Preparation and application of amphiphilic polysaccharide conjugate and medicinal compositions thereof

The invention relates to preparation and application of amphiphilic polysaccharide conjugate and medicinal compositions thereof with anti-tumor activity and biodegradability. The conjugate has amphiphilicity by using alkylenediamine as a connecting arm and introducing hydrophobic segmer, namely a carboxyl-containing anti-tumor medicament, on a polysaccharide framework, and are formed into nanometer micelles by self-assembly in water. The invention is characterized in that 1) the anti-tumor medicament is physically coated by a hydrophobic inner core consisting of hydrophobic groups so as to remarkably improve the solubility of the anti-tumor medicament; and 2) the anti-tumor medicament obtained by chemical conjugation and physical coating can jointly achieve treatment effect and improve medicament action. The polysaccharide conjugate and the medicinal compositions thereof can be used for injection, oral administration, external use or mucosa administration. The invention has the advantages ...

Special device for multi-crystal silicon film solar battery

The present invention discloses a polysilicon thin-film solar cell special equipment which comprises a container that is arranged in the boiler tube and executes chemical gas deposition procession to the thin-film cell piece, an air feeder which extends into the container through the opening on the container, and an ejection device which is arranged at the near side of the opening of the container and injects high-pressure inert gas to the opening of the container. The invention has reasonable structure and adopts high-pressure inert gas for sealing the opening of the container which executes chemical gas depositing procession to the thin-film cell piece.

OPTICAL FIBER UNIT

Method of preparing biodegradable super absorbent resin by using eggshell membrane

The invention discloses a method of preparing a biodegradable super absorbent resin by using an eggshell membrane. The super absorbent resin is prepared by employing an ultrasonic irradiation polymerization technique to make a reaction in a water phase system. The super absorbent resin is prepared particularly by the following steps: 1. modifying the inner membrane of the egg; 2. polymerizing thesuper absorbent resin at room temperature. The method is characterized by realization of absorbent resin polymerization at room temperature, no need of external heating modes such as water bath and air, no limitation of a radiation source (e.g., Co60, etc.), and can realize the absorbent resin polymerization at room temperature only by modifying the eggshell membrane, a cross-linking agent and a single-component initiator. The method shortens reaction time, simplifies preparation technology, needs no nitrogen protection and prepares a product with strong water absorbing capacity. The preparedproduct ...

Pharmaceutical composition containing gambogic acid medicament and preparation method thereof

The invention discloses a pharmaceutical composition containing a gambogic acid medicament and a preparation method thereof. The pharmaceutical composition containing the gambogic acid medicament is characterized by containing the gambogic acid medicament which forms micelle with an amphipathic high polymeric conjugate. In the invention, the gambogic acid medicament is coated in the amphipathic high polymeric conjugate by physical embedding and chemical conjugation, thus greatly improving the solubility of the gambogic acid medicament, notably improving the storage stability and antitumor activity and improving the safety of the medicament. Compared with gambogic acid medicaments, the pharmaceutical composition has improved curative effects and reduced irritation on treating liver cancer,cervical cancer and other cancers. The invention also provides preparation methods of the amphipathic high polymeric conjugate and the pharmaceutical composition containing the gambogic acid medicament.

Method of preparing biodegradable super absorbent resin by using eggshell membrane

The invention discloses a method of preparing a biodegradable super absorbent resin by using an eggshell membrane. The super absorbent resin is prepared by employing an ultrasonic irradiation polymerization technique to make a reaction in a water phase system. The super absorbent resin is prepared particularly by the following steps: 1. modifying the inner membrane of the egg; 2. polymerizing the super absorbent resin at room temperature. The method is characterized by realization of absorbent resin polymerization at room temperature, no need of external heating modes such as water bath and air, no limitation of a radiation source (e.g., Co60, etc.), and can realize the absorbent resin polymerization at room temperature only by modifying the eggshell membrane, a cross-linking agent and a single-component initiator. The method shortens reaction time, simplifies preparation technology, needs no nitrogen protection and prepares a product with strong water absorbing capacity. The prepared product ...

Trackless rubber wheel shuttle car for short wall mining

Special device for multi-crystal silicon film solar battery

The present invention discloses a polysilicon thin-film solar cell special equipment which comprises a container that is arranged in the boiler tube and executes chemical gas deposition procession tothe thin-film cell piece, an air feeder which extends into the container through the opening on the container, and an ejection device which is arranged at the near side of the opening of the containerand injects high-pressure inert gas to the opening of the container. The invention has reasonable structure and adopts high-pressure inert gas for sealing the opening of the container which executeschemical gas depositing procession to the thin-film cell piece.

Polysaccharide conjugate of carboxylic acid drug, preparation method thereof and application thereof

The invention discloses a polysaccharide conjugate of carboxylic acid drug, a preparation thereof and application thereof. In the technical scheme, sub-alkyl diamine with 2-12 carbon atoms is used as a connecting arm, and a carboxylic acid drug and polysaccharide carboxyl are connected with each other through an amido link. Compared with the original carboxylic acid drug, the conjugate enhances the pharmacological effect, reduces the adverse effect and improve the safety. In addition, the conjugate can have the amphipathic performance through using the hydrophobic carboxylic acid drug, so as to be used as a carrier of a slightly soluble or sparingly soluble drug. The preparation method of the invention is simple, the process is mature, the yield is high, and the preparation method is applicable to industrial production.

Interchangeable light saddle

The invention discloses an interchangeable light saddle which is applicable to a 50# traction pin and a 90# traction pin at the same time. The interchangeable light saddle comprises a horseshoe as well as two sets of horseshoe mouths and locking hooks, wherein the horseshoe is positioned at the center of a saddle body; the horseshoe mouths are connected with the horseshoe; the locking hooks are positioned at the back of the horseshoe, arranged on the saddle body through pressure plates and matched with neck parts below the root parts of the traction pins; openings of the horseshoe mouths are matched with the root parts of the traction pins, and the horseshoe mouths are detachably arranged on the horseshoe; the locking hooks are detachably connected with the pressure plates; the pressure plates are fixedly connected with the saddle body; the two locking hooks have the same thickness and are provided with bosses which have the same thickness and can make up height difference between thetwo ...

Anti-inflammatory drug (polysaccharide conjugate) as well as preparation and application of drug composition thereof

The invention discloses an anti-inflammatory drug (polysaccharide conjugate) as well as preparation and application of a drug composition thereof. The anti-inflammatory drug composition comprises an anti-inflammatory drug (polysaccharide conjugate) and slow-acting antirheumatic drugs. The anti-inflammatory drug (polysaccharide conjugate) has amphipathic characteristics by using alkylene diamines as a connecting arm and introducing hydrophobic non-steroidal anti-inflammatory drugs containing carbonyl on a polysaccharide framework, and is self-assembled to form a nano micelle in water, thereby physically coating the antirheumatic drugs, combining the chemically coupled non-steroidal anti-inflammatory drugs, and achieving the effect of combination treatment on the rheumatoid arthritis. The conjugate and the drug composition have high safety and good treatment effect, and can be used for injection, oral administration or external drug administration.

On-line calibration device of induction type cored magnetic sensor

The invention relates to an on-line calibration device of an induction type cored magnetic sensor. A supporting body is fixedly arranged on a magnetic core of a magnetic sensor; an enameled wire coil is wound on the supporting body; one end of the coil is connected with a resistor in series; and a shielding layer is arranged outside the coil. During use, by applying an AC voltage signal at a certain frequency and a certain intensity, a magnetic field at corresponding intensity and frequency is generated in the coil, the magnetic sensor senses a signal of the magnetic field to generate a voltage; the voltage signal is measured, the calibrated frequency response curve is obtained and the on-line calibration of the magnetic sensor is accomplished. The induction type cored magnetic sensor on-line calibration device has a simple structure, is convenient to operate and use, does not require to detach monitoring equipment, avoids complex work for transporting the magnetic sensor to a laboratory ...

Preparation method of new cephalosporin compound formulation

The invention relates to a new preparation method of a cephalosporin compound. The formula for preparing a suspension comprises 1g to 10g of the cephalosporin compound (C18H23N5O6S2), 5g to 15g of acacia, 0.1g to 1g of sorbic acid, 10g to 20g of poloxamer and a proper amount of glycerin; the formula for preparing an injectable powder injection comprises: 700g to 900g of the cephalosporin compound (C18H23N5O6S2), 20g to 40g of chlorobutanol, 300g to 500g of ibuprofen and a proper amount of water used for injection. The cephalosporin compound can be prepared into tablets, capsules, powder, particles, pastilles, emulsions or liquid preparations; the liquid preparations comprise oral or sterile solutions or suspensions used for injection. The cephalosporin compound has broad antibiotic spectrum, can be used for treating various diseases caused by bacterial infection, can be prepared into various preparation types and can be widely used for treating the diseases of animals, which are caused ...

Shortwall mining forklift in underground mine

The invention relates to a coal mine short-wall forklift, comprising a hopper, a front frame, a back frame, a hinge device, a cabin, an energy storage device, a hydraulic device, a walking device, a driving bridge, an operation device, an electric control circuit, a breaker, and a speed reducer. The invention uses large power energy-storage device as power, uses direct-current motor, hydraulic oil pump, hydraulic cylinder, and hydraulic valve to control transmitters, to wall, steer and load and unload the forklift, while the transmission and load of energy storage device are controlled by the hydraulic device. The invention uses two direct-current motors to drive the hydraulic oil pump, the gear speed reducer, to move the walking device forwards, backwards, steered or the like. And all elements are designed with explosion resistance. The invention can realize high power, high efficiency and high reliability or the like.

KDR siRNA and application thereof

The invention discloses a small interfering RNA (siRNA) sequence which can constrain tumor-derived vascular endothelial growth factor receptor 2(KDR) and the chemically modified compounds, the chemically modified compounds increase the stability of the siRNA and the ability of KDR siRNA to resist Nucleic acid hydrolysis in mammals bodies and guarantee the specificity of the anti-tumor effect. The invention also discloses the application of KDR siRNA in preparing anti-breast cancer gene therapy drugs.

Flame-proof type water-cooling apparatus for electric power electron power element

The invention relates to a flame-proof water cooling device of a power electronic power element, which is mainly composed of a flame-proof electric control main case body, an upper case body, a case base, a power element mounting cooling plate, a flame-proof flange plate, a cooling protective plate, a water inlet valve, a water outlet valve and a square-hole water cooling pipe, wherein a transitional connection plate, the flame-proof flange plate, the power element mounting cooling plate and the cooling protective plate are arranged on the outer side of the electric control main case body; a power element plate is arranged on the front surface of the power element mounting cooling plate, and a cooling device for the square-hole water cooling pipe is arranged on the back surface to form water circulation cooling and heat dissipating outside the case body; the water cooling pipe adopts a square-hole bending shape, thereby increasing the cold scattering area, reducing the heat of the power ...

Polysaccharide conjugate of carboxylic acid drug, preparation method thereof and application thereof

The invention discloses a polysaccharide conjugate of carboxylic acid drug, a preparation thereof and application thereof. In the technical scheme, sub-alkyl diamine with 2-12 carbon atoms is used as a connecting arm, and a carboxylic acid drug and polysaccharide carboxyl are connected with each other through an amido link. Compared with the original carboxylic acid drug, the conjugate enhances the pharmacological effect, reduces the adverse effect and improve the safety. In addition, the conjugate can have the amphipathic performance through using the hydrophobic carboxylic acid drug, so as to be used as a carrier of a slightly soluble or sparingly soluble drug. The preparation method of the invention is simple, the process is mature, the yield is high, and the preparation method is applicable to industrial production.

Nitrogenous super absorbent resin fertilizer and preparation method thereof

The invention discloses a nitrogenous super absorbent resin fertilizer and a preparation method thereof. Based on ultrasonic treatment technology, the preparation method adopts a novel synthetizing process to prepare a biodegradable nitrogenous super absorbent resin and comprises the following steps: carrying out modification treatment on maize straws; carrying out ultrasonic treatment on the maize straws; and soaking the prepared gel product in urea solution or uniformly mixing the prepared gel product with liquid urea to prepare the nitrogenous super absorbent resin fertilizer. The raw material in the invention is from one of agricultural solid wastes and has low price and no pollution. The treatment on the maize straws is simple and convenient and solid content in a reaction system is high. The ultrasonic treatment technology is applied to preparation of the absorbent resin so that the reaction time is greatly shortened, the processed solution can be directly subjected to high-temperature ...

TECHNOLOGY AND APPARATUS FOR PROCESSING SHELL-REMOVED LUCHONG INSECT OVUM

The present invention refers to the technology and the related apparatus for processing shell-removed Luchong (halophilic worm) ovum. Additional procedures added into the existing process include steeping ovum in brine, screening, separation with saturated salt water, separation with freshwater for removing impurities, e.g. mud, sand, ovum shell, etc., as well as recovery of saltwater, freshwater, and dechlorinating liq. and vacuum canning with salt water. The apparatus includes ovum steeping pool, double-net box, salt water separation tank, salt water precipitation tank, freshwater separation tank, freshwater recovery pool, shell-removing reaction tank, dechlorinating tank, small gas-filling machine, water pump, and vacuum canning machine. The present invention has advantages of large scale production, high product quality and purity, and long storage period.

Fermentation synergist for fuel alcohol

A fermentation synergist for preparing fuel alcohol from corn contains pectinase, cellulase, semi-cellulase, xylanase, phytase, acidic protease, bacterial protease, fungal protease and antibiotic, all of which constitute an efficient composite enzyme. Its advantages include full utilization of all nutrients, raised alcohol content up to (20%), short fermenting period, and low cost.

Process for preparing microbiological protein from alcohol supernatant

Disclosed is a microbe protein production method utilizing alcohol supernatant. The method employs membrane separation technology, sufficiently utilizes the effective substances in the supernatant to produce the microbe proteins. The invention can improve the additional value of the by-products, lower the consumption of the energy source and water with zero discharge. And has great economic benefit and environmental protection benefit, and can promote the development of the fuel alcohol.

Electromagnetic sky wave earthquake monitoring method

The invention relates to an electromagnetic sky wave earthquake monitoring method. A short wave time service signal transmitted by a short wave time service station is received by a short wave receiving antenna and a short wave receiver; the short wave receiver receives a time service signal modulated by Schumann resonance (SR) in a communication process and mixes and filters a received signal to acquire a signal with a zero intermediate frequency; and an analogue to digital (A/D) convertor samples the signal, transmits the sampled signal to a data processing computer, extracts a demodulated SR signal, analyzes parameters such as the frequency, bandwidth, intensity and the like of each order, displays the signal on a display in the forms of graphic and table, compares the signal with a standard SR signal so as to judge whether the signal is the warning of abnormity and realize earthquake monitoring. High-frequency electromagnetic waves are received actively in a radio detection mode so ...

Flame-proof type water-cooling apparatus for electric power electron power element

The invention relates to a flame-proof water cooling device of a power electronic power element, which is mainly composed of a flame-proof electric control main case body, an upper case body, a case base, a power element mounting cooling plate, a flame-proof flange plate, a cooling protective plate, a water inlet valve, a water outlet valve and a square-hole water cooling pipe, wherein a transitional connection plate, the flame-proof flange plate, the power element mounting cooling plate and the cooling protective plate are arranged on the outer side of the electric control main case body; a power element plate is arranged on the front surface of the power element mounting cooling plate, and a cooling device for the square-hole water cooling pipe is arranged on the back surface to form water circulation cooling and heat dissipating outside the case body; the water cooling pipe adopts a square-hole bending shape, thereby increasing the cold scattering area, reducing the heat of the power ...

Preparation and application of amphiphilic polysaccharide conjugate and medicinal compositions thereof

The invention relates to preparation and application of amphiphilic polysaccharide conjugate and medicinal compositions thereof with anti-tumor activity and biodegradability. The conjugate has amphiphilicity by using alkylenediamine as a connecting arm and introducing hydrophobic segmer, namely a carboxyl-containing anti-tumor medicament, on a polysaccharide framework, and are formed into nanometer micelles by self-assembly in water. The invention is characterized in that 1) the anti-tumor medicament is physically coated by a hydrophobic inner core consisting of hydrophobic groups so as to remarkably improve the solubility of the anti-tumor medicament; and 2) the anti-tumor medicament obtained by chemical conjugation and physical coating can jointly achieve treatment effect and improve medicament action. The polysaccharide conjugate and the medicinal compositions thereof can be used for injection, oral administration, external use or mucosa administration. The invention has the advantages ...

Interchangeable light saddle

The invention discloses an interchangeable light saddle which is applicable to a 50# traction pin and a 90# traction pin at the same time. The interchangeable light saddle comprises a horseshoe as well as two sets of horseshoe mouths and locking hooks, wherein the horseshoe is positioned at the center of a saddle body; the horseshoe mouths are connected with the horseshoe; the locking hooks are positioned at the back of the horseshoe, arranged on the saddle body through pressure plates and matched with neck parts below the root parts of the traction pins; openings of the horseshoe mouths are matched with the root parts of the traction pins, and the horseshoe mouths are detachably arranged on the horseshoe; the locking hooks are detachably connected with the pressure plates; the pressure plates are fixedly connected with the saddle body; the two locking hooks have the same thickness and are provided with bosses which have the same thickness and can make up height difference between the two ...

New process for extracting stevioside by utilizing enzyme coupling membrane separation technology

The invention discloses a new process for extracting stevioside by utilizing an enzyme coupling membrane separation technology, belonging to the technical field of food additives. The stevioside is a natural sweetener extracted from stevia rebaudian leaves, and the characteristics of high sweetness and low heat energy of the stevioside are more and more accepted by people. The existing extraction process has the defects of long extraction period, low extraction efficiency and the like, which is not favourable for the development of the stevioside industry. In the new process, the stevioside leaves serve as raw materials and are extracted at low temperature by an enzymatic method; impurities, such as colloid, pigment and the like, in the extracting solution are removed by virtue of a flocculation process; then, membrane filtration treatment is carried out by an ultrafiltration membrane with certain molecular weight cut-off; the ultrafiltrate is adsorbed, desorbed and decolorized by utilizing ...

Trackless rubber wheel shuttle car for short wall mining

The invention relates to a short wall mining trackless rubber tire shuttle car, which comprises a feeding part, a discharging part, a steering device, a scraper transport mechanism, a running mechanism, a steering mechanism, a cable taking in and off mechanism, a hydraulic transmission mechanism and an electric control mechanism. The invention adopts the electrical & mechanical integration explosion proof design and utilizes a connecting rod steering structure and a walking variable structure; the front and rear wheels adopt a wheelside speed reducing structure; a high voltage cable takes in and off automatically; the turning radius of the entire car is small and is 7.5m. The invention turns and walks freely, and solves the problem of difficult turning and walking of the equipments, and automatically finishes the scraper transport. The equipment is compact in structure, safe and reliable, is suitable for the narrow severe environment operation under the coal mine, high in production efficiency ...

Poloxamer-carboxylic acid drug conjugate and preparation method and application thereof

The invention discloses a poloxamer-carboxylic acid drug conjugate and a preparation method and application thereof. The conjugate is formed by directly linking the carboxyl of the carboxylic acid drug with the carboxyl of the poloxamer by the ester bond in the presence of a catalyst. The conjugate is the compound in the general formula (i) or (ii). Compared with the original carboxylic acid drugs, the conjugate has greatly improved drug solubility, enhanced pharmacological effects, reduced adverse reaction and higher safety. By utilizing the hydrophobic carboxylic acid drug, the conjugate can enhance the hydrophobicity of the poloxamer and greatly improve the amphipathy of the poloxamer, thus being capable of forming stable micellar structure under waterborne environment. As the drug carrier, the conjugate can complete further encapsulation of the drugs and can meet different release requirements by controlling the chemical grafted amount and the physical encapsulation amount or realize ...

Underground continuous tunnelling machine

The present invention relates to a coal mine underground continuous excavating machine. Its main mechanism includes the following several portions: main machine frame, rear machine frame, cutting mechanism, scooping plate mechanism, conveying mechanism, dust-removing mechanism, traveling mechanism, driving mechanism, hydraulic mechanism, electric control circuit and stable mechanism. Said invention also provides the connection mode of all the above-mentioned portions, and also provides the working principle of said excavating machine and its operation method.

Method for preparing stevia rebaudiana biological growth promoting agent

The invention discloses a method for preparing a stevia rebaudiana biological growth promoting agent and belongs to the field of agriculture and comprehensive utilization. In the preparation method, the stevia rebaudiana biological growth promoting agent is prepared by taking stevia rebaudiana waste residues and stevia rebaudiana stems obtained after stevia is extracted as raw materials and adding inorganic salt with trace elements and microbial composite strains for carrying out fermentation. The stevia rebaudiana biological growth promoting agent prepared by the method can be used as a fertilizer and a feed additive. When the stevia rebaudiana biological growth promoting agent is used as the fertilizer, the yield of crops and sweetness can be promoted and soil can be improved. When the stevia rebaudiana biological growth promoting agent is used as the feed additive, the quality and the yield of animal meat can be promoted and the antiviral ability of animals is improved. The stevia rebaudiana ...

Method for producing high purity rebaudiodside A

The invention relates to a method for producing high purity rebaudiodside A (RA) and belongs to the technical field of producing a food additive. The rebaudiodside A is an ingredient with the best taste in stevioside. Due to differences of respective processes and methods, the existing production processes commonly have the defects of low conversion rate, high energy consumption, high cost, unstable control on active ingredients and the like. In the invention, solvents such as methanol, ethanol and the like are mixed proportionally; the mixture is mixed with low purity RA proportionally; after being heated and flowing back, the obtained mixture is subjected to solid and liquid separation; and the obtained solid is dried or is dried after being washed so as to obtain the high purity RA. The content of RA can reach 80 to 99 percent. The RA recovery rate is more than 80 percent. The method for producing the high purity RA has the advantages of simple process, low energy consumption, high output ...

