Умножитель частоты следования импульсов

УМНОЖИТЕЛЬ ЧАСТОТЫ СЛЕДОВАНИЯ ИМПУЛЬСОВ, содержащий последовательно соединенные фильтр, делитель напряжения, компараторы и сумматор , отличающийся тем, что, с целью расширения функциональных возможностей путем получения коэффициента умножения равного N, в него введены последовательно соединенные формирователь импульсов, формирователь пилообразного напряжения : и амплитудный детектор, а делитель напряжения выполнен с (Н-1)-м выходами , каждый из которых соединен с первьш входом соответствующего компаратора , второй вход которого соединен с выходом формирователя пилообразного напряжения, а выход - с соответствующими входами сумматора, дополнительный , вход которого подключён к выходу формирователя импульсов .

Einrichtung zur Erzeugung einer Beschichtung von Druckprodukten einer Druckmaschine mit modifizierbarer Tropfencharakteristik

Einrichtung einer Druckmaschine zur Erzeugung einer Beschichtung, mit - einer Lackiereinheit zum Beschichten eines in der Druckmaschine verarbeiteten Bedruckstoffs, - wobei die Lackiereinheit als separater Ink-Jet-Drucker in Form eines Ink-Jet-Kopf-Arrays oder eines Ink-Jet-Kopf-Balkens zum zeilenweisen Beaufschlagen des bevorzugt großformatigen Bedruckstoffs verwendet wird, - wobei der Bedruckstoff unter Austrittsöffnungen der Ink-Jet-Köpfe durchgeführt wird, und - wobei die Ink-Jet-Köpfe über eine Steuerungseinheit derart angesteuert sind, dass die Mengenverteilung des Beschichtungsmaterials sowohl in der Fläche als auch im Schichtprofil und damit in der Beschichtungsstärke variierbar ist, wobei - die Ink-Jet-Köpfe mit einem Bilddatenrechner datentechnisch verbunden sind, wobei der Bilddatenrechner als Steuerungseinheit für die Ink-Jet-Köpfe derart ausgebildet ist, dass die Tropfencharakteristik der Ink-Jet-Köpfe mittels digitaler Bilddaten derart modifizierbar ist, dass die Mengenverteilung ...

Circuit board assembly

Manufacturing of high resolution conductive patterns using organometallic ink and banded anilox rolls

Sensing decal

REVERSE EMBOSSING PROCEDURE

ELECTRICALLY ADAPTED LAYER

PRINTED CIRCUIT PRODUCTION LINE

A printed circuit production line, comprising a computer connected to an input device and, via an interface, to an automatic laser engraving unit mechanically coupled to a plate holder and a printing machine which, in turn, is mechanically coupled to a set of equipment for mechanical working and chemical and galvanic treatment of printed circuit boards. The automatic laser engraving unit comprises a plate scanning system and an optic laser system which are optically interconnected. The interface comprises a switching circuit, an interrogation driver, and a pulse repetition frequency multiplier. The invention considerably speeds up the manufacture of printed circuits, reduces the amount of rejects, and improves the quality of printed circuits and working conditions.

PROCESS AND DEVICE FOR PRINTING A SUBSTRATE

The invention relates to a method and device for printing a fabric. The printable fabric (11) is moved through at least one printing mechanism (10) in order to print a static or non-variable printing image. According to the invention, the printable fabric (11) is moved through at least one printing device (12,13) which is coupled in-line to the printing mechanism (10) in order to individualize the static pattern with at least one dynamic or variable printing image.

A METHOD TO MAKE A METALLIC LAYER ON A SURFACE OF A DETAIL FOR SCREENING AGAINST ELECTROMAGNETIC RADIATION

The invention relates to a method of transferring a layer onto a detail (8) which shields against electromagnetic radiation. The layer (3, 7) is transferred with a predetermined extension directly or indirectly on to the detail (8) with the help of a known printing method.

Method for repairing a defective circuit board with at least one component.

Verfahren zur Reparatur einer Leiterplatte (1) mit zumindest einem defekten Bauteil (2), welches über zumindest eine leiterplattenseitige Kontaktstelle (3) mechanisch und/oder elektrisch mit der Leiterplatte (1) verbunden ist, wobei das Verfahren zumindest folgende Schritte umfasst: Entfernen des defekten Bauteils (2) von der Leiterplatte (1); Reinigen der mindestens einen leiterplattenseitigen Kontaktstelle (3); Aufbringen einer Lotpaste (4) auf die mindestens eine gereinigte leiterplattenseitige Kontaktstelle (3) mittels eines Lotauftragsstempels (5), wobei der Lotauftragsstempel (5) zuerst in einem Benetzungsschritt zur Benetzung mit der Lotpaste (4) in ein Reservoir (6) mit Lotpaste (4) zumindest teilweise abgesetzt wird und anschliessend der benetzte Lotauftragsstempel (5) in einem Übertragungsschritt auf der mindestens einen gewünschten leiterplattenseitigen Kontaktstelle (3) abgesetzt wird, so dass ein Aufbringen der Lotpaste (4) auf die mindestens eine leiterplattenseitige Kontaktstelle ...

Conductive metal ink composition, and method for preparing a conductive pattern

The present invention relates to a conductive metal ink composition, comprising an agent for enhancing the adherence of a first conductive metal powder to a non-aqueous solvent, as well as a polymer-coating property enhancer, and to a method for preparing a conductive pattern using the conductive metal ink composition. The conductive metal ink composition of the present invention may be appropriately applied to a roll printing process or the like, and may form a conductive pattern having improved conductivity and superior adherence to a base.

Process for contact printing of pattern of electroless deposition catalyst

Method for the manufacture of a printed circuit and planar antenna manufactured with this printed circuit

一种基于二自由度平衡环的曲面微笔静电直写成形装置

... 本发明公开了一种基于二自由度平衡环的曲面微笔直写成形装置，其中二自由度平衡环系统、气动导电油墨供料系统、曲面基板支撑系统均安装在平台支架上，曲面基板支撑的工作轴心与气动导电油墨供料系统的直写针头轴心重合，真空泵通过气管连接在曲面基板支撑系统的吸盘连接杆部分，电场电源正负极分别连接在气动导电油墨供料系统的直写针头部分和曲面基板支撑系统的电极部分，从而使固定在二自由度平衡环系统上的曲面基板处在直写针头与曲面基板支撑系统电极之间形成的静电电场中。本发明使曲面基板的待直写区域时刻保持水平，可实现曲面基板上电路的直写成形，可以在形状比较复杂的随机曲面基板表面直写制备具有电学性能的微型电路。 ...

PROCESS FOR PRINTING USING TWO LASERS

MANUFACTORING PROCESS Of a CIRCUIT PRINTS AND PLANAR ANTENNA MANUFACTURED WITH THIS ONE

La présente invention concerne un procédé de fabrication d'un circuit imprimé sur un support (2) diélectrique, pour lequel, lors d'une première étape, un modèle de circuit (1) est appliqué avec une encre conductrice de l'électricité et, lors d'une deuxième étape, le modèle de circuit est métallisé, l'encre conductrice de l'électricité étant appliquée au moyen d'un procédé d'héliogravure et la métallisation étant effectuée par voie électrolytique ou chimique.

CONDUCTIVE METAL INK COMPOSITION AND PREPARATION METHOD FOR CONDUCTIVE PATTERN

METHOD FOR BURYING A CONDUCTIVE MESH OF A TRANSPARENT ELECTRODE CAPABLE OF SECURELY FIXING THE CONDUCTIVE MESH TO THE TRANSPARENT ELECTRODE

PURPOSE: A method for burying a conductive mesh of a transparent electrode is provided to improve contact performance of the transparent electrode by burying the conductive mesh in the inner side of the transparent electrode. CONSTITUTION: A plate comprises a plurality of grooves forming into a mesh shape. A mesh burying apparatus(100) comprises a first conveying part(120) of PDMS(polydimethylsiloxane) material touched to the plate. A conductive mesh(M) is buried in a transparent electrode(E) by using the mesh burying apparatus so that the conductive mesh is not projected from the transparent electrode(S100). The plurality of grooves is filled with the conductive mesh. The conductive mesh attached to the first conveying part is entered into the inner side of the transparent electrode. The first conveying part is separated from a substrate(S)(S150). COPYRIGHT KIPO 2012 ...

투명한 전도성 막

... 높은 광 투과율, 낮은 표면 저항성, 및 우수한 필-오프 부착력을 나타내는 투명한 전도성 막이 개시되고 청구된다. 그와 같은 막은 전자장치 적용에 유용하다.

FRONT FILTER OF A PLASMA DISPLAY PANEL AND A METHOD FOR MANUFACTURING A PLASMA DISPLAY PANEL INCLUDING THE SAME, TO REDUCE LOSS AND AN ERROR RATE IN A MANUFACTURING PROCESS

PURPOSE: A front filter of a plasma display panel and a method for manufacturing a plasma display panel including the same are provided to reduce residues and an error rate by forming an electromagnetic wave shielding layer by implanting directly conductive paste into a mask. CONSTITUTION: A front filter includes a transparent resin(32) and an electromagnetic wave shielding layer. The electromagnetic wave shielding layer is formed on the transparent resin. The electromagnetic wave shielding layer is formed by transferring conductive paste(31) implanted into a mask(30a,30b). The transparent resin is positioned on an upper plate(33) of the plasma display panel. The transparent resin is positioned on a base film or a glass. A method for manufacturing a plasma display panel includes a process for preparing the mask having a depressed pattern, a process for implanting the conductive paste into the mask, and a process for forming the electromagnetic wave shielding layer by transferring the conductive ...

Kit, laminate, method for producing laminate, method for producing cured product pattern, and method of producing circuit board

Provided are: a kit of a curable composition for imprinting and a composition for forming an underlayer film for imprinting, which is capable of forming a uniform underlayer film, while having excellent wettability; and a laminate, a method for producing a laminate, a method for producing a cured product pattern, and a method for producing a circuit board, each of which uses the above-described kit. According to the present invention, a kit comprises a curable composition for imprinting and a composition for forming an underlayer film for imprinting; the composition for forming an underlayer film for imprinting contains a solvent in an amount of 99.0% by mass or more; the surface tension of the curable composition for imprinting and the surface tension of the nonvolatile component in the composition for forming an underlayer film for imprinting satisfy a specific relationship; and the nonvolatile component has a boiling point of more than 300 DEG C, and is in a liquid state at 23 DEG C.

Re-inking roller for microcontact printing in a roll-to-roll process

Composition of conductive ink for offset or reverse-offset printing

SOFT LITHOGRAPHIC STAMP WITH A CHEMICALLY PATTERNED SURFACE

L'invention concerne un tampon lithographique mou (30) et un procédé de fabrication du tampon (30). Un tampon (30) selon l'invention comprend des zones de blocage (37) et des zones d'impression (38). Les zones de blocage (37) sont constituées d'un matériau qui est différent du matériau dont sont constituées les zones d'impression (38) et qui présente une perméabilité, une diffusivité ou une capacité absorbante ou adsorbante dans le composé d'impression qui sont réduites, de sorte qu'elles empêchent ou réduisent sensiblement le transport ou le transfert chimique ou physique du composé d'impression des zones de blocage au substrat destiné à être marqué ou imprimé. Ainsi, lorsque le tampon (30) est imprégné d'un composé d'impression, ce dernier ne se diffuse que dans les zones d'impression (38) et, par conséquent, le composé d'impression n'est transféré que des zones d'impression (38) au substrat destiné à être marqué et sensiblement aucune diffusion du composé d'impression ne se produit via ...

Electroless copper plating polydopamine nanoparticles

Aqueous dispersions of artificially synthesized, mussel-inspired polyopamine nanoparticles were inkjet printed on flexible polyethylene terephthalate (PET) substrates. Narrow line patterns (4 μm in width) of polydopamine resulted due to evaporatively driven transport (coffee ring effect). The printed patterns were metallized via a site-selective Cu electroless plating process at a controlled temperature (30° C.) for varied bath times. The lowest electrical resistivity value of the plated Cu lines was about 6 times greater than the bulk resistivity of Cu. This process presents an industrially viable way to fabricate Cu conductive fine patterns for flexible electronics at low temperature, and low cost.

Method of manufacturing printed circuit boards

Methods of manufacturing printed circuit boards are disclosed. The methods utilize various printing techniques to apply conductive compositions to substrates in the creation of printed circuit boards. The method of manufacturing printed circuit board comprises the step of applying conductive composition to a substrate through a cold welding process.

Photogravure pressure and method for manufacturing multilayer ceramic electronic component

In a print area provided on a peripheral surface of a gravure roll, a plurality of cells are defined by printing-direction walls and perpendicular walls, and each perpendicular wall has a plurality of cuts. In a center portion of the print area, most intersections of the printing-direction walls and the perpendicular walls are defined by T-shaped intersections where the perpendicular walls do not cross the printing-direction walls, but meet the printing-direction walls in a T-shaped arrangement. Preferably, round chamfers are provided at corners where a portion of each printing-direction wall and a portion of each perpendicular wall intersect, and at leading ends of the perpendicular walls pointing toward the cuts.

High spread highly randomized generatable interleavers

Methods and apparatus for generating and performing digital communications using a randomized generatable interleaver. In accordance with one exemplary embodiment of the invention, a pseudo random interleaver of size n*m with excellent randomness and spread properties may be generated from a set of seed values. The interleaver of size N=n*m is defined by dividing the N possible address in the interleaver (0-N-1) into n subsets. The subsets are preferably generatable from a single value with in the subset either using an algorithm or a memory based lookup table. The set of n seeds comprises one value selected from each subset. An improved communication system incorporating the aforementioned interleaver and using turbo codes or other concatenated coding systems is also disclosed.

Electrically-conductive liquid for directly printing an electrical circuit component onto a substrate, and a method for making such a liquid

An electrically-conductive liquid for directly printing an electrical circuit component onto a substrate includes between substantially 25 percent and substantially 85 percent by weight of a solvent or water. Between substantially 10 percent and substantially 40 percent by weight of solids are provided, the solids including (i) substantially 5 percent to substantially 30 percent of polymer resin, and (ii) substantially 3 percent to substantially 15 percent by weight of a conductive powder. Between substantially 1 percent and substantially 7 percent by weight of plasticizers are also included. A method of making such an ink includes the steps of premixing the above-referenced solids and the above-referenced plasticizers, and then mixing the premix with the above-referenced solvent or water.

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Provided is a printed circuit board using thermally and electrically conductive layer, and a manufacturing method thereof. The manufacturing method for mounting a plurality of elements includes forming an electrode layer on a substrate of a PCB, forming a photo solder resist (PSR) layer in a patterned manner on a first area of the electrode layer; forming a conductive layer on the PSR layer in the patterned manner, the conductive layer being configured to conduct heat and static electricity; and mounting a plurality of elements on a second area of the side of the PCB, the second area being different from the first area.

ELECTRONIC MODULE, METHOD FOR MANUFACTURING SAME AND ELECTRONIC DEVICE COMPRISING A MODULE OF SAID TYPE

The invention relates to an electronic module comprising a dielectric support film having a first side, conductor paths that are printed on said first side, and a semiconductor component which connects the conductor paths by means of electrical connections. The electronic module of the invention is characterized in that each electrical connection includes a lead wire that connects a contact of the semiconductor component to each path directly or via an island or an interconnection pad. 1. An electronic module comprising a dielectric support film , having a first side , conductor paths that are printed on said first side and a semiconductor component which connects the conductor paths by means of electrical connections , wherein each electrical connection includes a lead wire that connects a contact of the semiconductor component to each path directly or via an island or an interconnection pad.2. The electronic module according to claim 1 , wherein each conductor path comprises a second end forming an interconnection pad designed to be electrically connected to an interconnection terminal of said electric circuit.3. The electronic module according to claim 1 , wherein the dielectric support film furthermore bears on a second side claim 1 , several electrical contact pads claim 1 , wherein said semiconductor component is electrically connected to said electrical contact pads.4. The electronic module according to claim 3 , wherein a first end of the lead wire is fixed to the contact stud of said semiconductor component and the other end of the lead wire passes through a reservation formed in the thickness of the dielectric film with respect to a contact island marked out in a contact pad and is fixed to said contact island and wherein the first end of the printed conductor path is created in said reservation on the surface of said contact island and emerges on the surface of the first side of said dielectric support film.5. The electronic module according to claim 1 , ...

System and Method for Controlling Powder Bed Density for 3D Printing

A system and corresponding method for additive manufacturing of a three-dimensional (3D) object to improve packing density of a powder bed used in the manufacturing process. The system and corresponding method enable higher density packing of the powder. Such higher density packing leads to better mechanical interlocking of particles, leading to lower sintering temperatures and reduced deformation of the 3D object during sintering. An embodiment of the system comprises means for adjusting a volume of a powder metered onto a top surface of the powder bed to produce an adjusted metered volume and means for spreading the adjusted metered volume to produce a smooth volume for forming a smooth layer of the powder with controlled packing density across the top surface of the powder bed. The controlled packing density enables uniform shrinkage, without warping, of the 3D object during sintering to produce higher quality 3D printed objects. 1. A binder jet system for additive manufacturing of a three-dimensional object , the system comprising:a hopper configured to deposit an amount of powder material onto a powder print bed and to move across the powder print bed in a direction of travel;a skimming device positioned downstream of the hopper relative to the direction of travel, wherein the skimming device is configured to traverse the amount of powder material to remove excess powder material from the powder print bed;a spreading apparatus positioned downstream of the skimming device in the direction of travel, wherein the spreading apparatus is configured to spread the powder material to form a layer of the powder material across the powder print bed, wherein the spreading apparatus includes a roller that is configured to move in the direction of travel, wherein an axis of rotation of the roller is angled at a non-perpendicular angle relative to the direction of travel, and wherein the roller is configured to direct powder material in a direction in the non-perpendicular ...

METHODS FOR MANUFACTURING ELECTRONIC DEVICES BY TIP PRINTING AND SCRAPE COATING

Musterstrukturierverfahren und Verfahren zum Herstellen eines LCD

Musterstrukturierverfahren, das Folgendes beinhaltet: Herstellen einer Druckplatte (400) mit Vertiefungen (430) und Stegen (460); Eintropfen eines Mustermaterials (200a) in die Vertiefungen (430) der Druckplatte (400) unter Verwendung zumindest einer Präzisionsdüse (600), wobei die Höhe des Mustermaterials in der Vertiefung (430) kleiner als die Tiefe der Vertiefungen (430) ist; Rollen einer Druckwalze (500) über die Druckplatte (400), um das Mustermaterial (200a) in den Vertiefungen (430) auf die Druckwalze (500) aufzudrucken; und Rollen der Druckwalze (500) über ein Substrat (100), um das Mustermaterial (200a) auf ihr auf das Substrat (100) aufzudrucken.

Printing

Silicon stamped circuits

A silicon stamp suitable for manufacturing integrated circuits is formed from a silicon wafer having a base 3 and a layer 2 on a surface thereof, which may be silicon dioxide grown on the surface, which is etched to form stamp recesses 4. Sub-nanometre scale powder is applied to the wafer in the form of an ink 5. The wafer is pressed onto a substrate 6, and the ink on areas of the stamp surface not in the recesses is transferred onto the substrate 6. The ink may contain sub-nanoparticles of silicon suspended in a non-reactive liquid vehicle.

Method of manufacturing a capacative touch sensor circuit using a roll-to-roll process to print a conductive microscopic pattern

Printing device and printing method using the same

A printing device and a printing method using the same is disclosed, in which an air pocket (630) is formed in a clich’ stage (450) so as to prevent a cleaning solution from permeating into a space between the clich’ stage (450) and a clich’ plate, thereby preventing a lower surface of the clich’ plate from being contaminated, the printing device comprising a clich’ stage (450) for fixation of a clich’ plate; a plurality of vacuum holes (600), formed in the clich’ stage (450), for vacuum-suction and fixation of the clich’ plate; and an air pocket (630) surrounding the plurality of vacuum holes (600) so as to prevent a cleaning solution from permeating into a space between the clich’ plate and the clich’ stage (450).

Improvements in or relating to the production of electrical resistors

An electrical circuit is printed on an insulating surface by applying a pattern in a finely divided conductive material substantially free from a permanent binder and then applying heat and pressure to at least the coated areas to cause the conducting particles to cohere together to form a conductive path which is partially embedded in the insulating material. The printing is carried out by using a slurry containing the finely divided conductive material and a volatile diluent. A small proportion of a less volatile organic solvent may also be present. A circuit may be printed on polystyrene using the off-set printing method, the printing block being inked with a slurry containing 50 per cent silver, 20 per cent triethanol-amine alginate and 10 per cent ethylene glycol. The print is sprinkled with finely divided silver, the surplus being brushed off before pressing at 150 DEG C and 500 lb./sq. in. for 0.5 sec. The sheet is finally washed. A print may be made on a phenol formaldehyde laminate ...

DEVICE FOR THE PRODUCTION OF ELECTRONIC DEVICES OF MEANS ROLL TON ROLL ROTARY PRINTING PROCEDURE

Electrical connection on a textile support material

Um eine einfache und sichere Verbindung zwischen zwei oder mehreren elektrischen Leitern auf einem textilen Trägermaterial (11) herzustellen ist vorgesehen, dass auf dem Trägermaterial (11) zur Herstellung der elektrisch leitenden Verbindung zwischen dem ersten Leitelement (31) und dem zweiten Leitelement (32) ein elektrisch leitender Thermotransferklebstoff (21) angeordnet ist, der in elektrisch leitendem Kontakt mit dem ersten Leitelement (31) und dem zweiten Leitelement (32) ist.

