they of cycloolefin resin and, bonded therewith. Insulating core board (40) and the spacer (120) and an insulating core board (60) and copper plate (70) to a laminate (S2), spacer (120) and an insulating core board (60) and copper plate (70) number 2 as co gas-vent through the through hole (140, 141) is formed. Through hole (141) solder materials with the symbol generation (150) filled with. Solder (150) by, electronic component (110) of copper plate electrode number 1 (70) a conductor pattern that is configured (75) also at. Insulating core board (40) and the spacer (120) and an insulating core board (60) and copper plate (70) to a laminate (S2), spacer (120) and an insulating core board (60) through the a through hole (142) is formed. Through hole (142) the interior of, solder as conductive material (151) filled with. Solder (151) by, electronic component (110) of number 2 electrode, insulating core board (60) onto the upper surface of is exposed is taken out of the. As such, electronic component (110) in a substrate a configuration, in short insulating core board (40) dielectric core board (60) between electronic component (110) for that embeds an in the arrangement, through hole (141, 142) through electronic components by soldering (110) the is turned. A hereinafter, an electronic device the side sheet (12) described the action of. In process for fabricating of lamination-pressing, combined with control the speed of the, also 6 as shown in the, insulating core board (40), adhesive sheet, spacer (120), adhesive sheet, insulating core board (60), adhesive sheet, copper plate (70) is laminated descending order of. Or insulating core board (40), adhesive sheet, electronic component (110), thin plate material (130), adhesive sheet, insulating core board (60), adhesive sheet, copper plate (70) is laminated descending order of. And, the lowered member pressurized from thereon are pressed and achieving improved insulation core board (40) and, spacer (120), spacer (120) and an insulating core board (60), insulating core board (60) and copper plate (70) for, each bonded to. At this time, insulating core board (40) and the spacer (120) or clearance is formed as a gap between, spacer (120) and an insulating core board (60) or clearance is formed as a gap between, insulating core board (60) and copper plate (70) as a gap between is clearance is formed. The electronic component (110) the electrical connections of the step, applied solder paste solder reflow furnace body in its cross section is composed of. At this time, insulating core board (40) and the spacer (120) or the gap defined between the, spacer (120) and an insulating core board (60) or the gap defined between the, insulating core board (60) and copper plate (70) present in the gap defined between the reads the data in the is rotatively gas, said gas, gas vent ball as through hole (140, 141) ., it is dequeued through. Therefore, it is prevented that the rotor has a semi-circular gap to prevent the separation of the can be. Furthermore, insulating core board (40) and the spacer (120) adhesion and between, spacer (120) and an insulating core board (60) adhesion and between, insulating core board (60) and copper plate (70) adhesion between. the center of the cylinder. The resulting structured materials, , the present embodiment according to one, are obtained is identical hereinafter. (6) insulating core board (60) of number 1 surface, for example on the upper surface patterned copper plate (70) pieces 17 are mounted. Insulating core board (60) of number 2 surface, for example on the lower surface spacer (120) devices through the predetermined, core board insulating as insulating substrate a component (40) is laminated. Said insulating core board (40) and said insulating core board (60) to be electrically connected to the component, electronic component (110) are embedded to. Insulating core board (60) through the a through hole (141), functioning as a ball vent a gas. Through hole (141) conductive materials with the solder (150) by filling the, electronic component (110) the, copper plate (70) a conductor pattern that consisting (75) is electrically connected to. Therefore, insulating core board (60) through the a through hole (141) conductive materials with the solder (150) by filling the, electronic component (110) the, copper plate (70) a conductor pattern that consisting (75) is electrically connected to. Due to this structure circuit board is formed of. can be reduced in size. Embodiment a, which are not of limited to standardize the, for example, .the formation of interference fringes embodied as follows. , Also 3 in heat sink (100) only one side of the same as upper surface of board (20) the arranged in the sections. However a embodiment, heat sink (100) on both sides as upper and lower surfaces of each board is even of each other disposed. , Gas vent through hole, for example of Figure 1 through hole (90, 91) instead, also 7 as shown in the, home (160, 161, 162) are combined by is.. Specifically, insulating core board (40) ([...]) bath concave on the upper surface of groove (160) is formed on. Home bath concave (160) ., it is dequeued a by a predetermined interval. Insulating core board (60) in home bath concave lower surface (161) by forming a, concave home bath (161) ., it is dequeued a by a predetermined interval. Insulating core board (60) in home bath concave on the upper surface (162) by forming a, concave home bath (162) ., it is dequeued a by a predetermined