Preparation method of cefquinome sulfate

The invention relates to a method for synthesizing cefquinome sulfate and relates to a preparation method of a medicament for animals. The preparation method comprises the following steps: taking cefotaxime, 2,3-cyclohexyl pyridine and trimethyliodosilane as initial raw materials; preparing cefotaxime hydriodate from the cefotaxime; carrying out decoloring and silica column chromatography on the cefotaxime; and reacting the treated cefotaxime with sulphuric acid to prepare a cefquinome sulfate product. Compared with the prior art, the invention has the advantages of high yield of products, stable production quality and suitability for industrial production.

Nitrogenous and potassic super absorbent resin fertilizer and preparation method thereof

The invention discloses a nitrogenous and potassic super absorbent resin fertilizer and a preparation method thereof. Based on ultrasonic treatment technology, the preparation method adopts a novel synthetizing process to prepare a biodegradable nitrogenous potassic absorbent resin fertilizer and is realized by the following steps: carrying out modification treatment on maize straws; carrying out ultrasonic treatment on the maize straws; and preparing nitrogenous and potassic absorbent resin. The modified maize straw powder is added with urea solution, then acrylate solution the neutralization degree of which is between 60 and 85 percent is prepared from the mixture by using KOH, and the acrylate solution is added into modified cellulose solution to make the super absorbent resin contain nitrogen and potassium elements. The raw material in the invention is from one of agricultural solid wastes, has low price and cannot cause any pollution to the environment. The prepared product has sustained ...

Method for automatically measuring special position of tunnel boring machine

The invention relates to a method for automatically measuring the special position of a tunnel boring machine. According to the practical situation of the tunneling operation of the tunnel boring machine in a small underground space of a coal mine, an industrial view camera, an industrial computer, a laser orientation instrument and an image acquisition card are arranged on the back part of the tunnel boring machine. The position of the tunnel boring machine on a coal petrography cross section is measured and calculated, the most reasonable position of a machine body is determined, a command on an excavating operation is made and operators are far away from hazardous areas so as to reduce sudden accidents, enhance excavating safety and keep the tunnel boring machine on a best and most reasonable position and in a best and most reasonable state. A maximum cover angle is +/-60 degrees, a displacement detection deviation is less than 10 millimeters, the detection accuracy of a deflection angle ...

Fermentation synergist for fuel alcohol

Preparation and application of conjugate of anti-infective medicament and polysaccharide and medicinal composition thereof

The invention discloses preparation and application of a conjugate of an anti-infective medicament and polysaccharide and a medicinal composition thereof. The anti-infective medicinal composition comprises a conjugate of the anti-infective medicament and the polysaccharide, and the anti-infective medicament for pharmaceutically conventional combined use. In the conjugate of the anti-infective medicament and the polysaccharide, alkylidene diamine is used as a linking arm, and a hydrophobic carboxylic anti-infective medicament is introduced on a polysaccharide skeleton, so that the conjugate ofthe anti-infective medicament and the polysaccharide has amphipathic characteristics, performs self-assembly in water to form a nano-micelle, can physically coat the anti-infective medicament, and iscombined with a chemically coupled anti-infective medicament to achieve a combined treatment effect. The conjugate and the medicinal composition thereof have high safety and wide antimicrobial spectrums, ...

Method for processing scorpion

The invention relates to a method for processing Chinese medicinal materials, particularly to a method for processing scorpions. The prior method for processing the scorpions is carried out by boiling, thereby inducing the live scorpions to secrete scorpion venom to the exterior after suffering from heat flash stimulation, and the scorpion venom is thermolabile and soluble in water, so as to lose a large amount of effective ingredients at the beginning of the processing. The invention provides a novel method for processing the scorpions, which comprises the following steps of soaking a live scorpion in clean water so as to cause the scorpion to discharge food and residues in digestive tract out of the body under a comfortable environment, and killing scorpion by refrigerating at low temperature so as not to loss effective ingredients in the scorpion. The method can maximally retain the effective ingredients of the scorpion. The obtained scorpion by the method has the peptide and protein ...

MOTHERBOARD WITH AN ENERGY SAVING FUNCTION

A motherboard with an energy saving function is coupled to an external power supply. The external power supply provides an operational power. The motherboard includes a battery and a processing device. The battery provides a standby power. The processing device receives the operational power in a turned-on mode. The processing device does not receive the operational power and receives the standby power in a turned-off mode. 1. A motherboard with an energy saving function and coupled to an external power supply providing an operational power , comprising:a battery providing a standby power; anda processing device receiving the operational power in a turned-on mode, wherein the processing device does not receive the operational power and receives the standby power in a turned-off mode.2. The motherboard as claimed in claim 1 , wherein the processing device charges the battery in the turned-on mode.3. The motherboard as claimed in claim 1 , wherein the processing device detects whether a specific condition occurs in the turned-off mode claim 1 , and when the specific condition occurs claim 1 , the processing device executes a predetermined action.4. The motherboard as claimed in claim 3 , wherein the specific condition is that the processing device receives an activating signal issued by an external device.5. The motherboard as claimed in claim 4 , wherein the processing device again receives the operational power and does not receive the standby power to again enter the turned-on mode according to the activating signal.6. The motherboard as claimed in claim 4 , wherein the external device is a mouse claim 4 , a keyboard or an internet.7. The motherboard as claimed in claim 1 , wherein the processing device determines whether to receive the operational power or receive the standby power according to a power on signal.8. The motherboard as claimed in claim 1 , wherein the processing device does not receive the operational power and receives the standby power in a ...

CONTROL CIRCUIT

A control circuit includes a temperature detection circuit, a comparison circuit, and an alarm circuit. The temperature detection circuit detects the temperature of a first socket and outputs a first temperature signal correspondingly. The comparison circuit compares the temperature signal with a reference temperature signal corresponding to a reference temperature, and outputs a control signal according to the comparison result. The alarm circuit alerts the users according to the control signal. 1. A control circuit comprising:a temperature detection circuit to detect the temperature at a first socket and output a first temperature signal correspondingly;a comparison circuit to compare the temperature signal with a reference temperature signal corresponding to a reference temperature, and output a control signal according to the comparison result; andan alarm circuit to alert users according to the control signal.2. The control circuit of claim 1 , further comprising a delay switching circuit claim 1 , wherein the delay switching circuit disconnects the socket from a first power supply according to the control signal.3. The control circuit of claim 2 , wherein the delay switching circuit comprises a delay circuit claim 2 , a first electronic switch claim 2 , and a relay claim 2 , the delay circuit receives the control signal and outputs a delay signal after a period of delay to a first terminal of the first electronic switch to turn off the first electronic switch claim 2 , a second terminal of the electronic switch is grounded claim 2 , a third terminal of the electronic switch is connected to an anode of a diode claim 2 , a cathode of the diode is connected to a second power supply claim 2 , a coil of the relay is connected to the diode in parallel claim 2 , a switch of the relay is connected between the socket and the first power supply.4. The control circuit of claim 3 , wherein the delay circuit comprises a second electronic switch and a first timer claim 3 , ...

LIGHT EMITTING DIODE PACKAGE

An exemplary LED package includes first and second electrodes, an LED chip and two electrically conductive wires. The first electrode has a top surface and an opposite bottom surface. A recess is defined in the top surface of the first electrode. The second electrode has a top surface and an opposite bottom surface. A recess is defined in the top surface of the second electrode. The LED chip has a bottom surface attached to the top surface of the first electrode, and a top surface on which a first pad and a second pad are formed. One of the electrically conductive wires has an end connecting to the first pad and an opposite end joining with a bottom of the recess of the first electrode. The other has an end connecting to the second pad and an opposite end joining with a bottom of the recess of the second electrode. 1. A light emitting diode (LED) package comprising:a first electrode and a second electrode insulating from the first electrode, at least one recess being defined in the second electrode;an LED chip mounted on the first electrode, the LED chip having a first pad and a second pad with opposite polarities; andat least one electrically conductive wire with one end connecting to one of the first and second pads of the LED chip, and an opposite end joining with the second electrode at a bottom of the at least one recess.2. The LED package of further comprising another electrically conductive wire claim 1 , wherein the first pad and the second pad are positioned on a top surface of the LED chip claim 1 , the first electrode defining a recess claim 1 , the another electrically conductive wire having one end connecting to the other one of the first and second pads and an opposite end joining with the first electrode at a bottom of the recess defined by the first electrode.3. The LED package of claim 1 , wherein a covering layer is coated on a joint between the at least one electrically conductive wire and the second electrode and a joint between the another ...

LENS MODULE AND IMAGE PICK-UP APPARATUS INCORPORATING SAME

A lens module includes a lens barrel, two lenses, and a light shielding plate. The lens barrel has a light passing hole and a receiving hole in communication with the light passing hole. The lenses are received in the receiving hole and aligned with the light passing hole and aligned with the light passing hole. The light shielding plate is arranged between the two lenses. The conic section of the light shielding plate prevents unwanted or stray light from reaching the image sensor. 1. A lens module , comprising:a lens barrel having a light passing hole and a receiving hole in communication with the light passing hole;a first lens and a second lens received in the receiving hole and aligned with the light passing hole, the first lens being adjacent to the light passing hole; anda first light shielding plate arranged between the first and second lenses, the first light shielding plate having a first surface adjacent to the first lens and a second surface facing away from the first surface, the first light shielding plate defining a first through hole through the first and second surfaces, the first through hole being optically aligned with the first and second lenses, the first light shielding plate having a first conical inner surface between the first surface and the second surface in the first through hole.2. The lens module of claim 1 , wherein the first conical inner surface is interconnected between the first surface and the second surface claim 1 , and faces toward the second surface.3. The lens module of claim 1 , wherein the first conical surface is interconnected between the first surface and the second surface claim 1 , and faces toward the first surface.4. The lens module of claim 1 , wherein the first light shielding plate further comprises a second conical inner surface between the first surface and the second surface claim 1 , the first conical inner surface connected to the second conical inner surface claim 1 , the second conical inner surface facing ...

AUTOMATIC PART FEEDER

An automatic part feeder includes a base, a rotatable disk covering the base, a part delivering devices, and a rotatable disk driving device received in the base. Each of the part delivering devices includes a ring-shaped receiving room opening toward a first end surface of the base, a first driving motor having a first rotatable shaft, and an ejector pole having one end extending through the ring-shaped receiving room and another end threadedly engaged with the first rotatable shaft. The rotatable disk driving device has a second driving motor having a second rotatable shaft. The rotatable disk includes receiving holes, and the second rotatable shaft engages with the rotatable disk and is configured for driving the rotatable disk to rotate to align the receiving holes with the respective ring-shaped receiving rooms to receive the parts ejected from the ring-shaped receiving rooms. 1. An automatic part feeder , comprising:a base comprising a first end surface, an opposite second end surface, a first accommodating hole and a plurality of second accommodating holes, the first and second accommodating holes being separated from each other and each being exposed at the first surface;a plurality of part delivering devices accommodated in the respective second accommodating holes, each of the part delivering devices comprising a ring-shaped receiving room opening toward the first end surface, a first driving motor having a first rotatable shaft, and an ejector pole having one end extending through the ring-shaped receiving room and another end threadedly engaged with the first rotatable shaft, the ring-shaped receiving room configured for receiving a plurality of parts, the ejector pole being movable outwardly by means of rotation of the first rotatable shaft, thereby ejecting the parts out of the ring-shaped receiving room;a rotatable disk driving device accommodated in the first accommodating hole, the rotatable disk driving device having a second driving motor having a ...

LIGHT EMITTING DIODE DEVICE

An LED device includes a substrate, an LED chip and a lens module. The substrate has an upper surface. The LED chip is arranged on the upper surface of the substrate. The LED chip has a light emitting surface away from the upper surface of the substrate. The lens module is arranged over the light emitting surface of the LED chip. The lens module includes a first lens. The first lens includes a first light outputting surface away from the light emitting surface of the LED chip. The first light outputting surface of the first lens defines a first cavity at a center thereof. 1. A light emitting diode (LED) device , comprising:a substrate having an upper surface;an LED chip arranged on the upper surface of the substrate, the LED chip having a light emitting surface away from the upper surface of the substrate; anda lens module arranged over the light emitting surface of the LED chip, the lens module comprising a first lens, the first lens comprising a first light outputting surface away from the light emitting surface of the LED chip, the first light outputting surface of the first lens defining a first cavity at a center of a top thereof.2. The LED device of claim 1 , wherein the first lens has a hemispherical shape.3. The LED device of claim 2 , wherein the first cavity has a conical shape claim 2 , and a central axis of the first cavity extends through a spherical center of the first lens.4. The LED device of claim 3 , wherein a distance H between a lowest point of the first cavity and a spherical center of the first lens and a spherical radius R of the first lens satisfy a condition:{'br': None, '⅛R≦H≦¼R.'}5. The LED device of claim 3 , wherein the first lens comprises a first light inputting facing the LED chip claim 3 , the first light outputting surface defining a first bounding circle around the first cavity claim 3 , and a distance Hbetween the first bounding circle and the first light inputting surface of the first lens and the spherical radius R satisfy a ...

LED PACKAGE AND METHOD FOR MANUFACTURING THE SAME

An LED package includes an electrode, an LED chip, and an insulation layer. The electrode includes a first electrode and a second electrode. The first electrode and the second electrode are separate from each other. The LED chips are connected to the first and second electrodes. The insulation layer covers the first and second electrodes and the LED chip. A cavity is defined in the first electrode for receiving the LED chip therein. A channel is defined between the first electrode and the second electrode. The channel communicates with the cavity and the insulation layer fills in the cavity and the channel. 1. An LED package , comprising: an electrode , an LED chip , and an insulation layer , the electrode including a first electrode and a second electrode , the first electrode and the second electrode arranged with intervals mutually , the LED chip connected electrically to the electrode , the insulation layer encapsulating the electrode and the LED chip , wherein a cavity is arranged on the first electrode , the LED chip is arranged within the cavity , a channel is defined between the first electrode and the second electrode , the channel communicates with the cavity , the insulation layer is filled into the cavity and the channel.2. The LED package of claim 1 , wherein the first electrode has a top surface claim 1 , the cavity is formed from the top surface.3. The LED package of claim 2 , wherein the cavity has an opening facing the second electrode claim 2 , and the second electrode has other cavity facing the first electrode claim 2 , the insulation layer also filling in the other cavity.4. The LED package of claim 1 , further including a connection electrode claim 1 , the connection electrode including a first connection electrode and a second connection electrode claim 1 , the first connection electrode connected to the first electrode claim 1 , the second connection electrode connected to the second electrode claim 1 , the first connection electrode ...

METHOD, APPARATUS AND INTEGRATED CIRCUIT FOR IMPROVING IMAGE SHARPNESS

An apparatus for improving image sharpness includes a pixel detector that labels each of pixels in an image as one of an edge/texture type and a non-edge/texture type, a pixel type determiner that classifies each of the pixels that are labeled as the edge/texture type as one of a border point type pixel, a transition point type pixel, and a peak point type pixel, and a filter. The filter includes a shrinking/expanding filter and a high boost filter, the shrinking/expanding filter filtering the border point type pixels, and the high boost filter subsequently filtering the peak point type pixels and then filtering the transition point type pixels. 1. A method and apparatus for improving image sharpness , comprising:labeling each pixel in an image as one of an edge/texture type and a non-edge/texture type;classifying each labeled pixel as the edge/texture type as one of a border point type, a transition point type, and a peak point type; andusing a shrinking/expanding filter to filter each border point type pixel, and subsequently using a high boost filter to first filter each peak point type pixel and then filter each transition point type pixel to sharpen the image.2. The method for improving image sharpness according to claim 1 , wherein claim 1 , when the image is processed in the horizontal direction claim 1 , the labeling further includes:calculating a horizontal gradient value for each pixel based on a grayscale value of the pixel;labeling a pixel as the edge/texture type if an absolute value of the horizontal gradient value of the pixel is greater than a gradient threshold value, and otherwise labeling the pixel as the non-edge/texture type; anddetermining whether adjacent left and right pixels of the pixel labeled as the edge/texture type are both labeled as the non-edge/texture type, the pixel being relabeled as the non-edge/texture type if the determination is affirmative.3. The method for improving image sharpness according to claim 2 , wherein the ...

COMPUTER SYSTEM WITH MULTIPLE OPERATION MODES AND METHOD OF SWITCHING MODES THEREOF

In a computer system with multiple operation modes and a method of switching modes, the computer system switches the operation modes with multiple hard disk drives by a setting signal. The method of switching modes includes the following steps. A chip unit detects the number of the hard disk drives with no storage of the boot program and the chip unit decides the operation mode of the Redundant Array of Independent Disks. The chip unit produces a corresponding control signal and transmits the control signal to a switch unit. The switch unit produces a setting signal according to the control signal and delivers to the hard disk device to switch the operation modes of the hard disk. 1. A computer system with multiple operation modes , the computer system comprising:a plurality of hard disk drives, at least one of the hard disk drives containing and executing a boot program normally;a chip unit electrically connecting to the hard disk drives, the chip unit detecting the number of the hard disk drives stored no boot program, and the chip unit optionally generating a control signal; anda switch unit electrically connecting to the chip unit and the hard disk drives, the switch unit receiving the control signal and generating a setting signal to the hard disk drives accordingly, and at least two hard disk drives with no boot program being able to execute an operation mode of the Redundant Array of Independent Disks.2. The computer system of claim 1 , wherein the hard disk drive is a Solid State Drive.3. The computer system of claim 1 , wherein the switch unit is a control chip.4. The computer system of claim 1 , wherein the switch unit is a General Purpose Input Output.5. A method of switching the operation modes of a computer system claim 1 , the method comprising the following steps:detecting the number of the hard disk drives with no boot program by a chip unit;deciding an operation mode of the Redundant Array of Independent Disks of the hard disk drives with no boot ...

METHOD, SYSTEM AND COMPUTER-READABLE MEDIUM FOR SWITCHING ACCESS MODE OF HARD DRIVE

A method for switching access mode of a hard drive is provided. The method includes the following steps: detecting and writing digitally current access mode as a current registry code of a system registration information by a processing unit, then overwriting the current registry code with a new registry code that corresponds to a new access mode other than the current access mode by the processing unit, and then reloading the system registration information by the processing unit, and then changing the current access mode to the new access mode correspondingly by a Basic Input/Output System (BIOS). In addition, a system executing the method and a computer-readable medium encoded with processing instructions for implementing the method are also provided. 1. A method for switching access mode of a hard drive , the hard drive having a plurality of access modes , the method comprising steps of:detecting and writing digitally current access mode as a current registry code of a system registration information by a processing unit;overwriting the current registry code with a new registry code that corresponds to a new access mode other than the current access mode by the processing unit;reloading the system registration information by the processing unit; andchanging the current access mode to the new access mode correspondingly by a Basic Input/Output System (BIOS).2. The method according to claim 1 , wherein the step of reloading the system registration information further comprises a step of reloading a hard drive driver by the processing unit of the computer.3. The method according to claim 1 , wherein the current access mode is Non-Redundant Array of Independent Drives mode (Non-RAID mode) and the new access mode is Redundant Array of Independent Drives mode (RAID mode) claim 1 , or the current access mode is Redundant Array of Independent Drives mode (RAID mode) and the new access mode is Non-Redundant Array of Independent Drives mode (Non-RAID mode).4. A system for ...

Air Filter Device

An air filter device includes an air filter medium, a base including a surrounding wall that has first and second ends and that defines a receiving space, and a loop-shaped retainer that engages removably the second end of the surrounding wall. The receiving space of the base is open at the first and second ends of the surrounding wall, and the air filter medium is placed removably in the receiving space. The first end of the surrounding wall is configured to support one side of the air filter medium, and the loop-shaped retainer is disposed to abut against another side of the air filter medium in the receiving space. 1. An air filter device comprising:an air filter medium;a base including a surrounding all that has first and second ends and that defines a receiving space, said receiving space being open at said first and second ends of said surrounding wall, said air filter medium being placed removably in said receiving space, said first end of said surrounding wall being configured to support one side of said air filter medium; anda loop-shaped retainer that engages removably said second end of said surrounding wall and that is disposed to abut against another side of said air filter medium in said receiving space.2. The air filter device of claim 1 , wherein said surrounding wall has an outer surface formed with a plurality of protrusions claim 1 , and said loop-shaped retainer is formed with a plurality of resilient anchoring members that engage removably and respectively said protrusions.3. The air filter device of claim 1 , wherein said loop-shaped retainer includes a loop-shaped frame that engages removably said second end of said surrounding wall claim 1 , and a sealing strip fitted between said loop-shaped frame and said surrounding wall.4. The air filter device of claim 3 , wherein said loop-shaped frame is formed with an insert groove that opens toward said surrounding wall and that has said sealing strip received therein claim 3 , said second end of ...

METHOD AND SYSTEM OF DETECTING REDUNDANT ARRAY OF INDEPENDENT DISKS AND TRANSFERRING DATA

A system is utilized for detecting a RAID which includes a detector and a processor which electrically connects with the detector. The detector detects read/write state of a plurality of storage units, and generates a signal according to the read/write state respectively. The processor receives the signal, and determines the read/write state corresponding to the signal. When the read/write state of a first storage unit of the storage units is determined abnormal and wherein the processor sends a control signal, so as to interrupt a RAID mode of the system. Then, data stored in the first storage unit moves to the rest of the storage units according to the control signal. 1. A method of detecting redundant array of independent disks (RAID) and transferring data , the RAID composed of a plurality of storage units and the method comprising the following steps of:executing a RAID mode by a RAID normally;detecting a read/write state of the plurality of storage units by a detector;generating a signal according to the read/write state of the storage units by the detector;transmitting the signal to a processor by the detector;determining the read/write state corresponding to the signal by the processor; andif the read/write state of a first storage unit of the storage units is abnormal, sending a control signal to interrupt the RAID mode and moving data stored in the first storage unit to the rest of the storage units by the processor.2. A method as claimed in claim 1 , further comprising the step of:setting a time interval to the detector for detecting the read/write state of the storage units.3. A method as claimed in claim 1 , wherein the step of determining the read/write state further comprises the step of determining the read/write state according to one or combination of a data read/write speed claim 1 , a data transmission speed claim 1 , a voltage variation value claim 1 , and a data integrity of the storage units.4. A method as claimed in claim 1 , further ...

