СПОСОБ ВСТРАИВАНИЯ КОМПОНЕНТА В ОСНОВАНИЕ

Изобретение относится к способу, согласно которому полупроводниковые компоненты, образующие часть электронной схемы, или по меньшей мере некоторые из таких компонентов, встраивают в основание, например, в печатную плату в процессе ее изготовления. Технический результат - создание способа, посредством которого бескорпусные микросхемы могут быть встроены в основание надежным, но экономичным образом. Достигается тем, что в основании выполняют сквозные отверстия для полупроводниковых компонентов, причем отверстия проходят между первой и второй поверхностями основания. После выполнения отверстий на вторую поверхность структуры основания наносят полимерную пленку, причем полимерная пленка закрывает сквозные отверстия для полупроводниковых компонентов со стороны второй поверхности структуры основания. Перед отверждением полимерной пленки или после ее частичного отверждения в отверстия вводят полупроводниковые компоненты со стороны первой поверхности. Полупроводниковые компоненты прижимают к полимерной ...

СПОСОБ ИЗГОТОВЛЕНИЯ МЕЖСЛОЙНОГО ПЕРЕХОДА МЕЖДУ ПЕЧАТНЫМИ ПРОВОДНИКАМИ НА КРИСТАЛЛИЧЕСКОЙ ИЛИ ПОЛИКРИСТАЛЛИЧЕСКОЙ ПОДЛОЖКЕ

Изобретение относится к радиоэлектронике, а точнее к технологии производства печатных плат. Технический результат изобретения - создание способа изготовления межслойного перехода между печатными проводниками на кристаллической или поликристаллической подложке, улучшающего адгезию за счет изменения свойств кристалла. Достигается тем, что в способе изготовления межслойного перехода между печатными проводниками на кристаллической или поликристаллической подложке берут подложку с переходными отверстиями, при помощи фоторезиста маскируют ее поверхности, за исключением колец вокруг переходных поверхностей. Располагают подложку в импланторе, экспонируют ее потоком ионов металла с одновременным вращением вокруг оси, перпендикулярной плоскости подложки, причем подложку размещают под углом к потоку ионов, обеспечивающим наилучшее их попадание в переходные отверстия. Извлекают заготовку из имплантора, переворачивают ее, снова располагают в импланторе и повторяют экспонирование с другой стороны. Извлекают ...

Способ изготовления многослойной печатной платы

... 1. Способ изготовления многослойной печатной платы, включающий следующие этапы: получение заготовок, получение отверстий, термостабилизация заготовок, подготовка поверхности, получение рисунка, травление, прессование МПП, подготовка отверстий МПП перед металлизацией, предварительное меднение, прямая металлизация, основное меднение, нанесение защитных и финишных покрытий, нанесение токопроводящих паст, оплавление сплава олово-свинец, лужение, получения защитной маски, обрезка контура, маркирование, консервация, упаковка, отличающийся тем, что операцию маркирования производят совместно с этапом сверления отверстий после прессования слоев многослойной печатной платы, причем маркирование осуществляют на свободном месте технологического поля многослойной печатной платы текстовой строкой в виде маркировочных знаков, выполненных сверлением отверстий определенного диаметра по их контуру.2. Способ изготовления многослойной печатной платы по п. 1, отличающийся тем, что текстовая строка содержит следующую ...

Printed circuit board with integrated cooling arrangement

The arrangement includes at least one conductor foil or printed circuit board (1,3) which is thermally connected with a fluid channel board (7) through a thermally conductive, but electrically isolating thermal layer (5,5'). The thermal layer is directly in thermal contact with solder (12) in at least one soldering hole (13,13') which proceeds through the at least one conductor foil or printed circuit board, and which is electrically connected with at least one soldering connection element (10,10') of an electric component (11,11').

Verfahren zum Formen von elektrischen Verbindungen in laminierten Kontaktlöchern

Elektrischer Verbinder für Differenz-Signale

Arrangement for quality control and monitoring of through-plated multilayer printed circuit boards

An arrangement for quality control and monitoring of through-plated multilayer printed circuit boards, at least one monitoring loop being formed in the multilayer printed circuit board, which loop has at least one residual ring whose geometrical size is reduced at least in comparison with residual rings which are not located in a monitoring loop on the multilayer printed circuit board.

Multilayered printed circuit board for components has conductive surfaces applied in layers and an electronic component with feedthroughs to dissipate heat

Conductive copper surfaces (2) are placed in layers. Feedthroughs (10) from the layers are arranged in a support area for an electronic component so as to dissipate heat. In addition to the feedthroughs, there is a heat sink (12) that runs through the layers and makes a direct contact with each conductive surface.

Verfahren zur Herstellung von Leiterplatten und Leiterplatte

Dargestellt und beschrieben ist eine Leiterplatte mit einem Basismaterial (2) aus Isolierstoff als Träger von Leiterbahnen (3), wobei die fertigen Leiterbahnen (3) eine Dicke von mindestens 100 mum aufweisen, sowie ein Verfahren zur Herstellung einer derartigen Leiterplatte (1). DOLLAR A Mit dem erfindungsgemäßen Verfahren kann eine Leiterplatte durch folgende Schritte sehr einfach und zuverlässig hergestellt werden: DOLLAR A È Strukturieren der Leiterfolienschicht zur Erzeugung der Leiterbahnen, DOLLAR A È Verpressen mit einem isolierenden Füllmaterial, so daß sowohl die Kanäle zwischen den Leiterbahnen mit dem Füllmaterial vollständig gefüllt als auch die Oberfläche der Leiterbahnen von dem Füllmaterial bedeckt sind, und DOLLAR A È Anbinden der im Inneren der Leiterplatte angeordneten Leiterbahnen an Anschlußflächen auf der Oberfläche der Leiterplatte durch Bohren und Metallisieren von Löchern.

FILTERSTRUKTUREN FÜR SCHNITTSTELLEN ZWISCHEN INTEGRIERTEN SCHALTUNGEN

Elektrostatische Schutzvorrichtung und Verfahren zu ihrer Herstellung

Mehrlagen-Leiterplatte

WIRE SCRIBED INTERCONNECTION BOARDS.

The invention concerns an interconnection board for connecting electronic, electro-optical and/or optical devices and methods of manufacturing such boards. The interconnections are formed by scribing electrically or optically conductive filaments (22) to form a signal conductor layer. The interconnection board comprises a base (30) as a support member, a signal conductor layer (22) laminated to the base and a surface conductor layer (12, 14) laminated to the signal conductor layer. The interlayer connections between the signal conductor layer and the surface conductor layer are formed by segments (24) of the conductive filaments of the signal conductor layer displaced from the signal conductor layer to the vicinity of the surface of the interconnection board to form part of, or connect with, the surface conductive pattern (12, 14). ...

CONNECTOR MEANS

Circuit board with coaxial conductors

Discloses a method for making a coaxial conductor interconnection circuit board, as well as the board per se, by providing a first conductive coating on a substrate, scribing an insulated wire signal conductor pattern on the first coating and a second conductive coating over the wire to provide a conductive shield surrounding the wire, eliminating conductive material from the coatings in clearance areas at terminal points and drilling at the terminal points by laser beam or mechanical drilling to expose the signal conductor.

A method of manufacturing a printed circuit board

Alternating voided areas of anti-pads

RF WAVEGUIDE SIGNAL TRANSITION APPARATUS

Partially voided anti-pads

CROSS CONNECTION BY PERMUTATIONS OF MEANS OF CONFIGURABLE PRINTED CIRCUIT BOARDS

MEHRLAGIGE LEITERPLATTE MIT LEITENDEN TESTFLÄCHEN SOWIE VERFAHREN ZUM BESTIMMEN EINES VERSATZES EINER INNENLAGE

MEHRSCHICHTLEITERPLATTE SOWIE VERFAHREN ZU IHRER HERSTELLUNG

MULTILEVEL MOUNTED BOARDS WITH COPPER-FILLED THROUGHHOLES

Method for manufacturing an electronic module

Die vorliegende Erfindung betrifft em elektronisches Modul mit zumindest emer Komponente, die in Isoliermaterial eingebettet ist. Das elektronische Modul umfasst ein erstes Isoliermaterial mit einer ersten Oberfläche und einer zweiten Oberfläche und einer Dicke zwischen der ersten Oberfläche und der zweiten Oberfläche, zumindest eine Öffnung durch das erste Isoliermaterial, ein zweites Isoliermaterial auf der zweiten Oberfläche des ersten Isoliermaterials, zumindest eine Komponente, die in das zweite Isoliermaterial eingebettet ist, zumindest eine leitende Struktur in der zumindest einen Öffnung, wobei die zumindest eine leitende Struktur eine erste Oberfläche und eine zweite Oberfläche hat, wobei die zweite Oberfläche dem zweiten Isoliermaterial zugewandt ist und die erste Oberfläche vom zweiten Isoliermaterial abgewandt ist und eine Distanz zwischen der ersten Oberfläche des ersten Isoliermaterials und der zweiten Oberfläche der zumindest einen leitenden Struktur geringer oder größer ...

Leiterplattenstruktur

The invention relates to a printed circuit board structure (7) having at least one dielectric insulating layer (2, 5o, 5u) and at least one conducting layer (3, 4, 6o, 6u), wherein within the at least one insulating layer (5a), a layer (5) of a dielectric heat-conductive material is provided, which layer (5) is located in close proximity to or in contact with an inner conductor arrangement (3). In the immediate vicinity of or in contact with the layer (5) made of a dielectric heat-conductive material, a further heat-conductive layer (11), preferably an electrically conductive metal layer, can thereby be provided. Also, an at least heat-conductive, preferably electrically conductive, through-plating (9) can be guided from one conductor section (6om) located externally on the printed circuit board to the inside of the printed circuit board at least close to the layer (5) made of a dielectric heat-conductive material.

MULTILAYER BOARD AS WELL AS PROCEDURE FOR YOUR PRODUCTION

MARKIERUNG ZUM MARKIEREN BZW. CODIEREN EINES GEGENSTANDS SOWIE VERFAHREN ZUR HERSTELLUNG EINER DERARTIGEN MARKIERUNG UND VERWENDUNG

Bei einer Markierung zum Markieren bzw. Codieren eines Gegenstands ist vorgesehen, daß eine Mehrzahl von aus einem leitenden bzw. leitfähigen Material bestehenden Markierungselementen (4, 5, 6) vorgesehen ist, daß die Markierungselemente (4, 5, 6) auf einem aus einem isolierenden Material bestehenden Teilbereich des Gegenstands aufbringbar und/oder in diesen integrierbar sind, daß die Markierungselemente (4, 5, 6) zur Ausbildung eines Codes wenigstens teilweise miteinander durch jeweils wenigstens ein aus einem leitenden bzw. leitfähigen Material bestehendes Verbindungselement (7, 8) verbunden bzw. verbindbar sind und daß die Markierungselemente (4, 5, 6) zur Erfassung des Codes wenigstens teilweise durch einen leitenden Zustand zwischen einzelnen Markierungselementen (4, 5, 6) feststellende Elemente kontaktierbar sind.Darüber hinaus wird ein Verfahren zur Herstellung einer derartigen Markierung als auch eine Verwendung einer derartigen Markierung im Zusammenhang mit einer insbesondere ...

PROTECTION STRUCTURES AGAINST VARIABLE TENSION AND PROCEDURES FOR THE PRODUCTION

MULTI-LAYER PRINTED CIRCUIT BOARD FOR HIGH TENSIONS AND HIGH ONES OF RIVERS AS WELL AS PROCEDURES FOR THE PRODUCTION OF SUCH

Procedure for manufacturing from circuit path arrangements to kind of the printed circuits with two or several circuit path levels

Electronic transformer/inductor devices and methods for making same

Defferential connector footprint for a multi-layer circuit board

ELECTRONIC APPARATUS PROVIDED WITH AN ELECTRONIC CIRCUIT SUBSTRATE

The present invention provides an electronic apparatus provided with an electronic circuit substrate that is inexpensive, in which packaging density is high and which has good heat dissipating characteristics, and which comprises: an electronic circuit substrate comprising a resin wiring substrate formed with a wiring pattern and a grounding pattern at an internal layer thereof, a plurality of through holes provided directly below a mounting portion of a heat generating component and connected with the grounding pattern, and a case for protectively housing the electronic circuit substrate provided with a heat dissipating protruding surface portion contacting an area where the through holes of the rear surface of the electronic circuit substrate are disposed, and being formed so as to ensure space between the case and the rear surface of the electronic circuit substrate to enable mounting of low heat generating electrical/electronic components.

METHOD TO ENSURE THE COOLING OF ELECTRONIC COMPONENTS FIXED ON A MULTILAYER FOR PRINTED CIRCUITS AND MULTILAYER REALIZED ACCORDING TO SAID METHOD

CHANGE-OVER SWITCHING USING CONFIGURABLE PRINTED CIRCUIT BOARDS

L'invention concerne un câblage dans un boîtier de connexion , à l'aide d'un panneau de circuit imprimé qui comporte sur l'un de ses bords N bornes d'entrée, sur le bord opposé N bornes de sortie, et, entre ces deux bords, une pluralité d'étages de dispositifs élémentaires de connexion à deux entrées deux sorties, les deux entrées d'un dispositif étant reliées électriquement aux deux sorties dudit dispositif , d'une part, par deux liaisons directes et, d'autre part, par deux liaisons de dérivation croisés, les entrées des dispositifs du premier étage étant directement reliées électriquement aux bornes d'entrée, les sorties des dispositifs du dernier étage étant directement reliées électriquement aux bornes de sortie, et, entre deux étages successifs, les sorties des dispositifs de l'étage de rang inférieur sont reliées électriquement aux entrées des dispositifs de l'étage de rang supérieur. Pour personnaliser un câblage on coupe soit les liaisons directes, soit les liaisons de dérivation ...

BIASED GRINDING ASSEMBLY

Applicants: Dawson et al. For: Biased Grinding Assembly A grinding assembly for grinding an object such as a printed circuit board coupon at a predetermined angle and to a predetermined grinding depth, including a control board carrying a grinding guide having at least two conductive leads and a conductive control track interconnecting the conductive leads, and a shelf having an upper surface for supporting the object. The shelf is positioned relative to the control board to establish a grinding surface for the object biased at the predetermined angle. The shelf is further positioned to align the predetermined grinding depth of the object with a portion of the rear edge of the control track so that the track is ground through when the object is ground along the biased grinding surface to the predetermined grinding depth.

MULTILAYER PRINTED WIRING BOARD

A MULTILAYER PRINTED WIRING BOARD This application discloses a multilayer printed wiring board having a plurality of pattern layers. Said printed wiring board has at least one pair of plated through holes, i.e. a first and a second plated through hole. The first plated through hole is directly connected to said patterns. The second plated through hole is not directly connected to said patterns. An electronic element terminal is connected to said second plated through hole. The first and second plated through holes are electrically connected to each other on a surface opposite an element mounting surface of the printed wiring board.

CIRCUIT MODULE WITH ENHANCED HEAT TRANSFER AND DISTRIBUTION

A circuit module having enhanced heat transfer and distribution characteristics which is particularly adapted for use in high speed electronic digital computers. The circuit module includes a circuit board assembly with a plurality of electronic devices such as integrated circuits, mounted on a circuit board. The circuit board includes conductive pads and plated-through holes forming a thermally conductive flow path from each electronic device to the opposite side of the circuit board for more efficient heat transfer away from the module. The heat pads and plated-through holes are preferably connected with the ground plane layer of the circuit board for better heat distribution as well.

STRIP TRANSMISSION LINE STRUCTURES

PRINTED CIRCUIT BOARD WITH VOID BETWEEN PINS

A circuit board includes at least one insulator layer and a plurality of conductors over which a plurality of signals is carried. A plurality of terminals is coupled to at least a subset of the plurality of conductors. A void is formed in the circuit board between at least two terminals.

HIGH DENSITY MULTI-LAYER CIRCUIT ARRANGEMENT

DIFFERENTIAL SIGNAL ELECTRICAL CONNECTORS

An electrical connector for transferring a plurality of differential signals between electrical components. The connector is made of modules that have a plurality of pairs of signal conductors with a first signal path and a second signal path. Each signal path has a pair of contact sections extending between the contact portions. For each pair of signal conductors, a first distance between the interim sections is less than a second distance between the pair of signal conductors and any other pair of signal conductors of the plurality. Embodiments are shown that increase routability.

SUPERCONDUCTING PRINTED CIRCUIT BOARD RELATED SYSTEMS, METHODS, AND APPARATUS

A multilayer circuit board structure includes superconducting connections to internal layers thereof, for example by inclusion of superconducting vias. Two or more panels can each comprise respective electrically insulative substrates, each have one or more through-holes, and also include a respective bimetal foil on at least a portion of a respective surface thereof, which is patterned to form traces. The bimetal foil includes a first metal that is non-superconductive in a first temperature range and a second metal that is superconductive in the first temperature range. The panels are plated to deposit a third metal on exposed traces of the second metal, the third metal superconductive in the first temperature range. Panels are join (e.g., laminated) to form at least a three-layer superconducting printed circuit board with an inner layer, two outer layers, and superconducting vias between the inner layer and at least one of the two outer layers.

A RADIO FREQUENCY CIRCUIT BOARD TOPOLOGY

An interconnection structure for interconnecting circuitry on a first conductive layer to circuitry on a second conductive layer is provided. The interconnection structure of the present invention comprises a signal conductor via surrounded by a plurality of ground vias. The plurality of ground vias shield the signal conductor via, thus providing electrical isolation for the conductor via from the rest of the circuitry. One feature of the present invention is that the plurality of ground vias can be modified, adjusting their diameters and their placement relative to the signal conductor via, in order to affect the overall characteristic impedance of the interconnection structure. This feature is useful when propagating high frequency signals between signal traces on different conductive layers of a printed circuit board. In view of the high frequencies used in today's wireless communication systems, the interconnection structure proposed aids in the practical implementation of radio frequency ...

PROCESS FOR PRODUCING SUBSEQUENTLY CONDITIONABLE CONTACT POINTS ON CIRCUIT SUBSTRATES AND CIRCUIT SUBSTRATES WITH SUCH CONTACT POINTS

The method for producing subsequently contactable contact points or pads between two conducting path planes of a circuit carrier separated from one another by an electrically insulating layer offers the possibility of e.g. producing a basic conductor diagram, which can be quickly subsequently easily adapted to the corresponding needs. By making windows in the conducting path planes in such a way that during the following through-etching of the electrically insulating layer by undercutting land-like parts connected to the opening periphery are exposed between or in the openings and said exposed, land-like parts can be contacted with electrically conductive parts of the other conducting path plane by mechanically bending together said conductive paths in order to bring about an electrical connection. (Fig. 6b) ...

PRINTED CIRCUIT BOARD FOR ELECTRICAL DEVICES HAVING RF COMPONENTS, PARTICULARLY FOR MOBILE RADIO TELECOMMUNICATION DEVICES

Printed circuit board for electrical devices having RF components, particularly for mobile radio telecommunication devices To increase the packing density of electronic circuits and conductor-track structures on printed circuit boards for electrical devices having RF components, particularly for mobile radio telecommunication devices, a "micro via" coating is initially applied to one or both sides of a printed circuit board assembly. This "micro via" coating then has, in particular, RF circuits and RF conductor-track structures applied to at least part of its surface. Finally, the RF circuits and RF conductor-track structures are protected in relation to an RF ground coating of the printed circuit board assembly by barrier areas arranged in an assembly coating, situated directly below the "micro via" coating, of the printed circuit board assembly against interfering influences which impair the RF parameters, to be set in each case, of the RF circuits and RF conductor-track structures.

Verfahren zur Herstellung einer elektrischen Leiterplatte

Mehrschichtige gedruckte Schaltung und Verfahren zu ihrer Herstellung

Multilayer printed circuit construction using

A multilayer printed circuit comprises separate circuit patterns built up sequentially on an insulating base, isolated from each other by an insulating resin, through connections between the circuits being made via holes already present in the insulating base. Holes are punched in the insulating substrate where connections are desired; a circuit pattern is printed on the panel surfaces using a catalytic ink, coating the walls of the holes also; the panel is immersed in an electroless copper plating bath so that copper is deposited in the form of the circuit and also on the hole walls; the board is cleaned, e.g. with a soln. of 1 part 28% ammonia and 1 part isopropyl alcohol; a resin mask is applied and cured, terminating the mask at the holes so that the metal there remains exposed; a second circuit pattern is printed with catalytic ink and the coating steps repeated as required. Overlapping layers of the metal are produced within the holes.

