Patterning apparatus and film patterning method

A patterning apparatus of the present invention includes a stage (10) on which a substrate (2) is loaded, a coating means (14) for coating a liquid (3) that reacts with an ultraviolet ray to deposit metal on the substrate (2), and an ultraviolet irradiating means (22) for irradiating the ultraviolet ray onto the liquid (3) that is coated on the substrate (2).

Electrical circuit board

Heat decomposable compositions containing organogold compound and resin binder

The invention concerns fluid compositions containing gold resinate, resin binders and a vehicle which compositions are suitable for producing gold seed layers by firing on a ceramic substrate. The compositions are characterized by resin binders comprising polymers having thermal decomposition temperatures at least 200 DEG C above the decomposition temperature of the gold resinate, and being capable of producing gold seed layers which retain high adhesion to the substrate after prolonged exposure to elevated temperatures.

METHOD OF MAKING CIRCUIT ELEMENTS IN A FILM

High resolution conductive patterns having low variance through optimization of catalyst concentration

COMPOSITIONS FOR THE PRODUCTION OF SEED LAYERS

NITRILGRUPPEN ABSTENTION POLYMER AND PROCEDURE FOR ITS SYNTHESIZING, COMPOSITION WITH NITRILGRUPPEN ABSTENTION POLYMER AND LAMINATE

PROCEDURE FOR MANUFACTURING HOLES IN A MULTILAYER PRINTED CIRCUIT

Graphene complexes and compositions thereof

Disclosed herein are complexes comprising graphene compositions thereof. Also disclosed herein are methods of synthesising said complexes and compositions, and the use of said complexes and compositions in, for instance, biomolecular sensing.

STRESS RELAXATION TYPE ELECTRONIC COMPONENT, A STRESS RELAXATION TYPE CIRCUIT BOARD, AND A STRESS RELAXATION TYPE ELECTRONIC COMPONENT MOUNTED MEMBER

A stress relaxation electronic part to be mounted on a wiring board and having a conductive stress relaxing mechanism body on the side where the part is connected to the wiring board.

Sealing material

Method of fabricating a multi-layer hybrid circuit using organometallic compounds

Ce procédé consiste à former un premier masque (4) de résine photolithographique sur un substrat (2) dont les motifs sont inverses de ceux des pistes (10a) à réaliser, déposer une couche d'organométallique apte à précipiter sur le substrat, sous forme d'un composé minéral conducteur ou diélectrique, lors d'un traitement thermique, traiter thermiquement la couche d'organométallique pour en éliminer les molécules organiques et libérer le composé minéral (10) qui se dépose sur l'ensemble du circuit, former un second masque (14) de résine photolithographique sur la structure obtenue, dont les motifs sont ceux des pistes à réaliser, éliminer les régions du composé minéral déposé, non masquées par le second masque, traiter thermiquement la structure obtenue pour détruire les premier et second masques et donner les propriétés électriques recherchées au composé minéral des pistes.

CONDUCTIVE METAL INK COMPOSITION AND PREPARATION METHOD FOR CONDUCTIVE PATTERN

본 발명은 롤프린팅 공정 등에 적합하게 적용되어, 보다 향상된 전도도를 나타내는 전도성 패턴의 형성을 가능케 하는 전도성 금속 잉크 조성물 및 이를 이용한 전도성 패턴의 형성 방법에 관한 것이다. 상기 전도성 금속 잉크 조성물은 전도성 금속 분말; 아민기와 하이드록시기를 포함하는 유기 리간드가 지방족 카르복실산 은(Ag)과 결합하여 착체를 형성한 유기 은 착화합물; 25℃에서 증기압이 3torr 이하인 제 1 비수용매 및 25℃에서 증기압이 3torr를 초과하는 제 2 비수용매를 포함하는 비수용매; 및 고분자 코팅성 향상제를 포함한다. The present invention relates to a conductive metal ink composition and a method of forming a conductive pattern using the same, which is suitably applied to a roll printing process, to enable the formation of a conductive pattern exhibiting improved conductivity. The conductive metal ink composition may include a conductive metal powder; Organic silver complexes in which an organic ligand comprising an amine group and a hydroxyl group is bonded to an aliphatic carboxylic acid silver (Ag) to form a complex; A non-aqueous solvent comprising a first non-aqueous solvent having a vapor pressure of 3 torr or less at 25 ° C. and a second non-aqueous solvent having a vapor pressure of more than 3 torr at 25 ° C .; And polymeric coating enhancers.

METHOD COMPRISING A METAL PATTERN OBTAINING STEP AND A METAL PATTERN TRANSFERRING STEP FOR FORMING HIGH CONDUCTIVE METAL PATTERNS ON A FLEXIBLE SUBSTRATE AND EMI FILTER USING THE SAME

PURPOSE: A method for promptly and efficiently forming high conductive metal patterns on a flexible substrate by a simple process and an EMI filter having superior performance manufactured using the method are provided. CONSTITUTION: A method for forming high conductive metal patterns on a flexible substrate comprises: a step of obtaining metal patterns by growing metal crystals through plating after obtaining potential patterns of a seed for crystal growth on a glass substrate; and a step of transferring the metal patterns obtained in the previous step onto a flexible plastic substrate treated with an adhesive, wherein the metal pattern obtaining step comprises: a first step of coating a photocatalytic compound on a glass substrate to form a photocatalytic film; a second step of obtaining potential patterns of a seed for crystal growth by selectively exposing the photocatalytic film obtained in the previous step to light; and a third step of obtaining metal patterns by performing plating ...

PRINTED-CIRCUIT BOARD AND METHOD OF MANUFACTURE THEREOF

La présente invention concerne une carte à circuits imprimés (39) comprenant un circuit de conducteurs (31) pour les plages de points de soudure et une couche de réserve anti-soudure (38) sur le circuit de conducteurs (31), des ouvertures (36, 37) étant ménagées dans la couche de réserve anti-soudure (38) pour accueillir la soudure. Le circuit de conducteurs (31) présente une surface dépolie (32) résultant d'un mordançage chimique réalisé au moyen d'un liquide contenant un complexe cuprique et un acide organique, la couche de réserve anti-soudure (38) étant appliquée sur la surface dépolie (32). Dans cette carte à circuit imprimé, on réalise un contact plus intime entre le circuit fin de conducteurs et la couche de réserve anti-soudure en des zones où des bosses de soudure se sont formées, ce qui prévient toute défaillance de connexion électrique.

Printed circuit board and method for producing the same

A printed circuit board includes insulating layers formed by impregnating a base material with a resin and a metal foil pattern formed on a desired layer of the insulating layers. Ions for forming a hardly soluble metal salt by combining with metal ions free from a portion of the board or a sulfur-containing compound for reacting with the metal ion are present in the insulating layer or on a surface of the metal foil pattern. Furthermore, a method for producing the printed circuit board includes any one of the steps of adding the ions or the sulfur-containing compound to the resin varnish, impregnating a base material with the solution of the ions or the sulfur-containing compound, or applying the solution onto the surface of the metal foil pattern, in order to allow the ions or the sulfur-containing compound to exist in the printed circuit board.

Microetchant for copper surfaces and processes for using same

An alkaline solution for the microetching of copper in the course of printed circuit manufacture is provided by combining components which are a source of cupric ion, ammonium hydroxide and/or a source of ammonium ion, and a compound, other than ammonia, which is a chelator for cupric ion in the alkaline environment of the solution. The microetchant composition is stable, brings about a desired microroughening of the copper surface with minimal removal of copper, is easily regenerated, and does not promote pink ring. When an organosilane through-hole conditioning agent is included in the composition, the composition can be used as a means for effecting in one step the microetching and conditioning steps of a printed circuit through-hole metallization process.

Circuit board structure and fabrication method thereof

A circuit board structure and fabrication method thereof are disclosed, including: a circuit board with a circuit layer thereon; a reactant formed on the surface of the circuit layer, wherein the reactant is an organic metallic polymer having a polymer end and a metal ion end; and a dielectric layer formed above the reactant and the circuit board, thus forming a metallic bond between the metal ion end of the reactant and the circuit layer and forming a chemical bond between the polymer end of the reactant and the dielectric layer. Owing to enhanced bonding between the dielectric layer and the circuit board, electrical performance of the circuit board structure is improved, and the demand for fine circuits is met.

Coating for the mitigation of metal whiskers

A coating for mitigating metal whiskers on a metal surface includes a polymeric coating material; and a metal ion complexing agent impregnated within the polymeric coating material, the metal ion complexing agent having a standard reduction potential (E°) that is greater than a metal in the metal surface.

Electroconductive composition, method for forming electroconductive film, and electroconductive film

An electroconductive composition including silver oxide (A) and silver salt of a fatty acid (B) containing at least one hydroxy group is provided. The electroconductive composition is capable of forming an electroconductive film at a low temperature and in a short period. The electroconductive composition is capable of adequately forming an electroconductive film on a substrate having a low heat resistance.

METHOD OF FORMING METAL PATTERN, AND METAL SALT MIXTURE

An objective is to provide plate making printing exhibit conductivity and flexibility with respect to a flexible substrate, and to provide a method of forming metal patterns via non-plate making printing, and a metal salt mixture usable for the method. Also disclosed is a method of forming a metal pattern possessing the steps of conducting patterning on a substrate with a metal salt mixture for the metal pattern formation possessing a metal salt and a reducing agent, and having a viscosity of 3-50 mPa.s at 25 ° C., and forming the metal pattern via heating to a temperature of 80-400° C.

Electrode and wiring forming method and method of manufacturing image forming apparatus

CONDUCTIVE PATTERNING

PRECIPITATION TYPE SOLDER COMPOSITION AND METHOD OF PRECIPITATING SOLDER

PROBLEM TO BE SOLVED: To provide a lead-free precipitation type solder composition of tin and silver or copper in which the liberation precipitation of silver and/or copper is suppressed, and the reduction precipitation of silver or copper is prevented, and which can form suitable lead-free solder on the surface of a conductor of a circuit pattern. SOLUTION: The precipitation type solder composition contains metal tin powder, and a complex of silver ions and/or copper ions and aryl or alkylphosphines or azoles. COPYRIGHT: (C)2003,JPO ...

ИМЕЮЩИЙ ПОКРЫТИЕ ЭЛЕКТРИЧЕСКИЙ УЗЕЛ

Structured electrically conductive metal layers producing method for use during production of electronic circuit utilized for e.g. smart label, involves removing solvent from connection and transferring connection into layer

The method involves providing an electrical isolating substrate with a foil made of polyethylene terephthalate. A metal-organic precursor-connection is provided and structured on the substrate, where the connection comprises silver neodecanoate. The connection is dissolved in a solvent and the solvent is removed from the metal-organic precursor connection, where the solvent comprises xylene, toluene or anisole. The metal-organic precursor connection is transferred into an electrically conductive metal layer under effect of atmosphere plasma that is produced using a plasma nozzle.

Anordnung zur Herstellung von gedruckten Stromkreisen

Heat decomposable compositions containing organogold compound and glass forming resinate

The invention concerns fluid compositions containing gold resinate, resin binders and a vehicle which compositions are suitable for producing gold seed layers by firing on a ceramic substrate. The compositions are characterized by the inclusion of at least 1% by weight glass forming resinates and being capable of producing gold seed layers which retain high adhesion to the substrate after prolonged exposure to elevated temperatures. In a preferred embodiment the compositions also comprise resin binders comprising polymers having thermal decomposition temperatures at least 200 DEG C above the decomposition temperature of the gold resinate.

Electrical power substrate

ELECTRICAL CIRCUIT BOARD

ELECTRICAL CIRCUIT BOARD PRODUCTION

A thin metal layer is bonded to an insulating substrate and metal tracks are plated e.g. by electroplating onto the thin metal layer, the surface of the tracks and the entire thickness of the metal layer are then converted to compound which is soluble in a fluid that doesn't attack the metal conductors, and the compound is removed by chemical dissolution to leave the metal tracks substantially unaltered.

HEAT DECOMPOSABLE FLUID COMPOSITIONS CONTAINING ORGANOGOLD AND ORGANOSILVER COMPOUNDS

A fluid composition for producing a gold seed layer on a substrate for an electrical circuit, which comprises an organogold compound and an organosilver compound present as 0,5 to 10 parts by weight silver per 100 parts by weight gold. In preferred compositions, the silver is present as 0,8 to 6 parts by weight per 100 parts by weight gold.

Electrical circuit board

Patterning apparatus and film patterning method

ELECTRICAL CIRCUIT BOARD

ARTICLE WITH COATING FROM ELECTRICALLY DIRECTION POLYMER AND NOBLE /HALBEDELMETAL AS WELL AS MANUFACTURING PROCESSES FOR IT

BENZOXAZIN AND EPOXY RESIN CONTAINING COMPOSITION

VERBINDUNGSKÖRPER

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EPOXY RESIN SYSTEM

Method for improving bonding of rigid, thermosetting compositions to hydrophilicsurfaces, and the articles formed thereby

Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards

ARTICLE WITH A COATING OF ELECTRICALLY CONDUCTIVE POLYMER AND PRECIOUS/SEMIPRECIOUS METAL AND PROCESS FOR PRODUCTION THEREOF

The invention relates to a coated article which has (i) at least one elec trically non-conducting base layer, (ii) at least one layer of copper and/or a copper alloy, and (iii) a layer which contains at least one electrically conductive polymer, wherein the copper or copper alloy layer (ii) is positio ned between the base layer (i) and the layer containing the conductive polym er (iii), and which is characterized in that the layer (iii) contains at lea st one precious metal or at least one semiprecious metal or a mixture thereo f. The invention also relates to a process for its production and also its u se for the prevention of corrosion and to preserve the solderability of prin ted circuit boards.