LIGHT EMITTING DIODE DEVICE

A light emitting diode (LED) device includes a substrate, first and second LED chips arranged on the substrate, and a phosphor layer over the first and second LED chips. The phosphor layer includes a plurality of phosphor units, each including a phosphor particle and a silver halide layer encapsulating the phosphor particle. Light emitted from the second LED chip strikes the phosphor particles to generate a first light, which. combines with the light to generate a resultant light. The silver halide layer is reduced by the light from the first LED chip to produce silver particles around the phosphor particles. The silver particles can block the light emitted from the second LED chip from sticking the phosphor particles. By adjusting the current supplied to the first LED chip, the color temperature of the resultant light generated by the LED device can be changed. 1. A light emitting diode (LED) device , comprising:a substrate;a first LED chip and a second LED chip arranged on the substrate, the first LED chip being ultraviolet (UV) LED for generating UV light; anda phosphor layer arranged over the first and second LED chips, the phosphor layer comprising a plurality of phosphor units, each phosphor unit comprising a phosphor particle and a silver halide layer encapsulating the phosphor particle;wherein when the first LED chip is turned off and the second LED chip is turned on, a part of light emitted from the second LED chip travelling through the silver halide layer and striking the phosphor particles to generate a first light, which is combined with a residual part of the light emitted from the second LED chip to generated a first resultant light with a first color temperature; andwherein when the first LED chip and the second LED chip are both turned on, the silver halide layer being reduced by the UV light generated from the first LED chip to produce silver particles around the phosphor particles, a part of the light emitted from the second LED chip striking the ...

CIRCUIT PROTECTION DEVICE AND PROTECTION METHOD THEREOF

A circuit protection device and a protection method thereof are provided. The circuit protection device includes a pulse width modulation unit which detects in order for a plurality of current phase of a plurality of transistors. The pulse width modulation unit decides the current phase of the transistors override a first threshold value whether. Then, the pulse width modulation unit sends a control signal to close the transistor that the current phase exceeds the first threshold value, so as to avoid the transistor burn down. 1. A circuit protection device being applicable to a circuit board , a plurality of transistors electrically disposed on the circuit board and each transistor having a current phase respectively , the circuit protection device comprising:a Pulse Width Modulation (PWM) unit electrically connecting to the transistors and storing a first threshold values corresponding to each of the plurality of transistors,wherein the PWM unit detects the current phase of the plurality of transistors in order, determines whether the current phase of each transistor exceeds the corresponding first threshold value, and produces a control signal to shut down the transistor when the current phase thereof exceeds the corresponding first threshold value.2. The circuit protection device as claim 1 , further comprising a temperature sensor electrically connecting to the PWM unit claim 1 , wherein the PWM unit further stores a second threshold values corresponding to each of the plurality of transistors claim 1 , detects a temperature of at least one transistor claim 1 , determines whether the temperature exceeds the second threshold value claim 1 , and generates the control signal to shut down the transistor when the temperature exceeds the second threshold value.3. The circuit protection device as claim 2 , wherein the temperature sensor is a thermal resistor.4. A circuit protection method comprising the following steps:detecting a current phase of a plurality of ...

LED PACKAGE DEVICE

An LED package device having a dam located on a substrate is provided, by which two regions are defined on the substrate. Two LED dies are respectively disposed on the two regions and separated by the dam; therefore, the LED package device has an enhanced intensity of the lateral-emitting light and a wide light emitting angle. The LED package devices can be used in backlight units to prevent mura and hot spot issues. 1. An LED package device , comprising:a substrate, having two regions separated by a dam, two electrodes located on a surface of the substrate;two LED dies, disposed on the two regions and, respectively, electrically connecting to the two electrodes; andan encapsulation layer, covering the surface of the substrate and the two LED dies.2. The LED package device as claimed in claim 1 , wherein the dam is located on a middle of the substrate.3. The LED package device as claimed in claim 2 , wherein the two regions define a first region and a second region respectively on two opposite ends of the substrate.4. The LED package device as claimed in claim 1 , wherein a height of the dam is greater than each of thicknesses of the two LED dies.5. The LED package device as claimed in claim 1 , wherein the dam is reflective and made of polyphthalamide (PPA) claim 1 , epoxy claim 1 , polymer or other plastic.6. The LED package device as claimed in claim 1 , wherein the two electrodes are respectively located on the two regions claim 1 , and a third electrode is located under the dam claim 1 , the two LED dies being electrically connected to the third electrode.7. The LED package device as claimed in claim 6 , wherein the two electrodes comprises an anode and a cathode.8. The LED package device as claimed in claim 7 , wherein the two LED dies electrically connect in series by an electrically-conducting mean via the third electrode.9. The LED package device as claimed in claim 1 , wherein two connecting electrodes are located on the two regions and claim 1 , ...

Energy Management Method and System, and Computer Readable Storage Medium for Storing the Method

An energy management method is provided. The energy management method comprises the steps of retrieving load information from at least one load and retrieving energy-supplying information from an energy supply system having a grid power source, a renewable energy generation module and an energy storage module to instantly calculate first and second energy thresholds. When an energy production of the renewable energy generation module is smaller than the second energy threshold, the grid power source or the energy storage module is controlled to supply energy to the load. When the energy production is between the first and the second energy thresholds, the renewable energy generation module is controlled to supply energy to the load. When the energy production is larger than the first energy threshold, the renewable energy generation module is controlled to supply energy to the load and charge the energy storage module.

LED PACKAGE AND LIGHT EMITTING DEVICE HAVING THE SAME

An exemplary LED package includes first and second electrodes, an LED die and an encapsulation. An inner wall of each first and second electrode includes a first oblique plane. The LED die is surrounded by and electrically connected to the first and second electrodes. The LED die includes an outputting surface. The encapsulation is filled between the first electrode ant the second electrode and covers the LED die, and includes opposite first and second outer surfaces, wherein the second outer surface acts as an outputting surface of the LED package. A reflective layer is coated on the first outer surface of the encapsulation. The first oblique plane of the electrode structure is light reflective and extends aslant from the outputting surface of the LED die towards the outputting surface of the LED package along a direction away from the LED die. 1. An LED package comprising:an electrode structure comprising a first electrode and a second electrode insulated from each other, the first electrode and the second electrode each comprising an inner wall, the inner wall comprising a first oblique plane;an LED die surrounded by and electrically connected to the first electrode and the second electrode, the LED die comprising an outputting surface; andan encapsulation filled between the first electrode ant the second electrode and covering the LED die, the encapsulation comprising a first outer surface and a second outer surface opposite to the first outer surface, a reflective layer covering the first outer surface of the encapsulation and facing the outputting surface of the LED die, the second outer surface of the encapsulation acting as an outputting surface of the LED package, the first oblique plane of the electrode structure extending aslant from the outputting surface of the LED die towards the outputting surface of the LED package along a direction away from the LED die.2. The LED package of claim 1 , wherein an angle between the first oblique plane and the ...

LED AND BACKLIGHT MODULE USING THE SAME

An LED includes a base, an LED chip, a first electrode, a second electrode, an encapsulating layer, and a reflective layer. The base forms a concave recessed from a top face thereof and a recess above the concave. The reflective layer is attached on the concave. The LED chip is received in the recess and located over the reflective layer. The LED chip has a light output face facing towards the reflective layer. The encapsulating layer is filled in the recess to cover the reflective layer and encapsulate the LED chip. The reflective layer includes a first reflective layer and a second reflective layer. The first reflective layer is located at a center of the concave. The second reflective layer surrounds and connects the first reflective layer. The first reflective layer has a curvature smaller than that of the second reflective layer. 1. An LED , comprising:a base forming a concave recessed from a face thereof and a recess above the concave;a reflective layer attached on the concave, the reflective layer comprising a first reflective layer and a second reflective layer, the first reflective layer being located at a center of the concave, the second reflective layer surrounding and connecting the first reflective layer, the first reflective layer having a curvature smaller than that of the second reflective layer;an LED chip received in the recess and spaced from the reflective layer, the LED chip having a light output face facing towards the reflective layer;a first electrode and a second electrode electrically connected to the LED chip; andan encapsulating layer filled in the recess to cover the reflective layer and encapsulate the LED chip.2. The LED of claim 1 , wherein the first reflective layer and the second reflective layer are arc-shaped.3. The LED of claim 2 , wherein a position of the LED chip deviates from a focus of the first reflective layer.4. The LED of claim 1 , wherein a distance between the first reflective layer and the face of the base is not ...

ELECTRONIC CONNECTION QUALITY TEST DEVICE FOR UNIVERSAL SERIAL BUS INTERFACES

An electronic connection quality test device includes a plurality of test circuits, a hot plug circuit, and a control circuit. The test circuits are respectively electrically connected to a plurality of universal serial bus (USB) interfaces. The hot plug circuit is electrically connected to each of the test circuits and a USB device. The control circuit is electrically connected to each of the test circuits and controls the test circuits to electrically connect selected ones of the USB interfaces with the USB device via the test circuits and the hot plug circuit, thereby forming tested electronic connections between the selected ones of the USB interfaces and the USB device. 1. An electronic connection quality test device , comprising:a plurality of test circuits configured to be respectively electrically connected to a plurality of universal serial bus (USB) interfaces;a hot plug circuit electrically connected to each of the test circuits, the hot plug circuit further configured to be electrically connected to a USB device; anda control circuit electrically connected to each of the test circuits;wherein the control circuit controls the test circuits to electrically connect selected ones of the USB interfaces with the USB device via the test circuits and the hot plug circuit.2. The electronic connection quality test device as claimed in claim 1 , wherein the control circuit includes a controller chip claim 1 , the controller chip includes a plurality of control pins corresponding to the test circuits and respectively electrically connected to the test circuits claim 1 , and the controller chip controls the test circuits to electrically connect selected ones of the tested USB interfaces to the USB device via the test circuits and the hot plug circuit using the control pins.3. The electronic connection quality test device as claimed in claim 2 , wherein the controller chip further includes a plurality of indication pins corresponding to the control pins claim 2 , and ...

LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MAKING SAME

A light emitting diode package includes a triangular supporting member, a first substrate and a second substrate adhered on first and second inclined sidewalls the supporting member, respectively, a first LED chip and a second LED chip secured on the first substrate and the second substrate, respectively, and a package layer covering the first LED chip and a second LED chip. The first inclined sidewall and a bottom surface of the supporting member cooperatively form a first angle therebetween, and the second inclined sidewall and the bottom surface cooperatively form a second angle therebetween. The first angle and the second angle each range between 0 degree and 90 degrees. A method for making the light emitting diode package is also provided. 1. An LED package , comprising:a supporting member comprising a bottom surface, a first sidewall and a second sidewall, the first sidewall and the bottom surface cooperatively forming a first angle therebetween, the second sidewall and the bottom surface cooperatively forming a second angle therebetween, the first angle and the second angle each ranging between 0 degree and 90 degrees;a first substrate and a second substrate formed respectively on the first sidewall and the second sidewall, a first electrode being formed on an upper surface of the first substrate and a second electrode being formed on an upper surface of the second substrate;a first LED chip and a second LED chip, the first LED chip being formed on an upper surface of the first electrode and electrically connected with the first electrode and the second electrode, the second LED chip being formed on an upper surface of the second electrode and electrically connected with the first electrode and the second electrode; anda package layer covering the first LED chip and the second LED chip.2. The LED package of claim 1 , wherein the first electrode extends downwardly from the upper surface of the first substrate to the upper surface of the supporting member claim ...

LIGHT EMITTING DIODE WITH SIDEWISE LIGHT OUTPUT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

A light emitting diode (LED) includes a substrate, an electrode structure positioned on the substrate, an LED component electrically connected to the electrode structure, and a lens structure positioned on the substrate and covering the LED component. The lens structure includes a rugged structure adjacent to the substrate; the roughness of the rugged structure decreases gradually along a direction from a center of the lens structure center toward a peripheral edge thereof. The present disclosure also provides a method for manufacturing the LED light source. 1. A light emitting diode (LED) comprising:a substrate;an electrode structure positioned on the substrate;an LED component electrically connected to the electrode structure;a lens structure positioned on the substrate and covering the LED component, the lens structure comprising a rugged structure adjacent to the substrate, the roughness of the rugged structure decreasing gradually along a direction from a center of the lens structure toward a peripheral edge thereof, and an encapsulant over the rugged structure, the LED component aligning with the center of the lens structure.2. The LED light source according to claim 1 , wherein the rugged structure comprises a first set of protrusions surrounding a center of the lens structure claim 1 , a second set of protrusions surrounding the first set of protrusions and a third set of protrusions surrounding the second set of protrusions claim 1 , and wherein the protrusions in a same set have a uniform height claim 1 , and the height of the second set of protrusions is smaller than that of the first set of protrusions claim 1 , and greater than that of the third set of protrusions.3. The LED light source according to claim 2 , wherein the lens structure comprises an annular base at a bottom thereof claim 2 , the annular base defines a through hole therein claim 2 , the lens structure defines a recess therein in communication with the through hole of the base claim 2 , ...

LED DEVICE HAVING UNIFORM DISTRIBUTION OF LIGHT INTENSITY OF LIGHT FILED

An LED device includes a substrate having a top surface, an LED chip arranged on the top surface of the substrate, an encapsulant arranged on the top surface of the substrate and covering the LED chip, and an optical element arranged over the encapsulant. The optical element includes a light input surface adjacent to the encapsulant and a light output surface opposite to the light input surface. The refractive index of the optical element is larger than that of the encapsulant. 1. An LED device comprising:a substrate;an LED chip arranged on the substrate;an encapsulant covering the LED chip; andan optical element arranged on the encapsulant, the optical element comprising a light input surface adjacent to the encapsulant and a light output surface opposite to the light input surface, the refractive index of the encapsulant being larger than that of the optical element.2. The LED device of claim 1 , wherein the light input surface is convex and protrudes towards the LED chip.3. The LED device of claim 2 , wherein the light input surface is aspheric.4. The LED device of claim 1 , wherein the optical element is just located above the LED chip.5. The LED device of claim 1 , wherein the light output surface is a rugged surface and has a plurality of micro-structures thereon.6. The LED device of claim 1 , further comprising a first electrode and a second electrode extend from a top surface of the substrate to a bottom surface of the substrate claim 1 , the LED chip being arranged on the first electrode and the second electrode.7. The LED device of claim 1 , wherein an upper surface of the encapsulantis is recessed downwardly to define a concave portion claim 1 , the optical element being received in the concave portion.8. An LED device comprising:a substrate having a top surface;an LED chip arranged on the top surface of the substrate;an encapsulant arranged on the top surface of the substrate and covering the LED chip; andan optical element arranged on the encapsulant, ...

LIGHT EMITTING DIODE ASSEMBLY HAVING A DEFORMABLE LENS

A light emitting diode assembly includes a base, a light emitting chip mounted on the base, an elastic lens covering the light emitting chip, two rotation members rotatably arranged on the base, and two stopper poles fixed on the base. The two rotation members are capable of driving the elastic lens to rotate with respect to the two stopper poles. The stopper poles compress the elastic lens to cause the elastic lens to deform resiliently when the elastic lens is rotated by the rotation members to engage with the stopper poles. 1. A light emitting diode assembly , comprising:a base;a light emitting chip mounted on the base;an elastic lens covering the light emitting chip;two rotation members rotatably arranged on the base; andtwo stopper poles fixed on the base, wherein the two rotation members are capable of driving the elastic lens to rotate with respect to the two stopper poles, and the stopper poles compress the elastic lens to cause the elastic lens to deform resiliently when the elastic lens is rotated by the rotation members to engage with stopper poles.2. The light emitting diode assembly of claim 1 , wherein the two rotation members are arranged at two opposite sides of the light emitting chip claim 1 , and apart from and facing towards each other.3. The light emitting diode assembly of claim 1 , wherein the two stopper poles are arranged at two opposite sides of the two rotation members.4. The light emitting diode assembly of claim 1 , wherein the two stopper poles each have a height claim 1 , along a direction away from and perpendicular to the base claim 1 , no less than that of the elastic lens.5. The light emitting diode assembly of claim 1 , wherein the two stopper poles each have a column shape.6. The light emitting diode assembly of claim 1 , wherein the two stopper poles are both perpendicular to the base.7. The light emitting diode assembly of claim 1 , wherein the lens is made of transparent and resilient material.8. The light emitting diode ...

LIGHT EMITTING DIODE LAMP HAVING VARIABLE LIGHT FIELD

A light emitting diode lamp includes a lamp body, a light emitting diode arranged on the lamp body, and a lamp cover to cover the light emitting diode. The lamp cover includes a lens in front of the light emitting diode to modulate the light from the light emitting diode. The light emitting diode lamp further includes a driver and an adjusting device. The driver is formed between the lamp body and a lamp cover. The adjusting device controls the driver to adjust a distance between the lens and the light emitting diode, whereby a light filed of the light from the light emitting diode is adjustable. 1. A light emitting diode lamp , comprising:a lamp body;a light emitting diode arranged on the lamp body;a lamp cover to cover the light emitting diode, the lamp cover comprising a lens in front of the light emitting diode, light from the light emitting diode being modulated by the lens;a driver; andan adjusting device, which controls the driver to adjust a distance between the lens and the light emitting diode.2. The light emitting diode lamp of claim 1 , wherein the lens is convex.3. The light emitting diode lamp of claim 1 , wherein the lens is concave.4. The light emitting diode lamp of claim 1 , wherein the driver is formed between the lamp cover and the lamp body.5. The light emitting diode lamp of claim 4 , wherein the driver comprises a stepping motor claim 4 , a sleeve and a shaft rotatable with the stepping motor and threadedly engaging in the sleeve.6. The light emitting diode lamp of claim 5 , wherein the shaft comprises an outer thread on an outer surface thereof claim 5 , and the sleeve comprises an inner thread on an inner surface thereof claim 5 , the stepping motor rotates the shaft to screw in or screw out of the sleeve.7. The light emitting diode lamp of claim 6 , wherein the stepping motor is fixed to the lamp body claim 6 , and the sleeve is fixed to the lamp cover.8. The light emitting diode lamp of claim 6 , wherein the stepping motor is fixed to the ...

SERVER WITH VOLTAGE TEST SYSTEM

A server includes a motherboard, a first test unit, and an indication device. The first test unit is connected to a first voltage terminal of the motherboard to receive a first voltage. The first test unit determines whether the received first voltage is within a range between a first predetermined voltage and a second predetermined voltage. If the first voltage is not within the range between the first predetermined voltage and the second predetermined voltage, the indication device indicates that the first voltage is abnormal. 1. A voltage test system for a motherboard , the voltage test system comprising:a first comparator comprising an inverting terminal to receive a first predetermined voltage, a non-inverting terminal connected to a first voltage terminal of the motherboard to receive a first voltage, and an output terminal, wherein the first comparator compares the first predetermined voltage with the first voltage, and outputs a first comparison signal;a second comparator comprising a non-inverting terminal to receive a second predetermined voltage, an inverting terminal connected to the first voltage terminal to receive the first voltage, and an output terminal, wherein the second comparator compares the second predetermined voltage with the first voltage, and outputs a second comparison signal;a first OR gate comprising a first input terminal connected to the output terminal of the first comparator to receive the first comparison signal, a second input terminal connected to the output terminal of the second comparator to receive the second comparison signal, and an output terminal; andan indication device connected to the output terminal of the first OR gate;wherein when the first voltage is not within a range between the first and second predetermined voltages, the first OR gate outputs a first control signal to start the indication device to denote that the first voltage is abnormal.2. The voltage test system of claim 1 , further comprising a third ...

BACKLIGHT MODULE AND LIQUID CRYSTAL DISPLAY USING THE SAME

A backlight module includes a mounting plate and plural light-emitting diodes mounted on the mounting plate. The mounting plate includes plural ridges. Each of the ridges is strip-shaped and includes two mounting walls each extending inclinedly and upwardly from a corresponding connecting portion. An obtuse angle is formed between each of the mounting walls and the corresponding connecting portion. The light-emitting diodes are mounted on the mounting walls of the ridges, whereby the light-emitting diodes are tilted relative to connecting portions. The present disclosure further discloses a liquid crystal display using the backlight module. The light-emitting diodes face upwardly and inclinedly toward a liquid display screen of the display when the backlight module is located below the screen. 1. A backlight module comprising:a mounting plate comprising a plurality of ridges, each of the ridges comprising two mounting walls each extending inclinedly and upwardly from a corresponding connecting portion, an obtuse angle being formed between each of the mounting walls and the corresponding connecting portion; anda plurality of light-emitting diodes mounted on the mounting walls of the ridges, whereby the light-emitting diodes are tilted upwardly relative to the connecting portions.2. The backlight module of claim 1 , wherein the mounting plate is wave-shaped.3. The backlight module of claim 1 , wherein each of the ridges is stripe-shaped and protrudes upwardly in relative to the connecting portions.4. The backlight module of claim 3 , wherein each of the ridges extends along a periphery of a trapezium.5. The backlight module of claim 4 , wherein each of the connecting portions has one of following shapes: flat and arc-shaped.6. The backlight module of claim 1 , wherein each of the ridges further comprises a top wall connecting top ends of the two mounting walls thereof claim 1 , and the top wall has one of following shapes: flat and arc-shaped.7. The backlight module ...