Method for designing electrically conductive layers for producing printed circuits, as well as a multi-layer base material for carrying out the method

Method for designing electrically conductive layers for producing printed circuits, as well as a multilayer base material for carrying out the method

Method for designing electrically conductive layers for producing printed circuits, and a multilayer base material for carrying out the method

Multi-layer printed circuit board body for high tensions and high rivers as well as procedure for the production of such a printed circuit board body.

Printed circuit board reinforcement.

Manufacturing method of composite pcb board

Having a reference circuit of the multi-layer circuit element

Via stub termination structures and methods for making same

电子元件和多层信号路由装置之间的电信号电气互连技术

... 本发明披露了一种用于在电子元件和多层信号路由装置之间电气互连电信号的技术。在一个特定的实施例中，这种技术是作为一种用于电气互连在电子元件和具有多个导电信号通路层的多层信号路由装置之间的电信号的互连阵列实现的。在这种情况下，所述互连阵列包括多个导电接点，它们被分组成为导电接点的多个布置，其中所述导电接点的多个布置的每个布置和所述导电接点的多个布置的其它相邻的布置通过在所述多层信号路由装置中相应地形成的沟槽分开，使得可以在其中在所述多个导电信号通路层上进行增加的数量的电信号的路由。 ...

Multilayer wiring board and method of manufacturing the same

A multilayer wiring board is manufactured by preparing a first wiring board, a second wiring board, and a joint sheet. The first wiring board is provided with a via having a first through-hole in which a conductive film is formed. The second wiring board is provided with a second through-hole at a position substantially matching the position of the first through-hole. The joint sheet is provided with a third through-hole at a position substantially matching the positions of the first and the second through-holes. the first wiring board and the second wiring board are stacked and bonded together by heat and pressure with the joint sheet interposed therebetween.

Manufactoring process of printed circuits with multiple layers

OUTLINE ELECTRICAL CIRCUIT MULTI-LAYER AND MANUFACTORING PROCESS OF MULTI-LAYER CIRCUITS BY COMPRISING APPLICATION

PLATE HAS CIRCUITS PRINT MULTI-LAYER

Electromagnetic interference filtering device for metallic case, has printed circuits connected by holes traversing board by being isolated from intermediate side and filtering components inserted in circuits at immediate proximity of holes

Dispositif (13) de filtrage d'interférences électromagnétiques propre à équiper une fenêtre (28) d'un boîtier (2) métallique renfermant du matériel électronique, comprenant une plaque (14) à circuits imprimés multicouche fixable (29) mécaniquement et en contact électrique avec le boîtier pour clore la fenêtre. La plaque (14) comporte : une face externe (15) munie de premiers circuits (16) connectés à un premier connecteur (23) ; une face interne (17) munie de seconds circuits (18) connectés à un second connecteur (24) ; une face intercalaire (19) formant écran ; des trous métallisés (25) réunissant les premiers et seconds circuits ; et des composants de filtrage (26) insérés dans les premiers ou seconds circuits à proximité immédiate des trous métallisés (25).

MULTILAYER PRINTED CIRCUIT BOARDS

Hydraulic control device, especially for the control of hydraulic winches

USING MIXING BY PERMUTATIONS OF THE CIRCUITS PRINT CONFIGURABLE

L'invention concerne un câblage dans un boîtier de connexion , à l'aide d'un panneau de circuit imprimé qui comporte sur l'un de ses bords N bornes d'entrée, sur le bord opposé N bornes de sortie, et, entre ces deux bords, une pluralité d'étages de dispositifs élémentaires de connexion à deux entrées deux sorties, les deux entrées d'un dispositif étant reliées électriquement aux deux sorties dudit dispositif , d'une part, par deux liaisons directes et, d'autre part, par deux liaisons de dérivation croisés, les entrées des dispositifs du premier étage étant directement reliées électriquement aux bornes d'entrée, les sorties des dispositifs du dernier étage étant directement reliées électriquement aux bornes de sortie, et, entre deux étages successifs, les sorties des dispositifs de l'étage de rang inférieur sont reliées électriquement aux entrées des dispositifs de l'étage de rang supérieur. Pour personnaliser un câblage on coupe soit les liaisons directes, soit les liaisons de dérivation ...

Printed circuit for electronic device, has support with thermal expansion coefficient along axis perpendicular to support, which is less than specific micrometer per meter per centigrade, for temperature domain less than specific degrees

Un circuit imprimé (101) comprenant : - un support en matière isolante (102), - des trous (3) traversant ledit support destinés à recevoir les éléments conducteurs (11) de composants électroniques, - des pistes conductrices, et - des pastilles conductrices, au moins une desdites pastilles étant une pastille externe (103, 104) située sur au moins une face (105, 106) du support, le coefficient de dilatation thermique du support, selon un axe perpendiculaire audit support, est inférieur ou égal à 60 µm/m/°C pour une plage de températures inférieures à 150°C, et au moins une pastille comportant une partie (206) exposée à la soudure ayant une largeur inférieure à 0,30 millimètres. Un dispositif électronique comportant des composants électroniques et des moyens de connexion, au moins une partie desdits composants étant supportée sur un circuit imprimé (101) décrit précédemment, ledit circuit imprimé étant connecté par lesdits moyens de connexion.

Large multilayer structures for electronic circuits - through-holes connected by palladium-mercury plus electroplating

CARTE DE CIRCUIT IMPRIME A COUCHES MULTIPLES ET SON PROCEDE DE FABRICATION

L'INVENTION CONCERNE UNE CARTE DE CIRCUIT IMPRIME QUI FACILITE L'ENLEVEMENT ET LE REMPLACEMENT DES COMPOSANTS. LA CARTE 1 EST FORMEE PAR DES COUCHES D'EPOXY CHARGE DE VERRE PORTANT DES CONDUCTEURS 6, 7. LES BROCHES DE CONNEXION 9 DE COMPOSANTS 2 MONTES SUR UNE FACE DE LA CARTE 1 PASSENT DANS DES TROUS 8 DE LA CARTE ET FONT SAILLIE SUR LA FACE OPPOSEE. UNE COUCHE DE POLYIMIDE CHARGE DE VERRE 13 COUVRE LA FACE OPPOSEE DE LA CARTE ET PORTE LES SURFACES CONDUCTRICES 9 QUI SONT CONNECTEES AUX EXTREMITES DES BROCHES 3. L'INVENTION S'APPLIQUE NOTAMMENT AU MONTAGE DES CIRCUITS INTEGRES.

PRINTED CIRCUIT BOARD, LIGHT EMITTING DEVICE MODULE USING PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

A printed circuit board includes, on a cross-sectional view, a conductive substrate; an insulating layer stacked on a part of the conductive substrate; a first conductive layer stacked on at least a portion of the insulating layer; a CCL (Copper Clad Laminates) layer stacked on at least a part of the first conductive layer; a second conductive layer stacked on at least a part of the CCL layer; and a PSR (Photo Solder Resist) layer stacked on a part of the second conductive layer and a part of the insulating layer. The heat dissipation performance of the printed circuit board can be improved. COPYRIGHT KIPO 2018 ...

코어 및 이를 이용한 인쇄회로기판

... 본 발명은 인쇄회로기판에 관한 것이다. 본 발명의 인쇄회로기판은, 측면에 경사 패턴이 형성된 코어; 상기 코어 상에 적층된 제1 절연층과, 상기 제1 절연층 상에 적층되어 상기 코어의 측면을 감싸는 제2 절연층; 상기 제1 절연층과 제2 절연층 상에 각각 형성된 내부 회로층과 외부 회로층; 및 상기 제2 절연층 상에 적층된 솔더 레지스트층;을 포함한다.

CAPACITIVE/RESISTIVE DEVICES AND PRINTED WIRING BOARDS INCORPORATING SUCH DEVICES, AND METHODS OF MAKING THEREOF

보호층 구비 동장 적층판 및 다층 프린트 배선판

... 도전 차단 부위 형성용 관통 구멍 주위에 있어서, 스루홀 가공성과 평탄성이 뛰어난 스루홀 분할 다층 프린트 배선판 제공을 목적으로 한다. 이 목적을 달성하기 위하여, 「스루홀을 전기적으로 차단하는 도전 차단 부위를 갖는 프린트 배선판에 사용하는 동장 적층판이며, 당해 동장 적층판은, 도전 차단 부위 형성용 관통 구멍을 형성하고, 당해 도전 차단 부위 형성용 관통 구멍에 도금 레지스트가 충전된 후에 박리 가능한 보호층을 표면에 구비하고 있는 것을 특징으로 하는 보호층 구비 동장 적층판」 등을 채용한다.

커브드형 보드 제조방법과 이를 이용한 회로기판

... 본 발명은 커브드형 보드 제조방법과 이를 이용한 회로기판에 관한 것으로, 이러한 본 발명은 일정곡률의 굴곡성을 유지하는 커브드형 보드를 제작함에 있어, 프리프레그 소재의 시트부재를 금형부를 통해 일정온도(예; 70℃) 이상에서 가압 성형하거나, 프리프레그 소재의 시트부재에 적어도 하나의 열경화성 수지로 이루어진 보강시트를 적층 구성한 후 이를 금형부를 통해 일정온도(예; 70℃) 이상에서 가압 성형한 것이고, 이에따라 일정곡률의 굴곡성을 유지하는 커브드형 보드를 완성하는 한편, 이러한 커브드형 보드의 일면 또는 양면으로 회로형성부를 형성시키면서 커브드된 회로기판(PCB)을 보급할 수 있도록 하는 한편, 일정곡률의 굴곡성을 유지하는 커브드형 보드내 경화성수지가 가압 성형으로부터 유출되더라도 이를 보완하도록 하여 커브드형 보드의 굴곡성이 변형되는 것을 방지하도록 한 것이다.

PRINTED CIRCUIT STRIP SUBSTRATE AND MANUFACTURING METHOD THEREOF

According to an embodiment of the present invention, a printed circuit strip substrate comprises: a unit substrate area having a plurality of unit substrates formed thereon; and a strip dummy area positioned outside the unit substrate area, and having a block dummy. The block dummy includes: a plurality of first block dummy patterns; and a second block dummy pattern electrically connected to the plurality of first block dummy patterns, and having a surface area larger than that of the first block dummy pattern. The printed circuit strip substrate can prevent a circuit pattern from being damaged by static electricity. COPYRIGHT KIPO 2017 ...

PRINTED CIRCUIT BOARD

The present invention provides a printed circuit board in which a plurality of via holes are formed by an array to manufacture a heat dissipation pad. In the pad, pitch between adjacent via holes is equal to or larger than a radius of the via holes and is smaller than or equal to a diameter of the via holes. Bar vias are formed in a lateral direction by lining up the adjacent via holes and laser drilling the adjacent via holes so that the adjacent via holes are laid out to be in contact with or overlap each other. The plurality of bar vias are arranged at predetermined intervals in a longitudinal direction so that the pitches between the bar vias do not overlap with each other. COPYRIGHT KIPO 2018 ...

METHOD FOR MANUFACTURING A SUBSTRATE, PREVENTING A PLATING LAYER COATED IN AN INNER WALL OF A PENETRATION HOLE FROM BEING DAMAGED WHEN ETCHING THE PLATING LAYER

PURPOSE: A method for manufacturing a substrate is provided to improve adhesion between the substrate and a wiring layer by etching a conductive layer formed in a surface of the substrate with a predetermined pattern. CONSTITUTION: A penetration hole(18) is formed in a substrate(16). A penetration hole is a pilot hole. A plated through hole is passed through the plated through hole. The plating is performed in the substrate. An inner wall of the penetration hole is coated with a plating layer(19). A photoresist is laminated in the surface of the substrate. The photoresist is exposed and developed. A resist pattern(72) is formed. The resist pattern covers at least planar region of the penetration hole. A conductive layer is formed in the surface of the substrate and is etched. The conductive layer is etched. The resist pattern is used as a mask. The substrate includes a conductive core unit(10). © KIPO 2009 ...

EMBEDDED CAPACITOR PCB AND FABRICATING METHOD THEREOF

PURPOSE: An embedded capacitor PCB and a fabricating method thereof are provided to obtain a high capacitance value and the accurate capacitance in unit areas by coating a photosensitive insulating resin and a polymer capacitor paste on the capacitor. CONSTITUTION: A photoresist dry film is laminated on a copper clad FR-4 layer(101). A capacitor bottom electrode is formed by exposing, developing and etching the photoresist dry film. A photosensitive insulating resin(103) is formed on a top part of the capacitor bottom electrode. The photosensitive insulating resin is etched by performing an exposure process and a developing process. A capacitor paste(104a-104d) is coated and hardened on an etched part. A top electrode copper foil layer(105a-105d) is formed by performing a copper plating process for the hardened capacitor paste and the photosensitive insulating resin. A photosensitive dry film is laminated on the top electrode copper foil layer. The photosensitive dry film except for the ...

표면 상호 연결부 및 무전해 충진물을 포함하는 캐비티를 포함하는 패키지 기판

... 일부 신규한 특징들은, 제 1 유전체 층, 제 1 상호연결부, 제 1 캐비티 및 제 1 무전해 금속 층을 포함하는 기판과 관련된다. 제 1 유전체 층은 제 1 표면 및 제 2 표면을 포함한다. 제 1 상호연결부는 제 1 유전체 층의 제 1 표면 상에 있다. 제 1 캐비티는 제 1 유전체 층의 제 1 표면을 관통한다. 제 1 무전해 금속 층은 적어도 부분적으로 제 1 캐비티에 형성된다. 제 1 무전해 금속 층은 제 1 유전체 층 내에 매립되는 제 2 상호연결부를 정의한다. 일부 구현들에서, 기판은 코어 층을 더 포함한다. 코어 층은 제 1 표면 및 제 2 표면을 포함한다. 코어 층의 제 1 표면은 제 1 유전체 층의 제 2 표면에 커플링된다. 일부 구현들에서, 기판은 제 2 유전체 층을 더 포함한다.

MULTI-LAYER PRINTED WIRING BOARD AND A CHARACTERISTIC IMPEDANCE MEASURING METHOD FOR REDUCING AN AREA FOR FORMING A TEST COUPON AND EXACTLY MEASURING CHARACTERISTIC IMPEDANCE

PURPOSE: A multi-layer printed wiring board and a characteristic impedance measuring method are provided to apply step pulse to each test coupon at a time by connecting the test coupons in series through a through-hole, thereby effectively measuring the characteristic impedance. CONSTITUTION: A multi-layer printed wiring board(10) having a plurality of signal wiring layers and at least one ground layer is composed of test coupons(11) formed at each signal wiring layer to measure impedance; through-holes(18) for connecting the test coupons of the signal wiring layers adjacent to each other, in series; a measuring pad(14) connected to one end of the test coupons connected in series; and a measuring pad(16) connected to the ground layer. The test coupon comprises plural linear parts(12) extended in a line and folded-back parts(13) connecting the linear parts to each other. © KIPO 2007 ...

얇은 라미네이트를 위한 홀 플러그

... 라미네이트 구조체에 홀 플러그를 형성하기 위한 방법이 제공된다. 적어도 유전층 및 유전층의 제1 측면 상의 제1 도전성 호일을 포함하는 라미네이트 구조체가 형성된다. 유전층의 제2 측면으로부터 제1 도전성 호일을 향하고 유전층을 적어도 부분적으로 관통하여 연장되는 비관통된 또는 블라인드 홀이 라미네이트 구조체에 형성되며, 홀은 10 대 1 미만의 홀 깊이 대 홀 직경 종횡비를 갖는다. 더 다른 예에서, 홀 종횡비는 1 대 1 미만일 수 있다. 그 다음, 비아 필 잉크는 홀에 증착될 수 있다. 그 다음, 비아 필 잉크는 홀 플러그를 형성하기 위해 건조되고/되거나 경화된다.

FLEXIBLE PRINTED CIRCUIT BOARD HAVING THIRD DIELECTRIC SUBSTANCE LAYER AND FOURTH GROUND LAYER

Provided is a flexible printed circuit board having a third dielectric substance and a fourth ground layer. The flexible printed circuit board having a third dielectric substance and a fourth ground layer comprises: a first dielectric substance; a second dielectric substance facing the plane of the first dielectric substance; a third dielectric substance facing the lower part of the first dielectric substance; a signal line formed on the first dielectric substance layer; a pair of first ground layers stacked on the first dielectric substance plane by placing the signal line therebetween; a second ground layer stacked on the lower part of the first ground layer to face the first ground layer; a third ground layer stacked on the second dielectric substrate; and a fourth ground layer stacked on the lower part of the third dielectric substance. The present invention does not restrict an installation position within a wireless terminal. COPYRIGHT KIPO 2017 ...

Conductive connection structure of printed circuit board (PCB)

A conductive connection structure is used to connect the power pads and the ground pads of an electrical device respectively to the power layer and the ground layer of a printed circuit board (PCB). The conductive connection structure includes a first conductive member and a second conductive member. One end of each conductive member has a conductive lead. The other end of each conductive member has a plurality of paired-sections extending from the conductive lead. The paired-sections of each conductive member are symmetrically arranged. The symmetrically-arranged paired-sections of the two conductive members are interlaced to form two electrical circuits with different current directions and to counterbalance the magnetic flux generated by the electrical circuits. Therefore, the inductance of the conductive connection structure is reduced when the electrical device is operated at a high switching frequency.

A method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method

A method of fabricating a substrate core structure comprises: providing first and second patterned conductive layers defining openings therein on each side of a starting insulating layer; providing a first and a second supplemental insulating layers onto respective ones of a first and a second patterned conductive layer; laser drilling a set of via openings extending through at least some of the conductive layer openings of the first and second patterned conductive layers; filling the set of via openings with a conductive material to provide a set of conductive vias; and providing a first and a second supplemental patterned conductive layer onto respective ones of the first and the second supplemental insulating layers, the set of conductive vias contacting the first supplemental patterned conductive layer at one side thereof, and the second supplemental patterned conductive layer at another side thereof.

Multi-layer printed circuit board layout and manufacturing method thereof

A multi-layer printed circuit board (PCB) includes a first wire layer, a middle layer on the first wire layer, a second wire layer on the middle layer, and a slanting via formed in the middle layer and the second wire layer. The manufacturing method includes providing a first wire layer and forming a first wire on the first wire layer; forming a middle layer on the first wire layer; forming a second wire layer on the middle layer; forming a slanting via in the middle layer and the second wire layer wherein the slanting via is not orthogonal to the first and the second wire layers; forming a second wire on the second wire layer by an etching method; and forming an electroplate layer in the via to connect the first wire and the second wire.

Method of providing printed circuit board with conductive holes and board resulting therefrom

A method of making a printed circuit board in which conductive thru-holes are formed within two dielectric layers of the board's structure so as to connect designated conductive layers. One hole connects two adjacent layers and the other connects two adjacent layers, including one of the conductive layers connected by the other hole. It is also possible to connect all three conductive layers using one or more holes. The resulting holes may be filled, e.g., with metal plating, or conductive or non-conductive paste. In the case of the latter, it is also possible to provide a top covering conductive layer over the paste, e.g., to serve as a pad or the like on the board's external surface.

Component embedded package carrier and manufacturing method thereof

High frequency and wide band impedance matching via

A high frequency and wide band impedance matching via is disclosed. The multi-layer circuit board has several signal transmission lines sited on different circuit layers, signal transmission vias and ground vias. The signal transmission vias is connected between the signal transmission lines. The ground vias correspond to signal transmission vias to stabilize the characteristic impedance of the first transmission line.

Wiring board and production process for the same

The present invention solves the problems of the wiring board which are caused by the irregularities on the surface of the resin impregnated fibrous sheet when it is used as the insulation substrate (the insufficient adhesion strength between the wiring pattern and the insulation substrate or the limitation of fineness of the wiring pattern because of the irregularities on the surface of the printed wiring board which are formed upon the thermocompression bonding) while the advantages of the wiring board having the inner via holes. In a wiring board, predetermined wiring patterns which are formed on both sides of an insulation substrates are electrically connected by an electrically conductive material filled in through holes which are formed through the insulation substrate composed of a resin impregnated fibrous sheet and a heat resistant film.