Method and apparatus for making electrical traces, circuits and devices

Method for transferring a picture to a surface

SILVER NANOPARTICLE INK

An ink composition including a metal nanoparticle; at least one aromatic hydrocarbon solvent, wherein the at least one aromatic hydrocarbon solvent is compatible with the metal nanoparticles; at least one aliphatic hydrocarbon solvent, wherein the at least one aliphatic hydrocarbon solvent is compatible with the metal nanoparticles; wherein the ink composition has a metal content of greater than about 45 percent by weight, based upon the total weight of the ink composition; wherein the ink composition has a viscosity of from about 5 to about 30 centipoise at a temperature of about 20 to about 30 °C. A process for preparing the ink composition. A process for printing the ink composition comprising pneumatic aerosol printing.

A DISPOSABLE CONTENT USE MONITORING PACKAGE WITH INDICATOR AND METHOD OF MAKING SAME

There is provided a content use monitoring package having a status indicator and a method of making same.

GLASS SUBSTRATE, EQUIPPED WITH CONDUCTING STRIPS BASED ON COPPER

Photogravure press and method for manufacturing multilayer ceramic electronic component

A method for manufacture transparent electrically heated glass with high light transmittance and low square resistance

3D printing method for ceramic substrate multilayer circuit

Silver particle coating composition

A method of Printing Electrical Circuits onto Substrates

Improvements with the manufacture of devices with electric drivers

Production of portable objects such as electronic labels using flexography or other rotating printing processes so that the production process can be increasingly automated and production rates increased

Dans la fabrication d'objets portables de type cartes sans contact est déposée, selon l'invention, une matière conductrice sur des supports bobinés, par les techniques de tampographie rotative et/ ou de flexographie, pour la fabrication de circuits intégrés de type sans contact conditionnés par lamination à froid en continu.

APPARATUS FOR MANUFACTURING ELECTRODE OF SOLAR CELL SUBSTRATE

An apparatus for manufacturing an electrode of a solar cell substrate according to the present invention comprises: a machine lathe; a roll-driving type transcription unit which is disposed on the center of the machine lathe and transcribes electrode paste on a flexible substrate and a glass substrate; a roll-driving type paste supply unit which is disposed on one side of the machine lathe, stores electrode paste and supplies electrode paste to the transcription unit; a roll-driving type flexible substrate transfer unit which is disposed on another side of the machine lathe, facing the paste supply unit, and allows electrode paste to be transcribed on the flexible substrate while transferring the flexible substrate toward the transcription unit to make the flexible substrate correspond to the transcription unit; and a glass substrate transfer unit which is disposed on a lower side of the transcription unit, is mounted with the glass substrate, and allows electrode paste to be transcribed ...

MICRO-DEVICE TRANSFER APPARATUS CAPABLE OF SELECTIVE TRANSFER

MICRO-DEVICE TRANSFER APPARATUS CAPABLE OF SELECTIVE TRANSFER AND ELECRONIC PRODUCTS MANUFACTURED USING THE SAME

DEVICE TO CREATE A SHIELD AGAINST ELECTROMAGNETIC RADIATION AND/OR FOR ELECTRIC CHAIN DRAINING

Printed wiring

This printed wiring is formed from a cured conductive ink film formed on a surface of a base material, and configured by including at least: a single wavy line; a first wiring element that is positioned on one of opposite sides of the wavy line in the width direction; and a second wiring element that is positioned on the other one of the opposite sides adjacently to the wavy line, wherein an extra wavy line that is another wavy line is provided between the wavy line and the first wiring element so as to be adjacent to the wavy line, extended side by side with the wavy line, and connected to the wavy line to be at the same potential as the wavy line.

Flexible-electronic-device manufacturing apparatus

A flexible-electronic-device manufacturing apparatus for manufacturing an electronic device (1) including a flexible base material (100) and a plurality of functional layers (110, 120, 130, 140) provided thereon includes: an impression cylinder (30) configured to hold and transport the base material (100); impression-cylinder driving means (230) for rotating the impression cylinder (30); processing means (40, 50, 60, 70) for performing a plurality of processes for providing the plurality of functional layers (110, 120, 130, 140) by a printing method or a coating applying method on the base material (100) held on the impression cylinder (30); impression-cylinder phase detecting means (201) for detecting the phase of the impression cylinder (30); and controlling means (200) for controlling the impression-cylinder driving means (230) and the processing means (40, 50, 60, 70) based on the result of detection by the impression-cylinder phase detecting means (201).

METHOD FOR PRINTING A CONDUCTIVE CIRCUIT USING A UV ROTATIONAL MOLDING MACHINE

The present invention relates to a method for printing a conductive circuit using a UV rotational molding machine, and more particularly to a method in which, when a conductive circuit is printed, UV imprint and gravure offset processes are performed in a roll-to-roll manner in order to form a high-density and highly integrated pattern, and according to which low-cost mass production is possible.

UV-Curable Ink Composition, Method for Producing Bezel Pattern of Display Substrate Using Same, and Bezel Pattern Produced Thereby

The present invention relates to a UV-curable ink composition, a method for producing a bezel pattern of a display substrate using same, and a bezel pattern produced thereby, the UV-curable ink composition comprising a colorant, an epoxy resin, an oxetane resin, a photopolymerization initiator, and a surfactant comprising a polar functional group, wherein the content ratio of the epoxy resin to the oxetane resin is 1:0.5-1:6.

System and method for high speed processing of turbo codes

A system and method for high efficiency, high performance processing of turbo codes is described. In accordance with one embodiment of the invention, an interleaver for interleaving code symbols is providing, the interleaver having a plurality of subsections, each subsection having a set of addresses and each address having an index, wherein a substantially constant relationship exists from any one subsection to any other subsection between the index of each address at a particular location.

Process and apparatus for manufacturing printed circuit boards

A method and apparatus for producing printed circuits utilizing direct printing methods to apply a pattern mask to a substrate. The pattern mask may be an etch resist mask for forming conductive pathways by an etching process, or the pattern mask may be a plating mask with conductive pathways being formed by a plating operation. The process of the present invention is applicable to forming both single-sided and double sided printed circuit boards.

Transfer method for manufacturing conductor structures by means of nano-inks

A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material. A method for producing a laminate material using the film material using at least one electrically conductive conductor structure, and to the corresponding film material and laminate material are described.

High spread highly randomized generatable interleavers

Methods and apparatus for generating and performing digital communications using a randomized generatable interleaver. In accordance with one exemplary embodiment of the invention, a pseudo random interleaver of size n*m with excellent randomness and spread properties may be generated from a set of seed values. The interleaver of size N=n*m is defined by dividing the N possible address in the interleaver (0N1) into n subsets. The subsets are preferably generatable from a single value within the subset either using an algorithm or a memory based lookup table. The set of n seeds comprises one value selected from each subset. An improved communication system incorporating the aforementioned interleaver and using turbo codes or other concatenated coding systems is also disclosed.

Fabricating method of a pattern including stretching a substrate

Provided is a fabricating method of a pattern, which includes preparing a first substrate having a first width and a first thickness, stretching the first substrate and preparing a second substrate having a second width and a second thickness, forming a base layer made of a material of a pattern which will be formed on the second substrate, removing a predetermined region of the base layer and forming a first pattern having a first line width and a first height on the second substrate, and removing a tensile force applied to the second substrate to restore the second substrate back to being the first substrate and forming a second pattern having a second line width and a second height on the first substrate. Fineness of a line width can be achieved by forming the first pattern in a state in which the substrate is stretched, contracting a line width of the first pattern while restoring the stretched substrate, and forming the second pattern having a contracted line width on the restored ...

Method and apparatus for printing electrical circuit directly on target surface having 3-dimensional shape, 3D printer used for the same and electrical device having electrical circuit printed by the same

A method and apparatus for printing an electric circuit directly on a target surface having a three-dimensional shape are provided. In this method, a 3D printing apparatus that can be attached to a target surface is used. In this printing method, two-dimensional information about the shape of the electric circuit to be printed and information about the three-dimensional shape of the target surface are input. Two-dimensional information about the shape of the electric circuit to be printed is adjusted based on the information about the three-dimensional shape of the target surface to generate three-dimensional information about the electric circuit to be printed. Based on this, a tool path for controlling the 3D printing apparatus is generated. An electric circuit can be directly fabricated on a target surface having a three-dimensional shape by the method and apparatus. In addition, an electronic device having a three-dimensional electric circuit manufactured by the present method can be ...

Process for manufacturing printed conductors

To make inductance elements, thick film electrically conductive paste, which may include precious metal such as silver, are applied by a deformable stamp on a ferrite core which, for example, can be someone hump shaped, for adhesion to a carrier (30) and formed with openings thereto, the stamp being shaped to fit within the opening and deforming to penetrate the opening to apply the thick film conductive paste in form of conductive tracks thereon. Conductive tracks can be applied, previously, to a substrate carrier (30), which are then joined by the paste strips to form interconnected windings (FIGS. 1a, 1b); or the ferrite may be in form of a toroidal core (34), on which the conductive tracks are applied around all surfaces, to form connected windings thereon, the deformable stamp having a projecting tip which can fit within the opening of the toroidal core.

PRINTED WIRING BOARD AND MANUFACTURING METHOD FOR SAME

СПОСОБ ИЗГОТОВЛЕНИЯ МЕТАЛЛИЧЕСКОГО СЛОЯ НА ПОВЕРХНОСТИ ДЕТАЛИ ДЛЯ ЭКРАНИРОВАНИЯ ОТ ЭЛЕКТРОМАГНИТНОГО ИЗЛУЧЕНИЯ

Изобретение относится к способу переноса слоя на деталь, который экранирует от электромагнитного излучения. Технический результат: повышение качества разрабатываемого металлического слоя, который экранирует от электромагнитного излучения, уменьшение трудоемкости, временных и материальных затрат при реализации способа. Слой переносится с заранее определенной протяженностью непосредственно или косвенно на деталь с помощью способа печати, при котором используется тампонная печатающая подушка. 2 з.п. ф-лы, 2 ил.

СПОСОБ И УСТАНОВКА ДЛЯ ПОЛУЧЕНИЯ ЭЛЕКТРОПРОВОДЯЩИХ РИСУНКОВ НА ПОДЛОЖКАХ

Изобретение относится к изготовлению электропроводящего рисунка. Техническим результатом является повышение обеспечения контролируемого теплопереноса и терморегулирование в ходе работ по нагреву, плавлению и отверждению. Упомянутый технический результат достигается тем, что способ (200, 300, 500) получения электропроводящего рисунка на подложке (202, 402) содержит этапы, на которых: обеспечивают электропроводящие твердые частицы на области подложки в виде заданного рисунка (508), где рисунок (403) содержит контактную область (404B) для соединения с электронным компонентом и проводящую структуру (404A), имеющую по меньшей мере часть (414), прилегающую к контактной области, нагревают проводящие частицы до температуры, более высокой, чем характеристическая точка плавления частиц, для установления расплава (510), и прижимают расплав к подложке в зажиме, температура контактной части которого ниже, чем вышеупомянутая характеристическая точка плавления, для отверждения частиц, с образованием электрически ...

PRINTED CIRCUIT BOARDS

A method of producing electrically conductive areas

A method is proposed for producing electrically conductive areas in which an electrically conductive paste is applied by means of a rotating, elastically deformable die (21) in a printing process to predetermined areas of a carrier (15). The method in accordance with the invention can be used with particular advantage for printing curved surfaces, particularly of electro-chemical metering sensors (15) for determining the oxygen content in gases. ...

System for introducing a substrate into a nip

The system comprises a web carrying a substance to be deposited onto a wafer substrate. A nip 40 is provided between a roller and an opposing surface and a transport conveyor advances a wafer substrate having parallel side edges towards the nip, so that the wafer substrate is gripped in the nip and frictionally driven through the nip at the same time as, and with the same velocity as, the web, the web being pressed against a surface of the substrate during passage through the nip to cause the substance pattern to transfer onto the wafer substrate. Lateral roller abutments 1106, 1108 located on opposite sides of the transport conveyor and resiliently biased towards one another to grip opposite side edges of the substrate, the abutments serving to align the substrate with the web and to apply a frictional force to advance the substrate towards the nip.

PRINTER AND A PROCEDURE FOR THE PRODUCTION OF A PRESS PRODUCT

PROCEDURE FOR THE PRODUCTION OF RFID LABELS

A smart package and monitoring system with indicator and method of making same

There is provided a smart package and monitoring system having a status indicator and a method of making the same. The smart package includes an electronic sensor monitoring tag having re-usable electronic circuitry and power source along with a conductive grid printed on a thin flexible substrate and connected to the tag so the tag and grid are in electrical continuity to form a monitoring device. The conductive grid is aligned with an opening of the smart package. The smart package can also include an optical ink indicator configured to display the status of the package. A multiplexer can be used to connect the tag to the conductive grid. The conductive grid can include capacitive sensors formed on a thin plastic layer and positioned so as to form a capacitive element with the conductive side of the blister.

System and method for high speed processing of turbo codes

PRINTED CIRCUIT PRODUCTION LINE

SILVER NANOPARTICLE INK

An ink composition including a metal nanoparticle; at least one aromatic hydrocarbon solvent, wherein the at least one aromatic hydrocarbon solvent is compatible with the metal nanoparticles; at least one aliphatic hydrocarbon solvent, wherein the at least one aliphatic hydrocarbon solvent is compatible with the metal nanoparticles; wherein the ink composition has a metal content of greater than about 45 percent by weight, based upon the total weight of the ink composition; wherein the ink composition has a viscosity of from about 5 to about 30 centipoise at a temperature of about 20 to about 30 °C. A process for preparing the ink composition. A process for printing the ink composition comprising pneumatic aerosol printing.

Apparatus and method of microcontact printing for improving uniformity

Method and device for printing printed material

Metalization of surfaces

Method of manufacture for plastic support, manufacturing device for same and use of the method for the manufacture of IC.

PRODUCTION LINE OF PLATES HAS WIRING OR CIRCUIT PRINTS

PRINTING PLATE FOR FORMING FINE WIRE PATTERNS, MANUFACTURING METHOD THEREOF, AND METHOD FOR FABRICATING FLAT PANEL DISPLAY DEVICE BY USING THE SAME

PURPOSE: A printing plate, a manufacturing method thereof, and a method for fabricating a flat panel display device by using the same are provided to correct concave patterns by a correcting film to carry out patterning process, thereby forming wires with high precision. CONSTITUTION: A printing plate includes a substrate(10') formed with concave patterns(P), and a correcting film(20) formed over the entire surface of the substrate including the concave patterns. The correcting film is preferably formed of inorganic substances by CVD(Chemical Vapor Deposition) or sputtering, and corrects width of the concave patterns without any change in the shape of the concave patterns. © KIPO 2007 ...

PATTERN TRANSFER DEVICE AND A PATTERN TRANSFER METHOD CAPABLE OF INCREASING THE PLANARITY OF A PRINTING PLATE

PURPOSE: A pattern transfer device and a pattern transfer method are provided to transfer an excellent pattern on a board by using a printing board having improved planarity. CONSTITUTION: A printing board(12) is installed on the top of a printing board stage(10). The specific pattern is formed in the printing board. A board stage(20) is separated from the printing board stage. A pressure unit(100) is installed in the printing plate stage. The pressure unit locally applies pressure to the printing board. A printing unit(30) transfers the pattern to the board. COPYRIGHT KIPO 2012 ...

그라비어 오프셋 인쇄기

... 제1, 2 판동(112, 122)과, 제1, 2 블랭킷동(116, 126)과, 판동(112, 122)으로부터 블랭킷동(116, 126)으로 잉크(2)를 전달하도록 판동(112, 122) 및 블랭킷동(116, 126)을 작동시키는 전달 작동 수단(117, 118, 127, 128)과, 블랭킷동(116, 126)의 잉크(2)를 웹 형상의 기재(1)에 전사하도록 블랭킷동(116, 126)을 이동시키는 전사 작동 수단(119, 129)과, 제1 블랭킷동(116)으로부터 기재(1)로의 잉크(2)의 전사와 제2 판동(122)으로부터 제2 블랭킷동(126)으로의 잉크(2)의 전달을 병행하여 행하도록 작동 수단(117, 118, 119, 127, 128, 129)의 작동을 제어하는 제어 장치(130)를 구비하는 인쇄기(100)로 했다.

CONDUCTIVE INK FOR LETTERPRESS REVERSE PRINTING

?estampas de impressão por microcontato com características funcionais?

RE-INKING ROLLER FOR MICROCONTACT PRINTING IN A ROLL-TO-ROLL PROCESS

Micro-contact printing stamp

Inking system for flexographic printing

A flexographic printing system comprising a print module including a plate cylinder on which is mounted a flexographic printing plate, an impression cylinder, an ink pan containing an ink, and an anilox roller for transferring the ink to the flexographic printing plate. A fountain roller mounted to the ink pan is at least partially immersed in the ink in the ink pan and transfers the ink to the anilox roller. A doctor blade mounted to the ink pan and is on a side of the anilox roller proximate to the impression cylinder removes excess amounts of the ink from the patterned surface of the first anilox roller before the ink is transferred to the flexographic printing plate.

METHOD AND DEVICES FOR EVALUATING ELECTRICALLY CONDUCTIVE, PRINTED STRUCTURES UND PRINTING MACHINE HAVING SUCH A DEVICE

The invention relates to a method for evaluating electrically conductive, printed structures and to a device, particularly for executing such a method, and to a printing machine (4) comprising such a device. The invention provides for the printing of electrically conductive structures, such as transistors, for the production of electronic circuits and a link-line conductivity test, preferably transversal to the running direction of the web material (2) running through the printing machine by means of one or more measuring rollers (11), which are provided with spaced ring electrodes for measuring the electric resistance or also for testing the short circuit strength in contact with the printed electrically conductive structure. The measuring signals are wirelessly transmitted to a receiver device (15) and can also be used in a closed control loop for influencing the printing parameters or the control technology of the printing machine.

Roll Printing Apparatus

According to example embodiments, a roll printing apparatus includes a cleaning device in which a cleaning nozzle unit and a spray nozzle unit are integrated so that both a reverse offset process and a cliche cleaning process may be achieved in the roll printing apparatus. The roll printing apparatus may include a base plate, a blanket roll to transfer an ink material to a cliche and a substrate, a blanket roll supporter located on the base plate to support the blanket roll, a cliche table located on the base plate to fix and move the cliche, a substrate table located on the base plate to fix the substrate, and the cleaning device installed on the base plate to clean the cliche. The cleaning device may include a cleaning nozzle unit to spray a cleaning solution and a spray nozzle unit to spray DIW, which are integrated.

Improvements in or relating to printing

A printing form precursor comprises a printing surface which comprises an inorganic metal compound, the printing surface being hydrophobic and capable of being made hydrophilic by energy but capable of becoming hydrophobic again, for reuse, if desired. An associated method of printing includes steps of subjecting the printing surface imagewise to energy so as to locally increase its hydrophilicity sufficient to make the surface differentiated in its acceptance of an oxophilic a printing ink; applying the ink to the printing surface and printing from the printing surface; causing or allowing the printing surface to undergo a reduction in hydrophilicity sufficient again to make the printing surface uniform in its acceptance of a printing ink; and,if wished, repeating these steps on multiple occasions. Thus the invention achieves the goal of providing a printing form precursor which does not need a chemical developer, and which can be used multiple times, to print different images.

Pattern forming apparatus and pattern forming method

The supply of a negative pressure to an opening P(+ 1 ) adjacent to an opening P( 0 ) is stopped by switching a suction valve connected to the opening P(+ 1 ) from an open state to a closed state while keeping a positive pressure valve connected thereto closed. Then, near the opening P(+ 1 ), a force for holding a blanket becomes gradually weaker against a pressure force in a pressurized space. Associated with that, an air component in the pressurized space flows into a space between a portion of the blanket vertically above the opening P(+ 1 ) and an upper surface, whereby the blanket portion is lifted from the upper surface and brought into contact with the lower surface of a printing plate. In this way, a contact area is slowly and stably widened while a sudden change of a pressure in the pressurized space SP 5 is suppressed.

Conductive metal ink composition, and method for preparing a conductive pattern

The present invention relates to a conductive metal ink composition, comprising: a first metal powder having conductivity; a non-aqueous solvent; an attachment improving agent; and a polymer coating property improving agent, and a method for forming a conductive pattern by using the conductive metal ink composition, and the conductive metal ink composition can be appropriately applied to a roll printing process and a conductive pattern exhibiting more improved conductivity and excellent attachment ability with respect to a board can be formed.

Touch panel and method of manufacturing the same

Disclosed herein are a touch panel and a method of manufacturing the same. The touch panel includes a transparent substrate, an insulating layer that is formed on the transparent substrate and has an intaglio portion formed thereon, an electrode layer that is embedded in the intaglio portion, and a light absorbing layer that is formed in an inner wall of the intaglio portion to be interposed between the inner wall of the intaglio portion and the electrode layer. In the touch panel, the electrode layer is formed to be embedded, and the light absorbing layer is further included, thereby durability and visibility of the touch panel.