interval. In short, insulating core board (40, 60) and copper plate (50, 70) (S1) having the optical package comprises a laminate in a embodiment, home as ball vent gas (160, 161, 162) are each insulating core board (40, 60) and copper plate (50, 70) may is formed on the adhesive surface of is. Wherein, insulating core board (40, 60) and copper plate (50, 70) adhesive surface, are connected side photo. As such, gas vent and selects, insulating core board (40, 60) and copper plate (50, 70) of adhesive surface a lower groove (160, 161, 162) is even ear. Home (160, 161, 162) the, insulating core board (40, 60) rather than copper plate (50, 70) are combined by to.. Or grooves (160, 161, 162) an insulating core board (40, 60) and copper plate (50, 70) are combined by for both of a.. , Metal plate as copper plate (50, 70) are used. However, aluminum plate as the metal plate form embodiment metal sheet is another payload such as. may be used. , Of punching out projecting the patterned copper sheet, insulating core was adhere to the substrate. However, generally, copper thin before patterning adhere to the substrate core insulating plate after is dots patterned by etching. 10: electronic apparatus, 11: electronic apparatus, 12: electronic apparatus, 20: circuit board, 30: wiring board, 40: insulating core board, 50: copper plate, 60: insulating core board, 70: copper plate, 80: electronic component, 90: through hole, 91: through hole, 92: solder, 100: heat sink, 101: through hole, 102: through hole, 110: electronic component, 120: spacer, 140: through hole, 141: through hole, 160: home, 161: home, 162: home, S1: laminate, S2: laminate. A circuit board, onto which an electronic component is to be mounted, is provided with insulating core substrates and patterned metal plates. The metal plates are bonded to at least one side of the insulating core substrates. The insulating core substrates and the metal plates form a laminated body, in which a gas-vent hole is provided. The gas-vent hole is formed so that when the electronic component is mounted, the gas present between the insulating core substrates and the metal plates expands and is released to a side open to the atmosphere via the gas-vent hole. As therein electronic part is mounted, said circuit board is formed of, insulating core board and, having patterned metal plate, and to at least one side of the same to said insulating core, and the metal plate, said insulating core board and the laminate configured metal plate said, gas vent ball (gas-vent hole) is formed, said insulating core board and said metal plate a gas present between, is given during mounting of electronic components expands said said gas vent hole to the atmosphere through open-sided light thus passed passes to the, said gas vent and selects formed, circuit board. According to Claim 1, said gas vent and selects, both said insulating core board and said metal plate including through the through hole number 1, circuit board. According to Claim 1, said gas vent and selects, said insulating core board and said metal plate, and at least one adhesive of each other a a groove formed, circuit board. According to Claim 2, said insulating core board on both sides of the, said a metal plate, the plate 1 and the pattern pair of conductors, said further circuit board is formed of, is so simple and easy to assemble by said number 1 filled with said 1 pair of conductors pattern for electrically connecting with a conductive, circuit board. According to one of Claim 1 to Claim 4, said further circuit board is formed of, said laminate is adhered a having heat-sink member, circuit board. According to Claim 5, said circuit board is formed of further, a heat radiation member said number 2 and a vent gas, a heat dissipation member said said laminate a gas present between said expanded is given during mounting of electronic components said gas when said number 2 gas vent hole to the atmosphere through open-sided light thus passed passes to the, said number 2 gas vent and selects formed, circuit board. According to Claim 1, the core board insulating said number 1 number 2 surface and having stabilized, and the metal plate said surface said number 1, said number 2 surface, spacer stacked an insulative substrate is a parts, said electronic component, said component a dielectric substrate and the embedded in and between spacers, said gas vent and selects, an core insulating said number 2 and supporting, said circuit board is formed of further, other patterns of electrical conductors said said electronic element for electrically connecting said number 2 is so simple and easy to assemble with conductive that the product that is being charged, circuit board. According to one of Claim 1 to Claim 7, a retort pouch inserted unit copper metal plate said, circuit board. As manufacturing method for the preparation of polyolefins having a, insulating core board and a metal plate and to give and is stacked; said insulating core board and said metal plate by so as to press the pressing member, said said insulating core substrate is bonded to the metal plate, the plate, and an vent gas in addition; of mounting electronic component with the identification of said metal plate; said insulating core board and said metal plate a gas present between, is given during mounting of electronic components said said gas vent hole expands light thus passed passes to the open-sided the atmosphere via having to, manufacturing method for the preparation of polyolefins having a.