CIRCUIT BOARD HAVING AN ELECTRODEPOSITED COATING ON A CONDUCTIVE CORE WITHIN A VIA AND METHOD OF MAKING SAME

A process for fabricating a circuit board includes: providing a substrate including a first electrically conductive core having a first insulating coating on a first side and a second insulating coating on a second side, forming an opening in the first and second insulating coatings and the first electrically conductive core, exposing an edge of the conductive core within the opening, and electrodepositing a third insulating material on the exposed edge of the first electrically conductive core. A circuit board fabricated using the process is also provided.

APERTURES FOR SIGNAL SHAPING USING GROUND AND SIGNAL PTH BACK-DRILLING

A method and apparatus for shaping signals transmitted via plated through holes (PTHs) utilizes standard back-drilling techniques to reduce the resonant stub lengths of ground PTHs in the vicinity of a back-drilled signal PTH.

RESONATOR, PRINTED BOARD, AND METHOD FOR MEASURING COMPLEX DIELECTRIC CONSTANT

A printed board includes conductive layers arranged in parallel to each other so as to sandwich a dielectric layer. A plurality of through via holes connected to the conductive layers are arranged at a certain spacing around openings arranged in the conductive layers. Moreover, a through via hole for excitation is arranged in non-contact with the conductive layers in the region of the openings of the conductive layers and the dielectric layers aligned with the openings. When measuring the complex dielectric constant, a high frequency power is applied to the through via holes and the power loss between the through via holes and the conductive layers is measured bay the S parameter method. Thus, it is possible to accurately measure the complex dielectric constant and its dependency on the frequency in the frequency range of several GHz to 20 GHz. Even when such a resonator is mounted on the substrate, no electric interference with other parts is caused.

NOISE SUPPRESSING STRUCTURE, MULTILAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SUCH MULTILAYER PRINTED CIRCUIT BOARD

A noise suppressing structure, which suppresses generation of conduction noise and radiation noise and can be reduced in thickness, a multilayer printed circuit board and a method for easily manufacturing such multilayer printed circuit board are provided. A noise suppressing structure (10) is provided with a first conductor (11), a noise suppressing layer (12) electromagnetically coupled with the first conductor through an insulating layer (13); and a second conductor (14) facing the noise suppressing layer through an insulating layer (13). The noise suppressing structure is a layer in which the noise suppressing layer (12) is formed by physically depositing a metal material on the insulating layer (13), and has a thickness of 5-300nm. The multilayer printed circuit board is provided with the noise suppressing structure. The method for manufacturing the multilayer printed circuit board is provided with a step of removing a part of the first conductor of the noise suppressing structure ...

MULTILAYER PRINTED CIRCUIT BOARD STRUCTURE COMPRISING AN INTEGRATED ELECTRICAL COMPONENT, AND PRODUCTION METHOD THEREFOR

The invention relates to a multilayer printed circuit board structure comprising a stack of a plurality of electrically insulating and/or electroconductive layers (7, 9, 10, 11) and at least one passive or active electrical component (2) arranged inside the stack of layers, said component extending laterally only in part of the surface extension of the stack of layers. The invention also relates to a passive or active electrical component (2) mounted on said stack, to an associated wiring (4, 5), and to a corresponding production method. According to the invention, the insert (1) is embedded between two electrically insulating liquid resin layers or prepreg layers (7, 9) extending over the entire surface and covering the insert on both sides, said insert being surrounded by a resin material that is liquefied by compression or lamination of the structure. The inventive structure can be used in printed circuit board technology.

MARKER FOR MARKING OR CODING AN OBJECT AND METHOD FOR PRODUCING SUCH A MARKER AND USE

On a marker for marking or coding an object, a plurality of marker elements (4, 5, 6) made of a conducting or conductive material are provided, the marker elements (4, 5, 6) can be applied onto and/or integrated into a partial region of the object made of an insulating material, the marker elements (4, 5, 6) are or can be connected at least partially to each other by a connecting element (7, 8) made of a conducting or conductive material for forming a code, and the marker elements (4, 5, 6) can be contacted at least partially by elements ascertaining a conducting state between individual marker elements (4, 5, 6) for capturing the code, wherein a plurality of mutually associated or associatable marker elements (4, 5, 6, 9, 10) are disposed or configured in different levels or layers of an insulating partial region of an object, particularly a planar object. In addition, a method for producing such a marker and also a use of such a marker in connection with a circuit board, particularly ...

MULTI-TIERED CIRCUIT BOARD AND METHOD OF MANUFACTURE

The present invention provides a printed circuit board assembly that includes a first printed circuit board portion having a first thickness and including at least one plated through hole selectively electrically interconnecting electrically conductive layers of the printed circuit board assembly. A second printed circuit board portion is also provided that has a second thickness which is less than the first thickness and further includes another a second plated through hole array exposed on a surface of the second printed circuit board portion.

CONNECTOR AND PRINTED CIRCUIT BOARD FOR REDUCING CROSS-TALK

An interconnection system that includes a printed circuit board and an electrical connector. The printed circuit board has holes, into which contact tails from signal conductors in the connector are inserted. The connector is designed to carry differential signals so that the signal conductors are grouped in pairs. The tails of the signal conductors are offset toward each other. Further, the holes in the printed circuit boards have upper and lower portion. The upper portions align with the spacing of the contact tails of the signal conductors in the connector. The lower portions are offset from the upper portions, bringing the lower portions closer together, thereby increasing the coupling within the pair that carries one differential signal and reducing the crosstalk to adjacent pairs.

TECHNIQUE FOR ACCOMMODATING ELECTRONIC COMPONENTS ON A MULTILAYER SIGNAL ROUTING DEVICE

A technique for accommodating electronic components on a multilayer signal routing device (100) is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for accommodating electronic components on a multilayer signal routing device (100). Such a method comprises determining a component space that is required to accommodate a plurality of electronic components on a surface of a multilayer signal routing device (100), and then forming at least one signal routing channel (104) on at least the surface of the multilayer signal routing device (100), wherein the at least one signal routing channel (104) has a channel space that is equal to or greater than the component space.

Split wave compensation for open stubs

In accordance with a first embodiment, the present invention provides a circuit substrate comprising a first surface; a second surface; a first via having a first end near said first surface and a second end near said second surface; a second via having a first end near said first surface and a second end near said second surface; a first conductive element electrically coupling said first end of said first via and said first end of said second via; a second conductive element electrically coupling said second end of said first via and said second end of said second via; an input signal line coupled to said first via; and an output signal line coupled to said second via.

Chip Capacitor Precursors

A capacitive precursor includes electrically conductive material layers stacked on a substrate. The electrically conductive layers provide first and second patterns. The patterns each include overlaying areas free of the electrically conductive material. The first pair of areas overlay areas of the second pattern having the electrically conductive material and the second pair of areas overlay areas of the first pattern having the electrically conductive material. Dielectric layers are interposed between neighboring electrically conductive material layers for electrical isolation. One or more capacitive precursors can be dropped onto or into a board and during assembly of a packaged semiconductor device and have electrically conducting layers associated with its respective plates connected together to form a capacitor during assembly using conventional assembly steps.

Printed wiring board and method for manufacturing the same

A printed wiring board comprises ground layers stacked via insulator(s); a first through hole; second through holes; and signal wirings each extending from the first through hole through the clearance between predetermined ones of the ground layers, disposed between predetermined second through holes of the second through holes. Each of first clearances in the ground layers neighboring layer in which the signal wiring is disposed has an outline that a distance between the first through hole and outline of the first clearance is minimum of the signal wiring. Each of second clearances in the ground layers not adjacent to the signal wiring has an outline formed outside a circle connecting each center of second through holes centering the first signal through hole, such that outline of second clearance does not contact with the second through holes.

Resonant via structures in multilayer substrates and filters based on these via structures

A resonant via structure is provided with a multilayer substrate, a signal via conductor and ground vias. The multilayer substrate includes conductor layers and a dielectric. The dielectric isolates each of the conductor layers. The signal via conductor is disposed through the multilayer substrate. The ground vias are disposed through the multilayer substrate and around the signal via conductor. The dielectric comprises two sections disposed between the signal via and ground vias, in the plane of conductor layers. The first section is disposed between the first layer and other layer of the conductor layers. The second section is disposed between the other layer and the last layer of the conductor layers.

Via structures and compact three-dimensional filters with the extended low noise out-of-band area

A filter of the present invention includes a plurality of via structures with a multilayer substrate. Each of the plurality of via structures includes first, second and third functional sections. One end of a signal via of the first functional section is connected to one end of a signal via of the second functional section and another end of the signal via of the second functional section is connected to two signal vias of the third functional section. Those signal vias are surrounded by a plurality of ground vias. Input and output ports of the filter are connected to another end of the signal via of each first functional section.

Printed Circuit Board and Method Of Manufacturing The Same

Disclosed herein is a printed circuit board, including: a substrate including a first circuit layer formed on one side thereof and a second circuit layer formed on the other side thereof; and a strike-type through body externally inserted in the substrate and electrically connecting the first circuit layer and the second circuit layer. The printed circuit board is advantageous in that, since a strike-type through body is externally inserted in a substrate, conventional complicated processes, such as hole forming, deburring, desmearing, electroless copper plating and electrolytic copper plating, can be omitted, thus simplifying a process of manufacturing a printed circuit board and reducing the manufacturing cost thereof. 1. A method of manufacturing a printed circuit board , comprising:providing a substrate;externally inserting a strike-type through body into the substrate to allow the strike-type through body to penetrate the substrate; andforming a first circuit layer on one side of the substrate and forming a second circuit layer on the other side of the substrate to allow the first circuit layer and the second circuit layer to be electrically connected with each other through the strike-type through body.2. The method according to claim 1 , wherein claim 1 , in the inserting of the strike-type through body claim 1 , the strike-type through body is inserted into the substrate in a gas punching manner.3. The method according to claim 1 , wherein claim 1 , in the inserting of the strike-type through body claim 1 , the strike-type through body is made of a conductive material.4. The method according to claim 1 , wherein claim 1 , in the inserting of the strike-type through body claim 1 , the strike-type through body is made of copper.5. The method according to claim 1 , wherein claim 1 , in the inserting of the strike-type through body claim 1 , one end of the strike-type through body is curved.6. The method according to claim 1 , wherein claim 1 , in the inserting ...

Process for making stubless printed circuit boards

A process of copper plating a through-hole in a printed circuit board, and the printed circuit board made from such process. The process comprises: providing a printed circuit board with at least two copper interconnect lines separated by an insulator in the vertical direction; providing a through-hole in the printed circuit board in the vertical direction such that the interconnect lines provide a copper land in the through-hole; applying a seed layer to an interior surface of the through-hole; removing an outermost portion of the seed layer from the interior surface of the through-hole with a laser; applying copper on the seed layer.

MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

The present invention provides a multilayer circuit board that includes a plurality of resin layers, conductive wiring layers, and via-hole conductors. Each of the resin layers includes a resin sheet containing a resin and a conductive wiring layer disposed on at least one surface of the resin sheet. The via-hole conductors contain an intermetallic compound having a melting point of 300° C. or more produced by a reaction between a first metal composed of Sn or an alloy containing 70% by weight or more Sn and a second metal composed of a Cu—Ni alloy or a Cu—Mn alloy. The second metal has a higher melting point than the first metal. 1. A multilayer circuit board , comprising:a plurality of resin layers stacked on one another, each of the resin layers including a resin sheet with at least one via-hole conductor and a conductive wiring layer disposed on at least one surface of the resin sheet,wherein each of the via-hole conductors contains an intermetallic compound comprising a reaction product between a first metal and a second metal, andwherein the first metal is selected from the group consisting of Sn and an alloy containing at least 70% by weight of Sn, and the second metal is selected from the group consisting of a Cu—Ni alloy and a Cu—Mn alloy, the second metal having a higher melting point than the first metal.2. The multilayer circuit board according to claim 1 , wherein the intermetallic compound has a melting point of at least 300° C.3. The multilayer circuit board according to claim 1 , wherein the resin sheet comprises a thermoplastic resin.4. The multilayer circuit board according to claim 1 , wherein the second metal constitutes at least 30% by weight of the reaction product.5. The multilayer circuit board according to claim 1 , wherein Ni constitutes 10% to 15% by weight of the Cu—Ni alloy claim 1 , and Mn constitutes 10% to 15% by weight of the Cu—Mn alloy.6. The multilayer circuit board according to claim 1 , wherein each of the via-hole conductors is ...

New printed circuit board and method for manufacturing same

The present invention relates to a laminated body for forming a printed circuit board comprising: a separation member in which first conductive layers and second conductive layers separable from each other are sequentially provided on each of upper and lower surfaces of a separating-insulation member; a laminating-insulation member sequentially laminated on each of the upper and lower surfaces of the separation member; and a conductive layer sequentially laminated on each of upper and lower surfaces of the insulation member, a printed circuit board comprising the laminated body, and a method of manufacturing the same. The present invention provides the new multi-layer printed circuit board to which various designs, such as a double-sided structure or an unbalanced structure, are applicable while overcoming an application limitation of a single-sided printed circuit board structure in the related art, thereby improving productivity and economic feasibility.

Printed wiring board and method for manufacturing the same

A printed circuit board has a core substrate, a first conductive pattern on first surface of the substrate, a second conductive pattern on second surface of the substrate, and a through-hole conductor formed of plated material through the substrate such that the conductor is connecting the first and second patterns. The plated material is filling a through hole in the substrate, the substrate includes an insulation layer including inorganic fiber and resin, a first resin layer on one surface of the insulation layer and having the first surface of the substrate, and a second resin layer on the opposite surface of the insulation layer and having the second surface of the substrate, the first and second resin layers do not contain inorganic fiber material, and the sum of thicknesses of the first and second resin layers is set in the range of 20% or less of thickness of the substrate.

RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

A method of manufacturing a rigid-flexible printed circuit board includes providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns and a first window are respectively formed; layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the base substrate; forming a via hole in the rigid region, and, simultaneously, forming a via hole to correspond to the first window in a flexible region; forming outer circuit patterns including areas adjacent to the first window; and applying solder resists in the rigid region to expose portions of external circuit patterns. The region adjacent to the via holes in the flexible region includes additional plating portions for covering the coverlays. 1. A method of manufacturing a rigid-flexible printed circuit board , comprising:providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns and a first window are respectively formed;layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the base substrate;forming a via hole in the rigid region, and, simultaneously, forming a via hole to correspond to the first window in a flexible region;forming outer circuit patterns including areas adjacent to the first window; andapplying solder resists in the rigid region to expose portions of external circuit patterns,wherein the region adjacent to the via holes in the flexible region includes additional plating portions for covering the coverlays.2. The method as set forth in claim 1 , wherein claim 1 , the via hole formed in the rigid region and the via hole formed in the flexible region are formed using a COlaser.3. The method as set forth in claim 1 , wherein diameters of the additional plating portions are larger than distances between ...

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

A method for manufacturing a wiring substrate includes forming a through-hole penetrating a core layer from one to another surface of the core layer, forming a first metal layer covering the one and the other surface of the core layer and an inner wall surface of the through-hole, forming a second metal layer on the first metal layer, and forming a patterned third metal layer on the second metal layer toward the one surface of the core layer along with forming a patterned fourth metal layer on the second metal layer toward the other surface of the core layer. The forming of the second metal layer includes covering the one and the other surfaces of the core layer and the first metal layer in the through-hole with the second metal layer and closing up a center part of the through-hole with the second metal layer. 1. A wiring substrate comprising:a core layer having one surface and another surface and including a through-hole penetrating the core layer from the one surface to the other surface of the core layer;a first metal layer covering an inner wall surface of the through-hole and extending from a center part of the through-hole to the one and the other surfaces of the core layer;a second metal layer formed on the first metal layer;a third metal layer formed on the second metal layer toward the one surface of the core layer;a fourth metal layer formed on the second metal layer toward the other surface of the core layer;a first wiring layer formed toward the one surface of the core layer and including a first part of the first metal layer, a first part of the second metal layer, and the third metal layer that are formed toward the one surface of the core layer;a second wiring layer formed toward the other surface of the core layer and including a second part of the first metal layer, a second part of the second metal layer, and the fourth metal layer that are formed toward the other surface of the core layer; anda through-wiring formed in the through-hole and ...

Printed circuit board and manufacturing method thereof

A printed circuit board and a method of manufacturing the same are provided. A printed circuit board having conductive patterns formed in multilayers on an insulating material laminated on both surfaces of a glass core is provided. The printed circuit board includes a first insulating material disposed on a first surface and a second surface of the glass core. and a second insulating material disposed on the first insulating material. The first insulating material surrounds a first portion of a side surface of the glass core and the second insulating material surrounds a second portion of the side surface of the glass core, the second portion being a portion of the glass core not surrounded by the first insulating material.

Circuit board and method of manufacturing the same

A circuit board includes a substrate and a through via. The substrate has a first surface and a second surface opposite to the first surface. The substrate includes circuit layers and insulation layers. The insulation layers are sandwiched between the circuit layers. The through via goes through the substrate and has portions defining a first portion and a second portion. The first portion of the through via is coated with a first metal layer and electrically connected to at least one of the circuit layer by the first metal layer. The second portion of the through via is coated with a second metal layer and electrically connected to at least one of the circuit layer by the second metal layer. The first and second portions are electrically insulted, and the diameter of the second portion is larger than that of the first portion.

Method for Producing a Printed Circuit Board with MultiLayer Sub-Areas in Sections

A method for producing a printed circuit board () with multilayer subareas in sections, characterized by the following steps: a) providing at least one conducting foil (′) and application of a dielectric insulating foil (′) to at least one subarea of the conducting foil; b) applying a structure of conducting paths (′) to the insulating layer (′); c) providing one further printed circuit board structure; d) joining of the further printed circuit board structure with the conducting foil (′) plus insulating layer (′) and conducting paths (′) by interposing a prepreg layer (′), and e) laminating the parts joined in step d) under pressing pressure and heat; and a printed circuit board produced according to this method. 1. A method for producing a printed circuit board with multilayer subareas in sections , characterized by:a) providing at least one conducting foil and application of a dielectric insulating foil to at least one subarea of the conducting foil;b) applying a structure of conducting paths to the insulating layer;c) providing one further printed circuit board structure;d) joining of the further printed circuit board structure with the conducting foil plus insulating layer and conducting paths by interposing a prepreg layer, ande) laminating the parts joined in step d) under pressing force and heat.2. A method according to claim 1 , characterized by:a′) providing a first conducting foil and applying a dielectric insulating layer to at least one subarea of the first conducting foil;b′) applying a structure of conducting paths to the insulating layer of the at least one subarea;c′) providing a second conducting foil;d′) providing a prepreg layer and joining of the at least one subassembly as produced in steps a′) and b′) and the at least the second conducting foil, wherein the third prepreg layer is provided between the conducting foils, and the conducting foils are disposed on the outside;e′) laminating the structure assembled in step d′) under pressing force ...

Circuit substrate and method for manufacturing the same

A circuit substrate includes a core substrate having cavity penetrating through the core substrate, a metal block accommodated in the cavity of the core substrate, a first build-up layer including an insulating layer and laminated on first side of the core substrate such that the first build-up layer is covering the cavity on the first side of the core substrate, and a second build-up layer including an insulating layer and laminated on second side of the core substrate such that the second build-up layer is covering the cavity on the second side of the core substrate, and a filling resin filling gap formed between the cavity and block positioned in the cavity of the core substrate. The block has roughened surfaces such that the roughened surfaces are in contact with the insulating layers in the first and second build-up layers on the first and second sides of the core substrate.

Assembly method for converting the precursors to capacitors

A method of assembling a packaged semiconductor device starts by dropping a pre-formed capacitor precursor on a surface of or within a first substrate. An integrated circuit die is dropped on either of the first substrate. If the pre-formed capacitor precursor lacks at least a first pair of vias for providing an electrical contact between capacitor plates of said chip capacitor, then at least a first pair of vias is formed in said pre-formed capacitor precursor. The first pair of vias are filled with an electrically conductive material to form the chip capacitor, wherein said filling of said vias provides an electrical contact between said first and second capacitor plates of said chip capacitor and said electrically conductive contact regions on said first substrate. A plurality of electrically conductive material layers and a plurality of dielectric layers are alternately stacked on a second substrate. The plurality of electrically conductive material layers comprise first and second patterns. The first pattern comprises at least a first pair of overlaying areas free of said electrically conductive material, and said second pattern comprises at least a second pair of overlaying areas free of said electrically conductive material. The first pair of areas overlay areas of the second pattern having said electrically conductive material and the second pair of areas overlay areas of the first pattern having said electrically conductive material. The plurality of electrically conductive material layers are electrically isolated from one another by the dielectric layers.

