СПОСОБ ИЗГОТОВЛЕНИЯ КАРТОЧКИ СО ВСТРОЕННЫМ МИКРОПРОЦЕССОРОМ И КАРТОЧКА, ИЗГОТОВЛЕННАЯ ЭТИМ СПОСОБОМ

Изобретение относится к карточкам со встроенным микропроцессором. Его использование при изготовлении таких карточек, снабжённых контактами, позволяет получить технический результат в виде обеспечения возможности нанесения на контакты видимой информации без ухудшения защиты металлических контактов от коррозии и окисления. Этот технический результат достигается в способе изготовления карточек, контакты которых образованы несколькими слоями, верхний из которых является слоем благородного металла, за счёт того, что на контакты воздействуют лазерным лучом, скорость перемещения которого выбирают так, чтобы время локального пребывания лазерного пятна на контактах и связанный с этим временем локальный перенос энергии луча вызывали локальное расплавление самого верхнего слоя и ещё хотя бы одного из расположенных под ним слоёв контакта с образованием сплава, легированного благородными металлами. 2 н. и 17 з.п. ф-лы, 10 ил.

ПЕЧАТНАЯ ПЛАТА, В ЧАСТНОСТИ, ДЛЯ СИЛЬНОТОЧНОГО ЭЛЕКТРОННОГО МОДУЛЯ, СОДЕРЖАЩЕГО ЭЛЕКТРОПРОВОДЯЩУЮ ПОДЛОЖКУ

Изобретение относится к печатной плате, в частности, для сильноточного электронного модуля. Технический результат - достижение непосредственного электрического контакта проводящих поверхностей или соответственно токопроводящих дорожек с самой подложкой и использование подложки в качестве электрического проводника. Достигается тем, что в печатной плате, в частности, для сильноточного электронного модуля, содержащего электропроводную подложку, подложка, по меньшей мере, частично, предпочтительно, полностью, выполнена из алюминия или из алюминиевого сплава. Причем, по меньшей мере, на одной поверхности электропроводной подложки расположена, по меньшей мере, одна проводящая поверхность в виде электропроводящего слоя, нанесенного, предпочтительно, методом печати, особенно предпочтительно, методом трафаретной печати. Причем проводящая поверхность непосредственно контактирует с электропроводной подложкой. 2 н. и 13 з.п. ф-лы, 11 ил.

ИЗОЛИРУЮЩАЯ ПЕЧАТНАЯ ПЛАТА И МОЩНОЕ ПОЛУПРОВОДНИКОВОЕ УСТРОЙСТВО, ИСПОЛЬЗУЮЩЕЕ ЕЕ

Изобретение относится к способу изготовления изолирующей подложки, более конкретно к печатной плате, которая может обеспечивать изоляцию внутри корпуса, например, мощного полупроводникового устройства. Настоящее изобретение предусматривает способ изготовления изолирующей печатной платы, включающий приложение напряжения между рельефом схемы печатной платы в атмосферном воздухе или газе с пониженным давлением для обеспечения электрического разряда на печатной плате или облучение лазерным лучом, в результате чего выступы концевой части проводника электрода расплавляются и сглаживаются для ограничения концентрации электрического поля. Технический результат - ограничение локальной концентрации электрического поля в концевой части слоя проводника изолирующей печатной платы и повышение начального напряжения парциального электрического разряда, что приводит к улучшению изоляционной надежности изолирующей печатной платы и использующего ее мощного полупроводникового устройства. 8 с. и 10 з.п. ф-лы ...

КОРПУС ДЛЯ ЭЛЕКТРОННОГО БАЛЛАСТНОГО СОПРОТИВЛЕНИЯ

Изобретение относится к электронным узлам, а более конкретно - к упрощению таких узлов. В частности, изобретение относится к электронным балластным сопротивлениям для газоразрядных ламп, причем такие балластные сопротивления имеют повышенное рассеяние тепла, уменьшенное количество компонентов, минимизированное механическое напряжение на электрических компонентах и повышенное подавление электромагнитных помех (ЭМП). Технический результат - улучшение работы электронных узлов, улучшение работы электронных балластных сопротивлений для газоразрядных ламп, уменьшение механических напряжений в таких устройствах, уменьшение ЭМП, исходящих от таких устройств, - достигается тем, что электронный узел, имеющий корпус, выполнен с уплотнением от воздействия окружающей среды, с возможностью подавления ЭМП и с хорошей термической связью между заключенными в узле горячими электрическими компонентами и наружным теплоотводом. 3 з.п. ф-лы, 6 ил.

УСТРОЙСТВО, СОСТОЯЩЕЕ ИЗ ПОДЛОЖКИ ДЛЯ МОЩНЫХ КОМПОНЕНТОВ ЭЛЕКТРИЧЕСКОЙ СХЕМЫ И ТЕПЛООТВОДА, А ТАКЖЕ СПОСОБ ИЗГОТОВЛЕНИЯ ТАКОГО УСТРОЙСТВА

В изобретении описано устройство, состоящее из подложки и теплоотвода, причем подложка имеет на первой стороне по меньшей мере один мощный схемный компонент, смонтированный на первом печатном проводнике большой площади, а на второй стороне, противоположной стороне размещения мощного схемного компонента, имеет второй печатный проводник большой площади, который теплопроводящими межслойными соединениями соединен с первым печатным проводником, при этом подложка второй стороной установлена на теплоотводе с обеспечением теплопроводного контакта между ними. С целью обеспечить в таком устройстве эффективную теплопередачу от подложки к теплоотводу и одновременно предотвратить нежелательный электрический контакт между находящимися под напряжением печатными проводниками в изобретении предлагается устанавливать подложку на теплоотвод с расположенными на ее второй стороне распорками, которые удерживают эту подложку на заданном расстоянии от теплоотвода, при этом зазор между подложкой и теплоотводом, ...

СБОРКА НА ПЕЧАТНОЙ ПЛАТЕ

Настоящее изобретение относится к сборке на печатной плате. Технический результат - создание сборки на печатной плате и способа сборки такой сборки на печатной плате, облегчающих разделение и сбор различных электронных компонентов, смонтированных в сборке на печатной плате, в конце ее срока эксплуатации,и дополнительно облегчающих повторное использование электронных компонентов и/или утилизацию веществ, из которых состоят отходы от электронного оборудования. Достигается тем, что сборка на печатной плате содержит: подложку; электронные компоненты, которые разделены на категории, причем каждый компонент прикреплен к подложке при помощи средства крепления, имеющего заданную температуру теплового расцепления, в зависимости от того, к какой категории относится упомянутый компонент. 3 н. и 9 з.п. ф-лы, 6 ил.

РЕЗИСТОРНАЯ ПЕЧАТНАЯ ПЛАТА ВЫХОДНОГО ТРАНСФОРМАТОРА СТРОЧНОЙ РАЗВЕРТКИ

Изобретение относится к выходным трансформаторам строчной развертки для подачи высокого напряжения на электронно-лучевую трубку дисплея радиоэлектронной аппаратуры. Резистор, регулирующий экранное напряжение, и резистор, регулирующий фокусирующее напряжение, напечатаны на одной стороне резисторной печатной платы, а стабилизирующий нагрузочный резистор печатается на другой ее стороне, так, что уменьшается размер резисторной печатной платы, а фокусирующее и экранное напряжения, которые подаются на аппаратуру, настраиваются стабильно и на них не влияет погрешность печати стабилизирующего нагрузочного резистора. Технический результат - уменьшение габаритов и повышение экономичности изготовления выходного трансформатора. 9 ил.

МИКРОСХЕМА

Микросхема, содержащая герметичный полимерный корпус и расположенные в нем кристалл, выводы, соединения кристалла с выводами, отличающаяся тем, что полимерный корпус выполнен как минимум двухслойным, кристалл и выводы расположены в первом и во втором слоях, а соединения кристалла с выводами расположены во втором слое, причем толщина слоя не превышает толщины кристалла, а толщина второго слоя не превышает суммарной толщины кристалла и высоты соединения кристалла и выводов, при этом третий и более слои могут быть расположены как со стороны первого, так и со стороны второго слоя.

МИКРОЭЛЕКТРОННЫЙ БЛОК

... 1. Микроэлектронный блок, содержащий корпус, разделенный перегородками на отсеки, в которых размещены установленные на рамках функциональные платы, а также крышку, закрепленную по периметру корпуса пайкой, сверхвысокочастотный и низкочастотный гермовводы и узел герметизации, отличающийся тем, что вышеуказанный корпус выполнен в виде плоского основания, на котором групповой пайкой закреплены перегородки, отсеки корпуса закрыты дополнительными экранирующими крышками с поглотителем, на внутренней стороне основания выполнены пазы для прокладки проводников низкочастотной и высокочастотной разводки, а на наружной стороне основания выполнены сквозные отверстия для винтов, которые фиксируются в глухих резьбовых отверстиях рамок функциональных плат, и соответствующие выемки с отверстиями для установки разъемов сверхвысокочастотного и низкочастотного гермовводов.2. Микроэлектронный блок по п.1, отличающийся тем, что основание, крышка, перегородки, экранирующие крышки и рамки микроэлектронного блока ...

ДАТЧИК ДЛЯ СИСТЕМЫ ЗАЩИТЫ АППАРАТНЫХ СРЕДСТВ ЧУВСТВИТЕЛЬНЫХ ЭЛЕКТРОННЫХ МОДУЛЕЙ ОБРАБОТКИ ДАННЫХ ОТ ВНЕШНИХ МАНИПУЛЯЦИЙ

Изобретение относится к электронным модулям, применяемым, например, в тахографах. Технический результат - повышение технологичности. В системе защиты аппаратных средств для чувствительных электронных модулей обработки данных от внешних манипуляций датчик имеет соответственно согласованную топологию. 11 з.п. ф-лы, 8 ил.

ЭЛЕКТРОННАЯ ПЛАТА С РЕБРАМИ ЖЕСТКОСТИ

Электронная плата с ребрами жесткости, содержащая алюминиевое основание, на котором создан диэлектрический слой оксида и контактные площадки с проводящими дорожками, отличающаяся тем, что на этапе селективного ступенчатого оксидирования алюминия (т.е. на этапе формирования диэлектрика) в глубине платы сформированы ребра жесткости для повышения виброзащищенности изделия.

Способ изготовления структуры оптико-электронной шины печатной платы и устройство для его реализации

Изобретение относится к технологии изготовления печатной платы и/или подложки корпуса полупроводниковой интегральной схемы, в частности к способу изготовления структуры оптического волновода высокой плотности и к самой печатной плате. Заявленный способ изготовления структуры оптико-электронной шины на поверхности печатной платы заключается в изготовлении мастер-штампа структуры оптических волноводов оптико-электронной шины, нанесении полимерного материала сердцевины оптических волноводов, нанесении полимерного материала нижней оболочки оптических волноводов, и нанесении полимерного материала верхней оболочки оптических волноводов. Причем для изготовления мастер-штампа используют метод фотолитографии с последовательным нанесением двух его слоев и формированием двухслойной структуры мастер-штампа из одного материала, после чего на сформированную структуру мастер-штампа наносят слой модификатора адгезии. Затем наносят полимерный материал сердцевины оптических волноводов в мастер-штамп путем ...

СХЕМНЫЙ МОДУЛЬ И УСТРОЙСТВО СВЯЗИ ПО ЛИНИИ ЭЛЕКТРОПЕРЕДАЧИ

Использование: в области электронной техники. Технический результат заключается в повышении надежности и защиты от шума. Схемный модуль монтируется с ИС, которая модулирует и демодулирует сигнал с несколькими несущими. Схемный модуль имеет многослойную плату, которая изнутри снабжается множеством проводящих слоев, уложенных с изолирующими слоями между ними, и ИС, которая снабжается множеством выводов заземления, которые нужно заземлить. Из множества проводящих слоев проводящий слой, представленный ближайшим к ИС, формирует слой заземления, электрически соединенный с множеством выводов заземления. 2 н. и 14 з.п. ф-лы, 39 ил.

ПЕЧАТНАЯ ПЛАТА

Изобретение относится к области радиотехники, в частности к изготовлению печатных плат. Сущность изобретения: печатная плата содержит диэлектрическую подложку 1 с рисунком проводников, которые выполнены в виде рамки 2 прямоугольной, круглой, квадратной или пр. формы. В одной из сторон на одном из участков рамки изготавливают перемычку 3 из материала, изменяющего свое электрическое сопротивление в широких пределах под воздействием электрического тока, индуцируемого в рамке. 8 з.п. ф-лы, 2 ил.

НЕЗАВИСИМЫЙ ЭЛЕКТРОННЫЙ КОМПОНЕНТ И СПОСОБ ЕГО УСТАНОВКИ

... 1. По существу, корпусной дискретный электронный компонент, содержащий силовую электронную схему, корпус или кожух (2) по существу в форме параллелепипеда и контактные штыри (3), соединенные внутри корпуса с указанной электронной схемой и выступающие из корпуса (2) для электрического соединения с печатной платой (4), причем в корпусе (2) имеется теплорассеивающая головная часть (5), имеющий по меньшей мере одну поверхность, выведенную из корпуса (2) и лежащую в плоскости (Р), а указанные контактные штыри (3) выступают из корпуса (2) так, что их первый участок первоначально проходит параллельно указанной плоскости (Р), отличающийся тем, что за первым участком по меньшей мере в одном (7) из контактных штырей (3) имеется по существу П-образный изгиб, в котором (7с) перекладина буквы П расположена по касательной к указанной плоскости (Р). 2. Дискретный электронный компонент по п.1, отличающийся тем, что свободные концы контактных штырей (3) и указанного по меньшей мере одного контактного штыря ...

Радиоэлектронный блок

Радиоэлектронный блок, содержащий размещенную на основании гибкую изогнутую печатную плату с токопроводниками и контактными площадками, спаянными с функциональными узлами, радиоэлементами, электродеталью и элемент фиксации печатной платы на основании, причем плата покрыта заливочным компаундом, отличающийся тем, что он снабжен дополнительным основанием, расположенным параллельно основному, при этом оба основания жестко соединены с электродеталью, на внутренней поверхности каждого основания выполнен спиральный канал для размещения торцевых поверхностей печатной платы и элемента фиксации, причем фиксация одного конца печатной платы выполнена с помощью электродетали с контактными площадками, а другого конца - с помощью эластичной оболочки, покрывающей один из функциональных узлов и связанные с ним токопроводники.

СПОСОБ И УСТРОЙСТВО ДЛЯ ОЧИСТКИ, РАЗДЕЛЕНИЯ, МОДИФИКАЦИИ И/ИЛИ ИММОБИЛИЗАЦИИ ХИМИЧЕСКИХ ИЛИ БИОЛОГИЧЕСКИХ ОБЪЕКТОВ, НАХОДЯЩИХСЯ В ТЕКУЧЕЙ СРЕДЕ, И ОПОРА ИЗ МИКРОПРОВОЛОКИ

... 1. Устройство для очистки, разделения, модификации и/или иммобилизации химических или биологических объектов, находящихся в текучей среде, посредством связывания химического или биологического объекта с функциональным покрытием или лигандами, находящимися на поверхности опор из микропроволоки при отсутствии воздействия магнитного поля, создаемого между опорами из микропроволоки и частицами, находящимися в текучей среде, на разделение названных частиц, которое содержит по меньшей мере одну опору из микропроволоки, закрепленную своими концами и имеющую многослойную структуру, состоящую из центрального стержня и по меньшей мере одного покрывающего слоя и пригодную для связывания химических или биологических объектов, при этом поверхность микропроволоки модифицирована путем присоединения лигандов или нанесением на нее функционального покрытия. ! 2. Устройство по п.1, в котором центральный стержень и покрывающие слои выполнены из материала, выбранного из группы, включающей стеклянный, металлический ...

ПОДЛОЖКА ДЛЯ УСТАНОВКИ МНОЖЕСТВА СВЕТОИЗЛУЧАЮЩИХ ЭЛЕМЕНТОВ

... 1. Устройство вывода света, содержащее подложку (1), имеющую:первый сегмент (5a), обеспеченный первой контактной площадкой (22a), и первый светоизлучающий элемент (2a), соединенный с первой контактной площадкой; ивторой сегмент (5b), обеспеченный второй контактной площадкой (22b), и второй светоизлучающий элемент (2b), соединенный со второй контактной площадкой,причем подложка обеспечена по меньшей мере одним сквозным отверстием (6a-c), которое продолжается от края (8, 9) упомянутой подложки до точки в пределах упомянутой подложки так, что относительное перемещение в плоскости подложки может быть достигнуто между первым сегментом (5a) подложки и вторым сегментом (5b) подложки приложением механической силы к упомянутой подложке, причем упомянутое устройство вывода света дополнительно содержит оптическую систему (10), обеспеченную первым оптическим элементом (11a), предназначенным для приема света от первого светоизлучающего элемента (2a), и вторым оптическим элементом (11b), предназначенным ...

Радиоэлектронный блок

Радиоэлектронный блок, содержащий пакет печатных плат с радиоэлементами, щиты, разделяющие печатные платы и соединенные с ними посредством обрамляющего крепления и стержней, отличающийся тем, что щиты выполнены в виде предварительных напряженных в направлении, противоположном действию погрузок, арок с центральным отверстием и гнездами, выполненными на выпуклых поверхностях арок и предназначенных для установки в них с клеем корпусов радиоэлементов, причем в платах между стержнями, выполнены радиальные пазы и центральное отверстие, соосное отверстию в арках, а обрамляющее крепление снабжено втулкой, размещенной в центральном отверстии арок и плат.

УСТРОЙСТВО РАЗЪЕМНОГО СОЕДИНЕНИЯ ДЕТАЛЕЙ, МОДУЛЕЙ И БЛОКОВ ЭЛЕКТРОННОЙ АППАРАТУРЫ

Изобретение представляет собой устройство типа застежки "молния" и предназначено для использования в вычислительной технике, приборостроении, электронике. Сущность изобретения: соединяемые блоки электронной аппаратуры оканчиваются контактными площадками, к каждой из которой подключены соединительные проводники. К соединяемым блокам прикреплены ленты из эластичного диэлектрического материала. На каждой из лент закреплены с определенным шагом зубцы первого и второго типов, образующие два противолежащих ряда. Зубцы первого типа выполнены так, что их выпуклая и вогнутая электропроводные поверхности разделены слоем диэлектрика, а к электропроводным поверхностям подключены соединительные проводники, проходящие через ленту из эластичного диэлектрического материала. Зубцы второго типа выполнены из оптически прозрачного диэлектрического материала и также имеют на своих противоположных сторонах выпуклую и вогнутую поверхности, через центры которых проходит оптическая ось. Внутри зубцов второго типа ...

ЭЛЕКТРОННЫЙ БЛОК

Электронный блок, состоящий из корпуса, выполненного в виде прямоугольного параллелепипеда с теплообменными стенками, субблоки которого выполнены в виде печатных плат с электрорадиоэлементами, которые установлены в корпусе с возможностью обеспечения контактных прижимных элементов теплового контакта по крайней мере двух других торцовых сторон их печатных плат субблоков с соответствующими прилегающими к ним теплообменным стенкам корпуса и электрически соединенные с панелью корпуса своими ответными частями, причем внутренние стороны теплообменных стенок образуют полую камеру с внутренними перегородками, сообщающимися между собой своими полостями с полостью корпуса посредством вентиляционных отверстий, контактные теплопроводящие прижимные элементы, выполненные в виде пружинных тепловых разъемов, выступающие части которых расположены на соответствующих торцовых сторонах печатных плат субблоков, а ответные им гнездовые части которых - на соответствующих прилегающих к этим торцовым сторонам печатных ...

СПОСОБ ИЗГОТОВЛЕНИЯ КОНТАКТНОЙ ПЛОЩАДКИ ТОНКОПЛЕНОЧНОЙ МИКРОСХЕМЫ

Способ изготовления контактной площадки тонкопленочной микросхемы, включающий нанесение слоя алюминия с подслоем металла и защитным слоем подложки, отличающийся тем, что в качестве защитного слоя наносят окисел металла, причем получают его нанесением в едином цикле на поверхность подложки с сформированными на ней контактной площадкой и резистивным слоем пленки тантала с удельным сопротивлением который затем окисляют насквозь при температуре не ниже 350°С и не выше температуры отжига резистивного слоя.

СТРУКТУРА СОЕДИНЕНИЙ ЭЛЕМЕНТОВ МИКРОСХЕМЫ С ПОНИЖЕННЫМ УРОВНЕМ ПЕРЕКРЕСТНЫХ ПОМЕХ ДЛЯ УЛУЧШЕНИЯ ВНЕЧИПОВОЙ ИЗБИРАТЕЛЬНОСТИ

Для снижения уровня перекрестных помех компоненты микросхемы с возвратной внечиповой РЧ избирательностью: дифференциальные функциональные блоки, передающие линии и внечиповые фильтры объединены структурой, которая компенсирует паразитные емкости, обусловленные всеми дифференциальными элементами микросхемы. Эта структура содержит первый подслой с дифференциальными генерирующим и приемным контурами. Контуры подсоединены к близко расположенным одна от другой концевым контактным площадкам посредством двух близко расположенных одна от другой (на некотором участке их длины) дифференциальных передающих линий, каждая из которых имеет постоянный собственный импеданс и скомпенсированную емкость по отношению к земле. Передающие линии снабжены общей заземляющей платой. Во втором подслое, имеющем возвратное межсоединение с первым подслоем, выполнен РЧ функциональный блок, в частности фильтр или линия задержки.