LASER-ENGRAVEABLE ELEMENTS AND METHOD OF USE

A composition comprises a fluoropolymer such as an elastomeric fluoropolymer and at least 1 weight % of a fluoro-functionalized near-infrared radiation absorber. This composition can be formed into laser-engraveable layers for various elements that can be laser-engraved to provide relief images. The resulting laser-engraved elements can take various forms including flexographic printing members, and can be used to apply various inks to receiver materials in an imagewise fashion. 1. A method for providing a laser-engraveable element , comprising:combining a reactive fluoropolymer, a fluoro-functionalized near-infrared radiation absorber, and a compound that causes crosslinking of the reactive fluoropolymer during thermal curing, to form a reactive fluoropolymer composition,forming the reactive fluoropolymer composition into a reactive fluoropolymer layer, andthermally curing the reactive fluoropolymer layer to provide a laser-engraveable layer comprising a fluoropolymer and the near-infrared radiation absorber.2. The method of comprising:forming the reactive fluoropolymer composition into a reactive fluoropolymer layer over a substrate, andthermally curing the reactive fluoropolymer layer to provide a laser-engraveable layer over the substrate.3. The method of claim 2 , wherein the substrate is selected from the group consisting of a polymeric film claim 2 , a fabric-containing web claim 2 , a ceramic claim 2 , a metal claim 2 , and a glass.4. The method of claim 1 , wherein the reactive fluoropolymer comprises at least two reactive groups selected from the group consisting of α claim 1 ,β-ethylenically unsaturated groups claim 1 , hydroxy claim 1 , carboxy claim 1 , isocyanate claim 1 , (meth)acrylate claim 1 , amine claim 1 , thiol claim 1 , carbonyl claim 1 , alkene claim 1 , alkyne claim 1 , epoxide claim 1 , azide claim 1 , boronic acid claim 1 , and organic phosphate groups.5. The method of claim 1 , wherein the reactive fluoropolymer is a multifunctional (meth ...

MANUFACTURING METHOD OF A CIRCUIT BOARD HAVING A GLASS FILM

Provided is a manufacturing method of a circuit board structure including steps as below. A glass film is provided on an electrostatic chuck (E-chuck). A plurality of first conductive vias are formed in the glass film. A first circuit layer is formed on an upper surface of the glass film, such that the first circuit layer is electrically connected with the first conductive vias. A first polymer layer is formed on the first circuit layer. The first polymer layer covers a surface of the first circuit layer and the upper surface of the glass film. A plurality of second conductive vias are formed in the first polymer layer. A second circuit layer is formed on the first polymer layer, such that the second circuit layer is electrically connected with the second conductive vias. The E-chuck is removed. 1. A manufacturing method of a circuit board structure , comprising:providing a glass film having an upper surface and a lower surface, and the lower surface of the glass film being disposed on an electrostatic chuck;forming a plurality of first conductive vias in the glass film, and the plurality of the first conductive vias penetrate the upper surface and the lower surface of the glass film;forming a first circuit layer on the upper surface of the glass film, such that the first circuit layer is electrically connected with the first conductive vias;forming a first polymer layer on the first circuit layer, and the first polymer layer covering a surface of the first circuit layer and the upper surface of the glass film;forming a plurality of second conductive vias in the first polymer layer, wherein the second conductive vias are electrically connected with the first circuit layer;forming a second circuit layer on the first polymer layer, such that the second circuit layer is electrically connected with the second conductive vias; andremoving the electrostatic chuck, so as to form a first circuit board structure.2. The manufacturing method of the circuit board structure ...

Biodegradable printed circuit boards and methods for making the printed circuit boards

Biodegradable printed circuit boards, or PCBs, may be produced from substrate sheets that include at least one biodegradable polymer. In addition, the electrical traces used on the PCBs, may also include a biodegradable polymer incorporated with an electrically conductive material. The PCBs may be composted to degrade the PCBs, and the

PRINTED WIRING LINE, ELECTRONIC DEVICE, TOUCH PANEL, GRAVURE PLATE, PRINTED WIRING LINE FORMATION METHOD, TOUCH PANEL PRODUCTION METHOD, AND ELECTRONIC DEVICE PRODUCTION METHOD

A printed wiring line formed on a substrate connects two different points on the substrate which are connectable by another printed wiring line with a shape of a straight-line segment and has a shape corresponding to at least one of: 1) a shape with no linear part parallel to the straight-line segment; 2) a shape with line segments connected in series, each line segment having a shape with no linear part parallel to the straight-line segment; 3) a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment, length of the part parallel to the straight-line segment being not more than length of the straight-line segment; and 4) a shape in which line segments are connected in series, each line segment having a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment. 1. A printed wiring line formed on a substrate , whereinthe printed wiring line connects two different points on the substrate which are connectable by another printed wiring line with a shape of a straight-line segment and has a shape corresponding to at least one of:1) a shape with no linear part parallel to the straight-line segment;2) a shape in which line segments are connected in series, each line segment having a shape with no linear part parallel to the straight-line segment;3) a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment, length of the part parallel to the straight-line segment being not more than half of length of the straight-line segment; and4) a shape in which line segments are connected in series, each line segment having a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment.2. Printed wiring lines comprising:at least two printed wiring lines formed parallel to each other on a substrate, whereinthe at least two printed wiring lines each have a same shape, 1) a ...

WIRING STRUCTURE AND MANUFACTURING METHOD THEREOF

A wiring structure includes a substrate, a convexoconcave absorption layer including a convexoconcave portion on the substrate, a conductive layer pattern on at least a concave portion of the convexoconcave absorption layer, and an insulating layer pattern over the conductive layer pattern and the convexoconcave absorption layer, on at least the concave portion. This configuration provides a wiring structure and a manufacturing method thereof which enable to form fine multilayer wiring using microcontact printing or the like. 1. A wiring structure , comprising:a substrate;a convexoconcave absorption layer including a convexoconcave portion on the substrate;a conductive layer pattern on at least a concave portion of the convexoconcave absorption layer; andan insulating layer pattern over the conductive layer pattern and the convexoconcave absorption layer, on at least the concave portion.2. The wiring structure according to claim 1 , wherein the convexoconcave absorption layer is a first thermosetting resin claim 1 , the insulating layer pattern is a second thermosetting resin claim 1 , and the conductive layer pattern is formed by metal particles.3. The wiring structure according to claim 2 , wherein a thermosetting temperature of the first thermosetting resin is higher than a thermosetting temperature of the second thermosetting resin and a sintering temperature of the metal particles.4. The wiring structure according to claim 2 , wherein the first thermosetting resin is an epoxy resin.5. The wiring structure according to claim 1 , wherein the convexoconcave absorption layer is a thermoplastic resin.6. A method for manufacturing a wiring structure claim 1 , comprising:forming a convexoconcave absorption layer on a substrate;forming a conductive layer pattern on the convexoconcave absorption layer;forming an insulating layer pattern on the convexoconcave absorption layer and on the conductive layer pattern;pushing the insulating layer pattern and the conductive ...

PRINTING PLATE, LAMINATED CERAMIC ELECTRONIC COMPONENT PRODUCING METHOD, AND PRINTER

A print pattern of a printing plate used in intaglio printing includes plural partition walls and a groove-shaped cell unit. The plural partition walls are continuously extended in a printing direction, and arranged at predetermined intervals in an orthogonal direction. The cell unit is formed between the partition walls adjacent to each other, and a printing paste (conductive paste) is retained in the cell unit. Plural printing direction walls that are arranged in a zigzag manner in the printing direction are coupled to each other by a coupling walls that are arranged in the printing direction walls adjacent to each other in the printing direction, thereby forming the partition wall. 1. A printing plate for intaglio printing that obtains a predetermined graphic pattern by printing a printing paste on an article to be printed , said printing plate comprisinga plurality of print patterns corresponding to a graphic pattern to be printed being formed in a surface of a plate material,a predetermined direction along the surface of the plate material being configured to correspond to a printing direction of the article to be printed, andeach of the plurality of print patterns including a plurality of partition walls and a groove-shaped cell unit, and each of the plurality of partition walls including a plurality of printing direction walls and a coupling wall,the plurality of partition walls being arranged at predetermined intervals in a direction orthogonal to the printing direction,the plurality of printing direction walls being arranged in a zigzag manner in the printing direction,the coupling wall being arranged so as to couple the printing direction walls adjacent to each other in the printing direction,the groove-shaped cell unit in which the printing paste is to be retained being provided between the partition walls adjacent to each other.2. The printing plate according to claim 1 , wherein the plurality of printing direction walls are arranged parallel to each ...

SCALABLE, PRINTABLE, PATTERNED SHEET OF HIGH MOBILITY GRAPHENE ON FLEXIBLE SUBSTRATES

The present invention provides methods for fabricating graphene workpieces. The present invention also provides for products produced by the methods of the present invention and for apparatuses used to perform the methods of the present invention. 1. A method of forming a workpiece , the method comprising:growing pristine monolayer or few-layer continuous graphene on a catalytic film to form a graphene/catalytic film bilayer;disposing a first layer of material on top of the graphene surface in a predetermined pattern; andreleasing the graphene from the catalytic film so that the graphene is in the form of the patterned layer.2. The method of claim 1 , wherein the growing pristine monolayer continuous graphene on a catalytic film is performed by chemical vapor deposition at either atmospheric or low pressure.3. The method of claim 1 , wherein the disposing a first layer of material on top of the graphene surface is performed by printing on the surface of the graphene surface with a laser printer.4. The method of claim 1 , wherein the disposing a first layer of material on top of the graphene surface is performed by printing on the surface of the graphene surface with an inkjet printer with a polymer ink.5. The method of claim 1 , wherein the disposing a patterned first layer of material on top of the graphene surface is performed by screen printing claim 1 , flexography claim 1 , gravure claim 1 , offset lithography claim 1 , nanoimprint lithography claim 1 , or any combination thereof.6. The method of claim 1 , wherein the disposing a first layer of material on top of the graphene surface is performed by selective sintering of material in a 3D printer.7. The method of claim 6 , wherein the selective sintering comprises one or more of selective heat sintering and selective laser sintering.8. The method of claim 1 , wherein the disposing a first layer of polymer on top of the graphene surface is performed by selectively depositing a liquid binding material in a powder ...

BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE

Provided is a manufacturing process for electronic circuit components such as bare dies, and packaged integrated chips, among others, where the surface of the electronic circuit component is at the same level as the associated substrate, the surface of the electronic circuit component holding connection pads. A gap exists between the electronic circuit component, and the end of an opening within the substrate. This gap is filled with a filler material, such as a bonding material. The bonding material also used to encapsulate or bond together the back side of the substrate and electronic circuit component. During the manufacturing process, the front surface of the electronic circuit component (which includes the contact pads) and the front surface of the substrate which includes electronic circuitry are held in an adhesive relationship by a flat material having an upper surface which includes adhesive or sticky material (such as PDMS). Once the flat material is removed the planar flat or level upper surface can readily accept the formation of conductive traces by the use of inkjet printing or other technologies. 1. A method of forming a hybrid electronic assembly comprising:providing a substrate having a first surface and second surface opposite the first surface, the first surface including conductive circuit tracings, the substrate having height, width, and length dimensions;identifying at least one location on the first surface of the substrate to form at least one opening through the substrate;performing a material removal operation at the identified at least one location, to create the at least one opening in the substrate at the at least one identified location;attaching an article with a sticking surface on a first flat or planar side over the at least one opening and the at least part of the substrate on the first surface side of the substrate;placing an electronic circuit component into the at least one opening at an orientation which has the first surface ...

METHOD FOR MANUFACTURING TRANSPARENT ELECTRODE, TRANSPARENT ELECTRODE, AND ORGANIC ELECTRONIC DEVICE

A method for forming a transparent electrode includes a step of forming a thin metal wire on a transparent substrate; and a step of forming a transparent conductive layer on the transparent substrate and the thin metal wire. The step of forming the transparent conductive layer is a step of forming the transparent conductive layer by applying an application liquid onto the transparent substrate and the thin metal wire by printing. The application liquid is composed of a conductive polymer, a water-soluble binder having a structural unit represented by the following general formula (I), a polar solvent having a log P value of −1.50 to −0.45, and 5.0 to 25 mass % of a glycol ether. 2. The transparent electrode manufacturing method according to claim 1 , wherein the polar solvent is a propylene glycol or a dimethyl sulfoxide.3. The transparent electrode manufacturing method according to claim 2 , wherein the glycol ether is an ethylene glycol monoalkyl ether or a propylene glycol monoalkyl ether.4. The transparent electrode manufacturing method according to claim 1 , wherein a content of the polar solvent in the transparent conductive layer forming application liquid is 8.0 to 25 mass % in the total mass of the transparent conductive layer forming application liquid.5. The transparent electrode manufacturing method according to claim 1 , wherein the conductive polymer has a π-conjugated conductive polymer component A and a polyanion component B claim 1 , and a mass ratio (A:B) of a solid content of the π-conjugated conductive polymer component A to a solid content of the polyanion component B in the conductive polymer is 1:1 to 1:10.6. The transparent electrode manufacturing method according to claim 5 , wherein the polyanion component B constituting the conductive polymer has a fluorine atom.7. The transparent electrode manufacturing method according to claim 1 , wherein the printing used for forming the transparent conductive layer is inkjet printing.8. The ...

3D PRINTED SENSOR AND CUSHIONING MATERIAL

Methods, apparatus, systems and articles of manufacture are disclosed relating to 3D-printed structures. An example 3D-printed structure includes a first conductive substrate, a second conductive substrate and a dielectric structure between the first conductive substrate and the second conductive substrate, the dielectric structure including a latticed structure having a first stiffness in a first direction and a second stiffness in a second direction different than the first direction. 1. A 3D-printed structure , comprising:a first conductive substrate;a second conductive substrate; anda dielectric structure between the first conductive substrate and the second conductive substrate, the dielectric structure including first and second latticed structures, the first and second latticed structures having a first stiffness in a first direction and a second stiffness in a second direction different than the first direction, the first latticed structure including a first plurality of legs extending inwardly at a first bend angle, the second latticed structure including a second plurality of legs extending inwardly at a second bend angle different from the first bend angle.2. The 3D-printed structure of claim 1 , wherein the first latticed structure includes a plurality of first unit cells having a first structure.3. The 3D-printed structure of claim 2 , wherein the second latticed structure includes a plurality of second unit cells having a second structure different than the first structure.4. The 3D-printed structure of claim 3 , wherein at least one of the first latticed structure or the second latticed structure is an auxetic structure having a negative Poisson ratio.5. The 3D-printed structure of claim 3 , wherein the first latticed structure and the second latticed structure arc auxetic structures claim 3 , each having a negative Poisson ratio.6. The 3D-printed structure of claim 5 , wherein at least one of the first conductive substrate claim 5 , the second ...

Scalable, Printable, Patterned Sheet Of High Mobility Graphene On Flexible Substrates

The present invention provides methods for fabricating graphene workpieces. The present invention also provides for products produced by the methods of the present invention and for apparatuses used to perform the methods of the present invention. 1. A patterned structure comprising:a patterned layer; anda graphene layer coupled to the patterned layer and separated from a substrate according to a pattern of the patterned layer.2. The patterned structure of claim 1 , wherein the patterned layer provides support for the graphene layer that is separated from the substrate.3. The patterned structure of claim 1 , wherein the separated graphene layer has the same pattern as the patterned layer.4. The patterned structure of claim 1 , wherein the patterned structure is a free-standing structure that is separated from the substrate.5. The patterned structure of claim 1 , wherein the patterned structure is configured to be coupled to a base substrate. This application is a continuation of U.S. patent application Ser. No. 16/752,421, filed Jan. 24, 2020; which is a continuation of U.S. patent application Ser. No. 16/214,601, filed Dec. 10, 2018; which is a continuation of U.S. patent application Ser. No. 15/850,046, filed Dec. 21, 2017 (now U.S. Pat. No. 10,165,679, issued Dec. 25, 2018); which is a continuation of U.S. patent application Ser. No. 15/305,167, filed Oct. 19, 2016 (now U.S. Pat. No. 9,930,777, issued Mar. 27, 2018); which is a National Stage Application of International Patent Application No. PCT/US2015/027193, filed Apr. 23, 2015; which claims the benefit of and priority to U.S. Patent Application No. 61/983,014, filed Apr. 23, 2014. The disclosures of the foregoing applications are incorporated herein by reference in their entireties for any and all purposes.This invention was made with government support under Contract No. DMR08-32802 awarded by the Nano/Bio Interface NSF NSEC. The government has certain rights in the invention.The disclosed invention is ...

CONDUCTIVE SUBSTRATE COMPRISING CONDUCTIVE PATTERN AND TOUCH PANEL COMPRISING SAME

The present invention relates to a conductive substrate comprising a conductive pattern having an improved concealment property and a touch panel comprising the same, and the conductive substrate according to the present invention comprises: a transparent substrate, and a conductive pattern comprising a conductive line provided on the transparent substrate, wherein the conductive pattern comprises two or more conductive lines spaced from each other in a longitudinal direction of the conductive line, and a distance between nearest-adjacent ends of two or more conductive lines spaced from each other is 15 μm or less. The conductive substrate according to the present invention can more efficiently conceal a metal line comprised in the conductive pattern. 1. A conductive substrate comprising:a transparent substrate, anda conductive pattern comprising a conductive line provided on the transparent substrate,wherein the conductive pattern comprises two or more conductive lines spaced from each other in a longitudinal direction of the conductive line, and a distance between nearest-adjacent ends of two or more conductive lines spaced from each other is 15 μm or less.2. The conductive substrate of claim 1 , wherein the distance between the nearest-adjacent ends of two or more conductive lines spaced from each other is 10 μm or less.3. The conductive substrate of claim 1 , wherein the distance between the nearest-adjacent ends of two or more conductive lines spaced from each other is 5 μm or less.4. The conductive substrate of claim 1 , comprising:a line breakage portion performing breakage at an angle of 80 to 110° in the longitudinal direction of at least one conductive line constituting the conductive pattern.5. The conductive substrate of claim 1 , wherein the conductive pattern comprises one or more selected from the group consisting of metal claim 1 , metal oxides claim 1 , metal nitrides claim 1 , metal oxynitrides claim 1 , and a metal alloy.6. The conductive ...

TOUCH SCREEN PANEL AND METHOD FOR MANUFACTURING SAME

A one glass solution touch screen panel includes a substrate, a shielding layer, an indium tin oxide film layer, a soft circuit board, an infiltrate layer, and a plurality of conducting connectors. The shielding layer is formed on a first portion of the substrate. The indium tin oxide film layer is formed on a second portion of the substrate and has a plurality of indium tin oxide film connecting portions. The soft circuit board is formed on the shielding layer. The infiltrate layer is formed on the connecting portions and defines a plurality of infiltrate gaps within the infiltrate layer. The conducting connectors are formed on the infiltrate layer. The conducting connectors are electrically connected to the soft circuit board. The conducting connectors extend into the infiltrate layer substantially filling a substantial portion of the plurality of infiltrate gaps and electrically connecting to the connecting portions. 1. A one glass solution touch screen panel comprising:a substrate with a top surface;a shielding layer formed on a first portion of the substrate, and having a top shielding layer surface opposite to and substantially parallel to the substrate top surface;an indium tin oxide film layer formed on a second portion of the substrate top surface, the indium tin oxide film layer having a top indium tin oxide film surface opposite to, and substantially parallel to the substrate, and including a plurality of indium tin oxide film connecting portions;a soft circuit board formed on a portion of the top shielding layer surface;an infiltrate layer formed on a portion of the top indium tin oxide film surface of the plurality of indium tin oxide connecting portions and on a portion of the top shielding layer surface, the infiltrate layer having a top infiltrate layer surface opposite to, and substantially parallel to, the top indium tin oxide film surface, and defining a plurality of infiltrate gaps within the infiltrate layer; anda plurality of conducting ...

COLLOID ELECTROLYTE COMPOSITION

The invention relates to a colloidal electrolyte composition comprising a polyelectrolyte selected from one or more cationic polymers, a particulate phase forming a colloidal dispersion, and a binder system able to form a cross-linked network upon curing the electrolyte composition. Also, the invention relates to a method of preparation the colloidal electrolyte composition, to an electrochemical cell and to a method of preparation the electrochemical cell. 1. An electrolyte composition in form of a colloidal dispersion comprising:a) polyelectrolyte selected from one or more cationic polymers being quaternized nitrogen containing compounds selected from the group consisting of copolymer having quaternized vinylimidazolium repeating units and poly(diallyldimethyl ammonium chloride) or copolymers thereof;b) a particulate phase comprising solid particles having a diameter of between 1 to 10000 nm and being inert to the other components included in the electrolyte composition; andc) a binder system comprising binder molecules able to form a polymeric network upon radical polymerization, and initiator molecules able to initiate radical polymerization of the binder molecules, said binder molecules being polyfunctional and monofunctional acrylates or methacrylates, or being di- or polyfunctional thiols and molecules having double bonds;wherein said polyelectrolyte is substantially absent of groups that are readily polymerizable under conditions of radical polymerization.2. An electrolyte composition according to claim 1 , wherein the polyelectrolyte is poly[(3-methyl-1-vinylimidazolium chloride)-co-(1-vinylpyrrolidone)].3. An electrolyte composition according to claim 1 , wherein the polyelectrolyte is poly(diallyldimethylammonium chloride) claim 1 , or copolymer thereof.4. An electrolyte composition according to claim 1 , wherein the polyelectrolyte has a molecular weight (Mw) of lower than 100000.5. An electrolyte composition according claim 1 , wherein the binder system ...