METHOD OF MANUFACTURING BRAKE PEDAL COIL PRINTED CIRCUIT BOARD FOR VEHICLE

A method of manufacturing a brake pedal coil printed circuit board for vehicles is provided which is capable of allowing a wireless sensor to quickly sense whether physical energy from a driver is applied to a foot brake pedal to turn on rear brake lights. To solve the above problems, the method of manufacturing a brake pedal coil printed circuit board for vehicles includes preparing a first epoxy layer () having first copper foil () laminated on both surfaces thereof (S), laminating each of second epoxy layers (and ) on the first copper foil (), and laminating second copper foil () on each of the second epoxy layers (and ) (S), forming a through hole (A) passing through upper and lower surfaces, performing electroless copper plating on an inside surface of the through hole (A) and the second copper foil (), and forming an electrolytic copper-plated layer () on each of the electroless copper-plated layer () of the through hole (A) and the electroless copper-plated layer () formed on the second copper foil () (S), forming circuits having a predetermined pattern on the electrolytic copper-plated layer () and the electroless copper-plated layer () and forming a gap between the circuits to have the same size as the circuits (S), applying a PSR ink () onto the electrolytic copper-plated layer () (S), applying a marking ink () onto the PSR ink () (S), forming a nickel (Ni)-plated layer () around the through hole (A) and the hole land (S), and forming an Au-plated layer () on the Ni-plated layer () (S). 1. A method of manufacturing a brake pedal coil printed circuit board for vehicles , comprising:{'b': 100', '110', '100, 'preparing a first epoxy layer () having first copper foil () laminated on both surfaces thereof (S);'}{'b': 200', '200', '110', '210', '200', '200', '200, 'i': a', 'b', 'a', 'b, 'laminating each of second epoxy layer (and ) on the first copper foil (), and laminating second copper foil () on each of the second epoxy layers (and ) (S);'}{'b': 210', '220', ...

MULTI-LAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

A multi-layered printed circuit board and a manufacturing method thereof are disclosed. The multi-layered printed circuit board in accordance with an aspect of the present invention includes: an inner-layer portion having an inner-layer wired pattern formed thereon; outer-layer portions having inner-layer wired portions formed thereon and being laminated on either surface of the inner-layer portion; a first via-hole formed to penetrate one of the outer-layer portions so as to be connected to a first point of the inner-layer wired pattern; and a second via-hole formed to penetrate the other of the outer-layer portions so as to be connected with a second point of the inner-layer wired pattern. The second via-hole is formed in an area of the inner-layer portion and the outer-layer portions that is removed through external form processing. 1. A multi-layered printed circuit board comprising:an inner-layer portion having an inner-layer wired pattern formed thereon;outer-layer portions having inner-layer wired portions formed thereon and being laminated on either surface of the inner-layer portion;a first via-hole formed to penetrate one of the outer-layer portions so as to be connected to a first point of the inner-layer wired pattern; anda second via-hole formed to penetrate the one of the outer-layer portions so as to be connected with a second point of the inner-layer wired pattern,wherein the second via-hole is formed in an area of the inner-layer portion and the outer-layer portions that is removed through external form processing.2. The multi-layered printed circuit board of claim 1 , further comprising a prepreg layers interposed between the inner-portion layer and the outer-portion layers so as to insulate the inner-portion layer from the outer-portion layers.3. The multi-layered printed circuit board of claim 1 , wherein the inner-layer wired pattern has open-circuit thereof measured through an electrical test between the first via-hole and the second via-hole.4 ...

FUSION BONDED LIQUID CRYSTAL POLYMER CIRCUIT STRUCTURE

A method of making a multilayered, fusion bonded circuit structure. A first circuitry layer is attached to a first major surface of a first LCP substrate. A plurality of first recesses are formed that extend from a second major surface of the first substrate to the first circuitry layer. The first recesses are then plated to form a plurality of first conductive pillars of solid metal that substantially fill the first recesses. A plurality of second recesses are formed in a second LCP substrate corresponding to a plurality of the first conductive pillars. The second recess are plated to form a plurality of second conductive structures that extend between first and second major surfaces of the second substrate. The second major surface of the first substrate is positioned adjacent to the second major surface of the second substrate. The first conductive pillars are aligned with the second conductive structures. The stack is then fusion bonded to mechanically couple the first conductive pillars to the second conductive structures. 1. A method of making a multilayered , fusion bonded circuit structure comprising the step of:attaching a first circuitry layer to a first major surface of a first LCP substrate;forming a plurality of first recesses extending from a second major surface of the first substrate to the first circuitry layer;plating the first recesses to form a plurality of first conductive pillars of solid metal that substantially fill the first recesses, the first conductive pillars extending above the first circuitry layer;forming a plurality of second recesses in a second LCP substrate corresponding to a plurality of the first conductive pillars;plating the second recesses to form a plurality of second conductive structures that extend between first and second major surfaces of the second substrate;positioning the second major surface of the first substrate adjacent to the second major surface of the second substrate;aligning the first conductive pillars with ...

Semi-additive process for printed circuit boards

A circuit board has a dielectric core, a foil top surface, and a thin foil bottom surface with a foil backing of sufficient thickness to absorb heat from a laser drilling operation to prevent the penetration of the thin foil bottom surface during laser drilling. A sequence of steps including a laser drilling step, removing the foil backing step, electroless plating step, patterned resist step, electroplating step, resist strip step, tin plate step, and copper etch step are performed, which provide dot vias of fine linewidth and resolution. 1) A process for forming fine pitch dot vias on a laminate having a bottom thin foil bonded to the laminate , a comparatively thicker backing foil adjacent to the bottom thin foil , and an optional thin top foil , the process comprising:laser drilling blind vias through the laminate top surface to the bottom thin foil, optionally also drilling through holes penetrating through the laminate, bottom thin foil, and backing foil;removing the backing foil;treating the surfaces of the laser drilled vias and drilled holes with a catalyst;electroless plating the optional top foil surface and bottom foil surface, the inner surfaces of the vias, and the inner surfaces of the optionally drilled through holes;applying patterned resist over the top and bottom surface;electro-plating the circuit board until copper is deposited to a level below the patterned resist;tin plating the exposed copper regions of the circuit board;stripping the patterned resist;quick etching the exposed copper regions to the underlying laminate;optionally etching the tin plating.2) The process of where said bottom thin foil or said optional top thin foil is copper foil approximately 0.12 mil to 0.15 mil in thickness.3) The process of where said laser drilled vias are less than 5 mils in diameter.4) The process of where said electroless plating and said electroplating deposits copper.5) The process of where said catalyst is at least one of: Palladium (Pd) claim 1 , ...

METHOD OF FORMING A LAMINATE STRUCTURE HAVING A PLATED THROUGH-HOLE USING A REMOVABLE COVER LAYER

A core or sub-composite structure is provided including a dielectric layer between a first conductive film and a second conductive film. The first conductive film may include a first peelable/removable cover layer formed on or coupled to a first conductive layer. The second conductive film may include a second peelable/removable cover layer formed on or coupled to a second conductive layer. 1. A method for making a laminated structure using , comprising: a first conductive film comprising a removable or peelable first cover layer formed on a first conductive layer;', 'a dielectric layer coupled to the first conductive layer of the first second conductive film;, 'forming a first core or sub-composite structure, the first core or sub-composite structure comprisingforming a hole in the first core or sub-composite structure, the hole extending through the first conductive film and the dielectric layer;depositing a plating resist in the hole in the first core or sub-component structure; andremoving the first cover layer to clean off excess or residual plating resist on an upper surface of the first core or sub-component structure.2. The method of claim 1 , further comprising:forming a through-hole through the first core or sub-composite structure and the plating resist; andplating an interior surface of the through-hole with a conductive material forming a segmented plated through-hole.3. The method of claim 1 , further comprising:patterning at least of the first conductive layer to form via pads, antipads, and/or electrical traces.4. The method of claim 1 , further comprising:laminating one or more additional dielectric layers and one or more additional core or sub-composite structures to the first core or sub-composite structure.5. The method of claim 1 , wherein the removable or peelable first cover layer is less than 35 microns.6. The method of claim 1 , wherein the first conductive layer has a thickness of between 3 microns and 210 microns.7. The method of claim 1 , ...

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES USING PLATING RESIST

A multilayer printed circuit board is provided having a first conductive layer and a first plating resist selectively positioned within the first conductive layer. A second plating resist may be selectively positioned within a second conductive layer. A through hole extends through the first plating resist in the first conductive layer and the second plating resist in the second conductive layer. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment. 1. A multilayer printed circuit board , comprising:a first conductive layer;a first plating resist selectively positioned within the first conductive layer;a second plating resist selectively positioned within a second conductive layer, the second plating resist separate from the first plating resist; anda through hole extending through the first plating resist in the first conductive layer, and the second plating resist in the second conductive layer, where an interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist to form a partitioned plated through hole having a first via segment electrically isolated from a second via segment.2. The multilayer printed circuit board of claim 1 , wherein the first plating resist is located adjacent a first surface of a first core or sub-composite structure claim 1 , and the second plating resist is located adjacent a second surface of a second core or sub-composite structure.3. The multilayer printed circuit board of claim 1 , wherein the first plating resist is located adjacent a first surface of a first core or sub-composite structure and the second plating resist is located adjacent an opposite second surface of the first core or sub-composite structure.4 ...

Printed Circuit Board and Manufacture Method Thereof

A printed circuit board is disclosed having a substrate with an insulating layer, aluminum foil layers disposed on both sides of the insulating layer, and a through-hole formed in the insulating layer and aluminum foil layers. A metal layer is disposed over an exposed surface of the insulating layer positioned along an inner surface of the through-hole. A zinc film is positioned on a surface of the aluminum foil. A metal film is disposed over the zinc film. A plating film is disposed on a surface of the metal film. A circuit pattern is etched through the aluminum foil and the plating film. 1. A printed circuit board comprising: an insulating layer,', 'aluminum foil layers disposed on both sides of the insulating layer, and', 'a through-hole formed in the insulating layer and aluminum foil layers;, 'a substrate having'}a metal layer disposed over an exposed surface of the insulating layer positioned along an inner surface of the through-hole;a zinc film positioned on a surface of the aluminum foil;a metal film disposed over the zinc film;a plating film disposed on a surface of the metal film; anda circuit pattern etched through the aluminum foil and the plating film.2. The printed circuit board of claim 1 , wherein the aluminum foil has a chemically etched surface roughness.3. The printed circuit board of claim 1 , further comprising a bonding material positioned between the aluminum foil and the insulating layer.4. The printed circuit board of claim 3 , wherein the bonding material comprises a polyimide-based or epoxy-based bonding sheet.5. The printed circuit board of claim 3 , wherein the metal layer is formed on an exposed surface of the bonding material along the inner surface of the through-hole.6. The printed circuit board of claim 1 , wherein the substrate is multilayered claim 1 , having a plurality of insulating layers and aluminum foil disposed on both sides of each insulating layer.7. The printed circuit board of claim 1 , wherein the metal layer is a ...

SELECTIVE PARTITIONING OF VIA STRUCTURES IN PRINTED CIRCUIT BOARDS

The embodiments herein relate to a method for selective partitioning of a via in a printed circuit board as to produce an electrically isolating portion between two electrically conducting portions in said via. The method involves the step of prior to drilling the hole for the via, laminating plating resist layers to the printed circuit board at a distance from each other corresponding to a desired length of the electrically isolated portion of the via. After drilling, copper is added to selected portions of the interior of the via in two different processing steps followed by a step of removing undesired copper as to produce the electrically isolating portion.

CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING SAME

The circuit board assembly includes a first circuit board having a first plurality of electronic components attached to a major surface of the first circuit board. The first plurality of electronic components is electrically interconnected to a first plurality of conductive pads defined on the major surface of the first circuit board. A second circuit board has a second plurality of electronic components attached to a first major surface of the second circuit board. The second plurality of electronic components is electrically interconnected to a second plurality of conductive pads defined on a second major surface of the second circuit board. The first and second circuit board are attached by coupling the first and second plurality of conductive pads. A portion of the first plurality of electronic components on the first circuit board are disposed within a cavity defined by the second major surface of the second circuit board. 1. A circuit board assembly , comprising:a first circuit board having a first plurality of electronic components attached to a major surface of the first circuit board and electrically interconnected by conductive traces with a first plurality of conductive pads defined on the major surface of the first circuit board; anda second circuit board having a second plurality of electronic components attached to a first major surface of the second circuit board and electrically interconnected to a second plurality of conductive pads defined on a second major surface of the second circuit board opposite the first major surface, wherein the first plurality of conductive pads are electrically and mechanically coupled to the second plurality of conductive pads and wherein a portion of the first plurality of electronic components are disposed within a cavity defined by the second major surface.2. The assembly according to claim 1 , wherein the cavity is characterized as a channel in the second major surface extending from a first minor surface of the ...

Semiconductor device and circuit board

A semiconductor device includes a semiconductor chip, a plurality of external terminals, and a board. The board includes a first main surface in which a plurality of first electrodes electrically connected to the semiconductor chip are formed, a second main surface in which a plurality of second electrodes electrically connected to the plurality of external terminals are formed, and a plurality of interconnect layers, provided between the first main surface and the second main surface, for forming a plurality of signal paths that electrically connect the first electrode and the second electrode corresponding thereto. The interconnect layer includes a plurality of metal members which are dispersedly disposed at a distance shorter than an electromagnetic wavelength equivalent to a signal band of a signal supplied to the signal path, in the vicinity of a portion in which a structure of an interconnect for forming the signal path is changed.

PRINTED CIRCUIT BOARD, ELECTRONIC COMPONENT-EMBEDDED SUBSTRATE, AND MANUFACTURING METHOD THEREOF

A printed circuit board and an electronic component-embedded substrate including the same are provided. The printed circuit board includes a first insulating layer, a second insulating layer disposed on the first insulating layer, a barrier layer disposed between the first and second insulating layers, a cavity penetrating through one of the first and second insulating layers, and a first wiring layer at least partially in contact with the barrier layer. The barrier layer has a modulus lower than a modulus of each of the first and second insulating layers. 1. A printed circuit board comprising:a first insulating layer;a second insulating layer disposed on the first insulating layer;a barrier layer disposed between the first and second insulating layers;a cavity penetrating through one of the first and second insulating layers; anda first wiring layer at least partially in contact with the barrier layer,wherein the barrier layer has a modulus lower than a modulus of each of the first and second insulating layers.2. The printed circuit board of claim 1 , wherein the barrier layer is a primer layer thinner than each of the first and second insulating layers.3. The printed circuit board of claim 2 , wherein the primer layer includes an insulating resin without an inorganic filler and glass fiber claim 2 , andthe first and second insulating layers include an insulating resin, an inorganic filler, and glass fiber.4. The printed circuit board of claim 2 , wherein the second insulating layer has a modulus lower than a modulus of the first insulating layer claim 2 , andthe cavity penetrates through the first insulating layer.5. The printed circuit board of claim 4 , wherein the primer layer includes an insulating resin without an inorganic filler and glass fiber claim 4 ,the first insulating layer includes an insulating resin, an inorganic filler, and glass fiber, andthe second insulating layer includes an inorganic filler and an insulating resin without glass fiber.6. The ...

CONDUCTIVE POLYMERS WITHIN DRILLED HOLES OF PRINTED CIRCUIT BOARDS

A triggering condition is applied to a conductive polymer positioned in a drilled hole in a printed circuit board. The applied triggering condition causes the polymer to vertically expand within the drilled hole such that the expanded polymer creates an electrically conductive path between contact pads located in different layers of the printed circuit board. 110-. (canceled)11. A computer program product comprising a computer readable storage medium , wherein the computer readable storage medium is not a transitory signal per se , the computer readable storage medium having program instructions embodied therewith , the programs instructions configured , when executed by at least one processor , to cause the at least processor to perform a method comprising:sending a command to apply a triggering condition to a conductive polymer positioned in a drilled hole in a printed circuit board to vertically expand the polymer within the drilled hole such that the expanded polymer creates an electrically conductive path between contact pads located in different layers of the printed circuit board.12. The computer program product of claim 11 , wherein the method further comprises:sending a command to remove the triggering condition from the expanded polymer, whereby the polymer vertically contracts within the drilled hole such that the electrically conductive path between the contact pads is broken.13. The computer program product of claim 11 , wherein electronic components communicate across the electrically conductive path created by the expanded polymer.14. The computer program product of claim 11 , wherein the polymer comprises a composite with an elastomer matrix and a conductive filler claim 11 , and the triggering condition is heat applied to the polymer.15. The computer program product of claim 11 , wherein the polymer comprises an electroactive polymer claim 11 , and the triggering condition is voltage applied to the polymer.16. A printed circuit board comprising a ...

CONDUCTIVE POLYMERS WITHIN DRILLED HOLES OF PRINTED CIRCUIT BOARDS

A triggering condition is applied to a conductive polymer positioned in a drilled hole in a printed circuit board. The applied triggering condition causes the polymer to vertically expand within the drilled hole such that the expanded polymer creates an electrically conductive path between contact pads located in different layers of the printed circuit board. 1. A method comprising applying a triggering condition to a conductive polymer positioned in a drilled hole in a printed circuit board to vertically expand the polymer within the drilled hole such that the expanded polymer creates an electrically conductive path between contact pads located in different layers of the printed circuit board.2. The method of claim 1 , further comprising:removing the triggering condition from the expanded polymer, whereby the polymer vertically contracts within the drilled hole such that the electrically conductive path between the contact pads is broken.3. The method of claim 1 , wherein the applying the triggering condition is responsive to a command from a processor to establish an electrical connection between the contact pads.4. The method of claim 3 , further comprising:responsive to a second command from the processor to sever the electrical connection, withdrawing the triggering condition from the polymer to contract the expanded polymer such that the electrically conductive path between the contact pads is broken.5. The method of claim 1 , wherein electronic components communicate across the electrically conductive path created by the expanded polymer.6. The method of claim 1 , wherein the polymer comprises a composite with an elastomer matrix and a conductive filler claim 1 , and the triggering condition is heat applied to the polymer.7. The method of claim 6 , wherein the heat is applied via a heated filament positioned in or near the polymer.8. The method of claim 1 , wherein the polymer comprises an electroactive polymer claim 1 , and the triggering condition is ...

CONDUCTIVE POLYMERS WITHIN DRILLED HOLES OF PRINTED CIRCUIT BOARDS

A triggering condition is applied to a conductive polymer positioned in a drilled hole in a printed circuit board. The applied triggering condition causes the polymer to vertically expand within the drilled hole such that the expanded polymer creates an electrically conductive path between contact pads located in different layers of the printed circuit board. 1receiving, from a processor, a first command to establish an electrical connection between two contact pads located in different layers of a printed circuit board;responsive to the first command, decreasing a pressure in a server rack in which the printed circuit board is situated, wherein the decreased pressure causes gas-filled microspheres in a conductive polymer positioned in a drilled hole in the printed circuit board to expand whereby the polymer vertically expands within the drilled hole such that the expanded polymer creates an electrically conductive path between the contact pads;communicating, by electronic components, across the electrically conductive path created by the expanded polymer;receiving, from the processor, a second command to sever the electrical connection; andresponsive to the second command, increasing the pressure in the server rack, wherein the increased pressure causes the expanded gas-filled microspheres to contract whereby the polymer vertically contracts within the drilled hole such that the electrically conductive path between the contact pads is broken.. A method comprising: The present disclosure relates generally to printed circuit boards, and, more particularly, to the expansion and contraction of conductive polymers within drilled holes of printed circuit boards.Often multiple vias are used in a multi-layered printed circuit board to electrically connect annular contact pads of conductive traces in differing (conductive) layers of the board. During the manufacturing of the printed circuit board, the vias may be created by plating drilled holes in the board with a ...