СПОСОБ ИЗГОТОВЛЕНИЯ ПРОВОДЯЩЕЙ СХЕМЫ НА ПОДЛОЖКЕ, ПРОВОДЯЩАЯ СХЕМА НА ПОДЛОЖКЕ И УСТРОЙСТВО ДЛЯ ИЗГОТОВЛЕНИЯ ГИБКОЙ ПРОВОДЯЩЕЙ СХЕМЫ

Из проводящей схемы можно изготовить плотно упакованные блоки контактов для использования в качестве электрических соединителей или схем. Способ и устройство для изготовления проводящей схемы включает в себя формование листа проводящего материала 22 для образования выступов 24 и желобков 26, из которых один образует проводящую схему, а другой - отходы материала, которые затем механически удаляются. Таким образом проводящая схема поддерживается слоем 12 диэлектрика.

ПЕЧАТНАЯ ПЛАТА

Изобретение относится к радиотехнике, в частности к изготовлению печатных плат. Сущность изобретения: печатная плата содержит диэлектрическую подложку 1 с рисунком проводников, которые выполнены в виде рамки 2 прямоугольной, круглой, квадратной или другой формы. В одной из сторон (на одном из участков) рамки изготавливают перемычку 3 из материала, изменяющего свое электрическое сопротивление в широких пределах под воздействием электрического тока, индуцируемого в рамке. 8 з.п. ф-лы, 2 ил.

ТЕСТ-КУПОН ДЛЯ КОНТРОЛЯ КАЧЕСТВА ПЕЧАТНЫХ ПЛАТ С ОТВЕРСТИЯМИ

Изобретение служит для повышения достоверности контроля печатных плат. Тест-купон выполнен в виде многослойной структуры, включающей внутренние и внешние слои со схемой проводников и контактными площадками (П) 2 - 3. Соединение металлизированных отверстий 1 с П 2 и 3 выполнено по части периметра отверстия, а с П 4 и 5 - по всему периметру. Участок перехода П 4 (5) - отверстие 1 выполнен с радиусом скругления r (0,1 - 0,25) I, где I - толщина многослойной структуры. В описании приведено выражение для определения количества отверстий. 2 ил.

МОНОЛИТНОЕ УСТРОЙСТВО ПЕРЕДАЧИ СИГНАЛОВ ДЛЯ ПРИМЕНЕНИЯ В ПРИЛОЖЕНИЯХ КРИОГЕННЫХ КВАНТОВЫХ ВЫЧИСЛЕНИЙ

БЛОК РАСПРЕДЕЛЕНИЯ ПИТАНИЯ С ПОФАЗНЫМ МОНИТОРИНГОМ ГРУПП РОЗЕТОК И УПРАВЛЕНИЕМ КАЖДОЙ РОЗЕТКОЙ

Полезная модель относится к области электротехники, а именно к устройствам распределения питания, и может быть использована для организации надежного энергоснабжения серверов, в том числе в шкафах корпоративных и коммерческих центров обработки данных (ЦОД). Блок содержит корпус с расположенным в нем интеллектуальным быстросъемным модулем, который содержит материнскую плату, соединенную с платой процессорного модуля и дисплейным модулем, а также порты для датчиков. Также в нем расположен розеточный модуль, выполненный с возможностью самостоятельного управления каждой розеткой автономно и содержит силовую плату с розетками, три аналого-цифровых преобразователя, датчики напряжения и тока, силовые реле для коммутации и микроконтроллер SТМ, кроме того, в корпусе расположен модуль фильтра электромагнитной совместимости. Предлагаемая полезная модель обеспечивает повышение скорости реагирования силовых реле на внештатные ситуации за счет выполнения розеточного модуля с мониторингом и управлением ...

Устройство расчета рисков некритических воздействий на систему ремонтно-восстановительных органов

Полезная модель относится к вычислительной технике. Технический результат заключается в определении текущего состояния системы ремонтно-восстановительных органов, исходя из множества значений некритического воздействия и плотности распределения некритических сценариев воздействий, для объективного планирования дальнейшего функционирования рассматриваемой системы. Технический результат достигается за счет того, что в устройство расчета рисков некритических воздействий на систему включены: блок управления, блок определения соответствия значения некритического воздействия множеству допустимых некритических воздействий, блок умножения, блок определения рисков некритических воздействий на систему ремонтно-восстановительных органов, устройство отображения информации. 1 ил.

Платы для печатных схем

Печатная плата

Печатная плата

Несущая рамка

Изобретение относится к радиоэлектронике и может быть использовано при контроле и изготовлении больших интегральных схем. Цель изобретения - расширение функциональных возможностей путем придания несущей рамке дополнительных функций приспособления спутника для автоматизированных процессов сборки, герметизации, маркировки, климатических испытаний, хранения и транспортировки. В гребенки 3 основания 1 (фиг.1) закладывают выводы интегральной схемы 5, накладывают прижимную рамку 2 и защелкивают скосы элементов крепления 11 в пазах основания 12. Собранная таким образом несущая рамка совмещает в себе функции межоперационной тары- спутника, защищая выступами 7 выводы интегральной схемы 4 от повреждений. На различных операциях несущая рамка выполняет функции съемной ориентирующей и зажимной части технологического оборудования, таких как установка сварки, обрубной штамп, контактирующее устройство. 1 з.п. ф-лы. 6 ил.

Радиоэлектронный блок

Многослойная печатная плата

МОНТАЖНАЯ ПЛАТА

Многослойная печатная плата

Фольгированнный диэлектрик

Diverting mounting support for electronic components - has base of thermally-conducting plastics material accepting thick film circuit

An electronic circuit of the type used in motor vehicle engine ignition systems is produced with a base (4), frame (5) and a cover (6). The unit may be mounted onto a body using side fixings (9). The base of the unit forms a board for the formation of a printed circuit onto which electronic devices may be mounted. Some of the devices can be in the form of heat generating power transistors (3), with good contact ensured by a contact paste. The base is produced of a plastics material with high thermal conductivity for good heat dissipation. ADVANTAGE - Provides good dissipation of generated heat to chassis or part of bodywork.

Harzzusammensetzungen und diese verwendende Leiterplatten

ELEKTRISCHE ABZWEIGDOSE SOWIE EIN VERFAHREN ZUR HERSTELLUNG DERSELBEN

3-DIMENSIONALES GEHÄUSE FÜR MONOLITHISCHE INTEGRIERTE MIKROWELLEN/MILLIMETERWELLETERWELLEN-SCHALTUNGEN

Prodn. of resist patterns on substrates, esp. drilled substrates - by laminating substrate with a solid resist, removing the protective film, applying a liq. resist, exposing with a mask, and developing

Process comprises (a) laminating the substrate with a solid resist (A); (b) removing the protective film from (A), (c) applying a liq. resist (B) to (A), (d) exposing the photopolymerisable layer consisting of (A) and (B), with an exposure mask applied directly to the photopolymerisable layer, and (e) developing the exposed layer. (B) is applied by spin-coating, after which the combination is dried and cooled. USE/ADVANTAGE - The process enables the prodn. of resist patterns with a fine structure on substrates with drill holes (i.e. for the prodn. of printed circuits) without building up lacquer round the drill holes or covering the holes themselves (contrast prior-art processes).

SAMMELSCHIENE

Energiezuführungsstruktur für ein Multichip

Leiterplattentrenneinrichtung

PRAEZISIONS-POSITIONIERUNG MIT HILFE VON ELEKTRISCHEN MESSUNGEN

Verfahren zur Justierung und Verbindung

ELEKTRISCHE VERBINDUNGEN MIT NACHGIEBIGEN KONTAKTEN

Printed circuit board with integrated cooling arrangement

The arrangement includes at least one conductor foil or printed circuit board (1,3) which is thermally connected with a fluid channel board (7) through a thermally conductive, but electrically isolating thermal layer (5,5'). The thermal layer is directly in thermal contact with solder (12) in at least one soldering hole (13,13') which proceeds through the at least one conductor foil or printed circuit board, and which is electrically connected with at least one soldering connection element (10,10') of an electric component (11,11').

ELEKTRISCHE VERBINDER

Verbesserungen an elektrischen Schaltungen

Elektronisches Modul mit Leistungsbauteilen und Verfahren zur Herstellung

Method for soldering printed-circuit boards

The invention relates to a method for soldering printed-circuit boards, in which, after being fitted with components, the printed-circuit boards pass through a plurality of stations in which they are successively subjected to a fluxing process, a pre-heating process, and the actual soldering process. According to the invention, after the actual soldering process, the printed-circuit boards are heated until existing tin-solder links are melted away. Subsequently, the underneath sides of the printed-circuit boards are scanned optically in order to identify soldering defects.

Sensoreinrichtung mit einem an einem Sensorrahmen angeordneten Sensorelement

Die Erfindung bezieht sich auf eine Sensoreinrichtung 1 mit einem an einem Sensorrahmen 2 angeordneten Sensorelement 4 und mit einer mit dem Sensorelement 4 elektrisch verbundenen, auf einer Leiterplatte 6 angeordneten Messschaltung 8. Für eine Verbesserung einer Qualität von Sensorsignalen der Sensoreinrichtung wird vorgeschlagen, dass die Leiterplatte 6 innerhalb des Sensorrahmens 2 angeordnet und gefaltet ist, dass die Messschaltung 8 an einem ersten Leiterplattenende 12 der Leiterplatte 6 an einer einer Innenseite des Sensorrahmens 2 unmittelbar zugewandten Leiterplattenoberfläche 20 angeordnet ist und dass das zweite Leiterplattenende 14 der Leiterplatte 6 eine potentielle Störquelle 16 für die Messschaltung 8 aufweist, wobei die Faltung der Leiterplatte 6 zwischen dem ersten Leiterplattenende 12 und dem zweiten Leiterplattenende 14 angeordnet ist.

MEHRSCHICHTIGE LEITERPLATTE

TEMPERATURGEREGELTE HYBRID-SCHALTUNG

Verfahren und Bauteil zum Montieren von Bauelementen auf einer Leiterplatte.

Herstellungsverfahren einer elektronischen Karte mit Wärmeabführung.

ELEKTRISCHE SCHALTVORRICHTUNG

Verfahren zur Herstellung einer funktionalisierten thermoplastischen Kunststofffolie mit hybriden Schichtstrukturen und gemäß diesem Verfahren bearbeitete Kunststofffolie

Beschrieben wird ein Verfahren zur Funktionalisierung von thermoplastischen Kunststofffolien mit hybriden Schichtstrukturen. Auf Kunststofffolien werden Kupferleitbahnen elektrochemisch abgeschieden, die in vorgesehenen Umformbereichen mit tiefziehfähigen Silberleitpasten ergänzt werden. Die nach diesem Verfahren hergestellte funktionalisierte thermoplastische Kunststofffolie kann Bestandteil einer Bedienoberfläche oder eines elektronischen Gerätes, insbesondere in einem Kraftfahrzeug sein.

Contactless chipcard manufacturing method

The chipcard manufacturing method uses a carrier foil provided with a conductive Cu layer, which is etched to provide a number of spaced coil structures, combined with a corresponding number of chip modules. The carrier foil is laminated with a pair of core foils positioned on either side of it and a pair of cover foils, before stamping out the individual cards, each containing a coil structure and a chip module.

Steckerleiste für elektronische Geräte

EINSTECKMODUL FUER EINE ELEKTRONISCHE EINRICHTUNG

Halterungsaufbau für einen Schwinger

HV capacitor unit with wide bandwidth and low reflection coefficient - uses circuit board with two-part metal coating to which capacitor electrodes and cable conductors are connected

A circuit board is given a two-part metallic coating. Electrodes and cable conductors are connected to it. The unit has also a socket for a coaxial cable (1). A circuit board carries on at least one side a metal coating divided in two separate parts. A plate-shaped capacitor is placed in a recess in the board strip-shaped part free from the metal coating, so that its metal electrodes are perpendicular to the circuit board. they are in addition connected, together with the coaxial cable inner and outer conductors to at least one of the metal coatings.

Contactless chip card manufacturing method

The manufacturing method has a conductive adhesive (9) applied via a dosing device to the surface of an antenna contact surface (20) incorporated in the card body, for securing a chip module contact surface, the height of the applied conductive adhesive measured via an electrode (35) displaced perpendicular to the chip card surface, with a voltage applied across the antenna contact surface and the measuring electrode, for providing a voltage discharge in the gas-filled space between the measuring electrode and the deposited conductive adhesive. An Independent claim for a device for a manufacture of chip cards is also provided.

Abwinkelbare und/oder abgewinkelte Leiterplattenstruktur mit zumindest zwei Leiterplattenabschnitten und Verfahren zu deren Herstellung

Die Erfindung betrifft eine abwinkelbare und/oder abgewinkelte Leiterplattenstruktur mit wenigstens zwei winkelig zueinander anordenbaren bzw. angeordneten Leiterplattenabschnitten, wobei die Leiterplattenstruktur wenigstens ein zumindest überwiegend in der Leiterplattenstruktur eingebettetes Leitungselement enthält, das sich zwischen zwei Anschlussstellen erstreckt und mit diesen Anschlussstellen elektrisch leitend verbunden ist, wobei sich die beiden Anschlussstellen auf verschiedenen Leiterplattenabschnitten befinden, wobei die Leiterplattenabschnitte unter Beibehaltung der Verbindungen zwischen den Anschlussstellen und dem wenigstens einen Leitungselement und unter Biegung des wenigstens einen Leitungselements über eine Biegekante zwischen den Leiterplattenabschnitten gegeneinander abwinkelbar und/oder abgewinkelt sind. Um die elektrische und mechanische Verbindung zwischen den Leiterplattenabschnitten zu verbessern, ist erfindungsgemäß vorgesehen, dass das Leitungselement im Querschnitt ...

Verbindungsanordnung zwischen einem koaxialen Verbinder und einem planaren Substrat

Non-conductive substrate for chip card carrier element

The substrate (2) is provided on one side with a number of conductive contact surfaces (6), each contained within a contour line (4) corresponding to a respective carrier element. The opposite side of the substrate is provided with conductor structures, with at least one contact field for an antenna coil and a semiconductor chip within each contour line. Openings are provided in the substrate outside the contour lines for contacting the coil terminals of the semiconductor chips from the contact surface side, to allow testing.

Elektronische Komponente und Verfahren zur Herstellung einer elektronischen Komponente

Elektronische Komponente (E), umfassend- zumindest einen Schaltungsträger (1), der mit einer Anzahl von elektronischen Bauteilen (A) bestückt ist, und- zumindest ein Abdeckelement (2) zur Abdichtung zumindest eines der elektronischen Bauteile (A), wobei- der Schaltungsträger (1) eine Anzahl von Durchgangsöffnungen (1.4) aufweist, die jeweils um einen mit mindestens einem der elektronischen Bauteile (A) bestückbaren Bereich (B) ausgebildet sind, wobei- ein Randabschnitt (2.1) des Abdeckelements (2) aus einem Verguss- oder Spritzgussmaterial gebildet ist und die Durchgangsöffnungen (1.4) durchdringt und- der Randabschnitt (2.1) mit dem Schaltungsträger (1) an den Durchgangsöffnungen (1.4) stoffschlüssig verbunden ist.

ELEKTRISCHE STECKBUCHSE

Steuergerät mit Mikroprozessor für Mittel- und Hochspannungsschaltanlagen.

ELEKTRISCHES GERÄT, INSBESONDERE SCHALT- UND STEUERGERÄT FÜR KRAFTFAHRZEUGE

Vorrichtungen, Systeme und Verfahren zur Stromzufuhr

Vorrichtung, umfassend: einen Träger (110), der angrenzend an eine erste Seite (114) einer Leiterplatte (120) angeordnet ist, die ein Kontaktfeld (130) aufweist, das darin von einer Schaltung (140) der Leiterplatte (120) angeordnet ist, wobei das Kontaktfeld (130) einen äußeren Rand (160) und einen inneren Rand (152) aufweist, wobei die Schaltung (140) innerhalb des inneren Rands (152) des Kontaktfelds (130) einen Stromversorgungskontakt (148) aufweist, und wobei die Leiterplatte (120) außerhalb des äußeren Rands (160) des Kontaktfelds (130) einen Stromversorgungs-Anschlusspunkt (156) aufweist; und einen Leiter (170), der an dem Träger (110) befestigt ist, wobei der Leiter (170) einen ersten Anschlusspunkt (172) und einen zweiten Anschlusspunkt (174) aufweist, und wobei der erste Anschlusspunkt (172) durch einen ersten Stift (178) mit dem Stromversorgungskontakt (148) verbunden ist und der zweite Anschlusspunkt (174) durch einen zweiten Stift (178) mit dem Stromversorgungs-Anschlusspunkt ...

VORRICHTUNG UND VERFAHREN ZUR STEUERUNG DERREGISTRATION VON DRUCKSCHRITTEN IN EINEM KONTINUIERLICHEN

Verfahren zum Aufbau einer Leiterplatten-Anordnung von hoher Leistungsfähigkeit.

Schaltungsplatine mit mehreren Computerschnittstellen.

Leiterplatte und Verfahren zum Erkennen der Position von oberflächenmontierten Bauteilen.

Wärmeleitende und druckempfindliche Klebefolie und Verfahren zur Befestigung elektronischer Bauteile auf wärmeabstrahlende Teile mittels derselben

Elektrischer Verbinder für Differenz-Signale

MIKROWELLEN-/MILLIMETERWELLEN-SCHALTUNGSSTRUKTUR MIT EINZELN MONTIERTEN ELEMENTEN VOM FLIPCHIPTYP UND HERSTELLUNGSVERFAHREN DAFÜR

LEITERPLATTE MIT GEHÄUSETEIL

Vorgeschlagen wird eine Leiterplatte (100), aufweisend ein Substrat (110) mit einer ersten Seite (TOP) und einer zweiten Seite (BOT), wenigstens ein Blech (120), das mit einer Schmalseite an der zweiten Seite (BOT) des Substrats (110) angebracht ist und von der zweiten Seite (BOT) derart vorsteht, dass eine Flachseite des Blechs (120) in Bezug auf die zweite Seite (BOT) freiliegt, und ein Gehäuseteil (160), das das Blech (120) zumindest abschnittsweise umgibt und mit dem Blech (120) wärmeübertragend gekoppelt ist.

Elektrischer Motor und Leiterplatte

Elektrischer Motor (1), zumindest aufweisend einen Stator (2) und einen ringförmigen Rotor (3), die entlang einer axialen Richtung (4) nebeneinander angeordnet sind; wobei der Stator (2) eine Mehrzahl von, entlang einer Umfangsrichtung (5) nebeneinander angeordneten und sich jeweils entlang der axialen Richtung (4) erstreckenden, Statorzähnen (6) aufweist; wobei an jedem Statorzahn (6) zumindest eine Spule (7) mit mindestens einer Windung (8) angeordnet ist; wobei die mindestens eine Windung (8) elektrisch leitend mit einer Leiterplatte (9) verbunden ist, wobei die Leiterplatte (9) an einer Stirnseite (10) des Stators (2) und entlang der axialen Richtung (4) neben dem Stator (2) angeordnet ist, wobei die Leiterplatte (9) eine Mehrzahl von elektrischen Verbindungsleitungen (11) umfasst, über die die mindestens eine Windung (8) jeder Spule (7) zumindest mit anderen Windungen (8) oder mit einem elektrischen Anschluss (12, 13) des Motors (1) verbunden ist.

GEDRUCKTE LEITERPLATTE.

ANORDNUNG ZUR ANSTEUERUNG EINER VIELZAHL PARALLELGESCHALTETER LEISTUNGS-FELDEFFEKTTRANSISTOREN

Speichermodul Routing

Speichermodulplatine mit: einer ersten Oberfläche, die eingerichtet ist, eine erste Mehrzahl von Speichereinrichtungen zu verbinden; einer Mehrzahl von Signalleitungen; und einem Befehls- und Adressbus, der mit den Signalleitungen verbunden ist, wobei der Befehls und Adressbus von den Signalleitungen geführt ist und geeignet ist, wenigstens eine der ersten Vielzahl von Speichereinrichtungen in einer Weise zu verbinden, die nicht erfordert, dass die Befehls- und Adressbusleitungen sich mehr als annähernd neunzig Grad biegen, bevor sie an wenigstens eine der ersten Mehrzahl von Speichereinrichtungen angebunden werden.

Leiterplatten mit selbsttragender Verbindung zwischen den Seiten.

Transformatoren, insbesondere mit symmetrischer/unsymmetrischer Kopplung.

Schaltungsanordnung und elektrischer Verteilerkasten

Eine Schaltungsanordnung 20 weist auf: ein Stromschienensubstrat 30 mit Stromschienen 31 und einem Kunststoffteil 35, das an den Stromschienen 31 anliegt, ein Einpresselement 50A oder 50B, das aus Metall mit einer größeren Dicke als die Stromschienen 31 hergestellt ist und in das Stromschienensubstrat 30 eingepresst ist, ein elektronisches Bauteil 55, das mit dem Einpresselement 50A oder 50B verbunden ist, Lot S, das die Stromschienen 31 und das Einpresselement 50A oder 50B verbindet, und einen Lotansammlungsabschnitt 40, der mit dem Kunststoffteil 35 gebildet ist und in dem das Lot S angesammelt ist.