COMPOSITION OF PALLADIUM UNSATURATED ORGANOAMINE COMPLEX AND PALLADIUM NANOPARTICLES

A palladium first composition is disclosed, including a palladium salt and an unsaturated organoamine, wherein the composition is substantially free of water, and wherein the first composition forms a second composition including stable palladium nanoparticles and a palladium unsaturated organoamine. The composition permits the use of solution processing methods to form a palladium layer on a wide variety of substrates, including in a pattern to form circuitry or pathways for electronic devices.

COMPOSITIONS FOR THE PRODUCTION OF SEED LAYERS

The invention concerns fluid compositions containing gold resinate, resin binders and vehicle which are suitable for producing gold seed layers by firing on a ceramic substrate. The compositions are characterized by the inclusion of at least 1% glass resinate and being capable of producing gold seed layers which retain high adhesion to the substrate after prolonged exposure to elevated temperatures. In a preferred embodiment the compositions also comprise resin binders comprising polymers having thermal decomposition temperatures at least 200.degree.C above the decomposition temperature of the gold resinate.

COMPOSITIONS FOR THE PRODUCTION OF SEED LAYERS

The invention concerns fluid compositions containing gold resinate, resin binders and vehicle and suitable for producing gold seed layers by firing on a ceramic substrate. The compositions are characterized by the inclusion of at least 1% glass forming resinates and being capable of producing gold seed layers which retain high adhesion to the substrate after prolonged exposure to elevated temperatures. In a preferred embodiment the compositions also comprise resin binders comprising polymers having thermal decomposition temperatures at least 200.degree.C above the decomposition temperature of the gold resinate.

STRESS RELAXATION TYPE ELECTRONIC COMPONENT, A STRESS RELAXATION TYPE CIRCUIT BOARD, AND A STRESS RELAXATION TYPE ELECTRONIC COMPONENT MOUNTED MEMBER

A stress relaxation type electronic component which is to be mounted on a circuit board, wherein a stress relaxation mechanism member is disposed on a surface of said electronic component, said surface being on a side of a connection portion where said electronic component is to be connected to said circuit board, and said stress relaxation mechanism member is electrically conductive.

Thermosetting resin composition and prepreg and laminated sheet using the same

SOLUTIONS OF METALLIC SILVER IN ISOCYANIDES

METHOD FOR PRODUCING ELECTRICALLY CONDUCTIVE LINES ON AN INSULATING SUBSTRATE AND MICROWAVE CIRCUIT COMPRISING SAME

?unidade elétrica revestida?

ELECTRICAL COMPONENTS AND METHOD OF MANUFACTURE

An electrical component provides a ceramic element 264 located on or in a dielectric substrate 262 between and in contact with a pair of electrical conductors 260A,.260B, wherein the ceramic element includes one or more metal oxides having fluctuations in metal- oxide compositional uniformity less than or equal to 1.5 mol% throughout the ceramic element. A method of fabricating an electrical component, provides or forming a ceramic element between and in contact with a pair of electrical conductors on a substrate including depositing a mixture of metalorganic precursors and causing simultaneous decomposition of the metal oxide precursors to form the ceramic element including one or more metal oxides.

COMPOSITION AND ASSOCIATED METHOD

A composition includes a polymer precursor and a metal precursor. The metal precursor may include a carbamate and a metal cation. The metal precursor may be responsive to an application of energy to form a metal nanoparticle. An associated method is provided.

Mounting structure for an electronic component and method for producing the same

In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.

Methods of treating a surface to promote metal plating and devices formed

Embodiments of the present invention provide methods of treating a surface of a substrate. In one particular aspect, embodiments of the present invention provide methods of treating a surface of a substrate that promote binding of one or more metal elements to the surface. According to some embodiments of the invention, films are formed on any conducting, semiconductive or non-conductive surface, by thermal reaction of molecules containing reactive groups in an organic solvent or in aqueous solution. The thermal reaction may be produced under a variety of conditions. In another aspect, the present invention provides a printed circuit board, comprising: at least one substrate; a layer of organic molecules attached to the at least one substrate; and a metal layer atop said layer of organic molecules.

Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates

The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

SOLDER BALL EXCELLENT IN MICRO-ADHESION PREVENTING PROPERTIES AND WETTING PROPERTIES AND METHOD FOR PREVENTING THE MICRO-ADHESION OF SOLDER BALLS

The present invention provides a solder ball that has solved the problem of micro-adhesion and, moreover, has solved both of the problems of micro-adhesion and wetting properties, and a method for preventing the micro-adhesion of solder balls. That is, the present invention provides a solder ball obtained by solidification and spheroidization in a gas phase and having metal soap molecules, preferably a metal soap molecules film of 3 nm or less in thickness, adsorbed on its surface. As the metal soap, there can be used, for example, calcium stearate, magnesium stearate or barium stearate. The present invention is preferably applied to solder balls with a diameter of 400 μm or less. The present invention also provides a method for preventing the micro-adhesion of solder balls which comprises immersing solder balls obtained by solidification and spheroidization in a gas phase, in a solution containing a metal soap dispersed therein, preferably, a solution containing a metal soap dispersed ...

Low temperature method and composition for producing electrical conductors

A composition of matter having a metal powder or powders of specified characteristics in a Reactive Organic Medium (ROM). These compositions can be applied by any convenient printing process to produce patterns of electrical conductors on temperature-sensitive electronic substrates. The pattern can be thermally cured in seconds to form pure metal conductors at a temperature low enough to avoid damaging the substrate.

Electron attachment assisted formation of electrical conductors

This invention is directed to a method of forming electrical conductors comprised of conductive metals generally carried on a substrate. In the method, a conductor formulation generally comprised of metal particles or metal precursor or mixture thereof, typically in the form of an ink or paste, is applied to the substrate and converted into a conductive metal by application of sufficient heat and for a sufficient time to effect sintering thereof while in the presence of a negatively charged ionic reducing gas.

Method of producing a wiring board

A wiring board comprises a substrate; a resin layer which is selectively formed on one main surface of the substrate and has fine metal particles contained or adhered to its surface; and a conductive metal layer which is formed on the resin layer with the fine metal particles interposed between them.

Methods of Printing Conductive Silver Features

A method of forming a conductive ink silver features on a substrate by printing a silver compound solution and a hydrazine compound reducing agent solution on the surface of a substrate with a printhead. The silver compound solution and the hydrazine compound reducing agent solution are mixed just before, during, or following the printing of both solutions on the surface of the substrate, and the silver compound is then reduced to form conductive silver ink features on the substrate.

METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE

A process for producing a metal film-coated material, the process including: (a1) forming, on a substrate, a polymer layer formed from a polymer which has a functional group capable of interacting with a plating catalyst or a precursor thereof, and is directly chemically bonded to the substrate; (a2) providing a plating catalyst or a precursor thereof to the polymer layer; and (a3) performing plating with respect to the plating catalyst or a precursor thereof. The polymer layer satisfies all of specific requirements regarding the saturated water absorption coefficient, the saturated water absorption coefficient, the water absorption coefficient, and the surface contact angle of the polymer layer.

Electron attachment assisted formation of electrical conductors

This invention is directed to a method of forming electrical conductors comprised of conductive metals generally carried on a substrate. In the method, a conductor formulation generally comprised of metal particles or metal precursor or mixture thereof, typically in the form of an ink or paste, is applied to the substrate and converted into a conductive metal by application of sufficient heat and for a sufficient time to effect sintering thereof while in the presence of a negatively charged ionic reducing gas.

CONDUCTIVE ADHESIVE

Conductive adhesives, which do not have the problem of migration in conductive metals upon application of a voltage and which exhibit low resistance values, are provided. One embodiment of the present invention relates to a conductive adhesive comprising a conductive filler and a resin, characterized in that the conductive filler comprises an alloy powder of silver and tin and further contains an additive comprising at least one member selected from among a chelator, an antioxidant, and a metal surfactant. Additives that can be used are chelators such as hydroxyquinolines, salicylidene aminothiophenols or phenanthrolines, antioxidants such as hydroquinones or benzotriazoles, and metal surfactants such as organic acids, acid anhydrides or organic acid salts.

Method for producing metal/ceramic bonding circuit board

FORMING METHOD OF CONDUCTIVE PATTERN, AND SUBSTRATE HAVING CONDUCTIVE PATTERN MANUFACTURED BY THE METHOD

PROBLEM TO BE SOLVED: To provide a manufacturing method of a substrate including a conductive pattern whereby the high conductivity of the conductive pattern can be obtained even when baking the pattern by a lower baking temperature than the baking temperature of a substrate including a conductive pattern formed by using an organic material singly or by using an inorganic material singly, and provide a substrate including the conductive pattern manufactured by the method. SOLUTION: The manufacturing method of the substrate includes a step of discharging a conductive inorganic composition containing conductive inorganic metal particles, on a base material, a step of discharging a conductive organic composition containing a conductive organic complex, on the conductive inorganic composition, and a step of baking the conductive inorganic and organic compositions. The substrate includes the conductive pattern manufactured by the manufacturing method. COPYRIGHT: (C)2010,JPO&INPIT ...

METHOD OF FORMING METALLIC PATTERN AND METAL SALT MIXTURE

PROBLEM TO BE SOLVED: To provide a method of forming a metallic pattern by plate making printing or non-plate making printing that is provided with the excellent conductivity and flexibility to a flexible base material, and a metal salt mixture for use in the method. SOLUTION: The method of forming the metallic pattern includes the steps of using the metal salt mixture for forming a metallic pattern which contains at least metal salt as well as reducing agent and whose viscosity at 25°C is 3-50 mPa s, drawing a pattern on a substrate material, and heating the substrate at 80-400°C. COPYRIGHT: (C)2008,JPO&INPIT ...

Härtbare Polyphenylenether/Polyepoxid-Zusammensetzung, verwendbar zur Herstellung von Leiterplatten für gedruckte Schaltungen.

COMPOSITIONS

Electrical circuit board

VERBINDUNGSKÖRPER

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SILVER ORGANO SOL COLORING MATERIAL FOR FORMING ELECTRICAL OF CONDUCTIVE SAMPLES

Electronic element and method of manufacture

Thermosetting resin composition and prepreg and laminated sheet using the same

Manufacture of multilayer circuits on insulated substrates

Suivant le procédé, on dépose une pellicule de composé organo-métallique de faible viscosité à base d'or sur le substrat isolant et on le décompose par chauffage pour constituer une pellicule d'accrochage; on constitue un premier réseau conducteur par dépôt électrolytique, sur la pellicule d'accrochage, d'une épaisseur de métal conducteur supérieure à celle de la pellicule et par photolithographie, la photolithographie précédant ou suivant le dépôt électrolytique; on constitue un premier niveau isolant en verre pouvant supporter une température supérieure à 800degré C sans modification de ses propriétés physiques par dépôt d'une couche mince de verre contenu dans un produit liquide photosensible et séchage; on constitue des trous de via dans le premier niveau par photogravure; on répète les opérations (a) à (d), la nouvelle étape (a) étant menée de façon à remplir les trous de via; et on cuit l'ensemble ainsi constitué entre 800degré C et 900degré C.

EPOXY RESIN COMPOSITIONS, PROCESSES UTILZING SAME AND ARTICLES MADE THEREFROM

Disclosed are epoxy resin compositions which include an alkali metal containing cure accelerator. The alkali metal containing cure accelerators are preferably alkali metal hydroxides, alkoxides, carboxylates, or alkali metal salts. Articles prepared from the resin compositions of the invention exhibit enhanced thermal properties, and similar non-thermal properties, when compared to articles prepared from compositions including other accelerators such as imidazoles. The resin compositions of the invention may be used for any purpose, but are particularly suited to be utilized in the manufacture of laminates for printed circuit boards and non-electrical structural applications. © KIPO & WIPO 2007 ...

LOW TEMPERATURE METHOD AND COMPOSITIONS FOR PRODUCING ELECTRICAL CONDUCTORS

A composition of matter having a metal powder or powders of specified characteristics in a Reactive Organic Medium (ROM). These compositions can be applied by any convenient printing process to produce patterns of electrical conductors on temperature-sensitive electronic substrates. The pattern can be thermally cured in seconds to form pure metal conductors at a temperature low enough to avoid damaging the substrate. © KIPO & WIPO 2007 ...

ELECTROCONDUCTIVE INK

This invention provides an electroconductive ink comprising metallic fine particles and a solvent. A screen printing method for printing the above electroconductive ink utilizing a screen printing technique is known as a method for forming an electroconductive circuit pattern on various substrates. In the screen printing method, however, since the formation of a fine circuit pattern is difficult, a method for printing the above electroconductive ink by an ink jet method has recently been proposed as a method for directly forming a fine circuit pattern. A print pattern formed by the ink jet method suffers from, for example, a problem of unsatisfactory adhesion to various substrates. The above problem can be solved, for example, by incorporating a Ti-or Al-containing coupling agent or an inorganic binder of a chelate in the above electroconductive ink. © KIPO & WIPO 2009 ...