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns. 1. A printed circuit board comprising:a plurality of layers including attachment layers and routing layers; and first and second signal vias extending through the attachment layers and connecting to respective signal traces on at least one of the routing layers;', 'ground vias extending through at least the attachment layers; and', 'non-plated air holes associated with each of the first and second signal vias and extending to a predetermined depth in the plurality of layers., 'via patterns formed in one or more of the plurality of layers, each of the via patterns comprising2. The printed circuit board as defined in claim 1 , wherein the non-plated air holes are located on opposite sides of the first and second signal vias.3. The printed circuit board as defined in claim 1 , wherein the non-plated air holes have smaller diameters than the first and second signal vias.4. The printed circuit board as defined in claim 1 , wherein the non-plated air holes extend through the attachment layers of the plurality of layers.5. The printed circuit board as defined in claim 1 , wherein one or more of the attachment layers includes a ground plane and wherein the ground plane is removed in an area around the first and second signal vias to form an antipad.6. ...

MULTILAYER PRINTED WIRING BOARD

A multilayer printed wiring board includes a core base material having a penetrating portion, a low-thermal-expansion substrate accommodated inside the penetrating portion of the core base material and having a first surface for mounting a semiconductor element and a second surface on the opposite side of the first surface, a first through-hole conductor provided inside the low-thermal-expansion substrate and provided for electrical connection between the first surface and the second surface of the low-thermal-expansion substrate, a filler filled in a gap between the low-thermal-expansion substrate and an inner wall of the core base material, and a wiring layer formed on at least one of the first surface and the second surface of the low-thermal-expansion substrate and having a resin insulation layer and a conductive layer. The wiring layer has a via conductor connecting the first through-hole conductor and the conductive layer. 1. A method for manufacturing a multilayer printed wiring board , comprising:providing a core base material having a penetrating portion and placed on a support material;mounting a low-thermal-expansion substrate having a through-hole conductor on the support material such that the low-thermal-expansion substrate is placed in the penetrating portion of the core base material;forming at least one insulation layer on the low-thermal-expansion substrate and the core base material such that a portion of an insulating material of the insulation layer is filled in a gap between the low-thermal-expansion substrate and an inner wall of the core base material and that the low-thermal-expansion substrate is fixed to the core base material;forming a conductive layer on the insulation layer;forming inside the insulation layer a via conductor electrically connected to the conductive layer; andremoving the support material after the low-thermal-expansion substrate is fixed to the core base material.2. The method for manufacturing a multilayer printed ...

SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD USING SAME

A surface-treated copper foil of the present disclosure includes a copper foil substrate, at least one surface of which has a surface treatment coat including at least a roughening-treated surface on which roughening particles are formed. Observation of a cross-section of the surface-treated copper foil with a scanning electron microscope shows that on a surface of the surface treatment coat, a standard deviation of the particle height of the roughening particles is 0.16 μm or more and 0.30 μm or less, and an average value of the ratio of the particle height to the particle width (particle height/particle width) of the roughening particles is 2.30 or more and 4.00 or less. 1. A surface-treated copper foil comprising a copper foil substrate , at least one surface of which has a surface treatment coat including at least a roughening-treated surface on which roughening particles are formed , whereinobservation of a cross-section of the surface-treated copper foil with a scanning electron microscope shows thaton a surface of the surface treatment coat, a standard deviation of the particle height of the roughening particles is 0.16 μm or more and 0.30 μm or less, and an average value of a ratio of the particle height to the particle width (particle height/particle width) of the roughening particles is 2.30 or more and 4.00 or less.2. A surface-treated copper foil comprising a copper foil substrate , at least one surface of which has a surface treatment coat including at least a roughening-treated surface on which roughening particles are formed , whereinobservation of a cross-section of the surface-treated copper foil with a scanning electron microscope shows thaton a surface of the surface treatment coat, a standard deviation of the particle height of the roughening particles is 0.16 μm or more and 0.30 μm or less, and an average value of a ratio of the particle height to the particle width (particle height/particle width) of the roughening particles is 2.30 or more and ...

PCB Based Semiconductor Package Having Integrated Electrical Functionality

A semiconductor package includes a metal baseplate, a semiconductor die having a reference terminal attached to the baseplate and an RF terminal facing away from the baseplate, and a multilayer circuit board having a first side attached to the baseplate and a second side facing away from the baseplate. The multilayer circuit board includes a plurality of interleaved signal and ground layers. One of the signal layers is at the second side of the multilayer circuit board and electrically connected to the RF terminal of the semiconductor die. One of the ground layers is at the first side of the multilayer circuit board and attached to the metal baseplate. Power distribution structures are formed in the signal layer at the second side of the multilayer circuit board. RF matching structures are formed in a different one of the signal layers than the power distribution structures.

SPACE TRANSFORMER AND MANUFACTURING METHOD THEREOF

A space transformer for connecting a signal source and probing a semiconductor wafer and a manufacturing method thereof are provided. The space transformer includes a circuit board including a wiring structure, a redistribution structure bonded to the circuit board and including second contact pads configured to probe the semiconductor wafer, a conductive through via penetrating through the circuit board and providing a vertical conductive path between the circuit board and redistribution structure. A plurality of first contact pads of the wiring structure is configured to connect the signal source. The redistribution structure is thinner than the circuit board, wherein a pitch of the adjacent second contact pads is finer than that of the adjacent first contact pads. 1. A space transformer for connecting a signal source and probing a semiconductor wafer , the space transformer comprising:a circuit board comprising a wiring structure, a plurality of first contact pads of the wiring structure configured to connect the signal source;a redistribution structure bonded to the circuit board and comprising a plurality of second contact pads, the second contact pads configured to probe the semiconductor wafer, the redistribution structure being thinner than the circuit board, wherein a pitch of the adjacent second contact pads is finer than that of the adjacent first contact pads; anda conductive through via penetrating through the circuit board and providing a vertical conductive path between the circuit board and redistribution structure.2. The space transformer according to claim 1 , wherein the redistribution structure further comprises a patterned dielectric layer having an outer surface substantially leveled with outer surfaces of the second contact pads.3. The space transformer according to claim 1 , wherein the wiring structure of the circuit board comprises a first conductive via connected to the first contact pads claim 1 , the redistribution structure comprises a ...

Printed circuit board and manufacturing method thereof

There is provided a printed circuit board including: a core layer having a cavity formed therein; a heat radiation body included in the cavity; an insulating layer provided on an upper surface and a lower surface of the core layer; and a heat dissipating via penetrating through the insulating layer to be in contact with the heat radiation body and dissipating heat externally, wherein the heat radiation body includes an insulating plate, a first metal block formed on an upper surface of the insulating plate, and a second metal block formed on a lower surface of the insulating plate.

Printed circuit board and method of manufacturing the same

The object of the present invention is to provide a printed circuit board formed with a cavity to mount a semiconductor chip.

INSULATING FILM, PRINTED CIRCUIT BOARD USING THE SAME, AND METHOD OF MANUFACTURING THE PRINTED CIRCUIT BOARD

There are provided an insulating film, a printed circuit board including the insulating film, and a method of manufacturing the printed circuit board. The insulating film includes a first insulating material; a second insulating material; and a metal thin film disposed between the first insulating material and the second insulating material. 1. An insulating film comprising:a first insulating material;a second insulating material; anda metal thin film disposed between the first insulating material and the second insulating material.2. A printed circuit board comprising:a board on which an inner layer buildup layer is formed;a first insulating layer formed on the inner layer buildup layer;a metal layer formed on the first insulating layer;a second insulating layer formed on the metal layer;a via formed to pass through the first insulating layer, the metal layer, and the second insulating layer and be in contact with an inner layer circuit layer of the inner layer buildup layer; andan insulating coating layer formed between the first insulating layer, the metal layer, and the second insulating layer and the via.3. The printed circuit board of claim 2 , wherein the metal layer is formed to be in contact with an entire one surface of the first insulating layer.4. The printed circuit board of claim 2 , wherein the metal layer is a ground layer.5. The printed circuit board of claim 2 , wherein the inner layer buildup layer includes one or more layers of the inner layer circuit layer.6. The printed circuit board of claim 2 , further comprising: a solder resist layer formed on the second insulating layer.7. The printed circuit board of claim 2 , further comprising: an outer layer buildup layer formed on the second insulating layer and including one or more layers of outer layer circuit layer.8. The printed circuit board of claim 7 , further comprising: a solder resist layer formed on the outer layer buildup layer.9. A method of manufacturing a printed circuit board claim 7 ...

APPARATUS AND METHOD FOR IMPEDANCE BALANCING OF LONG RADIO FREQUENCY (RF) VIA

An apparatus comprising a stack of printed circuit board (PCB) layers having a primary longitudinal structure forming a radio frequency (RE) via including a principal tuning section () and a constant longitudinal structure () along a conductive column support () journaled through the layers in the via. The principal section () comprising a first tuning sub-assembly ( A) in a first portion of the RE via above the longitudinal structure () and at an entrance of the primary longitudinal structure () and comprising a first set of pad, anti-pad pairs () tuned to receive an RE band. A second principal tuning sub-assembly (B) in a second portion of the via below the longitudinal structure () and at an exit of the primary longitudinal structure and comprising a second set of pad, anti-pad pairs () tuned to receive the band and mirroring the first set of pairs. 1. A printed circuit board (PCB) apparatus , comprising:{'b': ['3', '19', '221', '220', '223', '227', '255', '3', '19', '220', '223'], '#text': 'a plurality of printed circuit board (PCB) layers (L-L) forming a stack of PCB layers having formed therein a primary longitudinal structure () forming a radio frequency (RF) via () including a principal tuning section () and a constant longitudinal structure () along a conductive column support () journaled through the PCB layers (L-L) in the via (), the principal tuning section () comprising:'}{'b': ['229', '220', '227', '221', '445', '545', '645'], '#text': 'a first principal tuning sub-assembly (A) formed in a first portion of the RF via () located above the constant longitudinal structure () and at a first or entrance end of the primary longitudinal structure () and comprising a first set of pad, anti-pad pairs (, , ) tuned to receive and pass an RF band; and'}{'b': ['229', '220', '227', '221', '445', '545', '645', '445', '545', '645'], '#text': 'a second principal tuning sub-assembly (B) formed in a second portion of the RF via () below the constant longitudinal ...

Systems and methods for removing undesired metal within vias from printed circuit boards

The disclosure provides a multilayer structure for a printed wiring board (PWB). The multilayer structure may include a plurality of insulating layers interleaved with a plurality of conductive layers comprising at least one inner conductive layer. The multilayer structure may also include one or more stub-less plated through-holes through the plurality of insulating layers and the plurality of conductive layers. The multilayer structure may include at least one secondary material layer formed on the at least one inner conductive layer. The secondary material layer defines a void that creates a discontinuity in the plated through-hole to achieve segmented metallization of the plated through-hole. The disclosure also provides a method of forming the multilayer structure.

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

A printed circuit board in accordance with a disclosed embodiment may include first insulating layer having first via formed therein and second insulating layer laminated on both surfaces of the first insulating layer and having second via formed therein. The second via may connect first circuit formed on the first insulating layer with second circuit formed on the second insulating layer. A diameter of the second via may become greater toward an inside of the printed circuit board. 1. A printed circuit board , comprising:first insulating layer having first via formed therein; andsecond insulating layer laminated on both surfaces of the first insulating layer and having second via formed therein,wherein the second via connects first circuit formed on the first insulating layer with second circuit formed on the second insulating layer, andwherein a diameter of the second via becomes greater toward an inside of the printed circuit board.2. The printed circuit board as set forth in claim 1 , wherein a diameter of the first via is constant from one surface to the other surface of the first insulating layer.3. The printed circuit board as set forth in claim 1 , wherein a diameter of the first via becomes smaller from one surface to the other surface of the first insulating layer.4. The printed circuit board as set forth in claim 1 , further comprising solder resist laminated on the second insulating layer claim 1 ,wherein the solder resist has opening formed therein, andwherein a diameter of the opening becomes smaller toward the inside of the printed circuit board.5. A method of fabricating a printed circuit board claim 1 , comprising:processing first via hole in first insulating layer;forming first circuit on both surfaces of the first insulating layer and forming first via in the first via hole;processing second via hole in second insulating layer;laminating the second insulating layer on the first insulating layer in such a way that a processing surface of the second ...

WIRING STRUCTURE

A wiring structure includes an upper conductive structure, a lower conductive structure and an intermediate layer. The upper conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The lower conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The intermediate layer is disposed between the upper conductive structure and the lower conductive structure and bonds the upper conductive structure and the lower conductive structure together. The upper conductive structure is electrically connected to the lower conductive structure. The intermediate layer includes a plurality of sub-layers. Each of the sub-layers is formed from a polymeric material. A boundary is formed between two adjacent sub-layers. 1. A wiring structure , comprising:an upper conductive structure including at least one dielectric layer and at least one circuit layer in contact with the dielectric layer;a lower conductive structure including at least one dielectric layer and at least one circuit layer in contact with the dielectric layer; andan intermediate layer disposed between the upper conductive structure and the lower conductive structure and bonding the upper conductive structure and the lower conductive structure together, wherein the upper conductive structure is electrically connected to the lower conductive structure, the intermediate layer includes a plurality of sub-layers, each of the sub-layers is formed from a polymeric material, and a boundary is formed between two adjacent sub-layers.2. The wiring structure of claim 1 , wherein a line space of the circuit layer of the lower conductive structure is greater than a line space of the circuit layer of the upper conductive structure.3. The wiring structure of claim 1 , wherein the lower conductive structure further includes a core portion claim 1 , the at least one lower dielectric layer and the ...

WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

A wiring structure includes an upper conductive structure, a lower conductive structure, a plurality of metallic structures and an intermediate layer. The upper conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The lower conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The metallic structures are disposed between the upper conductive structure and the lower conductive structure, and electrically connecting the upper conductive structure and the lower conductive structure. The intermediate layer is disposed between the upper conductive structure and the lower conductive structure, and covers the metallic structures. 1. A wiring structure , comprising:an upper conductive structure including at least one dielectric layer and at least one circuit layer in contact with the dielectric layer;a lower conductive structure including at least one dielectric layer and at least one circuit layer in contact with the dielectric layer;a plurality of metallic structures disposed between the upper conductive structure and the lower conductive structure, and electrically connecting the upper conductive structure and the lower conductive structure; andan intermediate layer disposed between the upper conductive structure and the lower conductive structure, and covering the metallic structures,wherein each of the metallic structures includes an upper metallic portion in contact with a circuit layer of the upper conductive structure, and a lower metallic portion in contact with a circuit layer of the lower conductive structure, wherein the upper metallic portion of the metallic structure is symmetrical with the lower metallic portion of the metallic structure, andwherein the upper metallic portion of the metallic structure includes a first upper layer disposed on a circuit layer of the upper conductive structure, and the lower ...

MODULE-EMBEDDED MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

A module-embedded multilayer circuit board includes an inner circuit board, component embedded module embedded in the through opening, a first outer circuit board, and a second outer circuit board. A through opening is defined in the inner circuit board. The component embedded module includes a top surface and side surfaces. The top surface has a length greater than that of the two side surfaces. Each component embedded module includes a component, upper circuit patterns formed on the top surface, and side circuit patterns formed on the side surface and exposed from the through opening. The first and the second outer circuit board are formed on the inner circuit board. One end of the side circuit patterns is electrically connected to the first and the second outer circuit board, the other end of the side circuit patterns is electrically connected to the component by the upper circuit patterns, respectively. 1. A module-embedded multilayer circuit board , comprising:an inner circuit board, wherein at least one through opening is defined in the inner circuit board;at least one component embedded module embedded in the at least one through opening; wherein the component embedded module comprises a top surface and at least two side surfaces connected to the top surface, the top surface has a length greater than that of each of the two side surfaces; wherein each of the at least one component embedded module comprises a component, at least two upper circuit patterns, and two groups of side circuit patterns; the at least two upper circuit patterns are formed on the top surface; the two groups of side circuit patterns are formed on the side surface and exposed from the through opening of the inner circuit board;at least one first outer circuit board; andat least one second outer circuit board; wherein the first outer circuit board and the second outer circuit board are formed on two opposite surfaces of the inner circuit board; one end of the two groups of side circuit ...

Wiring board and method for manufacturing the same

A wiring board includes core substrate, a first build-up layer on first surface of the substrate and including conductive and insulating resin layers, and a second build-up layer on second surface of the substrate and including conductive and insulating resin layers. The first build-up is formed such that each conductive layer includes a metal foil layer and a plating layer on the foil layer and the foil layer of a conductive layer on an outermost resin layer has thickness greater than thickness of the foil layer of each conductive layer on a non-outermost resin layer, and the second build-up is foimed such that each conductive layer includes a metal foil layer and a plating layer on the foil layer and the foil layer of a conductive layer on an outermost resin layer has thickness greater than thickness of the foil layer of each conductive layer on a non-outermost resin layer.

SYSTEMS AND METHODS FOR FREQUENCY SHIFTING RESONANCE OF AN UNUSED VIA IN A PRINTED CIRCUIT BOARD

In accordance with embodiments of the present disclosure, a circuit board may include a first trace formed in a first layer of the circuit board, a second trace formed in a second layer of the circuit board, a via, and a termination pad. The via may be configured to electrically couple the first trace to the second trace, the via comprising a via stub corresponding to a first portion of a length of the via not within a second portion of the via between a first location in which the first trace is electrically coupled to the via and a second location in which the second trace is electrically coupled to the via. The termination pad may be formed at an end of the via stub opposite at least one of the first location and the second location. 123-. (canceled)24. A method comprising:determining a length of a via stub, the via stub corresponding to a first portion of a via not within a second portion of the via electrically coupling a first trace of a circuit board to a second trace of the circuit board;determining a Nyquist frequency of signals communicated on the via and one or more harmonic frequencies thereof;estimating a resonance frequency of the via stub based on the length; andin response to determining that the resonance frequency is approximately equal to the Nyquist frequency or one of the one or more harmonic frequencies, determine a size of a termination pad to be formed on an end of the via stub.25. The method of claim 24 , the size of the termination pad determined such that an effective impedance of the via stub having the termination pad formed thereon is approximately equal to a desired impedance.26. The method of claim 25 , wherein the desired impedance comprises at least one of a desired capacitance and a desired inductance.27. The method of claim 25 , wherein the desired impedance is selected such that the via stub has a desired effective resonant frequency.28. The method of claim 24 , wherein the size is a radius of the termination pad.29. The method ...

Pcb backdrilling method and system

A printed circuit board (PCB) backdrilling method is disclosed, where a conductive layer is disposed between a surface of a PCB on an intended-for-backdrilling side of a plated through hole (PTH) and a target signal layer of the PCB, and the method includes: performing a first backdrilling on the PTH with a first preset depth starting from the surface of the PCB; controlling the backdrill bit to move along the drill hole formed in the first backdrilling toward the target signal layer; and when the backdrill bit is in contact with the conductive layer, completing a second backdrilling with a second preset depth starting from the conductive layer.

THROUGH-HOLE-VIAS IN MULTI-LAYER PRINTED CIRCUIT BOARDS

Example multi-layer printed circuit boards (‘PCBs’) are described as well as methods of manufacturing a PCB. Embodiments include depositing upon layers of laminate printed circuit traces and joining the layers of laminate. Embodiments also include drilling at least one via hole through the layers of laminate and placing in the via hole a via conductor comprising a used portion and an unused portion, the via conductor comprising copper coated with a second metal having a conductivity lower than the conductivity of copper. 1. A method of manufacturing a multi-layer printed circuit board (‘PCB’) comprising:depositing upon layers of laminate printed circuit traces;joining the layers of laminate;drilling at least one via hole through the layers of laminate;placing in the via hole a via conductor comprising a used portion and an unused portion, the via conductor comprising copper coated with a second metal having a conductivity lower than the conductivity of copper.2. The method of further comprising:forming the used portion of the via conductor so as to conduct an alternating current signal from a trace on one layer of the PCB to a trace on another layer of the PCB,the alternating current signal characterized by a frequency high enough to demonstrate skin effect, moving the alternating current toward the surface of the via conductor.3. The method of further comprising:forming the unused portion of the via conductor with no connection to any further trace,the unused portion of the via conductor implementing a resonant stub effecting an insertion loss of the alternating current signal centered on a resonant frequency,the metal having a conductivity lower than the conductivity of copper increasing resistive dampening of resonance and reducing the insertion loss.4. The method of wherein:both the used portion and the unused portion of the via conductor comprise copper, andonly the unused portion of the via conductor is coated with a metal having a conductivity lower than the ...