Elektronisches System enthaltend Komponente, die durch einen thermisch leitfähigen Klebstoff verbunden sind.

Schaltungseinrichtung

Eine Schaltungseinrichtung 1 umfasst: eine Schaltungsanordnung 10 mit einer Leiterplatte 11; eine Wärmesenke 20; und ein Wärmeableitungsfett G. Die Wärmesenke 20 weist einen Hauptplattenabschnitt 21, welcher der Leiterplatte zugewandt angeordnet ist, und Vorsprungsteile 23A und 23B auf, die von dem Hauptplattenabschnitt 21 in Richtung der Leiterplatte 11 hervorstehen und an die Leiterplatte anschließen, und ist ein Element, das an die Leiterplatte 11 geschraubt ist. Das Wärmeableitungsfett G ist ein Wärmeübertragungsmaterial, das zwischen der Leiterplatte 11 und dem Hauptplattenabschnitt 21 angeordnet ist und Fließvermögen aufweist. Der Hauptplattenabschnitt 21 weist auf einer Wärmeübertragungsfläche 21F, die der Leiterplatte 11 zugewandt ist, einen ersten Fettaufbringungsbereich 21G auf, an welchen das Wärmeableitungsfett G aufgetragen wird. Die Leiterplatte 11 weist eine Abschirmungswand 15 auf, die sich von einer Wärmeableitungsfläche 11F2, die dem Hauptplattenabschnitt 21 zugewandt ...

Verfahren zur Sichtbarmachung der Härtung einer UV-härtbaren Zusammensetzung durch Farbänderung

Circuit element for band-pass filter on printed circuit board, has ground conductor with conductive members arranged to achieve desired frequency characteristic

The circuit element includes a conductive pattern (17) formed in the inner layer of a dielectric substrate (11), to define the characteristic of the circuit element. A ground conductor (12) is formed on the outer layer of the dielectric substrate. The ground conductor is arranged e.g. in a grid pattern, and conductive members are arranged in those regions (15) without ground conductor. By changing the position of the conductive members, to alter the position and area of the regions (15) without ground conductor, the electromagnetic field distribution can be changed, to achieve the desired frequency characteristic. An Independent claim is included for a circuit board module.

Elektronisches Bauelement aus pflanzlichem Material

Elektronisches Bauelement (1) umfassend- ein Trägersubstrat (2) für elektronische Bauteile (16), die auf einer ersten (3) und/oder zweiten Fläche (4) des Trägersubstrats (2) aufgebracht sind,- eine zwischen der ersten Fläche (3) und der zweiten Fläche (4) des Trägersubstrats (2) ausgebildete elektrische Verbindung (5), wobei das Trägersubstrat (2) ein Rattanmaterial mit einer kapillaren Struktur ist, wobei die kapillare Struktur (13) zwischen der ersten (3) und der zweiten Fläche (4) verläuft und als elektrische Verbindung zumindest abschnittsweise zwischen der ersten und der zweiten Fläche (3, 4) des Trägersubstrats (2) dient.

System und Verfahren zur Verstärkung einer Anschlussfläche

Signal transmission line and circuit board

A signal line and a circuit board that can be easily bent in a U shape and prevent unwanted emission include a line portion includes a plurality of laminated line portion sheets made of a flexible material. Signal lines extend within the line portion in an x-axis direction. Ground lines are provided within the line portion on a positive direction side in a z-axis direction with respect to the signal lines and have line widths equal to or smaller than the line widths of the signal lines. Ground lines are provided within the line portion on a negative direction side in the z-axis direction with respect to the signal lines. The signal lines overlap the ground lines when seen in a planar view from the z-axis direction.

Wiring Design Support Apparatus and Wiring Design Support Method

According to one embodiment, a wiring design support apparatus comprises a display, a drawing module, and a data creation module. The display is configured to display a three-dimensional object. The drawing module is configured to draw a line connecting two points on a surface of the three-dimensional object displayed by the display. The data creation module is configured to create first three-dimensional data indicating a wiring based on the line drawn by the drawing module.

System and method of forming a patterned conformal structure

A system and method of forming a patterned conformal structure for an electrical system is disclosed. The conformal structure includes a dielectric coating shaped to conform to a surface of an electrical system, with the dielectric coating having a plurality of openings therein positioned over contact pads on the surface of the electrical system. The conformal structure also includes a patterned conductive coating layered on the dielectric coating and on the contact pads such that an electrical connection is formed between the patterned conductive coating and the contact pads. The patterned conductive coating comprises at least one of an interconnect system, a shielding structure, and a thermal path.

Curved touch sensor

A method of forming a curved touch surface is disclosed. The method can include depositing and patterning a conductive thin film on a flexible substrate to form at least one touch sensor pattern, while the flexible substrate is in a flat state. According to certain embodiments, the method can include supporting the flexible substrate in the flat state on at least one curved forming substrate having a predetermined curvature; and performing an anneal process, or an anneal-like high-heat process, on the conductive thin film, wherein the anneal process can cause the flexible substrate to conform to the predetermined curvature of the at least one curved forming substrate. According to an embodiment, the curved forming substrate can include a first forming substrate having a first predetermined curvature and a second forming substrate having a second predetermined curvature complementing the first predetermined curvature.

Multi-layer flexible printed circuit board for electronic device

A multi-layer Flexible Printed Circuit Board (FPCB) for an electronic device, in which a plurality of components are provided alternately on a top surface and a bottom surface of a base layer and the components are removed from the other region. The multi-layer FPCB includes a base layer, a first circuit pattern provided on a side region on a top surface of the base layer, a first adhesive layer provided in the first circuit pattern, a second circuit pattern provided on a bottom surface of the base layer and in an other-side region opposite to the side region, a second adhesive layer provided in the second circuit pattern, a first insulating/protecting layer provided on a top surface of the first adhesive layer, and a second insulating/protecting layer provided on a bottom surface of the second adhesive layer.

Carrier tape for tab-package and manufacturing method thereof

The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching.

Optical Printed Circuit Board and Method for Manufacturing the Same

Provided are an optical printed circuit board and a method for manufacturing the same. The optical printed circuit board includes a printed circuit board and an optical connecting module. The printed circuit board is provided with at least one or more inner layers, and a circuit pattern electrically connecting the inner layers. The optical connecting module is embedded in the printed circuit board and includes an optical transmitting portion, an optical receiving portion, and an optical waveguide connecting the optical transmitting portion and the optical receiving portion. The printed circuit board defines an align pattern region, such that tops of the optical transmitting portion and the optical receiving portion are formed lower than a surface of the printed circuit board.

Fabrication method of substrate

A fabricating method of a substrate board is provided. The substrate board includes a substrate having rigid areas and flexible areas, and at least an electronic component disposed on the substrate, wherein each of the rigid areas is thicker than the flexible areas. A patterned high-extensive material may be additionally disposed on the substrate to improve reliability thereof. The rigid areas and the flexible areas may be formed by molds or cutters. By using an above structure, the electronic component is less affected when the substrate is under stress, so that good characteristics are maintained.

Optical Printed Circuit Board and Method of Fabricating the Same

Provided are a photovoltaic apparatus and a manufacturing method thereof. The photovoltaic apparatus includes: substrate; a back electrode layer disposed on the substrate; a plurality of first intermediate layers disposed on the back electrode layer; a plurality of second intermediate layers disposed on the back electrode layer and each disposed between the first intermediate layers; light absorbing layers disposed on the first intermediate layers and the second intermediate layers; and a front electrode layer disposed on the light absorbing layer.

Multilayer stacked circuit arrangement with localized separation section

A multilayer stacked circuit arrangement with localized separation section, has a first flat cable and first signal transmission lines arranged on the first flat cable. A second flat cable is stacked on and bonded to the first flat cable. The second flat cable further has signal transmission lines arranged on it. A bonding substance layer is formed between a first non-separation section of the first flat cable and a second non-separation section of the second flat cable for properly stacking the first and second flat cables where the separation sections are spaced apart from each other. A conductive via extends between the first non-separation section and the second non-separation section. At least some of the second signal transmission lines of the second flat cable are connected through the conductive via to the first signal transmission lines of the first flat cable.

Flexible base material and flexible electronic device

The invention provides a flexible base material and a flexible electronic device. The flexible base material includes a flexible substrate having a first surface and a second surface opposite to the first surface. A first organic composite barrier layer is deposited on the first surface of the flexible substrate, wherein the first organic composite barrier layer applies a first stress to the flexible substrate. An anti-curved layer is deposited on the second surface of the flexible substrate, wherein the anti-curved layer applies a second stress, which is cancelled off more than 90% of the first stress, to the flexible substrate.

Base member

A base member includes: a core layer including: a plate-like body, made of aluminum oxide; and plural linear conductors, which penetrate through the plate-like body in a thickness direction of the plate-like body; a bonding layer, formed on at least one of a first surface and a second surface of the core layer; and a silicon layer or a glass layer, formed on the bonding layer.

Mitigation of block bending in a ring laser gyroscope caused by thermal expansion or compression of a circuit board

An apparatus includes a sheet of circuit board material, at least one electrically conductive trace positioned on the sheet of circuit board material, and at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically conductive trace. The apparatus further includes at least one deformation point configured to absorb stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to an object resisting expansion or compression.

STRESS BUFFER LAYER AND METHOD FOR PRODUCING SAME

[Problem to be Solved] 1. A stress buffer layer comprising: a plate-like base material which has a top surface and a bottom surface each covered by a pair of insulating material layers made of an insulating material having a Young's modulus smaller than anodic oxide of valve metal and in which many through holes penetrating through the top surface and the bottom surface are provided; an internal electrode filled in the many through holes and conductively connected directly or indirectly to an electronic component , wherein both ends of the internal electrode are formed so as to be substantially on the same plane as the top and bottom surfaces of the base material at a point in time before the internal electrode is connected to the electronic component.2. The stress buffer layer according to claim 1 , wherein the plate-like base material includes an anodic oxide layer made of anodic oxide of valve metal between the insulating material layers.3. The stress buffer layer according to claim 1 , wherein the insulating material is resin.4. The stress buffer layer according to claim 1 , further comprising an external conductive layer arranged on at least one of the top surface and the bottom surface of the plate-like base material and conductively connected to at least one of the many internal electrodes.5. A method for producing a stress buffer layer claim 1 , the method comprising: a process of preparing an oxide base material formed by anodic oxidation of valve metal and having a top surface and a bottom surface penetrated by many through holes; a process of filling an internal electrode in the many through holes; a process of removing at least a part of the top surface and the bottom surface of the oxide base material; a process of arranging at least in a void space obtained by removing the oxide base material claim 1 , an insulating material layer made of an insulating material having a Young's modulus smaller than the oxide base material claim 1 , so that an end ...

PRINTED WIRING BOARD AND METHOD OF MANUFACTURE THEREOF

A printed wiring board, including a printed wiring member which respectively has object conductor that is subjected to electromagnetic wave shielding on at least one surface of an insulating layer; and an electromagnetic wave shielding member which has an electromagnetic wave shielding layer composed of a low-resistance section and a high-resistance section on at least one surface of a base film. The printed wiring member and the electromagnetic wave shielding member are bonded together with interposition of insulating adhesive layers, and with arrangement of the electromagnetic wave shielding layer separately and in opposition so that the object conductor is covered. The electromagnetic wave shielding layer and the object conductor are composed of the same type of conductive material, and the electromagnetic wave shielding layer is not exposed at the circumferential end faces of the printed wiring board. 1. A printed wiring board , comprising:a printed wiring member which respectively has an object conductor that is subjected to electromagnetic wave shielding on at least one surface of an insulating layer; andan electromagnetic wave shielding member which has an electromagnetic wave shielding layer composed of a low-resistance section and a high-resistance section on at least one surface of a base film;wherein said printed wiring member and said electromagnetic wave shielding member are bonded together with interposition of an insulating adhesive layer, and with arrangement of said electromagnetic wave shielding layer separately and in opposition so that said object conductor is covered;said electromagnetic wave shielding layer and said object conductor are composed of the same type of conductive material; andsaid electromagnetic wave shielding layer is not exposed at a circumferential end face of said printed wiring board.2. The printed wiring board according to claim 1 , wherein said electromagnetic wave shielding layer is separated from a via hole or through ...

THINNED FINGER SENSOR AND ASSOCIATED METHODS

An electronic device may include a housing with a connector member opening therein, electronic circuitry within the housing, and a finger sensor assembly carried by the housing. The finger assembly may include a thinned finger sensing integrated circuit (IC) secured to the housing that has a thickness less than 200 microns. The finger sensor assembly may also include a connector member extending through the connector member opening in the housing and coupling together the thinned finger sensing IC and the electronic circuitry. The thinned finger sensing IC may be adhesively secured to the housing, such as using a pressure sensitive adhesive, and the thinned finger sensing IC may conform to a non-planar surface. 132-. (canceled)33. An electronic device comprising:a housing having at least one connector member opening therein;a thinned finger sensing integrated circuit (IC) carried by said housing and having a thickness less than 200 microns; andat least one connector member coupled to said thinned finger sensing IC and extending through the at least one connector member opening in said housing.34. The electronic device according to wherein said thinned finger sensing IC comprises a monocrystalline substrate.35. The electronic device according to wherein said housing has a non-planar surface; and wherein said thinned finger sensing IC is secured to the non-planar surface and conforms in shape thereto.36. The electronic device according to further comprising an adhesive layer adhesively securing said thinned finger sensing IC to said housing.37. The electronic device according to wherein said adhesive layer comprises a pressure sensitive adhesive.38. The electronic device according to wherein said thinned finger sensing IC has a thickness less than 50 microns.39. The electronic device according to wherein said thinned finger sensing IC comprises a finger sensing area and a plurality of bond pads adjacent thereto; and wherein said at least one connector member comprises ...

Driving printed circuit board and liquid crystal display device including the same

The present disclosure discloses a driving printed circuit board (PCB) for use in a display device. More particularly, a driving printed circuit board improving the bonding by preventing PCB warpage is provided. The rear surface stiffener plate includes polygonal patterns to prevent a PCB warpage of the driving printed circuit board due to different heat shrinkage from that of the board during the surface mounting technology (SMT) process.

Flexible Circuit Sheet

A flexible circuit assembly can include a base layer, a plurality of circuit traces and an insulative layer. The plurality of circuit traces can each be coupled to a pair of circuit pads, and the circuit traces can be formed on an upper side of the base layer. The insulative layer can be formed over the circuit traces to isolate the circuit traces from an external environment. The base layer, plurality of circuit traces and insulative layer can form a flexible circuit sheet. The base layer and the insulative layer can include material properties and a thickness configured to facilitate the flexible circuit sheet being flexible such that the flexible circuit sheet is adapted to conform to a non-planar surface of the medical device. 1. A flexible circuit assembly for a navigated medical instrument , comprising:a base layer;a plurality of circuit traces each coupled to a pair of circuit pads, the circuit traces formed on an upper side of the base layer; andan insulative layer formed over the circuit traces to isolate the circuit traces from an external environment, wherein the base layer, plurality of circuit traces and insulative layer form a flexible circuit sheet;wherein the base layer and the insulative layer include material properties and a thickness configured to facilitate the flexible circuit sheet being flexible such that the flexible circuit sheet is adapted to conform to a non-planar surface of the medical device.2. The flexible circuit assembly of claim 1 , wherein the flexible circuit sheet includes a thickness of approximately 0.05 mm.3. The flexible circuit assembly of claim 2 , wherein the flexible circuit sheet includes a thickness of 0.04 mm.4. The flexible circuit assembly of claim 1 , wherein the base layer and the insulative layer are formed from polyimide or a photoimageable coverlay.5. The flexible circuit assembly of claim 1 , further comprising an adhesive configured to contact a lower side of the base layer and adapted to adhere the flexible ...

CONDUCTIVE STRUCTURE BODY AND METHOD FOR MANUFACTURING THE SAME

An exemplary embodiment of the present invention relates to a conductive structure body that comprises a darkening pattern layer having AlOxNy, and a method for manufacturing the same. The conductive structure body according to the exemplary embodiment of the present invention may prevent reflection by a conductive pattern layer without affecting conductivity of the conductive pattern layer, and improve a concealing property of the conductive pattern layer by improving absorbance. Accordingly, a display panel having improved visibility may be developed by using the conductive structure body according to the exemplary embodiment of the present invention. 1. A conductive structure body , comprising:a substrate;a conductive pattern layer; and{'sub': x', 'y, 'a darkening pattern layer comprising AlON(0≦x≦1.5, 0≦y≦1),'}wherein x and y mean ratios of numbers of O and N atoms to one Al atom, respectively.2. The conductive structure body according to claim 1 , wherein a thickness of the darkening pattern layer is 10 nm or more and 400 nm or less.3. The conductive structure body according to claim 1 , wherein the darkening pattern layer further comprises at least one selected from the group consisting of a dielectric material claim 1 , metal and mixture thereof.4. The conductive structure body according to claim 3 , wherein the dielectric material is selected from the group consisting of SiO claim 3 , SiO claim 3 , MgF claim 3 , and SiNz (z is an integer of 1 or more).5. The conductive structure body according to claim 3 , wherein the metal is selected from the group consisting of Fe claim 3 , Co claim 3 , Ti claim 3 , V claim 3 , Cu claim 3 , Al claim 3 , Au claim 3 , and Ag.6. The conductive structure body according to claim 1 , wherein the darkening pattern layer has an area of 80 to 120% of an area where the conductive pattern layer is occupied.7. The conductive structure body according to claim 1 , wherein a line width of the darkening pattern layer is the same as or ...

Wiring board and method for manufacturing the same

A wiring board includes a first multilayer wiring board having first conductive layers and having a surface, a second multilayer wiring board having second conductive layers and positioned such that the second multilayer wiring board has a surface facing the surface of the first multilayer wiring board, and an adhesive layer including an adhesive sheet and interposed between the first multilayer wiring board and the second multilayer wiring board such that the adhesive layer is adhering the first multilayer wiring board and the second multilayer wiring board. The first multilayer wiring board has a first pad on the surface of the first multilayer wiring board, the second multilayer wiring board has a second pad on the surface of the second multilayer wiring board, and the first pad and the second pad are positioned such that the first pad and the second pad face each other across the adhesive layer.

FLEXIBLE PRINTED CIRCUIT BOARD AND COMBINATION THEREOF

A flexible printed circuit board for connecting external modules, includes a high-frequency signal wiring board and a low-frequency signal wiring board. Side edges of the high-frequency signal wiring board and the low-frequency signal wiring board are connected to each other. The low-frequency signal wiring board is folded toward the high-frequency signal wiring board to form a stacked double-layer board structure. Each of two ends of the high-frequency signal wiring board extends to form a connecting board for connecting the external module. A flexible printed circuit board combination includes two flexible printed circuit boards. 1. A flexible printed circuit board , for connecting external modules , comprising:a high-frequency signal wiring board and a low-frequency signal wiring board,wherein side edges of the high-frequency signal wiring board and the low-frequency signal wiring board are connected to each other, the low-frequency signal wiring board is folded toward the high-frequency signal wiring board to form a stacked double-layer board structure, and each of two ends of the high-frequency signal wiring board extends to form a connecting board for connecting the external module.2. The flexible printed circuit board according to claim 1 , wherein at least one groove is formed at a folded position of the high-frequency signal wiring board and the low-frequency signal wiring board.3. The flexible printed circuit board according to claim 2 ,wherein each of the connecting boards is provided with a plurality of high-frequency signal contacts and a plurality of low-frequency signal contacts;wherein the high-frequency signal wiring board is provided with a plurality of high-frequency signal traces correspondingly connected to the high-frequency signal contacts on the two connecting boards;wherein the low-frequency signal wiring board is provided with at least one low-frequency signal trace correspondingly connected to the low-frequency signal contacts on the two ...

Semiconductor package substrate and method, in particular for mems devices

A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described.

METHOD FOR PRODUCING A CIRCUIT BOARD CONSISTING OF A PLURALITY OF CIRCUIT BOARD AREAS AND CIRCUIT BOARD

For a method for producing a circuit board consisting of a plurality of circuit board areas, wherein the individual circuit board areas comprise at least one layer made of an in insulating base material and a conducting pattern located on or in the base material, the following is provided: a substrate material, at least one registration mark formed in the substrate material, a first circuit board area arranged on the substrate material, at least one additional circuit board area, which substantially adjoins the first circuit board area or at least partially overlaps the first circuit board, the additional circuit board areas being oriented relative to the registration mark, and a plurality of connections of the conducting patterns of the first circuit board area and of the at least one additional circuit board area. Thus improved registration and orientation can be achieved when circuit board areas are coupled. 1. A method for producing a circuit board consisting of a plurality of circuit board areas , wherein the individual circuit board areas comprise at least one layer made of an in particular insulating base material and a conducting or conductive pattern located on or in the base material , said method comprising the steps of:providing a substrate material,forming at least one registration mark in the substrate material,arranging a first circuit board area on the substrate material while orienting the first circuit board area relative to the registration mark, andconnecting the conducting or conductive pattern of the first circuit board area to the conducting or conductive pattern of at least one further circuit board area, comprising the following additional step:arranging the at least one additional circuit board area adjoining the first circuit board area, or at least partially overlapping the first circuit board area, on the same or common surface of the substrate material while orienting the same relative to the registration mark.2. The method according to ...