Thermally Conductive Circuit Board Substrate and Method of Manufacture

A thermally conductive efficient substrate for use in an electrical circuit board assembly (ECBA) preferably having at least one LED component. The substrate is constructed of a thermally conductive efficient material such that the substrate functions both as a substrate and as a heat sink for the PCB. The substrate allows a PCB to function without a dedicated auxiliary heat sink. The substrate preferably includes a plurality of raised pads formed such that open channels are formed therebetween, and such that the upper surfaces of the pads are preferably substantially coplanar. Such intra-pad channels facilitate heat transfer and cooling of the substrate and the ECBA. 1. An ECBA having a thermally conductive efficient substrate wherein said substrate functions as both a substrate and a heat sink for said ECBA , and wherein said ECBA does not include an auxiliary dedicated heat sink.2. The substrate of claim 1 , wherein said substrate is formed from a plastic composition having at least one of metal particles and carbon particles interspersed therein.3. The substrate of claim 1 , wherein said substrate is formed from Alumide.4. The substrate of claim 1 , wherein said substrate includes at least one of a plurality of fins protruding therefrom and adapted so as to radiate heat and cool said ECBA claim 1 , and at least one tech pocket.5. The substrate of claim 1 , wherein said substrate has a thermal conductivity value of at least 1 watt per meter kelvin.6. The substrate of claim 1 , wherein said substrate is manufactured via an additive manufacturing process.7. The substrate of claim 1 , wherein said additive manufacturing process defines at least one of 3D printing and selective laser sintering.8. A thermally conductive efficient ECBA substrate formed from a composition having at least one of metal particles and carbon particles interspersed therein.9. The substrate of claim 8 , wherein said substrate is formed from Alumide.10. The substrate of claim 8 , wherein said ...

Touch substrate, method of manufacturing the same and display device having the same

A touch substrate includes a base substrate, a common electrode and a wire electrode. The base substrate has a plurality of common electrode areas. A common electrode is disposed in each of the common electrode areas. The common electrode has a plurality of first electrode lines extended in a first direction and arranged in a second direction crossing the first direction and a plurality of second electrode lines arranged in the first direction. The wire electrode is connected to an end of the common electrode to apply a voltage to the common electrode. The common electrode and the wire electrode are simultaneously formed through a same process using a printing substrate.

MANUFACTURING OF HIGH RESOLUTION CONDUCTIVE PATTERNS USING ORGANOMETALLIC INK AND BANDED ANILOX ROLLS

Disclosed herein are systems methods for using ink comprising organometallics in a flexographic printing process using engraved anilox rolls to transfer ink to an impression roll that prints a pattern on a substrate. A banded anilox roll with more than one geometry and/or volume of cells may be used in these production systems and methods. The pattern printed may comprise a plurality of lines which are each from 1 micrometer-25 micrometers wide and may be part of an electronics application such as a touch screen sensor or an RF antenna that requires microscopic conductive patterns such as touch screen displays or antennas. 1. A method of making a touch sensor comprising:flexographically printing a first pattern on a first substrate by a transferring ink from an ink source by a first anilox roll to a first flexomaster; and wherein the first pattern comprises a first plurality of lines and the second pattern comprises a second plurality of lines, wherein the first plurality of lines and the second plurality of lines are formed from an ink comprising 1 wt %-20 wt % organometallics and at least one solvent, wherein the ink viscosity is from 200 cps-20000 cps,', 'wherein printing comprises transferring the ink from an ink source by a first anilox roll to the first flexomaster and from the ink source by a second anilox roll to the second flexomaster, and wherein each line of the plurality of lines is between 1-25 micrometers wide;', 'wherein at least one of the first anilox roll and the second is a banded anilox roll, wherein the at least one banded anilox roll comprises a plurality of sections, wherein each section comprises a volume and a cell shape, and wherein at least two sections of the plurality of sections comprise at least one of different cell shapes or different volumes; and, 'flexographically printing a second pattern on a second substrate by a transferring ink from the ink source by a second anilox roll to a second flexomaster;'}plating the first and the ...

TRANSFER PRINTING PAPER AND MANUFACTURING METHOD OF SMART FABRIC

A transfer printing paper is provided. The transfer printing paper includes a release layer and a conductive layer. The conductive layer is formed on the release layer and is suitable for being transferred to a flexible material layer. After being transferred to the flexible material layer, the conductive layer is configured to be electrically in contact with a wearer wearing the flexible material layer, so as to conduct a physiological signal of the wearer. 1. A transfer printing paper , comprising:a release layer; anda conductive layer formed on the release layer and suitable for being transferred to a flexible material layer, wherein the conductive layer is configured to be electrically in contact with a wearer wearing the flexible material layer after the conductive layer is transferred to the flexible material layer, so as to conduct a physiological signal of the wearer.2. The transfer printing paper as claimed in claim 1 , wherein the transfer printing paper is a thermal transfer printing paper.3. The transfer printing paper as claimed in claim 1 , wherein the conductive layer comprises a conductive ink having extensibility.4. The transfer printing paper as claimed in claim 3 , wherein the conductive ink having extensibility further comprises hydrophilic synthetic resin or hydrophilic solvent.5. The transfer printing paper as claimed in claim 1 , wherein the conductive layer is in direct contact with the wearer wearing the flexible material layer.6. The transfer printing paper as claimed in claim 1 , further comprising a first protection layer claim 1 , wherein the first protection layer is disposed between the release layer and the conductive layer claim 1 , and the first protection layer is in direct contact with the wearer wearing the flexible material layer.7. The transfer printing paper as claimed in claim 6 , wherein the first protection layer has conductivity and washability.8. The transfer printing paper as claimed in claim 1 , further comprising a ...

CONDUCTIVE METAL INK COMPOSITION AND METHOD FOR FORMING A CONDUCTIVE PATTERN

The present invention relates to a conductive metal ink composition which is properly applied for roll-printing process to form conductive pattern with improved conductivity, and the method of preparing a conductive pattern using the same. The conductive metal ink composition comprises a conductive metal powder; an organic silver complex where an organic ligand including amine group and hydroxyl group binds with a silver (Ag) salt of aliphatic carboxylic acid; a non-aqueous solvent comprising a first non-aqueous solvent having a vapor pressure of torr or lower at C. and a second non-aqueous solvent having a vapor pressure of higher than torr at C.; and a coatability improving polymer. 113-. (canceled)14. A method for forming a conductive pattern , comprising the steps of:coating a conductive metal ink composition on a roller;forming a pattern of the ink composition corresponding to the conductive pattern on the roller, by contacting the roller with a cliché which has intaglio pattern corresponding to the conductive pattern;transferring the pattern of the ink composition on the roller onto a substrate; andsintering the transferred pattern on the substrate, a conductive metal powder;', 'an organic silver complex where an organic ligand including amine group and hydroxyl group binds with a silver (Ag) salt of aliphatic carboxylic acid;', 'a non-aqueous solvent comprising a first non-aqueous solvent having a vapor pressure of 3 torr or lower at 25° C. and a second non-aqueous solvent having a vapor pressure of higher than 3 torr at 25° C.; and', 'a coatability improving polymer., 'wherein the conductive metal ink composition comprises15. The method for forming a conductive pattern of claim 14 , wherein the conductive pattern is an electrode pattern of flat panel display device. The present invention provides a conductive metal ink composition and a method for forming a conductive pattern. More specifically, the present invention provides the conductive metal ink ...

A FABRICATING METHOD OF PATTERN

Provided is a fabricating method of a pattern, which includes preparing a first substrate having a first width and a first thickness, stretching the first substrate and preparing a second substrate having a second width and a second thickness, forming a base layer made of a material of a pattern which will be formed on the second substrate, removing a predetermined region of the base layer and forming a first pattern having a first line width and a first height on the second substrate, and removing a tensile force applied to the second substrate to restore the second substrate back to being the first substrate and forming a second pattern having a second line width and a second height on the first substrate. Fineness of a line width can be achieved by forming the first pattern in a state in which the substrate is stretched, contracting a line width of the first pattern while restoring the stretched substrate, and forming the second pattern having a contracted line width on the restored substrate such that high integration can be achieved. 1. A fabricating method of a pattern , comprising:preparing a first substrate having a first width and a first thickness;stretching the first substrate and preparing a second substrate having a second width and a second thickness;forming a base layer made of a material of a pattern which is to be formed on the second substrate;removing a predetermined region of the base layer and forming a first pattern having a first line width and a first height on the second substrate; andremoving a tensile force applied to the second substrate to restore the second substrate back to being the first substrate and forming a second pattern having a second line width and a second height on the first substrate.2. The fabricating method of claim 1 , further comprising transferring the second pattern onto a base member.3. The fabricating method of claim 1 , wherein the stretching of the first substrate includes stretching the first substrate in a ...

Printing method using two lasers

The invention relates to a laser printing method that includes the following steps: (a) the provision of a receiver substrate ( 4 ); (b) the provision of a target substrate ( 5 ) comprising a transparent substrate ( 50 ) one surface of which has a coating has a coating ( 51 ) constituted of a solid metal film; (c) the localised irradiation of the said film ( 51 ) through the said transparent substrate ( 50 ) by means of a first laser ( 6 ) in order to reach the melting temperature of the metal in a target zone of the said film which is in liquid form; (d) the irradiation of the said liquid film through the said transparent substrate by means of a second laser on the said target zone defined in the step (c), in order to form a liquid jet in the said target zone and bring about the ejection thereof from the substrate in the form of molten metal; (e) the depositing on the receiver substrate of a molten metal drop over a defined receiving zone, with the said drop solidifying upon cooling.

Electronic Device, Method and Apparatus for Producing an Electronic Device, and Composition Therefor

An electronic device, a method and apparatus for producing an electronic device, and a composition therefor are disclosed. An adhesive material is applied in a first pattern on a surface of a receiver substrate. A carrier having a metal foil disposed thereon is brought into contact with the first substrate such that a portion of the metal foil contacts the adhesive material. The adhesive material includes a first polymer, a second polymer, and a conductive carbon black dispersion, and is activated using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material. The first substrate and the second substrate are separated, whereby the portion of the metal foil is transferred to the first substrate. The adhesive is electrically conductive to maximize the possibility of maintaining electrical connectivity even when there is a break in the metal foil. 1. A method of producing an electronic device including the steps of:applying an adhesive material in a first pattern on a surface of a first substrate, wherein the adhesive material is electrically conductive; andapplying a metal on top of the adhesive material to secure the metal to the first substrate, wherein the metal comprises a conductive trace of an electronic circuit.2. The method of claim 1 , wherein the step of applying the metal comprises:bringing a second substrate having a metal foil disposed thereon into contact with the first substrate such that a portion of the metal foil contacts the adhesive material;activating the adhesive material using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material; andseparating the first substrate and the second substrate, whereby the portion of the metal foil is transferred from the second substrate to the first substrate.3. The method of claim 1 , wherein the adhesive material comprises a conductive carbon black and two or more polymers claim 1 , ...

CIRCUIT BOARD STRUCTURE

A circuit board structure includes a multi-layer board, a conductive body, and an electroplated layer. The multi-layer board has a predetermined conductive layer embedded therein, and includes a first blind hole recessed in a board surface thereof so as to allow a part of the predetermined conductive layer to be exposed therefrom. The first blind hole has an aperture having a diameter within a range of 0.15-0.5 mm, and has an aspect ratio defined as M that is within a range of 1.5-10. The conductive body is filled in the first blind hole and is electrically coupled to the part of the predetermined conductive layer. An inner surface of the conductive body defines a second blind hole having an aspect ratio that is larger than 0 and is less than M. The electroplated layer is formed in the second blind hole and is connected to the inner surface. 1. A circuit board structure , comprising:a multi-layer board having a predetermined conductive layer embedded therein, wherein the multi-layer board includes a first blind hole recessed in a board surface thereof so as to allow a part of the predetermined conductive layer to be exposed therefrom, the first blind hole has an aperture having a diameter that is within a range of 0.15-0.5 mm, and the first blind hole has an aspect ratio defined as M that is within a range of 1.5-10;a hardened conductive paste filled in the first blind hole and electrically coupled to the part of the predetermined conductive layer exposed from the first blind hole, wherein an inner surface of the hardened conductive paste defines a second blind hole having an aspect ratio that is less than N, and N is larger than 0 and is less than M; andan electroplated layer formed in the second blind hole and connected to the inner surface of the hardened conductive paste.2. The circuit board structure according to claim 1 , wherein the multi-layer board has a modification layer formed on an inner wall defining the first blind hole claim 1 , and the modification ...

APPARATUS AND METHOD FOR PROVIDING AN EMBEDDED STRUCTURE AND FOR PROVIDING AN ELECTRO-OPTICAL DEVICE INCLUDING THE SAME

An apparatus for providing a patterned structure includes a deposition facility for depositing an electrically conductive material on a cylindrical surface of a transfer roll, a supply facility for providing a flexible substrate with a carrier layer, a press-roll for pressing the flexible substrate with the carrier layer against the surface of the transfer roll, the press-roll being positioned in the rotation direction of the transfer roll with respect to a position where the first deposition facility deposits the substance on the transfer roll, and being arranged for embedding the deposited substance in said carrier layer, wherein the adhesion between the printed substance and the cylindrical surface of the transfer roll is less than the adhesion between the printed substance and said carrier layer, a transport facility for releasing the flexible substrate with the carrier layer embedding the substance as the patterned structure from the transfer roll. 1. Apparatus for providing an electrically conductive structure (ECS) comprising{'b': 10', '22', '20', '24, 'a first deposition facility () for depositing a substance) or a precursor thereof in a patterned way on a cylindrical surface () of a transfer roll () having a rotation direction (),'}{'b': 40', '20, 'a supply facility () for providing a flexible substrate (FS) with a carrier layer (CM) towards the transfer roll (),'}{'b': 42', '20', '42', '24', '10', '22', '20, 'a press-roll () for pressing the flexible substrate (FS) with the carrier layer (CM) against the cylindrical surface of the transfer roll (), the press-roll () being positioned in the rotation direction () of the transfer roll with respect to a position where the first deposition facility () deposits the substance on the transfer roll, and being arranged for embedding the deposited substance (ECM) in said carrier layer (CM), wherein an adhesion between the printed substance (ECM) and the cylindrical surface () of the transfer roll () is less than an ...

Scalable, Printable, Patterned Sheet Of High Mobility Graphene On Flexible Substrates

The present invention provides methods for fabricating graphene workpieces. The present invention also provides for products produced by the methods of the present invention and for apparatuses used to perform the methods of the present invention. 1. A patterned structure comprising:a patterned layer; anda graphene layer coupled to the patterned layer and separated from a substrate according to a pattern of the patterned layer.2. The patterned structure of claim 1 , wherein the patterned layer provides support for the graphene layer that is separated from the substrate.3. The patterned structure of claim 1 , wherein the separated graphene layer has the same pattern as the patterned layer.4. The patterned structure of claim 1 , wherein the patterned structure is a free-standing structure that is separated from the substrate.5. The patterned structure of claim 1 , wherein the patterned structure is configured to be coupled to a base substrate. This application is a continuation application of U.S. patent application Ser. No. 15/850,046, filed Dec. 21, 2017, which is a continuation application of U.S. patent application Ser. No. 15/305,167, filed Oct. 19, 2016, now U.S. Pat. No. 9,930,777, issued Mar. 27, 2018 which is a National Stage Application of International Patent Application No. PCT/US2015/027193, filed Apr. 23, 2015, which claims benefit of U.S. Patent Application No. 61/983,014, filed Apr. 23, 2014, the disclosures of which are both incorporated herein by reference in their entirety.This invention was made with government support under Contract No. DMR08-32802 awarded by the Nano/Bio Interface NSF NSEC. The government has certain rights in the invention.The disclosed invention is directed toward the fields of graphene workpieces and of manufacturing methods thereof.The present application generally relates to methods and apparatus for transfer of films from one or more substrates to another, where the film to be transferred is patterned during the transfer ...

METHOD OF FORMING AN ELECTRONIC DEVICE ON A FLEXIBLE SUBSTRATE

A method of forming an electronic device on a flexible substrate without using acetone dissolvent, including the steps of: printing a hydrophobic mask on a porous membrane to form a pattern thereon which is complementary to a desired pattern; filtering an aqueous suspension of an electronic material through the non-printed region of the porous membrane, whereby some electronic material is deposited on said non-printed region following the desired pattern; pressing the flexible substrate against the printed face of the membrane in order to transfer the patterned electronic material deposited on the porous membrane to the flexible substrate to form the electronic device thereon. 2. The method according to claim 1 , wherein the electronic material is graphene oxide.3. The method according claim 1 , wherein the porous membrane is made of nitrocellulose claim 1 , a pore size thereof being between 0.01 μm and 0.3 μm.4. The method according to claim 1 , wherein the printing material of the hydrophobic mask is wax.5. The method according to claim 1 , wherein the flexible substrate is organic.6. The method according to claim 5 , wherein the flexible substrate is polyethylene terephthalate (PET).7. The method according to claim 1 , wherein the pressing step is performed with a press.8. The method according to claim 7 , wherein the pressing step uses a pressing force of between 500 kg and 700 kg.9. The method according to claim 8 , wherein the press actuates through a stamp to which the flexible substrate is adhered.10. The method according to claim 1 , wherein the flexible substrate is a sheet.11. The method according to claim 10 , wherein the transfer step is performed with roll-to-roll hardware.12. The method according to claim 11 , wherein a printer for printing the hydrophobic mask is integrated with the roll-to-roll hardware.13. The method according to claim 1 , wherein the electronic device is an interdigitated electrode.14. The method according to claim 1 , wherein the ...

Selective deposition of magnetic particles and using magnetic material as a carrier medium to deposit nanoparticles

Selective deposition of magnetic material such as particles, and producing a pre-laminated stack of shielding layers for offsetting attenuation of RF caused by a metal face plate of a smart card (or tag) or a metallized layer near a passive transponder. Coated or uncoated magnetic particles of different sizes may be used to increase the packing density of the material after its deposition on a substrate. Magnetography-based techniques may be used to apply the particles, at high packing density, including different-sized particles to a substrate such as PVC. Magnetic particles may be used as a carrier medium to deposit other particles nanoparticles. A system for selective deposition is disclosed.

MICROELECTRONIC PACKAGE WITH SUBSTRATE-INTEGRATED COMPONENTS

Embodiments may relate to a microelectronic package or a die thereof which includes a die, logic, or subsystem coupled with a face of the substrate. An inductor may be positioned in the substrate. Electromagnetic interference (EMI) shield elements may be positioned within the substrate and surrounding the inductor. Other embodiments may be described or claimed. 1. A microelectronic package comprising:a substrate with a plurality of layers;a die coupled with a face of the substrate;an inductor positioned in the substrate and within a die shadow of the die; andelectromagnetic interference (EMI) shield elements positioned within the substrate and surrounding the inductor.2. The microelectronic package of claim 1 , wherein the inductor includes a metal element positioned in two layers of the substrate.3. The microelectronic package of claim 1 , wherein the inductor includes a conductive element in a first layer of the package substrate claim 1 , a conductive element in a second layer of the package substrate claim 1 , and a conductive element in a third layer of the package substrate claim 1 , and wherein the conductive elements of the first layer and the second layer are electronically coupled by a trench via.4. The microelectronic package of claim 1 , wherein the EMI shield elements include a through-substrate via (TSV) within the substrate.5. The microelectronic package of claim 1 , wherein the EMI shield elements further surround the die.6. The microelectronic package of claim 1 , wherein the die is a power amplifier (PA) or an acoustic wave resonator (AWR).7. The microelectronic package of claim 1 , wherein the plurality of layers includes a first subset of layers wherein respective layers of the first subset of layers has a first z-height claim 1 , and the plurality of layers includes a second subset of layers wherein respective layers of the second subset of layers has a second z-height.8. The microelectronic package of claim 1 , wherein the microelectronic ...

TOUCH PANEL AND TOUCH PANEL PRODUCTION METHOD

A touch panel comprises, a substrate, a layered structure formed in a sensing region defined on one side of the substrate, the layered structure including at least a first conductor layer made of a first hardened conductive ink, a second conductor layer made of a second hardened conductive ink and an insulating layer disposed therebetween, and an external connection terminal formed outside the sensing region on the one side of the substrate, wherein the external connection terminal comprises a first terminal layer made of the first hardened conductive ink and a second terminal layer made of the second hardened conductive ink, such that the first terminal layer and the second terminal layer are directly overlaid on each other. 1. A touch panel comprising:a substrate;a layered structure formed in a sensing region defined on one side of the substrate, the layered structure including at least a first conductor layer made of a first hardened conductive ink, a second conductor layer made of a second hardened conductive ink and an insulating layer disposed therebetween; andan external connection terminal formed outside the sensing region on the one side of the substrate;wherein the external connection terminal comprises a first terminal layer made of the first hardened conductive ink and a second terminal layer made of the second hardened conductive ink, such that the first terminal layer and the second terminal layer are directly overlaid on each other.2. The touch panel according to claim 1 ,wherein the first terminal layer forms a first mesh of fine lines and the second terminal layer forms a second mesh of fine lines.3. The touch panel according to claim 2 ,wherein each of the first mesh of fine lines and the second mesh of fine lines has a grid pattern having a pair of periodicity directions and a pair of grid periods corresponding thereto, such that the first mesh of fine lines and the second mesh of fine lines are identical to each other in terms of the pair of ...