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT-EMBEDDED SUBSTRATE AND ELECTRONIC COMPONENT-EMBEDDED SUBSTRATE

Disclosed herein are a method for manufacturing an electronic component-embedded substrate and an electronic component-embedded substrate. The method includes: inserting an electronic component having an external electrode into a cavity penetrating through a core substrate; forming a multilayer body in which the electronic component is embedded by stacking an insulating layer on upper and lower portions of the core substrate; forming a through-hole exposing the external electrode of the electronic component and penetrating through the multilayer body; and filling the through-hole with a conductive material. 1. A method for manufacturing an electronic component-embedded substrate , the method comprising:inserting an electronic component having an external electrode into a cavity penetrating through a core substrate;forming a multilayer body in which the electronic component is embedded by stacking an insulating layer on upper and lower portions of the core substrate;forming a through-hole exposing the external electrode of the electronic component and penetrating through the multilayer body; andfilling the through-hole with a conductive material.2. The method according to claim 1 , wherein in the forming of the through-hole claim 1 , the external electrode is exposed to an inner portion of the through-hole through a COlaser processing.3. The method according to claim 1 , wherein in the filling of the through-hole with the conductive material claim 1 , the electronic component-embedded substrate is formed by filling the through-hole with a conductive paste.4. The method according to claim 1 , wherein in the filling of the through-hole with the conductive material claim 1 , the through-hole is filled with the conductive material through a plating process.5. The method according to claim 1 , further comprising forming a stack via structure by stacking an additional insulating layer on the multilayer body in which the through-hole is filled and forming a via hole ...

Impedance matching structure of transmission line in multilayer circuit board

An impedance matching structure is disposed on a multilayer circuit board for matching an impedance of a transmission line for transmitting an electronic signal. At least one redundant conducting section is coupled to a conductive member of the transmission line between input and output terminals of the transmission line. The conductive member and the redundant conducting section are disposed in a corresponding plating hole. At least one grounding member disposed adjacent to but separated from either or both of the conductive member of the transmission line and the at least one redundant conducting section in a capacitor structure for impedance matching. The at least one grounding member includes a first grounding member penetrating through at least two layers of the multilayer circuit board.

PIN ARRAY INCLUDING SEGMENTED PINS FOR FORMING SELECTIVELY PLATED THROUGH HOLES

A process includes utilizing a pin array that includes multiple segmented pins for forming selectively plated through holes. The process includes forming a PCB laminate structure that includes multiple spinel-doped core layers and multiple through holes. Each spinel-doped core layer includes a heat-activated spinel material incorporated into a dielectric material. The process includes aligning individual segmented pins of a pin array with corresponding through holes of the PCB laminate structure, where each segmented pin includes heated segment(s) and insulating segment(s). The process includes inserting the segmented pins of the pin array into the corresponding through holes and generating heat within each heated pin segment that is sufficient to form metal nuclei sites in selected regions of the spinel-doped core layers adjacent to portions of the through holes that contain the heated pin segments. The metal nuclei sites function as seed layers to enable formation of selectively plated through holes. 1. A process of utilizing a pin array that includes multiple segmented pins for forming selectively plated through holes , the process comprising:forming a printed circuit board (PCB) laminate structure that includes a plurality of spinel-doped core layers and a plurality of through holes, wherein each spinel-doped core layer of the plurality of spinel-doped core layers includes a heat-activated spinel material incorporated into a dielectric material;aligning individual segmented pins of a plurality of segmented pins of a pin array with corresponding through holes of the plurality of through holes of the PCB laminate structure, wherein each segmented pin of the plurality of segmented pins includes one or more heated segments and one or more insulating segments;inserting the plurality of segmented pins of the pin array into the corresponding through holes;generating heat within each heated segment of the plurality of segmented pins that is sufficient to form metal ...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

There are provided a printed circuit board including: an insulation layer in which a via hole is formed; vias formed in the via hole; first circuit patterns formed below the insulation layer and electrically connected to the vias; and second circuit patterns formed on the insulation layer to be bonded to the vias; wherein the via has a diameter smaller than that of the via hole, and a method of manufacturing a printed circuit board. 1. A printed circuit board comprising:an insulation layer in which a via hole is formed;vias formed in the via hole;first circuit patterns formed below the insulation layer and electrically connected to the vias; andsecond circuit patterns formed on the insulation layer to be bonded to the vias;wherein the via has a diameter smaller than that of the via hole.2. The printed circuit board of claim 1 , wherein one side surface of the via contacts the insulation layer claim 1 , and the other side surface thereof does not contact the insulation layer.3. The printed circuit board of claim 1 , wherein the second circuit patterns have a diameter smaller than that of the via hole.4. The printed circuit board of claim 1 , wherein the first circuit patterns have a diameter smaller than that of the via hole.5. The printed circuit board of claim 1 , wherein the second circuit patterns have a diameter different from that of the via.6. The printed circuit board of claim 1 , wherein a plurality of vias are spaced apart from each other in the via hole.7. The printed circuit board of claim 1 , further comprising a via land formed below the insulation layer and bonded to a lower surface of the via.8. The printed circuit board of claim 7 , wherein the first circuit patterns are bonded to the via land.9. A method of manufacturing a printed circuit board comprising:forming a second insulation layer on the first insulation layer in which a via land is formed;forming a via hole exposing the via land in the second insulation layer;forming a plating resist in ...

MANUFACTURING METHOD OF CIRCUIT STRUCTURE EMBEDDED WITH HEAT-DISSIPATION BLOCK

A manufacturing method of circuit structure embedded with heat-dissipation block including the following steps is provided. A core board including a first dielectric layer and two first conductive layers located on two opposite sides of the first dielectric layer is provided. A through hole penetrated the core board is formed. A heat-dissipation block is disposed into the through hole. Two inner-layer circuits are formed on two opposite sides of the core board. At least one build-up structure is bonded on the core board, wherein the build-up structure includes a second dielectric layer and a second conductive layer, and the second dielectric layer is located between the second conductive layer and the core board. A cavity is formed on a predetermined region of the build-up structure, and the cavity is communicated with the corresponding inner-layer circuit. Another manufacturing method of circuit structure embedded with heat-dissipation block is also provided. 1. A manufacturing method of circuit structure embedded with heat-dissipation block , comprising:providing a core board, wherein the core board comprises a first dielectric layer and two first conductive layers, and the two first conductive layers are located on two opposite sides of the first dielectric layer, respectively;forming a through hole penetrated the core board;disposing a heat-dissipation block into the through hole;forming two inner-layer circuits on two opposite sides of the core board;bonding at least one build-up structure on the core board, wherein the build-up structure comprises a second dielectric layer and a second conductive layer, and the second dielectric layer is located between the second conductive layer and the core board; andforming a cavity on a predetermined region of the build-up structure, wherein the cavity is communicated with the corresponding inner-layer circuit and corresponding to the heat-dissipation block.2. The manufacturing method of circuit structure embedded with ...

Resin composition for permanent insulating film, permanent insulating film, multilayer printed wiring board, and process for producing the same

A resin composition for a permanent insulating film is provided, by which, in particular, partial through-holes obtained by partitioning a through-hole can be easily and precisely formed as designed without a deposition of catalytic species (seed) in a plating resist portion. The present invention provides a resin composition for a permanent insulating film, including a thermosetting resin, a resin filler, and a compound containing at least one atom selected from a sulfur atom and a nitrogen atom. The present invention also provides a multilayer printed wiring board in which conductive layers having a circuit pattern and insulation layers are alternately overlaid with each other, and a through-hole enabling electric conductivity among conductive layers via a through-hole. The through-hole includes a plating resist portion provided on either of an interlaminar part between the conductive layer and the insulation layer or another interlaminar part between the insulation layers, or both. The plating portion(s) is/are provided on the interlaminar parts which had been exposed in an opening as the through-hole, and on an exposed region other than the plating resist portion, and the plating resist portion is made of a cured product of the resin composition.

BOTTOM ELECTRODE SUBSTRATE FOR SEGMENT-TYPE ELECTRO-PHORETIC DISPLAY AND METHOD FOR MANUFACTURING THEREOF

The present disclosure provides a bottom electrode substrate for a segment-type electrophoretic display. The bottom electrode substrate includes a flexible substrate, a first conductive layer, an insulating layer, a second conductive layer and a segment-type electrode. The first conductive layer is disposed on the flexible substrate. The insulating layer covers the first conductive layer and the flexible substrate, wherein the insulating layer has at least one opening exposing a part of the first conductive layer. The second conductive layer is filled in the opening and in contact with the exposed first conductive layer. The segment-type electrode covers the second conductive layer and the insulating layer, and is in contact with the second conductive layer. A method for manufacturing the bottom electrode substrate is also provided herein. 1. A bottom electrode substrate for a segment-type electrophoretic display device , comprising:a flexible substrate;a first conductive layer disposed on the flexible substrate;a first insulating layer covering the flexible substrate and the first conductive layer, wherein the first insulating layer has at least one opening exposing a part of the first conductive layer;a second conductive layer filled in the opening and in contact with the exposed first conductive layer;a segment-type electrode covering the second conductive layer and the first insulating layer, and in contact with the second conductive layer,wherein the first conductive layer is formed of a first conductive slurry, the second conductive layer is formed of a second conductive slurry, and the segment electrode is formed of a third conductive slurry.2. The bottom electrode substrate of claim 1 , wherein the material of the flexible substrate comprises polyethylene terephthalate (PET) claim 1 , poly(methyl methacrylate) (PMMA) claim 1 , polycarbonate (PC) claim 1 , polyethylene (PE) claim 1 , polypropylene (PP) or a combination thereof.3. The bottom electrode ...

Circuit Board Apparatus and Method

A catalytic resin is formed by mixing a resin and either homogeneous or heterogeneous catalytic particles, the resin infused into a woven glass fabric to form an A-stage pre-preg, the A-stage pre-preg cured into a B-stage pre-preg, thereafter held in a vacuum and between pressure plates at a gel point temperature for a duration of time sufficient for the catalytic particles to migrate away from the resin rich surfaces of the pre-preg, thereby forming a C-stage pre-preg after cooling. The C-stage pre-preg subsequently has trenches formed by removing the resin rich surface, the trenches extending into the depth of the catalytic particles, optionally including drilled holes to form vias, and the C-stage pre-preg with trenches and holes placed in an electroless bath, whereby traces form in the trenches and holes where the surface of the cured pre-preg has been removed. 125-. (canceled)26. A circuit board layer comprising:a catalytic pre-preg having catalytic particles present except in an exclusion depth below a surface of the catalytic pre-preg;channels formed in the catalytic pre-preg with a depth which exceeds the exclusion depth;copper plated in the channels;said channels and said copper present on at least one side of the circuit board layer.27. The circuit board layer of where said catalytic particles are heterogeneous.28. The circuit board layer of where said catalytic particles comprise a filler coated with a catalyst.29. The circuit board layer of where said filler is at least one of: a clay mineral claim 28 , a hydrous aluminum phyllosilicate claim 28 , silicon dioxide claim 28 , kaolinite claim 28 , polysilicate claim 28 , a member of the kaolin or china clay family claim 28 , or a high temperature plastic.30. The circuit board layer of where said particle size is on the order of 3 u or less than 3 u.31. The circuit board layer of where the ratio of said catalytic particles to said resin by weight is in the range 8% to 16%.32. The circuit board layer of where ...

METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD

A method for producing a printed circuit board is disclosed, In the method, a slot is formed in a substrate having at least three layers with the slot extending through at least two of the layers. The slot has a length and a width with the length being greater than the width. The sidewall of the substrate surrounding the slot is coated with a conductive layer. Then, the conductive layer is separated into at least two segments that are electrically isolated along the side wall of the substrate. 1. A method for producing a printed circuit board , comprising the steps of:forming a slot in a substrate having at least three layers with the slot extending through at least two of the layers, the slot having a length and a width with the length being greater than the width;coating a sidewall of the substrate surrounding the slot with a conductive layer;separating the conductive layer into at least two segments that are electrically isolated along the side wall of the substrate.2. The method of claim 1 , wherein the step of separating the conductive layer into at least two segments that are electrically isolated is defined further as creating at least one cross-slot by removing a first portion of the conductive layer and the substrate and a second portion of the conductive layer and the substrate.3. The method of claim 2 , wherein the first portion and the second portion are aligned and located on opposite sides of the slot.4. The method of claim 2 , wherein the first portion and the second portion are spaced apart along the length of the slot.5. The method of claim 1 , wherein the the step of separating the conductive layer into at least two segments that are electrically isolated is defined further as positioning a tool having a diameter less than the slot into the slot so as to avoid contact with the conductive plating as the tool is positioned within the slot claim 1 , and moving the tool into the conductive plating and sidewall to form at least one cross-slot separating ...

SYSTEMS AND METHODS FOR INTERCONNECTING AND ISOLATING ANTENNA SYSTEM COMPONENTS

An antenna system circuit board stack with feed vias and with non-feed vias is disclosed. An antenna system circuit board stack as disclosed herein can include a plurality of patches or radiating elements formed on a common plane comprising a first surface of a circuit board. Each radiating element is electrically connected to one or more feed vias. In addition non-feed vias extend through, but are electrically isolated from, the radiating elements. An antenna system as disclosed herein enables the costs associated with multiple beam antenna systems, including but not limited to 5G communication systems, to be reduced as compared to alternative techniques. 1. An antenna system , comprising:a circuit board stack;a radiating element, wherein the radiating element is on a first layer of the circuit board stack; anda first non-feed via, wherein the first non-feed via extends between the radiating element and a second layer of the circuit board stack, and wherein the first non-feed via is electrically separated from the radiating element.2. The antenna system of claim 1 , further comprising:a first relieved area formed in the radiating element, wherein the first relieved area surrounds a portion of the first non-feed via to electrically separate the first non-feed via from the radiating element.3. The antenna system of claim 1 , further comprising a second non-feed via claim 1 , wherein the second non-feed via extends between the radiating element and the second layer of the circuit board stack claim 1 , and wherein the second non-feed via is electrically separated from the radiating element.4. The antenna system of claim 3 , further comprising:a first relieved area formed in the radiating element, wherein the first relieved area surrounds a portion of the first non-feed via to electrically separate the first non-feed via from the radiating element; anda second relieved area formed in the radiating element, wherein the second relieved area surrounds a portion of the ...

METHOD FOR MANUFACTURING TRANSFER FILM INCLUDING SEED LAYER, METHOD FOR MANUFACTURING CIRCUIT BOARD BY SELECTIVELY ETCHING SEED LAYER, AND ETCHING SOLUTION COMPOSITE

The disclosure relates to a method for manufacturing a transfer film including an electrode layer, the method comprising: an electrode layer formation step of forming an electrode layer on a carrier member by using a conductive material; a placement step of placing the carrier member on at least one side of an insulating resin layer respectively; a bonding step of bonding the carrier member and the insulating resin layer together by applying pressure thereto; and a transfer step of removing the carrier member to transfer the electrode layer on the insulating resin layer. 1. A method of manufacturing a transfer film comprising a seed layer , the method comprising:a seed-layer forming step of forming a seed layer with a first conductive material on a carrier member;a placing step of placing the seed layer on at least one side of an insulating resin layer;a bonding step of pressing and bonding the seed layer and the insulating resin layer in a thickness direction; anda transfer step of removing the carrier member to transfer the seed layer to the insulating resin layer.2. The method according to claim 1 , wherein the carrier member comprises a smooth surface.3. The method according to claim 2 , wherein the first conductive material comprises silver (Ag) claim 2 , a silver alloy claim 2 , or a silver compound.4. The method according to claim 1 , wherein the insulating resin layer comprises a prepreg sheet claim 1 , a bonding sheet claim 1 , or a hot-melt thermosetting resin.5. The method according to claim 4 , wherein the bonding step comprises performing a hot-press process to bond the insulating resin layer to the seed layer.6. The method according to claim 1 , wherein bonding force between the carrier member and the seed layer is weaker than bonding force between the insulating resin layer and the seed layer.7. The method according to claim 1 , further comprising a thermosetting-resin layer forming step of forming a thermosetting resin layer on the seed layer before ...

ELECTRICAL ASSEMBLY WITH A MULTILAYER BUS BOARD

An electrical assembly having an electrical device electrically connected to a multilayer bus board, which has a multilayer stacked assembly that includes a plurality of electrically conductive layer structures and at least one dielectric layer structure disposed between an adjacent pair of the conductive layer structures. A frame formed of a dielectric material encapsulates at least a portion of the multilayer stacked assembly and mechanically maintains the conductive layer structures and the dielectric layer structure in secure aligned abutting relation. 1. An electrical assembly , comprising: a multilayer stacked assembly having a plurality of layer structures including a pair of electrically conductive layer structures and a dielectric layer structure disposed between and adjoining each of the conductive layer structures; and', 'a molded frame formed of an insulating polymer material, the frame having a peripheral portion encapsulating end portions of the dielectric layer structure and the conductive layer structures to maintain the conductive layer structures and the dielectric layer structure in position relative to each other, the frame defining an enlarged opening through which an external surface of an outer one of the layer structures is exposed; and, 'a multilayer bus board comprisingan electrical device electrically connected to one or both of the conductive layer structures.2. The electrical assembly of claim 1 , wherein the layer structures are mechanically held together by the frame.3. The electrical assembly of claim 1 , wherein the peripheral portion of the frame comprises a plurality of outer structures claim 1 , and wherein the frame further comprises a plurality of inner structures that are joined to claim 1 , and disposed inward from claim 1 , the outer structures.4. The electrical assembly of claim 3 , wherein the inner structures include standoffs for mounting the multilayer bus board to an adjunct structure.5. The electrical assembly of claim ...

Flex-rigid wiring board

A flex-rigid wiring board includes a flexible base material structure, a rigid base material structure extending from opposite ends of the flexible base material structure, an electronic component embedded in the rigid base material structure, a first buildup layer laminated on first surfaces of the flexible base material structure and rigid base material structure and having an exposing portion exposing the flexible base material structure, and a second buildup layer laminated on second surfaces of the flexible base material structure and rigid base material structure and having an exposing portion exposing the flexible base material structure. The first and second buildup layers are formed such that the flexible base material structure exposed by the exposing portions of the first and second buildup layers forms a bendable portion and that the rigid base material structure and the first and second buildup layers form non-bendable portions connected to the bendable portion.

Board having electronic component embedded therein

A board having an electronic component embedded therein, includes a core layer having a groove with a bottom surface, an electronic component disposed above the bottom surface of the groove and spaced apart from the bottom surface of the groove, and an insulating layer disposed on the core layer and covering at least a portion of the electronic component. The insulating layer is disposed in at least a portion of a space between the bottom surface of the groove and the electronic component.

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

A method for manufacturing a printed wiring board includes forming a conductor layer including first and second pads on an insulating layer, forming a dry film resist layer on the insulating and conductor layers, forming first and second openings exposing the first and second pads, applying first metal plating to form first and second base plating layers on the first and second pads, applying second metal plating to form a first top plating layer of a first post and portion of a second top plating layer of a second bump post, applying the second metal plating further to form second portion of the second top layer of the second post, removing the dry film resist layer, forming a solder resist layer to cover the first and second posts, and thinning the solder resist layer over entire surface to position the first and second top layers outside the solder resist layer. 1. A method for manufacturing a printed wiring board , comprising:forming a conductor layer including a first conductor pad and a second conductor pad on a base insulating layer;forming a dry film resist layer on the base insulating layer such that the dry film resist layer covers the conductor layer formed on the base insulating layer;forming a first opening exposing the first conductor pad and a second opening having a smaller diameter than a diameter of the first opening and exposing the second conductor pad;applying first metal plating such that a first base plating layer is formed on the first conductor pad in the first opening and that a second base plating layer is formed on the second conductor pad in the second opening;applying second metal plating such that a first top plating layer is formed on the first base plating layer in the first opening to form a first bump post comprising the first base plating layer and the first top plating layer and that a portion of a second top plating layer is formed on the second base plating layer in the second opening;applying the second metal plating further ...