METHOD OF PRODUCTION OF MULTILAYER CIRCUIT BOARD

A method of production of a multilayer circuit board comprising using a curable composition which contains a heat curable resin and curing agent (I) to form an uncured or semicured resin layer on a board (step A), then bringing a curing agent (II) able to substantially to cure the heat curable resin at a temperature at which the curing agent (I) cannot substantially cure the heat curable resin into contact with the surface of the resin layer, then heating the resin layer at a temperature at which the curing agent (I) cannot substantially cure the heat curable resin and the curing agent (II) can substantially cure the heat curable resin (step B), next heating and curing the resin layer at a temperature at which the curing agent (I) can substantially cure the heat curable resin to form an electrical insulating layer (step C). 1. A method of production of a multilayer circuit board comprising using a curable composition which contains a heat curable resin and curing agent (I) to form an uncured or semicured resin layer on a board (step A) , then bringing a curing agent (II) able to substantially to cure the heat curable resin at a temperature at which the curing agent (I) cannot substantially cure the heat curable resin into contact with the surface of the resin layer , then heating the resin layer at a temperature at which the curing agent (I) cannot substantially cure the heat curable resin and the curing agent (II) can substantially cure the heat curable resin (step B) , next heating and curing the resin layer at a temperature at which the curing agent (I) can substantially cure the heat curable resin to form an electrical insulating layer (step C).2. The method of production of the multilayer circuit board as set forth in claim 1 , wherein claim 1 , at step A claim 1 , the uncured or semicured resin layer is formed by bonding a film shaped or sheet shaped article of the curable composition to the surface of the board.3. The method of production of the multilayer ...

DATA TRANSMISSION THROUGH OPTICAL VIAS

Technologies generally described herein relate to multilayer circuit boards with optical vias for data transmission between the layers. One or more regions may be created on a multilayer circuit board for optical vias. A transparent conducting oxide (TCO) layer can be deposited on a top and/or bottom layer of the circuit board. P-N junctions can be created over the TCO layer about the one or more regions to form optical vias as photo-emitting and/or photo-detecting components. The photo-emitting and/or photo-detecting components may be coupled to electronic components on the multilayer circuit board. 1. A multilayer circuit board with optical vias for data transmission between two or more layers , the circuit board comprising:a circuit board with two or more conductive layers separated by a dielectric layer;an optical via configured to provide an optical transmission path between the two or more layers of the circuit board;a transparent conducting oxide layer deposited on a top layer of the circuit board;a photo-emitter component coupled to one end of the optical via and configured to convert incident electrical signals to optical signals; anda photo-detector component coupled to another end of the optical via and configured to convert the optical signals to received electrical signals.2. The multilayer circuit board according to claim 1 , the photo-emitter component comprising either: a light emitting diode (LED) or a laser diode.3. The multilayer circuit board according to claim 1 , wherein the photo-emitter component comprises a p-n junction formed in the transparent conducting oxide layer.4. The multilayer circuit board according to claim 1 , wherein the transparent conducting oxide layer comprises one of SnO claim 1 , ZnO claim 1 , and ITO.5. The multilayer circuit board according to claim 1 , the photo-detector component comprising one or more of a p-n junction photodiode claim 1 , a p-i-n photodiode claim 1 , an avalanche photodiode claim 1 , and/or a metal- ...

FLEXIBLE PRINTED CIRCUIT BOARD INTEGRATED WITH REINFORCING PLATE, AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD INTEGRATED WITH REINFORCING PLATE

An object of the present invention is to provide (i) a stiffener-integrated flexible printed circuit board in which a defect such as a blistering is not generated during a reflow process even though a stiffener is attached to a photosensitive resin composition, and (ii) a method for manufacturing the stiffener-integrated flexible printed circuit board. The object can be attained by causing a stiffener-integrated flexible printed circuit board to have a structure in which (A) a stiffener (), (B) a bonding material (), (C) a cured film obtained by curing a photosensitive resin composition (), and (D) a flexible printed circuit board () are laminated in this order. 1. A stiffener-integrated flexible printed circuit board having a structure in which (A) a stiffener , (B) a bonding material , (C) a cured film obtained by curing a photosensitive resin composition , and (D) a flexible printed circuit board are laminated in this order.2. The stiffener-integrated flexible printed circuit board as set forth in claim 1 , wherein the stiffener-integrated flexible printed circuit board has a peel strength of not less than 1N/cm between (B) the bonding material and (C) the cured film obtained by curing a photosensitive resin composition.3. The stiffener-integrated flexible printed circuit board as set forth in claim 1 , wherein (B) the bonding material is a thermosetting adhesive.4. A stiffener-integrated flexible printed circuit board having a structure in which (A) a stiffener claim 1 , (C) a cured film obtained by curing a photosensitive resin composition claim 1 , and (D) a flexible printed circuit board are laminated in this order.5. The stiffener-integrated flexible printed circuit board as set forth in claim 1 , wherein the photosensitive resin composition contains (E) a thermosetting resin containing a reactive group reactive with a carboxyl group and (F) a carboxyl group-containing resin.6. The stiffener-integrated flexible printed circuit board as set forth in claim 5 , ...

Printed circuit board and method of manufacturing the same

A printed circuit board and a method of manufacturing the printed circuit board are disclosed. In an embodiment of the present invention, the method of manufacturing a printed circuit board can include: providing a pair of conductive layers, in which roughness of one surface of one of the pair of conductive layers is different from roughness of one surface of the other of the pair of conductive layers; and stacking the pair of the conductive layers on a dielectric layer such that one surface of one of the pair of conductive layers faces one surface of the dielectric layer and one surface of the other of the pair of conductive layers faces another surface of the dielectric layer.

MOTOR CONTROL DEVICE

A motor control device includes a circuit board having a control circuit controlling electric power to be supplied to a motor, a base fixedly supporting the circuit board, a flexible printed circuit supplying electric power to the motor, a pin terminal disposed on the circuit board, being electrically connected with the control circuit, a dummy pin terminal disposed on the circuit board, being electrically free from the control circuit, a wiring pattern land disposed on the FPC, being electrically connected with the pin terminal, and a dummy wiring pattern land disposed on the FPC, being connected with the dummy pin terminal. 1. A motor control device , comprising:a circuit board having a control circuit controlling electric power to be supplied to the motor;a base fixedly supporting the circuit board;a flexible printed circuit (FPC) supplying electric power to the motor;a pin terminal disposed on the circuit board, being electrically connected with the control circuit;a dummy pin terminal disposed on the circuit board, being electrically free from the control circuit;a wiring pattern land disposed on the FPC, being electrically connected with the pin terminal; anda dummy wiring pattern land disposed on the FPC, being connected with the dummy pin terminal.2. The motor control device according to claim 1 , wherein the dummy pin terminal and the dummy wiring pattern land are disposed toward a side claim 1 , where the FPC is drawn to the motor claim 1 , than the pin terminal and the wiring pattern land claim 1 , respectively.3. The motor control device according to claim 1 , wherein each of the dummy pin terminal and the dummy wiring pattern land is disposed in plural and same number.4. The motor control device according to claim 1 , wherein the dummy pin terminal and the dummy wiring pattern land are disposed outward than the pin terminal and the wiring pattern land claim 1 , respectively.5. The motor control device according to claim 1 , further comprising a FPC ...

Printed circuit board (PCB) connecting cable and manufacturing method thereof

A light emitting diode (LED) connecting cable is provided. The LED connecting cable includes a conductive strip which is formed as a metallic semicircular rod and which includes a plurality of connecting pins or connecting pads to be connected to an externally-provided printed circuit board (PCB) in a blockwise unit, an outer protection casing formed from an insulating material on an upper surface of the conductive strip, and an antishocking material charged in between the conductive strip and the outer protection casing, wherein the PCB includes a fixing support formed therein to fix the outer protection casing.

STARTING MATERIAL AND PROCESS FOR PRODUCING A SINTERED JOIN

The present invention relates to a starting material for producing a sintered join. In order to avoid the formation of cracks in the case of fluctuating thermal loading, the starting material comprises second particles in addition to metallic first particles which at least proportionately contain elemental silicon and/or silicon dioxide. In addition, the present invention relates to the use of elemental silicon and/or silicon dioxide for reducing the coefficient of thermal linear expansion α of a starting material of a sintered join or of a sintered join in particular in a sintered paste, a sintered powder or a sintered material preform. Furthermore, the present invention relates to sintered joins to electronic circuits and also to processes for forming a thermally and/or electrically conductive sintered join. 2. The starting material as claimed in claim 1 , wherein the elemental silicon and/or silicon dioxide is amorphous elemental silicon and/or amorphous silicon dioxide.320. The starting material as claimed in claim 1 , wherein the second particles () are spherical.42021. The starting material as claimed in claim 1 , wherein the second particles () have a particle core () composed of elemental silicon and/or silicon dioxide.520212222. The starting material as claimed in claim 1 , wherein the second particles () have a particle core () with a second coating () applied thereto claim 1 , where the second coating () comprises at least one metal selected from the group consisting of silver claim 1 , platinum claim 1 , palladium claim 1 , gold claim 1 , tin and combinations thereof.610. The starting material as claimed in claim 1 , wherein the first particles () are noble metal-containing and/or copper-containing.7101112. The starting material as claimed in claim 1 , wherein the first particles () have a particle core () with a first coating () applied thereto.8303010. The starting material as claimed in claim 1 , wherein the starting material further comprises third ...

Heavy-wire bond arrangement and method for producing same

The invention relates to a heavy-wire bond arrangement, having a substrate ( 2 ), a heavy wire ( 1 ) and a high-voltage heavy-wire bond connection, in which an end bond section ( 4 ) of the heavy wire ( 1 ), which extends towards the end ( 7 ) of the heavy wire ( 1 ), is bonded to the substrate ( 2 ), such that in the area of the bond section ( 4 ) a bond contact ( 5 ) between the heavy wire ( 1 ) and the substrate ( 2 ) is formed, the heavy wire ( 1 ) having a tapering section ( 6 ) which adjoins the end of the wire ( 7 ) and in which the wire cross-section tapers towards the end of the wire ( 7 ). The application additionally relates to a method for producing a heavy-wire bond arrangement.

Programmable breadboard matrix interconnection box

The present device is a programmable breadboard matrix interconnection box capable of receiving data from a computer or controller and automatically establishing connections between contact points. A conductor layer, a magnetic layer, and a contact layer are used to automate the connections between contact points. The conductor layer provides conductors which move between ‘ON’ and ‘OFF’ positions and rows/columns which can receive electric current. The magnetic layer provides a necessary magnetic field. The contact layer connects the conductor to the designated contact point. A controller activates each conductor using the Laplace Force generated by the magnetic field and electric current.

DISPLAY UNIT

In a display unit, measures against dropping of screws can be realized at low cost. The display unit includes: a wiring substrate in which wiring that is led out from a display panel is provided; a screw that fixes the wiring substrate to the display unit; and a substrate cover that covers the wiring substrate. The substrate cover has a screw covering region that covers a head of the screw, and part of the periphery of the screw covering region is separated from the other area of the substrate cover. 1. A display unit provided with a display panel , comprising:a wiring substrate in which wiring that is led out from the display panel is provided;a screw that fixes the wiring substrate to the display unit; anda substrate cover that covers the wiring substrate,wherein the substrate cover has a screw covering region that covers a head of the screw, andpart of the periphery of the screw covering region is separated from the other area of the substrate cover.2. The display unit according to claim 1 , wherein the substrate cover is formed of resin.3. The display unit according to claim 1 , wherein the screw covering region is separated from the other area of the substrate cover by a slit that is cut in part of the periphery of the head of the screw.4. The display unit according to claim 1 ,wherein the screw covering region is rectangular or triangular, andone side of the rectangular or triangular screw covering region is connected to the other area of the substrate cover, and the other sides thereof are separated from the other area of the substrate cover.5. The display unit according to claim 1 , further comprising a lighting device that has a light emitting surface that emits planar light and is disposed opposite to the display panel claim 1 ,wherein the wiring substrate is connected to the display panel via a flexible printed circuit, and is arranged on a back surface of the lighting device on a side opposite to the light emitting surface, andin the back surface of the ...

ELECTRONIC DEVICE

An electronic device includes a conductor plate, a circuit board placed with a distance to a surface of the conductor plate, a connector provided on the circuit board, a flexible cable having one end connected to the connector and laid down along the surface of the conductor plate, and a cable holding member which includes a sloped holding surface for holding at least part of a portion of the flexible cable ranging from the connector to the surface of the conductor plate and which is electrically connected to the conductor plate. 1. An electronic device comprising:a conductor plate;a circuit board placed with a distance to a surface of the conductor plate;a connector provided on the circuit board;a flexible cable having one end connected to the connector and laid down along the surface of the conductor plate; anda cable holding member which includes a sloped holding surface for holding at least part of a portion of the flexible cable ranging from the connector to the surface of the conductor plate and which is electrically connected to the conductor plate.2. The electronic device according to claim 1 , wherein the cable holding member is part of the conductor plate.3. The electronic device according to claim 1 , wherein the holding surface of the cable holding member extends from an edge of the circuit board to the surface of the conductor plate.4. The electronic device according to claim 1 , wherein the cable holding member is electrically connected to a ground provided on the circuit board.5. The electric device according to claim 1 , wherein the cable holding member is not contacted to a ground provided on the circuit board.6. The electronic device according to claim 1 , further comprising a bonding member for bonding the flexible cable to the holding surface of the cable holding member and the surface of the conductor plate.7. The electronic device according to claim 6 , wherein the bonding member is insulative.8. The electronic device according to claim 6 , ...

COMPONENT ASSEMBLY

A component assembly that can be easily built in a main substrate with high accuracy is formed such that a glass transition temperature of a built-in-component layer of an assembly substrate in which multiple capacitors are embedded is higher than a glass transition temperature of a built-in-component layer of a built-in-component substrate. Thus, thermal deformation of the component assembly is prevented when the built-in-component substrate in which the component assembly is built is heated during reflow, for example. The component assembly can thus be highly accurately built in the built-in-component substrate. Moreover, when the component assembly in which the multiple capacitors are embedded is built in the built-in-component substrate, electrode pads of the component assembly in which the multiple capacitors are embedded can be electrically connected to wiring layers of the built-in-component substrate by soldering despite the variation in height among the capacitors. 1. A component assembly provided in a layer of a main substrate , the component assembly comprising:an assembly substrate provided in the layer of the main substrate; anda plurality of electronic components provided in a layer of the assembly substrate; whereina glass transition temperature of the layer of the assembly substrate is higher than a glass transition temperature of the layer of the main substrate.2. The component assembly according to claim 1 , wherein a plurality of electrode pads are provided on a first main surface of the assembly substrate claim 1 , and each of the plurality of electronic components is electrically connected to a corresponding one of the electrode pads.3. The component assembly according to claim 1 , wherein the layer of the assembly substrate and the layer of the main substrate are both resin layers.4. The component assembly according to claim 1 , wherein at least one of the plurality of electronic components is a capacitor.5. The component assembly according to ...

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

A wiring board assembly includes: a plurality of insulating substrates of which each includes an insulating layer and a wiring layer; a wiring board that includes pads formed on the insulating substrate; and a semiconductor component that is joined on the pads by using solder bumps. The wiring board embeds a stiffening member whose thickness is thinner than that of the insulating layer and whose thermal expansion coefficient is smaller and Young's modulus is higher than those of the wiring layer and the insulating layer. 1. A wiring board comprising:an insulating substrate that includes at least one insulating layer;a wiring layer that is held in the insulating substrate and forms wiring; anda restraint member that is placed within a range of a thickness of the insulating substrate and of which a thermal expansion coefficient is smaller than thermal expansion coefficients of the wiring and the insulating substrate.2. The wiring board according to claim 1 , further comprising a pad that is located on the insulating substrate and mounts thereon a component claim 1 ,wherein the restraint member is placed on a straight line that extends from the pad in a thickness direction of the insulating substrate.3. The wiring board according to claim 2 , wherein the thermal expansion coefficient of the insulating substrate is larger than the thermal expansion coefficient of the component.4. The wiring board according to claim 1 , wherein the restraint member is placed on a straight line that extends from an angular portion of a polygonal component in a thickness direction of the insulating substrate.5. The wiring board according to claim 1 , whereinthe insulating substrate is divided into a plurality of insulating layers by the wiring layer, andthe restraint member is placed, among the plurality of insulating layers, in at least one the insulating layer within a range of a thickness of the at least one insulating layer.6. The wiring board according to claim 4 , further comprising ...

TOUCH PANEL AND TOUCH DISPLAY PANEL

A touch panel includes a substrate, a transparent sensor electrode pattern, a patterned compensation electrode, a passivation layer, a transparent shielding electrode and at least one connection structure. The substrate has a surface and includes a sensor region and a peripheral region. The transparent sensor electrode pattern is disposed on the surface of the substrate and in the sensor region. The patterned compensation electrode is disposed on the surface of the substrate and in the peripheral region, and the patterned compensation electrode and the transparent sensor electrode pattern are electrically isolated. The passivation layer is disposed on the surface of the substrate, covers the transparent sensor electrode pattern, and at least partially exposes the patterned compensation electrode. The transparent shielding electrode is disposed on the passivation layer. The connection structure is electrically connected to the transparent shielding electrode and the patterned compensation electrode exposed by the passivation layer. 1. A touch panel , comprising:a substrate having a surface, the substrate comprising a sensor region and a peripheral region;a transparent sensor electrode pattern, disposed on the surface of the substrate and in the sensor region;a patterned compensation electrode, disposed on the surface of the substrate and in the peripheral region, the patterned compensation electrode being electrically isolated from the transparent sensor electrode pattern;a passivation layer, disposed on the surface of the substrate, the passivation layer covering the transparent sensor electrode pattern and at least partially exposing the patterned compensation electrode;a transparent shielding electrode, disposed on the passivation layer; andat least one connection structure, electrically connected to the transparent shielding electrode and the patterned compensation electrode exposed by the passivation layer.2. The touch panel of claim 1 , wherein the patterned ...

THERMAL EXPANSION COMPENSATORS FOR CONTROLLING MICROELECTRONIC PACKAGE WARPAGE

The present description relates to the field of fabricating microelectronic packages, wherein a microelectronic device may be attached to a microelectronic substrate with a compensator to control package warpage. The warpage compensator may be a low coefficient of thermal expansion material, including but not limited to silicon or a ceramic material, which is positioned on a land-side of the microelectronic device to counteract the thermal expansion effects of the microelectronic device. 1. A microelectronic package , comprising:a microelectronic substrate;a microelectronic device attached to the microelectronic substrate; anda warpage compensator positioned adjacent the microelectronic substrate on a land side of the microelectronic device.2. The microelectronic package of claim 1 , wherein the warpage compensator has substantially the same coefficient of thermal expansion as the microelectronic device.3. The microelectronic package of claim 1 , wherein the warpage compensator is substantially the same material as a material used to form the microelectronic device.4. The microelectronic package of claim 1 , wherein the warpage compensator comprises a silicon-containing material.5. The microelectronic package of claim 1 , wherein the warpage compensator comprises a ceramic material.6. The microelectronic package of claim 5 , wherein the ceramic material may be selected from the group comprising silicon carbide claim 5 , silicon nitride claim 5 , aluminum nitride claim 5 , and ceramic glass.7. The microelectronic package of claim 1 , wherein the warpage compensator comprises a functional microelectronic device.8. A microelectronic package claim 1 , comprising:a microelectronic interposer has at least one conductive route extending for a device attachment surface of the microelectronic interposer to an opposing back surface of the microelectronic interposer;a microelectronic device attached to the microelectronic interposer device attachment surface; anda warpage ...

Method Of Preparing A Flexible Substrate Assembly And Flexible Substrate Assembly Therefrom

Some embodiments include a method of preparing a flexible substrate assembly. Other embodiments of related methods and structures are also disclosed. 1) A method comprising:providing a carrier substrate;{'sup': '−4', 'providing a cross-linking adhesive, the cross-linking adhesive being configured to outgas at a rate of less than approximately 2×10Torr-liters per second;'}providing a plastic substrate; andcoupling the carrier substrate to the plastic substrate using the cross-linking adhesive.2) The method of wherein: depositing the cross-linking adhesive over a first surface of the carrier substrate;', 'spinning the carrier substrate and the cross-linking adhesive to distribute the cross-linking adhesive over the first surface of the carrier substrate; and', 'placing a first surface of the plastic substrate over the first surface of the carrier substrate with the cross-linking adhesive located between the first surface of the plastic substrate and the first surface of the carrier substrate., 'coupling the carrier substrate to the plastic substrate comprises3) The method of wherein:coupling the carrier substrate to the plastic substrate comprises depositing the cross-linking adhesive over a first surface of the carrier substrate using at least one of the following techniques: spin-coating, spray-coating, extrusion coating, preform lamination, slot die coating, or screen lamination.4) The method of further comprising:after coupling the carrier substrate to the plastic substrate, removing the plastic substrate from the carrier substrate.5) The method of further comprising:after coupling the carrier substrate to the plastic substrate, fabricating one or more electrical components over a surface of the plastic substrate.6) The method of further comprising at least one of:thermally curing the cross-linking adhesive after coupling the carrier substrate to the plastic substrate;curing the cross-linking adhesive with ultraviolet light after coupling the carrier substrate to ...