High performance curable with tin metal salt compatibilizing agent PPO/monomeric epoxy compositions

LOW TEMPERATURE THERMAL CONDUCTIVE INKS

METHOD OF BONDING METAL PATTERN HAS A

composition of nanoparticles of palladium and organoamina unsaturated and method

Method of manufacturing microstructures of metal lines

A method of manufacturing microstructures of metal lines is disclosed. The method includes the steps of (a) providing a substrate; (b) forming a seed layer on the surface of the substrate; (c) forming a photo-resist layer on the surface of the seed layer and forming a patterned trench in the photo-resist layer by performing an exposure and lithography process, wherein the patterned trench has a specific width; (d) filling a metal conductive layer into the patterned trench by an electroplating process; and (e) removing the photo-resist layer and removing portion of the seed layer, which has no contact and no connection with the metal conductive layer, so as to form the microstructures of metal lines.

Structure having conductive pattern region and manufacturing method thereof, laminate and method for manufacturing the same, and copper wiring

The present invention provides a structure having conductive pattern region which allows manufacturing process to be extremely simplified, has excellent electrical insulation between conductive pattern regions, and has high reliability. A structure (10) having conductive pattern region comprises a support (11), and a layer (14) in which an insulating region (12) containing copper oxide and phosphorus-containing organic substance and a conductive pattern region (13) containing copper are disposed adjacent to each other on a surface formed of the support. In addition, a laminate comprises a support, a coating layer containing copper oxide and phosphor disposed on a surface formed of the support, and a resin layer disposed so as to cover the coating layer.

Polishing composition and polishing method

Method for forming highly conductive metal pattern on flexible substrate and EMI filter using metal pattern formed by the method

Disclosed herein is a method for forming a highly conductive metal pattern which comprises forming a metal pattern on a substrate by the use of a photocatalyst and a selective electroless or electroplating process, and transferring the metal pattern to a flexible plastic substrate. According to the method, a highly conductive metal pattern can be effectively formed on a flexible plastic substrate within a short time, compared to conventional formation methods. Further disclosed is an EMI filter comprising a metal pattern formed by the method. The EMI filter not only exhibits high performances, but also is advantageous in terms of low manufacturing costs and simple manufacturing process. Accordingly, the EMI filter can be applied to a variety of flat panel display devices, including PDPs and organic ELs.

PATTERNING APPARATUS AND FILM PATTERNING METHOD

A patterning apparatus of the present invention includes a stage on which a substrate is loaded, a coating means for coating a liquid that reacts with an ultraviolet ray to deposit metal on the substrate, and an ultraviolet irradiating means for irradiating the ultraviolet ray onto the liquid that is coated on the substrate.

Process for preparing a metallized polymide film containing a hydrocarbyl tin compound

A vacuum metallized polyimide film comprising an aromatic polyimide layer containing a hydrocarbyl tin compound in oxidation states (II) or (IV) as an additive and a metal plated layer bonded integrally with a high bonding strength or high adhesion through a vacuum deposited metal layer without the use of an adhesive. The metallized polyimide film can be used for flexible printed circuits and multilayer printed wiring boards, as well as for heaters, antennas and antistatic films.

Metallization method for microwave circuit

The method involves a thick film paste that is screen printed over the circuit plane of the substrate in the desired circuit pattern. The thick film paste is dried and fired. A metallorganic conductive paste is screen printed on top of the thick film circuit pattern, then it is dried and fired. If the printed circuit covers the whole substrate, the metallorganic paste is screen printed over the whole substrate. Alternatively, if the printed circuit covers portions of the substrate, the metallorganic paste is screen printed only over those portions. If the linewidth of the desired circuits is less than 4 mils, then the circuits are defined by photolithography. Alternatively, if the desired linewidth is greater than 4 mils, the screen printing technology is sufficient to define the circuits.

Polybutadiene thermosetting resin printed circuit board composition and the process thereof

The present invention is about a composition for high performance printed circuit board. Said composition includes 20-35 wt % of high molecular polymer of high molecular weight of polybutadiene with high vinyl groups, low molecular weight of polybutadiene and cyclic olefin polymer with two or above vinyl groups, and/or thermosetting polymer resin which was polymerized from acrylic acid, acrylonitrile and butadiene; 10-30 wt % woven glass fiber reinforced cloth; 25-50 wt % inorganic particulate filler; 1-10 wt % metallic coagents; 10-30 wt % brominated flame retardant. Using solvents to dilute the composition to the suitable viscosity, then after the resin sheet (prepreg) had been made by impregnation, the electric circuit board composition with excellent properties can be obtained by laminating at 170-220° C. with 20-50 kg/cm².

COMPOSITION COMPRISING BENZOXAZINE AND EPOXY RESIN

ORGANIC SILVER COMPOUND AND IT'S PREPARATION METHOD, ORGANIC SILVER INK AND IT'S DIRECT WIRING METHOD

Composition for the production of seed layers

The invention concerns fluid compositions containing gold resinate, resin binders and a vehicle which compositions are suitable for producing gold seed layers by firing on a ceramic substrate. The compositions are characterized by resin binders comprising polymers having thermal decomposition temperatures at least 200°C above the decomposition temperature of the gold resinate, and being capable of producing gold seed layers which retain high adhesion to the substrate after prolonged exposure to elevated temperatures. ...

Process for manufacturing printed circuit boards

Circuit boards are produced in a multistage process using an organometallic layer or metallic particle layer. Circuit boards having a substrate made of epoxide, silicon, glass, silicone rubber, or plastic are produced by: (a) drilling holes (4) in the substrate using a laser (1, 2); (b) coating the substrate (3) with an organometallic layer (5) or metallic particle layer (17); (c) placing an illuminating mask (7) in the form of the required conducting structure on the substrate (3); (d) hardening by irradiating the mask and the coating underneath the substrate; (e) removing the mask and subsequently removing the non-hardened part of the coating; and (f) applying a conducting metal layer (14) on the regions of the substrate (3) coated with the hardened organometallic layer (5).

Method and compositions for producing copper surfaces for improved bonding and articles made therefrom

Elektrisch leitfähige Klebstoff-Zusammensetzungen

Artikel mit einer nanoskopischen Beschichtung aus Edel-/Halbedelmetall sowie Verfahren zu deren Herstellung

Die Erfindung betrifft einen beschichteten Artikel, der (i) mindestens eine nicht elektrisch leitende Basisschicht, (ii) mindestens eine Schicht aus Kupfer und/oder einer Kupferlegierung, und (iii) eine nanoskopische Schicht mit einer Dicke von 150 nm oder weniger, die mindestens 80 Gew.-%, bezogen auf die Schicht (iii), mindestens eines von Kupfer verschiedenen Edelmetalls und/oder Halbedelmetalls enthält, aufweist, wobei die Kupfer- oder Kupferund (iii) angeordnet ist. Die Erfindung betrifft ferner ein Verfahren zur Herstellung eines solchen beschichteten Artikels.

COMPOSITIONS

Multilayered printed circuit board and manufacturing method thereof

An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22 , the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20 a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Method for Manufacturing a Double-Sided Printed Circuit Board

Disclosed is a method for manufacturing a double-sided printed circuit board (PCB) having a circuit pattern by printing a conductive paste. According to the method of the present invention, a circuit pattern that is precise and highly conductive can be formed, and a reduction in raw materials and the simplification of processes are made possible. Also, due to the printing of the conductive paste, short-circuit can be prevented even when a conductive layer is bent or exposed to heat or physical impact.

Method of fabricating micro structured surfaces with electrically conductive patterns

A method comprises forming a first pattern on a first flat surface and forming an inverse of the pattern on a second flat surface. The method further comprises attaching the second flat surface to a roller to produce an embossing tool and applying pressure between the embossing tool and a substrate thereby forming a second pattern in the substrate. The substrate is coated with a radiation curable resin material. The method also comprises transferring ink to the substrate, the ink containing a catalyst, and coating the substrate with the second pattern in an electroless plating bath. The first pattern alternatively may be formed on a sleeve which is then attached to a drum/roller.

Starting material for a sintered bond and process for producing the sintered bond

The invention relates to a starter material for a sintering compound, said starter material comprising first particles of at least one metal having a first coating which is applied to the first particles and consists of an organic material, and second particles which contain an organic metal compound and/or a precious metal oxide, the organic metal compound and/or the precious metal oxide being converted during heat treatment of the starter material into the fundamental elemental metal and/or precious metal. The invention is characterized in that the second particles have a core of at least one metal and a second coating which is applied to the core and contains the organic metal compound and/or precious metal oxide. Furthermore, the first coating contains a reducing agent by means of which the organic metal compound and/or the precious metal oxide is/are reduced to the elemental metal and/or precious metal at a temperature below the sintering temperature of the elemental metal and/or precious metal.

Starting material for a sintered bond and process for producing the sintered bond

The invention relates to a starter material for a sintering compound, said starter material comprising particles which at least proportionally contain an organic metal compound and/or a precious metal oxide, the organic metal compound and/or the precious metal oxide being converted during heat treatment of the starter material into the elemental metal and/or precious metal. The invention is characterized in that the particles have a coating containing a reducing agent by means of which the organic metal compound and/or precious metal oxide is reduced to the elemental metal and/or precious metal at a temperature below the sintering temperature of the elemental metal and/or precious metal.

Transparent electrode, method for manufacturing same, and organic electroluminescent element

The present invention addresses the problem of providing a transparent electrode having a low resistance and high storage stability, a method for manufacturing the transparent electrode, and an organic electroluminescent element. This transparent electrode wherein a metal conductive layer is provided on a substrate is characterized in that: the metal conductive layer has a metal fine line, and a plating layer covering the metal fine line; the transparent electrode has a transparent conductive layer on a substrate surface on the side on which the metal fine line is formed, said transparent conductive layer covering the substrate and the metal conductive layer; and the metal fine line is formed using a metal nano-particle ink or a metal complex ink.

Electronic module having an oxide surface finish as a solder mask, and method of manufacturing electronic module using organic solderability preservative and oxide surface finish processes

An electronic module includes a substrate, conductive pads at top and bottom surfaces of the substrate, at least one electronic component disposed on the top surface of the substrate and soldered to the pads at the top surface of the substrate, a molding compound covering the at least one electronic component, and a solder resist comprising an organo-metallic compound at regions between respective ones of the pads at the bottom surface of the substrate. The module is manufactured using both an OSP surface finishing process to coat the pads at the top surface of the substrate with OSP so as to protect the pads from oxidation while the electronic component is being connected to the substrate, and an oxide surface finish process to form the solder resist.

COATING FOR THE MITIGATION OF METAL WHISKERS

A coating for mitigating metal whiskers on a metal surface includes a polymeric coating material; and a metal ion complexing agent impregnated within the polymeric coating material, the metal ion complexing agent having a standard reduction potential (E°) that is greater than a metal in the metal surface. 1. A coating for mitigating metal whiskers on a metal surface , comprising:a polymeric coating material; anda metal ion complexing agent impregnated within the polymeric coating material, the metal ion complexing agent having a standard reduction potential (E°) that is greater than a metal in the metal surface.2. The coating of claim 1 , wherein the metal ion complexing agent comprises a metal ion:Schiff base complex claim 1 , and tin in a tin whisker can displace a metal ion in the metal ion:Schiff base complex.3. The coating of claim 2 , wherein the metal ion of the metal ion:Schiff base complex is a silver ion.4. The coating of claim 2 , wherein the metal ion of the metal ion:Schiff base complex is a gold ion.5. The coating of claim 2 , wherein the metal ion of the metal ion:Schiff base complex is a platinum ion.6. The coating of claim 2 , wherein the metal ion of the metal ion:Schiff base complex is a palladium ion.7. The coating of claim 2 , wherein the metal ion of the metal ion:Schiff base complex is a copper ion.8. The coating of claim 2 , wherein the metal ion of the metal ion:Schiff base complex is a cerium ion.9. The coating of claim 2 , wherein the metal ion of the metal ion:Schiff base complex is a rhodium ion.10. The coating of claim 1 , wherein the metal ion complexing agent is a porphyrin claim 1 , a substituted porphyrin claim 1 , a corrole claim 1 , a substituted corrole claim 1 , a carbaporphyrin claim 1 , a substituted carbaporphyrin claim 1 , an aminopolycarboxylic acid claim 1 , a phthalocyanine claim 1 , a substituted phthalocyanine claim 1 , or a combination thereof.11. The coating of claim 1 , wherein the metal ion complexing agent ...