Printed wiring board and method for manufacturing the same

A printed wiring board includes an insulating layer, a conductor layer formed on the insulating layer and including first and second pads, a solder resist layer formed on the insulating layer, covering the conductor layer and exposing the first and second pads to form the second pad having diameter smaller than diameter of the first pad, a first bump formed on the first pad and including first base and top plating layers such that the first base layer has embedded portion in the resist layer and exposed portion and having diameter substantially equal to or smaller than diameter of the embedded portion, and a second bump formed on the second pad and including second base and top plating layers such that the second base layer has embedded portion in the resist layer and exposed portion and having diameter substantially equal to or smaller than diameter of the embedded portion.

Wiring structure and method of manufacturing the same

A wiring structure includes a first dielectric layer, a second dielectric layer adjacent to the first dielectric layer, and a conductive region. The first dielectric layer defines a first opening, and the second dielectric layer defines a second opening. The conductive region includes a conductive via filling the first opening and the second opening. The conductive region further includes a first conductive trace embedded in the second dielectric layer and electrically connected with the conductive via. The conductive region includes a sidewall traversing through a thickness of the second dielectric layer with a substantial linear profile. A method of manufacturing a wiring structure is also disclosed.

Overlap Joint Flex Circuit Board Mating

An interconnection for flex circuit boards used, for instance, in a quantum computing system are provided. In one example, the interconnection can include a first flex circuit board having a first side and a second side opposite the first side. The interconnection can include a second flex circuit board having a third side and a fourth side opposite the third side. The first flex circuit board and the second flex circuit board are physically coupled together in an overlap joint in which a portion of the second side for the first flex circuit board overlaps a portion of the third side of the flex circuit board. The interconnection can include a signal pad structure positioned in the overlap joint that electrically couples a first via in the first flex circuit board and a second via in the second flex circuit board.

DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES FOR SHIELDING APPLICATIONS

Devices and method related to metallization of ceramic substrates for shielding applications. In some embodiments, a ceramic assembly includes a plurality of layers, the assembly including a boundary between a first region and a second region, the assembly further including a selected layer having a plurality of conductive features along the boundary, each conductive feature extending into the first region and the second region such that when the first region and the second region are separated to form their respective side walls, each side wall includes exposed portions of the conductive features capable of forming electrical connection with a conductive shielding layer 1. A ceramic assembly comprising a plurality of layers , the assembly including a boundary between a first region and a second region , the assembly further including a selected layer having a plurality of conductive features along the boundary , each conductive feature extending into the first region and the second region such that when the first region and the second region are separated to form their respective side walls , each side wall includes exposed portions of the conductive features capable of forming electrical connection with a conductive shielding layer.2. The ceramic assembly of wherein the assembly further includes a ground plane electrically connected to the plurality of conductive features.3. The ceramic assembly of wherein the ceramic assembly is in an unfired state to facilitate the separation of the first region and the second region.4. The ceramic assembly of wherein the conductive features include a plurality of rectangular conductive vias formed on or through the selected layer claim 2 , such that the boundary extends generally through a middle portion of each rectangular conductive via.5. The ceramic assembly of wherein the conductive features include a plurality of shaped conductive vias formed on or through the selected layer claim 2 , each shaped conductive via having a ...

CIRCUIT BOARD

A circuit board includes a flexible wiring board with a reinforcing member. The flexible wiring board has a first, second and third sections. The reinforcing member is embedded in a cavity in the first section of the wiring board, and is sandwiched by a pair of resin layers provided below and above. A pair of wiring layers are disposed on the pair of the resin layers, respectively. The metal reinforcing member has either a plate shape or a frame shape and is disposed closer to one of the pair of the wiring layers than to another of the pair of the wiring layers in a vertical direction. 1. A circuit board , comprising:a flexible wiring board having a plurality of layers laminated therein, including wiring layers and insulating layers, the wiring board having three sections arranged in a lengthwise direction of the wiring board: a first section in one end, a second section in a middle, and a third section in another end, the first section having a cavity or cutout in a plan view,a metal reinforcing member embedded in the cavity or cutout of the wiring board in the first section;a first resin layer that is formed on a bottom surface of the wiring board in the first section and that is selectively formed on a bottom of the reinforcement member, the first resin layer being absent on the wiring board in the second and third sections;a second resin layer that is formed on a top surface of the wiring board in the first section and that selectively covers a top surface the reinforcement member, the second resin layer being absent on the wiring board in the second and third sections;a first wiring layer that is provided on the first resin layer and that is electrically connected to the wiring board in the first section; anda second wiring layer that is provided on the second resin layer and that is electrically connected to the wiring board in the first section,wherein the metal reinforcing member has one of a plate shape and a frame shape in the plan view, and the metal ...

COMPOSITE CIRCUIT BOARD

A composite circuit board includes an insulation layer, an inner circuit layer, a first conductive layer and a second conductive layer embedded in the insulation layer, a third conductive layer and a fourth conductive layer formed on opposite surfaces of the insulation layer. The third conductive layer electrically connects with the first conductive layer. The fourth conductive layer electrically connects with the second conductive layer. The inner circuit layer is in a middle portion of the insulation layer. The first conductive layer and the second conductive layer respectively forms on opposite sides of the inner circuit layer. The insulation layer forms a plurality of first through holes between the first conductive layer and the inner circuit layer, a plurality of second through holes between the second conductive layer and the inner circuit layer. 1. A composite circuit board , comprising:an insulation layer;an inner circuit layer, a first conductive layer and a second conductive layer embedded in the insulation layer;a third conductive layer and a fourth conductive layer formed on opposite surfaces of the insulation layer;the third conductive layer electrically connecting with the first conductive layer, the fourth conductive layer electrically connecting with the second conductive layer;wherein, the inner circuit layer is in a middle portion of the insulation layer, the first conductive layer and the second conductive layer respectively located on opposite sides of the inner circuit layer, the insulation layer forms a plurality of first through holes between the first conductive layer and the inner circuit layer, a plurality of second through holes between the second conductive layer and the inner circuit layer, the first conductive layer extends toward the inner circuit layer through the plurality of first through holes to connect with the inner circuit layer, the second conductive layer extends toward the inner circuit layer through the plurality of second ...

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film. 1. A printed circuit board comprising:a plurality of layers including one or more planar conductive layers and one or more conductive trace layers; and first and second vias of a first diameter connected to at least one of the conductive trace layers; and', 'conductive vias of a second diameter smaller than the first diameter located between the first and second vias and connected to at least one of the planar conductive layers., 'columns of via patterns formed in one or more of the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising2. A printed circuit board comprising:a plurality of layers, a top layer of the plurality of layers including a conductive surface film; and at least one signal via connected to a layer of the plurality of layers; and', 'at least one conductive shadow via electrically connected to the conductive surface film., 'via patterns formed in the plurality of layers, each of the via patterns comprising3. The printed circuit board as defined in claim 2 , wherein the at least one signal via comprises first and second signal vias that form a differential signal pair.4. The printed circuit board as defined in claim 3 , wherein the at least one conductive shadow via includes two shadow vias located midway between the ...

Flexible circuit board

A flexible circuit board includes a substrate including a base layer and a bonding layer formed on each of opposite sides of the base layer. Each of the two bonding layers is formed by coating a bonding solution and drying the bonding solution. The bonding solution is composed of an adhesive and a solvent. A viscosity of the adhesive is 5000 millipascal-seconds. The adhesive is composed of a precursor having a mass fraction of 35%-65%, carboxyl modified polyphenylene oxide having a mass fraction of 10%-15%, bisphenol-F-epoxy resin having a mass fraction of 10%-15%, a silane coupling agent having a mass fraction of 0%-1.5%, silica filler having a mass fraction of 5%-20%, and a flame retardant filler having a mass fraction of 10%-20%.

SUPERCONDUCTING PRINTED CIRCUIT BOARD RELATED SYSTEMS, METHODS, AND APPARATUS

A multilayer circuit board structure includes superconducting connections to internal layers thereof, for example by inclusion of superconducting vias. Two or more panels can each comprise respective electrically insulative substrates, each have one or more through-holes, and also include a respective bimetal foil on at least a portion of a respective surface thereof, which is patterned to form traces. The bimetal foil includes a first metal that is non-superconductive in a first temperature range and a second metal that is superconductive in the first temperature range. The panels are plated to deposit a third metal on exposed traces of the second metal, the third metal superconductive in the first temperature range. Panels are join (e.g., laminated) to form at least a three-layer superconducting printed circuit board with an inner layer, two outer layers, and superconducting vias between the inner layer and at least one of the two outer layers. 1. A method of fabricating a multilayer superconducting printed circuit board , the method comprising:forming a first set of holes in a first electrically insulative substrate having a first surface and a second surface, the second surface opposed to the first surface across a thickness of the first electrically insulative substrate, each hole of the first set of holes forming a respective channel between the first surface and the second surface;forming a first panel by depositing a first bimetal foil to overlie at least a first portion of the first electrically insulative substrate;forming a second set of holes in a second electrically insulative substrate having a third surface and a fourth surface, the fourth surface opposed to the third surface across a thickness of the second electrically insulative substrate, each hole of the second set of holes forming a respective channel between the third surface and the fourth surface;forming a second panel by depositing a second bimetal foil to overlie at least a second portion ...

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns. 1. A printed circuit board comprising:a plurality of layers including conductive layers separated by dielectric layers; and first and second signal vias connecting to respective signal traces on at least one of the conductive layers;', 'ground vias extending through at least some layers of the plurality of layers; and', 'at least one non-plated air hole associated with one of the first and second signal vias and extending to a predetermined depth in the plurality of layers., 'via patterns formed in one or more of the plurality of layers, each of the via patterns comprising2. The printed circuit board as defined in claim 1 , wherein the at least one non-plated air hole includes non-plated air holes located on opposite sides of the first and second signal vias.3. The printed circuit board as defined in claim 1 , wherein the at least one non-plated air hole has a smaller diameter than the first and second signal vias.4. The printed circuit board as defined in claim 1 , wherein the at least one non-plated air hole extends through one or more layers of the plurality of layers.5. The printed circuit board as defined in claim 1 , wherein one or more of the plurality of layers includes a ground plane and wherein the ground plane is removed in an area ...

MANUFACTURING METHOD OF CIRCUIT CARRIER BOARD STRUCTURE

A circuit carrier board structure includes a first substrate, a second substrate, an adhesive layer, and a plurality of contact pads. The first substrate includes a first surface and a second surface, and also includes a plurality of first build-up layers sequentially stacked. The first build-up layers include a first dielectric layer and a first circuit layer. The second substrate includes a third surface and a fourth surface, and also includes a plurality of second build-up layers sequentially stacked. The second build-up layers include a second dielectric layer and a second circuit layer. The second surface is combined to the third surface. The connection pads are on the first surface and electrically connected to the first circuit layer. The first substrate is electrically connected to the second substrate. A manufacturing method of the circuit carrier board structure is also provided. 1. A manufacturing method of a circuit carrier board structure , comprising:providing a temporary carrier board;forming a first substrate on the temporary carrier board, wherein the first substrate has a first surface and a second surface opposite to the first surface;providing a second substrate having a third surface and a fourth surface opposite to the third surface;disposing an adhesive layer on one of the first substrate and the second substrate, wherein the adhesive layer is located between the first substrate and the second substrate;combining the second surface of the first substrate to the third surface of the second substrate; andremoving the temporary carrier board,wherein the first substrate is electrically connected to the second substrate.2. The manufacturing method of the circuit carrier board structure of claim 1 , wherein the step of forming the first substrate comprises:forming a release layer on the temporary carrier board; andforming a plurality of first build-up layers stacked on the release layer in sequence,wherein each of the first build-up layers comprises ...

SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES USING PLATING RESIST

A multilayer printed circuit board is provided having a first dielectric layer and a first plating resist selectively positioned in the first dielectric layer. A second plating resist may be selectively positioned in the first dielectric layer or a second dielectric layer, the second plating resist separate from the first plating resist. A through hole extends through the first dielectric layer, the first plating resist, and the second plating resist. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment. 1. A method of partitioning a via in a multilayer printed circuit board (PCB) as to produce an electrically isolating portion between two electrically conducting portions in said via , the method comprising of:placing at least one portion of a first plating resist layer on a first layered structure including a first conductive layer and a first dielectric layer, and placing at least one portion of a second plating resist layer on a second layered structure including a second conductive layer and a second dielectric layer;laminating the first and second layered structures with a third intermediate layered structure including at least one third dielectric layer adapted so that the portions of the first and second plating resist layers become embedded in the at least one third dielectric layer;drilling a first hole in the printed circuit board so that the first hole passes through the portions of the first and the second plating resist layer;placing the printed circuit board in a copper seed catalyzing bath so that a first copper layer is placed on an interior of the first hole except for portions with the plating resist layer;placing the printed circuit board in an electrolytic copper plating bath where the first copper layer placed on the at ...

SIGNAL TRANSMISSION DEVICE

A signal transmission device including a signal wiring, a wide wiring that is formed continuously with one and the other of the signal wirings and has a wiring width larger than a wiring width of at least the one or the other of the signal wirings, a power wiring to which a signal/power separation filter is connected via a branch wiring branching from the wide wiring, and an open stub wiring that is connected to the branch wiring and has an open tip. 1. A signal transmission device comprising:a signal wiring;a wide wiring that is formed continuously with one and other of the signal wirings and has a wiring width larger than a wiring width of at least the one or the other of the signal wirings;a power wiring to which a signal/power separation filter is connected via a branch wiring branching from the wide wiring; andan open stub wiring that is connected to the branch wiring and has an open tip.2. The signal transmission device according to claim 1 , whereinthe signal wiring, the wide wiring, and the open stub wiring are formed on a printed circuit board.3. The signal transmission device according to claim 1 , whereina ground wiring pattern through which return current flows is provided adjacent to the signal wiring on a side opposite to the branch wiring.4. The signal transmission device according to claim 1 , whereinthe open stub wiring includes a plurality of the open stub wirings having different lengths.5. The signal transmission device according to claim 1 , whereinthe signal wiring is connected between a transmission unit that transmits a signal from a camera and a receiving unit that receives a signal from the camera, andpower is supplied to the camera through the power wiring and the signal wiring.6. The signal transmission device according to claim 1 , further comprising:a first signal transmission circuit including the signal wiring, the wide wiring, the open stub wiring, and the power wiring; anda second signal transmission circuit including the signal ...

Multilayer electronic structure with integral faraday shielding

A multilayer electronic support structure including at least one metallic component encapsulated in a dielectric material, and comprising at least one faraday barrier to shield the at least one metallic component from interference from external electromagnetic fields and to prevent electromagnetic emission from the metallic component.

DEVICE EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Disclosed herein is a device embedded printed circuit board, including: a first core layer having a first via and having a via land for a first connection pad disposed on a lower surface thereof; a build-up layer formed on the first core layer and having a plurality of circuit layers including a second connection pad, a plurality of insulating layer disposed between the plurality of circuit layers, and a second via connecting the plurality of circuit layers; and a second core layer formed on the build-up layer and having a cavity. 1. A device embedded printed circuit board , comprising:a first core layer having a first via and having a via land for a first connection pad disposed on a lower surface thereof;a build-up layer formed on the first core layer and having a plurality of circuit layers including a second connection pad, a plurality of insulating layer disposed between the plurality of circuit layers, and a second via connecting the plurality of circuit layers; anda second core layer formed on the build-up layer and having a cavity.2. The device embedded printed circuit board as set forth in claim 1 , further comprising:a first device disposed in the cavity, wherein the first core layer has a device embedded cavity.3. The device embedded printed circuit board as set forth in claim 1 , further comprising:a second device connected to the exposed second connection pad and embedded in the cavity of the second core layer.4. The device embedded printed circuit board as set forth in claim 1 , further comprising:a second device connected to and mounted on an upper end of the exposed second via through the cavity of the second core layer, wherein the first via has a tapered shape in which a diameter of the via is wide downwardly.5. The device embedded printed circuit board as set forth in claim 1 , wherein the first and second core layers are an insulating resin in which a reinforcement material is impregnated.6. The device embedded printed circuit board as set forth ...

INTERPOSER BOARD AND METHOD OF MANUFACTURING THE SAME

Disclosed herein are an interposer board and a method of manufacturing the same. According to a preferred embodiment of the present invention, the interposer substrate may include: a base substrate; a circuit pattern formed on the base substrate; and a through via formed to penetrate through the base substrate and have a height lower than that of the circuit pattern. 1. An interposer board , comprising:a base substrate;a circuit pattern formed on the base substrate; anda through via formed to penetrate through the base substrate and have a height lower than that of the circuit pattern.2. The interposer board as set forth in claim 1 , wherein an inside of the through via is filled with a filler and is formed to have a height lower than that of a side wall thereof.3. The interposer board as set forth in claim 1 , wherein an edge of an inside of the through via is formed to have a height lower than that of a center thereof.4. The interposer board as set forth in claim 1 , wherein an inside of the through via is made of a conductive material or a non-conductive material.5. The interposer board as set forth in claim 1 , wherein an inside of the through via is made of a photosensitive insulating material.6. The interposer board as set forth in claim 1 , wherein the base substrate and the circuit pattern are further provided with a build-up layer which includes a build-up insulating layer and a build-up circuit layer.7. The interposer board as set forth in claim 6 , wherein the build-up insulating layer and an inside of the through via are made of the same material.8. The interposer board as set forth in claim 6 , wherein the build-up insulating layer is made of a photosensitive insulating material.9. The interposer board as set forth in claim 1 , wherein a circuit layer formed in an inside of the through via and a circuit layer formed on a side wall thereof are formed to have the same height.10. A method for manufacturing an interposer board claim 1 , comprising:preparing ...

SOLDER VOID REDUCTION BETWEEN ELECTRONIC PACKAGES AND PRINTED CIRCUIT BOARDS

A method includes fabricating a printed circuit board. The fabricating includes forming at least one conductive layer on top a first dielectric layer, wherein the at least one conductive layer comprises at least one of a ground plane and a power plane. The fabricating includes forming a second dielectric layer on top of the at least one conductive layer. The fabricating includes forming a thermal pad on top of the second dielectric layer. The fabricating includes forming at least one plated through hole for electrically coupling the thermal pad to the at least one conductive layer. The fabricating includes backdrilling the at least one plated through hole to remove a portion of the conductive material, wherein subsequent to the backdrilling the conductive material remaining in the at least one plated through hole electrically couples one or more of the at least one conductive layer to the thermal pad. 1. A method comprising: forming at least one conductive layer on top a first dielectric layer, wherein the at least one conductive layer comprises at least one of a ground plane and a power plane;', 'forming a second dielectric layer on top of the at least one conductive layer;', 'forming a thermal pad on top of the second dielectric layer, wherein an electronic package is to be soldered on top of the thermal pad;', 'forming at least one through hole through the thermal pad, the second dielectric layer, the at least one conductive layer, and the first dielectric layer;', 'filling the at least one through hole with a conductive material to form at least one plated through hole for electrically coupling the thermal pad to the at least one conductive layer; and', 'backdrilling the at least one plated through hole to remove a portion of the conductive material, wherein subsequent to the backdrilling the conductive material remaining in the at least one plated through hole electrically couples one or more of the at least one conductive layer to the thermal pad., ' ...

Methods of Manufacturing Printed Circuit Boards

Please move the Abstract from the first page of the published international application (International Publication No. WO 2017/011703) to the end of the present application, immediately following the claims. 124-. (canceled)25. A covered laminated printed circuit board subassembly , comprising:a laminated printed circuit board subassembly including a plurality of layered subassemblies, a top surface, a bottom surface and a plurality of vias electrically interconnecting certain of the layered subassemblies;each of the plurality of vias including a top surface opening in the top surface arid a bottom surface opening in the bottom surface; and,a removable polymer film material adhering to one of the group consisting of the top surface, the bottom surface and the top surface and the bottom surface; wherein any polymer film material adhering to the top surface, the bottom surface or the top surface and the bottom surface which is proximate any one of the plurality of top surface openings or bottom openings in the top surface or the bottom surface includes a hole proximate each of such openings designed to facilitate depositing hole-fill paste in each of the plurality vias.26. The covered laminated printed circuit board subassembly of claim 25 , wherein the removable polymer film material further comprises adhesive backing claim 25 , and the adhesive backing is oriented toward and is in contact with at least one of the top surface and the bottom surface of the laminated printed circuit board subassembly claim 25 , thereby adhering the removable polymer film material to at least one of the top surface and the bottom surface of the laminated printed circuit board subassembly.27. The covered laminated printed circuit board subassembly of claim 26 , wherein a sheet of the removable polymer film material is adhered to each of the top surface and the bottom surface.2838-. (canceled) This application claims the benefit of U.S. Provisional Patent Application No. 62/192,800 filed ...