DEVICE FOR IMPROVING ANTENNA RECEIVING SENSITIVITY IN PORTABLE TERMINAL

A device for improving antenna receiving sensitivity in a portable terminal includes an antenna in a low-frequency band of less than 900 MHz which is mounted on a predetermined position in a body housing and a touch pad unit connected to the vicinity of the antenna through a FPCB (Flexible Printed Circuit Board), in which the touch pad unit is grounded to a nearby body in the vicinity of the touch pad unit by using a conductive portion to block noise generated in the touch pad unit, thereby improving the antenna receiving sensitivity. 1. A device for improving antenna receiving sensitivity in a portable terminal , comprising:an antenna;a touch pad unit disposed in the vicinity of the antenna;a display bracket on which the touch pad unit is disposed; anda conductive portion disposed between the display bracket and the touch pad unit to couple noise introduced from the touch pad unit toward the display bracket and to block an introduction of the noise to the antenna.2. The device of claim 1 , wherein the display bracket is formed of a magnesium alloy material claim 1 , and the display bracket comprises an extension portion extending therefrom toward the touch pad unit such that the touch pad unit is disposed on the extension portion.3. The device of claim 2 , wherein the conductive portion comprises a conductive both-side tape to allow the touch pad unit and the extension portion to be conductive.4. The device of claim 3 , wherein the touch pad unit comprises:a touch pad layer;a signal line layer coupled to a bottom surface of the touch pad layer; anda first ground layer coupled to a bottom surface of the signal line layer.5. The device of claim 4 , wherein the conductive portion is coupled between the first ground layer and the extension portion to allow the first ground layer and the extension portion to be conductive.6. The device of claim 4 , wherein a partial area of the bottom surface of the first ground layer is open and contacts the conductive portion claim 4 ...

TRANSPARENT CONDUCTIVE ELEMENT, INPUT DEVICE, AND DISPLAY DEVICE

A transparent conductive element includes an optical layer provided with a wave surface that has an average wavelength smaller than or equal to a wavelength of visible light and a transparent conductive layer formed on the wave surface so as to follow the shape of the wave surface. When the average wavelength of the wave surface is λm and an average amplitude of vibration of the wave surface is Am, the ratio (Am/λm) is 0.2 or more and 1.0 or less; an average angle of sloped surfaces of the wave surface is in the range of 30° or more and 60° or less; and when a thickness of the transparent conductive layer at a highest position of the wave surface is D1 and a thickness of the transparent conductive layer at a lowest position of the wave surface is D3, a ratio D3/D1 is in the range of 0.8 or less. 111-. (canceled)12. A transparent conductive element comprising:an optical layer provided with a wave surface that has an average wavelength smaller than or equal to a wavelength of visible light; anda transparent conductive layer formed on the wave surface so as to follow the shape of the wave surface,wherein when the average wavelength of the wave surface is λm and an average amplitude of vibration of the wave surface is Am, a ratio (Am/λm) is 0.2 or more and 1.0 or less,an average angle of sloped surfaces of the wave surface is in the range of 30° or more and 60° or less, andwhen a thickness of the transparent conductive layer at a highest position of the wave surface is D1 and a thickness of the transparent conductive layer at a lowest position of the wave surface is D3, a ratio D3/D1 is in the range of 0.8 or less.13. The transparent conductive element according to claim 12 , wherein an area of a flat portion of the wave surface is 50% or less.14. The transparent conductive element according to claim 12 , wherein the thickness of the transparent conductive layer at the highest position of the wave surface is 100 nm or less.15. The transparent conductive element ...

COEFFICIENT OF THERMAL EXPANSION COMPENSATING COMPLIANT COMPONENT

An improved discrete electronic device and method of making the improved discrete electronic device is described. The discrete electronic device has an electronic passive component with a termination and a lead frame. A compensating compliant component is between the termination and the lead frame. The compensating compliant component has a composite core and a first conductor on the composite core. The first conductor is in electrical contact with the termination. A second conductor is also on the composite core wherein the second conductor is in electrical contact with the lead frame. 1. A discrete electronic device comprising:an electronic passive component comprising a termination;a lead frame;a compensating compliant component between said termination and said lead frame wherein said compensating compliant component comprises:a composite core;a first conductor on said composite core wherein said first conductor is in electrical contact with said termination; anda second conductor on said composite core wherein said second conductor is in electrical contact with said lead frame.2. The discrete electronic device of wherein said first conductor and said second conductor are on opposite faces of said composite core.3. The discrete electronic device of further comprising thru-hole plating electrically connecting said first conductor and said second conductor.4. The discrete electronic device of wherein said first conductor and said second conductor are symmetrical with respect to said composite core.5. The discrete electronic device of wherein said first conductor and said second conductor are not symmetrical with respect to said composite core.6. The discrete electronic device of wherein said first conductor and said second conductor are co-facial.7. The discrete electronic device of wherein said second conductor is a contact pad and said first conductor is an active pad.8. The discrete electronic device of further comprising a third conductor on said composite ...

Optical-electrical converting device

An optical-electrical converting device includes a first substrate, a planar waveguide, a bearing member, a reflective member, a second substrate, a laser beam emitting member, and a driving chip. The first substrate includes a supporting surface. The planar waveguide is supported on the supporting surface, and includes a laser beam incident surface. The bearing member is supported on the supporting surface, and includes a sloped surface aligned with the laser beam incident surface. The reflective member is positioned on the sloped surface. The second substrate is supported on both the bearing member and the planar waveguide. The second substrate comprising a lower surface and an upper surface. The laser beam emitting member is positioned on the lower surface, and includes a laser beam emitting surface aligned with the reflective member. The driving chip is positioned on the upper surface, and is electrically connected to the laser beam emitting member.

Patterned Substrates With Darkened Conductor Traces

The present disclosure provides an article having (a) a substrate having a first nanostructured surface that is antireflective when exposed to air and an opposing second surface; and (b) a conductor micropattern disposed on the first surface of the substrate, the conductor micropattern formed by a plurality of traces defining a plurality of open area cells. The micropattern has an open area fraction greater than 80% and a uniform distribution of trace orientation. The traces of the conductor micropattern have a specular reflectance in a direction orthogonal to and toward the first surface of the substrate of less than 50%. Each of the traces has a width from 0.5 to 10 micrometer. The articles are useful in devices such as displays, in particular, touch screen displays useful for mobile hand held devices, tablets and computers. They also find use in antennas and for EMI shields 115-. (canceled)16. An article comprising:a substrate having a first nanostructured surface that is antireflective when exposed to air and an opposing second surfaces; anda conductor micropattern disposed on the first surface of the substrate, the conductor micropattern formed by a plurality of traces defining a plurality of open area cells,wherein the micropattern has an open area fraction greater than 80% and a uniform distribution of trace orientation;wherein the traces of the conductor micropattern have a specular reflectance in a direction orthogonal to and toward the first surface of the substrate of less than 50%; andwherein each of the traces has a width from 0.5 to 10 micrometer.17. The article of claim 16 , wherein the nanostructured surface comprises nanofeatures having a height of from 50 to 500 nanometers.18. The article of claim 16 , wherein the nanostructured surface comprises nanofeatures having a height-to-width ration of 2 to 1.19. The article of claim 16 , wherein the nanostructured surface has a reflectance of between 0.05 to 1%.20. The article of claim 16 , wherein the ...

CIRCUIT MODULE AND METHOD OF MANUFACTURING SAME

A circuit module having satisfactory isolation characteristics and a method of manufacturing the same are such that electronic components are mounted on a principal surface of a circuit substrate. An insulating layer covers the principal surface of the circuit substrate and the electronic components. A groove is disposed in a principal surface of the insulating layer. A shielding layer covers the principal surface of the insulating layer and the inner surface of the groove. 19-. (canceled)10. A circuit module comprising:a substrate;an electronic component mounted on a principal surface of the substrate;an insulating layer that covers the principal surface of the substrate and the electronic component and that includes a recessed portion in a principal surface thereof; anda shielding layer that covers the principal surface of the insulating layer and an inner surface of the recessed portion; whereinthe shielding layer is made of a conductive material.11. The circuit module according to claim 10 , wherein the recessed portion is a groove.12. The circuit module according to claim 10 , wherein the recessed portion has a depth equal to or larger than a thickness of the insulating layer.13. The circuit module according to claim 10 , wherein the substrate includes a ground conductive layer claim 10 , and the shielding layer is connected to the ground conductive layer.14. The circuit module according to claim 10 , wherein the recessed portion comprises a plurality of recessed portions in the principal surface of the insulating layer claim 10 , and the plurality of recessed portions have a plurality of different depths.15. The circuit module according to claim 10 , wherein the substrate includes a conductive layer that faces the conductive material at a bottom of the recessed portion.16. The circuit module according to claim 10 , wherein the substrate includes a plurality of circuit blocks having different functions claim 10 , and the recessed portion is disposed at a border ...

Patterned Substrates With Darkened Multilayered Conductor Traces

The present disclosure provides an article having a substrate having opposing first and second surfaces. A conductor micropattern disposed on the first surface of the substrate. The conductor micropattern has a plurality of traces defining a plurality of cells. The conductor micropattern has an open area fraction greater than 80% and a uniform distribution of trace orientation. Each of the traces has a trace width from 0.5 to 10 micrometer. The conductor micropattern is a tri-layer material comprising in sequence a semi-reflective metal, a transparent layer, and a reflective layer disposed on the transparent layer. The articles are useful in devices such as displays, in particular, touch screen displays useful for mobile hand held devices, tablets and computers. They also find use in antennas and for EMI shields. 1. An article comprising:a substrate having opposing first and second surfaces; anda conductor micropattern disposed on the first surface of the substrate, the conductor micropattern comprising a plurality of traces defining a plurality of cells,wherein the conductor micropattern has an open area fraction greater than 80% and a uniform distribution of trace orientation; and each of the traces has a trace width from 0.5 to 10 micrometer, and{'claim-ref': {'@idref': 'CLM-00012', 'claims 12'}, 'b': '14', 'wherein the conductor micropattern is a tri-layer material comprising in sequence a semi-reflective metal, a transparent layer, and a reflective layer. NOTE: I would like for this claim not to be limited w.r.t. orientation of the tri-layer, relative to the substrate. The passage that I struck may imply a particular orientation (which, for example, would not be consistent with dependent -).'}2. The article of claim 1 , wherein the semi-reflective material is selected from the group consisting of titanium claim 1 , chromium claim 1 , aluminum claim 1 , nickel claim 1 , copper claim 1 , gold claim 1 , molybdenum claim 1 , platinum claim 1 , rhodium claim 1 , ...

Electronic device, electronic apparatus, method of manufacturing base substrate, and method of manufacturing electronic device

An electronic device has a package and a piezoelectric element accommodated in an accommodating space formed inside the package. The package has a frame-like metallization layer bonding a base substrate and a lid together and electrodes formed on and in the base substrate and electrically connected with the piezoelectric element. The metallization layer is insulated from the electrodes.

DYNAMIC LOOP WITH FOLD

A single layer dynamic loop is provided. A single layer dynamic loop includes a set of traces divided by a slit on the single layer dynamic loop, wherein the set of traces are divided into a first region and a second region; and wherein the single layer dynamic loop is folded along the slit to move at least part of the first region in relation to the second region. 1. A single layer dynamic loop , comprising:a set of traces divided by a slit on the single layer dynamic loop, wherein the set of traces are divided into a first region and a second region; andwherein the single layer dynamic loop is folded along the slit to move at least part of the first region in relation to the second region.2. The single layer dynamic loop of claim 1 , wherein the single layer dynamic loop is folded along the slit to move at least part of the first region behind the second region.3. The single layer dynamic loop of claim 1 , wherein the first region and the second region are of equal height after folding.4. The single layer dynamic loop of claim 1 , wherein the first region and the second region are of different height after folding.5. The single layer dynamic loop of claim 1 , wherein the first region is a region to be folded and the second region is a region not to be folded.6. The single layer dynamic loop of claim 1 , further comprising at least one of a spacer claim 1 , adhesive patch and damper claim 1 , at least partially disposed on the second region.7. The single layer dynamic loop of claim 1 , further comprising voice coil motor (VCM) lines claim 1 , wherein the VCM lines are at least partially folded behind the second region.8. The single layer dynamic loop of claim 7 , further comprising a shield layered above the VCM lines.9. The single layer dynamic loop of claim 8 , wherein if the shield is layered above the VCM lines claim 8 , the first region is folded toward the second region so that the shield is between the first region and the second region.10. A single layer ...

MULTI-LAYER MICROWAVE CORRUGATED PRINTED CIRCUIT BOARD AND METHOD

A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, an interconnect assembly includes a first flat flexible layer having a signal conductor and a ground conductor forming a first microstripline or microstrip transmission line, a second folded flexible layer having a signal conductor and a ground conductor forming a second microstripline or microstrip transmission line, the bottom surface of the second folded flexible layer having ridge portions, a non-conductive adhesive layer disposed between the top surface of the first flat flexible layer and the ridge portions of the second folded flexible layer, a signal through-hole extending through the non-conductive adhesive layer and the first flat flexible layer, and two ground through-holes extending through the non-conductive adhesive layer and the second folded flexible layer, wherein the two ground through-holes are disposed on opposite sides of the signal through-hole. 1. An interconnect assembly for a corrugated printed circuit board comprising:a first flat flexible layer having a top surface and a bottom surface and having a signal conductor and a ground conductor forming a first microstripline or microstrip transmission line;a second folded flexible layer having a top surface and a bottom surface and having a signal conductor and a ground conductor forming a second microstripline or microstrip transmission line, the bottom surface of the second folded flexible layer having ridge portions;a non-conductive adhesive layer disposed between the top surface of the first flat flexible layer and the ridge portions of the second folded flexible layer;a signal through-hole extending through the non-conductive adhesive layer and the first flat flexible layer, and connecting the signal conductor of the first flat flexible layer to the signal conductor of the second folded flexible layer; andtwo ground through-holes extending through the non-conductive adhesive layer and the second folded ...

Notched Display Layers

An electronic device may have a display mounted in a housing. The display may have layers such as polarizer layers, a color filter layer, and a thin-film transistor layer. Display layers such as color filter layers and thin-film-transistor layers may have glass substrates. Notches or other openings may be formed in the layers of a display. For example, a notch with a curved chamfered edge may be formed in a lower end of a thin-film-transistor layer. A component such as a button may overlap the notch. Structures such as sensors, cameras, acoustic components, and other electronic components, buttons, communications path structures such as flexible printed circuit cables and wire bonding wires, and housing structures may be received within a display layer notch. 1. An electronic device , comprising:a display having display layers;a notch in at least a given one of the display layers; anda component that is at least partly received within the notch.2. The electronic device defined in wherein the component comprises a button.3. The electronic device defined in wherein the button comprises a movable button member that overlaps the notch.4. The electronic device defined in wherein the given one of the display layers comprises a thin-film-transistor layer.5. The electronic device defined in wherein the notch has a curved edge.6. The electronic device defined in wherein the display layers comprise a color filter layer on the thin-film-transistor layer claim 5 , wherein the color filter layer is recessed relative to the thin-film-transistor layer to form a thin-film-transistor layer ledge claim 5 , and wherein the notch is formed from the ledge.7. The electronic device defined in wherein the component comprises a component selected from the group consisting of: a sensor claim 1 , a camera claim 1 , a button claim 1 , a light-emitting diode claim 1 , and an acoustic component.8. The electronic device defined in wherein the given one of the display layers comprises a thin-film- ...

PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

An electronic device comprises: a printed wiring board that comprises a substrate, pads formed on the substrate, and an insulating film layer covering a surface of the substrate on which the pads are formed; and an electronic element that comprises external terminals electrically connected to the pads and that is mounted on the printed wiring board. The insulating film layer comprises at least one connecting opening section each exposing at least part of one of the pads. At least part of an inner wall of the connecting opening section comprises at least one step section. 2. The printed wiring board according to claim 1 , wherein the step section is formed so that adhesive material can be applied on the step section.3. The printed wiring board according to claim 1 ,wherein the connecting opening section comprises: a first opening section formed for each of the pads so that at least part of each of the pads is exposed; and a second opening section that is formed on the first opening section and that is in communication with the first opening section,wherein an opening area of the second opening section is larger than an opening area of the first opening section, andwherein the step section is formed in an area where the first and second opening sections do not overlap.4. The printed wiring board according to claim 3 , wherein the first and second opening sections are formed on a one-to-one basis.5. The printed wiring board according to claim 4 , wherein the first and second opening sections are formed concentrically.6. The printed wiring board according to claim 3 , wherein the connecting opening section comprises a plurality of first opening sections claim 3 , and the second opening section overlaps with the plurality of first opening sections.7. The printed wiring board according to claim 1 , wherein the connecting opening section has a planar shape extending in one direction claim 1 , and the step section is formed at least one end of the connecting opening section ...

BENDABLE CIRCUIT BOARD FOR LED MOUNTING AND INTERCONNECTION

This invention is directed to bendable circuit substrate structures useful for LED mounting and interconnection. 2. The structure of wherein the copper layer is about 35 um thick claim 1 , the polyimide layer is at about 0.12 millimeters thick and the aluminum layer is about 0.2 millimeters to 0.247 millimeters thick.3. The structure of wherein the aluminum metal layer is about 0.4 mm to about 2 mm in thickness.4. The structure of claim 1 , where the copper layer is a circuitized layer.5. The structure of wherein the aluminum is anodized.6. The structure of wherein the aluminum is treated with a chemical conversion coating.7. The structure of wherein the aluminum is aluminum Alloy 5005.8. A method of manufacturing a laminated structure for mounting light emitting diodes (“LED”) to a 90° or greater configured angle claim 1 , comprising: i. an aluminum metal layer of about 0.2 mm to about 2 mm in thickness;', 'ii. a polyimide composite layer having a first surface directly contacting the first surface of the aluminum metal layer; and', 'iii. a copper foil layer directly contacting a second surface of the polyimide composite layer; and, 'a. providing a bendable a laminate circuit structure, the bendable laminate circuit structure having at least the following laminated layersb. bending the laminated layers 90° or more, such that after bending the laminated layers the bendable circuit structure for mounting LED mounting has an increase in electrical resistance of less than 10%.9. The method of wherein the providing step include providing a laminate wherein the copper layer is about 35 um thick claim 8 , the polyimide layer is about 12 um thick and the aluminum layer is about 200 um to 247 um thick.10. The laminate of wherein the providing step includes providing an aluminum metal layer of about 0.4 mm to about 2 mm in thickness.11. The method of claim 8 , wherein the bendable laminate structure has a thickness to about 3 millimeters.12. The method of claim 8 , where the ...

CIRCUIT SUBSTRATE AND METHOD OF MANUFACTURING SAME

A circuit substrate capable of reducing and preventing deviations of circuit characteristics includes a relatively hard region and a relatively soft region. A main body of the circuit substrate includes a stack of a plurality of flexible sheets made of a flexible material and includes rigid regions and a flexible region, the flexible region being more easily deformable than the rigid regions. Wiring conductors are disposed in the main body and define circuitry. Reinforcing insulative films are disposed so as to cover the portions where the wiring conductors are not disposed in the rigid regions on the flexible sheets when seen in plan view from the z-axis direction. 1. (canceled)2. A circuit substrate comprising:a main body including a stack of a plurality of first insulator layers made of a flexible material, the main body including a rigid region and a flexible region, the flexible region being more easily deformable than the rigid region;a conductive layer disposed in the main body and defining circuitry; anda second insulator layer disposed so as to cover at least a portion of an area in which the conductive layer is not disposed in the rigid region on at least one of the plurality of first insulator layers when viewed in plan from a stacking direction in which the plurality of first insulator layers are stacked; whereinthe second insulator layer is disposed in the main body; andthe second insulator layer has a thickness equal to or less than a thickness of the conductive layer in the stacking direction.3. The circuit substrate according to claim 2 , wherein the second insulator layer is made of a material that is harder than a material of the plurality of first insulator layers.4. The circuit substrate according to claim 2 , wherein the conductive layer extends across a border between the rigid region and the flexible region.5. The circuit substrate according to claim 2 , wherein the main body further includes a semi-rigid region disposed between the rigid ...

Terminal Structure for Glass Plate with Conductive Section and Glass Plate Article Utilizing Same

Disclosed is a glass plate article having a feed terminal structure to be connected with a feeding portion of a glass plate with a conductive portion, the glass plate article being characterized by that the feed terminal structure has at least one terminal seat subjected to a surface connection with the feeding portion through a Sn—Ag—Cu-series, lead-free solder alloy, that the terminal seat has a laminar form prepared by removing corner portions (soldering avoidance regions), each defined by a line connecting two points that are away from each of two vertices of one side of a square or rectangle by 1.6 mm or greater and are on two sides extending from each vertex, from the square or rectangle. 1. A glass plate article having a feed terminal structure to be connected with a feeding portion of a glass plate with a conductive portion , wherein the feed terminal structure of the glass plate article has at least one terminal seat subjected to a surface connection with the feeding portion through a lead-free solder alloy ,the terminal seat has a laminar form prepared by removing corner portions (soldering avoidance regions), each defined by a line connecting two points that are away from each of two vertices of one side of a square or rectangle by 1.6 mm or greater and are on two sides extending from each vertex, from the square or rectangle,{'sup': 2', '2, 'a connection area per each surface connection is from 8 mmto 98 mm, and'}the terminal seat is soldered to the feeding portion by using the lead-free solder alloy, the lead-free solder alloy is a Sn—Ag—Cu-series, lead-free solder alloy that has a dispersion/precipitation strengthened structure containing 1.5 to 4 mass % of Ag and 0.5 to 2 mass % of Cu and has a Young's modulus of 40 GPa or higher at room temperature.2. The glass plate article as claimed in claim 1 , wherein thermal expansion coefficient of a material of the feed terminal structure is 16×10to 19×10/° C.3. The glass plate article as claimed in claim 1 , ...