METHOD FOR FORMING INSULATING LAYER, METHOD FOR PRODUCING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE

By flexographic printing or inkjet printing, insulating ink is applied on a wiring pattern in accordance with a predetermined printing pattern. The insulating ink is hardened, whereby an insulating layer is formed. A contact region of the wiring pattern that is used for electrical connection with a conductor other than the wiring pattern is not covered with the insulating layer. The printing pattern is delimited by the outline of a non-printing region including the contact region. The wiring pattern includes, in the non-printing region, a trunk wiring line leading, to the contact region, from a position on the wiring pattern at which the wiring pattern overlaps with the outline and a branch wiring line extending from a point on at least one side of the trunk wiring line and terminating without making contact with the outline. 1. An electronic device comprising:a wiring pattern formed on a base; andan insulating layer that covers the wiring pattern in such a way that a region that belongs to the wiring pattern and is used for electrical connection with a conductor other than the wiring pattern is exposed, the region hereinafter referred to as a contact region, wherein a trunk wiring line leading, to the contact region, from a position on the wiring pattern at which the wiring pattern overlaps with an outline of the non-covered region, and', 'a branch wiring line extending from a point on at least one side of the trunk wiring line, except for both ends of the trunk wiring line, and terminating without making contact with the outline., 'in a non-covered region including the contact region, the wiring pattern includes'}2. An electronic device comprising:a wiring pattern formed on a base; andan insulating layer that covers the wiring pattern in such a way that a region that belongs to the wiring pattern and is used for electrical connection with a conductor other than the wiring pattern is exposed, the region hereinafter referred to as a contact region, whereinin a non- ...

METHOD FOR MANUFACTURING CIRCUIT WIRING BY THREE-DIMENSIONAL ADDITIVE MANUFACTURING

In a case where a circuit wiring is formed on a resin member by three-dimensional additive manufacturing, a method for manufacturing the circuit wiring by three-dimensional additive manufacturing capable of suppressing swelling or cracking of the circuit wiring is provided. A method for manufacturing a circuit wiring by three-dimensional additive manufacturing includes a discharging step of discharging a fluid containing a metal particle onto a resin member formed of a resin material; and a circuit wiring forming step of forming a circuit wiring by heating the fluid containing the metal particle discharged onto the resin member at a heating temperature to be cured, and the heating being performed at the heating temperature based on a glass transition point of the resin material, a linear expansion coefficient of the resin material, and a room temperature. 1. A method for manufacturing a circuit wiring by three-dimensional additive manufacturing comprising:a discharging step of discharging a fluid containing a metal particle onto a resin member formed of a resin material; anda circuit wiring forming step of forming a circuit wiring by heating the fluid containing the metal particle discharged onto the resin member at a heating temperature to be cured, and the heating being performed at the heating temperature based on a glass transition point of the resin material, a linear expansion coefficient of the resin material, and a room temperature.2. The method for manufacturing a circuit wiring by three-dimensional additive manufacturing according to claim 1 , whereinthe resin material is a material having the glass transition point higher than the heating temperature, and {'br': None, '(heating temperature−room temperature)×first linear expansion coefficient Подробнее

BACKPLANE AND METHOD FOR PRODUCING SAME

A backplane is for electrically connecting electrical components. An embodiment is directed to the backplane and to a method for producing the same. An embodiment of the backplane includes a carrier plate, conductor tracks, which extend on and/or in the carrier plate, and at least one cooling element arranged on a conductor track for cooling the conductor track. 1. A backplane for electrically connecting electrical components , the backplane comprising:a carrier plateconductor tracks, each respective conductor track of the conductor tracks extending at least one of on the carrier plate and in the carrier plate; andat least one cooling element arranged on at least one conductor track, of the conductor tracks, for cooling the at least one conductor track.2. The backplane of claim 1 , wherein the at least one cooling element is a cooling channel for conducting a cooling fluid.3. The backplane of claim 2 , wherein the at least one cooling channel at least partially surrounds the at least one respective conductor tract.4. The backplane of claim 2 , wherein the at least one cooling channel is wound around the at least one respective conductor track.5. The backplane of claim 2 , wherein at least one cooling channel includes a main channel and secondary channels claim 2 , the secondary channels branching off from the main channel.6. The backplane of claim 5 , wherein the secondary channels extend around the at least one respective conductor track in a ring-like or finger-like manner.7. The backplane of claim 2 , wherein the at least one cooling channel includes at least two interconnected sub-channels claim 2 , the at least two interconnected sub-channels claim 2 , being configured such that cooling fluid flows in opposite directions through respective ones of the at least two interconnected sub-channels8. The backplane of claim 2 , wherein the at least one cooling channel is arranged on a plurality of the conductor tracks.9. The backplane of claim 2 , wherein the at least ...

METHOD FOR MANUFACTURING TOUCH PANEL

A method for manufacturing a touch panel having a sensing area that includes a conductive part made up of thin-line mesh includes a step of designing the thin-line mesh, the thin-line mesh including a plurality of intersections, wherein the intersection forms therearound an acute angular area and an obtuse angular area, the acute angular area being defined between a pair of adjacently converging thin lines that forms an acute angle therebetween, the obtuse angular area being defined between a pair of adjacently converging thin lines that forms an obtuse angle therebetween, a step of filling electrically conductive ink into a printing plate by a squeezing process using a doctor blade, the printing plate having a groove pattern that conforms with the thin-line mesh, and a step of forming the conductive part by printing, in which the electrically conductive ink is transferred to a surface of a base member. 1. A method for manufacturing a touch panel having a sensing area that includes a conductive part made up of thin-line mesh , the method comprising:a step of designing the thin-line mesh, the thin-line mesh including a plurality of intersections, such that a plurality of thin lines converge at the intersection,wherein the intersection forms therearound an acute angular area and an obtuse angular area, the acute angular area being defined between a pair of adjacently converging thin lines that forms an acute angle therebetween, the obtuse angular area being defined between a pair of adjacently converging thin lines that forms an obtuse angle therebetween;a step of filling electrically conductive ink into a printing plate by a squeezing process using a doctor blade, the printing plate having a groove pattern that conforms with the thin-line mesh,wherein the doctor blade is moved along a squeezing direction, such that an imaginary straight line that passes through the intersection in the thin-line mesh in a direction in accordance with the squeezing direction, passes ...

THREE-DIMENSIONAL PRINTER AND PRINTING METHOD FOR PRINTED CIRCUIT BOARD

A Three-dimensional (3D) printer includes a belt, a tray and a plurality of printing devices located on the belt. The tray is located on the belt and receives a printed circuit board (PCB). A sensor attached to the tray. The sensor is used to sense whether the PCB is located in the tray, when the PCB is located in the tray, the belt is driven by a driving device to transport the tray to be located below each of the plurality of printing devices. Each of the plurality of printing devices is used to print the PCB. The disclosure further offers a printing method for the PCB using the 3D printer. 1. A three-dimensional (3D) printer comprising:a belt;a tray located on the belt and configured to receive a printed circuit board (PCB);a sensor attached to the tray and configured to sense whether the PCB is located in the tray;a plurality of printing devices located on the belt;wherein when the PCB is located in the tray, the belt is driven by a driving device to transport the tray to be located below each of the plurality of printing devices, and each of the plurality of printing devices is configured to print the PCB.2. The 3D printer of claim 1 , wherein the plurality of printing devices comprises a punching device claim 1 , a line printing device claim 1 , a layer printing device claim 1 , a white text and marking device claim 1 , a tin printing device claim 1 , the punching device is configured to punch the PCB claim 1 , the line printing device is configured to print the line of the PCB claim 1 , the layer printing device is configured to print the green solder layer of the PCB claim 1 , the white text and marking device is configured to print white text and marking claim 1 , and the tin printing device is configured to tin the PCB.3. The 3D printer of claim 2 , wherein the line printing device is configured to print the PCB using a conductive adhesive or conductive ink.4. The 3D printer of claim 1 , wherein the plurality of printing devices comprises a feeding device ...

STRETCHABLE PRINTED ELECTRONIC SHEETS TO ELECTRICALLY CONNECT UNEVEN TWO DIMENSIONAL AND THREE DIMENSIONAL SURFACES

A method and apparatus for forming a conductor on an uneven two-dimensional (2-D) or three-dimensional (3-D) surface is described. An amount of conductive material needed to form a conductor between two points on a surface of an object is determined. The determined amount of conductive material is deposited on a substrate. The substrate with the deposited conductive material is applied to the object to form a conductor between the two points on the surface of the object. The conductive material and substrate may be stretchable. The conductive material may be deposited by an inkjet printer or an embedded 3-D printer. The substrate with the deposited conductive material may be applied to the object by laminating the substrate with the deposited conductive material to the object. 1. A method for forming a conductor on an uneven two-dimensional (2-D) or three-dimensional (3-D) surface , the method comprising:determining an amount of conductive material to form a conductor between two points on a surface of an object;depositing the determined amount of conductive material on a substrate; andapplying the substrate with the deposited conductive material to the object to form a conductor between the two points on the surface of the object.2. The method of claim 1 , wherein the conductive material is a stretchable conductive material.3. The method of claim 1 , wherein the substrate is a stretchable substrate.4. The method of claim 1 , wherein the conductive material is deposited on the substrate by an inkjet printer that prints conductive material onto the surface of the substrate.5. The method of claim 1 , wherein the conductive material is deposited on the substrate by an embedded three-dimensional (3-D) printer that deposits conductive material into a reservoir within the substrate.6. The method of claim 1 , wherein the conductive material is deposited in a horseshoe pattern on the substrate.7. The method of claim 1 , wherein the substrate with the deposited conductive ...

WIRING BOARD

A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less. 17-. (canceled)8. A method for producing a wiring board , comprising:producing a silver ink composition by mixing a silver carboxylate and a nitrogen-containing compound with either or both of a reducing agent and an alcohol, andforming thin silver wires on a substrate by a printing method using the silver ink composition to form a wiring board,wherein a width of the thin silver wire in a cross-section in a direction perpendicular to a wire length direction thereof is 15 μm or less, and a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, andan aspect ratio of the thin silver wire in the cross-section in the direction perpendicular to the wire length direction thereof is 0.1 or less.9. The method according to claim 8 , wherein the silver carboxylate is a silver 2-methylacetoacetate or a silver acetoacetate.10. The method according to claim 8 , wherein the nitrogen-containing compound is at least one selected from the group consisting of an amine compound having 1 to 25 carbon atoms or less claim 8 , a quaternary ammonium salt having 4 to 25 carbon atoms or less claim 8 , an ammonia claim 8 , an ammonium salt produced by a reaction between the amine compound having 1 to 25 carbon atoms or less and an acid claim 8 , and an ammonium salt produced by a reaction between the ammonia and an acid.11. The method according to claim 10 , wherein at least one of the nitrogen-containing compound is a 2-ethylhexylamine.12. The method according to claim 8 , wherein the reducing agent is mixed ...

PRINTED WIRING LINE, ELECTRONIC DEVICE, TOUCH PANEL, GRAVURE PLATE, PRINTED WIRING LINE FORMATION METHOD, TOUCH PANEL PRODUCTION METHOD, AND ELECTRONIC DEVICE PRODUCTION METHOD

A printed wiring line formed on a substrate connects two different points on the substrate which are connectable by another printed wiring line with a shape of a straight-line segment and has a shape corresponding to at least one of: 1) a shape with no linear part parallel to the straight-line segment; 2) a shape in which line segments are connected in series, each line segment having a shape with no linear part parallel to the straight-line segment; 3) a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment, length of the part parallel to the straight-line segment being not more than length of the straight-line segment; and 4) a shape in which line segments are connected in series, each line segment having a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment. 1. A printed wiring line formed on a substrate , whereinthe printed wiring line connects two different points on the substrate which are connectable by another printed wiring line with a shape of a straight-line segment and has a shape corresponding to at least one of:1) a shape with no linear part parallel to the straight-line segment;2) a shape in which line segments are connected in series, each line segment having a shape with no linear part parallel to the straight-line segment;3) a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment, length of the part parallel to the straight-line segment being not more than half of length of the straight-line segment; and4) a shape in which line segments are connected in series, each line segment having a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment.2. Printed wiring lines comprising:at least two printed wiring lines formed parallel to each other on a substrate, whereinthe at least two printed wiring lines each have a same shape, 1 ...

METHOD FOR FORMING INSULATING LAYER, METHOD FOR PRODUCING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE

By flexographic printing or inkjet printing, insulating ink is applied on a wiring pattern in accordance with a predetermined printing pattern. The insulating ink is hardened, whereby an insulating layer is formed. A contact region of the wiring pattern that is used for electrical connection with a conductor other than the wiring pattern is not covered with the insulating layer. The printing pattern is delimited by the outline of a non-printing region including the contact region. The wiring pattern includes, in the non-printing region, a trunk wiring line leading, to the contact region, from a position on the wiring pattern at which the wiring pattern overlaps with the outline and a branch wiring line extending from a point on at least one side of the trunk wiring line and terminating without making contact with the outline. 1. A method for forming an insulating layer which covers a wiring pattern formed on a base in such a way that a region that belongs to the wiring pattern and is used for electrical connection with a conductor other than the wiring pattern is exposed , the region hereinafter referred to as a contact region , the method comprising:forming the wiring pattern on the base;applying insulating ink on the wiring pattern by flexographic printing or inkjet printing in accordance with a printing pattern delimited by an outline of a non-printing region including the contact region; and a trunk wiring line leading, to the contact region, from a position on the wiring pattern at which the wiring pattern overlaps with the outline; and', 'a branch wiring line extending from a point on at least one side of the trunk wiring line, except for both ends of the trunk wiring line, and terminating without making contact with the outline., 'forming the insulating layer by hardening the insulating ink, wherein in the non-printing region, the wiring pattern includes2. A method for forming an insulating layer which covers a wiring pattern formed on a base in such a way ...

INK COMPOSITION FOR PRINTING, AND PRINTING METHOD USING SAME

Provided are an ink composition for a printing method, in which the ink composition is applied to a printing blanket, a portion of a coating film is removed using a cliche, and then the coating film remaining on the printing blanket is transferred to an object to be printed, in which the ink composition before printing satisfies the following [Equation 1] [INK≤BNKγc] and the ink coating film on the printing blanket satisfies the following [Equation 2] [BNKγc≤INK≤SUB] immediately before the removal of the portion of the ink coating film from the printing blanket using the cliche, and a printing method using the same. 2. The ink composition of claim 1 , wherein said and silicone-based or a fluorine-based surfactant is present in an amount of from 0.01 wt % to 5 wt % based on the total weight of the ink composition.3. The ink composition of claim 1 , wherein the binder has a surface tension from 26 mN/m to 45 mN/m.4. The ink composition of claim 1 , wherein said at least two different solvents comprise a first solvent in an amount of 10 wt % to 40 wt % based on the total weight of the ink composition and a second solvent in an amount of 0.1 wt % to 50 wt % based on the total weight of the ink composition.5. The ink composition of claim 4 , wherein the first solvent comprises a solvent having a surface tension from 11 mN/m to 24 mN/m and the second solvent comprises a solvent having a surface tension from 26 mN/m to 72 mN/m.6. The ink composition of claim 4 , wherein said first solvent is selected from the group consisting of dimethyl glycol claim 4 , trimethyl chloro methane claim 4 , methanol claim 4 , ethanol claim 4 , isopropanol claim 4 , propanol claim 4 , hexane claim 4 , heptane claim 4 , octane claim 4 , 1-chlorobutane claim 4 , methyl ethyl ketone claim 4 , cyclohexane.7. The ink composition of claim 4 , wherein said second solvent is selected from the group consisting of dimethyl acetamide claim 4 , γ-butyl lactone claim 4 , hydroxytoluene claim 4 , propylene ...

Scalable, Printable, Patterned Sheet of High Mobility Graphene On Flexible Substrates

The present invention provides methods for fabricating graphene workpieces. The present invention also provides for products produced by the methods of the present invention and for apparatuses used to perform the methods of the present invention.

METHOD OF ROLL TO ROLL PRINTING OF FINE LINES AND FEATURES WITH AN INVERSE PATTERNING PROCESS

A method of inverse image flexographic printing includes transferring an insulating ink to a plurality of inverse printing patterns disposed on a flexo master. The insulating ink is transferred from the plurality of inverse printing patterns to a substrate. The insulating ink disposed on the substrate is cured. A catalytic ink is deposited on a plurality of exposed portions of the substrate. The catalytic ink deposited on the substrate is electroless plated. 1. A method of inverse image flexographic printing comprising:transferring an insulating ink to a plurality of inverse printing patterns disposed on an flexo master;transferring the insulating ink from the plurality of inverse printing patterns to a substrate;curing the insulating ink disposed on the substrate;depositing a catalytic ink on a plurality of exposed portions of the substrate; andelectroless plating the deposited catalytic ink on the substrate.2. The method of claim 1 , wherein the cured insulating ink disposed on the substrate comprise a plurality of lateral barriers on the substrate.3. The method of claim 2 , wherein the plurality of exposed portions of the substrate comprise an inverse image of the plurality of lateral barriers.4. The method of claim 1 , wherein the deposited catalytic ink disposed on the plurality of exposed portions of the substrate comprise a plurality of plating seed layers.5. The method of claim 4 , wherein the electroless plated substrate comprises electroless metallization of the plurality of plating seed layers.6. The method of claim 5 , wherein the metallized plurality of plating seed layers comprise a plurality of conductors.7. The method of claim 6 , wherein the plurality of conductors are transparent.8. The method of claim 6 , wherein the plurality of conductors have a width of less than 10 microns.9. The method of claim 6 , wherein the plurality of conductors have a width variation of less than 1 micron.10. The method of claim 6 , wherein the plurality of conductors ...

METHOD AND AN ARRANGEMENT FOR PRODUCING ELECTRICALLY CONDUCTIVE PATTERNS ON SUBSTRATES

A method () for producing an electrically conductive pattern on substrate (), comprising: providing electrically conductive solid particles onto an area of the substrate in a predefined pattern (), where the pattern () comprises a contact area (B) for connecting to an electronic component and a conductive structure (A) having at least a portion () adjacent to the contact area, heating the conductive particles to a temperature higher than a characteristic melting point of the particles to establish a melt (), and pressing the melt against the substrate in a nip, the temperature of the contact portion of which being lower than the aforesaid characteristic melting point so as to solidify the particles into essentially electrically continuous layer within the contact area and within the conductive structure in accordance with the pattern (), wherein the thermal masses of the contact area and the at least adjacent portion of the conductive structure are configured substantially equal. 1. A method for producing an electrically conductive pattern on substrate , comprising:providing electrically conductive solid particles onto an area of the substrate in a predefined pattern, where the pattern comprises a contact area for connecting to an electronic component and a conductive structure adjacent to the contact area,heating the conductive particles to a temperature higher than a characteristic melting point of the particles to establish a melt, andpressing the melt against the substrate in a nip, the temperature of the contact portion of which being lower than the aforesaid characteristic melting point so as to solidify the particles into essentially electrically continuous layer within the contact area and within the conductive structure in accordance with the pattern, whereinthe contact area and the conductive structure have thermal masses configured substantially equal.2. The method of claim 1 , wherein configuring the thermal masses substantially equal incorporates ...

MANUFACTURING PROCESS OF A POSITIONING CONTROL TOOL VIA 3D-PRINTING TECHNOLOGY

A manufacturing process to form a positioning control tool, such as a gyroscope, by using a three-dimensional (3D) printer printing a polymer material mixed with powdered graphene () components () on a piezoelectric substrate (), the components () include: a resonator () transducer configured to create a first surface acoustic wave (); a pair of reflectors () configured to reflect the first surface acoustic wave (); a structure () which, when subjected to a Coriolis force, creates a second surface acoustic wave (); a first sensor transducer () configured to sense the second surface acoustic wave (); and a second sensor transducer () configured to sense a residual surface acoustic wave from a second region of the surface () of the piezoelectric substrate free of the structures that respond to the Coriolis force. 1. A method to 3D print a gyroscope , wherein the method includes:3D print an insulating 3D-printing polymer material to form a first part of a frame for the gyroscope;3D print a polymer material mixed with powdered graphene on the first part of the frame to form a piezoelectric substrate;3D print a pattern on the piezoelectric substrate, wherein the pattern has apertures; a resonator transducer configured to create a first surface acoustic wave on a surface of the piezoelectric substrate;', 'a pair of reflectors configured to reflect the first surface acoustic wave to form a standing wave within a first region of the surface and between the pair of reflectors;', 'a structure within the first region wherein the structure is subject to a Coriolis force to create a second surface acoustic wave on the piezoelectric substrate;', 'a first sensor transducer disposed on the surface and configured to sense the second surface acoustic wave; and', 'a second sensor transducer disposed on the surface and configure to sense a residual surface acoustic wave from a second region of the surface, wherein the second region is separated form the structure, and the second sensor ...

Microcircuit forming method and etching fluid composition

The disclosure relates to a microcircuit forming method. The microcircuit forming method according to the disclosure comprises: a seed-layer forming step for forming a high-reflectivity seed layer on a substrate material by using a conductive material; a pattern-layer forming step for forming a pattern layer on the seed layer, the pattern layer having a pattern hole arranged thereon to allow the seed layer to be selectively exposed therethrough; a plating step for filling the pattern hole with a conductive material; a pattern-layer removing step for removing the pattern layer; and a seed-layer patterning step for removing a part of the seed layer which does not overlap the conductive material in the plating step, wherein the high-reflectivity seed layer has a specular reflection property.