Method, sensor, and printed circuit board for sensing position or motion of a shaft

The present disclosure presents a method, a sensor comprising printed circuit board (PCB), and a sensor PCB for a capacitive sensor for sensing position or motion of a shaft comprising an electrically conducting part. The method and the sensor utilise the sensor PCB that comprises a mounting hole through which the conducting part of the shaft can be mounted, at least one capacitor electrode formed to the printed circuit board, wherein an electrode surface of the electrode extends parallel to a center axis of the mounting hole and faces the center axis.

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

A circuit board includes a first metal layer having a first via hole penetrating through an upper surface of the first metal layer and a lower surface thereof; a plated part provided to a surface of the first via hole; an insulating film provided to a surface of the plated part; and a first via formed by providing a conductive material to at least a portion of a region surrounded by an outer surface of the insulating film. Since the circuit board may implement fineness of the first via while forming the first metal layer to be thicker than the related art, warpage may be decreased and heat dissipation performance may be improved. 1. A circuit board comprising:a first metal layer and a first via penetrating through the first metal layer,wherein the first metal layer and the first via have an insulating film and a plated part provided therebetween.2. The circuit board according to claim 1 , wherein the plated part includes a plurality of plated layers.3. A circuit board comprising:a first metal layer having a first via hole penetrating through an upper surface of the first metal layer and a lower surface thereof;a plated part provided to a surface of the first via hole;an insulating film provided to a surface of the plated part; anda first via formed of a conductive material and provided at least a portion of a region surrounded by an outer surface of the insulating film.4. The circuit board according to claim 3 , further comprising a second via hole defined by at least a portion of the outer surface of the insulating film has a shape corresponding to that of the first via hole and has a diameter smaller than that of the first via hole.5. The circuit board according to claim 4 , wherein the plated part includes a plurality of plated layers.6. The circuit board according to claim 5 , wherein each of the plurality of plated layers is formed by one plating process.7. The circuit board according to claim 6 , wherein the plating process is performed in a flash plating ...

Simultaneous and selective wide gap partitioning of via structures using plating resist

A multilayer printed circuit board is provided having a first dielectric layer and a first plating resist selectively positioned in the first dielectric layer. A second plating resist may be selectively positioned in the first dielectric layer or a second dielectric layer, the second plating resist separate from the first plating resist. A through hole extends through the first dielectric layer, the first plating resist, and the second plating resist. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.

Circuit board and method of manufacturing the same

Disclosed herein is a circuit board including: a core layer including a via hole; a metal film covering an inner wall of the via hole; a circuit pattern connected to the metal film on the core layer; and a plug surrounded by the metal film in the via hole and having a thickness thinner than a thickness of the core layer.

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Disclosed are a printed circuit board and a method of manufacturing the printed circuit board, which includes: a first resist layer; a first circuit formed on the first resist layer; an insulation film formed on the first resist layer so as to cover an upper surface and a lateral surface of the first circuit; a ground formed on the insulation film so as to be connected with the first circuit electrically; and an insulation layer formed on the insulation film so as to cover the ground. 1. A printed circuit board comprising:a first resist layer;a first circuit formed on the first resist layer;an insulation film formed on the first resist layer so as to cover an upper surface and a lateral surface of the first circuit;a ground formed on the insulation film so as to be connected with the first circuit electrically; andan insulation layer formed on the insulation film so as to cover the ground.2. The printed circuit board of claim 1 , further comprising a connecting portion penetrating the insulation film so as to be interposed between the first circuit and the ground.3. The printed circuit board of claim 2 , wherein the ground is made of a conductive material claim 2 , andwherein the connecting portion is formed by filling a hole formed in the insulation film with a conductive material that is the same as the conductive material of the ground.4. The printed circuit board of claim 2 , wherein one side of the connecting portion is in contact with the first circuit and the other side of the connecting portion is in contact with the ground.5. The printed circuit board of claim 1 , wherein a thickness of the insulation film is smaller than or equal to a thickness of the first circuit.6. The printed circuit board of claim 1 , wherein the insulation film is formed by use of deposition.7. The printed circuit board of claim 1 , further comprising a second circuit formed on the insulation layer for electrical connection with the ground.8. The printed circuit board of claim 7 , ...

Printed Circuit Board and Method for Producing Same

Disclosed are a printed circuit board manufactured by filling a via hole formed in a flexible board and a via hole formed in a cured base substrate and then laminating the flexible board and the cured base substrate and a method of manufacturing same. The method includes preparing a flexible board including a flexible region and a rigid region, preparing a cured base substrate, and laminating the cured base substrate on the rigid region of the flexible board, in which during the laminating, via holes respectively formed in the flexible board and the cured base substrate are first filled with a conductive material and then the flexible board and the cured base substrate are laminated. 1: A method of manufacturing a printed circuit board , the method comprising:preparing a flexible board including a flexible region and a rigid region;preparing a cured base substrate; andlaminating the cured base substrate on the rigid region of the flexible board,wherein in the laminating, via holes respectively formed in the flexible board and the cured base substrate are filled with a conductive material, and then the cured base substrate is laminated on the flexible board.2: The method according to claim 1 , wherein the preparing of the flexible board comprises:preparing a flexible base substrate;forming a first via hole in a flexible region of the flexible base substrate;forming a plating layer by plating one surface of the flexible base substrate and an inside wall surface of the first via hole;etching the plating layer to form an internal circuit pattern; andforming a protective layer to cover the internal circuit pattern.3: The method according to claim 1 , wherein the cured base substrate is a prepreg sheet that is formed by shaping an epoxy region in which glass fiber is contained in the form of a sheet.4: The method according to claim 1 , wherein the laminating comprises:forming a second via hole within the rigid region of the flexible board;filling the second via hole ...

Simultaneous and selective wide gap partitioning of via structures using plating resist

A multilayer printed circuit board is provided having a first dielectric layer and a first plating resist selectively positioned in the first dielectric layer. A second plating resist may be selectively positioned in the first dielectric layer or a second dielectric layer, the second plating resist separate from the first plating resist. A through hole extends through the first dielectric layer, the first plating resist, and the second plating resist. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.

METHOD OF MANUFACTURING THE PRINTED BOARD

A method of manufacturing a printed board, the method comprising: a first step of preparing a laminate having a base member in which a plurality of layers of glass cloths and a plurality of resin layers are alternately laminated, a first metal layer attached to one surface of the base member, and a second metal layer attached an opposite surface of the base member; a second step of forming a protective layer removable with a predetermined solvent on each of the first metal layer and the second metal layer; and a third step of irradiating the laminate on which the protective layer is formed with a laser beam to thereby form a through-hole penetrating in a thickness direction of the laminate. 1. A method of manufacturing a printed board , the method comprising:a first step of preparing a laminate having a base member in which a plurality of layers of glass cloths and a plurality of resin layers are alternately laminated, a first metal layer attached to one surface of the base member, and a second metal layer attached an opposite surface of the base member;a second step of forming a protective layer removable with a predetermined solvent on each of the first metal layer and the second metal layer; anda third step of irradiating the laminate on which the protective layer is formed with a laser beam to thereby form a through-hole penetrating in a thickness direction of the laminate.2. The method of manufacturing a printed board according to claim 1 ,wherein the protective layer is formed of a dry film made of a resin selected from acrylic resin, epoxy-based resin, and urethane-based resin.3. The method of manufacturing a printed board according to claim 1 ,wherein the protective layer has a thickness of at least 15 micrometer (μm) and at most 75 micrometer (μm).4. The method of manufacturing a printed board according to claim 1 ,wherein the base member has at least three layers of glass cloths, andwherein the base member has a thickness of at least 200 micrometer (m) and ...

Partial insulation with diagnostic pickup coils

A partially insulating layer for use in an HTS magnet coil. The partially insulating layer comprises an insulating body 401 having within it a set of linking tracks and a set of pickup tracks. Each linking track is electrically conductive and is electrically connected to first and second surfaces of the partially insulating layer, in order to provide an electrical path between said first and second surfaces. Each pickup track is electrically conductive and is inductively coupled to a respective linking track, and electrically isolated from the first and second surfaces. Each of the pickup tracks is configured for connection to a current measuring device in order to measure a current induced in the pickup track by a change in current flowing in the respective linking track.

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME

A printed wiring board in the present disclosure includes a core layer, a first buildup layer, a second buildup layer, and a through hole. The core layer has a conductor circuit located on a surface of an insulator. The first buildup layer containing a first resin is laminated on a surface of the core layer. The second buildup layer containing a second resin is laminated on a surface of the first buildup layer. The through hole extends through the core layer, the first buildup layer, and the second buildup layer. The first resin and the second resin are different from each other. The second buildup layer includes a plurality of filled vias filled with a conductor which are located around a circumference of an opening of the through hole. 1. A printed wiring board , comprising:a core layer comprising a conductor circuit located on a surface of an insulator;a first buildup layer containing a first resin which is laminated on a surface of the core layer;a second buildup layer containing a second resin which is laminated on a surface of the first buildup layer; anda through hole extending through the core layer, the first buildup layer, and the second buildup layer, whereinthe first resin and the second resin are different from each other, andthe second buildup layer comprises a plurality of filled vias filled with a conductor which are located around a circumference of an opening of the through hole.2. The printed wiring board according to claim 1 , wherein at least two pieces of the filled vias are arranged around the circumference of the opening of the through hole.3. The printed wiring board according to claim 1 , wherein a plurality of the filled vias are arranged on an identical circumference around the through hole.4. The printed wiring board according to claim 1 , wherein a wall surface of the through hole and a wall surface of each of the filled vias are separated by a distance of at least 0.3 mm.5. The printed wiring board according to claim 1 , wherein a ...

Multilayer printed circuit board

Disclosed herein is a multilayer printed circuit board. The multilayer printed circuit board according to the present invention includes: a stack via stacked in an upper portion of a core layer; staggered vias formed at both sides of the stack via and stacked on the core layer; and a solder resist layer stacked in a lower portion of the core layer and stacked on an insulating film except for open regions of the stack via and the staggered vias, such that the plurality of vias formed in the staggered via may increase rigidity to prevent warpage of the multilayer printed circuit board from being generated.

SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACTURING METHODS THEREFOR

A multi-layer circuit board, successively constituted by surface sticking layer, single-layer circuit board, middle sticking layer, single-layer circuit board, surface sticking layer, said multi-layer circuit board is provided with a hole, a hole wall of said hole is formed with conductive seed layer, and partial outer surface of said surface sticking layer is formed with a circuit pattern layer of conductive seed layer, wherein said conductive seed layer comprises a ion implantation layer implanting below the hole wall of said hole and below partial outer surface of said surface sticking layer. 1. A multi-layer circuit board , successively constituted by surface sticking layer , single-layer circuit board , middle sticking layer , single-layer circuit board , surface sticking layer , said multi-layer circuit board is provided with a hole , a hole wall of said hole is formed with conductive seed layer , and partial outer surface of said surface sticking layer is formed with a circuit pattern layer of conductive seed layer , wherein said conductive seed layer comprises a ion implantation layer implanting below the hole wall of said hole and below partial outer surface of said surface sticking layer.2. The multi-layer circuit board of claim 1 , wherein said ion implantation layer is located below the hole wall of said hole and/or below the partial outer surface of said surface sticking layer for a depth of 1-500 nm claim 1 , and forms steady doping structure with said substrate.3. The multi-layer circuit board of claim 1 , wherein said conductive seed layer further comprises a plasma deposition layer adhered above said ion implantation layer claim 1 , which plasma deposition layer has a thickness of 1-10000 nm. This application is a divisional application of U.S. patent application Ser. No. 16/911,911, filed Jun. 25, 2020, which is a divisional application of U.S. patent application Ser. No. 16/382,103, filed Apr. 11, 2019, which is a divisional application of U.S. ...

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

A wiring board with a built-in electronic component includes a substrate having a cavity, an interlayer insulating layer formed on the substrate such that the interlayer insulating layer is covering the cavity of the substrate, a conductor layer formed on the interlayer insulating layer, an electronic component accommodated in the cavity of the substrate and including a rectangular cuboid body and three terminal electrodes such that each of the three terminal electrodes has a metal film form formed on an outer surface of the rectangular cuboid body, and via conductors formed in the interlayer insulating layer such that the via conductors are connecting the conductor layer and the three terminal electrodes of the electronic component. The three terminal electrodes are arrayed in parallel on the outer surface of the rectangular cuboid body such that adjacent terminal electrodes have the opposite polarities. 1. A wiring board with a built-in electronic component , comprising:a substrate having a cavity;an interlayer insulating layer formed on the substrate such that the interlayer insulating layer is covering the cavity of the substrate;a conductor layer formed on the interlayer insulating layer;an electronic component accommodated in the cavity of the substrate and comprising a rectangular cuboid body and three terminal electrodes such that each of the three terminal electrodes has a metal film form formed on an outer surface of the rectangular cuboid body; anda plurality of via conductors formed in the interlayer insulating layer such that the plurality of via conductors is connecting the conductor layer and the three terminal electrodes of the electronic component,wherein the three terminal electrodes are arrayed in parallel on the outer surface of the rectangular cuboid body such that adjacent terminal electrodes have opposite polarities.2. A wiring board with a built-in electronic component according to claim 1 , further comprising:a second interlayer insulating ...

Printed Circuit Board for Transmission Control

A printed circuit board for transmission control and for arrangement on an interface is disclosed. The printed circuit board includes an upper side of the printed circuit board and an underside of the printed circuit board. A plurality of spaced-apart conductor tracks arranged at a distance from the upper side of the printed circuit board. The conductor tracks are connected to each other in an electrically conductive manner by way of a first plated-through hole. The first plated-through hole is drilled out on the underside of the printed circuit board in such a way that it is arranged so as to be set back in relation to the underside of the printed circuit board. The printed circuit board is arranged on an interface, the underside of the printed circuit board facing the interface. 1. A printed circuit board for transmission control and for arrangement on an interface , the printed circuit board comprising:an upper side;an underside arranged at a distance from the upper side; anda plurality of spaced-apart conductor tracks positioned between the upper side and the underside, the plurality of spaced-apart conductor tracks are connected to each other in an electrically conductive manner by way of a first plated-through hole,wherein the first plated-through hole is drilled out on the underside of the printed circuit board in such a way that it is arranged so as to be set back in relation to the underside of the printed circuit board, andwherein the printed circuit board is arranged on an interface, the underside of the printed circuit board facing the interface.2. The printed circuit board as claimed in claim 1 , wherein a second plated-through hole is made to extend to the underside of the printed circuit board and/or has a protrusion in relation to the underside of the printed circuit board claim 1 , wherein the second plated-through hole is connected in an electrically conductive manner to a ground layer arranged within the printed circuit board.3. The printed ...

Printed wiring board and method for manufacturing the same

A printed wiring board includes a core substrate, a first resin insulating layer formed on a first surface of the core substrate, a second resin insulating layer formed on a second surface of the core substrate on the opposite side of the first surface, an electronic component accommodated in opening portion formed in the core substrate, and a filling resin filling space formed between the electronic component and an inner wall of the opening portion and including resin material that is different from resin material forming the first and second resin insulating layers. The core substrate has a first conductor pattern forming a first outermost layer of the core substrate and a second conductor pattern forming a second outermost layer of the core substrate on the opposite side of the first conductor pattern, and the filling resin is filling spaces formed in the second conductor pattern of the core substrate.

PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF

Embodiments of the present application relate to the technical field of a printed circuit plate, in particular, to a printed circuit plate and a method manufacturing same so as to resolve a problem of an incomplete elimination of a short-line effect. The method for manufacturing a printed circuit board in the embodiments of the present application comprises a step of drilling target prepregs at positions corresponding to at least one preset hole therein so as to form through holes perforating through the target prepregs, wherein the formed through holes have an aperture greater than that of the preset hole, and the preset hole does not need to transmit electrical signal between layers of the PCB. The method further comprises: filling the formed through holes with a plating resist ink to prevent the through holes from being plated with a conductive material; laminating the target prepregs and core boards so as to form a multi-layer printed circuit board PCB, wherein some or all of the prepregs are the target prepregs; drilling the multi-layer PCB to perforate the preset holes in the target prepregs; and plating inner walls of holes formed by drilling the multi-layer PCB. 1. A method for manufacturing a printed circuit board (PCB) , comprising:drilling at least one target prepreg at a position corresponding to at least one preset hole therein so as to form-a hole perforating through the target prepreg with aperture greater than that of the preset hole, and the preset hole does not need to transmit electrical signal between layers of the PCB;filling the formed holes with a plating resist ink to prevent the through holes from being plated with a conductive material;laminating at least one target prepreg and core board so as to form a multi-layer printed circuit board PCB;drilling the multi-layer PCB to perforate the preset holes in the target prepregs; andplating inner walls of holes formed by drilling the multi-layer PCB.2. The method as claimed in claim 1 , wherein ...

BURIED VIA IN A CIRCUIT BOARD

A method may include forming a plurality of multilayer cores wherein each multilayer core comprises a sheet of cured dielectric material having a layer of metal on each side of the sheet of cured dielectric material, patterning each layer of metal in the plurality of multilayer cores to form wiring traces in each layer of metal, embedding a solder element in at least one sheet of a plurality of sheets of uncured dielectric material, wherein the solder element having a melting point temperature within a temperature range of a curing temperature of the uncured dielectric material, forming a printed circuit board by alternately stacking the plurality of multilayer cores with the plurality of sheets of uncured dielectric material between each multilayer core, laminating the stack of multilayer cores and sheets of uncured dielectric material to cause curing of the sheets of uncured dielectric material and melting of the solder element. 1. A method comprising:forming a plurality of multilayer cores wherein each multilayer core comprises a sheet of cured dielectric material having a layer of metal on each side of the sheet of cured dielectric material;patterning each layer of metal in the plurality of multilayer cores to form wiring traces in each layer of metal;embedding a solder element in at least one sheet of a plurality of sheets of uncured dielectric material, wherein the solder element having a melting point temperature within a temperature range of a curing temperature of the uncured dielectric material;forming a printed circuit board by alternately stacking the plurality of multilayer cores with the plurality of sheets of uncured dielectric material between each multilayer core, the at least one sheet of the uncured dielectric material having the embedded solder element positioned so as to be aligned with the wiring traces in adjacent layers of metal in adjacent multilayer cores; andlaminating the stack of multilayer cores and sheets of uncured dielectric material ...

PCB Based Semiconductor Package with Impedance Matching Network Elements Integrated Therein

A Doherty amplifier includes a metal baseplate having a die attach region and a peripheral region; a main amplifier and one or more peaking amplifiers, each amplifier comprising a transistor die that includes at least one RF terminal; and a multilayer circuit board having a first side attached to the peripheral region and a second side facing away from the baseplate. The circuit board includes two embedded electrically conductive layers separated from the two sides by respective composite fiber layers, and an embedded dielectric layer disposed between the embedded electrically conductive layers and having a higher dielectric constant than either of the composite fiber layers. The Doherty amplifier also includes an RF impedance matching network that is electrically connected to an RF terminal of at least one amplifier transistor die, and that comprises one or more reactive components formed from at least one of the embedded electrically conductive layers. 1. A Doherty amplifier , comprising:a metal baseplate having a die attach region and a peripheral region;a main amplifier and one or more peaking amplifiers, wherein each amplifier comprises a transistor die that includes at least one RF terminal; a first side attached to the peripheral region;', 'a second side facing away from the baseplate:', 'a first embedded electrically conductive layer that is separated from the first side by a first embedded composite fiber layer;', 'a second embedded electrically conductive layer that is separated from the second side by a second embedded composite fiber layer; and', 'an embedded dielectric layer that is disposed between the first and second embedded electrically conductive layers, and that has a higher dielectric constant than either of the first and second embedded composite fiber layers;, 'a multilayer circuit board comprisingan RF impedance matching network that is electrically connected to an RF terminal of at least one of the amplifier transistor dies, and that ...