NOVEL INSULATING FILM AND PRINTED WIRING BOARD PROVIDED WITH INSULATING FILM

The present invention provides an insulating film including: a (A) binder polymer; (B) spherical organic beads; and (C) fine particles containing at least one element selected from the group consisting of phosphorus, aluminum, and magnesium, both the (B) spherical organic bead and the (C) fine particles being dispersed in a predetermined state in the insulating film. 1. An insulating film comprising:a (A) binder polymer;(B) spherical organic beads; and(C) fine particles containing at least one element selected from the group consisting of phosphorus, aluminum, and magnesium,both the (B) spherical organic beads and the (C) fine particles being dispersed in the insulating film,the (B) spherical organic beads occupying a 20% to 50% area of any 125 μm×15 μm region of a cross section of the insulating film which cross section is cut along a thickness direction of the insulating film.2. The insulating film as set forth in claim 1 , wherein:the (A) binder polymer is a compound having a urethane bond in its molecule.3. The insulating film as set forth in claim 1 , wherein:the (C) fine particles are fine particles containing elemental phosphorus.4. The insulating film as set forth in claim 1 , wherein:more than half of the (B) spherical organic beads present in the 125 μm×15 μm region are 3 μm to 15 μm in particle diameter.5. The insulating film as set forth in claim 1 , wherein:all of the (B) spherical organic beads present in the 125 μm×15 μm region are not larger than 15 μm in particle diameter.6. The insulating film as set forth in claim 1 , wherein:a (B) spherical organic bead content therein is 30 to 100 parts by weight, relative to 100 parts by weight of the (A) binder polymer.7. The insulating film as set forth in claim 1 , wherein:the (B) spherical organic beads are cross-linked spherical organic beads having a urethane bond in its molecule.8. The insulating film as set forth in claim 1 , wherein:the (C) fine particles present in the 125 μm×15 μm region are 1 μm to ...

TRANSPARENT CONDUCTIVE FILM

Transparent conductive films are disclosed and claimed that exhibit high light transmittance, low surface resistance, and superior peel-off adhesion. Such films are useful in electronics applications. 1. A transparent conductive film comprising:at least one transparent substrate;at least one transparent primer layer disposed on the at least one transparent substrate, the at least one transparent primer layer formed from at least one transparent primer layer coating mix comprising at least one hydroxy-functional polymer and at least one heat curable monomer; andat least one transparent conductive layer disposed on the at least one transparent primer layer, the at least one transparent conductive layer formed from at least one transparent conductive layer coating mix comprising at least one first cellulose ester polymer and at least one metal nanowire.2. The transparent conductive film according to claim 1 , wherein the at least one transparent substrate comprises at least one polyester comprising at least about 70 wt % ethylene terephthalate repeat units.3. The transparent conductive film according to claim 1 , wherein the at least one first hydroxy-functional polymer comprises a cellulose acetate polymer claim 1 , a cellulose acetate butyrate polymer claim 1 , or a cellulose acetate propionate polymer.4. The transparent conductive film according to claim 1 , wherein that at least one first hydroxy-functional polymer comprises a hydroxyl content of at least about 3 wt % claim 1 , according to ASTM D817-96.5. The transparent conductive film according to claim 1 , wherein the at least one first hydroxy-functional polymer comprises a hydroxyl content of about 4.8 wt % claim 1 , according to ASTM D817-96.6. The transparent conductive film according to a claim 1 , wherein the at least one heat curable monomer comprises at least about three ether groups.7. The transparent conductive film according to claim 1 , wherein the at least one heat curable monomer comprises at ...

CONDUCTIVE SUBSTRATE AND ELECTRONIC DEVICE COMPRISING SAME

Disclosed are an electric conducting substrate, comprising a transparent substrate and an electric conducting pattern comprising an electric conducting line provided on the transparent substrate, and an electronic device comprising the same. 1. An electric conducting substrate , comprising:a transparent substrate; andan electric conducting pattern comprising an electric conducting line provided on the transparent substrate,wherein the electric conducting pattern comprises cells closed by the electric conducting line,a 0.5-squared value of an area of the cell is defined as a characteristic length (Lc) of the cells, and{'sub': av', 'av, 'claim-text': [{'br': None, 'i': W', '/AR', Lc, 'sup': '0.5', 'sub': 'av', '=[(1)−1\u2003\u2003[Formula 1]'}, {'br': None, 'i': W=', 'Lc, 'sub': 'av', '13exp(−0.0052)+α\u2003\u2003[Formula 2]'}], 'when a graph 1 representing the following Formula 1 and a graph 2 representing the following Formula 2 are illustrated by setting an average of characteristic lengths (Lc) of the cells as an X axis and setting a line width (W) of the electric conducting line as a Y axis, the line width (W) of the electric conducting line and the average of characteristic lengths (Lc) of the cells are comprised in a crossing region of a lower region of the graph 1 and a lower region of the graph 2in Formulas 1 and 2,W is a line width of the electric conducting line,{'sub': 'av', 'Lcis an average of characteristic lengths of cells closed by the electric conducting line,'}AR is an aperture ratio of the electric conducting pattern, andα is a constant.2. The electric conducting substrate of claim 1 , wherein when a graph 1 representing Formula 1 and a graph 2 representing Formula 2 are illustrated by setting a characteristic length (Lc) of the cells as an X axis and setting a line width (W) of the electric conducting line as a Y axis claim 1 , the line width (W) of the electric conducting line and the characteristic length (Lc) of the cells are comprised in a ...

TOUCH PANEL

The touch panel includes a light transmissive substrate, a first light transmissive conductive layer, and a second light transmissive conductive layer. The first conductive layer is provided on an upper surface of the substrate, and extending in a roughly band-shaped form in a first direction. The second conductive layer is provided on the upper surface of the substrate, insulated from the first conductive layer, and extending in a roughly band-shaped form in a second direction perpendicular to the first direction. The first conductive layers and the second conductive layers are plurally provided. The second conductive layer includes conductive parts provided on the upper surface of the substrate, and a connecting part provided for connecting the conductive parts in the second direction, and provided above the first conductive layer, and material of the connecting part is resin containing dispersed conductive fine wires. 1. A touch panel comprising:a light transmissive substrate;a first light transmissive conductive layer provided on an upper surface of the substrate, and extending in a roughly band-shaped form in a first direction; anda second light transmissive conductive layer provided on the upper surface of the light transmissive substrate, insulated from the first light transmissive conductive layer, and extending in a roughly band-shaped form in a second direction perpendicular to the first direction, whereinthe first light transmissive conductive layer and the second light transmissive conductive layer are plurally provided, andthe second light transmissive conductive layer includes a plurality of conductive parts provided on the upper surface of the light transmissive substrate, and a connecting part provided for connecting the plurality of conductive parts in the second direction, and provided above the first light transmissive conductive layer, and material of the connecting part is resin containing dispersed conductive fine wires.2. The touch panel ...

ELECTRIC ELEMENT-EMBEDDED MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

An electric element-embedded multilayer substrate, which is a multilayer substrate including an electric element embedded therein and a plurality of base material layers having flexibility, the electric element including a main surface and being embedded in the multilayer substrate to be sandwiched between the base material layers, and a slide member provided between the main surface of the electric element and the base material layer. 1. (canceled)2. An electric element-embedded multilayer substrate , comprising:a multilayer substrate including a plurality of base material layers;an electric element including a main surface and embedded in the multilayer substrate so as to be sandwiched between adjacent ones of the plurality of the base material layers; anda slide member provided between the main surface of the electric element and one of the base material layers.3. The electric element-embedded multilayer substrate according to claim 2 , wherein the slide member is a sheet metal member disposed on the one of the base material layers.4. The electric element-embedded multilayer substrate according to claim 3 , whereinthe base material layers are resin sheets including thermoplasticity;the sheet metal member is a metal foil including a shiny surface and a matte surface having a surface roughness higher than a surface roughness of the shiny surface; andthe shiny surface defines a contact surface with the main surface of the electric element.5. The electric element-embedded multilayer substrate according to claim 3 , further comprising an auxiliary member defined by the sheet metal member disposed on the one of the base material layers; whereinthe auxiliary member is arranged adjacent to the slide member, with the one of the base material layers being sandwiched therebetween, in a direction in which the plurality of the base material layers are stacked.6. The electric element-embedded multilayer substrate according to claim 5 , further comprising an interlayer wire ...

BATTERY MONITORING SYSTEM

A battery monitoring system for monitoring a state of a battery assembly that includes a connection assembly for electrically coupling a controller to the battery assembly. The connection assembly includes a circuit board having an edge extending from a top surface to a bottom surface. The connection assembly also includes a plurality of terminals each having a first end electrically coupled to the circuit board and a second end electrically coupled to the battery assembly with the second end extending beyond the edge of the circuit board with the plurality of terminals each being resiliently biased against the battery assembly for accommodating relative movement between the battery assembly and said circuit board. 1. A battery monitoring system comprising: one or more battery modules with each of said one or more battery modules comprising one or more battery cells and each of said one or more battery cells having a positive battery terminal and a negative battery terminal;', 'a positive bus bar electrically coupled to one or more of said positive battery terminals;', 'a negative bus bar electrically coupled to one or more of said negative battery terminals;, 'a battery assembly comprisinga controller for monitoring a status of said battery assembly; and a circuit board electrically coupled to said controller with said circuit board having an edge extending between a top surface and a bottom surface;', 'a first terminal having a first end electrically coupled to said circuit board and a second end electrically coupled to said positive bus bar with said second end extending beyond said edge of said circuit board, said first terminal being resiliently biased against said positive bus bar for accommodating relative movement between said positive bus bar and said circuit board;', 'a second terminal having a first end electrically coupled to said circuit board and a second end electrically coupled to said negative bus bar with said second end of said second terminal ...

Reflective Conductive Composite Film

A process for the manufacture of a reflective conductive film comprising: (i) a reflective polymeric substrate comprising a polymeric base layer and a polymeric binding layer, wherein the polymeric material of the base layer has a softening temperature T, and the polymeric material of the binding layer has a softening temperature T; and (ii) a conductive layer comprising a plurality of nanowires, wherein said nanowires are bound by the polymeric matrix of the binding layer such that the nanowires are dispersed at least partially in the polymeric matrix of the binding layer, said process comprising the steps of providing a reflective polymeric substrate comprising a polymeric base layer and a polymeric binding layer; disposing said nanowires on the exposed surface of the binding layer; and heating the composite film to a temperature Twherein Tis equal to or greater than TS−HS, and Tis at least about 5° C. below T. 1. A process for the manufacture of a reflective conductive film comprising:{'sub': S-B', 'S-HS, '(I) a reflective polymeric substrate comprising a polymeric base layer and a polymeric binding layer, wherein the polymeric material of the base layer has a softening temperature T, and the polymeric material of the binding layer has a softening temperature T; and'}(ii) a conductive layer comprising a plurality of nanowires,{'sub': 1', '1', 'S-HS', '1', 'S-B, 'wherein said nanowires are bound by the polymeric matrix of the binding layer such that the nanowires are dispersed at least partially in the polymeric matrix of the binding layer, said process comprising the steps of providing a reflective polymeric substrate comprising a polymeric base layer and a polymeric binding layer; disposing said nanowires on the exposed surface of the binding layer; and heating the composite film to a temperature Twherein Tis equal to or greater than T, and Tis at least about 5° C. below T.'}2. The process according to wherein said nanowires are disposed on the exposed surface ...

MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

A multilayer rigid flexible printed circuit board including a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same. 1. A multilayer rigid flexible printed circuit board comprising:a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; anda rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region.2. The multilayer rigid flexible printed circuit board according to claim 1 , wherein the laser blocking layer includes:an adhesive coated on the circuit pattern formed on the flexible film;a polyimide layer formed on the adhesive to protect the circuit pattern; anda copper foil layer formed on the polyimide layer.3. The multilayer rigid flexible printed circuit board according to claim 1 , wherein the laser blocking layer includes:an adhesive coated on the circuit pattern formed on the flexible film;a polyimide layer formed on the adhesive to protect the circuit pattern;an adhesive disposed on the polyimide layer; anda copper foil layer formed on the adhesive.4. The multilayer rigid flexible printed circuit board according to claim 1 , wherein an electromagnetic shielding layer is further formed between the laser blocking layer and the flexible film having the circuit pattern formed thereon.5. The multilayer rigid flexible printed circuit board according to claim 4 , wherein the electromagnetic shielding layer includes:an adhesive coated on the circuit ...

METHOD FOR PRODUCING CONDUCTIVE ZINC OXIDE FILM

An objective is to provide a novel preparation method for a conductive ZnO film which realizes large area and mass productions with low costs and low environment loads. The crystal of zinc oxide (ZnO) is deposited on a substrate by a precipitation method using liquidous solution method under the presence of citric acid. The citric acid adsorbs on the surface of (0001) face of ZnO to suppress anisotropic growth to a c axis direction of the crystal in the precipitation reaction and to form dense crystal film on the surface of the substrate. Then, the organic acid incorporated in the film is photo-decomposed by irradiating UV light to the prepared ZnO crystalline film. As the result, carriers trapped by the organic acid is released to the crystalline film so as to provide an adequate conductivity. 19-. (canceled)10. A method for preparing a conductive zinc oxide film , the method comprising the steps of:precipitating a zinc oxide film on a substrate by a precipitation using liquidous solution under the presence of organic acid; andremoving the organic acid from the zinc oxide film by irradiating UV light having broad wavelength distribution from 300 to 400 nm to the substrate.11. The method of claim 10 , wherein the organic acid is carboxylic acid.12. The method of claim 11 , wherein the carboxylic acid is selected from the group consisting of citric acid claim 11 , maleic acid claim 11 , dimethyl-mercapto-succinic acid claim 11 , phenol phtalein claim 11 , and eosin-Y.13. The method of claim 10 , wherein the deposition step is conducted using a spin spray method.14. The method of claim 10 , wherein the substrate is made of a material having low glass transition temperature.15. The method of claim 14 , wherein the material having the low glass transition temperature is inorganic glass.16. The method of claim 14 , wherein the material having the low glass transition temperature is a plastic material.17. A conductive zinc oxide film being prepared by the steps of: ...

TRANSPARENT ELECTRODE FILM HAVING CONDUCTIVE POLYMER ELECTRODE LAYER

This invention relates to a transparent electrode film for a touch screen panel using poly(3,4-ethylenedioxythiophene) (PEDOT) that is a kind of conductive polymer, and more particularly to a technique of manufacturing a transparent electrode film by forming a PEDOT coating on the surface of a transparent substrate such as polyester wherein a photocurable resin layer is formed on both surfaces of the substrate film to reduce changes in surface resistance upon aging testing, and an electrode layer containing PEDOT as an effective component is formed on the photocurable resin layer formed on one surface thereof. 1. A transparent electrode film with an electrode layer , comprising:a transparent substrate film;a photocurable hard coating layer formed on one surface or both surfaces of the transparent substrate film; anda transparent conductive polymer electrode layer formed on the photocurable hard coating layer.2. The transparent electrode film of claim 1 , wherein the photocurable hard coating layer at a position on which the transparent conductive polymer electrode layer is formed has a degree of curing of 45˜85%.3. The transparent electrode film of claim 1 , wherein the photocurable hard coating layer at a position on which the transparent conductive polymer electrode layer is not formed has a degree of curing of 85% or more.4. The transparent electrode film of claim 1 , wherein a conductive polymer of the electrode layer is poly(3 claim 1 ,4-ethylenedioxythiophene).5. The transparent electrode film of claim 1 , wherein the photocurable hard coating layer is an acrylate-based photocurable resin layer.6. The transparent electrode film of claim 5 , wherein the acrylate-based photocurable resin layer is formed by mixing 5˜80 parts by weight of an oxide acrylate compound comprising an alkyl claim 5 , an allyl claim 5 , or a phenyl as a structure having one or more carbons claim 5 , based on 100 parts by weight of a total acrylate resin.7. The transparent electrode film ...

METHOD OF MANUFACTURING ELECTRONIC APPARATUS, ELECTRONIC COMPONENT-MOUNTING BOARD, AND METHOD OF MANUFACTURING THE SAME

A method of manufacturing an electronic apparatus including a first and a second components, includes: forming a first solder bump on one of the first component and the second component; forming a second solder bump on the other one of the first component and the second component; bringing the first solder bump into contact with the second solder bump at a temperature higher than the liquidus temperature of any of the first and the second solder bumps such that the first and the second solder bumps are fused together to form a solder joint of an alloy having a lower liquidus temperature than any of the first and the second solder bumps; and solidifying the solder joint between the first and the second component. 1. An electronic component mounting board comprising:a circuit board;an electrode formed on the circuit board; anda first solder bump formed on the electrode, the first solder bump containing Bi as a base component and containing Sn.2. The electronic component mounting board according to claim 1 , whereinthe first solder bump contains Bi in the range from 85 to 90 wt. %.3. The electronic component mounting board according to claim 1 , whereinthe first solder bump further contains at least one metal selected from a group consisting of Au, Ag, Cu, Sb, Ni, Ge, and Zn in the range from 0.01 to 1 wt. %.4. The electronic component mounting board according to claim 1 , further comprisinga solder layer formed on the first solder bump, the solder layer containing Sn having a larger weight ratio than the first solder.5. The electronic component mounting board according to claim 4 , whereinthe solder layer contains Sn higher than or equal to 90 wt. %. This is a divisional application of U.S. application Ser. No. 13/113,305, filed May 23, 2011, which is a continuation of International Application No. PCT/JP2008/003534 filed on Nov. 28, 2008, the entire contents of which are incorporated herein by reference.The embodiment discussed herein is related to a method of ...

TRANSFER SHEET PROVIDED WITH TRANSPARENT CONDUCTIVE FILM MAINLY COMPOSED OF GRAPHENE, METHOD FOR MANUFACTURING SAME, AND TRANSPARENT CONDUCTOR

As Technical Problem, provided is a transfer sheet using graphene as a transparent conductive material, and a transparent conductor. As solution problem, there is provided a transfer sheet that includes a substrate sheet having releasability and smoothness, a metal thin film layer partially or entirely formed on the surface of the substrate sheet to reflect the smoothness of the substrate sheet, and a transparent conductive film layer formed on the metal thin film layer and mainly composed of graphene. 133-. (canceled)34. A transparent conductor having one transparent conductive portion mainly composed of graphene , comprising:a flexible transparent substrate of a two-dimensional form;a resin layer formed on one of surfaces of the transparent substrate; anda transparent conductive portion formed of a transparent conductive layer that is mainly composed of graphene and formed on the resin layer, and having flexibility.35. A transparent conductor having two transparent conductive portions mainly composed of graphene , comprising:a flexible first transparent substrate of a two-dimensional form;a first resin layer formed on one of surfaces of the first transparent substrate;a first transparent conductive portion formed of a first transparent conductive layer formed on the first resin layer and mainly composed of graphene;a flexible second transparent substrate of a two-dimensional form;a second resin layer formed on one of surfaces of the second transparent substrate; anda second transparent conductive portion formed of a second transparent conductive layer formed on the second resin layer and mainly composed of graphene, whereinthe first and second transparent conductive portions are opposed to each other to keep electrical isolation, and the transparent conductor is flexible and has a two-dimensional form.36. A transparent conductor having one transparent conductive portion mainly composed of graphene , comprising:a transparent substrate of a three-dimensional form;a ...

CONDUCTIVE SUBSTRATE AND TOUCH SCREEN HAVING SAME

The present invention relates to a conducting substrate and a touch screen comprising the same, and the conducting substrate according to the present invention comprises a board, and an electric conducting pattern provided on at least one surface of the board, wherein the electric conducting pattern comprises a border structure of closed figures continuously connected and does not comprise the closed figures having the same shape in a predetermined unit area (1 cm×1 cm), and the number of vertexes of the closed figures is different from the number of vertexes of quadrangles having the same number as the closed figures. 1. A conducting substrate , comprising:a board; andan electric conducting pattern provided on at least one surface of the board,wherein the electric conducting pattern comprises a border structure of closed figures continuously connected and does not comprise the closed figures having the same shape in a predetermined unit area (1 cm×1 cm), and the number of vertexes of the closed figures is different from the number of vertexes of quadrangles having the same number as the closed figures.2. A conducting substrate , comprising:a board; andan electric conducting pattern provided on at least one surface of the board,wherein the electric conducting pattern comprises a border structure of closed figures continuously connected and does not comprise the closed figures having the same shape in a predetermined unit area (1 cm×1 cm), and the number of vertexes of the closed figures is different from the number of vertexes of polygons formed by connecting the shortest distances between centers of masses of the closed figures.3. A conducting substrate , comprising:a board: andan electric conducting pattern provided on at least one surface of the board, {'br': None, '(standard deviation of distances between vertexes/average of the distances between the vertexes)×100. \u2003\u2003[Equation 1]'}, 'wherein the electric conducting pattern comprises a border structure ...