PRINTING INK COMPOSITION COMPRISING A METAL COMPLEX WITH ADJUSTED VISCOSITY

A printing ink composition includes a metal salt of a metal ion and a counter ion, and a viscosity adjusting agent. The metal ion is present as a metal complex of the metal ion and the viscosity adjusting agent, the viscosity adjusting agent includes at least one functional ligand, where the functional ligand may be a monofunctional ligand having one functional group and multifunctional ligands having more than one functional groups. 116.-. (canceled)17. A printing ink composition comprising a metal salt of a metal ion and a counter ion , and a viscosity adjusting agent , wherein the metal ion is present as a metal complex of the metal ion and the viscosity adjusting agent , wherein the metal of the metal ion is chosen from Ag , Cu , Pd , Au , Pt , Ni , In , Sn , Al and Zn , wherein the viscosity adjusting agent comprises a combination of at least one monofunctional ligand and at least one multifunctional ligand , wherein a monofunctional ligand is a ligand having one functional group , and a multifunctional ligand is a ligand having more than one functional group.18. The printing ink composition according to claim 17 , wherein the metal ion and the viscosity adjusting agent are present in a molar ratio 1:y claim 17 , where y represents the molar amount of functional groups present in the viscosity adjusting agent claim 17 , and wherein y is in the range of 1-4.19. The printing ink composition according to claim 18 , wherein y is in the range of 1-3.20. The printing ink composition according to claim 18 , wherein y is in the range of 1-2.21. The printing ink composition according to claim 18 , wherein y is in the range of 1-1.5.22. The printing ink composition according to claim 17 , wherein the functional group of the monofunctional ligand or a functional group of the multifunctional ligand comprises a hydroxyl claim 17 , carbonyl claim 17 , amino claim 17 , aromatic claim 17 , ether claim 17 , ester or thioester group claim 17 , an unsaturated carbon bond or a ...

COATED ELECTRICAL ASSEMBLY

An electrical assembly which has a multi-layer conformal coating on at least one surface of the electrical assembly, wherein each layer of the multi-layer coating is obtainable by plasma deposition of a precursor mixture comprising (a) one or more organosilicon compounds, (b) optionally O, NO, NO, H, NH, N, SiFand/or hexafluoropropylene (HFP), and (c) optionally He, Ar and/or Kr. The chemistry of the resulting plasma-deposited material chemistry can be described by the general formula: SiOHCFN. The properties of the conformal coating are tailored by tuning the values of x, y, z, a and b. 120.-. (canceled)21. An electrical assembly which has a multi-layer conformal coating on at least one surface of the electrical assembly , wherein the multi-layer conformal coating is obtained by:{'sub': 2', '2', '2, 'contacting the electrical assembly with a first precursor mixture comprising at least one organosilicon compound, under plasma deposition conditions suitable to form a first layer of the multi-layer conformal coating in contact with the electrical assembly, wherein the first layer is organic and hydrophobic, and wherein the first precursor mixture contains no, or substantially no, O, NO or NO; and'}{'sub': 2', '2', '2, 'contacting the electrical assembly with a second precursor mixture comprising at least one organosilicon compound, under plasma deposition conditions suitable to form a second layer of the multi-layer conformal coating, wherein the second layer is organic and hydrophobic, and wherein the second precursor mixture contains no, or substantially no, O, NO or NO.'}22. The electrical assembly according to claim 21 , wherein the multi-layer conformal coating has two to ten layers.23. The electrical assembly according to claim 21 , wherein the plasma deposition is plasma enhanced chemical vapour deposition (PECVD).24. The electrical assembly according to claim 21 , wherein the plasma deposition occurs at a pressure of 0.001 to 10 mbar.25. The electrical ...

Coating for the mitigation of metal whiskers

A coating for mitigating metal whiskers on a metal surface includes a polymeric coating material; and a metal ion complexing agent impregnated within the polymeric coating material, the metal ion complexing agent having a standard reduction potential) (E°) that is greater than a metal in the metal surface.

SILVER-ORGANO-COMPLEX INK WITH HIGH CONDUCTIVITY AND INKJET STABILITY

A robust formulation of silver-organo-complex (SOC) ink and method of making same are provided. In an aspect, the complexing molecules act as reducing agents. The silver loaded ink can be printed and sintered on a wide range of substrates with uniform surface morphology and excellent adhesion. 1. A method of preparing a metal integrated 3D object comprisingdepositing a first layer of UV dielectric ink using a 3D inkjet printer and curing the first layer to form a 3D object;depositing a second layer of UV dielectric ink over the first layer using an inkjet printer and curing the second layer to provide a smoothed surface to the 3D object;depositing a first layer of silver-organo-complex (SOC) ink on at least a portion of the smoothed surface using an inkjet printer and curing the SOC ink layer, wherein the SOC ink comprises a silver cation complexed with a first complexing agent and a second complexing agent and a carboxylic acid or a salt of a carboxylic acid; anddepositing a third layer of UV dielectric ink over at least a portion of the first SOC ink layer using an inkjet printer and curing the third layer.2. The method of claim 1 , wherein the first SOC ink layer is cured by IR heating.3. The method of claim 2 , wherein IR heating is performed at a temperature of less than 80° C.4. The method of claim 1 , wherein the second layer of UV dielectric ink is allowed to spread over the first layer of UV dielectric ink before curing.5. The method of claim 1 , further comprising depositing an additional layer of SOC ink onto the third layer of UV dielectric ink and curing the additional SOC ink layer.6. The method of claim 5 , wherein the additional layer of SOC ink contacts the first SOC ink layer.7. The method of claim 1 , wherein the first complexing agent is an alkyl amine selected from the group consisting of methylamine claim 1 , ethylamine claim 1 , propylamine claim 1 , butylamine claim 1 , and amylamine.8. The method of claim 1 , wherein said second complexing ...

Thermosetting resin composition and uses thereof

A thermosetting resin composition comprising a thermosetting resin, an inorganic filler, and an organomolybdenum compound is disclosed. The thermosetting resin composition may be used for preparing a resin vanish and a prepreg, wherein the prepreg is used for laminates and printed circuit boards.

ANISOTROPIC CONDUCTIVE FILM, CONNECTION METHOD, AND ASSEMBLY

An anisotropic conductive film, which contains a crystalline resin, an amorphous resin, and conductive particles, wherein the anisotropic conductive film is an anisotropic conductive film configured to anisotropic conductively connect a terminal of a first electronic part and a terminal of a second electronic part, and wherein the crystalline resin contains a crystalline resin containing a bond characterizing a resin, which is identical to a bond characterizing a resin contained in the amorphous resin. 1. An anisotropic conductive film , comprising:a crystalline resin;an amorphous resin; andconductive particles,wherein the anisotropic conductive film is an anisotropic conductive film configured to anisotropic conductively connect a terminal of a first electronic part and a terminal of a second electronic part, andwherein the crystalline resin contains a crystalline resin containing a bond characterizing a resin, which is identical to a bond characterizing a resin contained in the amorphous resin.3. The anisotropic conductive film according to claim 1 , wherein a mass ratio (crystalline resin:amorphous resin) of the crystalline resin to the amorphous resin is 25:75 to 75:25.4. The anisotropic conductive film according to claim 1 , wherein the crystalline resin contains a crystalline polyester resin claim 1 , and the amorphous resin contains an amorphous polyester resin.5. The anisotropic conductive film according to claim 1 , further comprising an elastomer.6. The anisotropic conductive film according to claim 5 , wherein a mass ratio (X:Y) of a sum (X) of an amount of the crystalline resin and an amount of the amorphous resin to an amount (Y) of the elastomer is 160:40 to 60:140.7. The anisotropic conductive film according to claim 1 , wherein the conductive particles have an average particle diameter of 2 μm to 40 μm.8. The anisotropic conductive film according to claim 1 , wherein the anisotropic conductive film satisfies a relationship that a difference (P1−P2) ...

ARTICLES HAVING SILVER ION a-OXY CARBOXYLATE OXIME COMPLEXES

A product article is prepared from a precursor article that has a substrate and a photosensitive thin film or a photosensitive thin film pattern on a supporting side. The product article have an electrically-conductive silver metal-containing film or thin film patterns, each of which contains electrically-conductive metallicsilver obtained by reduction of silver ions in the precursor article, an α-oxy carboxylate, an oxime compound, and a photosensitizer that can either reduce reducible silver ions or oxidize the α-oxy carboxylate. 1. A product article comprising a substrate having a first supporting side and a second opposing supporting side , and having on at least the first supporting side ,an electrically-conductive silver metal-containing thin film or one or more electrically-conductive silver metal-containing thin film patterns, comprising:silver metal;an α-oxy carboxylate;an oxime compound; anda photosensitizer that can either reduce reducible silver ion or oxidize the α-oxy carboxylate.2. The product article of claim 1 , comprising two or more electrically-conductive silver metal-containing thin film patterns in different portions on the first supporting side of the substrate.3. The product article of claim 1 , further comprising one or more electrically-conductive silver metal-containing thin film patterns in different portions on the second opposing supporting side of the substrate claim 1 , each of these one or more electrically-conductive silver metal-containing thin film patterns comprising:silver metal;an α-oxy carboxylate;an oxime compound; anda photosensitizer that can either reduce reducible silver ion or oxidize the α-oxy carboxylate.4. The product article of that is provided as a wound roll of a continuous material.5. The product article of claim 4 , wherein the wound roll of a continuous material is a wound roll of a polyester.8. The product article of claim 1 , wherein the α-oxy carboxylate is selected from:the group consisting of lactate, 2- ...

SILVER-ORGANO-COMPLEX INK WITH HIGH CONDUCTIVITY AND INKJET STABILITY

A robust formulation of silver-organo-complex (SOC) ink and method of making same are provided. In an aspect, the complexing molecules act as reducing agents. The silver loaded ink can be printed and sintered on a wide range of substrates with uniform surface morphology and excellent adhesion. 1. An ink composition for making a silver structure , the ink composition comprising: a silver salt; an organo-complex of a first complexing agent and a second complexing agent; and a carboxylic acid or a salt of a carboxylic acid.2. The ink composition of claim 1 , wherein said first complexing agent is an alkyl amine selected from the group consisting of methylamine claim 1 , ethylamine claim 1 , propylamine claim 1 , butylamine claim 1 , and amylamine3. The ink composition of claim 1 , wherein said second complexing agent is an aminoalcohol selected from the group consisting of methanolamine claim 1 , ethanolamine claim 1 , propanolamine claim 1 , and butanolamine.4. The ink composition of claim 1 , wherein said carboxylic acid is a short chain carboxylic acid having 1-3 carbon atoms.5. The ink composition of claim 1 , further comprising a solvent and/or a stabilizer.6. The ink composition of claim 1 , wherein the ink composition has a pH of 9-14.7. The ink composition of claim 1 , wherein the ink composition has an adjusted pH of about 10.5.8. The ink composition of claim 1 , wherein said ink composition further comprises an additive selected from the group consisting of HEC claim 1 , 2-HEC claim 1 , 2 claim 1 ,3-butanediol claim 1 , glycerol claim 1 , ethylene glycol claim 1 , and combinations thereof.9. The ink composition of claim 5 , wherein said solvent is water or a short chain alcohol having an alkyl chain of 1-3 carbon atoms.10. The ink composition of claim 1 , wherein the ink composition has a viscosity of about 4.95 mPa·s to about 5.97 mPa·s.11. The ink composition of claim 1 , wherein the ink composition has a surface tension of about 30.7 mN/m to about 33.08 mN ...

Method of manufacturing microstructures of metal lines

A method of manufacturing a metal line microstructure is provided. Firstly, a substrate is provided. Then, a seed layer is formed on a surface of the substrate. Then, a photoresist layer is formed on a surface of the seed layer, and a photolithography and etching process is performed to form a trench in the photoresist layer, wherein the trench has a specified width. Then, an electroplating process is performed to fill a conductive layer into the trench. Afterwards, the photoresist layer and a portion of the seed layer uncovered by the conductive layer are removed, so that the metal line microstructure is produced.

Conductive Formulations For Use In Electrical, Electronic And RF Applications

Metal flakes, an organic metal precursor, an organic solvent and either no binder, or a volatile or a thermally decomposable binder are combined to form a paste. The paste is deposited in a circuit pattern on a substrate and the circuit pattern is cured. While curing, the organic metal precursor decomposes to leave an electrically conductive path, and the printed circuit is thus formed. A precursor to an electrically conductive circuit material includes an organic metal precursor, metal microparticles, and an organic solvent. The method can be employed to form printed circuits, for a variety of electrical, electronic and sensing application, such as crack detection in ceramic, plastics, concrete, wood, fabric, leather, rubber or paper and composite materials. 1. A printed circuit formed by a method comprising the steps of:a) combining metal flakes, an organic metal precursor, an organic solvent and a thermally decomposable binder consisting of a carbamate gel of N, N, N′-trimethyl ethylene diamine or ethylene diamine to form a paste;b) depositing the paste in a circuit pattern on a substrate; andc) curing the circuit pattern on the substrate, whereby the organic metal precursor decomposes to leave an electrically conductive path, thereby forming the printed circuit.2. The printed circuit of claim 1 , wherein the circuit pattern consists of inductors claim 1 , capacitors claim 1 , or combinations thereof.3. The printed circuit of claim 1 , wherein the circuit pattern is a crack sensor.4. The printed circuit of claim 1 , wherein the paste is deposited into the substrate by screen printing.5. The printed circuit of claim 1 , wherein the metal flakes have a major dimension in a range of less than about 10 micrometers.6. The printed circuit of claim 5 , wherein the metal flakes have a major dimension of less than about 5 micrometers.7. The printed circuit of claim 6 , wherein the metal flakes are in the form of nanoparticles having a diameter between about 20 and about ...