BACKLIGHT MODULE HAVING OPTCIAL FIBER

A backlight module includes a back cover, a light source located on the back cover, an optical fiber located on the back cover and over the light source and having a light-incident hole facing the light source and a plurality of light-emergent windows opposite to the light-incident hole. A plurality of light shutters correspondingly covers the light-emergent windows. A controlling device is provided for controlling the open and close of the light shutters. Light emitted from the light source and entering the optical fiber is permitted to leave the optical fiber from the light-emergent windows whose light shutters are opened. The light is not permitted to leave the optical fiber from the light-emergent windows whose light shutters are closed. 1. A backlight module comprising:a back cover;a light source located in the back cover;an optical fiber located on the back cover and over the light source, the optical fiber having a light-incident hole facing the light source and a plurality of light-emergent windows opposite to the light-incident hole;a plurality of light shutters correspondingly covering the light-emergent windows; anda controlling device being configured for controlling the light shutters to open or close, wherein light emitted from the light source and entering the optical fiber is permitted to leave the optical fiber via the light-emergent windows whose light shutters are opened and not permitted to leave the optical fiber via the light-emergent windows whose light shutters are closed.2. The backlight module as described in claim 1 , wherein the light-incident hole is defined in a bottom face of the optical fiber claim 1 , and the light-emergent windows are defined in a top face of the optical fiber.3. The backlight module as described in claim 2 , wherein the top face of the optical fiber is larger than the bottom face of the optical fiber.4. The backlight module as described in claim 2 , wherein the optical fiber has a configuration like an inverted ...

BLADE CLIP

A clip to connect a blade to a rotor disk, the blade with a root and a tip in a spanwise direction, and a leading edge and a trailing edge in a chordwise direction, the root with a bottom surface, includes a locking mechanism shaped to engage a complementary slot extending into the bottom surface of the blade root in the spanwise direction; a support connected to the locking mechanism extending the length of the bottom surface of the root in the chordwise direction; and first and second arms extending radially inward converging in an axial direction so that the arms are closer at their distal ends to engage the rotor disk. 1. A clip to connect a blade to a rotor disk , the blade with a root and a tip in a spanwise direction , and a leading edge and a trailing edge in a chordwise direction , the root with a bottom surface , the clip comprising:a locking mechanism shaped to engage a complementary slot extending into the bottom surface of the blade root in the spanwise direction;a support connected to the locking mechanism extending the length of the bottom surface of the root in the chordwise direction; andfirst and second arms extending radially inward converging in an axial direction so that the arms are closer at their distal ends to engage the rotor disk.2. The clip of claim 1 , wherein the locking mechanism comprisesa neck connecting to the support; anda head connecting to the neck and extending a greater length in the chordwise direction than the neck.3. The claim of claim 2 , wherein the head has an oval cross-section.4. The clip of claim 2 , wherein the head includes a flat upper surface with rounded sides.5. The clip of claim 2 , wherein the length of the head is about ⅓ of the length of the root in the chordwise direction.6. The clip of claim 1 , wherein first and second arms engage the rotor disk with a tight fit.7. The clip of claim 1 , where the first and second arms have convex inner surfaces.8. The clip of claim 7 , wherein the first and second arms ...

LED MODULE

An LED module comprises an LED and a lens matching with the LED. The lens comprises a light-guiding portion and a plurality of retaining portions protruded from the light-guiding portion. The LED includes a substrate, a first electrode and a second electrode mounted on the substrate. A plurality of through holes is defined in the first electrode and a second electrode, respectively. Each retaining portion includes a rugged portion. The retaining portions are inserted into the through holes correspondingly, and the rugged portion abuts the substrate. Glue is applied between the rugged portion and the substrate. 1. An LED module comprising:an LED;a lens covering the LED, the lens comprising a light-guiding portion over the LED and a plurality of retaining portions protruded downwardly from the light-guiding portion, the LED comprising a substrate, a first electrode and a second electrode mounted on the substrate and an LED chip, a plurality of through holes being defined in the first electrode and the second electrode, respectively, each retaining portion including a rugged portion, the retaining portions being inserted into the through holes correspondingly, and the rugged portions of the retaining portions abutting the substrate, the LED chip being electrically connected to the first and second electrodes; andglue filled in the through holes and in a space between the rugged portions and the substrate to securely connect the retaining portions and the substrate together.2. The LED module as claimed in claim 1 , wherein the rugged portion is formed in a bottom end of each retaining portion claim 1 , the rugged portion comprises a plurality of bulges.3. The LED module as claimed in claim 2 , wherein a receiving hole is defined between neighboring bulges.4. The LED module as claimed in claim 3 , wherein the bulges are in the form of teeth.5. The LED module as claimed in claim 4 , wherein the receiving hole tapers from a bottom end adjacent to the substrate to a top end ...

METHOD FOR MANUFACTURING SUPPORTING BOARDS OF LIGHT EMITTING DIODE MODULES

A method for manufacturing supporting boards of light emitting diode modules comprises the following steps: providing a substrate which defines a plurality of through holes and receiving holes therein; providing an engaging plate which includes a plurality of electrode structures and brackets connecting the electrode structures with a connecting frame, each of the electrode structures forming a receiving cavity and an inserting part; providing a shaping roller assembly whereon the substrate and the engaging plate are wound, stacking the substrate and the engaging plate together, rotating the shaping roller assembly to make the shaping roller assembly press the stacked substrate and engaging plate, such that the through holes of the substrate are received in the receiving cavities of the engaging plate and the inserting parts of the electrode structures are inserted into the receiving holes of the substrate, whereby the supporting boards are formed. 1. A method for manufacturing supporting boards of light emitting diode modules comprising following steps:providing a non-metallic substrate, the substrate defining a plurality of through holes and receiving holes therein;providing a metallic engaging plate, the engaging plate including a plurality of electrode structures and brackets connecting the electrode structures, each of the electrode structures forming a receiving cavity and an inserting part; andproviding a shaping roller assembling, mounting the substrate and the engaging plate on the shaping roller assembly, rotating the shaping roller assembly to stack the substrate and the engaging plate together, and then roller pressing the stacked substrate and engaging plate together, such that the through holes of the substrate are received in the receiving cavities of the engaging plate and the inserting parts of the electrode structures are inserted into the receiving holes of the substrate, whereby a plurality of interconnected supporting boards of light-emitting ...

METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE

A method for manufacturing LED packages includes following steps: providing an engaging frame including a lead frame, electrode structures having first and second electrodes, and defining slots between the electrode structure, each first electrode including a first inserting part and each second electrode including a second inserting part; 1. A method for manufacturing light emitting diode (LED) packages comprising following steps:providing an engaging frame, the engaging frame comprising a lead frame and a plurality of electrode structures enclosed by and connected to the lead frame, and defining a plurality of receiving slots between the electrode structures, each electrode structure comprising a first electrode having a first inserting part and a second electrode having a second inserting part;providing a substrate, the substrate comprising a plurality of insulating parts and defining a plurality of receiving cavities and through holes;engaging the substrate and the engaging frame together to make the through holes of the substrate located at lateral sides of the first inserting parts and the second inserting parts respectively, the insulating parts of the substrate received in the corresponding receiving slots of the engaging frame, the receiving cavities of the substrate receiving the corresponding first inserting parts and the second inserting parts;providing a plurality of LED diodes, and connecting each LED diode electrically to the first electrode and the second electrode respectively at a bottom end of each through hole;forming an encapsulating layer in each through hole to encapsulate the LED chip; andcutting along the first inserting parts and the second inserting parts to make a side of each of the first inserting parts and a side of each of the second inserting parts exposed to an external environment.2. The method of claim 1 , wherein each first inserting part extends upwardly and vertically from a central portion of a top surface of each first ...

LED MODULE

An exemplary LED module includes an LED and a lens covering the LED. The lens includes a light-guiding portion over the LED and retaining portions protruding downwardly from the light-guiding portion. The LED includes a substrate, a first electrode and a second electrode mounted on the substrate, and an LED chip electrically connecting the first electrode and the second electrode respectively. Through holes are defined in the first electrode and the second electrode, respectively. Each retaining portion includes a first rugged portion and a second rugged portion. The retaining portions are inserted into the through holes correspondingly, the first rugged portion connects glue filled in a corresponding through hole, and the second rugged portion abuts the substrate, whereby the lens and the substrate are securely connected together. 1. An LED module comprising:an LED and a lens covering the LED, the LED comprising a substrate, a first electrode and a second electrode mounted on the substrate and an LED chip, a plurality of through holes being defined in the first electrode and the second electrode respectively, the lens comprising a light-guiding portion over the LED and a plurality of retaining portions protruding downwardly from the light-guiding portion, each retaining portion including a first rugged portion and a second rugged portion, the retaining portions being inserted into the through holes correspondingly, and the first rugged portion connecting glue filled in a corresponding through hole, the second rugged portion abutting the substrate.2. The LED module as claimed in claim 1 , wherein a cavity is defined at a bottom end of each retaining portion claim 1 , and two fixing parts are located at opposite sides of the cavity.3. The LED module as claimed in claim 2 , wherein the second rugged portion is formed on a bottom end of each fixing part.4. The LED module as claimed in claim 3 , wherein the first rugged portion is formed on a top surface of the cavity.5 ...

LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

An LED package includes a substrate, a pair of electrodes connected to the substrate, an LED die electrically connected to the electrodes, an encapsulation formed on the substrate to cover the LED die, and a reflective cup surrounding the substrate and the encapsulation. A curved surface is formed on the reflective cup, and abuts against and protrudes towards the encapsulation. The present disclosure also provides a method for manufacturing the LED package described above. 1. An LED package , comprising:a substrate;a pair of electrodes formed on the substrate;an LED die electrically connected to the electrodes;an encapsulation formed on the substrate to cover the LED die; anda reflective cup surrounding the substrate and the encapsulation, wherein the reflective cup comprises a curved surface abutting against and facing towards the encapsulation.2. The LED package of claim 1 , wherein the curved surface is a reflecting surface claim 1 , the reflecting surface is convex and positioned above the substrate and surrounds the LED die with a receiving space defined above the substrate claim 1 , and the reflecting surface protrudes towards the LED die and extends from the substrate upwardly and away from the LED die.3. The LED package of claim 2 , wherein the reflective cup further comprises a connecting surface extending downwardly from the reflecting surface.4. The LED package of claim 3 , wherein the connecting surface surrounds the substrate and is attached to lateral sides of the substrate.5. The LED package of claim 1 , wherein the substrate comprises four sidewalls claim 1 , and a first recess and a second recess are defined in the substrate from one of the sidewalls towards an opposite sidewall.6. The LED package of claim 5 , wherein the substrate further comprises an upper surface and a lower surface connecting the sidewalls claim 5 , and the first recess and the second recess penetrate the upper surface and the lower surface of the substrate.7. The LED package of ...

METHOD FOR MANUFACTURING LED PACKAGE

A method for manufacturing an LED package includes following steps. A plate is provided. The plate defines a plurality of the through holes extending from an upper surface to a bottom surface of the plate. A blue film is attached to the bottom surface of the plate and covers openings of the through holes. The blue film and an inner wall of the plate defining the through hole cooperatively define a groove. Glue doped with phosphor particle is injected into the groove. The phosphor particles are condensed to a bottom surface of the glue adjacent to the blue film. The LED chips are embedded in the grooves and positioned at upper ends of the grooves. Finally, the blue film is removed and the plate is severed to obtain a plurality of individual LED packages each including a corresponding LED chip. 1. A method for manufacturing an LED package , comprising following steps:providing a plate having an upper surface and a bottom surface, the plate defining a plurality of the through holes extending from the upper surface to the bottom surface of the plate, each of the through holes having a first opening in the upper surface and a second opening in the bottom surface;attaching a blue film to the bottom surface of the plate, the blue film covering the second openings of the through holes and cooperatively defining a groove with the an inner wall of the plate defining each of the through holes, the groove being communicated with an outer environment through the first opening;injecting a glue into the groove through the first opening, the glue being doped with phosphor particles;condensing the phosphor particles to a bottom surface of the glue adjacent to the blue film;embedding an LED chip in the groove, the LED chip being positioned at an upper end of the groove; andremoving the blue film and severing the plate to obtain a plurality of individual LED packages.2. The method of claim 1 , wherein the first opening and the second opening of each of the through holes are circular ...

METHOD FOR MANUFACTURING LED PACKAGE

A method of manufacturing an LED package including steps: providing an electrode, the electrode including a first electrode, a second electrode, a channel defined between the first electrode and the second electrode, the first electrode and the second electrode arranged with intervals mutually, a cavity arranged on the first electrode, and the cavity communicating with the channel; arranging an LED chip electrically connecting with the first electrode and the second electrode and arranged inside the cavity; providing a shield covering the first electrode and the second electrode; injecting a transparent insulating material to the cavity via the channel, and the first electrode, the second electrode, and the shield being interconnected by the transparent insulating material; solidifying the transparent insulating material to obtain the LED package. 1. A method of manufacturing an LED package comprising steps:providing an electrode, the electrode including a first electrode, a second electrode, a channel defined between the first electrode and the second electrode, the first electrode and the second electrode arranged with intervals mutually, a cavity arranged on the first electrode, and the cavity communicating with the channel;arranging an LED chip electrically connecting with the first electrode and the second electrode and arranged inside the cavity;providing a shield covering the first electrode and the second electrode;injecting a transparent insulating material to the cavity via the channel, and the first electrode, the second electrode, and the shield being interconnected by the transparent insulating material;solidifying the transparent insulating material to obtain the LED package.2. The method of claim 1 , wherein the shield is a lens claim 1 , the lens covers the electrodes claim 1 , the lens comprises a light emitting surface and a light incident surface claim 1 , a protrusion portion is formed on the light emitting surface claim 1 , a space is formed by ...

LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

An LED package includes adjacent first and second electrodes, first and second extension electrodes protruding sideward from the first and second electrodes, a molded body surrounding the first and second electrodes and an LED die. The molded body forms a reflecting cup located over the first and second electrodes, with each reflecting cup defining a receiving cavity in a top face thereof to receive the LED die. The first and second extension electrodes are exposed from an outer periphery of the molded body. The first electrode has a first bottom face. The second electrode has a second bottom face. The first and second bottom faces of the first and second electrodes are exposed out from a bottom face of the molded body. A method for manufacturing the LED package is also provided. 1. A light emitting diode (LED) package comprising:a first electrode and a second electrode adjacent to the first electrode, wherein the first electrode comprises a first top face and a first bottom face far away from the first top face, and the second electrode comprises a second top face and a second bottom face far away from the second top face;a first extension electrode protruding sideward from the first electrode in a direction away from the second electrode, and a second extension electrode protruding sideward from the second electrode in a direction away from the first electrode;a molded body surrounding and covering the first and second electrodes, the molded body comprising a reflecting cup located over the first and second electrodes, and the reflecting cup defining a receiving cavity in a top face thereof; andan LED die received in the receiving cavity, wherein the LED die is electrically connected to portions of the first and second electrodes exposed in the receiving cavity;wherein the first and second extension electrodes are exposed from an outer periphery of the molded body; andwherein the first and second bottom faces of the first and second electrodes are exposed out from ...

LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

An LED package includes a first electrode, a second electrode adjacent to the first electrode, a molded body surrounding and encapsulating the first and second electrodes, and an LED die mounted on the second electrode. The molded body includes a reflecting cup located over the first and second electrodes and the reflecting cup defines a receiving cavity in a top face to receive the LED die. A first extension electrode protrudes sideward from the first electrode and a second extension electrode protrudes sideward from the second electrode. The first and second extension electrodes are exposed from an outer periphery of the molded body. A method for manufacturing the LED package is also provided. 1. A light emitting diode (LED) package comprising:a first electrode and a second electrode adjacent to the first electrode;a first extension electrode protruding sideward from the first electrode in a direction away from the second electrode, and a second extension electrode protruding sideward from the second electrode in a direction away from the first electrode;a molded body surrounding and encapsulating the first and second electrodes, the molded body comprising a reflecting cup located over the first and second electrodes, the reflecting cup defining a receiving cavity in a top face thereof; andan LED die received in the receiving cavity, wherein the LED die is electrically connected to portions of the first and second electrodes exposed in the receiving cavity;wherein the first and second extension electrodes are exposed from an outer periphery of the molded body and wherein bottom faces of the first and second extension electrodes are located above a bottom face of the molded body.2. The LED package of claim 1 , wherein the first and second electrodes are embedded in the molded body claim 1 , and top faces of the first and second electrodes are partially exposed at a bottom of the receiving cavity.3. The LED package of claim 1 , wherein the reflecting cup has a width ...

SIDE VIEW LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

A side view light emitting diode (LED) package includes an electrode structure, an LED die disposed on the electrode structure and an encapsulation layer covering the LED die. The encapsulation layer includes a light outputting surface. The electrode structure includes a first electrode and a second electrode spaced from each other to define a tortuous gap therebetween. Resin material for forming a substrate of the LED package fills in the gap to interconnect the first and second electrode together. The LED die is electrically connected to the first electrode and the second electrode. The present disclosure also provides a method for manufacturing the side view LED package. 1. A side view light emitting diode (LED) package , comprising:an electrode structure comprising a first electrode and a second electrode spaced from each other, a part of the first electrode extending thorough a border of the second electrode near the first electrode to reach an inside of the second electrode;an LED die electrically connecting with the first electrode and the second electrode;an encapsulation layer covering the LED die, the encapsulation layer comprising a light outputting surface;a substrate interconnecting the first and second electrodes together;wherein a gap between the first electrode and second electrode is filled by the substrate and the gap has a tortuous configuration.2. The side view LED package of claim 1 , wherein the gap comprises two extending sections and a middle section interconnecting the two extending sections claim 1 , the middle section and each of the two extending sections being not parallel.3. The side view LED package of claim 2 , wherein the middle section is perpendicular to the two extending sections.4. The side view LED package of claim 1 , wherein the first electrode comprises a first main body claim 1 , and a first extending portion extending toward the second electrode from one side of the first main body along a horizontal direction.5. The side ...

LIGHT EMITTING DIODE MODULE

An LED module includes a PCB with a first electrode and a second electrode formed thereon, an LED mounted on the PCB, a lens mounted on the PCB and covering the LED. The LED includes a base, an LED die mounted on the base, and a packaging layer arranged on the base and covering the LED die therein. The base is flat. The lens includes a bottom surface, a first light output surface extending from the bottom surface, a second light output surface extending upwardly from a central of the first light output surface and away from the bottom surface, and a reflecting surface recessing downwardly from a top end of the second light output surface and oriented towards the bottom surface. A chamber is defined in the bottom surface to receive the LED therein. 1. A light emitting diode (LED) module comprising:a printed circuit board (PCB), wherein a first electrode and a second electrode are formed on a side of the PCB;an LED mounted on the PCB, the LED comprising a base, an LED die mounted on the base, and a packaging layer arranged on the base and covering the LED die therein, the base being flat; anda lens mounted on the PCB and covering the LED, the lens comprising a bottom surface in which a chamber is defined to receive the LED, a first light output surface extending from a periphery of the bottom surface, a second light output surface extending upwardly from a central of the first light output surface and away from the bottom surface, and a reflecting surface recessing downwardly from a top end of the second light output surface and oriented towards the bottom surface.2. The LED module of claim 1 , wherein the lens has an optical axis OO′ claim 1 , and the lens is symmetrical relative to the optical axis OO′.3. The LED module of claim 2 , wherein the first light output surface is convex claim 2 , an angle between the bottom surface and a tangent plane of any point on the first light output surface is less than 90 degrees.4. The LED module of claim 3 , wherein a distance ...

THIN FILM TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME, ARRAY SUBSTRATE AND DISPLAY DEVICE

The present disclosure provides a thin film transistor and a method for manufacturing the same, an array substrate, and a display device. The thin film transistor includes: an active layer located on one side of the substrate; a first interlayer dielectric layer located on one side of the active layer away from the substrate; a source penetrating through the first interlayer dielectric layer, and connected to the active layer; a second interlayer dielectric layer located on one side of the first interlayer dielectric layer away from the active layer and covering the source; and a drain, wherein the drain comprises a first portion penetrating through the second interlayer dielectric layer and the first interlayer dielectric layer and connected to the active layer. 1. A thin film transistor , comprising:an active layer located on one side of a substrate;a first interlayer dielectric layer located on one side of the active layer away from the substrate;a source penetrating through the first interlayer dielectric layer, and connected to the active layer;a second interlayer dielectric layer located on one side of the first interlayer dielectric layer away from the active layer and covering the source; anda drain, wherein the drain comprises a first portion penetrating through the second interlayer dielectric layer and the first interlayer dielectric layer and connected to the active layer.2. The thin film transistor according to claim 1 , wherein the drain further comprises:a second portion connected to the first portion and located on one side of the second interlayer dielectric layer away from the first interlayer dielectric layer, wherein the second portion is configured to be connected to a first electrode.3. The thin film transistor according to claim 2 , wherein an orthographic projection of the second portion of the drain on the substrate partially overlaps with an orthographic projection of the source on the substrate.4. The thin film transistor according to ...

CIRCUIT AND METHOD FOR WRITING PROGRAM CODES OF BASIC INPUT/OUTPUT SYSTEM

A circuit for writing program codes of a basic input/output system (BIOS) is connected to a main circuit and a BIOS. The BIOS stores a BIOS program code and has a BIOS identifier. The circuit includes a data source connection interface, a judgment trigger module and a write module. The data source connection interface stores an available BIOS program code matching with the BIOS. The judgment trigger module judges whether the BIOS is capable of, after a power-on initialization phase starts, completing loading the BIOS program code and performing system initialization in a preset time. If the BIOS is incapable of completing loading the BIOS program code and performing system initialization within the preset time, the judgment trigger module sends a trigger signal. After receiving the trigger signal, the write module downloads the available BIOS program codes according to the BIOS identifier, and writes to the BIOS, to overwrite the current data. 1. A circuit for writing program codes of a basic input/output system , connected to a main circuit and a basic input/output system of a computer system , wherein the basic input/output system having a memory for storing a BIOS program code , so that the basic input/output system executes the functions , and the basic input/output system has a BIOS identifier , characterized in that , the circuit for writing program codes of a basic input/output system comprises:a data source connection interface, used to acquire an available BIOS program code corresponding to the BIOS identifier;a judgment trigger module, connected to the main circuit, used to judge whether the basic input/output system is capable of, after the power-on initialization phase starts, completing loading the BIOS program code and performing the system initialization within a preset time, wherein if the basic input/output system is incapable of completing loading the BIOS program code and performing the system initialization within the preset time, the judgment ...