Scalable, Printable, Patterned Sheet Of High Mobility Graphene On Flexible Substrates

The present invention provides methods for fabricating graphene workpieces. The present invention also provides for products produced by the methods of the present invention and for apparatuses used to perform the methods of the present invention. 1. A patterned structure comprising:a patterned layer; anda graphene layer coupled to the patterned layer and separated from a substrate according to a pattern of the patterned layer.2. The patterned structure of claim 1 , wherein the patterned layer provides support for the graphene layer that is separated from the substrate.3. The patterned structure of claim 1 , wherein the separated graphene layer has the same pattern as the patterned layer.4. The patterned structure of claim 1 , wherein the patterned structure is a free-standing structure that is separated from the substrate.5. The patterned structure of claim 1 , wherein the patterned structure is configured to be coupled to a base substrate. This application is a continuation of U.S. patent application Ser. No. 16/214,601, filed Dec. 10, 2018, which is a continuation application of U.S. patent application Ser. No. 15/850,046, filed Dec. 21, 2017, now U.S. Pat. No. 10,165,679, issued Dec. 25, 2018, which is a continuation application of U.S. patent application Ser. No. 15/305,167, filed Oct. 19, 2016, now U.S. Pat. No. 9,930,777, issued Mar. 27, 2018 which is a National Stage Application of International Patent Application No. PCT/US2015/027193, filed Apr. 23, 2015, which claims benefit of U.S. Patent Application No. 61/983,014, filed Apr. 23, 2014, the disclosures of which are both incorporated herein by reference in their entirety.This invention was made with government support under Contract No. DMR08-32802 awarded by the Nano/Bio Interface NSF NSEC. The government has certain rights in the invention.The disclosed invention is directed toward the fields of graphene workpieces and of manufacturing methods thereof.The present application generally relates to methods ...

ELECTRICALLY CONDUCTIVE PASTE, THREE-DIMENSIONAL PRINTED CIRCUIT, TOUCH SENSOR, AND METHOD FOR PRODUCING THE SAME

An electrically conductive paste for molding processing is prepared by mixing and dispersing aggregated silver particles, a resin having glass transition temperature of 80° C. or lower, a curing agent and a solvent. The electrically conductive paste is suitable for use applications wherein the whole body of a substrate is thermally deformed to form a three-dimensional circuit after the formation of a printed circuit, and is particularly suitable for the formation of a fine wire for a touch sensor. 1. An electrically conductive paste for molding processing which is characterized in containing aggregated silver particles , a resin having glass transition temperature of 80° C. or lower , a curing agent and a solvent.2. The electrically conductive paste for molding processing according to claim 1 , wherein tap density of the aggregated silver particles is 2 to 5 g/cmand specific surface area of the aggregated silver particles is 0.5 to 2.0 m/g.3. The electrically conductive paste for molding processing according to claim 1 , wherein the aggregated silver particles contain aggregated silver particles consisting of primary particles having an average particle diameter of 0.1 to 3 μm claim 1 , and wherein the average particle diameter of the primary particles mentioned herein is a number-average particle diameter measured by an enlarged observation under a scanning electron microscope.4. The electrically conductive paste for molding processing according to claim 1 , wherein the glass transition temperature of the resin is 60° C. or lower.5. The electrically conductive paste for molding processing according to claim 1 , wherein number-average molecular weight of the resin is 5000 to 40000.6. The electrically conductive paste for molding processing according to claim 1 , wherein the paste contains carbon black as an electrically conductive filler.7. A three-dimensional printed circuit which is characterized in having a wire formed from the electrically conductive paste for ...

Method for forming multilayered circuit pattern on surface of three-dimensional metal board

A method for forming a multilayered circuit pattern on a surface of a 3D metal board includes: forming a first insulation layer on the surface of the 3D metal board; forming a first conductive pattern on the first insulation layer; forming a second insulation layer on the first conductive pattern except for a predetermined region; forming a second conductive pattern on the second insulation layer; and forming a third insulation layer on the second conductive pattern except for one or more circuit element mounting regions.

Printing plate, laminated ceramic electronic component producing method, and printer

A print pattern of a printing plate used in intaglio printing includes plural partition walls and a groove-shaped cell unit. The plural partition walls are continuously extended in a printing direction, and arranged at predetermined intervals in an orthogonal direction. The cell unit is formed between the partition walls adjacent to each other, and a printing paste (conductive paste) is retained in the cell unit. Plural printing direction walls that are arranged in a zigzag manner in the printing direction are coupled to each other by a coupling walls that are arranged in the printing direction walls adjacent to each other in the printing direction, thereby forming the partition wall.

PAPER-IN-RESIN ELECTRONICS - PROCESS FOR PRODUCING IT AND APPLICATION IN MANUFACTURED PRODUCTS

The invention relates to a paper-based printed electronic device comprising one or more sheets of paper that is impregnated with a resin in way to fill the voids (or pores) of porous networks of cellulose fibers and in particular to saturate said porous networks of cellulose fibers, as well as to coat the outer surfaces of the printed electronics with said resin. A fully encapsulated electronic device is obtained which is protected against external environmental and physical damages such as against moisture and oxygen and has acquired sufficient resistance to tearing. The impregnated and encapsulated electronic device can then be successfully integrated into an object in a form of a flat or curved monolithic structure. This may especially be achieved through a lamination process, as said device sustains high pressure, high temperature, does not create bubbles, does not delaminate, and can be fully embedded into an end product. 122.-. (canceled)23. An electronic device comprising a plurality of sheets assembled in a direction perpendicular to the plane of the sheets , wherein at least one of said sheets is a sheet of paper comprising a printed trace , pattern , and/or layer of an electronic ink , and wherein the assembly of plurality of sheets is impregnated and encapsulated with a resin in a form of a flat or curved monolithic structure.24. The electronic device according to claim 23 , wherein at least two of the plurality of sheets are paper sheets comprising printed traces claim 23 , patterns claim 23 , and/or layers of a conductive ink.25. The electronic device according to claim 23 , wherein all paper sheets have a Bendtsen porosity greater than 1 ml/min.26. The electronic device according to claim 23 , wherein the at least one paper sheet comprises a printed trace claim 23 , pattern claim 23 , and/or layer of an electronic ink having a Bekk smoothness greater than 50 s.27. The electronic device according to claim 23 , wherein the at least one paper sheet ...

ELECTRONIC PRODUCT AND MANUFACTURING METHOD THEREOF

An electronic product including a supporting structure, a first thermo-formable film, a conductive circuit and a protection layer is provided. The conductive circuit is formed on the first thermo-formable film, and an electronic component is mounted on the conductive circuit. The protection layer covers the electronic component, and includes a second thermo-formable film. The conductive circuit and the electronic component are enclosed between the first thermo-formable film and the second thermo-formable film, and the supporting structure, the first thermo-formable film and the protection layer are bonded and stacked to each other. 1. A manufacturing method of an electronic product , comprising:forming a conductive circuit on a first thermo-formable film;mounting an electronic component on the conductive circuit;forming a protection layer on the first thermo-formable film and covering the electronic component, wherein the protection layer comprises a second thermo-formable film, and the conductive circuit and the electronic component are enclosed between the first thermo-formable film and the second thermo-formable film; andforming a supporting structure, wherein the supporting structure, the first thermo-formable film and the protection layer are bonded and stacked to each other.2. The manufacturing method of an electronic product according to claim 1 , wherein at least one of the first thermo-formable film and the second thermo-formable film comprises at least a function film formed by at least one of a decorative layer claim 1 , a heat conducting layer claim 1 , a shielding layer claim 1 , and a function film compatible with a polymer film.3. The manufacturing method of an electronic product according to claim 1 , wherein the first thermo-formable film is a polymer film claim 1 , and the step of forming the conductive circuit comprises:forming a patterned ink layer having a circuit pattern on the polymer film;placing a conductive metal layer on the patterned ink ...

WIRING STRUCTURE MANUFACTURING METHOD AND WIRING STRUCTURE

A wiring structure that includes first wiring parts which are formed of conductive wires and second wiring parts which are formed of thicker conductive wires than the conductive wires of the first wiring parts and are connected to the first wiring parts is formed by offset printing which includes the following processes. First printing process: First conductive ink for forming the first wiring parts is transferred from a first blanket to a base. Second printing process: Second conductive ink for forming the second wiring parts is transferred from a second blanket, which is different from the first blanket, to the base. 1. A method for producing a wiring structure of a touch panel having defined a sensor region therein , the method comprising:transferring first conductive ink from a first blanket to the base to form a first wiring part formed of a conductive wire on the base, the first wiring part including a wiring part located in the sensor region and another wiring part located outside of the sensor region, wherein the first blanket offsets onto the base only the first conductive ink which forms the first wiring part; andtransferring second conductive ink from a second blanket to the base to form a second wiring part on the base, the second blanket being different from the first blanket, the second wiring part located outside of the sensor region, wherein the second wiring part is formed of a wider conductive wire than the conductive wire of the first wiring part, and wherein the second blanket offsets onto the base only the second conductive ink which forms the second wiring part.2. The method according to claim 1 , whereinthe transferring of the first conductive ink is performed after the transferring of the second conductive ink.3. The method according to claim 1 , whereinthe first wiring part is formed in a region other than a region in which the second wiring part is formed on the base, except for a portion thereof which is in direct contact with the second ...

STRUCTURAL DESIGNS FOR STRETCHABLE, CONFORMAL ELECTRICAL INTERCONNECTS

Disclosed is a conformable, stretchable and electrical conductive structure, which includes an auxetic structure, and a plurality of electrical conductors. The plurality of electrical conductors being incorporated within the auxetic structure, to form conformable, stretchable electrical interconnects, configured based on a design of the auxetic structure and placement of the electrical conductors incorporated with the auxetic structure. 1. A conformable stretchable electrically conductive structure comprising:an auxetic structure; anda plurality of electrical conductors, at least some of the plurality of electrical conductors being incorporated as part of the auxetic structure;wherein conformable, stretchable electrical interconnects are configured inconsideration of a design of the auxetic structure and a placement of the electrical conductors incorporated within the auxetic structure.2. The conformable stretchable electrically conductive structure according to having a stretch gradient.3. The conformable stretchable electrically conductive structure according to wherein the stretch gradient is defined by unit cell sizes of the auxetic structure and density of the interconnects.4. The conformable stretchable electrically conductive structure according to further including anchoring points configured to anchor selected portions of the auxetic structure.5. The conformable stretchable electrically conductive structure according to further including anchoring points which adjust a stretch profile.6. The conformable stretchable electrically conductive structure according to a first set of anchoring points and a second set of anchoring points claim 1 , wherein the first set of anchoring points provide a first stretch profile of the auxetic structure claim 1 , and the second set of anchoring points provide a second stretch profile of the auxetic structure different from the first stretch profile of the auxetic structure.7. The conformable stretchable electrically ...

Electronic product and manufacturing method thereof

A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a film, wherein the conductive circuit is made of a conductive metal layer, the conductive metal layer is a metal foil and the conductive metal layer is patterned to form the conductive circuit. Then, an electronic element is disposed on the conductive circuit of the film, and the electronic element is electrically connected to the conductive circuit. Then, the film and a supporting structure are combined by an out-mold forming technology or an in-mold forming technology, such that the electronic element is wrapped between the film and the supporting structure.

Method of fabricating touch screen panel

A touch screen panel includes a film substrate defined by a touch active area and a non-touch active area and the touch area is arranged outside the touch active area. The touch screen panel includes a plurality of sensing electrodes arranged in the touch active area on an upper surface and a lower surface of the film substrate, and outer lines arranged in the non-touch active area on the upper and the lower surfaces of the film substrate. The outer lines are connected to the sensing electrodes along one of a first direction and a second direction, and the outer lines include a transparent electrode layer and a plating layer on the transparent electrode layer.

WIRING STRUCTURE MANUFACTURING METHOD AND WIRING STRUCTURE

A wiring structure that includes first wiring parts which are formed of conductive wires and second wiring parts which are formed of thicker conductive wires than the conductive wires of the first wiring parts and are connected to the first wiring parts is formed by offset printing which includes the following processes. First printing process: First conductive ink for forming the first wiring parts is transferred from a first blanket to a base. Second printing process: Second conductive ink for forming the second wiring parts is transferred from a second blanket, which is different from the first blanket, to the base. 1. A method for producing a wiring structure formed by offset-printing conductive ink on a base , the wiring structure including a first wiring part formed of a conductive wire and a second wiring part formed of a thicker conductive wire than the conductive wire of the first wiring part and connected to the first wiring part , the method comprising:transferring first conductive ink for forming the first wiring part from a first blanket to the base; andtransferring second conductive ink for forming the second wiring part from a second blanket, the second blanket being different from the first blanket, to the base.2. The method according to claim 1 , wherein the first conductive ink is different from the second conductive ink.3. The method according to claim 1 , wherein the transferring of the first conductive ink is performed after the transferring of the second conductive ink.4. The method according to claim 2 , wherein the transferring of the first conductive ink is performed after the transferring of the second conductive ink.5. The method according to claim 1 , whereinthe wiring structure is a wiring structure used in a touch panel,the first wiring part is a wiring part formed in a sensor region of the touch panel, andthe second wiring part is a wiring part formed around the sensor region.6. The method according to claim 2 , whereinthe wiring ...

Patterned Nano-Engineered Thin Films On Flexible Substrates For Sensing Applications

A sensing assembly for sensing a condition. The sensing assembly comprises a substrate and a thin-film circuit element disposed on the substrate. The thin-film circuit element is exposed to the condition and outputting an analog signal in response to the condition. The thin-film circuit element having a plurality of discrete layers operably joined together to output the analog signal. 1. A sensing assembly for sensing a condition , said sensing assembly comprising:a substrate; anda thin-film circuit element disposed on said substrate, said thin-film circuit element being exposed to the condition and outputting an analog signal in response to the condition, said thin-film circuit element having a plurality of discrete layers operably joined together to output said analog signal.2. The sensing assembly according to wherein said substrate is a rigid substrate.3. The sensing assembly according to wherein said substrate is a flexible substrate.4. The sensing assembly according to wherein at least one of said plurality of discrete layers of said thin-film circuit element is an annealed layer.5. The sensing assembly according to wherein said circuit element is chosen from the group consisting of inductor claim 1 , capacitor claim 1 , resister claim 1 , sensor claim 1 , and actuator.6. The sensing assembly according to claim 1 , further comprising:a polymeric layer encapsulating said substrate and said thin-film circuit element.7. The sensing assembly according to wherein said plurality of discrete layers of said thin-film circuit element is made of a material configured to modify said analog signal.8. The sensing assembly according to wherein said plurality of discrete layers are deposited via layer-by-layer deposition and lithographic patterning to define a predetermined film composition.9. The sensing assembly according to wherein the condition is a strain condition and said plurality of discrete layers are configured to be responsive to the strain condition.10. The ...

CIRCUIT BOARD ASSEMBLY

A circuit board assembly is described. The circuit board assembly comprises a circuit board comprising a substrate supporting a plurality of contact lands and a device, such as a bare die or printed circuit board, comprising a plurality of contact pads which is mounted on the circuit board such that the contact pads are aligned with the contact lands. The circuit board assembly comprises an interconnect layer which has a sheet resistance, R, of at least 0.5 MΩ/sq, which is disposed between the device and the circuit board and which is arranged to provide electrical connections between the contact lands and corresponding contact pads. 1. A circuit board assembly comprising:a circuit board comprising a substrate supporting a plurality of contact lands;a device comprising a plurality of contact pads which is mounted on the circuit board such that the contact pads are aligned with the contact lands; and{'sub': 'S', 'an interconnect layer which has a sheet resistance, R, of at least 0.5 MΩ/sq and which is disposed between the device and the circuit board and which is arranged to provide electrical connections between the contact lands and corresponding contact pads.'}2. A circuit board assembly according to claim 1 , wherein the separation between adjacent contact pads or contact lands is greater than or equal to the width of each contact pad or contact land.3. A circuit board assembly according to claim 1 , wherein the interconnect layer comprises a homogeneously conductive material.4. A circuit board assembly according to claim 1 , wherein the ratio of the sheet resistance claim 1 , R claim 1 , to the contact resistance claim 1 , R claim 1 , between a contact pad and the corresponding contact land is at least 2500:1 claim 1 , at least 10 000:1 or at least 30 000:1.5. A circuit board assembly according to claim 1 , wherein the interconnect layer has a sheet resistance claim 1 , R claim 1 , of at least 1 MΩ/sq claim 1 , at least 2 MΩ/sq or at least 3 MΩ/sq.5. (canceled)6 ...

PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

A printed circuit board, a semiconductor package and a method of manufacturing the same are provided. The printed circuit board includes an insulation layer, an electronic component embedded within the insulation layer, a component guide affixing the embedded electronic component at an installed position, and a circuit layer disposed in the insulation layer. 1. A printed circuit board comprising:an insulation layer;an electronic component embedded within the insulation layer;a component guide affixing the embedded electronic component at an installed position; anda circuit layer disposed in the insulation layer.2. The printed circuit board as set forth in claim 1 , wherein the circuit layer comprises a circuit pattern embedded in one surface of the insulation layer.3. The printed circuit board as set forth in claim 1 , wherein the component guide is embedded in one surface of the insulation layer.4. The printed circuit board as set forth in claim 1 , wherein the component guide and the circuit layer are made of a same material.5. The printed circuit board as set forth in claim 1 , wherein the component guide comprises a metal pattern disposed around the electronic component.6. The printed circuit board as set forth in claim 5 , wherein the metal pattern of the component guide surrounds the electronic component.7. The printed circuit board as set forth in claim 5 , wherein the metal pattern of the component guide comprises an “L” shaped bracket disposed at a corner of the electronic component.8. The printed circuit board as set forth in claim 1 , further comprising a build-up layer disposed on the insulation layer claim 1 , the build-up layer comprising a build-up insulation layer and a build-up circuit layer.9. A semiconductor package comprising:a printed circuit board comprising: an insulation layer; an electronic component embedded within the insulation layer; a component guide affixing the embedded electronic component at an installed position; and a circuit ...

Method for forming a metal film, and nanoimprint lithography material

The present invention is to solve the problem of residues in nanoimprint lithography without losing the merits thereof, i.e., low cost and high productivity, and provides a metal film formation technique advantageous in pattern accuracy and product reliability over time. A metal film formation method according to the present invention comprises a first step where a nanoimprint lithography material is deposited on an insulating substrate to form an underlayer, a second step where the underlayer is pressed with a mold having protrusions to pattern by nanoimprint lithography, a third step where residues of the underlayer at regions pressed with the protrusions of the mold are evaporated by heating to be removed, and forming a metal film at least on the patterned underlayer. A nanoimprint lithography material according to the present invention contains a catalyst for a metal plating.

METHOD FOR FORMING PATTERN

The invention provides a process and an apparatus for producing a high quality electronic component by reducing sagging at pattern side walls, which may occur when patterns of a wiring, an electrode, etc. are printed by a screen printing process using an electroconductive paste, an insulation paste, or a semiconductor paste, and reducing a mesh mark on the patterns of a wiring, an electrode, etc., or a full solid surface film, as well as a pattern formation process, by which screen printing can be applied and double face printing can be conducted with the number of process steps less than a conventional process. A pattern is formed by that a pattern is printed on a blanket having a surface comprising polydimethylsiloxane using an electroconductive paste, an insulation paste, or a semiconductor paste by a screen printing process, and the pattern is transferred from the blanket to a printing object. 1. A formation process of a pattern characterized in that a pattern is printed on a blanket having a surface comprising polydimethylsiloxane using an electroconductive paste , an insulation paste , or a semiconductor paste by a screen printing process , and the pattern is transferred from the blanket to a printing object.2. The formation process of a pattern according to claim 1 , wherein the blanket is sheet-formed.3. The formation process of a pattern according to claim 1 , wherein the blanket is roll-formed.4. The formation process of a pattern according to claim 1 , wherein an electrode pattern is formed using an electroconductive paste.5. The formation process of a pattern according to claim 4 , wherein the electrode pattern is a wiring electrode to be used in a touch panel claim 4 , a solar cell claim 4 , a laminated ceramic capacitor claim 4 , an antenna claim 4 , and a multilayer printed wiring board.6. The formation process of a pattern according to claim 1 , wherein a first pattern is printed on the blanket by a screen printing process using an electroconductive ...

SPRING LOADED ROLLERBALL PEN FOR DEPOSITION OF MATERIALS ON RAISED SURFACES

A material deposition system and method is disclosed for depositing material onto raised features on a surface of a substrate. The material deposition system and method are a contact deposition or printing system and method, which employs biased rollerball to deposit the material as it travels along the substrate and over the raised features. 1. A material deposition system for depositing material onto raised surfaces on a substrate , the system comprising:a material deposition assembly including,a rollerball,a housing component configured to hold the rollerball, the housing component having an inner surface, an outer surface, a first end, and a second end distant from the first end, the first end sized and configured to hold the rollerball while allowing the rollerball to rotate,a bias mechanism positioned to contact the second end of the housing component,a stationary fitting having an inner surface and outer surface, the inner surface in contact with at least a portion of the outer surface of the housing component,a material carrying tube arrangement arranged to carry material to be deposited, the material carrying tube arrangement having a first opening arranged to receive the material to be deposited on the surface of the substrate, and a second end positioned immediately substantially adjacent a portion of the rollerball;a material container configured to hold the material to be deposited, and positioned to provide the material to be deposited to the material carrying tube arrangement; anda carriage configured to hold and move the material deposition assembly.2. The system according to wherein the inner surface of the stationary fitting has a low coefficient of friction to allow smooth sliding of the outer surface of the housing component against the inner surface of the stationary fitting.3. The system according to further including an air pressure generator positioned and configured to generate air pressure to move the material to be deposited through the ...