Method of polishing copper layer of substrate

The method of polishing a copper layer of a substrate is capable of improving a stock removal rate, etc. The method comprises the steps of: supplying a substrate onto an polishing pad of an polishing plate with a copper layer facing the polishing pad; pressing the substrate onto the polishing pad, with a backing pad, by a press head; relatively rotating the press head with respect to the polishing plate, with supplying polishing slurry onto the polishing pad. The backing pad is made of a material whose Asker C hardness is 75-95 and whose compressibility is 10% or less. The polishing slurry includes a chelating agent for chelating copper, an etching agent for etching the surface of copper layer, an oxidizing agent for oxidizing the surface of copper layer, and water.

基板における銅層の研磨方法

(57)【要約】 【課題】 研磨速度を上げられ、また基板における銅層 の厚さの均一性が得られ、かつ銅層表面のスクラッチの 発生を抑制することができ、また銅バンプの研磨におい ては高さの均一性が得られる基板における銅層の研磨方 法を提供する。 【解決手段】 バッキング材に、アスカーＣ硬度が７５ 〜９５度で圧縮率が１０％以下の素材からなるバッキン グ材を用い、研磨液に、銅のキレート剤と、銅に対する エッチング剤と、銅の酸化剤と、水とを含む研磨液を用 いることを特徴とする。研磨液に、二酸化ケイ素、酸化 アルミニウム、酸化セリウム、酸化チタン、窒化ケイ素 および酸化ジルコニウムからなる群より選ばれる少なく とも１種類の研磨材砥粒を含ませるとさらに好適であ る。

Copper and copper alloy surface treatment agent

Composition for treating copper or copper alloy surfaces

A method for roughening surfaces of copper or copper alloy to provide an excellent adhesion of a coated or laminated layer thereon, comprising treating said surfaces with an amount and for a time effective to roughen them with an aqueous solution comprising an azole compound, a copper compound dissolvable in the solution, an organic or inorganic acid and a halogen ion.

Etchant for copper or copper alloys

An etchant for copper or copper alloys comprising 5-50 wt % of an alkanolamine, a copper ion source in the amount of 0.2-10 wt % as copper, a halide ion source in the amount of 0.005-10 wt % as halogen, 0.1-30 wt % of an aliphatic carboxylic acid, and the balance water, wherein the molar ratio of the alkanolamine to one mol of the aliphatic carboxylic acid is two or more. The etchant is free from problems such as instability of the liquid composition and unpleasant odor, has a high etching rate, exhibits only very slight corrosion even if a small amount of residue is left on the surface and is capable of producing a roughened surface when used for microetching.

Polishing composition and polishing method

Method of polishing copper layer of substrate

The method of polishing a copper layer of a substrate is capable of improving a stock removal rate, etc. The method comprises the steps of: supplying a substrate onto an polishing pad of an polishing plate with a copper layer facing the polishing pad; pressing the substrate onto the polishing pad, with a backing pad, by a press head; relatively rotating the press head with respect to the polishing plate, with supplying polishing slurry onto the polishing pad. The backing pad is made of a material whose Asker C hardness is 75-95 and whose compressibility is 10% or less. The polishing slurry includes a chelating agent for chelating copper, an etching agent for etching the surface of copper layer, an oxidizing agent for oxidizing the surface of copper layer, and water.

Polishing composition and polishing method

A polishing composition contains alumina, a complexing agent, and an oxidizing agent. It is preferable that the complexing agent is at least one compound selected from an α-amino acid, ammonia, and an ammonium salt. The polishing composition is preferably used in applications for polishing an object having a resin section with a trench, and a conductor layer provided on the resin section so that at least the trench is filled with the conductor layer.

Polishing composition and polishing method

연마용 조성물은 알루미나, 착화제 및 산화제를 함유한다. 착화제는 α-아미노산, 암모니아 및 암모늄염으로부터 선택되는 적어도 하나인 것이 바람직하다. 연마용 조성물은 배선구를 갖는 수지부 및 적어도 배선구가 덮이도록 수지부의 위에 설치된 도체층을 구비한 연마대상물을 연마하는 용도에 적합하게 쓰일 수 있다. The polishing composition contains alumina, a complexing agent and an oxidizing agent. The complexing agent is preferably at least one selected from α-amino acids, ammonia and ammonium salts. A polishing composition can be used suitably for the application | polishing of the grinding | polishing object provided with the resin part which has a wiring tool, and the conductor layer provided on the resin part at least so that a wiring tool may be covered. 연마용 조성물, 알루미나, 착화제, 산화제 Polishing compositions, alumina, complexing agents, oxidizing agents

Polishing composition and polishing method

A polishing composition contains alumina, a complexing agent, and an oxidizing agent. It is preferable that the complexing agent is at least one compound selected from an α-amino acid, ammonia, and an ammonium salt. The polishing composition is preferably used in applications for polishing an object having a resin section with a trench, and a conductor layer provided on the resin section so that at least the trench is filled with the conductor layer.

Polishing composition and polishing method

A polishing composition contains alumina, a complexing agent, and an oxidizing agent. It is preferable that the complexing agent is at least one compound selected from an α-amino acid, ammonia, and an ammonium salt. The polishing composition is preferably used in applications for polishing an object having a resin section with a trench, and a conductor layer provided on the resin section so that at least the trench is filled with the conductor layer.

Composition for treating copper or copper alloys

A composition suitable for the treatment of surfaces of copper and copper alloys is disclosed. It comprises, (a) a cupric complex of an azole compound, (b) an organic acid having a boiling point or a decomposition point of 230° C or lower, (c) a difficultly volatile complexing agent, (d) a complexing agent having a complexing power which is weaker than that of the azole compound, and (e) water. The treatment of copper or copper alloys with the composition produces abraded surface with moderate irregularities, thereby ensuring better adhesion of various resists thereto and increased solderability. The composition is particularly useful for the manufacture of printed-wiring boards.

Microetching composition for copper or copper alloy

A microetching composition for copper or copper alloys comprising, (a) an oxidizing agent which can oxidize the copper or copper alloy, (b) a polymer compound which contains polyamine chains or a cationic group or both in the amount of 0.000001 to 1.0% by weight, and (c) water. The composition can produce surfaces of copper or copper alloy exhibiting excellent adhesion to resins such as prepregs and resists, and superior solderability. The composition can be adaptable to the manufacture of printed wiring boards with highly integrated fine line patterns.

Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom

This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.

Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates

The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates

The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates

The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates

The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates

The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates

The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

Manufacturing method of printed wiring board

Permanent resist, permanent resist-laminated substrate and process for producing the same

A permanent resist obtained by at least photoexposure and alkali development of a photosensitive resin composition, the permanent resist containing a metal carboxylate group, or a carboxyl group (a carboxyl anhydride group is also included among a carboxyl group according to the invention) and a metal carboxylate group, wherein an alkaline earth metal carboxylate group constitutes at least 30 mole percent of the total of a carboxyl group and a metal carboxylate group.

Carte a circuits imprimes et procede de fabrication

Multilayer printed wiring board and method for manufacturing the same

개구가 수지(20)에 레이저에 의하여 형성되고 그에 따라 바이어홀이 형성된다. 이때에 열전도율을 낮추기 위하여 에칭에 의하여 그 두께가 3 ㎛ 로까지 처리된 동박(22)이 콘포멀마스크로서 사용된다. 따라서 펄스형의 레이저빔의 조사수가 감소하여도 수지(20)에 개구(20a)가 형성된다. 따라서, 수지층의 층간절연을 수행하는 수지(20)의 언더컷의 발생이 방지된다. 그에 따라 바이어홀의 연결성의 신뢰도가 향상되는 것이다. An opening is formed in the resin 20 by a laser and a via hole is formed accordingly. At this time, in order to lower thermal conductivity, the copper foil 22 processed by the etching to 3 micrometers in thickness is used as a conformal mask. Therefore, even if the number of irradiation of the pulsed laser beam decreases, the opening 20a is formed in the resin 20. Therefore, occurrence of undercut of the resin 20 which performs interlayer insulation of the resin layer is prevented. As a result, the reliability of the via hole connectivity is improved. 다층프린트배선판 Multilayer printed wiring board

Printed wiring board and method of producing the same

There is provided a multilayer printed wiring board (88) comprising an underlayer conductor circuit (57), an interlaminar resin insulating layer (68) formed on the underlayer conductor circuit (57), an upper layer conductor circuit formed on the interlaminar resin insulating layer (68) and a via-hole (86) connecting the underlayer conductor circuit (57) to the upperlayer conductor circuit wherein the underlayer conductor circuit (57) and the upperlayer conductor circuit comprise an electroless plated film (74) and an electrolytic plated film (78) formed on the electroless plated film (74), and the conductor circuit has a roughened surface (65,81).

Printed wiring board and method of producing the same

Low expansion dielectric compositions

Dielectric compositions comprising a first component and a second component present at about 5 parts to about 60 parts filler per 100 parts of the first component are disclosed. In certain examples, the first component includes a polyphenylene ether, a polyepoxide, and optionally a compatibilizing agent and a catalyst. Certain examples of the dielectric compositions disclosed herein have low coefficients of thermal expansion. Prepregs, laminates, molded articles and printed circuit boards using the dielectric compositions are also disclosed.

Fabrication method of printed wiring board

A fabrication method of a printed wiring board realizing high adhesion strength of a patterned conductive layer while keeping the high insulation reliability between adjacent conductive paths. First, an adhesive material is prepared, which is a mixture of a photo-setting resin as a matrix, fine particles of a photolyzable resin dispersed in the photo-setting resin, and a metal-organic compound/complex mixed with the photo-setting resin. The adhesive material is coated on an insulative base material to form an adhesive layer. The adhesive layer is then selectively exposed to light, selectively curing the photo-setting resin and selectively photolyzing the particles of the photolyzable resin. The exposed adhesive layer is developed by an alkaline developer solution, thereby transferring the pattern on the mask to the adhesive layer and removing the photolyzed particles for surface roughening of the remaining, unexposed parts of the adhesive layer. The metal-organic compound/complex in the unexposed parts of the adhesive layer is reduced for activation, causing the metal-organic compound/complex to reveal plating catalytic activity. A conductive layer is selectively formed on the unexposed parts of the adhesive layer by electroless plating performed under the plating catalytic activity of the activated metal-organic compound/complex.

Vähän laajenevat eristävät koostumukset

Aromatic polyimide film having improved adhesion

방향족 폴리이미드 필름, 및 이 필름 상에 형성된 금속 또는 금속 산화물 층으로 구성된 내열성 방향족 폴리이미드/금속(또는 금속 산화물) 복합판에 있어서, 폴리이미드 필름은 방향족 폴리이미드 수지, 및 폴리이미드 수지 내에 분산되어 있고 그 분산된 양이 폴리이미드 필름의 양에 대해 1 내지 1,000 ppm 인 Al 함유물질로 구성되며, 금속 또는 금속 산화물 층은 접착제없이 폴리이미드 필름 상에 형성된다. In the heat-resistant aromatic polyimide / metal (or metal oxide) composite plate composed of an aromatic polyimide film and a metal or metal oxide layer formed on the film, the polyimide film is dispersed in an aromatic polyimide resin and a polyimide resin And the dispersed amount is composed of an Al-containing material with an amount of 1 to 1,000 ppm relative to the amount of the polyimide film, and the metal or metal oxide layer is formed on the polyimide film without the adhesive.

Method for forming patterned transparent conducting film

Printing is conducted at the transparent conducting film unnecessary portion on a substrate 1 with a masking ink having a higher thermal decomposition temperature than that of the transparent conducting film forming composition, and the ink is dried and cured by heat or light to form a masking pattern 2. The portion where a transparent conducting film is to be formed is preferably subjected to ozone cleaning and then coated with a transparent conducting film forming composition comprising an indium compound and/or a tin compound and a solvent to form a transparent conducting film forming composition layer 3. The thus worked substrate is subjected to a heat treatment, causing thermal decomposition of the masking pattern 2 after formation of a transparent conducting film. Then the residues of the masking ink and the transparent conducting film are removed to finally obtain a desired patterned transparent conducting film 4.

Metal pattern forming method, metal pattern, and printed wiring board

Coated electrical assembly

FIELD: chemistry. SUBSTANCE: invention relates to a coated electrical assembly and methods of making a coated electrical assembly. Electric assembly has multilayer conformal coating on at least one surface of electrical assembly. Each layer of the multilayer coating can be obtained by plasma deposition of a precursor mixture containing (a) one or more organosilicon compounds, (b) optionally O 2 , N 2 O, NO 2 , H 2 , NH 3 , N 2 , SiF 4 and/or hexafluoropropylene (HFP), and (c) optionally - He, Ar and/or Kr. First and lowest layer of the multilayer conformal coating is organic and is in contact with the surface of the electrical assembly. EFFECT: invention enables to form coatings which would provide improved levels of protection from moisture. 19 cl, 7 dwg, 3 tbl РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2 717 842 C2 (51) МПК H05K 3/28 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ИЗОБРЕТЕНИЯ К ПАТЕНТУ (52) СПК H05K 3/28 (2020.01) (21)(22) Заявка: 2017144870, 09.06.2016 (24) Дата начала отсчета срока действия патента: Дата регистрации: 26.03.2020 R U 09.06.2016 (72) Автор(ы): АРЕСТА, Джанфранко (GB), ХЕННИГЭН, Гарет (GB), БРУКС, Эндрю Саймон Холл (GB), СИНГХ, Шайлендра Викрам (GB) (73) Патентообладатель(и): СЕМБЛАНТ ЛИМИТЕД (GB) 10.06.2015 GB 1510091.0 (43) Дата публикации заявки: 12.07.2019 Бюл. № 20 (45) Опубликовано: 26.03.2020 Бюл. № 9 (56) Список документов, цитированных в отчете о поиске: US 2004229051 A1, 18.11.2004. RU 2563978 C2, 27.09.2015. WO 03016589 A1, 27.02.2003. RU 2007115923 A, 10.11.2008. RU 2467046 C2, 20.11.2012. (85) Дата начала рассмотрения заявки PCT на национальной фазе: 10.01.2018 2 7 1 7 8 4 2 Приоритет(ы): (30) Конвенционный приоритет: GB 2016/051702 (09.06.2016) C 2 C 2 (86) Заявка PCT: (87) Публикация заявки PCT: R U 2 7 1 7 8 4 2 WO 2016/198870 (15.12.2016) Адрес для переписки: 197101, Санкт-Петербург, а/я 128, "АРСПАТЕНТ", С.В. Новоселовой (54) ИМЕЮЩИЙ ПОКРЫТИЕ ЭЛЕКТРИЧЕСКИЙ УЗЕЛ (57) Реферат: Изобретение ...