PARKING DETECTION METHOD AND DEVICE BASED ON VISUAL DIFFERENCE

A parking detection method based on visual difference includes: obtaining a video frame of a predetermined monitoring area captured by each camera in real time, and labeling the video frame corresponding to each camera with time information of a current moment; determining vehicle information of a to-be-detected vehicle in each video frame labeled with the time information through a predetermined convolutional neural network model; determining feature point information of the to-be-detected vehicle in each video frame according to the vehicle information of the to-be-detected vehicle in each video frame; calculating a position relationship between the to-be-detected vehicle in each video frame and respective corresponding camera, and constructing current three-dimensional coordinates of the to-be-detected vehicle according to the position relationship; and determining a parking status of the to-be-detected vehicle according to the current three-dimensional coordinates of the to-be-detected vehicle. A parking detection device based on visual difference is further provided. 1. A parking detection method based on visual difference , comprising:obtaining a video frame of a predetermined monitoring area captured by each camera in real time, and labeling the video frame corresponding to each camera with time information of a current moment;determining vehicle information of a to-be-detected vehicle in each video frame labeled with the time information through a predetermined convolutional neural network model;determining feature point information of the to-be-detected vehicle in each video frame according to the vehicle information of the to-be-detected vehicle in each video frame;calculating a position relationship between the to-be-detected vehicle in each video frame and respective corresponding camera according to the feature point information, and constructing current three-dimensional coordinates of the to-be-detected vehicle according to the position relationship; ...

LIGHT EMITTING DIODE PACKAGE

An LED package includes a first electrode and a second electrode electrically insulating from the first electrode, an LED chip, two electrically insulating connecting layers, and a reflector. Top surfaces of the first electrode and the second electrode are recessed to define a first receiving space and a second receiving space therein. The LED chip is mounted on the top surface of the first electrode and electrically connects the first electrode and the second electrode. The electrically insulating connecting layers are respectively received in the first receiving space and the second receiving space. The reflector is mounted on top surfaces of the connecting layers and enclosing the LED chip therein. 1. An LED (light emitting diode) package , comprising:a first electrode and a second electrode electrically insulating from the first electrode, top surfaces of the first electrode and the second electrode recessed to define a first receiving space and a second receiving space therein;an LED chip mounted on the top surface of the first electrode and electrically connecting the first electrode and the second electrode;two connecting layers respectively received in the first receiving space and the second receiving space, the connecting layers being electrically insulating; anda reflector mounted on top surfaces of the connecting layers and enclosing the LED chip therein.2. The LED package of claim 1 , wherein bottom ends of the connecting layers are received in the first receiving space and the second space claim 1 , and top ends of the connecting layers are beyond the top surfaces of the first electrode and the second electrode.3. The LED package of claim 2 , wherein the top surfaces of the connecting layers are coplanar and beyond the top surfaces of the first electrode and the second electrode.4. The LED package of claim 3 , wherein a distance between the top surface of the connecting layer and the top surface of the first electrode is less than or equal to 80 ...

Bluetooth earphone system, and earphone case for storing and charging Bluetooth earphones

An earphone case for storing and charging Bluetooth (BT) earphones includes: an earphone container for accommodating a pair of BT earphones; a BT circuit for communicating with the pair of BT earphones through BT communication after the pair of BT earphones is taken out; a microphone for receiving outside sound to generate a microphone signal after the pair of BT earphones is taken out; an audio circuit for generating an audio signal according to the microphone signal and providing the audio signal for the pair of BT earphones through the BT circuit in a predetermined mode; a user interface for generating a control signal according to user control after the pair of BT earphones is taken out, and providing the control signal for the pair of BT earphones through the BT circuit; and a control circuit for controlling the interaction between the earphone case and the pair of BT earphones. 1. A Bluetooth (BT) earphone system , comprising:a pair of BT earphones; andan earphone case for storing and charging the pair of BT earphones, the earphone case comprising:an earphone container for accommodating the pair of BT earphones, the earphone container including multiple case terminals configured to be coupled to multiple earphone terminals of the pair of BT earphones;a rechargeable battery;a charging circuit configured to charge the pair of BT earphones with power of the rechargeable battery when the earphone container accommodates the pair of BT earphones;a BT circuit configured to be paired with the pair of BT earphones when the earphone container accommodates the pair of BT earphones, and further configured to communicate with the pair of BT earphones through BT communication after the pair of BT earphones is taken out from the earphone container;a microphone circuit configured to receive outside sound and thereby generate a microphone signal after the pair of BT earphones is taken out from the earphone container;an audio circuit configured to generate an audio signal ...

LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING SAME

An LED packaging includes a substrate having a top surface and a bottom surface opposite to the top surface, a recess defined in the top surface, an LED mounted on the top surface of the substrate, a zener diode received in the recess, and a reflecting layer formed in the recess and enclosing the zener diode therein. 1. A light emitting diode (LED) packaging comprising:a substrate having a top surface and a bottom surface opposite to the top surface, a recess defined in the top surface;an LED mounted on the top surface of the substrate;a zener diode received in the recess; anda reflecting layer formed in the recess and the reflecting layer enclosing the zener diode therein.2. The LED package of claim 1 , wherein the substrate comprises a first electrode claim 1 , a second electrode claim 1 , and an insulating layer sandwiched between the first electrode and the second electrode.3. The LED package of claim 2 , wherein the substrate is cuboidal claim 2 , the second electrode is cuboidal and located at a corner of the substrate claim 2 , the first electrode has an L-shaped configuration claim 2 , and the insulating layer has an L-shaped configuration to insulate the first electrode and the second electrode.4. The LED package of claim 3 , wherein the recess extends through a top portion of the substrate along a width direction of the substrate to expose part of the first electrode claim 3 , the second electrode and the insulating layer.5. The LED package of claim 3 , wherein the LED is mounted on the first electrode and electrically connects the first electrode and the second electrode via wires.6. The LED package of claim 3 , wherein the zener diode is arranged on the second electrode and electrically connects the first electrode and the second electrode.7. The LED package of claim 1 , wherein a top surface of the reflecting layer is coplanar with the top surface of the substrate.8. The LED package of claim 1 , wherein the reflecting layer is opaque and comprises ...

LIGHT EMITTING DIODE PACKAGE HAVING ZENER DIODE COVERED BY REFLECTIVE MATERIAL

An exemplary light emitting diode package includes a substrate comprising a first electrode, a second electrode and an insulation layer electrically insulating the first electrode from the second electrode; a light emitting diode is located on the substrate, and electrically connects with the first and second electrodes; a zener diode is located on the substrate, and electrically connects with the first and second electrodes; and a reflecting layer is formed on the zener diode to reflect light emitted from the light emitting diode and toward the zener diode. The disclosure also relates to a method for manufacturing the light emitting diode package. 1. A light emitting diode package , comprising:a substrate comprising a first electrode, a second electrode and an insulation layer insulating the first electrode with the second electrode;a light emitting diode located on the substrate, and electrically connecting with the first and second electrodes;a zener diode located on the substrate, and electrically connecting with the first and second electrodes, the zener diode and the light emitting diode being located on a same side of the substrate; anda reflecting layer formed on and covering the zener diode to reflect light emitted from the light emitting diode and toward the zener diode.2. The light emitting diode package of claim 1 , wherein the reflecting layer covers an entirety of the zener diode therein.3. The light emitting diode package of claim 2 , wherein the reflecting layer contains reflective particles in silicone glue.4. The light emitting diode package of claim 3 , wherein the reflective particles are TiOor SiOparticles.5. The light emitting diode package of claim 1 , wherein the reflecting layer contains reflective particles.6. The light emitting diode package of claim 5 , wherein the reflective particles are TiOor SiOparticles.7. The light emitting diode package of claim 1 , wherein the light emitting diode is located on the first electrode and the zener ...

FLIP CHIP LIGHT EMITTING DIODE PACKAGING STRUCTURE

A flip chip light emitting diode (LED) packaging structure, including a substrate, an LED chip including a P electrode and a N electrode. A protruding platform is formed in a center of the substrate. The protruding platform includes a first connecting portion and a second connecting portion electrically insulating from each other. The P electrode and the N electrode is conductively fixed to the protruding platform by solder, and a bottom edge of the P electrode and the N electrode are beyond a top edge of the protruding platform. 1. A flip chip light emitting diode (LED) structure comprising:a substructure having a first side and a second side opposite the first side, with a protruding platform extending out from the first substrate side; and a light emitting diode supported by, and coupled to, the protruding platform, the light emitting diode having a P electrode and an N electrode;wherein, the protruding platform has a top surface with a first edge and a second edge opposite the first edge, a first connecting portion along the first edge, a second connecting portion along the second edge and an insulating portion electrically insulating the first connecting portion from the second connecting portion;wherein, the P electrode rests on a portion of the top protruding platform surface with a portion of the P electrode extending away from the first top surface edge and the P electrode is electrically connected to the first connection portion; andwherein, the N electrode rests on a portion of the top protruding platform surface with a portion of the N electrode extending away from the second top surface edge and the N electrode is electrically connected to the second connection portion.2. The flip chip LED packaging structure of claim 1 , wherein an insulation portion is extends through the substrate claim 1 , the insulation portion extends from a bottom end of the substrate to a top end of the protruding platform.3. The flip chip LED packaging structure of claim 2 , ...

OPTICAL CABLE IDENTIFICATION TOOL

Systems and methods are provided for determining whether an optical cable matches a port on a switch device. The present disclosure can provide for a switch device which includes a cable identification tool. The cable identification tool can be configured to receive a port configuration table from a management device. The switch device can then obtain features of at least one cable attached to a port of the switch device. The switch device can then compare the obtained features with a table entry in the port configuration table to yield a comparison result. The table entry can correspond to the port to which the at least one cable is attached. Based on the comparison result, the switch device can generate one or more notifications. The notifications can indicate a match status of the at least one cable to the port. 1. A switch device , comprising:a plurality of ports; and receive a port configuration table from a management device, the port configuration table comprising a plurality of table entries, each of the plurality of table entries being associated with a corresponding port of the plurality of ports;', 'obtain features of at least one cable coupled to the switch device;', 'compare the obtained features of a first cable of the at least one cable with a first table entry of the plurality of table entries in the port configuration table to yield a comparison result, wherein the first table entry corresponds to a port of the plurality of ports coupled to the first cable of the at least one cable, and wherein the comparison result is indicative that the obtained features of the first cable match the first table entry; and', 'based on the comparison result being indicative that the obtained features of the first cable match the first table entry, generate one or more notifications that indicate a match status of the first cable to the port coupled to the first cable., 'a cable identification tool, wherein the cable identification tool is configured to2. The switch ...

LIGHT EMITTING DIODE PACKAGE

A light emitting diode (LED) package includes a substrate, a first electrode and a second electrode mounted on opposite sides of the substrate, an LED chip mounted on a top surface of one of the electrodes and electrically connecting the first electrode and the second electrode by wire bonding, and a reflecting cup enclosing an outer periphery of the first electrode and the second electrode to expose top surfaces of the first electrode and the second electrode and bottom surfaces of the first electrode and the second electrode. 1. A light emitting diode (LED) package comprising:a substrate;a first electrode and a second electrode mounted on opposite sides of the substrate;an LED chip mounted on a top surface of one of the electrodes and electrically connecting the first electrode and the second electrode by wire bonding; anda reflecting cup enclosing an outer periphery of the first electrode and the second electrode to expose top surfaces of the first electrode and the second electrode and bottom surfaces of the first electrode and the second electrode.2. The LED package of claim 1 , wherein the reflecting cup comprises a contacting surface which firmly contacts the outer periphery of the first electrode and the outer periphery of the second electrode claim 1 , a transition surface extending outwardly from a top end of the contacting surface claim 1 , and a reflecting surface extending upwardly and slantwise from the transition surface claim 1 , wherein the transition surface and the reflecting surface cooperatively define a receiving space therebetween.3. The LED package of claim 2 , wherein a bore diameter of the receiving space decreases from top to bottom.4. The LED package of claim 2 , wherein a package layer is filled in the receiving space to envelope the LED chip therein.5. The LED package of claim 2 , wherein the top surfaces of the first electrode and the second electrode are coplanar with the transition surface.6. The LED package of claim 5 , wherein the ...

PROVIDING SOCIAL NETWORK CONTENT IN GAMES

An apparatus and method for providing social network content in an online game is disclosed herein. Content is obtained from a social network site and is displayed within the game. The game also provides a mechanism for the user of the game to generate content to the posted within the social network from within the game. Such generated content is automatically posted in the social network for a recipient specified by the user. 1. A method for providing social network content in a computer-implemented game , the method comprising:retrieving, using a processor, content associated with a user of the game from a social network of the user, the content including a message generated by another user in the social network of the user;displaying at least a portion of the content within the game when the user plays the game; andproviding an element in the game for the user to reply to the displayed content from within the game.2. The method of claim 1 , further comprising receiving an indication to actuate the element claim 1 , and displaying a reply interface in response to the received indication.3. The method of claim 1 , further comprising automatically transmitting to the social network a reply to the message generated by the user from within the game.4. The method of claim 3 , further comprising automatically posting the reply to a portion of the social network associated with and accessed by the another user.5. The method of claim 1 , wherein the social network comprises a microblogging network claim 1 , and the content comprises content posted in real-time or near real-time on the social network.6. The method of claim 1 , wherein the game comprises an online game.7. The method of claim 1 , wherein the displaying of the portion of the content comprises displaying the content associated with non-player characters (NPCs) included in the game.8. The method of claim 1 , wherein the game includes a first non-player character and a second non-player character claim 1 , the ...

ARRAY SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE

The present disclosure provides an array substrate, a method for manufacturing the same, and a display device. The array substrate includes a base substrate, and gate lines and data lines arranged on the base substrate to define a plurality of pixel regions, and a diffuse reflection layer arranged in the plurality of pixel regions, in which a surface of the diffuse reflection layer facing a light emitting side of the array substrate is uneven. 1. An array substrate , comprising a base substrate , gate lines and data lines arranged on the base substrate to define a plurality of pixel regions , and a diffuse reflection layer arranged in the plurality of pixel regions , wherein a surface of the diffuse reflection layer facing a light emitting side of the array substrate is uneven.2. The array substrate of claim 1 , further comprising a light shielding layer for sheltering a thin film transistor of the array substrate from backlight.3. The array substrate of claim 2 , wherein the diffuse reflection layer and the light shielding layer are arranged on a same layer and made of a same material.4. The array substrate of claim 1 , wherein an orthogonal projection of the diffuse reflection layer onto the base substrate at least partially overlaps an orthogonal projection of a corresponding one of the plurality of pixel regions onto the base substrate.5. The array substrate of claim 4 , wherein the array substrate is an array substrate of a liquid crystal display device.6. The array substrate of claim 1 , further comprising an insulating layer arranged on the base substrate claim 1 , wherein the insulating layer is arranged on a side of the diffuse reflection layer proximate to the base substrate claim 1 , and a surface of the insulating layer facing a side of the diffuse reflection layer is uneven.7. The array substrate of claim 1 , wherein a material of the diffuse reflection layer comprises at least one of Ag claim 1 , Au claim 1 , Mo claim 1 , Al claim 1 , and Cu.8. The ...

BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHODS OF FORMING THE SAME

A method of forming a bonded assembly includes providing a first semiconductor die containing and first metallic bonding structures and a first dielectric capping layer containing openings and contacting distal horizontal surfaces of the first metallic bonding structures, providing a second semiconductor die containing second metallic bonding structures, disposing the second semiconductor die in contact with the first semiconductor die, and annealing the second semiconductor die in contact with the first semiconductor die such that a metallic material of at least one of the first metallic bonding structures and the second metallic bonding structures expands to fill the openings in the first dielectric capping layer to bond at least a first subset of the first metallic bonding structures to at least a first subset of the second metallic bonding structures. 1. A method of forming a bonded assembly , comprising:providing a first semiconductor die, wherein the first semiconductor die comprises first semiconductor devices, first interconnect-level dielectric material layers embedding first metal interconnect structures and first metallic bonding structures, and a first dielectric capping layer containing openings and contacting distal horizontal surfaces of the first metallic bonding structures;providing a second semiconductor die, wherein the second semiconductor die comprises second semiconductor devices, second interconnect-level dielectric material layers embedding second metal interconnect structures, and second metallic bonding structures;disposing the second semiconductor die in contact with the first semiconductor die; andannealing the second semiconductor die in contact with the first semiconductor die such that a metallic material of at least one of the first metallic bonding structures and the second metallic bonding structures expands to fill the openings in the first dielectric capping layer to bond at least a first subset of the first metallic bonding ...

METHOD AND DEVICE FOR MAGNETIC RESONANCE IMAGING

A mode matrix processor of a magnetic resonance imaging system includes an input unit, an output unit, an operation unit, and a control unit, wherein the input unit is used for receiving a number of digital magnetic resonance signals; the operation unit is used for performing a linear combination operation on the plurality of digital magnetic resonance echo signals, to obtain at least one digital mode signal; the output unit is used for sending the at least one digital mode signal; and the control unit controls, according to the number of the digital magnetic resonance signals, the operation unit to perform the linear combination operation. The mode matrix processor of a magnetic resonance imaging system according to a specific embodiment of the present invention has desirable portability between different systems. The mode matrix processor of a magnetic resonance imaging system according to a specific embodiment of the present invention can improve the compatibility of coils between different systems. 1. A mode matrix processor of a magnetic resonance imaging system , wherein the mode matrix processor comprises an input unit , an output unit , an operation unit , and a control unit , wherein the input unit is used for receiving a plurality of digital magnetic resonance signals; the operation unit is used for performing a linear combination operation on the plurality of digital magnetic resonance echo signals , to obtain at least one digital mode signal; the output unit is used for sending the digital mode signal; and the control unit controls , according to the number of the digital magnetic resonance signals , the operation unit to perform the linear combination operation.2. The mode matrix processor as claimed in claim 1 , characterized in that the operation unit comprises a synthesis module claim 1 , a power splitter module claim 1 , and a phase shift module claim 1 , the synthesis module being used for performing an addition operation in the linear combination ...

DEEPWATER JACKET DESIGN METHOD

A new jacket design method is disclosed, especially for deepwater water heavy jacket applications. The method utilizes a special type of air bags, called Ship Launching Air Bags (SLAB), to provide low cost temporary buoyancy used for jacket installation purpose only. A designer only needs to satisfy the jacket stiffness for the resistance of environmental and gravity loads without the consideration of jacket reserve buoyancy. The required jacket reserve buoyancy could be increased with the utilization of temporally attached SLABs during the jacket installation. 1. A method for designing a jacket of an offshore fixed platform , the jacket having a plurality of jacket members including main leg members , diagonal members and horizontal members , the method comprising:preparing a plurality of non-steel buoyancy tank groups, wherein each buoyancy tank group comprises a plurality of air bags; andinstalling the prepared plurality of non-steel buoyancy tank groups on the jacket;wherein more than 80 percent of jacket members between water surface and 40 meters (about 130 ft) below water surface are slender members with D (member diameter)/t (member wall thickness) less than or equal to 30.2. The method according to claim 1 , wherein each of the air bag is made of nature rubber and multiple layers of polyester nets bonded together through a vulcanized process.3. The method according to claim 1 , wherein each of the air bag comprises a middle tubular section and two cone sections at each end.4. The method according to claim 3 , wherein each of the air bag comprises a plurality of rows of side ring pairs longitudinally attached to the sides of the air bag middle section.5. The method according to claim 4 , wherein the act of preparing a plurality of non-steel buoyancy tank groups comprises:dividing a plurality of air bags into a plurality of groups, each group comprising two or more air bags; andforming a sheet of air bags for each group by connecting adjacent air bags within ...

LIGHT EMITTING DIODE PACKAGE

An LED package includes a first electrode, a second electrode electrically insulated from the first electrode, a reflecting cup connecting the first electrode and the second electrode, and an LED chip. The first electrode includes an elongated first main portion and a first connecting portion bending downwardly from an end of the first main portion. The second electrode includes an elongated second main portion and a second connecting portion bending downwardly from an end of the second main portion. The LED chip is received in reflecting cup. The first main portion and the second main portion are embedded into the receiving cup, the end of the first main portion and the end of the second main portion extend outside the reflecting cup, and the first connecting portion and the second connecting portion are located outside the receiving cup. 1. An LED (light emitting diode) package , comprising:a first electrode comprising an elongated first main portion and a first connecting portion bending downwardly from an end of the first main portion;a second electrode electrically insulated from the first electrode, the second electrode comprising an elongated second main portion and a second connecting portion bending downwardly from an end of the second main portion;a reflecting cup having a receiving groove and connecting the first electrode and the second electrode; andan LED chip received in the receiving groove and electrically connecting the first electrode and the second electrode;wherein the first main portion and the second main portion are embedded into the receiving cup, the end of the first main portion and the end of the second main portion extend outside the reflecting cup, and the first connecting portion and the second connecting portion are located outside the receiving cup.2. The LED package of claim 1 , wherein two opposite lateral sides of the end of the first main portion are recessed inwardly to form two first recessed portions claim 1 , respectively.3. ...

LIGHT EMITTING DIODE PACKAGE

An LED package includes a first electrode, a second electrode, a reflecting cup connecting the first electrode and the second electrode, and an LED chip. The first electrode includes a first main portion and a first connecting portion extending outwardly from the first main portion. The first connecting portion has a first connecting face away from the first main portion. The second electrode includes a second main portion and a second connecting portion extending outwardly from the second main portion. The second connecting portion has a second connecting face away from the second main portion. The first main portion and the second main portion are embedded into the receiving cup, and the first connecting face of the first connecting portion and the second connecting face of the second connecting portion are exposed outside the receiving cup. 1. An LED (light emitting diode) package , comprising:a first electrode, the first electrode comprising a first main portion and a first connecting portion extending outwardly from the first main portion, and the first connecting portion having a first connecting face away from the first main portion;a second electrode electrically insulated from the first electrode, the second electrode comprising a second main portion and a second connecting portion extending outwardly from the second main portion, and the second connecting portion having a second connecting face away from the second main portion;a reflecting cup having a receiving groove and connecting the first electrode and the second electrode; andan LED chip received in the receiving groove and electrically connecting the first electrode and the second electrode;wherein the first main portion of the first electrode and the second main portion of the second electrode are embedded into the receiving cup, and the first connecting face of the first connecting portion and the second connecting face of the second connecting portion are exposed outside the receiving cup.2. The ...