CONDUCTIVE STRUCTURE, TOUCH PANEL, AND METHOD FOR MANUFACTURING SAME

Provided are a conductive structure including a) a base. b) a conductive pattern provided on at least one side of the base. and c) a darkening layer provided on the upper surface and lower surface of the conductive pattern, provided on at least a part of the side of the conductive pattern, and provided in an area corresponding to the conductive pattern area, and a touch panel including the same and a manufacturing method thereof. 1. A conductive structure , comprising:a) a base;b) a conductive pattern provided on at least one side of the base; andc) a darkening layer provided on the upper surface and the lower surface of the conductive pattern, provided on at least a part of the side of the conductive pattern, and provided in an area corresponding to the conductive pattern.2. The conductive structure of claim 1 , wherein a color range of a pattern area configured by the darkening layer and the conductive pattern claim 1 , which is measured at the surface where the darkening layer of the conductive substrate is viewed claim 1 , has a L value of 20 or less claim 1 , an A value of −10 to 10 claim 1 , and a B value of −70 to 70 based on the CIE LAB color coordination.3. The conductive structure of claim 1 , wherein total reflectivity in the pattern area configured by the darkening layer and the conductive pattern claim 1 , which is measured at the surface where the darkening layer of the conductive substrate is viewed claim 1 , is 17% or less based on 550 nm.4. The conductive structure of claim 1 , wherein the darkening layer includes one kind or more selected from a group constituted by a dielectric material claim 1 , a metal claim 1 , a metal alloy claim 1 , a metal oxide claim 1 , a metal nitride claim 1 , a metal oxynitride claim 1 , and a metal carbide.5. The conductive structure of claim 4 , wherein the metal includes one kind or more selected from a group constituted by Ni claim 4 , Mo claim 4 , Ti claim 4 , Cr claim 4 , Al claim 4 , Cu claim 4 , Fe claim 4 , Co ...

Means to provide electrical connections to borderless flexible display

Systems and methods for the design and fabrication of flexible devices, including high-performance large-area OLEDs, narrow border display panels and lighting panels are provided. Various described fabrication- and design-processes may be used to provide the necessary electrical drive to lighting and display panels. Electrical drive may be provided to one or more row- and column-signals by patterning conductive elements near the panel edge. The electrical elements may further be folded over a region near the panel edge back on itself, such that electrical traces may route around the display edge. This may allow the display active area to be substantially the same area as its viewing area, and furthermore may allow pixels go substantially all the way to the edge of the viewing area.

Three-dimensional circuit component, method of making the same, and physical-quantity measuring instrument

For producing a three-dimensional circuit component, an electronic component is mounted on a synthetic resin block. A plurality of electrically-conductive patterns used to establish an electrical connection to the electronic component are formed on the block along a three-dimensional shape of the block. An end of each electrically-conductive patterns is provided with a solder-disposed section. A solder is provided between the solder-disposed section and an opposed surface of the electronic component. The section of each electrically-conductive patterns other than the solder-disposed section and a section on which the electronic component is mounted is internally formed in the block. Since the section of each electrically-conductive patterns other than the section on which the electronic component is mounted is internally formed in the block, the electrically-conductive patterns are not unnecessarily exposed.

CONDUCTIVE SUBSTRATE AND TOUCH SCREEN HAVING SAME

The present invention relates to a conducting substrate and a touch screen comprising the same, and the conducting substrate according to the present invention comprises a board, an electric conducting pattern provided on at least one surface of the board, and a darkening layer provided on at least one surface of the electric conducting pattern and in a region corresponding to the electric conducting pattern, wherein a reflective diffraction intensity of a reflective diffraction image obtained by radiating light emitted from a point light source on one surface from which the darkening layer is visible is reduced by 60% or more as compared to the conducting substrate having the same constitution except that the electric conducting pattern is formed of Al and does not comprise the darkening layer. 1. A conducting substrate comprising:a board,an electric conducting pattern provided on at least one surface of the board, anda darkening layer provided on at least one surface of the electric conducting pattern and in a region corresponding to the electric conducting pattern,wherein a reflective diffraction intensity of a reflective diffraction image obtained by radiating light emitted from a point light source on one surface from which the darkening layer is visible is reduced by 60% or more as compared to the conducting substrate having the same constitution except that the electric conducting pattern is formed of Al and does not comprise the darkening layer.2. A conducting substrate comprising:a board,an electric conducting pattern provided on at least one surface of the board, anda darkening layer provided on at least one surface of the electric conducting pattern and in a region corresponding to the electric conducting pattern,wherein total reflectance measured by using a total reflectance measuring device with an assumption of ambient light on one surface from which the darkening layer is visible is reduced by 20% or more as compared to the conducting substrate having ...

Component and method for producing a component

A component includes a substrate having at least one flexible substrate area which has at least one area reinforced by forming a material composite. The material composite includes at least a portion of the flexible substrate area. The component also includes a first microstructured or nanostructured element and a connecting mechanism configured to attach the first microstructured or nanostructured element to the flexible substrate area. A damping mass is configured to cover at least the first microstructured or nanostructured element and a portion of the substrate protruding over the material composite. The component is configured to provide a secure receptacle for the electronic element and to offer good vibration decoupling of the electronic element from vibrations of the component.

STRAIN RELIEF STRUCTURES FOR STRETACHBLE INTERCONNECTS

Intersection structures are provided to reduce a strain in a conformable electronic system that includes multi-level arrangements of stretchable interconnect structures. Bypass regions are formed in areas of the stretchable interconnect structures that may ordinarily cross or pass each other. The bypass regions of the stretchable interconnects are disposed relative to each other such that the intersection structure encompasses at least a portion of the bypass regions of each stretchable interconnect structure. The intersection structure has elastic properties that relieve a mechanical strain on the bypass regions during stretching at least one of the stretchable interconnect structures. 1. An apparatus comprising:a first conductive stretchable interconnect comprising a first bypass region;a second conductive stretchable interconnect comprising a second bypass region; and the second conductive stretchable interconnect is disposed in relation to the first conductive stretchable interconnect such that the intersection structure encompasses at least a portion of the first bypass region and the second bypass region; and', 'the intersection structure has elastic properties that relieve a mechanical strain on the first bypass region and the second bypass region during stretching of the first conductive stretchable interconnect and/or the second conductive stretchable interconnect., 'an intersection structure, wherein2. The apparatus of claim 1 , wherein the first bypass region or the second bypass region is embedded in the intersection structure.3. The apparatus of claim 1 , wherein the first bypass region or the second bypass region is disposed on a portion of the intersection structure.4. The apparatus of claim 1 , wherein the first conductive stretchable interconnect or the second conductive stretchable interconnect is embedded in a polymer.5. The apparatus of claim 4 , wherein the polymer is a polyimide.6. The apparatus of claim 1 , wherein the intersection structure ...

Printed circuit board and method for manufacturing the same

Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a core reinforcement having stiffness; insulating layers formed on both surfaces of the core reinforcement; a through hole formed by penetrating through the insulating layer and the core reinforcement; and a circuit layer formed on the insulating layer and a plating layer formed in the through hole for implementing inter-layer connection of the circuit layers.

Connection Carrier for Semiconductor Chips and Semiconductor Component

A connection carrier for at least one semiconductor chip is disclosed. The connection carrier has a carrier body having a main surface. A first connection area and a second connection area at a distance from the first connection area are formed on the main surface. The connection carrier has a mechanical decoupling device which is intended to reduce transmission of mechanical forces from the carrier body to at least one region of the first connection area. A semiconductor component having such a connection carrier is also stated. 114-. (canceled)15. A connection carrier for at least one semiconductor chip , the connection carrier comprising:a carrier body having a main surface;a first connection surface and a second connection surface separated from the first connection surface disposed on the main surface; anda mechanical decoupling device configured to reduce transmission of mechanical forces from the carrier body onto at least one region of the first connection surface.16. The connection carrier according to claim 15 , wherein the mechanical decoupling device is formed by a recess in the carrier body.17. The connection carrier according to claim 16 , wherein the recess is filled with a filler material that has a lower modulus of elasticity than the carrier body.18. The connection carrier according to claim 17 , wherein the modulus of elasticity of the filler material is at most 0.7 times the modulus of elasticity of the carrier body.19. The connection carrier according to claim 17 , wherein the mechanical decoupling device is formed by a bead that is formed in the filler material.20. The connection carrier according to claim 16 , wherein the recess overlaps with the first connection surface and with the second connection surface in plan view of the connection carrier.21. The connection carrier according to claim 15 , wherein the mechanical decoupling device is formed by a bead.22. The connection carrier according to claim 15 , wherein the mechanical decoupling ...

FOLDABLE DISPLAY DEVICE

A foldable display device having an excellent folding characteristic without image quality deterioration on a folding portion is provided. The foldable display device includes a flexible display panel and a cover window positioned outside the flexible display panel and protecting the flexible display panel from an external impact, wherein the cover window includes a folding region where concave grooves are formed. 1. A foldable display device , comprising:a flexible display panel; anda cover window positioned outside the flexible display panel and protecting the flexible display panel from an external impact, said cover window includes a folding region where concave grooves are formed.2. The foldable display device of claim 1 , whereinthe concave grooves are formed in a stripe pattern, and are positioned according to a direction crossing a direction in which the cover window is folded.3. The foldable display device of claim 2 , wherein each length of the concave grooves is the same as a width of the cover window.4. The foldable display device of claim 1 , whereinthe concave grooves are formed with a dot shape, and are positioned according to a first direction in which the cover window is folded and a second direction crossing the first direction.5. The foldable display device of claim 1 , whereinthe concave grooves are formed with a bar shape,the cover window is folded according to a first direction, andeach long edge of the concave grooves is positioned according to a second direction crossing the first direction.6. The foldable display device of claim 1 , wherein the concave grooves include first concave grooves of a bar shape and second concave grooves of a dot shape.7. The foldable display device of claim 6 , wherein the first concave grooves and the second concave grooves are alternately positioned one by one according to a second direction crossing a first direction in which the cover window is folded.8. The foldable display device of claim 2 , wherein each ...

ELECTRONIC DEVICE

An electronic device includes a printed circuit board that has a prohibited region, in which arrangement of a wiring pattern is prohibited, in a fixed region from an outer periphery, an electronic component mounted on the printed circuit board, a heat dissipation fin provided on the electronic component, and a fixing unit that is made of a conductive material and fixes the heat dissipation fin by pressing the fin against the printed circuit board side, wherein a notch is formed in two sides of the printed circuit board that face each other with the electronic component therebetween, and the fixing unit exerts an elastic force that presses the heat dissipation fin against the printed circuit board side by being locked to the notch and is such that hook portions locked to the notch are arranged in the prohibited region. 19.-. (canceled)10. An electronic device comprising:a printed circuit board that has a prohibited region, in which arrangement of a wiring pattern is prohibited, in a fixed region from an outer periphery;an electronic component mounted on the printed circuit board;a heat dissipation fin provided on the electronic component; anda fixing unit that fixes the heat dissipation fin by pressing the heat dissipation fin against the printed circuit board side, whereinthe fixing unit exerts an elastic force that presses the heat dissipation fin against the printed circuit board side by being locked to a notch formed in the printed circuit board and the fixing unit is such that a hook portion that is locked to the notch is arranged in the prohibited region.11. The electronic device according to claim 10 , wherein the fixing unit is made of a conductive material.12. The electronic device according to claim 10 , wherein the notch is formed in two sides that face each other with the electronic component therebetween.13. The electronic device according to claim 10 , further comprising a heat conductive sheet interposed between the electronic component and the heat ...

ALTERNATE PAD STRUCTURES/PASSIVATION INTEGRATION SCHEMES TO REDUCE OR ELIMINATE IMC CRACKING IN POST WIRE BONDED DIES DURING CU/LOW-K BEOL PROCESSING

Passivation integration schemes and pad structures to reduce the stress gradients and/or improve the contact surface existing between the Al in the pad and the gold wire bond. One of the pad structures provides a plurality of recessed pad areas which are formed in a single aluminum pad. An oxide mesa can he provided under the aluminum pad. Another pad structure provides a single recessed pad area which is formed in a single aluminum pad, and the aluminum pad is disposed above a copper pad and a plurality of trench/via pads. Still another pad structure provides a single recessed pad area which is formed in a single aluminum pad, and the aluminum pad is disposed above a portion of a copper pad, such that the aluminum pad and the copper pad are staggered relative to each other. 1. A pad structure comprising: a copper pad; a single aluminum pad above the copper pad; at least one recessed pad area formed in the aluminum pad , said aluminum pad being disposed above trench/via pads which are disposed proximate the copper pad; a first layer along an entire bottom surface of the aluminum pad and in contact with a top surface of each trench/via pad; and a second layer along an entire top surface of the copper pad and in contact with both the trench/via pads and portions of the first layer.2. A pad structure comprising: at least one copper pad; an aluminum pad above the copper pad; at least one recessed pad area formed in the aluminum pad , wherein the copper pad and the aluminum pad are staggered relative to each other; a first layer along an entire bottom surface of the aluminum pad and in contact with a top surface of each recessed pad area; and a second layer along an entire top surface of the copper pad and in contact with both the recessed pad areas and portions of the first layer.3. A pad structure as recited in claim 2 , wherein the aluminum pad is above a single copper pad claim 2 , as opposed to a plurality of copper pads being disposed below the aluminum pad.4. A ...

ELECTRODE PATTERN AND METHOD OF MANUFACTURING THE SAME, PRINTED CIRCUIT BOARD USING ELECTRODE PATTERN AND METHOD OF MANUFACTURING THE SAME

Disclosed herein are an electrode pattern and a method of manufacturing the same, and a printed circuit board applied with the electrode pattern and a method of manufacturing the same. In order to increase a heat dissipation effect, disclosed herein are an electrode pattern including electrode layers with a predetermined pattern; and insulators insulating the electrode layers from each other, in which the insulators are made of metal oxide, a method of manufacturing the same, and a printed circuit board applied with the electrode pattern and a method of manufacturing the same. 1. An electrode pattern , comprising:electrode layers having a predetermined pattern; andinsulators insulating the electrode layers from each other,wherein the insulators are made of metal oxide.2. The electrode pattern according to claim 1 , wherein the insulators are made of metal oxide formed by oxidizing the same material as the electrode layers.3. The electrode pattern according to claim 1 , wherein the insulators are regions oxidized in a metallic layer claim 1 , and the electrode layers are regions not oxidized in the metallic layer.4. The electrode pattern according to claim 1 , wherein the insulators contain any one or two or more of alumina (AlO) claim 1 , magnesium oxide (MgO) claim 1 , manganese oxide (MnO) claim 1 , zinc oxide (ZnO) claim 1 , titanium oxide (TiO) claim 1 , hafnium oxide (HfO) claim 1 , tantalum oxide (TaO) claim 1 , and niobium oxide (NbO).5. The electrode pattern according to claim 1 , wherein the electrode layer is a metallic material which is anodized.6. The electrode pattern according to claim 5 , wherein the electrode layers contain any one or two or more of aluminum (Al) claim 5 , magnesium (Mg) claim 5 , manganese (Mn) claim 5 , zinc (Zn) claim 5 , titanium (Ti) claim 5 , hafnium (Hf) claim 5 , tantalum (Ta) claim 5 , and niobium (Nb).7. The electrode pattern according to claim 1 , wherein the electrode layer has the same thickness as the insulator.8. The ...

Flexible multilayer substrate

A flexible multilayer substrate includes a multilayer body including a plurality of laminated resin layers. The multilayer body includes an innermost surface, which is a surface on an inner side when the substrate is bent, and an outermost surface, which is a surface on an outer side when the substrate is bent. Each of the plurality of resin layers includes a skin layer on one surface. Lamination of the multilayer body includes a skin layer joint plane at one location at a central portion in the thickness direction, and the skin layer and other surface come in contact with each other at another location along the central portion in the thickness direction. A skin layer joint plane is arranged on a side closer to the innermost surface than a central plane in the thickness direction of the multilayer body.

DISPLAY DEVICE, AND METHOD AND APPARATUS FOR MOUNTING DRIVER IC

A display device includes an upper substrate on a lower substrate, a driver integrated chip (IC) on the lower substrate, the driver IC and upper substrate contacting different parts of the lower substrate, a plurality of bumper units along edges of the driver IC, and a deformation preventing bumper unit between the bumper units, the deformation preventing bumper unit being configured to prevent the driver IC from being deformed. 1. A display device , comprising:an upper substrate on a lower substrate;a driver integrated chip (IC) on the lower substrate, the driver IC and upper substrate contacting different parts of the lower substrate;a plurality of bumper units along edges of the driver IC; anda deformation preventing bumper unit between the bumper units, the deformation preventing bumper unit being configured to prevent the driver IC from being deformed.2. The display device of claim 1 , wherein the deformation preventing bumper unit includes a bumper on the driver IC claim 1 , and a conductive ball on the bumper.3. The display device of claim 1 , wherein the plurality of bumper units are between the driver IC and the lower substrate claim 1 , the bumper units extending only along edges of the driver IC.4. The display device of claim 3 , wherein the deformation preventing bumper unit is between the driver IC and the lower substrate and parallel to the plurality of bumper units claim 3 , the deformation preventing bumper unit being centered between two outer edges of the driver IC.5. The display device of claim 1 , wherein each bumper unit is spaced apart from an adjacent bumper unit and from the deformation preventing bumper unit along a lengthwise direction of the lower substrate claim 1 , the driver IC being connected to the lower substrate via the plurality of bumper units and deformation preventing bumper unit.6. A driver integrated chip (IC) mounting apparatus claim 1 , comprising:a first stage configured to support a display panel;a second stage configured ...

Flexible Displays

An electronic device may be provided with an organic light-emitting diode display with minimized border regions. The border regions may be minimized by providing the display with bent edge portions having neutral plane adjustment features that facilitate bending of the bent edge portions while minimizing damage to the bent edge portions. The neutral plane adjustment features may include a modified backfilm layer of the display in which portions of the backfilm layer are removed in a bend region. A display device may include a substrate, a display panel on the substrate having display pixels, and peripheral circuitry proximate the display panel and configured to drive the display pixels. A portion of the periphery of the substrate may be bent substantially orthogonal to the display panel to reduce an apparent surface area of the display device. The bent portion may include an electrode for communication with the peripheral circuitry.

Signal wiring of touch panel

A signal wiring of a touch panel mainly extends a boding portion of a touch sensing unit from a signal wire on a substrate outside the substrate. The bonding portion is further attached to a signal bus so as to shrink the wiring area of the touch sensing unit and the edge frame as well. The bonding portion outside the substrate is allowed to be formed larger for improve the stability and yield of the connection between the touch sensing unit and the signal bus.

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD

Provided is a printed wiring board including a first heat dissipation pattern placed in one surface layer on which a semiconductor package is to be mounted, a second heat dissipation pattern placed in the other surface layer, and an inner layer conductor pattern placed in an inner layer, in which through holes are formed in the printed wiring board; the first heat dissipation pattern has a joint portion which is placed in an opposed region opposed to a heat sink of the semiconductor package and which is joined to the heat sink with solder; at least one of the through holes is placed in the opposed region; and the second heat dissipation pattern is formed in a pattern in which an end portion of a conductor film in the one of the through holes on the other surface layer side is separated. 1. A printed circuit board comprising:a semiconductor package; the printed wiring board comprising:', 'a first conductor pattern formed in a region of the first surface layer on which the semiconductor package is to be mounted;', 'a second conductor pattern placed in a second surface layer on a side opposite to the first surface layer;', 'a first through hole piercing the first surface layer and the second surface layer; and', 'a second through hole piercing the first surface layer and the second surface layer; and, 'a printed wiring board having the semiconductor package mounted on a first surface layer thereof,'}a solder member placed between the semiconductor package and the printed wiring board, for joining a conductive member provided in the semiconductor package and the first conductor pattern together, wherein: a first plane-like conductive pattern; and', 'a first pad-like conductive pattern which is surrounded by the first plane-like conductive pattern and is placed with a gap between the first pad-like conductive pattern and the first plane-like conductive pattern;, 'the first conductor pattern comprises a second plane-like conductive pattern; and', 'a second pad-like ...

Printed Circuit Solder Connections

Printed circuits may be electrically and mechanically connected to each other using connections such as solder connections. A first printed circuit such as a rigid printed circuit board may have solder pads and other metal traces. A second printed circuit such as a flexible printed circuit may have openings. Solder connections may be formed in the openings to attach metal traces in the flexible printed circuit to the solder pads on the rigid printed circuit board. A ring of adhesive may surround the solder connections. The flexible printed circuit may be attached to the rigid printed circuit board using the ring of adhesive. An insulating tape may cover the solder connections. A conductive shielding layer with a conductive layer and a layer of conductive adhesive may overlap the solder joints. The conductive adhesive may connect the shielding layer to the metal traces on the rigid printed circuit board. 1. Apparatus , comprising:a first printed circuit;a second printed circuit;solder connections between the first and second printed circuits; andan adhesive ring that that is interposed between the first and second printed circuits and that surrounds the solder connections.2. The apparatus defined in further comprising an insulating layer that overlaps the solder connections.3. The apparatus defined in wherein the first printed circuit comprises a rigid printed circuit board and wherein the second printed circuit comprises a flexible printed circuit and wherein the adhesive ring is attached to the flexible printed circuit and is attached to the rigid printed circuit board.4. The apparatus defined in wherein the flexible printed circuit comprises openings and wherein the solder connections comprise solder in the openings.5. The apparatus defined in further comprising an electromagnetic shielding layer that overlaps the insulating layer.6. The apparatus defined in wherein the shielding layer comprises a conductive layer and a layer of conductive adhesive.7. The ...