Method for fabricating highly conductive fine patterns using self-patterned conductors and plating

PURPOSE: A method for forming a high conductive fine pattern using a conductive pattern and plating is provided to reduce electric resistance of an electrode by plating metal materials on the conductive pattern. CONSTITUTION: Polymer materials(20) are laminated on a substrate(10). A depression(30) is formed to partially expose the substrate by removing the part of polymer materials. Conductive ink(40) is laminated on a mask template. Metal materials are laminated on a conductive pattern(41).

Thermosetting resin composition and use thereof

본 발명은 열경화성 수지 조성물에 관한 것이며, 상기 조성물은 열경화성 수지, 무기 충진제 및 유기 몰리브덴 화합물을 포함한다. 또한 상기 열경화성 수지 조성물은 수지 바니시, 프리프레그의 제조에 사용되며, 상기 프리프레그는 적층판 및 인쇄회로기판에 사용된다. The present invention relates to a thermosetting resin composition, which comprises a thermosetting resin, an inorganic filler and an organic molybdenum compound. Also, the thermosetting resin composition is used in the production of resin varnishes and prepregs, and the prepregs are used for laminate boards and printed circuit boards.

用于含铜金属的复合涂料组合物

本发明公开了采用包含选自取代或未取代的苯并咪唑、烷基咪唑、苯并三唑及烷基三唑的有机化合物及可为焊料润湿的含铜金属或金属焊料的金属微粒的复合涂料组合物有机金属涂层来保护如层压的电子线路板基体的含铜表面。该金属微粒能以加热金属化合物如贵金属的乙酸盐、乙酰丙酮酸盐及碳酸盐的方法在“现场”形成。

Method of polishing copper layer of substrate

본 발명의 기판의 구리층 연마 방법은 스톡 제거율 등을 향상시킬 수 있다. 상기 방법은 연마 플레이트의 연마 패드 위에 연마 패드와 대면하는 구리층과 기판을 공급하는 단계; 프레스 헤드에 의해 후면 패드와 연마 패드 위에 기판을 가압하는 단계; 연마 패드 위에 연마 슬러리를 공급하고, 연마 플레이트에 대해 프레스 헤드를 상대 회전시키는 단계를 포함한다. 후면 패드는 아스카 C 경도가 75~95이고, 압축율이 10% 미만인 재료로 이루어진다. 연마 슬러리는 구리를 킬레이트시키기 위한 클레이트제, 구리층의 표면을 에칭하기 위한 에칭제, 구리층의 표면을 산화시키기 위한 산화제, 및 물을 포함한다. The copper layer polishing method of the substrate of the present invention can improve the stock removal rate and the like. The method includes supplying a substrate and a copper layer facing the polishing pad over the polishing pad of the polishing plate; Pressing the substrate onto the backside pad and the polishing pad by a press head; Supplying the polishing slurry onto the polishing pad and rotating the press head relative to the polishing plate. The back pad is made of a material with an Asuka C hardness of 75-95 and a compression rate of less than 10%. The polishing slurry includes a chelating agent for chelating copper, an etchant for etching the surface of the copper layer, an oxidizing agent for oxidizing the surface of the copper layer, and water. 구리층, 연마기, 프레스 헤드, 연마 플레이트, 샤프트, 실린더 유닛 Copper Layer, Grinder, Press Head, Polishing Plate, Shaft, Cylinder Unit

Method for fabricating fine conductive patterns using surface modified mask template

PURPOSE: A method for forming a fine conductive pattern using a mask template is provided to reduce an electric resistance of a conductive pattern and constantly measure the amount of conductive ink by controlling the penetration of the conductive ink in polymer materials. CONSTITUTION: Polymer materials(20) are laminated on a substrate(10). Hydrophobic materials(30) penetrates through the polymer materials. A depression(42) is formed to expose the part of the substrate to the outside by removing the polymer materials. Conductive ink(50) is laminated on a mask template(40).

Microelectronic cleaning and arc remover compositions

본 발명은 구리 또는 알루미늄 배선과 이산화규소, 저 유전율(low-κ) 유전체 및 고 유전율(high-κ) 유전체를 포함하는 마이크로일렉트로닉 구조의 세정에 적합한 세정 조성물에 관한 것으로, 수소결합능이 있으며 산화제와 최소한으로 반응하거나 반응하지 않고, 디메틸피페리돈, 술폰 및 술폰란으로 구성된 그룹으로부터 선택된 극성 유기 용매; 테트라알킬암모늄 하이드록사이드, 수산화콜린, 수산화나트륨 및 수산화칼륨으로 구성된 그룹으로부터 선택된 성분; 물; 그리고 트랜스-1,2-시클로헥산디아민 테트라아세트산, 에탄-1-하이드록시-1,1-디포스포네이트 및 에틸렌디아민 테트라(메틸렌 포스폰산)로 구성된 그룹으로부터 선택된 킬레이트제 또는 금속 착제를 포함하여 이루어진다. The present invention relates to cleaning compositions suitable for cleaning microelectronic structures comprising copper or aluminum wiring and silicon dioxide, low-k dielectrics and high-k dielectrics, which are capable of hydrogen bonding, A polar organic solvent selected from the group consisting of dimethylpiperidone, sulfone, and sulphonane; A component selected from the group consisting of tetraalkylammonium hydroxide, choline hydroxide, sodium hydroxide, and potassium hydroxide; water; And a chelating agent or metal complexing agent selected from the group consisting of trans-1,2-cyclohexanediamine tetraacetic acid, ethane-1-hydroxy-1,1-diphosphonate and ethylenediaminetetra (methylenephosphonic acid) . 세정, 마이크로일렉트로닉, 기판 Cleaning, microelectronics, substrate

Composition comprising benzoxazine and epoxy resin

본 발명은 벤족사진 수지, 및 비스페놀 A 디글리시딜 에테르 및 비스페놀 S를 기재로 하는 개질(advancement) 수지, 및 임의로는 페로센 및 알루미늄 삼수화물을 포함하는 조성물에 관한 것이다. 이러한 조성물은 경화되어 중합체 5 네트워크를 형성하는 경우, 가연되기 어렵고 고온에 내성이다. 이러한 조성물은 특히 인쇄 배선판의 제조에 사용될 수 있다. The present invention relates to benzoxazine resins, and modification resins based on bisphenol A diglycidyl ether and bisphenol S, and optionally compositions comprising ferrocene and aluminum trihydrate. Such compositions, when cured to form a polymer 5 network, are difficult to be flammable and resistant to high temperatures. Such compositions can be used in particular for the production of printed wiring boards. 벤족사진 수지, 에폭시 수지, 개질 수지, 난연성 Benzoxazine resin, epoxy resin, modified resin, flame retardant

Organic silver conpound and it's preparation method, organic silver ink and it's direct wiring method

본 발명은 도전배선 형성용 유기은 용액 및 그 제조방법, 그로부터 제조되는 잉크 및 그 잉크를 이용한 도전배선 형성 방법에 관한 것이다. 보다 상세하게는 산화은을 유기용제에 용해시켜 유기은 용액을 제조하고, 이로부터 잉크젯프린터에 적용하여 도전배선을 형성할 수 있는 잉크를 제공하는 것이다. 또한 제조된 잉크를 잉크젯 프린터를 이용하여 인쇄한 후, 열처리 함으로써 다양한 기재에 도전배선을 형성하는 방법을 제공하는 것이다. The present invention relates to an organic silver solution for forming conductive wiring, a method for producing the same, an ink prepared therefrom, and a method for forming conductive wiring using the ink. More specifically, silver oxide is dissolved in an organic solvent to prepare an organic silver solution, and then applied to an inkjet printer to provide an ink capable of forming conductive wiring. The present invention also provides a method of forming conductive wiring on various substrates by printing a manufactured ink using an inkjet printer and then heat treating the prepared ink. 본 발명의 유기은 조성물 용액은 산화은을 아민계열 화합물과 락톤계열 화합물(또는 락탐계열 화합물, 카보네이트계열 화합물, 환상 산 무수물계열 화합물)로 반응시켜 용해하여 제조할 수 있으며, 이에 잉크젯 프린터의 적합한 액 유동성을 확보하기 위하여 알코올과 같은 유기용매, 계면활성제등을 첨가하여 잉크를 제조하였다. The solution of the organic silver composition of the present invention may be prepared by dissolving silver oxide by reacting an amine compound with a lactone compound (or a lactam compound, a carbonate compound, or a cyclic anhydride compound). In order to ensure the ink was prepared by adding an organic solvent, such as alcohol, a surfactant. 본 발명은 저공정비용으로 높은 농도의 유기은용액 및 잉크젯용 잉크의 제조방법을 제공할 수 있으며, 잉크젯인쇄, 열처리후 기존에 방식에 비하여 기재부착성, 인쇄성 및 높은 전도성을 부여하는 도전막 및 도전 배선 형성 기술을 제공할 수 있다. The present invention can provide a method for producing a high concentration of organic silver solution and inkjet ink at a low process cost, and after the inkjet printing, heat treatment, a conductive film that provides substrate adhesion, printability and high conductivity compared to conventional methods and A conductive wiring formation technique can be provided. 유기은, 산화은, 도전배선, 잉크젯 프린터, 고형분 Organic silver, silver oxide, conductive wiring, inkjet printer, solid content

Method for improving patterned silver conductivity

A method is used to improve the conductivity of silver disposed on a substrate. This silver is generally in the form of silver metal particles. The silver is treated with an aqueous solution comprising a conductivity enhancing agent to provide treated silver metal particles that are increased in conductivity. The treated silver metal particles are then dried. These two essential steps of treating and drying are repeated in at least one additional treatment cycle, in sequence, using the same or different conductivity enhancing agent, thereby improving the conductivity of the silver metal particles from one treatment cycle to another. This method can be carried out using an apparatus having a series of stations for carrying out each step in each treatment cycle.

Metal-film-coated material and process for producing same, metallic-pattern-bearing material and process for producing same, composition for polymer layer formation, nitrile polymer and method

一种金属模型材料的制造方法，包括下列步骤：(a1)在基板上形成聚合物层，该聚合物层由具有与电镀催化剂或其前体形成相互作用的官能团，并且和该基板直接化学结合的聚合物构成，和(a2)在该聚合物层上赋予电镀催化剂或其前体的步骤，和(a3)对该电镀催化剂或其前体进行电镀的步骤，和(a4)将形成的电镀膜蚀刻成呈图案状的步骤，上述聚合物层满足下述1～4的条件的全部。条件1：在25℃-50％下的饱和吸水率为0.01～10质量％，条件2：在25℃-95％下的饱和吸水率为0.05～20质量％，条件3：在100℃沸水中浸渍1小时后的吸水率为0.1～30质量％，条件4：在25℃-50％下滴加5μL蒸馏水，静置15秒后的接触角为50～150度。

Agent for surface processing of copper and copper alloy

本发明提供了一种可用于铜及铜合金的除锈、表面粗糙化等处理时用的表面处理剂，该处理剂可形成焊接性良好的表面，不会腐蚀处理后的铜，且其操作环境良好。本发明的表面处理剂由配合唑类的二价铜配合物作为氧化剂，沸点或分解温度在230℃以下的有机酸作溶解氧化铜的酸，难挥发性配位剂及比上述唑类络合能力弱的配位剂作为配位剂配制而成。

Method for forming multilayer circuit structure and substrate having multilayer circuit structure

Method of fabricating pattern

본 발명은 패턴 제조 방법에 관한 것으로서, 더욱 상세하게는, 레이저를 이용하여 패턴을 제조하는 방법에 관한 것이다. 기판 상에 금속 유기 잉크층을 형성하는 제1 단계; 금속 유기 잉크층을 반고상 상태로 경화시키는 제2 단계; 반고상 상태의 금속 유기 잉크층에 레이저 광을 조사하여, 조사된 부위가 고상상태로 경화되어 패턴이 형성되는 제3 단계; 및 반고상 상태의 금속 유기 잉크층을 제거하여 패턴만을 남기는 제4 단계를 포함한다.