SAS AUTOMATIC ZONING MECHANISM

A system and method for automatic serial-attached SCSI (SAS) zoning configuration. The SAS based architecture includes a local area network and a SAS system having a local area network port coupled to the local area network. The SAS system includes a plurality of SAS target devices, and an expander having a series of input ports and a plurality of target ports. The target ports are coupled to the SAS target devices. A management tool is coupled to the local area network. The management tool is operable to detect a cable connection between a first host device and an input port of the series of input ports. The management tool automatically configures SAS zones to assign target devices to the first host device. 1. A system that allows automatic serial-attached SCSI (SAS) zoning configuration , the system comprising:a local area network;a SAS system having a local area network port coupled to the local area network, a plurality of SAS target devices, and an expander having a plurality of input ports and a plurality of target ports, wherein at least some of the target ports are coupled to the SAS target devices; anda management tool coupled to the local area network, wherein the management tool is operable to detect a cable connection between a first host device and an input port of the plurality of input ports; and automatically configure a SAS zone to assign target devices to the first host device.2. The system of claim 1 , wherein the first host device is a server.3. The system of claim 1 , wherein at least one of the target devices is a storage device.4. The system of claim 1 , wherein the first host device includes a baseboard management controller operable to send a cable ID to the management tool via the local area network claim 1 , when the first host device is connected to the SAS system.5. The system of claim 4 , wherein the management tool is operable to detect the status of the connection between the first host device and an input port of the expander via ...

ARRAY SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE

Embodiments of the present disclosure provide an array substrate, a method for manufacturing the same, and a display device. The array substrate includes a base substrate and the array substrate includes a plurality of pixel units. In each of the plurality of pixel units, the array substrate includes a thin film transistor and a storage capacitor disposed above the base substrate, the storage capacitor includes a metal layer, an intermediate layer, and a reflective layer disposed in a stacked manner, the metal layer being adjacent to the base substrate. The array substrate further includes a common electrode layer disposed on a side of the storage capacitor facing away from the base substrate, the reflective layer is electrically connected to the common electrode layer, and the metal layer is electrically connected to an active layer of the thin film transistor. 1. An array substrate , comprising a base substrate , wherein the array substrate comprises a plurality of pixel units ,wherein, in each of the plurality of pixel units, the array substrate comprises a thin film transistor and a storage capacitor disposed above the base substrate,wherein the storage capacitor comprises a metal layer, an intermediate layer, and a reflective layer disposed in a stacked manner, the metal layer being adjacent to the base substrate, andwherein the array substrate further comprises a common electrode layer disposed on a side of the storage capacitor facing away from the base substrate, the reflective layer is electrically connected to the common electrode layer, and the metal layer is electrically connected to an active layer of the thin film transistor.2. The array substrate according to claim 1 , wherein the thin film transistor comprises the active layer claim 1 , a gate insulating layer claim 1 , a gate electrode layer claim 1 , an interlayer dielectric layer and a source-drain metal layer stacked sequentially on a side of the base substrate claim 1 , and the active layer is ...

Bonded assembly formed by hybrid wafer bonding using selectively deposited metal liners

A nucleation suppression layer including a self-assembly material can be formed on a surface of a bonding dielectric layer without depositing the self-assembly material on physically exposed surfaces of first metal bonding pads of a first semiconductor die. Metallic liners including a second metal can be formed on the physically exposed surfaces of the metal bonding pads without depositing the second metal on the nucleation suppression layer. The first semiconductor die is bonded to a second semiconductor die by inducing metal-to-metal bonding between mating pairs of the first metal bonding pads and second metal bonding pads of the second semiconductor die.

LED PACKAGE

The present disclosure provides a light emitting diode die which includes a substrate; an N type semiconductor layer, an active layer, and a P type semiconductor layer formed on the substrate in sequence; at least one recess, and a pair of electrodes. The recess extends to the N type semiconductor layer. The insulating layer covers the all of side surfaces of the N type semiconductor layer, the active layer, the P type semiconductor layer, and covers top of the P type semiconductor layer except an opening on the P semiconductor layer. One of the electrodes is filled in the recess and electrically connected to the N type semiconductor layer, and the other one of the electrodes is connected to the P type semiconductor layer in the opening. The present disclosure further provides an LED package having the LED die and a method for manufacturing the same. 1. A light emitting diode (LED) die comprising:a substrate;an N type semiconductor layer formed on the substrate;an active layer formed on the N type semiconductor layer;a P type semiconductor layer formed on the substrate;at least one recess penetrating through the P type semiconductor layer and the active layer and extending to the N type semiconductor layer;an insulating layer covering the all of side surfaces of the N type semiconductor layer, the active layer, the P type semiconductor layer, and covering a top of the P type semiconductor layer except an opening on the P semiconductor layer; anda pair of electrodes, one of the pair of electrodes filling the recess and being electrically connected to the N type semiconductor layer, and the other one of the pair of electrodes connected to the P type semiconductor layer in the opening.2. The LED die of claim 1 , wherein the recess is recessed from top of the P type semiconductor layer to the N type semiconductor layer to expose a part of the N type semiconductor layer for electrically connecting to one of the electrodes.3. The LED die of claim 1 , wherein there are two ...

MULTI-MEMBER BLUETOOTH DEVICE CAPABLE OF DYNAMICALLY SWITCHING OPERATION MODE

A multi-member Bluetooth device for communicating data with a remote Bluetooth device is disclosed including: a main Bluetooth circuit and an auxiliary Bluetooth circuit. In the period during which the auxiliary Bluetooth circuit operates at a sniffing mode, the auxiliary Bluetooth circuit sniffs packets transmitted from the remote Bluetooth device while the main Bluetooth circuit receives packets issued from the remote Bluetooth device, and the auxiliary Bluetooth circuit switches from the sniffing mode to a relay mode if the throughput of packets sniffed by the auxiliary Bluetooth circuit is lower than a predetermined threshold. In the period during which the auxiliary Bluetooth circuit operates at the relay mode, the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device and forwards the received packets to the auxiliary Bluetooth circuit, and the auxiliary Bluetooth circuit does not sniff packets issued from the remote Bluetooth device. 1100102100. A multi-member Bluetooth device () utilized to operably conduct data transmission with a remote Bluetooth device () , the multi-member Bluetooth device () comprising:{'b': '110', 'claim-text': [{'b': '111', 'a first Bluetooth communication circuit ();'}, {'b': 113', '111, 'a first packet parsing circuit (), arranged to operably parse packets received by the first Bluetooth communication circuit (); and'}, {'b': 117', '111', '113, 'a first control circuit (), coupled with the first Bluetooth communication circuit () and the first packet parsing circuit (); and'}], 'a main Bluetooth circuit (), comprising{'b': 120', '120, 'claim-text': [{'b': '121', 'a second Bluetooth communication circuit ();'}, {'b': 123', '121, 'a second packet parsing circuit (), arranged to operably parse packets received by the second Bluetooth communication circuit (); and'}, {'b': 127', '121', '123, 'a second control circuit (), coupled with the second Bluetooth communication circuit () and the second packet ...

MAIN BLUETOOTH CIRCUIT OF MULTI-MEMBER BLUETOOTH DEVICE CAPABLE OF DYNAMICALLY SWITCHING OPERATION MODE

A main Bluetooth circuit for use in a multi-member Bluetooth device is disclosed including: a first Bluetooth communication circuit, a first packet parsing circuit, and a first control circuit. In a period during which the auxiliary Bluetooth circuit operates at the sniffing mode, the first control circuit utilizes the first Bluetooth communication circuit to receive packets transmitted from the remote Bluetooth device. In a situation of that a throughput of packets sniffed from the remote Bluetooth device by the auxiliary Bluetooth circuit is lower than a predetermined threshold, the auxiliary Bluetooth circuit switches from the sniffing mode to the relay mode. In a period during which the auxiliary Bluetooth circuit operates at the relay mode, the first control circuit utilizes the first Bluetooth communication circuit to receive the packets transmitted from the remote Bluetooth device and to forward received packets to the auxiliary Bluetooth circuit. 1110100102110120110. A main Bluetooth circuit () of a multi-member Bluetooth device () utilized to operably conduct data transmission with a remote Bluetooth device () and comprising the main Bluetooth circuit () and an auxiliary Bluetooth circuit () which selectably operates at a sniffing mode or a relay mode , the main Bluetooth circuit () comprising:{'b': '111', 'a first Bluetooth communication circuit ();'}{'b': 113', '111, 'a first packet parsing circuit (), arranged to operably parse packets received by the first Bluetooth communication circuit (); and'}{'b': 117', '111', '113, 'a first control circuit (), coupled with the first Bluetooth communication circuit () and the first packet parsing circuit ();'}{'b': 120', '117', '111', '102', '120', '102, 'wherein in a period during which the auxiliary Bluetooth circuit () operates at the sniffing mode, the first control circuit () utilizes the first Bluetooth communication circuit () to receive packets transmitted from the remote Bluetooth device (), and the ...

MAIN BLUETOOTH CIRCUIT AND AUXILIARY BLUETOOTH CIRCUIT OF MULTI-MEMBER BLUETOOTH DEVICE CAPABLE OF ADAPTIVELY SWITCHING OPERATION MODE IN RESPONSE TO DATA TYPE CHANGE OF RECEIVED PACKETS

A main Bluetooth circuit and an auxiliary Bluetooth circuit of a multi-member Bluetooth device for communicating data with a remote Bluetooth device are disclosed. In the period during which the auxiliary Bluetooth circuit operates at a relay mode, the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device, and the auxiliary Bluetooth circuit does not sniff packets transmitted from the remote Bluetooth device. But the auxiliary Bluetooth circuit switches from the relay mode to a sniffing mode if the data type of packets transmitted from the remote Bluetooth device changes. In the period during which the auxiliary Bluetooth circuit operates at the sniffing mode, the auxiliary Bluetooth circuit sniffs packets issued from the remote Bluetooth device while the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device. 1110100100102110120110. A main Bluetooth circuit () of the multi-member Bluetooth device () , the multi-member Bluetooth device () being utilized to operably conduct data transmission with a remote Bluetooth device () and comprising the main Bluetooth circuit () and an auxiliary Bluetooth circuit () which selectably operates at a sniffing mode or a relay mode , the main Bluetooth circuit () comprising:{'b': '111', 'a first Bluetooth communication circuit ();'}{'b': 113', '111, 'a first packet parsing circuit (), arranged to operably parse packets received by the first Bluetooth communication circuit (); and'}{'b': 117', '111', '113, 'a first control circuit (), coupled with the first Bluetooth communication circuit () and the first packet parsing circuit ();'}{'b': 120', '117', '111', '102', '111', '120', '120', '111', '120', '102, 'wherein in a period during which the auxiliary Bluetooth circuit () operates at the relay mode, the first control circuit () utilizes the first Bluetooth communication circuit () to receive packets transmitted from the remote Bluetooth device (), and utilizes the first ...

MULTI-MEMBER BLUETOOTH DEVICE CAPABLE OF ADAPTIVELY SWITCHING OPERATION MODE IN RESPONSE TO DATA TYPE CHANGE OF RECEIVED PACKETS

A multi-member Bluetooth device for communicating data with a remote Bluetooth device is disclosed including: a main Bluetooth circuit and an auxiliary Bluetooth circuit. In the period during which the auxiliary Bluetooth circuit operates at a relay mode, the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device, and the auxiliary Bluetooth circuit does not sniff packets transmitted from the remote Bluetooth device. But the auxiliary Bluetooth circuit switches from the relay mode to a sniffing mode if the data type of packets transmitted from the remote Bluetooth device changes. In the period during which the auxiliary Bluetooth circuit operates at the sniffing mode, the auxiliary Bluetooth circuit sniffs packets issued from the remote Bluetooth device while the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device. 1100102100. A multi-member Bluetooth device () utilized to operably conduct data transmission with a remote Bluetooth device () , the multi-member Bluetooth device () comprising:{'b': '110', 'claim-text': [{'b': '111', 'a first Bluetooth communication circuit ();'}, {'b': 113', '111, 'a first packet parsing circuit (), arranged to operably parse packets received by the first Bluetooth communication circuit (); and'}, {'b': 117', '111', '113, 'a first control circuit (), coupled with the first Bluetooth communication circuit () and the first packet parsing circuit (); and'}], 'a main Bluetooth circuit (), comprising{'b': 120', '120, 'claim-text': [{'b': '121', 'a second Bluetooth communication circuit ();'}, {'b': 123', '121, 'a second packet parsing circuit (), arranged to operably parse packets received by the second Bluetooth communication circuit (); and'}, {'b': 127', '121', '123, 'a second control circuit (), coupled with the second Bluetooth communication circuit () and the second packet parsing circuit ();'}], 'an auxiliary Bluetooth circuit (), arranged to selectably operate a sniffing ...

Multi-member bluetooth device capable of dynamically switching operation mode, and related main bluetooth circuit and auxiliary bluetooth circuit

A multi-member Bluetooth device for communicating data with a remote Bluetooth device is disclosed including: a main Bluetooth circuit and an auxiliary Bluetooth circuit. In the period during which the auxiliary Bluetooth circuit operates at a relay mode, the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device and forwards the received packets to the auxiliary Bluetooth circuit; the auxiliary Bluetooth circuit does not sniff packets issued from the remote Bluetooth device, but will switch to a sniffing mode if a signal reception quality indicator of the auxiliary Bluetooth circuit is superior to a predetermined indicator value. In the period during which the auxiliary Bluetooth circuit operates at the sniffing mode, the auxiliary Bluetooth circuit sniffs packets issued from the remote Bluetooth device and the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device.

AUXILIARY BLUETOOTH CIRCUIT OF MULTI-MEMBER BLUETOOTH DEVICE CAPABLE OF DYNAMICALLY SWITCHING OPERATION MODE

An auxiliary Bluetooth circuit for use in a multi-member Bluetooth device is disclosed including: a second Bluetooth communication circuit, a second packet parsing circuit, and a second control circuit. In a period during which the auxiliary Bluetooth circuit operates at a sniffing mode, the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device, while the second control circuit utilizes the second Bluetooth communication circuit to sniff packets issued from the remote Bluetooth device. In a situation of that a throughput of packets sniffed by the auxiliary Bluetooth circuit is lower than a predetermined threshold, the auxiliary Bluetooth circuit switches from the sniffing mode to a relay mode. In a period during which the auxiliary Bluetooth circuit operates at the relay mode, the second control circuit utilizes the second Bluetooth communication circuit to receive packets forwarded from the main Bluetooth circuit. 1120100102110120120. An auxiliary Bluetooth circuit () of a multi-member Bluetooth device () utilized to operably conduct data transmission with a remote Bluetooth device () and comprising a main Bluetooth circuit () and the auxiliary Bluetooth circuit () , the auxiliary Bluetooth circuit () comprising:{'b': '121', 'a second Bluetooth communication circuit ();'}{'b': 123', '121, 'a second packet parsing circuit (), arranged to operably parse packets received by the second Bluetooth communication circuit (); and'}{'b': 127', '121', '123', '120, 'a second control circuit (), coupled with the second Bluetooth communication circuit () and the second packet parsing circuit (), arranged to operably control operations of the auxiliary Bluetooth circuit () under a sniffing mode and a relay mode;'}{'b': 120', '110', '102', '127', '121', '102, 'wherein in a period during which the auxiliary Bluetooth circuit () operates at the sniffing mode, the main Bluetooth circuit () receives packets transmitted from the remote Bluetooth device ...

MULTI-MEMBER BLUETOOTH DEVICE CAPABLE OF ADAPTIVELY SWITCHING OPERATION MODE IN RESPONSE TO DATA TYPE CHANGE OF RECEIVED PACKETS, AND RELATED MAIN BLUETOOTH CIRCUIT AND AUXILIARY BLUETOOTH CIRCUIT

A multi-member Bluetooth device for communicating data with a remote Bluetooth device is disclosed including: a main Bluetooth circuit and an auxiliary Bluetooth circuit. In the period during which the auxiliary Bluetooth circuit operates at a sniffing mode, the auxiliary Bluetooth circuit sniffs packets transmitted from the remote Bluetooth device and the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device. But the auxiliary Bluetooth circuit switches from the sniffing mode to a relay mode if the data type of packets transmitted from the remote Bluetooth device changes. In the period during which the auxiliary Bluetooth circuit operates at the relay mode, the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device and forwards the received packets to the auxiliary Bluetooth circuit, and the auxiliary Bluetooth circuit does not sniff packets transmitted from the remote Bluetooth device. 1100102100. A multi-member Bluetooth device () utilized to operably conduct data transmission with a remote Bluetooth device () , the multi-member Bluetooth device () comprising:{'b': '110', 'claim-text': [{'b': '111', 'a first Bluetooth communication circuit ();'}, {'b': 113', '111, 'a first packet parsing circuit (), arranged to operably parse packets received by the first Bluetooth communication circuit (); and'}, {'b': 117', '111', '113, 'a first control circuit (), coupled with the first Bluetooth communication circuit () and the first packet parsing circuit (); and'}], 'a main Bluetooth circuit (), comprising{'b': 120', '120, 'claim-text': [{'b': '121', 'a second Bluetooth communication circuit ();'}, {'b': 123', '121, 'a second packet parsing circuit (), arranged to operably parse packets received by the second Bluetooth communication circuit (); and'}, {'b': 127', '121', '123, 'a second control circuit (), coupled with the second Bluetooth communication circuit () and the second packet parsing circuit ();'}], 'an ...

LIGHT EMITTING DEVICE

A flip chip light emitting diode includes a plurality of light emitting diodes and an encapsulation covering the plurality of light emitting diodes. Each of light emitting diode has a P electrode and an N electrode which are exposed out of the encapsulation. 1. A light emitting diode packaging configured to be coupled to a circuit , the light emitting diode packaging comprising:a light emitting diode having a P electrode, an N electrode and a light exiting surface opposite to the P electrode and the N electrode;an encapsulation layer covering the light emitting diode, while leaving the P electrode and N electrode at least partially exposed from the encapsulation layer; andwherein the P electrode and the N electrode is configured to be coupled to the circuit.2. The light emitting diode packaging of claim 1 , wherein the light emitting diode is coupled with the circuit by flip chip bonding.3. The light emitting diode packaging of claim 2 , wherein the number of the light emitting diode is multiple.4. The light emitting diode packaging of claim 3 , wherein the light emitting diodes are packaged together by the encapsulation layer to form a single component.5. The light emitting diode packaging of claim 2 , wherein the light emitting diode comprises a substrate and a semiconductor layer formed on the substrate.6. The light emitting diode packaging of claim 5 , wherein the semiconductor layer comprises an N semiconductor claim 5 , a light emitting layer claim 5 , and a P semiconductor layer arranged in serious on the substrate.7. The light emitting diode packaging of claim 1 , wherein the encapsulation layer is made of transparent resin.8. The light emitting diode packaging of claim 1 , wherein the encapsulation layer comprises phosphors.9. A light emitting device claim 1 , comprising: a plurality of light emitting diodes, each light emitting diode having a P electrode and an N electrode thereon and a light exiting surface opposite to the P electrode and N electrode;', ' ...

ELECTRONIC DEVICE HAVING UPDATABLE BIOS AND BIOS UPDATING METHOD THEREOF

An electronic device having updatable BIOS is used to perform a BIOS updating method. The electronic device electrically connects to a server, in which update data is stored. The electronic device includes a Basic Input/Output System (BIOS), a network connection module and a switch. A BIOS program is stored in the BIOS, and a connecting program is stored in the network connection module for connecting to the server. When the electronic device is updating, the BIOS switches to electrically connect to the network connection module via the switch, and the network connection module connects to the server by executing the connecting program, downloads the update data applying to the BIOS, and overwrites the update data to the BIOS to update the BIOS program. 1. A electronic device having updatable BIOS , wherein the electronic device electronically connects to a server , and the server stores update data , comprising:a BIOS, storing a BIOS program;a network connection module, electronically connecting to the server and storing a connecting program, for connecting to the server; anda switch, wherein the BIOS switches to electronically connect to the network connection module via the switch;wherein when the electronic device updates the BIOS, the BIOS switches to electronically connect to the network connection module via the switch, and the network connection module connects to the server via the connecting program, downloads the update data applying to the BIOS, and overwrites the update data to the BIOS to update the BIOS program.2. The electronic device having updatable BIOS of claim 1 , further including:a button, set up in the electronic device and electronically connecting to the switch, wherein when the button is activated, the BIOS switches to electronically connect to the network connecting module.3. The electronic device having updatable BIOS of claim 1 , further including:a detection module, electronically connecting to the server, wherein when the detection ...

Display Substrate Motherboard and Manufacturing Method thereof, Display Substrate and Display Apparatus

Provided are a display substrate motherboard and manufacturing method thereof, a display substrate and a display apparatus. The display substrate motherboard includes a substrate, a display substrate area on the substrate, and a mark area on the periphery of the display substrate area. The display substrate motherboard also includes a thin film transistor disposed in the display substrate area, a mark structure disposed in the mark area and a planarization layer disposed on one side of the thin film transistor away from the substrate, and the planarization layer includes a groove which is disposed at the corresponding position of the mark structure and extends along a direction close to the substrate, and an orthographic projection of the groove on the substrate covers an orthographic projection of the mark structure on the substrate. 1. A display substrate motherboard comprising: a substrate , a display substrate area on the substrate , and a mark area on the periphery of the display substrate area; whereinthe display substrate motherboard also comprises a thin film transistor disposed in the display substrate area, a mark structure disposed in the mark area and a planarization layer disposed on one side of the thin film transistor away from the substrate; andthe planarization layer comprises a groove which is disposed at the corresponding position of the mark structure and extends along a direction close to the substrate, and an orthographic projection of the groove on the substrate covers an orthographic projection of the mark structure on the substrate.2. The display substrate motherboard according to claim 1 , further comprising: a reflective layer disposed on a side of the planarization layer away from the substrate; in a direction away from the substrate claim 1 , the first area covering the groove in the reflective layer is lower than the second area adjacent to the first area in the reflective layer claim 1 , and a step difference between the first area and ...