PRINTING

A method of preparing a printing form precursor for printing, or a printed circuit board precursor or a semiconductor precursor, the method comprising the step of applying electromagnetic radiation having a pulse duration of not greater than 1×10seconds, in an imagewise manner, to an imagable surface of the precursor. The imaging process may cause ablation of the coating of the precursor or permit its development in a developer. In each case the imaging radiation needs not be tuned to imaging chemistry (if any) present in the coating. Alternatively the imaging process may induce a change of hydrophilicity or hydrophobicity, or other change of state, of an uncoated substrate. 1. A method of preparing a printing form precursor for printing , the method comprising the step of applying electromagnetic radiation having a pulse duration of not greater than 1×10seconds and a fluence of at least 100 mJ/cm , in an imagewise manner , to an imageable surface of the printing form precursor ,wherein the imageable surface is aluminium oxide.2. A method as claimed in claim 1 , wherein an average frequency of the pulses is at least 100 pulses per second.3. A method as claimed in claim 1 , wherein a fluence does not exceed 20 claim 1 ,000 mJ/cm.4. A method as claimed in claim 1 , wherein an incubation number N in the method is 1 or a larger number up to 10.5. A method as claimed in claim 1 , wherein a profile of a laser beam applying the electromagnetic radiation is Gaussian claim 1 , square or rectangular.6. A method as claimed in claim 1 , wherein the method employs claim 1 , as an imaging device claim 1 , a nanosecond laser claim 1 , a femtosecond laser claim 1 , or a picosecond laser.7. A method as claimed in claim 1 , wherein the printing form precursor is a coated printing form precursor claim 1 , wherein a) the coating does not contain an imaging chemistry claim 1 , or b) the coating does contain an imaging chemistry; wherein in either case the image is formed in the coating ...

Conductive Ink Composition for Offset or Reverse-Offset Printing

There is provided a conductive ink composition for offset or reverse-offset printing, the conductive ink composition including a high boiling point solvent having a boiling point of 180 to 250° C. and a dispersion assistant solvent having a boiling point of 50 to 150° C., together with metal particles and tert-butyl alcohol as a main solvent. 1. A method of printing a conductive ink composition , comprising applying a conductive ink composition on a substrate using offset or reverse-offset printing , wherein the conductive ink composition comprises 3 to 15 wt % of a high boiling point solvent having a boiling point of 180 to 250° C. and 10 to 30 wt % of propylene glycol monomethyl ether acetate as a dispersion assistant solvent , together with 20 to 40 wt % of metal particles and 40 to 65 wt % of tert-butyl alcohol as a main solvent.2. The method of printing a conductive ink composition of claim 1 , wherein the offset or reverse-offset printing is performed by a polydimethylsiloxane (PDMS) material blanket.3. The method of printing a conductive ink composition of claim 1 , wherein the high boiling point solvent is at least one selected from terpineol claim 1 , ethyl carbitol acetate claim 1 , and butyl carbitol acetate.4. The method of printing a conductive ink composition of claim 1 , wherein the metal particles are copper particles claim 1 , silver particles claim 1 , or mixed particles thereof claim 1 , having an average particle size of 5 nm to 100 nm.5. The method of printing a conductive ink composition of claim 1 , wherein the conductive ink composition further comprises a binder and a dispersant.6. The method of printing a conductive ink composition of claim 5 , wherein the binder is at least one selected from phenol based resin and acrylic based resin.7. The method of printing a conductive ink composition of claim 5 , wherein the dispersant is a copolymer having an acid value of 50 mg KOH/g or higher and an amine value of 100 mg KOH/g or lower.8. The method ...

Microcontact printing stamps with functional features

A method includes providing an elastomeric stamp including a stamping surface with a first pattern element having a fill factor of 20 to 99 percent and including a continuous region and at least one discontinuous region, the discontinuous region including at least one of: (1) one or more elongated concavities, and (2) one or more interior voids. A second pattern element of the stamping surface has a fill factor of 0.25 to 10 percent, and includes traces with a width from 0.1 micrometers to 50 micrometers. The stamping surface is inked with an ink composition including a functionalizing molecule with a functional group selected to bind to a surface of the ink-receptive material. The inked stamping surface is contacted with an ink-receptive material selected from a sheet or a web for a contact time sufficient to bind the functional group with the surface of the ink-receptive material to form a self-assembled monolayer (SAM) of the functionalizing material.

COIL COATING PROCESS

A coil coating method for multilayer coating of a continuous metal strip, which is disposed in the strip passage, in which on a flat side of the metal strip, a curable polymer primer is applied by means of a roller application and cured in order to form an electrically insulating primer layer and a curable polymer varnish is applied onto said primer layer by means of roller application and cured in order to form an electrically insulating varnish layer, wherein at least one at least electrically conductive conductor track is printed on at least some areas between the primer layer and the varnish layer is proposed. In order to increase the reproducibility of the coil coating method, it is proposed that the conductor track be printed on some areas of the pre-cured primer layer and that the conductor track and varnish be applied using a wet-on-wet process. 1. A coil coating method for multilayer coating of a continuous metal strip , which is disposed in a strip passage , the method comprising:applying a curable polymer primer on a flat side of the metal strip using a roller application in order to form an electrically insulating primer layer;applying a curable polymer varnish onto said primer layer using a roller application and curing the polymer varnish in order to form an electrically insulating varnish layer; andprinting at least one electrically conductive conductor track on at least some areas between the primer layer and the varnish layer, wherein the at least one conductor track is printed on some areas of the pre-cured primer layer, and the at least one conductor track and the varnish are applied using a wet-on-wet process.2. The coil coating method according to claim 1 , comprising pre-curing the applied primer at least up to a gel point.3. The coil coating method according to claim 1 , curing the primer layer and/or the varnish layer by drying at a substrate temperature in a range of 150 to 300° C.4. The coil coating method according to claim 2 , comprising ...

CURABLE INFRARED LIGHT ABSORBING PRINTING INK AND ARTICLES PREPARED WITH IT

Curable printing ink compositions include a visible light transparent, UV-curable binder composition and a visible light transparent, and infrared light absorbing inorganic composition. The infrared light absorbing inorganic composition can include infrared absorbing nanoparticles. The ink compositions are capable of flexographic printing at room temperature to a thickness of at least 1.0 micrometer. The cured ink composition has an infrared absorbance of at least 50%. The ink compositions can be printed in patterns of geometric features and cured to form articles. 1. An ink composition comprising:a visible light transparent, UV-curable binder composition; anda visible light transparent, and infrared light absorbing inorganic composition,wherein the ink composition is capable of flexographic printing at room temperature toa thickness of at least 1.0 micrometer, and wherein the cured ink composition has aninfrared absorbance of at least 50%.2. The ink of claim 1 , wherein the visible light transparent UV-curable binder composition comprises a (meth)acrylate-based composition comprising at least one tri-functional (meth)acrylate claim 1 , at least one di-functional (meth)acrylate claim 1 , or a combination thereof claim 1 , and at least one UV-activatable initiator.3. The ink of claim 1 , wherein the visible light transparent claim 1 , and infrared light absorbing inorganic composition comprises nanoparticles of mixed metal oxides.4. The ink of claim 1 , wherein the visible light transparent claim 1 , and infrared light absorbing inorganic composition comprises nanoparticles of tungsten oxide claim 1 , doped tungsten oxides claim 1 , or mixed metal tungsten oxides.5. The ink of claim 1 , wherein the visible light transparent claim 1 , and infrared light absorbing inorganic composition comprises nanoparticles of cesium tungsten oxide.6. The ink of claim 1 , wherein the ink composition has a viscosity at room temperature of from 400-15 claim 1 ,000 centiPoise.7. The ink ...

INTEGRATED COMPUTATIONAL ELEMENT WITH MULTIPLE FREQUENCY SELECTIVE SURFACES

An optical analysis tool includes an integrated computational element (ICE). The ICE includes a plurality of layers stacked along a first axis. Constitutive materials of the layers are electrically conductive and patterned with corresponding patterns. An arrangement of the patterns with respect to each other is related to a characteristic of a sample. 1. A measurement tool for measuring a characteristic of a sample , the measurement tool comprising:an integrated computational element (ICE) comprising a plurality of layers stacked along a first axis, a constitutive material of each of the layers being electrically conductive and patterned with a corresponding pattern, wherein an arrangement of the patterns with respect to each other is related to a characteristic of a sample.2. The measurement tool of claim 1 , whereinthe plurality of layers of the ICE comprises a first layer of electrically conductive material patterned with a first pattern and a second layer of electrically conductive material patterned with a second pattern, andthe arrangement of the first and second patterns with respect to each other comprises a lateral offset in a plane perpendicular to the first axis, such that the offset causes a Moiré pattern related to the characteristic of the sample.3. The measurement tool of claim 2 , wherein the lateral offset comprises a translation or a rotation in the plane perpendicular to the first axis.4. (canceled)5. The measurement tool of claim 2 , wherein the first pattern is substantially the same as the second pattern.6. The measurement tool of claim 5 , wherein a pattern difference between the first and second patterns is less than a target pattern difference.7. The measurement tool of claim 1 , whereinthe plurality of layers of the ICE comprises three or more layers of electrically conductive material, andthe arrangement of the patterns of the three or more layers of material with respect to each other has translational symmetry along the first axis to ...

MASK STRUCTURE AND MANUFACTURING METHOD THEREOF

A mask structure and a manufacturing method of the mask structure are provided. The mask structure includes a transparent substrate, a patterned metal layer, and a plurality of microlens structures. The patterned metal layer is disposed on the transparent substrate and exposing a portion of the transparent substrate. The microlens structures are disposed on the transparent substrate exposed by a portion of the patterned metal layer and being in contact with the portion of the patterned metal layer. 1. A mask structure , comprising:a transparent substrate;a patterned metal layer, disposed on the transparent substrate and exposing a portion of the transparent substrate; anda plurality of microlens structures, disposed on the transparent substrate exposed by a portion of the patterned metal layer and being in contact with the portion of the patterned metal layer.2. The mask structure according to claim 1 , wherein a material of the patterned metal layer comprises one of chromium claim 1 , copper claim 1 , titanium claim 1 , palladium claim 1 , silver claim 1 , nickel claim 1 , tin claim 1 , or a combination thereof.3. The mask structure according to claim 1 , wherein a material of the transparent substrate comprises glass claim 1 , Ajinomoto (ABF) claim 1 , benzocyclo-buthene (BCB) claim 1 , liquid crystal polymers (LCP) claim 1 , poly-imide (PI) claim 1 , poly-phenylene ether (PPE) claim 1 , poly-tetra-fluoroethylene (PTFE) claim 1 , FR4 claim 1 , FR5 claim 1 , bistmaleimide triazine (BT) claim 1 , aramide claim 1 , epoxy resins claim 1 , or glass fibers.4. A manufacturing method of a mask structure claim 1 , comprising:providing a transparent substrate;forming a patterned metal layer on the transparent substrate, wherein the patterned metal layer is disposed on the transparent substrate and exposes a portion of the transparent substrate; andforming a plurality of microlens structures on the transparent substrate exposed by a portion of the patterned metal layer.5. ...

Conductive film and conductive film roll, electronic paper, touch panel and flat-panel display comprising the same

An object of the present invention is to provide a conductive film that is excellent in flexibility while maintaining its sufficient transparency and conductivity, and a conductive film roll, an electronic paper, a touch panel, and a flat-panel display having the same.A conductive film having a transparent substrate and a conductive part having a fine metal wire pattern disposed on one side or both sides of the transparent substrate, whereinthe fine metal wire pattern is constituted by a fine metal wire, andthe conductive film satisfies the following condition (i) or (ii):(i) the fine metal wire has voids, and when the cross-sectional area of the fine metal wire is defined as SM and the total cross-sectional area of the voids included in the cross-section of the fine metal wire is defined as SVtotal on the cross-section of the fine metal wire perpendicular to the direction of drawing of the fine metal wire, SVtotal/SM is 0.10 or more and 0.40 or less; and(ii) when the maximum thickness of the fine metal wire on the cross-section of the fine metal wire perpendicular to the direction of drawing of the fine metal wire is defined as T, the width of the fine metal wire at a height of 0.90T from the fine metal wire interface on the transparent substrate side is defined as W0.90 and the width of the fine metal wire on the fine metal wire interface on the transparent substrate side is defined as W0, W0.90/W0 is 0.40 or more and 0.90 or less.

SYSTEM AND METHOD FOR FORMING ELECTRICAL CIRCUITS POPULATED WITH ELECTRONIC COMPONENTS ON NON-PLANAR OBJECTS

An object printing system printer enables printing of electrical circuits on non-planar areas of objects and the accurate placement of electronic components within the printed circuits. The system includes a direct-to-object printer and an electronic component placement system. The direct-to-object printer is configured to form an electrical circuit on an object secured within the direct-to-object printer. The electronic component placement system is configured to retrieve an electronic component and install the electronic component in the electrical circuit on the object secured within the direct-to-object printer in response to the direct-to-object printer generating a signal for the electronic component placement system that indicates the electronic component is to be installed in the circuit on the object secured within the direct-to-object printer. 1. An object printing system comprising:a direct-to-object printer, the direct-to-object printer being configured to form an electrical circuit on an object secured within the direct-to-object printer; andan electronic component placement system, the electronic component placement system being configured to retrieve an electronic component and install the electronic component in the electrical circuit on the object in response to the direct-to-object printer generating a signal for the electronic component placement system that indicates the electronic component is to be installed in the circuit on the object secured within the direct-to-object printer.2. The object printing system of claim 1 , the direct-to-object printer further comprising:a holder configured to secure the object on which the electrical circuit is formed;an aerosol printer configured to direct a fluid containing conductive material toward the object secured by the holder to form the electrical circuit on the object;a plurality of actuators operatively connected to the holder, the actuators in the plurality of actuators being configured to move the ...

3D PRINTED SENSOR AND CUSHIONING MATERIAL

Methods, apparatus, systems and articles of manufacture are disclosed relating to 3D-printed structures. An example method of building a sensor with a 3D printer includes building a first conductive substrate and building a second conductive substrate. The example method also includes building a dielectric structure between the first conductive substrate and the second conductive substrate, the dielectric structure including a first latticed structure including a first plurality of legs extending inwardly at a first angle and a second latticed structure including a second plurality of legs extending inwardly at a second angle. 1. A method of building a sensor with a 3D printer , the method comprising:building a first conductive substrate;building a second conductive substrate; andbuilding a dielectric structure between the first conductive substrate and the second conductive substrate, the dielectric structure including a first latticed structure including a first plurality of legs extending inwardly at a first angle and a second latticed structure including a second plurality of legs extending inwardly at a second angle.2. The method of building the sensor of claim 1 , wherein the building of the dielectric structure includes building first unit cells having a first structure to form the first latticed structure and building second unit cells having a second structure to form the second latticed structure.3. The method of building the sensor of claim 2 , wherein the second structure is different from the first structure.4. The method of building the sensor of claim 1 , wherein the building of the first latticed structure includes building a lower portion claim 1 , a middle portion claim 1 , and an upper portion claim 1 , lateral dimensions of the middle portion smaller than lateral dimensions of the lower portion and the upper portion.5. The method of building the sensor of claim 4 , wherein the lower portion is a first lower portion claim 4 , the middle portion is ...

METHOD OF USING HAND-MADE CIRCUIT BOARD FOR LEARNING

A method of using a hand-made circuit board for learning includes: providing a hand-made circuit board which comprises a substrate; and a medium layer disposed on a surface of the substrate to form a pattern, wherein the medium layer has a notably paintable non-conductive zone configured with a plurality of electrical blocks, and the electrical blocks are discontinuously distributed in the notably paintable non-conductive zone, so that the electrical blocks on at least one cross-section of the notably paintable non-conductive zone are not electrically connected; and drawing a drawn conductive layer on the notably paintable non-conductive zone of the pattern by an end user, wherein the drawn conductive layer has conductive particles linking the electrical particle blocks in the notably paintable non-conductive zone, thereby electrically connecting the electrical particle blocks to complete a circuit line. 1. A method of using a hand-made circuit board for learning , comprising:providing a hand-made circuit board which comprises a substrate and a medium layer disposed on a surface of the substrate to form a pattern, wherein the medium layer has a notably paintable non-conductive zone configured with a plurality of electrical blocks, and the electrical blocks are discontinuously distributed in the notably paintable non-conductive zone, so that the electrical blocks on at least one cross-section of the notably paintable non-conductive zone are not electrically connected; anddrawing a drawn conductive layer on the notably paintable non-conductive zone of the pattern by an end user, wherein the drawn conductive layer has conductive particles linking the electrical particle blocks in the notably paintable non-conductive zone, thereby electrically connecting the electrical particle blocks to complete a circuit line.2. The method according to claim 1 , wherein the medium layer further has a conductive zone configured with a plurality of electrical blocks claim 1 , and the ...

Method for deposting a functional material on a substrate

A method for depositing a functional material on a substrate is disclosed. A plate having a first surface and a second surface is provided. A layer of light scattering material is applied onto the first surface of the plate, and a layer of reflective material is applied onto the second surface of the plate. After a group of wells has been formed on the second surface of the plate, a layer of light-absorbing material is applied on the second surface of the plate. Next, the wells are partially filled with a functional material. The plate is then irradiated with a pulse of light to heat the light-absorbing material between the bottom of the well and the functional material. This heats the gas in the tillage between the light absorbing material and the functional material to increase the pressure in gas to expel the functional material from the wells onto a receiving substrate.

METHOD FOR FORMING INSULATING LAYER, METHOD FOR PRODUCING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE

By flexographic printing or inkjet printing, insulating ink is applied on a wiring pattern in accordance with a predetermined printing pattern. The insulating ink is hardened, whereby an insulating layer is formed. A contact region of the wiring pattern that is used for electrical connection with a conductor other than the wiring pattern is not covered with the insulating layer. The printing pattern is delimited by the outline of a non-printing region including the contact region. The wiring pattern includes, in the non-printing region, a trunk wiring line leading, to the contact region, from a position on the wiring pattern at which the wiring pattern overlaps with the outline and a branch wiring line extending from a point on at least one side of the trunk wiring line and terminating without making contact with the outline. 1. An electronic device comprising:a wiring pattern formed on a base; andan insulating layer that covers the wiring pattern in such a way that a region that belongs to the wiring pattern and is used for electrical connection with a conductor other than the wiring pattern is exposed, the region hereinafter referred to as a contact region, wherein a trunk wiring line leading, to the contact region, from a position on the wiring pattern at which the wiring pattern overlaps with an outline of the non-covered region, and', 'a branch wiring line extending from a point on at least one side of the trunk wiring line, except for both ends of the trunk wiring line, and terminating without making contact with the outline., 'in a non-covered region including the contact region, the wiring pattern includes'}2. The electronic device according to claim 1 , whereinan insulating material that is a same as an insulating material used for a formation of the insulating layer continuously adheres to a portion of the wiring pattern which is exposed in the non-covered region, the portion including the position on the wiring pattern at which the wiring pattern overlaps ...

UV-CURABLE INK COMPOSITION, METHOD FOR PRODUCING BEZEL PATTERN OF DISPLAY SUBSTRATE USING SAME, AND BEZEL PATTERN PRODUCED THEREBY

The present invention relates to a UV-curable ink composition, a method for producing a bezel pattern of a display substrate using same, and a bezel pattern produced thereby, the UV-curable ink composition comprising a colorant, an epoxy compound, an oxetane compound and a photopolymerization initiator, wherein a content ratio of the epoxy compound to the oxetane compound is 1:0.5 to 1:6 and the curing dose amount of the ultraviolet curable ink composition is 20 to 5,000 mJ/cm. 1. A UV-curable ink composition comprising a colorant , an epoxy compound , an oxetane compound and a photopolymerization initiator , wherein a content ratio of the epoxy compound to the oxetane compound is 1:0.5 to 1:6 and the curing dose amount of the ultraviolet curable ink composition is 20 to 5 ,000 mJ/cm.2. The UV-curable ink composition of claim 1 , further comprising one or more selected from the group consisting of a surfactant claim 1 , an adhesion promoter claim 1 , a diluent claim 1 , and a photosensitizer.3. The UV-curable composition of claim 1 , wherein the oxetane compound comprises an oxetane compound having one oxetane ring and an oxetane compound having two oxetane rings.4. The UV-curable composition of claim 3 , wherein a content ratio of the oxetane compound having one oxetane ring to the oxetane compound having two oxetane rings is 1:16 to 1:3.5. The UV-curable composition of claim 1 , wherein a content of the epoxy compound is 5 to 50 wt % with respect to the total weight of the UV-curable ink composition.6. The UV-curable composition of claim 1 , wherein a content of the oxetane compound is 15 to 75 wt % with respect to the total weight of the UV-curable ink composition.7. The UV-curable composition of claim 1 , wherein the photopolymerization initiator is an iodonium salt or a sulfonium salt.8. The UV-curable composition of claim 1 , wherein a content of the photopolymerization initiator is 1 to 15 wt % based on the total weight of the UV-curable ink composition.9. ...

Conductive paste, method for forming conductive pattern, and object with printed conductive pattern

A conductive paste providing an intended conductive pattern having high linearity and having no disconnection, short circuits, or the like even in the case of performing gravure offset printing with a gravure plate having a bezel pattern. A conductive paste for bezel-pattern printing performed by a gravure offset printing process includes conductive metal particles (A); an organic compound (B) that is solid at 50° C. and has a boiling point of more than 300° C. at normal pressure; an organic compound (C) that is liquid at 50° C. and has a boiling point of more than 300° C. at normal pressure; and an organic solvent (D) that is not the (B) or (C), does not have reactivity with the (B) or (C), and has a boiling point of 170° C. to 300° C. at normal pressure. A method for forming a conductive pattern by a gravure offset printing process employs the above-described conductive paste.