THERMALLY ENHANCED WIRING BOARD WITH THERMAL PAD AND ELECTRICAL POST

A thermally enhanced wiring board with thermal pad and electrical post includes a metal slug, a metal pillar, a patterned interconnect substrate, an adhesive, a build-up circuitry and optionally a plated through hole. The metal slug and the metal pillar extend into apertures of the patterned interconnect substrate and are electrically connected to the build-up circuitry. The build-up circuitry covers the metal slug, the metal pillar and the patterned interconnect substrate and can provide signal routing. The metal slug can provide thermal contact surface, and the metal pillar can serve as power/ground plane or signal vertical transduction pathway. 1. A thermally enhanced wiring board with thermal pad and electrical post , comprising:a patterned interconnect substrate that includes first and second apertures;a metal slug that serves as the thermal pad and extends into the first aperture of the patterned interconnect substrate;a metal pillar that serves as the electrical post and extends into the second aperture of the patterned interconnect substrate;an adhesive that covers the patterned interconnect substrate in a first vertical direction, extends into gaps between the metal slug and the patterned interconnect substrate and between the metal pillar and the patterned interconnect substrate in a second vertical direction opposite the first vertical direction;a build-up circuitry that covers the metal slug, the metal pillar and the adhesive in the first vertical direction and includes a first dielectric layer, first via openings, and a first conductive trace, wherein the first via openings in the first dielectric layer are aligned with the metal slug and the metal pillar, and the first conductive trace extends from the first dielectric layer in the first vertical direction and extends through the first via openings in the second vertical direction and directly contacts the metal slug and the metal pillar respectively; anda plated through hole that extends through the ...

Detachable components for space-limited applications through micro and nanotechnology (decal-mnt)

The invention relates to space-saving micro- and nano-components and to methods for producing same. The components are characterized in that they do not comprise a rigid substrate having a considerable thickness. The mechanical stresses, which result in deformations and/or warpage within a component, are compensated by means of a mechanically stress-compensated design and/or by means of active mechanical stress compensation by depositing suitable stress compensation layers such that there is no need for relatively thick substrates. Thus, the overall thickness of the components is decreased and the integration options thereof in technical systems are improved. In addition, the field of application of such components is expanded.

ELECTROCONDUCTIVE SHEET AND TOUCH PANEL

An electroconductive sheet and a touch panel, wherein the electroconductive sheet has a first electroconductive section and a second electroconductive section; the first electroconductive section has a plurality of first electroconductive patterns arrayed in one direction and to which a plurality of first electrodes, respectively, are connected; the second electroconductive section has a plurality of second electroconductive patterns arrayed in a direction orthogonal to the arrayed direction of the first electroconductive patterns and to which a plurality of second electrodes, respectively, are connected; and the electroconductive sheet has dummy electrodes disposed between the first electrodes and the second electrodes, and other dummy electrodes disposed in portions corresponding to the second electrodes. 1. A conductive sheet , which is used on a display panel of a display device , comprising a first conductive part disposed closer to an input operation surface and a second conductive part disposed closer to the display panel , wherein the first conductive part and the second conductive part overlap with each other ,the first conductive part contains a plurality of first conductive patterns composed of thin metal wires, the first conductive patterns being arranged in one direction and each connected to a plurality of first electrodes,the second conductive part contains a plurality of second conductive patterns composed of the thin metal wires, the second conductive patterns being arranged in a direction perpendicular to the one direction of the first conductive patterns and each connected to a plurality of second electrodes,at least one of the first conductive part and the second conductive part contain dummy electrodes composed of the thin metal wires disposed between the first electrodes and the second electrodes, andthe first conductive part contains additional dummy electrodes composed of the thin metal wires disposed in positions corresponding to the second ...

Conductive component and preparation method thereof

A conductive component is disclosed in the present invention, which includes an insulating layer and a metal mesh arranged on the insulating layer, the metal mesh defines a plurality of voids arranged in array, the aperture ratio K of the voids of the metal mesh and the optical transmittance T 1 of the conductive component and the optical transmittance T 2 of the insulating layer being described as formula: T 1 =T 2 *K. The metal mesh is arranged on the insulating layer in the conductive component, a patterned sensing layer on the insulating layer by the metal mesh treated by exposure and development as needed when in use, and then applied to touch screen, the use of indium tin oxide is avoided in the conductive component, thus the cost of the conductive component is low. A method of preparing the conductive component is also provided.

NOVEL FLEXIBLE PRINTED CIRCUIT INTEGRATED WITH CONDUCTIVE LAYER

A conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film on the electromagnetic-shielding conductive film (A); and (C) a wiring-pattern-equipped film on the insulator film (B), the insulator film (B) containing at least (a) a binder polymer and (b) spherical organic beads. 1. A conductive-layer-integrated flexible printed circuit board comprising:(A) an electromagnetic-shielding conductive layer;(B) an insulator film on the electromagnetic-shielding conductive film (A); and(C) a wiring-pattern-equipped film on the insulator film (B),the insulator film (B) containing at least (a) a binder polymer and (b) spherical organic beads.2. The conductive-layer-integrated flexible printed circuit board as set forth in claim 1 , wherein the insulator film (B) contains (c) fine particles containing at least one type of element selected from the group consisting of phosphorus claim 1 , aluminum claim 1 , and magnesium.3. The conductive-layer-integrated flexible printed circuit board as set forth in claim 1 , wherein the electromagnetic-shielding conductive layer (A) contains (f) at least one type of element selected from the group consisting of silver claim 1 , copper claim 1 , aluminum claim 1 , and nickel.4. The conductive-layer-integrated flexible printed circuit board as set forth in claim 1 , wherein the insulator film (B) is made from a resin composition containing (d) a thermosetting resin.5. The conductive-layer-integrated flexible printed circuit board as set forth in claim 1 , wherein the insulator film (B) is made from a photosensitive resin composition containing (e) a photopolymerization initiator. The present invention relates to a conductive-layer-integrated flexible printed circuit board which is excellent in adhesion between an electromagnetic-shielding conductive layer and an insulator film, which is excellent in flexibility that can withstand repeated folding, in flame ...

Printed circuit board

A printed circuit board is designed to meet the following requirements. A front-back copper foil residual rate difference a−b falls within a range of −10% to 10%, where the insulative board is divided into a plurality of divisions, in which front and back surface copper foil residual rates of each division are a % and b %, respectively. A difference (a−b)−(c−d) between front-back copper foil residual rate differences of adjacent divisions falls within a range of −10% to 10%, where the front and back surface copper foil residual rates of a division adjacent to the each division are c % and d %, respectively. There are not three or more consecutive divisions for which the difference between the front-back copper foil residual rate differences goes beyond a range of −5% to 5%.

CONDUCTIVE SUBSTRATE AND TOUCH DISPLAY DEVICE

A conductive substrate comprises a substrate, a plurality of conductive patterns, and a plurality of optical compensation patterns. The conductive patterns extend along a first direction and are sequentially disposed on the substrate along a second direction. The optical compensation patterns are staggered from the conductive patterns along the second direction on the substrate. An edge of at least one of the conductive patterns extending along the first direction has a plurality of conductive protrusions, and an edge of at least one of the optical compensation patterns extending along the first direction has a plurality of optical compensation protrusions. A touch display device is also disclosed. 1. A conductive substrate , comprising:a substrate;a plurality of conductive patterns extending along a first direction and sequentially disposed on the substrate along a second direction; anda plurality of optical compensation patterns staggered from the conductive patterns along the second direction on the substrate,wherein an edge of at least one of the conductive patterns extending along the first direction has a plurality of conductive protrusions, and an edge of at least one of the optical compensation patterns extending along the first direction has a plurality of optical compensation protrusions.2. The conductive substrate as recited in claim 1 , wherein the adjacent conductive protrusions and the optical compensation protrusions are staggered from each other.3. The conductive substrate as recited in claim 2 , wherein the adjacent conductive protrusions and the optical compensation protrusions are staggered from each other in the way of a zigzag or in the way of convexes and concaves.4. The conductive substrate as recited in claim 1 , wherein a width of at least one of the conductive patterns is between 300 microns and 1000 microns claim 1 , and a width of at least one of the optical compensation patterns is between 500 microns and 2000 microns.5. The conductive ...

CONDUCTIVE SHEET AND TOUCH PANEL

The present invention pertains to a counductive sheet and a touch panel. A first conductive pattern and a second conductive pattern are both configured from the combination of a plurality of first lattices and a plurality of second lattices having a size that is larger than that of the first lattices. Of the first conductive pattern, the portion facing the second conductive pattern is configured from a plurality of second lattices, of the second conductive pattern, the portion facing the first conductive pattern is configured from a plurality of second lattices, and when seen from the top surface, the portions at which the first conductive pattern and the second conductive pattern are facing have a form that combines a plurality of first lattices. 1. A conductive sheet comprising a plurality of conductive patterns arranged in one direction , whereinthe conductive patterns each contain a combination of a plurality of first lattices and a plurality of second lattices, the first lattices and the second lattices are composed of thin metal wires, and the second lattices are larger than the first lattices,second lattice portions containing the second lattices are arranged in the one direction,first lattice portions containing the first lattices are arranged at predetermined intervals in a direction approximately perpendicular to the one direction, andthe first lattice portions are not connected with the second lattice portions.2. The conductive sheet according to claim 1 , wherein the first lattice portions each contain two or more first lattices arranged in the one direction.3. The conductive sheet according to claim 1 , wherein the first lattice portions each contain an L-shaped pattern containing a corner of the first lattices.4. The conductive sheet according to claim 1 , wherein the first lattice portions each contain a cross-shaped pattern containing a corner of the first lattices.5. The conductive sheet according to claim 1 , wherein the first lattices have a side ...

Flexible Substrate, Support Platform, Flexible Display And Manufacturing Method Thereof

The invention relates to manufacturing of displays. A flexible substrate is disclosed, which has a plurality of spacers arranged at intervals on one side thereof. The invention also discloses a support platform with spacers arranged at intervals, a flexible display formed from the flexible substrate with the spacers arranged at intervals and a method for manufacturing the flexible display. 1. A flexible substrate , wherein a plurality of spacers are arranged at intervals on one side of the flexible substrate.2. The flexible substrate in accordance with claim 1 , wherein the distance between any two adjacent ones of the plurality of spacers is from 10 to 500 μm.3. The flexible substrate in accordance with claim 2 , wherein the spacers are arranged in an array claim 2 , and each of the spacers has a cuboid structure with a height thereof ranging from 0.25 to 10 μm.4. The flexible substrate in accordance with claim 3 , wherein each of the spacers has a length and a width ranging from 10 to 500 μm.5. The flexible substrate in accordance with claim 2 , wherein each of the spacers has a cross-section shape of a trapezoid claim 2 , a triangle claim 2 , or a diamond.6. The flexible substrate in accordance with claim 5 , wherein the spacers are made of one of resin. silicon oxide claim 5 , silicon nitride and metal oxide claim 5 , or a combination thereof.7. The flexible substrate in accordance with claim 1 , wherein the flexible substrate is one of an ultra-thin glass substrate claim 1 , a plastic substrate claim 1 , a metal substrate or a combination thereof.8. A support platform for a flexible substrate claim 1 , comprising a plurality of spacers arranged at intervals on a surface of the support platform for flexible substrate.9. The support platform in accordance with claim 8 , wherein a distance between any two adjacent ones of the plurality of spacers is from 10 to 500 μm.10. The support platform in accordance with claim 9 , wherein the spacers are arranged in an array ...

CONDUCTIVE SHEET AND TOUCH PANEL

In this conductive sheet and touch panel, a first conductive pattern has a band-shaped section extending in the y-direction; a second conductive pattern has a plurality of electrode sections that are each connected in the x-direction by a connection section; the first conductive pattern and the second conductive pattern are both configured combining a first lattice and a second lattice (having a size larger than that of the first lattice); the facing portions of each of the band-shaped section of the first conductive pattern and the connection section of the second conductive pattern are configured from a plurality of second lattices; and when seen from the upper surface, the facing portions of the band-shaped section and the connection section have a form combining a plurality of first lattices. 1. A conductive sheet comprising a first conductive part and a second conductive part overlapping with each other , whereinthe first conductive part contains a plurality of first conductive patterns arranged in one direction,the second conductive part contains a plurality of second conductive patterns arranged in another direction approximately perpendicular to the one arrangement direction of the first conductive patterns,the first conductive patterns each contain a strip extending in the other direction approximately perpendicular to the one direction,the second conductive patterns each contain a plurality of electrode portions, which are connected with each other by a connection in the one direction,the first conductive patterns and the second conductive patterns each contain a combination of a plurality of first lattices and a plurality of second lattices, the first lattices and the second lattices are composed of thin metal wires, and the second lattices are larger than the first lattices,the second lattices are used in overlapping portions in the strips of the first conductive patterns and the connections of the second conductive patterns, andas viewed from above, the ...

FLEXIBLE WIRING BOARD, METHOD FOR MANUFACTURING SAME, MOUNTED PRODUCT USING SAME, AND FLEXIBLE MULTILAYER WIRING BOARD

A flexible wiring board includes an electric insulating base material including an incompressible member having bendability and a thermosetting member having bendability; a first wiring and a second wiring formed with the electric insulating base material interposed therebetween; and a via-hole conductor penetrating the electric insulating base material, and electrically connecting the first wiring and the second wiring to each other. The via-hole conductor includes a resin portion and a metal portion. The metal portion includes a first metal region mainly composed of Cu; a second metal region mainly composed of a Sn—Cu alloy; and a third metal region mainly composed of Bi. The second metal region is larger than the first metal region, and larger than the third metal region. 1. A flexible wiring board comprising:an electric insulating base material including an incompressible member having bendability and a thermosetting member having bendability;a first wiring and a second wiring formed with the electric insulating base material interposed therebetween; anda via-hole conductor penetrating the electric insulating base material, and electrically connecting the first wiring and the second wiring to each other, [ a first metal region mainly composed of Cu;', 'a second metal region mainly composed of a Sn—Cu alloy; and', 'a third metal region mainly composed of Bi, and, 'the metal portion includes, 'the second metal region is larger than the first metal region, and larger than the third metal region., 'wherein the via-hole conductor includes a resin portion and a metal portion, and'}2. The flexible wiring board of claim 1 ,wherein the second metal region covers the first metal region and the third metal region.3. The flexible wiring board of claim 1 ,wherein the first metal region and the third metal region are present in a state in which they are not brought into contact with each other.4. The flexible wiring board of claim 1 ,{'sub': 6', '5', '3', '6', '5', '3, ' ...

CIRCUIT BOARD DEVICE AND ELECTRONIC DEVICE

A circuit board device includes: a circuit board; an electronic component bonded to a first surface of the circuit board via an electronic component-bonding portion that is disposed over a rectangular region; and a reinforcing member disposed at one of four corners of a rectangular region of a second surface of the circuit board that is at a position corresponding to a position of the rectangular region of the first surface on a side opposite a side on which the rectangular region is present, wherein the reinforcing member includes a stress receiving portion having an outer edge located in a diagonal line direction of the rectangular region of the second surface and a stress dispersing portion extending in such a manner as to have a fan-like shape or a substantially fan-like shape toward the inside in the diagonal line direction with the stress receiving portion. 1. A circuit board device comprising:a circuit board;an electronic component bonded to a first surface of the circuit board via an electronic component-bonding portion that is disposed over a rectangular region; anda reinforcing member disposed at one of four corners of a rectangular region of a second surface of the circuit board that is at a position corresponding to the position of the rectangular region of the first surface on a side opposite the side on which the rectangular region is present,wherein the reinforcing member includes a stress receiving portion having an outer edge located along a diagonal axis of the rectangular region of the second surface that is positioned outside the corner of the rectangular region along the diagonal axis and a stress dispersing portion extending so as to have a fan-like shape or a substantially fan-like shape toward the center of the diagonal axis with the stress receiving portion being an end of the fan-like shape or the substantially fan-like shape.2. The circuit board according to claim 1 ,wherein a hollow portion is formed in a portion of the stress receiving ...

WIRING SUBSTRATE

A wiring substrate is provided with a substrate core including a first main surface, a second main surface, and a through hole. An electronic component is arranged in the through hole. A projection projects from a wall of the through hole toward a connection terminal of the electronic component. An insulator is filled between the wall of the through hole and the electronic component. A first insulation layer covers the electronic component and the first main surface. A second insulation layer covers the electronic component and the second main surface. The electronic component includes an electronic component body and the connection terminal formed on a side of the electronic component body. The connection terminal of the electronic component includes an engagement groove formed by the projection and extending along a direction in which the electronic component is fitted into the through hole. 1. A wiring substrate comprising:a substrate core including a first main surface, a second main surface, and a through hole;an electronic component arranged in the through hole;a projection that projects from a wall of the through hole toward a connection terminal of the electronic component;an insulator filled between the wall of the through hole and the electronic component;a first insulation layer that covers the electronic component and the first main surface of the substrate core; anda second insulation layer that covers the electronic component and the second main surface of the substrate core, whereinthe electronic component includes an electronic component body and the connection terminal formed on a side of the electronic component body, andthe connection terminal of the electronic component includes an engagement groove formed by the projection and extending along a direction in which the electronic component is fitted into the through hole.2. The wiring substrate according to claim 1 , whereinthe projection is one of a plurality of projections including two ...

HEAT DISSIPATING SUBSTRATE, AND ELEMENT EQUIPPED WITH SAME

A main object of the invention is to provide a heat dissipating substrate which is excellent in heat dissipating performance, and undergoes neither peel therein nor short circuit. The invention attains this objet by providing a heat dissipating substrate comprising a support base material, an insulating layer formed directly on the support base material, and a wiring layer formed directly on the insulating layer, wherein the insulating layer is formed by non-thermoplastic polyimide resin, and has a thickness in the range of 1 μm to 20 μm. 1. A heat dissipating substrate , comprising:a support base material;an insulating layer formed directly on the support base material; anda wiring layer formed directly on the insulating layer,wherein the insulating layer is formed by a non-thermoplastic polyimide resin, and has a thickness in the range of 1 μm to 20 μm.2. The heat dissipating substrate according to claim 1 , wherein the insulating layer is substantially a single layer.3. The heat dissipating substrate according to claim 1 , wherein the support base material has a thickness of 70 μm or more.4. The heat dissipating substrate according to claim 1 , wherein the insulating layer has a coefficient of linear thermal expansion in the range of 0 ppm/° C. to 40 ppm/° C.5. The heat dissipating substrate according to claim 1 , wherein a difference between a coefficient of linear thermal expansion of the insulating layer and a coefficient of linear thermal expansion of the support base material is 15 ppm/° C. or less.6. The heat dissipating substrate according to claim 1 , wherein the insulating layer has a coefficient of hygroscopic expansion in the range of 0 ppm/% RH to 15 ppm/% RH.7. The heat dissipating substrate according to claim 1 , wherein the non-thermoplastic polyimide resin has a volume resistivity of 1.0×10Ω·m or more.8. The heat dissipating substrate according to claim 1 , whereinthe support base material is a base material including a metal base material ...

In-Situ Fold-Assisting Frame for Flexible Substrates

A method for manufacturing devices built on flexible substrates employs an in-situ, fold-assisting device frame. The fold-assisting frame conforms to a portion of the interior volume within the package, such that one or more pivoting members of the frame may be used as an in-situ, bending jig, in place of conventional bending equipment, to support and fold the planar flexible substrate into a desired three-dimensional configuration. The frame may accommodate placement of an unfolded or partially folded flexible circuit board so that a fold-assisting feature, such as a hinge, incorporated into the frame attaches to the flexible circuit board and closes around a pivot point to gently bend the circuit board into place, thus creating a three-dimensional folded circuit. Such a fixture and method facilitate packaging electronic devices in a compact form, with application to a wide range of mobile consumer electronics, including, for example, implantable medical devices. 16-. (canceled)7. A method of folding a flexible substrate , in situ , within a device frame , the method comprising the steps of:providing a flexible frame of which at least a portion conforms to an interior shape of a device housing;aligning a pivoting portion of the flexible frame to a corresponding portion of the flexible substrate;securing the pivoting portion to the flexible substrate portion; andbending the pivoting portion of the flexible frame and the flexible substrate portion together into a desired three-dimensional configuration to fit conformally within the housing.8. The method of claim 7 , wherein aligning the pivoting portion of the flexible frame to a corresponding portion of the flexible substrate comprises placing the flexible substrate into a central compartment of the flexible frame.9. The method of claim 7 , wherein securing the pivoting portion to the flexible substrate portion comprises securing an upper substrate extension of the flexible substrate to the pivoting member by a ...