25-07-2023 дата публикации
Номер: CN116477963A
Принадлежит:
The invention relates to a method for producing a ceramic copper-clad substrate with pins from porous ceramic, which comprises the following steps of: SA, oxidizing one surface of a copper foil to form an oxide layer on the surface; sB, punching a plurality of through holes in preset positions on the ceramic substrate; sC, the surface, with the oxide layer, of the copper foil is attached to the ceramic substrate, and then co-sintering is carried out; sD, the copper foil side of the ceramic copper-clad substrate is subjected to film pasting, exposure and development treatment, the side, close to the copper foil, in the through hole is subjected to film pasting, and the width of an exposure area is smaller than that of the through hole; sE, etching is carried out by using an etching solution, and an etching region of the etching solution passes through a through hole region, so that a lower pin is left on the copper foil at the position of the through hole; and SF, processing breaking marks ...
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