SYSTEMS FOR APPLYING ELECTRICALLY CONDUCTIVE TAPE TRACES TO A SUBSTRATE AND METHODS OF USE THEREOF

A system for forming a conductive tape trace on a substrate includes a segment feeder arm configured to feed segments of conductive tape to the substrate and a segment placement armature configured to grasp and position the conductive tape segments in a predetermined pattern on the substrate. The conductive tape segments include a plurality of conductive tape bend segments and at least one conductive tape branch segment. The segment placement armature is configured to position and overlap the plurality of conductive tape bend segments on the substrate to form a conductive tape bend and position the at least one conductive tape branch segment in contact with and extending from the conductive tape bend. A roller can be included and be configured to apply a force onto the conductive tape segments positioned on the substrate. A welder that welds the conductive tape segments together can also be included. 1. A system for applying conductive tape to a substrate comprising:a segment feeder arm configured to feed segments of conductive tape to the substrate; anda segment placement armature configured to grasp and position segments of the conductive tape on the substrate;wherein the segment feeder arm feeds segments of conductive tape towards the substrate and the segment placement armature applies each segment in a predetermined pattern on the substrate.2. The system of claim 1 , wherein the segments of conductive tape comprise a plurality of conductive tape bend segments and at least one conductive tape branch segment.3. The system of claim 2 , wherein the segment placement armature is configured to position the plurality of conductive tape bend segments on the substrate to form a conductive tape bend.4. The system of claim 3 , wherein the segment placement armature is configured to position the plurality of conductive tape bend segments overlapping each other to form the conductive tape bend.5. The system of claim 3 , wherein the segment placement armature is configured ...

Sensing Decal

A method of manufacturing a sensing decal (), a sensing decal and a method of providing a sensing decal to a device (), in which the method of manufacture providing a flexible release layer () having a substantially non-uniform surface () and printing a conductive ink layer () onto the non-uniform surface. An adhesive layer () is printed onto the conductive ink layer to produce the sensing decal. The decal can then be applied to a surface () of a device and the flexible release layer is removed. 1. A method of manufacturing a sensing decal for use in the production of a sensor , comprising the steps of:providing a flexible release layer having a substantially non-uniform surface;printing a conductive ink layer on said substantially non-uniform surface; andprinting an adhesive layer onto said conductive ink layer; whereinsaid step of printing a conductive ink layer comprises pre-printing at least one patterned element, said patterned element providing a predetermined set of electrical properties for formation of a sensor.2. The method of claim 1 , wherein said at least one patterned element comprises a plurality of conductive islands thereby enabling a mask to be formed.3. The method of claim 1 , wherein said at least one patterned element comprises a plurality of rows of conductive ink spaced apart to provide areas of conduction and areas of insulation.4. The method of claim 1 , wherein said at least one patterned element comprises a first portion with a first number of layers of conductive ink and a second portion with a second number of layers of conductive ink.5. The method of claim 1 , said method further comprising a roll-to-roll printing process.6. The method of claim 1 , wherein said steps of printing comprise any one of the following:screen printing; ink jet printing; 3D printing; transfer printing by stamping; flexographic printings; gravure printing.7. The method of claim 1 , wherein said step of providing said flexible release layer comprises creating ...

SILVER PARTICLE COATING COMPOSITION

The present invention provides a silver coating composition that develops excellent conductivity (low resistance value) by low-temperature and short-time calcining, and that is excellent in fine-line drawing performance and suitable for intaglio offset printing. A silver particle coating composition comprising: silver nano-particles (N) whose surfaces are coated with a protective agent containing an aliphatic hydrocarbon amine; a surface energy modifier; and a dispersion solvent. The surface energy modifier may be selected from the group consisting of a silicon-based surface energy modifier and an acrylic surface energy modifier. The coating composition preferably further comprises silver microparticles (M). The silver coating composition is suitable for intaglio offset printing. 1. A silver particle coating composition comprising:silver nano-particles (N) whose surfaces are coated with a protective agent containing an aliphatic hydrocarbon amine;a surface energy modifier; anda dispersion solvent.2. The silver particle coating composition according to claim 1 , whereinthe aliphatic hydrocarbon amine in the silver nano-particles (N) comprises an aliphatic hydrocarbon monoamine (A) comprising an aliphatic hydrocarbon group and one amino group, said aliphatic hydrocarbon group having 6 or more carbon atoms in total, andfurther comprises at least one of: an aliphatic hydrocarbon monoamine (B) comprising an aliphatic hydrocarbon group and one amino group, said aliphatic hydrocarbon group having 5 or less carbon atoms in total; and an aliphatic hydrocarbon diamine (C) comprising an aliphatic hydrocarbon group and two amino groups, said aliphatic hydrocarbon group having 8 or less carbon atoms in total.3. The silver particle coating composition according to claim 2 , wherein the aliphatic hydrocarbon monoamine (A) is at least one selected from the group consisting of a linear alkylmonoamine having a linear alkyl group having 6 or more and 12 or less carbon atoms claim 2 , ...

PROCESS FOR MANUFACTURING A FUNCTIONAL FLEXIBLE CELLULOSIC SUBSTRATE, SETUP FOR IMPLEMENTING SAID PROCESS

A process for manufacturing a flexible cellulosic substrate comprises at least one functional circuit and/or at least one functional board. The flexible cellulosic substrates are made functional by printing with a functional ink, which provides good performance (signal speed/dielectric properties of the substrate), is economical, thermally and dimensionally stable, and is able to be produced simply and reproducibly at an industrial rate. The process starts with an aqueous fibrous suspension comprising paper pulp and/or a pulp of (micro/macro) cellulose fibrils and produces a wet fibrous mat from this suspension. One of the faces of the wet fibrous mat is printed by means of at least one functional ink capable of transmitting, emitting, and/or processing at least one signal in order to produce at least one topography comprising at least one track for circulation of the signal. Printed circuits and functional boards are obtained by the manufacturing process. 1. Process for manufacturing a flexible cellulosic substrate which comprises at least one functional circuit and/or is akin to at least one functional board , this circuit and/or this board being capable of carrying , circulating , and/or processing a signal , in particular an electrical signal in the case of printed electrical circuits or circuit boards , characterized in that it essentially consists of:a) preparing or making use of an aqueous fibrous suspension comprising paper pulp and/or pulp of cellulose fibrils;b) producing a wet fibrous mat from this suspension;c) draining this wet fibrous mat;c′) optionally, pressing this wet fibrous mat;d) printing one of the faces of the wet fibrous mat using at least one functional ink capable of transmitting, emitting, and/or processing at least one signal, in order to produce at least one topography comprising at least one track for circulation of the signal, optionally at least one component capable of acting on the signal;e) optionally, coating the printed face of ...

CAPACITIVE DEVICES AND METHODS OF FABRICATING SAME

Described herein are capacitive devices and methods for producing same using printing methods such as flexography, gravure, offset, lithography, etc. The capacitive devices are formed from printing conductive inks, non-conductive inks, masking ink layers, graphic artwork layers, and overprint layers on a substrate. Interaction between a conductive ink layer of the capacitive device with a touch screen device of a computer, tablet, smart phone, etc. causes a capacitive effect that allows information coded in capacitive device to be read, leading to an activity such as the download of content to the device having the touch screen. 1. A method of preparing a capacitive device , comprising: i) printing the electrically conductive ink layer on the substrate, and printing the non-electrically conductive ink layer over the electrically conductive layer or', 'ii) printing the non-electrically conductive ink layer on the substrate, and printing the electronically conductive ink layer over the non-electronically conductive ink layer; and, 'printing an electrically conductive ink layer and a non-electrically conductive ink layer on a substrate in a selected sequence, wherein the selected sequence comprisesprinting one or more masking layers over the electrically conductive ink layer and the non-electrically conductive ink layer to cover the electrically conductive ink layer and non-conductive ink layer.2. The method of claim 1 , further comprising printing graphic artwork over the one or more masking layers.3. The method of claim 1 , further comprising printing one or more layers of an overprint over the graphic artwork.4. The method of claim 1 , wherein the one or more masking layers hide the electrically conductive ink layer from view.5. (canceled)6. (canceled)7. The method of claim 1 , further comprising applying a primer to the substrate prior to printing the electrically conductive ink layer and the non-electrically conductive ink layer on the substrate in the selected ...

SYSTEMS AND METHODS FOR CREATING A HONEYCOMB CORE WITH INTEGRATED ELECTRONIC COMPONENTS

A honeycomb core includes a honeycomb substrate comprised of a number of sheets. A number of traces are printed onto the sheets of the honeycomb substrate. A number of integrated electronic devices are disposed within the honeycomb substrate. The integrated electronic devices are electrically coupled to the traces. 1. A honeycomb core comprising:a honeycomb substrate comprised of a number of sheets; anda number of traces printed onto the sheets of the honeycomb substrate.2. The honeycomb core of claim 1 , wherein the traces include electrically conductive ink.3. The honeycomb core of claim 1 , further comprising an electronic device disposed in the honeycomb substrate and connected to the traces.4. The honeycomb core of claim 3 , wherein the electronic device is printed onto one of the sheets.5. The honeycomb core of claim 3 , wherein the electronic device is disposed within a cell defined by the honeycomb substrate.6. The honeycomb core of claim 1 , further comprising vias disposed through the sheets of the honeycomb substrate.7. The honeycomb core of claim 6 , wherein the sheets are bonded together along bond lines claim 6 , and the vias are disposed at the bond lines.8. The honeycomb core of claim 7 , wherein the vias are grommets that are disposed through the sheets and each define a hole.9. The honeycomb core of claim 8 , wherein the vias are electrically conductive.10. The honeycomb core of claim 7 , wherein the vias are electrically conductive rivets that extend through the sheets.11. The honeycomb core of claim 7 , wherein the vias are connected to the traces.12. Fabricating a portion of an aircraft using the honeycomb core of .13. A honeycomb core comprising:a honeycomb substrate comprised of a number of sheets and defining a number of cells; andan electronic device disposed in the honeycomb substrate.14. The honeycomb core of claim 13 , further comprising a number of traces printed onto the sheets of the honeycomb substrate.15. The honeycomb core of claim ...

Wiring board

A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less.

METHODS OF FABRICATING ELECTRONIC AND MECHANICAL STRUCTURES

The present invention relates to the fabrication of complicated electronic and/or mechanical structures and devices and components using homogeneous or heterogeneous 3D additive build processes. In particular the invention relates to selective metallization processes including electroless and/or electrolytic metallization. 120-. (canceled)21. A method of fabricating a 3D structure , comprising:providing a substrate having at least one integrated circuit disposed thereon;depositing onto the substrate using 3D printing a first dielectric material to create a first patterned layer having at least one region in which the first dielectric material is deposited and at least one void region in which no first dielectric material is deposited;depositing, on the first patterned layer, a second dielectric material to create a second patterned layer having at least one region in which the second dielectric material is deposited and at least one void region in which no second dielectric material is deposited; anddepositing a metal into selected portions of one or both of the at least one void regions of the first and second patterned layers, thereby providing a 3D structure.22. The method of claim 21 , wherein the 3D structure is an electronic structure.23. The method of claim 21 , wherein the substrate comprises a circuit board.24. The method of claim 21 , wherein the substrate comprises a nonplanar surface.25. The method of claim 21 , wherein one or both of the first and second patterned layers have portions of differing thickness.26. The method of claim 21 , wherein the first and second dielectric materials comprise the same material.27. The method of claim 21 , wherein the first and second dielectric materials comprise different materials.28. The method of claim 21 , wherein one or both of the first and second dielectric materials comprise a photoimageable material.29. The method of claim 28 , comprising patterning the photoimageable material using a photolithographic ...

Microcontact printing with high relief stamps in a roll-to-roll process

A method includes unwinding a web material from a support and providing an elastomeric stamp, wherein the stamp includes a base surface and an arrangement of pattern elements extending away from the base surface, and wherein each pattern element has a stamping surface with a lateral dimension of less than about 5 microns and a height with respect to the base surface, and wherein an aspect ratio of the height to the lateral dimension is at least 1.5. The stamping surfaces of the pattern elements are inked with an ink composition including a functionalizing molecule, wherein the functionalizing molecule includes a functional group selected to bind to said substrate material. The stamping surface of the pattern elements is contacted with a major surface of the web material for a print time sufficient to bind the functional group with the web material to form a self-assembled monolayer (SAM) of the functionalizing material on the major surface of the web material according to the arrangement of pattern elements on the stamping surface.

Z-fold multi-element substrate structure

A folded micro-wire substrate structure includes a transparent folded flexible substrate having a first side and a second side opposed to the first side. The flexible substrate has a first portion and a second portion adjacent to the first portion of the flexible substrate. The flexible substrate has at least a first fold between the first and second portions so that the first portion is aligned with the second portion in a perpendicular direction. One or more electrical conductors is located in or on the flexible substrate, at least one electrical component is located on or in the flexible substrate in the first portion. At least one optical element is located on or in the flexible substrate in the second portion located so that the optical element directs light to or from the electrical component.

GLASS SUBSTRATE PROVIDED WITH COPPER-BASED CONDUCTIVE STRIPS

A glazing includes at least one glass sheet provided on one of the faces with an electrical network having resistance strips and collector strips, in which at least one portion of one face includes at least one strip obtained from an electrically conductive composition including a silver paste, the strip being in contact with another strip obtained from an electrically conductive composition including a copper paste, the other strip obtained from an electrically conductive composition including a copper paste being completely covered with a protective enamel layer. 1. A glazing comprising at least one glass sheet provided on a face thereof with an electrical network consisting of resistance strips and collector strips , wherein at least one portion of the face comprises at least one silver strip obtained from an electrically conductive composition comprising a silver paste , said silver strip being in contact with another copper strip obtained from an electrically conductive composition comprising a copper paste , said other copper strip obtained from an electrically conductive composition comprising a copper paste being completely covered with a protective enamel layer.2. The glazing as claimed in claim 1 , wherein the contact between the copper and silver strips is made at ends of the strip obtained from the electrically conductive composition comprising the copper paste.3. The glazing as claimed in claim 1 , wherein the copper strip partially covers the silver strip.4. The glazing as claimed in claim 1 , wherein the silver strip partially covers the copper strip.5. The glazing as claimed in claim 1 , wherein the copper strip and/or the silver strip is positioned on an enamel layer deposited on the glass sheet.6. The glazing as claimed in claim 5 , wherein the electrically conductive composition comprising the copper paste comprises between 70% and 90% by weight of copper powder and less than 15% by weight of glass frit.7. The glazing as claimed in claim 1 , ...

METHOD FOR PRODUCING A SUBSTRATE STRUCTURED BY NANOWIRES, PRODUCED SUBSTRATE, AND USE OF THE SUBSTRATE

The invention relates to a method for producing a substrate structured by nanowires, characterized in that no lubricant and no lithographic resist mask is used in the method, and only by moving a donor substrate having nanowires relative to a substrate and by locally tribological properties on the surface of the substrate, a specified number of nanowires is deposited selectively at locally defined points of the substrate. The invention further relates to a substrate that can be produced using the method according to the invention, and which selectively contains a specified number of nanowires on a surface at locally defined points. The invention further relates to the use of the substrate according to the invention in microelectronics, microsystems technology, and/or micro-sensor systems. 114-. (canceled)15. A method for the production of a substrate structured with nanowires , comprising the steps of:a) providing a substrate which, on one surface, comprises at least one first region with first tribological properties and at least one second region with second tribological properties, the first and second tribological properties being different and the first region contacting the second region at least in regions;b) pressing a donor substrate comprising nanowires with a specific contact pressure on the first region of the substrate so that the nanowires contact the first region of the substrate at least in regions; andc) moving the donor substrate relative to the substrate in the direction from the first region over at least the second region at a specific speed;wherein, no lubricant and no lithographical resist mask are utilized in the method and, merely by moving the donor substrate, in step c), and the different tribological properties of the two regions, a specific number of nanowires is deposited selectively at locally defined sites of the first and/or second region.16. The method according to claim 15 , wherein the different tribological properties are ...

PRINTED WIRING LINE, ELECTRONIC DEVICE, TOUCH PANEL, GRAVURE PLATE, PRINTED WIRING LINE FORMATION METHOD, TOUCH PANEL PRODUCTION METHOD, AND ELECTRONIC DEVICE PRODUCTION METHOD

A printed wiring line formed on a substrate connects two different points on the substrate which are connectable by another printed wiring line with a shape of a straight-line segment and has a shape corresponding to at least one of: 1) a shape with no linear part parallel to the straight-line segment; 2) a shape with line segments connected in series, each line segment having a shape with no linear part parallel to the straight-line segment; 3) a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment, length of the part parallel to the straight-line segment being not more than length of the straight-line segment; and 4) a shape in which line segments are connected in series, each line segment having a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment. 1. A gravure plate for gravure offset printing , the gravure plate comprising:a plate having a top surface configured to come into contact with a blanket, wherein a recess having a bottom surface and two side surfaces is formed on the top surface, the recess defining a pattern of a wiring line to be printed by the gravure plate; andprojections formed on the bottom surface of the recess, wherein the projections protrude inside the recess to reduce a volume of the recess by a total volume of the projections which protrude therein.2. The gravure plate according to claim 1 , whereina top of each of the projections is located between the top surface of the plate and the bottom surface of the recess, inclusive of the top surface of the plate and exclusive of the bottom surface of the recess.3. The gravure plate according to claim 1 , whereinthe projections are formed in a row in a longitudinal direction of the recess and only one of the projections is present in a width direction of the recess between the two side surfaces.4. The gravure plate according to claim 2 , whereinthe projections are formed in a row ...

TRANSFER DEVICE FOR ELECTRONIC DEVICE AND TRANSFER METHOD FOR ELECTRONIC DEVICE

A calibration plate is arranged on a support surface of a table. The calibration plate has first and second alignment marks arranged in one direction, and third and fourth alignment marks arranged in another direction that is orthogonal to the one direction. The first and second alignment marks that move in a front-and-rear direction are imaged by a first camera. The one direction of the calibration plate is made parallel to a front-and-rear direction based on the image. The positions of second and third cameras are adjusted based on the third and fourth alignment marks. The second and third cameras, positions of which have been adjusted, are moved to positions below the transfer roller, and a reference line formed at the transfer roller is imaged by the second and third cameras. An orientation of a rotation shaft of the transfer roller is adjusted in a plane parallel to the support surface based on these images. 1. A transfer device for an electronic device , the transfer device being able to carry out calibration using a calibration plate having first and second alignment marks arranged in one direction and third and fourth alignment marks arranged in another direction orthogonal to the one direction , and transferring a transfer article that constitutes the electronic device to an object , comprising:a table having a support surface that can selectively support the calibration plate and the object;a table supporter that supports the table such that the table is movable in first and second directions that are parallel to the support surface and orthogonal to each other, and supports the table such that the table is rotatable about an axis orthogonal to the support surface;a movement driver that moves the table supporter in the first direction among first, second, third and fourth positions;a transfer roller that has a rotation shaft, and an outer peripheral surface that can hold the transfer article and includes a reference line parallel to the rotation shaft;a ...

HAND-MADE CIRCUIT BOARD

A hand-made circuit board includes a substrate and a medium layer disposed on a surface of the substrate to form a pattern. The medium layer has a non-conductive zone configured with a plurality of electrical blocks. The electrical blocks are discontinuously distributed in the non-conductive zone, so that the electrical blocks on at least one cross-section of the non-conductive zone are not electrically connected. In addition, the medium layer has a conductive zone configured with a plurality of electrical blocks. The electrical blocks are continuously distributed in the conductive zone, so that the electrical blocks on at least one cross-section of the conductive zone are electrically connected. 1. A hand-made circuit board , comprising:a substrate; anda medium layer disposed on a surface of the substrate to form a pattern, wherein the pattern has a non-conductive user-drawing zone configured with a plurality of electrical blocks, and the electrical particle blocks are discontinuously distributed in the non-conductive user-drawing zone, so that the electrical particle blocks on at least one cross-section of the non-conductive user-drawing zone are not electrically connected.2. The hand-made circuit board according to claim 1 , wherein the pattern further has a conductive zone configured with a plurality of electrical particle blocks claim 1 , and the electrical particle blocks are continuously distributed in the conductive zone claim 1 , so that the electrical particle blocks on at least one cross-section of the conductive zone are electrically connected.3. The hand-made circuit board according to claim 2 , wherein the non-conductive user-drawing zone or the conductive zone is a resistance-adjustable zone.4. The hand-made circuit board according to claim 1 , wherein the electrical particle blocks are conductive blocks claim 1 , conductive wires claim 1 , conductive sheets claim 1 , conductive inks claim 1 , conductive tapes claim 1 , semi-conductive materials claim ...

Support structure for lighting devices, corresponding lighting device and method

According to the present disclosure, a support structure for lighting devices, e.g. LED lighting devices, is provided with an electrically insulating core layer having a first and a second mutually opposed surfaces, with mounting locations for electrically-powered light radiation sources on the first surface, a network of electrically conductive lines printed on said first surface, at least some of said electrically conductive lines extending between the mounting locations and fixed locations on the first surface, and electrical distribution lines of electrically conductive material on the second surface of the core layer, and electrically conductive vias extending through core layer and electrically coupling the electrical distribution lines on the second surface with the electrically conductive lines at said fixed locations on the first surface. 1. A support structure for lighting devices , the structure including:an electrically insulating core layer having first and second opposed surfaces, with mounting locations for electrically-powered light radiation sources on said first surface,a network of an electrically conductive lines printed on said first surface, said network including electrically conductive lines extending between at least some of said mounting locations and fixed locations on said first surface,electrical distribution lines of electrically conductive material on said second surface of the core layer, andelectrically conductive vias extending through said core layer, said conductive vias electrically coupling said electrical distribution lines on said second surface with said network of electrically conductive lines at said fixed locations on said first surface.2. The support structure of claim 1 , wherein said network of electrically conductive lines includes electrically conductive ink or paste printed on said first surface of the core layer.3. The support structure of claim 1 , wherein said electrically conductive vias include printed ...