INTERFACIAL TILT-RESISTANT BONDED ASSEMBLY AND METHODS FOR FORMING THE SAME

A first bonding unit is provided, which includes a first substrate, a first passivation dielectric layer, and first bonding pads. A second bonding unit is provided, which includes a second substrate, a second passivation dielectric layer, and second bonding pads including bonding pillar structures. Solder material portions are formed on physically exposed surfaces of the first bonding pads. The second bonding unit is attached to the first bonding unit by bonding the at least one of the bonding pillar structures to a respective solder material portion. 1. A bonded assembly , comprising:a first bonding unit comprising a first substrate, first metal interconnect structures embedded in first dielectric material layers, a first passivation dielectric layer having a first proximal surface contacting one of the first dielectric material layers and a first distal surface that is spaced from the first proximal surface by a thickness of the first passivation dielectric layer, first bonding pads located within and laterally surrounded by a respective opening in the first passivation dielectric layer, wherein distal surfaces of the first bonding pads are recessed relative to the first distal surface of the first passivation dielectric layer, and solder material portions located within and laterally surrounded by a respective opening in the first passivation dielectric layer; anda second bonding unit comprising a second substrate, second metal interconnect structures embedded in second dielectric material layers, a second passivation dielectric layer having a second proximal surface contacting one of the second dielectric material layers and a second distal surface that is spaced from the second proximal surface by a thickness of the second passivation dielectric layer, and second bonding pads located within and laterally surrounded by a respective opening the second passivation dielectric layer, wherein each of the second bonding pads comprises a bonding pillar structure that ...

Novel Use of Adapalene in Treating Esophageal Cancer and Gastrointestinal Stromal Tumor

A novel use of 6-[3-(1-adamantyl)-4-methoxyphenyl]-2-naphthalenecarboxylic acid or a pharmaceutically acceptable salt or functional derivative thereof in treating a cancer, and in particular esophageal cancer and gastrointestinal stromal tumor, is provided. 1. A method of treating a cancer in a subject comprising administering to the subject 6-[3-(1-adamantyl)-4-methoxyphenyl]-2-naphthalenecarboxylic acid or a pharmaceutical salt or derivative thereof in need of such treatment , wherein the cancer is esophageal cancer or gastrointestinal stromal tumor.2. The method of claim 1 , wherein the subject in need of such treatment is a mammal.3. The method of claim 2 , wherein the mammal is human.4. The method claim 1 , wherein the cancer is esophageal cancer.5. The method claim 1 , wherein the cancer is gastrointestinal stromal tumor.6. The method of claim 1 , wherein the 6-[3-(1-adamantyl)-4-methoxyphenyl]-2-naphthalenecarboxylic acid or a pharmaceutical salt or derivative thereof is administrated to the subject at a daily dosage which is converted from a mouse daily dosage of about 40 mg/kg body weight.7. The method of claim 1 , wherein the 6-[3-(1-adamantyl)-4-methoxyphenyl]-2-naphthalenecarboxylic acid is administered to the subject in a solution form via intraperitoneal injection route.8. The method of claim 7 , wherein the solution is prepared by dissolving 6-[3-(1-adamantyl)-4-methoxyphenyl]-2-naphthalenecarboxylic acid in an organic solvent and mixing the organic solution of the 6-[3-(1-adamantyl)-4-methoxyphenyl]-2-naphthalenecarboxylic acid with an aqueous solution.9. A method of treating a cancer in a subject comprising administering to the subject an agent active in binding with EGFR kinase domain in the subject in need of such treatment claim 7 , wherein the cancer is esophageal cancer claim 7 , and the agent comprises 6-[3-(1-adamantyl)-4-methoxyphenyl]-2-naphthalenecarboxylic acid or a pharmaceutical salt or derivative thereof.10. A method of treating a ...

Radio-Frequency Module and Wireless Device

A wireless device includes a radio-frequency module, a modem module, and a control unit. The radio-frequency module and the modem module operate either in a first operation mode or in a second operation mode. The control unit, coupled to the RF and the modem module, generates a control signal to indicate to the RF and the modem module to operate in the first operation mode or to operate in the second operation mode. A first set of signal formats corresponding to the first operation mode is a superset of a second set of signal formats corresponding to the second operation mode, and a first power consumption corresponding to the first operation mode is higher than a second power consumption corresponding to the second operation mode. 1. A wireless device , operating within a wireless system , the wireless device comprising:a radio-frequency (RF) module and a modem module, configured to operate in a first operation mode or in a second operation mode; anda control unit, coupled to the RF module and the modem module, configured to generate a control signal to indicate the RF module and the modem module to operate in the first operation mode or to operate in the second operation mode;wherein a first set of signal formats corresponding to the first operation mode is a superset of a second set of signal formats corresponding to the second operation mode, and a first power consumption corresponding to the first operation mode is higher than a second power consumption corresponding to the second operation mode;wherein the RF signals in the first set of signal formats correspond to frequency shift keying (FSK) modulated baseband signals and phase shift keying (PSK) modulated baseband signals;wherein the RF signals in the second set of signal formats correspond to FSK modulated baseband signals, or the RF signals in the second set of signal formats correspond to FSK modulated baseband signals and PSK modulated baseband signals.2. The wireless device of claim 1 , wherein the RF ...

LED PACKAGE WITH REFLECTING CUP

The present disclosure provides an LED package which includes electrodes, an LED die electrically connected with the electrodes, an encapsulation covering the LED die; and a casing surrounding the encapsulation and the LED die. The casing includes a base, a reflecting cup and a supporting portion. The reflecting cup extends from the base upwards, the reflecting cup surrounds the LED die, and the supporting portion is located inside the reflecting cup and across the electrodes. 1. A light emitting diode (LED) package comprising:a plurality of electrodes;an LED die electrically connected with the plurality of electrodes;an encapsulation covering the LED die; anda casing surrounding the encapsulation and the LED die, the casing comprising: a base; a reflecting cup extending upwards from the base upwards and surrounding the LED die; and a supporting portion being located inside the reflecting cup and across the electrodes.2. The LED package of claim 1 , wherein the base comprises a frame and a plurality of brackets claim 1 , and the brackets are formed inside the frame.3. The LED package of claim 2 , wherein the reflecting cup extends from the frame along a height of the light emitting diode.4. The LED package of claim 2 , wherein the brackets comprise a first bracket claim 2 , a second bracket and a third bracket claim 2 , the first bracket and the third bracket are spaced from each other claim 2 , the second bracket is connected between the first bracket and the third bracket.5. The LED package of claim 4 , wherein the first bracket is parallel to the third bracket claim 4 , and the supporting portion is located between the first bracket and the third bracket.6. The LED package of claim 4 , wherein a portion of the first bracket has the same height with the second bracket claim 4 , and a portion of the third bracket has the same height with the second bracket claim 4 , the portion of the first bracket claim 4 , the portion of the third bracket and the second bracket ...

DISPLAY DRIVING CIRCUIT AND REFRESH RATE ADJUSTMENT METHOD

A display driving circuit applied to a display includes a detection unit, a counting unit and an adjusting unit. The detection unit is configured to detect N pulses of an emission control signal of the display in a frame and define a frame porch interval increasing unit accordingly. The frame porch interval increasing unit equals to 1/N frame. N is a positive integer. The counting unit is coupled to the detection unit and configured to count frames according to a first refresh rate. The adjusting unit is coupled to the detection unit and the counting unit and configured to insert M frame porch interval increasing units every time when the counting unit counts L frames to adjust the first refresh rate to a second refresh rate, wherein the second refresh rate is lower than the first refresh rate. L and M are positive integers and L≥M. 1. A display driving circuit , applied to a display , the display driving circuit comprising:a detection unit, configured to detect N pulses of an emission control signal of the display in a frame and define a frame porch interval increasing unit accordingly, wherein the frame porch interval increasing unit equals to 1/N frame, and N is a positive integer;a counting unit, coupled to the detection unit and configured to count a plurality of frames according to a first refresh rate; andan adjusting unit, coupled to the detection unit and the counting unit and configured to insert M frame porch interval increasing units every time when the counting unit counts L frames to adjust the first refresh rate to a second refresh rate, wherein the second refresh rate is lower than the first refresh rate, and L and M are positive integers and L≥M.2. The display driving circuit of claim 1 , wherein the display is a self-luminous display.3. The display driving circuit of claim 1 , wherein the second refresh rate equals to the first refresh rate *[(L*N)/(L*N+M)].4. The display driving circuit of claim 1 , wherein the plurality of frames all corresponds ...

TEST METHOD, SYSTEM, MEDIUM AND DEVICE FOR DUAL IN-LINE MEMORY MODULE

The present disclosure provides a test method, system, medium and device for a dual in-line memory module, the test method includes: obtaining a position of the dual in-line memory module on a server; modifying a protection mechanism after detecting a defective dual in-line memory module; testing each dual in-line memory module; storing the test result in a system event log of the baseboard management control module. The test method, system, medium and device for a dual in-line memory module of the present disclosure is to prevent the server from being shut down during the test of the dual in-line memory module, and timely discover the defective dual in-line memory module. 1. A test method for a dual in-line memory module , comprising:obtaining a position of the dual in-line memory module on a server;modifying a protection mechanism after detecting a defective dual in-line memory module, wherein the modifying a protection mechanism after detecting the defective dual in-line memory module includes: prohibiting a function of shutting down the server after detecting the defective dual in-line memory module; prohibiting a function that a memory reference code shuts down the server after detecting the defective dual in-line memory module; prohibiting a function that a basic input output module gets stuck in a loop after detecting the defective dual in-line memory module;testing each dual in-line memory module;storing a test result in a system event log of a baseboard management control module.2. The test method for a dual in-line memory module according to claim 1 , furthering comprising obtaining the test result stored in the system event log through a preset script.3. The test method for a dual in-line memory module according to claim 2 , wherein the preset script is an IMPI platform management tool.4. The test method for a dual in-line memory module according to claim 1 , further comprising cleaning the system event log and burning the basic input output module.5. A ...

LIGHT EMITTING DIODE PACKAGE WITH OXIDATION-RESISTANT METAL COATING LAYER

An exemplary light emitting diode (LED) package includes a substrate, a first electrode and a second electrode embedded in the substrate and spaced from each other, and an LED die mounted on a top surface of the substrate. The substrate also includes a bottom surface. Top ends of the first and second electrodes are exposed at the top surface of the substrate, and bottom ends of the first and second electrodes are exposed at the bottom surface of the substrate. An oxidation-resistant metal coating layer is formed on a top face of each of the first and second electrodes. The LED die is electrically connected to the first and second electrodes via the two oxidation-resistant metal coating layers. 1. A light emitting diode (LED) package comprising:a substrate, comprising a top surface and a bottom surface at opposite sides thereof;a first electrode and a second electrode spaced from the first electrode, both the first and second electrodes penetrating downwardly through the substrate from the top surface to the bottom surface, a top end of each of the first and second electrodes being exposed at the top surface of the substrate, and a bottom end of each of the first and second electrodes being exposed at the bottom surface of the substrate; andan LED die arranged on the top surface of the substrate and electrically connected to the first and second electrodes, the LED die comprising a positive bonding pad and a negative bonding pad;wherein each of the first and second electrodes has a top face and a bottom face at opposite sides thereof, an oxidation-resistant metal coating layer is formed on the top face of at least one of the first and second electrodes, and at least one of the positive and negative bonding pads of the LED die is electrically connected to a corresponding one of the first and second electrodes via the oxidation-resistant metal coating layer.2. The LED package of claim 1 , wherein the oxidation-resistant metal coating layer is formed on the top face of ...

Novel Use of Adapalene in Treating Cancer

A novel use of 6-[3-(1-adamantyl)-4-methoxyphenyl]-2-naphthalenecarboxylic acid or a pharmaceutically acceptable salt or functional derivative thereof in treating a cancer, and in particular non-small cell lung cancer, is provided. 1. A method of treating a cancer in a subject comprising administering to the subject 6-[3-(1-adamantyl)-4-methoxyphenyl]-2-naphthalenecarboxylic acid or a pharmaceutical salt or derivative thereof in need of such treatment.2. The method of claim 1 , wherein the subject in need of such treatment is a mammal.3. The method of claim 2 , wherein the mammal is human.4. The method of claim 1 , wherein the cancer is an EGFR associated cancer.5. The method claim 4 , wherein the EGFR associated cancer is selected from lung cancer claim 4 , breast cancer claim 4 , head and neck cancer claim 4 , pancreatic cancer claim 4 , colorectal cancer or glioma cancer.6. The method claim 1 , wherein the cancer is non-small cell lung cancer.7. The method of claim 6 , wherein the subject in need such of treatment is under or has received a treatment of Gefitinib or Erlotinib.8. The method of claim 6 , wherein the subject in need of such of treatment has developed a resistance to Gefitinib or Erlotinib.9. The method of claim 6 , wherein the 6-[3-(1-adamantyl)-4-methoxyphenyl]-2-naphthalenecarboxylic acid or a pharmaceutical salt or derivative thereof is administrated to the subject at a daily dosage which is converted from a mouse daily dosage of about 40 mg/kg body weight.10. The method of claim 1 , wherein the 6-[3-(1-adamantyl)-4-methoxyphenyl]-2-naphthalenecarboxylic acid is administered the subject in a solution form via i.p. route.11. The method of claim 10 , wherein the solution is prepared by dissolving 6-[3-(1-adamantyl)-4-methoxyphenyl]-2-naphthalenecarboxylic acid in an organic solvent and mixing the organic solution of the 6-[3-(1-adamantyl)-4-methoxyphenyl]-2-naphthalenecarboxylic acid with an aqueous solution. This patent application claims the ...

Deception Techniques Using Policy

Methods and systems for diversifying coverage of a deception point are provided. Exemplary methods include: receiving, by a first enforcement point in a first data network segment, a first data packet addressed to a first workload in the first data network segment; forwarding the first data packet to the deception point using a first low-level security rule set, the deception point logging the first data packet to produce a first log, receiving, by a second enforcement point in a second data network segment, a second data packet addressed to a second workload in the second data network segment, forwarding the second data packet to the deception point using a second low-level security rule set, the deception point logging the second data packet to produce a second log, the deception point providing the first and second logs to a security director for analysis. 1. A computer-implemented method for diversifying coverage of a deception point comprising:receiving, by a first enforcement point in a first data network segment, a first data packet addressed to a first workload in the first data network segment;forwarding the first data packet to the deception point using a first low-level security rule set, the deception point being different from the first workload, the deception point logging the first data packet to produce a first log, the first low-level security rule set being produced using a high-level declarative security policy, the high-level declarative security policy including a high-level security statement;receiving, by a second enforcement point in a second data network segment, a second data packet addressed to a second workload in the second data network segment, the first data network segment and the second data network segment being in a common network; andforwarding the second data packet to the deception point using a second low-level security rule set, the deception point being different from the second workload, the deception point logging the ...

METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE

A method for manufacturing an LED package includes the steps: providing a lead frame including many pairs of first and second electrodes, the first electrodes and second electrodes each including a main body, an extension electrode, and a supporting branch, the first electrodes in a column and the second electrodes in a column being linearly connected by a first and second tie bars, respectively; forming many molded bodies to correspond to the pairs of the first and second electrodes, the first and second main bodies being embedded into the molded bodies, the first and second extension electrodes being exposed out from a periphery of the molded body, bottoms of the first and second supporting branches being exposed at a bottom of the molded body; disposing LED dies in corresponding receiving cavities; and cutting the first and second tie bars and the molded bodies and the lead frame. 1. A method for manufacturing the LED package comprising:providing a lead frame, the lead frame comprising a plurality of pairs of electrodes arranged in a matrix, each pair of electrodes comprising a first electrode and a second electrode adjacent to the first electrode, the first electrodes being arranged in a plurality of columns, and the second electrodes being arranged in a plurality of columns, wherein each first electrode comprises an elongated first main body, a first extension electrode protruding laterally from one end of the first main body, and a first supporting branch protruding downwardly from a bottom of the first main body, and each second electrode comprises an elongated second main body, a second extension electrode protruding laterally from one end of the second main body, and a second supporting branch protruding downwardly from a bottom of the second main body, the first electrodes arranged in the same column being linearly connected together by a first tie bar, the second electrodes arranged in the same column being linearly connected together by a second tie bar, ...

METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE HAVING A VOLTAGE STABILIZING MODULE CONSISTING OF TWO DOPING LAYERS

A method for manufacturing an LED (light emitting diode) package comprises following steps: providing an electrically insulated base, the base having a first surface and a second surface opposite thereto; an annular voltage stabilizing module is formed on the first surface; a first electrode is formed on the first surface, wherein the first electrode is attached to and encircled by the voltage stabilizing module; a second electrode is formed on the first surface, wherein the second electrode is attached to and encircles the voltage stabilizing module; an LED chip is mounted on the first electrode, wherein the LED chip is electrically connected to the first and second electrodes, and the LED chip and the voltage stabilizing module are connected in reverse parallel. Finally, an encapsulative layer is brought to encapsulate the LED chip. 1. A method for manufacturing an LED (light emitting diode) package comprising following steps:providing an electrically insulated base, the base having a first surface and a second surface opposite to the first surface;forming an annular voltage stabilizing module on the first surface of the base;forming a first electrode on the first surface of the base, the first electrode being attached to and encircled by the voltage stabilizing module;forming a second electrode on the first surface of the base, the second electrode being attached to and encircling the voltage stabilizing module;mounting at least one LED chip on the first electrode, the at least one LED chip being electrically connected to the first and second electrodes, the at least one LED chip and the voltage stabilizing module being connected in reverse parallel; andencapsulating the at least one LED chip with an encapsulative layer.2. The method of claim 1 , wherein the voltage stabilizing module comprises a first doping layer and a second doping layer claim 1 , the first and second doping layer being doped with two different or two kinds of different elements claim 1 , ...

SYSTEMS AND METHODS FOR VEHICLE CONTROL USING TERRAIN-BASED LOCALIZATION

Systems and methods described herein include implementation of road surface-based localization techniques for advanced vehicle features and control methods including advanced driver assistance systems (ADAS), lane drift detection, passing guidance, bandwidth conservation and caching based on road data, vehicle speed correction, suspension and vehicle system performance tracking and control, road estimation calibration, and others. 1120.-. (canceled)121. A method comprising:obtaining, from one or more sensors corresponding to a left wheel of a vehicle, left wheel data as the vehicle traverses a road segment;obtaining, from one or more sensors corresponding to a right wheel of the vehicle, right wheel data as the vehicle traverses the road segment;obtaining, from a cloud database, two or more road profiles, each road profile corresponding to a track on the road segment;comparing the left wheel data and the right wheel data to the two or more road profiles;determining, by a controller, at a first time, a first match between the left wheel data or the right wheel data and a first road profile of the two or more road profiles;determining, by the controller, a first location the vehicle on the road segment based on the first match;determining, by the controller, at a second time, a second match between the left wheel data or the right wheel data and a second road profile of the two or more road profiles;determining, by the controller, a second location of the vehicle on the road segment based on the second match; anddetermining, based on a difference between the first location and the second location, that the vehicle has completed a lane drift behavior.122. The method of claim 121 , wherein the difference between the first location and the second location indicates that the vehicle has drifted within a lane on the road.123. The method of claim 121 , wherein the difference between the first location and the second location indicates that the vehicle has drifted into ...

DATA INTEGRATION APPARATUS FOR USE IN SENSOR NETWORK

A data integration apparatus for use in a sensor network system is provided. The sensor network system includes a sensor network and an application server. The data integration apparatus receives text commands associated with access of the sensor network from the application server, and accomplishes the operations of the tabled data provided by the network node of the sensor network by using the text commands and the hardware configurations of the sensor network cooperatively. 1. A data integration apparatus for use in a sensor network system , the sensor network system comprising a sensor network and an application server , the data integration apparatus comprising:a resource allocation module, being stored with a sensor configuration;a data processing module connected with the application server and the sensor network, being configured to receive a sensor query command from the application server, access the sensor configuration according to the sensor query command to query the sensor network, and transmit a query response back to the application server, wherein the sensor configuration is updated after being accessed.2. The data integration apparatus as claimed in claim 1 , wherein the sensor configuration comprises a sensor resource profile claim 1 , a bus profile and a resource-bus mapping profile claim 1 , and the data processing module further comprises: receive the sensor query command from the application server;', 'query the sensor resource profile according to the sensor query command and retrieve a sensor type configuration from the sensor resource profile; and', 'transmit a sensor bus query command according to the sensor type configuration;, 'a data interface processing unit, being configured to query the resource-bus mapping profile according to the sensor bus query command and retrieve a bus mapping configuration from the resource-bus mapping profile;', 'query the bus profile according to the bus mapping configuration and retrieve a bus type ...

PHOTOELECTRIC DEVICE AND METHOD OF MANUFACTURING THE SAME

A photoelectric device includes an electrode structure, an LED (light emitting diode) element, a zener diode and a reflective cup. The LED element, the zener diode and the reflective cup are arranged on the electrode structure. The LED element and the zener diode are electrically connected in anti-parallel with each other. The reflective cup comprises an inner surface defined thereof and a nick defined in an outside of the reflective cup. The LED element is surrounded by the inner surface of the reflective cup and the zener diode is arranged in the nick. 1. A photoelectric device comprising:an electrode structure with a first electrode and a second electrode insulating the first electrode;an LED (light emitting diode) element arranged on the electrode structure and electrically connected with the electrode and the second electrode;a zener diode arranged on the electrode structure and electrically connected with the electrode and the second electrode and electrically connected in anti-parallel with the LED element; anda reflective cup formed on the electrode structure and comprising an inner surface defined thereof and a nick defined in an outside of the reflective cup, the LED element surrounded by the inner surface of reflective cup and the zener diode arranged in the nick.2. The photoelectric device of claim 1 , wherein an insulating tape is located between the first electrode and the second electrode.3. The photoelectric device of claim 2 , wherein the insulating tape comprises a plurality of sub tapes.4. The photoelectric device of claim 3 , wherein the LED element is arranged at one of the sub tapes claim 3 , the zener element is arranged at the other one of the sub tapes.5. The photoelectric device of claim 2 , wherein the insulating tape comprises a first sub tape exposed inside the reflective cup claim 2 , a second sub tape covered by the reflective cup and a third sub tape exposed through the nick claim 2 , the second sub tape is connected between the first ...

METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGES

A method for manufacturing LED packages includes steps: providing a lead frame including many pairs of first, second electrodes and first and second tie bars, the first electrodes and second electrodes each including a main body and an extension electrode protruding outward from the main body; forming many molded bodies to engage with the first and second electrodes, the first and second main bodies being embedded into the molded bodies, and the first and second extension electrodes being exposed out from a periphery of the molded body; preforming two first through grooves at joints where each first electrode meets the first tie bar and two second through grooves at joints where each second electrode meets the second tie bar; disposing LED dies in corresponding receiving cavities; and cutting the molded bodies through the grooves to obtain a plurality of individual LED packages. 1. A method for manufacturing LED (light emitting diode) packages comprising:providing a lead frame, the lead frame comprising a plurality of pairs of electrodes arranged in a matrix, and a plurality of first and second tie bars, each pair of electrodes comprising a first electrode and a second electrode adjacent to the first electrode, the first electrodes being arranged in a plurality of columns, and the second electrodes being arranged in a plurality of columns, wherein each first electrode comprises an elongated first main body and a first extension electrode protruding laterally from one end of the first main body, each second electrode comprises an elongated second main body and a second extension electrode protruding laterally from one end of the second main body, the first electrodes arranged in the same column are connected by a corresponding first tie bar, and the second electrodes arranged in the same column are connected by a corresponding second tie bar;forming a plurality of molded bodies engaging with the pairs of the first and second electrodes, each molded body surrounding ...

METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGES

A method for manufacturing LED packages includes steps: providing a lead frame including many pairs of first and second electrodes, and first and second tie bars, the first electrodes and second electrodes each including a main body and an extension electrode protruding outward from the main body; forming many molded bodies to engage with the pairs of the first and second electrodes, the first and second main bodies being embedded into the molded bodies, and the first and second extension electrodes being exposed out from a corresponding molded body; preforming many first grooves at a bottom of each molded body; disposing LED dies in the corresponding receiving cavities; and cutting the molded bodies along edges thereof defining the first grooves in a first direction and then along a second direction perpendicular to the first direction to obtain many individual LED packages. 1. A method for manufacturing LED (light emitting diode) packages comprising:providing a lead frame, the lead frame comprising a plurality of pairs of electrodes arranged in a matrix, and a plurality of first and second tie bars, each pair of electrodes comprising a first electrode and a second electrode adjacent to the first electrode, the first electrodes being arranged in a plurality of columns, and the second electrodes being arranged in a plurality of columns, wherein each first electrode comprises an elongated first main body and a first extension electrode protruding laterally from one end of the first main body, each second electrode comprises an elongated second main body and a second extension electrode protruding laterally from one end of the second main body, the first electrodes arranged in the same column are connected by a corresponding first tie bar, and the second electrodes arranged in the same column are connected by a corresponding second tie bar;forming a plurality of molded bodies engaging with the pairs of the first and second electrodes, each molded body surrounding and ...

ARRAY SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND DISPLAY PANEL

An array substrate, a method of manufacturing the same, and a display panel are provided, the array substrate includes a base substrate, and a pixel unit on the base substrate; and a reflective layer disposed on the base substrate and located in a portion of a region of the pixel unit, a surface of the reflective layer facing away from the base substrate includes a rugged structure. 1. An array substrate comprising:a base substrate, anda pixel unit on the base substrate; anda reflective layer disposed on the base substrate and located in a portion of a region of the pixel unit,wherein, a surface of the reflective layer facing away from the base substrate comprises a rugged structure.2. The array substrate according to claim 1 , wherein the reflective layer is made of a metal material.3. The array substrate according to claim 2 , wherein the reflective layer is made of silver.4. The array substrate according to claim 1 , further comprising:a pixel electrode disposed on the base substrate and located in the pixel unit,wherein the reflective layer is disposed between the pixel electrode and the base substrate.5. The array substrate according to claim 4 , further comprising:a thin film transistor on the base substrate,wherein the thin film transistor comprises a gate electrode, an active layer, and a source/drain electrode,wherein the reflective layer is disposed in a same layer as any one of the gate electrode, the active layer, and the source/drain electrode.6. The array substrate according to claim 5 , wherein the reflective layer is disposed in the same layer as the active layer.7. The array substrate according to claim 5 , wherein the thin film transistor is a top-gate thin film transistor claim 5 , and the array substrate further comprises:a light shielding layer between the thin film transistor and the base substrate;wherein an orthogonal projection of the gate electrode on the base substrate is located within an orthogonal projection of the light shielding layer ...

LED PACKAGE

The present invention is related to a light emitting diode (LED) package. The LED package includes a blue LED chip, a first electrode, a second electrode and a phosphor layer. The phosphor layer covers an outer periphery of the blue LED chip, except a bottom surface of the blue LED chip. The phosphor layer is mixed by yellow fluorescent power and glue. The phosphor layer includes a main portion corresponding to a central portion of an emitting angle of the blue LED chip and an extending portion corresponding to a periphery of the emitting angle. An average thickness of the main portion is larger than the thickness of the extending portion. 1. A light emitting diode (LED) package comprising:a blue LED chip;a first electrode and a second electrode; anda phosphor layer covering an outer periphery of the blue LED chip, excepting a bottom surface of the blue LED chip, and the phosphor layer mixed by yellow fluorescent power and glue;wherein the phosphor layer includes a main portion corresponding to a center of an emitting angle of the blue LED chip and an extending portion corresponding to a periphery of the emitting angle, the average thickness of the extending portion is more large than the thickness of the main portion.2. The LED package of claim 1 , wherein the thickness of the main portion is uniform.3. The LED package of claim 2 , wherein the extending portion bends from a bottom end of the main portion.4. The LED package of claim 3 , wherein a thickness of the extending portion generally increases from a top end connected to the main portion to a bottom end away from the main portion.5. The LED package of claim 3 , wherein the thickness of the extending portion is uniform.6. The LED package of claim 1 , wherein the longitudinal section of the blue LED chip is rectangular claim 1 , the main portion corresponding to a central portion of an emitting angle of the blue LED chip and an extending portion corresponding to a periphery of the emitting angle of the blue LED ...

ELECTRONIC DEVICE AND METHOD OF BURN-IN PREVENTION FOR ELECTRONIC DEVICE

An electronic device is provided. The electronic device includes: a display panel and a host. The host is electrically connected to the display panel, and includes a processing unit and a graphics processing unit. The processing unit executes a driver program of the graphics processing unit and a specific program to render a display image of the specific program, wherein the display image includes a user interface. The processing unit obtains position information about a static area of the user interface. In response to the processing unit obtaining the position information about the static area of the user interface, the graphics processing unit performs a burn-in-prevention process on the static area via the driver program to generate an output image, and transmits the output image to the display panel for displaying. 1. An electronic device , comprising:a display panel; anda host, electrically connected to the display panel, wherein the host comprises a processing unit and a graphics processing unit;wherein the processing unit executes a driver program of the graphics processing unit and a specific program to render a display image of the specific program, and the display image comprises a user interface,wherein the processing unit obtains position information about a static area of the user interface,wherein in response to the processing unit obtaining the position information about the static area of the user interface, the graphics processing unit performs a burn-in-prevention process on the static area via the driver program to generate an output image, and transmits the output image to the display panel for displaying.2. The electronic device as claimed in claim 1 , wherein the burn-in-prevention process utilizes the graphics processing unit to generate a translucent window corresponding to the static area claim 1 , and the translucent window has a transparency value between 0 and 1 claim 1 ,wherein the graphics processing unit performs image blending on the ...

LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING SAME

A method for packaging an light emitting diode, includes: arranging one or more light emitting diode dies on a film; encapsulating the one or more light emitting diode dies on the film; removing the film from the one or more encapsulated light emitting diode dies to expose a surface of the one or more encapsulated light emitting diode dies; forming an isolating layer on the exposed surface encapsulation surface portion of the one or more encapsulated light emitting diode dies so as to define a plurality of recesses; and forming a plurality of leads in the plurality of recesses of the one or more encapsulated light emitting diode dies, with each one of the plurality of leads being connected to one of the un-encapsulated electrodes of the one or more light emitting diode dies. 1. A method of manufacturing a light emitting diode package comprising:arranging one or more light emitting diode dies on a film, with the electrodes of each of the one or more light emitting diode dies positioned on the film;encapsulating the one or more light emitting diode dies on the film;removing the film from the one or more encapsulated light emitting diode dies to expose a surface of the one or more encapsulated light emitting diode dies, the exposed surface including the un-encapsulated electrodes of each of the one or more light emitting diode dies and the exposed surface encapsulation surface portion;forming an isolating layer on the exposed surface encapsulation surface portion of the one or more encapsulated light emitting diode dies so as to define a plurality of recesses; andforming a plurality of leads in the plurality of recesses of the one or more encapsulated light emitting diode dies, with each one of the plurality of leads being connected to one of the un-encapsulated electrodes of the one or more light emitting diode dies.2. The method of manufacturing the light emitting diode package of claim 1 , wherein the light emitting diode dies are inverted by flip-chip bonding claim ...

PHOTOELECTRIC DEVICE

A photoelectric device includes a base, an LED (light emitting diode) element and a zener diode. The base includes a first electrode and a second electrode. The LED element and the zener diode are electrically connected with the first electrode and the second electrode. A recess structure is defined in the base. The zener diode is arranged in the recess structure. The zener diode is electrically connected in anti-parallel with the LED element. 1. A photoelectric device comprising:a base with a first electrode and a second electrode and defining a recess structure thereof in the base;an LED (light emitting diode) element arranged on the base and electrically connected with the first electrode and the second electrode; anda zener diode arranged in the recess structure and electrically connected with the first electrode and the second electrode and electrically connected in anti-parallel with the LED element.2. The photoelectric device of claim 1 , wherein the first electrode surrounds the second electrode.3. The photoelectric device of claim 2 , wherein the second electrode is a circle or ellipse shape claim 2 , and the first electrode is an annulus shape and located at periphery sides of the second electrode.4. The photoelectric device of claim 2 , wherein the first electrode comprises a first arm claim 2 , a second arm and a connecting arm claim 2 , the first arm is spaced from the second arm claim 2 , the connecting arm is connected between the first arm and the second arm.5. The photoelectric device of claim 4 , wherein the first arm and the second arm are located at a side of the connecting arm.6. The photoelectric device of claim 3 , wherein an opening is defined among the first arm claim 3 , the second arm and the connecting arm claim 3 , the second electrode is received in the opening.7. The photoelectric device of claim 6 , wherein the first arm and the second arm are perpendicular to the connecting arm.8. The photoelectric device of claim 7 , wherein a sum ...

Deception using Distributed Threat Detection

Methods and systems for deception using distributed threat detection are provided. Exemplary methods by an enforcement point, the enforcement point communicatively coupled to a first data network and a second data network, the enforcement point not providing services in the second data network, include: receiving, from a first workload in the second data network, a data packet addressed to a second workload in the second data network, the data packet requesting a service from the second workload; determining the data packet is for unauthorized access of the second workload, the determining using at least some of a 5-tuple of the data packet; identifying a deception point using the service, the deception point being in the first data network and including a decoy for the service; and redirecting the data packet to the deception point in the first data network. 1. A method by an enforcement point , the enforcement point communicatively coupled to a first data network and a second data network , the enforcement point not providing services in the second data network , the method comprising:receiving, from a first workload in the second data network, a data packet addressed to a second workload in the second data network, the data packet requesting a service from the second workload;determining the data packet is for unauthorized access of the second workload, the determining using at least some of a 5-tuple of the data packet;identifying a deception point using the service, the deception point being in the first data network and including a decoy for the service; and getting the data packet;', 'emulating an application providing the service;', 'producing a response to the data packet using the emulating and the data packet; and', 'providing the response to the first workload such that the response appears to originate from the second workload., 'redirecting the data packet to the deception point in the first data network, the deception point2. The method of claim 1 , ...

CMOS THIN FILM TRANSISTOR, MANUFACTURING METHOD THEREOF AND ARRAY SUBSTRATE

A CMOS thin film transistor, a method for manufacturing the same, and an array substrate are provided. The method includes: forming a semiconductor layer including an N-type region and a P-type region on a substrate, the N-type region is divided into a first region, a second region, a third region, a fourth region and a fifth region, the P-type region is divided into a sixth region, a seventh region and an eighth region; performing first N-type ion doping on the first region and the fifth region; performing first P-type ion doping on the N-type region; performing second P-type ion doping on the N-type region and the P-type region; performing second N-type ion doping on the first region, the second region, the fourth region, the fifth region, the sixth region and the eighth region; and performing third P-type ion doping on the sixth region and the eighth region. 1. A method for manufacturing a CMOS thin film transistor , comprising:step 1, forming a semiconductor layer on a substrate, wherein the semiconductor layer comprises an N-type region and a P-type region which are arranged in a single layer and are spaced apart from each other,the N-type region is divided into a first region, a second region, a third region, a fourth region and a fifth region which are arranged successively, and is used for forming an N-type thin film transistor, the first region is used for forming a first heavily doped drain region, the second region and the fourth region are used for forming lightly doped drain regions, the third region is used for forming a first gate inner region, and the fifth region is used for forming a first heavily doped source region,the P-type region is divided into a sixth region, a seventh region and an eighth region which are arranged successively, and is used for forming a P-type thin film transistor, wherein the sixth region is used for forming a second heavily doped drain region, the seventh region is used for forming a second gate inner region, and the ...

MEMORY OVERCLOCKING METHOD AND COMPUTER DEVICE

A memory overclocking method adapted for a computer device is provided. The computer device includes a basic input output system and a memory. The memory overclocking method includes the following steps. A boot loader of the computer device is executed, and an overclocking module is executed by the basic input output system, wherein a first memory clock frequency for overclocking is preset in a serial presence detect of a memory. A second memory clock frequency by the overclocking module is generated by the overclocking module, wherein the second memory clock frequency is higher than the first memory clock frequency. Whether the second memory clock frequency meets a boot condition of the computer device is determined to decide whether to operate the memory at the second memory clock frequency. In addition, a computer device applying the memory overclocking method is also provided. 1. A memory overclocking method , suitable for a computer device comprising a basic input output system and a memory , wherein the method comprises:executing a boot loader of the computer device, and executing an overclocking module by the basic input output system, wherein at least one first memory clock frequency for overclocking is preset in a serial presence detect of the memory;generating a second memory clock frequency by the overclocking module, wherein the second memory clock frequency is higher than the at least one first memory clock frequency; anddetermining whether the second memory clock frequency meets a boot condition of the computer device to decide to operate the memory at the second memory clock frequency.2. The memory overclocking method according to claim 1 , wherein the step of generating the second memory clock frequency by the overclocking module comprises:selecting one of the reference clock frequencies corresponding to specifications of the memory as the second memory clock frequency from a plurality of reference clock frequencies pre-stored in a parameter database ...

Memory clock frequency adjusting method, mainboard, and computer operating system

A memory clock frequency adjusting method suitable for a computer device is provided. The computer device includes a basic input output system (BIOS) and a memory. The memory clock frequency adjusting method includes following steps. A boot process of the computer device is executed, and the memory is operated at a memory clock frequency set by the BIOS. Whether the computer device is successfully booted is determined by the BIOS to decide whether the boot process of the computer device is to be re-executed. A setting of the memory clock frequency is adjusted by the BIOS when the computer device re-executes the boot process to lower the memory clock frequency, so that the memory is operated at the lowered memory clock frequency. In addition, a mainboard and a computer operating system applying the memory clock frequency adjusting method are also provided.

Light emitting diode package

A light emitting diode (LED) package includes a substrate, a first electrode and a second electrode embedded in the substrate and spaced from each other, an LED die mounted on a top surface of the substrate and electrically connected to the first and the second electrodes. Both the first and the second electrodes include a top face and a bottom face, with the top face and the bottom face of each of the first and the second electrodes being exposed at the top surface and a bottom surface of the substrate, respectively. The top face of the first electrode defines a first groove corresponding to a positive bonding pad (p-pad) of the LED die. The p-pad is partially inserted into the first groove. An oxidation-resistant metal coating layer is filled between an insertion portion of the p-pad and an inner surface of the first groove.

Light emitting diode package

A light emitting diode (LED) package includes a substrate, a first electrode, a second electrode, an LED die mounted on the substrate and electrically connected to the first and the second electrodes, and an encapsulation layer encapsulating the LED die. Both the first and the second electrodes are embedded in the substrate and spaced from each other. Each of the first and the second electrodes includes a top face and a bottom face, with the top face and the bottom face thereof being exposed at a top surface and a bottom surface of the substrate, respectively. The top face of the first electrode defines a first groove therein. An oxidation-resistant metal coating layer is filled in the first groove. A positive bonding pad of the LED die directly contacts with a top face of the first oxidation-resistant metal coating layer.

Coin-Operated Washer/Dryer

A coin-operated washing/drying machine including a cabinet and a coin box assembly disposed within the cabinet. A supporting structure is fixedly disposed within the cabinet. At least a bottom surface of the coin box assembly is fixedly connected with the supporting structure by a fastener. The fastener passes through from the interior of the coin box assembly and is fixedly connected with the supporting structure. The supporting structure is disposed within the cabinet; the bottom surface of the coin box assembly is fixedly connected with the supporting structure; the fasteners such as screws are thus invisible from an overall appearance. Since the coin box assembly is fixed to the supporting structure by the bottom surface to cause such a fixing structure to be hidden in the bottom surface of the coin box assembly, thereby achieving a good anti-theft effect. 1. A coin-operated washing/drying machine , comprising a cabinet and a coin box assembly disposed within the cabinet , wherein a supporting structure is fixedly disposed within the cabinet; at least a bottom surface of the coin box assembly is fixedly connected with the supporting structure by a fastener; and the fastener passes through from the interior of the coin box assembly and is fixedly connected with the supporting structure.2. The coin-operated washing/drying machine according to claim 1 , further comprising a drum supporting element for supporting a drum within the cabinet;wherein the supporting structure is fixed on the drum supporting element.3. The coin-operated washing/drying machine according to claim 2 , wherein the supporting structure is fixed on the drum supporting element in a welding manner.4. The coin-operated washing/drying machine according to claim 2 , wherein the supporting structure is an L-shaped bent plate comprising a first plate and a second plate; one side surface of the first plate is welded to the drum supporting element; and the second plate is fixedly connected with a bottom ...

FLIP-CHIP LIGHT EMITTING DIODE PACKAGE WITH MOISTURE BARRIER LAYER

An exemplary light emitting diode (LED) package includes a substrate, a first electrode penetrating downward through the substrate, a second electrode penetrating downward through the substrate and spaced from the first electrode, an LED die arranged on the substrate and mounted to the first and second electrodes by flip-chip technology, and an encapsulation layer formed on the substrate to encapsulate the LED die therein. The substrate includes a top surface and a bottom surface at opposite sides thereof. Top ends of the first and second electrodes are exposed at the top surface of the substrate, and bottom ends of the first and second electrodes are exposed at the bottom surface of the substrate. A moisture barrier layer is attached on the bottom of the LED package to cover a joint of the first and/or second electrode and the substrate. 1. A light emitting diode (LED) package comprising:a substrate comprising a top surface and a bottom surface at opposite sides thereof;a first electrode and a second electrode spaced from the first electrode, the first and second electrodes respectively penetrating downwardly through the substrate from the top surface to the bottom surface, top ends of the first and second electrodes being exposed at the top surface of the substrate, and bottom ends of the first and second electrodes being exposed at the bottom surface of the substrate;an LED die mounted on the top surface of the substrate and being electrically connected to the first and second electrodes by flip-chip technology;an encapsulation layer formed on the top surface of the substrate to encapsulate the LED die therein; anda moisture barrier layer attached on the bottom thereof to cover at least a part of a joint of the first electrode and/or the second electrode and the substrate.2. The LED package of claim 1 , wherein the moisture barrier layer comprises a first portion attached on the bottom of the LED package to cover at least a part of the joint of the first ...

END RING PORT STRUCTURE OF AN ATYPICAL RADIO-FREQUENCY COIL OF A MAGNETIC RESONANCE IMAGING SYSTEM

An end ring port structure of an atypical coil for a magnetic resonance imaging system, has an end ring, provided with multiple end ring capacitance positions for disposing equivalent capacitances, with a portion of the equivalent capacitances being formed by two or more split capacitors. A first port has a first leg and a second leg, which are each connected to the end ring. A second port has a third leg and a fourth leg, which are each connected to the end ring. A first capacitor bank is arranged on the end ring between an end ring connection point of the first leg and an end ring connection point of the second leg. The first capacitor bank has at least two capacitors not all belonging to the same end ring capacitance position. A second capacitor bank is arranged on the end ring between an end ring connection point of the third leg and an end ring connection point of the fourth leg. The second capacitor bank has at least two capacitors not all belonging to the same end ring capacitance position. 1. An end ring port structure of an atypical coil , comprising:an end ring having multiple end ring capacitance positions for disposing equivalent capacitances, with a portion of the equivalent capacitances being formed by two or more split capacitors;a first port, comprising a first leg and a second leg which are each connected to the end ring;a second port, comprising a third leg and a fourth leg which are each connected to the end ring,a first capacitor bank on the end ring between an end ring connection point of the first leg and an end ring connection point of the second leg, the first capacitor bank comprising at least two split capacitors not all belonging to the same end ring capacitance position; anda second capacitor bank on the end ring between an end ring connection point of the third leg and an end ring connection point of the fourth leg, the second capacitor bank comprising at least two split capacitors not all belonging to the same end ring capacitance ...