Adhesive layer forming liquid

Es ist eine Aufgabe der vorliegenden Erfindung, eine Klebstoffschicht bildende Flüssigkeit zur Verfügung zu stellen, bei welcher die Beeinträchtigung der Klebstoffschichtbildungsfähigkeit im Verlauf der Zeit verzögert werden kann und weiterhin die Glattheit einer Klebstoffschichtoberfläche sicher aufrecht erhalten werden kann. Die Kkebstoffschicht bildende Flüssigkeit der vorliegenden Erfindung ist eine Klebstoffschicht bildende Flüssigkeit, die eine Flüssigkeit ist, um eine Klebstoffschicht zu bilden, um Kupfer und ein Harz miteinander zu verbinden, und die eine wässrige Lösung ist, aufweisend eine Säure, ein Zinn(IV)-Salz, ein Komplexierungsmittel, einen Stabilisator und einen Komplexierungsverzögerer, um eine Komplexierungsreaktion zwischen dem Komplexierungsmittel und Kupfer zu verzögern. It is an object of the present invention to provide an adhesive layer-forming liquid in which the deterioration of the adhesive layer forming ability can be retarded with time, and furthermore, the smoothness of an adhesive layer surface can be surely maintained. The tickle layer-forming liquid of the present invention is an adhesive layer-forming liquid which is a liquid to form an adhesive layer to bond copper and a resin together, and which is an aqueous solution comprising an acid, a tin (IV). Salt, a complexing agent, a stabilizer and a complexing retarder to retard a complexing reaction between the complexing agent and copper.

Adhesive layer-forming liquid

【課題】接着層の形成性能の経時劣化を抑制できる上、接着層表面の平滑性を確保できる接着層形成液を提供する。 【解決手段】本発明の接着層形成液は、銅と樹脂を接着させるための接着層を形成する接着層形成液であって、酸、第二スズ塩、錯化剤、安定化剤、及び前記錯化剤と銅との錯形成反応を抑制する錯形成抑制剤を含む水溶液であることを特徴とする。 【選択図】なし

Printed wiring board and method for manufacturing the same

하층 도선회로(26), 상기 하층 도선회로(26) 상에 형성된 층간 수지 절연층(37), 상기 층간 수지 절연층(37) 상에 형성된 상층 도선회로(44) 및 상기 하층 도선회로(26)와 상기 상층 도선회로(44)를 연결하는 비어홀(51)을 포함하는 다층 인쇄 배선판이 제공된다. 본 발명에 따른 다층 인쇄 배선판은 구리(Ⅱ)착물과 유기산을 포함하는 식각용액으로 상기 하층 도선회로(26)를 처리하여 형성된 거친 표면(35)을 갖으며, 상기 하층 도선회로(26)는 상기 거친 표면(35)을 통하여 상기 비어홀(51)에 연결된다. 본 발명에 따른 상기 다층 인쇄 배선판에 있어서, 상기 하층 도선회로와 상기 층간 수지 절연층 간의 접착성 및 상기 하층 도선회로와 상기 비어홀 도체 간의 접착성이 향상되며, 가열 또는 열순환 동안에도 상기 비어홀 부분에의 높은 연결 신뢰성을 확보할 수 있다. A lower conductive line circuit 26, an interlayer resin insulating layer 37 formed on the lower conductive line circuit 26, an upper conductive line circuit 44 formed on the interlayer resin insulating layer 37, and the lower conductive line circuit 26 And a via hole 51 connecting the upper conductive line circuit 44 to each other. The multilayer printed wiring board according to the present invention has a rough surface 35 formed by treating the lower conductive line circuit 26 with an etching solution containing a copper (II) complex and an organic acid, and the lower conductive line circuit 26 is It is connected to the via hole 51 through a rough surface 35. In the multilayer printed wiring board according to the present invention, the adhesion between the lower conductive wire circuit and the interlayer resin insulating layer and the adhesion between the lower conductive wire circuit and the via hole conductor are improved, and the via hole portion is maintained even during heating or thermal cycling. High connection reliability can be ensured.

Method for manufacturing double-sided printed circuit board

Method for manufacturing a double-sided printed circuit board

本发明涉及通过导电性胶的印刷来制造具备电路图案的双面印刷电路板的方法，本发明涉及双面印刷电路板的制造方法，通过该方法可形成精密且高导电率的电路图案，同时可以节省原材料、缩短工序，并且依靠导电性胶的印刷而形成的导电层，即使在弯曲或者热冲击及物理冲击下，也不会使连接短路。

Conductive paste, manufacturing method thereof and printed wiring board using the same

본 발명은 종래의 귀금속을 이용한 도전성 입자의 문제점을 고려하여 재료 가격이 낮고, 또 접속 신뢰성, 절연 신뢰성이 높은 도전성 페이스트 및 그 제조방법과 그것을 이용한 프린트 배선 기판을 제공하기 위한 것으로, 도전성 페이스트는 금속입자 표면이 두께 10nm 미만의 동일 금속의 착체(complex)로 피복되고, 상기 금속입자 상에 자연 산화막이 존재하지 않는 도전성 입자와 절연성 수지를 주성분으로 하는 바인더로 구성된다.

Anisotropic conductive film, connection method, and assembly

제 1 전자 부품의 단자와 제 2 전자 부품의 단자를 이방성 도전 접속시키는 이방성 도전 필름으로서, 결정성 수지와 비정성 수지와 도전성 입자를 함유하고, 상기 결정성 수지가, 상기 비정성 수지가 갖는 수지를 특징 짓는 결합과 동일한, 수지를 특징 짓는 결합을 갖는 결정성 수지를 함유하는 이방성 도전 필름이다.

Low viscosity precursor compositions and methods for the deposition of conductive electronic features

전도성 형상과 같은 전기적 형상의 형성 및 증착을 위한 전구체 조성물. 상기 전구제 조성물은 점도가 낮아, 직접-기록 툴을 사용하여 증착을 가능하게 하는 데에 유리하다. 전구체 조성물은 또한 전환 온도가 낮아, 저온 기판 상에서 전기적 형성으로의 전환 및 증착을 가능하게 한다. 특히 바람직한 전구체 조성물은 고 전도성의 구리 형상의 형성을 위한 은 금속을 포함한다. 또다른 특히 바람직한 조성물은 고 전도성의 구리 형상의 형성을 위한 구리 금속을 포함한다. 전구체 조성물, 금속 전구체 조성물, 금속 전구체 화합물, 저점도, 전환 온도

Process for producing multilayer printed wiring board and multilayer printed wiring board

본 발명은, 최외층이 제 1 도체층인 내층 기판 상에 형성되고 절연성 중합체와 경화제를 함유하는 경화성 조성물을 이용하여 이루어지는 미경화 또는 반경화의 수지층 표면에, 금속에 배위가능한 구조를 갖는 화합물을 접촉시키고, 이어서 상기 수지층을 경화시켜 전기절연층을 형성하고, 수득된 전기절연층의 표면을 전기절연층의 표면 평균조도(Ra)가 0.05 ㎛ 이상 0.2 ㎛ 미만이 되고, 표면 10점 평균조도(Rzjis)가 0.3 ㎛ 이상 4 ㎛ 미만이 될 때까지 산화한 후, 상기 전기절연층 상에 도금법에 의해 제 2 도체층을 형성하는 다층 프린트 배선판의 제조방법, 및 이의 제조방법에 의해 얻어지는 다층 프린트 배선판을 제공한다. 본 발명에 의해, 대형 기판이라도 패턴 밀착성이 우수한 다층 프린트 배선판을 수득할 수 있다.

Methods and compositions for the formation of recessed electrical features on a substrate

Precursor compositions having a low conversion temperature and methods for the fabrication of recessed electrical features from the precursor compositions. The electrical features can be conductors, resistors and dielectric features. The precursor compositions are deposited into recessed features, such as trenches, formed in a substrate and are reacted at a low temperature to form electrical features having good electrical and mechanical properties. The substrate can be a low temperature substrate, such as an organic substrate.

Electronic component and method of manufacture

一种电子元件提供位于电介质基体(262)之上或之中、处于一对电导体(260A、260B)之间并与其接触的陶瓷元件(264)，其中陶瓷元件包括一种或多种金属氧化物，其在整个所述陶瓷元件中的金属氧化物组分均匀度的波动小于或等于1.5mol％。一种制造电子元件的方法，提供以下步骤：在基体上的一对导电体之间形成陶瓷元件并与该对导电体接触，包括沉积金属有机先导物的混合物并使金属氧化物先导物同时沉积，以形成包括一种或多种金属氧化物的陶瓷元件。

Power management module and method of manufacture

A power management module, provides an inductor including one or more electrical conductors disposed around a ferromagnetic ceramic element including one or more metal oxides having fluctuations in metal-oxide compositional uniformity less than or equal to 1.50 mol % throughout the ceramic element.

Multilayer printed wiring board and method for manufacturing the same

개구가 수지(20)에 레이저에 의하여 형성되고 그에 따라 바이어홀이 형성된다. 이때에 열전도율을 낮추기 위하여 에칭에 의하여 그 두께가 3 ㎛ 로까지 처리된 동박(22)이 콘포멀마스크로서 사용된다. 따라서 펄스형의 레이저빔의 조사수가 감소하여도 수지(20)에 개구(20a)가 형성된다. 따라서, 수지층의 층간절연을 수행하는 수지(20)의 언더컷의 발생이 방지된다. 그에 따라 바이어홀의 연결성의 신뢰도가 향상되는 것이다. An opening is formed in the resin 20 by a laser and a via hole is formed accordingly. At this time, in order to lower thermal conductivity, the copper foil 22 processed by the etching to 3 micrometers in thickness is used as a conformal mask. Therefore, even if the number of irradiation of the pulsed laser beam decreases, the opening 20a is formed in the resin 20. Therefore, occurrence of undercut of the resin 20 which performs interlayer insulation of the resin layer is prevented. As a result, the reliability of the via hole connectivity is improved. 다층프린트배선판 Multilayer printed wiring board

Method for making fine patterns using mask template

본 발명은 마스크 템플릿을 이용한 미세패턴 형성방법에 관한 것으로서, 본 발명에 따른 마스크 템플릿을 이용한 미세패턴 형성방법은 기판의 일영역을 외부에 노출시키는 노출부와, 상기 기판의 타영역 상에 도포된 고분자 물질에 의해 마련되는 비노출부를 구비하는 마스크 템플릿을 상기 기판상에 형성하는 마스크 템플릿 형성단계; 상기 마스크 템플릿의 상측에 전도성 잉크를 공급하여, 상기 비노출부 상에 상기 전도성 잉크를 적층하고, 상기 노출부에 의해 노출된 기판상에 상기 전도성 잉크를 적층하는 잉크 적층단계; 상기 전도성 잉크에 용해 또는 분산된 전도성 잉크 입자를 추출하기 위하여 상기 전도성 잉크에 열을 가하는 열처리단계; 를 포함하며, 상기 열처리단계를 통해, 상기 비노출부에 배치되는 전도성 잉크 입자는 상기 비노출부와 결합하여 전기적 절연성을 가지는 절연패턴을 형성하고, 상기 기판에 배치되는 전도성 잉크 입자는 전기적 전도성을 가지는 도전패턴을 형성하는 것을 특징으로 한다. 본 발명에 의하면, 직접인쇄방식을 사용하는 경우에 패턴간의 중첩없이 미세한 패턴을 형성할 수 있는 마스크 템플릿을 이용한 미세패턴 형성방법이 제공된다. 전기잉크, 나노 실버, 고분자 물질, 미세패터닝, 패턴방법, 마스크 템플릿

Composite material improved in junction strength and method for forming the same

(57)【要約】 【課題】 接合強度が向上された複合材料およびその形 成方法を提供する。 【解決手段】 樹脂基体の表面をイオン交換基導入処理 し、該樹脂基体の表面を金属イオン含有液で処理して金 属イオンを導入し、該金属イオンを還元することにより 得られる、樹脂基体の表面に金属を有する複合材料であ って、さらに、該複合材料の樹脂基体と金属とが熱圧着 されることを特徴とする前記複合材料樹脂を提供する。 該複合材料は、樹脂基体と金属との接合強度に劣る無電 解めっきにより得られる複合材料よりも、樹脂基体と金 属との接合強度に優れる。さらに、該複合材料の形成に 際しては熱圧着法が使用できるので、該複合材料を簡易 に製造可能である。

Method of fabricating pattern

本发明涉及一种图案制造方法，具体涉及利用激光的图案制造方法。该方法包括：在基板上形成有机金属油墨层(20)的第一阶段；将有机金属油墨层(20)固化成半固体状态的第二阶段；将激光照射在半固体状态的有机金属油墨层(20)上，由此被照射的部分固化成固体状态以形成图案的第三阶段；去除半固体状态的有机金属油墨层(20)而只留下图案的第四阶段。

Structure having conductive pattern region and manufacturing method thereof, laminate and manufacturing method thereof, and copper wiring

제조 공정을 매우 간략하게 할 수 있고, 도전성 패턴 영역 사이의 전기 절연성이 우수하며, 또한 신뢰성이 높은 도전성 패턴 영역을 갖는 구조체를 제공하는 것. 도전성 패턴 영역을 갖는 구조체(10)는, 지지체(11)와, 지지체가 구성하는 면 위에, 산화구리 및 인 함유 유기물을 포함하는 절연 영역(12)과, 구리를 포함하는 도전성 패턴 영역(13)이 상호 인접하여 배치된 층(14)을 구비한다. 또한, 적층체는, 지지체와, 지지체가 구성하는 면 위에 배치된, 산화구리 및 인을 포함하는 도포층과, 도포층을 덮도록 배치된 수지층을 구비한다. To provide a structure in which the manufacturing process can be very simplified, the electrical insulation between the conductive pattern regions is excellent, and the structure has a highly reliable conductive pattern region. The structure 10 having a conductive pattern region includes a support 11, an insulating region 12 including copper oxide and phosphorus-containing organic material, and a conductive pattern region 13 including copper, on a surface of the support. It has layers 14 disposed adjacent to each other. Moreover, a laminated body is provided with the support body, the application layer which is arrange|positioned on the surface which the support body comprises, and contains copper oxide and phosphorus, and the resin layer arrange|positioned so that an application layer may be covered.

Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material

A die bonding portion is metallically bonded by well-conductive Cu metal powders with a maximum particle diameter of about 15 μm to 200 μm and adhesive layers of Ag, and minute holes are evenly dispersed in a joint layer. With this structure, the reflow resistance of about 260° C. and reliability under thermal cycle test can be ensured without using lead.

Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material

A die bonding portion is metallically bonded by well-conductive Cu metal powders with a maximum particle diameter of about 15 μm to 200 μm and adhesive layers of Ag, and minute holes are evenly dispersed in a joint layer. With this structure, the reflow resistance of about 260° C. and reliability under thermal cycle test can be ensured without using lead.

Partial plating method, partial plating resin base material, and manufacturing method of multilayer circuit board

Organic silver compound and it's preparation method, organic silver ink and it's direct wiring method

本发明提供通过将氧化银溶解在有机溶剂中来生产有机银溶液的方法，还提供一种通过用于喷墨打印机来形成导电电路的墨水。并且，本发明提供一种使用所生产的墨水由喷墨打印机印刷，然后热处理，从而在各种基板上形成导电电路的方法。可以通过使氧化银与胺类化合物和内酯类化合物(或内酰胺类化合物、碳酸酯类化合物、环状酸酐类化合物)反应，从而前者溶解在后者中，由此生产本发明的组合物，即有机银溶液。为了保证适合喷墨打印机的液体流动性，通过向其中加入例如醇类、表面活性剂等有机溶剂来生产墨水。

Electrically Conductive Adhesive Composition

본 발명은 마주하는 전극 사이에 전기 전도성을 제공하나, 인접하는 전극 사이에 측면으로 전기 단열을 유지하는 비등방성으로 전도성인 접착제 조성물에 관한 것이며, 상기 비등방성으로 전도성인 접착제 조성물은 (a) 글리시딜 에폭시 수지 같은 양이온성으로 중합가능한 단량체; (b) 친핵성 작용기 또는 금속 착물 형성 작용기가 실질적으로 없는 열가소성 수지; (c) 임의로, 알콜-함유 물질; (d) (1) 유기금속성 양이온: (2) 경화 속도 증강제; 및 (3) 안정화 첨가제를 함유하는 열적으로 개시된 촉매 시스템; (e) 전도성 입자; 및 (f) 임의로, 실란 결합제를 포함하며, 이때 상기 결합제 조성물은 120-125℃의 온도에서 경화된다. The present invention relates to an anisotropically conductive adhesive composition that provides electrical conductivity between opposite electrodes but maintains electrical insulation laterally between adjacent electrodes, wherein the anisotropically conductive adhesive composition comprises (a) Cationic polymerizable monomers such as cydyl epoxy resins; (b) a thermoplastic resin substantially free of nucleophilic functional groups or metal complex forming functional groups; (c) optionally, an alcohol-containing material; (d) (1) organometallic cations: (2) cure rate enhancers; And (3) a thermally disclosed catalyst system containing a stabilizing additive; (e) conductive particles; And (f) optionally, a silane binder, wherein the binder composition is cured at a temperature of 120-125 ° C.

Electrode element using silver nano-wire and its manufacturing method

The present invention relates to an electrode element using a silver nanowire and a method of fabricating the same, capable of lowering resistance by enhancing the coupling between wire unit structures through a low temperature process, facilitating the application to a polymer substrate, improving a haze phenomenon, lowering the adhesive strength of the silver nanowire layer, improving surface roughness, and reducing the resistance variation as a function. To this end, the present invention provides a method of fabricating the electrode element using the silver nanowire, which includes: a first step (S110) of forming a silver nanowire layer (220) on a substrate; a second step (S120) of coating an organometal (OM) compound solution (230) on the silver nanowire layer (220); a third step (S130) of enhancing the coupling in each intersection part (C) by local thermal energy emitted from the intersection part (C) between wire unit structures (225) due to surface plasmon by radiating light to an upper portion of the silver nanowire layer (220) coated with the OM compound solution (230); and a fourth step (S140) of treating a surface by coating a SOL-GEL solution (250) on the silver nanowire layer (220) treated by the plasmon. The present invention also provides the electrode element fabricated through the same.

FLUID CONNECTION AND FLUID HEATER DEVICE

Dispositif (10) de raccordement fluidique et de chauffage de fluide pour un circuit de fluide, en particulier pour un véhicule automobile, ce dispositif comprenant un corps tubulaire (12) monobloc en matériau plastique ou composite comportant au moins une surface annulaire interne (18) définissant une veine (20) d’écoulement de fluide depuis une entrée (14) jusqu’à une sortie (16) du corps, et au moins une surface annulaire externe (22) s’étendant autour de la veine et sur laquelle est situé au moins un élément résistif de chauffage, caractérisé en ce que l’élément résistif de chauffage est un circuit résistif (36) qui est formé in situ sur ladite surface annulaire. Figure pour l'abrégé : Figure 1 Fluid connection and fluid heating device (10) for a fluid circuit, in particular for a motor vehicle, this device comprising a one-piece tubular body (12) made of plastic or composite material comprising at least one internal annular surface (18) defining a fluid flow vein (20) from an inlet (14) to an outlet (16) of the body, and at least one outer annular surface (22) extending around the vein and on which is located at least one resistive heating element, characterized in that the resistive heating element is a resistive circuit (36) which is formed in situ on said annular surface. Figure for abstract: Figure 1

Transparent electrode, method for producing the same, and organic electroluminescence device

本発明の課題は、低抵抗で保存性が高い透明電極とその製造方法及び有機エレクトロルミネッセンス素子を提供することである。本発明の透明電極は、基板上に金属導電層を備える透明電極であって、前記金属導電層が、金属細線と、前記金属細線を被覆するメッキ層を有し、前記金属細線を形成した側の前記基板の面上に当該基板及び前記金属導電層を覆う透明導電層を有し、前記金属細線が、金属ナノ粒子インク又は金属錯体インクを用いて形成されたことを特徴とする。 An object of the present invention is to provide a transparent electrode having low resistance and high storage stability, a method for producing the same, and an organic electroluminescence element. The transparent electrode of the present invention is a transparent electrode having a metal conductive layer on a substrate, wherein the metal conductive layer has a fine metal wire and a plating layer covering the fine metal wire, and the side on which the fine metal wire is formed A transparent conductive layer covering the substrate and the metal conductive layer is provided on the surface of the substrate, and the metal fine wire is formed using a metal nanoparticle ink or a metal complex ink.

Surface treatment liquid for copper material, method of surface treatment for copper material, copper material with surface treatment coating, and laminate member

본 발명은 구리재료용 표면처리액, 표면처리방법 및 그에 의해 구리재료 표면에 형성된 표면처리 피막을 제공하는 것을 과제로 한다. An object of this invention is to provide the surface treatment liquid for copper materials, the surface treatment method, and the surface treatment film formed by the copper material surface by this. 또한 본 발명은, 구리의 산화 에칭제, Ti, Zr, Hf 및 Si로 이루어진 군으로부터 선택되는 1종 이상의 금속원소를 포함하는 화합물, 및 HF의 공급원으로서의 불소 함유 화합물을 함유하는 것을 특징으로 하는 구리재료용 표면처리액, 및 그 액 중에 구리 및 구리합금소재를 침지하는 것을 특징으로 하는 표면처리방법, 및 그에 의해 구리 및 구리합금 상에 형성되는 Ti, Zr, Hf 및 Si로 이루어진 군으로부터 선택되는 1종 이상의 금속원소, Cu, O 및 F를 함유하는 것을 특징으로 하는 표면처리 피막, 및 그 표면처리 피막을 갖는 구리소재와 수지층이, 표면처리 피막을 매개로 접합되는 것을 특징으로 하는 적층부재에 관한 것이다. The present invention also provides a copper containing a compound containing at least one metal element selected from the group consisting of copper oxide etching agent, Ti, Zr, Hf and Si, and a fluorine-containing compound as a source of HF. A surface treatment liquid for the material, and a surface treatment method characterized by immersing copper and a copper alloy material in the liquid, and thereby selected from the group consisting of Ti, Zr, Hf and Si formed on copper and copper alloy. A surface treatment film containing at least one metal element, Cu, O, and F, and a laminated material characterized in that a copper material and a resin layer having the surface treatment film are joined via a surface treatment film. It is about.

Articles with reducible silver ions or silver metal

A precursor article has a substrate and a photosensitive thin film or photosensitive thin film pattern on one or both supporting sides. A non-hydroxylic-solvent soluble silver complex is present that is represented by the following formula (I): (Ag + ) a (L) b (P) c    (I) wherein L represents an α-oxy carboxylate; P represents a primary alkylamine; a is 1 or 2; b is 1 or 2; and c is 1, 2, 3, or 4, provided that when a is 1, b is 1, and when a is 2, b is 2. A photosensitizer can also be present to enhance photosensitivity for conversion of reducible silver ions to electrically-conductive silver metal in a resulting product article or device. The electrically-conductive silver metal can be provided as a uniform electrically-conductive silver metal-containing thin film or layer, or as one or more electrically-conductive silver metal-containing thin film patterns.

Process for protecting an electronic device by selective deposition of polymer coatings.

Se describen métodos para la protección de un dispositivo electrónico de contaminantes por medio de la aplicación de diferentes materiales poliméricos a diferentes componentes vitales de un dispositivo. En una modalidad, el método comprende la aplicación (110, 120) de un primer polímero, tal como (210, 220) un polímero de base acrílica, a uno o más conectores y componentes localizados sobre la tarjeta de circuitos impresos del dispositivo. El método además comprende la aplicación (140) de un segundo polímero, tal como un polímero de base silicona, a diferentes conectores y componentes sobre la tarjeta de circuitos impresos. El método lleva a que diferentes componentes sean revestidos con un polímero diferente, sin la necesidad de revestimientos de capas múltiples sobre ningún componente. También se describen dispositivos electrónicos que son protegidos mediante tales revestimientos poliméricos e hidrofóbicos. Ejemplos no limitantes de tales dispositivos incluyen teléfonos inteligentes, computadoras, y dispositivos de juego.

Method for producing metal film

Microelectronic cleaning and arc remover compositions

Method of manufacturing multilayered circuit board

An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22 , the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20 a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Sintered compound starting material and method for producing the sintered compound

Der erfindungsgemäße Ausgangswerkstoff einer Sinterverbindung umfasst Partikel, die zumindest anteilig eine organische Metallverbindung und/oder ein Edelmetalloxid enthalten, wobei die organische Metallverbindung und/oder das Edelmetalloxid bei einer Temperaturbehandlung des Ausgangswerkstoffes in das elementare Metall und/oder Edelmetall umgewandelt wird. Kennzeichnend für die Erfindung ist, dass die Partikel eine Beschichtung enthaltend ein Reduktionsmittel aufweisen, mittels welchem die Reduktion der organischen Metallverbindung und/oder des Edelmetalloxids zu dem elementaren Metall und/oder Edelmetall bei einer Temperatur unterhalb der Sintertemperatur des elementaren Metalls und/oder Edelmetalls erfolgt. The starting material of a sintered compound according to the invention comprises particles which at least partially contain an organic metal compound and / or a noble metal oxide, the organic metal compound and / or the noble metal oxide being converted into the elemental metal and / or noble metal during a temperature treatment of the starting material. It is characteristic of the invention that the particles have a coating containing a reducing agent, by means of which the reduction of the organic metal compound and / or the noble metal oxide to the elemental metal and / or noble metal takes place at a temperature below the sintering temperature of the elemental metal and / or noble metal .

Conductive-substance-adsorbing resin film, process for producing conductive-substance-adsorbing resin film, metal-layer-coated resin film made from the same, and process for producing metal-layer-coat

本发明提供一种与树脂薄膜的粘附性出色、可在其表面容易地形成与树脂膜的界面中的凹凸小的导电性层的导电性物质吸附性树脂薄膜及其制造方法；使用其得到的与绝缘性的树脂薄膜的粘附性出色的容易形成高精细的配线的带金属层的树脂薄膜以及作为可利用简易的方法制作具有高精细的配线的印刷线路板的材料的带金属层的树脂薄膜的制造方法。另外，本发明还提供至少包括2层树脂层、该树脂层的至少1层为具有吸附导电性物质或金属的性质的吸附性树脂层的导电性物质吸附性树脂薄膜。通过在该导电性物质吸附性树脂层吸附金属进而进行电镀处理，可以得到带金属层的树脂薄膜。